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11862329 | DETAILED DESCRIPTION Embodiments of the present innovation relate to a pathogen detection and display system. In one arrangement, the pathogen detection and display system is configured to discover and display the location of substances of interest, particularly pathogens that can spread infection. Embodiments of the innovation can be used in healthcare facilities on surfaces, medical equipment and devices, patients, and staff, for example. It can also be used in restaurants, on cruise ships, in theaters, prisons or any other space where the spread of pathogens can cause harm. FIG.1Aillustrates a schematic representation of a detection and display system10, according to one arrangement. As shown, the system includes a collection device12, a reading device14, a display device16and a control system or controller device18. The collection device12is configured to retrieve samples from a facility or worksite for the testing of pathogens. For example, the collection device12can be a computerized device having a controller13, such as a memory and a processor. One arrangement of the collection device12is illustrated and described with respect toFIGS.12-16below. Returning toFIG.1A, the collection device12is disposed in operative communication with the reading device14. For example, the collection device12is configured to provide the collected (e.g., physical) samples to the reading device14for processing. The reading device or system14is configured to receive the collected samples and processes the samples to determine whether a pathogen is present. For example, with reference toFIG.1A, the reading device14can be a computerized device having controller15such as a memory and a processor. One arrangement of the reading device14is illustrated inFIG.18below. Returning toFIG.1A, the collection device12is disposed in electrical communication with the control system18. For example, the reading device14is configured to communicate with the control system18via a wired or wireless network19, such as a LAN or a WAN. During operation, the reading device18is configured to transmit pathogen information20, which relates to a detected pathogen, to the control system14. The control system18, such as a computerized device having controller21such as a memory and a processor, is configured to utilize the pathogen information20to provide information, such as pathogen action information24, regarding the detected pathogen, such as via display device16, to an end user. An example of the operation of the control system18is provided in detail below. FIG.1Billustrates an example of the collect-read-display functions of a pathogen detection and display system10, such as illustrated inFIG.1A, according to one arrangement. The collection and reading devices12,14and display16shown here are functional examples only. These elements12,14,16and their functions may take many alternative forms depending upon the specific applications and technologies used. Examples of the three functions of the system10are provided as follows: Collection Functionality In one arrangement, the collection device12is configured to take samples to test for pathogens. These are generally taken from surfaces within a hospital, and can include a room's walls, floor, windows, etc., as well as beds and other furnishings, medical devices and equipment. Samples may be collected from patients, caregivers, visitors or from any other entity that may provide usable information to the system. Collection technicians may be nursing or environmental staff, or other personnel trained in the process, who may be hospital employees or staff supplied by an outside company. The collection device12provides the staff members with instructions that include all the information necessary for collection. Instructions may include the time when a collection is to be taken, the specific location or locations to sample, the type of sample to take (i.e. there may be different collection devices for different pathogens of interest), disposition of collected sample and any other relevant information. Reading Functionality In one arrangement, the reading device14accepts the collected samples and processes them to determine whether a pathogen is present. The determination may be as basic as pathogen or no pathogen, or may include specific pathogen family, genus, species, colony count, biomass or other pertinent information. In one arrangement, the pathogen information determined here is provided to the display device16via the control system18. In one embodiment, the reading device14is automated and configured to have the technician insert the collection device12into the reading device14. However, a completely manual system is within the scope of this innovation. For example, manual culturing and identification can be provided by a morphologist, or by DNA or other high-tech methods. Alternately, an automated system, such as described below, can be utilized Displaying Functionality In one arrangement, the display device16presents pathogen information determined by the collect and read functions to the personnel responsible for hygiene, infection control and management of the facility. The display method and format can be tailored to the target user to provide them with the most appropriate information in an easy to use fashion. The display output example inFIG.1Bmay be well suited for use by infection control and cleaning staff. It depicts a floor map of a hospital outlining individual rooms. The highlighted rooms are contaminated by pathogens, and the others are not. This display output provides hospital staff with a simple visual understanding of the areas that need immediate attention. A display output meant for a hospital manager may present statistics, reports and analyses rather than a map. Display outputs may be tailored by individual, function or other criteria. The display device16may be interactive, allowing the user to select and choose information and presentation format, as preferred. Additionally, the display output may be provided on any suitable display device16, such as computers, smart phones, tablets, wall-mounted monitors, dedicated devices, existing facility communication systems, etc. In one arrangement, the system10includes a control system. In one embodiment, the system10is configured as a cloud-based system, such as having a server device, which can support one or multiple facilities. For example, using a secure internet connection, cellular or other suitable communication technology, results from the reader device14are transmitted to the control system18having a controller21, such as a memory and a processor, configured to process the results and to transmit the processed results to one or more display devices16. Alternatively, the control system18can utilize a facility's mainframe computer, a device with an embedded system, a PC-based computer or other suitable technology. In one embodiment, the system18informs hospital staff of the location of pathogens. In one arrangement, it is the responsibility of the staff to determine the proper course of action to remedy the situation. This system18provides the scientific evidence, such as typically required for an evidence-based practice. The staffs clinical expertise is used to remediate the problems and to understand the ramifications of their choices based on ongoing pathogen auditing results. This provides the staff with the ability to see the location of pathogens and to realize the efficacy of their protocols. The comparative effectiveness of protocols will become apparent over time. This will provide the opportunity to maximize remediation efficacy and minimize contamination, resulting in fewer HAIs. Knowledge of the location of pathogens will also give hospital staff the ability to adapt patient treatment. For example, if a particular pathogen is found in a patient's room and the patient is deemed susceptible to it, a course of antibiotics may be started prior to the patient showing symptoms of infection. Other behavioral changes can result from this innovation as well, because for the first time, hospital staff will be able to truly understand the effectiveness and results of their methods, procedures and techniques. In use, the control system18is configured to provide instructions for collecting samples. For example, the control system18is configured to provide a trained technician or team of technicians with instructions via smart phone, tablet, existing hospital communication system, or other convenient device. This may be the same display device16that is used to display the pathogen location results, or it may be a different device. These instructions may also be delivered by a non-electronic device, such as a paper printout. These instructions include information such as which rooms are to be sampled, the sampling location or multiple locations within that room, the type of sample to be collected if more than one is available, time of day to take the samples, disposition of the sample after it is collected, or any other information that is pertinent to the collection and handling of samples. The technician then proceeds to collect samples as instructed. In one arrangement, the sample is collected using a collection device12that allows relatively rapid collection by touching a collection device12to a surface within the room, equipment and devices within the room, or even patients and staff. This collection device12may be used to take a single sample, or may be used to sample multiple locations; i.e. bed rail, window sill, etc., as instructed. Each individual collection device12is identified and logged into the system. Each collection device12can be individually serialized and can be read into the system by use of bar code, RFID tag or any other convenient identification method. Identification may also be made by manually logging a serial number or other identifier into the system. Alternative methods may also be used. For example, individual labels may be printed, whereby the staff member taking the collection places the label onto the collection device12at time of collection. This label correlates each collection device12with its sampling instruction. Numerous methods can be used by the system10to link any sample to its instruction, as well as time of day, etc. In this manner, the pathogen display system10can relate each collected sample to its correct location and time. Once samples are collected by the collection device12, the samples are provided to the reading device14. In one embodiment, the reading device is configured to automatically detect the presence of a pathogen based upon the samples. For example, once the collection device12is inserted into the reading device14, the reading device14is configured to automatically determine whether a pathogen is present or not. This may be accomplished by a variety of mechanisms, from manual culturing and identification by a morphologist to DNA or other high-tech methods, to the automated system described later. Delivery of the collected samples to the reader may be accomplished in a variety of ways, such as human currier, existing pneumatic delivery systems, robotic delivery devices, etc. The reading device14may be localized to a hospital floor or a centralized hospital location, or even a more centralized, regional location outside of the hospital that may serve multiple facilities. The collect-read-display process can function as well with various reading device models. In one arrangement, if an automatic reading device14is not used, a manual system may be employed. For example, a sample may be collected using a currently available swab sampler that is identified as previously described. The sample is then delivered to a laboratory, where it is cultured and grown. A morphologist determines whether a sample contains a pathogen. This information can then be manually entered into the system. As indicated above, the collection device12and reading device14are configured as separate devices. Such indication is by way of example only. In one arrangement, the collection and reading devices can be combined into a singular device that consolidates the collect and read function. This singular device would collect and read a sample and send the pathogen information to the control system. A singular device containing collect, read and display functions would also be anticipated by this innovation. Display Once the pathogen information is collected and read, the control system18provides information, such as pathogen action information24, to the display device16. In one embodiment, the pathogen action information24is configured as a facility map30outputted by the display device16. The facility map30is configured to provide a pathogen sample identifier, such as a type of pathogen identified in the facility, a pathogen sample location, such as a visual representation of the location of pathogens within the facility, and a pathogen sample time. Also as part of the pathogen action information24, the display device16can provide a list of room numbers with an indication of a positive or negative test result, or may provide detailed information about the type of pathogen found, specific location of detected pathogens (bed rail, door knob, blood pressure monitor, etc.), and any other information that may aid in remediation and prevention. The display example inFIG.1Bdepicts a display output that may be used by front-line staff responsible for remediation and patient safety. In this example, a map of the floor plan depicts room locations and identification. Rooms where no pathogens have been found are shown in a first color, such as blue. Rooms that have pathogen contamination are shown in a second color, such as red. This provides the staff with an instant visual recognition of locations that need attention. Other information presented in theFIG.1Bexample is the name of the hospital and floor within the hospital, total number of contaminated rooms, and an activity log containing the status of recent audits. In some embodiments, the display device16is configured as an interactive device that can be accessed through a touch screen or other selection method. For example, a staff member may select a room of interest by touching the screen to get detailed information about the testing and results within that room. The example inFIG.1Bdepicts a room selected with additional information shown. Through the interactive display, the user may select a variety of informational and visual formats. Examples include multiple levels of detail, historical information, data trends, graphical representations vs. lists, or any other data and presentation that can be helpful to the staff. Following are illustrative examples of the display, its contents and interactivity. FIG.2shows an embodiment of a pathogen display home screen or display output, as provided by display device16. In it can be seen a plan view of the four units within the hospital200. Units1and2are depicted in a first color, such as red, indicating that pathogens have been found in these units. The intensity of the color indicates the relative number of positive pathogen results within that unit. For example, unit2is a darker shade than unit1, meaning more pathogens were found there than in unit1. Within the unit maps are the total number of positive pathogen results201, in this case 5 rooms are contaminated. Also displayed is the change in the number of contaminated rooms202, in this case it has increased 2.2% from the previous reporting period. The reporting period may be the current calendar day, the prior 24 hours, or other period as desired. Units3and4are shown as unshaded (i.e., in white) meaning that they are not included in the testing. If a unit being tested has no pathogen presence, it can be depicted in a second color, such as green, blue or another color, indicating it is pathogen-free. Also provided by the display output are the facility name203and the pathogen being detected204. The display output may show the total number of room that have tested positive along with the percentage change for the facility205, and may display the average patient stay206, in this case 3.2 days. The display output may also show the map title and information date207as well as current date and time208. A navigation panel209allows the user to select the page view for the home screen as well as individual units. The current view is the map view of the home page210. The display output may include features for ease of navigation. For example, selecting a unit on the screen may bring up the detailed display for that unit. Selecting the chart view211brings up an historical graph display of pathogen results. The display output can also provide standard statistical calculations such as average, mean, standard dev, or % change, for example.FIG.3shows a display output of a historical graph300. The date range301shows that this graph represents the time period of Feb. 19 to Mar. 19, 2015. The graph300depicts the total number of rooms that test positive for each day of the month. As can be seen in this example, during the one hour and seven minute elapsed time between the current date and time208ofFIG.2and current date and time302ofFIG.3, the total number of contaminated rooms during the reporting period has risen from 7 to 9303. This illustrates how the display device16functions in real time. FIG.4shows a drop-down menu401that can be used to change the historical date range. For example, a user can select the drop-down menu40to change the display from a prior month of history to a prior three month of history.FIG.5shows the range changed to display the prior three months of history. Selecting any point501on the graph may display information specific to that date. A trend line502may be used as an indicator of the level at which action must be taken, in this case, four contaminated rooms. The probability of spreading infection is related to the amount of pathogen present and the number of locations that are contaminated. There may be a number of contaminated locations under which only a limited remediation effort is necessary for the probability to remain low. Anything above this line may require immediate and/or intensive effort to reduce the pathogen content. This number may be decided upon based on historical data and trends, as well as location or other factors. For example, an oncology unit may require a lower contamination tolerance than an outpatient unit since the oncology patients will tend to have compromised immune systems, making them more susceptible to infection. Along with this trend line, the graph may show the average, median, standard deviations or other desired information. FIG.6depicts an example display output as a map600of Unit1, showing room locations and room numbers. This is a map600of the current reporting period, in this case, 24 hours. As illustrated, any room shown in a first color601has tested positive for pathogens in its most recent audit. Rooms shown in a second color602did not test positive for pathogens in their most recent audit. Rooms that are half shaded603are rooms that have a pending test result. The color of the shaded half indicates the prior day's test result. In this figure, room117has been selected, which has brought up a window604showing the prior week's results, with each day shaded in a first or second color depending on results. To the right of the map is provided a status window605having status entries607. Status entries607provided above the line606are completed tests, while entries provided below the line606are pending. The completed test results are displayed in a first or second color to indicate positive or clear (negative) results, and show the room number, result status and time of test. The pending results show the room number, status and the time remaining until results are known. The status in this case is Reader, meaning that samples have been collected and are in the reader awaiting results. Other status entries may include tests that are scheduled, collections being made, in transit between collection and reader, etc. The status line may be selected and dragged upward or downward to view past or future status entries. User selection of a status entry607may bring up a detail window700as the display output, as shown inFIG.7. The window700can include detailed information about an individual test result including room number, date of collection, staff member making the collection, the patient in the room, test results, notes, and may even include data about staff on duty or any other relevant information including qualitative and/or quantitative pathogen data. As with the graph results shown previously, the display dates702may be selected by an end user to view historical data.FIG.8shows the display output providing results800from a one month period. Any rooms that tested positive within this time are shown in a first color, along with the number of days that the test results were positive. This can be displayed as the number of positive results, can be shown as a percentage, or may be a calculated number indicating a persistence factor. A persistence factor may make it possible to recognize rooms that should be investigated because of a persistence or pattern of persistence of pathogens. The persistence factor may be a calculation based on number of recurrences, size of pathogen colonies and other elements that will be determined by practice of the art. Selecting a specific room can bring up a window with that room's historical data. Additionally, the display may be cycled through day by day to view the changing results. As with the whole facility map, the unit data may be viewed in graph form900as inFIG.9. Although not shown in the Figures, one aspect of the system10is the ability to display not only the location and number of occurrences of pathogens, but also quantitative information as well. This may be presented as the percentage of surfaces that are contaminated with pathogens. This may be the percentage of surfaces tested, or an extrapolation of the total contaminated surfaces within an area based on test sample locations and results, and the understanding of pathogen growth and contamination trends learned from historical data. Alternatively, or in addition, the quantitative measure may relate to the size of the pathogen colonies. The size may be the area of an individual colony, expressed in units such as square inches, square centimeters, etc. It may be the volume in cubic inches, cubic centimeter, etc., or it may be the mass of the colony in grams, ounces, etc. The display may present this information in a manner that is most helpful in understanding contamination levels, trends, etc. For example, the charts and graphs shown in the figures that display information about room contamination may include this quantitative information as rough data, percentage of increase or decrease, levels requiring immediate attention, etc. In one arrangement, the data and presentation can be user dependent. For example, an infection control officer may view a hospital-wide contamination map. A historical map can identify locations of recurring pathogens, indicating problem areas that need investigation. A hospital administrator can obtain analytical information, comparisons, and reports. An admissions department may use the information to place incoming patients with a known susceptibility into rooms with historically low pathogen content. As can be seen, the system allows all users of the system to visualize the information in a manner that serves them best, from a whole-hospital “heat map” to details of a singular collection. Additionally, alerts and updates may be delivered using a messaging system, and may include visual and auditory communications. These are only a few examples of its display capabilities. Some embodiments may include a two-way communication capability between the user and the system10. In this manner, a user can request specific information regarding collection, results, statistics, etc. They may also prompt the system10to perform additional assays or other functions if they perceive a need. The display device16can be configured as any appropriate technology or combination of technologies. These may include smart phones, tablets, personal computers, wall-mounted monitors. These devices can be wireless or wired. As new display technologies become available, they can be integrated into the system10. Control System Returning toFIG.1A, the control system18is configured to manage the flow of information, in both directions, between the collection device12, reader device14, and display device16. An example of the operation of the control system18is provided in detail below. For example, the control system18is configured to receive pathogen sample information20from the reading device14where the pathogen sample information is related to a pathogen associated with a facility. For example, the pathogen sample information20provided by the reading device14can identify a pathogen sample type (i.e. a type of pathogen identified by the reader), a pathogen sample collection time, and a pathogen sample collection location of a given facility. After receiving the pathogen information20, the control system18is configured to correlate the pathogen sample information20with a pathogen transmission factor22, such as stored in a database, the pathogen transmission factor22associated with transmission of the pathogen within the facility. In one arrangement, the pathogen transmission factor22can identify a variety of ways in which a pathogen can spread through a facility. The pathogen transmission factor22can identify patient demographics, hospital staff information, or cleaning protocols used, with respect to particular pathogens found in the facility. For example, assume the pathogen information20identifies a particular pathogen as occurring in a given room of a facility, such as a hospital. In response to receiving the pathogen information20, the control system18is configured to correlate the pathogen information20with a variety of pathogen transmission factors22(i.e., factors that affect how a pathogen is spread in the facility), such as a listing of the hospital nurses that have been in the room, identification of the movement of the patient relative to that room, and/or identification of the movement of hospital equipment relative to that room. In this case, assume the pathogen sample information20identifies the pathogen asC. Diff. and the location as Hospital Room1. Also, further assume that the pathogen transmission factor22identifies a piece of medical equipment having been tested positive forC. Diffin the last two days. Based upon a correlation of the pathogen sample information20and the pathogen transmission factor22, the control system18can identify the piece of medical equipment as possibly being the source of the spread ofC. Diff. Next, based upon the correlation of the pathogen sample information20and the pathogen transmission factor22, the control system18is configured to transmit pathogen action information24associated with the primary pathogen sample information to an output device. While the pathogen action information24can be configured in a variety of ways, in one arrangement, the pathogen action information24is configured to inform a user about a condition regarding the pathogen sample information20, thereby allowing the user to take some action regarding the pathogen. In one arrangement, the pathogen action information24can include information indicating a time to collect a sample, information indicating a location to collect a sample, information indicating a process by which to collect a sample, information indicating a type of sample to collect, and information indicating an instruction following collection, such as instructions related to the pathogen. For example, as a result of the control system18receiving and correlating the pathogen sample information20, the control system18can identify the presence of a pathogen in a given location in a facility, such as in a hospital room. In such a case, the control system18can provide, as pathogen action information24, instructions to an end user to overcome issues raised by the presence of the pathogen. For example, the control system18can provide, as pathogen action information24, instructions to remove the pathogen from the location by cleaning or by exposing the location to UV light to kill the pathogens. Alternately, the control system18can provide, as pathogen action information24, instructions to select pathogen-carrying or pathogen-resistant patients or staff to access the pathogen-positive location. Accordingly, in the case where a pathogen is detected, the control system18is configured to provide, as the pathogen action information24, instructions to an end user in order to remedy issues raised by the identification of the presence of a pathogen in a facility. In another example, with reference to the scenario provided above, in the case where the control system18identifies a particular piece of medical equipment as possibly being the source of the spread ofC. Diff, the control system18can provide a notice via the display device16, as the pathogen action information24, that the piece of equipment may be the source of the spread of the pathogen. Further, the control system18can provide, as the pathogen action information24, a modified pathogen detection schedule, pathogen cleaning schedule, and/or an identification of the presence of the pathogen in the given room using a map of the facility provided by the display device16. Each of these mechanisms provides information to a user about a condition of the pathogen sample information20, thereby allowing the user to take some action regarding the pathogen. As provided above, one arrangement, the control system18is configured to perform a number of functions. For example, the control system18is configured to provide pathogen action information24, such as pathogen collecting instructions as described above, to an end user via an output device such as the display device16. The collection methods, schedule of collections and other necessary information may be pre-determined and programmed into the controller21. A schedule may be determined in a manner that assures that each room is audited, for example, every three days. If particular locations are more problematic than others, they can be scheduled for audit more often than others. As patterns are developed and recognized through the course of the ongoing audits, the control system18is configured to adapt and modify schedules to more effectively audit the facility. In some embodiments, this modification can be accomplished by the front-line staff responsible for remediation through an interactive display device, or may be the responsibility of an infection control officer or other staff member. In some embodiments, modifications are determined by algorithms within the control system. As with the audit schedule, collection locations within a room can be pre-selected and then modified based on ongoing audit results. For example, initial locations may be based on recognized Critical Touch Points (CTP). CTPs represent areas of a facility touched frequently by multiple people, creating conditions conducive to the spread of HAIs. Some examples of CTPs include: bed frame, TV remote, bedside table, mirror, chair arm, door knob, trash can, IV pole, sink fixture, light switch, toilet fixtures, TP dispenser, Blood pressure cuff, shower head, and telephone. The control system18is configured to modify all aspects of collection instruction over time, based on audit results, to improve efficiency of collection and value of results. The control system18is also configured to correlate the results obtained by the reading device14(i.e., the pathogen sample information) with a pathogen transmission factor22associated with the transmission of a pathogen within a facility. For example, the control system18is configured to match each collected sample's result20with the location and time of collection stored in a database. If specific pathogen information is included in the test, that will also be correlated to the sample time and location. The control system18is also configured to transmit and present the correlated information (i.e., pathogen action information24) to the display device16. For example, the control system18is configured to format the pathogen action information24into the desired visual representation as described above, and then send it in one or more formats to one or multiple display devices16. In one embodiment, the control system's database resides in a cloud-based system rather than on a localized computer. In this manner, the control system18can manage information from multiple facilities, and data can be correlated between facilities. Adaptive Learning In one arrangement, the control system18is configured to continuously receive pathogen sample information20from one or more reading devices. In such an arrangement, the control system18is configured to utilize the information or data20to adjust a database of pathogen transmission factors22in order to adapt collection methods and locations based upon historical results (i.e. as associates with the pathogen transmission factors22). This is an adaptive, self-learning system utilizing constant feedback to maximize the ability of the control system18to detect pathogens. The control system18can adapt collecting techniques to particular facilities or types of facilities, location within a facility, and type of room or even specific rooms and location within rooms. It can also take into account the pathogen types and their traits, such as locations that they are commonly found, etc. For example, as indicated above and with respect to a first iteration of the process, the control system18is configured to receive primary pathogen sample information20from a reading device14, correlate the information20with the pathogen transmission factor22, and transmit pathogen action information24to an output device. In one arrangement, with reference toFIG.1A, following transmission of the pathogen action information24, the control system18is configured to receive secondary pathogen sample information20′ related to the pathogen associated with the facility. For example, assume the case where the initial pathogen action information24instructs an end user to sanitize Hospital Room1because the presence ofC. Diff. had previously been detected there. Following the cleaning process, the end user then collects a secondary pathogen sample from Hospital Room1using the collection device12and provides the sample to the reading device14for analysis. Following the analysis, the reading device14is configured to transmit the updated, secondary pathogen sample information20′ to the control system18. Based upon the secondary pathogen sample information20′ received from the reading device14, the control system18is configured to update the pathogen transmission factor22. For example, assume the case where the secondary pathogen sample information20′ identifies the continued presence ofC. Diffin Hospital Room1. Based upon such an indication, the control system18is configured to update the pathogen transmission factor22(e.g., the pathogen transmission factor database) to indicate the continued presence ofC. Diffin Hospital Room1. Next, the control system18correlates the secondary pathogen sample information20′ with the updated pathogen transmission factor22, and based upon the correlation of the secondary pathogen sample information20′ and the updated pathogen transmission factor22, transmits pathogen action information24′ associated with the secondary pathogen sample information to the output device, such as display device16. For example, with the updated pathogen transmission factor22indicating a continued presence ofC. Diffin Hospital Room1(i.e., following the sanitization of Hospital Room1as instructed in the first iteration) correlation of the secondary pathogen sample information20′ updated pathogen transmission factor22can cause the control system18to transmit pathogen action information24′ requiring the testing of other equipment in Hospital Room1to identify a source of theC. Diffcontamination. The control system18is further configured to continue the above described iterative process with subsequent secondary pathogen sample information20′ received from the reading device14. Such a process allows the control system18to develop the pathogen transmission factors22(i.e., the pathogen transmission factor database) to maximize the ability of the control system18to detect pathogens. In one example, as described above, audits may start with known CTP locations and a prescribed number of samples in a room. As results are compiled by the control system18, the number of samples and their locations can be fine-tuned so as to sample the locations most likely to return a positive result. If, for example, a particular location generally returns a negative result, the control system18may limit or stop future collection at that location, and instead collect at an alternative location, or eliminate that collection entirely. If a particular location generally returns a positive result, the control system18can add or relocate samples in future collections to locations that have similarities. For example, if a pathogen is found on a piece of equipment in a room, the control system18may test other equipment in the room. The control system18may also decide to test similar equipment in other rooms. It can be seen that this system18will help to fine tune its detection capabilities to develop testing protocols that will sample the locations most likely to return a positive result. If the particular pathogen found is included in the data, the testing can be tuned to test for the most troublesome pathogens. In one arrangement, when the control system18is initially brought online, the system18is configured to compare and contrast the results of sample type, location and result (i.e., pathogen sample information20) with the pathogen transmission factor22. As the database of pathogen transmission factor results22grows, the control system18is configured to analyze the database to recognize patterns and trends in the data22and to analyze patterns within patterns. As additional information is entered into the control system18, such as patient demographics, hospital staff information, cleaning protocols used, etc., these variables can be analyzed within the context of results for an in-depth understanding of complex interactions. As the database grows and algorithms evolve, the control system18can become predictive. With the ability to predict future trends, the system will tailor auditing methods to find contamination at the earliest possible stage. In some embodiments, control systems may be interlinked. This can include multiple control systems18sharing a database, or a centralized control system18supporting multiple facilities. One advantage of interlinking is that as each control system18evolves, it can share its learning with the others, improving the performance of auditing at all facilities. Another advantage of interlinking is the ability to compare patterns and outcomes between facilities. For example, a series of events at one facility may have preceded an outbreak. The pattern is recognizable and becomes part of the system's database. The control system18can look for the beginnings of this pattern in other facilities and take steps to avoid an outbreak there. Interlinking can take place within floors of a facility, between local facilities, regional facilities, or even national or worldwide facilities. These are only examples of the benefits of interlinking. In some embodiments, the control system18is configured to collect information about the cleaning methods and protocols that are used in response to a positive pathogen result. This data can be used to correlate the audit results with the efficacy of the cleaning methods. The employee performing the cleaning may, for example, enter cleaning information into the control system18. This information may include cleaning chemicals used, method of cleaning, specific items and location cleaned, etc. This information may be entered using any of the communication devices previously discussed. The control system18can compare cleaning methods to audit results and build a database of the most effective responses to pathogen contamination. As the control system18learns (i.e., builds the database with most effective responses), it may display suggested cleaning methods along with the pathogen location information. In one arrangement, the control system18may perform comparative analyses. For example, results obtained both from collecting samples (i.e., pathogen sample information20) and from analyzing cleaning methods can be compared between the technicians who performed the collection and/or cleaning. If, for example, a technician's results are notably different from the norm, it offers an opportunity to improve the results by learning effective methods from higher performing technicians, and by increasing training for lower performing ones. These comparisons may also be made between locations such as floors, departments, facilities, regions, etc., and by shift, day, season or any other distinction that can help the system learn and understand the cause and effect of behavior vs. performance. If the control system's database contains data24from multiple facilities, that data can be compared and trends can be analyzed. Recognizable patterns may develop, providing an understanding of the trends of pathogens and their spread. These patterns can be used to predict the location and type of pathogen and help to guide audits. The control system18may also obtain the ability to predict future outbreaks by recognizing a set of conditions that are conducive to an outbreak, and therefore facilitate its prevention. This is particularly valuable and effective when the control system18is connected between facilities as it may see potential problems that can affect facilities around a region. In some embodiments, the control system18may have access to certain of the facility's own data. This can be through a direct link to the facility's electronic medical records, or by way of limited anonymous data compiled specifically for use by the system. Data that is obtained may be used to determine trends by interlinking it with information acquired during auditing. These trends are used to improve audit effectiveness and to ultimately make predictions and conclusions that will aid in the prevention of HAIs and disease outbreaks. Trends can be followed and linked geographically by room, department, facility, region, etc., demographically by patient status, diagnosis, history, etc., and chronologically by time, date or season. In some embodiments, it can be advantageous to the control system18to understand the human and/or equipment traffic entering and exiting a patient room or other location. This may be as simple as counting the total number of visitors to a monitored location using a commercially available proximity detector, camera or other device capable of recognizing that a person or piece of equipment has passed through a doorway. In this manner, the control system18is configured to correlate the presence of pathogens to the total quantity of staff and other visitors entering the space. This correlation may show that high traffic areas have a higher probability of pathogen contamination than low traffic areas. This information can be used to adapt collection quantities, locations and techniques. The control system18can utilize total traffic counts within a time period, or look at traffic vs. time of day to obtain and understand trends. A traffic-identifying system may include recognition of the traffic entering and exiting the space. For example, staff member's badges may include an RFID tag or other device that allows the system to specifically identify them as they enter or exit the space. In this manner, the system can determine any correlation between particular staff members and pathogen presence. Visitors may be issued badges with similar capabilities. The control system18may utilize a camera-based system. Such a system may include facial recognition or other techniques to identify staff, patients, visitors, etc. Additionally, people's motion may be detected and analyzed. There are systems currently available that have the ability to do this. Examples of this technology include Echo5D™ by Atlas5D™, as well as the Kinect Sensor. By including this capability, the system can determine motion within the space, and may monitor contact between the patient and medical staff and visitors, medical equipment and other surfaces within the patient's environment. All of this information may be used by the system to understand interrelations between all these variables and employ the findings for the prediction of pathogen locations. Any information obtained by the control system18may be used to generate more effective auditing. This can be include adding the diagnosis of the previous patent. In this manner, audit results can be compared to patient diagnosis data. For example, after a patient discharge, if the prior patient had MRSA, it could trigger a different audit protocol than if the patient had a different, or no infection. As more data is acquired by the control system18, the results will continue to improve. This data can be patient related, such as demographic statistics, or may be related to the facility's staff, such as the doctor, nurses, cleaning staff and other employees. This can show trends pertaining to specific workers. The same is true for the geographic locations within a facility showing, for example, that a particular room, floor, department, etc., has more or less propensity for pathogens. Chronology can add an additional dimension of detail, as trends can be followed by time of day, season, etc. With these factors considered, the number of samples and their locations for any room audit can change in real time based on the history of that particular room, its patients, staff and any other contributing data. The control system18may even be configured to take into account health related information from other locations within a facility, or within other facilities in the immediate geographical area, within the region, or even a wider area. In one arrangement, mathematical prediction methods can be developed and improved with practice of embodiments of the current innovation. As an example, the control system18configured to execute a discriminant analysis may be used to predict the probability of pathogen presence. This probability can then be used to determine collection location, type frequency, etc. An example equation can be shown as: Probability of pathogen presence=P(PP)=α+β1X1+β2X2+β3X3+β4X4. . . , where X1,X2, etc. are the variables as described above and can include collection results such as pathogen presence, type quantity, etc., patient demographic, staffing, cleaning protocols used, traffic and others. β values are weighting values for each of the variables. The weighting values will be determined and modified over time as results are correlated and understood. This is merely an example of the type of equation that may be used by the adaptive, predictive control system18. Depending upon pathogen detection results, formulas may change over time, as may weighting values and included variables. In some embodiments of this innovation, the control system18can be configured with the ability to direct cleaning and remediation efforts that are determined by audit results. With knowledge of the particular pathogens that were detected and their location, specific and targeted cleaning methods can be determined. This can employ the most efficacious cleaning chemicals and methods to use for a given pathogen on a given surface. For example, ifC. diffis found on a bed rail, the system may know that the best way to remediate it is with a bleach wipe. Depending on the pathogen to be removed and the surface on which it is found, the best methods and cleaning chemicals can be determined. This cleaning information may be communicated to the staff via the display. In some embodiments, this control system18can be configured to specify the use of targeted cleaning kits. Kits can be designed that contain chemicals, cleaning tools and instructions necessary for cleaning a specific pathogen on a specific surface. In the previous example ofC. difffound on a bed rail, an individually identifiable kit could contain bleach wipes and instructions for cleaning. Other individually identifiable kits can contain chemicals and cleaning supplies for any number of pathogens and surfaces. The use of kits in this manner can help to insure thorough disinfection and simplify the cleaning process. Additionally, the system may determine that an alternative sanitizing method such as room fogging or other whole-room sanitizing method would be most effective. Additional steps may be taken to assure the quality and effectiveness of audit results. These can be used as a method to certify collection technicians, audit results and facilities. These steps are a series of checks and balances that add confidence to the validity of the audit. Collection technicians can be trained and certified in the proper use of devices, testing methods and protocols, as well as ethical and performance standards. Only certified staff with proper identification may collect samples. These staff members may be hospital employees; however, it may be preferable for them to be employees of an independent auditing company. This provides impartiality and can add confidence to the audit results. The control system18can compare audit results from the certified staff members. If a collection device12has notably different results from a statistical norm, it may be an indication of a performance problem that needs to be addressed. The control system18can look at percentage of negative results, amount of time taken for collections, etc. This step provides an additional level of confidence in the audit results. An independent laboratory may be used to verify the results of the system's reader device14. A percentage of samples that have been read may be sent to the laboratory to be analyzed. The percentage of samples can be a fixed amount, say 10%, can be variable based on results, or can be determined by an appropriate statistical sampling method. The laboratory's results are compared to the reader device's results as one more check on the system. A collection device12may be used that contains a control sample. For example, the collection device12may contain two compartments, one for the collected sample and one containing the pathogen being studied. This is can be configured as a simulated, inert version of the pathogen. The control sample should always return a positive result. If the result of the control is negative, it indicates that the reader is not performing correctly. A positive control sample result adds to the confidence of collected sample's result. Pathogen Detection Taken together, the collect and read functions of the collection device12and the reader device14can form a pathogen detection system. Conventional detection methods run the gamut from simple products that determine if a spot has been cleaned to sophisticated scientific methods such as spectroscopy and DNA testing. By contrast, embodiments of the control system can use any applicable technology to detect the presence of harmful pathogens, breaches in cleaning protocols or other indicators of potentially harmful conditions. Embodiments of the innovation are not dependent upon a specific technology. As improved detection methods and devices are developed, they may be incorporated into this system. Pathogen detection methods that can be utilized by the current innovation vary widely in the length of time needed to obtain results, from minutes to days. Although faster methods can be advantageous, even the slowest methods have value. Immediate results are not as critical to the system's efficacy as is the value of an ongoing audit. The continuing stream of pathogen data will provide an understanding of the level of accumulation of pathogens in terms of presence, persistence and quantity. This is particularly true in the prevention of outbreaks, since it takes a number of days for an outbreak to occur, and even the slowest methods allow for detection and remediation substantially before that time. With an average hospital stay of 3.6 days, results can be obtained before an infection is spread from one patient to the next. This alone can substantially decrease the occurrence of HAIs. Even in its simplest embodiment, the current innovation can have a tremendous effect on the incidence of HAIs, saving many lives and billions of dollars. In a health care facility, where infections are commonplace, it is often ordinary practice that the occurrence of three patient infections triggers an action for infection control and remediation. This means that a hospital room that is contaminated with a pathogen can cause three HAIs before it is attended to. An example scenario for the current innovation will use the following assumptions: ⅓ of hospital rooms will be audited each day, meaning each room is audited every 3rd day. The pathogen detection test returns results in a maximum of 3 days. This is the slowest of the current technologies. Audit results for each room are received every 3 days, reporting pathogen contamination from 3 days prior. The average patient stay is 3.6 days. The result is that even with a 3 day return of test results, on average only 1 patient can be exposed to pathogen contamination. That is one patient exposure compared to the current 3 patient infections. This means that the current innovation, in its simplest form, can reduce the occurrence of HAIs in an audited room by ⅔. To further illustrate, an example timeline will be presented: Day 1. Audit sample (1) is collected. Later in the day, a patient is admitted. This patient (1) is an asymptomatic pathogen carrier who subsequently contaminates the room. Day 4. Audit sample (1) returns a negative result. Audit sample (2) is collected. Patient (1) is discharged. Another patient (2) is admitted. Day 7. Audit sample (2) returns positive for pathogens. Patient (2) has been exposed, but may not yet be symptomatic (It can take from 2 days to over a week for incubation). If patient is deemed susceptible, antibiotics may be started. The room is remediated. This nearly worst-case scenario illustrates that the current innovation, even in its simplest form and using the slowest test methods, can be extremely effective. Even though patient (2) was exposed, the exposure was detected prior to the patient's discharge. Treatment can begin, and the patient can be discharged on schedule. Without the knowledge gained from the audit, this patient could have been discharged and become symptomatic after returning home, resulting in a costly readmission. The delay in treatment may have resulted in a severe infection, causing a lengthy stay in the hospital, or even death. Additionally, without the continuing audit, two additional patients may have been infected prior to remediation. Table 1 shows the above scenario along with modifications and illustrates the effect of collecting samples more frequently and using tests that can return a result in one day. The results in bold indicate positive results. All results are based on an average length of stay. As would be expected, the best results occur when the room is sampled every day using a test with a one day result time. In this case, pathogen contamination is discovered prior to patient 1 being discharged. The other scenario that, on average, may return a positive result prior to patient 2 being admitted is to sample every two days with a one day test result (depending on the time of day that the result is received). All the other results are received between one and four days after patient 2 is admitted. TABLE 1sample frequency (days)332211result time (days)Day3131311sam-sam-sam-sam-sam-sam-patient 1ple 1ple 1ple 1ple 1ple 1ple 1admitted2result 1result 1sam-sam-ple 2ple 2result 13sam-sam-result 2ple 2ple 24samplesampleresultresult 2resultpatient 12 result211discharged1patient 2admitted5result 2sam-result 2ple 36result27sample3 result2 The above scenario does not take into account additional factors. Current research shows that the probability of a patient becoming infected by contamination in a room appears to be related to the percentage of surfaces within that room that are contaminated. Additionally, the quantity of bacteria present on a contaminated surface contributes to the probability of the pathogen being spread. The more massive a bacteria colony is, the more likely it is to be contacted and to cause infection. The opportunity for the spread of contaminants increases with time as the patient, visitors and staff touch multiple surfaces, depositing and/or spreading pathogens, and pathogen colonies have time to grow. The length of time it takes for the contamination level to reach a point of high probability of transmission is variable and uncertain, but it may take days to weeks for the level to become critical. This makes the current innovation even more effective because pathogens may be found by an audit before having enough time to spread and grow, creating a high probability of infecting a patient. Even with a 3 day audit result, many pathogens will be found and remediated when their levels are low and not likely to cause infection. The choice of sample frequency, and the resulting cost increases will be determined by factors such as staffing levels, costs of testing and, mostly, effectiveness as determined by the evidence produced by the scientific audit. The choice of sampling frequency and protocols for a particular facility or location within a facility may involve additional factors. Some areas, such as day surgery, emergency rooms, urgent care facilities, etc. will have a shorter length of stay than the 3.6 day average, as well as exposure to more patients. It may be advantageous to sample more frequently and/or choose more rapid detection methods in these areas. In contrast, a chronic or other long term care facility may not need to be audited as often. Facilities that work largely with patients that have compromised immune systems, such as oncology, can require more frequent audits than a physical therapy department that works with injured, but generally healthy patients. These are illustrative examples, and not an exhaustive list. Any factors that contribute to the spread of pathogens and resulting infections may be taken into account. With most technologies currently available, a detection method can generally test for only one type of pathogen. The particular pathogen being audited must be determined prior to testing. For example,C. diff, which may account for as much as 30% of HAIs, may be of particular interest within a facility. Even if this were the only pathogen being tested for, the system would still be effective. WhereC. diffis found, there are likely to be other pathogens. Additionally,C. diffis a difficult pathogen to remove. If an area has been cleaned well enough to removeC. diff, then most other pathogens have also been removed. Because of this, the result of testing forC. diffalone can be substantially greater than 30%. Testing for specific pathogens may be location dependent. If a facility, or location within a facility, historically shows a more significant occurrence of a different type of infection, for example MRSA, then it may be more effective to sample for that pathogen. The selection of pathogens to test may also change with time, as different ones become predominant. Audits may be chosen based on historical information, for example, if a room's prior patient had an infection that may cause an HAI, the next audit for that room may test for that specific pathogen. Numerous testing methods can be developed as the auditing system is used. For example, target pathogens may be alternated during subsequent audits, or more than one target pathogen may be sampled in an audit. As testing technologies become available that can sample for multiple pathogens, they can be incorporated into the current system. Patient Perimeter A patient may contact environmental pathogens by touching surfaces, people or other items that are contaminated. Accordingly, important locations to sample are those within the patient's reach. A patient's condition may be taken into account by the system in order to refine sampling by defining a patient perimeter. A patient who is confined to a bed can only reach a limited distance, and so has a small perimeter in which to make contact with pathogens. In one arrangement, the system can confine sampling to locations within reach of the patient, such as the bed, table, IV pole, night stand, telephone, TV remote, etc. A patient with limited mobility may get out of bed only to use the bathroom. Knowing this, the control system18may expand the perimeter to include any surfaces or objects between the bed and bathroom, as well as inside the bathroom itself. In the case of an ambulatory patient, the perimeter may expand to include the entire room. In a unit with ambulatory patients, the patient perimeter may expand to encompass hallway surfaces, equipment, etc.FIGS.10A and10Bdepict a hospital room. Within it are the bed1001, table1002, stand1003and bathroom1004. For the bedridden patient, the patient perimeter may be defined as shown1005inFIG.10A. For the patient with limited mobility, it may be defined as shown1006inFIG.10B. For the ambulatory patient, the entire room may be defined as the perimeter. In one arrangement, the control system18is configured to define a patient perimeter25as a pathogen transmission factor22associated with a patient location within a facility, such as based upon the above-referenced criteria. Defining the patient perimeter allows the system10the ability to perform the most effective and cost-efficient sampling possible. For example, the control system is configured to transmit pathogen action information24to an output device based upon the correlation of the pathogen sample information20, the pathogen transmission factor22, and the patient perimeter25. By defining the perimeter, the pathogen action information24can indicate that areas that are not likely to infect a patient are not sampled, saving time and cost. In a smaller perimeter with less area and surfaces, it may be an advantage to sample a higher percentage of surfaces to increase the confidence of the results, since a sample area with a small perimeter may take less time and fewer collection samples. In many cases, a small perimeter may indicate a compromised patient with a weak immune system. More concentrated sampling can give a higher confidence of a pathogen-free environment. As a patient's status changes, the system may adjust the patient perimeter to suit. For example, a patient perimeter can be classified based on mobility and/or on diagnosis. The patient perimeter can also change with time. In a room that contains more than one patient, the control system18may consider the status of all patients when determining appropriate sampling methods and locations. FIG.11shows one example of a double room in which both patients are ambulatory. The patient in the first bed1101has a patient perimeter depicted by the solid line1102. The patient in the second bed1103has a perimeter depicted by the broken line1105. The area where the two patient's perimeters overlap is shown by hatch lines1106. The overlapping area includes the bathroom and the aisle in front of the second bed. The control system18may determine that the overlapping area requires more stringent auditing then the non-shared areas. This may include sampling more area of the surfaces, sampling additional surfaces, testing for multiple pathogens, more frequent auditing, etc. Other factors may be included in sampling decisions. For example, since all persons entering or exiting the room must pass through part of the perimeter of the patient in the second bed, additional or alternative testing may be conducted in that patient's area. The health of the individual patients or even the previous patient's diagnosis may be incorporated by the system for use in determining sampling techniques. These are only examples of the use of a patient perimeter as an element in determining sampling techniques and frequencies. These methods may be used with rooms with more than two patients, with alternative room layouts and floor plans, or in combination with any other methods described in this disclosure. Other perimeters may also be defined, such as hallways and common areas, diagnostic rooms, etc. These perimeters will be defined as zones. The zones in this example are not a complete list, but are useful to illustrate aspects of this innovation. Zones may be added, subtracted of changed as needed, depending on an individual facility, type of treatment, etc. For this example, zones will be defined as: Zone 1: perimeter of a bedridden patient (1005inFIG.10A) Zone 2: perimeter of a patient with limited mobility (1006inFIG.10B) Zone 3: perimeter of an ambulatory patient; the entire room, including bathroom Zone 4: areas shared by more than one patient (1106inFIG.11) Zone 5: unit hallways and common areas Zone 6: diagnostic or treatment areas (X-Ray, PT, etc.) These zones may be used in a patient centered approach to determine when and where to collect samples to most efficiently and effectively find and aid in the removal of pathogens. A patient can be classified as a Zone 1, 2, or 3 patient as described above. An auditing protocol may be defined for each zone. For example, a Zone 1 auditing protocol (AP1) will order samples to be collected on the critical touch points within reach of a Zone 1 patient. In embodiments utilizing an adaptive system as described previously, the sampling points may change with time, based on the results of previous collections. A Zone 3 auditing protocol (AP3) will include sample locations within the entire room and bathroom. This is similar for all zones. Some embodiments may include multiple protocols for each zone. There may be a standard protocol along with an enhanced protocol that includes more detailed sampling or pathogen-specific sampling based on a patient's susceptibility, sample result history or other factors. For example, a standard Zone 1 audit protocol may include sampling a total area of 20 square inches on the bedrails, table and IV pole. If a Zone 1 audit tests positive, the system may trigger an enhanced audit protocol that samples 50 square inches of surface on the standard audit surfaces plus others. If a patient being admitted is deemed to have a high susceptibility of infection, or if the prior patient had an infection, it may also trigger an enhanced or expanded audit. There can be multiple audit protocols for each Zone that are targeted to specific pathogens, patient susceptibilities, prior history and other factors. In some embodiments, the system can initiate a remediation protocol based on audit results. Cleaning and sanitizing protocols can be developed for each zone. For example, a Zone 1 remediation protocol (RP1) will encompass the cleaning methods, tools and cleaners necessary for an intensive sanitizing within that zone. This is similar for all zones. There may be more than one protocol for each zone. The choice of protocol may be based on the specific pathogen found or other parameters. Additionally, enhanced protocols with more rigorous remediation techniques may be used in Zones that have a persistent or large volume contamination. In some embodiments, the materials and supplies for each auditing and/or remediation protocol may be prepared in kit form. For example, the system may instruct the user to acquire an AP1 kit and proceed to a specific room to collect samples. The AP1 kit may include collection devices12and instructions necessary to take samples in Zone 1 of that room. Similarly, the system may send an instruction to acquire a RP1 kit, containing the necessary chemicals, supplies and instructions, and proceed to a specific location to perform a remediation. The flow chart1700inFIG.17shows a decision path for each of the zones. This example shows both auditing and remediation responses, however some embodiments may include auditing only. For simplicity, only one auditing protocol and one remediation protocol is shown for each zone. These are simplified examples. It may be preferable to include additional factors in the decision tree. These may include patient diagnosis, pathogen results and history, multiple protocols for each zone, etc. Referring now toFIG.17, each patient's zone is defined as Zone 1, 2 or 3 as described above. For a Zone 1, or bedridden patient, AP1 is deployed. A negative result indicates there is no pathogen contamination. In this case, the standard auditing schedule is continued. A positive result indicates the presence of pathogens, which can require further action. It may be important to know if the patient has left the unit, for example has been transported for X-Rays, physical therapy, etc. If the patient has been to another location, it may be necessary to test that location to determine whether pathogens have been carried there by the patient. If so, the system can order the deployment of AP2 (expanding to the next zone) and AP6 (the visited location). If the patient has not left, then only AP2 is necessary. At this point, RP1 may be deployed to remediate any pathogens in Zone 1 of the patient room. If the sample results are negative, the standard audit is resumed. If the results are positive, the audit area is expanded to Zone 3, remediation expands to RP2, and if positive at the remote location, RP6. Negative results always return the system to the standard auditing protocols. Positive results can trigger expanding sample and remediation zones. For a Zone 2 patient, with limited mobility, the control system18may inquire whether the patient is in a shared room. If so, then Zone 4 (the shared space) can be included in the auditing and, if necessary, remediation protocols. For a Zone 3 ambulatory patient, the standard audit zone is expanded to the entire room SP3. Since this patient has access to more spaces, a positive result may require auditing and remediating the unit hallways and common areas. These examples show only one timeline that may span multiple days. The standard auditing procedures may test each room daily, every 2 days, etc. For each patient or room, there may be multiple timelines at various points in their progression. The results from one timeline may be used as a factor in making auditing and remediation decisions in concurrently occurring timelines. Detection Technologies Following is a synopsis of several conventional pathogen detection technologies. The current innovation may incorporate one or more of these, or other, pathogen detection technologies. ATP tests can reveal biomass left on a surface, and results are available in minutes. A disadvantage with ATP testing is that it indiscriminately detects biomass and cannot tell the difference between living or dead cells, or whether a detected biomass is harmful or benign. This can result in a great deal of cleaning effort to remove harmless substances. Another technology would recognize and possibly identify and classify pathogens. One conventional method used in healthcare facilities is to culture samples taken within a room that is suspected of being contaminated. An area is swabbed for a sample, which is then placed into a growth medium such as agar. The sample is incubated at an elevated temperature and observed for bacteria growth. Various growth media and techniques may be used to test for a variety of pathogens. As the pathogen colonies grow, the morphology of the growing colony is observed and the type of microbe is determined. Initial results can begin to be seen in approximately six hours, but it can take up to 48 hours to make a positive identification. This method relies on the experience of the observer to make a correct identification. It can, however, obtain detailed information about the type of pathogen found. Gram staining is a conventional method of classifying bacteria. This is a manual process in which a sample is prepared and then viewed under a microscope. The multi-part preparation includes smearing the sample onto a slide, covering with crystal violet, rinsing, covering with Gram's iodine (mordant), draining then rinsing the slide in 95% ethyl alcohol, rinsing, covering with safranin (counterstain), rinsing and blotting. The prepared sample is viewed under the microscope, and bacteria are identified by color and shape, and are classified by gram positive or gram negative. Gram positive bacteria stain violet and includeBacillus, Listeria, Staphylococcus, Streptococcus, Enterococcus, andClostridium. Gram negative bacteria stain red, and can includeE. coli, acinetobacter, Klebsiella pneumoniaand others that result in many types of HAIs, including pneumonia, urinary tract infections, and bloodstream infections. Liquid chromatography-mass spectrometry can be used to identify microorganisms. A sample is first separated by liquid chromatography, where a pressurized liquid and a sample mixture are pumped through a column filled with a sorbent, which separates the sample components. The components are then analyzed by the spectrometer, which breaks down the light emitted or absorbed by chemical elements into specific lines of color. Every chemical element on the periodic table has its own spectral fingerprint that identifies it, so the chemical compounds can be identified. In two of the more commonly used methods, Raman spectroscopy measures the scattering of light, while infrared spectroscopy is based on absorption of photons. This technique is rapid and accurate, but the equipment is very expensive, costing $80K and up per unit. DNA testing can be used to identify microbes. One method of DNA testing utilizes a CCD camera for Surface Plasmon Resonance imaging (SPRi). This is an optical process used to detect the binding of molecules onto arrays of probe biomolecules attached to chemically-modified gold surfaces. In basic terms, the camera looks at light refracted through a prism and a computer creates a DNA image from the information. In one arrangement, optics-based instant read scanning devices can also be utilized. For example, optics based devices can illuminate a microbe with specific wavelengths of light and detect optical phenomena specific to pathogens. Collection Device Accuracy and consistency of sample collection is critical to obtaining legitimate pathogen testing results. Some embodiments of this innovation may utilize a sample collection device12that will assist the user in collecting samples at the correct locations, at the correct time, and with proper collecting techniques FIG.12shows an example collection system1200having a collection device1201and a replaceable collector1202. In one arrangement, the collection device1201includes a user computerized device, such as a smartphone1203and a smartphone housing1204. A commercially available smartphone, such as an iPhone, Android, etc., may be used, since these devices contain many of the features that will aid in collecting samples. However, a custom designed device could also be used. The smartphone1203may be inserted into the housing1204in the same manner as it is inserted into a protective case. The housing1204allows the user device1203to interface with the replaceable collector1202and may contain additional electronic and/or mechanical components and connections. The replaceable collector1202contains a swab component (not visible in this view) that is wiped on the surface being sampled. The collector1202comprises a body1205with an attaching means1206to removably attach it to the housing. In this example, the collector body1205has a hinge1207that allows the body to open, exposing the swab. In one embodiment, the collector1202is automatically identifiable by the collecting device1200. This example utilizes a bar code1208that can be read by the smartphone. Other identifiers may be used, such as QR codes, RFID or other suitable technology. The shape, attaching mechanism and other details of the collector1202are exemplary and not meant to be limiting. Other designs can function as well within the scope of this innovation. FIGS.13A through13Cillustrate the progression of the attachment of the collector1202to the computerized device housing1204. In this case, a tab1301mates with the slot1206in the collector1202. In the view illustrated inFIG.13C, the collector1202is fully inserted and attached to the housing1204. FIG.14Ashows the underside of the collection device1200. In this embodiment, the smartphone's camera1401can read the barcode1208on the collector1202. Since each collector1202has a unique identifier, the device1200will be able to match the specific collector to the time and location of sampling. As illustrated inFIG.14B, the collector body1202has been opened at the hinge1207to expose the swab surface1402. A seal1403may be incorporated into the collector body1204to keep air and moisture away from the swab both prior to and after sampling and insure that any pathogens within the sample are captured. In one embodiment, the camera retains visibility of part of the collector when it is open. In this manner, the device insures that the collector is not only open and ready for sampling, but is still present. The material of the swab1402may be chosen depending upon the specific pathogen being tested. Commonly used materials are cotton, PET and polyester. The collection device1202may also contain a neutralizing broth additive that neutralizes residual sanitizers that may be present on a surface. Swab materials and additives are well known in the art and will not be discussed in detail. In some embodiments, one collection device1200may be used to test for different pathogens, depending on the type of growth media used in processing the collected sample. One sample may also be used to test for multiple pathogens by splitting the sample between growth media. Additionally, a control sample may be contained within the collection device1200. This can be an inert version of the pathogen being tested. There may be collection devices1200of differing types with materials and additives selected for specific pathogens of interest. The collection device1202to be used may be chosen by the type of pathogen being studied. Since all collection devices1200are individually identified, the device can determine whether the correct collector is being used. FIG.15shows the collection device1200in position ready to sample a horizontal surface.FIG.16shows an embodiment of the collection device1200with a retractable handle1200that is lowered to allow a user to grasp and maneuver the collection device1200during a sample collection procedure. The collection device1200performs many functions that aid in accurate and consistent sampling. In one scenario of its use, the technician turns on the device and logs on to the detection and display system10. This may be a manual login, but is preferably an automatic recognition of the technician. This can be accomplished in ways that include scanning a bar code, QR code or other identifier that is on the technician's identification badge. Many user devices are configured with the ability to read finger or thumb prints, or perform retina scans. This offers a positive identification of the person using the device. Once logged onto the detection and display system10, the collection device1200receives sampling instructions from the pathogen display system's controller. The sampling device can now pass these instructions to the user through the audio and video capabilities of the device's smartphone. Instructions may include which room or area will be sampled, where within the area to sample, which collection device1202to use, when a sample has been correctly taken and other information. The scenario may go as follows: The technician turns on the collection device18and logs into the detection and display system10via thumbprint scan, etc. The technician is instructed by the control system18to go to a particular space within the facility. The technician is instructed by the control system18to attach a collector1202to the device1200. In cases where there is more than one type of collector available, the type will be specified. The device1200identifies the collector as being an unused collector of the correct type, and records the identifier. The technician is instructed by the control system18to open the collector, exposing the swab portion. The device confirms that the collector is ready to swab. The technician is instructed by the control system18to take a sample from a specified location. In some embodiments, the device utilizes the smartphone's onboard GPS, accelerometer and orientation capabilities. By using these capabilities, the control system18can determine the exact location of the sample, the velocity at which the sample was taken and the angle of the device in two axes. Some embodiments may include a force measurement. This can be accomplished by including a force sensor in the device housing and transmitting the data to the smartphone. Alternatively, certain smartphones are configured with pressure sensitive displays, the onboard sensor may be used. The technician can be instructed to hold the device and press on a location on the display to apply pressure to the swab. The pressure on the display can be used to calculate the actual force on the swab. With this information, the device1200can assure that the sample was taken at the correct location and sampling area, that the swab passed over the surface at the optimal sampling velocity, that the angle corresponds to the orientation of the surface being sampled, and that the optimal amount of force was put on the swab. If any of these sensed sampling parameters are not optimal, the device can give the technician instructions to correct their technique. The device may even give the technician a score on their performance, for example 1-10, for immediate feedback on the quality of their sampling technique. Once a sample is complete, the device1200can instruct the technician to close the collector1202and remove it from the device1200. It may also instruct the technician as to what to do with the used collector. The sample is now complete. The device can instruct the technicians to take another sample within the area, move to a new area, etc. Reading System Some embodiments of the innovation may include a system that samples and cultures potentially harmful microbes within a health care environment, and identifies and categorizes pathogens. This uses a method that automates certain culturing operations and methods, as described above, and manages others to create a complete solution for the detection and classification of harmful pathogens. Bacteria, spores, etc. that are collected during the sampling process are microscopic. In order to facilitate visual recognition, they are allowed to grow into a colony. This is accomplished by placing the sample into a growth medium such as agar or nutrient broth, then incubating at an elevated temperature to promote growth. In general, visible growth occurs within six hours, although it can take up to 48 hours to positively identify a microorganism and its strain. The particular growth media will be selected based on the types of pathogens of interest, e.g. MRSA,C. diff, acinetobacter, etc. In some embodiments, more than one growth medium may be used, and the sample tested for multiple pathogens. An imaging camera can be used to monitor and survey sample growth over time. Images of the samples may be captured and stored over time. This camera may be visible-light, infrared or a combination. The type of camera used will depend on the specific pathogens of interest and at what wavelength of light they are most easily visible. An objective lens may be used to focus the image of the growing culture. This may be a stationary fixed-focus lens, or may comprise an adjustable focus. If an adjustable focus lens is included, it can be used to measure the height of growth of the colony (by focusing top and bottom of the colony and measuring distance) if this information is deemed useful in identifying a pathogen. Illumination of the sample may also be selective. For example, if a particular pathogen reflects one wavelength of light better than another, a light source that produces that wavelength may be used. The preferable light source is one or an array of LEDs, since they are available to produce a variety of colors. An array may be used to produce a multiple of specific wavelengths that can be used singularly or in combination to facilitate the visualization of multiple pathogens. The system includes a computerized device, such as a computer system having a controller such as a memory and a processor, to identify potentially harmful pathogens. As microbe colonies grow, they develop with recognizable patterns. These patterns can be used to identify the microbes. The computer system contains a database comprising images of all microbes of interest. This database can be modified as new species of microbes emerge. The computerized device is configured to compare the image captured by the camera to images in the database and determines matches. The camera and computer are configured to automatically perform the same function that a morphologist performs when manually testing samples. The current innovation has the advantage of automation, infrared imaging, adaptive lighting and a nearly infinite library of pathogens and other organisms. The library may contain images of pathogens at varying stages of their growth to aid in early identification. The library may also contain non-pathogenic microbe images that may be used to eliminate samples that are not of interest. The computerized device is configured to compare the visible image to the database and looks for matching patterns. In samples with active microorganisms, growth should start to be visible within approximately six hours. If after six hours there is no growth, then there are no microorganisms within the sample. The computerized device can then stop the comparison and save the results as a no growth culture. This is done on an ongoing basis until the pattern is developed enough to make a positive or negative identification. Once a microbe has been identified, the results are reported. The computerized device is also configured to measure the size of the colony. The size may be measured as square area or cubic volume and mass may be calculated from the volume. In this manner, the system has the ability to determine both the type and colony size of the pathogen. Once the microbes that have been identified are analyzed and classified by the computerized device, the results can be reported as: No growth: if no growth is seen within the prescribed time, no microbes are present. Growth not of interest: microbial growth is present, but the microbes are not harmful. Harmful pathogen: microbes are present, and are deemed to be harmful pathogens. Results uncertain: growth is present, but a positive identification could not be made. The control system18is configured to learn as test results are obtained in order to accelerate the identification process. Images are obtained throughout the growth process, and the system can look for similarities in growth patterns. Early tests may take 24 to 48 hours to return a positive identification. However, growth of a particular microbe may follow a unique pattern that allows the system to recognize it prior to it being developed enough for a visual recognition. Primary observations may be made by the system such as color, shape, size, growth rate, luminescence, etc., as well as more subtle observations such as rate of change of the primary observations. The ability to recognize a particular pattern of growth prior to the development of an identifiable growth will allow identification to be made earlier in the growth process. This automated system will have the ability to recognize multiple patterns during the growth process, allowing identification of multiple microbes in a sample. FIG.18shows a schematic representation of the components within a reading system1800. The reading system1800includes a camera1801, such as the imaging camera described above. This may be a visible light or infrared camera1801, or a combination camera. While a single camera1801is illustrated, the reading system1800can include multiple cameras. These may be fixed or variable focus, depending on the detail of readings desired. The reading system1800can include a lighting device1802configured to project single or multiple light frequencies, and may one, two or an array of lights. A holding device1803holds collectors containing samples to be determined. In some embodiments, the holder device1803holds multiple collectors, for example, in a carousel device. If a carousel device is used, the reading system1800can include a turntable1804. The reading system1800also includes a computerized device (not shown) having a controller such as a processor and a memory or other suitable control device. The controller is configured to operate the cameras and lights, as well as the turntable and any other devices that are part of the reader, contains software that compares and determines pathogen content, and communicates with the pathogen display system's control system. It also has access to the pathogen database. The reading system1800may have a stand-alone control system, or may share part or all of its functions with the pathogen display system's control system. FIG.19shows an example of the carousel device1901. A collector1902is disposed within the carousel device1901. The carousel device1901shown has space for 8 samples. A carousel device1901may have more or less spaces as determined by design intent. A reading system1800may be able to accept multiple carousels and include an indexing means. Alternatively, the reader system1800may use mechanisms other than a carousel device1901to hold one or multiple collectors. In use, the reading system1800is configured to move a selected collector1902into position to be viewed by the camera1801. The reading system1800can read the identifier on the collector1902, which will correlate it to the sample location and time. This minimizes or eliminates the possibility of intermixing samples and producing incorrect results. Since each collector's results take several hours, the reader can cycle each collector into view in an intermittent fashion. As each sample reaches the point at which a determination is made, the result is logged and may be displayed. In some embodiments, the reader includes a mechanism that removes a collector that has been completed and replaces it with another untested one. Certification The systems, methods and apparatus described herein may be used a means to certify a pathogen auditing program. This certification may be considered on four levels. The flowchart2000inFIG.20illustrates these certification levels. Level 1 certifies the technician. This assures that the collection techniques used by all technicians are correct and consistent. This begins with a vetting process for each technician to confirm that they have the necessary skills and abilities to understand and carry out successful collections. The specific skills required will be determined with practice of the art. All technicians will undergo intensive initial training, as well as ongoing training, to certify them in the proper use of devices, testing methods and protocols, as well as ethical and performance standards. Level 2 certifies the collection of samples. This certification level assures that samples are taken in the specified locations, at the specified times, using the correct methods and techniques. This begins with technicians that are certified at Level 1. The system presents a set of collection instructions to the technicians who are proficient at collection techniques, protocols, etc. These collection locations and methods have been determined by the system to be the most likely to find pathogen contamination. The proprietary collector adds another layer of assurance to the certification. The collector recognizes the technician and monitors their movements, sampling location and sampling technique. If samples are not collected as expected by the system, it can instantly instruct the technician with corrections. This aids in removing human error from the system. Level 3 certifies the audit results. This begins with the Level 2 certified collections. An independent laboratory review adds another layer of certainty to the results, as does the control sample as described above. Comparing results between technicians adds one more layer of control. Technicians whose results vary from the norm can be reviewed to understand the differences and actions may be taken to bring them into compliance. As an adaptive system, sampling instructions are constantly being reviewed and revised based on historical results in an effort to create a constantly improving result. Embodiments that utilize the proprietary reader add an additional level of confidence. As with the collector, this device aids in removing human error as a factor in determining pathogen content. Level 4 certifies the facility. At this level, entire facilities, or select units within a facility, enroll in a continuous auditing program. The nature of pathogen spread and growth is unpredictable and changeable. It is important that Level 3 audits are conducted in an ongoing manner to truly understand the circumstance of pathogens within a facility. The data produced by these audits has a cumulative learning effect on the adaptive systematic audit protocols that are created by the system. This certification can be enhanced as multiple facilities join the system and share. While various embodiments of the innovation have been particularly shown and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the innovation as defined by the appended claims. | 95,281 |
11862330 | DETAILED DESCRIPTION FIG.1depicts an intelligent clearing house system10generally including RFID tagged items or items otherwise capable of wireless communication20, computer processing hardware and software30, and third party applications40. Arrows21C,22C,23C,41C,42C,43C, and44C depict communications to and from the computer processing hardware and software30. Tagged items20are shown inFIG.1as including Staff21, Patients22, and Equipment23, but virtually anything can be tagged or otherwise be capable of wireless communication. One could, for example, tag consumables, and especially expensive or controlled substances such as certain drugs and stents. One could also tag documentation such as patient records, computer programs, computer printouts, journals and other library materials and periodicals. High contact surfaces, such as elevator, door surfaces, lobby surfaces, break room surfaces, cafeteria surfaces, or restroom surfaces etc. can also be tagged or otherwise capable of wireless communication. In a real world implementation one would typically work backwards from a business problem being addressed. For example, if an enterprise is increasing capacity of an emergency room, it might be advisable to tag all the medical staff, the patients, and the medical equipment related to the ER. With staff one would typically include an RFID tag on the badges already used for identification, to access certain floors, or possibly on a radiation badge. One might also include a fingerprint or other biometric sensor. For patients it is most advantageous to tag the wrist or ankle bands, or enable the patients personal wireless device to communicate with the system, so that the tag or enabled device remains with the patient throughout the stay. Alternatively or additionally, an enterprise could use a tag carried by a staff member, other employee, visitor, or patient that is already included in his/her cell phone, pager, PDA or other device. One could put a patient tag on the patient's chart, but it is much better to put a patient tag on the patient and a document tag on the chart. Equipment is readily tagged directly on the unit, and in some cases the equipment might already by tagged or capable of wireless communication. It is contemplated that a single entity, whether staff, patient, equipment, or otherwise, could have any type of tag that is functional, and possibly multiple tags. The current preference appears to be for active tags, such as those available from Parco/Multispectral Solutions,™ Pango,™ Ekahau,™ Exavera,™ and Aeroscout™. Some active tags are disposable and some have replaceable batteries. Many modern active tags can operate on an ultra-wide band, and thereby have sufficiently low energy consumption to last four or more years on a single battery. Ultra-wide (UWB) frequency approved in June 2002 by the FCC for commercial use. UWB operates at a very high spectrum band (6.3 GHz) and therefore there are no interference and security issues. The nature of this frequency allows assets to be located within 1-foot granularity. The readers can see 600 feet and employ triangulation algorithms that eliminate the need to have readers in every room. These readers have low power needs and the batteries in the tags have a life of approximately 4 years. Currently preferred readers are those marketed by Parco and Multispectral.™ In general, the exact feature set of the tags is a matter of customer preference and need. Tags come in a variety of configurations, with the currently preferred tag being about 1 inch×1 inch (2.5 cm×2.5 cm) for equipment, a regular badge for staff, and a wristband for patients and visitors. Some installations prefer, or are already outfitted with, other types of tags such as passive, semi-passive, and/or semi-active tags. Some tags might deliver only identify information used for determining location, while other tags might provide other types of information such as physical parameters data (time, temperature, and moisture, etc) and operational data (e.g. on/off, status, etc). A major strategic advantage in systems and methods described herein is that they can be completely hardware agnostic to the underlying RFID system or wireless communication protocols that a particular prospective customer employs. Among other things this lowers the barrier to accepting the new service and facilitates choosing the best possible RFID hardware or software improvement of personal wireless devices (e.g., application) for a particular situation. As illustrated below, further benefits derive from employing a “command-center” approach that interfaces with different RF systems, and can become the central information processing unit of “who, what, where, and when” of medical equipment, staff, visitors, items, locations, and patients. Any suitable type of tag or other wireless communication device, or combinations of different types of tags or devices, can be utilized, provided appropriate readers are installed, or appropriate software used to augment devices or readers to enable location and relative proximity location between devices, and provided sufficient readers are placed around the enterprise. For example, if an enterprise uses ultra-wide band tags, then it needs to utilize at least some ultra-wide band readers. Contemplated systems can have anywhere from a single tag to 5,000 or even more tags in a large enterprise. The readers can advantageously be positioned such that at least 80% of the RFID information is refreshed at least every 10 minutes, and but more preferably the system would be implemented such that at least 80% of the RFID information is refreshed at least every minute, more preferably 100% every 10 seconds. Typically one would place readers at doors to detect passive tags, and active tag readers on ceilings and hallways. Current active tag readers can often triangulate locations of tags from up to 200 meters away, through walls and other structures, with a resolution of only a meter or less, preferably a foot or less. Arrows21C,22C, and23C represent potentially two-way communication between the devices, tags, or tagged items on the one hand, and the computer processing hardware and software30on the other hand. At the very least the tags or other devices need to wirelessly communicate with the tag readers (upward arrows) or other network, with the readers then typically communicating with the computer processing hardware and software30using cable or another wireless communication. The downward arrows typically depict communications to the tagged items rather than to the tag itself. For example, the computer processing hardware and software30might send an email, voice mail, or page to an appropriate device carried by a staff member or even a patient. It is contemplated that future tags will have displays associated with them, so that a lost patient, for example, could be located and directed back to his/her room. Computer processing hardware and software30preferably contains at least the three layers shown. The lowest layer on the diagram is middleware32, which receives tag data, such as location, duration, temperature, or moisture or other environmental parameters from the readers. Ideally, middleware32can be implemented in a generalized fashion to accommodate any needed inputs, thereby preventing the system from being tied to any particular manufacturer or model of tags or tag readers, or any particular telephone or other communications system. Having received the data, middleware32then preferably passes the data into the core engine, described here as an Intelligent Associations And Analytics Engine34, which preferably has a hot cache or other memory structure34A,34B, and34C and is preferably structured/operated under Java. The core engine34applies a set of rules to the RFID information to determine events, and applies correlations to the events to determine steps, and then executes or initiates execution of the steps. Some of those steps provide passing information along to the third party applications40via additional middleware36, described here as the Uniform Enterprise Visibility Applications and Semantic Data. In real-world embodiments, middleware36is likely to be implemented as separate processors, such as the blades in a blade server, to handle communications with the various proprietary interfaces of the third party applications40. Arrows41C,42C,43C and44C represent communication between middle layer36and the third party applications40. That communication will mostly involve one-way communication, with the middleware36supplying information to the third party applications40(upward arrows). But it is contemplated that one or more of the third party applications40could send inquiries or other data to the middleware36(downward arrows). Communication characterized by arrows41C,42C,43C and44D will likely, but not necessarily, be formatted according to a standard messaging protocol, such as Health Level 7 (see www.hl7.org). Hospitals can easily have dozens of third party applications, handling many different types of information. Among the contemplated third party applications are an asset management application41, a staff timekeeping application42, a hospital information application (HIS)43, and an electronic medical records application44, and optionally a contact tracing application. Another of the contemplated applications40is a web portal where hospital administrators can pull-up operational reports of not only their hospitals but, when appropriate, see similar reports on medical assets being used at other hospitals for the purpose of comparing notes and sharing and learning best practices. Currently this kind of information can only be obtained by one-to-one (versus many-to-many) conversations; poring through a vast array of industry publications; or by attending expensive, often distant, educational meetings. The web portal application highlights the healthcare IT industry's migration from providing pure information technology to providing information itself. Transcending conventional incremental benefits associated with the IT business, the addition of a rich and varied database of the latest information on products, services and methods employed by hospitals, is expected to empower hospital or other healthcare enterprise managers to perceive and react rapidly and in a manner adding significant value and cost savings to their organization. In essence, they will have this knowledge database to help them be proactive and either preclude or quickly “put out operational fires.” In yet another contemplated aspect, the “Intelligent Clearing House software” can have a mapper-software that integrates processed intelligent data to support Information Technology systems such as IDX, Cerner etc. inside the hospital through GUI screens and “point-and-click” software. Still further, an “Intelligent Clearing House software” engine can move beyond automatic detection of events to automated prediction of events. The predicted events could well comprise HL7 standard events, including for example patient admission, patient discharge, and so forth. Exemplary events include the following:1) “Patient X-ray procedure complete”: The system can detect that an X-ray procedure was completed, or that a surgical procedure is about to start, by determining that the patient was transported out of the X-ray room, waited in the radiology hallway for a bit, re-entered the X-ray room, and is just coming back to the surgical unit.2) “Patient Transfer Complete”: By detecting that a patient is transported from OR (after being in OR for 2 hours), and is the entering surgical unit, the system can determine that the patient left one unit of the hospital and is about to enter other.3) “Equipment Sterilization Complete”: By detecting that a equipment was moved to a sterilization unit, was in the sterilization room for a required number of minutes, the system can determine that the equipment is done with sterilization and is being moved back to a patient's room. The Intelligent Clearing House software can further be used to monitor and record contact tracing events in a hospital, an enterprise, or a public space. Distance between RFID tags or wireless devices are monitored to determine whether a person came in contact or close proximity (e.g., one, two, three feet, etc.) with equipment, supplies, items, or other high contact surfaces in an enterprise or public space, as well as to identify high contact surfaces, or whether a person came within a defined proximity of another person, for example 15 feet, 10 feet, or 6 feet, in order to monitor social distancing and provide contact tracing, for example of the spread of Covid-19 or other highly infectious or transmittable health phenomena. A log can be compiled based on such monitoring, providing compliance grades and identifying personnel in violation of social distancing or items in need of frequent sanitizing. FIG.2shows how implementations described herein can coordinate numerous aspects of information flow within a hospital or other health care enterprise, even though the subject matter is not directed to providing a completely unified system. In this instance there are icons for Physician (part of Staff21), Patient22, and Equipment23, all in accordance withFIG.1, and also additional icons for another type of tagged item (Surgery24), and additional types of third party applications (Enterprise (HIS)43, Lab45, Pharmacy46, and Suppliers47). The central circle labeled “RFID System” corresponds to the computer processing hardware and software30. Arrows21C,22C,23C, and43C correspond to the same numbered arrows inFIG.1, while arrows24C represent communication between tagged items in the operating room24(patient, staffs, or equipment) and middleware32. Similarly, arrows45C,46C, and47C represent communication between the third party applications in the lab45, in pharmacy46, and suppliers47, respectively, and middleware36. InFIG.3, the core engine100(34ofFIG.1) applies a set of rules112to the RFID information110to determine events120, applies correlations122to the events120to determine steps130, and then executes132the steps130. As described above, some of those steps132provide passing information along to the third party applications40via additional middleware36.FIG.4depicts an exemplary portion of an RFID tag table, showing field designators (Tag ID, Tag Type, Tag Name, Coordinates, and Time Stamp) in the first column and four sample records in columns 2-5. The reader will note thatFIGS.4-6are each oriented sideways to the normal viewing perspective; such that the columns represent individual records and the rows represent fields.FIG.5depicts an exemplary portion of an Event Rule table, showing field designators in the first column and four sample records in columns 2-5. Of course, it should be noted that the data can be generalized. Thus, the “who” field (row4) could reference a type of asset and not necessarily an instance of the type. For example, the corresponding cell of record1might use the designation “Doctor” instead of including the literal “Dr. Jones”, the corresponding cell. Similarly, the “where” could be “examining room” as opposed to a particular zone. The data can also be used to interact with third party systems40. For example, the message field (row16) could be an HL7 communication to a third party application such as a bed management system, rather than a text message to the corresponding “who” field. Still further, the message could be a keystroke recording or other logon script, that accesses context relevant information (from one or more of the third party systems) with respect to the “who” or other information in record1.FIG.6depicts a portion of a Correlation Engine table, showing field designators in the first column and four sample records in columns 2-5. In terms of interfaces, several highly advantageous software functionalities are contemplated, including: (a) reporting the location of the responder as being within one of a plurality of business locations; (b) using scalar vector graphics to display the locations with varying degrees of detail (seeFIGS.7A and7B); (c) displaying replay of movements of the assets; (d) displaying utilization profiles of the assets; and (e) coordinating the locations of the at least some of the assets data from a global satellite positioning system (GPS). Such location, relative proximity, and record keeping enables highly sensitive contact tracing in a healthcare facility, enterprise, or public space. It is still further contemplated that different ones of the readers (referenced earlier as responders) can operate with first and second different middleware, different frequencies, different types of interrogators, etc, and that the system according to the inventive subject matter can nevertheless consolidate output from the different types of equipment. This could be viewed as an “air-traffic controller” type of system, in that it can operate with and coordinate with a large number of different systems, some of which may be incompatible with each other.FIG.8is a use case showing how patient care could be improved using a preferred embodiment, andFIG.9is a use case showing how operational efficiency could be improved using a preferred embodiment. In yet another preferred aspect of the inventive subject matter as exemplarily depicted inFIG.10, a person200is wearing a vital signs monitor device210tagged with a first Radio Frequency Identification (RFID) tag212, and a patient identification wrist band220tagged with a second RFID tag222. Of course, the person210shown is emblematic of all possible persons, regardless of gender, race, age, ambulatory status, and so forth. The specific vital signs monitor device210shown here is a Micropag™ device available from Welch Allyn™, for which additional information can be found on the Internet at http://www.monitoring.welchallyn.com/products/wireless/micropaq.asp. Device210, however, should be viewed as emblematic of all possible devices, including for example patient telemetry devices that might be larger or smaller, of different configurations, and regardless of how they are worn about the body. Descriptions of several of the myriad other devices represented by device210can be found by following links at another Welch Allyn website, http://www.monitoring.welchallyn.com/products/wireless/resourcelib.asp. Thus,FIG.10should be interpreted broadly to include teachings and suggestions that the same, or an alternative, device could be worn about the chest, leg, coupled to a gurney carrying the person as a patient, and so forth. The critical limitations are that the device210can be carried on the person, has a portable power supply, has wireless communication capability, and monitors and provides data for at least one vital sign. Similarly, the various tags212,222should also be viewed from the broadest possible perspective, and are emblematic of all sizes and shapes of RFID tags, and all types of such tags including, for example, active or passive tags, standard or Ultra-Wide Band (UWB) frequency tags, and so on. There is, however, a definite preference for tags that can provide two dimensional spatial resolution in at least some portions of a typical hospital setting down to at least about 10 feet (3 meters), more preferably to at least two feet, and most preferably down to at least one foot resolution. Adding a high-resolution RFID tag of whatever type to ISM and WMTS Wireless Telemetry band equipment is contemplated to be valuable in that it enables locating patients, employees, visitors, equipment, or items in substantially real-time with high resolution. This can be extremely useful, for example, in locating a patient when there is a “code-blue” situation, and also in locating nearby personnel and equipment when such tags are there as well. It is still further contemplated that use of high resolution RFID tags on patients (and/or on or in telemetry devices), in conjunction with appropriate software, can even identify when a patient falls to the floor, or for some other reason stops moving. In such case, an intelligent software system can dispatch nearest staff member. Such systems and methods are further critical for high resolution contact tracing, for example in monitoring or mitigating the spread of highly infectious of transmittable health phenomena such as Covid-19. Yet another aspect of using UWB or other RFID tags on telemetry devices is that such use can facilitate efficient and accurate capture of billing information. Among other things the use of the device can be detected and charged on a per-day or other time basis. In a still further aspect of contemplated systems and methods, inappropriate use of tagged patients can be reduced or at least documented. For example, nurses are expected to read a bar-code by scanning a patient wristband, and then to scan the bar-code on drug or medical supply being administered. Unfortunately, for convenience or other reasons, the patient wristband can be easily duplicated and scanned together with the drug or medical at the nurse's station, thus defeating an otherwise helpful safety system. In contrast, contemplated systems using RFID technology are expected to improve patient identification accuracy. Active tags are being adopted to track patients, medical staff, and medical equipment. But due to economical reasons, the drugs, medical supplies and lab specimens will continue to have bar-coding or passive tags which will need some type of handheld reader and manual intervention to read. Consequently, it is contemplated that the handheld reader to read bar-code or passive tag on drug, medical supply or lab specimen also includes an active tag embedded or slapped-on, which will help to close the loop on complete matching of “five rights” before the patient is delivered some type of clinical service (The physical location of this hand-held reader that is scanning the drug, medical supply, lab specimen will ensure physical proximity check to the patient automatically). In such case, when the clinician comes closer to the patient, and both are wearing active tags, the identification of the patient is automatically done through proximity. The next step is for the clinician to actually administer a drug, use some medical supply, verify a specimen or perform some procedure. It should be appreciated that RFID tags cannot be easily duplicated or printed like barcodes. There is also no ability to verify where the patient bar-code wristband is being read. In the above method, the physical location of the patient is known as well as the location of medical staff and the hand-held reader that is reading the drug, medical supply or lab specimen, which helps enforcing the “five rights” check with automation using new type hand-held reader and a new method. Such applications a likewise useful for contact tracing, as proximity between one or more devices or readers is critical to monitoring social distancing and identifying potential risky contact. Consequently, it is particularly contemplated that conventional handheld readers are used to scan a barcode or passive tag (e.g., on a drug, medical supply, lab specimen etc.) and that such devices are coupled to an active, semi-active or even passive RFID tag with any radio frequency (HF, UHF, 2.4 GHz, 6.3 GHz and so on) or any wireless standard (Wi-fi, Zigbee, UWB and so on). Most preferably, such tagged readers are then used in the context ofFIGS.1and/or2. It should be noted that implementations according to the inventive subject matter presented herein offer many benefits. Among other advantages, intelligent RFID technology provides healthcare providers a dynamic and visual model on patient flow at the facility, giving insight on efficiency and quantity of asset usage. Users can instantly locate assets like medical staff, medical equipment, medical supplies, and patients, offering total asset visibility to the healthcare organization. The Return-on-Investment (ROI) is supported by more accurate patient billing, better asset utilization, and better asset preventive maintenance, reduced asset shrinkage, better security, increased productivity, reduced medical errors, thus reducing costs and increasing quality of care and safety. Intelligent asset utilization increases tend to reduce asset purchases and rental bills, an increase in equipment billing accuracies (and in future versions even tagged drugs and medical supplies), cuts asset shrinkage, and potentially increased facility throughput due to increased productivity. Currently, hospitals are focusing their RFID adoption activities on medical equipment tagging for the purpose of gaining operational insights about equipment utilization, maintenance and billing. But the benefits become even greater as RFID tags become more intelligent and go beyond simple locating functions, e.g., to sense temperature, moisture etc. Among other things the systems and methods described herein provide powerful processing software to harvest all of a client's incremental data as it flows in and through the organization, leading to improved staff productivity (e.g., by finding equipment, staff, and patients easily), which results in reductions in wasted manpower time and effort. Systems and methods according to the inventive subject matter will also reduce patient stays inside hospitals while increasing quality-of-care (e.g., by being able to track and treat patients and monitor their care and medications more efficiently). Viewed from a difference perspective, contemplated systems and methods may be viewed as adding a horizontal “layer” that cuts across multiple (often disparate) IT systems; each handling a specific vertical operation like asset management, staff time keeping, EMR (Electronic Medical Record), HIS (Hospital Information System), and PhIS (Pharmacy Information System). In effect, these systems and methods permit creation of an “Intranet” connecting medical staff, patients and equipment into an automated and coherent universal communication and real-time operational analysis platform. Thus, specific embodiments and applications of systems and methods for tag based knowledge systems for healthcare enterprises have been disclosed. It should be apparent, however, to those skilled in the art that many more modifications besides those already described are possible without departing from the inventive concepts herein. The inventive subject matter, therefore, is not to be restricted except in the spirit of the appended claims. Moreover, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms “comprises” and “comprising” should be interpreted as referring to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps may be present, or utilized, or combined with other elements, components, or steps that are not expressly referenced. | 27,183 |
11862331 | DETAILED DESCRIPTION Embodiments of the present invention inter alia address the need for enhancement of purely mechanical one-way or multi-way/re-usable injection/infusion products, such as insulin injection pens), which do not provide a power supply, with additional functions, such as for instance a usability indication, an alarm function or patient-specific therapy functions. Since native integration of such additional functions into injection/infusion products increases their costs, it is generally desirable to provide such functions based on an additional add-on module. Due to the complexity and criticality of infusion/injection devices, it is advantageous that such an add-on module is provided without requiring constructional changes of the infusion/injection devices to which it shall be added. Furthermore, it is advantageous (e.g. cost-efficient) that the add-on module can be easily and quickly attached to the infusion/injection devices with only minor change of production lines for the infusion/injection devices (in case that the add-on module is attached to the infusion/injection devices as the last or one of the last production steps) or by hand assembly (for instance by a user of the infusion/injection device itself), even in case of low quantities. Embodiments of the present invention allow for easy and cost-efficient addition of functions (for instance supported by a power source such as for instance a battery) to medical devices. These functions may for instance comprise one or more of:indicating the time since the last application or until the next application (for instance optically or acoustically),reminding of a time (for instance optically, acoustically or by means of vibration),indicating usability (for instance optically, acoustically or by means of vibration), and/orallowing identification (for instance via Radio Frequency Identification, RFID). Modules/apparatuses according to embodiments of the present invention may for instance be attached to the medical devices in one or more of the following forms:The attachment may be persistent (fixedly, i.e. non-releasably), for instance as an additional production step during manufacturing of the medical device and/or the module. For instance, the module may be clicked on a dosage knob or actuation button of a medical device, or may be attached to the medical device via a snap/latch mechanism, allowing for cost-efficient automatic assembly or assembly by hand.The attachment may be persistent (fixedly) for each medical device, but may be accomplished by the user of the medical device.The attachment is releasably (e.g. only temporary). The module may then for instance be transferrable from medical device to medical device and thus be reusable, yielding cost savings for the user. Modules/apparatuses according to embodiments of the present invention may for instance comprise one or more of the following components:a power unit,a housing with a (standardized) attachment unit for attachment to a medical device,a functional unit, optionally with an integrated switch or sensor,optionally an indicator/actuator/signal generator,optionally a transmitter,optionally a receiver. The functional unit may be flexible in its functionality and may for instance comprise one or more of the following:a timer, optionally with a programming interface,an indicator function for allowing the medical device to be found/located (for instance like a key finder), optionally in combination with an external transmitter or an external activationan RFID unit and/or a storage medium. Examples of the indicator/actuator/signal generator may for instance function in one or more of the following ways:optically, for instance via an LED,acoustically (for instance speech generation or sound signal),by means of oscillation, for instance by vibration,via a data set, for instance comprising one or more of an expiration date, a production date, an indication of the type of medicament, an active ingredient of the medicament, a serial number. In the following, an embodiment of the present invention will be described with reference to an insulin injection device, to which a module (as an embodiment of an apparatus according to the present invention) is attachable or attached. The present invention is however not limited to such application and may equally well be deployed with injection/infusion devices that eject other medicaments, or with other types of medical devices. FIG.1is an exploded view of an injection device1and a module2. Injection pen1may for instance represent Applicant's ClikSTAR® insulin injection pen. Injection device1ofFIG.1is a reusable injection pen that comprises a housing10and contains an insulin container14, to which a needle15can be affixed. Insulin container14contains a cartridge (not detailed inFIG.1) that actually contains the insulin and can be replaced with a new cartridge when empty, making injection device1reusable. The needle15is protected by an inner needle cap16and an outer needle cap17, which in turn can be covered by a cap18. An insulin dose to be ejected from injection device1can be selected by turning the dosage knob (dosage selector)12, and the selected dose is then displayed via dosage window13, for instance in multiples of so-called International Units (IU), wherein one IU is the biological equivalent of about 45.5 μg pure crystalline insulin ( 1/22 mg). An example of a selected dose displayed in dosage window13may for instance be 30 IUs, as shown inFIG.1. Turning the dosage knob12may cause a mechanical click sound to provide acoustical feedback to a user. The numbers displayed in dosage window13are printed on a sleeve that is contained in housing10and mechanically interacts with a piston in insulin container14(and the cartridge contained therein). When needle15is stuck into a skin portion of a patient, and then actuation button (injection button)11is pushed inwards, for instance by a thumb of the user of injection device, the insulin dose displayed in display window13will be ejected from injection device1. When the needle15of injection device1remains for a certain time in the skin portion after the injection button11is pushed, a high percentage (or even all) of the dose is actually injected into the patient's body. Injection device1may be used for several injection processes. As stated above, an empty insulin cartridge (positioned in insulin container14) can be replaced by a new one. Before using injection device1for the first time (or after a change of the cartridge), it may be necessary to perform a so-called “prime shot” to remove air from the cartridge in insulin container14and needle15, for instance by selecting two units of insulin and pressing actuation button11while holding injection device1with the needle15upwards. InFIG.1, further a module2is shown, which is attachable to actuation button11of injection device1, for instance by clicking or pressing it onto actuation button11, for instance to achieve a form closure or fit closure. Equally well, module2may be screwed on actuation button11, or may be glued thereon. This may for instance be performed by a user of injection device1, and may lead to either a fixed or releasable connection between module2and injection device1. As already described above, module2may equally well be attached (either fixedly or releasably) to injection device1during production of injection device1. Module2comprises a detector unit with a detector that detects an actuation action performed to actuation button11, and an electric unit for storing or providing information related to this detected actuation action. Mounting module2on actuation button11has the advantage that module2can be affixed without requiring modification of the injection device1, and that a robust detection of actuation actions can be achieved, since actuation actions can only be applied to actuation button11via module2. FIG.2is a cross-sectional view through the centre of an embodiment of the module2ofFIG.1when it is attached to actuation button11of injection device1. Module2comprises a housing20, which is of cylindrical shape with a circular inner protrusion200. Housing20may for instance be made of aluminium. Above the circular protrusion200of housing20, an electric circuit22is positioned. Electric circuit22may be attached to housing20, for instance by gluing, but equally well, no specific attachment may be performed, for instance to allow electric circuit22to be removed from module2, for instance to change electric circuit22. Electric circuit22is for instance formed on a printed circuit board, which may have one or more layers of wiring. On top of electric circuit22, a light emitting diode (LED)220is positioned, which is under control of the electric circuit22. Electric circuit22is connected to the poles of a battery23(e.g. a coin cell), which is positioned below electric circuit22and at least partially within circular protrusion200, via contacts (for instance one or more contacts that contact battery23laterally (first pole) and one or more contacts that contact battery23at its top (second pole)) not shown inFIG.2. Electric circuit22is thus powered by battery23. Battery23may for instance be held in circular protrusion200(for instance a battery holder with included contacts, which may for instance be attached to or formed on the bottom of electric circuit22) and may be removed, for instance for replacement, by pulling it downwards out of circular protrusion200. On top of electric circuit22, contact areas211are formed, which are connected to electric circuit22as will be discussed with reference toFIG.3below. Module2further comprises a snap disk210, which has an electrically conductive portion2100on its lower side and is arranged with respect to contact areas211in way that if a downward force is applied to snap disk210, snap disk210deforms and electrically conductive portion2100of snap disk210comes into contact with contact areas211, so that these contact areas211are electrically connected. Snap disk210and contact areas211thus form an electric switch21, which functions as a detector for a force applied to snap disk210. A reset force for this electric switch21is provided by snap disk210in a way that, if the downward force is no longer applied to snap disk210, snap disk210returns into its previous position. Snap disk210is designed to be at least partially transparent, so that light emitted by LED220can be perceived through snap disk210. To this end, snap disk210may for instance have circular or ring-shaped transparent areas. InFIG.2, such a circular transparent area2101is indicated in snap disk210. Below the circular protrusion200of housing20, module2forms a circular space for absorption of at least a part of actuation button11of injection device1. This space may at least partially also be used by a lower portion of battery23. The radius of this circular space is adapted to the outer radius of actuation button11in a way that module2can be attached to actuation button11and firmly rests on actuation button11, while still being releasable from actuation button11without destroying module2and actuation button11, for instance if injection device1is replaced by another injection device, but module2shall be reused. Example measures for the module2ofFIG.2are a total height of 10.67 mm, with the height of the housing above the circular protrusion being 3 mm, and the height of the housing below the circular protrusion being 5.4 mm. The total diameter of module2may for instance be 17 mm, and the inner diameter of circular protrusion200may for instance be 11 mm. Functionally, electric switch21, electric circuit22, battery23and the upper part of the housing20with circular protrusion200form a detector unit. An actuation action (which in the present embodiment corresponds to an actuation force) can be exerted to actuation button11of injection device1only via this detector unit and is detected by switch21that functions as a detector. In case that battery23is not in contact with actuation button11(unlike the example shown inFIG.2), the detector unit may be considered to only comprise electric switch21, electric circuit22and the upper part of housing20with circular protrusion200, since these components relay the actuation force to actuation button11. Switch21is configured to detect the actuation action based on a detection of a force applied to the detector unit as part of the actuation action. In particular, when desiring to cause ejection of a selected dose of the medicament contained in injection device1, the actuation force is initially applied to snap disk210, which is then pushed downward to come into contact with contact areas211. The actuation force is then relayed to circular protrusion200via the electric circuit22and battery23, and then relayed to its actual destination, the actuation button11, via the circular protrusion200. It is readily clear for a person skilled in the art that a plurality of alternatives exists for the arrangement of components shown inFIG.2. For instance, to avoid that the actuation force has to be applied to actuation button11inter alia via the electric circuit22(and, as shown inFIG.2, battery23), which may cause damages to these components, contact areas211may for instance not be formed on top of electric circuit22, but on a separate carrier plate, to which also the snap disk210is connected. This carrier plate may then for instance only be in contact with the electric circuit22at an outer region thereof (i.e. near housing20), so that an actuation force applied to this carrier plate may then be relayed only to the outer region of electric circuit22and thus may avoid damage of components in the inner region of electric circuit22. Equally well, of course other types of electric switches may be used. For instance, instead of snap disk210, a rigid plate or cap (e.g. convex or concave) may be used attached on top of housing20and with a central opening through which an actuator of an electric switch (e.g. a key switch) protrudes, wherein the length of the way the actuator has to be moved down to close the electric switch is chosen so that the switch is closed when the top of the actuator and the top surface of the plate are aligned, and that in this position and also when applying further force on the plate, only the reset force of the switch (for instance cause by a reset spring) acts on components to which the switch is mounted. When applying an actuation force via this plate, then the actuator of the electric switch is pressed inwards and the electric switch is closed. Further applying the actuation force then leads to the actuation force being relayed to the actuation button11via the housing20and its protrusion200, and not via the electric circuit22and the battery23. Equally well, of course other types of detectors may be deployed, such as for instance a touch sensor arranged on, in or below a plate (or cap) placed on top of housing20, or a pressure sensor that is arranged within housing20and is responsive to changes in pressure caused with an upper part of housing20when a force is applied to a flexible membrane or other moving member attached to the top of housing20(assuming that housing20is otherwise tight, which may for instance be achieved by replacing protrusion200by a solid plate). In the module2ofFIG.2, the electric circuit22is connected to switch21, in particular to its contact areas211, and provides information related to the actuation action detected when switch21is closed. In the embodiment ofFIG.2, electric circuit22implements a timer that is activated when switch21is closed and turns on LED220for a pre-defined time. Lighting of the LED220thus indicates to a user of injection device1that a pre-defined time period since a last actuation action has not yet passed, and thus may for instance prevent too early reuse of the injection device1, for instance in case that the user forgot that he already used the injection device1shortly before. FIG.3shows an example of a circuit diagram300for the electric circuit22of module2ofFIG.2. The electric circuit implements a monostable multivibrator with a timer element U1 (such as for instance Texas Instruments' TLC555, which is a low-power variant of an NE555 timer) at its core. X1and X2denote battery contacts connected to one pole of battery23(supply voltage potential Vcc). These two contacts may for instance contact battery23laterally. X3is a battery contact connected to the other pole of battery23(ground potential GND), which may for instance be arranged at the top of battery23. Battery23may for instance be a coin cell battery, such as for instance of type CR1025. In circuit diagram300, S1represents electric switch21ofFIG.2, and V1denotes LED220ofFIG.2. Furthermore, R1, R2, R3and R4are resistors, and C1, C2and C3are capacitors. The electric circuit ofFIG.3functions as follows: If switch S1is closed, LED V1is turned on and emits light. After a pre-defined time, which is governed by the values of R3and C3(T=R*C), LED V1is turned off again. For instance, the pre-defined time may be set to 15 minutes. LED V1then is active for 15 minutes after the last use of the injection device1and in this way reminds a user that injection device1has already been used. As already stated above, indication that a pre-defined time duration since the last actuation action has not yet passed is only one example of additional functionality that can be added to an injection device according to embodiments of the present invention. Equally well, module2may be modified to convey other information. For instance, the time instant of the last detected actuation action (or a history of the last detected actuation actions) may be indicated to a user, for instance optically (via a display integrated into module2) or acoustically (for instance via speech generation or via sounds). This indication may for instance be performed in response to a request of the user, which may for instance be made by the user by pressing a button. Equally well, information on detected actuation actions (e.g. the last detected actuation action, or a history of the last detected actuation actions) may be stored in a memory of module2, and/or may be provided to electronic devices via wired or wireless connections. The module2may also be equipped with a key finder functionality. Electric circuit23of module2may also comprise a processor (such as for instance a microprocessor) that controls functions of module2. This processor may for instance store and/or provide information related to an actuation action detected by a detector, such as for instance an electric switch (e.g. switch21) or any other type of detector. FIG.4is a flowchart400of an embodiment of a method according to the present invention. This method may for instance be at least partially controlled and/or performed by a processor of module2. A computer program with instructions operable to cause the processor to perform this may be stored on a computer-readable medium, which may for instance be a tangible storage medium. In a step401, an actuation action is detected, and in a step402, information related to the detected actuation action is stored and/or provided. Module2ofFIG.2may furthermore be equipped with a further component that is capable of measuring a dose that is dialed with dosage knob12(seeFIG.1). This component may for instance be formed on or attached to a lower portion of module2and may comprise a rotatable member that is attached to dosage knob12so that rotation thereof with respect to module2can be sensed. Information on this sensed rotation may then be transformed by the electric circuit22(or a processor of module2) into information on a selected dose and may be stored and/or provided like the information on a detected actuation action. Alternatively, an acoustic sensor may be used in module2to determine a selected dose based on click sounds produced by injection device1when a dose is dialed. The rotation may be measured relative to another part of the knob12or relative to a part of the injection device1, for example relative to the housing10, or relative to the dose dial sleeve that can be seen through the dosage window13. By measuring the relative movement, it can be distinguished whether the dialed dose is measured or whether the injected dose is measured. In an example embodiment, dosage knob12may be rotated during dose dialing relative to housing10, however it may not rotate relative to the housing10during dose injection. Thus, a dialed dose can be measured. In an example embodiment, dosage knob12may be rotated during dose dialing relative to housing10, but no rotational movement is made relative to the dose dial sleeve. During dose injection, the dose dial sleeve rotates. Thus, a relative rotational movement between the dose dial sleeve and the dosage knob may be detected during dose injection. As the module2is fixed to the dosage know12, it may detect the relative movement. The invention has been described above by means of embodiments, which shall be understood to be non-limiting examples only. In particular, it should be noted that there are alternative ways and variations which are obvious to a skilled person in the art and can be implemented without deviating from the scope and spirit of the appended claims. | 21,408 |
11862332 | DETAILED DESCRIPTION Various embodiments are described below with reference to the drawings in which like elements generally are referred to by like numerals. The relationship and functioning of the various elements of the embodiments may better be understood by reference to the following detailed description. However, embodiments are not limited to those illustrated in the drawings. It should be understood that the drawings are not necessarily to scale, and in certain instances details may have been omitted that are not necessary for an understanding of embodiments disclosed herein, such as—for example—conventional fabrication and assembly. However, drawings may be rendered to scale unless specifically disclaimed. The invention is defined by the claims, may be embodied in many different forms, and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey enabling disclosure to those skilled in the art. As used in this specification and the claims, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Reference herein to any industry standards (e.g., ASTM, ANSI, IEEE, or HIPAA standards) is defined as complying with the currently published standards as of the original filing date of this disclosure concerning the units, measurements, and testing criteria communicated by those standards unless expressly otherwise defined herein. The terms “proximal” and “distal” are used herein in the common usage sense where they refer respectively to a handle/doctor-end of a device or related object and a tool/patient-end of a device or related object. The terms “about,” “substantially,” “generally,” and other terms of degree, when used with reference to any volume, dimension, proportion, or other quantitative or qualitative value, are intended to communicate a definite and identifiable value within the standard parameters that would be understood by one of skill in the art (equivalent to a medical device engineer with experience in this field), and should be interpreted to include at least any legal equivalents, minor but functionally-insignificant variants, standard manufacturing tolerances, and including at least mathematically significant figures (although not required to be as broad as the largest range thereof). One embodiment of a system for monitoring and managing use of a catheter to drain fluid from a body is described with reference toFIG.2. System200includes patient devices201a-201n(where n may represent any number greater than one), server202, physician device203, and nurse device204. Patient devices201a-201nare generally configured to allow a user on the patient side of treatment (e.g. the patient or a caretaker of the patient) to input and receive information related to catheter-based fluid drainage. Physician device203is generally configured to allow a physician to input and receive information related to catheter-based fluid drainage. Nurse device204is generally configured to allow a nurse to input and receive information related to catheter-based fluid drainage. Server202is generally configured to receive information related to catheter-based fluid drainage from, and to transmit information to, patient devices201a-201n, physician device203, and nurse device204. In system200, patient devices201a-201n, physician device203, and nurse device204are each in operative communication with server202. The operative communication may be in the form of a network providing wired and/or wireless communication via recognized communication protocols, which allows patient devices201a-201n, physician device203, and nurse device204to transmit information to, and receive information from, server202. Additionally, the network may similarly allow server202to transmit information to, and receive information from, patient devices201a-201n, physician device203, and nurse device204. Although system200as shown inFIG.2depicts a single server202, a single physician device203, and a single nurse device204, other embodiments of a system for monitoring and managing the use of a catheter to drain fluid from a body may include more than one server202, more than one physician device203, and/or more than one nurse device204. Additionally, other embodiments may include a single patient device201a, and/or may omit the server202, the physician device203, and/or the nurse device204. One embodiment of a device to implement patient device201a, physician device203, or nurse device204is described with reference toFIG.3. Mobile device300is configured to generate and/or otherwise provide a user interface301. For example, mobile device300may be configured to render user interface301for output on an output device of mobile device300, based upon preexisting information and/or new information. For example, mobile device300may be configured to render user interface301for display on a display of mobile device300by using a preexisting user interface template, generating and using a new user interface, receiving and using a newly generated user interface, combining aspects of a preexisting user interface template with a newly received or generated user interface, or through combinations of such operations. User interface301is configured to provide an output interface302, by which mobile device300prompts a user to input catheter use information. Output interface302includes one or more perceptible output elements304configured to be output by mobile device300to request, remind, alert, inform, or otherwise prompt the user to input catheter use information into mobile device300. User interface301is further configured to provide an input interface303, through which the user is able to input catheter use information. Input interface303includes one or more interactive input elements305configured to be operated by the user to input catheter use information into mobile device300. Perceptible output element304may be embodied as an element of a graphical user interface displayable on display306, and may include a text field304aand/or an image field304bhaving content associated with a particular type of catheter use information. Perceptible output element304may be embodied as an audio output signal having content associated with a particular type of catheter use information. Perceptible output element304may be associated with interactive input elements305so as to prompt the user to input a particular type of catheter use information using a particular interactive input element305. Perceptible output element304may be located in, on, and/or adjacent to an associated interactive input element305. Interactive input element305may be embodied as an element of a graphical user interface displayable on display306, such as text entry field305a, selectable link305b, toggle switch305c, selectable box305d, and/or radio button305e. Interactive input element305may be embodied as an element configured to recognize an audio input indicative of catheter use information. User interface301is configured to translate interactions with one or more peripheral devices307into interactions with input interface303and interactive input element304. Peripheral device307may for example be embodied as one or more of a touch-screen307aand/or an audio sensor307b(e.g a microphone). Referring again toFIGS.2and3, an embodiment of patient device201amay be implemented using mobile device300. An embodiment of patient device201aimplemented using mobile device300is configured to prompt, using output interface302, a patient-side user to input catheter use information, and to allow the patient-side user to input catheter use information using input interface303. Catheter use information is information that is related to using the catheter to drain fluid from the patient. Exemplary catheter use information may include: information about the patient who will have, is having, or has had fluid drained using a catheter; information about the catheter or related components that will be, are being, or have been used to drain fluid from the patient; information about the manner in which the catheter will be, is being, or has been used to drain fluid from the patient; and/or information about results of using the catheter to drain fluid from the patient. Exemplary information about the patient may include information about the patient's name, gender, and/or age. Exemplary information about the catheter or related components may include information about a type of or patient requirements for a catheter (e.g. chest vs. abdomen), drainage kit, and/or clamp (e.g. a pinch clamp vs. a roller clamp). Exemplary information about requirements for a catheter or related components may include an indication of the user's desire to purchase, or obtain a new prescription for, a catheter or related component. Exemplary information about the manner of using the catheter may include: a drainage type (e.g. from the chest vs. from the abdomen), a prescribed drainage schedule, a date and/or time of drainage conducted, and/or a request for information about how to implement a step of using the catheter to drain fluid from the patient (e.g. a request input to device201afrom the user requesting that device201adisplay instructions and/or instructional videos related to connecting the drainage bottle, draining fluid, and/or final steps and disposal, and/or a request input to device201afrom the user requesting that device201adisplay a Frequently Asked Questions page and/or message board related to use of the catheter). Exemplary information about results of using the catheter to drain fluid from the patient may include: volume drained from the patient; frequency of drainage from the patient; comfort or discomfort level of the patient (e.g. indications that the catheter site may be infected, indications of patient pain experience and/or pain rating, indications of shortness of breath, coughing, chest discomfort, and/or excessive saliva); information about the patient's ambulation ability (e.g. full, reduced, mainly site or lie down, mainly in bed, and/or totally bed bound); user notes about the drainage; and/or an image of a used drainage bottle and the fluid therein. Referring again toFIGS.2and3, an embodiment of patient device201aimplemented using mobile device300is further configured to receive the catheter use information that is input by the patient-side user through input interface303of user interface301, and to generate catheter management information based upon the received catheter use information. Catheter management information includes information that the patient, caretaker, physician, nurse, or others could use to implement, alter, avoid, or treat the patient in connection with, use of the catheter to drain fluid from the patient. Exemplary catheter management information may include: stored results of using the catheter to drain fluid from the patient; a recommendation of a step to be taken by the user to use the catheter to drain fluid from the patient; an indication of whether medical personnel should be contacted regarding the patient; and/or background information about using the catheter to drain fluid from the patient. Exemplary stored results of using the catheter to drain fluid from the patient may include a historical log of drainage results over time. Exemplary recommendations of a step to be taken by the user to use the catheter to drain fluid from the patient may include: a page configured to request a new prescription for a component of using the catheter to drain fluid from the patient; a page configured to order a component of using the catheter to drain fluid from the patient; instructions for how to use the catheter to drain fluid from the patient; and/or a page configured to access a video file related to using the catheter to drain fluid from the patient. Exemplary indications of whether medical personnel should be contacted regarding the patient may include: a page indicating that a medical professional should be contacted regarding the patient; a page indicating that a medical professional need not be contacted regarding the patient; and/or a message that automatically contacts a medical professional regarding the patient. Exemplary background information about using the catheter to drain fluid from the patient may include a discussion board and/or frequently asked questions (FAQ) page related to using the catheter for fluid drainage. In an embodiment of patient device201aimplemented using mobile device300, an embodiment of user interface301may be a graphical user interface including one or more patient pages configured to be displayed by display306. Patient device201amay be configured to generate and/or otherwise provide patient pages for display by display306. For example, patient device201amay be configured to render patient pages for display by display306. Patient pages may each incorporate one or more perceptible output elements304and/or one or more interactive input elements305. As will be described further below, some patient pages may be operatively connected with other patient pages, such that when the patient-side user interacts with an interactive input element305on one patient page, another patient page is provided and/or displayed by display306. Exemplary patient pages with one or more of these features are shown in and described with reference toFIGS.4-25. One embodiment of a patient page is described with reference toFIG.4.FIG.4depicts page400, which is a patient-side log-in screen that is configured to prompt the user to enter a username and associated password. Page400may be configured to operate as a component of a unique patient portal. A unique patient portal may include access to different options, such as different prompts for catheter use information and different catheter management information, than is available in unique physician and nurse portals that are described further below. The unique patient portal may be a secure portal. For example, patient device201amay be configured such that in order for a user to view any of the exemplary patient pages ofFIGS.4-25that display or allow the user to input catheter use information associated with a patient, the user must first enter a username associated with that patient along with a password that patient device201arecognizes as being associated with that patient. Another embodiment of a patient page is described with reference toFIG.5.FIG.5depicts page500, which is a create account page. Page500is configured to allow a patient-side user to create an account associated with system200. Page500is configured to prompt a user to input a username (such as an e-mail address) and a password, and patient device201ais configured to associate the entered username with the password within system200. Page500is further configured to prompt a user to input other information about the patient associated with the created account, such as the type of catheter used by the patient, the age of the patient, and the gender of the patient, and patient device201ais configured to then associate that entered information about the patient with the created account within system200. Page500may be reached upon the user selecting the “Create Account” selectable link of page400. Another embodiment of a patient page is described with reference toFIGS.6A-6C.FIGS.6A-6Cdepict page600, which is a patient dashboard that may be automatically reached after the user inputs a recognized username and password into page400. Page600is configured to display information about the patient who is associated with the recognized username and password. Page600is configured to display recent drainage volumes input by the patient, as depicted inFIG.6A. Page600is further configured to display a message600aindicating the patient's next scheduled drainage. The message may be a pop-up message, as depicted inFIG.6B. Patient device201amay be configured to display page600based upon previously entered catheter use data, such as the patient's prescribed drainage schedule and/or a historical log of the patient's input catheter use data. Page600is further configured to display a plurality of selectable links each configured to display another of the exemplary pages ofFIGS.4-25upon selection by the user. Page600may be configured to display some of the plurality of selectable links through a drop-down menu600bdisplayed to the user by interacting with a button, as depicted inFIG.6C. Another embodiment of a patient page is described with reference toFIG.7.FIG.7depicts page700, which is a settings screen that may be reached upon the user selecting a selectable “Settings” link (not shown) of page600. Page700is configured to display interactive input elements that allow the user to input catheter use information including drainage type and drainage schedule settings. Another embodiment of a patient page is described with reference toFIG.8.FIG.8depicts page800, which is a daily drainage schedule screen configured to inform the user of the patient's next scheduled drainage. Page800may be reached upon the user selecting the “View Calendar” selectable link of page600and choosing the “Day” selectable link (not shown). Another embodiment of a patient page is described with reference toFIG.9.FIG.9depicts page900, which is a monthly drainage schedule screen configured to inform the user of scheduled drainages in a month and to allow the user to add an entry of catheter use information in association with a given day via various interactive input elements. Page900may be reached upon the user selecting the “View Calendar” selectable link of page600and choosing the “Month” selectable link (not shown). Another embodiment of a patient page is described with reference toFIGS.10A-10E.FIGS.10A-10Edepict page1000, which is an add entry page configured to prompt the user to input, through a variety of interactive input elements, various catheter use input information, including volume of drainage, date of drainage, time of drainage, patient discomfort level, and drainage details. Page1000may be reached upon selecting the Add Entry (i.e. “+”) selectable link of pages600,800,900,1400,2100, and/or2200. Page1000may be configured to, in response to a user selecting an appropriate interactive input element, display a scroller that allows the user to input catheter use information associated with the respective interactive input element. For example,FIG.10Bdepicts a scroller displayed by page1000in configuration1000ain response to a user selecting the date of drainage interactive input element.FIG.10Cdepicts a scroller displayed by page1000in configuration1000bin response to a user selecting the time of drainage interactive input element.FIG.10Ddepicts a scroller displayed by page1000in configuration1000cin response to a user selecting the drainage volume interactive input element.FIG.10Edepicts a pop-up interface displayed by page1000in configuration1000din response to a user selecting the pain rating interactive input element, which is configured for a user to select an appropriate pain rating. Patient device201ais configured to associate the catheter use information input through page1000with a catheter use information entry and with the patient. Another embodiment of a patient page is described with reference toFIGS.11A-11C.FIGS.11A-11Cdepict page1100, which is a catheter use information input screen configured to prompt the user to input a variety of catheter use information using a plurality of interactive input elements. Page1100further allows the user to upload a picture, such as a picture of the used drainage bottle and its contents, or a picture of the patient's catheter exit site. Page1100may be configured to display a pop-up menu in response to a user selecting the “Add Photo” selectable link depicted inFIG.11A. A pop-up menu configuration1100ais depicted inFIG.11B, and may include a plurality of selectable links that allow the user to choose an image already stored on patient device201a, capture a new image using an image capture sensor of device201a, or delete an image from device201a. Page1100is further configured for the user to input notes to associate with a catheter use information entry. Page1100is further configured to allow the user to input additional information to store in association with a catheter use information entry. For example, page1100is configured to prompt a user to input information about where the drainage procedure was performed, who performed the drainage procedure, and how long the drainage procedure took. Page1100may be configured to prompt the user by displaying a drop-down menu configuration1100bwhen a user selects a selectable link on page1100, as depicted inFIG.11C. Page1100may further be configured to prompt a user to indicate whether the patient is experiencing shortness of breath, coughing, chest discomfort, and excessive saliva. Page1100may be reached by a user selecting the “Add Notes” selectable link of page1000. Patient device201amay be configured to receive a picture that has been uploaded to patient device201a, for example using page1100, and to perform image analysis on the uploaded picture. The picture may be of the patient's used drainage bottle and its contents, or of the patient's catheter exit site. In an exemplary image analysis algorithm, patient device201amay be configured to perform image analysis on an uploaded picture of a used drainage bottle and its contents to determine changes in color of the fluid in the bottle, and to automatically display a medical personnel contact recommendation and/or contact the physician upon a determination that a predetermined change in color has occurred. For example, patient device201amay be configured to extract a color signal from the image and/or a transparency signal from the image. Patient device201amay be further configured to compare an extracted color signal and/or transparency signal from an uploaded image with one or more color signals and/or transparency signals from one or more previous images associated with that patient, and to determine a percentage change in color signal and/or transparency signal from the previous image(s) to the analyzed image. Patient device201amay be further configured to determine whether the percentage change in color signal and/or transparency signal is greater than a predetermined percentage. Patient device201amay be further configured to, upon determining that the percentage change is greater than the predetermined percentage, display a medical personnel contact recommendation, and/or automatically contact medical personnel with a message informing the medical personnel that the patient is exhibiting the predetermined percentage change in color signal and/or transparency signal. In an exemplary image analysis algorithm, patient device201amay be configured to compare an extracted color signal and/or transparency signal from an uploaded image of the used bottle and its contents with one or more color signals and/or transparency signals from an electronic library storing used bottle and bottle contents images associated with all patients associated with system200. Patient device201amay be further configured to determine whether a predetermined relationship exists between the extracted color signal and/or transparency signal from the uploaded image and the one or more color signals and/or transparency signals from the used bottle and bottle contents images in the electronic library. The electronic library may be on or accessible to server202. In an exemplary image analysis algorithm, patient device201amay be configured to perform image analysis on an uploaded picture of the used bottle and its contents to automatically determine and log drainage volume. For example, patient device201amay be configured to detect top and bottom edges of the used bottle and top and bottom edges of fluid in the bottle. Patient device201amay be further configured to use the detected edges to determine a height of the bottle and a height of the fluid. Patient device201amay be further configured to calculate a ratio of bottle height to fluid height. Patient device201amay be further configured to compare the calculated ratio to a predetermined scale relating a plurality of volumes of fluid in a bottle to a plurality of respective ratios of bottle height to fluid height, and to thereby determine a volume the corresponds to the calculated ratio. Patient device201amay be further configured to store the determined volume as a drainage volume in a historical log of the patient. In an exemplary image analysis algorithm, patient device201amay be configured to perform analysis on an uploaded picture of the patient's catheter exit site. For example, patient device201amay be configured to extract a color signal from an uploaded image. Patient device201amay be further configured to compare an extracted color signal from the uploaded image with one or more color signals from one or more previous images associated with that patient, and to determine a percentage change in color signal from the previous image(s) to the analyzed image. Patient device201amay be further configured to determine whether the percentage change in color is greater than a predetermined percentage. Patient device201amay be further configured to, upon determining that the percentage change is greater than the predetermined percentage, display a medical personnel contact recommendation, and/or automatically contact medical personnel with a message informing the medical personnel that the patient is exhibiting the predetermined percentage change in color signal and may be exhibiting an infection. In an exemplary image analysis algorithm, patient device201amay be configured to compare an extracted color signal from an uploaded image of the patient's catheter exit site with one or more color signals and/or transparency signals from an electronic library storing catheter exit site images associated with all patients associated with system200. Patient device201amay be further configured to determine whether a predetermined relationship exists between the extracted color signal from the uploaded image and the one or more color signals from the catheter exit site images in the electronic library. The electronic library may be on or accessible to server202. In an exemplary image analysis algorithm, patient device201amay be configured to use an extracted color signal from an uploaded image of a patient's catheter exit site to determine a size of red area around the catheter exit site. Patient device201amay determine the size of red area around the catheter exit site by detecting an edge between the red area and a non-red area surrounding the red area, defining that edge as the boundary of the red area, and calculating the area within the boundary. Patient device201amay be further configured to compare the calculated red area with one or more red areas from one or more previous images of the patient's catheter exit site to determine a percentage change in red area from the previous image(s). Patient device201amay be further configured to compare the determined percentage change to a predetermined threshold percentage change, and to display a medical personnel contact recommendation, and/or automatically contact medical personnel with a message informing the medical personnel that the patient is exhibiting the predetermined percentage change in red area and may be exhibiting an infection. Another embodiment of a patient page is described with reference toFIG.12.FIG.12depicts page1200, which is a catheter use information input screen configured to prompt the user to input a plurality of catheter use information. Page1200is configured to prompt the user to input whether the catheter site may be infected, whether pain is experienced, whether the patient drained more than 1000 mL, and whether the patient drained less than 50 mL three times in a row. In some embodiments, patient device may be configured to display a medical personnel contact recommendation when the user selects one or more of the interactive input elements of page1200that indicate that a user is experiencing the prompted-for conditions. In some embodiments, patient device201amay be configured to automatically generate and transmit a signal to physician device203and/or nurse device204upon user selection of those interactive input elements. For example, patient device201amay be configured to receive, via page1200, an input from the user indicating that the patient has drained less than 50 mL for three consecutive drainages, and in response: (1) display a medical personnel contact recommendation; and/or (2) automatically provide a diagnosis that the patient may have achieved pleurodesis; and/or (3) automatically provide a signal informing the physician that the patient should come in for a follow up appointment. Another embodiment of a patient page is described with reference toFIG.13.FIG.13depicts page1300, which is an ambulation information input screen configured to prompt the user to input a description of the patient's ambulatory ability, and to receive the input using a plurality of selectable interactive input elements. Another embodiment of a patient page is described with reference toFIGS.14A-14B.FIGS.14A-14Bdepict page1400, which is a view log screen configured to display a historical log in a chart form depicting the drainage volume or discomfort level (e.g. pain rating) at various dates. The historical log of page1400may be generated by patient device201abased upon catheter use information input through page1000and/or page1100. Page1400also includes interactive input elements configured to allow the user to toggle from the historical log for drainage volume1400a, depicted inFIG.14A, to the historical log for discomfort level1400b, depicted inFIG.14B. Historical log for drainage volume1400amay depict drainage volumes that are below a threshold level, such as 50 mL, in a manner distinct from drainage volumes not below that threshold level, for example by using a different color, as depicted inFIG.14A. The bar charts of page1400shown inFIGS.14A and14Bmay be configured to scroll horizontally, such that information from additional dates can be displayed on the screen of patient device201a. Additionally, the listing of logged data of page1400shown inFIGS.14A and14Bbelow the bar charts may be configured to scroll vertically, such that information from additional dates can be displayed on the screen of patient device201a. Page1400can be reached upon the user selecting the “View Logs” link of page600. Patient device201amay be configured to automatically perform analysis upon data of a historical log in order to generate and/or display one or more patient diagnoses and/or medical personnel contact recommendations. For example, patient device201amay be configured to execute an algorithm which analyzes a historical log, such as the historical log whose data is displayed by page1400. The algorithm may monitor drainage volumes and/or patient discomfort levels over some number of consecutive days to determine a trend. In an embodiment of an exemplary historical log analysis algorithm, patient device201amay be configured to recognize when a historical log includes three consecutive days in which drainage of 50 mL or less of drainage is recorded, and to in response determine that the patient is exhibiting a pattern indicating they have achieved pleurodesis. Patient device201amay be further configured to, in response to the determination that the patient is exhibiting a pattern indicating they have achieved pleurodesis, display a medical personnel contact recommendation to the user, and/or automatically contact medical personnel with a message informing the medical personnel of the diagnosis. In an embodiment of an exemplary historical log analysis algorithm, patient device201amay be configured to recognize that the patient's drainage has rapidly dropped from an amount within an expected range during one or more days to nearly zero drainage during one or more subsequent days, and to in response determine that the patient's catheter might be clogged. Patient device201amay be further configured to, in response to a determination that the patient's catheter might be clogged, look up the patient's discomfort levels from the days with nearly zero drainage and compare them to a predetermined threshold. Patient device201amay be further configured to, upon a determination that the patient's discomfort levels from those days are below a threshold, determine that the patient is not feeling well, and in response display a medical personnel contact recommendation to the user, and/or automatically contact medical personnel with a message informing the medical personnel that the patient's catheter may be clogged and that the patient should visit the medical personnel. In an embodiment of an exemplary historical log analysis algorithm, patient device201amay be configured to recognize that the patient's drainage has shown a trend of decreasing over some number of consecutive days, and has then substantially increased in a manner indicating that effusion has reoccurred. Patient device201amay be configured to, upon a determination that effusion has reoccurred, display a medical personnel contact recommendation to the user, and/or automatically contact medical personnel with a message informing the medical personnel that effusion has reoccurred and to monitor the patient to determine the cause of the reoccurrence. For example, the message may suggest that the medical personnel perform ultrasound and/or X-ray imaging of the patient. In an embodiment of an exemplary historical log analysis algorithm, patient device201amay be configured to recognize when a historical log includes random drainage over some number of consecutive days. Patient device201amay be further configured to determine that the patient's drainage has been random over the number of consecutive days by determining that the patient's drainage over the number of consecutive days does not exhibit a trend for which medical personnel should be contacted (e.g. pleurodesis has been achieved, potential catheter clog, effusion reoccurrence, etc.). Patient device201amay be further configured to, upon a determination that the patient's drainage has been random over the consecutive number of days, display a message to the user to continue routine drainage, and/or automatically contact medical personnel with a message informing the medical personnel that the patient should continue routine drainage. In an embodiment of an exemplary historical log analysis algorithm, patient device201amay be configured to recognize when a historical log includes a trend of increasing quality of life. For example, patient device201amay be configured to recognize a trend of increasing quality of life when a historical log includes a trend of decreasing discomfort levels. Patient device201amay be further configured to, upon determining that the patient's quality of life has been increasing (e.g. when the patient's discomfort levels have been decreasing), display a medical personnel contact recommendation to the user, and/or automatically contact medical personnel with a message informing the medical personnel that the patient's quality of life is improving and to consider bringing in the patient and performing more aggressive chemotherapy treatment. In an embodiment of an exemplary historical log analysis algorithm, patient device201amay be configured to recognize when a historical log includes a trend of decreasing quality of life. For example, patient device201amay be configured to recognize a trend of decreasing quality of life when a historical log includes a trend of increasing discomfort levels. Patient device201amay be further configured to, upon determining that the patient's quality of life has been decreasing (e.g. when the patient's discomfort levels have been increasing), display a medical personnel contact recommendation to the user, and/or automatically contact medical personnel with a message informing the medical personnel that the patient's quality of life is decreasing and to consider bringing in the patient and adjusting chemotherapy treatment. In an embodiment of an exemplary historical log analysis algorithm, patient device201amay be configured to automatically monitor trends in a patient's catheter use information and/or catheter management information and automatically adjust the patient's drainage schedule based thereon. For example, for ascites patients, resolution of fluid build-up may not be an expected outcome, so a goal may be to achieve steady states for patient quality of life (or comfort), food intake, and fluid drainage volumes. Patient device201amay be configured to recognize that a patient's historical log shows a fluctuation in quality of life (e.g. discomfort level), appetite, and/or drainage volumes from day to day. An exemplary fluctuation may be defined as a series of daily values that alternate from relatively high to relatively low from day to day. Patient device201amay be configured to adjust the patient's drainage schedule in response to recognizing the fluctuation in quality of life, appetite, and/or drainage volume. Patient device201amay be configured to adjust the patient's drainage schedule by displaying one or more prompts configured to cause more frequent fluid drainage of the patient. Patient device201amay be configured to automatically monitor the patient's quality of life, appetite, and/or drainage volume after the patient's drainage schedule has been adjusted, and to further adjust the patient's drainage schedule until monitored quality of life, appetite, and/or drainage volumes reach respective optimized levels. Optimized levels may be defined as steady state levels. Another embodiment of a patient page is described with reference toFIG.15.FIG.15depicts page1500, which is a send report screen including interactive input elements configured to allow the user to send a weekly report or a full report from patient device201ato server202, physician device203, and/or nurse device204. Page1500can be reached by a user selecting the “Report” selectable link of pages800,900,1000,1100, and/or1400. Another embodiment of a patient page is described with reference toFIG.16.FIG.16depicts page1600, which is a report screen. Page1600includes a plurality of interactive input elements configured to allow the user to generate and send a report file by selecting a recipient, adding pictures and drainage log files, inputting a message, and selecting a send link. Page1600may be reached upon selecting an interactive input element on page1500. Patient device201amay be configured to send the report file to physician device203and/or nurse device204. Another embodiment of a patient page is described with reference toFIG.17.FIG.17depicts page1700, which is a medical personnel contact recommendation screen. Patient device201amay be configured to display a medical personnel contact recommendation screen upon a user selecting one or more of the interactive input elements shown on page1200that confirm that the patient is experiencing the conditions associated therewith. In some embodiments, the displayed medical personnel contact recommendation may simply prompt the user to contact medical personnel. Page1700is an example of a medical personnel contact recommendation screen that may be displayed if none of the interactive input elements of page1200are selected by the user. Page1700further includes a link to contact a hotline associated with using the catheter to drain fluid from the patient. The link may be configured to cause patient device201ato make a telephone call to the hotline upon the user selecting the link. Another embodiment of a patient page is described with reference toFIG.18.FIG.18depicts page1800, which is a shopping cart screen. Page1800includes a plurality of interactive input elements configured to allow the user to select components to use a catheter to drain fluid from a patient, and to submit a request to order the selected components. Page1800can be reached upon the user selecting the selectable shopping cart link of page600. Patient device201amay be configured to display page1800based upon catheter use information. For example, patient device201amay execute an algorithm that receives from physician device203a number of refills for a patient, subtracts a refill from that number each time a user submits a request for a refill using page1800, and displays the updated refills remaining on page1800. Another embodiment of a patient page is described with reference toFIG.19.FIG.19depicts page1900, which is a request prescription screen. Page1900includes a plurality of interactive input elements allowing the user to input information about the patient's doctor and required components of using the catheter to drain fluid, and to submit a request for a new prescription. Page1900can be reached upon the user selecting the “Request New Prescription” link of page1800. Patient device201amay be configured to send the request for a new prescription to server202, physician device203, and/or nurse device204upon selection of the “Request New Prescription” link of page1900. Another embodiment of a patient page is described with reference toFIG.20.FIG.20depicts page2000, which is a resources screen. Page2000includes a plurality of interactive input elements configured to allow the user to select sources of instructions for and background information about using the catheter to drain fluid. Page2000can be reached upon the user selecting the resources link of page600. Another embodiment of a patient page is described with reference toFIG.21.FIG.21depicts page2100, which is an instructions selection page. Page2100includes a plurality of interactive input elements configured to prompt the user to input catheter use information about the clamp type, prompt the user to select from instructional videos, and prompt the user to select a link to frequently asked questions. Page2100can be reached upon the user selecting the “Drainage Instructions” link of page2000. Another embodiment of a patient page is described with reference toFIG.22.FIG.22depicts page2200, which is a detailed instructions selection screen. Page2200includes a plurality of interactive input elements configured to prompt the user to select a relevant set of instructions for a particular part of the drainage process. Page2200can be reached by selecting the appropriate clamp type link of page2100. Another embodiment of a patient page is described with reference toFIGS.23A,23B,23C, and23D.FIGS.23A,23B,23C, and23Drespectively depict pages2301,2302,2303, and2304, which are respectively instructions screens for: preparing to drain; connecting the drainage bottle; draining fluid; and finishing draining. Pages2301,2302,2303, and2304can respectively be reached upon the user selecting the corresponding selectable link from page2200. Another embodiment of a patient page is described with reference toFIG.24.FIG.24depicts page2400, which depicts a detailed manual selection screen including selectable links providing the user access to detailed manuals according to clamp type. Page2400can be reached upon the user selecting the “View detailed instructions” link of page2100. Another embodiment of a patient page is described with reference toFIG.25.FIG.25depicts page2500, which depicts an instructional video selection screen including a plurality of selectable links providing the user access to instructional videos related to using the catheter to drain fluid from the patient. Page2500can be reached upon the user selecting the “Watch instructional videos” link of page2100. Patient device201ais further configured to encrypt and store catheter management information in a HIPAA compliant manner, and to transmit catheter management information to server202in a HIPAA compliant manner. For example, patient device201amay be configured to verify that server202is located within the same country as the patient device201abefore transmitting catheter management information to the server202. One or more patient devices (e.g. patient device201a), physician devices (e.g. physician device203), nurse devices (e.g. nurse device204), and/or servers (e.g.202) may be configured to receive information from one or more attachments and/or sensors. The one or more attachments and/or sensors may be of one or more types. For example, one or more of patient device201a, server202, physician device203, and/or nurse device204may be further configured to receive information from one or more attachments and/or sensors that include: pH sensors configured to measure the pH level of the drainage fluid, weight sensors configured to measure the weight of the drainage bottle, albumin sensors configured to measure the albumin level of the drainage fluid, intrapleural pressure sensors attached to the catheter, lactate dehydrogenase (LDH) sensors configured to measure LDH level of the drainage fluid, glucose sensors configured to measure glucose level of the drainage fluid, cell count sensors configured to measure cell count level of the drainage fluid, cell differential sensors configured to measure cell differentiation level of the drainage fluid, interleukin (IL) level sensors configured to measure levels of various interleukins of the drainage fluid, vascular endothelial growth factor (VEGF) sensors configured to measure level of VEGF of the drainage fluid, interferon gamma (IFN-gamma) sensors configured to measure level of IFN-gamma of the drainage fluid, and/or other suitable sensors. In some embodiments, the types of attachments and/or sensors may be different between systems configured to perform and/or monitor different types of drainage. For example, in a system configured to drain fluid and monitor drainage in association with pleural effusion, sensors may include one or more sensors to measure LDH, glucose, pH, cell count, and/or cell differential. In a system configured to drain fluid and monitor drainage in association with ascites, sensors may include one or more sensors to measure cell count, cell differential, IL-6, IL-7, IL-8, IL-9, IL-10, VEGF, IFN-gamma, and/or albumin. These exemplary embodiments are not limiting, and those skilled in the art may recognize other suitable sensor types, and/or combinations of sensor types, with which to configure a patient device, physician device, nurse device, and/or server for communication, and/or to include with a drainage apparatus. The one or more attachments and/or sensors may be included on or in one or more components of a drainage apparatus such as apparatus100. One or more sensors may be included on or in a catheter, for example catheter112. One or more sensors may be included at a distal tip of a catheter, for example catheter112. One or more sensors may be included in a cap on a catheter valve, for example valve116. One or more sensors may be included inside drainage tubing, for example proximal tube110. One or more sensors may be included on or within a drainage container, for example drainage container114. These exemplary embodiments are not limiting, and those skilled in the art may recognize other suitable sensor locations. One or more of patient device201a, server202, physician device203, and/or nurse device204may be further configured to add data received from these one or more attachments and/or sensors to a patient's historical data log, patient reports, etc., for example in association with a catheter use information entry, and to perform trend analysis on data received from these one or more attachments or sensors. Referring again toFIGS.2and3, an embodiment of physician device203may be implemented using another mobile device300. In an embodiment of physician device203implemented using another mobile device300, physician device203is configured to prompt, using output interface302, a physician to input catheter use information, and to allow the physician to input catheter use information using input interface303. In an embodiment of physician device203implemented using another mobile device300, the physician device203is further configured to receive the catheter use information that is input by the physician through input interface303of user interface301, and to generate catheter management information based upon the received catheter use information. In an embodiment of physician device203implemented using another mobile device300, an embodiment of user interface301may be a graphical user interface including one or more physician pages configured to be displayed by display306. Physician device203may be configured to generate and/or otherwise provide physician pages for display by display306. For example, physician device203may be configured to render physician pages for display by display306. Physician pages may each incorporate one or more perceptible output elements304and/or one or more interactive input elements305. As will be described further below, some physician pages may be operatively connected with other physician pages, such that when the physician interacts with an interactive input element305on one physician page, another physician page is provided and/or displayed by display306. Exemplary physician pages with one or more of these features are shown in and described with reference toFIGS.26-28 Physician device203may be further configured to establish a unique physician portal. A unique physician portal may include access to different options, such as different prompts for catheter use information and different catheter management information, than is available in unique patient portals described above and unique nurse portals that are described further below. The unique physician portal may be a secure portal. For example, physician device203may be configured such that in order for a physician to view any of the exemplary physician pages ofFIGS.26-28that display or allow the physician to input catheter use information associated with a physician, the physician must first enter, in a login page similar login page400, a username associated with the physician along with a password that physician device203recognizes as being associated with the physician. An embodiment of a physician page is described with reference toFIG.26.FIG.26depicts page2600, which is a physician dashboard screen configured to display a plurality of perceptible output elements and a plurality of interactive input elements. Page2600is configured to display to the physician an indicator of unread messages associated with the physician, and a fillable text field configured to allow the physician to enter a patient name to search for information related to that patient. Page2600is further configured to display to the physician an interactive menu of selectable links to other exemplary physician pages ofFIGS.26-28. Another embodiment of a physician page900is described with reference toFIG.27.FIG.27depicts page2700, which is a directions menu screen. Page2700is configured to allow the physician to request directions regarding a plurality of components related to using a catheter to drain fluid from a patient, by selecting from a plurality of selectable links. Page2700can be reached upon a physician selecting the information (“i”) selectable link on page2600. Another embodiment of a physician page is described with reference toFIG.28.FIG.28depicts page2800, which is a shopping menu screen. Page2800is configured to allow the physician to order components related to using a catheter to drain fluid from a patient, by selecting from a plurality of selectable links. Page2800can be reached upon a physician selecting the shopping cart selectable link on page2600. Physician device203may be further configured to allow the physician to receive, view, and respond to any catheter management information transmitted from patient device201ato physician device203. Physician device203may be configured to allow the physician to view and respond to catheter management information of patient device203in real-time. For example, a physician could use physician device203to monitor the patient's logged drainage results information, determine that the user is not performing the prescribed drainage procedure, and then use physician device203to transmit a message to patient device201aindicating that the prescribed drainage procedure should be adopted immediately to avoid a hospital visit. Physician device203may be further configured to transmit a notification to the patient that the patient may need to come in for a follow-up appointment, based upon catheter management information received by the physician device203. Referring again toFIGS.2and3, an embodiment of nurse device204may be implemented using another mobile device300. In an embodiment of nurse device204implemented using another mobile device300, nurse device204is configured to prompt, using output interface302, a nurse to input catheter use information, and to allow the nurse to input catheter use information using input interface303. For example, nurse device204may be configured to generate and/or otherwise provide nurse pages for display by display306. For example, nurse device204may be configured to render nurse pages for display by display306. In an embodiment of nurse device204implemented using another mobile device300, the nurse device204is further configured to receive the catheter use information that is input by the nurse through input interface303of user interface301, and to generate catheter management information based upon the received catheter use information. Nurse device204may be further configured to establish a unique nurse portal. A unique nurse portal may include access to different options, such as different prompts for catheter use information and different catheter management information, than is available in unique patient and physician portals that are described above. The unique nurse portal may be a secure portal. For example, nurse device204may be configured such that in order for a nurse to view or input catheter use information associated with the nurse, the nurse must first enter, in a login page similar login page400, a username associated with the nurse along with a password that nurse device204recognizes as being associated with the nurse. In some embodiments of system200, the same software application could be loaded on or otherwise provided to patient devices201a-201n, physician device203, and nurse device204, with the software application configured to cause those devices to perform the operations associated herein with those devices. In those embodiments, the software application could be configured such that each device would provide access to the operations respectively associated with that device based upon privileges associated with the username entered in a login page similar to login page400. In some embodiments of system200, two distinct software applications could be provided: a patient software application loaded on or otherwise provided to patient devices201a-201n; and a clinician software application loaded on or otherwise provided to physician device203and nurse device204. In those embodiments, the patient software application may be configured to cause patient devices201a-201nto perform only the operations associated herein with patient devices201a-201n, while the clinician software application may be configured to cause physician device203and nurse device204to perform the operations respectively associated herein with those devices depending upon privileges associated with the username entered in a login page similar to login page400. The clinician software application may further be configured to cause both physician device203and nurse device204to generate a clinician portal that provides access to training opportunities (e.g. webinars), journal articles, discussion boards, videos, tips and tricks, the ICD-10 code list, and/or instructions for how to fill out prescription forms for success with medical supply companies. Referring again toFIG.2, server202is configured to receive catheter management information transmitted by patient device201a, physician device203, and nurse device204. Server202may be a server associated with Amazon Web Services that is configured to host information associated with system200. Server202is configured to encrypt and store received catheter management information in a HIPAA compliant manner. Server202is further configured to transmit stored catheter management information in a HIPAA compliant manner to patient device,201a, physician device203and nurse device204. Server202is also configured to transmit catheter management information received from patient device201a, physician device203, nurse device204to another patient device, another physician device, and/or another nurse device in a HIPAA compliant manner. In some embodiments, server202is further configured to integrate catheter management information received from patient device201ainto electronic health records (EHR) associated with the patient. For example, server202may be configured to directly integrate catheter management information into electronic health records associated with the patient, without any intervention by medical personnel. In some embodiments, server202is further configured to scrub patient identifying information from catheter management information received from patient device201a, and to provide the catheter management information, scrubbed of the patient identifying information, to an account associated with a clinical study and/or to an account associated with a manufacturer of the catheter to be used for researching trends in diseases. Scrubbing of patient identifying information may be performed using currently available or later developed algorithms and/or devices recognized as suitable to one skilled in the art. In some embodiments, server202is further configured to aggregate catheter management data from a plurality of patient devices201a-201nfor use in clinical studies or for researching trends in diseases. In an exemplary embodiment, server202may be configured to analyze aggregated catheter management data from a plurality of patient devices201a-201nand output population catheter management data to a web portal. An exemplary web portal2900output by server202is depicted inFIGS.29A and29B. Web portal2900may be accessible to a manufacturer of the type or brand of catheters that are used by the patients associated with patient devices201a-201n. As shown inFIGS.29A and29B, population catheter management data displayed at web portal2900may include: total number of users; number of active users; number of users using a particular type of mobile device; percentage of users using various catheter types (e.g. pleural vs. peritoneal); number of patients of a given gender; number of patients of a given age; and/or average population drainage frequency for a given week of treatment. Population catheter management data displayed at a web portal may also include: average population drainage volume for a given number of drainage procedures; average population pain rating for a given number of drainage procedures; number of patients using a given number of bottles per catheter or performing a given number of drainage entries per catheter; population average amount of time to perform a drainage procedure; population average number of drainage entries per given location; and/or population average number of drainage entries per given performer of drainage. Server202may be configured to determine population management data specific to a given type of catheter type (e.g. pleural vs. peritoneal). One embodiment of an electronic device having elements suitable for implementing patient device201a, server202, physician device203, nurse device204, and/or mobile device300is described with reference toFIG.30, which depicts electronic device3000. Electronic device3000may be a mobile phone, smart phone, tablet computer, desktop computer, laptop computer, personal digital assistant (PDA), medical device, dedicated server, or the like, as appropriate given the context. Electronic device3000includes a processing unit3001operably connected with a memory unit3002, a power unit3003, an input/output unit3004, a communication unit3005, and a peripheral unit3006. Processing unit3001includes one or more of processor3007. Processor3007is configured to receive, process, and output data. Processor3007may be or include one or more of a microprocessor, central processing unit (CPU), application specific integrated circuit (ASIC), digital signal processor (DSP), network processor, graphics processing unit, floating-point unit, image processor, coprocessor, or the like. Memory unit3002is generally configured to store data in a manner accessible to one or more of the other units of electronic device3000. Memory3002may include a non-transitory computer-readable medium. Memory unit3002may include one or more of non-volatile memory, including flash memory, read-only memory (ROM), programmable ROM (PROM), erasable PROM (EPROM), and, electrically erasable PROM (EEPROM), or volatile memory, including dynamic random-access memory (DRAM), fast CPU cache memory, static random-access memory (SRAM), or the like. Memory unit3002may be configured to receive, organize, and store data received from one or more of the other units of electronic device3000, and allow one or more of the other units of electronic device3000to access the data stored by the memory unit3002as appropriate in context. Memory unit3002may store software or firmware in the form of a set of executable instructions configured to be executed by processing unit3001. The set of executable instructions stored by memory unit3002may be configured to, when executed by processing unit3001, cause processing unit3001to perform, or as appropriate according to context, control the performance of, any of the operations associated in this disclosure with system200, patient device201a, server202, physician device203, nurse device204, or mobile device300. Power unit3003generally provides power to one or more of the other units of electronic device3000to allow those units to function. Power unit3003may include an AC or DC power supply, switches, a current regulator, and a voltage regulator. Power unit3003may include a battery or other source of electrical energy. Input/output unit3004is configured to provide for transfer of information between processing unit3001and one or more of memory unit3002, communication unit3005, or peripheral unit3006. Input/output unit3004may be implemented as hardware, software, or a combination of hardware and software. Communication unit3005is configured to receive data for and transmit data from electronic device3000. Communication unit3005may facilitate wired or wireless communication with other devices. Communication unit3005may include a wireless antenna and/or transceiver. Communication unit3005may be configured to establish a data transfer connection with a computer network such as the internet, or with individual devices. Communication unit3005may be configured to communicate according to any communication protocol recognized as suitable in the art. Peripheral unit3006is configured to accept input from a user or output information to a user. Peripheral unit3006may include input peripherals such as a keyboard, computer mouse, touchscreen, microphone, digital camera, image capture sensor, video sensor, or the like. Peripheral unit3006may further include output peripherals, such as a computer display, speaker, or the like. Peripheral unit3006may further be configured to accept input from one or more attachments and/or sensors configured to provide information about the catheter use, including pH sensors, weight sensors, albumin level sensors, intrapleural pressure sensors, LDH level sensors, glucose level sensors, cell count sensors, cell differential level sensors, IL level sensors, VEGF level sensors, IFN-gamma level sensors, and/or other suitable sensors. Aspects of this disclosure provide a variety of benefits over the conventional paper log technology discussed above. Devices for and methods of mobile monitoring of a drainage catheter disclosed herein may: allow users to more conveniently log information related to the drainage catheter and share the information with parties involved in the treatment; provide for automatic notification of relevant conditions to parties involved in the treatment; allow for parties involved in the treatment to access unique portals and dashboards targeted to the respective parties' roles in the treatment; allow the patient to more efficiently obtain necessary drainage supplies and communicate with other patients using the same type of catheter; and/or increase patient compliance with prescribed drainage procedures and thereby improve patient outcomes. Those of skill in the art will appreciate that embodiments not expressly illustrated herein may be practiced within the scope of the claims, including that features described herein for different embodiments may be combined with each other and/or with currently-known or future-developed technologies while remaining within the scope of the claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation unless specifically defined by context, usage, or other explicit designation. It is therefore intended that the foregoing detailed description be regarded as illustrative rather than limiting. And, it should be understood that the following claims, including all equivalents, are intended to define the spirit and scope of this invention. Furthermore, the advantages described above are not necessarily the only advantages of the invention, and it is not necessarily expected that all of the described advantages will be achieved with every embodiment. In the event of any inconsistent disclosure or definition from the present application conflicting with any document incorporated by reference, the disclosure or definition herein shall be deemed to prevail. | 66,567 |
11862333 | DETAILED DESCRIPTION OF THE EMBODIMENTS An illustrative patient support apparatus20usable in a caregiver assistance system according to the present disclosure is shown inFIG.1. Although the particular form of patient support apparatus20illustrated inFIG.1is a bed adapted for use in a hospital or other medical setting, it will be understood that patient support apparatus20could, in different embodiments, be a cot, a stretcher, a recliner, or any other structure capable of supporting a patient while the patient is in a healthcare facility, such as, but not limited to, a hospital. For purposes of the following written description, patient support apparatus20will be primarily described as a bed with the understanding that the following written description applies to these other types of patient support apparatuses. In general, patient support apparatus20includes a base22having a plurality of wheels24, a lift subsystem comprising a pair of lifts26supported on the base, a litter frame28supported on the lifts26, and a support deck30supported on the litter frame28. Patient support apparatus20further includes a headboard32, a footboard34, and a plurality of siderails36. Siderails36are all shown in a raised position inFIG.1but are each individually movable to a lower position in which ingress into, and egress out of, patient support apparatus20is not obstructed by the lowered siderails36. In some embodiments, siderails36may be moved to one or more intermediate positions as well. Lifts26are configured to raise and lower litter frame28with respect to base22. Lifts26may be hydraulic actuators, electric actuators, or any other suitable device for raising and lowering litter frame28with respect to base22. In the illustrated embodiment, lifts26are operable independently so that the tilting of litter frame28with respect to base22can also be adjusted. That is, litter frame28includes a head end and a foot end, each of whose height can be independently adjusted by the nearest lift26. Patient support apparatus20is designed so that when an occupant lies thereon, his or her head will be positioned adjacent the head end and his or her feet will be positioned adjacent the foot end. Litter frame28provides a structure for supporting support deck30, the headboard32, footboard34, and siderails36. Support deck30provides a support surface for a mattress38, or other soft cushion, so that a person may lie and/or sit thereon. Support deck30is made of a plurality of sections, some of which are pivotable about generally horizontal pivot axes. In the embodiment shown inFIG.1, support deck30includes a head section40, which is also sometimes referred to as a Fowler section or a backrest section. Head section40is pivotable about a generally horizontal pivot axis between a generally horizontal orientation (not shown inFIG.1) and a plurality of raised positions (one of which is shown inFIG.1). Support deck30may include additional sections that are pivotable about one or more horizontal pivot axes, such as an upper leg or thigh section and/or a lower leg or foot section (not labeled). Patient support apparatus20further includes a plurality of control panels42that enable a user of patient support apparatus20, such as a patient and/or an associated caregiver, to control one or more aspects of patient support apparatus20. In the embodiment shown inFIG.1, patient support apparatus20includes a footboard control panel42a, a pair of inner siderail control panels42b(only one of which is visible), and a pair of outer siderail control panels42c(only one of which is visible). Footboard control panel42aand outer siderail control panels42care intended to be used by caregivers, or other authorized personnel, while inner siderail control panels42bare intended to be used by the patient associated with patient support apparatus20. Not all of the control panels42include the same controls and/or functionality. In the illustrated embodiment, footboard control panel42aincludes a substantially complete set of controls for controlling patient support apparatus20while control panels42band42cinclude a selected subset of those controls. One or more of any of control panels42a, b, and/or c may include a height adjustment control that, when activated, changes a height of litter frame28relative to base22. Control panels42aand/or42cmay include controls for allowing a user to do one or more of the following: activate and deactivate a brake for wheels24, arm an exit detection system46, take a weight reading of the patient, activate and deactivate a propulsion system, and communicate with a healthcare facility computer network installed in the healthcare facility in which patient support apparatus20is positioned. Inner siderail control panels42bmay also include a nurse call control that enables a patient to call a nurse. A speaker and microphone are included on, or adjacent to, inner siderail control panel42bin order to allow the patient to aurally communicate with the remotely positioned nurse. Footboard control panel42ais implemented in the embodiment shown inFIG.1as a touchscreen display70having a plurality of controls72positioned alongside the touchscreen display70. Controls72may be implemented as buttons, dials, switches, or other devices. Either or both of control panels42bor42cmay also include a display for displaying information regarding patient support apparatus20, and such a display may be a touchscreen in some embodiments. Alternatively, any one or more of control panels42a-cmay omit a touchscreen display and instead include only dedicated controls72, or some other form of non-display controls. The mechanical construction of those aspects of patient support apparatus20not explicitly described herein may be the same as, or nearly the same as, the mechanical construction of the Model FL27 InTouch Critical Care bed manufactured and sold by Stryker Corporation of Kalamazoo, Michigan. This mechanical construction is described in greater detail in the Stryker Maintenance Manual for the Model FL27 InTouch Critical Care Bed (Version 2.4; 2131-409-002 REV B), published by Stryker Corporation of Kalamazoo, Michigan, the complete disclosure of which is incorporated herein by reference. It will be understood by those skilled in the art that those aspects of patient support apparatus20not explicitly described herein can alternatively be designed with other types of mechanical constructions, such as, but not limited to, those described in commonly assigned, U.S. Pat. No. 7,690,059 issued to Lemire et al., and entitled HOSPITAL BED; and/or commonly assigned U.S. Pat. publication No. 2007/0163045 filed by Becker et al. and entitled PATIENT HANDLING DEVICE INCLUDING LOCAL STATUS INDICATION, ONE-TOUCH FOWLER ANGLE ADJUSTMENT, AND POWER-ON ALARM CONFIGURATION, the complete disclosures of both of which are also hereby incorporated herein by reference. The mechanical construction of those aspects of patient support apparatus20not explicitly described herein may also take on forms different from what is disclosed in the aforementioned references. FIG.2illustrates a first embodiment of a caregiver assistance system106according to the present disclosure. Caregiver assistance system106includes patient support apparatus20in communication with a caregiver assistance server90, and one or more electronic devices104that are adapted to communicate with caregiver assistance server90. Caregiver assistance system106may also include a conventional patient support apparatus server86that is separate from caregiver assistance server90, or the functionality of caregiver assistance server90may be modified to include the functionality of patient support apparatus server86, thereby allowing patient support apparatus server86to be omitted. As will be discussed in greater detail below with respect toFIG.4, caregiver assistance system106communicates with a plurality of conventional servers on a local area network74of the healthcare facility and uses those communications to obtain some of the information it needs to perform its caregiver assistance functions. FIG.2illustrates in greater detail some of the internal components of patient support apparatus20. As shown therein, patient support apparatus20includes a controller48, a memory50, a first lift actuator52a, a second lift actuator52b, a brake sensor54, an scale/exit detection system46, an Alternating Current (A/C) power input56, an A/C power sensor58, one or more control panels42, an off-board network transceiver60, a nurse call cable interface62, and a location transceiver64. Additionally, patient support apparatus20includes a first lift sensor66a, a second lift sensor66b, a cable sensor68, display70, and one or more controls72incorporated into one or more of the control panels42. It will be understood by those skilled in the art that patient support apparatus20may be modified to include additional components not shown inFIG.2, as well modified to include fewer components from what is shown inFIG.2. Controller48(FIG.2) is constructed of any electrical component, or group of electrical components, that are capable of carrying out the functions described herein. In many embodiments, controller48is a conventional microcontroller, or group of conventional microcontrollers, although not all such embodiments need include a microcontroller. In general, controller48includes any one or more microprocessors, field programmable gate arrays, systems on a chip, volatile or nonvolatile memory, discrete circuitry, and/or other hardware, software, or firmware that is capable of carrying out the functions described herein, as would be known to one of ordinary skill in the art. Such components can be physically configured in any suitable manner, such as by mounting them to one or more circuit boards, or arranging them in other manners, whether combined into a single unit or distributed across multiple units as part of an embedded network. When implemented to include an embedded network, the embedded network may include multiple nodes that communicate using one or more of the following: a Controller Area Network (CAN); a Local Interconnect Network (LIN); an I-squared-C serial communications bus; a serial peripheral interface (SPI) communications bus; any of RS-232, RS-422, and/or RS-485 communication interfaces; a LonWorks network, and/or an Ethernet. The instructions followed by controller48in carrying out the functions described herein, as well as the data necessary for carrying out these functions, are stored in memory50, and/or in one or more other memories accessible to the one or more microprocessors, microcontrollers, or other programmable components of controller48. Memory50also includes a unique ID that uniquely identifies the particular patient support apparatus into which it is incorporated, such as, but not limited to, a serial number. When controller48is implemented to communicate using an on-board Ethernet, the on-board Ethernet may be designed in accordance with any of the Ethernet-carrying patient support apparatuses disclosed in commonly assigned U.S. patent application Ser. No. 14/622,221 filed Feb. 13, 2015, by inventors Krishna Bhimavarapu et al. and entitled COMMUNICATION METHODS FOR PATIENT HANDLING DEVICES, the complete disclosure of which is incorporated herein by reference. In some embodiments, controller48may be implemented to include multiple nodes that communicate with each other utilizing different communication protocols. In such embodiments, controller48may be implemented in accordance with any of the embodiments disclosed in commonly assigned U.S. patent application Ser. No. 15/903,477 filed Feb. 23, 2018, by inventors Krishna Bhimavarapu et al. and entitled PATIENT CARE DEVICES WITH ON-BOARD NETWORK COMMUNICATION, the complete disclosure of which is incorporated herein by reference. First and second lift actuators52aand52b(FIG.2) are components of lifts26and are configured to raise and lower litter frame28with respect to base22. A first one of lift actuators52apowers a first one of the lifts26positioned adjacent a head end of patient support apparatus20and a second one of lift actuators52bpowers a second one of the lifts26positioned adjacent a foot end of patient support apparatus20. Lift actuators52aand52bmay be conventional linear actuators having electric motors therein that, when driven, expand or contract the length of the linear actuator, thereby moving the litter frame upward or downward and changing its height H (FIG.1) relative to the floor. Each lift actuator52aand52bincludes a corresponding lift sensor66aand66b, respectively. Each of the sensors66a,66bdetects a position and/or angle of its associated actuator52a,52band feeds the sensed position/angle to controller48. Controller48uses the outputs from sensors66as inputs into a closed-loop feedback system for controlling the motion of the actuators52a,52band the litter deck. Controller48also uses the outputs from sensors66a,66bto determine the height H of litter frame28above the floor. In some embodiments, actuators52are constructed in any of the same manners as the actuators34disclosed in commonly assigned U.S. patent application Ser. No. 15/449,277 filed Mar. 3, 2017, by inventors Anish Paul et al. and entitled PATIENT SUPPORT APPARATUS WITH ACTUATOR FEEDBACK, the complete disclosure of which is incorporated herein by reference. In such embodiments, sensors66aand66bmay be constructed to include any of the encoders and/or switch sensors disclosed in the aforementioned '277 application. Scale/exit detection system46is configured to determine a weight of a patient positioned on support deck30and/or when the patient is moving and is likely to exit patient support apparatus20. The particular structural details of the exit detection system can vary widely. In some embodiments, scale/exit detection system46includes a plurality of load cells arranged to detect the weight exerted on litter frame28. By summing the outputs from each of the load cells, the total weight of the patient is determined (after subtracting the tare weight). Further, by using the known position of each of the load cells, controller48determines a center of gravity of the patient and monitors the center of gravity for movement beyond one or more thresholds. One method of computing the patient's center of gravity from the output of such load cells is described in more detail in commonly assigned U.S. Pat. No. 5,276,432 issued to Travis and entitled PATIENT EXIT DETECTION MECHANISM FOR HOSPITAL BED, the complete disclosure of which is incorporated herein by reference. Other methods for determining a patient's weight and/or the weight of non-patient objects supported on litter frame28are disclosed in commonly assigned U.S. patent application Ser. No. 14/776,842, filed Sep. 15, 2015, by inventors Michael Hayes et al. and entitled PATIENT SUPPORT APPARATUS WITH PATIENT INFORMATION SENSORS, and commonly assigned U.S. patent application Ser. No. 14/873,734 filed Oct. 2, 2015, by inventors Marko Kostic et al. and entitled PATIENT SUPPORT APPARATUSES WITH MOTION MONITORING, the complete disclosures of both of which are incorporated herein by reference. Other systems for determining a patient's weight and/or detecting a patient's exit from patient support apparatus may alternatively be used. Controller48communicates with network transceiver60(FIG.2) which, in at least one embodiment, is a Wi-Fi radio communication module configured to wirelessly communicate with wireless access points76of local area network74. In such embodiments, network transceiver60may operate in accordance with any of the various IEEE 802.11 standards (e.g. 802.11b, 802.11n, 802.11g, 802.11ac, 802.11ah, etc.). In other embodiments, network transceiver60may include, either additionally or in lieu of the Wi-Fi radio and communication module, a wired port for connecting a network wire to patient support apparatus20. In some such embodiments, the wired port accepts a category 5e cable (Cat-5e), a category 6 or 6a (Cat-6 or Cat-6a), a category 7 (Cat-7) cable, or some similar network cable, and transceiver60is an Ethernet transceiver. In still other embodiments, network transceiver60may be constructed to include the functionality of the communication modules56disclosed in commonly assigned U.S. patent application Ser. No. 15/831,466 filed Dec. 5, 2017, by inventor Michael Hayes et al. and entitled NETWORK COMMUNICATION FOR PATIENT SUPPORT APPARATUSES, the complete disclosure of which is incorporated herein by reference. Regardless of the specific structure included with network transceiver60, controller48is able to communicate with the local area network74(FIG.2) of a healthcare facility in which the patient support apparatus is positioned. When network transceiver60is a wireless transceiver, it communicates with local area network74via one or more wireless access points76. When network transceiver60is a wired transceiver, it communicates directly via a cable coupled between patient support apparatus20and a network outlet positioned within the room of the healthcare facility in which patient support apparatus20is positioned. As will be discussed in greater detail below with respect toFIG.4, local area network74includes a plurality of servers that are utilized in different manners by the caregiver assistance system disclosed herein, and patient support apparatus20communicates with one or more of those servers via transceiver60as part of the caregiver assistance system. Nurse call cable interface62is an interface adapted to couple to one end of a nurse call cable78(FIG.4). The other end of the nurse call cable78couples to a nurse call outlet82(FIG.4) that is typically built into each headwall of each of the patient rooms within a healthcare facility. In many embodiments, nurse call outlet82is a 37 pin outlet that cable78couples to, thereby enabling patient support apparatus20to communicate directly with a conventional nurse call system80. In some embodiments, nurse call interface62is constructed in accordance with any of the cable interfaces92disclosed in commonly assigned U.S. patent application Ser. No. 15/945,437 filed Apr. 4, 2018, by inventors Krishna Bhimavarapu et al. and entitled PATIENT SUPPORT APPARATUSES WITH RECONFIGURABLE COMMUNICATION, the complete disclosure of which is incorporated herein by reference. In other embodiments, nurse call cable interface62may be replaced with a wireless nurse call communication system that wirelessly communicates with nurse call outlet82. For example, in some embodiments, nurse call cable interface62is replaced with a radio module, such as the radio module60disclosed in commonly assigned U.S. patent application Ser. No. 14/819,844 filed Aug. 6, 2015, by inventors Krishna Bhimavarapu et al. and entitled PATIENT SUPPORT APPARATUSES WITH WIRELESS HEADWALL COMMUNICATION, the complete disclosure of which is incorporated herein by reference. In such wireless headwall embodiments, a headwall module, such as headwall module38disclosed in the aforementioned '844 application, is included and coupled to nurse call outlet82. Still other types of wireless communication between the patient support apparatus and nurse call outlet82may be implemented. Location transceiver64(FIG.2) is adapted to detect a wireless signal emitted from a nearby location beacon84(FIG.4) that is positioned at a fixed and known location within the healthcare facility. AlthoughFIG.4only illustrates a single one of these location beacons84, it will be understood that a particular healthcare facility includes many of these location beacons84mounted throughout the healthcare facility. Each location beacon84broadcasts a wireless, short range signal that contains a unique identifier. The short range signal, in some embodiments, is broadcast via an infrared transmitter and is only detectable by receivers (e.g. location transceivers64) that are positioned within several feet of the location beacon84. Consequently, location transceivers64, which are adapted to detect the signals transmitted from location beacons84, are only able to detect these signals when patient support apparatuses20are positioned adjacent (e.g. within several feet) of one of these location beacons84. If/when location transceiver64is able to detect the unique signal from a particular location beacon84, the corresponding patient support apparatus20can therefore be concluded to be currently positioned adjacent that particular location beacon84. This allows the current location of the patient support apparatus20to be identified. In some healthcare facilities, one or more of the patient rooms may not be completely private rooms, but instead may be shared with one or more other patients. In such situations, it is typical to mount two or more location beacons84within such a room—one on the headwall at the bay where the first patient support apparatus20normally resides and the other on the headwall at the bay where the second patient support apparatus20normally resides (and still more if the room is shared by more than two patients). When location transceiver64receives a signal from an adjacent location beacon84, controller48forwards the received signal, including the unique ID of the beacon84, to a patient support apparatus server86(FIG.2) which is sometimes alternately referred to herein as a bed server86. Patient support apparatus server86includes a location table88(FIG.4), or has access to such a table88, that correlates beacon IDs to locations within the healthcare facility. Patient support apparatus server86is thereby able to determine the location of each patient support apparatus20within the healthcare facility (at least all of those that are positioned adjacent a location beacon84). In some embodiments, location beacons84(FIG.2) function both as locators and as wireless links to the nurse call outlet82integrated into the adjacent headwall. When equipped with this dual function, patient support apparatuses20may omit the nurse call cable interface62, yet still be able to communicate with the nurse call system server62b. In the illustrated embodiment ofFIG.4, however, patient support apparatus20includes a nurse call cable78that communicatively couples the patient support apparatus20to nurse call outlet82, thereby enabling the patient support apparatus20to communicate directly with the nurse call system80. Further details about the function of location beacons84, whether operating solely as locators or both as locators and wireless portals to the nurse call system outlets82, may be found in any of the following commonly assigned U.S. patent references: U.S. Pat. No. 8,102,254 issued Jan. 24, 2012 to Becker et al. and entitled LOCATION DETECTION SYSTEM FOR A PATIENT HANDLING DEVICE; patent application Ser. No. 14/819,844 filed Aug. 6, 2015, by inventors Krishna Bhimavarapu et al. and entitled PATIENT SUPPORT APPARATUSES WITH WIRELESS HEADWALL COMMUNICATION; patent application Ser. No. 62/600,000 filed Dec. 18, 2017, by inventor Alex Bodurka, and entitled SMART HOSPITAL HEADWALL SYSTEM; and patent application Ser. No. 62/598,787 filed Dec. 14, 2017, by inventors Alex Bodurka et al. and entitled HOSPITAL HEADWALL COMMUNICATION SYSTEM, the complete disclosures of all of which are incorporated herein by reference. Controller48of patient support apparatus20(FIG.2) communicates with A/C power sensor58, which informs controller48whether or not an A/C power cable102(FIG.4) is coupled between patient support apparatus20and a conventional A/C power outlet44. In other words, A/C power sensor58lets controller48know whether patient support apparatus20is receiving electrical power from an off-board power supply (e.g. power outlet44). In some cases, patient support apparatus20includes one or more batteries that are able to power patient support apparatus20, including controller48, when patient support apparatus20is not coupled to a source of electrical power. As will be discussed more below, the status of the A/C power cord102(e.g. whether patient support apparatus20is operating on battery power or on power from an A/C outlet) is communicated from A/C power sensor58to controller48, which then forwards that status via network transceiver60to patient support apparatus server86and/or to caregiver assistance server90. Controller48also communicates with brake sensor54(FIG.2). Brake sensor54informs controller48whether or not a brake has been applied on patient support apparatus20. When the brake is applied, one or more of wheels24are braked to resist rotation. When the brake is not applied, wheels24are free to rotate. As with the data from the A/C power cord58, the data from the brake sensor54is forwarded by controller48to patient support apparatus server86and/or to caregiver assistance server90, via network transceiver60. Caregiver assistance server90shares this information with caregivers via one or more electronic devices that are in communication with server90, as will be discussed in greater detail below. Each of the control panels42includes one or more controls72that are used to control various functions of the patient support apparatus20(FIG.2). For example, one or more of the control panels42includes a motion control72for controlling movement of the lift actuators52aand52b. Additional controls72may be provided for activating and deactivating the brake for wheels24, arming and disarming exit detection function of scale/exit detection system46, taking a weight reading of the patient using the scale function of scale/exit detection system46, activating and deactivating a propulsion system (if included), and communicating with one or more servers on local area network74. It will be understood that in some embodiments, one or more of controls72may be integrated into a touchscreen display, such as display70. In such embodiments, one or more of the controls may only appear when the user navigates to specific screens displayed on the touchscreen. Patient support apparatus20communicates with the caregiver assistance server90of local area network74(FIG.2). Caregiver assistance server90is adapted to assist the caregivers in performing a plurality of tasks. In general, caregiver assistance server90includes software that, when executed, assists the caregivers in ensuring that the patient support apparatuses20are maintained in a desirable state, assists the caregiver in performing their rounding tasks, assists the caregivers in performing fall and/or skin assessments, assists the caregivers with setting reminders and receiving notifications of the reminders, as well as assists the caregivers with receiving alerts and/or status information about the patients under their care while the caregivers go about their duties. FIG.3illustrates in greater detail some of the specific functionality and components of caregiver assistance server90. Caregiver assistance server90is adapted to execute a caregiver assistance application124that performs a plurality of algorithms and that utilizes a plurality of components. The algorithms includes a caregiver rounding algorithm140, a patient skin assessment algorithm141, a patient fall risk assessment algorithm143, a reminder algorithm145, a status/command algorithm147, and an alerting algorithm149. Caregiver rounding algorithm140assists a caregiver in performing his or her rounding duties, as well as assisting the caregiver to ensure that patient support apparatuses20are properly configured in accordance with the policies of the particular healthcare facility that employs the caregivers and operates the patient support apparatuses20. In general, caregiver rounding algorithm140allows a caregiver to document his or her individual rounding actions while simultaneously reminding the caregiver of any actions that need to be taken to configure the patient support apparatus20properly. Such patient support apparatus configurations include, but are not limited to, setting a brake, moving the litter frame to its lowest height (or within a specified range of its lowest height), positioning the siderails in a correct position, arming the exit detection system, plugging in the nurse call cable, and/or plugging in the A/C power cable. Patient skin assessment algorithm141assists the caregiver when assessing a particular patient's risk of developing bed sores. Fall risk assessment algorithm143assists the caregiver when assessing the fall risk of a particular patient. Reminder algorithm145assists the caregiver by keeping track of any or all tasks that the caregiver is to complete that have time deadlines, including issuing reminders to the caregiver of when those tasks are due and/or are approaching their deadlines. Status/command algorithm147functions to provide the caregivers with up-to-date information of the status of each of the patient support apparatuses20having a patient to which that caregiver is assigned, as well as to allow the caregiver to remotely control one or more aspects of those patient support apparatuses20. Alerting algorithm149provides alerts to caregivers when a status of a patient support apparatus20is changed to an out-of-compliance state, when a reminder deadline approaches or is reach, and/or whenever any information from any of the other algorithms140,141,143,145, and/or147yields information to which the caregivers should be alerted. Further details of one embodiment of a patient skin assessment algorithm141(FIG.3) that may be utilized with the system106of the present disclosure are found in commonly assigned U.S. provisional patent application Ser. No. 62/826,195 filed Mar. 29, 2019, by inventors Thomas Durlach et al. and entitled SYSTEM FOR MANAGING PATIENT SUPPORT APPARATUSES AND BED SORE RISKS, the complete disclosure of which is incorporated herein by reference. Further details of one embodiment of a patient fall risk assessment algorithm143that may be utilized with the system106of the present disclosure are found in commonly assigned U.S. provisional patent application Ser. No. 62/826,187 filed Mar. 29, 2019, by inventors Thomas Durlach et al. and entitled SYSTEM FOR MANAGING PATIENT SUPPORT APPARATUSES AND PATIENT FALL RISKS, the complete disclosure of which is incorporated herein by reference. Still other skin assessment algorithms and/or fall risk assessment algorithms may be executed by caregiver assistance application124without departing from the spirit of the present disclosure. Further details about a suitable reminder algorithm145, status/command algorithm147, and an alerting algorithm149are provided below. The different components of caregiver assistance application124include a set of local rules126, a data repository128, a communication interface130, and a web Application Programming Interface132(FIG.3). The set of local rules126is initially defined prior to the installation of caregiver assistance application124within a particular healthcare facility, in at least some embodiments. In other embodiments, the set of local rules126is defined during or after installation of caregiver assistance application124. In all embodiments discussed herein, however, local rules126are modifiable by authorized personnel from the healthcare facility. Such modifications are made by way of one or more computers134that are in communication with local area network74(FIG.4). An authorized individual136(FIG.4) utilizes computer134to communicate with caregiver assistance application124and add, delete, or modify one or more of the local rules126. Local rules126(FIG.3) include, but are not limited to, the following: rules indicating how frequently caregivers are to perform their rounding duties (e.g. once every two hours, once every three hours, etc.); rules indicating what state patient support apparatuses20are to be placed in (compliance rules); rules specifying who is to be notified, and when, if a rounding duty is not performed within the desired time period; rules specifying who is to be notified, and when, if a patient support apparatuses is not placed in the desired state and/or is moved out of the desired state; rules specifying how such notifications are to be communicated (e.g. email, phone call, texts, etc.); rules specifying what personnel within the healthcare facility are authorized to view what data using caregiver assistance application124; and rules specifying if and/or how rounding duties are to be verified and/or documented in the EMR server98. Both the rules for caregiver assistance frequency and the desired states of the patient support apparatuses20may be configured by authorized individuals136to vary based upon one or more factors. For example, both the caregiver assistance frequency and desired states of patient support apparatuses may vary for different wings of the healthcare facility, different units of the healthcare facility, different times of day and/or different shifts, different models of patient support apparatuses, different patient health conditions, different patient treatments, different data stored in the EMR server98, etc. Local rules126(FIG.3) also include additional administrative data that is stored on caregiver assistance server90, or stored in a memory otherwise accessible to caregiver assistance application124. Such administrative data includes, but is not limited to, the IP address, or other network address, of each of the servers with which caregiver assistance application124is to communicate (e.g. EMR server98, ADT server94, patient support apparatus server86, RTLS server100, and nurse call server96), and/or the IP addresses or other configuration data necessary for caregiver assistance application124to communicate with one or more middleware software applications that act as gateways to one or more of these servers. The administrative data also may also include the email addresses, passwords, phone numbers, user names, access levels, and other information about those hospital personnel who have been authorized to use caregiver assistance application124. The email address and/or phone numbers are used in some embodiments of the alerting algorithm149in order for caregiver assistance application124to make contact with mobile electronic devices104a(FIG.4) carried by the caregivers when there is an alert, or other information to which the caregiver's attention is desirably directed. Data repository128(FIG.3) stores data that is received by caregiver assistance application124during the course of its operation. This data includes patient support apparatus status data sent from patient support apparatuses20(via patient support apparatus server86in some embodiments, and directly in other embodiments), alert data (e.g. when alerts occurred, causes, remedies, notifications, etc.), rounding completion/incompletion data, verification data verifying caregiver assistance (discussed more below), patient data from skin and fall assessment algorithms141and143, and other data. Communication interface130(FIG.3) controls the communications between caregiver assistance application124and the electronic devices104with which it is in communication. Communication interface130also controls the communications between caregiver assistance application124and the servers with which it is in communication. All of these communications, in at least one embodiments, are carried out using conventional Internet packet routing. That is, patient support apparatuses20send data in packets that have an IP addresses corresponding to patient support apparatus server86and/or caregiver assistance server90, and servers86and/or90send message packets back to patient support apparatuses20that include an IP address corresponding to the particular patient support apparatus(es)20to which the messages are intended. In some embodiments, each patient support apparatus20includes a static IP address that is stored on the patient support apparatus20, while in other embodiments, the patient support apparatuses20consult a local Dynamic Host Configuration Protocol (DHCP) server (not shown) on local area network74and the DHCP server assigns a network address to the patient support apparatus. Web API132(FIG.3) provides a portal for authorized software applications and/or servers to access the data of caregiver assistance application124. In some embodiments, electronic devices104communicate with caregiver assistance application124via the web API132. In other embodiments, electronic devices104utilize a web browser built therein that access one or more Uniform Resource Locators (URLs) that direct the web browser to caregiver assistance application124. In still other embodiments, web API132may be utilized for carrying out additional communications with any of the servers on network74and/or for communicating with other software applications that are unrelated to caregiver assistance application124. In general, caregiver rounding algorithm140, status/command algorithm147, and alerting algorithm149of caregiver assistance application124performs the following functions: gather data from patient support apparatuses20about their current states; communicate the patient support apparatus data to electronic devices104that are remote from caregiver assistance server90; cause the electronic devices104to display the patient support apparatus status data thereon; cause the electronic devices104to display reminders and/or other information on their displays to assist caregivers in performing their rounding duties; receive rounding data that is input into electronic devices104by caregivers during or after the performance of their rounding duties; communicate alerts to the caregivers if the patient support apparatus status data indicates the patient support apparatus20is not in a desired state; forward patient support apparatus commands received from caregivers (via electronic devices104) to patient support apparatuses20; receive verification data from electronic devices104and/or patient support apparatuses20verifying the caregivers' presence adjacent the patient support apparatus20when performing the rounding tasks; and document to an Electronic Medical Record server98(FIG.4) the successful completion of the rounding tasks, as well as the current state of the patient support apparatus status data at the time of completion of the rounding task. It will be understood that, in some embodiments, caregiver assistance application124may be modified such that one or more of these functions are modified, supplemented, and/or omitted. Patient support apparatus20is shown inFIG.2positioned in a room92of a representative example of a healthcare facility.FIG.2also depicts patient support apparatus20in communication with local area network74of the healthcare facility. It will be understood that the precise structure and contents of the local area network74will vary from healthcare facility to healthcare facility.FIG.4illustrates in greater detail the contents of a common hospital's local area network74, along with caregiver assistance server90and other components of caregiver assistance system106. As shown inFIG.4, local area network74includes a plurality of servers, including a conventional Admission, Discharge, and Tracking (ADT) server94, a conventional nurse call system server96, a conventional Electronic Medical Records server98, a conventional real time location system (RTLS) server100, and a plurality of conventional wireless access points76. Local area network74also includes caregiver assistance server90that, together with one or more patient support apparatuses20and one or more electronic devices (e.g. mobile electronic devices104aor stationary electronic devices104b) implement one embodiment of the caregiver assistance system106according to the present disclosure. Still further, network74includes a conventional Internet gateway108that couples local area network74to the Internet110, thereby enabling the servers and/or patient support apparatuses20to communicate with computers outside of the healthcare facility, such as, but not limited to, a geographically remote server112. In some embodiments, all or some of the functions of caregiver assistance server90are carried out by geographically remote server112, while in other embodiments caregiver assistance server90is configured to implement all of its functions without accessing geographically remote server112. ADT server94stores patient information, including the identity of patients and the corresponding rooms92and/or bays within rooms to which the patients are assigned. That is, ADT server94includes a patient-room assignment table114, or functional equivalent to such a table. The patient-room assignment table correlates rooms, as well as bays within multi-patient rooms, to the names of individual patients within the healthcare facility. The patient's names are entered into the ADT server94by one or more healthcare facility staff whenever a patient checks into the healthcare facility and the patient is assigned to a particular room within the healthcare facility. If and/or when a patient is transferred to a different room and/or discharged from the healthcare facility, the staff of the healthcare facility update ADT server94. ADT server therefore maintains an up-to-date table114that correlates patient names with their assigned rooms. EMR server98(FIG.4) stores individual patient records. Such patient records identify a patient by name and the medical information associated with that patient. Such medical information may include all of the medical information generated from the patient's current stay in the healthcare facility as well as medical information from previous visits. EMR table116shows an abbreviated example of two types of medical information entries that are commonly found within a patient's medical records: a fall risk entry indicating whether the patient is a fall risk, and a bed sore risk entry indicating whether the patient is at risk for developing bed sores. AlthoughFIG.4shows the data for these entries to be expressed as text, it will be understood that this data may be stored within a medical record in numeric format. For example, the fall risk data may be stored as a numeric value generated from a conventional fall risk assessment tool, such as, but not limited to, the Morse fall risk scale or the Hester-Davis fall risk scale. Similarly, the bed sore data may be stored as a numeric value generated from a conventional bed sore risk assessment tool, such as, but not limited to, the Braden scale. As noted, EMR server98includes far more additional information in the medical records of each patient than what is shown in table116ofFIG.4, and some of that additional data, such as rounding data, is discussed in more detail below. It will be understood that the term “EMR server,” as used herein, also includes Electronic Health Records servers, or EHR servers for short, and that the present disclosure does not distinguish between electronic medical records and electronic health records. RTLS server100(FIG.4) is a conventional server that may be present within a given healthcare facility. When present, RTLS server100keeps track of the current location of people and equipment within the healthcare facility. In many instances, the RTLS server keeps track of the current location of one or more tags120(FIG.4) that are worn by personnel and/or that are attached to equipment. Such tags120may be RF ID tags, or other types of tags. RTLS table118provides an example of the type of location data that RTLS server100may contain with respect to caregivers. As shown therein, table118shows the current location of two caregivers, one by room number (e.g. room 400) and another by general location (e.g. “hallway”). Other types of location data may be included. Further, as noted, some healthcare facilities may not include such an RTLS server100and caregiver assistance system106is able to fully function without such a server. Nurse call server96is shown inFIG.4to include a caregiver assignment table122that matches caregivers to specific rooms and/or bays within the healthcare facility. Although table122only shows caregivers assigned to a single room, it will be understood that each caregiver is typically assigned to multiple rooms. In some nurse call systems80, caregivers are assigned to specific patients, rather than to specific rooms. Caregiver assistance system106is configured to work with both types of nurse call systems80. Caregiver assistance system106is also adapted to work with healthcare facilities that utilize a separate caregiver assignment server (not shown), rather than nurse call server96, to assign caregivers to rooms and/or patients. Regardless of whether caregiver assignment table122is stored within nurse call server96or some other server on network74, nurse call system server96is configured to communicate with caregivers and patients. That is, whenever a patient on a patient support apparatus20presses, or otherwise activates, a nurse call, the nurse call signals pass through nurse call cable78to nurse call outlet82. Nurse call outlet82is coupled via wire to nurse call server96and/or to another structure of nurse call system80that then routes the call to the appropriate nurse. The nurse is thereby able to communicate with the patient from a remote location. In some nurse call systems80, nurse call server96is also able to forward alerts and/or other communications to portable wireless devices carried by caregivers and/or to audio stations positioned within patient rooms92. Such portable wireless devices are the same as mobile electronic devices104adiscussed herein, in at least one embodiment. Local area network74may include additional structures not shown inFIG.4, such as, but not limited to, one or more conventional work flow servers and/or charting servers that monitor and/or schedule patient-related tasks for particular caregivers, and/or one or more conventional communication servers that forward communications to particular individuals within the healthcare facility, such as via one or more portable devices (smart phones, pagers, beepers, laptops, etc.). The forwarded communications may include data and/or alerts that originate from patient support apparatuses20as well as data and/or alerts that originate from caregiver assistance server90. Wireless access points76are configured, in at least some embodiments, to operate in accordance with any one or more of the IEEE 802.11 standards (e.g. 802.11g, 802.11n, 802.11ah, etc.). As such, patient support apparatuses20and electronic devices104a,104bthat are equipped with Wi-Fi capabilities, and that have the proper authorization credentials (e.g. password, SSID, etc.), can access local area network74and the servers hosted thereon. This allows patient support apparatus20to send messages to, and receive messages from, patient support apparatus server86and/or caregiver assistance server90. This also allows electronic devices104to send messages to, and receive messages from, patient support apparatus server86and/or caregiver assistance server90. As noted previously, alternatively, or additionally, patient support apparatuses20may include a wired port for coupling a wired cable (e.g. a Category 5, Category 5e, etc.) between the patient support apparatus20and one or more routers/gateways/switches, etc. of network74, thereby allowing patient support apparatuses20to communicate via wired communications with servers86and/or90. In still other embodiments, one or more of the patient support apparatuses20are equipped with alternative wireless transceivers enabling them to communicate directly with patient support apparatus server86and/or caregiver assistance server90via an antenna and transceiver that is directly coupled to servers86and/or90and that is separate from LAN74, thereby allowing patient support apparatuses20to bypass LAN74in their communications with servers86and/or90. One example of patient support apparatuses equipped to communicate directly with a server on a healthcare facility's local area network without utilizing the LAN is disclosed in commonly assigned U.S. patent application Ser. No. 15/831,466 filed Dec. 5, 2017, by inventors Michael Hayes and entitled NETWORK COMMUNICATION FOR PATIENT SUPPORT APPARATUSES, the complete disclosure of which is incorporated herein by reference. In some embodiments, patient support apparatuses20include communication modules, such as the communication modules66disclosed in the aforementioned '466 application, and servers86and/or90are coupled directly to a receiver, such as the enterprise receiver90disclosed in the aforementioned '466 application. In such embodiments, patient support apparatuses20are able to both send and receive messages directly to and from servers86and/or90without utilizing access points76or any of the hardware of network74(other than servers86and/or90). Caregiver assistance server90constructs a table218(FIG.4) that correlates specific caregivers with the patient support apparatuses20assigned to them. As shown inFIG.4, table218correlates individual patient support apparatuses20and their current statuses to the specific caregivers who are assigned to those patient support apparatuses20. Although not shown inFIG.4, table218also may correlate caregivers and their patient support apparatuses20to specific rooms within the healthcare facility. In order to construct table218, caregiver assistance application124receives the unique patient support apparatus identifiers186, along with the current status of the patient support apparatuses20from patient support apparatus server86. Caregiver assistance application124determines which caregivers are associated with each of these patient support apparatuses20based on the caregiver-to-room assignment data it receives from nurse call server96(i.e. the data of table122) and the room-to-patient support apparatus data it receives from patient support apparatus server86(i.e. the data from table88). Caregiver assistance server90is therefore supplied with sufficient data to know the current status of each patient support apparatus20, the room in which each patient support apparatus20is assigned, the caregiver assigned to that room and/or patient support apparatus20, the patient assigned to each patient support apparatus20, and the fall risk and/or bed sore risk (if known) of each patient. Still further, in those embodiments where an RTLS server100is included, caregiver assistance server90is also supplied with sufficient data to know the current location of each caregiver. FIG.5illustrates a general algorithm226executed by caregiver assistance application124in at least one embodiment of the present disclosure. General algorithm226is carried out by the one or more processors of caregiver assistance server90when caregiver assistance server90is executing caregiver assistance application124. General algorithm226begins at an initial access step142where a user accesses caregiver assistance application124. Initial step142is illustrated inFIG.5as a box having dashed lines. The dashed lines are presented in order to indicate that step142is performed by a user, rather than caregiver assistance application124itself. The remaining steps of algorithm226are carried out by caregiver assistance application124. Initial step142is carried out by a user by manipulating one of the electronic devices104that are used in conjunction with caregiver assistance application124. Caregiver assistance system106includes one or more electronic devices104that communicate with caregiver assistance server90and its caregiver assistance application124. These electronic devices104utilize caregiver assistance application124to receive status data from patient support apparatuses20and to send and receive caregiver assistance data. In other words, caregiver assistance application124functions as an intermediary between the electronic devices104and the patient support apparatuses20, as well as an intermediary between the electronic devices104and other servers, such as EMR server98and/or the nurse call server96. Caregiver assistance application124also performs other functions, as described below. Electronic devices104come in a variety of different forms. As shown inFIG.4, some electronic devices104aare mobile electronic devices intended to be carried by a user (e.g. caregiver) while other electronic devices104bare stationary electronic devices that generally remain in one location. Mobile electronic devices104amay take on different forms, such as, but not limited to, smart phones, tables, laptop computers, Computers on Wheels (COWs), and others. Stationary electronic devices104bmay also take on different forms, such as, but not limited to, televisions, displays, Personal Computers (PCs), and others. For purposes of the following written description, caregiver assistance system106will be described with reference to electronic devices104that access caregiver assistance system106via a conventional web browser. It will be understood, however, that in other embodiments, electronic devices104may be modified to execute specialized software that is specifically tailored for use in carrying out the functions of caregiver assistance system106. In order for a caregiver associated with an electronic device104to access caregiver assistance system106, the caregiver utilizes the web-browsing application contained within the electronic device104to go to a particular web page, or other URL, associated with caregiver assistance application124. Any conventional web-browsing software may be used for this purpose, including, but not limited to, Microsoft's Bing or Internet Explorer web browsers, Google's Chrome web browser, Apple's Safari web browser, Mozilla's Firefox web browser, etc. The particular URL accessed with the web browser may vary for different healthcare facilities and can be customized by authorized IT personnel at the healthcare facility. In some embodiments, a domain name may be associated with caregiver assistance application124that is resolved by a local DNS server to the IP address of caregiver assistance server90(e.g. www.caregiver-assistance-app.com). In other embodiments, access to caregiver assistance system106may be achieved in other manners. Once at the initial web page corresponding to caregiver assistance application124, caregiver assistance application124instructs the web browser of the electronic device104to display a login screen on the display of the electronic device104.FIG.7illustrates an example of such a login screen144. Login screen144is shown inFIG.7as being displayed on a mobile electronic device (smart phone)104a. This is done merely for purposes of illustrating one specific type of electronic device104with which caregiver assistance system106may be utilized. Other types of devices104may be used andFIGS.8-17depict illustrative screens of caregiver assistance system106that do not show the specific type of electronic device104on which they are displayed, which is intended to re-emphasize the device agnostic nature of caregiver assistance system106. Login screen144includes a username field146in which a user is asked to input his or her username, as well as a password field148in which the user is asked to input his or her password. In order for the user to input this information, he or she utilizes the conventional input features of the electronic device104. Thus, for example, when the electronic device104includes a touch screen display and the user touches or otherwise selects either of the fields146,148, the electronic device104shows on its display, in some embodiments, an image of an alphanumeric keyboard that can be used by the user to input his or her username and password. After this information is typed into fields146,148, the user either presses the “enter” or “return” button, or touches the login icon150shown on login screen144. If electronic device104does not include a touch screen display, the user may enter the username and login information using a conventional keyboard, a mouse or other pointer, or other methods. Caregiver assistance application124receives the users username and password at step152of general algorithm226(FIG.5). That is, the entry of the user's username and password into electronic device104is communicated by the electronic device104to caregiver assistance server90. As was noted, this may be done in a conventional manner utilizing the WiFi, or other network communication, abilities of the electronic device104. Once caregiver assistance application124receives the username and password, it consults rules repository126to see if the username and password match an approved user. As mentioned previously, local rules repository contains information input into application124by an authorized representative of the healthcare facility in which caregiver assistance application124is installed. This information includes a list of those individuals who are authorized to use caregiver assistance application124, including their usernames and passwords (and other data, such as their authorization level, email address, phone number, etc.). If the users username and password match an authorized entry within local rules repository126, caregiver assistance application124proceeds to step154of algorithm226(FIG.5). At step154of algorithm140, caregiver assistance application124displays a main screen that allows a user to access the functionality of caregiver assistance application124. The content of the main screen may vary widely.FIG.8illustrates one example of such a main screen in the form of a room listing screen156. Room listing screen156includes a plurality of rows. Each row includes a room identifier158that identifies a particular room92within the healthcare facility in which caregiver assistance system106is installed. The particular selection of which rooms to list in room listing screen156corresponds, in the illustrated embodiment, to the particular person who has just logged into caregiver assistance application124. That is, each caregiver is assigned a level of administrative access to the data contained within caregiver assistance application124. This assignment is carried out by one or more of the authorized individuals136who initially set up caregiver assistance application124. In at least one embodiment, caregivers are assigned an access level that only permits them to view rooms that they themselves have been assigned. Caregiver managers may be granted a higher access level that permits them to view all of the rooms of all of the caregivers which they oversee. Administrators may be granted an even higher access that allows them to see all of the rooms in the entire healthcare facility. Still other types of access levels may be used and/or created, and the rules defining the access level architecture are stored within local rules repository126. Caregiver assistance application124automatically determines which rooms a particular caregiver has been assigned by communicating with a server on local area network74that maintains room assignments for caregivers. In the example illustrated inFIG.4, nurse call server96is shown to include a caregiver-room assignment table122that stores the room assignments for the caregivers within the healthcare facility. As noted previously, caregiver-room assignment table122may be stored on a different server. During installation of caregiver assistance application124, an authorized administrator inputs the IP address of the server containing caregiver room assignment table122(and/or other data necessary to gain access to caregiver-room assignment table122). Similar data is also input for all of the other servers and tables discussed herein. After a user successfully logins at step152of algorithm140, caregiver assistance application124sends a message to the server having caregiver room assignment table122. The message requests an up-to-date listing of the rooms that are assigned to the caregiver who has just logged in. After receiving this information, caregiver assistance application124displays those rooms on the display of the electronic device104(or, more precisely, causes the web browser to display those rooms on the display of the electronic device104). Thus, in the example ofFIG.8, caregiver assistance application124displays rooms 7090 through 7096, which correspond to the rooms assigned to the particular caregiver who is using caregiver assistance application124. In some healthcare facilities, caregivers may be assigned to specific patients instead of specific rooms. In such instances, caregiver assistance application124may be configured in at least two alternative manners. In a first manner, caregiver assistance application124continues to display a room listing, such as the room listing screen156ofFIG.8. In a second manner, caregiver assistance application124displays a patient listing screen that, instead of rows of the rooms the caregiver has been assigned, displays rows of each of the patients the caregiver has been assigned to. When configured in either manner, caregiver assistance application124determines the data to display by sending a request to the particular server(s) within the healthcare facility that maintain data sufficient to correlate specific caregivers to specific patients. In the particular embodiment illustrated inFIG.4, there is no server that correlates patients to caregivers. However, by utilizing patient-room assignment table114in conjunction with another server that stores caregiver to room assignments (e.g. table122), caregiver assistance application124is able to determine which particular patients are assigned to a particular caregivers, and which rooms92those particular patients are located in within the healthcare facility. For example, if caregiver assistance application124is configured to display room listing screen156(FIG.8) in a healthcare facility that assigns caregivers to specific patients, rather than to specific rooms, caregiver assistance application124sends a first request message and a second request message. The first request message is sent to whatever server maintains a table correlating caregivers and the particular patient they have been assigned to care for. The second request is sent to ADT server94and requests a listing of the specific rooms in which the caregiver's assigned patients are located. By using the data retrieved from these two requests, caregiver assistance application124is able to determine which particular patients the caregivers has been assigned, along with the rooms those patients have been assigned. Caregiver assistance application124is thereby able to display room listing screen156in a manner that is tailored to the particular caregiver who is using caregiver assistance application124. In those embodiments where caregiver assistance application124is configured to display rows of the patients assigned to a particular caregiver, rather than the patient room listing screen156, caregiver assistance application124need not send the first request message mentioned above. Instead, it can send a single request message to the particular server that stores the table (or other data structure) that correlates caregivers to particular patients. Caregiver assistance application124then displays on the display screen of the electronic device used by that particular caregiver the listing of those patients who are assigned to that particular caregiver. Still further, in some embodiments, a particular healthcare facility may assign rooms to particular caregivers but may desire to have room listing screen156replaced by a patient listing screen that identifies the particular patients assigned to a particular caregiver. Caregiver assistance application124may be configured to accommodate this desire. In order to do so, caregiver assistance application124sends a message to nurse call server96requesting the room assignments for a particular caregiver and also sends a message to ADT server94requesting the patient assignments to particular rooms. By using the data from both of these requests, caregiver assistance application124is able to determine which patients have been assigned to which caregivers, and is therefore able to display a patient listing screen instead of, or in addition to, room listing screen156. This is configurable by an authorized individual136and is stored in rule repository126. It should be noted that, although most electronic devices104are associated with a particular caregiver, this is not always the case, particularly for stationary electronic devices104b. Stationary electronic devices104b, which may include large screen smart televisions, may be associated with a particular unit of a healthcare facility, a particular nurse's station, wing, floor, and/or other section of the healthcare facility. For these devices, the login credentials may be tailored to the particular location and/or intended function of that particular electronic device104b. For example, a stationary electronic device104bmay be associated with an oncology unit, an east wing, nurse's station XYZ, the second floor, or rooms A through G, or something else. In such instances, caregiver assistance application124may be configured to assign a username and password to each such electronic device104that is custom tailored to that specific device. Thus, for example, if a particular electronic device104is positioned at a nurse's station within a pediatric oncology unit, the device104may be assigned a username of “pediatric oncology display” and have its own specific password. Once an authorized user has logged into caregiver assistance application124via that device, caregiver assistance application displays the rooms and/or patient data corresponding to the pediatric oncology unit on that particular device. The room and/or patient data may include rooms and/or patients that are assigned to multiple caregivers, thereby allowing the electronic device104to display information beyond that associated with a single caregiver. Regardless of whether caregiver assistance application124displays room listing screen156at step154or a patient listing screen, caregiver assistance application124is also configured to display a status summary160(FIG.8). Status summaries160provide additional information about the status of the patient in the room and/or the patient support apparatus20assigned to that room. Thus, for example, the status summary160may indicate that a patient is a fall risk or a bed sore risk, that the patient support apparatus20is currently empty, that the patient support apparatus20is in a compliant or non-compliant state, and/or that one or more tasks (e.g. a fall risk assessment) are waiting to be performed for that particular patient and/or room. Caregiver assistance application124receives the data necessary for displaying status summaries160by communicating with one or more of the servers on local area network74. In some embodiments, caregiver assistance application124receives all of the patient support apparatus data from patient support apparatus server86, which may be a commercially available bed status server, such as, but not limited to, the iBed server available from Stryker Corporation of Kalamazoo, Michigan. Further details of the iBed server are found in the Stryker Installation/Configuration Manual for the iBed Server 2.0 (document 5212-209-001 REV A), published in May of 2016 by Stryker Corporation of Kalamazoo, Michigan, the complete disclosure of which is incorporated herein by reference. In other embodiments, caregiver assistance application124is configured to receive the patient support apparatus status data directly from the patient support apparatuses20themselves, rather than through an intermediary server, such as the above-noted iBed server. Caregiver assistance application124receives the patient data and protocol data from EMR server98and/or ADT server94. ADT server94may contain, in addition to patient room assignments, data identifying one or more protocols that are to be followed for assessing a patient, such as the patient's fall risk and/or bed sore risk. Alternatively, such protocol data may be stored elsewhere. Such data allows caregiver assistance application124to display the status of a patient's assessments. In other words, caregiver assistance application124determines from server94and/or another server (or the rules of repository126) if a particular patient is supposed have a fall assessment, bed sore assessment, or other assessment performed. If so, caregiver assistance application124further sends an inquiry to EMR server98to determine if such an assessment has been completed for that particular patient. If it has not, caregiver assistance application124displays this lack of completion in the status summary160(FIG.8). In the example shown inFIG.8, the patient in room 7092 has not yet had a fall risk assessment performed, and this information is shown in the status summary160corresponding to room 7092. Turning more particularly to the examples shown inFIG.8, caregiver assistance application124receives the data necessary to indicate that the patient in room 7093 is a fall risk from EMR server98. Caregiver assistance application124requests and receives the data indicating “safe bed” for rooms 7090 and 7091 from patient support apparatus server86. The term “safe bed” displayed in the status summary160for rooms 7090 and 7091 ofFIG.8means that the patient support apparatuses20in those rooms are currently configured in their desired state (i.e. in their compliant states). As was noted previously, this “desired state” may be a pre-programmed part of caregiver assistance system106, or it may be modified and/or customized by an authorized individual136. In either case, the definition of the desired state, or “safe bed,” is stored in local rules repository126. In some embodiments, a particular patient support apparatus20is considered to be in the “safe bed” state if all of the following are true: the exit detection system46is armed, the brake is activated, the litter frame28is at its lowest height (or within a specified range of its lowest height), and at least three of the siderails36are in their raised position. As noted, this “safe bed” state may be modified to include, among other things, one or more of the following: a requirement that the A/C cable102is plugged into an A/C power outlet; a requirement that the nurse call cable78is plugged into the nurse call outlet82; a requirement that a monitoring function for the patient support apparatus20is armed; and/or other requirements. Still further, the “safe bed” state may be modified to remove one or more of the aforementioned criteria. As was noted previously, caregiver assistance application124determines if a patient in a particular room needs to have an assessment performed by checking EMR server98and/or one or more other servers on the local area network that define what assessments are to be performed (and when), and that record when such assessments have been completed. In the particular example shown inFIG.8, caregiver assistance application124has determined that the patient in room 7092 has not yet had a fall risk assessment performed, and therefore displays “fall risk assessment” in the status summary160associated with room 7092. Similarly, caregiver assistance application124is configured to display in the status summary160the results of any patient assessments that a caregiver should be aware of. Thus, in the example ofFIG.8, caregiver assistance application124displays “fall risk patient” for the status summary160associated with room 7094. This indicates that a fall risk assessment has been performed for the patient in room 7094 and that assessment has indicated that that particular patient is at a higher risk for falling. The results of this fall risk assessment are typically stored in EMR server98, and caregiver assistance application124is configured to request these results from EMR server98and display them in status summary160, if a fall risk (or bed sore risk, or other risk) has been detected. Caregiver assistance application124is also configured to display in the status summary160whether or not a patient support apparatus20is currently occupied by a patient or not. This information is obtained from the weight sensors, such as load cells, that are included within the scale/exit detection system46of each patient support apparatus20. Each patient support apparatus20periodically transmits its weight readings to patient support apparatus server86. Those weight readings are forwarded to caregiver assistance server90. If the weight readings are less than a threshold (e.g. 50 pounds), caregiver assistance application124concludes that the patient support apparatus20is unoccupied and may display this information in status summary160(or it may display other information that is configured to have a higher priority, such as, but not limited to, any assessments that need to be performed for that particular patient). Such information may be displayed in status summary160with the words “weight not detected,” or “patient out of bed,” or some other text that indicates that the patient support apparatus20is not detecting the patient. In the example shown inFIG.8, caregiver assistance application124is displaying the word “empty” for rooms 7095 and 7096. This indicates that those rooms currently do not have any patients assigned to them. Caregiver assistance application124determines this information by sending a request to ADT server94server asking it for patient information for those rooms92that are assigned to the particular caregivers who are using caregiver assistance system106. In this example, ADT server94instructed caregiver assistance application124that rooms 7095 and 7096 were not assigned to any patients. Accordingly, caregiver assistance application124displays “empty” in the status summary160for these rooms. It will be understood that the examples of information displayed in the status summaries160shown inFIG.8are merely several examples of the types of information that may be displayed on room listing screen156. Caregiver assistance application124may be modified to show less, more, and/or different information in status summaries160and/or to eliminate them entirely. Still further, caregiver assistance application124may be configured to display the status summaries160in different colors, depending upon the informational content of the status summary160. Thus, for example, tasks that need to be completed may be highlighted in a different color (e.g. orange); information indicating a task has not been complete within a designated time period and/or a patient support apparatus20that is out of compliance with a desired state may be highlighted in yet another color (e.g. red); and information indicating that no tasks or no out-of-compliance states exist may be indicated in yet another color (e.g. green). Indications of alerts may be displayed in status summary through flashing text, or still other manners. Returning to general algorithm226of caregiver assistance system106(FIG.5), general algorithm226proceeds from step154to step155. At step155of general algorithm226, caregiver assistance application124determines whether or not a caregiver has selected a particular room from amongst the rooms listed in room listing screen156. If the caregiver has not selected a particular room, algorithm226returns to step154and continues to display the room listing screen156. If the caregiver has selected a particular room, application124proceeds to step157where it displays on the screen of electronic device104a room overview screen162, such as the room overview screen162ofFIG.9. Thus, if a user navigates to the room listing screen156at any point while using caregiver assistance application124, he or she can press on (or otherwise select) a particular room listed on room listing screen156. Caregiver assistance application124responds to this selection by displaying a room overview screen162that corresponds to the particular room92selected by the user. The particular room overview screen162shown inFIG.9is therefore displayed by caregiver assistance application124when a user specifically selects room 7093 from room listing screen156. Caregiver assistance application124may also include other tools for allowing a user to navigate to room overview screen162, such as, but not limited to, a search function in which room numbers may be entered/searched. Room overview screen162(FIG.9) displays information about a particular room92within the healthcare facility and the patient associated with that room92. It will be understood that room overview screen162may be changed to a bay overview screen, or other type of overview screen, if the particular room that the caregiver has selected is a semi-private room containing more than one patient support apparatus20or patient. In such embodiments, caregiver assistance application124displays a bay overview screen (not shown) similar to room overview screen162that is specific to the particular bay that the caregiver has selected the within semi-private room. Room overview screen162(or a similar bay overview screen) includes a bed icon164, an exit detection system status indicator166, a bed watch status indicator168, a bed status bar170, a summary area172, and a task menu174(FIG.9). Bed icon164includes a plurality of siderail icons176positioned along the sides of bed icon164. Within each siderail icon176is an indicator (not labeled) that includes the word “up” or “down.” Caregiver assistance application124selectively displays the “up” or “down” down indication within the siderail icons176based upon the current status of the siderails36of the patient support apparatus20within room 7093. Caregiver assistance application124receives the up/down status of each siderail36from patient support apparatus server86and displays “up” or “down” to match the current siderail status of patient support apparatus20. Caregiver assistance application124is also configured, in at least some embodiments, to display the siderail icons176in a different color if they are in the down state, such as, but not limited to, amber. This distinguishes the siderail icons176from those corresponding to siderails36that are in an up position, which may be displayed in a green color, or some other color. Exit detection system status indicator166(FIG.9) indicates the current status of the scale/exit detection system46of the corresponding patient support apparatus20(e.g. the patient support apparatus20positioned in room 7093). That is, status indicator166indicates if the exit detection system46is currently armed or not. It also indicates what zone of the exit detection system the user has selected, if the exit detection system is armed and includes multiple zones. Many exit detection systems are configured to allow a user to select different zones of permitted movement. The different zones allow a patient to move different amounts before the exit detection system issues an alert. In the example ofFIG.9, the patient support apparatus20includes an exit detection system46having three zones, the second of which is highlighted. The exit detection system46is indicated inFIG.9as being disarmed (off). Caregiver assistance application124displays an “armed” or “on” indicator when the exit detection system46is armed, and also highlights the selected zone (1, 2, or 3). Further information about the zones and/or operation of an exit detection system that may be incorporated into patient support apparatus20and utilized in caregiver assistance system106are found in commonly assigned U.S. patent application Ser. No. 14/918,003 filed Oct. 20, 2015, by inventors Marko Kostic et al. and entitled EXIT DETECTION SYSTEM WITH COMPENSATION, the complete disclosure of which is incorporated herein by reference. Bed watch status indicator168(FIG.9) indicates whether the bed watch feature of the patient support apparatus20is turned on or off. The bed watch feature is a feature that is included in some embodiments of patient support apparatuses20, but may be omitted in other embodiments. In general, the bed watch feature, when activated, causes the patient support apparatus20to issue an alert when any component and/or function of the patient support apparatus20is changed from a desired state to an undesired state. Thus, for example, if the bed watch function is activated and includes the monitoring of the siderails36of the patient support apparatus20, the patient support apparatus20will issue an alert if one or more of the siderails are lowered, or otherwise moved to an undesired state. Generally speaking, when the bed watch feature is incorporated into a particular patient support apparatus20, the patient support apparatus20issues an alert if any one or more of the following changes on the patient support apparatus20: the exit detection system46is disarmed, a siderail36is lowered, the patient exits the patient support apparatus20, the brake is deactivated, the height of the bed is raised beyond a specified level, the A/C power cord102is unplugged, and/or the nurse call cable78is unplugged. The particular features of patient support apparatus20that, when changed, trigger an alert can be configured by an authorized user, such as authorized individual136. Also, the alert issued by patient support apparatus20in response to the bed watch function detecting an undesired state may be a local alert (at patient support apparatus20), a remote alert (e.g. sent to patient support apparatus server86and/or to caregiver assistance application124), or a combination of both a local and a remote alert. Bed status bar170provides additional information about the current status of patient support apparatus20(FIG.9). This includes an indication of whether or not the brake on the patient support apparatus20is activated or not; information indicating whether litter frame28is at its lowest height or not; information indicating whether the nurse call cable78is plugged into nurse call outlet82or not; and information indicating whether the A/C power cable102is plugged into an A/C outlet or not. All of the information shown in status bar170(as well as all of the patient support apparatus20data displayed by caregiver assistance application124) is sent by the patient support apparatuses20(via transceiver60) to patient support apparatus server86, which then forwards it to caregiver assistance server90and caregiver assistance application124. Although, in some modified embodiments, caregiver assistance application124and caregiver assistance server90are configured to receive this information directly from patient support apparatuses20, thereby avoiding the need for a separate patient support apparatus server86. The data displayed in bed status bar170(FIG.9) is updated in real time, or near real time. In most embodiments of patient support apparatuses20, the patient support apparatuses20are configured to automatically (and nearly immediately) communicate their status to patient support apparatus server86whenever a change occurs in their status. Thus, for example, if the nurse call cable78gets unplugged from the nurse call outlet82, the patient support apparatus20sends a message automatically and almost immediately thereafter to patient support apparatus server86. The patient support apparatus server86automatically, and immediately or nearly immediately, forwards this status update to caregiver assistance application124. Caregiver assistance application124, in turn, updates the information displayed in bed status bar170to indicate that the nurse call cable has been unplugged. A caregiver, who may be remote from a particular room92and/or a particular patient support apparatus20, thereby gets a real time, or near real time, update of the status of patient support apparatus20when utilizing caregiver assistance application124. Summary area172of room overview screen162(FIG.9) lists one or more items of information about the patient, the patient's patient support apparatus20, the room assigned to that particular patient, and/or any data generated from the reminder algorithm145. In the example shown inFIG.9, the summary area172includes a reminder to set, or arm, exit detection system46, and more specifically to select zone 2 when arming it. This data comes from reminder algorithm145, which allows a caregiver to select one or more tasks associated with a patient and/or patient support apparatus20, schedule those tasks, have reminders issued via caregiver assistance application124, and display data about those reminders in summary area172. Summary area172also includes an entry re-iterating the fact that the nurse call cable78has been disconnected. Still further, summary area172includes an entry reminding the caregiver of any upcoming tasks that are scheduled for this particular patient, room, and/or patient support apparatus20. In the specific example ofFIG.7, the summary area172of room overview screen162includes a reminder to turn the patient in room 7093 in thirty-three minutes. This task data is input into caregiver assistance application124by a caregiver and/or authorized individual136using the reminder algorithm145. Additional or alternative reminders may be included using the reminder algorithm145, such as reminders to perform a fall risk assessment, to perform a bed sore risk assessment, to carry out one or more therapies, etc. Task menu174of room overview screen162(FIG.9) identifies a plurality of different tasks that may be undertaken by a caregiver utilizing caregiver assistance application124. In the example shown inFIG.9and elsewhere (e.g.FIGS.10-17), task menu174includes four separate task icons: a falls task icon178, a rounding task icon180, a skin task icon182, and a reminders task icon184. If a caregiver selects one of these task icons174-182at step159, caregiver assistance application124begins execution of a corresponding algorithm140,141,143, and145at step161(FIG.5). More specifically, if a caregiver selects fall task icon178at step159, caregiver assistance application124begins execution of fall risk assessment algorithm143at step161. If a caregiver selects rounding task icon180at step159, caregiver assistance application124begins execution of rounding algorithm140(FIG.6) at step161. If a caregiver selects skin task icon182at step159, caregiver assistance application124begins execution of skin assessment algorithm141at step161. Finally, if a caregiver selects reminder icon184at step157, caregiver assistance application124begins executing reminder algorithm145at step161. The selection of these various icons and their associated algorithms cause caregiver assistance application124to bring up different screens corresponding to the selected task. The different screens enable a user to perform one or more tasks with respect to that particular patient. For example, if the user selects the falls task icon178, caregiver assistance application124causes the display on electronic device104to display a screen allowing a caregiver to perform one or more tasks associated with reducing the likelihood of a patient falling. These tasks include, but are not limited to, performing a fall risk assessment and configuring the patient support apparatus20in a manner that helps to reduce or minimize a patient's fall risk. The particular screen that is displayed by caregiver assistance application124in response to a user selecting the falls task icon178(or any of the other task icons of task menu174) may be an initial screen of a larger set of screens that are displayable by caregiver assistance application124in order to assist the caregiver with the selected task. This is discussed more with respect to caregiver rounding task icon180. If a caregiver selects skin task182(FIG.9) at step159(FIG.5), caregiver assistance application124executes skin assessment algorithm141, which causes it to display an initial skin care screen (not shown) that assists the caregiver in performing a bed sore risk assessment, documenting one or more existing skin states or conditions, and/or setting one or more reminders or configurations on the patient support apparatus20to assist in preventing the development and/or worsening of a patient's bed sores. As with fall task icon180, the selection of skin task icon182causes caregiver assistance application124to display an initial screen associated with caring for a patient's skin that is part of a larger set of screens adapted to assist the caregiver in caring for the patient's skin. The additional screens within that larger set are accessible through the initial screen, or through one or more of the other screens that are accessible from the initial screen. If a caregiver selects reminder task icon184step159(FIG.5), caregiver assistance application124executes reminder algorithm145and displays an initial reminder screen (not shown) that allows the caregiver to set, edit, and/or cancel reminders associated with caring for that patient. Such reminders include, but are not limited to, reminders to turn the patient, reminders to perform one or more therapies on the patient (e.g. a lateral rotation therapy using mattress38), reminders to perform caregiver rounds, and other reminders. Whatever the specific reminder, caregiver assistance application124is configured to display the reminder in summary area172of room overview screen162, in the status summary160of room listing screen156, and/or on other screens of caregiver assistance application124. The display may include not only an indication of the reminder, but also a time remaining until the reminder deadline is met (or, if the reminder deadline has passed, an amount of time that has passed since the reminder deadline expired). Still further, in some embodiments of caregiver assistance system106, caregiver assistance application124is configured to send a notification to the caregiver when a reminder deadline is reached (or at one or more configurable times ahead of the reminder deadline). The notifications include, in some embodiments, an email, a text, a phone call, or some other type of notification, as will be discussed more below. During the performance of any of the tasks identified in task menu174, caregiver assistance application124is configured to continue to display task menu174on the screens that are specifically associated with those tasks. If the user selects a task icon corresponding to a task different from the one currently being executed, caregiver assistance application124switches to performing the algorithm associated with that particular task. In the specific case of the rounding algorithm140, if the caregiver selects rounding task icon180from one of the screens associated with tasks icons178,182, or184, caregiver assistance application switches to step192of rounding algorithm140(FIG.6), as will be discussed in more detail below. If the caregiver does not select any of the tasks from task menu174, general algorithm226(FIG.5) of caregiver assistance application124proceeds to step163where it determines if a caregiver has input a command to control one or more aspects of the patient support apparatus20. If the caregiver has input such a command, algorithm226proceeds to step165where it sends the command to the patient support apparatus20. The routing of this command is through caregiver assistance server90, in at least one embodiment. That is, the command to control one or more aspects of the patient support apparatus20is sent from the electronic device104to caregiver assistance application124(via one or wireless access points76). After being received, caregiver assistance application124forwards the command either directly to the corresponding patient support apparatus20using wireless access points76, or it forwards the command to patient support apparatus server86, which then forwards the command to the patient support apparatus20using one or more wireless access points76. When the command is received at the patient support apparatus20, controller48checks to see if the command is an authorized command and, if so, implements the command. After both steps163and165of general algorithm226(FIG.5), caregiver assistance application124proceeds to step167where it checks to see if the caregiver has input a command to change the currently displayed room overview screen162back to the room listing screen156ofFIG.8. If the caregiver has, algorithm226returns back to step154and proceeds in the manner previously described. If the caregiver has not, algorithm returns back to step157and proceeds in the manner previously described. It should be noted that the display of different screens within caregiver assistance application124is not only controlled by the area that a user presses/selects on a particular screen, but also by the caregiver's use of the conventional “back” and “forward” functions of the web browser that the caregiver is using to access caregiver assistance application124. Thus, for example, if a user is viewing room overview screen162ofFIG.9and wishes to return to viewing room listing screen156ofFIG.8, he or she can simply press, or otherwise activate, the “back” function of the web browser the caregiver is using. If a caregiver selects rounding task icon180(FIG.9) at step159of general algorithm226(FIG.5), caregiver assistance application124begins executing rounding algorithm140ofFIG.6. Rounding algorithm140begins at a step192where caregiver assistance application124receives and/or verifies a room selection or bed selection. In response to such a room selection or bed selection, caregiver assistance application124proceeds to displaying a first rounding screen190, such as the first rounding screen190shown inFIG.10. The caregiver's selection of a specific room or patient support apparatus is used by caregiver assistance application124in order for caregiver assistance application124to know what patient and/or room rounding information to display on screen190(and its subsequent rounding screens). If a caregiver navigates to screen190from a screen, such as screen162ofFIG.9, caregiver assistance application displays information on screen190that corresponds to the same bed and/or room as was selected in screen162. Thus, because screen162was displaying information for room 7093 inFIG.9, if a user navigates to screen190ofFIG.10by pressing on the rounding task icon180ofFIG.9, caregiver assistance application will automatically display the rounding information on screen190that also corresponds to room 7093. However, there may be situations where the first rounding screen190is called up by the caregiver without having previously selected a particular room and/or patient, or there may be situations where the caregiver wants to utilize first rounding screen190for a different room or patient than what was selected on a previously displayed screen. In those situations, first rounding screen190may be modified and/or supplemented by a screen, or input field, in which the caregiver can select a particular room and/or patient for carrying out the rounding tasks associated with first rounding screen190. In some embodiments, the particular patient support apparatus20may be selected at step192by having the user manually enter the room number of the patient whose rounding information he or she is intending to collect. In other embodiments, patient support apparatus20may have a short range wireless transmitter (e.g. one or more near field transmitters and/or a Bluetooth transmitter) that communicates automatically with the mobile electronic device104aand tells the device104awhich patient support apparatus20it is. In response, caregiver assistance application124automatically associates the first rounding screen190with the patient support apparatus20identified in the wireless communication it received from the patient support apparatus20. In still other embodiments, caregiver assistance application124may be configured to automatically associate first rounding screen190with a particular room or patient based on the current location of the mobile electronic device104aat the time the first rounding screen190was first accessed. Such current location information may be received from RTLS server100. Regardless of the specific manner in which the room for first rounding screen190is selected, caregiver assistance application124displays the selected room in a room identifier location198(FIG.10). Caregiver assistance application124may also display the same content of status summary160(of room listing screen156) in a status location200adjacent the room identifier location198. First rounding screen190also includes a top portion202and a bottom portion204. Top portion202includes the same information displayed in the top half of room overview screen162(FIG.9). Specifically, it includes the bed icon164, exit detection system status indicator166, bed watch status indicator168, and bed status bar170. Bottom portion204, however, does not include summary area172of room overview screen162, but instead includes a first rounding question206. The first rounding question identifies a question intended to be asked by the caregiver of the patient while the caregiver is performing his or her rounding duties. Caregiver assistance application124displays this first question206at step208of algorithm140(FIG.6). The specific first rounding question206displayed at step208of algorithm140(illustrated inFIG.10) is a question regarding the patient's pain level. Specifically, it is a question of the patient's current pain level on a scale of zero through ten with zero being the lowest pain level and ten being the highest. It will be understood that, although first question206is described herein as being the “first” question shown after rounding task icon180is selected, the particular order of questions displayed by caregiver assistance application124may be varied, and the term “first” in the phrase “first rounding question” is merely used to distinguish the question from other rounding question, not to indicate any particular significance to its sequential order. First rounding question screen190(FIG.10) includes a plus sign icon210, a minus sign icon212, a next icon214, and a current pain level indicator216. The plus sign icon210and minus sign icon212are pressed by the caregiver to increase or decrease the patient's pain level, as indicated by the current pain level indicator216, until the corresponding pain level shown by indicator216matches the pain level expressed by the patient. For example, if the user indicates their pain level is a six, the caregiver presses the plus sign icon212six times until the current pain level indicator reads a six. The caregiver then presses next icon214and caregiver assistance application124saves the pain level data and proceeds to display a second rounding question screen, such as second rounding question screen220shown inFIG.11. In other embodiments, first rounding question screen190(FIG.10) is modified to allow the user to input the patient's current pain level in one or more alternative and/or additional manners. For example, in another embodiment, plus and minus signs210and212are replaced by a numeric keypad icon and the user simply presses on the numbers of the keypad to directly input the patient's pain level. In yet another embodiment, a slider bar icon is displayed on screen190and the user touches the slider bar while moving the sliding portion of the bar to a position corresponding to the number of the patient's pain level. Still other manners of allowing the user to input the patient's pain level are possible. Second rounding question screen220includes all of the same elements of first rounding question screen190with the exception of the specific rounding question displayed in bottom portion204. That is, second rounding question screen220displays the room identifier in the room identifier location298, the status of the room in the room status location200, and all of the same icons in top portion202that are found in the top portion202of first rounding screen190. Bottom portion204, however, differs from bottom portion204of screen190in that it is directed to a different rounding question. Specifically, bottom portion204of second rounding question screen220includes a rounding question222inquiring whether the patient is currently in a comfortable position or not. If the patient is not, the caregiver assists the patient to a more comfortable position and documents this movement or turning of the patient by pressing a “patient turn” icon224displayed on screen220. In response to pressing the turn icon224, caregiver assistance application124records the fact that the patient has been turned, along with the identity of the particular caregiver associated with the mobile electronic device104afrom which the turn indication was received. Caregiver assistance application124further time stamps this recording and, as will be discussed further below, includes it with other rounding information that is transmitted to the EMR server98. If the patient does not need to be turned or otherwise repositioned, the caregiver presses the next icon214on screen220(FIG.11). The pressing of the next icon214on screen220causes caregiver assistance application124to display a third rounding question screen230, an example of which is shown inFIG.12. Third rounding question screen230includes a top portion202and a bottom portion204. Top portion202include all of the same information as the top portions202of first and second rounding question screens190and220. Bottom portion204differs from these screens in that it includes a third rounding question232, which, in this case, is an inquiry into whether the patient needs to use the restroom or not. If the patient needs to use the restroom, the caregiver assists, or otherwise allows, the patient to use the restroom. In some embodiments, third rounding question screen230may include an input that, when pressed by the caregiver, sends a message to caregiver assistance application124indicating that the patient has used the restroom, and caregiver assistance application124saves this information for entry into that particular patient's electronic medical record. If the patient does not need to use the restroom, or has finished using the restroom, the caregiver presses the next icon214. In response to pressing the next icon214on third rounding question screen230, caregiver assistance application124displays a fourth rounding question screen240, one example of which is shown inFIG.13. Fourth rounding question screen240includes a top portion202and a bottom portion204. Top portion202include all of the same information as the top portions202of first, second, and third rounding question screens190,220, and230. Bottom portion204differs from these screens in that it includes a fourth rounding question242, which, in this case, is an inquiry into whether the patient needs any possession or not. If the patient needs a possession, the caregiver retrieves it for the patient, or otherwise moves it into a position within the room92that is accessible to the patient without requiring the patient to leave patient support apparatus20. After ensuring that the patient has access to any of his or her possessions, the caregiver again presses the next icon214. It can be seen fromFIG.6that the input of rounding information utilizing the rounding screens190,220,230, and240corresponds to steps246,248, and250of algorithm140. That is, at step208(FIG.4), caregiver assistance application124displays a first rounding question. This step is accomplished by displaying first rounding question screen190and its associated first rounding question206. After displaying this information, caregiver assistance application124waits for a response from the caregiver at step248. After waiting for the response, algorithm140receives data from the caregiver at step248. This data input corresponds to, for example, the caregiver entering the patient's pain level via screen190, or repositioning the patient and documenting the repositioning step using patient turn icon224of screen220. For some screens, such as screens230and240, the data entry includes the pressing of the next icon214, which indicates that the corresponding question was asked by the caregiver. After receiving the caregiver assistance data at step248(FIG.6), caregiver assistance application124moves onto step250where it determines whether or not there are more caregiver assistance questions to ask. Thus, after displaying first, second, and third rounding question screens190,220, and230, respectively, caregiver assistance application124returns back to step208and displays the another rounding question screen. However, after displaying the fourth rounding question screen240(FIG.13), caregiver assistance application124moves from step250to step252where it waits for verification data verifying the completion of the rounding task to be input by the caregiver, as will be discussed in greater detail below. Before proceeding to describe step252, it is worth noting that the particular number and content of the caregiver assistance questions displayed by caregiver assistance application124on electronic devices104may be varied from the four shown inFIGS.10-13. Caregiver assistance application124includes an administrative portal that can be accessed by an authorized individual136to change the number of questions asked, the content of the questions, the order of the questions, and the content of the data that is to be input into the application124in response to receiving the patient's answers. At step252(FIG.6) of rounding algorithm140, caregiver assistance application124displays a rounding completion screen260(FIG.14). The rounding completion screen260includes a rounding documentation window262that indicates the time (and date) at which the caregiver completed his or her rounding task associated with the particular room shown in room identifier location198(or more particularly, the patient in that room), as well as a verification that the information entered by the caregiver (e.g. pain level) has been sent to caregiver assistance server90and recorded by caregiver assistance application124. In some embodiments, as will be discussed more below, caregiver assistance application124proceeds to automatically forward this rounding information to EMR server98for storage in the patient's electronic medical record. In the embodiments which follow algorithm140, as shown inFIG.6, caregiver assistance application124does not send this rounding data to EMR server98until it receives verification data verifying that the caregiver was actually present at the patient's bedside while he or she accessed and used rounding screens190,220,230, and240. More specifically, in the embodiment of algorithm140shown inFIG.6, caregiver assistance application124proceeds from step250(if there are no more rounding questions) to step252where it seeks to capture verification data. As noted, the verification data refers to data that is used to verify that the caregiver actually entered the room and performed his or her rounding duties in the patient's room. The particular verification data that is captured at step252may vary widely from embodiment to embodiment.FIGS.15,16, and17illustrate three different verification screens that may be utilized by caregiver assistance application124for gathering this verification data. Each of the three screens is intended to gather different verification data. In practice, caregiver assistance application124will typically utilize only a single one of the screens shown inFIGS.15-17. The inclusion of multiple screens inFIGS.15-17is intended to show a variety of different types of verification data that may be gathered by caregiver assistance application124. It will further be understood, of course, that still other types of verification data may be gathered by caregiver assistance application124besides the three examples shown inFIGS.15-17. Verification screen270(FIG.15) includes a bottom portion204having an image window272and a capture icon274. Image window272displays an image currently being sensed by the camera built into mobile electronic device104a. Capture icon274is touched by the caregiver when the caregiver is ready to take a picture. The image window272inFIG.15specifically shows a Quick Response (QR) code because, in the embodiment illustrated therein, each patient support apparatus20is configured to display a QR code on its display70in response to the caregiver pressing a specific control, or series of controls. Controller48of the patient support apparatus20generates the QR code in a manner that embeds at least two pieces of information in the QR code: a unique identifier corresponding to that particular patient support apparatus20and a current time (and day). Caregiver assistance application124is adapted to analyze the QR code to determine the specific patient support apparatus20identified in the code and the time at which the photograph was captured by the mobile electronic device104a. Caregiver assistance application124compares the specific patient support apparatus20identified in the QR code with the identity of the patient support apparatus20positioned in the room identified in the room identifier location198to ensure that they match. If they do not match, then the image that the caregiver captured using capture icon274is not an image of the patient support apparatus20associated with the patient to whom the caregiver just asked the rounding questions. In this case, caregiver assistance application124displays an error message and does not proceed to step254of algorithm140(FIG.6). If the patient support apparatus20identifiers match, then caregiver assistance application124proceeds to step254. Caregiver assistance application124receives patient support apparatus identifiers186(FIG.4) that uniquely identify each patient support apparatus20from patient support apparatus server86. When each patient support apparatus20sends these identifiers186to patient support apparatus server86, the patient support apparatus20also sends a locator identifier138(FIG.4) that uniquely identifies the location beacon84within that room. This information is shared with caregiver assistance application124. Caregiver assistance application124therefore receives not only the unique IDs corresponding to each patient support apparatus20, but also the location of those patient support apparatuses20. Alternatively, it receives the unique IDs of the patient support apparatuses20and bed location table88. In either situation, caregiver assistance application124receives sufficient information to know the specific patient support apparatus ID of each patient support apparatus20and the specific room in which each patient support apparatus is located in. This is the information caregiver assistance application124uses to compare against the patient support apparatus identifier contained within the QR code. For example, if a caregiver takes a picture of a QR code using verification screen270and capture icon274, and the picture is taken in room 7093 (FIG.15), caregiver assistance application124compares the patient support apparatus20ID contained within the QR code to the location record it maintains for that particular patient support apparatus20. If that record also indicates that that particular patient support apparatus20is located in room 7093, then caregiver assistance application124accepts the QR code as verification that the caregiver was actually present in that room when he or she performed his or her rounding tasks. If the record does not match, caregiver assistance application124displays an error message and does not accept the picture of the QR codes as verification of the caregiver's physical presence during the rounding task. Patient support apparatuses20suitable for use with the verification method utilized by verification screen270ofFIG.15include a clock that keeps track of the current time, and a controller48configured to embed both the current time and the unique ID of the patient support apparatus20into the QR code. Some examples of patient support apparatuses20that include internal clocks and that may be utilized with algorithm140and the verification process ofFIG.13are disclosed in commonly assigned U.S. patent application Ser. No. 15/642,621 filed Jul. 6, 2017, by inventors Anuj Sidhu et al. and entitled PATIENT SUPPORT APPARATUSES WITH CLOCKS, the complete disclosure of which is incorporated herein by reference. Other types of patient support apparatuses20can, of course, alternatively be used. The patient support apparatuses20utilized with the verification process ofFIG.15are configured to display the QR code somewhere on their display screen70. The display of the QR code may be constant with repetitive updates to include the current time (e.g. every minute or so), or the display may be intermittent in response to the caregiver pressing, or otherwise activating, one or more controls on the patient support apparatus20. With respect to the latter option, one of controls72may be specifically dedicated to causing patient support apparatus20to display the QR code, or the code may be displayed in response to the caregiver navigating to a specific screen on which the QR code is displayed. Still other manners of getting the patient support apparatus20to display the QR code may be utilized. It will also be noted that there is no requirement that the patient support apparatus20specifically utilizes a QR code. That is, other codes may be utilized, such as, but not limited to, a bar code. Still further, in some embodiments, patient support apparatus20is configured to not encode the information at all. In such embodiments, patient support apparatus20displays, or can be manipulated by the caregiver to display (e.g. using controls72), a screen on which both the current time and the unique identifier of the patient support apparatus20are shown. The caregiver captures an image of that display using the camera function of the mobile electronic device (e.g. smart phone, tablet, etc.) and forwards the image to caregiver assistance application124. Caregiver assistance application124processes the image to extract the ID of the patient support apparatus and the time from the captured image. The extracted patient support apparatus ID is then matched against the record data for that particular room, as discussed above. If the captured patient support apparatus ID data matches the data contained in the records (data repository128) of caregiver assistance application124, caregiver assistance application124proceeds to step254, which will now be described. At step254of rounding algorithm140(FIG.6), caregiver assistance application124determines whether or not patient support apparatus20is in a compliant or non-compliant state. The definition of a compliant state may be determined during the installation of caregiver assistance application124(or modified thereafter) in accordance with the particular requirements of the healthcare facility into caregiver assistance application124is being installed, or it may be pre-defined by the vendor of caregiver assistance application124. Alternatively, or additionally, the compliant state may be modified and/or defined by an authorized individual136after installation. In many embodiments, the compliant state includes the same criteria that are monitored by the bed watch feature discussed above. That is, in many instances, healthcare facilities will define a compliant state of a patient support apparatus as one in which all of the following are true: the brake is activated, the litter frame28is at its lowest height, the exit detection system46is armed, a monitoring feature armed, at least three of the siderails36are up (and/or specific ones of the siderails are up), the A/C power cable102is plugged into a wall outlet, and the nurse call cable78is plugged into a nurse call outlet82. Other definitions of a compliant state may, of course, be utilized, Caregiver assistance application124checks to see if the patient support apparatus20is in the compliant state or not at step254. Caregiver assistance application124performs this step by asking patient support apparatus server86for the current status data of the patient support apparatus20when the user reaches step254. The current status data of each patient support apparatus20is maintained by patient support apparatus server86in table88(FIG.4). As was noted, patient support apparatuses20send their status data to patient support apparatus server86whenever they sense a change in their state (or upon a specific request from patient support apparatus server86). After caregiver assistance application124receives the current status data of the patient support apparatus20from patient support apparatus server86, it checks to see if the current status data matches the compliant state criteria discussed above. If caregiver assistance application124determines that the patient support apparatus20is currently in a compliant state, it moves to step256of rounding algorithm140(FIG.6). If caregiver assistance application124determines that the patient support apparatus20is not currently in a compliant state, it moves to following a first control path280(in one embodiment) or to following a second control path282(in another embodiment). At step256(FIG.6), caregiver assistance application124sends various data to the EMR server98to be documented in the electronic medical record of the patient for whom the caregiver just completed his or her rounding tasks. This transmission occurs without the caregiver having to perform any additional step beyond the ones previously described. The particular data that is sent to EMR server98includes the following: (a) the rounding data entered by the caregiver into the mobile electronic device104aduring the rounding task (e.g. pain level, whether the patient used the restroom, etc.); (b) the verification data captured during step252(or data indicating that the rounding tasks was verified); (c) whether or not the patient support apparatus20is in a compliant state or not (or alternatively, the current status of patient support apparatus20with respect to its brake, siderails, litter frame height, exit detection system, nurse call cable, and/or power cable); (d) a time and date stamp; and (e) data sufficient to identify the caregiver who is currently logged into the particular mobile electronic device104afrom which caregiver assistance application124receives the rounding data. The time and date stamp may include both the time and date at which the data is received by caregiver assistance application124from the corresponding mobile electronic device104, and the time and data that is encoded in the verification data presented on the display70of the patient support apparatus20and captured by the caregiver in image window272. Alternatively, or additionally, the time and data stamp may refer to the time at which this data is sent to EMR server98by caregiver assistance application124. EMR server98, upon receipt of this data, updates the patient's electronic medical record with the new data, and caregiver assistance application124returns back to step154, thereby enabling the caregiver to complete another rounding task and/or another one of the tasks associated with task menu174. After completing step256(FIG.6), caregiver assistance application124is configured, in at least some embodiments, to update any timer that is associated with the rounding task that was just completed. In other words, caregiver assistance application124may be configured to implement a reminder algorithm145that reminds the caregivers of tasks that they are to perform. Such tasks may include the rounding tasks. Thus, for example, if a caregiver is to perform a rounding tasks for his or her rooms, the reminder algorithm145will issue periodic reminders and/or display on the associated screens of electronic devices104the amount of time remaining until the rounding task should be performed. In these embodiments, caregiver assistance application124is configured to reset such timers after a caregiver completes a rounding task at step254. Thus, for example, if a caregiver is supposed to perform a rounding task every two hours, and the caregiver has just completed a round for room 1703, caregiver assistance application124automatically resets the timer for room 1703 to two hours after step256is completed. The corresponding time information displayed on the screens of mobile electronic devices104ais therefore also automatically reset, thereby providing the caregivers with up-to-date indications of how much time is left until the next rounding task is to be performed. Caregiver assistance application124maintains and updates timers for rounding tasks associated with each room and/or patient as well as, in some embodiments, timers for other tasks. Returning to step254of algorithm140(FIG.6), if the patient support apparatus20is determined by caregiver assistance application124to not be compliant at that step, it proceeds to either 1stcontrol path280or second control path282, depending upon the particular embodiment of caregiver assistance application124. Turning first to the embodiment in which caregiver assistance application124proceeds to first control path280, caregiver assistance application124implements the status/command algorithm147. That is, caregiver assistance application124proceeds to step258and waits there to receive a command from the caregiver that will remotely change the patient support apparatus20to a compliant state. As noted previously, the status/command algorithm147allows caregiver assistance application124to receive patient support apparatus commands from a caregiver and relay those commands to the corresponding patient support apparatus20. This enables the caregiver to remotely change the state of the patient support apparatus20to be in a compliant state. For example, if caregiver assistance application124determines at step254that the patient support apparatus20is not in a compliant state because the exit detection system46is not currently armed, caregiver assistance application124will display an indication informing the caregiver that this is the cause of the non-compliant state. It will also display a control that enables the caregiver to use the mobile electronic device104ato arm the exit detection system. In some embodiments, this control is simply a display of exit detection system status indicator166and tapping on this indicator166toggles between arming and disarming exit detection system46. Other types of controls may also or alternatively be displayed. In response to the user tapping on the control to arm the exit detection system46, the mobile electronic device104asends a message to caregiver assistance server90instructing caregiver assistance application124to send a command to the patient support apparatus20to arm its exit detection system46. This message is sent at part of step266of algorithm140. In response to this message, caregiver assistance application124proceeds to step268(FIG.6) where it either sends a command directly to the corresponding patient support apparatus20to arm its exit detection system46, or it sends the command to patient support apparatus server86, which in turn relays the command to the appropriate patient support apparatus20. In either scenario, the command is received by the patient support apparatus20and controller48responds by arming the exit detection system. The arming of the exit detection system46by controller48also prompts controller48to send a new status message to patient support apparatus server86that updates the current status of the patient support apparatus20. This updated status includes the fact that the exit detection system46is now armed. Patient support apparatus server86forwards this updated status to caregiver assistance application124, which receives it at step276(FIG.6). Using this updated status data, caregiver assistance application124returns to step254where it again checks to see if the patient support apparatus20is in a compliant state or not. If it is, it proceeds to step256and takes the actions associated with step256that were previously described. If the patient support apparatus20is still out of compliance, caregiver assistance application124returns to first control path280and step258where it waits to receive another command from the caregiver for changing the state of the patient support apparatus20. In some embodiments, caregiver assistance application124is configured to only allow the caregiver to remotely change those states of the patient support apparatus20that do not involve any motion. That is, the caregiver is only allowed to use his or her mobile electronic device104aat step266to send non-movement commands to the patient support apparatus20. This is done in order to avoid the situation where movement occurs on patient support apparatus20when the caregiver may not be present in the room, and such movement may startle the patient and/or be impeded by an obstacle, such as, but not limited to, the patient himself or herself. Such unattended movement may therefore lead to injuries. Therefore, in some embodiments, caregiver assistance application124only forwards non-moving commands, such as, but not limited to, commands to arm/disarm the exit detection system46, arm/disarm the bed watch function, and turn on/off the brake. In those embodiments of caregiver assistance application124where it follows second control path282(FIG.6), caregiver assistance application proceeds to step264after it determines at step254that the patient support apparatus20in not in a compliant state. At step264, caregiver assistance application124displays a screen (not shown) on the mobile electronic device104athat includes an acknowledgement input. The acknowledgement input is an input that the caregiver must actively touch, or otherwise activate, and includes a message indicating that the patient support apparatus20is not in a compliant state. After the caregiver acknowledges that the patient support apparatus20is not in a compliant state at step264, caregiver assistance application124proceeds to step256and takes the actions associated with step256that were previously described. In addition to those actions, caregiver assistance application124also sends to EMR server98data indicating that the non-compliant state of the patient support apparatus20was actively acknowledged (and a time and date of the acknowledgment, in some embodiments). Caregiver assistance application124may also send the identity of the caregiver who performed this acknowledgement to EMR server98. It can be seen from a comparison of first and second control paths280and282(FIG.6) that caregiver assistance application124may be configured to either not allow a caregiver to upload rounding data to EMR server98if the patient support apparatus20is not in a compliant state (first path280) or to allow the caregiver to upload the rounding data to EMR server98for a non-compliant patient support apparatus20, provided the caregiver actively acknowledges (at step264) that the patient support apparatus20is not in a compliant state (second path282). Either control path280and282therefore encourages the caregiver to ensure that the patient support apparatus20is in a compliant state, thereby helping the healthcare facility to achieve higher rates of patient support apparatus compliancy. It will be understood that caregiver assistance application124may be modified in still other embodiments to include alternative paths to control paths280and282, and/or to include modifications to these control paths. For example, in at least one embodiment, caregiver assistance application124follows a third alternative path (not shown) in which the caregiver has access to an “update status” control on mobile electronic device104a. The “update status” control, when activated by the caregiver, causes the mobile electronic device104ato send a message to caregiver assistance application124instructing caregiver assistance application124to request an updated status of the patient support apparatus20from patient support apparatus server86. The inclusion of the “update status” control allows a caregiver who is positioned next to the patient support apparatus20to directly utilize the controls72on patient support apparatus20to change the patient support apparatus20to a compliant state. Once in the compliant state, pressing the “update status” control causes the now-compliant state of the patient support apparatus20to be communicated to caregiver assistance application124, which then moves to step256of rounding algorithm140, thereby allowing the rounding data to be uploaded to EMR server98. One modification to this alternative third control path that may be implemented is to configure caregiver assistance application124to repetitively and/or automatically request updated statuses from the patient support apparatuses20. In this modified embodiment, it is not necessary for a caregiver to press, or otherwise activate, an “update status” control. Instead, caregiver assistance application124automatically receives patient support apparatus status updates. Thus, in this embodiment, once the caregiver assistance application124receives a status update for the patient support apparatus20that indicates that the patient support apparatus20is in a compliant state, it automatically moves to step256without requiring the caregiver to manually manipulate any controls on the mobile electronic device104a. In still other embodiments, any of the features of control paths280,282, or the third alternative control path described above may be combined together. For example, in some embodiments, caregiver assistance application124may be configured to display three options to the caregiver after determining at step254that the patient support apparatus20is out of compliance: (a) a patient support apparatus command input, (b) an acknowledgement input; and (c) an “update status” input. The caregiver can then decide whether to use the mobile electronic device104ato change the patient support apparatus state (option a); acknowledge the non-compliant state of the patient support apparatus20without correcting it (option b); or change the patient support apparatus20state using the controls72on the patient support apparatus20itself and request that the updated status be communicated to caregiver assistance application124(option c). Still other variations may be implemented. Returning now to step252of caregiver rounding algorithm140(FIG.6), caregiver assistance system106may be modified to capture verification data at step252in a variety of manners different from what was previously described above with respect to step252andFIG.15. Two of these different manners are illustrated inFIGS.16and17. After a caregiver has completed the caregiver assistance questions ofFIGS.10-13and steps208,246,248, and250, caregiver assistance application may be configured in some embodiments to execute step252by having the caregiver take a photograph of the patient support apparatus20itself, rather than the QR code, or other code, on the display70of the patient support apparatus20. An example of this type of verification is shown inFIG.16, which shows a first alternative verification screen290. First alternative verification screen290, like verification screen270ofFIG.15, includes a camera image window272that shows the image currently being detected by the camera built into mobile electronic device104a. In order for a caregiver to properly verify that he or she has completed a rounding task associated with a particular patient, he or she aims the camera of the mobile electronic device104asuch that the camera is pointed at a designated portion of the patient support apparatus20. In the example shown inFIG.16, the designated portion includes the foot end of patient support apparatus20. The designated portion may vary, depending upon the particular patient support apparatus20, but should include whatever portion of the patient support apparatus20includes sufficient information to uniquely identify the patient support apparatus20and distinguish it from other patient support apparatuses20within the healthcare facility. This identification information may include a sticker with a serial number on it, an engraved serial number, a sticker or other structure coupled to the patient support apparatus20, and/or any other kind of image information that identifies the particular patient support apparatus20. Once that portion of the patient support apparatus20is within the field of view of the camera of mobile electronic device104a, the caregiver presses the image capture icon274and the mobile electronic device104atakes a picture of that portion of the patient support apparatus20. The mobile electronic device104aalso sends the captured image to caregiver assistance application124where it is analyzed to verify that the patient support apparatus20in the image matches the patient support apparatus assigned to the patient for whom the caregiver just completed his or her rounding tasks, as discussed previously. If there is a match, caregiver assistance application124proceeds to step256where it uploads the rounding data and other data (including the capture image) to EMR server98. In alternative embodiment, caregiver assistance application124is configured to have the caregiver capture an image of the patient support apparatus20using the camera of mobile electronic device104a, but the particular portion of patient support apparatus20that is captured is immaterial. In this modified embodiment, the caregiver turns on the location feature (GPS, WiFi triangulation, etc.) of the mobile electronic device104aand has the mobile electronic device automatically append a geographic location to the photograph captured using image window272. The mobile electronic device104aforwards the image data (i.e. photograph) to caregiver assistance application124, along with the location data and, in some cases, the time and date at which the photo was taken. Caregiver assistance application124uses knowledge of the geographic location of each room within the healthcare facility (stored in data repository128, or elsewhere) to determine if the location at which the photograph was taken matches the room in which the corresponding patient is located. If so, it proceeds to step256of algorithm140. If not, it displays an error message. After a caregiver has completed the caregiver assistance questions ofFIGS.10-13and steps208,246,248, and250, caregiver assistance application124is configured in some embodiments to display second alternative verification screen300ofFIG.17, rather than first alternative verification screen290ofFIG.16(or verification screen270ofFIG.15). In such embodiments, the caregiver is instructed to not only capture an image (take a picture) using the camera function of the mobile electronic device104a, but to also use the selfie feature built into the camera of mobile electronic device104athat enables the mobile electronic device to simultaneously capture both a forward looking photograph and a rearward looking photograph of the caregiver himself or herself. In other words, caregiver assistance application124instructs the caregiver to take a picture using both the forward facing camera of the mobile electronic device104aand the rearward facing camera of the mobile electronic device104a. The rearward facing camera is intended to capture an image of the caregiver while the forward facing camera is intended to capture an image of all or a portion of the patient support apparatus20. An example of this is shown inFIG.17, which includes a forward-facing image304and a rearward facing image306. The forward facing image304captures a portion of the patient support apparatus and the rearward facing image306captures an image of the caregiver. The purpose of the rearward facing camera image of the caregiver is to document the actual presence of the caregiver at the bedside of the patient when he or she has completed the rounding tasks associated with that patient. As with the other verification processes, caregiver assistance application124processes the image data from both the forward and rearward facing cameras to identify the patient support apparatus20within the forward facing image304. This image may be of an identifier of the patient support apparatus20, of a QR or other code, or of any portion of the patient support apparatus20. Caregiver assistance application124, in at least one embodiment, also processes the rearward image306using conventional facial recognition technology to determine the identity of the caregiver captured therein. In other embodiments, caregiver assistance application124does not process the caregiver image data, but instead forwards it to EMR server98at step256unanalyzed. In another embodiment, mobile electronic device104aincludes native software onboard that perform facial recognition. In this embodiment, the controller of mobile electronic device104ais configured to compare an image (taken, for example, by using the digital camera function of the mobile electronic device) of the caregiver with a baseline image taken previously of the caregiver and to determine if there is a match. In other words, in this embodiment, mobile electronic device104ais programmed to perform facial recognition of the selfie photograph captured by mobile electronic device104aand, if the selfie is determined to match the authorized caregiver, to forward the captured data to the caregiver assistance application124. The data forwarded to caregiver assistance application124in this embodiment, however, may omit the actual image data of the caregiver, thereby reducing consumed bandwidth, as well as repeated storage of a caregiver's face. Instead of the image data, the mobile electronic device124is programmed to send a message confirming that the selfie image captured by the mobile electronic device104ais of an authorized caregiver (and in some embodiments, the identity of that authorized caregiver). Caregiver assistance application124can be configured in this embodiment (as well as other embodiments) to omit any facial recognition software. It will be appreciated by those skilled in the art that other manners of verifying the caregiver's presence at the patient's bedside during the rounding task may be utilized by caregiver assistance application124, including verification techniques that do not utilize a camera. For example, in some embodiments, patient support apparatuses20include a near field transceiver and/or a short range RF transceiver (e.g. Bluetooth, or infrared) that is detectable by mobile electronic device104a. By bring the mobile electronic device104ainto sufficiently close proximity to the transceiver, the mobile electronic device104ais able to wirelessly receive a signal from the patient support apparatus20that identifies that particular patient support apparatus20and, in some embodiments, also indicates a time. Caregiver assistance application124uses the reception of that signal as verification of the caregiver's physical presence at the patient's bedside during the rounding task. The detected signal and/or the fact that the detected signal was received may be forwarded to the EMR server98at step256(FIG.6). It will also be appreciated by those skilled in the art that various other modifications may be made to rounding algorithm140. These include, but are not limited to, skipping the compliance step254completely (along with control paths280and/or282); skipping the capture verification data step252and instead proceeding directly from step250to step254; changing the order of one or more steps (e.g. step192is moved ahead of step188or154); and/or combinations of one or more of these modifications. Caregiver assistance application124is also configured to provide alerts to the caregivers at times when the caregivers may not be utilizing caregiver assistance application124for performing caregiver assistance tasks. These alerts are provided as part of the alerting algorithm149. As one example of these alerts, alerting algorithm149is configured to alert caregivers whenever a status of any of the patient support apparatuses20assigned to the caregiver changes while the bed watch feature is armed. Caregiver assistance application124may further be configured to alert the corresponding caregiver whenever any patient support apparatus20alert is issued by any of the patient support apparatuses20to which the caregiver is assigned (e.g. a patient exit alert, a cord-out alert, etc.). Such alerts may arise when the caregiver is using caregiver assistance application124for other purposes, such as one of the tasks identified in task menu174, or such alerts may arise while the caregiver is engaged in other tasks that don't involve the use of an electronic device104. Such alerts are communicated to the caregiver, in at least one embodiment, by sending a text, email, and/or automated phone call to the particular caregiver associated with the patient support apparatus20that is issuing the alert. Further, alerting algorithm149is configured to allow users to choose how such alerts are issued, in at least some embodiments. Caregivers may therefore receive a text sent to their mobile electronic device104a(or another phone capable of receiving texts), for example, if the exit detection system46of a patient support apparatus20they are responsible for is disarmed, or if the brake is disabled, or any other status changes that warrant an alert. The mobile electronic device104awill then respond to the received text (or email or phone call) with a beep, the illumination of one or more lights, or in any other manner dictated by that particular caregiver's preferences. Structural modifications may also be made to caregiver assistance system106. For example, although caregiver assistance system106has been described herein as utilizing a caregiver assistance application124executed on caregiver assistance server90and accessed by electronic devices104having conventional web-browser applications stored thereon, caregiver assistance system106may be modified to include one or more native applications that execute on the electronic devices104aorbthemselves. In some of these modified embodiments, the caregiver does not need to open up the web-browser to access caregiver assistance application124, but instead opens up a local caregiver assistance software application on the electronic device104that interacts with the caregiver assistance application124being executed on caregiver assistance server90. In such embodiments, it may be easier to provide alerts to the caregiver by having the electronic device vibrate, emit an audible sound, and/or illuminate one or more lights on the device. Such alerts may be more difficult to communicate to a caregiver when caregiver assistance system106is implemented using browser-connected electronic devices104, particularly if the caregiver has the browser application closed and/or running in the background and/or is not looking at the information currently being displayed on the screen of the electronic device104. Such native applications may be programmed for execution with the Android or iOS operating systems, or still other operating systems utilized by the electronic device104. It will be understood by those skilled in the art that, although caregiver assistance application124has been primarily described herein with reference to a single caregiver using a single electronic device104, caregiver assistance application124is not limited to use by only a single caregiver and/or a single electronic device104. Further, caregiver assistance application124is not limited to use with only a single patient support apparatus20or a single patient. Instead, caregiver assistance application124is configured to be used, if desired, with all of the patient support apparatuses20within the healthcare facility, as well any or all of the caregivers within the healthcare facility. Such use of caregiver assistance application124by multiple caregivers can occur simultaneously. That is, multiple caregivers may be logged into caregiver assistance application124at the same time. In such cases, caregiver assistance application124is configured to display the room, patient, and/or patient support apparatus information discussed above for the set of rooms, patients, and/or patient support apparatuses20assigned to that particular caregiver. In other words, each caregiver (other than those with administrative access) is only able to view the room, patient, and patient support apparatus information for the rooms and/or patients assigned to that particular caregiver. Unless otherwise configured by an authorized individual, alerts associated with those patients, rooms, and/or patient support apparatuses20are only communicated by caregiver assistance application124to the mobile electronic device104aassociated with that caregiver (and, in some cases, to the stationary electronic device104bthat is associated with that particular room or patient). Stationary electronic devices104bare typically not used to perform rounding tasks associated with a patient because they cannot be carried with the caregiver to a patient's room, and thus cannot be used to capture image information and/or perform other tasks while in the patient's room. Nevertheless, stationary electronic devices104bare capable of displaying all of the screens previously described and associated with caregiver assistance application124. Further, authorized individuals136can configure caregiver assistance application124as they see fit with respect to what, if any, alerts are displayed on the stationary electronic devices104b. For example, if a particular stationary electronic device104bis associated with a particular wing of the healthcare facility, then the authorized individual136may configure caregiver assistance application124to notify the stationary electronic device104bwhenever any alert from any room or patient support apparatus20within that wing is issued. This can be configured even if the different rooms and/or patient support apparatuses20are assigned to different caregivers. As a result, caregiver A may receive alerts on his or her mobile electronic device104afor a first set of rooms in that particular wing; caregiver B may receive alerts on his or her mobile electronic device104afor a second set of rooms in that particular wing; and the stationary electronic device104bassociated with that wing may receive alerts for both the first and the second sets of rooms (and any other rooms in that particular wing). Still other variations are possible. The data flows of caregiver assistance system106between caregiver assistance server90, patient support apparatuses20, and electronic devices104are illustrated in greater detail inFIG.2. As shown therein, patient support apparatuses20transmit patient support apparatus messages310to patient support apparatus server86(or directly to caregiver assistance server90) via network transceivers60and wireless access points76. The patient support apparatus data contained within messages310includes such things as the status of the exit detection system46(armed or disarmed), the status of the siderails36(up or down), the status of the electrical power cord102(plugged in or not), the status of the nurse call cable78(plugged in or not), the status of the brake (on or off), the height of the litter frame28, any existing alerts, and/or other data about patient support apparatus20. Caregiver assistance server90, after receiving the data in these messages, transmits outbound messages312to selected ones of the electronic device104(FIG.2). The content of the outbound messages312includes all or selected portions of the patient support apparatus data received via messages310. The outbound messages312also include the data content for the display screens shown as part of general algorithm226and rounding algorithm140. This data content includes, among other things, the rounding questions that are identified in the rounding display screens ofFIGS.10-13, any reminders, room numbers, alerts, and other data discussed herein. Caregiver assistance server90receives inbound message314from the electronic devices104in which it is in communication (FIG.2). Inbound messages314include rounding data, patient support apparatus commands, and/or verification data. The rounding data includes the answers and/or acknowledgements corresponding to the rounding questions displayed on first through fourth rounding screens190,220,230, and240. The patient support apparatus commands include any commands input by the caregiver into the electronic device104to change a state of the corresponding patient support apparatus20. As discussed previously, such commands include commands to arm exit detection system46and/or commands to arm a bed watch system, as well as other. Inbound messages314may also include verification data, which is data gathered by mobile electronic device104athat verifies the actual physical presence of the caregiver adjacent the patient support apparatus whose patient the caregiver is performing rounding duties for. More specifically, the verification data includes the images of the QR code, bar code, patient support apparatus, and/or caregivers that are captured by the mobile electronic device104aand sent to caregiver assistance application124, as was previously described above with respect toFIGS.15-17. It will be understood that the data flows illustrated inFIG.2may be modified significantly. For example,FIG.18illustrates a caregiver assistance system106aaccording to another embodiment of the present disclosure. Caregiver assistance system106adiffers from caregiver assistance system106ofFIG.2in that caregiver assistance system106aincludes different flows of messages sent between the caregiver assistance server90, the mobile electronic devices104a, and the patient support apparatuses. Caregiver assistance system106aalso differs from caregiver assistance system106ofFIG.2in that it includes modified patient support apparatuses20athat, unlike patient support apparatuses20, include a short range transceiver320. Further aspects of caregiver assistance system106aare described below. Patient support apparatuses20aof caregiver assistance system106ainclude all of the same components of patient support apparatuses20of caregiver assistance system106. Those common components have been labeled with common numbers inFIG.2and, unless explicitly stated to the contrary below, the description of those components previously made above is equally applicable to these components. Caregiver assistance system106adiffers from caregiver assistance system106primarily in the source of the verification data that is sent by electronic device104to caregiver assistance server90. As noted, such verification data verifies that the caregiver was actually physically present adjacent a patient support apparatus20awhen he or she performed his or her rounding tasks. In system106a, the verification data comes not from the images captured and illustrated inFIGS.15-17, but from the short range transceiver320that is built into patient support apparatus20a. Short range transceiver320(FIG.18) is adapted to wirelessly communicate with electronic devices104over a relatively short range. The short range is, in some embodiments, no larger than the typical size of a healthcare facility room such that, when a caregiver leaves a particular room, the caregiver's mobile electronic device104ais no longer within range of the short range transceiver320, and therefore no longer able to communicate with the short range transceiver320. In some embodiments, short range transceiver320is an infrared transceiver adapted to communicate in line-of-sight situations with a corresponding infrared transceiver built into the mobile electronic device104a. In other embodiments, short range transceiver320is a near field transceiver adapted to communicate with a near field transceiver built into mobile electronic device104a. In still other embodiments, short range transceiver320is an RF transceiver having a relatively small power output such that communications are limited to within a short range of patient support apparatus20a. Such RF transceivers may include, but are not limited to, Bluetooth transceivers. Regardless of the specific short range transceiver320utilized by patient support apparatus20a, controller48of patient support apparatus20ais configured to transmit one or more patient support apparatus messages322using transceiver320to a nearby mobile electronic device104a(FIG.18). The messages322contain one or more of the following pieces of information: the unique identifier186of the corresponding patient support apparatus20a; the current time; and/or sufficient patient support apparatus data to indicate whether the current status of the patient support apparatus20is in compliance with its desired settings or not. This information is transmitted periodically and repetitively in some embodiments of patient support apparatus20a. In other embodiments, this information is transmitted only in response to an interrogation signal received from a mobile electronic device104a. In still other embodiments, this information may be transmitted both repetitively and in response to interrogation signals. Mobile electronic device104areceives message(s)322when it is positioned within the vicinity of patient support apparatus20a(FIG.18). Mobile electronic device104auses the message322for carrying out the verification and/or compliance steps of rounding algorithm140. That is, in some embodiments, messages322are sent and captured by mobile electronic device104aas part of step252of algorithm140. The sending of messages322to mobile electronic device104atakes the place of, or in some embodiments supplements, the capturing of image data that otherwise occurs at step252of algorithm140. Mobile electronic device104auses the messages322, particularly the patient support apparatus ID and/or time, to verify that it was physically present adjacent patient support apparatus20awhen the rounding occurred. This verification is handled, in some embodiments, internally via the programming of caregiver assistance application124such that the caregiver does not need to enter any information, or take any manual steps (other than positioning mobile electronic device104awithin range of transceiver320) for this verification data to be received by mobile electronic device104aand forwarded to caregiver assistance application124. In other embodiments, in order to prevent a user (or electronic device104a) from modifying the data contained within messages322, the data is encrypted with an encryption algorithm that caregiver assistance application124is able to decrypt, but not mobile electronic device104a. In still other embodiments, patient support apparatus20amay be further modified to send a second message to caregiver assistance application124via network transceiver60whenever it transmits message322via short range transceiver320. This second message confirms to caregiver assistance application124that message322was sent and, in some embodiments, contains the same information. If caregiver assistance application124does not receive this second message, it does not accept the verification data sent from mobile electronic device104a. Message322(FIG.18) may also include patient support apparatus data. In some embodiments, the patient support apparatus data only includes an indicator indicating whether the patient support apparatus20is in a compliant or non-compliant state. In other embodiments, the patient support apparatus data includes actual data about the state of the components of the patient support apparatus20and the determination of whether the patient support apparatus is in a compliant or non-compliant state is made by caregiver assistance application124based on the data communicated in message322, as well as data stored in local rules repository126defining the criteria for compliance. In either embodiment, the patient support apparatus data sent in message322is used by algorithm140to perform step254(FIG.6). In some embodiments, message322may also include the current time. If included, this time information is also forwarded to caregiver assistance application124. Caregiver assistance application124uses this time information to confirm the time that the caregiver was actually present at the patient's bedside. This time information is sent to EMR server98in some embodiments. In other embodiments, patient support apparatus20may skip transmitting a time in message322and mobile electronic device104amay append a time of receipt of message322in the data it sends to caregiver assistance application124. As yet another alternative, both patient support apparatus20and mobile electronic device104amay omit sending any time information and caregiver assistance application124can instead record the time at which it receives the inbound messages314from mobile electronic device104a. In any of these embodiments (which may be wholly or partially combined), the time is used by caregiver assistance application124to determine and/or record when the caregiver completed his or her rounding task for the particular patient assigned to the patient support apparatus20that sent message322. FIG.19illustrates a caregiver assistance system106baccording to another embodiment of the present disclosure. Caregiver assistance system106bdiffers from caregiver assistance systems106and106aofFIGS.2and18, respectively, in that mobile electronic device104asends an electronic device message324to patient support apparatus20athat is used by caregiver assistance system106bfor verifying that the caregiver was present at the patient's bedside during the caregiver's performance of his or her rounding duties. As shown more clearly inFIG.19, mobile electronic device104ais adapted in caregiver assistance system106bto send out a short range message324to a nearby short-range transceiver320of patient support apparatus20a. The short range message324is sent as a result of any one or more of the following: in response to a user manipulating an input on mobile electronic device104a, an expiration of a periodic time interval, an interrogation signal sent from short range transceiver320of patient support apparatus20a, a signal from RTLS server100to mobile electronic device104aindicating that it is currently in a room with one or more patient support apparatuses20a, a combination of one or more of these triggering conditions, and/or in response to still other triggering conditions. The content of electronic device message324includes a unique identifier that uniquely identifies the mobile electronic device104a. This may be a serial number of the device104a, a MAC address, or some other identifier that distinguishes that particular mobile electronic device104afrom other mobile or stationary electronic devices104a,104bthat are part of system106b, and/or other electronic devices that are not part of system106bbut which may utilize the same protocol and/or communication channel as transceiver320. As with patient support apparatus message322(FIG.18), electronic device message324may be sent via infrared, near field communication, low power RF (e.g. Bluetooth), or some other protocol that limits the range of message324such that it is not detected by patient support apparatuses20athat are positioned outside of the room in which the caregiver is currently located. In response to receiving the electronic device message324, controller48of patient support apparatus20aforwards a message to caregiver assistance application124informing application124of the receipt of the message324, including the mobile ID contained within the message324. Caregiver assistance application124uses the receipt of this information at step252of rounding algorithm140. That is, caregiver assistance application124waits for receipt of this message from patient support apparatus20aand, if it does not receive it, it concludes that there has been no verification of the caregiver's presence beside the patient when performing his or her rounding task. If the caregiver assistance application124receives the message, then it concludes that there has been verification and proceeds to step254of algorithm140. In some embodiments, caregiver assistance application124proceeds from step250directly to step254and doesn't wait for the receipt of the mobile ID from patient support apparatus20. In such embodiments, caregiver assistance application124checks to see if the mobile ID has been received from the patient support apparatus20aafter performing step254and/or the steps of path280and/or282have been completed (but prior to step256). In the caregiver assistance system106bofFIG.19, mobile electronic device104adoes not need to include any verification data in the inbound messages314it sends to caregiver assistance server90because such verification data is contained within the patient support apparatus messages310sent by network transceiver60. In some embodiments, the verification data contained within message310includes only the mobile electronic device ID, while in other embodiments, the verification data includes additional information, such as, but not limited to, the time at which the electronic device message324was received. Of course, all of the messages310sent from patient support apparatus20a(and patient support apparatuses20) via network transceiver60to caregiver assistance server90include the patient support apparatus ID. In the caregiver assistance system106bofFIG.19, the messages314sent by mobile electronic device104ato caregiver assistance server90may omit patient support apparatus data that is used to determine whether the patient support apparatus20ais in a compliant state or not. This information may be omitted because patient support apparatus20asends its status data directly via messages310, and this status data is used by caregiver assistance application124to determine at step254whether the patient support apparatus20ais in a compliant state or not. Caregiver assistance system106bofFIG.19may be modified to replace the short range communication between mobile electronic device104aand transceiver320of patient support apparatus20a. In such modified embodiments, rather than having a wireless signal transmitted to patient support apparatus20ato verify the caregiver's presence adjacent the patient support apparatus20a, the patient support apparatus20ais modified to accept a physical input from the caregiver, such as a button, switch, or the like, that the caregiver presses during the rounding task. The physical input may be included as an icon on a touchscreen of patient support apparatus20a, or it may be a dedicated control, or it may some combination of the two. As an alternative to a physical input, a wireless signal may be utilized for verification purposes that does not involve mobile electronic device104a. For example, the input may involve a caregiver swiping a card with a magnetic strip along a card reader built into patient support apparatus20a, or it may involve positioning a near field communication card adjacent a near field communication transceiver built into patient support apparatus20a. Still other variations are possible. Regardless of how the input to patient support apparatus20is implemented, when the caregiver physically or wirelessly activates the verification control on patient support apparatus20a, controller48sends a message310to caregiver assistance application124that includes verification data indicating that the caregiver was present adjacent patient support apparatus20a. The message310may include a time at which the verification input was activated by the caregiver. In this modified embodiment of system106b, short range transceiver320of patient support apparatus20amay be omitted and/or modified, and mobile electronic device104aneed not include a transceiver that is compatible with transceiver320. FIG.20illustrates another caregiver assistance system106caccording to yet another embodiment of the present disclosure. Caregiver assistance system106cdiffers from caregiver assistance systems106,106a, and106bofFIGS.2,18, and19, respectively, in that mobile electronic device104adoes not send any rounding data, commands, and/or patient support apparatus data back to caregiver assistance application124. Instead, such data is communicated to caregiver assistance server90via patient support apparatus20a. Caregiver assistance system106calso differs from the other caregiver assistance systems106,106a, and106bin that it can utilize either patient support apparatus20or patient support apparatus20a. That is, the patient support apparatuses usable with caregiver assistance system106ccan include short range transceiver320, or they may omit short range transceiver320. Indeed, in some embodiments, caregiver assistance system106cmay be implemented in a healthcare facility wherein some of the patient support apparatuses includes short range transceiver320and others do not. In the embodiment ofFIG.20, system106cuses mobile electronic devices104a(and/or stationary electronic devices104b(not shown)) primarily to display information regarding the patient support apparatuses20and/or20a, as well as, in some embodiments, to display rounding information. The caregiver, however, does not utilize mobile electronic device104a(or device104b) to input rounding information, verification data, and/or compliance data. Instead, all of this data is entered onto a user interface of patient support apparatus20or20a. Stated alternatively, in the embodiment of caregiver assistance system106cofFIG.20, all of the screens shown in at leastFIGS.10-14are adapted to be displayed on the display70of patient support apparatus20, or20a, rather than (or in addition to) the display of the electronic devices104. Controller48of system106cis therefore configured to execute a software application that displays the information shown inFIGS.10-14on display70and provides the same functionality as those screens. The caregiver, for example, enters the patient's pain level using plus and minus icons210and212and a next icon214that are displayed on display screen70of the corresponding patient support apparatus20or20a(seeFIG.10). In the embodiment ofFIG.20, mobile electronic device104adoes not need to receive any compliance data from the patient support apparatus20or20abecause this information is sent from the patient support apparatus to caregiver assistance application124(via messages310). Indeed, in some embodiments, mobile electronic devices104amay be dispensed with entirely, or used only to receive alerts and/or status updates. Alternatively, mobile electronic devices104amay be used to display information about the rounding status and/or patient support apparatus status, but not accept any inputs regarding patient rounding (and, in some embodiments, not accept any commands for commanding the patient support apparatus). In the embodiment ofFIG.20, patient support apparatus20or20amay be configured to require a user to enter a username and/or a password before allowing the caregiver to input the rounding information into patient support apparatus20or20a. Such access may be carried out in the same or similar manner to what is illustrated inFIGS.7and8. Alternatively, in some embodiments, patient support apparatus20or20amay be configured to allow the caregiver to enter rounding data without first establishing his or her credentials. In the caregiver assistance system106cofFIG.20, neither mobile electronic device104anor patient support apparatus20(or20a) sends any verification data to caregiver assistance server90. This is because the rounding data comes to caregiver assistance server90via messages310from patient support apparatus20or20a. Because such messages310are specifically received from patient support apparatus20or20a, and are only sent in response to the caregiver manipulating one or more controls on the patient support apparatus20or20a, the very sending of such messages310is verification that the caregiver is present adjacent the patient support apparatus20or20a. In other words, because messages310originate from patient support apparatuses20or20ain response to caregiver actions, such messages inherently provide their own verification of the caregiver's presence. It will be understood that caregiver assistance system106cofFIG.20may be modified in a number of different manners. For example, in at least one modified embodiment, rounding algorithm140is modified so that no rounding questions are displayed and/or caregiver assistance application124does not wait for receipt of any answers for the rounding questions. In this modified embodiment, it is assumed that the caregivers will ask the proper questions while they are present in the patient's room. Therefore, system106cassumes that rounding questions and rounding tasks are properly asked and implemented whenever the caregiver is present in a patient's room. As a result of this assumption, this modified embodiment of system106cconcludes that a caregiver has properly performed a rounding task whenever his or her presence within a patient's room is detected (while the patient is present in that room). Accordingly, in this modified embodiment, patient support apparatus20or20ais configured to send a message310to caregiver assistance server90whenever it detects the presence of a caregiver. The message includes data indicating the detection of the caregiver's presence, and caregiver assistance application124interprets this data as an indication that the caregiver has completed a round with that particular patient. In this modified embodiment of system106c, the presence of a caregiver within a room can be detected in a variety of different manners. In one implementation, patient support apparatus20or20ais modified to send a message310whenever a button or control is activated on one of the caregiver control panels42aor42c. For example, if the scale controls are used to weigh the patient, or a therapy control is used to implement a mattress therapy, or the exit detection system is armed, controller48of patient support apparatus20or20asends a message310to caregiver assistance server indicating that a caregiver has activated a control on patient support apparatus20or20a. The message310is sent because system106cassumes that such button or control activations are the result of a caregiver's actions, not the patient's actions. As a result, the message310includes data indicating that a caregiver is present in the room. The message310may include data identifying the specific control that has been activated and/or a time at which the control was activated. Alternatively, message310may simply indicate that a caregiver control was activated without specifying which one and/or without specifying a time. In another implementation of this modified embodiment of system106c, the caregiver carries a card (an RF ID card, a card with a magnetic strip, a near field communication card, or another type of card) that is detected by a corresponding sensor on the patient support apparatus20or20awhen the caregiver is within relatively close proximity to the patient support apparatus20or20a(e.g. within the same room, or closer). In response to detecting the card, patient support apparatus20or20asends a message310to caregiver assistance application124indicating the presence of the caregiver, and caregiver assistance application124treats that message310as proof that the caregiver has completed a round with the patient. The message310may also include patient support apparatus data that caregiver assistance application124uses to determine if the patient support apparatus20or20ais in a compliant or non-compliant state. This data (the compliancy data and rounding completion data) is then sent to EMR server98, as discussed above with respect to step256of algorithm140. In this modified embodiment of caregiver assistance system106c, patient support apparatus20(or20a) and/or mobile electronic device104acan be designed to omit the display of any rounding questions and/or rounding related screens shown inFIGS.10-17. In other words, in this modified embodiment, because the caregiver is assumed to perform his/her rounding duties correctly whenever present in the patient's room, there is no need to display the questions shown inFIGS.10-13and/or receive answers to those questions. The display of these screens can therefore be omitted. Further, there is no need to include verification screens15-17because the caregiver's presence is inherently verified in this embodiment (i.e. the caregiver's presence is the trigger in this embodiment for concluding that a rounding task has been completed). Indeed, in this embodiment, the web API132of caregiver assistance server90can be omitted entirely, if desired, along with need for any devices (electronic devices104a,104b, or patient support apparatuses20or20a) to log into this modified version of system106c. It will be understood by those skilled in the art that any of the components, functions, and/or features of the different embodiments of caregiver assistance systems106,106a,106b, and106cmay be combined together, substituted, and/or mixed in any manner. As but one non-limited example, system106may be modified to omit the display of any rounding questions, similar to modified system106c, and the patient support apparatuses20of system106may be modified to display a code that identifies the bed and the current time. In this modified system, the caregiver is assumed to ask the desired rounding questions and take care of the desired rounding tasks, and the modified system merely verifies the caregiver's presence in the patient's rooms. This presence is verified by the modified patient support apparatus displaying the code and the caregiver capturing an image of this code using his or her mobile electronic device104athat sends the captured image to caregiver assistance server90. In some embodiments, the code includes both the bed ID and time, while in other embodiments the code includes only the bed ID. In still other embodiments, the bed ID and/or time are not coded at all, but merely displayed so that an image of them can be captured by the caregiver's mobile electronic device104a. In a variation on this embodiment, the patient support apparatus20may be configured to not display the ID and/or time (or the code) or the patient support apparatus ID if the patient support apparatus is not currently in a compliant state, or it may simultaneously display the fact that it is not in a compliant state along with the ID and/or time (or a code with such information). It will also be understood that, in any of the embodiments discussed above that utilize one or more near field transceivers incorporated into any of the patient support apparatuses20or20a, such patient support apparatuses20or20amay constructed to include such near field transceivers and/or utilize the near field transceivers in any of the manners disclosed in commonly assigned U.S. Pat. No. 9,966,997 issued May 8, 2018, to inventors Michael Hayes et al. and entitled COMMUNICATION SYSTEMS FOR PATIENT SUPPORT APPARATUSES, the complete disclosure of which is incorporated herein by reference. Various additional alterations and changes beyond those already mentioned herein can be made to the above-described embodiments. This disclosure is presented for illustrative purposes and should not be interpreted as an exhaustive description of all embodiments or to limit the scope of the claims to the specific elements illustrated or described in connection with these embodiments. For example, and without limitation, any individual element(s) of the described embodiments may be replaced by alternative elements that provide substantially similar functionality or otherwise provide adequate operation. This includes, for example, presently known alternative elements, such as those that might be currently known to one skilled in the art, and alternative elements that may be developed in the future, such as those that one skilled in the art might, upon development, recognize as an alternative. Any reference to claim elements in the singular, for example, using the articles “a,” “an,” “the” or “said,” is not to be construed as limiting the element to the singular. | 177,012 |
11862334 | DETAILED DESCRIPTION Aspects of this disclosure involve obtaining, storing, and/or processing athletic data relating to the physical movements of an athlete. The athletic data may be actively or passively sensed and/or stored in one or more non-transitory storage mediums. Still further aspects relate to using athletic data to generate an output, such as for example, calculated athletic attributes, feedback signals to provide guidance, and/or other information. These and other aspects will be discussed in the context of the following illustrative examples of a personal training system. In the following description of the various embodiments, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration various embodiments in which aspects of the disclosure may be practiced. It is to be understood that other embodiments may be utilized and structural and functional modifications may be made without departing from the scope and spirit of the present disclosure. Further, headings within this disclosure should not be considered as limiting aspects of the disclosure and the example embodiments are not limited to the example headings. I. Example Personal Training System A. Illustrative Networks Aspects of this disclosure relate to systems and methods that may be utilized across a plurality of networks. In this regard, certain embodiments may be configured to adapt to dynamic network environments. Further embodiments may be operable in differing discrete network environments.FIG.1illustrates an example of a personal training system100in accordance with example embodiments. Example system100may include one or more interconnected networks, such as the illustrative body area network (BAN)102, local area network (LAN)104, and wide area network (WAN)106. As shown inFIG.1(and described throughout this disclosure), one or more networks (e.g., BAN102, LAN104, and/or WAN106) may overlap or otherwise be inclusive of each other. Those skilled in the art will appreciate that the illustrative networks102-106are logical networks that may each comprise one or more different communication protocols and/or network architectures and yet may be configured to have gateways to each other or other networks. For example, each of BAN102, LAN104and/or WAN106may be operatively connected to the same physical network architecture, such as cellular network architecture108and/or WAN architecture110. For example, portable electronic device112, which may be considered a component of both BAN102and LAN104, may comprise a network adapter or network interface card (NIC) configured to translate data and control signals into and from network messages according to one or more communication protocols, such as the Transmission Control Protocol (TCP), the Internet Protocol (IP), and the User Datagram Protocol (UDP), through one or more of architectures108and/or110. These protocols are well known in the art, and thus will not be discussed here in more detail. Network architectures108and110may include one or more information distribution network(s), of any type(s) or topology(s), alone or in combination(s), such as for example, cable, fiber, satellite, telephone, cellular, wireless, etc., and as such, may be variously configured such as having one or more wired or wireless communication channels (including but not limited to: WiFi®, Bluetooth®, Near-Field Communication (NFC) and/or ANT technologies). Thus, any device within a network ofFIG.1(such as portable electronic device112or any other device described herein) may be considered inclusive to one or more of the different logical networks102-106. With the foregoing in mind, example components of an illustrative BAN102and LAN104(which may be coupled to WAN106) will be described. 1. Example Local Area Network LAN104may include one or more electronic devices, such as computer device114. Computer device114, or any other component of system100, may comprise a mobile terminal, such as a telephone, music player, tablet, netbook or any portable device. In other embodiments, computer device114may comprise a media player or recorder, desktop computer, server(s), a gaming console, such as for example, a Microsoft® XBOX, Sony® Playstation, and/or a Nintendo® Wii gaming consoles. Those skilled in the art, given benefit of this disclosure, will appreciate that these are merely example devices for descriptive purposes and this disclosure is not limited to any console or computing device. Those skilled in the art, given benefit of this disclosure, will appreciate that the design and structure of computer device114may vary depending on several factors, such as its intended purpose. One example implementation of computer device114is provided inFIG.2, which illustrates a block diagram of computing device200. Those skilled in the art will appreciate that the disclosure ofFIG.2may be applicable to any device disclosed herein. Device200may include one or more processors, such as processor202-1and202-2(generally referred to herein as “processors202” or “processor202”). Processors202may communicate with each other or other components via an interconnection network or bus204. Processor202may include one or more processing cores, such as cores206-1(referred to herein as “cores206” or more generally as “core206”), which may be implemented on a single integrated circuit (IC) chip. Cores206may comprise a shared cache208and/or a private cache (e.g., caches210-1). One or more caches208/210may locally cache data stored in a system memory, such as memory212, for faster access by components of the processor202. Memory212may be in communication with the processors202via a chipset216. Cache208may be part of system memory212in certain embodiments. Memory212may include, but is not limited to, random access memory (RAM), read only memory (ROM), and may include one or more of solid-state memory, optical or magnetic storage, and/or any other medium that can be used to store electronic information. Yet other embodiments may omit system memory212. System200may include one or more I/O devices (e.g., I/O devices214-1, each generally referred to as I/O device214). I/O data from one or more I/O devices214may be stored at one or more caches208,210and/or system memory212. Each of I/O devices214may be permanently or temporarily configured to be in operative communication with a component of system100using any physical or wireless communication protocol. Returning toFIG.1, four example I/O devices (shown as elements116-122) are shown as being in communication with computer device114. Those skilled in the art will appreciate that one or more of devices116-122may be stand-alone devices or may be associated with another device besides computer device114. For example, one or more I/O devices may be associated with or interact with a component of BAN102and/or WAN106. I/O devices116-122may include, but are not limited to, athletic data acquisition units, such as for example, sensors. One or more I/O devices may be configured to sense, detect, and/or measure an athletic parameter from a user, such as user124. Examples include, but are not limited to: an accelerometer, a gyroscope, a location-determining device (e.g., GPS), a light (including non-visible light) sensor, a temperature sensor (including ambient temperature and/or body temperature), sleep pattern sensors, a heart rate monitor, an image-capturing sensor, a moisture sensor, a force sensor, a compass, an angular rate sensor, and/or combinations thereof, among others. In further embodiments, I/O devices116-122may be used to provide an output (e.g., audible, visual, or tactile cue) and/or receive an input, such as a user input from athlete124. Example uses for these illustrative I/O devices are provided below, however, those skilled in the art will appreciate, given benefit of this disclosure, that such discussions are merely descriptive of some of the many options within the scope of this disclosure. Further, reference to any data acquisition unit, I/O device, or sensor is to be interpreted as disclosing an embodiment that may have one or more I/O device, data acquisition unit, and/or sensor disclosed herein or known in the art (either individually or in combination). Information from one or more devices (across one or more networks) may be used to provide (or be utilized in the formation of) a variety of different parameters, metrics or physiological characteristics including but not limited to: motion parameters, such as speed, acceleration, distance, steps taken, direction, relative movement of certain body portions or objects to others, or other motion parameters which may be expressed as angular rates, rectilinear rates or combinations thereof; physiological parameters, such as calories, heart rate, sweat detection, effort, oxygen consumed, and oxygen kinetics; and other metrics that may fall within one or more categories, such as: pressure, impact forces, information regarding the athlete, such as height, weight, age, and demographic information; and combinations thereof. System100may be configured to transmit and/or receive athletic data, including the parameters, metrics, or physiological characteristics collected within system100or otherwise provided to system100. As one example, WAN106may comprise server111. Server111may have one or more components of system200ofFIG.2. In one embodiment, server111comprises at least a processor and a memory, such as processor206and memory212. Server111may be configured to store computer-executable instructions on a non-transitory computer-readable medium. The instructions may comprise athletic data, such as raw or processed data collected within system100. System100may be configured to transmit data, such as flight time, to a social networking website or host such a site. Server111may be utilized to permit one or more users to access and/or compare athletic data. As such, server111may be configured to transmit and/or receive notifications based upon athletic data or other information. Returning to LAN104, computer device114is shown in operative communication with a display device116, an image-capturing device118, sensor120, and exercise device122, which are discussed in turn below with reference to example embodiments. In one embodiment, display device116may provide audio-visual cues to athlete124to perform a specific athletic movement. The audio-visual cues may be provided in response to computer-executable instruction executed on computer device114or any other device, including a device of BAN102and/or WAN106. Display device116may be a touchscreen device or otherwise configured to receive a user-input. In one embodiment, data may be obtained from image-capturing device118and/or other sensors, such as sensor120, which may be used to detect (and/or measure) athletic parameters, either alone or in combination with other devices, or stored information. Image-capturing device118and/or sensor120may comprise a transceiver device. In one embodiment sensor128may comprise an infrared (IR), electromagnetic (EM) or acoustic transceiver. For example, image-capturing device118, and/or sensor120may transmit waveforms into the environment, including toward the direction of athlete124and receive a “reflection” or otherwise detect alterations of those released waveforms. Those skilled in the art will readily appreciate that signals corresponding to a multitude of different data spectrums may be utilized in accordance with various embodiments. In this regard, devices118and/or120may detect waveforms emitted from external sources (e.g., not system100). For example, devices118and/or120may detect heat being emitted from user124and/or the surrounding environment. Thus, image-capturing device126and/or sensor128may comprise one or more thermal imaging devices. In one embodiment, image-capturing device126and/or sensor128may comprise an IR device configured to perform range phenomenology. In one embodiment, exercise device122may be any device configurable to permit or facilitate the athlete124performing a physical movement, such as a treadmill, a step machine, etc. There is no requirement that the device be stationary. In this regard, wireless technologies permit portable devices to be utilized, thus a bicycle or other mobile exercising device may be utilized in accordance with certain embodiments. Those skilled in the art will appreciate that equipment122may be or comprise an interface for receiving an electronic device containing athletic data performed remotely from computer device114. For example, a user may use a sporting device (described below in relation to BAN102) and upon returning home or the location of equipment122, download athletic data into element122or any other device of system100. Any I/O device disclosed herein may be configured to receive activity data. 2. Body Area Network BAN102may include two or more devices configured to receive, transmit, or otherwise facilitate the collection of athletic data (including passive devices). Exemplary devices may include one or more data acquisition units, sensors, or devices known in the art or disclosed herein, including but not limited to I/O devices116-122. Two or more components of BAN102may communicate directly, yet in other embodiments, communication may be conducted via a third device, which may be part of BAN102, LAN104, and/or WAN106. One or more components of LAN104or WAN106may form part of BAN102. In certain implementations, whether a device, such as portable device112, is part of BAN102, LAN104, and/or WAN106, may depend on the athlete's proximity to an access point to permit communication with mobile cellular network architecture108and/or WAN architecture110. User activity and/or preference may also influence whether one or more components are utilized as part of BAN102. Example embodiments are provided below. User124may be associated with (e.g., possess, carry, wear, and/or interact with) any number of devices, such as portable device112, shoe-mounted device126, wrist-worn device128and/or a sensing location, such as sensing location130, which may comprise a physical device or a location that is used to collect information. One or more devices112,126,128, and/or130may not be specially designed for fitness or athletic purposes. Indeed, aspects of this disclosure relate to utilizing data from a plurality of devices, some of which are not fitness devices, to collect, detect, and/or measure athletic data. In certain embodiments, one or more devices of BAN102(or any other network) may comprise a fitness or sporting device that is specifically designed for a particular sporting use. As used herein, the term “sporting device” includes any physical object that may be used or implicated during a specific sport or fitness activity. Exemplary sporting devices may include, but are not limited to: golf balls, basketballs, baseballs, soccer balls, footballs, powerballs, hockey pucks, weights, bats, clubs, sticks, paddles, mats, and combinations thereof. In further embodiments, exemplary fitness devices may include objects within a sporting environment where a specific sport occurs, including the environment itself, such as a goal net, hoop, backboard, portions of a field, such as a midline, outer boundary marker, base, and combinations thereof. In this regard, those skilled in the art will appreciate that one or more sporting devices may also be part of (or form) a structure and vice-versa, a structure may comprise one or more sporting devices or be configured to interact with a sporting device. For example, a first structure may comprise a basketball hoop and a backboard, which may be removable and replaced with a goal post. In this regard, one or more sporting devices may comprise one or more sensors, such as one or more of the sensors discussed above in relation toFIGS.1-3, that may provide information utilized, either independently or in conjunction with other sensors, such as one or more sensors associated with one or more structures. For example, a backboard may comprise a first sensor configured to measure a force and a direction of the force by a basketball upon the backboard and the hoop may comprise a second sensor to detect a force. Similarly, a golf club may comprise a first sensor configured to detect grip attributes on the shaft and a second sensor configured to measure impact with a golf ball. Looking to the illustrative portable device112, it may be a multi-purpose electronic device, that, for example, includes a telephone or digital music player, including an IPOD®, IPAD®, or iPhone®, brand devices available from Apple, Inc. of Cupertino, California or Zune® or Microsoft® Windows devices available from Microsoft of Redmond, Washington. As known in the art, digital media players can serve as an output device, input device, and/or storage device for a computer. Device112may be configured as an input device for receiving raw or processed data collected from one or more devices in BAN102, LAN104, or WAN106. In one or more embodiments, portable device112may comprise one or more components of computer device114. For example, portable device112may be include a display116, image-capturing device118, and/or one or more data acquisition devices, such as any of the I/O devices116-122discussed above, with or without additional components, so as to comprise a mobile terminal. a. Illustrative Apparel/Accessory Sensors In certain embodiments, I/O devices may be formed within or otherwise associated with user's124clothing or accessories, including a watch, armband, wristband, necklace, shirt, shoe, or the like. These devices may be configured to monitor athletic movements of a user. It is to be understood that they may detect athletic movement during user's124interactions with computer device114and/or operate independently of computer device114(or any other device disclosed herein). For example, one or more devices in BAN102may be configured to function as an all-day activity monitor that measures activity regardless of the user's proximity or interactions with computer device114. It is to be further understood that the sensory system302shown inFIG.3and the device assembly400shown inFIG.4, each of which are described in the following paragraphs, are merely illustrative examples. i. Shoe-Mounted Device In certain embodiments, device126shown inFIG.1, may comprise footwear which may include one or more sensors, including but not limited to those disclosed herein and/or known in the art.FIG.3illustrates one example embodiment of a sensor system302providing one or more sensor assemblies304. Assembly304may comprise one or more sensors, such as an accelerometer, a gyroscope, location-determining components, force sensors and/or or any other sensor disclosed herein or known in the art. In the illustrated embodiment, assembly304incorporates a plurality of sensors, which may include force-sensitive resistor (FSR) sensors306; however, other sensor(s) may be utilized. Port308may be positioned within a sole structure309of a shoe, and is generally configured for communication with one or more electronic devices. Port308optionally may be provided to be in communication with an electronic module310, and the sole structure309optionally may include a housing311or other structure to receive the module310. The sensor system302also may include a plurality of leads312connecting the FSR sensors306to the port308, to enable communication with the module310and/or another electronic device through the port308. Module310may be contained within a well or cavity in a sole structure of a shoe, and the housing311may be positioned within the well or cavity. In one embodiment, at least one gyroscope and at least one accelerometer are provided within a single housing, such as module310and/or housing311. In at least a further embodiment, one or more sensors are provided that, when operational, are configured to provide directional information and angular rate data. The port308and the module310include complementary interfaces314,316for connection and communication. In certain embodiments, at least one force-sensitive resistor306shown inFIG.3may contain first and second electrodes or electrical contacts318,320and a force-sensitive resistive material322disposed between the electrodes318,320to electrically connect the electrodes318,320together. When pressure is applied to the force-sensitive material322, the resistivity and/or conductivity of the force-sensitive material322changes, which changes the electrical potential between the electrodes318,320. The change in resistance can be detected by the sensor system302to detect the force applied on the sensor316. The force-sensitive resistive material322may change its resistance under pressure in a variety of ways. For example, the force-sensitive material322may have an internal resistance that decreases when the material is compressed. Further embodiments may utilize “volume-based resistance”, which may be implemented through “smart materials.” As another example, the material322may change the resistance by changing the degree of surface-to-surface contact, such as between two pieces of the force sensitive material322or between the force sensitive material322and one or both electrodes318,320. In some circumstances, this type of force-sensitive resistive behavior may be described as “contact-based resistance.” ii. Wrist-Worn Device As shown inFIG.4, device400(which may resemble or comprise sensory device128shown inFIG.1), may be configured to be worn by user124, such as around a wrist, arm, ankle, neck or the like. Device400may include an input mechanism, such as a depressible input button402configured to be used during operation of the device400. The input button402may be operably connected to a controller404and/or any other electronic components, such as one or more of the elements discussed in relation to computer device114shown inFIG.1. Controller404may be embedded or otherwise part of housing406. Housing406may be formed of one or more materials, including elastomeric components and comprise one or more displays, such as display408. The display408may be considered an illuminable portion of the device400. The display408may include a series of individual lighting elements or light members such as LED lights410. The lights may be formed in an array and operably connected to the controller404. Device400may include an indicator system412, which may also be considered a portion or component of the overall display408. Indicator system412can operate and illuminate in conjunction with the display408(which may have pixel member414) or completely separate from the display408. The indicator system412may also include a plurality of additional lighting elements or light members, which may also take the form of LED lights in an exemplary embodiment. In certain embodiments, indicator system may provide a visual indication of goals, such as by illuminating a portion of lighting members of indicator system412to represent accomplishment towards one or more goals. Device400may be configured to display data expressed in terms of activity points or currency earned by the user based on the activity of the user, either through display408and/or indicator system412. A fastening mechanism416can be disengaged wherein the device400can be positioned around a wrist or portion of the user124and the fastening mechanism416can be subsequently placed in an engaged position. In one embodiment, fastening mechanism416may comprise an interface, including but not limited to a USB port, for operative interaction with computer device114and/or devices, such as devices120and/or112. In certain embodiments, fastening member may comprise one or more magnets. In one embodiment, fastening member may be devoid of moving parts and rely entirely on magnetic forces. In certain embodiments, device400may comprise a sensor assembly (not shown inFIG.4). The sensor assembly may comprise a plurality of different sensors, including those disclosed herein and/or known in the art. In an example embodiment, the sensor assembly may comprise or permit operative connection to any sensor disclosed herein or known in the art. Device400and or its sensor assembly may be configured to receive data obtained from one or more external sensors. iii. Apparel and/or Body Location Sensing Element130ofFIG.1shows an example sensory location which may be associated with a physical apparatus, such as a sensor, data acquisition unit, or other device. Yet in other embodiments, it may be a specific location of a body portion or region that is monitored, such as via an image capturing device (e.g., image capturing device118). In certain embodiments, element130may comprise a sensor, such that elements130aand130bmay be sensors integrated into apparel, such as athletic clothing. Such sensors may be placed at any desired location of the body of user124. Sensors130a/bmay communicate (e.g., wirelessly) with one or more devices (including other sensors) of BAN102, LAN104, and/or WAN106. In certain embodiments, passive sensing surfaces may reflect waveforms, such as infrared light, emitted by image-capturing device118and/or sensor120. In one embodiment, passive sensors located on user's124apparel may comprise generally spherical structures made of glass or other transparent or translucent surfaces which may reflect waveforms. Different classes of apparel may be utilized in which a given class of apparel has specific sensors configured to be located proximate to a specific portion of the user's124body when properly worn. For example, golf apparel may include one or more sensors positioned on the apparel in a first configuration and yet soccer apparel may include one or more sensors positioned on apparel in a second configuration. FIG.5shows illustrative locations for sensory input (see, e.g., sensory locations130a-130o). In this regard, sensors may be physical sensors located on/in a user's clothing, yet in other embodiments, sensor locations130a-130omay be based upon identification of relationships between two moving body parts. For example, sensor location130amay be determined by identifying motions of user124with an image-capturing device, such as image-capturing device118. Thus, in certain embodiments, a sensor may not physically be located at a specific location (such as one or more of sensor locations130a-130o), but is configured to sense properties of that location, such as with image-capturing device118or other sensor data gathered from other locations. In this regard, the overall shape or portion of a user's body may permit identification of certain body parts. Regardless of whether an image-capturing device is utilized and/or a physical sensor located on the user124, and/or using data from other devices, (such as sensory system302), device assembly400and/or any other device or sensor disclosed herein or known in the art is utilized, the sensors may sense a current location of a body part and/or track movement of the body part. In one embodiment, sensory data relating to location130mmay be utilized in a determination of the user's center of gravity (a.k.a, center of mass). For example, relationships between location130aand location(s)130f/130lwith respect to one or more of location(s)130m-130omay be utilized to determine if a user's center of gravity has been elevated along the vertical axis (such as during a jump) or if a user is attempting to “fake” a jump by bending and flexing their knees. In one embodiment, sensor location130nmay be located at about the sternum of user124. Likewise, sensor location130omay be located approximate to the naval of user124. In certain embodiments, data from sensor locations130m-130omay be utilized (alone or in combination with other data) to determine the center of gravity for user124. In further embodiments, relationships between multiple sensor locations, such as sensors130m-130o, may be utilized in determining orientation of the user124and/or rotational forces, such as twisting of user's124torso. Further, one or more locations, such as location(s), may be utilized as (or approximate) a center of moment location. For example, in one embodiment, one or more of location(s)130m-130omay serve as a point for a center of moment location of user124. In another embodiment, one or more locations may serve as a center of moment of specific body parts or regions. Example Metrics Calculations Aspects of this disclosure relate to systems and methods that may be utilized to calculate one or more activity metrics of an athlete, including but not limited to steps, flight time, speed, distance, pace, power, and/or others. The calculations may be performed in real time, such that the user may obtain real-time feedback during one or more activities. In certain embodiments, all calculations for a plurality of metrics may be estimated using a same set of attributes, or a sub-set of attributes from a common group of attributes, and the like. In one embodiment, a calculation of flight time may be performed on a first set of attributes and with or without classifying the activity being performed by the athlete, such as being walking, running, playing a specific sport, or conducting a specific activity. In one embodiment, determinations of flight time may be performed with or without any activity type templates, such that as the flight time may be calculated from sensor data and/or derivatives thereof, without classifying the activity type. For example, flight time may be calculated in accordance with certain embodiments using the same set of attributes regardless of whether the athlete is performing a first activity or a second activity, such as for example, walking or playing soccer or basketball. In certain implementations, calculations of flight time may be performed using a first set of attributes and another metric, such as jump height and/or speed, may be determined from the same set of attributes or a subset of the same attributes. In one embodiment, determination of a plurality of metrics may be conducted using a selection of core attributes. In one example, this attribute calculation may be used to estimate flight time and/or a jump height and/or speed of the user. In one more specific example, a flight time and/or speed may be estimated using a same set of attributes, or a sub-set of attributes from a common group of attributes, and the like. The systems and methods described herein may compare calculated attributes from activity data (real-time activity data, and the like) to one or more models wherein the one or more models may not include data captured for the activity type that the athlete performed (and may not be categorized, such as for flight time calculations). In this way, the one or more models may be agnostic to the specific activity being performed by a user. For example, an activity device may receive information from a user performing a basketball activity and at least one model may not contain any data from basketball activities. As an example of calculating multiple metrics, systems and methods may be implemented to determine whether to calculate speed for one or more time windows of data. Certain aspects of this disclosure relate to determinations of speed or distance that comprises categorizing athletic data. As discussed above, however, other aspects relate to calculating flight time values without categorizing the athletic data into activity types (walking, running, basketball, sprinting, soccer, football, etc.), however, categorizing at least a portion of the same data utilized to calculate flight time for the calculation of other metrics, such as for example, speed and/or distance is within the scope of this disclosure. In one implementation, speed (or another metric) may be determined from at least a portion of data derived from the determination of flight time values. In accordance with certain embodiments, the attributes are calculated on a single device, such as any device disclosed herein or known in the art. In one embodiment, the attributes and calculation of the metrics are calculated on a single device. In one such example, a device configured to be worn on an appendage of a user may be configured to receive sensor data and calculate the attributes and a plurality of metrics from the attributes. In one embodiment, the single device comprises at least one sensor configured capture data utilized to calculate at least one attribute. In accordance with certain embodiments, the attributes are calculated from one or more sensors located on the single device. Example Calculations One or more of the systems and methods described herein may calculate an estimate of flight time that implements at least one of the components ofFIG.6. In one configuration, a device, such as device112,126,128,130, and/or400may capture data associated with one or more activities being performed by a user, and may include one or more sensors, including, but not limited to: an accelerometer, a gyroscope, a location-determining device (e.g., GPS), a light sensor, a temperature sensor (including ambient temperature and/or body temperature), a heart rate monitor, an image-capturing sensor, a moisture sensor and/or combinations thereof. This captured activity data may, in turn, be used to calculate one or more flight time values associated with the user. In another example, the systems and methods described herein may be implemented to estimate one or more metrics from sensor data. These metrics may include, among others, an estimation of flight time, an estimation as to whether a user is running, walking, or performing other activity, and/or an estimation of a speed and a distance (a pace) which a user is moving, and the like. For example, block607of flowchart600fromFIG.6shows an example implementation of calculating flight time from one or more attributes. Separately, block603is directed to an example implementation for calculating speed, which may be determined using one or more calculated attributes, which may be derived from the same sensors, from the same data, and/or the same attributes as the flight time metric. Accordingly, the systems and methods described herein may utilize data received from one or more different sensor types, including, among others, an accelerometer, a heart rate sensor, a gyroscope, a location-determining device (e.g., GPS), a light (including non-visible light) sensor, a temperature sensor (including ambient temperature and/or body temperature), sleep pattern sensors, an image-capturing sensor, a moisture sensor, a force sensor, a compass, an angular rate sensor, and/or combinations thereof. Furthermore, while the example of attributes associated with acceleration data output from an accelerometer sensor are described, those of ordinary skill will appreciate, given benefit of this disclosure, that other sensors may be used, alone or in combination with other sensors and devices, without departing from the scope of this disclosure. For example, a heart rate monitor may be used, wherein the data output from a heart rate monitor may output data representative of a heart rate in units of beats per minute (BPM) or equivalent. Accordingly, one or more transformations may be performed on outputted heart rate data to interpolate a heart rate signal between heart rate data points, and allowing for signal dropouts at certain points. Furthermore, the attributes calculated for sensor data associated with a heart rate monitor, or any other sensor, may be the same, or may be different to those described above in relation to accelerometer data. In another implementation, the systems and methods described herein may analyze sensor data from combinations of sensors. For example, a device may receive information related to motion of two or more appendages of a user (from one or more accelerometers, and the like). In one example, the device may determine that accelerometer data may indicate that said user could not have been “in-flight” above a certain time period. In certain embodiments, all sensor data comes from a unitary device. In one example, the unitary device is an appendage-worn device. In certain configurations, the appendage worn device comprises at least one of an accelerometer, a location-determining sensor (e.g., GPS), a force sensor and a heart rate monitor. The unitary device may comprise a sensor configured to be placed on or within athletic apparel, such as a shoe. In yet another example, a sensor from at least two different devices is utilized to collect the data. In at least one embodiment, the device comprising a sensor utilized to capture data is also configured to provide an output of flight time. In one embodiment, the device (or another device) comprises a display device configured to display an output relating to flight time. In further embodiments, the device may comprise a communication element configured to transmit information relating to flight time to a remote device. In another implementation, one or more attributes may be calculated from received sensor data and used as inputs to one or more walking and/or running models for predicting, among others, a speed/pace of a user. Further details of such an implementation are described in relation to block603of flowchart600. FIG.6is a flowchart showing an exemplary implementation of attribute calculation. In one example, this attribute calculation may be used to estimate one or more metrics associated with an activity being performed by a user, wherein this estimation may include airtime, jump height, energy expenditure, speed, and/or one or more other metrics. Examples herein may be explained in relation to example metrics, such as airtime, however, other metrics are not excluded unless expressly written herein. In this regard, embodiments of the disclosed innovation relate to systems and methods that detect, measure, and/or report airtime in new and non-obvious ways when compared to the prior art. Previous attempts to incorporate airtime as a metric merely focused on flight of one or both feet in the context of jumps. For example, with reference to basketball players, prior attempts may have considered an offensive player making a jump shot or a defensive player attempting to jump up to block the shot of the offensive player to determine flight time. As would therefore be expected, such results would be highly correlated to total jumps during the same time period. In accordance with various embodiments, airtime calculations are not limited to instances in which it is determined the athlete has jumped (or is jumping). Certain embodiments may calculate airtime for instances in which at least two feet are simultaneously not contacting the ground or surface. Determinations of airtime may, therefore, comprise calculating airtime for instance of side jumps/shifts (like lateral shuffling when guarding an opponent in basketball,) as well as during instances of running, jogging, sprinting, and/or similar movements. In certain embodiments, a movement (e.g., a walk) where 2 feet never simultaneously leave the ground may not be included. In certain embodiments as generally described above, metric determinations may not be limited to calculations from two-footed jumps, in which both feet leave the surface at substantially the same time. Such jumps are often observed, for example, by basketball players while taking a shot and/or blocking a shot. In other embodiments, airtime calculations are not limited to any form of a jump, inclusive of two-footed jumps as well as one-footed jumps—in which one foot leaves the ground in advance of the other (such as, for example, when attempting a layup in a basketball game). Further aspects of this invention relate to calculating airtime from flights of one or more feet during one or more of: running or jogging. Certain embodiments may classify the activity. Information related to the movement of the user may be outputted as one or more data signals from one or more sensors associated with one or more sensor devices monitoring the user. In one implementation,FIG.6represents one or more processes carried out by at least one processor, such as processor unit202, which may be associated with a sensor device, such as, among others, device112,126,128,130, and/or400. In one implementation, one or more sensor devices may monitor one or more motions associated with one or more activities being performed by a user. In one embodiment, footwear, such as that shown inFIG.3may be utilized to capture at least a portion of the data utilized to detect when at least one foot left the ground or surface (e.g., launch), when at least one foot returned to the surface (e.g., strike) or other attributes. Various embodiments of footwear may have at least one accelerometer and/or at least one force sensor. In some performance monitoring systems and methods, devices may not directly monitor a volume of oxygen being consumed by a user during an activity. Although oxygen consumption and/or caloric burn may be useful in some instances to measure performance or fatigue, many current systems may not accurately measure the user's performance or fatigue, e.g., due to natural variations between two athletes (including but not limited to size, weight, sex, abilities, etc.). An athlete may expend calories; however, it may not translate into adequate performance. For example, a defensive basketball player may expend a lot of calories waving their arms trying to block an offensive player, however, if they are not quick on their feet, and/or move with responsiveness, that caloric expenditure may not translate into an accurate performance metric. In one arrangement, however, received activity data may be correlated with observed oxygen consumption values for activities that may exhibit certain attributes, and associated with one or more oxygen consumption models. One or more embodiments may receive sensor data from one or more sensors (see, e.g., block602). In certain embodiments, the sensor data may be associated with a device worn by a user. In one example, and as previously described, said device may be, among others, device112,126,128,130, and/or400. Accordingly, the sensor data may be received by a processor, such as processor202fromFIG.2, and may be received from one or more sensors described herein and/or known in the art. In one implementation, sensor data may be received at block602from an accelerometer located on or within footwear or otherwise at a location proximate to the athlete's foot. In one implementation employing an accelerometer, an output of an accelerometer sensor may include an acceleration value for each of three axes (x-, y-, and z-axis). Accordingly, in one implementation, a plurality of acceleration values associated with the respective axes to which an accelerometer sensor is sensitive (x-, y-, and z-axis) may be grouped as a single acceleration data point. In accordance with various embodiments, time stamped data (a.k.a. “timestamps” herein) may be received directly or indirectly from the sensor(s) and/or processed (e.g. block606). Various embodiments may receive or calculate one or more timestamps or sensor attributes, such as but not limited to one or more of the following: a foot strike timestamp, a left foot strike timestamp, a right foot strike timestamp, a launch timestamp, a left foot launch time stamp, a right foot launch timestamp, derived timestamps, such as but not limited to: a left foot launch Z-axis (vertical axis with respect to the surface the user has launched from and/or the Earth's surface) derivative max timestamp, and/or a right foot launch Z-axis derivative max timestamp. As one example, accelerometer data may be received at a frequency of, among others, 25 Hz. Additionally or alternatively, sensor data may be received from the sensor, such as accelerometer, in windows of time intervals. In one embodiment, the window (or time frame) may be about 1, 2, 3, 4 or 5 seconds in length. A window may be a period of time during which sensor data is recorded for one or more motions of a user associated with one or more activities being performed by a user. In one implementation, a sample window may include 128 samples (data points) of sensor data, wherein a sample of sensor data may include a value for each of three orthogonal axes of an accelerometer (x-axis, y-axis, and z-axis), and/or a vector normal value. In yet another implementation, sensor data received from, in one implementation, an accelerometer, may be received in windows that do not overlap and received singly, rather than simultaneously, and/or discrete from each other. However, in alternative embodiments, those of ordinary skill will readily understand, given benefit of this disclosure, that the systems and methods described herein may be employed with any frequency of operation of an accelerometer, with a window length measuring any length of time, and using any number of samples of sensor data from within a given window. Data may be validated as it is received, such as, for example, at block604. Data validation may include, among others, a comparison of one or more values of received sensor data to one or more threshold values, and the like. Embodiments may compare one or more strike times against launch times to filter out erroneous data. Further aspects of this disclosure relate to calculating one or more attributes from the data (see, e.g., block606). Calculation of one or more attributes may occur before, during or after validation protocols. In one implementation, one or more attributes may be calculated for one or more of the received samples in a sample window (e.g., the 128 sample window described above). Attribute calculation may occur in real-time as the data is collected. As discussed above, derived data, such as a launch z-axis derivative max timestamp, may be calculated. One or more calculated and/or raw attributes may be utilized to determine whether the athlete is running, jogging, conducting a sidestep, a jump, and/or performing another action—which may or may not be classified. In one embodiment, data may be used to determine whether the athlete is walking (which according to at least some embodiments would not be used in the calculation of airtime), whether a jump was initiated with a specific foot, whether the jump was a single or double-footed jump, and/or other information. In this regard, certain embodiments may compare one or more calculated attributes associated with data received from one or more sensors, and indicative of one or more activities being performed by a user, to one or more attributes associated with one or more models. In one example, one or more attributes may be utilized to calculate flight time (e.g., block607). In this regard, although block603is shown below block607with respect to flowchart600, certain embodiments may classify motions, such as being walking, running, jumping, etc., before determining the flight times. In this regard, block603may be a precursor to block607 In accordance with one embodiment, it may be determined the relative timing of the athlete's feet leaving the surface being traversed by the athlete (launch) and/or which foot left the surface first or last since a relative time point, such as a previous last foot strike or specific foot strike. The determination may be based upon timestamps indicating the launch of each foot. Certain embodiments may determine a launch time for the last foot determined to leave the surface (a.k.a., the launch foot), as the maximum z-derivative. In various embodiments, a time stamp of the last foot to leave the ground (or have a threshold level of movement along an axis—e.g., the vertical axis) may be used as the beginning point to determine flight. Yet other embodiments may use other timestamps, such as when the first foot left the ground. For example, upon determining, such as from timestamps, that both feet were off the ground during a time frame, the first timestamp may be used to calculate airtime. In certain embodiments, the initiation point for airtime may be dependent on a type of activity, such as whether the user was running, jogging, jumping, side-stepping, etc. In one example, one or more data points received from a sensor are aggregated into a dataset representative of one or more motions of user. Accordingly, the one or more data points may be processed to represent the data in a way that allows for one or more trends and/or metrics to be extracted from the data. In one example, acceleration data output from an accelerometer may be processed (transformed) to calculate a vector normal (“vector norm”). Additional or alternative transformations may be employed to calculate, in one example, a standard deviation of the vector normal, a derivative of the vector normal, and/or a Fast Fourier Transform (FFT) of the vector normal. Those skilled in the art will appreciate, given benefit of this disclosure, that certain transformations may combine sensor data from two or more sensors and/or with other data, such as biographical data (e.g., height, age, weight, etc.). In other embodiments, transformation may only utilize data from single sensors, such that sensor data from multiple sensors is not mixed. In this regard, aspects of this disclosure are directed toward using one or more attributes utilized in the determination of airtime to determine other attributes. Sensor data, raw or processed may be compared to one or more models (see e.g., block608). In certain embodiments, total, immediate and/or average flight times may be determined. In this regard, aspects relate to measuring athletic ability or other information based upon flight time. For example, an athlete's average flight time (which may include airtime from walking and/or running) may be an indicator of athletic performance. Certain embodiments relate to determining flight time, such as the flight time during a unit of time (e.g., what is the average flight time during a minute of a game or athletic performance). For example, as shown inFIG.7, an athlete may average 200 milliseconds per “flight” (“instantaneous flight time”) in the first minute of a game and 150 milliseconds per flight another minute of the same game or performance. Flight times may be considered irrespective of “height” for example, a user may have a series of small flights during their blocking or running and thus exhibit more flight time than another player who jumped several times and/or had higher jumps. In another embodiment, average flight time as a function of time, such as average flight time (e.g., in milliseconds/sec) of a game or athletic performance may be determined (see, e.g.,FIG.8). For example, the average flight time (especially as more time passes during an event/game) may converge to represent the time in flight as compared with the time not in flight. Likewise, total or cumulative flight time may represent the total time in flight during a game or performance (See, e.g.,FIG.9). Such information is an improvement over the prior art as airtime calculations according to various embodiments disclosed herein may be beneficial in training regimes. For example, a quantity of airtime within a certain time frame may be used to determine the user's level of exertion as compared to their maximum, either theoretically, a preference, or past collected data. Likewise, this information may be used to gauge one athlete's performance and/or abilities against another player's abilities, even another player performing the same position, and/or it may be used to gauge one athlete's performance at different positions (e.g., forward vs. center), as well as their “rate of fatigue.” In this regard, total movements or caloric expenditure may not accurately measure the user's fatigue, ability, and/or current performance or rate of decline. In certain embodiments, force measurements, such as launch and/or strike forces may be used in conjunction with airtime determinations. Flight time attributes may be used as inputs to one or more of, among others, models for estimation of a number of steps (during walking, which may not be considered in calculations of airtime), strides (during running), or other movements by a user, and/or models for estimation of speed and distance (pace) of a user (see e.g., block603of flowchart600). Furthermore, as will be apparent fromFIG.6, one or more calculated attributes may be used as inputs to one or more models such that, in one example, a model for estimation of flight time may be executed separately from a model for calculation of airtime, a step rate, a walking speed, and/or a running speed, and the like. For example, an activity device may receive information from a user performing a basketball activity. In response, the device may process the received basketball activity data (such as, for example, block606of flowchart600), and compare calculated attributes to one or more models or otherwise conduct further analysis in addition to air time. As one example, a determination to accumulate airtime, such as part of the calculations of block607may lead to a determination of whether a jump occurred, and if so, jump height may be determined (such as, for example, block608). In accordance with one embodiment, determination of jump height and/or other metrics that may be related to jump height may be performed, at least in part, by comparing one or more of the data attributes used in the calculation of airtime against one or more models. As previously described, one or more models may be stored in a memory, such as memory212, and the like, and associated with a device, including a sensor device. FIG.10shows a flowchart of calculating jump height according to one embodiment. Flight time may be used in a linear regression to determine jump height. As discussed above, one or more attributes calculated (including, e.g., at block606) may be used in a determination of whether sensor data is indicative of walking, running, or another activity being performed by a user, and additionally or alternatively, the speed at which the user is walking or running, and the like. Accordingly, one or more attributes calculated at block606may be used as inputs to block603. In particular, one or more attributes may be communicated from block606to decision block616. At block616, one or more processes may be executed to determine whether a user is running or walking, or performing another activity. If it is determined that a user is performing an activity other than running or walking, the process proceeds from block616to618, at which no speed is defined. Accordingly, for a user performing activity other than running or walking, no processes are executed to define the speed at which the user is traveling, and the like. If it is determined, at decision616, that's the user is running or walking, decision620may be implemented to determine whether the activity is walking or running. Example embodiments for selecting an activity, such as running or walking, are provided herein. In one embodiment, if it is determined that a user is running, one or more attributes may be communicated to a running model, such as to determine speed (e.g., see block622). If, however, it is determined that a user is walking, certain embodiments may communicate one or more attributes to a walking model, such as to determined speed (e.g., block624). Results from data processing by these models may be used, e.g., at steps607,608. A more detailed description ofFIGS.7-11and potential features thereof is provided below. As described above, aspects of this invention can be used to determine “flight time.”FIG.7includes a flowchart describing one such example system and method. The process ofFIG.7starts with a data set that includes data collected, e.g., from footwear based sensors, including at least some right foot launch, right foot strike, left foot launch, and left foot strike data (e.g., collected from one or more sensors provided in an article of footwear, such as force or accelerometer based sensor data, like that described in conjunction withFIG.3). In Step2102, this example system and method may synchronize the sensor events registered by the two shoe based sensor systems, if necessary, e.g., to account for deviations in sensor clocks and/or transmission times. In particular arrangements, the systems and methods may measure the required transmission time between each of the sensors and the activity processing system and subsequently use the measured transmission time to adjust a time associated with each of the detected sensor events. Additionally or alternatively, synchronization may include temporally sorting the events received. In some examples, the foot strike and foot launch event data might not be received in an order in which the events were detected. Accordingly, the system and method may pre-process the event data to order the events according to the time at which they were detected. As another potential feature (in addition to or in place of any of those described above), as use of the system and method begin (e.g., when a “start” button or function is initiated, when the player registers to go into the game, etc.), at Step2102the clocks in and/or associated with each shoe may be synchronized to the same time (e.g., a “0” starting time). Once the sensors synchronized and/or otherwise are ready to go, at Step2104, the system and method may initiate measurements and registration of events by the sensors in each shoe (e.g., initiate determination of “foot strike” or “foot on” events and initiate determination of “foot launch” or “foot off” events), and this “foot strike/foot launch” data is received at Step2106. As or after the foot strike/foot launch data is received, at Step2108, the data may be sorted based on the time it was generated (e.g., based on the “timestamps” associated with and included in the data for each foot strike and foot launch event). Therefore, incoming data from the shoe based sensors may include one of more the following types of information: (a) identification of the sensor generating the data (e.g., right shoe, left shoe, a particular sensor on the shoe (if multiple sensors are present), etc.), (b) timestamp information (e.g., when the data was measured), (c) type of event (e.g., launch or strike), (d) other data associated with the measurement (e.g., landing force, landing acceleration, launch acceleration, etc.), etc. Based on the information contained in the data stream, in Step2110, the “start” and “end” timestamps for “flight times” (e.g., corresponding pairs of consecutive “Foot A launch” and “Foot B strike” events and pairs of consecutive “Foot B launch” and “Foot A strike” events, pairs of “Foot A strike” and “Foot A launch” events, pairs of “Foot B strike” and “Foot B launch” events, etc.). These start and end timestamps for the consecutive pairs of launch and strike events may be used to determine “flight time” associated with the flight events at Step2112. Once flight times for each desired flight event are determined, validation checks can be performed at Steps2114-2118to determine/confirm whether the “flight” data represents a legitimate jump and/or if desired, “flight time” associated with running, jogging, sprinting, or the like. As some more specific examples, one potential validation check may be determining whether the determined “flight time” (from the event timestamps) is longer than humanly possible to constitute flight from an actual “jump” or “run” activity. For example, if the timestamp data stream indicates that the player has been up in the air for several seconds, this “flight time” might be determined to not constitute a jump or jump (e.g., answer “no” at Step2116), in which case, the “flight time” for that pair of foot launch and foot strike events may be set to 0 (Step2118). A long flight time, however, does not necessarily compel a determination that the data is faulty and/or that the noted activity did not constitute a “jump” or true “flight time” (optionally including “flight time” associated with running, jogging, and/or sprinting activities). Rather, systems and methods according to at least some examples of this invention may further analyze data that indicates that an excessively long “flight time” occurred (or optionally all flight time data). For example, in some instances when playing basketball, a player might prolong a “flight time” by grasping and holding onto the rim or net and/or by not landing on his/her feet (e.g., landing on one's back, knees, elbows, etc.). Therefore, rather than automatically throwing out data indicating a flight time longer than a predetermined threshold value, data and/or information from other sensors and/or sources could be consulted to see if a more accurate picture can be developed of what happened during the long flight time in question. For example, if the player grabbed onto the rim, the foot and/or body based sensors may register the initial lift off, a “hanging” in mid-air phase (when the rim or net is grabbed) or even a second lift phase (if the player pulls himself further upward using the rim/net), followed by a downward movement phase. As another option, a wrist borne sensor may be used to detect prolonged close proximity to the rim during a time when both feet are off the ground. Video data also may be consulted to determine whether a specific flight event is legitimate or fully legitimate. If such legitimate flight events are detected or determined, then at Step2118, rather than setting the flight time to 0 for that event, the flight time could be adjusted, e.g., to count “flight time” only as the “up” and “down” time associated with that jump or other flight event (and to not add in the additional time when the player swung from the rim or net, further propelled himself/herself upward using the rim or net, etc. as part of the flight time for that event). In an event where the player lands off his feet, a body based sensor (or an accelerometer included with the shoe based sensors) may detect an abrupt change in velocity and/or acceleration when the player lands on the floor. If such events are detected, then at Step2118, rather than setting the flight event time to 0 for that event, the time could be adjusted, e.g., to count “flight time” as the time between the last “foot launch” event and the following on-floor landing event by a body part other than a foot. Once the flight times are determined as valid (answer “yes” in Step2116), determined as invalid and set to 0 (Step2118), and/or adjusted (in the alternatives for Step2118discussed above), at Step2120, the data in the flight time buffer memory can be updated (e.g., with updated determinations of average flight time or cumulative/total flight time, etc.) and/or other desired data may be generated and/or other metrics may be determined. If more data remains available for evaluation, the system and method can loop back (loop2122) to Step2106and analyze the next timestamp data set and/or any available additional data. At any desired or appropriate time in the process (e.g., including before loop2122occurs), flight time data and/or other feedback, metrics, and/or information can be made available to the player, the coach, and/or any other designated party (Step2124). Additionally or alternatively, at Step2124, coaching and/or training information may be presented to the user, e.g., in the form of workout plans, workout drills, playing tips or advice, etc. Information relating to “flight time” and/or any desired parameters and/or metrics may be provided to the user in a variety of ways, including the various ways described above.FIGS.8-10provide some example displays and/or user interfaces (e.g., for display screens on computers, smart phones, etc.) that may provide feedback and/or information to users in accordance with at least some examples of this invention. As described above, values associated with a determination of “flight time” for individual flight events (e.g., time between consecutive foot landing and prior foot launch events) may be added together (e.g., in a flight time buffer memory) or the buffer may otherwise be updated based upon the measured/detected flight times (e.g., blocks1050b,1180,2120). This data may be used in various ways. For example, as shown inFIG.8, one user interface screen2200may illustrate one or more players' “instantaneous flight time” (in milliseconds), per flight, over the course of his/her playing time in the game (minutes of game play). In the example ofFIG.8, the performances of two players are shown overlapping to enable comparison of their performances (these performances do not need to have taken place at the same time, in the same game, and/or at the same location). In the illustrated example ofFIG.8, it can be seen that while both Player's instantaneous performances (e.g., average flight time per flight) followed similar trends, particularly at a start, Player B′s flight time performance, however, tailed off dramatically at the end as compared to Player A′s performance (e.g., after about 8 minutes of playing time). FIG.9illustrates an example user interface screen2300that shows one or more players' “average flight time” (in milliseconds/second) over the course of his/her playing time in the game (minutes of game play). In the example ofFIG.9, the performances of two players again are shown overlapping to enable comparison of their performances (again, these performances do not need to have taken place at the same time, in the same game, and/or at the same location). In the illustrated example ofFIG.9, it can be seen that while Player B′s average flight time was a little higher than Player A when his/her play started (e.g., inside the first two minutes), Player A maintained a higher flight time over the full course of his/her play. The “average flight time” (especially as more time passes during an event/game) may converge or flatten out (as shown inFIG.9) and may be considered as a representation of a player's “time in flight” as compared with the time not in flight (e.g., time spent running or jumping as compared to time not running or jumping). FIG.10shows an example user interface screen2400that provides another interesting metric and information in accordance with at least some examples of this invention. More specifically,FIG.10shows “cumulative flight time” (in seconds) for one or more individual players over the course of their playing time in the game. In this illustrated example, Player A shows a relatively constant, steady accumulation of “flight time” over the course of his/her playing time whereas Player B′s performance curtailed off more quickly and resulted in substantially less overall flight time. These metrics and comparisons (e.g., fromFIGS.8-10) provide valuable information to the player or coach as they compare players, compare player fitness/performance levels, compare individual player performance changes over time (e.g., the Player A and Player B curves may represent one player's performance at different times) and/or develop training and practice sessions for the player(s). Additionally or alternatively, if desired, players could allow others to view their “flight time” data and use this information (e.g., in social networks) to create groups of friends, challenges, and/or other games and activities that will tend to motivate players to compete, strive to get better, and play harder. These types of interactions, comparisons, and challenges with others also can help set goals and/or avoid boredom. Other metrics and options are possible without departing from this invention. For example, as shown inFIG.11, systems and methods according to at least some examples of this invention may create, determine, and maintain a jump “height” metric for players. More specifically,FIG.11describes information that may be utilized in a “Jump Height” determining algorithm to determine “jump height” associated with any desired “flight time” event. As shown, the jump height algorithm may take as input data2502one or more of: left foot strike timestamp; right foot strike timestamp; left foot launch timestamp; right foot launch timestamp; left foot launch data in the Z (vertical) direction (e.g., Z derivative max, to get upwardly directed force information); and right foot launch data in the Z (vertical) direction (e.g., Z derivative max, to get upwardly directed force information). At Step2504, the foot sensor data is reviewed to determine the last foot to launch so that both feet are indicated as being up in the air, and the timestamp associated with that foot's launch is used as the timestamp of the maximum Z-derivative for that foot and that event. Then, at Step2506, the strike times for each foot are compared to the launch times for each foot to determine the overall strike time (when the first foot strike occurs). If it is determined that either foot strike event occurs before the last foot launched, the data is filtered out (and no “jump height” is determined based on that data set). Once valid “flight event” data is determined (e.g., the time between the last foot launch time, with both feet in the art, and the first foot strike time) for a data set, the “jump height” for that data set is determined based on the flight time (Step2508). While any desired algorithm may be used for determining jump height from flight time, in this illustrated example jump height is calculated based on the following equation: y=41.66708x−3.818335 (Eq. 1), wherein “y” represents jump height in inches and “x” represents flight time in seconds. This equation was derived from a linear regression of measured jump height and flight time data. Players could challenge themselves and/or one another to attain specific “jump height goals,” e.g., based on a cumulative jump height for multiple “flight events” determined by systems and methods according to this invention (e.g., first to “jump over” the Eiffel Tower, etc.). Other “jump height” metrics also may be used in challenges of this type, including an “instantaneous jump height,” “average jump height,” etc. If desired, systems and methods according to at least some examples of this invention may define the various metrics more granularly than simply determining various flight time features. As noted above, using different sensors and/or combinations of sensor input data, different types of “flights” can be determined and distinguished from one another, including walking v. jogging v. running v. sprinting v. jumps (and/or v. running jumps v. vertical jumps). Therefore, if desired, “flight time” metrics (including instantaneous, average, or cumulative/total flight time) and/or jump height metrics (including instantaneous, average, or cumulative/total jump height) as described above in conjunction withFIGS.8-11can be further broken down into flight times and/or jump heights associated with any one or more of these different types of activities (or any desired combination of these activities), including one or more of: walking time; jogging time; running time; sprinting time; jumping time; running jump time; vertical jump time; jogging flight time; running flight time; sprinting flight time; jump flight time; vertical jump flight time; running jump flight time; jogging jump height; running jump height; sprinting jump height; jumping jump height; vertical jumping jump height; and running jump type jump height. Other ways of providing more detailed feedback and data to the user are possible without departing from this invention. For example, by combining the flight time and jump data (and optionally the more granular flight time and jump data described above) with other input data, systems and methods according to at least some examples of this invention may further provide individual “flight time” and “jump height” metrics for players on offense and on defense (e.g., “offensive flight time” and “defensive flight time”). As some more specific examples, sensor data (e.g., GPS sensors, image sensors, proximity sensors, etc.) could be used to provide data to systems and methods according to some examples of the invention where play is occurring on the floor so that a determination can be made as to whether the player is on the offensive or defensive side of the floor. Abrupt changes in acceleration, velocity, and/or movement values and/or directions by multiple players also could be considered an indicator of a change in ball possession (transitioning the players from offense to defense and vice versa). “Ball possession” determination systems and methods also may be used to determine whether an individual player and/or team is on offense or defense. Some example “ball possession” determination systems and methods are described, for example, in U.S. Patent Appln. Publn. No. 2010/0184564 A1 published Jul. 22, 2010, which publication is entirely incorporated herein by reference for all non-limiting purposes. With such “offense” or “defense” input, systems and methods according to at least some examples of this invention may break down the flight times and/or jump heights to include one or more of: offense walking, jogging, running, sprinting, jumping, running jump, and/or vertical jump times; offense jogging flight time; offense running flight time; offense sprinting flight time; offense jump flight time; offense vertical jump flight time; offense running jump flight time; offense jogging jump height; offense running jump height; offense sprinting jump height; offense jumping jump height; offense vertical jumping jump height; offense running jump type jump height; defense walking, jogging, running, sprinting, jumping, running jump, and/or vertical jump times; defense jogging flight time; defense running flight time; defense sprinting flight time; defense jump flight time; defense vertical jump flight time; defense running jump flight time; defense jogging jump height; defense running jump height; defense sprinting jump height; defense jumping jump height; defense vertical jumping jump height; and/or defense running jump type jump height. Jump detection and/or jump determination information in accordance with at least some examples of this invention also may be used to provide additional useful information, particularly if combined with information regarding results of the jumping action. For example, determination that: (a) a player has possession of the ball (e.g., using a wrist based or body based ball contact/proximity sensing system), (b) the player in possession of the ball jumps vertically or jumps while running (e.g., using footwear based sensors), and (c) the player releases possession of the ball can be used by systems and methods according to examples of this invention as a determination that the player: (i) took a shot (e.g., if ball proximity to the rim and/or backboard is determined, and optionally whether the player made or missed the shot), (ii) made a pass (e.g., if ball possession by another player on the same team is determined), (iii) made a turnover (e.g., if ball possession by another player on the other team is determined), or (iv) had the shot or pass blocked (e.g., if an opposing player contacts the ball and changes its trajectory). As another example, determination that a player not in possession of the ball (but optionally detected as being in proximity to the ball): (a) jumps (e.g., using footwear based sensor) and (b) contacts the ball (e.g., with a ball based sensor) to change the trajectory of the ball may be used to determine that the player blocked another player's shot and/or intercepted a pass. An yet another example, determination that a player not in possession of the ball (but optionally detected as being in proximity to the ball): (a) jumps (e.g., using footwear based sensor), (b) possesses the ball (e.g., with a ball based sensor), and (c) lands the jump (before or after gaining possession of the ball) may be used to determine that the player rebounded the ball or caught a pass (from a teammate or from one of the other team's players). Flight times and/or jump heights associated with any of these other detected activities could be tallied and the information presented to the player, coach, etc. as useful coaching/training data and/or metrics. CONCLUSION Providing an activity environment having one or more of the features described herein may provide a user with an experience that will encourage and motivate the user to engage in athletic activities and improve his or her fitness. Users may further communicate through social communities and challenge one another to participate in point challenges. Aspects of the embodiments have been described in terms of illustrative embodiments thereof. Numerous other embodiments, modifications and variations within the scope and spirit of this disclosure will occur to persons of ordinary skill in the art from a review of this disclosure. For example, one of ordinary skill in the art will appreciate that the steps illustrated in the illustrative figures may be performed in other than the recited order, and that one or more steps illustrated may be optional in accordance with aspects of the embodiments. | 77,560 |
11862335 | DETAILED DESCRIPTION OF THE EMBODIMENTS FIG.1shows schematically a network structure for a system1for remote controlling and monitoring of at least one instrument3according to one embodiment of the invention. The system1comprises at least one instrument3to be controlled and/or monitored. This could be an analytical or bioprocessing instrument or a process development instrument such as for example a chromatography system, a filtration system, a bioreactor, a peptide synthesis system or an electrophoresis system. The system comprises further at least one instrument server5which is connected to the at least one instrument3. More than one instrument3can be connected to the same instrument server5. In the embodiment shown inFIG.1three instrument servers5are shown. Two of the instrument servers5are connected to two instruments3each and one instrument server5is connected to one instrument3. This is however only an example. Any number of instruments3could be connected to each one of the instruments servers5and the system1can comprise any number of instrument servers5. The at least one instrument server5comprises an instrument control software for controlling the instruments3connected to this instrument server5. The system1comprises further at least one gateway7connected to the at least one instrument server5. A client9, here shown in the form of a computer and a mobile telephone having computing ability can connect to the gateway7. Control and/or monitoring of the instruments3can be performed from the clients9. A transferring means11is provided in the at least one instrument server5. Said transferring means11is arranged to receive information from the at least one connected instrument3and forward said information to the at least one gateway7. Furthermore a first self-hosted web server13containing a web application is provided in the at least one instrument server5for providing possibility to control the at least one instrument3via a web browser. An instrument control web page is provided by the at least one instrument server5. A client9can access the instrument control web page through the gateway7which will be further explained below. A publishing means15is provided in the at least one gateway7. Said publishing means15is arranged to receive information about the instruments3from at least one connected instrument server5and publish said information in an instrument monitoring web page. Said publishing of information in the instrument monitoring web page is performed automatically when an instrument is connected. The gateway7comprises a second self-hosted web server17containing a web application. The second self-hosted web server provides the possibility to publish the information in a web page and provides the possibility to monitor the at least one instrument via a web browser. Hereby a client9connected to the gateway7can monitor the instruments3via the instrument monitoring web page. Said transferring means11and said first self-hosted web server13are provided to the instrument server5as an application plugin. Herein the term plugin is intended to refer to an extension provided to already existing software and could also be called just an extension or an addon. In this invention it is an advantage to provide both the transferring means and the first self-hosted web server13to the instrument server5as a plugin because then there is no requirement for an update of the original instrument control software. In some environments, particularly in the bioprocessing field there may be requirements for new validations and tests if a software is updated and therefore a plugin is s preferred instead of updating the software since it means that no validation is necessary. The use of a self-hosted web server within the instrument server5furthermore avoids the need for updating the software in a client computer. Furthermore, said publishing means15and said second self-hosted web server17are provided to the gateway7as a plugin for the same reasons as given above. Said system1comprises further at least one software hyperlink URL or the like provided in the instrument monitoring web page, wherein said at least one hyperlink will redirect a user selecting, for example by clicking, the hyperlink to the instrument control web page. Hereby the instruments3can be both monitored and controlled remotely from a client9connected to the gateway7. A user of the client will open the instrument monitoring web page and there all the instruments3connected to the system3will be shown in a graphical user interface dashboard. Information relating to the instruments3can be shown in the dashboard. Such information can be for example alerts, faults, logs, users, methods or any other type of data available in the instrument. Each instrument3shown in the dashboard (instrument monitoring web page) is provided with a hyperlink. When a user clicks the hyperlink the user is redirected to the instrument control web page associated with this specific instrument3and this specific instrument server5connected to the instrument3. In the instrument control web page the user can control the instrument. The gateway7is further connected via a firewall to the Internet. Thereby, a client (web browser) could connect to the gateway7through Internet. Such Internet connection would of course require authentication and authorization of users. In addition to this a secure connection using encryption is required in order to ensure protection of data transferred between the web server and web browser. Analysis of data retrieved from the instruments and shown in the instrument monitoring web page could in this case be provided over Internet. Furthermore comparison and statistics from many different systems like the system1shown inFIG.1could be provided over Internet. FIG.2is a flow chart of a method for remote monitoring and controlling of at least one instrument3according to one embodiment of the invention. The method comprises the steps of:S1: Collecting information for example of the type described below, from the at least one instrument3in at least one instrument server5connected to the at least one instrument.S3: Forwarding the information to a gateway7connected to the at least one instrument server5.S5: Publishing the information from the instruments3received in the gateway7in an instrument monitoring web page using a self-hosted web server17containing a web application and provided in the gateway7.S7: Opening the instrument monitoring web page from a client9connected to the gateway7, for example connected via the Internet or a LAN.S9: Monitoring from the client9the instrument information shown in the instrument monitoring web page.S11: Choosing at least one of the instruments3to control by selecting an appropriate hyperlink in the instrument monitoring web page.S13: Redirecting the instrument monitoring web page to an instrument controlling web page provided by a self-hosted web server13containing a web application and provided in the instrument server5.S15: Controlling at least one of the instruments3directly from the client9through the instrument controlling web page, for example via the Internet or a LAN. In one embodiment the step of forwarding the information to a gateway7comprises forwarding information to the gateway from at least two instrument servers5connected to the gateway. In one embodiment the step of monitoring comprises monitoring more than one instrument in the same instrument monitoring web page. The gateway7can be a network node which can receive data from plural instrument servers5formatted according to different protocols, where the instrument servers5are a distributed network employing packet switching. FIG.3is a flow chart of a method for providing remote control and monitoring of at least one instrument3according to one embodiment of the invention. The method comprises the steps of:A1: Providing a transferring means11to at least one instrument server5. Said transferring means11is arranged to receive information from at least one instrument3connected to the instrument server5and forward said information to a gateway7which is connected to the at least one instrument server5.A3: Providing a first self-hosted web server13containing a web application in the at least one instrument server5for providing possibility to control the at least one instrument3via a web browser in an instrument control web page.A5: Providing a publishing means15in the gateway7. Said publishing means is arranged to receive information about at least one instrument3from at least one instrument server5and publish said information on an instrument monitoring web page.A7: Providing a second self-hosted web server17containing a web application in the gateway7for providing possibility to monitor the at least one instrument3via a web browser and the instrument monitoring web page. According to one embodiment said transferring means11and said first self-hosted web server13are provided to the at least one instrument server5as an application plugin and said publishing means15and said second self-hosted web server17are provided to the gateway7as a plugin as discussed above. In one embodiment of the invention the method further comprises providing a URL or the like hyperlink for each instrument in the instrument monitoring web page to a corresponding instrument control web page for each instrument. The system and method according to the invention can be performed in a computer program product arranged to be provided in a system for remote controlling and monitoring of at least one instrument. Said system comprises at least one instrument to be controlled and/or monitored, at least one instrument server connected to the at least one instrument and at least one gateway connected to the at least one instrument server. Said computer program product comprises instructions for causing the at least one instrument server and the gateway in the system to perform the method steps of:collecting information from the at least one instrument in the at least one instrument server;forwarding the information to the gateway;publishing the information from the instruments received in the gateway in an instrument monitoring web page using a self-hosted web server containing a web application provided in the gateway;redirecting the instrument monitoring web page to an instrument controlling web page provided by a self-hosted web server containing a web application provided in the instrument server when a user chooses an instrument to control in the instrument monitoring web page. The system mentioned above has particular utility for the monitoring and control of bioprocessing instruments, particularly but not exclusively of the type sold under the brand names of AKTA, and WAVE, as sold by GE Healthcare Bio-Sciences. These instruments are of the type that can be reconfigured to provide different functionality, and therefore are not necessarily performing exactly the same function all the time. Thus, remote monitoring and control is of more importance than monitoring and control of process equipment where the inputs and outputs do not change. Also, these branded instruments require provision for both breakdown maintenance and preventative maintenance, as well as replacement and supply of consumables. These branded instruments can have increased capacity or increased functionality, if ancillary components are employed, and therefore, there is a need for inventory control of such consumables and ancillary components. FIG.4shows a network system100similar to that shown inFIG.1, where like features have reference numerals which include the same last two digits. The architecture of the system100is the same as described above. The information102transmitted from the instruments103for example an AKTA chromatography instrument or WAVE bioreactor to the instrument server105, for the purpose of monitoring instrument performance typically includes data indicative of any one or more of:Process run time;Sensor data over time (curve data);Process steps employed;Process step progression; andError events, error logs and warnings. The data is formatted at the instrument server105and then transmitted, for example as packet switched data104to the gateway107. In order to enhance the performance of the gateway107, for example when long-running processes are monitored, the gateway in this embodiment includes memory storage106to store or buffer the data104until it is accessed by a client109. To further enhance the functionality of the system, two-way communication is available between an inventory server108and the gateway, where the inventory server is configured in a similar way to the instrument servers, such that formatted data is received from the inventory server, again accessible by the client109. The inventory server108has real-time records of ancillary equipment and consumables, which can be physically located in the vicinity of the instruments, or more remotely. The inventory server hosts a web application allowing client control for the purposes of ordering and reservation of ancillary components and consumables. Instrument data110, which can include inventory data is transmitted to the client again optionally via packet switched data across the Internet or via a LAN. That data can be data relating to individual instrument, or collated data, for example indicative of errors or warnings only from all instruments. The instrument data102transmitted to the instrument server may also be used for the purpose of instrument maintenance (preventative or breakdown maintenance), and may include:Error events, error logs and warnings;Instrument run time;Run time for instrument critical parts, as such valve cycles, UV lamp burn time; pump strokes;Power consumption which is out of limit; andExcessive consumption of consumables. Again such data can be formatted at the instrument servers105for onward transmission to the gateway107, stored if necessary at memory106, and accessed by a client109. Access to inventory data from the inventory server108allows unexpected maintenance to be scheduled via the control steps mentioned above, i.e. where the client can access instrument control software via a web-based application hosted at the instrument server, if necessary relying on the monitoring data and inventory data mentioned above, for example by reserving ancillary components from a physical inventory to supplement or replace the monitored instrument. Consumable items too can be reserved via the client109. Control of the instruments103via a client109can be directly via each instrument server, the client being directed via a hyperlink to the appropriate server, via conventional security software. Such control can include control data sent by the client for the purpose of:Selecting an appropriate process routine;Including or omitting steps in a process routine;Pausing a routine for adding or removing ancillary equipment;Pausing a routine to replace a malfunctioning or defective part;Pausing a routine for replacing or adding a consumable; and/orStarting or stopping the instrument. The examples given above in relation to bioprocessing instruments are examples only, and other instruments can be controlled and monitored using this system. Nevertheless the advantages of monitoring and control according to the system described allow for efficient and fast control of multiple instruments which are functionally adaptable and disparate in function and/or physical location, so can be adapted for use across multiple industrial applications. | 15,611 |
11862336 | DETAILED DESCRIPTION OF THE INVENTION Aspects of the present invention and certain features, advantages, and details thereof, are explained more fully below with reference to the non-limiting examples illustrated in the accompanying drawings. Descriptions of well-known materials, fabrication tools, processing techniques, etc., are omitted so as not to unnecessarily obscure the invention in detail. It should be understood, however, that the detailed description and the specific examples, while indicating aspects of the invention, are given by way of illustration only, and not by way of limitation. Various substitutions, modifications, additions, and/or arrangements, within the spirit and/or scope of the underlying inventive concepts will be apparent to those skilled in the art from this disclosure. The terms software, program code, and one or more programs are used interchangeably throughout this application. The term “diagnose” is utilized throughout the application in to suggest that a data model that is generated and method determining a probability of the presence of a given physical or medical condition, including but not limited to a disease or an orphan disease, based on a data set related to an individual, referred to herein as a patient. However, the so-called diagnosis provided by aspects of embodiments of the present invention is not analogous to a medical diagnosis, provided by a health professional, often based on the result of a medical text or procedure. Rather, a diagnosis herein is merely a recognition of a pattern, or a given portion of a pattern, where the pattern was generated from a self-learning model, in embodiments of the present invention. Embodiments of the present invention combine data analytics and pattern prediction to enable program code executing on at least one processor to identify patterns within a data set in the absence of advance data defining the pattern. In an embodiment of the present invention, program code analyzes a data set to identify parameters comprising data points characteristic of a certain condition (e.g., a physical condition). The program code adapts a machine learning algorithm to utilize these parameters to identify data consistent with this condition and utilizing data sets of sizes which cannot be analyzed by a human or by a computing environment that does not adequately distribute processing tasks related to the analysis. The program code identifies these parameters in the absence of established data characterizing the condition. This approach can be utilized to determine recognition patterns to identify diseases (e.g., ALS), and/or orphan diseases in a data set that includes data related to individuals with this condition and subsequently, to identify these patterns in an unlimited data set where the prevalence of individuals with this condition is unknown. However, this approach is not merely limited to physical condition (e.g., disease) identification, but can be utilized in general to predict criteria identifying an event and apply these criteria across a data set that is not constrained by size or complexity. Throughout this specification, aspects of embodiments of the present invention are applied to the task of physical condition (e.g., disease) identification, including but not limited to ALS identification. However, this singular (non-limiting) application of aspects of embodiments of the present invention is offered to illustrate the functionality of the present invention, as understood by one of skill in the art. Advantages provided by aspects of some embodiments of the present invention include: (1) the ability to identify features that differentiate ALS patients from the general population prior to diagnosis, (2) the ability to determine potential predictors of a future ALS diagnosis, (3) the ability to demonstrate the appearance of ALS symptoms earlier than currently understood by the medical community, (4) the ability to provide the potential to accelerate ALS diagnosis, and (5) the ability to estimate a time period until an ALS diagnosis is made, based on the appearance of ALS symptoms. Certain embodiments of the present invention represent improvements over known methods of data identification both in the application of identifying individuals with physical/medical conditions as well as in data management and data mining in general. For example, embodiments of the present invention enable the determination and identification of patterns based on an unlimited number of factors given the ability of the program code to mine large data stores. For example, when applied to creating a profile (e.g., a disease profile) and identifying individuals that fit this profile, relevant features that the program code builds into a pattern for later identification of individuals that fit this pattern are not solely based on diseases, but on drugs and procedures as well, which expands the information content that can be leveraged by the overall process. Embodiments of the present invention increase computational efficiency because, when building a profile to identify a given quality, the program code selects relevant features using not just prior knowledge and frequency count, but ultimate information theory mechanisms, including mutual information, and weight the variety of information utilized by, for example, truncating a the set of obtained features to establish a level of significance for each identified feature in the mutual information. Mutual information is an example of a method that can be utilized to identify features in an embodiment of the present invention. Further embodiments of the present invention utilize varying techniques to select features, including but not limited to, diffusion mapping, principal component analysis, recursive feature elimination (a brute force approach to selecting features), and/or a Random Forest to select the features. Embodiments of the present invention that utilize mutual information, diffusion mapping, and a Random Forest may provide certain efficiency advantages. Aspects of embodiments of the present invention represent improvements to existing computing technology and are inextricably tied to computing. Specifically, embodiments of the present invention represent improved methods of handling large volumes of data and for building logistical models from the data. For example, embodiments of the present invention reduce the observed data rate in the eventual results because the program code preprocesses the data utilized to build a pattern, rather than using a less efficient binary binning procedure. Aspects of embodiments of the present invention are inextricably tied to computing at least because the electronic disease models generated by embodiments of the present invention cannot be generated outside of computing and do not exist outside of computing. Records initially utilized in embodiments of the present invention are electronic records in one or more data set, contained in one or more database, that are machine readable. The resultant models are also electronic and can only be applied to additional electronic data sets utilizing computing resources. Because of both the volume and the nature of data, an individual is not capable of accomplishing the specific aspects of embodiments of the present invention that result in a machine readable data model that can be applied by program code to additional data sets in order to identify records with a probability of an event or condition that the model was generated to predict the probable presence of. To be useful, program code in embodiments of the present invention both generates and updates models and provides results (identification of records that comport with the model), within a limited temporal period. For example, in a scenario where an individual visits a healthcare provider, the individual and the provider would benefit from acquiring information regarding whether the individual, as represented by an electronic medical record, has items in the record that match the data sought by one or more disease models. If this information cannot be provided within the visit, it is arguably not useful to the individual or the healthcare provider. Thus, in embodiments of the present invention, the program code analyzes an individual record and applies disease models in real-time, or close to real-time. In certain embodiments of the present invention the program code predicts and detects patterns in data by utilizing Support Vector Machines (SVMs). In an aspect of an embodiment of the present invention, the program code trains a linear SVM classification algorithm for segregating database entries, for example, to separate entries representing individuals with a given condition from entries representing individuals that do not have the condition. In an embodiment of the present invention, the program code utilizes linear SVM, rather than, for example, logistic regression, Random Forest (RF) grouping algorithms, and/or other simple statistical approaches, to achieve a best available classification performance. Another advantage of certain embodiments of the present invention that utilize SVM is that the program code can apply the SVM score of the false positive data as a mechanism to sort out the most promising subjects. (Certain embodiments of the present invention do utilize RF grouping algorithms and logistic regression with SVM in order to achieve hyper-parameter optimization.) Embodiments of the present invention provide advantages and improvements that are inextricably tied to computer technology also because embodiments of the present invention offer certain advantages that increase computational efficiency and efficacy. For example, as described in greater detail later on, embodiments of the present invention utilize distributed processing based on anticipated query results in order to decrease the timeline for key analytic deliverables. This distributed processing enables the program code to perform multiple analysis processes simultaneously. Portions of certain embodiments of the present invention can be migrated to a cloud architecture and made available to users as software as a service (SaaS) offerings.FIG.11depicts certain aspects of a technical environments that may be utilized when certain embodiments of the present invention are available as a service. The unlimited computational capacity of resources in a cloud architecture are suited to support the program code's distribution of simultaneous queries and processes in order to meet the efficiency demands of the system in a data rich environment. Embodiments of the present invention also provide advantages and improvements that are inextricably tied to computer technology because they utilize machine learning. One advantageous aspect of some embodiments of the present invention over existing approaches to event (e.g., condition) identification in data dense environments is that some other methods approach the problem of event identification and recognition as a statistical problem, instead of a machine learning one, which is an approach that limits the options in available tools. By utilizing machine learning, embodiments of the present invention can identify records that include an event where the information directly identifying the event is absent. For example, by using machine learning, program code can identify patients with a given disease in a data set of undiagnosed patients, i.e., where the data does not already indicate that the disease is present in the patient. In some cases, the program code can utilize machine learning to indicate that an individual is infected with a disease when the opposite is indicated in data related to that individual. Thus, the program code is not merely identifying and retrieving existing established data stored in one or more memory device. Rather, the program code establishes a pattern, continuously trains a machine learning algorithm to apply the pattern, and utilizes the algorithm to identify instances of an event not already explicitly indicated by the data utilizing this pattern. Embodiments of the present invention provide advantages over known diagnostic systems when utilized to determine mutual information and apply this information to an analysis of a data set where the presence of the event related to the mutual information is unknown, at least because the process is devoid of selection bias. Returning to the orphan disease example, in embodiments of the present invention, there are no assumptions regarding an individual that are carried into the program code and the program code performs its analyses consistently. Selection bias is an issue when attempting to identify a medical condition as a medical professional may be prone to certain conclusions based on, for example, past experience. In the area of orphan disease identification, this bias is especially problematic because the rarity of an orphan disease means that a medical professional may come into contact with very few people, or even no people at all, with a given condition until a certain patient presents the condition. As aforementioned, challenges in identifying conditions, including diseases, such as ALS, and orphan diseases, from population-related data exist based on both the limitations of present computing solutions to process the volume of data efficiently and the lack of knowledge regarding what parameters should be searched within this large volume. In the case of orphan diseases, the small number of confirmed cases renders pattern building and recognition challenging, and in the case of ALS, the fact that a medical diagnosis is the result of eliminating other possibilities renders the same data problems. Regarding the volume of data, embodiments of the present invention can process a large number of patients coded with a large number of universe codes. For example, an embodiment of the present invention can be utilized to process the patient histories of more than 180 million patients, whose records may include up to 10 years of recorded healthcare history. Given the distributed nature of the processing architecture, the number of patients that can be processed/scored is only limited by storage, as the efficiency of the process enables the processing of increasingly large volumes of data. Workflows of certain embodiments of the present invention can include three stages: data integration, pattern extraction, and population separation. Data integration refers to aspects of embodiments of the present invention in which the program code derives discriminating features of a first data set, where an event is present. For example, if the event is a certain orphan disease, or ALS, the program code may analyze records of individuals medically diagnosed with the orphan disease or ALS and extract discriminating features that describe the treatment journey of these patients. Pattern integration refers to aspects of embodiments of the present invention in which the program code develops a pattern for identifying records with a given event based on using the most distinctive features extracted during data integration. For example, if the aforementioned orphan disease is the example, the program code would develop patterns describing the most distinctive features the program code extracted from the patient records. Population separation refers to aspects of embodiments of the present invention where the program code utilizes the pattern to identify the event in one or more data store. For example, returning to the orphan disease example, by analyzing data resources including records identifying large populations, the program code identifies within the resources which patient clusters match the treatment pathways exhibited by the known sufferers. Referring specifically to ALS, in utilizing aspects of embodiments of the present invention to build a data model related to ALS and applying that dynamic model to identify individuals that fit the model within a given probability, embodiments of the present invention enable identification of early predictors of ALS by using big data analytics of a large claims database.FIG.1is a workflow100that illustrates aspects of embodiments of the present invention, including one or more programs that perform data integration (e.g., patient definition), pattern extraction (e.g., feature extraction), and generate population separation maps (e.g., prediction). As will be illustrated and discussed herein, one or more programs, executed by at least one processing resource, mined data utilizing various aspects of embodiments of the present invention to identified features in the electronic medical data of ALS patients, specifically within the electronic claim histories of the patients, that differentiate these patients from the general population, even before initial ALS diagnosis by a medical professional. One or more programs in embodiments of the present invention determine that ALS patients may present with clinically relevant symptoms suggestive of connective tissue disorders, skin disorders, and nonspecific neurological complaints five (5) years before ALS is diagnosed. The one or more programs determine that medically significant predictors seen in patients who were eventually diagnosed with ALS included, include, but are not limited to, nervous system disorders, hereditary and degenerative nervous system conditions, connective tissue disease, skin disorders, lower respiratory disease, gastrointestinal disorders, neurologist visits, orthopedic surgeon visits, gastroenterologist visits, non-traumatic joint disorder, otolaryngologist visits, and/or the use of riluzole, a glutamate blocker, prior to diagnosis. In analyzing electronic data in a database comprising five (5) continuous years of medical records (histories), the one or more programs determined that the frequency of ALS patient features increase over time. In some embodiments of the present invention, one or more programs apply the model generated utilizing the electronic medical data, to conduct an analysis of combinatorial features that differentiate undiagnosed ALS patients from the general population, to further characterize early predictors of ALS, and to optimize the algorithm differentiating patients with ALS prior to diagnosis. As will be described in more detail below, and as illustrated utilizingFIGS.1-3, in embodiments of the present invention, one or more programs obtain (exclusively) machine-readable electronic medical records of individuals who were previously medically diagnosed with ALS. The one or more programs analyze (mine) the data utilizing both frequency ranking and by identifying mutual information. Thus, the program code in embodiments of the present invention employs an analysis that utilizes two data-ranking methods: a frequency method and a mutual information method. The program code utilizes the mutual information measure to quantify the statistical relevance of every feature in the electronic data set(s) of medical records to a future ALS diagnosis. The program code computes the relative frequency of pertinent events to rank the differentiating features based on the mutual information measure. Based on frequency ranking and mutual information, the one or more programs identify distinguishing features in categories that include diagnoses, procedures, drugs, providers, and locations. Based on identifying the distinguishing features, the one or more programs generate predictors (e.g., an adaptive data model), that the one or more programs can apply to data sets where it is unknown whether the individuals represented have ALS, and based on applying the model, the one or more programs can identify probabilities of ALS being present among the individuals represented. Returning toFIG.1,FIG.1is an example of a workflow100of an embodiment of the present invention which includes, as described above, data integration, pattern extraction, and population separation.FIG.2provides an overview200of portions ofFIG.1, as the aspects of data integration, pattern extraction, and population separation are also illustrated inFIG.2. As seen inFIG.2, data integration210includes patient definition, where one or more programs generating a patient definition by analyzing electronic records that include, but are not limited to, clinical and natural history data, expert input, and drug and diagnosis codes, over time, and across multiple de-identified data sets. The one or more programs in embodiments of the present invention perform pattern extraction220, which the one or more programs extract features and create a disease (or event) model creation refining the patient profile and applying machine learning and information theoretic techniques. In population separation230, the one or more programs make a prediction. Based on the one or more programs completing the development of disease models, the one or more programs applies the developed models to the remaining population, which enables the one or more programs to identify undiagnosed patients, in addition to diagnosed but untreated patients Returning toFIG.1, in some embodiments of the present invention, the program code defines filter parameters for a given event (110). The filter parameters include data points where patterns could be relevant to the event. For example, if the event is the diagnosis of ALS, filter parameters may include one or more of disease/diagnostic codes for comorbid or symptomatic conditions (muscle weakness, dysphagia, other motor neuron diseases, multiple sclerosis, joint disorders, nervous system disorders, etc.), prescription drugs, inpatient and/or outpatient procedures to diagnose and/or treat symptoms of ALS (needle electromyography, physical therapy, magnetic resonance imaging, etc.), visits to specialists, etc. In an embodiment of the present invention, the disease/diagnostic codes may comprise diagnostic codes, such as International Statistical Classification of Diseases and Related Health Problems codes, referred to as ICD-9 codes and the newer ICD-10 codes. Based on the filter parameters, the program code parses a data set in which the event is present in each record and identifies patterns (comprised of features) across records that relate to these parameters (120). Returning to ALS, the program code may identify mutual information of all categories of potentially relevant features such as, for example, for comorbid diagnoses, prescription drugs, provider visits, treatment locations, and/or medical procedures. In an embodiment of the present invention, the data set analyzed by the program code comprises medical information (e.g., records) related to a population of individuals with a given disease. For example, the data set may include, coupled with the timing for each feature, diagnostic codes, Dx(t), (e.g., ICD-9 codes, ICD-10 codes), procedures (e.g., Proc(t)), drug treatments, including prescriptions (e.g., Drug(t)), provider visits (Provider(t), and/or the location(s) of each individual represented in the data set (e.g., Location(t)). Locations may include, but are not limited to, locations of providers who interacted with a patient, a ZIP code related to a practice and/or a patient, a metropolitan area identifier, etc. The constant in the data set is that it is a known that each individual represented by the data has a specific medical condition, including a particular disease. The individual factors or features in the data set can also be referred to collectively as codes. One or more programs in an embodiment of a present invention may initially identify a population with ALS by electronically isolating a group of records that include individuals definitively diagnosed with ALS, by utilizing ICD-9 code 335.20 (i.e., amyotrophic lateral sclerosis) and ICD-10 code G12.21 (i.e., amyotrophic lateral sclerosis) from all patients in the national dataset that includes the electronic medical records of over 170 million patients. In order to further isolate a data set for use in predictive feature analyses (e.g., population separation,FIG.2,230), the one or more programs filtered this initial data (110) by identifying, from these electronic records, records that represented individual across all the states in the United States with a minimum of one year of adjudicated claims history prior to the implementation of these ALS diagnosis code in the records. Codes for ALS may include connective tissue diseases, nervous system disorders, gastrointestinal disorders, joint disorders, multiple sclerosis, diagnostic nervous system procedures, physical therapy, magnetic resonance imaging, riluzole use, antibiotics, neurologist visits, etc. Referring toFIG.1and the example of identifying a pattern ALS or for a given disease, including an orphan disease, in order to identify patterns (e.g.,FIG.1,120), in an embodiment of the present invention, program code identifies a patient temporal signal, i.e., the codes and the combination of codes that separate individuals with a given condition, for example, from a general population. In an embodiment of the present invention, the program code utilizes feature selection techniques to identify the mutual information in the data set that can be utilized to characterize the given condition. The program code may utilize this mutual information as an inclusion/exclusion index. For example the codes selected through mutual information provide the inclusion criteria for patients to be selected by one or more programs and conversely, those patients who do not possess any of the codes within this set, are excluded by the one or more programs. The goal of feature selection is to define the smallest subset of features that collectively contain most of the mutually shared information and thus most clearly define the characteristics of a patient with a given disease. In building a dynamic electronic model for use in identifying individuals with ALS from electronic medical records, the one or more programs utilized a mutual information measure to quantify the statistical relevance of every feature in the electronic patient data set (e.g., records representing more than 170 million patients, of which diagnosis codes identified 13,882 ALS patients, each with records from 2010 through June 2016, with an average of 4.8 years of claims history per patient) to a future ALS diagnosis. Thus, the one or more programs determined the relative frequency of pertinent events to rank the differentiate features based on the mutual information measure. In some embodiments of the present invention, the program code determined the distinguishing diagnoses by mutual information over five (5) years prior to an ALS diagnosis. From 48 to 60 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other hereditary and degenerative nervous system conditions, other nervous system disorders, paralysis, medical examination/evaluation, multiple sclerosis (MS), other screening for suspected conditions (not mental disorders or infectious disease), other upper respiratory disease, other connective tissue disease, headache (including migraine), and spondylosis; intervertebral disc disorders; other back problems. From 36 to 48 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other hereditary and degenerative nervous system conditions, other nervous system disorders, paralysis, spondylosis; intervertebral disc disorders; other back problems, other connective tissue disease, other screening for suspected conditions (not mental disorders or infectious disease), medical examination/evaluation, multiple sclerosis (MS), other non-traumatic joint disorders, and other upper respiratory disease. From 24 to 36 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other nervous system disorders, other hereditary and degenerative nervous system conditions, other connective tissue disease, spondylosis; intervertebral disc disorders; other back problems, paralysis, multiple sclerosis (MS), other upper respiratory disease, malaise and fatigue, other gastrointestinal disorders, and other screening for suspected conditions (not mental disorders or infectious disease). For 18 to 24 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other nervous system disorders, the diagnoses, from most frequent to least frequent, were as follows determined by the program code to be as follows: other hereditary and degenerative nervous system conditions, spondylosis; intervertebral disc disorders; other back problems, other connective tissue disease, paralysis, multiple sclerosis (MS), immunizations and screening for infectious disease, other gastrointestinal disorders, malaise and fatigue, and other non-traumatic joint disorders. For 12 to 18 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other nervous system disorders, other hereditary and degenerative nervous system conditions, other connective tissue disease, spondylosis; intervertebral disc disorders; other back problems, paralysis, malaise and fatigue, other gastrointestinal disorders, multiple sclerosis (MS), other non-traumatic joint disorders, and rehabilitation care; fitting of prostheses; and adjustment of devices. For 9 to 12 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other nervous system disorders, other hereditary and degenerative nervous system conditions, spondylosis; intervertebral disc disorders; other back problems, other connective tissue disease, paralysis, other gastrointestinal disorders, other non-traumatic joint disorders, malaise and fatigue, acquired foot deformities, and rehabilitation care; fitting of prostheses; and adjustment of devices. For 6 to 9 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other nervous system disorders, spondylosis; intervertebral disc disorders; other back problems, other hereditary and degenerative nervous system conditions, other connective tissue disease, paralysis, malaise and fatigue, other gastrointestinal disorders, rehabilitation care; fitting of prostheses; and adjustment of devices, other non-traumatic joint disorders, and other lower respiratory disease. For 3 to 6 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other nervous system disorders, spondylosis; intervertebral disc disorders; other back problems, other hereditary and degenerative nervous system conditions, other connective tissue disease, malaise and fatigue, other gastrointestinal disorders, paralysis, other upper respiratory disease, rehabilitation care; fitting of prostheses; and adjustment of devices, other non-traumatic joint disorders, and other lower respiratory disease. For 0 to 3 months, the diagnoses, that were determined to frequently occur in the patient population, by the program code, are as follows: other nervous system disorders, other connective tissue disease, other hereditary and degenerative nervous system conditions, spondylosis; intervertebral disc disorders; other back problems, malaise and fatigue, other gastrointestinal disorders, paralysis, rehabilitation care; fitting of prostheses; and adjustment of devices, other upper respiratory disease, other lower respiratory disease. To give a more specific example, in some embodiments of the present invention, the program code determined the distinguishing diagnoses by mutual information over five (5) years prior to an ALS diagnosis. From 48 to 60 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other hereditary and degenerative nervous system conditions, other nervous system disorders, paralysis, medical examination/evaluation, multiple sclerosis (MS), other screening for suspected conditions (not mental disorders or infectious disease), other upper respiratory disease, other connective tissue disease, headache (including migraine), and spondylosis; intervertebral disc disorders; other back problems. From 36 to 48 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other hereditary and degenerative nervous system conditions, other nervous system disorders, paralysis, spondylosis; intervertebral disc disorders; other back problems, other connective tissue disease, other screening for suspected conditions (not mental disorders or infectious disease), medical examination/evaluation, multiple sclerosis (MS), other non-traumatic joint disorders, and other upper respiratory disease. From 24 to 36 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other nervous system disorders, other hereditary and degenerative nervous system conditions, other connective tissue disease, spondylosis; intervertebral disc disorders; other back problems, paralysis, multiple sclerosis (MS), other upper respiratory disease, malaise and fatigue, other gastrointestinal disorders, and other screening for suspected conditions (not mental disorders or infectious disease). For 18 to 24 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other nervous system disorders, other hereditary and degenerative nervous system conditions, spondylosis; intervertebral disc disorders; other back problems, other connective tissue disease, paralysis, multiple sclerosis (MS), immunizations and screening for infectious disease, other gastrointestinal disorders, malaise and fatigue, and other non-traumatic joint disorders. For 12 to 18 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other nervous system disorders, other hereditary and degenerative nervous system conditions, other connective tissue disease, spondylosis; intervertebral disc disorders; other back problems, paralysis, malaise and fatigue, other gastrointestinal disorders, multiple sclerosis (MS), other non-traumatic joint disorders, and rehabilitation care; fitting of prostheses; and adjustment of devices. For 9 to 12 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other nervous system disorders, other hereditary and degenerative nervous system conditions, spondylosis; intervertebral disc disorders; other back problems, other connective tissue disease, paralysis, other gastrointestinal disorders, other non-traumatic joint disorders, malaise and fatigue, acquired foot deformities, and rehabilitation care; fitting of prostheses; and adjustment of devices. For 6 to 9 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other nervous system disorders, spondylosis; intervertebral disc disorders; other back problems, other hereditary and degenerative nervous system conditions, other connective tissue disease, paralysis, malaise and fatigue, other gastrointestinal disorders, rehabilitation care; fitting of prostheses; and adjustment of devices, other non-traumatic joint disorders, and other lower respiratory disease. For 3 to 6 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other nervous system disorders, spondylosis; intervertebral disc disorders; other back problems, other hereditary and degenerative nervous system conditions, other connective tissue disease, malaise and fatigue, other gastrointestinal disorders, paralysis, other upper respiratory disease, rehabilitation care; fitting of prostheses; and adjustment of devices, and other lower respiratory disease. For 0 to 3 months, the ten (10) most distinguishing diagnoses, from highest to lowest mutual information value, were determined by the program code to be as follows: other nervous system disorders, other connective tissue disease, other hereditary and degenerative nervous system conditions, spondylosis; intervertebral disc disorders; other back problems, malaise and fatigue, other gastrointestinal disorders, paralysis, rehabilitation care; fitting of prostheses; and adjustment of devices, other upper respiratory disease, other lower respiratory disease. By determining mutual information, the program code in embodiments of the present invention uncovers consistent data over voluminous records that would be impossible outside of the specialized processing, which is discussed herein. Based on identifying and ranking the mutual information above, the program code made certain discoveries regarding individuals with ALS that were not apparent before this analysis. The program code determined that connective tissue disease was significantly higher than the control population (ALS patients with the electronic data sets utilized) 5 years prior to ALS diagnosis. The code for muscle weakness was a significant driver of connective tissue disease diagnoses. Skin disorders were a prevalent code throughout the 5 years prior to diagnosis although they decreased in frequency as the patient neared ALS diagnosis. Other connective tissue disease, hereditary and degenerative nervous system conditions and other nervous system disorders were differentiating diagnoses throughout the 5 years leading up to ALS diagnosis. Connective tissue disease became a more prominent diagnosis as ALS diagnosis approached. Multiple sclerosis was one of the top differentiating diagnoses 5 years prior to ALS diagnosis, but diminished in prominence as ALS diagnosis approached. Malaise and fatigue and other gastrointestinal disorders appeared in the top ten differentiating diagnoses 36 months prior to ALS diagnosis, and increased in prominence as ALS diagnosis approached. Also, lower respiratory diseases did not appear in the top ten differentiating diagnoses until 9 months prior to ALS diagnosis. Other commonalities determined in this ALS example by the program code include, but are not limited to: ALS patients are distributed throughout the US, with higher concentrations in the Northeast, Florida, and Great Lakes, compared to the general population, ALS patients are skewed to older age and male gender, the patient geographic distribution is in line with the US population, 26.7% of patients had claims data for riluzole, 56% of the patients with ALS were covered by commercial insurance plans, 34% by Medicare, and 10% by Medicaid. As discussed above, the program code applies frequency ranking and mutual information procedures in embodiments of the present invention to identify the distinguishing features that include diagnoses, procedures, drugs, providers, and locations, which the program code later uses to determine predictors of the condition. Thus, with ALS, the program code, in determining the distinguishing features utilizing these techniques also determined: visits to the neurologist become much more common as patients near ALS diagnosis; visits to the gastroenterologist become less frequent relative to other providers in the 2 years prior to ALS diagnosis; visits to orthopedists had little change over time, while visits to otolaryngologists increased slightly; initially, visits to both orthopedic surgery and gastroenterology are common, but gastroenterology visits declined as patients neared diagnosis; and visits to the otolaryngologist increased as patients neared ALS diagnosis. Also, the program code determined that ALS patients more frequently saw orthopedists than neurologists between 18 and 60 months prior to diagnosis. The program code may also take into account feature continuity when determining predictors. In the ALS example, the program code, in its analysis to identify distinguishing features, determined that ALS patient features increased over time in the 5-year cohort, other nervous system disorders and other connective tissue disease increased disproportionately as patients approached diagnosis, and that unspecified disease of spinal cord and primary lateral sclerosis changed relatively little over time. Using the described analytic methods, the program code identified features in ALS patients' claims histories that differentiate them from the general population before initial ALS diagnosis. The program code determined that medically significant predictors seen in patients who were eventually diagnosed with ALS included, but were not limited to, nervous system disorders, hereditary and degenerative nervous system conditions, connective tissue disease, skin disorders, lower respiratory disease, gastrointestinal disorders, neurologist visits, orthopedic surgeon visits, gastroenterologist visits, non-traumatic joint disorder, otolaryngologist visits, and the use of riluzole prior to diagnosis. As is discussed herein, upon identifying the differentiated features, the program code analyzes combinatorial features that differentiate undiagnosed ALS patients from the general population to further characterize early predictors of ALS, and optimize the algorithm differentiating patients with ALS prior to diagnosis. Returning to the analysis to generate the predictive model, in embodiments of the present invention, as discussed above, for each category represented in the data set, the program code analyzes items in those categories over time and notes the absence or presence of each item that appears in the data set for each category. Returning to the disease example, in an embodiment of the present invention, the program code separately analyses codes in each of the following categories: Dx(t), Proc(t), Drug(t), Provider(t), Location(t)). The one or more programs considered features including diagnosis codes, procedure codes, medications, standard provider types, and standard care facility types. Specific items in these categories for ALS may include, but not be limited to, connective tissue diseases, nervous system disorders, gastrointestinal disorders, joint disorders, and multiple sclerosis (Dx(t)), diagnostic nervous system procedures, physical therapy, and magnetic resonance imaging (Proc(t)), riluzole and antibiotics (Drug(t)), neurologist, gastroenterologist, and orthopedist visits (Provider(t)), and office, outpatient facility, and patient home (Location(t)). Table 1 below illustrates an analysis of the program code of the presence and absence of certain items in a given category utilizing the orphan disease identification example. In Table 1, the variables 1 and 0 serve as categorical variables and represent whether the given item is absent or present at a given time. In the example of Table 1, the diagnosis codes assigned to individuals by medical professionals, in the data set, over time, are analyzed by the program code. In an embodiment of the present invention, the program code repeats this analysis for procedures, drugs, and the locations of the individuals represented in the records in the data set. As is understood by one of skill in the art, program code performing the analysis can identify nuances in the vast data set within a workable timeframe (e.g., during the visit of an individual to a health care provider) based on the utilization of the processing power of the computer system upon which aspects of the present invention are implemented.FIGS.4-7, which will be discussed herein, include computing configurations that are customized to handle the processing demands that the analysis performed by the program code utilizes TABLE 1Pat(N)t1t2t3. . .tnDx11011Dx20100. . .Dxn1111 Referring back toFIG.1, once the program code has identified patterns, in an embodiment of the present invention, the program code may weigh the features comprising the patterns in order of significance and remove data that do not include top features (130). Embodiments of the present invention employ more than one method of weighing and selecting significant features. As discussed in relation to the ALS example above, the program code may ranking the features based on the raw mutual information values. However, in some embodiments of the present invention, the program code may view the output of a classifier, e.g., SVM or random forest that will provide a numerical measure of the feature importance that can then be ranked. In an embodiment of the present invention, the program code may weigh a feature with more mutual information across records as more significant. Thus, the program code selects top features (i.e., features with largest values of mutual information, down to the level of significance) from each of the categories and orders them in descending order (according to the values of mutual information). By removing data that does not include top features, the program code focuses the analysis and increases the efficiency in later identifications. The universe of data related to, for example, individuals suffering from an orphan disease, may be extremely vast, and by weighing features of the data, the program code is able to consolidate the data set into a more manageable amount for processing. In an embodiment of the present invention, the program code determines the frequency of a code and represents this frequency with a number between 0 and 1. The program code utilizes these frequency codes to perform binning based on how often each item occurs within the data set. For ease of understanding, Table 1 displays binary values (1 and 0), however, a data set that is analyzed may include more than one event in a specific time slot, thus, a binary representation, such as Table 1 is not fully representative of this aspect of an embodiment of the present invention and is offered merely for ease of understanding. In fact, for a specific condition or disease, the table would not be binary, but would contain numerical values as the numerical values would represent frequency of a code appearing in a patients' health journey. In an embodiment of the present invention, the values in a matrix can represent the presence or absence of a code in a patient's history (as seen in Table 1), but can also represent the frequency with which the code occurs in that time slot. For example, if each column represents a month, then the numerical value can represent (1) the absence or presence of a code, (2) the number of times that code appears in that time slot, (3) the average frequency with which that code appears in that time slot, and (4) any function that can be applied to the value to represent events in that time slot. Aspects of embodiments of the present invention utilized to generate mutual information are the same regardless of the condition for which the program code is constructing this information. Thus, embodiments of the present invention are portable over an unlimited number of data sets and can be utilized to identify an unlimited number of events or conditions. As described above, the program code indexes tables in order to derive tables for use in the analysis and, as explained inFIGS.4-7, the computing is distributed based on the processing demands of the processes performed by the program code to generate the mutual information. In embodiments of the present invention, the program code computes mutual information for each feature as an independent process. The program code computes mutual information a specific feature and an output class variable. Computing the mutual information of two features in separate processes will not affect the result of either computed mutual information result. Returning toFIG.1, in an embodiment of the present invention, the program code may pre-process remaining data (140). For example, in an embodiment of the present invention, the program code may use a binning procedure using the average value of the corresponding feature as threshold, for example, values above the threshold are coded as 1, and values below it as 0. In an embodiment of the present invention, after pre-processing the remaining data, in embodiments where this part of the process is included, the program code utilizes the pre-processed data or access available data sets to build a training set by using statistical sampling (150). The training set includes data representing the event and data that represent an absence of the event. In some embodiments of the present invention, the training set comprises electronic records that are only readable by a computing resource. The program code formulates the training set by proportionally selecting representative electronic records from the target and control populations: the target population is the population with the condition (e.g., event, disease) and the control population is the population is the negative case (to distinguish from the target). Thus, in the example where an event is a disease, the training set includes disease entries and healthy entries. Departing from the specific disease example, in an embodiment of the present invention, the program code utilizes a test set of training data to train the machine learning algorithm. The training set is selected to include both records with the occurrence or condition the algorithm was generated to identify, and records absent this occurrence or condition. The program code tests/trains the individual features that comprise the mutual information (and/or other technologies discussed herein) selected to identify a given condition, and utilizing voting and ensemble learning, trains the algorithm. In an embodiment of the present invention, the program code may utilize the training set with the significant patterns identified in the analysis to construct and tune a machine learning algorithm, such that the algorithm can distinguish data comprising the event from data that does not comprise the event (160). The machine learning algorithm may be a linear SVM classification algorithm, which can be utilized with one or more of an RF grouping algorithm and/or a log regression. If the event is a disease, including an orphan disease, the program code may train the machine learning algorithm to separate database entries representing individuals with a disease from entries representing healthy individuals and/or individuals without this particular disease. The program code may utilize the machine learning algorithm, may assign probabilities to various records in the data set during training runs and the program code, may continue training the algorithm until the probabilities accurately reflect the presence and/or absence of a condition in the records within a pre-defined accuracy threshold. With certain diseases, the program code utilizes a support vector machine (SVM) classifier. The program code made a selection based on a comparative assessment of various classifiers. When building a model for ALS, in some embodiments of the present invention, the program code utilized random forest to generate predictors. In some embodiments of the present invention, using the disease example, the training set represents a patient population that had the disease. This defined patient population may consist of a constellation of codes, (diagnosis, procedures, drugs, etc.). The machine learning algorithm, which is discussed herein, learns from this defined patient population. In essence, the machine learning algorithm uses a surrogate patient population to find the undiagnosed patients. Stated in another way, the surrogate patient population consists of the patients known to have the disease, and the machine learning algorithms encode their pre-diagnosis characteristics to find similar patients and process the retrospective patient journey to predict the prospective patient journey. In the patient definition process (see, e.g.,FIG.2,220) the program code identifies cohort of patients that the machine learning algorithm will learn from; this patient cohort will serve as the training set. In embodiments of the present invention, the internal algorithms applied by the program code include, but are not limited to: 1) mutual information to inform or refine the patient definition; and/or 2) various datamining techniques, including but not limited to, histograms to capture procedures, drugs, diagnosis codes, specialty types, geographic location, patient demographics (age, gender), and co-morbidities. As aforementioned, in an embodiment of the present invention, the program code constructs the machine learning algorithm, which can be understood as a classifier, as it classifies records (which may represent individuals) into a group with a given condition and a group without the given condition. In an embodiment of the present invention, the program code utilizes the frequency of occurrences of features in the mutual information to identify and filter out false positives. The program code utilizes the classifier to create a boundary between individuals with a condition and the general population to lower multi-dimensional planes, given multiple dimensions, including, for example, fifty (50) to one hundred (100) dimensions. When embodiments of the present invention are employed to build a model to predict ALS, the one or more program employ an ensemble of classifiers developed employing machine learning techniques to optimize the selection and ranking of ALS diagnosis predictors (see, e.g.,FIG.2,230). As part of constructing a classifier (machine learning algorithm), the program code may test the classifier to tune its accuracy. In an embodiment of the present invention, the program code feeds the previously identified feature set into a classifier and utilizes the classifier to classify records of individuals based on the presence or absence of a given condition, which is known before the tuning. As aforementioned, the presence or absence of the condition is not noted explicitly in the records of the data set. When classifying an individual with a given condition utilizing the classifier, the program code may indicate a probability of a given condition with a rating on a scale, for example, between 0 and 1, where 1 would indicate a definitive presence. The classifier may also exclude certain individuals, based on the medical data of the individual, from the condition. In an embodiment of the present invention, the program code constructs more than one machine learning algorithm, each with different parameters for classification, based on different analysis of the mutual information, and generates an ultimate machine learning algorithm based on a sum of these classifiers. In an embodiment of the present invention, to decrease the instances of false positive results, in an embodiment of the present invention, when the algorithm is an SVM algorithm, the program code collects false positive results and sorts them according to their SVM score in order to identify false positives. In an embodiment of the present invention, to increase the comprehensibility and usability of the result, the program code post-processes records identified as including the event according to pre-defined logical filters. These pre-defined filters may be clinically derived (e.g., only males have this disease). In the disease example, the result of applying the classification algorithm is a sorted list of individuals suspected of having the disease. Departing from the specific disease example and returning toFIG.1, based on training the machine learning algorithm, the program code applies the constructed classification algorithm to the available data to identify records, including the event, and produces a list of occurrences (170). In some embodiments of the present invention, the constructed classification algorithm is a database object that is stored in a memory resource that is communicatively coupled to the processing resource executing the program code. In some embodiments of the present invention, the list produced is a machine-readable data set that is saved by the program code in stored in a memory resource that is communicatively coupled to the processing resource, including but not limited to, a relational database. As discussed earlier, this process is illustrated inFIG.2. FIG.3is a workflow300of certain aspects of an embodiment of the present invention. In order to offer a comprehensive example of the operation of an embodiment of the present invention,FIG.3uses disease identification in population data as an example of the invention's capability in identifying events across one or more data set. Aspects of this workflow300are relevant to the specific ALS model disclosed herein.FIG.3also demonstrates how the machine learning utilized in the present invention is a continuous process and an evolving process. The training of an algorithm, including but not limited to, an SVM algorithm and/or a random forest algorithm, can be an ongoing and iterative process. For example, the algorithm may include a machine learning algorithm that is continuously trained by the program code as validated samples and their extracted patterns are applied to the training algorithms. Referring toFIG.3, the program code receives data related to a patient population diagnosed with a given disease (310). This data is provided in the form of machine-readable electronic medical records. Thus, the program code obtains the data. From the data, the program code isolates data defining a general control population (320). In an embodiment of the present invention, the control population serves as a negative example to the learning algorithm. In addition, the control population can incorporate clinically derived comorbidities to distinguish further the population with the disease from the population without the disease. The program code identifies mutual information across the records of the patients in the general control population (330). The program code selects features common to the records and weighs the features in accordance with commonality (340). The program code selects features of a pre-defined weight and utilizes those features to generate a machine learning algorithm (350). In an embodiment of the present invention, the program code selects features that meet a certain pre-defined threshold based upon the prevalence of the feature in the initial data set. In an embodiment of the present invention, the model defines a group of features for an individual with the disease. The program code employs the machine learning algorithm to generate additional predictions as to features that may be common among the previously diagnosed population (360). Returning to the ALS example. The one or more programs in some embodiments of the present invention derived predictors (e.g., diagnosis predictors, seeFIG.2,230) by differentiating features selected by mutual information and ranking/weighing the features utilizing relative frequency. In some embodiments of the present invention, the one or more programs may generate additional predictions by utilizing data in particular time periods. In building predictors for ALS, the one or more programs in an embodiment of the present invention generated predictors utilizing data within the following time brackets: 3, 6, 9, 12, 18, 24, 36, 48, and 60 months before the initial ALS diagnosis. As will be understood by one of skill in the art, patterns or commonalities in the data among various individuals with a given condition may not be readily apparent when the program code scans the data. For this reason, the machine learning algorithm assists the program code in predicting what some commonalities may be, based on already-identified commonalities. The program code can then test whether these predictions represent actual patterns. When a prediction is sufficiently prevalent, the program code updates the pattern and therefore, the machine learning algorithm, to include this quality. The identification of features, generation of a model, and generation of prediction for additional features, is an iterative process that tunes the machine learning algorithm that the program code ultimately utilizes to identify undiagnosed patients in an expanded data set. Additionally, the program code can utilize features derived from one data set in an analysis of another data set. Thus, based on the predictions, the program code selects features common to the records and weighs the features in accordance with commonality (340). The program code selects features of a pre-defined weight and utilizes those features to update the model (350). Thus, the machine learning aspect of an embodiment of the present invention is iterative. As demonstrated inFIG.3, not only does the program code train a machine learning algorithm based on weighted mutual information initially identified by the program code upon obtaining and/or receiving the data, the algorithm also generates predictions for data that may exist in the data set that was not initially identified, enabling the program code to further analyze the data based in these predictions, validate or invalidate the predictions, and based on this result, further train the algorithm to improve its ability to identify, for example, undiagnosed patients with a given disease. Returning toFIG.3, the program code applies the machine learning algorithm to identify undiagnosed individuals with a disease in a larger population (360). In an embodiment of the present invention, the program code can align the determination of a diagnosis for a given individual with the timing of the diagnosis as related to items in the mutual information that match up with the data related to the individual. An important challenge of identifying an isolated event in a data set utilizing a machine learning algorithm that can utilize unlimited parameters of varying complexity is that the computation can be extremely inefficient, as the algorithms scale non-linearly. Thus, when the program code trains and applies the machine learning algorithm to identify undiagnosed individuals with a disease in a larger population (360), in embodiments of the present invention, the queries utilized in the training and application of the algorithm are distributed to increase the efficiency of the process. Specifically, in an aspect of certain embodiments of the present invention, the program code receives queries throughout the process of identifying the events in the data set and evaluates the complexity of the queries before assigning a computer resource to answer the query. For example, in an embodiment of the present invention, the program code decides where to route a query based on the complexity of the anticipated answer to the query. In this manner, the program code sends a straightforward database query that can be answered with a single value pulled from a data set in response to a resource configured to respond efficiently to this type of query. Meanwhile, queries that require more complex responses, such as queries included in the execution of the machine learning algorithm, may be distributed over a group of resources to maximize efficiency, without compromising functionality. In an embodiment of the present invention, the program code builds and improves the model through machine learning at a granular level. The model building code architecture is integrated in the sense that the only input needed is a list of patient IDs (de-identified patient ID numbers), and a list of features to include in the model. The model builder sets up the testing and training sets, extracts the appropriate retrospective patient histories from the database and builds a suite of models, optimizes them, ensembles them and then generates a report on their performance. In an embodiment of the present invention, a database comprises a set of tables that are derived from the raw data obtained from the claims data vendor. This new data architecture combines the relevant data elements from all the “raw” tables and produces tables that contain only the pertinent information used for the machine learning models. The tables are indexed (internal database optimization) so that queries execute faster. In embodiments of the present invention, the program code derives a set of population tables from the raw tables, extracting data elements pertinent and representative of each patient's health journey. The extracted data includes, for each record, the diagnosis code, the date, the patient id number, the drug code, the procedure code, and all matched to the date on the claim. In embodiments of the present invention, separate tables exist for the diagnosis code, drugs code, procedure code, and the specialty type. FIG.4depicts a technical architecture that may be utilized by an embodiment of the present invention. In an embodiment of the present invention, a user utilizes a workstation310to connect to a distributed computing environment320over a network connection. The network utilized can be wired, wireless or hybrid and may be public or private, depending upon the data security employed in the delivery of the data. The network may include the Internet. The distributed computing environment is layered in order to service efficiently the queries and machine learning of the method. Layers includes a visualization layer330responsible for delivery of comprehensive results, an analysis layer340responsible for processing and responding to queries that require straightforward data access answers, a data language layer350to extract, transform, load, generate derived tables to increase efficiency, extract and prepare data for machine learning algorithms, and/or apply information theoretic techniques to extract all features, and a distributed computing layer360responsible for allocating resources for processing various threads utilized in embodiments of the present invention. The program code in the distributed computing layer360manages at least one server370(the cluster of five servers inFIG.4is merely one example used to illustrate and is not limiting). The distributed computing layer360receives each query and/or instruction and the program code in the distributed computing layer decides, based on the type of response the query requests or the complexity of the instruction, whether to distribute the query or instruction to a resource in of the managed resources370and to which resource the query/instruction should be distributed. FIG.5depicts another architecture that can be utilized by embodiments of the present invention. In this technical environment, rather than a data languages layer, a combined data/distribution management layer460layer manages distribution to the managed resources470, as well as to at least one dedicated processing resource480, which handles the machine learning. This dedicated processing resource480can handle multiple threads simultaneously. At the data/distribution management layer, the program code receives a query and based on the type of response the query is requesting, the program code decides whether to distribute the query to the managed resources470or to answer the query with the resource in the data/distribution management layer460. In embodiments of the present invention, general database queries are handled by resources at the data/distribution management layer460without further distribution. In addition, the distributing functionality, program code executing on resources in the data/distribution management layer460also interact with the dedicated processing resource to select the parameters utilized in the machine learning. FIG.6is one example of a computing environment utilized by some embodiments of the present invention that includes elements of a cloud590. In this example, the program code utilizes the resource of the cloud590to pre-populate data at rest so that the data utilized by the program code in the present invention both to train the machine learning algorithm and ultimately to identify records with a given event (e.g., disease) is unlimited. Aspects of certain embodiments of the present invention can be deployed as SaaS utilizing this cloud590environment. FIG.7is another examples of a technical environment that can be a portion of an embodiment of the present invention. In this example, as withFIG.6, the present invention that includes elements of a cloud590. In this example, as withFIG.6, the program code utilizes the resource of the cloud590to pre-populate data at rest so that the data utilized by the program code in the present invention both to train the machine learning algorithm and ultimately to identify records with a given event (e.g., disease) is unlimited. Aspects of certain embodiments of the present invention can be deployed as SaaS utilizing this cloud590environment. Utilizing the technical architecture of this figure, program code will execute: (1) on the 5 machine network, and/or (2) on AWS cloud computing infrastructure. FIG.8is a general workflow800that illustrates aspects of various aspects of some embodiments of the present invention. This workflow800provides a general guide to certain features of embodiments of the present invention. Each aspect of this workflow800is performed by program code executed by at least one processing circuit. As illustrated inFIG.8, the program code performs patient definition810, feature extraction820, feature selection830, machine learning based classifier development840, and prediction of the remaining patients in the database850. The application of certain aspects of embodiments of the present invention to the identification of diseases can be understood in the context of the example that follows. Below, for ALS, data related to the demographics of a patient population diagnosed with ALS was obtained by one or more programs from a database of de-identified patient claims data acquired from an insurance claims database. For example, a database utilized in an embodiment of the present invention may comprise data covering eight years. An embodiment of the present invention was utilized to discover patients within this database who had not yet been diagnosed with ALS. Although ALS is used specifically in this example, the process is also relevant to a generic Disease 1. The description is therefore genericized in order to illustrate the functionality. Stage 1: Patient Definition (e.g.,FIG.2,210;FIG.8.810) In order to identify individuals with ALS in the database to utilize in order to ultimately identify other individuals, the one or more programs define an ALS patient by utilizing information in the records related to ICD-9 and certain ALS-specific drugs, here referred to as Drug 1, Drug 2, and Drug 3. This set of patients is referred to as the “gold standard” ALS group. For example, the patient definition used for ALS consists of the ICD-9 and ICD-10 diagnosis codes along with the relevant drugs, one of which being riluzole. The program code may apply a set of definitions, which may include or exclude drugs (i.e., riluzole). In some embodiments of the present invention, the definition applied by the one or more programs may also include or exclude related conditions, along with a specific repeatability that the one or more programs identify by observing the codes. Stage 2: Model Creation (e.g.,FIG.2,220;FIG.8.820-840) In order to identify which features or combination of features are most statistically relevant for differentiating ALS from non-ALS patients, an information-theoretical concept of mutual information was utilized to determine the differentiating features. As discussed earlier, mutual information is a measure of how much information about one set of data can be determined from another set of data. Features or their combinations with higher mutual information values are likely to be more informative for discriminating ALS from non-ALS patients. After the program code determined the mutual information of individual features or their combinations, the program code begins feature selection. The goal of feature selection is to define the smallest subset of features that collectively contain most of the mutually shared information and thus most clearly define the characteristics of the ALS patient. As discussed above, machine learning algorithms drive the analysis of feature selection that created a model of ALS. Thus, the program code generates a model consisting of the fewest possible and simultaneously most differentiating characteristics of the ALS patients, resulting in an enhanced patient definition. Stage 3: Prediction (e.g.,FIG.2,230;FIG.8.850) Once the program code determines a model of the characteristics of the ALS patient from the gold standard ALS patients, the program code scores the remaining population of patients in the data set by the model to find undiagnosed patients. In order to score patients, the program code computes the features for every patient in the data set not in the set of gold ALS patients. Each patient's features (or characteristics) were input to the ALS computer model and the program code produced a numerical score. This numerical score is the likelihood that the patient is an undiagnosed ALS patient. The numerical score can be used to rank patients from those who are most likely to be undiagnosed with ALS to those that are least likely to have ALS. In this case model scores were generated for over 170 million patients. The prioritized list may be used to allocate resources to better address the needs of the highest likely patients. In an embodiment of the present invention, the training set is processed dynamically and informs and tunes the model and the data of unknown patients is continually utilized to tune the model. For example, during the building phase of the model, the output of the model with a training set input, is compared to a known label (patient with disease or not) (supervised learning). The error is used to modify the internal parameters of the model. This process continues until the error is minimized. However, once the model is built, it is then used to score the patients. For each patient (e.g., of the at least 180 million), the features are computed and fed through the model. The output of the model indicates whether the patient is a likely undiagnosed disease patient or not. (The output is binary.) Stage 4: Validating ALS Patients There are two approaches considered to validate that the predicted undiagnosed ALS patients actually have the condition. The first approach is to perform a field validation, where the appropriate personnel are deployed at providers to educate them on the characteristics of potential ALS patients. The providers would then call in those patients and get them tested for ALS. This process could take several months. An alternative approach is to monitor the health claims of the predicted patients over time. As the healthcare claims data is updated (monthly), new ALS patients with a definitive diagnosis indication would be flagged. In this manner the number of predicted undiagnosed patients that were validated to have the disease can be determined without engaging the sales force or medical science liaisons. In addition how far ahead in time the prediction was made before the true diagnosis can be determined. In this example, applying the model to the remaining population of the database yielded 2,142 to 3,113 potentially undiagnosed ALS patients. The number varied depending on the specific model (generated by the program code) utilized. The information identified by the program code and incorporated in the model includes age, gender, diagnosis codes, procedures, prescriptions, provider types, and facility types. As discussed above, program code in an embodiments of the present invention may store the resultant model in a database and continually update/tune the model as the repeated application provides more intelligence. Some embodiments of the present invention include a computer-implemented method, a computer system, and a computer program product where one or more programs in a distributed computing environment, obtain one or more machine-readable data sets related to a patient population diagnosed with a disease, from one or more databases. Based on a frequency of features in the one or more data sets, the one or more programs identify common features in the one or more data sets and weight the common features, based on frequency of occurrence in the one or more data sets, where the common features include mutual information. The one or more programs generate one or more patterns that include a portion of the common features. The one or more programs generate one or more machine learning algorithms based on the one or more patterns, the one or more machine learning algorithms to identify presence or absence of the given disease in an undiagnosed patient based on absence or presence of features comprising the one or more patterns in data related to the undiagnosed patient. The one or more programs utilize statistical sampling to compile a training set of data, wherein the training set comprises data from the one or more data sets and at least one additional data set including data related to a population without the disease, and where utilizing the statistical sampling comprises formulating and obtaining queries based on the data set and processing and responding to the queries, the processing includes, for each query: the one or more programs evaluating the query to determine one of a high or a low level of anticipated complexity of a prospective response to the query, based on the query being evaluated at a low level of anticipated complexity, the one or more programs assigning the query to a computing resource in the distributed computing environment, where the computing resource is configured to respond to low level complexity queries, and based on the query being evaluated at a high level of anticipated complexity, the one or more programs distributing the query over a group of computing resources of the distributed computing environment to maximize efficiency, where the distributing includes assigning each computing resource of the group of computing resources a portion of the query to execute in parallel with at least one other computing resource of the group of computing resources executing another portion of the query. The one or more programs tune the one or more machine learning algorithms by applying the one or more machine learning algorithms to the training set of data. The one or more programs dynamically adjust the common features including the one or more patterns to improve accuracy, such that the one or more machine learning algorithms can distinguish patient data indicating the disease from patient data that does not indicate the disease. The one or more programs determine, based on applying the one or more machine learning algorithms to data related to the undiagnosed patient, a probability, where the probability is a numerical value indicating a percentage of commonality between the data related to the undiagnosed patient and the one or more patterns. In some embodiments of the present invention, the one or more programs generate the one or more patterns by ranking the common features based on the weighting and retaining the portion of the common features where the portion includes common features of a pre-defined weight, wherein the portion comprises the one or more patterns. In some embodiments of the present invention, the one or more programs identify the common features based on a commonality in timestamps associated with the occurrence of the common features in the data set. In some embodiments of the present invention, the mutual information includes features from a plurality of feature categories and wherein each pattern of the one or more patterns comprising a portion of the common features comprises features in one feature category of the plurality of feature categories. In some embodiments of the present invention, the disease is amyotrophic lateral sclerosis and the features are selected from the group consisting of: connective tissue diseases, nervous system disorders, joint disorders, hereditary and degenerative nervous system conditions, multiple sclerosis, malaise and fatigue, and gastrointestinal disorders. In some embodiments of the present invention, one feature category is selected from the group consisting of: diagnosis codes, procedures, drug treatments, providers, and locations. In some embodiments of the present invention, the one or more machine learning algorithms include a linear Support Vector Machines classification algorithm. In some embodiments of the present invention, the one or more machine learning algorithms include at least two machine learning algorithms and the tuning further includes: the one or more programs compile results of the tuning of each of the at least two machine learning algorithms and utilize ensemble learning to consolidate portions of the at least two machine learning algorithms into a single machine learning algorithm. In some embodiments of the present invention, in tuning, the one or more programs associate, based on applying the one or more machine learning algorithms to the training set of test data, probabilities to a portion of the records in the training set of test data, wherein the probabilities reflect a likelihood of presence of the disease for each record training set of test data, and the one or more programs complete the dynamically adjusting of the common features when the probabilities are within a pre-defined accuracy threshold. In some embodiments of the present invention, the disease is amyotrophic lateral sclerosis. In some embodiments of the present invention, to determine the probability, the one or more programs obtain, from a computing resource, electronic medical records for the undiagnosed patient for a defined temporal period, wherein the electronic medical records comprise electronic contact information for a healthcare provider to the undiagnosed patient. The one or more programs apply the one or more machine learning algorithms to the electronic medical records. The one or more programs determine, based on the applying, if the probability is within a predetermined range. Based on determining that the probability exceeds a predetermined threshold, the one or more programs electronically alert, in real time, the healthcare provider to the undiagnosed patient of the probability. In this manner, a patient who is at a healthcare provider for an appointment, can receive time sensitive information that may lead the healthcare provider to make a diagnosis. In some embodiments of the present invention, the one or more programs retain, in a memory resource communicatively coupled to the one or more processors, the one or more patterns. The one or more programs obtain an indication regarding accuracy of the probability. The one or more programs update the one or more patterns based on the indication. In some embodiments of the present invention, the probability indicates a probability that the undiagnosed patient has the disease. FIG.11illustrates various aspects of a technical architecture1100utilized to deploy some embodiments of the present invention as a service, for example, utilizing a distributed computing environment, including but not limited to a cloud computing environment. As depicted inFIG.11, in certain embodiments of the present invention, one or more programs parse a data set in which the event is present in each record and identifies patterns (comprised of features) across records that relate to these parameters (e.g.,FIG.1,120), but the data set is comprised by multiple data sets1110a-1110n. These data sets1110a-1110nmay include, but are not limited to, third party electronic health records, payer database that enable a third party to flag patients for early interventions, etc. In order to parse these varied data sets1110a-1110n, the one or more programs may be deployed to computing nodes1120that host the varied data sets1110a-1110nand/or various computing nodes1130that are in communication with the data sets1110a-1110n. When the one or more programs build a training set of data (e.g.,FIG.1,150), the one or more programs may consolidate the data from the varied data sets1110a-1110ninto a centralized memory module1140, where the one or more programs may access the data to construct a machine learning algorithm such that the algorithm can distinguish data comprising the event from data that does not comprise the event (e.g.,FIG.1,160). As the data sets1110a-1110nare not static (they may be controlled by various parties and therefore consistently updated with additional information), not only can the one or more programs apply the constructed classification algorithm to the available data to identify records including the event and produce a list of occurrences (e.g.,FIG.1,170), but the one or more programs (e.g., as deployed for accessing the data sets1110a-1110n), continually ingest data from the data sets1110a-1110nand dynamically updates features and patient predictions in real time.FIG.12is a workflow that demonstrates the continuous updates to the algorithm enabled by the dynamic nature of the data sets. FIG.12is a workflow1200utilized in certain embodiments of the present invention. In an embodiment of the present invention, one or more programs identify data sets from more than one source related to a patient population diagnosed with a medical condition (e.g., ALS) (1210). The data sets may include, but are not limited to, third party electronic health records, payer database that enable a third party to flag patients for early interventions. In some embodiments of the present invention, the one or more programs standardize the records from the diverse sources for analysis (1220). The one or more programs identify common features in the data sets and weight the common features based on frequency of occurrence in the data sets, wherein the common features comprise mutual information (1230). In some embodiments of the present invention, the one or more programs may execute individually on each data set and then, once the patterns are identified in each individual set, the one or more programs can cross reference the results with those of the other data sets. Alternatively, the records indicating the condition may be consolidated by the one or more programs and may be analyzed at contemporaneously. The one or more programs generate one or more patterns comprising a portion of the common features (1240). The one or more programs generate one or more machine learning algorithms based on the one or more patterns, the one or more machine learning algorithms to identify presence or absence of the given medical condition in an undiagnosed patient based on absence or presence of features comprising the one or more patterns in data related to the undiagnosed patient (1250). The one or more programs identify additional data relevant to the patient population diagnosed with the medical condition in the data sets (1260). This identification (e.g.,1210,1260) is continuous based on changes to the data sets. Based on updates, the one or more programs progress through the workflow1200and continuously (e.g., in real-time) update the one or more machine learning algorithms (1250). As discussed above, the program code may be deployed over various computing nodes in order to access the various data sets (e.g.,FIG.11,1110a-1110n), thus, the one or more programs are able to continuously determine the additions/deletions/changes in the data sets, analyze the data, and identify common features in the data sets and weight the common features based on frequency of occurrence in the data sets, wherein the common features comprise mutual information (1230). Although the real-time tuning aspect of the algorithm is demonstrated inFIG.12utilizing an embodiment of the present invention similar toFIG.2, various embodiments of the present invention may consistently utilize additional data and changes in data to tune the algorithms generated by the program code, including in real-time, in order to increase the accuracy of identifications. In certain embodiments of the present invention the program code utilizes supervised, semi-supervised, or unsupervised deep learning through a single- or multi-layer neural network (NN) to create complex intermediate features and weightings from the feature sets and classify patients into multiple categories related to the presence and progression of a condition (e.g., ALS). As understood by one of skill in the art, neural networks are a biologically-inspired programming paradigm which enables a computer to learn from observational data. This learning is referred to as deep learning, which is a set of techniques for learning in neural networks. Neural networks, including modular neural networks, are capable of pattern recognition with speed, accuracy, and efficiency, in situation where data sets are multiple and expansive (e.g.,FIG.11,1110a-1110n). Modern neural networks are non-linear statistical data modeling tools. They are usually used to model complex relationships between inputs and outputs or to identify patterns in data (i.e., neural networks are non-linear statistical data modeling or decision making tools). In general, program code utilizing neural networks can model complex relationships between inputs and outputs and identify patterns in data. Because of the speed and efficiency of neural networks, especially when parsing multiple complex data sets, neural networks and deep learning provide solutions to many problems in image recognition, speech recognition, and natural language processing. FIG.13is workflow1300where the program code utilizes neural networks in order to develop one or more patterns that can be utilized to segregate data that represents individuals with a likelihood of a condition (e.g., ALS). As illustrated inFIG.13, in some embodiments of the present invention, program code trains a single or multiple layer neural network algorithm to segregate database entries into multiple classes, for example, in the case of ALS being the condition: 1) entries representing individuals likely to have ALS, 2) individuals likely to develop ALS within a near-term time period, 3) individuals likely to develop ALS within a long-term time period, and 4) individuals not likely to develop ALS. An advantage of certain embodiments of the present invention that utilize NNs is the ability to produce highly non-linear decision boundaries for directly separating database entries into multiple classes, rather than, for example, a linear SVM, which separates database entries into two classes based on a linear decision boundary. To utilize SVMs to achieve multiple class separation, in embodiments of the present invention, the one or more programs layer multiple SVMs. Another advantage of certain embodiments of the present invention that utilize NNs is that the one or more programs, in utilizing the NNs, may automate feature selection by ingesting raw data and produce intermediate features that enable separation of the database entries into multiple classes. Certain machine learning methods may utilize a refined set of features from the raw data to achieve classification of database entries (e.g.,FIG.12,1220). In embodiments of the present invention, the one or more programs can utilize NNs without pre-refining features from raw data. This is an advantage afforded by the utilization of NNs. In certain embodiments of the present invention the program code utilizes a recurrent neural network (RNN). An RNN is a class of NN where connections between units form a directed cycle in order to exhibit dynamic temporal behavior. Unlike feedforward NNs, RNNs can use their internal memory to process arbitrary sequences of inputs. For this reason, current applications of RNNs include unsegmented data recognition, connected handwriting recognition, and speech recognition. Returning toFIG.13, in embodiments of the present invention, the one or more programs utilize an RNN and data in the data sets (e.g.,FIG.11,1110a-1110n) to learn an optimal set of features for classifying patients into the above multiple categories, which are related to the presence and progression of the condition (1310). Utilization of the RNN enables the program code to account for the temporal dynamics of a patient's health (i.e., changes in the data sets,FIG.11,1110a-1110n). The one or more programs generate (complex) intermediate features and weightings from the learned features (1320). Based on the intermediate features and weightings from the learned features, the one or more programs classify patients into multiple categories related to the condition (1330). In addition to the advantages offered by embodiments of the present invention that utilize NNs, embodiments of the present invention that utilize RNNs offer advantages such as accounting for the temporal dynamics of a patient's health history to improve the ability of the algorithm to separate database entries into multiple classes, and direct learning of the optimal features for achieving good performance in classifying the individuals represented by the data. Returning toFIG.1, in some embodiments of the present invention, after the program code utilizes the pre-processed data or access available data sets to build a training set by using statistical sampling (150), rather than or in addition to utilizing the training set with the significant patterns identified in the analysis to construct and tune a machine learning algorithm, such that the algorithm can distinguish data comprising the event from data that does not comprise the event (160), the program code utilizes the features learned by a NN to train the machine learning algorithm (i.e., a simpler classification algorithms) used by the program code (e.g., SVMs) to boost classification performance (not pictured inFIG.1). FIG.14depicts a workflow1400where the parallel functionality of an SVM approach and an NN approach are utilized by the program code to boost classification performance of a resultant classifier algorithm. As depicted inFIG.14, certain of the aspects may be executed in parallel and/or contemporaneously. In some embodiments of the present invention, one or more programs define filter parameters for a given condition (1410). To generate the SVM classifier, the one or more programs analyze the data sets in which the condition is present in each record and identify patterns (comprised of features) across records that relate to these parameters (1420). The one or more programs pre-process remaining data (1440), which as discussed above, is not performed by the one or more programs when utilizing NNs to identify features as NNs can utilize raw data. The one or more programs utilize the pre-processed data to build a training set by using statistical sampling (1450). The one or more programs utilize the training set to construct a SVM classification algorithm that can distinguish data comprising the condition from data that does not comprise the condition (1460). Based on the one or more programs defining filter parameters for a given condition (1410), in parallel and/or sequentially, the one or more programs utilize an RNN to learn a set of features for classifying patients into multiple categories related to presence and progression of the condition, based on data sets in which the condition is present in each record (1425). The one or more programs generate intermediate features and weightings from the learned features (1435). The one or more programs utilize the intermediate features learned by the NN to train the SVM classification algorithm (1465). The one or more programs apply the constructed and tuned classification algorithm to the available data to parse the records into multiple classifications (1470). The classifications may be binary and identify individuals with the condition, but based on the NN, the one or more programs may identify records in multiple categories, including: 1) entries representing individuals likely to have the condition (e.g., ALS), 2) individuals likely to develop the condition within a near-term time period, 3) individuals likely to develop the condition within a long-term time period, and 4) individuals not likely to develop condition. Embodiments of the present invention include a computer-implemented method, a computer program product, and a computer system that include one or more programs (executed by one or more processors in a distributed computing environment) that continually obtain a plurality of machine-readable data sets related to a patient population diagnosed with a medical condition from one or more databases, wherein each data set is obtained from a different computing node in the distributed computing environment. The one or more programs continually apply a neural network to the plurality of data sets to machine learn an optimal set of features for classifying patients into a plurality of categories related to presence or progression of the medical condition, where the machine learned optimal set of features comprise features identified by the neural network as occurring over the plurality of data sets and weighted by the neural network. The one or more programs continually generate, based on the machine learned optimal set of features, intermediate features, based on the weightings of a portion of the machine learned optimal set of features, where the intermediate features comprise a model of the condition. The one or more programs obtain at a given time, one or more data sets related to a population a patient population not diagnosed with the condition. The one or more programs evaluate and classify, based on the evaluating, a portion of records comprising the one or more data sets into the plurality of categories related to the condition, based on a current model, where based on the continually obtaining, continually applying, and continually generating, the current model is a version of the model generated in real-time based on the given time. In some embodiments of the present invention, the plurality of categories consist of: records representing individuals likely to have the condition, individuals likely to develop the condition within a near-term time period, individuals likely to develop the condition within a long-term time period, and individuals not likely to develop the condition. In some embodiments of the present invention, each data set of the plurality of machine-readable data sets is administered by one or more processors outside operational control of the one or more processors obtaining the plurality of machine-readable data. In some embodiments of the present invention, based on a frequency of features in the plurality of data sets, the one or more programs identify additional common features in the plurality of data sets and weighting the additional common features based on frequency of occurrence in the plurality of data sets, wherein the additional common features comprise mutual information. The one or more programs generate one or more patterns comprising a portion of the additional common features. The one or more programs generate, utilizing one or more support vector machines, one or more classifier algorithms based on the one or more patterns, the one or more classifier algorithms to identify presence or absence of the given medical condition in an undiagnosed patient based on absence or presence of features comprising the one or more patterns in data related to the undiagnosed patient. The one or more programs tune, based on the current model, the one or more classifier algorithms. The one or more programs classify, based on the one or more tuned classifier algorithms, a second portion of records comprising the one or more data sets into the plurality of categories related to the condition. In some embodiments of the present invention, the one or more programs obtain, at a second given time an additional one or more data sets related to a population a patient population not diagnosed with the condition. The one or more programs classify a portion of records comprising the additional one or more data sets into a plurality of categories related to the condition, based on a new current model, wherein based on the continually obtaining, continually applying, and continually generating, the new current model is a version of the model generated in real-time at the second given time. In some embodiments of the present invention, the medical condition comprises amyotrophic lateral sclerosis. In some embodiments of the present invention, the one or more programs generate, from a portion of the classified records, a new machine-readable data set related to a patient population diagnosed with a medical condition. The one or more programs include the new machine-readable data set in the plurality of machine-readable data sets, for the continually obtaining. In some embodiments of the present invention, one or more of the plurality of machine-readable data sets are obtained in different formats, and the continually applying and the continually generating do not include per-processing data comprising the plurality of machine-readable data sets. In some embodiments of the present invention, the neural network is a recurrent neural network. In some embodiments of the present invention, the optimal set of features weighted by the neural network are weighted based on a criterion selected from the group consisting of: frequency of occurrence across the plurality of machine-readable data sets, mutual information across the plurality of machine-readable data sets, presence or absence of occurrence across the plurality of machine-readable data sets, percentage of records of the plurality of machine-readable data sets comprising an occurrence of the medical condition. FIG.9illustrates a block diagram of a resource1300in computer system110and/or terminal120a-120b, which is part of the technical architecture of certain embodiments of the technique. The resource1300may include a circuitry370that may in certain embodiments include a microprocessor354. The computer system1300may also include a memory355(e.g., a volatile memory device), and storage181. The storage181may include a non-volatile memory device (e.g., EPROM, ROM, PROM, RAM, DRAM, SRAM, flash, firmware, programmable logic, etc.), magnetic disk drive, optical disk drive, tape drive, etc. The storage355may comprise an internal storage device, an attached storage device and/or a network accessible storage device. The system1300may include a program logic330including code333that may be loaded into the memory355and executed by the microprocessor356or circuitry370. In certain embodiments, the program logic330including code333may be stored in the storage181, or memory355. In certain other embodiments, the program logic333may be implemented in the circuitry370. Therefore, whileFIG.2shows the program logic333separately from the other elements, the program logic333may be implemented in the memory355and/or the circuitry370. Using the processing resources of a resource1300to execute software, computer-readable code or instructions, does not limit where this code can be stored. Referring toFIG.10, in one example, a computer program product700includes, for instance, one or more non-transitory computer readable storage media702to store computer readable program code means or logic704thereon to provide and facilitate one or more aspects of the technique. As will be appreciated by one skilled in the art, aspects of the technique may be embodied as a system, method or computer program product. Accordingly, aspects of the technique may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, micro-code, etc.) or an embodiment combining software and hardware aspects that may all generally be referred to herein as a “circuit,” “module” or “system.” Furthermore, aspects of the technique may take the form of a computer program product embodied in one or more computer readable medium(s) having computer readable program code embodied thereon. Any combination of one or more computer readable medium(s) may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical or any suitable combination thereof. A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus or device. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using an appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing. Computer program code for carrying out operations for aspects of the technique may be written in any combination of one or more programming languages, including an object oriented programming language, such as Java, Smalltalk, Java, Python, R-Language, C++ or the like, and conventional procedural programming languages, such as the “C” programming language, assembler or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider). Aspects of the technique are described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. These computer program instructions may also be stored in a computer readable medium that can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions stored in the computer readable medium produce an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks. The computer program instructions, also referred to as computer program code, may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. In addition to the above, one or more aspects of the technique may be provided, offered, deployed, managed, serviced, etc. by a service provider who offers management of customer environments. For instance, the service provider can create, maintain, support, etc. computer code and/or a computer infrastructure that performs one or more aspects of the technique for one or more customers. In return, the service provider may receive payment from the customer under a subscription and/or fee agreement, as examples. Additionally or alternatively, the service provider may receive payment from the sale of advertising content to one or more third parties. In one aspect of the technique, an application may be deployed for performing one or more aspects of the technique. As one example, the deploying of an application comprises providing computer infrastructure operable to perform one or more aspects of the technique. As a further aspect of the technique, a computing infrastructure may be deployed comprising integrating computer readable code into a computing system, in which the code in combination with the computing system is capable of performing one or more aspects of the technique. As a further aspect of the technique, the system can operate in a peer to peer mode where certain system resources, including but not limited to, one or more databases, is/are shared, but the program code executable by one or more processors is loaded locally on each computer (workstation). As yet a further aspect of the technique, a process for integrating computing infrastructure comprising integrating computer readable code into a computer system may be provided. The computer system comprises a computer readable medium, in which the computer medium comprises one or more aspects of the technique. The code in combination with the computer system is capable of performing one or more aspects of the technique. Further, other types of computing environments can benefit from one or more aspects of the technique. As an example, an environment may include an emulator (e.g., software or other emulation mechanisms), in which a particular architecture (including, for instance, instruction execution, architected functions, such as address translation, and architected registers) or a subset thereof is emulated (e.g., on a native computer system having a processor and memory). In such an environment, one or more emulation functions of the emulator can implement one or more aspects of the technique, even though a computer executing the emulator may have a different architecture than the capabilities being emulated. As one example, in emulation mode, the specific instruction or operation being emulated is decoded, and an appropriate emulation function is built to implement the individual instruction or operation. In an emulation environment, a host computer includes, for instance, a memory to store instructions and data; an instruction fetch unit to fetch instructions from memory and to optionally, provide local buffering for the fetched instruction; an instruction decode unit to receive the fetched instructions and to determine the type of instructions that have been fetched; and an instruction execution unit to execute the instructions. Execution may include loading data into a register from memory; storing data back to memory from a register; or performing some type of arithmetic or logical operation, as determined by the decode unit. In one example, each unit is implemented in software. For instance, the operations being performed by the units are implemented as one or more subroutines within emulator software. Further, a data processing system suitable for storing and/or executing program code is usable that includes at least one processor coupled directly or indirectly to memory elements through a system bus. The memory elements include, for instance, local memory employed during actual execution of the program code, bulk storage, and cache memory which provide temporary storage of at least some program code in order to reduce the number of times code must be retrieved from bulk storage during execution. Input/Output or I/O devices (including, but not limited to, keyboards, displays, pointing devices, DASD, tape, CDs, DVDs, thumb drives and other memory media, etc.) can be coupled to the system either directly or through intervening I/O controllers. Network adapters may also be coupled to the system to enable the data processing system to become coupled to other data processing systems or remote printers or storage devices through intervening private or public networks. Modems, cable modems, and Ethernet cards are just a few of the available types of network adapters. Embodiments of the present invention may be implemented in cloud computing systems.FIG.6may also comprise a node in this type of computing environment. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the descriptions below, if any, are intended to include any structure, material, or act for performing the function in combination with other elements as specifically noted. The description of the technique has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated. | 116,403 |
11862337 | The above described drawing figures illustrate aspects of the invention in at least one of its exemplary embodiments, which are further defined in detail in the following description. Features, elements, and aspects of the invention that are referenced by the same numerals in different figures represent the same, equivalent, or similar features, elements, or aspects, in accordance with one or more embodiments. DESCRIPTION Each of us experience an influx of emotions, sensations, and sounds throughout our daily life. If we had to consciously decide at all times what to ignore and what to pay attention to, we would quickly become overstimulated. However, most of us are able to screen and shut out of our awareness to this constant stream of previously tagged incoming stimuli using a behavioral phenomenon called latent inhibition. Latent inhibition refers to the reduced ability to learn the relevance of a stimulus if there has already been previous learning about that same stimulus in different or even neutral context. As such, a familiar or irrelevant stimulus takes longer to acquire meaning or salience compared to a new or relevant stimulus. This process enables us to reduce our attention or ignore such benign stimuli (attentional filtering) and selectively attend to the new or relevant stimuli. Thus, latent inhibition can be seen as a measure of the ability to ignore irrelevant stimuli. This tendency to disregard previously irrelevant stimuli is involuntary, meaning the brain automatically carries out the process, and is believed to prevent sensory overload. Latent inhibition is a normal modulation of associative learning. The basic idea of latent inhibition is that it is often easier to learn something new than to unlearn something familiar. In particular, once you have learned to recognize something or associate it with something else, it is difficult to unlearn it if its meaning changes. It is often easier to make associations to something new than to reassign associations that have already been made to something familiar. The prior learning produces an interference effect. An individual demonstrating the inability to discriminate between relevant and irrelevant stimuli has latent inhibition dysfunction. There are two poles of latent inhibition dysfunction: 1) attenuated latent inhibition defect which is a failure to ignore irrelevant stimuli; and 2) enhanced latent inhibition defect which is a failure to dis-ignore irrelevant stimuli when they become relevant. Also known as a disrupted or reduced latent inhibition defect, in an individual manifesting an attenuated latent inhibition defect there is an absence of slower learning to previously irrelevant stimulus (pre-exposed cue) compared to a novel stimulus (non-pre-exposed cue). An individual who shows an inability to ignore previously exposed irrelevant stimuli. An individual who maintains attention to all stimuli, regardless of its relevance because the individual is unable to focus and disregard irrelevant information. Also known as a potentiated or persistent latent inhibition defect, in an individual manifesting an enhanced latent inhibition defect there is an exaggeration in the reduction in learning to a previously irrelevant stimulus (pre-exposed cue), compared to a novel stimulus (non-pre-exposed cue). An individual fails to stop ignoring the irrelevant stimulus once it becomes relevant. An individual shows behavioral inflexibility or attentional perseveration. Facilitated learning of inattention to the previously irrelevant stimulus. Latent inhibition assays have been developed in order to determine whether latent inhibition of an individual is functioning within normal ranges. These assays generally fall into one of two study designs, namely between-participant design and within-participant design. In a between-participant design of a latent inhibition assay, participants are allocated either to a pre-exposed group or a non-pre-exposed group. Both groups participate in the pre-exposure phase in which the pre-exposed stimulus is rendered familiar (often in conjunction with a masking paradigm). In the test phase, participants in the pre-exposed group are assessed on their ability to learn an association between the pre-exposed stimulus and a target outcome (pre-exposure condition), while participants in the non-pre-exposed group are assessed on their ability to learn an association between the pre-exposed stimulus and a novel stimulus with the same target outcome (non-pre-exposure condition). Latent inhibition is demonstrated when participants from the pre-exposed group are slower to learn the cue-target association than the participants from the non-pre-exposed group. The procedure used in a latent inhibition assay using the between-participant design has several limitations, the most prominent being that both the pre-exposed and non-pre-exposed groups are composed of different participants which makes it difficult to match patients with identical states across groups and as such confounds are introduced when comparing an effect of latent inhibition in patients to the performance level seen in relative control group of participants. In a within-participant design of a latent inhibition assay, all participants participate in the pre-exposure phase in which the pre-exposed stimulus is rendered familiar/irrelevant (often in conjunction with a masking paradigm). A within-participant design further includes a test phase. In the test phase, participants are measured in their ability to learn an association between the pre-exposed stimulus and a target outcome (pre-exposure condition) and a novel stimulus with the same target outcome (non-pre-exposure condition). Within-participant designs have advantages over between-participant designs in that they allow for performance and learning about both the pre-exposed and non-pre-exposed stimuli to be compared within the same individual. In between-participant designs, different participants are assigned to either a pre-exposed or non-pre-exposed group and then compared for their performance; as such between-participant designs do not allow for a measure of latent inhibition per individual and make it difficult to match participants and patients with identical symptom states across the two groups. However, the procedures used in latent inhibition assays relying on current within-participant designs have several limitations, the most prominent being that an expectation of the stimulus-target is established prior to the test phase through instruction which generates a procedure that aligns itself with other learning phenomena other than latent inhibition. For example, by creating an expectation of target appearance during the pre-exposure phase, an effect of conditioned inhibition (instead of latent inhibition) is learned because the target outcome was expected to appear (and did not) at a time when the pre-exposed stimulus was presented. Conditioned inhibition occurs when there is a reduction in learning of the cue-target association during the test stage due to the cue predicting the absence of the target during pre-exposure. This negative prediction error results in the formation of an inhibitory association between the pre-exposed stimulus and the target outcome, slowing later learning for reasons other than latent inhibition. In addition, exposing the target outcome from the test phase in the pre-exposure phase, unpaired with the cue, establishes an alternative limitation, learned irrelevance. Learned irrelevance occurs when there is a reduction in learning due to the cue being an infrequent predictor of the target outcome during the pre-exposure phase. This negative prediction error results in the formation of a positive association between the pre-exposed stimulus and the absence of the target outcome, slowing later learning for reasons other than latent inhibition. The present specification discloses systems and methods of measuring latent inhibition that address the problems associated with current within-participant latent inhibition paradigms, including the confounds of conditioned inhibition and learned irrelevance. The disclosed systems and methods ensure this, in part, by setting up no expectation of the target stimulus either through instruction or explicit exposure to the target outcome prior to the pre-exposure phase. This is achieved, in part, by establishing all stimuli as relevant during the pre-exposure phase, and an expectation of the target stimulus is only introduced prior to the test stage. This removes the influence/observation of other learning effects, including the cognitive-behavioral effects of conditioned inhibition and learned irrelevance. By overcoming the design and interpretational problems of current latent inhibition testing, the disclosed systems and methods enhance the development of cognitive explanations about schizophrenia and the utility of latent inhibition assessment as a diagnostic and screening tool. Computer networks in general are well known in the art, often having one or more client computers and one or more servers, on which any of the methods and systems of various disclosed embodiments may be implemented. In particular the computer system, or server in this example, may represent any of the computer systems and physical components necessary to perform the computerized methods discussed in connection with the present figures and, in particular, may represent a server (cloud, array, etc.), client, or other computer system upon which e-commerce servers, websites, databases, web browsers and/or web analytic applications may be instantiated. As shown inFIG.1, the present computer system20includes in at least one example embodiment, an optional illustrated exemplary server22with associated database24and client computing device26(which may also be referred to as a patient computer or patient computing device), and a patient response device28(which may be separate or integral with the patient computing device26). Although the system20is described as separate components, the present system may be integrated into a single device, where the patient computer26could be a laptop, tablet computer, smartphone, or a dedicated device, with the database24being stored in locally within the patient computer26and/or being communicated to one or more other devices, such as a service provider's device (physician, clinician, etc.). Each computing device within the present system20is generally known to a person of ordinary skill in the art, and each may include a processor, a bus for communicating information, a main memory coupled to the bus for storing information and instructions to be executed by the processor and for storing temporary variables or other intermediate information during the execution of instructions by processor, a static storage device or other non-transitory computer readable medium for storing static information and instructions for the processor, and a storage device, such as a hard disk, may also be provided and coupled to the bus for storing information and instructions. The server22and client computer26may optionally be coupled to a display for displaying information. However, in the case of server22, such a display may not be present and all administration of the server may be via remote clients. Further, the server22and client computer26may optionally include connection to an input device for communicating information and command selections to the processor, such as a keyboard, mouse, touchpad, microphone, and the like. Moreover, the client computer26may optionally include connection to an output device for communicating information and command selections to the patient P or the therapist such as a speaker, etc. At the outset, it should be noted that communication between each of the server22and client computer26may be achieved using any wired- or wireless-based communication protocol (or combination of protocols) now known or later developed. As such, the present invention should not be read as being limited to any one particular type of communication protocol, even though certain exemplary protocols may be mentioned herein for illustrative purposes. It should also be noted that the terms “patient device” (and equivalent names for computing devices that describe the user) are intended to include any type of computing or electronic device now known or later developed, such as desktop computers, mobile phones, smartphones, laptop computers, tablet computers, virtual reality systems, personal data assistants, gaming devices, unattended terminals, access control devices, point of interaction (“POI”) systems, etc. The server22and client computer26may also include a communication interface coupled to the bus, for providing two-way, wired and/or wireless data communication to and from the server and/or client computers. For example, the communications interface may send and receive signals via a local area network, public network, intranet, private network (e.g., a VPN), or other network, including the Internet. In the present illustrated example, the hard drive of the server22(including an optional third-party server and/or mobile app backend service, and the like) and/or one or all of the client computer26is encoded with executable instructions, that when executed by a processor cause the processor to perform acts as described in the methods ofFIGS.2-5. The server22communicates through the Internet, intranet, or other network with the client computer26to cause information and/or graphics to be displayed on the screen, such as HTML code, text, images, and the like, sound to be emitted from the speakers, etc. The server22may host a URL site with information, which may be accessed by the client computer26. Information transmitted to the client computer26may be stored and manipulated according to the methods described below, using the software encoded on the client device26. Although the computing devices are illustrated schematically as laptops, the computing devices may include desktops, tablets, cellular devices (e.g., smart phones, such as iOS devices, ANDROID devices, WINDOWS devices, and the like), or any other computing device now known or later developed. Further, although the patient response device28is illustrated as a hand-held response device, the patient P can enter a response into the system20in a number of ways, including interacting with a touchscreen (e.g., touching a user interface element, such as a button, etc.), a verbal input (e.g., speaking into the microphone, with the response analyzed by known speech recognition systems, etc.), a keyboard input (such as, typing a response word or series of characters, or contacting a particular key to register a response, etc.), or other input means now known or later developed. Still looking atFIG.1, the computing devices may be one of many available computing devices capable of running executable programs and/or a browser instance. For example, they may be a mobile device, such as a tablet computer or a mobile phone device with computer capabilities, a laptop, a desktop, or other computing device. Executable instructions for the present method may be installed on the server22that hosts a web or other application caused to display a user interface on the client device26. Alternatively, executable instructions for all or at least part of the present method may be installed locally on the client device26, with the various datasets generated being stored locally. In an example embodiment, the client device26access and interact with the graphical user interface through a web browser instance, such as FIREFOX, CHROME, SAFARI, INTERNET EXPLORER, and the like, or through a desktop application. The web application is hosted on an application server with application hosting capabilities. In another example embodiment, the client device26can access and interact with the graphical user interface through either a web application running on a mobile web browser or a mobile application (commonly called an “app”). Alternatively, executable instructions for carrying out all or at least part of the present method may be installed locally on the client device26. For example, the client device26may be required to locally install an application on a smartphone device for carrying out all or part of the present method. In an example embodiment, an executable application file is installed on the client device26so that messages can be sent to and received from the server22(or between the devices, if any addition devices are connected to the system20), with the server sending, receiving, and/or relaying the messages to the client device26. The messages may be comprised of various forms of data, such as alpha-numeric text, pictures, animations, links, and so on. In yet another example embodiment, one party may have an application installed on the computing device, while the other party sends and receives messages through a browser instance. The present specification discloses three systems and computer implemented assessment methods: 1) a system and method of assigning an individual to a group participating in a clinical study regarding a psychotic disorder; 2) a system and method of determine whether and what type of psychotic disorder an individual may be suffering from; and 3) a system and method of recommending a therapy to treat an individual with a psychotic disorder. All three disclosed systems and computer implemented assessment methods use a non-invasive computational device-based test. In addition, as discussed in detail below, while some aspects of the non-invasive computational device-based test are common to all three disclosed systems and methods, other aspects are present in only two of the three while some aspects are present in one of the disclosed systems and methods. FIG.2illustrates an example embodiment of the present computer implemented assessment method200, broadly showing the optional steps in carrying out the method200. The present method200may be carried out utilizing discrete modules or separate applications or launching a single application capable of performing all steps of the present method200. Broadly described, the present latent inhibition test method200includes the step of initializing a pre-exposure portion of the application300, initializing the test portion of the application400, initializing the latent inhibition scoring portion of the application500. Once a latent inhibition score and/or outcome assessment has been calculated, one or more of the methods of determining a clinical study group assignment208, determining a patient psychotic disorder210, and determining an appropriate patient therapy212can be implemented selectively or automatically. A psychotic disorder determination method and a therapy recommendation method disclosed herein comprise a step of entering information about an individual into a latent inhibition test program running on a computational device. A group assignment method disclosed herein may optionally comprise a step of entering information about an individual into a latent inhibition test program running on a computational device. Typically this information includes an individual's medical history and current condition. Information disclosed herein includes, without limitation, whether this is an initial assessment or a subsequent assessment of an individual, whether or not the individual is currently experiencing psychotic symptoms, whether or not the individual has a history of a psychotic disorder, and whether or not the individual has a history of resistance to anti-psychotic drug treatment. A group assignment method, a psychotic disorder determination method, and a therapy recommendation method disclosed herein comprises, in part, a step of having an individual perform a latent inhibition test program running on a computational device. In one embodiment, a latent inhibition test program includes procedures comprising a pre-exposure phase and a test phase. Turning to the flow chart ofFIG.3, an example embodiment of the pre-exposure phase or portion of the application300is illustrated in greater detail. After initializing the application, the pre-exposure (P.E.) instructions are displayed302on the patient computing device26, for example, by displaying the instructions to the patient P on a monitor or screen of the patient computing device26. Any data received/transmitted by the patient computing device26in the present computer method can be communicated from/to a local database (e.g., stored on the patient computing device26hard drive) or communicated from/to a remote server on a local intranet or through the Internet, or other known transmission means. The P.E. instructions establish a set of rules which should be followed by the patient P during the pre-exposure portion of the present method200for the successful completion of the pre-exposure phase300. In one or more embodiments, certain parameters of the P.E. instructions can be set by the professional administering the assessment, such as the time period that a stimulus is displayed, the time interval between the display stimulus, the particular pre-exposure dataset being used (if multiple datasets are available, etc.). Although the present method200describes “displaying” instructions, stimuli, or other data to the patient P through the patient computing device26as a form of communication, the form of communication can vary, including an audio communication (e.g., through a speaker on a computer, etc.); and thus, is not limited to displaying on the computer screen or other display means. For example, a pre-exposure phase disclosed herein includes presenting an individual with a first set of directions for how to respond to each stimulus of a first group of stimuli that will be presented to the individual while performing a latent inhibition test program disclosed herein. In an aspect of this embodiment, a first set of directions disclosed herein includes pre-exposure phase instructions which inform the individual on how to respond to each stimulus of the first group of stimuli that will be presented to the individual during a pre-exposure phase disclosed herein. The pre-exposure dataset is retrieved from the database by the application. The application determines in step304the type of responses required as an input from the patient computing device26. In one embodiment, pre-exposure phase instructions include n-back instructions. When a n-back response is required 308, then the application requires an input from the patient computing device26for a P.E. stimulus displayed that matches a prior P.E. stimulus (a prior matching P.E. stimulus) displayed n-positions prior (where “n” can be any predetermined number, depending on the dataset and the design of the assessment, such as 0, 1, 2, 3, 4, . . . ). The application requires an input from the patient computing device26within a predetermined time interval after the start of display of each stimulus in the P.E. stimuli dataset retrieved from the database306. The “n” value is generally related to the particular P.E. dataset utilized, but may be set by the profession in one or more example embodiments. In an aspect of this embodiment, pre-exposure phase instructions require the individual to respond to a stimulus of a first group of stimuli as it appears on the screen (0-back). In another aspect of this embodiment, pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown one position back in a sequence of the first group of stimuli (1-back). In yet another aspect of this embodiment, pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown two positions back in a sequence of the first group of stimuli (2-back). In another aspect of this embodiment, an individual is asked to respond to each stimulus in a specific manner, including, without limitation, verbally acknowledge the that a stimulus was presented or by physically inputting the response into a computational device, such as by pressing a button on a keypad or clicking a control device like a mouse. A pre-exposure phase disclosed herein includes presenting an individual with a first group of stimuli. The application causes each of the P.E. stimuli in the P.E. stimulus dataset to be displayed sequentially in a predetermined order (or, optionally, a random order in one or more example embodiments)310. The xnstimulus is displayed for a time period ΔtPEnwith an interval time period of Δtinwhere Δtincan be greater than or equal to 0 seconds. Although, ΔtPEnand Δtinare generally constant throughout the P.E. phase, the times can be varied in one or more example embodiments. The P.E. stimulus dataset comprises one or more pre-exposed stimulus, one or more neutral stimuli, and optionally, other stimuli. If a patient response input is detected312, it is determined if the response is detected during the time period permitted for response, which can be ΔtPEn, ΔtPEn+Δtin, or other predetermined time period for which a patient response input in appropriate. In the illustrated example embodiment method, for each time period, the application determines whether a patient (“user”) response input is detected (e.g., from a response clicker, a keyboard input, a voice response input, etc.). If no patient response input is detected, the application compares the nonresponse to the dataset of correct responses for that particular iteration “n” to determine if the nonresponse is correct, step314, thereafter, recording the nonresponse as correct or incorrect in the P.E. results dataset, in step316. Likewise, if a patient response input is detected, the application compares the response to the dataset of correct responses for that particular iteration “n” to determine if the response is correct318(e.g., the response was received during a time period associated with a prior matching P.E. stimulus displayed n stimuli prior), thereafter, recording the response as correct or incorrect in the P.E. results dataset, in step320. Of course, this comparison need not be immediately be made; the application can collect a dataset of responses and time for each response for comparison at any point in time, including a later analysis conducted at a time in the future. The application will continue to display P.E. stimuli in iterations322until all P.E. stimuli in the P.E. stimuli dataset have been displayed, step324. Alternately, the number of P.E. stimuli in the P.E. stimuli dataset can be accessed by the application (e.g., the known number can be entered, or associated with the dataset, etc.), where the application displays successive P.E. stimuli up to that number known number. After all the P.E. stimuli have been displayed and the time period for any patient response has ended, using one or more of the disclosed algorithms on the P.E. results dataset, the application calculates a P.E. result, step326. As the P.E. result can be used in conjunction with test phase and/or to determine whether to proceed with the test stage, it is determined if the P.E. results calculated are within parameters that are predetermined,328, or set by the professional administering or analyzing the present assessment. The application can proceed automatically to the test phase of the assessment332, or the application can terminate the assessment at the end of the P.E. phase330or at any time, or the application can stop and await manual instruction input from the administrator/professional. In an aspect of this embodiment, stimuli belonging to a first group of stimuli disclosed herein are presented to an individual in a random order. In this step, an individual, without his knowledge, is familarize to a preexposure stimulus without any association to a target stimulus because the first group of stimuli does not contain a target stimulus. If a 1-back or a 2-back design, but not a 0-back design, is employed, a pre-exposure phase procedure is also used to assess working memory. The purpose of presenting this first group of stimuli is to mitigate the effects of conditional learning and learned irrelevance. Conditional learning is mitigated because a target stimulus is not presented in the preexposure phase. This avoids the expectation of a target stimulus being presented during the preexposure phase when in fact it will not be, thereby mitigating conditional learning. Learned irrelevance is also mitigated because a target stimulus is not presented during the preexposure phase. This avoids any association of the target stimulus with the preexposure stimulus. Each stimulus from the first group of stimuli being presented to the individual is done so for a defined period of time. Generally, a defined period of time for presenting a stimulus from the first group of stimuli to an individual needs to be of a long enough duration that the individual can perceive that the stimulus is being presented to the individual. In an aspect of this embodiment, a defined period of time for presenting a stimulus from the first group of stimuli can be between, e.g., about 10 msec to about 10,000 msec, about 100 msec to about 5,000 msec, about 250 msec to about 2,500 msec, about 500 msec to about 1,500 msec, about 750 msec to about 1,250 msec, or about 1,000 msec In other aspects of this embodiment, a defined period of time for presenting a stimulus from the first group of stimuli can be, e.g., about 10 msec, about 50 msec, about 100 msec, about 150 msec, about 200 msec, about 250 msec, about 300 msec, about 350 msec, about 400 msec, about 450 msec, about 500 msec, about 550 msec, about 600 msec, about 650 msec, about 700 msec, about 750 msec, about 800 msec, about 850 msec, about 900 msec, about 950 msec, about 1,000 msec, about 1,100 msec, about 1,200 msec, about 1,300 msec, about 1,400 msec, about 1,500 msec, about 1,600 msec, about 1,700 msec, about 1,800 msec, about 1,900 msec, about 2,000 msec, about 2,500 msec, or about 3,000 msec. In yet other aspects of this embodiment, a defined period of time for presenting a stimulus from the first group of stimuli can be, e.g., at least 10 msec, at least 50 msec, at least 100 msec, at least 150 msec, at least 200 msec, at least 250 msec, at least 300 msec, at least 350 msec, at least 400 msec, at least 450 msec, at least 500 msec, at least 550 msec, at least 600 msec, at least 650 msec, at least 700 msec, at least 750 msec, at least 800 msec, at least 850 msec, at least 900 msec, at least 950 msec, at least 1,000 msec, at least 1,100 msec, at least 1,200 msec, at least 1,300 msec, at least 1,400 msec, at least 1,500 msec, at least 1,600 msec, at least 1,700 msec, at least 1,800 msec, at least 1,900 msec, at least 2,000 msec, at least 2,500 msec, or at least 3,000 msec. In still other aspects of this embodiment, a defined period of time for presenting a stimulus from the first group of stimuli can be, e.g., at most 10 msec, at most 50 msec, at most 100 msec, at most 150 msec, at most 200 msec, at most 250 msec, at most 300 msec, at most 350 msec, at most 400 msec, at most 450 msec, at most 500 msec, at most 550 msec, at most 600 msec, at most 650 msec, at most 700 msec, at most 750 msec, at most 800 msec, at most 850 msec, at most 900 msec, at most 950 msec, at most 1,000 msec, at most 1,100 msec, at most 1,200 msec, at most 1,300 msec, at most 1,400 msec, at most 1,500 msec, at most 1,600 msec, at most 1,700 msec, at most 1,800 msec, at most 1,900 msec, at most 2,000 msec, at most 2,500 msec, or at most 3,000 msec. In further other aspects of this embodiment, a defined period of time for presenting a stimulus from the first group of stimuli can be from, e.g., about 10 msec to about 100 msec, about 10 msec to about 200 msec, about 10 msec to about 300 msec, about 10 msec to about 400 msec, about 10 msec to about 500 msec, about 10 msec to about 600 msec, about 10 msec to about 700 msec, about 10 msec to about 800 msec, about 10 msec to about 900 msec, about 10 msec to about 1,000 msec, about 10 msec to about 1,100 msec, about 10 msec to about 1,200 msec, about 10 msec to about 1,300 msec, about 10 msec to about 1,400 msec, about 10 msec to about 1,500 msec, about 10 msec to about 1,600 msec, about 10 msec to about 1,700 msec, about 10 msec to about 1,800 msec, about 10 msec to about 1,900 msec, about 10 msec to about 2,000 msec, about 10 msec to about 3,000 msec, about 100 msec to about 200 msec, about 100 msec to about 300 msec, about 100 msec to about 400 msec, about 100 msec to about 500 msec, about 100 msec to about 600 msec, about 100 msec to about 700 msec, about 100 msec to about 800 msec, about 100 msec to about 900 msec, about 100 msec to about 1,000 msec, about 100 msec to about 1,100 msec, about 100 msec to about 1,200 msec, about 100 msec to about 1,300 msec, about 100 msec to about 1,400 msec, about 100 msec to about 1,500 msec, about 100 msec to about 1,600 msec, about 100 msec to about 1,700 msec, about 100 msec to about 1,800 msec, about 100 msec to about 1,900 msec, about 100 msec to about 2,000 msec, about 100 msec to about 3,000 msec, about 250 msec to about 300 msec, about 250 msec to about 400 msec, about 250 msec to about 500 msec, about 250 msec to about 600 msec, about 250 msec to about 700 msec, about 250 msec to about 800 msec, about 250 msec to about 900 msec, about 250 msec to about 1,000 msec, about 250 msec to about 1,100 msec, about 250 msec to about 1,200 msec, about 250 msec to about 1,300 msec, about 250 msec to about 1,400 msec, about 250 msec to about 1,500 msec, about 250 msec to about 1,600 msec, about 250 msec to about 1,700 msec, about 250 msec to about 1,800 msec, about 250 msec to about 1,900 msec, about 250 msec to about 2,000 msec, about 250 msec to about 3,000 msec, about 500 msec to about 600 msec, about 500 msec to about 700 msec, about 500 msec to about 800 msec, about 500 msec to about 900 msec, about 500 msec to about 1,000 msec, about 500 msec to about 1,100 msec, about 500 msec to about 1,200 msec, about 500 msec to about 1,300 msec, about 500 msec to about 1,400 msec, about 500 msec to about 1,500 msec, about 500 msec to about 1,600 msec, about 500 msec to about 1,700 msec, about 500 msec to about 1,800 msec, about 500 msec to about 1,900 msec, about 500 msec to about 2,000 msec, about 500 msec to about 3,000 msec, about 750 msec to about 800 msec, about 750 msec to about 900 msec, about 750 msec to about 1,000 msec, about 750 msec to about 1,100 msec, about 750 msec to about 1,200 msec, about 750 msec to about 1,300 msec, about 750 msec to about 1,400 msec, about 750 msec to about 1,500 msec, about 750 msec to about 1,600 msec, about 750 msec to about 1,700 msec, about 750 msec to about 1,800 msec, about 750 msec to about 1,900 msec, about 750 msec to about 2,000 msec, about 750 msec to about 3,000 msec, about 1,000 msec to about 1,100 msec, about 1,000 msec to about 1,200 msec, about 1,000 msec to about 1,300 msec, about 1,000 msec to about 1,400 msec, about 1,000 msec to about 1,500 msec, about 1,000 msec to about 1,600 msec, about 1,000 msec to about 1,700 msec, about 1,000 msec to about 1,800 msec, about 1,000 msec to about 1,900 msec, about 1,000 msec to about 2,000 msec, about 1,000 msec to about 3,000 msec, about 1,250 msec to about 1,300 msec, about 1,250 msec to about 1,400 msec, about 1,250 msec to about 1,500 msec, about 1,250 msec to about 1,600 msec, about 1,250 msec to about 1,700 msec, about 1,250 msec to about 1,800 msec, about 1,250 msec to about 1,900 msec, about 1,250 msec to about 2,000 msec, about 1,250 msec to about 3,000 msec, about 1,500 msec to about 1,600 msec, about 1,500 msec to about 1,700 msec, about 1,500 msec to about 1,800 msec, about 1,500 msec to about 1,900 msec, about 1,500 msec to about 2,000 msec, about 1,500 msec to about 3,000 msec, about 2,000 msec to about 3,000 msec, or about 2,500 msec to about 3,000 msec. Presentation of a stimulus from the first group of stimuli may optionally include an interval of time where no stimulus is presented to an individual performing the pre-exposure phase. These intervals are simply gaps between the presentation of each stimulus. An interval of time between the presentation of each stimulus from the first group of stimuli is done for a defined period of time. In one embodiment, presentation of each stimuli from the first group of stimuli does not include an interval period of time. In another embodiment, an interval period of time is present between the presentation of each stimulus. In an aspect of this embodiment, an interval period of time between the presentation of a stimulus from the first group of stimuli can be between, e.g., about 1 msec to about 10,000 msec, about 5 msec to about 1,000 msec, about 10 msec to about 500 msec, about 15 msec to about 250 msec, about 20 msec to about 100 msec, about 25 msec to about 75 msec, or about 50 msec. In other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the first group of stimuli can be, e.g., about 10 msec, about 50 msec, about 100 msec, about 150 msec, about 200 msec, about 250 msec, about 300 msec, about 350 msec, about 400 msec, about 450 msec, about 500 msec, about 550 msec, about 600 msec, about 650 msec, about 700 msec, about 750 msec, about 800 msec, about 850 msec, about 900 msec, about 950 msec, about 1,000 msec, about 1,100 msec, about 1,200 msec, about 1,300 msec, about 1,400 msec, about 1,500 msec, about 1,600 msec, about 1,700 msec, about 1,800 msec, about 1,900 msec, about 2,000 msec, about 2,500 msec, or about 3,000 msec. In yet other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the first group of stimuli can be, e.g., at least 10 msec, at least 50 msec, at least 100 msec, at least 150 msec, at least 200 msec, at least 250 msec, at least 300 msec, at least 350 msec, at least 400 msec, at least 450 msec, at least 500 msec, at least 550 msec, at least 600 msec, at least 650 msec, at least 700 msec, at least 750 msec, at least 800 msec, at least 850 msec, at least 900 msec, at least 950 msec, at least 1,000 msec, at least 1,100 msec, at least 1,200 msec, at least 1,300 msec, at least 1,400 msec, at least 1,500 msec, at least 1,600 msec, at least 1,700 msec, at least 1,800 msec, at least 1,900 msec, at least 2,000 msec, at least 2,500 msec, or at least 3,000 msec. In still other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the first group of stimuli can be, e.g., at most 10 msec, at most 50 msec, at most 100 msec, at most 150 msec, at most 200 msec, at most 250 msec, at most 300 msec, at most 350 msec, at most 400 msec, at most 450 msec, at most 500 msec, at most 550 msec, at most 600 msec, at most 650 msec, at most 700 msec, at most 750 msec, at most 800 msec, at most 850 msec, at most 900 msec, at most 950 msec, at most 1,000 msec, at most 1,100 msec, at most 1,200 msec, at most 1,300 msec, at most 1,400 msec, at most 1,500 msec, at most 1,600 msec, at most 1,700 msec, at most 1,800 msec, at most 1,900 msec, at most 2,000 msec, at most 2,500 msec, or at most 3,000 msec. In further other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the first group of stimuli can be, e.g., about 10 msec to about 100 msec, about 10 msec to about 200 msec, about 10 msec to about 300 msec, about 10 msec to about 400 msec, about 10 msec to about 500 msec, about 10 msec to about 600 msec, about 10 msec to about 700 msec, about 10 msec to about 800 msec, about 10 msec to about 900 msec, about 10 msec to about 1,000 msec, about 10 msec to about 1,100 msec, about 10 msec to about 1,200 msec, about 10 msec to about 1,300 msec, about 10 msec to about 1,400 msec, about 10 msec to about 1,500 msec, about 10 msec to about 1,600 msec, about 10 msec to about 1,700 msec, about 10 msec to about 1,800 msec, about 10 msec to about 1,900 msec, about 10 msec to about 2,000 msec, about 10 msec to about 3,000 msec, about 100 msec to about 200 msec, about 100 msec to about 300 msec, about 100 msec to about 400 msec, about 100 msec to about 500 msec, about 100 msec to about 600 msec, about 100 msec to about 700 msec, about 100 msec to about 800 msec, about 100 msec to about 900 msec, about 100 msec to about 1,000 msec, about 100 msec to about 1,100 msec, about 100 msec to about 1,200 msec, about 100 msec to about 1,300 msec, about 100 msec to about 1,400 msec, about 100 msec to about 1,500 msec, about 100 msec to about 1,600 msec, about 100 msec to about 1,700 msec, about 100 msec to about 1,800 msec, about 100 msec to about 1,900 msec, about 100 msec to about 2,000 msec, about 100 msec to about 3,000 msec, about 250 msec to about 300 msec, about 250 msec to about 400 msec, about 250 msec to about 500 msec, about 250 msec to about 600 msec, about 250 msec to about 700 msec, about 250 msec to about 800 msec, about 250 msec to about 900 msec, about 250 msec to about 1,000 msec, about 250 msec to about 1,100 msec, about 250 msec to about 1,200 msec, about 250 msec to about 1,300 msec, about 250 msec to about 1,400 msec, about 250 msec to about 1,500 msec, about 250 msec to about 1,600 msec, about 250 msec to about 1,700 msec, about 250 msec to about 1,800 msec, about 250 msec to about 1,900 msec, about 250 msec to about 2,000 msec, about 250 msec to about 3,000 msec, about 500 msec to about 600 msec, about 500 msec to about 700 msec, about 500 msec to about 800 msec, about 500 msec to about 900 msec, about 500 msec to about 1,000 msec, about 500 msec to about 1,100 msec, about 500 msec to about 1,200 msec, about 500 msec to about 1,300 msec, about 500 msec to about 1,400 msec, about 500 msec to about 1,500 msec, about 500 msec to about 1,600 msec, about 500 msec to about 1,700 msec, about 500 msec to about 1,800 msec, about 500 msec to about 1,900 msec, about 500 msec to about 2,000 msec, about 500 msec to about 3,000 msec, about 750 msec to about 800 msec, about 750 msec to about 900 msec, about 750 msec to about 1,000 msec, about 750 msec to about 1,100 msec, about 750 msec to about 1,200 msec, about 750 msec to about 1,300 msec, about 750 msec to about 1,400 msec, about 750 msec to about 1,500 msec, about 750 msec to about 1,600 msec, about 750 msec to about 1,700 msec, about 750 msec to about 1,800 msec, about 750 msec to about 1,900 msec, about 750 msec to about 2,000 msec, about 750 msec to about 3,000 msec, about 1,000 msec to about 1,100 msec, about 1,000 msec to about 1,200 msec, about 1,000 msec to about 1,300 msec, about 1,000 msec to about 1,400 msec, about 1,000 msec to about 1,500 msec, about 1,000 msec to about 1,600 msec, about 1,000 msec to about 1,700 msec, about 1,000 msec to about 1,800 msec, about 1,000 msec to about 1,900 msec, about 1,000 msec to about 2,000 msec, about 1,000 msec to about 3,000 msec, about 1,250 msec to about 1,300 msec, about 1,250 msec to about 1,400 msec, about 1,250 msec to about 1,500 msec, about 1,250 msec to about 1,600 msec, about 1,250 msec to about 1,700 msec, about 1,250 msec to about 1,800 msec, about 1,250 msec to about 1,900 msec, about 1,250 msec to about 2,000 msec, about 1,250 msec to about 3,000 msec, about 1,500 msec to about 1,600 msec, about 1,500 msec to about 1,700 msec, about 1,500 msec to about 1,800 msec, about 1,500 msec to about 1,900 msec, about 1,500 msec to about 2,000 msec, about 1,500 msec to about 3,000 msec, about 2,000 msec to about 3,000 msec, or about 2,500 msec to about 3,000 msec. A first group of stimuli comprises a plurality of stimuli. In an aspect of this embodiment, a first group of stimuli disclosed herein comprises at least one preexposed stimulus, one or more neutral stimuli, or both at least one preexposed stimulus and one or more neutral stimuli. A preexposed stimulus is a stimulus presented during the pre-exposure phase and is intended to represent a familiar stimulus during the test phase. It is predictive of the occurrence of the target stimulus during the test phase. A neutral stimulus is a non-cued stimulus having infrequent association with a preexposed, a non-preexposed, or a target stimulus and as such cannot be accurately used by an individual to anticipate which stimulus will occur next. A preexposure phase disclosed herein can optionally include measuring a response of an individual to each stimulus from the first group of stimuli. Measurement of these responses is an assessment of compliance with the first set of directions and helps assess the quality of an individual's participation. In an aspect of this embodiment, an individual is allowed to proceed to the test phase of a latent inhibition test program disclosed herein if the individual responses to, e.g., at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, or at least 95% of a first group of stimuli according to the first set of directions. Turning to the flow chart ofFIG.4, an example embodiment of the test phase or portion of the application400is illustrated in greater detail. The test instructions are displayed402on the patient computing device26, step402, which requires the patient P to enter a response input in relation to a target stimulus. The test dataset is retrieved from the database by the application, where the test dataset includes at least one target stimulus, a plurality of non-target stimuli comprising at least one cue stimuli, where non-target stimuli can further comprise at least one at least one pre-exposed stimuli, a non-pre-exposed stimulus, and one or more neutral stimuli. A test phase disclosed herein includes presenting an individual with a second set of directions for how to respond to each stimulus of a second group of stimuli that will be presented to the individual while performing a latent inhibition test program disclosed herein. In an aspect of this embodiment, a second set of directions disclosed herein includes test phase instructions which inform the individual on how to respond to each stimulus of the second group of stimuli that will be presented to the individual during a test phase disclosed herein. In an aspect of this embodiment, a second set of directions include test phase instructions that inform the individual to anticipate the occurrence of a target stimulus disclosed herein and to respond accordingly in some manner. For example, an individual how anticipates that a target stimulus will be presented next can indicate so by verbally stating that the target stimulus will occur next, or by physically responding by inputting such anticipation into a computational device, such as by pressing a button on a keypad or clicking a control device like a mouse. A test phase disclosed herein includes presenting the individual with a second group of stimuli. The purpose of presenting this second group of stimuli is to measure latent inhibition of an individual by measuring the learning rate of the association of the target stimulus to the preexposure and non-preexposure stimuli. In an aspect of this embodiment, stimuli belonging to a second group of stimuli disclosed herein are presented to an individual in a peudo-random order. In another aspect of this embodiment, stimuli belonging to a second group of stimuli disclosed herein are presented to an individual in a predetermined order. In an aspect of this embodiment, a predetermined order of presenting stimuli belonging to a second group of stimuli disclosed herein to an individual involves presenting an equal number of presentations for a target stimulus occurring immediately after presentation of the preexposed stimulus and immediately after presentation of the non-preexposed stimulus. In other aspects of this embodiment, the presentation of a preexposed stimulus/target stimulus combination and a non-preexposed stimulus/target stimulus combination occurs two times more often, three times more often, four times more often, five times more often, six times more often, seven times more often or eight times more often relative to the presentation of the target stimulus occurring immediately after presentation of a particular neutral stimulus. The application causes each of the test stimuli in the test stimulus dataset to be displayed sequentially in a predetermined order406. Each xntest stimuli is displayed for a time period ΔtTnwith an interval time period of Δtinwhere Δtincan be greater than or equal to 0 seconds. Although, ΔtTnand Δtinare generally constant throughout the test phase, the times can be varied in one or more example embodiments. In the present example embodiment, initially, a non-target test stimulus is caused to display on the patient computer26, step408. However, the test phase may be varied in one or more example embodiments to display a target stimulus initially, although this is not generally preferred, as the test phase is designed to determine the patient's ability to predict the display of the target stimulus. In step410, the application causes the “xn” test stimulus (e.g., the next test stimulus in the sequence within the test stimulus dataset) to display on the patient computer26. If the xnstimulus is a target stimulus, then, in step414, the application calculates the time lapse ΔtLnfrom the introduction of the prior cue stimulus up to the introduction of the target stimulus, with no intervening prior target stimuli. Basically, once the cue stimulus is displayed, the time to timely respond ends as soon as the next target stimulus appears. In order for a patient P to have predicted the appearance of the target stimulus, a user response input must be detected during the time lapse ΔtLn, step420. If a patient response input is detected during the time lapse ΔtLn, step426, then the response time ΔtRnis calculated from the introduction of the cue stimulus to when the patient response input is detected. In step424, if no patient response input is detected during the time lapse ΔtLn, and is not detected until the target stimulus is displayed or is not detected even after the target stimulus display has ended, then an untimely response (step428) or a nonresponse (step430). Whether the response is determined to be timely, untimely, or a nonresponse, the user response input (or lack thereof) is recorded in the test results dataset, steps428,430,432. If the xnstimulus is not a target stimulus, step412, then it is determined by the application whether all test stimuli within the test stimulus dataset have been displayed in the sequence, step416, much like the iterations of the P.E. phase above. If not all test stimuli within the test stimulus dataset have been displayed, the next test stimulus in the sequence called up,418, for display in step410, starting the next iteration. If all test stimuli within the test stimulus dataset have been displayed, then the application can proceed automatically to the determination of the latent inhibition score phase of the application, step434. In aspects of this embodiment, a test phase comprises 20 occurrences of a preexposed stimulus/target stimulus combination are presented, 20 occurrences of a non-preexposed stimulus/target stimulus combination are presented, and five occurrences of a particular neutral stimulus/target stimulus combination are presented, where four different neutral stimuli are presented for a total number of 20. In other aspects of this embodiment, a test phase comprises 30 occurrences of a preexposed stimulus/target stimulus combination are presented, 30 occurrences of a non-preexposed stimulus/target stimulus combination are presented, and 10 occurrences of a particular neutral stimulus/target stimulus combination are presented, where three different neutral stimuli are presented for a total number of 30. In other aspects of this embodiment, a test phase comprises 30 occurrences of a preexposed stimulus/target stimulus combination are presented, 30 occurrences of a non-preexposed stimulus/target stimulus combination are presented, seven or eight occurrences of a particular neutral stimulus/target stimulus combination are presented, where four different neutral stimuli are presented for a total number of 30 (i.e., two dirrent neutral stimuli are presented seven times while the other two neutral stimuli are presented eight times immediately before the target stimulus. In still other aspects of this embodiment, a test phase comprises 40 occurrences of a preexposed stimulus/target stimulus combination are presented, 40 occurrences of a non-preexposed stimulus/target stimulus combination are presented, and 19 occurrences of a particular neutral stimulus/target stimulus combination are presented, where four different neutral stimuli are presented for a total number of 40. Each stimulus from the first group of stimuli being presented to the individual is done so for a defined period of time. Generally, a defined period of time for presenting a stimulus from the first group of stimuli to an individual need to be of a long enough duration that the individual can perceive that the stimulus is being presented to the individual. In an aspect of this embodiment, a defined period of time for presenting a stimulus from the second group of stimuli can be between, e.g., about 10 msec to about 10,000 msec, about 100 msec to about 5,000 msec, about 250 msec to about 2,500 msec, about 500 msec to about 1,500 msec, about 750 msec to about 1,250 msec, or about 1,000 msec In other aspects of this embodiment, a defined period of time for presenting a stimulus from the second group of stimuli can be, e.g., about 10 msec, about 50 msec, about 100 msec, about 150 msec, about 200 msec, about 250 msec, about 300 msec, about 350 msec, about 400 msec, about 450 msec, about 500 msec, about 550 msec, about 600 msec, about 650 msec, about 700 msec, about 750 msec, about 800 msec, about 850 msec, about 900 msec, about 950 msec, about 1,000 msec, about 1,100 msec, about 1,200 msec, about 1,300 msec, about 1,400 msec, about 1,500 msec, about 1,600 msec, about 1,700 msec, about 1,800 msec, about 1,900 msec, about 2,000 msec, about 2,500 msec, or about 3,000 msec. In yet other aspects of this embodiment, a defined period of time for presenting a stimulus from the second group of stimuli can be, e.g., at least 10 msec, at least 50 msec, at least 100 msec, at least 150 msec, at least 200 msec, at least 250 msec, at least 300 msec, at least 350 msec, at least 400 msec, at least 450 msec, at least 500 msec, at least 550 msec, at least 600 msec, at least 650 msec, at least 700 msec, at least 750 msec, at least 800 msec, at least 850 msec, at least 900 msec, at least 950 msec, at least 1,000 msec, at least 1,100 msec, at least 1,200 msec, at least 1,300 msec, at least 1,400 msec, at least 1,500 msec, at least 1,600 msec, at least 1,700 msec, at least 1,800 msec, at least 1,900 msec, at least 2,000 msec, at least 2,500 msec, or at least 3,000 msec. In still other aspects of this embodiment, a defined period of time for presenting a stimulus from the second group of stimuli can be, e.g., at most 10 msec, at most 50 msec, at most 100 msec, at most 150 msec, at most 200 msec, at most 250 msec, at most 300 msec, at most 350 msec, at most 400 msec, at most 450 msec, at most 500 msec, at most 550 msec, at most 600 msec, at most 650 msec, at most 700 msec, at most 750 msec, at most 800 msec, at most 850 msec, at most 900 msec, at most 950 msec, at most 1,000 msec, at most 1,100 msec, at most 1,200 msec, at most 1,300 msec, at most 1,400 msec, at most 1,500 msec, at most 1,600 msec, at most 1,700 msec, at most 1,800 msec, at most 1,900 msec, at most 2,000 msec, at most 2,500 msec, or at most 3,000 msec. In further other aspects of this embodiment, a defined period of time for presenting a stimulus from the second group of stimuli can be from, e.g., about 10 msec to about 100 msec, about 10 msec to about 200 msec, about 10 msec to about 300 msec, about 10 msec to about 400 msec, about 10 msec to about 500 msec, about 10 msec to about 600 msec, about 10 msec to about 700 msec, about 10 msec to about 800 msec, about 10 msec to about 900 msec, about 10 msec to about 1,000 msec, about 10 msec to about 1,100 msec, about 10 msec to about 1,200 msec, about 10 msec to about 1,300 msec, about 10 msec to about 1,400 msec, about 10 msec to about 1,500 msec, about 10 msec to about 1,600 msec, about 10 msec to about 1,700 msec, about 10 msec to about 1,800 msec, about 10 msec to about 1,900 msec, about 10 msec to about 2,000 msec, about 10 msec to about 3,000 msec, about 100 msec to about 200 msec, about 100 msec to about 300 msec, about 100 msec to about 400 msec, about 100 msec to about 500 msec, about 100 msec to about 600 msec, about 100 msec to about 700 msec, about 100 msec to about 800 msec, about 100 msec to about 900 msec, about 100 msec to about 1,000 msec, about 100 msec to about 1,100 msec, about 100 msec to about 1,200 msec, about 100 msec to about 1,300 msec, about 100 msec to about 1,400 msec, about 100 msec to about 1,500 msec, about 100 msec to about 1,600 msec, about 100 msec to about 1,700 msec, about 100 msec to about 1,800 msec, about 100 msec to about 1,900 msec, about 100 msec to about 2,000 msec, about 100 msec to about 3,000 msec, about 250 msec to about 300 msec, about 250 msec to about 400 msec, about 250 msec to about 500 msec, about 250 msec to about 600 msec, about 250 msec to about 700 msec, about 250 msec to about 800 msec, about 250 msec to about 900 msec, about 250 msec to about 1,000 msec, about 250 msec to about 1,100 msec, about 250 msec to about 1,200 msec, about 250 msec to about 1,300 msec, about 250 msec to about 1,400 msec, about 250 msec to about 1,500 msec, about 250 msec to about 1,600 msec, about 250 msec to about 1,700 msec, about 250 msec to about 1,800 msec, about 250 msec to about 1,900 msec, about 250 msec to about 2,000 msec, about 250 msec to about 3,000 msec, about 500 msec to about 600 msec, about 500 msec to about 700 msec, about 500 msec to about 800 msec, about 500 msec to about 900 msec, about 500 msec to about 1,000 msec, about 500 msec to about 1,100 msec, about 500 msec to about 1,200 msec, about 500 msec to about 1,300 msec, about 500 msec to about 1,400 msec, about 500 msec to about 1,500 msec, about 500 msec to about 1,600 msec, about 500 msec to about 1,700 msec, about 500 msec to about 1,800 msec, about 500 msec to about 1,900 msec, about 500 msec to about 2,000 msec, about 500 msec to about 3,000 msec, about 750 msec to about 800 msec, about 750 msec to about 900 msec, about 750 msec to about 1,000 msec, about 750 msec to about 1,100 msec, about 750 msec to about 1,200 msec, about 750 msec to about 1,300 msec, about 750 msec to about 1,400 msec, about 750 msec to about 1,500 msec, about 750 msec to about 1,600 msec, about 750 msec to about 1,700 msec, about 750 msec to about 1,800 msec, about 750 msec to about 1,900 msec, about 750 msec to about 2,000 msec, about 750 msec to about 3,000 msec, about 1,000 msec to about 1,100 msec, about 1,000 msec to about 1,200 msec, about 1,000 msec to about 1,300 msec, about 1,000 msec to about 1,400 msec, about 1,000 msec to about 1,500 msec, about 1,000 msec to about 1,600 msec, about 1,000 msec to about 1,700 msec, about 1,000 msec to about 1,800 msec, about 1,000 msec to about 1,900 msec, about 1,000 msec to about 2,000 msec, about 1,000 msec to about 3,000 msec, about 1,250 msec to about 1,300 msec, about 1,250 msec to about 1,400 msec, about 1,250 msec to about 1,500 msec, about 1,250 msec to about 1,600 msec, about 1,250 msec to about 1,700 msec, about 1,250 msec to about 1,800 msec, about 1,250 msec to about 1,900 msec, about 1,250 msec to about 2,000 msec, about 1,250 msec to about 3,000 msec, about 1,500 msec to about 1,600 msec, about 1,500 msec to about 1,700 msec, about 1,500 msec to about 1,800 msec, about 1,500 msec to about 1,900 msec, about 1,500 msec to about 2,000 msec, about 1,500 msec to about 3,000 msec, about 2,000 msec to about 3,000 msec, or about 2,500 msec to about 3,000 msec. Presentation of a stimulus from the second group of stimuli include an interval of time where no stimulus is presented to an individual performing the test phase. Like the pre-exposure phase, these intervals are simply gaps between the presentation of each stimulus. An interval of time between the presentation of each stimulus from the first group of stimuli is done for a defined period of time. Thus, unlike the pre-exposure phase where these intervals are optional, in the test phase, the intervals of time between stimuli is mandatory. In an aspect of this embodiment, an interval period of time between the presentation of a stimulus from the second group of stimuli can be between, e.g., about 1 msec to about 10,000 msec, about 5 msec to about 1,000 msec, about 10 msec to about 500 msec, about 15 msec to about 250 msec, about 20 msec to about 100 msec, about 25 msec to about 75 msec, or about 50 msec. In an aspect of this embodiment, an interval period of time between the presentation of a stimulus from the second group of stimuli can be between, e.g., about 10 msec to about 10,000 msec, about 50 msec to about 1,000 msec, about 100 msec to about 500 msec, about 150 msec to about 250 msec, about 100 msec to about 200 msec, about 125 msec to about 175 msec, or about 150 msec. In other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the second group of stimuli can be, e.g., about 10 msec, about 50 msec, about 100 msec, about 150 msec, about 200 msec, about 250 msec, about 300 msec, about 350 msec, about 400 msec, about 450 msec, about 500 msec, about 550 msec, about 600 msec, about 650 msec, about 700 msec, about 750 msec, about 800 msec, about 850 msec, about 900 msec, about 950 msec, about 1,000 msec, about 1,100 msec, about 1,200 msec, about 1,300 msec, about 1,400 msec, about 1,500 msec, about 1,600 msec, about 1,700 msec, about 1,800 msec, about 1,900 msec, about 2,000 msec, about 2,500 msec, or about 3,000 msec. In yet other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the second group of stimuli can be, e.g., at least 10 msec, at least 50 msec, at least 100 msec, at least 150 msec, at least 200 msec, at least 250 msec, at least 300 msec, at least 350 msec, at least 400 msec, at least 450 msec, at least 500 msec, at least 550 msec, at least 600 msec, at least 650 msec, at least 700 msec, at least 750 msec, at least 800 msec, at least 850 msec, at least 900 msec, at least 950 msec, at least 1,000 msec, at least 1,100 msec, at least 1,200 msec, at least 1,300 msec, at least 1,400 msec, at least 1,500 msec, at least 1,600 msec, at least 1,700 msec, at least 1,800 msec, at least 1,900 msec, at least 2,000 msec, at least 2,500 msec, or at least 3,000 msec. In still other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the second group of stimuli can be, e.g., at most 10 msec, at most 50 msec, at most 100 msec, at most 150 msec, at most 200 msec, at most 250 msec, at most 300 msec, at most 350 msec, at most 400 msec, at most 450 msec, at most 500 msec, at most 550 msec, at most 600 msec, at most 650 msec, at most 700 msec, at most 750 msec, at most 800 msec, at most 850 msec, at most 900 msec, at most 950 msec, at most 1,000 msec, at most 1,100 msec, at most 1,200 msec, at most 1,300 msec, at most 1,400 msec, at most 1,500 msec, at most 1,600 msec, at most 1,700 msec, at most 1,800 msec, at most 1,900 msec, at most 2,000 msec, at most 2,500 msec, or at most 3,000 msec. In further other aspects of this embodiment, an interval period of time between the presentation of a stimulus from the second group of stimuli can be, e.g., about 10 msec to about 100 msec, about 10 msec to about 200 msec, about 10 msec to about 300 msec, about 10 msec to about 400 msec, about 10 msec to about 500 msec, about 10 msec to about 600 msec, about 10 msec to about 700 msec, about 10 msec to about 800 msec, about 10 msec to about 900 msec, about 10 msec to about 1,000 msec, about 10 msec to about 1,100 msec, about 10 msec to about 1,200 msec, about 10 msec to about 1,300 msec, about 10 msec to about 1,400 msec, about 10 msec to about 1,500 msec, about 10 msec to about 1,600 msec, about 10 msec to about 1,700 msec, about 10 msec to about 1,800 msec, about 10 msec to about 1,900 msec, about 10 msec to about 2,000 msec, about 10 msec to about 3,000 msec, about 100 msec to about 200 msec, about 100 msec to about 300 msec, about 100 msec to about 400 msec, about 100 msec to about 500 msec, about 100 msec to about 600 msec, about 100 msec to about 700 msec, about 100 msec to about 800 msec, about 100 msec to about 900 msec, about 100 msec to about 1,000 msec, about 100 msec to about 1,100 msec, about 100 msec to about 1,200 msec, about 100 msec to about 1,300 msec, about 100 msec to about 1,400 msec, about 100 msec to about 1,500 msec, about 100 msec to about 1,600 msec, about 100 msec to about 1,700 msec, about 100 msec to about 1,800 msec, about 100 msec to about 1,900 msec, about 100 msec to about 2,000 msec, about 100 msec to about 3,000 msec, about 250 msec to about 300 msec, about 250 msec to about 400 msec, about 250 msec to about 500 msec, about 250 msec to about 600 msec, about 250 msec to about 700 msec, about 250 msec to about 800 msec, about 250 msec to about 900 msec, about 250 msec to about 1,000 msec, about 250 msec to about 1,100 msec, about 250 msec to about 1,200 msec, about 250 msec to about 1,300 msec, about 250 msec to about 1,400 msec, about 250 msec to about 1,500 msec, about 250 msec to about 1,600 msec, about 250 msec to about 1,700 msec, about 250 msec to about 1,800 msec, about 250 msec to about 1,900 msec, about 250 msec to about 2,000 msec, about 250 msec to about 3,000 msec, about 500 msec to about 600 msec, about 500 msec to about 700 msec, about 500 msec to about 800 msec, about 500 msec to about 900 msec, about 500 msec to about 1,000 msec, about 500 msec to about 1,100 msec, about 500 msec to about 1,200 msec, about 500 msec to about 1,300 msec, about 500 msec to about 1,400 msec, about 500 msec to about 1,500 msec, about 500 msec to about 1,600 msec, about 500 msec to about 1,700 msec, about 500 msec to about 1,800 msec, about 500 msec to about 1,900 msec, about 500 msec to about 2,000 msec, about 500 msec to about 3,000 msec, about 750 msec to about 800 msec, about 750 msec to about 900 msec, about 750 msec to about 1,000 msec, about 750 msec to about 1,100 msec, about 750 msec to about 1,200 msec, about 750 msec to about 1,300 msec, about 750 msec to about 1,400 msec, about 750 msec to about 1,500 msec, about 750 msec to about 1,600 msec, about 750 msec to about 1,700 msec, about 750 msec to about 1,800 msec, about 750 msec to about 1,900 msec, about 750 msec to about 2,000 msec, about 750 msec to about 3,000 msec, about 1,000 msec to about 1,100 msec, about 1,000 msec to about 1,200 msec, about 1,000 msec to about 1,300 msec, about 1,000 msec to about 1,400 msec, about 1,000 msec to about 1,500 msec, about 1,000 msec to about 1,600 msec, about 1,000 msec to about 1,700 msec, about 1,000 msec to about 1,800 msec, about 1,000 msec to about 1,900 msec, about 1,000 msec to about 2,000 msec, about 1,000 msec to about 3,000 msec, about 1,250 msec to about 1,300 msec, about 1,250 msec to about 1,400 msec, about 1,250 msec to about 1,500 msec, about 1,250 msec to about 1,600 msec, about 1,250 msec to about 1,700 msec, about 1,250 msec to about 1,800 msec, about 1,250 msec to about 1,900 msec, about 1,250 msec to about 2,000 msec, about 1,250 msec to about 3,000 msec, about 1,500 msec to about 1,600 msec, about 1,500 msec to about 1,700 msec, about 1,500 msec to about 1,800 msec, about 1,500 msec to about 1,900 msec, about 1,500 msec to about 2,000 msec, about 1,500 msec to about 3,000 msec, about 2,000 msec to about 3,000 msec, or about 2,500 msec to about 3,000 msec. A second group of stimuli comprises a plurality of stimuli. In an aspect of this embodiment, a second group of stimuli disclosed herein comprises at least one preexposed stimuli, a non-preexposed stimulus, a target stimulus, and the one or more neutral stimuli. A non-preexposed stimulus is a stimulus which is not presented during the pre-exposure phase and represents a novel stimulus that occurs only during the test phase. It is predictive of the occurrence of the target stimulus. A target stimulus is a stimulus which is not presented during the pre-exposure phase and represents a novel stimulus occurring only during the test phase. It is the stimulus that an individual is trying to anticipate the occurrence of during the test phase. The target stimulus can only be correctly anticipated by an individual following a preexposed or a non-preexposed stimulus and not a neutral stimulus. A preexposed stimulus and neutral stimulus are the same as those in presented in the preexposure phase proceure. A group assignment method, a psychotic disorder determination method, and a therapy recommendation method disclosed herein measures a time associated with a target anticipated response of the individual to each stimulus from a second group of stimuli disclosed herein. A response to a target stimulus disclosed herein of less than the sum of the presentation time and interval time according to a second set of directions disclosed is indicative that the individual anticipated the occurrence of the target stimulus. In aspects of this embodiment, an individual is scored as anticipating the occurrence of a target stimulus if the sum of the presentation time and interval time is, e.g., less than 550 msec, less than 750 msec, less than 950 msec, less than 1,050 msec, less than 1,150 msec, less than 1,350 msec, less than 1,550 msec, less than 1,750 msec, less than 1,950 msec, less than 2,150 msec, less than 2,350 msec, or less than 2,550 msec, then the individual anticipated the occurrence of the target stimulus. A response to a target stimulus disclosed herein of equal to or more than the sum of the presentation time and interval time according to a second set of directions disclosed herein is indicative that the individual failed to anticipate the occurrence of the target stimulus. In aspects of this embodiment, an individual is scored as failing to anticipate the occurrence of a target stimulus if the sum of the presentation time and interval time is, e.g., 550 msec or more, 750 msec or more, 950 msec or more, 1,050 msec or more, 1,150 msec or more, 1,350 msec or more, 1,550 msec or more, 1,750 msec or more, 1,950 msec or more, 2,150 msec or more, 2,350 msec or more, 2,550 msec or more, then the individual failed to anticipate the occurrence of the target stimulus. A group assignment method, a psychotic disorder determination method, and a therapy recommendation method disclosed herein comprises a step of measuring a latent inhibition response of the individual to calculate a latent inhibition score to determine whether the individual exhibits an attenuated latent inhibition response, a normal latent inhibition response or an enhanced latent inhibition response. The latent inhibition score phase of the application500is illustrated in greater detail inFIG.5. The patient's P test data from the test results dataset is retrieved from the database, step502. The latent inhibition score LISPfor the patient P is determined using the latent inhibition algorithm to at least a portion of the test results dataset, such as the response time tRn, and optionally, the nonresponses or untimely responses, step504. Outliers in the dataset may be manually or automatically removed to improve the assessment accuracy. The latent inhibition score LISPcalculated is compared to a reference latent inhibition score LISRto determine an outcome assessment for the patient P, step505. In step506, the application determines whether LISP=LISR, that is, equal exactly or within a predetermined range of one another. If LISP=LISR, then the patient P is classified as having a normal latent inhibition response, step508. In step510, the application determines whether LISP>LISR. If LISP>LISR, then the patient P is classified as having an enhanced latent inhibition response, step512. In step514, the application determines whether LISP<LISR. If LISP<LISR, then the patient P is classified as having an attenuated latent inhibition response, step516. The outcome assessment data for the patient P is recorded in the patient dataset, step518. As seen inFIG.2, the present invention is, in one aspect thereof, a method200that broadly invokes an algorithm for performing a latent inhibition task. The algorithm is embodied in one or more data processing functions that are executed by a plurality of software elements. The latent inhibition task is performed in a pre-exposure phase (referred to herein as the pre-exposure portion300), a test phase (referred to herein as the text portion400), and a measurement and application phase (referred to herein as the latent inhibition scoring portion500) in which a latent inhibition score is calculated to model a patient's response to presentations of stimulus, and used to determine a clinical study group assignment for a patient, a patient's psychotic disorder, and an appropriate therapeutic treatment for the patient. It is to be understood that the measurement and application phase may also include calculating a working memory score, and that either or both of a latent inhibition score or a working memory score may be calculated by the algorithm.FIG.3is a flow chart of steps in the pre-exposure phase, whileFIG.4is a flow chart of steps in the test phase.FIG.5is a flow chart of steps in determining a clinical study group assignment for a patient, andFIG.6andFIG.7are matrices of diagnosis and treatment recommendations according to latent inhibition scores. The algorithm may be executed by hardware components, such as one or more servers, that are configured to execute a plurality of data processing modules. The hardware components and software elements are components within a computing environment that may also include one or more processors as well as the plurality of additional software elements and hardware components. The one or more processors, and the various software and hardware, are configured to execute program instructions routines, sub-routines, and other software elements stored within at least one computer-readable non-transitory storage medium to at least perform the analytical functions described herein that are part of the algorithm performing the latent inhibition task, and embodied within the plurality of data processing modules. The algorithm performs a number of specific functions while executing the pre-exposure phase and the test phase of the latent inhibition task, which as a general overview assesses the degree to which patients detect that a newly-introduced target stimulus is associated with a novel non-target stimulus, versus detecting that it is associated with a familiar non-target stimulus. The latent inhibition task begins with a familiarization or pre-exposure block that allows the patient to become familiar with several non-target stimuli. Next, the main or test block sees a novel non-target stimulus added, in addition to the introduction of the target stimulus. The pre-exposure and text blocks are presented via a graphical user interface having touch-responsive capability. In terms of its screen layout, presentation and button operation, the latent inhibition task is similar to a rapid visual processing test (RVP) of sustained visual attention, during non-training phases. In the pre-exposure and testing blocks of the latent inhibition task algorithm, stimuli are restricted to text values; in typical task variants, each stimulus is a single capital letter. Quotations may be used herein to indicate variants, the selection of which is used to indicate a configurable facet of the implementation. These are equivalent to ‘variables’ in software code and represent different portions of the algorithm performed in the present invention that may or may not be called, depending at least in part on the objectives of the administrator of the test. Regardless, the values taken on are specified by the task variant in force, or where not overridden therein, by values given in Tables 1, 2 and 3. TABLE 1Values for Variables utilized within Algorithmfor Assessing Latent InhibitionVariable NameDefault5 (PE)6 (NPE)preMethod2backpreOccurrences15200mainOccurrencesNoTarget6400MainOccurrencesThenTarget52020avoidRepeatstruestimulusDisplay1000postStimulusBlank150preemptDelay100stimulusTextHeight23 TABLE 2Values for Variables utilized within Algorithmfor Assessing Latent InhibitionVariable NameStandard5 (PE)6 (NPE)preMethod0backpreOccurrences0200mainOccurrencesNoTarget6400MainOccurrencesThenTarget52020avoidRepeatstruestimulusDisplay1000postStimulusBlank150preemptDelay100stimulusTextHeight23 TABLE 3Values for Variables utilized within Algorithmfor Assessing Latent InhibitionVariable NameOne-Back5 (PE)6 (NPE)preMethod1backpreOccurrences15200mainOccurrencesNoTarget6400MainOccurrencesThenTarget52020avoidRepeatstruestimulusDisplay1000postStimulusBlank150preemptDelay100stimulusTextHeight23 The pre-exposure blocks may operate in one of 3 modes as indicated in Tables 1, 2 and 3. The modes may be a default mode, a standard mode, and a one-back mode. The values presented for each of these modes dictate the presentation of the pre-exposure by the latent inhibition algorithm, as follows below. Variable names in Tables 1, 2 and 3 refer to different portions of the tasks, such as “preInstructions” etc. Referring to Tables 1, 2 and 3 where there are multiple (i) values for a variable, a separate column is used for each (i) against which the variable's values differs. For clarity, the legends ‘PE’ and ‘NPE’ point out, respectively, the pre-exposure and non-pre-exposure stimulus (i.e. respectively the familiar and the non-familiar stimulus configured to precede the target stimulus most frequently). During the pre-exposure phase, button operation on the graphical user interface includes a button that is drawn at a bottom center of the touchable screen. To make a button press, the patient touches inside the button (which initially appears untouched), which is then re-drawn to indicate that it has been touched. When the patient stops touching the button, or drags it outside of its bounds, the algorithm redraws the button so that it returns to its untouched state. There is no other effect on the latent inhibition task. At the next step of this pre-exposure phase, the button is surrounded by an invisible border of approximately 5 mm thickness (relative to a typical tablet screen). It is to be understood that any size of such a border may be displayed, however. Regardless, touches within this border are counted as touches to the button. Prior to each block, instructions are displayed on the touch screen interface. An arrow button is displayed at the bottom of the touch screen, typically appearing below the instructions. When the patient taps it, the algorithm removes the instructions and the block of pre-exposure stimuli presentations begin. Depending on the selected variable for displaying text on the screen in a particular font, a button may or may not be displayed at the outset to the patient signaling the beginning of pre-exposure stimuli. For example, if “preMethod” has been selected with a variable of “1back” or “2back”, then a button is displayed; otherwise, no button is displayed. Regardless, consecutive stimulus presentations are initiated. The stimuli presented are drawn in turn from a randomly shuffled list, comprised of “preOccurrences(i)” which represent occurrences of stimulus(i) for each defined stimulus(i) (i>0). If “avoidRepeats” has been selected, the list is further amended such that the same stimulus is never presented twice in a row. This is achieved by inspecting each stimulus in turn and, where it causes a repeat of the preceding stimulus, moving it to a random new position in the sequence where it no longer causes a repeat (i.e. where it neither follows nor precedes the same stimulus). Each stimulus is presented for display for a preset period of time depending on the variable, typically expressed in milliseconds. For example, where “stimulusDisplay” is the variable, the preset time period is 1000 msec. The stimulus is then offset, and no stimulus is displayed for another preset period of time, such as the time period specific by “postStimulusBlank.” The stimulus size is a preset height, for example that specified by the variable “stimulusTextHeight.” When button presses are made by the patient, they are associated with a perceived presentation. A given presentation is the perceived presentation from “preemptDelay” ms after it is displayed on the screen, until “preemptDelay” ms after the next stimulus is displayed on the screen. Before “preemptDelay” ms from the first stimulus in the block, and from “preemptDelay” ms after the last stimulus in the block, there is no perceived presentation and any presses made by the patient on the touch screen are ignored. The pre-exposure block ends “preemptDelay” ms after the last stimulus of the block is offset. The main or testing block, or phase, of the latent inhibition task algorithm is executed in the same manner as the pre-exposure block, except for the differences described as follows. In this phase, the button is always displayed to the patient. The stimuli to be presented in this test phase of the algorithm are drawn in turn from a randomly shuffled list, comprised of “mainOccurrencesNoTarget(i)” occurrences of stimulus(i) for each defined stimulus(i) (i>0), and “mainOccurrencesThenTarget(i)” occurrences of stimulus(i) for each defined stimulus(i) (i>0), with each occurrence being immediately followed by a single occurrence of “targetStimulus”. Note that during the shuffling, whenever a stimulus that is followed by a “targetStimulus” is moved, the target is moved along with that stimulus, such that it still succeeds the moved stimulus in the shuffled sequence. As during the pre-exposure phase, if “avoidRepeats” is the default, the list of stimuli is further amended such that the same stimulus is never presented twice in a row; however, where the moved stimulus was followed by a target in the original sequence, the target is moved along with that stimulus, such that it still succeeds the moved stimulus in the amended sequence. Returning to the discussion of variables and defaults for the pre-exposure and test blocks, during the presentation of stimuli in “preInstructions” in the pre-exposure block, the patient is presented with text that may be, in one example,In this task you will see a sequence of letters appearing on the screen.Your task is to press the response button at the bottom of the screen each time the current letter is the same as the one that was presented before last, which is 2 positions back in the sequence.Otherwise, do not respond.When this task ends, you will be given a new set of instructions.Press the arrow below when you are ready to begin. During the main or test block, different text appears on the touch screen during “preInstructions”. The patient is presented with text that reads, for example, asIn this task you will see a sequence of letters appearing on the screen.Your task is to try and predict when a letter X is going to appear.If you think you know when the X will appear then you can press the response button early in the sequence, which is before the X appears on screen.Alternatively, if you are unable to do this please press the response button as quickly as possible when you see the letter X. There may be more than one rule that predicts the X.Please try to be as accurate as you can, but do not worry about making the occasional error.If you understand the task, please press the arrow below when you are ready to begin. For the above text, symbols are used when delineating text to be shown for various ones of the variables, and where the symbolappears in software code, this indicates that a new line should be started on the screen (note that the symbol is not displayed on the screen to the patient). These are the only points at which text will be wrapped on-screen, regardless of how the text is wrapped in this specification. During the testing phase, the latent inhibition task algorithm measures a response of the patient to stimuli presented. Protocols for measuring a response time available for task variants in the algorithm are defined below. Variables in quotation marks indicate a configurable option of the measurement protocols. This is equivalent to a ‘variable’ in software code; where surrounded by angle brackets, substitute the actual value of the variable when reading the text. The values taken on by these variables are specified in the measure definitions of the task variant in force. Note that measures are always incalculable when the task is aborted. ‘Perceived presentations’ refers to the presentation displayed to the subject except where the relevant subject interaction occurred during the pre-empt period, in which case it refers to the prior presentation. Any interactions during the pre-empt period of the first presentation are ignored. This is consistent with the approach taken in the rapid visual processing test (RVP) of sustained visual attention. The algorithm has several analytical functions available for modeling the response time measured as a stimulus response latency. These analytical functions apply statistical analyses for such a model that include count, mean, median and standard deviation, and the algorithm may utilize one or more of these analytical functions when modeling a patient's response time. Together these statistical analyses are used to evaluate ranges of behavior in the patient's response that are indicative of normal, attenuated, or enhanced latent inhibition, either in the amount of the patient's responses, or in relation to a central tendency of the responses and the distance from such a central tendency. Stimulus response latency during the main (not pre-exposure) block on perceived presentations of the selected type is measured from the presentation of the stimulus to the first button tap by the subject. Where the present invention applies a counting function, the algorithm counts the number of presentations on which such a response occurred, regardless of the exact reaction time within the presentation. Where the present invention applies a mean, median, or standard deviation function, the model performs these calculations on the total number of responses. Presentation type for a latency response stimulus may occur in a number of different forms. This may include filler, a pre-exposure (P.E.) stimulus where the pre-target stimulus that was shown during pre-exposure), a non pre-exposure (N.P.E.) where the pre-target stimulus that was not shown during pre-exposure, target, target-after-P.E., target-after-N.P.E., and target-after-filler. Target response latency during the main (not pre-exposure) block is measured from the first button tap made during each P.E./N.P.E. target period. The P.E./N.P.E. target period runs from the start of the P.E./N.P.E. stimulus' perceived presentation to the end of the subsequent target stimulus' perceived presentation, measured from the onset of the P.E./N.P.E. stimulus. Again, the algorithm has several analytical functions available for modeling the response time measured as a target response latency. These analytical functions apply statstical analyses that include count, mean, median and standard deviation, and the algorithm may utilize one or more of these analytical functions when modeling a patient's response time for target stimuli. Presentation type for a target stimulus is as noted above either a pre-exposure (P.E.) or non pre-exposure (N.P.E.) stimulus. For a P.E. stimulus, the pre-target stimulus is that which was shown during pre-exposure, any presses of a button during the subsequent target are also included. For a N.P.E. stimulus, the pre-target stimulus is that which was not shown during pre-exposure, and as with P.E., any presses during the subsequent target are also included. An assessment of working memory requires evaluating pre-exposure hits and pre-exposure false alarms. Note fromFIG.3that n-back responses relate to responses to stimuli presented n positions prior, and that instructions may or may not require n-back responses, such that a response input may be required for each P.E. stimulus displayed, or an n-back response is required for a P.E. stimulus that matches a prior P.E. stimulus presented n positions prior. Pre-exposure hits are evaluated by counting the number of n-back ‘go’ perceived presentations during the pre-exposure block, on which the patient tapped the button. Note that this would be zero in the case of pre-exposure blocks with no n-backs. Pre-exposure false alarms are evaluated by counting the number of n-back ‘stop’ perceived presentations during the pre-exposure block on which the patient tapped the button. Note that this would also be zero in the case of pre-exposure blocks with no n-backs. Regardless of the presentation type or the analytical function used to evaluate response time, the algorithm uses the information obtained from these analytical functions to calculate a latent inhibition score and a working memory score. Each of these may be used in the present invention to arrive at determinations of a clinical study group assignment for a patient, a patient's psychotic disorder, and an appropriate therapeutic treatment for the patient, as noted above. A patient's latent inhibition score may be calculated by measuring the target response latency for the PE stimulus, measuring the target response latency for the NPE stimulus, and computing a difference between the two—in other words, P.E. minus N.P.E. This may be performed regardless of the analytical function applied to measure latent inhibition. A patient's working memory score may be calculated by compiling a total number of hits, and total number of false alarms, and computing a difference between the two—in other words, hits minus false alarms. As with the latent inhibition score, this may be performed regardless of the analytical function applied to measure latent inhibition. The present invention may incorporate one or more techniques of machine learning, and apply proprietary rules identifying such techniques of machine learning to analyze the stimulus latency response and target latency response developed from modeling a patient's reactions to stimuli presented. Machine learning is an application of artificial intelligence in which algorithms are deployed to evaluate data, learn from that data, and make informed decisions based on what was learned. Specific machine learning models can be developed to focus on particular issues to be solved by such informed decisions. In the present invention, the algorithm may be configured to apply such techniques to improve upon the outcomes determined by the latent inhibition score and the working memory score, by inferring distinctions based on past responses to displays of text. The present invention may therefore apply the one or more techniques of machine learning to improve upon the resulting determinations of a clinical study group assignment for a patient, a patient's psychotic disorder, and an appropriate therapeutic treatment for the patient. In step1000, the application retrieves the outcome assessment data for the patient P from the patient dataset for further assessment. Patient personal data (such as medical history, personal data, etc.) is entered and/or retrieved from the patient dataset in step1002, for use with the outcome assessment data for further assessment. In step600, the application algorithm is applied to one or both of the outcome assessment data and the patient personal data to determine an assignment of the patient P to a group participating in a clinical study regarding a psychotic disorder. In step700, the application algorithm is applied to one or both of the outcome assessment data and the patient personal data to determine the type of patient psychotic disorder, if any. In step800, the application algorithm is applied to one or both of the outcome assessment data and the patient personal data to determine an appropriate patient therapy. The assessment data from one or more of steps600,700, and800are recorded in the patient dataset in the database. In one embodiment, a latent inhibition score is calculated using one or more reaction times. In an aspect of this embodiment, a latent inhibition score is calculated by i) calculating a first average time based on each target anticipated response measured when a target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by subtracting the second average time by the first average time. In an aspect of this embodiment, a latent inhibition score is calculated using one or more reaction times by i) calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by subtracting the first average time by the second average time. In an aspect of this embodiment, a latent inhibition score is calculated using one or more reaction times by i) calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second average time based on each target prediction response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by determining whether the first average time is slower or faster than the second average time. In an aspect of this embodiment, a latent inhibition score is calculated using one or more reaction times by i) pairing each target anticipatory response time based on the non-preexposed stimulus with a target anticipatory response time based on the preexposed stimulus; ii) calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; and iii) calculating the latent inhibition score by determining (a) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (b) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (c) both (a) and (b). In one embodiment, a latent inhibition score is calculated using the number of anticipatory responses. In an aspect of this embodiment, a latent inhibition score is calculated by i) calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by subtracting the second average number of anticipatory responses by the first average number of anticipatory responses. In an aspect of this embodiment, a latent inhibition score is calculated using the number of anticipatory responses by i) calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by subtracting the first average number of anticipatory responses by the second average number of anticipatory responses. In an aspect of this embodiment, a latent inhibition score is calculated using the number of anticipatory responses by i) calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by determining whether the first average number of anticipatory responses is lower or higher than the second average number of anticipatory responses. In an aspect of this embodiment, a latent inhibition score is calculated using the number of anticipatory responses by i) pairing each target anticipatory response based on the non-preexposed stimulus with a target anticipatory response based on the preexposed stimulus; ii) calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; and iii) calculating the latent inhibition score by determining (a) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (b) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (c) both (a) and (b). In one embodiment, a latent inhibition score is calculated using the percent of anticipatory responses. In an aspect of this embodiment, a latent inhibition score is calculated using the percent of anticipatory responses by i) calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by subtracting the second percent of anticipatory responses by the first percent of anticipatory responses. In an aspect of this embodiment, a latent inhibition score is calculated using the percent of anticipatory responses by i) calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by subtracting the first percent of anticipatory responses by the second percent of anticipatory responses. In an aspect of this embodiment, a latent inhibition score is calculated using the percent of anticipatory responses by i) calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by determining whether the first percent of anticipatory responses is lower or higher than the second percent of anticipatory responses. In one embodiment, a latent inhibition score is calculated by comparing the latent inhibition score to a reference score comprising a standard range of latent inhibition scores. A reference score can be based on values obtained from normal individuals, values obtained from different types of patients, and/or values obtained from the same individual on one or more prior testings. A standard range latent inhibition scores can be based on a plurality of healthy individuals. In aspects of this embodiment, a plurality of healthy individuals can be, e.g., about 20 or more individuals, about 30 or more individuals, about 40 or more individuals, about 50 or more individuals, about 60 or more individuals, about 70 or more individuals, about 80 or more individuals, about 90 or more individuals, or about 100 or more individuals. A latent inhibition score calculated above a reference score is indicative of an enhanced latent inhibition response. a latent inhibition score calculated within a standard range latent inhibition scores of a reference score is indicative a normal latent inhibition response. A latent inhibition score calculated below A reference score is indicative of an attenuated latent inhibition response. In one embodiment, a latent inhibition score is calculated using an accuracy-sensitivity d′ score. In an aspect of this embodiment, a latent inhibition score is calculated using an accuracy-sensitivity d′ score by i) calculating a first d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; ii) calculating a second d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and iii) calculating the latent inhibition score by subtracting the second d′ score of anticipatory responses by the first d′ score of anticipatory responses. A first d′ score and a second d′ score are calculated by: i) calculating a hit rate by dividing the totaling the number of correctly identified back targets by the total number of back targets; ii) calculating a false alarm rate, by dividing the number of responses for stimuli erroneously identified as back targets by the total number of back targets; and iii) applying a z-transformation to the hit rate and the false alarm rate and subtracting the resulting transformed false alarm rate from the resulting transformed hit rate to obtain the d′ score. A group assignment method, a psychotic disorder determination method, and a therapy recommendation method disclosed herein may further include evaluating working memory of the individual. In one embodiment, working memory can be evaluated in a pre-exposure phase disclosed herein by providing instructions which require an individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown one position back in a sequence of the first group of stimuli. In one embodiment, working memory can be evaluated in a pre-exposure phase disclosed herein by providing instructions which require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown two positions back in a sequence of the first group of stimuli. In one embodiment, working memory is evaluated by: i) counting the number of pre-exposure responses presented based on the presentation back stimulus; ii) counting the number of pre-exposure responses selected correctly by the individual based on the presentation back stimulus; and iii) calculating the percent of pre-exposure responses selected correctly by the individual, wherein 50% or more is indicative of a working memory. In one embodiment, working memory is evaluated by: i) counting the number of pre-exposure responses selected incorrectly by the individual based on the presentation back stimulus; and ii) calculating the percent of pre-exposure responses selected incorrectly by the individual, wherein 50% or more is indicative of impaired working memory. In one embodiment, working memory is evaluated by calculating the average reaction time of pre-exposure responses selected incorrectly by the individual. In one embodiment, working memory is evaluated by calculating a d′ score of pre-exposure responses presented based on the presentation of back stimulus. Once a latent inhibition score is calculated by a group assignment method, a psychotic disorder determination method, or a therapy recommendation method disclosed herein, this calculation is used as a basis to make an outcome assessment. Although each method generates an outcome assessment the details of that assessment are method specific. With respect to a group assignment method disclosed herein an outcome assessment comprises a step of assigning the individual to a group designated by the clinical study. In one embodiment, an individual is assigned to a group based on whether a latent inhibition score of the individual is indicative of an attenuated latent inhibition response, a normal latent inhibition response, or an enhanced latent inhibition response. In one embodiment, when working memory is also measured, an individual is assigned to a group based on whether the latent inhibition score of the individual is indicative of an attenuated latent inhibition response, a normal latent inhibition response, or an enhanced latent inhibition response and whether the individual exhibits a deficit in working memory or not. With respect to a psychotic disorder determination method disclosed herein an outcome assessment comprise calculating a psychotic disorder of the individual (FIG.6). In one embodiment, an outcome assessment of psychotic disorder determination method disclosed herein pertains to whether an individual is at an ultra-high risk for a psychotic disorder. In aspects of this embodiment, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In yet other aspects of this embodiment, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In one embodiment, an outcome assessment of psychotic disorder determination method disclosed herein pertains to whether an individual is suffering a first episode of the psychotic disorder. In aspects of this embodiment, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, an outcome assessment indicates that an individual is not suffering a first episode of the psychotic disorder when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In yet other aspects of this embodiment, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In yet other aspects of this embodiment, hen working memory is also measured, an outcome assessment indicates that an individual is not suffering a first episode of the psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In yet other aspects of this embodiment, hen working memory is also measured, an outcome assessment indicates that an individual is not suffering a first episode of the psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder. In one embodiment, an outcome assessment of psychotic disorder determination method disclosed herein pertains to whether an individual is suffering from the psychotic disorder. In aspects of this embodiment, an outcome assessment indicates that an individual is suffering from a psychotic disorder when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, an outcome assessment indicates that an individual is not suffering from a psychotic disorder when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In yet other aspects of this embodiment, an outcome assessment indicates that an individual is suffering from a psychotic disorder when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not suffering from a psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not suffering from a psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In one embodiment, an outcome assessment of psychotic disorder determination method disclosed herein pertains to whether an individual is suffering from a treatment-resistant form of a psychotic disorder. In aspects of this embodiment, an outcome assessment indicates that an individual is not suffering from a treatment-resistant form of the psychotic disorder when an attenuated latent inhibition response is calculated by the method and the information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment. In aspects of this embodiment, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when a normal latent inhibition response is calculated by the method and the information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment. In aspects of this embodiment, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when an enhanced latent inhibition response is calculated by the method and the information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when a normal latent inhibition response is calculated by the method, information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of the psychotic disorder when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory. With respect to a therapy recommendation method disclosed herein an outcome assessment comprise a recommend therapy to treat an individual (FIG.7). In aspects of this embodiment, a recommended theray includes i) no therapy recommendation; or ii) treating with a pro-cognitive drug, treating with an anti-psychotic drug, treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms, or any combination thereof. In aspects of this embodiment, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In yet other aspects of this embodiment, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided when an attenuated latent inhibition response is calculated by the method, information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided when an enhanced latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In aspects of this embodiment, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, an outcome assessment indicates that an individual is not suffering a first episode of the psychotic disorder and a therapy recommendation includes maintaining a current treatment when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In yet other aspects of this embodiment, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug when an attenuated latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not suffering a first episode of the psychotic disorder and a therapy recommendation includes maintaining a current treatment when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method. information inputted into the method indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In aspects of this embodiment, an outcome assessment indicates that an individual is suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, an outcome assessment indicates that an individual is not suffering from the psychotic disorder and a therapy recommendation includes maintaining a current treatment when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In yet other aspects of this embodiment, an outcome assessment indicates that an individual is suffering from the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method. information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug when an attenuated latent inhibition response is calculated by the method. information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not suffering from the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug in addition to maintaining a current treatment when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In yet other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is not suffering from the psychotic disorder and a therapy recommendation includes maintaining a current treatment when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method. information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory. In still other aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method, information inputted into the method indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory. In aspects of this embodiment, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment. In other aspects of this embodiment, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment. In yet other aspects of this embodiment, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method. information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug when an attenuated latent inhibition response is calculated by the method. information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug when a normal latent inhibition response is calculated by the method. information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method. information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory. In aspects of this embodiment, when working memory is also measured, an outcome assessment indicates that an individual is suffering from a treatment-resistant form of a psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug when an enhanced latent inhibition response is calculated by the method. information inputted into the method indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory. In aspects of this embodiment, an outcome assessment indicates that the calculated latent inhibition score was an improvement over the one or more previous latent inhibition scores and therapy recommendation includes increasing the drug dose of a current treatment when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that this was a subsequent assessment. In other aspects of this embodiment, an outcome assessment indicates that the calculated latent inhibition score was an improvement over the one or more previous latent inhibition score and a therapy recommendation includes maintaining a current treatment when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that this was a subsequent assessment. In yet other aspects of this embodiment, an outcome assessment indicates that the calculated latent inhibition score was similar or worse than the one or more previous latent inhibition score and a therapy recommendation includes decreasing the drug dose of a current treatment when an enhanced latent inhibition response calculated by the method and information inputted into the method indicates that this was a subsequent assessment. In aspects of this embodiment, an outcome assessment indicates that the calculated latent inhibition score was similar or worse than the one or more previous latent inhibition scores and a therapy recommendation includes a different treatment when an attenuated latent inhibition response is calculated by the method and information inputted into the method indicates that this was a subsequent assessment. In other aspects of this embodiment, an outcome assessment indicates that the calculated latent inhibition score was similar to the one or more previous latent inhibition scores and a therapy recommendation includes maintaining a current treatment when a normal latent inhibition response is calculated by the method and information inputted into the method indicates that this was a subsequent assessment. In yet other aspects of this embodiment, an outcome assessment indicates that the calculated latent inhibition score was similar or worse than the one or more previous latent inhibition scores and a therapy recommendation includes a different treatment when an enhanced latent inhibition response is calculated by the method and information inputted into the method indicates that this was a subsequent assessment, when the calculated latent inhibition score. Aspects of the present specification disclose a pro-cognitive drug. In one embodiment, a pro-cognitive drug disclosed herein includes an agonist, an antagonist, a partial agonist, a positive allosteric modulator, a negative allosteric modulator, a silent allosteric modulator, or an inverse agonist of an ionotropphic receptor. Exemplary examples of an ionotropphic receptor include, without limitation, a Nicotinic Acetylcholine (nAch) receptor, an ionotropphic Gamma-Aminobutyric Acid (GABA) receptor, an ionotropphic Glutamine (Glu) receptor, or an ionotropphic Serotonin (5-HT) receptor. Non-limiting examples of an nAch receptor include an α4β2 nAch receptor, an αβ4 nAch receptor, and an α7 nAch receptor. Non-limiting examples of an ionotropphic GABA receptor include a GABAAreceptor and a GABAA-preceptor. Non-limiting examples of an ionotropphic Glutamine receptor includes an N-methyl-D-aspartate receptor, a Kainate receptor, and an α-amino-3-hydroxy-5-methyl-4-isoxazolepropionic acid receptor. Non-limiting examples of an onotropphic 5-HT receptor include a 5-HT3receptor. In one embodiment, a pro-cognitive drug disclosed herein includes an agonist, an antagonist, a partial agonist, a positive allosteric modulator, a negative allosteric modulator, a silent allosteric modulator, or an inverse agonist of a metabotrophic receptor. Exemplary examples of a metabotrophic receptor include, without limitation, a Muscarinic Acetylcholine (mAch) receptor, a Cannabinoid (CB) receptor, a Dopamine (DA) receptor, an Endorphin receptor, a metabotrophic Gamma-Aminobutyric Acid (GABA) receptor, a metabotrophic Glutamine (Glu) receptor, a Norepinephrine (NE) receptor, an Oxytocin receptor, and a metabotrophic Serotonin (5-HT) receptor. Non-limiting examples of a mAch receptor include a M1mAch receptor, M2mAch receptor, M3mAch receptor, M4mAch receptor, and M5mAch receptor. Non-limiting examples of a CB receptor include a CB1 receptor and CB2 receptor. Non-limiting examples of a DA receptor include a DA1receptor, a DA2receptor, a DA3receptor, a DA4receptor, or a DA5receptor and heterodimers thereof. Non-limiting examples of an Endorphin receptor is a μ1Opioid receptor, a μ2Opioid receptor, and a μ3Opioid receptor. Non-limiting examples of a metabotrophic GABA receptor include a GABABreceptor. Non-limiting examples of a metabotrophic Glu receptor include a Glu receptor, a Glu receptor2, a Glu receptor3, a Glu receptor4, a Glu receptor5, a Glu receptor6, a Glu receptor7, and a Glu receptor8. Non-limiting examples of a NE receptor include an α1Adrenergic receptor, an α2Adrenergic receptor, a β1Adrenergic receptor, a β2Adrenergic receptor, and a β3Adrenergic receptor. Non-limiting examples of a metabotrophic 5-HT receptor include a 5-HT1receptor, a 5-HT2receptor, a 5-HT4receptor, a 5-HT5receptor, a 5-HT6receptor, and a 5-HT7receptor. In one embodiment, a pro-cognitive drug disclosed herein includes an agonist, an antagonist, a partial agonist, a positive allosteric modulator, a negative allosteric modulator, a silent allosteric modulator, or an inverse agonist of a phosphodiesterase (PDE). Exemplary examples of a PDE include, without limitation, a PDE1, a PDE2, a PDE3, a PDE4, a PDE5, a PDE6, a PDE7, a PDE8, a PDE9, and a PDE10. Aspects of the present specification disclose an anti-psychotic drug. In one embodiment, an anti-psychotic drug includes a dopamine antagonist. Exemplary examples of a dopamine antagonist include, without limitation, Chlorpromazine, Haloperidol, Loxapine, Perphenazine, Prochlorperazine, Thiothixene, Thioridazine, and Trifluoperazine. In one embodiment, an anti-psychotic drug includes a serotonin-dopamine antagonist. Exemplary examples of a serotonin-dopamine antagonist include, without limitation, Olanzapine, Paliperidone, Quetiapine, and Risperidone. In one embodiment, an anti-psychotic drug includes a partial dopamine agonist. Exemplary examples of a partial dopamine agonist include, without limitation, Aripiprazole. A group assignment method, a psychotic disorder determination method, and a therapy recommendation method disclosed herein can be useful to assign an individual suffering from a wide variety of psychotic disorders. Exemplary psychotic disorders include, without limitation, a schizophrenia spectrum disorder, an obsessive-compulsive disorder, an anxiety disorder, a bipolar disorder, or a dementia disease. In other embodiments, a group assignment method can be described as follows:1. A method of assigning an individual to a group for a clinical study on a psychotic disorder using a non-invasive computational device-based test, the method comprising:a. having the individual perform a latent inhibition assessment using the computational device and a graphical user interface coupled thereto, the latent inhibition assessment comprising a pre-exposure phase and a test phase,i. wherein the pre-exposure phase includes,presenting the individual with a first set of directions for how to respond to each stimulus of a first group of stimuli, wherein the first set of directions include pre-exposure phase instructions which require the individual to respond to each stimulus of the first group of stimuli in a defined manner;presenting the individual with a random order of the first group of stimuli, each stimulus being presented for 10 msec to 10,000 msec, wherein the first group of stimuli comprises a plurality of stimuli including at least one preexposed stimulus and one or more neutral stimuli;ii. wherein the test phase includes,presenting the individual with a second set of directions for how to respond to each stimulus of a second group of stimuli, wherein the second set of directions include test phase instructions which require the individual to anticipate the occurrence of a target stimulus;presenting the individual with the second group of stimuli, each stimulus being presented for 10 msec to 10,000 msec with a 0 msec to 10,000 msec interval between each stimulus, wherein the second group of stimuli comprises a plurality of stimuli including the at least one preexposed stimuli, a non-preexposed stimulus, the target stimulus, and the one or more neutral stimuli; recording and analyzing the individual's interaction with the graphical user interface following presentation of the second group of stimuli, bymeasuring a time associated with a target anticipated response of the individual to each stimulus from the plurality of stimuli, wherein a response to the target stimulus of less than the sum of the presentation time and interval time according to the second set of directions is indicative that the individual anticipated the occurrence of the target stimulus, and wherein a response to the target stimulus of equal to or more than the sum of the presentation time and interval time according to the second set of directions is indicative that the individual failed to anticipate the occurrence of the target stimulus;b. measuring a latent inhibition response of the individual to calculate a latent inhibition score, by modeling the time associated with a target anticipated response in one or more statistical analyses that analyze one or more of a count of a number of presentations on which the response to the targeted stimulus occurred, a central tendency of the number of responses to the target stimulus, or a distance from a central tendency of the number of the responses to the target stimulus, and determining whether the individual exhibited an attenuated latent inhibition response, a normal latent inhibition response or an enhanced latent inhibition response from the latent inhibition score; andc. assigning the individual to a group designated for the clinical study.2. The method of embodiment 1, wherein the pre-exposure phase instructions require the individual to respond to a stimulus of the first group of stimuli as it appears on the screen.3. The method of embodiment 1, wherein the pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown one position back in a sequence of the first group of stimuli.4. The method of embodiment 1, wherein the pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown two positions back in a sequence of the first group of stimuli.5. The method of any one of embodiments 1-4, wherein each stimulus is presented for is 100 msec to 5,000 msec, 250 msec to 2,500 msec, 500 msec to 1,500 msec, 750 msec to 1,250 msec, or 1,000 msec6. The method of any one of embodiments 1-5, wherein step (b)(i) further comprising an interval between each stimulus.7. The method of embodiment 6, wherein interval between each stimulus is 1 msec to 10,000 msec, 5 msec to 1,000 msec, 10 msec to 500 msec, 15 msec to 250 msec, 20 msec to 100 msec, 25 msec to 75 msec, or 50 msec8. The method of any one of embodiments 1-7, wherein step (a)(i) further comprises measuring a response of the individual to each stimulus from the first group of stimuli.9. The method of any one of embodiments 1-8, wherein if the individual responses to at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, or at least 95% of the first group of stimuli according to the first set of directions, the program proceeds to the test phase of step (b)(ii).10. The method of any one of embodiments 1-9, wherein in step (a)(ii) if the sum of the presentation time and interval time is less than 550 msec, less than 750 msec, less than 950 msec, less than 1,050 msec, less than 1,150 msec, less than 1,350 msec, less than 1,550 msec, less than 1,750 msec, less than 1,950 msec, less than 2,150 msec, less than 2,350 msec, or less than 2,550 msec, then the individual anticipated the occurrence of the target stimulus.11. The method of any one of embodiments 1-10, wherein in step (a)(ii) if the sum of the presentation time and interval time is 550 msec or more, 750 msec or more, 950 msec or more, 1,050 msec or more, 1,150 msec or more, 1,350 msec or more, 1,550 msec or more, 1,750 msec or more, 1,950 msec or more, 2,150 msec or more, 2,350 msec or more, 2,550 msec or more, then the individual failed to anticipate the occurrence of the target stimulus.12. The method of any one of embodiments 1-11, wherein in step (b)(ii) an equal number of presentations for the target stimulus occurs after presentation of the preexposed stimulus and after presentation of the non-preexposed stimulus13. The method of any one of embodiments 1-11, wherein in step (b)(ii) an unequal number of presentations for the target stimulus occurs after presentation of the preexposed stimulus relative to after presentation of the non-preexposed stimulus14. The method of embodiment 13, wherein the unequal number of presentations for the target stimulus occurring after presentation of the preexposed stimulus is ±10%, +20%, +30%, +40%, +50% the number of presentations for the target stimulus occurring after presentation of the non-preexposed stimulus.15. The method of any one of embodiments 1-14, wherein in step (b) the latent inhibition score is calculated by determining one or more reaction times.16. The method of embodiment 15, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second average time by the first average time.17. The method of embodiment 15, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first average time by the second average time.18. The method of embodiment 15, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target prediction response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first average time is slower or faster than the second average time.19. The method of embodiment 15, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: pairing each target anticipatory response time based on the non-preexposed stimulus with a target anticipatory response time based on the preexposed stimulus; calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; calculating the latent inhibition score by determining (i) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (ii) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (iii) both (i) and (ii).20. The method of any one of embodiments 1-14, wherein in step (b) the latent inhibition score is calculated by determining a number of anticipatory responses.21. The method of embodiment 20, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second average number of anticipatory responses by the first average number of anticipatory responses.22. The method of embodiment 20, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first average number of anticipatory responses by the second average number of anticipatory responses.23. The method of embodiment 20, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first average number of anticipatory responses is lower or higher than the second average number of anticipatory responses.24. The method of embodiment 20, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: pairing each target anticipatory response based on the non-preexposed stimulus with a target anticipatory response based on the preexposed stimulus; calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; calculating the latent inhibition score by determining (i) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (ii) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (iii) both (i) and (ii).25. The method of any one of embodiments 1-14, wherein in step (b) the latent inhibition score is calculated by determining a percentage of anticipatory responses.26. The method of embodiment 25, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second percent of anticipatory responses by the first percent of anticipatory responses.27. The method of embodiment 25, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first percent of anticipatory responses by the second percent of anticipatory responses.28. The method of embodiment 25, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first percent of anticipatory responses is lower or higher than the second percent of anticipatory responses.29. The method of any one of embodiments 1-14, wherein in step (b) the latent inhibition score is calculated by determining an accuracy-sensitivity d′ score.30. The method of embodiment 29, wherein the first d′ score and the second d′ score are calculated by: calculating a first d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second d′ score of anticipatory responses by the first d′ score of anticipatory responses.31. The method of embodiment 29, wherein the first d′ score and the second d′ score are calculated by: calculating a hit rate by dividing the totaling the number of correctly identified back targets by the total number of back targets; calculating a false alarm rate, by dividing the number of responses for stimuli erroneously identified as back targets by the total number of back targets; and applying a z-transformation to the hit rate and the false alarm rate and subtracting the resulting transformed false alarm rate from the resulting transformed hit rate to obtain the d′ score.32. The method of any one of embodiments 1-31, wherein in step (b) the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises comparing the latent inhibition score to a reference score comprising a standard range of latent inhibition scores.33. The method of embodiment 32, wherein the reference score is based on values obtained from normal individuals, values obtained from different types of patients, and/or values obtained from the same individual on one or more prior testings.34. The method of embodiment 32 or 33, wherein the standard range latent inhibition scores is based on 20 or more, 30 or more, 40 or more, 50 or more, 60 or more, 70 or more, 80 or more, 90 or more, or 100 or more healthy individuals.35. The method of any one of embodiments 32-34, wherein a latent inhibition score is calculated above the reference score, the latent inhibition score is indicative of an enhanced latent inhibition response; a latent inhibition score is calculated within the standard range latent inhibition scores of the reference score, the latent inhibition score is indicative of a normal latent inhibition response; and a latent inhibition score is calculated below the reference score, the latent inhibition score is indicative of an attenuated latent inhibition response.36. The method of any one of embodiments 1-35, wherein assignment is based on whether the latent inhibition score of the individual is indicative of an attenuated latent inhibition response, a normal latent inhibition response, or an enhanced latent inhibition response37. The method of any one of embodiments 1-36, further comprising evaluating working memory.38. The method of embodiment 37, wherein working memory is evaluated in the pre-exposure phase by providing instructions which require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown one position back in a sequence of the first group of stimuli.39. The method of embodiment 37, wherein working memory is evaluated in the pre-exposure phase by providing instructions which require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown two positions back in a sequence of the first group of stimuli.40. The method of any one of embodiments 37-39, wherein assignment is based on whether the latent inhibition score of the individual is indicative of an attenuated latent inhibition response, a normal latent inhibition response, or an enhanced latent inhibition response and whether the individual exhibits a deficit in working memory or not.41. The method of embodiment 37, wherein working memory is calculate by: counting the number of pre-exposure responses presented based on the presentation back stimulus; counting the number of pre-exposure responses selected correctly by the individual based on the presentation back stimulus; and calculating the percent of pre-exposure responses selected correctly by the individual, wherein 50% or more is indicative of a working memory.42. The method of embodiment 37, wherein working memory is calculate by: counting the number of pre-exposure responses selected incorrectly by the individual based on the presentation back stimulus; and calculating the percent of pre-exposure responses selected incorrectly by the individual, wherein 50% or more is indicative of impaired working memory.43. The method of embodiment 37, wherein working memory is calculate by: calculating the average reaction time of pre-exposure responses selected incorrectly by the individual.44. The method of embodiment 37, wherein working memory is calculate by: calculating a d′ score of pre-exposure responses presented based on the presentation of back stimulus.45. The method of any one of embodiments 1-44, wherein the psychotic disorder includes a schizophrenia spectrum disorder, an obsessive-compulsive disorder, an anxiety disorder, a bipolar disorder, or a dementia disease.46. A computer programmed to carry out the method of any one of embodiments 1-45.47. A computer operating the method of any one of embodiments 1-45.48. A system adapted to carry out the method of any one of embodiments 1-45.49. A storage medium on which is stored or otherwise recorded a computer programme for carrying the method of any one of embodiments 1-45. In other embodiments, a psychotic disorder determination method can be described as follows:1. A method of determining a psychotic disorder of an individual using a non-invasive computational device-based test, the method comprising:a. optionally entering information about the individual into a latent inhibition test program running on a computational device, the information including:i. whether this is an initial assessment or a subsequent assessment;ii. whether or not the individual is currently experiencing psychotic symptoms;iii. whether or not the individual has a history of a psychotic disorder; and/oriv. whether or not the individual has a history of resistance to anti-psychotic drug treatmentb. having the individual perform a latent inhibition assessment using the latent inhibition test program running on the computational device and a graphical user interface coupled thereto with which the user interacts, the latent inhibition assessment comprising a pre-exposure phase and a test phase,i. wherein the pre-exposure phase includes,presenting the individual with a first set of directions for how to respond to each stimulus of a first group of stimuli, wherein the first set of directions include pre-exposure phase instructions which require the individual to respond to each stimulus of the first group of stimuli in a defined manner;presenting the individual with a random order of the first group of stimuli, each stimulus being presented for 10 msec to 10,000 msec, wherein the first group of stimuli comprises a plurality of stimuli including at least one preexposed stimulus and one or more neutral stimuli;ii. wherein the test phase includes,presenting the individual with a second set of directions for how to respond to each stimulus of a second group of stimuli, wherein the second set of directions include test phase instructions which require the individual to anticipate the occurrence of a target stimulus;presenting the individual with the second group of stimuli, each stimulus being presented for 10 msec to 10,000 msec with a 0 msec to 10,000 msec interval between each stimulus, wherein the second group of stimuli comprises a plurality of stimuli including the at least one preexposed stimuli, a non-preexposed stimulus, the target stimulus, and the one or more neutral stimuli; recording and analyzing the individual's interaction with the graphical user interface following presentation of the second group of stimuli, bymeasuring a time associated with a target anticipated response of the individual to each stimulus from the plurality of stimuli, wherein a response to the target stimulus of less than the sum of the presentation time and interval time according to the second set of directions is indicative that the individual anticipated the occurrence of the target stimulus, and wherein a response to the target stimulus of equal to or more than the sum of the presentation time and interval time according to the second set of directions is indicative that the individual failed to anticipate the occurrence of the target stimulus;c. measuring a latent inhibition response of the individual to calculate a latent inhibition score by modeling the time associated with a target anticipated response in one or more statistical analyses that analyze one or more of a count of a number of presentations on which the response to the targeted stimulus occurred, a central tendency of the number of responses to the target stimulus, or a distance from a central tendency of the number of the responses to the target stimulus, and, determining whether the individual exhibited an attenuated latent inhibition response, a normal latent inhibition response or an enhanced latent inhibition response from the latent inhibition score; andd. calculating the psychotic disorder of the individual.2. The method of embodiment 1, wherein the information entered for (a)(iv) includes whether or not the individual is resistant to an anti-psychotic drug.3. The method of embodiment 1 or 2, wherein the pre-exposure phase instructions require the individual to respond to a stimulus of the first group of stimuli as it appears on the screen.4. The method of embodiment 1 or 2, wherein the pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown one position back in a sequence of the first group of stimuli.5. The method of embodiment 1 or 2, wherein the pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown two positions back in a sequence of the first group of stimuli.6. The method of any one of embodiments 1-5, wherein each stimulus is presented for is 100 msec to 5,000 msec, 250 msec to 2,500 msec, 500 msec to 1,500 msec, 750 msec to 1,250 msec, or 1,000 msec7. The method of any one of embodiments 1-6, wherein step (b)(i) further comprising an interval between each stimulus.8. The method of embodiment 7, wherein interval between each stimulus is 1 msec to 10,000 msec, 5 msec to 1,000 msec, 10 msec to 500 msec, 15 msec to 250 msec, 20 msec to 100 msec, 25 msec to 75 msec, or 50 msec.9. The method of any one of embodiments 1-8, wherein step (b)(i) further comprises measuring a response of the individual to each stimulus from the first group of stimuli.10. The method of any one of embodiments 1-9, wherein if the individual responses to at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, or at least 95% of the first group of stimuli according to the first set of directions, the program proceeds to the test phase of step (b)(ii).11. The method of any one of embodiments 1-10, wherein in step (b)(ii) if the sum of the presentation time and interval time is less than 550 msec, less than 750 msec, less than 950 msec, less than 1,050 msec, less than 1,150 msec, less than 1,350 msec, less than 1,550 msec, less than 1,750 msec, less than 1,950 msec, less than 2,150 msec, less than 2,350 msec, or less than 2,550 msec, then the individual anticipated the occurrence of the target stimulus.12. The method of any one of embodiments 1-11, wherein in step (b)(ii) if the sum of the presentation time and interval time is 550 msec or more, 750 msec or more, 950 msec or more, 1,050 msec or more, 1,150 msec or more, 1,350 msec or more, 1,550 msec or more, 1,750 msec or more, 1,950 msec or more, 2,150 msec or more, 2,350 msec or more, 2,550 msec or more, then the individual failed to anticipate the occurrence of the target stimulus.13. The method of any one of embodiments 1-12, wherein in step (b)(ii) an equal number of presentations for the target stimulus occurs after presentation of the preexposed stimulus and after presentation of the non-preexposed stimulus14. The method of any one of embodiments 1-12, wherein in step (b)(ii) an unequal number of presentations for the target stimulus occurs after presentation of the preexposed stimulus relative to after presentation of the non-preexposed stimulus15. The method of embodiment 14, wherein the unequal number of presentations for the target stimulus occurring after presentation of the preexposed stimulus is ±10%, +20%, +30%, +40%, +50% the number of presentations for the target stimulus occurring after presentation of the non-preexposed stimulus.16. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining one or more reaction times.17. The method of embodiment 16, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second average time by the first average time.18. The method of embodiment 16, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first average time by the second average time.19. The method of embodiment 16, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target prediction response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first average time is slower or faster than the second average time.20. The method of embodiment 16, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: pairing each target anticipatory response time based on the non-preexposed stimulus with a target anticipatory response time based on the preexposed stimulus; calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; calculating the latent inhibition score by determining (i) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (ii) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (iii) both (i) and (ii).21. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining a number of anticipatory responses.22. The method of embodiment 21, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second average number of anticipatory responses by the first average number of anticipatory responses.23. The method of embodiment 21, wherein measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first average number of anticipatory responses by the second average number of anticipatory responses.24. The method of embodiment 21, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first average number of anticipatory responses is lower or higher than the second average number of anticipatory responses.25. The method of embodiment 21, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: pairing each target anticipatory response based on the non-preexposed stimulus with a target anticipatory response based on the preexposed stimulus; calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; calculating the latent inhibition score by determining (i) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (ii) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (iii) both (i) and (ii).26. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining a percentage of anticipatory responses.27. The method of embodiment 26, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second percent of anticipatory responses by the first percent of anticipatory responses.28. The method of embodiment 26, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first percent of anticipatory responses by the second percent of anticipatory responses.29. The method of embodiment 26, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first percent of anticipatory responses is lower or higher than the second percent of anticipatory responses.30. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining an accuracy-sensitivity d′ score.31. The method of embodiment 30, wherein the first d′ score and the second d′ score are calculated by: calculating a first d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second d′ score of anticipatory responses by the first d′ score of anticipatory responses.32. The method of embodiment 30, wherein the first d′ score and the second d′ score are calculated by: calculating a hit rate by dividing the totaling the number of correctly identified back targets by the total number of back targets; calculating a false alarm rate, by dividing the number of responses for stimuli erroneously identified as back targets by the total number of back targets; and applying a z-transformation to the hit rate and the false alarm rate and subtracting the resulting transformed false alarm rate from the resulting transformed hit rate to obtain the d′ score.33. The method of any one of embodiments 1-32, wherein in step (c) the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises comparing the latent inhibition score to a reference score comprising a standard range of latent inhibition scores.34. The method of embodiment 33, wherein the reference score is based on values obtained from normal individuals, values obtained from different types of patients, and/or values obtained from the same individual on one or more prior testings.35. The method of embodiment 33 or 34, wherein the standard range latent inhibition scores is based on 20 or more, 30 or more, 40 or more, 50 or more, 60 or more, 70 or more, 80 or more, 90 or more, or 100 or more healthy individuals.36. The method of any one of embodiments 33-35, wherein when a latent inhibition score is above the reference score, the latent inhibition score is indicative of an enhanced latent inhibition response; when a latent inhibition score is within the standard range latent inhibition scores of the reference score, the latent inhibition score is indicative of a normal latent inhibition response; and when a latent inhibition score is below the reference score, the latent inhibition score is indicative of an attenuated latent inhibition response.37. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted not to be currently at an ultra-high risk for the psychotic disorder; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder and is likely to have a treatment resistant form of the disorder.38. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering a first episode of the psychotic disorder;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted not to be suffering a first episode of the psychotic disorder; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering a first episode of the psychotic disorder and is likely to have a treatment resistant form of the disorder.39. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering from the psychotic disorder;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted not to be suffering from the psychotic disorder; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering from the psychotic disorder.40. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, the individual is predicted to not be suffering from a treatment-resistant form of the psychotic disorder.41. The method of any one of embodiments 1-36, further comprising evaluating working memory.42. The method of embodiment 41, wherein working memory is evaluated in the pre-exposure phase by providing instructions which require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown one position back in a sequence of the first group of stimuli.43. The method of embodiment 41, wherein working memory is evaluated in the pre-exposure phase by providing instructions which require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown two positions back in a sequence of the first group of stimuli.44. The method of any one of embodiments 41-43, wherein assignment is based on whether the latent inhibition score of the individual is indicative of an attenuated latent inhibition response, a normal latent inhibition response, or an enhanced latent inhibition response and whether the individual exhibits a deficit in working memory or not.45. The method of any one of embodiments 41-44, wherein working memory is calculated by: counting the number of pre-exposure responses presented based on the presentation back stimulus; counting the number of pre-exposure responses selected correctly by the individual based on the presentation back stimulus; and calculating the percent of pre-exposure responses selected correctly by the individual, wherein 50% or more is indicative of a working memory.46. The method of any one of embodiments 41-44, wherein working memory is calculated by: counting the number of pre-exposure responses selected incorrectly by the individual based on the presentation back stimulus; and calculating the percent of pre-exposure responses selected incorrectly by the individual, wherein 50% or more is indicative of impaired working memory.47. The method of any one of embodiments 41-44, wherein working memory is calculated by: calculating the average reaction time of pre-exposure responses selected incorrectly by the individual;48. The method of any one of embodiments 41-44, wherein working memory is calculated by: calculating a d′ score of pre-exposure responses presented based on the presentation of back stimulus.49. The method of any one of embodiments 41-48, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder;b. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be currently at an ultra-high risk for the psychotic disorder;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to not be currently at an ultra-high risk for the psychotic disorder;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to not be currently at an ultra-high risk for the psychotic disorder.50. The method of any one of embodiments 41-48, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder;b. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be suffering a first episode of the psychotic disorder;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder.51. The method of any one of embodiments 41-48, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder;b. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be suffering from the psychotic disorder;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder.52. The method of any one of embodiments 41-48, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder;b. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted not to be suffering from a treatment-resistant form of the psychotic disorder;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be suffering from a treatment-resistant form of the psychotic disorder;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder.53. The method of any one of embodiments 1-52, wherein the psychotic disorder includes a schizophrenia spectrum disorder, an obsessive-compulsive disorder, an anxiety disorder, a bipolar disorder, or a dementia disease.54. A computer programmed to carry out the method of any one of embodiments 1-53.55. A computer operating the method of any one of embodiments 1-53.56. A system adapted to carry out the method of any one of embodiments 1-53.57. A storage medium on which is stored or otherwise recorded a computer programme for carrying the method of any one of embodiments 1-53. In other embodiments, a therapy recommendation method can be described as follows:1. A method of recommending a therapy to treat an individual with a psychotic disorder using a non-invasive computational device-based test, the method comprising:a. optionally entering information about the individual into a latent inhibition test program running on a computational device, the information including:i. whether this is an initial assessment or a subsequent assessment;ii. whether or not the individual is currently experiencing psychotic symptoms;iii. whether or not the individual has a history of a psychotic disorder; and/oriv. whether or not the individual has a history of resistance to anti-psychotic drug treatmentb. having the individual perform a latent inhibition assessment using the latent inhibition test program running on the computational device and a graphical user interface coupled thereto with which the individual interacts, the latent inhibition assessment comprising a pre-exposure phase and a test phase,i. wherein the pre-exposure phase includes,presenting the individual with a first set of directions for how to respond to each stimulus of a first group of stimuli, wherein the first set of directions include pre-exposure phase instructions which require the individual to respond to each stimulus of the first group of stimuli in a defined manner;presenting the individual with a random order of the first group of stimuli, each stimulus being presented for 10 msec to 10,000 msec, wherein the first group of stimuli comprises a plurality of stimuli including at least one preexposed stimulus and one or more neutral stimuli;ii. wherein the test phase includes,presenting the individual with a second set of directions for how to respond to each stimulus of a second group of stimuli, wherein the second set of directions include test phase instructions which require the individual to anticipate the occurrence of a target stimulus;presenting the individual with the second group of stimuli, each stimulus being presented for 10 msec to 10,000 msec with a 0 msec to 10,000 msec interval between each stimulus, wherein the second group of stimuli comprises a plurality of stimuli including the at least one preexposed stimuli, a non-preexposed stimulus, the target stimulus, and the one or more neutral stimuli; recording and analyzing the individual's interaction with the graphical user interface following presentation of the second group of stimuli, bymeasuring a time associated with a target anticipated response of the individual to each stimulus from the plurality of stimuli, wherein a response to the target stimulus of less than the sum of the presentation time and interval time according to the second set of directions is indicative that the individual anticipated the occurrence of the target stimulus, and wherein a response to the target stimulus of equal to or more than the sum of the presentation time and interval time according to the second set of directions is indicative that the individual failed to anticipate the occurrence of the target stimulus;c. measuring a latent inhibition response of the individual to calculate a latent inhibition score, by modeling the time associated with a target anticipated response in one or more statistical analyses that analyze one or more of a count of a number of presentations on which the response to the targeted stimulus occurred, a central tendency of the number of responses to the target stimulus, or a distance from a central tendency of the number of the responses to the target stimulus, and determining whether the individual exhibited an attenuated latent inhibition response, a normal latent inhibition response or an enhanced latent inhibition response from the latent inhibition score; andd. calculating the recommend therapy to treat an individual, the recommend therapy including either i) no therapy recommendation; or ii) treating with a pro-cognitive drug, treating with an anti-psychotic drug, treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms, or any combination thereof.2. The method of embodiment 1, wherein the information entered for (a)(iv) includes whether or not the individual is resistant to an anti-psychotic drug.3. The method of embodiment 1 or 2, wherein the pre-exposure phase instructions require the individual to respond to a stimulus of the first group of stimuli as it appears on the screen.4. The method of embodiment 1, or 2 wherein the pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown one position back in a sequence of the first group of stimuli.5. The method of embodiment 1 or 2, wherein the pre-exposure phase instructions require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a stimulus shown two positions back in a sequence of the first group of stimuli.6. The method of any one of embodiments 1-5, wherein each stimulus is presented for is 100 msec to 5,000 msec, 250 msec to 2,500 msec, 500 msec to 1,500 msec, 750 msec to 1,250 msec, or 1,000 msec7. The method of any one of embodiments 1-6, wherein step (b)(i) further comprising an interval between each stimulus.8. The method of embodiment 7, wherein interval between each stimulus is 1 msec to 10,000 msec, 5 msec to 1,000 msec, 10 msec to 500 msec, 15 msec to 250 msec, 20 msec to 100 msec, 25 msec to 75 msec, or 50 msec9. The method of any one of embodiments 1-8, wherein step (b)(i) further comprises measuring a response of the individual to each stimulus from the first group of stimuli.10. The method of any one of embodiments 1-9, wherein if the individual responses to at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, or at least 95% of the first group of stimuli according to the first set of directions, the program proceeds to the test phase of step (b)(ii).11. The method of any one of embodiments 1-10, wherein in step (b)(ii) if the sum of the presentation time and interval time is less than 550 msec, less than 750 msec, less than 950 msec, less than 1,050 msec, less than 1,150 msec, less than 1,350 msec, less than 1,550 msec, less than 1,750 msec, less than 1,950 msec, less than 2,150 msec, less than 2,350 msec, or less than 2,550 msec, then the individual anticipated the occurrence of the target stimulus.12. The method of any one of embodiments 1-11, wherein in step (b)(ii) if the sum of the presentation time and interval time is 550 msec or more, 750 msec or more, 950 msec or more, 1,050 msec or more, 1,150 msec or more, 1,350 msec or more, 1,550 msec or more, 1,750 msec or more, 1,950 msec or more, 2,150 msec or more, 2,350 msec or more, 2,550 msec or more, then the individual failed to anticipate the occurrence of the target stimulus.13. The method of any one of embodiments 1-12, wherein in step (b)(ii) an equal number of presentations for the target stimulus occurs after presentation of the preexposed stimulus and after presentation of the non-preexposed stimulus14. The method of any one of embodiments 1-13, wherein in step (b)(ii) an unequal number of presentations for the target stimulus occurs after presentation of the preexposed stimulus relative to after presentation of the non-preexposed stimulus15. The method of embodiment 14, wherein the unequal number of presentations for the target stimulus occurring after presentation of the preexposed stimulus is ±10%, +20%, +30%, +40%, +50% the number of presentations for the target stimulus occurring after presentation of the non-preexposed stimulus.16. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining one or more reaction times.17. The method of embodiment 16, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second average time by the first average time.18. The method of embodiment 16, wherein measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first average time by the second average time.19. The method of embodiment 16, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average time based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average time based on each target prediction response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first average time is slower or faster than the second average time.20. The method of embodiment 16, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: pairing each target anticipatory response time based on the non-preexposed stimulus with a target anticipatory response time based on the preexposed stimulus; calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; calculating the latent inhibition score by determining (i) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (ii) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (iii) both (i) and (ii).21. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining a number of anticipatory responses.22. The method of embodiment 21, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second average number of anticipatory responses by the first average number of anticipatory responses.23. The method of embodiment 21, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first average number of anticipatory responses by the second average number of anticipatory responses.24. The method of embodiment 21, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second average number of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first average number of anticipatory responses is lower or higher than the second average number of anticipatory responses.25. The method of embodiment 21, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: pairing each target anticipatory response based on the non-preexposed stimulus with a target anticipatory response based on the preexposed stimulus; calculating whether a paired target anticipatory response time based on the non-preexposed stimulus was faster relative to its paired target anticipatory response time based on the preexposed stimulus; calculating the latent inhibition score by determining (i) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were higher relative to their paired target anticipatory response time based on the preexposed stimulus, (ii) the total number of paired target anticipatory response times based on the non-preexposed stimulus that were lower relative to their paired target anticipatory response time based on the preexposed stimulus, or (iii) both (i) and (ii).26. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining a percentage of anticipatory responses.27. The method of embodiment 26, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second percent of anticipatory responses by the first percent of anticipatory responses.28. The method of embodiment 26, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the first percent of anticipatory responses by the second percent of anticipatory responses.29. The method of embodiment 26, wherein the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises: calculating a first percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second percent of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by determining whether the first percent of anticipatory responses is lower or higher than the second percent of anticipatory responses.30. The method of any one of embodiments 1-15, wherein in step (c) the latent inhibition score is calculated by determining an accuracy-sensitivity d′ score.31. The method of embodiment 30, wherein the first d′ score and the second d′ score are calculated by: calculating a first d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the non-preexposed stimulus; calculating a second d′ score of anticipatory responses based on each target anticipated response measured when the target stimulus was presented after presentation of the preexposed stimulus; and calculating the latent inhibition score by subtracting the second d′ score of anticipatory responses by the first d′ score of anticipatory responses.32. The method of embodiment 30, wherein the first d′ score and the second d′ score are calculated by: calculating a hit rate by dividing the totaling the number of correctly identified back targets by the total number of back targets; calculating a false alarm rate, by dividing the number of responses for stimuli erroneously identified as back targets by the total number of back targets; and applying a z-transformation to the hit rate and the false alarm rate and subtracting the resulting transformed false alarm rate from the resulting transformed hit rate to obtain the d′ score.33. The method of any one of embodiments 1-32, wherein in step (c) the measuring a latent inhibition response of the individual to calculate a latent inhibition score further comprises comparing the latent inhibition score to a reference score comprising a standard range of latent inhibition scores.34. The method of embodiment 33, wherein the reference score is based on values obtained from normal individuals, values obtained from different types of patients, and/or values obtained from the same individual on one or more prior testings.35. The method of embodiment 33 or 34, wherein the standard range latent inhibition scores is based on 20 or more, 30 or more, 40 or more, 50 or more, 60 or more, 70 or more, 80 or more, 90 or more, or 100 or more healthy individuals.36. The method of any one of embodiments 33-35, wherein when a latent inhibition score is above the reference score, the latent inhibition score is indicative of an enhanced latent inhibition response; when a latent inhibition score is within the standard range latent inhibition scores of the reference score, the latent inhibition score is indicative of a normal latent inhibition response; and when a latent inhibition score is below the reference score, the latent inhibition score is indicative of an attenuated latent inhibition response.37. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted not to be currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug.38. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted not to be suffering a first episode of the psychotic disorder and a therapy recommendation includes maintaining a current treatment; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug.39. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted not to be suffering from the psychotic disorder and a therapy recommendation includes maintaining a current treatment; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, the individual is predicted to be suffering from the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug as an add on therapy to current treatment.40. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug;b. when a normal latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, the individual is predicted not to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes maintaining a current treatment; orc. when an enhanced latent inhibition response is calculated in step (c) and the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug.41. The method of any one of embodiments 1-36, wherein in step (d):a. when an attenuated latent inhibition response calculated in step (c) and the information in step (a) indicates that this was a subsequent assessment, a therapy recommendation includes increasing the drug dose of a current treatment;b. when a normal latent inhibition response calculated in step (c) and the information in step (a) indicates that this was a subsequent assessment, a therapy recommendation includes maintaining a current treatment and dose; orc. when an enhanced latent inhibition response calculated in step (c) and the information in step (a) indicates that this was a subsequent assessment, a therapy recommendation includes decreasing the drug dose of a current treatment.42. The method of any one of embodiments 1-36, further comprising evaluating working memory.43. The method of embodiment 42, wherein working memory is evaluated in the pre-exposure phase by providing instructions which require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a back stimulus shown one position back in a sequence of the first group of stimuli.44. The method of embodiment 42, wherein working memory is evaluated in the pre-exposure phase by providing instructions which require the individual to respond to a current stimulus of the first group of stimuli only if the current stimulus is the same as a back stimulus shown two positions back in a sequence of the first group of stimuli.45. The method of any one of embodiments 42-44, wherein assignment is based on whether the latent inhibition score of the individual is indicative of an attenuated latent inhibition response, a normal latent inhibition response, or an enhanced latent inhibition response and whether the individual exhibits a deficit in working memory or not.46. The method of any one of embodiments 42-45, wherein working memory is calculated by: counting the number of pre-exposure responses presented based on the presentation back stimulus; counting the number of pre-exposure responses selected correctly by the individual based on the presentation back stimulus; and calculating the percent of pre-exposure responses selected correctly by the individual, wherein 50% or more is indicative of a working memory.47. The method of any one of embodiments 42-45, wherein working memory is calculated by: counting the number of pre-exposure responses selected incorrectly by the individual based on the presentation back stimulus; and calculating the percent of pre-exposure responses selected incorrectly by the individual, wherein 50% or more is indicative of impaired working memory.48. The method of any one of embodiments 42-45, wherein working memory is calculated by: calculating the average reaction time of pre-exposure responses selected incorrectly by the individual.49. The method of any one of embodiments 42-45, wherein working memory is calculated by: calculating a d′ score of pre-exposure responses presented based on the presentation of back stimulus.50. The method of any one of embodiments 42-49, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic and a pro-cognitive drug;b. when an attenuated latent inhibition response is calculated in step (c) and the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to not be currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be currently at an ultra-high risk for the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is not currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to not be currently at an ultra-high risk for the psychotic disorder and no therapy recommendation is provided.51. The method of any one of embodiments 42-49, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug;b. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder and a therapy recommendation includes maintaining a current treatment and a further treating with a pro-cognitive drug;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be suffering a first episode of the psychotic disorder and a therapy recommendation includes maintaining a current treatment;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that this is an initial assessment, the individual is currently experiencing psychotic symptoms, the individual has no history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering a first episode of the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug.52. The method of any one of embodiments 42-49, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug;b. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug in addition to maintaining a current treatment;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be suffering from the psychotic disorder and a therapy recommendation includes maintaining a current treatment;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual has a history of a psychotic disorder, and the individual has no history of resistant to anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from the psychotic disorder and a therapy recommendation includes treating with a pro-cognitive drug.53. The method of any one of embodiments 42-49, wherein in step (d):a. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug and a pro-cognitive drug;b. when an attenuated latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes treating with an anti-psychotic drug;c. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted not to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes maintaining a current treatment and further treating with a pro-cognitive drug;d. when a normal latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted not to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes maintaining a current treatment;e. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug; orf. when an enhanced latent inhibition response is calculated in step (c), the information in step (a) indicates that the individual is currently experiencing psychotic symptoms, the individual has a history of a psychotic disorder, and the individual has a history of resistant to an anti-psychotic drug treatment, and there is not a deficit in working memory, the individual is predicted to be suffering from a treatment-resistant form of the psychotic disorder and a therapy recommendation includes treating with clozapine or an alternative drug for treatment-resistant psychotic symptoms and a pro-cognitive drug.54. The method of any one of embodiments 1-53, wherein the psychotic disorder includes a schizophrenia spectrum disorder, an obsessive-compulsive disorder, an anxiety disorder, a bipolar disorder, or a dementia disease.55. The method of any one of embodiments 1-54, wherein the pro-cognitive drug is an agonist, antagonist, partial agonist, positive allosteric modulator, negative allosteric modulator, silent allosteric modulator, or inverse agonist of an ionotropphic receptor.56. The method of embodiment 55, wherein the ionotropphic receptor is a Nicotinic Acetylcholine (nAch) receptor, an ionotropphic Gamma-Aminobutyric Acid (GABA) receptor, an ionotropphic Glutamine (Glu) receptor, or an ionotropphic Serotonin (5-HT) receptor.57. The method of embodiment 56, wherein the nAch receptor is α4β2 nAch receptor, αβ4 nAch receptor, α7 nAch receptor.58. The method of embodiment 56, wherein the ionotropphic GABA receptor is a GABAAreceptor or a GABAA-Preceptor.59. The method of embodiment 56, wherein the ionotropphic Glutamine receptor is an N-methyl-D-aspartate receptor, a Kainate receptor, or an α-amino-3-hydroxy-5-methyl-4-isoxazolepropionic acid receptor.60. The method of embodiment 56, wherein the ionotropphic 5-HT receptor is a 5-HT3receptor.61. The method of any one of embodiments 1-54, wherein the pro-cognitive drug is an agonist, antagonist, partial agonist, positive allosteric modulator, negative allosteric modulator, silent allosteric modulator, or inverse agonist of an metabotrophic receptor.62. The method of embodiment 61, wherein the metabotrophic receptor is a Muscarinic Acetylcholine (mAch) receptor, a Cannabinoid (CB) receptor, a Dopamine (DA) receptor, an Endorphin receptor, a metabotrophic Gamma-Aminobutyric Acid (GABA) receptor, a metabotrophic Glutamine (Glu) receptor, a Norepinephrine (NE) receptor, an Oxytocin receptor, a metabotrophic Serotonin (5-HT) receptor.63. The method of embodiment 62, wherein the mAch receptor is a M1mAch receptor, M2mAch receptor, M3mAch receptor, M4mAch receptor, or M5mAch receptor.64. The method of embodiment 62, wherein the CB receptor is a CB1 receptor or CB2 receptor.65. The method of embodiment 62, wherein the DA receptor is a DA1receptor, a DA2receptor, a DA3receptor, a DA4receptor, or a DA5receptor and heterodimers thereof.66. The method of embodiment 62, wherein the Endorphin receptor is a μ1Opioid receptor, a μ2Opioid receptor, or a μ3Opioid receptor.67. The method of embodiment 62, wherein the metabotrophic GABA receptor is a GABABreceptor.68. The method of embodiment 62, wherein the metabotrophic Glu receptor is a Glu receptor1, Glu receptor2, Glu receptor3, Glu receptor4, Glu receptor5, Glu receptor6, Glu receptor7, or Glu receptor8.69. The method of embodiment 62, wherein the NE receptor is an α1Adrenergic receptor, an α2Adrenergic receptor, a β1Adrenergic receptor, a β2Adrenergic receptor, or a β3Adrenergic receptor.70. The method of embodiment 62, wherein the metabotrophic 5-HT receptor is a 5-HT1receptor, a 5-HT2receptor, a 5-HT4receptor, a 5-HT5receptor, a 5-HT6receptor, or a 5-HT7receptor.71. The method of any one of embodiments 1-54, wherein the pro-cognitive drug is an agonist, antagonist, partial agonist, positive allosteric modulator, negative allosteric modulator, silent allosteric modulator, or inverse agonist of a phosphodiesterase (PDE).72. The method of embodiment 71, wherein the PDE is a PDE1, a PDE2, a PDE3, a PDE4, a PDE5, a PDE6, a PDE7, a PDE8, a PDE9, or a PDE10.73. The method of any one of embodiments 1-72, wherein the anti-psychotic drug is a dopamine antagonist, a serotonin-dopamine antagonist or a partial dopamine agonist.74. The method of embodiment 73, wherein the dopamine antagonist includes Chlorpromazine, Haloperidol, Loxapine, Perphenazine, Prochlorperazine, Thiothixene, Thioridazine, and Trifluoperazine.75. The method of embodiment 74, wherein the serotonin-dopamine antagonist includes Olanzapine, Paliperidone, Quetiapine, and Risperidone.76. The method of embodiment 74, wherein the partial dopamine agonist includes Aripiprazole.77. A computer programmed to carry out the method of any one of embodiments 1-76.78. A computer operating the method of any one of embodiments 1-76.79. A system adapted to carry out the method of any one of embodiments 1-76.80. A storage medium on which is stored or otherwise recorded a computer programme for carrying the method of any one of embodiments 1-76. EXAMPLES The following non-limiting examples are provided for illustrative purposes only in order to facilitate a more complete understanding of representative embodiments now contemplated. These examples should not be construed to limit any of the embodiments described in the present specification, including those pertaining to the methods and uses disclosed herein. Example 1 Pre-Exposure Phase Instructions This example provides exemplary pre-exposure phase instructions given to an individual during a first set of directions for how to respond to each stimulus of a first group of stimuli during a pre-exposure phase disclosed herein. 0-Back Pre-Exposure Phase Instructions. In this task you will see a sequence of letters appearing on the screen. Your task is to say each of the letters out loud as you see them appear. When this task ends, you will be given a new set of instructions. Press the button on screen when you are ready to begin. 1-Back Pre-Exposure Phase Instructions. In this task you will see a sequence of letters appearing on the screen. Your task is to press the response button at the bottom of the screen each time the current letter is the same as the one presented just before. Otherwise, do not respond. When this task ends, you will be given a new set of instructions. Press the button on screen when you are ready to begin. 2-Back Pre-Exposure Phase Instructions. In this task you will see a sequence of letters appearing on the screen. Your task is to press the response button at the bottom of the screen each time the current letter is the same as the one that was presented before last, that is 2 positions back in the sequence. Otherwise, do not respond. When this task ends, you will be given a new set of instructions. Press the button on screen when you are ready to begin. Example 2 Test Phase Instructions This example provides exemplary test phase instructions given to an individual during a second set of directions for how to respond to each stimulus of a second group of stimuli during a pre-exposure phase disclosed herein. Test Phase Instructions. In this task you will see a sequence of letters appearing on the screen. Your task is to try and predict when a letter ‘X’ is going to appear. If you think you know when the ‘X’ will appear then you can press the response button early in the sequence, that is before the ‘X’ appears on screen. Alternatively, if you are unable to do this please press the response button as quickly as possible when you see the letter ‘X.’ There may be more than one rule that predicts the ‘X.’ Please try to be as accurate as you can, but do not worry about making the occasional error. If you understand your task and are ready to begin, please press the button on screen. Example 3 Latent Inhibition Task Assay as a Participant Selection/Screening Tool for Individuals Classified as Ultra-High Risk (UHR)/at Risk Mental State (ARMS) for Psychosis Approximately 30% of individuals classified as ultra-high risk (UHR) for psychosis develop the illness within two years and whilst there are a range of pharmacological and psychosocial interventions available for psychosis, there is great individual variation in clinical response for UHR individuals and no way to determine who may convert to a full-blown psychotic episode. There is need for a biomarker that can better identify individuals at high risk for conversion to psychosis. Latent inhibition has been extensively examined as a model for the different symptoms of psychotic disorders and demonstrates that an attenuation on the test is associated with higher levels of dopamine and psychotic states, whereas an enhancement on the test is associated with low levels of glutamate/acetylcholine and negative and cognitive states. Latent inhibition is used as a cognitive biomarker to prospectively stratify patients and identify those at an increased risk for transition to psychosis and as such will be most likely to respond to particular treatments aimed at improving symptoms or delaying/preventing psychosis onset.(i) Latent inhibition attenuation: Indicative of high-transition risk with potentially increased likelihood in responsiveness to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists as latent inhibition score indicates there is a convergence/emergence of psychosis and a hyper-dopaminergic dysfunction underlay the symptoms of psychosis. Recommend treating with a dopaminergic-based anti-psychotic drug.(ii) Latent inhibition enhancement: Indicative of high-transition risk with potentially increased likelihood of being non-responsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates cognitive/negative symptoms and a non-dopaminergic dysfunction underlay symptoms of psychosis. Recommend treating with a pro-cognitive drug therapy due to increased likelihood of treatment resistance to dopaminergic-based anti-psychotic drug treatments if individual converts to psychosis, but likely to respond to non-dopaminergic-based drug treatments.(iii) Latent inhibition within normal range: Indicative of low-transition risk to psychosis and diagnosis as UHR appears to be unwarranted. No drug treatment is recommended. Example 4 Working Memory Latent Inhibition Assay as a Participant Selection/Screening Tool for Individuals Classified as Ultra-High Risk (UHR)/at Risk Mental State (ARMS) for Psychosis Same use case as above with the addition of working memory assessment during the pre-exposure phase of the latent inhibition task. An assessment of working memory has the additional benefit of being able to determine whether an individual is experiencing a deficit to their working memory in addition to demonstrating a dysfunction of attentional gating though latent inhibition. Individuals that flag up as having a deficit in both latent inhibition and working memory will increase confidence and provide additional information regarding the optimal diagnosis and/or treatment for a patient to receive.(i) Attenuated latent inhibition and working memory deficit: Indicative of high-transition risk with potentially increased likelihood in responsiveness to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists, latent inhibition score indicates there is a convergence/emergence of psychosis, a hyper-dopaminergic dysfunction underlay the symptoms of psychosis. Additional finding of working memory deficit confirms cognitive deficit that could start to affect functional outcome if untreated. Recommend treating with a dopaminergic-based anti-psychotic drug and a pro-cognitive drug.(ii) Enhanced latent inhibition and working memory deficit: Indicative of high-transition risk with potentially increased likelihood of being non-responsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates cognitive/negative symptoms and a non-dopaminergic dysfunction underlay symptoms of psychosis and cognitive impairment. Additional finding of working memory deficit confirms cognitive deficit that could start to affect functional outcome if untreated. Recommend treating with a pro-cognitive drug therapy due to a working memory deficit and likely responsiveness to non-dopaminergic-based drug treatments and increased likelihood of resistance to dopaminergic-based anti-psychotic drug treatments in order to as prevent further cognitive decline and emergence of psychosis.(iii) In cases where latent inhibition is either attenuated, enhanced or normal but working memory shows no deficit, individuals should be monitored instead of immediately treated with a drug therapy. A treatment recommendation can be made based on the range of normality on the non-deficit task. Example 5 Latent Inhibition Assay for First-Episode Psychosis (FEP) and Prediction of Antipsychotic Treatment-Response These patients have experienced their first psychotic episode and are antipsychotic-naïve or have minimum exposure to antipsychotic treatment (or alternative therapy). These patients are generally classified as FEP within the first three years from illness onset and up to a third of patients do not respond effectively to currently available anti-psychotic drug treatments or other psychosocial therapies which may be because they have an alternative, non-dopaminergic, neurobiology underlying their psychotic state. Similar to the UHR population, latent inhibition will be used as a cognitive biomarker to prospectively stratify patients and identify those most likely to respond to anti-psychotic medication (or alternative therapy) aimed at ameliorating or improving currently experienced clinical symptoms.(i) Attenuated latent inhibition: Indicative of an individual with increased likelihood of being responsive to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists, because latent inhibition score indicates there is a hyper-dopaminergic dysfunction underlay the symptoms of psychosis. Recommend treating with a dopaminergic-based anti-psychotic drug.(ii) Enhanced latent inhibition: Indicative of an individual with increased likelihood of being non-responsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates cognitive/negative symptoms, a non-dopaminergic dysfunction underlay symptoms of psychosis and cognitive impairment. Recommend fast-track implementation of clozapine treatment or an alternative drug for treatment-resistant psychotic symptoms with a pro-cognitive drug therapy due to increased likelihood of resistance to dopaminergic-based anti-psychotic drug treatments.(iii) Normal latent inhibition: Indicative of management of positive symptoms of psychosis in individual and cognitive/negative symptoms that are minimal. Recommend maintenance of current treatment regime with monitoring. Example 6 Working Memory Latent Inhibition Assay for First-Episode Psychosis (FEP) and Prediction of Antipsychotic Treatment-Response Same use case as above with the addition of working memory assessment during the pre-exposure phase of the latent inhibition task (Working Memory Latent Inhibition; WMLI). An assessment of working memory has the additional benefit of being able to determine whether an individual is experiencing a deficit to their working memory in addition to demonstrating a dysfunction of attentional gating though latent inhibition. Individuals that flag up as having a deficit in both latent inhibition and working memory will increase confidence and provide additional information regarding the optimal diagnosis and/or treatment for a patient to receive.(i) Attenuated latent inhibition and working memory deficit: Indicative of an individual with increased likelihood of being responsive to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists, because latent inhibition score indicates there is a hyper-dopaminergic dysfunction underlay of the symptoms of psychosis. Additional finding of working memory deficit confirms cognitive deficit that could start to affect functional outcome if untreated. Recommend treating with a dopaminergic-based anti-psychotic drug and a pro-cognitive drug.(ii) Enhanced latent inhibition and working memory deficit: Indicative of an individual with increased likelihood of being non-responsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates cognitive/negative symptoms, a non-dopaminergic dysfunction underlay symptoms of psychosis and cognitive impairment. Additional finding of working memory deficit confirms cognitive deficit that could start to affect functional outcome if untreated. Recommend fast-track implementation of clozapine treatment or an alternative drug for treatment-resistant psychotic symptoms with a pro-cognitive drug therapy due to a working memory deficit and likely responsiveness to non-dopaminergic-based drug treatments and increased likelihood of resistance to dopaminergic-based anti-psychotic drug treatments.(iii) Normal latent inhibition and working memory deficit: Indicative of management of positive symptoms of psychosis in individual but working memory deficit indicates cognitive impairment. Recommend maintenance of current treatment regime for psychosis with additional pro-cognitive drug therapy due to a working memory deficit to minimize impairment to functional outcome and day-to-day life.(iv) In other cases where only latent inhibition or working memory are abnormal treatment recommendation for an individual is made based on the range of normality on the non-deficit task. Example 7 Latent Inhibition Assay to Direct Treatment of Chronic Treatment Responsive Schizophrenia These are patients that show good response to antipsychotic treatment, with illness duration approximately over 3 years. Patients with good response have mild or no psychotic symptoms. However, they can exhibit high negative symptoms and severe cognitive dysfunction, that, if sustained over long periods of time, increases their risk of relapse and impairs functional outcome and day-to-day life. These cognitive and negative symptoms can be very heterogeneous amongst patients. Latent inhibition will be used as a cognitive biomarker to determine whether psychotic symptoms are under control and to identify those patients that are experiencing sufficient cognitive deficit that would warrant treatment. Latent inhibition scores will be used to determine which treatments patients will be most likely to respond to.(i) Attenuated latent inhibition: Indicative of an individual with increased likelihood of being responsive to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists, because latent inhibition score indicates a hyper-dopaminergic dysfunction underlay the symptoms of psychosis. Recommend treating with a dopaminergic-based anti-psychotic drug and pro-cognitive drug to control cognitive symptoms. Monitor for non-adherence and consider dosage of anti-psychotic drug as attenuation not expected in this group if psychosis is seemingly stable.(ii) Enhanced latent inhibition: Indicative of an individual being somewhat responsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates management of positive symptoms but cognitive/negative symptoms are prominent. Recommend continued treatment a dopaminergic-based anti-psychotic drug with additional pro-cognitive drug to control cognitive symptoms.(iii) Normal latent inhibition: Indicative of management of positive symptoms of psychosis in individual and cognitive/negative symptoms that are minimal. Recommend maintenance of current treatment regime with monitoring. Example 8 Working Memory Latent Inhibition Assay to Direct Treatment of Chronic Treatment Responsive Schizophrenia Same use case as above with the addition of working memory assessment during the pre-exposure phase of the latent inhibition task (Working Memory Latent Inhibition; WMLI). An assessment of working memory has the additional benefit of being able to determine whether an individual is experiencing a deficit to their working memory in addition to demonstrating a dysfunction of attentional gating though latent inhibition. Individuals that flag up as having a deficit in both latent inhibition and working memory will increase confidence and provide additional information regarding the optimal diagnosis and/or treatment for a patient to receive.(i) Attenuated latent inhibition and working memory deficit: Indicative of an individual with increased likelihood of being responsive to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists, because latent inhibition score indicates a hyper-dopaminergic dysfunction underlay the symptoms of psychosis. Additional finding of working memory deficit confirms presence of a cognitive deficit that could start to affect functional outcome if untreated. Recommend treating with a dopaminergic-based anti-psychotic drug and a pro-cognitive drug to control cognitive symptoms. Monitor for non-adherence and consider dosage of anti-psychotic drug as attenuation not expected in this group if psychosis is seemingly stable.(ii) Enhanced latent inhibition and working memory deficit: Indicative of an individual being somewhat responsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates management of positive symptoms but cognitive/negative symptoms are prominent. Additional finding of working memory deficit confirms presence of a cognitive deficit that could start to affect functional outcome if untreated. Recommend treating with a dopaminergic-based anti-psychotic drug with additional pro-cognitive drug to control negative/cognitive symptoms.(iii) Normal latent inhibition and working memory deficit: Indicative of management of positive symptoms of psychosis in individual but working memory deficit confirms cognitive impairment. Recommend maintenance of current treatment regime for psychosis with additional pro-cognitive drug therapy due to a working memory deficit to minimize impairment to functional outcome and day-to-day life.(iv) In other cases where only latent inhibition or working memory are abnormal treatment recommendation for an individual is made based on the range of normality on the non-deficit task. Example 9 Latent Inhibition Assay for Chronic Treatment-Resistant Schizophrenia (TRS) One-third of schizophrenia patients do not respond to anti-psychotic drugs. The longer patients are left without treatment during a psychotic episode, the less responsive they continue to become to treatment and are thus more difficult to treat. TRS patients have a different neurobiological profile: rather than being hyper-dopaminergic, they have normal dopaminergic levels but may have low levels of glutamate/acetylcholine. Currently, the only effective drug for patients who are treatment resistant to APD's is clozapine but this drug does have some unpleasant side effects and so more tolerable drugs for patients are desirable (and are in development). Attenuated latent inhibition is a predictor of hyper-dopaminergic activity, whereas enhanced latent inhibition is a predictor of normo-dopaminergic/glutamatergic activity and as such latent inhibition can be used to diagnose/identify and subsequently treat TRS vs non-TRS patients. Latent inhibition can be used as way to pre-select patients, and thus effectively treat those, who flag us as being phenotypically treatment resistant.(i) Attenuated latent inhibition: Indicative of an individual somewhat non-responsive (i.e., treatment resistance) to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists, because latent inhibition score indicates anti-psychotic drug treatment-resistance due to non-biological underpinnings (e.g. medication non-compliance, recreational drug abuse, other substance abuse). Recommend treating with a dopaminergic-based anti-psychotic drug with additional pro-cognitive drug to control cognitive symptoms and enhance treatment efficacy. Monitor for non-adherence and consider dosage modification of anti-psychotic drug as attenuation not expected in this group if psychosis is seemingly stable.(ii) Enhanced latent inhibition: Indicative of an individual being unresponsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates cognitive/negative symptoms and a non-dopaminergic dysfunction underlay symptoms of psychosis and cognitive impairment. Recommend fast-track implementation of clozapine treatment or an alternative drug for treatment-resistant psychotic symptoms with a pro-cognitive drug therapy and likely responsiveness to non-dopaminergic-based drug treatments and increased likelihood of resistance to dopaminergic-based anti-psychotic drug treatments.(iii) Normal latent inhibition: Indicative of management of positive symptoms of psychosis in individual and cognitive/negative symptoms that are minimal. Recommend maintenance of current treatment regime with monitoring. If range of normality is extreme, consider clozapine or an alternative drug for treatment-resistant psychotic symptoms and pro-cognitive drug for symptom reduction. Example 10 Working Memory Latent Inhibition Assay for Chronic Treatment-Resistant Schizophrenia (TRS) Same use case as above with the addition of working memory assessment during the pre-exposure phase of the latent inhibition task (Working Memory Latent Inhibition; WMLI). An assessment of working memory has the additional benefit of being able to determine whether an individual is experiencing a deficit to their working memory in addition to demonstrating a dysfunction of attentional gating though latent inhibition. Individuals that flag up as having a deficit in both latent inhibition and working memory will increase confidence and provide additional information regarding the optimal diagnosis and/or treatment for a patient to receive.(i) Attenuated latent inhibition and working memory deficit: Indicative of an individual somewhat non-responsive (i.e., treatment resistant) to dopaminergic-based anti-psychotic drug treatments, e.g., dopamine antagonists, because latent inhibition score indicates anti-psychotic drug treatment-resistance due to non-biological underpinnings (e.g. medication non-compliance, recreational drug abuse, other substance abuse). Additional finding of working memory deficit confirms cognitive deficit that could start to affect functional outcome if untreated. Recommend treating with a dopaminergic-based anti-psychotic drug with additional pro-cognitive drug to ameliorate cognitive symptoms and enhance treatment efficacy. Monitor for non-adherence and consider dosage modification of anti-psychotic drug as attenuation not expected in this group if psychosis is seemingly stable.(ii) Enhanced latent inhibition and working memory deficit: Indicative of an individual being unresponsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates cognitive/negative symptoms and a non-dopaminergic dysfunction underlay symptoms of psychosis and cognitive impairment. Additional finding of working memory deficit confirms cognitive deficit that could start to affect functional outcome if untreated. Recommend fast-track implementation of clozapine treatment or an alternative drug for treatment-resistant psychotic symptoms with additional pro-cognitive drug therapy to ameliorate cognitive and negative symptoms and enhance efficacy of clozapine treatment or an alternative drug for treatment-resistant psychotic symptoms.(iii) Normal latent inhibition and working memory deficit: Indicative of management of positive symptoms of psychosis in individual but working memory deficit indicates cognitive impairment. Recommend maintenance of current treatment regime for psychosis with additional pro-cognitive drug therapy due to a working memory deficit to minimize impairment to functional outcome and day-to-day life.(iv) In other cases where only latent inhibition or working memory are abnormal, treatment recommendation for an individual is made based on the range of normality on the non-deficit task. Example 11 Latent Inhibition Assay in APD Antipsychotic Drug Action Antipsychotic trials currently rely on the Positive and Negative Syndrome Scale (PANSS) assessment as a primary outcome outcome and/or subjective way to determine the efficacy of a drug for improving symptomatology. Assessment of latent inhibition will be used as an objective way to measure responsiveness to treatment.(i) Attenuated latent inhibition: Indicative of an individual who is experiencing psychosis with an increased likelihood of being responsive to dopaminergic-based anti-psychotic drug treatments. If attenuation of latent inhibition remains through the course of an anti-psychotic trial then the compound in question may be deemed ineffective for remediating psychosis or the dosage may need increasing.(ii) Enhanced latent inhibition: Indicative of an individual who has responded to the APD if latent inhibition was previously attenuated and the dose of the APD may require decreasing to attain normal latent inhibition. If latent inhibition was enhanced from the start of the trial, then this is indicative of an individual with an increased likelihood of being unresponsive to dopaminergic-based anti-psychotic drug treatments because latent inhibition score indicates a non-dopaminergic dysfunction underlay symptoms of psychosis and cognitive impairment. In this instance this patient would be deemed a non-responder to the compound in question.(iii) Normal latent inhibition: Indicative of management of positive symptoms of psychosis in individual and cognitive/negative symptoms that are minimal. If this score was previously an attenuated or enhanced latent inhibition, the compound may be considered effective.(iv) No change in latent inhibition score from initial assessment mat be considered as a non-response to the treatment. In closing, it is to be understood that although aspects of the present specification are highlighted by referring to specific embodiments, one skilled in the art will readily appreciate that these disclosed embodiments are only illustrative of the principles of the subject matter disclosed herein. Therefore, it should be understood that the disclosed subject matter is in no way limited to a particular compound, composition, article, apparatus, methodology, protocol, and/or reagent, etc., described herein, unless expressly stated as such. In addition, those of ordinary skill in the art will recognize that certain changes, modifications, permutations, alterations, additions, subtractions and sub-combinations thereof can be made in accordance with the teachings herein without departing from the spirit of the present specification. It is therefore intended that the following appended embodiments and embodiments hereafter introduced are interpreted to include all such changes, modifications, permutations, alterations, additions, subtractions and sub-combinations as are within their true spirit and scope. Certain embodiments of the present invention are described herein, including the best mode known to the inventors for carrying out the invention. Of course, variations on these described embodiments will become apparent to those of ordinary skill in the art upon reading the foregoing description. The inventor expects skilled artisans to employ such variations as appropriate, and the inventors intend for the present invention to be practiced otherwise than specifically described herein. Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the embodiments appended hereto as permitted by applicable law. Moreover, any combination of the above-described embodiments in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context. Groupings of alternative embodiments, elements, or steps of the present invention are not to be construed as limitations. Each group member may be referred to and embodimented individually or in any combination with other group members disclosed herein. It is anticipated that one or more members of a group may be included in, or deleted from, a group for reasons of convenience and/or patentability. When any such inclusion or deletion occurs, the specification is deemed to contain the group as modified thus fulfilling the written description of all Markush groups used in the appended embodiments. Unless otherwise indicated, all numbers expressing a characteristic, item, quantity, parameter, property, term, and so forth used in the present specification and embodiments are to be understood as being modified in all instances by the term “about.” As used herein, the term “about” means that the characteristic, item, quantity, parameter, property, or term so qualified encompasses a range of plus or minus ten percent above and below the value of the stated characteristic, item, quantity, parameter, property, or term. Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached embodiments are approximations that may vary. For instance, as mass spectrometry instruments can vary slightly in determining the mass of a given analyte, the term “about” in the context of the mass of an ion or the mass/charge ratio of an ion refers to +/−0.50 atomic mass unit. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the embodiments, each numerical indication should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Use of the terms “may” or “can” in reference to an embodiment or aspect of an embodiment also carries with it the alternative meaning of “may not” or “cannot.” As such, if the present specification discloses that an embodiment or an aspect of an embodiment may be or can be included as part of the inventive subject matter, then the negative limitation or exclusionary proviso is also explicitly meant, meaning that an embodiment or an aspect of an embodiment may not be or cannot be included as part of the inventive subject matter. In a similar manner, use of the term “optionally” in reference to an embodiment or aspect of an embodiment means that such embodiment or aspect of the embodiment may be included as part of the inventive subject matter or may not be included as part of the inventive subject matter. Whether such a negative limitation or exclusionary proviso applies will be based on whether the negative limitation or exclusionary proviso is recited in the embodimented subject matter. Notwithstanding that the numerical ranges and values setting forth the broad scope of the invention are approximations, the numerical ranges and values set forth in the specific examples are reported as precisely as possible. Any numerical range or value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Recitation of numerical ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate numerical value falling within the range. Unless otherwise indicated herein, each individual value of a numerical range is incorporated into the present specification as if it were individually recited herein. The terms “a,” “an,” “the” and similar references used in the context of describing the present invention (especially in the context of the following embodiments) are to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. Further, ordinal indicators—such as “first,” “second,” “third,” etc.—for identified elements are used to distinguish between the elements, and do not indicate or imply a required or limited number of such elements, and do not indicate a particular position or order of such elements unless otherwise specifically stated. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., “such as”) provided herein is intended merely to better illuminate the present invention and does not pose a limitation on the scope of the invention otherwise embodimented. No language in the present specification should be construed as indicating any non-embodimented element essential to the practice of the invention. When used in the embodiments, whether as filed or added per amendment, the open-ended transitional term “comprising”, variations thereof such as “comprise” and “comprises”, and equivalent open-ended transitional phrases thereof like “including,” “containing” and “having”, encompasses all the expressly recited elements, limitations, steps, integers, and/or features alone or in combination with unrecited subject matter; the named elements, limitations, steps, integers, and/or features are essential, but other unnamed elements, limitations, steps, integers, and/or features may be added and still form a construct within the scope of the embodiment. Specific embodiments disclosed herein may be further limited in the embodiments using the closed-ended transitional phrases “consisting of” or “consisting essentially of” (or variations thereof such as “consist of”, “consists of”, “consist essentially of”, and “consists essentially of”) in lieu of or as an amendment for “comprising.” When used in the embodiments, whether as filed or added per amendment, the closed-ended transitional phrase “consisting of” excludes any element, limitation, step, integer, or feature not expressly recited in the embodiments. The closed-ended transitional phrase “consisting essentially of” limits the scope of a embodiment to the expressly recited elements, limitations, steps, integers, and/or features and any other elements, limitations, steps, integers, and/or features that do not materially affect the basic and novel characteristic(s) of the embodimented subject matter. Thus, the meaning of the open-ended transitional phrase “comprising” is being defined as encompassing all the specifically recited elements, limitations, steps and/or features as well as any optional, additional unspecified ones. The meaning of the closed-ended transitional phrase “consisting of” is being defined as only including those elements, limitations, steps, integers, and/or features specifically recited in the embodiment whereas the meaning of the closed-ended transitional phrase “consisting essentially of” is being defined as only including those elements, limitations, steps, integers, and/or features specifically recited in the embodiment and those elements, limitations, steps, integers, and/or features that do not materially affect the basic and novel characteristic(s) of the embodimented subject matter. Therefore, the open-ended transitional phrase “comprising” (and equivalent open-ended transitional phrases thereof) includes within its meaning, as a limiting case, embodimented subject matter specified by the closed-ended transitional phrases “consisting of” or “consisting essentially of.” As such embodiments described herein or so embodimented with the phrase “comprising” are expressly or inherently unambiguously described, enabled and supported herein for the phrases “consisting essentially of” and “consisting of.” All patents, patent publications, and other references cited and identified in the present specification are individually and expressly incorporated herein by reference in their entirety for the purpose of describing and disclosing, for example, the compositions and methodologies described in such publications that might be used in connection with the present invention. These publications are provided solely for their disclosure prior to the filing date of the present application. Nothing in this regard is or should be construed as an admission that the inventors are not entitled to antedate such disclosure by virtue of prior invention or for any other reason. All statements as to the date or representation as to the contents of these documents is based on the information available to the applicant and does not constitute any admission as to the correctness of the dates or contents of these documents. Lastly, the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present invention, which is defined solely by the embodiments. Accordingly, the present invention is not limited to that precisely as shown and described. | 298,312 |
11862338 | DETAILED DESCRIPTION It is to be appreciated that certain aspects, modes, embodiments, variations and features of the present methods are described below in various levels of detail in order to provide a substantial understanding of the present technology. There is an urgent need for more efficacious treatments for psychiatric disorders characterized by negative affect (e.g., Affective Disorder), such as major depressive disorder (MDD), post-traumatic stress disorder, and anxiety disorders. Such ADs are common, disabling and costly. Indeed, an estimated 350 million people worldwide suffer from depression, which is the leading cause of disability in Americans ages 15-44. Major depressive disorder (MDD) is among the leading causes of disability worldwide and is as associated with both significant functional impairment and reduced quality of life (WHO, 2001). MDD is a highly prevalent mental illness, affecting approximately 17% of the population across the lifespan, and frequently following a recurrent and chronic course (Kessler et al.,JAMA.289, 3095-3105 (2003)). Despite the availability of established treatments, it is estimated that only about one third of patients with MDD achieve remission (Trivedi et al.,Am J Psychiatry163, 28-40 (2006); Rush et al.,Am J Psychiatry163, 1905-1917 (2006)). Accordingly, methods and systems that assign the appropriate therapeutic intervention to a particular subject are warranted. The present disclosure demonstrates that cognitive-emotional training is associated with changes in short-term plasticity of brain networks implicated in an Affective Disorder, such as MDD, bipolar disorder, post-traumatic stress disorder (PTSD), general anxiety disorder, social phobia, obsessive compulsive disorder, treatment resistant depression, or borderline personality disorder. Fourteen MDD patients received cognitive-emotional training (e.g., that Emotional Faces Memory Task (EFMT) training) as monotherapy over a 6-week period. Patients were scanned at baseline and post-treatment to identify changes in resting-state functional connectivity and effective connectivity during emotional working memory processing. Compared to baseline, patients showed post-treatment reduced connectivity within resting-state networks involved in self-referential and salience processing and greater integration across the functional connectome at rest. Moreover, a post-treatment increase in the EFMT-induced modulation of connectivity was observed between the cortical control and limbic brain regions, which was associated with clinical improvement. These results demonstrate that cognitive-emotional training enhances the functional integration of resting-state networks and the effective connectivity from cortical control brain regions to regions involved in emotional responses, and that these changes in connectivity parameters are related to symptomatic improvement. Cognitive-emotional training is also associated with changes in short-term plasticity of brain networks implicated in other disorders. For example, the disorders can include anxiety disorders, such as generalized anxiety disorder (GAD), social phobia, borderline personality disorder, and post-traumatic stress disorder (PTSD), etc. The systems and methods disclosed herein are useful for rapidly and accurately detecting an Affective Disorder based on a patient's effective connectivity and/or functional connectivity between select sub-processing regions. Moreover, the systems and methods of the present technology permit clinicians to rapidly assign suitable therapeutic interventions (e.g., cognitive-emotional therapy) to patients with Affective Disorders. The systems and methods described herein also assist with mitigating delays in clinical decision-making with respect to maintaining or modifying a therapeutic regimen (e.g., altering, substituting, or discontinuing a particular course of therapy, or incorporating an additional therapy) of a patient suffering from an Affective Disorder, thereby ensuring patient safety, and reducing the overall risk of suicide. Definitions Unless defined otherwise, all technical and scientific terms used herein generally have the same meaning as commonly understood by one of ordinary skill in the art to which this technology belongs. As used in this specification and the appended claims, the singular forms “a”, “an” and “the” include plural referents unless the content clearly dictates otherwise. For example, reference to “a cell” includes a combination of two or more cells, and the like. Generally, the nomenclature used herein and the laboratory procedures in cell culture, molecular genetics, organic chemistry, analytical chemistry and nucleic acid chemistry and hybridization described below are those well-known and commonly employed in the art. As used herein, the term “about” in reference to a number is generally taken to include numbers that fall within a range of 1%, 5%, or 10% in either direction (greater than or less than) of the number unless otherwise stated or otherwise evident from the context (except where such number would be less than 0% or exceed 100% of a possible value). As used herein, the terms “brain activation” or “brain activity” refer to the electrical activity of one or more neurons in at least one brain region and the corresponding metabolic changes observed in a subject in response to an internal or external stimulus. As used herein, “cognitive-emotional training” refers to the performance of cognitive or emotion-oriented tasks for the purpose of inducing activation in specific brain regions, and aiming to modulate the activation patterns within/between regions over time (harnessing brain plasticity) to induce symptom improvement in psychiatric conditions. As used herein, a “control” is an alternative sample used in an experiment for comparison purpose. A control can be “positive” or “negative.” For example, where the purpose of the experiment is to determine a correlation of the efficacy of a therapeutic intervention for a particular type of disease, a positive control (an intervention known to exhibit the desired therapeutic effect) and a negative control (a subject or a sample that does not receive the therapy or receives a placebo) are typically employed. As used herein, “effective connectivity” or “EC” refers to the influence one neural system or brain region has, or exerts, on another neural system or brain region. EC depends on and tests an a priori defined model for the influence between brain regions/neural systems, rather than reporting an observed correlation (as in FC). In order to determine whether one brain region influences another, the correlation of neural activity between two brain regions is measured during a specific behavior or cognitive task that is known or believed to activate the network or system (e.g., working memory). In some embodiments, effective connectivity can be measured from fMRI data. Methods for measuring and interpreting EC are described in Friston,Human Brain Mapping2:56-78(1994). Effective connectivity can be considered an index of short-term neural-network level plasticity (Stephan et al.Biological Psychiatry59, 929-939 (2006); Friston,Brain Connect.1(1):13-36 (2011)). This short-term plasticity represents a fundamental mechanism by which the brain alters or contextualizes its connectivity and function in response to external or internal cues (Salinas & Sejnowski,Neuroscientist7, 430-440 (2001)). As used herein, “functional connectivity” or “FC” refers to the temporal correlations between spatially remote neurophysiological events (activations of distinct brain regions). FC is a statement about observed correlations. Functional connectivity can be measured using functional magnetic resonance imaging (fMRI) where a blood oxygen level dependent (BOLD) signal is measured as a quantitative indicator of neural activity in a specific brain region of interest. Any signal of neural activity (electrophysiological signals such as EEG) can also be used to calculate FC. Correlation between signals in distinct brain regions is calculated to estimate FC. Methods for measuring and interpreting FC are described in Friston,Human Brain Mapping2:56-78(1994). As used herein, “integration” refers to the degree of functional connectivity or effective connectivity within a single network or brain region, or between multiple networks or brain regions. As used herein, a “neuron” is an electrically excitable cell of the nervous system that communicates with other cells via synapses. A typical neuron comprises a cell body, several short branches processes (dendrites), and one long process (axon). As used herein, the term “plasticity” refers to the strengthening or weakening of neuronal synapses over time. As used herein, a “synapse” is a specialized region between an axon terminus of a neuron and an adjacent neuron or target effector cell (e.g., muscle cell) across which impulses (i.e., electrical signals and/or chemical signals) are transmitted. An impulse may be conducted by a neurotransmitter, or may be transmitted via gap junctions connecting the cytoplasms of pre- and post-synaptic cells. As used herein, the terms “individual”, “patient”, or “subject” can be an individual organism, a vertebrate, a mammal, or a human. In some embodiments, the individual, patient or subject is a human. As used herein, an “effective amount of time” refers to a duration based on a combination of one or more of a frequency, a length, and/or content (e.g., number or quality of images) of a cognitive-emotional training session, that can achieve a desired endpoint of effective connectivity, functional connectivity, or integration in at least one sub-processing region of the nervous system of a subject. Altered Brain Activation in MDD Numerous studies have shown that patients with MDD exhibit persistent deficits in cognitive control (the capacity to maintain and manipulate information) in the presence of emotionally salient stimuli, and that such deficits are associated with illness severity (Hamilton et al.Am J Psychiatry.169(7):693-703 (2012); Bora et al.Psychol Med.43(10):2017-26 (2013)). Functional magnetic resonance imaging (fMRI) studies in MDD have shown that dorsal cortical regions known to subserve cognitive control are hypoactive, whereas regions involved in emotion processing, particularly the amygdala (AMG), are hyperactive (Deiner et al.,Neuroimage.61(3):677-85 (2012); Fitzgerald et al.,Hum. Brain Mapp.29, 683-695 (2008)). These abnormalities have been observed across multiple tasks but have been most commonly studied using working memory (Wang et al.Prog Neuropsychopharmacol Biol Psychiatry.56:101-8 (2015)) and facial affect processing paradigms (Stuhrmann et al.Biol Mood Anxiety Disord.1:10 (2011); Delvecchio et al.Eur Neuropsychopharmacol.22(2):100-13 (2012)). These abnormalities in local brain activation also extend to functional connectivity of dorsal cortical regions and the AMG, characterized by reduced “top-down” regulatory input from cortical regions to the AMG (Zhang et al.Neurosci Bull.32(3):273-85 (2016)). MDD is also associated with alterations in resting-state functional connectivity, particularly in networks associated with cognitive control (central executive network; CEN), salience (Salience Network; SAL) and self-referential processing (default mode network; DMN) (Kaiser et al,JAMA Psychiatry72: 603-611 (2015)). Compared to healthy individuals, patients with MDD show hypoconnectivity within regions of the CEN and hyperconnectivity between medial brain regions that form part of the dorsal DMN (Kaiser et al,JAMA Psychiatry72: 603-611 (2015)). These changes in the internal network cohesion appear to occur in the context of reduced functional integration between resting-state networks (Kaiser et al,JAMA Psychiatry72: 603-611 (2015)). Collectively, these task and resting-state abnormalities in brain functional connectivity represent the network-level correlates of the emotional dysregulation commonly observed in MDD populations. Cognitive-Emotional Therapy Cognitive-emotional therapy offers significant promise as a treatment intervention for MDD because of its theoretical potential to target and ameliorate neural network abnormalities. Examples of various forms of cognitive-emotional therapy include, but are not limited to, Emotional Faces Memory Task (EFMT), Wisconsin Card Sorting Test, Emotional Stroop Test, Iowa Gambling Task, Dot-probe task, Face perception task, and delay discounting task. EFMT was developed as a cognitive-emotional training exercise that aims to enhance cognitive control for emotional information processing (and accordingly, improve emotion regulation) in MDD by targeting both cognitive control and emotional processing networks. The EFMT intervention combines working memory (N-back) and facial affect identification tasks, which have been shown to elicit activity specifically in the dorsolateral prefrontal cortex (DPFC) and AMG, respectively. EFMT prompts participants to remember the emotions observed on a series of faces, displayed one at a time on a computer screen, and subsequently indicate if the emotion observed on a given face matches the emotion shown N (number) of faces prior. The task's difficulty level (N) is calibrated based on each participant's performance to ensure a consistent challenge and engagement of the targeted neural networks. The EFMT training regimen involves manipulating emotionally salient stimuli in working memory, and participants are therefore thought to be exerting cognitive control during emotional information processing throughout task participation. A version of this task elicited simultaneous activation of the DPFC and AMG in a sample of healthy volunteers. The Wisconsin Card Sorting Test examines abstract reasoning and the ability of a subject to problem solve in changing environments. The Wisconsin Card Sorting Test is useful for eliciting activation of the frontal lobe (e.g., prefrontal cortical regions) and is described in Chen & Sun, C. W.,Sci Rep7, 338 (2017); Teubner-Rhodes et al.,Neuropsychologia102, 95-108 (2017). The Emotional Stroop Test is a cognitive interference task that measures the ability of a subject to process emotions when conflicting information is also presented by examining the amount of time participants take to name colors of words presented to them in the presence of an emotional distractor. The Emotional Stroop Test is useful for eliciting activation of the precentral gyms and anterior cingulate, and is described in Ben-Haim et al.,J Vis Exp.112 (2016); Song et al.Sci Rep7, 2088 (2017). The Iowa Gambling Task (IGT) is a decision-making task involving the complex interplay of motivational, cognitive, and response processes in choice behavior, and is useful for eliciting activation of the amygdala, and ventral-medial prefrontal cortex (vmPFC). IGT is also considered an indicator of dopamine system activity, and is described in Fukui et al.Neuroimage24, 253-259 (2005) and Ono et al.Psychiatry Res233, 1-8 (2015). The Dot-probe task measures selective attention of a subject toward emotional stimuli and is useful for eliciting activation of the anterior cingulate cortex (ACC), and amygdala. The Dot-probe task is described in Gunther et al.BMC Psychiatry15, 123 (2015). The Face perception task measures the ability of a subject to understand and interpret facial expressions, and elicits activation of the fusiform face area (FFA), amygdala, and superior temporal sulcus (fSTS). See Dal Monte et al.Nat Commun6, 10161 (2015); Hortensius et al.Philos Trans R Soc Lond B Biol Sci371 (2016); Taubert et al.Proc Natl Acad Sci USA115, 8043-8048 (2018). The Delay discounting task evaluates the ability of a subject to set and attain goals, specifically immediate rewards vs. larger but delayed rewards. The Delay discounting task elicits activation of the orbital frontal cortex (OFC) and is described in Altamirano et al.Alcohol Clin Exp Res35, 1905-1914 (2011). Systems and Methods FIG.8shows a block diagram of an example data processing system800. The data processing system800, can be utilized for the treatment and analysis of data related to the treatment of the affective disorder discussed above. For example, the data processing system can be utilized for administering a cognitive-emotional therapy and analyzing data associated with the therapy. The data processing system800can include one or more processing unit802, a user interface804, a network interface806, storage808, memory810, and a system bus830. The processing unit802is any logic circuitry that responds to and processes instructions fetched from the memory810. In many embodiments, the processing unit802is provided by a microprocessor unit, e.g.: those manufactured by Intel Corporation of Mountain View, California; those manufactured by Motorola Corporation of Schaumburg, Illinois; the ARM processor and TEGRA system on a chip (SoC) manufactured by Nvidia of Santa Clara, California; the POWER7 processor, those manufactured by International Business Machines of White Plains, New York; or those manufactured by Advanced Micro Devices of Sunnyvale, California. The processing unit802may be based on any of these processors, or any other processor capable of operating as described herein. The processing unit802may utilize instruction level parallelism, thread level parallelism, different levels of cache, and multi-core processors. A multi-core processor may include two or more processing units on a single computing component. Examples of multi-core processors include the AMD PHENOM IIX2, INTEL CORE i5 and INTEL CORE i7. The user interface804can include displays, input/output devices, and peripheral devices that can allow communication with one or more users. The user interface can include display devices, touch screen displays, mouse, keyboard, gesture sensitive devices, etc. the network interface806can allow interface with an external network, such as the Internet, an Ethernet network, or any other local or wide area network. The storage808can include non-volatile memory, such as, for example, a disk drive, a flash drive, a ROM, an EMPROM, an EEPROM, etc. The system bus830can provide communication between various components of the data processing system800. The memory810can store data and one or more software modules that the processing unit802can execute to perform one or more functions. Specifically, the memory810can include executable logic engines that can be executed by the processing unit802. For example, the memory810can include a subject data structure812, a ranking engine814, an efficacy engine816, a cognitive-emotional training engine818, a classifier engine820, and an analysis engine824. These components of the memory810are discussed further below. The memory810can be a hardware storage device and can include volatile and/or non-volatile memory. As an example, the memory810can include volatile memory such as RAM, DRAM, SRAM, etc., and non-volatile memory such as those mentioned above in relation to storage808. FIG.9shows an example data structure900. As an example, the data structure900can be stored in memory810of the data processing system800shown inFIG.8. The data processing system800can maintain the data structure900to manage one or more connectivity values associated with one or more subjects. The data structure can include columns, where each column assigned a plurality of fields for storing data values. However, it is understood that any type of data structure or data structures can also be used. The data structure900stores key fields902that stores subject identifiers that identify a subject. The subject identifiers can include alphanumeric and or binary digits that can uniquely identify a subject. The data structure900can include keyed data corresponding to the key or subject identifier in the key fields902. For example, the keyed data associated with a subject identifier can include the data values in rows corresponding to the subject identifier. As an example, the data structure900also can include fields904for storing data values representing a set of first connectivity values associated with one or more subject identifiers. The first connectivity values, for example, can represent a magnitude of a connection associated with at least one sub-processing region of the nervous system of the subject. In some examples, the first connectivity value can represent the magnitude measured at a first time. The data structure900can further includes fields906for storing data values representing a rank associated with one or more of the subject identifiers. The rank can be based on the first connectivity value and can represent a position of the subject identifier in relation to first connectivity values associated with other subject identifiers. For example, the rank can represent the position of the subject identifier based on increasing first connectivity values associated with all subject identifiers. The data structure900can further include fields908for storing data values representing a classification associated with one or more subject identifiers. The classification can also be based on the first connectivity values. The classification, can for example, include a first classification value such as “eligible” and a second classification value such as “ineligible.” The classification can indicate, for example, whether a subject identified by the subject identifier is eligible, or is a good candidate, for cognitive-emotional training. The data structure900can further include fields910for storing data values representing a second connectivity value, which, like the first connectivity value, can also represent a magnitude of a connection associated with at least one sub-processing region of the nervous system of the subject. In some examples, the second connectivity value can represent the magnitude measured at a second time, such as, for example, after the subject has been exposed to the cognitive-emotional training. In some examples, the second connectivity value can represent the magnitude of a connection associated with the same at least one sub-processing region as that associated with the first connectivity value. For example, both the first and second connectivity values can represent magnitudes of connections between the DPFC and the AMG of the subjects. The data structure900also can include another classification field912for storing data values representing efficacy associated with one or more subject identifiers. The efficacy can indicate the effectiveness of a treatment, such as, for example, the cognitive-emotional training, on the subject based on the first and the second connectivity values that are measured before and after, respectively, the administration of the treatment. The data structure900can include additional connectivity values, classifications, and ranks. In some examples, the data structure900can include values associated with connections of more than one sub-processing regions of the nervous system of the subjects. For example, the data structure can include first and/or second connectivity values measured for connections between the dACC and the AMG of the subjects. It should be appreciated that a connectivity value can correspond to an effective connectivity, functional connectivity, or integration across at least one sub-processing region of the nervous system of a subject. In some embodiments, the connectivity values can be determined from a device configured to perform an fMRI on a subject. In some embodiments, the connectivity values can be inferred from one or more outputs provided by fMRI. It should be appreciated that the connectivity values can be inferred or identified from any device that is configured to determine effective connectivity, functional connectivity, or integration across at least one sub-processing regions. FIG.10shows a flow diagram of an example process1000representing a classifier engine820that can be utilized to determine an eligibility of subjects for a treatment. In particular, the flow diagram1000can be utilized to update the data structure900with classification values that indicate whether the associate subject is eligible or ineligible for the treatment, such as, for example, a cognitive-emotional training. The process1000includes accessing a subject connectivity value associated with a subject (1002). In particular, the process1000can include accessing a data structure including a subject identifier identifying a subject and a subject connectivity value derived from at least one of a scan or test provided to the subject, where the subject connectivity value represents a magnitude of a connection associated with at least one sub-processing region of a nervous system of the subject. The data structure, for example, can be the data structure900shown inFIG.9. The subject connectivity value can represent, for example, the first or the second connectivity values in the data structure900. The at least one sub-processing region of the nervous system can include at least one of, without limitation, the DPFC, the AMG, the dACC, the DMN, the SAL, the LCEN, the RCEN, the dDMN, and the vDMN. As an example, the data processing system800can access the first connectivity value 10 from the data structure900associated with the subject identified by the subject identifier “Subject 1.” The process1000executing executable logic that includes comparisons rules, execution of which compares the subject connectivity value to a threshold value (1004). In particular, the process1000can include comparing, by the data processing system, the subject connectivity value to a connectivity threshold value to determine a classification of the subject. As an example, the data processing system800can store the connectivity threshold value in memory810, and can compare, for example, the first connectivity value of 10 stored in the data structure900to the threshold value. The threshold value can represent a baseline number that can be based on the measurement environment and setup to which the subject is exposed, and can vary based on the changes in the measurement environment or setup. For example, different measuring instruments on the same subjects may generate different connectivity values. Therefore, the threshold value can be selected based on the measurement environment and setup. The process1000includes storing a first classification value in the data structure if the subject connectivity value is greater than the threshold (1006). In particular, the data processing system800, responsive to determining that the subject connectivity value exceeds the connectivity threshold value, stores in the data structure an association between the subject identifier and a first classification value corresponding to a first classification. As an example, the first classification can represent ineligibility, and the first classification value can include the entry “Ineligible.” For example, referring to the data structure900shown inFIG.9, the data processing system800can compare the first connectivity value of 6 of Subject 2 to an example threshold value of 5, and store the entry “Ineligible” in the classification column (field908) of the data structure900in association with the subject identifier “Subject 2.” The process1000includes storing a second classification value in the data structure if the subject connectivity value is less than the threshold (1006). In particular, the data processing system responsive to determining that the subject connectivity value is less than the connectivity threshold value, store in the data structure an association between the subject identifier and a second classification value corresponding to a second classification. As an example, the second classification can represent eligibility, and the second classification value can include the entry “Eligible.” For example, in the data structure900, the data processing system can compare the first connectivity value of 15 of the Subject 3 with a threshold value of 20 and store the entry “Eligible” in the classification column (field908) of the data structure900in association with the subject identifier “Subject 3.” The process1000may also be executed iteratively, updating the data structure900as new connectivity values are received. Thus, the process1000may update the field908with the appropriate first or second classification value based on changes in the subject connectivity values in relation to the connectivity threshold. In some examples, the sub-processing regions can include the dorsolateral prefrontal cortex (DPFC) and the amygdala (AMG), and the connectivity value and the connectivity threshold value represent an effective connectivity between the DPFC and the AMG and an effective connectivity threshold value between the DPFC and the AMG. The first classification value can indicate that the subject is ineligible, and the second classification value indicates that the subject is eligible. That is, if the effective connectivity value is less than a threshold value, the associate subject is eligible for the cognitive-emotional training, and the data structure900can be accordingly updated. In some examples, the sub-processing regions can include the anterior cingulate cortex (dACC) and the amygdala (AMG), and the connectivity value and the connectivity threshold value represent an effective connectivity between the dACC and the AMG and an effective connectivity threshold value between the dACC and the AMG. The first classification value can indicate that the subject is eligible, and the second classification value indicates that the subject is ineligible. That is, if the effective connectivity value is greater than a threshold value, the associate subject is eligible for the cognitive-emotional training, and the data structure900can be accordingly updated. In some examples, the sub-processing regions can include the default mode resting state network (DMN), and the connectivity value and the connectivity threshold value represent a functional connectivity within the DMN and a functional connectivity threshold value associated with the DMN. The first classification value can indicate that the subject is eligible, and the second classification value indicates that the subject is ineligible. That is, if the functional connectivity value is greater than a threshold value, the associate subject is eligible for the cognitive-emotional training, and the data structure900can be accordingly updated. In some examples, the sub-processing regions can include the default mode resting state network (DMN) or the salience resting state network (SAL), and the connectivity value and the connectivity threshold value represent a functional connectivity within the DMN or SAL and a functional connectivity threshold value associated with the DMN or SAL. The first classification value can indicate that the subject is eligible, and the second classification value indicates that the subject is ineligible. That is, if the functional connectivity value is greater than a threshold value, the associate subject is eligible for the cognitive-emotional training, and the data structure900can be accordingly updated. In some examples, the sub-processing regions can include one of LCEN and RCEN, dDMN and vDMN, LCEN and vDMN, and LCEN and SEL. The connectivity value and the connectivity threshold value, respectively, represent an integration between the selected pair of sub-processing regions. The first classification value indicates that the subject is ineligible, and the second classification value indicates that the subject is eligible. That is, if the integration value is less than a threshold value (for example, a threshold value of 0), the associate subject is eligible for the cognitive-emotional training, and the data structure900can be accordingly updated. In some examples, the classifier820engine can consider connectivity values between or within more than one set of sub-processing regions to determine the eligibility of the subject. For example, the classifier engine820can consider a combination of the effective connectivity between the DPFC and the AMG and the dACC and the AMG to determine eligibility. If the effective connectivity between DPFC and the AMG is less than a threshold, and the effective connectivity between the dACC and the AMG is above a threshold, the classifier engine820can determine that the subject is eligible, and update the data structure900accordingly. FIG.11shows a flow diagram of an example process1100representing a ranking engine814of the data processing system800shown inFIG.8that can be utilized to rank subjects based on their respective measured subject connectivity values. The process1100can include accessing subject connectivity values associated with subjects (1102). In particular, the process1100can include identifying from a data structure a plurality of subject connectivity values associated with a plurality of subject identifiers corresponding to a plurality of subjects, where each subject connectivity value in the plurality of subject connectivity values represents a magnitude of a connection associated with at least one sub-processing region of a nervous system of a respective subject of the plurality of subjects. For example, the ranking engine814can access the plurality of first connectivity values listed in the data structure900associated with the plurality of subject identifiers “Subject 1” to “Subject n.” The process1100includes ranking based on the connectivity values (1102). In particular, the process1100can include assigning to each subject identifier in the data structure a rank based on the subject connectivity value. For example, referring to the data structure900inFIG.9, the ranking engine814can assign ranks in the rank column based on increasing first connectivity values, with the lowest connectivity value being assigned the lowest rank and the highest connectivity value being assigned the highest rank. The ranking may in some instances be can be assigned in the reverse order. The process1100can include determining the difference between subject connectivity values and a threshold value (1106). In particular, the ranking engine814can determine the difference between the first connectivity values shown inFIG.9and a threshold value. In some instances, the threshold value can be similar to that selected by the classifier engine820discussed above. The process1100includes determining whether the difference is greater than 0 (1108). That is, whether the connectivity value is greater than or equal to the threshold value. The process1100includes selecting a subset of subjects, each subject of the subset selected based on a difference between the connectivity threshold value and the subject connectivity value (1110). As an example, the ranking engine814can select m subjects having the m highest differences between their connectivity values and the threshold value. Once the subjects are selected, the ranking engine814can generate an ordered list of the selected subject identities based on the respective ranks (1112). The process1100may also be executed iteratively, updating the data structure900as new connectivity values are received. Thus, the process1000may update the field906with the appropriate ranks based on received first connectivity values of additional subjects, or based on new first connectivity values associated with existing subject identifiers in the data structure900. In some examples, the at least one sub-processing region can include the DPFC and the AMG or the dACC and the AMG, and the subject connectivity values can represent the effective connectivity between the sub-processing engine. For DPFC and AMG, the subject connectivity values associated with the selected subset of subjects are below the connectivity threshold value. For dACC and AMG, the subject connectivity values associated with the selected subset of subjects are above the connectivity threshold value. In some examples, the at least one sub-processing regions can be the dDMN or the SAL, and the subject connectivity values can represent functional connectivity within the DMN or the SAL. In some such examples, subject connectivity values associated with the selected subset of subjects are above the connectivity threshold value. In some examples, a pair of sub-processing regions can be the LCEN and the RCEN, the dDMN and the vDMN, the LCEN and the vDMN, or the LCEN and the SAL. The subject connectivity values can represent functional connectivity within the pair of sub-processing regions. In some such examples, the subject connectivity values associated with the selected subset of subjects are above the connectivity threshold value. The process1100can also include not selecting the subject that have a connectivity value that is less than the threshold value. In some instances, this can remove candidate that are not predisposed to respond to the treatment, such as the cognitive-emotional training. Therefore, by eliminating those subjects from the overall list of subjects can improve the time for carrying out the treatment. FIG.12shows a flow diagram of an example process1200representing an efficacy engine816shown inFIG.8that can be utilized to determine the efficacy of a cognitive-emotional training on a subject. The process1200includes identifying first and second connectivity values associated with a subject (1202). In particular, the efficacy engine816identify a first connectivity value of a subject, where the first connectivity value represents a first magnitude of a connection associated with at least one sub-processing region of a nervous system of a subject at a first time, and a second connectivity value of the subject, where the second connectivity value represents a second magnitude of the connection associated with the at least one sub-processing region of the nervous system of the subject at a second time after the subject has been exposed to cognitive-emotional training. For example, referring toFIG.9, the efficacy engine816can access the data structure900to identify the first and second connectivity values for a subject, such as those associated with the subject identity: “Subject 1.” The process1200includes determining a difference between the first connectivity value and the second connectivity values (1204). For example, the efficacy engine816, for “Subject 1” can determine the difference between the first and second connectivity values as being equal to 10. The process1200includes determining whether the difference is less than or greater than a threshold value (1206). In particular, the efficacy engine816can access a stored value or an operator provided threshold value. The threshold value can represent the minimum difference in the connectivity values that should be observed to indicate that there is an effective improvement in the subject as a result of the treatment. The process1200includes classifying the subject as effective if the difference is greater than the threshold (1208) and classifying the subject as ineffective if the difference is less than the threshold (1210). In particular, the efficacy engine816responsive to determining that the difference exceeds a threshold value, store in the data structure an association between the subject identifier and a first classification value corresponding to a first classification. As an example, the first classification can be effectiveness, and the first classification value can be the entry “Y.” Further, the efficacy engine816responsive to determining that the difference is less than the threshold value can store in the data structure an association between the subject identifier and a second classification value corresponding to a second classification. For example, the second classification can be ineffectiveness, and the second classification value can be the entry “N.” It is understood that other entries other than “Y” and “N” can also be used. The process1200may also be executed iteratively, updating the data structure900as new connectivity values are received. Thus, the process1000may update the field912with the appropriate entry based on changes in the first and/or second connectivity values, or based on new first and second connectivity values in new keyed data associated with new subject identifiers. In some examples, the sub-processing regions can include the DPFC and the AMG or the dACC and the AMG. The first connectivity value and the second connectivity value represent an effective connectivity between the DPFC and the AMG or the dACC and the AMG of the subject. In some examples, the sub-processing regions can include the dDMN or the SAL. The first connectivity value and the second connectivity value represent a functional connectivity within the dDMN or the SAL of the subject. In some examples, the sub-processing regions can include the pairs LCEN and RCEN, the dDMN and the vDMN, the LCEN and the vDMN, or the LCEN and the SAL. The first connectivity value and the second connectivity value represent an integration across the particular pair of sub-processing regions of the subject. In some examples, the analysis engine824can carry out analysis of the data collected before, during, or after the treatment. For example, the analysis engine824can perform data analysis such as Neuroimaging Preprocessing and Quality Assurance, Resting State Network Connectivity Analysis, Task-based fMRI (Connectivity) Analysis, Statistical Analysis, analyzing changes in resting-state functional connectivity, effective connectivity, and integration in post-treatment data discussed above. In some examples, the analysis engine can perform analysis of neuroimaging data to determine the effective connectivity, functional connectivity, and the integration values. As an example, the analysis engine824can include software based on the procedure discussed in Anand, A., Li, Y., Wang, Y., Wu, J., Gao, S., Bukhari, L., Mathews, V. P., Kalnin, A., and Lowe, M. J. (2005). Activity and connectivity of brain mood regulating circuit in depression: a functional magnetic resonance study. Biol Psychiatry 57, 1079-1088, and Raichle, M. E., MacLeod, A. M., Snyder, A. Z., Powers, W. J., Gusnard, D. A., and Shulman, G. L. (2001). A default mode of brain function. Proc Natl Acad Sci USA 98, 676-682. In some examples, the cog-emo training engine818can perform one or more cognitive-emotional therapies such as, for example, EFMT, the Wisconsin card sorting test, the emotional stroop test, the Iowa gambling task, the dot probe task, the face perception task and the delay discounting task, discussed above. System The system can include any script, file, program, application, set of instructions, or computer-executable code, that is configured to enable a computing device to administer emotion identification and working memory tasks to users. The computing device can include or be connected with a display. The computing device can be a laptop, desktop computer, mobile phone, tablet, or other computing device. The system can include a database that includes a plurality of faces images. The faces illustrated by the face images can be in different emotional states, e.g., happy, sad, scared, excited, etc. Each of the face images can be labeled in the database with its corresponding emotional state. In some implementations, the face images can be generated on demand using a reference data base that includes portions of face images in different emotional states. For example, a face image in a happy state can be divided into sub-images that include only a single facial component, such as the eyes, mouth, etc. The system can combine the sub-images into unique face images on demand. The system can also include a plurality of training policies in the database. The training policies can control for how long each of the images are presented to a user and in what order. The system can present a series of images to the user. During a test with the system, participants identify the emotions that they observe on a series of images of faces that are presented one at a time on a display. Each of the images can be displayed for about 1 second, followed by a fixation cross for 1 second. As the images are presented to the user, the system can instruct the user to remember the sequence of emotions that they observed. Using an N-back working memory paradigm, participants are prompted to indicate after each presented face whether the emotion on the face they just observed is the same as the emotion that was shown N faces prior. In some implementations, the training policy can indicate that each training session contains 15 blocks of the task during which the N level varies depending on the participant's performance: the difficulty level increases or decreases across blocks as a participant's accuracy improves or declines (respectively). The first training session begins with a difficulty level of N=1 and the starting difficulty level for subsequent sessions is determined by performance at the prior session. Because EFMT utilizes a progressively challenging working memory paradigm, the task is tailored to a participant's ability level and ensures a consistent challenge throughout each training session. N-back working memory tasks that are progressively challenging have been shown to improve working memory performance. EXAMPLES The present technology is further illustrated by the following Examples, which should not be construed as limiting in any way. Example 1: Experimental Materials and Methods Subjects. 25 un-medicated MDD participants experiencing a current major depressive episode (MDE) were recruited to participate in a study protocol which involved an fMRI scan before and after completing six weeks of emotional faces memory task (EFMT) or sham-control training (CT) as part of a parent clinical trial protocol (NCT01934491). Participants were recruited online and through advertisements in local newspapers for depression research studies. All participants were between the ages of 18-55 and were evaluated by trained clinicians using the Structured Clinical Interview for DSM-IV-TR Axis I Disorders (SCID) (see First, M. B. et al.Structured clinical interview for DSM-IV axis disorders(SCID) (New York State Psychiatric Institute, Biometrics Research, New York, NY (1995)). Other Axis I comorbid diagnoses (excluding psychotic disorders, bipolar disorders and substance abuse or dependence within the past six months) were permitted as long as the participants' MDD diagnosis was considered to be primary. MDD severity, as measured by the Hamilton Depression Rating Scale—17-item version (Ham-D) (see Hamilton, J. P et al.Am J Psychiatry169:693-703 (1960)), had to be at least “moderate” (Ham-D≥16). Participants with very severe MDD (Ham-D≥27) were excluded from the study and referred for treatment. Participants who reported taking any antidepressant medications during their current MDE, as well as those with a history of treatment non-response (2+ failures of an adequate trial of a standard antidepressant medication) were excluded from the study. Cognitive-behavioral therapy attendance in the six weeks prior to, or at any time during, the study was also exclusionary as per the protocol. Participants with visual or motor impairments that were thought to interfere with performance on the EFMT training were also excluded. After an initial pre-screening interview, potentially eligible participants were informed about the study procedures who then signed informed consent forms to complete screening and baseline procedures. Participants who were eligible for and enrolled in the parent clinical trial investigating EFMT efficacy were subsequently offered enrollment in the fMRI study protocol, and provided informed consent if they elected to participate. Participants were reimbursed for each study session completed to compensate for time and travel expenses. Procedures. The study intervention (EFMT) was administered over 20 separate research visits. At the first visit, the SCID and Ham-D were administered to the subjects to confirm MDD diagnosis and determine symptom severity. A subsequent baseline evaluation was conducted which included the pre-treatment fMRI scan. Participants were randomly assigned to the EFMT or CT groups by a research coordinator using a pre-determined randomization sequence for group assignment. Participants were assigned to complete 18 training sessions over 6 weeks (an approximate duration of 20-35 minutes each, three times per week). Participants that failed to complete at least 2 training sessions in any week, or that missed greater than 3 training sessions during the course of the study, were discontinued as per the clinical trial protocol. Weekly depression severity (Ham-D) assessments were conducted by PhD or MD-level clinicians who were blind to participant group assignment. Ham-D raters were extensively trained to administer the assessment and demonstrated an intra-class correlation coefficient (ICC) of >0.8 on two separate training interviews. An outcome evaluation was conducted within 1 week of completing the training sessions, at which time baseline assessments and the fMRI scanning procedures were repeated. Cognitive Training Interventions. EFMT has been fully described in previous publications (see Iacoviello, B. M. et al.Eur Psychiatry30:75-81 (2015); Iacoviello, B. M. et al.Depress Anxiety31:699-706 (2014)). EFMT was designed to enhance cognitive control for emotional information processing in MDD by targeting both cognitive control and emotional processing networks, and was accomplished by combining emotion identification and working memory tasks. In the EFMT task, participants were asked to identify the emotions that they observed on a series of pictures of faces that were presented one at a time on a computer screen, and subsequently remember the sequence of emotions that they observed.FIG.1depicts an example trial sequence in the EFMT task. Using an N-back working memory paradigm, participants were prompted to indicate after each presented face whether the emotion on the face they had just observed was the same as the emotion that was shown N faces prior. Thus, the EFMT task involved exerting cognitive control over emotional information processing and was hypothesized to induce simultaneous activation of the amygdala (AMG) and the dorsolateral prefrontal cortex (DPFC). The CT condition involved a working memory training exercise which utilized the same N-back paradigm as EFMT, but included neutral shapes as stimuli instead of emotional faces. A session of EFMT or CT would take approximately 15-25 minutes to complete, and the study regimen involved completing 18 sessions of EFMT or CT over a 6 week period (3 sessions per week for 6 weeks). Neuroimaging Data Acquisition. Imaging data were acquired at ISMMS on a 3T Skyra scanner (Siemens, Erlangen, Germany) with a 32 channel receiver coil. Participants were scanned at study enrollment (baseline) and immediately after completing six weeks of EFMT training. Anatomical as well as resting-state and task-based fMRI data were acquired. The task included an abridged and modified version of an EFMT session. Twelve blocks of 10 trials began with a 2.5 s cue identifying the target type (0-back, 1-back, or 2-back). In 0-back trials, subjects viewed a target image (a face depicting an emotion) and indicated if each subsequent stimulus was exactly the same image as the target image. In the 1-back and 2-back trials, participants indicated whether or not each face depicted the same emotion as that presented either “1-back” or “2-back.” The anatomical, resting-state and task acquisitions were identical at baseline and post-treatment for all participants. The resting-state and task-fMRI data were acquired using a T2* single shot echo planar gradient echo imaging sequence with the following parameters: time to echo/repetition time (TE/TR)=35/1000 millisecond (ms), 2.1 mm isotropic resolution, 70 contiguous axial slices for whole brain coverage, field of view (FOV): 206×181×147 mm3, matrix size: 96×84, 60 degrees flip-angle, multiband (MB) factor 7, blipped CAIPIRINHA (Controlled Aliasing in Parallel Imaging Results in Higher Acceleration) phase-encoding shift=FOV/3, ˜2 kHz/Pixel bandwidth with ramp sampling, echo spacing: 0.68 ms, and echo train length 57.1 ms. The duration of the resting-state acquisition was 10 minutes and the duration of the WM task was 7 minutes and 34 seconds. Structural images were acquired using a T1-weighted, 3D magnetization-prepared rapid gradient-echo (MPRAGE) sequence (FOV: 256×256×179 mm3, matrix size: 320×320, 0.8 mm isotropic resolution, TE/TR=2.07/2400 ms, inversion time (TI)=1000 ms, 8 degrees flip-angle with binomial (1, −1) fat saturation, bandwidth 240 Hz/Pixel, echo spacing 7.6 ms, in-plane acceleration (GeneRalized Autocalibrating Partial Parallel Acquisition) factor 2 and total acquisition time of 7 min). Neuroimaging Preprocessing and Quality Assurance. Task and resting-state fMRI (rs-fMRI) data acquired at baseline and post-treatment were preprocessed separately using identical methods. All analyses were implemented using the Statistical Parametric Mapping software, version 12 (SPM12; www.fil.ion.ucl.ac.uk/spm/software/spm12/) and the Data Processing and Analysis for Brain Imaging Toolbox (see Yan, C. G. et al.Neuroinformatics14:339-351 (2016)). Each fMRI dataset was motion corrected to the first volume with rigid-body alignment; coregistration between the functional scans and the anatomical T1 scan; spatial normalization of the functional images into Montreal Neurological Institute stereotaxic standard space; spatial smoothing within functional mask with a 6-mm at full-width at half-maximum Gaussian kernel. Resting-state data were additionally preprocessed to correct for head motion using the following steps: wavelet despiking (removing signal transients related to small amplitude (<1 mm) head movements) (see Patel, A. X. et al.Neuroimage95:287-304 (2014)); detrending; and multiple regression of motion parameters and their derivatives (24-parameter model) (see Friston, K. J. et al.Magn. Reson. Med.35:346-355 (1996)) as well as white matter (WM), cerebro-spinal fluid (CSF) time series and their linear trends. The WM and CSF signals were computed using a component-based noise reduction method (CompCor, 5 principal components) (see Behzadi, Y. et al.Neuroimage37:90-101 (2007)). Lastly, a bandpass filtering was applied ([0.01-0.1] Hz). Individual task-fMRI and rs-fMRI datasets were excluded if volume-to-volume head motion was above 3 mm or 1 degree. No significant differences were present in maximal or mean head motion between baseline and follow-up scans (all p>0.2). Resting State Network Connectivity Analysis. rs-fMRI data acquired at baseline and post-treatment were analyzed separately using identical methods as described below. The strategy implemented focused on the resting-state networks that were most relevant to MDD. Specifically, connectivity of the ventral (vDMN) and dorsal (dDMN) default mode network, the left (LCEN) and right (RCEN) central executive network and the salience network (SAL) were examined (FIG.2A). To ensure the reproducibility of the analyses, these networks were defined using validated and freely available templates provided by the Functional Imaging in Neuropsychiatry Disorders Lab, Stanford University (<http://findlab.stanford.edu/functional_ROIs.html>) (see Shirer, W. R. et al.Cerebral Cortex22:158-165 (2012)). In each participant, the within-network and between-network functional connectivity was calculated for each network that respectively reflect functional cohesiveness and segregation. For the within-network functional connectivity, the average voxelwise time series within each network region was computed, and then the pairwise Pearson's correlations between network regions was calculated and averaged. For the between-network functional connectivity, an average time-series within each network (averaging all the time-series of the voxels part of the network) was first calculated and then the Pearson's correlation between each pair of networks' time-series was computed. Both within-network and between-network measures were further Fisher Z-transformed. Task-based fMRI (Connectivity) Analysis. Task-fMRI data acquired at baseline and post-treatment were analyzed separately using identical methods as described below. Herein, the focus was on effective connectivity computed using Dynamic Causal Modeling (DCM; see Friston, K. J. et al.Neuroimage19:1273-1302 (2003)). In DCM, the endogenous connections represented task-independent coupling strengths between regions while the modulatory effects represented task-induced alterations in inter-regional connectivity (Id.). The modeled neuronal dynamics were then related to observed blood oxygen level-dependent (BOLD) signal using a hemodynamic forward model (see Stephan, K. E. et al.Neuroimage38:387-401 (2007)). Following established procedures (see Dima, D. et al.Human Brain Mapping36:4158-4163 (2015); Dima, D. et al.Transl. Psychiatry6:e706 (2016); Moser, D. A. et al.Mol. Psychiatry23:1974-1980 (2018)), spherical 5-mm volumes of interest (VOIs) were defined bilaterally, centered on the MNI coordinates of the group maxima of the working memory load-dependent modulation at baseline: Left inferior parietal cortex (PAR): −42,−48,44, right PAR: 44,−38, 42; dACC left dorsal anterior cingulate cortex (dACC): −6 24 44, right dACC: 6 22 44; left DPFC: −28 4 60, right DPFC: 28 8 58; left AMG: −26 −4 −20, right AMG: 26 −2 −20). The same VOIs were used in the post-treatment DCM to ensure continuity between analyses. Regional time series were summarized with the first eigenvariate of all activated (at p<0.01) voxels within the participant-specific VOIs. The VOIs defined above were used to specify the basic 8-region DCM in all participants. Reciprocal connections were defined between these regions both within and between hemispheres. The effect of working-memory load (driving input) entered the PAR bilaterally. Starting from this basic layout, a structured model space was derived by considering the modulatory effect of working-memory load on the inter-regional coupling strength. Random effects Bayesian Model Averaging (BMA) was then conducted to obtain average connectivity estimates across all models for each participant (see Penny, W. D. et al.PLoS Comput Biol6:e1000709 (2010); Stephan, K. E. et al.Neuroimage49:3099-3109 (2010)) as BMA accommodates uncertainty about models when estimating the consistency and strength of connections. The resulting posterior means from the averaged DCM from the baseline and post-treatment datasets were used to test for changes in the modulatory effects of working-memory load on inter-regional connectivity. For completeness, differences between baseline and post-treatment in working memory load-dependent modulation of brain activity were examined using general linear models and are reported inFIG.4. Statistical Analysis Strategy. Effect sizes for repeated measures based on Cohen's d were computed to estimate the post-treatment changes of any given functional measure using equation (1): d=m1-m2s*2(1-r)(1) wherein m1 and m2 are the average value of a given measure at baseline and at post-treatment respectively; s is the average standard-deviation of a given measure at baseline and post-treatment, and r is the value of a given connectivity measure between baseline and post-treatment. Only results with an effect size greater than 0.3 were reported as these were more likely to be meaningful based on the conventional interpretation of Cohen's d (see Cohen, J.Statistical power and analysis for the behavioral sciences. Hillsdale, N.J., Lawrence Erlbaum Associates, Inc., (1988)). Pearson's correlations were used to assess the relationship between change in level of symptoms and change in brain imaging measures. Given the exploratory nature of the study the threshold of statistical inference was p<0.05, uncorrected. Comparison of different clinical measures between baseline and post-treatment scans was based on paired t-tests. Example 2: Post-Treatment Observations in Resting-State Functional Connectivity and Effective Connectivity Twenty-five participants provided signed consent to participate in the present study. Two participants received baseline fMRI scans but were discontinued from the parent clinical trial protocol prior to randomization. Sixteen of these participants had been assigned to the EFMT condition in the parent clinical trial, and seven participants were assigned to the control (CT) condition. Five participants were lost to attrition and did not complete the clinical trial protocol or outcome fMRI scan (two participants in the EFMT group and three participants in the CT group). The current study sample included fourteen participants that completed the EFMT regimen, for whom valid pre-post fMRI and behavioral data were available. Four sham-control participants also had valid pre-post imaging and behavioral data. The current report includes the fourteen EFMT participants with valid pre-post imaging and behavioral data.FIG.5provides the demographic and clinical characteristics of the fourteen EFMT-treated MDD participants in the study. In the parent clinical trial, from which participants in the current study were derived, EFMT was observed to result in significantly superior MDD symptom reduction from baseline to study outcome compared to CT (see Iacoviello, B. M. et al.npj Digital Medicine1:21 (2018)). The fourteen participants in the present sample also demonstrated, on average, a clinical response to the EFMT intervention (Ham-D improvement from a mean score of 19.14 (SD=2.6) at baseline to a mean score of 11.43 (SD=5.12) at study outcome; t(13)=6.88, p<0.001) (FIG.5). Changes in resting-state functional connectivity. As shown inFIG.2B, post-treatment reductions were observed in within-network connectivity in the dDMN (d=−0.38) and SAL (d=−0.36). By contrast, connectivity was increased between the LCEN and RCEN (d=0.30), between the vDMN and dDMN (d=0.32), and between the LCEN and both vDMN (d=0.45) and SAL (d=0.53) (FIG.2B). However, correlations between changes in resting-state connectivity and symptomatic change post-treatment were generally low and did not achieve statistical significance. Effective Connectivity. Bilateral post-treatment reductions were observed in the effective connectivity from the dACC to the AMG (left: d=−0.44; right: d=−0.32) and right-sided increase in the top-down connectivity from the DPFC to the AMG (d=0.33) (FIG.3). The post-treatment change in effective connectivity from both DPFC and DACC to the AMG correlated with a reduction in depressive symptoms as measured with the total score of the HAM-D, with the latter significant at an uncorrected threshold (r=0.51, p=0.05). FIG.6provides a community analysis of 42 healthy control subjects, at rest. These data demonstrate that in healthy subjects the medial-temporal network (hippocampus-amygdala-temporal poles) are sufficiently integrated.FIGS.7A-7Bdemonstrate a community analysis of 7 MDD participants from the EFMT study, at rest prior to treatment (left panel) and after treatment (right panel). These results demonstrate that MDD participants had a less-integrated medial-temporal network prior to EFMT treatment as evidenced by the absence of the black colored dot in left and right brain regions surrounded by the dashed circles, whereas EMFT-treatment partially restored the medial-temporal network of the MDD participants. FIG.6provides a community analysis of 42 healthy control subjects, at rest. These data demonstrate that in healthy subjects the medial-temporal network (hippocampus-amygdala-temporal poles) are sufficiently integrated.FIG.7demonstrates a community analysis of 7 MDD participants from the EFMT study, at rest prior to treatment (left panel) and after treatment (right panel). These results demonstrate that MDD participants had a less-integrated medial-temporal network prior to EFMT treatment, whereas EMFT-treatment partially restored the medial-temporal network of the MDD participants. The results presented herein demonstrate that EFMT training induces neuroplastic changes in patients with MDD. Previous studies have suggested a degree of lateralization in prefrontal dysfunction in MDD, with abnormalities in right DPFC being primarily associated with reduced voluntary control of emotional processing (Grimm et al.Biol Psychiatry.63(4):369-76 (2008)). The results described herein demonstrate that the working-memory-induced modulation of the connectivity from the right DPFC to the right AMG was increased post-EMFT, which was associated with symptomatic improvement. A further post-treatment change concerned the weakening of the functional coupling/effective connectivity between the dACC and AMG. Previous studies have suggested that the dACC shows maladaptive inflexibility in from the very early stages of MDD (Ho et al.Neuropsychopharmacology.42(12):2434-2445 (2017)) because its connectivity does not show the expected variation across different tasks (Shine et al.Neuron92: 544-554 (2016)). A weakening of the connectivity from the dACC to the AMG was observed post EFMT training, which was associated with symptomatic improvement. These data suggest that the reduction in the effective connectivity of the dACC following EFMT training may reflect a shift toward improved dACC functioning in MDD patients. The symptom improvement observed in this study appears to be associated with restoration of the regulatory control of limbic regions as indicated by increased DPFC and decreased dACC connectivity with AMG. SeeFIGS.3A-3B. Post-treatment reduction in the functional connectivity of the dDMN and SAL, and increased integration between networks involved in cognitive control and self-referential and salience processing was also observed. Hypoconnectivity and reduced integration of frontoparietal resting-state networks has been identified as a reliable correlate of MDD (Kaiser et al.JAMA Psychiatry72: 603-611 (2015)). It is therefore interesting to note that most of the post-EMFT changes in between-network resting-state functional connectivity concern the CEN, which is considered a key network for cognitive control (Smith et al.Proc Natl Acad Sci USA.106(31):13040-5 (2009)). The CEN was more integrated across the left and right hemisphere and with the DMN and SAL. This increase in the integration between networks for cognitive control, self-referential and salience processing has the potential to facilitate a more coherent and coordinated response to emotional stimuli in patients with MDD. Moreover, there was also evidence for post-treatment reduction in the functional connectivity of the dDMN, a phenomenon which has also been observed following successful treatment with antidepressants (Brakowski et al.J Psychiatr Res.92:147-159 (2017)). EQUIVALENTS The present technology is not to be limited in terms of the particular embodiments described in this application, which are intended as single illustrations of individual aspects of the present technology. Many modifications and variations of this present technology can be made without departing from its spirit and scope, as will be apparent to those skilled in the art. Functionally equivalent methods and apparatuses within the scope of the present technology, in addition to those enumerated herein, will be apparent to those skilled in the art from the foregoing descriptions. Such modifications and variations are intended to fall within the scope of the present technology. It is to be understood that this present technology is not limited to particular methods, reagents, compounds compositions or biological systems, which can, of course, vary. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting. In addition, where features or aspects of the disclosure are described in terms of Markush groups, those skilled in the art will recognize that the disclosure is also thereby described in terms of any individual member or subgroup of members of the Markush group. As will be understood by one skilled in the art, for any and all purposes, particularly in terms of providing a written description, all ranges disclosed herein also encompass any and all possible subranges and combinations of subranges thereof. Any listed range can be easily recognized as sufficiently describing and enabling the same range being broken down into at least equal halves, thirds, quarters, fifths, tenths, etc. As a non-limiting example, each range discussed herein can be readily broken down into a lower third, middle third and upper third, etc. As will also be understood by one skilled in the art all language such as “up to,” “at least,” “greater than,” “less than,” and the like, include the number recited and refer to ranges which can be subsequently broken down into subranges as discussed above. Finally, as will be understood by one skilled in the art, a range includes each individual member. Thus, for example, a group having 1-3 cells refers to groups having 1, 2, or 3 cells. Similarly, a group having 1-5 cells refers to groups having 1, 2, 3, 4, or 5 cells, and so forth. All patents, patent applications, provisional applications, and publications referred to or cited herein are incorporated by reference in their entirety, including all figures and tables, to the extent they are not inconsistent with the explicit teachings of this specification. | 70,035 |
11862339 | DETAILED DESCRIPTION OF THE INVENTION The terms “based on” and “in response to” are used interchangeably with the present disclosure. The term “processor” encompasses one or more of a local processor, a remote processor, or a processor system, and combinations thereof. The term “feature” is used herein to describe a characteristic or attribute that is relevant to determining the developmental progress of a subject. For example, a “feature” may refer to a clinical characteristic that is relevant to clinical evaluation or diagnosis of a subject for one or more developmental disorders (e.g., age, ability of subject to engage in pretend play, etc.). The term “feature value” is herein used to describe a particular subject's value for the corresponding feature. For example, a “feature value” may refer to a clinical characteristic of a subject that is related to one or more developmental disorders (e.g., if feature is “age”, feature value could be 3; if feature is “ability of subject to engage in pretend play”, feature value could be “variety of pretend play” or “no pretend play”). As used herein, the phrases “autism” and “autism spectrum disorder” may be used interchangeably. As used herein, the phrases “attention deficit disorder (ADD)” and “attention deficit/hyperactivity disorder (ADHD)” may be used interchangeably. As used herein, the term “facial recognition expression activity” refers to the therapeutic activity (e.g., in a digital therapy application or device) wherein children are prompted to find people in their environment displaying a particular emotion and receive real-time emotion confirmation. Facial recognition expression activity can also be described as unstructured play. This activity provides reinforcement that faces have variation in emotion and training on how to differentiate between emotions. As used herein, the phrase “social reciprocity” refers to the back and forth reciprocal social interactions and/or communications between individuals. Social reciprocity can include verbal and non-verbal social interactions such as, for example, a conversation or an exchange of facial expressions and/or body language. One or more elements or indicators of social reciprocity may be measured according to the platforms, systems, devices, methods, and media disclosed herein. For example, social reciprocity can be measured using eye contact or gaze fixation, verbal responsiveness to a social or emotional cue (e.g., saying “hi” in response to a greeting by a parent), non-verbal responsiveness to a social or emotional cue (e.g., smiling in response to a smile from a parent). Described herein are methods and devices for determining the developmental progress of a subject. For example, the described methods and devices can identify a subject as developmentally advanced in one or more areas of development or cognitively declining in one or more cognitive functions, or identify a subject as developmentally delayed or at risk of having one or more developmental disorders. The methods and devices disclosed can determine the subject's developmental progress by evaluating a plurality of characteristics or features of the subject based on an assessment model, wherein the assessment model can be generated from large datasets of relevant subject populations using machine-learning approaches. While methods and devices are herein described in the context of identifying one or more developmental disorders of a subject, the methods and devices are well-suited for use in determining any developmental progress of a subject. For example, the methods and devices can be used to identify a subject as developmentally advanced, by identifying one or more areas of development in which the subject is advanced. To identify one or more areas of advanced development, the methods and devices may be configured to assess one or more features or characteristics of the subject that are related to advanced or gifted behaviors, for example. The methods and devices as described can also be used to identify a subject as cognitively declining in one or more cognitive functions, by evaluating the one or more cognitive functions of the subject. Described herein are methods and devices for diagnosing or assessing risk for one or more developmental disorders in a subject. The method may comprise providing a data processing module, which can be utilized to construct and administer an assessment procedure for screening a subject for one or more of a plurality of developmental disorders or conditions. The assessment procedure can evaluate a plurality of features or characteristics of the subject, wherein each feature can be related to the likelihood of the subject having at least one of the plurality of developmental disorders screenable by the procedure. Each feature may be related to the likelihood of the subject having two or more related developmental disorders, wherein the two or more related disorders may have one or more related symptoms. The features can be assessed in many ways. For example, the features may be assessed via a subject's answers to questions, observations of a subject, or results of a structured interaction with a subject, as described in further detail herein. To distinguish among a plurality of developmental disorders of the subject within a single screening procedure, the procedure can dynamically select the features to be evaluated in the subject during administration of the procedure, based on the subject's values for previously presented features (e.g., answers to previous questions). The assessment procedure can be administered to a subject or a caretaker of the subject with a user interface provided by a computing device. The computing device comprises a processor having instructions stored thereon to allow the user to interact with the data processing module through a user interface. The assessment procedure may take less than 10 minutes to administer to the subject, for example 5 minutes or less. Thus, apparatus and methods described herein can provide a prediction of a subject's risk of having one or more of a plurality of developmental disorders using a single, relatively short screening procedure. The methods and devices disclosed herein can be used to determine a most relevant next question related to a feature of a subject, based on previously identified features of the subject. For example, the methods and devices can be configured to determine a most relevant next question in response to previously answered questions related to the subject. A most predictive next question can be identified after each prior question is answered, and a sequence of most predictive next questions and a corresponding sequence of answers generated. The sequence of answers may comprise an answer profile of the subject, and the most predictive next question can be generated in response to the answer profile of the subject. The methods and devices disclosed herein are well suited for combinations with prior questions that can be used to diagnose or identify the subject as at risk in response to fewer questions by identifying the most predictive next question in response to the previous answers, for example. In one aspect, a method of providing an evaluation of at least one cognitive function attribute of a subject comprises the operations of: on a computer system having a processor and a memory storing a computer program for execution by the processor. The computer program may comprise instructions for: 1) receiving data of the subject related to the cognitive function attribute; 2) evaluating the data of the subject using a machine learning model; and 3) providing an evaluation for the subject. The evaluation may be selected from the group consisting of an inconclusive determination and a categorical determination in response to the data. The machine learning model may comprise a selected subset of a plurality of machine learning assessment models. The categorical determination may comprise a presence of the cognitive function attribute and an absence of the cognitive function attribute. Receiving data from the subject may comprise receiving an initial set of data. Evaluating the data from the subject may comprise evaluating the initial set of data using a preliminary subset of tunable machine learning assessment models selected from the plurality of tunable machine learning assessment models to output a numerical score for each of the preliminary subset of tunable machine learning assessment models. The method may further comprise providing a categorical determination or an inconclusive determination as to the presence or absence of the cognitive function attribute in the subject based on the analysis of the initial set of data, wherein the ratio of inconclusive to categorical determinations can be adjusted. The method may further comprise the operations of: 1) determining whether to apply additional assessment models selected from the plurality of tunable machine learning assessment models if the analysis of the initial set of data yields an inconclusive determination; 2) receiving an additional set of data from the subject based on an outcome of the decision; 3) evaluating the additional set of data from the subject using the additional assessment models to output a numerical score for each of the additional assessment models based on the outcome of the decision; and 4) providing a categorical determination or an inconclusive determination as to the presence or absence of the cognitive function attribute in the subject based on the analysis of the additional set of data from the subject using the additional assessment models. The ratio of inconclusive to categorical determinations may be adjusted. The method may further comprise the operations: 1) combining the numerical scores for each of the preliminary subset of assessment models to generate a combined preliminary output score; and 2) mapping the combined preliminary output score to a categorical determination or to an inconclusive determination as to the presence or absence of the cognitive function attribute in the subject. The ratio of inconclusive to categorical determinations may be adjusted. The method may further comprise the operations of: 1) combining the numerical scores for each of the additional assessment models to generate a combined additional output score; and 2) mapping the combined additional output score to a categorical determination or to an inconclusive determination as to the presence or absence of the cognitive function attribute in the subject. The ratio of inconclusive to categorical determinations may be adjusted. The method may further comprise employing rule-based logic or combinatorial techniques for combining the numerical scores for each of the preliminary subset of assessment models and for combining the numerical scores for each of the additional assessment models. The ratio of inconclusive to categorical determinations may be adjusted by specifying an inclusion rate and wherein the categorical determination as to the presence or absence of the developmental condition in the subject is assessed by providing a sensitivity and specificity metric. The inclusion rate may be no less than 70% with the categorical determination resulting in a sensitivity of at least 70% with a corresponding specificity in of at least 70%. The inclusion rate may be no less than 70% with the categorical determination resulting in a sensitivity of at least 80 with a corresponding specificity in of at least 80%. The inclusion rate may be no less than 70% with the categorical determination resulting in a sensitivity of at least 90% with a corresponding specificity in of at least 90%. The data from the subject may comprise at least one of a sample of a diagnostic instrument, wherein the diagnostic instrument comprises a set of diagnostic questions and corresponding selectable answers, and demographic data. The method may further comprise training a plurality of tunable machine learning assessment models using data from a plurality of subjects previously evaluated for the developmental condition. The training may comprise the operations of: 1) pre-processing the data from the plurality of subjects using machine learning techniques; 2) extracting and encoding machine learning features from the pre-processed data; 3) processing the data from the plurality of subjects to mirror an expected prevalence of a cognitive function attribute among subjects in an intended application setting; 4) selecting a subset of the processed machine learning features; 5) evaluating each model in the plurality of tunable machine learning assessment models for performance; and 6) determining an optimal set of parameters for each model based on determining the benefit of using all models in a selected subset of the plurality of tunable machine learning assessment models. Each model may be evaluated for sensitivity and specificity for a pre-determined inclusion rate. Determining an optimal set of parameters for each model may comprise tuning the parameters of each model under different tuning parameter settings. Processing the encoded machine learning features may comprise computing and assigning sample weights to every sample of data. Each sample of data may correspond to a subject in the plurality of subjects. Samples may be grouped according to subject-specific dimensions. Sample weights may be computed and assigned to balance one group of samples against every other group of samples to mirror the expected distribution of each dimension among subjects in an intended setting. The subject-specific dimensions may comprise a subject's gender, the geographic region where a subject resides, and a subject's age. Extracting and encoding machine learning features from the pre-processed data may comprise using feature encoding techniques such as but not limited to one-hot encoding, severity encoding, and presence-of-behavior encoding. Selecting a subset of the processed machine learning features may comprise using bootstrapping techniques to identify a subset of discriminating features from the processed machine learning features. The cognitive function attribute may comprise a behavioral disorder and a developmental advancement. The categorical determination provided for the subject may be selected from the group consisting of an inconclusive determination, a presence of multiple cognitive function attributes and an absence of multiple cognitive function attributes in response to the data. In another aspect, an apparatus to evaluate a cognitive function attribute of a subject may comprise a processor. The processor may be configured with instructions that, when executed, cause the processor to receive data of the subject related to the cognitive function attribute and applies rules to generate a categorical determination for the subject. The categorical determination may be selected from a group consisting of an inconclusive determination, a presence of the cognitive function attribute, and an absence of the cognitive function attribute in response to the data. The cognitive function attribute may be determined with a sensitivity of at least 70% and a specificity of at least 70%, respectively, for the presence or the absence of the cognitive function attribute. The cognitive function attribute may be selected from a group consisting of autism, autistic spectrum, attention deficit disorder, attention deficit hyperactive disorder and speech and learning disability. The cognitive function attribute may be determined with a sensitivity of at least 80% and a specificity of at least 80%, respectively, for the presence or the absence of the cognitive function attribute. The cognitive function attribute may be determined with a sensitivity of at least 90% and a specificity of at least 90%, respectively, for the presence or the absence of the cognitive function attribute. The cognitive function attribute may comprise a behavioral disorder and a developmental advancement. In another aspect, a non-transitory computer-readable storage media encoded with a computer program including instructions executable by a processor to evaluate a cognitive function attribute of a subject comprises a database, recorded on the media. The database may comprise data of a plurality of subjects related to at least one cognitive function attribute and a plurality of tunable machine learning assessment models; an evaluation software module; and a model tuning software module. The evaluation software module may comprise instructions for: 1) receiving data of the subject related to the cognitive function attribute; 2) evaluating the data of the subject using a selected subset of a plurality of machine learning assessment models; and 3) providing a categorical determination for the subject, the categorical determination selected from the group consisting of an inconclusive determination, a presence of the cognitive function attribute and an absence of the cognitive function attribute in response to the data. The model tuning software module may comprise instructions for: 1) pre-processing the data from the plurality of subjects using machine learning techniques; 2) extracting and encoding machine learning features from the pre-processed data; 3) processing the encoded machine learning features to mirror an expected distribution of subjects in an intended application setting; 4) selecting a subset of the processed machine learning features; 5) evaluating each model in the plurality of tunable machine learning assessment models for performance; 6) tuning the parameters of each model under different tuning parameter settings; and 7) determining an optimal set of parameters for each model based on determining the benefit of using all models in a selected subset of the plurality of tunable machine learning assessment models. Each model may be evaluated for sensitivity and specificity for a pre-determined inclusion rate. The cognitive function attribute may comprise a behavioral disorder and a developmental advancement. In another aspect, a computer-implemented system may comprise a digital processing device. The digital processing may comprise at least one processor, an operating system configured to perform executable instructions, a memory, and a computer program. The memory may comprise storage for housing data of a plurality of subjects related to at least one cognitive function attribute and storage for housing a plurality of machine learning assessment models. The computer program may include instructions executable by the digital processing device for: 1) receiving data of the subject related to the cognitive function attribute; 2) evaluating the data of the subject using a selected subset of a plurality of machine learning assessment models; and 3) providing a categorical determination for the subject, the categorical determination selected from the group consisting of an inconclusive determination, a presence of the cognitive function attribute and an absence of the cognitive function attribute in response to the data. The cognitive function attribute may comprise a behavioral disorder and a developmental advancement. In another aspect, a mobile device for providing an evaluation of at least one cognitive function attribute of a subject may comprise a display and a processor. The processor may be configured with instructions to receive and display data of the subject related to the cognitive function attribute and receive and display an evaluation for the subject. The evaluation may be selected from the group consisting of an inconclusive determination and a categorical determination. The evaluation for the subject may be determined in response to the data of the subject. The categorical determination may be selected from the group consisting of a presence of the cognitive function attribute and an absence of the cognitive function attribute. The cognitive function attribute may be determined with a sensitivity of at least 80 and a specificity of at least 80, respectively, for the presence or the absence of the cognitive function attribute. The cognitive function attribute may be determined with a sensitivity of at least 90 and a specificity of at least 90, respectively, for the presence or the absence of the cognitive function attribute. The cognitive function attribute may comprise a behavioral disorder and a developmental advancement. In another aspect, a digital therapeutic system to treat a subject with a personal therapeutic treatment plan may comprise one or more processors, a diagnostic module to receive data from the subject and output diagnostic data for the subject, and a therapeutic module to receive the diagnostic data and output the personal therapeutic treatment plan for the subject. The diagnostic module may comprise one or more classifiers built using machine learning or statistical modeling based on a subject population to determine the diagnostic data for the subject. The diagnostic data may comprise an evaluation for the subject, the evaluation selected from the group consisting of an inconclusive determination and a categorical determination in response to data received from the subject. The therapeutic module may comprise one or more models built using machine learning or statistical modeling based on at least a portion the subject population to determine and output the personal therapeutic treatment plan of the subject. The diagnostic module may be configured to receive updated subject data from the subject in response to therapy of the subject and generate updated diagnostic data from the subject. The therapeutic module may be configured to receive the updated diagnostic data and output an updated personal treatment plan for the subject in response to the diagnostic data and the updated diagnostic data. The diagnostic module may comprise a diagnostic machine learning classifier trained on the subject population. The therapeutic module may comprise a therapeutic machine learning classifier trained on the at least the portion of the subject population. The diagnostic module and the therapeutic module may be arranged for the diagnostic module to provide feedback to the therapeutic module based on performance of the treatment plan. The therapeutic classifier may comprise instructions trained on a data set comprising a population of which the subject is not a member. The subject may comprise a person who is not a member of the population. The diagnostic module may comprise a diagnostic classifier trained on plurality of profiles of a subject population of at least 10,000 people and therapeutic profile trained on the plurality of profiles of the subject population. In another aspect, a digital therapeutic system to treat a subject with a personal therapeutic treatment plan may comprise a processor, a diagnostic module to receive data from the subject and output diagnostic data for the subject, and a therapeutic module to receive the diagnostic data and output the personal therapeutic treatment plan for the subject. The diagnostic data may comprise an evaluation for the subject, the evaluation selected from the group consisting of an inconclusive determination and a categorical determination in response to data received from the subject. The personal therapeutic treatment plan may comprise digital therapeutics. The digital therapeutics may comprise instructions, feedback, activities or interactions provided to the subject or caregiver. The digital therapeutics may be provided with a mobile device. The diagnostics data and the personal therapeutic treatment plan may be provided to a third-party system. The third-party system may comprise a computer system of a health care professional or a therapeutic delivery system. The diagnostic module may be configured to receive updated subject data from the subject in response to a feedback data of the subject and generate updated diagnostic data. The therapeutic module may be configured to receive the updated diagnostic data and output an updated personal treatment plan for the subject in response to the diagnostic data and the updated diagnostic data. The updated subject data may be received in response to a feedback data that identifies relative levels of efficacy, compliance and response resulting from the personal therapeutic treatment plan. The diagnostic module may use machine learning or statistical modeling based on a subject population to determine the diagnostic data. The therapeutic module may be based on at least a portion the subject population to determine the personal therapeutic treatment plan of the subject. The diagnostic module may comprise a diagnostic machine learning classifier trained on a subject population. The therapeutic module may comprise a therapeutic machine learning classifier trained on at least a portion of the subject population. The diagnostic module may be configured to provide feedback to the therapeutic module based on performance of the personal therapeutic treatment plan. The data from the subject may comprise at least one of the subject and caregiver video, audio, responses to questions or activities, and active or passive data streams from user interaction with activities, games or software features of the system. The subject may have a risk selected from the group consisting of a behavioral disorder, neurological disorder and mental health disorder. The behavioral, neurological or mental health disorder may be selected from the group consisting of autism, autistic spectrum, attention deficit disorder, depression, obsessive compulsive disorder, schizophrenia, Alzheimer's disease, dementia, attention deficit hyperactive disorder and speech and learning disability. The diagnostic module may be configured for an adult to perform an assessment or provide data for an assessment of a child or juvenile. The diagnostic module may be configured for a caregiver or family member to perform an assessment or provide data for an assessment of the subject. In another aspect, a non-transitory computer-readable storage media may be encoded with a program. The computer program may include executable instructions for: 1) receiving input data from the subject and outputting diagnostic data for the subject; 2) receiving the diagnostic data and outputting a personal therapeutic treatment plan for the subject; and 3) evaluating the diagnostic data based on at least a portion the subject population to determine and output the personal therapeutic treatment plan of the subject. The diagnostic data may comprise an evaluation for the subject, the evaluation selected from the group consisting of an inconclusive determination and a categorical determination in response to input data received from the subject. Updated subject input data may be received from the subject in response to therapy of the subject and updated diagnostic data may be generated from the subject. Updated diagnostic data may be received and an updated personal treatment plan may be outputted for the subject in response to the diagnostic data and the updated diagnostic data. In another aspect, a non-transitory computer-readable storage media may be encoded with a computer program. The computer program may include executable instructions for receiving input data from a subject and outputting diagnostic data for the subject and receiving the diagnostic data and outputting a personal therapeutic treatment plan for the subject. The diagnostic data may comprise an evaluation for the subject, the evaluation selected from the group consisting of an inconclusive determination and a categorical determination in response to data received from the subject. The personal therapeutic treatment plan may comprise digital therapeutics. In another aspect, a method of treating a subject with a personal therapeutic treatment plan may comprise a diagnostic process of receiving data from the subject and outputting diagnostic data for the subject wherein the diagnostic data comprises an evaluation for the subject and a therapeutic process of receiving the diagnostic data and outputting the personal therapeutic treatment plan for the subject. The evaluation may be selected from the group consisting of an inconclusive determination and a categorical determination in response to data received from the subject. The diagnostic process may comprise receiving updated subject data from the subject in response to a therapy of the subject and generating an updated diagnostic data from the subject. The therapeutic process may comprise receiving the updated diagnostic data and outputting an updated personal treatment plan for the subject in response to the diagnostic data and the updated diagnostic data. The updated subject data may be received in response to a feedback data that identifies relative levels of efficacy, compliance and response resulting from the personal therapeutic treatment plan. The personal therapeutic treatment plan may comprise digital therapeutics. The digital therapeutics may comprise instructions, feedback, activities or interactions provided to the subject or caregiver. The digital therapeutics may be provided with a mobile device. The method may further comprise providing the diagnostics data and the personal therapeutic treatment plan to a third-party system. The third-party system may comprise a computer system of a health care professional or a therapeutic delivery system. The diagnostic process may be performed by a process selected from the group consisting of machine learning, a classifier, artificial intelligence, or statistical modeling based on a subject population to determine the diagnostic data. The therapeutic process may be performed by a process selected from the group consisting of machine learning, a classifier, artificial intelligence, or statistical modeling based on at least a portion the subject population to determine the personal therapeutic treatment plan of the subject. The diagnostic process may be performed by a diagnostic machine learning classifier trained on a subject population. The therapeutic process may be performed by a therapeutic machine learning classifier trained on at least a portion of the subject population. The diagnostic process may comprise providing feedback to the therapeutic module based on performance of the personal therapeutic treatment plan. The data from the subject may comprise at least one of the subject and caregiver video, audio, responses to questions or activities, and active or passive data streams from user interaction with activities, games or software features. The diagnostic process may be performed by an adult to perform an assessment or provide data for an assessment of a child or juvenile. The diagnostic process may enable a caregiver or family member to perform an assessment or provide data for an assessment of the subject. The subject may have a risk selected from the group consisting of a behavioral disorder, neurological disorder, and mental health disorder. The risk may be selected from the group consisting of autism, autistic spectrum, attention deficit disorder, depression, obsessive compulsive disorder, schizophrenia, Alzheimer's disease, dementia, attention deficit hyperactive disorder, and speech and learning disability. Disclosed herein are systems and methods that provide diagnosis together with digital therapy using readily available computing devices (e.g. smartphones) and utilize machine learning. Described herein are methods and devices for evaluating and treating an individual having one or more diagnoses from the related categories of behavioral disorders, developmental delays, and neurologic impairments. In some embodiments, an evaluation comprises an identification or confirmation of a diagnosis of an individual wherein the diagnosis falls within one or more of the related categories of diagnoses comprising: behavioral disorders, developmental delays, and neurologic impairments. In some embodiments, an evaluation as carried out by a method or device described herein comprises an assessment of whether an individual will respond to a treatment. In some embodiments, an evaluation as carried out by a method or device described herein comprises an assessment of the degree to which an individual will respond to a particular treatment. For example, in some embodiments, an individual is assessed, using the methods or devices described herein, as being highly responsive to a digital therapy. In some embodiments, a digital therapy is administered when it is determined that an individual will be highly responsive to the digital therapy. Also described herein are personalized treatment regimen comprising digital therapeutics, non-digital therapeutics, pharmaceuticals, or any combination thereof. In some embodiments, a therapeutic agent is administered together with the digital therapy. In some embodiments, a therapeutic agent administered together with a digital therapy is configured to improve the performance of the digital therapy for the individual receiving the digital therapy. In some embodiments, a therapeutic agent administered with a digital therapy improves the cognition of the individual receiving the digital therapy. In some embodiments, the therapeutic agent relaxes the individual receiving the digital therapy. In some embodiments, the therapeutic agent improves the level of concentration or focus of the individual receiving the digital therapy. Digital therapeutics can comprise instructions, feedback, activities or interactions provided to an individual or caregiver by a method or device described herein. Digital therapeutics in some embodiments are configured to suggest behaviors, activities, games or interactive sessions with system software and/or third party devices. The digital therapeutics utilized by the methods and devices described herein can be implemented using various digital applications, including augmented reality, virtual reality, real-time cognitive assistance, or other behavioral therapies augmented using technology. Digital therapeutics can be implemented using any device configured to produce a virtual or augmented reality environment. Such devices can be configured to include one or more sensor inputs such as video and/or audio captured using a camera and/or microphone. Non-limiting examples of devices suitable for providing digital therapy as described herein include wearable devices, smartphones, tablet computing devices, laptops, projectors and any other device suitable for producing virtual or augmented reality experiences. The systems and methods described herein can provide social learning tools or aids for users through technological augmentation experiences (e.g., augmented reality and/or virtual reality). In some embodiments, a digital therapy is configured to promote or improve social reciprocity in an individual. In some embodiments, a digital therapy is configured to promote or improve social reciprocity in an individual having autism or autism spectrum disorder. In some embodiments of the methods and devices described herein, a method or device for delivering a virtual or augmented reality based digital therapy receives inputs and in some of these embodiments an input affects how a virtual or augmented reality is presented to an individual receiving therapy. In some embodiments, an input is received from a camera and/or microphone of a computing device used to deliver the digital therapy. In some instances, an inputs is received from a sensor such as, for example, a motion sensor or a vital sign sensor. In some embodiments, inputs in the form of videos, images, and/or sounds are captured and analyzed using algorithm(s) such as artificial intelligence or machine learning models to provide feedback and/or behavioral modification to the subject through the virtual or augmented reality experience that is provided. In some embodiments, an input to a method or device comprises an evaluation of a facial expression or other social cue of one or more other individuals that a digital therapy recipient interacts with either in a virtual reality or an augmented reality interaction. In a non-limiting example of an augmented reality digital therapy experience, an individual may react with a real person, and in this example, a video, image, and/or sound recording of the person is taken by the computing device that is delivering the digital therapy. Then, the video, image, and/or sound recording is analyzed using analysis classifier that determines an emotion associated with a facial expression (or other social cue) of the person interacted with by the individual in the augmented reality environment. An analysis of the facial expression (or other social cue) may comprise an assessment of an emotion or a mood associated with the facial expression and/or other social cue. The result of the analysis is then provided to the individual receiving the digital therapy. In some embodiments, the result of the analysis is displayed within the augmented reality environment. In some embodiments, the result of the analysis is displayed on a screen of a computing device. In some embodiments, the result of the analysis is provided via an audible sound or message. In a non-limiting example of an virtual reality digital therapy experience, an individual receiving the digital therapy may interact with an image or representation of a real person or an image or representation of a virtual object or character such as a cartoon character or other artistic rendering of an interactive object. In this example, the software determines an emotion that is conveyed by the virtual person, character, or object within the virtual reality environment. The result of the analysis is then provided to the individual receiving the digital therapy. In some embodiments, the result of the analysis is displayed within the augmented reality environment. In some embodiments, the result of the analysis is displayed on a screen of a computing device. In some embodiments, the result of the analysis is provided via an audible sound or message. As a further illustrative example, a smiling individual that is interacted with by a digital therapy recipient is evaluated as being happy. In this example, the input comprises the evaluation of the facial expression or other social cue and it is displayed to or otherwise made available to the recipient of digital therapy to help with learning to recognize these facial expressions or social cues. That is, in this example, the emotion that the individual is evaluated as expressing (in this example happiness) is displayed or otherwise made available to the digital therapy recipient, by, for example, displaying the word “happy” on a screen of a mobile computing during or around the time that the individual is smiling in the virtual or augmented reality experience. Examples of emotions that can be detected and/or used in various games or activities as described herein include happy, sad, angry, surprise, frustrated, afraid/scared, calm, disgusted, and contempt. In certain instances, the device uses audio or visual signals to communicate to the subject the emotion or social cue detected for the other individual captured as input(s). Visual signals can be displayed as words, designs or pictures, emoticons, colors, or other visual cues that correspond to detected emotions or social cues. Audio signals can be communicated as audio words, sounds such as tones or beats, music, or other audio cues that correspond to detected emotions or social cues. In some cases, a combination of visual and audio signals are utilized. These cues can be customized or selected from an array of cues to provide a personalized set of audio/visual signals. Signals can also be switched on or off as part of this customized experience. In certain instances, the digital therapy experience comprises an activity mode. The activity mode can include an emotion elicitation activity, an emotion recognition activity, or unstructured play. The unstructured play can be an unscripted, free roaming, or otherwise unstructured mode in which a user is free to engage in one or more digital therapy activities. An example of an unstructured mode is a game or activity in which the user is free to collect one or more images or representations of real persons or images or representations of virtual objects or characters such as a cartoon character or other artistic rendering of an interactive object. This unstructured mode can be characterized as having a “sandbox” style of play that places few limitations on user decisions or gameplay in contrast to a progression style that forces a user into a series of tasks. The user can collect such images using the camera of a device such as a smartphone (e.g., taking pictures of other individuals such as a family member or caretaker). Alternatively or in combination, the user can collect images or representations digitally such as via browsing a library or database. As an illustrative example, the user wanders around his house and takes photographs of his parents using a smartphone camera. In addition, the user collects selfies posted by a family member on social media by selecting and/or downloading the photographs onto the smartphone. In some cases, the device displays the live image or a captured or downloaded image along with the identified or classified emotion for the person in the image. This allows the user to engage in unstructured learning while encountering real world examples of emotions being expressed by various other individuals. An emotion recognition activity can be configured to test and/or train a user to recognize emotions or emotional cues through a structured learning experience. For example, an emotion recognition activity can be used to help a user engage in reinforcement learning by providing images the user has already previously been exposed to (e.g., photographs of a caretaker the user captured during unstructured play). Reinforcement learning allows a user to reinforce their recognition of emotions that have already been shown to them previously. The reinforcement learning can include one or more interactive activities or games. One example is a game in which the user is presented with multiple images corresponding to different emotions (e.g., smartphone screen shows an image of a person smiling and another image of a person frowning) and a prompt to identify an image corresponding to a particular emotion (e.g., screen shows or microphone outputs a question or command for user to identify the correct image). The user can respond by selecting one of the multiple images on the screen or providing an audio response (e.g., stating “left/middle/right image” or “answer A/B/C”). Another example is a game in which the user is presented with a single image corresponding to an emotion and asked to identify the emotion. In some cases, the user is given a choice of multiple emotions. Alternatively, the user must provide a response without being given a selection of choices (e.g., a typed or audio short answer instead of a multiple choice selection). In some cases, a selection of choices is provided. The selection of choices can be visual or non-visual (e.g., an audio selection not shown on the graphic user interface). As an illustrative example, the user is shown an image of a caregiver smiling and prompted by the following audio question “Is this person happy or sad?”. Alternatively, the question is shown on the screen. The user can then provide an audio answer or type out an answer. Another example is a game in which a user is presented with multiple images and multiple emotions and can match the images to the corresponding emotions. In certain instances, the photographed and/or downloaded images are tagged, sorted, and/or filtered for use in one or more activities or games as part of the digital therapy experience. For example, since reinforcement learning can entail the user being queried regarding images that the user has already exposed to, the library of available images may be filtered to remove images that do not satisfy one or more of the following rules: (1) at least one face is successfully detected; (2) at least one emotion is successfully detected; (3) the image has been presented or shown to the user previously. In some cases, the images are further filtered depending the specific activity. For example, a user may be assigned an emotion recognition reinforcement learning activity specifically directed to recognizing anger due to poor performance in previous activities; therefore, the images used for this reinforcement learning activity may also be filtered to include at least one image where anger or an emotional cue corresponding to anger is detected. In certain instances, the photographed and/or downloaded images are imported into a library of collected images that is accessible by the digital therapeutic software. Alternatively or in combination, the images can be tagged such that they are recognized by the digital therapeutic software as images collected for the purpose of the interactive digital therapy experience. Tagging can be automatic when the user takes photographs within the context of the interactive digital therapy experience. As an illustrative example, a user opens up a digital therapy application on the smartphone and selects the unscripted or free roaming mode. The smartphone then presents a photography interface on its touchscreen along with written and/or audio instructions for taking photographs of other person's faces. Any photographs the user captures using the device camera is then automatically tagged and/or added to the library or database. Alternatively, the user browsing social media outside of the digital therapy application selects a posted image and selects an option to download, import, or tag the image for access by the digital therapy application. In certain instances, images are tagged to identify relevant information. This information can include the identity of a person in the image (e.g., name, title, relationship to the user) and/or the facial expression or emotion expressed by the person in the image. Facial recognition and emotion classification as described herein can be used to evaluate an image to generate or determine one or more tags for the image. As an illustrative example, a user takes a photograph of his caretaker, the photograph is screened for facial recognition, followed by emotion classification based on the recognized face. The classified emotion is “HAPPY”, which results in the image being tagged with the identified emotion. In some cases, the tagging is performed by another user, for example, a parent or caregiver. As an illustrative example, the parent logs into the digital therapeutic application and accesses the library or database of images collected by the user. The parent sorts for untagged images and then selects the appropriate tags for the emotions expressed by the person within the images. As an illustrative example, a computing device comprising a camera and microphone tracks faces and classifies the emotions of the digital therapy recipient's social partners using an outward-facing camera and microphone, and provides two forms of cues to the digital therapy recipient in real time. The device also has an inward-facing digital display having a peripheral monitor and a speaker. An expression of an individual interacted with by the digital therapy recipient is assessed using a machine learning classifier and when a face is classified as expressing an emotion, the emotion is an input to the device and is displayed or otherwise presented to the recipient of the digital therapy. In some cases, the device also comprises an inward-facing camera (e.g., a “selfie” camera) and tracks and classifies the emotions of the digital therapy recipient. The tracking and classification of the emotions of the social partner and the emotions of the digital therapy recipient can be performed in real time simultaneously or in close temporal proximity (e.g., within 1, 2, 3, 4, or 5 seconds of each other, or some other appropriate time frame). Alternatively, images may be captured of the social partner and/or digital therapy recipient and then evaluated to track and classify their respective emotions at a later time (i.e., not in real time). This allows the social interaction between the patient and the target individual to be captured, for example, as the combined facial expression and/or emotion of both persons. In some cases, the detected expressions and/or emotions of the parties to a social interaction are time-stamped or otherwise ordered so as to determine a sequence of expressions, emotions, or other interactions that make up one or more social interactions. These social interactions can be evaluated for the patient's ability to engage in social reciprocity. As an illustrative example, the patient points the phone at his parent who smiles at him. The display screen of the phone displays an emoticon of a smiley face in real time to help the patient recognize the emotion corresponding to his parent's facial expression. In addition, the display screen optionally provides instructions for the patient to respond to the parent. The patient does not smile back at his parent, and the inward facing camera captures this response in one or more images or video. The images and/or videos and a timeline or time-stamped sequence of social interactions are then saved on the device (and optionally uploaded or saved on a remote network or cloud). In this case, the parent's smile is labeled as a “smile”, and the patient's lack of response is labeled as “non-responsive” or “no smile”. Thus, this particular social interaction is determined to be a failure to engage in smile-reciprocity. The social interaction can also be further segmented based on whether the target individual (parent) and the patient expressed a “genuine” smile as opposed to a “polite smile”. For example, the algorithms and classifiers described herein for detecting a “smile” or “emotion” can be trained to distinguish between genuine and polite smiles, which can be differentiated based on visual cues corresponding to the engagement of eye muscles in genuine smiles and the lack of eye muscle engagement in police smiles. This differentiation in types or subtypes of emotions or facial expressions can be based on training the algorithms or classifiers on the appropriate data set of labeled images, for example, images labeled with “polite” vs “genuine” smiles. In some aspects, the platforms, systems, devices, methods, and media disclosed herein comprise a software application configured to enable management and/or monitoring of the digital therapeutics. The software application can be a mobile application, a web application, or other computer application. In some cases, the application provides a control center that allows the subject or a caregiver of the subject to manage the device. The device can enable a user to review, upload, or delete captured data such as videos, audios, photos, or detected or classified emotional cues. A user can also use the device to enter or configure settings such as, for example, data capture settings (e.g., what kind of data is captured, how long it is stored, etc.). In some cases, the application obtains images (e.g., stills from captured video), executes an emotional cue classifier, and/or saves video and usage data. Sometimes, the platforms, systems, devices, methods, and media disclosed herein provide digital therapeutics having an interactive feature. The interactive feature in an embodiment is configured so that the digital therapy recipient guesses an emotion of another person based on a facial expression or social cues for all persons interacting with the individual. In some instances, the platforms, systems, devices, methods, and media disclosed herein provide a user with the option to delete captured data such as videos or audios. This option preserves the privacy of the family by enabling them to delete the data. Metrics on the captured data can be obtained or calculated such as usage, age of video, whether the video was saved or deleted, usage during the intervention period, and other relevant parameters. In some cases, the device operates at a frame rate of ˜15-20 FPS, which enables facial expressions recognition within 100 ms. The device can operate at a frame rate of 10 FPS to 100 FPS. The device can operate at a frame rate of 10 FPS to 15 FPS, 10 FPS to 20 FPS, 10 FPS to 25 FPS, 10 FPS to 30 FPS, 10 FPS to 35 FPS, 10 FPS to 40 FPS, 10 FPS to 45 FPS, 10 FPS to 50 FPS, 10 FPS to 60 FPS, 10 FPS to 80 FPS, 10 FPS to 100 FPS, 15 FPS to 20 FPS, 15 FPS to 25 FPS, 15 FPS to 30 FPS, 15 FPS to 35 FPS, 15 FPS to 40 FPS, 15 FPS to 45 FPS, 15 FPS to 50 FPS, 15 FPS to 60 FPS, 15 FPS to 80 FPS, 15 FPS to 100 FPS, 20 FPS to 25 FPS, 20 FPS to 30 FPS, 20 FPS to 35 FPS, 20 FPS to 40 FPS, 20 FPS to 45 FPS, 20 FPS to 50 FPS, 20 FPS to 60 FPS, 20 FPS to 80 FPS, 20 FPS to 100 FPS, 25 FPS to 30 FPS, 25 FPS to 35 FPS, 25 FPS to 40 FPS, 25 FPS to 45 FPS, 25 FPS to 50 FPS, 25 FPS to 60 FPS, 25 FPS to 80 FPS, 25 FPS to 100 FPS, 30 FPS to 35 FPS, 30 FPS to 40 FPS, 30 FPS to 45 FPS, 30 FPS to 50 FPS, 30 FPS to 60 FPS, 30 FPS to 80 FPS, 30 FPS to 100 FPS, 35 FPS to 40 FPS, 35 FPS to 45 FPS, 35 FPS to 50 FPS, 35 FPS to 60 FPS, 35 FPS to 80 FPS, 35 FPS to 100 FPS, 40 FPS to 45 FPS, 40 FPS to 50 FPS, 40 FPS to 60 FPS, 40 FPS to 80 FPS, 40 FPS to 100 FPS, 45 FPS to 50 FPS, 45 FPS to 60 FPS, 45 FPS to 80 FPS, 45 FPS to 100 FPS, 50 FPS to 60 FPS, 50 FPS to 80 FPS, 50 FPS to 100 FPS, 60 FPS to 80 FPS, 60 FPS to 100 FPS, or 80 FPS to 100 FPS. The device can operate at a frame rate of 10 FPS, 15 FPS, 20 FPS, 25 FPS, 30 FPS, 35 FPS, 40 FPS, 45 FPS, 50 FPS, 60 FPS, 80 FPS, or 100 FPS. The device can operate at a frame rate of at least 10 FPS, 15 FPS, 20 FPS, 25 FPS, 30 FPS, 35 FPS, 40 FPS, 45 FPS, 50 FPS, 60 FPS, or 80 FPS. The device can operate at a frame rate of at most 15 FPS, 20 FPS, 25 FPS, 30 FPS, 35 FPS, 40 FPS, 45 FPS, 50 FPS, 60 FPS, 80 FPS, or 100 FPS. In some cases, the device can detect facial expressions or motions within 10 ms to 200 ms. The device can detect facial expressions or motions within 10 ms to 20 ms, 10 ms to 30 ms, 10 ms to 40 ms, 10 ms to 50 ms, 10 ms to 60 ms, 10 ms to 70 ms, 10 ms to 80 ms, 10 ms to 90 ms, 10 ms to 100 ms, 10 ms to 150 ms, 10 ms to 200 ms, 20 ms to 30 ms, 20 ms to 40 ms, 20 ms to 50 ms, 20 ms to 60 ms, 20 ms to 70 ms, 20 ms to 80 ms, 20 ms to 90 ms, 20 ms to 100 ms, 20 ms to 150 ms, 20 ms to 200 ms, 30 ms to 40 ms, 30 ms to 50 ms, 30 ms to 60 ms, 30 ms to 70 ms, 30 ms to 80 ms, 30 ms to 90 ms, 30 ms to 100 ms, 30 ms to 150 ms, 30 ms to 200 ms, 40 ms to 50 ms, 40 ms to 60 ms, 40 ms to 70 ms, 40 ms to 80 ms, 40 ms to 90 ms, 40 ms to 100 ms, 40 ms to 150 ms, 40 ms to 200 ms, 50 ms to 60 ms, 50 ms to 70 ms, 50 ms to 80 ms, 50 ms to 90 ms, 50 ms to 100 ms, 50 ms to 150 ms, 50 ms to 200 ms, 60 ms to 70 ms, 60 ms to 80 ms, 60 ms to 90 ms, 60 ms to 100 ms, 60 ms to 150 ms, 60 ms to 200 ms, 70 ms to 80 ms, 70 ms to 90 ms, 70 ms to 100 ms, 70 ms to 150 ms, 70 ms to 200 ms, 80 ms to 90 ms, 80 ms to 100 ms, 80 ms to 150 ms, 80 ms to 200 ms, 90 ms to 100 ms, 90 ms to 150 ms, 90 ms to 200 ms, 100 ms to 150 ms, 100 ms to 200 ms, or 150 ms to 200 ms. The device can detect facial expressions or motions within 10 ms, 20 ms, 30 ms, 40 ms, 50 ms, 60 ms, 70 ms, 80 ms, 90 ms, 100 ms, 150 ms, or 200 ms. The device can detect facial expressions or motions within at least 10 ms, 20 ms, 30 ms, 40 ms, 50 ms, 60 ms, 70 ms, 80 ms, 90 ms, 100 ms, or 150 ms. The device can detect facial expressions or motions within at most 20 ms, 30 ms, 40 ms, 50 ms, 60 ms, 70 ms, 80 ms, 90 ms, 100 ms, 150 ms, or 200 ms. Disclosed herein are platforms, systems, devices, methods, and media that provide a machine learning framework for detecting emotional or social cues. Input data can include image and/or video data and optionally additional sensor data (e.g., accelerometer data, audio data, etc.). The input data is provided into an emotion detection system that detects or identifies emotional or social cues, which can be output to the user such as in real-time via a user interface on a computing device. The emotion detection system includes artificial intelligence or machine learning model(s) trained to identify the emotional or social cues. In some instances, the system provides pre-processing of the data, a machine learning model or classifier, and optionally additional steps for processing or formatting the output. The output may be evaluated against one or more thresholds to place the input as falling within one or more of multiple social or emotional cue categories. In some embodiments, the machine learning model is implemented as a regression model (e.g., providing a continuous output that may correlate with a degree of a social cue such as degree of anger). Alternatively, the model is implemented as a classification model (e.g., a categorical output indicating a smile or a frown is detected). In some instances, both types of models are implemented depending on the types of cues being detected. In some instances, the emotion detection system comprises one or more modules for performing specific tasks necessary for the overall process to function. The emotion detection system can include a facial recognition module for detecting and tracking the faces of persons that are present in one or more images or video data and an expression or emotion detection module that evaluates the detected faces to identify the presence of one or more emotional or social cues. Additional modules may be present such as an audio module for processing any audio input (e.g., spoken words or verbal commands of the user), or other modules corresponding to additional sensor inputs. Various combinations of these modules are contemplated depending on the specific implementation of the emotion detection system. The facial recognition module3810and emotion detection module3820can together perform a series of steps such as illustrated in the non-limiting diagram shown inFIG.38. First, the input data comprising image and/or video3801is provided. Facial detection is performed on the input data (e.g., for each image or frame of a video feed)3802. This may include fiducial point face tracking or other processes useful for providing accurate face detection. The face may be normalized and/or registered against a standard size and/or position or angle. Other image processing techniques that may be applied include normalization of lighting. Next, a histogram of gradients feature extraction is generated for a region of interest on the face3803. The facial expression is then classified to detect a social or emotional cue (e.g., smile, frown, anger, etc.)3804. The classification may be carried out using a logistic regression machine learning model, which is trained on a training data set of labeled images. Finally, the output of the machine learning model can be filtered3805, for example, using a filtering algorithm such as a moving average or a low-pass time-domain filter. This can help provide real-time social or emotional cue detection that remains steady over time by avoiding too many cues being detected from the image or video data. Various methods for providing real-time emotional or social cue detection can be employed. Examples include neutral subtraction for facial expression recognition that estimates the neutral face features in real-time and subtracts from extracted features, and classifying multiple images such as in a video feed and then averaging or smoothing them over time to mitigate noise. Various machine learning models can be used, for example, feed-forward convolutional neural networks used in conjunction with recurrent neural networks. This framework for social or emotional cue detection can be implemented on both input from an outward facing camera (e.g., target individual) and from an inward facing camera (e.g., the user). In addition, other input data sources such as sensor data can be incorporated into the analytical framework to improve emotion and social cue detection. In some embodiments, the various modules of the emotion detection system is implemented using a multi-dimensional machine learning system. For example, a convolutional neural network can generate output directly based on input data such as pixel image data and optionally additional forms of input data. Various known approaches can perform object recognition, segmentation, and localization tasks without registration or image preprocessing. In addition, transfer learning can be used to improve emotion and social cue detection when a small amount of labeled data is available by generating a pre-trained neural network on publicly available image databases that is then fine-tuned using the small data set. then be applied to the domain of affective computing with a small amount of data. In some embodiments, the emotion recognition system is configured to customize the social or emotional cue detection based on specific target individuals to improve emotion detection. For example, the system may label images identified as belonging to the same individual, which are used to provide a target-specific data set to help calibrate the machine learning model. The labels may be supplied by the user or a parent or caregiver, for example, a parent who is reviewing the images captured by the patient in order to apply the correct label or correct mistakes in the label. Accordingly, the machine learning model such as a convolutional neural network may be tweaked to adjust the weights between layers in order to improve accuracy for that particular individual. Thus, the accuracy can increase over time as more data is collected. The digital therapeutics can comprise a social learning aid for a subject to increase cognitive performance such as, for example, facial engagement and/or recognition or providing feedback during social interactions. In some cases, the platforms, systems, devices, methods, and media disclosed herein provide an assessment tool comprising a survey or questionnaire to be completed by the subject or the subject's caretaker. The survey can include at least 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 80, 90, or 100 or more items and/or no more than 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 80, 90, or 100 or more items. These items can be categorized across a plurality of domains. In some cases, the items are categorized across two, three, four, or five social domains. The inputs or responses to these items can correspond to features utilized in the machine learning algorithms described herein such as trained evaluation or diagnostic models or classifiers. In some cases, the inputs or responses comprise a number or score. The score can be generated by summing up the items for each of the items. A score below a threshold can be interpreted as indicating or suggesting a disorder, delay, or impairment such as, for example, autism spectrum disorder. In some cases, the platforms, systems, devices, methods, and media disclosed herein provide an assessment tool that measures various domains such as, for example, communication, daily living, socialization, motor functioning, and adaptive behavior skills. The assessment tool can be used to monitor the subject. For example, a higher score can indicate greater adaptive functioning. In some embodiments, a method or device as described herein includes an evaluation aspect and a digital therapy aspect, wherein the evaluation together with the digital therapy together improve a social reciprocity of an individual receiving digital therapy. More specifically, in some embodiments, an evaluation on an individual using machine learning modeling selects for individuals who: (1) are in need of social reciprocity improvement and (2) will improve their social reciprocity considerably with the use of digital therapy. It is important to note that while certain individuals are capable of a therapeutic interaction with a digital therapy, certain individuals are not capable of benefiting from digital therapy due to, for example, cognitive deficits that prevent them from fully interacting with digital therapy to a therapeutic degree. Embodiments of the methods and devices described herein select for individuals who will benefit from digital therapy to a higher degree so that a digital therapy is only provided to these individuals, whereas individuals determined to not benefit from digital therapy are provided other treatment modalities. In some embodiments, an individual receiving a digital therapy is provided with a therapeutic agent or additional therapy that enhances his digital therapy experience by, for example, improving the cognition and/or attention of the individual during the digital therapy session. The digital therapeutics can include social interaction sessions during which the subject engages in social interaction with the assistance of the social learning aid. In some instances, the personal treatment plan comprises one or more social interaction sessions. The social interaction sessions can be scheduled such as, for example, at least one, two, three, four, five, six, seven sessions per week. The digital therapeutics implemented as part of the personal treatment plan can be programmed to last at least one, two, three, four, five, six, seven, eight, nine, or ten or more weeks. In some instances, the digital therapeutics are implemented using artificial intelligence. For example, an artificial intelligence-driven computing device such as a wearable device can be used to provide behavioral intervention to improve social outcomes for children with behavioral, neurological or mental health conditions or disorders. In some embodiments, the personalized treatment regimen is adaptive, for example, dynamically updating or reconfiguring its therapies based on captured feedback from the subject during ongoing therapy and/or additional relevant information (e.g., results from an autism evaluation). FIGS.1A and1Bshow some developmental disorders that may be evaluated using the assessment procedure as described herein. The assessment procedure can be configured to evaluate a subject's risk for having one or more developmental disorders, such as two or more related developmental disorders. The developmental disorders may have at least some overlap in symptoms or features of the subject. Such developmental disorders may include pervasive development disorder (PDD), autism spectrum disorder (ASD), social communication disorder, restricted repetitive behaviors, interests, and activities (RRBs), autism (“classical autism”), Asperger's Syndrome (“high functioning autism), PDD-not otherwise specified (PDD-NOS, “atypical autism”), attention deficit and hyperactivity disorder (ADHD), speech and language delay, obsessive compulsive disorder (OCD), intellectual disability, learning disability, or any other relevant development disorder, such as disorders defined in any edition of the Diagnostic and Statistical Manual of Mental Disorders (DSM). The assessment procedure may be configured to determine the risk of the subject for having each of a plurality of disorders. The assessment procedure may be configured to determine the subject as at greater risk of a first disorder or a second disorder of the plurality of disorders. The assessment procedure may be configured to determine the subject as at risk of a first disorder and a second disorder with comorbidity. The assessment procedure may be configured to predict a subject to have normal development, or have low risk of having any of the disorders the procedure is configured to screen for. The assessment procedure may further be configured to have high sensitivity and specificity to distinguish among different severity ratings for a disorder; for example, the procedure may be configured to predict a subject's risk for having level 1 ASD, level 2 ASD, or level 3 ASD as defined in the fifth edition of the DSM (DSM-V). Many developmental disorders may have similar or overlapping symptoms, thus complicating the assessment of a subject's developmental disorder. The assessment procedure described herein can be configured to evaluate a plurality of features of the subject that may be relevant to one or more developmental disorders. The procedure can comprise an assessment model that has been trained using a large set of clinically validated data to learn the statistical relationship between a feature of a subject and clinical diagnosis of one or more developmental disorders. Thus, as a subject participates in the assessment procedure, the subject's feature value for each evaluated feature (e.g., subject's answer to a question) can be queried against the assessment model to identify the statistical correlation, if any, of the subject's feature value to one or more screened developmental disorders. Based on the feature values provided by the subject, and the relationship between those values and the predicted risk for one or more developmental disorders as determined by the assessment model, the assessment procedure can dynamically adjust the selection of next features to be evaluated in the subject. The selection of the next feature to be evaluated may comprise an identification of the next most predictive feature, based on the determination of the subject as at risk for a particular disorder of the plurality of disorders being screened. For example, if after the subject has answered the first five questions of the assessment procedure, the assessment model predicts a low risk of autism and a relatively higher risk of ADHD in the subject, the assessment procedure may select features with higher relevance to ADHD to be evaluated next in the subject (e.g., questions whose answers are highly correlated with a clinical diagnosis of ADHD may be presented next to the subject). Thus, the assessment procedure described herein can be dynamically tailored to a particular subject's risk profile, and enable the evaluation of the subject's disorder with a high level of granularity. FIG.2is a schematic diagram of a data processing module100for providing the assessment procedure as described herein. The data processing module100generally comprises a preprocessing module105, a training module110, and a prediction module120. The data processing module can extract training data150from a database, or intake new data155with a user interface130. The preprocessing module can apply one or more transformations to standardize the training data or new data for the training module or the prediction module. The preprocessed training data can be passed to the training module, which can construct an assessment model160based on the training data. The training module may further comprise a validation module115, configured to validate the trained assessment model using any appropriate validation algorithm (e.g., Stratified K-fold cross-validation). The preprocessed new data can be passed on to the prediction module, which may output a prediction170of the subject's developmental disorder by fitting the new data to the assessment model constructed in the training module. The prediction module may further comprise a feature recommendation module125, configured to select or recommend the next feature to be evaluated in the subject, based on previously provided feature values for the subject. The training data150, used by the training module to construct the assessment model, can comprise a plurality of datasets from a plurality of subjects, each subject's dataset comprising an array of features and corresponding feature values, and a classification of the subject's developmental disorder or condition. As described herein, the features may be evaluated in the subject via one or more of questions asked to the subject, observations of the subject, or structured interactions with the subject. Feature values may comprise one or more of answers to the questions, observations of the subject such as characterizations based on video images, or responses of the subject to a structured interaction, for example. Each feature may be relevant to the identification of one or more developmental disorders or conditions, and each corresponding feature value may indicate the degree of presence of the feature in the specific subject. For example, a feature may be the ability of the subject to engage in imaginative or pretend play, and the feature value for a particular subject may be a score of either 0, 1, 2, 3, or 8, wherein each score corresponds to the degree of presence of the feature in the subject (e.g., 0=variety of pretend play; 1=some pretend play; 2=occasional pretending or highly repetitive pretend play; 3=no pretend play; 8=not applicable). The feature may be evaluated in the subject by way of a question presented to the subject or a caretaker such as a parent, wherein the answer to the question comprises the feature value. Alternatively or in combination, the feature may be observed in the subject, for example with a video of the subject engaging in a certain behavior, and the feature value may be identified through the observation. In addition to the array of features and corresponding feature values, each subject's dataset in the training data also comprises a classification of the subject. For example, the classification may be autism, autism spectrum disorder (ASD), or non-spectrum. Preferably, the classification comprises a clinical diagnosis, assigned by qualified personnel such as licensed clinical psychologists, in order to improve the predictive accuracy of the generated assessment model. The training data may comprise datasets available from large data repositories, such as Autism Diagnostic Interview-Revised (ADI-R) data and/or Autism Diagnostic Observation Schedule (ADOS) data available from the Autism Genetic Resource Exchange (AGRE), or any datasets available from any other suitable repository of data (e.g., Boston Autism Consortium (AC), Simons Foundation, National Database for Autism Research, etc.). Alternatively or in combination, the training data may comprise large self-reported datasets, which can be crowd-sourced from users (e.g., via websites, mobile applications, etc.). The preprocessing module105can be configured to apply one or more transformations to the extracted training data to clean and normalize the data, for example. The preprocessing module can be configured to discard features which contain spurious metadata or contain very few observations. The preprocessing module can be further configured to standardize the encoding of feature values. Different datasets may often have the same feature value encoded in different ways, depending on the source of the dataset. For example, ‘900’, ‘900.0’, ‘904’, ‘904.0’, ‘−1’, ‘−1.0’, ‘None’, and ‘NaN’ may all encode for a “missing” feature value. The preprocessing module can be configured to recognize the encoding variants for the same feature value, and standardize the datasets to have a uniform encoding for a given feature value. The preprocessing module can thus reduce irregularities in the input data for the training and prediction modules, thereby improving the robustness of the training and prediction modules. In addition to standardizing data, the preprocessing module can also be configured to re-encode certain feature values into a different data representation. In some instances, the original data representation of the feature values in a dataset may not be ideal for the construction of an assessment model. For example, for a categorical feature wherein the corresponding feature values are encoded as integers from 1 to 9, each integer value may have a different semantic content that is independent of the other values. For example, a value of ‘1’ and a value of ‘9’ may both be highly correlated with a specific classification, while a value of ‘5’ is not. The original data representation of the feature value, wherein the feature value is encoded as the integer itself, may not be able to capture the unique semantic content of each value, since the values are represented in a linear model (e.g., an answer of ‘5’ would place the subject squarely between a ‘1’ and a ‘9’ when the feature is considered in isolation; however, such an interpretation would be incorrect in the aforementioned case wherein a ‘1’ and a ‘9’ are highly correlated with a given classification while a ‘5’ is not). To ensure that the semantic content of each feature value is captured in the construction of the assessment model, the preprocessing module may comprise instructions to re-encode certain feature values, such as feature values corresponding to categorical features, in a “one-hot” fashion, for example. In a “one-hot” representation, a feature value may be represented as an array of bits having a value of 0 or 1, the number of bits corresponding to the number of possible values for the feature. Only the feature value for the subject may be represented as a “1”, with all other values represented as a “0”. For example, if a subject answered “4” to a question whose possible answers comprise integers from 1 to 9, the original data representation may be [4], and the one-hot representation may be [0 0 0 1 0 0 0 0 0]. Such a one-hot representation of feature values can allow every value to be considered independently of the other possible values, in cases where such a representation would be necessary. By thus re-encoding the training data using the most appropriate data representation for each feature, the preprocessing module can improve the accuracy of the assessment model constructed using the training data. The preprocessing module can be further configured to impute any missing data values, such that downstream modules can correctly process the data. For example, if a training dataset provided to the training module comprises data missing an answer to one of the questions, the preprocessing module can provide the missing value, so that the dataset can be processed correctly by the training module. Similarly, if a new dataset provided to the prediction module is missing one or more feature values (e.g., the dataset being queried comprises only the answer to the first question in a series of questions to be asked), the preprocessing module can provide the missing values, so as to enable correct processing of the dataset by the prediction module. For features having categorical feature values (e.g., extent of display of a certain behavior in the subject), missing values can be provided as appropriate data representations specifically designated as such. For example, if the categorical features are encoded in a one-hot representation as described herein, the preprocessing module may encode a missing categorical feature value as an array of ‘0’ bits. For features having continuous feature values (e.g., age of the subject), the mean of all of the possible values can be provided in place of the missing value (e.g., age of 4 years). The training module110can utilize a machine learning algorithm or other algorithm to construct and train an assessment model to be used in the assessment procedure, for example. An assessment model can be constructed to capture, based on the training data, the statistical relationship, if any, between a given feature value and a specific developmental disorder to be screened by the assessment procedure. The assessment model may, for example, comprise the statistical correlations between a plurality of clinical characteristics and clinical diagnoses of one or more developmental disorders. A given feature value may have a different predictive utility for classifying each of the plurality of developmental disorders to be evaluated in the assessment procedure. For example, in the aforementioned example of a feature comprising the ability of the subject to engage in imaginative or pretend play, the feature value of “3” or “no variety of pretend play” may have a high predictive utility for classifying autism, while the same feature value may have low predictive utility for classifying ADHD. Accordingly, for each feature value, a probability distribution may be extracted that describes the probability of the specific feature value for predicting each of the plurality of developmental disorders to be screened by the assessment procedure. The machine learning algorithm can be used to extract these statistical relationships from the training data and build an assessment model that can yield an accurate prediction of a developmental disorder when a dataset comprising one or more feature values is fitted to the model. One or more machine learning algorithms may be used to construct the assessment model, such as support vector machines that deploy stepwise backwards feature selection and/or graphical models, both of which can have advantages of inferring interactions between features. For example, machine learning algorithms or other statistical algorithms may be used, such as alternating decision trees (ADTree), Decision Stumps, functional trees (FT), logistic model trees (LMT), logistic regression, Random Forests, linear classifiers, or any machine learning algorithm or statistical algorithm known in the art. One or more algorithms may be used together to generate an ensemble method, wherein the ensemble method may be optimized using a machine learning ensemble meta-algorithm such as a boosting (e.g., AdaBoost, LPBoost, TotalBoost, BrownBoost, MadaBoost, LogitBoost, etc.) to reduce bias and/or variance. Once an assessment model is derived from the training data, the model may be used as a prediction tool to assess the risk of a subject for having one or more developmental disorders. Machine learning analyses may be performed using one or more of many programming languages and platforms known in the art, such as R, Weka, Python, and/or Matlab, for example. A Random Forest classifier, which generally comprises a plurality of decision trees wherein the output prediction is the mode of the predicted classifications of the individual trees, can be helpful in reducing overfitting to training data. An ensemble of decision trees can be constructed using a random subset of features at each split or decision node. The Gini criterion may be employed to choose the best partition, wherein decision nodes having the lowest calculated Gini impurity index are selected. At prediction time, a “vote” can be taken over all of the decision trees, and the majority vote (or mode of the predicted classifications) can be output as the predicted classification. FIG.3is a schematic diagram illustrating a portion of an assessment model160based on a Random Forest classifier. The assessment module may comprise a plurality of individual decision trees165, such as decision trees165aand165b, each of which can be generated independently using a random subset of features in the training data. Each decision tree may comprise one or more decision nodes such as decision nodes166and167shown inFIG.3, wherein each decision node specifies a predicate condition. For example, decision node16predicates the condition that, for a given dataset of an individual, the answer to question #86 (age when abnormality is first evident) is 4 or less. Decision node167predicates the condition that, for the given dataset, the answer to question #52 (showing and direction attention) is 8 or less. At each decision node, a decision tree can be split based on whether the predicate condition attached to the decision node holds true, leading to prediction nodes (e.g.,166a,166b,167a,167b). Each prediction node can comprise output values (‘value’ inFIG.3) that represent “votes” for one or more of the classifications or conditions being evaluated by the assessment model. For example, in the prediction nodes shown inFIG.3, the output values comprise votes for the individual being classified as having autism or being non-spectrum. A prediction node can lead to one or more additional decision nodes downstream (not shown inFIG.3), each decision node leading to an additional split in the decision tree associated with corresponding prediction nodes having corresponding output values. The Gini impurity can be used as a criterion to find informative features based on which the splits in each decision tree may be constructed. An assessment model can be configured to detect or evaluate a subject for the presence of a disorder or condition. In some cases, a separate assessment model is configured to determine whether a subject having the disorder or condition will be improved by a digital therapy, for example, a digital therapy configured to promote social reciprocity. When the dataset being queried in the assessment model reaches a “leaf”, or a final prediction node with no further downstream splits, the output values of the leaf can be output as the votes for the particular decision tree. Since the Random Forest model comprises a plurality of decision trees, the final votes across all trees in the forest can be summed to yield the final votes and the corresponding classification of the subject. While only two decision trees are shown inFIG.3, the model can comprise any number of decision trees. A large number of decision trees can help reduce overfitting of the assessment model to the training data, by reducing the variance of each individual decision tree. For example, the assessment model can comprise at least about 10 decision trees, for example at least about 100 individual decision trees or more. An ensemble of linear classifiers may also be suitable for the derivation of an assessment model as described herein. Each linear classifier can be individually trained with a stochastic gradient descent, without an “intercept term”. The lack of an intercept term can prevent the classifier from deriving any significance from missing feature values. For example, if a subject did not answer a question such that the feature value corresponding to said question is represented as an array of ‘0’ bits in the subject's data set, the linear classifier trained without an intercept term will not attribute any significance to the array of ‘0’ bits. The resultant assessment model can thereby avoid establishing a correlation between the selection of features or questions that have been answered by the subject and the final classification of the subject as determined by the model. Such an algorithm can help ensure that only the subject-provided feature values or answers, rather than the features or questions, are factored into the final classification of the subject. The training module may comprise feature selection. One or more feature selection algorithms (such as support vector machine, convolutional neural nets) may be used to select features able to differentiate between individuals with and without certain developmental disorders. Different sets of features may be selected as relevant for the identification of different disorders. Stepwise backwards algorithms may be used along with other algorithms. The feature selection procedure may include a determination of an optimal number of features. The training module may be configured to evaluate the performance of the derived assessment models. For example, the accuracy, sensitivity, and specificity of the model in classifying data can be evaluated. The evaluation can be used as a guideline in selecting suitable machine learning algorithms or parameters thereof. The training module can thus update and/or refine the derived assessment model to maximize the specificity (the true negative rate) over sensitivity (the true positive rate). Such optimization may be particularly helpful when class imbalance or sample bias exists in training data. In at least some instances, available training data may be skewed towards individuals diagnosed with a specific developmental disorder. In such instances, the training data may produce an assessment model reflecting that sample bias, such that the model assumes that subjects are at risk for the specific developmental disorder unless there is a strong case to be made otherwise. An assessment model incorporating such a particular sample bias can have less than ideal performance in generating predictions of new or unclassified data, since the new data may be drawn from a subject population which may not comprise a sample bias similar to that present in the training data. To reduce sample bias in constructing an assessment model using skewed training data, sample weighting may be applied in training the assessment model. Sample weighting can comprise lending a relatively greater degree of significance to a specific set of samples during the model training process. For example, during model training, if the training data is skewed towards individuals diagnosed with autism, higher significance can be attributed to the data from individuals not diagnosed with autism (e.g., up to 50 times more significance than data from individuals diagnosed with autism). Such a sample weighting technique can substantially balance the sample bias present in the training data, thereby producing an assessment model with reduced bias and improved accuracy in classifying data in the real world. To further reduce the contribution of training data sample bias to the generation of an assessment model, a boosting technique may be implemented during the training process. Boosting comprises an iterative process, wherein after one iteration of training, the weighting of each sample data point is updated. For example, samples that are misclassified after the iteration can be updated with higher significances. The training process may then be repeated with the updated weightings for the training data. The training module may further comprise a validation module115configured to validate the assessment model constructed using the training data. For example, a validation module may be configured to implement a Stratified K-fold cross validation, wherein k represents the number of partitions that the training data is split into for cross validation. For example, k can be any integer greater than 1, such as 3, 4, 5, 6, 7, 8, 9, or 10, or possibly higher depending on risk of overfitting the assessment model to the training data. The training module may be configured to save a trained assessment model to a local memory and/or a remote server, such that the model can be retrieved for modification by the training module or for the generation of a prediction by the prediction module120. FIG.4is an operational flow400of a method of a prediction module120as described herein. The prediction module120can be configured to generate a predicted classification (e.g., developmental disorder) of a given subject, by fitting new data to an assessment model constructed in the training module. At step405, the prediction module can receive new data that may have been processed by the preprocessing module to standardize the data, for example by dropping spurious metadata, applying uniform encoding of feature values, re-encoding select features using different data representations, and/or imputing missing data points, as described herein. The new data can comprise an array of features and corresponding feature values for a particular subject. As described herein, the features may comprise a plurality of questions presented to a subject, observations of the subject, or tasks assigned to the subject. The feature values may comprise input data from the subject corresponding to characteristics of the subject, such as answers of the subject to questions asked, or responses of the subject. The new data provided to the prediction module may or may not have a known classification or diagnosis associated with the data; either way, the prediction module may not use any pre-assigned classification information in generating the predicted classification for the subject. The new data may comprise a previously-collected, complete dataset for a subject to be diagnosed or assessed for the risk of having one or more of a plurality of developmental disorders. Alternatively or in combination, the new data may comprise data collected in real time from the subject or a caretaker of the subject, for example with a user interface as described in further detail herein, such that the complete dataset can be populated in real time as each new feature value provided by the subject is sequentially queried against the assessment model. At step410, the prediction module can load a previously saved assessment model, constructed by the training module, from a local memory and/or a remote server configured to store the model. At step415, the new data is fitted to the assessment model to generate a predicted classification of the subject. At step420, the module can check whether the fitting of the data can generate a prediction of one or more specific disorders (e.g., autism, ADHD, etc.) within a confidence interval exceeding a threshold value, for example within a 90% or higher confidence interval, for example 95% or more. If so, as shown in step425, the prediction module can output the one or more developmental disorders as diagnoses of the subject or as disorders for which the subject is at risk. The prediction module may output a plurality of developmental disorders for which the subject is determined to at risk beyond the set threshold, optionally presenting the plurality of disorders in order of risk. The prediction module may output one developmental disorder for which the subject is determined to be at greatest risk. The prediction module may output two or more development disorders for which the subject is determined to risk with comorbidity. The prediction module may output determined risk for each of the one or more developmental disorders in the assessment model. If the prediction module cannot fit the data to any specific developmental disorder within a confidence interval at or exceeding the designated threshold value, the prediction module may determine, in step430, whether there are any additional features that can be queried. If the new data comprises a previously-collected, complete dataset, and the subject cannot be queried for any additional feature values, “no diagnosis” may be output as the predicted classification, as shown in step440. If the new data comprises data collected in real time from the subject or caretaker during the prediction process, such that the dataset is updated with each new input data value provided to the prediction module and each updated dataset is fitted to the assessment model, the prediction module may be able to query the subject for additional feature values. If the prediction module has already obtained data for all features included in the assessment module, the prediction module may output “no diagnosis” as the predicted classification of the subject, as shown in step440. If there are features that have not yet been presented to the subject, as shown in step435, the prediction module may obtain additional input data values from the subject, for example by presenting additional questions to the subject. The updated dataset including the additional input data may then be fitted to the assessment model again (step415), and the loop may continue until the prediction module can generate an output. FIG.5is an operational flow500of a feature recommendation module125as described herein by way of a non-limiting example. The prediction module may comprise a feature recommendation module125, configured to identify, select or recommend the next most predictive or relevant feature to be evaluated in the subject, based on previously provided feature values for the subject. For example, the feature recommendation module can be a question recommendation module, wherein the module can select the most predictive next question to be presented to a subject or caretaker, based on the answers to previously presented questions. The feature recommendation module can be configured to recommend one or more next questions or features having the highest predictive utility in classifying a particular subject's developmental disorder. The feature recommendation module can thus help to dynamically tailor the assessment procedure to the subject, so as to enable the prediction module to produce a prediction with a reduced length of assessment and improved sensitivity and accuracy. Further, the feature recommendation module can help improve the specificity of the final prediction generated by the prediction module, by selecting features to be presented to the subject that are most relevant in predicting one or more specific developmental disorders that the particular subject is most likely to have, based on feature values previously provided by the subject. At step505, the feature recommendation module can receive as input the data already obtained from the subject in the assessment procedure. The input subject data can comprise an array of features and corresponding feature values provided by the subject. At step510, the feature recommendation module can select one or more features to be considered as “candidate features” for recommendation as the next feature(s) to be presented to one or more of the subject, caretaker or clinician. Features that have already been presented can be excluded from the group of candidate features to be considered. Optionally, additional features meeting certain criteria may also be excluded from the group of candidate features, as described in further detail herein. At step515, the feature recommendation module can evaluate the “expected feature importance” of each candidate feature. The candidate features can be evaluated for their “expected feature importance”, or the estimated utility of each candidate feature in predicting a specific developmental disorder for the specific subject. The feature recommendation module may utilize an algorithm based on: (1) the importance or relevance of a specific feature value in predicting a specific developmental disorder; and (2) the probability that the subject may provide the specific feature value. For example, if the answer of “3” to question B5 is highly correlated with a classification of autism, this answer can be considered a feature value having high utility for predicting autism. If the subject at hand also has a high probability of answering “3” to said question B5, the feature recommendation module can determine this question to have high expected feature importance. An algorithm that can be used to determine the expected feature importance of a feature is described in further detail in reference toFIG.6, for example. At step520, the feature recommendation module can select one or more candidate features to be presented next to the subject, based on the expected feature importance of the features as determined in step515. For example, the expected feature importance of each candidate feature may be represented as a score or a real number, which can then be ranked in comparison to other candidate features. The candidate feature having the desired rank, for example a top 10, top 5, top 3, top 2, or the highest rank, may be selected as the feature to the presented next to the subject. FIG.6is an operational flow600of method of determining an expected feature importance determination algorithm127as performed by a feature recommendation module125described herein. At step605, the algorithm can determine the importance or relevance of a specific feature value in predicting a specific developmental disorder. The importance or relevance of a specific feature value in predicting a specific developmental disorder can be derived from the assessment model constructed using training data. Such a “feature value importance” can be conceptualized as a measure of how relevant a given feature value's role is, should it be present or not present, in determining a subject's final classification. For example, if the assessment model comprises a Random Forest classifier, the importance of a specific feature value can be a function of where that feature is positioned in the Random Forest classifier's branches. Generally, if the average position of the feature in the decision trees is relatively high, the feature can have relatively high feature importance. The importance of a feature value given a specific assessment model can be computed efficiently, either by the feature recommendation module or by the training module, wherein the training module may pass the computed statistics to the feature recommendation module. Alternatively, the importance of a specific feature value can be a function of the actual prediction confidence that would result if said feature value was provided by the subject. For each possible feature value for a given candidate feature, the feature recommendation module can be configured to calculate the actual prediction confidence for predicting one or more developmental disorders, based on the subject's previously provided feature values and the currently assumed feature value. Each feature value may have a different importance for each developmental disorder for which the assessment procedure is designed to screen. Accordingly, the importance of each feature value may be represented as a probability distribution that describes the probability of the feature value yielding an accurate prediction for each of the plurality of developmental disorders being evaluated. At step610, the feature recommendation module can determine the probability of a subject providing each feature value. The probability that the subject may provide a specific feature value can be computed using any appropriate statistical model. For example, a large probabilistic graphical model can be used to find the values of expressions such as: prob(E=1|A=1,B=2,C=1) where A, B, and C represent different features or questions in the prediction module and the integers 1 and 2 represent different possible feature values for the feature (or possible answers to the questions). The probability of a subject providing a specific feature value may then be computed using Bayes' rule, with expressions such as: prob(E=1|A=1,B=2,C=1)=prob(E=1,A=1,B=2,C=1)/prob(A=1,B=2,C=1) Such expressions may be computationally expensive, in terms of both computation time and required processing resources. Alternatively or in combination with computing the probabilities explicitly using Bayes' rule, logistic regression or other statistical estimators may be used, wherein the probability is estimated using parameters derived from a machine learning algorithm. For example, the following expression may be used to estimate the probability that the subject may provide a specific feature value: prob(E=1|A=1,B=2,C=1)≈sigmoid(a1*A+a2*B+a3*C+a4), wherein a1, a2, a3, and a4 are constant coefficients determined from the trained assessment model, learned using an optimization algorithm that attempts to make this expression maximally correct, and wherein sigmoid is a nonlinear function that enables this expression to be turned into a probability. Such an algorithm can be quick to train, and the resulting expressions can be computed quickly in application, e.g., during administration of the assessment procedure. Although reference is made to four coefficients, as many coefficients as are helpful may be used as will be recognized by a person of ordinary skill in the art. At step615, the expected importance of each feature value can be determined based on a combination of the metrics calculated in steps605and610. Based on these two factors, the feature recommendation module can determine the expected utility of the specific feature value in predicting a specific developmental disorder. Although reference is made herein to the determination of expected importance via multiplication, the expected importance can be determined by combining coefficients and parameters in many ways, such as with look up tables, logic, or division, for example. At step620, steps605-615can be repeated for every possible feature value for each candidate feature. For example, if a particular question has 4 possible answers, the expected importance of each of the 4 possible answers is determined. At step625, the total expected importance, or the expected feature importance, of each candidate feature can be determined. The expected feature importance of each feature can be determined by summing the feature value importances of every possible feature value for the feature, as determined in step620. By thus summing the expected utilities across all possible feature values for a given feature, the feature recommendation module can determine the total expected feature importance of the feature for predicting a specific developmental disorder in response to previous answers. At step630, steps605-625can be repeated for every candidate feature being considered by the feature recommendation module. The candidate features may comprise a subset of possible features such as questions. Thus, an expected feature importance score for every candidate feature can be generated, and the candidate features can be ranked in order of highest to lowest expected feature importance. Optionally, in addition to the two factors determined in steps605and610, a third factor may also be taken into account in determining the importance of each feature value. Based on the subject's previously provided feature values, the subject's probability of having one or more of the plurality of developmental disorders can be determined. Such a probability can be determined based on the probability distribution stored in the assessment model, indicating the probability of the subject having each of the plurality of screened developmental disorders based on the feature values provided by the subject. In selecting the next feature to be presented to the subject, the algorithm may be configured to give greater weight to the feature values most important or relevant to predicting the one or more developmental disorders that the subject at hand is most likely to have. For example, if a subject's previously provided feature values indicate that the subject has a higher probability of having either an intellectual disability or speech and language delay than any of the other developmental disorders being evaluated, the feature recommendation module can favor feature values having high importance for predicting either intellectual disability or speech and language delay, rather than features having high importance for predicting autism, ADHD, or any other developmental disorder that the assessment is designed to screen for. The feature recommendation module can thus enable the prediction module to tailor the prediction process to the subject at hand, presenting more features that are relevant to the subject's potential developmental disorder to yield a final classification with higher granularity and confidence. Although the above steps show an operational flow600of an expected feature importance determination algorithm127, a person of ordinary skill in the art will recognize many variations based on the teachings described herein. The steps may be completed in a different order. Steps may be added or deleted. Some of the steps may comprise sub-steps of other steps. Many of the steps may be repeated as often as desired by the user. A non-limiting implementation of the feature recommendation module is now described. Subject X has provided answers (feature values) to questions (features) A, B, and C in the assessment procedure: SubjectX={‘A’:1, ‘B’:2, ‘C’:1} The feature recommendation module can determine whether question D or question E should be presented next in order to maximally increase the predictive confidence with which a final classification or diagnosis can be reached. Given Subject X's previous answers, the feature recommendation module determines the probability of Subject X providing each possible answer to each of questions D and E, as follows: prob(E=1|A=1,B=2,C=1)=0.1 prob(E=2|A=1,B=2,C=1)=0.9 prob(D=1|A=1,B=2,C=1)=0.7 prob(D=2|A=1,B=2,C=1)=0.3 The feature importance of each possible answer to each of questions D and E can be computed based on the assessment model as described. Alternatively, the feature importance of each possible answer to each of questions D and E can be computed as the actual prediction confidence that would result if the subject were to give the specific answer. The importance of each answer can be represented using a range of values on any appropriate numerical scale. For example: importance(E=1)=1 importance(E=2)=3 importance(D=1)=2 importance(D=2)=4 Based on the computed probabilities and the feature value importances, the feature recommendation module can compute the expected feature importance of each question as follows: Expectation[importance(E)]=(prob(E=1|A=1,B=2,C=1)*importance(E=1)+(prob(E=2|A=1,B=2,C=1)*importance(E=2)=0.1*1+0.9*3=2.8Expectation[importance(D)]=(prob(D=1|A=1,B=2,C=1)*importance(D=1)+(prob(D=2|A=1,B=2,C=1)*importance(D=2)=0.7*2+0.3*4=2.6 Hence, the expected feature importance (also referred to as relevance) from the answer of question E is determined to be higher than that of question D, even though question D has generally higher feature importances for its answers. The feature recommendation module can therefore select question E as the next question to be presented to Subject X. When selecting the next best feature to be presented to a subject, the feature recommendation module125may be further configured to exclude one or more candidate features from consideration, if the candidate features have a high co-variance with a feature that has already been presented to the subject. The co-variance of different features may be determined based on the training data, and may be stored in the assessment model constructed by the training module. If a candidate feature has a high co-variance with a previously presented feature, the candidate feature may add relatively little additional predictive utility, and may hence be omitted from future presentation to the subject in order to optimize the efficiency of the assessment procedure. The prediction module120may interact with the person participating in the assessment procedure (e.g., a subject or the subject's caretaker) with a user interface130. The user interface may be provided with a user interface, such as a display of any computing device that can enable the user to access the prediction module, such as a personal computer, a tablet, or a smartphone. The computing device may comprise a processor that comprises instructions for providing the user interface, for example in the form of a mobile application. The user interface can be configured to display instructions from the prediction module to the user, and/or receive input from the user with an input method provided by the computing device. Thus, the user can participate in the assessment procedure as described herein by interacting with the prediction module with the user interface, for example by providing answers (feature values) in response to questions (features) presented by the prediction module. The user interface may be configured to administer the assessment procedure in real-time, such that the user answers one question at a time and the prediction module can select the next best question to ask based on recommendations made by the feature recommendation module. Alternatively or in combination, the user interface may be configured to receive a complete set of new data from a user, for example by allowing a user to upload a complete set of feature values corresponding to a set of features. As described herein, the features of interest relevant to identifying one or more developmental disorders may be evaluated in a subject in many ways. For example, the subject or caretaker or clinician may be asked a series of questions designed to assess the extent to which the features of interest are present in the subject. The answers provided can then represent the corresponding feature values of the subject. The user interface may be configured to present a series of questions to the subject (or any person participating in the assessment procedure on behalf of the subject), which may be dynamically selected from a set of candidate questions as described herein. Such a question-and-answer based assessment procedure can be administered entirely by a machine, and can hence provide a very quick prediction of the subject's developmental disorder(s). Alternatively or in combination, features of interest in a subject may be evaluated with observation of the subject's behaviors, for example with videos of the subject. The user interface may be configured to allow a subject or the subject's caretaker to record or upload one or more videos of the subject. The video footage may be subsequently analyzed by qualified personnel to determine the subject's feature values for features of interest. Alternatively or in combination, video analysis for the determination of feature values may be performed by a machine. For example, the video analysis may comprise detecting objects (e.g., subject, subject's spatial position, face, eyes, mouth, hands, limbs, fingers, toes, feet, etc.), followed by tracking the movement of the objects. The video analysis may infer the gender of the subject, and/or the proficiency of spoken language(s) of the subject. The video analysis may identify faces globally, or specific landmarks on the face such as the nose, eyes, lips and mouth to infer facial expressions and track these expressions over time. The video analysis may detect eyes, limbs, fingers, toes, hands, feet, and track their movements over time to infer behaviors. In some cases, the analysis may further infer the intention of the behaviors, for example, a child being upset by noise or loud music, engaging in self-harming behaviors, imitating another person's actions, etc. The sounds and/or voices recorded in the video files may also be analyzed. The analysis may infer a context of the subject's behavior. The sound/voice analysis may infer a feeling of the subject. The analysis of a video of a subject, performed by a human and/or by a machine, can yield feature values for the features of interest, which can then be encoded appropriately for input into the prediction module. A prediction of the subject's developmental disorder may then be generated based on a fitting of the subject's feature values to the assessment model constructed using training data. Alternatively or in combination, features of interest in a subject may be evaluated through structured interactions with the subject. For example, the subject may be asked to play a game such as a computer game, and the performance of the subject on the game may be used to evaluate one or more features of the subject. The subject may be presented with one or more stimuli (e.g., visual stimuli presented to the subject via a display), and the response of the subject to the stimuli may be used to evaluate the subject's features. The subject may be asked to perform a certain task (e.g., subject may be asked to pop bubbles with his or her fingers), and the response of the subject to the request or the ability of the subject to carry out the requested task may be used to evaluate to the subject's features. The methods and devices described herein can be configured in many ways to determine the next most predictive or relevant question. At least a portion of the software instructions as described herein can be configured to run locally on a local device so as to provide the user interface and present questions and receive answers to the questions. The local device can be configured with software instructions of an application program interface (API) to query a remote server for the most predictive next question. The API can return an identified question based on the feature importance as described herein, for example. Alternatively or in combination, the local processor can be configured with instructions to determine the most predictive next question in response to previous answers. For example, the prediction module120may comprise software instructions of a remote server, or software instructions of a local processor, and combinations thereof. Alternatively or in combination, the feature recommendation module125may comprise software instructions of a remote server, or software instructions of a local processor, and combinations thereof, configured to determine the most predictive next question, for example. The operational flow600of method of determining an expected feature importance determination algorithm127as performed by a feature recommendation module125described herein can be performed with one or more processors as described herein, for example. FIG.7illustrates a method700of administering an assessment procedure as described herein. The method700may be performed with a user interface provided on a computing device, the computing device comprising a display and a user interface for receiving user input in response to the instructions provided on the display. The user participating in the assessment procedure may be the subject himself, or another person participating in the procedure on behalf of the subject, such as the subject's caretaker. At step705, an Nthquestion related an Nthfeature can be presented to the user with the display. At step710, the subject's answer containing the corresponding Nthfeature value can be received. At step715, the dataset for the subject at hand can be updated to include Nththe feature value provided for the subject. At step720, the updated dataset can be fitted to an assessment model to generate a predicted classification. Step720may be performed by a prediction module, as described herein. At step725, a check can be performed to determine whether the fitting of the data can generate a prediction of a specific developmental disorder (e.g., autism, ADHD, etc.) sufficient confidence (e.g., within at least a 90% confidence interval). If so, as shown at step730, the predicted developmental disorder can be displayed to the user. If not, in step735, a check can be performed to determine whether there are any additional features that can be queried. If yes, as shown at step740, the feature recommendation module may select the next feature to be presented to the user, and steps705-725may be repeated until a final prediction (e.g., a specific developmental disorder or “no diagnosis”) can be displayed to the subject. If no additional features can be presented to the subject, “no diagnosis” may be displayed to the subject, as shown at step745. Although the above steps show a non-limiting method700of administering an assessment procedure, a person of ordinary skill in the art will recognize many variations based on the teachings described herein. The steps may be completed in a different order. Steps may be added or deleted. Some of the steps may comprise sub-steps of other steps. Many of the steps may be repeated as often as desired by the user. The present disclosure provides computer control devices that are programmed to implement methods of the disclosure.FIG.8shows a computer device801suitable for incorporation with the methods and devices described herein. The computer device801can process various aspects of information of the present disclosure, such as, for example, questions and answers, responses, statistical analyses. The computer device801can be an electronic device of a user or a computer device that is remotely located with respect to the electronic device. The electronic device can be a mobile electronic device. The computer device801includes a central processing unit (CPU, also “processor” and “computer processor” herein)805, which can be a single core or multi core processor, or a plurality of processors for parallel processing. The computer device801also includes memory or memory location810(e.g., random-access memory, read-only memory, flash memory), electronic storage unit815(e.g., hard disk), communication interface820(e.g., network adapter) for communicating with one or more other devices, and peripheral devices825, such as cache, other memory, data storage and/or electronic display adapters. The memory810, storage unit815, interface820and peripheral devices825are in communication with the CPU805through a communication bus (solid lines), such as a motherboard. The storage unit815can be a data storage unit (or data repository) for storing data. The computer device801can be operatively coupled to a computer network (“network”)830with the aid of the communication interface820. The network830can be the Internet, an internet and/or extranet, or an intranet and/or extranet that is in communication with the Internet. The network830in some cases is a telecommunication and/or data network. The network830can include one or more computer servers, which can enable distributed computing, such as cloud computing. The network830, in some cases with the aid of the computer device801, can implement a peer-to-peer network, which may enable devices coupled to the computer device801to behave as a client or a server. The CPU805can execute a sequence of machine-readable instructions, which can be embodied in a program or software. The instructions may be stored in a memory location, such as the memory810. The instructions can be directed to the CPU805, which can subsequently program or otherwise configure the CPU805to implement methods of the present disclosure. Examples of operations performed by the CPU805can include fetch, decode, execute, and writeback. The CPU805can be part of a circuit, such as an integrated circuit. One or more other components of the device801can be included in the circuit. In some cases, the circuit is an application specific integrated circuit (ASIC). The storage unit815can store files, such as drivers, libraries and saved programs. The storage unit815can store user data, e.g., user preferences and user programs. The computer device801in some cases can include one or more additional data storage units that are external to the computer device801, such as located on a remote server that is in communication with the computer device801through an intranet or the Internet. The computer device801can communicate with one or more remote computer devices through the network830. For instance, the computer device801can communicate with a remote computer device of a user (e.g., a parent). Examples of remote computer devices and mobile communication devices include personal computers (e.g., portable PC), slate or tablet PC's (e.g., Apple® iPad, Samsung® Galaxy Tab), telephones, Smart phones (e.g., Apple® iPhone, Android-enabled device, Blackberry®), or personal digital assistants. The user can access the computer device801with the network830. Methods as described herein can be implemented by way of machine (e.g., computer processor) executable code stored on an electronic storage location of the computer device801, such as, for example, on the memory810or electronic storage unit815. The machine executable or machine readable code can be provided in the form of software. During use, the code can be executed by the processor805. In some cases, the code can be retrieved from the storage unit815and stored on the memory810for ready access by the processor805. In some situations, the electronic storage unit815can be precluded, and machine-executable instructions are stored on memory810. The code can be pre-compiled and configured for use with a machine have a processer adapted to execute the code, or can be compiled during runtime. The code can be supplied in a programming language that can be selected to enable the code to execute in a pre-compiled or as-compiled fashion. Aspects of the platforms, systems, devices, methods, and media provided herein, such as the computer device801, can be embodied in programming. Various aspects of the technology may be thought of as “products” or “articles of manufacture” typically in the form of machine (or processor) executable code and/or associated data that is carried on or embodied in a type of machine readable medium. Machine-executable code can be stored on an electronic storage unit, such memory (e.g., read-only memory, random-access memory, flash memory) or a hard disk. “Storage” type media can include any or all of the tangible memory of the computers, processors or the like, or associated modules thereof, such as various semiconductor memories, tape drives, disk drives and the like, which may provide non-transitory storage at any time for the software programming. All or portions of the software may at times be communicated through the Internet or various other telecommunication networks. Such communications, for example, may enable loading of the software from one computer or processor into another, for example, from a management server or host computer into the computer platform of an application server. Thus, another type of media that may bear the software elements includes optical, electrical and electromagnetic waves, such as used across physical interfaces between local devices, through wired and optical landline networks and over various air-links. The physical elements that carry such waves, such as wired or wireless links, optical links or the like, also may be considered as media bearing the software. As used herein, unless restricted to non-transitory, tangible “storage” media, terms such as computer or machine “readable medium” refer to any medium that participates in providing instructions to a processor for execution. Hence, a machine readable medium, such as computer-executable code, may take many forms, including but not limited to, a tangible storage medium, a carrier wave medium or physical transmission medium. Non-volatile storage media include, for example, optical or magnetic disks, such as any of the storage devices in any computer(s) or the like, such as may be used to implement the databases, etc. shown in the drawings. Volatile storage media include dynamic memory, such as main memory of such a computer platform. Tangible transmission media include coaxial cables; copper wire and fiber optics, including the wires that comprise a bus within a computer device. Carrier-wave transmission media may take the form of electric or electromagnetic signals, or acoustic or light waves such as those generated during radio frequency (RF) and infrared (IR) data communications. Common forms of computer-readable media therefore include for example: a floppy disk, a flexible disk, hard disk, magnetic tape, any other magnetic medium, a CD-ROM, DVD or DVD-ROM, any other optical medium, punch cards paper tape, any other physical storage medium with patterns of holes, a RAM, a ROM, a PROM and EPROM, a FLASH-EPROM, any other memory chip or cartridge, a carrier wave transporting data or instructions, cables or links transporting such a carrier wave, or any other medium from which a computer may read programming code and/or data. Many of these forms of computer readable media may be involved in carrying one or more sequences of one or more instructions to a processor for execution. The computer device801can include or be in communication with an electronic display835that comprises a user interface (UI)840for providing, for example, questions and answers, analysis results, recommendations. Examples of UI's include, without limitation, a graphical user interface (GUI) and web-based user interface. Methods and devices of the present disclosure can be implemented by way of one or more algorithms and with instructions provided with one or more processors as disclosed herein. An algorithm can be implemented by way of software upon execution by the central processing unit805. The algorithm can be, for example, random forest, graphical models, support vector machine or other. Although the above steps show a method of a device in accordance with an example, a person of ordinary skill in the art will recognize many variations based on the teaching described herein. The steps may be completed in a different order. Steps may be added or deleted. Some of the steps may comprise sub-steps. Many of the steps may be repeated as often as if beneficial to the platform. Each of the examples as described herein can be combined with one or more other examples. Further, one or more components of one or more examples can be combined with other examples. Experimental Data A data processing module as described herein was built on Python 2.7, Anaconda Distribution. The training data used to construct and train the assessment model included data generated by the Autism Genetic Resource Exchange (AGRE), which performed in-home assessments to collect ADI-R and ADOS data from parents and children in their homes. ADI-R comprises a parent interview presenting a total of 93 questions, and yields a diagnosis of autism or no autism. ADOS comprises a semi-structured interview of a child that yields a diagnosis of autism, ASD, or no diagnosis, wherein a child is administered one of four possible modules based on language level, each module comprising about 30 questions. The data included clinical diagnoses of the children derived from the assessments; if a single child had discrepant ADI-R versus ADOS diagnoses, a licensed clinical psychologist assigned a consensus diagnosis for the dataset for the child in question. The training data included a total of 3,449 data points, with 3,315 cases (autism or ASD) and 134 controls (non-spectrum). The features evaluated in the training data targeted 3 key domains: language, social communication, and repetitive behaviors. A boosted Random Forest classifier was used to build the assessment model as described herein. Prior to training the assessment model on the training data, the training data was pre-processed to standardize the data, and re-encode categorical features in a one-hot representation as described herein. Since the training data was skewed towards individuals with autism or ASD, sample weighting was applied to attribute up to 50 times higher significance to data from non-spectrum individuals compared to data from autistic/ASD individuals. The assessment model was trained iteratively with boosting, updating the weighting of data points after each iteration to increase the significance attributed to data points that were misclassified, and retraining with the updated significances. The trained model was validated using Stratified k-fold cross validation with k=5. The cross-validation yielded an accuracy of about 93-96%, wherein the accuracy is defined as the percentage of subjects correctly classified using the model in a binary classification task (autism/non-spectrum). Since the training data contained a sample bias, a confusion matrix was calculated to determine how often the model confused one class (autism or non-spectrum) with another. The percentage of correctly classified autism individuals was about 95%, while the percentage of correctly classified non-spectrum individuals was about 76%. It should be noted, however, that the model may be adjusted to more closely fit one class versus another, in which case the percentage of correct classifications for each class can change.FIG.9shows receiver operating characteristic (ROC) curves mapping sensitivity versus fall-out for an assessment model as described herein. The true positive rate (sensitivity) for the diagnosis of autism is mapped on the y-axis, as a function of the false positive rate (fall-out) for diagnosis mapped on the x-axis. Each of the three curves, labeled “Fold #0”, “Fold #1”, and “Fold #2”, corresponds to a different “fold” of the cross-validation procedure, wherein for each fold, a portion of the training data was fitted to the assessment model while varying the prediction confidence threshold necessary to classify a dataset as “autistic”. As desired or appropriate, the model may be adjusted to increase the sensitivity in exchange for some increase in fall-out, or to decrease the sensitivity in return for a decrease in fall-out, as according to the ROC curves of the model. The feature recommendation module was configured as described herein, wherein the expected feature importance of each question was computed, and candidate questions ranked in order of computed importance with calls to a server with an application program interface (API). The feature recommendation module's ability to recommend informative questions was evaluated by determining the correlation between a question's recommendation score with the increase in prediction accuracy gained from answering the recommended question. The following steps were performed to compute the correlation metric: (1) the data was split up into folds for cross-validation; (2) already answered questions were randomly removed from the validation set; (3) expected feature importance (question recommendation/score) was generated for each question; (4) one of the questions removed in step 2 was revealed, and the relative improvement in the subsequent prediction accuracy was measured; and (5) the correlation between the relative improvement and the expected feature importance was computed. The calculated Pearson correlation coefficient ranged between 0.2 and 0.3, indicating a moderate degree of correlation between the expected feature importance score and the relative improvement.FIG.10is a scatter plot showing the correlation between the expected feature importance (“Expected Informativitiy Score”) and the relative improvement (“Relative Classification Improvement”) for each question. The plot shows a moderate linear relationship between the two variables, demonstrating the feature recommendation module is indeed able to recommend questions that would increase the prediction accuracy. The length of time to produce an output using the developed prediction module and the feature recommendation model was measured. The prediction module took about 46 ms to make a prediction of an individual's risk of autism. The feature recommendation module took about 41 ms to generation question recommendations for an individual. Although these measurements were made with calls to a server through an API, the computations can be performed locally, for example. While the assessment model of the data processing module described with respect toFIGS.9-10was constructed and trained to classify subjects as having autism or no autism, a similar approach may be used to build an assessment model that can classify a subject as having one or more of a plurality of developmental disorders, as described herein. In another aspect, the methods and devices disclosed herein can identify a subject as belonging to one of three categories: having a developmental condition, being developmentally normal or typical, or inconclusive or requiring additional evaluation to determine whether the subject has the developmental condition. The developmental condition can be a developmental disorder or a developmental advancement. The addition of the third category, namely the inconclusive determination, results in improved performance and better accuracy of the categorical evaluations corresponding to the presence or absence of a developmental condition. FIG.11is an operational flow of an evaluation module identifying a subject as belonging to one of three categories. As shown inFIG.11, a method1100is provided for evaluating at least one behavioral developmental condition of a subject. The evaluation module receives diagnostic data of the subject related to the behavioral developmental at1110, evaluates the diagnostic data at1120using a selected subset of a plurality of machine learning assessment models and provides categorical determinations for the subject at1130. The categorical determination can be inconclusive, or can indicate the presence or absence of the behavioral developmental condition. FIG.12is an operational flow of a model training module as described herein. As shown inFIG.12, a method1200is provided for using machine learning to train an assessment model and tune its configuration parameters optimally. Multiple machine learning predictive models can be trained and tuned using the method1200, each using datasets prepared offline and comprising a representative sample of a standardized clinical instrument such as ADI-R, ADOS, or SRS. Models can also be trained using datasets comprising data other than clinical instruments, such as demographic data. The model training module pre-processes diagnostic data from a plurality of subjects using machine learning techniques at1210. Datasets can be pre-processed using well-established machine learning techniques such as data cleaning, filtering, aggregation, imputation, normalization, and other machine learning techniques as known in the art. The model training module extracts and encodes machine learning features from the pre-processed diagnostic data at1220. Columns comprising the datasets can be mapped into machine learning features using feature encoding techniques such as, for example, one-hot encoding, severity encoding, presence-of-behavior encoding or any other feature encoding technique as known in the art. Some of these techniques are novel in nature and not commonly used in machine learning applications, but they are advantageous in the present application because of the nature of the problem at hand, specifically because of the discrepancy between the setting where clinical data is collected and the intended setting where the model will be applied. Presence of behavior encoding in particular is advantageous for the problem at hand especially, since the machine learning training data is comprised of clinical questionnaires filled by psycho-metricians having observed subjects for multiple hours. The answer codes they fill in can correspond to subtle levels of severity or differences in behavioral patterns that may only become apparent throughout the long period of observation. This data is then used to train models destined to be applied in a setting where only a few minutes of subject observation is available. Hence the subtleties in behavioral patterns are expected to be less often noticeable. Presence of behavioral encoding as described herein mitigates this problem by abstracting away the subtle differences between the answer choices and extracting data from the questionnaires only at the level of granularity that is expected to be reliably attained in the application setting. The model training module processes the encoded machine learning features at1230. In an embodiment, questionnaire answers can be encoded into machine learning features, after which, a sample weight can be computed and assigned to every sample of diagnostic data in a dataset, each sample corresponding to each subject having diagnostic data. Samples can be grouped according to subject-specific dimensions and sample weights can be computed and assigned to balance one group of samples against every other group of samples to mirror the expected distribution of subjects in an intended setting. For example, samples with positive classification labels might be balanced against those with negative classification labels. Alternatively or additionally, samples in each of multiple age group bins can be made to amount to an equal total weight. Additional sample balancing dimensions can be used such as gender, geographic region, sub-classification within the positive or negative class, or any other suitable dimension. The process of sample-weight adjustment might be further refined to mirror the expected distribution of subjects in the intended application setting. This can allow the trained models to be adapted to various specific application settings. For example, a model can be trained for use specifically as a level two screening tool by adjusting the sample weights in the training dataset to reflect the expected prevalence rates of diagnostic conditions in a level two diagnostic clinic. Another variant of the same screener can be trained for use as a general public screening tool, again by adjusting the weights of training samples to reflect and expected population of mostly neuro-typical subjects and a minority of positive samples with prevalence rates to match those in the general population. to mirror an expected distribution of subjects in an intended application setting. The model training module selects a subset of the processed machine learning features at1240. In an embodiment, with the training samples weighted accordingly, and all potential machine learning features encoded appropriately, feature selection can take place using a machine learning process generally known as bootstrapping, where multiple iterations of model training can be run, each using a random subsample of the training data available. After each run, a tally can be updated with the features the training process deemed necessary to include in the model. This list can be expected to vary from run to run, since the random data subsets used in training might contain apparent patterns that are incidental to the choice of data samples and not reflective of real life patterns for the problem at hand. Repeating this process multiple times can allow for the incidental patterns to cancel out, revealing the features that are reflective of patterns that can be expected to generalize well outside the training dataset and into the real world. The top features of the bootstrapping runs can then be selected and used exclusively for training the final model, which is trained using the entire training dataset, and saved for later application. Several models can be trained instead of one model, in order to specialize the models over a demographic dimension in situations where the dimension is expected to affect the choice of useful features. For example, multiple questionnaire-based models can be built, each for a specific age group, since the best questions to ask of a subject are expected to be different for each age group. In this case, only the right model for each subject is loaded at application time. The model training module evaluates each model at1250. In particular, each model can be evaluated for performance, for example, as determined by sensitivity and specificity for a pre-determined inclusion rate. In an embodiment, using a held-out dataset that was not used during the model training phase, the models can be evaluated for performance, in terms of inclusion rate, sensitivity, and specificity. The model training module tunes each model at1260. More specifically, to assess the performance of the models in different tuning settings, the tuning parameters of each model can be changed in iterative increments and the same metrics can be computed over the same held-out set in every iteration. The optimal settings can then be locked in and the corresponding models saved. Tuning parameters can include, for example, the number of trees in a boosted decision tree model, the maximum depth of every tree, the learning rate, the threshold of positive determination score, the range of output deemed inconclusive, and any other tuning parameter as known in the art. In a preferable embodiment, the parameter tuning process of1260can comprise a brute-force grid search, an optimized gradient descent or simulated annealing, or any other space exploration algorithm as known in the art. The models being tuned can undergo separate, independent tuning runs, or alternatively the models can be tuned in an ensemble fashion, with every parameter of every model explored in combination, in order to arrive at the optimal overall set of parameters at1270to maximize the benefit of using all the models in an ensemble. Moreover, in yet another aspect, tuning the inconclusive range of each predictive model can be augmented with an external condition, determined by a business need rather than a performance metric. For example, it can be deemed necessary for a particular classifier to have an inclusion rate of no less than 70%. In other words, the classifier would be expected to provide an evaluation indicating either the presence or the absence of a developmental condition for at least 70% of the subjects being classified, yielding an inconclusive determination for less than 30% of the subjects. Accordingly, the corresponding tuning process for the inconclusive output range would have to be limited to only the ranges where this condition is met. The models are tunable based on the context of the application. The predictive model can be configured to output a diagnosis having a particular degree of certainty that can be adjusted based on tuning of the inconclusive range. In addition, tuning of the inconclusive range can be exposed outside the offline machine learning phase. More specifically, tuning of the inconclusive range can be a configurable parameter accessible to agents operating the models after deployment. In this way, it is possible for an operator to dial the overall device up or down along the tradeoff between more inclusion and more accuracy. To support this case, multiple optimal inconclusive ranges might be explored and stored during the model training phase, each with its corresponding inclusion rate. The agent can then affect that change by selecting an optimal point from a menu of previously determined optimal settings. FIG.13is another operational flow of an evaluation module as described herein. As shown inFIG.13, a method1300is provided for outputting a conclusive prediction at1355indicating the presence or absence of a developmental condition, or an inconclusive determination of “No diagnosis” at1365. The evaluation module as depicted inFIG.13receives new data such as diagnostic data from or associated with a subject to be evaluated as having or not having a developmental condition at1310. Multiple saved assessment models that have been trained, tuned, and optimized as depicted inFIG.12and as described herein can be loaded at1320. Diagnostic data can be fit to these initial assessment models and outputs can be collected at1330. The evaluation module can combine the initial assessment model outputs at1340to generate a predicted initial classification of the subject. If the evaluation module determines that the initial prediction is conclusive at1350, it can output a conclusive determination indicating either the presence or absence of the developmental condition in the subject. If the evaluation module determines that the initial prediction is inconclusive at1350, it can then proceed to determine whether additional or more sophisticated assessment models are available and applicable at1360. If no additional assessment models are available or applicable, the evaluation module outputs an inconclusive determination of “No diagnosis.” If however, the evaluation module determines that additional or more sophisticated assessment models are available and applicable, it can proceed to obtain additional diagnostic data from or associated with the subject at1370. Next, the evaluation module can load the additional or more sophisticated assessment models at1380and can repeat the process of fitting data to the models, only this time, the additional data obtained at1370is fitted to the additional assessment models loaded at1380to produce new model outputs, which are then evaluated at1350for a conclusive prediction. This process as depicted by the loop comprising steps1350,1355,1360,1365,1370,1380and back to1330and1340can be repeated until either a conclusive prediction is output at1355, or if no more applicable classification models are available to use, an inconclusive determination of “No diagnosis” is output at1365. In particular, when data from a new subject is received as input at1310inFIG.13, each available model for preliminary determination is loaded at1320and run, outputting a numerical score at1330. The scores can then be combined using a combinatorial model. FIG.14is a non-limiting operational flow of the model output combining step depicted inFIG.13. As shown inFIG.14, a combiner module1400can collect the outputs from multiple assessment models1410,1420,1430, and1440, which are received by a model combinatory or combinatorial model1450. The combinatorial model can employ simple rule-based logic to combine the outputs, which can be numerical scores. Alternatively, the combinatorial model can use more sophisticated combinatorial techniques such as logistic regression, probabilistic modeling, discriminative modeling, or any other combinatorial technique as known in the art. The combinatorial model can also rely on context to determine the best way to combine the model outputs. For example, it can be configured to trust the questionnaire-based model output only in a certain range, or to defer to the video-based model otherwise. In another case, it can use the questionnaire-based model output more significantly for younger subjects than older ones. In another case, it can exclude the output of the video-based model for female subjects, but include the video-based model for male subjects. The combinatorial model output score can then be subjected to thresholds determined during the model training phase as described herein. In particular, as shown inFIG.14, these thresholds are indicated by the dashed regions that partition the range of numerical scores1460into three segments corresponding to a negative determination output1470, an inconclusive determination output1480, and a positive determination output1490. This effectively maps the combined numerical score to a categorical determination, or to an inconclusive determination if the output is within the predetermined inconclusive range. In the case of an inconclusive output, the evaluation module can determine that additional data should be obtained from the subject in order to load and run additional models beyond the preliminary or initial set of models. The additional models might be well suited to discern a conclusive output in cases where the preliminary models might not. This outcome can be realized by training additional models that are more sophisticated in nature, more demanding of detailed input data, or more focused on the harder-to-classify cases to the exclusion of the straightforward ones. FIG.15shows an example of a questionnaire screening algorithm configured to provide only categorical determinations of a developmental condition as described herein. In particular, the questionnaire screening algorithm depicted inFIG.15shows an alternating decision tree classifier that outputs a determination indicating only the presence or the absence of autism. The different shading depicts the total population of children who are autistic and not autistic and who are evaluated via the questionnaire. Also depicted are the results of the classifier, showing the correctly and incorrectly diagnosed children populations for each of the two categorical determinations. In contrast,FIG.16shows an example of a Triton questionnaire screening algorithm configured to provide both categorical and inconclusive determinations as described herein. In particular, the Triton algorithm depicted inFIG.16implements both age-appropriate questionnaires and age-specific models to yield specialized classifiers for each of two subgroups (i.e. “3 years old & under” and “4+ year olds”) within a relevant age group (i.e. “children”). It is clear from this example that the categorical determinations indicating the presence and absence of Autism in the two subgroups inFIG.16each have a higher accuracy when compared with the categorical determinations inFIG.15, as indicated by the different shaded areas showing the correctly and incorrectly diagnosed children populations for each of the two categorical determinations. By providing a separate category for inconclusive determinations, the Triton algorithm ofFIG.16is better able to isolate hard-to-screen cases that result in inaccurate categorical determinations as seen inFIG.15. A comparison of the performance for various algorithms highlights the advantages of the Triton algorithm, and in particular, the Triton algorithm having a context-dependent combination of questionnaire and video inputs.FIG.17shows a comparison of the performance for various algorithms in terms of a sensitivity-specificity tradeoff for all samples in a clinical sample as described herein. As shown inFIG.17, the best performance in terms of both sensitivity and specificity is obtained by the Triton algorithm configured for 70% coverage when combined with the video combinator (i.e. context-dependent combination of questionnaire and video inputs). FIG.18shows a comparison of the performance for various algorithms in terms of a sensitivity-specificity tradeoff for samples taken from children under 4 as described herein. The Triton algorithm configured for 70% coverage when combined with the video combinator (i.e. context-dependent combination of questionnaire and video inputs) has the best performance. FIG.19shows a comparison of the performance for various algorithms in terms of a sensitivity-specificity tradeoff for samples taken from children 4 and over described herein. For the most part, the Triton algorithm configured for 70% coverage when combined with the video combinator appears to have the best performance. FIGS.20-22, show the specificity for different algorithms at 75%-85% sensitivity range for all samples, for children under 4, and for children 4 and over. In all three cases, the Triton algorithm configured for 70% coverage when combined with the video combinator has the best performance, having 75% specificity for all samples, 90% specificity for children under 4, and 55% specificity for children 4 and over. Note that the Triton algorithm has the further advantage of flexibility. For example, tunable models are provided as described herein, wherein the inconclusive ratio or inclusion rate may be controlled or adjusted to control the tradeoff between coverage and reliability. In addition, the models described herein may be tuned to an application setting with respect to expected prevalence rates or based on expected population distributions for a given application setting. Finally, support for adaptive retraining enables improved performance over time given the feedback training loop of the method and device described herein. A person of ordinary skill in the art can generate and obtain additional datasets and improve the sensitivity and specificity and confidence interval of the methods and devices disclosed herein to obtain improved results without undue experimentation. Although these measurements were performed with example datasets, the methods and devices can be configured with additional datasets as described herein and the subject identified as at risk with a confidence interval of 80% in a clinical environment without undue experimentation. The sensitivity and specificity of 80% or more in a clinical environment can be similarly obtained with the teachings provided herein by a person of ordinary skill in the art without undue experimentation, for example with additional datasets. In some instances, an additional dataset is obtained based on clinician questionnaires and used to generate assessment models that can be used alone or in combination with other models. For example, a parent or caregiver questionnaire, clinician questionnaire, results of video analysis, or any combination thereof can provide the inputs to one or more preliminary assessment models corresponding to each data source. These preliminary assessment models can generate outputs such as preliminary output scores that may be combined to generate a combined preliminary output score as described herein. In certain instances, the assessment and/or diagnosis of the patient can be performed using an assessment module comprising a series of assessment models. The assessment module may interface or communicate with an input module configured to collect or obtain input data from a user. The series of assessment models can be used to inform the data collection process such that enough data is obtained to generate a conclusive determination. In some cases, the systems and methods disclosed herein collect an initial data set (e.g., including a parent or caregiver questionnaire) corresponding to the parent or caregiver assessment model using a first assessment module. The data set includes data corresponding to features of the assessment model, which can be evaluated in order to generate a determination, for example, a positive or negative determination (e.g., categorical determination) or an inconclusive determination regarding a behavioral disorder or condition such as autism. If the determination is inconclusive, then an additional data set may be obtained, for example, results of video analysis (e.g., an algorithmic or video analyst-based assessment of a captured video of the individual) using a second assessment module. Alternatively, in some cases, the results of video analysis are used along with the initial parent or caregiver data set to generate an assessment. This information may be incorporated into an assessment model configured to incorporate the additional data set from the video analysis to generate an updated determination. If the updated determination is still inconclusive, then another data set may be obtained, for example, a supplemental questionnaire by a healthcare provider such as a doctor or clinician (e.g., based on an in-person assessment) using a third assessment module. Such scenarios may occur in the case of especially difficult cases. Alternatively, the new data set may be optional and decided by the healthcare provider. The next data set may be obtained and then evaluated using an assessment model configured to incorporate this data in generating the next determination. Each of the series of assessment models may be configured to account for the existing data set and the new or additional data set in generating a determination. Alternatively, each of the series of assessment models may be only configured to account for the new or additional data set, and the outcome or score of the assessment models are simply combined as disclosed herein in order to generate the new or updated assessment outcome. The data sets can be obtained via one or more computing devices. For example, a smartphone of the parent or caregiver may be used to obtain input for the parent or caregiver questionnaire and to capture the video for analysis. In some cases, the computing device is used to analyze the video, and alternatively, a remote computing device or a remote video analyst analyzes the video and answers an analyst-based questionnaire to provide the input data set. In some cases, a computing device of a doctor or clinician is used to provide the input data set. The analysis of the video and the assessment or diagnosis based on the input data using the one or more assessment models can be performed locally by one or more computing devices (e.g., parent's smartphone) or remotely such as via cloud computing (e.g., computation takes place on the cloud, and the outcome/result is transmitted to the user device for display). For example, a system for carrying out the methods disclosed herein can include a parent or caregiver mobile application and/or device, a video analyst portal and/or device, and a healthcare provider device and/or dashboard. A benefit of this approach of dynamically obtaining new data sets based on the status of the current assessment outcome or determination is that the evaluation or diagnostic process is performed more efficiently without requiring more data than is necessary to generate a conclusive determination. Additional datasets may be obtained from large archival data repositories as described herein, such as the Autism Genetic Resource Exchange (AGRE), Boston Autism Consortium (AC), Simons Foundation, National Database for Autism Research, and the like. Alternatively or in combination, additional datasets may comprise mathematically simulated data, generated based on archival data using various simulation algorithms. Alternatively or in combination, additional datasets may be obtained via crowd-sourcing, wherein subjects self-administer the assessment procedure as described herein and contribute data from their assessment. In addition to data from the self-administered assessment, subjects may also provide a clinical diagnosis obtained from a qualified clinician, so as to provide a standard of comparison for the assessment procedure. In another aspect, a digital personalized medicine device as described herein comprises digital devices with processors and associated software configured to: receive data to assess and diagnose a patient; capture interaction and feedback data that identify relative levels of efficacy, compliance and response resulting from the therapeutic interventions; and perform data analysis, including at least one or machine learning, artificial intelligence, and statistical models to assess user data and user profiles to further personalize, improve or assess efficacy of the therapeutic interventions. The assessment and diagnosis of the patient in the digital personalized medicine device can categorize a subject into one of three categories: having one or more developmental conditions, being developmentally normal or typical, or inconclusive (i.e. requiring additional evaluation to determine whether the subject has any developmental conditions). In particular, a separate category can be provided for inconclusive determinations, which results in greater accuracy with respect to categorical determinations indicating the presence or absence of a developmental condition. A developmental condition can be a developmental disorder or a developmental advancement. Moreover, the methods and devices disclosed herein are not limited to developmental conditions, and may be applied to other cognitive functions, such as behavioral, neurological or mental health conditions. In some instances, the device can be configured to use digital diagnostics and digital therapeutics. Digital diagnostics and digital therapeutics can comprise a device or methods comprising collecting digital information and processing and evaluating the provided data to improve the medical, psychological, or physiological state of an individual. The device and methods described herein can categorize a subject into one of three categories: having one or more developmental conditions, being developmentally normal or typical, or inconclusive (i.e. requiring additional evaluation to determine whether the subject has any developmental conditions). In particular, a separate category can be provided for inconclusive determinations, which results in greater accuracy with respect to categorical determinations indicating the presence or absence of a developmental condition. A developmental condition can be a developmental disorder or a developmental advancement. Moreover, the methods and devices disclosed herein are not limited to developmental conditions, and may be applied to other cognitive functions, such as behavioral, neurological or mental health conditions. In addition, a digital therapeutic device can apply software based learning to evaluate user data, monitor and improve the diagnoses and therapeutic interventions provided by the device. Digital diagnostics in the device can comprise of data and meta-data collected from the patient, or a caregiver, or a party that is independent of the individual being assessed. In some instances the collected data can comprise monitoring behaviors, observations, judgements, or assessments may be made by a party other than the individual. In further instances, the assessment can comprise an adult performing an assessment or provide data for an assessment of a child or juvenile. Data sources can comprise either active or passive sources, in digital format via one or more digital devices such as mobile phones, video capture, audio capture, activity monitors, or wearable digital monitors. Examples of active data collection comprise devices, devices or methods for tracking eye movements, recording body or appendage movement, monitoring sleep patterns, recording speech patterns. In some instances, the active sources can include audio feed data source such as speech patterns, lexical/syntactic patterns (for example, size of vocabulary, correct/incorrect use of pronouns, correct/incorrect inflection and conjugation, use of grammatical structures such as active/passive voice etc., and sentence flow), higher order linguistic patterns (for example, coherence, comprehension, conversational engagement, and curiosity). Active sources can also include touch-screen data source (for example, fine-motor function, dexterity, precision and frequency of pointing, precision and frequency of swipe movement, and focus/attention span). Video recording of subject's face during activity (for example, quality/quantity of eye fixations vs saccades, heat map of eye focus on the screen, focus/attention span, variability of facial expression, and quality of response to emotional stimuli) can also be considered an active source of data. Passive data collection can comprise devices, devices, or methods for collecting data from the user using recording or measurements derived from mobile applications, toys with embed sensors or recording units. In some instances, the passive source can include sensors embedded in smart toys (for example, fine motor function, gross motor function, focus/attention span and problem solving skills) and wearable devices (for example, level of activity, quantity/quality of rest). The data used in the diagnosis and treatment can come from a plurality of sources, and may comprise a combination of passive and active data collection gathered from one device such as a mobile device with which the user interacts, or other sources such as microbiome sampling and genetic sampling of the subject. The methods and devices disclosed herein are well suited for the diagnosis and digital therapeutic treatment of cognitive and developmental disorders, mood and mental illness, and neurodegenerative diseases. Examples of cognitive and developmental disorders include speech and learning disorders and other disorders as described herein. Examples of mood and mental illness disorders, which can affect children and adults, include behavioral disorders, mood disorders, depression, attention deficit hyperactivity disorder (“ADHD”), obsessive compulsive disorder (“OCD”), schizophrenia, and substance-related disorders such as eating disorders and substance abuse. Examples of neurodegenerative diseases include age related cognitive decline, cognitive impairment progressing to Alzheimer's and senility, Parkinson's disease and Huntington's disease, and amyotrophic lateral sclerosis (“ALS”). The methods and devices disclosed herein are capable of digitally diagnosing and treating children and continuing treatment until the subject becomes an adult, and can provide lifetime treatment based on personalized profiles. The digital diagnosis and treatment as described herein is well suited for behavioral intervention coupled with biological or chemical therapeutic treatment. By gathering user interaction data as described herein, therapies can be provided for combinations of behavioral intervention data pharmaceutical and biological treatments. The mobile devices as described herein may comprise sensors to collect data of the subject that can be used as part of the feedback loop so as to improve outcomes and decrease reliance on user input. The mobile device may comprise passive or active sensors as described herein to collect data of the subject subsequent to treatment. The same mobile device or a second mobile device, such as an iPad™ or iPhone™ or similar device, may comprise a software application that interacts with the user to tell the user what to do in improve treatment on a regular basis, e.g. day by day, hour by hour, etc. The user mobile device can be configured to send notifications to the user in response to treatment progress. The mobile device may comprise a drug delivery device configured to monitor deliver amounts of a therapeutic agent delivered to the subject. The methods and devices disclosed herein are well suited for treatment of both parents and children, for example. Both a parent and a child can receive separate treatments as described herein. For example, neurological condition of the parent can be monitored and treated, and the developmental progress of the child monitored and treated. The mobile device used to acquire data of the subject can be configured in many ways and may combine a plurality of devices, for example. For example, since unusual sleep patterns may be related to autism, sleep data acquired using the therapeutic apparatus described herein can be used as an additional input to the machine learning training process for autism classifiers used by the diagnostic apparatus described above. The mobile device may comprise a mobile wearable for sleep monitoring for a child, which can be provide as input for diagnosis and treatment and may comprise a component of the feedback loop as described herein. Many types of sensor, biosensors and data can be used to gather data of the subject and input into the diagnosis and treatment of the subject. For example, work in relation to embodiments suggests that microbiome data can be useful for the diagnosis and treatment of autism. The microbiome data can be collected in many ways known to one of ordinary skill in the art, and may comprise data selected from a stool sample, intestinal lavage, or other sample of the flora of the subject's intestinal track. Genetic data can also be acquired an input into the diagnostic and therapeutic modules. The genetic data may comprise full genomic sequencing of the subject, of sequencing and identification of specific markers. The diagnostic and therapeutic modules as disclosed herein can receive data from a plurality of sources, such as data acquired from the group consisting of genetic data, floral data, a sleep sensor, a wearable anklet sleep monitor, a booty to monitor sleep, and eye tracking of the subject. The eye tracking can be performed in many ways to determine the direction and duration of gaze. The tracking can be done with glasses, helmets or other sensors for direction and duration of gaze. The data can be collected during a visual session such as a video playback or video game, for example. This data can be acquired and provided to the therapeutic module and diagnostic module as described herein before, during and after treatment, in order to initially diagnose the subject, determine treatment of the subject, modify treatment of the subject, and monitor the subject subsequent to treatment. The visual gaze, duration of gaze and facial expression information can be acquired with methods and devices known to one of ordinary skill in the art, and acquired as input into the diagnostic and therapeutic modules. The data can be acquired with an app comprising software instructions, which can be downloaded. For example, facial processing has been described by Gloarai et al. “Autism and the development of face processing”, Clinical Neuroscience Research 6 (2006) 145-160. An autism research group at Duke University has been conducting the Autism and beyond research study with a software app downloaded onto mobile devices as described on the web page at autismandbeyond.researchkit.duke.edu. Data from such devices is particularly well suited for combination in accordance with the present disclosure. Facial recognition data and gaze data can be input into the diagnostic and therapeutic modules as described herein. The platforms, systems, devices, methods, and media disclosed herein can provide an activity mode including various activities such as facial expression recognition activities. Facial expression recognition can be performed on one or more images. A computing device, for example a smartphone, can be configured to perform automatic facial expression recognition and deliver real-time social cues as described herein. The system can track expressive events in faces using the outward-facing camera on the smartphone and read the facial expressions or emotions by passing video and/or image or photographic data to a smartphone app for real-time machine learning-based classification of commonly used emotions (e.g., standardized Ekman “basic” emotions). Examples of such emotions include anger, disgust, fear, happiness, sadness, surprise, contempt, and neutral. The system can then provide real-time social cues about the facial expressions (e.g., “happy,” “angry,” etc.) to the subject or user through the smartphone. The cues can be visual, shown on the app, and/or auditory, through a speaker on the smartphone, or any combination thereof. The system can also record social responses, such as the amount and type of facial engagement and level of social interaction observed. In some embodiments, the emotion recognition system includes a computer vision pipeline beginning with a robust 23-point face tracker, followed by several lighting optimization steps such as gamma correction, difference of Gaussian filtering, and contrast equalization, or any combination thereof. In some embodiments, a histogram of oriented gradient features is extracted for the whole face and a logistic regression classifier is applied for final emotion prediction. The classifier model can be trained on a number of large existing facial expression recognition databases, as well as additional data gathered from other participants or subjects. In some embodiments, while a session is being conducted, a technique termed “neutral subtraction” allows the system to be calibrated in real-time to specific faces it sees during an interaction, allowing for increased personalize predictions for specific users. In certain instances, various modes of feedback is provided to the subject (e.g., the child), parents or caregivers, interventionists, clinicians, or any combination thereof. The system can be configured to provide progress feedback to clinicians, for example, through a healthcare provider portal as described herein. Feedback can include performance scores on various activities or games, indicating whether an emotional response is correct, explanation of incorrect answers, improvements or progress (e.g., progress in terms of emotion recognition activities over the past month), or other observations or commentary. Feedback can include performance metrics such as facial attention looking time, correct emotional responses, scores, and other metrics that can be optionally provided in a simple interface for review by clinicians and interventionists so that they can monitor the progress of the subject. Progress feedback can correspond to various domains or subdomains of behavior. For example, progress feedback and/or subject improvements can pertain to the socialization domain and/or specific subdomains including interpersonal relationships, play and leisure, and coping skills. Specific improvements can be tracked, for example, by monitoring and assessing performance and other metrics of the subject during the various digital therapeutic activities. As an example, an inward facing camera and/or microphone can be used to monitor facial engagement, emotional expression, gaze, verbal interactions (e.g., whether child verbally responds to a caregiver's question), and other behavior by the subject. The digital therapeutic platforms, systems, devices, methods, and media disclosed herein can be configured to evaluate a subject with respect to subdomains and associated deficits as well as determine whether the subject will benefit or improve with digital therapy. For example, interpersonal relationships can entail deficits in social-emotional reciprocity, deficits in nonverbal communicative behaviors used for social interaction, and deficits in developing, maintaining, and understanding relationships. The improvements provided herein can include increases in facial engagement, increases in understanding of emotional expression, and increases in opportunity and motivation for social engagement. The play and leisure subdomain can include deficits in developing, maintaining, and understanding relationships, which can be improved by digital therapeutic games and/or activities that encourage social play. Due to increases in facial engagement and understanding of emotional expression, the subject can become more adept at maintaining relationships. Social coping can entail an insistence on sameness, inflexible adherence to routines, or ritualized patterns of verbal or nonverbal behavior, and due to increases in facial engagement and understanding of emotional expression, the subject can become more able to cope with environmental stressors including that of better understanding social interactions. The therapeutic effects or results of subjects engaging in the therapeutic activities and/or games disclosed herein can be collected as additional data that is used to train machine learning models or classifiers for determining responsiveness to the therapy. In some embodiments, a subject who has been evaluated and positively identified as having (or predicted as having) autism spectrum disorder by a diagnostic or evaluation module can be then assessed by a machine learning model or classifier that predicts or determines the subject will be responsive or will benefit from one or more digital therapies disclosed herein. In some cases, individual activities or games or a plurality of activities or games are predicted to provide a significant therapeutic benefit with respect to one or more forms of social reciprocity. In some cases, the benefit is generally with respect to social reciprocity. Alternatively, or in combination, the benefit is determined with respect to specific domains or subdomains relating to social behavior or reciprocity, or other behavioral deficiencies. The digital therapeutic can be customized or personalized based on some or all of the diagnostic dimensions used in evaluating a subject for the presence of a disorder, condition, or impairment. For example, a subject may be assessed based on using a machine learning model that predicts the subject will benefit from emotion recognition activities in the socialization domain and/or specific subdomains such as interpersonal relationships, play and leisure, and/or coping skills. This can be based on the various diagnostic dimensions generated during the diagnostic process, which are then incorporated into the therapeutic customization process. A machine learning model may incorporate these dimensions in assessing a predicted or likelihood of improvement or benefit a subject may obtain from specific therapeutics, for example, emotion recognition activities or social reciprocity. In some cases, the subject is predicted to benefit regarding specific behaviors such as increased facial engagement or increased understanding of emotions expressed by others. A significant benefit or improvement may be established statistically using conventional statistical tools or metrics, or can be set (e.g., a threshold such as an average 10% improvement in emotion recognition scores after 3 weeks of treatment). In some embodiments, subject performance is monitored and collected onto a remote database server where it can be anonymized and combined with data for other subjects to form data sets used to train such machine learning models. The classifiers as disclosed herein are particularly well suited for combination with this data to provide improved therapy and treatment. The data can be stratified and used with a feedback loop as described herein. For example, the feedback data can be used in combination with a drug therapy to determine differential responses and identify responders and non-responders. Alternatively or in combination, the feedback data can be combined with non-drug therapy, such as behavioral therapy (e.g., a digital therapy described herein). With regards to genetics, recent work suggests that some people may have genes that make them more susceptible to autism. The genetic composition of the subject may render the subject more susceptible to environmental influences, which can cause symptoms and may influence the severity of symptoms. The environmental influence may comprise an insult from a toxin, virus or other substance, for example. Without being bound by any particular theory, this may result in mechanisms that change the regulation of expression genes. The change in expression of genes may be related to change in gastro-intestinal (“GI”) flora, and these changes in flora may affect symptoms related to Autism. Alternatively or in combination, an insult to the intestinal microbiome may result in a change in the microbiome of the subject, resulting in the subject having less than ideal homeostasis, which may affect associated symptoms related to Autism. The inventors note that preliminary studies withB. fragilisconducted by Sarkis K. Mazmanian and others, suggest changes in this micro-organism can be related to autism and the development of autisms. (See also, “Gut Bacteria May Play a Role in Autism” by Melinda Wenner Moyer, Scientific American, Sep. 1, 2014) The digital diagnostic uses the data collected by the device about the patient, which may include complimentary diagnostic data captured outside the digital diagnostic, with analysis from tools such as machine learning, artificial intelligence, and statistical modeling to assess or diagnose the patient's condition. The digital diagnostic can also provide assessment of a patient's change in state or performance, directly or indirectly via data and meta-data that can be analyzed and evaluated by tools such as machine learning, artificial intelligence, and statistical modeling to provide feedback into the device to improve or refine the diagnoses and potential therapeutic interventions. Analysis of the data comprising digital diagnostic, digital therapeutics, and corresponding responses, or lack thereof, from the therapeutic interventions can lead to the identification of novel diagnoses for patients and novel therapeutic regimens for both patents and caregivers. Types of data collected and utilized by the device can include patient and caregiver video, audio, responses to questions or activities, and active or passive data streams from user interaction with activities, games or software features of the device, for example. Such data can also represent patient or caregiver interaction with the device, for example, when performing recommended activities. Specific examples include data from a user's interaction with the device's device or mobile app that captures aspects of the user's behaviors, profile, activities, interactions with the software device, interactions with games, frequency of use, session time, options or features selected, and content and activity preferences. Data may also include streams from various third party devices such as activity monitors, games or interactive content. Digital therapeutics as described herein can comprise of instructions, feedback, activities or interactions provided to the patient or caregiver by the device. Examples include suggested behaviors, activities, games or interactive sessions with device software and/or third party devices (for example, the Internet of Things “IoT” enabled therapeutic devices as understood by one of ordinary skill in the art). FIG.23Aillustrates a device diagram for a digital personalized medicine platform2300for providing diagnosis and therapy related to behavioral, neurological or mental health disorders. The platform2300can provide diagnosis and treatment of pediatric cognitive and behavioral conditions associated with developmental delays, for example. A user digital device2310—for example, a mobile device such as a smart phone, an activity monitor, or a wearable digital monitor—records data and metadata related to a patient. Data may be collected based on interactions of the patient with the device, as well as based on interactions with caregivers and health care professionals. The data may be collected actively, such as by administering tests, recording speech and/or video, and recording responses to diagnostic questions. The data may also be collected passively, such as by monitoring online behavior of patients and caregivers, such as recording questions asked and topics investigated relating to a diagnosed developmental disorder. The digital device2310is connected to a computer network2320, allowing it to share data with and receive data from connected computers. In particular, the device can communicate with personalized medical device2330, which comprises a server configured to communicate with digital device2310over the computer network2320. Personalized medical device2330comprises a diagnosis module2332to provide initial and incremental diagnosis of a patient's developmental status, as well as a therapeutic module2334to provide personalized therapy recommendations in response to the diagnoses of diagnosis module2332. Each of diagnosis modules2332and2334communicate with the user digital device2310during a course of treatment. The diagnosis module provides diagnostic tests to and receives diagnostic feedback from the digital device2310, and uses the feedback to determine a diagnosis of a patient. An initial diagnosis may be based on a comprehensive set of tests and questions, for example, while incremental updates may be made to a diagnosis using smaller data samples. For example, the diagnostic module may diagnose autism-related speech delay based on questions asked to the caregiver and tests administered to the patient such as vocabulary or verbal communication tests. The diagnosis may indicate a number of months or years delay in speech abilities. Later tests may be administered and questions asked to update this diagnosis, for example showing a smaller or larger degree of delay. The diagnosis module communicates its diagnosis to the digital device2310, as well as to therapy module2334, which uses the diagnosis to suggest therapies to be performed to treat any diagnosed symptoms. The therapy module2334sends its recommended therapies to the digital device2310, including instructions for the patient and caregivers to perform the therapies recommended over a given time frame. After performing the therapies over the given time frame, the caregivers or patient can indicate completion of the recommended therapies, and a report can be sent from the digital device2310to the therapy module2334. The therapy module2334can then indicate to the diagnosis module2332that the latest round of therapy is finished, and that a new diagnosis is needed. The diagnostic module2332can then provide new diagnostic tests and questions to the digital device2310, as well as take input from the therapy module of any data provided as part of therapy, such as recordings of learning sessions or browsing history of caregivers or patients related to the therapy or diagnosed condition. The diagnostic module2332then provides an updated diagnosis to repeat the process and provide a next step of therapy. Information related to diagnosis and therapy can also be provided from personalized medical device2330to a third-party device2340, such as a computer device of a health care professional. The health care professional or other third party can be alerted to significant deviations from a therapy schedule, including whether a patient is falling behind an expected schedule or is improving faster than predicted. Appropriate further action can then be taken by the third party based on this provided information. FIG.23Billustrates a detailed diagram of diagnosis module2332. The diagnosis module2332comprises a test administration module2342that generates tests and corresponding instructions for administration to a subject. The diagnosis module2332also comprises a subject data receiving module2344in which subject data are received, such as test results; caregiver feedback; meta-data from patient and caregiver interactions with the device; and video, audio, and gaming interactions with the device, for example. A subject assessment module2346generates a diagnosis of the subject based on the data from subject data receiving module2344, as well as past diagnoses of the subject and of similar subjects. A machine learning module2348assesses the relative sensitivity of each input to the diagnosis to determine which types of measurement provide the most information regarding a patient's diagnosis. These results can be used by test administration module2342to provide tests which most efficiently inform diagnoses and by subject assessment module2346to apply weights to diagnosis data in order to improve diagnostic accuracy and consistency. Diagnostic data relating to each treated patient are stored, for example in a database, to form a library of diagnostic data for pattern matching and machine learning. A large number of subject profiles can be simultaneously stored in such a database, for example 10,000 or more. FIG.23Cillustrates a detailed diagram of therapy module2334. Therapy module2334comprises a therapy assessment module2352that scores therapies based on their effectiveness. A previously suggested therapy is evaluated based on the diagnoses provided by the diagnostic module both before and after the therapy, and a degree of improvement is determined. This degree of improvement is used to score the effectiveness of the therapy. The therapy may have its effectiveness correlated with particular classes of diagnosis; for example, a therapy may be considered effective for subjects with one type of diagnosis but ineffective for subjects with a second type of diagnosis. A therapy matching module2354is also provided that compares the diagnosis of the subject from diagnosis module2332with a list of therapies to determine a set of therapies that have been determined by the therapy assessment module2352to be most effective at treating diagnoses similar to the subject's diagnosis. Therapy recommendation module2356then generates a recommended therapy comprising one or more of the therapies identified as promising by the therapy matching module2354, and sends that recommendation to the subject with instructions for administration of the recommended therapies. Therapy tracking module2358then tracks the progress of the recommended therapies, and determines when a new diagnosis should be performed by diagnosis module2332, or when a given therapy should be continued and progress further monitored. Therapeutic data relating to each patient treated are stored, for example in a database, to form a library of therapeutic data for pattern matching and machine learning. A large number of subject profiles can be simultaneously stored in such a database, for example 10,000 or more. The therapeutic data can be correlated to the diagnostic data of the diagnostic module2332to allow a matching of effective therapies (e.g., digital therapies) to diagnoses. A therapy can comprise a digital therapy. A digital therapy can comprise a single or multiplicity of therapeutic activities or interventions that can be performed by the patient or caregiver. The digital therapeutic can include prescribed interactions with third party devices such as sensors, computers, medical devices and therapeutic delivery devices. Digital therapies can support an FDA approved medical claim, a set of diagnostic codes, or a single diagnostic code. FIG.24illustrates a method2400for diagnosis and therapy to be provided in a digital personalized medicine platform. The digital personalized medicine platform communicates with a subject, which may include a patient with one or more caregivers, to provide diagnoses and recommend therapies. In step2410the diagnosis module assesses the subject to determine a diagnosis, for example by applying diagnostic tests to the subject. The diagnostic tests may be directed at determining a plurality of features and corresponding feature values for the subject. For example, the tests may include a plurality of questions presented to a subject, observations of the subject, or tasks assigned to the subject. The tests may also include indirect tests of the subject, such as feedback from a caregiver of patient performance versus specific behaviors and/or milestones; meta-data from patient and caregiver interactions with the device; and video, audio, and gaming interactions with the device or with third party tools that provide data on patient and caregiver behavior and performance. For initial tests, a more comprehensive testing regimen may be performed, aimed at generating an accurate initial diagnosis. Later testing used to update prior diagnoses to track progress can involve less comprehensive testing and may, for example, rely more on indirect tests such as behavioral tracking and therapy-related recordings and meta-data. In step2412, the diagnosis module receives new data from the subject. The new data can comprise an array of features and corresponding feature values for a particular subject. As described herein, the features may comprise a plurality of questions presented to a subject, observations of the subject, or tasks assigned to the subject. The feature values may comprise input data from the subject corresponding to characteristics of the subject, such as answers of the subject to questions asked, or responses of the subject. The feature values may also comprise recorded feedback, meta-data, and device interaction data as described above. In step2414, the diagnosis module can load a previously saved assessment model from a local memory and/or a remote server configured to store the model. Alternatively, if no assessment model exists for the patient, a default model may be loaded, for example, based on one or more initial diagnostic indications. In step2416, the new data is fitted to the assessment model to generate an updated assessment model. This assessment model may comprise an initial diagnosis for a previously untreated subject, or an updated diagnosis for a previously treated subject. The updated diagnosis can include a measurement of progress in one or more aspects of a condition, such as memory, attention and joint attention, cognition, behavioral response, emotional response, language use, language skill, frequency of specific behaviors, sleep, socialization, non-verbal communication, and developmental milestones. The analysis of the data to determine progress and current diagnosis can include automated analysis such as question scoring and voice-recognition for vocabulary and speech analysis. The analysis can also include human scoring by analysis reviewing video, audio, and text data. In step2418, the updated assessment model is provided to the therapy module, which determines what progress has been made as a result of any previously recommended therapy. The therapy module scores the therapy based on the amount of progress in the assessment model, with larger progress corresponding to a higher score, making a successful therapy and similar therapies more likely to be recommended to subjects with similar assessments in the future. The set of therapies available is thus updated to reflect a new assessment of effectiveness, as correlated with the subject's diagnosis. In step2420, a new therapy is recommended based on the assessment model, the degree of success of the previous therapy, if any, and the scores assigned to a collection of candidate therapies based on previous uses of those therapies with the subject and other subjects with similar assessments. The recommended therapy is sent to the subject for administration, along with instructions of a particular span of time to apply it. For example, a therapy might include a language drill to be performed with the patient daily for one week, with each drill to be recorded in an audio file in a mobile device used by a caregiver or the patient. In step2422, progress of the new therapy is monitored to determine whether to extend a period of therapy. This monitoring may include periodic re-diagnoses, which may be performed by returning to step2410. Alternatively, basic milestones may be recorded without a full re-diagnosis, and progress may be compared to a predicted progress schedule generated by the therapy module. For example, if a therapy is unsuccessful initially, the therapy module may suggest repeating it one or more times before either re-diagnosing and suggesting a new therapy or suggesting intervention by medical professionals. FIG.25illustrates a flow diagram2500showing the handling of suspected or confirmed speech and language delay. In step2502an initial assessment is determined by diagnosis module2532. The initial assessment can assess the patient's performance in one or more domains, such as speech and language use, and assess a degree and type of developmental delay along a number of axes, as disclosed herein. The assessment can further place the subject into one of a plurality of overall tracks of progress; for example, the subject can be assessed as verbal or nonverbal. If the subject is determined to be non-verbal, as in step2510, one or more non-verbal therapies2512can be recommended by the therapy module2534, such as tasks related to making choices, paying attention to tasks, or responding to a name or other words. Further suggestions of useful devices and products that may be helpful for progress may also be provided, and all suggestions can be tailored to the subject's needs as indicated by the subject's diagnosis and progress reports. While applying the recommended therapies, progress is monitored in step2514to determine whether a diagnosis has improved at a predicted rate. If improvement has been measured in step2514, the device determines whether the subject is still non-verbal in step2516; if so, then the device returns to step2510and generates a new recommended therapy2512to induce further improvements. If no improvement is measured in step2514, the device can recommend that the therapy be repeated a predetermined number of times. The device may also recommend trying variations in therapy to try and get better results. If such repetitions and variations fail, the device can recommend a therapist visit in step2518to more directly address the problems impeding development. Once the subject is determined to be verbal, as indicated in step2520, verbal therapies2522can be generated by therapy module2534. For example, verbal therapies2522can include one or more of language drills, articulation exercises, and expressive requesting or communicating. Further suggestions of useful devices and products that may be helpful for progress may also be provided, and all suggestions can be tailored to the subject's needs as indicated by the subject's diagnosis and progress reports. As in the non-verbal track, progress in response to verbal therapies is continually monitored in step2524to determine whether a diagnosis has improved at a predicted rate. If improvement has been measured in step2524, the device reports on the progress in step326and generates a new recommended therapy2522to induce further improvements. If no improvement is detected in step2524, the device can recommend that the therapy be repeated a predetermined number of times. The device may also recommend trying variations in therapy to try and get better results. If such repetitions and variations fail, the device can recommend a therapist visit in step2528to more directly address the problems impeding development. The steps for non-verbal and verbal therapy can be repeated indefinitely, to the degree needed to stimulate continued learning and progress in the subject, and to prevent or retard regress through loss of verbal skills and abilities. While the specific therapy plan illustrated inFIG.25is directed towards pediatric speech and language delay similar plans may be generated for other subjects with developmental or cognitive issues, including plans for adult patients. For example, neurodegenerative conditions and/or age related cognitive decline may be treated with similar diagnosis and therapy schedules, using treatments selected to be appropriate to such conditions. Further conditions that may be treated in adult or pediatric patients by the methods and devices disclosed herein include mood disorders such as depression, OCD, and schizophrenia; cognitive impairment and decline; sleep disorders; addictive behaviors; eating disorders; and behavior related weight management problems. FIG.26illustrates an overall of data processing flows for a digital personalized medical device comprising a diagnostic module and a therapeutic module, configured to integrate information from multiple sources. Data can include passive data sources (2601), passive data can be configured to provide more fine grained information, and can comprise data sets taken over longer periods of time under more natural conditions. Passive data sources can include for example, data collected from wearable devices, data collected from video feeds (e.g. a video-enabled toy, a mobile device, eye tracking data from video playback), information on the dexterity of a subject based on information gathered from three-axis sensors or gyroscopes (e.g. sensors embedded in toys or other devices that the patient may interact with for example at home, or under normal conditions outside of a medical setting), smart devices that measure any single or combination of the following: subject's speech patterns, motions, touch response time, prosody, lexical vocabulary, facial expressions, and other characteristic expressed by the subject. Passive data can comprise data on the motion or motions of the user, and can include subtle information that may or may not be readily detectable to an untrained individual. In some instances, passive data can provide information that can be more encompassing. Passively collected data can comprise data collected continuously from a variety of environments. Passively collected data can provide a more complete picture of the subject and thus can improve the quality of an assessment. In some instances, for example, passively collected data can include data collected both inside and outside of a medical setting. Passively collected data taken in a medical setting can differ from passively collected data taken from outside a medical setting. Therefore, continuously collected passive data can comprise a more complete picture of a subject's general behavior and mannerisms, and thus can include data or information that a medical practitioner would not otherwise have access to. For example, a subject undergoing evaluation in a medical setting may display symptoms, gestures, or features that are representative of the subject's response to the medical environment, and thus may not provide a complete and accurate picture of the subject's behavior outside of the medical environment under more familiar conditions. The relative importance of one or more features (e.g. features assessed by a diagnostic module) derived from an assessment in the medical environment, may differ from the relative importance of one or more features derived from or assessed outside the clinical setting. Data can comprise information collected through diagnostic tests, diagnostic questions, or questionnaires (2605). In some instances, data from diagnostic tests (2605) can comprise data collected from a secondary observer (e.g. a parent, guardian, or individual that is not the subject being analyzed). Data can include active data sources (2610), for example data collected from devices configured for tracking eye movement, or measuring or analyzing speech patterns. As illustrated inFIG.26, data inputs can be fed into a diagnostic module which can comprise data analysis (2615) using for example a classifier, algorithm (e.g. machine learning algorithm), or statistical model, to make a diagnosis of whether the subject is likely to have a tested disorder (e.g. Autism Spectrum Disorder) (2620) or is unlikely to have the tested disorder (2625). The methods and devices disclosed herein can alternatively be employed to include a third inconclusive category (not depicted in this diagram), which corresponds to the subject requiring additional evaluation to determine whether he/she is or is not likely to have a tested disorder. The methods and devices disclosed herein are not limited to disorders, and may be applied to other cognitive functions, such as behavioral, neurological, mental health, or developmental conditions. The methods and devices may initially categorize a subject into one of the three categories, and subsequently continue with the evaluation of a subject initially categorized as “inconclusive” by collecting additional information from the subject. Such continued evaluation of a subject initially categorized as “inconclusive” may be performed continuously with a single screening procedure (e.g., containing various assessment modules). Alternatively or additionally, a subject identified as belonging to the inconclusive group may be evaluated using separate, additional screening procedures and/or referred to a clinician for further evaluation. In instances where the subject is determined by the diagnostic model as likely to have the disorder (2620), a secondary party (e.g. medical practitioner, parent, guardian or other individual) may be presented with an informative display. An informative display can provide symptoms of the disorder that can be displayed as a graph depicting covariance of symptoms displayed by the subject and symptoms displayed by the average population. A list of characteristics associated with a particular diagnosis can be displayed with confidence values, correlation coefficients, or other means for displaying the relationship between a subject's performance and the average population or a population comprised of those with a similar disorders. If the digital personalized medicine device predicts that the user is likely to have a diagnosable condition (e.g. Autism Spectrum Disorder), then a therapy module can provide a behavioral treatment (2630) which can comprise behavioral interventions; prescribed activities or trainings; interventions with medical devices or other therapeutics for specific durations or, at specific times or instances. As the subject undergoes the therapy, data (e.g. passive data and diagnostic question data) can continue to be collected to perform follow-up assessments, to determine for example, whether the therapy is working. Collected data can undergo data analysis (2640) (e.g. analysis using machine learning, statistical modeling, classification tasks, predictive algorithms) to make determinations about the suitability of a given subject. A growth curve display can be used to show the subject's progress against a baseline (e.g. against an age-matched cohort). Performance or progress of the individual may be measured to track compliance for the subject with a suggested behavioral therapy predicted by the therapy module may be presented as a historic and predicted performance on a growth curve. Procedures for assessing the performance of an individual subject may be repeated or iterated (2635) until an appropriate behavioral treatment is identified. The digital therapeutics treatment methods and devices described with reference toFIGS.23A-23CandFIGS.24-26are particularly well suited for combination with the methods and devices to evaluate subjects with fewer questions described herein with reference toFIGS.1A to10. For example, the components of diagnosis module2332as described herein can be configured to assess the subject with the decreased set of questions comprising the most relevant question as described herein, and subsequently evaluated with the therapy module2334to subsequently assess the subject with subsequent set of questions comprising the most relevant questions for monitoring treatment as described herein. FIG.27shows a device2700for evaluating a subject for multiple clinical indications. The device2700may comprise a plurality of cascaded diagnostic modules (such as diagnostic modules2720,2730,2740,2750, and2760). The cascaded diagnostic modules may be operatively coupled (such as in a chain of modules) such that an output from one diagnostic module may form an input to another diagnostic module. As shown inFIG.27, the device may comprise a social or behavioral delay module2720, an autism or ADHD module2730, an autism and ADHD discrimination module2740, a speech or language delay module2750, and an intellectual disability module2760. Modules (e.g., such as the diagnostic modules described with respect toFIG.27) as described anywhere herein may refer to modules comprising a classifier. Accordingly, a social or behavioral delay module may comprise a social or behavioral delay classifier, an autism or ADHD module may comprise an autism or ADHD classifier, an autism and ADHD discrimination module may comprise an autism and ADHD classifier, a speech or language delay module may comprise a speech or language delay classifier, an intellectual disability module may comprise an intellectual disability classifier, and so forth. The social or behavioral delay module2720may receive information2710, such as information from an interactive questionnaire described herein. The social or behavioral delay module may utilize any diagnostic operations described herein to determine a social or behavioral delay diagnostic status of the subject. For instance, the social or behavioral delay module may utilize any operations of the procedure1300described with respect toFIG.13to determine a social or behavioral delay diagnostic status (i.e., whether or not the subject displays behaviors consistent with social or behavioral delay). Upon a determination of the social or behavioral delay diagnostic status, the social or behavioral delay module may output a determination as to whether or not the subject displays social or behavioral delay. The social or behavioral delay module may output a positive identification2722indicating that the subject does display social or behavioral delay. The social or behavioral delay module may output a negative indication2724indicating that the subject does not display social or behavioral delay. The social or behavioral delay module may output an inconclusive indication2726indicating that the social or behavioral delay module has been unable to determine whether or not the subject displays social or behavioral delay. When the social or behavioral delay module determines that the subject does not display social or behavioral delay or that the result of the social or behavioral delay inquiry is indeterminate, the device may output such a result and halt its inquiry into the subject's social or behavioral health. However, when the social or behavioral delay module determines that the subject does display social or behavioral delay, the social or behavioral delay module may pass this result, and information2710, to the autism or ADHD module2730. The autism or ADHD delay module may utilize any diagnostic operations described herein to determine an autism or ADHD status of the subject. For instance, the autism or ADHD delay module may utilize any operations of the procedure1300described with respect toFIG.13to determine an autism or ADHD diagnostic status (i.e., whether or not the subject displays behaviors consistent with autism or ADHD). Upon a determination of the autism or ADHD diagnostic status, the autism or ADHD module may output a determination as to whether or not the subject displays autism or ADHD. The autism or ADHD module may output a positive identification2732indicating that the subject does display autism or ADHD. The autism or ADHD module may output a negative indication2734indicating that the subject does not display autism or ADHD. The autism or ADHD module may output an inconclusive indication2736indicating that the autism or ADHD module has been unable to determine whether or not the subject displays autism or ADHD. When the autism or ADHD module determines that the subject does not display autism or ADHD or that the result of the autism or ADHD inquiry is indeterminate, the device may output such a result and halt its inquiry into the subject's social or behavioral health. In such a scenario, the device may revert to the earlier diagnosis that the subject displays social or behavioral delay. However, when the autism or ADHD module determines that the subject does display autism or ADHD, the autism or ADHD module may pass this result, and information2710, to the autism and ADHD discrimination module2740. The autism and ADHD discrimination module may utilize any diagnostic operations described herein to discriminate between autism and ADHD. For instance, the autism and ADHD discrimination module may utilize any operations of the procedure1300described with respect toFIG.13to discriminate between autism and ADHD for the subject (i.e., to determine whether the subject displays behaviors that are more consistent with autism or with ADHD). Upon a discriminating between autism and ADHD, the autism and ADHD discrimination module may output a determination as to whether displays autism or whether the subject displays ADHD. The autism and ADHD discrimination module may output an indication2742indicating that the subject displays autism. The autism and ADHD discrimination module may output an indication2744indicating that the subject displays ADHD. The autism and ADHD discrimination module may output an inconclusive indication2746indicating that the autism and ADHD discrimination module has been unable to discriminate between whether the subject's behavior is more consistent with autism or with ADHD. When the autism and ADHD discrimination module determines that the result of the autism and ADHD discrimination inquiry is indeterminate, the device may output such a result and halt its inquiry into the subject's social or behavioral health. In such a scenario, the device may revert to the earlier diagnosis that the subject displays behavior consistent with autism or ADHD. Alternatively or in combination, the autism and ADHD discrimination module may be further configured to pass information2710to one or more additional modules. For instance, the autism and ADHD discrimination module may be configured to pass information to an obsessive compulsive disorder module (not shown inFIG.27). The obsessive compulsive disorder module may make a determination as to whether a subject displays behavior consistent with obsessive compulsive disorder using any of the platforms, systems, devices, methods, and media described herein (such as any operations of the procedure1300). Alternatively or in combination, the speech or language delay module2750may receive the information2710. The speech or language delay module may utilize any diagnostic operations described herein to determine a speech or language delay diagnostic status of the subject. For instance, the speech or language delay module may utilize any operations of the procedure1300described with respect toFIG.13to determine a speech or language delay diagnostic status (i.e., whether or not the subject displays behaviors consisting with speech or language delay). Upon a determination of the speech or language delay diagnostic status, the speech or language delay module may output a determination as to whether or not the subject displays speech or language delay. The speech or language delay module may output a positive identification2752indicating that the subject does display speech or language delay. The speech or language delay module may output a negative indication2754indicating that the subject does not display speech or language delay. The speech or language delay module may output an inconclusive indication2756indicating that the speech or language delay module has been unable to determine whether or not the subject displays speech or language delay. When the speech or language delay module determines that the subject does not display speech or language delay or that the result of the speech or language delay inquiry is indeterminate, the device may output such a result and halt its inquiry into the subject's speech or language health. However, when the speech or language delay module determines that the subject does display speech or language delay, the speech or language delay module may pass this result, and information2710, to the intellectual disability module2760. The intellectual disability module may utilize any diagnostic operations described herein to determine an intellectual disability status of the subject. For instance, the intellectual disability module may utilize any operations of the procedure1300described with respect toFIG.13to determine an intellectual disability diagnostic status (i.e., whether or not the subject displays behaviors consistent with intellectual disability). Upon a determination of the intellectual disability diagnostic status, the intellectual disability module may output a determination as to whether or not the subject displays intellectual disability. The intellectual disability module may output a positive identification2762indicating that the subject does display intellectual disability. The intellectual disability module may output a negative indication2764indicating that the subject does not display intellectual disability. The intellectual disability module may output an inconclusive indication2766indicating that the intellectual disability module has been unable to determine whether or not the subject displays intellectual disability. When the intellectual disability module determines that the subject does not display intellectual disability or that the result of the intellectual disability inquiry is indeterminate, the device may output such a result and halt its inquiry into the subject's speech or language health. In such a scenario, the device may revert to the earlier diagnosis that the subject displays speech or language delay. Alternatively or in combination, the intellectual disability module may be further configured to pass information2710to one or more additional modules. For instance, the intellectual disability module may be configured to pass information to a dyslexia module (not shown inFIG.27). The dyslexia module may make a determination as to whether a subject displays behavior consistent with dyslexia using any of the platforms, systems, devices, methods, and media described herein (such as any operations of the procedure1300). Though described with reference to social or behavioral delay, autism, ADHD, obsessive compulsive disorder, speech or language delay, intellectual disability, and dyslexia, the device2700may comprise any number of modules (such as 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more than 10 modules) that may provide a diagnostic status for any behavioral disorder. The modules may be operatively coupled (such as cascaded or chained) in any possible order. Disclosed herein, in various embodiments, are machine learning methods for analyzing input data including, for example, images in the case of emotion detection classifiers, parent/video analyst/clinician questionnaires in the case of detection of the presence of a behavioral, developmental, or cognitive disorder or condition, user input or performance (passive or active) or interactions with a digital therapy device (e.g., games or activities configured to promote emotion recognition), and other sources of data described herein. Disclosed herein, in various aspects, are platforms, systems, devices, methods, and media incorporating machine learning techniques (e.g., deep learning utilizing convolutional neural networks). In some cases, provided herein is an AI transfer learning framework for the analysis of image data for emotion detection. In certain aspects, disclosed herein are machine learning frameworks for generating models or classifiers that detect one or more disorders or conditions, and/or models or classifiers that determine a responsiveness or efficacy or likelihood of improvement using a digital therapy such as one configured to promote social reciprocity. These models or classifiers can be implemented in any of the systems or devices disclosed herein such as smartphones, mobile computing devices, or wearable devices. In some embodiments, the machine learning model or classifier exhibits performance metrics such as accuracy, sensitivity, specificity, positive predictive value, negative predictive value, and/or AUC for an independent sample set. In some embodiments, the model is evaluated for performance using metrics such as higher accuracy, sensitivity, specificity, positive predictive value, negative predictive value, and/or AUC for an independent sample set. In some embodiments, the model provides an accuracy of at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, or at least 99% when tested against at least 100, 200, 300, 400, or 500 independent samples. In some embodiments, the model provides a sensitivity (true positive rate) of at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, and/or a specificity (true negative rate) of at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, or at least 99% when tested against at least 100, 200, 300, 400, or 500 independent samples. In some embodiments, the model provides a positive predictive value (PPV) of at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, or at least 99% when tested against at least 100, 200, 300, 400, or 500 independent samples. In some embodiments, the model provides a negative predictive value (NPV) of at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, or at least 99% when tested against at least 100, 200, 300, 400, or 500 independent samples. In some embodiments, the model has an AUC of at least 0.7, 0.75, 0.8, 0.85, 0.9, 0.91, 0.92, 0.93, 0.94, 0.95, 0.96, 0.97, 0.98 or 0.99 when tested against at least 100, 200, 300, 400, or 500 independent samples. In some embodiments, the machine learning algorithm or model configured for detecting emotions in one or more images comprises a neural network. In some embodiments, transfer learning is used to generate a more robust model by first generating a pre-trained model trained on a large dataset of images (e.g., from ImageNet), freezing a portion of the model (e.g., several layers of a convolutional neural network), and transferring the frozen portion into a new model that is trained on a more targeted data set (e.g., images accurately labeled with the correct facial expression or emotion). In some embodiments, a classifier or trained machine learning model of the present disclosure comprises a feature space. In some embodiments, a feature space comprises information such as pixel data from an image. When training the model, training data such as image data is input into the machine learning algorithm which processes the input features to generate a model. In some embodiments, the machine learning model is provided with training data that includes the classification (e.g., diagnostic or test result), thus enabling the model to be trained by comparing its output with the actual output to modify and improve the model. This is often referred to as supervised learning. Alternatively, in some embodiments, the machine learning algorithm can be provided with unlabeled or unclassified data, which leaves the algorithm to identify hidden structure amongst the cases (referred to as unsupervised learning). Sometimes, unsupervised learning is useful for identifying the features that are most useful for classifying raw data into separate cohorts. In some embodiments, one or more sets of training data are used to train a machine learning model. In some embodiments, the machine learning algorithm utilizes a predictive model such as a neural network, a decision tree, a support vector machine, or other applicable model. In some embodiments, the machine learning algorithm is selected from the group consisting of a supervised, semi-supervised and unsupervised learning, such as, for example, a support vector machine (SVM), a Naïve Bayes classification, a random forest, an artificial neural network, a decision tree, a K-means, learning vector quantization (LVQ), self-organizing map (SOM), graphical model, regression algorithm (e.g., linear, logistic, multivariate, association rule learning, deep learning, dimensionality reduction and ensemble selection algorithms. In some embodiments, the machine learning model is selected from the group consisting of: a support vector machine (SVM), a Naïve Bayes classification, a random forest, and an artificial neural network. Machine learning techniques include bagging procedures, boosting procedures, random forest, and combinations thereof. Illustrative algorithms for analyzing the data include but are not limited to methods that handle large numbers of variables directly such as statistical methods and methods based on machine learning techniques. Statistical methods include penalized logistic regression, prediction analysis of microarrays (PAM), methods based on shrunken centroids, support vector machine analysis, and regularized linear discriminant analysis. The platforms, systems, devices, methods, and media described anywhere herein may be used as a basis for a treatment plan, or for administration of a drug, for a disorder diagnosed by any device or method for diagnosis described herein. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat acute stress disorder, such as propranolol, citalopram, escitalopram, sertraline, paroxetine, fluoxetine, venlafaxine, mirtazapine, nefazodone, carbamazepine, divalproex, lamotrigine, topiramate, prazosin, phenelzine, imipramine, diazepam, clonazepam, lorazepam, or alprazolam. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat adjustment disorder, such as buspirone, escitalopram, sertraline, paroxetine, fluoxetine, diazepam, clonazepam, lorazepam, or alprazolam. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat agoraphobia, such as diazepam, clonazepam, lorazepam, alprazolam, citalopram, escitalopram, sertraline, paroxetine, fluoxetine, or buspirone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat Alzheimer's disease, such as donepezil, galantamine, memantine, or rivastigmine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat anorexia nervosa, such as olanzapine, citalopram, escitalopram, sertraline, paroxetine, or fluoxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat anxiety disorders, such as sertraline, escitalopram, citalopram, fluoxetine, diazepam, buspirone, venlafaxine, duloxetine, imipramine, desipramine, clomipramine, lorazepam, clonazepam, or pregabalin. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat attachment disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat attention deficit/hyperactivity disorder (ADHD/ADD), such as amphetamine (for instance, in a dosage of 5 mg to 50 mg), dextroamphetamine (for instance, in a dosage of 5 mg to 60 mg), methylphenidate (for instance, in a dosage of 5 mg to 60 mg), methamphetamine (for instance, in a dosage of 5 mg to 25 mg), dexmethylphenidate (for instance, in a dosage of 2.5 mg to 40 mg), guanfacine (for instance, in a dosage of 1 mg to 10 mg), atomoxetine (for instance, in a dosage of 10 mg to 100 mg), lisdexamfetamine (for instance, in a dosage of 30 mg to 70 mg), clonidine (for instance, in a dosage of 0.1 mg to 0.5 mg), or modafinil (for instance, in a dosage of 100 mg to 500 mg). The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat autism or autism spectrum disorders, such as risperidone (for instance, in a dosage of 0.5 mg to 20 mg), quetiapine (for instance, in a dosage of 25 mg to 1000 mg), amphetamine (for instance, in a dosage of 5 mg to 50 mg), dextroamphetamine (for instance, in a dosage of 5 mg to 60 mg), methylphenidate (for instance, in a dosage of 5 mg to 60 mg), methamphetamine (for instance, in a dosage of 5 mg to 25 mg), dexmethylphenidate (for instance, in a dosage of 2.5 mg to 40 mg), guanfacine (for instance, in a dosage of 1 mg to 10 mg), atomoxetine (for instance, in a dosage of 10 mg to 100 mg), lisdexamfetamine (for instance, in a dosage of 30 mg to 70 mg), clonidine (for instance, in a dosage of 0.1 mg to 0.5 mg), or aripiprazole (for instance, in a dosage of 1 mg to 10 mg). The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat bereavement, such as citalopram, duloxetine, or doxepin. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat binge eating disorder, such as lisdexamfetamine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat bipolar disorder, such as topiramate, lamotrigine, oxcarbazepine, haloperidol, risperidone, quetiapine, olanzapine, aripiprazole, or fluoxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat body dysmorphic disorder, such as sertraline, escitalopram, or citalopram. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat brief psychotic disorder, such as clozapine, asenapine, olanzapine, or quetiapine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat bulimia nervosa, such as sertraline, or fluoxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat conduct disorder, such as lorazepam, diazepam, or clobazam. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat cyclothymic disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat delusional disorder, such as clozapine, asenapine, risperidone, venlafaxine, bupropion, or buspirone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat depersonalization disorder, such as sertraline, fluoxetine, alprazolam, diazepam, or citalopram. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat depression, such as sertraline, fluoxetine, citalopram, bupropion, escitalopram, venlafaxine, aripiprazole, buspirone, vortioxetine, or vilazodone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat disinhibited social engagement disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat disruptive mood dysregulation disorder, such as quetiapine, clozapine, asenapine, or pimavanserin. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat dissociative amnesia, such as alprazolam, diazepam, lorazepam, or chlordiazepoxide. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat dissociative disorder, such as bupropion, vortioxetine, or vilazodone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat dissociative fugue, such as amobarbital, aprobarbital, butabarbital, or methohexital. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat dissociative identity disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat dyslexia, such as amphetamine (for instance, in a dosage of 5 mg to 50 mg), dextroamphetamine (for instance, in a dosage of 5 mg to 60 mg), methylphenidate (for instance, in a dosage of 5 mg to 60 mg), methamphetamine (for instance, in a dosage of 5 mg to 25 mg), dexmethylphenidate (for instance, in a dosage of 2.5 mg to 40 mg), guanfacine (for instance, in a dosage of 1 mg to 10 mg), atomoxetine (for instance, in a dosage of 10 mg to 100 mg), lisdexamfetamine (for instance, in a dosage of 30 mg to 70 mg), clonidine (for instance, in a dosage of 0.1 mg to 0.5 mg), or modafinil (for instance, in a dosage of 100 mg to 500 mg). The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat dysthymic disorder, such as bupropion, venlafaxine, sertraline, or citalopram. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat eating disorders, such as olanzapine, citalopram, escitalopram, sertraline, paroxetine, or fluoxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat expressive language disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat gender dysphoria, such as estrogen, prostogen, or testosterone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat generalized anxiety disorder, such as venlafaxine, duloxetine, buspirone, sertraline, or fluoxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat hoarding disorder, such as buspirone, sertraline, escitalopram, citalopram, fluoxetine, paroxetine, venlafaxine, or clomipramine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat intellectual disability. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat intermittent explosive disorder, such as asenapine, clozapine, olanzapine, or pimavanserin. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat kleptomania, such as escitalopram, fluvoxamine, fluoxetine, or paroxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat mathematics disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat obsessive-compulsive disorder, such as buspirone (for instance, in a dosage of 5 mg to 60 mg), sertraline (for instance, in a dosage of up to 200 mg), escitalopram (for instance, in a dosage of up to 40 mg), citalopram (for instance, in a dosage of up to 40 mg), fluoxetine (for instance, in a dosage of 40 mg to 80 mg), paroxetine (for instance, in a dosage of 40 mg to 60 mg), venlafaxine (for instance, in a dosage of up to 375 mg), clomipramine (for instance, in a dosage of up to 250 mg), or fluvoxamine (for instance, in a dosage of up to 300 mg). The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat oppositional defiant disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat panic disorder, such as bupropion, vilazodone, or vortioxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat Parkinson's disease, such as rivastigmine, selegiline, rasagiline, bromocriptine, amantadine, cabergoline, or benztropine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat pathological gambling, such as bupropion, vilazodone, or vartioxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat pica. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat postpartum depression, such as sertraline, fluoxetine, citalopram, bupropion, escitalopram, venlafaxine, aripiprazole, buspirone, vortioxetine, or vilazodone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat posttraumatic stress disorder, such as sertraline, fluoxetine, or paroxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat premenstrual dysphoric disorder, such as estradiol, drospirenone, sertraline, citalopram, fluoxetine, or buspirone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat pseudobulbar affect, such as dextromethorphan hydrobromide, or quinidine sulfate. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat pyromania, such as clozapine, asenapine, olanzapine, paliperidone, or quetiapine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat reactive attachment disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat reading disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat Rett's syndrome. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat rumination disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat schizoaffective disorder, such as sertraline, carbamazepine, oxcarbazepine, valproate, haloperidol, olanzapine, or loxapine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat schizophrenia, such as chlorpromazine, haloperidol, fluphenazine, risperidone, quetiapine, ziprasidone, olanzapine, perphenazine, aripiprazole, or prochlorperazine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat schizophreniform disorder, such as paliperidone, clozapine, risperidone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat seasonal affective disorder, such as sertraline, or fluoxetine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat separation anxiety disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat shared psychotic disorder, such as clozapine, pimavanserin, risperidone, or lurasidone. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat social (pragmatic) communication disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat social anxiety phobia, such as amitriptyline, bupropion, citalopram, fluoxetine, sertraline, or venlafaxine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat somatic symptom disorder. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat specific phobia, such as diazepam, estazolam, quazepam, or alprazolam. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat stereotypic movement disorder, such as risperidone, or clozapine. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat stuttering. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat Tourette's disorder, such as haloperidol, fluphenazine, risperidone, ziprasidone, pimozide, perphenazine, or aripiprazole. The platforms, systems, devices, methods, and media described anywhere herein may be used to administer a drug to treat transient tic disorder, such as guanfacine, clonidine, pimozide, risperidone, citalopram, escitalopram, sertraline, paroxetine, or fluoxetine. FIG.28shows a drug that may be administered in response to a diagnosis by the platforms, systems, devices, methods, and media described herein. The drug may be contained within a container2800, such as a pill bottle. The container may have a label2810bearing instructions “If diagnosed with disorder x, administer drug y”. The disorder x may be any disorder described herein. The drug y may be any drug described herein. FIG.29shows a diagram of a platform for assessing an individual as described herein. The platform architecture as illustrated inFIG.29includes the various sources of input, specifically the caregiver or user mobile application or device2901, the video analyst portal2902, and the healthcare provider dashboard2903. These input data sources communicate with the rest of the platform via the internet2914which itself interfaces with a video storage service2912and a load balancer gateway2916. The load balancer gateway2916is in operative communication with the application server2918which utilizes an index service2924and an algorithm and questionnaire service2926to assist with data analysis. The application server2918can source data from the video storage service2912and the primary database2910for use in the analysis. A logging or audit service may also be used to document any events such as what user data is accessed and how it is used in order to help ensure privacy and HIPAA compliance. FIG.30shows a non-limiting flow diagram for evaluating an individual. A caregiver or healthcare provider raises concerns about a child3001after which a ASD device is prescribed for the child3002in which the healthcare provider determines the use of this device is appropriate and explains its use to the caregiver. Later, the caregiver completes a first module including a caregiver questionnaire and uploads the response and 2 videos3003. Next, a video analyst evaluates the uploaded videos3004and provides a response to complete the second module. The healthcare provider also has discretion to complete a third module including a clinician/healthcare provider questionnaire3005. This third module may be completed during the appointment with the child or outside of the appointment. The device then returns the result of the assessment3006. In the case of a positive assessment3007or a negative assessment3008for ASD, the healthcare provider provides a review of the result in conjunction with clinical presentation to make a diagnosis. The final assessment result is then a positive ASD diagnosis3010or a negative ASD diagnosis3011. FIG.31Ashows a login screen for a mobile device for assessing an individual in accordance with the platforms, systems, devices, methods, and media described herein. The login can include a username and password for accessing the personal account associated with a caregiver and/or the subject to be assessed. FIG.31Bshows a screen of the mobile device indicating completion of a user portion of the an ASD evaluation, for example, of a first assessment module. FIG.31Cshows a screen of the mobile device providing instructions for capturing a video of the subject who is suspected as having ASD. The screen shows interactive elements that are selectable by the user to initiate video recording for a first video and a second video corresponding to different play times by the subject. FIG.31D,FIG.31E, andFIG.31Fshow screens of the mobile device prompting a user to answer questions for use in assessing a subject in accordance with the platforms, systems, devices, methods, and media described herein. FIG.32shows a display screen of a video analyst portal displaying questions as part of a video analyst questionnaire. The responses to this questionnaire can form a portion of the input to the assessment model(s) or classifier(s), for example, in a second assessment module as described herein. FIG.33shows a display screen of a healthcare provider portal displaying questions as part of a healthcare provider questionnaire. The responses to this questionnaire can form a portion of the input to the assessment model(s) or classifier(s), for example, in a third assessment module as described herein. FIG.34shows a display screen of a healthcare provider portal displaying uploaded information for an individual including videos and a completed caregiver questionnaire in accordance with the platforms, systems, devices, methods, and media described herein. FIG.35shows a diagram of a platform for providing digital therapy to a subject as described herein, including the mobile device software and server software. The mobile device software includes an augmented reality game module3501, an emotion recognition engine3502, a video recording/playback module3503, and a video review game3504(e.g., emotion guessing or recognition game). The server software includes an API service3510, an application database3511, video storage3512, healthcare provider portal3513, and the healthcare provider or therapist review portal3514on a local computing device. FIG.36shows a diagram of a device configured to provide digital therapy in accordance with the platforms, systems, devices, methods, and media described herein. In this illustrative example, the device is a smartphone3601having an outward facing camera that allows a user to capture one or more images (e.g., photographs or video) of another individual3603. Face tracking is performed to identify one or more faces3604within the one or more images. The identified face is analyzed in real-time for emotion classification3605. The classification is performed using a classifier configured to categorize the face as exhibiting an emotion selected from a plurality of emotions3606. In this example, the smartphone3601is in an unstructured play or otherwise free roaming mode in which the classified emotion is portrayed with a corresponding emoticon3602on the display screen to provide dynamic or real-time feedback to the user. FIG.37shows an operational flow of a combined digital diagnostic and digital therapeutic. In this non-limiting embodiment, the digital diagnostic operations include the application of diagnostic input modalities3701(e.g., inputs corresponding to parent/caretaker questionnaire, clinician questionnaire, video-based inputs, sensor data, etc.). The input data is then used in the computation of internal diagnostic dimensions3702, for example, a subject can be projected onto a multi-dimensional diagnostic space based on the input data. The diagnostic dimensions are projected into scalar output3703. This scalar output is evaluated against a threshold3704. For example, a threshold can be a scalar value that determines the cut-off between a positive, negative, and optionally an inconclusive determination for the presence of a disorder, condition, or impairment, or a category or group thereof. Accordingly, the resulting outcome or prediction is generated3705. The outcome or prediction can be a predicted medical diagnosis and/or can be taken into account by a clinician in making a medical diagnosis. Next, a therapy can be prescribed3706based on the diagnosis or outcome of the diagnostic process. The digital therapeutic operations include obtaining or receiving the internal diagnostic dimensions3707from the digital diagnostic operations. The customized and/or optimized therapeutic regimen is then generated3708based on the internal diagnostic dimensions3707and the prescription3706. The digital therapeutic regimen is then administered3709, for example, through the same computing device used to make the diagnosis or evaluation of the subject. The digital therapeutic regimen can include one or more activities or games determined to increase or maximize improvements in the subject with respect to one or more functions associated with the diagnosed disorder, condition, or impairment. For example, the activities or games can include emotional cue recognition activities using facial recognition and automatic real-time emotion detection implemented via a smartphone or tablet. User progress can be tracked and stored in association with the specific user or subject3710. Progress tracking allows for the monitoring of performance and adjustments or changes to the games or activities based on the progress over time. For example, the customized therapeutic regimen for the subject is shifted away from activities or games that the subject is excelling at, or alternatively, the difficulty level is increased. EXAMPLES Example 1 Assessment Modules A smartphone device is configured with a series of assessment modules configured to obtain data and evaluate the data to generate an assessment of an individual. Module 1—Caregiver Assessment The caregiver assessment is designed to probe behavioral patterns similar to those probed by a standardized diagnostic instrument, the Autism Diagnostic Interview—Revised (ADIR)—but is presented in a simplified manner in order to be concise and easy for caregivers to understand. The device presents a minimal set of the most predictive questions to the caregiver to identify key behavioral patterns. A caregiver will be provided a series of multiple-choice questions based on the age of the child, which is typically completed within 10-15 minutes. For children 18 through 47 months, the caregiver will be asked to answer 18 multiple-choice questions which fall into the following categories:Non-verbal communicationSocial interactionUnusual sensory interests/reactions. For children 48 through 71 months, the caregiver will be asked to answer 21 multiple-choice questions which fall into the following categories:Non-verbal communicationReciprocal verbal communicationSocial interactionUnusual sensory interests/reactionsRepetitive/Restricted behaviors or interests. Module 2—Video Analysis Module 2 requires caregivers to upload 2 videos each of at least 1 minute in duration of the child's natural play at home with toys and other people. Detailed instructions are provided in-app to the caregiver. The videos are uploaded securely to a HIPAA secure server. Each submission is scored by analysts independently of each other who evaluate behaviors observed by answering a series of multiple-choice questions evaluating phenotypic features of ASD on the combinative videos. The video analysts do not have access to the caregiver responses from Module 1 or the HCP responses from Module 3. For children 18-47 months old, the video analyst evaluates the child's behavior with 33 questions while children 48-71 months old are evaluated with 28 questions which fall into the following categories:Non-verbal and verbal communicationSocial interactionUnusual sensory interests/reactionsStereotyped or repetitive motor movements, use of objects, or speech. For every question, the analysts have the option of selecting: “The footage doesn't provide enough opportunity to assess reliably.” In addition, analysts may deem a submission un-scorable if one or more videos are unhelpful for any reason such as: poor lighting, poor video or audio quality, bad vantage point, child not present or identifiable within a group, insufficient interaction with the child. If un-scorable, caregivers will be notified and requested to upload additional videos. The algorithm underlying the medical device will use the questionnaire answers coming from each of the video analysts separately, as follows: for each of the analysts, the fully answered questionnaire will be input to the Module 2 algorithm as a set of input features, to which the algorithm will output a numerical response internally. This will be repeated for each of the analysts individually, resulting in a set of numerical responses. The numerical responses will then be averaged, and the average of the responses will be considered the overall output of Module 2. The output of Module 2 is then combined with the output of the other modules in order to arrive at a singular categorical outcome. Module 3—Healthcare Provider Assessment The HCP will be provided a series of questions based on the age of the child. For children 18 through 47 months, the HCP will be asked to answer 13 multiple-choice questions. For children 48 through 71 months, the HCP will be asked to answer 15 multiple-choice questions. Prior to completing Module 3, the HCP will not have access to the caregiver responses from Module 1. The HCP will not have access to the video analysts responses from Module 2. The questions fall into the following categories:DevelopmentLanguage and communicationSensory, repetitive, and stereotypic behaviorSocial Algorithmic Outputs After the (3) modules are completed, the inputs are evaluated to determine whether there is sufficient information to make a determination. The dynamic algorithms used to generate the determination:Utilize non-observable co-dependencies and non-linearity of informationIdentify a minimal set of maximally predictive featuresCan dynamically substitute “next most relevant” information to generate diagnostic output Underlying each of the Modules 1, 2, and 3 comprising the medical device is an independently trained machine learning predictive model. Each of the three models is trained offline using a dedicated training set of thousands of samples of historical medical instrument scoresheets at the question-answer item level, as well as the corresponding diagnostic labels, such that the training process is a supervised machine learning run. The machine learning algorithmic framework is GBDT (Gradient Boosted Decision Trees), which, upon training on the data in the training set, produces a set of automatically-created decision trees, each using some of the input features in the training set, and each producing a scalar output when run on new feature data pertaining to a new patient submission. The scalar outputs from each of the trees is summed up in order to arrive at the total scalar output of the classification model. Therefore, when used in prediction, each of the three modules outputs a single scalar value that is considered an intermediate output of the overall algorithm. The scalar outputs from each of the three classification algorithms are passed as inputs into a second stage combinatorial classification model, which is trained independently on 350 historical data submissions collected in clinical studies. This combinatorial model is probabilistic in nature and is trained to take into account the covariance matrix between all three individual module classifiers. It outputs a single scalar value that represents a combined output of all three modules, and its output is then compared to preset thresholds in order to produce a categorical outcome that can be considered a determination of whether the child is Positive for ASD or Negative for ASD. The device is also designed to allow for no result output when the prediction is weak. If a categorical determination cannot be provided, the healthcare provider will be informed that the device is not able to provide a result for autism spectrum disorder (ASD) at that point of time (“No Result”). Specifically, a patient may exhibit sufficient number and/or severity of features for which the patient is unable to be confidently placed within the algorithmic classifier as being negative for ASD but exhibits insufficient number and/or severity of features for which the patient is unable to be confidently placed within the algorithmic classifier as being positive of ASD. In these cases, the Algorithm does not provide a result (“No Result” case). In most cases (patients), the Algorithm will provide one of two distinct diagnostic outputs—Positive ASD, Negative ASD. Example 2 Patient Evaluation Overview During a patient examination, the healthcare provider (HCP) has concerns about the child's development based on observations and/or caregivers' concerns. HCP then prescribes a device configured with a digital application and provides an overview of the device to the caregiver. Once the device has been dispensed by the pharmacy, the caregiver accesses the app. The caregiver leaves the HCP's office, downloads the app and creates an account. The caregiver is then prompted to answer questions about the child's behavior/development in the app (Module 1). Once done, caregiver is required to record and upload two videos of the child in the child's natural home environment. Detailed instructions are provided in the app. If videos are too short, too long or do not conform with technical instructions, the caregiver will not able to upload them and is provided with additional instructions as to what needs to be corrected in order to proceed. Once videos are uploaded, the caregiver is notified that they will be contacted for next steps. Once videos are uploaded, trained video analysts are prompted to review uploaded videos through a video analyst portal. The video analysts are blinded to the caregiver responses in Module 1, as well as the HCP responses from Module 3. The video analysts answer questions about the child's behavior exhibited in the videos, subject to defined requirements and quality controls (Module 2). Caregivers may be notified that additional videos need to be uploaded if video analysts deem that a video is not “assessable”. Once the device is prescribed, the HCP is prompted by Cognoa to answer a set of questions about the child's behavior/development (Module 3). HCPs will follow their standard practice guidelines for documentation for completion of Module 3. Prior to answering Module 3 questions, the HCP is blinded to caregiver responses in Module 1 and Video Analysts responses from Module 2. Once all 3 Modules are completed, dynamic machine-learning algorithms evaluate and combine the modules' inputs through complex multi-level decision trees to provide an output. The HCP is notified to log in to the HCP dashboard and review the overall device's assessment result, alongside the instructions for use of the device indicating that the result should be used in conjunction with the clinical presentation of the patient. The HCP reviews the device's result, in conjunction with medical evaluation of the child's clinical presentation to make a definitive diagnosis within his/her scope of practice. The device's result will help HCP to diagnose ASD, or to determine that the child does not have ASD. In some cases, the HCP will be notified that the device is not able to provide a result. In these cases, the HCP must make the best decision for the patient at his/her discretion; however, in this situation, the Device makes no recommendations, nor does it provide further clinical instructions or guidance on next steps for the HCP. Lastly, after the Device has rendered an output, the HCP will have access to caregiver responses to Module 1, raw patient videos and the clinical performance testing data regarding the device. Example 3 ASD Positive Evaluation Scenarios ASD Positive Scenario A During a patient examination in a primary care setting, a licensed healthcare provider has concerns about a 2 year-old child's development based on observations and caregiver's concern. The patient has speech delay and his mother states he does not respond to his name when called, but his hearing evaluation was normal and he can become easily irritated by soft sounds. The primary healthcare provider assesses whether the use of the Cognoa Device is appropriate according to the device's labeling and directs the caregiver to use the device via a prescription. The caregiver leaves the clinic, downloads the software, completes Module 1 and uploads videos of the patient. Video Analysts complete Module 2 by scoring the submitted videos via the Analyst Portal. The healthcare provider accesses Module 3 via the Provider Portal and completes the healthcare provider questionnaire. The device analyzes the information provided considering key developmental behaviors that are most indicative of autism and the healthcare provider is notified of the device result once available. The healthcare provider is presented with a report indicating the patient is “Positive for ASD” and the supporting data that were used to determine the result are available for the healthcare provider to review. The healthcare provider reviews the result and determines that the result matches the clinical presentation and provides the diagnosis of ASD in a face-to-face visit with the caregiver where the diagnosis is explained and therapies are prescribed as per the American Academy of Pediatrics recommendations. ASD Positive Scenario B During a patient examination in a primary care setting, a licensed healthcare provider evaluates a 3½ year old child's development. The patient has odd use of language but speech is not delayed. Parents report she also makes odd repetitive noises. She seems to lack awareness of danger and often invades the personal space of strangers. The healthcare provider assesses whether the use of the Device is appropriate according to the device's labeling and directs the caregiver to use the device via a prescription. The caregiver leaves the clinic, downloads the software, completes Module 1 and uploads videos of the patient. Video Analysts complete Module 2 by scoring the submitted videos via the Analyst Portal. The healthcare provider accesses Module 3 via the Provider Portal and completes the healthcare provider questionnaire. The device analyzes the information provided considering key developmental behaviors that are most indicative of autism and the healthcare provider is notified of the device result once available. The healthcare provider is presented with a report indicating the patient is “Positive for ASD” and the supporting data that were used to determine the result are available for the healthcare provider to review. The healthcare provider reviews the Device result and determines that the result is most consistent with ASD. The healthcare provider provides the diagnosis of ASD in a face to face visit with the caregiver where the diagnosis is explained and therapies are prescribed as per the American Academy of Pediatrics recommendations. Example 4 ASD Negative Evaluation Scenario ASD Negative Scenario A During a patient examination in a primary care setting, a licensed healthcare provider evaluates a 5 year old child's development. The patient has hyperactive behavior and is easily distractible. His mother states he does not respond to his name when called and she needs to call him several times before he acknowledges her. The patient also struggles with peer relationships and has difficulty making friends. The healthcare provider is concerned about possible autism but is most suspicious of ADHD. The healthcare provider assesses whether the use of the Device is appropriate according to the device's labeling and directs the caregiver to use the device via a prescription. The healthcare provider also requests for the parent and Kindergarten teacher to complete the Vanderbilt ADHD assessment. The caregiver leaves the clinic, downloads the software, completes Module 1 and uploads videos of the patient. Video Analysts complete Module 2 by scoring the submitted videos via the Analyst Portal. The healthcare provider accesses Module 3 via the Provider Portal and completes the healthcare provider questionnaire. The device analyzes the information provided considering key developmental behaviors that are most indicative of autism and the healthcare provider is notified of the device result once available. The healthcare provider is presented with a report indicating the patient is “Negative for ASD” and the supporting data that were used to determine the result are available for the healthcare provider to review. The healthcare provider reviews the Device result and the Vanderbilt assessment to determine that the diagnosis is most consistent with ADHD. The healthcare provider provides the diagnosis of ADHD predominantly hyperactive type in a face to face visit with the caregiver where the diagnosis is explained and therapies are prescribed as per the American Academy of Pediatrics recommendations. The healthcare provider monitors the patient's response to behavioral therapy and prescribes a non-stimulant ADHD medication keeping the possibility of ASD in the differential diagnosis. The patient responds well to therapy and medication with no longer exhibiting signs concerning for ASD reinforcing the diagnosis of ADHD. ASD Negative Scenario B During a patient examination in a primary care setting, a parent reports that the 18 month patient's older sibling has an autism diagnosis and his father has noted some episodes of aggressiveness and possible stereotypic behaviors. The patient has met all his developmental milestones and his examination and interactions in the clinic are age appropriate. The father shows the healthcare provider videos of the patient exhibiting stereotypic behaviors similar to the older sibling. The healthcare provider assesses whether the use of the Cognoa Device is appropriate according to the device's labeling and directs the caregiver to use the device via a prescription. The caregiver leaves the clinic, downloads the software, completes Module 1 and uploads videos of the patient. Cognoa Video Analysts complete Module 2 by scoring the submitted videos via the Cognoa Analyst Portal. The healthcare provider accesses Module 3 via the Cognoa Provider Portal and completes the healthcare provider questionnaire. The device analyzes the information provided considering key developmental behaviors that are most indicative of autism and the healthcare provider is notified of the device result once available. The healthcare provider is presented with a report indicating the patient is “Negative for ASD” and the supporting data that were used to determine the result are available for the healthcare provider to review. The healthcare provider reviews the Cognoa Device result and determines that the patient is most likely imitating the older sibling. The healthcare provider monitors the patient's development and provides parenting guidance on redirection when the patient exhibits aggressive or stereotypic behaviors. Example 5 ASD Inconclusive Evaluation Scenario ASD Inconclusive Scenario A During a patient examination in a primary care setting, a 5½ year old is reported by the parent to have learning difficulties and the school has recommended an individualized education plan assessment be performed for possible placement into the special education system. The patient makes poor eye contact with the healthcare provider in the clinic and is slow to answer questions with a flattened affect. There are no signs of neglect or abuse and no reported hallucinations. Laboratory evaluation reveal a normal CBC, CMP, and TSH. The healthcare provider assesses whether the use of the Cognoa Device is appropriate according to the device's labeling and directs the caregiver to use the device via a prescription. The caregiver leaves the clinic, downloads the software, completes Module 1 and uploads videos of the patient. Video Analysts complete Module 2 by scoring the submitted videos via the Analyst Portal. The healthcare provider accesses Module 3 via the Provider Portal and completes the healthcare provider questionnaire. The device analyzes the information provided considering key developmental behaviors that are most indicative of autism and the healthcare provider is notified that the device cannot provide a result regarding ASD at this point in time based on the information provided. Use of the Device stops at this point. At this point, the HCP uses their professional decision-making to determine the next steps for the patient. ASD Inconclusive Scenario B Since starting Kindergarten, a 5 year old who has had speech delay but has been making progress in speech therapy, has been noted by his teacher as arguing frequently with adults, losing his temper easily, refusing to follow rules, blaming others for his own mistakes, deliberately annoying others, and otherwise behaving in angry, resentful, and vindictive ways. The parent brings these concerns to the child's primary care healthcare provider. The healthcare provider assesses whether the use of the Device is appropriate according to the device's labeling and directs the caregiver to use the device via a prescription. The caregiver leaves the clinic, downloads the software, completes Module 1 and uploads videos of the patient. Video Analysts complete Module 2 by scoring the submitted videos via the Analyst Portal. The healthcare provider accesses Module 3 via the Provider Portal and completes the healthcare provider questionnaire. The device analyzes the information provided considering key developmental behaviors that are most indicative of autism and the healthcare provider is notified that the device cannot provide a result regarding ASD at this point in time based on the information provided. Use of the Device stops at this point. At this point, the HCP use their professional decision-making to determine the next steps for the patient. Example 6 Emotion Recognition Digital Therapy A patient is assessed using the device as described in any of the preceding examples and determined to be positive for ASD. The device used for assessment and/or a different device is configured with a digital therapy application for treating the patient through training for emotion recognition (“therapeutic device”). In this case, the device is a smartphone configured with a mobile application for providing the digital therapy. The HCP prescribes the device and/or mobile application for treating the patient. The patient or a parent or caregiver is given access to the therapeutic device and registers/logs into a personal account for the mobile application. The mobile application provides selectable modes for the patient including an activity mode comprising emotion elicitation activities, emotion recognition activities, and unstructured play. The patient or a parent or caregiver selects unstructured play, causing the device to activate the camera and display a graphic user interface that dynamically performs facial recognition and emotion detection/classification in real time as the patient points the outward facing camera towards other persons. When the patient points the camera at a particular individual, an image of the individual is analyzed to identify at least one emotion, and the graphic user interface displays the emotion or a representation thereof (e.g., an emoji or words describing or corresponding to the emotion). This allows the patient to observe and learn the emotion(s) that are being displayed by the person being observed with the camera. In some cases, there is a delay in the display of the emotion on the interface to allow the patient time to attempt to identify the emotion before being given the “answer”. Each positively identified emotion and its corresponding image(s) is then stored in an image library. The caregiver moderates the digital therapy session, wherein the child uses the smartphone to walk around their home, office, or other familiar environment, and “find” or try to elicit an emotion that is prompted by audio in-app. Often, in the home setting, the emotion will be generated by the caregiver; the instructions to the caregiver will be to replicate the requested emotion or to intentionally provide the wrong face. During use of the device in areas with multiple people, the caregiver instructions will instruct the caregiver to help the child find individuals with the prompted facial expression; if none exist, the caregiver may choose to replicate the emotion or prompt another individual in close proximity to replicate the emotion without alerting the child. The child points the phone camera towards the individual who they believe is expressing the prompted emotion; the mobile app has an Augmented Reality (AR) component wherein there is an alert to the child when a face is detected. The screen then provides the child real-time audio and visual feedback correctly labeling the emotional expression displayed on the face (e.g., an emoticon is displayed in real-time, on-screen, with the corresponding emotion). The emoticon remains on screen in the augmented reality environment as the child continues using the product After the patient has collected a number of images in the image library, the patient then switches out of the unstructured play activity and selects the emotion recognition activities. The patient then selects an emotion recognition game or emotion guessing game for reinforcement learning. An emotion guessing game stores previous images that the child has evaluated mixed with stock face images (from pre-reviewed sources). The goal of this activity is to (a) review images that were not evaluated correctly by the children and have the caregiver correct it and (b) reinforce and remind the child of their correct choices to improve retention. The child can then try to correctly match or label the emotional expressions displayed in the images. The goal from this EGG is to reinforce the learnings from the augmented reality unstructured play session in a different, 2D environment. It also provides additional social interaction opportunities between caregiver and child to review and discuss the emotions together. Various reinforcement learning games are provided for selection by the patient. Examples of these games are shown below:(A) A game shows three images that the patient has collected (may be mixed with stock images) that have been classified as showing three different emotions: happy, sad, and angry. The game provides a visual and audio prompt asking the patient to select the image that shows the “happy” emotion. The patient selects a image, and is then given feedback based on whether the selection is correct. The patient proceeds to complete several of these activities using various images that have been collected.(B) A game shows a single image of a person that the patient has collected (or stock image) and is presented with a prompt to determine the emotion shown in the image. The patient can be shown a multiple choice selection of emotions. The emotions may be selectable or the patient may be able to drag the emotion to the image or vice versa.(C) A mix and match emotion recognition activity. In this case, a column of 3 collected (or stock) images are displayed on the left of the graphic user interface screen, and a column of 3 emotions are displayed on the right of the graphic user interface. The interface allows the user to select an image and then a corresponding emotion to “match” them together. Once the images and emotions have all been matched, the patient is provided with feedback based on performance. Alternatively, two columns of images and emotions are shown, and the patient is able to drag and drop to align an image with a corresponding emotion in the same row in order to “match” them together.(D) A dynamic emotion sorting game. Two or more buckets are provided at the bottom of the screen, each bucket having an emotion label, while various collected images float through the screen. The patient is instructed to drag each image into the appropriate bucket. Once all images have been sorted into a bucket, the patient is provided with feedback based on performance. The emotion recognition games and activities described herein can be provided for various emotion recognition and learning purposes and not just for reinforcement learning using collected images that the user has already been exposed to. The patient's performance during an activity can be tracked or monitored when available. As the patient completes an activity in a sequence of activities, the next activity provided can be biased or weighted towards selection of images that test for emotions where the patient has relatively poor performance. The patient then switches to emotion elicitation activities. These activities are designed to provide stimulus calculated to evoke an emotion. The emotional stimulus is selected from an image, a sequence of images, a video, a sound, or any combination thereof. Examples of emotional stimuli include audiovisual content designed to elicit fear (spider, monster) and happiness or joy (children's song or show). The emotional response elicited in the patient can be determined by an inward facing camera of the device. For example, the camera can capture one or more images of the patient's face while the emotional stimulus is being provided, which are then evaluated to detect any emotional response. The response can be monitored over time to track any changes in the patient's responsiveness to emotional stimuli. Example 7 Digital Diagnostic and Digital Therapy A patient is assessed using a smartphone device in accordance with any of the preceding examples and determined to be positive for ASD. This positive assessment is then taken into account by a HCP who diagnoses the patient as having ASD and prescribes the patient a digital therapy application for treating the patient through the same smartphone device. The patient or a parent or caregiver is given access to the therapeutic device and registers/logs into a personal account for the mobile application. The personal account contains the diagnostic information used in assessing the patient. This diagnostic information is computed to determine the patient's position within a multi-dimensional space relating to various aspects of the ASD such as, for example, specific impairments like decreased social reciprocity. These internal diagnostic dimensions are then used to identify an activity that is predicted to improve the patient's impaired ability to engage in social reciprocity. The identified activity is an activity mode comprising activities for monitoring and improving social reciprocity. One example of such an activity mode for monitoring and improving social reciprocity is a modification of the unstructured play in which the user is prompted to respond to the facial expression or emotional cue detected in the parent or caregiver. The patient or a parent or caregiver selects the modified unstructured play, causing the device to activate both the inward-facing camera and the outward-facing camera, and display a graphic user interface that dynamically performs facial recognition and emotion detection/classification in real time of a target individual (e.g., a parent) as the patient points the outward facing camera towards other persons and the patient using the inward facing camera (e.g., selfie camera). When the patient points the camera at a particular individual, one or more images or video of the individual is analyzed to identify at least one emotion, and the graphic user interface displays the emotion or a representation thereof (e.g., an emoji or words describing or corresponding to the emotion). This allows the patient to observe and learn the emotion(s) that are being displayed by the person being observed with the camera. In some cases, there is a delay in the display of the emotion on the interface to allow the patient time to attempt to identify the emotion before being given the “answer”. Each positively identified emotion and its corresponding image(s) is then stored in an image library. In addition to detection of the target individual's emotion, the device captures images or video of the patient's facial expression and/or emotion simultaneously or close in temporal proximity to the analysis of the target individual. The social interaction between the patient and the target individual can be captured this way as the combined facial expression and/or emotion of both persons. The time stamps of the detected expressions or emotions of the individuals are used to determine a sequence of social interactions, which are then evaluated for the patient's ability to engage in social reciprocity. The patient's performance is monitored and linked to the personal account to maintain an ongoing record. This allows for continuing evaluations of the patient to generate updated diagnostic dimensions that can be used to update the customized therapeutic regimen. In one instance, the patient points the phone at his parent who smiles at him. The display screen of the phone displays an emoticon of a smiley face in real time to help the patient recognize the emotion corresponding to his parent's facial expression. In addition, the display screen optionally provides instructions for the patient to respond to the parent. The patient does not smile back at his parent, and the inward facing camera captures this response in one or more images or video. The images and/or videos and a timeline or time-stamped sequence of social interactions are then saved on the device (and optionally uploaded or saved on a remote network or cloud). In this case, the parent's smile is labeled as a “smile”, and the patient's lack of response is labeled as “non-responsive” or “no smile”. Thus, this particular social interaction is determined to be a failure to engage in smile-reciprocity. The social interaction can also be further segmented based on whether the target individual (parent) and the patient expressed a “genuine” smile as opposed to a “polite smile”. For example, the algorithms and classifiers described herein for detecting a “smile” or “emotion” can be trained to distinguish between genuine and polite smiles, which can be differentiated based on visual cues corresponding to the engagement of eye muscles in genuine smiles and the lack of eye muscle engagement in police smiles. While preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby. | 285,470 |
11862340 | DESCRIPTION OF THE PREFERRED EMBODIMENTS The following description of the preferred embodiments of the invention is not intended to limit the invention to these preferred embodiments, but rather to enable any person skilled in the art to make and use this invention. 1. Overview. As shown inFIGS.2-3and8, an embodiment of a method200for assessing cardiovascular disease in a user using a camera module, the method including: receiving a time series of image data S210of a body region of the user, the time series of image data captured during a time period; generating a photoplethysmogram (PPG) dataset from the time series of image data S220; generating a processed PPG dataset S230; determining a cardiovascular parameter value of the user based on the processed PPG dataset S240; fitting a chronobiological model S265to (1) the cardiovascular parameter value, and (2) a subsequent cardiovascular parameter value, characterizing a cardiovascular parameter variation over time of the user based on the fitted chronobiological model S260; and presenting an analysis of the cardiovascular parameter variation to the user at a mobile computing device associated with the camera module S270. While variations of the method100implement a mobile computing device comprising a camera module, some variations of the method100can alternatively omit use of a mobile computing device camera module. In some variations, the method200functions to assess cardiovascular disease-related health states in a user using a mobile computing device with a camera module. The method200can further function to alert a user, a care provider, and/or any other suitable entity of cardiovascular risks identified in a user. The method200can additionally or alternatively function to automatically facilitate therapy provision to a user based on analysis of determined cardiovascular parameter variation. The method200is preferably performed with an embodiment, variation, or example of the system100described below, but can alternatively be performed with any other suitable system100. 2. Benefits. In specific examples, the system100and/or method200can confer several benefits over conventional methodologies for determining and cardiovascular parameters for managing cardiovascular disease. In specific examples, the system100and/or method200can perform one or more of the following: First, the technology can provide a convenient, frictionless user experience. For example, rather than requiring an external device usually coupled to a smart phone, portions of the method200can be implemented with consumer smartphone devices (or other mobile computing devices). In specific examples, cardiovascular parameters and cardiovascular risks can be determined based on image data captured from a smartphone camera by a user. Such implementation can reduce the need for user-specific a priori calibration using statistical modeling of population data across demographics and disease. In variations, the method200can be performed without supplementary electrocardiogram datasets, circumventing the need for an ECG biosignal detector. Second, the technology can improve upon existing sensor technology by improving specificity in ascertaining and managing cardiovascular disease burden in individuals. Such specificity can aid in providing targeted therapies to patients. For example, improvements in specificity can be ascertained in determining cardiovascular parameters such as: heart rate, heart rate variability, blood pressure, blood pressure variability, measures of blood vessel stiffness, measures indicative of atherosclerosis, and/or other relevant cardiovascular parameters indicative of cardiovascular risk. Third, the technology can leverage imaged-derived signal processing technologies to specifically determine and assess cardiovascular parameters in order to enable automatic facilitation of therapy provision, including: modulating medication provision, automatically adjusting environmental aspects of the user to promote health of the user, providing tailored medical recommendations, facilitating digital communications between patients and care providers, and/or any suitable therapy provision for managing cardiovascular disease. Fourth, the technology can confer improvements to the technological areas of at least biosensors, leveraging mobile computing device technology to determine cardiovascular parameters, and digital management of cardiovascular disease. Such improvements can be conferred through, for example, the facilitation of self- and/or remote-cardiovascular health monitoring, enabling a more convenient user experience for improving user adherence. Further, a frictionless user experience can be provided while maintaining a sufficient level of specificity of physiological monitoring of cardiovascular disease-related health states, in order to enable automatic, tailored therapy provision. Fifth, the technology can confer improvements in a mobile computing device itself that is implementing one or more portions of the method200, as the mobile computing device can be transformed into a biosignal detector with high specificity in determining relevant cardiovascular parameters and/or managing cardiovascular disease. In examples, the technology can enable cardiovascular parameter evaluation using fewer sources of data (e.g., without electrocardiogram data), thus requiring computing systems to process fewer types of data. Sixth, the technology can provide technical solutions necessarily rooted in computer technology (e.g., leveraging a mobile computing device to capture image data; transforming image data to different states such as raw and processed biosignals used for determining cardiovascular status of individuals; automatically facilitating therapy provision based on such data, etc.) to overcome issues specifically arising with computer technology (e.g., how to leverage mobile computing systems for cardiovascular management in a user-frictionless manner; how to allow computer systems to determine certain cardiovascular parameters using fewer types of data; how to facilitate digital communication of time-sensitive data amongst a system of computing systems, in order to enable automatic therapy provision in situations where the patient is at risk, etc.). The technology can, however, provide any other suitable benefit(s) in the context of using non-generalized computer systems for digital health applications. 3. System. As shown inFIG.1, an embodiment of a system100for assessing cardiovascular risks in a user can include a data collection module110, a data processing module120, a data analysis module130, and an output module140. The system100functions to determine cardiovascular parameter variations (e.g., diurnal blood pressure variations, variations in other cardiovascular parameters, etc.) of a user over time through analysis of data collected at a mobile computing system with a camera module112. The system100preferably enables or otherwise performs an embodiment, variation, or example of the method200described above, but can alternatively facilitate performance of any suitable method involving determination of cardiovascular parameter variation over time. In some embodiments, the system100can additionally or alternatively include or communicate data to and/or from: a user database (storing user account information, user profiles, user health records, user demographic information, associated care provider information, associated guardian information, user device information, etc.), an analysis database (storing computational models, collected data, historical signal data, public data, simulated data, determined cardiovascular parameters, etc.), and/or any other suitable computing system. Database(s) and/or portions of the method200can be entirely or partially executed, run, hosted, or otherwise performed by: a remote computing system (e.g., a server, at least one networked computing system, stateless computing system, stateful computing system, etc.), a user device (e.g., a device of a user executing an application for collecting data and determining associated cardiovascular parameters), a care provider device (e.g., a device of a care provider associated with a user of the application executing on the user device), a machine configured to receive a computer-readable medium storing computer-readable instructions, or by any other suitable computing system possessing any suitable component (e.g., a graphics processing unit, a communications module, etc.). However, the modules of the system100can be distributed across machine and cloud-based computing systems in any other suitable manner. Devices implementing at least a portion of the method200can include one or more of: a smartwatch, smartphone, a wearable computing device (e.g., head-mounted wearable computing device), tablet, desktop, a camera module112, a supplemental sensor, a biosignal detector, an implantable medical device, an external medical device, and/or any other suitable device, as described in more detail below. All or portions of the method200can be performed by one or more of: a native application, web application, firmware on the device, plug-in, and any other suitable software executing on the device. Device components used with the method200can include an input (e.g., keyboard, touchscreen, etc.), an output (e.g., a display), a processor, a transceiver, and/or any other suitable component, wherein data from the input device(s) and/or output device(s) can be collected and/or transmitted to entities for analysis (e.g., to determine cardiovascular parameter variation over time). Communication between devices and/or databases can include wireless communication (e.g., WiFi, Bluetooth, radiofrequency, etc.) and/or wired communication. The data collection module110, data processing module120, data analysis module130, output module140, any other suitable component of the system100, and/or any suitable step of the method200can employ machine learning approaches including any one or more of: supervised learning (e.g., using logistic regression, using back propagation neural networks, using random forests, decision trees, etc.), unsupervised learning (e.g., using an Apriori algorithm, using K-means clustering), semi-supervised learning, reinforcement learning (e.g., using a Q-learning algorithm, using temporal difference learning), and any other suitable learning style. Each module of the plurality can implement any one or more of: a regression algorithm (e.g., ordinary least squares, logistic regression, stepwise regression, multivariate adaptive regression splines, locally estimated scatterplot smoothing, etc.), an instance-based method (e.g., k-nearest neighbor, learning vector quantization, self-organizing map, etc.), a regularization method (e.g., ridge regression, least absolute shrinkage and selection operator, elastic net, etc.), a decision tree learning method (e.g., classification and regression tree, iterative dichotomiser 3, C4.5, chi-squared automatic interaction detection, decision stump, random forest, multivariate adaptive regression splines, gradient boosting machines, etc.), a Bayesian method (e.g., naïve Bayes, averaged one-dependence estimators, Bayesian belief network, etc.), a kernel method (e.g., a support vector machine, a radial basis function, a linear discriminate analysis, etc.), a clustering method (e.g., k-means clustering, expectation maximization, etc.), an associated rule learning algorithm (e.g., an Apriori algorithm, an Eclat algorithm, etc.), an artificial neural network model (e.g., a Perceptron method, a back-propagation method, a Hopfield network method, a self-organizing map method, a learning vector quantization method, etc.), a deep learning algorithm (e.g., a restricted Boltzmann machine, a deep belief network method, a convolution network method, a stacked auto-encoder method, etc.), a dimensionality reduction method (e.g., principal component analysis, partial lest squares regression, Sammon mapping, multidimensional scaling, projection pursuit, etc.), an ensemble method (e.g., boosting, boostrapped aggregation, AdaBoost, stacked generalization, gradient boosting machine method, random forest method, etc.), and any suitable form of machine learning algorithm. Each processing portion of the method200can additionally or alternatively leverage: a probabilistic module, heuristic module, deterministic module, or any other suitable module leveraging any other suitable computation method, machine learning method or combination thereof. 3.1 Data Collection Module As shown inFIG.1, the data collection module110functions to collect data for processing and analysis in order to determine cardiovascular parameters of the user. The data collection module110preferably includes a camera module112and a signal generation module. Additionally or alternatively, the data collection module no can include: a biosignal detector (e.g., a heart rate monitor, etc.), a supplemental sensor (e.g., a sensor of a smartphone, a sensor of a wearable fitness device, etc.), and/or any other suitable component. 3.1.A Camera Module With respect to variations where the data collection module110includes a camera module112, the camera module112preferably includes at least one camera unit112configured to generate image data and/or video data from a body region (e.g., a finger region a head region, and/or any suitable human body region) of the individual. The camera module112is preferably a component of a mobile computing system associated with a user, but can additionally or alternatively be a component of a mobile computing system associated with a care provider, an organization, a guardian, and/or any other suitable entity. The camera module112can alternatively be a component distinct from a mobile computing system, but can otherwise take any suitable form. Additionally or alternatively, the camera module112can include a second camera unit configured to generate ambient light data for normalization of the time series of image data. However, the camera module112and associated image data can possess any suitable characteristic. Image data captured from the camera module112and/or supplementary sources can include: a single image, a composite image (e.g., mosaic including multiple images stitched together), a time series of image data (e.g., multiple images captured in series over time), a video, multi-dimensional image data, graphics, patterns, animations, and/or any other suitable static or moving image data. The image data can be of any suitable type (e.g., vector images, raster images, multispectral images, ultraspectral images, etc.), have any suitable color characteristic (e.g., color, black and white, multiple color channels, image intensity, etc.), resolution characteristic, multi-dimensional characteristic, and/or any suitable image parameter. The image data is preferably associated with one or more temporal indicators (e.g., a time point, a time period, a time unit, etc. The temporal indicator can be a time point relative to a time period, an absolute time (e.g., indicated by a global timestamp), or any other suitable measure of time. The time period is preferably associated with a feature of a human day (e.g., a daytime period, a nighttime period, a sleeping phase, a waking phase, a morning, an afternoon, a night, a sunrise, a sunset, a dawn, a dusk, a twilight, etc.), but can additionally or alternatively be associated with any other suitable feature. In a first example, a daytime period includes the time from sunrise to sunset, and the nighttime period includes the time from sunset to sunrise. In a second example, a sleeping phase can include: stage 1, 2, 3, 4, and/or rapid eye movement sleep. The time period can include any suitable duration of time (e.g., a second, minute, hour, day, week, month, year, etc.), which can be a continuous duration (e.g., a continuous 24 hour period), or a non-continuous duration (e.g., a 24 hour period composed of different hours of different days). The temporal indicator can additionally or alternatively describe time in relation to any suitable reference point (e.g., number of hours after awakening, after sleeping, after sunrise, after sunset, etc.). However, temporal indicators can possess any suitable characteristic, and can be associated with any suitable data structure (e.g., PPG data, cardiovascular parameters, analyses of cardiovascular parameters, notifications, therapy provision, etc.) and/or component. The image data is preferably received at a remote computing system that stores and processes the image data. Alternatively, the image can be entirely or partially processed at a user mobile computing device, but can additionally or alternatively be received and/or processed at any suitable component. The image data preferably includes a set of image elements. Types of image elements can include a pixel, a superpixel, a digital value, an image segment, or any other suitable image element. Alternatively, the image includes a single image element. However, the image can include any number of image elements defined in any suitable fashion. 3.1.B Signal Generation Module With respect to variations where the data module no includes a signal generation module, the signal generation module preferably converts image data captured by the camera module112into a raw signal indicating a biological characteristic of a user. The raw signal preferably includes a PPG signal, but can additionally or alternatively include any other signal. When the raw signal includes a PPG signal, the PPG signal preferably arises from optical measurement of illuminated tissue (e.g., tissue structures perfused with blood). Additionally or alternatively, the signal module can convert image data that does not originate from the camera module112, such as public image data of body regions of patients. However, the signal generation module can leverage any suitable image data to generate any suitable type of signal. 3.2 Data Processing Module As shown inFIG.1, the data processing module120functions to process image data and/or raw signals (e.g., a PPG dataset) in order to generate a processed dataset for analysis by the data analysis module130in determining a cardiovascular parameter of the user. The data processing module120is preferably implemented at a remote server, but can additionally or alternatively be implemented at a mobile computing device of the user and/or any other computing system. The data processing module120preferably performs processing on a PPG dataset generated by the signal generation module from image data captured by the camera module112, but the data processing module120can additionally or alternatively process any other suitable dataset (e.g., non-PPG datasets, ECG datasets, PPG datasets collected from other sources, etc.). The data processing module120can perform operations associated with embodiments, variations, or examples of the method200described including one or more of: normalization, filtering, noise reduction, smoothing, model fitting, transformations, mathematical operations (e.g., calculating a first derivative of collected signals, positive component squared operations, operations associated with moving averages, etc.), image processing, and/or any other suitable processing. During operation, the data processing module120can additionally or alternatively correct for one or more of: body region placement errors with respect to captured image data by the camera module112(e.g., a misplaced finger relative a camera module112of a user smartphone camera), variations in motion of the mobile computing device or other components of the system100(e.g., a user who shakes the mobile computing device during video capture of a finger for cardiovascular analysis), fingertip pressure, and/or any other suitable issues related to data collection. However, the data processing module120can generate a processed dataset in any other suitable manner. 3.3 Data Analysis Module As shown inFIG.1, the data analysis module130functions to analyze one or more datasets in determining a cardiovascular parameter value of a user. The data analysis module130is preferably implemented at the remote server implementing the data processing module120, but can additionally or alternatively be implemented at any suitable computing system. The data analysis module130is preferably configured to analyze processed datasets (e.g., a processed PPG dataset) generated from the data processing module120. Additionally or alternatively, the data analysis module120can analyze processed datasets with supplemental datasets (e.g. user demographic data inputted by the user, supplemental biosignal datasets, motion data, physical activity data, etc.). But the data analysis module130can otherwise analyze any suitable dataset or combination of datasets. The data analysis module130preferably determines cardiovascular parameter values of one or more cardiovascular health-related parameters including: arterial stiffness, phase of constriction, pulse transit time, pulse wave velocity, heart rate, heart rate variation, blood pressure, blood pressure variation (e.g., diurnal blood pressure variation), and/or any other suitable cardiovascular parameter type. Cardiovascular parameter values can indicate hypertension, atherosclerosis, narrow of blood vessels, arterial damage, and/or any other suitable cardiovascular risk factor. The cardiovascular parameter values are preferably associated with a temporal indicator corresponding to the image data from which the cardiovascular parameter value is determined. For example, in relation to a portion of the method200described below, a camera module112can collect a time series of image data corresponding to a daytime period (e.g., after sunrise and before sunset), the signal generation module can convert the image data into a PPG dataset, the data processing module120can process the PPG dataset, and the data analysis module130can determine a cardiovascular parameter value from the processed PPG dataset, where the cardiovascular parameter value is associated with the daytime period in which the camera module112collected the time series of image data. However, the cardiovascular parameters can additionally or alternatively be associated with any other suitable temporal indicator (e.g., non-daytime period, non-nighttime period, etc.), on any other suitable time scale (e.g., seconds, minutes, hours, days, weeks, months, years, etc.). 3.4 Output Module As shown inFIG.1, the output module140functions to generate and/or present an analysis of the cardiovascular parameter value to an entity for informing the entity of cardiovascular risk associated with the user. The output module140can additionally or alternatively function to automatically facilitate therapy provision to the user based upon an analysis of the cardiovascular parameter value. The output module140is preferably implemented at the remote server used in implementing the data processing module120and the data analysis module130, but can be otherwise implemented. The output module140preferably includes a communication system configured to transmit the analysis of the cardiovascular parameter value to a user device, a guardian device, a care provider device, and/or any other suitable component. The analysis of the cardiovascular parameter value can be presented at an application executing on a mobile computing device, at a website, as a notification, and/or as any suitable form. The system100can, however, include any other suitable elements configured to receive and/or process data in order to promote assessment or management of cardiovascular health of one or more individuals. 4. Method. As shown inFIGS.2-3and8, an embodiment of a method200for assessing cardiovascular disease in a user using a camera module, the method including receiving a time series of image data S210of a body region of the user, the time series of image data captured during a time period; generating a photoplethysmogram (PPG) dataset from the time series of image data S220; generating a processed PPG dataset S230; determining a cardiovascular parameter value of the user based on the processed PPG dataset S240; fitting a chronobiological model S265to (1) the cardiovascular parameter value, and (2) a subsequent cardiovascular parameter value; characterizing a cardiovascular parameter variation over time of the user based on the fitted chronobiological model S260; and presenting an analysis of the cardiovascular parameter variation to the user at a mobile computing device S270associated with the user. In some variations, the method200can additionally or alternatively include implementing an image sampling protocol S280, and automatically facilitating therapy provision S290, thereby promoting cardiovascular health of the user. In relation to remote assessment of a patient, the method200is preferably implemented, at least in part, using a mobile computing device of the patient, such that the patient can be remote from a clinical setting (e.g., hospital, clinic, etc.) during extraction of clinically-relevant parameters associated with cardiovascular disease. As such, the method200is preferably implemented, at least in part, at an embodiment, variation, or example of the system100described in Section 3 above; however, the method200can additionally or alternatively be implemented using any other suitable system(s). 4.1 Receiving Image Data Block S210recites: receiving a time series of image data of a body region of the user, the time series of image data captured during a time period. Block S210functions to acquire data from which relevant cardiovascular health-associated parameters can be extracted and analyzed, according to subsequent blocks of the method200. Block S210is preferably implemented at a camera module of a mobile computing device (e.g., a smartphone) associated with the user, but can additionally or alternatively be implemented using any other suitable system component. A time series of image data is preferably received in Block S210, but any type, combination, or number of image data can be received, and processed in future steps, as described in relation to image data types above. Regarding Block S210, the time series of image data is preferably associated with a time period temporal indicator (e.g., a daytime period, a nighttime period, a sleeping phase, a waking phase, a morning, an afternoon, a night, a sunrise, a sunset, a dawn, a dusk, a twilight, etc.). In a specific example, Block S210can include: receiving a first time series of image data of the body region of the user, the first time series of image data captured during a daytime period, and the first time series of image data captured at the camera module of the mobile computing device; receiving a second time series of image data of the body region of the user, the second time series of image data captured during a nighttime period, and the second time series of image data captured at the camera module of the mobile computing device. In this specific example, such data can be used to analyze patterns and generate characterizations associated with diurnal variations in one or more cardiovascular health associated parameters; however, variations of Block S210can alternatively collect any other suitable image data according to any other suitable time scale, and at any other suitable frequency. With respect to Block S210, the received time series of image data is preferably captured at locations remote from a healthcare provider (e.g., at home, at work, at a social event, etc.), such as to offer a non-invasive, convenient user experience for monitoring, assessment, and treatment of cardiovascular risks. Additionally or alternatively, the received time series of image data can be captured in-clinic (e.g., during a visit to a physician at a hospital), and/or any other suitable location. Captured image data is preferably transmitted to a computing system (e.g., a remote server) with GPU processing capabilities. Pushing data processing to the GPU thus allows the mobile computing device to maximize potential use of camera module functions of the mobile computing device in relation to limitations in processing capacity at the mobile computing device. In variations, the image data is additionally or alternatively transmitted to personal computer modules, mobile computing device modules, cloud-computing modules, and/or any other suitable computing modules for subsequent processing and analysis. In a first variation of Block S210, receiving a time series of image data can include: providing a user with access to the camera module through an application executing on a mobile computing device associated with a user; automatically prompting, with the application, the mobile computing device to transmit the time series of image data captured by the camera module; and receiving, at a remote server, the time series of image data. In a specific example of this first variation, the application can prompt the user to access the camera module, facilitating user capture of a time series of image data of a specified body region of the user. In response to the user capturing the time series of image data, the application can prompt the internet-enabled mobile computing device to transmit the captured time series of image data to a remote server for further processing and analysis. Additionally or alternatively, in a second variation of Block S210, receiving a time series of image data can include: providing an interface to the user for manually uploading time series of image data; and receiving the time series of image data through the provided interface. In this variation, the interface can be provided through an application configured to operate on a mobile computing device of the user, through a web interface, or through any other suitable venue. The manually uploaded time series of image data can be captured on the same device performing the upload (e.g., time series of image data captured and uploaded on the same user tablet device), captured on a different device (e.g., image data captured on a digital camera, transferred to a desktop computer, and uploaded through a web interface accessed by the desktop computer), and/or captured on any other suitable component. Additionally or alternatively, in a third variation of Block S210, Block S210can be performed in coordination with transmitting light (e.g., from an illumination module of the mobile computing device including the camera module) toward a body region (e.g., a finger placed in the field of view of the camera module) of an individual. The operational states of the camera module and/or the illumination module can be governed at a native application executing at the mobile computing device of the individual to coordinate generation of the data from the individual. In one such specific example, a native application installed at the mobile computing device of the individual can guide the individual in providing PPG data in coordination with transitioning the camera and illumination modules of the mobile computing device into active states. Block S210can additionally or alternatively include manipulating one or more parameters/operational settings of the hardware components (e.g., the camera module, the illumination module, etc.) implementing Block Silo. For example, Block S210can include adjusting a focal length of the camera module, adjusting an acquisition rate of the camera module, adjusting a white balance parameter (e.g., tint, temperature) of the camera module of the mobile computing device, and/or manipulating any other suitable camera module function of the mobile computing device. In other examples, with respect to the illumination module, Block S110can comprise manipulating one or more of: an intensity of emitted light, one or more color parameters (e.g., wavelength, etc.) of emitted light, and any other suitable illumination parameter provided by one or more light sources (e.g., light emitting diodes, LEDs; displays, etc.) of the mobile computing device. However, performing Block S210in coordination with transmitting light can be conducted in any other suitable manner. Variations of Block S210can, however, be performed in any other suitable manner in order to acquire data for processing according to subsequent blocks of the method200. 4.2 Generating a PPG Dataset Block S220recites: generating a photoplethysmogram (PPG) dataset from the time series of image data, which functions to generate PPG signals from image data, for monitoring of perfusion of blood to the dermis and subcutaneous tissue of the skin of the individual, over a duration of time and in a non-clinical setting. Alternative variations of Block S220can, however, be implemented in association with any other suitable body region of a user, and/or in a clinical setting. The PPG dataset is preferably generated from light absorption data based on image data of a body region of the user, where the light absorption data can provide non-invasive determination of parameters associated with different states of cardiovascular disease. In particular, the PPG dataset is preferably generated from the time series of image data received in Block S210, but can additionally or alternatively be generated form any suitable image data. Generating a PPG dataset S220is preferably performed for every time series of image data received in Block S210. Additionally or alternatively, a PPG dataset can be generated only for selected time series of image data (e.g., time series of image data of sufficient image quality, time series of image data sufficiently capturing a specific body region of the user within the time series, time series of image data with sufficiently stable motion characteristics, and/or time series of image data with characteristics exceeding any suitable threshold), but a PPG dataset can be generated for datasets selected based on any suitable criteria. Block S220is preferably implemented at a signal generation or signal extraction module of a remote server with GPU processing capabilities, but can be otherwise implanted partially or fully at any suitable component. Generating a PPG dataset from the time series of image data is preferably performed in response to receiving the time series of image data (e.g., at a remote server implementing Block S220). Additionally or alternatively, Block S220can be performed in aggregate, such that Block S220is performed in response to receiving multiple time series of image data, thereby generating multiple PPG datasets. However, generating the PPG dataset can be performed at any suitable time. 4.3 Generating a Processed PPG Dataset Block S230recites: generating a processed PPG dataset, which functions to process the generated raw PPG dataset into a form suitable for specific determination of cardiovascular parameters of the user. Block S230can additionally or alternatively include: identifying regions of interest S232; filtering with a PPG acquisition model S234; and/or identifying placement error of a body region based on image intensity of the time series of image data S236, as shown inFIG.2. Regarding Block S230, generating a processed dataset is preferably performed for a PPG dataset generated in Block S220, thereby generating a processed PPG dataset, but processing as in Block S230can be performed for any dataset (e.g., a supplementary biosignal dataset), thereby generating supplemental processed datasets. Generating a processed PPG dataset is preferably performed for every PPG dataset generated in Block S230, but can be selectively performed base don any suitable criteria. Generating a processed PPG dataset is preferably performed at a data processing module of a remote server implementing Blocks S210and S220, but can otherwise be performed partially or fully at any suitable component or combination of components. With respect to Block S230, generating a processed PPG dataset is preferably performed in response to generating a first PPG dataset in Block S220, but processing can be performed in aggregate on a set of PPG datasets (e.g., multiple PPG datasets generated in Block S220from multiple received time series of image data corresponding to different time periods). However, generating a processed PPG dataset can be performed at any suitable time on any suitable number or combination of datasets. For Block S230, generating a processed PPG dataset can include processing a PPG dataset through operations including one or more of: normalization, filtering, noise reduction, smoothing, model fitting, transformations, mathematical operations (e.g., calculating a first derivative of collected signals, positive component squared operations, operations associated with moving averages, etc.), image processing, and/or any other suitable processing technique. Generating processed PPG datasets preferably includes processing each generated PPG dataset using the same or similar processing techniques, such that processed PPG datasets can be compared and/or analyzed in a consistent manner. However, different datasets can be processed through different techniques, different variations of the same techniques, and/or through any suitable manner. 4.3.A Identifying Regions of Interest In a first variation of Block S230, as shown inFIGS.4-5, generating the processed dataset can additionally or alternatively include identifying regions of interest S232, which functions to filter the PPG dataset for regions of interest to perform subsequent processing and/or analysis steps upon. Identifying regions of interest preferably includes the processing steps of: bandpass filtering, performing a first derivative dataset, calculating a positive component squared, and comparing a moving average dataset across the positive component squared dataset, but can additionally or alternatively include any suitable processing step performed on any suitable dataset. Identifying regions of interest is preferably based on the comparison of the moving average dataset across the positive component squared dataset, thereby identifying heartbeat regions of interest. In a specific example, the short and long moving averages from the PPG dataset are compared across the positive component squared of the first derivative dataset of the bandpass filtered PPG dataset generated in Block S220. Identified heartbeat regions of interest are preferably filtered through criteria including: length of region, amplitude of positive component, time since previous beat, and/or any other suitable criteria. In a specific example of Block S232, identifying heartbeat regions of interest can include: generating a moving average dataset in near real-time based on the PPG dataset, wherein the processed PPG dataset is further based on the moving average dataset. In this specific example, the Block S232can further include: filtering the PPG dataset with a bandpass filter; deriving a first derivative dataset from the bandpass filtered PPG dataset; generating a positive component squared dataset from the first derivative dataset; and generating a comparison of the moving average dataset across the positive component squared dataset, wherein generating the processed dataset S230is based on the comparison. Additionally, Block S232can include: identifying heartbeat regions of interests based on the comparison of the moving average dataset across the positive component squared dataset; and filtering the heartbeat regions of interest based on at least one of: length of region, amplitude of positive component, and time since previous beat, wherein generating the processed PPG dataset S230is based on the filtered heartbeat regions of interest. However, identifying regions of interest can be performed in any other suitable manner. 4.3.B Filtering with a PPG Acquisition Model In a second variation of Block S230, as shown inFIG.2, generating the processed dataset can additionally or alternatively include filtering with a PPG acquisition model S234. Filtering with a PPG acquisition model can be performed on a dataset generated in Block S220, S230, S232, S236, and/or any other suitable dataset. Filtering with a PPG acquisition model S234preferably includes: generating a PPG acquisition model from historical PPG dataset; and filtering the PPG dataset with the PPG acquisition model generated from the historical PPG data, wherein generating the processed PPG dataset is based on the filtered PPG dataset, and wherein the processed PPG dataset is a subset of the PPG dataset. Filtering with the PPG acquisition model can be based on user information (e.g., demographic information, user-inputted data, etc.), collected data (e.g. collected supplemental sensor data, image data, etc.), care provider information, predetermined criteria (e.g., manually selected PPG data characteristics, manual labeling of training data for a machine learning model, etc.), automatically determined criteria (e.g., using a machine learning model, etc.), and/or any other suitable criteria. The PPG acquisition model can include probabilistic properties, heuristic properties, deterministic properties, and/or any other suitable properties for filtering PPG datasets. PPG signals, signal regions, and/or any suitable portion of PPG datasets are preferably classified with a “valid” classification or a “compromised” classification, but can otherwise be classified. In a specific example of Block S234, Block S234can include: classifying historical PPG signals as compromised historical PPG signals or valid historical PPG signals; generating the PPG acquisition model based on the classified historical PPG signals; and filtering a PPG dataset using the PPG acquisition model, based on feature similarity of the PPG signals with the compromised historical PPG signals and the valid historical PPG signals, wherein generating the processed PPG dataset is based on the filtered PPG dataset. However, filtering with a PPG acquisition model S234can be performed in any other suitable manner. 4.3.C Identifying Placement Error Based on Image Intensity In a second variation of Block S230, as shown inFIG.2, generating the processed dataset can additionally or alternatively include identifying placement error of a body region of a user, based on image intensity S236, which functions to identify and correct for user error in capturing a body region of the user with a camera module. Identifying placement error is preferably performed for identifying a finger placement error of the user, but a placement error can be identified for any suitable body region of the user. Identifying body region placement error is preferably based on image intensity characteristics (e.g., a two-dimensional distribution of intensity variation) of a time series of image data received as in Block S210, but can be based on any suitable image data property. Body region placement errors can be corrected through normalization based on the identified placement errors. Placement error identification and/or normalization can be performed across a single time series of image data, multiple time series of image data, and/or any suitable granularity of image data. In a specific example of Block S230, the body region is a finger of the user, the body region of the user is a finger of the user, where generating the processed PPG dataset comprises: identifying a placement error of the finger based on two-dimensional distribution of intensity variation of the time series of image data (e.g. a time series of image data received as in Block S210); correcting the PPG dataset based on the placement error of the finger; and generating the processed PPG dataset based on the corrected PPG dataset. In other examples, Block S230can additionally or alternatively include correcting for variations in motion and/or fingertip pressure based on observations of the imaging frame data in time. However, Block S236can be performed in any other suitable manner. 4.4 Determining a Cardiovascular Parameter Value Block S240recites: determining a cardiovascular parameter value of the user based on the processed PPG dataset, which functions to determine a cardiovascular parameter value indicative of a cardiovascular risk associated with the user. Block S240can additionally or alternatively include fitting a cosinor model to a dataset S250, and characterizing a cardiovascular parameter variation over time S260. With respect to Block S240, types of cardiovascular parameter values that can be determined in Block S240include one or more of: arterial stiffness, phase of constriction, pulse transit time, pulse wave velocity, heart rate, heart rate variation, blood pressure, blood pressure variation (e.g., diurnal blood pressure variation), and/or any other suitable cardiovascular parameter types. Cardiovascular parameter values can indicate hypertension, atherosclerosis, narrow of blood vessels, arterial damage, and/or any other cardiovascular risk factor. Regarding Block S240, determining a cardiovascular parameter value is preferably in response to generating a processed dataset S230, but can have any suitable temporal relationship with any other portion of the method200. In relation to Block S240, A cardiovascular parameter value is preferably determined from analyzing a processed PPG dataset, but can additionally or alternatively be determined based on a raw PPG dataset, a supplementary dataset, and/or any other suitable dataset (e.g., a dataset from Blocks S210, S220, S230, S232, S234, and/or S236). Additionally or alternatively, cardiovascular parameters can be determined without using specific types of data. For example, determining a cardiovascular parameter value can be based on datasets of only the PPG data type. In another example, cardiovascular parameter values can be determined without using electrocardiogram (ECG) data. In a specific example, determining the blood pressure parameter value of the user includes determining the blood pressure parameter value without using ECG signals, and wherein characterizing a diurnal blood pressure variation of the user comprises characterizing a diurnal blood pressure variation without using ECG signals. Determining a cardiovascular parameter value can include determining the cardiovascular parameter using models and/or approaches possessing probabilities properties, heuristic properties, deterministic properties, and/or any other suitable feature for calculating cardiovascular parameter values from a processed PPG dataset and/or any suitable dataset. However, cardiovascular parameter values can be determined in any suitable manner. Regarding Block S240, as shown inFIG.6, determining a cardiovascular parameter value can additionally or alternatively include fitting a cosinor model to a dataset S250. A cosinor model is preferably fitted to a processed PPG dataset as in Block S230, but can be fitted to any suitable dataset or combination of datasets. For example, Block S240can include fitting harmonic cosinor model to the processed PPG dataset, wherein determining the cardiovascular parameter value comprises determining the cardiovascular parameter based on the fitted harmonic cosinor model. In specific examples (e.g., examples in which the pulse waveform of the target dataset has a harmonic structure), the phase and amplitude of harmonic components of the waveform can be estimated per beat using: Y(t)=A0+∑nAncos(2πntT+ϕn)+ε where T is the length of the beat. Regarding Block S250, fitting a cosinor model to the dataset is preferably based on a time window (e.g., a continuous 24 hour time window including a daytime period and a nighttime period) associated the dataset, but can additionally or alternatively be based on any suitable temporal indicator. For example, fitting the cosinor model to the dataset can include selecting a particular cosinor model and/or parameters of a cosinor model based on the time window associated with the dataset upon which the cosinor model will be fitted. However, fitting a cosinor model to a dataset can be performed in any other suitable manner. Block S240can additionally or alternatively include characterizing a cardiovascular parameter variation over time S260. Determining cardiovascular parameter variation S260is preferably performed for blood pressure (e.g., characterizing a diurnal blood pressure variability), but can be performed for any suitable cardiovascular parameter. Diurnal cardiovascular parameter variation (e.g., variation throughout a day) can be characterized in Block S260. Additionally or alternatively, any other suitable cardiovascular parameter variation can be characterized over any suitable temporal indicator in variations of Block S260. In a specific example, a fitted chronobiological model a set of cardiovascular parameters sharing a cardiovascular parameter type, the set of cardiovascular parameters corresponding to a time window comprising a time period (e.g., a daytime period), a second time period (e.g., a nighttime period), and a continuous 24 hour time period, wherein characterizing the cardiovascular parameter variation over time comprises characterizing the cardiovascular parameter variation over the time window. However, characterizing the cardiovascular parameter variation over time can be otherwise performed. Regarding Block S260, as shown inFIGS.7A-7B, characterizing cardiovascular parameter variation over time can include fitting a chronobiological model to a set of cardiovascular parameter values S265. The set of cardiovascular parameter values preferably includes one or more cardiovascular parameter values determined as in Block S240, but can additionally or alternatively include any suitable cardiovascular parameter value. In a specific example, Block S260can include fitting a chronobiological model to (1) the cardiovascular parameter value associated with the first time period, and (2) a subsequent cardiovascular parameter value associated with a second time period, wherein the cardiovascular parameter value and the subsequent cardiovascular parameter value share a cardiovascular parameter type, wherein characterizing a first cardiovascular parameter variation over time is based on the fitted first chronobiological model. However, fitting a chronobiological model to a set of cardiovascular parameter values S265can be performed in any suitable manner. With respect to Block S260, fitting the chronobiological model preferably enables extrapolation of cardiovascular parameter values corresponding to time points (or other temporal indicators) at which cardiovascular parameter values were not generated. For example, for a continuous 24 hour period, a user may capture five time series of image data, corresponding to 8 AM, 12 PM, 4 PM, 8 PM, and 12 AM. Cardiovascular parameter values can be determined for each of the five time series of image data, and Block S260can include: in response to fitting a chronobiological model to the cardiovascular parameter values, extrapolating cardiovascular parameter values corresponding to time points without overlap with the time points (or other temporal indicators) corresponding to the captured time series of image data (e.g., not corresponding to 8 AM, 12 PM, 4 PM, 8 PM or 12 AM). However, extrapolating cardiovascular parameter values based on a fitted chronobiological model can be performed in any suitable manner. 4.4.A Determining a Cardiovascular Parameter Value—Specific Variations In a first variation of Block S240, as shown inFIG.4, determining a cardiovascular parameter value can include determining a heart rate value of the user. The heart rate value is preferably determined from a PPG dataset processed as in Block S232. For example, the heart rate value is preferably determined from a PPG dataset processed by: filtering the PPG dataset with a bandpass filter; deriving a first derivative dataset from the bandpass filtered PPG dataset; generating a positive component squared dataset from the first derivative dataset; generating a comparison of the moving average dataset across the positive component squared dataset to identify regions of interest (e.g., heartbeat regions of interest); and filtering the heartbeat regions of interest based on criteria including at least one of length of region, amplitude of positive component, and time since previous beat. Additionally or alternatively, determining the heart rate value can be based on any suitable dataset processed in any suitable manner. The heart rate value is preferably derived from the peak-to-peak interval of the processed PPG dataset, where minima, maxima, and/or any suitable feature or interval can be identified. However, heart rate values can be determined with any other suitable approach. Additionally or alternatively, in a second variation of Block S240, as shown inFIG.4, determining a cardiovascular parameter value can include determining a heart rate variability based on the heart rate value of the user. Determining the heart rate variability is preferably based on a set of heart rate values determined as in the first specific variation of Block S240. However, heart rate variability can be determined in any suitable manner. Additionally or alternatively, in a third variation of Block S240, as shown inFIG.4, determining a cardiovascular parameter value can include determining a blood pressure parameter value for the user. A determined blood pressure parameter value is preferably associated with one of a daytime period and a nighttime period (e.g., to facilitate analysis of diurnal blood pressure variability), but can be associated with any suitable temporal indicator. In the third variation of Block S240, determining the blood pressure parameter value preferably includes fitting a cosinor model (e.g., a harmonic cosinor model) to a PPG dataset processed as in Block S230; and determining the blood pressure value of the user based on the fitted cosinor model. In examples, the phase and amplitude of harmonic components can be estimated from the fitted cosinor model, and in an example, such parameters can be used in determining the blood pressure parameter value through blood pressure transport theory: DBP=c0,0A0+c4,0A4 PP=c1,1A1 SBP=DBP+PP where DBP is diastolic blood pressure, SBP is systolic blood pressure, PP is pulse pressure, Anare harmonic components, and cn,nare constants. In a specific example, determining the blood pressure parameter value can include: determining an amplitude of a harmonic component of the fitted cosinor model; and determining the blood pressure parameter value based on the amplitude of the harmonic component. In such examples, model coefficients can be estimated through calibration datasets (e.g., calibration PPG and calibration blood pressure datasets measured, for example, in-clinic during user on-boarding with an embodiment of the method200). As an illustration, the determining the blood pressure parameter value can include receiving a calibration PPG dataset corresponding to a time period; receiving a calibration blood pressure dataset corresponding to the time period; and determining the blood pressure parameter value based on the calibration PPG dataset, the calibration blood pressure dataset, and an amplitude of the harmonic component of a fitted cosinor model. However, determining the blood pressure parameter value can be otherwise determined. Additionally or alternatively, in a fourth variation of Block S240, as shown inFIGS.4and7A-7B, determining a cardiovascular parameter value can include characterizing a blood pressure variability over time. A diurnal blood pressure variability (e.g., blood pressure variability throughout the day) is preferably determined, but blood pressure variability can be determined across and/or associated with any suitable temporal indicator. Blood pressure variability over time is preferably characterized based upon a set of blood pressure parameter values determined as in the third specific variation of Block S240. Additionally or alternatively, blood pressure variability can be determined based on blood pressures determined from a supplemental sensor, from third-party sources (e.g., public databases, private health records, third-party medical devices, user-inputted blood pressures, etc.), and/or any other suitable source. In the fourth variation of Block S240, determining the cardiovascular parameter value can include fitting a chronobiological blood pressure model to a set of blood pressure parameter values. The set of blood pressure parameter values preferably includes one or more blood pressure parameter values determined as in the third specific variation of Block S240. For example, characterizing a diurnal blood pressure variation of the user can be based on the fitted chronobiological blood pressure model. In a specific example, characterizing diurnal blood pressure variation includes fitting a chronobiological blood pressure model to (1) a blood pressure parameter value associated with the daytime period and (2) a blood pressure parameter value associated with the nighttime period. In specific examples, the rhythmic change in blood pressure during the course of a day can be described with a sum of cosines: yn=M+∑c=1CAccos(ωctn+ϕc)+en;n=1,…,N, where ynis the observed blood pressure value at time tn; C is the number of sinusoidal components (e.g., C=2); and ωcare the diurnal angular frequencies for each sinusoidal component; ϕcis the angular phase (offset) of each angular frequency; and N is the number of observation samples. Angular frequencies can be any suitable time period (e.g., 1 hour period, 24 hour period, etc.). In such specific examples, parameters can be estimated with least squares minimization of the residual sum of squares (RSS) of the observed blood pressure measures against modeled blood pressure: RSS(M,A1,t,ϕ1, . . . ,tc,ϕc)=Σn=1Nen2=Σn=1N(ynobs−ynest)2, where solving the system can provide a vector of parameters: θ=({circumflex over (M)},,,, . . . ,,) In the fourth variation, characterizing the diurnal blood pressure variation can include characterizing the diurnal blood pressure variation based upon analysis of the fitted chronobiological blood pressure model. For example, determining a blood pressure variability can include: identifying a nighttime region of the fitted chronobiological blood pressure model; the nighttime region associated with a nighttime period; determining a degree of blood pressure dip at the nighttime region; and characterizing the diurnal blood pressure variation based on the degree of blood pressure dip at the nighttime region. In a specific application, a lack of blood pressure dip at the nighttime region of a fitted chronobiological blood pressure model can indicate an inability to appropriately downregulate blood pressure during nighttime, which can indicate cardiovascular risk and provide guidance for appropriate treatments. However, fitting the chronobiological blood pressure model can be performed in any suitable fashion. 4.5 Presenting an Analysis Block S270recites: presenting an analysis of the cardiovascular parameter variation to the user at the mobile computing device, which functions to generate and/or present an analysis of one or more cardiovascular parameter values to an entity for informing the entity of cardiovascular risk associated with the user. A remote server (e.g., a remote server implementing other Blocks of the method200) preferably transmits a generated analysis (e.g., also generated at the remote server) to a mobile computing system associated with a user, care provider, guardian, and/or any other suitable entity. In a specific example, presenting an analysis includes presenting an analysis of a cardiovascular parameter variation to a user at a mobile computing device associated with the user. In another specific example, the analysis of a cardiovascular parameter can be transmitted to a mobile computing device comprising a camera module used in capturing a received time series of image data from which the cardiovascular parameter was determined. However, any suitable component can transmit, receive, and/or present any suitable analysis of a cardiovascular parameter. Regarding Block S270, presenting an analysis preferably includes presenting an analysis of a cardiovascular parameter variation over time as determined in Block S260, but an analysis of any suitable cardiovascular parameter can be presented. The presented analysis can be generated based on one or more fitted models, cardiovascular parameters, and/or any other suitable data. For example, generating an analysis of cardiovascular parameter variation can include presenting and/or comparing variations in multiple different cardiovascular parameters over time. Additionally or alternatively, in specific examples, presenting an analysis can include comparing cardiovascular parameter variations over time of multiple users. In a specific examiner where a first chronobiological model has been fitted to cardiovascular parameters associated with first user and associated with a first and a second time period within a first time window, presenting the analysis S270can include: fitting a second chronobiological model to (1) cardiovascular parameter associated with a second user and associated with a third time period, and (2) a subsequent cardiovascular parameter associated with the second user and associated with a fourth time period, the third and the fourth time periods within a second time window; characterizing a second cardiovascular parameter variation over time of the second user based on the fitted second chronobiological model; and generating a comparison between the first cardiovascular parameter variation over time (e.g., based on the first chronobiological model fitted to cardiovascular parameters associated with the first and the second time period) and the second cardiovascular parameter variation over time, wherein the analysis of the cardiovascular parameter is based on the comparison. Additionally or alternatively, in specific examples, presenting an analysis can include generating an analysis based on multiple cardiovascular parameters (e.g., cardiovascular parameters of the same type but associated with different temporal indicators, cardiovascular parameters of different types, etc.) determined for a user. In a specific example, presenting an analysis270can include: characterizing a diurnal heart rate variation of the user; characterizing a diurnal blood pressure variation of the user based on a fitted chronobiological mode; generating an analysis based on the diurnal heart rate variation and the diurnal blood pressure variation; presenting the analysis to the user; and automatically facilitating therapy provision to the user based upon the analysis. With respect to Block S270, the analysis can be any number or combination of forms, including numerical (e.g., cardiovascular parameter values, cardiovascular risk values, probabilities, raw values, processed values, etc.), verbal (e.g., verbal indications of cardiovascular risk and/or disease, recommendations, etc.), graphical (e.g., colors indicating risk state, educational graphics, etc.), and/or any suitable form. In relation to Block S270, presenting the analysis can include presenting the analysis based on rules (e.g., notification preferences set by a user, rules established by a care provider, by a guardian, etc.), time (e.g., notification at set frequencies, times of day, etc.), steps (e.g., presenting an analysis in response to generating the analysis, which can be in response to characterizing cardiovascular parameter variation), and/or any other suitable criteria. In a first variation of Block S270, presenting an analysis can include automatically notifying an entity through an application executing on a corresponding mobile computing device. Automatic notifications can be transmitted from a remote server to a mobile computing device associated with a user, a guardian, a care provider, and/or any other suitable entity. Automatic notifications can take the form of a native application notification, a text message, a web interface, an application interface, and/or any other suitable form. Automatically notifying an entity is preferably in response to generating an analysis of a cardiovascular parameter, but can be performed at any suitable time in relation to any suitable portion of the method200. However, automatically notifying an entity can be performed in any suitable manner In a second variation of Block S270, presenting an analysis can include automatically presenting an alert in response to a characteristic of the analysis of the cardiovascular parameter exceeding a threshold. Thresholds can be established (e.g., by a care provider, by a guardian, by a user, by a third party, etc.) for characteristics of any suitable model, dataset, cardiovascular parameter, cardiovascular parameter variation, and/or any suitable component of the method200. For example, presenting an analysis of diurnal blood pressure variation can include presenting a warning to the user at the mobile computing device in response to the degree of blood pressure dip less than a threshold degree at a nighttime region of a fitted chronobiological blood pressure model. In another example, presenting an analysis of heart rate variability can include presenting a warning to a care provider at a care provider mobile computing device in response to the heart rate variability exceeding a heart rate variability threshold. However, presenting an alert based on thresholds can be performed in any suitable manner. 4.6 Implementing an Image Sampling Protocol Block S280recites: implementing an image sampling protocol, which functions to determine a timing and frequency for prompting the user to perform an image sampling process to collect image data in characterizing cardiovascular parameters. Implementing an image sampling protocol can additionally or alternatively include: receiving user information associated with a user; generating an image sampling protocol for the user; and providing a notification to the user prompting to the user to capture image data with a camera module, based on the image sampling protocol. Implementing sampling protocols can facilitate improved specificity, user adherence, user experience, and/or other various aspects of the method200. Implementing an image sampling protocol is preferably performed at a remote server (e.g., the remote server receives user information; generates an image sampling protocol based on user information; and transmits an alert to a user prompting image data capture, based on the generated image sampling protocol), but can be implemented partially or fully at any suitable component. Regarding Block S280, implementing an image sampling protocol preferably includes receiving user information associated with a user. User information can be received from a user, a care provider, a guardian, a third party (e.g., a public database), and/or any other suitable entity. Receiving user information can include receiving user information through an application executing on a mobile computing device, a web interface, non-digitally, and/or through any other suitable means. Types of user information can include: user account information, user profile information, user health records, user demographic information, associated care provider information, associated guardian information, user device information (e.g., GPS location, battery state of charge, calendar information, sensor information, etc.), user schedule information (e.g., is the user currently busy, etc.), time of day, sleep patterns (e.g., sleep phase), waking patterns, degree of physical activity, current biosignal status (e.g., current heart rate, current brain activity, etc.), supplemental sensor information, guardian-provided information for the user, care provider-provided information for the user, and/or any other suitable type of user information. However, receiving user information can otherwise be performed. In relation to Block S280, implementing an image sampling protocol preferably includes generating and/or optimizing an image sampling protocol for the user. An image sampling protocol can be configured to specify parameters for frequency (e.g., how often to prompt a user), timing (e.g., at what time during the day to prompt the user), notification format (e.g., text message, push notification, application notification, desktop reminder, etc.), transmission mode (e.g., wireless transmission, through a web interface, through an application, etc.), destination (e.g., notifying at a user mobile computing device, at a guardian mobile computing device, etc.), and/or any suitable characteristic with respect to sampling. Generating an image sampling protocol is preferably based on received user information, and can additionally or alternatively be based on models, datasets, cardiovascular parameters, population data, public databases, simulated data (e.g., underlying model noise) and/or any other suitable information related to portions of the method200. In one example, Block S280can include receiving sleep phase information (e.g., through an application executing on the mobile computing device, through an external medical device, etc.) of the user, wherein optimizing the image sampling protocol comprises optimizing the image sampling protocol based on the sleep phase information. In another example, the predetermined timing for prompting a user to capture a second time series of image data can be updated based on the actual timing of when a user captured a first time series of image data. However, any suitable information can be used in generating and/or optimizing an image sampling protocol for the user. In a specific example, Block S280can include updating a sampling protocol in response to a user recording a time series of image data leading to a faulty PPG dataset, and/or in response to a user recording a time series of image data outside a threshold time window determined by the optimal sampling protocol. Additionally or alternatively, sampling protocols can be generated and/or optimized in relation to parameters imposed by one or more target cardiovascular parameters to be determined. For example, specific types of simulated data and/or user information can be used and/or weighted differently in response to a target goal of determining diurnal blood pressure variation rather than determining heart rate variability. Further, One or more image sampling protocols for one or more users can be generated and/or optimized using models (e.g., machine learning models, Bayesian networks, deep learning models, etc.), and/or approaches possessing probabilistic properties, heuristic properties, deterministic properties, and/or any other suitable properties. However, generating and/or optimizing an image sampling protocol can be performed in any suitable manner. With respect to Block S280, implementing an image sampling protocol preferably includes a providing a notification to the user that prompts the user to capture image data, based on the image sampling protocol. Providing a notification can additionally or alternatively include providing guidance (e.g., orienting the mobile computing device, directions on how to operate the mobile computing device, etc.) to the user to control the mobile computing device to illuminate a body region and/or capture image data. The notification is preferably provided at the device (e.g., a smartphone) including the camera module, but can be provided at any suitable device associated with the user. Additionally or alternatively, providing a notification can be performed in any manner analogous to presenting an analysis S270. In a specific example, presenting a notification to the user includes: before receiving a time series of image data, presenting, based on the optimized image sampling protocol, a notification to the user at the mobile computing device at a notification time period, the notification prompting the first user to capture the time series of image data at the camera module of the mobile computing device. Block S280can additionally or alternatively include adjusting for low user adherence. For example, Block S280can include updating a sampling protocol and/or correcting a dataset for time discrepancies between a provided notification and the actual time a user captures a time series of image data. However, providing a notification to the user can be performed in any suitable manner. 4.7 Automatically Facilitating Therapy Provision Block S290recites: automatically facilitating therapy provision to the user, which functions to apply a therapy to the user based on a portion of the method200, as shown inFIG.8. Automatically facilitating therapy provision to the user is preferably based upon an analysis of a cardiovascular parameter as in Block S270, but can be based on any suitable model, dataset, cardiovascular parameter, supplemental data (e.g., public data), and/or any suitable information. In a specific example, the method200can include: generating a moving average dataset in near real-time based on the PPG dataset, wherein the processed PPG dataset is further based on the moving average dataset, and automatically facilitating therapy provision to the user based upon the analysis in near real-time. Automatically facilitating therapy provision to the user S290can include one or more of: automatically modulating medication provision, automatically adjusting an environmental aspect of the user, providing a medical recommendation, facilitating telemedicine digital communications between a user and another entity, and/or any suitable therapy approach. Block S290Is preferably partially or fully implanted at a remote server (e.g., a remote server implementing other Blocks of the method, but can be implemented at any suitable component). In variations, automatically facilitating therapy provision can include transmitting instructions to a mobile computing device, the instructions prompting the mobile computing device to instruct a secondary mobile computing device to apply the therapy. In a specific example, Block S290can include generating, at a remote server, instructions for automatically adjusting an environmental aspect of the user; transmitting the instructions to a mobile computing device (e.g., a smartphone connected to a home network of the user) the instructions prompting the mobile computing device to wirelessly communicate with a secondary device to adjust the environmental aspect (e.g., a television connected to the home network of the user). However, automatically facilitating therapy provision can be performed in any suitable manner. In a first variation of Block S290, automatically facilitating therapy provision can include automatically modulating medication provision. Characteristics of medication provision that can be modulated include: dosage level, dosage frequency, type of medication, medication regimen, medication information, prescription renewal, prescription retrieval, and/or any other suitable medication provision characteristic. Modulation of medication provision can include providing notifications regarding the modulation (e.g., providing a notification to take a blood pressure medication based on a characterized diurnal blood pressure variation as in Block S260and/or Block S270), automatically communicating with another entity (e.g., renewing a prescription with a pharmacy, contacting a care provider regarding the medication, etc.), and/or any suitable action. Automatically facilitating therapy provision can be implemented using automatic medication dispensing apparatus (e.g., a wirelessly-connected medication dispenser), such that this variation of Block S290includes providing commands from the computing system to the medication dispenser based upon analyses outputted from previous blocks of the method200. However, automatically modulating medication provision can be performed in any suitable manner. Additionally or alternatively, in a second variation of Block S290, automatically facilitating therapy provision can include automatically adjusting an environmental aspect of the user. Adjusting an environmental aspect can include: selecting an environmental aspect to adjust from at least one of lighting audio, and temperature; determining a degree of adjustment (e.g., how much lighting, audio, or temperature to adjust), a timing of adjustment (e.g., automatically adjusting in response to generating an analysis of a cardiovascular parameter, scheduling an adjustment for a particular time or frequency, etc.), and/or any suitable characteristic. A lighting environmental aspect can be the lighting of a mobile computing device of the user (e.g., the mobile computing device used in capturing the time series of image data from which a cardiovascular parameter is determined), a connected lightbulb (e.g., a smart lightbulb connected on the same network as a smartphone of a user), and/or any other suitable lighting component. An audio environmental aspect can be an audio of a mobile computing device (e.g., automatically controlling a mobile computing device to play a selected audio tone or musical sample, modifying the volume setting of a mobile computing device, etc.), a connected audio output device (e.g., a speaker, a television, a secondary mobile computing device, etc.), and/or any suitable device. A temperature environmental aspect can be controlled through a temperature control device (e.g., a connected thermometer, a connected air conditioning and/or heating system, etc.). However, environmental aspects can possess any suitable characteristic, and adjusting an environmental aspect can be performed in any suitable manner. Additionally or alternatively, in a third variation of Block S290, automatically facilitating therapy provision can include providing a medical recommendation. A medical recommendation can be provided to one or more of: a user (e.g., for the user to implement themselves), a care provider, a guardian, and/or any suitable entity. A medical recommendation can include a recommendation to perform a specific action (e.g., to take a walk, to rest, to think positive thoughts, etc.), to stop performing a specific action, to take a medication, to communicate with other entity, and/or any suitable activity. The medical recommendation is preferably provided at the mobile computing device associated with the entity to be notified, but can be provided at any suitable device. Additionally or alternatively, in a fourth variation of Block S290, automatically facilitating therapy provision can include facilitating a digital communication between a user and another entity. A digital communication is preferably enabled between a user and a care provider, but can be enabled between a user and a guardian and/or any relevant entity. A digital communication is preferably enabled through an application (e.g., a phone calling application, a text messaging application, an application implementing portions of the method200, etc.), executing on a mobile computing device associated with a user, but such digital communication can be facilitated through any suitable venue. Facilitating a digital communication between a user and another entity can include: providing an analysis of a cardiovascular parameter to one or more of the user and the other entity, guiding the user and/or the other entity through review of the analysis and/or generation of a treatment based on the analysis, and/or any suitable action. However, automatically facilitating therapy provision can be performed in any other suitable manner. Embodiments of the method200can, however, include any other suitable blocks or steps configured to control, modulate, or process information derived from one or more of: hardware aspects of the data acquisition system(s) implementing the method; user experience/user interface (UX/UI) aspects of the system(s) implementing the method; population specific data; sampling site variability; and other suitable sources in order to generate high quality data for characterization, assessment, and management of cardiovascular disease. Variations of the method200and system100include any combination or permutation of the described components and processes. Furthermore, various processes of the preferred method can be embodied and/or implemented at least in part as a machine configured to receive a computer-readable medium storing computer-readable instructions. The instructions are preferably executed by computer-executable components preferably integrated with a system and/or one or more portions of a control module and a processor. The computer-readable medium can be stored on any suitable computer readable media such as RAMs, ROMs, flash memory, EEPROMs, optical devices (CD or DVD), hard drives, floppy drives, or any suitable device. The computer-executable component is preferably a general or application specific processor, but any suitable dedicated hardware device or hardware/firmware combination device can additionally or alternatively execute the instructions. The FIGURES illustrate the architecture, functionality and operation of possible implementations of systems, methods and computer program products according to preferred embodiments, example configurations, and variations thereof. In this regard, each block in the flowchart or block diagrams may represent a module, segment, step, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block can occur out of the order noted in the FIGURES. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions. As a person skilled in the art will recognize from the previous detailed description and from the figures and claims, modifications and changes can be made to the preferred embodiments of the invention without departing from the scope of this invention defined in the following claims. | 83,000 |
11862341 | DESCRIPTION OF THE INVENTION Hereinafter, with reference to the accompanying drawings, the embodiments of the present disclosure will be described in detail so that those of ordinary skill in the art to which the present disclosure pertains can readily implement them. However, the present disclosure may be implemented in several different forms and is not limited to the embodiments described herein. In order to clearly explain the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification. Throughout the specification, when a part “includes” or “comprises” a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated. It is to be understood that the techniques described in the present disclosure are not intended to be limited to specific embodiments, and include various modifications, equivalents, and/or alternatives of the embodiments of the present disclosure. The expression “configured to (or set to)” as used in this disclosure, depending on the context, can be used interchangeably with, for example, “suitable for”, “having the capacity to,” “designed to”, “adapted to”, “made to”, or “capable of”. The term “configured (or configured to)” is not necessarily means only “specifically designed to” hardware. Instead, in some circumstances, the expression “a device configured to” means that the device is “capable of” with other devices or components. For example, the phrases “a processor configured (or configured to perform) A, B, and C,” “a module configured (or configured to perform) A, B, and C”, means a dedicated processor (for example, it may mean an embedded processor) or a generic-purpose processor (e.g., a CPU or an application processor) capable of performing corresponding operations by executing one or more software programs stored in a memory device. Hereinafter, an embodiment of the present disclosure will be described with reference to the attached drawings. FIG.1is a diagram illustrating a configuration of a mental state classification server100according to an embodiment of the present disclosure; andFIG.2is a schematic diagram illustrating a state of a receiving terminal10provided with a questionnaire of a mental state classification service through a mental state classification server100according to an embodiment of the present disclosure. Referring toFIG.1andFIG.2, the mental state classification server100according to an embodiment of the present disclosure includes a service platform110and a mental state classification platform120. The service platform110and the mental state classification platform120include a computing system, hardware on which a program is executed, software running on the hardware, and a cloud service, and may be connected to each other or other servers through a network. In addition, the service platform110and the mental state classification platform120include a system configured to provide a service at the request of a user or administrator; and provide a distributed processing form that operates one or more application programs in a mutually cooperative environment. The service platform110and the mental state classification platform120may include hardware such as a processor, a storage or database, and a communication module. Specifically, the service platform110may provide a questionnaire for classification of at least one mental state to a user's terminal10. Here, the at least one mental state may include major depression disorder, anxiety disorder, adjustment disorder, PTSD, suicidal ideation, and insomnia. Accordingly, the questionnaire provided by the service platform110includes a questionnaire related to at least one of major depressive disorder, anxiety disorder, adjustment disorder, PTSD, suicidal ideation, and insomnia. For example, clinical scales of mental states that can be used in the questionnaire are shown in Table 1 below. TABLE 1Name of mentalCategorystateClinical questionnaire tool1major depressivePHQ-9 (Patient HealthdisorderQuestionnaire 9)2anxiety disorderGAD-7 (GeneralizedAnxiety Disorder 7)3adaptationADNM-4 (AdjustmentdisorderDisorder-New Module-4)4post-traumaticK-PC-PTSD-5 (Koreanstress disorderversion of the Primary CarePTSD Screen for DSM-5)5suicide accidentP4 (P4 Suicidality Screener)6insomniaISI (Insomnia Severity Index) For example, the service platform110may provide a questionnaire for classification of at least one mental state through an installed application program (e.g., an app) of the terminal10. For example, as shown inFIG.2, when the service platform110provides the questionnaire to the user's terminal10, a virtual person c transmits the questionnaire in a form of a chatting message2to the user. In one embodiment, the questionnaire may be provided at the same time as notifying the user of what kind of mental state the questionnaire is, how many questions the questionnaire are comprised of, and the conditions that the user should consider when answering the questionnaire. For example, a plurality of questionnaires may be performed for each category. However, the present disclosure is not necessarily limited to this form, and the mental state classification server of the present disclosure may be provided without notifying the user of which mental state the questionnaire is related to. For example, the service platform110may provide a questionnaire regarding the mental state of major depressive disorder; and may proceed with the questionnaire without informing that the questionnaire provided to the user has a purpose of examining major depressive disorder. In addition, the service platform110may receive the user's personal information from the terminal10and store it. To this end, the service platform110may include a database (not shown) to store the personal information. However, the present invention is not limited thereto, and the service platform110may transmit the user's personal information to an external server (e.g., a cloud server) to store the user's personal information. In this case, the personal information may be stored in a storage space of an external server accessible to the service platform110. Here, the ‘personal information’ may be biographical information of the user. For example, the personal information may be at least one of real name, gender, age (date of birth), phone number, and workplace information (company name, affiliated department, affiliated team, job responsibility, position, and number of years of employment). Furthermore, the service platform110may receive the user's answer to the questionnaire for classification of at least one or more mental states and transmit it to the mental state classification platform120. At this time, the service platform110may store the answer to the questionnaire input by the user through the user interface12of the terminal10. For example, the user may input the answer to the questionnaire through a touch input using a display of the terminal, a microphone (i.e., voice input), a keyboard, and a keyboard application. Alternatively, for example, as shown inFIG.3, the user may input the answer by clicking a button b corresponding to the answer of the questionnaire displayed on the user interface12. In addition, the service platform110can be configured to conduct a questionnaire on the mental state in the terminal10; use the camera of the terminal10to capture a face image of the user while the user inputs the answer; receive the image in real time; and transmit the received face image to the mental state classification platform120. That is, the mental state classification platform120may receive the face image from the terminal in real time and extract heart rate variability (HRV) data of the user in real time. For example, the service platform110may provide the user with questionnaires corresponding to a plurality of mental states to the terminal10; and receive, in real time, the face image generated by photographing a user's face while the user inputs answers to the questionnaires. At this time, the service platform110may provide the user with a questionnaire about a plurality of mental states; receive the face image generated by photographing the user's face image in real time while inputting the answer to the questionnaire for each of the plurality of psychological states; transmit the received face image to the mental state classification platform120. In addition, the mental state classification platform120may be configured to obtain a third value for each of the plurality of mental states, based on a first numerical value based on the answer to the questionnaire for each of the plurality of mental states and a second numerical value based on the face image generated while inputting the answer. For example, while the user inputs the answer to a questionnaire corresponding to the mental state, a minimum time for photographing an image by the camera14may be determined by the service provider of the service platform110. For example, the minimum time for photographing an image of the camera14may be preferably 3 to 5 minutes. However, the present invention is not limited thereto, and the photographing time may be shorter, such as within 1 minute, 2 minutes, or 3 minutes, or longer than the minimum time range. For example, in response to receiving the user's application for mental state classification for major depressive disorder and anxiety disorder, the service platform110may transmit questionnaires about major depressive disorder and anxiety disorder to the terminal10of the user and receive, in real time, the face image captured while the user inputs answers to the questionnaires into the terminal10. In addition, the mental state classification platform120may receive the face image from the service platform110and extract HRV data based on the received face image. HRV may be measured using the face image generated while a plurality of questionnaires is performed for each category. In this case, the measurement of HRV may be performed in real time. Therefore, in the embodiment of the present disclosure, since the classification of the mental state is performed by extracting HRV data based on the image of the user's face together with the answer to the questionnaire for classification of the mental state, the embodiment of the present disclosure is capable of more accurate mental state classification than a classification of mental states by conducting only simple questionnaires or simply analyzing HRV data. In more detail, the at least one mental state may be at least one of major depression disorder, anxiety disorder, adjustment disorder, PTSD, suicidal ideation, and insomnia. In another embodiment of the present disclosure, the mental state classification server100may perform classification of a plurality of mental states; and the service platform110may provide the terminal10with a plurality of questionnaires for classifying each of a plurality of mental states to the user. Unlike the above-described embodiment, the service platform110may receive a user's face image from the terminal10for each section in which the service platform110provides a questionnaire for each of a plurality of mental states and receives an answer. For example, the plurality of mental states received by the service platform110may be major depressive disorder, anxiety disorder, adaptation disorder, PTSD, insomnia, and suicidal ideation. In response to this, the service platform110may sequentially provide questionnaire(s) corresponding to each of the depression, anxiety disorder, and adaptation disorder to the terminal10. In addition, while each time the user inputs the answer to each of the questionnaires provided sequentially in this way, the service platform110may control the camera14of the terminal10to photograph the user's face and generate the face image corresponding to each of questionnaires of the plurality of psychological state for a predetermined time (e.g., 1 minute, 2 minutes, 3 minutes, 5 minutes, etc.). For example, the service platform110may provide the user with a questionnaire related to major depressive disorder through the terminal10and receive a face image of a first section in which the user inputs the answer into the terminal10; provide the user with a questionnaire related to anxiety disorder and receive a face image of a second section in which the user inputs the answer into the terminal10; provide the user with a questionnaire related to adjustment disorder and receive a face image of a third section in which the user inputs the answer into the terminal10; provide a questionnaire related to PTSD to the user and receive a face image of a fourth section in which the user inputs the answer into the terminal10; provide the user with a questionnaire related to insomnia and receive a face image of a fifth section in which the user inputs the answer into the terminal10; and provide the user with a questionnaire related to suicidal ideation and receive a face image of a sixth section in which the user inputs the answer into the terminal10. Thereafter, the mental state classification platform120may extract each HRV data by using, in real time, the face image obtained for each section in the first section to the sixth section. In one embodiment, the service platform110, in response to the fact that the face image received from the terminal10does not meet the criterion (level) for extracting accurate HRV data, may capture the user' face again for the remaining time even after all questionnaires have been completed and extract HRV data. For example, for this purpose, a virtual agent may provide feedback on the service to the user or provide a brief questionnaire to additionally extract HRV data after image capturing for all provided questionnaires is finished, and additionally perform image capturing of the camera14while the user inputs answers to a brief questionnaire. For example, in response to determining that the face image captured in the sixth section does not meet the standard (level) for extracting accurate HRV data, the service platform110may request re-measurement through the terminal10. The service platform110may provide a brief questionnaire to the terminal10in response to the user's response to the re-measurement; and store the face image of a seventh section captured while the user inputs the answer. At this time, the terminal10may allow the virtual person (agent) displayed on the user interface12to interact with the user by transmitting a brief questionnaire about the psychological state (e.g., suicidal ideation) to be measured in the sixth section to the user. Based on the provision of a questionnaire on each psychological state and the face image generated for each questionnaire section on each mental state received from the terminal10(for example, the face image of each of the first to sixth sections), the mental state classification platform120may extract HRV data, evaluate the plurality of psychological states based on the extracted HRV data, and classifies the psychological state in which the user is placed. The mental state classification platform120may be configured to obtain a third value for each of the plurality of mental states, based on a first numerical value based on the answer to the questionnaire for each of the plurality of mental states and a second numerical value based on the face image generated while inputting the answer. Therefore, the mental state classification server100of the present disclosure has an advantage of being able to analyze a more accurate mental state classification for a corresponding mental state through a face image captured while inputting the answer to a questionnaire corresponding to the mental state, even if the user does not input an honest answer to a questionnaire for classifying a plurality of mental states. The face image may be generated by photographing the user's face using the camera14provided in the terminal10. In addition, the service platform110may receive camera photographing time information of the user and transmit it to the mental state classification platform120. The mental state classification platform120may execute a first algorithm. The mental state classification platform120may be configured to execute the first algorithm to obtain a first numerical value indicating a possibility that the user corresponds to the mental state based on the answer received from the terminal10. The first numerical value may include a scale indicating a severity of the user's mental health state. In one embodiment, the severity may be expressed as a percentage or a range of scores. The severity of the psychological health state may be expressed by classifying a scale into, for example, mild, moderate, and severe. Alternatively, the severity of the psychological health state may be expressed by classifying a scale into five levels of, for example, no disability, mild, moderate, moderately severe, and severe. This stage division is exemplary, and the steps can be variously modified by setting. Also, the mental state classification platform120may extract HRV data based on the user's face image stored in the service platform110. Here, the HRV refers to a degree of variability in the heart rate. That is, the HRV refers to a minute variability between one cardiac cycle and the next. The heart rate is determined by an influence of the autonomic nervous system on the intrinsic spontaneity of the sinus node; and is related to an interaction between sympathetic and parasympathetic nerves. This interaction changes moment by moment according to changes in an internal/external environment, resulting in a change in heart rate. In addition, the method of extracting HRV data based on the user's face image may include a method of predicting a heart reaction by analyzing the color change of the face over time from the face image photographed with the camera14. Furthermore, in the method of extracting HRV data based on the user's face image, the face image received by the mental state classification platform120may be image-processed in real time to extract HRV data. For example, the method of extracting the HRV data may include steps of: by the mental state classification platform120, receiving a face image from the terminal10in real time, and detecting the user's face in a frame of the received face image; in response to the face not being detected in the frame, re-detecting the user's face; defining a measurement area in the detected face; extracting a color-based fine movement signal by tracking the head movement due to a fine movement and extracting a fine change in color accordingly; converting the extracted facial fine movement signal into a frequency band through the fast Fourier transform (FFT) to extract a power spectrum and normalizing it to extract relative frequencies; comparing similarity between the relative frequencies of the facial fine movement signal extracted from the face image and the built rule base to select K heartbeat candidates; recognizing an average heart rate of K heart rate candidates extracted from the rule base based on the K-nearest neighbor algorithm through similarity comparison as a final heart rate; and extracting the HRV variables (HRV data) by calculating formulas of the HRV variables from the final recognized heart rate. Examples of the HRV variables are shown in Table 2 below. In the step of extracting the color-based fine movement, each fine movement signal may be normalized to remove noise other than the heartbeat component, and a bandpass filter may be applied to the heartbeat band. TABLE 2<Descriptions of the HRV variables>HRVNo.DomainvariableExplanation1TimeHRAverage heart rate per minute (bpm)2DomainSDNNStandard deviation of intervals betweenall peaks3RMSSDSquare root of the mean of the sum ofthe squares of the differences betweenadjacent peaks4pNN50Proportion (%) of difference betweenadjacent peaks greater than 50 msec.5FrequencyVLFPower values in the 0.0033 to 0.04 HzDomainband in the frequency domain6LFPower values in the 0.04 to 0.15 Hz bandin the frequency domain7HFPower values in the 0.15-0.4Hz band inthe frequency domain8VLF (%)VLF divided by the total power value(power value in the 0.0033~0.4 Hz band)9LF (%)LF divided by total power value (powervalue in 0.0033~0.4 Hz band)10HF (%)HF divided by the total power value(power value in the 0.0033~0.4 Hz band)11InVLFVLF taken as natural logarithm12InLFLF taken as natural logarithm13InHFHF taken natural logarithm14LF/HFLF divided by HF15VLF/HFVLF divided by HF16TotalPower spectrum band between 0.0033 andPower0.4 Hz17DominantThe power value of the highest peak in thePowerpower spectrum18DominantFrequency value (Hz) of the highest peakHzin the power spectrum19PeakPower spectrum band from −0.015 Hz topower+0.015 Hz centered at peak Hz20Peak HzFrequency value (Hz) of the highest peakin the power spectrum band between 0.04and 0.26 Hz21CoherencePeak Power divided by the differenceratiobetween Total Power and Peak Power Such HRV may be used to classify human mental states. In order to classify such a mental state, the mental state classification platform120of the mental state classification server100of the present disclosure may use a clinical surrogate marker. Here, the clinical surrogate marker refers to an indirect indicator of a disease state or treatment; and refers to laboratory measurements or physical signs used to substitute actual clinically meaningful outcome variables (i.e., clinical endpoints). In this regard, according to Kisam Jung (Kisam Jung. (2004).Overview of HRV. Korean Journal of Family Medicine,25(1), 52-58.), autonomic nervous system dysfunction is associated with many clinical diseases and symptoms such as depression, anxiety, and insomnia; and HRV analysis is a non-invasive and reliable test method that can measure autonomic nervous system function and can be widely applied to various diseases and conditions related to autonomic nervous system. Also, a research paper (Tiwari, A., Narayanan, S., & Falk, T. H. (2019, July).Stress and anxiety measurement” in-the-wild” using quality-aware multi-scale hrv features. In2019 41st Annual According to the International Conference of the IEEE), HRV was found to have a major correlation with factors measuring quality of life, such as mental and social job stressors, mental job stress and anxiety, and mental fatigue; and job stressors, anxiety, and mental fatigue were found to be related to work performance. On the other hand, the mental state classification platform120may obtain a second numerical value indicating a possibility that the user corresponds to the mental state based on the extracted HRV variables (HRV data) by executing a second algorithm. In an embodiment, since the second numerical value is obtained from HRV data of the user while the questionnaire is performed, the second numerical value may be a numerical value associated with the reliability of the questionnaire. FIG.3shows classification criteria graphs for classifying a plurality of mental states through HRV data of a mental state classification server according to an embodiment of the present disclosure. Referring toFIG.3, a step of performing the second algorithm executed by the mental state classification platform120may include classifying a severity of the mental state by applying a mental disorder screening model to the extracted HRV data to obtain a second numerical value. That is, the second numerical value may include the severity of the mental state. For example, the mental state classification platform120may extract HRV variables (HRV data) such as HR value, LF value, and HF value by real-time image processing of the received face image, and then classify the mental state of the user by analyzing the extracted HR values, LF values, and HF values as cutoff criteria of the mental disorder screening model. Here, the HR value is related to depressive symptoms, the LF value is related to mental stress and fatigue, and the HF value may decrease when suffering from constant stress, fear, anxiety, or anxiety. For example, as shown inFIG.3below, when the HR value is less than 65.3 to 76.3 in the major depressive disorder category, it may be classified as ‘not depressed’; when the HR value is 76.3 to 82.3, it may be classified as ‘intermediate’; and the HR value may be classified as ‘serious’ when it is greater than 82.3 to 93.1. For example, as shown inFIG.3, the anxiety disorder can be classified as ‘not anxious’ when the LF value is 5.63 to 5.71; and can be classified as ‘serious’ when the LF value is 5.39 to 5.51. For example, as inFIG.3, the adaptation disorder can be classified as ‘not an adaptation disorder’ when the HF value is 296.76 to 368.89; and can be classified as ‘serious’ when the HF value is 165.42 to 229.06. For example, as inFIG.3, the PTSD can be classified as ‘not PTSD’ when the HF value is 296.76 to 368.89; and can be classified as ‘serious’ when the HF value is 165.42 to 229.06. For example, as inFIG.3, the suicidal ideation can be classified as ‘not at risk of suicide’ when the HF value is less than 6.2 to 6.9; can be classified as ‘mild’ when the HF value is 5.5 to 6.2; and can be classified as ‘serious’ when the HF value is less than 5.2 to 5.5. For example, as inFIG.3, the insomnia can be classified as ‘not insomnia’ when the LF value is more than 7.11 to 8.14; can be classified as ‘mild’ when the LF value is 6.62 to 7.11; and can be classified as ‘serious’ when the LF value is less than 6.34 to 6.62. In addition, the mental state classification platform120may execute a third algorithm to obtain the third numerical value indicating a possibility that the user corresponds to the mental state based on the first numerical value and the second numerical value. Here, the third numerical value may include a severity of the mental state. In an embodiment, the third algorithm may set weights for the first numerical value and the second numerical value; and obtain the third numerical value based thereon. For example, the mental state classification platform120may execute the third algorithm to reflect the mental state result classified according to the first numerical value as 95% in a final classification result, and the mental state classified according to the second numerical value by reflecting the result as 5% in the final classification result, to drive a third numerical value indicating the final classification result. In another embodiment, the mental state classification platform120may derive a third numerical value representing the final classification result by multiplying the first numerical value by a weight by the second numerical value by executing the third algorithm. FIG.4is a schematic diagram illustrating a state of the receiving terminal10provided with a questionnaire of a mental state classification service through the mental state classification server100according to another embodiment of the present disclosure. Referring toFIG.4together withFIG.2, the terminal10according to another embodiment of the present disclosure may perform photographing of the user's face with the camera14in a background while inputting the answer to a questionnaire for classifying the at least one psychological state. Here, the background execution refers to executing the application program behind the user interface12invisible so as not to interfere with the user. For example, unlike the terminal10ofFIG.2, the terminal10ofFIG.4may photograph the user's face with the camera14without displaying a camera photographing screen on the user interface12. FIG.5is a diagram illustrating a state in which a user's individual mental state classification result report30is provided to the user's terminal20by the mental state classification server100according to an embodiment of the present disclosure. Referring toFIG.5together withFIG.1, the mental state classification platform120may be configured to generate a mental state classification result report30indicating the mental state having the third numerical value. The mental state classification platform120may indicate a possibility that the user corresponds to at least one mental state in the mental state classification result report30as a percentage31and a plurality of stages32. For example, the plurality of stages may be five levels of ‘not’, ‘mild’, ‘moderate’, ‘moderately severe’, and severe’; four levels of ‘not’, ‘mild’, ‘moderate’, and ‘severe’; and three levels of ‘not’, ‘moderate’, and ‘severe’ and the like. This stage division is exemplary, and the stage division may be two stages or six stages or more. For example, the major depressive disorder can be divided into five levels: not depressive, mild, moderate, moderately severe, and severe. For example, the anxiety disorder can be divided into four levels: not anxious, mild, moderate, and severe. For example, the adaptation disorder can be divided into two levels: not an adaptation disorder, and severe. For example, the PTSD can be divided into three levels: non-PTSD, moderate, and severe. For example, the insomnia may be divided into four levels: not insomnia, mild, moderately severe, and severe. For example, the suicidal ideation may be divided into three levels of not suicidal ideation, mild, and severe. It will be understood that the stage division for each of the above mental states is exemplary, and the stage division may be different according to settings. Accordingly, the mental state classification server100according to an embodiment of the present disclosure may include the service platform110and the mental state classification platform120; and may finally classify the user's mental state by considering both the result of classifying the mental state based on the answer to the questionnaire for classifying the mental state and the result of classifying the mental state based on the HRV data. Accordingly, the mental state classification server100of the present disclosure can effectively increase accuracy and reliability of the user's mental state classification. Furthermore, the mental state classification server100of the present disclosure may extract the HRV data based on the user's answer to the questionnaire and the user's face image captured by the camera while the user inputs the answer to the questionnaire into the terminal10; and thus it is possible to solve problems of the prior art that occur when the user does not answer accurately enough to indicate his/her actual mental state. That is, according to the mental state classification server100of the present disclosure, even if the user does not input an accurate answer to the questionnaire corresponding to the mental state, a more accurate mental state classification for a corresponding psychological state may be analyzed through a face image captured while inputting the answer to the questionnaire. The service platform110may be configured to receive the mental state classification result report30from the mental state classification platform120; and provide the mental state classification result report30to the user. For example, as shown inFIG.5, the service platform110may transmit the mental state classification result report30to the terminal of the user through e-mail. In addition, the mental state classification result report30may further include behavioral recommendations for the corresponding mental state in response to the third numerical value for the mental state being greater than or equal to a predetermined scale. For example, the mental state classification platform120may indicate the third numerical value in the mental state classification result report30by representing the user's mental state as three levels of mild, moderate, and severe. In addition, the mental state classification platform120may include, in response to the mild mental state of the user, contents recommending self-regulation using a digital therapeutic agent in the mental state classification result report30. The mental state classification platform120may include, in response to the user's moderate mental state, contents recommending self-regulation using the digital therapeutic agent and recommendation to visit a local hospital in the group's mental state classification result report30. The mental state classification platform120may include, in response to the user's mental state being severe, contents recommending a visit to a university hospital in the mental state classification result report30. FIG.6Ais a diagram illustrating a state in which a group's mental state classification result report is provided to an administrator's terminal by a mental state classification server according to an embodiment of the present disclosure.FIG.6Bis an enlarged view of region A ofFIG.6Aof the present disclosure.FIG.6Cis an enlarged view of region B ofFIG.6Aof the present disclosure.FIG.6Dis an enlarged view of region C ofFIG.6Aof the present disclosure.FIG.6Eis an enlarged view of region D ofFIG.6Aof the present disclosure.FIG.6Fis an enlarged view of region E ofFIG.6Aof the present disclosure. Referring toFIGS.6A to6Ftogether withFIG.5, the mental state classification server100may perform the mental state classification of a plurality of users included in one group; and the mental state classification platform120may further generate a mental state classification result report40indicating an average of the third numerical value of the users included in the group derived from the third algorithm. That is, the mental state classification platform120may generate the group's mental state classification result report40so that only the average of the third value of the group is shown, and an individual third value of the members of the group is not included. Accordingly, the mental state classification server100of the present disclosure may not expose the user's mental state to the administrator, so that the user can honestly input an answer to the questionnaire. The service platform110may be configured to receive the group's mental state classification result report40from the mental state classification platform120, and provide the received group's mental state classification result report40to an administrator who manages the group. As shown inFIGS.6A to6F, the service platform110may transmit the group's mental state classification result report40to the administrator through an application program of the terminal10. For example, as shown inFIGS.6A to6F, the mental state classification platform120may generate the group's mental state classification result report40so that the group's mental state classification result is displayed as a percentage ratio and a graph, etc. based on the third numerical value of the group to which the user belongs. The group's mental state classification result report40may be generated so that the classification result of the mental state of the group is displayed as a percentage ratio, a graph, or the like. For example, as inFIG.6B, the group's mental state classification result report40may include a total number of people tested41a, a main mental state classification result41b, an increase/decrease in the number of people in a specific psychological state41c, a graph41dshowing a ratio of each level of depression in the group, and a graph41eshowing a ratio of achieving a health goal of mental state among group members. For example, as shown inFIG.6C, the group's mental state classification result report40may include a depression graph of a national average and a depression graph of the employee group of a corresponding company. For example, as shown inFIG.6D, the group's mental state classification result report40may represent an increase or decrease of a specific mental state (depression, adjustment disorder, sleep disorder, PTSD, etc.) of each team member of the company as the number of people. For example, as shown inFIG.6E, the group's mental state classification result report40may represent the mental state classification result of all employees of the company in a donut-type graph. Here, the donut-shaped graph may represent the ratio of the number of persons corresponding to each of depression, sleep disorder, anxiety disorder, and adjustment disorder, among the total number of people. For example, as shown inFIG.6F, the group's mental state classification result report40may represent a degree of satisfaction with the mental state classification service of the employee group of the corresponding company (in-house satisfaction) as a graph. Therefore, the service platform110may provide the group's mental state classification result report40to the administrator who manages the user group, so that the mental state classification server100of the present disclosure can help the administrator manage the mental state of the user group well. The mental state classification platform120may improve the third algorithm through machine learning using artificial intelligence. In an embodiment, the mental state classification platform120may receive a result of classifying the at least one mental state of the user by a person. The mental state classification platform120may improve the third algorithm by performing machine learning of artificial intelligence based on the first numerical value, the second numerical value, the third numerical value, and the result classified by the person so that a fourth algorithm can be derived. That is, the mental state classification platform120may derive the fourth algorithm by adjusting the degree to which each of the first value and the second value is reflected in the third value so that the third value may be close to the result of a person (e.g., a specialist) directly classifying the user's mental state. In addition, the mental state classification platform120may be configured to replace (update) the third algorithm with the derived fourth algorithm. Accordingly, the mental state classification server100of the present disclosure may provide a more accurate mental state classification service to the user by deriving the fourth algorithm in which the mental state classification platform120improves the third algorithm. FIG.7is a conceptual diagram illustrating components of the terminal10according to an embodiment of the present disclosure. Referring toFIG.7, the terminal10configured to be accessible to the service platform110provided in the mental state classification server100according to an embodiment of the present disclosure is provided. Specifically, the terminal10may include a user interface12, a camera14, a wireless communication unit16, and a processor18. The user interface12may display a questionnaire for classification of a mental state provided from the service platform110. The user interface12may be configured so that a user of the terminal10may input an answer to the questionnaire. For example, when the terminal10is a smartphone, the user interface12may be a display capable of a touch input. The camera14may be configured to generate a face image by photographing the face of the user of the terminal10. That is, the camera14may be configured to capture an image of the user's face while the user inputs the answer to the questionnaire. For example, when the terminal10is a smartphone, the camera14of the smartphone may be a front camera14located at an upper end of the display unit of the smartphone. The wireless communication unit16may be configured to receive the questionnaire from the service platform110. The terminal10may receive the questionnaire information through Internet communication of the wireless communication unit16. However, it is not necessarily limited to such Internet wireless communication, and the terminal10may receive the questionnaire contents through wired communication. The wireless communication unit16may be configured to transmit the answer input through the user interface12to the service platform110through Internet wireless communication. The wireless communication unit16may be configured to transmit the generated face image to the service platform110through Internet wireless communication. The processor18manages and controls the components of the terminal10. The processor18may be configured to control the user interface12, the camera14, and the wireless communication unit16. For example, when the terminal10is a smartphone, the processor18may be an application processor (AP). In one embodiment, the processor18may be application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, micro-controllers, microprocessors, or any other type of processor or controller for performing other functions. The processor18of the terminal10of the present disclosure may control the user interface12so that a virtual person transmits questions of the questionnaire to the user in the form of a chatting message, when providing the questionnaire to the user through the user interface12. In an embodiment, the provision of the questionnaire may be performed by an application stored in the terminal10. The processor18may control the camera14to generate a face image by photographing the user's face whenever the user inputs an answer to the questionnaire through the user interface12. The processor18may control the wireless communication unit16to transmit the generated face image of the user to the service platform110. Since the user's face is photographed with the camera14while the user inputs the answer into the terminal10, the terminal10of the present disclosure may provide the mental state classification server100with a face image captured while inputting the answer to the questionnaire so that the mental state classification server100can analyze a more accurate mental state classification for the corresponding mental state although the user does not input an accurate answer to the questionnaire corresponding to the mental state. As shown inFIG.2, the user may be configured to display at least a part of the user's face on the user interface12while the user inputs the answer to the questionnaire through the user interface12of the terminal10. In this case, the face image being photographed through the camera14may be displayed at the top of the chatting (conversation) screen with a virtual person (agent) for mental state classification of the user interface12. The face image may represent a middle of a forehead and both cheeks of the user's face. That is, a minimum camera view area to be displayed on the user interface12may correspond to the middle of the forehead and both cheeks of the face. In this regard, according to the objective self-awareness (OSA) theory and a method proven in OSA theory-related experiments, the minimum camera view area in which the user's face is captured is displayed on the user interface12, so that the camera14can be used as a mirror and the user who recognizes his/her appearance may provoke self-reflection and enter a more truthful answer (Duval & Wicklund, 1972). Accordingly, the terminal10of the present disclosure may display at least a part of the user's face on the user interface12of the terminal10while the camera14is photographing, thereby allowing the user to input the user's true answer to the questionnaire while the user inputs the answer to the questionnaire through the user interface12of the terminal10. Alternatively, as shown inFIG.4, in the method of providing a mental state classification service of the present disclosure, during at least one questionnaire, the camera14may be executed in a background to prevent the user from recognizing the face photograph. FIG.8is a flowchart illustrating a process of classifying a user's mental state in a method for classifying a mental state according to an embodiment of the present disclosure. Referring toFIG.8together withFIG.1, the mental state classification method according to an embodiment of the present disclosure is a method of classifying at least one mental state of a user of the terminal10using the mental state classification server100including the service platform110and the mental state classification platform120. Specifically, the mental state classification method may include a step M01of providing, by the service platform110, a questionnaire related to the mental state to the user through the terminal10to classify the mental state of the user. The mental state classification method includes a step M02of receiving, by the service platform110, the answer input by the user to the questionnaire for classifying the mental state and storing the received answer. The mental state classification method includes a step M03of, by the service platform110, receiving a face image generated by photographing the face of the user by the terminal10while the user inputs the answer corresponding to the psychological state to the terminal10and transferring the received face image to the mental state classification platform120. Each questionnaire may include a plurality of questions. The mental state classification method includes a step M04of obtaining, by the mental state classification platform120, a first numerical value representing a possibility that the user corresponds to the mental state, based on the answer received from the service platform110, by executing a first algorithm. The mental state classification method includes a step M05of extracting, by the mental state classification platform120, HRV data of the user based on the transmitted face image. The mental state classification method includes a step M06of obtaining, by the mental state classification platform120, a second value indicating a possibility that the user corresponds to the mental state based on the extracted HRV data of the user by executing a second algorithm. The mental state classification method includes a step M07of obtaining, by the mental state classification platform120, a third numerical value indicating a possibility that the user corresponds to the mental state based on the first numerical value and the second numerical value, by executing a third algorithm. The mental state classification method includes a step M08of generating, by the mental state classification platform120, a mental state classification result report30indicating the third numerical value of the mental state and transmitting the generated mental state classification result report30to the service platform110. The mental state classification method includes a step M09of providing, by the service platform110, the mental state classification result report40to the user. In this case, the service platform110may be configured to receive, in real time, a face image generated by photographing while the user inputs the answer corresponding to the mental state into the terminal10. For example, the service platform110may receive, in real time, a face image generated by photographing a user's face while the user inputs answers to questionnaires corresponding to a plurality of mental states. However, it is not necessarily limited to this form, and the mental state classification method may include classifying a plurality of mental states of the user, and, by the service platform, receiving a face image for each questionnaire section, generated by photographing the user's face image for each questionnaire section for each of the plurality of mental states. In addition, the mental state classification platform120may be configured to obtain a third numerical value for each questionnaire section based on the first value based on the answer to the questionnaire for each of the plurality of mental states and the second value based on the face image for each questionnaire section. Therefore, the mental state classification method of the present disclosure may classify the mental state of the user by using the service platform110and the mental state classification platform120included in the mental state classification server100, so that it is possible to finally classify the mental state of the user into a level indicating good or bad, considering both the mental state classification result based on the answers to the questionnaire for mental state classification and the mental state classification result based on the HRV data. Accordingly, the mental state classification method of the present disclosure can effectively increase accuracy and reliability of the user's mental state classification. On the other hand, again referring toFIG.8together withFIGS.1and6A, the mental state classification method may include: a step of N01of generating, by the mental state classification platform120, a group's mental state classification result report40indicating an average of the third numerical value of each of the plurality of users derived from the third algorithm; and a step of N02of receiving, by the service platform110, the group's mental state classification result report40from the mental state classification platform120and providing the received group's mental state classification result report40to an administrator who manages the plurality of users. In addition, the step M08may include a step (not shown) of adding an action recommendation for a mental state having the third numerical value to the mental state classification result report30in response to determining that the third numerical value is equal to or greater than the reference value. For example, the mental state classification platform120may represent the third numerical value as three levels of the user's mental state: mild, moderate, and severe. In addition, the step M08may include: in response to the user's psychological state being mild, including in the psychological state classification result report30contents recommending self-regulation using a digital therapeutic agent; in response to the user's psychological state being moderate, including self-regulation using digital therapeutics and recommendations for visiting a local hospital in the psychological state classification result report30; and in response to the user's psychological state being severe, including contents recommending a visit to a university hospital in the mental state classification result report30. FIG.9is a flowchart illustrating a process of machine learning by the mental state classification platform120of the mental state classification server100according to an embodiment of the present disclosure. Referring toFIG.9, the mental state classification method of the present disclosure, after the step M09of providing the mental state classification result report30to the user, may further perform following steps M10, M11, and M12for increasing accuracy of classifying the mental state of the user. That is, the mental state classification method may further include: a step M10of receiving, by the mental state classification platform120, a possibility of the user's mental state classified by a person (e.g., a specialist); a step of M11of deriving, by the mental state classification platform120, a fourth algorithm that improves the third algorithm by performing machine learning of artificial intelligence based on the first numerical value, the second numerical value, the third numerical value, and the result classified by the person; and a step M12of, by the mental state classification platform120, replacing the third algorithm with the fourth algorithm. Accordingly, the mental state classification method of the present disclosure may provide a more accurate mental state classification service to the user, by including the steps of, by the mental state classification platform120, deriving the fourth algorithm that improved the third algorithm; and substituting the third algorithm for the derived fourth algorithm. FIG.10is a flowchart illustrating steps of a method for providing a mental state classification service according to an embodiment of the present disclosure. Referring toFIG.10together withFIGS.1,5, and6A, a method of providing a mental state classification service according to an embodiment of the present disclosure is a method of providing a classification service of at least one mental state to a user using the mental state classification server100, which includes the service platform110and the mental state classification platform120. Specifically, the method of providing the mental state classification service to the user may include a step S01of receiving, by the service platform110, an application for the mental state classification service from at least one of the user and the administrator who manages users. For example, the service platform110may start a mental state classification service in response to a request from the user or the administrator who wants to classify the mental state. The method of providing the mental state classification service to the user may include a step S02of receiving, by the service platform110, the user's personal information and storing the personal information. The method of providing the mental state classification service to the user may include a step S03of notifying, by the service platform110, the user's administrator of completion of the mental state classification service registration. The method of providing the mental state classification service to the user may further include a step S04of providing, by the service platform110, a notification to the user about the registered mental state classification service. The service platform110may check a HRV measurement environment through the user's terminal10after notifying the completion of the registration of the mental state classification service. For example, the method of checking the HRV measurement environment may check noise of the user's surrounding environment, brightness of lighting, an operating state of the camera14, and the like. The method of providing the mental state classification service to the user may include a step S05of receiving, after providing the user with a registration notification of the mental state classification service, by the service platform110, a request from the user to start the mental state classification service. The method of providing the mental state classification service to the user may further include a step S06of confirming, after receiving S05the request to start the mental state classification service from the user, by the service platform110, whether the user who requested the start of the mental state classification service is the same as the user registered in the service. In this case, the service platform110may check whether the user is the same person as the user registered in the service through a user authentication method. Here, the ‘user authentication method’ may be, for example, a method in which an authentication code is sent to the receiving terminal10as a text message, and the user of the receiving terminal10enters the authentication code at a user authentication site. In addition, the user authentication method may be a method of inputting first six digits of a resident number or transmitting the authentication code by e-mail. The method of providing the mental state classification service to the user may include a step S07of providing, by the service platform110, a questionnaire for the classification of the mental state to the user's terminal10. The method of providing the mental state classification service to the user may include a step S08of receiving, by the service platform110, the user's answer to the questionnaire from the terminal10and storing the received answer. The method of providing the mental state classification service to the user may include a step S09of receiving, by the service platform, the face image generated by photographing the user's face while conducting the mental state questionnaire and the user's inputting the answer corresponding to the mental state into the terminal10. The method of providing the mental state classification service to the user may include a step S10of transmitting, by the service platform110, the answer to the user's questionnaire and the user's face image to the mental state classification platform120and requesting the mental state classification platform120to classify a mental state based on the transmitted user's answer and perform HRV analysis based on the transmitted face image. The method of providing the mental state classification service to the user may include a step S11of extracting, by the mental state classification platform120, the user's HRV data based on the generated face image. The method of providing the mental state classification service to the user may include a step S12of classifying, by the mental state classification platform120, a possibility of corresponding to the mental state based on the answer to the questionnaire and the extracted HRV data and generating the mental state classification result report30based on the classified result. The method of providing the mental state classification service to the user may include a step S13of transmitting, by the mental state classification platform120, the mental state classification result report30and the extracted HRV data to the service platform110. The method of providing the mental state classification service to the user may include a step S14of providing, by the service platform110, the mental state classification result report30to the user. Therefore, according to the method of providing the mental state classification service of the present disclosure, even if the user does not input an honest answer to the questionnaire corresponding to any one of the mental states, since it is possible to analyze a more accurate mental state classification for the mental state, a highly reliable mental state classification result report can be provided to the user. According to one embodiment of the present disclosure, the method of providing a mental state classification service of the present disclosure may provide a classification service of a plurality of mental states of a user. In this case, the service platform110may receive an application about the classification service of the plurality of mental states of the user. The step S07of, by the service platform110, providing the questionnaire for classification of a mental state to the user's terminal, may include, by the service platform110, providing a plurality of questionnaires for classification of a plurality of mental states to the user's terminal10. The step S08of, by the service platform110, storing the answer may include, by the service platform110, receiving the user's answers to each of the plurality of questionnaires and storing the received answers. The step S09of receiving the face image may include, by the service platform110, receiving a face image generated by photographing a face while the user inputs the answer to a questionnaire for each of the plurality of mental states. After the service platform110receives the face image, the method may further perform a step of, by the service platform110, transmitting the face image to the mental state classification platform120. In addition, the step S11of extracting the HRV data may include a step of, by the mental state classification platform120, extracting HRV data of the user that can classify each of the plurality of mental states based on all face images generated while inputting an answer to a questionnaire for each of the plurality of mental states. According to another embodiment of the present disclosure, the method of providing a classification service of at least one mental state to the user may provide a classification service of a plurality of mental states of the user. Unlike the method of providing the mental state classification service of an embodiment of the present disclosure described above, the step S09of receiving the face image may include a step of, by the service platform110, receiving a face image generated by photographing a face for each section in which the user inputs the answer to the questionnaire for each of the plurality of psychological states and transmitting the face image to the mental state classification platform120. In addition, the step S11of extracting the HRV data may include a step of, by the mental state classification platform120, extracting HRV data of the user that corresponds to each of the plurality of mental states based on the face image generated for each questionnaire section for each of the plurality of mental states. In addition, as shown inFIG.5, the generating of the mental state classification result report30may include, by the mental state classification platform120, a possibility of corresponding to each of the mental states based on the answers to each of the plurality of questions and the extracted HRV data and generating the mental state classification result report30based on the classified result. In another embodiment, the method of providing the mental state classification service may include, by the service platform110, classifying the mental states of a plurality of users. The step S12of generating the mental state classification result report30may include, by the mental state classification platform, further generating a group's mental state classification result report40representing an average of possibilities corresponding to the mental state of the plurality of users. In another embodiment, the method may provide the mental state classification result report30of a plurality of users (i.e., a group) to the administrator. At this time, the step S13may further include, by the service platform110, receiving the group's mental state classification result report40from the mental state classification platform120. In addition, as shown inFIG.6A, the method of providing a mental state classification service to the user may include a step S15of receiving, by the service platform110, the group's mental state classification report from the mental state classification platform120and providing the received group's mental state classification report to an administrator who manages the plurality of users. The user's personal information may be at least one of a real name, gender, age (date of birth), a phone number, and work information (company name, affiliated department, affiliated team, job title, and number of years of service). The at least one mental state may be a mental state related to a mental illness designated by the Korea Workers' Compensation and Welfare Service. For example, the at least one mental state may include major depression disorder, anxiety disorder, adjustment disorder, PTSD, suicidal ideation, and insomnia. The step S07of providing a questionnaire for classification of the user's mental state to the terminal10may include a step (not shown) of transmitting, through the user interface12of the terminal10, the questionnaire to the user in a form of a chatting message by a virtual person. For example, as shown inFIG.2, the service platform110may provide the questionnaire through an installed application program (e.g., an app) of the terminal10. When the questionnaire is provided to the user, the virtual person may transmit the question of the questionnaire to the user in the form of a chatting message2. As shown inFIG.2, the step S09of, by the service platform110, storing the user's face image photographed by the camera14of the terminal10may include displaying at least a part of the user's face, which is being photographed by the camera14, while the user inputs the answer to the questionnaire through the user interface of the terminal10. At this time, at least a part of the user's face being photographed by the camera14may be displayed on a top of the screen for a medical examination with a virtual person (i.e., agent) for mental state classification of the user interface12. In addition, at least a portion of the user's face may include a middle of a forehead and both cheeks of the user's face. That is, according to the objective self-awareness (OSA) theory and the method proven in OSA theory-related experiments, the camera can be utilized as a mirror by displaying this minimum camera view on the user interface12; so that a user who recognizes his/her appearance can provoke self-reflection and can enter a more truthful answer (Duval, S., & Wicklund, R. A. (1972). A theory of objective self awareness. New York: Academic Press.). Accordingly, the method of providing the mental state classification service of the present disclosure includes the step of displaying at least a part of the user's face on the user interface12of the terminal10while the camera14is photographing, so that it is possible to induce the user to input a true answer to the questionnaire while the user is inputting the answer to the questionnaire through the user interface12of the terminal10. FIG.11is a flowchart illustrating steps of providing a mental state classification service in addition to the method of providing the mental state classification service according to an embodiment of the present disclosure. Referring toFIG.11together withFIG.10, the method of providing a mental state classification service according to an embodiment of the present disclosure may further include: after the step S14of providing the mental state classification result report to the user or the step S15of providing the mental state classification result report to the administrator, a step Z01of, by the service platform110, receiving the user's face image captured regularly for a predetermined period and transmitting the received face image to the mental state classification platform120; a step Z02of, by the mental state classification platform120, extracting HRV data based on the user's face image stored in the service platform110; a step Z03of, by the mental state classification platform120, generating a mental state classification result report30indicating a possibility of corresponding to the mental state based on the extracted HRV data; and a step Z04of, by the service platform110, providing the mental state classification result report30to the user. For example, the step Z01may include a step of, by the service platform110, receiving a face image generated by photographing the user's face once a week for four weeks from the terminal10. Therefore, the method of providing a mental state classification service according to an embodiment of the present disclosure can provide a regular mental state classification service to the user in a convenient way even after providing the mental state classification service to the user, so that it is possible to effectively help manage the user's mental health. The apparatus and method described above may be implemented as a hardware component, a software component, and/or a combination of the hardware component and the software component. For example, devices and components described in the embodiments may be implemented using one or more general purpose computers or special purpose computers, for example, a processor, controller, arithmetic logic unit (ALU), digital signal processor, microcomputer, field programmable array (FPA), programmable logic unit (PLU), microprocessor, or a certain other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to execution of the software. Although, for the convenience of understanding, there are instances where one processing device is described as being used, a person of ordinary skill in the art will recognize that a processing device may include a plurality of processing elements and/or a plurality of types of processing elements. For example, the processing device may include a plurality of processors or one processor and one controller. Other processing configurations are also possible, such as parallel processors. Software may include a computer program, code, instructions, or a combination of one or more of these, and configure a processing unit to behave as desired, or independently or collectively give instructions to the processing unit. The software and/or data may be permanently or temporarily embodied on a certain machine, component, physical device, virtual equipment, computer storage medium or device, or transmitted signal wave in order to be interpreted by or to provide instructions or data to the processor. The software may be distributed over networked computer systems and stored or executed in a distributed manner. The software and data may be stored in one or more computer-readable recording media. The described embodiments of the present disclosure also allow certain tasks to be performed on a distributing computing environment performed by remote processing devices that are linked through a communications network. In the distributed computing environment, program modules may be located in both local and remote memory storage devices. As described above, although the embodiments have been described with reference to the limited drawings, those of ordinary skill in the art may apply various technical modifications and variations to the above, based on them. Appropriate results can be achieved when, for example, the described techniques are performed in an order different from the described method, and/or the described components of a system, structure, apparatus, circuit, etc. are combined or combined in a different form than the described method, or other components or an equivalent may be substituted or exchanged to achieve an appropriate result. Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims. | 70,206 |
11862342 | DESCRIPTION OF THE EMBODIMENTS Reference will now be made in detail to the exemplary embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. An embolus dislodged from atherosclerotic plaques may cause clinical complications, depending on the source and destination of the embolus in the circulatory system. In other words, patient risk of heart disease and attack may be based, in part, on embolus destination, e.g., in the coronary arteries. The size and destination of an embolus may indicate the extent to which the embolus may harm the patient. For example, deep vein thrombosis may cause a life-threatening pulmonary embolism if a sizable embolus enters the lungs. As another example, embolism in patients may cause stroke or transient ischemic attack (TIA). Similarly, early microembolism after carotid endarterectomy may relate to postoperative cerebral ischemia. Stroke may also be caused by embolization from the aortic arch or other places in the vasculature, including the left atrial appendage of the heart. Thus, a desire exists to better predict embolus destination. The present disclosure includes methods to determine embolus destination based on the location of embolic source, vascular anatomy, blood flow characteristics, and/or circulatory system. This disclosure includes systems and methods for assessing the impact of an embolus, as a function of the source of the embolus and a patient's circulatory system. For example, this disclosure describes systems and methods for predicting the circulatory destination probability of an embolus dislodged from a specified location, including the heart (e.g., left atrium, left atrium with atrial fibrillation, aortic valve, mitral valve, left ventricular aneurysms, prosthetic aortic or mitral valves, abdominal aorta, carotid, coronary arteries, veins, etc.) to assess (i) the impact of an embolus on cerebral-related risks (e.g., cognitive impairment, stroke, TIA), (ii) the impact of an embolus on peripheral-related risks (e.g., pulmonary embolism), and/or (iii) a risk of potential emboli dislodgement associated with invasive procedures. Thus, this disclosure includes systems and methods for assessing the impact of embolism on patient risk and evaluating therapeutic options based, at least in part, on the impact of embolism. The disclosure further includes systems and methods for evaluating therapeutic options based on the assessments. For example, this disclosure may include methods to identify culprit embolic sources for treatment. Identifying or predicting source locations of emboli may provide treatment recommendations targeted to locations where dislodged emboli may cause a harmful embolism. Referring now to the figures,FIG.1depicts a block diagram of an exemplary system100and network for disease assessment using predictions regarding embolism dislodgement and destination, according to an exemplary embodiment. Specifically,FIG.1depicts a plurality of physicians102and third party providers104, any of whom may be connected to an electronic network101, for example, the Internet, through one or more computers, servers, and/or handheld mobile devices. Physicians102and/or third party providers104may create or otherwise obtain images of one or more patients' anatomy. The physicians102and/or third party providers104may also obtain any combination of patient-specific information, including age, medical history, blood pressure, blood viscosity, patient activity or exercise level, etc. Physicians102and/or third party providers104may transmit the anatomical images and/or patient-specific information to server systems106over the electronic network101. Server systems106may include storage devices for storing images and data received from physicians102and/or third party providers104. Server systems106may also include processing devices for processing images and data stored in the storage devices. For the present disclosure, “patient” may refer to any individual of interest. FIG.2Adepicts a flowchart of a general embodiment for identifying emboli source locations, circulatory destination probabilities, and locations vulnerable to embolism. The flowchart ofFIG.2Amay further depict evaluating patient risk or treatment options associated with the circulatory destination probabilities and locations vulnerable to embolism.FIG.2Bdepicts a flowchart of a general embodiment for finding embolic sources for one or more patient conditions or risks.FIGS.3A-5Bdepict exemplary applications of the methods shown inFIGS.2A and2B. For example,FIGS.3A-3Cdepict flowcharts for a specific embodiment for predicting cerebral-related risks and evaluating treatment options associated with the cerebral-related risks.FIGS.4A-4Cdepict flowcharts for a specific embodiment for predicting peripheral-related risks and evaluating treatment options associated with the peripheral-related risks.FIGS.5A-5Cdepict flowcharts for a specific embodiment for assessing a risks (e.g., of potential emboli dislodgement or embolism) associated with an invasive procedure. The exemplary methods of the figures may be performed or used individually, or in any combination. Any or all the steps of the exemplary methods may be performed using a computing processor. FIG.2Ais a flowchart of an exemplary method200of determining emboli source locations, circulatory destination probabilities, and vessel locations vulnerable to embolism, according to an exemplary embodiment. The method ofFIG.2Amay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step201may include receiving a model of a patient's vasculature and physiologic characteristics (e.g., in an electronic storage medium). For example, the vascular model may include a portion of the patient's vasculature, or the patient's entire circulatory system. Various portions of the vascular model may be at imaged and/or modeled varying levels of detail. For example, in a case involving a model of the patient's entire circulatory system, prioritized portions or portions of interest in the patient's circulatory system may be modeled in greater detail. Remaining portions of the model may be inferred. One such exemplary scenario may include modeling portions of interest for the received patient vascular model as 3D geometric, anatomic models while modeling remaining portions of the received patient vascular model as reduced order models. The vascular model may include a composite of various models, reflecting, for instance, variations in geometry, psychological response, boundary conditions, and/or physics-based variations in blood flow for respective location(s) in the vasculature. In one embodiment, step203may include receiving one or more locations of interest in the patient (e.g., a plaque, pathological area, location of possible vascular shedding, etc.) via invasive and/or noninvasive imaging, for storage in an electronic storage medium. Step203may also include identifying one or more locations of interest using a computing processor. For example, step203may include identifying a plaque, a pathological area, and/or a location of possible vascular shedding in the received model of the patient's vasculature and designating the identified plaque, pathological area, and/or location of possible vascular shedding as one or more locations of interest. In one embodiment, the one or more locations of interest may be stored within an electronic storage drive. In one embodiment, step205may include computing circulatory destination probability in order to determine potential destination(s) for an embolus dislodged from one or more locations of interest. For example, step205may include determining one or more blood flow characteristics and using the determined blood flow characteristic(s) to determine the circulatory destination probability of an embolus dislodged from the identified locations of interest of the patient's vasculature. The blood flow characteristics may be determined based on the patient's vasculature and the received physiologic characteristics (e.g., from step201). For example, the blood flow characteristics may be determined by simulating blood flow through at least a portion of the model of the patient's vasculature. The determinations of circulatory destination probability may be calculated via particle tracking, using a computing processor (as described in further detail, for example, at step309ofFIG.3A, step409ofFIG.4A, and step509ofFIG.5A). In one embodiment, step207may include determining locations vulnerable to embolism, based on the computed destination probabilities for a given location in the patient's modeled vasculature (e.g., a location of interest). The circulatory destination probability may indicate a destination/target location in the patient's vasculature where the dislodged embolus (e.g., from step203) may lodge, as well as the likelihood that the dislodged embolus would lodge at that particular destination. In other words, the output of step207may include various locations (e.g., destinations) in a patient's vasculature where an embolism may form, given the identified locations of interest (e.g., of step203). In one embodiment, the various locations may comprise locations vulnerable to embolism (e.g., vulnerable locations in a patient's vasculature). In a further embodiment, step207may include ranking or selecting locations vulnerable to embolism, from the various locations (e.g., destinations) in a patient's vasculature where an embolism may form. For example, step207may include identifying a location vulnerable in a patient's vasculature vulnerable to embolism where the destination probability of the location exceeds a predetermined threshold. Step207may include identifying a threshold destination probability of a location in the patient's vasculature. As an example, step207may designate a destination probability of 50% as a threshold, such that a destination probability that exceeds 50% may cause an associated location to be identified as a “vulnerable location.” For instance, location A may be associated with a 56% likelihood of embolism, while location B may be associated with a 30% likelihood of embolism. Step207may include designating location A as a “vulnerable location” while location B is not. Alternately or in addition, vulnerable locations may be designated as locations in a vessel most vulnerable to embolism or with the highest likelihoods of embolism. For example, the three locations in a vessel most vulnerable to embolism or locations of a patient's vasculature with the top three destination probabilities may be designated as “vulnerable locations.” In one embodiment, step207may further include associating an identified vulnerable location (of embolism) with the location of interest (e.g., source location for the dislodged emboli). In other words, step207may further include determining, for a location in a patient's vasculature (e.g., an embolic source), a probability of embolism associated with emboli dislodging from the location. In one embodiment, step209may include storing, outputting, and/or generating a representation of vulnerable embolism locations and associated embolic sources, e.g., to an electronic storage medium. In a further embodiment, step211may include outputting a patient risk of an event associated with the computed risk of embolism and/or the determined vulnerable embolism location(s). For example, computing patient risk for the event of a stroke may include one or more of the following: imaging at least a portion of the patient's aortic arch, great vessels, carotid artery, vertebral, and/or intracranial circulation, identifying, e.g., from imaging, plaques (e.g., at a carotid bifurcation), assessing a degree of stenosis, assessing plaque characteristics, assessing plaque composition, determining an association between a risk of stroke and a location of stroke (e.g., from an embolus). A risk of stroke and/or location of stroke (embolus) may be calculated by correlating risk to actual occurrences of stroke/TIA, diffusion weighted maps of MRI (e.g., to identify symptomatic stroke and areas of ischemia/infarction of a brain (that could be asymptomatic), etc.), etc. In another embodiment, computing patient risk for stroke may include calculating blood flow patterns and/or predicting vulnerable locations in a patient's anatomy for embolism/stroke. Machine learning of plaque severity and/or location in conjunction with distribution of stroke (e.g., from MRI and head CTA) may enhance predictive certainty. In some cases, patient risk of an embolism-related event may be inferred from the risk of an embolism. In one embodiment, step211may include estimating the patient risk of an embolism-related event using a machine-learning based prediction model derived from clinical data on the relationship between detected emboli and actual clinical events. For instance, an exemplary event associated with the risk of embolism may include stroke. A vulnerable embolism location within the brain may relate to a high patient risk of stroke, whereas a patient may have a low risk of stroke if the computed circulatory destination probability indicates a low probability that an emboli from the patient's location of interest (e.g., from step203), would lodge in the patient's cerebral vasculature. In one embodiment, method200may include determining one or more destinations of interest (e.g., target location(s)) in the patient's vasculature. For example, destinations of interest may include locations in the circulatory system where embolism presence would be particularly harmful, e.g., one or more of the aorta, carotid artery, various peripheral vessels, etc. Determining the destinations of interest may include receiving and/or identifying the destinations of interest. Then, method200may include calculating a circulatory destination probability, in particular, for an embolus dislodged from a location of interest and traveling to one of the one or more destinations of interest. Such an embodiment may include an analysis in method200particularly providing determinations of risk of certain events associated with embolism. For example, a patient's lungs or the brain may serve as destinations of interest in a case where peripheral vessels (e.g., peripheral veins) may be defined as sources of interest and method200may be used to provide an assessment destination risk for embolization to the lungs (pulmonary embolism) or to the brain (if the patient has a patent foramen ovale in the heart). Then, method200may include calculating source probability of the peripheral vessels, destination probability of the lungs and brain, and/or the patient's risk of pulmonary embolism, rather than performing a more comprehensive assessment for several locations vulnerable to embolism or for patient risk of various different events associated with embolism. FIG.2Bis a flowchart of an exemplary method220of identifying source locations for emboli, according to an exemplary embodiment. The method ofFIG.2Bmay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step221may include receiving (and/or determining) one or more destinations of interest in a patient's vasculature. A destination of interest in a patient's vasculature may relate to a location in a patient's vasculature where an embolism may impact a patient's health, or create a risk of harm to the patient. In one embodiment, step223may include determining a computed destination probability (e.g., from step205of method200) associated with at least one destination of interest of the one or more destinations of interest. For example, step223may include retrieving, from stored destination probabilities (e.g., from step209of method200), a destination probability associated with the at least one destination of interest. In some cases, multiple destination probabilities may be associated with a destination of interest, since emboli may be associated with various sources, each corresponding to a different destination probability. In one embodiment, step225may include determining an embolic source associated with the computed destination probability (e.g., from step205or step223) for the at least one destination of interest of the one or more destinations of interest of step221. The embolic source may include a location in the model of the patient's vasculature comprising at least one location (or a portion of at least one location) of the one or more of the locations of interest (e.g., from step203). For example, a location of interest may include a segment of the patient's modeled vasculature. The embolic source may include a particular location or sub-section of the segment of the patient's modeled vasculature. For example, emboli that may theoretically lodge at the destination of interest may arrive from several source locations within the patient's vasculature. Step225may include determining sources of emboli most likely to arrive at a destination of interest, given the patient's circulatory pattern. In one embodiment, step227may include storing, outputting, and/or generating a representation of a destination of interest (e.g., a vulnerable embolism location) with one or more associated embolic sources, e.g., to an electronic storage medium. In a further embodiment, step229may include outputting a patient risk of an event associated with a risk of embolism from the computed destination probability. Step229may further include generating treatment recommendations associated with one or more of the determined embolic sources (e.g., from step225). For example, if the highest probability of embolic source is determined to be at the left atrial appendage, step229may include generating a recommendation of a left atrial appendage closing procedure in order to prevent a stroke. If the embolic source is a deep vein thrombus in the legs, step229may include generating a recommendation of a vena cava filter that can trap the embolus before it reaches the lung, thus possibly protecting the patient from a fatal pulmonary embolus. If an ulcerating carotid plaque is the source for cerebral emboli, step229may include generating a recommendation of a carotid endarterctomy to attempt to eliminate the embolic source and prevent stroke. FIGS.3A-3Cdepict exemplary methods of predicting cerebral-related risks and evaluating treatment options associated with the cerebral-related risks, according to an exemplary embodiment. Emboli sources may include atheromatous plaque in a carotid artery or an aorta, heart chambers with atrial fibrillation, and/or prosthetic heart valves. The presence of microembolisms may correlate with a patient's risk of stroke, TIA, cognitive impairment, and/or postoperative cerebral ischemia. The methods ofFIGS.3A-3Cmay include identifying likely embolic sources, e.g., by using computational fluid dynamics (CFD) analyses or simulations applied to patient-specific images of cerebral arteries and other vasculatures. Outputs of methods inFIGS.3A-3Cmay provide predictions or recommendations for reducing the risk of stroke, TIA, cognitive impairment, and/or postoperative cerebral ischemia. FIG.3Ais a flowchart of an exemplary method300of determining destination(s) in cerebral vessels for an embolus dislodged from a location in patient's vasculature, according to an exemplary embodiment. The method ofFIG.3Amay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, steps301-307may include receiving various information relating to a patient. For example, step301may include receiving the patient's medical history, including any inherited or acquired hypercoagulable state that may affect thrombotic risk. For instance, patient medical history may include the patient's family medical history, as well as the patient's prior history of deep venous thrombosis or pulmonary embolism, factor V Leiden, cancer, and/or recent trauma or surgery. Step303may include receiving information on medications that the patient may be taking that may affect thrombotic risk. Examples of such medications may include: Aspirin, Clopidogrel, Coumadin/Warfarin, Heparin, etc. In one embodiment, step305may include receiving the patient's physiologic conditions and/or a model of the patient's anatomy (e.g., including at least a portion of the patient's circulatory system). The model of the patient's anatomy may include a representation of the patient's heart, aortic arch, coronary, carotid, and cerebral arteries, and/or veins. Alternately or in addition, the model of the patient's anatomy may include a 3D mesh model (e.g., obtained via segmentation of cardiac and head CT images) and/or a patient-specific cerebral artery model combined with a generic circulatory model (e.g., of a coronary, aortic arch, etc.) based on a population average. Patient physiologic conditions may include, for example: age, sex, blood pressure/heart rate under rest/exercise conditions, physical activity (e.g., exercise intensity), sedentary time per day, obesity, etc. In one embodiment, step307may include receiving one or more locations of interest in the patient's anatomy (e.g., a plaque, pathological area, location of possible vascular shedding, etc.). A location of interest may include a simulated culprit embolic source. In one embodiment, the locations of interest may be received in an electronic storage medium. Alternately or in addition, step307may include identifying one or more locations of interest in the patient's anatomy. For example, the locations of interest may be identified via invasive and/or noninvasive imaging (e.g., CT, MRI, IVUS, transcranial Doppler ultrasound, etc.). In one exemplary case, step307may include identifying the one or more locations of interest by detecting atherosclerotic plaques in the patient's vessel(s). Step307may further include storing identified location(s) of interest electronically (e.g., via an electronic storage medium, RAM, etc.). Information regarding a location of interest in the patient may include, for example, information on the presence and severity of atherosclerotic carotid artery disease, intracranial stenosis, cardiac disease, venous disease, and/or arterial dissection in the patient's anatomy. For instance, presence and severity of cardiac disease may include information on any heart condition(s), disorders, or irregularities a patient may have, e.g., atrial fibrillation (and left atrial appendage activity), performance of one or more prosthetic heart valves, patent foramen ovale, acute myocardial infarction, and/or left ventricular dysfunction. In one embodiment, step309may include determining blood flow characteristics (e.g., using computational fluid dynamics (or approximation)) based on the patient's medical history, medications, physiologic condition(s), and/or anatomy (e.g., as received from steps301-307). Step309may further include determining a circulatory destination probability of a dislodged embolus (e.g., an embolus dislodged from a location of interest, including the patient's aorta, carotid, or heart) based on the determined blood flow characteristics. In one embodiment, determining the circulatory destination probability, based on an embolus source, may include performing Lagrangian particle tracking. An exemplary computational fluid dynamics analysis for determining blood flow characteristics and circulatory destination probability, is described in the method ofFIG.3C. In one embodiment, step309may further include outputting and/or storing the circulatory destination probability, e.g., to an electronic storage medium or display. In some instances, the circulatory destination probability may be stored such that the probability is associated with the location of interest, wherein the location of interest may be identified as a potential source location for an embolus. Furthermore, step309may include determining location vulnerable to embolism, based on the determined circulatory destination probabilities. FIG.3Bis a flowchart of an exemplary method310of determining and evaluating emboli source locations in a patient's cerebral vasculature, according to an exemplary embodiment. The method ofFIG.3Bmay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step311may include receiving one or more destination locations of interest in the patient's vasculature. For example, for cerebral-related risks (e.g., stroke, TIA, cognitive impairment, and/or postoperative cerebral ischemia), destination locations of interest may include cerebral arteries. In other words, emboli or microemboli presence in cerebral arteries may present risk of stroke, TIA, cognitive impairment, and/or postoperative cerebral ischemia. In one embodiment, step313may include determining stored and/or computed circulatory destination probabilities associated with a received destination location (e.g., of step309). For example, the received destination locations may be identified as locations vulnerable to embolism. In one embodiment, step315may include determining source location(s) associated with a computed circulatory destination probability (e.g., of step313), and thereby associated with a received destination location (e.g., of step311). For example, step315may include retrieving stored embolic sources (e.g., from method300), based on circulatory destination probabilities for the one or more destinations of interest. For example, an embolic source may include one or more locations of interest (e.g., from step307). In one embodiment, step317may include generating various outputs including, for example, destination/vulnerable location(s) (e.g., of step309) and/or source location(s) (e.g., of step315). For example, step317may include outputting a representation including one or more destination probabilities in the patient cerebral artery model. In one case, such a representation of the cerebral artery model may include visual indication (e.g., highlighting) at vulnerable embolism location(s) and/or at embolic source(s) associated with the patient's cerebral or vulnerable embolism location(s). In one embodiment, the output cerebral artery model may be stored in an electronic storage medium. Alternately or in addition, step317may include generating a representation or display showing selected embolic sources. For example, the representation or display may include a user interface for a user (e.g., a health care provider) to select one or more locations and/or embolic sources in the received model of the patient's anatomy or output cerebral artery model. The representation or display may then include numerical or color indicators showing risk of embolism or destination probabilities and/or embolic paths. For example, a representation of an embolic path may include a line indicating at least a portion of the journey of an embolus through the patient's circulatory system as it travels from a source location to a target location in the patient's vasculature. The outputs of step317may be made accessible to physicians evaluating potential treatments to reduce the patient's risk of stroke or TIA. For example, the treatments may include targeted action taken at the identified vulnerable locations. For example, targeted treatments may include actions that may reduce risk of stroke or TIA, including carotid endarterectomy and/or carotid stenting. In such a scenario, the carotid bifurcation may be a vulnerable location. For instance, the carotid bifurcation as an embolic source may produce symptoms of amaurosis fugax (temporary blindness in one eye) if an embolus tracks to the patient's ophthalmic artery branch from the bifurcation. The carotid bifurcation as an embolic source may produce a stroke if the embolus tracks to the middle cerebral artery from the carotid bifurcation. Another preventative treatment for embolism may include treatments for embolism to the toe, which may cause gangrene of the toe. For such cases, an embolus source may include the patient's aortic bifurcation or iliac artery and a treatment may include aortic femoral bypass surgery or iliac stenting, respectively. Additionally or alternatively, step317may include assessing hemodynamic and biomechanical forces acting on a patient's vessels or plaque in the patient's vessels. The forces may include sheer stress, drag, tangential pressure, etc. Such forces, as well as, e.g., the timing, duration, and magnitude of such forces, may be used to stratify risks and/or determine treatment options or recommendations. In other words, levels of risk for a patient may be evaluated as a function of various threshold levels or combinations of hemodynamic force(s) at a location in a patient's vessel, biomechanical force(s) at a location in a patient's vessel, frequency/timing of the force, and/or duration of the force. For example, a magnitude of a hemodynamic or biomechanical force on a plaque may increase a likelihood of an embolus being dislodged. In one scenario, step317may include estimating the likelihood of an embolus being dislodged from a patient's vessel wall, based on whether the magnitude of hemodynamic or biomechanical force at a location of plaque in the patient's vasculature exceeds a threshold magnitude of force, for a given period of time. In one embodiment, step319may include analysis of the output of step317, e.g., associating destination probabilities with various locations in the patient cerebral artery model and effects of emboli presence at the destinations. For example, step319may include outputting a patient risk of stroke, TIA, cognitive impairment, or postoperative cerebral ischemia associated with the computed risk of embolism at one or more locations in the patient cerebral artery model (e.g., based on the destination probability). Alternately or in addition, step319may include calculating and/or displaying a cumulative risk/probability (e.g., of cognitive impairment) over time. For example, step319may include calculating the destination probabilities over a span of time, and then outputting a predicted risk/probability based on the collective calculations (e.g., by repeating the above steps with multiple iterations to simulate the cumulative effects of an ongoing release of microemboli). FIG.3Cis a flowchart of an exemplary method320of determining blood flow characteristics and circulatory destination probability of a dislodged embolus, in order to predict cerebral-related risks and evaluate treatment options associated with the cerebral-related risks, according to an exemplary embodiment. The method ofFIG.3Cmay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step321may include computing a velocity field of blood flow through a portion of the patient's anatomy (e.g., the patient's heart, coronary, cerebral, carotid, and/or aortic arch). Computing the velocity field of blood flow may include solving Navier-Stokes equations computationally under the received patient physiologic conditions. For example, a computational model may include venous circulation as well as arterial circulation. Venous circulation may be modeled by including collapsibility of veins due to the effect of forces external to the body (e.g., gravity, external pressure, etc.) or forces internal to the body (e.g., intra-abdominal and/or intra-thoracic pressure from, for instance, respiration, straining, valsalva, etc.). In one embodiment, step323may include simulating the path of a dislodged embolus through the patient's circulatory system based on the computed velocity field. For example, step323may include virtually injecting particles into the blood flow at the received or identified potential embolic sources (e.g., received or identified carotid stenosis, atheromatous plaque in aorta, and/or heart valves from step315). Step325may include determining a trajectory of one or more of the particles (e.g., by solving the ordinary differential equation of {dot over (x)}(t)=u(x, t); x(t0)=x0using an appropriate numerical method, where u(x, t) is the velocity field and x(t) is the location of particle at time t). The size and number of particles may be determined by non-invasive imaging (e.g., ultrasound) or estimated by the disease severities of embolic sources. In one embodiment, step327may include determining the destination probability of an embolus. For example, step327may include computing the ratio of the number of particles reaching the target cerebral arteries (e.g., of step311) with respect to the total number of released particles. Alternately or in addition, step327may include tracking the path of a single particle traveling through the patient's circulatory system. In one embodiment, step329may include storing the destination probability of the embolus (e.g., to an electronic storage medium and/or RAM). FIGS.4A-4Cdepict exemplary methods of predicting peripheral-related risks and evaluating treatment options associated with the peripheral-related risks, according to an exemplary embodiment. The methods ofFIGS.4A-4Cmay include identifying embolic sources using CFD analysis in conjunction with patient-specific images of peripheral arteries and veins. Identifying the embolic sources in peripheral arteries and veins may help determine treatment to reduce a patient's risk of kidney embolism, pulmonary (e.g., right-sided or venous) embolism, and/or mesenteric or lower extremity embolism. FIG.4Ais a flowchart of an exemplary method400of determining destination(s) in peripheral vessels for an embolus dislodged from a location in patient's vasculature, according to an exemplary embodiment. The method ofFIG.4Amay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, steps401-407may include receiving various information on a patient. Steps401and403may be similar to steps301and303, respectively. For example, step401may include receiving the patient's medical history, including any inherited or acquired hypercoagulable state that may affect thrombotic risk. For instance, patient medical history may include the patient's family medical history, as well as the patient's prior history of deep venous thrombosis or pulmonary embolism, factor V Leiden, cancer, and/or recent trauma or surgery. Step403may include receiving information on medications that the patient may be using that may affect thrombotic risk. Examples of such medications may include: Aspirin, Clopidogrel, Coumadin/Warfarin, Heparin, etc. Step405may include receiving the patient's physiologic conditions and/or a model of the patient's anatomy (e.g., including at least a portion of the patient's circulatory system). The model of the patient's anatomy may include a representation of the patient's aortic arch, coronary, renal, mesenteric, and/or pulmonary and peripheral arteries and veins. Alternately or in addition, the model of the patient's anatomy may include a 3D mesh model (e.g., obtained via segmentation of peripheral, cardiac and/or abdominal CT images) and/or a patient-specific artery model combined with a generic circulatory model (e.g., of a coronary, aortic arch, etc.) based on a population average. Patient physiologic conditions may include, for example: age, sex, blood pressure/heart rate under rest/exercise conditions, physical activity (e.g., exercise intensity), sedentary time per day, obesity, etc. In one embodiment, step407may include receiving one or more locations of interest in the patient's anatomy (e.g., a plaque, pathological area, location of possible vascular shedding, etc.). For example, the locations of interest may be received from an electronic storage medium. Alternately or in addition, step407may include identifying one or more locations of interest in the patient's anatomy. For example, the locations of interest may be identified via invasive and/or noninvasive imaging (e.g., CT, MRI, IVUS, Doppler ultrasound, etc.). In one exemplary case, step407may include identifying the one or more locations of interest by detecting atherosclerotic plaques in a patient's vessel(s). Step407may further include storing the identified location(s) of interest electronically (e.g., via an electronic storage medium, RAM, etc.). Information regarding a location of interest in the patient may include, for example, information on the presence and severity of atherosclerotic carotid artery disease, cardiac disease, venous disease, and/or arterial dissection in the patient's anatomy. For instance, the presence and severity of cardiac disease may include information on any heart condition(s), disorders, or irregularities a patient may have, e.g., atrial fibrillation (and/or left atrial appendage activity), performance of one or more prosthetic heart valves, patent foramen ovale, acute myocardial infarction, and/or left ventricular dysfunction. In one embodiment, step409may include determining blood flow characteristics (e.g., using a computational fluid dynamics simulation and/or approximation). Step409may further include determining a circulatory destination probability of a dislodged embolus (e.g., an embolus dislodged from a culprit embolic source, including the patient's aorta, carotid, or heart). In one embodiment, determining the circulatory destination probability, based on an embolus source, may include performing Lagrangian particle tracking. An exemplary computational fluid dynamics analysis for determining blood flow characteristics and circulatory destination probability, is described in the method ofFIG.4C. In one embodiment, step409may further include outputting and/or storing the circulatory destination probability, e.g., to an electronic storage medium or display. In some instances, the circulatory destination probability may be stored such that the probability is associated with the location of interest, wherein the location of interest may be identified as a potential culprit embolus source. Furthermore, step409may include determining locations vulnerable to embolism, based on the determined circulatory destination probabilities. FIG.4Bis a flowchart of an exemplary method410of determining and evaluating source locations of embolism in a patient's peripheral vasculature, according to an exemplary embodiment. The method ofFIG.4Bmay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step411may include receiving one or more destination locations of interest in the patient's vasculature. For example, for peripheral-related risks (e.g., kidney embolism, pulmonary (e.g., right-sided or venous) embolism, and/or mesenteric or lower extremity embolism), destination locations of interest may include one or more pulmonary, renal, peripheral, or femoral arteries. In other words, emboli presence in the pulmonary, renal, or femoral arteries may present risk of pulmonary (e.g., right-sided or venous) embolism, kidney embolism, lower extremity embolism, and/or mesenteric embolism, respectively. In one embodiment, step413may include determining stored and/or computed circulatory destination probabilities associated with a received destination location (e.g., of step409). For example, the received destination locations may be identified as locations vulnerable to embolism. In one embodiment, step415may include determining source location(s) associated with a determined circulatory destination probability (e.g., of step413), and thereby associated with a received destination location (e.g., of step411). For example, step415may include retrieving stored embolic sources (e.g., from method400), based on circulatory destination probabilities for the one or more destinations of interest. For example, an embolic source may include one or more of the one or more locations of interest (e.g., from step407). In one embodiment, step417may include generating various outputs including, for example, destination/vulnerable location(s) (e.g., of step411) and/or source location(s) (e.g., of step415). For example, step417may include outputting a representation including one or more destination probabilities and/or embolic paths in a patient artery model. In one case, such a representation of the artery model may include visual indication (e.g., highlighting) at vulnerable embolism location(s) and/or at embolic source(s) associated with the patient's vulnerable embolism location(s). In one embodiment, the representation including the artery model may be stored to an electronic storage medium. Alternately or in addition, step417may include generating a representation or display showing selected location(s) of embolic sources. For example, the representation or display may include a user interface for a user (e.g., a health care provider) to select one or more locations and/or embolic sources in the received model of the patient's artery model or the representation of the artery model. The representation or display may then include numerical or color indicators showing risk of embolism or destination probabilities. The outputs of step417may be made accessible to physicians evaluating potential treatments to reduce the risk or number of pulmonary, kidney, mesenteric, or lower extremity embolisms. In one embodiment, step419may include analysis of the output of step417, e.g., associating destination probabilities with various locations in the patient artery model and effects of emboli presence at the destinations. For example, step419may include outputting a patient risk of pulmonary, kidney, mesenteric, or lower extremity embolisms, based on the computed risk of embolism at one or more locations in the patient artery model. FIG.4Cis a flowchart of an exemplary method420of determining blood flow characteristics and circulatory destination probability of a dislodged embolus for peripheral-related risks, according to an exemplary embodiment. The method ofFIG.4Cmay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step421may include computing a velocity field of blood flow in the patient's anatomy (e.g., the patient's heart, coronary, cerebral, carotid, and aortic arch). Computing the velocity field of blood flow may include computationally solving Navier-Stokes equations under the received patient physiologic conditions. For example, a computational model may include venous circulation as well as arterial circulation. Venous circulation may be modeled by including collapsibility of veins due to the effect of external forces (e.g., gravity, external pressure, etc.). In one embodiment, step423may include simulating the path of a dislodged embolus through the patient's circulatory system based on the computed velocity field. For example, step423may include may include injecting particles virtually in the received or identified potential embolic sources (e.g., received or identified femoral veins, atheromatous plaque in aorta, and/or heart valves from step415). Step425may include determining a trajectory of particles (e.g., by solving the ordinary differential equation of {dot over (x)}(t)=u(x, t); x(t0=x0using an appropriate numerical method, where u(x, t) is the velocity field and x(t) is the location of particle at time t). The size and number of particles may be determined by non-invasive imaging (e.g., ultrasound) or estimated by the disease severities of embolic sources. Step427may include determining the destination probability of an embolus (e.g., by computing the ratio of the number of particles reaching target pulmonary, renal, or femoral arteries (e.g., of step411) with respect to the total number of released particles). Step429may include storing the destination probability of the embolus (e.g., to an electronic storage medium and/or RAM). FIG.5Ais a flowchart of an exemplary method500of assessing or assigning a risk of potential emboli dislodgement associated with an invasive procedure, according to an exemplary embodiment. The method ofFIG.5Amay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101.FIGS.5A-5Cmay include evaluating a risk of embolism that may be associated with one or more invasive procedures. Emboli may be dislodged during invasive procedures, including endovascular procedures (e.g., angiography, stenting procedures, transcatheter valve procedures (e.g., transcatheter aortic valve implantation (TAVI)), and/or revascularization of coronary, carotid, and/or peripheral arteries. For example, method500may include providing a probability of emboli dislodgement from potential embolic sources, along the trajectory of invasive procedures. In one embodiment, steps501-507A may include receiving various information on a patient. Steps501may be similar to steps301and401, and step503may be similar to steps303and403. For example, step501may include receiving the patient's medical history, including any inherited or acquired hypercoagulable state that may affect thrombotic risk. For instance, patient medical history may include the patient's family medical history, as well as the patient's prior history of deep venous thrombosis or pulmonary embolism, factor V Leiden, cancer, and/or recent trauma or surgery. Step503may include receiving information on medications that the patient may be using that may affect thrombotic risk. Examples of such medications may include: Aspirin, Clopidogrel, Coumadin/Warfarin, Heparin, etc. In one embodiment, step505may include receiving the patient's physiologic conditions and/or a model of the patient's anatomy (e.g., including at least a portion of the patient's circulatory system). The model of the patient's anatomy may include a representation of the patient's aortic arch, coronary, carotid, and/or cerebral arteries and veins. Alternately or in addition, the model of the patient's anatomy may include a 3D mesh model (e.g., obtained via segmentation of cardiac and/or head CT images) and/or a patient-specific artery model combined with a generic circulatory model (e.g., of a coronary, aortic arch, etc.) based on a population average. Patient physiologic conditions may include, for example: age, sex, blood pressure/heart rate under rest/exercise conditions, physical activity (e.g., exercise intensity), sedentary time per day, obesity, etc. Further data on patient information or modeling the patient's anatomy/physical state may include any data on extrinsic forces and/or conditions that may act on an area of interest of the patient's body, including body position (e.g., supine, standing, standing on head, flexion, extension, etc.) and/or extreme conditions (e.g., acceleration or deceleration, sporting conditions, g-forces, deep diving, valsalva, shoveling snow, pregnancy, etc.). Any extrinsic forces that may affect the circulatory system may be taken into account for step505, since any of these factors may be a triggering event for an embolus. In one embodiment, step507A may include receiving one or more locations of interest in the patient's anatomy (e.g., a plaque, pathological area, location of possible vascular shedding, etc.). For example, the locations of interest may be received from an electronic storage medium. Alternately or in addition, step507A may include identifying one or more locations of interest in the patient's anatomy. For example, the locations of interest may be identified via invasive and/or noninvasive imaging (e.g., CT, MRI, IVUS, Doppler ultrasound, etc.). In one exemplary case, step507A may include identifying the one or more locations of interest by detecting atherosclerotic plaques in a patient's vessel(s). Identified location(s) of interest may be stored electronically (e.g., via an electronic storage medium, RAM, etc.). Information about a location of interest in the patient may include, for example, information on the presence and/or severity of atherosclerotic carotid artery disease, intracranial stenosis, cardiac disease, venous disease, and/or arterial dissection in the patient's anatomy. For instance, presence and severity of cardiac disease may include information on any heart condition(s), disorder(s), or irregularities a patient may have, e.g., atrial fibrillation (and/or left atrial appendage activity), performance of one or more prosthetic heart valves, patent foramen ovale, acute myocardial infarction, and/or left ventricular dysfunction. In one embodiment, step507B may include determining a potential trajectory of an invasive procedure in the model of the patient's anatomy. The potential trajectory may be determined, based on the one or more received and/or identified locations of interest (of step507A). Exemplary trajectories may include guide-wire, catheter, or pressure wire trajectories along a superficial femoral artery, aortic arch, etc. In one embodiment, step509may include determining blood flow characteristics (e.g., using computational fluid dynamics (or approximation)). Step509may further include determining a circulatory destination probability of a dislodged embolus, e.g., an embolus dislodged from a culprit embolic source along the trajectory of the invasive procedure (e.g., from step507B). In one embodiment, determining the circulatory destination probability, based on an embolus source, may include performing Lagrangian particle tracking. An exemplary computational fluid dynamics analysis for determining blood flow characteristics and circulatory destination probability is described in the method ofFIG.5C. In one embodiment, step509may further include outputting and/or storing the circulatory destination probability, e.g., to an electronic storage medium or display. In some instances, the circulatory destination probability may be stored such that the probability is associated with the location of interest, wherein the location of interest may be identified as a potential source location for an embolus. Furthermore, step509may include determining locations vulnerable to embolism, based on the determined circulatory destination probabilities. FIG.5Bis a block diagram of an exemplary method510of determining and evaluating source locations of embolism associated with invasive procedures, according to an exemplary embodiment. The method ofFIG.5Bmay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step511may include receiving one or more destination locations of interest in the patient's vasculature. For example, destination locations of interest for cerebral-related risks (e.g., stroke, TIA, cognitive impairment, or postoperative cerebral ischemia) may include one or more cerebral arteries. For peripheral-related risks (e.g., kidney embolism, pulmonary (e.g., right-sided or venous) embolism, and/or mesenteric or lower extremity embolism), destination locations of interest may include one or more pulmonary, renal, peripheral, or femoral arteries. In one embodiment, step513may include determining stored and/or computed circulatory destination probabilities associated with a received destination location (e.g., of step509). For example, the received destination locations may be identified as locations vulnerable to embolism. In one embodiment, step515may include determining source location(s) associated with a computed circulatory destination probability (e.g., of step513), and thereby associated with a received destination location (e.g., of step515). For example, step515may include retrieving stored embolic sources (e.g., from method500), based on circulatory destination probabilities for the one or more destinations of interest. For example, an embolic source may include one or more of the one or more locations of interest (e.g., from step507A). In one embodiment, step515may involve determining associations between the computed destination probabilities and embolic sources located along a trajectory of the invasive procedure (e.g., from step507B). For example, step515may include finding or identifying, of the embolic sources associated with the computed destination probabilities from step509, a subset of embolic sources that may be located along one or more trajectories of the invasive procedure from step507B. In one embodiment, step517may include generating various outputs including, for example, destination/vulnerable location(s) (e.g., of step509) and/or source location(s) (e.g., of step515). For example, step517may include outputting a representation including one or more destination probabilities in a patient artery model. In one case, such a representation of the artery model may include a visual indication (e.g., highlighting) at one or more trajectories of an invasive procedure, at vulnerable embolism location(s), at possible locations along an embolus's path through the patient's circulatory system, and/or at embolic source(s) associated with the patient's cerebral or vulnerable embolism location(s). In one embodiment, the representation including the artery model may be stored to an electronic storage medium. Alternately or in addition, step517may include generating a representation or display showing selected location(s) of embolic sources. For example, the representation or display may include a user interface for a user (e.g., a health care provider) to compare the efficacy of one or more potential treatments in reducing risk associated with invasive procedures. The representation or display may then include numerical or color indicators showing risk of embolism or destination probabilities. The outputs of step517may be made accessible to physicians evaluating potential treatments to reduce the risk or number of embolisms resulting from invasive procedures. In one embodiment, step519may include analysis of the output of step517, e.g., associating destination probabilities with various locations in the patient artery model and effects of emboli presence at the destinations. For example, step519may include outputting a patient risk of emboli dislodgement and/or harmful emboli dislodgement that may occur as a result of an invasive procedure performed on the patient's vasculature. Alternately or in addition, step519may include outputting a patient risk of embolism(s) and/or harmful embolism(s) that may occur as a result of an invasive procedure performed on the patient's vasculature. Step519may include generating a recommendation regarding the one or more potential treatments for reducing risk associated with invasive procedures. FIG.5Cis a flowchart of an exemplary method520of determining blood flow characteristics and circulatory destination probability of a dislodged embolus related to invasive procedures, according to an exemplary embodiment. The method ofFIG.5Cmay be performed by server systems106, based on information, images, and data received from physicians102and/or third party providers104over electronic network101. In one embodiment, step521may include computing a velocity field of blood flow in the patient's anatomy (e.g., the patient's heart, coronary, cerebral, carotid, renal, femoral, and/or aortic arch). Computing the velocity field of blood flow may include computationally solving Navier-Stokes equations under the received patient physiologic conditions. For example, a computational model may include venous circulation as well as arterial circulation. Venous circulation may be modeled by including collapsibility of veins due to the effect of external forces (e.g., gravity, external pressure, etc.). In one embodiment, step523may include simulating the path of a dislodged embolus through the patient's circulatory system based on the computed velocity field. For example, step523may include injecting particles virtually in the received or identified potential embolic sources (e.g., received or identified carotid stenosis, atheromatous plaque in aorta, heart valves, etc. from step515). In one embodiment, step525may include determining the trajectory of particles (e.g., by solving the ordinary differential equation of {dot over (x)}(t)=u(x, t); x(t0)=x0using an appropriate numerical method, where u(x, t) is the velocity field and x(t) is the location of particle at time t). The size and number of particles may be determined by non-invasive imaging (e.g., ultrasound) or estimated by the disease severities of embolic sources. In one embodiment, step527may include determining the destination probability of an embolus (e.g., by computing the ratio of the number of particles reaching the target cerebral or peripheral arteries with respect to the total number of released particles). Step529may include storing the probability of the destination (e.g., to an electronic storage medium and/or RAM). Embolisms may form from emboli originating from various sources in a patient's vasculature and various factors contributing to the patient's blood flow. The present disclosure includes systems and methods for predicting embolisms based on a circulatory destination probability of an embolus traveling through a patient's bloodstream. At the same time, the systems and methods provide determinations of the level of harm introduced by an embolism traveling through a patient's bloodstream. Accordingly, the disclosed systems and methods may provide patient risk assessments and treatment plans related to embolisms, based on circulatory destination probabilities of emboli. Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims. | 58,809 |
11862343 | DETAILED DESCRIPTION OF THE INVENTION The Medication Risk Mitigation (MRM) system of the instant invention applies an array of evidenced-based components and numerous personalized components (e.g., pharmacogenomics, renal function, etc.) to enhance medication safety by individualizing a medication care plan. The system of the instant invention also invokes an assortment of patient-specific interventions to measurably improve medication adherence. The system of the instant invention utilizes a computer program product comprising a non-transitory computer readable medium having program instructions stored in a memory device, the instructions executable by a processor to direct the performance of operations for the management of a regimen for a patient's use of prescribed medication. This MRM process distinctively integrates a medication decision support web/cloud MRM platform with pharmacists and prescribers in order to minimize the pandemic of medication-related morbidity and mortality, while decreasing the rate and alarming cost of medication-induced problems. Advantageously, the instant invention reduces ER visits and hospitalizations, with accompanying improvements in quality of life, medication concordance and adherence. The system of the instant invention is scalable to meet global implementation. The MRM system of the instant invention provides prospective, concurrent and retrospective interventions, as each are described below. A. Prospective Intervention The prospective intervention occurs when a physician, for example, prescribes one or more drugs using an integrated web/cloud system. At the point a physician prescribes a medication, the system of the instant invention automatically presents those intrinsic and extrinsic components that are indicated with each requested medication. Each indicated component is presented for the new medication, along with the aggregated impact for the complete medication profile. Based on the alert output of the system of the instant invention, a prescribing physician is benefited by information permitting the physician to make informed decisions regarding any necessary changes to the prescription. Once the prescription entry process is completed, the indicated components persist on the medication profile throughout the life of the prescription. The components are dynamic in that new components can be added or updated to the current components and can be incorporated with an automatic, retrospective analysis of the current medication profile. Data attribution and data stores drive the triggering of the said alerts of the instant invention. The system of the instant invention includes a front-end application for managing various intrinsic and extrinsic components for each medication input into the system. A database of the instant invention assigns attribution to specific medications for both extrinsic and intrinsic components. Such extrinsic and intrinsic components are used as the data sources for triggering the said alerts, along with supplying data to other aspects of the instant invention. Intrinsic components include, by way of non-limiting example:a. Lab test results for an individual patient;b. concomitant medications prescribed to an individual patient;c. documented medication allergies for a particular patient;d. pharmacogenomic data for a particular patient based on medication metabolizing isoenzymes and transporters; ande. medication adherence information for an individual patient Next, the system of the instant invention checks for known complications of a particular medication or particular combination of concomitant medications based on the available inputs, along with complications based on extrinsic components which include, but are not limited to:a. Beers listed medications;b. GCN Sequence Number;c. RxCUID (RxNorm);d. NDC;e. medication name;f. START/STOPP criteria;g. black-box FDA warnings;h. CNS sedative burdens; andi. aggregated Anticholinergic Cognitive Burden B. Concurrent Intervention Once a prescriber finishes prescribing the medication, the medication requests are received electronically by a participating pharmacist, via secure instant messaging by way of programmed computers or handheld devices via the internet according to one embodiment of the invention. The participating pharmacist then reviews the patient's medication profile, as well as pertinent lab test results, and applies the instant invention to evaluate the aforementioned extrinsic and intrinsic components. By combining the components with pharmacotherapy best practices, a targeted risk assessment is completed. Potential identified preventable medication-related problems are communicated back to the prescriber using, according to one embodiment of the invention, a secure instant messaging system, including recommendations from the pharmacist to the prescriber. There are specific utilities for applying the concurrent intervention, even though the same MRM components are applied in each step. A prescriber at the prospective intervention may neglect to apply the components or be uncertain as to the importance of a given component, such as an unfamiliarity with a particular pharmacogenomic contraindication. Advantageously, a concurrent intervention by a pharmacist permits a second review of the same information in order to reduce the likelihood of missing a particular fact. Additionally, a pharmacist may also have specific knowledge of competitive receptor pharmacogenomics that a prescribing physician may lack. In one embodiment, a pharmacist may also have knowledge regarding drugs a patient is taking that may not be known by the prescriber. Next, the prescriber can optionally respond back to the pharmacist with information that may necessitate a modification of a given prescription based on the aforementioned analysis. This response is made using the same secure instant messaging system, according to one embodiment of the instant invention. In a preferred embodiment, recommendations for medication modifications are accompanied by a structured risk mitigation interface that allows for prescribers to automatically propagate medication changes to a patient's profile upon accepting the recommendations. C. Retrospective Intervention The instant invention is also evoked every six months (or upon need or the change or addition of any input into the system, such as a new patient lab result or updated extrinsic component) by a participating pharmacist as he/she performs a semi-annual comprehensive medication review. This triggers a report containing MRM recommendations to the prescriber via the instant invention's secure instant messaging system, according to one embodiment. Recommendations can include medication dosage modifications, medication substitution recommendations and cessation of medication. Recommendations are based on the instant invention's aforementioned application of extrinsic and intrinsic components—whereby all of which may be updated dynamically using the instant invention as new patient tests are performed or new medical information becomes available, for example. Such additional data includes, among other things, adherence and concordance information, medication overutilization calculators and lab values to assess an overall hospitalization, fall or other medication misadventuring risk to a patient at a given point in time. Upon reviewing and accepting the recommended MRM strategies, prescribers can manually (and, in a preferred embodiment, automatically by way of the aforementioned structured risk mitigation interface) propagate medication changes and monitoring parameters for tracking, trending and reporting purposes against the established targeted outcomes (namely, reductions in hospitalizations, falls and medication misadventures). In another embodiment, the system of the instant invention provides prescribers and pharmacists with an application that allows for the analysis of a prospective medication regimen change in the form of either a new or a replacement therapy. This analysis demonstrates the projected impact of proposed medication changes against the current risk profile of the patient's medication regimen in the context of the extrinsic and intrinsic components. Predictive modeling is based on the weighted correlation of the targeted outcomes (i.e. reductions in hospitalizations, falls and medication misadventuring) against various medication and patient characteristics (both intrinsic and extrinsic). In one embodiment of the instant invention, a plurality of pharmacists and/or a plurality of prescribers all treating the same patient all share access to the system of the instant invention by means of access to a cloud-based computer system. By way of further illustration, the system of the instant invention aggregates and presents the various alerts based on the aforementioned triggers. The pharmacist interprets the array of results, using other patient-specific parameters (e.g., kidney function trend, liver function trend, age, medication use history and incidence of Adverse Medication Events, etc.), and provides educated guidance on medication therapy regimen choices in the form of a human generated report. Turning to the figures, there is shown inFIG.1a diagram of the prospective intervention process, generally indicated by reference numeral10. At step20, a prescription is made by a prescribing physician (or other health care provider licensed to write prescriptions) participating in the system of the instant invention. The prescription is transmitted via a computer network to a clinical query engine30. The clinical query engine30receives input from one or more databases35. In a preferred embodiment, the databases35include information containing information on clinical drugs, a storage database for records generated through the system of the instant invention, medical records for individual patients, including prescriptions, lab results and patient records, along with any medical histories for patients that may come from third parties. The databases35include all of the extrinsic and intrinsic data that are collected pursuant to the instant invention. Based on any of the above-mentioned indications or contraindications, one or more alerts40may be issued. Based on the alert40, the prescriber may consider whether it is necessary to make a modification to his or her prescription at step50. If a modification is determined by the prescriber to be necessary, the system of the instant invention presents prescription alternatives that are known in the art at step60which, when selected by the prescriber according to the computer drive process of the instant invention at step70, the process returns to consider the new medicine selection with the clinical query engine30and proceeds thereafter in the manner herein described. Had the prescriber elected to bypass step50or in the circumstance where there was no alert40or step50, then the system of the instant invention would commit the medication to a patient's profile80(which would be stored in a database35). Turning to the concurrent intervention process depicted inFIG.2and generally identified by reference number85, once the medication is committed to a patient's profile80(as depicted inFIG.1), the system of the instant invention generates a computer delivered notification90that alerts a pharmacist using the system of the instant invention of a pending new prescription. At this point, the concurrent review begins. A pharmacist reviews the prescription at step100. The pharmacist reviews any alerts40that are generated by the clinical query engine30and also applies his or her knowledge of pharmacotherapy best practices100in order to facilitate his or her review of the prescription. Based on the pharmacist's review, he or she must determine whether or not to request a medication change from the prescriber at step110. If no change is needed, the pharmacist will submit the prescription to the pharmacy to be dispensed at step120. However, if the pharmacist desires to request a medication modification, the system of the instant invention provides a secure computer facilitated electronic message from the pharmacist to the prescriber at step130. The computer facilitated electronic message may take the form of a user-generated message or, in an alternative embodiment, it may take the form of a computer form with system generated fields for messages to be standardized according to industry practice. The prescriber then considers whether to accept or reject the suggested medication recommendation(s) at step135. Upon reviewing the recommendations generated at step130, a prescriber may reject the proposed medication modification, in which case the process proceeds to step120. Alternatively, if the prescription is modified, then the system reverts to step60fromFIG.1(which is reproduced inFIG.2) where the system of the instant invention presents alternative prescription options that a prescriber selects at step70fromFIG.1(which is reproduced inFIG.2), which loops the system back to the clinical query engine30fromFIG.1(which is reproduced inFIG.2) and the process continues accordingly, as depicted inFIG.1. Turning now toFIG.3, there is shown a diagram of the retrospective review, generally indicated by reference numeral200. This process begins when a new patient is admitted to a health care facility utilizing the system of the instant invention, automatically every six months, or upon request based on a fall, recent hospitalization or otherwise, as shown in step210. Once one of the aforementioned triggering conditions is met, an intervention is initiated at step330. The system of the instant invention utilizes the clinical query engine30(depicted inFIG.1) in order to produce a computer generated report at step340. Here, additional records350contain data that may have been added over time to one of the databases35(depicted inFIG.1). Such records350may contain clinical analytics and calculators, MRM components (such as the intrinsic and extrinsic components listed above), medication adherence and concordance analysis, lab results and intrinsic assessments, along with written records reflecting pharmacotherapy best practices. Over time, certain trends in lab results, for example, may present opportunities for medication modification that were not apparent at the prospective or concurrent stages. Based on this review, a pharmacist may recommend medication changes, identify monitoring parameters, establish clinical milestones or predict outcomes and risks. Each such action is recorded in a databases35(as shown inFIG.1) of the system of the instant invention at step360. The pharmacist then prepares a report370which is recorded in a databases35(as shown inFIG.1) of the system of the instant invention, which may include a medication change request determination at step375. If a medication change request is made, a secure message (of the type previously discussed) is sent to the participating prescriber at step380. Here, the prescriber can decide at step385whether to accept or reject to the proposed modification by following the procedure beginning at step135inFIG.2. If the recommendation is rejected, then the system of the instant invention documents the transaction and reverts to the previous medical regimen parameters at step390. Afterwards, the system of the instant invention locks the monitoring parameters and the targeted outcomes at step400. At step400, the system of the instant invention permits visibility into metrics in order to determine whether anticipated benefits from previous changes were actually realized. For example, a prescription could be modified to reduce cognitive burdens and reduce the frequency of falls. The system of the instant invention, therefore, permits the frequency of falls to be tracked over time after the said modification was made in order to determine whether it was effective in achieving the desired ends. These results are displayed by the system of the instant invention in the form of a pharmacist's system generated report at step500. In turn, ongoing medication management occurs at step510until the next trigger event210occurs. However, if the prescriber decided at step385to accept a proposed medication modification, then the system of the instant invention would present the prescriber with the opportunity to make a medication modification in the manner herein previously described, as shown at step520. Once a modification is made, the system of the instant invention reverts to the instantiation of the clinical query engine30inFIG.1and proceeds thereafter in the manner described herein. Furthermore, if a pharmacist decided that a medication change was not recommended at step375, then the system of the instant invention would proceed to step400. FIG.4depicts the decision support and predictive clinical outcomes component of the instant invention, as generally identified by reference numeral600. A physician or pharmacist may use the system of the instant invention to view a MRM dashboard610. Here, a report620for a given patient can be reviewed in order to visualize risk profiles and weighted risk factors. Weighted risk profiles include each of the aggregated risk factors, number of medications being taken concurrently, duration of therapy of the existing medications, drug allergies, patient demographics, documented lab results and lab results trending (e.g. INR, CrCl, BMI, etc.). Risk factors incorporated into the weighted risk profiles include aACB score, Sedative burden, drug metabolism pathway, drug-drug interactions, drug-gene interactions and published drug guidelines (e.g. Beers List, FDA Black Box warnings). For example, the system of the instant invention permits an operator to input additional personalized risk factors into the system of the instant invention at step630which are then analyzed using the system of the instant invention at step640as data is captured and the volume of clinical information grows, the risk profile and weighted risk factors are refined due to the model establishing greater correlation between targeted outcomes and patient markers (e.g. demographic characteristics, intrinsic attributes, current medications). Based on this analysis, it is possible to hypothetically model the impact of proposed medication modifications using the system of the instant invention with report650. If any changes to the medication profile are warranted, then they may be implemented in the manner herein previously described. | 18,619 |
11862345 | DETAILED DESCRIPTION Disclosed herein are techniques for performing segment analysis of patients data to identify relationships between different characteristics of the patients data and treatment metrics. A model of influences of the different categories of the patients data on the treatment metrics can be created. The model can be used for various applications such as, for example, improving clinical decision making, medical resource management, etc. More specifically, patient data of a plurality of patients can be obtained. The patients may have contracted a common illness (e.g., sepsis), have received medical treatments for the illness, and have since recovered. The patient data of each patient may include characteristics data and treatment administration data of the each patient, as well as metrics data related to the medical treatments. The characteristics data and the treatment administration data may be associated with a plurality of categories including, for example, demographic data, locale, the diagnosis results of the patient, medical provider information, etc. The metrics data may include, for example, a length of hospitalization (LOH) of the patient for the medical treatment, cost, and other metrics to evaluate the quality of the medical treatment (e.g., recurrence of the illness, etc.). The characteristics data and the treatment administration data of each patient can be used to compute a patient features vector for the patient. A patient features vector of a patient may represent a plurality of features, with each feature corresponding to a category of data of the characteristics data and treatment administration data of a patient. The patient features vectors of the plurality of patients can be computed from the patient data. Unsupervised machine learning techniques can be applied to divide the patient features vectors into clusters. For example, a two-stage clustering processing can be performed on the patient features vectors. Specifically, the patient features vectors can be clustered into a first set of first clusters. A cluster features vector may be computed for each first cluster of the first set of first clusters to represent a distribution for each of the plurality of data categories. The cluster features vectors, which represent the first set of first clusters of patient characteristics data and treatment administration data, can be further clustered into a second set of second clusters. Through the two-stage clustering, the patient data can be clustered into the second set of second clusters. The patient data in each second cluster of the second set of second clusters can be further processed using supervised machine learning techniques, such as regression, to determine a treatment metric model representing a relationship between each patient feature and the treatment metrics. The treatment metric model can be used to, for example, process second patient data of a new patient to generate a clinical decision for the new patient (e.g., length of hospitalization, which hospital to receive the treatment, etc.), to perform medical resource management to improve the treatment metrics, etc. The two-stage clustering techniques can reduce the computation time and resource needed to generate the treatment metric model. Specifically, performing a regression analysis directly on a large volume of patients data can be very computation-intensive. In contrast, the two-stage clustering provides a divide-and-conquer approach where the patients data having certain degree of similarities are divided into clusters, and then a treatment metric model is created for each cluster. As the volume of patients data involved in creation of each treatment metric model is reduced, the computation resource and time required for the creation of the metric model can be reduced. In addition, the two-stage clustering process can also generate a discriminative set of clusters using reduced computation time and resource. Specifically, the patients data can be encoded into patients features vectors using one-hot encoding scheme to become more compact and require fewer computation time and resource for processing. Cosine distance clustering can be performed on the one-hot encoded patients features vectors to generate a first set of first clusters. A cluster features vector may be computed for each cluster of the first set of first clusters to represent a distribution for each of the data categories in the cluster, and K-means clustering (based on Euclidean distance) can be performed on the cluster features vectors to generate a second set of second clusters. While K-means clustering typically can provide a more discriminative set of clusters, applying K-means clustering directly on all the patients data can also be very computation-intensive. With the two-stage clustering process, K-means clustering is performed on the cluster features vectors (which represents the patients data in a condensed form) with reduced computation resource and time. The two-stage clustering process also allow more patients data to be included in the clustering process and the subsequent treatment metric model generation, which can further improve the treatment metric models as well as the clinical decisions made based on these models. I. Treatment Metric Modelling Based on Segment Analysis of Patient Data FIG.1is an example flow diagram100of a method for generating treatment metrics to support a clinical and/or resource management decision, whereasFIG.2illustrates a flow diagram200of an improved method for generating the treatment metrics for the decisions. A treatment metric model can be used to predict a treatment metric for a particular administration of a treatment. Treatment metrics can measure various aspects of the medical treatments received by patients for an illness, such as length of hospitalization (LOH), recurrence of the illness, cost, etc. A treatment metric for an illness may be impacted by various factors, such as the treatment method, the provider of the treatment, etc. InFIG.1, treatment metric model102may define relationships that quantify the impacts of these factors on a treatment metric. To generate treatment metric model102, such as a model that defines length of hospitalization (LOH), cost, etc. for a sepsis patient, patients data104of patients who have received a treatment for sepsis can be collected. Patients data104may include treatment administration data106, which may include information about prior treatment decisions including, for example, the treatments the patients have received, the providers of those treatments, etc. Patients data104may also include treatment metric data108(e.g., length of hospitalization, cost, etc.) for those treatments. A relationship between treatment administration data106and treatment metric data108can be determined. Treatment metric model102can model the impacts of various treatment decisions (as reflected in treatment administration data106) on treatment metric data108based on the relationship. Treatment metric model102can be used to support different applications to improve the quality of care and reduce economic burden on the patients, such as supporting a clinical decision120for a new patient, supporting a resource management decision130, etc. For example, a clinical decision120can be made to select (and provide) a treatment method for the new patient, to select a provider of the treatment, etc. The decision can be driven by a treatment metric of the treatment and/or the provider using treatment metric model102. For example, a treatment method provided by a specific provider can be selected based on the treatment metrics (e.g., low LOH, low cost, etc.) of the treatment method and the provider according to treatment metric model102. A resource management decision130can be made to determine what resource is to be allocated to a provider of treatment, and the determination can be driven by a treatment metric of the provider provided by treatment metric model102. For example, if the provider has a much worse metric (e.g., a longer LOH, a higher cost, etc.) than other providers when providing a treatment method according to the metric, resources can be allocated to that provider (e.g., to improve training of the staff) to improve its operations in providing the treatment method. Although treatment metric model102can provide insight into certain factors related to the treatment history, treatment metric model102does not take into account other factors, such as patients characteristics, which can affect the relevancy of treatment metric model102to individual patients for clinical decision making. For example, the demographic data of a patient (e.g., age, gender, race, locale, etc.), as well as diagnosis data of the patient prior to and during the treatments, may also affect the treatment metric for that patient. As an illustrative example, patients in different age groups, having different initial diagnoses, etc., may have different responses to the same medical treatment provided by the same provider, which can lead to different treatment metrics for the patients (e.g., different LOH, different costs, etc.). In addition, there can be hidden factors that influence the length of hospitalization, the choice and location of treatment, etc. and the biases are unrelated to the severity of the disease or the quality of care provided to the patients but can be related to other patient characteristics. A clinical decision made without taking into account the patients characteristics and these hidden factors can degrade the treatment metric for the treatment, as well as the quality of care, provided to the patients. Moreover, a resource management decision that fails to take into account these hidden factors can also lead to inefficient utilization of resources without improving the quality of care provided to the patients. FIG.2illustrates flow diagram200of an improved method for generating treatment metrics to support a clinical and/or resource management decision. As shown inFIG.2, a plurality of treatment metric models201, including treatment metric model201aand201b, can be determined from patients data204. As shown inFIG.2, patients data204include, in addition to treatment administration data106and treatment metric data108, patients characteristics data202. Patients characteristics data202can include various characteristics data of the patients including, for example, demographic data205and diagnosis data206of the patients. Patients data204can be processed using supervised machine learning techniques to determine the relationships between a treatment metric (e.g., LOH) and various treatment decisions and patients characteristics. One example of supervised machine learning techniques may include regression analysis208, such as partial least square regression (PLSR), linear regression, etc. In data regression, the known associations among the treatment metrics data set, the treatment decisions data set, and patients' characteristics data set, as reflected in patients data204, can be considered ground truth. Through an interactive data regression process, a function describing a relationship among the treatment metrics, the treatment decisions, and patients characteristics that fits (within certain tolerance) among the known associations between the data sets can be determined. Although regression analysis208can be performed on patients data204directly, such an approach can be very computation-intensive especially when patients data204comprise data of a large patient population, which can result in a large and diverse set of patients characteristics data202. Specifically, the interactive data regression process may involve determining and adjusting the model parameters to fit the patients data. The computation time and resource involved can become prohibitively large as more patients data are used to determine the treatment metric model. On the other hand, maximizing the amount of patients data involved in the regression analysis allows the treatment metric model to cover more associations among the treatment metrics data set, the treatment decisions data set, and patients' characteristics data set, so that the treatment metric model is more likely to generate a metric that is relevant to a patient. To reduce the computation time/resource involved in the regression analysis, the patients can be divided into different patient clusters or segments, and then a regression analysis can be performed on the patients data for each cluster of patients to generate a treatment metric model. A new patient can then be classified into one of the patient cluster, and the treatment metric model of that cluster can be used to determine the treatment metrics for the new patient. Specifically, referring toFIG.2, a segment analysis210can be performed on patients characteristics data202and treatment administration data106to divide the data (and the patients represented by the data) into clusters that exhibits a certain degree of similarity. The division of patients data204into clusters can reduce the volume and non-uniformity of data to be processed by regression analysis208, both of which can reduce the complexity of the regression analysis. Regression analysis208can be performed on each segment of patients data204to determine a treatment metric model associated with the segment. For example, treatment metric model201acan be determined from segment210of patients data204, whereas treatment metric model201bcan be determined from segment212of patients data204. One treatment metric model can be selected from treatment metric models201aor201bto generate a clinical decision for a new patient, a medical resource management decision for a hospital, etc., based on matching the characteristics of the new patient and/or the hospital with the segments of patients characteristics data202and treatment administration data106. II. A Two-Stage Clustering Process There are various challenges associated with performing segment analysis on a large volume of patients data204. For example, supervised learning techniques are unsuitable for segment analysis208, given that very little is known about the similarities (or differences) among patients characteristics data202and treatment administration data106of each patient. Further, there is no ground truth that can be relied upon as criteria for dividing patients data204. Therefore, unsupervised learning techniques, such as clustering, may be employed to learn (e.g., measure) the similarities among patients characteristics data202and treatment administration data106of each patient, and to group the patients according to the similarity measurements into clusters. One big challenge with clustering is to determine a metric for the similarity measurements such that the measurements can reflect the proper differences and similarities among patients characteristics data202and treatment administration data106of each patient. FIGS.3A-3Dillustrate an example of a two-stage clustering process to divide patients data into clusters. The two-stage clustering process includes clustering patient features vectors into a first set of first clusters. A cluster features vector may be computed for each of the first set of first clusters to represent, for example, a distribution for each of the plurality of data categories in the cluster. The cluster features vectors can be further clustered into a second set of second clusters. Through the two-stage clustering, the patients of whom the patients data are clustered can be divided into clusters. As to be described below,FIG.3Aillustrates examples of patent features vectors representing patients data204,FIG.3Billustrates an example of cluster features vectors, whereasFIG.3Cillustrates an example of a two-stage clustering process which is performed based on the example patent features vectors ofFIG.3Aand which generates the example cluster features vectors ofFIG.3B.FIG.3Dillustrates a mapping process to cluster the patients based on the second set of second clusters. A. Examples of Patient Features Vectors FIG.3Aillustrates an example of a patient features vector301of a patient and its mapping to demographic data205, diagnosis data206, and treatment administration data106of the same patient. As shown inFIG.3A, each of demographic data205, diagnosis data206, and treatment administration data106includes a plurality of categories of data, with each category assigned a value for the patient. For example, the data categories of demographic data205may include different demographic information of the patient including age group300, marital status302, race304, gender306, and locale308of the patient. Moreover, the data categories of diagnostic data are related to various potential diagnoses of the patient before or during a treatment and may include organ failure310and infection312. Further, the data categories of treatment administration data106include various information about the administration of the treatment to the patient and may include hospital admission type314, insurance source316, hospital operator318, hospital type320, hospital bed numbers322, and point of referral324. Each data category of demographic data205, diagnosis data206, and treatment administration data106can be mapped to a feature of patient features vector301. A feature of patient features vector301can correspond to a data category, and the value of the data category (represented by the grey box) can be encoded into a feature value. For example, feature330corresponds to age group300, feature332corresponds to marital status302, feature334corresponds to race304, feature336corresponds to gender306, feature338corresponds to locale308, feature340corresponds to organ failure310, feature342corresponds to infection312, feature344corresponds to hospital admission type314, feature346corresponds to insurance source316, feature348corresponds to hospital operator318, feature350corresponds to hospital type320, feature352corresponds to hospital bed numbers322, whereas features354corresponds to point of referral324. In some embodiments, a one-hot encoding scheme can be employed to encode a value of data category into a feature. A data category can have a set of alternative values, and the value of the data category can be indicated by the selection of one of the alternative values. A feature can have a set of bits corresponding to the set of alternative values, and one of the bits can be set to indicate the value selected for the data category. For example, referring toFIG.3B, age group320can be one of a first age group between the ages of 18-44, a second age group between the ages of 45-64, a third age group between the ages of 65-74, and a third age group beyond the age of 74. Feature350, which corresponds to age group320, can have four bits representing the four alternative age groups for age group320, and one of the bits can be set to represent which of the four alternative age groups the patient belongs to. In the example ofFIG.3B, the patient is in the first age group 18-44 (as represented by the shading of the first age group), and the first bit of feature350is set. The bits in other features are also set according to which alternative values are selected for other data categories (as represented by the shading). As part of the two-stage clustering process, patient feature vectors301clinical decision generator can be clustered into a first set of first clusters based on a similarity metric. The one-hot encoding scheme allows patients data to be represented in a binary format, which allows the patient features vector to become more compact and requires fewer computation resources for the clustering operation. However, the binary representation can impose limit on the similarity measurements for clustering operation. For example, since with one-hot encoding, each feature always have one bit set to one and the rest of the bits set to zero, a Euclidian distance between two different feature values can be always one. As a result, Euclidian distance cannot accurately measure a degree of similarity (or difference) between two one-hot encoded vectors. On the other hand, cosine distance, which is generated by the inner product between two vectors and represent an angle formed by the two vectors, can provide a more accurate measurement of a degree of similarity between two one-hot encoded patient features vectors. But the cosine distance measurement between binary representations of patient features vectors only reflects the difference in angles, while ignoring the magnitudes of the patient features which can also indicate a degree of similarities. As a result, a clustering operation based on cosine distances between binary representations of feature vectors may generate a large number of small clusters, yet the clusters are not sufficiently different from one another, and there is insufficient discrimination among the clusters. Moreover, with each cluster only representing a very small population of the patients, the patient characteristics data202and treatment administration data106in each cluster, as well as the corresponding treatment metric data108, may be unable to provide sufficient insight of the relationship among these data and may be unsuitable for treatment metric model generation. B. Examples of Cluster Features Vector To improve the discrimination among the first set clusters, as part of the two-stage clustering process, the first set of first clusters of patient features vectors can be further clustered into a second set of second clusters. Specifically, for each of the first set of first clusters, a cluster features vector can be computed to provide a numerical representation of the features represented by the patient features vectors in the cluster. Each feature in a cluster features vector can represent a feature in patient features vector. Each feature in cluster features vector305can include a number representing a distribution of the alternative values for each data category in the patient features vectors of a cluster of the first set of first clusters. For example, as described above, a feature in a patient cluster vector can be represented by a set of bits, with each bit corresponding to an alternative value for the corresponding data category. A feature in a cluster features vector of a cluster can have a set of numerical values corresponding to the set of alternative values of the corresponding feature in the patient features vectors of the clusters. Each numerical value of a feature of the cluster features vector can represent a percentage of occurrence of that alternative value for the corresponding data category within that cluster, such that each feature in cluster features vector can represent a distribution of the alternative values within the cluster. FIG.3Billustrates an example of a cluster features vector305computed for a cluster of the first set of first clusters. As shown inFIG.3B, cluster features vector305also include features360-384mapped to the data categories of demographic data205, diagnosis data206, and treatment administration data106, as described above. Each feature of cluster features vector305can represent a distribution of the alternative values for a corresponding data category among the patient features vectors301of the cluster. For example, feature360, corresponding to age group300, can indicate that within a cluster, 30% (represented by 0.3) of the patients are of the first age group 18-44, 10% of the patients are of the second age group 45-64, 50% of the patients are of the third age group 65-74, and 10% of the patients are of the fourth age group beyond the age of 74. Likewise, feature370, corresponding to organ failure330, can indicate that within the cluster, 90% of the patients experienced organ failure and 10% of the patients have not experienced organ failure. With such arrangements, a cluster features vector305can include a numerical representation, or a numerical sample, of the features of a group of patients who exhibit certain degree of similarity in terms of demographic, diagnostic results, and treatment administration. The cluster features vectors305can be clustered using K-means clustering based on computation of Euclidean distances between the cluster features vectors to generate a second set of second clusters, with each cluster of the second set of second clusters including a subset of the first set of first clusters. Euclidean distance computation are suitable because, unlike patient features vectors301which are one-hot encoded and only carry binary values (ones or zeros), each cluster features vector305includes a numerical representation of the features. The numerical representation can be any number within a range and is not binary. A degree of similarity (or difference) between two cluster features vectors305can be reflected from the Euclidean distance computed from the numerical representations of the features of the vectors. The clustering of cluster features vectors based on Euclidean distance, as part of the two-stage clustering operation, provides several advantages. For example, since the Euclidean distance is based on the magnitudes of each feature of the vectors, the Euclidean distance can provide a more accurate measurement of the degree of similarity (and difference) among the vectors, which allows the second set of second clusters to be have more discrimination among the clusters. Moreover, with each cluster only representing a larger population of the patients, the patient characteristics data202and treatment administration data106of the patients represented in each cluster, as well as the corresponding treatment metric data108, can provide more insight of the relationship among these data and can be used to create treatment metric models that can provide a more accurate prediction of a treatment metric. Moreover, as k-means clustering is performed only on the cluster features vectors which are much fewer than the number of patient features vectors, the computation time and resource needed for the clustering can be reduced compared with, for example, applying K-means clustering on patients feature vectors that include numerical representations rather than binary representation of the features. This also allows more patients data to be included in the clustering operation to further improve the treatment metric models. C. Examples of Two Stage Clustering FIG.3Cillustrates an example of a two stage clustering operation based on patients characteristics data202. As shown inFIG.3C, patients characteristics data202and treatment administration data106of each patient can first be encoded into patient features vectors301, the details of which are described inFIG.3A. Patient features vectors301can be clustered into a first set of first clusters (of patient features vectors301) including, for example, cluster386a, cluster386b, cluster386c, cluster386n, etc. The clustering of patient features vectors301can be performed based on cosine distance clustering techniques as described above. Moreover, cluster features vector305, including cluster features vector305a, cluster feature vectors305b, cluster feature vector305c, cluster feature vector305n, etc., can be determined for, respectively, cluster386a, cluster386b, cluster386c, and cluster386n, to represent a distribution of the alternative values of each feature among the patient features vectors301in the respective cluster. For example, a cluster features vector305acan be determined for cluster304a, cluster features vector305bcan be determined for cluster304b, cluster features vector305ccan be determined for cluster304c, cluster features vector305ncan be determined for cluster304n, etc. The details of cluster features vectors305are described inFIG.3B. Cluster features vectors305(e.g., cluster features vectors305a,305b,305c,305n, etc.) can be clustered into a second set of second clusters388including, for example, cluster388a, cluster388b, cluster388n, etc. The clustering of cluster features vectors305can be performed based on K-means clustering techniques as described above. Each cluster of clusters388can include a plurality of cluster features vectors305, which can represent a subset of first set of first clusters386. After the second set of second clusters388(of cluster features vectors305) are formed, patients data204of each patient, including patients characteristics data202and treatment administration data106, can be clustered into clusters390of patients data including, for example, patients data cluster390a, patients data cluster390b, patients data cluster390n, etc., based on the second set of second clusters388. Specifically, referring toFIG.3D, the patients data204of each patient (e.g., patient X) can be mapped to a patient features vector301(e.g., “patient X features vector” inFIG.3D) included in the first set of first clusters386a. Patients data204include patients characteristics data202and treatment administration data106which are encoded in the patient features vectors301, as well as treatment metrics data108. As first set of first clusters386ais represented by a cluster features vector305(e.g., cluster features vector305a) in one of the second set of second clusters388(e.g., cluster388a), through the mapping between cluster features vector305aand cluster388a, patient X data can be clustered in a cluster390aof patients data which corresponds to cluster388a. Other patients data clusters, such as cluster390b, cluster390n, etc., can also be formed. The cluster of patients data can then be submitted to regression analysis208to generate treatment metric models201including, for example, treatment metric model201a, treatment metric model201b, treatment metric model201c, as described above. For example, treatment metric model201acan be generated from patients data cluster390a, treatment metric model201bcan be generated from patients data cluster390b, treatment metric model201ccan be generated from patients data cluster390c, etc. III. Supervised Machine Learning Processing of Patients Data Clusters The patient data in each segment can be further processed based on supervised machine learning techniques to determine a relationship between a patient feature (e.g., age, gender, which hospital the patient stayed, etc.) and a treatment metric (e.g., length of hospitalization, cost, recurrence, etc.), to determine a treatment metric model for that segment. The supervised machine learning techniques may include, for example, partial least square regression (PLSR), linear regression, etc. FIG.4AandFIG.4Billustrate examples of treatment metric model generation for segments of patients data. InFIG.4A, a treatment metric model describing a relationship between a treatment metric and each patient feature can be determined, whereasFIG.4Billustrates a treatment metric model that ranks the patient features based on their influence on a particular treatment metric. Referring toFIG.4A, as shown on graph402, based on the results of the two-stage clustering operation ofFIG.3CandFIG.3D, cluster390aof patients data can be formed. Cluster390aof patients data may include diagnosis data indicating whether the patients have experienced organ failure, as well as treatment administration data indicating whether the patients use a private insurance or a public insurance, which are included in patient features vector301and clustered by the two-stage clustering operation. In addition, cluster390aof patients data may also include a set of treatment metric data, such as length of hospitalization (LOH) for patients of that cluster. Graphs404and406illustrate example distributions of length of hospitalization (LOH) among patients having experienced organ failure (or no failure) and patients using public or private insurance can be extracted from patients data segment310a. The distribution include a range of LOH as well as the distribution of the patients within the ranges. Specifically, in both graphs404and406, the bars denote a range of LOHs for the patients having a particular feature within cluster310a. For example, in graph404, patients having private insurance have a range408of LOH, whereas patients having public insurance have a range410of LOH. Moreover, in graph406, patients having organ failure have a range412of LOH, whereas patients not having organ failure have a range414of LOH. Moreover, the ovals and their colors represent the number of patients within each subrange of the LOH ranges. For example, ovals416and418represent the numbers of patients within two subranges of LOH range408, oval420represents the number of patients within a subrange of LOH range410, ovals422and424represents the number of patients within two subranges of LOH range412, whereas oval427represents the number of patients within a subrange of414. The number of patients in oval422(black) can be higher than the other ovals (grey). A correlation between LOH and a patient feature can be determined from graphs404and406. For example, as shown in graph404, the LOH ranges for patients having public insurance and the LOH ranges for patients having private insurance are about the same. Moreover, the density distributions of patients within the LOH range (represented by the color of the shading) are also about the same. This may indicate that the LOH have very little correlation with the type of insurance the patients have. Moreover, as shown in graph406, the LOH ranges of patients having organ failure are higher than the LOH ranges of patients having no organ failure, with most of the patients having organ failure having a LOH close to the upper range (represented by oval422). This may indicate that the LOH has a strong correlation with organ failure where patients having organ failure tend to have a longer LOH. Supervised machine learning techniques, such as partial least square regression (PLSR), linear regression, etc., can be used to process the distributions of LOH exhibited in graphs404and406to determine, for example, a relationship between LOH and the insurance sources, and a relationship between LOH and patient's diagnosis result (e.g., whether the patient has organ failure). A function having LOH as a dependent variable and a data category (e.g., organ failure, insurance source, etc.) as an independent variable can be fit among that the data points of graphs404and406to describe the relationships. One example relationship can be represented by the following equation: LOH=α1×f1+α2×f2+α3×f3(Equation 1) Equation 1 can represent a LOH model based on a weighted sum of feature values f1, f2, and f3. Feature value f1can represent whether the patient has private insurance or public insurance. Feature value f2can represent whether the patient has organ failure or has no organ failure. Feature value f3can represent a feature from treatment administration data106such as, for example, the hospital where the patient stayed for a treatment. These feature values can be non-binary and can be encoded using on one-hot encoding scheme to generate the feature values in patient features vectors204. Weights α1, α2, and α3can represent the weights assigned to, respectively, feature values f1, f2, and f3. FIG.4Billustrates a LOH model426that provides different LOH values for different feature values f1, f2, and f3. An LOH model can be computed based on the patients data for each of clusters390of patients data (e.g., cluster390a, cluster390b, cluster390n, etc.). Each of weights α1, α2, and α3can represent a degree and a direction of influence of each respective feature values f1, f2, and f3on LOH. For example, based on graph404, LOH has very little correlation with whether a patient has private insurance or public insurance, therefore the weight α1assigned to feature value f1(which represents whether the patient has private insurance or public insurance) can have a very small value. Moreover, LOH has a strong and positive correlation with whether the patient has organ failure, therefore the weight α2assigned to feature value f2(which represents whether the patient has organ failure) can be positive and have a large value. LOH model426ofFIG.4Bcan be used to assist in generating a clinical decision. In one example, a new patient is accepted at a hospital, and a decision is to be made about selecting a treatment to be provided to the new patient (e.g., whether the new patient should be transferred to another hospital, etc.) out of a plurality of clinical options. The new patient may have patient features f1and f2, but not f3(which represents the hospital to receive the treatment). The new patient data (and the new patient) can be classified into one of clusters390(e.g., cluster390a). Various techniques of classification can be used. In one example, based on the patients data204in each of clusters390, an average feature value for f1and for f2can be determined for each of clusters390. The classification can be based on, for example, computing the Euclidean distances between the feature values f1and f2of the new patient and the average feature values f1and f2of each of clusters390, and select one of clusters390for which the Euclidean distance is the minimum. The LOH model from the selected cluster can be used to determine whether the new patient should stay at that hospital or should be transferred to another hospital, with the objective of minimizing the LOH value. For example, different feature values f3representing different hospitals, in addition to the feature values f1and f2, can be input to the LOH model to compute a set of LOH values. The hospital that give rise to the minimum LOH value according to the model can be selected to provide treatment to the new patient. In some examples, as part of the treatment metric model, the data categories and/or features can be ranked based on their degree and direction of impacts on the treatment metric, which enable an application (e.g., a clinical decision making application, a medical resource management application, etc.) to identify data categories/features that exert the strongest impact on the treatment metric, and to generate a decision based on the identification. For example, treatment metric values for patients having a particular patient feature (e.g., being part of an age group) and treatment metric values for patients not having that patient feature (e.g., not part of the age group) can be determined. Based on the differences between these treatment metric values, the effect of absence or presence of that patient feature on the treatment metric category can be determined. Other techniques, such as Variables Importance on Partial Least Squares (PLS) projections (VIP), can also be employed. FIG.4Cillustrates graphs430,432,434, and436of the ranking of impact of different features on LOH for different clusters390of patient data based on VIS. Cluster1can correspond to cluster390aof patients data, cluster2can correspond to cluster390bof patients data, cluster3can correspond to cluster390cof patients data, whereas cluster4can correspond to cluster390dof patients data. As shown in graph430, for cluster1, the top three data categories that exert the strongest impact on LOH are organ failure, race, and source of insurance. For cluster2, the top three data categories that exert the strongest impact on LOH are organ failure, a number of beds between 0-99 (of the hospital in which the patient received treatment), and race. For cluster3, the top three data categories that exert the strongest impact on LOH are organ failure, a number of beds over 500 (of a hospital in which the patient received treatment), and point of referral being a trauma center. For cluster4, the top three data categories that exert the strongest impact on LOH are organ failure, the patient received treatment at a teaching hospital, and the patient in an age group over 75. As shown inFIG.4C, some features, such as organ failure, can exert a large degree of impact on LOH in different clusters of patients, whereas some other features, such as being treated at a non-teaching hospital, exerts a large degree of impact on LOH for a particular cluster (cluster4) but not in other clusters. The relationship between a certain feature and LOH may depend on other features of the patients, such as the patients' demographic characteristics, various aspects of treatment administration, etc. Moreover, hidden factors, such as bias, may be identified in a case where some factors exert significant impacts on the LOH, and those factors are not strongly related to the severity of the disease or the quality of treatment. For example, race and insurance source exert strong impact on LOH in cluster1. It may be determined that these factors are not strongly related to the severity of the disease or the quality of treatment, and their impacts on LOH can be due to those hidden factors. The ranking of features in a treatment metric model can be used to assist in generating a clinical decision. For example, as shown inFIG.4C, the model may indicate that staying in a non-teaching hospital has a large and negative influence on the length of hospitalization in cluster3. In such a case, a decision can be made to transfer the new patient to a non-training hospital to reduce the length of hospitalization for the patient, which can also reduce the economic burden on the patient. As another example, if the new patient has features matching the highest ranked features in the model, the clinical decision can be made based on the influences of those features. For example, the model may indicate that being part of a particular age group has a large and positive influence on the length of hospital stay, which may suggest that patients in that age group tends to stay in the hospital longer to recover. If the new patient is also in that age group, a decision can be made to extend the length of hospitalization for the new patient. The ranking of features in a treatment metric model can also be used to improve medical resource management by, for example, identifying administrative factors that impact the treatment metrics but are unrelated to the severity of the illness. For example, for a cluster of patients, the model may indicate that staying at a specific hospital has a large and positive influence on the length of hospitalization at that hospital, while the severity of the illness has a relatively small impact on the length of hospitalization at that hospital. Based on this indication, inquiries specific to that hospital can be made to determine the causes for the longer length of hospitalization, and to determine which action (e.g., more training, more equipment, etc.) can be undertaken to shorten the length of hospitalization for the patients there. IV. Applications of Treatment Metric Model FIG.5AandFIG.5Billustrate examples of applications of treatment metric models generated using the disclosed techniques.FIG.5Aillustrates an example of using a treatment metric model to support clinical decision making, based on techniques described above inFIG.4A-FIG.4C. As shown inFIG.5A, a system500, which includes a clinical decision generator502and a treatment metric models database504, can generate one or more clinical decisions506(or recommendations) for a new patient508based on patient characteristics data510of new patient. As shown inFIG.5A, patient characteristics data510may include demographic data518and diagnosis data520having the same categories of data/features (e.g., age group320, gender326, organ failure330, etc.) as, respectively, demographic data205and diagnosis data206ofFIG.2. In addition, treatment metric models database504stores a plurality of treatment metric models524including, for example, treatment metric model524a, treatment metric model524b, etc. Each treatment metric model can be generate based on a cluster390of patients data204(e.g., cluster390a, cluster390b, cluster390n, etc.) from the two-stage clustering operation ofFIG.3C. Each treatment metric model is associated with a set of average feature values (e.g., f1f2, etc.) of the respective cluster. For example, treatment metric model524ais associated with average feature values526a, whereas treatment metric model524bis associated with average feature values526b. Treatment metric models524can include models that describe relationships between a treatment metric (e.g., LOH) and the feature values, such as LOH model426ofFIG.4B. Treatment metric model524can also include models that rank the impact of different features on a treatment metric (e.g., LOH), such as those shown inFIG.4C. Clinical decision generator502can identify a treatment metric model from treatment metric models database504based on patient characteristics data510, and use the identified treatment metric model to generate clinical decisions506(or recommendations) for new patient508. The identification can be based on determining, from database504, a set of average feature values that are of the minimum Euclidean distance from patient characteristics data510. The treatment metric model associated with the identified set of average feature values can then be identified. Clinical decision generator502can use the identified treatment metric model to generate (or to assist in generating) a clinical decision. For example, a new patient is accepted at a hospital, and a decision is to be made about selecting a treatment to be provided to the new patient (e.g., whether the new patient should be transferred to another hospital, etc.) out of a plurality of clinical options. Clinical decision generator502can input feature values of patient characteristics data510of the new patient to the identified model. Clinical decision generator502can also input a range of feature values of treatment administration data representing the clinical options, such as different hospitals, to the identified model, to generate a set of treatment metric values (e.g., a set of LOH values). The hospital that give rise to the minimum LOH value according to the model can be selected to provide treatment to the new patient. FIG.5Billustrates other applications of treatment metric models. InFIG.5B, the treatment metric models may include those shown inFIG.4Cand include a ranking of features based on their impact on a treatment metric such as LOH. InFIG.5B, clinical decision generator502may identify treatment metric model524abased on patient characteristics data510and generate a clinical decision550. For example, from treatment metric model524a, clinical decision generator502may determine that receiving treatment in a hospital having fewer than 100 beds (represented by “Bedcat 0-99”) is one of the top-ranked feature and has a negative influence on LOH. To reduce LOH, a clinical decision550can be made to transfer the new patient to a hospital having fewer than 100 beds. In another example, both treatment metric models524aand524bindicate that race is one of the top three factors having the strongest impact on LOH. If there is a lack of clear connection between race and LOH, a clinical decision550can be made to devote medical resources to investigate whether there exists some form of racial bias in the treatment administration by the hospitals represented in the patients data. V. Method FIG.6illustrates a method600of determining a treatment metric model. Method600can be performed by, for example, a computer. At operation602, the computer may obtain patients data of a plurality of patients, the patients data comprising a plurality of data categories related to characteristics of the patients and administration of treatments to the patients, the profile data further comprising treatment metric data of the treatments. The patients may have contracted a common illness (e.g., sepsis), have received medical treatments for the illness, and have since recovered. The patients data of each patient may include characteristics data each patient, administration data related to the treatment each patient has received, as well as treatment metrics data related to the medical treatments. The characteristics data and the administration data may be associated with a plurality of data categories. The characteristics data may include different categories of data including, for example, demographic data (which may include categories such as age, gender, race, etc.), locale (which may include categories such as city of residence, urban or rural area, etc.), etc. the diagnosis results of the patient before and/or during the medical treatment, etc. The diagnosis results may be specific to the illness and may include categories of data indicating, for example, whether the patient suffered from an organ failure, whether the patient has contracted an inflection, etc. Moreover, the administration data may include categories of data identifying, for example, the hospital where the patient stayed for the medical treatment, whether the hospital is a teaching hospital or non-teaching hospital, a number of inpatient beds of the hospital, insurance provider information, etc. The treatment metrics data may include, for example, a length of hospitalization (LOH) of the patient for the medical treatment, cost, and other metrics to evaluate the quality of the medical treatment (e.g., recurrence of the illness, etc.). At operation604, the computer may compute a patient features vector, such as patient features vectors301, for each of the plurality of patients based on the patient data, each patient features vector including a plurality of features corresponding to the plurality of data categories of the patients data. As shown inFIG.3A, each feature can be a one-hot encoded representation of a value of a corresponding data category. The value can be one of a discrete set of alternative values for the data category, and the one-hot encoded representation can indicate which of the alternative value that data category has taken. At operation606, the computer system may cluster the patient features vectors into a first set of first clusters based on cosine distances between the plurality of features of the patient features vector. For example, the clustering can be performed so that the cosine distance between any two patient features vectors within a cluster is below a first threshold (e.g., corresponding to 50% difference or less). At operation608, the computer may compute a cluster features vector, such as cluster features vectors305, for each first cluster of the first set of first clusters, each cluster features vector being computed based on a distribution for each of the plurality of data categories. Each respective distribution is determined from the plurality of features among the patient feature vectors in the first cluster for the data category corresponding to the respective distribution. The distribution can be based on, for example, a percentage of occurrence of each alternative values for each data category/feature in the cluster. Each cluster features vector may represent a sample of a cluster of the first set of first clusters. Computing a cluster features vector for each cluster of the first set of first clusters, each cluster features vector being computed based on a distribution of the plurality of features in the each cluster At operation610, the computer may cluster the cluster features vectors into a second set of second clusters based on Euclidean distance clustering. Each cluster feature vectors may include numerical representations of the features, and Euclidean distances can be computed based on the numerical representations. For example, the clustering can be performed so that the Euclidean distance between any two cluster features vectors within a cluster is below a second threshold. At operation612, the computer may, for each second cluster of the second set of second clusters, assign a segment of the patients data corresponding to patients whose patient feature vectors are in the portion of the first set of first clusters corresponding to the second cluster. The patients data can be mapped to the cluster features vectors via patient features vectors and can be divided according to the second set of second clusters, as shown inFIG.3D. At operation614, the computer may, for each second cluster of the second set of second clusters, determine a treatment metric model based on performing supervised machine learning on the patients data in the second cluster. The treatment metric model reflects a relationship among the patient characteristics of patients, administration of the treatment, and the treatment metric data of the treatment for the patients in the second cluster, thereby enabling selection of a particular administration of treatment having optimal treatment metric data. The supervised machine learning may include, for example, partial least square regression (PLSR), linear regression, etc. A function having the treatment metric as a dependent variable and a data category (e.g., organ failure, insurance source, etc.) as an independent variable can be fitted among that the data points of the patients data in each cluster to describe the relationships. The treatment metric models can include, for example, a relationship between a treatment metric and patient characteristics, treatment administration features, etc. The treatment metric models can also include a ranking of data categories based on the degrees of impact of the data categories on the treatment metric. In some examples, method600further comprises selecting an administration of treatment by: classifying a new patient into one of the second set of second clusters based on the patient characteristics data of the new patient; obtaining a first treatment metric model determined for the one of the second set of second clusters; inputting the patient characteristics data and data representing a range of administrations of the treatment to the first treatment metric model to compute a range of treatment metrics; and selecting, as part of the clinical decision, an administration of the treatment from the range of administrations of the treatment based on the range of treatment metrics. For example, a clinical decision can be made to reduce length of hospitalization based on identifying, from a treatment metric model of a cluster that is most similar to a new patient, factors that exert the strongest impacts on the treatment metric for the new patient. As another example, a resource management decision can be made to identify factors that impact treatment metrics but not related severity of the illness or quality of care. VI. Additional Embodiments In one example, a method comprises: obtaining patients data of a plurality of patients, the patients data comprising a plurality of data categories related to characteristics of the patients and administration of a treatment to the patients, the patients data further comprising treatment outcome data of the treatment; computing a patient features vector for each of the plurality of patients based on the patients data, each patient features vector including a plurality of features corresponding to the plurality of data categories of the patients data; clustering the patient features vectors into a first set of clusters based on cosine distances; computing a cluster features vector for each cluster of the first set of clusters, each cluster features vector being computed based on a distribution of the plurality of features in the each cluster; clustering the cluster features vectors into a second set of clusters based on Euclidean distances; dividing the patients data into the second set of clusters; and determining a treatment outcome model for each cluster of the second set of clusters based on performing supervised machine learning on the each cluster of patients data. In one example, a method comprises: obtaining patients data of a plurality of patients, the patients data comprising a plurality of data categories, the data categories related to a patient characteristic of the plurality of patients and an administration of a treatment to the plurality of patients, the patients data further comprising treatment metric data of the treatment; for each of the plurality of patients, computing a patient features vector based on patient data of the patient, each patient features vector including a plurality of features indicating values of the patient data in the plurality of data categories; clustering the patient features vectors into a first set of first clusters based on cosine distances between the plurality of features of the patient features vectors; for each first cluster of the first set of first clusters, computing a cluster features vector based on a respective distribution for each of the plurality of data categories, each respective distribution being determined from the plurality of features among the patient feature vectors in the first cluster for the data category corresponding to the respective distribution; clustering the cluster features vectors into a second set of second clusters based on Euclidean distances, each of the second set of second clusters corresponding to a portion of the first set of first clusters; for each second cluster of the second set of second clusters, assigning a segment of the patients data corresponding to patients whose patient feature vectors are in the portion of the first set of first clusters corresponding to the second cluster; for each second cluster of the second set of second clusters, determining a treatment metric model based on performing supervised machine learning on the patients data in the second cluster, wherein the treatment metric model reflects a relationship among the patient characteristics of patients, administration of the treatment, and the treatment metric data of the treatment for the patients in the second cluster. Each of the treatment metric models enables a treatment metric to be computed for a new patient based on inputting patient characteristic data of the new patient, and a clinical decision to be generated for the new patient based on the computed treatment metric. In some aspects, the method further comprises selecting the particular administration of treatment by: classifying the new patient into one of the second set of second clusters based on the patient characteristics data of the new patient; obtaining a first treatment metric model determined for the one of the second set of second clusters; inputting the patient characteristics data and data representing a range of administrations of the treatment to the first treatment metric model to compute a range of treatment metrics; and selecting, as part of the clinical decision, an administration of the treatment from the range of administrations of the treatment based on the range of treatment metrics. In some aspects, the treatment metric comprises a length of hospitalization (LOH). In some aspects, the plurality of data categories comprise demographic data of a patient and diagnosis data of the patient prior to the administration of the treatment to the patient. In some aspects, the demographic data comprise at least one of: age group, marital status, race, gender, or locale. In some aspects, the diagnosis data comprise at least one of: whether the patient experiences organ failure, or whether the patient experiences infection. In some aspects, the data categories related to the administration of the treatment to a patient comprise: a type of admission of the patient to a hospital, a source of insurance, an operator of the hospital, a type of the hospital, a number of beds of the hospital, or a point of referral. In some aspects, a feature included in a patient feature vector indicates one of a discrete set of alternative values of a corresponding data category. In some aspects, for each cluster of the first set of first clusters and for each of the plurality of data categories, the distribution comprises a percentage of occurrence in the patient feature vectors for each alternative value of the corresponding data category. In some aspects, the feature comprises a discrete set of bits and is one-hot encoded to indicate which of the discrete set of alternative values is the value. Each of the patient features vectors comprise only binary values. In some aspects, a cosine distance between any two of the patient features vectors in a cluster of the first set of first clusters is below a first threshold. In some aspects, a Euclidean distance between any two of the cluster features vectors in a cluster of the second set of second clusters is below a second threshold. In some aspects, the supervised machine learning comprises at least one of: partial least square regression (PLSR), or linear regression. In some aspects, the treatment metric model comprises a ranking of the plurality of data categories based on degrees of impact of the plurality of data categories. In some aspects, the plurality of patients comprise at least a thousand patients. VII. Computer System Any of the computer systems mentioned herein may utilize any suitable number of subsystems. Examples of such subsystems are shown inFIG.7in computer system10. In some embodiments, a computer system includes a single computer apparatus, where the subsystems can be the components of the computer apparatus. In other embodiments, a computer system can include multiple computer apparatuses, each being a subsystem, with internal components. A computer system can include desktop and laptop computers, tablets, mobile phones and other mobile devices. In some embodiments, a cloud infrastructure (e.g., Amazon Web Services), a graphical processing unit (GPU), etc., can be used to implement the disclosed techniques. The subsystems shown inFIG.7are interconnected via a system bus75. Additional subsystems such as a printer74, keyboard78, storage device(s)79, monitor76, which is coupled to display adapter82, and others are shown. Peripherals and input/output (I/O) devices, which couple to I/O controller71, can be connected to the computer system by any number of means known in the art such as input/output (I/O) port77(e.g., USB, FireWire). For example, I/O port77or external interface81(e.g. Ethernet, Wi-Fi, etc.) can be used to connect computer system10to a wide area network such as the Internet, a mouse input device, or a scanner. The interconnection via system bus75allows the central processor73to communicate with each subsystem and to control the execution of a plurality of instructions from system memory72or the storage device(s)79(e.g., a fixed disk, such as a hard drive, or optical disk), as well as the exchange of information between subsystems. The system memory72and/or the storage device(s)79may embody a computer readable medium. Another subsystem is a data collection device85, such as a camera, microphone, accelerometer, and the like. Any of the data mentioned herein can be output from one component to another component and can be output to the user. A computer system can include a plurality of the same components or subsystems, e.g., connected together by external interface81or by an internal interface. In some embodiments, computer systems, subsystem, or apparatuses can communicate over a network. In such instances, one computer can be considered a client and another computer a server, where each can be part of a same computer system. A client and a server can each include multiple systems, subsystems, or components. Aspects of embodiments can be implemented in the form of control logic using hardware (e.g. an application specific integrated circuit or field programmable gate array) and/or using computer software with a generally programmable processor in a modular or integrated manner. As used herein, a processor includes a single-core processor, multi-core processor on a same integrated chip, or multiple processing units on a single circuit board or networked. Based on the disclosure and teachings provided herein, a person of ordinary skill in the art will know and appreciate other ways and/or methods to implement embodiments of the present invention using hardware and a combination of hardware and software. Any of the software components or functions described in this application may be implemented as software code to be executed by a processor using any suitable computer language such as, for example, Java, C, C++, C #, Objective-C, Swift, or scripting language such as Perl or Python using, for example, conventional or object-oriented techniques. The software code may be stored as a series of instructions or commands on a computer readable medium for storage and/or transmission. A suitable non-transitory computer readable medium can include random access memory (RAM), a read only memory (ROM), a magnetic medium such as a hard-drive or a floppy disk, or an optical medium such as a compact disk (CD) or DVD (digital versatile disk), flash memory, and the like. The computer readable medium may be any combination of such storage or transmission devices. Such programs may also be encoded and transmitted using carrier signals adapted for transmission via wired, optical, and/or wireless networks conforming to a variety of protocols, including the Internet. As such, a computer readable medium may be created using a data signal encoded with such programs. Computer readable media encoded with the program code may be packaged with a compatible device or provided separately from other devices (e.g., via Internet download). Any such computer readable medium may reside on or within a single computer product (e.g. a hard drive, a CD, or an entire computer system), and may be present on or within different computer products within a system or network. A computer system may include a monitor, printer, or other suitable display for providing any of the results mentioned herein to a user. Any of the methods described herein may be totally or partially performed with a computer system including one or more processors, which can be configured to perform the steps. Thus, embodiments can be directed to computer systems configured to perform the steps of any of the methods described herein, potentially with different components performing a respective steps or a respective group of steps. Although presented as numbered steps, steps of methods herein can be performed at a same time or in a different order. Additionally, portions of these steps may be used with portions of other steps from other methods. Also, all or portions of a step may be optional. Additionally, any of the steps of any of the methods can be performed with modules, units, circuits, or other means for performing these steps. The specific details of particular embodiments may be combined in any suitable manner without departing from the spirit and scope of embodiments of the invention. However, other embodiments of the invention may be directed to specific embodiments relating to each individual aspect, or specific combinations of these individual aspects. The above description of example embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and many modifications and variations are possible in light of the teaching above. A recitation of “a”, “an” or “the” is intended to mean “one or more” unless specifically indicated to the contrary. The use of “or” is intended to mean an “inclusive or,” and not an “exclusive or” unless specifically indicated to the contrary. Reference to a “first” component does not necessarily require that a second component be provided. Moreover reference to a “first” or a “second” component does not limit the referenced component to a particular location unless expressly stated. All patents, patent applications, publications, and descriptions mentioned herein are incorporated by reference in their entirety for all purposes. None is admitted to be prior art. | 68,246 |
11862346 | DETAILED DESCRIPTION A classification system for medical conditions is defined by a set of quantitative definitions of classes of patients, herein called subtypes. Each subtype has a subtype definition defined in an N-dimensional space which determines, given patient data for a patient, whether the patient belongs to the subtype. The subtype definition has an associated mapping defining how patient data is mapped to a patient vector representing the patient in the N-dimensional space in which the subtype is defined. Each subtype in the classification system defines a medical condition wherein patients belonging to the subtype have medical fact patterns that, when mapped to the N-dimensional space, are quantitatively closer to medical fact patterns of patients belonging to the subtype than to other patients belonging to other subtypes. Further, patients belonging to the subtype have a similar likelihood of a health care outcome. These quantitative definitions are derived by, at first, identifying groups of patients, herein called sub-cohorts, such that the medical fact patterns of patients in each sub-cohort, as analyzed in the N-dimensional space, are closer to the patients in the sub-cohort than to patients in the other sub-cohorts. In one implementation, referring toFIG.1, a data flow diagram of an example implementation of a classification system for medical conditions will now be described. A computer system100processes patient data104for a plurality of patients. The patient data generally includes, for each patient, one or more of demographic data about the patient, medical information for the patient, genotypic data for the patient, and lifestyle information of the patient. The patient data may include outcome data106for the patient. When outcome data for a plurality of patients is available, information such as outcome rates, average outcomes, expected outcomes, or any combination of two or more of these, can be computed for the plurality of patients. Patient data can be obtained from a number of different sources of health care information for the patient including, but not limited to, electronic medical records from the patient's health care providers, insurance providers, and other sources. More particularly, patient data can include, but is not limited to, information recorded for patients by a health care provider. Examples of health care providers include, but are not limited to, individuals, such as a physician, a therapist, a nurse, or support staff, and organizations, such a hospital or other facility employing health care providers. Patient data can include information from entities other than health care providers but who are otherwise involved in health care, such as insurers, pharmacies, laboratories, supply providers and the like, which may store information about claims, diagnostic tests, laboratory work, supplies, and vendors. Patient data can include information reported by patients or their caregivers or both. The medical information can include any one or more of, for example, information about reported or observed symptoms of the patient, diagnoses made by the health care provider, any medications, treatments, or other interventions prescribed or recommended by the health care provider, or any requests for laboratory work or diagnostic tests and related reports or results, or any other information about encounters with health care providers. Such data can be stored as a history of interactions or encounters with the health care provider and may have multiple instances of a type of data over time, such as vital signs and lab results. Such data typically includes information, typically representing symptoms, diagnoses, procedures and medications, which is typically coded according to a standard, such as ICD-9, ICD-10, CPT, SNOMED, LOINC, COSTAR, and RxNorm coding systems. The demographic information can include, for example, age, gender, race, family history, social history, and other information for the patient. If there is authorization to store personally identifying information, then such information may include a name, an address and various contact information. Genotypic information can include data representing information about genetic profiles of patients. Lifestyle information can include data representing information about aspects of patients' daily lives that can affect their health, such as smoking history, exercise type and frequency, diet information, occupation, family status, socioeconomic status, family history of disease, and so on. The patient data generally is stored as a set of occurrences of events. Each recorded event occurs at a point in time in a history of events for the patient. For some types of events, a relative time can be computed with respect to a reference time and stored. Patient data can be de-identified data such that any personally identifying information is removed, in which case patient data for a patient is associated with a unique code representing that patient, which code distinguishes the patient from other patients. Patient data generally includes both structured and unstructured data. Structured data generally is data that has a specified data model or other organization, whereas unstructured data generally does not. By way of example, structured data can include database records, attribute-value pairs, and the like, whereas unstructured data can be either textual data, such as free text, documents, reports of results, published and unpublished literature, and the like, or non-textual data, such as image data of which DICOM data is an example. Patient data also can include cost information related to resources for various activities related to providing health care for a patient. Thus, for each activity performed with respect to a patient, resource utilization information also can be made available. Resources can include personnel, equipment, supplies, space, and the like. Resources generally have an associated cost, typically represented by a cost per unit, cost per unit of time, cost per unit of space, and the like. The computer system includes a sub-cohort analysis module116which, given the patient data104, generates subtype definitions118. The sub-cohort analysis module processes the patient data104to select a set of patients called a cohort. The computer system processes the patient data for the cohort to group patients into sub-cohorts114of similar patients, i.e., each sub-cohort includes patients who have similar fact patterns in their patient data. Patients in different sub-cohorts generally, but not necessarily, have significant differences in their patient data. Within each sub-cohort, one or more of the demographic data, medical history data, genotypic data, and lifestyle data of the patients include fact patterns which are more closely related quantitatively to each other than to fact patterns in the data for other groups of patients, according to criteria of similarity used to identify the sub-cohorts. The computer system generates, for a sub-cohort, a quantitative definition describing the patients in the sub-cohort based on facts which are common in the patient data within the sub-cohort. This quantitative definition is called herein a “subtype definition” which defines a “subtype”. A subtype definition is quantitative because it represents the common facts for a class of patients defined by the subtype definition and those fact patterns, when mapped to an N-dimensional space, are quantitatively closer to the fact patterns of other patients belonging to the same subtype than to the fact patterns of other patients belonging to other subtypes. The subtype definition is based on quantified patient data, even if some quantified data represents qualitative information about a patient, such as a broad or imprecise diagnosis based on current definitions of diseases and health conditions. The label for the class of patients meeting this definition is called herein a “subtype”. Any patient for which the patient data at a given moment in time meets a subtype definition for a subtype belongs to that subtype for that moment in time. These definitions are output as subtype definitions118. Further associating subtypes with outcomes enables understanding how subtypes relate to outcomes. For example, a sub-cohort outcome analysis module130can process outcome data106for patients in sub-cohorts114to determine whether there is a sub-cohort in which patients have outcomes that are meaningfully different from outcomes of patients in other sub-cohorts, in the entire cohort, or within a larger population. If outcomes for patients in a sub-cohort are meaningfully different from outcomes for other groups of patients, then the patients in the sub-cohort may belong to, as called herein, a “medically-interesting subtype”. When outcome data106is available for at least a subset of patients in a sub-cohort, the sub-cohort outcome analysis module130also can predict outcomes for other patients in the sub-cohort based on the outcomes for that subset of patients. The subtype definition118for a medically interesting subtype not only provides a quantitative definition of that subtype, but also provides a definition of a medical condition which may be less broad or more precise than a currently used definition of a disease or health condition. Generally, a medically interesting subtype is defined using many factors, which results in the subtype representing a narrow subset of the patient population. Further, sources of imprecision can be attenuated because subtypes are defined by using quantified patient data both for many factors and from a long period of time within the patient's medical history. Because each subtype represents a class of patients having similar fact patterns in their patient data, the patients belonging to a medically interesting subtype may have a particular medical condition characterized by the subtype definition. That medical condition may be specified less broadly and more precisely by that subtype definition than by a currently used definition of a disease or health condition otherwise characterizing the patients in that subtype. To distinguish herein currently used definitions of diseases and health conditions from the label given a patient that belongs to a subtype, we refer herein to the patient belonging to a subtype as having a “medical condition characterized by the subtype”, or “medical condition” for short. Because a medically-interesting subtype is identified based on outcome data, the medical condition characterized by a subtype also can be understood as being characterized by both the prevalent fact patterns in the patient data in the sub-cohort and the outcomes for the patients in the sub-cohort. Because subtype definitions are generated from quantitative patient data, a subtype definition118can be represented in the computer system100in a manner such that it be read and interpreted as computer program instructions that, when executed on patient data, determines whether a patient belongs to the subtype. A computer system that generates subtype definitions118thus generates computer programs for subtype membership detection. In other words, subtype definitions are effectively small computer programs that act as detectors120of whether a patient, based on their patient data at a specific time, belongs to the corresponding subtype at that time. The subtype definitions118can be distributed to and applied on other computer systems150, separate from computer system100, for application to other patient data124for application to the other patient data, without requiring access either to the original patient data104,106or to the computer system180(or more specifically, the sub-cohort analysis module116) used to identify sub-cohorts114or generate the subtype definitions118. A subtype membership detector120uses the subtype definition118as a computer program to process patient data124for a patient, to determine whether the patient belongs to that subtype. Patient data124can originate from any other computer system, or from patient data104. The subtype membership detector120can output data indicating the subtype to which the patient belongs, such as in the form of labeled patient data122. The output indication can be stored with the patient data124, or104, or both, to which it corresponds. Generally, to process patient data124using the subtype definition118, the structure and content of the patient data (i.e., its structure, including field names and data types) should match the structure and content of data used in the subtype definition. This condition may be met in several ways, examples of which are the following. The patient data124has the same structure and content as data in the subtype definition118. The patient data104has the same content, and is transformed to have the same structure, as data in the subtype definition118. The data in the subtype definition118is transformed to have the same structure as the patient data. The subtype definition118is defined in a manner that allows the subtype definition to be applied to data with different structures, such as the patient data124. When a patient is identified as belonging to a subtype, several inferences can be made with respect to the patient, as performed by the inference module140inFIG.1. Several inferences can be performed, such as one or more of predicting or evaluating outcomes, identifying treatments, or identifying or evaluating risks for the patient. Some inferences can be based on data for other patients belonging to that subtype. Attributes generally associated with patients in a subtype also can be associated with a patient determined to be in that subtype. One or more of outcome data, treatment information, risk information, or attribute data can be output by the inference module, for example in the form of updated patient data142. Such outputs can be stored in the original patient data124,104. The inference module140, subtype membership detector120, and analysis modules116,130can be implemented on different computer systems, indicated by170,150, and180, respectively, or may be combined onto one or more computer systems. Computer-implemented processes using such a computer system are illustrated by the flowcharts ofFIG.2. InFIG.2, dashed lines between sets of steps indicate that the processes represented by these sets of steps can be performed at different times, by different entities, or using different computer systems. In a first set of steps, a computer system accesses200patient data for a cohort selected from a set of patients. This cohort can be called a training cohort. The sub-cohort analysis module (116inFIG.1) groups202the patients into sub-cohorts of similar patients based on fact patterns in their patient data. The sub-cohort analysis module generates204a subtype definition for a sub-cohort based on facts which are common in the patient data for patients within the sub-cohort. Subtype definitions can be generated for one, some or all of the sub-cohorts. Generation of a subtype definition for a sub-cohort can be deferred, for example, until outcome analysis for the sub-cohort indicates that the sub-cohort represents a medically interesting subtype. If outcome data is available, the sub-cohort outcome analysis module (130inFIG.1) accesses206patient data for patients in one or more sub-cohorts. This module computes208sub-cohort level outcome statistics for a sub-cohort based on the patient data for patients in that sub-cohort. The sub-cohort level outcome statistics computed using this module can be used, for example, to identify210medically interesting subtypes. The sub-cohort level outcome statistics for a sub-cohort can be compared to the sub-cohort level outcome statistics for one or more of other groups of patients, such as the training cohort, any other cohort, another sub-cohort, or the general population, or can be compared to known norms, or any combination of these. As indicated by the dashed arrows inFIG.2, the outcome analysis for a sub-cohort can occur at any time after a sub-cohort is identified, whether or not a subtype definition has been or will be generated for the sub-cohort. The computer system performing the outcome analysis in steps206through210can be independent of any computer system performing steps200through204and212through220. Medically interesting subtypes can be identified at any time after sub-cohort level outcome statistics have been computed for a sub-cohort and can be performed using a separate computer system from the computer system used to compute the sub-cohort level outcome statistics. To apply a subtype definition to determine whether a patient belongs in a subtype, a subtype membership detector (120inFIG.1) accesses212the subtype definition and accesses214patient data for the patient. These steps can be performed independently of each other and in any sequence or in parallel. Data for multiple patients can be accessed. The detector120applies216the subtype definition to the accessed patient data. Note that the performance of steps212through216by a subtype membership detector120can occur at any time after a subtype definition is generated, and the computer system implementing the subtype membership detector can be independent of any other computer system performing any of the steps200through204, or steps206through210, or step220. At any time after a patient's data has been processed to determine their subtype membership, various inferences can be made. An inference module (140inFIG.1) applies220inferences to the patient data based on the patient's subtype membership. To do so the inference module may access other data, such as one or more of outcome data, outcome statistics, or other information, or combinations thereof, to make such inferences. The inference module can be implemented using a computer system which is separate from the computer system that implements the subtype membership detector and can be used at any time independently of other parts of the computer system. The steps inFIG.2and modules in the computer system inFIG.1, will be described in more detail below in connection with an example implementation of such, as illustrated inFIGS.3and4, for deriving subtypes, and illustrated inFIG.6, for applying subtypes to patient data to determine subtypes to which patients belong. In this example implementation, we refer to an item of patient data as a “medical event” (sometimes abbreviated herein as “ME”). A medical event is, generally, any item of data in the patient data. Patient data generally includes a collection of such medical events for each patient. Any kind of data, whether demographic data, medical information, genotypic data, or lifestyle data, can be stored in the computer system as a kind of medical event. For the purpose of illustration, the following are a few non-limiting examples of medical events: 1. A diagnosis code, which indicates that a patient was assigned a code representing a diagnosis, such as an ICD9 code, at a certain time in the patient history. 2. A procedure code, which indicates that a patient experienced one of a procedure, test, laboratory, imaging, or other encounter with the health care system at a certain time. 3. A medication code, which indicates that a medication was prescribed by a prescriber or filled by a pharmacy at a certain time. 4. A medication dosage amount, which indicates a recommended amount and frequency for taking a medication. 5. A medication dosage era, which indicates an amount of medication likely consumed by a patient over a specified time interval. The amount can be estimated from an individual source, or a combination of sources, including, but not limited to, the specified dosing and amount prescribed by a prescriber over a specific period of time, the specified dosing and amount filled by pharmacies over a specific period of time, the specified dosing and amount infused at an infusion center over a specific period of time, and the labelled dosing and amount purchased from a retail pharmacy over a specific period of time. 6. A laboratory order code, which indicates a specific test and when the specific test was ordered. 7. A laboratory result code, which indicates a result for a specific test. For a laboratory result event in a patient history, the combination of the type of test and result value can be mapped to the appropriate laboratory result code which enters the patient history at the specific time. The laboratory order code and a laboratory result value can be combined into laboratory result value bins. In some implementations there could be two bins per type of laboratory result: normal and abnormal. In some implementations, more than two bins can be specified. Laboratory results can be entered as continuous variables in some implementations. 8. Imaging and other interpreted test findings, such as electrocardiograms. These events can include both qualitative information, such as specific findings, and quantitative information, such as number of new lesions, tumor dimensions, or specific flow rates. Such data in some instances can be transformed to value bins. Other methods of using imaging and related types of data, such as with 2-dimensional or 3-dimensional or time sequences, include classifying the interpretation of the test from binary results (such as normal, abnormal) to a finite set of results (single vessels, two vessels, and three vessels occluded). In this case, the type of test is combined with the result of the test to give image-result codes, which then enter the patient data in similar ways as labs and medications. As an example implementation of medical events, a medical event can be represented using at least one field. A field is a data structure that stores a data value, and generally has a name and a data type. In object-oriented programming, a field is the data encapsulated within a class or object. Fields may be shared by multiple instances of an object. In relational databases, a field is the intersection of a row and a column, and the field name is the column name. In such an implementation, a medical event generally comprises a code field to store a code, optionally one or more value fields to store corresponding values, and optionally a time stamp field to store a corresponding time stamp. Thus, any medical information can be represented as a medical event with a code field, an optional value field, and an optional time stamp field. For example, a medical event for a patient may be a diagnosis of a disease or health condition using current definitions, which can be represented by the combination of a code field storing the ICD10 code for the diagnosis, and a time stamp field storing the date and time a health care provider input the diagnosis into the patient data. As another example, a medical event for a patient may indicate a laboratory test, which can be represented by the combination of a code field storing a code representing the laboratory test, a value field storing a value for a result from the laboratory test, and a time stamp field storing a date the laboratory test was performed, or when the result was added to the patient data, or other relevant time. A problem that can arise when processing a large volume of patient data is that the same fact can be stored in different ways for different patients and for a single patient. In other words, the same fact may be represented inconsistently throughout the data set. For example, different codes may be used, but may represent the same thing or generally similar things. There may be different codes for different medications which are in the same class of medications, such as pain medication. There may be different codes for different variants of a procedure, such as a left knee surgery versus a right knee surgery, when both are forms of knee surgery. Or, medical events that typically occur together, such as both a diagnosis and its corresponding laboratory test, may not appear together in a patient's data, e.g., there may be only a diagnosis code or only a laboratory test code. If the same fact is not represented in the same way, then it becomes difficult to identify patients that have similar fact patterns in their patient data. Another problem that can arise when processing a large volume of patient data to identify sub-cohorts is that processing complexity increases with each additional dimension of patient data. If every kind of medical event is considered a dimension of the patient data, then the number of dimensions of data can become very large. To address these problems, the computer system can process medical events into corresponding “medical instances”, by applying a set of “medical instance mappings” to the medical events. Medical instances, in essence, “roll up” or “generalize” specific types of medical events by converting them into a more general type of medical instance. In general, a “medical instance mapping” is an operation performed on patient data that maps a medical event to a corresponding medical instance. The computer system can process medical events in patient data using medical instance mappings to compute corresponding medical instances. Data representing a medical instance can be stored in data structures similar to the data structures used for storing medical events. By generalizing specific types of medical events into a more general type of medical instance, the number of dimensions of patient data is reduced. Similarly, by mapping different types of medical events that represent the same fact into the same type of medical instance, the inconsistency in the data is reduced. As one example, the computer system can use a mapping of a larger set of codes, that can occur in medical events, to a smaller set of codes used for the medical instances. For example, all codes in medical events representing different forms of pain medication can be mapped to a single new code as a medical instance representing those forms of pain medications. As another example, the computer system can map a range of values stored in association with a code in medical events to smaller set of discrete ranges using medical instances. For example, different medical events can store different dosages for the same medication; the different dosages can be mapped to discrete ranges (e.g., low, medium, high). The computer system can include one or more processes for deriving medical instance mappings. For the purpose of illustration, given a set of medical events, there are several ways in which medical instances and their corresponding mappings can be derived. In one implementation, an MI can represent a single ME. In another implementation, an MI can represent a group of ME's. An entire set of individual ME's can be transformed into a finite, smaller set of such groups. Example approaches to deriving such mappings of medical events into medical instances include, but are not limited to, the following. One approach uses medical instances that represent groups of medical codes. Each medical instance represents a set of codes which are related to each other in some way. In one implementation, the relation between codes within a medical instance could be a type of the codes. For example, all ICD10 Diagnosis codes, or a subset of such codes, could be represented by a medical instance; all CPT Procedure codes, or a subset of such codes, could be represented by another medical instance, etc. In this example, one mapping is defined that maps each ICD10 diagnosis code to a single code representing the medical instance; another mapping is defined that maps each CPT procedure code to another medical instance. This way of defining medical instances results in few medical instances, where the codes represented by each medical instance are related to each other by the type of the codes. Another approach for defining medical instances is based on the relation of co-occurrence. Using this approach, a medical instance represents a collection of codes which co-occur in patient medical histories more frequently with each other than they co-occur with codes which are used to define other medical instances. The mapping maps each code in this collection of codes to the medical instance representing the collection of codes. A computer system can include one or more computer program modules that implement various algorithms that can be used to derive a set of medical instances. For example, such a module can optimize grouping of codes with regards to co-occurrence. Different modules can implement different techniques for discovering different groups of codes that can be represented by different medical instances and deriving a mapping for that medical instance. An example implementation of such a computer program module, which derives medical instances based on co-occurrence, utilizes a mapping algorithm, an example of which is known as “word2vec”. Such algorithms may come in various forms, for example the Continuous Bag-of-Words model (CBOW) or the Skip-Gram model or other variations. The algorithm processes a set of patient medical histories for a plurality of patients. Each patient medical history is organized and represented as an ordered sequence of events, in which events are ordered with respect to time at which they occurred in the patient medical history. Such ordering sometimes cannot be strict due to multiple codes having identical timestamps. In that case, there can be a secondary ordering based on, for example, some other criteria (e.g., by type of code) or simply random secondary ordering. After the patient medical histories are ordered, the algorithm maps each code in the list of codes onto a Euclidean embedding space for which dimensions have been predetermined by the user. The algorithm, in this implementation word2vec, optimizes the mapping such that the more frequently two codes co-occur (i.e., are found in high proximity to each other) in patient medical histories, the closer their mapped embeddings reside in the embeddings space. After such embeddings have been produced, medical instances can be produced by splitting the embeddings space into sub-spaces, each of which holds a cluster of embeddings. Such splitting can be produced by using Unsupervised Learning methods from the fields of Machine Learning, Statistical Learning, Artificial Intelligence, Deep Learning or combinations thereof. Unsupervised Learning is a collection of clustering algorithms which optimally split up the Euclidean embeddings space in subspaces by drawing a number of hypersurfaces which serve as the boundaries of the various subspaces. The number of resulting subspaces can be either pre-specified by the user or optimally selected by the clustering algorithm, depending on the use case and/or the algorithm. There is a large variety of clustering algorithms, as discussed above. Examples include k-means, k-medians, Expectation Maximization clustering using Gaussian Mixture Models, Agglomerative Hierarchical Clustering, Density-Based Spatial Clustering of Applications with Noise (DBSCAN), Deep Embedded Clustering and many others. Each one of these algorithms can be used to derive medical instances. In one implementation, the word2vec algorithm and k-means clustering can be used to derive medical instances. Other implementations which derive medical instances on the basis of co-occurrence relations include algorithms derived from approaches such as count-based methods (e.g., Latent Semantic Analysis), and predictive methods (e.g., neural probabilistic language models). Word2vec is a predictive method. The methods of representation that use co-occurrence relations have the underlying hypothesis that medical codes which appear in the same patient medical histories relate to similar medical context or, in other words, similar conditions. Relations other than co-occurrence of medical events in patient medical histories can be used to guide the automated derivation of medical instances that are groups of medical codes or events. Different algorithms from Artificial Intelligence, Machine Learning, Deep Learning may be used to derive medical instances based on such relations. Medical instances also can be derived by human experts fully or partly. In that case, the medical experts use criteria that guide them to group codes into medical instances. For example, the criterion may be to ensure that codes which relate to the same condition are in the same group. A variety of criteria may guide human experts in their derivation of medical instances. There are cases where medical instances can be derived using a combination of algorithms and human expertise. Human experts can adjust or alter medical instances derived by the computer, or can pre-process the data that is used by automated algorithms to derive the medical instances. In another implementation, the set of derived medical instances may be algorithmically altered and fine-tuned using algorithms that might judiciously rearrange the medical event content of specific medical instances; or merge some medical instances into larger medical instances using same relation criteria as the ones used to derive the original set of medical instances or different relation criteria; or divide some medical instances to smaller medical instances in order to satisfy size or coherence criteria. The various derivation methods described above result in a set of mappings that map medical events to the medical instances. This set of mappings can be organized in a library of medical instances. This library thus contains the building blocks of the patient sub-cohorts and corresponding subtypes that will be generated. A medical instance mapping module maps the patient data for patients in the training cohort into the medical instances based on the medical instance definitions accessed from the library. The library can be structured to include the following information for each medical instance:a. Set of medical events that are members of the medical instance;b. Any functions or other operation used to combine or process one or more of the medical events;c. A label or a key for uniquely identifying the medical instance; andd. A human-readable description of the medical instance, for example generated by medical experts and aiming at communicating the nature of the medical instance to users. Referring back toFIG.1, the computer system includes a sub-cohort analysis module116which processes patient data to identify sub-cohorts114and generate subtype definitions118for those sub-cohorts based on the patient data in those sub-cohorts. An example implementation of the sub-cohort analysis module will now be described in connection withFIG.3. For the purposes of the rest of this description, the term “medical instance” is used, but should be understood to include medical events, or medical instances derived from medical events, or some combination of both. Sub-cohorts are identified based on the principle that similar medical histories tend to include similar medical instances. InFIG.3, the sub-cohort analysis module accesses patient data300for patients in a training cohort (TC) to groups those patients into sub-cohorts based on medical instances302and one or more time periods304. In this implementation, the sub-cohort analysis module116includes a patient history summarization module306that summarizes medical instances occurring in patient histories during the specified time period304. The time period304can be selected in many ways, with some examples described in more detail below. Summarization of Patient History Time Period304 All of the patient data for a patient over time is called the patient history. This patient history is summarized over a selected time period304. For a patient, the history can be summarized over a longer or shorter Time Period (TP)304than other patients. There are many ways to define the time period. The time period can be, for example, the entire lifetime from birth up to a certain date. The time period can be, for example, a specific period between two fixed time points. The time period can be a time period anchored on one event or between two events, for example, between two doctor visits, or a time period before, or after, or around a surgical operation. The time period can be the union of multiple periods that are disjoint. History Representation Generally, a patient history is summarized by mapping patient data into an N-dimensional space, such as an N-dimensional patient vector representing the patient. The mapping, in general, reflects the prevalence of certain characteristics, whether medical events, medical instances, or other patient data, in the patient history. Each characteristic of the patient history to be considered is a dimension of the N-dimensional space. The value for a given patient for that characteristic represents the prevalence or relative prevalence of that characteristic in the patient's history. Note that the patient history summarization for a patient may change over time depending on how the time period304is defined, and due to the fact that patient histories change over time as patient data is added. Considering an implementation in which each patient medical history over the time period304is a sequence of codes, one summarization of a patient history is a patient vector. Each medical instance can be one of the N dimensions of the patient vector. Given such a patient vector, the patient history can be summarized in several ways. For example, the summarization of the patient history in the patient vector can be one count per member of the finite set of medical instances. If a certain medical instance appears k times in the patient history, then the corresponding position of that medical instance in the vector for that patient has the value k. Another summarization may include computing a time weighted sum of each medical instance, where time is relative with respect to an anchor date. For example, the anchor date may be the date of an observation in the patient history. Another summarization may include prevalence of a medical instance in the patient history relative to the prevalence of the medical instance in the collective patient history of a large patient population, of which the patient of interest is a member. Let the summarization include N summary components as described above. Thus, the patient representation is a N-dimensional History Representation Vector (N-dHRV). Thus, for the patients in the training cohort, the patient history summarization module306outputs, for each patient, a point or patient vector in an N-dimensional space, as indicated at312. Enrichment with Demographic, Genotypic, and Lifestyle Data In one implementation, the medical information of the patient can be augmented with additional facts such as demographic information, genotypic information, or lifestyle information, or any combination of these. Each one of these components can be converted to a Euclidean vector representation in order to be added on to the N-dHRV. While the term N-dHRV is used herein, this term also includes additional patient descriptors that may not vary over time, in addition to those that do vary over time, such as age or the summary components described above. Sub-Cohort Derivation A set of patients is selected as the training cohort300. The training cohort is chosen to satisfy use-case criteria such as the type of patient for which subtypes will be derived. One example is the set of patients who have certain conventional diagnosis codes in their medical history such as diabetes mellitus or certain demographic characteristics such as age. Another example is the set of patients for whom there is a certain confidence in the completeness of their medical history data available in the patient database, such as a minimum of enrollment to a health care plan. Given the training cohort300, medical instances302, and time period304, the patient vectors for the patients in the training cohort can be computed, which then can be segmented into sub-cohorts. As an example, for each patient in the training cohort: Step 1. Assign a time period TP304for each patient in the TC, over which the N-dHRV312will be derived. In one implementation, the TP is identical among all patients. The TP could be defined by a fixed start date and a fixed end date, e.g., Jan. 1, 2015-Dec. 31, 2015. Or it could be the union of two or more fixed intervals in their history, e.g., the union of the interval Jan. 1, 2013-Dec. 31, 2013 and the interval Jan. 1, 2015-Dec. 31, 2015. In another implementation, the TP can differ in length among patients. One example is that the beginning of the TP is anchored at a specific event, e.g., on the day of a surgical operation. The end of the TP could be at a fixed time post the beginning of the TP, e.g., 30 days after the operation. The end of the TP in this example also could be anchored related to a specific event, e.g., on the day of hospital discharge after the surgical operation. The latter would generally result in TP's of varying length over patients in the TC. In that case, the more appropriate summarization of patient history might be a summarization based on MI prevalence as opposed to counts. Another example is that the TP covers the entire patient history of each patient. Or other TP definition methods which result in unequal, varying TP lengths for over patients in the TC. Again, in this case MI prevalence summarization might be the more appropriate summarization of patient history as it would allow equitable comparisons between different patients. Step 2. Now that there is a TP304associated with/attached to each patient in the TC, the N-dimensional History Representation312for each patient is generated on the basis of the MI present in the TP and the selected way of generating the History Representation. The N-dHRV is generated for each patient in the TC. The entire TC is now represented as a set of points (312) in the N-dimensional Euclidean space R{circumflex over ( )}N. The TC along with all its history that is used for subtype derivation is mapped onto the N-dimensional Euclidean space R{circumflex over ( )}N. Step 3. The set of N-dHRV data points in R{circumflex over ( )}N representing the entire training cohort allows sub-cohorts to be derived by segmenting the R{circumflex over ( )}N dataset by a segmentation module314which outputs descriptions of the sub-cohorts (116). One way of performing this operation is by using Unsupervised Learning methods from the fields of Machine Learning, Statistical Learning, Artificial Intelligence, Deep Learning or combinations thereof. Unsupervised Learning refers to the use of clustering algorithms to optimally split up R{circumflex over ( )}N into subspaces. The number of resulting subspaces is either pre-specified by the user or optimally selected by the clustering algorithm, depending on the use case and/or the algorithm. There is a large variety of clustering algorithms. Examples include k-means, k-medians, Expectation Maximization clustering using Gaussian Mixture Models, Agglomerative Hierarchical Clustering, Density-Based Spatial Clustering of Applications with Noise (DBSCAN), Deep Embedded Clustering and many others. Each one of these algorithms can be used to derive MI's as described above. With some algorithms, the result in a number of hypersurfaces which serve as boundaries of the various subspaces. Another way of performing the R{circumflex over ( )}N segmentation is by using Supervised Learning algorithms, whereby a known outcome is available for each patient in training cohort and furnished to an algorithm along with the N-dHRV. Supervised Learning algorithms associate the N-dHRV with the known outcomes. In that way, the Supervised Learning algorithms provide implicit segmentation of R{circumflex over ( )}N. There are possibilities for transforming such implicit segmentations into explicit segmentations such as those produced by Unsupervised Learning algorithms. Additionally, other algorithms from the fields of Artificial Intelligence, Machine Learning, Deep Learning, Reinforcement Learning, Expert Systems, Bayesian Inference can be used to generate R{circumflex over ( )}N segmentations. Each R{circumflex over ( )}N sub-segment contains a sub-cohort of the training cohort. The set of patients whose N-dHRV belongs to the i-th sub-segment constitute the i-th patient sub-cohort. Each R{circumflex over ( )}N sub-segment is well defined by quantitative relationships between each variable in the N-dHRV. As each dimension of the N-dHRV represents actual phenotypic features of patients, the mathematical relationships which define the sub-segment in turn are a subtype definition (118) corresponding to that sub-cohort. A patient's phenotypic data at a certain time, when transformed into a point of the N-dHRV space, assigns the patient to one of the R{circumflex over ( )}N sub-segments which have been derived based on the patients in the training cohort. Patient membership in a sub-segment of R{circumflex over ( )}N amounts to membership of that patient in a specific subtype. N-dHRV sub-segments are by definition directly linked to patient subtypes. When there is a specific cohort of patients, then patient membership to subtypes result in patient sub-cohorts that correspond to each subtype. A patient's membership in a specific subtype can be dynamic: this membership is associated not only with the patient/individual but also with the specific time period304over which the patient N-dHRV312is computed. Patient subtype membership can be time dependent: when the time period changes (for example, patient subtype membership is considered at different times with a fixed length of time period), the same individual patient may belong to different subtypes. This depends on the patient's history over the time period that is used to compute subtype membership at any given time. Distributed Sub-Cohort Membership In the description so far, an implicit assumption is that a given patient at a given time belongs to a single specific sub-cohort. However, this concept can be expanded to include distributed definition of sub-cohort membership. This expansion can be implemented using the concept of Membership Vectors (MV). The MV of a patient over a time period TP is a vector comprising as many elements as the number of sub-cohorts. Each element is a metric that represents the degree of membership to a specific sub-cohort. In the case where membership is strictly confined to a single sub-cohort, the MV could be designed to include just one element that is non-zero, the element that corresponds to the sub-cohort where the patient fully belongs. The rest of the elements could be 0. There are many ways to assign membership degrees. One example includes computing inverse Euclidean distance between the N-dHRV of the patient from each of a sub-cohort centroid. Another example is the outcome of probabilistic Unsupervised Learning models such as Gaussian Mixture Models or Dirichlet Mixture Models as examples. In the case of probabilistic clustering (occasionally also referred to as soft clustering), the resulting clusters are characterized by a combination of statistical measures such as center (mean) and covariance. The clusters are probability distributions and each patient is assigned a probability of belonging to (being characterized by) each cluster. In this case one could assign, deterministically, a single sub-cohort membership to the patient as the sub-cohort of highest probability of belonging to. There are many more ways in which MV can be computed. The advantage of distributed membership to sub-cohorts and subtypes is that we allow the analysis to consider proximity of the patient to multiple subtypes. This may allow a more complete view of the patient, by means of the multiple subtypes with which the patient has commonality. Outcomes Per Sub-Cohort As noted above in connection with the description ofFIGS.1and2, given a set of sub-cohorts for which outcome data is available for patients in those sub-cohorts, it is possible to compute sub-cohort level outcome statistics. The outcome data may represent actual outcomes or predicted outcomes or a combination of both. Thus, the sub-cohort outcome analysis module130can determine whether the sub-cohort level outcome statistics for one sub-cohort are different from sub-cohort level outcome statistics for other cohorts or known norms. As an example, if an average outcome of a first sub-cohort is different than an average outcome of a second sub-cohort, then there may be a characteristic of the patients in the first sub-cohort which suggests there is a medically-interesting subtype represented by this sub-cohort. By considering different kinds of outcome data and outcome statistics, the computer system can assist in exploring connections between subtypes and patient outcomes. Turning now toFIG.4, an example implementation of a sub-cohort outcome analysis module130will now be described. This module accesses data describing the sub-cohorts114and accesses outcome data106. Given N sub-cohorts, a statistics processing module400accesses, for each sub-cohort, the available outcome data for each patient in the sub-cohort, to computes outcome statistic402-1, . . .402-N for the respective sub-cohort. Such sub-cohort level outcome statistics can include, but are not limited to, one or more of average outcomes, outcome rates, or expected average outcome, or any other sub-cohort level outcome statistics. A user interface module404can access the outcome statistics402-x,402-y, . . . , for one or more sub-cohorts x, y, . . . , to allow a user to visualize the outcome statistics. Such visualization may be provided by generating display data406including a graphical representation of such outcome statistics and presenting the display data on a display an interactive manner. For example, based on user input408, the user interface module can select one or more sub-cohorts and the outcome statistics to be visualized. The user interface module may allow a visual, side-by-side comparison of the outcome statistics. The user interface module may perform computations to quantify this comparison. A result of such an analysis can be a selection of a sub-cohort that is medically interesting, by virtue of the fact that the sub-cohort has outcome statistics that are meaningfully different from the outcome statistics of other groups of patients, such as other sub-cohorts, the general population, or the training cohort, or other known norms for outcome statistics. With this module130, each sub-cohort can be associated with a certain rate of Medical Outcome. For example, the number of patients within a sub-cohort who will have a hypoglycemic hospitalization episode within 12 months after the end of the TP as a percentage of total patients in the sub-cohort defines a sub-cohort level medical outcome. This rate is called herein the Sub-Cohort Level Outcome. Possible outcomes include present or future medical episodes, development of new conditions, expenditures and other possible outcomes. Sub-Cohort Level Outcomes can be derived for multiple Medical Outcomes of interest. Sub-Cohort Membership-Based Outcome Predictive Model Sub-Cohort Level Outcomes are defined and computed based on the hypothesis that such outcomes are a property of the sub-cohort. The reasoning lies upon the very nature of generating sub-cohorts. Every patient in a sub-cohort has:a. similar phenotypic profile to every other patient in the same sub-cohort based on his/her medical history; andb. less similar profile to patients in different sub-cohorts than to patients in the same sub-cohort. Consider now a patient-level predictive model where the predicted probability of an outcome for a specific patient is the sub-cohort based outcome of the sub-cohort in which the patient belongs. Since predictive models map a profile to a probability of outcome, sub-cohort based predictive modeling is expected to perform well as outcome predictor on the patient level. To quantify and confirm predictive performance on a patient level the following steps can be performed:a. Split the TC into two sets, the Model Development Set (MDS) and the Out-of-Sample validation (OOS) set;b. Identify sub-cohorts in the manner described herein using only the patients in MDS;c. Compute the sub-cohort level outcome for each sub-cohort, based on the MDS data;d. For each patient in the OOS, identify the sub-cohort (referring to the sub-cohorts of item 3 above) to which the patient belongs, and assign the sub-cohort level outcome as the predicted/estimated outcome for the specific patient;e. Using the actual (known) outcome and the predicted/estimated outcome for each patient in OOS, compute predictive model Out-of-Sample performance. More generally, such division of the TC into MDS and OOS can allow us to evaluate generalizability of any conclusions made using the derivation of sub-cohorts, subtypes and medically interesting subtypes. For example, if a certain medical instance enjoys high relative prevalence within a certain sub-cohort in relation to the rest of the MDS, one can use the corresponding sub-cohort of the OOS and deduce whether the same medical instance enjoys high relative prevalence. If so, this lends high confidence that the conclusion of the medical instance-related derivation and analysis within the MDS is generalizable to broader patient populations. It thus lends high confidence to the statement that the corresponding subtype is characterized by high relative prevalence of the certain medical instance. As another example, if a certain outcome is relatively higher within a certain sub-cohort in relation to the rest of the MDS, one can use the corresponding sub-cohort of the OOS and deduce whether said outcome is relatively high. If so, this lends high confidence that the conclusions of the outcome assessment and analysis within the MDS are generalizable to broader patient populations. It thus lends high confidence to the statement that the corresponding subtype is characterized by relatively high outcome. All analyses described herein in the context of sub-cohorts can be performed in the context of the MDS for derivation and OOS for validation and assessment of generalizability, even if not explicitly stated herein. Characterization of Sub-Cohorts and Interpretability This approach to classification of medical conditions provides ways to characterize cohorts of patients which allow human users to understand the special character of each sub-cohort in a transparent manner, unlike Machine Learning, Deep Learning, Artificial Intelligence solutions which result in opaque, “black box” solutions. To arrive at such a characterization, in the example implementation above, the prevalence of each medical instance within the sub-cohort is computed, relative to the prevalence of the medical instance in the entire training cohort. One way to define and compute such relative prevalence is to count the number of times that the medical instance is part of all patient data in the sub-cohort as well as the number of times that the medical instance is part of all patient data in the training cohort and divide the two numbers. There are several ways and computations that the relative prevalence of a medical instance in a sub-cohort can be evaluated. A sub-cohort identified using the methodology described herein could have high relative prevalence in a few medical instances. Such medical instances with a high relative prevalence provide the special character of the sub-cohort. For example, a sub-cohort of diabetic patients may have high relative prevalence of insulin medications. Such sub-cohort thus includes the set of patients that are distinguished by the rest of the diabetic population due to their elevated intake of insulin medications. Additionally, there could be cases where the unique character of a sub-cohort is provided by low relative prevalence in some medical instances, or by a mix of high relative prevalence in some medical instances and low relative prevalence in some other medical instances. Additionally, the degree by which each sub-cohort differs by other sub-cohorts along the direction of any medical instance is precisely quantified at the sub-cohort level. Assigning Interventions from a Library to Sub-Cohorts The capability to interpret sub-cohorts on the basis of MI relative prevalence, allows medical experts to assign interventions on different sub-cohorts. Consider the example of the diabetic sub-cohort with high relative prevalence of insulin intake. It turns out that this sub-cohort is also associated with significantly higher than average rate of future hypoglycemic episodes. Therefore, action can be taken to alert these patients' physicians about their high intake of such medications and to consider the possibility of reducing their prescriptions of such. In some implementations, it might be identified that these patients correspond to certain physicians who tend to over prescribe such medications. In that case, action can be taken to advice these physicians to regulate their prescriptions. Furthermore, in cases such as the elevated insulin intake sub-cohort, precise quantification of sub-cohorts may allow detailed guidelines as to the recommended quantities of medications that should be prescribed. In the general case, possible interventions can be considered a Library of Medical Interventions. Such a Library can be literally and officially developed and maintained, or it can more abstractly indicate the collective expertise of medical professionals, researchers and experts in the field. The capability to characterize and describe sub-cohorts in terms of MI prevalence allows medical experts to assign interventions specific to types and subtypes in order to manage patient health. Additionally, the matching of high relative prevalence MIs and interventions could potentially be provided by an engineered Expert System designed and trained using methods from the fields of Artificial Intelligence. An example of display data406for an interactive user interface module404is illustrated inFIG.7. In this snapshot of the interactive process, the user has selected a display of four different sub-cohorts of the Training Cohort (or, alternatively, the Model Development Set (MDS) or the Out-Of-Sample validation (OOS) Set). In this example, the Training Cohort is a set of patients with at least two Systemic Lupus Erythematosus diagnoses in their medical history. The outcome of interest is mortality over the 12 months immediately following the time period over which the medical data has been used to generate the patient vector. The system displays the Outcome Relative Prevalence (defined as the ratio of 1-year mortality rate within the sub-cohort divided by 1-year mortality rate within the Training Cohort). The user has selected to display 10 top Medical Instances, in descending order of Relative Prevalence of the Medical Instance (to be defined in the sequel) from the patient history among patients in each sub-cohort. Each horizontal block represents one sub-cohort. Each block includes 10 boxes, one per Medical Instance for the 10 MI's. At the top of each sub-cohort block is the count of patients in it. Each box includes 4 quantities: the code of the Medical Instance (e.g., 89 in the top left most box), the Relative Prevalence of the Medical Instance (prevalence, as in average number of occurrences of the MI in patient history, among patients in the sub-cohort divided by prevalence over the Training Cohort), the Sub-Cohort Frac(tion) (percentage of patients in the sub-cohort with at least one occurrence of the MI in their medical history) and the Overall Frac(tion) (percentage of patients in the Training Cohort with at least one occurrence of the MI in their medical history who belong to the sub-cohort). The intensity of the shading of the boxes is proportional to the Relative Prevalence of the Medical Instance. Although not shown in the image, the user is shown the composition of the corresponding Medical Instance (which medical events comprise the MI) when the user hovers the mouse over a box. This display allows the user to gain insights on sub-cohorts, identify sub-cohorts for further validation, and ultimately decide which of these sub-cohorts correspond to medically interesting subtypes. Identifying Sub-Cohorts with Effective Treatments and Pathways In the same way that a sub-cohort in which patients with an elevated risk of an adverse outcome can be identified, understood, quantified, and targeted for mitigating intervention, other sub-cohorts can be characterized by relatively desirable outcome rates. With such sub-cohorts, medical experts have the opportunity to identify medical or lifestyle practices with high relative prevalence within the sub-cohort. This allows the creation of hypotheses for optimal treatment which could be translatable to quantified protocols. A specific example is in the case of drug discovery, development, and testing. While current disease or health condition definitions are broad and heterogenous, as described earlier, when a drug or device or other treatment is developed and tested and submitted for regulatory approval, it may be required to list the specific indications for which it is intended to be used. A more clear, precise and mathematical description of subtypes and their relationship to specific outcomes permits a specific identification of the patients for whom a drug or treatment is being developed, for whom it will work, how well it will work, and with what risks. This improves both the regulatory process and how drugs, devices, procedures, and treatments are selected for individual patients. Hierarchies of Subtypes The training cohort (TC) has been divided in a number of sub-cohorts each of which includes patients with similar phenotypic characteristics. These sub-cohorts can be used to define patient subtypes. There may be some use cases where the number of generated subtypes is too high. One example includes cases where there is a multitude of subtypes with too small membership (number of patients) in cohorts of interest. The use case may include broader subtypes, each resulting in larger patient sub-cohorts, so as to apply a smaller number of interventions to larger numbers of patients. In such a case, a merging of subtypes is a solution. However, merging of subtypes should be carefully done in order to ensure that the subtypes that get merged are related to each other. In other words, the resulting merged subtypes should still include sets of patients that are similar to each other more than they are similar to patients in other merged subtypes. The methodology can be altered to generate TC sub-cohorts (which are then used to define patient subtypes). One way to accomplish this objective is by using a methodology similar to the one used to generate MI's that are groups of codes. One of these ways is to generate merged sub-cohorts of TC that are related to each other via frequent co-occurrence in patient histories. In fact, a patient history can be represented as a sequence of periods TP which may or may not overlap with each other. Each patient-TP combination is then mapped to a certain subtype among the set of subtypes that have already been generated, which can now be merged into broader subtypes (the patient during the period TP belongs to subtype k). A sequence of TP's is defined by the starting time of each TP. If the beginning of TP1 is earlier than the beginning of TP2, then TP1 precedes TP2 in the sequence. Note that the end of TP1 may be later in time than the beginning of TP2. In other words, TP1 and TP2 may overlap. In the above manner, sequences of TPs can be generated for each patient and these sequences are mapped to subtypes. Consequently, a patient history can be represented as a sequence of subtypes. The co-occurrence relation-based methodologies also can be used to lead to the creation of MI's. One way is to use Hierarchical Clustering approaches, such as Agglomerative Hierarchical Clustering. Such methods generate a hierarchy of sub-segments in the N-dHRV and the number of R{circumflex over ( )}N sub-segments, TC sub-cohorts, and patient subtypes can be varied. Another concern could be that the number of subtypes is too low. Such is the case when an objective is to identify highly specific subtypes, resulting in relatively smaller sub-cohorts. For example, it is possible to find subtypes which are distinctly characterized by rare conditions or unusual excesses in intake of some medication, etc. In this case, one interest would be to have flexibility in allowing higher number of subtypes or sub-cohorts. Various techniques could be used for that. Hierarchical clustering approaches can be used either in the form of the Agglomerative Hierarchical Clustering algorithm or other techniques. Mathematical, Quantitative Definition of Medical Conditions Many associations between patient profile characteristics and outcomes are well understood directionally but not quantitatively. In the elevated insulin intake example, it is generally known that elevated insulin intake increases the risk of some individuals with Type II diabetes suffering a future hypoglycemic episode, but it is not well understood what more specifically and quantitatively defines and separates those most predisposed individuals and whether they constitute a discernible subtype of diabetes. This methodology is applicable for identifying sub-cohorts within large patient populations as well as for typing or subtyping individuals to classify them within particular sub-cohorts for better understanding of the likelihood of progression, improvement, and discrete future outcomes, as well as potential efficacious treatments. Reliable associations can be provided due to processing large amounts of patient data. The definition of each subtype is fully quantified. Given a patient and a TP, there is a deterministic way to assign subtype membership (whether single subtype or distributed). Each patient at each time has a subtype membership, this is a property of the patient. By way of his or her subtype membership, the patient is also associated with quantified subtype level outcome measures for various outcomes. Subtype membership is a precise mapping between patient profile and set of subtypes. The combination of subtype membership and subtype outcome, as quantified using the TC sub-cohort outcome rates and statistics, allows measure driven medical conditions to be defined. A computer system classifies patients and their state of health or conditions or diseases in this way, by classifying patients in subtypes which are characterized by phenotypic, demographic, and genotypic characteristics and conditions as combination of subtype membership and subtype level outcome. Note that a variety of outcomes can be associated with each subtype. When a subtype has elevated rates of an adverse outcome, the combination works both as a diagnostic of the subtype-outcome condition as well as a way of assigning intervention protocol. In summary, the combination of observations and events and biological findings and how they relate mathematically to each other and to the outcome is how the medical condition is defined. The medical condition definition provides the utility of treatment to mitigate adverse outcomes. Mathematical, Quantitative Definition of Efficacious and Safe Drugs, Devices, Procedures, Treatments, Pathways and Protocols The methodology described herein is applicable at least for identifying patient subtypes and, consequently, sub-cohorts within large patient populations, with better understanding of potentially efficacious treatments that result in improved outcomes. By processing large amounts of patient data, the computer system can provide reliable associations between treatments and outcomes for subtypes of patients that exhibit similar patterns of symptoms, laboratory measurements, image generated understanding of underlying physiology, history of undergone procedures, demographic and genotypic characteristics while differing in certain components of their undergone treatment. These subtypes can be investigated for particular underlying biological processes for drug development. They can be targeted with available and new treatments for the specific impact of such treatments on known outcomes. They can be included in regulatory filings to specifically identify which patients a specific drug or device is intended to treat and with what anticipated outcomes. They can be incorporated into computer systems that receive or contain health information to identify a subtype for a specific patient, to help to plan or administer or approve any of an intervention, treatment, procedure, test, drug, device, pathway, lifestyle change. Subtypes also can be associated with a library of interventions which can be prescribed to patients with those subtypes. The same approach can be used to identify specific subtypes to target for drug development or other treatment or intervention development or matching. The computer system thus identifies medical protocols along with the patient subtypes that, when subjected to the protocol, show positive response. This approach to using mathematical relationships to describe types and subtypes of conditions or diseases also may make the regulatory approach to approval of drugs and devices clearer as treatments would be applicable to a specific subtype and approved to achieve a specific modification in the outcome of interest. Representation of Subtype as a String With a library of medical instances, each subtype can be uniquely, quantitatively, and mathematically characterized as a combination of a. a mapping which maps patient data for a patient into an N-dimensional patient vector and b. a subtype definition in the N-dimensional space. An example characterization is the following. Each of the techniques described above to generate subtypes, provides a mathematical relationship that defines patient membership in the subtype. For example, in an implementation where membership is defined by minimum Euclidean proximity to a subtype centroid in R{circumflex over ( )}N, this relationship is defined as the centroid whose Euclidean distance from the patient N-dHRV is lowest. In an implementation where membership is distributed, the degree of membership is identified as a function F of distance from subtype centroids in R{circumflex over ( )}N. A suitable class of F functions includes, but is not limited to, scalar functions of scalars that are monotonically decreasing. In both these implementations, the centroid of a subtype is a single point in the N-dHRV which is derived by the methodology described herein. Different implementations from the above two examples would involve different membership mathematical relationships. The membership mathematical relationship uses a set of quantities. In the above example, and in the case where M subtypes have been derived, the set of quantities includes N-coordinates for each one of the M subtype centroids. The set of all these quantities for the N coordinates for a centroid can be appropriately pulled together into a string which, along with the mathematical relationship that ties the quantities together, uniquely defines a subtype. Referring now toFIG.8, an illustrative example of data structures for storing information in the classification system to represent subtypes will now be described. Generally, a subtype is characterized by a mapping802and a subtype definition800. The subtype definition is a quantitative representation of the subtype which can be applied to an N-dimensional patient vector representing a patient to determine whether the patient belongs to the subtype. The mapping is a set of operations that transform patient data into the N-dimensional patient vector. The N-dimensional patient vector is a summary of the patient data. Each of the N dimensions represents a kind of data found in patient data. The value for any given dimension in the patient vector for a patient represents the prevalence of that kind of data in that patient's data. Given a mapping to transform patient data into a patient vector of N dimensions, and a subtype definition, patient data for any patient can be transformed, using the mapping, into a patient vector in the same N dimensions for which the subtype definition is defined, and it can be determined, by applying the subtype definition to the patient vector, whether that patient belongs to the subtype. InFIG.8, as a reference, an illustrative N-dimensional patient vector840is shown, having values for each of N dimensions850-1,850-2, . . . ,850-N. The mapping800is represented by a data structure that stores, for each of N dimensions820-1,820-2, . . . ,820-N, data defining a respective operation (e.g.822-1) to be applied to patient data that generates a value for a corresponding dimension (e.g.,850-1) of a patient vector. The format of the data defining the operation depends on the implementation, such as the nature of the patient data represented by each dimension, and how prevalence is determined from the patient data, examples of which are provided above. Other information can also be provided about each dimension, such as text for a human-readable description or explanation of the dimension (e.g.,824-1), or other information (e.g.,826-1). Data representing a time period830also can be stored if the mapping applied a time period to summarize patient data (as in some implementations described above). The subtype definition802is represented by a data structure that stores query parameters812and logic814. The logic814comprises any data that indicates an operation to be performed to process a patient vector. Query parameters812are any data that are used by the operation on the patient vector. The format of the query parameters and logic depends on the implementation. There is a wide variety of possible implementations of a data structure for the subtype definition. In one implementation, as described above, a result of identifying sub-cohorts is sets of coordinates of centroids describing each sub-cohort in the N dimensions. In some implementations, the query parameters812can include this set of centroids, and the logic814can include an indication of a similarity metric to be computed between a patient vector and each centroid. Example similarity metrics include, but are not limited to, Euclidean distance and squared Euclidean distance. A wide variety of measures of distance or similarity are available to be used. A patient can be considered belonging to the subtype with the centroid closest to the patient vector for the patient. It should be understood that the data structures800and802are illustrated separately for ease of explanation, but can be implemented in a single data structure, or more data separate structures, depending on the implementation. There is a wide variety of possible implementations of data structures to represent mapping of patient data to patient vectors and to represent subtype definitions to apply to such patient vectors. Subtype Membership Detection After subtype definitions and associated mappings for medically interesting subtypes are stored as subtypes, this collection of subtypes becomes a classification system for medical conditions. The classification system for medical conditions is defined by the set of quantitative definitions of the subtypes. Each subtype has a subtype definition defined in an N-dimensional space which determines, given patient data for a patient, whether the patient belongs to the subtype. The subtype definition has an associated mapping defining how patient data is mapped to a patient vector representing the patient in the N-dimensional space in which the subtype is defined. Referring toFIG.5, the subtype membership detector120ofFIG.1will now be described in more detail. Note that the N dimensions of patient vectors, both what they represent and how values are computed, are the same in both the derivation and application of a subtype definition in N-dimensions. If the computer system uses an implementation such as shown inFIG.3which uses medical instances to derive subtypes, then a similar patient history summarization module606, medical instances602, and time period604are used to apply the subtype definition to other patient data124. InFIG.5, patient history summarization module606, medical instances602, and time period604map patient data for a patient into a point630in the N-dimensional space in which the subtype is defined. A subtype test module620applies the subtype definitions118to the point630to determine whether the patient represented by the point630is a member of the subtype. This indication of subtype membership is output at600. Reduction in Size of Subtype Definition In an implementation such as described above, in which a subtype definition is represented as a string of data defining a centroid in N-dimensional space, the number of elements in this string may be very high. Often, there are important underlying patient characteristics that materially distinguish the identified, discovered subtype which may amount to a few key MI's and few key other patient characteristics. In cases like that, a definition of the subtype that involves only those material patient characteristics is a more functional, inclusive, and ultimately useful definition of the subtype. There could be many implementations for defining subtypes in this way. One implementation follows. After a subtype has been discovered and identified using the above methodology, several defining MI's and other patient characteristics of the subtype can be isolated. Such isolation can use criteria such as:a. Highest relative prevalence within the subtype (as statistically manifested within the corresponding sub-cohort of the TC); for each MI and other characteristic, the portion of patients and/or times in patient history and/or additional metrics of frequency that the characteristic occurs within the sub-cohort is computed and compared to the portion of patients and/or times in patient history and/or additional metrics of frequency that the characteristic occurs within the entire TC.b. Highest prevalence within the subtype (as statistically manifested within the corresponding sub-cohort of the TC); for each MI and other characteristic, the count of patients and/or times in patient histories and/or additional metrics of frequency that the characteristic occurs within the sub-cohort is computed.c. Lowest relative prevalence within the subtype, possibly combined with high overall prevalence within the overall TC (such would be the case that characterizes a subtype by the absence of an otherwise common characteristic within the overall TC, and the type of patient that the TC represents).d. Criteria that combine metrics from Items a, b and c above. One example set of combined criteria could be those characteristics which belong to the top M % high relative prevalence set of MI's and other characteristics as well as the top P % high prevalence set of MI's and other characteristics. This set of characteristics could be augmented with other characteristics, for example, that are at the bottom K % relative prevalence but top L % prevalence within the overall TC. In this implementation, the filtering of MI's and other characteristics results in a reduced number of characteristics that are used to identify the sub-cohorts. If an objective is to characterize subtypes based on a reduced set of MI's and other characteristics, then the description of a subtype can be confined to the reduced set of corresponding dimensions. Below are presented example implementations of dimensionality reduction: Step 1. Retain the sub-cohort of TC which corresponds to the subtype that was identified in the N-dHRV. Step 2. Retain the set of reduced number of important characteristics. Let this be a number of N1 characteristics, where N1<N. This defines a N1-dHRV (the dimensions of which are a subset of dimensions of the N-dHRV), which sits in the R{circumflex over ( )}N1 Euclidean space. In one implementation, the following steps can follow: Step 3: Produce the N1-dHRV representation of each patient in the sub-cohort that corresponds to identified subtype. Assign a label 1 to each one of these patients and associate that label 1 to their N1-dHRV. Step 4: Produce the N1-dHRV representation of every other patient in TC (all but those of the sub-cohort that corresponds to the subtype of interest). Assign a label 0 to each one of these patients and associate that label 0 to their N1-dHRV. Step 5: Steps 3 and 4 have produced a dataset in R{circumflex over ( )}N1 which has labels 0 and 1. All the datapoints are projections of patient N-dHRVs to N1-dHRVs in the lower dimensional space R{circumflex over ( )}N1. Label 1's are projections of the patients that belong to the discovered subtype. Label 0's are projections of every other patient. This allows a classifier to be trained in R{circumflex over ( )}N1 which will serve as the classifier for the generated subtype in R{circumflex over ( )}N1 (those N1 dimensions are the MI's and other characteristics along which the specific subtype differs the most from other patient subtypes). This classifier can be a good separator of the subtypes (in other words, it can have high classification performance). Step 6: This classifier is now defining a meta-subtype as follows: every patient who is classified as the original subtype using the generated classifier, is said to belong to the meta-subtype. Step 7: To confirm that the meta-subtype in N1 dimensional space is medically relevant in the same way that the subtype in N dimensions was, outcomes of interest are computed in both the patient sub-cohort that corresponds to the meta subtype as well as everyone else. There can be a significant difference in outcomes, if the entire process of reducing dimensionality has been executed appropriately. Step 8: The meta-subtype is now the subtype of interest. Step 9: The classifier which allows the meta-subtype to be defined using a mathematical description, from which a uniquely characterizing string of the meta-subtype can be derived. For example, a linear classifier with a bias term will be defined by its (N1+1) linear model coefficients along with a potential classification level cut-off which defines the meta-subtype. In the above implementation, appropriate dataset divisions for classifier development and out-of-sample validations of classifier as well as meta-subtype are implied. In some implementations, a clustering machine learning algorithm can be used to generate two clusters in the R{circumflex over ( )}N1 space, with one of the two clusters defining the meta-subtype. The following in an example. A defined population of patients with classically diagnosed systemic lupus erythematosus (SLE), for whom a broad, multi-year collection of medical facts was available (number of patients is 550,000), was processed in the manner described above. The processing yielded a library of 500 MIs that were in turn used to generate a set of 100 sub-cohorts comprised of patients grouped or distinguished by their subtypes. The resulting subtypes, in this case, are represented by a string of 50,000 total coordinates, along with the mathematical relationship of minimum proximity. Qualitatively, a medically trained observer can see that the subtypes differ in such ways as the prevalence of conditions such as glaucoma, kidney disease, and lower extremity vasculitis related effects. In another implementation, a limited set of medical instances are identified (by a user or by automated analysis) which are in highest relative prevalence (or some other alternative metric) within a certain sub-cohort, which certain sub-cohort has relatively high (or low) outcome and it constitutes a medically interesting subtype. In that case, a subtype can be defined which includes all patients who have an elevated presence of the limited set of medical instances in their medical history. The level of elevated presence could be above certain value, including the possibility of hypothesizing a subtype including all patients who have counts over 0 in all or any of the medical instances in the limited set of medical instances. Subsequently, a sub-cohort can be generated with all patients in the training cohort who belong to the newly defined subtype. Within this sub-cohort, a measurement of one or more outcomes and an evaluation of such outcome or outcomes rates can follow. If it is deemed that any such outcome is higher or lower than corresponding outcome in the overall patient population, or in the training cohort, or in other sub-cohorts in the population, then the newly defined subtype could constitute a medically interesting subtype. If the training cohort has been separated in MDS (used to derive sub-cohorts and definitions of subtypes) and OOS (used to assess generalizability of MDS findings), then outcome can be evaluated on the MDS and OOS separately and if the outcomes follow similar trends of being relatively higher or relatively lower within both MDS and OOS, this provides higher confidence in the validity of the newly defined subtype as a medically-interesting subtype. An example of a subtype characterized by a small number of medical instances and derived in the manner described above is now presented. In this example, the training cohort is a set of patients with at least two Systemic Lupus Erythematosus diagnoses in their medical history. The outcome of interest is mortality over the 12 months immediately following the time period over which the medical data has been used to generate the patient vector. The resulting sub-cohort from the analysis includes all patients who have total occurrence count greater than 0 in each of two medical instances, coded as Medical Instances 84 and 282, over a period of 1 year prior to the time of computation of subtype membership. The list of medical event codes which roll up to the each one of these medical instances are provided in the tables in Appendix I (MI84) and Appendix II (MI282), which form a part of this application and are hereby incorporated by reference. One can see that MI 84 includes a set of diagnosis and procedure codes related to heart condition. The MI 282 includes a set of diagnosis and procedure codes associated with providing special care or nursing services. The outcome for this sub-cohort (1-yr mortality rate) is 516% higher than 1-yr mortality rate among the entire training cohort. Therefore, it constitutes a medically interesting subtype. Hypotheses Using outcome data, the computer system also can assist users in exploring connections between subtypes and outcomes and develop hypotheses about outcomes for patients of a subtype. A hypothesis identifies a connection between a set of facts from patient data and a corresponding outcome and is relevant to explaining why patients in one sub-cohort exhibit different outcomes than patients in another sub-cohort. Such a hypothesis can be tested through further medical research. Having now described an example implementation,FIG.6illustrates an example of a computer with which components of the computer system of the foregoing description can be implemented. This is only one example of a computer and is not intended to suggest any limitation as to the scope of use or functionality of such a computer. The system described above can be implemented in one or more computer programs executed on one or more such computers as shown inFIG.6. The computer can be any of a variety of general purpose or special purpose computing hardware configurations. Some examples of types of computers that can be used include, but are not limited to, personal computers, game consoles, set top boxes, hand-held or laptop devices (for example, media players, notebook computers, tablet computers, cellular phones including but not limited to “smart” phones, personal data assistants, voice recorders), server computers, multiprocessor systems, microprocessor-based systems, programmable consumer electronics, networked personal computers, minicomputers, mainframe computers, and distributed computing environments that include any of the above types of computers or devices, and the like. With reference toFIG.6, a computer500includes a processing system comprising at least one processing unit502and at least one memory504. The processing unit502can include multiple processing devices; the memory504can include multiple memory devices. A processing unit502comprises a processor which is logic circuitry which responds to and processes instructions to provide the functions of the computer. A processing device can include one or more processing cores (not shown) that are multiple processors within the same logic circuitry that can operate independently of each other. Generally, one of the processing units in the computer is designated as a primary processor, typically called the central processing unit (CPU). A computer can include coprocessors that perform specialized functions such as a graphical processing unit (GPU). The memory504may include volatile computer storage devices (such as a dynamic or static random-access memory device), and non-volatile computer storage devices (such as a read-only memory or flash memory) or some combination of the two. A nonvolatile computer storage device is a computer storage device whose contents are not lost when power is removed. Other computer storage devices, such as dedicated memory or registers, also can be present in the one or more processors. The computer500can include additional computer storage devices (whether removable or non-removable) such as, but not limited to, magnetically-recorded or optically-recorded disks or tape. Such additional computer storage devices are illustrated inFIG.6by removable storage device508and non-removable storage device510. Such computer storage devices508and510typically are nonvolatile storage devices. The various components inFIG.6are generally interconnected by an interconnection mechanism, such as one or more buses530. A computer storage device is any device in which data can be stored in and retrieved from addressable physical storage locations by the computer by changing state of the device at the addressable physical storage location. A computer storage device thus can be a volatile or nonvolatile memory, or a removable or non-removable storage device. Memory504, removable storage508and non-removable storage510are all examples of computer storage devices. Computer storage devices and communication media are distinct categories, and both are distinct from signals propagating over communication media. Computer500may also include communications connection(s)512that allow the computer to communicate with other devices over a communication medium. Communication media typically transmit computer program instructions, data structures, program modules or other data over a wired or wireless substance by propagating a signal over the substance. By way of example, and not limitation, communication media includes wired media, such as metal or other electrically conductive wire that propagates electrical signals or optical fibers that propagate optical signals, and wireless media, such as any non-wired communication media that allows propagation of signals, such as acoustic, electromagnetic, electrical, optical, infrared, radio frequency and other signals. Communications connections512are devices, such as a wired network interface, or wireless network interface, which interface with communication media to transmit data over and receive data from signal propagated over the communication media. The computer500may have various input device(s)514such as a pointer device, keyboard, touch-based input device, pen, camera, microphone, sensors, such as accelerometers, thermometers, light sensors and the like, and so on. The computer500may have various output device(s)516such as a display, speakers, and so on. Such devices are well known in the art and need not be discussed at length here. The various computer storage devices508and510, communication connections512, output devices516and input devices514can be integrated within a housing with the rest of the computer, or can be connected through various input/output interface devices on the computer, in which case the reference numbers508,510,512,514and516can indicate either the interface for connection to a device or the device itself as the case may be. The various modules, tools, or applications, and data structures and flowcharts implementing the methodology described above, as well as any operating system, file system and applications, can be implemented using one or more processing units of one or more computers with one or more computer programs processed by the one or more processing units. A computer program includes computer-executable instructions and/or computer-interpreted instructions, such as program modules, which instructions are processed by one or more processing units in the computer. Generally, such instructions define routines, programs, objects, components, data structures, and so on, that, when processed by a processing unit, instruct or configure the computer to perform operations on data, or configure the computer to implement various components, modules or data structures. In one aspect, an article of manufacture includes at least one computer storage medium, and computer program instructions stored on the at least one computer storage medium. The computer program instructions, when processed by a processing system of a computer, the processing system comprising one or more processing units and storage, configures the computer as set forth in any of the foregoing aspects and/or performs a process as set forth in any of the foregoing aspects. Any of the foregoing aspects may be embodied as a computer system, as any individual component of such a computer system, as a process performed by such a computer system or any individual component of such a computer system, or as an article of manufacture including computer storage in which computer program instructions are stored and which, when processed by one or more computers, configure the one or more computers to provide such a computer system or any individual component of such a computer system. Appendix I-MI 84 codenameI42.9_d_ICD10_DiagnosisCardiomyopathy, unspecifiedI50.23_d_ICD10_DiagnosisAcute on chronic systolic (congestive) heart failureZ95.0_d_ICD10_DiagnosisPresence of cardiac pacemakerZ95.810_d_ICD10_DiagnosisPresence of automatic (implantable) cardiac defibrillatorI42.0_d_ICD10_DiagnosisDilated cardiomyopathyI47.2_d_ICD10_DiagnosisVentricular tachycardiaI48.92_d_ICD10_DiagnosisUnspecified atrial flutterI42.8_d_ICD10_DiagnosisOther cardiomyopathiesI50.42_d_ICD10_DiagnosisChronic combined systolic (congestive) and diastolic (congestive) heartfailureI48.1_d_ICD10_DiagnosisPersistent atrial fibrillationI49.5_d_ICD10_DiagnosisSick sinus syndromeI44.2_d_ICD10_DiagnosisAtrioventricular block, completeI44.7_d_ICD10_DiagnosisLeft bundle-branch block, unspecified93299_p_CPTInterrogation device evaluation(s), (remote) up to 30 days; implantablecardiovascular physiologic monitor system or subcutaneous cardiacrhythm monitor system, remote data acquisition(s), receipt oftransmissions and technician review, technical support and distributionof results93296_p_CPTInterrogation device evaluation(s) (remote), up to 90 days; single, dual,or multiple lead pacemaker system, leadless pacemaker system, orimplantable defibrillator system, remote data acquisition(s), receipt oftransmissions and technician review, technical support and distributionof results93280_p_CPTProgramming device evaluation (in person) with iterative adjustment ofthe implantable device to test the function of the device and selectoptimal permanent programmed values with analysis, review and reportby a physician or other qualified health care professional; dual leadpacemaker system93297_p_CPTInterrogation device evaluation(s), (remote) up to 30 days; implantablecardiovascular physiologic monitor system, including analysis of 1 ormore recorded physiologic cardiovascular data elements from all internaland external sensors, analysis, review(s) and report(s) by a physician orother qualified health care professionalI48.3_d_ICD10_DiagnosisTypical atrial flutter93295_p_CPTInterrogation device evaluation(s) (remote), up to 90 days; single, dual,or multiple lead implantable defibrillator system with interim analysis,review(s) and report(s) by a physician or other qualified health careprofessionalZ45.02_d_ICD10_DiagnosisEncounter for adjustment and management of automatic implantablecardiac defibrillatorZ95.818_d_ICD10_DiagnosisPresence of other cardiac implants and grafts93294_p_CPTInterrogation device evaluation(s) (remote), up to 90 days; single, dual,or multiple lead pacemaker system, or leadless pacemaker system withinterim analysis, review(s) and report(s) by a physician or other qualifiedhealth care professionalI49.01_d_ICD10_DiagnosisVentricular fibrillationZ45.018_d_ICD10_DiagnosisEncounter for adjustment and management of other part of cardiacpacemaker80162_p_CPTDigoxin; total93451_p_CPTRight heart catheterization including measurement(s) of oxygensaturation and cardiac output, when performedT82.7XXD_d_ICD10_DiagnosisInfection and inflammatory reaction due to other cardiac and vasculardevices, implants and grafts, subsequent encounterI42.2_d_ICD10_DiagnosisOther hypertrophic cardiomyopathy93284_p_CPTProgramming device evaluation (in person) with iterative adjustment ofthe implantable device to test the function of the device and selectoptimal permanent programmed values with analysis, review and reportby a physician or other qualified health care professional; multiple leadtransvenous implantable defibrillator systemI44.1_d_ICD10_DiagnosisAtrioventricular block, second degree93283_p_CPTProgramming device evaluation (in person) with iterative adjustment ofthe implantable device to test the function of the device and selectoptimal permanent programmed values with analysis, review and reportby a physician or other qualified health care professional; dual leadtransvenous implantable defibrillator systemI48.4_d_ICD10_DiagnosisAtypical atrial flutter92960_p_CPTCardioversion, elective, electrical conversion of arrhythmia; externalK0606_p_HCPCSAutomatic external defibrillator, with integrated electrocardiogramanalysis, garment typeZ45.010_d_ICD10_DiagnosisEncounter for checking and testing of cardiac pacemaker pulse generator[battery]93290_p_CPTInterrogation device evaluation (in person) with analysis, review andreport by a physician or other qualified health care professional, includesconnection, recording and disconnection per patient encounter;implantable cardiovascular physiologic monitor system, includinganalysis of 1 or more recorded physiologic cardiovascular data elementsfrom all internal and external sensors93282_p_CPTProgramming device evaluation (in person) with iterative adjustment ofthe implantable device to test the function of the device and selectoptimal permanent programmed values with analysis, review and reportby a physician or other qualified health care professional; single leadtransvenous implantable defibrillator system33249_p_CPTInsertion or replacement of permanent implantable defibrillator system,with transvenous lead(s), single or dual chamber33208_p_CPTInsertion of new or replacement of permanent pacemaker withtransvenous electrode(s); atrial and ventricular93289_p_CPTInterrogation device evaluation (in person) with analysis, review andreport by a physician or other qualified health care professional, includesconnection, recording and disconnection per patient encounter; single,dual, or multiple lead transvenous implantable defibrillator system,including analysis of heart rhythm derived data elements93288_p_CPTInterrogation device evaluation (in person) with analysis, review andreport by a physician or other qualified health care professional, includesconnection, recording and disconnection per patient encounter; single,dual, or multiple lead pacemaker system, or leadless pacemaker system93613_p_CPTIntracardiac electrophysiologic 3-dimensional mapping (List separately inaddition to code for primary procedure)Z45.09_d_ICD10_DiagnosisEncounter for adjustment and management of other cardiac device00537_p_CPTAnesthesia for cardiac electrophysiologic procedures includingradiofrequency ablation93281_p_CPTProgramming device evaluation (in person) with iterative adjustment ofthe implantable device to test the function of the device and selectoptimal permanent programmed values with analysis, review and reportby a physician or other qualified health care professional; multiple leadpacemaker system33225_p_CPTInsertion of pacing electrode, cardiac venous system, for left ventricularpacing, at time of insertion of implantable defibrillator or pacemakerpulse generator (eg, for upgrade to dual chamber system) (Listseparately in addition to code for primary procedure)00530_p_CPTAnesthesia for permanent transvenous pacemaker insertion93621_p_CPTComprehensive electrophysiologic evaluation including insertion andrepositioning of multiple electrode catheters with induction orattempted induction of arrhythmia; with left atrial pacing and recordingfrom coronary sinus or left atrium (List separately in addition to code forprimary procedure)93653_p_CPTComprehensive electrophysiologic evaluation including insertion andrepositioning of multiple electrode catheters with induction orattempted induction of an arrhythmia with right atrial pacing andrecording, right ventricular pacing and recording (when necessary), andHis bundle recording (when necessary) with intracardiac catheterablation of arrhythmogenic focus; with treatment of supraventriculartachycardia by ablation of fast or slow atrioventricular pathway,accessory atrioventricular connection, cavo-tricuspid isthmus or othersingle atrial focus or source of atrial re-entry93662_p_CPTIntracardiac echocardiography during therapeutic/diagnosticintervention, including imaging supervision and interpretation (Listseparately in addition to code for primary procedure)I42.6_d_ICD10_DiagnosisAlcoholic cardiomyopathy93641_p_CPTElectrophysiologic evaluation of single or dual chamber pacingcardioverter-defibrillator leads including defibrillation thresholdevaluation (induction of arrhythmia, evaluation of sensing and pacing forarrhythmia termination) at time of initial implantation or replacement;with testing of single or dual chamber pacing cardioverter-defibrillatorpulse generator93623_p_CPTProgrammed stimulation and pacing after intravenous drug infusion (Listseparately in addition to code for primary procedure)00534_p_CPTAnesthesia for transvenous insertion or replacement of pacingcardioverter-defibrillator33210_p_CPTInsertion or replacement of temporary transvenous single chambercardiac electrode or pacemaker catheter (separate procedure)C1892_p_HCPCSIntroducer/sheath, guiding, intracardiac electrophysiological, fixed-curve, peel-away93656_p_CPTComprehensive electrophysiologic evaluation including transseptalcatheterizations, insertion and repositioning of multiple electrodecatheters with induction or attempted induction of an arrhythmiaincluding left or right atrial pacing/recording when necessary, rightventricular pacing/recording when necessary, and His bundle recordingwhen necessary with intracardiac catheter ablation of atrial fibrillationby pulmonary vein isolationI45.5_d_ICD10_DiagnosisOther specified heart blockC1898_p_HCPCSLead, pacemaker, other than transvenous vdd single pass93279_p_CPTProgramming device evaluation (in person) with iterative adjustment ofthe implantable device to test the function of the device and selectoptimal permanent programmed values with analysis, review and reportby a physician or other qualified health care professional; single leadpacemaker system or leadless pacemaker system in one cardiac chamberD86.85_d_ICD10_DiagnosisSarcoid myocarditis93655_p_CPTIntracardiac catheter ablation of a discrete mechanism of arrhythmiawhich is distinct from the primary ablated mechanism, including repeatdiagnostic maneuvers, to treat a spontaneous or induced arrhythmia(List separately in addition to code for primary procedure)C1882_p_HCPCSCardioverter-defibrillator, other than single or dual chamber(implantable)T82.110A_d_ICD10_DiagnosisBreakdown (mechanical) of cardiac electrode, initial encounterC1733_p_HCPCSCatheter, electrophysiology, diagnostic/ablation, other than 3d or vectormapping, other than cool-tipT82.198A_d_ICD10_DiagnosisOther mechanical complication of other cardiac electronic device, initialencounterT82.111A_d_ICD10_DiagnosisBreakdown (mechanical) of cardiac pulse generator (battery), initialencounter75572_p_CPTComputed tomography, heart, with contrast material, for evaluation ofcardiac structure and morphology (including 3D image postprocessing,assessment of cardiac function, and evaluation of venous structures, ifperformed)V45.02_d_ICD9_DiagnosisAutomatic implantable cardiac defibrillator in situC1785_p_HCPCSPacemaker, dual chamber, rate-responsive (implantable)00410_p_CPTAnesthesia for procedures on the integumentary system on theextremities, anterior trunk and perineum; electrical conversion ofarrhythmiasC1777_p_HCPCSLead, cardioverter-defibrillator, endocardial single coil (implantable)C1722_p_HCPCSCardioverter-defibrillator, single chamber (implantable)93620_p_CPTComprehensive electrophysiologic evaluation including insertion andrepositioning of multiple electrode catheters with induction orattempted induction of arrhythmia; with right atrial pacing andrecording, right ventricular pacing and recording, His bundle recording427.1_d_ICD9_DiagnosisParoxysmal ventricular tachycardia33241_p_CPTRemoval of implantable defibrillator pulse generator only93286_p_CPTPeri-procedural device evaluation (in person) and programming of devicesystem parameters before or after a surgery, procedure, or test withanalysis, review and report by a physician or other qualified health careprofessional; single, dual, or multiple lead pacemaker system, or leadlesspacemaker systemT82.120A_d_ICD10_DiagnosisDisplacement of cardiac electrode, initial encounter00093873901_m_NDCMexiletine HCl Oral Capsule 150 MG93657_p_CPTAdditional linear or focal intracardiac catheter ablation of the left orright atrium for treatment of atrial fibrillation remaining aftercompletion of pulmonary vein isolation (List separately in addition tocode for primary procedure)I47.0_d_ICD10_DiagnosisRe-entry ventricular arrhythmia33284_p_CPTRemoval of an implantable, patient-activated cardiac event recorder428.42_d_ICD9_DiagnosisChronic combined systolic and diastolic heart failure33216_p_CPTInsertion of a single transvenous electrode, permanent pacemaker orimplantable defibrillatorT46.2X5A_d_ICD10_DiagnosisAdverse effect of other antidysrhythmic drugs, initial encounterC1900_p_HCPCSLead, left ventricular coronary venous system93287_p_CPTPeri-procedural device evaluation (in person) and programming of devicesystem parameters before or after a surgery, procedure, or test withanalysis, review and report by a physician or other qualified health careprofessional; single, dual, or multiple lead implantable defibrillatorsystemJ0282_m_HCPCSInjection, amiodarone hydrochloride, 30 mg33228_p_CPTRemoval of permanent pacemaker pulse generator with replacement ofpacemaker pulse generator; dual lead system33244_p_CPTRemoval of single or dual chamber implantable defibrillator electrode(s);by transvenous extractionC1895_p_HCPCSLead, cardioverter-defibrillator, endocardial dual coil (implantable)93650_p_CPTIntracardiac catheter ablation of atrioventricular node function,atrioventricular conduction for creation of complete heart block, with orwithout temporary pacemaker placement33264_p_CPTRemoval of implantable defibrillator pulse generator with replacementof implantable defibrillator pulse generator; multiple lead systemI49.02_d_ICD10_DiagnosisVentricular flutterA9560_p_HCPCSTechnetium tc-99m labeled red blood cells, diagnostic, per study dose,up to 30 millicuries93600_p_CPTBundle of His recordingT82.191A_d_ICD10_DiagnosisOther mechanical complication of cardiac pulse generator (battery),initial encounter33270_p_CPTInsertion or replacement of permanent subcutaneous implantabledefibrillator system, with subcutaneous electrode, includingdefibrillation threshold evaluation, induction of arrhythmia, evaluationof sensing for arrhythmia termination, and programming orreprogramming of sensing or therapeutic parameters, when performed93462_p_CPTLeft heart catheterization by transseptal puncture through intact septumor by transapical puncture (List separately in addition to code for primaryprocedure)T82.118A_d_ICD10_DiagnosisBreakdown (mechanical) of other cardiac electronic device, initialencounter426.0_d_ICD9_DiagnosisAtrioventricular block, completeT82.199A_d_ICD10_DiagnosisOther mechanical complication of unspecified cardiac device, initialencounter33262_p_CPTRemoval of implantable defibrillator pulse generator with replacementof implantable defibrillator pulse generator; single lead systemT82.190A_d_ICD10_DiagnosisOther mechanical complication of cardiac electrode, initial encounter33233_p_CPTRemoval of permanent pacemaker pulse generator only33263_p_CPTRemoval of implantable defibrillator pulse generator with replacementof implantable defibrillator pulse generator; dual lead system93261_p_CPTInterrogation device evaluation (in person) with analysis, review andreport by a physician or other qualified health care professional, includesconnection, recording and disconnection per patient encounter;implantable subcutaneous lead defibrillator system93640_p_CPTElectrophysiologic evaluation of single or dual chamber pacingcardioverter-defibrillator leads including defibrillation thresholdevaluation (induction of arrhythmia, evaluation of sensing and pacing forarrhythmia termination) at time of initial implantation or replacement;33235_p_CPTRemoval of transvenous pacemaker electrode(s); dual lead systemI45.3_d_ICD10_DiagnosisTrifascicular block93609_p_CPTIntraventricular and/or intra-atrial mapping of tachycardia site(s) withcatheter manipulation to record from multiple sites to identify origin oftachycardia (List separately in addition to code for primary procedure)33340_p_CPTPercutaneous transcatheter closure of the left atrial appendage withendocardial implant, including fluoroscopy, transseptal puncture,catheter placement(s), left atrial angiography, left atrial appendageangiography, when performed, and radiological supervision andinterpretation33207_p_CPTInsertion of new or replacement of permanent pacemaker withtransvenous electrode(s); ventricular93622_p_CPTComprehensive electrophysiologic evaluation including insertion andrepositioning of multiple electrode catheters with induction orattempted induction of arrhythmia; with left ventricular pacing andrecording (List separately in addition to code for primary procedure)93654_p_CPTComprehensive electrophysiologic evaluation including insertion andrepositioning of multiple electrode catheters with induction orattempted induction of an arrhythmia with right atrial pacing andrecording, right ventricular pacing and recording (when necessary), andHis bundle recording (when necessary) with intracardiac catheterablation of arrhythmogenic focus; with treatment of ventriculartachycardia or focus of ventricular ectopy including intracardiacelectrophysiologic 3D mapping, when performed, and left ventricularpacing and recording, when performedV45.09_d_ICD9_DiagnosisOther specified cardiac device in situ33223_p_CPTRelocation of skin pocket for implantable defibrillator33222_p_CPTRelocation of skin pocket for pacemakerC1779_p_HCPCSLead, pacemaker, transvenous vdd single passC1896_p_HCPCSLead, cardioverter-defibrillator, other than endocardial single or dual coil(implantable)33215_p_CPTRepositioning of previously implanted transvenous pacemaker orimplantable defibrillator (right atrial or right ventricular) electrodeC2630_p_HCPCSCatheter, electrophysiology, diagnostic/ablation, other than 3d or vectormapping, cool-tipC1721_p_HCPCSCardioverter-defibrillator, dual chamber (implantable)T82.837A_d_ICD10_DiagnosisHemorrhage due to cardiac prosthetic devices, implants and grafts,initial encounterT82.847A_d_ICD10_DiagnosisPain due to cardiac prosthetic devices, implants and grafts, initialencounter33224_p_CPTInsertion of pacing electrode, cardiac venous system, for left ventricularpacing, with attachment to previously placed pacemaker or implantabledefibrillator pulse generator (including revision of pocket, removal,insertion, and/or replacement of existing generator)92961_p_CPTCardioversion, elective, electrical conversion of arrhythmia; internal(separate procedure)33212_p_CPTInsertion of pacemaker pulse generator only; with existing single lead33213_p_CPTInsertion of pacemaker pulse generator only; with existing dual leadsJ1742_p_HCPCSInjection, ibutilide fumarate, 1 mgJ1742_m_HCPCSInjection, ibutilide fumarate, 1 mgC1786_p_HCPCSPacemaker, single chamber, rate-responsive (implantable)93619_p_CPTComprehensive electrophysiologic evaluation with right atrial pacing andrecording, right ventricular pacing and recording, His bundle recording,including insertion and repositioning of multiple electrode catheters,without induction or attempted induction of arrhythmia78494_p_CPTCardiac blood pool imaging, gated equilibrium, SPECT, at rest, wallmotion study plus ejection fraction, with or without quantitativeprocessing33229_p_CPTRemoval of permanent pacemaker pulse generator with replacement ofpacemaker pulse generator; multiple lead system33234_p_CPTRemoval of transvenous pacemaker electrode(s); single lead system,atrial or ventricularT82.119A_d_ICD10_DiagnosisBreakdown (mechanical) of unspecified cardiac electronic device, initialencounterT82.518A_d_ICD10_DiagnosisBreakdown (mechanical) of other cardiac and vascular devices andimplants, initial encounterV53.32_d_ICD9_DiagnosisFitting and adjustment of automatic implantable cardiac defibrillator93724_p_CPTElectronic analysis of antitachycardia pacemaker system (includeselectrocardiographic recording, programming of device, induction andtermination of tachycardia via implanted pacemaker, and interpretationof recordings)33206_p_CPTInsertion of new or replacement of permanent pacemaker withtransvenous electrode(s); atrial93612_p_CPTIntraventricular pacingT82.110D_d_ICD10_DiagnosisBreakdown (mechanical) of cardiac electrode, subsequent encounter33217_p_CPTInsertion of 2 transvenous electrodes, permanent pacemaker orimplantable defibrillator33218_p_CPTRepair of single transvenous electrode, permanent pacemaker orimplantable defibrillator93793_p_CPTAnticoagulant management for a patient taking warfarin, must includereview and interpretation of a new home, office, or lab internationalnormalized ratio (INR) test result, patient instructions, dosageadjustment (as needed), and scheduling of additional test(s), whenperformedT82.190D_d_ICD10_DiagnosisOther mechanical complication of cardiac electrode, subsequentencounter33214_p_CPTUpgrade of implanted pacemaker system, conversion of single chambersystem to dual chamber system (includes removal of previously placedpulse generator, testing of existing lead, insertion of new lead, insertionof new pulse generator)33240_p_CPTInsertion of implantable defibrillator pulse generator only; with existingsingle leadG8694_p_HCPCSLeft ventricular ejection fraction (lvef) < 40%93260_p_CPTProgramming device evaluation (in person) with iterative adjustment ofthe implantable device to test the function of the device and selectoptimal permanent programmed values with analysis, review and reportby a physician or other qualified health care professional; implantablesubcutaneous lead defibrillator system33227_p_CPTRemoval of permanent pacemaker pulse generator with replacement ofpacemaker pulse generator; single lead systemZ45.9_d_ICD10_DiagnosisEncounter for adjustment and management of unspecified implanteddeviceL9900_p_HCPCSOrthotic and prosthetic supply, accessory, and/or service component ofanother hcpcs\l\“ code”425.5_d_ICD9_DiagnosisAlcoholic cardiomyopathyV45.00_d_ICD9_DiagnosisUnspecified cardiac device in situV53.39_d_ICD9_DiagnosisFitting and adjustment of other cardiac deviceV43.21_d_ICD9_DiagnosisOrgan or tissue replaced by other means, heart assist device42023010501_m_NDCBrevital Sodium Injection Solution Reconstituted 500 MG996.04_d_ICD9_DiagnosisMechanical complication of automatic implantable cardiac defibrillator996.01_d_ICD9_DiagnosisMechanical complication due to cardiac pacemaker (electrode)996.61_d_ICD9_DiagnosisInfection and inflammatory reaction due to cardiac device, implant, andgraftT46.2X1A_d_ICD10_DiagnosisPoisoning by other antidysrhythmic drugs, accidental (unintentional),initial encounter93292_p_CPTInterrogation device evaluation (in person) with analysis, review andreport by a physician or other qualified health care professional, includesconnection, recording and disconnection per patient encounter;wearable defibrillator systemB33.24_d_ICD10_DiagnosisViral cardiomyopathy33286_p_CPTRemoval, subcutaneous cardiac rhythm monitor93642_p_CPTElectrophysiologic evaluation of single or dual chamber transvenouspacing cardioverter-defibrillator (includes defibrillation thresholdevaluation, induction of arrhythmia, evaluation of sensing and pacing forarrhythmia termination, and programming or reprogramming of sensingor therapeutic parameters)C2621_p_HCPCSPacemaker, other than single or dual chamber (implantable)996.09_d_ICD9_DiagnosisOther mechanical complication of cardiac device, implant, and graft93603_p_CPTRight ventricular recording93610_p_CPTIntra-atrial pacing93602_p_CPTIntra-atrial recordingT82.111D_d_ICD10_DiagnosisBreakdown (mechanical) of cardiac pulse generator (battery),subsequent encounter Appendix II-MI 282 codenameG0156_p_HCPCSServices of home health/hospice aide in home health or hospice settings,each 15 minutesG0299_p_HCPCSDirect skilled nursing services of a registered nurse (rn) in the home health orhospice setting, each 15 minutesG0300_p_HCPCSDirect skilled nursing services of a licensed practical nurse (lpn) in the homehealth or hospice setting, each 15 minutesG0151_p_HCPCSServices performed by a qualified physical therapist in the home health orhospice setting, each 15 minutes99308_p_CPTSubsequent nursing facility care, per day, for the evaluation and managementof a patient, which requires at least 2 of these 3 key components: Anexpanded problem focused interval history; An expanded problem focusedexamination; Medical decision making of low complexity. Counseling and/orcoordination of care with other physicians, other qualified health careprofessionals, or agencies are provided consistent with the nature of theproblem(s) and the patient's and/or family's needs. Usually, the patient isresponding inadequately to therapy or has developed a minor complication.Typically, 15 minutes are spent at the bedside and on the patient's facilityfloor or unit.99309_p_CPTSubsequent nursing facility care, per day, for the evaluation and managementof a patient, which requires at least 2 of these 3 key components: A detailedinterval history; A detailed examination; Medical decision making ofmoderate complexity. Counseling and/or coordination of care with otherphysicians, other qualified health care professionals, or agencies are providedconsistent with the nature of the problem(s) and the patient's and/or family'sneeds. Usually, the patient has developed a significant complication or asignificant new problem. Typically, 25 minutes are spent at the bedside andon the patient's facility floor or unit.G0152_p_HCPCSServices performed by a qualified occupational therapist in the home healthor hospice setting, each 15 minutesS9131_p_HCPCSPhysical therapy; in the home, per diemS9123_p_HCPCSNursing care, in the home; by registered nurse, per hour (use for generalnursing care only, not to be used when cpt codes 99500-99602 can be used)P9604_p_HCPCSTravel allowance one way in connection with medically necessary laboratoryspecimen collection drawn from home bound or nursing home bound patient;prorated trip chargeT1030_p_HCPCSNursing care, in the home, by registered nurse, per diemQ5001_p_HCPCSHospice or home health care provided in patient's home/residenceA0428_p_HCPCSAmbulance service, basic life support, non-emergency transport, (bls)G0157_p_HCPCSServices performed by a qualified physical therapist assistant in the homehealth or hospice setting, each 15 minutesS9124_p_HCPCSNursing care, in the home; by licensed practical nurse, per hourT1021_p_HCPCSHome health aide or certified nurse assistant, per visitP9603_p_HCPCSTravel allowance one way in connection with medically necessary laboratoryspecimen collection drawn from home bound or nursing home bound patient;prorated miles actually travelledS9129_p_HCPCSOccupational therapy, in the home, per diem99306_p_CPTInitial nursing facility care, per day, for the evaluation and management of apatient, which requires these 3 key components: A comprehensive history; Acomprehensive examination; and Medical decision making of high complexity.Counseling and/or coordination of care with other physicians, other qualifiedhealth care professionals, or agencies are provided consistent with the natureof the problem(s) and the patient's and/or family's needs. Usually, theproblem(s) requiring admission are of high severity. Typically, 45 minutes arespent at the bedside and on the patient's facility floor or unit.K0001_p_HCPCSStandard wheelchairE0260_p_HCPCSHospital bed, semi-electric (head and foot adjustment), with any type siderails, with mattress99307_p_CPTSubsequent nursing facility care, per day, for the evaluation and managementof a patient, which requires at least 2 of these 3 key components: A problemfocused interval history; A problem focused examination; Straightforwardmedical decision making. Counseling and/or coordination of care with otherphysicians, other qualified health care professionals, or agencies are providedconsistent with the nature of the problem(s) and the patient's and/or family'sneeds. Usually, the patient is stable, recovering, or improving. Typically, 10minutes are spent at the bedside and on the patient's facility floor or unit.G0471_p_HCPCSCollection of venous blood by venipuncture or urine sample bycatheterization from an individual in a skilled nursing facility (snf) or by alaboratory on behalf of a home health agency (hha)T1001_p_HCPCSNursing assessment/evaluation99310_p_CPTSubsequent nursing facility care, per day, for the evaluation and managementof a patient, which requires at least 2 of these 3 key components: Acomprehensive interval history; A comprehensive examination; Medicaldecision making of high complexity. Counseling and/or coordination of carewith other physicians, other qualified health care professionals, or agenciesare provided consistent with the nature of the problem(s) and the patient'sand/or family's needs. The patient may be unstable or may have developed asignificant new problem requiring immediate physician attention. Typically,35 minutes are spent at the bedside and on the patient's facility floor or unit.R54_d_ICD10_DiagnosisAge-related physical debilityK0195_p_HCPCSElevating leg rests, pair (for use with capped rental wheelchair base)Q0092_p_HCPCSSet-up portable x-ray equipmentG0180_p_HCPCSPhysician certification for medicare-covered home health services under ahome health plan of care (patient not present), including contacts with homehealth agency and review of reports of patient status required by physiciansto affirm the initial implementation of the plan of care that meets patient'sneeds, per certification period99305_p_CPTInitial nursing facility care, per day, for the evaluation and management of apatient, which requires these 3 key components: A comprehensive history; Acomprehensive examination; and Medical decision making of moderatecomplexity. Counseling and/or coordination of care with other physicians,other qualified health care professionals, or agencies are provided consistentwith the nature of the problem(s) and the patient's and/or family's needs.Usually, the problem(s) requiring admission are of moderate severity.Typically, 35 minutes are spent at the bedside and on the patient's facilityfloor or unit.G0495_p_HCPCSSkilled services of a registered nurse (rn), in the training and/or education of apatient or family member, in the home health or hospice setting, each 15minutesE0143_p_HCPCSWalker, folding, wheeled, adjustable or fixed heightR26.0_d_ICD10_DiagnosisAtaxic gait99349_p_CPTHome visit for the evaluation and management of an established patient,which requires at least 2 of these 3 key components: A detailed intervalhistory; A detailed examination; Medical decision making of moderatecomplexity. Counseling and/or coordination of care with other physicians,other qualified health care professionals, or agencies are provided consistentwith the nature of the problem(s) and the patient's and/or family's needs.Usually, the presenting problem(s) are moderate to high severity. Typically, 40minutes are spent face-to-face with the patient and/or family.Z99.3_d_ICD10_DiagnosisDependence on wheelchairR0070_p_HCPCSTransportation of portable x-ray equipment and personnel to home ornursing home, per trip to facility or location, one patient seenG0493_p_HCPCSSkilled services of a registered nurse (rn) for the observation and assessmentof the patient's condition, each 15 minutes (the change in the patient'scondition requires skilled nursing personnel to identify and evaluate thepatient's need for possible modification of treatment in the home health orhospice setting)G0179_p_HCPCSPhysician re-certification for medicare-covered home health services under ahome health plan of care (patient not present), including contacts with homehealth agency and review of reports of patient status required by physiciansto affirm the initial implementation of the plan of care that meets patient'sneeds, per re-certification periodK0003_p_HCPCSLightweight wheelchairG0496_p_HCPCSSkilled services of a licensed practical nurse (lpn), in the training and/oreducation of a patient or family member, in the home health or hospicesetting, each 15 minutes99316_p_CPTNursing facility discharge day management; more than 30 minutesR0075_p_HCPCSTransportation of portable x-ray equipment and personnel to home ornursing home, per trip to facility or location, more than one patient seenG0153_p_HCPCSServices performed by a qualified speech-language pathologist in the homehealth or hospice setting, each 15 minutes99348_p_CPTHome visit for the evaluation and management of an established patient,which requires at least 2 of these 3 key components: An expanded problemfocused interval history; An expanded problem focused examination; Medicaldecision making of low complexity. Counseling and/or coordination of carewith other physicians, other qualified health care professionals, or agenciesare provided consistent with the nature of the problem(s) and the patient'sand/or family's needs. Usually, the presenting problem(s) are of low tomoderate severity. Typically, 25 minutes are spent face-to-face with thepatient and/or family.G0155_p_HCPCSServices of clinical social worker in home health or hospice settings, each 15minutesT1031_p_HCPCSNursing care, in the home, by licensed practical nurse, per diemE0156_p_HCPCSSeat attachment, walker99350_p_CPTHome visit for the evaluation and management of an established patient,which requires at least 2 of these 3 key components: A comprehensiveinterval history; A comprehensive examination; Medical decision making ofmoderate to high complexity. Counseling and/or coordination of care withother physicians, other qualified health care professionals, or agencies areprovided consistent with the nature of the problem(s) and the patient'sand/or family's needs. Usually, the presenting problem(s) are of moderate tohigh severity. The patient may be unstable or may have developed asignificant new problem requiring immediate physician attention. Typically,60 minutes are spent face-to-face with the patient and/or family.G0158_p_HCPCSServices performed by a qualified occupational therapist assistant in thehome health or hospice setting, each 15 minutesE0630_p_HCPCSPatient lift, hydraulic or mechanical, includes any seat, sling, strap(s) or pad(s)G0159_p_HCPCSServices performed by a qualified physical therapist, in the home healthsetting, in the establishment or delivery of a safe and effective physicaltherapy maintenance program, each 15 minutesK0004_p_HCPCSHigh strength, lightweight wheelchairE0163_p_HCPCSCommode chair, mobile or stationary, with fixed armsK0007_p_HCPCSExtra heavy duty wheelchairS9127_p_HCPCSSocial work visit, in the home, per diem99315_p_CPTNursing facility discharge day management; 30 minutes or lessE1038_p HCPCSTransport chair, adult size, patient weight capacity up to and including 300poundsE0971_p_HCPCSManual wheelchair accessory, anti-tipping device, eachE0261_p_HCPCSHospital bed, semi-electric (head and foot adjustment), with any type siderails, without mattressE0277_p_HCPCSPowered pressure-reducing air mattress99304_p_CPTInitial nursing facility care, per day, for the evaluation and management of apatient, which requires these 3 key components: A detailed or comprehensivehistory; A detailed or comprehensive examination; and Medical decisionmaking that is straightforward or of low complexity. Counseling and/orcoordination of care with other physicians, other qualified health careprofessionals, or agencies are provided consistent with the nature of theproblem(s) and the patient's and/or family's needs. Usually, the problem(s)requiring admission are of low severity. Typically, 25 minutes are spent at thebedside and on the patient's facility floor or unit.99341_p_CPTHome visit for the evaluation and management of a new patient, whichrequires these 3 key components: A problem focused history; A problemfocused examination; and Straightforward medical decision making.Counseling and/or coordination of care with other physicians, other qualifiedhealth care professionals, or agencies are provided consistent with the natureof the problem(s) and the patient's and/or family's needs. Usually, thepresenting problem(s) are of low severity. Typically, 20 minutes are spentface-to-face with the patient and/or family.S8120_p_HCPCSOxygen contents, gaseous, 1 unit equals 1 cubic footG0162_p_HCPCSSkilled services by a registered nurse (rn) for management and evaluation ofthe plan of care; each 15 minutes (the patient's underlying condition orcomplication requires an rn to ensure that essential non-skilled care achievesits purpose in the home health or hospice setting)G0160_p_HCPCSServices performed by a qualified occupational therapist, in the home healthsetting, in the establishment or delivery of a safe and effective occupationaltherapy maintenance program, each 15 minutes99347_p_CPTHome visit for the evaluation and management of an established patient,which requires at least 2 of these 3 key components: A problem focusedinterval history; A problem focused examination; Straightforward medicaldecision making. Counseling and/or coordination of care with otherphysicians, other qualified health care professionals, or agencies are providedconsistent with the nature of the problem(s) and the patient's and/or family'sneeds. Usually, the presenting problem(s) are self limited or minor. Typically,15 minutes are spent face-to-face with the patient and/or family.E0973_p_HCPCSWheelchair accessory, adjustable height, detachable armrest, completeassembly, eachE2601_p_HCPCSGeneral use wheelchair seat cushion, width less than 22 inches, any depthS9128_p_HCPCSSpeech therapy, in the home, per diemL89.151_d_ICD10_DiagnosisPressure ulcer of sacral region, stage 1G0181_p_HCPCSPhysician supervision of a patient receiving medicare-covered servicesprovided by a participating home health agency (patient not present)requiring complex and multidisciplinary care modalities involving regularphysician development and/or revision of care plans, review of subsequentreports of patient status, review of laboratory and other studies,communication (including telephone calls) with other health careprofessionals involved in the patient's care, integration of new informationinto the medical treatment plan and/or adjustment of medical therapy, withina calendar month, 30 minutes or more99334_p_CPTDomiciliary or rest home visit for the evaluation and management of anestablished patient, which requires at least 2 of these 3 key components: Aproblem focused interval history; A problem focused examination;Straightforward medical decision making. Counseling and/or coordination ofcare with other physicians, other qualified health care professionals, oragencies are provided consistent with the nature of the problem(s) and thepatient's and/or family's needs. Usually, the presenting problem(s) are self-limited or minor. Typically, 15 minutes are spent with the patient and/orfamily or caregiver.K0739_p_HCPCSRepair or nonroutine service for durable medical equipment other thanoxygen equipment requiring the skill of a technician, labor component, per 15minutesG0154_p_HCPCSDirect skilled nursing services of a licensed nurse (lpn or rn) in the homehealth or hospice setting, each 15 minutesK0006_p_HCPCSHeavy duty wheelchairE0303_p_HCPCSHospital bed, heavy duty, extra wide, with weight capacity greater than 350pounds, but less than or equal to 600 pounds, with any type side rails, withmattressE1399_p HCPCSDurable medical equipment, miscellaneousK0800_p_HCPCSPower operated vehicle, group 1 standard, patient weight capacity up to andincluding 300 poundsE0181_p_HCPCSPowered pressure reducing mattress overlay/pad, alternating, with pump,includes heavy dutyE0990_p_HCPCSWheelchair accessory, elevating leg rest, complete assembly, eachE0149_p_HCPCSWalker, heavy duty, wheeled, rigid or folding, any typeE0240_p_HCPCSBath/shower chair, with or without wheels, any sizeE0978_p_HCPCSWheelchair accessory, positioning belt/safety belt/pelvic strap, eachK0823_p_HCPCSPower wheelchair, group 2 standard, captains chair, patient weight capacityup to and including 300 pounds99344_p_CPTHome visit for the evaluation and management of a new patient, whichrequires these 3 key components: A comprehensive history; A comprehensiveexamination; and Medical decision making of moderate complexity.Counseling and/or coordination of care with other physicians, other qualifiedhealth care professionals, or agencies are provided consistent with the natureof the problem(s) and the patient's and/or family's needs. Usually, thepresenting problem(s) are of high severity. Typically, 60 minutes are spentface-to-face with the patient and/or family.E0245_p_HCPCSTub stool or benchE0185_p_HCPCSGel or gel-like pressure pad for mattress, standard mattress length and widthT2005_p_HCPCSNon-emergency transportation; stretcher vanE2611_p_HCPCSGeneral use wheelchair back cushion, width less than 22 inches, any height,including any type mounting hardwareE0100_p_HCPCSCane, includes canes of all materials, adjustable or fixed, with tipS0281_p_HCPCSMedical home program, comprehensive care coordination and planning,maintenance of plan99600_p_CPTUnlisted home visit service or procedureK0052_p_HCPCSSwingaway, detachable footrests, replacement only, eachE0910_p_HCPCSTrapeze bars, a/k/a patient helper, attached to bed, with grab barE0951_p_HCPCSHeel loop/holder, any type, with or without ankle strap, eachQ5002_p_HCPCSHospice or home health care provided in assisted living facilityG0161_p_HCPCSServices performed by a qualified speech-language pathologist, in the homehealth setting, in the establishment or delivery of a safe and effective speech-language pathology maintenance program, each 15 minutesE0912_p_HCPCSTrapeze bar, heavy duty, for patient weight capacity greater than 250 pounds,free standing, complete with grab barE0271_p_HCPCSMattress, innerspringE1226_p_HCPCSWheelchair accessory, manual fully reclining back, (recline greater than 80degrees), eachE1230_p_HCPCSPower operated vehicle (three or four wheel nonhighway) specify brandname and model numberE0144_p_HCPCSWalker, enclosed, four sided framed, rigid or folding, wheeled with posteriorseatE0445_p_HCPCSOximeter device for measuring blood oxygen levels non-invasivelyS5160_p_HCPCSEmergency response system; installation and testingE0105_p_HCPCSCane, quad or three prong, includes canes of all materials, adjustable or fixed,with tipsE2201_p_HCPCSManual wheelchair accessory, nonstandard seat frame, width greater than orequal to 20 inches and less than 24 inches99342_p_CPTHome visit for the evaluation and management of a new patient, whichrequires these 3 key components: An expanded problem focused history; Anexpanded problem focused examination; and Medical decision making of lowcomplexity. Counseling and/or coordination of care with other physicians,other qualified health care professionals, or agencies are provided consistentwith the nature of the problem(s) and the patient's and/or family's needs.Usually, the presenting problem(s) are of moderate severity. Typically, 30minutes are spent face-to-face with the patient and/or family.E1140_p_HCPCSWheelchair, detachable arms, desk or full length, swing away detachablefootrestsE0940_p_HCPCSTrapeze bar, free standing, complete with grab barE0961_p_HCPCSManual wheelchair accessory, wheel lock brake extension (handle), eachE0247_p_HCPCSTransfer bench for tub or toilet with or without commode openingE0265_p_HCPCSHospital bed, total electric (head, foot and height adjustments), with any typeside rails, with mattress99510_p_CPTHome visit for individual, family, or marriage counselingE0705_p_HCPCSTransfer device, any type, eachE2392_p_HCPCSPower wheelchair accessory, solid (rubber/plastic) caster tire with integratedwheel, any size, replacement only, eachK0002_p_HCPCSStandard hemi (low seat) wheelchairE0244_p_HCPCSRaised toilet seatQ5009_p_HCPCSHospice or home health care provided in place not otherwise specified (nos)E0301_p_HCPCSHospital bed, heavy duty, extra wide, with weight capacity greater than 350pounds, but less than or equal to 600 pounds, with any type side rails,without mattress99318_p_CPTEvaluation and management of a patient involving an annual nursing facilityassessment, which requires these 3 key components: A detailed intervalhistory; A comprehensive examination; and Medical decision making that is oflow to moderate complexity. Counseling and/or coordination of care withother physicians, other qualified health care professionals, or agencies areprovided consistent with the nature of the problem(s) and the patient'sand/or family's needs. Usually, the patient is stable, recovering, or improving.Typically, 30 minutes are spent at the bedside and on the patient's facilityfloor or unit.99374_p_CPTSupervision of a patient under care of home health agency (patient notpresent) in home, domiciliary or equivalent environment (eg, Alzheimer'sfacility) requiring complex and multidisciplinary care modalities involvingregular development and/or revision of care plans by that individual, reviewof subsequent reports of patient status, review of related laboratory andother studies, communication (including telephone calls) for purposes ofassessment or care decisions with health care professional(s), familymember(s), surrogate decision maker(s) (eg, legal guardian) and/or keycaregiver(s) involved in patient's care, integration of new information into themedical treatment plan and/or adjustment of medical therapy, within acalendar month; 15-29 minutesE2361_p_HCPCSPower wheelchair accessory, 22nf sealed lead acid battery, each, (e.g., gelcell, absorbed glassmat)E0168_p_HCPCSCommode chair, extra wide and/or heavy duty, stationary or mobile, with orwithout arms, any type, eachE0165_p_HCPCSCommode chair, mobile or stationary, with detachable arms99324_p_CPTDomiciliary or rest home visit for the evaluation and management of a newpatient, which requires these 3 key components: A problem focused history;A problem focused examination; and Straightforward medical decisionmaking. Counseling and/or coordination of care with other physicians, otherqualified health care professionals, or agencies are provided consistent withthe nature of the problem(s) and the patient's and/or family's needs. Usually,the presenting problem(s) are of low severity. Typically, 20 minutes are spentwith the patient and/or family or caregiver.S3601_p_HCPCSEmergency stat laboratory charge for patient who is homebound or residingin a nursing facilityE2208_p_HCPCSWheelchair accessory, cylinder tank carrier, eachE0241_p_HCPCSBath tub wall rail, eachE1039_p_HCPCSTransport chair, adult size, heavy duty, patient weight capacity greater than300 poundsE2602_p_HCPCSGeneral use wheelchair seat cushion, width 22 inches or greater, any depthA0420_p_HCPCSAmbulance waiting time (als or bls), one half (1/2) hour increments99375_p_CPTSupervision of a patient under care of home health agency (patient notpresent) in home, domiciliary or equivalent environment (eg, Alzheimer'sfacility) requiring complex and multidisciplinary care modalities involvingregular development and/or revision of care plans by that individual, reviewof subsequent reports of patient status, review of related laboratory andother studies, communication (including telephone calls) for purposes ofassessment or care decisions with health care professional(s), familymember(s), surrogate decision maker(s) (eg, legal guardian) and/or keycaregiver(s) involved in patient's care, integration of new information into themedical treatment plan and/or adjustment of medical therapy, within acalendar month; 30 minutes or moreE0147_p_HCPCSWalker, heavy duty, multiple braking system, variable wheel resistanceE0159_p_HCPCSBrake attachment for wheeled walker, replacement, eachS8121_p_HCPCSOxygen contents, liquid, 1 unit equals 1 poundE2365_p_HCPCSPower wheelchair accessory, u-1 sealed lead acid battery, each (e.g., gel cell,absorbed glassmat)T4542_p_HCPCSIncontinence product, disposable underpad, small size, eachE1150_p_HCPCSWheelchair, detachable arms, desk or full length swing away detachableelevating legrestsE0272_p_HCPCSMattress, foam rubberG0372_p_HCPCSPhysician service required to establish and document the need for a powermobility deviceE2366_p_HCPCSPower wheelchair accessory, battery charger, single mode, for use with onlyone battery type, sealed or non-sealed, eachE0310_p_HCPCSBed side rails, full lengthE1240_p_HCPCSLightweight wheelchair, detachable arms, (desk or full length) swing awaydetachable, elevating legrestT1023_p_HCPCSScreening to determine the appropriateness of consideration of an individualfor participation in a specified program, project or treatment protocol, perencounterS9110_p_HCPCSTelemonitoring of patient in their home, including all necessary equipment;computer system, connections, and software; maintenance; patienteducation and support; per month99327_p_CPTDomiciliary or rest home visit for the evaluation and management of a newpatient, which requires these 3 key components: A comprehensive history; Acomprehensive examination; and Medical decision making of moderatecomplexity. Counseling and/or coordination of care with other physicians,other qualified health care professionals, or agencies are provided consistentwith the nature of the problem(s) and the patient's and/or family's needs.Usually, the presenting problem(s) are of high severity. Typically, 60 minutesare spent with the patient and/or family or caregiver.E0255_p_HCPCSHospital bed, variable height, hi-lo, with any type side rails, with mattressE0154_p_HCPCSPlatform attachment, walker, eachE2603_p_HCPCSSkin protection wheelchair seat cushion, width less than 22 inches, any depthE2202_p_HCPCSManual wheelchair accessory, nonstandard seat frame width, 24-27 inchesE0295_p_HCPCSHospital bed, semi-electric (head and foot adjustment), without side rails,without mattressE0184_p_HCPCSDry pressure mattressE1260_p_HCPCSLightweight wheelchair, detachable arms (desk or full length) swing awaydetachable footrest99337_p_CPTDomiciliary or rest home visit for the evaluation and management of anestablished patient, which requires at least 2 of these 3 key components: Acomprehensive interval history; A comprehensive examination; Medicaldecision making of moderate to high complexity. Counseling and/orcoordination of care with other physicians, other qualified health careprofessionals, or agencies are provided consistent with the nature of theproblem(s) and the patient's and/or family's needs. Usually, the presentingproblem(s) are of moderate to high severity. The patient may be unstable ormay have developed a significant new problem requiring immediate physicianattention. Typically, 60 minutes are spent with the patient and/or family orcaregiver.99339_p_CPTIndividual physician supervision of a patient (patient not present) in home,domiciliary or rest home (eg, assisted living facility) requiring complex andmultidisciplinary care modalities involving regular physician developmentand/or revision of care plans, review of subsequent reports of patient status,review of related laboratory and other studies, communication (includingtelephone calls) for purposes of assessment or care decisions with health careprofessional(s), family member(s), surrogate decision maker(s) (eg, legalguardian) and/or key caregiver(s) involved in patient's care, integration ofnew information into the medical treatment plan and/or adjustment ofmedical therapy, within a calendar month; 15-29 minutesE1639_p_HCPCSScale, eachK0807_p_HCPCSPower operated vehicle, group 2 heavy duty, patient weight capacity 301 to450 poundsE2612_p_HCPCSGeneral use wheelchair back cushion, width 22 inches or greater, any height,including any type mounting hardwareK0005_p_HCPCSUltralightweight wheelchairE0274_p_HCPCSOver-bed table99326_p_CPTDomiciliary or rest home visit for the evaluation and management of a newpatient, which requires these 3 key components: A detailed history; Adetailed examination; and Medical decision making of moderate complexity.Counseling and/or coordination of care with other physicians, other qualifiedhealth care professionals, or agencies are provided consistent with the natureof the problem(s) and the patient's and/or family's needs. Usually, thepresenting problem(s) are of moderate to high severity. Typically, 45 minutesare spent with the patient and/or family or caregiver.E0621_p_HCPCSSling or seat, patient lift, canvas or nylonT2049_p_HCPCSNon-emergency transportation; stretcher van, mileage; per mile96154_p_CPTHealth and behavior intervention, each 15 minutes, face-to-face; family (withthe patient present)G0164_p_HCPCSSkilled services of a licensed nurse (lpn or rn), in the training and/or educationof a patient or family member, in the home health or hospice setting, each 15minutesK0825_p_HCPCSPower wheelchair, group 2 heavy duty, captains chair, patient weight capacity301 to 450 poundsA0384_p_HCPCSBls specialized service disposable supplies; defibrillation (used by alsambulances and bls ambulances in jurisdictions where defibrillation ispermitted in bls ambulances)A9281_p_HCPCSReaching/grabbing device, any type, any length, eachE0627_p_HCPCSSeat lift mechanism, electric, any typeE0248_p_HCPCSTransfer bench, heavy duty, for tub or toilet with or without commodeopeningE0635_p_HCPCSPatient lift, electric with seat or slingE0246_p_HCPCSTransfer tub rail attachmentT5999_p_HCPCSSupply, not otherwise specifiedE0155_p_HCPCSWheel attachment, rigid pick-up walker, per pairE0243_p_HCPCSToilet rail, eachS9529_p_HCPCSRoutine venipuncture for collection of specimen(s), single home bound,nursing home, or skilled nursing facility patientK0056_p_HCPCSSeat height less than 17\ or equal to or greater than 21\“ for a high strength,lightweight, or ultralightweight wheelchair”E1280_p_HCPCSHeavy duty wheelchair, detachable arms (desk or full length) elevatinglegrestsK0816_p_HCPCSPower wheelchair, group 1 standard, captains chair, patient weight capacityup to and including 300 poundsE1290_p_HCPCSHeavy duty wheelchair, detachable arms (desk or full length) swing awaydetachable footrestK0733_p_HCPCSPower wheelchair accessory, 12 to 24 amp hour sealed lead acid battery, each(e.g., gel cell, absorbed glassmat)E1391_p_HCPCSOxygen concentrator, dual delivery port, capable of delivering 85 percent orgreater oxygen concentration at the prescribed flow rate, eachK0801_p_HCPCSPower operated vehicle, group 1 heavy duty, patient weight capacity 301 to450 poundsG0182_p_HCPCSPhysician supervision of a patient under a medicare-approved hospice(patient not present) requiring complex and multidisciplinary care modalitiesinvolving regular physician development and/or revision of care plans, reviewof subsequent reports of patient status, review of laboratory and otherstudies, communication (including telephone calls) with other health careprofessionals involved in the patient's care, integration of new informationinto the medical treatment plan and/or adjustment of medical therapy, withina calendar month, 30 minutes or moreE1130_p_HCPCSStandard wheelchair, fixed full length arms, fixed or swing away detachablefootrestsK0821_p_HCPCSPower wheelchair, group 2 standard, portable, captains chair, patient weightcapacity up to and including 300 poundsE0250_p_HCPCSHospital bed, fixed height, with any type side rails, with mattressE1092_p_HCPCSWide heavy duty wheel chair, detachable arms (desk or full length), swingaway detachable elevating leg restsK0053_p_HCPCSElevating footrests, articulating (telescoping), eachE0294_p_HCPCSHospital bed, semi-electric (head and foot adjustment), without side rails,with mattressE0148_p_HCPCSWalker, heavy duty, without wheels, rigid or folding, any type, eachA9280_p_HCPCSAlert or alarm device, not otherwise classifiedK0822_p_HCPCSPower wheelchair, group 2 standard, sling/solid seat/back, patient weightcapacity up to and including 300 poundsE1031_p_HCPCSRollabout chair, any and all types with casters 5\ or greater”E1090_p_HCPCSHigh strength lightweight wheelchair, detachable arms desk or full length,swing away detachable foot restsE0305_p_HCPCSBed side rails, half lengthE1093_p_HCPCSWide heavy duty wheelchair, detachable arms desk or full length arms, swingaway detachable footrestsG0163_p_HCPCSSkilled services of a licensed nurse (lpn or rn) for the observation andassessment of the patient's condition, each 15 minutes (the change in thepatient's condition requires skilled nursing personnel to identify and evaluatethe patient's need for possible modification of treatment in the home healthor hospice setting)E0158_p_HCPCSLeg extensions for walker, per set of four (4) | 151,824 |
11862347 | DETAILED DESCRIPTION OF THE INVENTION Aspects of the present invention and certain features, advantages, and details thereof, are explained more fully below with reference to the non-limiting examples illustrated in the accompanying drawings. Descriptions of well-known materials, fabrication tools, processing techniques, etc., are omitted so as not to unnecessarily obscure the invention in detail. It should be understood, however, that the detailed description and the specific examples, while indicating aspects of the invention, are given by way of illustration only, and not by way of limitation. Various substitutions, modifications, additions, and/or arrangements, within the spirit and/or scope of the underlying inventive concepts will be apparent to those skilled in the art from this disclosure. The terms software and program code are used interchangeably throughout this application and can refer to logic executed by both hardware and software. Components of the system that can be utilized to execute aspects of embodiments of the present invention may include specialized hardware, including but not limited to, a GPP, an FPGA and a GPU (graphics professor unit). Additionally, items denoted as processors may include hardware and/or software processors or other processing means, including but not limited to a software defined radio and/or custom hardware. Embodiments of the present invention include a computer-implemented method, a computer program product, and a computer system, which include program code executing on at least one server that enables patients seeking medical treatment for conditions that benefit from regular monitoring, such as hypertension and/or diabetes, to communicate their blood sugar and other vital readings to physicians, in a secure manner, in real-time, and receive medical treatment (including recommendations for treatment) quickly (e.g., in real-time and/or in near real time) over this secure connection. Embodiments of the present invention additionally include a computer system and method that enables physicians and/or other health care providers to utilize a communications connection with a patient to diagnose issues and provide treatment (and recommendations for treatment). Aspects of embodiments of the present invention provide a global, scalable solution, which is useable and compatible across computing and communications platforms. By utilizing aspects of the present technique, a patient can take various health-related readings and communicates these readings, in a greater context supplied by the technique, to a specific physician through a live stream, allowing the physician to react to the readings and communicate adjustments to the patient, based on this information. This live stream offers improved disease management and the patient gets “better than office visit” outcomes. This technique offers the physician with a more effective way to monitor patients with, for example, diabetes and high blood pressure. By utilizing aspects of the technique, the patient is monitored closely without having to leave home/work/school for physician appointments. By utilizing and embodiment of the present invention, patients monitor disease states in the comfort of their homes/offices/schools, and this embodiment can communicate the readings safely, for example, utilizing encryption, to care providers, in real time, for interpretation and treatment. As explained herein, in embodiments of the present invention, a combination of one or more of passive and/or active monitoring techniques can be utilized. In an aspect of the present invention, embodiments of the system and method provide secure, HIPAA compliant storage of patient-specific readings. In an aspect of the present invention, embodiments of the system and method enable secure real-time communications between the patient and physician. In an aspect of the present invention, embodiments of the system and method enable the integration of data recorded by patients, such as blood pressure readings and dietary choices, into a patient's electronic medical record. Aspects of various embodiments of the present invention are inextricably linked to computing. For example, certain aspects of some embodiments of the present invention are directed to utilizing features inextricably linked to computing in an improved user interface. In some embodiments of the present invention, the user interfaces generated by the program code (executing on one or more processors) provides data to care providers and patients in real-time, in a novel manner. Additionally, aspects of various embodiments of the present invention also provide a practical application, through the use of computing technology. Aspects of embodiments of the present invention provide time-sensitive data to individuals with an immediacy while also complying with specific data security protocols. Regarding the security aspects, in some embodiments of the present invention, program code executing on a secure HIPAA compliant server writes data in an encrypted format, encrypting the data, converting the data to HL7 embedded portable document format (PDF) message files, and writing the HL7 embedded portable document format (PDF) message files into the electronic medical record. As an example of temporal aspects of some embodiments of the present invention that provide practicality because computing technology enables these time-sensitive aspects are various types of alerts to certain users. For example, in some embodiments of the present invention, when program code executing on one or more processors determines that data is not in a pre-configured range for a given patient and that given patient is associated with a given care provider, the program code utilizes contact information stored within the system to transmit automatically a real-time alert in an encrypted format, over a wireless communication channel to the care provider, who is located remotely. This alert is populated by the program code on a provider's computing device. The program code determines that the provider's computing device, a wireless device is online and is associated with the care provider and automatically displays the alert in an interface the program code generates on the device. But the program code can also determine that the device is not online and in this event, the program code can retain the alert at a secured location and display in the interface when the wireless device associated with the care provider is online. Displaying enables the care provider to utilize the interface to access, over the Internet, certain of the data related to the health of the patient and the historical medical data stored on the computer readable medium of a secure HIPAA compliant server, which is part of the system disclosed herein. The alert can comprise personally identifiable patient data transmitted as an HL7 message file. An additional aspect of some embodiments of the present invention that relates to security is that in some embodiments of the present invention program code executing on a secure HIPAA compliant server (which is part of a system disclosed herein), obtains from a mobile device, over an Internet connection, data related to the health state of a patient. The data obtained by the program code includes both data obtained upon submission (i.e., via the interface on the mobile device) and data obtained from a secured location on the mobile device. The data from the secured location was submitted through the interface when the mobile device was not connected to the secure HIPAA compliant server over the Internet and stored by the mobile device in the secured location of the mobile device. Embodiments of the present invention provide significant advantages over existing approaches for electronic communication between a patient and a provider. Listed in this paragraph are just some of the advantages and are not meant to suggest any limitations. As discussed herein, the communications provided by various embodiments of the present invention are streaming communications, which provides for more timely healthcare because delays are eliminated (while maintaining information security through various protections described herein). In addition to providing this streaming communications, in embodiments of the present invention, program code executed by the processor of the secure HIPAA compliant server writes data (which can included data entered by a user and the aforementioned secured data) to a computer readable medium in an encrypted format. This writing can include encrypting the data, converting the data to a first set of HL7 embedded portable document format (PDF) message files, and writing the first set of HL7 embedded portable document format (PDF) message files into an electronic medical record. Another advantage over existing patient-caregiver communication systems is that in some embodiments of the present invention, the program code sends alerts that include personally identifiable patient data transmitted as an HL7 message file. Another non-limiting example of advantages over existing patient-caregiver communication systems is that in embodiments of the present invention program code executed by a processor displays, on a mobile device, instantaneously upon obtaining, a medical recommendation, based on the streaming communication. This recommendation can include a diet plan. Based on obtaining the diet plan, the program code can execute a query on a memory resource selected from the group consisting of an external memory resource and an internal memory resource and in response to the query, the program code can obtain information describing one or more products compatible with the diet plan and display this information on the mobile device. As discussed in reference toFIG.1, below, in an aspect of the present invention, embodiments of the system and method are accessible via a variety of computing terminals, including but not limited to, smartphones, tablets, laptops and/or desktops. In an aspect of the present invention, embodiments of the system and method enable ease of implementation of any disaster recovery solution, including the use of a hot or cold backup, including a dedicated backup server to the server130inFIG.1, by centralizing data obtained and utilized by the invention, as seen in the technical architecture ofFIG.1. In an aspect of the present invention, embodiments of the system and method enable rapid notification of a physician or other medical care provider when a patient exhibits vital signs and/or readings outside of an acceptable range. Due to this rapid notification, the physician and/or care provider can react to the information, including prescribing a drug treatment, or a course of treatment including exercise, diet, etc. In an aspect of the present invention, embodiments of the system and method enable the monitoring and adjustment of the dietary habits of a patient as the real-time communication between a patient and a care giver, such as a nutritionist or dietician, provides can provide and monitor a meal plan pertaining to a patient. FIG.1is a computing environment100used to execute one or more aspects of an embodiment of the present invention. Terminal110is a user terminal that includes, but is not limited to, a mobile device. A mobile device is a particularly effective terminal110as it enables a user to communicate health states from unlimited locations. Terminal110can include, but is not limited to, a laptop, a desktop, a smartphone, and a tablet. For ease of understanding, only a single terminal110is shown inFIG.1, but the system architecture is scalable to communicate with and obtain data from numerous terminals. One of skill in the art will recognize that it is advantageous to utilize a mobile device as terminal110, however, this example is not limiting. In the embodiment ofFIG.1, terminal110communicates over a wireless computing network120with a secure, encrypted, Health Insurance Portability and Accountability Act (HIPAA) compliant server130. In a further embodiment of the present invention, software140(computer code executed by a processor) on the terminal110, encrypts information sent over the network120to the server130. In a further embodiment of the present invention, the wireless network120is not a public network, such that only certain terminals, such as terminal110can communicate over the network120with the server130. For example, the when the network120is private, it can include, but is not limited to, a virtual private network (VPN) and/or a privately leased line. One of skill in the art will recognize that the connection between the terminal110and the server130can be privatized in various ways known in the art in order to limit communications to the server130to one or more of a select group of terminals. In a further embodiment of the present invention, software160executed at the server130encrypts the communications from the terminal110to the server130. In an embodiment of the present invention, the server130includes a computer readable storage medium150, such as a database, including but not limited to a SQL Server, which stores historical data related to users of the system, including such data related to the user of terminal110. When the server130receives data from a terminal110via the network120, software160executed by a processor on the server130can store the data in the computer readable storage medium150, compare the data to data stored in the computer readable storage medium150, and/or retrieve related data from the computer readable storage medium150. Software160executed by one or more processors of the server130sends the data from the terminal110, and in embodiments of the present invention, additional data retrieved from the computer readable medium150, over a secure network connection to a care provider terminal170, which is a mobile terminal in embodiments of the present invention. In further embodiments of the present invention, the software160will display the data from the terminal and/or data retrieved from a computer readable storage medium150on a GUI (not pictured) viewable on the care provider terminal170. The system and method comply with HIPAA guidelines for securing patient information. To this end, in embodiments of the present invention, the software160obtains data and encrypts the data before saving it in the computer readable storage medium150. In further embodiments of the present invention, the software160will send a notification to the care provider terminal170, notifications include, but are not limited to, emails, text messages, and/or voice messages, and enable the user of the care provider terminal170to access the data obtained by the server130from the terminal110and/or the historical data maintained by the software160in the computer readable storage medium150. In a further embodiment of the present invention, the software160will determine whether the data obtained from the terminal110is outside pre-configured “acceptable” parameters, and send an alert to a care provider, via a communications connection with the care provider terminal120when the software160determines that the readings are not within the acceptable range. In further embodiments of the present invention, the on the server130will create an HL7 message file, standard message that is compliant with the standards created by Health Level Seven to comply with HIPAA's privacy guidelines. AlthoughFIG.1describes computer readable storage medium150as being a component of the server130, further embodiments of the present invention utilize one or more computer readable media that are internal and/or external to the physical server, but are accessible to the software160executed by the one or more processors of the server130. In the embodiment ofFIG.1, server130is a web server and, therefore, the terminal110and the care provider terminal170utilizes thin clients, such as browsers, to access the software160, that is executed on the server130. Varying embodiments of the present invention may utilize a fat client version and may install components of the software160on the terminal100, the server130, and/or the care provider terminal170. FIG.2illustrates a block diagram of a resource200, like terminal110and/or server130, and/or care giver terminal170in computer system100, which is part of the technical architecture of certain embodiments of the technique. The resource200may include a circuitry202that may in certain embodiments include a microprocessor204. The computer system200may also include a memory206(e.g., a volatile memory device), and storage208. The storage208may include a non-volatile memory device (e.g., EEPROM, ROM, PROM, RAM, DRAM, SRAM, flash, firmware, programmable logic, etc.), magnetic disk drive, optical disk drive, tape drive, etc. The storage208may comprise an internal storage device, an attached storage device and/or a network accessible storage device. The system200may include a program logic210including code212that may be loaded into the memory206and executed by the microprocessor204or circuitry202. In certain embodiments, the program logic210including code212may be stored in the storage208, or memory206. In certain other embodiments, the program logic210may be implemented in the circuitry202. Therefore, whileFIG.2shows the program logic210separately from the other elements, the program logic210may be implemented in the memory206and/or the circuitry202. Using the processing resources of a resource200to execute software, computer-readable code or instructions, does not limit where this code is can be stored. The terms program logic, code, and software are used interchangeably throughout this application. Referring toFIG.3, in one example, a computer program product300includes, for instance, one or more non-transitory computer readable storage media302to store computer readable program code means or logic304thereon to provide and facilitate one or more aspects of the technique. As will be appreciated by one skilled in the art, aspects of the technique may be embodied as a system, method or computer program product. Accordingly, aspects of the technique may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, micro-code, etc.) or an embodiment combining software and hardware aspects that may all generally be referred to herein as a “circuit,” “module” or “system.” Furthermore, aspects of the technique may take the form of a computer program product embodied in one or more computer readable medium(s) having computer readable program code embodied thereon. Any combination of one or more computer readable medium(s) may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical or any suitable combination thereof. A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus or device. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using an appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing. Computer program code for carrying out operations for aspects of the technique may be written in any combination of one or more programming languages, including an object oriented programming language, such as Java, Smalltalk, C++ or the like, and conventional procedural programming languages, such as the “C” programming language, assembler or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider). Aspects of the technique are described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. These computer program instructions may also be stored in a computer readable medium that can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions stored in the computer readable medium produce an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks. The computer program instructions, also referred to as computer program code, may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the technique. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions. In addition to the above, one or more aspects of the technique may be provided, offered, deployed, managed, serviced, etc. by a service provider who offers management of customer environments. For instance, the service provider can create, maintain, support, etc. computer code and/or a computer infrastructure that performs one or more aspects of the technique for one or more customers. In return, the service provider may receive payment from the customer under a subscription and/or fee agreement, as examples. Additionally or alternatively, the service provider may receive payment from the sale of advertising content to one or more third parties. In one aspect of the technique, an application may be deployed for performing one or more aspects of the technique. As one example, the deploying of an application comprises providing computer infrastructure operable to perform one or more aspects of the technique. As a further aspect of the technique, a computing infrastructure may be deployed comprising integrating computer readable code into a computing system, in which the code in combination with the computing system is capable of performing one or more aspects of the technique. As a further aspect of the technique, the system can operate in a peer to peer mode where certain system resources, including but not limited to, one or more databases, is/are shared, but the program code executable by one or more processors is loaded locally on each computer (workstation). As yet a further aspect of the technique, a process for integrating computing infrastructure comprising integrating computer readable code into a computer system may be provided. The computer system comprises a computer readable medium, in which the computer medium comprises one or more aspects of the technique. The code in combination with the computer system is capable of performing one or more aspects of the technique. Further, other types of computing environments can benefit from one or more aspects of the technique. As an example, an environment may include an emulator (e.g., software or other emulation mechanisms), in which a particular architecture (including, for instance, instruction execution, architected functions, such as address translation, and architected registers) or a subset thereof is emulated (e.g., on a native computer system having a processor and memory). In such an environment, one or more emulation functions of the emulator can implement one or more aspects of the technique, even though a computer executing the emulator may have a different architecture than the capabilities being emulated. As one example, in emulation mode, the specific instruction or operation being emulated is decoded, and an appropriate emulation function is built to implement the individual instruction or operation. In an emulation environment, a host computer includes, for instance, a memory to store instructions and data; an instruction fetch unit to fetch instructions from memory and to optionally, provide local buffering for the fetched instruction; an instruction decode unit to receive the fetched instructions and to determine the type of instructions that have been fetched; and an instruction execution unit to execute the instructions. Execution may include loading data into a register from memory; storing data back to memory from a register; or performing some type of arithmetic or logical operation, as determined by the decode unit. In one example, each unit is implemented in software. For instance, the operations being performed by the units are implemented as one or more subroutines within emulator software. Further, a data processing system suitable for storing and/or executing program code is usable that includes at least one processor coupled directly or indirectly to memory elements through a system bus. The memory elements include, for instance, local memory employed during actual execution of the program code, bulk storage, and cache memory which provide temporary storage of at least some program code in order to reduce the number of times code must be retrieved from bulk storage during execution. Input/Output or I/O devices (including, but not limited to, keyboards, displays, pointing devices, DASD, tape, CDs, DVDs, thumb drives and other memory media, etc.) can be coupled to the system either directly or through intervening I/O controllers. Network adapters may also be coupled to the system to enable the data processing system to become coupled to other data processing systems or remote printers or storage devices through intervening private or public networks. Modems, cable modems, and Ethernet cards are just a few of the available types of network adapters. As will be understood by those of skill in the art, privacy and security are important components of any system that transmits medical data. The present invention provides a number of advantages the ensure privacy and security are preserved and health care privacy guidelines are complied with. Embodiments of the present are configured so that a physician and/or care provider can only utilize the system and method to communicate with his or her own patients exclusively, and receive and review data from his or her own patients, exclusively. Another advantage is that patients can securely utilize the system and method to send multiple readings regarding their health states to their care providers, which ensures a more accurate diagnosis and/or recommendation, by the recipient of the information. In embodiments of the present invention, these multiple readings are date/time stamped and sent to a physician or care provider via a secure, encrypted, HIPAA compliant server130. Thus, the server130is easily integrated into the patient electronic medical record and eliminates office visits for the patient. Embodiments of the present invention provide an advantage by enabling streaming communication between the patient and physician, while integrating blood pressure, blood sugar, pulse and diet, for a complete picture of the patient. FIG.4is a workflow400of one or more aspects of an embodiment of the present invention. When referring toFIG.4, components of the technical environment ofFIG.1are referenced for ease of understanding, however, one of skill in the art will recognize that aspects of the present invention can be implementing across a variety of technical environments. A patient utilizes the terminal110to record his or her own blood sugar and/or blood pressure readings (S410). The user can manually enter this information and/or a device that provides these reading can be communicatively attached to the terminal110so that the terminal can receive these readings. The software160obtains the readings, associates the readings with the time in which they were provided, for example, by adding a date/time stamp (S420) and, optionally, additional patient information. For example, in an embodiment of the present invention, a user/patient enters blood pressure, blood sugar, pulse readings, and/or meal plan readings, on a mobile device, a terminal110, in order to communicate the readings to his or her physician. The software160obtains (S430) the data received at the terminal110at the secure, encrypted, HIPAA compliant server130. In an embodiment of the present invention, to protect the privacy of a terminal110user, such as a patient, personal identification of a patient is associated by the software160with a medical record number of the patient. The software160encrypts the data from the terminal110(S440). Upon encrypting the data, in embodiments of the present invention, the software160saves the data from the terminal110(S450) on a computer readable storage medium150. In this manner, the software160meets HIPAA guidelines for securing patient information. In embodiments of the present invention, the software160stores all encrypted data in HL7 message files. In an embodiment of the present invention, the software160enables the computer readable storage medium150to generate HL7 messages for the electronic medical record of a given patient. In an embodiment of the present invention, the software160determines whether the data received is within a pre-configured “acceptable” range and if not, sends an alert to the patient's care provider (S460), for example, by sending an electronic alert, such as a text or email, to the care giver terminal170. Provided the software160transmits the patient data itself, it does so in an HL7 message file to comply with HIPAA standards. The software160can also make the data obtained from the terminal110as well as historical data that it saved on the computer readable storage medium, accessible to a user of a care giver terminal via a GUI. The software160obtains a response from the care giver (S470), via a care giver terminal170and can retain this response on the server130and/or securely communicate the response to the terminal110(S480). In this manner, disease readings are monitored and managed by the physician and he/she sees fit by sending return message to the patient regarding the readings. For example, in embodiments of the invention, the software160is interactive so that the physician can make recommendations to the patient for changes in medications, diet, and exercise to positively affect/improve his or her disease. As a result, the patient becomes very involved in his or her own health care, but not “tied” to his or her physician for multiple office visits. In embodiments of the present invention, the software160can communicate a variety of data regarding a given patient to a physician. Because the server130can store medical data, including the electronic medical record, relating to the patient in a secure way, for example, by utilizing patient numbers instead of identifying information, encrypting the data, and creating HL7 messages, when a physician receives an alert and/or checks a patient's reported readings, he or she can also reference historical data on the server130as well as the patients' electronic medical record, also encrypted and secured on the server130in embodiments of the present invention. In an embodiment of the present invention, the software160displays the patient's medical data including medications relating to diabetes and hypertension with patient readings, including but not limited to, pulse pressure, weight, height. The availability of this complete information is helpful in correctly treating a patient for disease states. As diet is also a contributing factor to diabetes and hypertension and maintaining a healthful diet helps treat these conditions, embodiments of the present invention can also assist in this dimension of health care. In an embodiment of the present invention, computer readable storage medium on the server (or accessible to the server) stores a pre-loaded diet plan for a given patient. When the patient utilizes the terminal110, the software160can provide the user with meal plan information. From the care provider terminal170, a nutritionist and/or dietician can make changes/suggestions to the patient and modify the plan. Embodiments of the present invention enable the patient and provider to experience an instant communication. Although the server130provides security between the terminal110and the care provider terminal170, from the patient and physician perspective, communications occur in real-time.FIG.4Ais a workflow500showing an aspect of an embodiment of the present invention from the perspective of a patient utilizing a terminal110. Referring toFIG.4A, a patient utilizes a GUI on the terminal110to log into the application (S510), which can be understood as being created by computer code being executed by a processor at a server130. Hence, the software enables the interactions of what is being referring to in this figure as the application. As seen inFIG.4A, the patient logs onto the application at the terminal110(S510) and enters BP and Sugar Readings (S520) and provided that the terminal110is connected to a network (i.e., online), the data entered by the patient can be saved on the server130(S530a). In the event that the terminal110is not connected to a network, the data can be saved locally (S530b). Because of the manner described earlier in which the software160supplements and protects the data, the data is saved by the software160on the server130(S540a) and at what is perceived by a user as the same time, the data shows instantly on the care provider terminal170(S550a). With this information, the provider utilizes the care provider terminal170to update the medications of the patient (S560a), and, like the data entered at the terminal110by the patient, because of the back-end secure processing described earlier, the data entered by the provider displays “instantly” on the terminal110to the patient (S570a). Please note that in this embodiment of the present invention, the login of the user can be verified even without connectivity to the network and therefore, the computer program code that handles the verification is executed locally at the terminal110. However, the verification functionality of the computer code can also be integrated into the code executed at the server130. FIG.4Bis an aspect of a workflow600of an embodiment of the present application from the point-of-view of the provider. As seen inFIG.4B, a provider accesses the invention by logging into a GUI (S610). When authorized by the software160, the provider can view notifications for abnormal readings in the GUI of the care provider terminal170(S620). In response to these readings, the provider has the option of utilizing the software160to take a number of actions, including but not limited to, updating the medications of the patient (S630), checking for refills (S640), confirming a refill request with a patient (S650), posting new medication changes to a patient's account (S660), and/or deleting notifications and posting updates (S670). Please note that the order of the actions available to the care provider, as well as the actions themselves, as displayed inFIG.4B, are meant as a non-limiting example. Referring toFIG.21, in an embodiment of the present invention, this is an exemplary screenshot of a GUI viewable on terminal110displaying readings taken by a patient and highlighting abnormal blood pressure readings visually, in this case, in red. To increase the security of the technique, a number of features are integrated into various embodiments of the present invention. Security features include, but are not limited to, providing accesses between the terminal110, the server130, and the care provider terminal170through an HTTPS protocol with a secured socket active certificate, locking a user out, whether a patient or a provider, after a set number of unsuccessful login attempts, refraining from storing patient-identifiable information on the terminal110, enabling remote deactivation of the terminal110and/or the access of the terminal110to the server130, through the care provider terminal170or at the server130, enabling deactivation of the care provider terminal170and/or the access of the care provider terminal170to the server130, at the server130, and/or at another terminal, storing the MAC address of the terminal110in a resource accessible to the server130and enabling access to the server130only if the MAC address is recognized by the software160, and/or storing data in encrypted databases in a secured server behind a firewall. In embodiments of the present invention, a factor that assists in facilitating communication between patients utilizing terminal and care givers utilizing terminals, are the graphical user interfaces provided by the software160. An embodiment of the present invention provides a separate customized GUI (graphical user interface) for each user group, patients and physicians (this terms includes other care providers). The interfaces can be referred to as a Patient Dashboard and a Physician Dashboard.FIG.5is a screenshot of an embodiment of a Patient Dashboard, whileFIG.6is a screenshot of an embodiment of a Physician Dashboard. Some features of various embodiments of these user interfaces, which are discussed in great details below, provide one or more of the following features: 1) data viewable on the Patient Dashboard is protected so that the patient name and MRN are not visible on the device; 2) through the Physician Dashboard, a care giver can take advantage of various reporting features available on the server130; 3) background color, text, textbox and buttons are different colors and provide a professional, easy to understand look; 4) security measures enable a user of the Physician Dashboard to access data exclusive to his or her patients. The sections that follow discuss features of the Physician Dashboard and Patient Dashboard GUIs available in select embodiments of the present invention. In an embodiment of the present invention, the Physician Dashboard has 5 tabs: Search, Medication, Refill, Notification, and Pin. Further embodiments of the present invention may include one or more of these tabs. In the embodiment discussed here, the Search tab allows the physician to locate a patient's data using the medical record number of that patient. The Medication tab allows the physician to enter current medications. Those medications will instantly populate the medication field on the Patient Dashboard. The Refill tab allows the physician to view refills the patient has requested through the medication field on the Patient Dashboard. The Notification tab alerts the physician to data that falls outside acceptable ranges for blood pressure, blood sugar and pulse. The Pin tab allows the physician to view a list of all the patients currently on the application, their names, MRNs and passwords. The Pin tab allows the physician to search for a patient using the MRN, first or last name. In embodiments of the present invention, the physician can view a patient's data in a variety of formats, including but not limited to, a daily format and/or an average weekly format. The Pin tab also enabled the physician to enter a new patient and delete or deactivate an existing patient. In an embodiment of the present invention, the Patient Dashboard has 3 tabs: My Vitals, Medication and Help. Further embodiments of the present invention may include one or more of these tabs. In an embodiment of the present invention, the My Vitals tab gives the patient the option to enter blood pressure, blood sugar or both. Once the data is entered in the appropriate fields, the patient has the option to Submit, Clear or Cancel the data. If the patient chooses to submit the data, software160obtains the data and handles it in a manner, as described in reference toFIG.4, wherein the physician effectively receives it instantly. In some embodiments, the My Vitals tab has a list, sorted chronologically, by date and time, of all data the patient has entered. This feature allows the patient to view all the data and determine if there is a pattern with their blood pressure or blood sugar. If the patient is able to determine a pattern then the patient is empowered to make changes in his or her treatment and/or lifestyle. In an embodiment of the present invention, the Medication tab has a list of medications the patient is currently taking. The medication list is generated on the Physician Dashboard and can only be modified on the Physician Dashboard. Once a medication is entered on the Physician Dashboard, the patient is asked to accept the medication using a simple two step procedure. This feature ensures that the patient and physician are in agreement with the current medication list. The patient is also able to request refills using a simple two step procedure. In an embodiment of the present invention, through the GUI that displays on the terminal110, the patient has an option to select a particular medication and request a refill. When a patient makes this selection, the software160displays this request in the Physician Dashboard, on the care giver terminal170. The care provider can utilize the Physician Dashboard to indicate that the prescription is renewed. In this manner, a provider can track his or her patient's medications, and thus, track chronic issues more easily. In an embodiment of the present invention, once the physician has renewed the prescription, the software160communicates this information to the patient by displaying an alert, for example, a Red alert, on the screen of the terminal110showing the old and the new updated med. When the patient utilizes an input device coupled or integrated into the terminal110to accept the medication update, the software160obtains this ascent and removes the alert. This quick method of asking for a refill helps a patient keep track of his or her meds as well as keep his or her blood pressure and blood sugar under control. In an embodiment of the present invention, the Help tab is available to guide the patients through the application and lists common abbreviations used on the application. The Help tab also provides the website and e-mail should the patient need technical assistance. Any medical questions must be directed through the patient's physician. As aforementioned, embodiments of the present invention can also be utilized to monitor the diet of a patient and to implement a nutrition plan. In an embodiment of the present invention, this diet-related aspect enables a user to utilize a drag and drop method in a GUI for characterizing a diet, including, but not limited to, choosing diet type, selecting from a list of possible or favorite food options, quantity, and time of day. The diet drag and drop screens can incorporate pictures, and text, as well as options to save or choose an item from favorite foods. An embodiment of the invention can also incorporate further functionality into the user's GUI on a terminal110such as tabs under a main Diet tab, including but not limited to Favorites, and Schedule. As a user selects a diet plan to plan meals and/or enters meals that he or she is consuming, the software160will determined the calories of the meal choices by accessing a mapping table on a computer readable storage medium accessible to the server130and/or internal to the server130. An embodiment of the present invention can include an Alert or Notifications feature, which will display messages to users from the dietitian and/or nutritionist who is monitoring the activity of the patient. Similarly, the present invention can also include a New or Recommendations feature that displays new food options that are preferred to help control blood sugar and blood pressure. By entering data regarding meal choices into a terminal110, the software160, upon encrypting and structuring the data in a manner that complies with HIPAA guidelines and protects the privacy of the patient, can make this data accessible to a nutritionist and/or dietician on a care provider terminal170. Specifically, in an embodiment of the present invention, by interacting with a Diet tab on a GUI, the patient enables the software160to obtains messages and number of calories consumed, to be passed on to the dietitian. To aid the patient and the dietician in understanding the content, the GUI provides color coded alerts based on calorie consumption and other nutritional information such as: protein, fat carbohydrates, etc. These colors alerts are configured to indicate how well the patient is following a pre-configured meal plan, which is accessible to the software160executed on the server so that the software can access the data entered as well as the plan data and determine whether the user is complying with the plan and identify discrepancies. In embodiments of the present invention, the aforementioned favorite list features may also feature a “NEW” tab in the Diet category. When a user selects this tab, the software160connects to internal and/or external memory resources to query whether there are new products on the market to check if there are new products on the market that are comparable to something on the favorite list of a given patient. As mentioned earlier, embodiments of the present invention store historical data securely on memory resources accessible to the software160executing on the server130. Historical data related to nutritional entries is also available in relation to diet entries. Thus in the client interface, in embodiments of the present invention, a user can view his or her History, retrieved from the saved data, on a separate tab, including having access to meal plans for a given period, such as the last ten days. To further increase ease of use, in embodiments of the present invention, the Diet tab includes animations that reflect a patient's progress at following a plan. For example, a character can appear when the software160determines that an intake obtained from the terminal110is out of an acceptable range. Embodiments of the present invention include a computer-implemented method, a computer program product, and a system for enabling streaming communication between a patient and a provider, the method comprising. In some embodiments of the present invention, program code executed by one or more processors executes an interface on a remote care provider device, where the interface is configured to receive and to access data of patients associated with a care provider and to communicate the patients. The program code obtains, at a secure HIPAA compliant server, from a mobile device over an Internet connection, data related to the health state of a patient selected from the patients, where a first portion of the data is obtained upon submission, via an interface on the mobile device and a second portion of the data is obtained from a secured location on the mobile device, wherein the second portion of data was submitted through the interface when the mobile device was not connected to the secure HIPAA compliant server over the Internet and stored by the mobile device in the secured location of the mobile device, where the secure HIPAA compliant server comprises a processor and a computer readable medium that stores an electronic medical record comprising a medical record number of the patient, historical medical data for the patient associated with the medical record number, and contact information for the care provider for the patient, wherein the contact information is utilized to enable streaming communication between the patient and care provider. The program code (of the secure HIPAA compliant server) associates a timestamp with the data, associating the data with the medical record number of the patient. The program code (of the secure HIPAA compliant server) writes the data to the computer readable medium in an encrypted format. The writing includes program code (of the secure HIPAA compliant server) encrypting the data, the program code (of the secure HIPAA compliant server) converting the data to a first set of HL7 embedded portable document format (PDF) message files, and the program code (of the secure HIPAA compliant server) writing the first set of HL7 embedded portable document format (PDF) message files into the electronic medical record. The program code determines whether the data is in a pre-configured range. The program code determines, based on the contact information that the patient is associated with the care provider. Responsive to determining that the data is not in the pre-configured range and that the patient is associated with the care provider, the program code utilizes the contact information to transmit, automatically, a real-time alert in the encrypted format over a wireless communication channel to the remote care provider device, where the alert is automatically displayed in the interface, where the displaying enables the care provider to utilize the interface to access, over the Internet, certain of the data related to the health of the patient and the historical medical data stored on the computer readable medium of the secure HIPAA compliant server, and where the alert comprises personally identifiable patient data transmitted as an HL7 message file. Responsive to the alert, the program code obtains a response from the wireless device associated with the care provider of the patient and associates the response with the medical record number of the patient and encrypts and writes the response to the computer readable medium in the encrypted format, where the response comprises a medical recommendation based on at least one of: the data and/or a portion of the historical medical data. The program code displays, on the mobile device, instantaneously upon obtaining, the medical recommendation, based on the streaming communication, where the medical recommendation comprises a diet plan. Based on obtaining the diet plan, the program code executes a query on a memory resource selected from the group consisting of an external memory resource and an internal memory resource. Responsive to the query, the program code obtains information describing one or more products compatible with the diet plan. The program code displays the information on the mobile device. In some embodiments of the present invention, program code executing on one or more processors executes an interface on a remote care provider device, where the interface is configured to receive and to access data of patients associated with the care provider and to communicate the patients. The program code obtains, at a secure HIPAA compliant server, from an interface on a mobile device over an Internet connection, data related to the health state of a patient selected from the patients, where the secure HIPAA compliant server comprises a processor and a computer readable medium that stores an electronic medical record comprising a medical record number of the patient, historical medical data for the patient associated with the medical record number, and contact information for the care provider for the patient, wherein the contact information is utilized to enable streaming communication between the patient and care provider. Program code executing on a processor of the secure HIPAA compliant server associates a timestamp with the data and associates the data with the medical record number of the patient. The program code executing on the processor of the secure HIPAA compliant server writes the data to the computer readable medium in an encrypted format, where the writing comprises: encrypting the data, converting the data to a first set of HL7 embedded portable document format (PDF) message files, and writing the first set of HL7 embedded portable document format (PDF) message files into the electronic medical record. The program code (executing on the one or more processors) determines whether the data is in a pre-configured range. The program code determines, based on the contact information that the patient is associated with the care provider. Responsive to determining that the data is not in the pre-configured range and that the patient is associated with the care provider, the program code utilizes the contact information to transmit automatically a real-time alert in the encrypted format over a wireless communication channel to the remote care provider device, wherein, based on determining that the wireless device associated with the care provider is online, the alert is automatically displayed in the interface, and wherein based on determining that the wireless device associated with the care provider is not online, the alert is retained at a secured location and displayed in the interface when the wireless device associated with the care provider is online, where the displaying enables the care provider to utilize the interface to access, over the Internet, certain of the data related to the health of the patient and the historical medical data stored on the computer readable medium of the secure HIPAA compliant server, where the alert comprises personally identifiable patient data transmitted as an HL7 message file. Responsive to the alert, the program code obtains a response from the wireless device associated with the care provider of the patient and associates the response with the medical record number of the patient and encrypts and writes the response to the computer readable medium in the encrypted format, where the response comprises a medical recommendation based on at least one of: the data, a portion of the historical medical data. The program code displays, on the mobile device, instantaneously upon obtaining, the medical recommendation, based on the streaming communication, where the medical recommendation comprises a diet plan. Based on obtaining the diet plan, the program code executes a query on a memory resource selected from the group consisting of an external memory resource and an internal memory resource. Responsive to the query, the program code obtains information describing one or more products compatible with the diet plan. The program code displays the information on the mobile device. In some embodiments of the present invention, the program code converts the response to a second HL7 message files before writing the data to the computer readable medium. In some embodiments of the present invention, the historical medical data includes historical data related to the health of the patient obtained over a pre-configured period of time. In some embodiments of the present invention, the data comprises at least one of a blood sugar reading or a blood pressure reading. In some embodiments of the present invention, the medical recommendation comprises at least one prescription. In some embodiments of the present invention, the data comprises a record of food consumed by the patient over a given period of time. In some embodiments of the present invention, the patient data comprises vital signs of the patient and the medical recommendation comprises a provider intervention. In some embodiments of the present invention, the patient data comprises dietary habits of the patient and the medical recommendation comprises a provider intervention. In some embodiments of the present invention, the program code generates, based on the data related to the health state of a patient and the medical recommendation, an HL7 embedded PDF document. The program code integrates the HL7 embedded PDF document into the electronic medical record.FIG.25is an example of a PDF that can be generated by program code in some embodiments of the present invention. Not only does the program code in the interface generate the PDF summary, but this PDF can be integrated, by the program code, into an electronic medical records (EMR) system. The data creates a dual integrated interface with CMV and EMR. Program code in embodiments of the present invention can also obtain (and select and query) data from the EMR system through a CCDA Care Continuity Document. An embodiment of the present invention includes the use of a mobile device, which will allow close connection between the physician and the patient. The patient will enter the blood pressure, blood sugar, pulse and meal plan readings their mobile device in a manner including, but not limited to, manually, utilizing an input method, or by voice activation. The GUI utilized for entry and the back end system is useable with any mobile device or computer, which has access to a communications network, such as the Internet. An embodiment of the present invention is a web based application. An embodiment of the present invention is HIPAA compliant, secure, and/or the data is encrypted before it saves to any computer readable storage medium. In an embodiment of the present invention, a central server stores all patient data, and creates a HL7 message file to be ready to transport to the patient's medical record. One advantage of the present invention is that it eliminates a patient's paper readings and enabled patients to review their medications and request refills electronically. FIGS.7-21are screenshots that are examples from a GUIs of an embodiment of the present invention. These screenshots are offered as a non-limiting example to illustrate the ease of interaction with the system for a user. FIG.7is an example of a Provider Admin Screen with patient information hidden. FIG.8is a Notification Screen with Alerts from Patients with Comments and Date Sorted for Provider monitoring. FIG.9is an example of Refill Request functionality available to the patient, as well as direct instant communication on Provider side for each Refill request. One click to request a refill is a unique option for the patient. This shows an alert on the provider side that a patient is looking for a medication refill. After the refill is updated, the patient receives a message back in the application notifying about the same. FIG.10is a Medication form for the Provider to add or edit a medication. FIG.11illustrates the Search Option available to search for patients using PIN #s, Last names or First Names, discussed earlier. FIG.12illustrates how Medication Details pop up on Patient Side. FIG.13is a Help Screen on the Patient side to provide easy instructions to input the variables. FIG.14illustrates how Patients can enter their vital signs into the GUI. FIG.15illustrates a Keyboard as well as voice activated screen to type or talk into the screen to input vital signs. FIG.16is a Blood Pressure Recording/Reading screen in a table grid format, with date with sorting feature available and details available on double click. FIG.17is a Blood Sugar Recording/Reading screen in a table grid format, with date with sorting feature available and details available on double click. FIG.18is a Blood Pressure & Blood Sugar Recording/Reading screen in a table grid format, with date with sorting feature available and details available on double click. FIG.19is a Patient Medication List shown on a screen with Change, Old medications to accept refills requested by the patients. FIG.20depicts Blood Pressure, Blood Sugar and Both options available for recording on the Patient Dashboard screens. FIG.21shows a listing of blood pressure readings to demonstrate that detail is available, based on date and time of the reading, through interfaces generated by the program code in embodiments of the present invention. As discussed earlier, the details and timing of notifications to both care providers as well as to patients (as a streaming communication) coupled with security and privacy features provide various advantages over existing method of enabling electronic communications between care providers and patients.FIG.22is a dashboard that provides, at a glance, a summary of statistics for a given care provider. In this example, the program code generates a screen that shows a number of patients (assigned to the care provider), a number of active patients (e.g., those who have interacted in various ways with the care provider through the application, including, in one example, those who have requested prescription refills through the application). The interface generated by the program code also displays the number of readings in the last year (from utilizing various Internet of Things (IoT) devices, including those integrated into mobile devices, to monitor patients), notifications, refills, average patient age, number of care providers, and the last PDF that was generated by the application. An example of the type of PDF that can be generated by an embodiment of the present invention isFIG.25. As understood by one of skill in the art, the IoT is a system of interrelated computing devices, mechanical and digital machines, objects, animals and/or people that are provided with unique identifiers and the ability to transfer data over a network, without requiring human-to-human or human-to-computer interaction. These communications are enabled by smart sensors, which include, but are not limited to, both active and passive radio-frequency identification (RFID) tags, which utilize electromagnetic fields to identify automatically and to track tags attached to objects and/or associated with objects and people. Smart sensors, such as RFID tags, can track environmental factors related to an object or an area, including but not limited to, temperature and humidity. The smart sensors can be utilized to measure temperature, humidity, vibrations, motion, light, pressure and/or altitude. IoT devices also include individual activity and fitness trackers, which include (wearable) devices or applications that include smart sensors for monitoring and tracking fitness-related metrics such as distance walked or run, calorie consumption, and in some cases heartbeat and quality of sleep and include smartwatches that are synced to a computer or smartphone for long-term data tracking. Because the smart sensors in IoT devices carry unique identifiers, a computing system that communicates with a given sensor can identify the source of the information. Although in some embodiments of the present invention, users actively register IoT devices for utilization by the program code, in some embodiments of the present invention, the program code could automatically discover possible IoT devices and request confirmation from the user. Within the IoT, various devices can communicate with each other and can access data from sources available over various communication networks, including the Internet. Certain IoT devices can also be placed at various locations and can provide data based in monitoring environmental factors at the locations. In embodiments of the present invention, program code executing on one or more processors can obtain various values (readings) provided, in real-time, as well as historically, by one or more IoT devices. One interface generated by the program code in embodiments of the present invention (and consistently updated as more information is provided through a patient interface) is a graphical interface referred to as a healthy wheel.FIG.23provides an example of the healthy wheel provided by the program code in various embodiments of the present invention. A healthy wheel is a snapshot that displays, in real-time, and updates, in real-time, a snapshot of overall patient health. The healthy wheel is a combination of multiple data variables that allow a provider to understand a patient better, not just using clinical vital signs, but also by utilizing socio demographic factors that are relevant to the patient. Program code in embodiments of the present invention can obtain data that it populates on the health wheel from a variety of heterogeneous sources, including electronic medical records, socioeconomic data related to geographic areas, and information provided by a patient (on entry through the application and also, from secured data). In order to populate the healthy wheel, the program code collects, both actively and passively, various data. As illustrated inFIG.23an activity portion of the healthy wheel captures data from daily patient activity. The activity for a given patient can be designed by a healthcare provider or other care giver. This activity is designed for the patient, and the average activity is considered to calculate the health state of the given patient. In embodiments of the present invention, the program code can determine whether an individual is meeting activity thresholds both based on manual entry by a patient though a patient interface and/or by passively capturing this data, for example, from an IoT device of the patient, including but not limited to an activity tracker. In some embodiments of the present invention, program code assesses the activity of a given patient based on different factors, including but not limited to, a number of minutes, and assessment of a level of activity, the age or age range of the patient, and/or the medical issues of the patient. The activity can be established on a minimum scale activity, which can include participation of the patient in physical activities, including home activity, walking, etc. The activity can also be broken down into stages and can be managed by a medical provider, through the interface including but not limited to, a physiologist. In some embodiments of the present invention, the healthy wheel also captures a socio-economic status of a given patient. This factor can be a rating of 1-4 (for example) on a Townsend scale (based on the Townsend index, a measure of material deprivation within a population). The determination of the socio-economic status of a given patient can be determined by the program code based on pulling data from various sources, including patient records, but can also be based on polling a patient for data. The Townsend scale is based on four variables: employment (or, rather, lack of employment of people above 16 within a given household), car ownership (or, rather lack of ownership), home ownership (or, rather lack of ownership), and household (over)crowding. This information is available to the program code based on patient entry and/or medical records, in some embodiments of the present invention. Thus, the program code can provide this healthy wheel representation to include this actor. In some embodiments of the present invention, the healthy wheel interface also includes a value for depression, which is binary. This value is based upon the medical records of the individual. In some embodiments of the present invention, the healthy wheel interface also includes a value representing tobacco use, which can be binary, but can also be a value on a set scale, including but not limited to, whether the patient is a smoker, not a smoker, an ex-smoker, a heavy smoker, and/or an infrequent (low) smoker. In some embodiments of the present invention, the specific smoking habits of an individual can be obtained to populate this element in the interface. Certain other elements of the healthy wheel can also be binary values, in some embodiments of the present invention, the healthy wheel displays the employment status of the patient (e.g., employed or unemployed), the housing situation of the patient (e.g., independent or dependent), and/or the alcohol usage of the patient (e.g., yes or no). In some embodiments of the present invention, the program code can provide more details for these elements of the healthy wheel. As aforementioned, the information utilized to populate the healthy wheel can come from various data sources, including the electronic medical records of the patient, entry by the patient through and interface, and/or publicly available data sources, including but not limited to, social media. In some embodiments of the present invention, the healthy wheel also includes the diet of the individual (as provided by the patient as well as medical records). Elements that comprise the diet can include, but are not limited to fruits and vegetables consumed. In some embodiments of the present invention, a health provider, who is a dietician, can count a minimum of vegetables, 2, 3 4, or whether the patient consumes foods at all (yes or no), can view a healthy seven scale, based on readings, including, but not limited to weight, whether the patient has diabetes, (diet is denominator). The care provider can determine whether the patient needs a therapeutic lifestyle change, and can establish and implement a baseline requirement for the patient. In embodiments of the present invention, any adjustments that the care giver provides in the healthy wheel can be transmitted in real-time to the patient. In some embodiments of the present invention, the healthy wheel also includes whether the patient has family support (in maintaining a health state). This can be a binary value (yes or no), and can also include details about the living situation of the patient, including but not limited to, whether the support provider cooperative, remote, and/or in-house. Notifications can populate in various parts of the healthy wheel such that the care provider can see where a patient has strayed from a baseline. In some embodiments of the present invention, the program code displays certain parts of the wheel in different colors in order to draw attention to areas that include deviations. As discussed above, in various embodiments of the present invention, the program code provides alerts to a provider, through an interface.FIG.24is an example of the level of detail in which alerts can be provided in an interface in some embodiments of the present invention. As illustrated inFIG.24, the program code in embodiments of the present invention enables providers to see population health specifics and allows providers to contact support without leaving the application interface. A healthcare provider (user) can click on a given alert, navigate directly to a more detailed record (including but not limited to a healthy wheel interface), and can contact an additional individual linked to the patient's record for assistance. For example, a physician could utilize the application to contact a dietician and vice versa. When either the physician or the dietician makes an adjustment in the interface, responsive to the alert, the patient can receive this change (e.g., medical recommendation) in real time. In some embodiments of the present invention, the program code can anticipate (predict) a deviation that would result in an alert to the healthcare provider through the interface, in advance of an actual event. To this end, the program code monitors the user and by utilizing data collected by available (e.g., registered) IoT devices, and can apply machine learning algorithms to model the user's health patterns and to generate a user health profile, establishing a baseline (which can be automatic or can be set, in advance, for a patient, by a healthcare provider, through an interface, which can include the healthy wheel). The program code can train these algorithms, based on patterns for the patient (or across all patients). Some embodiments of the present invention utilize a machine learning training system to perform cognitive analyses of sensor and IoT data and/or electronic medical records, to generate a user health profile (e.g., baseline) in embodiments of the present invention. Program code can obtain data in embodiments of the present invention from one or more personal devices (e.g., IoT devices, sensors, personal health trackers, physical activity trackers, smart watches, etc.), which the user can be utilizing while a session is active on a computing device, as well as from entry values by the user and/or from electronic medical records of the user. Machine learning (ML) solves problems that cannot be solved by numerical means alone. In this ML-based example, program code extracts various features/attributes from training data (e.g., medical records), which can be resident in one or more databases. In some embodiments of the present invention, the training data can comprise historical medical and general health data (such as in the categories in the healthy wheel) of the user and/or of a group of users. The features are utilized to develop a predictor function, h(x), also referred to as a hypothesis, which the program code utilizes as a machine learning model. In identifying various features/attributes (e.g., patterns) in the training data, the program code can utilize various techniques including, but not limited to, mutual information, which is an example of a method that can be utilized to identify features in an embodiment of the present invention. Further embodiments of the present invention utilize varying techniques to select features (elements, patterns, attributes, etc.), including but not limited to, diffusion mapping, principal component analysis, recursive feature elimination (a brute force approach to selecting features), and/or a Random Forest, to select the features. The program code can utilize a machine learning algorithm to train the machine learning model (e.g., the algorithms utilized by the program code), including providing weights for the conclusions, so that the program code can prioritize various anticipated health events, in accordance with the predictor functions that comprise the machine learning model. The conclusions can be evaluated by a quality metric. By selecting a diverse set of training data, the program code trains the machine learning model to identify and weight various attributes (e.g., features, patterns) that correlate to various medical events. Based on modeling the user's behavior and medical data, the program code can determine (for example) whether temporal sensor data represents an established pattern, or whether a deviation can be anticipated. ## In some embodiments of the present invention, the program code executed by one or more processors, utilizes machine learning to predict and provide confidence level statistic within the interface in order to provide variability data to healthcare providers.FIGS.26-28are examples of predictions and statistics that can be generated in the interface utilized by healthcare providers in embodiments of the present invention. As illustrated inFIGS.26-28, the program code in some embodiments of the present invention generates prediction and confidence interval statistics including, but not limited to, automatically generating Real Variability, Standard Deviation, and/or Coefficient of Variation. The interface generated by the program code in some embodiments of the present invention also provides a user with a view of reconciled medications by integrating data from the CCDA EMR documents. This allows providers to make a comprehensive treatment plan and alleviates errors on the part of providers, which could have adverse health consequences.FIG.29provides an example of a medication reconciliation interface generated by program code in some embodiments of the present invention. As discussed above, in some embodiments of the present invention, the program code can provide a recommendation responsive to a medical issue that is related to the diet of a patient. To that end,FIG.30is an example of an interface generated by the program code in embodiments of the present invention that enables a care provider user to see data in a structured way. In both an interface provided by the program code to the patient, as well as to the provider, the user can scan foods, as well as save functionalities being recommended by the dietitian. Based on recommendation provided by the dietician, the program code in the interface can make specific “smart” recommendations that factor in health goals set by professionals (and in concert with the recommendations). As a health profile of a given patient includes exercise, in some embodiments of the present invention, the program code generates an interface by which not only can a patient enter exercise, but the provider can also view the exercise (and annotate) in a comprehensive manner.FIG.31is an example of this interface. Through this exercise functionality, providers receive data in a more structured way to understand activity function for patients. As with the diet functionality, based on goals and recommendations set by a healthcare provider, the program code can make recommendations to the patient to fulfill goals (these can be understood as smart recommendations based on the program code utilizing algorithms). In some embodiments of the present invention, the exercise interface can be automatically populated on the patient side because the patient device running the application interfaces with an IoT device of the patient which tracks physical activity of the patient. FIG.32shows how a patient can provide information about his/her/their sleep patterns through the patient interface, which is then available to the healthcare provider. This questionnaire is a sleep test and the program code correlates the blood pressure of the patient (via medical records and/or an IoT device and/or patient entry with the patient's blood pressure and blood sugar data.FIG.33is a similar interface in some embodiments of the present invention, but it related to stress and it also allows the provider to correlate this data with blood pressure and blood sugar. As seen inFIG.34, in some embodiments of the present invention, the program code provides an interface (in the application) to measure mental health of a patient utilizing mini-mental state examiner (MMSE) examinations. Streaming communication provided by the application (both to the provider and the patient) include encrypted messaging between provider and patient. For example, some embodiments of the present invention include an encrypted chatroom, as illustrated inFIG.35, where the program code encrypts communication such that they cannot be intercepted and are secure. When utilizing embodiments of the present invention to make a medical recommendation, the provider has various internal resources to refer to.FIGS.36-37are two of these types of resources. WhileFIG.36shows decision support,FIG.37is a guidelines document. Treatment guidelines saved on a resource accessible to the application are updated regularly. Below, Example 1 is a recitation of an embodiment of at least one aspect of the present invention. Example 1 Thirty-three percent of the population has been diagnosed with hypertension and 25.8 million Americans are diagnosed with Type I or II Diabetes; 1.9 cases per year. Example 1 of the present invention addresses this problem. A more effective way to monitor patient's w/hypertension and diabetes, occurs when patients can check their own readings and receive tight physician management through application The present invention is a physician driven application for their patients to monitor disease states in the comfort of their homes/office/school. Patients take their readings and send them in real time to their physician for interpretation and treatment via secure encrypted server. This invention is an improvement on what currently exists. This is a physician driven application for their patients to monitor disease states in the comfort of their homes/office/school. Patients take their readings and send them in real time to their physician for interpretation and treatment via secure encrypted server. The patient's medical data including medications relating to diabetes and hypertension are displayed with patient readings along pulse pressure, weight, height-all integral parts of treating a patient for disease states In application screen, medical information exclusive to patient is sent to physician for interpretation and recommendation. The Version of The Invention Discussed Here Includes:1. An application for a mobile device2. Offered exclusively by the physician to his/her own patients3. HIPAA compliant4. Patient data goes through secure encrypted server5. Monitor patients with Diabetes and Hypertension in real time6. Tight physician management of diseases7. Patient data and outcomes easily integrated into patient's electronic medical record8. Eliminates office Visits9. Patients can send multiple readings every day and are being monitored more closely The invention is used to improve and tighten up physician management of Diabetes and Hypertension (5&6) by using mobile device technology (1) that is offered and sold exclusively by the physician to his/her own patients (2). The patient can send multiple readings every day to his/her provider (9) the readings will be date/time stamped and is send through a secure encrypted (4) HIPAA compliant server (3) which is easily integrated into the patient electronic medical record (7) and eliminates office visits (8) for the patient. After the blood pressure and blood sugar readings are inputted manually into the mobile device by the patient, there is a button to send the data to the secure server for review by the physician. The personal identification of each patient utilizes the medical record number of the patient. The diseases readings are then monitored and managed by the physician and he/she sees fit by sending return message to the patient regarding the readings In standard medical practice, specializing in Diabetes and Hypertension all elements is necessary for full medical analysis and treatment of disease states. The software written includes all the elements necessary to maximize the best outcome for the patient and physician. Any change or shuffling of elements could severely affect the health care of the patient. The patient (user) records his or her own blood sugar and or blood pressure readings, those readings are date/time stamped and then the patient sends them to the physician for interpretation and management of their disease states. It is interactive software so that the physician can make recommendations to the patient for changes in medications, diet, and exercise to positively affect/improve their disease. The patient becomes very involved in their own health care, but not “tied” to their physician for multiple office visits. Accordingly a small sample of combinations set forth in Example 1 are the following: A1. A method for improving communication between a patient and a provider, the method comprising: obtaining, by a processor, data related to the health state of a patient; associating, by the processor, a timestamp with the data, encrypting the data and writing the data to a computer readable medium; determining, by the processor, whether the data is in a pre-configured range; responsive to determining that the data is not in the pre-configured range, sending an alert to a client; and obtaining a response from the client and writing the response to the computer readable medium, wherein the response comprises a medical recommendation based on the data. A2. The method of A1, further comprising converting the data to a first HL7 message files before writing the data to the computer readable medium. A3. The method of A1, further comprising converting the response to a second HL7 message files before writing the data to the computer readable medium. A4. The method of A1, further comprising, writing the data to an electronic medical record associated with the patient. A5. The method of A1, wherein the alert comprises the data and supplemental data retrieved from the computer readable medium. A6. The method of A5, wherein the supplemental data comprises historical data related to the health of the patient obtained over a pre-configured period of time. A7. The method of A1, wherein the data comprises at least one of a blood sugar reading or a blood pressure reading. A8. The method of A1, wherein the medical recommendation comprises at least one prescription. A9. The method of A1, wherein the data comprises a record of food consumed by the patient over a given period of time. A10. The method of A9, wherein the medical recommendation comprises a diet plan. B1. A computer system for improving communication between a patient and a provider, the computer system comprising: a memory; and a processor in communications with the memory, wherein the computer system is configured to perform a method, said method comprising obtaining, by the processor, data related to the health state of a patient; associating, by the processor, a timestamp with the data, encrypting the data and writing the data to a computer readable medium; determining, by the processor, whether the data is in a pre-configured range; responsive to determining that the data is not in the pre-configured range, sending an alert to a client; and obtaining a response from the client and writing the response to the computer readable medium, wherein the response comprises a medical recommendation based on the data. B2. The computer system of claim B1, the method further comprising converting the data to a first HL7 message files before writing the data to the computer readable medium. B3. The computer system of claim B1, the method further comprising converting the response to a second HL7 message files before writing the data to the computer readable medium. B4. The computer system of B1, the method further comprising writing the data to an electronic medical record associated with the patient. B5. The computer system of B1, wherein the alert comprises the data and supplemental data retrieved from the computer readable medium. B6. The computer system of B1, wherein the supplemental data comprises historical data related to the health of the patient obtained over a pre-configured period of time. B7. The computer system of B1, wherein the data comprises at least one of a blood sugar reading or a blood pressure reading. B8. The computer system of B1, wherein the medical recommendation comprises at least one prescription. C1. A computer program for improving communication between a patient and a provider, the computer program product comprising: a computer readable storage medium readable by a processing circuit and storing instructions for execution by the processing circuit for performing a method comprising: obtaining, by the processor, data related to the health state of a patient; associating, by the processor, a timestamp with the data, encrypting the data and writing the data to a computer readable medium; determining, by the processor, whether the data is in a pre-configured range; responsive to determining that the data is not in the pre-configured range, sending an alert to a client; and obtaining a response from the client and writing the response to the computer readable medium, wherein the response comprises a medical recommendation based on the data. C2. The computer program of claim C1, the method further comprising: converting the data to a first HL7 message files before writing the data to the computer readable medium; converting the response to a second HL7 message files before writing the data to the computer readable medium; and writing the data to an electronic medical record associated with the patient in the computer readable medium. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the descriptions below, if any, are intended to include any structure, material, or act for performing the function in combination with other elements as specifically noted. The description of the technique has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated. | 92,483 |
11862348 | DETAILED DESCRIPTION Disclosed herein are systems, devices and methods for generating a surgical plan for altering an abnormal bone using generic normal bone models. Various embodiments described herein can help improve the efficacy and the reliability in osteoplasty planning, such as removal of excess bone from the femoral neck in cam impingement. The methods and devices described herein can also be applicable to planning surgery of pathological bones under various other conditions. FIG.1is a block diagram that illustrates an example of a system100for planning a surgery on an abnormal bone. The system100can include a model receiver module110, an input interface120, and a surgical planning module130. The system100can also include a memory circuit140and a controller circuit150. Optionally, the system100can include a communication interface160. In an example, the system100can generate instructions for operating a surgical tool (such as a surgical navigation system or medical robotics) to alter the abnormal bone, such as by surgically removing an excess portion from the abnormal bone. The model receiver module110can be configured to receive a generic normal bone model. Examples of the normal bone can include a femur, an acetabulum, or any other bone in a body. The generic normal bone model can include a data set representing a normal bone which has an anatomical origin comparable to the abnormal bone to be altered by the system100. In some examples, the generic normal bone model can represent the shape or appearance of the anatomical structure of the normal bone. The generic normal bone model can be in a form of a parametric model, a statistical model, a shape-based model, or a volumetric model. The generic normal bone model can also be based on physical properties of the normal bone, such as an elastic model, a geometric spine model, or a finite element model. In a particular example, the generic normal bone model may include a statistical shape (SS) model derived from a plurality of images of normal bones of comparable anatomical origin from a group of subjects known to have normal bone anatomy. The SS model comprises a statistical representation of the normal bone anatomy from the group of subjects. In some examples, the generic normal bone model can represent a desired postoperative shape or appearance of the normal bone. The desired postoperative shape or appearance of the normal bone can be obtained by modifying a normal bone model (such as a parametric model, a statistical model, a shape-based model, or a volumetric model) using a computer software configured for three-dimensional manipulation of the normal bone model. In some embodiments, the generic normal bone model can be generated using a system external to the system100, and the generic normal bone model can be stored in a machine-readable medium such as a memory device. The model receiver module110can retrieve from the memory device a generic normal bone model that represents an anatomical origin comparable to that of the abnormal bone. In some embodiments, the system100can include a generic normal bone model generator configured to be coupled to the model receiver module110. The normal bone model generator can create a generic normal bone model such as by using shape data or appearance data. The shape data may include geometric characteristics of a bone such as landmarks, surfaces, boundaries of three-dimensional images objections. The appearance data may include both geometric characteristics and intensity information of a bone. In an example, the shape data or appearance data can be constructed from a plurality of medical images of the normal bones of comparable anatomical origin from a group of subjects. The medical images can include two-dimensional (2D) or three-dimensional (3D) images. Examples of the medical images include an X-ray, an ultrasound image, a computed tomography (CT) scan, a magnetic resonance (MR) image, a positron emission tomography (PET) image, a single-photon emission computed tomography (SPECT) image, or an arthrogram. In another example, the shape data or appearance data can be constructed from a plurality of point clouds acquired from normal bones of comparable anatomical origin from a group of subjects using a coordinated measuring system (such as one or more tracking probes). In an embodiment, the shape data or appearance data can be constructed from medical images or point clouds of normal bones from a group of subjects with comparable age, gender, ethnicity, size, or other physical or demographical data. For example, the shape data or appearance data may include medical images or point clouds of normal bones from the subjects whose physical or demographical data are comparable to the host (patient) of the abnormal bone being analyzed by the system100. This would allow the generic normal bone model to specifically represent the abnormal bone under analysis. The input interface120can be configured to receive an abnormal bone representation including a data set representing the shape, appearance, or other morphological characteristics of the abnormal bone. The abnormal bone representation can be analyzed by the system100to identify a region of abnormality. The input interface120can receive the abnormal bone representation from a patient database. The abnormal bone representation can include one of more of a medical image, a point cloud, a parametric model, or other morphological description of the abnormal bone. In some examples, the input interface120can be configured to be coupled to an imaging system or other image acquisition module within or external to the system100. The imagining system or the image acquisition module can feed the abnormal bone representation (e.g., one or more images or point clouds) to the system100via the input interface120. In some embodiments, the generic normal bone model received from the model receiver module110has data format or modality comparable to the abnormal bone representation received from the input interface120. For example, if the input interface120receives a CT scan image of the pathological femur from a patient, then the model receiver module110can be configured to receive an SS model derived from CT scans of normal femurs of comparable anatomical origin from a group of patients. In another example, the input interface120can receive a CT scan image of the pathological acetabulum from a patient, and the model receiver module110can be configured to receive an SS model derived from CT scans of normal acetabula of comparable anatomical origin from a group of patients. The surgical planning module130can be configured to generate a surgical plan for altering a portion of the abnormal bone. As illustrated inFIG.1, the surgical planning module can include a registration module131and a surgical plan formation module132. The registration module131can be configured to register the generic normal bone model to the abnormal bone representation. Due to the anatomical variations across subjects, and/or the extrinsic differences resulted from different data acquisition processes (e.g., the imaging system or the image acquisition processes), the generic normal bone model and the abnormal bone representation may have structural discrepancies resulting in reduced correspondence. The registration module131can transform the generic normal bone model into a registered generic model specific to the abnormal bone under analysis. The registered generic model can be in a coordinate system similar to that of the abnormal bone representation. Examples of the registration module131are discussed below, such as with reference ofFIG.2. The surgical plan formation module132can be configured to identify one or more abnormal regions of the abnormal bone using comparison of the registered generic model and the abnormal bone representation. In an example, the surgical plan formation module132can calculate a level of disconformity between the registered generic model and the abnormal bone representation. The disconformity can be used as a basis for surgical planning Examples of the surgical plan formation module132are discussed below, such as with reference ofFIG.3. The memory circuit140can be configured to store the generic normal bone model such as received from the model receiver module110, the abnormal bone representation such as received from the input interface120, and a set of instructions controlling operation of individual modules of the system100and inter-module data communication. In an example, the registered generic model created by the registration module131can be stored in the memory circuit140. The controller circuit150can be coupled to the surgical planning module130and the memory circuit140. The controller circuit is configured to execute the set of instructions to cause the surgical planning module130to generate the surgical plan for altering the portion of the abnormal bone from the one or more abnormal regions. The communication interface160, coupled to the surgical planning module130and the memory circuit140, can be configured to generate a representation illustrating one or more of the generic normal bone model, the registered generic model, the abnormal bone representation, and the surgical plan. The communication interface160can include a display device configured to present the information in audio, visual, or other multi-media formats to assist the surgeon during the process of creating and evaluating a surgical plan. Examples of the presentation formats include sound, dialog, text, or 2D or 3D graphs. The presentation may also include visual animations such as real-time 3D representations of the generic normal bone model, the abnormal bone representation, the registered generic model, and the surgical plan, among other things. In certain examples, the visual animations are color-coded to further assist the surgeon to visualize the one or more regions on the abnormal bone that needs to be altered according to the surgical plan. In various examples, the communication interface160can also include a user input device configured to receive user input to accept or modify the surgical plan generated by the surgical planning module130. The communication interface160can communicate over an internal bus to other modules within the system100. In some examples, the communication interface160can be configured to communicate with one or more external devices including, for example, a tracking device, a positioning device, a surgical navigation system, or a medical robotic system. The communication interface160can include both wired interface (such as cables coupled to the communication ports on the communication interface160) and wireless connections such as Ethernet, IEEE 802.11 wireless, or Bluetooth, among others. FIG.2is a block diagram that illustrates an example of a registration module131. The registration module131can include a segmentation module210, a model transformation module220, a matching module230, and an alignment module240. As illustrated inFIG.1, the registration module131can take as input the generic normal bone model and the abnormal bone representation, and generate registered generic model and the alignment between the registered generic model and the abnormal bone representation. The segmentation module210can be configured to partition the generic normal bone model into a plurality of segments. For example, when the generic normal bone model constitutes a medical image or point cloud, the segmentation module210can partition the image or the point cloud into segments representing various anatomical structures. In some examples, the segmentation module210can be configured to assign a label to each of the segments, such that the segments with the same label share specified characteristics such as a shape, anatomical structure, or intensity. The segmentation module210can also partition the abnormal bone representation into a plurality of segments. For example, the segmentation module can differentiate the pathological portion from the normal portion on the abnormal bone representation, and identify from the segments of the abnormal bone representation a registration area free of anatomical abnormity. In some embodiments, the segmentation module210can be optional. For example, the segmentation module210can be excluded from the registration module131when both the generic normal bone model and the abnormal bone representation, when received by the system100, are segmented images with labels assigned according to the respective anatomical structures. The model transformation module220can transform the generic normal bone model to create a registered generic model such as using a comparison between the area on the abnormal bone free of anatomical abnormity and the corresponding segments of the generic normal bone model. The transformation can include linear or nonlinear operations such as scaling, rotation, translation, expansion, dilation, or other affine transformation. The transformation can include rigid transformations that preserve the distance (such as translation, rotation, and reflection) or non-rigid transformations such as stretching, shrinking, or model-based transformations such as radial basis functions, splines, or finite element model. In some embodiments, the model transformation module220can employ both the rigid transformation to bring the generic normal bone model in global alignment with the size and orientation of the abnormal bone representation, and the non-rigid transformation to reduce the local geometric discrepancies by aligning the generic normal bone model with the abnormal bone representation. In some embodiments, the model transformation module220can determine a desired transformation Θ that minimizes the difference between the identified abnormity-free segments on the abnormal bone representation Sabnormal(x,y,z) and the corresponding segments of the generic normal bone model Smodel(x,y,z) generic normal bone model following the transformation Θ. That is, the desired transformation Θoptis selected such that the Euclidian distance ∥Θopt(Smodel(x,y,z))−Sabnormal(x,y,z)∥ is minimized. The model transformation module220can then apply the desired transformation Θoptto the generic normal bone model to create the registered generic model Θopt(Smodel). The matching module230can match the registered generic model to the abnormal bone representation. In an embodiment, the matching module230can match, in response to identifying the registration area of the abnormal bone, one or more segments of the registered generic model to the corresponding registration area of the abnormal bone. The alignment module240can be configured to align the remaining segments of the registered generic model with the remaining segments of the abnormal bone representation based at least in part on the matching. FIG.3illustrates an embodiment of the surgical plan formation module132. The surgical plan formation module132is configured to identify the one or more abnormal regions of the abnormal bone and generate a surgical plan for altering the identified abnormal regions. The surgical plan formation module132comprises a feature extraction module310, an abnormality detection module320, and an alteration decision module330. The feature extraction module310is configured to extract a plurality of model features from the registered generic model and a plurality of abnormal bone features from the abnormal bone representation. In an example, types of the extracted features can include one or more geometric parameters such as a location, an orientation, a curvature, a contour, a shape, an area, a volume, or other volumetric parameters. In another example, the extracted features can include one or more intensity-based parameters. The features can be extracted in the space domain, frequency domain, or space-frequency domain. In various examples, the features may include statistical measurements derived from the geometric or intensity-based parameters, such as the mean, median, mode, variance, covariance, and other second or higher order statistics. The abnormity detection module320is configured to identify one or more abnormal regions of the abnormal bone using a comparison between the model features and the abnormal bone features. The comparison can be performed on all or selected segments from the registered generic model and from the abnormal bone representation. In an embodiment, the comparison can be performed only after the registration module131matches the segment of the registered generic model to the registration area of the abnormal bone. The abnormality detection module320can detect an abnormal region from a segment of the abnormal bone if a similarity measure between the abnormal bone feature of the segment (Rabnormal(k)) and the model feature of the corresponding segment on the registered generic model (Rmodel(k)) meets a specified criterion. For example, an abnormal region can be detected if the volumetric difference between Rabnormal(k) and Rmodel(k) exceeds a specified threshold. In various examples, the abnormity detection module320can employ different similarity measures according to the type of the features. The abnormity detection module320can also select similarity measure according to the data format (such as the imaging modality or image type) of the abnormal bone representation and the generic normal bone model. For example, if the extracted features from310are geometric features, the abnormity detection module320can calculate sum of squared distance between the model features and the abnormal bone features, where the distance can be computed as one of L1 norm, L2 norm (Euclidian distance), infinite norm, or other norm in the normed vector space. In another example, if the extracted features are intensity-based features, then the abnormity detection module320can calculate the similarity between the model features and the abnormal bone features using one of the measures such as correlation coefficient, mutual information, or ratio image uniformity. The alteration decision module330can be configured to subtract, for the detected abnormal regions, a volumetric parameter (Xmodel(k)) of the segment of the registered generic model from a volumetric parameter (Xabnormal(k)) of the segment of the abnormal bone. The volumetric parameters Xmodel(k) and Xabnormal(k) each represents a shape or a volume of the corresponding bone representation. The subtracted volumetric parameter in each of the one or more abnormal regions can be determined as the part of alteration. In some embodiments, the subtraction can be performed between a model feature Rmodel(k) and an abnormal bone feature Rabnormal(k). For example, both Rmodel(k) and Rabnormal(k) may not represent direct measurement of shape or volume of the corresponding bone representation; rather, Rmodel(k) may be a model feature indirectly representing the volume via a mapping Φ of a volumetric parameter Xmodel(k) (i.e., Rmodel(k)=Φ(Xmodel(k)), and the abnormal bone feature Rabnormal(k) indirectly represents the volume via a mapping Φ of a volumetric parameter Xabnormal(k) (i.e., Rabnormal(k)=Φ(Xabnormal(k)). The volumetric difference, as part of surgical plan, can be determined by applying the inverse map Φ−1to the respective features, i.e., Φ−1(Rabnormal(k))−Φ−1(Rmodel(k)). In an example, the alteration decision module330can include instructions for performing a first simulation of the abnormal bone (such as a diseased femur, a diseased acetabulum, or other diseased bones in the body), and a second simulation of the surgically altered abnormal bone such as a simulated model of the post-operative abnormal bone with the identified excess bone tissue removed. One or both of the first and the second simulations can each include a biomechanical simulation for evaluating one or more biomechanical parameters including, for example, range of motion of the respective bone. The alteration decision module330can determine the one or more abnormal regions of the abnormal bone using a comparison between the first simulation and the second simulation. In some examples, the alteration decision module330can include instructions for incrementally altering the one or more abnormal regions of the abnormal bone by gradually removing the identified excess bone tissue from the abnormal bone such as following a pre-specified procedure. FIGS.4A-Eillustrate examples of deformity of a pathological femur detected using a generic normal femur model.FIGS.4A-Billustrate an example of a three-dimensional (3D) pathological proximal femur image410(as shown inFIG.4A) with deformed region detected using a 3D generic normal proximal femur model420(as shown inFIG.4B), which can be generated and presented using the system100or its various embodiments discussed in this document. The generic normal proximal femur model420can be derived from statistical shape data constructed from multiple CT scans of normal proximal femurs of comparable anatomical origin from a group of subjects. The pathological proximal femur image410represents a CT scan of the proximal femur taken from a patient with femoroacetabular impingement (FAI). The normal proximal femur statistical shape (SS) model420can be registered onto the pathological impinged proximal femur image410. Both the SS model420and the impinged proximal femur image410can be partitioned and labeled. A segment of the impinged proximal femur image410free of abnormity, such as the femur head411, can be identified and matched to the corresponding femur head421of the SS model420. The remaining segments of the impinged proximal femur image410can then be aligned to the respective remaining segments of the SS model420. A comparison of the segments from the SS model420and the impinged proximal femur image410reveals a deformity region on the femur neck412of the impinged proximal femur image410. The excess bone on the detected deformity region412can be defined as the volumetric difference between the detected deformity region412and the corresponding femur neck segment422on the SS model420. The volumetric difference, as part of the surgical plan, defines the shape and volume on the pathological femur410that needs to be surgically removed. FIGS.4C-Eillustrates an example of a two-dimensional (2D) pathological femur representation430(as shown inFIG.4C) with deformed region detected using a 2D generic normal femur model440(as shown inFIG.4D). The generic normal femur model440can be generated and presented using the system100or its various embodiments discussed in this document. The generic normal femur model440can be a statistical model, a geometric model, or a parametric model constructed from multiple images of normal femurs of comparable anatomical origin. Following the registration of the generic normal femur model440to the pathological femur representation430, a registered femur model450can be generated (as shown inFIG.4E). By matching the registered femur model450to the pathological femur representation430, an abnormity-free region451(which can include one or more abnormity-free segments) can be identified. By aligning the remaining segments of the registered femur model450to the corresponding segments of the pathological femur representation430, a deformity region452can be detected. The deformity region452, as illustrated inFIG.4E, defines the shape of the excess bone tissues on the pathological femur representation430that can be surgically removed. The 2D example illustrated inFIGS.4C-Eis provided primarily to illustrate the concepts of segmentation and fitting a generic model to a pathological model. The method of segmentation and correlation illustrated by the 2D example are directly applicable to 3D models discussed above in reference toFIGS.4A-B. FIG.5is a flowchart that illustrates an example of a method for planning a surgery on an abnormal bone. In an embodiment, the system100, including its various embodiments discussed in this document, is programmed to perform method500, including its various embodiments discussed in this document. A representation of an abnormal bone or a portion of the abnormal bone is received at510. The abnormal bone can be a pathological bone undergoing surgical planning for alteration, repair, or removal. The abnormal bone representation can include a data set characterizing the abnormal bone. In an example, the data set includes geometric characteristics including location, shape, contour, or appearance of the anatomical structure. In another example, the data set can include intensity information. In various examples, the abnormal bone representation can include at least one medical image such as an X-ray, an ultrasound image, a computed tomography (CT) scan, a magnetic resonance (MR) image, a positron emission tomography (PET) image, a single-photon emission computed tomography (SPECT) image, or an arthrogram, among other 2D or 3D images. The abnormal bone representation can also include one or more point clouds. In some examples, the abnormal bone representation can be received from a database storing the data set characterizing the abnormal bone, or from an imaging system or an image acquisition module including an X-ray machine, a CT scanner, an MRI machine, a PET scanner, among others. At520, a generic normal bone model can be received. The generic normal bone model includes a data set representing a normal bone or a portion of the normal bone having an anatomical origin comparable to the abnormal bone received at510. The generic normal bone model can represent the shape or appearance of the anatomical structure of the normal bone. The generic normal bone model may be in one of the forms including a parametric model, a statistical model, a shape-based model, a volumetric model, or other geometric models. The generic normal bone model can also be based on physical properties of the normal bone, including, for example, an elastic model, a spline model, or a finite element model. In some examples, the generic normal bone model can represent a desired postoperative shape or appearance of the normal bone. The desired postoperative shape or appearance of the normal bone can be obtained by modifying a normal bone model (such as a parametric model, a statistical model, a shape-based model, or a volumetric model) using a computer software configured for three-dimensional manipulation of the normal bone model. In various examples, the generic normal bone model may include a statistical model created from a plurality of images or point clouds from normal bones of comparable anatomical origin from a group of subjects. The data used for generating the generic normal bone model may include shape data or appearance data. The shape data may include geometric features such as landmarks, surfaces, or boundaries; whilst the appearance data may include both geometric features and intensity information. In one example, the generic normal bone model includes a statistical shape (SS) model. The SS model can be derived from a plurality of medical images taken from normal bones of comparable anatomical origin from a group of subjects known to have normal bone anatomy. Examples of the medical images include an X-ray, an ultrasound image, a CT scan, an MR image, a PET image, a SPECT image, or an arthrogram, among other 2D and 3D images. In various embodiments, the shape data or appearance data can be constructed from medical images or the point clouds of normal bones of comparable anatomical origin from a group of subjects with similar age, gender, ethnicity, size, or other physical or demographical data. In some embodiments, the generic normal bone model has a comparable data format or modality as the abnormal bone representation. For example, if a CT scan of the pathological proximal femur from a patient is received at510, then the SS model received at520can be constructed from the CT scans of proximal femurs with normal anatomy from a plurality of subjects. In another example, a CT scan of the pathological acetabulum from a patient can be received at510, and the SS model received at520can be constructed from the CT scans of normal acetabula with normal anatomy from a plurality of subjects. At530, the generic normal bone model can be registered to the abnormal bone representation. The generic normal bone model and the abnormal bone representation can each be partitioned into a plurality of segments representing various anatomical structures on the respective image. The segments can be labeled such that the segments with the same label share specified characteristics such as a shape, anatomical structure, or intensity. In partitioning the abnormal bone representation, the pathological portion can be differentiated from the normal portion of the abnormal bone representation, and a registration area free of anatomical abnormity can be identified from the abnormal bone representation. To register the generic normal bone model to the abnormal bone representation, the generic normal bone model can be transformed to create a registered generic model. The transformation can include a rigid transformation that brings the generic normal bone model in global alignment with the size and orientation of the abnormal bone representation. Examples of the rigid transformation include translation, rotation, or reflection. The transformation can also include a non-rigid transformation to reduce the local geometric discrepancies by aligning the generic normal bone model with the abnormal bone representation. Examples of non-rigid transformation include stretching, shrinking, or model-based transformations including radial basis functions, splines, or finite element models. In an example, both a rigid and non-rigid transformations can be applied to the generic normal bone model. In some embodiments, a desired transformation Θoptcan be determined as the one that minimizes the difference between the identified abnormity-free segments on the abnormal bone representation Sabnormal(x,y,z) and the corresponding segments of the generic normal bone model Smodel(X,Y,Z) generic normal bone model following the transformation Θ. That is, the desired transformation Θoptis selected such that the Euclidian distance ∥Θ(Smodel(x,y,z))−Sabnormal(x,y,z)∥ is minimized. The desired transformation can then be applied to the generic normal bone model to create the registered generic model. Then, in response to identifying the registration area of the abnormal bone, one or more segments of the registered generic model can be matched to the corresponding registration area of the abnormal bone. The remaining segments of the registered generic model can be aligned with the remaining segments of the abnormal bone representation based at least in part on the matching. At540, one or more abnormal regions of the abnormal bone can be detected. The abnormity can be detected using a comparison between the registered generic model and the abnormal bone representation. In an example, a plurality of model features can be extracted from the registered generic model, and a plurality of abnormal bone features can be extracted from the abnormal bone representation. Examples of the extracted features include one or more geometric parameters such as a location, an orientation, a curvature, a contour, a shape, an area, a volume, or other geometric parameters. The extracted features can also include one or more intensity-based parameters. A degree of disconformity between a segment of the registered generic model and the matched segment of the abnormal bone representation can be calculated. For example, if a similarity measures between the abnormal bone feature of the segment (Rabnormal(k)) and the model feature of the corresponding segment on the registered generic model (Rmodel(k)) meets a specified criterion, the segment of the abnormal bone is declared to be abnormal. Examples of the similarity measures include distance in a normed vector space (such as L1 norm, L2 norm or Euclidian distance, and infinite norm), correlation coefficient, mutual information, or ratio image uniformity, among others. In an embodiment, the similarity measure can be determined according to the type of the feature or the modality of the image. For example, when geometric features are extracted from a 3D image of the abnormal bone and from an SS model which is derived from 3D medical images of the comparable bone anatomy, a volumetric difference, such as the sum of squared distance in the 3D normed vector space can be computed between the model features and the abnormal bone features. In some embodiments, statistical distribution of a model feature can be used in calculating the degree of disconformity. For example, the generic normal bone model can be derived from images of bones of comparable anatomical origin from M subjects (M≥2). In determining the statistical distance between an N-dimensional abnormal bone feature vector Y=[y(1), y(2), . . . , y(N)] and an N-dimensional model feature vector X=[x(1), x(2), . . . , x(N)], the feature data from M subjects Xm=[xm(1), xm(2), . . . , xm(N)] (m=1, 2, . . . , M) can be used to estimate a covariance matrix Cxxof the model feature vector X as shown in equation (1): Cxx=1M-1∑m=1M(Xm-X)*(Xnm-X)T(1) The statistical distance between the abnormal bone feature vector Y and model feature vector X can then be computed as the Mahalanobis distance as given in (2): DXY=√{square root over ((Y−X)TCXX−1(Y−X))} (2) At550, a surgical plan is generated. The surgical plan can define the location, shape, and volume of the portion of the abnormal bone from the one or more abnormal regions that need to be altered. In one example, for a segment with detected abnormal region, a volumetric parameter Xabnormal(k) represents a shape or a volume of a segment of the abnormal bone representation, and a volumetric parameter Xmodel(k) represents a shape or a volume of the corresponding segment of the registered generic model. The volumetric parameter Xmodel(k) can then be subtracted from the volumetric parameter Xabnormal(k), and the resulting subtracted volumetric parameter can be determined as the part of alteration. In an example, the surgical plan can include instructions for performing a first simulation of the abnormal bone and a second simulation of the surgically altered abnormal bone, such as a simulated model of the post-operative abnormal bone with the identified excess bone tissue removed. One or both of the first and the second simulations can each include a biomechanical simulation for evaluating one or more biomechanical parameters including, for example, range of motion of the respective bone. One or more abnormal regions of the abnormal bone can be detected using a comparison between the first simulation and the second simulation. In some embodiments, a graphical representation can be generated to illustrate one or more of the generic normal bone model, the abnormal bone representations, and the surgical plan. The graphical representation provides feedback to enable a system user to accept or modify the surgical plan. In some examples, the surgical plan can include instructions for incrementally altering the one or more abnormal regions of the abnormal bone by gradually removing the identified excess bone tissue from the abnormal bone such as following a pre-specified procedure. FIG.6is a flowchart that illustrates an example of a method600for planning a surgical alteration of a portion of a diseased bone such as a diseased femur, a diseased acetabulum, or other diseased bone in the body. One example of the alteration surgery is the treatment of femoroacetabular impingement (FAI). Surgical treatment of FAI includes removal of the excess bone from the femoral neck using, for example, a high speed bur or an arthroscopic shaver. The method600can be used to identify the abnormal regions of impingement and generate a surgical plan including the shape and volume of bone removal, thereby providing instructions to guide a surgical tool in the surgery. In an embodiment, the system100, including its various embodiments discussed in this document, is programmed to perform method600, including its various embodiments discussed in this document. A representation of the abnormal bone is received at601. The representation can include a data set characterizing the abnormal bone. In an example, the representation can be one or more medical images of the diseased femur, such as an X-ray, an ultrasound image, a CT scan, an MR image, a PET image, a SPECT image, or an arthrogram, among other 2D and 3D images. In another example, the representation can include one or more point clouds of the diseased femur. At602, the availability of a generic normal model is checked. The generic normal bone model can include a data set representing a normal bone which has an anatomical origin comparable to the abnormal bone in question. One example of the generic model includes a statistical shape (SS) model of a normal femur. The normal femur SS model can be derived from statistical shape data constructed from multiple medical images of normal femurs from comparable anatomical origin from a group of subjects. The generic normal bone model can have a comparable data format or image modality as the abnormal bone representation received at601. For example, if a CT scan image of the pathological femur is received at601, then at602an statistical shape (SS) model derived from CT scans of normal femurs of comparable anatomical origin can be searched for subsequent use. If the generic normal bone model is available (e.g., found in a SS model database) at602, then at603the generic normal bone model can be retrieved for further use. If the model is not available, then a generic normal bone model can be created. As illustrated inFIG.6, at604, a plurality of images of normal bones with anatomical origin comparable to the received abnormal bone can be retrieved from an image database or other storage devices. In an example, the images can have a comparable data format or image modality as the received abnormal bone representation, and can be taken from a group of subjects having similar physical or demographical data as the host (patient) of the abnormal bone under analysis. In some examples, even if the SS model is available at602, it may be desirable to recreate an SS model using data of normal bones from a specified group of subjects such as having demographic data comparable to the host of the abnormal bone. The images thus received at604comprise statistical shape data. The statistical shape data can then be partitioned into a plurality of segments at605. Each image in the statistical shape data can be partitioned according to various anatomical structures of the normal bone. For example, an image of the proximal femur can be partitioned into image segments of femur head, femur neck, fovea of head, greater trochanter, and lesser trochanter, among others. The partitioned segments each may be assigned a label such that the segments with the same label share specified characteristics such as a shape, anatomical structure, or intensity. The partitioned statistical shape data can then be used to create an SS model at606. In some examples, the SS model can be created by computing statistical distributions of shapes and/or intensities of the segments from the shape data or appearance data. Other methods, such as a principal component analysis, regression analysis, and parametric modeling can be used to create the SS model. At607, the abnormal bone can be partitioned into different segments. The SS model can also be partitioned if no segments are available (for example, the SS model directly retrieved from a database at603). In an example, the partition of the abnormal bone can be performed using a similar method as partitioning the images in statistical shape data. As a result, correspondence can be established between the segments of the SS model and the segments of the abnormal bone representation. From the partitioned segments of the abnormal bone, a registration area free of anatomical abnormity can be identified. The SS model can be transformed at608to generate a registered SS model. The registered SS model can be in a coordinate system similar to that of the abnormal bone representation. Examples of the transformation can include scaling, rotation, translation, expansion, dilation, or other affine transformation. Then, in response to identifying the registration area of the abnormal bone free of anatomical abnormity, one or more segments of the registered SS model can be matched to the corresponding registration area of the abnormal bone at609. The remaining segments of the registered SS model can then be aligned with the remaining segments of the abnormal bone representation at610, based at least in part on the matching results from609. An abnormal bone segment can then be selected and compared to the corresponding segment of the registered SS model at611. In an embodiment, a pool of abnormal bone segments suspected of deformity can be pre-selected such as by the surgeon, and each of the suspected segments of deformity can be compared to the corresponding segment of the registered SS model. A degree of disconformity between the abnormal bone segment and the corresponding registered SS model segment can be computed at612. The degree of disconformity can be calculated, for example, as a statistical distance between one or more features extracted from the abnormal bone segment and the one or more features extracted from the corresponding SS model segment. Examples of the extracted features include volumetric parameters such as area, shape, or volume. Examples of the statistical distance include L1 norm, L2 norm (i.e., Euclidian distance), infinite norm or other norms in the normed vector space, correlation coefficient, or mutual information, among others. The degree of disconformity can then be compared to a specified criterion such as a threshold at613. If the degree of disconformity falls below the threshold, then no deformity is detected in the present abnormal bone segment. A different abnormal bone segment can be selected at614such as from the pool of suspected segments of deformity. The corresponding segment of the registered SS model can also be selected and the degree of disconformity can be calculated for the suspected segment at612. If at613the degree of disconformity meets the specified criterion (e.g., exceeds the threshold), then deformity is detected for the present abnormal bone segment; and a volumetric difference between the abnormal bone segment and the corresponding segment of the registered SS model can be calculated at615. In an example, the volumetric parameters of the segment of the registered SS model can be subtracted from the corresponding volumetric parameters of the abnormal bone segment. A surgical plan is generated at616including recommending an alteration, repair, or removal of the subtracted volumes on the abnormal bone. The surgical plan can also include comparison of a first simulation of the diseased femur and a second simulation of a model of surgically altered diseased femur. The simulation can be used for evaluating one or more biomechanical parameters including, for example, range of motion of the respective bone. The pool of suspected segments of deformity is then checked at617. If there remain suspected segments of deformity, an abnormal bone segment can be selected from the pool at614and the disconformity calculation resumes at612. If all suspected segments of deformity have been processed, then at618a composite surgical plan can be generated. In an example, the composite surgical plan comprises the recommended alterations to all the abnormal bone segments. FIG.7is a block diagram that illustrates an example of a machine in the form of a computer system700within which instructions, for causing the computer system to perform any one or more of the methods discussed herein, may be executed. In various embodiments, the machine can operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine may operate in the capacity of a server or a client machine in server-client network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), a tablet PC, a set-top box (STB), a PDA, a cellular telephone, a web appliance, a network router, switch or bridge, or any machine capable of executing instructions (sequential or otherwise) that specify actions to be taken by that machine. Further, while only a single machine is illustrated, the term “machine” shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein. The example computer system700includes a processor702(such as a central processing unit (CPU), a graphics processing unit (GPU), or both), a main memory704and a static memory706, which communicate with each other via a bus708. The computer system700may further include a video display unit710(such as a liquid crystal display (LCD) or a cathode ray tube (CRT)), an alpha-numeric input device712(such as a keyboard), a user interface (UI) navigation device (or cursor control device)714(such as a mouse), a disk drive unit716, a signal generation device718(e.g., a speaker) and a network interface device720. The disk drive unit716includes a machine-readable storage medium722on which is stored one or more sets of instructions and data structures (e.g., software)724embodying or used by any one or more of the methods or functions described herein. The instructions724may also reside, completely or at least partially, within the main memory704, static memory706, and/or within the processor702during execution thereof by the computer system700, the main memory704and the processor702also constituting machine-readable media. In an example, the instructions724stored in the machine-readable storage medium722include instructions causing the computer system700to receive an abnormal bone representation including a data set representing the abnormal bone, to receive a generic normal bone model including a data set representing a normal bone having an anatomical origin comparable to the abnormal bone, to register the generic normal bone model to the abnormal bone representation to create a registered generic model, to identify one or more abnormal regions of the abnormal bone using a comparison between the registered generic model and the abnormal bone representation, and to generate a surgical plan for altering a portion of the abnormal bone from the one or more abnormal regions. To direct the computer system700to generate the surgical plan, the machine-readable storage medium722may further store the instructions724that cause the computer system700to generate data representing one or more of a volume, a shape, a location, or an orientation of the one or more abnormal regions in reference to the generic normal bone model, and to guide a surgical a surgical tool or surgical system (such as a surgical navigation and/or medical robotics) in altering the portion of the abnormal bone. The instructions in the machine-readable storage medium722may also cause the computer system700to generate a graphical representation illustrating one or more of the generic normal bone model, the abnormal bone representations, and the surgical plan, and to receive command from a system user to modify the surgical plan. While the machine-readable medium722is shown in an example embodiment to be a single medium, the term “machine-readable medium” may include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) that store the one or more instructions or data structures. The term “machine-readable storage medium” shall also be taken to include any tangible medium that is capable of storing, encoding or carrying instructions for execution by the machine and that cause the machine to perform any one or more of the methods of the present invention, or that is capable of storing, encoding or carrying data structures used by or associated with such instructions. The term “machine-readable storage medium” shall accordingly be taken to include, but not be limited to, solid-state memories, and optical and magnetic media. Specific examples of machine-readable media include non-volatile memory, including by way of example, semiconductor memory devices (e.g., erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; magnetic disks such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks. A “machine-readable storage medium” shall also include devices that may be interpreted as transitory, such as register memory, processor cache, and RAM, among others. The definitions provided herein of machine-readable medium and machine-readable storage medium are applicable even if the machine-readable medium is further characterized as being “non-transitory.” For example, any addition of “non-transitory,” such as non-transitory machine-readable storage medium, is intended to continue to encompass register memory, processor cache and RAM, among other memory devices. In various examples, the instructions724may further be transmitted or received over a communications network726using a transmission medium. The instructions724may be transmitted using the network interface device720and any one of a number of well-known transfer protocols (e.g., HTTP). Examples of communication networks include a LAN, a WAN, the Internet, mobile telephone networks, plain old telephone (POTS) networks, and wireless data networks (e.g., WiFi and WiMax networks). The term “transmission medium” shall be taken to include any intangible medium that is capable of storing, encoding or carrying instructions for execution by the machine, and includes digital or analog communications signals or other intangible media to facilitate communication of such software. The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the invention can be practiced. These embodiments are also referred to herein as “examples.” Such examples can include elements in addition to those shown or described. However, the present inventors also contemplate examples in which only those elements shown or described are provided. Moreover, the present inventors also contemplate examples using any combination or permutation of those elements shown or described (or one or more aspects thereof), either with respect to a particular example (or one or more aspects thereof), or with respect to other examples (or one or more aspects thereof) shown or described herein. In the event of inconsistent usages between this document and any documents so incorporated by reference, the usage in this document controls. In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In this document, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, composition, formulation, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Method examples described herein can be machine or computer-implemented at least in part. Some examples can include a computer-readable medium or machine-readable medium encoded with instructions operable to configure an electronic device to perform methods as described in the above examples. An implementation of such methods can include code, such as microcode, assembly language code, a higher-level language code, or the like. Such code can include computer readable instructions for performing various methods. The code may form portions of computer program products. Further, in an example, the code can be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media can include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memories (RAMs), read only memories (ROMs), and the like. The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments can be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to comply with 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments can be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. | 54,862 |
11862349 | DESCRIPTION OF THE PREFERRED EMBODIMENT This invention involves an application specific design of piping, valves, control logic and a chemical injection system to effectively employ the concepts of a wet filtered vent design, such as the one described in U.S. Pat. No. 9,502,144, without the addition of a wet filter vent filtration tank. One embodiment of this invention is illustrated inFIG.1, which shows a schematic representation of a portion of a nuclear containment and adjacent spent fuel pool. This invention uses ventilation piping10that directs a pressure relief discharge from the containment vessel12into the plant's existing spent fuel pool14through an engineered sparger design (or existing spent fuel pool cooling system sparger)16. Isolation of the ventilation piping is achieved via conventional, remotely operated valve(s)18, controlled to open by manual actuation by the plant operator. An alternate bypass system, with passive pressure relief valve20, is available in the event of an operator error or mechanical failure of the isolation valve(s)18. The bypass system automatically opens the valve20, which is a passive pressure relief device, if a preselected pressure is sensed in the containment. The contaminated aerosol release will be filtered via the spent fuel pool inventory, which will be treated with conventional wet filtration chemistry control via a passive chemical injection system22for gas (e.g., iodine, cesium, xenon) and fission product particulates removal. The chemicals will be released into the pool inventory simultaneous with the ventilation release to the pool. (i.e., opening of the ventilation isolation valves18or20) via a controlled opening of the chemical injection system isolation valve24. The chemicals will be injected directly above the sparger outlets16via a chemical injection header26. Preferably, the chemical injection header and the sparger are supported in the spent fuel pool at an elevation, preferably, as low as possible in the pool and below the operating level necessary for fuel transfer into and out of the pool. The chemical injection header26is, preferably, positioned just above and over the sparger16. The consequential fission product decay heat energy released to the pool will be removed by the current spent fuel pool cooling system. Aerosol release from the spent fuel pool surface will be vented from the spent fuel building via normal or special supplemental, if necessary, spent fuel pool ventilation systems. Liquid swell in the spent fuel pool will not be sufficient to displace excessive pool inventory such that acceptable spent fuel bundle submergence remains for shielding the spent fuel following closure of the vent isolation valves. Check valve(s) (passive dampers)28in the ventilation piping will prevent draw of pool inventory into containment during any containment vessel vacuum; similarly, a passive vacuum breaker32will prevent the containment vessel from exceeding a maximum vacuum limit. While specific embodiments of the invention have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. An example could be to avoid installation of a unique containment vessel penetration, an alternate embodiment could incorporate the device into the existing fuel transfer tube30. Accordingly, the particular embodiments disclosed are meant to be illustrative only and not limiting as to the scope of the invention which is to be given the full breadth of the appended claims and any and all equivalents thereof. | 3,663 |
11862350 | Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate various embodiments of the invention, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner. DESCRIPTION Applicant of the present application owns the following U.S. Patents, the disclosure of each of which is herein incorporated by reference in its respective entirety:U.S. Pat. No. 10,020,081, titled NUCLEAR CONTROL ROD POSITION INDICATION SYSTEM, filed Jan. 15, 2016;U.S. Pat. No. 8,599,987, titled WIRELESS TRANSMISSION OF NUCLEAR INSTRUMENTATION SIGNALS, filed Oct. 13, 2009;U.S. Pat. No. 3,893,090, titled POSITION INDICATION SYSTEM, filed Jan. 3, 1973; andU.S. Pat. No. 3,846,771, titled POSITION INDICATION SYSTEM, filed Jan. 3, 1973. The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which examples of the present disclosure are shown. The present disclosure, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein. Rather, these examples are provided for thoroughness and completeness, and will fully convey the scope of the present disclosure to those skilled in the art. Like numbers refer to like elements throughout. FIG.3shows a high level system100for monitoring the position of a movable element in a nuclear reactor vessel8according to at least one aspect of the present disclosure. The system100comprises electronic measurement circuits located in data cabinets A and B mounted on the reactor vessel head12within the containment structure. The electronic circuits located in the data cabinets A, B read the signals generated by sensors configured to monitor the position of a movable element within the nuclear reactor vessel8. In the aspect illustrated inFIG.3, the system100is configured to monitor the position of control rods102,104located within the nuclear reactor vessel8. The system100illustrated inFIG.3includes a reactor vessel8that houses a nuclear core into which the control rods102,104are inserted and withdrawn during a nuclear reaction. The control rods102,104are typically connected together by a spider cluster assembly and driven into and out of the core by a drive rod that moves within a pressure housing in steps activated by a control rod drive mechanism. The position of the control rods102,104relative to the core are determined by rod position by coil stacks106,108each comprising a plurality of indicator control rod position indicator coils110,112. For conciseness and clarity of disclosure, only a single coil stack106,108per control rod102,104is shown inFIG.3. In actual implementations, a coil stack comprises alternating A and B coils per control rod102,104for redundancy. Accordingly, a digital rod position indication system, such as the system100schematically illustrated inFIG.3, includes coil stacks106,108for each control rod102,104, respectively, and a digital rod position indication data processing unit114that receives signals from the data cabinets A, B. The data processing unit114processes the signals received from the coil stacks106,108to determine the position of the control rods102,104. Each coil stack106,108comprises an independent channel of control rod position indicator coils110,112placed over the pressure housing. Each channel may include up to 24 control rod position indicator coils110,112. The control rod position indicator coils110,112are interleaved and positioned at 3.75 inch (9.53 cm.) intervals (six steps), for example. The digital rod position indication electronics for each coil stack106,108of each control rod102,104are located in a pair of redundant data cabinets A, B mounted on the reactor vessel head12. Although intended to provide independent verification of the position of the control rods102,104, digital rod position indication systems are considered to be accurate within plus or minus 3.75 inches (9.53 cm.) (six steps) with both channels functioning and plus or minus 7.5 inches (19.1 cm.) using a single channel (twelve steps), for example. In contrast to conventional digital rod position indication systems, a conventional analog rod position indication system determines the position based on the amplitude of the AC output voltage of an electrical coil stack linear variable differential transformer. The overall accuracy of a properly calibrated analog rod position indication system is considered to be accurate within plus or minus 7.2 inches (18.3) (twelve steps), for example. Neither conventional analog rod position indication systems nor conventional digital rod position indication systems are capable of determining the actual positions of the control rods102,104. In a DRPI system, the position of the control rod102,104is known when the DRPI transitions to each gray code. It should be noted that for purposes of this application, the phrase “control rod” is used generally to refer to a unit for which separate axial position information is maintained, such as a group of control rods102,104physically connected in a spider cluster assembly. The number of control rods102,104varies according to the plant design. For example, a typical four-loop pressurized water reactor has fifty-three control rods102,104. Each control rod102,104requires its own set of control rod position indicator coils110,112having one or more channels and the digital rod position indication electronics associated with each channel in the case of digital systems. Thus, in a typical four-loop pressurized water reactor, the entire digital rod position indication system would include fifty-three coil stacks, each having two independent channels, and 106 digital rod position indication electronics units. The voltages generated by each control rod position indicator coil110,112configured to monitor the position of each control rod102,104are transmitted over cables comprising multiple wires116,118,120,122. These voltages are passed through several layers of multiplexors in order to send the voltages outside of the containment structure over a single wire124,126ignoring redundancy and two wires for redundancy. Current nuclear reactors include 29-61 control rods102,104and next generation nuclear reactors will include up to 69 control rods102,104. Each control rod102,104is stacked with a plurality of control rod position indicator coils110,112. FIG.4shows a block diagram of a data processing unit114for the system100for monitoring the position of a movable element in a nuclear reactor vessel shown inFIG.3according to at least one aspect of the present disclosure. The data processing unit114comprises a logic processor128coupled to a memory130in which software instructions132are installed, an analog input circuit134, and a digital output circuit136. The digital output circuit136controls analog multiplexors138,140in each the data cabinet A, B. Every control rod position indicator coil110,112(FIG.3) will have its own binary digital control number. When the digital output circuit136switches to a new address, the analog input circuit134reads the voltage. This will repeat until all control rod position indicator coils110in one coil stack106and all control rod position indicator coils112in another coil stack108are read. With this data the position of all control rods102,104(FIG.3) in the nuclear power plant can be determined. This process will continue on a loop indefinitely. The loop, however, may be modified to any combination including monitoring a single coil, which may be useful for control rod102,104drop testing, for example. With reference toFIGS.3and4, in one aspect, the system100according to the present disclosure is configured to monitor the position of the control rods102,104in a nuclear reactor vessel8. In one aspect, the system100for monitoring a position of a control rod102,104of a nuclear reactor vessel8comprises electronic circuits located in data cabinets A, B mounted directly on a nuclear reactor vessel head12inside the containment structure. During outages large cables comprising multiple wires116,118,120,122going to control rod position indicator coils110,112will no longer need to be disconnected, thus reducing wear on the cables and connectors and eliminating testing, which must be performed after the cables are re-connected to validate the cable, which saves time and radiation dose. In one aspect, the present system100replaces the existing data cabinets A, B in the DRPI system with an updated electronic design. This enables the system100to be more flexible by allowing all indication and additional functions simply by having programmable software132in the data processing unit114located outside the containment structure. Existing DPRI systems accomplish control rod102,104position by using an electrical/electronic hardware only approach. The hardware reads the voltages on the control rod position indicator coils110,112and determines the position of each control rod102,104via hardware only and then sends that data out to the display system. The system100according to at least one aspect of the present disclosure, however, is configured to read all the voltages on the control rod position indicator coils110,112directly into a computer/processor128in the data processing unit114where the software132instructions are executed by the processor to determine the location of the control rods102,104and to perform all other DRPI functions. There are numerous advantages to the system100according to at least one aspect of the present disclosure. For example, if one control rod position indicator coil110in the coil stack106appears to develop more resistance over time than the other control rod position indicator coils110or connections in the coil stack106, e.g., due to physical wear, the processor128can execute the software132instructions to adjust for the different and unexpected readings, whereas existing hardware only based DRPI systems are unable to make any adjustments in the positioning readings of the control rods102,104. Additionally, in the system100according to at least one aspect of the present disclosure, the data cabinets A, B are mounted on the top of the reactor vessel head12. The system100overcomes several challenges such as physical space limitations and operating in higher levels of radiation. Locating the data cabinets A, B with associated electronic circuits on top of the reactor vessel head12eliminates the need during outages to disconnect the DRPI stack cables comprising the multiple wires116,118,120,122going to control rod position indicator coils110,112. This will save the nuclear power plant operator valuable outage time and financial resources, and will increase reliability. Given the enhanced radiation environment, the electronic circuits, e.g., multiplexers and other active or passive electronic components, located in the data cabinets A, B include radiation hardened electronic components which may require radiation shielding to meet the necessary radiation and life expectancy requirements of the electronic circuits. Radiation testing proved that commercial off the shelf active electronic components were not viable for use on top of the reactor vessel head12even with reasonable levels of shielding. Some passive electrical components, such as capacitors, diodes, and resistors, can withstand the radiation levels needed without additional shielding. Accordingly, the electronic circuits located in the data cabinets A, B employ radiation hardened multiplexers and other active components. Electronic Multiplexer Architecture FIGS.5A-5Cshow a high level multiplexer system200broken into partial views over several sheets according to at least one aspect of the present disclosure, whereFIG.5Ashows a multiplexer circuit202located inside the containment structure,FIG.5Bshows a communication circuit204coupled to the multiplexer circuit202shown inFIG.5A, where the communication circuit204is located inside the containment structure, andFIG.5Cshows a data processing unit114comprising a data acquisition computer system coupled to the communication circuit202shown inFIG.5B, where the data processing unit114is located outside the containment structure. The multiplexer circuit202is a detailed implementation of the analog multiplexers138,140shown inFIG.4. The communication circuit204is contained in the data cabinets A, B shown inFIGS.3and4. The processing unit is also shown inFIGS.3and4. It will be appreciated that in one aspect, the high level multiplexer system200may include redundant controls for redundant components. In other aspects, the high level multiplexer system200may include the single control for primary and redundant components as illustrated inFIGS.5A-5C, for example. The multiplexer circuit202shown inFIG.5Aand the communication circuit204shown inFIG.5Bare located in the data cabinets A, B located on top of the reactor vessel head12(FIGS.1,3) inside the containment structure. These circuits202,204each include radiation shielding and active components that are radiation hardened to, e.g., from 75 krad to over 125 krad TID based on construction. The multiplexer circuit202is used to read all the coil voltages down to a single output and reading the entire system at a fast rate. The multiplexer circuit202comprises a first analog multiplexer222and a second analog multiplexer224. Each of the first and second analog multiplexers222,224are 32-to-1 channel multiplexers, for example, that are radiation hardened. One example of a radiation hardened 32-to-1 channel multiplexer integrated circuit is manufactured by Renesas/Intersil. Although the analog coil voltages are sent over a long distance outside of the containment structure, there are several conditions to mitigate transmitting the analog coil voltage over a long distance. All coil voltages are transmitted over a single wire (ignoring A/B coils and redundancy). Any contact resistance, wire resistance, or other varying resistance over time will affect the coil voltages equally over the entire system200. The actual coil voltages being read by the data acquisition system does not matter. They only matter as a percentage related to all other coil voltages within each DRPI stack. For example, if rod-in voltage is 1.60 v and rod-out voltage is 1.15 v under normal expected conditions the system is reading the 0.45 v delta between the coils. If there is any additional wire resistance causing the rod-in voltage being read to be 1.20 v and rod-out voltage being read to be 0.75 v, the system will still be able to see the voltage delta between. Although there may be some resolution loss as the resistance increases, the system200will read the delta voltage properly unless the resistance approaches an open circuit. Such a dramatic resistance change would be a result of an installation or connection failure, which could happen under any system or design. All wire and cable within a nuclear power plant could be subjected to some level of noise. Analog signals are generally more susceptible to noise since information is being passed in a small voltage or current level, where digital signals are relying on bits logic to send the information. In low voltage analog transmission, a change of 10 mV due to noise can cause drastic changes in the system. In this system200, however, it would be unaffected due to the large voltage difference between rod-in and rod-out states. While the signals being sent are analog, it is very similar to a 0.45 v digital signal as there are only two states of information (rod-in/rod-out). The multiplexer system200comprises an interface circuit (not shown), a multiplexer circuit202, a communication circuit204, and an AC transformer (not shown) located inside the containment structure. The data processing unit114comprises an analog input circuit134and a digital output circuit136located outside the containment structure. In one aspect, the circuits are implemented in a modular way to enable modifications of the metal enclosure to accommodate several sizes and layouts. Interface Circuit The interface circuit performs several functions. It contains the connectors used to connect to each DRPI coil. In one aspect, each interface circuit may be configured to connect to 4 DRPI stacks, for example. Four was chosen based on size, modular fit, and internal wiring connectors. Those skilled in the art will appreciate, however, that each interface circuit may be configured to connect to any number of DRPI stacks, e.g., 1-3 or more than 4. The interface circuit includes 5 ohm resistors required to be in series with each coil. In implementations that include 21 coils per coil stack, there are 21 resistors per coil stack and thus 84 resistors per interface card. A connector is included to bring the 6 Vac needed to go out to the coils directly to the interface circuit (˜40 Amps). There also will be two connectors (low voltage/low current) that send all coil position voltage from the interface circuit to the multiplexer circuit202. Multiplexer Circuit With reference now toFIG.5A, in one aspect, the multiplexer circuit202multiplexes all the coil voltages received from each DRPI coil stack and sends the voltages out to the communication circuit204shown inFIG.5B. Like the interface circuit, in one aspect, each multiplexer circuit202will handle 4 DRPI coil stacks. Each interface circuit will connect to a multiplexer circuit202passing all the coil voltages of the 4 DRPI coil stacks in parallel wires. This connection is made by radiation tolerant ribbon cable, or other radiation tolerant wire to board connectors. With continued reference toFIG.5A, the inputs to the multiplexer circuit202are the incoming A/C voltages from 21 coils210,212,214. Each of the received coil voltages210,212,214are applied to 21 separate A/C peak detector rectifiers216,218,220, respectively. For conciseness and clarity of disclosure, the coil voltages214represent the individual coil voltage inputs form coils 3-21 and each of these coil voltages a re applied to individual A/C peak detector rectifiers220. For radiation hardness robustness, in the example illustrated inFIG.5A, the A/C peak detector rectifiers216,218,220are implemented using passive components. One example of the passive A/C peak detector rectifiers216,218,220is shown inFIG.6. Returning now toFIG.5A, each coil voltage210,212,214is rectified from a 50 Hz or 60 Hz AC voltage to its peak DC voltage. The data acquisition system outside of the containment structure is capable of reading AC voltage, however, it will be sampling at a fast enough rate that it may not read the peak voltages consistently. Therefore, the coil voltages210,212,214rectify the AC voltage to its peak DC value. With reference also toFIG.6, one example of a passive A/C peak detector rectifier circuit300is representative of the passive A/C peak detector rectifiers216,218,220. The passive A/C peak detector rectifier circuit300comprised a diode D1-1, appropriately sized capacitor C1and resistor C1. It will be appreciated that other rectifier circuits may be employed, such as operational amplifier based rectifier circuits, however, such operational amplifier based rectifier circuits must be radiation hardened in order to provide a viable option. The simple passive A/C peak detector rectifier circuit300can perform adequately in a high radiation environment that exists on top of the reactor vessel head12(FIGS.1and3). With reference primarily toFIG.5Aand also toFIG.5B, once each coil voltage210,212,214is rectified, it is fed to a 32 channel analog multiplexer222,224. Each coil stack which have its own multiplexer. All 21 coil voltages210,212,214will be wired to the first21channels of that analog multiplexer222,224. The outputs226,230of each coil stack analog multiplexer222,224is provided from the multiplexer circuit202to the communications circuit204(FIG.5B). For example, the output226of the multiplexer circuit202labeled Card #1Out is provided to the Card #1input232of the communication circuit204. Selector bits for each analog multiplexer222,224is received from the Mux Sel #1input244of the communications circuit204by the multiplexer select input228of the multiplexer circuit202. In the example illustrated inFIG.5A, five selector bits A0, A1, A2, A3, A4are used to select one of the 21 coil voltages210,212,214as inputs to the analog multiplexers222,224. Since each multiplexer circuit202will be able to handle 4 DRPI stacks, the multiplexer circuit202will contain eight total multiplexers. Each coil stack will have its own analog multiplexer222and an isolated redundant multiplexer224. Also, each coil voltage210,212,214will have a redundant rectifier circuit216,218,220(see also A/C peak detector rectifier circuit300inFIG.6) for a total of 168 rectifier circuits. In one aspect, the multiplexer22,224may be a radiation hardened multiplexer part number ISL71831SEH by Renesas/Intersil, which is rated as a 75 krad TID (total ionizing dose) for a low dose rate. Another suitable radiation hardened analog multiplexer222,224is a radiation hardened multiplexer part number ISL71841SEH by Renesas/Intersil, which is rated at 100 krad TID, among additional features. It will be appreciated that the analog multiplexers222,224may be implemented using any suitable radiation hardened multiplexer and the specific components described in the present disclosure are provided as examples without limitation. Communication Card With reference now primarily toFIG.5Band also toFIGS.5A and5C, the communication circuit204is the interface between the multiplexer circuit202and the data processing unit114located outside the containment structure. All the digital outputs that control the analog multiplexers222,224in the multiplexer circuit202will be received on the communication circuit204, then distributed out to the multiplexer circuit202. With continued reference toFIGS.5A-C, the communication circuit204comprises three 32 channel analog multiplexers246,248,250. Two of the analog multiplexers246,248receive the output voltage from each DRPI stack multiplexer such as the multiplexer222(FIG.5A). Therefore reducing 64 analog multiplexers down to 2 outputs. The third analog multiplexer250will reduce the other two analog multiplexers246,248down to a single output254, which is provided to the Analog Voltage Input1of the data processing unit114located outside the containment structure. The third analog multiplexer250will only have 2 of the 32 input channels used, but for simplicity and part availability the same integrated circuit is used. Selector bits A0, A1, A2, A3, A4for the first and second analog multiplexers246,248on the communication circuit204are received by the Mux Sel #2Input252from the data processing unit114. The analog multiplexer select bits A0, A1, A2, A3, A4for the analog multiplexers222,224on the multiplexer circuit202are received by the Mux Sel #1Input256from the data processing unit114. Data Acquisition Computer System With reference now primarily toFIG.5Cand also toFIGS.3,5A, and5B, The data processing unit114is located outside the containment structure. The data processing unit114comprises a processor128coupled to a memory130which also contains executable software instructions132to calculate the position of the control rods102,104based on the coil voltages210,212,214. The software instructions132also enable the processor128to control the selection of the analog multiplexers222,224in the multiplexer circuit202and the analog multiplexers246,248,250in the communication circuit204. Data Cabinet Layout and Design With reference now toFIGS.3-5C, the two data cabinets A, B comprising the transformer, interface, multiplexer circuit202, and communication circuit204will be mounted on the head of the nuclear reactor vessel head12. In one aspect, the individual circuits located in the data cabinets A, B, such as the interface circuit, multiplexer circuits202, and communication circuits204, are modular so that they can be single or double stacked in the data cabinet A, B enclosures. This allows for the data cabinet A, B enclosures to be different sizes depending on the application while still using the same electronics. FIG.7shows a method400of monitoring a position of a control rod disposed in a nuclear reactor vessel8disposed in a radioactive environment according to at least one aspect of the present disclosure. The method400is implemented in the hardware architecture shown inFIGS.3-6. An AC voltage is applied to the each control rod position indicator coil110,112in each coil stack106,108. According to the method400, the processor128located outside the containment structure selects402a control rod position indicator coil110arranged in a coil stack106through the analog multiplexer138located in the data cabinet A mounted on a nuclear reactor vessel head12inside the containment structure. The coil stack106is positioned proximate a control rod102disposed in the nuclear reactor vessel8. A signal from the control rod position indicator coil110is passed404through the analog multiplexer138. The signal from the analog multiplexer138is received406the by the processor128through the communication circuit204. The processor128determines408a position of the control rod102based on the received signal. Still with reference toFIG.7, according to the method400, the processor128determines410if there is another control rod position indicator coil110in the coil stack106. If there is another control rod position indicator coil110in the coil stack106, the method400proceeds along the “Yes” branch and the processor128advances412to the next control rod position indicator coil110in the coil stack106and repeats the selecting402, passing404, sending406, and determining408functions until all control rod position indicator coils110in the coil stack106are selected and read. If there are no more control rod position indicator coil110in the coil stack106, the method400proceeds along the “No” branch and the processor128advances414to the next coil stack108and repeats the selecting402, passing404, sending406, and determining408functions until all control rod position indicator coils110in the coil stack106are selected and read. In one aspect, the method400may repeat indefinitely by sampling all coils110,112in all coil stacks106,108in the nuclear reactor vessel8. In other aspects, the method400may be modified to sample any combination of coils110,112in the coil stacks106,108including monitoring a single coil, which may be useful for drop testing the control rod102,104, for example. As discussed above, there may be up to 21 control rod position indicator coils110,112per coil stack106,108, and there may be up to 69 control rods102,104in a nuclear reactor vessel8. In one aspect, the signal according to the method400is a voltage and the method comprises reading a voltage signal from the selected control rod position indicator coil110,112. The method400further comprises rectifying the voltage read from each of the control rod position indicator coils100,112. According to the method400, the processor128determines408a position of the control rod102based on the received voltage signal and in other aspects, and processor128then determines a position of the control rod102based on the received rectified voltage signal. In other aspects, the signal may be resistance, current, or other electrical parameter associated with the control rod position indicator coils110,112in each coil stack106,108. Accordingly, the method400comprises reading resistance, current, or other electrical parameter associated with the control rod position indicator coils110,112in each coil stack106,108and the processor128determines a position of the control rod based on the received resistance, current, or other electrical parameter associated with the control rod position indicator coils110,112in each coil stack106,108, and combinations thereof. The method400, further comprises routing signals through additional analog multiplexers in a communication circuit204located inside the containment structure that interfaces the analog multiplexers138,140with the data processing unit114located outside the containment structure. EXAMPLES Various aspects of the subject matter described herein are set out in the following examples. Example 1 A method of monitoring a position of a control rod disposed in a nuclear reactor vessel disposed in a radioactive environment, the method comprising: (a) selecting, by a processor located outside a containment structure, a control rod position indicator coil arranged in a coil stack through an analog multiplexer located in a data cabinet mounted on a nuclear reactor vessel head inside the containment structure, wherein the coil stack is located proximate to a control rod disposed in the nuclear reactor vessel; (b) passing, through the analog multiplexer, a signal from the control rod position indicator coil; (c) receiving, by the processor, the signal from the analog multiplexer through a communication circuit located in the data cabinet mounted on the nuclear reactor vessel head inside the containment structure; and (d) determining, by the processor, a position of the control rod based on the received signal. Example 2 The method of Example 1, further comprising determining if there is another control rod position indicator coil in the coil stack. Example 3 The method of Example 2, further comprising: selecting, by the processor, to a new control rod position indicator coil in the coil stack, if there is another control rod position indicator coil in the coil stack; and repeating (b)-(d) for all control rod position indicator coils in the coil stack. Example 4 The method of any one or more of Examples 2-3, further comprising: selecting, by the processor, to a new coil stack, if there are no more control rod position indicator coils in the coil stack; and repeating (b)-(d) for all control rod position indicator coils in the new coil stack. Example 5 The method of Example 4, further comprising repeating (a)-(d) for all coil stacks in the nuclear reactor vessel indefinitely. Example 6 The method of any one or more of Examples 1-5, wherein the signal is a voltage, the method further comprising rectifying, by a passive A/C peak detector rectifier circuit, the voltage signal, wherein the passive A/C peak detector rectifier circuit is located inside the containment structure. Example 7 The method of any one or more of Examples 1-6, further comprising routing signals through additional analog multiplexers in the communication circuit. Example 8 An apparatus for monitoring a position of a control rod disposed in a nuclear reactor vessel disposed in a radioactive environment, the apparatus comprising: a processor coupled to a memory storing executable instructions, the processor located outside a containment structure; an analog multiplexer located in a data cabinet mounted on a nuclear reactor vessel head inside the containment structure; and a communication circuit coupled to the analog multiplexer and the processor; wherein when executed by the processor the executable instructions cause the processor to: (a) select a control rod position indicator coil arranged in a coil stack through the analog multiplexer, wherein the coil stack is located proximate to a control rod disposed in the nuclear reactor vessel; (b) pass a signal from the control rod position indicator coil through the analog multiplexer; (c) receive the signal from the analog multiplexer through the communication circuit; and (d) determine a position of the control rod based on the received signal. Example 9 The apparatus of Example 8, wherein when executed by the processor the executable instructions cause the processor to determine if there is another control rod position indicator coil in the coil stack. Example 10 The apparatus of Example 9, wherein when executed by the processor the executable instructions cause the processor to: select a new control rod position indicator coil in the coil stack, if there is another control rod position indicator coil in the coil stack; and repeat (b)-(d) for all control rod position indicator coils in the coil stack. Example 11 The apparatus of any one or more of Examples 9-10, wherein when executed by the processor the executable instructions cause the processor to: select a new coil stack, if there are no more control rod position indicator coils in the coil stack; and repeat (b)-(d) for all control rod position indicator coils in the new coil stack. Example 12 The apparatus of Example 11, wherein when executed by the processor the executable instructions cause the processor to repeat (a)-(d) for all coil stacks in the nuclear reactor vessel indefinitely. Example 13 The apparatus of any one or more of Examples 8-12, wherein the signal is a voltage, the apparatus further comprising a passive A/C peak detector rectifier circuit to rectify the voltage signal, wherein the passive A/C peak detector rectifier circuit is located inside the containment structure. Example 14 The apparatus of any one or more of Examples 8-13, wherein the communication circuit further comprises an analog multiplexer to route signals through the communication circuit to the processor. Example 15 A system for monitoring a position of a control rod disposed in a nuclear reactor vessel disposed in a radioactive environment, the system comprising: a data processing unit located outside a containment structure, the data processing unit comprising a processor coupled to a memory storing executable instructions; a nuclear reactor vessel located inside the containment structure; a plurality of control rods disposed in the nuclear reactor vessel; a coil stack comprising a plurality of control rod position indicator coils, wherein the coil stack is located proximate to the control rod disposed in the nuclear reactor vessel; a data cabinet mounted on the nuclear reactor vessel head inside the containment structure, the data cabinet comprising: an analog multiplexer; and a communication circuit coupled to the analog multiplexer and the processor; wherein when executed by the processor the executable instructions cause the processor to: (a) select a control rod position indicator coil arranged in a coil stack through the analog multiplexer; (b) pass a signal from the control rod position indicator coil through the analog multiplexer; (c) receive the signal from the analog multiplexer through the communication circuit; and (d) determine a position of the control rod based on the received signal. Example 16 The system of Example 15, wherein when executed by the processor the executable instructions cause the processor to determine if there is another control rod position indicator coil in the coil stack. Example 17 The system of Example 16, wherein when executed by the processor the executable instructions cause the processor to: select a new control rod position indicator coil in the coil stack, if there is another control rod position indicator coil in the coil stack; and repeat (b)-(d) for all control rod position indicator coils in the coil stack. Example 18 The system of any one or more of Examples 16-17, wherein when executed by the processor the executable instructions cause the processor to: select a new coil stack, if there are no more control rod position indicator coils in the coil stack; and repeat (b)-(d) for all control rod position indicator coils in the new coil stack. Example 19 The system of Example 18, wherein when executed by the processor the executable instructions cause the processor to repeat (a)-(d) for all coil stacks in the nuclear reactor vessel indefinitely. Example 20 The system of any one or more of Examples 15-19, wherein the signal is a voltage, the apparatus further comprising a passive A/C peak detector rectifier circuit to rectify the voltage signal, wherein the passive A/C peak detector rectifier circuit is located inside the containment structure. Example 21 The system of any one or more of Examples 15-20, wherein the communication circuit further comprises an analog multiplexer to route signals through the communication circuit to the processor. While specific aspects of the present disclosure have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of which is to be given the full breadth of the claims appended and any and all equivalents thereof. Those skilled in the art will recognize that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to claims containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a” and/or “an” should typically be interpreted to mean “at least one” or “one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to “at least one of A, B, and C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, and C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). In those instances where a convention analogous to “at least one of A, B, or C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, or C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). It will be further understood by those within the art that typically a disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms unless context dictates otherwise. For example, the phrase “A or B” will be typically understood to include the possibilities of “A” or “B” or “A and B.” With respect to the appended claims, those skilled in the art will appreciate that recited operations therein may generally be performed in any order. Also, although various operational flow diagrams are presented in a sequence(s), it should be understood that the various operations may be performed in other orders than those which are illustrated, or may be performed concurrently. Examples of such alternate orderings may include overlapping, interleaved, interrupted, reordered, incremental, preparatory, supplemental, simultaneous, reverse, or other variant orderings, unless context dictates otherwise. Furthermore, terms like “responsive to,” “related to,” or other past-tense adjectives are generally not intended to exclude such variants, unless context dictates otherwise. It is worthy to note that any reference to “one aspect,” “an aspect,” “an exemplification,” “one exemplification,” and the like means that a particular feature, structure, or characteristic described in connection with the aspect is included in at least one aspect. Thus, appearances of the phrases “in one aspect,” “in an aspect,” “in an exemplification,” and “in one exemplification” in various places throughout the specification are not necessarily all referring to the same aspect. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more aspects. Any patent application, patent, non-patent publication, or other disclosure material referred to in this specification and/or listed in any Application Data Sheet is incorporated by reference herein, to the extent that the incorporated materials is not inconsistent herewith. As such, and to the extent necessary, the disclosure as explicitly set forth herein supersedes any conflicting material incorporated herein by reference. Any material, or portion thereof, that is said to be incorporated by reference herein, but which conflicts with existing definitions, statements, or other disclosure material set forth herein will only be incorporated to the extent that no conflict arises between that incorporated material and the existing disclosure material. The terms “comprise” (and any form of comprise, such as “comprises” and “comprising”), “have” (and any form of have, such as “has” and “having”), “include” (and any form of include, such as “includes” and “including”) and “contain” (and any form of contain, such as “contains” and “containing”) are open-ended linking verbs. As a result, a system that “comprises,” “has,” “includes” or “contains” one or more elements possesses those one or more elements, but is not limited to possessing only those one or more elements. Likewise, an element of a system, device, or apparatus that “comprises,” “has,” “includes” or “contains” one or more features possesses those one or more features, but is not limited to possessing only those one or more features. In summary, numerous benefits have been described which result from employing the concepts described herein. The foregoing description of the one or more forms has been presented for purposes of illustration and description. It is not intended to be exhaustive or limiting to the precise form disclosed. Modifications or variations are possible in light of the above teachings. The one or more forms were chosen and described in order to illustrate principles and practical application to thereby enable one of ordinary skill in the art to utilize the various forms and with various modifications as are suited to the particular use contemplated. It is intended that the claims submitted herewith define the overall scope. | 43,695 |
11862351 | DESCRIPTION OF THE PREFERRED EMBODIMENT The present invention relates generally to a coated composite material for nuclear fuel components, such as, but not limited to, fuel rod cladding, as well as methods of preparation. The coated composite includes a combination of ceramic and metallic components. The ceramic component is in the form of a ceramic composite that includes a ceramic matrix and ceramic fibers. The ceramic composite includes silicon carbide. Thus, in certain embodiments, the ceramic matrix and/or the ceramic fibers are composed of silicon carbide or silicon carbide-containing material. The metallic component is in the form of a coating composition and includes zirconium alloy. In accordance with the invention, the ceramic composite is formed or shaped into the nuclear fuel component, such as, fuel rod cladding, which includes an interior surface, an exterior surface and a cavity formed therein, and the coating composition is deposited on the exterior surface of the ceramic composite, e.g., cladding, to form thereon a zirconium coating, e.g., thin film. Without intending to be bound by any particular theory, it is believed that the presence of the zirconium coating serves as an Environmental Barrier Coating (EBC) on the ceramic composite and therefore, is effective to mitigate the potential for corrosion that is generally associated with ceramic, e.g., when in contact with coolant water in a nuclear water reactor. In addition, the zirconium coating effectively contributes to maintaining hermeticity of the ceramic composite cladding due to micro-cracking of the ceramic, e.g., silicon carbide, matrix under various loading conditions during operation, such as, system pressure, thermal quenching, fatigue, impact during seismic/Loss of Coolant Accident (LOCA), impact during handling, and the like. In general, the zirconium coating forms a hermetic barrier for fission products and may also provide some mechanical support for the cladding structure. The ceramic composite can be composed of silicon carbide fibers distributed or embedded within a silicon carbide matrix, or interlocking woven or braided fibers, e.g., fiber tows wrapped to form a woven structure. In general, the zirconium-coated, ceramic composite is an effective barrier to protect the contents contained within the cladding structure from exposure to high temperature environments and mechanical stresses. For example, the cladding may be suitable for use as fuel cladding for containing nuclear fuel in reactor environments having liquid coolant circulating at high temperatures. The fuel cladding has the capability to withstand normal and accident conditions, such as, design basis accidents and beyond design basis accidents, associated with nuclear fuel reactors. For ease of description, the invention is described herein in the context of a fuel cladding for containing or holding radioactive fuel pellets, wherein the cladding is placed in a reactor core and exposed to high temperature coolant circulating around the outside of the cladding and through the core. However, it is understood that the invention is not limited to this context. Fuel rod cladding is typically in the shape of an elongated tube having a cavity formed therein and two opposing open ends. The thickness of the tube wall can vary. In certain embodiments, the tube wall thickness is from about 100 to about 1000 microns. The cavity has fuel pellets contained therein and typically a hold-down device, such as a spring, to maintain the configuration, e.g., a stack, of the fuel pellets. A sealing mechanism is typically positioned at or in each open end of the cladding to provide a seal and prevent the coolant circulating in the core from entering the cavity of fuel rod cladding. (As shown inFIG.3.) The fuel rod cladding is positioned in the core of the nuclear reactor. (As shown inFIG.2.) Fuel rod cladding is primarily intended to contain fissile fuel pellets in which fission is causing heat generation and, to separate from a coolant medium the fuel pellets and fission products resulting from the fission. The cladding is typically composed of either a metallic material, e.g., zirconium or zirconium alloy, or alternatively a ceramic material, e.g., silicon carbide. There are advantages and disadvantages associated with each of the metallic cladding and ceramic cladding. For example, metallic cladding provides good hermeticity, good ductility, adjustable strength and a protective corrosion resistant layer. In contrast, ceramic cladding provides high stiffness, high temperature strength, high temperature survivability in oxidative and corrosive environments. As to conventional ceramic cladding, it is known in the art to coat an outer surface of a cladding composed of ceramic composite, e.g., silicon carbide matrix with silicon carbide fibers, with a silicon carbide monolithic layer, in the absence of a metal layer. This configuration is referred to in the art as “duplex”. Further, it is known to in the art to coat both of an inner surface and an outer surface of a cladding composed of ceramic composite, e.g., silicon carbide matrix with silicon carbide fibers, with a silicon carbide monolithic layer, in the absence of a metal layer. This configuration is referred to in the art as “triplex”. Furthermore, it is known in the art to apply a liner composed of metal, e.g., chromium tungsten, to an inner surface of a cladding composed of ceramic composite, e.g., silicon carbide matrix with silicon carbide fibers, and to apply a silicon carbide monolithic layer to the surface of the metal liner, such that the metal liner is positioned between the ceramic composite and the silicon carbide monolithic layer. Thus, this is referred to in the art as the “sandwich” configuration. The fuel rod cladding in accordance with the invention provides a multi-component material system that combines both metal, e.g., zirconium alloy, and ceramic materials, e.g., silicon carbide matrix and fibers, such that properties and advantages associated with each of these materials can be exhibited in the cladding. The invention includes a ceramic composite tube and a metal composition, which consists of a zirconium alloy, deposited in the form of a coating on an outer surface of the ceramic composite tube. In general, the fuel rod cladding composed of the multi-component material avoids problems associated with conventional ceramic composite systems, such as, difficulty in achieving hermeticity, while retaining material ductility and high temperature strength. The presence of the zirconium coating is effective to preclude the loss of hermeticity due to micro-cracks in the silicon carbide material and protection against corrosion from reactor coolant. FIG.4is a schematic, cross-section view, of a fuel rod in accordance with certain embodiments of the invention. As shown inFIG.4, the cladding80of the fuel rod is in the form of a cylindrical tube. It is contemplated and understood that the shape of the cladding is not limiting and can include a wide variety of shapes and configurations. For example, the cladding can be in the form of a box structure or other closed form including two-dimensional axially or conically extended structures. Further, the structure may be consistently shaped or inconsistently shaped; that is, the shape may be adjusted to accommodate variations in diameter along its length. Furthermore, it is contemplated that the cylindrical tube may be used in a variety of environments, such as, but not limited to, a reactor wherein the cladding80has contained therein a fuel element. InFIG.4, the cladding80includes the cylindrical tube, which, as a non-limiting example, may be a preformed cylinder, that has an inner cavity81and an interior surface82. The cladding80is composed of a ceramic composite83and a zirconium layer86deposited on a surface84of the ceramic composite83. The inner cavity81of the cladding80also includes a stack of the plurality of nuclear fuel pellets70, the upper and lower end plugs72and74, respectively, and the spring76which serves as a hold-down device to maintain the stacked configuration of the pellets70. The cladding80surrounds the pellets70to function as a barrier to prevent the fission by-products from entering the coolant and further contaminating the reactor system. The upper and lower end plugs72and74, respectively, provide a seal and prevent reactor coolant that is circulating in the core from entering the inner cavity81of the cladding80. FIG.5is a schematic that shows a cross section of a zirconium-coated, ceramic composite cladding in more detail. As shown inFIG.5, the cladding80is composed of the ceramic composite83that includes a ceramic matrix and ceramic fibers, wherein the ceramic can include silicon carbide or a silicon-carbide-containing material. The zirconium layer86, e.g., in the form of a coating, such as, a thin film, is applied to the surface84of the ceramic composite83. The zirconium layer86is composed of zirconium or zirconium alloy. The zirconium layer86is exposed to and in contact with coolant that circulates in a nuclear reactor and is effective to preclude the coolant from contacting the ceramic composite83, which is positioned underneath of the zirconium layer86. As described herein, the cladding80includes ceramic, e.g., silicon carbide/silicon carbide-containing, matrix and ceramic, e.g., silicon carbide/silicon carbide-containing, fibers. Generally, the fibers are distributed or embedded in the matrix. The fibers can include interlocking woven or braided, e.g., wound, fibers. The thickness of the cladding80can vary. For example, the cladding80can have a thickness in the range from about 100 to about 600 microns. The cladding80is typically formed using conventional apparatus and processes. In certain embodiments, the ceramic composite83may be constructed by pre-stressing a fiber component, forming fibers into tows, wrapping, wounding or braiding the fibers in a form of, for example, a cylindrical tube. In certain embodiments, a continuous braid lay-up (preforming) or filament winding over a mandrel can be employed. Typically, there are voids that exist between individual or groups of fibers and therefore, following the wrapping, winding or braiding step, the ceramic matrix is applied to at least partially fill the voids formed between the fibers. In addition, a thin (sub-micron) interface layer may be incorporated between the fibers and the adjacent ceramic matrix. The presence of the interface layer allows for ductile behavior. The ceramic matrix can be deposited or applied by employing chemical vapor infiltration (CVI) or chemical vapor deposition (CVD) technology. As used herein, CVI refers to depositing the ceramic matrix in pores using decomposed gaseous matrix precursors and CVD refers to depositing the ceramic matrix on surfaces using decomposed gaseous matrix precursors. In certain embodiments, CVI is conducted at temperatures from about 300° C. to about 1100° C. depending on the particular CVI process and apparatus employed. Traditional decomposition-based CVI occurs from about 900° C. to about 1100° C. In certain embodiments, atomic layer deposition-based SiC deposition is carried out at temperatures from about 300° C. to about 500° C. Alternatively, a conventional sol gel infiltration, drying and firing process may be used to form the ceramic composite. The zirconium layer86provides a protective coating over the ceramic composite83. This zirconium or zirconium alloy layer provides hermeticity of the ceramic composite cladding80and protection against corrosion from reactor coolant during normal operation, operational transients, design basis accidents and beyond design basis accidents. The coating thickness of the zirconium layer86can vary and may depend on the selection of zirconium alloy. This zirconium alloy layer will be sufficiently thick to prevent exposure of the underlying ceramic composite83from exposure to the coolant, taking into account operational induced effects, such as, but not limited to zirconium oxidation, grid-to-rod fretting wear, and the like, and provide a smooth surface to facilitate fuel rod insertion. Also, the thickness of the zirconium layer86will be appropriate to prevent excessive zirconium-steam reaction during a beyond design basis accident. That is, the maximum layer thickness is determined, and limited to, a thickness that is effective to prevent excessive hydrogen reaction during a beyond design basis accident condition. In certain embodiments, the zirconium layer, e.g., layer86, has a thickness in the range of about 0.004 to about 0.006 inches. This thickness can correspond to design criteria for a traditional zirconium cladding design, which includes the ability to accommodate (i) 10% (0.0023 mils) wall thickness reduction due to grid-to-rod fretting wear and (ii) not more than 17% (0.0038 mils) wall thickness loss by oxidation during a Loss of Coolant Accident (LOCA). Furthermore, this thickness can correspond to design criteria based on reduction of at least 70% of the total amount of zirconium in a typical fuel assembly having zirconium alloy cladding. Thus, the fuel rod cladding in accordance with the invention can reduce the amount of zirconium in a nuclear reactor core by at least 70%, resulting in a reduction of the zirconium-steam reaction in order to reduce or preclude the generation of excessive hydrogen. The zirconium layer, e.g., layer86, is typically formed using conventional coating apparatus and deposition processes. For example, the zirconium layer86may be formed by employing arc spray, liquid phase spray, plasma spray, cold-spray or laser deposition for applying a coating composition and forming a coating having a thickness that is sufficiently thick to provide complete coverage of the surface of the underlying ceramic composite83, and to retain a protective surface layer over the lifetime of the cladding. Preferred methods include plasma spray or laser deposition of the zirconium or zirconium alloy composition onto the ceramic composite. The ceramic composite, e.g., both of the fibers and matrix, and the zirconium coating exhibit high strength and stiffness at both reactor normal operating temperature, and at higher temperatures that are typical of design basis and beyond design basis accidents. The zirconium-coated, ceramic composite fuel rod cladding in accordance with the invention, provides at least one or more of the following benefits as compared to conventional claddings known in the art:(i.) Hermeticity of the surface of the cladding tube with respect to gaseous and volatile fuel fission products under various loading conditions;(ii.) Smooth, even surface of the cladding tube to facilitate fuel rod insertion process;(iii.) Sufficient thickness to protect against grid-to-rod fretting wear to prevent exposure of ceramic cladding to nuclear reactor coolant;(iv.) Sufficient thickness for 17% LOCA oxidation limit;(v.) Appropriate thickness to prevent excessive zirconium-steam reaction during a Beyond Design Basis Event;(vi.) Reduction of at least 70% of the total amount of zirconium in a fuel assembly of a nuclear reactor;(vii.) Capability to demonstrate high temperature strength and toughness, as well as swelling resistance and void formation resistance in response to irradiation;(viii.) Mechanical tolerance to very high temperatures and high mechanical strains;(ix.) Mechanical support and containment of fuel debris in the event of accident conditions; and(x.) Corrosion resistance and oxidation protection of the surface of the cladding tube. During operation in a reactor, internal pressure generated by gas production from the fuel is restrained by the cladding. The cladding functions include containing the fuel and fuel fission products, providing mechanical strength and stability, and providing protection and hermeticity to the external environment. As a result of the zirconium-coated, ceramic composite of the invention, the need for high temperature strength, swelling resistance and, corrosion resistance in a single material is avoided. While specific embodiments of the invention have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular embodiments disclosed are meant to be illustrative only and not limiting as to the scope of the invention which is to be given the full breadth of the appended claims and any and all equivalents thereof. | 16,683 |
11862352 | DETAILED DESCRIPTION An object of the present invention is to provide a channel box and a fuel assembly having a shape that can be achieved by applying a silicon carbide composite material, which can increase earthquake resistance and improve functions and performance of the fuel assembly. The channel box of the embodiment is a channel box having a hollow elongated portion and accommodating a plurality of nuclear reactor fuel rods inside the hollow elongated portion, wherein the hollow elongated portion is constituted by a plurality types of silicon carbide composite materials. Hereinafter, the channel box and the fuel assembly according to the embodiment are described below with reference to the drawings. The channel box of the embodiment is constituted by using the silicon carbide composite material, and is disposed to cover the fuel rods of a boiling water reactor (BWR), and has functions of securing a reactor coolant flow path, guiding a control rod, and fixing and protecting the fuel rods. In the following description, a constitution of the channel box is mainly described, where the fuel rods are arranged in a lattice pattern in the channel box to form the fuel assembly. First Embodiment FIG.1is a perspective diagram illustrating a schematic constitution of a channel box1with a silicon carbide composite material according to a first embodiment applied. The channel box1has a square hollow elongated portion2whose overall shape is a square elongated shape. The channel box1also has channel box corner portions21located at four corners of the square hollow elongated portion2and channel box sides22located between these channel box corner portions21. Hereinafter, a material formed by silicon carbide fibers, an interface around the fibers, and a matrix are referred to as a silicon carbide composite material. A material formed by the matrix alone is referred to as a monolithic silicon carbide material. The channel box1has a laminated structure of these two materials. FIG.2is a schematic perspective diagram schematically illustrating a constitution of the channel box1of the first embodiment. As illustrated inFIG.2, the channel box1is divided into a plurality of (six in the example illustrated inFIG.2) areas7to12in a longitudinal direction, and the silicon carbide composite material used is different from one another. The example illustrated inFIG.2illustrates the case where the channel box1is divided into six areas7to12, but the number of areas may be five or less, or seven or more. The constitution of the silicon carbide composite material may be changed continuously without dividing the channel box1into the plurality of areas. For example, a silicon carbide composite material having the constitution illustrated inFIG.3can be used as the silicon carbide composite material. The silicon carbide composite material illustrated inFIG.3has, for example, a three-layer structure made up of a first layer31, a second layer32, and an intermediate layer33interposed therebetween. The first layer31is made of, for example, silicon carbide. The second layer32is made of silicon carbide complexed with silicon carbide fibers. The intermediate layer33is made of a solid lubricant. Here, the first layer31is arranged on the outside and the second layer32on the inside in the channel box1. Since a constituent of the channel box1of the first embodiment is basically silicon carbide, radioactivation during use is suppressed. Further, generation of hydrogen due to a reaction with water is suppressed even if the channel box1comes into contact with water during a serious accident of a nuclear reactor. Further, the channel box1of the first embodiment has a structure in which the intermediate layer33, which serves as an interface that weakens a bonding force between the first layer31and the second layer32, is interposed between the first layer31made of silicon carbide and the second layer32made of silicon carbide complexed with silicon carbide fibers, thereby achieving a balance among strength, fracture toughness, and fracture energy at a high level. Concretely, the first layer31made of silicon carbide ensures the strength and the second layer32made of silicon carbide complexed with silicon carbide fibers ensures the fracture toughness and fracture energy. In particular, the first layer31and the second layer32are functionally separated and effectively perform their functions by interposing the intermediate layer33, which serves as the interface that weakens the bonding force, between the first layer31and the second layer32. Thus, the first layer31made of silicon carbide sufficiently ensures the strength required in normal time and for vibrations during earthquakes. The second layer32made of silicon carbide complexed with silicon carbide fibers suppresses fracture when a load or a thermal shock exceeding a design basis is applied in a serious accident of a nuclear reactor. The silicon carbide composite material is not limited to the above-mentioned three-layer structure, but can also have the constitution of four or more layers. The second layer32is made of silicon carbide complexed with silicon carbide fibers. This allows, for example, the second layer32to exhibit ductile fracture, and thereby progress of the fracture can be suppressed when combined with such as the first layer31for brittle fracture. In the second layer32, for example, a matrix is formed by silicon carbide, and the silicon carbide fibers are arranged in the matrix of silicon carbide. The second layer32may have pores. Spaces between the silicon carbide fibers need not be completely filled by the matrix made of silicon carbide, as long as porosity is between 8.5 and 22.0%. The silicon carbide fibers are usually arranged in the matrix made of silicon carbide in a form of fiber bundles of approximately 100 to 10000 fibers. In the second layer32, such fiber bundles are preferably continuous. For example, in the second layer32, it is preferred that an entire structure is formed of one continuous fiber bundle. In such a case, the fracture toughness and fracture energy are particularly high. As mentioned above, the intermediate layer33is disposed between the first layer31and the second layer32and has the solid lubricant. The first layer31and the second layer32are functionally separated and effectively express their functions by interposing the intermediate layer33between the first layer31and the second layer32. In addition, the interposition of the intermediate layer33between the first layer31and the second layer32prevents cracks generated in the first layer31from propagating directly to the second layer32. As a result, the balance among the strength, fracture toughness, and fracture energy can be achieved at a higher level compared to the case where the first layer31and the second layer32are directly bonded. Boron nitride, graphite, mica-based minerals, and the like are preferred to be used as the interface in the intermediate layer33that weakens the bonding force. When the intermediate layer33is made of these materials, the first layer31and the second layer32are functionally well separated. In the silicon carbide composite material of the above constitution, for example, states of the strength, fracture toughness, and fracture energy can be adjusted by changing a ratio of an average thickness of the first layer31to an average thickness of the second layer32. The states of the strength, fracture toughness, and fracture energy can also be adjusted by adjusting a content or the like of the silicon carbide fibers in the second layer32. The channel box1vibrates horizontally during an earthquake, but force applied by the earthquake vibration differs depending on a position of the channel box1in a longitudinal direction (vertical direction) and a position in a horizontal direction (perpendicular to the longitudinal direction). In the channel box1of the first embodiment, the channel box1is divided into six areas7to12in the longitudinal direction depending on horizontal stress or the like applied, for example, during an earthquake, and the silicon carbide composite material used is made different as illustrated inFIG.2, and thereby mechanical properties (strength, fracture toughness, and fracture energy), and the like required for the position in the longitudinal direction can be provided. For example, when a center portion in the longitudinal direction of the channel box1requires bending resistance and upper and lower ends require shear resistance, such mechanical properties can be achieved by decreasing the silicon carbide fiber content of the silicon carbide composite material at the center portion in the longitudinal direction and increasing the contents at the upper and lower ends in each of the areas7to12. The silicon carbide fiber content can be adjusted as described above, for example, by changing the ratio of the average thickness of the first layer31to the average thickness of the second layer32, adjusting the silicon carbide fiber content or the like of the second layer32, and the like. Contrary to the above, when the center portion in the longitudinal direction of the channel box1requires the shear resistance and the upper and lower ends require the bending resistance, such mechanical properties can be achieved by increasing the silicon carbide fiber content of the silicon carbide composite material at the center portion in the longitudinal direction and decreasing the contents at the upper and lower ends in each of the areas7to12. The above description describes three areas, the center portion and the upper and lower ends in the longitudinal direction of the channel box1. However, in the example illustrated inFIG.2, for example, the longitudinal direction of the channel box1is divided into six areas7to12, which allows for finer adjustments to be made for each longitudinal position. For example, each neighboring area can be adjusted to have different mechanical properties. The above description describes the case where the channel box1is divided into the areas7to12in the longitudinal direction, but it may also be divided into areas in the horizontal direction, or into areas in the longitudinal and horizontal directions. Furthermore, a horizontal cross-sectional shape of the channel box1may be changed as well as the silicon carbide fiber content of the silicon carbide composite material. As described above, the present embodiment can provide a channel box and a fuel assembly having a shape that can be achieved by applying the silicon carbide composite material, capable of increasing earthquake resistance, and improving functions and performance of the fuel assembly. Second Embodiment Next, a second embodiment will be explained with reference toFIG.4andFIG.5. InFIG.4andFIG.5, the parts corresponding to the first embodiment are marked with the same signs, and redundant explanations are omitted. As illustrated inFIG.4, a channel box1aof the second embodiment has corner portions3each with an outward bulge in its horizontal cross-sectional shape. In other words, a sidewall portion of the channel box1ahas square hollow elongated shape whose corner portions each has an outwardly protruding shape. FIGS.5A,5Bare enlarged horizontal cross-sectional diagrams of a main part illustrating a positional relationship of the channel box1a, a control rod4, and fuel rods5of the second embodiment compared with a conventional channel box100, whereFIG.5Aillustrates the case of the channel box1a, andFIG.5Billustrates the case of the conventional channel box100. As illustrated inFIG.5B, a coolant gap6is formed between an inner wall of the channel box corner portion21and the fuel rod5closest to the corner portion. The channel box1amade of the silicon carbide composite material is installed in a reactor core of a nuclear reactor while covering a plurality of fuel rods5. Therefore, the channel box1ahas the square hollow elongated portion2to cover the fuel rods5, and this shape enables the channel box1ato secure a reactor coolant flow path inside the fuel assembly, to guide the control rod when it is inserted, and to protect the fuel assembly. Therefore, the channel box1ahas a structure having a plate thickness that satisfies these functions. Since the silicon carbide composite material has higher strength than a zirconium alloy, a thinner plate thickness than that required for the current zirconium-based alloy channel box100can be used by replacing the material of the channel box from that of the current zirconium-based alloy channel box100to the silicon carbide composite of the channel box1a. If the plate thickness of the channel box can be made thinner, the structure can be changed to have a curvature that allows the coolant gap6to be larger than before, and the corner portion3with a bulge on the outside of the channel box can be used. In addition, compared to the case where a plate material made of zirconium alloy is bent using a press or the like, for example, the silicon carbide composite material can be formed into any shape more easily, for example, by wrapping the material around a jig with a predetermined shape and heating it, or the like. InFIG.5, the difference between the plate thickness of the channel box1aand that of the channel box100is exaggerated in order to make it easier to understand, but it is possible to reduce the plate thickness of the silicon carbide composite material by 20 to 30% compared to the current zirconium-based alloy channel box. The channel box1aof the second embodiment with the above constitution has the corner portions3with the outward bulge in its horizontal cross-sectional shape, which can increase the overall strength as well as the earthquake resistance as in the first embodiment. In addition, the thinning of the plate thickness increases a fuel flow path area within the same external dimensions as before. Besides, the coolant gap6between the inner wall of the channel box corner portion and the fuel rod5closest to that corner portion is 0.1 to 2 mm wider than before, for example, increasing the flow path area. As described above, the second embodiment improves the earthquake resistance and increases the flow path area around the corner fuel rods, which have a narrow flow path area and are thermally severe in the channel box, thus improving critical power. In addition, the flow path area can be increased within the same external dimensions as before, and pressure loss design of the fuel assembly can be more flexible. Furthermore, optimized design can lead to improving channel stability, increasing of power, improving thermal tolerance, and the like. In the above second embodiment, the case where all four corner portions are the corner portions3each with the outward bulge. However, at least one corner portion can be the corner portion3with the outward bulge. Hereinabove, while certain embodiments of the present invention have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. These novel embodiments may be embodied in a variety of other forms, furthermore, various omissions, substitutions, and changes may be made therein without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions. | 15,478 |
11862353 | DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION FIGS.1-3illustrate a fuel assembly10according to an embodiment of the present invention. As shown inFIG.3, the fuel assembly10comprises a plurality of fuel elements20supported by a frame25. As shown inFIG.3, the frame25comprises a shroud30, guide tubes40, an upper nozzle50, a lower nozzle60, a lower tie plate70, an upper tie plate80, and/or other structure(s) that enable the assembly10to operate as a fuel assembly in a nuclear reactor. One or more of these components of the frame25may be omitted according to various embodiments without deviating from the scope of the present invention. As shown inFIG.3, the shroud25mounts to the upper nozzle50and lower nozzle60. The lower nozzle60(or other suitable structure of the assembly10) is constructed and shaped to provide a fluid communication interface between the assembly10and the reactor90into which the assembly10is placed so as to facilitate coolant flow into the reactor core through the assembly10via the lower nozzle60. The upper nozzle50facilitates direction of the heated coolant from the assembly10to the power plant's steam generators (for PWRs), turbines (for BWRs), etc. The nozzles50,60have a shape that is specifically designed to properly mate with the reactor core internal structure. As shown inFIG.3, the lower tie plate70and upper tie plate80are preferably rigidly mounted (e.g., via welding, suitable fasteners (e.g., bolts, screws), etc.) to the shroud30or lower nozzle60(and/or other suitable structural components of the assembly10). Lower axial ends of the elements20form pins20athat fit into holes70ain the lower tie plate70to support the elements20and help maintain proper element20spacing. The pins20amount to the holes70ain a manner that prevents the elements20from rotating about their axes or axially moving relative to the lower tie plate70. This restriction on rotation helps to ensure that contact points between adjacent elements20all occur at the same axial positions along the elements20(e.g., at self-spacing planes discussed below). The connection between the pins20aand holes70amay be created via welding, interference fit, mating non-cylindrical features that prevent rotation (e.g., keyway and spline), and/or any other suitable mechanism for restricting axial and/or rotational movement of the elements20relative to the lower tie plate70. The lower tie plate70includes axially extending channels (e.g., a grid of openings) through which coolant flows toward the elements20. Upper axial ends of the elements20form pins20athat freely fit into holes80ain the upper tie plate80to permit the upper pins20ato freely axially move upwardly through to the upper tie plate80while helping to maintain the spacing between elements20. As a result, when the elements20axially grow during fission, the elongating elements20can freely extend further into the upper tie plate80. As shown inFIG.4, the pins70atransition into a central portion of the element20. FIGS.4and5illustrate an individual fuel element/rod20of the assembly10. As shown inFIG.5, the elongated central portion of the fuel element20has a four-lobed cross-section. A cross-section of the element20remains substantially uniform over the length of the central portion of the element20. Each fuel element20has a fuel kernel100, which includes a refractory metal and fuel material that includes fissile material. A displacer110that comprises a refractory metal is placed along the longitudinal axis in the center of the fuel kernel100. The displacer110helps to limit the temperature in the center of the thickest part of the fuel element20by displacing fissile material that would otherwise occupy such space and minimize variations in heat flux along the surface of the fuel element. According to various embodiments, the displacer110may be eliminated altogether. As shown inFIG.5, the fuel kernel100is enclosed by a refractory metal cladding120. The cladding120is preferably thick enough, strong enough, and flexible enough to endure the radiation-induced swelling of the kernel100without failure (e.g., without exposing the kernel100to the environment outside the cladding120). According to one or more embodiments, the entire cladding120is at least 0.3 mm, 0.4 mm, 0.5 mm, and/or 0.7 mm thick. According to one or more embodiments, the cladding120thickness is at least 0.4 mm in order to reduce a chance of swelling-based failure, oxidation based failure, and/or any other failure mechanism of the cladding120. The cladding120may have a substantially uniform thickness in the annular direction (i.e., around the perimeter of the cladding120as shown in the cross-sectional view ofFIG.5) and over the axial/longitudinal length of the kernel100(as shown inFIG.4). Alternatively, as shown inFIG.5, according to one or more embodiments, the cladding120is thicker at the tips of the lobes20bthan at the concave intersection/area20cbetween the lobes20b. For example, according to one or more embodiments, the cladding120at the tips of the lobes20bis at least 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, 100%, 125%, and/or 150% thicker than the cladding120at the concave intersections/areas20c. The thicker cladding120at the tips of the lobes20bprovides improved wear resistance at the tips of the lobes20bwhere adjacent fuel elements20touch each other at the self-spacing planes (discussed below). The refractory metal used in the displacer110, the fuel kernel100, and the cladding120comprises zirconium according to one or more embodiments of the invention. As used herein, the term zirconium means pure zirconium or zirconium in combination with other alloy material(s). However, other refractory metals may be used instead of zirconium without deviating from the scope of the present invention (e.g., niobium, molybdenum, tantalum, tungsten, rhenium, titanium, vanadium, chromium, zirconium, hafnium, ruthenium, osmium, iridium, and/or other metals). As used herein, the term “refractory metal” means any metal/alloy that has a melting point above 1800 degrees Celsius (2073K). Moreover, in certain embodiments, the refractory metal may be replaced with another non-fuel metal, e.g., aluminum. However, the use of a non-refractory non-fuel metal is best suited for reactor cores that operate at lower temperatures (e.g., small cores that have a height of about 1 meter and an electric power rating of 100 MWe or less). Refractory metals are preferred for use in cores with higher operating temperatures. As shown inFIG.5, the central portion of the fuel kernel100and cladding120has a four-lobed profile forming spiral spacer ribs130. The displacer110may also be shaped so as to protrude outwardly at the ribs130(e.g., corners of the square displacer110are aligned with the ribs130). According to alternative embodiments of the present invention, the fuel elements20may have greater or fewer numbers of ribs130without deviating from the scope of the present invention. For example, as generally illustrated in FIG. 5 of U.S. Patent Application Publication No. 2009/0252278 A1, a fuel element may have three ribs/lobes, which are preferably equally circumferentially spaced from each other. The number of lobes/ribs130may depend, at least in part, on the shape of the fuel assembly10. For example, a four-lobed element20may work well with a square cross-sectioned fuel assembly10(e.g., as is used in the AP-1000). In contrast, a three-lobed fuel element may work well with a hexagonal fuel assembly (e.g., as is used in the VVER). FIG.9illustrates various dimensions of the fuel element20according to one or more embodiments. According to one or more embodiments, any of these dimensions, parameters and/or ranges, as identified in the below table, can be increased or decreased by up to 5%, 10%, 15%, 20%, 25%, 30%, 40%, 50%, or more without deviating from the scope of the present invention. Fuel Element 20 ParameterSymbolExample ValuesUnitCircumscribed diameterD9-14 (e.g., 12.3, 12.4, 12.5, 12.6)mmLobe thicknessΔ2.5-3.8 (e.g., 2.5, 2.6, 2.7, 2.8, 2.9,mm3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7,3.8), variableMinimum cladding thicknessδ0.4-1.2 (e.g., 0.4, 0.5, 0.6, 0.7,mm0.8, 0.9, 1.0, 1.1, 1.2)Cladding thickness at the lobeδmax0.4-2.2 (e.g., 0.4, 0.5, 0.6, 0.7,mm0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5,1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2),1.5δ, 2δ, 2.5δAverage cladding thickness0.4-1.8 (e.g., 0.4, 0.5, 0.6, 0.7,mm0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4,1.5, 1.6, 1.7, 1.8), at least 0.4, 0.5, or 0.6Curvature radius of cladding at loberΔ/2, Δ/1.9, variablemmperipheryCurvature radius of fuel kernel at loberf0.5-2.0 (e.g., 0.5, 0.6, 0.7, 0.8,mmperiphery0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5,1.6, 1.7, 1.8, 1.9, 2.0),(Δ-2δ)/2, variableRadius of curvature between adjacentR2-5 (e.g., 2, 3, 4, 5), variablemmlobesCentral displacer side lengtha1.5-3.5 (e.g., 1.5, 1.6, 1.7,mm1.8, 1.9, 2.0, 2.1, 2.2, 2.3,2.4, 2.5, 2.6, 2.7, 2.8, 2.9,3.0, 3.1, 3.2, 3.3, 3.4, 3.5)Fuel element perimeter25-60 (e.g., 25, 30, 35, 40, 45, 50, 55, 60)mmFuel element area50-100 (e.g., 50, 60, 70, 80, 90, 100)mm2Fuel kernel area, mm230-70 (e.g., 30, 40, 50, 60, 70)mm2Enrichment<19.7w/oU fraction<25v/o As shown inFIG.4, the displacer110has a cross-sectional shape of a square regular quadrilateral with the corners of the square regular quadrilateral being aligned with the ribs130. The displacer110forms a spiral that follows the spiral of the ribs130so that the corners of the displacer110remain aligned with the ribs130along the axial length of the fuel kernel100. In alternative embodiments with greater or fewer ribs130, the displacer110preferably has the cross-sectional shape of a regular polygon having as many sides as the element20has ribs. As shown inFIG.6, the cross-sectional area of the central portion of the element20is preferably substantially smaller than the area of a square200in which the tip of each of the ribs130is tangent to one side of the square200. In more generic terms, the cross-sectional area of an element20having n ribs is preferably smaller than the area of a regular polygon having n sides in which the tip of each of the ribs130is tangent to one side of the polygon. According to various embodiments, a ratio of the area of the element20to the area of the square (or relevant regular polygon for elements20having greater or fewer than four ribs130) is less than 0.7, 0.6, 0.5, 0.4, 0.35, 0.3. As shown inFIG.1, this area ratio approximates how much of the available space within the shroud30is taken up by the fuel elements20, such that a lower ratio means that more space is advantageously available for coolant, which also acts as a neutron moderator and which increases the moderator-to-fuel ratio (important for neutronics), reduces hydraulic drag, and increases the heat transfer from the elements20to the coolant. According to various embodiments, the resulting moderator to fuel ratio is at least 2.0, 2.25, 2.5, 2.75, and/or 3.0 (as opposed to 1.96 when conventional cylindrical uranium oxide rods are used). Similarly, according to various embodiments, the fuel assembly10flow area is increased by over 16% as compared to the use of one or more conventional fuel assemblies that use cylindrical uranium oxide rods. The increased flow area may decrease the coolant pressure drop through the assembly10(relative to conventional uranium oxide assemblies), which may have advantages with respect to pumping coolant through the assembly10. As shown inFIG.4, the element20is axially elongated. In the illustrated embodiment, each element20is a full-length element and extends the entire way from lower tie plate70at or near the bottom of the assembly10to the upper tie plate80at or near the top of the assembly10. According to various embodiments and reactor designs, this may result in elements20that are anywhere from 1 meter long (for compact reactors) to over 4 meters long. Thus, for typical reactors, the elements20may be between 1 and 5 meters long. However, the elements20may be lengthened or shortened to accommodate any other sized reactor without deviating from the scope of the present invention. While the illustrated elements20are themselves full length, the elements20may alternatively be segmented, such that the multiple segments together make a full length element. For example, 4 individual 1 meter element segments20may be aligned end to end to effectively create the full-length element. Additional tie plates70,80may be provided at the intersections between segments to maintain the axial spacing and arrangement of the segments. According to one or more embodiments, the fuel kernel100comprises a combination of a refractory metal/alloy and fuel material. The refractory metal/alloy may comprise a zirconium alloy. The fuel material may comprise low enriched uranium (e.g., U235, U233), plutonium, or thorium combined with low enriched uranium as defined below and/or plutonium. As used herein, “low enriched uranium” means that the whole fuel material contains less than 20% by weight fissile material (e.g., uranium-235 or uranium-233). According to various embodiments, the uranium fuel material is enriched to between 1% and 20%, 5% and 20%, 10% and 20%, and/or 15% and 20% by weight of uranium-235. According to one or more embodiments, the fuel material comprises 19.7% enriched uranium-235. According to various embodiments, the fuel material may comprise a 3-10%, 10-40%, 15-35%, and/or 20-30% volume fraction of the fuel kernel100. According to various embodiments, the refractory metal may comprise a 60-99%, 60-97%, 70-97%, 6090%, 65-85%, and/or 70-80% volume fraction of the fuel kernel100. According to one or more embodiments, volume fractions within one or more of these ranges provide an alloy with beneficial properties as defined by the material phase diagram for the specified alloy composition. The fuel kernel100may comprise a Zr—U alloy that is a high-alloy fuel (i.e., relatively high concentration of the alloy constituent relative to the uranium constituent) comprised of either δ-phase UZr2, or a combination of δ-phase UZr2and α-phase Zr. According to one or more embodiments, the δ-phase of the U—Zr binary alloy system may range from a zirconium composition of approximately 65-81 volume percent (approximately 63 to 80 atom percent) of the fuel kernel100. One or more of these embodiments have been found to result in low volumetric, irradiation-induced swelling of the fuel element20. According to one or more such embodiments, fission gases are entrained within the metal kernel100itself, such that one or more embodiments of the fuel element20can omit a conventional gas gap from the fuel element20. According to one or more embodiments, such swelling may be significantly less than would occur if low alloy (α-phase only) compositions were used (e.g., at least 10%, 20%, 30%, 50%, 75%, 100%, 200%, 300%, 500%, 1000%, 1200%, 1500%, or greater reduction in volume percent swelling per atom percent burnup than if a low alloy α-phase U-10Zr fuel was used). According to one or more embodiments of the present invention, irradiation-induced swelling of the fuel element20or kernel100thereof may be less than 20, 15, 10, 5, 4, 3, and/or 2 volume percent per atom percent burnup. According to one or more embodiments, swelling is expected to be around one volume percent per atom percent burnup. According to one or more alternative embodiments of the present invention, the fuel kernel is replaced with a plutonium-zirconium binary alloy with the same or similar volume percentages as with the above-discussed U—Zr fuel kernels100, or with different volume percentages than with the above-discussed U—Zr fuel kernels100. For example, the plutonium fraction in the kernel100may be substantially less than a corresponding uranium fraction in a corresponding uranium-based kernel100because plutonium typically has about 60-70% weight fraction of fissile isotopes, while LEU uranium has 20% or less weight fraction of fissile U-235 isotopes. According to various embodiments, the plutonium volume fraction in the kernel100may be less than 15%, less than 10%, and/or less than 5%, with the volume fraction of the refractory metal being adjusted accordingly. The use of a high-alloy kernel100according to one or more embodiments of the present invention may also result in the advantageous retention of fission gases during irradiation. Oxide fuels and low-alloy metal fuels typically exhibit significant fission gas release that is typically accommodated by the fuel design, usually with a plenum within the fuel rod to contain released fission gases. The fuel kernel100according to one or more embodiments of the present invention, in contrast, does not release fission gases. This is in part due to the low operating temperature of the fuel kernel100and the fact that fission gas atoms (specifically Xe and Kr) behave like solid fission products. Fission gas bubble formation and migration along grain boundaries to the exterior of the fuel kernel100does not occur according to one or more embodiments. At sufficiently high temperatures according to one or more embodiments, small (a few micron diameter) fission gas bubbles may form. However, these bubbles remain isolated within the fuel kernel100and do not form an interconnected network that would facilitate fission gas release, according to one or more embodiments of the present invention. The metallurgical bond between the fuel kernel100and cladding120may provide an additional barrier to fission gas release. According to various embodiments, the fuel kernel100(or the cladding120or other suitable part of the fuel element20) of one or more of the fuel elements20can be alloyed with a burnable poison such as gadolinium, boron, erbium or other suitable neutron absorbing material to form an integral burnable poison fuel element. Different fuel elements20within a fuel assembly10may utilize different burnable poisons and/or different amounts of burnable poison. For example, some of fuel elements20of a fuel assembly10(e.g., less than 75%, less than 50%, less than 20%, 1-15%, 1-12%, 2-12%, etc.) may include kernels100with 25, 20, and/or 15 weight percent or less Gd (e.g., 1-25 weight percent, 1-15 weight percent, 5-15 weight percent, etc.). Other fuel elements20of the fuel assembly10(e.g., 1095%, 10-50%, 20-50%, a greater number of the fuel elements20than the fuel elements20that utilize Gd) may include kernels100with 10 or 5 weight percent or less Er (e.g., 0.1-10.0 weight percent, 0.1 to 5.0 weight percent etc.). According to various embodiments, the burnable poison displaces the fuel material (rather than the refractory metal) relative to fuel elements20that do not include burnable poison in their kernels100. For example, according to one embodiment of a fuel element20whose kernel100would otherwise include 65 volume percent zirconium and 35 volume percent uranium in the absence of a poison, the fuel element20includes a kernel100that is 16.5 volume percent Gd, 65 volume percent zirconium, and 18.5 volume percent uranium. According to one or more other embodiments, the burnable poison instead displaces the refractory metal, rather than the fuel material. According to one or more other embodiments, the burnable poison in the fuel kernel100displaces the refractory metal and the fuel material proportionally. Consequently, according to various of these embodiments, the burnable poison within the fuel kernel100may be disposed in the δ-phase of UZr2or α-phase of Zr such that the presence of the burnable poison does not change the phase of the UZr2alloy or Zr alloy in which the burnable poison is disposed. Fuel elements20with a kernel100with a burnable poison may make up a portion (e.g., 0-100%, 1-99%, 1-50%, etc.) of the fuel elements20of one or more fuel assemblies10used in a reactor core. For example, fuel elements20with burnable poison may be positioned in strategic locations within the fuel assembly lattice of the assembly10that also includes fuel elements20without burnable poison to provide power distribution control and to reduce soluble boron concentrations early in the operating cycle. Similarly, select fuel assemblies10that include fuel elements20with burnable poison may be positioned in strategic locations within the reactor core relative to assemblies10that do not include fuel elements20with burnable poison to provide power distribution control and to reduce soluble boron concentrations early in the operating cycle. The use of such integral burnable absorbers may facilitate the design of extended operating cycles. Alternatively and/or additionally, separate non-fuel bearing burnable poison rods may be included in the fuel assembly10(e.g., adjacent to fuel elements20, in place of one or more fuel elements20, inserted into guide tubes in fuel assemblies10that do not receive control rods, etc.). In one or more embodiments, such non-fuel burnable poison rods can be designed into a spider assembly similar to that which is used in the Babcock and Wilcox or Westinghouse designed reactors (referred to as burnable poison rod assemblies (BPRA)). These then may be inserted into the control rod guide tubes and locked into select fuel assemblies10where there are no control banks for the initial cycle of operation for reactivity control. When the burnable poison cluster is used it may be removed when the fuel assembly is relocated for the next fuel cycle. According to an alternative embodiment in which the separate non-fuel bearing burnable poison rods are positioned in place of one or more fuel elements20, the non-fuel burnable poison rods remain in the fuel assembly10and are discharged along with other fuel elements20when the fuel assembly10reaches its usable life. The fuel elements20are manufactured via powder-metallurgy co-extrusion. Typically, the powdered refractory metal and powdered metal fuel material (as well as the powdered burnable poison, if included in the kernel100) for the fuel kernel100are mixed, the displacer110blank is positioned within the powder mixture, and then the combination of powder and displacer110is pressed and sintered into fuel core stock/billet (e.g., in a mold that is heated to varying extents over various time periods so as to sinter the mixture). The displacer110blank may have the same or similar cross-sectional shape as the ultimately formed displacer110. Alternatively, the displacer110blank may have a shape that is designed to deform into the intended cross-sectional shape of the displacer110upon extrusion. The fuel core stock (including the displacer110and the sintered fuel kernel100material) is inserted into a hollow cladding120tube that has a sealed tube base and an opening on the other end. The opening on the other end is then sealed by an end plug made of the same material as the cladding to form a billet. The billet may be cylindrically shaped, or may have a shape that more closely resembles the ultimate cross-sectional shape of the element20, for example, as shown inFIGS.5and9. The billet is then co-extruded under temperature and pressure through a die set to create the element20, including the finally shaped kernel100, cladding110, and displacer120. According to various embodiments that utilize a non-cylindrical displacer110, the billet may be properly oriented relative to the extrusion press die so that corners of the displacer110align with the lobes20bof the fuel element20. The extrusion process may be done by either direct extrusion (i.e., moving the billet through a stationary die) or indirect extrusion (i.e., moving the die toward a stationary billet). The process results in the cladding120being metallurgically bonded to the fuel kernel100, which reduces the risk of delamination of the cladding120from the fuel kernel100. The tube and end plug of the cladding120metallurgically bond to each other to seal the fuel kernel100within the cladding120. The high melting points of refractory metals used in the fuel elements10tend to make powder metallurgy the method of choice for fabricating components from these metals. According to one or more alternative embodiments, the fuel core stock of the fuel elements20may be manufactured via casting instead of sintering. Powdered or monolithic refractory metal and powdered or monolithic fuel material (as well as the powdered burnable poison, if included in the kernel100) may be mixed, melted, and cast into a mold. The mold may create a displacer-blank-shaped void in the cast kernel100such that the displacer110blank may be inserted after the kernel100is cast, in the same manner that the cladding120is added to form the billet to be extruded. The remaining steps for manufacturing the fuel elements20may remain the same as or similar to the above-discuss embodiment that utilizes sintering instead of casting. Subsequent extrusion results in metallurgical bonding between the displacer110and kernel100, as well as between the kernel100and cladding120. According to one or more alternative embodiments, the fuel elements20are manufactured using powdered ceramic fuel material instead of powdered metal fuel material. The remaining manufacturing steps may be the same as discussed above with respect to the embodiments using powdered metal fuel material. In various metal fuel embodiments and ceramic fuel embodiments, the manufacturing process may result in a fuel kernel100comprising fuel material disposed in a matrix of metal non-fuel material. In one or more of the metal fuel embodiments, the resulting fuel kernel100comprises a metal fuel alloy kernel comprising an alloy of the metal fuel material and the matrix of metal non-fuel material (e.g., a uranium-zirconium alloy). In one or more of the ceramic fuel embodiments, the kernel100comprises ceramic fuel material disposed in (e.g., interspersed throughout) the matrix of metal non-fuel material. According to various embodiments, the ceramic fuel material used in the manufacturing process may comprise powdered uranium or plutonium oxide, powdered uranium or plutonium nitride, powdered uranium or plutonium carbide, powdered uranium or plutonium hydride, or a combination thereof. In contrast with conventional UO2fuel elements in which UO2pellets are disposed in a tube, the manufacturing process according to one or more embodiments of the present invention results in ceramic fuel being disposed in a solid matrix of non-fuel material (e.g., a zirconium matrix). As shown inFIG.4, the axial coiling pitch of the spiral ribs130is selected according to the condition of placing the axes of adjacent fuel elements10with a spacing equal to the width across corners in the cross section of a fuel element and may be 5% to 20% of the fuel element20length. According to one embodiment, the pitch (i.e., the axial length over which a lobe/rib makes a complete rotation) is about 21.5 cm, while the full active length of the element20is about 420 cm. As shown inFIG.3, stability of the vertical arrangement of the fuel elements10is provided: at the bottom—by the lower tie plate70; at the top—by the upper tie plate80; and relative to the height of the core—by the shroud30. As shown inFIG.1, the fuel elements10have a circumferential orientation such that the lobed profiles of any two adjacent fuel elements10have a common plane of symmetry which passes through the axes of the two adjacent fuel elements10in at least one cross section of the fuel element bundle. As shown inFIG.1, the helical twist of the fuel elements20in combination with their orientation ensures that there exists one or more self-spacing planes. As shown inFIG.1, in such self spacing planes, the ribs of adjacent elements20contact each other to ensure proper spacing between such elements20. Thus, the center-to-center spacing of elements20will be about the same as the corner-to-corner width of each element20(12.6 mm in the element illustrated inFIG.5). Depending on the number of lobes20bin each fuel element20and the relative geometrical arrangement of the fuel elements20, all adjacent fuel elements20or only a portion of the adjacent fuel elements20will contact each other. For example, in the illustrated four-lobed embodiment, each fuel element20contacts all four adjacent fuel elements20at each self-spacing plane. However, in a three-lobed fuel element embodiment in which the fuel elements are arranged in a hexagonal pattern, each fuel element will only contact three of the six adjacent fuel elements in a given self-spacing plane. The three-lobed fuel element will contact the other three adjacent fuel elements in the next axially-spaced self-spacing plane (i.e., ⅙ of a turn offset from the previous self-spacing plane). In an n-lobed element20in which n fuel elements are adjacent to a particular fuel element20, a self-spacing plane will exist every 1/n helical turn (e.g., every ¼ helical turn for a four-lobed element20arranged in a square pattern such that four other fuel elements20are adjacent to the fuel element20; every ⅓ helical turn for a three-lobed element in which three fuel elements are adjacent to the fuel element (i.e., every 120 degrees around the perimeter of the fuel element)). The pitch of the helix may be modified to create greater or fewer self-spacing planes over the axial length of the fuel elements20. According to one embodiment, each four-lobed fuel element20includes multiple twists such that there are multiple self-spacing planes over the axial length of the bundle of fuel elements20. In the illustrated embodiment, all of the elements20twist in the same direction. However, according to an alternative embodiment, adjacent elements20may twist in opposite directions without deviating from the scope of the present invention. The formula for the number of self-spacing planes along the fuel rod length is as follows: N=n*L/h, where: L—Fuel rod length n—Number of lobes (ribs) and the number of fuel elements adjacent to a fuel element h—Helical twist pitch The formula is slightly different if the number of lobes and the number of fuel elements adjacent to a fuel element are not the same. As a result of such self-spacing, the fuel assembly10may omit spacer grids that may otherwise have been necessary to assure proper element spacing along the length of the assembly10. By eliminating spacer grids, coolant may more freely flow through the assembly10, which advantageously increases the heat transfer from the elements20to the coolant. However, according to alternative embodiments of the present invention, the assembly10may include spacer grid(s) without deviating from the scope of the present invention. As shown inFIG.3, the shroud30forms a tubular shell that extends axially along the entire length of the fuel elements20and surrounds the elements20. However, according to an alternative embodiment of the present invention, the shroud30may comprise axially-spaced bands, each of which surrounds the fuel elements20. One or more such bands may be axially aligned with the self-spacing planes. Axially extending corner supports may extend between such axially spaced bands to support the bands, maintain the bands' alignment, and strengthen the assembly. Alternatively and/or additionally, holes may be cut into the otherwise tubular/polygonal shroud30in places where the shroud30is not needed or desired for support. Use of a full shroud30may facilitate greater control of the separate coolant flows through each individual fuel assembly10. Conversely, the use of bands or a shroud with holes may facilitate better coolant mixing between adjacent fuel assemblies10, which may advantageously reduce coolant temperature gradients between adjacent fuel assemblies10. As shown inFIG.1, the cross-sectional perimeter of the shroud30has a shape that accommodates the reactor in which the assembly10is used. In reactors such as the AP-1000 that utilize square fuel assemblies, the shroud has a square cross-section. However, the shroud30may alternatively take any suitable shape depending on the reactor in which it is used (e.g., a hexagonal shape for use in a VVER reactor (e.g., as shown in FIG. 1 of U.S. Patent Application Publication No. 2009/0252278 A1). The guide tubes40provide for the insertion of control absorber elements based on boron carbide (B4C), silver indium cadmium (Ag, In, Cd), dysprosium titanate (Dy2O3·TiO2) or other suitable alloys or materials used for reactivity control (not shown) and burnable absorber elements based on boron carbide, gadolinium oxide (Gd2O3) or other suitable materials (not shown) and are placed in the upper nozzle50with the capability of elastic axial displacement. The guide tubes40may comprise a zirconium alloy. For example, the guide tube40arrangement shown inFIG.1is in an arrangement used in the AP-1000 reactor (e.g., 24 guide tubes arranged in two annular rows at the positions shown in the 17×17 grid). The shape, size, and features of the frame25depend on the specific reactor core for which the assembly10is to be used. Thus, one of ordinary skill in the art would understand how to make appropriately shaped and sized frame for the fuel assembly10. For example, the frame25may be shaped and configured to fit into a reactor core of a conventional nuclear power plant in place of a conventional uranium oxide or mixed oxide fuel assembly for that plant's reactor core. The nuclear power plant may comprise a reactor core design that was in actual use before 2010 (e.g., 2, 3 or 4-loop PWRs; BWR-4). Alternatively, the nuclear power plant may be of an entirely new design that is specifically tailored for use with the fuel assembly10. As explained above, the illustrated fuel assembly10is designed for use in an AP-1000 or EPR reactor. The assembly includes a 17×17 array of fuel elements20,24of which are replaced with guide tubes40as explained above for a total of 265 fuel elements20in EPR or 264 fuel elements20in AP-1000 (in the AP-1000, in addition to the 24 fuel elements being replaced with the guide tubes, a central fuel element is also replaced with an instrumented tube). The elements20preferably provide 100% of the overall fissile material of the fuel assembly10. Alternatively, some of the fissile material of the assembly10may be provided via fuel elements other than the elements20(e.g., non-lobed fuel elements, uranium oxide elements, elements having fuel ratios and/or enrichments that differ from the elements20). According to various such alternative embodiments, the fuel elements20provide at least 50%, 60%, 70%, 75%, 80%, 85%, 90%, and/or 95% by volume of the overall fissile material of the fuel assembly10. Use of the metal fuel elements20according to one or more embodiments of the present invention facilitate various advantages over the uranium oxide or mixed oxide fuel conventionally used in light water nuclear reactors (LWR) (including boiling water reactors and pressurized water reactors) such as the Westinghouse-designed AP-1000, AREVA-designed EPR reactors, or GE-designed ABWR. For example, according to one or more embodiments, the power rating for an LWR operating on standard uranium oxide or mixed oxide fuel could be increased by up to about 30% by substituting the all-metal fuel elements20and/or fuel assembly10for standard uranium oxide fuel and fuel assemblies currently used in existing types of LWRs or new types of LWRs that have been proposed. One of the key constraints for increasing power rating of LWRs operating on standard uranium oxide fuel has been the small surface area of cylindrical fuel elements that such fuel utilizes. A cylindrical fuel element has the lowest surface area to volume ratio for any type of fuel element cross-section profile. Another major constraint for standard uranium oxide fuel has been a relatively low burnup that such fuel elements could possibly reach while still meeting acceptable fuel performance criteria. As a result, these factors associated with standard uranium oxide or mixed oxide fuel significantly limit the degree to which existing reactor power rating could be increased. One or more embodiments of the all-metal fuel elements20overcome the above limitations. For example, as explained above, the lack of spacer grids may reduce hydraulic resistance, and therefore increase coolant flow and heat flux from the elements20to the primary coolant. The helical twist of the fuel elements20may increase coolant intermixing and turbulence, which may also increase heat flux from the elements20to the coolant. Preliminary neutronic and thermal-hydraulic analyses have shown the following according to one or more embodiments of the present invention:The thermal power rating of an LWR reactor could be increased by up to 30.7% or more (e.g., the thermal power rating of an EPR reactor could be increased from 4.59 GWth to 6.0 GWth).With a uranium volume fraction of 25% in the uranium-zirconium mixture and uranium-235 enrichment of 19.7%, an EPR reactor core with a four-lobe metallic fuel element20configuration could operate for about 500-520 effective full power days (EFPDs) at the increased thermal power rating of 6.0 GWth if 72 fuel assemblies were replaced per batch (once every 18 months) or 540-560 EFPDs if 80 fuel assemblies were replaced per batch (once every 18 months).Due to the increased surface area in the multi-lobe fuel element, even at the increased power rating of 6.0 GWth, the average surface heat flux of the multi-lobe fuel element is shown to be 4-5% lower than that for cylindrical uranium oxide fuel elements operating at the thermal power rating of 4.59 GWth. This could provide an increased safety margin with respect to critical heat flux (e.g., increased departure from nucleate boiling margin in PWRs or maximum fraction limiting critical power ratio in BWRs). Further, this could allow a possibility of using 12 fuel elements per assembly with burnable poisons. Burnable poisons could be used to remove excess reactivity at the beginning of cycle or to increase the Doppler Effect during the heat-up of the core.Thus, the fuel assemblies10may provide greater thermal power output at a lower fuel operating temperature than conventional uranium oxide or mixed oxide fuel assemblies. To utilize the increased power output of the assembly10, conventional power plants could be upgraded (e.g., larger and/or additional coolant pumps, steam generators, heat exchangers, pressurizers, turbines). Indeed, according to one or more embodiments, the upgrade could provide 30-40% more electricity from an existing reactor. Such a possibility may avoid the need to build a complete second reactor. The modification cost may quickly pay for itself via increased electrical output. Alternatively, new power plants could be constructed to include adequate features to handle and utilize the higher thermal output of the assemblies10. Further, one or more embodiments of the present invention could allow an LWR to operate at the same power rating as with standard uranium oxide or mixed oxide fuel using existing reactor systems without any major reactor modifications. For example, according to one embodiment:An EPR would have the same power output as if conventional uranium-oxide fuel were used: 4.59 GWt;With a uranium volume fraction of 25% in the uranium-zirconium mixture and uranium-235 enrichment of approximately 15%, an EPR reactor core with a four-lobe metallic fuel element20configuration could operate for about 500-520 effective full power days (EFPDs) if 72 fuel assemblies were replaced per batch or 540-560 EFPDs if 80 fuel assemblies were replaced per batch.The average surface heat flux for the elements20is reduced by approximately 30% compared to that for cylindrical rods with conventional uranium oxide fuel (e.g., 39.94 v. 57.34 W/cm2). Because the temperature rise of the coolant through the assembly10(e.g., the difference between the inlet and outlet temperature) and the coolant flow rate through the assembly10remain approximately the same relative to conventional fuel assemblies, the reduced average surface heat flux results in a corresponding reduction in the fuel rod surface temperature that contributes to increased safety margins with respect to critical heat flux (e.g., increased departure from nucleate boiling margin in PWRs or maximum fraction limiting critical power ratio in BWRs). Additionally and/or alternatively, fuel assemblies10according to one or more embodiments of the present invention can be phased/laddered into a reactor core in place of conventional fuel assemblies. During the transition period, fuel assemblies10having comparable fissile/neutronic/thermal outputs as conventional fuel assemblies can gradually replace such conventional fuel assemblies over sequential fuel changes without changing the operating parameters of the power plant. Thus, fuel assemblies10can be retrofitted into an existing core that may be important during a transition period (i.e., start with a partial core with fuel assemblies10and gradually transition to a full core of fuel assemblies10). Moreover, the fissile loading of assemblies10can be tailored to the particular transition desired by a plant operator. For example, the fissile loading can be increased appropriately so as to increase the thermal output of the reactor by anywhere from 0% to 30% or more higher, relative to the use of conventional fuel assemblies that the assemblies10replace. Consequently, the power plant operator can chose the specific power uprate desired, based on the existing plant infrastructure or the capabilities of the power plant at various times during upgrades. One or more embodiments of the fuel assemblies10and fuel elements20may be used in fast reactors (as opposed to light water reactors) without deviating from the scope of the present invention. In fast reactors, the non-fuel metal of the fuel kernel100is preferably a refractory metal, for example a molybdenum alloy (e.g., pure molybdenum or a combination of molybdenum and other metals), and the cladding120is preferably stainless steel (which includes any alloy variation thereof) or other material suitable for use with coolant in such reactors (e.g., sodium). Such fuel elements20may be manufactured via the above-discussed co-extrusion process or may be manufactured by any other suitable method (e.g., vacuum melt). As shown inFIGS.7A,7B, and8, fuel assemblies510accordingly to one or more embodiments of the present invention may be used in a pressurized heavy water reactor500(seeFIG.8) such as a CANDU reactor. As shown inFIGS.7A and7B, the fuel assembly510comprises a plurality of fuel elements20mounted to a frame520. The frame520comprises two end plates520a,520bthat mount to opposite axial ends of the fuel elements20(e.g., via welding, interference fits, any of the various types of attachment methods described above for attaching the elements20to the lower tie plate70). The elements20used in the fuel assembly510are typically much shorter than the elements20used in the assembly10. According to various embodiments and reactors500, the elements20and assemblies510used in the reactor500may be about 18 inches long. The elements20may be positioned relative to each other in the assembly510so that self-spacing planes maintain spacing between the elements20in the manner described above with respect to the assembly10. Alternatively, the elements20of the assembly510may be so spaced from each other that adjacent elements20never touch each other, and instead rely entirely on the frame520to maintain element20spacing. Additionally, spacers may be attached to the elements20or their ribs at various positions along the axial length of the elements20to contact adjacent elements20and help maintain element spacing20(e.g., in a manner similar to how spacers are used on conventional fuel rods of conventional fuel assemblies for pressurized heavy water reactors to help maintain rod spacing). As shown inFIG.8, the assemblies510are fed into calandria tubes500aof the reactor500(sometimes referred to in the art as a calandria500). The reactor500uses heavy water500bas a moderator and primary coolant. The primary coolant500bcirculates horizontally through the tubes500aand then to a heat exchanger where heat is transferred to a secondary coolant loop that is typically used to generate electricity via turbines. Fuel assembly loading mechanisms (not shown) are used to load fuel assemblies510into one side of the calandria tubes500aand push spent assemblies510out of the opposite side of the tubes500a, typically while the reactor500is operating. The fuel assemblies510may be designed to be a direct substitute for conventional fuel assemblies (also known as fuel bundles in the art) for existing, conventional pressurized heavy water reactors (e.g., CANDU reactors). In such an embodiment, the assemblies510are fed into the reactor500in place of the conventional assemblies/bundles. Such fuel assemblies510may be designed to have neutronic/thermal properties similar to the conventional assemblies being replaced. Alternatively, the fuel assemblies510may be designed to provide a thermal power uprate. In such uprate embodiments, new or upgraded reactors500can be designed to accommodate the higher thermal output. According to various embodiments of the present invention, the fuel assembly10is designed to replace a conventional fuel assembly of a conventional nuclear reactor. For example, the fuel assembly10illustrated inFIG.1is specifically designed to replace a conventional fuel assembly that utilizes a 17×17 array of UO2fuel rods. If the guide tubes40of the assembly10are left in the exact same position as they would be for use with a conventional fuel assembly, and if all of the fuel elements20are the same size, then the pitch between fuel elements/rods remains unchanged between the conventional UO2fuel assembly and one or more embodiments of the fuel assembly10(e.g., 12.6 mm pitch). In other words, the longitudinal axes of the fuel elements20may be disposed in the same locations as the longitudinal axes of conventional UO2fuel rods would be in a comparable conventional fuel assembly. According to various embodiments, the fuel elements20may have a larger circumscribed diameter than the comparable UO2fuel rods (e.g., 12.6 mm as compared to an outer diameter of 9.5 mm for a typical UO2fuel rod). As a result, in the self-aligning plane illustrated inFIG.1, the cross-sectional length and width of the space occupied by the fuel elements20may be slightly larger than that occupied by conventional UO2fuel rods in a conventional fuel assembly (e.g., 214.2 mm for the fuel assembly10(i.e., 17 fuel elements 20×12.6 mm circumscribed diameter per fuel element), as opposed to 211.1 mm for a conventional UO2fuel assembly that includes a 17×17 array of 9.5 mm UO2fuel rods separated from each other by a 12.6 mm pitch). In conventional UO2fuel assemblies, a spacer grid surrounds the fuel rods, and increases the overall cross-sectional envelope of the conventional fuel assembly to 214 mm×214 mm. In the fuel assembly10, the shroud30similarly increases the cross-sectional envelope of the fuel assembly10. The shroud30may be any suitable thickness (e.g., 0.5 mm or 1.0 mm thick). In an embodiment that utilizes a 1.0 mm thick shroud30, the overall cross-sectional envelope of an embodiment of the fuel assembly10may be 216.2 mm×216.2 mm (e.g., the 214 mm occupied by the 17 12.6 mm diameter fuel elements20plus twice the 1.0 mm thickness of the shroud30). As a result, according to one or more embodiments of the present invention, the fuel assembly10may be slightly larger (e.g., 216.2 mm×216.2 mm) than a typical UO2fuel assembly (214 mm×214 mm). The larger size may impair the ability of the assembly10to properly fit into the fuel assembly positions of one or more conventional reactors, which were designed for use with conventional UO2fuel assemblies. To accommodate this size change, according to one or more embodiments of the present invention, a new reactor may be designed and built to accommodate the larger size of the fuel assemblies10. According to an alternative embodiment of the present invention, the circumscribed diameter of all of the fuel elements20may be reduced slightly so as to reduce the overall cross-sectional size of the fuel assembly10. For example, the circumscribed diameter of each fuel element20may be reduced by 0.13 mm to 12.47 mm, so that the overall cross-sectional space occupied by the fuel assembly10remains comparable to a conventional 214 mm by 214 mm fuel assembly (e.g., 17 12.47 mm diameter fuel elements20plus two 1.0 mm thickness of the shroud, which totals about 214 mm). Such a reduction in the size of the 17 by 17 array will slightly change the positions of the guide tubes40in the fuel assembly10relative to the guide tube positions in a conventional fuel assembly. To accommodate this slight position change in the tube40positions, the positions of the corresponding control rod array and control rod drive mechanisms in the reactor may be similarly shifted to accommodate the repositioned guide tubes40. Alternatively, if sufficient clearances and tolerances are provided for the control rods in a conventional reactor, conventionally positioned control rods may adequately fit into the slightly shifted tubes40of the fuel assembly10. Alternatively, the diameter of the peripheral fuel elements20may be reduced slightly so that the overall assembly10fits into a conventional reactor designed for conventional fuel assemblies. For example, the circumscribed diameter of the outer row of fuel elements20may be reduced by 1.1 mm such that the total size of the fuel assembly is 214 mm×214 mm (e.g., 15 12.6 mm fuel elements20plus 2 11.5 mm fuel elements20plus 2 1.0 mm thicknesses of the shroud30). Alternatively, the circumscribed diameter of the outer two rows of fuel elements20may be reduced by 0.55 mm each such that the total size of the fuel assembly remains 214 mm×214 mm (e.g., 13 12.6 mm fuel elements20plus 4 12.05 mm fuel assemblies plus 2 1.0 mm thicknesses of the shroud30). In each embodiment, the pitch and position of the central 13×13 array of fuel elements20and guide tubes40remains unaltered such that the guide tubes40align with the control rod array and control rod drive mechanisms in a conventional reactor. FIG.10illustrates a fuel assembly610according to an alternative embodiment of the present invention. According to various embodiments, the fuel assembly610is designed to replace a conventional UO2fuel assembly in a conventional reactor while maintaining the control rod positioning of reactors designed for use with various conventional UO2fuel assemblies. The fuel assembly610is generally similar to the fuel assembly10, which is described above and illustrated inFIG.1, but includes several differences that help the assembly610to better fit into one or more existing reactor types (e.g., reactors using Westinghouse's fuel assembly design that utilizes a 17 by 17 array of UO2rods) without modifying the control rod positions or control rod drive mechanisms. As shown inFIG.10, the fuel assembly includes a 17 by 17 array of spaces. The central 15 by 15 array is occupied by 200 fuel elements20and25guide tubes40, as described above with respect to the similar fuel assembly10illustrated inFIG.1. Depending on the specific reactor design, the central guide tube40may be replaced by an additional fuel element20if the reactor design does not utilize a central tube40(i.e., 201 fuel elements20and24guide tubes40). The guide tube40positions correspond to the guide tube positions used in reactors designed to use conventional UO2fuel assemblies. The peripheral positions (i.e., the positions disposed laterally outward from the fuel elements20) of the 17 by 17 array/pattern of the fuel assembly610are occupied by 64 UO2fuel elements/rods650. As is known in the art, the fuel rods650may comprise standard UO2pelletized fuel disposed in a hollow rod. The UO2pelletized fuel may be enriched with U-235 by less than 20%, less than 15%, less than 10%, and/or less than 5%. The rods650may have a slightly smaller diameter (e.g., 9.50 mm) than the circumscribed diameter of the fuel elements20, which slightly reduces the overall cross-sectional dimensions of the fuel assembly610so that the assembly610better fits into the space allocated for a conventional UO2fuel assembly. In the illustrated embodiment, the fuel rods/elements650comprise UO2pelletized fuel. However, the fuel rods/elements650may alternatively utilize any other suitable combination of one or more fissile and/or fertile materials (e.g., thorium, plutonium, uranium-235, uranium-233, any combinations thereof). Such fuel rods/elements650may comprise metal and/or oxide fuel. According to one or more alternative embodiments, the fuel rods650may occupy less than all of the 64 peripheral positions. For example, the fuel rods650may occupy the top row and left column of the periphery, while the bottom row and right column of the periphery may be occupied by fuel elements20. Alternatively, the fuel rods650may occupy any other two sides of the periphery of the fuel assembly. The shroud630may be modified so as to enclose the additional fuel elements20in the periphery of the fuel assembly. Such modified fuel assemblies may be positioned adjacent each other such that a row/column of peripheral fuel elements650in one assembly is always adjacent to a row/column of fuel elements20in the adjacent fuel assembly. As a result, additional space for the fuel assemblies is provided by the fact that the interface between adjacent assemblies is shifted slightly toward the assembly that includes fuel elements650in the peripheral, interface side. Such a modification may provide for the use of a greater number of higher heat output fuel elements20than is provided by the fuel assemblies610. A shroud630surrounds the array of fuel elements20and separates the elements20from the elements650. The nozzles50,60, shroud630, coolant passages formed therebetween, relative pressure drops through the elements20and elements650, and/or the increased pressure drop through the spacer grid660(discussed below) surrounding the elements650may result in a higher coolant flow rate within the shroud630and past the higher heat output fuel elements20than the flow rate outside of the shroud630and past the relatively lower heat output fuel rods650. The passageways and/or orifices therein may be designed to optimize the relative coolant flow rates past the elements20,650based on their respective heat outputs and designed operating temperatures. According to various embodiments, the moderator:fuel ratio for the fuel elements20of the fuel assembly610is less than or equal to 2.7, 2.6, 2.5, 2.4, 2.3, 2.2, 2.1, 2.0, 1.9, and/or 1.8. In the illustrated embodiment, the moderator:fuel ratio equals a ratio of (1) the total area within the shroud630available for coolant/moderator (e.g., approximated by the total cross-sectional area within the shroud630minus the total cross-sectional area taken up by the fuel elements20(assuming the guide tubes40are filled with coolant)) to (2) the total cross-sectional area of the kernels100of the fuel elements20within the shroud630. According to an alternative embodiment of the invention, the shroud630may be replaced with one or more annular bands or may be provided with holes in the shroud630, as explained above. The use of bands or holes in the shroud630may facilitate cross-mixing of coolant between the fuel elements20and the fuel elements650. As shown inFIG.10, the fuel elements650are disposed within an annular spacer grid660that is generally comparable to the outer part of a spacer grid used in a conventional UO2fuel assembly. The spacer grid660may rigidly connect to the shroud630(e.g., via welds, bolts, screws, or other fasteners). The spacer grid660is preferably sized so as to provide the same pitch between the fuel elements650and the fuel elements20as is provided between the central fuel elements20(e.g., 12.6 mm pitch between axes of all fuel elements20,650). To provide such spacing, the fuel elements650may be disposed closer to the outer side of the spacer grid660than to the shroud630and inner side of the spacer grid660. The fuel assembly610and spacer grid660are also preferably sized and positioned such that the same pitch is provided between fuel elements650of adjacent fuel assemblies (e.g., 12.6 mm pitch). However, the spacing between any of the fuel elements20,650may vary relative to the spacing between other fuel elements20,650without deviating from the scope of the present invention. According to various embodiments, the fuel elements20provide at least 60%, 65%, 70%, 75%, and/or 80% of a total volume of all fissile-material-containing fuel elements20,650of the fuel assembly610. For example, according to one or more embodiments in which the fuel assembly610includes 201 fuel elements20, each having a cross-sectional area of about 70 mm2, and 64 fuel elements650, each having a 9.5 mm diameter, the fuel elements20provide about 75.6% of a total volume of all fuel elements20,650(201 fuel elements 20×70 mm2equals 14070 mm2; 64 fuel elements 650×π×(9.5/2)2=4534 mm2; fuel element20,650areas are essentially proportional to fuel element volumes; (14070 mm2/(14070 mm2+4534 mm2)=75.6%)). The height of the fuel assembly610matches a height of a comparable conventional fuel assembly that the assembly610can replace (e.g., the height of a standard fuel assembly for a Westinghouse or AREVA reactor design). The illustrated fuel assembly610may be used in a 17×17 PWR such as the Westinghouse 4-loop design, AP1000, or AREVA EPR. However, the design of the fuel assembly610may also be modified to accommodate a variety of other reactor designs (e.g., reactor designs that utilize a hexagonal fuel assembly, in which case the outer periphery of the hexagon is occupied by UO2rods, while the inner positions are occupied by fuel elements20, or boiling water reactors, or small modular reactors). While particular dimensions are described with regard to particular embodiments, a variety of alternatively dimensioned fuel elements20,650and fuel assemblies10may be used in connection with a variety of reactors or reactor types without deviating from the scope of the present invention. Depending on the specific reactor design, additional rod positions of a fuel assembly may be replaced with UO2rods. For example, while the fuel assembly610includes UO2rods only in the outer peripheral row, the assembly610could alternatively include UO2rods in the outer two rows without deviating from the scope of the present invention. According to various embodiments, the portion of the fuel assembly610that supports the fuel elements650is inseparable from the portion of the fuel assembly610that supports the fuel elements20. According to various embodiments, the fuel elements20are not separable as a unit from the fuel elements650of the fuel assembly610(even though individual fuel elements20,650may be removed from the assembly610, for example, based on individual fuel element failure). Similarly, there is not a locking mechanism that selectively locks the fuel element650portion of the fuel assembly to the fuel element20portion of the fuel assembly610. According to various embodiments, the fuel elements20and fuel elements650of the fuel assembly610have the same designed life cycle, such that the entire fuel assembly610is used within the reactor, and then removed as a single spent unit. According to various embodiments, the increased heat output of the fuel elements20within the fuel assembly610can provide a power uprate relative to the conventional all UO2fuel rod assembly that the assembly610replaces. According to various embodiments, the power uprate is at least 5%, 10%, and/or 15%. The uprate may be between 1 and 30%, 5 and 25%, and/or 10 and 20% according to various embodiments. According to various embodiments, the fuel assembly610provides at least an 18-month fuel cycle, but may also facilitate moving to a 24+ or 36+ month fuel cycle. According to an embodiment of the fuel assembly610, which uses fuel elements20having the example parameters discussed above with respect to the element20shown inFIG.10, the assembly17provides a 17% uprate relative to a conventional UO2fuel assembly under the operating parameters identified in the below tables. Operating Parameter for AREVA EPR ReactorValueUnitReactor power5.37GWtFuel cycle length18monthsReload batch size1/3coreEnrichment of Fuel Element 20<19.7w/oEnrichment of UO2of the Rods 650<5w/oCoolant flow rate117%rv* rv = reference value Fuel Assembly ParameterValueUnitFuel assembly design17 × 17Fuel assembly pitch215mmFuel assembly envelope214mmActive fuel height4200mmNumber of fuel rods265Fuel element 20 pitch (i.e., axis to axis spacing)12.6mmAverage outer fuel element 20 diameter12.6mm(circumscribed diameter)Average minimum fuel element 20 diameter10.44mmModerator to fuel ratio, seed region (around2.36elements 20)Moderator to fuel ratio, blanket (around the fuel1.9rods 650) The fuel assemblies10,510,610are preferably thermodynamically designed for and physically shaped for use in a land-based nuclear power reactor90,500(e.g., land-based LWRS (including BWRs and PWRs), land-based fast reactors, land-based heavy water reactors) that is designed to generate electricity and/or heat that is used for a purpose other than electricity (e.g., desalinization, chemical processing, steam generation, etc.). Such land-based nuclear power reactors90include, among others, VVER, AP-1000, EPR, APR-1400, ABWR, BWR-6, CANDU, BN-600, BN-800, Toshiba 4S, Monju, etc. However, according to alternative embodiments of the present invention, the fuel assemblies10,510,610may be designed for use in and used in marine-based nuclear reactors (e.g., ship or submarine power plants; floating power plants designed to generate power (e.g., electricity) for onshore use) or other nuclear reactor applications. The foregoing illustrated embodiments are provided to illustrate the structural and functional principles of the present invention and are not intended to be limiting. To the contrary, the principles of the present invention are intended to encompass any and all changes, alterations and/or substitutions within the spirit and scope of the following claims. | 62,433 |
11862354 | DETAILED DESCRIPTION The passive reactivity control device incorporates a reservoir of a molten salt containing a strong neutron absorber from the lanthanide family or hafnium in the form of a fluoride or chloride salt mixed with a monovalent salt to form a low melting point eutectic mixture. Lanthanides do not generate significant tritium or helium on irradiation. They are however high melting point metals so cannot simply replace the well known lithium in the reactivity control device. Conversion to fluoride or chloride salt and formation of a eutectic salt mixture with a monovalent metal halide reduces the melting point to a useable level. The device resembles a mercury thermometer. The reservoir, or thermometer bulb, is located in the hot outlet coolant (or coolant combined with fuel) salt and the narrow tube, or thermometer stem, runs into the reactor core. The stem contains an inert gas (ie a gas that does not react significantly with the molten salt) which is compressed as the neutron absorbing salt expands down the stem and the pressure of that gas returns the neutron absorbing salt to the bulb on cooling of the reservoir. Particularly useful lanthanides for use in a thermal spectrum reactor are Gadolinium, Europium, Samarium which each have neutron absorbance cross sections of several thousand barns. However other less strongly absorbing lanthanides such as Dysprosium, Erbium or Hafnium can also be used and mixtures of multiple lanthanides can also be used which can be advantageous if it is desired to reduce the neutron absorption of the salt so that it is “grey” rather than “black” to neutrons. For fast reactors the most effective lanthanides are Europium and Hafnium but again, mixtures of less strongly absorbing lanthanides can have utility. There are two possible approaches to avoid breaking of the molten salt fluid column during expansion and contraction. In the first approach, the reservoir is located below the tube, and the tube is oriented generally upwards (i.e. such that the column will be maintained by gravity, and the molten salt expands upwards). In the second approach, the tube is sufficiently narrow for the molten salt fluid column to remain intact when inverted—the radius required will depend on the contact angle between the molten salt fluid and the inside surface of the tube. In the first case, the tube can have any desired width. In the second case, the tube can have any desired orientation. In either case, for the molten salt fluid column to remain intact during expansion and contraction, it is desirable that the surface of the stem containing it has a large contact angle with the molten salt fluid, and in particular that the surface is not wetted by the fluid. Where wetting of a metal surface is a problem, this can be improved by depositing a coating on the wetted surface of a material with which the molten salt has a high contact angle. Pyrolytic carbon is one such suitable coating. Example 1 A nuclear reactor core is formed from a series of molybdenum tubes containing a mixture of uranium fluoride and sodium fluoride. The uranium is enriched in U235 isotope. The tubes are located in channels in graphite blocks and a coolant liquid passes upwards through the channel between the graphite and the tube. FIG.1shows an array of passive reactivity devices100in a graphite moderated liquid molten salt fuelled reactor core. The reservoir101of the passive reactivity device is located above the level of the fuel salt110in the tube as shown inFIG.1. The stem102of the device projects down through the annulus between the graphite120and the tube and terminates at the bottom of the fuel tube.FIG.2shows the location of the neutron absorbing fluid103in the bulb101and stem102at different coolant output temperatures T1<T2<T3. The remainder of each passive reactivity device contains a gas104which does not react with the neutron absorbing fluid. On the left is with the device at a temperature below normal reactor operating temperature, central is the device at normal operating temperature and right is above normal operating temperature. Example 2 A nuclear reactor core is formed from a series of molybdenum tubes containing a mixture of uranium fluoride and sodium fluoride. The uranium is enriched in U235 isotope. The tubes are located in channels in graphite blocks and a coolant liquid passes downwards through the channel between the graphite and the tube. FIG.3shows an arrangement in which the bulbs301of the passive reactor control devices are located below the fuel tubes, i.e. below the fuel salt310, and the stems302extend up between the graphite moderators320and the fuel salt310. | 4,690 |
11862355 | DETAILED DESCRIPTION Hereinafter, specific embodiments for realizing the spirit of the present disclosure will be described in detail with reference to the accompanying drawings. In describing the embodiments of the present disclosure, the detailed descriptions of well-known functions or configurations will be omitted if it is determined that the detailed descriptions of well-known functions or configurations may unnecessarily make obscure the spirit of the present disclosure. Specific terms in the present disclosure are used simply to describe specific embodiments without limiting the present disclosure. An expression used in the singular encompasses the expression of the plural, unless it has a clearly different meaning in the context. Hereinafter, a method of removing a nuclear power plant activation structure according to an embodiment of the present disclosure will be described with reference to the drawings. Referring toFIGS.1to4, the method of removing a nuclear power plant activation structure according to the embodiment of the present disclosure is a method provided to remove a nuclear power plant activation structure2buried in a nuclear reactor1before dismantling the nuclear reactor1, and may include a step S100of flattening at least a portion of a wall surface of a peripheral portion1bof a wall of a nuclear reactor1including a buried portion1ain which a nuclear power plant activation structure2is buried and the peripheral portion1bcircumferentially surrounding the buried portion1a, a step S200of installing drilling devices3and4in the flattened peripheral portion1bto perform a drilling operation, a step S300of extracting the nuclear power plant activation structure2from the buried portion1a, and a step S400of cutting the extracted nuclear power plant activation structure2and then storing the cut nuclear power plant activation structure in a shielding container. Hereinafter, a method of removing the nuclear power plant activation structure2according to an embodiment of the present disclosure will be described for each step. (Step S100of Flattening at Least a Portion of Peripheral Portion1b) At least a portion of the wall surface of the peripheral portion1bof the wall of the nuclear reactor1is filled with mortar so that the drilling devices3and4which perform the operation on the wall surface of the reactor1can be stably installed on the wall surface of the nuclear reactor1. In this process, since an outer surface of the peripheral portion1bis flattened, the drilling devices3and4can be firmly installed on the flattened outer surface of the peripheral portion1b, and thus, the drilling operation can be performed on the peripheral portion1bwithout shaking. (Step S200of Installing Drilling Devices3and4in the Peripheral Portion1bHaving the Flattened Outer Surface to Perform Drilling Operation) First, a scattering prevention unit, for example, a temporary storage tent, is installed on the outer surface of the peripheral portion1bso as to surround the drilling devices3and4. Accordingly, scattering of dust, sludge, or the like generated in the subsequent drilling operation is prevented by the scattering prevention unit. Meanwhile, the step S200of installing the drilling devices3and4in the peripheral portion1bhaving the flattened outer surface to perform the drilling operation includes a step S210of performing a first drilling operation using a first drilling device3, and a step S220of performing a second drilling operation using a second drilling device4. Referring to the step S210of performing the first drilling operation, when the installation of the scattering prevention unit with respect to the peripheral portion1bis completed, an initial drilling position at which the peripheral portion1bshould be drilled is set to extract the nuclear power plant activation structure2from the buried portion1a. In other words, in order to smoothly extract the nuclear power plant activation structure2from the buried portion1a, the peripheral portion1bis drilled through the first drilling device3and the second drilling device4to weaken the structural strength. To this end, the first drilling device3is installed in the peripheral portion1bso that the first drilling device3is in a parallel relationship with the nuclear power plant activation structure2based on an angle at which the nuclear power plant activation structure2is buried in the buried portion1a. In this case, the first drilling operation includes a dry drilling operation, and the first drilling device3may be a dry drilling device, for example, a dry core drill. Next, the reason why the first drilling operation is performed as the dry drilling operation will be described briefly. When the first drilling operation with respect to the peripheral portion1bis performed as a wet drilling operation in which a cooling medium for cooling frictional heat generated between a first core bit3amounted on the first drilling device3and the peripheral portion1bis used in the drilling operation, since the peripheral portion1bis formed of concrete, the surroundings are contaminated by sludge generated by mixing dust generated during the drilling process and cooling medium such as cooling water and concrete. Meanwhile, the first drilling device3on which the first core bit3ais mounted is driven until the peripheral portion1bis drilled to a predetermined first drilling thickness, for example, a depth of about 50 mm. In this case, an end portion facing the outer surface of the peripheral portion1bamong both end portions of the first core bit3ahas a first protrusion3a′ protruding along the circumferential direction of the first core bit3a. Accordingly, as an example, the peripheral portion1bcorresponding to a radially outer side of the nuclear power plant activation structure2may be drilled in a donut shape. In the present embodiment, a case in which the first drilling thickness of the first drilling device3with respect to the peripheral portion1bis set to about 50 mm in advance is described as an example. However, this is only an example, and thus, a spirit of the present disclosure is not limited thereto. If necessary, the first drilling thickness of the first drilling device3with respect to the peripheral portion1bis not set in advance, but the first drilling thickness of the first drilling device3with respect to the peripheral portion1bcan be flexibly changed depending on a degree to which the nuclear power plant activation structure2is buried in the buried portion1a, a situation of the first drilling operation, or the like. Next, the step of performing the second drilling operation S220will be described, the second drilling operation is performed on the first drilled peripheral portion1busing the second drilling device4. In this case, the second drilling device4is installed in the peripheral portion1bso that the second drilling device3is installed in a parallel relationship with the nuclear power plant activation structure2based on the angle at which the nuclear power plant activation structure2is buried in the buried portion1a. In this case, the second drilling operation is a substantial drilling operation in which the peripheral portion1bcorresponding to the radial outer side of the nuclear power plant activation structure2is drilled to smoothly extract the nuclear power plant activation structure2from the buried portion1a, and a depth of the peripheral portion1bdrilled in the second drilling operation may be deeper than that of the peripheral portion1bdrilled in the first drilling operation. When the second drilling operation is performed, a second core bit4ais mounted on the second drilling device4. In this case, a length “b” of the second core bit4amounted on the second drilling device4may be longer than a length “a” of the first core bit3amounted on the first drilling device3in the second step S200. For example, the second core bit4amounted on the second drilling device4may have the length “b” corresponding to the length of the nuclear power plant activation structure2buried in the buried portion1a. In this case, the second drilling device4on which the second core bit4ais mounted is driven until the peripheral portion1bis drilled to a predetermined thickness. At this time, an end portion of both end portions of the second core bit4afacing the outer surface of the peripheral portion1bhas a second protrusion4a′ protruding along the circumferential direction of the second core bit4a. Accordingly, as an example, the peripheral portion1bcorresponding to the radially outer side of the nuclear power plant activation structure2may be drilled in a donut shape. Meanwhile, an operator checks an insertion state of the second core bit4ainserted in the peripheral portion1bin real time, and then, predicts in real time a position of an expected buried structure, for example, a reinforcing bar, a pipe, an H beam support, or the like according to the depth drilled through the second core bit4a. Moreover, the operator performs the second drilling while checking in real time a jamming of the second core bit4a, loosening and jamming of sludge, smooth supply of the cooling medium, or the like. The second drilling operation includes a wet drilling operation, and the second drilling device4may be a wet drilling device using a cooling medium, for example a wet core drill. Meanwhile, in the second drilling operation by the second drilling device4, the cooling medium, e.g., cooling water is provided to cool the frictional heat generated by the friction between the second core bit4aof the second drilling device4and the peripheral portion1b. The cooling medium is mixed with concrete or the like to generate sludge or dust which may contaminate surroundings. In view of above, in the embodiment of the present disclosure, the cooling medium used for a second drilling operation, e.g., the cooling water, is collected, and dust or sludge is separated from the collected cooling medium. Moreover, the cooling medium from which the dust or sludge is separated is purified, and thus, can be reused as the cooling medium of the second drilling device4. More specifically, the cooling medium used in the second drilling operation is collected by a cooling medium collection unit5installed in close contact with the peripheral portion1bso as to surround the second core bit4aof the second drilling device4from the outside (step S221). Subsequently, the cooling medium collected through a drain hole (not shown) provided at a lower end of the cooling medium collection unit5is drained from the cooling medium collection unit5and transferred to a first water collecting tank6(step S222). Next, while the cooling medium transferred to the first water collecting tank6stays in the first water collecting tank6for a predetermined time, the dust or sludge contained in the cooling medium is deposited in a lower portion of the first water collecting tank6and at least a portion of the dust or sludge contained in the cooling medium may be separated from the cooling medium (step S223). Moreover, the cooling medium from which at least a portion of the dust or sludge contained in the cooling medium is removed is transferred to a second water collecting tank7(step S224). While the cooling medium transferred to the second water collecting tank7stays in the second water collecting tank7for a predetermined time, the dust or sludge remaining in the cooling medium can be separated from the cooling medium (step S225). Next, after purifying the cooling medium from which the dust or sludge is separated (step S226), the purified cooling medium is pumped by a pump8and transferred to the cooling medium storage tank9. Moreover, if necessary, the cooling medium can be resupplied and reused as the cooling medium of the second drilling device4(step S227). In this case, a flow rate of the cooling medium storage tank9in which the cooling medium to be supplied to the second drilling device4is stored is checked in real time to determine whether or not the cooling medium is smoothly supplied to the peripheral portion1bduring the second drilling operation. Moreover, color and temperature of the cooling medium collected in the first water collection tank6and the second collection tank7are checked in real time to determine whether or not the drilling operation is well performed by the second drilling device4without problems. Meanwhile, if coal tar inside a liner of the nuclear reactor1is extracted during the second drilling operation, the drilling operation is immediately stopped, and a worktable for displacing the nuclear power plant activation structure (2) to be subsequently extracted from the buried portion1ais installed. In this case, a shielding facility such as lead glass is installed and a cutting device such as a band saw and a band saw device is installed in a direction in which the nuclear power plant activation structure2is extracted from the nuclear reactor1. In addition, a shielding container for accommodating the cut nuclear power plant activation structure2is located inside the shielding facility. (Step S300of Extracting Nuclear Power Plant Activation Structure2from Buried Portion1a) When the shielding container for accommodating the nuclear power plant activation structure2is located inside the shielding facility, the nuclear power plant activation structure2can be extracted from the buried portion1athrough the holes formed in the peripheral portion1bthrough the primary and second drilling. When the extraction of the nuclear power plant activation structure2from the buried portion1ais completed, the nuclear power plant activation structure2extracted from the buried portion1ais placed on the worktable and fixed to the worktable. Next, before the nuclear power plant activation structure2is cut, the concrete remaining around the nuclear power plant activation structure2is broken and removed by a breaker. (Step S400of Cutting Extracted Nuclear Power Plant Activation Structure2and Storing Nuclear Power Plant Activation Structure2in Shielded Container) In both end portions of the extracted nuclear power plant activation structure2, an end portion having a relatively large degree of radiation, that is, an end portion buried inside the nuclear reactor1, is cut using a cutting device. When the cutting of the nuclear power plant activation structure2is completed, the cut nuclear power plant activation structure2is remotely controlled and accommodated in the shielding container, and the shielding container is closed. According to the method of removing the nuclear power plant activation structure according to the present embodiment as described above, it is possible to easily dismantle the nuclear power plant activation structure from the nuclear reactor, and thus, it is possible to reduce a dismantling period and a dismantling cost. Hereinbefore, the embodiment of the present disclosure is described as a specific embodiment. However, this is only an example, and the present disclosure is not limited thereto and should be construed as having the widest scope according to a basic idea disclosed in the present specification. A person skilled in the art may combine/substitute the disclosed embodiments to implement a pattern of a shape that is not indicated, but this also does not depart from the scope of the present disclosure. In addition, a person skilled in the art can easily change or modify the disclosed embodiment based on the present specification, and it is clear that the changes or modifications also belong to the scope of the present disclosure. | 15,630 |
11862356 | DETAILED DESCRIPTION Segmented Reaction Chamber Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms “mounted,” “connected,” “supported,” and “coupled” and variations thereof are used broadly and encompass direct and indirect mountings, connections, supports, and couplings. Further, “connected” and “coupled” are not restricted to physical or mechanical connections or couplings. Before explaining at least one embodiment, it is to be understood that the invention is not limited in its application to the details set forth in the following description as exemplified by the Examples. Such description and Examples are not intended to limit the scope of the invention as set forth in the appended claims. The invention is capable of other embodiments or of being practiced or carried out in various ways. Throughout this disclosure, various aspects of this invention may be presented in a range format. It should be understood that the description in range format is merely for convenience and brevity, and should not be construed as an inflexible limitation on the scope of the invention. Accordingly, as will be understood by one skilled in the art, for any and all purposes, particularly in terms of providing a written description, all ranges disclosed herein also encompass any and all possible subranges and combinations of subranges thereof, as well as all integral and fractional numerical values within that range. As only one example, a range of 20% to 40% can be broken down into ranges of 20% to 32.5% and 32.5% to 40%, 20% to 27.5% and 27.5% to 40%, etc. Any listed range can be easily recognized as sufficiently describing and enabling the same range being broken down into at least equal halves, thirds, quarters, fifths, tenths, etc. As a non-limiting example, each range discussed herein can be readily broken down into a lower third, middle third, and upper third, etc. Further, as will also be understood by one skilled in the art, all language such as “up to,” “at least,” “greater than,” “less than,” “more than” and the like include the number recited and refer to ranges which can be subsequently broken down into subranges as discussed above. In the same manner, all ratios disclosed herein also include all subratios falling within the broader ratio. These are only examples of what is specifically intended. Further, the phrases “ranging/ranges between” a first indicate number and a second indicate number and “ranging/ranges from” a first indicate number “to” a second indicate number are used herein interchangeably. Terms such as “substantially,” “about,” “approximately” and the like are used herein to describe features and characteristics that can deviate from an ideal or described condition without having a significant impact on the performance of the device. For example, “substantially parallel” could be used to describe features that are desirably parallel but that could deviate by an angle of up to 20 degrees so long as the deviation does not have a significant adverse effect on the device. Similarly, “substantially linear” could include a slightly curved path or a path that winds slightly so long as the deviation from linearity does not significantly adversely effect the performance of the device. Provided is a segmented reaction chamber for a reactor operable to produce an isotope. The reactor may comprise a region for containing a controlled nuclear fission reaction, the region segmented into a plurality of independent compartments. Each of the compartments may contain a parent material in an aqueous solution. The parent material may interact with neutrons to produce an isotope via a fission reaction. The isotope produced may comprise at least one of the isotopes including, but not limited to, Mo-99, I-131, I-125, Xe-133, Cs-137, Co-60, Y-90, Sr-90, and Sr-89. In certain embodiments, a reaction chamber405comprises an activation cell410that may be segmented, forming a segmented activation cell600, as shown inFIGS.32-35. It is envisioned that the principles of a segmented approach for a subcritical reactor for isotope production is also applicable to any aqueous reactor system. In certain embodiments, the invention provides an aqueous reaction chamber (ARC), filled with an aqueous solution, such as one found in a critical or subcritical aqueous isotope production system. The activation cell may be segmented into multiple pieces or a plurality of compartments by dividers605. The segmented activation cell600may be divided or segmented into n independent compartments by dividers605. The independent compartments n may be any integer from 2 to 10, from 3 to 8, or from 4 to 6. The compartments may be assembled or positioned proximate to the target chamber in any suitable orientation. For example, the compartments may be radially symmetrically disposed about a central axis of the activation cell. In certain embodiments, the compartments may be disposed linearly along a central axis, disposed concentrically about a central axis, or disposed radially asymmetrically about a central axis of the activation cell. The compartments of the activation cell may independently contain a parent material for interacting with the protons or neutrons generated in the target chamber to produce an isotope. 1-3 solution extraction/fill lines610may connect each chamber to an exterior reservoir (not shown) to transport parent material and isotope. A plurality of water cooling pipes615may flow fluid to supply a cooling jacket620proximal to or surrounding the segmented activation cell600. A lid625may cap the segmented activation cell600to retain the fluid materials within. A segmented activation cell may allow for the extraction of isotopes at different periods of time. Separations in the reaction region may also be used to control instabilities that might develop in the solution. In some embodiments, the parent material in at least one compartment may be reacted over a time period y with at least a portion of the neutrons or protons generated in the target chamber. The time period y may be about the half life of the isotope produced. For example, the half life of Mo-99 is about 66 h. As such, the time period y may be about 60 h to about 70 h. The time period y may be at least about at least about 12 h, at least about 18 h, 24 h, at least about 36 h, at least about 48 h, at least about 72 h, or at least about 96 h. The time period y may be less than about 2 weeks, less than about 1.5 weeks, less than about 1 week, less than about 5 days, less than about 100 h, less than about 96 h, less than about 72 h, or less than about 48 h. The time period y may be about 12 h to about 2 weeks, about 24 h to about 1 week, about 36 h to about 96 h, or about 48 h to about 80 h. Existing systems describing the production of medical isotopes in ARCs may utilize a single volume to contain the aqueous solution. In such systems, the ARC may be operated from periods of minutes to months to produce various isotopes. When the device has operated for sufficient time to produce the desired quantity of an isotope, the fluid may be drained and the isotope separated. Suitably, optimal production will have occurred after a period of time equal to approximately one half-life of the material being created. Many markets for radioisotopes require a continuous supply of material; oversupply may not be sold and undersupply may result in lost revenue. If an oversupply is generated early in a period of time and cannot be sold, it may decay away in storage. In order to supply constant market demand, an excess of material may be produced early in the cycle, so that there may be ample supply while waiting for the next batch. FIG.30illustrates the decay of a particularly useful isotope, Mo-99 as created in a 5 day batch process. The dashed line represents hypothetical demand (x-axis reads days, y axis reads supply units). In this system, it may take 5 days to produce 10 units of Mo-99. Once the isotope is extracted, irradiation may start on the next 5 day batch. This may result in a tremendous variation in the amount of material available. Due to requirements for high purity isotopes, the ARC may irradiate its solution to near saturation, so shorter batches may not be performed to distribute the production of isotopes over time. In other embodiments, the ARC may be cut into physically different sections within the same device. If a device has x regions in it, the entire system could be irradiated to saturation (which occurs at time y), and then one cell may have its isotopes extracted after a period of time proportional to the saturation time. Then, every period of time that passes equal to y/x, another cell may have its isotopes extracted. As soon as isotope extraction is performed on any given cell, the irradiation process on that cell may begin anew. As such, each cell may always be irradiated to nearly saturation before it is empty. Again, considering the case of Mo-99, it may be desirable to have approximately a 5 day irradiation period. In this case, the ARC may be split into 5 cells. Every day in the 5 day period, 2 units of Mo-99 may be extracted. This may lead to a more uniform supply of the radioisotope, as shown inFIG.31.FIG.31shows the amount of Mo-99 available during a 5 day batch process with a segmented reaction chamber in arbitrary units. The dashed line represents hypothetical demand (x-axis reads days, y axis reads supply units). InFIG.30, shown is the hypothetical ARC described may create an oversupply early in the 5 day period, and may not be able to meet demand later. As shown inFIG.31, the same ARC, segmented into 5 pieces, may continuously meet demand, which may result in less wasted product and eliminate the shortage previously experienced. A similar effect may be created by producing multiple smaller units, but there may be significantly greater expense involved in doing so. The segmented design may offer almost no additional cost, but may improve performance dramatically. In addition to the utility for smoothing supply to meet demand, the segmented aqueous system may serve to disrupt instabilities that may arise in critical or near critical aqueous systems. These instabilities may lead to control problems that may result in a failure to properly operate. Previous experiments with critical aqueous reactors resulted in instabilities that led to control problems as well as destructive behaviors that caused radiological spills. These instabilities were the result of the solution moving around in unpredictable ways, in some cases forming vortices in the solution. The addition of segmentation to the reaction chamber may minimize the extent to which these instabilities can propagate, which may greatly increase the controllability of the reaction chamber. A segmented reaction chamber may be used with any suitable critical or subcritical fission reactor with an aqueous reaction chamber. For example, a segmented reaction chamber may be used with a hybrid reactor described below. Example of a Hybrid Reactor for Production of Isotopes FIG.22illustrates an arrangement of a hybrid reactor5athat is well suited to the production of medical isotopes. Before proceeding, the term “hybrid reactor” as used herein is meant to describe a reactor that includes a fusion portion and a fission portion. In particular, the illustrated reactor5ais well suited to the production of Mo-99 from Mo-98 or from a solution of LEU. The hybrid reactor5aincludes a fusion portion10and a fission portion8that cooperate to produce the desired isotopes. In the construction illustrated inFIG.22, ten distinct fusion portions10are employed. Each fusion portion10is arranged as a magnetic fusion portion10and acts as a neutron source as will be discussed with regard toFIGS.1and2. Of course other arrangements could use fewer fusion portions10, more fusion portions10, or other arrangements of fusion portions as desired. FIG.23illustrates another arrangement of a hybrid reactor5bthat is well suited to the production of medical isotopes. In the construction ofFIG.23, linear fusion portions11act as neutron sources as will be discussed with regard toFIGS.3and4. In the construction ofFIG.23, the linear fusion portions11are arranged such that five fusion portions11are positioned at one end of the fission portion8and five fusion portions11are positioned on the opposite end of the fission portion8. Of course other arrangements that employ other quantities of fusion portions11, or other arrangements of fusion portions could be employed if desired. As illustrated inFIGS.1-3, each fusion portion10,11provides a compact device that may function as a high energy proton source or a neutron source. In one embodiment, the fusion portions10,11utilize2H-3He (deuterium-helium 3) fusion reactions to generate protons, which may then be used to generate other isotopes. In another embodiment, the fusion portions10,11function as neutron sources by changing the base reactions to2H-3H,2H-2H, or3H-3H reactions. In view of the disadvantages inherent in the conventional types of proton or neutron sources, the fusion portions10,11provide a novel high energy proton or neutron source (sometimes referred to herein generically as an ion source but also considered a particle source) that may be utilized for the production of medical isotopes. Each fusion portion10,11uses a small amount of energy to create a fusion reaction, which then creates higher energy protons or neutrons that may be used for isotope production. Using a small amount of energy may allow the device to be more compact than previous conventional devices. Each fusion portion10,11suitably generates protons that may be used to generate other isotopes including but not limited to18F,11C,15O,13N,63Zn,124I and many others. By changing fuel types, each fusion portion may also be used to generate high fluxes of neutrons that may be used to generate isotopes including but not limited to I-131, Xe-133, In-111, I-125, Mo-99 (which decays to Tc-99m) and many others. As such, each fusion portion10,11provides a novel compact high energy proton or neutron source for uses such as medical isotope generation that has many of the advantages over the proton or neutron sources mentioned heretofore. In general, each fusion portion10,11provides an apparatus for generating protons or neutrons, which, in turn, are suitably used to generate a variety of radionuclides (or radioisotopes). With reference toFIGS.1and2, each magnetic fusion portion10includes a plasma ion source20, which may suitably include an RF-driven ion generator and/or antenna24, an accelerator30, which is suitably electrode-driven, and a target system including a target chamber60. In the case of proton-based radioisotope production, the apparatus may also include an isotope extraction system90. The RF-driven plasma ion source20generates and collimates an ion beam directed along a predetermined pathway, wherein the ion source20includes an inlet for entry of a first fluid. The electrode-driven accelerator30receives the ion beam and accelerates the ion beam to yield an accelerated ion beam. The target system receives the accelerated ion beam. The target system contains a nuclear particle-deriving, e.g. a proton-deriving or neutron-deriving, target material that is reactive with the accelerated beam and that, in turn, emits nuclear particles, i.e., protons or neutrons. For radioisotope production, the target system may have sidewalls that are transparent to the nuclear particles. An isotope extraction system90is disposed proximate or inside the target system and contains an isotope-deriving material that is reactive to the nuclear particles to yield a radionuclide (or radioisotope). It should be noted that while an RF-driven ion generator or ion source is described herein, other systems and devices are also well-suited to generating the desired ions. For example, other constructions could employ a DC arc source in place of or in conjunction with the RF-driven ion generator or ion source. Still other constructions could use hot cathode ion sources, cold cathode ion sources, laser ion sources, field emission sources, and/or field evaporation sources in place of or in conjunction with a DC arc source and or an RF-driven ion generator or ion source. As such, the invention should not be limited to constructions that employ an RF-driven ion generator or ion source. As discussed, the fusion portion can be arranged in a magnetic configuration10and/or a linear configuration11. The six major sections or components of the device are connected as shown inFIG.1andFIG.2for the magnetic configuration10, andFIG.3for the linear configuration11. Each fusion portion, whether arranged in the magnetic arrangement or the linear arrangement includes an ion source generally designated20, an accelerator30, a differential pumping system40, a target system which includes a target chamber60for the magnetic configuration10or a target chamber70for the linear configuration11, an ion confinement system generally designated80, and an isotope extraction system generally designated90. Each fusion portion may additionally include a gas filtration system50. Each fusion portion may also include a synchronized high speed pump100in place of or in addition to the differential pumping system40. Pump100is especially operative with the linear configuration of the target chamber. The ion source20(FIG.4andFIG.5) includes a vacuum chamber25, a radio-frequency (RF) antenna24, and an ion injector26having an ion injector first stage23and an ion injector final stage35(FIG.6). A magnet (not shown) may be included to allow the ion source to operate in a high density helicon mode to create higher density plasma22to yield more ion current. The field strength of this magnet suitably ranges from about 50 G to about 6000 G, suitably about 100 G to about 5000 G. The magnets may be oriented so as to create an axial field (north-south orientation parallel to the path of the ion beam) or a cusp field (north-south orientation perpendicular to the path of the ion beam with the inner pole alternating between north and south for adjacent magnets). An axial field can create a helicon mode (dense plasma), whereas a cusp field may generate a dense plasma but not a helicon inductive mode. A gas inlet21is located on one end of the vacuum chamber25, and the first stage23of the ion injector26is on the other. Gas inlet21provides one of the desired fuel types, which may include1H2,2H2,3H2,3He, and11B, or may comprise1H,2H,3H,3He, and11B. The gas flow at inlet21is suitably regulated by a mass flow controller (not shown), which may be user or automatically controlled. RF antenna24is suitably wrapped around the outside of vacuum chamber25. Alternatively, RF antenna24may be inside vacuum chamber25. Suitably, RF antenna24is proximate the vacuum chamber such that radio frequency radiation emitted by RF antenna24excites the contents (i.e., fuel gas) of vacuum chamber25, for example, forming a plasma. RF antenna24includes a tube27of one or more turns. RF tube or wire27may be made of a conductive and bendable material such as copper, aluminum, or stainless steel. Ion injector26includes one or more shaped stages (23,35). Each stage of the ion injector includes an acceleration electrode32suitably made from conductive materials that may include metals and alloys to provide effective collimation of the ion beam. For example, the electrodes are suitably made from a conductive metal with a low sputtering coefficient, e.g., tungsten. Other suitable materials may include aluminum, steel, stainless steel, graphite, molybdenum, tantalum, and others. RF antenna24is connected at one end to the output of an RF impedance matching circuit (not shown) and at the other end to ground. The RF impedance matching circuit may tune the antenna to match the impedance required by the generator and establish an RF resonance. RF antenna24suitably generates a wide range of RF frequencies, including but not limited to 0 Hz to tens of kHz to tens of MHz to GHz and greater. RF antenna24may be water-cooled by an external water cooler (not shown) so that it can tolerate high power dissipation with a minimal change in resistance. The matching circuit in a turn of RF antenna24may be connected to an RF power generator (not shown). Ion source20, the matching circuit, and the RF power generator may be floating (isolated from ground) at the highest accelerator potential or slightly higher, and this potential may be obtained by an electrical connection to a high voltage power supply. RF power generator may be remotely adjustable, so that the beam intensity may be controlled by the user, or alternatively, by computer system. RF antenna24connected to vacuum chamber25suitably positively ionizes the fuel, creating an ion beam. Alternative means for creating ions are known by those of skill in the art and may include microwave discharge, electron-impact ionization, and laser ionization. Accelerator30(FIG.6andFIG.7) suitably includes a vacuum chamber36, connected at one end to ion source20via an ion source mating flange31, and connected at the other end to differential pumping system40via a differential pumping mating flange33. The first stage of the accelerator is also the final stage35of ion injector26. At least one circular acceleration electrode32, and suitably 3 to 50, more suitably 3 to 20, may be spaced along the axis of accelerator vacuum chamber36and penetrate accelerator vacuum chamber36, while allowing for a vacuum boundary to be maintained. Acceleration electrodes32have holes through their centers (smaller than the bore of the accelerator chamber) and are suitably each centered on the longitudinal axis (from the ion source end to the differential pumping end) of the accelerator vacuum chamber for passage of the ion beam. The minimum diameter of the hole in acceleration electrode32increases with the strength of the ion beam or with multiple ion beams and may range from about 1 mm to about 20 cm in diameter, and suitably from about 1 mm to about 6 cm in diameter. Outside vacuum chamber36, acceleration electrodes32may be connected to anti-corona rings34that decrease the electric field and minimize corona discharges. These rings may be immersed in a dielectric oil or an insulating dielectric gas such as SF6. Suitably, a differential pumping mating flange33, which facilitates connection to differential pumping section40, is at the exit of the accelerator. Each acceleration electrode32of accelerator30can be supplied bias either from high voltage power supplies (not shown), or from a resistive divider network (not shown) as is known by those of skill in the art. The divider for most cases may be the most suitable configuration due to its simplicity. In the configuration with a resistive divider network, the ion source end of the accelerator may be connected to the high voltage power supply, and the second to last accelerator electrode32may be connected to ground. The intermediate voltages of the accelerator electrodes32may be set by the resistive divider. The final stage of the accelerator is suitably biased negatively via the last acceleration electrode to prevent electrons from the target chamber from streaming back into accelerator30. In an alternate embodiment, a linac (for example, a RF quadrapole) may be used instead of an accelerator30as described above. A linac may have reduced efficiency and be larger in size compared to accelerator30described above. The linac may be connected to ion source20at a first end and connected to differential pumping system40at the other end. Linacs may use RF instead of direct current and high voltage to obtain high particle energies, and they may be constructed as is known in the art. Differential pumping system40(FIG.8andFIG.9) includes pressure reducing barriers42that suitably separate differential pumping system40into at least one stage. Pressure reducing barriers42each suitably include a thin solid plate or one or more long narrow tubes, typically 1 cm to 10 cm in diameter with a small hole in the center, suitably about 0.1 mm to about 10 cm in diameter, and more suitably about 1 mm to about 6 cm. Each stage comprises a vacuum chamber44, associated pressure reducing barriers42, and vacuum pumps17, each with a vacuum pump exhaust41. Each vacuum chamber44may have 1 or more, suitably 1 to 4, vacuum pumps17, depending on whether it is a 3, 4, 5, or 6 port vacuum chamber44. Two of the ports of the vacuum chamber44are suitably oriented on the beamline and used for ion beam entrance and exit from differential pumping system40. The ports of each vacuum chamber44may also be in the same location as pressure reducing barriers42. The remaining ports of each vacuum chamber44are suitably connected by conflat flanges to vacuum pumps17or may be connected to various instrumentation or control devices. The exhaust from vacuum pumps17is fed via vacuum pump exhaust41into an additional vacuum pump or compressor if necessary (not shown) and fed into gas filtration system50. Alternatively, if needed, this additional vacuum pump may be located in between gas filtration system50and target chamber60or70. If there is an additional compression stage, it may be between vacuum pumps17and filtration system50. Differential pumping section is connected at one end to the accelerator30via an accelerator mating flange45, and at the other at beam exit port46to target chamber (60or70) via a target chamber mating flange43. Differential pumping system40may also include a turbulence generating apparatus (not shown) to disrupt laminar flow. A turbulence generating apparatus may restrict the flow of fluid and may include surface bumps or other features or combinations thereof to disrupt laminar flow. Turbulent flow is typically slower than laminar flow and may therefore decrease the rate of fluid leakage from the target chamber into the differential pumping section. In some constructions, the pressure reducing barriers42are replaced or enhanced by plasma windows. Plasma windows include a small hole similar to those employed as pressure reducing barriers. However, a dense plasma is formed over the hole to inhibit the flow of gas through the small hole while still allowing the ion beam to pass. A magnetic or electric field is formed in or near the hole to hold the plasma in place. Gas filtration system50is suitably connected at its vacuum pump isolation valves51to vacuum pump exhausts41of differential pumping system40or to additional compressors (not shown). Gas filtration system50(FIG.10) includes one or more pressure chambers or “traps” (13,15) over which vacuum pump exhaust41flows. The traps suitably capture fluid impurities that may escape the target chamber or ion source, which, for example, may have leaked into the system from the atmosphere. The traps may be cooled to cryogenic temperatures with liquid nitrogen (LN traps,15). As such, cold liquid traps13,15suitably cause gas such as atmospheric contaminants to liquefy and remain in traps13,15. After flowing over one or more LN traps15connected in series, the gas is suitably routed to a titanium getter trap13, which absorbs contaminant hydrogen gasses such as deuterium that may escape the target chamber or the ion source and may otherwise contaminate the target chamber. The outlet of getter trap13is suitably connected to target chamber60or70via target chamber isolation valve52of gas filtration system50. Gas filtration system50may be removed altogether from device10, if one wants to constantly flow gas into the system and exhaust it out vacuum pump exhaust41, to another vacuum pump exhaust (not shown), and to the outside of the system. Without gas filtration system50, operation of apparatus10would not be materially altered. Apparatus10, functioning as a neutron source, may not include getter trap13of gas filtration system50. Vacuum pump isolation valves51and target chamber isolation valves52may facilitate gas filtration system50to be isolated from the rest of the device and connected to an external pump (not shown) via pump-out valve53when the traps become saturated with gas. As such, if vacuum pump isolation valves51and target chamber isolation valves52are closed, pump-out valves53can be opened to pump out impurities. Target chamber60(FIG.11andFIG.12for magnetic system10) or target chamber70(FIG.13andFIG.14for the linear system11) may be filled with the target gas to a pressure of about 0 to about 100 torr, about 100 mtorr to about 30 torr, suitably about 0.1 to about 10 torr, suitably about 100 mtorr to about 30 torr. The specific geometry of target chamber60or70may vary depending on its primary application and may include many variations. The target chamber may suitably be a cylinder about 10 cm to about 5 m long, and about 5 mm to about 100 cm in diameter for the linear system14. When used in the hybrid reactor, the target chamber is arranged to provide an activation column in its center. The fusion portions are arranged to direct beams through the target chamber but outside of the activation column. Thus, the beams travel substantially within an annular space. Suitably, target chamber70may be about 0.1 m to about 2 m long, and about 30 to 50 cm in diameter for the linear system14. For the magnetic system12, target chamber60may resemble a thick pancake, about 10 cm to about 1 m tall and about 10 cm to about 10 m in diameter. Suitably, the target chamber60for the magnetic system12may be about 20 cm to about 50 cm tall and approximately 50 cm in diameter. For the magnetic target chamber60, a pair of either permanent magnets or electromagnets (ion confinement magnet12) may be located on the faces of the pancake, outside of the vacuum walls or around the outer diameter of the target chamber (seeFIG.11andFIG.12). The magnets are suitably made of materials including but not limited to copper and aluminum, or superconductors or NdFeB for electromagnets. The poles of the magnets may be oriented such that they create an axial magnetic field in the bulk volume of the target chamber. The magnetic field is suitably controlled with a magnetic circuit comprising high permeability magnetic materials such as 1010 steel, mu-metal, or other materials. The size of the magnetic target chamber and the magnetic beam energy determine the field strength according to equation (1): r=1.44E/B(1) for deuterons, wherein r is in meters, E is the beam energy in eV, and B is the magnetic field strength in gauss. The magnets may be oriented parallel to the flat faces of the pancake and polarized so that a magnetic field exists that is perpendicular to the direction of the beam from the accelerator30, that is, the magnets may be mounted to the top and bottom of the chamber to cause ion recirculation. In another embodiment employing magnetic target chamber60, there are suitably additional magnets on the top and bottom of the target chamber to create mirror fields on either end of the magnetic target chamber (top and bottom) that create localized regions of stronger magnetic field at both ends of the target chamber, creating a mirror effect that causes the ion beam to be reflected away from the ends of the target chamber. These additional magnets creating the mirror fields may be permanent magnets or electromagnets. It is also desirable to provide a stronger magnetic field near the radial edge of the target chamber to create a similar mirror effect. Again, a shaped magnetic circuit or additional magnets could be employed to provide the desired strong magnetic field. One end of the target chamber is operatively connected to differential pumping system40via differential pumping mating flange33, and a gas recirculation port62allows for gas to re-enter the target chamber from gas filtration system50. The target chamber may also include feedthrough ports (not shown) to allow for various isotope generating apparatus to be connected. In the magnetic configuration of the target chamber60, the magnetic field confines the ions in the target chamber. In the linear configuration of the target chamber70, the injected ions are confined by the target gas. When used as a proton or neutron source, the target chamber may require shielding to protect the operator of the device from radiation, and the shielding may be provided by concrete walls suitably at least one foot thick. Alternatively, the device may be stored underground or in a bunker, distanced away from users, or water or other fluid may be used a shield, or combinations thereof. Both differential pumping system40and gas filtration system50may feed into the target chamber60or70. Differential pumping system40suitably provides the ion beam, while gas filtration system50supplies a stream of filtered gas to fill the target chamber. Additionally, in the case of isotope generation, a vacuum feedthrough (not shown) may be mounted to target chamber60or70to allow the isotope extraction system90to be connected to the outside. Isotope extraction system90, including the isotope generation system63, may be any number of configurations to provide parent compounds or materials and remove isotopes generated inside or proximate the target chamber. For example, isotope generation system63may include an activation tube64(FIGS.12and14) that is a tightly wound helix that fits just inside the cylindrical target chamber and having walls65. Alternatively, in the case of the pancake target chamber with an ion confinement system80, it may include a helix that covers the device along the circumference of the pancake and two spirals, one each on the top and bottom faces of the pancake, all connected in series. Walls65of activation tubes64used in these configurations are sufficiently strong to withstand rupture, yet sufficiently thin so that protons of over 14 MeV (approximately 10 to 20 MeV) may pass through them while still keeping most of their energy. Depending on the material, the walls of the tubing may be about 0.01 mm to about 1 mm thick, and suitably about 0.1 mm thick. The walls of the tubing are suitably made of materials that will not generate neutrons. The thin-walled tubing may be made from materials such as aluminum, carbon, copper, titanium, or stainless steel. Feedthroughs (not shown) may connect activation tube64to the outside of the system, where the daughter or product compound-rich fluid may go to a heat exchanger (not shown) for cooling and a chemical separator (not shown) where the daughter or product isotope compounds are separated from the mixture of parent compounds, daughter compounds, and impurities. In another construction, shown inFIG.15, a high speed pump100is positioned in between accelerator30and target chamber60or70. High speed pump100may replace the differential pumping system40and/or gas filtration system50. The high speed pump suitably includes one or more blades or rotors102and a timing signal104that is operatively connected to a controller108. The high speed pump may be synchronized with the ion beam flow from the accelerator section, such that the ion beam or beams are allowed to pass through at least one gap106in between or in blades102at times when gaps106are aligned with the ion beam. Timing signal104may be created by having one or more markers along the pump shaft or on at least one of the blades. The markers may be optical or magnetic or other suitable markers known in the art. Timing signal104may indicate the position of blades102or gap106and whether or not there is a gap aligned with the ion beam to allow passage of the ion beam from first stage35of accelerator30through high speed pump100to target chamber60or70. Timing signal104may be used as a gate pulse switch on the ion beam extraction voltage to allow the ion beam to exit ion source20and accelerator30and enter high speed pump100. When flowing through the system from ion source20to accelerator30to high speed pump100and to target chamber60or70, the beam may stay on for a time period that the ion beam and gap106are aligned and then turn off before and while the ion beam and gap106are not aligned. The coordination of timing signal104and the ion beam may be coordinated by a controller108. In one embodiment of controller108(FIG.18), controller108may comprise a pulse processing unit110, a high voltage isolation unit112, and a high speed switch114to control the voltage of accelerator30between suppression voltage (ion beam off; difference may be 5-10 kV) and extraction voltage (ion beam on; difference may be 20 kv). Timing signal104suitably creates a logic pulse that is passed through delay or other logic or suitable means known in the art. Pulse processing unit110may alter the turbine of the high speed pump to accommodate for delays, and high speed switch114may be a MOSFET switch or other suitable switch technology known in the art. High voltage isolation unit112may be a fiber optic connection or other suitable connections known in the art. For example, the timing signal104may indicate the presence or absence of a gap106only once per rotation of a blade102, and the single pulse may signal a set of electronics via controller108to generate a set of n pulses per blade revolution, wherein n gaps are present in one blade rotation. Alternatively, timing signal104may indicate the presence or absence of a gap106for each of m gaps during a blade rotation, and the m pulses may each signal a set of electronics via controller108to generate a pulse per blade revolution, wherein m gaps are present in one blade rotation. The logic pulses may be passed or coordinated via controller108to the first stage of accelerator section35(ion extractor), such that the logic pulse triggers the first stage of accelerator section35to change from a suppression state to an extraction state and visa versa. If the accelerator were +300 kV, for example, the first stage of accelerator35may be biased to +295 kV when there is no gap106in high speed pump100, so that the positive ion beam will not flow from +295 kV to +300 kV, and the first stage of accelerator35may be biased to +310 kV when there is a gap106in high speed pump100, so that the ion beam travels through accelerator30and through gaps106in high speed pump100to target chamber60or70. The difference in voltage between the suppression and extraction states may be a relatively small change, such as about 1 kV to about 50 kV, suitably about 10 kV to about 20 kV. A small change in voltage may facilitate a quick change between suppression (FIG.17) and extraction (FIG.16) states. Timing signal104and controller108may operate by any suitable means known in the art, including but not limited to semiconductors and fiber optics. The period of time that the ion beam is on and off may depend on factors such as the rotational speed of blades102, the number of blades or gaps106, and the dimensions of the blades or gaps. The isotopes18F and13N, which are utilized in PET scans, may be generated from the nuclear reactions inside each fusion portion using an arrangement as illustrated inFIGS.12and14. These isotopes can be created from their parent isotopes,18O (for18F) and16O (for13N) by proton bombardment. The source of the parent may be a fluid, such as water (H218O or H216O), that may flow through the isotope generation system via an external pumping system (not shown) and react with the high energy protons in the target chamber to create the desired daughter compound. For the production of18F or13N, water (H218O or H216O, respectively) is flowed through isotope generation system63, and the high energy protons created from the aforementioned fusion reactions may penetrate tube64walls and impact the parent compound and cause (p,α) reactions producing18F or13N. In a closed system, for example, the isotope-rich water may then be circulated through the heat exchanger (not shown) to cool the fluid and then into the chemical filter (not shown), such as an ion exchange resin, to separate the isotope from the fluid. The water mixture may then recirculate into target chamber (60or70), while the isotopes are stored in a filter, syringe, or by other suitable means known in the art until enough has been produced for imaging or other procedures. While a tubular spiral has been described, there are many other geometries that could be used to produce the same or other radionuclides. For example, isotope generation system63may suitably be parallel loops or flat panel with ribs. In another embodiment, a water jacket may be attached to the vacuum chamber wall. For18F or13N creation, the spiral could be replaced by any number of thin walled geometries including thin windows, or could be replaced by a solid substance that contained a high oxygen concentration, and would be removed and processed after transmutation. Other isotopes can be generated by other means. With reference toFIGS.1and3, the operation of the fusion portions will now be described. Before operation of one of the fusion portions, the respective target chamber60or70is suitably filled by first pre-flowing the target gas, such as3He, through the ion source20with the power off, allowing the gas to flow through the apparatus10and into the target chamber. In operation, a reactant gas such as2H2enters the ion source20and is positively ionized by the RF field to form plasma22. As plasma22inside vacuum chamber25expands toward ion injector26, plasma22starts to be affected by the more negative potential in accelerator30. This causes the positively charged ions to accelerate toward target chamber60or70. Acceleration electrodes32of the stages (23and35) in ion source20collimate the ion beam or beams, giving each a nearly uniform ion beam profile across the first stage of accelerator30. Alternatively, the first stage of accelerator30may enable pulsing or on/off switching of the ion beam, as described above. As the beam continues to travel through accelerator30, it picks up additional energy at each stage, reaching energies of up to 5 MeV, up to 1 MeV, suitably up to 500 keV, suitably 50 keV to 5 MeV, suitably 50 keV to 500 keV, and suitably 0 to 10 Amps, suitably 10 to 100 mAmps, by the time it reaches the last stage of the accelerator30. This potential is supplied by an external power source (not shown) capable of producing the desired voltage. Some neutral gas from ion source20may also leak out into accelerator30, but the pressure in accelerator30will be kept to a minimum by differential pumping system40or synchronized high speed pump100to prevent excessive pressure and system breakdown. The beam continues at high velocity into differential pumping40where it passes through the relatively low pressure, short path length stages with minimal interaction. From here it continues into target chamber60or70, impacting the high density target gas that is suitably 0 to 100 torr, suitably 100 mtorr to 30 torr, suitably 5 to 20 torr, slowing down and creating nuclear reactions. The emitted nuclear particles may be about 0.3 MeV to about 30 MeV protons, suitably about 10 MeV to about 20 MeV protons, or about 0.1 MeV to about 30 MeV neutrons, suitably about 2 MeV to about 20 MeV neutrons. In the embodiment of linear target chamber70, the ion beam continues in an approximately straight line and impacts the high density target gas to create nuclear reactions until it stops. In the embodiment of magnetic target chamber60, the ion beam is bent into an approximately helical path, with the radius of the orbit (for deuterium ions,2H) given by the equation (2): r=204*EiB(2) where r is the orbital radius in cm, Eiis the ion energy in eV, and B is the magnetic field strength in gauss. For the case of a 500 keV deuterium beam and a magnetic field strength of 7 kG, the orbital radius is about 20.6 cm and suitably fits inside a 25 cm radius chamber. While ion neutralization can occur, the rate at which re-ionization occurs is much faster, and the particle will spend the vast majority of its time as an ion. Once trapped in this magnetic field, the ions orbit until the ion beam stops, achieving a very long path length in a short chamber. Due to this increased path length relative to linear target chamber70, magnetic target chamber60can also operate at lower pressure. Magnetic target chamber60, thus, may be the more suitable configuration. A magnetic target chamber can be smaller than a linear target chamber and still maintain a long path length, because the beam may recirculate many times within the same space. The fusion products may be more concentrated in the smaller chamber. As explained, a magnetic target chamber may operate at lower pressure than a linear chamber, easing the burden on the pumping system because the longer path length may give the same total number of collisions with a lower pressure gas as with a short path length and a higher pressure gas of the linac chamber. Due to the pressure gradient between accelerator30and target chamber60or70, gas may flow out of the target chamber and into differential pumping system40. Vacuum pumps17may remove this gas quickly, achieving a pressure reduction of approximately 10 to 100 times or greater. This “leaked” gas is then filtered and recycled via gas filtration system50and pumped back into the target chamber, providing more efficient operation. Alternatively, high speed pump100may be oriented such that flow is in the direction back into the target chamber, preventing gas from flowing out of the target chamber. While the invention described herein is directed to a hybrid reactor, it is possible to produce certain isotopes using the fusion portion alone. If this is desired, an isotope extraction system90as described herein is inserted into target chamber60or70. This device allows the high energy protons to interact with the parent nuclide of the desired isotope. For the case of18F production or13N production, this target may be water-based (16O for13N, and18O for18F) and will flow through thin-walled tubing. The wall thickness is thin enough that the 14.7 MeV protons generated from the fusion reactions will pass through them without losing substantial energy, allowing them to transmute the parent isotope to the desired daughter isotope. ThenN or18F rich water then is filtered and cooled via external system. Other isotopes, such as124I (from124Te or others),11C (from14N or11B or others),15O (from15N or others), and63Zn, may also be generated. In constructions that employ the fission portion to generate the desired isotopes, the isotope extraction system90can be omitted. If the desired product is protons for some other purpose, target chamber60or70may be connected to another apparatus to provide high energy protons to these applications. For example, the a fusion portion may be used as an ion source for proton therapy, wherein a beam of protons is accelerated and used to irradiate cancer cells. If the desired product is neutrons, no hardware such as isotope extraction system90is required, as the neutrons may penetrate the walls of the vacuum system with little attenuation. For neutron production, the fuel in the injector is changed to either deuterium or tritium, with the target material changed to either tritium or deuterium, respectively. Neutron yields of up to about 1015neutrons/sec or more may be generated. Additionally, getter trap13may be removed. The parent isotope compound may be mounted around target chamber60or70, and the released neutrons may convert the parent isotope compound to the desired daughter isotope compound. Alternatively, an isotope extraction system may still or additionally be used inside or proximal to the target chamber. A moderator (not shown) that slows neutrons may be used to increase the efficiency of neutron interaction. Moderators in neutronics terms may be any material or materials that slow down neutrons. Suitable moderators may be made of materials with low atomic mass that are unlikely to absorb thermal neutrons. For example, to generate Mo-99 from a Mo-98 parent compound, a water moderator may be used. Mo-99 decays to Tc-99m, which may be used for medical imaging procedures. Other isotopes, such as I-131, Xe-133, In-111, and I-125, may also be generated. When used as a neutron source, the fusion portion may include shielding such as concrete or a fluid such as water at least one foot thick to protect the operators from radiation. Alternatively, the neutron source may be stored underground to protect the operators from radiation. The manner of usage and operation of the invention in the neutron mode is the same as practiced in the above description. The fusion rate of the beam impacting a thick target gas can be calculated. The incremental fusion rate for the ion beam impacting a thick target gas is given by the equation (3): df(E)=nb*Iione*σ(E)*dl(3) where df(E) is the fusion rate (reactions/sec) in the differential energy interval dE, nbis the target gas density (particles/m3), Iionis the ion current (A), e is the fundamental charge of 1.6022*10−19coulombs/particle, σ(E) is the energy dependent cross section (m2) and dl is the incremental path length at which the particle energy is E. Since the particle is slowing down once inside the target, the particle is only at energy E over an infinitesimal path length. To calculate the total fusion rate from a beam stopping in a gas, equation (2) is integrated over the entire particle path length from where its energy is at its maximum of Eito where it stops as shown in equation (4): F(Ei)=∫0Einb*=Iione*σ(E)dl=nbIione∫0Eiσ(E)dl(4) where F(Ei) is the total fusion rate for a beam of initial energy Eistopping in the gas target. To solve this equation, the incremental path length dl is solved for in terms of energy. This relationship is determined by the stopping power of the gas, which is an experimentally measured function, and can be fit by various types of functions. Since these fits and fits of the fusion cross section tend to be somewhat complicated, these integrals were solved numerically. Data for the stopping of deuterium in3He gas at 10 torr and 25° C. was obtained from the computer program Stopping and Range of Ions in Matter (SRIM; James Ziegler, www.srim.org) and is shown inFIG.19. An equation was used to predict intermediate values. A polynomial of order ten was fit to the data shown inFIG.19. The coefficients are shown in TABLE 1, and resultant fit with the best-fit 10thorder polynomial is shown inFIG.20. TABLE 1OrderCoefficient10−1.416621E−2793.815365E−248−4.444877E−2172.932194E−186−1.203915E−1553.184518E−134−5.434029E−1135.847578E−092−3.832260E−0711.498854E−050−8.529514E−05 As can be seen from these data, the fit was quite accurate over the energy range being considered. This relationship allowed the incremental path length, dl, to be related to an incremental energy interval by the polynomial tabulated above. To numerically solve this, it is suitable to choose either a constant length step or a constant energy step, and calculate either how much energy the particle has lost or how far it has gone in that step. Since the fusion rate in equation (4) is in terms of dl, a constant length step was the method used. The recursive relationship for the particle energy E as it travels through the target is the equation (5): En+1=En−S(E)*dl(5) where n is the current step (n=0 is the initial step, and Eois the initial particle energy), En+1is the energy in the next incremental step, S(E) is the polynomial shown above that relates the particle energy to the stopping power, and dl is the size of an incremental step. For the form of the incremental energy shown above, E is in keV and dl is in μm. This formula yields a way to determine the particle energy as it moves through the plasma, and this is important because it facilitates evaluation of the fusion cross section at each energy, and allows for the calculation of a fusion rate in any incremental step. The fusion rate in the numerical case for each step is given by the equation (6): fn(E)=nb*Iione*σ(En)*dl(6) To calculate the total fusion rate, this equation was summed over all values of Enuntil E=0 (or n*dl=the range of the particle) as shown in equation (7): F(Eo)=∑n*dl=rangen=0fn(E)(7) This fusion rate is known as the “thick-target yield”. To solve this, an initial energy was determined and a small step size dl chosen. The fusion rate in the interval dl at full energy was calculated. Then the energy for the next step was calculated, and the process repeated. This goes on until the particle stops in the gas. For the case of a singly ionized deuterium beam impacting a 10 torr helium-3 gas background at room temperature, at an energy of 500 keV and an intensity of 100 mA, the fusion rate was calculated to be approximately 2×1013fusions/second, generating the same number of high energy protons (equivalent to 3 μA protons). This level is sufficient for the production of medical isotopes, as is known by those of skill in the art. A plot showing the fusion rate for a 100 mA incident deuterium beam impacting a helium-3 target at 10 torr is shown inFIG.21. The fusion portions as described herein may be used in a variety of different applications. According to one construction, the fusion portions are used as a proton source to transmutate materials including nuclear waste and fissile material. The fusion portions may also be used to embed materials with protons to enhance physical properties. For example, the fusion portion may be used for the coloration of gemstones. The fusion portions also provide a neutron source that may be used for neutron radiography. As a neutron source, the fusion portions may be used to detect nuclear weapons. For example, as a neutron source the fusion portions may be used to detect special nuclear materials, which are materials that can be used to create nuclear explosions, such as Pu,233U, and materials enriched with233U or235U. As a neutron source, the fusion portions may be used to detect underground features including but not limited to tunnels, oil wells, and underground isotopic features by creating neutron pulses and measuring the reflection and/or refraction of neutrons from materials. The fusion portions may be used as a neutron source in neutron activation analysis (NAA), which may determine the elemental composition of materials. For example, NAA may be used to detect trace elements in the picogram range. As a neutron source, the fusion portions may also be used to detect materials including but not limited to clandestine materials, explosives, drugs, and biological agents by determining the atomic composition of the material. The fusion portions may also be used as a driver for a sub-critical reactor. The operation and use of the fusion portion10,11is further exemplified by the following examples, which should not be construed by way of limiting the scope of the invention. The fusion portions10,11can be arranged in the magnetic configuration10to function as a neutron source. In this arrangement, initially, the system10will be clean and empty, containing a vacuum of 10−9torr or lower, and the high speed pumps17will be up to speed (two stages with each stage being a turbomolecular pump). Approximately 25-30 standard cubic centimeters of gas (deuterium for producing neutrons) will be flowed into the target chamber60to create the target gas. Once the target gas has been established, that is, once the specified volume of gas has been flowed into the system and the pressure in the target chamber60reaches approximately 0.5 torr, a valve will be opened which allows a flow of 0.5 to 1 sccm (standard cubic centimeters per minute) of deuterium from the target chamber60into the ion source20. This gas will re-circulate rapidly through the system, producing approximately the following pressures: in the ion source20the pressure will be a few mtorr; in the accelerator30the pressure will be around 20 μtorr; over the pumping stage nearest the accelerator, the pressure will be <20 μtorr; over the pumping stage nearest the target chamber, the pressure will be approximately 50 mtorr; and in the target chamber60the pressure will be approximately 0.5 torr. After these conditions are established, the ion source20(using deuterium) will be excited by enabling the RF power supply (coupled to the RF antenna24by the RF matching circuit) to about 10-30 MHz. The power level will be increased from zero to about 500 W creating a dense deuterium plasma with a density on the order of 1011particles/cm3. The ion extraction voltage will be increased to provide the desired ion current (approximately 10 mA) and focusing. The accelerator voltage will then be increased to 300 kV, causing the ion beam to accelerate through the flow restrictions and into the target chamber60. The target chamber60will be filled with a magnetic field of approximately 5000 gauss (or 0.5 tesla), which causes the ion beam to re-circulate. The ion beam will make approximately 10 revolutions before dropping to a negligibly low energy. While re-circulating, the ion beam will create nuclear reactions with the target gas, producing 4×1010and up to 9×1010neutrons/sec for D. These neutrons will penetrate the target chamber60, and be detected with appropriate nuclear instrumentation. Neutral gas that leaks from the target chamber60into the differential pumping section40will pass through the high speed pumps17, through a cold trap13,15, and back into the target chamber60. The cold traps13,15will remove heavier gasses that in time can contaminate the system due to very small leaks. The fusion portions11can also be arranged in the linear configuration to function as a neutron source. In this arrangement, initially, the system will be clean and empty, containing a vacuum of 10−9torr or lower and the high speed pumps17will be up to speed (three stages, with the two nearest that accelerator being turbomolecular pumps and the third being a different pump such as a roots blower). Approximately 1000 standard cubic centimeters of deuterium gas will be flowed into the target chamber70to create the target gas. Once the target gas has been established, a valve will be opened which allows a flow of 0.5 to 1 sccm (standard cubic centimeters per minute) from the target chamber70into the ion source20. This gas will re-circulate rapidly through the system, producing approximately the following pressures: in the ion source20the pressure will be a few mtorr; in the accelerator30the pressure will be around 20 μtorr; over the pumping stage nearest the accelerator, the pressure will be <20 μtorr; over the center pumping stage the pressure will be approximately 50 mtorr; over the pumping stage nearest the target chamber70, the pressure will be approximately 500 mtorr; and in the target chamber70the pressure will be approximately 20 torr. After these conditions are established, the ion source20(using deuterium) will be excited by enabling the RF power supply (coupled to the RF antenna24by the RF matching circuit) to about 10-30 MHz. The power level will be increased from zero to about 500 W creating a dense deuterium plasma with a density on the order of 1011particles/cm3. The ion extraction voltage will be increased to provide the desired ion current (approximately 10 mA) and focusing. The accelerator voltage will then be increased to 300 kV, causing the ion beam to accelerate through the flow restrictions and into the target chamber70. The target chamber70will be a linear vacuum chamber in which the beam will travel approximately 1 meter before dropping to a negligibly low energy. While passing through the target gas, the beam will create nuclear reactions, producing 4×1010and up to 9×1010neutrons/sec. These protons will penetrate the target chamber70, and be detected with appropriate nuclear instrumentation. Neutral gas that leaks from the target chamber70into the differential pumping section40will pass through the high speed pumps17, through a cold trap13,15, and back into the target chamber70. The cold traps13,15will remove heavier gasses that in time can contaminate the system due to very small leaks. In another construction, the fusion portions10are arranged in the magnetic configuration and are operable as proton sources. In this construction, initially, the system will be clean and empty, containing a vacuum of 10−9torr or lower, and the high speed pumps17will be up to speed (two stages with each stage being a turbomolecular pump). Approximately 25-30 standard cubic centimeters of gas (an approximate 50/50 mixture of deuterium and helium-3 to generate protons) will be flowed into the target chamber60to create the target gas. Once the target gas has been established, that is, once the specified volume of gas has been flowed into the system and the pressure in the target chamber60reaches approximately 0.5 torr, a valve will be opened which allows a flow of 0.5 to 1 sccm (standard cubic centimeters per minute) of deuterium from the target chamber60into the ion source20. This gas will re-circulate rapidly through the system, producing approximately the following pressures: in the ion source20the pressure will be a few mtorr; in the accelerator30the pressure will be around 20 μtorr; over the pumping stage nearest the accelerator30, the pressure will be <20 μtorr; over the pumping stage nearest the target chamber60, the pressure will be approximately 50 mtorr; and in the target chamber60the pressure will be approximately 0.5 torr. After these conditions are established, the ion source20(using deuterium) will be excited by enabling the RF power supply (coupled to the RF antenna24by the RF matching circuit) to about 10-30 MHz. The power level will be increased from zero to about 500 W creating a dense deuterium plasma with a density on the order of 1011particles/cm3. The ion extraction voltage will be increased to provide the desired ion current (approximately 10 mA) and focusing. The accelerator voltage will then be increased to 300 kV, causing the ion beam to accelerate through the flow restrictions and into the target chamber60. The target chamber60will be filled with a magnetic field of approximately 5000 gauss (or 0.5 tesla), which causes the ion beam to re-circulate. The ion beam will make approximately 10 revolutions before dropping to a negligibly low energy. While re-circulating, the ion beam will create nuclear reactions with the target gas, producing 1×1011and up to about 5×1011protons/sec. These protons will penetrate the tubes of the isotope extraction system, and be detected with appropriate nuclear instrumentation. Neutral gas that leaks from the target chamber60into the differential pumping section40will pass through the high speed pumps17, through a cold trap13,15, and back into the target chamber60. The cold traps13,15will remove heavier gasses that in time can contaminate the system due to very small leaks. In another construction, the fusion portions11are arranged in the linear configuration and are operable as proton sources. In this construction, initially, the system will be clean and empty, containing a vacuum of 10−9torr or lower and the high speed pumps17will be up to speed (three stages, with the two nearest that accelerator being turbomolecular pumps and the third being a different pump such as a roots blower). Approximately 1000 standard cubic centimeters of about 50/50 mixture of deuterium and helium-3 gas will be flowed into the target chamber70to create the target gas. Once the target gas has been established, a valve will be opened which allows a flow of 0.5 to 1 sccm (standard cubic centimeters per minute) from the target chamber70into the ion source20. This gas will re-circulate rapidly through the system, producing approximately the following pressures: in the ion source20the pressure will be a few mtorr; in the accelerator30the pressure will be around 20 μtorr; over the pumping stage nearest the accelerator30, the pressure will be <20 μtorr; over the center pumping stage the pressure will be approximately 50 mtorr; over the pumping stage nearest the target chamber70, the pressure will be approximately 500 mtorr; and in the target chamber70the pressure will be approximately 20 torr. After these conditions are established, the ion source20(using deuterium) will be excited by enabling the RF power supply (coupled to the RF antenna24by the RF matching circuit) to about 10-30 MHz. The power level will be increased from zero to about 500 W creating a dense deuterium plasma with a density on the order of 1011particles/cm3. The ion extraction voltage will be increased to provide the desired ion current (approximately 10 mA) and focusing. The accelerator voltage will then be increased to 300 kV, causing the ion beam to accelerate through the flow restrictions and into the target chamber70. The target chamber70will be a linear vacuum chamber in which the beam will travel approximately 1 meter before dropping to a negligibly low energy. While passing through the target gas, the beam will create nuclear reactions, producing 1×1011and up to about 5×1011protons/sec. These neutrons will penetrate the walls of the tubes of the isotope extraction system, and be detected with appropriate nuclear instrumentation. Neutral gas that leaks from the target chamber70into the differential pumping section40will pass through the high speed pumps17, through a cold trap13,15, and back into the target chamber70. The cold traps13,15will remove heavier gasses that in time can contaminate the system due to very small leaks. In another construction, the fusion portions10,11are arranged in either the magnetic configuration or the linear configuration and are operated as neutron sources for isotope production. The system will be operated as discussed above with the magnetic target chamber or with the linear target chamber70. A solid sample, such as solid foil of parent material Mo-98 will be placed proximal to the target chamber60,70. Neutrons created in the target chamber60,70will penetrate the walls of the target chamber60,70and react with the Mo-98 parent material to create Mo-99, which may decay to meta-stable Tn-99m. The Mo-99 will be detected using suitable instrumentation and technology known in the art. In still other constructions, the fusion portions10,11are arranged as proton sources for the production of isotopes. In these construction, the fusion portion10,11will be operated as described above with the magnetic target chamber60or with the linear target chamber70. The system will include an isotope extraction system inside the target chamber60,70. Parent material such as water comprising H216O will be flowed through the isotope extraction system. The protons generated in the target chamber will penetrate the walls of the isotope extraction system to react with the16O to produce13N. The13N product material will be extracted from the parent and other material using an ion exchange resin. The13N will be detected using suitable instrumentation and technology known in the art. In summary, each fusion portion10,11provides, among other things, a compact high energy proton or neutron source. The foregoing description is considered as illustrative only of the principles of the fusion portion10,11. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the fusion portion10,11to the exact construction and operation shown and described, and accordingly, all suitable modifications and equivalents may be resorted to as required or desired. As illustrated inFIGS.22and23, the fission portions400a,400bof the hybrid reactor5a,5bare positioned adjacent the target chambers60,70of a plurality of fusion portions10,11. The fusion portions10,11are arranged such that a reaction space405is defined within the target chambers60,70. Specifically, the ion trajectories within the target chambers60,70do not enter the reaction space405, and so materials to be irradiated can be placed within that volume. In order to further increase the neutron flux, multiple fusion portions10,11are stacked on top of one another, with as many as ten sources being beneficial. As illustrated inFIG.22, the hybrid reactor5aincludes the fission portion400aand fusion portions10in the magnetic arrangement to produce a plurality of stacked target chambers60that are pancake shaped but in which the ion beam flows along an annular path. Thus, the reaction space405within the annular path can be used for the placement of materials to be irradiated. FIG.23illustrates a linear arrangement of the fusion portions11coupled to the fission portion400bto define the hybrid reactor5b. In this construction, the ion beams are directed along a plurality of substantially parallel, spaced-apart linear paths positioned within an annular target chamber70. The reaction space405(sometimes referred to as reaction chamber) within the annular target chamber70is suitable for the placement of materials to be irradiated. Thus, as will become apparent, the fission portions400a,400bdescribed with regard toFIGS.24-29could be employed with either the magnetic configuration or the linear configuration of the fusion portions10,11. With reference toFIGS.22and23the fission portion400a,400bincludes a substantially cylindrical activation column410(sometimes referred to as an activation cell) positioned within a tank415that contains a moderator/reflector material selected to reduce the radiation that escapes from the fission portion400a,400bduring operation. An attenuator may be positioned proximate the activation cell and selected to maintain the fission reaction at a subcritical level, a reflector may be positioned proximate the target chamber and selected to reflect neutrons toward the activation cell, and a moderator may substantially surround the activation cell, the attenuator, and the reflector. The activation column410is positioned within the target chamber60,70where the fusion reactions occur. The target chamber60,70is about 1 m tall. A layer of beryllium420may surround the target chamber60,70. The moderating material is typically D2O or H2O. In addition, a gas regeneration system425is positioned on top of the tank415. An aperture430in the center of the gas regeneration system425extends into the activation column410where a sub-critical assembly435including a LEU mixture and/or other parent material may be located. In preferred constructions, the aperture430has about a 10 cm radius and is about 1 m long. Each fusion portion10,11is arranged to emit high energy neutrons from the target chamber. The neutrons emitted by the fusion portions10,11are emitted isotropically, and while at high energy those that enter the activation column410pass through it with little interaction. The target chamber is surrounded by 10-15 cm of beryllium420, which multiplies the fast neutron flux by approximately a factor of two. The neutrons then pass into the moderator where they slow to thermal energy and reflect back into the activation cell410. It is estimated that the neutron production rate from this configuration is about 1015n/s (the estimated source strength for a single fusion portion10,11operating at 500 kV and 100 mA is 1014n/s and there are ten of these devices in the illustrated construction). The total volumetric flux in the activation cell410was calculated to be 2.35*1012n/cm2/s with an uncertainty of 0.0094 and the thermal flux (less than 0.1 eV) was 1.34*1012n/cm2/s with an uncertainty of 0.0122. This neutron rate improves substantially with the presence of LEU as will be discussed. As discussed with regard toFIGS.1and3, the fusion portion10,11can be arranged in the magnetic arrangement or the linear arrangement. The real advantage of the magnetic arrangement of the fusion portions10,11is that they allow for a long path length in a relatively low pressure gas. To effectively use the linear configuration, the target gas must be cooled and must be maintained at a higher pressure. One example of such a configuration would have several deuterium beam lines shooting axially into the target chamber70from above and below the device as illustrated inFIG.23. While the target chambers70may need to operate at up to 10 torr for this to be successful, it may be a simpler and more efficient approach for the fusion portion10,11. The primary simplification in the linear configuration is the elimination of the components needed to establish the magnetic field that guides the beam in the spiral or helical pattern. The lack of the components needed to create the field makes the device cheaper and the magnets do not play a role in attenuating the neutron flux. However, in some constructions, a magnetic field is employed to collimate the ion beam produced by the linear arrangement of the fusion portions11, as will be discussed. In order to produce Mo-99 of high specific activity as an end product, it should be made from a material that is chemically different so that it can be easily separated. The most common way to do this is by fission of235U through neutron bombardment. The fusion portions10,11described previously create sufficient neutrons to produce a large amount of Mo-99 with no additional reactivity, but if235U is already present in the device, it makes sense to put it in a configuration that will provide neutron multiplication as well as providing a target for Mo-99 production. The neutrons made from fission can play an important role in increasing the specific activity of the Mo-99, and can increase the total Mo-99 output of the system. The multiplication factor, keffis related to the multiplication by equation 1/(1−keff). This multiplication effect can result in an increase of the total yield and specific activity of the end product by as much as a factor of 5-10. keffis a strong function of LEU density and moderator configuration. Several subcritical configurations of subcritical assemblies435which consist of LEU (20% enriched) targets combined with H2O (or D2O) are possible. All of these configurations are inserted into the previously described reaction chamber space405. Some of the configurations considered include LEU foils, an aqueous solution of a uranium salt dissolved in water, encapsulated UO2powder and others. The aqueous solutions are highly desirable due to excellent moderation of the neutrons, but provide challenges from a criticality perspective. In order to ensure subcritical operation, the criticality constant, keffshould be kept below 0.95. Further control features could easily be added to decrease keffif a critical condition were obtained. These control features include, but are not limited to control rods, injectable poisons, or pressure relief valves that would dump the moderator and drop the criticality. Aqueous solutions of uranium offer tremendous benefits for downstream chemical processes. Furthermore, they are easy to cool, and provide an excellent combination of fuel and moderator. Initial studies were performed using a uranium nitrate solution-UO2(NO3)2, but other solutions could be considered such as uranium sulfate or others. In one construction, the salt concentration in the solution is about 66 g of salt per 100 g H2O. The solution is positioned within the activation cell410as illustrated inFIGS.24and25. In addition to the solution, there is a smaller diameter cylinder500in the center of the activation cell410filled with pure water. This cylinder of water allows the value of keffto be reduced so that the device remains subcritical, while still allowing for a large volume of LEU solution to be used. In the aqueous solution layout illustrated inFIGS.24and25, the central most cylinder500contains pure water and is surrounded by an aqueous mixture of uranium nitrate that is contained between the tube and a cylindrical wall505that cooperate to define a substantially annular space510. The target chamber60,70is the next most outward layer and is also annular. The pure water, the aqueous mixture of uranium nitrate, and the target chamber60,70are surrounded by the Be multiplier/reflector420. The outermost layer520in this case is a large volume of D2O contained within the tank415. The D2O acts as a moderator to reduce radiation leakage from the fission portion400a,400b.FIGS.26-29illustrate similar structural components but contain different materials within some or all of the volumes as will be discussed with those particular figures. A common method to irradiate uranium is to form it into either uranium dioxide pellets or encase a uranium dioxide powder in a container. These are inserted into a reactor and irradiated before removal and processing. While the UO2powders being used today utilize HEU, it is preferable to use LEU. In preferred constructions, a mixture of LEU and H2O that provides Keff<0.95 is employed. FIGS.26and27illustrate an activation column410that includes UO2in a homogeneous solution with D2O. The center cylinder500in this construction is filled with H2O525, as is the outermost layer530(only a portion of which is illustrated). The first annular space535contains a solution of 18% LEU (20% enriched) and 82% D2O. The second annular layer540is substantially evacuated, consistent with the fusion portion target chambers60,70. The center cylinder500, the first annular space535, and the second annular space540are surrounded by a layer of Be420, which serves as a multiplier and neutron reflector. In another construction, Mo-99 is extracted from uranium by chemical dissolution of LEU foils in a modified Cintichem process. In this process, thin foils containing uranium are placed in a high flux region of a nuclear reactor, irradiated for some time and then removed. The foils are dissolved in various solutions and processed through multiple chemical techniques. From a safety, non-proliferation, and health perspective, a desirable way to produce Mo-99 is by (n,γ) reactions with parent material Mo-98. This results in Mo-99 with no contamination from plutonium or other fission products. Production by this method also does not require a constant feed of any form of uranium. The disadvantage lies in the difficulty of separating Mo-99 from the parent Mo-98, which leads to low specific activities of Mo-99 in the generator. Furthermore, the cost of enriched Mo-98 is substantial if that is to be used. Still, considerable progress has been made in developing new elution techniques to extract high purity Tc-99m from low specific activity Mo-99, and this may become a cost-effective option in the near future. To implement this type of production in the hybrid reactor5a,5billustrated herein, a fixed subcritical assembly435of LEU can be used to increase the neutron flux (most likely UO2), but can be isolated from the parent Mo-98. The subcritical assembly435is still located inside of the fusion portion10,11, and the Mo-99 activation column would be located within the subcritical assembly435. In preferred constructions, Mo-98 occupies a total of 20% of the activation column410(by volume). As illustrated inFIGS.28and29, the centermost cylinder500contains a homogeneous mixture of 20% Mo-98 and H2O. The first annular layer555includes a subcritical assembly435and is comprised of an 18% LEU (20% enriched)/D2O mixture. The second annular layer560is substantially evacuated, consistent with the fusion portion target chambers60,70. The center cylinder500, the first annular space555, and the second annular space560are surrounded by the layer of Be420, which serves as a multiplier and neutron reflector. The outermost layer570(only a portion of which is illustrated) contains water that reduces the amount of radiation that escapes from the fission portion5a,5b. For the LEU cases, the production rate and specific activity of Mo-99 was determined by calculating 6% of the fission yield, with a fusion portion10,11operating at 1015n/s. Keffwas calculated for various configurations as well. Table 1 summarizes the results of these calculations. In the case of production from Mo-98, an (n,γ) tally was used to determine the production rate of Mo-99. The following table illustrates the production rates for various target configurations in the hybrid reactor5a,5b. Mo-99Total Mo-yield/g U99 yield @(or Mo-98)saturationTarget ConfigurationKeff(Ci)(6 day kCi)Aqueous UO2(NO3)20.9471.512.93UO2powder0.9452.9222Natural Mo (w subcritical)0.9430.682.69Mo-98 (w subcritical)0.9432.8311.1Natural Mo (w/o subcritical)—0.0850.44Mo-98 (w/o subcritical)—0.351.8 While the specific activity of Mo-99 generated is relatively constant for all of the subcritical cases, some configurations allow for a substantially higher total production rate. This is because these configurations allow for considerably larger quantities of parent material. It is also worth noting that production of Mo-99 from Mo-98 is as good a method as production from LEU when it comes to the total quantity of Mo-99 produced. Still, the LEU process tends to be more favorable as it is easier to separate Mo-99 from fission products than it is to separate it from Mo-98, which allows for a high specific activity of Mo-99 to be available after separation. In constructions in which Mo-98 is used to produce Mo-99, the subcritical assembly435can be removed altogether. However, if the subcritical assembly435is removed, the specific activity of the end product will be quite a bit lower. Still, there are some indications that advanced generators might be able to make use of the low specific activity resulting from Mo-98 irradiation. The specific activity produced by the hybrid reactor5a,5bwithout subcritical multiplication is high enough for some of these technologies. Furthermore, the total demand for U.S. Mo-99 could still be met with several production facilities, which would allow for a fission free process. For example, in one construction of a fusion only reactor, the subcritical assembly435is omitted and Mo-98 is positioned within the activation column410. To enhance the production of Mo-99, a more powerful ion beam produced by the linear arrangement of the fusion portion11is employed. It is preferred to operate the ion beams at a power level approximately ten times that required in the aforementioned constructions. To achieve this, a magnetic field is established to collimate the beam and inhibit the undesirable dispersion of the beams. The field is arranged such that it is parallel to the beams and substantially surrounds the accelerator30and the pumping system40but does not necessarily extend into the target chamber70. Using this arrangement provides the desired neutron flux without the multiplicative effect produced by the subcritical assembly435. One advantage of this arrangement is that no uranium is required to produce the desired isotopes. Thus, the invention provides, among other things, a segmented activation cell600for use in producing medical isotopes. The segmented activation cell may be used, for example, with a hybrid reactor5a,5b. The constructions of the hybrid reactor5a,5bdescribed above and illustrated in the figures are presented by way of example only and are not intended as a limitation upon the concepts and principles of the invention. | 84,134 |
11862357 | The figures are not necessarily to scale. Wherever appropriate, similar or identical reference numerals are used to refer to similar or identical components. DETAILED DESCRIPTION Collimators, in particular collimators for use in radiation applications, may be configured to align radiation rays (e.g., align radiation rays to be parallel or substantially parallel). In turn, the collimator may reduce scatter radiation of the emitted radiation. Moreover, collimators may reduce the size or control the shape of an emitted radiation beam. However, conventional collimators are relatively large, which may limit the applications of collimators to relatively high energies. For example, conventional collimators may be tube shaped or otherwise within a relatively large housing. Thus, conventional collimators may be burdensome to house or store, bulky, and/or difficult to use or move. The large size of conventional collimators limits the ability to position a sample in close proximity to the face of the x-ray tube when performing geometric magnification. This limitation on positioning limits the amount of geometric magnification that is attainable using conventional collimators. Furthermore, as the collimator shutters are placed farther from the face of the x-ray generator, the cone of radiation passing through the collimator increases and requires a corresponding increase in the sizes of the shutter plates need to be to block the cone of radiation, which increases the size, weight and cost of the collimator. Additionally, conventional collimators are not adjustable. In turn, a user may need multiple, differently-sized collimators to have a collimator size or shape appropriate for a particular application. In this way, the user may have to switch the collimator used for any particular application, which may be time consuming and/or difficult. Moreover, it may be expensive to have multiple collimators on hand for the specific collimation needs of the different applications. In contrast to conventional collimators, disclosed example collimators are both relatively small (e.g., as compared to conventional collimators) and adjustable. Therefore, disclosed example collimators discussed herein may be applicable to increased collimation applications, easier to house and store, and result in less time consumption and expense (e.g., by not having to, or not having to as frequently, change the collimator for different applications). FIG.1illustrates an example x-ray imaging system100that includes an adjustable collimator116. The example x-ray imaging system100may be used to perform x-ray imaging, x-ray scanning (e.g., for non-destructive testing (NDT)), or the like. The example x-ray imaging system100is configured to direct an x-ray beam102emitted by an x-ray generator104to an image acquisition system106through a workpiece108(e.g., an object to be imaged or under test). In the example ofFIG.1, a workpiece positioner110holds or secures the workpiece108, and moves and/or rotates the workpiece108such that the desired portion and/or orientation of the workpiece108is located in the path of the x-ray beam102. In some examples, the x-ray generator104, the image acquisition system106, and/or the workpiece positioner110may be positioned and/or reoriented using one or more actuators. Relative repositioning of the x-ray generator104, the image acquisition system106, and/or the workpiece positioner110may result in different effects, such as changing the focal length, changing the focal point, changing an unsharpness parameter, changing a magnification (e.g., a ratio of a distance between the x-ray generator104and the image acquisition system106to a distance between the x-ray generator104to the workpiece positioner110or to the workpiece108), changing a portion of the workpiece108that is scanned, and/or other effects. Example implementations of the workpiece positioner110include a mechanical manipulator, such a platen having linear and/or rotational actuators. Other example workpiece positioners110may include robotic manipulators, such as robotic arms having 6 degrees of freedom (DOF). The x-ray imaging system100further includes an enclosure112, in which the x-ray generator104, the image acquisition system106, and the workpiece positioner110are enclosed. The enclosure112includes one or more doors114or other access openings to, for example, insert or remove the workpiece108, perform servicing on any of the components within the enclosure112, install and/or adjust the adjustable collimator116, and/or otherwise access an interior of the enclosure112. The image acquisition system106ofFIG.1generates digital images based on the incident x-ray beam102(e.g., generated by the x-ray generator104and directed toward the image acquisition system106). In some examples, the image acquisition system106may be configured to acquire a plurality of radiographs and generate one or more images based on the radiographs. For example, the image acquisition system106may include a fluoroscopy detection system and a digital image sensor configured to receive an image indirectly via scintillation, and/or may be implemented using a sensor panel (e.g., an amorphous silicon panel, a CCD panel, a CMOS panel, etc.) configured to receive the x-rays directly, and to generate the digital images. In other examples, the image acquisition system106may use a solid state panel coupled to a scintillation screen and having pixels that correspond to portions of the scintillation screen. Example solid state panels may include amorphous silicon panels, CMOS x-ray panels and/or CCD x-ray panels. In yet other examples, the image acquisition system106may use a different method to generate the digital images based on the incident x-ray radiation. The x-ray imaging system100further includes an adjustable collimator116. As seen inFIG.1, the adjustable collimator116may be attached to the x-ray generator104. In some such examples, the adjustable collimator116may be removably attached to the x-ray generator104. In other examples, the adjustable collimator116may be positioned proximate the x-ray generator104. In any case, the x-ray radiation generated by the x-ray generator104may be directed through the adjustable collimator116to collimate the x-ray beam102. The x-ray imaging system100including the adjustable collimator116may provide enhanced focus and/or resolution of the images generated by the image acquisition system106. The adjustable collimator116may also reduce scatter of the x-ray beam generated by the x-ray generator104as the beam propagates. While the example ofFIG.1includes an x-ray generator104and an image acquisition system106, in other examples the x-ray imaging system100may perform imaging using radiation in other wavelengths. FIG.2is a perspective view of an example adjustable collimator200that may be used to implement the collimator116ofFIG.1. The adjustable collimator200includes a housing202. The housing202may be made of any suitable material for radiation collimation. For example, the housing202may be made of lead, tungsten, tantalum, molybdenum, tin, bismuth, a high density plastic, or any other suitable material. The housing202may be any suitable size and/or shape. In some examples, the housing (and therefore the adjustable collimator200) may be smaller than conventional collimators. For instance, the housing202may be small enough to be attached to a radiation generator or positioned proximate a radiation generator (e.g., the adjustable collimator200may have the same or a similar cross-sectional area as the portion of the radiation generator which emits the radiation beam). In some examples, the width of the adjustable collimator200(e.g., as measured in the direction of the x-axis illustrated inFIG.2) may be between about 1 inch and about 10 inches, between about 1 inch and about 5 inches, between about 1 inch and about 3 inches, or between about 1 inch and about 2 inches; the length of the adjustable collimator200(e.g., as measured in the direction of the z-axis illustrated inFIG.2) may be between about 1 inch and about 10 inches, between about 1 inch and about 5 inches, between about 1 inch and about 3 inches, or between about 1 inch and about 2 inches; and the thickness of the adjustable collimator200(e.g., as measured in the direction of the y-axis illustrated inFIG.2) may be between about 0.10 inches and about 5 inches, between about 0.1 inches and about 1 inch, between about 0.1 inches and about 0.5 inches, or between about 0.1 inches and about 0.3 inches. In other examples, the adjustable collimator200(e.g., the housing202of the adjustable collimator200) may have different dimensions. The housing202defines an aperture204. In some examples, radiation from a radiation generator (e.g., the x-ray generator104ofFIG.1) is directed through the aperture204from an inlet to an outlet of the housing202. In examples in which the housing202is configured to be attached to a source of radiation, the housing202may be attached to the source of radiation such that the aperture204is in a path of the radiation emitted by the source of radiation. The aperture204may be configured to collimate the radiation directed from the inlet to the outlet of the housing202. In some such examples, collimation of the radiation reduces scatter radiation of the propagating radiation, which may reduce unintended or undesired incidence of radiation on the radiation detector. The aperture204may be any suitable size and/or shape. In some examples, the width of the aperture204(e.g., as measured in the direction of the x-axis illustrated inFIG.2) may be between about 0.05 inches and about 3 inches, between about 0.1 inches and about 1 inch, between about 0.1 inches and about 0.5 inches, or between about 0.1 inches and about 0.3 inches; and the length of the aperture204(e.g., as measured in the direction of the z-axis illustrated inFIG.2) may be between about 0.05 inches and about 3 inches, between about 0.1 inches and about 1 inch, between about 0.1 inches and about 0.5 inches, or between about 0.1 inches and about 0.3 inches. In other examples, the aperture204may have different dimensions. The adjustable collimator200further includes a first shutter206and a second shutter208within the housing202. In some examples, the first shutter206and/or the second shutter208may be configured to move (e.g., translate along the x-axis illustrated inFIG.2) within the housing202. In some cases, both the first and the second shutter206,208may be configured to move within the housing202. In some such examples, the first shutter206and the second shutter208may be configured to move in opposite directions of each other. For example, when the first shutter206is configured to translate along the x-axis in a first translation direction A, the second shutter208may be configured to translate along the x-axis in a second translation direction B opposite the first translation direction A. Similarly, in some such cases when the first shutter206is configured to translate along the x-axis in the second translation direction B, the second shutter208may be configured to translate along the x-axis in the first translation direction A. In this way, the first and second shutters206,208may be configured to move either toward each other or away from each other. In other examples, the first and second shutters206,208may be configured to move within housing202at different times or only one of first shutter206or second shutter208may be configured to move (e.g., with the other of the first shutter206or the second shutter208remaining stationary within housing202). As one example, the first shutter206may be configured to move toward the second shutter208. As another example, the second shutter208may be configured to move away from the first shutter206. In some examples, movement of the first shutter206or the second shutter208may be controlled manually. For example, a user may rotate a first screw210to adjust the first shutter206and/or rotate a second screw212to adjust the second shutter208. In other examples, the adjustment of one of first screw210or second screw212may be configured to move both the first shutter206and the second shutter208. More details with respect to the adjustment of the first shutter206and/or the second shutter208are discussed below with respect toFIG.4. In yet other examples, the manual adjustment mechanism may be something other than a screw. In some cases, rather than the movement of the first shutter206and/or the second shutter208being controlled manually, the adjustable collimator200may include one or more actuators configured to drive movement of the first and/or the second shutter206,208. The first and second shutters206,208may be configured to adjust an effective width of the aperture204. For example, the first and second shutters206,208may be configured to substantially align with the aperture204such that movement of one or both of the first shutter206or the second shutter208blocks at least a portion of the aperture204in some configurations. In the example illustrated inFIG.2for instance, the first shutter206and second shutter208are in contact with each other while aligned with the aperture204. Thus, in the example ofFIG.2, the effective width of the aperture204is 0. In the example ofFIG.2, the effective width of the aperture204can be increased by moving the first shutter206and the second shutter208away from each other (or one of the first shutter206or the second shutter208away from the other of the first shutter206or the second shutter208). Conversely, while the first shutter206and the second shutter208are spaced partially or fully apart (e.g., the effective width of the aperture204is greater than zero), the effective width of the aperture may be decreased by moving the first shutter206and the second shutter208toward each other. FIG.3is a front view of the example adjustable collimator200ofFIG.2, in accordance with aspects of this disclosure. In the example illustrated inFIG.3, the first shutter206has been moved away from the second shutter208in the first translation direction A and the second shutter208has been moved away from the first shutter206in the second translation direction B opposite the first translation direction A (as compared to the configuration of the first and second shutters206,208illustrated inFIG.2). In turn, the effective width w of the aperture204has been increased (in comparison to the example ofFIG.2). In the example ofFIG.3, the first shutter206and the second shutter208are both partially blocking the aperture204. In other examples, however, the first and/or the second shutter206,208may be moved within housing202such that none of the first and/or the second shutter206,208block the aperture204. In examples in which neither the first shutter206nor the second shutter208block the aperture204, the effective width w of the aperture204may be equal to the actual width of the aperture204. In this way, the effective width w of the aperture204can be adjusted by moving one or both of the first shutter206or the second shutter208within the housing202. In turn, the effective width w of the aperture204may be capable of ranging from 0 (e.g., closed by the first shutter206and the second shutter208being in contact) to the actual width of the aperture204(e.g., neither the first shutter206nor the second shutter208blocking any portion of the aperture204). Thus, the collimator200as disclosed herein is adjustable by movement of one or both of the first shutter206or the second shutter208. By being adjustable, the adjustable collimator200may be suitable for use with a variety of applications by enabling the size of a beam of radiation to be varied, and/or by being capable of having different levels of focus or resolution. FIG.4is an exploded view of the example adjustable collimator200ofFIG.2. As seen inFIG.4, the adjustable collimator200may include multiple housing components202a,202b,202cthat form the housing202when the adjustable collimator200is assembled. In particular, the adjustable collimator ofFIG.4includes a first housing component202a, a second housing component202b, and a third housing component202c. The housing components202a,202b,202cmay be coupled in any suitable manner, such as, for example, using mechanical attachment mechanisms (e.g., screws) or an adhesive. In other examples, the housing202may be made of fewer or more than 3 housing components. For example, in some cases, the housing202may include a single housing component. The example housing component202may be rotated with respect to the other components of the adjustable collimator200to provide vertical collimation, horizontal collimation, or collimation according to any other angle. Additionally or alternatively, the example adjustable collimator200may be duplicated to provide multi-angle (e.g., horizontal and vertical) collimation. In examples in which the housing202includes multiple housing components202a,202b,202c, one or more of the housing components202a,202b,202cmay define all or portions of the aperture204. For instance, in the example ofFIG.4, the second housing component202bdefines a first aperture204aand the third housing component202cdefines a second aperture204b. In some examples, the first aperture204aand the second aperture204bmay be configured to align (or substantially align) when the adjustable collimator200is assembled. In this way, the alignment of the first aperture204aand the second aperture204bmay form the aperture204that extends from an inlet214to and outlet216of the housing202. For example, first aperture204amay be at an inlet214of the adjustable collimator200and the second aperture204bmay be at an outlet216of the adjustable collimator200. In other words, radiation may enter through the first aperture204aand exit through the second aperture204b. In some such examples, the first shutter206and the second shutter208may be configured to move within the housing202between the first and second apertures204a,204b(e.g., between the second housing component202band the third housing component202c). Such a configuration may enable the first shutter206and/or the second shutter208to move within the housing202to adjust the effective width w of the aperture204by moving to block both the first aperture204aand the second aperture204b(e.g., if the first and second aperture204a,204bare aligned when the adjustable collimator200is assembled). In this way, the second housing component202band the third housing component202cmay define a slot that the first and/or the second shutter206,208are configured to move within. In some such examples, the first shutter206may include one or more plungers230configured to restrain movement of the first shutter206to follow the slot in the housing202. Additionally, or alternatively, the second shutter208may include one or more plungers232configured to restrain movement of the second shutter208to follow the slot in the housing202. The first shutter206and/or the second shutter208including one or more plungers230,232may help ensure that the first and second shutter206,208remain within the slot defined by the housing202such that movement of one or both of the first shutter206or the second shutter208results in a change of the effective width w of the aperture204. In other words, the plungers230,232may help align the first and/or second shutter206,208with the aperture204in at least some configurations. In examples in which the housing includes a single component or only a single aperture is defined, the first shutter206and the second shutter208may be configured to move within the housing202such that the first and/or second shutter206,208are configured to at least partially block the aperture204in some positions of the first and second shutters206,208to control the effective width w of the aperture204. In some such examples, the housing202may still define a slot within which the first and/or second shutters206,208are configured to move within. The adjustable collimator200further includes a first yoke218coupled to the housing202at a first pivot point220. The first yoke218may be configured to pivot with respect to the housing202about the first pivot point220. In some examples, the first pivot point220may be at a longitudinal center of the first yoke218. In other examples, the pivot point220may be located at a different position of the first yoke218. The first yoke218may be configured to move the first shutter206to increase or decrease the effective width w of the aperture204. For example, the first yoke218may be configured to move the first shutter206toward the second shutter208to reduce the effective width w of the aperture204when rotated in a first direction (e.g., clockwise) and/or move the first shutter206away from the second shutter208to increase the effective width w of the aperture204when rotated in a second direction opposite of the first direction (e.g., counter-clockwise). In some examples, the adjustable collimator200may include a first link222coupled to the first shutter206. In such examples, the first link222may be configured to move the first shutter206upon pivoting of the first yoke218. For example, when the first yoke218is rotated in the first direction (e.g., clockwise), the first yoke218may push the first link222, causing the first link222to move in the second translation direction B. Because the first link222is coupled to the first shutter206, the first link222moves the first shutter206in the second translation direction B (e.g., toward the second shutter208). In turn, the effective width w of the aperture204may be reduced. In the example ofFIG.4, a second yoke224is also coupled to the housing202at a second pivot point226. The second yoke224is configured to pivot with respect to the housing202about the second pivot point226. In some examples, the second pivot point226may be at a longitudinal center of the second yoke224. In other examples, the pivot point226may be located at a different position of the second yoke224. The second yoke224may be configured to move the second shutter208to increase or decrease the effective width w of the aperture204. For example, the second yoke224may be configured to move the second shutter208toward the first shutter206to reduce the effective width w of the aperture204when rotated in a first direction (e.g., clockwise) and/or move the second shutter208away from the first shutter206to increase the effective width w of the aperture204when rotated in a second direction opposite of the second direction (e.g., counter-clockwise). Similar to the first link222and first yoke218, in some examples in which the adjustable collimator200includes a second yoke224, the adjustable collimator200may include a second link228coupled to the second shutter208. In such examples, the second link228may be configured to move the second shutter208upon pivoting of the second yoke224. For example, when the second yoke224is pivoted in the first direction (e.g., clockwise), the second yoke224may push the second link228, causing the second link228to move in the first translation direction A. Because the second link228is coupled to the second shutter208, the second link228moves the second shutter208in the first translation direction A (e.g., toward the first shutter206). In turn, the effective width w of the aperture204may be reduced. In some examples, the first yoke218may also be configured to move the second shutter208. For example, the first yoke218may be configured to push the second link228in the second translation direction B upon rotation of the first yoke218in the second direction (e.g., counter-clockwise). In turn, the second shutter208coupled to the second link228may be moved in the second translation direction B (e.g., away from the first shutter206) thereby increasing the effective width w of the aperture204. Similarly, the second yoke224may be configured to move the first shutter206in the first translation direction A (e.g., away from the second shutter208) by pushing the first link222when the second yoke224is rotated in the second direction (e.g., counter-clockwise). In some examples, rotation of one of the first yoke218or the second yoke224may result in rotation of the other of the first yoke218or the second yoke224. In turn, both of the first link222and the second link228may be pushed at substantially the same time. For example, when the first yoke218is rotated in the first direction (e.g., clockwise), the first yoke218may push the first link222in the second translation direction B. Movement of the first link222in the second translation direction B may push on the second yoke224, causing the second yoke224to rotate in the first direction (e.g., clockwise). Consequently, rotation of the second yoke224in the first direction may push the second link228in the first translation direction A. Thus, movement of the first link222in the second translation B and movement of the second link228in the first translation direction A may cause the first shutter206and the second shutter208to move toward from each other simultaneously (or nearly simultaneously) to reduce the effective width w of the aperture204. Moreover, rotation of the first yoke218in the second direction (e.g., counter-clockwise) may likewise rotate the second yoke224in the second direction in some examples. For instance, the first yoke218may be rotated in the second direction (e.g., counter-clockwise), pushing the second link228in the second translation direction B. In turn, the second link228may push on the second yoke224to rotate the second yoke224in the second direction (e.g., counter-clockwise). Rotation of the second yoke224in the second direction may push the first link222in the first translation direction A. In this way, movement of the first link222in the first translation A and movement of the second link228in the second translation direction B may cause the first shutter206and the second shutter208to move away from each other simultaneously (or nearly simultaneously) to increase the effective width w of the aperture204. In examples in which rotation of the first yoke218or the second yoke224results in rotation of the other of the first yoke218or the second yoke224, only one yoke may need to be rotated in order to move both the first shutter206and the second shutter208to reduce or increase the effective width w of the aperture204. In turn, operation of the adjustable collimator200described herein may be more efficient and/or easier than other collimators. The first yoke218and the second yoke224may be rotated in any suitable manner. In some examples, the first yoke218and/or the second yoke224may be configured to be rotated manually. For example, in some cases, the first yoke218may be coupled to a first screw (e.g., the first screw210illustrated inFIGS.2and3). Additionally or alternatively, the second yoke224may be coupled to a second screw (e.g., the second screw212illustrated inFIGS.2and3). Rotation of the first screw210or the second screw212(e.g., using a screwdriver) may cause rotation of the respective yoke coupled to the screw being rotated, thereby causing movement of one or both of the first shutter206or the second shutter208. In other examples, other manual rotation mechanisms may be used to rotate one or both yokes. For example, one or both of the yoke(s)218,224and/or one or both of the link(s)222,228may extend through the housing for manual manipulation via pushing and/or pulling of the yoke(s)218,224and/or the link(s)222,228. In some examples, the adjustable collimator200may include one or more actuators234configured to rotate one or both of the first yoke218or the second yoke224to move the first shutter206and/or the second shutter208. In some such examples, the one or more actuators234may be coupled to a controller configured to communicate with (e.g., command, obtain information from, etc.) the actuators234. In some such examples, a user may be able to input a command, such as a desired effective width w of the aperture204, and the controller may command the one or more actuators234to rotate the first and/or second yoke218,224to cause the first and/or second shutter206,208to move within the housing202to achieve the desired effective width w of the aperture204. In other examples, the one or more actuators234may be operated in a different manner or the adjustable collimator200may use a mechanism other than actuators to adjust the effective width w of the aperture204. FIG.5is a perspective view of an example filter wheel500that includes the adjustable collimator ofFIG.1. The filter wheel500may be placed between the x-ray generator104and the workpiece108to easily place any of multiple filters on the filter wheel500into a filtering position. The example filter wheel500may be provided with the adjustable collimator200, in which the filter wheel500functions as the housing202ato which the other components (202b,202c,204a-232) are coupled. The example adjustable collimator200may be implemented in the filter wheel500using any of the orientations and/or configurations discussed above with reference toFIGS.2-4, except that an aperture502in the filter wheel500takes the place of the housing202afor mounting and assembling the other components. FIG.6is a perspective view of another example adjustable collimator600having an adjustable housing602and which may be used to implement the adjustable collimator116ofFIG.1.FIG.7is a rear elevation view of the adjustable collimator600ofFIG.6. The example collimator600is otherwise similar to the collimator200ofFIG.2, and includes the aperture204, the first shutter206, the second shutter208, the first screw210, the second screw212, the inlet214, the outlet216, the yoke(s)218,224, the pivot points220,226, the links222,228, and/or the plungers230,232ofFIGS.2,3, and4. The housing602includes a mount housing604and an adjustable housing component606. The mount housing604may include multiple portions, similar to the housing components202a,202b,202cofFIG.3. Instead of the components204-232being installed in the housing202, in the example ofFIG.6the components204-232are installed in the mount housing604. The perimeter of the mount housing604has a different geometry that the housing202to accommodate the adjustable housing component606while allowing installation of the components204-232. The adjustable housing component606includes an adjustment block608and an alignment screw610that adjusts a distance or gap612of the adjustment block608from the mount housing604. The adjustable collimator600is installed onto a radiation source by partially fastening the shoulder screws614a,614bto the radiation source to partially secure the mount housing604b. The adjustment block608is also secured to the radiation source by screws616a,616. The mount housing604includes slots618a,618bto permit travel of the aperture204with respect to the shoulder screws614a,614band, as a result, with respect to the radiation source. When the shoulder screws614a,614band the screws616a,616bare installed, the alignment screw610may be turned to adjust the gap612, which adjusts the location of the aperture604relative to the radiation source. When the aperture204is located in the desired position, the shoulder screws614a,614bmay be fully secured to secure the mount housing to the radiation source. The example collimator600ofFIGS.6and7allow for fine adjustment of the position of the aperture204with respect to the radiation source to further improve alignment. In some examples, the radiation housing allows for movement of the mount housing604with respect to the output location of the radiation (e.g., an X-ray tube or gamma ray tube). In such examples, adjustment of the alignment screw610moves the mount housing604and, as a result, the aperture204with respect to the radiation output location. FIG.8Ais a front elevation view of another example adjustable collimator800having shoulder screws802,804to stabilize the adjustable housing component606.FIG.8Bis a perspective view of the adjustable collimator ofFIG.8B. The example collimator800ofFIGS.8A and8Bis similar to the collimator600ofFIG.6, and includes the housing602, the mount housing604, the adjustable housing component606, the adjustment block608, the alignment screw610, the shoulder screws614a,614b, the screws616a,616b, the slots618a,618b, the aperture204, the first shutter206, the second shutter208, the first screw210, the second screw212, the inlet214, the outlet216, the yoke(s)218,224, the pivot points220,226, the links222,228, and/or the plungers230,232ofFIGS.6and7. The example collimator800ofFIGS.8A and8Bfurther includes shoulder screws802a,802b, which extend through the bores (not shown) in the adjustment block608to secure and stabilize the adjustment block608to the mount housing604. The shoulder screws802a,802bto reduce or prevent relative rotation between the adjustment block608and the mount housing604. The example adjustment block608is further stabilized by springs804a,804b, which are compressed between the shoulder screws802a,802band the adjustment block608to reduce vibration in the adjustment block608. The present methods and systems may be realized in hardware, software, and/or a combination of hardware and software. The present methods and/or systems may be realized in a centralized fashion in at least one computing system, or in a distributed fashion where different elements are spread across several interconnected computing systems. Any kind of computing system or other apparatus adapted for carrying out the methods described herein is suited. A typical combination of hardware and software may include a general-purpose computing system with a program or other code that, when being loaded and executed, controls the computing system such that it carries out the methods described herein. Another typical implementation may comprise an application specific integrated circuit or chip. Some implementations may comprise a non-transitory machine-readable (e.g., computer readable) medium (e.g., FLASH drive, optical disk, magnetic storage disk, or the like) having stored thereon one or more lines of code executable by a machine, thereby causing the machine to perform processes as described herein. As used herein, the term “non-transitory machine-readable medium” is defined to include all types of machine readable storage media and to exclude propagating signals. As utilized herein the terms “circuits” and “circuitry” refer to physical electronic components (i.e. hardware) and any software and/or firmware (“code”) which may configure the hardware, be executed by the hardware, and or otherwise be associated with the hardware. As utilized herein, “and/or” means any one or more of the items in the list joined by “and/or”. As an example, “x and/or y” means any element of the three-element set {(x), (y), (x, 3)}. In other words, “x and/or y” means “one or both of x and y”. As another example, “x, y, and/or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and/or z” means “one or more of x, y and z”. As utilized herein, the term “exemplary” means serving as a non-limiting example, instance, or illustration. As utilized herein, the terms “e.g.,” and “for example” set off lists of one or more non-limiting examples, instances, or illustrations. As utilized herein, circuitry is “operable” to perform a function whenever the circuitry comprises the necessary hardware and code (if any is necessary) to perform the function, regardless of whether performance of the function is disabled or not enabled (e.g., by a user-configurable setting, factory trim, etc.). While the present method and/or system has been described with reference to certain implementations, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present method and/or system. For example, block and/or components of disclosed examples may be combined, divided, re-arranged, and/or otherwise modified. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from its scope. Therefore, the present method and/or system are not limited to the particular implementations disclosed. Instead, the present method and/or system will include all implementations falling within the scope of the appended claims, both literally and under the doctrine of equivalents. | 36,612 |
11862358 | DETAILED DESCRIPTION In the following detailed description, numerous specific details are set forth by way of examples in order to provide a thorough understanding of the relevant teachings. However, it should be apparent to those skilled in the art that the present teachings may be practiced without such details. In other instances, well-known methods, procedures, components, and/or circuitry have been described at a relatively high-level, without detail, in order to avoid unnecessarily obscuring aspects of the present teachings. While this disclosure includes a number of embodiments in many different forms, there is shown in the drawings and will herein be described in detail particular embodiments with the understanding that the present disclosure is to be considered as an exemplification of the principles of the disclosed methods and systems, and is not intended to limit the broad aspects of the disclosed concepts to the embodiments illustrated. As will be realized, the disclosed methods and systems are capable of other and different configurations and several details are capable of being modified all without departing from the scope of the disclosed methods and systems. For example, one or more of the following embodiments, in part or whole, may be combined consistently with the disclosed methods and systems. As such, one or more steps from the flowcharts or components in the Figures may be selectively omitted and/or combined consistently with the disclosed methods and systems. In addition, the steps contained within the flowcharts can be performed in different orders. In other words, the order of the steps described below does not have to be strictly followed and instead steps can be performed out of order. Accordingly, the drawings, flow charts and detailed descriptions are to be regarded as illustrative in nature, not restrictive or limiting. 1) Definitions The following terms appear through this specification and are defined as follows. The term “partial solidification zone” is an area of the fused segment of the intermediate portion of the busbar, where the zone extends from the lowermost conductor in the fused segment to the upper most conductor in the fused segment. For example, inFIG.39zone1660of the busbar1000that extends between the top surface1000aand the bottom surface1000bthat has undergone a partial penetration weldment process. The term “partially solidified region” means an extent of the partial solidification zone of the busbar that has undergone a partial penetration weldment process. This process combines or fuses some, but not all, of the intermediate extents of conductors contained within the partial solidification zone to form the partially solidified region that provides a single consolidated conductor. Examples of partially solidified regions1650are shown inFIGS.38,39, and45. In the partially solidified region1650, a significant amount (e.g., approximately 70%) of the conductors1090located within the partial solidification zone1660are combined into a single consolidated conductor and a lesser amount (e.g., approximately 30%) of the conductors located within the partial solidification zone1660and beyond the partially solidified region1650remain as individual conductors1090—meaning that they are not combined or fused into a single combined conductor. The term “unsolidified region” means an extent of the busbar that has not undergone a weldment process to combine or fuse any of the conductors contained within that extent of the busbar. As such, all of the conductors located within an unsolidified region remain as individual conductors. For example,FIG.39shows unsolidified regions1670adjacent to and between the two partially solidified regions1650within the fused segment1220of the intermediate portion1200of the inventive busbar1000. The term “fully solidified region” means an extent of the busbar that has undergone a full penetration weldment process to combine or fuse all conductors contained within that extent of the busbar into a single consolidated conductor. For example,FIG.43shows one fully solidified region1690flaked by unsolidified region1670within the fused segment1220of the intermediate portion1200of the inventive busbar1000. The term “fused segment” is an extent of the busbar that contains at least one partially solidified region or fully solidified region, or both. The fused segment may also include an unsolidified regions. For example,FIG.39shows unsolidified regions1670and partially solidified regions1650, andFIG.43shows unsolidified regions1670surrounding a fully solidified region1690, both within the fused segment1220of the intermediate portion1200of the inventive busbar1000. The term “unfused segment” is an extent of the busbar that does not contain a either a partially solidified region or a fully solidified region. Thus, the unfused segment only contains an unsolidified region(s). For example,FIGS.38and42shows unsolidified regions1670within the unfused segment1520of the intermediate portion1200of the inventive busbar1000. The term “in-plane” refers to the X and Y directions in a three dimensional Cartesian X, Y and Z coordinate system, as shown inFIGS.3A-3B. The term “in-plane bend” is a type of bend of the busbar that is oriented in the X-Y plane and that is oriented transverse, typically perpendicular to the width of the busbar.FIG.1Ashows a busbar10with two exemplary in-plane bends1750in the X-Y plane, which were formed within the fused segment1220of the intermediate portion1200of the inventive busbar1000. The term “out-of-plane” refers to the Z direction in the three dimensional Cartesian X, Y and Z coordinate system, as shown inFIG.3. The term “out-of-plane bend” is a type of bend of the busbar that is oriented in the Z direction and that is perpendicular to X-Y plane.FIG.1Bshows a busbar20with two out-of-plane bends1760in the Z-direction. The term “High power” shall mean (i) voltage between 20 volts to 600 volts regardless of current or (ii) at any current greater than or equal to 80 amps regardless of voltage. The term “High current” shall mean current greater than or equal to 80 amps regardless of voltage. The term “High voltage” shall mean a voltage between 20 volts to 600 volts regardless of current. 2) Overview of Conventional Busbars A conventional rigid busbar10is shown inFIG.1and a conventional flexible busbar20is shown inFIG.2, wherein both of these conventional busbars10,20suffer from numerous limitations. For example, conventional rigid busbars10: (i) have high manufacturing costs, (ii) cannot effectively account for manufacturing tolerances, and (iii) cannot properly expand or contract during battery charging and discharging cycles. While conventional flexible busbars20address some of the problems associated with conventional rigid busbars10, flexible busbars20have their own significant limitations. For example, conventional flexible busbars10: (i) cannot be easily connected to other objects, (ii) can be expensive to fabricate, and (iii) cannot maintain an in-plane bend busbar without creating large gaps (e.g., delamination) between the conductors contained within the flexible busbar20, which in turn reduces current flow within the busbar20. In order to achieve the configuration of an in-plane bend using a flexible busbar20, the flexible busbar20is folded22in a manner that causes a first extent of the busbar20to overlap with a second extent of the busbar20(seeFIG.2). This folded configuration increases the height required for the busbar20and the geometry of the fold limits the current flow of the busbar20. Additionally, even out-of-plane bends can cause an increase in the resistance of the busbar20, which may lead to hot spots in the insulation and even failure of the busbar20. Further, the edges of the flexible busbar20tear into or wear away the insulation; thereby leading to the failure of the entire busbar20. To solve some of these issues, companies have attempted to join separate and distinct flexible busbars with separate and distinct rigid busbars. The cobbling together of these two separate and distinct types of busbars is expensive, time consuming, their junction regions are prone to extremely high failure rates, and a substantial amount of material is wasted in attempting to form these busbars. On top of these issues, conventional busbars10,20that are connected to components using conventional connectors24also suffer from a number of problems. For example, conventional busbars10,20and connectors24suffer from: (i) time consuming installation, (ii) requiring a high level of skill and dexterity to perform the installation, (iii) high number of safety concerns, (iv) may require disassembly of the entire battery pack, if a conventional connector is dropped or misplaced within the pack during the installation process, (v) subject to high failure rates, (vi) requires multiple people to confirm that a single installation has been properly performed, and (vii) requires a substantial amount of space and weight. As shown inFIGS.3Aand B, a number of safety concerns exist when an installer, I, is working over an open battery pack. To mitigate some of these concerns, the installer I wears thick protective gloves26and utilizes custom designed tools28. The custom designed tools28are expensive to obtain and the thick protective gloves26requires that the installer I have a high level of skill and dexterity to ensure that the conventional connector24is not accidently dropped within the battery pack or the surrounding environment. If a mishap like this occurs, then the installation process needs to be halted and the entire battery pack must be disassembled in order to find the misplaced conventional connector24. Even assuming that the installation goes as planned, a second person (other than the installer I) is typically required to check the torque of the conventional connectors24and apply a marking or indicia to show that such the requisite check was made. Because the conformation of the connection is done by hand, the manufacturing company may not have a digital record showing when and if the conventional connector was properly connected. 3) Design and Fabrication of the Inventive Busbar The inventive busbar1000disclosed herein overcomes a number of the limitations disclosed above while meeting automotive, military, marine and aviation performance, production and reliability requirements. In particular, the busbar1000includes a plurality of conductors1090arranged to provide two opposed end portions1700and an intermediate portion1200, wherein each of the conductors1090has a plurality of intermediate extents that traverse or span the intermediate portion1200. The intermediate portion1200includes: (i) a first or fused segment1220and (ii) a second or unfused segment1520. First, integrally forming fused and unfused segments1220,1520into a single busbar1000allows the busbar1000to combine the best features of the conventional rigid busbars10and conventional flexible busbars20into a single unit, while limiting the negative features associated with these conventional busbars10,20. For example, the unfused segments1520are flexible which allows the busbar1000to: (i) adjust for manufacturing tolerances, (ii) expand and contract during thermal expansion and contraction events, such as battery charging and battery discharging cycles, and (iii) help absorb vibrations caused by the environment (e.g., under the hood of a vehicle) that the busbar1000is installed within, instead of transferring these vibrations into the connectors. Additionally, the fused segments1220of the busbar1000are stiffer which allows the busbar1000to be accurately bent both out-of-plane and in-plane and especially maintain that in-plane bend over time without causing the conductors contained within the busbar1000to delaminate and thus reduce current flow. This attribute of the busbar1000is beneficial because: (i) it reduces the overall height required for the busbar1000and (ii) does not limit the current flow through the fused segments, which in turn allows the busbar1000to carry more current without creating hotpots or causing a substantial rise in temperature. Further, the edges of the busbar1000can be modified to reduce the probability that the conductors contained within the busbar1000tear into or wear away the surrounding insulation. Moreover, the high cost, extremely high failure rates and material waste associated with the cobbled together conventional busbars are eliminated by integrally forming the fused and unfused segments1220,1520into a single busbar1000. Finally, the inclusion of fused and unfused segments1220,1520allows the busbar1000to be: (i) formed without custom molds and (ii) shipped to a customer in a substantially flat configuration, which reduces packaging, handling, and shipping costs and also reduces the chance the busbar1000may be damaged either in transit or while being handled prior to being installed in a component, device or vehicle. The inventive busbar1000can utilize either conventional connectors24or a boltless connector system2000. The boltless connector system2000does not utilize bolts, screws, fasteners, or the like to connect at least an extent of a busbar1000between: (i) power sources (e.g., alternator or battery), (ii) a power source and a power distribution/control component, or (iii) a power source and a device (e.g., radiator fan, heated seat, power distribution component, or another current drawing component). This boltless connector system2000and its features are described within at least PCT/US20/14484, which is incorporated by reference, and overcomes a number of the limitations related to conventional busbar connectors24. For example, the boltless connector system2000only requires a single person to connect the male connector assembly2200into the female connector assembly2600, hear an audible signal (e.g., a “click”), tug on the connector assemblies2200,2600to ensure they are properly coupled together, and read an extent of the system (push, click, tug, read—“PCTR” compliant). In other words, the busbar1000can be coupled to another component or device without the use of a separate tool, which reduces safety concerns, reduces assembly and handling times, and does not require a high level of skill and dexterity required to install a conventional busbar connector24. Manufacturing times remain consistent because there are no loose parts that may be lost within the battery pack or surrounding environment. Furthermore, labor costs are better managed and reduced because handling and installation of the busbar1000(i) only requires one person a shorter amount of time to install the busbar1000, (ii) requires less space (e.g., the conventional connector height (D1shown inFIG.3B) is reduced from approximately 40 mm to 16 mm), and (iii) is easier because the busbar100is approximately 50% lighter than conventional busbar. In addition to being utilized within a vehicle battery pack, the busbar1000may be used to provide mechanical and electrical connection in other electrical systems that are found in an airplane, a motor vehicle, a military vehicle (e.g., tank, personnel carrier, heavy-duty truck, and troop transporter), a bus, a locomotive, a tractor, a boat, a submarine, a battery pack, a volt system that has more than 24 volts, power storage system, in a high-power application, in a high-current application, in a high-voltage application, or in another application where busbars1000are essential to meet industry standards and production requirements. A. Designing the Inventive Busbar Designing and fabricating a busbar1000is a multi-step process50that is described at a high level in connection withFIG.4. As shown inFIG.4, this multi-step process50starts by receiving specifications from the customer in step52. These customer specifications may include a multitude of different requirements, including but not limited to: (i) current carrying capacity, (ii) geometry constraints, (iii) material and/or chemical constrains, (iv) manufacturing repeatability, (v) durability, (vi) compliance with standard setting bodies, (viii) environmental constraints, (ix) manufacturing requirements, and (x) other requirements. The customer specifications may be sent to the busbar designer in any manner and the specifications may take any form including data sheets and CAD models. For example,FIG.5shows an example of a portion of the customer specifications that were received within step52. Specifically,FIG.5shows a digital 3D CAD model of a battery pack54that includes eight battery modules56a-56h. The customer is requesting busbars1000that can: (i) mechanically and electrically couple the external battery pack connectors58to the battery modules56a-56hand (ii) couple the battery models56a-56hto one another. Once the customer specifications are received, the busbar designer can take the specifications and move on to step64of this multi-step process50. The next step in the multi-step process50of designing and manufacturing a busbar1000is step64(seeFIG.4), which entails digitally designing engineering busbar models100that meet the customer specifications that were received within step52. In designing these engineering busbar models100, it may be desirable to understand how electricity will be routed within the customer's application, product, component, or device. In particular, it may be desirable to gain an understanding of how busbars will route the electricity within the application, product, component, or device to enable the busbar designer to create engineering busbar models100that: (i) meets the customer's specifications, (ii) minimizes the length and weight of the busbar, (iii) allows for proper electrical and mechanical connections, (iv) minimizes the height required for the busbar, and (v) minimizes overlapping busbar. To gain this understanding, the designer may create a model of the busbar layout70within the application, product, component, or device (step66). An example of a model of this busbar layout70is shown inFIG.7A. In particular,FIG.7Ashows eight different non-engineering busbar models68a-68hthat may be used within the customer's application, product, component, or device shown inFIG.5.FIGS.7B-7Fshow isolated views of a few of these non-engineering busbar models68a-68e. While these non-engineering models68a-68hare not suitable for manufacturing purposes, they provide the general overall geometry of the busbar. The next steps described herein will work to turn these non-engineering models68a-68hinto engineering models100that can be manufactured. Returning toFIG.6, the next step in digitally designing the engineering busbar models100is selecting the material and configuration of the conductors90contained within the busbar model100(step74). Specifically, process of step74is described in greater detail withinFIG.8. With the non-engineering model in hand68a-68h, the busbar designer can select the materials that will be used in the engineering busbar model100(step78). As shown inFIG.8, the busbar designer may choose to make the busbar model100from a single material in step80. Such materials may include, but are not limited to, stainless steel, nickel, aluminum, silver, gold, copper, steel, zinc, brass, bronze, iron, platinum, lead, molybdenum, calcium, tungsten, lithium, tin, a combination of the listed materials, or other similar metals. For example, the busbar designer may choose to utilize C10200 copper alloy in connection with non-engineering busbar model68a,68b. This copper alloy has an electrical conductivity of more than 80% of IACS (International Annealed Copper Standard, i.e., the empirically derived standard value for the electrical conductivity of commercially available copper), is reported, per ASTM B747 standard, to have a modulus of elasticity (Young's modulus) of approximately 115-125 gigapascals (GPa) at room temperature and a coefficient of terminal expansion (CTE) of 17.6 ppm/degree Celsius (from 20-300 degrees Celsius) and 17.0 ppm/degree Celsius (from 20-200 degrees Celsius). Alternatively, the busbar designer may choose to use a plurality of materials in step82. If the busbar designer makes this selection, then the designer must select the configuration of the materials in step84. For example, the busbar designer may choose to alternate materials within the busbar model100or may interweave two different materials within the busbar model100. More specifically, the model100may include alternating layers of copper and aluminum or may include a plated conductor (FIG.9A)90, which includes an aluminum core and a copper plating. It should be understood that the above materials and configurations of materials are only examples and other similar materials and configurations are contemplated by this disclosure. Once the materials and their configuration are selected in step78, the busbar design can then select the configuration of the conductors90in step88. Step88is comprised of multiple sub-steps, which are shown inFIG.8. One of these sub-steps included within step88requires the selection of the overall configuration of the conductors90in step92. Non-limiting examples of configurations that the designer may select include: (i) a vertical stack or laminated stack (seeFIG.9B), (ii) a woven, knitted or braided pattern (seeFIG.9C), or (iii) other configurations (seeFIGS.11A-11F). In addition, the selection of the overall configuration of the conductors90in step92includes selecting the number of conductors90that are contained within the busbar model100. In making this selection, the busbar designer may keep the number of conductors90consistence throughout the busbar model100or may vary the number of conductors90contained within the model100. For example, the design may choose to increase the number of conductors90near the end portion or may be decreased the number of conductors90within an intermediate portion of the busbar model100. It should be understood that the exemplary non-engineering busbar models68a,68bmay utilize a laminated stack of ten conductors90, wherein the number of conductors90does not vary across the length of the busbar model100. Another one of these sub-steps in step88requires selecting the shape of each conductor90within the busbar model100in step94. Exemplary shapes include, but are not limited to, rectangular prism or bar (seeFIG.9B), a “U-shaped” plate (seeFIG.9C), cylinder, a pentagonal prism, a hexagonal prism, octagonal prism, a cone, a tetrahedron, or any other similar shape. In making this selection, the busbar designer may keep the shape of conductors90consistence throughout the busbar model100or may vary the shape of conductors90contained within the model100. Changes in the shape of the conductors90may be desirable to add mechanical strength or electrical current capacity within certain segments of the busbar model100. It should be understood that the shape of the conductors90contained within the exemplary non-engineering busbar models68a,68bmay be rectangular prisms or bars. In addition, the selection of the shape of each conductor90in step94includes selecting the thickness of conductors90that are contained within the busbar model100. In making this selection, the busbar designer may keep the thickness of conductors90consistence throughout the busbar model100or may vary the thickness of conductors90contained within the model100. Changes in the thickness of the conductors90may be desirable to add mechanical strength or electrical current capacity within certain segments of the busbar model100. Further, the selection of the shape of each conductor90in step94includes selecting whether the conductors90contained within the busbar model100have a solid, partially solid or a hollow configuration. It should be understood that the conductors90contained within the exemplary non-engineering busbar models68a,68bmay be solid, have a substantially constant thickness of 0.01 inches or 0.254 mms, have a length that is 13.5 inches or 344 mm, and a width that is 0.78 inches or 20 mm. Another one of these sub-steps in step88requires selecting the arrangement of the conductors90within the busbar model100in step96. For example, the busbar designer may desire a specific circular configuration, shown inFIG.11E, over another circular configuration, shown inFIG.11F. The last sub-step in step88is the selection of the edge detail of the busbar model100, as shown in step98. For example, the designer may select a coined edge detail104, as shown inFIGS.12A-12B, or a circular weld pattern106, as shown inFIGS.12C-12D. It should be understood that any weld pattern shown in16F-16H may be utilized instead of the circular weld pattern shown in16E. In making this selection, the busbar designer may keep the edge detail consistence throughout the busbar model100or may vary the edge detail contained within the model100. Changes in the edge detail may be desirable to aid in the bending of the busbar. For example, the design may choose to use a combination of a weld pattern and the coined edge detail in the areas that will be bent, while only using a weld pattern in other fused segments220of the busbar100. It should be understood that the exemplary non-engineering busbar models68a,68bmay utilize the edge detail that is shown by the circular weld pattern106. When making the above selections, it may desirable for the designer to ensure that: (i) the thickness of the conductors90is greater than 0.01 mm, (ii) the width of the conductors90is greater than 1 mm and preferably between 10-25 mm, and (iii) there are more than two conductors90within the busbar and preferably between 5 and 35 conductors13. It should be understood that the above described configurations, shapes, arrangements, and edge details are only examples of possible selections and other similar configurations, shapes, arrangements, and edge details are contemplated by this disclosure. Returning toFIG.6, once the materials and configuration of the conductors90is selected in step74, then the busbar designer can identify segments220of the intermediate portion200of the busbar100to be fused in step110. In turn by identifying the segments220of the intermediate portion200of the busbar100that are to be fused, the design is also identifying the segments520of the busbar100that are to be left unfused. The designer will identify these segments220based upon a number of factors, which may include: (i) width of the busbar, (ii) the geometry of the bend (e.g., in-plane750or out-of-plane760) contained within the busbar, (iii) the number of conductors90contained, (iv) thickness of the conductors90, (v) material properties of the conductors90, (vi) fusion type or method, (vii) commercial throughput of the machine performing the fusion, (viii) total number of bends contained within the busbar, (ix) spacing of the bends within the busbar, (x) other customer specifications, and (xi) other factors that are obvious to one of skill in the art based upon the above list of factors. Once the designer has analyzed some or all of the above factors, the designer can determine whether the intermediate portion200of the busbar model100should contain: (i) no fused segments220and only unfused segments520, (ii) only one fused segment220(seeFIG.13A)222that extends between both end portions720, or (iii) contain multiple fused segments220(seeFIG.13B)224. It should be understood that a fused segment220is less flexible or more rigid, or more stiff then an unfused segment520. The following are non-limiting examples of how the fused segments220and unfused segments520may be selected and arranged within a busbar100. In one example, the intermediate portion200may not include any fused segments220, if: (i) the busbar100does not contain any bends (see68e), (ii) the bends contained within the busbar100are out-of-plane760and have a wide bend radius, or (iii) the designer determines that the busbar100does not need to include such segments. If the busbar designer determines that the busbar model100does not need to contain any fused segments220, then the designer can move onto the next step in this process. In a second example, the intermediate portion200may only include one fused segment220(shown inFIG.13A), if: (i) the busbar100only contains a single bend, (ii) if the overall length of the busbar100is short (e.g., less than 8 inches) and the busbar100includes multiple bends, (iii) if the overall length of the busbar100is not long (e.g., greater than 3 feet) and the busbar100only contains a single bend type (e.g., in-plane750or out-of-plane760) or (iv) the designer determines that the busbar100only needs to include this single segment. One of the primary reasons that a designer may choose to use only a single fused segment220is because the variance in manufacturing times between using a single segment and multiple segments does not justify trying to create multiple segments. Determining that the busbar100should include one fused segment220requires the busbar designer determine the general properties of that segment220. These general properties are based on the designer's analysis of the some or all of the factors described above. Alternatively, if the busbar model100contains non-bent extents, out-of-plane bends760, and in-plane bends750, then the designer may choose to utilize multiple fused segments220. This may be desirable because the designer can vary the properties of each fused segment220, which in turn provides the welds that are necessary for certain extents of the busbar100but does not require that the entire busbar100be welded at a frequency that is only adapted to the bend that requires the most force. Varying of the properties permits improved manufacturing times and eliminates the possible of over welding the busbar100. Determining that the busbar should include multiple segment220within the busbar requires the busbar designer determine the location and general properties of each segment220contained within the busbar100. Various examples250,254,258,262,266,270,274of busbar models100that contain multiple fused segments220are shown inFIGS.14A-14G. For example, the designer may choose to utilize the busbar design250shown inFIG.14Ain order to build the busbar100shown in the non-engineering busbar model68b. This is because the intermediate portion200of the non-engineering busbar model68bonly contains two similar in-plane bends750and thus both of the fused segments220,251can have the same general properties250a. These general properties250ainclude: (i) stiffness, (ii) ductility, (iii) flexibility, (iv) flexural modulus, (v) resilience, or (vi) other similar properties. Additionally, the non-engineering busbar model68bhas a non-bent extent252that is positioned between the two fused segments220. The designer can choose to use an unfused segment520for this non-bent extent252of the busbar100. Accordingly, this example layout for the non-engineering busbar model68bwill contains: (i) two end portions700,702a,702band (ii) an intermediate portion200. The intermediate portion200includes: (i) two fused segments220,251a-251bthat has the same general properties250aand (ii) one unfused segment520that has the general properties250bthat are associated within the individual conductors90in their specific arrangement, which are contained within that segment520. This exemplary configuration of fused and unfused segments220,520contained within non-engineering busbar model68bwill allow the busbar100to achieve the in-plane bends750that are shown in connection with the model68band will allow the non-bent extent252to flex, expand, contract, absorb vibration, or move as required by the busbar100during operation of the customer's application, product, component, or device that is shown inFIG.5. This provides a significant advantage over conventional busbars10,20, as described above. In another example, the designer may choose to utilize the busbar design254shown inFIG.14Bin order to build the busbar100shown in the non-engineering busbar model68a. This is because the intermediate portion200of the non-engineering busbar model68acontains: (i) two similar in-plane bends750and thus both of these fused segments220,253a-253bcan have the same first set of general properties254a, and (ii) two similar out-of-plane bends760and thus both of these fused segments220,253c-253dcan have the same second set of general properties254b. However, as shown inFIG.14B, the first set of general properties254ais different from the second set of general properties254b. These first and second sets of general properties254a,254bare different because the bends are different. For example, the welds contained within the first set of general properties254awill need to be more frequent than the welds contained within the second set of general properties254bdue to the fact that the in-plane bends750place a higher amount of force on the conductors90in comparison to force placed on the conductors90due to the out-of-plane bends760. Additionally, the non-engineering busbar model68ahas a non-bent extent256that is positioned between the innermost fused segments220,253a. The designer can choose to use an unfused segment520for this non-bent extent256of the busbar100. Accordingly, the above example layout for the non-engineering busbar model68awill contains: (i) two end portions700,702a,702band (ii) an intermediate portion200. The intermediate portion200includes: (i) two fused segments220,253a-253b, wherein each segment has a first set of general properties254a, (i) two fused segments220,253c-253d, wherein each segment has a second set of general properties254b, and (ii) one unfused segment520that has the general properties254cthat are associated within the individual conductors90in their specific arrangement, which are contained within that segment520. This exemplary configuration of fused and unfused segments220,520contained within non-engineering busbar model68awill allow the busbar100to achieve the in-plane bends750that are shown in connection with the model68aand will allow the non-bent extent256to flex, expand, contract, absorb vibration, or move as required by the busbar100during operation of the customer's application, product, component, or device that is shown inFIG.5. This provides a significant advantage over conventional busbars10,20, as described above. Alternatively, the designer may choose to utilize the busbar design258shown inFIG.14Cin order to build the busbar100shown in the non-engineering busbar model68a. This is because the intermediate portion200of the non-engineering busbar model68acontains: (i) four bends and thus these fused segments220,259a-259d, can have a first set of general properties258a, and (ii) three extents that are positioned between these bends that can account for forces that radiate from the four bends and thus these fused segments220,259e-259jcan have a second set of general properties258b. As shown inFIG.14B, the first set of general properties258ais different from the second set of general properties258b. These first and second sets of general properties258a,258bare different because the forces experienced by these regions are different. Additionally, the non-engineering busbar model68ahas a non-bent extent260that is positioned between the innermost fused segments220,259b. The designer can choose to use an unfused segment520for this non-bent extent256of the busbar100. Accordingly, the above example layout for the non-engineering busbar model68awill contains: (i) two end portions720a,702band (ii) an intermediate portion200. The intermediate portion200includes: (i) four fused segments220,259a-259d, wherein each segment has a first set of general properties258a, (i) three fused segments220,259e-259j, wherein each segment has a second set of general properties258b, and (ii) one unfused segment520that has the general properties258cthat are associated within the individual conductors90in their specific arrangement, which are contained within that segment520. In a second alternative, the designer may choose to utilize the busbar design262shown inFIG.14Din order to build the busbar100shown in the non-engineering busbar model68a. This is because the intermediate portion200of the non-engineering busbar model68acontains four bends and thus these fused segments220,263can have a first set of general properties262a. Additionally, the non-engineering busbar model68ahas non-bent extents264a-264ethat surround the fused segments220,263that have a second set of general properties262b. The designer can choose to use an unfused segment520for these non-bent extents264a-264eof the busbar100. Accordingly, the above example layout for the non-engineering busbar model68awill contains: (i) two end portions702a,702band (ii) an intermediate portion200. The intermediate portion200includes: (i) four fused segments220,264a, wherein each segment has a first set of general properties258a, and (ii) five unfused segment520that has the general properties264cthat are associated within the individual conductors90in their specific arrangement, which are contained within that segment520. In a third alternative, the designer may choose to utilize the busbar design250shown inFIG.14Ain order to build the busbar100shown in the non-engineering busbar model68a. In this alternative example, the designer may utilize the weld frequency required for the in-plane bends750for all four bend regions. This may be beneficial because the manufacturing times may not vary enough to alter the general properties for each of type of bend. Finally, busbar layouts266,270, and274may contain multiple fused segments220and multiple unfused segments520. Specifically, busbar design266may be used in the creation of the busbar1000cshown inFIG.79. While busbar design270may be used in the creation of the busbar1000dshown inFIG.80, busbar bar design274may be used in the creation of the busbar1000eshown inFIG.81. Overall, it should be understood that the intermediate portion200may contain any number (e.g., 0-1000) of fused regions220and any number (e.g., 0-1000) of unfused regions520. For example, the intermediate portion200may only contain a single fused region220. Returning toFIG.6, once the fused segments220of the intermediate portion200of the busbar100have been identified in step110, then the busbar designer can select a method of fusing the identified segments220within the intermediate portion200and end portions700in step114. Examples of fusion methods that may be selected are shown withinFIG.15. In particular, these fusion methods include: (i) laser welding800, (ii) resistance welding900, (iii) cold form910, (iv) arc welding920, (v) electron beam welding930, (v) orbital welding940, (vi) ultrasonic welding950, (vii) friction welding960, (viii) any combination of the above methods970, or (ix) other known methods for fusing metal980. In making this selection, the designer may consider some or all of the following: (i) configuration of conductors90, (ii) number of conductors90, (iii) density of the conductors90, (iv) thickness of the conductors90, (v) material properties of the conductors90, (vi) general properties of the fused segments220, (vii) number of fused segments220, (viii) frequency of the fused segments220, (ix) commercial throughput requirements, (x) width of the busbar, (xi) other customer specifications, and (xii) other factors that are obvious to one of skill in the art based upon the above list of factors If the designer selects laser welding800, then the designer may select: (i) laser type802, (ii) laser power804, (iii) laser beam shape806, (iv) laser path808, and/or (v) other factors810. The laser type802may be any type of laser that is designed to solidify, weld, or cut metal. For example, the laser type802that may be used is a fiber-based laser that has a wavelength that is between 688 nm and 1080 nm. The laser power804may be any power that is configured to weld the busbar100in the desired manner. For example, the laser power804may be between 0.5-25 kW, preferably between 1-6 kW, and most preferably between 2-5 kW. The laser beam shape806may also take any desirable shape, including only a central core820(shown inFIG.16A), a ring822surrounding a central core820(shown inFIGS.16B-16D), a central core and two adjacent cores, wherein these adjacent cores are positioned in front of the central core when utilizing the laser, or other similar configurations. Not only can the general shape of the laser beam be controlled, the power and size associated with each of these features may also be controlled. Examples of how these power levels may be changed are shown inFIGS.16B-16D. Specifically,FIG.16Bshows a beam shape806where the central core820is set to a first power level and the ring822is set to a second power level that is lower than the first power level. For frame of reference, the central core power may vary between 0.5-12 kW, preferably between 1-5 kW, and most preferably between 2-4 kW, while the ring power may vary between 0.5-15 kW, preferably between 1-4 kW, and most preferably between 1-2.5 kW. Additionally, the diameter of the central core820and the diameter of the ring may be changed. For example, these diameters by vary between 50 and 600 μm. After selecting the laser type802, laser power804, and laser beam shape806, the designer may select the laser path808. Exemplary laser paths808are shown inFIGS.16E-16H. It should be understood that these laser paths808are not the overall path the laser will follow on the busbar100. Instead, these laser paths808are a component of the overall path the laser will follow. For example, the laser may oscillate in a circular path832while following a sine pattern on the top of busbar100. Alternatively, the laser may oscillate in a circular path832while following a linear edge of the busbar100. As shown inFIGS.16F-16G, shapes other than a circle may be followed, such as a line834, a figure eight836, or an infinity sign838. Finally, the designer can select other variables like processing times, cool down times, and the alike. Instead of going with a laser based fusion process, the designer may choose to go with a resistance spot welding fusion process900. Here, the designer will select: (i) the fabrication mode902, (ii) the power level that is applied to the electrode904, (iii) the roller type906, if the mass fabrication mode is selected in902, and (iv) other like variables908. This process will be discussed in greater detail below in connection withFIGS.73-75. It should be understood that the designer may choose to use any one of the above fusion methods in connection with applying an external pressure to the conductors90in order to keep the conductors90properly arranged when the conductors90are undergoing this fusion process. It should also be understood that different fusion methods may be utilized in connection with different portions, segments, regions of the busbar100. For example, the end portions700may be formed using a resistance welding method900, while the intermediate portion200may be formed using a laser welding method800. In further alternative embodiments, the fused segments220may be created using a process that deposits material around the conductors90within the busbar100. For example, this may use a 3D printer or may slip a material sleeve over the conductors90to form this fused region220. Upon selecting the fusion method for the identified segments within the intermediate portion200and the end portions700in step114, the designer proceeds to determine the combination pattern for the identified fused segments220within the intermediate portion200of the busbar100. Returning toFIG.6, once the fusion method has been selected in step114, then the busbar designer can determine the combination pattern for the identified fused segments220within the intermediate portion200of the busbar100in step118. Because the general properties of each fused segment220were already identified in connection with step110, step118focuses on converting these general properties (e.g.,250a,254a,258a) into manufacturable properties. The designer analyses these general properties (e.g.,250a,254a,258a), the properties associated with selected the fusion process, and other relevant properties in order to determine the combination pattern for the identified fused segments220. This combination pattern or specifically this segment combination pattern300can be generated from two components, a top segment fusion pattern304and a bottom segment fusion pattern308. Forming the segment combination pattern300from these two components304,308is desirable because the fusion method is typically configured to only partially penetrate the conductors90contained within the busbar100due to the fact that full penetration of all conductors90may mechanically weaken the busbar100. To reduce the number of fully solidified regions, the busbar100is welded from the top of the busbar100and the bottom of the busbar100in a manner that does not fully penetrate all conductors90contained within the busbar100. In other words, the top and bottom welds are typically configured to be partial solidified regions. These welds will be discussed in greater detail in connection withFIGS.36-47. While it may be desirable to split the segment combination pattern300into two components, it should be understood that the segment combination pattern300may remain as a single component and the fusion of the segment220may only occur on a single side (e.g., top or bottom) of the busbar100. Creating the top and bottom segment fusion patters304,306, whose combination form the segment combination pattern300, is a multiple step process that is described in connection withFIG.17A. Here, the first step in this process is selecting the number of waveforms320in step124. The number of waveforms320that may be selected can be any number (e.g., 0-100), is preferably between 1-6, and most preferably is two330,340. It is desirable to use two waveforms330,340because: (i) the waveforms330,340can be arranged to minimize the distance along the edges of the busbar100that do not contain welds and (ii) it limits regions that will overlap with the bottom fusion pattern306. After selecting the number of waveforms320in step124, the designer can select the type of waveform320in step126. Exemplary waveform types are shown inFIGS.18A-18R. Examples of the waveforms contained withinFIG.18are: (i) sine wave (FIG.18A), (ii) triangle (FIG.18B), (iii) ramp up (FIG.18C), (iv) ramp down (FIG.18D), (v) square (FIG.18E), (vi) pulse (FIG.18F), (vii) line (FIG.18G), (viii) rounded pulse (FIG.18H), (ix) circular pulse (FIG.18I), (x) triangular pulse (FIG.18J), (xi) ramp pulse (FIG.18K), (xii) sine cubed (FIG.18L), (xiii) flame (FIG.18M), (ixv) semicircle (FIG.18N), (xv) and other waveforms (FIGS.180-18R). It may be desirable to use a waveform320that contains curvilinear shapes because these waveforms do not contain multiple acute angles that may introduce additional stresses into the busbar100when it is manipulated. Nevertheless, waveforms that include acute angles may be used if the designer takes adequate precautions (e.g., only using them in segments that will undergo an out-of-plane bend760). Additionally, it should be understood that the waveform types shown inFIG.18are only exemplary waveform types and that other types may be used. Once the designer selects the waveform type in step126, the designer then selects the amplitude of the waveform320in step128and the frequency of the waveform320in step130. While any amplitude may be selected in step128, it may be desirable to select an amplitude of the waveform320that enables the apex of the waveform to come close to the edges of the busbar100but not extend over the edges of the busbar100. This may be desirable because this will reduce welding spatter, if the designer is utilizing a laser welding fusion process800, and in turn reduces the number of sharp edges contained within the busbar100. Similarly, while any frequency may be selected in step130, it should be understood that the frequency of the waveform320is one of the leading factors that alters the properties of the busbar100. Thus, the frequency of the waveform320should be selected such that the top segment fusion pattern304meets a portion of the general property requirements (e.g.,250a,254a,258a), which in turn allows the fused region to meet the requirements associated with the bend, and this in turn allows the busbar100to meet at least some of the customer specifications50that were received within step52. Once this process is completed for the top segment fusion pattern304, the designer can then perform the same steps to create the bottom fusion pattern308. In particular, the designer will: (i) select the number of waveforms in step134, (ii) select the waveform type in step136, (iii) select the amplitude in step138, and (iv) select the frequency in step140. Finally, after both the top and bottom segment fusion patterns304,308are created, the designer can then align these patterns304,308on the busbar100to form the segment combination pattern300. In particular, it may be desirable to align the patterns304,308in a manner that minimizes overlap between the patterns304,308because their alignment or intersection will create a fully solidified region. For example, the designer may offset the patterns304,308by 90 degrees in order to minimize this overlap. Other methods of minimizing the number of fully solidified region include: (i) stopping and starting the waveforms320to avoid creating overlapping areas, (ii) decreasing the number of conductors90that are fused within these overlapping/intersecting regions/points by the selected fusion process, or (iii) choosing a different waveform type that minimizes the number of overlapping areas (seeFIG.21B). In summary, the combination segment fusion pattern300includes a top segment fusion pattern304and a bottom segment fusion pattern308, wherein the top and bottom fusion patterns304,308comprise of at least one waveform320that has an amplitude and a frequency. It should be understood that in alternative embodiments, the top segment fusion pattern304or the bottom segment fusion pattern308may be omitted, the top or bottom segment fusion patterns may include only a single waveform, and/or the waveform may be a straight line (i.e., have an amplitude of zero). As discussed above, numerous factors are considered in formulating the general properties (e.g.,250a,254a,258a) of each of the fused segments220in step110, which in turn means that numerous factors are considered when generating the segment combination pattern300. In considering these numerous factors, it should be understood that the bend geometry may be one of the leading factors in determining the waveform type, amplitude, and frequency. This is because significantly different forces are placed on the conductors90that are contained within the busbar100in connection with the in-plane bends750in comparison to the out-of-plane bends760. Also, as discussed above, the frequency of the waveform320is one of the leading factors that alters the properties of the busbar100within the fused segment220. Taking these specific factors into consideration, it can be seen that the frequency of the waveforms contained within the segment combination pattern302b,302cincreases betweenFIGS.20A-20B. This increase in frequency is designed to account for the fact thatFIG.20Ais designed for an out-of-plane bend760, whileFIG.20Bis designed for an in-plane bend750. Another leading factor that alters the properties of the busbar100within the fused segment220is the width of the busbar100. Taking this and other factors into consideration, it can be seen that the frequency of the waveforms contained within the segment combination pattern302d,302eincreases betweenFIGS.20C-20D. This increase in frequency is designed to account for the fact thatFIG.20Cis designed for a busbar that has a first width, whileFIG.20Dis designed for a busbar that has a second width that is larger than the first width. It should be understood that the number, type, amplitude, frequency of the waveforms contained within the may be: (i) consistent across the entire fused segment220, or (ii) may not be consistent across the entire fused segment220. For example, the frequency of the waveform320may vary within a single fused segment220. Examples showing a segment combination pattern302f,302gthat contain waveforms that have varying frequency are shown inFIGS.21A-21B. In particular, the waveforms contained within these segment combination pattern300increase their frequency as they approach the center of the fused segment220. This configuration may be desirable, if the center of the fused segment220is centered over a bend in the busbar100because it will provide additional rigidity to the busbar100in this region and in turn will reduce the probability of delamination of the conductors90contained within the busbar100. Additionally, it should be understood that the designer may change other variables to achieve the desired properties of the busbar100. Examples include, but are not limited to: (i) the width of each of the waveforms330,340,350,360may be the same, different or may vary across the fused segment220, and (ii) the number of conductors90that are solidified by each waveform330,340,350,360may be the same, different, or may vary across the fused segment220. Like the process that is described above in connection with determining the combination pattern for the identified fused segments220in step118, the busbar designer can determine the combination pattern for the end portions700of the busbar100in step150. Specifically, the end combination pattern400may be determined based upon the connector that the designer plans on attaching to the busbar100. For example, a first end combination pattern400amay be used in connection with end portions700designed to receive a connector2000, while a second end combination pattern402bmay be used for the end portions700designed to receive an aperture formed therethrough. After selecting the desired properties, the designer may follow the same steps that are described above in connection with determining the segment combination pattern300. Specifically, the top fusion pattern404is determined in step154by: (i) selecting the number of waveforms in step156, (ii) the waveform types are selected in step158, (iii) the amplitude of the waveforms is selected in step160, and (iv) the frequency of the waveforms is elected in step162. Next, the bottom fusion pattern410is determined in step164by: (i) selecting the number of waveforms in step166, (ii) the waveform types are selected in step168, (iii) the amplitude of the waveforms is selected in step170, and (iv) the frequency of the waveforms is elected in step172. Finally, in step174, the top and bottom fusion patterns404,410are arranged in a manner that minimize overlap between the top and bottom fusion patterns404,410in step174. As shown inFIGS.22A-22E, the end combination pattern400may take the form of: (i) overlapping rectangles402a, as shown inFIG.22C, (ii) spiraling rectangles402b, as shown inFIG.22B, or (iii) spiraling circles402c, as shown inFIG.22C. It should be understood that the spiraling circles or rectangles402,404may be desirable because there is no overlap between the end fusion patterns404,410. Once the segment combination pattern300and end combination pattern400are determined, the designer can replace the general properties (e.g.,250a,254a,258a) with these combination patterns300,400. An example of this replacement is shown in connection withFIGS.23A-23D. Specifically, the general properties that were determined in connection with the exemplary250,254,258,262busbar models100inFIGS.14A-14Dare replaced by the combination patters300,400that meet these general properties inFIGS.23A-23D. Focusing first onFIG.23A, the intermediate portion200includes: (i) two fused segments220,251a-251band (ii) one unfused segment520,252. The general properties250aof fused segments220,251a-251bhave been replaced by segment combination patterns452a-452b, wherein each pattern452a-452bincludes a top fusion pattern453that is shown in solid lines and a bottom fusion pattern454that is shown in broken lines. The top and bottom fusion patterns453,454are comprised of two waveforms, wherein each waveform has a waveform type that is a sine wave, has an amplitude that is just shorter than the width of the busbar100, has a consistent frequency, and is offset from the other waveform by 180 degrees. The top and bottom fusion patterns453,454are offset by 90 degrees from one another in order to minimize their overlap with one another. As described above, the unfused segment520,252that is positioned between the fused segments251a-251bmaintains the same properties250b, described above in connection withFIG.14A, because this extent of the busbar100is not modified by a fusion process. Finally, the end portions700,702a,702bhave been modified to include end combination pattern456a-256b, wherein each pattern456a-456bincludes a top fusion pattern457that is shown in solid lines and a bottom fusion pattern458that is shown in broken lines. The top and bottom fusion patterns457,458are comprised of concentric rectangles are offset from each other in order to minimize their overlap. Focusing next onFIG.23B, the intermediate portion200includes: (i) four fused segments220,253a-253dand (ii) one unfused segment520,256. The general properties254aof the first two fused segments220,253a-253bhave been replaced by segment combination patterns462a-462b, wherein each pattern262a-462bincludes a top fusion pattern463athat is shown in solid lines and a bottom fusion pattern464athat is shown in broken lines. The top and bottom fusion patterns463a,464aare comprised of two waveforms, wherein each waveform has a waveform type that is a sine wave, has an amplitude that is just shorter than the width of the busbar100, has a consistent frequency, and is offset from the other waveform by 180 degrees. The top and bottom fusion patterns463a,464aare offset by 90 degrees from one another in order to minimize their overlap with one another. The general properties254bof the second two fused segments220,253c-253dhave been replaced by segment combination patterns462c-462d, wherein each pattern262c-462dincludes a top fusion pattern463bthat is shown in solid lines and a bottom fusion pattern464bthat is shown in broken lines. The top and bottom fusion patterns463b,464bare comprised of two waveforms, wherein each waveform has a waveform type that is a sine wave, has an amplitude that is just shorter than the width of the busbar100, has a consistent frequency, and is offset from the other waveform by 180 degrees. The top and bottom fusion patterns463b,464bare offset by 90 degrees from one another in order to minimize their overlap with one another. As shown inFIG.23B, the waveforms contained within the segment combination patterns462c-462dhave a lower frequency than the waveforms contained within the segment combination patterns462a-462b. This lower frequency is selected because segments253c,253dare configured to be bent out-of-plane760, while segments253a,253bare configured to be bent in-plane750. As described above, the unfused segment520,256that is positioned between the fused segments253amaintains the same properties254c, described above in connection withFIG.14B, because this extent of the busbar100is not modified by a fusion process. The end portions700,702a,702bhave been modified to include end combination pattern466a-466b, wherein each pattern466a-466bincludes a top fusion pattern467that is shown in solid lines and a bottom fusion pattern468that is shown in broken lines. The top and bottom fusion patterns467,468are comprised of concentric rectangles are offset from each other in order to minimize their overlap. Focusing next onFIG.23C, the intermediate portion200includes: (i) ten fused segments220,259a-259jand (ii) one unfused segment520,260. The general properties254aof the four of the fused segments220,259a-259dhave been replaced by segment combination patterns472a-472d, wherein each pattern272a-472dincludes a top fusion pattern473athat is shown in solid lines and a bottom fusion pattern474athat is shown in broken lines. The top and bottom fusion patterns473a,474aare comprised of two waveforms, wherein each waveform has a waveform type that is a sine wave, has an amplitude that is just shorter than the width of the busbar100, has a consistent frequency, and is offset from the other waveform by 180 degrees. The top and bottom fusion patterns473a,474aare offset by 90 degrees from one another in order to minimize their overlap with one another. The general properties254bof the other six fused segments220,259e-259jhave been replaced by segment combination patterns472e-472j, wherein each pattern272e-274jincludes a top fusion pattern473bthat is shown in solid lines and a bottom fusion pattern474bthat is shown in broken lines. The top and bottom fusion patterns473b,474bare comprised of two waveforms, wherein each waveform has a waveform type that is a sine wave, has an amplitude that is just shorter than the width of the busbar100, has a consistent frequency, and is offset from the other waveform by 180 degrees. The top and bottom fusion patterns473b,474bare offset by 90 degrees from one another in order to minimize their overlap with one another. As shown inFIG.23C, the waveforms contained within the segment combination patterns472c-472dhave a higher frequency than the waveforms contained within the segment combination patterns472e-472j. This higher frequency is selected because segments259a-259dare configured to be bent in-plane750, while segments259e-472jare configured to account for forces that radiate from the four in-plane bends750in segments259a-259d. As described above, the unfused segment520,260that is positioned between the fused segments259e,259hmaintains the same properties258c, described above in connection withFIG.14C, because this extent of the busbar100is not modified by the fusion process. The end portions700,702a,702bhave been modified to include end combination pattern476a-476b, wherein each pattern476a-476bincludes a top fusion pattern477that is shown in solid lines and a bottom fusion pattern478that is shown in broken lines. The top and bottom fusion patterns477,478are comprised of concentric rectangles are offset from each other in order to minimize their overlap. Focusing next onFIG.23D, the intermediate portion200includes: (i) four fused segments220,263a-263dand (ii) five unfused segments520,264a-264e. The general properties262aof the four of the fused segments220,263a-263dhave been replaced by segment combination patterns482a-487d, wherein each pattern282a-482dincludes a top fusion pattern483athat is shown in solid lines and a bottom fusion pattern484athat is shown in broken lines. The top and bottom fusion patterns483a,484aare comprised of two waveforms, wherein each waveform has a waveform type that is a sine wave, has an amplitude that is just shorter than the width of the busbar100, has a consistent frequency, and is offset from the other waveform by 180 degrees. The top and bottom fusion patterns483a,484aare offset by 90 degrees from one another in order to minimize their overlap with one another. As described above, the unfused segment520,264a-264ethat are positioned between the fused segments263a-263dmaintain the same properties264c, described above in connection withFIG.14D, because this extent of the busbar100is not modified by the fusion process. The end portions700,702a,702bhave been modified to include end combination pattern486a-486b, wherein each pattern486a-486bincludes a top fusion pattern487that is shown in solid lines and a bottom fusion pattern488that is shown in broken lines. The top and bottom fusion patterns487,488are comprised of concentric rectangles are offset from each other in order to minimize their overlap. Once the engineering model100are created, the designer can then digitally test these models100(e.g.,450fromFIG.23A) to determine if a busbar manufactured based upon the model100will meet the customer specifications50. Here, the model is bent using a digital bending machine179and the electrical properties of model are tested using a voltage testing system181. Such testing can be accomplished using a finite element (FE) model of the busbar100. If the busbar model100passes these tests then the designer can proceed to the next step the process. However, if the busbar model100fails these tests179,181, then the designer can start the designing process all over again. B. Fabricating the Inventive Busbar Returning toFIG.4, once the engineering model100has passed the digital tests that are set forth in step180, the designer can start the fabrication process in step182. This fabrication process182is a multiple step process that is described in greater detail withinFIG.25. At a high level, this process182includes: (i) obtaining a plurality of conductors1090, (ii) fusing the identified segments1220within the intermediate portion1200according to the engineering model100in step184, (iii) fusing the end portion(s)1700of the busbar1000according to the engineering model100in step186, (iv) adding the selected edge detail to the busbar1000in step188, and (v) performing optional fabrication steps such as adding in connectors in step190, insulating the busbar1000in step192, and/or plating an extent of the busbar1000in step194. As shown inFIG.25, the first step in this multiple step process182is obtaining a plurality of conductors1090and then fusing the identified segments1220within the intermediate portion1200according to the engineering model100in step184. To perform this step184, the busbar designer/manufacture obtains the conductors1090and then utilizes a machine798that is capable of performing the fusion method that was selected when creating the engineering model100. For example, if the designer decided to use a laser welding fusion method, then the designer would utilize the laser welding machine850that is shown in at leastFIGS.26-28,48A,49A,52-53. As shown in these Figures, the laser welding machine850includes two separate lasers852,854that can simultaneously weld the busbar from the top and bottom of the busbar1000. The two separate lasers852,854are preferably aligned in a horizontal plane. However, it should be understood that the laser welding machine850may have other configurations, which include: (i) only one laser852that can interact with only one side of the busbar1000at a time, (ii) only one laser852, but the light output from the laser is modified, using optics and mirrors, such that the laser can interact with both sides of the busbar1000at the same time, or (iii) two lasers852,854that are not aligned. As shown inFIG.26, after the designer acquires or obtains access to the laser welding machine850, the designer will: (i) insert the conductors90that have been arranged according to the engineering model100into the machine and (ii) load in the engineering model100. The laser welding machine850will then perform the weldment process that is described within the engineering model100. For example,FIG.26shows the laser welding machine850creating welds1600based upon the top fusion pattern452athat is shown inFIG.23A. After the laser welding machine850performs the weldment process in step186, the machine850performs the fuses the end portion(s)1700of the busbar1000according to the engineering model100in step186. In particular, this step can be seen in connection withFIG.27, where the end portions1700of the busbar1000are welded1600according to top fusion pattern456athat is shown inFIG.23A. In creating this fused segment1220, the designer/manufacture has at least made this segment1220of the busbar more rigid or stiffer than the segment1220was before this welding process1600was performed. After the top and bottom surfaces of the busbar1000have undergone the weldment process in connection with steps186,187, the edge detail is added to the busbar1000in step188. In the example that is shown inFIG.28, the edge detail that was selected for this example is the edge weldment process106fromFIG.12C-12D. This edge detail may have been selected during the design phase because it: (i) help fuse the edge portions of the busbar1000that typically undergo a large amount of stress when the busbar1000is bent, and (ii) it helps ensure that any material that was forced to the edges of the busbar1000during the top and bottom weldment process is rounded off, which prevents the busbar1000from having sharp edges that can create holes within the insulation. Specifically,FIG.28show the welding machine850including a laser852that can create welds1600on the edges or sides of the busbar1000. These welds1600followed on the previously selected circle pattern (FIG.16E). It should be understood that this set may be omitted from the process or the welding pattern may be altered to a different pattern (e.g., increase the strength of the laser on the edge portions and decrease the laser in the center of the busbar1000). It should be understood that the depth of the welds on the edges or sides may be varied within a busbar1000or may be varied for the specific application. The fabrication steps184,186,188lead to the formation of the busbar1000shown inFIGS.29-35based on the engineering model100that is shown inFIG.23A. It should be understood that busbar1000is an exemplary embodiment of the inventive busbar and that other embodiments are disclosed within this application and are contemplated by this disclosure.FIGS.29-35show that the busbar1000includes: (i) an intermediate portion1200and (ii) two end portions1700. Referring toFIG.29, the intermediate portion1200extends between end boundary lines1200a,1200b, while the end portions1700extends outward from end boundary lines1200a,1200b. The intermediate portion includes: (i) two fused segments1220and (ii) one unfused segment1520. Also, in the embodiment shown inFIG.29, the fused segments1220extend between the end boundary lines1200a,1200band an intermediate boundary line1220a,1220b. The unfused segment1520is not welded and thus contains an unsolidified region1670. Accordingly, an extent of the individual conductors1090are visible withinFIGS.29-35. The fused segments1220were created from welds1600generated based on the top fusion pattern453and bottom fusion pattern454of the segment combination fusion pattern452a, shown inFIG.23A. The welds1600,1602contained within the fused segment1220include four waveforms1610,1612,1614,1616, wherein two waveforms1610,1612are disposed on the top surface1000aof the busbar1000and two waveforms1614,1616are disposed on the bottom surface1000bof the busbar1000. Each of the four waveforms1610,1612,1614,1616is a sine wave, has an amplitude that is less than the width of the busbar1000, and a frequency that is consistent across the entire fused segment1220. The top sine waves1610,1612are arranged such that they are 180 degrees out of phase with each other. The bottom sine waves1614,1616are arranged such that they are also 180 degrees out of phase with each other. In addition, the combination of the top sine waves1610,1612is 90 degrees out of phase with the combination of the bottom sine waves1614,1616. Additionally, the sides or edges of the busbar1000also contain welds1600,1606based upon the selected edge detail106. Further, the end portions700were created from welds1600generated based on the top fusion pattern457and bottom fusion pattern458of the end combination fusion pattern456ashown inFIG.23A. Here, the top fusion pattern457and bottom fusion pattern458include concentric rectangles. FIGS.37-39show cross-sectional views of the busbar1000shown inFIG.37, where the top surface1000aof the busbar100includes welds1600,1602,1604. Cross-sectioning this busbar1000along the longitudinal center line37-37, shows that: (i) welds1602create partially solidified regions1650in the fused segments1220of the intermediate portion1200of the busbar1000, (ii) welds1604create a densified end portion1700, and (iii) areas that did not undergo a weldment process remain unsolidified1670. The partially solidified regions1650are formed within the fused segment220of the intermediate portion200because the weldment process combines some, but not all, of the conductors1090contained within weldment zone1660into a single consolidated conductor. Referring toFIG.39, a partially solidified region1650extends from a first side1000aof the busbar1000to a peak1656of the weld1600. Wherein the weld peak1656is positioned at a point that is located between the first and second surfaces1000a,1000bof the busbar1000and preferably an appreciable distance inward from the first and second surfaces1000a,1000b. The partial solidification zone is a zone1660of the busbar1000that extends between the top surface1000aand the bottom surface1000bthat has undergone a partial penetration weldment process. The partial solidification zone1660has a height that extends between the first and second surfaces1000a,1000b. Stated another way, the partial solidification zone1660has a height that is equal to fused segment height HF and is greater than the partially solidified height HP. The partial solidification zone1660has a width ZW that is equal to at least the diameter or cross-sectional width of the partially solidified region1650. The weld1600has a weld depth DW that extends from the first surface1000ato the weld peak1656. A weld depth DW in a partially solidified region1650has a partially solidified height HP. The partially solidified height HP is less than the total fused segment height or thickness HF of the busbar1000. Because partially solidified height HP is less than the fused segment height HF, an unsolidified region1670is formed between the weld peak1656and the second surface1000bof the busbar1000. This unsolidified region1670has an unsolidified height HU, which extends between the second surface1000band the peak1656of the weld1600. The unsolidified height HU is typically at least 10% of fused segment height HF and is preferably between 20% and 60% of fused segment height HF. On the other hand, partially solidified height HP is equal to at least 10% of the fused segment height HF, is preferably between 35% and 80% of the fused segment height HF, and is most preferably between 45% and 70% of the fused segment height HF. In this exemplary embodiment, a partially solidified region1650may be created by solidifying between two and nine conductors1090. Here,FIG.39shows that approximately seven of the ten conductors1090are solidified in the partially solidified region1650. In other words, not all—approximately three—of the conductors1090are not solidified and thus these conductors1090are in the unsolidified region1670. Stated another way, the intermediate portion1200of the busbar1000includes a plurality of conductors1090that traverse or spans the intermediate portion1200of the busbar1200. The fused segment1220of the intermediate portion1200contains a partial solidification zone1660that extends between the upper most surface1000aof the plurality of conductors and the lowermost surface of the plurality of conductors1000b. A majority of the extents of the conductors1090contained within this partial solidification zone1660have been solidified into a single consolidated conductor to form a partially solidified region1650. Likewise, a minority of the extents of the conductors1090contained within this partial solidification zone1660have unsolidified. As best shown inFIG.39, the partially solidified region1650contains varying fusing density, wherein a first or inner zone1652has a first fusing density and the second or outer zone1654has a fusing second density that is less than the first fusing density. The differences in density result from the configuration and operating conductions of the laser welding machine850, where the laser beam loses strength as it penetrates into the busbar1000. The less dense zone1654is created at a certain distance outward of the center of the weld1600or beyond the more dense zone1652. It should be understood that this second zone1654may have a fusing density gradient, where it has a higher fusing density closest to the first zone1652and the lowest fusing density at a furthest point away from the first zone1652. It also should be understood that the fusing density may be consistent or substantially consistent within this first zone1652. Additional aspects of the partially solidified region1650and unsolidified region1670are presented in the definitions section at the outset of the detailed description. In a first non-limiting example, the settings that may be used in connection with the laser welding machine850, for a busbar1000that includes 10 copper conductors1090having a height or thickness HC that is equal to 0.01 inches or 0.254 mms, are: (i) laser type is a fiber laser, (ii) power of the laser is 2000 W, (iii) laser beam shape is a central core, (iv) there is no laser path, and (v) cycle time is set to 0.116 seconds. These settings for the machine850form a partially solidified region that extends approximately 56% of the way into the busbar1000and has a diameter of approximately 0.24 mm at its widest point. In another example, the settings that may be used in connection with the machine850for a busbar1000that includes 10 copper conductors1090having a height HC that is equal to 0.01 inches or 0.254 mm, are: (i) laser type is a fiber laser, (ii) power of the laser is 5000 W, (iii) laser beam shape is a central core with a ring, wherein the core has a power of 1500 W and the ring has a power of 3500 W, (iv) there is no laser path, and (v) cycle time was set to 0.079 seconds. These settings for the machine850form a partially solidified region1650that extends approximately 77% of the way into the busbar1000and has a diameter of approximately 0.732 mm at its widest point. In another example, the settings that may be used in connection with the machine850, for a busbar1000that includes 10 copper conductors1090having a height HC that is equal to 0.01 inches or 0.254 mms, are: (i) laser type is a fiber laser, (ii) power of the laser is 5000 W, (iii) laser beam shape is a central core with a ring, wherein the core has a power of 1500 W and the ring has a power of 3500 W, (iv) there is no laser path, and (v) cycle time was set to 0.158 seconds. These settings for the machine850form a partially solidified region that extends approximately 79% of the way into the busbar1000and has a diameter of approximately 0.732 mm at its widest point. In addition to containing the partially solidified regions1650, the fused segment1220within the intermediate portion1200of the busbar1000contains unsolidified regions1670. As shown in the Figures, a majority of the volume contained within the fused segment1220contains unsolidified regions1670. The substantial volume of1670ensures that the busbar1000has properties that include attributes of rigid busbars10and flexible busbars20. It should be understood thatFIGS.37-39only show partially solidified regions1650because the cross-section37-37is taken along an extent of the busbar1000that does not contain overlapping or intersecting weld that extend from both the top and bottom of the busbar1000.FIG.37also shows the cross-section of the end portions1700of the busbar1000. Unlike the intermediate portion1200, the end portions1700are intended to receive a connector and as such it is desirable for these areas to be fully solidified as a single consolidated conductor. As discussed above, the end portions1700are welded in manner that causes these portions to be densified (enough solidified surface area to equal 120% of the busbar's100cross sectional area) such that they can be coupled to a connector. Turning toFIGS.40-43, the section plane of the busbar1000is offset from the longitudinal center1000cof the busbar1000towards a peripheral edge1000eand at the location where the top welds1602that were formed from the top surface1000aintersect with the bottom welds1602that were formed from the bottom surface1000b. These intersection locations form fully solidified regions1690because a significant extent of the conductors1090are solidified downward from the top surface1000aand a significant extent of the conductors1090are solidified upward from the bottom surface1000b. Accordingly, these significant extents of the conductors1090meet between the top and bottom surfaces1000a,1000b, typically in the midpoint region between the two surfaces100a,100b, and form a fully solidified region1690. The weld depth DW in a fully solidified region1690has a fully solidified height HFS. The fully solidified height HFS is substantially equal to fused segment height HF of the busbar1000. In certain exemplary embodiment, the fully solidified height HFS may be greater than the fused segment height HF when weldment material is deposited onto one of the two surfaces100a,100bcreating a “dome-effect”. Because weld depth DW is equal or greater than the fused segment height HF, an unsolidified region1670is not formed between weld and the second surface1000bof the busbar1000. In other words, all of the intermediate extents of the conductors1090that are positioned within the full solidification zone1688are solidified into a single consolidated conductor. Additional aspects of the fully solidified region1690are presented in the definitions section at the outset of the detailed description. Like the partially solidified zone1660, the fully solidified zone1688is an area of the fused segment1220of the intermediate portion1200of the busbar1000, where the zone extends between the top surface1000aand the bottom surface1000bthat has undergone a partial penetration weldment process. The full solidification zone1688has a height that extends between the first and second surfaces1000a,1000b. Stated another way, the full solidification zone1660has a height that is equal to fused segment height HF and may be equal to the fully solidified height HFS The full solidification zone1688has a width ZW that is at equal to at least the diameter or cross-sectional width of the fully solidified region1690. Like the partially solidified region1650, the fully solidified region1690contains varying fusing density, wherein a first or inner zone1692has a first fusing density and the second or outer zone1694has a second fusing density that is less than the first fusing density. The differences in fusing density result from the configuration and operating parameters of the machine850, where the laser beam loses strength as it penetrates into the busbar1000and thus the less dense zone1694is created at a certain distance outward from the center of the weld1600or beyond the more dense zone1694. It should be understood that this second zone1694may have a fusing density gradient, where it is has a higher fusing density closest to the first zone1692and the lowest fusing density a furthest point away from the first zone1652. It also should be understood that the fusing density may be consistent or substantially consistent within this first zone1652. As shown inFIGS.42and43, the unsolidified region1670surrounds the fully solidified region1690, such that the individual conductors1090in the unsolidified region1670remain distinct, un-fused components. FIGS.44-45show a cross-sectional view of the busbar1000taken along section plane defined by line45-45ofFIG.44and revealing multiple regions that have been partially and fully solidified. First, middle extent ofFIG.45shows three partially solidified regions1650, wherein the two outer regions1650are formed from the bottom weldment process and the middle region1650is formed from the top weldment process. Second, the opposed edge zones1693are solidified with edge welds1606resulting from the circular edge detail106contained in the busbar model100that was used to create busbar1000. These edge welds1606form fully solidified edge regions1693that extend inward from the outer peripheral edges1000d,1000eof the busbar1000. In particular, these fully solidified edge regions1693extend from a first peripheral edge1000d,1000eto the interior weld boundary1696and thus have a width WW, wherein WW may be between 0.2 mm to 5 mm or preferably between 0.2 mm to 1 mm. In addition to solidifying the edges1000d,1000eof the busbar1000, this edge detail106also rounds off the corners1698of the busbar1000. These rounded corners1698help reduce the probability that the conductors1090wear into or tear the insulation1780. FIGS.46-47show a cross-sectional view of the busbar1000taken along a section plane denoted by line47-47ofFIG.46and revealing multiple fully regions that have been fully solidified. First, the middle extent ofFIG.47shows two fully solidified regions1690that are adjacent to unsolidified regions1670. Second, the opposed edge zones1693are solidified with edge welds1606resulting from the circular edge detail106contained in the busbar model100that was used to create busbar1000. These edge welds1606form fully solidified edge regions1693that extend inward from the outer peripheral edges1000d,1000eof the busbar1000. In particular, these fully solidified edge regions1693extend from a first peripheral edge1000d,1000eto the interior weld boundary1696and thus have a width WW, wherein WW may be between 0.2 mm to 5 mm or preferably between 0.2 mm to 1 mm. In addition to solidifying the edges1000d,1000eof the busbar1000, this edge detail106also rounds off the corners1698of the busbar1000. These rounded corners1698help reduce the probability that the conductors1090wear into or tear the insulation1780. As shown inFIGS.29-33, the busbar1000includes a fused segment1220that has a length, width, and height. The length extends between the end boundary lines1200a,1200band intermediate boundary line1220a,1220b, the width extends between the edges of the busbar1000d,1000e, and the height extends between the top surface1000aand bottom surface100b. The length, width, and height dimensions collectedly define a fused segment volume V, which can be summed to determine a total fused segment volume of the busbar1000. Each of the fused segment volumes contain a plurality of fully solidified regions1690, a plurality of partially solidified regions1650, a substantial unsolidified solidified region1670. The fused segment volume also contains the unsolidified region1670that extends between and around the plurality of fully solidified regions1690and the plurality of partially solidified regions1650. In the busbar1000that is shown inFIGS.29-47, the unsolidified region1670occupies a majority of the fused segment volume, while the combination of the partially solidified regions1650and the fully solidified regions1670occupy a minority of the fused segment volume. Additionally, the partially solidified regions1650occupies more of the fused segment volume than the fused segment volume that is occupied by the fully solidified regions1670. Moreover, the fully solidified region1670occupies less of the fused segment volume than the fused segment volume that is occupied by either of the partially solidified regions1650or unsolidified region1670. Further referring to the busbar1000that is shown inFIGS.29-47, it should be understood that increasing the volume of the partially solidified regions1650within the fused segment volume: (i) will increase at least the localized stiffness in the fused segment1220, (ii) tends to increase the stiffness of the intermediate portion1200of the busbar1000, and (iii) tends to increase the overall stiffness of the busbar1000. For example, creating these partially solidified regions1650will increase the modulus Young's modulus of the busbar above 115 gigapascals (GPa) at room temperature. It should also be understood that increasing the volume of the fully solidified regions1690within the fused segment volume: (i) will increase at least the localized stiffness in the fused segment1220, (ii) tends to increase the stiffness of the intermediate portion1200of the busbar1000, and (iii) tends to increase the overall stiffness of the busbar1000. Increasing the volume of the fully solidified regions1690within the fused segment volume should have a greater effect on these stiffness parameters, as compared as solely increasing the volume of the partially solidified regions1650. Further, adding a partially solidified region1650and/or fully solidified region1690to fused segment1220having only an unsolidified region1670will increase the localized and overall stiffness of the fused segment1220. Moreover, it should further be understood that increasing the volume of both the partially solidified regions1650and the fully solidified regions1690within the fused segment volume: (i) will increase at least the localized stiffness in the fused segment1220, (ii) tends to increase the stiffness of the intermediate portion1200of the busbar1000, and (iii) tends to increase the overall stiffness of the busbar1000. Finally, it should be understood that increasing the volume of unsolidified region1670within the fused segment volume: (i) will increase at least the localized flexibility in the fused segment1220, (ii) tends to increase the flexibility of the intermediate portion1200of the busbar1000, and (iii) tends to increase the overall flexibility of the busbar1000. As discussed above, the intermediate portion1200may contain any number (e.g., 0-1000) of fused regions1220and any number (e.g., 0-1000) of unfused regions1520. For example, the intermediate portion1200may only contain a single fused region1220or may only contain an unfused region1520. Additionally, the fused segment1220may contain number of waveforms (e.g., 0-100), is preferably between 1-6, and most preferably is four1610,1612,1614,1618. As such, the fused segment1220may contain any number of partially solidified regions1650or fully solidified regions1690. For example, the fused segment1220may be almost solid due to the fact it contains a high number of fully solidified regions1690or may almost be unsolidified because the fused segment only contains a single weld1600in a small volume (e.g., single laser dot). Further, any waveform type, frequency, and amplitude may be utilized in order to meet the customer specifications. Overall, the unfused segments1520may perform in a manner that is similar to a conventional flexible busbar20and the fused segment1220may perform in a manner that is similar to a conventional rigid busbar10. These integrally formed segments1220,1520provide significant benefits over conventional busbars10,20. An optional step of forming the inventive busbar1000includes encasing the conductors1090in a protective material or insulation1780that encases a subset of the busbar1000. The insulation1780may be a heat-shrunk material (e.g., CPX 100 EV from Shawcor). In alternative embodiments, the insulation1780may be tape or any other type of material that may be used to coat the busbar1000. In a further alternative embodiment, the insulation1780may be formed around the busbar1000using an insulation machine1782that utilizes centering process1784that are shown inFIG.48A-48D. Specifically, the use of this process1784helps prevent high scrap rate or marginally passing HI Pot parts, which are formed because the busbar1000can move within the cavity during the injection of the material that will act as an insulator1780. The machine1782shown inFIGS.48A-48Dutilize biased pins1786a,1786bthat hold the busbar1000within the center of the mold1788. The pins1786a,1786bmay be biased using a spring, magnet, or any other biasing mechanism. As shown in the transition fromFIG.48B to48C, the pressure from the insertion of the insulation material1790will force the pins1786a,1786boutward from the center, which allows the busbar1000to be fully encapsulated by the insulator1780and substantially centered within the insulator1780. Thus, reducing hot spots or scrap busbars. Finally,FIG.48Eshows finished busbar1000that has been removed from the mold1788and wherein the conductors1090of the busbar1000are surrounded by the insulator1780. The insulation1780may include an identification device, symbol, logo, or indicia (e.g., names, QR codes, or radio frequency identification devices (“RFID”)) that is formed within the insulation1780. These identification device, symbol, logo, or indicia may help manufacture ensure the busbars are installed in the right locations and aid in the track/inventory of the busbars1000. It should be understood the insulation1780may include shielding properties that reduce the electromagnetic noise that is generated by these busbars1000. As shown inFIGS.48A,49Aand after the top, bottom, and sides of the busbar1000are welded and the joints are formed, the end portions500of the busbar1000may be formed using the welding machine850. In forming the end portions500, a densification weld is created and then an attachment means is added thereto. The attachment means may be either an opening that is configured to receive a conventions coupler24or a boltless connector system2000that includes a spring member440a, or any other attachment mechanism for use with a busbar. The boltless connector system2000is described in a number of applications that are owned by the assignee of this application and are incorporated herein by reference. These application, include PCT/US2019/36127, PCT/US2019/36070, PCT/US2019/36010, and PCT/US2018/019787, U.S. patent application Ser. No. 16/194,891 and U.S. Provisional Applications 62/897,658, 62/988,972 and 63/058,061. At a high level, an extent of the system2000is shown inFIGS.7,49A-49B,63-66,79-81,83-84, which provide various views of the male connector assembly2200. The male connector assembly2200includes: (i) a male terminal receiver2260, (ii) a male terminal assembly2430. The male terminal receiver2260is formed from an arrangement of terminal receiver side walls2262a-2262d. The side walls2262a-2262dform a bowl shaped receiver2266. The receiver2266is configured to snugly receive a majority of the male terminal assembly2430. This configuration provides additional rigidity to the male terminal assembly2430and limits the exposed amount of the male terminal assembly2430. However, the entire male terminal assembly2430is not enclosed within the male terminal receiver2260or the body2226because then the male terminal assembly2430would then be prevented from contacting the female terminal assembly2800. Thus, to facilitate the coupling of the male terminal assembly2430to the female terminal assembly2800, the side walls2262a-2262deach have male terminal openings2268a-2268dthere through. The male terminal openings2268a-2268dare disposed through an intermediate portion of the side walls2262a-2262dand are configured to permit an extent of the male terminal assembly2430to extend through the side walls2262a-2262dto enable the male terminal assembly430to contact the female terminal assembly2800. FIGS.7,49A-49B,63-66provide various views of the male terminal assembly2430. Specifically, the male terminal assembly2430includes a spring member2440aand a male terminal2470. The male terminal2470includes a male terminal body2472and a male terminal connection member or plate2474. The male terminal connection plate2474is coupled to the male terminal body2472and is configured to receive an extent of the busbar1000that connects the male terminal assembly2430to a device (e.g., an alternator) outside of the connector system2000. The male terminal body2472includes: (i) an arrangement of male terminal side walls2482a-2482dand (ii) a rear terminal wall480. The arrangement of male terminal side walls2482a-2482dare coupled to one another and generally form a rectangular prism. The male terminal side walls2482a-2482dinclude: (i) a side wall portion2492a,2492c, which generally has a “U-shaped” configuration and (ii) contact arms2494a-2494h. The side wall portions2492a-2492dare substantially planar and have a U-shaped configuration with an intermediate segment. The contact arms2494a-2494hextend: (i) from an extent of the intermediate segment of the side wall portion2492a-2492d, (ii) away from the rear male terminal wall2480, and (iii) across an extent of the contact arm openings. The contact arms2494a-2494hextend away from the rear male terminal wall2480at an outward angle. This configuration allows the contact arms2494a-2494hto be deflected or displaced inward and towards the center of the male terminal2470by the female terminal assembly800, when the male terminal assembly2430is inserted into the female terminal assembly2800. This inward deflection is best shown in figures contained within PCT/US2019/036010. This inward deflection helps ensure that a proper mechanical and electrical connection is created by ensuring that the contact arms2494a-2494hare placed in contact with the female terminal assembly2800. The male terminal2470is typically formed from a single piece of material (e.g., metal). Therefore, the male terminal2470is a one-piece male terminal2470and has integrally formed features. To integrally form these features, the male terminal2470is typically formed using a die cutting process. However, it should be understood that other types of forming the male terminal2470may be utilized, such as casting or using an additive manufacturing process (e.g., 3D printing). In other embodiments, the features of the male terminal470may not be formed from one-piece or be integrally formed, but instead formed from separate pieces that are welded together. FIG.66show views of the spring member2440athat is configured to function with the first embodiment of the male terminal470. The spring member2440agenerally includes: (i) arched spring sections2448a-448dand (ii) spring arms2452a-2452h. The arched spring sections2448a-448dextend between the rear extent of the spring member wall2444and the spring arms2452a-2452h. The spring arms2452a-2452hare not connected to one another. This configuration allows for omnidirectional of the spring arms2452a-2452h, which facilitates in the mechanical coupling between the male terminal2470and the female terminal assembly2800. The spring member2440ais typically formed from a single piece of material (e.g., metal). To integrally form these features, the spring member2440ais typically formed using a die forming process. As discussed in greater detail below and in PCT/US2019/036010, when the spring member2440ais formed from a flat sheet of metal, installed within the male terminal2470and connected to the female terminal assembly800, and is subjected to elevated temperatures, the spring member440aapplies an outwardly directed spring thermal force, STF, on the contact arms2494a-2494hdue in part to the fact that the spring member2440aattempts to return to a flat sheet. However, it should be understood that other types of forming the spring member2440amay be utilized, such as casting or using an additive manufacturing process (e.g., 3D printing). In other embodiments, the features of the spring member2440amay not be formed from a one-piece or be integrally formed, but instead formed from separate pieces that are welded together. Additionally, it should be understood that the connector system2000is T4/V4/S3/D2/M2, wherein the system2000meets and exceeds: (i) T4 is exposure of the system100to 150° C., (ii) V4 is severe vibration, (iii) Si is sealed high-pressure spray, (iv) D2 is 200 k mile durability, and (v) M2 is less than 45 Newtons of force is required to connect the male connector assembly2200to the female connector assembly2600. In addition, it should be understood that the male terminal assembly2430and the female terminal assemblies2800disclosed within this application may be replaced with the male terminal assemblies and the female terminal assemblies disclosed within PCT/US2018/019787 or PCT/US2019/36010. In addition, the de-rating of some of these connectors is disclosed within PCT/US2020/14484. Further, it should be understood that alternative configurations for connector systems2000are possible. For example, any number of male terminal assemblies2430may be positioned within a single male housing assembly2220. For example, the male housing assembly2220may be configured to contain multiple (e.g., between 2-30, preferably between 2-8, and most preferably between 2-4) male terminal assemblies2430. The female connector assembly2600may be reconfigured to accept these multiple male terminal assemblies into a single female terminal assembly2800. Alternatively, the female connector assembly2600may be reconfigured to include multiple female terminal assemblies2800, where each female terminal assembly2800receives a single male terminal assemblies2430. Moreover, it should also be understood that the male terminal assemblies2430may have any number of contact arms2494(e.g., between 2-100, preferably between 2-50, and most preferably between 2-8) and any number of spring arms2452(e.g., between 2-100, preferably between 2-50, and most preferably between 2-8). As discussed above, the number of contact arms2494may not equal the number of spring arms. For example, there may be more contact arms2494then spring arms2452. Alternatively, there may be less contact arms2494then spring arms2452. Instead of bending the busbar1000in-plane750, two busbars1000a,1000bmay be joined together to form a single busbar. This may be beneficial when the customer's application does not allow for the space required for an in-plane bend750. Here, the two busbars1002,1004are joined together at a defined angle (e.g., 90 degrees) use a “densification weld.” A densification weld is designed to create enough comingled surface area to equal 120% of the busbar's100cross sectional area. This helps ensure that this area does not become a current restrictor and a heat generator. In the exemplary embodiment that is shown withinFIGS.67-72, this 90 degree weld is negligible to 10% less resistive that a straight busbar1000of equal length. This is extremely beneficial due to the fact that 90 bends cannot be achieved within conventional busbars without creating a resistive extent within the busbar. When welding two busbars1000together at a defined angle, the conductors90contained within each side of the busbar may have an overlapping, dovetailing, or interweaving arrangement. Two examples of this arrangement are shown inFIGS.67-68. Specifically,FIG.67shows two busbars1002,1004, where one busbar1002has a segment removed from two of the conductors1090and the other busbar1004has a segment removed from three of the conductors90. These removed segments are cooperatively dimensioned to fit within one another. Alternatively,FIG.68shows two busbars1002,1004, where two segments have been removed from the first busbar1002and three segments have been removed from the second bus bar1004. It should be understood that other overlapping, dovetailing, or interweaving arrangements are contemplated by this disclosure. Once the busbars have been arranged, the designer can welded to one another using the welding machine789that is shown inFIGS.69-70. The combine fusion pattern that the welding machine789may utilize are shown inFIGS.22C-22E. As an alternative to utilizing a laser welding machine850, the designer may have decided to use a resistance spot welding machine901. The resistance spot welding machine901may include two fabrication modes902a,902b, wherein the first fabrication mode902ais a prototype fabrication mode and the second fabrication mode902bis a mass production fabrication mode. In the first or prototype fabrication mode902a, the user controls the areas of the busbar1000that will be welded by manually feeding the busbar1000into the machine and then using a foot pedal to activate the machine901. Upon activation, the machine901will force the electrified electrodes909a,909binto contact with the conductors1090. This contact will cause the electricity from the electrodes909a,909bto form at least a partially solidify region1650. This contact procedure can be performed multiple times by the designer to form the fused segment1220of the busbar1000. Alternatively, the if the designer selects the second or mass production fabrication mode902b, then the designer will need to select the design of the roller electrodes906a,906b. Examples of these electrode designs are shown inFIGS.76-78. In particular the roller electrodes906a,906bmay have raised surfaces (FIG.76) or may have recessed surfaces (FIG.77-78). The raised surfaces will only make contact with the conductors1090of the busbar1000within these raised surfaces. This contact with the conductors1090by these raised surfaces will weld the busbar1000in these locations or areas. For example, the roller that is shown inFIG.76will form a pattern that contains two sine waves. In contrast, if the roller906a,906bhas recessed extents then these extends will not come into contact with the busbar1000and the weld areas will be the remaining surface of the roller906a,906b. For example, the roller shown inFIG.77will weld all area within the busbar1000except for the area that will be contained within the oval area. It should be understood that the exemplary rollers906a,906bare only examples and are non-limiting. Similar to the busbar1000as described above and shown inFIGS.1-79,FIG.79show a second embodiment of a busbar3000. For sake of brevity, the above disclosure in connection with busbar1000will not be repeated below, but it should be understood that across embodiments like numbers that are separated by2000represent like structures. For example, the disclosure relating to fused segment1220applies in equal force to fused segments3220. Further, it should be understood that the functionality of busbar3000is similar to, or identical to, the functionality disclosed in connection with busbar1000. The general properties of this second embodiment3000were identified in step110and shown inFIG.14E. In particular,14E shows that the busbar designer identified five fused segments3220and four unfused segments5220. The bending of these fused segments3220is shown inFIG.79, wherein four of these bends only have an in-plane3750aspect and the other bend has both an in-plane3750and out-of-plane aspects3760. Like busbar1000, busbar3000includes connectors4000that are identical to connectors2000. Similar to the busbar1000as described above and shown inFIGS.1-79,FIG.80show a third embodiment of a busbar5000. For sake of brevity, the above disclosure in connection with busbar1000will not be repeated below, but it should be understood that across embodiments like numbers that are separated by4000represent like structures. For example, the disclosure relating to fused segment1220applies in equal force to fused segments5220. Further, it should be understood that the functionality of busbar5000is similar to, or identical to, the functionality disclosed in connection with busbar1000. The general properties of this third embodiment5000were identified in step110and shown inFIG.14F. In particular,14F shows that the busbar designer identified five fused segments5220and four unfused segments5220. The bending of these fused segments5220is shown inFIG.80, wherein four of these bends only have an in-plane aspect5750and the other bend has both an in-plane5750and out-of-plane aspects5760. In addition, an extent of the unfused segment5520is bent in this embodiment5000. Like busbar1000, busbar5000includes connectors6000that are identical to connectors2000. Similar to the busbar1000as described above and shown inFIGS.1-79,FIG.81show a fourth embodiment of a busbar7000. For sake of brevity, the above disclosure in connection with busbar1000will not be repeated below, but it should be understood that across embodiments like numbers that are separated by6000represent like structures. For example, the disclosure relating to fused segment1220applies in equal force to fused segments7220. Further, it should be understood that the functionality of busbar7000is similar to, or identical to, the functionality disclosed in connection with busbar1000. The general properties of this fourth embodiment7000were identified in step110and shown inFIG.14G. In particular,14G shows that the busbar designer identified three fused segments7220and three unfused segments7220. The bending of these fused segments7220is shown inFIG.81, wherein these three bends only have an in-plane aspect7750. Like busbar1000, busbar7000includes connectors8000that are identical to connectors2000. Similar to the busbar1000as described above and shown inFIGS.1-79,FIG.82show a fourth embodiment of a busbar9000. For sake of brevity, the above disclosure in connection with busbar1000will not be repeated below, but it should be understood that across embodiments like numbers that are separated by8000represent like structures. For example, the disclosure relating to fused segment1220applies in equal force to fused segments9220. Further, it should be understood that the functionality of busbar9000is similar to, or identical to, the functionality disclosed in connection with busbar1000. Unlike busbar1000, busbar9000includes conventional bolted connectors10,999. C. Deliver and Install Busbar(s) Once the busbar1000intermediate portion1200and end portions1700formed, there are a number of options for how the busbar1000can be delivered and installed within an environment, application, system, product, component or device. Specifically,FIG.51shows three different options199a,199b, and199c. The first option199ais where the busbar1000is shipped to the customer in a strait and flat configuration and the customer bends the bar1000to form all desired bends. Once the busbar1000contains the necessary bends, the busbar1000can be installed within the system (e.g., battery pack within a vehicle). The second option199bis where the busbar1000is bent in-plane1750and then shipped to the customer. In this configuration, the busbar1000does not contain any bends in the Z direction and thus is substantially flat. Once the customer receives that busbar1000, the customer can bend the busbar1000to form the out-of plane bends1760. Once the busbar1000contains the necessary bends, the busbar1000can be installed within the system (e.g., battery pack within a vehicle). Shipping the busbar1000in connection with the first or second options199a,199b, reduces the probability that the busbar1000will be damaged. In addition, the package size of the busbars can drastically be reduced; thus, saving a considerable amount of money that would have been spent on shipping costs. Finally, in the third option199c, the busbar1000can be shipped to the customer in a form that is ready to be installed within requiring the customer to perform additional bends. To bend the busbar1000into the configuration that is desirable, the busbar1000may have: (i) one or more in-plane bends1750, (ii) one or more out-of-plane bends1760, or (iii) may have a combination of one or more in-plane1750and one or more out-of-plane1760. As shown in the figures and discussed above, the in-plane bends1750are only formed within the fused segments1220of the busbar1000. This helps ensure that the individual conductors within the busbar1000do not delaminate due to this bend. In other words, the in-plane bends1750are not formed within the unfused segments1520of the busbar1000. In contrast, the out-of-plane bends1760may be formed within the fused segment1220or the unfused segment1520. This is because the out-of-plane bends1760do not cause the same stresses to be placed on the conductors1090that the out-of-plane bends1750place on the conductors1090. Thus, when the designer/manufacture is bending the busbar1000into its configuration for installation, the designer/manufacture must make sure that they are bending the busbar1000in the proper segments1220,1520. In addition, the busbar/manufacture must be able to apply the proper amount of force to bend the busbar1000in the desired shape. In an exemplary and non-limiting example, the pressure needs to bend an unfused segment1520of the busbar may require approximately 250 pounds of force. To bend a fused segment1220of the busbar1000, the designer will need to apply more force than to bend an unfused segment, but less than the force then what would be required to bend a fully solidified busbar. For example, this force need to bend a fused segment1220may be between 250 pounds and 500 pounds. To form these bends, the designer/manufacture may use any of the following machines780a,780b, or780cthat are shown inFIGS.52-55B. In particular,FIGS.780a,780bshow bending machines that are used to bend prototype busbars1000, whileFIGS.54-55Bshow bending machines that are used to bend busbars1000that are manufactured using a mass production assembly. The prototype bending machine780ainclude three spools782a,782b,782cthat have sides, which are configured to fully encase the busbar1000while bending. The middle spool782bis attached to arm784, which can be cranked down to apply downward pressure on the busbar1000in light of the positional relationship of the two end spools782a,782c. In other words, the middle spool782bacts as a mandrel that bends the busbar1000in-plane1750. The mass production machine780cautomates the functions of the prototype bending machines780a,780b. In particular,FIGS.55A and55Bshow how this mass production machine780ccan create both in-plane bends1750and out-of-plane bends1760in the busbar1000. It should be understood that these are only examples of machines780a-780cthat may be utilized to bend the busbar1000. For example, certain out-of-plane bends1760may not be bent by a machine and instead may be bent by hand. FIGS.83-84show a motor vehicle environment M that includes a power distribution system11000that includes a number of components, such as a charger, a battery pack assembly11002, a DC-DC converter, and an electrical motor. As shown inFIGS.83-84, the battery pack assembly11004has a skateboard configuration, wherein the battery pack assembly11002has a plurality (e.g.,36) of battery pack modules11006that are arranged in a substantially linear configuration that is positioned at or below vehicle axle level and below a majority of the motor vehicle body11008, when installed. The battery pack modules11006are formed from a plurality (e.g.,12) of cells, wherein the cells are coupled to one another to form a positive terminal11010and a negative terminal11012for each battery pack module11006. The positive terminals11010of these battery pack modules11006are coupled to one another (e.g., in parallel and in series) using busbars1000,3000,5000,7000,9000in order to create a battery pack11002that supplies proper voltage levels for operation of the motor vehicle M. Like the positive terminals11010, the negative terminals11012are similarly coupled together using busbars1000,3000,5000,7000,9000. It should be understood that the busbars1000,3000,5000,7000,9000may be used in components contained within the motor vehicle environment M that are outside of the battery pack assembly11002. In addition, the inventive busbars1000,3000,5000,7000are PCTR compliant, which not only reduces the height requirements of the busbars, but also simplifies installation. It may be desirable to gather the information obtained from fabricating and bending the busbars1000, which have been made from an engineering model100. This information can then be fed back into to the overall computer system in order to more accurately transform the non-engineering model68a-68hinto an engineering model100and test the engineering model100. For example, the information that may be fed back into the computer system can include: (i) whether the fusion method caused too may fully solidified regions, (ii) whether the fusion method did not cause the partially solidified regions to extent to a desirable depth, (iii) bending forces required to bend the fused segments1220, (iv) electrical properties of the fused segments, (v) whether the fused segment1220delaminated during bending, or (vi) other relevant information. The computer system may take this information and alter the FE model used within the testing. As this FE model is able to closely predict how the busbars1000will operate when they are fabricated, the designer may utilize this FE model to help transform the non-engineering model68a-68hinto an engineering model100. It should be understood that the information that is fed back into the computer system may be fitted and/or analyzed with a learning algorithm or a neural network. This analysis can then be used to modify the FE model in order to improve its accuracy, which in turn will allow for more accurate creation of the engineering models100, which will result in cheaper, better performing, and more durable busbars1000. MATERIALS AND DISCLOSURE THAT ARE INCORPORATED BY REFERENCE PCT Application Nos. PCT/US2020/49870, PCT/US2020/14484, PCT/US2020/13757, PCT/US2019/36127, PCT/US2019/36070, PCT/US2019/36010, and PCT/US2018/019787, U.S. patent application Ser. No. 16/194,891 and U.S. Provisional Applications 62/897,658 62/897,962, 62/897,962, 62/988,972, 63/051,639, 63/058,061, 29/749,790 and 29/749,813, each of which is fully incorporated herein by reference and made a part hereof. SAE Specifications, including: J1742_201003 entitled, “Connections for High Voltage On-Board Vehicle Electrical Wiring Harnesses—Test Methods and General Performance Requirements,” last revised in March 2010, each of which is fully incorporated herein by reference and made a part hereof. ASTM Specifications, including: (i) D4935-18, entitled “Standard Test Method for Measuring the Electromagnetic Shielding Effectiveness of Planar Materials,” and (ii) ASTM D257, entitled “Standard Test Methods for DC Resistance or Conductance of Insulating Materials,” each of which are fully incorporated herein by reference and made a part hereof. American National Standards Institute and/or EOS/ESD Association, Inc. Specifications, including: ANSI/ESD STM11.11 Surface Resistance Measurements of Static Dissipative Planar Materials, each of which is fully incorporated herein by reference and made a part hereof. DIN Specification, including Connectors for electronic equipment—Tests and measurements—Part 5-2: Current-carrying capacity tests; Test 5b: Current-temperature de-rating (IEC 60512-5-2:2002), each of which are fully incorporated herein by reference and made a part hereof. USCAR Specifications, including: (i) SAE/USCAR-2, Revision 6, which was last revised in February 2013 and has ISBN: 978-0-7680-7998-2, (ii) SAE/USCAR-12, Revision 5, which was last revised in August 2017 and has ISBN: 978-0-7680-8446-7, (iii) SAE/USCAR-21, Revision 3, which was last revised in December 2014, (iv) SAE/USCAR-25, Revision 3, which was revised on March 2016 and has ISBN: 978-0-7680-8319-4, (v) SAE/USCAR-37, which was revised on August 2008 and has ISBN: 978-0-7680-2098-4, (vi) SAE/USCAR-38, Revision 1, which was revised on May 2016 and has ISBN: 978-0-7680-8350-7, each of which are fully incorporated herein by reference and made a part hereof. Other standards, including Federal Test Standard 101C and 4046, each of which is fully incorporated herein by reference and made a part hereof. INDUSTRIAL APPLICABILITY This inventive busbar1000described herein includes many advantages over other busbar system that currently exists. Some of these advantages include: i) using less material, ii) weighing less, iii) providing sufficient current paths, which allows the busbars to carry more current without a substantial rise in temperature, iv) the ability to be shipped in a substantially flat configuration, which reduces shipping costs and reduces the chance the busbar may be deformed, v) can have bolt or boltless configurations, wherein the boltless configurations reduce labor costs associated with installation, vi) does not require special molds or fabrication techniques to enable the busbar1000to be custom fitted to a specific application, vii) does not require the combination of multiple different materials, which also increases the amount of current the buss bar100can handle without a substantial rise in temperature, viii) has a low profile configuration, which allows the designer to reduce the height of the battery pack, and ix) can be formed into complex geometries at or near the place the busbar is installed. While the foregoing has described what are considered to be the best mode and/or other examples, it is understood that various modifications may be made therein and that the subject matter disclosed herein may be implemented in various forms and examples, and that the teachings may be applied in numerous applications, only some of which have been described herein. For example, within the intermediate portion1200the busbar1000may not contain an unfused segment1520and may only contain fused segments1220. It is intended by the following claims to claim any and all applications, modifications and variations that fall within the true scope of the present teachings. Other implementations are also contemplated. While some implementations have been illustrated and described, numerous modifications come to mind without significantly departing from the spirit of the disclosure; and the scope of protection is only limited by the scope of the accompanying claims. Headings and subheadings, if any, are used for convenience only and are not limiting. The word exemplary is used to mean serving as an example or illustration. To the extent that the term includes, have, or the like is used, such term is intended to be inclusive in a manner similar to the term comprising as comprising is interpreted when employed as a transitional word in a claim. Relational terms such as first and second and the like may be used to distinguish one entity or action from another without necessarily requiring or implying any actual such relationship or order between such entities or actions. Phrases such as an aspect, the aspect, another aspect, some aspects, one or more aspects, an implementation, the implementation, another implementation, some implementations, one or more implementations, an embodiment, the embodiment, another embodiment, some embodiments, one or more embodiments, a configuration, the configuration, another configuration, some configurations, one or more configurations, the subject technology, the disclosure, the present disclosure, other variations thereof and alike are for convenience and do not imply that a disclosure relating to such phrase(s) is essential to the subject technology or that such disclosure applies to all configurations of the subject technology. A disclosure relating to such phrase(s) may apply to all configurations or one or more configurations. A disclosure relating to such phrase(s) may provide one or more examples. A phrase such as an aspect or some aspects may refer to one or more aspects and vice versa, and this applies similarly to other foregoing phrases. Numerous modifications to the present disclosure will be apparent to those skilled in the art in view of the foregoing description. Preferred embodiments of this disclosure are described herein, including the best mode known to the inventors for carrying out the disclosure. It should be understood that the illustrated embodiments are exemplary only, and should not be taken as limiting the scope of the disclosure. | 123,767 |
11862359 | BEST MODE FOR CARRYING OUT THE INVENTION Preferred examples and embodiments of the present invention pertaining to the first to the fourth aspects of the present invention are described below with use of drawings. However, the present invention is not limited by any of the following examples and embodiments. For example, components and conditions of these preferred examples and embodiments may be appropriately combined. Moreover, preferred examples may be used interchangeably among the respective aspects, and other components may be combined to an extent that is not problematic. Modification of positions, quantities, sizes, amounts, and the like are possible within a scope that does not deviate from the intent of the present invention. For example, the preferred example given in the description ofFIG.1may also be preferentially used in other examples of this aspect, unless otherwise specified. Regarding the First Aspect A first embodiment of the first aspect of the present invention is described below with reference to drawings, but the present invention is not limited by the pertinent embodiment. The first embodiment of the first aspect of the present invention relates to a conductive polymer fiber, and a biological electrode. More specifically, it relates to a conductive polymer fiber in which a conductive polymer impregnates or adheres to a base fiber, and to a biological electrode provided with the aforementioned conductive polymer fiber. First Embodiment of First Aspect A conductive polymer fiber10of the present invention shown inFIG.1(first embodiment) is a fiber wherein a base fiber11is coated with a conductor12containing PEDOT-PSS {poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid)} as conductive polymer.FIG.1is a cross-sectional view in the lengthwise direction of the conductive polymer fiber10, andFIG.3is a cross-sectional view in a direction orthogonal to the lengthwise direction. As the base fiber11is used as the core of the conductive polymer fiber10, and as its circumference is coated with the conductor12, the adhesive area of the two is large, constituting a composite fiber with sufficient mutual adhesion. When this configuration exists, the conductor12is reinforced by the base fiber11, with the result that strength can be increased compared to fiber that consists only of the conductor12. In particular, strength in wet and dry states is excellent. Moreover, the flexibility of the base fiber11at the core is imparted to the conductive polymer fiber10. There are no particular limitations on the type of the base fiber11, provided that it is composed of a polymer. For example, one may use synthetic fiber, vegetal fiber, animal fiber, and the like. It may consist of a single material, or a mixed material. As the aforementioned synthetic fiber, one may cite, for example, nylon, polyester, acrylic, aramid, polyurethane, carbon fiber, and so on. As the aforementioned vegetal fiber, one may cite, for example, cotton, hemp, jute, and so on. As the aforementioned animal fiber, one may cite, for example, silk, wool, collagen, elastic fiber composed of animal tissue, and so on. Among the enumerated base fiber materials, it is preferable to use animal-based fiber (protein-containing fiber), which has excellent adhesivity with the conductor12, high strength in dry and wet states, and flexibility appropriate for applications to clothing and the like. Furthermore, silk fiber is more preferable, because it has particularly excellent adhesivity and hydrophilicity relative to the below-mentioned PEDOT-PSS. The base fiber preferably consists of silk alone, but mixed material is also preferable if necessary. In the case of a silk mixture, the silk content may be from 0.1% to less than 100%, or from 1% to 95%, or from 3% to 90%, or from 10% to 80%, or from 30% to 70%, or from 40% to 60%. It is preferable to suitably mix it with other material according to the intended use. As silk fiber that may be used with the base fiber11, one may cite, for example, natural silk fiber of silkworms, spiders, and bees, as well as artificial silk fiber using gene recombination technology. Silk contains protein referred to as fibroin, and is fiber that has excellent hydrophilicity, biocompatibility, and stainability, as when used in clothing and surgical thread, and is one of the fibers that has been used by humanity since ancient times. Consequently, it may be optimally used as the base fiber11. The silk fiber used in the base fiber11may be either unprocessed raw silk from which the sericin that is the gelatinous component has not been removed, or refined silk from which the sericin has been partially or fully removed. Refined silk is preferable from the standpoint of raising adhesivity with the conductor12, and fiber strength. There are no particular limitations on the diameter (thickness) of the base fiber11, and it may be suitably selected according to application. As examples of diameter, one may cite, for instance, ranges of 0.1 μm to 1 mm, 1 μm to 1 mm, 1 μm to 0.5 mm, and so on. For example, a diameter of 1 μm to 100 μm is preferable when used in clothing, biological electrodes, biointerfaces, and the like. There are no particular limitations on the length of the base fiber11, and it may be suitably selected according to application. For example, one may set a length of 10 μm to 10 cm as an electrode for implantation into biological tissue, 1 mm to 50 cm for use in a biointerface on a body surface, 1 cm to 100 m as fiber material to be woven or knitted into an article of clothing, and so on, but one is not limited thereto, and the selection may be made according to necessity. There are no particular limitations on the base fiber11(41), and it may be selected according to necessity. For example, one may use twisted filament of a desired thickness obtained by twisting together multiple base fibers (see the example shown inFIG.6), and blended yarn that blends different types of base fiber. The form of the base fiber is not limited to the aforementioned thread form, and one may also use without problem a base fiber that is cord-like, cloth-like, ribbon-like, and so on. For purposes of enhancing the hydrophilicity of the base fiber11, it is also acceptable to use a base fiber that has been subjected to plasma treatment, pore treatment, or chemical coating. The conductor12includes conductive polymer, and may be composed only of conductive polymer, or may also include other additives. The conductive polymer used in the present invention is PEDOT-PSS {poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid)} which has excellent conductivity and hydrophilicity. PEDOT-PSS is a conductive polymer which can be obtained by polymerizing 3,4-ethylenedioxythiophene, which is a monomer, in the presence of poly(4-styrene sulfonic acid)}. PPS functions as a dopant that imparts a negative charge to PEDOT. In the present invention, it is preferable to include a dopant in the conductive polymer from the standpoint of raising the conductivity of the conductive polymer fiber. The present inventors discovered that the adhesivity of PEDOT-PSS and fiber containing protein such as silk is particularly excellent, and that the adhering surfaces of the two do not easily come apart. Based on this finding, in the present invention, it is more preferable to use silk fiber as the base fiber11, and PEDOT-PSS as the conductive polymer containing the conductor12. As other conductive polymers that may be used, polyaniline sulfonic acid and polypyrrole can be cited. With respect to the conductive polymer containing the conductor12, one type may be used, or two or more types may be used in combination. There are no particular limitations on the molecular weight of the conductive polymer used in the present invention. For example, molecular weights in a range from several thousand to several tens of thousand may be used, and may be optionally selected according to necessity. To cite specific examples, polystyrene-converted weight average molecular weight (Mw) may be in a range of 1000-900000, a range of 3000-450000, or a range of 5000-50000, but one is not limited to these ranges. As the method for forming the conductor12, one may cite a method which forms a conductor12composed only of conductive polymer by coating the base fiber11with a solvent containing conductive polymer such as PEDOT-PSS and a diluting solvent, and by drying the solvent. However, the conductor12may also contain additives other than the conductive polymer. As the aforementioned additives, one may cite, for example, glycerol, sorbitol, polyethylene glycol-polypropylene glycol copolymer, ethylene glycol, sphingosine, phosphatidylcholine, and so on. One type of additive may be included in the conductor12, or two of more types may be used in combination. The above-cited additives may be used for the purpose of adjusting the wetting properties of conductive polymer fiber such as PEDOT-PSS, and for the purpose of improving compatibility with biological tissue (skin or tissue) when used as a biological electrode by imparting flexibility. Otherwise, as specific examples of the aforementioned adjustment of wetting properties, one may cite, for example, adjustment of water absorbency, prevention of excessive swelling/contraction during wetting/drying, and so on. It is preferable to use PEDOT-PSS and the aforementioned additives in combination, because adjustment of the wetting properties of the conductor12is facilitated, and prevention of excessive swelling and drying is particularly facilitated. As to the reasons for this, it would seem that one factor is that inclusion of additives in advance as well as PEDOT-PSS that has a high degree of water absorbency reduces the scope for subsequent infiltration of moisture. With respect to additives used for the purpose of adjusting the wetting properties of PEDOT-PSS, and further imparting flexibility, among the foregoing examples, glycerol, sorbitol, polyethylene glycol, and polyethylene glycol-polypropylene glycol copolymer are particularly preferable. Even when used in a high humidity environment, the conductive polymer fiber10having the conductor12containing the aforementioned additives and PEDOT-PSS does not exhibit excessive moisture absorption, and has a high degree of fiber strength, and excellent conductivity. As it also combines excellent flexibility, the rough feel (rigidity) of PEDOT-PSS is moderated, and as it has excellent tactility and compatibility with biological tissue, it can compose biological electrodes that are capable of low-noise measurement of biological signals. As additives contained in the conductor12, one is not limited to the foregoing examples. For example, one may also use known organic solvents such as surface active agents, alcohols, natural polysaccharides, sugar alcohols, acrylic resins, and dimethyl sulfoxide. As the aforementioned surface active agents, one may cite known cationic surface active agents, anionic surface active agents, and non-ionic surface active agents. These surface active agents may be used alone or in combinations of two or more. As the aforementioned cationic surface active agents, one may cite, for example, quaternary alkyl ammonium salt, halogenated alkylpyridinium, and so on. As the aforementioned anionic surface active agents, one may cite, for example, alkyl sulfate, alkylbenzene sulfonate, alkyl sulfosuccinate, fatty acid salt, and so on. As the aforementioned non-ionic surface active agents, one may cite, for example, polyoxyethylene, polyoxyethylene alkyl ether, and so on. As the aforementioned alcohols, one may widely use known monovalent alcohols and polyvalent alcohols. With respect to these alcohols, one type may be used alone, or two or more types may be used in combination. As monovalent alcohols, one may cite, for example, methanol, ethanol, propyl alcohol, isopropyl alcohol, butanol, and so on. The carbon skeleton composing these alcohols may be straight-chained, branched, or cyclic. As polyvalent alcohols, one may cite, for example, glycols such as ethylene glycol; chain polyvalent alcohols such as glycerin; cyclic polyvalent alcohols such as glucose and sucrose; polymer polyvalent alcohols such as polyethylene glycol or polyvinyl alcohol, and polyethylene glycol-polypropylene glycol copolymer; and so on. As natural polysaccharides, one may cite, for example, chitosan, chitin, glucose, aminoglycan, and so on. As sugar alcohols, one may cite, for example, sorbitol, xylitol, erythritol, and so on. As the aforementioned acrylic resin, one may cite, for example, polyacrylic acid, polymethyl methacrylate, methyl polymethacrylate resin, and so on. There are no particular limitations on a thickness h of the conductor12that coats the circumference of the base fiber11, and it may be selected at one's discretion. Any thickness is acceptable, provided that the effects of the present patent application are obtained. For example, thickness may be 0.001 to 2-fold a diameter L of the base fiber11. The thickness h may be selected according to necessity, and, for example, it is acceptable to have a thickness that is 0.01 to 1-fold, a thickness that is 0.001 to 0.1-fold, a thickness that is 1 to 2-fold, or a thickness that is 0.1 to 1-fold the diameter L of the base fiber11. More specifically, for example, in the case where silk fiber of silkworms of 2-3 denier (D)—i.e., silk fiber with a fiber diameter of approximately 10-15 microns—is used as the core, a thickness of 0.01-10 microns is acceptable. Fiber diameter and the like may be measured by an optional method, and can be confirmed by such means as electron microscope photographs. If necessary, a less-than-complete coating of the base fiber with the conductor is also acceptable. In the present invention, the thickness may mean the length of a line which starts from a center of the base fiber to a surface and an end thereof is covered by the conductor. By coating the circumference of the base fiber11with the conductor12, the conductivity of the conductive polymer fiber10is raised, and conduction by contact of multiple conductive polymer fibers10is facilitated. Moreover, with the aforementioned thickness range, it is possible to obtain fiber having more excellent conductivity without impairing the flexibility of the conductive polymer fiber10. Within the aforementioned range, the greater is the thickness, the higher is the conductivity of the fiber that can be obtained. In short, the conductivity or electrical resistance of the conductive polymer fiber10can be adjusted by adjusting the thickness of the conductor12. <Conductive Polymer Fiber Production Method (1a)> The following method may be cited as an exemplary method for coating the surface of the base fiber11with the conductor12or causing adhesion of the conductor12to form the conductive polymer fiber10shown inFIG.1. First, an aqueous solution containing conductive polymer (e.g., a commercial PEDOT-PSS solution (Heraeus, Ltd.: CLEVIOS P)) is made to adhere to the surface of the base fiber11in a solution bath. Thereafter, or after uniformly applying the aforementioned solution to the surface of the base fiber11using a roller or a brush, a portion of the moisture contained in the aforementioned solution is removed by drying. Subsequently, an organic solvent such as acetone, methanol, ethanol or the like, or a fixing solution such as magnesium chloride solution is applied to gelatinize the conductive polymer of PEDOT-PSS or the like. By this means, a method which fixes the conductor12containing conductive polymer such as PEDOT-PSS to the surface of the base fiber11(hereinafter referred to as “production method 1a”) can be exemplified. As an example of the aforementioned aqueous solution, one may cite an aqueous solution containing conductive polymer of PEDOT-PSS or the like at a concentration of 0.1-50 (v/v) %. This concentration may be selected as necessary. For example, a concentration such as 1-30%, 30-50%, or 0.5-15% is also acceptable. Otherwise, the aforementioned aqueous solution may contain the aforementioned additives as necessary. In the present invention, as an aqueous solution containing conductive polymer, apart from the cited CLEVIOS P, any solution containing PEDOT-PSS can be used. <Method for Causing Inclusion of Additives> As a method for causing inclusion of additives in the conductor12, one may cite a method wherein the conductor12that was applied to the base fiber11by production method 1a is dried, after which the additive is applied to the surface of the obtained conductive polymer fiber10, or a method wherein a conductive polymer fiber10is immersed in a solution containing the additive for a prescribed time, after which the excess additive solution remaining on the surface is removed. As another method, one may use a mixed solution obtained by mixing the additive in the solution containing the conductive polymer that is used to be coated onto the surface of the base fiber11, and together apply the conductive polymer and additive, or perform immersion therein. As an example of the aforementioned mixed solution, one may cite an aqueous solution containing a conductive polymer such as PEDOT-PSS at a concentration of 0.1-50 (v/v) %, and an additive such as glycerol at a concentration of 0.1-50 (v/v) %. There are no particular limitations on the concentration of the additive in the conductor12in the present invention, and it may be set at, for example 0.1-50 wt %. This concentration may be selected as necessary, and, for example, 1-20 wt %, 20-50 wt %, or 0.1-5 wt % is also acceptable. Second Embodiment of First Aspect A conductive polymer fiber20of the present invention shown inFIG.2(second embodiment) is fiber in which a base fiber21is impregnated with a conductor22containing conductive polymer.FIG.2is a cross-sectional view in the lengthwise direction of the conductive polymer fiber20, andFIG.4is a cross-sectional view in a direction orthogonal to the lengthwise direction. As the conductor22permeates the interior of the base fiber21, the two constitute an integrated composite fiber. When this configuration exists, there is no risk that the conductor22may come apart from the base fiber21. Moreover, as the conductor22is reinforced by the base fiber21, strength can be increased compared to fiber composed of the conductor22alone, and it also endowed with the flexibility of the base fiber21. Otherwise, in the present invention, the entirety of the internal space of the base fiber may be filled by the conductor, but it is also acceptable if there is unfilled space. The conductor preferably reaches to the center of the interior of the base fiber, but there may also be portions where it does not reach there as necessary. With respect to the materials composing the base fiber21and the conductor22, the materials composing the base fiber11and the conductor12described in the first embodiment may be applied. As with the first embodiment, the conductor22preferably contains the aforementioned additives. <Conductive Polymer Fiber Production Method (1b)> As with the conductive polymer fiber20shown inFIG.2, as a method of immersing the conductor22in the base fiber21, an aqueous solution containing conductive polymer (e.g., a commercial PEDOT-PSS solution (Heraeus CLEVIOS P)) is immersed in the base fiber21for a prescribed time in a solution bath, after which a portion of the moisture contained in the aforementioned solution is removed by driving, and then an organic solvent such as acetone, methanol, ethanol or the like, or a fixing solution such as magnesium chloride solution is applied to gelatinize the PEDOT-PSS. By this means, a method which fixes the conductor22containing PEDOT-PSS to the surface of the base fiber21can be exemplified (hereinafter referred to as “production method 1b”). Otherwise, the aforementioned aqueous solution may contain the aforementioned additives as necessary. As a method for accelerating permeation of a solution containing a conductive polymer in the base fiber21, one may cite a method which conducts immersion with adjustment of the pH of the aforementioned solution, a method which subjects the base fiber21to mechanical operations such as tension or compression or the like during immersion, a method which heats the aforementioned solution during immersion, a method which conducts treatment such as pressure reduction or pressure application during immersion, and so on. Specifically, in the case where the base fiber21of silk or the like is immersed in a PEDOT-PSS solution, the pH of the aforementioned solution is preferably adjusted from 1-6. Third Embodiment of the First Aspect With respect to a conductive polymer fiber30of the present invention shown inFIG.5(third embodiment), a base fiber31is impregnated with a conductor32containing conductive polymer, the circumference of the base fiber31is coated with a metal33, and the circumference of the coated metal or carbon33is also coated with a conductor34.FIG.5is a cross-sectional view in a direction orthogonal to the lengthwise direction of the conductive polymer fiber30. Unless otherwise specified, “metal or carbon” is referred to below as “metal.” The third embodiment combines the above-described advantages of the first embodiment and the second embodiment. In addition, the coated metal33itself contributes to improving the conductivity of the conductive polymer fiber30. As the metal33is interposed between the conductor32and the conductor34, the metal33is not exposed on the fiber surface, thereby preventing corrosion or deterioration of the metal33. It is also acceptable to have a portion of the metal33exposed on the fiber surface as necessary. The materials composing the base fiber31and the conductors32and34may apply the materials composing the base fibers and the conductors described in the first embodiment and the second embodiment. As in the first embodiment and the second embodiment, the conductors32and34preferably contain the aforementioned additives. The material composing the conductor32and the material composing the conductor34may be identical, or may differ. There are no particular limitations on the type of metal33, and one may cite, for example, titanium, gold, silver, copper, carbon, and so on. Of these metals, gold is preferable due to its corrosion resistance, conductivity, and ductility. The aforementioned carbon preferably contains carbon atoms as the primary raw material, and examples of the primary raw material include, for example, carbon black, glassy carbon, graphene, carbon nanotube, and fullerene. The carbon content in these carbon materials is preferably 80-100 mass %, more preferably 90-100 mass %, and still more preferably 95-100 mass %. The metal33may use a single type of metal, or it may use two or more types of metal in combination. There are no particular limitations on the thickness of the metal33(metal layer or carbon layer) that coats the circumference of the base fiber31, and it may be suitably changed according to the type of metal. For example, one may cite a range of 0.1 nm to 1 mm. For instance, in the case where gold is used, its thickness may be set at 1 nm to 2 μm. The metal layer33may be formed by known film formation method such as the sputtering method or the non-electrolytic plating method. A carbon layer may be formed by a known film formation method such as carbon deposition. <Conductive Polymer Fiber Production Method (2a)> The following method may be cited as a method for producing the conductive polymer fiber30. First, by means of a known film formation method, the metal33is coated onto the conductive polymer fiber20obtained by production method 1b. The fiber obtained thereby is immersed in an aqueous solution containing conductive polymer (e.g., a commercial PEDOT-PSS solution (Heraeus CLEVIOS P)), and a direct current voltage of +0.5 V to 20 V is applied using this metal33as an electrode, thereby electrochemically fixing the conductive polymer of PEDOT-PSS or the like to the surface of the metal33to produce the conductive polymer fiber30. This method is hereinafter referred to as production method 2a. In this instance, a method which forms the metal layer over the circumference of the conductive polymer fiber20is exemplified, but it is also acceptable to adopt a method wherein a metal layer is simply formed on a base fiber, and a conductive polymer is similarly electrically fixed to the circumference of the aforementioned metal layer. Here, the conductive polymer fiber30is obtained with a more excellent conductivity by adding ethylenedioxythiophene (EDOT) to the aforementioned solution. The amount of ethylenedioxythiophene may be selected at one's discretion. For example, a 0.1 w/v % solution of ethylenedioxythiophene (Heraeus CLEVIOS M V2) or the like may be added to the aforementioned solution. <Conductive Polymer Fiber Production Method (2b)> One may also cite a method wherein the conductive polymer is electrochemically fixed without formation of the metal33. That is, the conductive polymer fiber20obtained by production method 1b is already conductive. Utilizing this conductivity, the conductive polymer fiber20obtained by production method 1b is added to a solution containing a conductive polymer (e.g., a commercial PEDOT-PSS solution (Heraeus CLEVIOS P)), and a direct current voltage of +0.5 V to 20 V is applied therein, thereby enabling production of conductive polymer fiber wherein the conductive polymer of PEDOT-PSS or the like is electrochemically fixed to the surface of the circumference of the conductive polymer fiber20. This method is hereinafter referred to as production method 2b. Otherwise, the aforementioned additives may be included in the aforementioned aqueous solution as necessary. A figure depicting the configuration of the conductive polymer fiber obtained by production method 2b is omitted, but it is a configuration wherein the metal33is removed from the conductive polymer fiber30shown inFIG.5, and the aforementioned metal33is replaced by the conductor34. Fourth Embodiment With respect to the conductive polymer fiber40of the present invention shown inFIG.6(fourth embodiment), a conductor42containing a conductive polymer is arranged between multiple base fibers41with close adhesion to the base fiber41.FIG.6is a cross-sectional drawing in a direction orthogonal to the lengthwise direction of the conductive polymer fiber40. The number of base fibers may be selected at one's discretion, and is an integer of two or more. For example, a number such as 2, 3, 4, 5, 6, 7, or 8 is acceptable. A number in a range of 1-30, or a number in a range of 1-1000 may be used. The conductive polymer fiber40may be formed into a high order structure such as twisted cord, cloth, or nonwoven cloth by intertwining and/or weaving together multiple base fibers41. As in the example shown inFIG.6, the conductive polymer fiber40may be configured as a high order structure such as twisted cord, cloth, or nonwoven cloth by arranging the conductor42containing PEDOT-PSS, which is a conductive polymer, among multiple base fibers41with close adhesion to the base fiber, and by intertwining and/or weaving together the multiple base fibers41. As the conductor42assumes the role of bonding the multiple base fibers41, the strength of the aforementioned high order structure can be increased. Furthermore, as a relatively large amount of the conductor42can be placed among the multiple base fibers41, a conductive polymer fiber of more excellent conductivity is obtained. The reference amount compared here is the amount of conductor placed on the surface of a single base fiber. There are no particular limitations on the method for producing the conductive polymer fiber40. For example, one may cite a method wherein the aforementioned high order structure is immersed in a solution containing conductive polymer, and this is dried. The fiber interval between the multiple base fibers may be selected at one's discretion. For example, the fiber interval between base fibers41may be set at 0.01-3 times the diameter of the base fiber. For example, in the case where a base fiber41with a diameter of 10 μm to 15 μm is used, it may be set to 0.01 μm to 50 μm. When the fiber interval is within such a range, a sufficient amount of the conductor42can be placed between the fibers. The materials composing the base fiber41and the conductor42may apply the materials composing the base fiber and the conductor described in the first embodiment. As in the first embodiment, the conductor42preferably contains the aforementioned additives. Fifth Embodiment of the First Aspect A conductive polymer fiber50of the present invention shown inFIG.7(fifth embodiment) is a fiber wherein a conductor54containing conductive polymer is placed between multiple base fibers51that are internally impregnated with a conductor52containing conductive polymer, and closely adheres to the base fiber51.FIG.7is a cross-sectional view in a direction orthogonal to the lengthwise direction of the conductive polymer fiber50. Apart from the internal impregnation of the base fiber51with the conductor52, the configuration of the fifth embodiment is identical to the configuration of the fourth embodiment. In the present embodiment, conductivity is further enhanced by the conductor52. The material composing the conductor52and the material composing the conductor54may be identical, or may differ. The production method of the fifth embodiment may apply the above-described production methods of the first to the fourth embodiments. Sixth Embodiment of the First Aspect A conductive polymer fiber60of the present invention shown inFIG.8(sixth embodiment) is fiber constituted by coating a base fiber61with a conductor62containing conductive polymer, and coating the circumference thereof with an insulating layer63.FIG.8is a cross-sectional view in a direction orthogonal to the lengthwise direction of the conductive polymer fiber60. As the base fiber61and the conductor62are protected by the insulating layer63, fiber of excellent durability is obtained. A configuration may also be adopted as necessary wherein a portion of the insulating layer63is removed to expose a portion of the conductor62at the surface of the fiber. Known insulating materials may be applied as the material of the insulating layer63. From the standpoints of biocompatibility and flexibility, polytetrafluoroethylene (PTFE) and silicone resin (silicone rubber) are preferable. There are no particular limitations on the thickness of the insulating layer63. It may be selected at one's discretion, and may be set within a range of, for example, 0.1 μm to 3 mm, 0.1 μm to 2 mm, 1 μm to 2000 μm, 10 μm to 500 μm, or the like. The base fiber61and the conductor62may be coated with the insulating layer63by known resin coating methods. <Biological Electrode> As the conductive polymer fiber of the present invention has sufficient strength, conductivity, and flexibility even under high-humidity usage conditions, it is not only suitable for use in biological electrodes and biointerfaces, but also in clothing. By multiply bundling the conductive polymer fiber of the present invention to configure thread or cord, it is possible to obtain conductivity that is sufficient for measurement of biological signals. As PEDOT-PSS which is a conductive polymer is combined with the aforementioned fiber, conduction can be immediately obtained by contact of the aforementioned fiber and a measurement object. Accordingly, biological signals can be stably recorded over a long period by having the aforementioned fiber (thread) contact the measurement object, or by tying it, wrapping it, sewing it, or tucking it thereto/therein. In the case where a biological electrode is fabricated using the conductive polymer fiber of the present invention as the electrode, it is possible to offer a biological electrode in various forms such as that of a cloth, belt, or strap by tying, weaving, stitching, or bundling thread that bundles the aforementioned fiber. Furthermore, a patch-like (cloth-like) biological electrode can also be produced by combining this conductive polymer fiber, and molding it into nonwoven cloth or the like. Regarding the Second Aspect The second aspect of the present invention relates to a method and a device for producing conductive polymer fiber. In particular, it relates to a method and a device for producing conductive polymer fiber wherein a conductor containing conductive polymer impregnates or adheres to an insulating fiber (fiber bundle). An embodiment of the method and the device for producing conductive polymer fiber of the second aspect of the present invention is described below with appropriate reference mainly toFIG.13toFIG.18, but the second aspect of the present invention is not limited to the below embodiment. Now,FIGS.13-16are schematic drawings which show devices for producing conductive polymer fiber described in the present embodiments.FIG.1,3,6, and the like are schematic drawings which show examples of the conductive polymer fiber obtained by the production method and the production device of the present embodiment. (Conductive Polymer Fiber) The production method and production device of the second aspect of the present invention are capable of preferentially forming the conductive polymer fiber described in the aforementioned first aspect. The preferred conditions stated in the first aspect can also be used here. For example, the conductive polymer fiber recorded inFIG.1,3, or6can be easily formed. In the present aspect, it is more preferable to use PEDOT-PSS as the conductive polymer contained in the conductor12, but the base fiber used in the present embodiments is not limited to silk fiber, and other common fiber materials may be used without any restriction. It is sufficient if incorporation of PEDOT-PSS as the conductive polymer is required. In the present aspect, when producing the conductive polymer fiber10by the production method and production device described below, first, the conductor12is made to impregnate and/or adhere to the base fiber11by immersing the base fiber11in a solution of the conductor12. At this time, with respect to the solution of the conductor12, a diluting solvent may be included in addition to the PEDOT-PSS that is the conductive polymer, and additives apart from the conductive polymer may also be included as necessary. (Method and Device for Producing Conductive Polymer Fiber) An embodiment of the method and device for producing the conductive polymer fiber of the present invention is described in detail below with reference mainly toFIG.13-16. (Production Device) First, the production device used in the present embodiment is described in detail. A device for producing conductive polymer fiber (hereinafter abbreviated as “production device”)210shown inFIG.13is provided with an immersion container205. The immersion container205internally houses a conductor solution204that contains PEDOT-PSS {poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid)} as conductive polymer, and is an immersion container which serves to immerse an insulating base fiber211composed of thread-like, cord-like, cloth-like, or ribbon-like fiber bundles in the conductor solution204to cause a conductor (see a conductor212shown inFIG.17A,17B, and so on) to impregnate and/or adhere to the base fiber211. In addition, the production device210is provided with a reel unit209which serves to perpendicularly raise the base fiber211from the conductor solution204housed in the immersion container205, and multiple electrodes202and203which electrochemically polymerize and fix the conductor212that impregnates and/or adheres to the base fiber211by energizing the perpendicularly raised base fiber211while it travels. The production device210described in the present embodiment is also provided with a dryer208which conducts drying by blowing air toward the base fiber211on/in which the conductor212has been polymerized and fixed, and a chamber (including a humidity regulator)207capable of adjusting atmospheric humidity in the vicinity of the base fiber211to constitute the skeletal framework. As stated above, the immersion container205is a container which internally houses the conductor solution204containing PEDOT-PSS as conductive polymer, and may consist of a conventional known container. A bobbin206is housed within the immersion container205so as to be immersed in the conductor solution204. The insulating base fiber211composed of thread-like, cord-like, cloth-like, or ribbon-like fiber bundles that is wound around the bobbin206is immersed in the conductor solution204, thereby causing the conductor212to impregnate and/or adhere to the base fiber211. In the present embodiment, a conventional known bobbin may be used as the bobbin206. For example, a bobbin may be used which is configured in the form of a roll bobbin or the like, and which is capable of being turned by a motor or the like, thereby enabling winding of the base fiber211. Around this bobbin206is wound a base fiber211to which the treatment that causes impregnation and/or adhesion of the conductor212thereto has not been conducted. The base fiber211that is wound around the bobbin206is played out, as the post-treated base fiber211, i.e., a conductive polymer fiber201, is reeled in by the below-described reel unit209. The form of the bobbin206is not limited to the aforementioned roll bobbin. For example, in the case where a cloth-like or cord-like base fiber is used, a winding shaft adapted to that form may be used. The reel unit209perpendicularly raises the base fiber211at a constant speed from the conductor solution204housed in the immersion container205, taking in and winding the base fiber211around it. Here, as with the aforementioned bobbin204, a turnable reel may be used that has the form of a roll bobbin or the like. As described in detail below, the reel unit209has a configuration which can adjust the travel speed of the base fiber211to adjust the amount of the conductor212that is electrochemically polymerized and fixed on/in the base fiber211. In the present embodiment, by perpendicularly raising the base fiber211from the conductor solution204by the reel unit209, the amount of conductor212that impregnates and/or adheres to the base fiber211is kept constant, thereby producing uniform electrochemical polymerization and fixation by energization. As shown inFIG.13, in the production device210, multiple electrodes202and203are alternately provided which energize the traveling base fiber211that is perpendicularly raised by the reel unit209, and which electrochemically polymerize and fix the conductor212that impregnates and/or adheres to the base fiber211. These multiple electrodes202and203are multiply provided in the lengthwise direction of the base fiber211, and are respectively disposed on both sides in the lateral direction of the base fiber211, resulting in a configuration where the base fiber211is interposed between the multiple electrodes202and203. A constant current or a constant voltage is impressed on these multiple electrodes202and203from a direct-current stabilized power supply (not illustrated in the drawing). The multiple electrodes202and203may also be disposed vertically, provided that the effects of the invention of the present patent application are obtained. A distance is preferably provided between the electrodes so that they do not contact each other, but the distance may be selected at one's discretion. The number of electrodes may also be selected at one's discretion, and there should be one or more electrode combinations of positive terminal and negative terminal. For example, the aforementioned combination(s) may be within a range from 1 to 10, or a range from 2 to 8, or a range from 3 to 5. In the example shown inFIG.13, the multiple electrodes202are positive terminals, and the multiple electrodes203are negative terminals. By this means, inFIG.13, the base fiber211impregnated with and/or adhering to the conductor212transits the various electrodes in the order of “positive terminal (+)”-“negative terminal (−)”-“positive terminal (+)”-“negative terminal (−)” while traveling perpendicularly. In this manner, the positive terminal and the negative terminal are alternately applied. The multiple electrodes202and203are, for example, composed of conductive metal material or carbon material, and energize the base fiber211in the lengthwise direction while contacting the aforementioned base fiber211that travels perpendicularly. Thus, the traveling base fiber211is energized between the electrodes, whereby the PEDOT-PSS contained in the conductor212that impregnates and/or adheres to the base fiber211is polymerized, and electrochemically fixed by polymerization. As these multiple electrodes202and203, one may use without any restriction known electrodes of various forms that have previously been used in the electrode field such as metal rods or metal plates with smooth surfaces. In particular, in the case where comb teeth-like electrodes are adopted that have multiple comb teeth (electrodes), it is possible to further raise the efficiency of the electrochemical polymerization and fixation of the conductor212relative to the base fiber211. FIG.14shows a detail enlargement of an example where the multiple electrodes (code numbers202and203) shown inFIG.13are configured from the comb teeth-like electrodes221and231having multiple comb teeth. The number of comb teeth may be selected at one's discretion. The comb teeth-like electrodes221and231shown inFIG.14have comb teeth221aand231athat are multiply provided in the lengthwise direction of the base fiber211, and are disposed so as to sandwich the aforementioned base fiber211from both sides in the radial direction of the base fiber211. The multiple comb teeth221aand231aare disposed so as to respectively combine in an alternating manner in the lengthwise direction of the base fiber211from both sides in the radial direction of the base fiber211. The comb teeth-like electrodes221and231energize the base fiber211that is compelled to travel in the direction of the arrow mark inFIG.14, while the multiple comb teeth221aand231aare pressed against the base fiber211from both sides in the radial direction of the base fiber211, and guide it. During this time, the comb teeth-like electrodes221and231are supplied with a constant current or constant voltage by connection of a direct-current stabilized power supply, which is not illustrated in the drawing, to the terminals221band231b. As stated above, by alternately arranging positive terminals (comb teeth221a) and negative terminals (comb teeth231a) along the travel direction of the base fiber211, the comb teeth-like electrodes221and231repeatedly energize the aforementioned base fiber211in a short time by contact with the base fiber211, enabling polymerization and fixation of the PEDOT-PSS. In the present embodiment, first, the base fiber211is compelled to travel in the vertical direction, whereby the conductor212that is fixed thereto is uniformly dispersed over the interior and exterior of the fiber bundle composed of the base fiber211, preventing irregularities. Furthermore, by using the comb teeth-like electrodes221and231as the multiple electrodes, and by continuously arranging the comb teeth (positive terminals)221aand the comb teeth (negative terminals)231ain an alternating manner, polymerization and fixation of the conductor212relative to the base fiber (fiber bundle)211can be conducted several times in one transit. Moreover, as the configuration is such that each of the multiple comb teeth (electrodes)221aand231aare connected in alignment, applied voltage can be set low, because the combined resistance between electrodes is reduced. Generally, when the voltage applied to the respective electrodes is set high, problems such as degradation tend to occur due to the electrolysis of water and the heating of polymer. It is therefore preferable to set applied voltage as low as possible within a range enabling polymerization and fixation. Thus, when the voltage applied to the electrodes is set low, it is necessary to have an efficient flow of the current required for polymerization of polymer. From this standpoint, as well, it is preferable to use the comb teeth-like electrodes221and231of the foregoing configuration. During this time, the voltage applied to the comb teeth-like electrodes221and231can be set at one's discretion, and can, for example, be set to a range of 0.1-18 (V). In the present embodiment, the configuration using the comb teeth-like electrodes221and231which constitute multipolar electrodes provided with the multiple comb teeth221aand231autilizes the characteristic that PEDOT-PSS (conductor212) that has already been electrochemically polymerized normally does not undergo decomposition after polymerization even under a reverse current flow. Consequently, during the process in which the base fiber211travels through the comb teeth-like electrodes221and231, polymerization and fixation is conducted when a positive terminal (+ pole) is approached, and electrochemical polymerization is repeated by travel between the comb teeth-like electrodes221and231that constitute multipolar electrodes, laminating the conductor212containing PEDOT-PSS onto the base fiber211. There are no particular limitations on the size of the comb teeth-like electrodes221and231, and the distance between comb teeth (distance between electrodes) of the multiple comb teeth221a(231a) is preferably in a range of 1-50 mm, and is preferably about 10 mm from the standpoint of treatment efficiency of electrochemical polymerization and fixation. The multiple electrodes (code numbers202and203) shown inFIG.13are not limited to the comb teeth-like electrodes221and231described above. For example, the multiple electrodes may be configured from rotor electrodes222and232which are multiply disposed in the lengthwise direction of the base fiber211, and which are disposed so as to sandwich the aforementioned base fiber from both sides in the radial direction of the base fiber211, as shown in the detail enlargements ofFIG.15A-15C. In the example shown inFIG.15A-15C, the rotor electrodes232disposed on one side in the radial direction of the base fiber211are roller shaped, and the rotor electrodes222disposed on the other side are pulley shaped. These rotor electrodes222and232are respectively disposed in an alternating manner in the lengthwise direction of the base fiber211. As shown inFIG.15C, when the rotor electrodes222and232are used as the multiple electrodes, the base fiber211is energized by traveling between the respective multiple electrodes222and232, while the roller-shaped rotor electrodes232press against the base fiber211, and guidance is provided by the hollows222bformed in the pulley-shaped rotor electrodes222. As shown inFIG.15A, the roller-shaped rotor electrodes232are considered as negative terminals (−) in the present embodiment, and are configured by joining a metal shaft232cto a roller232a. As the (−) side of the direct-current stabilized power supply (not illustrated in the drawings) is connected to the metal shaft232c, metal material having conductivity is used as this metal shaft232c. With respect to the roller232a, for example, a metallic compact roller is used which is composed of stainless steel, and which incorporates a rotatable ball bearing. As shown inFIG.15C, the roller-shaped rotator electrode232is contacted at its outer circumferential surface232bby the base fiber211that travels in the vertical direction. Consequently, although the size of the roller232amay be selected as necessary, taking into consideration the travel speed and the like of the base fiber211, for example, a roller with a diameter of about 6 mm and a width of about 3 mm can be used. As shown inFIG.15B, the pulley-shaped rotor electrodes222are considered as positive terminals (+) in the present embodiment, and are configured by joining a pulley222aformed with a hollow222bon its circumferential surface to a metal shaft222c. As the (+) side of the direct-current stabilized power supply (not illustrated in the drawings) is connected to the metal shaft222c, a metal material having conductivity is used as this metal shaft222c, as in the case of the roller-shaped rotor electrode232. As the pulley222a, for example, a metallic compact pulley is used which is composed of stainless steel, and which incorporates a rotatable ball bearing. As shown inFIG.15C, the pulley-shaped rotor electrode222is contacted at the hollow222b, which is formed on the circumferential surface thereof, by the base fiber211that travels in the vertical direction, and guides the fiber. Consequently, although the size of the pulley222amay be selected as necessary as in the case of the roller-shaped rotor electrode232, taking into consideration the travel speed and the like of the base fiber11, for example, a pulley with a diameter of about 8 mm and a width of about 4 mm may be used. In the present embodiment, as shown inFIG.15C, the pulley-shaped rotor electrodes222and the roller-shaped rotor electrodes232are configured to be alternately disposed, i.e., to alternately dispose positive terminals (+) and negative terminals (−), along the vertical travel direction of the base fiber211(see also code numbers202and203inFIG.15A-15C). The base fiber (fiber bundle)211that is impregnated with and/or adheres to the conductor212then contacts the metallic pulley-shaped rotor electrodes (positive terminals)222and roller-shaped rotator electrodes (negative terminals)232that are respectively fixed to the metal shafts222cand232c, and that incorporate bearings. By supplying power at constant current or low-voltage from a direct-current stabilized power supply (not illustrated in the drawings) to these respective rotor electrodes222and232, the conductor212containing PEDOT-PSS is electrochemically polymerized, and fixed to the base fiber211. In the case where the rotor electrodes222and232described above are used, the amount of electricity required to polymerize and fix the conductor212containing PEDOT-PSS may be selected at one's discretion. For example, when silk thread with a diameter of approximately 280 μm (No. 9 silk thread, produced by Fujix, Ltd.) is used as the base fiber, it is possible to obtain satisfactory polymerization and fixation of 0.1-6 mC, and particularly of about 3 mC, per 10 mm. The rotor electrodes222and232described above rotate together with the traveling base fiber211. As the friction associated with contact is reduced by this, it is possible to prevent friction-induced peeling of the conductor212containing PEDOT-PSS that is electrochemically fixed to the base fiber211. That is, surface breakdown of the polymer in the conductive polymer fiber201can be avoided. In the production device210of the present embodiment, an arrangement of a thread-like fiber bundle can be ordered by having the roller-shaped rotor electrodes232press against the base fiber211, and by providing guidance with the hollows222bof the pulley-shaped rotor electrodes222. By this means, it is possible to adopt a configuration that enables energization to be conducted while controlling the amount of conductor212that impregnates and/or adheres to the base fiber211. In this case, for example, regulation is conducted with respect to the form and dispositional format of the pulley-shaped rotor electrodes222and the roller-shaped rotor electrodes232, as well as the tensile force, travel speed, and turning condition of the base fiber (fiber bundles)201. By this means, with respect to the base fibers, it is possible to adjust opening, bundling function, fiber interval, fiber bundle arrangement (form), and so on. By adjusting the interval between the respective fibers with the above-described adjustment, for example, it is then possible to retain and fix an optional amount of conductor212(42) among the respective base fibers, as in the example shown inFIG.6. In particular, it becomes possible to conduct adjustment into the various forms stated above by implementing form sets of the base fibers (fiber bundles)211utilizing the pulley-shaped rotor electrodes222and the roller-shaped rotor electrodes232. As set forms of fiber bundles, one may cite various forms such as, for example, the presence or absence of twisting of fiber bundles, cross-sectional forms of fiber bundles (flattened, true circle, ellipse, square, etc.), and turning of fiber fascicles (straightening of fascicle of fiber bundles by reversing twist, or further application of twisting). Form sets should be implemented by suitably selecting these with adjustments. In the present embodiment, by implementing the aforementioned form sets of fiber bundles, it is possible to obtain composite fiber bundles of the conductive polymer fiber201that are set (formed) into prescribed forms. When forming such composite fiber bundles, as in the example shown inFIG.6, a high order structure such as twisted cord, cloth, or nonwoven cloth can be made by arranging the conductor212(42) containing the PEDOT-PSS that is a conductive polymer among multiple base fibers211(41) with close adhesion to the base fiber211(41), and by intertwining and/or weaving together the multiple base fibers211(41). As shown inFIG.13, in addition to the foregoing configuration, the production device210of the present embodiment may also be provided with a dryer208that blows air toward the base fiber211in/on which the conductor212is polymerized and fixed, and a chamber (including a humidity regulator)207which regulates atmospheric humidity in the vicinity of the base fiber211. The chamber207is provided with an air conditioning function (humidity regulator), and constantly maintains a concentration (PEDOT-PSS concentration) of the conductor212by maintaining internal humidity at a high humidity. As this type of chamber207, one may use, without any restriction, a constant temperature/constant humidity tank of a size enabling housing of the multiple electrodes202and203and the immersion container205, which has been conventionally used in this field. The dryer208blows dry air of low humidity toward the base fiber211in/on which the conductor212has been polymerized and fixed (the conductive polymer fiber201), and dries it. For example, conventional air-blowing dryers configured from a motor, a fan, and the like may be adopted without any restriction. In the present embodiment, it is also possible to conduct moisture adjustment for the PEDOT-PSS solution (conductor212) that impregnates the base fiber (fiber bundle)211by using the aforementioned chamber, and conducting humidity adjustment in the vicinity of the multiple electrodes202and203. In the case where the chamber is given a 3-part configuration to independently regulate humidity in each part, it is possible to have settings like those shown in the following (A)-(C). (A) Immersion container: the humidity control of the part is adjusted to a range of 50-100%, in order to prevent evaporation of moisture from the conductor solution containing PEDOT-PSS, and constantly maintain a concentration of PEDOT-PSS. (B) Multiple electrodes: adjustment of the moisture of the conductor solution containing PEDOT-PSS that impregnates the fiber is conducted by controlling humidity from high humidity to low humidity, e.g., in a range of 99-10%. (C) Dryer: a function for blowing dry air (e.g., the humidity setting is in a range of 0-40%) can be added, in order to accelerate drying of the base fiber in/on which the conductor has been polymerized and fixed (the conductive polymer fiber) by circulation of low-humidity dry air. In addition to the respective configurations described above, although omitted from the drawings, the production device of the present embodiment may also be provided with, for example, a container-like disinfectant and cleaning unit which conducts fixation and sterilization/disinfection of residual monomers by an ethanol or acetone bath. Furthermore, the disinfection and cleaning unit may be additionally provided with a configuration enabling removal of residual monomers by a cleaning bath of physiological saline solution or the like. Moreover, the electrodes used in the present invention are not limited only to multiple electrodes like those shown inFIG.13-15. It is also acceptable to have, for example, a production device250provided with monopolar (individual) electrodes252and253, as shown inFIG.16. This production device250is provided with an immersion container255which houses a PEDOT-PSS solution204. It also includes: an electrode (negative electrode)253consisting of a metal plate or the like, which is installed in the PEDOT-PSS solution inside the immersion container255; an electrode (positive terminal)252consisting of a metal rod or the like, which is installed outside the immersion container255, and which contacts the base fiber211; a bobbin256which is installed inside the immersion container255, and around which is wound the base fiber211; a chamber257with internal humidity regulation, which houses each electrode252,253, the immersion container255, and the bobbin256; a direct-current stabilized power supply251which supplies current to the electrodes252and253; a dryer258which conducts air-blow drying of the base fiber201(conductive polymer fiber201); and a reel unit259which takes in the conductive polymer fiber201after completion thereof. When this type of production device250provided with the individual (monopolar) electrodes252and253is used, the base fiber211travels between the electrodes while being raised perpendicularly, whereby the conductor212which is polymerized and fixed in the base fiber211can be uniformly dispersed, preventing irregularities, with the result that it is possible to manufacture conductive polymer fiber201of excellent conductivity and durability. (Production Method) A procedure of a method for producing the conductive polymer fiber201using the above-described production device210is described below with reference to the same drawings (FIG.13-15) used to describe the aforementioned production device. A method for producing the conductive polymer fiber201described in the present embodiment is sequentially provided with the respective steps shown in (1)-(3) described below, and each of these steps (1)-(3) are also conducted while regulating atmospheric humidity. (1) An immersion step in which the insulating base fiber211composed of thread-like fiber bundles is immersed in a conductor solution containing PEDOT-PSS as conductive polymer, thereby causing the conductor212to impregnate and/or adhere to the base fiber211. (2) A fixation step in which the conductor212that impregnates and/or adheres to the base fiber211is electrochemically polymerized and fixed by energizing the base fiber211by compelling it to travel between the multiple electrodes202and203while being perpendicularly raised from the conductor solution. (3) A drying step in which the base fiber211in/on which the conductor212has been polymerized and fixed is dried by air blowing. (Immersion Step) In the immersion step, as stated above, the base fibers211are immersed in the conductor solution containing PEDOT-PSS as conductive polymer, thereby causing the conductor212to impregnate and/or adhere to the base fibers211. Specifically, a conductor solution containing PEDOT-PSS which is a conductive polymer is stored in the immersion container205, as shown inFIG.13, and the base fibers (fiber bundles)211are immersed in this solution. By this step, the conductor212having conductivity impregnates and/or adheres to the base fibers211, with the result that the base fibers211have conductivity. When adjusting a conductor solution containing conductive polymer like that described above, for example, additives and the like can also be added as necessary to a commercial PEDOT-PSS solution (Heraeus, Ltd.: CLEVIOS P and the like). That is, a method may also be applied wherein a mixed solution is prepared in which an additive is mixed with the conductor solution containing PEDOT-PSS, and the conductive polymer and additive are simultaneously applied to or used to immerse the base fibers211. Such a mixed solution may be selected at one's discretion. As one example, one may cite an aqueous solution containing a concentration of 0.1-50 (V/V) % of conductive polymer such as PEDOT-PSS, and 0.1-50 (V/V) % of an additive such as glycerol. There are no particular limitations on the additive concentration in the conductor solution, and it may, for example, be in a range of 0.1-50 wt %. (Fixation Step) Next, in the fixation step, the base fibers211are energized by traveling between the multiple electrodes202and203while being perpendicularly raised from the solution. By this means, the conductor212that impregnates and/or adheres to the base fibers211is electrochemically polymerized and fixed. Specifically, for example, the base fibers (fiber bundles)211in/on which the conductor212is impregnated and/or adheres are compelled to travel by being perpendicularly raised from the solution by the reel unit209, as shown inFIG.13. Thus, by causing the base fibers211to travel while being perpendicularly raised, a condition is produced in which the conductor212is free of gravity-induced eccentricity, and impregnates and/or adheres to the base fibers211with uniform dispersion. Then, in the fixation step, the multiple electrodes202and203shown inFIG.13are used to energize the base fibers211while making contact so as to sandwich them from both sides in the radial direction. Thus, the base fibers (fiber bundles)211in/on which the conductor212containing PEDOT-PSS is impregnated and/or adheres are brought into contact with the electrodes202and203, to cause a current flow, whereby the conductor212containing PEDOT-PSS adhering to the interior and exterior of the fiber bundles is electrochemically polymerized and fixed, and the conductive polymer fibers201are obtained which are composite fibers of the base fibers (fiber bundles)211and the conductor212containing PEDOT-PSS. In the fixation step, the above-described comb teeth-like electrodes221and231having multiple comb teeth221aand231ashown inFIG.14may be used as the multiple electrodes. In this case, the comb teeth-like electrodes221and231are disposed so as to sandwich the aforementioned base fibers211from both sides in the radial direction of the base fibers211, and the multiple comb teeth221aand231aare disposed so as to be positioned in an alternating manner in the lengthwise direction of the base fibers211from both sides in the radial direction of the base fibers211. A method can then be adopted wherein the base fibers211are energized by perpendicularly traveling while the multiple comb teeth221aand231aprovided in the comb teeth-like electrodes221and231press against the base fibers (fiber bundles)211from both sides in the radial direction, and provide guidance. In the fixation step, as the multiple electrodes, it is also possible to use the rotor electrodes222and232shown inFIG.15A-15C, which are multiply disposed in the lengthwise direction of the base fibers211, and which are disposed so as to sandwich the base fibers211from both sides in the radial direction of the aforementioned base fibers211. That is, using the roller-shaped rotor electrodes232disposed on one side in the radial direction of the base fibers211and the pulley-shaped rotor electrodes222disposed on the other side, the rotor electrodes222and232disposed on both sides of the base fibers211are disposed in an alternating manner in the lengthwise direction of the base fibers211. A method can then be adopted wherein the base fibers211are energized by traveling between the respective multiple electrodes while the roller-shaped rotor electrodes232press against the base fibers (fiber bundles)211, and guidance is provided by the hollows222bformed in the pulley-shaped rotor electrodes222. Furthermore, in the fixation step, a method can be adopted wherein energization is conducted while controlling the amount of the conductor212that impregnates and/or adheres to the base fibers211by ordering an arrangement of a thread-like fiber bundle by having the base fibers211pressed by the roller-shaped rotor electrodes232, and guided by the hollows222bin the pulley-shaped rotor electrodes222, as described with respect to the foregoing production device configuration. (Drying Step) Next, in the drying step, the conductive polymer fibers201are dried by blowing low-humidity dry air toward the base fibers211in/on which the conductor212is polymerized and fixed, i.e., the conductive polymer fiber201. Specifically, as shown inFIG.13, for example, dried air is blown toward the base fibers (fiber bundles)211in/on which the conductor212has been electrochemically polymerized and fixed in the aforementioned fixation step, using the dryer208provided with a humidity regulation means (not illustrated in the drawing) and an air blowing means. By this means, the water (solvent) contained in the solution of the conductor212containing PEDOT-PSS is removed by drying. Subsequently, with the production method of the present embodiment, it is preferable to remove the unpolymerized PEDOT-PSS and the solvent by cleaning the conductive polymer fibers201using, for example, an electrolytic solution consisting of physiological saline water or the like. Furthermore, in the present embodiment, drying is preferably conducted after performing cleaning and disinfection of the conductive polymer fibers201using an ethanol solution. Although detailed description is omitted, in the production method of the present embodiment, it is also possible to manufacture the conductive polymer fibers201using the production device250provided with the monopolar (individual) electrodes252and253shown inFIG.16. According to the above-described method for producing the conductive polymer fibers201of the present invention, as stated above, a method is adopted wherein the base fibers211in/on which the conductor212containing PEDOT-PSS is impregnated and/or adheres are energized by traveling between the multiple electrodes202and203while being perpendicularly raised from the conductor solution. As the process in which the conductor212is electrochemically polymerized and fixed in the base fibers211can be continuously conducted in a one-step process by this method, productivity is improved. Furthermore, by having the base fibers211travel between the multiple electrodes202and203while being perpendicularly raised, the conductor212that is polymerized and fixed in the base fibers211is uniformly dispersed, enabling prevention of irregularities. It is therefore possible to manufacture with good productivity the conductive polymer fibers201which are provided with a high degree of biocompatibility and satisfactory uniformity, as well as excellent conductivity and durability. Moreover, according to the conductive polymer fiber production device210of the present invention, a configuration is adopted which is provided with the reel unit209that perpendicularly raises the base fibers211in/on which the conductor212containing PEDOT-PSS is impregnated and/or adheres from a conductor solution in the immersion container205, and the multiple electrodes202and203which energize the base fibers211during travel. As the process in which the conductor212is electrochemically polymerized and fixed in the base fibers211can be continuously conducted in a one-step process by this method, productivity can be improved. Furthermore, by providing the multiple electrodes202and203which energize the base fibers211while they are perpendicularly raised, the conductor212that is polymerized and fixed in the base fibers211is uniformly dispersed, enabling prevention of irregularities. It is therefore possible to obtain with good productivity the conductive polymer fibers201which are provided with a high degree of biocompatibility and satisfactory uniformity, as well as excellent conductivity and durability. Regarding the Third Aspect The third aspect of the present invention relates to a biological electrode and a biological signal measurement device. In further detail, the present invention relates to a biological electrode of the body surface attachment type utilizing composite material of conductive polymer and fiber (hereinafter “conductive composite fiber”), and to a biological signal measurement device provided with the biological electrode. In the present aspect, the fiber described in the first aspect of the present invention can be preferentially used. Embodiments of the third aspect of the present invention are described below with reference to drawings, but the present invention is not limited by the pertinent embodiments. <<An Example Using a Biological Electrode as a Brainwave Measurement Electrode>> In recent years, brainwave measurement is not only being conducted by testing in medical facilities, but applications are also advancing with respect to home-based brainwave testing, telemedicine, health information and ubiquitous healthcare systems, and the like. Furthermore, applications are also anticipated outside of the medical treatment field with respect to psychological research involving measurement of event-related potential, engineering such as BCI (brain computer interface), and the welfare and nursing-care field. In brainwave measurement, it is necessary to attach the electrode with avoidance of the hair that exists on the scalp. With respect to brainwave measurement using conventional biological electrodes, in order to stably fix the electrodes, the electrodes are fixed to skin using an adhesive agent, or the electrodes are fixed by pressure from above using a head cap that covers the entire head, and/or the electrodes are prevented from coming off by copious amounts of paste or gel between the electrodes and the scalp. However, these countermeasures have many inconveniences associated with attachment, impose a large burden on the subject, and are particularly problematic when conducting continuous measurement of brain waves over a long period. Moreover, as the external appearance of the electrodes creates significant discomfort in the subject or in bystanders, utilization of brain waves beyond medical treatment applications has not become widely generalized. As the biological electrode of a first embodiment of the third aspect of the present invention described below utilizes the conductivity of conductive polymer, it becomes possible to downsize the electrode, and decrease the skin contact area. Furthermore, this electrode which is composed by flexible fiber material imparts little irritation to skin when attached, and inhibits discomfort during attachment. There is also no need to seal the skin with highly viscous gel or tape or the like as with conventional biological electrodes. As the biological electrode of the first embodiment of the third aspect of the present invention has an excellent wear feeling, is capable of continuous use, and has an external appearance that causes no discomfort during attachment, it can also be preferentially used, for example, in brainwave measurement applications. First Embodiment of Third Aspect The biological electrode of the first embodiment is provided with cord-like contacts composed of conductive polymer fiber. It is capable of measuring brain waves by attachment of the aforementioned contacts to the scalp in the gaps between scalp hair (seeFIGS.19A-19D, andFIGS.20A-20D). A biological electrode310shown inFIGS.19A-19Dis at least provided with cord-like contacts311composed of conductive polymer fiber, first frames312, and a second frame313(connecting parts). The two ends of the contact311are connected with the two ends of the arcuate first frame312. The flexible form of the contact311is provided by the first frame. Tension may be imparted to the contact311by the first frame312. The second frame313that is laid across the multiple first frames312functions as a beam that fixes the respective first frames312. In addition, a signal cable314is connected to a terminal of each contact311. Electrical signals are transmitted and received between each contact311and a brainwave analyzer (not illustrated in the drawings) connected to the distal end of the signal cable314. The direction of the electrical signals may be only one-way, or it may be bidirectional-way. There are no particular limitations on the form of the contacts311, provided that it is a form enabling contact with the scalp S, and any form such as a cord-like, thread-like, band-like, cloth-like, net-like, or other form is acceptable. The size and length of the contacts311may also be suitably adjusted. There are no particular limitations on the form, number, or size of the first frames312and the second frame(s)313. For example, one may adopt a form which enables appropriate tension to be imparted to the contacts311, or a form which enables fixing of the contacts311so that they do not loosen. There are no particular limitations on the material composing the first frames312and the second frame(s)313, provided that it is not a material that disturbs electrical signals in the contacts311, and conventional resin material may be used. As examples of the number of the first frames312, one may cite a number included in a range from 1 to 20, a range from 2 to 8, a range from 2 to 4, or the like. As examples of the number of the second frame(s)313, one may cite a number included in a range from 1 to 6, a range from 1 to 3, a range from 1 to 2, or the like. With respect to the form of the first frames312and the second frame(s)313, for example, a partially looped shaped is acceptable, and a tabular shape is also acceptable. Thickness is preferably constant, but may vary in parts. In the drawings, a single second frame313is disposed at right angles to four first frames312, but the second frame(s)313may be positioned in a plurality, and/or may be diagonally arranged as necessary. Provided that brainwave measurement (signal measurement) is not impaired, at least either of the first frames312and the second frame(s)313may be made of metal. For example, by composing the first frames312and the second frame(s)313of metal material, one may adopt a configuration wherein the signal cable314is connected to either the first frame312or the second frame313without connection to the contact311, and transmission and receipt of electrical signals vis-à-vis the contact311is conducted via the first frame312or the second frame313. There are no particular limitations on the connection method of the signal cable314and the conductive composite fiber composing the contacts311, provided that it is a method enabling electrical connection. For example, one may apply caulking that uses metal, winding/ligation of the conductive composite fiber around/to the signal cable314, or adhesion by a conductive adhesive agent. In the present invention, one or more of the cord-like contacts311may be used per electrode. As illustrated inFIG.19A-19Dusing the first frames312and the second frame313, stable contact is obtained between the contacts311and the skin by configuring the comb-shaped electrode310. In the comb-shaped biological electrode310shown inFIG.19A-19D, multiple cord-like contacts311are arranged in parallel. The comb-shaped electrode310in which the multiple contacts311are arranged in parallel is inserted between hair or in the manner of a comb when there is scalp hair growth, and a net-like holder can also be put on over the comb to fix it in place (FIG.22A-22B). Variation of First Embodiment of Third Aspect As a configuration of a more compact biological electrode, a hairpin-like biological electrode320in which two contacts321are fixed to a hairpin-like hair clip (metal plate spring) is shown inFIG.20A-20D. This hairpin-like biological electrode320can be used by inserting it to the vicinity of scalp hair roots. The hairpin-like hair clip is able to hold the hair in place. In the illustrated example, two contacts321are fixed to a scalp S. The hairpin-like biological electrode320shown inFIG.20A-20Dis at least provided with the cord-like contacts321composed of conductive composite fiber, third frames322, and a fourth frame323. The two ends of the contact321are attached to two cylindrical third frames322, and it is possible to adjust the tension imparted to the contact321by adjusting the distance of the two third frames322. The two third frames322are respectively fixed by a distal end part and a curved part of the fourth frame324for that uses a hairpin. In the example shown inFIG.20A-20D, two cord-like contacts321are provided in the hairpin. A terminus of each contact321is connected to a signal cable324, and transmission and receipt of electrical signals is conducted between each contact321and a brainwave analyzer (not illustrated in the drawings) connected to the distal end of the signal cable324. The direction of the electrical signals may be only one-way, or it may be bidirectional way. There are no particular limitations on the form of the contacts321, provided that it is a form enabling contact with the scalp S, and a cord-like, thread-like, band-like, cloth-like, net-like, or other form is acceptable. The size and length of the contacts321are also adjustable. There are no particular limitations on the form of the third frames322, and one may adopt a polygonal column shape such as a cylindrical, triangular prism, or quadrangular prism shape, or a spherical shape or the like. In this configuration, the fourth frame323can be fixed to hair H, because it has a hairpin structure, and functions as a hairpin. As a result, the contacts321can be easily brought into contact with the skin (scalp) S, and can be fixed at a desired position. There are no particular limitations on the material composing the third frames322and the fourth frame323, provided that it is material that does not disturb electrical signals in the contacts321. For example, conventional resin materials can be used. Provided that there is no impairment to brainwave measurement (signal measurement), at least either of the third frames322and the fourth frame323may be made of metal. In the present variation, for example, the third frames322may be composed of insulating resin, and the hairpin that is the fourth frame323may be made of metal. Provided that there is no impairment to brainwave measurement, the contacts321may be electrically connected to the metallic fourth frame323. One or more of the cord-like contacts321may be used per electrode. As illustrated inFIG.20A-20D, stable contact of the contacts321and the skin can be obtained by configuring the hairpin-like electrode320using the third frames322and the fourth frame323. In the hairpin electrode320shown inFIG.20A-20D, multiple cord-like contacts321are arranged in parallel. The hairpin electrode320that arranges the multiple contacts321in parallel is fixed in place by fastening the hair with the hairpin. The conductive composite fiber composing the cord-like contacts321may be identical to that of the above-described contacts311. (Conductive Composite Fiber) As the conductive composite fiber composing the cord-like contacts311and321, a composite fiber of conductive polymer and conventional fiber material may be applied. There are no particular limitations on the compounding mode (method). For example, it is acceptable to have a form where the conductive polymer coats the surface of the aforementioned fiber material that is cord-like (thread-like), a form where the conductive polymer impregnates the aforementioned fiber material that is cord-like, or a form where cord-like conductive polymer and the aforementioned fiber material that is cordlike are twisted together or spun. The materials and the conductive polymer fiber described in the first aspect may be preferentially used, and the device and method described in the second aspect may be used. There are no particular limitations on the type of the aforementioned conductive polymer, and conventional conductive polymer may be applied. For example, in addition to the aforementioned PEDOT-PSS, one may cite hydrophilic conductive polymer such as PEDOT-S(poly(4-(2,3-dihydrothieno[3,4-b][1,4]dioxin-2yl-methoxy-1-butanesulfonic acid, potassium salt). By using composite fiber containing hydrophilic conductive polymer as the material of the contacts311and321, adsorbency (adhesion) relative to skin can be easily imparted to the contacts311and321themselves. As the aforementioned fiber material, one may apply conventional fiber material such as silk, cotton, hemp, rayon, and chemical fiber. Of these, silk is optimal. When silk is used, the strength and hydrophilicity of the aforementioned composite fiber can be further enhanced. Moreover, when silk is used, the wear feeling is better when skin is contacted. There no particular limitations on the types of the aforementioned conductive polymer that are combined with silk, but hydrophilic conductive polymer such as the aforementioned PEDOT-PSS or PEDOT-S is preferable. As the aforementioned conductive composite fiber composing the contacts of the respective embodiments of the present invention, the conductive polymer fiber that is described in further detail below may be applied. (Structure of Contacts) As the structure of the cord-like contacts configuring the respective embodiments of the present invention, two types of structure may be exemplified. A first structure for a cord-like contact is a structure that uses the aforementioned conductive composite fiber bundles alone. As an example of the first structure, one may cite the contact311shown inFIG.19A-19D. As the contact311is fabricated by weaving bundled thread (cord) of multiple conductive composite fibers, it has appropriate thickness and strength. As the first structure that is configured only with composite conductive fibers is flexible, it is well-suited for applications requiring flexibility and a comfortable wear feeling with respect to the biological electrode. The aforementioned conductive composite fibers are preferably thread-like or cord-like. A second structure for cord-like contacts is a structure which combines the aforementioned conductive composite fiber bundle and metallic cable or metallic wire. As an example of the second structure, one may cite the structure schematically shown inFIGS.21A and21B. The contact321ofFIG.20has the structure shown inFIG.21B. As the second structure raises conductivity by means of the metallic cable or metallic wire, it is well-suited to applications requiring a reduction in electrode resistance per contact area of biological electrode. In the second structure shown inFIG.21A, a metal wire321fis wound so as to bring together a bundle of multiple cores321g, on top of which conductive composite fibers321eare wound. The material composing the cores321gmay be conductive, or it may be insulating. In the illustrated example, the cores311are cores composed of insulating fibers. The number and the thickness of the cores311may be suitably adjusted. In the drawing, it is depicted that the number of windings of the metal wire and the number of windings of the conductive composite fibers321eare identical, but the relative relationship of these winding numbers is not limited thereto. For example, the number of windings of the metal wire321fmay be less than the number of windings of the conductive composite fibers. Moreover, the cord-like contact may be partially coated by an insulating cover321zas necessary. As an insulating cover, for example, one may cite a cover composed of silicone resin. With respect to the second structure shown inFIG.21B, conductive composite fibers321aare wound so as to bring together a bundle of multiple metallic cables321b. There are no particular limitations on the type of metal composing the metallic cables, but highly conductive copper cable is optimal. In the illustrated example, the metallic cables321bare copper cables. There are no particular limitations on the number or the thickness of the metallic cables321b, and these may be suitably adjusted. However, instead of using a small number of thick metallic cables, use of a large number of thin metallic cables or metallic wires may increase flexibility even at the same diameter of bundle. The cord-like contact may be partially covered by an insulating cover321cas necessary. As an insulating cover, one may cite, for example, a cover composed of silicone resin.FIG.21Cis a photograph of the cord-like contact321having the structure ofFIG.21B. When the first structure and the second structure are compared, in the first structure, electrical connection of the contact311and the metallic (conductive) signal cable314occurs at the single point of the terminal of the contact311, whereas in the second structure, the electrical connection of the contact321and the signal cable324occurs over the entirety of the contact321. Therefore, electrode resistance is reduced in the second structure, because the distance between the skin and the metallic cable is shorter than in the first structure. There are no particular limitations on the thickness of the contact, but it is preferable to have a thickness that obtains a structural strength inhibiting breakage during contact with skin. For example, when thickness of 0.1 mm to 5 mm, a structural strength inhibiting breakage can be easily obtained. Normally, the second structure which has metal wire tends to have greater structural strength than the first structure. As examples of other thickness ranges, one may also cite a thickness of 0.1 mm to 3 mm, a thickness of 0.5 mm to 1 mm, and so on. As a contact provided with conductive composite fibers has adhesion (adsorbency) relative to skin, the biological electrode of the first embodiment can be independently attached without use of paste or adhesive for electrode attachment. However, it is possible that the biological electrode could come off (peel off) from the skin surface upon application of external force due to an action of the subject or pulling of the signal cable or the like. In order to prevent this, a means can be adopted which presses the biological electrode against the skin surface. The aforementioned means can be exemplified by a net-like holder (cap) N like the one shown inFIG.22A. (Holder for Brainwave Electrode; Cap with Stretchable Netting) Biological electrodes of the first embodiment of the third aspect, for example, the comb-like electrodes310shown inFIG.22A, can be fixed by placing thereon a cap with a stretchable net N shown inFIG.22A. The net N can be used as a holder for lightly pressing on the comb-like electrodes310from above to stably hold them in place. As the comb-like electrodes310are inserted between gaps in the hair, they do not easily come off. Consequently, with respect to the comb-like electrodes310, there is no need to conduct strong pressure fixation with a head cap or the like as with conventional electrodes, and stable fixation can be obtained by using a cover with a low-tension stretchable net or the like. As the aforementioned low-tension stretchable net, for example, commercial net bandages (manufactured by Nippon Eizai Co., Ltd.) and the like may be applied. According to the biological electrode of the first embodiment, a design that fits under hair can be easily achieved. Furthermore, with use of a stretchable net, hair can be pulled out from under the net. Consequently, wear feeling and external appearance during attachment are both improved by use of the biological electrode of the first embodiment.FIG.22Ashows a fitting view of the comb-like electrodes310and the cap with the stretchable net N.FIG.22Bshows an example (top view) where the comb-like electrodes310are disposed in the stretchable grid-like net N. InFIG.22B, Δ represents the nose, and the two ellipses respectively represent the left and right ears. Within the region demarcated by the grid, the positions shown by shading represent the places where the comb-like electrodes310are disposed. In this configuration, the attachment sites of the biological electrodes310can be conformed to the international 10-20 method by adjusting the cord intervals of the stretchable net N. <<Example where the Biological Electrode is Used as an Electrode for Electrocardiogram Measurement>> Biological electrodes for Holter electrocardiogram testing and biological electrodes for myogenic potential monitoring or hear rate monitoring have heretofore been widely available. Frequently, electrodes for Holter electrocardiogram testing use highly adhesive tape or adhesive pads, and are used when fixed to skin. Noise generation is prevented by fixing the biological electrodes to skin. As monitoring electrodes which are often continuously used over long periods are fixed to skin, they frequently use adhesive pads of conductive gel. With respect to measurement data from these electrodes, there is little immixture of artifacts such as noise, and the stability of measured waveforms is excellent. However, there is a problem that high-frequency components of biological signals are attenuated. As electrolytic paste or gel is used between the metallic electrode and the skin with respect to conventional biological electrodes, it is thought that this problem occurs due to the influence of the volumetric components (capacitance) of the electrolyte solution. Consequently, electrolytic paste and electrolytic gel are one factor inhibiting analysis of biological signals containing high-frequency components, and high-speed communication between a living body or the like and an external device in BCI. With conventional biological electrodes, steaming tends to occur due to the close adhesion of a highly adhesive electrode to skin, causing discomfort to the subject (wearer). Moreover, as a preliminary treatment for obtaining the effect of the adhesive agent, delipidation of the skin surface subject to which adhesion is performed must be conducted with an alcohol swab or the like. However, as delipidation treatment with alcohol is strongly irritating to skin, it is a cause of itchiness and contact dermatitis, and requires improvement. Problems of steaming and influence to frequency characteristics due to the use of metallic electrodes in this manner are not limited only to electrocardiogram measurement, but also are related to the aforementioned brainwave measurement. Such problems are problems to be solved in terms of transmission of electrical signals or electrical stimulation between the electrode and the living body. Attempts to improve these problems have also been made in the past, but sufficient improvement has not been achieved. For example, with respect to conventional biological electrodes for brainwave measurement, in order to alleviate the effects on frequency characteristics which are caused by electrolytic paste, attempts have been made to conduct measurement with direct placement on skin of compact electrodes, which is made of sintered metal or the like, without use of electrolytic paste. However, a problem arises with respect to the stability of measured waveforms as a result of the attempts. That is, with a method which conducts direct placement of a metallic electrode on skin, resistance between the skin and the electrode tends to fluctuate due to mechanical compliance and electrochemical mismatch. Furthermore, measured signals tend to destabilize due to vibration from body movement or breathing of the living body, and it often happens that noise becomes intermixed with measured signals. Moreover, hard metallic electrodes tend to cause discomfort or unpleasantness when brought into direct contact with skin, and this point also requires a solution. In order to alleviate the problems of hard metallic electrodes, development of textile electrodes using conductive fiber have advanced in recent years, and have been made available centering on the sports and health fields. Textile electrodes are cloth-like biological electrodes incorporating conductive fiber, and are used with pressure fixation to skin using stretchable bands and the like. With respect to textile electrodes, pasteless types predominate which bring the electrode into direct contact with skin without use of electrolytic paste, or which are used in a state where moisture is contained in the cloth which composes the electrode. With respect to measurement by means of such textile electrodes, in cases where the state of contact with skin is stably maintained, relatively satisfactory biological signals are obtained. However, in cases where the state of contact with skin is even slightly unstable, the resistance between skin and electrode fluctuates greatly, resulting in the problem that the reliability of measured waveforms declines due to artifacts such as distortion of recorded waveforms and immixture of hum noise. With respect to a biological electrode of a second embodiment of the third aspect of the present invention described below, similar to the biological electrode of the first embodiment, downsizing of the electrode and contraction of the skin contact area are made possible by utilizing the conductivity of conductive polymer. Furthermore, this electrode which is composed of flexible fiber material imparts little irritation to skin when attached, and inhibits the occurrence of discomfort during attachment. Moreover, there is no need for close adhesion to skin by means of highly adhesive gel or tape or the like, unlike conventional biological electrodes. As the biological electrode of the second embodiment of the present invention has an excellent wear feeling, enables continuous use, and has an external appearance that causes no strangeness when attached, it can be preferentially used in applications involving textiles for medical or sports use. Second Embodiment of the Third Aspect A biological electrode330of the second embodiment is shown inFIG.24A-24B. The biological electrode330is provided with a contact part (electrode surface)332in which multiple cord-like contacts331composed of conductive composite fiber are planarly arranged, and a sheet-like substrate333which supports the contact part332. A configuration combining the contact part332and the substrate333is called an electrode pad. A signal cable334is provided which is electrically connected to each contact331. Furthermore, a holder335composed of stretchable material is provided as a means for pressing the contact part332of the aforementioned electrode pad against skin S. There no particular limitations on the form of the planar contact part332in which multiple contacts331composed of conductive composite fiber bundles are arranged, and the substrate333, in so far as they enable to obtain surface contact between the contact part332and skin, and it is not necessarily tabular. In short, the contact part332or the substrate333may be formed in a curved, concave, or convex manner along a curved surface of skin. There is no need for the form of the electrode pad to be rigidly fixed, and it may flexibly change shape in conjunction with skin contact. By using the sheet-like substrate333, it is possible to ensure the planarity of the skin contact surface of the biological electrode, and also promote stable adhesion to skin. The material, size, and form of the aforementioned substrate may be selected at one's discretion. For example, as the substrate, one may cite a PVC (polyvinyl chloride) sheet of 0.2 mm thickness, or a silicone flat sheet (1 mm thickness). The material of the aforementioned substrate is not limited thereto, and a material is well suited for use that is a flexible film-like (sheet-like) material, that easily maintains the planarity of the substrate, and that has satisfactory adhesion with skin. The contact part332(electrode pad) that contacts the skin is formed such that the contacts331composed of conductive composite fibers are arranged on the aforementioned substrate. It is also acceptable to provide a substrate surface with adhesion to skin by lightly imparting adhesive properties to one surface of the sheet-like substrate (the surface provided with the contact part332). There are no particular limitations on the size of the sheet composing the substrate333. For example, in the case of a square-shaped electrode for electrocardiogram use, one side may be set at about 30 mm (e.g., in a range from 5 mm to 75 mm). A specific example of a biological electrode330is shown inFIG.25A-25B. The upper level shows a side view, and the lower level shows a frontal view. The holder335is omitted from the drawings. In the example ofFIG.25A-25B, multiple contacts331are arranged in parallel in the lateral direction on the page surface, and the two ends of each contact331are connected to the signal cables334disposed in the vertical direction on the page surface. The two ends of the contact331penetrate the substrate333to connect to the signal cables334. In the illustrated example, with respect to the surfaces of the substrate333that is the base material, the signal cables334are disposed on the opposite surface (the rear surface) from the surface (front surface) on which the contacts331are arranged and fixed. With this configuration, the contacts331can be drawn to the substrate surface by the signal cables334. The surface on which the signal cables334are disposed may be the front surface rather than the rear surface of the substrate333 At overlapping positions of the contact332and the substrate333, apertures336are provided in the substrate333. The apertures336function as ventilation holes (aeration holes). That is, when the electrode pad including the contact part332and the substrate333presses against skin, vapor or perspiration from the skin can discharge to the exterior of the electrode pad from the apertures336. There are no particular limitations on the form of the apertures336, provided that it is a form that pierces the substrate333, and allows passage of air, and any shape such as circular or rectangular is acceptable. The contacts331disposed on the front surface of the substrate333may be exposed to the rear surface of the substrate333through the apertures336. There are no particular limitations on the positions where the apertures336are disposed in the substrate333, but are preferably disposed so that the multiple apertures336are mutually symmetrical relative to the center of the substrate333. The multiple apertures336are also preferably provided at positions that overlap with the contact part332. There are no particular limitations on the total aperture area of the apertures336provided in the substrate333. Setting of a large aperture area that would impair the structural strength of the substrate333is preferably to be avoided, and ordinarily an aperture area is about 1-40% of the area of the substrate333is preferable. Selection of the aperture area is preferably made within the above range according to purpose, and, for example, 1-20%, 20-40%, or 10-30% is acceptable. Within the aforementioned range, the structural strength of the substrate333can be adequately maintained, aeration properties between the substrate333and the skin can be improved, and steaming of the skin can be mitigated. The total aperture area of the apertures336provided at positions overlapping the contact part332is preferably about 2-60% of the area of the contact part332. Selection is preferably made within this range according to purpose, and for example, 2-40%, 40-60%, 10-30%, or 5-45% is acceptable. Within the aforementioned range, the structural strength of the contact part332can be adequately maintained, aeration properties between the contact part332and the skin can be improved, and steaming of the skin can be mitigated. As shown inFIG.25B, a humidity control pad337may be provided on the surface (rear surface) of the substrate333that is opposite the contact part332. Vapor or perspiration that passes through the apertures336can be absorbed by the humidity control pad337. There are no particular limitations on the material of the humidity control pad337, provided that it is material having water absorbency. A humidity control cover338may also be provided for purposes of covering or fixing the humidity control pad337. The humidity control pad337does not only absorb skin perspiration and the like, but can also be used for the purpose of supplying a humectant such as water or glycerol to the skin and the contacts, by impregnating the humidity control pad337in advance with a humectant such as water or glycerol. InFIG.25A-25B, the contacts331disposed on the front surface of the substrate333may be exposed to the rear surface of the substrate333by the apertures336, and the contacts331may contact the humidity control pad337. By means of this contact, water and the like can be supplied to the contacts331. By providing the apertures336in the substrate333, it is possible to respond to a variety of skin conditions from situations of copious perspiration and susceptibility to steaming such as in summertime, among young people, and during exercise, to situations of dryness such as in wintertime, among the elderly, and during repose. The apertures336free skin that is closed (covered) by the electrode pad, and are not only provided for the purpose of diffusing humidity, but may also be provided for the purpose of actively supplying moisture to skin. That is, removal of perspiration and adjustment of humidity can be achieved by providing a water absorbent pad (sponge or the like)337on the apertures336. By including water, glycerol, or moisturizers in the aforementioned humidity control pad337in environments susceptible to dryness, the aforementioned ingredients can be supplied to the contacts331and the skin from the pad337. For purposes of humidity control during dryness, the exterior of the aforementioned humidity control pad337is preferably covered with a cover of PVC or the like. As the conductive composite fibers composing the contacts331have moderate hygroscopic properties, and as moisture is transported and dispersed by capillary action in the minute fibers composing the contacts331, smooth humidity regulation is possible in the periphery of the contacts332by establishment of the apertures336and the pad337. The size (area) of the apertures336can be suitably adjusted according to usage conditions such as room temperature, humidity, exercise, and presence or absence of fever. There are no particular limitations on the total area of an individual or multiple aperture(s)336provided in the substrate333, provided that the structural strength of the substrate333can be suitably maintained. For example, adjustment of the total area can be conducted in a range from 0.1 to 50% relative to the area of the sheet-like substrate333composing the electrode pad. Selection of the total area is preferably conducted within the above range according to purpose, and, for example, 0.1-30%, 30-50%, 5-40%, 15-50%, 0.1-5%, and so on are acceptable. A description of the conductive composite fibers composing the contacts331is identical to the description of the conductive composite fibers of the above-described first embodiment. Moreover, a description of the structure of the contacts331is identical to the description of the contacts of the above-described first embodiment. There are no particular limitations on the density of the contacts331in the contact part332, on the number of contacts331per unit area of the contact part332, and on the area of the contact part332, and these may be suitably adjusted according to application. With respect to the density of the contacts331in the contact part332when, for example, contacts331(fiber bundles) with a diameter of 280 microns are arranged in parallel, 30 contacts would normally be used at an electrode width of 10 mm, but one is not limited thereto. For example, it is possible to conduct adjustment of the number within a range from 1 to 200. More specifically, for example, with respect to a biological electrode for electrocardiogram measurement, when conductive composite fiber bundles (contacts in which composite fiber of PEDOT-PSS and silk is impregnated with glycerol) which are identical to those in Example 3-1 described below are arranged in parallel without gaps and fixed to a substrate for use, the contact area with skin (the area of the contact part332) may be set at 1 cm×1 cm (100 mm2), and can normally be set to 10-50,000 mm2. In the case where the aforementioned biological electrode for electrocardiogram measurement is used as a skin surface electrode for electrical stimulation, the range of the contact area of the electrode can be set, for example, to 10-50,000 mm2. There are no particular limitations on the method of arrangement of the contacts331in the contact part332, and it may be suitably adjusted according to application. For example, not only may multiple contacts331(conductive composite fiber bundles) be arranged in parallel without gaps, but it is also possible to adopt a configuration wherein multiple contacts331are laid in multiple layers, a configuration wherein multiple contacts331are formed into cloth-like form by weaving or knitting, and a towel-like configuration wherein multiple contacts331are napped on a fabric. A configuration in which multiple contacts331mutually overlap poses no problems for use, because the respective contacts331are in mutual contact, and are electrically connected (conductivity is obtained). It is also acceptable to adopt a configuration wherein the gaps between the multiple contacts331in the contact part332are widened, and the multiple contacts331are sparsely arranged. In such a configuration, the surface of the substrate333is exposed through the gaps in the contacts331, thereby enabling the aforementioned exposed surface to directly contact skin from between the contacts331. Consequently, by imparting adhesive properties to the aforementioned exposed surface of the substrate333, it is possible to adjust the adhesive force of the electrode pad relative to skin, the current density, and the contact range between the contact part332of the electrode and the skin. The aforementioned conductive composite fibers are maintained in a moderately moist (wet) state by impregnating the conductive composite fibers composing the contacts331with moisturizing ingredients such as glycerol, and by having moisture (perspiration) from the skin on which the biological electrode is set absorbed by the aforementioned conductive composite fibers. When the aforementioned conductive composite fibers are moderately moist, a light tackiness is produced in the aforementioned conductive composite fibers. There are no particular limitations on the method for attaching the electrode pad of the biological electrode330to a skin surface, provided that it is a method enabling stable fixation of the biological electrode. For example, utilizing the aforementioned tackiness possessed by the conductive composite fibers, or the tackiness of the sheet-like substrate333, it is possible to independently affix the electrode pad alone to the skin. When the contact part332in which the contacts331are arranged are brought into contact with a body surface (skin surface), the contacts331are quickly affixed to the skin surface, and conduction is obtained between the contacts331and the skin surface, enabling obtainment of biological signals. The biological signals are transmitted to an external device such as a biological amp through the signal cable334(metallic conductor wire) connected to the contacts331. Utilizing the tackiness possessed by the electrode pad in this manner, it is possible to fix (attach) the electrode pad alone to a skin surface. With this fixation method, the fixing force relative to skin is not high, because the electrode pad is affixed to the skin utilizing the weak adhesion of the substrate333, and the adhesion produced by the wetness of the conductive composite fibers of the contacts331. Therefore, there is a possibility that the electrode pad could be displaced or come off due to pulling of the signal cable334or significant body movement. Thus, with a view to stable retention of the electrode pad and prevention of displacement or separation, the holder335may be applied in order to press the electrode pad against the skin surface S. There are no particular limitations on the configuration such as the form or size of the holder335. For example, one may cite a method wherein, using a band-like stretchable fabric (drape) like that shown inFIG.25A-25B, electrode pads338are attached to the skin surface S of a body B, and the stretchable holder335is wound so that it enwraps the torso circumference of the body B from above the electrode pads338. With this configuration, the electrode pads338do not easily come off even when there is significant movement of the body B, and the electrode pads338can be more stably fixed. For example, as shown inFIG.26A-26B, the holder335can be set on the inside of an undershirt (shirt) T. The electrode pads338and a portion of the holder335are fastened to the inside of the undershirt T. The holder335and the electrode pads338are structurally independent, and the holder335is made so that it is capable of moving in the transverse direction over the electrode pads338, i.e., capable of moving (capable of shifting) in a direction along the surface of the body B. Therefore, the holder335and the electrode pads338are preferably disposed so that they can be distanced from each other, and the holder335and the electrode pads338are preferably not completely fixed. Thus, the holder335and the electrode pads338are structurally independent, the contact sites of the holder335and the electrode pads338are not fixed, and the holder335is capable of sliding over the electrode pads338at the aforementioned contacts sites, whereby it is possible to inhibit the electrode pads338from coming off due to displacement of the body B and the undershirt T, the attenuation of biological signals, and the occurrence of noise associated with electrode displacement. Moreover, when necessary, the holder335can be proactively withdrawn from the body B, and the electrode pads338can be removed and/or replaced. The holder335can play the role of stably holding the electrode pads338, and can also be utilized to hold accessories of the biological electrode (a cable, a connector, an amp339, and so on). There are no particular limitations on the base fabric (material) composing the holder335. For example, among cloth, sheet, mesh, rubber band, and the like, use of a stretchable base fabric is preferable. Specifically, band-like two-way stretchable cloth or lycra (registered trademark) (general name: Spandex) (manufactured by Toray, Ltd.) can be used by stitching it to the inside of an undershirt at a width (longitudinal length) of 15 cm to conform to the height of the heart (seeFIG.25A-25B). This holder is well suited for use as, for example, the holder of an electrocardiogram electrode (for CC5 induction). In the case of CC5, a configuration can be adopted wherein the electrode pads338are set up on the left and right of the anterior chest, and these are covered by the electrode holder335. The holder335is not limited for the case where it is attached to the inside of an undershirt of the upper body as described above, and, for example, it may also be attached by being wound in a band-like manner around a limb, head, neck, or finger according to the application of the biological electrode330. The material of the holder335is not limited to the aforementioned Spandex, and various types of cloth, sheet, mesh, band, and the like can be used provided that they are stretchable flat material (base fabric). <<Effects Obtained by the Biological Electrodes of the First Embodiment and Second Embodiment of the Third Aspect of the Present Invention>> Examples of the effects obtained by the materials and structures with which the biological electrodes of the respective embodiments are provided are cited as follows. When the biological electrode pertaining to the present invention is attached to a measurement site, there is no need to use conductive gel (electrolytic gel) or conductive paste (electrolytic paste). By not using conductive gel or paste, the following effects (A)-(E) are obtained. (A) Wear Feeling is Improved. Occurrence of discomfort associated with attachment of the electrode to skin is inhibited. As the aforementioned gel or paste is not used, there is no need to seal the skin with liquid or gel, and the electrode can be attached in a state where the skin is exposed to the external air. That is, measurement can be conducted in a state where the cord-like electrode lightly contacts the skin, or in a state where a soft cloth-like electrode touches the skin. (B) Trouble Caused by Electrolytic Paste is Avoided. There is no risk of occurrence of contact defects or noise in the case where the electrolytic fluid leaks out or the moisture of the aforementioned gel or paste dries up. (C) Electrical Properties of the Electrode are Improved. Electrode resistance per unit area can be lowered to less than that of a conventional biological electrode. This is advantageous for measurement of weak signals such as brain waves or evoked potential. Moreover, as the electrode of the present invention has little capacitance, high-frequency transmission properties are excellent, and this is advantageous for recording biological signals containing high-frequency components such as brain waves and electrocardiograms. (D) The Convenience of Use of the Electrode is High. As the aforementioned paste or gel is not used, there is no need for an operation to remove the aforementioned paste or gel after measurement (after testing). For example, one can omit hair washing after brainwave measurement, which is necessary with use of conventional electrodes. (E) Downsizing of the Electrode is Possible. As electrode resistance per unit area is less than that of a conventional electrode, the electrode can have a smaller size, a lighter weight, and a higher density than a conventional biological electrode. As a result of being provided with conductive composite fibers, the biological electrode of the present invention can obtain the following effects (F)-(K). (F) Stability of Attachment is Improved. Stable attachment of the electrode is possible by light pressure or weakly adhesive material. There is no need for a powerful adhesive agent, or for strong pressure fixation by band, headgear and the like, as with conventional biological electrodes. (G) Low-Noise Signals are Obtained. Due to the properties of the conductive composite fibers including adhesion, flexibility, thinness, and light weight, there is little unnecessary vibration of the electrode during body movement when the electrode wearer (subject) moves, mitigating noise. (H) A Natural External Appearance is Obtained. Particularly in brainwave electrode applications, the electrodes do not stand out even when attached, due to downsizing and flattening of the electrodes, and a design that conceals the electrodes under head hair. That is, brainwave measurement is possible at all times during daily life. (I) Skin Steaming Due to Attachment of Biological Electrodes Over Long Periods can be Mitigated. Generally, when electrodes are continuously attached over long periods, skin steaming tends to occur due to perspiration of the skin. However, in the case where the biological electrode of the present invention uses hydrophilic conductive composite fiber in the electrode material, and provides apertures for aeration in the substrate as described above, skin steaming when use of the electrode is conducted over long periods can be further mitigated. (J) The Range of Application of the Biological Electrode can be Expanded. The overall form (basic form) of the biological electrode can be fashioned into a thin planar shape (cloth shape) or linear shape (cord shape). As the electrode is lighter in weight, flatter, and more flexible than conventional electrodes, it is possible to fabricate electrodes with a linear shape that is thinner than a cord shape. In addition, the wear feeling is also comfortable. Due to these properties, the biological electrode of the present invention can be applied as a wearable electrode, and its range of application can be expanded. (K) Measurement can be Conducted with a Stability that is Equal or Superior to that of Conventional Biological Electrodes. Even when used without electrolytic paste (pasteless), the biological electrode of the present invention is able to overcome the immixture of noise and the instability of measured signals that are drawbacks of conventional pasteless electrodes. That is, it is possible to obtain a stability of measured signals that is equal or superior to that of conventional biological electrodes for medical treatment that use electrolytic paste. A detailed description of conductive polymer fibers is given below that can be used as conductive composite fibers composing the biological electrode of the present invention. However, the aforementioned conductive composite fibers are not limited to these conductive polymer fibers. Regarding the Fourth Aspect The fourth aspect of the present invention relates to an implantable electrode and a device for measuring biological signals. More specifically, the present invention relates to an implantable biological electrode which uses composite material of conductive polymer and fibers (hereinafter “conductive composite fibers”), and a biological signal measurement device provided with the biological electrode. Embodiments of the fourth aspect of the present invention are described below with reference to drawings, but the present invention is not limited by the pertinent embodiments. As stated above, PEDOT-PSS which is a known conductive polymer gelatinizes in biological tissue due to its high water absorbency, greatly reducing its mechanical strength. Consequently, it is difficult to set PEDOT-PSS that is worked into a needle shape or rod shape within a living body alone. Even supposing that it were possible to implant PEDOT-PSS in biological tissue, there is the problem that the wire connection part of the electrode that is composed with PEDOT-PSS alone and the metallic conductor wire (cable) that connects to an external device is susceptible to embrittlement and breakage (disconnection). With the fourth aspect of the present invention, conductive composite fibers compounded from conductive polymer and fibers are used as the implantable electrode. Accordingly the problems of dissolution of the electrode itself, and embrittlement of the wire connection of the conductive polymer and the metallic conductor wire, which is caused by moisture absorption by the conductive polymer, can be solved. First Embodiment of the Fourth Aspect An implantable electrode410of a first embodiment of the fourth aspect of the present invention shown inFIG.29A-29Cis provided with a conductive composite fiber bundle401which is formed into a rod shape (needle shape) in which conductive composite fibers containing conductive polymer are multiply bundled. A metallic conductor wire402is wound around a portion of the conductive composite fiber bundle401, forming a wire connection part403. The wire connection part403is coated by a polymer404(resin) that is insulating and water resistant. Either before or after moisture absorption, the conductive composite fiber bundle401has better mechanical strength than a conductor of conductive polymer alone that is molded into a rod shape of the same diameter. Consequently, it is possible to prevent breakage of the conductive composite fiber bundle401when it is implanted into biological tissue, and dissolution of the conductive composite fiber bundle401in biological tissue after implantation. The conductive composite fiber bundle401is preferably in a dry state prior to use. As the conductive composite fiber bundle401in a dry state has high mechanical strength, and is contracted compared to when wet, it has a relatively small volume. Therefore, by using the conductive composite fiber bundle401in a dry contracted state, its invasiveness can be mitigated during insertion into biological tissue. (Conductive Composite Fibers) As the conductive composite fibers composing the conductive composite fiber bundle401, composite fibers of conductive polymer and known fiber material may be applied. There are no particular limitations on the compounding configuration (method). For example, a configuration is acceptable wherein the conductive polymer is coated onto a surface of the aforementioned fiber material that is thread-shaped (cord-shaped), a configuration is acceptable wherein the aforementioned fiber material that is thread-shaped is impregnated with the conductive polymer, and a configuration is acceptable wherein thread-shaped conductive polymer and the aforementioned fiber material that is thread-shaped are intertwined or spun together. The fiber described in the first embodiment of the present invention may be preferentially used. There are no particular limitations on the type of the aforementioned conductive polymer, and known conductive polymer may be applied. For example, in addition to the aforementioned PEDOT-PSS, hydrophilic conductive polymer such as PEDOT-S(poly(4-(2,3-dihydrothieno[3,4-b] [1,4]dioxin-2yl-methoxy-1-butanesulfonic acid, potassium salt) may be cited. By using composite fiber containing hydrophilic conductive polymer as a material of the conductive composite fiber bundle1, adhesive properties (tackiness), which can adhere to a needle405, can be easily imparted by the conductive composite fiber bundle401itself. As the fiber material, for example, known fiber material may be applied such as silk, cotton, hemp, rayon, and chemical fiber. Of these, silk is optimal. When silk is used, the strength and hydrophilicity of the aforementioned composite fiber can be enhanced. Moreover, silk is preferable, because it has almost no toxicity relative to biological tissue, inhibits arousal of inflammation due to immune reaction, and has excellent compatibility with biological tissue. There are no particular limitations on the type of the aforementioned conductive polymer that is combined with silk, but hydrophilic conductive polymer such as the aforementioned PEDOT-PSS or PEDOT-S is preferable. There are no particular limitations on the length and diameter of the conductive composite fiber composing the implantable electrode of the present invention, and these may be suitably adjusted according to the length and diameter of the fiber material that is compounded. There are no particular limitations on the length and size of the conductive composite fiber bundle composed by intertwining and/or bonding of multiple conductive composite fibers, and these may be suitably adjusted according to purpose or application. For example, diameter within a range of 0.01 μm-5 mm is acceptable, and length within a range of 0.1 μm-1 m is acceptable. As another example, diameter within a range of 0.1 μm-1 mm is also acceptable, and length within a range of 0.1 μm-50 cm is also acceptable. To cite a specific case, for example, the diameter of the rod-shaped conductive composite fiber bundle401shown inFIG.29A-29Cmay be set at 0.1 μm-500 μm, and its length may be set at 1 μm-10 mm. The thickness of the coil-shaped conductive composite fiber bundle401shown inFIG.31A-31Cmay, for example, be set at 10 μm-500 μm, and its length may be set at 100 μm-50 cm. Now, the aforementioned diameter and length are diameter and total extendable length in a state where the conductive composite fiber bundle401wound in a coil shape is stretched out. The external diameter of the coil in a state where it is wound in the coil shape shown inFIG.31A-31Cmay be set, for example, at 10 μm-5 mm, and length of the coil in the direction of the central axis of the aforementioned coil may be set, for example, at 100 μm-50 mm. In addition, the diameter of the conductive composite fiber bundle401connected to the surgical thread shown inFIG.32A-32Dmay be set, for example, at 0.1 μm-500 μm, and its length may be set at 1 μm-10 cm. The diameter of the conductive composite fiber bundle401composing the core part shown inFIG.33Bmay be set, for example, at 10 μm-10 mm, and its length may be set, for example, at 10 μm-50 cm. With respect to the conductive composite fiber composing the implantable electrodes of the respective embodiments of the present invention, the conductive polymer fiber described in further detail below may be applied. (Bonding of Needle and Conductive Composite Fiber Bundle) The conductive composite fiber bundle401of the first embodiment of the fourth aspect is bonded to the distal end of the needle405(guide needle). When the conductive composite fiber bundle401is wetted with water or alcohol or the like, the conductive polymer in its surface has adhesiveness (tacky), and is fixed by contracting when it is dried again. Utilizing these properties, it is possible to bond (fix) the conductive composite fiber bundle401to the distal end of the needle405(FIG.29A). When the implantable electrode410having this configuration is inserted into biological tissue, the conductive composite fiber bundle401absorbs body fluid (extracellular fluid or cerebrospinal fluid or the like), and swells (FIG.29B). Furthermore, as the bonding force (fixing force) of the swollen conductive composite fiber bundle401and the needle405decreases, it is possible to withdraw the needle405while the conductive composite fiber bundle401remains inside the biological tissue (FIG.29C). The conductive composite fiber bundle401that is set inside biological tissue is connected to an external device via the conductor wire402(metallic conductor wire402), and receiving and transmission of signals (electrical signals or electrical stimulation) are preferable. There are no particular limitations on the constituent material of the needle405, and one may cite, for example, metal such as gold, platinum, and copper, carbon or resin (plastic), and the like. The conductor wire402is preferably wire material capable of electrical conduction with respect to the conductive composite fiber bundle and the external device. There are no particular limitations on the constituent material of the conductor wire402, and one may apply, for example, metal, silicon, carbon, and so on. There are no particular limitations on the type of the aforementioned metal, and metal used in conventional electric wire is acceptable. As the electric wire402that is implanted in biological tissue prevents pickup of electrical noise, and functions stably over long periods, the electric wire402is preferably coated with a polymer having insulating and water resistant properties. There are no particular limitations on the type of the aforementioned polymer, and the below-described water resistant polymer that coats the conductive composite fiber bundle of the fourth embodiment of the present invention may be applied. There are no particular limitations on the diameter and length of the electric wire402, and these may be suitably adjusted according to application. As the method of bonding the conductive composite fiber bundle401to the needle405, in addition to the method of utilizing the above-described adhesiveness of conductive polymer, wherein the adhesiveness causes when it is wet, it is also acceptable to conduct bonding via hydrophilic adhesive material (an adhesive agent). There are no particular limitations on the aforementioned adhesive material, but material is preferable which can bond (demonstrate adhesion with respect to) the conductive composite fiber bundle1and the needle5in a dry state, and which decreases in bonding force (adhesive force) due to moisture absorption. For example, one may cite material containing PEG (polyethylene glycol), PEDOT-PSS, polylactic acid, sorbitol, fibrin glue, starch glue, and so on. There are no particular limitations on the type of the aforementioned PEG, and one may use, for example, a relatively high polymer PEG which is solid at a temperature between room temperature (e.g., 20° C.) and at body temperature (e.g., 40° C.), and which becomes liquid when heated. After applying the PEG, that has been heated and dissolved, to the needle, and subsequently bringing the conductive composite fiber bundle into contact with the needle, the PEG is solidified by returning to room temperature, thereby enabling bonding of the needle and the fiber bundle. When this structure is placed in an environment where body fluid such as within tissue exists, the PEG gradually dissolves, enabling the conductive composite fiber bundle to naturally separate from the needle. As a method for bonding the conductive composite fiber bundle401to the needle405, it is also acceptable to indirectly bond the conductive composite fiber bundle401and the needle405via the aforementioned adhesive material that is applied to the polymer404that coats the wire connection part403. (Protection of the Wire Connection Part) The wire connection part403is coated by the polymer404. As the conductive composite fiber bundle401composing the wire connection part403is coated by the polymer404in the biological tissue, there occurs hardly any swelling or mechanical strength reduction due to moisture absorption. Moreover, as the mechanical strength of the conductive composite fiber bundle401is increased by its compounding with the fiber material, there is no breakage (disconnection) of the wire connection between the conductive composite fiber bundle401and the metallic wire connection403even after moisture absorption, and electrical connection can be fully maintained. There no particular limitations on the method for connecting the metallic conductor wire402to the conductive composite fiber bundle401in the wire connection part403, and, for example, one may cite a method involving bonding by winding, ligature, caulking, or an adhesive agent (silver paste, silver epoxy, and the like). There are no particular limitations on the type of the polymer404that coats the wire connection part403, and one may cite, for example, silicone, PTFE (polytetrafluoroethylene), PVC (polyvinyl chloride), and so on. By coating the wire connection part403with the polymer404, electrical short circuits can be prevented, and the wire connection part403can be protected. (Implantation of the Electrode into the Body) As a method for implanting the implantable electrode410of the first embodiment of the fourth aspect within biological tissue, one may cite, for example, a method wherein a manipulator capable of high-speed operation is used to insert the needle405at high speed (in a short time) into a living body. The needle405leads the way in penetrating to a prescribed position within the body, introducing both the conductive composite fiber bundle401bonded to the needle405and the connected metallic conductor wire402to the prescribed position within the body. This insertion is completed at high speed, and is preferably completed before the start of swelling of the conductive composite fiber bundle401in the body. There are no particular limitations on the insertion speed, and it may be conducted, for example, at 100-1000 mm/sec. As a specific example, using an electrically conducting actuator capable of high-speed operation, insertion can be conducted at a speed of 10-20 msec so that the conductive composite fiber bundle401of the implantable electrode410is implanted to a depth of 2 mm below the cerebral cortex of an animal. Subsequently, the conductive composite fiber bundle401swells due to body fluid, and the aforementioned adhesive material bonding the conductive composite fiber bundle401and the needle405dissolves, enabling the needle405alone to be withdrawn at the stage where the bonding force has weakened. The conductive composite fiber bundle401implanted in the biological tissue swells, closely adhering to the surrounding biological tissue. (Implantation of Multiple Electrodes) The implantable electrode410of the first embodiment may be provided with a single conductive composite fiber bundle401at the distal end of the needle405as shown inFIG.30A, or it may be provided with multiple conductive composite fiber bundles401at the needle405as shown inFIG.30B-30C. In the configuration ofFIG.30B, the heights of the bonding sites of the two conductive composite fiber bundles401on the needle405are staggered (their positions in the lengthwise direction of the needle405are changed). With this configuration, the respective conductive composite fiber bundles401can be implanted at respectively different heights (depths) when inserted into the body, and can function as respectively independent electrodes (2ch electrode). In the configuration example ofFIG.30B, the conductive composite fiber bundles401are fixed to the two sides sandwiching the needle405when viewed from the side and from the bottom, but the two electrodes may also be fixed to one side of the needle405. In such a case, when viewed from the bottom surface, the two conductive composite fiber bundles401would be observed overlapping in the depthward direction (in the height direction). That is, the cross-sectional area would be reduced. When fixed in this manner, the invasiveness inflicted on biological tissue when inserted into the body can be further mitigated. In the configuration ofFIG.30C, the heights of the bonding sites of the four conductive composite fiber bundles401on the needle405are identical, and the four conductive composite fiber bundles401are disposed so as to surround the perimeter of the needle405. In this case, the four conductive composite fiber bundles401(4chelectrode) can be implanted in the biological tissue centering on the position where the needle405is inserted. Second Embodiment of the Fourth Aspect An implantable electrode420of the second embodiment of the fourth aspect of the present invention shown inFIG.31A-31Cis identical to the first embodiment, except that the conductive composite fiber bundle401is wound around the distal end of the needle405in a coil shape. InFIG.31A-31C, the same code numbers are assigned to components identical to the first embodiment of the fourth aspect. The coil-shaped conductive composite fiber bundle401may be bonded to the distal end of the needle405, or it may simply be wound around it. As the coil-shaped conductive composite fiber bundle401is firmly wound around the distal end of the needle405, when insertion into biological tissue is conducted in the distal direction of the needle405, the conductive composite fiber bundle401is prevented from falling off the needle405(FIG.31A). Moreover, as the outer diameter of the coil (the diameter of a circle drawn by rotation of the coil) is small when it is dry and contracted, invasiveness relative to the biological tissue is mitigated. The implantable electrode420inserted into the biological tissue swells due to absorption of body fluid by the conductive composite fiber bundle1, becoming a swollen fiber bundle401′ (FIG.31B), i.e., the coil spontaneously expands with enlargement of its external diameter, resulting in close adhesion of the conductive composite fiber bundle401and the biological tissue. As the bonding force of the conductive composite fiber bundle401and the needle405weakens due to moisture absorption, the needle405can be withdrawn while the conductive composite fiber bundle401remains in the biological tissue (FIG.31C). The implantable electrode420of the second embodiment having the coil-shaped conductive composite fiber bundle401is suited to cases where atrophia or dead space could form in biological tissue due to implantation of the electrode (the conductive composite fiber bundle401), or cases where the cells or nerve fibers subject to measurement are scattered within the biological tissue. Third Embodiment of the Fourth Aspect An implantable electrode430of a third embodiment of the fourth aspect of the present invention is shown inFIG.32A-32D. The metallic conductor wire402is connected to one end of the conductive composite fiber bundle401, and a surgical nylon monofilament thread406is bonded to the other end by the above-described method. A curved needle405for surgical stitching is attached to the nylon thread406. A method is exemplified in which the implantable electrode430is placed within a nerve cord (bundle). According to a microsurgical operation technique using neurovascular suturing, the needle405is made to pass through (pierce) a nerve cord N′ (FIG.32A), and the nylon thread406is pulled upward in a procedure that sutures the nerve cord N′, whereby the conductive composite fiber bundle401that is pulled by the nylon thread406is introduced into the nerve cord N′ (FIG.32B). Subsequently, as a result of body fluid absorption by the conductive composite fiber bundle401at a prescribed position within the nerve cord N′, the nylon thread406detaches from the conductive composite fiber bundle401, and can be removed to the outside of the nerve cord N′. The conductive composite fiber bundle401implanted within the nerve cord N′ swells due to moisture absorption, closely adhering to the interior of the nerve cord N′ (FIG.32C).FIG.32Dshows a situation where multiple implantable electrodes are placed in multiple nerve cords N′ within a nerve bundle. Peripheral nerves have many mixed nerves including motor, sensory, and autonomic nerves, and form nerve bundles. As a nerve cord runs three-dimensionally through the interior of a nerve bundle, and as there are large individual variations in the distribution of nerve bundle and cord, it is difficult to identify a nerve cord by brain coordinates as with the central nerves, but it is possible to clinically identify the principal nerve fibers by observation under a microscope and measurement of neural activity. The implantable electrode of the third embodiment uses these clinical techniques to enable selective signal recording and stimulation of motor, sensory, and autonomic nerves. The implantable electrode of the third embodiment is not only implanted by surgical techniques, but can also be mechanically inserted by an automatic anastomosis apparatus or a micromanipulator or the like. (Adjustment of Moisture Absorption Speed) It is possible to slow the speed with which the conductive composite fibers and the conductive composite fiber bundle(s) composing the implantable electrode of the present invention absorb body fluid within the body. As a method for causing delay, there is a method in which one or more of glycerol, sorbitol, ethylene glycol, squalane, silicone, mineral oil, or MPC (2-methacryloyloxyethylphosphoryl choline) impregnate or are applied to the conductive composite fibers (bundles) in advance. For example, by impregnating the conductive composite fiber bundle401of the third embodiment in advance with glycerol, even if electrode implantation into the body proves difficult, and surgical operation time is prolonged, it is possible to prevent occurrence of moisture absorption-induced swelling of the conductive composite fiber bundle401and detachment of the nylon thread406during the aforementioned surgical operation. By maintaining a narrow diameter of the conductive composite fiber bundle401, invasiveness relative to biological tissue during electrode implantation can be mitigated. Fourth Embodiment of the Fourth Aspect With respect to an implantable electrode440of a fourth embodiment of the present invention, as shown inFIGS.33A and33B, the conductive composite fiber (bundle)401formed in the form of a rod (needle) or cord (cable) is used as a core part, and the perimeter of at least a portion of the core part is coated with a water resistant polymer404, forming a flow path so that a liquid can infiltrate (permeate) from one end1a(401a) to the other end1bof the core part. The one end1aand the other end1bare not coated with the polymer404, and are exposed. “Flow path” does not merely signify a hollow tube, but signifies a configuration wherein the water resistant polymer404configures a tube, and the conductive composite fiber bundle401is disposed inside the tube. As the conductive composite fiber bundle401is water absorbent and substance-permeable, a liquid can spontaneously move by infiltrating from the one end1ato the other end1b. The method for transporting a liquid or substance through the flow path is not limited to infiltration, capillary action, diffusion, and the like, and it is also possible to adopt a method wherein a substance is subjected to electrophoresis by establishing either the one end1aor the other end1bas a positive electrode, and the other as a negative electrode, or a method which conducts liquid feeding by connecting a pump (e.g., an osmotic pump) to the one end1a, and applying pressure to the liquid. Whichever method is used, drug transport and liquid feeding can be stably conducted at constant speed. A reservoir407(FIG.33A) or a chamber408(FIG.33B) into which a medicinal solution can enter is connected to the one end1aof the core part configured by the conductive composite fiber bundle401. A liquid feeding pump may be connected to a tube connector409provided in the chamber408. By storing a solution containing a drug in the reservoir407or the chamber408, the aforementioned solution can infiltrate the aforementioned flow path, and pass from the one end1ato the other end1bof the core part. Therefore, the drug can be administered locally to the environs of the other end1bby placing the other end1bat a desired position in biological tissue. There are no particular limitations on the type of the aforementioned drug, but it is preferable to use a drug which has pharmacological action inhibiting or promoting a biological reaction. As the aforementioned drug, one may cite, for example, a drug that reduces impairment of biological tissue, a drug that promotes repair of biological tissue, a drug that causes growth of biological tissue, and so on. Specifically, for example, one may cite soluble drugs of glycerol, sorbitol, mannitol, fructose, BDNF (brain-derived neurotrophic factor), NGF (nerve growth factor), NT3 (neurotrophin-3), GSNO (S-nitrosoglutathione), SKF96365, cilostazol, TRIM (1-(2-trifluoromethylphenyl) imidazole), gadolinium, magnesium, EGTA (ethylene glycol tetraacetic acid), ruthenium red, and the like. One may cite a configuration wherein a solution in which one or more of these drugs is dissolved is stored in the reservoir407of the chamber408. There are no particular limitations on the type of water resistant polymer404coating the core part, provided that it is a polymer enabling formation of a coating layer on the circumference of the core part (formation of a water seal on the outer surface of the core part), and, for example, polymer (resin) that is used in the field of conventional medical instruments such as catheters may be applied. The water resistant polymer404is also preferably endowed with insulating properties in order to avoid an electrical short-circuit between the conductive composite fibers401composing the core part and the ambient environment. There are no particular limitations on the thickness of the coating layer composed by the water-resistant polymer404. For example, one may cite 0.1 μm-5 mm. As specific examples of the water-resistant polymer404, one may cite silicone, PTFE (polytetrafluoroethylene), PVC (polyvinyl chloride), ABS (acrylonitrile butadiene styrene), ANS (acrylonitrile styrene), PEN (polyethylene naphthalate), PBT (polybutylene terephthalate), polycarbonate, PEI (polyether imide), PES (polyether sulfone), PET (polyethylene terephthalate), polyamide, aromatic polyamide, polyester, polyether block amide copolymer, polymethyl methacrylate, polyurethane, EVA (ethylene vinyl acetate), ethylene vinyl alcohol, polyethylene, latex rubber, PTFE, FEP, PFA, polypropylene, polysiloxane, ionomer, SAN (styrene acrylonitrile), nylon, thermoplastic elastomer, and so on. The aforementioned drug may be impregnated in or applied to the conductive composite fibers composing the implantable electrode of the present invention in advance. In this case, as well, the aforementioned drug is gradually released from the aforementioned conductive composite fibers that are implanted in biological tissue, and the aforementioned drug can be locally administered to the environs of the aforementioned conductive composite fibers. In a state where the other end1bof the core part is implanted in biological tissue, the other end1aand the reservoir407or chamber408may also be implanted in the biological tissue, or they may be disposed outside of the biological tissue. In the case where the one end1ais implanted in the biological tissue, the volume of the reservoir407or the chamber408connected to the one end1ais preferably as small as possible. For example, one may cite a capsule-like reservoir407. In the case where the chamber408is placed within the biological tissue, it may also be connected to the exterior of the biological tissue via the tube connector409provided in the chamber408. From the standpoint of reducing invasiveness relative to the biological tissue, the one end1aof the core part and the reservoir407or the chamber408are preferably set up outside the biological tissue. The core part which is coated by the water-resistant polymer404may be fabricated with a desired length (e.g., 100 μm-10 cm) and thickness (e.g., 10 μm-5 mm) according to application. There are no particular limitations on the size and constituent material of the reservoir407and the chamber408, and these may be suitably modified according to the purpose and mode of use. For example, a plastic bag or case of silicone resin or the like may be applied as the reservoir407or the chamber408. In the fourth embodiment, there is no need to coat the entire interval from the one end1ato the other end1bof the conductive composite fiber bundle401with the water-resistant polymer404, and it is acceptable for a portion of the interval to have no coating. The interval where the conductive composite fiber bundle401functions as a liquid feed path is preferably coated with the water-resistant polymer404. In the fourth embodiment shown inFIGS.33A and33B, the interval from the vicinity of the other end1bto a part where the reservoir407or the chamber408is provided, which includes the one end1a, is coated with the water-resistant polymer404. There are no particular limitations on the method of connection of the one end1aand the reservoir407or the chamber408. A connection method may be cited wherein the one end1ais installed in an exposed state in the liquid storage part of the reservoir407or the chamber408, and the water-resistant polymer404that is coated toward the central side from the one end1amay be bonded to the outer wall of the reservoir407or the chamber408with a known adhesive agent or the like. (Application of Drug Delivery Function) Heretofore, upon implantation of an electrode into the cerebral nervous system (tissue of the central nervous system), there has been the problem that a limited impairment produced by the invasion during implantation expands, producing a permanent impairment over a wider region than the size of the electrode, and this needs to be remedied. The drug transport function (drug delivery function) possessed by the implantable electrode440of the fourth embodiment of the present invention may be applied to administer drugs for purposes of alleviating impairment due to electrode implantation, and demonstrates particularly remarkable effects in alleviating impairment produced by implantation in nerve tissue. By administering a drug—e.g., GSNO (S-nitrosogluthathione)—that has the effect of alleviating impairment of central nervous tissue from the other end1bof the aforementioned core part, the damage inflicted on central nervous tissue by the implantable electrode440can be greatly mitigated. As a result, transmission and receipt of signals between the electrode and the nervous tissue can be stably conducted with a high degree of accuracy over a longer period than before. A detailed explanation is given with reference to data in the below-described Example 4-4 (FIGS.34A-34D). In the case where a drug such as GSNO is used in combination with a conventional biological electrode made of metal or carbon, it is necessary to separately implant a tube (e.g. a microscopic hollow needle such as a microcapillary) to deliver the drug to the implantation site of the biological electrode. Or it is necessary to have a bundle structure wherein the microscopic hollow tube is stored (bundled) as an adjunct to the biological electrode in a single sheath (tube). In this type of bundle structure, the drug release holes (release ports) of the drug transport path are disposed at a distance from the electrode (incorporated into the sheath), with the result that not only is the configuration of the structure that is implanted into the biological tissue rendered more complicated, but it is also difficult to uniformly distribute the drug at the interface of the electrode and the biological tissue. On the other hand, with respect to the fourth embodiment of the present invention, as the conductive composite fiber bundle401that is the electrode itself doubles as a drug transport path, the structure is simple. Furthermore, as the drug seeps out from the surface of the electrode, it is possible to uniformly administered the drug to the interface where the electrode and the cellular tissue come into contact, i.e., to the region where the impairment occurs most. Moreover, the release speed of the drug can be adjusted by adding the aforementioned additives such as glycerol to the conductive composite fiber bundle401. The drug transport function (drug delivery function) of the implantable electrode440of the fourth embodiment of the fourth aspect of the present invention is not limited to drug administration applications for purposes of alleviating impairments to biological tissue. For example, it can also be used in a variety of applications to stimulate or utilize the physiological functions of living cells and biological tissue, such as selective bonding of nerve fibers (selective formation of neural wiring) by neurotrophic factors, and recording of electrical signals associated with selective stimulation of nerve fibers. Moreover, the liquid that is distributed through the flow path of the implantable electrode440is not limited to drug solutions, and there are no particular limitations on its composition or function, provided that it is a liquid capable of infiltrating and moving through the conductive composite fiber bundle401. <<Examples of Effects Obtained by the Fourth Aspect of the Present Invention>> According to the implantable electrode of the present invention, for example, the following effects are obtained. 1. A biological electrode configured using flexible conductive composite fibers can be set within biological tissue. 2. Connection of the conductive composite fibers with an electric wire (signal cable) can be stably maintained within a living body. 3. A drug can be transported at constant speed to a site where the electrode contacts biological tissue. 4. Impairment of biological tissue (particularly of cerebral nervous tissue) due to placement (implantation) of the electrode can be alleviated. 5. It is possible to stably record biological signals over long periods. 6. The electrode can be three-dimensionally placed in conformity with a three-dimensional structure of neural tissue. EXAMPLES Examples of the First Aspect Next, the first aspect of the present invention is described in further detail with reference to Examples, but the first aspect of the present invention is not limited by the following Example. <Evaluation of Tensile Strength> Comparative Example 1-1 A liquid obtained by drying condensation of Heraeus CLEVIOS P solution (produced by Heraeus, Ltd.) was uniformly applied onto a plate, and naturally dried, and ethanol was further fixed thereon to fabricate a PEDOT-PSS film (sectional area 0.03 mm2, length 3 cm) which was used for test samples.FIG.9Ashows the results of studies respectively pertaining to tensile strength of the samples in a dry state and a wet state (a state in which pure water is absorbed until saturation). From the graph, it is clear that the tensile strength of PEDOT-PSS linear material in a wet state (on the right) has undergone a steep decline to the point where it is approximately 10% of tensile strength in a dry state (on the left). Example 1-1 FIG.9Bshows the results of studies pertaining to the tensile strength of raw material silk thread (No. 9 silk thread, produced by Fujix, Ltd.; twisted thread of 18 fibers of 21 D denier silk fiber, with a thread diameter of approximately 280 μm, and a length of 20 cm) in a dry state and a wet state (a state in which pure water is absorbed until saturation). FIG.9Bshows the results of studies of tensile strength in a dry state and a wet state (a state in which pure water is absorbed until saturation) of a conductive polymer fiber bundle of approximately 280 μm diameter consisting of PEDOT-PSS and the aforementioned silk thread (No. 9 silk thread) (hereinafter sometimes referred to as “PEDOT-PSS silk fiber bundle1”). The bundle was obtained by the above-described production method 2b by conducting immersion for one hour in 20 cc of the aforementioned CLEVIOS P solution, by subsequently using a comb-like multi-point electrode to conduct electrochemical fixation by energization of 3 mC per 1 cm using ethanol as an organic solvent, and then by removing 60% of the water by the blowing of dry air during partial drying of the moisture contained in the solution. The vertical axis of the graph represents maximum strength (CN: centimeter Newton), and the error bar represents a standard deviation per 10 specimens. The tensile strength test conformed to the JIS L 1013 standard, a constant rate extension type tester (manufactured by Orientec Co., Ltd., model RTC-1210A) was used with a fiber length between grips of 20 cm, and a tension speed of 20 cm/min, and maximum strength was obtained from an average of measured values from 10 tests. The specific measured values (CN) of the aforementioned graph are as follows.Dry unprocessed silk: average value=1350.4, standard deviation=8.11Wet unprocessed silk: average value=1082.9, standard deviation=12.28Dry PEDOT-PSS silk: average value=1238.8, standard deviation=16.93Wet PEDOT-PSS silk: average value=1031.4, standard deviation=24.45 From the graph, when a comparison is made of the raw material silk in a dry state and a wet state and the PEDOT-PSS silk fiber bundle1in a dry state and a wet state, no clear difference in strength can be observed between the two. That is, the tensile strength of the PEDOT-PSS silk fiber bundle1in a wet state preserves 83% of strength in a dry state, while the tensile strength of the raw material silk thread in a wet state preserves 80% of strength in a dry state. From this finding, it is clear that the conductive polymer fiber of the present invention has the same excellent strength as raw material silk thread whether in a dry state or a wet state, and inhibits breakage, cracking, and the like, with the result that its conductivity is not easily reduced. Furthermore, with respect to the strength difference when dry and when wet, it is clear that the PEDOT-PSS silk fiber bundle1has a smaller strength difference (a reduction of 17% (207 CN) if strength when dry is used as the standard) than the raw material silk thread (a reduction of 20% (268 CN) if strength when dry is used as the standard), with the result that the PEDOT-PSS silk fiber bundle1undergoes a smaller change in strength due to wetness, and has stable strength properties. From the results of Example 1-1 and Comparative example 1-1, it is obvious that the tensile strength of the conductive polymer fiber (in a dry state) of the present invention is approximately 10 times better than that of conductive fiber (in a dry state) composed only of PEDOT-PSS. <Evaluation of Water Resistance> Example 1-2 With respect to conductive polymer fiber (PEDOT-PSS silk fiber bundle1) produced by the same method as Example 1, a sample A impregnated with glycerol, and a sample B not be impregnated with glycerol were prepared. In a state where the respective samples A and B were immersed in pure water, shaking was conducted under conditions of 5 cm horizontal amplitude, 3 Hz, 10 times. Thereafter, 3 sets of washing treatment with natural drying were repeated, and changes in the resistance values of each sample A and B were recorded. The resistance values were calculated from current volume during DC5 load, using a direct-current stabilized power source (PAB18-5.5, manufactured by Kikusui Electronics Corp.) and a digital multi-meter (VOAC7511, manufactured by Iwatsu Electric Co., Ltd). Measurement of resistance values was conducted on the samples in a dry state (in a state free of moisture). The results are shown inFIG.10. The vertical axis of the graph shows resistance values (MΩ/mm) per 1 mm of length of the PEDOT-PSS silk fiber bundle1(in a dry state) that has a fiber diameter of approximately 280 microns. According to the graph, in the case of the PEDOT-PSS silk fiber bundle1to which glycerol is not added (Sample B; plotted with “⋄” linked by a solid line in the graph), the resistance values increase as a result of repetition of washing treatment, reducing conductivity. On the other hand, with respect to the PEDOT-PSS silk fiber bundle1to which glycerol is added (Sample A; plotted with “Δ” linked by a double-dotted line in the graph), it is clear that no increase is observed in the resistance values, and that conductivity is maintained. In short, water resistance can be enhanced by impregnating the conductive polymer fiber of the present invention with an additive such as glycerol. <Evaluation of Biological Electrode (1)> Example 1-3 Using conductive polymer fiber with a diameter of approximately 280 μm and a length of 300 mm composed of the aforementioned silk thread (No. 9 silk thread) and PEDOT-PSS obtained by the above-described production method 2b (hereinafter sometimes referred to as “PEDOT-PSS silk fiber bundle2”), as shown inFIG.11A, a rubber band4and a metallic conductor wire5is provided on top of a fixed cord3, and the PEDOT-PSS silk fiber bundle2is wound around them in a coil shape as an electrode to produce a cord-like body-surface type biological electrode. This biological electrode is set on a human body surface6.FIG.11Bshows one example of a result of human electrocardiogram measurement using these biological electrodes. When measuring a human electrocardiogram, measurement was able to be conducted by bringing the PEDOT-PSS silk fiber bundle2, which is the electrode composing the biological electrode, into contact with skin without use of paste (jelly) containing an electrolyte. In short, as a biological electrode provided with the PEDOT-PSS silk fiber bundle2of the present invention has excellent strength, flexibility, conductivity, it is clearly capable of attachment by adhesion to a body surface. The attachment sites of the biological electrodes were located on the skin (body surface) of the upper right limb, upper left limb, and lower left limb, each biological electrode was connected to an electrocardiograph (Polygraph, AP1124, manufactured by TEAC, Ltd.), and the human electrocardiogram was recorded during repose by the bipolar limb lead method (setting sensitivity 2000 μV/mm; timescale 1 second; lead I, II, III). <Evaluation of Biological Electrode (2)> Example 1-4 The circumference of conductive polymer fiber with a diameter of approximately 280 μm and a length of 1.5 mm composed of the aforementioned silk thread (No. 9 silk thread) and PEDOT-PSS obtained by the above-described production method 1a was coated with silicone resin to insulate a portion thereof. Specifically, the length of the exposed portion (non-insulated portion) was set at approximately 500 μm, and the length of the insulated coated portion was set at approximately 1000 μm. The electrode resistance of the obtained conductive polymer fiber (hereinafter sometimes referred to as the PEDOT-PSS silk fiber bundle3) was approximately 500 kΩ, and this was connected to a metal wire (Xwire, produced by Tanaka Kikinzoku Kogyo Co., Ltd.) to produce a thread-like implantable biological electrode.FIG.12Ashows a photograph thereof taken by stereoscopic microscope. Next, the biological electrode that was produced was inserted directly under the epineurium of the sciatic nerve of a rat under a microscope, and was fixed by ligature using surgical thread for microsurgery (S&T 10-0) (right figure ofFIG.12A). After the operation, the metal conductor wire was connected to a pre-amplifier, and the action potential (aggregate action potential) of the sciatic nerve was recorded using a biological signal recorder (AP1024, manufactured by TEAC, Ltd.). An example of measurement results is shown inFIG.12B. With respect to measurement conditions, setting sensitivity is 2000 μV/mm, timescale is 1 second, and in order from the top is during rest, during muscle contraction, and during muscle relaxation. As the implantable biological electrode provided with the PEDOT-PSS silk fiber bundle3of the present invention is thread-like, it can be sewn into tissue by a surgical operation. Consequently, compared to conventional large-sized metal electrodes of inferior flexibility, the biological electrode of the present invention has a high degree of freedom with respect to implantation sites, the electrode can be fixed in a stable state, and only a minimum required part is exposed while the remainder is covered, thereby resulting in a high degree of durability, and allowing recording over long periods. <Evaluation of Conductivity> Example 1-5 Using the aforementioned silk thread (No. 9 silk thread), conductive polymer fiber was produced in which PEDOT-PSS is arranged within and on the outer circumference of the silk thread by the above-described production method 2b. Specifically, the following samples were prepared: a sample C on the outer circumference of which PEDOT-PSS is electrochemically coated once, and dried; a sample D obtained by impregnating the sample C with glycerol; a sample E obtained by electrochemically applying an additional coat of PEDOT-PSS (for a total of two coats); and a sample F obtained by impregnating the sample E with glycerol. The conductivity of each sample C, D, E, and F in a dry state (a state free of moisture) was measured by the resistance value measurement method described in Example 1-2, and the results of measurement of the respective resistance values by the same method as Example 1-2 are shown in Table 1. Based on the obtained results, in order to enhance conductivity and resistance values, it is clearly preferable to have a thicker conductor thickness (in terms of the number of coats, two are preferable to one), and to add glycerol. TABLE 1Silk threadFiber resistanceConductivity(No.)Number of coatsAdditive(MΩ/cm)(S/cm)91—9.040.00018491Glycerol0.05750.030492—1.590.0013592Glycerol0.02060.102 Examples of the Second Aspect The second aspect of the present invention is described below with further specificity by Examples, but the second aspect of the present invention is not limited in any way by the Examples. Example 2-1 In the present Example, silk fiber (No. 9 silk thread with a diameter of approximately 280 μm) was prepared as machine-made fiber. As shown inFIG.13andFIG.15A-B, using a production apparatus provided with the rotor electrodes of the present invention, conductive polymer fiber was produced by polymerizing and fixing a conductor containing PEDOT-PSS to the outer circumference of silk fibers and to the interior of a fiber bundle composed of the aforementioned silk fibers. At this time, two types of conductor solution were prepared, one in which an additive was not used, and one to which glycerol was added, and each was subjected to electrochemical polymerization and fixation. With respect to the rotor electrodes, as shown inFIG.13A-B, the pulley-like rotor electrodes222and the roller-like rotor electrodes232were used, and these respective rotor electrodes222and232were alternately arranged so as to sandwich the silk fibers from both sides in the radial direction of the aforementioned silk fibers. At this time, as the pulley-like rotor electrodes222, electrodes having pulleys222awith a diameter of 8 mm and a width of 4 mm were used. As the roller-like rotor electrodes232, electrodes having rollers232awith a diameter of 6 mm and a width of 3 mm were used. Specifically, as described in the aforementioned embodiments of the present invention, silk fibers were immersed in a conductor solution containing PEDOT-PSS stored in an immersion container, and these were vertically raised with a reel unit. In this instance, using comb teeth-like electrodes like those shown inFIG.14, the silk fibers were alternately sandwiched from both sides by multiple comb teeth, and energization was conducted while the silk fibers were being raised. In this instance, using a direct-current stabilized power source (manufactured by Kikusui Electronics Corp.: PAB18-5.5), direct-current power of 20 μA and 18 V was supplied to the comb teeth-like electrodes, and adjustment was conducted by current-voltage monitoring using a “Digital Multi-Meter (manufactured by Iwatsu Electric Co., Ltd.: VOAC7511)” so as to assure a quantity of electricity of 3-6 mC in polymerization and fixation of 10 mm of silk fibers in the lengthwise direction (electric flux density: 5.85-9.95×104C/m2). With respect to the obtained conductive polymer fiber, fiber resistance and conductivity were measured over a fiber length of 10 mm under direct current of 350 mA using a resistance measuring apparatus “DM 2561 (manufactured by NF Corporation).” As a fiber gripping tool, a nanogrip manufactured by Stack Electronics Co., Ltd. was used. Measurement at this time was conducted in a dry state (a state free of moisture), and the results are shown in the following Table 2. In Table 2, Example 1 indicates Example 2-1, and Comparative example 1 indicates Comparative example 1-1. With respect to the obtained conductive polymer fiber, the coating condition of the conductor containing PEDOT-PSS was visually confirmed by observation using a stereoscopic microscope, and a photo taken at that time is shown inFIG.17A. In addition, the water resistance of the obtained conductive polymer fiber was evaluated by taking a stereoscopic microscope image (using a Leica SZ) after immersion for one month in physiological saline water (0.9% NaCl solution: 20° C.), and the photo is shown inFIG.18A. TABLE 2Glycerol addedNo additiveFiberFiber resistanceConductivityresistanceConductivityType(MΩ/cm)(S/cm)(MΩ/cm)(S/cm)Example 19.411.69 × 10−50.07212.21 × 10−3Comparative35.34.51 × 10−6131.22 × 10−5example 1 Example 2-2 With respect to the Example, conductive polymer fiber was produced in the production apparatus shown inFIG.13under the same conditions and by the same procedure as Example 2-1 described above, except for the point that energization was conducted using the comb teeth-like electrodes221and231shown inFIG.14. In this instance, with respect to the comb teeth-like electrodes221and231, a distance between comb teeth (distance between electrodes) of 10 mm was used for the multiple comb teeth221aand231a. With respect to the obtained conductive polymer fiber, the coating condition of the conductor containing PEDOT-PSS was visually confirmed by observation using a stereoscopic microscope, and the photograph taken at that time is shown inFIG.17B. Comparative Example 2-1 In Comparative example, conductive polymer fiber was produced by fixing a conductor containing PEDOT-PSS to the outer circumference of silk fibers and to the interior of a fiber bundle consisting of the aforementioned silk fibers under the same conditions and by the same procedure as Example 2-1 described above, except for the point that the conductor was fixed to the silk fibers (base fibers) by the conventional chemical fixation method. The fiber resistance and the conductivity of the obtained conductive polymer fibers were measured by the same method as above, and the results are shown in Table 2. Water resistance was also evaluated by the same method as Example 2-1 described above, and a photograph taken as a stereoscopic microscope image is shown inFIG.18B. (Evaluation Results) Per the results shown in Table 2, compared to the conductive polymer fiber of Comparative examples produced by the chemical fixation method using a conventional production apparatus, it is clear that the conductive polymer fiber of Example 1 in which a conductor containing PEDOT-PSS is electrochemically polymerized and fixed to silk fibers (base fibers) by the production method prescribed by the present invention using the production apparatus of the present invention obtains lower fiber resistance and superior conductivity regardless of the presence or absence of additives. As shown by the photograph figure ofFIG.17A, it is clear that the conductive polymer fiber obtained by Example 2-1 is uniformly coated by the conductor containing PEDOT-PSS on the surface of the silk fibers and to the interior of the fiber bundle, and that the conductor is fixed without exposure of silk fibers. Furthermore, as shown in the photograph figure ofFIG.18A, it was confirmed with respect to the conductive polymer fiber obtained in Example 2-1 that the coating condition of the conductor on the surface of the silk fibers and to the interior of the fiber bundle (the black color on the surface of the silk fibers) was maintained even after 1 month of water resistance testing. On the other hand, as shown in Table 2, the conductive polymer fiber produced using the conventional chemical fixation method clearly had higher fiber resistance and lower conductivity than the conductive polymer fiber of Example 2-1. As shown in the photograph figure ofFIG.18B, with respect to the conductive polymer fiber obtained in Comparative example 2-1, it was observed after one month of water resistance testing that the silk fiber was in an exposed state (there was a white-gray color on the surface of the silk fibers), and it was confirmed that most of the conductor had peeled off and vanished. As shown in the photograph figure ofFIG.17B, compared to the conductive polymer fiber of Example 1 produced using rotor electrodes, it was confirmed with respect to the conductive polymer fiber obtained using comb teeth-like electrodes in Example 2-2 that the surface of the silk fibers was partially exposed. The reason for this would seem to be that, when conducting energization using the comb teeth-like electrodes during vertical lifting, conductor is peeled off due to contact with some of the comb teeth (metal rod electrodes), but as the rate of coating of the silk fiber surface is higher than in the conductive polymer fiber produced by the Comparative examples, the product is superior both in terms of fiber resistance and conductivity compared to the conventional product. Examples of the Third Aspect Next, the third aspect of the present invention is described in further detail with reference to Examples, but the third aspect of the present invention is not limited by Examples shown below. Example 3-1 Comb-Like Brainwave Electrode A silk fiber bundle before composite fiber production (produced by Fujix, Ltd.: Taiya No. 9, fiber diameter approximately 280 μm) was immersed in a solution in which 0.1% EDOT (produced by the German company Heraeus, Ltd.) was added to PEDOT-PSS (CLEVIOS P produced by the German company Heraeus, Ltd.). Subsequently, the aforementioned silk fiber bundle was energized to electrochemically fix the PEDOT-PSS to the surface and the interior of the silk fiber bundle, thereby producing conductive composite fiber including the silk fiber bundle and PEDOT-PSS. This conductive composite fiber bundle was bundled in 4 units, and was fixed by being spread on comb-like arcuate frames made of polystyrene (4 sites for a total of 16 units), obtaining the comb-like biological electrode10shown inFIG.19A-19D. As the signal cable314joined to the contacts311composed of the conductive composite fiber, a signal cable for a brainwave measurement apparatus (manufactured by Nihon Kohden Corporation) was used. The coating of this signal cable was stripped away to a length of 1 cm, and the conductive composite fiber was wound around the exposed copper wire, and fastened. The junction of the conductive composite fiber and the signal cable was coated and insulated with an ethylene vinyl alcohol adhesive. The aforementioned junction was then fixed to a frame end together with the signal cable. Prior to using the biological electrode in brainwave measurement, the contacts311(conductive composite fibers) were impregnated with glycerol. As a result of impregnation with glycerol, the conductivity and water resistance of the conductive composite fibers were enhanced, and fiber flexibility was improved, thereby enabling satisfactory contact between the contacts311and the scalp, and stable measurement of brainwaves. With respect to the biological electrode310produced in the Example, its size was 12 mm in width, 35 mm in length, and 6 mm in thickness with a 2 mm thickness at the comb tip, its weight was 1.1 g (electrode only, not including cable weight), and it was also thinner, and lighter in weight. Furthermore, as its form was comb-shaped, the biological electrode310could be attached with concealment under head hair. Example 3-2 Hairpin-Like Brainwave Electrode Conductive composite fibers identical to those in Example 1 were used. A hairpin-like hair fastener with a length of 3.5 cm was used as the frame. The aforementioned hairpin was made of steel, and its surface was painted with urethane resin. The coating of a signal cable for brainwave measurement (manufactured by Nihon Kohden Corporation) was stripped away to a depth of 3 cm, and conductive composite fibers were doubly wound around the exposed copper wire to produce a contact with a thickness of approximately 1 mm (FIG.21C). Two contacts were fixed to the two ends of a U-shaped frame of the hairpin via a support made of ethylene vinyl to obtain the hairpin-like biological electrode320shown inFIG.20A-20D. With respect to the biological electrode320produced in the Example, its size was 35 mm in length, 2-5 mm in transverse width, and 3 mm in height, and its weight was 0.5 g (electrode only, not including cable weight). In the case where brainwave measurement is conducted using the biological electrode320, as the electrode itself grips the head hair, it is capable of self-fixing, and a holder such as a stretchable net may be used or not used. FIG.23Ashows a human brainwave measured using the hairpin-like brainwave electrodes of Example 3-2. As different electrodes, hairpin-like electrodes of Example 3-2 were respectively attached at C3 and C4. As indifferent electrodes, silver-silver chloride plate electrodes (NE134A manufactured by Nihon Kohden Corporation, for use with collodion electrodes) were attached with fixation to both sides of an auricle (earlobe) using tape, with interposition of absorbent cotton containing physiological saline water. Pre-treatment such as delipidation and dead skin removal was not conducted with respect to the skin to which the electrodes were attached.FIG.23Ashows a waveform obtained by measuring a brainwave of an adult male in a conscious state in an ordinary laboratory under conditions of a 1 Hz low-pass cutoff filter, and a 20 Hz high-pass cutoff filter, using MEB5504 manufactured by Nihon Kohden Corporation. Now, the horizontal axis of the figure is 400 ms/div, and the vertical axis is 50 μV/div. FIG.23Bshows the auditory brainstem response (evoked potential) of an adult male measured using the hairpin-like brainwave electrodes of Example 3-2. The employed measurement apparatus (MEB5504 manufactured by Nihon Kohden Corporation) and the electrode attachment were the same as in the brainwave measurement ofFIG.23A. Clicking sound of 90 db was input to both ears from headphones, and averaging of 1000 times was conducted according to the standard setting values of auditory evoked potential. Now, the horizontal axis of the figure is 1 ms/div, and the vertical axis is 0.2 μV/div. From the evoked potential waveform measured under conditions of 1 Hz low-pass cutoff filter, and 200 Hz high-pass cutoff filter, it is shown that the biological electrode of the embodiments of the present invention can be used to measure evoked potential. Example 3-3 Electrocardiogram Electrode For purposes of comparing the stability of measured biological signals and the occurrence of noise, the following three types of electrodes 1-3 were attached to the body surface of the same experimental animal (a rat), simultaneous measurement of electrocardiograms was conducted, and the measured waveforms were compared.Electrode 1 (the electrode of the second embodiment of the present invention): contacts in which were arranged 30 fibers (of 12 mm length) obtained by impregnating conductive composite fibers produced in the same manner as Example 3-1 with glycerol were attached to the rat body surface, and fixed by the two methods described below.Electrode 2 (conventional type): an electrode (F120S, manufactured by Nihon Kohden Corporation) generated by applying conductive gel to a silver-silver chloride electrode was attached to the rat body surface, and fixed by the two methods described below.Electrode 3 (conventional textile electrode): a commercial sports heart rate monitor electrode (brand name: Smart Fabric Sensor, WearLink+ strap electrode, manufactured by Polar Corporation) provided with fiber fabric to which a silver coating was applied was attached to the rat body surface, and fixed by the two methods described below. The rear thorax of the rat was shaved, and the skin was washed with ethanol disinfectant, after which the aforementioned three types of biological electrodes (electrodes 1-3) were respectively attached to the left rear thorax and right rear thorax. For all parts, the attachment sites of the electrodes 1-3 were set as close to one another as possible. As an indifferent electrode (body earth), a medical-use biological electrode (F-150S, manufactured by Nihon Kohden Corporation) was attached to the thoracolumbar area. The signals obtained from the respective biological electrodes were analyzed by a measurement apparatus (Polymate AP1124, manufactured by TEAC, Ltd.). With respect to the left rear thorax and right rear thorax electrodes of the rat, the respective electrodes were fixed by two fixing methods (stretchable band or tape), and measurement was conducted. The measurement results are shown inFIG.27. First, in the case where an electrode pad configured by placing a sheet substrate made of PVC on top of the respective electrode was subjected to pressure fixation with a stretchable band, the signals obtained from the three types the electrodes were almost identical, and stable signal recording could be conducted. Next, when the band was removed, and fixation was conducted with medical-use adhesive tape (Silky Pore) (registered trademark), stable signals were recorded from Electrode 1 and Electrode 2, whether the rat was in a state of repose or body movement. However, with respect to signals from Electrode 3, the baseline fluctuated due to body movement, and immixture of hum noise was observed. From the foregoing results, it is clear that the stability of signal measurement by Electrode 1 of the second embodiment of the present invention approximated that of the medical-use Electrode 2, and was superior to the textile Electrode 3. Example 3-4 Adjustment of Skin Humidity Changes in skin moisture associated with steaming of skin to which a biological electrode adheres were measured by a skin moisture measurement device (Corneometer), and a comparison was made of skin moisture after six hours of adhesion of a conventional biological electrode and the biological electrode of the second embodiment of the present invention. Forearm skin of human adult males was used as the measurement site. The subjects conducted desk work involving personal computers and the like in an environment with a room temperature of 26 degrees and a humidity of 40%. Skin moisture at the site before adhesion of each electrode and 6 hours after adhesion of each electrode was measured by a skin moisture measurement instrument (TK59823, manufactured by the German company Courage+Khazaka Electronic). The measurement results are shown inFIG.10. The measurement results shown inFIG.28show forearm skin moisture prior to electrode attachment (result A) and after 6 hours of electrode adhesion (results B-E) (error bar 1 SD, standard deviation n=10). Result B (+13.7%) are results obtained using the biological electrode of the second embodiment of the present invention provided with apertures in the sheet substrate for aeration; result C (+15%) are results obtained using a biological electrode identical to that of result B except that it was not provided with apertures; result D (+32.3%) are results obtained using a conventional biological electrode to which adhesive gel was applied; and result E (+54.4%) are results obtained using a conventional biological electrode that used a highly adhesive pad as the sheet substrate. The aforementioned results appearing within parentheses indicate the rate of increase in moisture at the adhesion site of each electrode, assuming moisture prior to electrode attachment is 100%. The specific configurations of the electrodes B-E corresponding to the respective results are as follows. Electrode B is a biological electrode with the form shown inFIG.25A, configured by impregnating conductive composite fibers produced in the same manner as Example 3-1 with glycerol, and by arranging in parallel fibers on a 20×30 mm PVC sheet-like substrate to form a 7×12 mm contact. Two apertures with an area of 20 mm2are provided on the sheet-like substrate, and fixed to the skin surface by an adhesive agent applied to the surface of the PVC sheet. Electrode C has the same configuration as Electrode B, except that it uses a sheet-like substrate that is not provided with apertures. Electrode D is a silver-silver chloride medical-use biological electrode (F120S, 18×35 mm, manufactured by Nihon Kohden Corporation) that uses conductive adhesive gel. Electrode E is a silver-silver chloride medical-use biological electrode (M150, manufactured by Nihon Kohden Corporation, with a diameter of 40 mm) that uses a highly adhesive foam pad. The biological electrodes B-D were used in a state where they were autonomously fixed to the forearm of the subject. In the foregoing results, the skin moisture of the conventional electrode D using adhesive gel rose by +32.3%, and the skin moisture of the conventional electrode E using a highly adhesive foam pad rose by +54.4%. On the other hand, in contrast to the conventional types, the rise in skin moisture of electrode B (with apertures) using conductive composite fibers was limited to +13.7%, and that of electrode C (without apertures) was limited to +15.0%. These results indicate that, compared to conventional electrodes, steaming is inhibited with the electrodes of the second embodiment of the present invention. Furthermore, the rise (increase) in skin moisture is more limited with electrode B that provides apertures in the sheet-like substrate than with electrode C that has no apertures, exhibiting the humidity reduction effect due to apertures. Example 3-5 Comparison of Electrical Properties of Biological Electrodes Comparison of Combined Resistance of Biological Electrode and Skin The following three types of biological electrodes 4-6 were respectively attached to human forearm skin at 5 cm electrode intervals, and the combined resistance of the respective biological electrodes and the skin was measured under sinusoidal conditions of 10 Hz using a biological electrode impedance meter (manufactured by Melon Technos Co., Ltd.). With respect to these measurement results, taking the following result of electrode 4 as “1,” the resistance ratios normalized by electrode area are shown in the table under the figure. The contact area of each electrode and the impedance are additionally noted. From the aforementioned results, it is shown that the impedance per area of the biological electrode 4 of the second embodiment of the present invention is lowest. Otherwise, the impedance of the sports-use biological electrode 6 when the contact surface was in a dry state was extremely high, rendering measurement impossible with the employed measuring instrument. Electrode 4 (electrode of the present invention) is a biological electrode wherein the fixation method of the second embodiment was conducted with respect to 12 mm×7 mm contacts which consisted of 15 conductive composite fibers that were produced in the same manner as Example 1 and that were impregnated with glycerol, and which were arranged in parallel on a sheet-like substrate made of PVC. Electrode 4 was set on the surface of human forearm skin, and fixed in place with a stretchable band. At this time, the contact area of the contact part constituted by the aforementioned contacts and the human forearm skin surface was 84 mm2(7×12 mm). Electrode 5 (conventional type): an electrode (Vitrode F 150S, manufactured by Nihon Kohden Corporation) obtained by applying conductive gel to a silver-silver chloride electrode was set upon the skin surface, and the sheet-like substrate used in electrode 4 was placed thereon, and fixed in place with a stretchable band. At this time, the contact area of the electrode 5 and the human forearm skin surface was 630 mm2. Electrode 6 (conventional sports-use biological electrode): a commercial sports heart rate monitor electrode (Smart Fabric Sensor, WearLink+ strap electrode, manufactured by Polar Corporation) provided with fiber woven cloth made of nylon to which a silver coating was applied was set on the skin surface, and fixed in place with a stretchable band. At this time, the contact area of the electrode 6 and the human forearm skin surface was 600 mm2. The results of measurement of the combined resistance of each electrode and the skin are shown below. TABLE 3Combined resistance of electrode and skinContact areaImpedanceNormalizedNo.Electrode(mm2)(KΩ)resistance ratio4Electrode of the present invention (PEDOT-PSS silk + glycerol)841.4815Medical test-use electrode (silver-silver chloride electrode +630105533electrolytic gel) Vitrode F 150S, manufactured by Nihon KohdenCorporation6Sports-use biological electrode (silver coated nylon fiber cloth) for6001.13 (wet)5.45 (wet)sports heart rate monitor, manufactured by Polar∞ (dry)— (dry)Human forearm skin 5 cm electrode intervalReference electrode: silver plateelectrode + physiological saline waterBiological electrode impedance meter:Melon Technos (10 Hz, sinusoidal) Frequency Properties For purposes of comparing the frequency properties of the below-mentioned electrode 7 provided with conductive composite fibers and the below-mentioned conventional electrode 8 using an electrolyte solution, the frequency properties of the two electrodes were measured using Autolabo (PGSTAT, manufactured by Metrohm Autolab Co., Ltd.), and the results are shown in the below table. It is shown that the impedance of the below-mentioned electrode 7 of the second embodiment of the third aspect of the present invention in the 10 Hz to 10 KHz region is lower than the impedance of the below-mentioned electrode 8 consisting of silk fiber impregnated with a sodium chloride electrolyte solution. Electrode 7 (electrode of the present invention) consists of contacts of conductive composite fiber of 2 cm length produced in the same manner as Example 3-1 and impregnated with glycerol. Electrode 8 is an electrode (of 2 cm length) obtained by impregnating the silk fiber (with a fiber diameter of 280 microns) composing electrode 7 with a 0.9% sodium chloride electrolyte solution. The results of measurement of the frequency properties of each electrode are shown below. TABLE 4Frequency propertiesFrequency (Hz)No.Electrode101001K10K7Electrode of the present16.010321.210.7invention (PEDOT-PSSsilk + glycerol)8Conventional electrode10314444.083.0(using NaCl electrolyte solution)Impedance (KΩ) Examples of the Fourth Aspect Next, the fourth aspect of the present invention is described in further detail with reference to Examples, but the fourth aspect of the present invention is not limited by Examples described below. Example 4-1 Production of Implantable Electrode Using Conductive Composite Fibers A silk fiber bundle (produced by Fujix, Ltd.; Taiya No. 9, with a fiber diameter of approximately 280 μm) before composite fiber production was immersed in a solution in which 0.1% EDOT (produced by the German company Heraeus) was added to PEDOT-PSS (CLEVIOS P, produced by the German company Heraeus). Subsequently, the aforementioned silk fiber bundle was energized using a comb-like electrode, and the PEDOT-PSS was electrochemically fixed to the surface and the interior of the silk fiber bundle to obtain a conductive composite fiber bundle comprising the silk fiber bundle and PEDOT-PSS. The coating at the distal end of a polyimide-coated platiniridium wire (with a diameter of 30 microns) (manufactured by Wire Company, Inc. of California, USA) was removed, and ligated to the conductive composite fiber bundle (with a fiber diameter of approximately 280 microns) that had been fabricated. The ligated portion and the surface of the conductive composite fiber bundle were coated using PDMS (polydimethylsiloxane) (brand name: Sylgard 184, produced by Toray-Dow Corning Co., Ltd.). The coating at the distal end of the conductive composite fiber bundle was stripped away to a depth of 500-2000 microns, exposing the distal end of the conductive composite fiber bundle. The PEDOT-PSS contained in the aforementioned exposed distal end was brought into contact with a stainless steel guide needle (with a diameter of 100 microns, manufactured by Seirin Corporation), and ethanol was applied to conduct electrochemical fixation (adhesion) and produce an implantable electrode. (Placement of Implantable Electrode) An SD rat was anesthetized with isoflurane, and subjected to cranial fenestration, and the dura mater was removed to expose the cerebral cortex. Using a motorized actuator (RCD, manufactured by IAI Corporation) fixed on a micromanipulator of a brain stereotaxic instrument (SR-6R, manufactured by Narishige Co., Ltd.), the aforementioned implantable electrode was placed within the cerebral cortex. Specifically, the distal end of the aforementioned electrode was inserted into the left barrel cortex to a subcortical depth of 2 mm in 0.01-0.02 seconds. The platiniridium wire ligated to the aforementioned conductive composite fiber bundle was connected to the head amp of a cranial nerve signal measurement recording analyzer (model: RZ51, manufactured by the American company TDT, Inc.). As a reference electrode, a silver-silver chloride wire was placed on the cortex, and the silver-silver chloride wire was placed under the skull as a body earth. The measured signals were recorded and analyzed with dedicated software (Open EX, open explorer TDT). The moisture absorption of the composite material composed by the PEDOT-PSS and the silk fiber is slow. For example, when the aforementioned conductive composite fiber bundle in a dry state is immersed in 0.9% NaCl physiological saline water, swelling of the fiber is clearly observed approximately 30 seconds or later after the start of immersion. If the aforementioned conductive composite fiber bundle is inserted into biological tissue at high speed (in a short time, e.g., within 1 second), the aforementioned implantable electrode provided with the aforementioned conductive composite fiber bundle can be set within the body, before the PEDOT-PSS swells due to water absorption, and then declines in strength. After insertion of the aforementioned implantable electrode into the brain, the conductive composite fiber containing PEDOT-PSS that is stationary within the tissue gradually absorbs body fluid (extracellular fluid or cerebrospinal fluid), swells, and adheres to the surrounding tissue. The adhesion between the conductive composite fiber and the guide needle comes apart due to the moisture absorption, and the conductive composite fiber electrode separates from the guide needle. Thereafter, the guide needle is withdrawn by the micromanipulator, and the conductive composite fiber bundle which is the body of the aforementioned electrode remains within the tissue. (Recording of Cerebral Action Potential) According to the aforementioned insertion method, the aforementioned implantable electrodes with a fiber diameter of 200 microns and a fiber length of 1 mm were placed at two sites of the left barrel cortex in the rat brain at positions of 2 mm depth. The distance between electrodes at this time was 2 mm.FIG.35Ashows the action potential of the rat cerebral cortex (barrel cortex) recorded by the aforementioned electrodes. The upper graph and the lower graph consist of signals respectively detected by the two implanted electrodes. As a result of mechanical stimulation of the right whiskers of the rat, burst-like aggregate action potential was recorded from the two implanted electrodes. Synchronized aggregate potential ↓: arrow mark) and nonsynchronous aggregate potential (▾ mark) are observed in the waveforms of the two electrodes. Example 4-2 Fabrication of Implantable Electrode A conductive composite fiber bundle (with a length of 3 mm, and a fiber diameter of 50 microns) produced in the same manner as Example 4-1 was immersed in glycerol, and the fiber was impregnated with glycerol. An insertion guide thread was connected to one end of the obtained conductive composite fiber bundle. As the insertion guide thread, a nylon monofilament suture thread (thickness: 10-0, produced by S&T) with attached curved needle for microsurgery was used. A gold wire (X wire, manufactured by Tanaka Kikinzoku Kogyo Co., Ltd.) from which the insulating coating was stripped was wound around and fixed to the other end of the aforementioned conductive composite fiber bundle, and the fixed part was coated with PDMS (brand name: Sylgard 184, produced by Toray-Dow Corning Co., Ltd.). (Recording of Aggregate Action Potential of Sciatic Nerve) A Wistar rat was anesthetized with isoflurane, and an incision was made in the skin of the lower left limb, exposing the left sciatic nerve. The 10-0 guide thread was inserted into the outer membrane of the sciatic nerve bundle under a microscope. Subsequently, the aforementioned conductive composite fiber bundle connected to the guide thread was introduced into the sciatic nerve bundle by pulling on the guide thread. As the aforementioned conductive composite fiber bundle had been treated to delay moisture absorption speed, i.e., as moisture absorption speed had been delayed by the impregnation with glycerol, there was no evidence swelling during the surgical operation, and it was inserted into the tissue (under the outer membrane of the nerve). Fifteen minutes after insertion, the aforementioned conductive composite fiber bundle swelled up, and was fixed to the interior of the tissue.FIG.35Bshows the aggregate action potential (at a scale bar of 1 second, 50 μV) of the rat sciatic nerve that was measured after electrode fixation. Example 4-3 Recording of Rat Electrocardiogram Using conductive composite fiber bundles (with a length of 20 mm, and a wire diameter of 280μ) produced in the same manner as Example 4-1, a rat electrocardiogram was recorded. Under isoflurane anesthesia, the implantable electrodes were set within subcutaneous tissue by ligating the aforementioned conductive composite fiber bundles so that the electrodes were provided to subcutaneous tissue layers at the 3 sites of the right anterior thorax, left anterior thorax, and the hypochondrium of the rat. The conductive composite fiber bundles composing the aforementioned electrodes were connected to a signal cable of a pre-amplifier of a polygraph (AP1124, manufactured by TEAC, Ltd.) via a metallic conductor wire coated with an insulating and water-resistant polymer.FIG.35Cshows a rat electrocardiogram (bipolar lead) (at a scale bar of 1 second, 50 mV) recorded with a sampling frequency of 1 kHz. Example 4-4 Drug Transport (Drug Delivery) Utilizing Implantable Electrode A silicone bag storing a drug solution was connected as a reservoir to one end of a conductive composite fiber bundle that was produced by the same method as Example 1, but made relatively long. In this instance, the outer surface of the aforementioned conductive composite fiber bundle was coated (sealed) using PDMS (brand name: Sylgard 184, produced by Toray-Dow Corning Co., Ltd.) to configure the drug delivery path. By means of this coating, an implantable electrode was obtained which was provided with the aforementioned conductive composite fiber bundle at the core, and in which a tube made of PDMS configured the outer shell of the aforementioned delivery path. For purposes of measuring drug delivery speed with respect to the aforementioned conductive composite fiber bundle configuring the core of the aforementioned electrode, a conductive composite fiber bundle was prepared for testing, and a drug delivery test was conducted. First, the central portion of a conductive composite fiber bundle (with a length of 20 mm, and a fiber diameter of 280 microns) produced by the same method as Example 4-1 was coated over a length of 5 mm with PDMS, and one end of the aforementioned conductive composite fiber bundle was immersed in a chamber having 1 mL of physiological saline water containing 100 μM of Lucifer yellow fluorescent material, and the other end was put into it a dish having 0.5 mL of ordinary physiological saline water (without fluorescent material). The water level of the liquid in the chamber containing the Lucifer yellow was set to be 5 mm higher than the water level in the dish containing the ordinary physiological saline water. These were left in a room with a constant temperature of 37 degrees, and the concentration of the Lucifer yellow contained in the physiological saline water in the aforementioned dish was measured at 0, 1, 2, 3, 4, and 7 days after implantation. Using a fluorescence intensity measurement device (multilabel counter, ALVO SX1420, manufactured by PerkinElmer Co., Ltd.) for measurement, measurement was conducted by the fluorometric method. The measurement results are shown inFIG.36. By transport of the Lucifer yellow from the aforementioned chamber to the dish via the aforementioned conductive composite fiber bundle, the concentration of the Lucifer yellow in the aforementioned dish increased at a rate of 0.17 μM/day. This result shows that Lucifer yellow permeates (osmotically moves through) conductive composite fibers at a constant speed (inFIG.36, the ▴ plot and the dotted line). Example 4-5 A conductive composite fiber bundle was prepared whose central portion was coated with PDMS in the same manner as Example 4-4. However, the aforementioned conductive composite fiber bundle was impregnated with glycerol before being coated with the PDMS. Upon measuring drug delivery speed in the same manner as Example 4-4 using this conductive composite fiber bundle, the concentration of the Lucifer yellow in the dish increased at a rate of 6.7 μM/day (inFIG.36, the ▪ plot and the solid line). From this result, it is shown that drug delivery speed is increased by adding glycerol to the conductive composite fibers. As one reason for the improvement in drug delivery speed due to impregnation of conductive composite fibers with glycerol, it would seem that when the conductive composite fibers are coated with PDMS, the glycerol prevents the PDMS from penetrating (infiltrating) to the interior of the conductive composite fiber bundle, and the condition of the flow path constituted by the conductive composite fiber bundle is maintained in a condition suited to drug transport. Example 4-6 Evaluation of Electrode Invasiveness Relative to Central Nervous Tissue An ongoing problem has been that implantation of a biological electrode into central nervous system tissue results in occurrence of permanent damage to the central nervous system tissue in a region wider than the size of the electrode, impairing measurement, and this problem requires a remedy. A study was conducted by animal experiments with respect to whether the damage (invasion) inflicted on central nervous tissue by implantation of the aforementioned electrode could be mitigated by administering—via the aforementioned flow path (drug delivery path) of the aforementioned electrode—a drug (GSNO: S-nitrosoglutathione) having the effect of mitigating damage to central nervous tissue, after insertion of the implantable electrode produced in Example 4-4 of the present invention into the brain (FIG.34B-34D). The extent of damage to nervous tissue by electrode implantation (insertion) into rat brains was evaluated by immunohistostaining of glial cells (astrocytes) of the rat cerebral cortex, and by loss of nervous tissue. The immunohistostaining was conducted as follows. Frozen slices of 25 microns were prepared from the cerebral cortex subjected to perfusion fixation with 4% paraformaldehyde, combined with anti-GFAP antibodies (MAB360 Chemicon) under conditions of 1:1000 dilution, 4° C., overnight, and also labeled with secondary antibodies (Alexa 568), after which observation was conducted under a fluorescent microscope (BX51, Olympus Corporation). When a conventional metallic needle electrode was implanted in the rat brain, and when the cerebral cortex was observed under fluorescent microscope after one week, as shown inFIG.34D, a pronounced tissue loss (blackened region) had occurred extending beyond the implantation area (dotted line region) of the metallic needle electrode. GFAP-positive glial cells (astrocytes) had propagated in the nervous tissue (▴ inFIG.34D). In particular, glial cells had propagated in the region of contact with the electrode, forming glial scarring (arrow marks ofFIG.34D). Thus, on the 7thday after electrode implantation, pronounced tissue loss, formation of glial scarring (arrow marks), and glial cell clusters (▴ marks) were observed. Using a conventional metallic needle electrode implanted in this manner, the aggregate action potential of the rat cerebral cortex was measured. After electrode implantation, measurement was conducted on the 1stday and the 7thday. The results are shown on the lower levels (conventional) (scale bar 250 ms, 40 mV) ofFIG.34A. Measured signals were satisfactory on the 1stday, but a contraction of measured waveforms and a loss of spikes were observed on the 7thday. InFIG.34A, Day 1 is the record of measurement on the 1stday after electrode implantation, and Day 7 is the record of measurement on the 7thday after electrode implantation. The arrow marks indicate the loss of spikes. On the other hand, after insertion of the implantable electrode produced in Example 4-4 into the rat brain, an anti-inflammatory agent (GSNO) was administered at 15 μg/day per 250 g of body weight via the aforementioned drug delivery path of the aforementioned electrode. The speed of drug delivery was adjusted by a compact osmotic pump (manufactured by the American company Alzet, Inc.) connected to the aforementioned drug delivery path. In the case of the Example in which the anti-inflammatory agent was administered, tissue loss was less than with the conventional electrode, and tissue loss was limited to the electrode implantation area (dotted-line region) (FIG.34C). Propagation of glial cells in the nervous tissue was minor, and no clear glial scarring was observed in the area of contact with the electrode (FIG.34C). InFIG.34C, GSNO was administered to the environs of the electrode, and even at the 7thday after electrode implantation, tissue loss was localized to the electrode implantation region (dotted line), and there was also little propagation of glial cells in the tissue. For purposes of comparison,FIG.34Bshows fluorescent immunostaining of glial cells in a normal cerebral cortex without electrode implantation. Using the electrode of Example 4 of the present invention implanted in this manner, the aggregate action potential of a rat cerebral cortex was measured. Measurement was conducted on the 1st and the 7th day after electrode implantation. The results are shown on the upper level ofFIG.34A(PEDOT-PSS) (scale bar 250 ms, 40 mV). Satisfactory waveforms were observed with respect to measured signals of both the first and the seventh days. The respective configurations and their combinations in the various embodiments described above are exemplary, and additions, omissions, substitutions, and other modifications of configuration are possible within a scope that does not deviate from the intent of the present invention. Moreover, the present invention is not limited by the respective embodiments, and is limited only by the scope of the claims. INDUSTRIAL APPLICABILITY The present invention is able to provide conductive polymer fibers with superior conductivity, strength in dry and wet states, and flexibility, and a biological electrode provided therewith. It provides a method and a device for producing conductive polymer fibers which are capable of causing impregnation or adhesion of a conductor containing PEDOT-PSS in or to base fibers, and continuously conducting electrochemical polymerization and fixation thereof, and producing with satisfactory productivity conductive polymer fibers having superior conductivity and durability. The biological electrode of the present invention can be widely used as an body surface mounting type implantable biological electrode capable of long-term continuous use in a wide range of fields including medical treatment, health promotion, information technology, wearable computers, and the like. It is possible to provide a biological electrode that has an improved wear feeling compared to conventional electrodes, and a biological signal measurement device provided with the biological electrode. The implantable electrode of the present invention can be widely used as an implantable electrode in a wide range of fields including medical treatment, health promotion, information technology, wearable computers, and the like. More specifically, it can be used in electrical stimulation therapy involving deep brain stimulation and the like, implantable electrodes for nervous action recording, brain-machine interfaces, and so on. It is possible to offer an implantable electrode which enables detection of weak electrical signals from within a living body, which has excellent biocompatibility, and which has a low degree of invasiveness relative to biological tissue. BRIEF DESCRIPTION OF THE REFERENCE SYMBOLS 2: conductive polymer fiber3: fixing cord4: rubber band5: metal conductor wire6: human body surface33: metal or carbon34: conductor54: conductor63: insulating layerL: diameter of base fiberh: thickness of coated conductor10,20,30,40,50,60: conductive polymer fiber11,21,31,41,51,61: base fiber12,22,32,42,52,62: conductor210,250: device for producing conductive polymer fiber (production device)202: multiple electrodes (positive terminals)221: comb teeth-like electrodes (multiple electrodes; positive terminals)221a: comb tooth (electrode)221b: terminal222: rotor electrode (pulley-like electrode)222a: pulley222b: groove222c: metal shaft203: multiple electrodes (negative terminals)231: comb teeth-like electrodes (multiple electrodes; negative terminals)231a: comb tooth (electrode)231b: terminal231c: rotor electrode (roller-like electrode)232a: roller232b: outer circumferential surface232c: metal shaft252: single (monopolar) electrode (positive terminal)253: single (monopolar) electrode (cathode)204: conductor solution205,255: immersion container206,256: bobbin207,257: chamber (humidity regulator)208,258: drier209,259: reel unit310: biological electrode311: contact312: first frame313: second frame314: signal cableH: hair (head hair)S: skin (scalp)320: biological electrode321: contact322: third frame323: fourth frame324: signal cable321a: conductive composite fiber321b: metal wire material321c: insulating coating material321e: conductive composite fiber321f: metal wire321g: core material321z: insulating coating materialN: low-tension net330: biological electrode331: contact332: contact part333: substrate (base material)334: signal cable335: holder336: aperture337: humidity control pad338: electrode pad339: amp (external device)B: body (torso)T: undershirt (shirt)401: conductive composite fiber402: electric cable (metal conductor wire)403: wire connection part404: polymer405: needle (guide needle)406: thread407: reservoir408: chamber409: tube connector410,420,430,440: implantable electrodeN′: nerve cord | 210,492 |
11862360 | DETAILED DESCRIPTION Illustrative embodiments of the present disclosure may be provided as improvements to support stands and stand-alone bases. According to an illustrative embodiment of the present disclosure one or more portions of the support stands and the bases are made of non-conductive materials. Illustrative embodiments of the present disclosure may be provided as improvements to support stands for supporting metallic and/or conductive pipes. According to an illustrative embodiment of the present disclosure one or more portions of the pipe support stand are made of non-conductive materials. The support stands and bases contemplated by the present disclosure are configured and dimensioned to support one or more objects. As used herein, “object” in the singular and “objects” in the plural are used to include any object. Non-limiting examples of an object include structures, materials and equipment. Non-limiting examples of structures, materials and equipment include piping, cabling and construction structures and materials. Non-limiting examples of piping, cabling and construction structures and materials include electrical conduits, electrical and communication wires and cabling, pressure air lines, pipes for fluids and gases, and other piping materials. A support stand according to an illustrative embodiment of the present disclosure is shown inFIGS.1and2and is referred to generally as support stand100. Support stand100includes a pedestal114having a base116and a saddle102. A proximate end126of jack screw110is attached to base member108of saddle102. For example, the proximate end126of threaded jack screw110may rest in a recess in base member108. The recess in base member108may be threaded for receiving threaded jack screw110. Alternatively, threaded jack screw110may be formed integral with base member108. The distal end124of threaded jack screw110is received in the female threaded center portion118of pedestal114. Jack screw110allows saddle102to be adjusted up and down to a desired height. Locking sleeve112includes a lock screw122for locking jack screw110in a desired position. Saddle102may have different configurations depending on a particular application. According to the illustrative embodiment depicted inFIG.1, a V-shaped pipe stand saddle102is shown. Saddle102includes a pair of arms104which connect at saddle base106. V-shaped pipe stand saddle102is dimensioned such that a pipe can be supported in the V. One or more slots111may be provided in saddle102dimensioned for receiving straps, e.g., tie wrap straps (not shown). The straps are slid through the slots111and around the object being supported by support stand100and joined for holding the object securely in place. It will be appreciated that saddle102may be provided in any suitable configuration for supporting various different types/sizes of objects. For example, saddle102may have a flat top for supporting various types/sizes of objects. Saddle102may have a roller type support for supporting objects that may move or shift. Saddle102may have a U-shaped support or any other shape for supporting various types of objects. Base116may be formed integral with pedestal114or may be a separate unit mounted to pedestal114in any suitable manner. For example, according to an embodiment of the present disclosure as shown inFIG.2A, base116A may include a female receiver portion115dimensioned to receive a corresponding male end117of pedestal114. Although shown as square in cross-section, it will be appreciated that female receiver portion115and male end117may be provided in other shapes as appropriate, including but not limited to round, oval, rectangular, triangular, etc. Further, the male end117of the pedestal may be smaller in size than the pedestal, the same size as the pedestal or larger than the pedestal. As shown inFIG.2B, the bottom of female receiver portion115may include a plurality of orifices119that extend through its bottom portion121for allowing drainage of water, etc. The one or more orifices119may be used to receive a non-conductive spike that may be driven into a substrate, e.g., the ground or flooring, for anchoring the base in a desired position. According to another illustrative embodiment of the present disclosure as shown inFIG.3A, base116B includes a male portion125extending therefrom dimensioned to receive a corresponding female end portion133of pedestal114. Although shown as square in cross-section, it will be appreciated that female end portion133and male portion125may be provided in other shapes as appropriate, including but not limited to round, oval, rectangular, triangular, etc. A base according to another illustrative embodiment of the present disclosure is shown inFIG.3Band is referred to as base116C. Base116C includes one or more slots155that extend from one side through base116C to the other side and are dimensioned for receiving non-conductive straps, e.g., tie wrap straps (not shown). According to this embodiment of the present disclosure, the lower end of pedestal114A includes one or more slots157that extend from one side through pedestal114A and to the other side and are also dimensioned for receiving straps. Pedestal114A rests on a top portion159of base116C. A strap is then threaded through slot155in base116C and then through slot157in pedestal114A and the ends of the strap are then secured together thus joining the base116C to the pedestal114A. Although shown as square in cross-section, it will be appreciated that pedestal114A and/or the top portion159of base116C may be provided in other shapes as appropriate, including but not limited to round, oval, rectangular, triangular, etc. A base116D according to another embodiment of the present disclosure is shown inFIG.3C. In this embodiment, a pedestal114rests on the top portion179of base116D and is held in place by the weight of an object resting on the support (e.g., a pipe). It will be appreciated that the shapes of the base116and bases116A-116D may be other than as shown. For example, although shown as including beveled upper edges123(123A-123D), it will be appreciated that these edges may be provided as square corners, rounded corners, etc. as desired. Base116and bases116A-116D may be provided in a shape other than square as shown. For example, base116and bases116A-116D may be any suitable geometric shape including but not limited to rectangular, triangular, round, oval, etc. It will be appreciated that the shape of pedestal114may be other as shown. For example, instead of a square cross-sectional shape, pedestal114may have a circular, triangular, rectangular, etc. cross-sectional shape as suitable for a particular application. According to an embodiment of the present disclosure, saddle102, jack screw110, pedestal114and base116(and bases116A-116D) are made from a non-conductive or dielectric material. Non-limiting examples of suitable non-conductive and dielectric materials include, concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. Since the support stand100is formed from a non-conductive or dielectric material, there is no need to ground the support. A support stand according to another illustrative embodiment of the present disclosure is shown inFIGS.4A and4Band is referred to generally as support stand200. According to this embodiment, the height of support stand200is fixed. Of course, support stand200may be provided in various heights, allowing the end user to choose support stands200having heights suitable for a particular location and/or use of the support stand. Alternatively, the length of the pedestal may be cut to a desired length at the work site so that the assembled support stand is at the desired height. Support stand200includes a pedestal214having a base216and a saddle202. Base216may be formed integral with pedestal214or may be a separate unit mounted to pedestal214in any suitable manner similar to those described above with respect toFIGS.2A-3C. A proximate end226of connecting member210is attached to saddle base206of saddle202. For example, the proximate end226of connecting member210may rest in a recess in saddle base206. Alternatively, connecting member210may be formed integral with or otherwise permanently attached to saddle base206. The distal end224of connecting member210is attached to pedestal end220. For example, the distal end224of the connecting member210may rest in a recess (not shown) provided in the pedestal end220of the pedestal214. Alternatively, connecting member210may be formed integral with or otherwise permanently attached to pedestal214. The saddle202may have different configurations depending on a particular application. According to the illustrative embodiment depicted inFIG.4A, a V-shaped saddle202is shown. Saddle202includes a pair of arms204which connect at saddle base206. V-shaped saddle202is dimensioned such that an object can be supported in the V as shown inFIG.4B. One or more slots211may be provided in saddle202dimensioned for receiving straps, e.g., tie wrap straps (not shown), that can be slid through the slots211and around the object being supported by support stand200and joined for holding the object securely in place. It will be appreciated that saddle202may be provided in any suitable configuration for supporting various different types/sizes of objects. For example, saddle202may have a flat top for supporting various types/sizes of construction objects. Saddle202may have a roller type support for supporting objects that may move or shift. Saddle202may have a U-shaped support or any other shape for supporting various types of objects. It will be appreciated that the shape of pedestal214may be other than as shown. For example, instead of a square cross-sectional shape, pedestal214may have a circular, triangular, rectangular, etc. cross-sectional shape. According to an embodiment of the present disclosure, saddle202, connecting member210, pedestal214and base216are made from a non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the support stand200include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. Since the support stand200is formed from a non-conductive or dielectric material, there is no need to ground the support. A support stand according to another illustrative embodiment of the present disclosure is shown inFIGS.5A-5Eand is referred to generally as support stand300. According to this embodiment, the height of support stand300is fixed. Of course, support stand300may be provided in various heights, allowing the end user to choose support stands300having heights suitable for a particular location and/or use of the support stand. Alternatively, the length of the pedestal may be cut to a desired length at the work site so that the assembled support stand is at the desired height. Support stand300includes a pedestal314having a base316and a saddle302. Base316includes a tubular section320mounted to a platform322in any suitable manner. Base316may be formed as a single unit by injection molding. Alternatively, tubular section320may be glued or welded, e.g., heat or chemical welded, or mechanically fastened to the platform322. Saddle302is formed from a tubular section326having a U-shaped support member328mounted thereto. Saddle302may be formed as a single unit by injection molding. Alternatively, tubular section326may be glued or welded, e.g., heat or chemical welded, or mechanically fastened to the member328. Pedestal314is a section of pipe-like material having a suitable length providing support stand300with a height for a particular location and/or use of the support stand. Pedestal314may be cut by the end user to a suitable length at the work site to provide an appropriate height for support stand300. Pedestal314has an outside diameter suitable for being received in tubular section326of saddle302and tubular section320of base322. The support stands shown inFIGS.5A-5Eprovide support for one or more objects being supported in this type of U-shaped support. As shown inFIGS.5D and5E, the U-shaped support members328A (FIG.5D) and328B (FIG.5E) may be suitably dimensioned for the size of the object, e.g., pipe diameter, to be supported. The support stand300, i.e., the saddle302, base316and pedestal314, are made from a non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the support stand300include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. Since the support stand300is formed from a non-conductive or dielectric material, there is no need to ground the support. A support stand according to another illustrative embodiment of the present disclosure is shown inFIGS.6A-6Cand is referred to generally as support stand400. According to this embodiment, the height of support stand400is fixed. Of course, support stand400may be provided in various heights allowing the end user to choose support stands400having heights suitable for a particular location and/or use of the support stand. Alternatively, the length of the pedestal may be cut at the work site to a desired length so that the assembled support stand is at the desired height. Support stand400includes a pedestal414, a base member402A and a saddle member402B. According to an illustrative embodiment of the present disclosure, base member402A and saddle member402B are similar and interchangeable. As shown inFIGS.6B and6C, members402(402A,402B) include a base plate420, tubular member422and at least one support member424. One or more drainage orifices428may be provided in base plate420within tubular member422as shown. One or more notched orifices426may also be provided in base plate420for allowing non-conductive stakes to be driven there through and into a substrate, e.g., the ground or flooring, supporting base member402A. Notched orifices426may also be used for allowing bolts to be passed there through and into an object being supported by saddle member402B. The inner diameter of tubular member422is dimensioned for receiving pedestal414. As noted, the pedestal414may be cut by the end user to a suitable length to provide an appropriate height for support stand400. The support stand400is formed from a non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the support stand400include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. Since the support stand400is formed from a non-conductive or dielectric material, there is no need to ground the support stand. A support stand according to another illustrative embodiment of the present disclosure is shown inFIG.7and is referred to generally as support stand500. According to this embodiment, the height of support stand500is fixed. Of course, support stand500may be provided in various heights allowing the end user to choose support stands500having heights suitable for a particular location and/or use of the support stand. Alternatively, the length of the pedestal may be cut to a desired length at the work site so that the assembled support stand is at the desired height. Support stand500includes a pedestal514, a base member502A and a saddle member502B. According to an illustrative embodiment of the present disclosure, base member502A and saddle member502B are similar and are interchangeable. Members502(502A,502B) include a base plate520, tubular member522and circular support member524. Although not shown, one or more drainage orifices may be provided in base plate520within tubular member522. One or more notched orifices526may also be provided in base plate520for allowing non-conductive stakes to be driven there through and into a base supporting base member502A. Notched orifices526may also be used for allowing bolts to be passed there through and into an object being supported by saddle member502B. The inner diameter of tubular member522is dimensioned for receiving pedestal514. As noted, the pedestal514may be cut by the end user to a suitable length to provide an appropriate height for support stand500. The support stand500is formed from a non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the support stand500include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. Since the support stand500is formed from a non-conductive or dielectric material, there is no need to ground the support stand. According to embodiments of the present disclosure, the bases described herein may be used as stand-alone support stands. The bases described herein may be stackable to achieve a desired height to support objects. For example, as shown inFIG.8, each base616has a bottom surface614that is an inverse impression of the top surface623of the base. Two or more bases616may be stacked together by the end user until a desired height is achieved. The stacked bases may interlock to maintain the position of the bases relative to each other. According to an embodiment of the present disclosure, each base is made from a non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the support stand500include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. Since the base is formed from a non-conductive or dielectric material, there is no need to ground the base. A support stand according to another illustrative embodiment of the present disclosure is shown inFIG.9and is referred to generally as support stand700. The support stand700may be made from any suitable non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the support stand700include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. The support stand700includes a pedestal702, a base710and a saddle716. In this exemplary embodiment, the pedestal702is a fixed length pedestal702so that support stand700has a fixed height. The support stand700may be provided with fixed length pedestals702having various heights allowing the end user to choose a support stand700having a height suitable for a particular application. Alternatively, the length of the pedestal702may be cut to a desired length so that the assembled support stand700is at the desired height. The base710may include a platform714providing a relatively large surface area contacting the ground or flooring2. The saddle716includes a support member717and one or more flanges716extending from the support member. The flanges716may be secured to the support member717or the flanges may be monolithically formed with the support member. In this exemplary embodiment, an end706of pedestal702is joined to an end712of base710, and an opposite end704of pedestal702is joined to an end708of the support member717of the saddle716. Continuing to refer toFIG.9, the support member717may include a recessed portion718that may be a curved recessed to conform to the shape of the object, e.g., a pipe, being supported by support member717. However, the recessed portion718may have any shape that conforms to the object being supported, such as a rectangular or square shape. The flanges720include edges722extending diagonally from an upper edge724toward the support member717. The diagonal edges722and recessed portion718serve to form a U-shaped, V-shaped or other shaped opening, and act as a guide for placement of objects on the support member717. Each flange720may include one or more support apertures726and728that can be used to support one or more objects, such as electrical conduits, electrical and communication wires and cabling, pressure air lines, pipes for fluids and gases, and other piping materials. The support apertures726and728may have the same diameter or different diameters. According to the embodiment ofFIG.9, the pedestal702may be formed integrally with base710and saddle716. According to other illustrative embodiments of the present disclosure, support stands may be formed by joining two or more individual sections. For example, a support stand according to another illustrative embodiment is shown inFIG.10, and is referred to as support stand750. The support stand750may be made from any suitable non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming support stand750include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. The support stand750includes a pedestal752, a base760and a saddle770. In this exemplary embodiment, the pedestal752includes a pin755extending from end754and an orifice757formed in end756. The pin755may be formed integrally with pedestal752or may be removably attached to pedestal752. The base760may include a base extension762and a platform764. The base extension762extends from base760and includes a pin759extending therefrom. The pin759may be formed integrally with base extension762or the pin759may be removably attached to the base extension762. The pin759has an outer diameter slightly smaller than an inner diameter of orifice757formed in pedestal752to permit the pin759to fit within the orifice757. The platform764of the base760provides a relatively large surface area for contacting the ground or flooring. The saddle770includes a support member772and one or more flanges780extending from the support member. The flanges780may be secured to the support member772or the flanges may be monolithically formed with the support member. The support member772includes an orifice774formed at end776and a recessed portion778in a top surface of the support member. The diameter of the orifice774is preferably slightly larger than the outer diameter of the pin755extending from the end754of the pedestal752so that the pin755can fit within the orifice774when assembled. In this exemplary embodiment, the saddle770is capable of rotating 360 degrees about pin755to accommodate the support of objects in any desired direction. The recessed portion778of the support member772may include a curved recessed surface, as seen inFIG.10, to conform to the shape of the object, e.g., a pipe, being supported by support member772. However, the recessed portion778may have any shape that conforms to the object being supported, such as a rectangular or square shape. Each flange780includes an edge782extending diagonally from an upper edge784toward the support member772. The diagonal edges782and recessed portion778serve to form a U-shaped, V-shaped or other shaped opening, and act as a guide for placement of objects on the support member772. Each flange780may include one or more support apertures786and788that can be used to support one or more objects, such as electrical conduits, electrical and communication wires and cabling, pressure air lines, pipes for fluids and gases, and other piping materials. The support apertures786and788may have the same diameter or different diameters. The pedestal752, base760and saddle766of the support stand750can be stored and transported disassembly and then assembled on site. Assembly can be completed by inserting pin759of base760into orifice757of pedestal752, and by inserting pin755of pedestal752into orifice774of saddle770. A support stand according to another illustrative embodiment of the present disclosure is shown inFIG.11and is referred to as support stand800. The support stand800may be made from any suitable non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming support stand800include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. The support stand800includes a pedestal802, a base810and a saddle820. In this exemplary embodiment, the pedestal802includes a threaded pin805extending from end804and an orifice807including a threaded inner surface formed in end806. The threaded pin805may be formed integrally with pedestal802or may be removably attached to pedestal802. The base810may include a base extension812and a platform814. The base extension812extends from base810and includes a threaded pin809extending therefrom. The threaded pin809may be formed integrally with the base extension812or the threaded pin809may be may be removably attached to the base extension812. The threaded pin809is configured to fit within the threaded orifice807formed in pedestal802to couple the base810to the pedestal802. The saddle820includes a support member822and one or more flanges830extending from the support member. The flanges830may be secured to the support member822or the flanges may be monolithically formed with the support member. The support member822has a threaded orifice824formed at end826and a recessed portion828in a top surface of the support member. The threaded pin805is configured to fit within the threaded orifice824to couple the saddle820to the pedestal802. The recessed portion828may include a curved recessed surface, as shown inFIG.11, to conform to the shape of the object, e.g., a pipe, being supported by support member822. However, the recessed portion828may have any shape that conforms to the object being supported, such as a rectangular or square shape. Each flange830includes an edge832extending diagonally from an upper edge834toward the support member822. The diagonal edges832and recessed portion828serve to form a U-shaped, V-shaped or other shaped opening, and act as a guide for placement of objects on the support member822. Each flange830may include one or more support apertures826and828that can be used to support one or more objects, such as electrical conduits, electrical and communication wires and cabling, pressure air lines, pipes for fluids and gases, and other piping materials. The support apertures826and828may have the same diameter or different diameters. The pedestal802, saddle816and base810of support stand810can be stored and transported disassembled and then assembled on site. Assembly can be completed by screwing threaded pin809of base810into orifice807of pedestal802, and by screwing threaded pin805of pedestal802into threaded orifice824of the saddle820. A support stand according to another illustrative embodiment of the present disclosure is shown inFIG.12, and is referred to as support stand850. The support stand850may be made from any suitable non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming support stand850include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. The support stand850includes a pedestal852, one or more pedestal extensions860, a base870and a saddle880. The pedestal852includes a pin855extending from end854and an orifice857formed in end856. The pin855may be formed integrally with pedestal852or may be removably attached to pedestal852. Each pedestal extension860includes a pin862extending from end864and an orifice866in end868. The pin862may be formed integrally with pedestal extension860or may be removably attached to pedestal extension860. The one or more pedestal extensions860may be provided in various lengths allowing one or more pedestal extensions862to be added to pedestal852for achieving a desired overall height of the support stand850. The orifice866preferably has a diameter that is slightly larger than the outer diameter of the pin855extending from pedestal852to permit the pin855to fit within the orifice866when assembled, as described below. The base870may include a base extension872and a platform874. The base extension872extends from base870and includes a pin876extending therefrom. The pin876may be formed integrally with base extension872or may be removably attached to base extension872. Preferably, the pin876has an outer diameter slightly smaller than an inner diameter of orifice857formed in pedestal852to permit the pin876to fit within the orifice857when assembled, as described below. Referring toFIGS.12and13, the saddle880includes a support member882and one or more flanges890extending from the support member. The flanges890may be secured to the support member882or the flanges may be monolithically formed with the support member. The support member882includes an orifice884formed in a lower portion887of the support member and a recessed portion886on an upper surface of the support member. The orifice884preferably has a diameter that is slightly larger than the outer diameter of the pin862extending from pedestal extension860to permit the pin862to fit within the orifice884when assembled, as described below. In this exemplary embodiment, the saddle880is capable of rotating 360 degrees about pin862to accommodate the support of objects in any desired direction. The recessed portion886of the support member882may be a curved recessed to conform to the shape of the object, e.g., a pipe, being supported by central support member882. However, the recessed portion886may have any shape that conforms to the object being supported, such as a rectangular or square shape. Each flange890includes an edge892extending diagonally from an upper edge894toward the recessed portion886of the support member882. The diagonal edges892and recessed portion886serve to form a U-shaped or V-shaped opening, and act as a guide for placement of objects on the support member882. Each flange890may also include one or more support apertures896and898that can be used to support one or more objects, such as electrical conduits, electrical and communication wires and cabling, pressure air lines, pipes for fluids and gases, and other piping materials. The support apertures896and898may have the same diameter or different diameters. The pedestal852, pedestal extension860, base870and saddle880of the support stand850can be stored and transported disassembled and then assembled on site. Assembly can be completed by inserting pin876of base870into orifice857of pedestal852, by inserting pin855of pedestal852into orifice866of pedestal extension860, and by inserting pin862of pedestal extension860into orifice884of saddle880. It will be appreciated that the pin876of the base870and the orifice857of the pedestal852may be threaded as described above with respect to the embodiment depicted inFIG.11so that the base870may be releasably secured to the pedestal852by threading the pin876into the orifice857. Similarly, the pin855of the pedestal852and the orifice866of the pedestal extension860may be threaded as described above with respect to the embodiment depicted inFIG.11so that the pedestal extension may be releasably secured to the pedestal by threading the pin855into the orifice866. Similarly, the pin862of the pedestal extension860and the orifice884of the saddle890may be threaded as described above with respect to the embodiment depicted inFIG.11so that the saddle may be releasably secured to the pedestal extension by threading the pin862into the orifice884. Referring now toFIGS.14and15, additional illustrative embodiments of a portion of a support stand including the saddle880ofFIG.12is shown. In the illustrative embodiment ofFIG.14, an object6extends through and rests in one of the support apertures898in one of the flanges890and an object4rests on the recessed portion886of the support member882. It will be appreciated that many support stands may be provided along the run of objects4and6. For example, objects4and6may be pipes, conduits and/or wires extending from point A to point B. Depending on the distance between point A and point B, one or more support stands may be provided for supporting the objects. Object6may be fed through a support aperture896or898in a flange890and/or rest on a recessed portion886of one or more support stands850provided between point A and point B. Object4may rest on the recessed portion886and/or be fed through a support aperture in a flange890of the one or more support stands provided between point A and point B. Depending on a particular application, it may be desirable to provide protection for an object passing through a support aperture896or898in the saddle880to minimize damage to the object, e.g., chafing, etc. In addition, it might be desirable depending on a particular application to reduce the size of one or more support apertures896and/or898passing through a flange890of the saddle880to provide a more snug and secure fit for an object passing there through. In these instances, a grommet900may be provided. The grommet900includes a first portion902having an outer diameter dimensioned to fit within the support aperture896or898, and may include a second portion904having a larger diameter and acting as a stop. The grommet900may be made of a nonconductive or dielectric material such as those described herein. Referring toFIG.15, depending on a particular application, two or more objects4and6may be tied together using, for example, ties8. Object6is passed through one or more apertures898of the support stands850provided between point A and point B. Object4may rest on the recessed portion886of the one or more support stands provided between point A and point B. The objects4and6may then be tied together using one or more ties8as desired. Referring toFIG.16, a portion of a support stand according to another embodiment of the present disclosure is shown. The support stand910in this exemplary embodiment includes a pedestal902, a base (not shown) and a saddle916. The pedestal902may be may be similar to any of the pedestals and/or pedestal extensions described herein and may be attached to the saddle916in any of the manners described herein. The base may be similar to any of the bases described herein. In this exemplary embodiment, the saddle916includes a support member920and a pair of flanges930extending from the support member as shown. The support member920includes an orifice (not shown) formed in a lower portion of the support member to receive an upper portion of the pedestal902and a recessed portion922on an upper surface of the support member. The orifice is similar to the orifices described herein. Each flange930includes a diagonal edge932extending toward the recessed portion922of the support member920. The diagonal edges932and recessed portion922serve to form a U-shaped, V-shaped or other shaped opening, and act as a guide for placement of objects on the support member920. In place of or in addition to the support apertures described herein, each flange930may include one or more slots934and936. The slots934may be a substantially U-shaped slot, V-shaped slot or other shape slot having an open end, as shown. The width of the slot934is configured and dimensioned to receive and support the desired object. For example, according to the embodiment depicted inFIG.16, the slot934is configured and dimensioned to receive and support object7. The slots936are formed at an angle to include an upwardly extending arm938so that an object, e.g., object9, inserted into the slot936remains in the slot. A support stand according to another illustrative embodiment of the present disclosure is shown inFIGS.17-21and is referred to generally as support stand950. The support stand950may be made from any suitable non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the support stand950include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. The support stand950includes a pedestal952, a base960and a saddle970. The pedestal952may be a fixed length pedestal so that support stand950has a fixed height. When using fixed length pedestals, the fixed length pedestals may be provided in various heights allowing an end user to choose a pedestal952having a length suitable for a particular location and/or use of the support stand950. Alternatively, the length of the pedestal952may be cut to a desired length at the work site so that the assembled support stand950is at the desired height. As another alternative, the pedestal952may include pedestal extensions to adjust the height of the pedestal952for a particular location and/or use of the support stand950. The pedestal extensions may be similar to the pedestal extensions860shown inFIG.12and described herein. In the embodiment shown inFIGS.17-21, the pedestal is a fixed length pedestal. The base960may include a platform962providing a relatively large surface area contacting the ground or flooring and a raised end964extending from the platform962, as seen inFIG.17. In this illustrative embodiment, the raised end964of the base960is configured to be joined with, couple to or otherwise mated with end954of the pedestal952so that the base960can be removed from the pedestal952when shipping the support stand950. In another illustrative embodiment, the raised end964of the base960may be molded with the pedestal to form a monolithic structure. Referring toFIGS.17-19, the saddle970includes a support member972and one or more flanges974extending from the support member. The support member972includes an orifice976configured to receive an upper end956of the pedestal952, as shown inFIG.17. The orifice976ends within the support member972at a wall stop977such that when the orifice receives the upper end956of the pedestal952, a top of the upper end956of the pedestal952contacts or bottoms-out at the wall stop977. In this illustrative embodiment, the support member972includes a removable cap978that is removable secured to the support member972using, for example, mechanical fasteners979, such as screws passing through holes in the cap978and into threaded holes, plugs or inserts positioned in the support member972, as seen inFIG.19. The cap978forms part of the orifice976in the support member972and when removed provides a window or access to the interior of the orifice976, seen inFIG.18. Access to the interior of the orifice976permits smaller scale height adjustments of the saddle970relative to the pedestal952using one or more shims980, seen inFIG.21, as described in more detail below. The support member972may include a recessed portion982, seen inFIG.17, that may be a curved recessed to conform to the shape of an object being supported by support member950. However, the recessed portion982may have any shape that conforms to the object being supported, such as a rectangular or square shape, so that the object can rest on the saddle970. Referring toFIGS.17and20, each flange974includes an edge984extending diagonally from an upper edge986toward the recess portion982of the support member972. The diagonal edges984and recessed portion982serve to form a U-shaped, V-shaped or other shaped opening, and act as a guide for placement of objects on the support member950. The flanges974may be secured to the support member972using mechanical fasteners or adhesive fasteners, or the flanges974may be integrally formed into the support member972so that the flanges and support member are monolithically formed. Each flange974may include one or more support apertures988and990that can be used to support one or more objects. The support apertures988and990may have the same diameter or different diameters. In another illustrative embodiment, the flanges974may include one or more slots similar to slots934and936described above with reference toFIG.16. Referring toFIGS.18and20-21, adjusting the height of the saddle970relative to the pedestal952will be described. In instances where there is a gap “G”, seen inFIG.20, between the support member972of the saddle970and the object4to be supported by the support stand950, the saddle970may have to be raised so that the object4rests on the recess portion982of the support member972. To raise the height of the saddle970, the cap978is removed from the support member972by removing the screws979securing the cap to the support member972, as shown inFIG.18. With the cap978removed, access to the interior of the orifice976is provided such that the saddle970can be lifted or horizontally removed from pedestal952and one or more shims980can be placed on the top of the pedestal952. The saddle970can be lowered or horizontally repositioned on the pedestal952and the one or more shims980, as shown inFIG.21. With the wall stop977of the support member972of the saddle970resting on the one or more shims980, the cap978is re-attached to the support member. At this point, the gap “G” has been eliminated and the object4is resting on the recessed portion982of the support member972as shown inFIG.21. It is noted that the one or more shims980may be made from any suitable non-conductive or dielectric material. Non-limiting examples of suitable non-conductive or dielectric materials used for forming the shims980include concrete, polymer concrete, cementitious resins, fiberglass, fiberglass reinforced resins, plastics including PE (polyethylene), PVC (polyvinyl chloride) and other plastic compositions, etc. As shown throughout the drawings, like reference numerals designate like or corresponding parts. While illustrative embodiments of the present disclosure have been described and illustrated above, it should be understood that these are exemplary of the disclosure and are not to be considered as limiting. Additions, deletions, substitutions, and other modifications can be made without departing from the spirit or scope of the present disclosure. Accordingly, the present disclosure is not to be considered as limited by the foregoing description. | 42,881 |
11862361 | MODE FOR CARRYING OUT THE INVENTION Hereinafter, a conductive laminate according to the present technology, an optical device using the same, and a method for manufacturing the conductive laminate will be described in detail with reference to the drawings. It should be noted that the present disclosure is not limited to the following embodiments and various modifications can be made without departing from the scope of the present disclosure. Moreover, the features illustrated in the drawings are shown schematically and are not intended to be drawn to scale. Actual dimensions should be determined in consideration of the following description. Furthermore, those skilled in the art will appreciate that dimensional relations and proportions may be different among the drawings in certain parts. Conductive Laminate FIG.1is a cross-sectional view schematically illustrating a configuration of a conductive laminate1according to the present technology. As shown inFIG.1, the conductive laminate1is a conductive laminate in which a first transparent material layer3, a metal layer4mainly composed of silver, and a second transparent material layer5are laminated on at least one surface of a transparent substrate2in this order from the transparent substrate2side, in which the first transparent material layer3is composed of a zinc-free metal oxide, and the second transparent material layer5is composed of a zinc-containing metal oxide. The respective layers3to5of the conductive laminate1can be formed by sputtering, which is one of vacuum deposition techniques. The inventors of the present invention conducted a study by laminating various transparent materials and silver by sputtering, and found that an absorption layer causing light absorption (hereinafter referred to as a “light absorbing layer”) was formed at the interface between the transparent material and silver. In addition, it was found that there were two interfaces between the first transparent material layer3and the silver constituting the metal layer4and between the silver constituting the metal layer4and the second transparent material layer5, respective light absorbing layers existed at each of the interfaces, and the formation mechanisms of each of the light absorbing layers were different. The first light absorbing layer between the first transparent material layer3and the silver constituting the metal layer4is formed when the first transparent material layer3is formed on the transparent substrate2and then silver is formed by sputtering or the like. In other words, when the silver atoms jumped out from the target at a high speed reach the transparent substrate2, they lose kinetic energy and are fixed to the surface. At that time, when the interaction with the metal constituting the first transparent material layer3is strong, the first transparent material layer3is alloyed to form a light absorbing layer (first light absorbing layer). Zinc easily forms a light absorbing layer since it has a wide solid solution region with silver and strongly interacts with silver. In general, stronger interaction will suppress the island formation on the surface of silver to suppress the absorption by the silver islands, but when the layer is formed, a certain amount of the light absorbing layer is also formed there. When a metal oxide of a metal such as Nb, Ti, Zr, Hf, Ta, W, or Mo, which is less interactive with silver, is used as the first transparent material constituting the first transparent material layer3, a very thin silver film would form an island structure and increase light absorption; however, it has been found that laminating silver with a certain thickness or more will reduce light absorption by silver alone without forming a first light absorbing layer by an alloy layer with the first transparent material. The minimum film thickness for this purpose was found to be 7 nm or more. The second light absorbing layer between silver constituting the metal layer4and the second transparent material layer5might be formed when the second transparent material layer5is formed on the metal layer4by sputtering or the like. In other words, although metal elements constituting the second transparent material layer5and oxygen atoms reach the surface of the transparent substrate2the surface of which is covered with silver, weak interaction between the silver and the metal element would cause insufficient wetting and spreading of the second transparent material layer5and would form a large number of small voids at the interface, the voids causing light absorption. On the contrary, a zinc-containing metal oxide used as the second transparent material improves wettability on the surface of the transparent substrate2covered with silver, thereby forming an excellent interface. In addition, since the strong bonding between zinc and oxygen would cause zinc to be an oxide film before forming an alloy with silver, it is possible to avoid the formation of a light absorbing layer (second light absorbing layer) by the alloy layer. At present, the practicable conductive oxide constituting the second transparent material layer5is a zinc oxide and a zinc alloy composite oxide, and it can be said that the zinc oxide and the zinc alloy composite oxide are preferable since they have good contact resistance when the electric charge is substantially transferred from the outside to the surface of the conductive laminate1. As described above, by using, as a first transparent material constituting the first transparent material layer3, a zinc-free transparent material, or industrially, an oxide or composite oxide of metals such as Nb, Ti, Zr, Hf, Ta, W, and Mo, depositing the first transparent material on the transparent substrate2by sputtering or the like, depositing silver as the metal layer4by sputtering or the like to a thickness of 7 nm or more, and depositing a zinc-containing oxide as a second transparent material constituting the second transparent material layer5by sputtering or the like, in other words, by laminating these layers in this order, it is possible to suppress light absorption at the interfaces between each of the layers3to5to obtain the conductive laminate1having a high transmittance. It is desired that the first transparent material constituting the first transparent material layer3contains no zinc, and a high refractive index material having a refractive index of 1.8 or more is preferable because reflection of the surface is suppressed by optical interference. Examples include oxides of Nb, Ti, Zr, Hf, Ta, W, and Mo, and composite oxides thereof. Further, one or more other types of elements may be added within a range not exceeding 50 atom % to these elements. The metal layer4is a metal layer containing silver as a main component, and this may be pure silver or additive elements may be added in a range not exceeding 10 atom % in total. In other words, in the present technology, the silver as a main component means both of silver of 90 atom % or more and pure silver. In addition, the silver layer preferably has a thickness of 7 nm or more because a thickness less than 7 nm tends to form an island-like film. The upper limit of the silver layer thickness is not particularly limited, but is preferably less than 15 nm. A film thickness of 15 nm or more will make the light absorption inside the silver layer larger than the absorption at the interface, which may degrade the effect of the present technology. The second transparent material constituting the second transparent material layer5desirably contains zinc, and one or more kinds of materials may be added in a range not exceeding 50 atom % from the viewpoints of optical properties, electrical conductivity, and chemical stability. In this way, by forming the zinc-free first transparent material on the transparent substrate2, depositing silver or a silver alloy, and then forming a zinc-containing second transparent material, the present technology can suppress the formation of a light absorbing layer at each interface and achieve the conductive laminate1having low electric resistance and high transmittance. The conductive laminate1according to the present technology has low electric resistance and high transmittance. Therefore, the present technology can provide a power saving and high performance optical device using at least one conductive laminate, for example, a touch panel, a light control element, an electrophoretic optical element, a light emitting element, an antenna or the like that uses the conductive laminate as at least one pole of an electrode. Hereinafter, each layer constituting the conductive laminate1will be described in detail. As described above, in the conductive laminate1according to the present technology, a first transparent material layer3, a metal layer4mainly composed of silver, and a second transparent material layer5are laminated on at least one surface of the transparent substrate2in this order from the transparent substrate2side. Transparent Substrate The transparent substrate2of the present disclosure may be composed of either a glass substrate or a resin film. The transparent substrate2composed of a resin film can be manufactured by a roll-to-roll method so as to improve production efficiency. The material of such resin film is not particularly limited, and may be, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaramid, polyimide, polycarbonate, polyethylene, polypropylene, triacetylcellulose (TAC), and polycycloolefin (COC, COP), among others. The thickness of the transparent substrate2is not particularly limited, but in the case of the resin film, it is preferable to set the thickness to 20 μm or more and 200 μm or less in consideration of ease of handling in manufacturing and thinning of the member. In the conductive laminate1according to the present technology, the transparent substrate2preferably has a light transmittance of 88% or more. In order to improve the scratch resistance of the transparent substrate2, thin films of, for example, acrylic resin may be formed on both surfaces of the transparent substrate2by, for example, solution coating. First Transparent Material Layer The first transparent material layer3is composed of a zinc-free metal oxide, and an oxide of a material which is less interactive with silver, such as oxides of Nb, Ti, Zr, Hf, Ta, W, and Mo can be preferably used. These may be a composite oxide containing one or more elements, or may contain elements other than zinc at a concentration of 50 atom % or less. The thickness of the first transparent material layer3is not particularly limited, and can be set to a film thickness having the highest transmittance according to the material configuration. The first transparent material layer3may have an actual thickness in the range of, for example, 30 to 80 nm. The method of forming the first transparent material layer3is not particularly limited, but it is preferable to use a sputtering method in order to improve production efficiency and equalize the film thickness distribution. The first transparent material layer3may be formed as a plurality of layers from the viewpoint of moisture-proof property. In this case, at least the transparent material layer in contact with the metal layer4is preferably composed of a zinc-free metal oxide such as oxides of Nb, Ti, Zr, Hf, Ta, W, or Mo which is less interactive with silver. Metal Layer The metal layer4laminated on the first transparent material layer3is a metal layer mainly composed of silver. Additional elements may be added to the metal layer4in a range not exceeding 10 atom % as a whole. In other words, the metal layer4according to the present technology is composed of 90 atom % or more of silver or pure silver. The metal layer4preferably has a thickness of 7 nm or more. A film thickness of less than 7 nm tends to form an island-like film and might inhibit light transmittance. The upper limit of the film thickness is not particularly limited, but a film thickness of 15 nm or more will make the light absorption inside the silver layer larger than the absorption at the interface, which may degrade the effect of the present invention. Although the method of forming the metal layer4is not particularly limited, it is preferable to use a sputtering method from the viewpoint of continuously forming the second transparent material layer5after forming the metal layer4, improving production efficiency, and equalizing the film thickness distribution. Second Transparent Material Layer The second transparent material layer5laminated on the metal layer4is composed of an zing-containing oxide. The second transparent material layer5may contain one or more elements other than zinc in a range not exceeding 50 atom % from the viewpoints of optical properties, electrical conductivity, and chemical stability. The thickness of the second transparent material layer5is not particularly limited, and can be set to a film thickness having the highest transmittance according to the material configuration. An actual thickness of the second transparent material layer5may be in a range of, for example, 30 to 70 nm. The method of forming the second transparent material layer5is not particularly limited, but it is preferable to use a sputtering method in order to continuously form the second transparent material layer5after the formation of the metal layer4, improve the production efficiency, and equalize the film thickness distribution. The second transparent material layer5may be formed as a plurality of layers from the viewpoint of scratch resistance property. In this case, at least the transparent material layer in contact with the metal layer4may be of a zinc-containing oxide, and one or more elements may be added thereto in a range not exceeding 50 atom % from the viewpoints of optical properties, electrical conductivity, and chemical stability. Other layers are also preferably formed of a transparent oxide having electrical conductivity in order to maintain excellent electrical conductivity. Although the conductive laminate1shown inFIG.1is formed by laminating the first transparent material layer3, the metal layer4, and the second transparent material layer5on one surface of the transparent substrate2, in the conductive laminate1according to the present technology, the first transparent material layer3, the metal layer4and the second transparent material layer5may be laminated on the other surface of the transparent substrate2or on both surfaces of the transparent substrate2. Manufacturing Steps of Conductive Laminate The conductive laminate1described above can be manufactured by laminating the first transparent material layer3, the metal layer4mainly composed of silver, and the second transparent material layer5on at least one surface of the transparent substrate2in this order from the transparent substrate2side. The first transparent material layer3, the metal layer4, and the second transparent material layer5may be formed by using, for example, a thin film forming apparatus disclosed in Japanese Unexamined Patent Application Publication No. 2014-34701.FIG.2is a perspective view illustrating an internal configuration of a thin film forming apparatus disclosed in Japanese Unexamined Patent Application Publication No. 2014-34701. This thin film forming apparatus forms a film on a film substrate by sputtering with a roll-to-roll method, allowing a plurality of sputtering targets to be placed, and allowing a plurality of kinds of different materials to be formed while maintaining a vacuum atmosphere once the roll is set. In addition, at the time of sputtering, this thin film forming apparatus can introduce oxygen gas into the plasma in addition to argon gas used as a sputtering gas, thereby forming the oxide of the target material on the film base material. Hereinafter, the structure of the thin film forming apparatus will be described in detail. The thin film forming apparatus is provided with: a measuring unit to which a base film is continuously supplied in the longitudinal direction to measure optical properties in the width direction of a thin film formed on the base film; a supply unit provided with a plurality of gas nozzles in the width direction of the base film to supply reactive gas near the target; and a control unit to control the flow rate of reactive gas ejected from each gas nozzle based on the optical properties in the width direction measured by the measuring unit, thereby forming a thin film of uniform thickness in the longitudinal direction and the width direction. Further, a specific configuration may preferably be provided with a film forming part including: a supply unit, a sputtering electrode for applying a voltage to a target, and a plasma measuring unit for measuring the emission spectrum of the plasma in the width direction of the substrate film during film formation. With this configuration, the control unit can control the flow rate of the reactive gas ejected from each gas nozzle and the voltage applied to the target on the basis of the optical properties in the width direction measured by the measuring unit and the emission spectrum measured by the plasma measuring unit, thereby forming a thin film having a uniform thickness in the width direction. Further, a specific configuration may include: an unwinding part for winding out the base film in the longitudinal direction, a film forming unit in which a plurality of film forming parts are arranged in the longitudinal direction of the base film, and a winding part for winding the base film in which the thin film is formed in the film forming unit. Thus, a multilayer thin film can be formed during the processes between the unwinding and the winding of the base film. It is preferable to dispose the measuring unit at least after the last film forming part, i.e., between the film forming unit and the winding part, and it is more preferable to dispose a plurality of the measuring units after each of the plurality of the film forming parts, respectively. Thus, the optical properties of both the single-layer thin film and the multi-layer thin film can be measured. The thin film forming apparatus shown inFIG.2feeds a base film serving as a base film while winding it around a can roll to form a thin film on the surface of the base film by sputtering. In this thin film forming apparatus, a base film10(transparent substrate2) is supplied from an unwinding roll11functioning as an unwinding part and the base film10having the thin film formed thereon is wound by a winding roll12functioning as a winding part. A first film forming chamber unit and a second film forming chamber unit which are film formation units are provided in a vacuum chamber. The vacuum chamber is connected to a vacuum pump for discharging air and can be adjusted to a predetermined degree of vacuum. The first film forming chamber unit and the second film forming chamber unit are respectively provided with a first can roll21and a second can roll22, and a plurality of sputtering chambers SP1to SP10functioning as film forming units are fixed so as to face the outer peripheral surfaces of the can rolls21,22. In each of the sputtering chambers SP1to SP10, a predetermined target is mounted above the electrode, and the supply part having a plurality of gas nozzles in the width direction of the base film10is provided. In addition, the thin film forming apparatus is provided with an optical monitor31functioning as the measuring unit for measuring optical properties between the first film forming chamber unit and the second film forming chamber unit, i.e., after film formation by the sputtering chamber SPS. Thus, it is possible to control the film formation on an intermediate product conveyed after the first film forming chamber unit and to reduce the adjustment time for adjusting a single layer. In addition, the thin film forming apparatus is further provided with an optical monitor32, which is the measuring unit for measuring optical properties after the second film forming chamber unit, i.e., after film formation by the sputtering chamber SP10. Thus, it is possible to confirm the quality of the final film formation after the second film forming chamber unit. The optical monitors31,32measure optical properties in the width direction of the thin film formed on the base film10by an optical head capable of scanning in the width direction, as will be described later. The optical monitors31,32measure, for example, the peak wavelength of reflectance as an optical property and convert it into an optical thickness to acquire an optical thickness distribution in the width direction. The thin film forming apparatus having such a constitution can produce a multilayer thin film by feeding the base film10from a winding roll11, forming thin films on the base film10conveyed by the first can roll21and the second can roll22, and winding the thin film by the winding roll12. Here, by measuring optical properties in the width direction of the thin film formed on the base film10by using the optical monitors31,32, and controlling the flow rate of the reactive gas supplied from each gas nozzle provided in the width direction based on the optical properties, it is possible to form a thin film having a uniform thickness in the longitudinal direction and the width direction. EXAMPLES Hereinafter, the present technology will be specifically described with reference to examples and comparative examples, but the present invention is not limited to the following examples. Example 1 A first transparent material layer, a metal layer, and a second transparent material layer were sequentially formed on a transparent substrate by using a thin film forming apparatus disclosed in Japanese Unexamined Patent Application Publication No. 2014-34701 shown inFIG.2. A COP film of 50 μm thickness was used as the transparent substrate. The thin film forming apparatus can simultaneously laminate thin films of a plurality of materials in sequence, and in the present example, targets of niobium oxide, silver, and a composite oxide of zinc-tin are arranged in this order from the side closer to the film unwinding side. Each target is connected to an individual power source and can cause discharge by applying arbitrarily controllable power. Further, each target is housed in an independent container, and the partition wall separating the targets has only a small gap near the can roll, so that a substantially different gas atmosphere can be realized. A film was formed by a sputtering method by evacuating the entire vacuum chamber of the thin film forming apparatus to 1×10−3Pa or less, introducing argon gas into the first cathode part provided with niobium oxide in the vacuum chamber while adjusting the flow rate to be 150 sccm by a mass flow controller, and then applying power to the niobium oxide target to cause discharge. At this time, in order to suppress the light absorption of niobium oxide due to oxygen shortage, 6 sccm of oxygen was added to form a transparent oxide layer. The running speed of the film was 3 m/min. After measuring a relation between the electric power and the film thickness, the electric power was previously adjusted based on the measurement so that niobium oxide with a thickness of 46 nm could be formed at a running speed of 3 m/min. After niobium oxide was formed at the first cathode part, a silver thin film was formed at the second cathode part. Specifically, a film was formed by a sputtering method by introducing argon gas into the second cathode part in the vacuum chamber while adjusting the flow rate to be 450 sccm by a mass flow controller, and then applying power to the silver target to cause discharge. Although two adjacent cathodes are used in this example, it is not necessary to use two adjacent cathodes. Depending on the configuration of the apparatus, the entire cathode chamber may be used as a partition wall instead of using one cathode chamber. After measuring a relation between the electric power and the film thickness, the electric power was previously adjusted based on the measurement so that silver film with a thickness of 9 nm could be formed at a running speed of 3 m/min. After a silver thin film was formed at the second cathode part, a zinc-tin composite oxide was formed at the third cathode part. Specifically, a film was formed by a sputtering method by introducing argon gas into the third cathode part of the vacuum chamber while adjusting the flow rate to be 150 sccm by a mass flow controller, and then applying power to the zinc-tin composite oxide target to cause discharge. At this time, a small amount of oxygen was introduced separately from argon gas while adjusting the amount of oxygen by a mass flow controller so as not to cause poor conductivity due to insufficient oxygen or excessive oxygen to obtain an excellent transparent conductive oxide. Although two adjacent cathodes are used in this example, it is not necessary to use two adjacent cathodes. Depending on the configuration of the apparatus, one entire cathode chamber may be used as a partition wall instead of using individual cathode chambers. After measuring a relation between the electric power and the film thickness, the electric power was previously adjusted based on the measurement so that zinc-tin composite oxide with a thickness of 50 nm could be formed at a running speed of 3 m/min. All the film thicknesses were calculated in advance by computer simulation and designed to have the highest transmittance. After forming the three layers, a sample was prepared by continuously winding the film having the configure shown inFIG.1, introducing air into the entire apparatus, and then taking out the sample. Example 2 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 49 nm, the silver film thickness was adjusted to 8 nm, and the zinc-tin composite oxide film thickness was adjusted to 52 nm. Example 3 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 52 nm, the silver film thickness was adjusted to 7 nm, and the zinc-tin composite oxide film thickness was adjusted to 53 nm. Example 4 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 43 nm, the silver film thickness was adjusted to 10 nm, and the zinc-tin composite oxide film thickness was adjusted to 49 nm. Example 5 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 40 nm, the silver film thickness was adjusted to 11 nm, and the zinc-tin composite oxide film thickness was adjusted to 47 nm. Example 6 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 38 nm, the silver film thickness was adjusted to 12 nm, and the zinc-tin composite oxide film thickness was adjusted to 46 nm. Example 7 A sample was prepared under the same conditions as in Example 1 except that titanium oxide was used as the first transparent material, the film thickness of which was adjusted to 39 nm, the silver film thickness was adjusted to 10 nm, and the zinc-tin composite oxide film thickness was adjusted to 52 nm. Example 8 A sample was prepared under the same conditions as in Example 1 except that zirconium oxide was used as the first transparent material, the film thickness of which was adjusted to 71 nm, the silver film thickness was adjusted to 7 nm, and the zinc-tin composite oxide film thickness was adjusted to 42 nm. Example 9 A sample was prepared under the same conditions as in Example 1 except that hafnium oxide was used as the first transparent material, the film thickness of which was adjusted to 62 nm, the silver film thickness was adjusted to 7 nm, and the zinc-tin composite oxide film thickness was adjusted to 47 nm. Example 10 A sample was prepared under the same conditions as in Example 1 except that tantalum pentoxide was used as the first transparent material, the film thickness of which was adjusted to 58 nm, the silver film thickness was adjusted to 7 nm, and the zinc-tin composite oxide film thickness was adjusted to 50 nm. Example 11 A sample was prepared under the same conditions as in Example 1 except that tungsten oxide was used as the first transparent material, the film thickness of which was adjusted to 63 nm, the silver film thickness was adjusted to 7 nm, and the zinc-tin composite oxide film thickness was adjusted to 47 nm. Example 12 A sample was prepared under the same conditions as in Example 1 except that molybdenum oxide was used as the first transparent material, the film thickness of which was adjusted to 65 nm, the silver film thickness was adjusted to 7 nm, and the zinc-tin composite oxide film thickness was adjusted to 48 nm. Example 13 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 51 nm, the silver film thickness was adjusted to 7 nm, and zinc oxide was used as the second transparent material, the film thickness of which was adjusted to 53 nm. Example 14 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 53 nm, the silver film thickness was adjusted to 7 nm, and indium-zinc composite oxide was used as the second transparent material, the film thickness of which was adjusted to 51 nm. Example 15 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 47 nm, the silver film thickness was adjusted to 7 nm, and aluminum-zinc composite oxide was used as the second transparent material, the film thickness of which was adjusted to 58 nm. Comparative Example 1 A sample was prepared under the same conditions as in Example 1 except that zinc oxide was used as the first transparent material, the film thickness of which was adjusted to 64 nm, the silver film thickness was adjusted to 7 nm, and the zinc-tin composite oxide film thickness was adjusted to 46 nm. Comparative Example 2 A sample was prepared under the same conditions as in Example 1 except that zinc-tin composite oxide was used as the first transparent material, the film thickness of which was adjusted to 77 nm, the silver film thickness was adjusted to 7 nm, and niobium oxide was used as the second transparent material, the film thickness of which was adjusted to 35 nm. Comparative Example 3 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 55 nm, the silver film thickness was adjusted to 6 nm, and the zinc-tin composite oxide film thickness was adjusted to 54 nm. Comparative Example 4 A sample was prepared under the same conditions as in Example 1 except that the niobium oxide film thickness was adjusted to 55 nm, the silver film thickness was adjusted to 7 nm, and niobium oxide was used as the second transparent material, the film thickness of which was adjusted to 42 nm. Comparative Example 5 A sample was prepared under the same conditions as in Example 1 except that zinc oxide was used as the first transparent material, the film thickness of which was adjusted to 64 nm, the silver film thickness was adjusted to 7 nm, and zinc oxide was used as the second transparent material, the film thickness of which was adjusted to 46 nm. Comparative Example 6 A sample was prepared under the same conditions as in Example 1 except that zinc oxide was used as the first transparent material, the film thickness of which was adjusted to 66 nm, the silver film thickness was adjusted to 7 nm, and indium-zinc composite oxide was used as the second transparent material, the film thickness of which was adjusted to 44 nm. Comparative Example 7 A sample was prepared under the same conditions as in Example 1 except that zinc oxide was used as the first transparent material, the film thickness of which was adjusted to 58 nm, the silver film thickness was adjusted to 7 nm, and aluminum-zinc composite oxide was used as the second transparent material, the film thickness of which was adjusted to 51 nm. Comparative Example 8 A sample was prepared under the same conditions as in Example 1 except that zinc oxide was used as the first transparent material, the film thickness of which was adjusted to 74 nm, the silver film thickness was adjusted to 8 nm, and titanium oxide was used as the second transparent material, the film thickness of which was adjusted to 31 nm. Evaluation Results Each sample was cut to an arbitrary size and then measured and evaluated. The surface resistance was measured in accordance with “JIS K-7194” by using “Loresta GP (registered trademark) (available from Dia Instruments)”. The total light transmittance was measured in accordance with “JIS K-7105” by using “NDH 5000 (available from Nippon Denshoku Industries)”. The transmittance and reflectance at an incidence angle of 5° were measured by using a spectroscope “U-4100 (available from Hitachi High Technologies)”, and the light absorption amount for each value at a wavelength of 550 nm was defined by the following equation (1). Light Absorption (%)=100(%)−(Transmittance (%)+Reflectance (%)) (1) In other words, the light which are neither reflected nor transmitted was regarded as being converted into (absorbed as) heat in the thin film and the substrate. In practice, although light absorption may appear to increase because of the substantial reduction in transmittance and reflectance due to scattering or the like, since the substrate used in the present disclosure is extremely small in absorption and has a smooth surface, the light absorption obtained by the above formula (1) can be substantially regarded as the absorption by the laminated films. In the present disclosure, it is preferable that the surface resistance should be as low as possible and the total light transmittance should be as high as possible. Generally-used ITO (Indium Tin composite Oxide) films usually have a total light transmittance of around 88% at a surface resistance of 100 Ω/square, though this depends on the film thickness of ITO. Therefore, in order to prove the superiority of the present disclosure, the resistance value is preferably 20 Ω/square or less and the total light transmittance is preferably 90% or more. TABLE 1first transparentsecond transparentmaterial layermetal layer (Ag)material layersurfacetotal lightlightthicknessthicknessthicknessresistancetransmittanceabsorptionmaterial(nm)material(nm)material(nm)(Ω/square)(%)(%)Ex. 1Nb2O546Ag9Zn—Sn—O50991.44Ex. 2Nb2O549Ag8Zn—Sn—O521191.14Ex. 3Nb2O552Ag7Zn—Sn—O531490.05Ex. 4Nb2O543Ag10Zn—Sn—O49890.55Ex. 5Nb2O540Ag11Zn—Sn—O47790.46Ex. 6Nb2O538Ag12Zn—Sn—O46690.18Ex. 7TiO239Ag10Zn—Sn—O52890.25Ex. 8ZrO271Ag7Zn—Sn—O421491.34Ex. 9HfO262Ag7Zn—Sn—O471491.54Ex. 10TaO558Ag7Zn—Sn—O501491.54Ex. 11WO363Ag7Zn—Sn—O471491.45Ex. 12MoO365Ag7Zn—Sn—O481491.45Ex. 13Nb2O551Ag7ZnO531491.44Ex. 14Nb2O553Ag7In—Zn—O511491.04Ex. 15Nb2O547Ag7Al—Zn—O581491.64Comp. 1ZnO64Ag7Zn—Sn—O461886.210Comp. 2Zn—Sn—O77Ag7Nb2O5353887.38Comp. 3Nb2O555Ag6Zn—Sn—O5412080.315Comp. 4Nb2O555Ag7Nb2O5423989.37Comp. 5ZnO64Ag7ZnO461980.514Comp. 6ZnO66Ag7In—Zn—O441687.09Comp. 7ZnO58Ag7Al—Zn—O511787.59Comp. 8ZnO74Ag8TiO2311583.512 Examples 1 to 6 As is clear from Table 1, the samples of Examples 1 to 6 exhibit the surface resistance of 30 Ω/square or less, and the total light transmittance of 90% or more. In addition, although the light absorption slightly increases with the increase in the film thickness of silver, it does not significantly affect the total light transmittance, and the present technology contributes to suppress the cause of light absorption as disclosed. Examples 7 to 12 In comparison with Examples 1 to 6, Examples 7 to 12 shows the properties in the cases in which the first transparent material layer is replaced. As is clear from Table 1, the samples of Examples 7 to 12 exhibit the surface resistance of 30 Ω/square or less and the total light transmittance of 90% or more. In other words, it is understood that, for the effect shown in the present disclosure, the first transparent material layer is not limited to niobium oxide, and the first transparent material layer may be formed with another metal oxide containing no zinc, such as titanium oxide, zirconium oxide, hafnium oxide, tantalum pentoxide, tungsten oxide, and molybdenum oxide, among others. Examples 13 to 15 Examples 1 to 12 in the present disclosure employs a single film of tin composite oxide having a relatively low resistance value as the second transparent material layer, but the present invention is not limited thereto. In compared with Examples 1 to 6, Examples 13 to 15 shows the properties in the cases in which the second transparent material layer is replaced. As is clear from Table 1, the samples of Examples 13 to 15 exhibit the surface resistance of 30 Ω/square or less and the total light transmittance is 90% or more. In other words, it is understood that the second transparent material layer is not limited to zinc-tin composite oxide, and a transparent conductor containing zinc can exhibits the same effect. Comparative Example 1 Comparative Example 1 uses zinc oxide as the first transparent material layer. As shown in Table 1, in the sample of Comparative Example 1, the total light transmittance is greatly deteriorated in comparison with Example 3 having the same silver film thickness, and the light absorption is also increased, indicating that using zinc oxide as the first transparent material layer will increase the absorption. Comparative Example 2 In Comparative Example 2, contrary to the structure shown in Examples 1 to 6, zinc-tin composite oxide was used for the first transparent material layer and niobium oxide was used for the second transparent material layer. As shown in Table 1, the sample of Comparative Example 2 has a lower total light transmittance and an increased light absorption as compared with Example 3 having the same silver film thickness. This implies that the mechanism causing the absorption at the interface between the first transparent material layer and the metal layer (silver) and the mechanism causing the absorption at the interface between the metal layer (silver) and the second transparent material layer are different. Comparative Example 3 In Comparative Example 3, the structure was the same as in Examples 1 to 6, and the thickness of the metal layer (silver) was changed to be 6 nm. As shown in Table 1, in the sample of Comparative Example 3, reducing the thickness of the metal layer (silver) degraded the effect of the present disclosure since the continuity of the silver thin film could not be maintained, resulting in formation of an island-like structure in the film, so that the surface resistance rapidly increased and the amount of light absorption significantly increased. Comparative Example 4 In Comparative Example 4, both the first transparent material and the second transparent material were composed of niobium oxide. As shown in Table 1, in the sample of Comparative Example 4, the total light transmittance is degraded in comparison with Example 3 having the same silver film thickness, indicating that using a material containing zinc as the second transparent material will suppress light absorption. In addition, the surface resistance of the niobium oxide also increased because of its low conductivity. Comparative Examples 5 to 8 In Comparative Examples 5 to 8, zinc oxide was used as the first transparent material layer. As shown in Table 1, the samples of Comparative Examples 5 to 8 exhibits a low total light transmittance, indicating that the total light transmittance could not be improved even if a material other than the zinc-tin composite oxide is used for the second transparent material layer, and that, when the first transparent material is a zinc-containing oxide, a highly transparent film could not be obtained even if the second transparent material is replaced with any material. As described above, the effects of the present invention could be verified from the results of the examples and the comparative examples. The present invention is not limited to the examples described above. It is obvious that a person having ordinary knowledge in the field of the art to which the present invention belongs can conceive of various alterations or modifications within the scope of the technical idea described in the claims, and it is understood that these also fall naturally within the technical scope of the present invention. REFERENCE SIGNS LIST 1conductive laminate,2transparent substrate,3first transparent material layer,4metal layer,5second transparent material layer,10base film,11unwinding roll,12winding roll,21first can roll,22second can roll,31optical monitor,32optical monitor, SP sputtering chamber | 41,252 |
11862362 | DETAILED DESCRIPTION The inventive concept will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplifying embodiments are shown. The inventive concept may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided by way of example so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Like numbers refer to like elements throughout the description. FIG.1shows a cross-sectional view of an example of a multi-phase submarine power cable1. The multi-phase submarine power cable1according to the present example is a three-phase submarine power cable. The multi-phase submarine power cable could alternatively be configured for more than three phases. The multi-phase submarine power cable1comprises a plurality of power cores3,5,7. In the present example, the number of power cores is equal to three. Each power core3,5,7is configured to carry a current of a respective electric phase. The power cores3,5and7are arranged in a stranded configuration. The power cores3,5,7are stranded. The power cores3,5and7have a lay direction and a core stranding pitch. Each power core3,5,7comprises a respective conductor3a,5a,7a. Each power core3,5,7comprises an insulation system3b,5b,7barranged around the respective conductor3a,5a,7a. Each insulation system3b,5b,7bmay comprise an inner semiconductive layer3c,5c,7c. The inner semiconductive layer3c,5c,7cis a conductor screen. The inner semiconductive layer3c,5c,7cis arranged around the respective conductor3a,5a,7a. Each insulation system3b,5b,7bmay comprise an insulation layer3d,5d,7d. The insulation layer3d,5d,7dis arranged around the respective inner semiconductive layer3c,5c,7c. Each insulation layer3d,5d,7dmay for example comprise cross-linked polyethylene (XLPE), impregnated paper tapes, or polypropylene. Each insulation system3b,5b,7bmay comprise an outer semiconductive layer3e,5e,7e. The outer semiconductive layer3e,5e,7eis an insulation screen. The outer semiconductive layer3e,5e,7eis arranged around the respective insulation layer3d,5d,7d. Each power core3,5,7may comprise a water barrier3f,5f,7f. Each water barrier3f,5f,7fmay be arranged around the respective outer semiconductive layer3e,5e,7e. Each water barrier3,5e,7emay for example comprise a metallic sheath. Each metallic sheath may for example comprise copper, stainless steel, aluminium or lead. Each metallic sheath may for example be one or more metal sheets that is/are folded around the respective insulation system3b,5b,7band longitudinally welded along the length of the multi-phase submarine power cable1. The water barriers3f,5f,7fmay be corrugated in the axial direction in case the multi-phase submarine power cable1is a dynamic submarine power cable. The water barriers3f,5f,7fmay be smooth in case the multi-phase submarine power cable1is a static multi-phase submarine power cable. The multi-phase submarine power cable1may comprise a plurality of elongated armour wires9forming an armour layer that surrounds the stranded power cores3,5,7. The armour wires9may be arranged helically outside the stranded power cores3,5,7in the axial direction of the multi-phase submarine power cable1. The multi-phase submarine power cable1may comprise filler profiles11a-11c. The filler profiles11a-11care arranged between adjacent power cores3,5,7radially inside the armour layer. The filler profiles11a-11care stranded together with the power cores3,5,7. The multi-phase submarine power cable1comprises a curvature sensor15. The curvature sensor15is configured to detect curvature variations and bending of the multi-phase submarine power cable15. The curvature sensor15comprises an elastic elongated member15aand a plurality of FBG fibres15bextending axially along the elongated member15a. The elongated member15amay have an elasticity such that it is able to bend as in much as the allowed bending of the multi-phase submarine power cable without plastic deformation. The elongated member15amay comprise or consist of a composite material. The composite material may for example be fibreglass. The elongated member15amay according to other variations comprise a thermoplastic polymer. The thermoplastic polymer may for example be a high-density polyethylene (HDPE) or polypropylene. The elongated member15amay have a bending stiffness, El, of at least 0.3 Nm2. The elongated member15amay for example have a bending stiffness of at least 1 Nm2, such as at least 1.5 Nm2, such as at least 2 Nm2, such as at least 2.5 Nm2, such as at least 3 Nm2. The elongated member15amay be a rod or a tube. The elongated member15amay have a circular cross-section. The elongated member15ais arranged between the stranded power cores3,5and7. The elongated member15ais arranged along the central axis of the multi-phase submarine power cable1. The elongated member15ais arranged in an interstice between the stranded power cores3,5,7at the centre of the multi-phase submarine power cable1. The curvature sensor15is arranged between the stranded power cores3,5,7. The FBG fibres15bare spaced apart from each other. The FBG fibres15bare arranged offset from the centre of the elongated member15a. The FBG fibres15bare arranged at a radial distance from the centre of the elongated member15a. The FBG fibres15bmay comprise gratings distributed along the length of the FBG fibres15b. The gratings of different FBG fibres15bmay be axially aligned or essentially axially aligned. The curvature in different axial planes may thereby be determined in the same axial measurement points or regions. FIG.2shows a cross-section of an example of the curvature sensor15. In this example, the elongated member15ahas a plurality of channels15cprovided in the outer surface15dof the elongated member15a. The channels15care recesses in the outer surface15d. The channels15cextend axially along the elongated member15a. The channels15cmay be straight channels. Each FBG fibre15bis arranged in a respective channel15c. The channels15care distributed in the circumferential direction of the elongated member15a. The channels15cmay be evenly distributed in the circumferential direction of the elongated member15a. In the present example, the curvature sensor15comprises three FBG fibres15b. The FBG fibres15bare arranged in a respective channel15c, which are arranged at an angle α of 120° from each other. The FBG fibres15bare arranged fixed in the respective channel15c. The FBG fibres15bmay for example be fixed in the channels15cby means of an adhesive. The radial distance r from the centre16of the elongated member15ato the FBG fibres15bmay be the same for each FBG fibre15b, or alternatively the radial distances r may differ. The radial distance r may be from the centre of the elongated member15ato the centre of the FBG fibres15b. The channels could instead of being provided in the outer surface be arranged in the interior of the elongated member. The elongated member may according to one example be provided with an outer protective layer. The protective layer may for example comprise a polymer sheath such as a sheath comprising polyethylene or polypropylene, or a metal sheath. The protective layer is configured to protect the FBG fibres and/or keep the FBG fibres in place in the channels. FIG.3shows a perspective view of the curvature sensor15. The curvature sensor15is provided with the FBG fibres15bextending axially along the elongated member15afor a monitored length L1that corresponds to the monitored region of the multi-phase submarine power cable1where curvature variations are to be monitored. The length of axial extension of the FBG fibres15bdefine the monitored length L1. The elongated member15amay extend along the central axis of the multi-phase submarine power cable1from the monitored region all the way out through an open end of the multi-phase submarine power cable1. The elongated member15ais provided with the FBG fibres15balong the entire monitored length L1and with optical fibres15b′ without Bragg gratings spliced with a respective one of the FBG fibres15bfor a non-monitored length L2. The non-monitored length L2is a non-monitored region of the multi-phase submarine power cable1. The total length of the elongated member15amay be the sum of the monitored length L1and the non-monitored length L2. The optical fibres15b′ extend from an open end of the multi-phase submarine power cable1. As an example, the monitored length L1may be 1-10 m, and the non-monitored length L2may be 1-50 m. FIG.4schematically shows a system18comprising the multi-phase submarine power cable1and a monitoring system19. The optical fibres15b′ are connected to the monitoring system19. The monitoring system19is configured to emit electromagnetic waves, e.g. infrared, visible or ultraviolet light into the optical fibres15b′. The monitoring system19is configured to detect electromagnetic waves reflected by the FBG fibres15bin the optical fibres15b′. The monitoring system19is configured to determine the curvature distribution at discrete locations along the elongated member15based on the reflected electromagnetic waves. The discrete locations correspond to the locations of the gratings of the FBG fibres15b. The monitoring system19is configured to determine the curvature radius of the elongated member15aat the discrete locations based on the elongation of the FBG fibres15b. The elongation that the gratings in the FBG fibres15bare subjected to can be calculated based on the reflected electromagnetic waves used in the measurement. The monitoring system19is configured to determine the curvature of the elongated member15at the location of the gratings and thus of the multi-phase submarine power cable1along the monitored length L1, in different axial planes, based on the strain in the FBG fibres15band the radial distance r from the centre C of the elongated member15ato the FBG fibres15b. The curvature of the elongated member is determined by the curvature of the multi-phase submarine power cable1. The variations in curvature of the multi-phase submarine power cable1can thereby be determined over the length of the monitored length L1. The monitoring system19may be configured to compare the curvature with those of a model of the multi-phase submarine power cable1to determine whether the curvature values are within acceptable limits. According to one example, the monitoring system19may comprise an electromagnetic wave transmitting and detecting device and a processing device. The electromagnetic wave transmitting and detecting device and the processing device may be the same device, i.e. arranged in the same housing, or they may be different devices. For example, the electromagnetic wave transmitting and detecting device may be connected by wire or wirelessly to the processing device. The processing device may be configured to process the measurements from the FBG fibres detected by the electromagnetic wave transmitting and detecting device, to determine the curvature distribution at discrete locations along the elongated member15a, as will be explained in the following. According to one example the monitoring system19may be configured to determine strain ranges based on the curvatures. The monitoring system19may use a mathematical model of the multi-phase submarine power cable1to determine the strain or stress ranges in the internal cable components. The mathematical model may provide strain ranges in the most fatigue-sensitive component of the multi-phase submarine power cable. This component may for example be the water barrier and/or the conductor. The monitoring system19may be configured to determine the number of occurrences of each strain or stress range. This can be performed for example by using the rain flow counting method. The monitoring system19may be configured to determine the number of cycles to failure of the most fatigue-sensitive component for each strain or stress range. The number of cycles to failure for the strain or stress ranges can for example be determined using an S—N fatigue curve for the most fatigue-sensitive component such as the water barrier or the conductor. The monitoring system19may be configured to determine a fatigue damage of the multi-phase submarine power cable1based on the number of occurrences of each strain or stress range and the number of cycles to failure for each of the strain ranges. The Palmgren-Miner linear damage hypothesis can be used to determine the fatigue damage. The monitoring system19may be configured to repeat the steps above as new curvature variations are detected by changes in the detected electromagnetic waves. The fatigue damage of the current iteration is added to the fatigue damage of the previous iteration. An accumulated fatigue damage is thus obtained. In this way, real-time monitoring of the fatigue damage of the multi-phase submarine power cable1may be performed. FIG.5is a flowchart of a method of preparing the multi-phase submarine power cable1for operation. In a step a) the multi-phase submarine power cable1is provided. The curvature sensor15is at this time not installed in the multi-phase submarine power cable1. In a step b) the curvature sensor15is provided. In a step c) the curvature sensor15is installed in the multi-phase submarine power in cable1by pushing the curvature sensor15into the multi-phase submarine power cable1. The multi-phase submarine power cable1has an open end through which the curvature sensor15is inserted into the multi-phase submarine power cable1. The curvature sensor15is pushed in between the stranded power cores3,5,7. The curvature sensor15is pushed so far into the multi-phase submarine power cable1that the monitoring length L1provided with the FBG fibres15breaches and aligns with the monitoring region of the multi-phase submarine power cable1. The curvature sensor15may be pushed into the multi-phase submarine power cable1through its open end after the multi-phase submarine power cable1has been attached to a hang-off on an offshore platform. In particular, an end portion of the multi-phase submarine power cable1is attached to the hang-off. The curvature sensor15may be pushed to a section of the multi-phase submarine power cable1arranged in a bend restricting device. For example, the entire monitored length L1of the elongated member15amay be arranged in the bend restricting device. FIG.6schematically shows an offshore platform21. In this example, the offshore platform21is a floating platform but could alternatively be a stationary platform. The multi-phase submarine power cable1is in this example a dynamic multi-phase submarine power cable1. The multi-phase submarine power cable1is fixed to the offshore platform21by means of a hang-off23. The multi-phase submarine power cable1is suspended into the sea27from the hang-off23. The installation includes a bend restricting device25provided on the multi-phase submarine power cable1. The bend restricting device25may be provide around the multi-phase submarine power cable1as the multi-phase submarine power cable1exits a rigid structure such as a tube29. The bend restricting device25may for example be a bend stiffener, as shown in the example, or a bellmouth. The curvature sensor15and in particular the monitoring length L1thereof, with the FBG fibres15bis arranged in the bend restricting device25. This is the region of the multi-phase submarine power cable1which is normally subjected to the highest fatigue stress. The inventive concept has mainly been described above with reference to a few examples. However, as is readily appreciated by a person skilled in the art, other embodiments than the ones disclosed above are equally possible within the scope of the inventive concept, as defined by the appended claims. | 15,974 |
11862363 | DETAILED DESCRIPTION Exemplary embodiments and their advantages are best understood by reference toFIGS.1-4, wherein like numbers are used to indicate like and corresponding parts unless expressly indicated otherwise. In the following description, details are set forth by way of example to facilitate discussion of the disclosed subject matter. It should be apparent to a person of ordinary skill in the field, however, that the disclosed embodiments are exemplary and not exhaustive of all possible embodiments. Throughout this disclosure, a hyphenated form of a reference numeral refers to a specific instance of an element and the un-hyphenated form of the reference numeral refers to the element generically. Thus, for example, “device12-1” refers to an instance of a device class, which may be referred to collectively as “devices12” and any one of which may be referred to generically as “a device12”. Referring now to the drawings,FIG.1illustrates a perspective view of a magnetized cable assembly100including an elongated and flexible magnetized cable101including one or more bare or insulated electrically conductive wires (not visible inFIG.1) connected to electrical connectors120at either end of magnetized cable101. Magnetized cable101incorporates magnetic particles that have been magnetized to produce a persistent magnetic field in which some surface regions of magnetized cable101lie within a north pole region of the magnetic field and other surface regions of magnetized cable101lie within a south pole region of the magnetic field. In at least some embodiments, an orientation and strength of the persistent magnetic field, in combination with the geometry and dimensions of magnetized cable101, enable efficient storage and handling of magnetized cable101by facilitating a coiling of magnetized cable101from an extended or uncoiled state and, when magnetized cable101is coiled, maintaining magnetized cable101in the coiled state while also permitting easy manually uncoiling of magnetized cable101from the coiled state. Embodiments of magnetized cable101may have a rectangular or substantially rectangular cross section including an opposing pair of substantially planar and parallel major surfaces and a pair of substantially planar and parallel minor surfaces. In these rectangular embodiments, the persistent magnetic field may be oriented to produce a north pole region encompassing one of the major surfaces and a south pole region encompassing the other major surface. Those of ordinary skill in the field will appreciate that, in such embodiments, magnetized cable101features a north pole surface and a south pole surface that come in contact with each other when the cable is coiled or otherwise wound on itself, e.g., prior to storing magnetized cable101when not in use. Those of ordinary skill will further appreciate that magnetized cable101is not limited to rectangular configurations and that the storage and handling benefits of magnetized cable101may be realized in other configurations including, without limitation, circular and other elliptical cross section configurations. FIG.2andFIG.3illustrate cross sections for an unsheathed (FIG.2) AND sheathed (FIG.3) implementations of magnetized cable101. The unsheathed implementation of magnetized cable101depicted inFIG.2includes an elongated and flexible magnetic member, referred to herein simply as elongated flexible magnetized component (EFMC)201, encompassing one or more electrically conductive wires203. AlthoughFIG.2depicts a magnetized cable101featuring three wires (203-1,203-2, and203-2), other implementations may employ fewer or more wires203. EFMC201may comprise any suitable combination of flexible base material and magnetized particles distributed randomly or otherwise upon or within the base material. The base material may be implemented with any of various natural or synthetic polymers exhibiting suitable flexibility. In at least some embodiments, the base material is or includes a pliable natural or synthetic rubber, silicon, silicon-rubber, or chlorinated polyethylene material exhibiting sufficient flexibility and other desirable characteristics including, without limitation, low electrical and thermal conductivity, high thermal and chemical stability, and low toxicity. The base material may be produced by any suitable manufacturing process including extrusion processes, compression molding processes, etc. The magnetized particles may comprise magnetic particles that have been subjected to a magnetic field sufficiently strong to align the magnetic orientation of the magnetic particles. The source material may be ground or otherwise processed to produce a magnetic powder that can be easily incorporated within the base material. The unsheathed magnetized cable101depicted inFIG.2features a rectangular or substantially rectangular cross section, with optional rounded or beveled corners, defining substantially planar and parallel opposing major surfaces202-1and202-2. The illustrated magnetized cable101includes three wires203-1,203-2, and,203-3embedded in EFMC201. Each wire203depicted inFIG.2includes an electrically conductive core205enclosed within an optional insulating coating204. In at least one embodiment, electrically conductive cores205are implemented with tinned copper and insulating coating204is implemented with highly flexible PVC. Other implementations may use different materials for conductive cores205and insulating coating204. The wires203Illustrated inFIG.2include two wires205-1and205-3with a larger diameter or smaller gage and a third wire205-2with a smaller diameter or larger gage. Again, however, the number of wires203included in magnetized cable101and the diameters of each wire203is a design choice that may vary from one implementation to the next. Wires203may be incorporated within EFMC201while EFMC201is being formed. For example, magnetized cable may be fabricated by an extrusion process in which one or more wires203are fed through an extrusion tool as EFMC201is extruded around them. Other embodiments may incorporate wires203within EFMC201after EFMC201is formed. FIG.2further illustrates a magnetic field indicator220to convey an orientation of a persistent magnetic field produced by magnetized cable101. The magnetic field indicator220ofFIG.2indicates that a “north” surface of magnetized cable101, i.e., first major surface202-1, lies within a northern pole region of the magnetic field while a “south” surface of magnetized cable101, i.e., second major surface202-2, lies within a southern pole region of the persistent magnetic field. In the depicted configuration, it will readily appreciated that, when magnetized cable101as coiled upon itself, whether for storage or otherwise, portions of first major surface202-1within one loop of the coiled cable will come into close proximity with portions of second major surface202-2in the next adjacent loop of the coiled cable and that the persistent magnetic field will provide a magnetic force of attraction between the opposing major surfaces that actively assists in the coiling process as the cable magnetically “snaps” onto itself. In at least some embodiments, a strength of the persistent magnetic field will be sufficient to maintain the opposing major surfaces of magnetized cable101in contact with one another after the person or device coiling the cable releases the cable. Some embodiments implement a Halbach array configuration in which the polarity of the magnetic field alternates, e.g., N—S—N—S, to increase the magnetic flux on one side of a magnetic assembly. The sheathed magnetized cable101depicted inFIG.3, like the unsheathed magnetized cable101depicted inFIG.2, includes an EFMC201and a set of three wires203-1,203-2, and203-3. Unlike the magnetized cable101ofFIG.2, however, the magnetized cable101ofFIG.3includes a sheath210surrounding and enclosing EFMC201and wires203. In addition, whereas the wires203depicted inFIG.2are embedded within EFMC201, the wires203depicted inFIG.3are not embedded within EFMC201. Instead, the wires203ofFIG.3are positioned within voids207defined between EFMC201and the surrounding sheath210. The EFMC201ofFIG.3occupies a substantial majority of the cavity defined by the interior of sheath210and the voids207are not so large as to leave appreciable distance between sidewalls of wires203and sheath210or EFMC201. Instead the voids are sized to closely retain wires203within close proximity to adjacent portions of sheath210and EFMC201. In at least one embodiment, sheath210is comprised of a braided fabric nylon, but other suitable materials may be used. In at least one additional embodiment, sheath210is comprised of an extruded polymer. Like the magnetized cable101ofFIG.2, the sheathed magnetized cable101depicted inFIG.3includes a persistent magnetic field represented by magnetic field indicator220. The magnetized cable201illustrated inFIG.3has an oval cross section that defines substantially planar and parallel first and second major surfaces202-1and202-2and the persistent magnetic field conveyed by indicator220places first major surface202-1in a northern pole region of the persistent magnetic and second major filed202-2in a southern pole region of the persistent magnetic field. This configuration again, as it did with the configuration illustrated inFIG.2, facilitates efficient handling and storage of magnetized cable101by providing a magnetic field that actively assists in the coiling process and, after the cable is coiled, maintaining magnetized cable101in the coiled position. Because wires203are not embedded in EFMC201, EFMC201can be fabricated independently of wires203. Referring now toFIG.4, a flow diagram illustrates an exemplary method400of producing magnetized cable101. While the flow diagram implies an order or sequence of the depicted operations, the diagram is not intended to be so limiting and, unless an order of two or more operations is expressly disclosed, operations of method400may occur in a different sequence where appropriate. The illustrated method400includes grinding and/or otherwise processing (operation402) a source of magnetic material to produce a magnetic powder containing magnetic particles. The source of the magnetic material may include scrap, recycled, waste, or otherwise previously used magnetic material. The method400illustrated inFIG.4furthers include forming (operation404) an flexible elongated component by combining the magnetic particles and an EFMC base material. The EFMC base material may include a rubber, silicon, silicon-rubber, or another suitable material. The EFMC base material may be extruded, molded, or otherwise formed into the elongated flexible component and the magnetic particles may be combined with the base material either during or after the formation process to produce a random or non-random distribution of magnetic particles within the flexible elongated component. After the formation process, the flexible elongated component may be exposed (operation406) to a magnetic field of sufficient strength and for a sufficient duration to align or substantially align the magnetic orientation of all or substantially all of the magnetic particles to establish a persistent magnetic field within the flexible elongate and thereby transform the combination of the flexible elongated component and the magnetic particles into an elongated flexible permanent magnet referred to herein as the EFMC. As depicted inFIG.4, method400may further include incorporating (operation410) one or more bare or insulated electrically conductive wires in or about the EFMC. In some embodiments, the EFMC may be formed to include one or more elongated grooves suitable for receiving or engaging the one or more wires. In these embodiments, the one or more wires may be incorporated after the EFMC has been formed. In other embodiments, the one or more wires may be present when the EFMC is formed such that the EFMC is formed around and enclosing the one or more wires. The method400illustrated inFIG.4further includes an optional operation for enclosing (operation412) the EFMC and the one or more wires within a suitable sheath. In other embodiments, magnetized cable may be produced by providing a flexible magnet, comprising a polymer with magnetic material, in tube form. The flexible magnetic tube may be positioned around and/or adjacent to the one or more insulated or bare metal, electrically conductive wires before securing the one or more wires and the magnetic tube via heat shrinking, adhesive bonding, or another suitable method. In some embodiments, a flexible magnet may be supplied in tape form. The tape may be fastened to the length of the cable by means of heat shrinking, adhesive bonding, or other method. In some embodiments, one or more magnetic wires may be added in parallel to the existing conductors in a cable. In another embodiment, magnetic wires may be used to replace existing conductors in a cable. In some embodiments, a magnetic sheath may be be added around an existing non-magnetized cable. In another embodiment, discrete (individual) magnetic beads or shapes may be arrayed along the length of the cable. In some embodiments, magnetic flux concentrators may be used. Magnetic flux concentrators are pieces of ferrous material that can be used to direct or intensify magnetic flux in a particular direction. In embodiments featuring a rectangular cross section cable, (e.g., the magnetized cable101ofFIG.1), the flat faces of the cable allow more surface area (and therefore greater magnetic force) between cable loops. In some embodiments, additional magnetization may be added to the connectors at either end of the magnetized cable. Connectors are typically larger in cross section than the cables between them, allowing greater volume for more magnetic material and stronger magnetization. Strong magnetic attraction at the end of the cables can provide tactile and/or audible feedback to the user that the cable has been securely coiled. This disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Similarly, where appropriate, the appended claims encompass all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Moreover, reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, or component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative. All examples and conditional language recited herein are intended for pedagogical objects to aid the reader in understanding the disclosure and the concepts contributed by the inventor to furthering the art, and are construed as being without limitation to such specifically recited examples and conditions. Although embodiments of the present disclosure have been described in detail, it should be understood that various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the disclosure. | 15,537 |
11862364 | DETAILED DESCRIPTION Overview Energy and a control signal may be provided using a coupled power and control cable. The coupled power and control cable may comprise a power cable, a control cable, and an overall jacket. The power cable may be connected between a switch and a fixture and may provide energy to the fixture from the switch. The control cable may be connected between the control circuit and the fixture and may provide the control signal to the fixture from the control circuit. The power cable and the control cable may be disposed beneath the overall jacket. Both the foregoing overview and the following example embodiments are examples and explanatory only, and should not be considered to restrict the disclosure's scope, as described and claimed. Further, features and/or variations may be provided in addition to those set forth herein. For example, embodiments of the disclosure may be directed to various feature combinations and sub-combinations described in the example embodiments. Example Embodiments The following detailed description refers to the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the following description to refer to the same or similar elements. While embodiments of the disclosure may be described, modifications, adaptations, and other implementations are possible. For example, substitutions, additions, or modifications may be made to the elements illustrated in the drawings, and the methods described herein may be modified by substituting, reordering, or adding stages to the disclosed methods. Accordingly, the following detailed description does not limit the disclosure. Instead, the proper scope of the disclosure is defined by the appended claims. FIG.1shows an operating environment100for a coupled cable. As shown inFIG.1, operating environment100may include a system105for providing energy and a control signal using a coupled power and control cable. Operating environment100may comprise, but is not limited to, a home, a business, a commercial space, an industrial space, or any similar area. Operating environment100may comprise an electrical panel110fed by a transformer115. Electrical panel110may include circuit breakers used to feed circuits out of electrical panel110. Once such circuit may be used to feed system105. Transformer115may be operated by an electric utility entity and may step voltage down from a level used by the electric utility entity to a level usable by operating environment100. System105may comprise a fixture120connected to a control device125via a coupled cable130. Control device125may comprise a switch135and a control circuit140. Electrical energy may be fed to control device125from panel110. Fixture120may comprise any type device that consumes energy and can be controlled. For example, fixture120may comprise, but is not limited to, a light such as a Light Emitting Diode (LED) light or a florescent light. Switch135may be configured to interrupt the supply of electrical energy to fixture120. For example, when switch135is closed, electrical energy may be supplied to control device125and fixture120from electrical panel110. However, when switch135is open, the electrical energy supplied to control device125and fixture120from electrical panel110may be interrupted. Control circuit140may comprise any device used to control fixture120. For example, when fixture120comprises a light such as an LED light, control circuit140may comprise, but is not limited to, a dimmer for the LED light. The dimmer may comprise, for example, a potentiometer and may be configured to supply a control signal that may comprise a voltage signal between 0V and 10V. As the voltage of the control signal from control circuit140changes (e.g., increases), the LED light may supply a corresponding change (e.g., higher light intensity) in response. FIGS.2A,2B, and2Cshow coupled cable130in more detail. As shown inFIG.2A, coupled cable130may comprise a power cable205, a control cable210, and an overall jacket215. Overall jacket215may comprise complementary valleys220, a connector portion225, and a stripe230. As shown inFIG.2B, coupled cable130may have a first end235and a second end240. Power cable205may comprise a power cable jacket245, a power cable first conductor250, a power cable second conductor255, and a power cable ground wire260. Power cable205may comprise a non-metallic (NM) sheathed cable that maybe used, for example, for both exposed and concealed work in normally dry locations at temperatures not to exceed 90° C. (with ampacity limited to that for 60° C. conductors) as specified in the National Electrical Code (NEC). Power cable205may comprise a Class 1 remote-control and signaling circuit cable as defined by the NEC. Class 1 cables typically operate at 120V, but the NEC permits them to operate at up to 600V. Power cable first conductor250may comprise, but is not limited to, American Wire Gage (AWG) 12 Thermoplastic High Heat-resistant Nylon-coated (THHN) copper wire with black insulation. Power cable second conductor255may comprise, but is not limited to, AWG 12 THHN copper wire with white insulation. And power cable ground wire260may comprise, but is not limited to, an AWG 12 bare copper wire. Paper fillers may be placed inside power cable jacket245between power cable first conductor250, power cable second conductor255, and power cable ground wire260. The aforementioned wires are not limited to solid copper and may be stranded or may comprise any conductive metal or non-metal material. Control cable210may comprise a control cable jacket265, a control cable first conductor270, and a control cable second conductor275. Control cable210may not include a ground wire. Control cable first conductor270may comprise, but is not limited to, an AWG 16 TFN copper wire with grey insulation. Control cable second conductor275may comprise, but is not limited to, an AWG 16 TFN copper wire with purple insulation. The aforementioned wires are not limited to solid copper and may be stranded or may comprise any conductive metal or non-metal material. Control cable210may comprise a Class 1 remote-control and signaling circuit cable as defined by the NEC. Class 1 cables typically operate at 120V, but the NEC permits them to operate at up to 600V. Although control cable210may only be operated within Class 2 voltage and current level limits, control cable210may be insulated and otherwise comprise a Class 1 cable. For example, Class 2 circuits typically include wiring for low-energy (100VA or less), low-voltage (under 30V) loads such as low-voltage lighting, thermostats, PLCs, security systems, and limited-energy voice, intercom, sound, and public address systems. Class 2 circuits may protect against electrical fires by limiting the power to 100VA for circuits that operate at 30V or less, and 0.5VA for circuits between 30V and 150V. Electric shock may be protected against by limiting the current of the circuit to 5 mA or less for circuits between 30V and 150V. Overall jacket215may cover both power cable205and control cable210. As stated above, power cable205may comprise an NEC Class 1 cable. Because power cable205and control cable210are included under the same overall jacket215, control cable210may also comprise an NEC Class 1 cable even though control cable210may only be operated within NEC Class 2 voltage and current level limits. Coupled cable130may include power cable205and control cable210in a side-by-side configuration. For example, as shown inFIG.2A, an axis may pass through the conductors of both power cable205and control cable210. In addition, overall jacket215may comprise complementary valleys220and connector portion225that may aid in tearing power cable205and control cable210apart. For example, an operator may grasp power cable205with the fingers of one hand and grasp control cable210with the fingers of the other hand and pull the two apart along connector portion225. Stripe230may be included in overall jacket215to indicate (e.g., to an operator) which side of coupled cable130may comprise power cable205and which side may comprise control cable210. The example shown inFIG.2Ashows stripe230on control cable210side of coupled cable130, however it may be included on power cable205side of coupled cable130instead. Notwithstanding, an indicator may be used with embodiments of the disclosure to indicate which side of coupled cable130includes power cable205and which side includes control cable210. FIG.3is a flow chart setting forth the general stages involved in a method300consistent with embodiments of the disclosure for providing a coupled power and control cable system. Method300may be implemented using coupled cable130as described in more detail above with respect toFIG.1andFIGS.2A,2B, and2C. Ways to implement the stages of method300will be described in greater detail below. Method300may begin at starting block305and proceed to stage310where coupled cable130may be received by an operator. For example, as described above, coupled cable130may comprise overall jacket215beneath which power cable205and a control cable210are disposed. Overall jacket may comprise complementary valleys220and connector portion225disposed between power cable205and control cable210. Overall jacket may have a stripe on a portion of overall jacket215under which control cable210is disposed. Power cable205may be Class 1 and control cable210may be Class 1. Although control cable210may only be operated within Class 2 voltage and current level limits, control cable210may be insulated and otherwise comprise a Class 1 cable because overall jacket215may cover both power cable205and control cable210. From stage310, where coupled cable130is received by the operator, method300may advance to stage320where the operator may select, based upon stripe230on coupled cable130, control cable210from coupled cable130. Stripe230may be included in overall jacket215to indicate to the operator which side of coupled cable130may comprise power cable205and which side may comprise control cable210. The example shown inFIG.2Ashows stripe230on control cable210side of coupled cable130, however it may be included on power cable205side of coupled cable130instead. Notwithstanding, an indicator may be used with embodiments of the disclosure to indicate which side of coupled cable130includes power cable205and which side includes control cable210. Once the operator selects, based upon stripe230on coupled cable130, control cable210from coupled cable130in stage320, method300may continue to stage330where the operator may connect first end235of selected control cable210to control circuit140of control device125. For example, the operator may grasp power cable205with the fingers of one hand and grasp control cable210with the fingers of the other hand and pull the two apart along connector portion225for a small length of coupled cable130at first end235. The operator may then connect the separated power cable205at first end235to switch135and the separated control cable210at first end235to control circuit140. After the operator connects first end235of selected control cable210to control circuit140of control device125in stage330, method300may proceed to stage340where the operator may connect second end240of selected control cable210to fixture120. For example, the operator may grasp power cable205with the fingers of one hand and grasp control cable210with the fingers of the other hand and pull the two apart along connector portion225for a small length of coupled cable130at second end240. The operator may then connect the separated power cable205at second end240to fixture120and the separated control cable210at second end240to fixture120. Prior to connecting first end235of coupled cable130to control device125or connecting second end240of coupled cable130to fixture120, the operator may first pull coupled cable130in system105between fixture120and control device125. Because overall jacket215may cover both power cable205and control cable210, the cable pull is simplified because only one cable (i.e., coupled cable130) need be pulled between fixture120and control device125. With conventional systems, two cables rather than one would need to be pulled. Embodiments of the disclosure provide an improvement by simplifying this cable pull. Furthermore, because power cable205and control cable210are under the same overall jacket215, there may be no confusion to the operator as to which power cable corresponds to which control cable when multiple fixtures and multiple control devices are employed in system105because corresponding power cables and control cables are attached to one another. Once operator connects second end240of selected control cable210to fixture120in stage340, method300may then end at stage350. FIG.4is a flow chart setting forth the general stages involved in a method400consistent with embodiments of the disclosure for providing service using a coupled power and control cable system. Method400may be implemented using coupled cable130as described in more detail below with respect toFIG.1andFIGS.2A,2B, and2C. Ways to implement the stages of method400will be described in greater detail below. Method400may begin at starting block405and proceed to stage410where coupled cable130may be provided between fixture120and control device125. Control device125may comprise switch135and control circuit140. For example, electrical energy may be fed to control device125from panel110. From stage410, where coupled cable130may be provided between fixture120and control device125, method400may advance to stage420where energy may be provided to fixture120from switch135. For example, switch135maybe configured to interrupt the supply of electrical energy to fixture120. When switch135is closed, for example, energy may be supplied to control device125and fixture120from electrical panel110. However, when switch135is open, the energy supplied to control device125and fixture120from electrical panel110may be interrupted. After energy is provided to fixture120from switch135in stage420, method400may proceed to stage430where a control signal may be provided to fixture120from control circuit140. The control signal may comprise a voltage level between a first voltage value and a second voltage value. The voltage level may not exceed a maximum value corresponding to Class 2. For example, control circuit140may comprise any device used to control fixture120. When fixture120comprises an LED light, for example, control circuit140may comprise a dimmer for the LED light. The dimmer may comprise a potentiometer and may be configured to supply a control signal that may comprise a voltage signal between 0V (e.g., first voltage value) and 10V (second voltage value). As the voltage of the control signal increases, the LED light may supply a corresponding higher light intensity. Power cable205may be Class 1 and control cable210may be Class 1. Although control cable210may only be operated within Class 2 voltage and current level limits, control cable210may be insulated and otherwise comprise a Class 1 cable. Once control signal is provided to fixture120from control circuit140in stage430, method400may then end at stage440. FIGS.5A and5Bshow a coupled cable130similar to that shown inFIGS.2A,2B, and2C. As shown inFIG.5A, coupled cable130may include power cable205and control cable210in a side-by-side configuration. For example, as shown inFIG.5A, an axis may pass through the conductors of both power cable205and control cable210. In addition, overall jacket215may comprise complementary valleys220and connector portion225that may aid in tearing power cable205and control cable210apart. For example, an operator may grasp power cable205with the fingers of one hand and grasp control cable210with the fingers of the other hand and pull the two apart along connector portion225. FIG.5Bshows connector portion225in greater detail. As shown inFIG.5B, connector portion225may comprise a webbing disposed within overall jacket215. The webbing may comprise a webbing first portion505protruding from overall jacket215on the power cable205side of coupled cable130and a webbing second portion510protruding from overall jacket215on the control cable210side of coupled cable130. A first webbing valley515and an opposing second webbing valley520may be disposed between webbing first portion505and webbing second portion510. First webbing valley515and second webbing valley520may be “V” shaped. Notwithstanding, first webbing valley515and second webbing valley520may comprise any shape. As stated above, an operator may grasp power cable205with the fingers of one hand and grasp control cable210with the fingers of the other hand and pull (e.g., tear) the two apart along connector portion225. Connector portion225, comprising the webbing that may include first webbing valley515and opposing second webbing valley520, may aid in this pulling or tearing apart of connector portion225. For example, power cable205and control cable210may separate along the opposing first webbing valley515and second webbing valley520during the pulling and tearing process. Accordingly, the opposing first webbing valley515and second webbing valley520may facility in separating power cable205and control cable210. FIG.6shows a die600that may be used in making coupled cable130consistent with embodiments of the disclosure. As shown inFIG.6, die600may comprise a first section605, a second section610, and an intermediate section615. Intermediate section615may comprise tips620protruding into a gap in die600between first section605and second section610. Die600may be used in an extrusion process for manufacturing coupled cable130. During manufacturing, coupled cable130may pass through die600. Power cable205portion of coupled cable130may pass through first section605of die600and control cable210of coupled cable130may pass through second section610of die600. Intermediate section615of die600may be disposed between first section605and second section610and may form connector portion225comprising the webbing as described above with respect toFIG.5AandFIG.5Bduring manufacturing coupled cable130. Intermediate section615may include tips620that may form opposing first webbing valley515and second webbing valley520in connector portion225of coupled cable130. FIG.7shows coupled cable130similar to that shown inFIGS.2A,2B,2C,5A, and5B. As shown inFIG.7, coupled cable130may include power cable205and control cable210in a side-by-side configuration. In contrast with the embodiments ofFIGS.2A,2B,2C,5A, and5B, control cable210ofFIG.7may comprise optical fibers. For example, control cable210ofFIG.7may comprise a first fiber705having a first fiber jacket710. Similarly, control cable210ofFIG.7may comprise a second fiber715having a second fiber jacket720. First fiber jacket710and second fiber jacket720may, for example, may provide additional mechanical strength and protection to first fiber705and second fiber715respectively. As with the embodiments shown inFIG.5AandFIG.5B, overall jacket215ofFIG.7may comprise complementary valleys220and connector portion225that may aid in tearing power cable205and control cable210apart. For example, an operator may grasp power cable205with the fingers of one hand and grasp control cable210with the fingers of the other hand and pull the two apart along connector portion225. Connector portion225ofFIG.7may be similar to connector portion225shown inFIG.5Bas described above. Overall jacket215may cover both power cable205and control cable210. As stated above, power cable205may comprise an NEC Class 1 cable. The coupled cable130ofFIG.7may be used with the processes described above with respect toFIG.3andFIG.4. With the coupled cable130ofFIG.7, the control signal may be sent as an optical signal over control cable210. Furthermore, fixture120may comprise or further include a WiFi Access Point (AP). Control cable210ofFIG.7may be used to send and receive data signals to and from the AP. FIG.8shows coupled cable130similar to that shown inFIGS.2A,2B,2C,5A, and5B. As shown inFIG.8, coupled cable130may include power cable205and control cable210in a side-by-side configuration. In contrast with the embodiments ofFIGS.2A,2B,2C,5A, and5B, control cable210ofFIG.8may comprise a plurality of twisted pair. For example, control cable210ofFIG.8may comprise a partition805that may separate an interior of control cable210into a plurality of compartments. As shown inFIG.8, a first compartment may include a first twisted pair810and a second twisted pair815. Similarly, a second compartment may include a third twisted pair820and a fourth twisted pair825. WhileFIG.8shows four twisted pair, embodiments of the disclosure are not so limited and may include any number of twisted pair. Furthermore, embodiments of the disclosure may include any number of partitions and compartments. For example, embodiments of the disclosure may include four compartments where each of the plurality of twisted pair is included in a separate compartment. Furthermore, control cable210ofFIG.8may comprise a ripcord830. When installing coupled cable130, ripcord may be pulled in order to open the compartments and gain access to the plurality of twisted pair. Each of the conductors in the plurality of twisted pair may also include a color stripe that may be used to identify a particular twisted pair or individual conductors within a twisted pair. As with the embodiments shown inFIG.5AandFIG.5B, overall jacket215ofFIG.8may comprise complementary valleys220and connector portion225that may aid in tearing power cable205and control cable210apart. For example, an operator may grasp power cable205with the fingers of one hand and grasp control cable210with the fingers of the other hand and pull the two apart along connector portion225. Connector portion225ofFIG.8may be similar to connector portion225shown inFIG.5Bas described above. Overall jacket215may cover both power cable205and control cable210. As stated above, power cable205may comprise an NEC Class 1 cable. Because power cable205and control cable210are included under the same overall jacket215, control cable210may also comprise an NEC Class 1 cable even though control cable210may only be operated within NEC Class 2 voltage and current level limits. The coupled cable130ofFIG.8may be used with the processes described above with respect toFIG.3andFIG.4. With the coupled cable130ofFIG.8, the control signal may be sent as an electrical signal over one or more of the plurality of twisted pair of control cable210. Furthermore, fixture120may comprise or further include a WiFi Access Point (AP). Control cable210ofFIG.8may be used to send and receive data signals to and from the AP. The plurality of twisted pair of control cable210may provide Power-over-Ethernet (POE). As such, one or more of the plurality of twisted pair of control cable210may be used to provide both power and data to the AP. Embodiments of the present disclosure, for example, are described above with reference to block diagrams and/or operational illustrations of methods, systems, and computer program products according to embodiments of the disclosure. The functions/acts noted in the blocks may occur out of the order as shown in any flowchart. For example, two blocks shown in succession may in fact be executed substantially concurrently or the blocks may sometimes be executed in the reverse order, depending upon the functionality/acts involved. While the specification includes examples, the disclosure's scope is indicated by the following claims. Furthermore, while the specification has been described in language specific to structural features and/or methodological acts, the claims are not limited to the features or acts described above. Rather, the specific features and acts described above are disclosed as example for embodiments of the disclosure. | 23,949 |
11862365 | DETAILED DESCRIPTION Hereinafter, the present disclosure will be described with reference to the accompanying drawings. Shapes and sizes of elements in the drawings may be exaggerated or reduced for clarity of description. In the drawings, a first direction may be defined as a thickness (T) direction, a second direction may be defined as a length (L) direction, and a third direction may be defined as a width (W) direction. FIG.1is a perspective view of a resistor component according to an example. FIG.2is a cross-sectional view schematically illustratingFIG.1, taken along line I-I′. FIG.3is a cross-sectional view schematically illustrating an embodiment of a resistor component according to the present disclosure. FIG.4is a graph illustrating a resistance value and a temperature coefficient of resistivity, according to a ratio of an amount of nickel (Ni) in a resistive layer relative to a total amount of copper (Cu) and nickel (Ni). Referring toFIGS.1to4, a resistor component1000according to an example may include a substrate100having a first surface and a second surface, opposing each other; an external electrodes300and400disposed outside of the substrate100; a resistive layer200disposed on the first surface of the substrate100, connected to the external electrode300or400, including an alloy of a first metal and a second metal; and a first protective layer G1disposed on the resistive layer200and including any one of the first and second metals. As described above, during a sintering process, a first metal or a second metal included in external electrodes (e.g.,300and400) may diffuse into a resistive layer (e.g.,200) to increase an absolute value of a temperature coefficient of resistivity (TCR). Therefore, there is a problem in that reliability of a resistor component (e.g.,1000) may be deteriorated. In addition, there is a problem in that rated power of the resistor component (e.g.,1000) may be lowered because glass or the like included in a conventional protective layer may have lower heat dissipation than metal. In a resistor component1000according to an example, any one of the first metal and the second metal included in the first protective layer G1may diffuse into the resistive layer200during a sintering process. Therefore, the resistor component1000having a low absolute value of a temperature coefficient of resistivity (TCR) and excellent heat dissipation characteristics and rated power may be provided. Hereinafter, each configuration included in a resistor component1000according to an example will be described in more detail. The substrate100may be provided as a plate shape having a predetermined thickness, and may have first and second surfaces S1and S2opposing each other in the first direction. The substrate100may include a material capable of efficiently dissipating heat generated in the resistive layer200to be described later. The substrate100may include a ceramic insulating material such as alumina (Al2O3), but the present disclosure is not limited thereto, and may include a polymer material. For example, the substrate100may be an alumina substrate obtained by anodizing a surface of aluminum, but the present disclosure is not limited thereto, and may be a sintered alumina substrate. The resistive layer200may be disposed on one surface of the substrate100, for example, the first surface S1of the substrate100, and may be connected to the external electrodes300and400. The resistive layer200may include at least one of the first metal or the second metal, an alloy of the first and second metals, or a metal oxide. For example, the resistive layer200may include at least one of an Ag—Pd alloy, a Cu—Ni alloy, a Ni—Cr-based alloy, Ru oxide, Si oxide, or an Mn-based alloy, and may include more preferably a Cu—Ni alloy, an alloy of copper (Cu) as the first metal and nickel (Ni)as the second metal. An amount of the second metal in the resistive layer200may be 20 to 60 moles, based on 100 moles of a total amount of the first metal and the second metal. Taking the aforementioned Cu—Ni alloy as an example, when an amount of nickel (Ni) is 20 to 60 moles, based on 100 moles of the total amount of copper (Cu) and nickel (Ni), as illustrated inFIG.4, an absolute value of a temperature coefficient of resistivity (TCR) may be close to 0, to decrease a resistance value change rate of the resistor component1000and improve reliability thereof. When an amount of nickel (Ni) is not within the defined ranges, an absolute value of a temperature coefficient of resistivity (TCR) may increase to deteriorate reliability of the resistor component1000. As will be described later, the amount of the second metal in the resistive layer200may be controlled by the second metal diffused from the first protective layer G1. In this case, measurement of the amount of the second metal included in the resistive layer200may be, for example, carried out by scanning cross-sections of the resistive layer200in the first and second directions using a scanning electron microscope (SEM), and analyzing the same with energy dispersive spectroscopy (EDS). The resistive layer200may be formed by a thick film process. For example, the resistive layer200may be formed by applying a paste for forming a resistive layer including an alloy of the first and second metals on the first surface S1of the substrate100using a process such as screen-printing or the like, and firing the same. The first protective layer G1may be disposed on the resistive layer200to protect the resistive layer200from an external environment. In particular, the first protective layer G1may serve to minimize damage to the resistive layer200during a trimming process. The first protective layer G1may be disposed in a region between a first external electrode300and a second external electrode400, which will be described later, and may cover a portion of each of the first external electrode300and the second external electrode400according to a design. In addition, the first protective layer G1may be disposed to extend over at least a portion of first electrodes310and410, which will be described later. The first protective layer G1may include at least one of the first metal and the second metal. More specifically, the first protective layer G1may include a plurality of aggregates11of particles of any one of the first metal and the second metal. The first metal and the second metal may be, for example, copper (Cu) and nickel (Ni), respectively. The first protective layer G1may serve to absorb and dissipate heat generated in the resistive layer200by including a metal component having excellent heat dissipation. Therefore, rated power of the resistor component1000may be improved. An average particle size (D50) of the aggregates11may be 2 μm to 10 μm in consideration of heat dissipation characteristics, but the present disclosure is not limited thereto. The average particle size of the aggregates11may be measured by various processes, such as diameter measurement or the like using a scanning electron microscope (SEM) image. The at least one of the first metal and the second metal may be an additive in the first protective layer. The first protective layer G1may include at least one of the first metal and the second metal, to reduce the absolute value of the temperature coefficient of resistivity (TCR) of the resistive layer200and the resistance value change rate. When the resistive layer200includes, for example, a Cu—Ni alloy, and an amount of nickel (Ni) included in the resistive layer200is 20 to 60 moles, based on 100 moles of a total amount of copper (Cu) and nickel (Ni), as illustrated inFIG.4, the absolute value of the temperature coefficient of resistivity (TCR) may be close to 0. In this case, in a sintering process, a phenomenon in which copper (Cu) or nickel (Ni) included in the external electrode300or400is diffused into the resistive layer200should be considered. For example, amount ratios of copper (Cu) and nickel (Ni) in the resistive layer200may be changed according to diffusion of copper (Cu) or nickel (Ni) included in the external electrode300or400. Therefore, as an amount of nickel (Ni) may be lower or higher than a total amount of copper (Cu) and nickel (Ni), the absolute value of the temperature coefficient of resistivity (TCR) may increase to reduce reliability of the resistor component1000. In this case, the first protective layer G1may include at least one of copper (Cu) or nickel (Ni) to offset a change in the temperature coefficient of resistivity (TCR) due to diffusion. Moreover, the resistance value change rate by sintering may be reduced. For example, when the external electrodes300and400include copper (Cu), the copper (Cu) included in the external electrodes300and400may be diffused into the resistive layer200to decrease an amount of nickel (Ni), compared to a total amount of copper (Cu) and nickel (Ni). In this case, when the first protective layer G1includes nickel (Ni), the nickel (Ni) included in the first protective layer G1may be also diffused into the resistive layer200during a sintering process, to increase an amount of nickel (Ni), compared to a total amount of copper (Cu) and nickel (Ni). Therefore, a change in ratio of the nickel (Ni) may be offset to constantly maintain ratios of copper (Cu) and nickel (Ni) during the sintering process, and an increase in absolute value of the temperature coefficient of resistivity (TCR) by diffusion of copper (Cu) from the external electrode300or400may be suppressed. In addition, ratios of copper (Cu) and nickel (Ni) in the sintering process by diffusion of nickel (Ni) from the first protective layer G1may be constantly maintained to reduce a change rate in resistance value of the resistive layer200by the sintering. For example, when the external electrodes300and400includes nickel (Ni), the nickel (Ni) included in the external electrodes300and400may be diffused into the resistive layer200to increase an amount of nickel (Ni), compared to a total amount of copper (Cu) and nickel (Ni). In this case, when the first protective layer G1includes copper (Cu), the copper (Cu) included in the first protective layer G1may be also diffused into the resistive layer200during a sintering process, to decrease an amount of nickel (Ni), compared to a total amount of copper (Cu) and nickel (Ni). Therefore, a change in ratio of the nickel (Ni) may be offset to constantly maintain ratios of copper (Cu) and nickel (Ni) during the sintering process, and an increase in absolute value of the temperature coefficient of resistivity (TCR) by diffusion of nickel (Ni) from the external electrodes300and400may be suppressed. In addition, ratios of copper (Cu) and nickel (Ni) in the sintering process by diffusion of copper (Cu) from the first protective layer G1may be constantly maintained to reduce a change rate in resistance value of the resistive layer200by the sintering. The first protective layer G1may be formed by applying a paste for forming a first protective layer including a glass component, a resin component, a solvent, and at least one of the first metal and the second metal or any one of the first metal powder and the second metal powder, which will be described later, on the resistive layer200or on the substrate100on which the first electrodes310and410are formed, and then sintering the same. In some embodiments, the paste may include at least one of the first metal and the second metal and at least one of a glass component, a resin component, and a solvent. The metal powder particles may be agglomerated during the sintering process. Therefore, the first protective layer G1may include agglomerates11of any one of the first metal and the second metal, and glass12. The glass12may include, for example, at least one of SiO2, BaO, B2O3, CaO, Al2O3, or ZnO, and may be fired in the same reducing atmosphere and temperature as the resistive layer200. A sintering temperature may be 800° C. to 900° C., but the present disclosure is not limited thereto. An amount of the second metal powder in the paste for forming the first protective layer may be at least 10 wt % or 10 wt % to 30 wt %, based on a total weight of the paste for forming the first protective layer. For example, an amount of the nickel (Ni) powder may be 10 wt % to 30 wt %, based on a total weight of the paste for forming the first protective layer. Therefore, a temperature coefficient of resistivity (TCR) and a resistance value change rate due to sintering may be reduced. When an amount of the nickel (Ni) powder is less than 10 wt %, based on a total weight of the paste for forming the first protective layer, effects of reducing the temperature coefficient of resistivity (TCR) and the change rate of resistance value due to sintering may be insignificant. When an amount of the nickel (Ni) powder exceeds 30 wt %, based on a total weight of the paste for forming the first protective layer, trimming properties may be deteriorated. A resistor component1000according to an example may include a second protective layer G2disposed on the first protective layer G1. The second protective layer G2may serve to protect the resistive layer200from external impact, together with the first protective layer G1, and may include a thermosetting resin and/or a photocurable resin to effectively absorb the external impact. The second protective layer G2may be formed by applying a curable paste including a resin component to the first protective layer G1and the substrate100, and curing the same. The external electrodes300and400may include a first external electrode300and a second external electrode400respectively disposed on a side surface of the substrate100, for example, on both side surfaces opposing in the second direction. In addition, the external electrodes300and400may include first electrodes310and410disposed on the substrate100, and second electrodes320and420respectively disposed on the first electrodes310and410. Specifically, the first electrodes310and410may be disposed on both side surfaces of the substrate100opposing each other in the second direction, and may be extended to portions of the first and second surfaces S1and S2of the substrate100, respectively. From this point of view, the first electrodes310and410may include upper electrodes311and411disposed on the first surface S1of the substrate100, lower electrodes312and412disposed on the second surface S2of the substrate100, and side electrodes313and413respectively disposed on a side surface of the substrate100to respectively connect the upper electrodes311and411and the lower electrodes312and412. In this case, the resistive layer200may extend onto the first electrodes310and410extending to the first and second surfaces S1and S2. For example, the resistive layer200may cover at least a portion of each of the upper electrodes311and411. Therefore, the first protective layer G1may be in contact with at least a portion of each of the first electrodes310and410, and the second protective layer G2may be in contact with at least a portion of each of the first electrodes310and410and at least a portion of each of the second electrodes320and420. Therefore, connectivity between the resistive layer200and the external electrodes300and400may be improved, and the first and second protective layers G1and G2may effectively protect the resistive layer200. The first electrodes310and410may be formed by applying a conductive paste to the side surface of the substrate100and a portion of each of the first and second surfaces S1and S2, and then sintering the same. Therefore, the first electrodes310and410may be fired electrodes including a conductive metal and glass. The conductive metal of the first electrodes310and410may include copper (Cu), silver (Ag), nickel (Ni) and/or an alloy thereof, and may more preferably include copper (Cu) and/or nickel (Ni). Referring toFIG.3, in an embodiment, upper electrodes311and411and lower electrodes312and412may be sintered electrodes including a conductive metal and glass, and side electrodes313and413may be sputtered layers formed by sputtering. In this case, the side electrodes313and413may be formed on a side surface of the substrate100, a portion of each of the upper electrodes311and411, and a portion of each of the lower electrodes312and412, and may include, for example, nickel (Ni)-chromium (Cr) alloy. When the side electrodes313and413include a Ni—Cr alloy, adhesion to the substrate100may be improved, and a resistor component1000may be miniaturized by reducing a thickness of an external electrodes300and400. In this case, an average thickness of the side electrodes313and413may be to 100 nm. The thicknesses of the side electrodes313and413refer to lengths of the side electrodes313and413in the second direction, and the average thickness may be determined by measuring thicknesses at 10 points in cross-sections of the resistor component1000in the first and second directions, equally spaced in the first direction. Types of the second electrodes320and420are not specifically limited, may be plating layers including at least one of nickel (Ni), tin (Sn), or palladium (Pd) as a conductive metal to improve mounting characteristics, and may be formed as a plurality of layers. The second electrodes320and420may be, for example, a nickel (Ni) plating layer or a tin (Sn) plating layer, or may be a structure in which the nickel (Ni) plating layer and the tin (Sn) plating layer are sequentially formed. In addition, the second electrodes320and420may include a plurality of nickel (Ni) plating layers and/or a plurality of tin (Sn) plating layers. The nickel (Ni) plating layer may prevent dissolution of a solder, and may act as a barrier to suppress electron movement in tin (Sn), and the tin (Sn) plating layer may play a role of improving wettability of a solder. Experimental Example In the Example and Comparative Example, copper (Cu) was included as a first metal, nickel (Ni) was included as a second metal, and all other conditions were equal to each other. In the Example including a first protective layer and the Comparative Example not including a first protective layer, 38 samples were prepared, respectively, and resistance value change rates of the samples according to a change in applied voltages were determined. The applied voltages corresponded to 2.5 times, 3.0 times, and 3.5 times of a rated voltage (RV), respectively, and an average value of resistance value change rates was determined when voltage are applied to the samples of each of the Example and Comparative Example. FIG.5is a graph illustrating resistance value change rates of the Example and Comparative Example according to an applied voltage. Referring toFIG.5, it can be confirmed that, in the Example, when applied voltages were 2.5 times, 3.0 times, and 3.5 times a rated voltage (RV), average values of resistance value change rates were 0.15%, 0.37%, and 0.69%, respectively, and in the Comparative Example, average values of resistance value change rates were 0.17%, 0.55%, and 1.45%, respectively. That is, it can be confirmed that resistance value change rates in the Example, according to applied voltages, were lower than that of the Comparative Example, and it can be confirmed that the Example had superior rated power characteristics than the Comparative Example. Absolute values of the temperature coefficient of resistivity (TCR) according to an amount of nickel (Ni and change rates in resistance value of the resistive layer200according to sintering, based on a total weight of a paste for forming the first protective layer G1, were determined. The change rates in resistance value according to sintering means rates at which resistance values change, in a process of applying a paste for forming a first protective layer G1on a substrate100on which first electrodes310and410and a resistive layer200were formed, and then sintering the same. After preparing 38 samples each having 0 wt %, 10 wt %, 20 wt %, 30 wt %, and 40 wt % of nickel (Ni) amount relative to a total weight of the paste for forming the first protective layer G1, absolute values of the temperature coefficient of resistivity (TCR) of the resistive layer200were determined and are illustrated in Table 1. The absolute values of the temperature coefficient of resistivity (TCR) were determined by measuring the resistances values over a temperature range of20rto125r. In addition, resistance value change rates of the resistive layer200, before and after sintering of the first protective layer G1, were determined and are illustrated in Table 1. TABLE 1ResistanceValueNickelTCRChange(Ni)AbsoluteRates (%)AmountValueaccording(wt %)(ppm/° C.)to Sintering099−9.61060−2.520371.030262.240202.3 Referring to Table 1, it can be seen that absolute values of the temperature coefficient of resistivity (TCR) gradually decreased as an amount of nickel (Ni) included in the paste for forming the first protective layer G1increases. This may be because a change in ratios of copper (Cu) and nickel (Ni) included in the resistive layer200offsets, as the nickel (Ni) included in the first protective layer G1may be diffused into the resistive layer200during the sintering process to diffuse copper (Cu) included in the first electrodes310and410into the resistive layer200. In addition, it can be seen that as nickel (Ni) included in the paste for forming the first protective layer G1is included, a change in ratios of copper (Cu) and nickel (Ni) included in the resistive layer200offsets during the sintering process to reduce change rates of resistance values of the resistive layer200. When an amount of nickel (Ni) included in the paste for forming the first protective layer G1exceeds 30 wt %, effects of reducing the resistance value change rate may be insignificant, and trimming characteristics may be deteriorated. Therefore, it can be seen that an amount of nickel (Ni) included in the paste for forming the first protective layer G1is preferably 10 wt % to 30 wt %, based on a total weight of the paste for forming the first protective layer. As the above conditions are satisfied, a resistor component1000having high reliability may be provided. In the present disclosure, expressions such as a side portion, a side surface, or the like may be used to refer to a left or right direction or a portion or surface in the direction, based on the drawings for convenience of description, expressions such as an upper side, an upper portion, an upper surface, or the like may be used to refer to an upward direction or a portion or surface in the direction, based on the drawings for convenience of description, and expressions such as a lower side, a lower portion, a lower surface, or the like may be used to refer to a downward direction or a portion or surface in the direction for convenience of description. In addition, positioning on the side portion, the upper side, the upper portion, the lower side, or the lower portion may be used not only when a target component is in direct contact with a reference component in a direction corresponding thereto, but also when the target component is located in the corresponding direction but is not in direct contact with the reference component. However, this is a definition of the direction for convenience of description, and the scope of the claims is not particularly limited by the description of this direction, and the concept of upward/downward direction or the like may be switched at any time. The term “connect” or “connection” in the present specification may not be only a direct connection, but also a concept including an indirect connection through an adhesive layer or the like. In addition, the term “electrically connected” or “electrical connection” in the present specification is a concept including both a physical connection and a physical non-connection. In addition, the expressions of “first,” second,” etc. in the present specification are used to distinguish one component from another, and do not limit the order and/or importance of the components. In some cases, without departing from the spirit of the present disclosure, a “first” component may be referred to as a “second” component, and similarly, a “second” component may be referred to as a “first” component. The expression “example” used in this specification does not refer to the same embodiment to each other, but may be provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that the above-mentioned examples are implemented in combination with the features of other examples. For example, although the description in a specific example is not described in another example, it can be understood as an explanation related to another example, unless otherwise described or contradicted by the other example. The terms used in the present disclosure are used only to illustrate various examples and are not intended to limit the presently disclosed concept. Singular expressions include plural expressions unless the context clearly dictates otherwise. As one effect among various effects of the present disclosure, a resistor component having a low temperature coefficient of resistivity (TCR) may be provided. As one effect among the various effects of the present disclosure, a resistor component having excellent rated power by absorbing and dissipating heat generated in the resistor component may be provided. As one effect among various effects of the present disclosure, a resistor component having a low resistance value change rate may be provided. While example embodiments have been illustrated and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims. | 25,922 |
11862366 | DETAILED DESCRIPTION FIGS.1A and1Bteach a heater10for a variety of uses. The heater includes an essentially pure aluminum nitride base or substrate12. Essentially pure is at least 5% impurities or less, but equal to or less than 1% is preferred. In one embodiment, the impurities of the base do not include any of polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE), hexabromocyclododecane (HBCDD), polyvinyl chloride (PVC), chlorinated paraffin, phthalate, cadmium, hexavalent chromium, lead, and mercury. The shape of the base includes a longitudinally extending solid of a generally rectangular shape having a length (l) and width (w) dimension and a thickness (t). After separating by dicing inFIG.7from a saw15along dashed lines17and19from a larger wafer20, for example, representative dimensions of each heater10include a thickness in a range of about 0.5-0.7 mm, a length in a range of about 150-160 mm, and a width in a range of about 6-8 mm. With continued reference toFIGS.1A and1B, each heater10includes at least one resistive trace22on a topside24of the base. Connected to each resistive trace at interface25is a conductor26. During use, the conductor26receives power from an external voltage source to power the resistive trace(s)22. In turn, the resistive trace heats and provides heating to the device in which it is used, such as for a cabin heater in an electric or hybrid vehicle or a fuser in an imaging device. In one embodiment, the external source is 115 VAC. In others, it is 12 VDC, 350 VDC, 650 VDC or 800 VDC. In any, the resistive trace and conductor support the voltage and lack Kirkendall voids at the interface25, by way of the methods of manufacturing the heater as described below. In dimensions, the thickness of the resistive trace is about 10-13 μm on the aluminum nitride base and has a length of about 135-145 mm and a width of about 4.5-5.5 mm. The conductor has a thickness of about 9-15 μm on the aluminum nitride base, a length of about 11-13 mm, and a width of about 4.8-5.8 mm. Also, the resistive trace has a resistance of about 10-12 ohms at 195° C. The resistive trace is formed from a resistor paste of about 80% silver and 20% palladium while the conductor is formed from a conductive paste of silver and palladium or platinum. In one embodiment, pastes for conductor layers include content of about 93% silver and about 7% palladium or platinum. Overlying each resistive trace and at least a portion of the conductor, but not an entirety of the conductor as it needs to connect to the external power source, is at least four layers of glass30(30-1,30-2,30-3,30-4,FIG.1a). The glass is any of a variety but the first two consecutive glass layers30-1,30-2are of a first type, while the next two 30-3, 30-4 are of a different type. The first type defines a cross glass layer, while the different type defines a cover glass layer. Any of the four glass layers define a glass having a viscosity of 100 Pa·s or less. More particularly, the viscosity exists at 90 Pa·s or less, especially 65 Pa·s or less. Its solid content, on the other hand, exists at 65% or more. In various specific embodiments, the glass is purchased commercially from AGC, Inc. (formerly the Asahi Glass Company) as seen in Table 1. Its properties are also noted. TABLE 1AGC, Inc.ThixotropicViscositySolidGlass Paste IDIndex(Pa · s)Content (%)AP5717B102.0-2.410066AP5717B131.68969AP5717B141.46172 In any layer of glass, the dimensions include a thickness in a range of about 10-13 μm on the aluminum nitride base, a length in a range of about 135-145 mm, and a width in a range of about 4.5-5.5 mm. In one embodiment, the first two consecutive layers30-1,30-2of the at least four glass layers together have a thickness of about 24 μm. The next two consecutive layers30-3,30-4and a fifth layer of glass (not shown untilFIG.6I) together have a combined thickness of about 65 μm. The fifth layer of glass also overlies the base and resistive and conductive layers and is similar in composition to any of the cover glass layers. With reference toFIG.1C, a bottom or backside40of the base12optionally includes one or more thermistors50. They interconnect with a same or different conductor26of the topside. They are positioned to measure the temperature of the heater10and the conductor26connects the thermistors to external sources to measure, store and control the temperature. With reference to the Figure sets of2A et seq.,3A et seq., and4A et seq., the general process steps for fabricating the heater10ofFIGS.1aand1bwill be described. They include one or more of thick-film printing, settling, drying, and firing or heating. As shorthand from the industry, they are generally known as print, dry, and fire, or PDF. In more detail, theFIGS.2A-2Fshow printing, drying, and firing. InFIG.2A, a base or substrate, such as the essentially pure aluminum nitride base12, is provided. InFIG.2B, thick-film printing of the substrate includes providing a mesh stencil60upon and through which a paste62is applied. In the instance of layering a resistor, conductor or glass, a resistive paste, a conductive paste or a glass paste is applied. InFIG.2C, a leveling device64, such as a squeegee or other scraper, levels the paste on a surface66(FIG.2B) of the base. InFIG.2D, the paste so applied is allowed to settle on the base forming a layer70upon removal of the stencil. This settling occurs typically for about five to ten minutes at room temperature, e.g., 20°-25° C. InFIG.2E, the base and layer is provided to a curing or drying unit80. The drying unit typifies a box oven or blast furnace and the base is provided to the unit along a conveyor, typically. The drying unit begins drying the layer70at around room temperature followed by a curing or drying cycle of about 30 minutes reaching temperatures of 140°-160° C. In one embodiment, the drying cycle includes applying infrared heat or hot air (both given generically as heat82) for a period of time of about 30 total minutes at a temperature profile of the drying unit beginning at about 25° C. and ramping up to about 80° C. for about 10 minutes, ramping up again to about 160° C. for about minutes and cooling down to below 50° C. After that, the base12with layer70is fired in a heater or firing unit80′. In some instances, the firing unit80′ is the same unit as the drying unit but having different heating profiles. In others, the firing unit80′ is different from the drying unit80and the base advances from one unit to the next along a conveyor, typically. In any, the heating profile for heating the base depends upon which type of layer is most recently printed and dried thereon, e.g., resistive layer, conductive layer or glass layer. InFIG.8, a representative heating profile for any layer is shown in graph100. Namely. the heating profile for a un-layered base or resistive or conductive layer is shown by the solid line102, whereas a dashed line104depicts the heating profile for glass. In general, the heating profile of the heating unit includes a total heating time of about 40 total minutes starting at about 25° C. and ramping up to a peak temperature (part of zones5-8) by 20 minutes and maintaining the peak temperature for at least 10 minutes and decreasing the temperature of the heating unit (post zone8) for at least 10 minutes thereafter. Cooling continues even further thereafter (post zone12) until completely cooled. For an un-layered base or the resistive or conductive layers, the peak temperature reaches about 850° C. The glass layers, on the other hand, have a peak temperature of 830° C. or 810° C., depending on which layers. Table 2, infra, provides a representative embodiment of which glass layers heat at which temperatures. With reference toFIGS.3A-3E, instances are shown of thick-film printing a base12to form and dry a layer12thereon. The views are similar toFIGS.2A-2E, except there is no instance of firing the base/layer(s) in a firing unit. Rather, the processing steps only include printing and drying. Similarly, too,FIGS.4A and4Bshow the mere firing of a substrate12in a firing unit80′, but without any instance of printing or drying a layer on the base or substrate. With reference toFIGS.5A-5E, a sequence of events depicts the printing, drying and firing steps of processing, but for a patterned layer overlying a base. That is,FIG.5Ashows a base12. InFIG.5B, the mesh stencil60′ includes a patterned layout61for receiving (1) a paste62and leveling (2) therein by the leveling device64, but whereas a remainder of the stencil includes a masked portion65preventing application of the paste82to the base12. InFIG.5C, the result is given with a base12having patterned layers thereon. In this instance, two longitudinally extending resistive traces91reside on the surface66of the base12in the pattern matching the patterned layering61of the stencil60′. Of course, any patterned shapes are possible. Settling of the patterned layer then occurs for about five to ten minutes at room temperature and are similar to that ofFIG.2D. Heating of the base and patterned layers next occurs in Figure including either curing and or firing in a drying and or heating unit80/80′. InFIG.5E, the patterned layer of the base12is further shown with another patterned layer93representing a conductive layer connected to a resistive layer at an interface25. Again, any patterning of layers is contemplated herein. With the principles of any instances of printing, drying and firing on a base, reference toFIGS.6A-6Ishow one embodiment of forming an aluminum nitride heater according to the invention. AtFIG.6A, an essentially pure aluminum nitride base12is provided. The base has 5% or fewer impurities, especially 1% or less. A surface66of the base is optionally pretreated by oxidizing the surface or providing a plasma treatment according to known techniques. The base is then fired according to the heating profile102ofFIG.8, up to a peak temperature of 850° C. InFIG.6B, a conductor layer26is patterned on a topside24of the base by thick-film printing and drying. The conductor layer is formed from a conductive paste. The past is a blend of silver and platinum or silver and palladium. The silver comprises more than 90% of the paste. In one design, the paste is about 93% silver and about 7% palladium. InFIG.6C, on a backside of the base20, another conductor layer26is patterned by thick-film printing and drying. The paste is the same as the topside paste and the backside is used to secure thermistors, e.g.,FIG.1C, such as by resistance-welding thermistors to the conductor layer. Thereafter, the base12with top and backside conductor layers are fired. The firing takes the form of the heating profile102ofFIG.8and reaches a peak temperature of about 850° C. In alternate embodiments, the processes ofFIGS.6B and6Ccould be reversed with the latter occurring first. InFIG.6D, a resistive trace22is patterned and connects to the conductor layer26at an interface25. The trace is formed by thick-film printing with a patterned stencil and allowed to settle into place at the interface whereupon it is dried. The trace, formed also of a blend of silver and palladium, representatively comprises 80% silver and 20% palladium. Thereafter, the trace together with the base and the top and backside conductor layers is fired in a firing unit. The firing takes the form of the heating profile102ofFIG.8and reaches a peak temperature of about 850° C. InFIG.6E, a first glass layer30-1is patterned over the resistive trace and portions of the conductor. The first glass layer is patterned by thick-film printing, then dried and fired. The heating profile takes the form of the dashed line104inFIG.8and reaches a peak temperature of about 830° C. The glass layer is typified as a cross glass layer formed from a paste sold by AGC, Inc. as AP5717B14. It has thixotropic index of 1.4, a viscosity of about 61 Pa·s and a solid content of more than 70%, especially 72%. Similarly, inFIG.6F, a second glass layer30-2is patterned over the first glass layer30-1and also covers the resistive trace and portions of the conductor. The second glass layer is patterned by thick-film printing, then dried and fired. The heating profile takes the form of the dashed line104inFIG.8and reaches a peak temperature of about 830° C. The second glass layer is also a cross glass layer formed from a paste sold by AGC, Inc. as AP5717B14. InFIG.6G, a third first glass layer30-3is patterned over the second glass layer and resistive trace and portions of the conductor. The third glass layer is patterned by thick-film printing, then dried and fired. The heating profile takes the form of the dashed line104inFIG.8and reaches a peak temperature of about 830° C. The glass layer in this embodiment, however, is cover glass layer formed from a paste sold by AGC, Inc. as AP5717B13. It has thixotropic index of 1.6, a viscosity of 90 or less, about 89 Pa·s and a solid content of about 69. Similarly, inFIG.6H, a fourth glass layer30-4is patterned over the third glass layer and resistive trace and portions of the conductor. The fourth glass layer is patterned by thick-film printing, then dried and fired. The heating profile takes the form of the dashed line104inFIG.8and reaches a peak temperature of about 830° C. The glass layer is cover glass layer formed from a paste sold by AGC, Inc. as AP5717B13. It too has thixotropic index of 1.6, a viscosity of 90 or less, about 89 Pa·s and a solid content of about 69. InFIG.6I, a fifth glass layer30-5(optional in some embodiments, hence the dashed lines) is patterned over the fourth glass layer and resistive trace and portions of the conductor. The fifth glass layer is patterned by thick-film printing, then dried and fired. The heating profile takes a form similar to the dashed line104inFIG.8, but reaches a peak temperature lower than any other temperature, at around 810° C. The glass layer is cover glass layer formed from a paste sold by AGC, Inc. as AP5717B13. It has thixotropic index of 1.6, a viscosity of 90 or less, about 89 Pa·s and a solid content of about 69. In table form, as a series of processes #1-11, Table 2 shows the making of an essentially pure aluminum nitride heater as a technical specification. Namely: TABLE 2Process#Process StepSequenceTemp (° C.)Spec1Fire BaseF8502ConductorPDTopside3ConductorPDBackside4FireF8505Resistive tracePDF8506UniformityChecked7COG1PDF830Total thickness8COG2PDF83024 microns9OG1PDF830Total thickness10OG2PDF83065 microns11OG3PDF810Notes:#1 is optional, #2 and #3 can be reversed, PD = Print, Dry, F = Fire, PDF = Print, Dry, Fire, COG1 = 1st“Cross Glass” layer, COG2 = 2nd“Cross Glass” layer, OG1 = 1stCover Glass layer, OG2 = 2ndCover Glass layer, OG3 = 3rd Cover Glass layer. Thereafter, upon cooling, the resistive trace of the heater becomes tested under voltage conditions of 1.75 KVAC applied to the conductor layer. Resistance of the trace is tested cold at room temperature and upon heating the heater to about 200° C. Its resistance should be about 10 ohms at room temperature and about 11 ohms upon heating. A range of +/−2 ohms is acceptable. The foregoing description of several structures and methods of making the same has been presented for purposes of illustration. It is not intended to be exhaustive or to limit the claims. Modifications and variations to the description are possible in accordance with the foregoing. It is intended that the scope of the invention be defined by the claims appended hereto. | 15,541 |
11862367 | Other objects and advantages associated with the aspects disclosed herein will be apparent to those skilled in the art based on the accompanying drawings and detailed description. In accordance with common practice, the features depicted by the drawings may not be drawn to scale. Accordingly, the dimensions of the depicted features may be arbitrarily expanded or reduced for clarity. In accordance with common practice, some of the drawings are simplified for clarity. Thus, the drawings may not depict all components of a particular apparatus or method. Further, like reference numerals denote like features throughout the specification and figures. DETAILED DESCRIPTION Aspects of the present disclosure are illustrated in the following description and related drawings directed to specific embodiments. Alternate aspects or embodiments may be devised without departing from the scope of the teachings herein. Additionally, well-known elements of the illustrative embodiments herein may not be described in detail or may be omitted so as not to obscure the relevant details of the teachings in the present disclosure. In certain described example implementations, instances are identified where various component structures and portions of operations can be taken from known, conventional techniques, and then arranged in accordance with one or more exemplary embodiments. In such instances, internal details of the known, conventional component structures and/or portions of operations may be omitted to help avoid potential obfuscation of the concepts illustrated in the illustrative embodiments disclosed herein. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. FIG.1illustrates a cross-sectional view of passive components that may be fabricated in a semiconductor device100. In an aspect, the semiconductor device100may comprise an integrated passive device (IPD) that includes one or more inductors, one or more capacitors, and one or more resistors. The semiconductor device100may comprise a substrate110(e.g., a high-resistivity silicon (HRS) substrate), a first passivation layer120(e.g., a first dielectric layer) on the substrate110, and a second passivation layer130(e.g., a second dielectric layer). In the first passivation layer120, first metallization layers122(also referred to as M1layers) may be formed on the substrate110, second metallization layers124(also referred to as M2layers) may be formed above the first metallization layers122, and third metallization layers128(also referred to as M3layers) may be formed above the second metallization layers124. First conductive vias126(also referred to as V1vias) may also be formed. Some first conductive vias126may electrically couple some first metallization layers122with some second metallization layers124. Other first conductive vias126may electrically couple other first metallization layers122with some third metallization layers128. In the second passivation layer130, first redistribution layers (RDLs)134(also referred to as RDL1) may be formed, and second redistribution layers138(also referred to as RDL2) may be formed above the first redistribution layers134. The first and second redistribution layers134,138may also respectively be referred to as fourth and fifth metallization layers (or M4layers, M5layers). Second conductive vias132(also referred to as V2vias) and third conductive vias136(also referred to as V3vias) may also be formed. Some second conductive vias132may electrically couple some third metallization layers128with some first redistribution layers134. Also, some third conductive vias136may electrically couple some first redistribution layers134with some second redistribution layers138. At least one second metallization layer124may be fabricated as a sheet resistor R (discussed in more detail below). At least one combination of a first metallization layer122and a second metallization layer124with a dielectric therebetween may be fabricated as a capacitor C. Further, at least one combination of some first and second redistribution layers134,138along with the some third conductive vias136may be fabricated as an inductor L. FIG.2illustrate a schematic of a power combiner200constructed from passive devices including resistors R, capacitors C and inductors L. The power combiner200combines signals provided at input ports P1and P2and outputs a combined result at an output port Pout.FIG.3illustrates a schematic of a broadband filter300constructed from passive devices including capacitors C and inductors L. Both the power combiner200and the broadband filter300may be fabricated through semiconductor fabrication technologies as represented by the passive devices of the semiconductor device100ofFIG.1. FIG.4illustrate an example of a conventional sheet resistor, which is rectangular in shape. As seen, the resistance R (or more generally impedance Z) of the sheet resistor can change depending on the frequency. That is, the AC resistance of the sheet resistor can change. In this instance, it is seen that the AC resistance can increase as the frequency increases. FIG.5shows some details of the conventional sheet resistor. As seen, a sheet resistor may have a per square resistance (□). This per square resistance—also referred to as sheet resistance RS—is typically independent of the size of the square itself. The total resistance of the sheet resistor may then be determined by multiplying the aspect ratio (AR) by the per square resistance RS. AR may be defined as length (L) divided by width (W) of the sheet resistor. That is R=AR*RS. For example, if the sheet (or per square) resistance RS=16Ω/□ and if a 96Ω sheet resistor is desired, then the sheet resistor may be fabricated such that its AR=6. FIG.6Aillustrates a schematic of a power combiner600, andFIG.6Billustrates a layout of the same power combiner600. The power combiner600may be the same or similar as the power combiner200ofFIG.2. That is, the power combiner600combines signals provided at input ports P1and P2and outputs the combined result at an output port Pout. The power combiner600comprises a resistor R, a plurality of capacitors C, and a plurality of inductors L. Note that as seen inFIG.6B, the resistor R of the power combiner600is a conventional sheet resistor, i.e., a rectangularly shaped sheet resistor. Power combiners can be more complex as seen inFIGS.7A and7Billustrating a power combiner700. As seen in the schematic ofFIG.7Aand in the layout ofFIG.7B, the power combiner700combines signals provided at input ports P1, P2, P3and P4and outputs the combined result at an output port Pout. The power combiner700comprises a plurality of resistors R, a plurality of capacitors C, and a plurality of inductors L. The resistors R of the power combiner700are conventional sheet resistors. When operating at high frequencies (e.g., 10 GHz or higher), the conventional rectangular sheet resistor also behave as an inductor due to the induced magnetic flux.FIG.8illustrates the conventional sheet resistor may be modeled as an inductor in series with the resistor. This inductor may also be referred to as equivalent series inductor (ESL). FIG.9illustrates a schematic of a power combiner900with the conventional sheet resistor modeled as shown inFIG.8, e.g., when operating in a high frequency environment. Unfortunately, the ESL can distort impedance matching and performance in circuits such as power combiners. As seen inFIG.10, the ESL can reduce performance by as much as 7 dB or more at frequencies of interest. To address some or all issues of conventional sheet resistors, it is proposed to reduce or even eliminate ESL of an AC resistor through a self-inductance cancellation technique. In general, a sheet resistor that includes meandering portions is proposed. For example, the proposed sheet resistor may include an upper portion and a lower portion. The upper and lower portions may both meander between two ports. Also, the upper and lower portions may meander such that a closed loop void is formed. As a demonstration, inductance and resistance values of different sheet resistors at an example frequency of interest (e.g., 11 GHz) are provided inFIGS.11,12and13.FIG.11illustrates a conventional rectangular sheet resistor1100,FIG.12illustrates an improved sheet resistor1200, andFIG.13illustrates an example of a proposed sheet resistor1300. As seen, the resistance values of the three sheet resistors1100,1200and1300are very similar. However, the ESL inductance values of the resistors can vary significantly. For example, the ESL inductance of the conventional sheet resistor1100may be as much as 180 pH. The sheet resistor1200, at 98 pH, is an improvement over the conventional sheet resistor1100. On the other hand, for the proposed sheet resistor1300, the ESL inductance is nearly zero, i.e., nearly eliminated. That is, the proposed sheet resistor1300may be “ESL-less”. FIG.14Aillustrates a schematic of a proposed power combiner1400that includes an ESL-less resistor, andFIG.14Billustrates a layout of the same power combiner1400. The power combiner1400may combine signals provided at input ports P1and P2(referred to as first input port and second input port respectively for ease of reference) and output the combined result at an output port Pout. The power combiner1400may comprise a sheet resistor1410(e.g., an ESL-less sheet resistor), a first capacitor1420, a second capacitor1430, a third capacitor1440, a first inductor1450and a second inductor1460. The sheet resistor1410may be electrically connected between the first input port P1and the second input port P2. The first capacitor1420may be electrically connected between the first input port P1and ground, the second capacitor1430may be electrically connected between the second input port P2and ground, and the third capacitor1440may be electrically connected between the output port Pout and ground. The first inductor1450may be electrically in series between the first input port P1and the output port Pout, and the second inductor1460may be electrically in series between the second input port P2and the output port Pout. It should be noted that the power combiner1400is one or many proposed power combiners. While not shown, a power combiner that combines more than two inputs may be provided. For example, a four-input power combiner similar to the power combiner700may be fabricated. Also, the proposed power combiners may be implemented in integrated passive devices (IPDs). The physics behind the self-inductance cancellation is explained with reference toFIG.15illustrating an ESL-less sheet resistor1500. The sheet resistor1410ofFIG.14may be an example of the ESL-less sheet resistor1500. Note that there are two parallel current paths between first and second ports Pa and Pb of the sheet resistor1500. For example, current may flow through the upper portion and the lower portion. As current flows through a path, magnetic flux Φ(i) due to current i is generated. However, due to the parallel current paths, the magnetic flux Φ(i) of one path can cancel out the magnetic flux Φ(i) of the other path. This can be particularly true in the space formed by the closed loop of the upper and lower portions. This implies that inductance L=Φ(i)/i may virtually be eliminated in the sheet resistor1500. For ease of reference, this space may be referred to as the closed loop void. The meandering of the upper and lower paths also aids in the flux cancellation. A geometry of a proposed ESL-less sheet resistor1600is explained with reference toFIG.16. The sheet resistors1410and1500may be examples of the sheet resistor1600. The sheet resistor1600may comprise an upper portion1610and a lower portion1620. The upper and lower portions1610,1620may be connected in parallel between first and second ports Pa, Pb. First and second ends of the upper portion1610may respectively be connected to the first and second ports Pa, Pb. Similarly, first and second ends of the lower portion1620may respectively be connected to the first and second ports Pa, Pb. The upper and lower portions1610,1620may be connected such that a closed loop void1630is formed between them. In an aspect, the sheet resistor1600may be formed titanium nitride (TiN). However, it should be noted that the sheet resistor1600may be formed from other materials that may be formed as thin films. Also, the sheet resistor1600may be fabricated as part or component of IPDs, which may also comprise one or more capacitors and/or one or more inductors. The upper portion1610may comprise one or more upper vertical portions and one or more upper horizontal portions. The one or more upper vertical portions and the one or more upper horizontal portions may be connected in series between the first port Pa and the second port Pb. In the example sheet resistor1600ofFIG.16, the one or more upper vertical portions may comprise first, second, third and fourth upper vertical portions1611,1613,1615,1617. The one or more upper horizontal portions comprise first, second and third upper horizontal portions1612,1614,1616. Along the upper portion1610, the first port Pa may be electrically connected to the second port Pb through the first upper vertical portion1611, the first upper horizontal portion1612, the second upper vertical portion1613, the second upper horizontal portion1614, the third upper vertical portion1615, the third upper horizontal portion1616, and the fourth upper vertical portion1617in that order. In an aspect, the upper portion1610may be mirrored with the lower portion1620. That is, the lower portion1620may comprise one or more lower vertical portions and one or more lower horizontal portions. The one or more lower vertical portions and the one or more lower horizontal portions may be connected in series between the first port Pa and the second port Pb. The one or more lower vertical portions may comprise first, second, third and fourth lower vertical portions1621,1623,1625,1627. The one or more lower horizontal portions comprise first, second and third lower horizontal portions1622,1624,1626. Along the lower portion1620, the first port Pa may be electrically connected to the second port Pb through the first lower vertical portion1621, the first lower horizontal portion1622, the second lower vertical portion1623, the second lower horizontal portion1624, the third lower vertical portion1625, the third lower horizontal portion1626, and the fourth lower vertical portion1627in that order. In an aspect, distances or geometries of various parts of the sheet resistor1600may be specified or designed. InFIG.16, various distances are defined as follows:Distance A (DA) may refer to a vertical distance between the first upper horizontal portion1612and the first lower horizontal portion1622within the closed loop void1630. More generally, DA may refer to a vertical distance between the first upper horizontal portion1612and the lower portion1620, or may refer to a vertical distance between the upper portion1610and the first lower horizontal portion1622.Distance B (DB) may refer to a horizontal distance between the second upper vertical portion1613and the third upper vertical portion1615within the closed loop void1630. Alternatively, DB may refer to a horizontal distance between the second lower vertical portion1623and the third lower vertical portion1625within the closed loop void1630.Distance C (DC) may refer to a distance between an upper surface of the second upper horizontal portion1614and an upper surface of the third upper horizontal portion1616. Alternatively, DC may refer to a distance between a lower surface of the second lower horizontal portion1624and a lower surface of the third lower horizontal portion1626.Distance D (DD) may refer to a horizontal width of the second upper vertical portion1613. Alternatively, DD may refer to a horizontal width of the second lower vertical portion1623.Distance E (DE) may refer to a vertical width of the second upper horizontal portion1614. Alternatively, DE may refer to a vertical width of the second lower horizontal portion1624.Distance F (DF) may refer to a vertical width of the first upper horizontal portion1612. Alternatively, DF may refer to a vertical width of the first lower horizontal portion1622.Distance G (DG) may refer to a vertical distance between the second upper horizontal portion1614and the second lower horizontal portion1624within the closed loop void1630. More generally, DG may refer to a vertical distance between the second upper horizontal portion1614and the lower portion1620, or may refer to a vertical distance between the upper portion1610and the second lower horizontal portion1624. For description purposes, DD (e.g., horizontal width of the second upper (lower) vertical portion1613(1623)) may be specified as W (e.g., DD=W), and other distances may be specified in relation to DD. Examples of such distances may be as follows:DB may be at least 1.5 times DD (i.e., DB≥1.5×DD).DE may be equal to DD (i.e., DE≈DD) within a threshold tolerance. In an aspect, the threshold tolerance may be defined as being within a fabrication tolerance of each other. For example, if a fabrication technique is such that a distance varies ±5 nm from design, then corresponding distances of two resistors may be considered as being equal if the distances are within 10 nm of each other. Alternatively, threshold tolerance may be defined as being within a threshold percentage of each other.DF may be equal to DD (i.e., DF≈DD) within the threshold tolerance.DA may be equal to twice DF (i.e., DE≈2×DF≈2×DD) within the threshold tolerance.DC may be equal to DF (i.e., DC≈DF≈DD) within the threshold tolerance.DG may be greater than DA (i.e., DG>DA). InFIG.16, the transitions between vertical and horizontal portions are illustrated as right angles. This is of course a possibility. But in an aspect, the transitions may be more smooth. That is, they may be more rounded, or at least not so abrupt. InFIG.16, a transition corner is highlighted with a dashed circle.FIG.17illustrates a more zoomed in view of the highlighted transition corner. As seen, the transition may be more gradual than the abrupt right angles. Again, it is emphasized that the sheet resistor1600ofFIG.16is merely an example. The proposed ESL-less resistor may take on a variety of geometries. Also, the sheet resistor1600may be utilized in IPD circuits such as power combiners. FIG.18illustrates a flow chart of an example method1800of fabricating an ESL-less sheet resistor, such as the sheet resistor1600. In block1810, an upper portion1610may be formed. A first end of the upper portion1610may be connected to a first port Pa and a second end of the upper portion1610may be connected to a second port Pb. FIG.19illustrates a flow chart of a process to implement block1810. In block1910, one or more upper vertical portions may be formed. For example, first, second, third and fourth upper vertical portions1611,1613,1615,1617may be formed. In block1920, one or more upper horizontal portions may be formed. For example, first, second and third upper horizontal portions1612,1614,1616may be formed. The one or more upper vertical portions and the one or more upper horizontal portions may be connected in series between the first port Pa and the second port Pb. For example, the first port Pa may be electrically connected to the second port Pb through the first upper vertical portion1611, the first upper horizontal portion1612, the second upper vertical portion1613, the second upper horizontal portion1614, the third upper vertical portion1615, the third upper horizontal portion1616, and the fourth upper vertical portion1617in that order. Referring back toFIG.18, in block1820, a lower portion1620may be formed. A first end of the lower portion1620may be connected to the first port Pa and a second end of the lower portion1620may be connected to the second port Pb. FIG.20illustrates a flow chart of a process to implement block1820. In block2010, one or more lower vertical portions may be formed. For example, first, second, third and fourth lower vertical portions1621,1623,1625,1627may be formed. In block2020, one or more lower horizontal portions may be formed. For example, first, second and third lower horizontal portions1622,1624,1626may be formed. The one or more lower vertical portions and the one or more lower horizontal portions may be connected in series between the first port Pa and the second port Pb. For example, the first port Pa may be electrically connected to the second port Pb through the first lower vertical portion1621, the first lower horizontal portion1622, the second lower vertical portion1623, the second lower horizontal portion1624, the third lower vertical portion1625, the third lower horizontal portion1626, and the fourth lower vertical portion1627in that order. It will be appreciated that the foregoing fabrication processes and related discussion were provided merely as a general illustration of some of the aspects of the disclosure and is not intended to limit the disclosure or accompanying claims. Further, many details in the fabrication process known to those skilled in the art may have been omitted or combined in summary process portions to facilitate an understanding of the various aspects disclosed without a detailed rendition of each detail and/or all possible process variations. Further, it will be appreciated that the illustrated configurations and descriptions are provided merely to aid in the explanation of the various aspects disclosed herein. For example, the number and location of the inductors, the metallization structure may have more or less conductive and insulating layers, the cavity orientation, size, whether it is formed of multiple cavities, is closed or open, and other aspects may have variations driven by specific application design features, such as the number of antennas, antenna type, frequency range, power, etc. Accordingly, the forgoing illustrative examples and associated figures should not be construed to limit the various aspects disclosed and claimed herein. FIG.21illustrates various electronic devices that may be integrated with any of the aforementioned ESL-less resistors in accordance with various aspects of the disclosure. For example, a mobile phone device2102, a laptop computer device2104, and a fixed location terminal device2106may each be considered generally user equipment (UE) and may include devices2100in which one or more ESL-less resistors are incorporated as described herein. The devices2102,2104,2106illustrated inFIG.21are merely exemplary. Other electronic devices may also include the RF filter including, but not limited to, a group of devices (e.g., electronic devices) that includes mobile devices, hand-held personal communication systems (PCS) units, portable data units such as personal digital assistants, global positioning system (GPS) enabled devices, navigation devices, set top boxes, music players, video players, entertainment units, fixed location data units such as meter reading equipment, communications devices, smartphones, tablet computers, computers, wearable devices, servers, routers, electronic devices implemented in automotive vehicles (e.g., autonomous vehicles), an Internet of things (IoT) device or any other device that stores or retrieves data or computer instructions or any combination thereof. The foregoing disclosed devices and functionalities may be designed and configured into computer files (e.g., RTL, GDSII, GERBER, etc.) stored on computer-readable media. Some or all such files may be provided to fabrication handlers who fabricate devices based on such files. Resulting products may include semiconductor wafers that are then cut into semiconductor die and packaged into an antenna on glass device. The antenna on glass device may then be employed in devices described herein. Implementation examples are described in the following numbered clauses:Clause 1: A sheet resistor, comprising: an upper portion, a first end of the upper portion connected to a first port and a second end of the upper portion connected to a second port; and a lower portion, a first end of the lower portion connected to the first port and a second end of the lower portion connected to the second port, wherein the upper portion and the lower portion are connected in parallel between the first port and the second port, and wherein the first end and the second end of the upper portion are respectively connected to the first end and the second end of the lower portion such that a closed loop void is formed between the upper portion and the lower portion.Clause 2: The sheet resistor of clause 1, wherein the sheet resistor is formed from titanium nitride (TiN).Clause 3: The sheet resistor of any of clauses 1-2, wherein the sheet resistor is formed as a part of an integrated passive device (IPD).Clause 4: The sheet resistor of clause 3, wherein the IPD also comprises: one or more capacitors; one or more inductors; or both.Clause 5: The sheet resistor of any of clauses 1-4, wherein the upper portion comprises: one or more upper vertical portions; and one or more upper horizontal portions, the one or more upper vertical portions and the one or more upper horizontal portions being connected in series between the first port and the second port.Clause 6: The sheet resistor of clause 5, wherein the one or more upper vertical portions comprise a first upper vertical portion, a second upper vertical portion, a third upper vertical portion, and a fourth upper vertical portion, wherein the one or more upper horizontal portions comprise a first upper horizontal portion, a second upper horizontal portion, and a third upper horizontal portion, and wherein the first port is electrically connected to the second port through the first upper vertical portion, the first upper horizontal portion, the second upper vertical portion, the second upper horizontal portion, the third upper vertical portion, the third upper horizontal portion, and the fourth upper vertical portion in that order.Clause 7: The sheet resistor of clause 6, wherein a horizontal distance between the second upper vertical portion and the third upper horizontal portion within the closed loop void is at least 1.5 times a horizontal width of the second upper vertical portion, a vertical width of the second upper horizontal portion is equal to the horizontal width of the second upper vertical portion within a threshold tolerance, a vertical width of the first upper horizontal portion is equal to the horizontal width of the second upper vertical portion within the threshold tolerance, and a distance between an upper surface of the second upper horizontal portion and an upper surface of the third upper horizontal portion is equal to the vertical width of the first upper horizontal portion within the threshold tolerance.Clause 8: The sheet resistor of clause 7, wherein within the closed loop void, a vertical distance between the first upper horizontal portion and the lower portion is equal to twice the vertical width of the first upper horizontal portion within the threshold tolerance.Clause 9: The sheet resistor of clause 8, wherein within the closed loop void, a vertical distance between the second upper horizontal portion and the lower portion is greater than the vertical distance between the first upper horizontal portion and the lower portion.Clause 10: The sheet resistor of any of clauses 1-9, wherein the lower portion comprises: one or more lower vertical portions; and one or more lower horizontal portions, the one or more lower vertical portions and the one or more lower horizontal portions being connected in series between the first port and the second port.Clause 11: The sheet resistor of clause 10, wherein the one or more lower vertical portions comprise a first lower vertical portion, a second lower vertical portion, a third lower vertical portion, and a fourth lower vertical portion, wherein the one or more lower horizontal portions comprise a first lower horizontal portion, a second lower horizontal portion, and a third lower horizontal portion, and wherein the first port is electrically connected to the second port through the first lower vertical portion, the first lower horizontal portion, the second lower vertical portion, the second lower horizontal portion, the third lower vertical portion, the third lower horizontal portion, and the fourth lower vertical portion in that order.Clause 12: The sheet resistor of any of clauses 1-11, wherein the sheet resistor is incorporated into an apparatus selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.Clause 13: A power combiner, comprising: one or more resistors comprising a sheet resistor; one or more capacitors comprising a first capacitor, a second capacitor, and a third capacitor; and one or more inductors comprising a first inductor and a second inductor, wherein the sheet resistor is electrically connected between a first input port and a second input port, wherein the first capacitor is electrically connected between the first input port and a ground, the second capacitor is electrically connected between the second input port and the ground, and the third capacitor is electrically connected between an output port and the ground, wherein the first inductor is electrically connected between the first input port and the output port, and the second inductor is electrically connected between the second input port and the output port, and wherein the sheet resistor comprises: an upper portion, a first end of the upper portion connected to the first input port and a second end of the upper portion connected to the second input port; and a lower portion, a first end of the lower portion connected to the first input port and a second end of the lower portion connected to the second input port, wherein the upper portion and the lower portion are connected in parallel between the first input port and the second input port, and wherein the first end and the second end of the upper portion are respectively connected to the first end and the second end of the lower portion such that a closed loop void is formed between the upper portion and the lower portion.Clause 14: The power combiner of clause 13, wherein the sheet resistor is formed from titanium nitride (TiN).Clause 15: The power combiner of any of clauses 13-14, wherein the sheet resistor, at least one capacitor, and at least one inductor are formed as parts of an integrated passive device (IPD).Clause 16: The power combiner of any of clauses 13-15, wherein the upper portion comprises: one or more upper vertical portions; and one or more upper horizontal portions, the one or more upper vertical portions and the one or more upper horizontal portions being connected in series between the first port and the second port.Clause 17: The power combiner of clause 16, wherein the one or more upper vertical portions comprise a first upper vertical portion, a second upper vertical portion, a third upper vertical portion, and a fourth upper vertical portion, wherein the one or more upper horizontal portions comprise a first upper horizontal portion, a second upper horizontal portion, and a third upper horizontal portion, and wherein the first port is electrically connected to the second port through the first upper vertical portion, the first upper horizontal portion, the second upper vertical portion, the second upper horizontal portion, the third upper vertical portion, the third upper horizontal portion, and the fourth upper vertical portion in that order.Clause 18: The power combiner of clause 17, wherein a horizontal distance between the second upper vertical portion and the third upper horizontal portion within the closed loop void is at least 1.5 times a horizontal width of the second upper vertical portion, a vertical width of the second upper horizontal portion is equal to the horizontal width of the second upper vertical portion within a threshold tolerance, a vertical width of the first upper horizontal portion is equal to the horizontal width of the second upper vertical portion within the threshold tolerance, and a distance between an upper surface of the second upper horizontal portion and an upper surface of the third upper horizontal portion is equal to the vertical width of the first upper horizontal portion within the threshold tolerance.Clause 19: The power combiner of clauses 18, wherein within the closed loop void, a vertical distance between the first upper horizontal portion and the lower portion is equal to twice the vertical width of the first upper horizontal portion within the threshold tolerance.Clause 20: The power combiner of clause 19, wherein within the closed loop void, a vertical distance between the second upper horizontal portion and the lower portion is greater than the vertical distance between the first upper horizontal portion and the lower portion.Clause 21: The power combiner of any of clauses 13-20, wherein the lower portion comprises: one or more lower vertical portions; and one or more lower horizontal portions, the one or more lower vertical portions and the one or more lower horizontal portions being connected in series between the first port and the second port.Clause 22: The power combiner of clause 21, wherein the one or more lower vertical portions comprise a first lower vertical portion, a second lower vertical portion, a third lower vertical portion, and a fourth lower vertical portion, wherein the one or more lower horizontal portions comprise a first lower horizontal portion, a second lower horizontal portion, and a third lower horizontal portion, and wherein the first port is electrically connected to the second port through the first lower vertical portion, the first lower horizontal portion, the second lower vertical portion, the second lower horizontal portion, the third lower vertical portion, the third lower horizontal portion, and the fourth lower vertical portion in that order.Clause 23: The power combiner of any of clauses 13-22, wherein the power combiner is incorporated into an apparatus selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.Clause 24: A method of fabricating a sheet resistor, the method comprising: forming an upper portion, a first end of the upper portion connected to a first port and a second end of the upper portion connected to a second port; and forming a lower portion, a first end of the lower portion connected to the first port and a second end of the lower portion connected to the second port, wherein the upper portion and the lower portion are connected in parallel between the first port and the second port, and wherein the first end and the second end of the upper portion are respectively connected to the first end and the second end of the lower portion such that a closed loop void is formed between the upper portion and the lower portion.Clause 25: The method of clause 24, wherein the sheet resistor is formed from titanium nitride (TiN).Clause 26: The method of any of clauses 24-25, wherein the sheet resistor is formed as a part of an integrated passive device (IPD).Clause 27: The method of clause 26, wherein the IPD also comprises: one or more capacitors; one or more inductors; or both.Clause 28: The method of any of clauses 24-27, wherein forming the upper portion comprises: forming one or more upper vertical portions; and forming one or more upper horizontal portions, the one or more upper vertical portions and the one or more upper horizontal portions being connected in series between the first port and the second port.Clause 29: The method of clause 28, wherein the one or more upper vertical portions comprise a first upper vertical portion, a second upper vertical portion, a third upper vertical portion, and a fourth upper vertical portion, wherein the one or more upper horizontal portions comprise a first upper horizontal portion, a second upper horizontal portion, and a third upper horizontal portion, and wherein the first port is electrically connected to the second port through the first upper vertical portion, the first upper horizontal portion, the second upper vertical portion, the second upper horizontal portion, the third upper vertical portion, the third upper horizontal portion, and the fourth upper vertical portion in that order.Clause 30: The method of clause 29, wherein a horizontal distance between the second upper vertical portion and the third upper horizontal portion within the closed loop void is at least 1.5 times a horizontal width of the second upper vertical portion, a vertical width of the second upper horizontal portion is equal to the horizontal width of the second upper vertical portion within a threshold tolerance, a vertical width of the first upper horizontal portion is equal to the horizontal width of the second upper vertical portion within the threshold tolerance, and a distance between an upper surface of the second upper horizontal portion and an upper surface of the third upper horizontal portion is equal to the vertical width of the first upper horizontal portion within the threshold tolerance.Clause 31: The method of clause 30, wherein within the closed loop void, a vertical distance between the first upper horizontal portion and the lower portion is equal to twice the vertical width of the first upper horizontal portion within the threshold tolerance.Clause 32: The method of clause 31, wherein within the closed loop void, a vertical distance between the second upper horizontal portion and the lower portion is greater than the vertical distance between the first upper horizontal portion and the lower portion.Clause 33: The method of any of clauses 24-32, wherein the forming lower portion comprises: forming one or more lower vertical portions; and forming one or more lower horizontal portions, the one or more lower vertical portions and the one or more lower horizontal portions being connected in series between the first port and the second port.Clause 34: The method of clause 33, wherein the one or more lower vertical portions comprise a first lower vertical portion, a second lower vertical portion, a third lower vertical portion, and a fourth lower vertical portion, wherein the one or more lower horizontal portions comprise a first lower horizontal portion, a second lower horizontal portion, and a third lower horizontal portion, and wherein the first port is electrically connected to the second port through the first lower vertical portion, the first lower horizontal portion, the second lower vertical portion, the second lower horizontal portion, the third lower vertical portion, the third lower horizontal portion, and the fourth lower vertical portion in that order. As used herein, the terms “user equipment” (or “UE”), “user device,” “user terminal,” “client device,” “communication device,” “wireless device,” “wireless communications device,” “handheld device,” “mobile device,” “mobile terminal,” “mobile station,” “handset,” “access terminal,” “subscriber device,” “subscriber terminal,” “subscriber station,” “terminal,” and variants thereof may interchangeably refer to any suitable mobile or stationary device that can receive wireless communication and/or navigation signals. These terms include, but are not limited to, a music player, a video player, an entertainment unit, a navigation device, a communications device, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an automotive device in an automotive vehicle, and/or other types of portable electronic devices typically carried by a person and/or having communication capabilities (e.g., wireless, cellular, infrared, short-range radio, etc.). These terms are also intended to include devices which communicate with another device that can receive wireless communication and/or navigation signals such as by short-range wireless, infrared, wireline connection, or other connection, regardless of whether satellite signal reception, assistance data reception, and/or position-related processing occurs at the device or at the other device. In addition, these terms are intended to include all devices, including wireless and wireline communication devices, that are able to communicate with a core network via a radio access network (RAN), and through the core network the UEs can be connected with external networks such as the Internet and with other UEs. Of course, other mechanisms of connecting to the core network and/or the Internet are also possible for the UEs, such as over a wired access network, a wireless local area network (WLAN) (e.g., based on IEEE 802.11, etc.) and so on. UEs can be embodied by any of a number of types of devices including but not limited to printed circuit (PC) cards, compact flash devices, external or internal modems, wireless or wireline phones, smartphones, tablets, tracking devices, asset tags, and so on. A communication link through which UEs can send signals to a RAN is called an uplink channel (e.g., a reverse traffic channel, a reverse control channel, an access channel, etc.). A communication link through which the RAN can send signals to UEs is called a downlink or forward link channel (e.g., a paging channel, a control channel, a broadcast channel, a forward traffic channel, etc.). As used herein the term traffic channel (TCH) can refer to either an uplink/reverse or downlink/forward traffic channel. The wireless communication between electronic devices can be based on different technologies, such as code division multiple access (CDMA), W-CDMA, time division multiple access (TDMA), frequency division multiple access (FDMA), Orthogonal Frequency Division Multiplexing (OFDM), Global System for Mobile Communications (GSM), 3GPP Long Term Evolution (LTE), 5G New Radio, Bluetooth (BT), Bluetooth Low Energy (BLE), IEEE 802.11 (WiFi), and IEEE 802.15.4 (Zigbee/Thread) or other protocols that may be used in a wireless communications network or a data communications network. Bluetooth Low Energy (also known as Bluetooth LE, BLE, and Bluetooth Smart) is a wireless personal area network technology designed and marketed by the Bluetooth Special Interest Group intended to provide considerably reduced power consumption and cost while maintaining a similar communication range. BLE was merged into the main Bluetooth standard in 2010 with the adoption of the Bluetooth Core Specification Version 4.0 and updated in Bluetooth 5. The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any details described herein as “exemplary” is not to be construed as advantageous over other examples. Likewise, the term “examples” does not mean that all examples include the discussed feature, advantage or mode of operation. Furthermore, a particular feature and/or structure can be combined with one or more other features and/or structures. Moreover, at least a portion of the apparatus described herein can be configured to perform at least a portion of a method described herein. It should be noted that the terms “connected,” “coupled,” or any variant thereof, mean any connection or coupling, either direct or indirect, between elements, and can encompass a presence of an intermediate element between two elements that are “connected” or “coupled” together via the intermediate element unless the connection is expressly disclosed as being directly connected. Any reference herein to an element using a designation such as “first,” “second,” and so forth does not limit the quantity and/or order of those elements. Rather, these designations are used as a convenient method of distinguishing between two or more elements and/or instances of an element. Also, unless stated otherwise, a set of elements can comprise one or more elements. Those skilled in the art will appreciate that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof. Nothing stated or illustrated depicted in this application is intended to dedicate any component, action, feature, benefit, advantage, or equivalent to the public, regardless of whether the component, action, feature, benefit, advantage, or the equivalent is recited in the claims. In the detailed description above it can be seen that different features are grouped together in examples. This manner of disclosure should not be understood as an intention that the claimed examples have more features than are explicitly mentioned in the respective claim. Rather, the disclosure may include fewer than all features of an individual example disclosed. Therefore, the following claims should hereby be deemed to be incorporated in the description, wherein each claim by itself can stand as a separate example. Although each claim by itself can stand as a separate example, it should be noted that—although a dependent claim can refer in the claims to a specific combination with one or one or more claims—other examples can also encompass or include a combination of said dependent claim with the subject matter of any other dependent claim or a combination of any feature with other dependent and independent claims. Such combinations are proposed herein, unless it is explicitly expressed that a specific combination is not intended. Furthermore, it is also intended that features of a claim can be included in any other independent claim, even if said claim is not directly dependent on the independent claim. It should furthermore be noted that methods, systems, and apparatus disclosed in the description or in the claims can be implemented by a device comprising means for performing the respective actions and/or functionalities of the methods disclosed. Furthermore, in some examples, an individual action can be subdivided into one or more sub-actions or contain one or more sub-actions. Such sub-actions can be contained in the disclosure of the individual action and be part of the disclosure of the individual action. While the foregoing disclosure shows illustrative examples of the disclosure, it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. The functions and/or actions of the method claims in accordance with the examples of the disclosure described herein need not be performed in any particular order. Additionally, well-known elements will not be described in detail or may be omitted so as to not obscure the relevant details of the aspects and examples disclosed herein. Furthermore, although elements of the disclosure may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated. | 48,537 |
11862368 | DETAILED DESCRIPTION Technical solution and advantages of the examples of the disclosure, the technical solutions of the present disclosure are described in connection with the examples of the present disclosure and the corresponding drawings. The described examples are just a part but not all of the examples of the present disclosure. Based on the examples of the present disclosure, those skilled in the art can obtain other example(s), without any inventive work, which should be within the scope of the disclosure. It shall be understood that, although the terms “first,” “second,” “third,” and the like may be used herein to describe various information, the information should not be limited by these terms. These terms are only used to distinguish one category of information from another. For example, without departing from the scope of the present disclosure, first information may be termed as second information; and similarly, second information may also be termed as first information. As used herein, the term “if” may be understood to mean “when” or “upon” or “in response to” depending on the context. The technical solutions of the present application will be clearly and completely described below in connection with particular embodiments of the present application and corresponding accompanying drawings, so that the objectives, technical solutions and advantages of the present application are more understandable. Apparently, the described embodiments are just a part but not all of the embodiments of the present application. Based on the described embodiments of the present application, those skilled in the art can obtain other embodiment(s), without any inventive work, which should be within the scope of the present application. In the following, technical solutions provided by embodiments of the present application will be described in detail in connection with the drawings. An embodiment of the present application discloses an inductance device, as shown inFIG.1, including an inductor framework1, a main coil2, an upper magnetic core3, a lower magnetic core4, and auxiliary coils5. The inductor framework in the embodiment can be made from insulating materials, and it is recommended to use phenolic plastics as the materials of the inductor framework for reduction of cost. Specifically, as shown inFIGS.2-6, the inductor framework1includes a main winding part10and auxiliary winding parts12that are integrally arranged. The main winding part10includes an upper end100, a lower end102, a main body104located between the upper end100and the lower end102, and an inserting hole106. Edges of both the upper end100and the lower end102go beyond the main body104, and cooperate with the main body104to form a main winding groove104ain which the main coil2is wound. The upper end100and the lower end102can restrict the form of the main coil2to prevent the main coil2from separating from the main body104. The upper end100has a top surface100afacing away from the lower end, and the lower end102also has a bottom surface102afacing away from the upper end100. The inserting hole106passes successively through the upper end100, the main body104, and the lower end102in the direction from the top surface100ato the bottom surface102a. The auxiliary winding parts12extend towards the direction away from the inserting hole106from the lower end102. The auxiliary winding parts12have extension directions perpendicular to that of the inserting hole106, and namely the auxiliary winding parts12are arranged at sides of the inserting hole106. Side surfaces of the auxiliary winding parts12facing away from the upper end100are welding surfaces120which are at a distance from the top surface100ain the extension direction of the inserting hole106no less than a distance between the bottom surface102aand the top surface100ain the extension direction of the inserting hole106, and in other words the welding surfaces120are at a lower location than the bottom surface102aso as to be welded with a PCB. The auxiliary winding parts12are used to wind the auxiliary coils5around them, and the auxiliary coils5wound thereon can cover at least a portion of the welding surfaces120to be used for welding. There is no special limit to the shape of the auxiliary coils5, as long as the auxiliary coil5can cover a portion of the welding surface120. For example, it is possible to wind the auxiliary coil5annularly between two vertical surfaces121,122adjacent to the welding surface120and a surface123of the auxiliary winding part12facing the upper end100, or between the two vertical surfaces121,122and a surface124of the auxiliary winding part12facing away from the lower end102, and it is also possible to wind the auxiliary coils5in other more complicated way, which will not be discussed herein. In order to prevent the auxiliary coil5from separating from the auxiliary winding part12, it is necessary to arrange on the auxiliary winding parts12a position limiting structure125which restricts the auxiliary coil5to prevent the auxiliary coil5from separating from the auxiliary winding part12. In the embodiment, the position limiting structure125may be arranged on an arbitrary surface of the auxiliary winding part12. The auxiliary coils5are of an integral structure, so the objection of preventing the auxiliary coils5from separating from the auxiliary winding parts12can be achieved as long as any portion of the auxiliary coils5is prevented from separating from the auxiliary winding parts12. However, in order to ensure the welding effect, the welding surface120is preferably as close as possible to the PCB when assembling the inductance device. Thus, it is preferred for the position limiting structures125in the embodiment to be arranged on other surfaces of the auxiliary winding parts12rather than the welding surfaces120. In the embodiment, the position limiting structure125may be the structure such as a position limiting block, a position limiting baffle plate, etc., and it is recommended to use the form of a position limiting groove. The position limiting groove125(for the sake of description, the reference number125of the position limiting structure is used for the position limiting groove in the following) can receive a portion of the auxiliary coil5so that the portion of the auxiliary coil5cannot separate from the auxiliary winding part12. The position limiting groove125extends in a direction identical, perpendicular, or even inclined to the extension direction of the inserting hole106. The number of the position limiting groove125can be more than one. For example, the vertical surfaces121and122are provided with one position limiting groove125, respectively; or the vertical surface121is provided with one position limiting groove125which has the same extension direction as the inserting hole106, and the surface124is provided with one position limiting groove125which extends in a direction perpendicular to the extension direction of the inserting hole106(seeFIG.2), and the plurality of position limiting grooves125cooperate with each other to limit the position of the auxiliary coil5. Furthermore, it is also possible to arrange multiple segments of position limiting grooves125, examples of which will not be given herein. In the embodiment, the main coil2and the auxiliary coils5can be wound successively with the same enameled wire when winding, and there is electrical connection between the main coil2and the auxiliary coils5that are wound, so that the auxiliary coils5can supply power directly for the main coil2. Furthermore, the main coil2and the auxiliary coils5in the embodiment can also be wound with different enameled wires, respectively, and in this case there is no electrical connection between the auxiliary coil5and the main coil2, the auxiliary coils5are only used for fixing and welding. It is necessary for the main coil2to have at least one input end and one output end, and thus, in the usual case at least two of the auxiliary coils5are wound with the same enameled wire as the main coil2. The two auxiliary coils5can be used as the input end and the output end of the main coil2, respectively. Of course, to cope with different application environments, the number of the input end and the output end of the main coil2can be changed, and the number of the auxiliary coils5in electrical connection with the main coil2can be increased further. As shown inFIG.1, both the upper magnetic core3and the lower magnetic core4in the embodiment are E-shaped structures, middle extension portions of the E-shaped structures are central column30and40, respectively. When the winding of the main coil2and the auxiliary coils5is finished, the upper magnetic core3is capped onto the top surface100a, and the central column30of the upper magnetic core3is inserted into the inserting hole106from an opening of the inserting hole6at the upper end100, and extension portions at two sides of the upper magnetic core3cover the outer periphery of the main coil2. The lower magnetic core4is capped onto the bottom surface102a, and the central column40of the lower magnetic core4is inserted into the inserting hole106from an opening of the inserting hole6at the lower end102. It is required that the side surface of the lower magnetic core4facing away from the upper magnetic core3should not go beyond the welding surface102in order to avoid affecting the welding effect. In order to prevent the side surface of the lower magnetic core4facing away from the upper magnetic core3from going beyond the welding surface, it is possible in design to form a height difference between the welding surface120and the bottom surface102aenough to receive the lower magnetic core4, or to arrange a lower through groove102bin the bottom surface102awhich is used to receive the lower magnetic core4. In this case, in order to insert the central column40into the inserting hole106, it is necessary for the inserting hole106to extend to the lower through groove102b. At the same time, in order to prevent the lower magnetic core4from interfering with the auxiliary winding parts12, the auxiliary winding parts12extend in directions perpendicular to the extension direction of the lower through groove102b, and namely the auxiliary winding parts12are arranged at sides of the lower through groove102b. When the inductance device is assembled onto the PCB7, a portion of the enamel of the auxiliary coils5covering the welding surfaces120is melt by high temperature to expose internal metal wires. Under high temperature the metal wires will melt and flow onto a bonding pad on the PCB7, and after cooling and solidifying, the welding operation of the auxiliary coils5and the bonding pad can be finished (seeFIG.7). Because it is unnecessary to reserve the region in the bonding pad for the pins to pass through, the boding pad has an area reduced greatly and even can completely be hidden under the inductance device, thus greatly saving the area of the PCB7. To improve the stability of assembly, it is possible that the auxiliary winding parts12extend at two sides of the lower end102symmetric to the inserting hole106and the auxiliary coils5are wound around auxiliary winding parts12at each side, so that the inductance device can have a welded connection with the PCB at its two sides by the auxiliary coils5during the welding operation, and the high stability is obtained. The number of the auxiliary winding parts12and the auxiliary coils5can be adjusted according to the required structural strength and the need for electrical connection. Usually, the number of the auxiliary winding parts12is in a range from two to five, and it is preferred to use the technical solution with four auxiliary winding parts, and any two of the four auxiliary winding parts are symmetrical to each other. In the embodiment, usually each auxiliary coil5is separately wound around one auxiliary winding part12, and however one auxiliary coil5being simultaneously wound around a plurality of the auxiliary winding parts12at the same side of the lower end102is not excluded in the embodiment. For example, in the technical solution shown inFIG.8, the two auxiliary winding parts12at the same side can be used as two supporting points around which the enameled wire is wound to form an elongated auxiliary coil5. This kind of auxiliary coil5and the PCB have a larger welding area, and the better structural stability and electrical stability are obtained. Of course, when winding, in addition to the two auxiliary winding parts12as the supporting points, other auxiliary winding parts15can be included in the middle of the auxiliary coil5to support the middle part, and therefore the same auxiliary coil5can be simultaneously wound around two or more auxiliary winding parts12. In addition, as shown inFIG.9, the enameled wire can be led from a surface123of one auxiliary winding part12to a surface123of the other auxiliary winding part123. As shown inFIG.10, the enameled wire can be led from a welding surface120of one auxiliary winding part12to a welding surface120of the other auxiliary winding part12. As shown inFIG.11, the enameled wire can also be led from a surface123of one auxiliary winding part12to a surface123of the other auxiliary winding part12. Also, as shown inFIG.12, the enameled wire can also be led from a welding surface120of one auxiliary winding part12to a welding surface120of the other auxiliary winding part12, thus forming a slash or crossing structure. In addition to the structures described above, as shown inFIG.13, in some embodiments, it is also possible that the enameled wire is wound around the auxiliary winding part5which is lengthened to form an elongated auxiliary coil5. When the enameled wire is required to extend to the auxiliary winding part12after being wound to form the main coil2, or when the enameled wire is required to extend to the main winding groove104aafter being wound to form the auxiliary coil5, it is necessary for the enameled wire to extend for a distance to arrive at the auxiliary winding parts12or the main winding groove104a. For the regularization of the enameled wire within the distance to make the whole of coils tidier, as shown inFIG.2, in the embodiment, the lower end102are also provided with wire routing grooves102cwhich are located at one side of the lower end102facing the upper end100and extend from the main winding groove104ato sides of the auxiliary winding parts facing the upper end100, namely the sides where the surfaces123are located, so that the enameled wire can transfer between the main winding groove104aand the auxiliary winding parts12through the wire routing grooves102c. The portion of the enameled wire between the main coil2and the auxiliary coils5will be restricted by the wire routing grooves102c, thus forming a tidy appearance. In order to prevent the wire routing grooves102cfrom affecting the winding of the main coil2, the wire routing grooves102ccannot protrude from the surface102dof the lower end102facing the upper end100. Therefore, in the present embodiment, the side of the auxiliary winding parts12facing the upper end100are at a distance from the upper end100in the extension direction of the inserting hole106greater than the distance between the surface102dof the lower end102facing the upper end100and the upper end100in the extension direction of the inserting hole106, and namely the sides of the auxiliary winding parts12facing the upper end100are at a farther distance from the upper end100. In this way, the wire routing grooves102ccan form inclined grooves to gradually move away from the upper end100in an oblique way from the surface102dand finally extend to the auxiliary winding parts12, thus avoiding the wire routing grooves102cfrom protruding from the surface102d. The sides of the auxiliary winding parts12facing the upper end100can be the surfaces123, and can be the bottoms of the position limiting grooves125in the case where position limiting grooves125are provided at the surfaces123. For mechanized production, an attaching mechanism is usually used when transferring the inductance device, and for the convenience of attaching, it is necessary to arrange an attaching surface easy to be attached in the inductance device. With respect to the inductance device, the surface32of the upper magnetic core3facing away from the lower magnetic core4is an integral surface of a large area, and therefore is usually used as an attaching surface. With miniaturization of the inductance device, the surface32has a decreased area to make it more difficult to meet attaching requirements. For the improvement of the attaching effect of the miniaturized inductance device, as shown inFIG.2, in the present embodiment, the top surface100ais also provided with an upper through groove100bto which the inserting hole106extends. It should be noted that the upper through groove100bextends in a direction perpendicular to the extension directions of the auxiliary winding parts12, because it is necessary for the lower magnetic core4to avoid the auxiliary winding parts12and to be arranged oppositely to the upper magnetic core3. Meanwhile, it is also necessary for an attaching structure6to be arranged in the inductance device. When assembling the upper magnetic core3with the inductor framework1, the upper magnetic core3is capped into the upper through groove100b, so that the surface32is flush with the top surface100a, and the attaching structure6simultaneously covers the surface32and at least a portion of the top surface100a(seeFIG.8). In this case, the attaching area includes a portion of the top surface100ain addition to the surface32, thereby increasing the attaching area and improving the attaching effect. In the embodiment, the attaching structure6can be a baffle plate which is attached onto the surface32and at least a portion of the top surface100a. Because the inductance device generates lots of heat in working condition, it is possible to use the baffle plate made from a high temperature resistant insulation material to avoid the damage of the baffle plate. In addition, a high temperature resistant adhesive tape is also used for the attaching structure6. The adhesive tape is wound in the extension direction of the upper through groove100bto cover outer circumferences of the upper magnetic core3and the lower magnetic core4and at least a portion of the top surface100a. The upper through groove100band the lower through groove102bin the embodiment can be arranged simultaneously, or one of them can be arranged separately. If there are both the upper through groove100band the lower through groove102b, the upper through groove100bhas the same extension direction as the lower through groove102b. In this case, it is necessary for the adhesive tape to cover a portion of the top surface100a, the adhesive tape has a width larger than that of the upper magnetic core3and larger than that of the lower magnetic core4. If the lower through groove102bhas the same notch size as the upper through groove100b, the adhesive tape not only goes beyond the upper through groove100bto cover the top surface100aduring winding, but also goes beyond the lower through groove102b. However, the adhesive tape going beyond the lower through groove102bcan affect adversely the welding process, so it is recommended in the embodiment that the lower through groove102bof the inductor framework1is designed to have a notch size larger than that of the upper through groove102a, so as to receive the adhesive tape. Preferably, in the above mentioned inductor framework, the position limiting structure is a position limiting groove configured to receive a portion of the auxiliary coil. Preferably, in the above mentioned inductor framework, the position limiting groove extends in a direction identical and/or perpendicular to the extension direction of the inserting hole. Preferably, in the above mentioned inductor framework, the auxiliary winding part extends at two sides of the lower end symmetrical to the inserting hole. Preferably, in the above mentioned inductor framework, the number of the auxiliary parts is in a range from two to five. Preferably, in the above mentioned inductor framework, four auxiliary winding parts are provided, and any two of the four auxiliary winding parts are symmetrical to each other. Preferably, in the above mentioned inductor framework, the top surface is provided with an upper through groove to which the inserting hole extends, and the auxiliary winding part extends in a direction perpendicular to an extension direction of the upper through groove. Preferably, in the above mentioned inductor framework, the bottom surface is provided with a lower through groove to which the inserting hole extends, and the auxiliary winding part extends in a direction perpendicular to an extension direction of the lower through groove. Preferably, in the above mentioned inductor framework, the top surface is provided with an upper through groove to which the inserting hole extends, an extension direction of the upper through groove is the same as that of the lower through groove, and a notch size of the lower through groove is a larger than that of the upper through groove. Preferably, in the above mentioned inductor framework, the lower end is further provided with a wire routing groove, and the wire routing groove is located at a side of the lower end facing the upper end and extends to a side of the auxiliary winding part facing the upper end from the main winding groove. Preferably, in the above mentioned inductor framework, a distance between the side of the auxiliary winding part facing the upper end and the upper end in the extension direction of the inserting hole is greater than a distance between the side of the lower end facing the upper end and the upper end in the extension direction of the inserting hole, and the wire routing groove is an inclined groove. Preferably, in the above mentioned inductor framework, the inductor framework is an inductor framework of phenolic plastic. Preferably, in the above mentioned inductance device, the main coil and the auxiliary coil are formed by winding with the same enameled wire or different enameled wires. Preferably, in the above mentioned inductance device, the auxiliary coil includes at least two auxiliary coils, and the main coil and at least two of the auxiliary coils are formed by winding with the same enameled wire. Preferably, in the above mentioned inductance device, the auxiliary coil includes at least one auxiliary coil which is wound separately around one of the auxiliary winding part. Preferably, in the above mentioned inductance device, the auxiliary coil includes at least one auxiliary coil, at least one auxiliary coil is wound simultaneously around a plurality of auxiliary winding parts at the same side of the lower end. Preferably, in the above mentioned inductance device, the top surface is provided with an upper through groove to which the inserting hole extends, and the auxiliary winding part extends in a direction perpendicular to an extension direction of the upper through groove, the inductance device further includes an attaching structure; the upper magnetic core is capped onto the upper through groove, a surface of the upper magnetic core facing away from the lower magnetic core is flush with the top surface, and the attaching structure covers both the surface of the upper magnetic core facing away from the lower magnetic core and at least a portion of the top surface. Preferably, in the above mentioned inductance device, the bottom surface is provided with a lower through groove which extends in the same direction as the upper through groove, the inserting hole extends to the lower through groove, and a notch size of the lower through groove is larger than that of the upper through groove; and the attaching structure is an adhesive tape which is wound in the extension direction of the lower through groove to cover an outer circumference of both the upper magnetic core and the lower magnetic core and to cover at least a portion of the top surface. Preferably, in the above mentioned inductance device, the attaching structure is a baffle plate which is attached onto both a surface of the upper magnetic core facing away from the lower magnetic core and at least a portion of the top surface. At least one technical solution adopted by the embodiment of the present application can achieve the following beneficial effects: the inductor framework and the inductance device provided by the embodiment of the present application can weld a portion of the auxiliary coil covering the welding surface with a pad on a PCB during assembling. Because it is unnecessary to reserve a region in the pad for pins to pass through, so the area can be greatly reduced or even completely hidden under the inductor device, thus greatly saving the area of the PCB. The inductance device includes a main coil, an auxiliary coil, an upper magnetic core, a lower magnetic core, and an inductor framework, the main coil is wound in the main winding groove, the auxiliary coil is wound around the auxiliary winding part and covers a portion of the welding surface; the upper magnetic core is capped onto the top surface, the lower magnetic core is capped onto the bottom surface, a side surface of the lower magnetic core facing away from the upper magnetic core does not go beyond the welding surface. The inductor framework and the inductance device provided by the embodiments of the present application can greatly save the area of the PCB. AA The present disclosure may include dedicated hardware implementations such as application specific integrated circuits, programmable logic arrays and other hardware devices. The hardware implementations can be constructed to implement one or more of the methods described herein. Examples that may include the apparatus and systems of various implementations can broadly include a variety of electronic and computing systems. One or more examples described herein may implement functions using two or more specific interconnected hardware modules or devices with related control and data signals that can be communicated between and through the modules, or as portions of an application-specific integrated circuit. Accordingly, the system disclosed may encompass software, firmware, and hardware implementations. The terms “module,” “sub-module,” “circuit,” “sub-circuit,” “circuitry,” “sub-circuitry,” “unit,” or “sub-unit” may include memory (shared, dedicated, or group) that stores code or instructions that can be executed by one or more processors. The module refers herein may include one or more circuit with or without stored code or instructions. The module or circuit may include one or more components that are connected. The above embodiments of this application focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment, without repeated here considering the conciseness of the text. The above descriptions are only embodiments of this application and are not used to be construed as any limitation to the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of the claims of the present application. | 27,687 |
11862369 | DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION The magnets, structures, compositions, methods, and systems of the present invention will be described in detail by reference to various non-limiting embodiments. This description will enable one skilled in the art to make and use the invention, and it describes several embodiments, adaptations, variations, alternatives, and uses of the invention. These and other embodiments, features, and advantages of the present invention will become more apparent to those skilled in the art when taken with reference to the following detailed description of the invention in conjunction with the accompanying drawings. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly indicates otherwise. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as is commonly understood by one of ordinary skill in the art to which this invention belongs. Unless otherwise indicated, all numbers expressing conditions, concentrations, dimensions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and attached claims are approximations that may vary depending at least upon a specific analytical technique. The term “comprising,” which is synonymous with “including,” “containing,” or “characterized by” is inclusive or open-ended and does not exclude additional, unrecited elements or method steps. “Comprising” is a term of art used in claim language which means that the named claim elements are essential, but other claim elements may be added and still form a construct within the scope of the claim. As used herein, the phrase “consisting of” excludes any element, step, or ingredient not specified in the claim. When the phrase “consists of” (or variations thereof) appears in a clause of the body of a claim, rather than immediately following the preamble, it limits only the element set forth in that clause; other elements are not excluded from the claim as a whole. As used herein, the phrase “consisting essentially of” limits the scope of a claim to the specified elements or method steps, plus those that do not materially affect the basis and novel characteristic(s) of the claimed subject matter. With respect to the terms “comprising,” “consisting of,” and “consisting essentially of,” where one of these three terms is used herein, the presently disclosed and claimed subject matter may include the use of either of the other two terms, except when used in Markush groups. Thus in some embodiments not otherwise explicitly recited, any instance of “comprising” may be replaced by “consisting of” or, alternatively, by “consisting essentially of.” The present invention provides a permanent magnet with location-specific magnetic orientation and crystallographic texture. This disclosure describes the structure of permanent magnets with tailored texture as well as methods of controlling solidification to achieve a tailored texture. The methods disclosed herein provide an efficient way to shape the magnetic field induced by a permanent magnet. In some variations, additive manufacturing (e.g., selective laser melting or electron beam melting) is employed to fabricate a permanent magnet voxel by voxel and layer by layer, so that the magnetic orientation of each voxel may be independently aligned via applying a magnetic field during the solidification of each voxel. A “voxel” is a volumetric (3D) pixel. In additive manufacturing, there is solidification of individual voxels so that the magnetic field may be varied voxel-by-voxel if desired. A plurality of voxels forms a single layer having a thickness defined by the voxel height. Additive manufacturing also enables site-specific control of the crystallographic orientation during three-dimensional (3D) printing. The solidification texture depends on crystal structure, lattice strain, and surface attachment kinetics, and is directionally dictated by a maximal thermal gradient during the phase transformation from liquid to solid. Thermal gradients may be controlled during selective laser melting using (a) a laser scan strategy, e.g. locally heating in a predetermined raster pattern and energy intensity and/or (b) an externally applied magnetic field to influence texture evolution. In some embodiments, the magnetic easy axis orientation aligns with a crystallographic orientation in which resistance to demagnetization is maximized. Using the principles of this disclosure, the magnetic performance of a permanent magnet may be improved by controlling crystallographic orientation (texture) of the grains in the microstructure of the permanent magnet. This invention is especially powerful when crystallographic texture control and magnetic orientation are combined during additive manufacturing. The result is a magnet which contains regions with different crystallographic and magnetic orientations, which may be optimized in various ways. Some variations are predicated on favorable orientations of the magnetic easy axis within a magnet architecture. Preferred embodiments enable the control of solidification of additively manufactured or welded microstructures on the order of the single domain limit (e.g., about 1-3 microns) to maximize the resistance to demagnetization in addition to controlling the orientation of the magnetic easy axis. In some embodiments, easy axis alignment is designed into regions of interest, such as surfaces or corners, to improve overall resistance to demagnetization in a bulk magnet. This approach enables fabrication of magnets with a strong field on one side, while the field on the other side is close to zero, for example. Such region optimization is on a length scale (e.g., less than 500 microns) that is infeasible with conventional manufacturing methods which require serial assembly. The present invention increases permanent-magnet performance while potentially reducing manufacturing costs compared to current manufacturing methods described in the Background. Material costs of rare-earth permanent-magnet materials, required for high-performance automotive and aerospace platforms, are significantly reduced by using powder-bed or spray-based additive manufacturing methods. The reason is that a near-net-shape product can be produced with minimal material waste upon finishing and with a high rate of material recycling. By improving the demagnetization resistance of magnetic architectures through tailored crystallographic textures, the mass and volume efficiency of magnets can be improved. This, in turn, reduces the necessary material mass for matching performance to improve motor efficiencies. In addition, the invention provides the capability to produce optimized magnet shapes which optimize field utility. The ability to use higher magnetic fields enables efficiency gains in permanent-magnet motors. All of these factors improve permanent-magnet motor efficiencies and decrease the overall cost to manufacture. Some variations provide a permanent-magnet structure comprising:a region having a plurality of magnetic domains and a region-average magnetic axis, wherein each of the magnetic domains has a domain magnetic axis, wherein each domain magnetic axis is substantially aligned with the region-average magnetic axis, and wherein the plurality of magnetic domains is characterized by an average magnetic domain size; andwithin the region, a plurality of metal-containing grains, wherein the plurality of metal-containing grains is characterized by an average grain size,wherein each of the magnetic domains has a domain easy axis that is dictated by a crystallographic texture of the metal-containing grains;wherein the region has a region-average easy axis based on average value of the domain easy axis within the region; andwherein the region-average magnetic axis and the region-average easy axis form a region-average alignment angle θ that has a θ standard deviation of less than 30° based on alignment-angle variance within the plurality of magnetic domains. A “permanent magnet” (or “hard magnet”) means a magnet with an intrinsic magnetic coercivity of 1000 A/m (amperes per meter) or greater. For example, a permanent magnet may be selected from the group consisting of a NdFeB magnet, a NdDyFeB magnet, a FeCoCr magnet, a FeAlNiCo magnet, a SmCo magnet, and combination thereof. The “magnetic axis” is the straight line joining two poles of a magnetized body. The torque exerted on the magnet by a magnetic field in the direction of the magnetic axis equals 0. The “crystallographic texture” is the distribution of crystallographic orientations of a polycrystalline material. A “crystallographic orientation” is defined by the plane (Miller) indices of the lattice plane of a crystal. There may be one region or many regions. When there are multiple regions, the individual region-average magnetic axes and the individual region-average easy axes may vary spatially, such as different orientations in different corners of the structure. Regions may be bulk regions contained in the interior of the permanent-magnet structure and/or surface regions contained at the surface of the permanent-magnet structure. The magnetic domain averages and easy axis averages may vary spatially—e.g., different orientations in different corners—in different areas of the permanent-magnet structure. The variations across regions may be regular or irregular. Each metal-containing grain has a grain easy axis. If a magnetic domain is the same as a grain, as in some embodiments, then the grain easy axis is the same as the domain easy axis. But if a magnetic domain is larger than one grain (e.g., 5 grains), then the domain easy axis is dictated by easy axes of all individual grains in the magnetic domain. The metal-containing grains may contain a metal selected from the group consisting of Fe, Ni, Al, Co, Cr, Nd, B, Sm, Dy, and combinations thereof. In some embodiments, the metal-containing grains contain a metal alloy selected from the group consisting of NdFeB, FeCoCr, AlNiCo, SmCo, Dy2O3, SrRuO3, and combinations thereof. When there are multiple regions, there may be different compositions in those regions, including different types or amounts of metal-containing grains, for example. An example is a surface region with a different composition than a bulk region of the permanent-magnet structure. The selection of components in the overall composition will be dependent on the desired magnet properties and should be considered on a case-by-case basis. Someone skilled in the art of material science or metallurgy will be able to select the appropriate materials for the intended use, based on the information provided in this disclosure. In some embodiments, the region-average alignment angle θ is from −10° to 10°, from −5° to 5°, from −2° to 2°, or from −1° to 1°. In other embodiments, the region-average alignment angle θ is selected from 0° to 90°. In certain embodiments, the region-average alignment angle θ is 0°. In certain embodiments, the region-average alignment angle θ is 90°. The region-average alignment angle θ standard deviation may be less than 20°, less than 10°, or less than 5°, for example. In some embodiments, the region-average easy axis has a standard deviation that is less than 25°, less than 20°, less than 10°, or less than 5°. This standard deviation is calculated based on all of the domain easy axes within a given region. In certain embodiments, each domain easy axis is substantially aligned with the region-average easy axis, in which case the standard deviation may be less than 2°, less than 1°, less than 0.5°, less than 0.1°, or about 0°. A magnetic domain may contain an individual metal-containing grain. Typically, a magnetic domain contains multiple metal-containing grains. In some embodiments, the average magnetic domain size is about the same as the average grain size. In other embodiments, the average magnetic domain size is larger than the average grain size. The average magnetic domain size may be from 1 micron to 1000 microns, for example. In some embodiments, the average magnetic domain size is from 10 microns to 10 millimeters. The average grain size may be from 0.1 microns to 50 microns, for example. An exemplary average grain size is from about 1 micron to about 5 microns. Grain sizes may be measured by a variety of techniques, including dynamic light scattering, laser diffraction, image analysis, or sieve separation, for example. Dynamic light scattering is a non-invasive, well-established technique for measuring the size and size distribution of particles typically in the submicron region, and with the latest technology down to 1 nanometer. Laser diffraction is a widely used particle-sizing technique for materials ranging from hundreds of nanometers up to several millimeters in size. Exemplary dynamic light scattering instruments and laser diffraction instruments for measuring particle sizes are available from Malvern Instruments Ltd., Worcestershire, UK. Image analysis to estimate particle sizes and distributions can be done directly on photomicrographs, scanning electron micrographs, or other images. In some embodiments, the metal-containing grains are substantially equiaxed grains. In other embodiments, the metal-containing grains are substantially columnar grains or elongated grains. In certain embodiments, the metal-containing grains are a combination of substantially equiaxed grains and substantially columnar grains. Grains may be surrounded by a grain boundary layer with a different composition and magnetic properties. In the permanent-magnet structure, the region may have a characteristic length scale selected from 100 microns to 1 meter, such as about 1 mm, 1 cm, or 10 cm, for example. In some permanent-magnet structures, there is at least one additional region having a plurality of additional magnetic domains and a plurality of metal-containing grains. The additional region may have a different composition compared to the bulk region(s). In some embodiments, the additional region is contained at a corner or edge of the permanent-magnet structure. In these or other embodiments, the additional region is contained at a surface of the permanent-magnet structure. For example, a corner or edge of a cuboid permanent magnet may have crystallographic and magnetic orientation facing out of the corner whereas the rest of the magnet has crystallographic and magnetic orientation facing towards a bulk region internally. In some embodiments, the permanent-magnet structure is contained within a Halbach array. Halbach arrays are conventionally assembled by bonding individually uniform texture and magnetic orientation magnets in a sequence of orientations that accentuates the field on one side of the magnet at the expense of the field on the opposing side. This conformation sacrifices field uniformity due to the large size (>1 mm) of the magnets used conventional Halbach arrays. By using the principles disclosed herein, a Halbach array configuration may be constructed at the micron scale, thereby enabling more-uniform, high-flux magnetic fields to be generated in the permanent magnet. In some embodiments, the permanent-magnet structure is an additively manufactured structure. Additive manufacturing is discussed in more detail below. In some embodiments, the permanent-magnet structure is a welded structure. The permanent-magnet structure may be contained within a solid bulk magnet. Alternatively, the permanent-magnet structure may be contained within a porous magnet. The porosity may vary, such as from 0% to about 50%, or from 0% to about 20%, by volume. Additionally there may be some topology including irregular surfaces, discontinuous interfaces, internal roughness, etc. The present invention will now be further described, including with reference to the accompanying drawings that are not intended to limit the scope of the invention. The drawings are not necessarily to scale. FIG.1depicts a conventional isotropic magnet (left side) and a conventional anisotropic magnet (right side). In a conventional die-pressed isotropic magnet, crystallographic orientation of grains is non-uniform and random, and magnetic alignment is along the same direction throughout the volume of the magnet. In a conventional die-pressed anisotropic magnet, magnetic alignment is along the same direction throughout the volume of the magnet, and there is some alignment and uniformity of crystallographic orientation of grains. The anisotropic variant generates a higher-energy product due to the alignment along the easy axis. In contrast,FIG.2depicts a solid, bulk magnet with a magnetic field applied in three different directions within the three regions shown. The crystallographic orientation has not been controlled and is therefore not shown. In the permanent-magnet structure ofFIG.2, there is location-specified magnetization orientation (but not location-specified crystallographic texture), in reference to the easy axis orientation, throughout the total volume. The magnetic orientation changes by 90° across each region from left to right inFIG.2. Because the crystallographic orientation has not been controlled, it is statistically unlikely to be aligned with the magnetic orientation. That is, inFIG.2, a region-average magnetic axis and a region-average easy axis form a region-average alignment angle θ that may have a high θ standard deviation (such as 30° or higher) based on alignment-angle variance within the plurality of magnetic domains. FIG.3depicts a solid, bulk magnet with magnetic field in three different directions in the three regions shown. Additionally, the crystallographic orientation has been controlled through thermal gradients in solidification (e.g., from additive manufacturing or welding). In the permanent-magnet structure ofFIG.3, there is location-specified magnetization orientation and crystallographic texture, in reference to the easy axis orientation, throughout the total volume. The magnetic orientation changes by 90° from the first (left) regions to the second (middle) region, and then changes by 180° from the second to the third (right) region inFIG.3. The crystallographic easy axis changes by approximately 90° across each regions from left to right inFIG.3. In the first two regions, the easy axis is closely aligned with the magnetic orientation, resulting in increased energy product. In each ofFIG.2andFIG.3, the height of the bulk magnet may be on the order of 1 cm, while the individual grain size may be on the order of 1 to 5 microns, for example. Thus the squares depicting multiple grains and orientations represent a small portion of the volume of each region. The difference between the structures inFIGS.2and3is that inFIG.2, magnetic orientation is controlled but the crystallographic orientation is not controlled, while inFIG.3, both of the magnetic orientation and the crystallographic orientation are controlled. In either case, the magnetization orientation may be designed with specific orientations in different regions (or voxels) of the permanent-magnet structure. Magnetic domains may be larger than crystal grains. In certain preferred embodiments, each individual grain is individually tailorable, as noted inFIG.3(magnetic domains=crystal grains). Control of both crystallographic texture and magnetization direction in permanent magnets may utilize combinations of magnetization direction and easy axis alignment (grain orientations). This control may augment magnetic field distribution and tailor the field shape generated by the permanent magnet. The voxel size of the controlled region may be 10 μm×10 μm×10 μm in size, for example, dependent on the additive-manufacturing, welding, or other method to control the local microstructure. In certain embodiments, single magnetic domains with uniform magnetic orientation exist in single grains which can be individually oriented crystallographically. Interfaces between domains are susceptible to domain reversal (demagnetization) due to a lower barrier to nucleation. By matching a single magnetic domain with a single grain, the resistance to domain reversal within that grain is minimized, raising the energy barrier to nucleation of a reverse domain. The local orientation of magnetization may be directionally tailored, even if unaligned with the easy axis, to shape the magnetic field generated by the permanent-magnet structure. This is depicted inFIG.4which shows an exemplary permanent magnet with a shaped field due to tailored magnetization, with north (N)-south (S) axis orientation having angle θ from normal direction. The permanent-magnet structure ofFIG.3is a preferred structure due to location-specified magnetization orientation as well as location-specified crystallographic orientation. Location-specified magnetization and crystallographic orientation may also be referred to as optimized, designated, or pre-selected orientations, since the orientations are designed into the structure intentionally, not randomly generated during fabrication. Location-specified magnetization and crystallographic orientation, within various regions of the structure, may be optimized to account for the anticipated use conditions. For example, designated orientations may be desirable in locations of high susceptibility of demagnetization. These regions arise when demagnetizing field concentration is high or when orientations with respect to the field direction change rapidly, such as at corners. An important example is the problem of demagnetization in electric motors. The magnetization of permanent magnets is typically parallel to the long surface. The applied magnetic flux density which magnets experience in electric motor applications is higher at the corners. Thus, the corners demagnetize easier, limiting performance. Also, at magnet corners, edges, or surfaces, there can be severe local heating that raises the local temperature above the Curie temperature of the magnetic material. Normally this would mean that the material loses its persistent magnetic field. Conventionally, these problems are mitigated by shaping the magnetic field of the permanent magnets in an electric motor via arranging many smaller magnets into a larger Halbach array and adhesively bonding the smaller magnets together. By contrast, demagnetization can be prevented or at least inhibited at corners, edges, or surfaces by tailoring the crystallographic texture (easy axis alignment). Also, the local composition at the corners, edges, or surfaces that experience local heating may be optimized using a different composition compared to the bulk region. For example, rare earth elements may be included, or at a higher concentration, at corners, edges, or surfaces, or other additional regions compared to the bulk region. Optimal easy axis orientations with respect to the external field preferably increase the energetic barrier to the nucleation of a reverse magnetic domain. Such optimization preserves magnetization in higher applied fields. In magnetocrystalline anisotropic materials, there may exist more than one easy axis dependent on crystal structure which describes the magneto-crystalline anisotropy. In the case of multiple easy axes, the texture configuration may be chosen in any of the equivalent directions, which may assist in texture control. The magnetization and crystallographic orientations may or may not be co-aligned in the magnet, even when both of these orientations are controlled. In some preferred embodiments, the magnetic orientation and crystallographic orientation are co-aligned. The magnetization and crystallographic orientations do not need to be co-aligned in the magnet to realize improved demagnetization benefits. In some embodiments, the magnetization and crystallographic orientations are controlled to achieve an average alignment angle between them. FIG.5depicts several examples of magnetic configurations for different orientations that may be employed. The macroscopic and microscopic magnetic fields ({right arrow over (M)}) are only meant to distinguish tailored orientations at specific regions (corners and edges) compared to the bulk region of each structure, without implying a necessary length scale. Note also that while the arrows inFIG.5depict magnetic orientations, similar structures may be drawn in which the arrows denote crystallographic orientations, or multiple sets of arrows denoting magnetic orientations along with crystallographic orientations (such as inFIG.3). The torque generated in two dimensions varies with (sin θ)2where the maximum torque, and resistance to demagnetization, is generated perpendicular to the opposing magnetic field. The torque generated in three dimensions, and the 3D resistance to demagnetization as a function of position, may be modeled by one skilled in the art. 3D modeling may be used to aid in pre-selecting regions of interest for tailoring the crystallographic texture. For example, COMSOL Multiphysics® simulation software may be utilized to computationally model and design a permanent-magnet structure. The permanent-magnet structure is characterized by a total energy product that is the maximum of the magnetic remanence times magnetic coercivity for the structure. The permanent-magnet structure may have a total energy product of greater than 50 kJ/m3, such as about, or at least about, 100 kJ/m3, 200 kJ/m3, 300 kJ/m3, 400 kJ/m3, or 500 kJ/m3, including all intervening ranges. It is known to be difficult to attain high total energy product without using rare-earth metals. Although some embodiments herein incorporate rare-earth metals at least within certain regions of the structure, other embodiment incorporate no rare-earth metals at all (except for impurities). In certain embodiments employing additive manufacturing to control local solidification, the permanent-magnet structure may have a total energy product of greater than 50 kJ/m3, such as about, or at least about, 75 kJ/m3, 100 kJ/m3, 125 kJ/m3, 150 kJ/m3, 175 kJ/m3, or 200 kJ/m3, including all intervening ranges. Tuned anisotropy may be utilized to get the same as, or close to, rare-earth magnetic performance even if rare-earth metals are not incorporated at all or only at critical locations, such as corners. The design of magnetic orientation and crystallographic orientation enables optimization of magnet properties in non-uniform demagnetizing fields present in nearly every application. In an opposing demagnetizing field, magnetic orientations near the edges or surfaces of permanent-magnet structures become unaligned or at least become sub-optimal in their orientations. By selectively manipulating the local orientation in these regions of rapidly demagnetizing field orientation, to instead resist demagnetization, the ceiling for operating conditions (e.g., temperature and field strength) can be raised. Performance can be improved for demanding motor applications, especially electric vehicle propulsion. In some embodiments, magnetic domains are oriented to augment fields on one side of a structure, such as (but not limited to) a Halbach array. A Halbach array may be configured to cause cancellation of magnetic components, resulting in a one-sided magnetic flux, as depicted inFIG.6. A Halbach array is an arrangement of permanent magnets that augments the magnetic field on one side of the array while cancelling the field to zero or near zero on the other side. An advantage of a one-sided flux distribution is that the field is twice as large on the side on which the flux is confined. Another advantage is the absence of a stray field on the opposite side, which helps with field confinement. Halbach arrays may be used for brushless direct-current motors, free-electron lasers, and wiggler magnets for particle accelerators. Some preferred variations of the invention will now be further described in reference to additive manufacturing. It will be understood that the invention is not limited to additive manufacturing, but additive manufacturing is especially able to take advantage of many principles taught herein. Additive manufacturing provides control of crystallographic orientation during 3D printing. The resultant crystallographic orientation of a grain is dependent on several contributing thermodynamic driving forces. One such factor is the direction of the maximum thermal gradient, in which solidifying cubic crystals tend to preferentially grow with a <100> orientation. The thermal gradient can be controlled using a laser scan strategy by locally heating with a variety of spatially and/or temporally varying patterns. The formation of crystallographic texture can also be tailored during solidification and subsequent solid-state transformations through the application of an external magnetic field, potentially producing more texture uniformity with specified locality and direction. Tailorable magnetization may be achieved by varying local magnetic coercivity when using laser or electron beam heat treatment. In some embodiments, the magnetic performance is improved by controlling crystallographic orientation (texture) of the grains in addition to the magnetization orientation in the microstructure. This control is especially powerful when crystallographic texture and magnetic orientation are both tailored in a synergistic way during additive manufacturing. To this end, the grains may be crystallographically oriented in the (or a) direction that allows the highest remanent magnetization; simultaneously, a magnetic field may be applied to orient the magnetization in that same direction. The result is a magnet with optimal crystallographic and magnetic orientation and therefore the maximum energy product. Magnetic materials may also be optimized by 3D tailoring of crystallographic texture in regions susceptible to demagnetization. By employing additive manufacturing, local thermal, magnetic, and stress fields may be manipulated in the production of permanent magnets having selected crystallographic texture(s) with location specificity. In some embodiments, without limitation, an additive-manufacturing feedstock is a powder that is surface-functionalized with a plurality of nanoparticles. The nanoparticles may promote heterogeneous nucleation in the melt pool to induce equiaxed grain growth. In some embodiments, the nanoparticles are magnetic nanoparticles. Some variations provide a method of making a permanent magnet with tailored magnetism, the method comprising:(a) providing a feedstock composition containing one or more magnetic or magnetically susceptible materials;(b) exposing a first amount of the feedstock composition to an energy source for melting in a scan direction, thereby generating a first melt layer;(c) solidifying the first melt layer in the presence of an externally applied magnetic field, thereby generating a magnetic metal layer containing a plurality of individual voxels;(d) optionally repeating steps (b) and (c) a plurality of times to generate a plurality of solid layers by sequentially solidifying a plurality of melt layers in a build direction, thereby generating a plurality of magnetic metal layers; and(e) recovering a permanent magnet comprising the magnetic metal layer,wherein the externally applied magnetic field has a magnetic-field orientation, defined with respect to the scan direction, that is selected to control (i) a magnetic axis within the magnetic metal layer and/or (ii) a crystallographic texture within the magnetic metal layer. In some embodiments, the magnetic-field orientation is selected to control the crystallographic texture but not necessarily the magnetic axis within the magnetic metal layer. In some embodiments, the magnetic-field orientation is selected to control the magnetic axis but not necessarily the crystallographic texture within the magnetic metal layer. In preferred embodiments, the magnetic-field orientation is selected to control both the crystallographic texture as well as the magnetic axis within the magnetic metal layer. The magnetic or magnetically susceptible material in the feedstock composition may include elemental metals, metal alloys, ceramics, metal matrix composites, or combinations thereof, for example. The feedstock composition may be in the form of a powder, a wire, or a combination thereof, for example. The magnetic or magnetically susceptible material may be selected from the group consisting of Fe, Co, Ni, Cu, Cr, Mg, Mn, Zn, Sr, Ce, Si, B, C, Ba, Tb, Pr, Sm, Nd, Dy, Gd (gadolinium), and combinations or alloys thereof. Exemplary alloys that are magnetic or magnetically susceptible include, but are not limited to, Fe2O3, FeSi, FeNi, FeZn, MnZn, NdFeB, NdDyFeB, FeCoCr, FeAlNiCo, AlNiCo, SmCo, Dy2O3, SrRuO3, and combinations thereof. In some embodiments, without limitation, an additive-manufacturing feedstock is a powder that is surface-functionalized with a plurality of nanoparticles. The nanoparticles may promote heterogeneous nucleation in the melt pool to induce equiaxed grain growth. In some embodiments, the nanoparticles are magnetic or magnetically susceptible and become magnetically aligned during solidification to produce a crystallographic texture dictated by an external magnetic field. Alternatively, or additionally, the nanoparticles—whether or not they are magnetic or magnetically susceptible—may induce growth of a magnetic phase which could then be magnetically aligned with the magnetic-field direction. A magnetically susceptible material is a material that will become magnetized in an applied magnetic field. Magnetic susceptibility indicates whether a material is attracted into or repelled out of a magnetic field. Paramagnetic materials align with the applied field and are attracted to regions of greater magnetic field. Diamagnetic materials are anti-aligned and are pushed toward regions of lower magnetic fields. On top of the applied field, the magnetization of the material adds its own magnetic field. The magnetizability of materials arises from the atomic-level magnetic properties of the particles of which they are made, typically being dominated by the magnetic moments of electrons. The energy source may be a laser beam, an electron beam, or both a laser beam and an electron beam. The energy source preferably imposes a thermal gradient that melts a portion of the feedstock composition in a scan direction, rather than bulk melting the entire feedstock composition. In some embodiments, steps (b) and (c) utilize a technique selected from the group consisting of selective laser melting, electron beam melting, laser engineered net shaping, selective laser sintering, direct metal laser sintering, integrated laser melting with machining, laser powder injection, laser consolidation, direct metal deposition, directed energy deposition, plasma arc-based fabrication, ultrasonic consolidation, electric arc melting, and combinations thereof. In some embodiments, step (b) is also conducted in the presence of the externally applied magnetic field, along with step (c). Optionally, the magnetic-field orientation may be adjusted during step (b). Steps (b) and (c) together may be referred to as additive manufacturing or welding. When step (d) is employed to generate a plurality of solid layers by sequentially solidifying a plurality of melt layers in a build direction, then steps (b) and (c) together are typically referred to as additive manufacturing or 3D printing. When step (d) is conducted, the magnetic-field orientation may be adjusted in the build direction. The magnetic-field orientation may be adjusted at every build layer, or may switch back and forth between two different orientations for successive layers, or may incrementally change angle as the build proceeds, as just a few examples of build strategies. In some preferred embodiments, the magnetic-field orientation is adjusted during step (c), i.e. during solidification of the first melt layer. For example, after some voxels have been formed in a first melt layer, the magnetic-field orientation may be adjusted, after which more voxels are formed in the first melt layer. In some embodiments, the magnetic-field orientation is selected to control voxel-specific magnetic axes within the plurality of individual voxels contained within the magnetic metal layer. In these or other embodiments, the magnetic-field orientation is selected to control voxel-specific crystallographic textures within the plurality of individual voxels contained within the magnetic metal layer. A “voxel” is a volumetric (3D) pixel. A plurality of voxels forms a single layer having a thickness defined by the voxel height. In some embodiments, the individual voxels are defined by a characteristic voxel length scale selected from about 50 microns to about 1000 microns. In certain embodiments, the characteristic voxel length scale is selected from about 100 microns to about 500 microns. An exemplary voxel is on the order of 100 μm×100 μm×100 μm. Another exemplary voxel is on the order of 10 μm×10 μm×10 μm. A voxel may be cubic in geometry, but that is not necessary. For example, a voxel may be rectangular or may have an irregular shape. For an arbitrary voxel geometry, there is a characteristic voxel length scale that is equivalent to the cube root of the average voxel volume. The characteristic voxel length scale may be about, at least about, or at most about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 40, 50, 75, 100, 125, 150, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, or 1000 microns, including all intervening ranges (e.g., 100-500 microns). The characteristic voxel length scale is typically a function of the laser or electron beam intensity, beam diameter, scan speed, and properties (e.g., kinematic viscosity) of the material being fabricated. In preferred embodiments utilizing additive manufacturing, there is solidification of individual voxels and the magnetic field may be varied voxel-by-voxel, if desired. Using a highly localized energy source, and potentially using different compositions during fabrication, small voxels of a structure can be created with specific crystal orientations and magnetic properties, independently of other voxels. Depending on the intensity of the energy delivered, each voxel may be created by melting and solidification of a starting feedstock or by sintering or other heat treatment of a region of material, for example. During solidification, a molten form of a voxel produces one or more solid grains with individual crystal structures. In some embodiments, solidified voxels contain single grains. In other embodiments, solidified voxels contain a plurality of grains having some distribution of crystallographic orientations and magnetic orientations. Geometrically, an individual voxel may be the same size as an individual grain, or may be larger than an average grain size within a magnetic metal layer. In various embodiments, an average voxel contains about, at least about, or at most about 1, 1.5, 2, 2.5, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 50, 75, or 100 grains, including all intervening ranges. When a voxel contains a plurality of grains each having its own crystallographic orientation and magnetic easy axis, the voxel will have a voxel-average crystallographic orientation and a voxel-average magnetic easy axis. In some embodiments, a voxel is configured such that all grains have the same or similar crystallographic orientations and/or magnetic easy axes. In other embodiments, a voxel is configured such that individual grains have different crystallographic orientations and/or magnetic easy axes. A magnetic metal layer from additive manufacturing or welding has crystallographic texture arising from individual grains which, in turn, form voxels. There is a magnetic easy axis for each grain, an average magnetic easy axis for each voxel, and an average magnetic easy axis for the magnetic metal layer. Using the principles of this disclosure, there may be varying degrees of alignment between these hierarchical magnetic easy axes. In certain embodiments, a voxel contains a plurality of grains with a narrow crystallographic orientation distribution along the easy axis of the crystal as well as co-aligned magnetic domains contained within each grain. This co-alignment produces the maximum total remanent magnetic flux for the voxel. In a larger structure with a plurality of voxels, there may be a narrow crystallographic orientation distribution along the easy axis as well as co-aligned magnetic domains contained within each voxel. This co-alignment produces the maximum total remanent magnetic flux for the structure. The grain sizes may vary widely, such as from about 0.1 microns to about 1000 microns. In various embodiments, the average grain size (within a given voxel or within the overall structure) may be about, at least about, or at most about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 75, 100, 125, 150, 200, 250, 300, 350, 400, 500, 600, 700, 800, 900, or 1000 microns. When step (d) is conducted, to generate a plurality of solid layers by sequentially solidifying a plurality of melt layers in a build direction, the magnetic-field orientation may be adjusted in the build direction. In other words, the magnetic-field orientation may be different for one layer versus another layer, in addition to variations of the magnetic-field orientation within a layer (voxel-specific magnetic-field orientations). The atomic structure of a crystal introduces preferential directions for magnetization. This is referred to as magnetocrystalline anisotropy. A “magnetic easy axis” is a direction inside a crystal, along which a small applied magnetic field is sufficient to reach the saturation magnetization. There can be a single easy axis or multiple easy axes. A “magnetic hard axis” is a direction inside a crystal, along which a large applied magnetic field is needed to reach the saturation magnetization. There will be a magnetic easy axis and a magnetic hard axis whether or not a magnetic field is actually being applied. The magnetic easy axis is different from the magnetic axis. A magnetic axis is only present when a magnetic field is actually applied, whereas a magnetic easy axis is a fixed property of a given crystalline material. In some embodiments of the invention, the magnetic-field orientation may be selected to control voxel-specific magnetic easy axes within the plurality of individual voxels contained within the magnetic metal layer. In some embodiments, the individual voxels are substantially magnetically aligned with each other, in reference to the magnetic easy axes of each voxel within a given magnetic metal layer. By “substantially magnetically aligned” is it meant that there is a standard deviation that is less than 25°, less than 20°, less than 10°, or less than 5°, calculated based on all of the magnetic easy axes within the magnetic metal layer. In certain embodiments, all magnetic easy axes are substantially aligned, such that the standard deviation is less than 2°, less than 1°, less than 0.5°, less than 0.1°, or about 0°. Remanence measurements may be used to determine the alignment of magnetic easy axes. See McCurrie, “Determination of the degree of easy axis alignment in uniaxial permanent magnets from remanence measurements”Journal of Applied Physics52, 7344 (1981), which is hereby incorporated by reference. In some preferred embodiments, the magnetic-field orientation is selected to control voxel-specific magnetic axes as well as voxel-specific magnetic easy axes within the plurality of individual voxels contained within the magnetic metal layer, wherein the voxel-specific magnetic axes are substantially aligned with the voxel-specific magnetic easy axes for at least a portion of the magnetic metal layer. In certain embodiments, the voxel-specific magnetic axes are substantially aligned with the voxel-specific magnetic easy axes for all of the magnetic metal layer. In other embodiments, the magnetic-field orientation is selected to control voxel-specific magnetic axes as well as voxel-specific magnetic easy axes within the plurality of individual voxels contained within the magnetic metal layer, wherein the voxel-specific magnetic axes are configured to be at angles with the voxel-specific magnetic easy axes for at least a portion of the magnetic metal layer. In some methods, conditions in step (b) and/or step (c) are controlled such that thermal gradients assist in generating the crystallographic texture within the magnetic metal layer. In some embodiments, different feedstock compositions, each comprising one or more magnetic or magnetically susceptible materials, are exposed to the energy source. The crystallographic texture may be adjusted during the method by performing step (b), step (c), and optionally step (d) at different times using different feedstock compositions. Different feedstock compositions may be not only different species, but also different concentrations of the same species. Optionally, different feedstock compositions, each comprising one or more magnetic or magnetically susceptible surface-modifying particles, are exposed to the energy source, and the crystallographic texture is adjusted during the method by performing step (b), step (c), and optionally step (d) at different times using the different feedstock compositions. In certain embodiments, neither the base particles nor the surface-modifying particles are magnetic or magnetically susceptible, but during fabrication, grains are produced which are magnetic or magnetically susceptible. An externally applied magnetic field may align those grains during solidification. Different feedstock compositions also enable the fabrication of graded compositions. For instance, the concentration of magnetic rare earth elements may be adjusted throughout a magnetic structure. One example employs local doping of Dy, Nd, or Yb in areas that are susceptible to demagnetization. Local doping may be achieved via spray additive processes, for example. Some embodiments optimize the crystallographic texture site-specifically throughout the volume of the magnet. In contrast to conventionally processed magnetic materials with a single easy axis orientation, or a narrow distribution of easy axis orientations, texture-controlled permanent magnets disclosed herein may possess easy axis orientations tailored to resist demagnetizing fields in regions of high susceptibility of demagnetization. Such regions may exist where demagnetizing field concentration is high and/or where orientations with respect to the magnetic field direction change rapidly, such as at corners. Interfaces between domains are susceptible to domain reversal (demagnetization) due to a relatively low barrier to nucleation. Optimal easy axis orientations with respect to the external magnetic field preferably increase the energy barrier to nucleation of a reverse magnetic domain, thereby preserving magnetization. For example, by matching a single magnetic domain with a single grain, the resistance to domain reversal within that grain is minimized, raising the energy barrier to nucleation of a reverse domain. In general, the geometry of the feedstock composition is not limited and may be, for example, in the form of powder particles, wires, rods, bars, plates, films, coils, spheres, cubes, prisms, cones, irregular shapes, or combinations thereof. In certain embodiments, the feedstock composition is in the form of a powder, a wire, or a combination thereof (e.g., a wire with powder on the surface). When the feedstock composition is in the form of powder, the powder particles may have an average diameter from about 1 micron to about 500 microns, such as about 10 microns to about 100 microns, for example. When the feedstock composition is in the form of a wire, the wire may have an average diameter from about 10 microns to about 1000 microns, such as about 50 microns to about 500 microns, for example. The energy source for additive manufacturing may be provided by a laser beam, an electron beam, alternating current, direct current, plasma energy, induction heating from an applied magnetic field, ultrasonic energy, other sources, or a combination thereof. Typically, the energy source is a laser beam or an electron beam. Process steps (b) and (c) may utilize a technique selected from the group consisting of selective laser melting, electron beam melting, laser engineered net shaping, selective laser sintering, direct metal laser sintering, integrated laser melting with machining, laser powder injection, laser consolidation, direct metal deposition, wire-directed energy deposition, plasma arc-based fabrication, ultrasonic consolidation, and combinations thereof, for example. In certain embodiments, the additive manufacturing process is selected from the group consisting of selective laser melting, energy-beam melting, laser engineered net shaping, and combinations thereof. Selective laser melting utilizes a laser (e.g., Yb-fiber laser) to provide energy for melting. Selective laser melting is designed to use a high power-density laser to melt and fuse metallic powders together. The process has the ability to fully melt the metal material into a solid 3D part. A combination of direct drive motors and mirrors, rather than fixed optical lens, may be employed. An inert atmosphere is usually employed. A vacuum chamber can be fully purged between build cycles, allowing for lower oxygen concentrations and reduced gas leakage. Selective laser melting is a type of powder bed-based additive manufacturing. Electron beam melting uses a heated powder bed of metal that is then melted and formed layer by layer, in a vacuum, using an electron beam energy source similar to that of an electron microscope. Metal powder is welded together, layer by layer, under vacuum. Electron beam melting is another type of powder bed-based additive manufacturing. Laser engineering net shaping is a powder-injected technique operates by injecting metal powder into a molten pool of metal using a laser as the energy source. Laser engineered net shaping is useful for fabricating metal parts directly from a computer-aided design solid model by using a metal powder injected into a molten pool created by a focused, high-powered laser beam. Laser engineered net shaping is similar to selective laser sintering, but the metal powder is applied only where material is being added to the part at that moment. Note that “net shaping” is meant to encompass “near net” fabrication. Direct metal laser sintering process works by melting fine powders of metal in a powder bed, layer by layer. A laser supplies the necessary energy and the system operates in a protective atmosphere, typically of nitrogen or argon. Another approach utilizes powder injection to provide the material to be deposited. Instead of a bed of powder that is reacted with an energy beam, powder is injected through a nozzle that is then melted to deposit material. The powder may be injected through an inert carrier gas or by gravity feed. A separate shielding gas may be used to protect the molten metal pool from oxidation. Directed energy deposition utilizes focused energy (either an electron beam or laser beam) to fuse materials by melting as the material is being deposited. Powder or wire feedstock can be utilized with this process. Powder-fed systems, such as laser metal deposition and laser engineered net shaping, blow powder through a nozzle, with the powder melted by a laser beam on the surface of the part. Laser-based wirefeed systems, such as laser metal deposition-wire, feed wire through a nozzle with the wire melted by a laser, with inert gas shielding in either an open environment (gas surrounding the laser), or in a sealed gas enclosure or chamber. Powder bed-based additive manufacturing is preferred for its ability to produce near-net-shape products as well as the smaller tailorable voxel size (such as about 200 μm or less) compared to directed energy deposition (conventionally >500 μm). Some embodiments utilize wire feedstock and an electron beam heat source to produce a near-net shape part inside a vacuum chamber. An electron beam gun deposits metal via the wire feedstock, layer by layer, until the part reaches the desired shape. Then the part optionally undergoes finish heat treatment and machining. Wire can be preferred over powder for safety and cost reasons. Additive manufacturing provides the opportunity to tailor local structure voxel-by-voxel in a serial, layered process. A processed voxel is the volume affected by heat input from the direct energy source in a layer-based approach, which volume includes the melt pool as well as the surrounding heat-affected zone. The solidification crystallographic texture may be controlled by the direction of heat extraction. In addition to the thermal field, a magnetic field may be applied during processing to control both crystallographic texture and magnetization orientation. The external magnetic field may be generated by means of an induction coil, multiple induction coils, a permanent magnet, or an array of permanent magnets, for example. In some embodiments, the additively manufactured permanent magnet has a microstructure with a crystallographic texture that is not solely oriented in the additive-manufacturing build direction. For example, the solid layers may have differing primary growth-direction angles with respect to each other. The method is not limited in principle to the number of solid layers that may be fabricated. A “plurality of solid layers” in step (d) means at least 2 layers, such as at least 10 individual solid layers. The number of solid layers may be much greater than 10, such as about 100, 1000, or more. As noted earlier, in the case of welding or single-layer manufacturing, there may be a single layer in the final structure. Multiple-layer welding is another embodiment. The plurality of solid layers may be characterized by an average layer thickness of at least 10 microns, such as about 10, 20, 30, 40, 50, 75, 100, 150, or 200 microns, for example. Each solid layer may contain a number of voxels. In a special case for a substantially vertical build (e.g., a narrow column), there may be a single voxel per layer. The average number of voxels per layer may be about, at least about, or at most about 2, 3, 4, 5, 10, 20, 30, 40, 50, 100, 150, 200, 300, 400, 500, 600, 700, 800, 900, or 1000, including all intervening ranges, for example. One or more solid layers may have a microstructure with equiaxed grains. A microstructure that has “equiaxed grains” means that at least 90 vol %, preferably at least 95 vol %, and more preferably at least 99 vol % of the metal alloy contains grains that are roughly equal in length, width, and height. In some embodiments, at least 99 vol % of the magnet contains grains that are characterized in that there is less than 25%, preferably less than 10%, and more preferably less than 5% standard deviation in each of average grain length, average grain width, and average grain height. Equiaxed grains may result when there are many nucleation sites arising from grain-refining nanoparticles contained in the microstructure. The surface-modifying particles of some embodiments are grain-refining nanoparticles. The grain-refining nanoparticles are preferably present in a concentration of at least 0.01 vol %, such as at least 0.1 vol %, at least 1 vol %, or at least 5 vol % of the feedstock composition. In various embodiments, the grain-refining nanoparticles are present in a concentration of about, or at least about, 0.1, 0.2, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 vol %. In some embodiments, the grain-refining nanoparticles are lattice-matched to within ±5% compared to an otherwise-equivalent material containing the base particles but not the grain-refining nanoparticles. In certain embodiments, the grain-refining nanoparticles are lattice-matched to within ±2% or within ±0.5% compared to a material containing the base particles but not the grain-refining nanoparticles. Preferably, the microstructure of the additively manufactured magnet is substantially crack-free. The avoidance of cracks can be important for magnets. For example, samarium-cobalt magnets are brittle and prone to cracking and chipping. Crack-free SmCo-based permanent magnets may be fabricated. A magnet microstructure that is “substantially crack-free” means that at least 99.9 vol % of the metal alloy contains no linear or tortuous cracks that are greater than 0.1 microns in width and greater than 10 microns in length. In other words, to be considered a crack, a defect must be a void space that is at least 0.1 microns in width as well as at least 10 microns in length. A void space that has a length shorter than 10 microns but larger than 1 micron, regardless of width, can be considered a porous void (see below). A void space that has a length of at least 10 microns but a width shorter than 0.1 microns is a molecular-level gap that is not considered a defect. Typically, a crack contains open space, which may be vacuum or may contain a gas such as air, CO2, N2, and/or Ar. A crack may also contain solid material different from the primary material phase of the metal alloy. The non-desirable material disposed within the crack may itself contain a higher porosity than the bulk material, may contain a different crystalline (or amorphous) phase of solid, or may be a different material altogether, arising from impurities during fabrication, for example. The magnet microstructure may be substantially free of porous defects, in addition to being substantially crack-free. “Substantially free of porous defects” means at least 99 vol % of the magnet contains no porous voids having an effective diameter of at least 1 micron. Preferably, at least 80 vol %, more preferably at least 90 vol %, even more preferably at least 95 vol %, and most preferably at least 99 vol % of the magnet contains no porous voids having an effective diameter of at least 1 micron. A porous void that has an effective diameter less than 1 micron is not typically considered a defect, as it is generally difficult to detect by conventional non-destructive evaluation. Also preferably, at least 90 vol %, more preferably at least 95 vol %, even more preferably at least 99 vol %, and most preferably at least 99.9 vol % of the metal alloy contains no larger porous voids having an effective diameter of at least 5 microns. Typically, a porous void contains open space, which may be vacuum or may contain a gas such as air, CO2, N2, and/or Ar. Porous voids may be reduced or eliminated, in some embodiments. For example, additively manufactured metal parts may be hot-isostatic-pressed to reduce residual porosity, and optionally to arrive at a final additively manufactured magnet that is substantially free of porous defects in addition to being substantially crack-free. In additive manufacturing, post-production processes such as heat treatment, light machining, surface finishing, coloring, stamping, or other finishing operations may be applied. Also, several additive manufactured parts may be joined together chemically or physically to produce a final magnet. EXAMPLE This example demonstrates crystallographic texture control of a laser-welded Nd2Fe14B magnet structure. A Nd2Fe14B magnet structure is processed in a laser-welding machine with an external magnetic field. A DC magnetic field with flux density of approximately 1 T is applied parallel to the horizontal face of a sintered Nd2Fe14B magnet structure. Single-track weld lines are generated using a pulsed infrared laser-welder moving the surface through the static DC field. FIG.7shows photomicrographs of the Nd2Fe14B magnet microstructure with a shifted dendrite growth direction against the direction of maximum thermal gradient.FIG.8shows a photomicrograph top view of the laser-welded Nd2Fe14B magnet structure.FIG.9shows the increase in NdFeB easy axis [001] texture along the scan vector direction in IPF (inverse pole figure) density plots. EBSD (electron backscatter diffraction) maps are provided for reference orientations. The IPF density plots are shown in the lower half ofFIG.9, and the EBSD maps are shown in the upper half ofFIG.9. Epitaxial dendritic solidification tends to grow in the direction of the largest thermal gradient. However, under an external magnetic field, the solidification direction is unaligned with the maximum thermal gradient. Adjustment of the field direction influences texture evolution (from the dendritic solidification direction) with greater or less magnitude in accordance with the magnitude and field applied. In this detailed description, reference has been made to multiple embodiments and to the accompanying drawings in which are shown by way of illustration specific exemplary embodiments of the invention. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that modifications to the various disclosed embodiments may be made by a skilled artisan. Where methods and steps described above indicate certain events occurring in certain order, those of ordinary skill in the art will recognize that the ordering of certain steps may be modified and that such modifications are in accordance with the variations of the invention. Additionally, certain steps may be performed concurrently in a parallel process when possible, as well as performed sequentially. All publications, patents, and patent applications cited in this specification are herein incorporated by reference in their entirety as if each publication, patent, or patent application were specifically and individually put forth herein. The embodiments, variations, and figures described above should provide an indication of the utility and versatility of the present invention. Other embodiments that do not provide all of the features and advantages set forth herein may also be utilized, without departing from the spirit and scope of the present invention. Such modifications and variations are considered to be within the scope of the invention defined by the claims. | 62,837 |
11862370 | DETAILED DESCRIPTION OF THE EMBODIMENTS To make the objectives, technical solutions and advantages of this application more clearly, this application will be described and explained below in combination with the embodiments. It should be understood that the specific embodiments described are used for explaining this application only, rather than limiting this application. On the basis of the embodiments in this application, all the other embodiments obtained by those of ordinary skill in the art without making creative efforts will fall within the protection scope of this application. The “embodiment” mentioned in this application means that the specific features, structures or characteristics described in combination with an embodiment may be involved in at least one of the embodiments of this application. The phrase appearing in different places of this specification is neither necessarily the same embodiment, nor an independent or alternative embodiment that is mutually exclusive from other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application can be combined with other embodiments in case of no conflict. Unless defined otherwise, the technical terms or scientific terms involved in this application should have the general meanings understood by those of ordinary skill in the technical field to which this application belongs. The words “a”, “an”, “one”, “the” and the like mentioned in this application may indicate the singular or the plural, rather than representing a quantitative limitation. The terms “including/comprising”, “containing”, “having” and any variant thereof mentioned in this application are intended to cover non-exclusive inclusion; the words “connection”, “interconnection”, “coupling” and the like are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The phrase “a plurality of” involved in this application means more than or equal to 2. “And/or” describes an association between associated objects, indicating that three relationships are available. For example, “A and/or B” can mean that A exists alone, A and B exist at the same time, and B exists alone. The terms “first”, “second”, “third” and the like involved in this application are only to distinguish similar objects, and do not represent a specific order of the objects. EXAMPLE 1 A method for preparing a high-resistivity sintered samarium-cobalt magnet included the following steps: (1) Calcium fluoride was weighed according to 1% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 2% (by weight) of the calcium fluoride, the calcium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 10:1 (that is, a mass ratio of steel balls to the calcium fluoride was 10:1) to obtain fine calcium fluoride powder with an average particle size of 10 nm. In the present invention, there is no limitation to the volume or mass of the alcohol, as long as a ball milling tank is fully filled. (2) The fine calcium fluoride powder prepared in step (1) was rinsed and dried in an oxygen-free glove box (in the present invention, there is no limitation to the drying temperature; the drying was performed at a room temperature in this example) to obtain calcium fluoride powder. (3) Metal raw materials were weighed according to compositions based on a percentage by weight: Sm=24%, Co=40%, Fe=30%, Cu=4% and Zr=2%, and then smelted uniformly by induction melting or arc melting to obtain alloy ingots. The induction smelting or arc smelting in this example is a conventional smelting method in the art, and the present invention does not improve the steps and principles of the induction smelting or arc smelting. (4) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (3) using a jaw crusher and a disk crusher, respectively, and then powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 3:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 2.5 μm. The coarse crushing was performed first using the jaw crusher, and then the fine crushing was performed using the disk crusher. There is no limitation to the particle size after fine crushing. The particle size of the magnetic powder after the fine crushing was 0-150 μm in this example. (5) The calcium fluoride powder prepared in step (2) was mixed with alcohol, and a suspension was obtained by ultrasonic treatment for 0.5 h. In the present invention, there is no specific limitation to a mass ratio of the calcium fluoride powder to the alcohol, as long as the fluoride can be immersed by the alcohol. (6) The magnetic powder prepared in step (4) was spread evenly on a platinum sheet A at a bottom of a container, and the suspension prepared in step (5) was slowly poured into the container to avoid the magnetic powder from suspending; after pouring, a platinum sheet B was placed on a surface of the liquid in a suspended manner, the platinum sheet B was completely immersed in the suspension, then deposition treatment was performed under an electric field, and a voltage of 3 V was applied to the platinum sheets A and B for 60 min, with the platinum sheet B serving as a positive electrode and the platinum sheet A serving as a negative electrode, to obtain deposited magnetic powder. (7) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 30 MPa and cold isostatic pressing at a pressure of 200 MPa were performed on the deposited magnetic powder prepared in step (6) to obtain compacts. (8) The compacts prepared in step (7) were sintered at a temperature of 1,240° C. for 0.5 h. The solution treatment was performed at a temperature of 1,185° C. for 2 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 870° C. for 5 h, then slowly cooling down at 0.5° C./min to 400° C. and keeping the temperature for 5 h. A final-state magnet obtained included the following compositions based on a percentage by weight: Sm=23.5%, Fe=29.7%, Cu=3.9%, Zr=2%, F=0.02%, Ca=0.04% and the remaining amount of Co (namely Co=40.84%). COMPARATIVE EXAMPLE 1-1 A method for preparing a high-resistivity sintered samarium-cobalt magnet included the following steps: (1) Calcium fluoride was weighed according to 1% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 2% (by weight) of the calcium fluoride, the calcium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 10:1 (that is, a mass ratio of steel balls to the calcium fluoride was 10:1) to obtain fine calcium fluoride powder with an average particle size of 10 nm. (2) Metal raw materials were weighed according to compositions based on a percentage by weight: Sm=24%, Co=40%, Fe=30%, Cu=4% and Zr=2%, and then smelted uniformly by induction melting or arc melting to obtain alloy ingots. (3) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (2) using a jaw crusher and a disk crusher, respectively, then the fine calcium fluoride powder prepared in step (1) was added, and powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 3:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 2.5 μm. (4) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 30 MPa and cold isostatic pressing at a pressure of 200 MPa were performed on the magnetic powder prepared in step (3) to obtain compacts. (5) The compacts prepared in step (4) were sintered at a temperature of 1,240° C. for 0.5 h. The solution treatment was performed at a temperature of 1,185° C. for 2 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 870° C. for 5 h, then slowly cooling down at 0.5° C./min to 400° C. and keeping the temperature for 5 h. A final-state magnet obtained included the following compositions based on a percentage by weight: Sm=23.5%, Fe=29.7%, Cu=3.9%, Zr=2%, F=0.02%, Ca=0.04% and the remaining amount of Co. All the other conditions in this comparative example were the same as those in example 1. COMPARATIVE EXAMPLE 1-2 (1) Calcium fluoride was weighed according to 1% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 2% (by weight) of the calcium fluoride, the calcium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 10:1 to obtain fine calcium fluoride powder with an average particle size of 10 nm. (2) The fine calcium fluoride powder prepared in step (1) was rinsed and dried in an oxygen-free glove box to obtain calcium fluoride powder. (3) Metal raw materials were weighed according to compositions based on a percentage by weight: Sm=24%, Co=40%, Fe=30%, Cu=4% and Zr=2%, and then smelted uniformly by induction melting or arc melting to obtain alloy ingots. (4) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (3) using a jaw crusher and a disk crusher, respectively, and then powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 3:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 2.5 μm. (5) The calcium fluoride powder prepared in step (2) was mixed with alcohol, and a suspension was obtained by ultrasonic treatment for 0.5 h. (6) The magnetic powder prepared in step (4) was spread evenly at a bottom of a container, the suspension prepared in step (5) was slowly poured into the container to avoid the magnetic powder from suspending, and the immersion lasted for 60 min without applying any voltage to obtain immersed magnetic powder. (7) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 30 MPa and cold isostatic pressing at a pressure of 200 MPa were performed on the immersed magnetic powder prepared in step (6) to obtain compacts. (8) The compacts prepared in step (7) were sintered at a temperature of 1,240° C. for 0.5 h. The solution treatment was performed at a temperature of 1,185° C. for 2 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 870° C. for 5 h, then slowly cooling down at 0.5° C./min to 400° C. and keeping the temperature for 5 h. A final-state magnet obtained included the following compositions based on a percentage by weight: Sm=23.5%, Fe=29.7%, Cu=3.9%, Zr=2%, F=0.02%, Ca=0.04% and the remaining amount of Co (namely Co=40.84%). All the other conditions in this comparative example were the same as those in example 1. EXAMPLE 2 (1) Magnesium fluoride was weighed according to 2% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 4% (by weight) of the magnesium fluoride, the magnesium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 18:1 (that is, a mass ratio of steel balls to the magnesium fluoride was 18:1) to obtain fine magnesium fluoride powder with an average particle size of 100 nm. The alcohol was used as a medium for filling a ball milling tank. In the present invention, there is no limitation to the volume or mass of the alcohol, as long as the ball milling tank is fully filled. (2) The fine powder prepared in step (1) was placed in an oxygen-free glove box, and the fine magnesium fluoride powder was rinsed and dried to obtain magnesium fluoride powder. (3) Metal raw materials were weighed according to compositions based on a percentage by weight: Sm=27%, Co=46%, Fe=18%, Cu=6% and Zr=3%, and then smelted uniformly by induction melting or arc melting to obtain alloy ingots. (4) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (3) using a jaw crusher and a disk crusher, respectively, and then powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 6:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 4 μm. (5) The magnesium fluoride powder prepared in step (2) was mixed with alcohol, and a suspension was obtained by ultrasonic treatment for 2.5 h. In the present invention, there is no specific limitation to a mass ratio of the magnesium fluoride powder to the alcohol, as long as the fluoride can be immersed by the alcohol. (6) The magnetic powder prepared in step (4) was spread evenly on a platinum sheet A at a bottom of a container, and the suspension prepared in step (5) was slowly poured into the container to avoid the magnetic powder from suspending; after pouring, a platinum sheet B was placed on a surface of the liquid in a suspended manner, the platinum sheet B was completely immersed in the suspension, then deposition treatment was performed under an electric field, and a voltage of 7 V was applied to the platinum sheets A and B for 35 min, with the platinum sheet B serving as a positive electrode and the platinum sheet A serving as a negative electrode, to obtain deposited magnetic powder. (7) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 60 MPa and cold isostatic pressing at a pressure of 270 MPa were performed on the deposited magnetic powder prepared in step (6) to obtain compacts. (8) The compacts prepared in step (7) were sintered at a temperature of 1,210° C. for 2.5 h. The solution treatment was performed at a temperature of 1,160° C. for 5 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 800° C. for 13 h, then slowly cooling down at 1° C./min to 400° C. and keeping the temperature for 13 h. A final-state magnet obtained included the following compositions based on a percentage by weight: Sm=26.8%, Fe=17.3%, Cu=5.9%, Zr=2.9%, F=0.05%, Mg=0.1%, and the remaining amount of Co (namely Co=46.95%). COMPARATIVE EXAMPLE 2-1 (1) Magnesium fluoride was weighed according to 2% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 4% (by weight) of the magnesium fluoride, the magnesium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 18:1 to obtain fine magnesium fluoride powder with an average particle size of 100 nm. (2) Metal raw materials were weighed according to compositions based on a percentage by weight: Sm=27%, Co=46%, Fe=18%, Cu=6% and Zr=3%, and then smelted uniformly by induction melting or arc melting to obtain alloy ingots. (3) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (2) using a jaw crusher and a disk crusher, respectively, then the fine magnesium fluoride powder prepared in step (1) was added, and powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 6:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 4 μm. (4) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 60 MPa and cold isostatic pressing at a pressure of 270 MPa were performed on the magnetic powder prepared in step (3) to obtain compacts. (5) The compacts prepared in step (4) were sintered at a temperature of 1,210° C. for 2.5 h. The solution treatment was performed at a temperature of 1,160° C. for 5 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 800° C. for 13 h, then slowly cooling down at 1° C./min to 400° C. and keeping the temperature for 13 h. A final-state magnet obtained included the following compositions based on a percentage by weight: Sm=26.8%, Fe=17.3%, Cu=5.9%, Zr=2.9%, F=0.05%, Mg=0.1%, and the remaining amount of Co (namely Co=46.95%). All the other conditions in this comparative example were the same as those in example 2. COMPARATIVE EXAMPLE 2-2 (1) Magnesium fluoride was weighed according to 2% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 4% (by weight) of the magnesium fluoride, the magnesium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 18:1 to obtain fine magnesium fluoride powder with an average particle size of 100 nm. (2) The fine powder prepared in step (1) was placed in an oxygen-free glove box, and the fine magnesium fluoride powder was rinsed and dried to obtain magnesium fluoride powder. (3) Metal raw materials were weighed according to compositions based on a percentage by weight: Sm=27%, Co=46%, Fe=18%, Cu=6% and Zr=3%, and then the raw materials were smelted uniformly by induction melting or arc melting to obtain alloy ingots. (4) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (3) using a jaw crusher and a disk crusher, respectively, and then powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 6:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 4 μm. (5) The magnesium fluoride powder prepared in step (2) was mixed with alcohol, and a suspension was obtained by ultrasonic treatment for 2.5 h. (6) The magnetic powder prepared in step (4) was spread evenly at a bottom of a container, and the suspension prepared in step (5) was slowly poured into the container to avoid the magnetic powder from suspending, and the immersion lasted for 35 min without applying any voltage to obtain immersed magnetic powder. (7) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 60 MPa and cold isostatic pressing at a pressure of 270 MPa were performed on the immersed magnetic powder prepared in step (6) to obtain compacts. (8) The compacts prepared in step (7) were sintered at a temperature of 1,210° C. for 2.5 h. The solution treatment was performed at a temperature of 1,160° C. for 5 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 800° C. for 13 h, then slowly cooling down at 1° C./min to 400° C. and keeping the temperature for 13 h. A final-state magnet obtained included the following compositions based on a percentage by weight: Sm=26.8%, Fe=17.3%, Cu=5.9%, Zr=2.9%, F=0.05%, Mg=0.1%, and the remaining amount of Co. All the other conditions in this comparative example were the same as those in example 2. EXAMPLE 3 (1) Terbium fluoride was weighed according to 3% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 6% (by weight) of the terbium fluoride, the terbium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 25:1 (that is, a mass ratio of steel balls to the terbium fluoride was 25:1) to obtain fine terbium fluoride powder with an average particle size of 200 nm. The alcohol was used as a medium for filling a ball milling tank. In the present invention, there is no limitation to the volume or mass of the alcohol, as long as the ball milling tank is fully filled. (2) The fine powder prepared in step (1) was placed in an oxygen-free glove box, and the fine terbium fluoride powder was rinsed and dried to obtain terbium fluoride powder. (3) Metal raw materials were weighed according to compositions based on a percentage by weight: Sm:Co:Fe:Cu:Zr=31:51:5:9:4, and then the raw materials were smelted uniformly by induction melting or arc melting to obtain alloy ingots. (4) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (3) using a jaw crusher and a disk crusher, respectively, and then powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 8:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 5.2 μm. (5) The terbium fluoride powder prepared in step (2) was mixed with alcohol, and a suspension was obtained by ultrasonic treatment for 4 h. In the present invention, there is no specific limitation to a mass ratio of the magnesium fluoride powder to the alcohol, as long as the fluoride can be immersed by the alcohol. (6) The magnetic powder prepared in step (4) was spread evenly on a platinum sheet A at a bottom of a container, and the suspension prepared in step (5) was slowly poured into the container to avoid the magnetic powder from suspending; after pouring, a platinum sheet B was placed on a surface of the liquid in a suspended manner, the platinum sheet B was completely immersed in the suspension, then deposition treatment was performed under an electric field, and a voltage of 10 V was applied to the platinum sheets A and B for 10 min, with the platinum sheet B serving as a positive electrode and the platinum sheet A serving as a negative electrode, to obtain deposited magnetic powder. (7) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 100 MPa and cold isostatic pressing at a pressure of 350 MPa were performed on the deposited magnetic powder prepared in step (6) to obtain compacts. (8) The compacts prepared in step (7) were sintered at a temperature of 1,190° C. for 4 h. The solution treatment was performed at a temperature of 1,130° C. for 8 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 750° C. for 20 h, then slowly cooling down at 1.5° C./min to 400° C. and keeping the temperature for 20 h. A final-state magnet obtained was a high-resistivity sintered samarium-cobalt magnet, including the following compositions based on a percentage by weight: Sm=30.2%, Fe=4.8%, Cu=8.9%, Zr=3.8%, F=0.08%, TM=0.2%, and the remaining amount of Co, wherein TM was terbium. COMPARATIVE EXAMPLE 3-1 (1) Terbium fluoride was weighed according to 3% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 6% (by weight) of the terbium fluoride, the terbium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 25:1 to obtain fine terbium fluoride powder with an average particle size of 200 nm. (2) Metal raw materials were weighed based on a percentage by weight according to a chemical formula of Sm31Co51Fe5Cu9Zr4and the remaining amount of Co, and then smelted uniformly by induction melting or arc melting to obtain alloy ingots. (3) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (2) using a jaw crusher and a disk crusher, respectively, then the fine terbium fluoride powder prepared in step (1) was added, and powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 8:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 5.2 μm. (4) Magnetic field orientation molding at a magnetic filed strength of 2 T and a pressure of 100 MPa and cold isostatic pressing at a pressure of 350 MPa were performed on the magnetic powder prepared in step (3) to obtain compacts. (5) The compacts prepared in step (4) were sintered at a temperature of 1,190° C. for 4 h. The solution treatment was performed at a temperature of 1,130° C. for 8 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 750° C. for 20 h, then slowly cooling down at 1.5° C./min to 400° C. and keeping the temperature for 20 h. A final-state magnet obtained was a sintered samarium-cobalt magnet, including the following compositions based on a percentage by weight: Sm=30.2, Fe=4.8, Cu=8.9, Zr=3.8, F=0.08, TM=0.2, and the remaining amount of Co, wherein TM was terbium. All the other conditions in this comparative example were the same as those in example 3. COMPARATIVE EXAMPLE 3-2 (1) Terbium fluoride was weighed according to 3% (by weight) of magnetic powder, oleic acid was weighed with an addition amount of 6% (by weight) of the terbium fluoride, the terbium fluoride and the oleic acid were mixed with alcohol, and then high-energy ball milling was performed at a ball-to-material ratio of 25:1 to obtain fine terbium fluoride powder with an average particle size of 200 nm. (2) The fine powder prepared in step (1) was placed in an oxygen-free glove box, and the fine terbium fluoride powder was rinsed and dried to obtain terbium fluoride powder. (3) Metal raw materials were weighed based on a percentage by weight according to a chemical formula of Sm31Co51Fe5Cu9Zr4and the remaining amount of Co, and then smelted uniformly by induction melting or arc melting to obtain alloy ingots. (4) Coarse crushing and fine crushing were performed on the alloy ingots prepared in step (3) using a jaw crusher and a disk crusher, respectively, and then powder processing was performed on the finely crushed powder using a stirring mill or rolling ball mill at a ball-to-material mass ratio of 8:1, with 120# high-purity gasoline or high-purity methylbenzene serving as a medium for the ball milling, to obtain magnetic powder with an average particle size of 5.2 μm. (5) The terbium fluoride powder prepared in step (2) was mixed with alcohol, and a suspension was obtained by ultrasonic treatment for 4 h. (6) The magnetic powder prepared in step (4) was spread evenly at a bottom of a container, and the suspension prepared in step (5) was slowly poured into the container to avoid the magnetic powder from suspending, and the immersion lasted for 10 min without applying any voltage to obtain immersed magnetic powder. (7) Magnetic field orientation molding at a magnetic field strength of 2 T and a pressure of 100 MPa and cold isostatic pressing at a pressure of 350 MPa were performed on the immersed magnetic powder prepared in step (6) to obtain compacts. (8) The compacts prepared in step (7) were sintered at a temperature of 1,190° C. for 4 h. The solution treatment was performed at a temperature of 1,130° C. for 8 h, and the compacts were cooled down to a room temperature. Afterwards, annealing was performed by keeping a temperature of 750° C. for 20 h, then slowly cooling down at 1.5° C./min to 400° C. and keeping the temperature for 20 h. A final-state magnet obtained was a sintered samarium-cobalt magnet, including the following compositions based on a percentage by weight: Sm=30.2, Fe=4.8, Cu=8.9, Zr=3.8, F=0.08, TM=0.2, and the remaining amount of Co, wherein TM was terbium. All the other conditions in this comparative example were the same as those in example 3. The magnets prepared in the above-mentioned examples and comparative examples were tested. The magnetic properties of the magnets were tested using a pulsed magnetometer at a maximum magnetic field of 11 T, and the magnetic properties were determined at a room temperature. The resistivity was detected using a four-point method. The detection results are as shown in Table 1. TABLE 1Magnetic Properties and Resistivity Data of the MagnetsPrepared in the Examples and the Comparative Examples(BH)maxResistivityItemBr (kG)Hcj (kOe)(MGOe)(μΩ · mm)Example 111.7219.8331.60143.50Comparative10.5611.3422.92139.60Example 1-1Comparative10.9113.7026.38126.70Example 1-2Example 211.2827.6329.57156.80Comparative9.808.7318.50154.90Example 2-1Comparative10.7619.3724.74136.50Example 2-2Example 39.6122.4622.10187.30Comparative7.308.9110.87178.80Example 3-1Comparative8.9117.6517.88156.40Example 3-2 It can be seen from Table 1 that the magnetic properties of the magnets in examples 1-3 are all better than those in the comparative examples, indicating that adding fluoride in the preparation method of the present invention can effectively improve the resistivity of the magnets and maintain the high magnetic properties of the magnets at the same time. In comparative examples 1-2, 2-2 and 3-2, the fluoride is simply mixed with the magnetic powder, the resistivity of the magnet can be improved, but the magnetic properties deteriorate rapidly. The properties of the magnets in comparative examples 1-3, 2-3 and 3-3 show that when no voltage is applied, the effect on improving the resistivity of the magnets is poor, and the magnetic properties are also affected to a certain extent. Those skilled in the art should understand that the technical features of those embodiments can be combined freely, and not all the technical features of all possible combinations in those embodiments are described to make the description concise. However, all the combinations of these technical features should be deemed as the scope recorded in the specification as long as there is no contradiction therein. The above-mentioned embodiments only express several implementation modes of this application, and are specifically described in details, but it cannot be understood as a limitation to the scope of the present invention. It should be noted that for those of ordinary skill in the art, a number of improvements and modifications can be made without departing from the principle of the present invention. Such improvements and modifications should also fall within the protection scope of the present invention. | 30,688 |
11862371 | DETAILED DESCRIPTION A magnetic structural body according to an embodiment of the present disclosure is described below in detail with reference to drawings. Incidentally, the magnetic structural body according to the present disclosure is not limited to an embodiment described below or an illustrated configuration. The structure of the magnetic structural body according to an embodiment of the present disclosure is schematically shown inFIGS.1A to1C. The magnetic structural body10according to this embodiment contains core-shell structure particles13each including a core section11and a shell section12covering the surface of the core section. Herein, the neighboring core-shell structure particles13are linearly linked to each other. The core section11is made of an alloy containing a first metal and a second metal. The shell section12is made of an alloy which contains the first metal and the second metal and which has a first metal-to-second metal content ratio different from that of the core section11. In the magnetic structural body10, which has such a structure, the core-shell structure particles13, which are made of metal, are linearly linked together. Therefore, the magnetic structural body10has high magnetic permeability and higher mechanical strength. The term “core-shell structure particles” as used in the present disclosure refers to those which have a structure that a shell section covers at least one portion of the surface of a core section, in which the core section and the shell section mainly contain a first metal and a second metal, and in which the core section and the shell section differ in first metal-to-second metal content ratio from each other. Core-shell structure particles in the present disclosure are not present alone and have a morphology that the core-shell structure particles are linked to each other. In exemplified modes shown inFIGS.1A to1C, a plurality of the shell sections12continuously cover the surfaces of a plurality of the core sections11. In other words, a plurality of the shell sections12are bonded together. Therefore, any substance (for example, an oxide or the like) different from the alloy making up the shell sections12, any cavity, or the like is not present between the shell section12covering the surface of one of the core sections11and the shell section12covering the surface of the core section11adjoining the one of the core sections11. The shell section12covering the surface of one of the core sections11and the shell section12covering the surface of the core section11adjoining the one of the core sections11are in surface contact with each other. The magnetic structural body10according to this embodiment has high mechanical strength because the shell sections12have such a continuous, integral structure. Therefore, the core-shell structure particles13are tightly linked to each other even under high-temperature conditions and can maintain such a wire form as shown inFIGS.1A to1C. As is clear from the exemplified modes shown inFIGS.1A to1C, the magnetic structural body according to the present disclosure is such that the core-shell structure particles13, which are made of metal, are linearly linked together. Since such a structure is used, in a case where a magnetic field is applied to the magnetic structural body in a longitudinal direction thereof, the demagnetizing field can be kept small and high magnetic permeability can be ensured. The term “linearly linked” as used herein may refer to a structure in which the major axis of one magnetic structural body10is not bent at ±30° or more over the whole of the magnetic structural body10. The major axis of one magnetic structural body10is preferably not bent at ±20° or more, more preferably ±10° or more, and further more preferably ±5° or more. The magnetic structural body10may have a linear structure or a branched structure. From the viewpoint of enhancing the magnetic permeability, the magnetic structural body10preferably has the linear structure rather than the branched structure. In the magnetic structural body10, at least three of the core-shell structure particles13may be linked together. In the magnetic structural body10, the number of the core-shell structure particles13linked together is preferably at least ten and is, for example, at least 50. The core-shell structure of the above-mentioned magnetic structural body can be confirmed in such a manner that after a cross section thereof is exposed using a focused ion beam (FIB), a mapping function of energy dispersive X-ray analysis (EDX) of a scanning transmission electron microscope (STEM) is used. In the magnetic structural body according to the present disclosure, the core sections are preferably substantially spherical. When the core sections are substantially spherical, the magnetic structural body can be more readily obtained so as to have a wire form in which the core-shell structure particles are linearly linked together. The term “substantially spherical” as used herein can be expressed in terms of sphericity and refers to one with a sphericity of 50 or more. The sphericity is preferably 60 to 95 and may be, for example, 70 to 90 or 75 to 85. The sphericity may refer to one that is calculated in accordance with the following equation in such a manner that the lateral and longitudinal sizes are measured from two-dimensional images of particles photographed with a scanning electron microscope (SEM) and arbitrary ten of the particles are averaged: Sphericity=Σni=1(lateral size/longitudinal size)/n×100. Setting the sphericity of the core sections to 50 or more enables the magnetic structural body to be more readily obtained such that the magnetic structural body has the wire form, in which the core-shell structure particles are linearly linked together, as described above. Setting the sphericity of the core sections11to 95 or less allows the core-shell structure particles13to have a flat shape as exemplified inFIG.1(b), thereby allowing the contact area between the neighboring core-shell structure particles13to be larger. In the magnetic structural body according to the present disclosure, the particle size of each core section is preferably 0.1 μm to 10 μm. When the particle size of the core section is 0.1 μm or more, a core-shell structure can be more effectively formed. In the magnetic structural body according to the present disclosure, the neighboring core-shell structure particles are such that the shell sections in at least the individual core-shell structure particles are linked together. According to an embodiment, in the neighboring core-shell structure particles13, the core sections11are linked to each other and the shell sections12are linked to each other as exemplified inFIG.1(c). In other words, a plurality of the core sections11are linked to each other to form a core part and a plurality of the shell sections12covering the surface of the core part are linked to each other to form a shell part. Such a structure that a plurality of the core sections11are linked together allows the magnetic permeability and mechanical strength of the magnetic structural body10to be higher. In the above embodiment, the contact area between the shell sections12in the contact plane between the neighboring core-shell structure particles13is preferably larger than the contact area between the core sections11. In this case, the contact area between the shell section12covering the surface of one of the core sections11and the shell section12covering the surface of the core section11adjoining the one of the core sections11is larger than the contact area between the core sections11and therefore the mechanical strength of the magnetic structural body10is higher. The core sections are made of the alloy containing the first metal and the second metal. The shell sections are made of the alloy which contains the first metal and the second metal and which has a first metal-to-second metal content ratio different from that of the core section. The alloy making up the core sections and the alloy making up the shell sections may contain other elements such as phosphorus and/or boron as described below and may further contain an inevitable impurity. The inevitable impurity is a trace component which may possibly be contained in raw materials of the magnetic structural body or which may possibly be trapped in a production step and is a component which is contained to such a degree that characteristics of the magnetic structural body are not affected. The first metal has a standard redox potential higher than that of the second metal. In other words, the first metal is more likely to be reduced than the second metal. Therefore, the first metal precipitates prior to the second metal as described below in connection with a production method. As a result, in the core sections, the content of the first metal is higher than the content of the second metal. The first metal exhibits the catalytic effect of reducing the second metal to precipitate the second metal. The first metal is the magnetic metal. Therefore, the magnetic structural body according to an embodiment includes a wire-shaped core part in which a plurality of the core sections, which are made of a magnetic material, are linked to each other (that is, a wire-shaped magnetic core part). The first metal may be, for example, cobalt or nickel. The second metal is more unlikely to be reduced than the first metal and is metal which is reduced by the catalytic effect of the first metal to precipitate. The second metal may be, for example, iron. In a preferred embodiment, the first metal is cobalt or nickel and the second metal is iron. That is, the core sections and the shell sections are preferably made of an iron-cobalt alloy or an iron-nickel alloy. In this case, the saturation flux density of the magnetic structural body can be further increased. The average concentration of the first metal in the core sections is preferably higher than the average concentration of the first metal in the shell sections. When the first metal is cobalt or nickel, the average concentration of cobalt or nickel in the core sections is preferably higher than the average concentration of cobalt or nickel in the shell sections. On the other hand, the average concentration of the second metal in the shell sections is preferably higher than the average concentration of the second metal in the core sections. Such a configuration enables the bond of the core-shell structure particles in the magnetic structural body to be strengthened. The average concentration of each component contained in the core sections and the shell sections can be measured by STEM-EDX (scanning transmission electron microscope-energy dispersive X-ray spectroscope). In an embodiment, the core sections and the shell sections are made of an amorphous alloy. The amorphous alloy has no crystallomagnetic anisotropy and is affected by magnetic shape anisotropy only. Therefore, in a case where the magnetic structural body according to this embodiment is used as a magnetic material for coil components, when the core sections and the shell sections are made of the amorphous alloy, the magnetic structural body may be placed in consideration of shape anisotropy only, thereby enabling the handleability of the magnetic structural body to be further enhanced. The core sections and the shell sections may contain another element in addition to the first metal and the second metal. In an embodiment, the core-shell structure particles contain phosphorus. Herein, the core sections contain phosphorus and the average concentration of phosphorus in the core sections is higher than the average concentration of phosphorus in the shell sections. Phosphorus may be one derived from an oxidizing agent used in a step of producing the magnetic structural body. The core-shell structure particles contain boron in addition to or instead of phosphorus. Boron may be one derived from a reducing agent used in a step of producing the magnetic structural body. When the core sections and the shell sections contain, for example, iron and further contain phosphorus and/or boron, the core sections and the shell sections can be more successfully made from the amorphous alloy. In an embodiment, the molar ratio of the first metal to second metal in the core sections is preferably from 1 to 3. When the molar ratio of the first metal to the second metal is within the above range, the magnetic structural body can be obtained so as to have higher saturation flux density. On the other hand, the molar ratio of the first metal to second metal in the shell sections is preferably from 1 to 2. In the shell sections, a region closer to the outer surface of each shell section has a higher first metal concentration. The composition of the core sections and the composition of the shell sections are not particularly limited and may meet the above-mentioned conditions. The core sections and the shell sections preferably do not contain any noble metal, particularly gold (Au), palladium (Pd), platinum (Pt), and/or rhenium (Ru). When the core sections and the shell sections contain noble metals such as Au, Pd, Pt, and/or Ru, a core-shell structure like the magnetic structural body according to this embodiment cannot be formed as described below in connection with a method for producing the magnetic structural body. The core sections and the shell sections are preferably made of the amorphous alloy. The amorphous alloy has no crystallomagnetic anisotropy and is affected by magnetic shape anisotropy only as described above. Therefore, in a case where the magnetic structural body according to this embodiment is used as a magnetic material for coil components, when the core sections and the shell sections are made of the amorphous alloy, the magnetic structural body may be placed in consideration of shape anisotropy only, thereby enabling the handleability of the magnetic structural body to be enhanced, which is preferable. In an embodiment, the core-shell structure particles contain none of phosphorus and boron. In other words, the core-shell structure particles are made of a phosphorus-free component and a boron-free component. That is, the core-shell structure particles are made of components such as the first metal, the second metal, oxygen, nitrogen, carbon, and sodium only. Since the core-shell structure particles contain none of phosphorus and boron, magnetic characteristics (that is, saturation flux density and magnetic permeability) of the magnetic structural body can be more successfully prevented from deteriorating. However, the core-shell structure particles may contain phosphorus and boron in the form of inevitable impurities. The inevitable impurities are trace components which may possibly be contained in raw materials of the magnetic structural body or which may possibly be trapped in a producing step and are components which are contained to such a degree that characteristics of the magnetic structural body are not affected. In an embodiment, the first metal in the magnetic structural body is preferably cobalt. In a case where the magnetic structural body is formed in, for example, a mode that the core-shell structure particles contain none of phosphorus and boron, the core sections are unlikely to become spherical; hence, the magnetic structural body linearly linked is not obtained in some cases. Even in this case, when the first metal used is cobalt, the core sections can be successfully obtained so as to be substantially spherical and the magnetic structural body linearly linked can be obtained. In this embodiment, the second metal is preferably iron. In an embodiment, the molar ratio of the first metal to the second metal is preferably from 4 to 9. When the molar ratio thereof is 4 or more, the sphericity of the core sections can be increased, thereby enabling the magnetic structural body linearly linked to be obtained. When the molar ratio thereof is 9 or less, the shell sections can be sufficiently formed and the mechanical strength of the magnetic structural body can be further increased. In an embodiment, the core sections preferably have a hexagonal close-packed structure phase. When the core sections have the hexagonal close-packed structure phase, the sphericity of the core sections can be increased, thereby enabling the magnetic structural body linearly linked to be obtained. From the viewpoint of the sphericity of the core-shell structure particles, the shell sections preferably have the hexagonal close-packed structure phase. Next, a method for producing the magnetic structural body according to this embodiment is described below. A method described below is merely an example. The method for producing the magnetic structural body according to this embodiment is not limited to the method below. In outline, the magnetic structural body is produced in such a manner that a metal salt-containing solution is added to a reducing solution (or the reducing solution is adjusted to the metal salt-containing solution) with a magnetic field applied thereto using a magnet or the like and the metal salt-containing solution and the reducing solution are subjected to reaction. (Metal Salt-Containing Solution) The metal salt-containing solution contains a salt of the first metal, a salt of the second metal, and a solvent. Each of the first metal salt and the second metal salt may be at least one selected from the group consisting of sulfates, nitrates, and chlorides. The first metal salt and the second metal salt may be salts containing the same anion or salts containing different anions. When the first metal salt and the second metal salt are nitrates, nitrate ions are likely to decompose a reducing agent and therefore the growth rate of a particle making up each core section11tends to be low. As a result, the size of the core-shell structure particles tends to be large. When the reducing solution used is basic, the metal salt-containing solution is an acidic solution. The solvent contained in the metal salt-containing solution may be water or alcohol. The metal salt-containing solution may further contain a chelating agent in addition to the first metal salt, the second metal salt, and the solvent. When the metal salt-containing solution contains the chelating agent, the first metal salt and the second metal salt are allowed to be stably present in the metal salt-containing solution. The chelating agent is preferably a salt stabilizing both the first metal salt and the second metal salt. Alternatively, the chelating agent is preferably a salt allowing the second metal salt to be more stably present than the first metal salt. This enables the second metal stabilized by the chelating agent to be slowly precipitated after large-size core sections which contain a larger amount of the first metal rather than the second metal (which are first metal-rich) are precipitated. As a result, the magnetic structural body can be obtained so as to have a core-shell structure. (Reducing Solution) The reducing solution contains a reducing agent and a solvent. The reducing agent may be at least one selected from the group consisting of sodium borohydride, dimethylamine borane, and hydrazine monohydrate. When the reducing agent contains boron (when the reducing agent is, for example, sodium borohydride), the magnetic structural body can incorporate boron. As a result, the magnetic structural body particles linked, which are made of the amorphous alloy, can be more successfully obtained. However, when the reducing agent contains no boron (when the reducing agent is, for example, hydrazine monohydrate), magnetic characteristics of the magnetic structural body can be more successfully prevented from deteriorating. The solvent contained in the reducing solution may be water or alcohol. The reducing solution may further contain an oxidizing agent in addition to the reducing agent and the solvent. The oxidizing agent may be, for example, sodium hypophosphite. When the reducing solution contains the oxidizing agent, the reducing power of the reducing agent can be adjusted. In an embodiment in which the reducing agent contains boron, the molar ratio of the first metal to second metal in the metal salt-containing solution is preferably from 1 to 3. When the molar ratio of the first metal to the second metal is within the above range, the magnetic structural body can be obtained so as to have higher saturation flux density. Furthermore, a structure in which the core sections are linked to each other can be formed. In an embodiment in which the reducing agent contains no boron, the first metal in the metal salt-containing solution is preferably cobalt. When the first metal used is cobalt, the core sections can be successfully obtained so as to be substantially spherical and the magnetic structural body linearly linked can be obtained. In this embodiment, the second metal is preferably iron. The molar ratio of the first metal to second metal in the metal salt-containing solution is preferably from 4 to 9. When the molar ratio of the first metal to the second metal is within the above range, the magnetic structural body linearly linked can be formed and the magnetic structural body can be obtained so as to have higher magnetic permeability. Furthermore, the shell sections of the core-shell structure particles can be sufficiently formed and the mechanical strength of the magnetic structural body can be further enhanced. Both the metal salt-containing solution and the reducing solution contain no noble metal, particularly none of gold (Au), palladium (Pd), platinum (Pt), and rhenium (Ru). Noble metals such as Au, Pd, Pt, and Ru exhibit a high catalytic effect on the reducing agent. Therefore, when the metal salt-containing solution and/or the reducing solution contains Au, Pd, Pt, and/or Ru, the first metal is precipitated together with the second metal and the core sections, which contain a large amount of the first metal (which is first metal-rich), cannot be preferentially precipitated. Hence, the magnetic structural body, which has the core-shell structure, cannot be obtained. The formation of the magnetic structural body according to the present disclosure is described using an illustrated mode shown inFIGS.2A-2C. First, the reducing solution is added to the above-mentioned metal salt-containing solution in a beaker30with a magnetic field applied thereto using a magnet40, whereby a mixed solution20is prepared. In the mixed solution20, which is prepared by adding the reducing solution to the metal salt-containing solution, the first metal, which has a standard redox potential higher than that of the second metal, is preferentially precipitated in a solution, whereby a plurality of the core sections11are formed (refer toFIG.2A). After the core sections11are formed, a structure in which a plurality of the core sections11, which are made of an alloy containing the first metal, which is the magnetic metal, are linearly linked to each other can be formed (refer toFIG.2B). Since the second metal has a standard redox potential lower than that of the first metal, the second metal is precipitated after the formation of the core sections11to form the shell sections12, which cover the surfaces of the core sections (refer toFIG.2C). In this operation, the first metal acts as a catalyst that reduces the second metal to precipitate the second metal. The reaction of the metal salt-containing solution with the reducing agent is preferably carried out at 50° C. to 80° C. and more preferably about 60° C. The magnetic structural body is produced as described above, has high mechanical strength, and is such that the core-shell structure particles are tightly linked together under high-temperature conditions and a wire form can be maintained. Example 1 A magnetic structural body of Example 1 was prepared by a procedure described below. First, iron(II) sulfate heptahydrate, cobalt(II) sulfate heptahydrate, and trisodium citrate dihydrate were weighed so as to give a composition shown in Table 1 and were used to prepare 50 mL of a metal salt-containing solution. A solvent used in the metal salt-containing solution was water. Furthermore, sodium borohydride which was a reducing agent, sodium hypophosphite, and sodium hydroxide for pH adjustment were weighed so as to give a composition shown in Table 2 and were used to prepare 50 mL of a reducing solution. A solvent used in the reducing solution was water. A φ 15 mm×10 mm samarium-cobalt magnet was placed into a water bath maintained at 60° C. and a 200 mL beaker containing 50 mL of the above-mentioned metal salt-containing solution was placed thereon. The above-mentioned reducing solution was poured into a 100 mL beaker and was maintained at 60° C. The reducing solution was added to the metal salt-containing solution at a flow rate of 2 mL/min using a liquid transfer pump. TABLE 1Substance nameChemical formulaConcentration/MIron sulfateFeSO40.015Cobalt sulfateCoSO40.015Trisodium citrateNa3(C3H5O(COO)3)0.090 TABLE 2Substance nameChemical formulaConcentration/MSodium hydroxideNaOH2.00Sodium borohydrideNaBH40.53Sodium hypophosphiteNaH2PO20.50 After all the reducing solution was added, an obtained solution was maintained at 60° C. for 30 minutes. A precipitate attracted to the magnet on the bottom of the beaker was collected and was rinsed with pure water four times, whereby the remaining reducing agent and the like were removed. The magnetic structural body of Example 1 was obtained as described above. FIGS.3and4show the appearance of the magnetic structural body observed with a scanning electron microscope (SEM). SEM observation confirmed that core-shell structure particles with a diameter of about 1 μm were linearly linked together to form the magnetic structural body, which was wire-shaped. The core-shell structure particles had a shape that both ends of a spherical or substantially spherical particle were cut by parallel or substantially parallel two planes. The neighboring core-shell structure particles shared a cross section to form a shape that particles were linked together. The magnetic structural body, which was wire-shaped, was subjected to focused ion beam (FIB) processing, followed by analyzing the composition of a cross section of the magnetic structural body by STEM-EDX analysis. Results are shown inFIG.5. FIG.5shows composition analysis results of a cross section substantially perpendicular to an axis (hereinafter referred to as the “wire axis”) substantially parallel to a direction in which the core-shell structure particles are linked together. As is clear fromFIG.5, core sections which contain a relatively large amount of a first metal (which are cobalt-rich) are present inside the magnetic structural body and each of shell sections in which the content of the first metal is relatively small (which are cobalt-poor) covers the periphery of a corresponding one of the core sections. This is probably because, since cobalt is more likely to be reduced than iron by the reducing agent, a cobalt-rich component was first precipitated to form the core sections, the decomposition of the reducing agent was subsequently promoted by the catalytic effect of precipitated cobalt, and the shell sections, which are cobalt-poor (that is, iron-rich), were precipitated around the core sections. FIG.6shows composition analysis results of a cross section substantially parallel to the wire axis of the magnetic structural body. FromFIG.6, it could be confirmed that the core sections, which were cobalt-rich, were present in the magnetic structural body and each of the shell sections, which were cobalt-poor, covered the surface of a corresponding one of the core sections. In the neighboring core-shell structure particles, it could be confirmed that the core sections were linked to each other and the shell sections were linked to each other. It could be confirmed that the contact area between the shell sections in the contact plane between the neighboring core-shell structure particles was larger than the contact area between the core sections. Furthermore, it became clear that any cavity or any substance different from the composition of the shell sections was not present between the neighboring shell sections and the shell sections had a continuous, integral structure. FIG.7shows XRD analysis results of the core-shell structure particles in Example 1. No clear crystal peak was present as shown inFIG.7and it became clear that the core-shell structure particles were made of an amorphous alloy. Incidentally, a peak at about 36 (2θ) inFIG.7is a diffraction peak due to a sample bag and does not show any crystal peak of the core-shell structure particles. Wires obtained in Example 1 are such that the core-shell structure particles are made of an iron-cobalt alloy and are linearly linked together. Each of the core-shell structure particles has a shape that both ends of a spherical or substantially spherical particle are cut by parallel or substantially parallel two planes. The neighboring core-shell structure particles share a cross section to form a shape that a plurality of the core-shell structure particles are linked together. The surface of each of the core sections, which are relatively cobalt-rich, is covered by a corresponding one of the shell sections, which are relatively cobalt-poor. The neighboring shell sections are in contact with each other at an area larger than that between the cores, which are placed therein. In addition, any cavity or any substance different from the composition of the shell sections is not present between the neighboring shell sections. This allows the shell sections to be continuously integrated in one of the wires, thereby obtaining an effect that the strength of the wires is high. Since the shell sections are made of the iron-cobalt alloy, an effect that the shell sections can maintain a wire shape up to a relatively high temperature unlike polymers with a low heatproof temperature is obtained. Example 2 A magnetic structural body of Example 2 was prepared by a procedure described below. Iron(II) sulfate heptahydrate, nickel(II) sulfate hexahydrate, and trisodium citrate dihydrate were weighed so as to give a composition shown in Table 3 and were used to prepare 50 mL of a metal salt-containing solution. A solvent used in the metal salt-containing solution was water. Furthermore, sodium borohydride which was a reducing agent, sodium hypophosphite, and sodium hydroxide for pH adjustment were weighed so as to give a composition shown in Table 4 and were used to prepare 50 mL of a reducing solution. A solvent used in the reducing solution was water. A φ 15 mm×10 mm samarium-cobalt magnet was placed into a water bath maintained at 60° C. and a 200 mL beaker containing 50 mL of the metal salt-containing solution was placed thereon. The reducing solution was poured into a 100 mL beaker and was maintained at 60° C. The reducing solution was added to the metal salt-containing solution at a flow rate of 2 mL/min using a liquid transfer pump. All the reducing solution was added and was then maintained at 60° C. for 30 minutes. A precipitate attracted to the magnet on the bottom of the beaker was collected and was rinsed with pure water four times, whereby the remaining reducing agent and the like were removed. TABLE 3Substance nameChemical formulaConcentration/MIron sulfateFeSO40.015Nickel sulfateNiSO40.015Trisodium citrateNa3(C3H5O(COO)3)0.090 TABLE 4Substance nameChemical formulaConcentration/MSodium hydroxideNaOH2.00Sodium borohydrideNaBH40.53Sodium hypophosphiteNaH2PO20.50 FIG.8shows the appearance of the precipitate observed with a SEM. It was confirmed that core-shell structure particles with a diameter of about 100 nm to 200 nm were linearly arranged to form the magnetic structural body, which was wire-shaped. The particles had a shape that a spherical or substantially spherical shape was cut by parallel or substantially parallel two planes. The neighboring particles shared a cross section to form a shape that particles were linked together. Wires obtained in Example 2, as well as the wires obtained in Example 1, had a core-shell structure composed of core sections which contained a relatively large amount of a first metal (which were nickel-rich) and shell sections in which the content of the first metal was relatively low (which were nickel-poor). The wires obtained in Example 2 are such that the core-shell structure particles are made of an iron-nickel alloy and are linearly linked together. The particles have a shape that a spherical or substantially spherical shape is cut by parallel or substantially parallel two planes. The neighboring particles share a cross section to form a shape that particles are linked together. One of the wires is continuously integral and an effect that the strength of the wires is high is obtained. An effect that a wire shape can be maintained up to a relatively high temperature unlike polymers with a low heatproof temperature is obtained. Example 3 Synthesis was performed under the same conditions as those used in Example 1 except that the types of metal salts were changed from iron(II) sulfate heptahydrate and cobalt(II) sulfate heptahydrate in Example 1 to iron(II) chloride tetrahydrate and cobalt(II) chloride hexahydrate, respectively.FIG.9shows the appearance of a precipitate observed with a SEM. It was confirmed that core-shell structure particles with an average diameter of about 1 μm were linearly arranged to form a wire-shaped magnetic structural body. The particles had a shape that a spherical or substantially spherical shape was cut by parallel or substantially parallel two planes. The neighboring particles shared a cross section to form a shape that particles were linked together. Wires obtained in Example 3, as well as the wires obtained in Example 1, had a core-shell structure composed of core sections which contained a relatively large amount of a first metal (which were cobalt-rich) and shell sections in which the content of the first metal was relatively low (which were cobalt-poor). The wires obtained in Example 3 are such that the core-shell structure particles are made of an iron-cobalt alloy and are linearly linked together. The particles have a shape that a spherical or substantially spherical shape is cut by parallel or substantially parallel two planes. The neighboring particles share a cross section to form a shape that particles are linked together. One of the wires is continuously integral and an effect that the strength of the wires is high is obtained. An effect that a wire shape can be maintained up to a relatively high temperature unlike polymers with a low heatproof temperature is obtained. Example 4 Synthesis was performed under the same conditions as those used in Example 1 except that the types of metal salts were changed from iron(II) sulfate heptahydrate and cobalt(II) sulfate heptahydrate in Example 1 to iron(II) acetate and cobalt(II) acetate tetrahydrate, respectively.FIG.10shows the appearance of a precipitate observed with a SEM. It was confirmed that core-shell structure particles with an average diameter of about 1 μm were linearly arranged to form a wire-shaped magnetic structural body. The particles had a shape that a spherical or substantially spherical shape was cut by parallel or substantially parallel two planes. The neighboring particles shared a cross section to form a shape that particles were linked together. Wires obtained in Example 4, as well as the wires obtained in Example 1, had a core-shell structure composed of core sections which contained a relatively large amount of a first metal (which were cobalt-rich) and shell sections in which the content of the first metal was relatively low (which were cobalt-poor). The wires obtained in Example 4 are such that the core-shell structure particles are made of an iron-cobalt alloy and are linearly linked together. The particles have a shape that a spherical or substantially spherical shape is cut by parallel or substantially parallel two planes. The neighboring particles share a cross section to form a shape that particles are linked together. One of the wires is continuously integral and an effect that the strength of the wires is high is obtained. An effect that a wire shape can be maintained up to a relatively high temperature unlike polymers with a low heatproof temperature is obtained. Example 5 A magnetic structural body of Example 5 was prepared by a procedure described below. Iron(II) acetate and cobalt(II) acetate tetrahydrate were weighed so as to give a composition shown in Table 5 and were used to prepare 50 mL of a metal salt-containing solution. A solvent used in the metal salt-containing solution was ethylene glycol. Furthermore, hydrazine monohydrate which was a reducing agent and sodium hydroxide for pH adjustment were weighed so as to give a composition shown in Table 6 and were used to prepare 50 mL of a reducing solution. A solvent used in the reducing solution was ethylene glycol. A φ 15 mm×10 mm samarium-cobalt magnet was placed into a water bath maintained at 60° C. and a 200 mL beaker containing 50 mL of the metal salt-containing solution was placed thereon. The above-mentioned reducing solution was poured into a 100 mL beaker and was maintained at 60° C. The reducing solution was added to the metal salt-containing solution at a flow rate of 2 mL/min using a liquid transfer pump. TABLE 5Substance nameChemical formulaConcentration/MIron acetateFe(CH3CO2)20.016Cobalt acetateCo(CH3CO2)20.064 TABLE 6Substance nameChemical formulaConcentration/MSodium hydroxideNaOH3.330HydrazineN2H46.750 All the reducing solution was added and was then maintained at 60° C. for 30 minutes. A precipitate attracted to the magnet on the bottom of the beaker was collected and was rinsed with pure water four times, whereby the remaining reducing agent and the like were removed. The magnetic structural body of Example 5 was obtained as described above. FIG.11shows the appearance of the precipitate observed with a SEM. It was confirmed that spherical core-shell structure particles with a diameter of about 1 μm were linearly linked together to form the magnetic structural body, which was wire-shaped. The particles had a shape that a spherical or substantially spherical shape was cut by parallel or substantially parallel two planes. The neighboring core-shell structure particles shared a cross section to form a shape that particles were linked together. The obtained magnetic structural body, which was wire-shaped, was subjected to FIB processing, followed by analyzing the composition of a cross section of the magnetic structural body, which was wire-shaped, by STEM/EDX analysis. Results are shown inFIG.12. As shown inFIG.12, it is clear that a core section which is relatively cobalt-rich is present inside each of the core-shell structure particles and a shell section which is relatively cobalt-poor covers the periphery of the core section. This is probably because, since cobalt is more likely to be reduced than iron by the reducing agent, cobalt-rich particles are first precipitated to form cores, the decomposition of the reducing agent is promoted by the catalytic effect of subsequently precipitated cobalt, and shells which are cobalt-poor (that is, iron-rich) are precipitated around the cores. In this example, it became clear that no boron or phosphorus was contained in the particles because the reducing agent used was not sodium borohydride or sodium hypophosphite. Therefore, the magnetic structural body of Example 5 exhibits good magnetic characteristics such as saturation flux density and magnetic permeability. FIG.13shows XRD analysis results of the core-shell structure particles in Example 5. It became clear that the core-shell structure particles had a hexagonal close-packed structure as shown inFIG.13. Incidentally, a peak at about 44 (2θ) and a peak at about 76 (2θ) inFIG.13are peaks showing a hexagonal close-packed structure phase. Example 6 Synthesis was performed under the same conditions as those used in Example 5 except that the molar concentration of each metal salt in the metal salt-containing solution used in Example 5 was adjusted so as to give a composition shown in Table 7. TABLE 7Substance nameChemical formulaConcentration/MIron acetateFe(CH3CO2)20.008Cobalt acetateCo(CH3CO2)20.072 FIG.14shows the appearance of a precipitate observed with a SEM. It was confirmed that spherical particles with a diameter of about 1 μm were linearly arranged to form a wire-shaped magnetic structural body. The core-shell structure particles had a shape that a spherical or substantially spherical shape was cut by parallel or substantially parallel two planes. The neighboring core-shell structure particles shared a cross section to form a shape that particles were linked together. The present disclosure includes modes below and is not limited to the modes. (Mode 1) A magnetic structural body contains core-shell structure particles each including a core section and a shell section covering the surface of the core section. The core section is made of an alloy containing a first metal and a second metal. The shell section is made of an alloy which contains the first metal and the second metal and which has a first metal-to-second metal content ratio different from that of the core section. The first metal is a magnetic metal and has a standard redox potential higher than that of the second metal. The neighboring core-shell structure particles are linearly linked to each other. (Mode 2) In the magnetic structural body specified in Mode 1, the core section is substantially spherical. (Mode 3) In the magnetic structural body specified in Mode 1 or 2, in the neighboring core-shell structure particles, the core sections of each of the core-shell structure particles are linked to each other and the shell sections are linked to each other. (Mode 4) In the magnetic structural body specified in Mode 3, the contact area between the shell sections in the contact plane between the neighboring core-shell structure particles is larger than the contact area between the core sections. (Mode 5) In the magnetic structural body specified in any one of Modes 1 to 4, the average concentration of the first metal in the core sections is higher than the average concentration of the first metal in the shell sections. (Mode 6) In the magnetic structural body specified in any one of Modes 1 to 5, the average concentration of the second metal in the shell sections is higher than the average concentration of the second metal in the core sections. (Mode 7) In the magnetic structural body specified in any one of Modes 1 to 6, the core sections and the shell sections are made of an amorphous alloy. (Mode 8) In the magnetic structural body specified in any one of Modes 1 to 7, the first metal is cobalt or nickel and the second metal is iron. (Mode 9) In the magnetic structural body specified in any one of Modes 1 to 8, the core-shell structure particles contain phosphorus and the average concentration of phosphorus in the core sections is higher than the average concentration of phosphorus in the shell sections. (Mode 10) In the magnetic structural body specified in any one of Modes 1 to 9, the core-shell structure particles contain boron. (Mode 11) In the magnetic structural body specified in any one of Modes 1 to 10, the molar ratio of the first metal to second metal in the core sections is from 1 to 3. (Mode 12) In the magnetic structural body specified in any one of Modes 1 to 8, the core-shell structure particles contain none of phosphorus and boron. (Mode 13) In the magnetic structural body specified in any one of Modes 1 to 8 and 12, the first metal is cobalt and the second metal is iron. (Mode 14) In the magnetic structural body specified in any one of Modes 1 to 8, 12, and 13, the molar ratio of cobalt to iron in the magnetic structural body is from 4 to 9. (Mode 15) In the magnetic structural body specified in any one of Modes 1 to 8 and 12 to 14, the core sections have a hexagonal close-packed structure phase. A magnetic structural body according to the present disclosure can be widely used as a magnetic material making up an electronic component such as an inductor in various applications. | 44,651 |
11862372 | DETAILED DESCRIPTION Hereinafter, certain embodiments of the present invention will be described. The embodiments described below are intended to give a concrete form to the technical idea of the present invention and are not intended to limit the scope of the present invention to the embodiments described below. When multiple substances correspond to a component included in a composition, “the amount of the component in the composition” as used in the present specification refers to the total amount of the multiple substances in the composition, unless otherwise stated. Method of Manufacturing Composition for Bonded Magnets According to First Embodiment The manufacturing method according to this embodiment includes: obtaining a first kneaded mixture by kneading a rare earth-iron-nitrogen-based magnetic powder and an acid-modified polypropylene resin; and obtaining a second kneaded mixture by kneading the first kneaded mixture with a polypropylene resin and an amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower. With respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, the amount of the acid-modified polypropylene resin is 3.5 parts by weight or greater and less than 10.4 parts by weight, and the total amount of the polypropylene resin and the amorphous resin is 0.35 part by weight or greater and less than 3.88 parts by weight. Polypropylene resins have water resistance, but these resins are poor in adhesion to metals due to their low polarity and also have insufficient heat resistance. Amorphous resins are suitable for compositions for bonded magnets because the degree of mold shrinkage of these resins is smaller than that of crystalline resins; however, since these amorphous resins have high viscosity, the kneading temperature during the manufacture of a composition for bonded magnets needs to be set higher than the glass transition temperature at which the resins start to melt. This may cause oxidative degradation of the rare earth-iron-nitrogen-based magnetic powder used, depending on the type of resin. Thus, this embodiment includes obtaining a first kneaded mixture by kneading a rare earth-iron-nitrogen-based magnetic powder and an acid-modified polypropylene resin, in order to provide increased water resistance due to the nature of polypropylene resins and increased adhesion to the magnetic powder due to the presence of the acid-modified portion of the resin. Subsequently, this embodiment includes obtaining a second kneaded mixture by kneading the first kneaded mixture with a polypropylene resin and an amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower at a predetermined ratio with respect to the magnetic powder, in order to provide the bonded magnet with hot water resistance attributable to the polypropylene resin and the amorphous resin. Moreover, kneading the polypropylene resin and the amorphous resin together reduces the viscosity, which allows the kneading temperature during the manufacture of a composition for bonded magnets to be set close to the glass transition temperature of the amorphous resin. Specifically, it is considered that, when the amorphous resin has a glass transition temperature of 120° C. or higher, the amorphous resin maintains thermal stability even in an environment at 120° C., and therefore the bonded magnet provides hot water resistance in addition to water resistance attributable to polypropylene. It is also considered that, when the amorphous resin has a glass transition temperature of 250° C. or lower the kneading temperature during the manufacture of a composition for bonded magnets is allowed to be set to 250° C. or lower where the magnetic powder is less likely to undergo oxidative degradation, and therefore the bonded magnet has improved hot water resistance. The steps are described in detail below. Obtaining First Kneaded Mixture The first kneaded mixture may be obtained by kneading a rare earth-iron-nitrogen-based magnetic powder and an acid-modified polypropylene resin while heating at 210° C. to 250° C. Any kneading machine may be used, and examples include single-screw extruders, special single-screw extruders, kneaders, mixing rollers, Banbury mixers, intermeshing type twin-screw extruders, and non-intermeshing type twin-screw extruders. Rare Earth-Iron-Nitrogen-Based Magnetic Powder Examples of the rare earth-iron-nitrogen-based magnetic powder include SmFeN-based magnetic powders having good remanence and good inherent coercive force. The SmFeN-based magnetic powder may be a nitride containing a rare earth metal (Sm), iron (Fe), and nitrogen (N) as represented by general formula: SmxFe(100-x-y)Ny, where the value “x” indicating the atomic percent (%) of the rare earth metal Sm is in a range of 3 to 30 (at %); the value “y” indicating the atomic percent (%) of N is in a range of 5 to 15 (at %); and the balance is mainly Fe. The reason for limiting the atomic percent of Sm to 3 to 30 (at %) is as follows: at less than 3 at %, separation of the α-Fe phase may occur, thereby reducing the coercive force of the nitride so that the magnet can become unpractical; and at greater than 30 at %, precipitation of Sm may occur, rendering the alloy powder unstable in the air and thus reducing remanent magnetization. Meanwhile, the reason for limiting the atomic percent of nitrogen N to 5 to 15 (at %) is as follows: at less than 5 at %, coercive force may is hardly exerted; and at greater than 15 at %, nitrides of Sm, iron, or alkaline metals themselves may be formed. The SmFeN-based magnetic powder may be manufactured, for example, by a method disclosed in Japanese Patent No. 3698538. The SmFeN-based magnetic powder may have an average particle size of 2 μm to 5 μm and a standard deviation of the particle size distribution of 1.5 or less. The magnetic powder to be used in this embodiment is preferably surface-treated in order to improve oxidation resistance, water resistance, resin wettability, or chemical resistance as described below. Such treatments may be used in combination, if necessary. The surface treatment may be performed by a process chosen according to the needs, but basically by a wet process or a dry process (e.g. using a mixer). Examples of such treatment agents include, firstly, phosphorus compounds having a P—O bond. Examples of phosphoric acid treatment agents include inorganic or organic phosphoric acid treatment agents such as orthophosphoric acid, sodium dihydrogen phosphate, ammonium dihydrogen phosphate, diammonium hydrogen phosphate, zinc phosphate, calcium phosphate, and other phosphates; hypophosphorous acid and hypophosphites; pyrophosphoric acid, and polyphosphoric acids. Basically, such a phosphoric acid source may be dissolved in water or an organic solvent such as IPA and optionally supplemented with a reaction accelerator such as nitric acid ions and/or a crystal grain refining agent such as V ions, Cr ions, or Mo ions, and then a magnetic powder may be introduced into the resulting phosphoric acid bath to form a passivation film having a P—O bond on the surface of the powder particles. Besides these phosphate film treatments, the following methods may be used: treatments in which submicron or nano-order particles are adsorbed to the magnetic powder surface by a wet or dry process to form an inorganic oxide film such as silica, alumina, or titania film; sol-gel methods using organic metals; or treatments in which an inorganic oxide-treated film is formed on the magnetic powder surface. Next, a coating treatment of a magnetic powder with a coupling agent is described. Before kneading the resin and the magnetic powder to form a composite, a coat layer may be formed on the outermost surface of the surface-treated-film of the magnetic powder using a coupling agent in order to provide compatibility and association with the resin. It is preferable to form a coat layer using a coupling agent having a basic group in order to provide association with the acid-modified portion of the acid-modified polypropylene resin. Examples of the basic group include epoxy and amino groups. It is preferable in view of association to use a coupling agent having an amino group. Examples of silane coupling agents having an amino group include γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-(2-aminoethyl)aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane hydrochloride, N-β(aminoethyl)-γ-}aminopropyltrimethoxysilane, N-β(aminoethyl)-γ-aminopropylmethyldimethoxysilane, bis(trimethoxysilylpropyl)amine, and N-(1,3-dimethylbutylidene)-3-(triethoxysilyl)-1-propanamine. In the present invention, it is preferable to use a coupling agent having good reactivity with the acid anhydride group attached to the resin, preferably, for example, γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-(2-aminoethyl)aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, or γ-aminopropyltriethoxysilane. Moreover, in order to obtain a molded magnet having good properties, the amount (by weight) of amino groups derived from the coupling agent per unit surface area of the magnetic powder is more preferably 0.5 to 5 mg/m2. An amount of less than 0.5 mg/m2may result in insufficient insulation between the particles. An amount of greater than 5 mg/m2may result in both lower magnetic properties and lower water resistance due to agglomeration of the magnetic particles resulting from excessively increased affinity between these particles. Acid-Modified Polypropylene Resin In order to increase the adhesion to the rare earth-iron-nitrogen-based magnetic powder, it is preferable to use an acid-modified polypropylene resin. Examples of the acid include saturated or unsaturated carboxylic acids and carboxylic acid anhydrides. Specific examples include maleic acid, fumaric acid, succinic acid, oxalic acid, maleic anhydride, and succinic anhydride. Among these, maleic anhydride is preferable in view of association with the rare earth magnetic powder. Examples of maleic anhydride-modified polypropylene resins include maleic anhydride-grafted polypropylene resins. The maleic anhydride group may further increase adhesion by chemically bonding to the basic group at the tip of the coupling agent, particularly having an amino group, on the outermost surface of the magnetic powder. The maleic anhydride-modified polypropylene resins are polypropylene resins modified with maleic acid or maleic anhydride. Such modification may be carried out by conventionally known methods. For example, maleic anhydride may be added together with a peroxide to a polypropylene resin and kneaded using a single screw kneading extruder or a twin-screw kneading extruder to cause a graft reaction. The maleic anhydride-modified polypropylene resin to be used in the bonded magnet according to this embodiment may be produced by modifying a commercially available polypropylene resin with an acid anhydride by a method as described above. Alternatively, it may be a commercially available maleic anhydride-modified polypropylene resin. The degree of acid modification relative to polypropylene is, for example, in a range of 0.1% by weight or greater and 5% by weight or less, preferably of 0.2% by weight or greater and 2.8% by weight or less, more preferably of 0.35% by weight or greater and 1.4% by weight or less, particularly preferably of 0.7% by weight or greater and 1.25% by weight or less, to improve hot water resistance. The number average molecular weight of the acid-modified polypropylene resin is preferably in a range of 20,000 or greater and 90,000 or less. A number average molecular weight of less than 20,000 reduces the mechanical strength of the bonded magnet. A number average molecular weight of greater than 90,000 increases the viscosity. The amount of the acid-modified polypropylene resin is, for example, in a range of 3.5 parts by weight or greater and less than 10.4 parts by weight, preferably of 4 parts by weight or greater and less than 9.3 parts by weight, particularly preferably of 5 parts by weight or greater and 7 parts by weight or less, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder. An amount of less than 3.5 parts by weight reduces the adhesion to the rare earth-iron-nitrogen-based magnetic powder. An amount of 10.4 parts by weight or greater reduces hot water resistance. Obtaining Second Kneaded Mixture The second kneaded mixture may be obtained by kneading the first kneaded mixture with a polypropylene resin and an amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower while heating at 210° C. to 250° C. Polypropylene Resin The polypropylene resin is preferably a non-modified polypropylene resin having a number average molecular weight in a range of 20,000 or greater and 90,000 or less. A number average molecular weight of less than 20,000 reduces the mechanical strength of the bonded magnet. A number average molecular weight of greater than 90,000 increases the viscosity. The amount of the polypropylene resin is, for example, in a range of 0.05 parts by weight or greater and less than 0.65 parts by weight, preferably 0.2 parts by weight or greater and 0.5 parts by weight or less, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, to improve hot water resistance. Amorphous Resin The amorphous resin to be used is a resin having a glass transition temperature of 120° C. or higher with good miscibility with the polypropylene resin in order to compensate for the low thermal stability of the acid-modified polypropylene resin and the polypropylene resin. The resin to be used also has a glass transition temperature of 250° C. or lower in order to keep the molding temperature low to prevent oxidative degradation of the rare earth-iron-nitrogen-based magnetic powder. Examples of the amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower include polycarbonate resins (PC), polyphenylene ether resins (PPE), polyether sulfone resins (PES), polysulfone resins (PSU), polyether imide resins (PEI), and polyarylate resins (PAR). These resins may be used alone or in combinations of two or more. In particular, polyphenylene ether having a glass transition temperature higher than 200° C. with a very low water absorption rate is preferable. The polyphenylene ether may be modified. The amount of the amorphous resin is, for example, in a range of 0.1 parts by weight or greater and less than 3.23 parts by weight, preferably of 0.3 parts by weight or greater and 2.5 parts by weight or less, particularly preferably of 0.7 parts by weight or greater and 2 parts by weight or less, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, to improve hot water resistance. The total amount of the polypropylene resin and the amorphous resin is, for example, in a range of 0.35 part by weight or greater and less than 3.88 parts by weight, preferably of 0.5 parts by weight or greater and 2.5 parts by weight or less, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, to improve hot water resistance. Polymer Alloy In order to improve miscibility with the acid-modified polypropylene resin, it is preferable to use a polymer alloy containing the polypropylene resin and the amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower. The polymer alloy resin containing the amorphous resin and the polypropylene resin may be produced by any conventionally known methods. For example, when the amorphous resin is polyphenylene ether, a polymer alloy resin may be produced by the following methods: a polypropylene resin and a polyphenylene ether/polystyrene resin are separately combined with a peroxide and maleic anhydride, followed by melt-kneading using a single screw kneading extruder or a twin-screw kneading extruder to obtain resins graft-modified with the acid anhydride; diamine is added to these resins and kneaded again to bond the constituent components by grafting. Alternatively, a compatibilizer is added to a polypropylene resin and a polyphenylene ether/polystyrene alloy resin and kneaded. Examples of the compatibilizer used in the latter case include hydrogenated butadiene/styrene copolymers, styrene-ethylene/butylene-styrene block copolymers, styrene-ethylene/butylene-ethylene block copolymers, and ethylene-ethylene/butylene-ethylene block copolymers. The amount of the polypropylene resin in the polymer alloy is adjusted in a range of, for example, 10% by mass or greater and 20% by mass or less. The amount of the amorphous resin is adjusted in a range of, for example, 50% by mass or greater and 70% by mass or less. The polymer alloy resin may be a commercial product, and examples include Xyron EV103 and Xyron T0702 (Asahi Kasei Corporation), and Lemalloy PX603Y (Mitsubishi Chemical Corporation). Examples of the polyphenylene ether resin include poly(2,6-dimethyl-1,4-phenylene)ether, poly(2-methyl-6-ethyl-1,4-phenylene)ether, poly(2,6-diethyl-1,4-phenylene)ether, poly(2-methyl-6-n-propyl-1,4-phenylene)ether, poly(2-ethyl-6-n-propyl-1,4-phenylene)ether, poly(2,6-di-n-propyl-1,4-phenylene)ether, poly(2-methyl-6-propyl-1,4-phenylene)ether, poly(2-ethyl-6-isopropyl-1,4-phenylene)ether, poly(2,6-diisopropyl-1,4-phenylene)ether, poly(2-methyl-6-phenyl-1,4-phenylene)ether, poly(2,6-diphenyl-1,4-phenylene)ether, poly(2-methyl-6-chloro-1,4-phenylene)ether, poly(2-methyl-6-hydroxyethyl-1,4-phenylene)ether, poly(2-methyl-6-chloroethyl-1,4-phenylene)ether, poly(2-methyl-6-methoxy-1,4-phenylene)ether, poly(2-methyl-1,4-phenylene)ether, poly(1,4-phenylene)ether, and poly(2,6-di(p-fluorophenyl)-1,4-phenylene)ether. The amount of the polymer alloy is, for example, in a range of 0.5 parts by weight or greater and less than 5.38 parts by weight, preferably of 1 part by weight or greater and 5 parts by weight or less, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, to improve hot water resistance. Obtaining Third Kneaded Mixture This embodiment preferably further includes obtaining a third kneaded mixture by kneading the second kneaded mixture and a polypropylene resin having a number average molecular weight of 9,000 or less. The third kneaded mixture may be obtained by kneading the second kneaded mixture and a polypropylene resin having a number average molecular weight of 9,000 or less while heating at 210° C. to 250° C. Polypropylene Resin Having Number Average Molecular Weight of 9,000 or Less Use of a low molecular weight polypropylene resin having a number average molecular weight of 9,000 or less further improves hot water resistance. Examples of the low molecular weight polypropylene resin include Hi-Wax (Mitsui Chemicals, Inc.), Umex and Viscol (Sanyo Chemical Industries, Ltd.), and Licocene PP (Clariant). The amount of the polypropylene resin having a number average molecular weight of 9,000 or less is, for example, in a range of 0.01 part by weight or greater and 3.5 parts by weight or less, preferably of 0.08 parts by weight or greater and 3 parts by weight or less, particularly preferably of 0.7 parts by weight or greater and 2.5 parts by weight or less, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, to improve hot water resistance. The polypropylene resin having a number average molecular weight of 9,000 or less is more preferably a non-modified polypropylene resin. Use of a non-modified polypropylene resin having a number average molecular weight of 9,000 or less further improves hot water resistance. Additives In the steps of obtaining the respective kneaded mixtures, various additives may be added, if necessary, such as lubricants, antioxidants, heavy metal deactivators, crystal nucleating agents, flame retardants, plasticizers, ultraviolet absorbers, antistatic agents, colorants, and release agents. Among these additives, phenolic or phosphorus antioxidants and/or heavy metal deactivators may be suitably used in order to alleviate damage to the resin molecules due to severe conditions (e.g. high temperature and high humidity), catalysis by ultraviolet light or active metals, or external forces (e.g. shear and friction), to which the product is exposed during the kneading or bonded magnet formation processes or during actual use. Method of Manufacturing Composition for Bonded Magnets According to Second Embodiment The manufacturing method according to this embodiment is a method of manufacturing a composition for bonded magnets, including: providing a rare earth-iron-nitrogen-based magnetic powder having a coat layer containing a basic group, an acid-modified polypropylene resin, a polypropylene resin, and an amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower; and obtaining a kneaded mixture by kneading the rare earth-iron-nitrogen-based magnetic powder having a coat layer containing a basic group, the acid-modified polypropylene resin, the polypropylene resin, and the amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower, wherein, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, the amount of the acid-modified polypropylene resin is 3.5 parts by weight or greater and less than 10.4 parts by weight, and the total amount of the polypropylene resin and the amorphous resin is 0.35 part by weight or greater and less than 3.88 parts by weight. In the second embodiment, the rare earth-iron-nitrogen-based magnetic powder having a coat layer containing a basic group and the acid-modified polypropylene resin are kneaded together in order to provide increased water resistance due to the nature of polypropylene resins and increased adhesion to the magnetic powder due to association between the basic group and the acid-modified portion. It is also considered that the polypropylene resin and the amorphous resin are also kneaded together in order to provide the bonded magnet with hot water resistance attributable to the polypropylene resin and the amorphous resin, as is the case in the first embodiment. The kneaded mixture in the second embodiment may be obtained by kneading a rare earth-iron-nitrogen-based magnetic powder having a coat layer containing a basic group, an acid-modified polypropylene resin, a polypropylene resin, and an amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower while heating at 210° C. to 250° C. Any kneading machine may be used, and examples include single-screw extruders, special single-screw extruders, kneaders, mixing rollers, Banbury mixers, intermeshing type twin-screw extruders, and non-intermeshing type twin-screw extruders. The rare earth-iron-nitrogen-based magnetic powder and the resins, and the amount and other conditions thereof are as described above in the first embodiment, and detailed descriptions thereof are thus omitted. The kneaded mixture in the second embodiment preferably further contains a polypropylene resin having a number average molecular weight of 9,000 or less which has been provided in advance. The polypropylene resin having a number average molecular weight of 9,000 or less and the amount and other conditions thereof are as described above in the first embodiment, and detailed descriptions thereof are thus omitted. The composition for bonded magnets according to the second embodiment may be obtained by cutting the above-described kneaded mixture into an appropriate size after cooling. Composition for Bonded Magnet According to Third Embodiment The composition for bonded magnets according to this embodiment includes: a rare earth-iron-nitrogen-based magnetic powder; an acid-modified polypropylene resin; a polypropylene resin; and an amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower, wherein, with respect to 100 parts by weight of the rare earth-iron-nitrogen-based magnetic powder, the amount of the acid-modified polypropylene resin is 3.5 parts by weight or greater and less than 10.4 parts by weight, and the total amount of the polypropylene resin and the amorphous resin is 0.35 part by weight or greater and less than 3.88 parts by weight. In the third embodiment, the presence of the acid-modified polypropylene resin increases adhesion to the rare earth-iron-nitrogen-based magnetic powder. Further, the presence of the polypropylene resin and the amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower at a predetermined ratio with respect to the magnetic powder provides water resistance attributable to the polypropylene resin and heat resistance attributable to the amorphous resin. Overall, this results in improved hot water resistance. Also in the third embodiment, within the composition for bonded magnets, the acid-modified polypropylene resin tends to be located on the surface of the magnetic powder particles due to adhesion of the acid-modified group of the acid-modified polypropylene resin to the magnetic powder, while the polypropylene resin and the amorphous resin having a glass transition temperature of 120° C. or higher and 250° C. or lower tend to be located on the surface of the acid-modified polypropylene resin. The acid-modified group portion of the acid-modified polypropylene resin, which has polarity, can bind to moisture, but hot water resistance is provided by the presence of the polypropylene resin and the amorphous resin on the surface of the acid-modified polypropylene resin. The rare earth-iron-nitrogen-based magnetic powder and the resins, and the amount and other conditions thereof are as described above in the first embodiment, and detailed descriptions thereof are thus omitted. In view of hot water resistance, the composition for bonded magnets preferably further contains a polypropylene resin having a number average molecular weight of 9,000 or less. When the number average molecular weight is 9,000 or less, such a low molecular weight component tends to bleed out to the outermost surface of the composition to form a skin layer, and tends to be located on the surface of the polypropylene resin and the amorphous resin. This increases hot water resistance. The polypropylene resin having a number average molecular weight of 9,000 or less and the amount and other conditions thereof are as described above in the first embodiment, and detailed descriptions thereof are thus omitted. With the use of the composition for bonded magnets, it is possible to manufacture a bonded magnet having good hot water resistance. Specifically, for example, a bonded magnet may be obtained by heat treating the composition for bonded magnets in an orientation field to align the easy axes of magnetization (orientation step), followed by pulse magnetization in a magnetizing field (magnetization step). The heat treatment temperature in the orientation step is preferably, for example, 90° C. or higher and 250° C. or lower, more preferably in a range of 150° C. to 230° C. The magnitude of the orientation field in the orientation step may be, for example, 720 kA/m. The magnitude of the magnetizing field in the magnetization step may be, for example, 1500 to 2500 kA/m. EXAMPLES Hereinafter, certain examples of the present invention are described in detail. The details of materials, test methods, and evaluation methods are described by means of examples, but the present invention is not limited to these examples, and modifications may be made without departing from the gist of the present invention. 1. Providing Raw Materials 1-1. Rare Earth-Iron-Nitrogen-Based Magnetic Powder Surface Treatment Method An Sm—Fe—N anisotropic magnetic powder (3,000 g) was introduced into a mixer, followed by purging with nitrogen. Then, a mixed solution of a silane coupling agent (γ-aminopropyltriethoxysilane) (12 g), ethanol (12 g), and ammonia water (6 g) was added by spray to the magnetic powder with mixing, followed by mixing for one minute and then drying under nitrogen flow at 120° C. for five hours. Thus, an Sm2Fe17N3powder having a coupling agent film formed on a silica film (hereinafter, magnetic powder (A)) was obtained. Average particle size: about 2.8 μm (measured by FSSS method) Magnetic properties: Remanence (Br): 12.5 kG Inherent coercive force (iHc): 16 kOe Squareness (Hk): 7 kOe 1-2. Acid-Modified Polypropylene Resin (Hereinafter, Resin (A)) Polypropylene resin:Degree of maleic anhydride modification: 1% by weightNumber average molecular weight (Mn): about 40,000 1-3. Polypropylene Resin (Hereinafter, Resin (B)) and Amorphous Resin (Hereinafter, Resin (C)) Polypropylene resin:Acid modification: noneNumber average molecular weight (Mn): about 20,000 Amorphous resin: poly(2,6-dimethyl-1,4-phenylene)ether resin (Tg: about 214° C.) Polyphenylene Ether/Polystyrene/Polypropylene Composite Alloy Resin Production Method The resin (B) (15 parts by weight) and a styrene-ethylene/butylene-styrene block copolymer (styrene content: 53%, specific gravity: 0.97) (10 parts by weight) were added to a miscible resin (100 parts by weight) obtained by kneading the resin (C) and a polystyrene resin at a ratio of 3:1, and they are kneaded using a twin-screw extruder to obtain a polyphenylene ether/polystyrene/polypropylene composite alloy resin (hereinafter, alloy resin (D)). 1-4. Resin (E) Polypropylene resin (E-1):Degree of maleic anhydride modification: 0% by weightNumber average molecular weight (Mn): 3,000 Polypropylene resin (E-2):Degree of maleic anhydride modification: 0% by weightNumber average molecular weight (Mn): 4,000 Polypropylene resin (E-3):Degree of maleic anhydride modification: 0% by weightNumber average molecular weight (Mn): 9,000 Polypropylene resin (E-4):Degree of maleic anhydride modification: about 0.3% by weightNumber average molecular weight (Mn): 3,500 Example 1 Manufacturing Composition for Bonded Magnets The magnetic powder (A), the resin (A), the alloy resin (D), and an antioxidant were introduced into a twin-screw kneading machine such that, with respect to 100 parts by weight of the magnetic powder, the amount of the resin (A) was 7.36 parts by weight, the amount of the resin (D) was 3.15 parts by weight, and the amount of the antioxidant was 0.3 parts by weight. The mixture was kneaded at 220° C. to obtain a kneaded mixture. After cooling, the obtained kneaded mixture was cut into an appropriate size to obtain a composition for bonded magnets. Molding The obtained composition for bonded magnets was melted in a cylinder at 240° C., and injection-molded in an orientation field of 9 kOe in a mold whose temperature was adjusted to 90° C. Thus, a cylindrical bonded magnet (ϕ10/t7) was obtained. The magnet was imparted with magnetic properties by pulse magnetization in a magnetizing field of 60 kOe. Hot Water Resistance Evaluation The magnetized bonded magnet was placed with water in a pressure-resistant vessel and subjected to a pressure cooker test (PCT) (121° C./2 atm/450 hr) to evaluate hot water resistance. For the hot water resistance evaluation, the total flux of the bonded magnet was measured before and after the PCT test using a flux meter, and the hot water resistance was evaluated based on the irreversible demagnetization ratio [(total flux of bonded magnet after 450-hour PCT)/(total flux of bonded magnet before 450-hour PCT)×100)]. Example 2 Manufacturing Composition for Bonded Magnets The magnetic powder (A), the resin (A), the alloy resin (D), the resin (E-1), and an antioxidant were introduced into a twin-screw kneading machine such that, with respect to 100 parts by weight of the magnetic powder, the amount of the resin (A) was 7.29 parts by weight, the amount of the resin (D) was 3.15 parts by weight, the amount of the resin (E-1) was 0.08 parts by weight, and the amount of the antioxidant was 0.3 parts by weight. The mixture was kneaded at 220° C. to obtain a kneaded mixture. After cooling, the obtained kneaded mixture was cut into an appropriate size to obtain a composition for bonded magnets. Molding A bonded magnet was produced in the same manner as in Example 1, and evaluated for hot water resistance. Comparative Example 1 The magnetic powder (A) and a 12 nylon (PA12) resin (weight average molecular weight Mw: 12,000) were kneaded while heating at 210° C. using a twin-screw kneading machine such that, with respect to 100 parts by weight of the magnetic powder, the amount of the PA12 resin was 8.3 parts by weight and the amount of an antioxidant was 0.3 parts by weight. After cooling, the obtained kneaded mixture was cut into an appropriate size to obtain a composition for bonded magnets. Molding The obtained composition for bonded magnets was melted in a cylinder at 230° C., and injection-molded in an orientation field of 9 kOe in a mold whose temperature was adjusted to 90° C. Thus, a cylindrical bonded magnet (ϕ10/t7) was obtained. The magnet was imparted with magnetic properties by pulse magnetization in a magnetizing field of 60 kOe. Hot Water Resistance Evaluation The hot water resistance of the obtained bonded magnet was evaluated in the same manner as in Example 1. Comparative Example 2 The magnetic powder (A) and a polyphenylene sulfide (PPS) resin (linear; weight average molecular weight Mw: 20,000) were kneaded while heating at 300° C. using a twin-screw kneading machine such that the amount of the PPS resin was 14 parts by weight with respect to 100 parts by weight of the magnetic powder. After cooling, the obtained kneaded mixture was cut into an appropriate size to obtain a composition for bonded magnets. Molding The obtained compound was melted in a cylinder at 320° C., and injection-molded in an orientation field of 9 kOe in a mold whose temperature was adjusted to 150° C. Thus, a cylindrical bonded magnet (ϕ10/t7) was obtained. The magnet was imparted with magnetic properties by pulse magnetization in a magnetizing field of 60 kOe. Hot Water Resistance Evaluation The hot water resistance of the obtained bonded magnet was evaluated in the same manner as in Example 1. Examples 3 to 13 and Comparative Examples 3 and 4 Bonded magnets were produced in the same manner as in Example 1 or Example 2, except that, with respect to 100 parts by weight of the magnetic powder (A), the amounts of the resin (A) and the alloy resin (D) were as indicated in Table 1 and that the type of resin (E) and its amount (with respect to 100 parts by weight of the magnetic powder (A)) were as indicated in Table 1. Then, their hot water resistance was evaluated. In addition, the alloy resin (D) in Example 13 or Comparative Example 4 was provided with a ratio shown in Table 1 by the same method as described above for the alloy resin. TABLE 1AlloyResinResinResinresinPA12(A)(B)(C)(D)Resin (E)resinPPS resinDemagnetizationParts byParts byParts byParts byParts byParts byParts byratioweightweightweightB + CweightTypeweightweightweight%Example 17.360.381.892.273.15————26.3Example 27.290.381.892.273.15E-10.08——26Example 37.140.381.892.273.15E-10.23——20.5Example 46.990.381.892.273.15E-10.38——22Example 56.620.381.892.273.15E-10.75——16.1Example 65.870.381.892.273.15E-11.5——15.4Example 75.130.381.892.273.15E-12.25——16.8Example 86.620.381.892.273.15E-20.75——17.2Example 96.620.381.892.273.15E-30.75——15Example 107.140.381.892.273.15E-40.23——26.7Example 116.990.381.892.273.15E-40.38——25.3Example 126.620.381.892.273.15E-40.75——26.2Example 139.30.120.620.741.03————25.2Comparative———————8.3—52Example 1Comparative————————1429.3Example 2Comparative10.4————————38.4Example 3Comparative5.380.653.233.885.38————31.6Example 4 Example 14 Obtaining First Kneaded Mixture The magnetic powder (A), the resin (A), and an antioxidant are introduced into a twin-screw kneading machine through its first feeder such that, with respect to 100 parts by weight of the magnetic powder (A), the amount of the resin (A) is 6.62 parts by weight and the amount of the antioxidant is 0.3 parts by weight. The mixture is kneaded at 220° C. to obtain a first kneaded mixture. Obtaining Second Kneaded Mixture The alloy resin (D) is introduced into the twin-screw kneading machine through its second feeder such that, with respect to 100 parts by weight of the magnetic powder (A), the amount of the alloy resin (D) is 3.15 parts by weight (with respect to the magnetic powder (A), the amount of the resin (B) is 0.38 parts by weight and the amount of the resin (C) is 1.89 parts by weight), and then kneaded with the first kneaded mixture at 220° C. to obtain a second kneaded mixture. Obtaining Third Kneaded Mixture The resin (E-3) is introduced into the twin-screw kneading machine through its third feeder such that the amount of the resin (E-3) is 0.75 parts by weight with respect to 100 parts by weight of the magnetic powder (A), and then kneaded with the second kneaded mixture at 220° C. to obtain a third kneaded mixture. After cooling, the obtained third kneaded mixture is cut into an appropriate size to obtain a composition for bonded magnets. Molding and Hot Water Resistance Evaluation A bonded magnet was produced in the same manner as in Example 1 to evaluate hot water resistance. Table 1 shows the relationships between the composition and the demagnetization ratio of the bonded magnets obtained above.FIG.1shows the relationships between the demagnetization ratio and the elapsed time in the PCT test. As shown inFIG.1, in Comparative Example 1, the demagnetization after one-hour PCT (hereinafter, initial demagnetization) was small, but eventually the magnet was greatly demagnetized. This is probably because, since the moisture-absorbing PA resin was used, the magnetic powder was degraded by reaction with the moisture that penetrated into the magnet over time. In Comparative Example 2, the initial demagnetization was large, the demagnetization proceeded with time, and eventually the magnet was greatly demagnetized. This is probably because the kneading temperature and the bonded magnet molding temperature had to be set to 300° C. due to the high viscosity of the PPS resin, and therefore the magnetic powder was oxidatively degraded at such high temperatures. In Comparative Example 3, the initial demagnetization was small, but eventually the magnet was greatly demagnetized, and thus the same tendency as the 12 nylon magnet was observed. This is probably because, since the acid-modified polypropylene resin alone was used, the heat resistance was insufficient and the magnet was softened at high temperatures, thus allowing penetration and diffusion of moisture into the magnet. The results in Comparative Example 4 are probably because, since the amount of the acid modification polypropylene resin relative to the amount of the alloy resin was small, the water resistance was insufficient, thus allowing penetration and diffusion of moisture into the magnet. In contrast, in Examples 1 to 13, the initial demagnetization and the final demagnetization were both suppressed. This is probably because the kneading temperature and the molding temperature were reduced to 240° C., and also because the resins were incorporated in predetermined amounts to provide the bonded magnet with appropriate hot water resistance. Moreover, Example 14, which had the same composition as in Example 9, would be expected to show a demagnetization ratio equal to or lower than that in Example 9, as described for the first embodiment. FIG.2shows a graph of amount of the resin (E-1) versus irreversible magnetization ratio after a pressure cooker test (121° C./2 atm/450 hr). The results show that the amount of the resin (E-1) able to effectively reduce the demagnetization ratio of the magnet was 0.2 parts by weight or greater. The demagnetization ratio was found to be reduced particularly when the amount of the resin (E-1) was 0.75 parts by weight or greater and 1.75 parts by weight or less. FIG.3shows a graph of degree of maleic anhydride modification versus irreversible demagnetization ratio after a pressure cooker test (121° C./2 atm/200 hr) of bonded magnets produced in the same manner as in Example 1 but replacing the resin (A) with maleic anhydride-modified polypropylene resins having varying degrees of modification ranging from 0 to 2.8% by weight (0, 0.14, 0.35, 0.7, 1, 1.4, 1.75, and 2.8% by weight). The results show that the degree is preferably 0.2% by weight or greater and 2.8% by weight or less, more preferably 0.35% by weight or greater and 1.4% by weight or less, particularly preferably 0.7% by weight or greater and 1.25% by weight or less. The present invention provides compositions for bonded magnets that may be suitably used in magnet components for motors, sensors, or actuators which are to be exposed to high-temperature, high-humidity environments or hot water. | 41,474 |
11862373 | DETAILED DESCRIPTION The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a second feature over or on a first feature in the description that follows may include embodiments in which the second and first features are formed in direct contact, and may also include embodiments in which additional features may be formed between the second and first features, such that the second and first features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, spatially relative terms, such as “beneath”, “below”, “lower”, “on”, “over”, “overlying”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. FIG.1is a schematic cross-sectional view of a memory device in accordance with some embodiments.FIG.2is a schematic cross-sectional view of a memory stack in accordance with some embodiments. Referring toFIG.1andFIG.2, a memory device1includes a substrate100, a first transistor T1, a second transistor T2and a MRAM cell110. In some embodiments, the substrate100includes silicon and/or elementary semiconductor such as germanium. Alternatively or additionally, the substrate may include a compound semiconductor such as silicon carbide, gallium arsenide, indium arsenide, and/or indium phosphide. In some embodiments, the substrate100may include a silicon-on-insulator (SOI) structure. The substrate100may also include various doping configurations depending on design requirements as is known in the art such as P-type substrate and/or N-type substrate and various doped regions such as P-wells and/or N-wells. In some embodiments, the first transistor T1and the second transistor T2are disposed separately on the substrate100. Each of the first transistor T1and the second transistor T2may be a lateral transistor, a vertical transistor or a suitable semiconductor device, like a bipolar device. The transistor is a FinFET device, a tunnel FET (“TFET”) device, a gate-all-around (“GAA”) device or a suitable device depending on MRAM circuitry design. In some embodiments, the first transistor T1includes a gate dielectric layer102, a gate electrode104over the gate dielectric layer102and a spacer105aside the gate electrode104. Similarly, the second transistor T2includes a gate dielectric layer202, a gate electrode204over the gate dielectric layer202and a spacer205aside the gate electrode204. Each of the gate dielectric layers102and202may include a high-k material having a dielectric constant greater than about 10. In some embodiments, the high-k material includes metal oxide, such as ZrO2, Gd2O3, HfO2, BaTiO3, Al2O3, LaO2, TiO2, Ta2O5, Y2O3, STO, BTO, BaZrO, HfZrO, HfLaO, HfTaO, HfTiO, the like, or a combination thereof. In alternative embodiments, each of the gate dielectric layers102and202can optionally include a silicate such as HfSiO, LaSiO, AlSiO, the like, or a combination thereof. Each of the gate electrodes104and204may include a metal material suitable for forming a metal gate or portion thereof. In some embodiments, each of the gate electrodes104and204includes a work function metal layer and a fill metal layer on the work function metal layer. The work function metal layer is an N-type work function metal layer and/or a P-type work function metal layer. In some embodiments, the N-type work function metal layer includes TiAl, TiAlN, or TaCN, conductive metal oxide, and/or a suitable material. In alternative embodiments, the P-type work function metal layer includes TiN, WN, TaN, conductive metal oxide, and/or a suitable material. The fill metal layer includes copper, aluminum, tungsten, or a suitable material. In some embodiments, each of the gate electrodes104and204functions as a word line WL. Each of the spacers105and205may include a nitrogen-containing dielectric material, a carbon-containing dielectric material or both, and the spacers104have a dielectric constant less than about 10, or even less than about 5. In some embodiments, the spacers104include SiN, SiCN, SiOCN, SiOR (wherein R is an alkyl group such as CH3, C2H5or C3H7), SiC, SiOC, SiON, the like, or a combination thereof. In some embodiments, the first transistor T1has two source/drain regions106and108in the substrate100at two sides thereof. In some embodiments, the source/drain region106functions as a drain region, and the source/drain region108functions as a source region. Similarly, the first transistor T2has two source/drain regions206and208in the substrate100at two sides thereof. In some embodiments, the source/drain region206functions as a drain region, and the source/drain region208functions as a source region. In some embodiments, the source/drain region106of the first transistor T1is disposed adjacent to the source/drain region206of the first transistor T2. In some embodiments, each of the source/drain regions106,108,206and208includes silicon germanium (SiGe) for a P-type device. In alternative embodiments, each of the source/drain regions106,108,206and208includes silicon carbon (SiC), silicon phosphate (SiP), SiCP or a SiC/SiP multi-layer structure for an N-type device. In some embodiments, the source/drain regions106,108,206and208may be optionally implanted with a P-type dopant or an N-type dopant as needed. In some embodiments, a dummy transistor DT is further included and disposed between the first transistor T1and the second transistor T2. The dummy transistor DT includes a dummy gate dielectric layer, a dummy gate electrode over the dummy gate dielectric layer and a dummy spacer aside the dummy gate electrode. The dummy transistor DT is formed during the formation of the first transistor T1and the second transistor T2. In some embodiments, the dummy transistor DT is grounded during the operation of the memory device1. In some embodiments, a zeroth interlayer dielectric layer ILD0is formed over the first and second transistors T1and T2, and a zeroth metal layer M0is formed on the zeroth interlayer dielectric layer ILD0. In some embodiments, the zeroth metal layer M0functions as a source line SL. In some embodiments, the zeroth metal layer M0is electrically coupled to the source/drain region106and108through zeroth via plugs V01and V02, respectively. Similarly, the zeroth metal layer M0is electrically coupled to the source/drain regions206and208through zeroth via plugs V01and V02, respectively. In some embodiments, the zeroth interlayer dielectric layer ILD0includes nitride such as silicon nitride, oxide such as silicon oxide, phosphosilicate glass (PSG), borosilicate glass (BSG), boron-doped phosphosilicate glass (BPSG), the like, or a combination thereof, and is formed by a suitable deposition technique such as spin-coating, chemical vapor deposition (CVD), flowable CVD, plasma-enhanced CVD (PECVD), atomic layer deposition (ALD), the like, or a combination thereof. In some embodiments, an etch stop layer is formed included in the zeroth interlayer dielectric layer ILD0, and the etch stop layer includes SiN, SiC or the like. In some embodiments, each of the zeroth meta layer M0and the zeroth via plugs V01/V02includes Al, Cu, AlCu, Au, Ti, TiN, Ta, TaN, W, WN or a combination thereof, and is formed by a suitable technique such as sputtering, electroless plating, electro plating, PVD, CVD, ALD, the like, or a combination thereof. In some embodiments, a first interlayer dielectric layer ILD1is formed over the zeroth interlayer dielectric layer ILD0, and a first metal layer M1is formed on the first interlayer dielectric layer ILD1. In some embodiments, the first metal layer M1is electrically coupled to the zeroth metal layer M0(and therefore the source/drain region106) through a first via plug V1. Similarly, the first metal layer M1is electrically coupled to the zeroth metal layer M0(and therefore the source/drain region206) through another first via plug V1. The materials and forming methods of the first interlayer dielectric layer ILD1, the first metal layer M1and the first via plugs V1are similar to those of the zeroth interlayer dielectric layer ILD0, the zeroth metal layer M0and the zeroth via plugs V01/V02described above, so the details are not iterated herein. In some embodiments, a second interlayer dielectric layer ILD2is formed over the first interlayer dielectric layer ILD1, and a second metal layer M2is formed on the second interlayer dielectric layer ILD2. In some embodiments, the second metal layer M2is electrically coupled to the first metal layer M1(and therefore the source/drain region106) through a second via plug V2. Similarly, the second metal layer M2is electrically coupled to the first metal layer M1and therefore the source/drain region206through another second via plug V2. The materials and forming methods of the second interlayer dielectric layer ILD2, the second metal layer M2and the second via plugs V2are similar to those of the zeroth interlayer dielectric layer ILD0, the zeroth metal layer M0and the zeroth via plugs V01/V02described above, so the details are not iterated herein. In some embodiments, a third interlayer dielectric layer ILD3is formed over the second interlayer dielectric layer ILD2, and a third metal layer M3is formed on the third interlayer dielectric layer ILD3. In some embodiments, two patterns of the third metal layer M3function as bottom electrodes BE of the MRAM cell110. In some embodiments, the third metal layer M3is electrically coupled to the second metal layer M2(and therefore the source/drain region106) through a third via plug V3. Similarly, the third metal layer M3is electrically coupled to the second metal layer M2(and therefore the source/drain region206) through another third via plug V3. The materials and forming methods of the third interlayer dielectric layer ILD3, the third metal layer M3and the third via plugs V3are similar to those of the zeroth interlayer dielectric layer ILD0, the zeroth metal layer M0and the zeroth via plugs V01/V02described above, so the details are not iterated herein. Referring toFIG.1andFIG.2simultaneously, a memory stack MS1such as a MRAM stack is formed on the bottom electrodes BE of the third metal layer M3. Specifically, in addition to the bottom electrodes BE, the MRAM cell110further includes a spin-orbit torque (SOT) layer10and an overlying magnetic tunnel junction (MTJ) stack28. In some embodiments, the width of the MTJ stack28is less than the width of the SOT layer10. In some embodiments, the MTJ stack28includes, from bottom to top, a synthetic free layer14, a tunneling barrier layer16and a reference layer18. In some embodiments, the MTJ stack28includes a dielectric layer (e.g., tunneling barrier layer16) sandwiched between a magnetic fixed layer (e.g., reference layer18) and a magnetic free layer (e.g., synthetic free layer14) whose magnetization polarity can be changed. Due to the tunnel magnetoresistance effect, the resistance value between the reference layer and the synthetic free layer changes with the magnetization polarity switch in the synthetic free layer. Parallel magnetizations (“P state”) lead to a lower electric resistance, whereas antiparallel magnetizations (“AP state”) lead to a higher electric resistance. The two states of the resistance values are considered as two logic states “1” or “0” that are stored in the MRAM cell. In some embodiments, the memory stack MS1is a spin-orbit torque (“SOT”) MRAM (“SOT-MRAM”) stack. In the SOT-MRAM stack, a MTJ structure is positioned on a heavy metal layer with large spin-orbit interaction. The free layer (e.g., synthetic free layer14) is in direct contact with the heavy metal layer (e.g., SOT layer10). Spin torque is induced by the in-plane current injected through the heavy metal layer under the spin-orbit coupling effect, which generally includes one or more of the Rashba effect or the spin Hall effect (“SHE effect”). The write current does not pass through the vertical MTJ. Instead, the write current passes through the heavy metal layer in an in-plane direction. The magnetization polarity in the free layer (e.g., synthetic free layer14) is set through the SOT effect. More specifically, when a current is injected in-plane in the heavy metal layer, the spin orbit coupling leads to an orthogonal spin current which creates a spin torque and induce magnetization reversal in the free layer. In some embodiments, the SOT layer10is formed over the two bottom electrodes BE. Specifically, the two bottom electrodes BE are disposed below and in physical contact with two edge portions of the SOT layer10, while exposes the central portion of the SOT layer10. In some embodiments, the SOT layer10includes heavy metal such as W, Pt, AuPt or a combination thereof. In some embodiments, the SOT layer10has a thickness of about 1 nm to 5 nm. In some embodiments, the SOT layer10extends beyond the edges of the bottom electrodes BE. However, the disclosure is not limited thereto. In alternative embodiments, the edge of the SOT layer10is aligned with the edges of the bottom electrodes BE. In some embodiments, the reference layer18is formed over the SOT layer10. In some embodiments, the reference layer18has a fixed orientation or polarity, e.g., in the left direction as shown by a unidirectional arrow, parallel to a substrate plane or a plane which the MTJ stack28sits on. In some embodiments, the reference layer18includes one or more of Fe, Co, Ni, FeCo, CoNi, CoFeB, FeB, FePt, FePd and a suitable ferromagnetic material. In some embodiments, the reference layer18includes FeCo, CoFeB, FeB, the like, or a combination thereof. In some embodiments, the reference layer18includes CoFeB and has a thickness of about 1 nm to 3 nm. In some embodiments, the synthetic free layer14is formed between the SOT layer10and the reference layer18. Herein, the term “synthetic free layer” indicates a free layer including two layers configured to have magnetic anisotropies perpendicular to each other. Specifically, the synthetic free layer of the disclosure has a canting magnetic anisotropy. In some embodiments, the canting angle or titling angle may be more than zero degrees and no more than about 45 degrees (i.e., 0<canting angle≤45). In some embodiments, such canting magnetic anisotropy improves the conversion rate of the synthetic free layer14. The canting angle is naturally formed by adding an extra vertical layer in the stack. Such canting angle is helpful for the switching due to the symmetry breaking. For the perpendicular magnetic anisotropy (PMA) case, a perpendicular magnetization with an in-plane SOT current is known to require an external magnetic field along the current direction. A tilting angle can solve this issue because the special symmetry is broken due to the tilting angle. A larger angle can result in a lower switching current. The tilting angle should be small, usually would not exceed about 45 degrees. An larger tilting angle also indicates a smaller anisotropy/retention. This is the reason why switching current is lower. In the present disclosure, the switching current of the device can be lower when the canting angle is greater than zero. However, the reading window of the device may be reduced when the canting angle is greater than 45 degrees. In the present disclosure, by controlling and adjusting the canting angle within the above range, both the switching current and the reading window can be improved, and the operation performance of the device is accordingly boosted. In some embodiments, the synthetic free layer14includes a first free layer11, a second free layer13, and a non-magnetic metal spacer12between the first free layer11and the second free layer13. In some embodiments, the first free layer11has a first magnetic anisotropy, and the second free layer13has a second magnetic anisotropy perpendicular to the first magnetic anisotropy. Specifically, the first free layer11, the non-magnetic metal spacer12and the second free layer13together form a tri-layered synthetic free layer14. The synthetic free layer14of the present disclosure functions as a tilting free layer because it provides special in-plane and perpendicular coupling. Such tilting free layer is a key since the perpendicular SOT-MRAM requires an external field and the present disclosure can solve this issue. In some embodiments, the first free layer11is in physical contact with the SOT layer10. The first free layer11is referred to as a magnetic bias layer in some examples. In some embodiments, the first free layer has a fixed orientation, polarity or magnetic anisotropy, e.g., in the up direction as shown by a unidirectional arrow, perpendicular to the substrate plane or the plane which the MTJ stack28sits on. In some embodiments, the first free layer11includes Co, CoNi, the like, or a combination thereof. Thin film magnetization generally lies in the plane of the film (in-plane magnetic anisotropy) in order to minimize the magnetostatic energy. However, a PMA axis is necessary for efficient spin torque switching. Multilayer systems such as Co/Ni, Co/Pd, and Co/Pt have strong PMA when they have sufficient face-centered cubic (FCC) (111) crystal orientation. In some embodiments, the first free layer11includes Co or a suitable ferromagnetic material, and is configured to form a perpendicular magnetic anisotropy (PMA) with Pt of the SOT layer10. In some embodiments, the first free layer11has a thickness of about 0.5 nm to 1.5 nm. The magnetization orientation of the second free layer13is switchable in the horizontal axis, as shown by a bi-directional arrow. The switchable magnetization orientation or magnetic anisotropy of the second free layer13represents two states thereof with respect to the magnetization orientation of the reference layer18, a parallel state “P” or an antiparallel state “AP”. In the “P” state, the magnetic anisotropy of the second free layer13is in the same direction as that of the reference layer18, here in the left direction. In the “AP” state, the magnetic anisotropy of the second free layer13is in a different direction from that of the reference layer18, here in the right direction. In some embodiments, the second free layer13includes one or more of Fe, Co, Ni, FeCo, CoNi, CoFeB, FeB, FePt, FePd and a suitable ferromagnetic material. In some embodiments, the second free layer13includes CoFeB and has a thickness of about 1 nm to 3 nm. In some embodiments, the thickness of the first free layer11is less than the thickness of the second free layer13. However, the disclosure is not limited thereto. In alternative embodiments, the thickness of the first free layer11is substantially equal to or greater than the thickness of the second free layer13. In some embodiments, the non-magnetic metal spacer12between the first free layer11and the second free layer13includes one of more of PtCo, WCoFeB, Ru, RuFe, RuCo, Ir, IrFe, IrCo and a suitable ferromagnetic material. In some embodiments, the non-magnetic metal spacer12includes PtCo and/or WCoFeB and has a thickness of about 1 nm or less, such as about 0.1 nm to about 1 nm. In some embodiments, the tunneling barrier layer16is disposed between the synthetic free layer14and the reference layer18. The tunneling barrier layer16barriers the tunneling of charge carriers between the reference layer18and the synthetic free layer14. In some embodiments, the tunneling barrier layer16includes an amorphous barrier, such as aluminum oxide (AlOx) or titanium oxide (TiOx), or a crystalline barrier, such as magnesium oxide (MgO) or a spinel (e.g., MgAl2O4). In some embodiments, the tunneling barrier layer16includes MgO and has a thickness of about 0.5 nm to 1.5 nm. In some embodiments, the MTJ stack28further includes a synthetic anti-ferromagnetic (SAF) layer24. The SAF layer24is configured to fix the orientation or magnetic anisotropy of the reference layer18. In some embodiments, the SAF layer24is optional and is not a part of the MTJ stack28. In some embodiments, the SAF layer24includes one or more non-magnetic metal layers each sandwiched between two pinned ferromagnetic layers. For example, the SAF layer24may include two pinned ferromagnetic layers and one non-magnetic metal layer between the two pinned ferromagnetic layers. For example, the SAF layer24may include non-magnetic metal layers and pinned ferromagnetic layers stacked alternately. The non-magnetic metal layer is referred to as a coupling layer in some examples. The pinned ferromagnetic layer is referred to as a pinned layer or a ferromagnetic layer in some examples. In some embodiments, the SAF layer24includes a first ferromagnetic layer21, a second ferromagnetic layer23and a coupling layer22between the first ferromagnetic layer21and the second ferromagnetic layer23. In some embodiments, the first ferromagnetic layer21has a third magnetic anisotropy, and the second ferromagnetic layer23has a fourth magnetic anisotropy antiparallel to the third magnetic anisotropy. In some embodiments, the first ferromagnetic layer21has a fixed orientation or polarity, e.g., in the left direction as shown by a unidirectional arrow, parallel to the substrate plane or the plane which the MTJ stack28sits on. In some embodiments, the first ferromagnetic layer21includes one or more of Fe, Co, Ni, FeCo, CoNi, CoFeB, FeB, FePt, FePd and a suitable ferromagnetic material. In some embodiments, the first ferromagnetic layer21includes Co and/or CoFeB and has a thickness of about 1 nm to 3 nm. In some embodiments, the second ferromagnetic layer23has a fixed orientation or polarity, e.g., in the right direction as shown by a unidirectional arrow, parallel to a substrate plane or a plane which the MTJ stack28sits on. In some embodiments, the second ferromagnetic layer23includes one or more of Fe, Co, Ni, FeCo, CoNi, CoFeB, FeB, FePt, FePd and a suitable ferromagnetic material. In some embodiments, the second ferromagnetic layer23includes Co and/or CoFeB and has a thickness of about 1 nm to 3 nm. In some embodiments, the coupling layer22includes one or more of W, Mo, Ru, Ir and a suitable material. In some embodiments, the coupling layer22includes Ru and/or Ir and has a thickness of about 1 nm or less. In some embodiments, the MTJ stack28further includes a spacer20between the reference layer18and the SAF layer24. In some embodiments, the spacer20is optional and is not a part of the MTJ stack28. In some embodiments, the spacer20includes one or more of W, Mo, Ru, Ir and a suitable material. In some embodiments, the spacer20includes W and/or Mo and has a thickness of about 1 nm or less. In some embodiments, the material of the coupling layer22is different from that of the spacer20. However, the disclosure is not limited thereto. In alternative embodiments, the material of the coupling layer22is the same as that of the spacer20. In some embodiments, the MTJ stack28further includes a capping structure26on the SAF layer24. In some embodiments, the capping structure26is configured to serve as a hard mask for protecting the structure from being damaged in the subsequently processes. In some embodiments, the capping structure26is configured to prevent boron atoms from diffusing to the top electrode. In some embodiments, the capping structure26is optional and is not a part of the MTJ stack28. In some embodiments, the capping structure26includes a first capping layer25and an overlaying second capping layer27. In some embodiments, the capping structure26includes one or more of Ta, Ru, TiN, TaN, W and a suitable material. In some embodiments, the first capping layer25includes Ru and has a thickness of about 1 nm to 3 nm. In some embodiments, the second capping layer27includes Ta and has a thickness of about 1 nm to 3 nm. The first capping layer25may serve as a hard mask, and the second capping layer27may serve as a diffusion barrier. Continue referring toFIG.1, a top electrode TE is formed on the MTJ stack28. In some embodiments, the top electrode TE includes Al, Cu, AlCu, Au, Ti, TiN, Ta, TaN, W, WN or a combination thereof, and is formed by a suitable technique such as sputtering, electroless plating, electro plating, PVD, CVD, ALD, the like, or a combination thereof. In some embodiments, the method of forming the SOI layer10, the MTJ stack28and the top electrode TE includes forming multiple films over the bottom electrodes BE and patterning the films. Each of the multiple films is formed by a suitable technique such as sputtering, electroless plating, electro plating, PVD, CVD, ALD or the like, and the patterning operation includes photolithography etching processes. Referring toFIG.1again, a fourth interlayer dielectric layer ILD4is formed over the third interlayer dielectric layer ILD3, and a fourth metal layer M4is formed on the fourth interlayer dielectric layer ILD4. In some embodiments, the fourth metal layer M4functions as a bit line BL. In some embodiments, the fourth metal layer M4is electrically coupled to the second metal layer M3(and therefore the source/drain regions106and206) through fourth via plugs V4. The materials and forming methods of the third interlayer dielectric layer ILD4, the fourth metal layer M4and the fourth via plugs V4are similar to those of the zeroth interlayer dielectric layer ILD0, the zeroth metal layer M0and the zeroth via plugs V01/V02described above, so the details are not iterated herein. The memory device1of the disclosure is thus completed. The memory device1of the disclosure is a two-transistor/one-resistor (2T1R) device. The structures of the memory device and memory stack of the disclosure will be described below with reference toFIG.1andFIG.2. In some embodiments, the memory device1includes a substrate100, a first transistor T1, a second transistor T2and a MARAM cell110. The first transistor T1is disposed over the substrate100and having a source/drain region (e.g., drain region)106. The second transistor T2is disposed over the substrate100and has a source/drain region (e.g., drain region)206. The MRAM cell110is disposed over the substrate100. The MRAM cell110includes bottom electrodes BE, a SOT layer10, a MTJ stack28and a top electrode TE. The MTJ stack28includes a synthetic free layer14, a tunneling barrier layer16and a reference layer18. The bottom electrodes BE are respectively coupled to the source/drain region106of the first transistor T1and the source/drain region206of the second transistor T2. The SOT layer10is disposed over the bottom electrodes BE. The synthetic free layer14is disposed over the SOT layer10and includes two layers configured to have magnetic anisotropies perpendicular to each other. In some embodiments, the synthetic free layer14includes a first free layer11with a perpendicular magnetic anisotropy and a second free layer13with a horizontal magnetic anisotropy. The first free layer11is in physical contact with the SOT layer10. The synthetic free layer14further includes a non-magnetic metal spacer12between the first free layer11and the second free layer13. The tunneling barrier layer16is disposed over the synthetic free layer14. The reference layer18is disposed over the tunneling barrier layer16. In some embodiments, the free layer18has a horizontal magnetic anisotropy. In some embodiments, the tunneling barrier layer16, the reference layer18and part of the synthetic free layer14(e.g., the second free layer14) are all oriented in the same direction, such as the (100) direction. In some embodiments, the memory stack MS1further includes a capping structure26over the reference layer18, and a SAF layer24between the capping structure26and the reference layer18. In some embodiments, the SAF layer24includes a first ferromagnetic layer21and a second ferromagnetic layer23, both of which have horizontal magnetic anisotropies antiparallel to each other. In some embodiments, when the SAF layer24is oriented in the (111) direction different from the (100) direction of the reference layer18, a spacer20is further included in the memory stack MS1. However, the disclosure is not limited thereto. In alternative embodiments, when the SAF layer24is oriented in the (100) direction the same as the (100) direction of the reference layer18, the spacer20can be omitted from the memory stack MS1. The tunneling barrier layer16is disposed over the synthetic free layer14. The reference layer18is disposed over the tunneling barrier layer16. The top electrode TE is disposed over the reference layer18and coupled to a bit line BL. In some embodiments, the first free layer11of the synthetic free layer14that is in physical contact with the SOT layer10forms a perpendicular magnetic anisotropy with the SOT layer10. The above embodiment, the memory device1further includes a dummy transistor DT between first transistor T1and the second transistor T2, and the dummy transistor DT is grounded. The above embodiments in which the MRAM cell110are provided between the third metal layer M3and the fourth metal layer M4are provided for illustration purposes, and are not construed as limiting the present disclosure. In alternative embodiments, upon the process requirements, the MRAM cell110may be provided between two adjacent metal layers, such as between the first metal layer M1and the second metal layer M2, between the second metal layer M2and the third metal layer M3or between the fourth metal layer M4and the fifth metal layer M5. The memory stack MS1in the memory device1may be modified to have other configurations, as shown inFIG.3toFIG.5. Specifically, one of the memory stacks MS2to MS4inFIG.3toFIG.5may replace the memory stack MS1in the memory device1. The memory stack MS2ofFIG.3is similar to the memory stack MS1ofFIG.2, and the difference between them lies in that, the magnetic anisotropies of the synthetic free layer14, the reference layer18and the SAF layer24are designed differently for memory stacks MS2and MS1. Specifically, in the memory stack MS2ofFIG.3, the synthetic free layer14includes a first free layer11with a horizontal magnetic anisotropy and a second free layer13with a perpendicular magnetic anisotropy. In some embodiments, the free layer18has a perpendicular magnetic anisotropy. In some embodiments, the SAF layer24includes a first ferromagnetic layer21and a second ferromagnetic layer23, both of which have perpendicular magnetic anisotropies antiparallel to each other. The memory stack MS3ofFIG.4is similar to the memory stack MS1ofFIG.2, and the difference between them lies in that, the SAF layer24and the underlying spacer20are provided for the memory stack MS1but are optionally omitted from the memory stack MS3. Specifically, in the memory stack MS3, the capping structure26is in physical contact with the reference layer18. The memory stack MS4ofFIG.5is similar to the memory stack MS2ofFIG.3, and the difference between them lies in that, the SAF layer24and the underlying spacer20are provided for the memory stack MS2but are optionally omitted from the memory stack MS4. Specifically, in the memory stack MS4, the capping structure26is in physical contact with the reference layer18. The major problem of the conventional SOT-MRAM resides in that an external magnetic field is required when writing the SOT memory cell thereof. As such, the process steps are complicated to provide the external magnetic field for the conventional SOT-MRAM. In the disclosure, the spin-torque from the magnetic bias layer (e.g., the first free layer11) breaks the symmetry of the charge carriers flowing through the SOT layer, so an external field is not required to change the magnetic anisotropy of the synthetic free layer. In other words, the memory device1of the disclosure is an external field-free SOT-MRAM, so the process steps are simplified and the switching efficiency is improved. In the above-mentioned embodiments, the magnetic bias layer (e.g., the first free layer11) and the switchable free layer (e.g., the second free layer13) are disposed at the same side of the SOT layer10, as shown inFIG.1toFIG.5. However, the disclosure is not limited thereto. In alternative embodiments, the magnetic bias layer (e.g., magnetic bias layer31) and the switchable free layer (e.g., free layer33) are disposed at opposite sides of the SOT layer30, as shown inFIG.6toFIG.8. FIG.6is a schematic cross-sectional view of a memory device in accordance with alternative embodiments.FIG.7is a schematic cross-sectional view of a memory stack in accordance with some embodiments.FIG.8is a schematic cross-sectional view of a memory stack in accordance with alternative embodiments. Referring toFIG.6andFIG.7, a memory device2includes a substrate100, a first transistor T1, a second transistor T2and a MRAM cell210. The memory device2ofFIG.6is similar to the memory device1ofFIG.1, and the difference between them lies in that, the MRAM cell210of memory device2ofFIG.6replaces the MRAM cell110of memory device1ofFIG.1. The MRAM cell210ofFIG.6is similar to the MRAM cell110ofFIG.1, and the difference between them lies in that, the memory stack MS5of the MRAM cell210ofFIG.6replaces the memory stack MS1of the MRAM cell110ofFIG.1. The memory stack MS5ofFIG.6is similar to the memory stack MS1ofFIG.1, and the difference between them lies in that, the memory stack48ofFIG.6are divided into two portions at opposite sides of the SOT layer30, while the MTJ stack28ofFIG.1is a bulk portion at the same side of the SOT layer10. Referring toFIG.6andFIG.7simultaneously, a memory stack MS5such as a MRAM stack is formed on the bottom electrodes BE of the third metal layer M3. Specifically, in addition to the bottom electrodes BE, the MRAM cell210includes a SOT layer10and a MTJ stack48. In some embodiments, the MTJ stack48includes a lower MTJ stack48adisposed below the SOT layer30and an upper MTJ stack48bdisposed above the SOT layer30. In some embodiments, the width of the lower MTJ stack48ais substantially equal to the width of the SOT layer30, while the width of the upper MTJ stack48bis less than the width of the SOT layer30. In some embodiments, the lower MTJ stack48aincludes a magnetic bias layer31. The magnetic bias layer31is in physical contact with the lower surface of the SOT layer30. The material and function of the magnetic bias layer31are similar to those of the first free layer11described above, so the details are not iterated herein. In some embodiments, the lower MTJ stack48afurther includes a buffer layer50between the magnetic bias layer31and the bottom electrodes BE. In some embodiments, the buffer layer50is configured to prevent boron atoms from diffusing to the bottom electrodes. In some embodiments, the buffer layer50includes one or more of Ta, Ru, TiN, TaN, W and a suitable material. In some embodiments, the buffer layer50includes Ta and has a thickness of about 1 nm to 3 nm. In some embodiments, the buffer layer50is optional and is not a part of the lower MTJ stack48a. In such case, the magnetic bias layer31is in physical contact with the bottom electrodes BE. In some embodiments, the upper MTJ stack48bincludes, from bottom to top, a free layer33, a tunneling barrier layer36and a reference layer38. The materials and functions of the free layer33, the tunneling barrier layer36and the reference layer38are similar to those of the second free layer13, the tunneling barrier layer16and the reference layer18described above, so the details are not iterated herein. In some embodiments, the upper MTJ stack48boptionally includes a SAF layer44. In some embodiments, the SAF layer44includes a first ferromagnetic layer41, a second ferromagnetic layer43and a coupling layer42between the first ferromagnetic layer41and the second ferromagnetic layer43. The materials and functions of the first ferromagnetic layer41, the coupling layer42and the second ferromagnetic layer43are similar to those of the first ferromagnetic layer21, the coupling layer22and the second ferromagnetic layer23described above, so the details are not iterated herein. In some embodiments, the upper MTJ stack48boptionally includes a spacer40between the reference layer38and the SAF layer44. The material and function of the spacer40are similar to those of the spacer20described above, so the details are not iterated herein. In some embodiments, when the SAF layer44is oriented in the (111) direction different from the (100) direction of the reference layer38, the spacer40is further included in the memory stack MS5. In alternative embodiments, when the SAF layer44is oriented in the (100) direction the same as the (100) direction of the reference layer38, the spacer40is omitted from the memory stack MS5. In some embodiments, the upper MTJ stack48boptionally includes a capping structure46over the reference layer38. In some embodiments, the capping structure46includes a first capping layer45and an overlaying second capping layer47. The materials and functions of the first capping layer45and the second capping layer47are similar to those of the first capping layer25and the second capping layer27described above, so the details are not iterated herein. The memory stack MS6ofFIG.8is similar to the memory stack MS5ofFIG.7, and the difference between them lies in that, the magnetic anisotropies of the magnetic bias layer31, the free layer33, the reference layer38and the SAF layer44are designed differently for memory stacks MS6and MS5. Specifically, the magnetic bias layer31has a horizontal magnetic anisotropy, and the switchable free layer33has a perpendicular magnetic anisotropy. In some embodiments, the SAF layer44includes a first ferromagnetic layer41and a second ferromagnetic layer43, both of which have perpendicular magnetic anisotropies antiparallel to each other. In accordance with some embodiments of the present disclosure, a memory stack includes a spin-orbit torque layer, a magnetic bias layer and a free layer. The magnetic bias layer is in physical contact with the spin-orbit torque layer and has a first magnetic anisotropy. The free layer is disposed adjacent to the spin-orbit torque layer and has a second magnetic anisotropy perpendicular to the first magnetic anisotropy. In accordance with alternative embodiments of the present disclosure, a memory stack includes a spin-orbit torque layer, a synthetic free layer, a tunneling barrier layer and a reference layer. The synthetic free layer is disposed over the spin-orbit torque layer, and includes a first free layer with a perpendicular magnetic anisotropy and a second free layer with a horizontal magnetic anisotropy. The tunneling barrier layer is disposed over the synthetic free layer. The reference layer is disposed over the tunneling barrier layer. In accordance with yet alternative embodiments of the present disclosure, a memory device includes a substrate, a first transistor, a second transistor and a MRAM cell. The first transistor is disposed over the substrate and has a first source/drain region. The second transistor is disposed over the substrate and has a second source/drain region. The MRAM cell is disposed over the substrate, and includes first and second bottom electrodes, a spin-orbit torque layer, a synthetic free layer, a tunneling barrier layer, a reference layer and a top electrode. The first and second bottom electrodes are respectively coupled to the first source/drain region and the second source/drain region. The spin-orbit torque layer is disposed over the first and second bottom electrodes. The synthetic free layer is disposed over the spin-orbit torque layer and includes two layers configured to have magnetic anisotropies perpendicular to each other. The tunneling barrier layer is disposed over the synthetic free layer. The reference layer is disposed over the tunneling barrier layer. The top electrode is disposed over the reference layer and coupled to a bit line. The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. | 41,475 |
11862374 | In the figures, identical and functionally identical elements are provided with the same reference symbols. DETAILED DESCRIPTION OF THE DRAWINGS FIG.2shows a high-voltage on-board power system7for a motor vehicle (not shown) which can be driven electrically. The high-voltage on-board power system7has two high-voltage components8,9which are electrically connected to one another. The high-voltage component8can be, for example, a traction battery of the motor vehicle which can be driven electrically, and the high-voltage component9can be, for example, an inverter of the motor vehicle. The high-voltage components8,9are electrically coupled to one another via a filter10which is configured at least to damp interference signals which are transmitted between the high-voltage components8,9. The filter10has at least one current-compensated inductor11. InFIG.3atoFIG.3c, cross-sectional illustrations of different embodiments of a current-compensated inductor11according to the invention are shown. The inductor11has a magnetic core12which is extruded in the axial direction (into the plane of the drawing). Busbars14which also extend in the axial direction are arranged within an inner opening13of the magnetic core12. A section of the busbars14is surrounded by the magnetic core12here along the axial direction. The magnetic core12is therefore plugged onto the busbars14. An inner side15, facing the inner opening13, of the magnetic core12and first areas16aof outer sides16of the busbars14which face the inner side15of the magnetic core12have shapes which correspond to one another. The inner side15of the magnetic core12can be formed, for example, from an electrically insulated material so that the first areas16aof the outer side16of the busbars14bear over an entire surface on the inner side15of the magnetic core12here. Second areas16bof the outer sides16of the busbars14face an airgap17or an electrically insulating area between the busbars14. The inner side15of the magnetic core12is shaped concavely, at least in certain areas, here, while the first areas16aof the busbars14are shaped concavely, at least in certain areas, so as to fit the latter. In the embodiment of the inductor11according toFIG.3a, the magnetic core12has a circular-ring-shaped cross section18, so that the inner opening13is embodied in a circular fashion. Furthermore, the inductor11according toFIG.3ahas three busbars14which have circular-sector-shaped cross sections19. The convexly shaped first areas16aof the outer side16and the concavely shaped inner side15of the magnetic core12have the same radius of curvature here, so that the first areas16aof the busbars can be positioned over an entire surface on the inner side15of the magnetic core12. The three circular-sector-shaped cross sections19of the busbars14have here, in particular, areas of equal size. The airgap17between the circular-sector-shaped cross sections19of the busbars14is embodied in a star shape here. Given the same inductivity, a quantity of material of such an inductor11according toFIG.3ais smaller, approximately by a factor of 2.5, than a quantity of material of the inductor1according toFIG.1bin which the busbars4have rectangular cross sections. A depth of the magnetic core2of the inductor1according toFIG.1bin the axial direction must therefore be larger approximately by a factor of 2.5 in order to set the same inductivity as the inductor11according toFIG.3a. In the embodiment of the inductor11according toFIG.3b, the magnetic core12has an oval-ring-shaped cross section20with two circular-arc sections21lying opposite one another and two straight element sections22lying opposite one another. As a result, the inner opening15is embodied in an oval fashion. The inductor11according toFIG.3balso has three busbars14, wherein two outer busbars14are arranged in the region of the circular arc sections21, and a central busbar14is arranged in the region of the straight element sections22. The two outer busbars14each have a circular-segment-shaped cross-sectional area23and a rectangular cross-sectional area24, wherein the convexly shaped form of the first area16aof the outer side16of the busbar14is formed by the circular-segment-shaped cross-sectional area23. The middle busbar14has a rectangular cross section25. The first area16aof the outer side16of the middle busbar14therefore has straight edges facing the straight element sections22. A volume of the inner opening13is utilized here to a significantly greater extent than the internal volume of the inner opening3of the inductor1according toFIG.1cin which the busbars4have rectangular cross sections. In the embodiment of the inductor11according toFIG.3c, the magnetic core12also has an oval-ring-shaped cross section20, but the straight element sections22are shorter than the straight element sections22of the inductor11according toFIG.3b. The inductor11according toFIG.3chas two busbars14which have circular-segment-shaped cross sections26in order to form the convex shape. The circular-segment-shaped cross sections26are arranged spaced apart from one another here in the region of the circular-arc sections21of the magnetic core12, forming a strip-shaped airgap17. LIST OF REFERENCE NUMBERS 1Inductor2Magnetic core3Inner opening4Busbars5Inner side6Outer side7High-voltage on-board power system8,9High-voltage components10Filter11Inductor12Magnetic core13Inner opening14Busbar15Inner side16Outer side16a,16bAreas of the outer side17Airgap18Circular-ring-shaped cross section19Circular-sector-shaped cross section20Oval-ring-shaped cross section21Circular-arc sections22Straight element sections23Circular-segment-shaped cross-sectional area24Rectangular cross-sectional area25Rectangular cross section26Circular-segment-shaped cross section | 5,777 |
11862375 | DESCRIPTION OF EMBODIMENTS FIG.1shows a bushing unit10mounted to a support structure12of a device14of a high voltage application. The bushing unit10comprises a bushing16with a rod-shaped conductor18surrounded by an insulator part20and a base22at one end portion24of the bushing10, which is the base of an accessory equipment module26of the bushing unit10. The device14might be a transformer tank of a transformer, supporting the bushing unit10by use of its support structure12. In many cases the bushing unit10is installed vertically. In the present case shown inFIG.1, the isolator unit10is mounted on the support structure12in vertical installation situation as well. The illustration here is only a little diagonal. The isolator unit10has a lower device side with an electrical contact28(at the end of said end area) e.g. inside the tank and a higher air side with another electrical contact30at the opposite side. The rod-shaped conductor18electrically connects these two contacts28,30. The exact design of the accessory equipment module26including the description of the individual components of this module26is discussed in connection withFIG.2, which shows the accessory equipment module26in detail. The accessory equipment module26comprises an accessory equipment assembly32with a plurality of accessory equipment units34,36and a support38for mounting the accessory equipment assembly26at the base22of the bushing16. All accessory equipment units34,36shown in the examples are current transformer units34,36. In the following, these current transformer units34,36should be representative of all possible accessory equipment units34,36that are positioned aligned in the area of bushings16, such as sensors, relays, etc. The support38comprises a frame40with external fastening structures42, which frame40holds the accessory equipment assembly32in its interior. The frame40consists of two ring structures44,46connected by cross members48. The external fastening structures42are formed in the ring-structures44,46. The support38comprises two groups of aligning means50,52for aligning each individual current transformer unit34,36separately with respect to the conductor18, namely a first group of aligning means50, which allows a movement of each current transformer unit34,36substantially parallel to a conductor axis54of the conductor18and an individual tilt of each current transformer unit34,36within the accessory equipment assembly26and a second group of these aligning means52, which allows a movement of the accessory equipment assembly32as a hole in two orthogonal directions in a plane perpendicular to the conductor18(arrow group56). Both groups of aligning means50,52allow the movement via adjustment slots58and counter elements60guided in these adjustment slots58. The counter elements60are threaded rods or similar rod elements. Fixing elements such as nuts matching the threaded rods are not shown. The aligning means50,52comprise a set of U-shaped elements62including the adjustment slots58. The U-shaped elements62are located between the ring structures44,46of the frame40and the current transformer units34,36or the accessory equipment assembly32respectively. The counter elements60corresponding to the first group of aligning means50are mounted on the side of the current transformer units34,36(which is at the base of the U-shaped elements62) and the counter elements60corresponding to the second group of aligning means52are mounted on the side of the frame40(which is at the arms of the U-shaped elements62). The counter elements60of the first group of aligning means50are arranged at angle elements64, which carry the current transformer units34,36. This type of modular support38allows easy interfacing and fixing of the CT units34,36to the base22of the bushing16and an equally easy adjustment of the position of the CT units34,36, using the dedicated adjustment slots58in the three directions: vertical, horizontal and oblique (CT: Current Transformer). This feature, of an easy adjustment of the CT units34.36, also allows the independent adjustment of each CT unit34,36, greatly facilitating the installation of these, when an installation of more than one CT units34,36on the same bushing16is utilized. In addition, since the support38is integrated with the bushing16is reduced, also the handling of the whole bushing16and CT module26assembly or disassembly is considerably facilitated, also for maintenance or replacement of one or more CT units34,36or the isolator itself. Now this adjustment can be done by placing the bushing16in a horizontal position: fixed the main support38to the base22of the bushing16and fixed by the CT units34,36on the modular support38, these will be easily adjustable through the adjustable slots58and counter elements50(pins/rods). Since the CT units34,36are fixed inside the main support38, there is no problem of accidental fall or displacement even when operating with the isolator unit10horizontally, and therefore facilitating and securing the operator assigned to the installation or maintenance of this part of the transformer. Finally,FIG.3shows the accessory equipment module26ofFIG.2mounted on the bushing16in a sectional view. The base of the bushing16comprises a bellow coupling66. Such bellows couplings66are used to ensure the encapsulation of a displaceable bushing16with the corresponding movement. InFIG.3for example, the frame40of the support38, the U-shaped elements62and the CT units34,36of the accessory equipment assembly32are clearly visible. In this context, the alignment functions of the support38with respect to the CT units34,36relative to the conductor18are also clearly visible. In case of request of bellows couplings66, this solution solve also the problem of the incidental contact between the CT units34,36and the bellows coupling66itself and adjacent parts of transformer tank (turrets, . . . ) In case it is necessary to apply such a bellows coupling66, the modular support38allows the fixing of the CT unit(s)34,36to the base22of the bushing16: in this way the movement of the bushing16brings with it integral way both the support38with the CT units34,36and the bellows, preventing the contact between CT units34,36and bellows of the bellow coupling66. While the disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the disclosure is not limited to the disclosed embodiments. Other variations to be disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed subject matter, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting scope. REFERENCE SIGNS LIST 10bushing unit12support structure14device16bushing18conductor20insulator part22base24end portion26accessory equipment module28contact, device-side30contact, air-side32accessory equipment assembly34current transformer unit, first36current transformer unit, second38support40frame42fastening structure44ring-structure46ring-structure48cross member50aligning means (first group)52aligning means (second group)54conductor axis56arrow group58adjustment slot60counter element62U-shaped element64angle element66bellow coupling | 7,694 |
11862376 | DETAILED DESCRIPTION An inductor component1according to a first embodiment of the present disclosure will be described with reference toFIGS.1to4. As illustrated inFIG.1, the inductor component1includes a core3having a winding core portion2that extends in an axial direction AX of the core3. The core3is shaped like a drum and includes a first flange4formed at a first end of the winding core portion2in the axial direction AX and a second flange5formed at a second end of the winding core portion2that is opposite to the first end. When necessary, the inductor component1may also include a top plate7that is fixed to the core3by an adhesive6so as to span the first flange4and the second flange5. The core3and the top plate7are sintered ceramic bodies made, for example, of ferrite or alumina. In the case of both of the core3and the top plate7being made of a magnetic substance, the core3and the top plate7form a closed magnetic circuit. As illustrated inFIG.3, the winding core portion2of the core3has a cross section shaped substantially like a quadrangle. The cross section of the winding core portion2or the quadrangle has four sides S1to S4, and interior angles between adjacent ones of the four sides are 90 degrees. The winding core portion2has four corner portions C1to C4each having an interior angle of 90 degrees on the quadrangular cross section. In each of the four corner portions C1to C4, of which the corner portion C1is illustrated inFIG.4, a first round surface R1and a second round surface R2are formed and arranged adjacent to each other in the circumferential direction of the winding core portion2. The first round surface R1and the second round surface R2are convexly formed so as to protrude outward. As illustrated inFIG.3, of the four corner portions C1to C4, the first corner portion C1is positioned diagonally opposite to the third corner portion C3, and the second corner portion C2is positioned diagonally opposite to the fourth corner portion C4. The first round surfaces R1and the second round surfaces R2are arranged circumferentially around the winding core portion2in the following order: the first round surface R1of the first corner portion C1, the second round surface R2of the first corner portion C1, the second round surface R2of the second corner portion C2, the first round surface R1of the second corner portion C2, the first round surface R1of the third corner portion C3, the second round surface R2of the third corner portion C3, the second round surface R2of the fourth corner portion C4, and the first round surface R1of the fourth corner portion C4. Note that dimensions inFIG.4are in millimeters. In the cross-sectional shape of the winding core portion2, the corner portions C1to C4have an interior angle of 90 degrees or more and less than 120 degrees (i.e., from 90 degrees to 120 degrees). At at least one of the corner portions C1to C4, the first round surface R1and the second round surface R2are formed adjacent to each other in the circumferential direction of the winding core portion2. As a result, the first round surface R1and the second round surface R2can virtually provide a large round surface having a large curvature due to the side by side arrangement of the round surfaces. Accordingly, when a wire40is wound around the winding core portion2, which will be described later, the wire40is bent readily so as to follow the corner portions C1to C4but does not readily rise from other surface portions of the winding core portion2even if the wire40is relatively thick, for example, having a diameter of 100 μm or more. At the corner portions C1to C4of the winding core portion2, at which the first round surface R1and the second round surface R2are formed, the wire40can be reliably brought into contact with the winding core portion2at at least two positions, in other words, at the first round surface R1and the second round surface R2. This can increase friction between the wire40and the winding core portion2, which can stabilize the winding pattern and the position of the wire40wound around the winding core portion2. The core3having the winding core portion2configured as above is preferably manufactured in the following manner. A ceramic powder, which is the material for the core3, is first prepared. The ceramic powder is processed to provide a compact in a forming step. The compact will be formed into the core3finally.FIG.5illustrates a major part of a molding apparatus11for carrying out the forming step, in other words, a part of the apparatus for forming the winding core portion2.FIG.5is a cross section taken along line A-A inFIG.2.FIG.6is an enlarged cross-sectional view illustrating section F inFIG.5. As illustrated inFIGS.5and6, the molding apparatus11includes a die14that defines a cavity13into which the ceramic powder14is charged. In the cavity13of the die14, an upper punch15and a lower punch16are disposed so as to oppose each other and are guided so as to move closer to or away from each other. The upper punch15and the lower punch16move closer to each other with the ceramic powder12interposed therebetween, thereby applying pressure to the ceramic powder12to form a compact17from which the core3is produced. The compact17has a first shoulder31to be formed into the second round surface R2at a position outside the first round surface R1in the first corner portion C1. The compact17also has a second shoulder32to be formed into the second round surface R2at a position outside the first round surface R1in the second corner portion C2, a third shoulder33to be formed into the second round surface R2at a position outside the first round surface R1in the third corner portion C3, and a fourth shoulder34to be formed into the second round surface R2at a position outside the first round surface R1in the fourth corner portion C4. The die14has a first molding face19and a second molding face20inside the cavity13. The first molding face19serves to form a first side surface P1having a first side S1that extends between the first corner portion C1and the second corner portion C2of the winding core portion2on the cross section thereof (seeFIG.3). The second molding face20serves to form a second side surface P2having a third side S3that extends between the third corner portion C3and the fourth corner portion C4of the winding core portion2on the cross section thereof (seeFIGS.2and3). The upper punch15has a third molding face21that serves to form an upper surface P3having a fourth side S4that extends between the first corner portion C1and the fourth corner portion C4of the winding core portion2on the cross section thereof (seeFIGS.2and3). The third molding face21has a first concave face23and a fourth concave face26. The first concave face23serves to form the first round surface R1at a position inside the first shoulder31in the first corner portion C1of the winding core portion2. The fourth concave face26serves to form the first round surface R1at a position inside the fourth shoulder34in the fourth corner portion C4of the winding core portion2. In the present embodiment, the third molding face21also has a first flat face27at a position outside the first concave face23and a fourth flat face30at a position outside the fourth concave face26. The first flat face27serves to form the first shoulder31at a position outside the first round surface R1in the first corner portion C1. The fourth flat face30serves to form the fourth shoulder34at a position outside the first round surface R1in the fourth corner portion C4. The lower punch16has a fourth molding face22that serves to form a lower surface P4having a second side S2that extends between the second corner portion C2and the third corner portion C3of the winding core portion2on the cross section thereof (seeFIGS.2and3). The fourth molding face22has a second concave face24and a third concave face25. The second concave face24serves to form the first round surface R1at a position inside the second shoulder32in the second corner portion C2of the winding core portion2. The third concave face25serves to form the first round surface R1at a position inside the third shoulder33in the third corner portion C3of the winding core portion2. In the present embodiment, the fourth molding face22also has a second flat face28at a position outside the second concave face24and a third flat face29at a position outside the third concave face25. The second flat face28serves to form the second shoulder32at a position outside the first round surface R1in the second corner portion C2. The third flat face29serves to form the third shoulder33at a position outside the first round surface R1in the third corner portion C3. The forming step is carried out by using the above-configured die14, upper punch15, and lower punch16, which produces the compact17in which the first round surfaces R1are formed in respective corner portions of the winding core portion2, in other words, the first corner portion C1, the second corner portion C2, the third corner portion C3, and the fourth corner portion C4.FIG.5illustrates a cross section of the winding core portion2of the compact17configured as above.FIG.6provides an enlarged view illustrating a portion of the compact17. Next, the compact17is fired to sinter the ceramic powder12.FIG.7Ais an enlarged view illustrating a portion of the compact17that has been fired, which corresponds to section F inFIG.5. As illustrated inFIG.7A, the first shoulder31is positioned next to the first round surface R1in the first corner portion C1of the winding core portion2. The first shoulder31is a portion to be formed into the second round surface R2. The compact17that has been fired is subjected to barrel finishing. As a result, as illustrated inFIG.7B, the first shoulder31in the first corner portion C1is polished into the second round surface R2. Similarly, in the step of barrel finishing, the second shoulder32of the second corner portion C2, the third shoulder33of the third corner portion C3, and the fourth shoulder34of the fourth corner portion C4are polished into the second round surfaces R2. The compact17obtained in the above forming step may have fins38(an example of a fin is indicated by the dotted line inFIG.7A). The fins38are formed due to extra ceramic powder being extruded into gaps37between the die14and the upper and lower punches15and16(seeFIG.6). The fins38may protrude from at least one of edges of the first shoulder31, the second shoulder32, the third shoulder33, and the fourth shoulder34. In this case, the step of barrel finishing can also serve as a step of removing the fins38. The core3is obtained after barrel finishing. After the step of barrel finishing, a third round surface R3may often formed. As illustrated inFIG.7C, the third round surface R3is a concave surface formed between the first round surface R1and the second round surface R2as viewed from outside. The third round surface R3typically has a curvature of 0.04 mm or more. Note that the third round surface R3can be obtained also by way of design changes of the punches15and16used in the forming step. The above description has been directed mainly to the first corner portion C1of the winding core portion2, in other words, the portion corresponding to section F inFIG.5in the compact17that has been fired. The second to fourth corner portions C2to C4of the winding core portion2are also subjected to the same processing as described with the first corner portion C1, and the detailed description will be omitted here. In the embodiment described above, the barrel finishing is adopted in the polishing step. However, other polishing techniques, such as sand blasting or laser polishing, may be adopted. Referring back toFIG.1, the wire40is wound around the winding core portion2. A manner of winding the wire40will be described later. The first flange4and the second flange5have respective bottom surfaces8and9that face a mounting substrate (not illustrated). A first terminal electrode41is formed on the bottom surface8, and a second terminal electrode42is formed on the bottom surface9. The terminal electrodes41and42are formed, for example, by baking an electroconductive paste, plating a conductive metal, or adhering a conductive metal piece. More specifically, a first end of the wire40is connected to the first terminal electrode41, and a second end of the wire40, which is an end opposite to the first end, is connected to the second terminal electrode42(these ends are not illustrated). For example, thermocompression bonding or welding can be used for the connection. For example, the wire40is made of copper. The wire includes a central conductor having a circular cross section and an insulator coating that covers the central conductor. In the present description, the diameter of the wire refers to the diameter of the central conductor excluding the insulator coating. FIG.1illustrates cross sections of turns of the wire40. Turn numbers 1 to 20 appear on respective cross sections, which are the ordinary numbers designated to the turns from the first flange4. The wire40, which is wound around the winding core portion2, has four aligned winding portions B1to B4each of which constitutes a bank winding portion (hereinafter referred to as “aligned bank winding portions B1to B4”). The first aligned bank winding portion B1is formed of the first to fifth turns of the wire40(hereinafter expressed as “the turn 1 to the turn 5”). In other words, the turns 1 to 3 of the wire40are positioned in a lower layer and wound helically around the winding core portion2. The wire40is subsequently returned by approximately 1.5 turns and further wound around the winding core portion2in such a manner that the turn 4, which is a turn in an upper layer, fits in a recess formed by and between the turn 1 and the turn 2 of the lower layer, and the turn 5, which is another turn in the upper layer, fits in a recess formed by and between the turn 2 and the turn 3 with the exception of a returned wire portion R. In the first aligned bank winding portion B1, the wire40goes up from the lower layer to the upper layer at a portion of the wire40between the turn 3 and the turn 4 where the wire40wound around the winding core portion2is returned in a direction opposite to the proceeding direction of the winding. Accordingly, this portion of the wire40is referred to as the “returned wire portion R”. The helical winding of the wire40is somewhat disturbed at the returned wire portion R. In the present embodiment, the returned wire portion R occurs at a predetermined position on the circumference of the winding core portion2, for example, at a position on the first side surface P1having the side S1on the cross section of the winding core portion2(seeFIG.3). In other words, the returned wire portion R starts at the first corner portion C1and ends at the second corner portion C2. A second aligned bank winding portion B2is formed of the turn 6 to the turn 10 of the wire40. After the wire40forms the turn 5, which is the last turn in the upper layer in the first aligned bank winding portion B1, the wire40goes down to the next lower layer and is wound around the winding core portion2to form the turn 6 to the turn 8. The wire40is subsequently returned by approximately 1.5 turns and is further wound around the winding core portion2in such a manner that the turns 9 and 10 in the upper layer fit in recesses formed by and between adjacent ones of the turns 6 to 8 in the lower layer with the exception of a returned wire portion. Here, the returned wire portion also occurs at a position on the first side surface P1having the side S1on the cross section of the winding core portion2(seeFIG.3). The third aligned bank winding portion B3and the fourth aligned bank winding portion B4are formed similarly to the first aligned bank winding portion B1and the second aligned bank winding portion B2, and the detailed description is omitted here. Regarding the wire40wound around the winding core portion2, especially regarding the wire40in the lower layer, the present inventors have obtained the following knowledge through experiments and experiences. As the wire becomes thick, the rigidity of the wire increases, which makes it more difficult to bend the wire. This leads to difficulty in winding the wire without the wire rising from the circumferential surface of the winding core portion. However, there must exist an appropriate relation between the diameter of the wire and the curvature of corner portions of the winding core portion, with which the wire can be wound around the winding core portion without rising from the circumferential surface. The study based on this assumption has revealed that when the corner portions of the winding core portion have round surfaces with a curvature of 0.75 times or more of the wire diameter, the wire can be wound around the winding core portion without rising from the circumferential surface. If the curvatures of the corner portions are too large, the cross-sectional shape of the winding core portion becomes more like a circle or an ellipse. In this case, the problem occurs in the bank winding in the aligned manner as described previously. The wire can be wound around stably in the lower layer, but it becomes difficult to stably position the starting point of the returned wire portion R on the circumference of the winding core portion. The starting point of the returned wire portion R is the position at which the wire is returned in the direction opposite to the proceeding direction of the winding so that the wire can go up from the lower layer to the upper layer. Thus, the preferable curvature of the corner portions has an upper limit, which is found to be twice as great as the diameter of the wire. In summary, when the relation between the diameter D of the wire and the curvature r of each corner portion of the winding core portion satisfies 0.75D≤r≤2D, the wire can be wound around the winding core portion without rising from the circumferential surface thereof, in other words, with the wire being in contact with the circumferential surface. At the same time, this enables the returned wire portion R of the aligned bank winding to stay stably at the predetermined position on the circumferential surface of the winding core portion. In the present embodiment, each of the corner portions C1to C4of the winding core portion2forms circumferentially arranged two round surfaces, in other words, the first round surface R1and the second round surface R2, instead of forming one simple round surface. In this case, a virtual curvature of each of the corner portions C1to C4of the winding core portion2is obtained in the following manner.FIG.8Aillustrates a quarter circle having a radius of r. The area of the quarter circle is obtained from π·r2/4.FIG.8Billustrates a quarter ellipse that encompasses the first round surface R1and the second round surface R2, in which W denotes a half of the major axis and T denotes a half of the minor axis. The area of the quarter ellipse is obtained from π·W·T/4. When the area of the quarter circle is equal to the area of the ellipse, in other words, π·r2/4=π·W·T/4, r is regarded as the virtual curvature of each of the corner portions C1to C4of the winding core portion2. From this equation, r2=W·T is obtained. Accordingly, the virtual curvature r of each of the corner portions C1to C4of the winding core portion2can be obtained from r=(W·T)0.5. Even if the wire is relatively thick, for example, having a diameter of 100 μm or more, the wire can be wound without rising from the circumferential surface of the winding core portion if the virtual curvature (W·T)0.5is set to be at least 0.75 times greater than the diameter of the wire. In other words, when the diameter of the wire is denoted by D, the virtual curvature (W·T)0.5at least satisfies 0.75D≤(W·T)0.5. At the same time, when the wire is wound into the aligned bank winding portion, it is necessary to stabilize the starting point of the wire at which the wire is returned in the direction opposite to the proceeding direction of the winding in order to go up from the lower layer to the upper layer. In order to enable the starting point of the wire to stay at a predetermined position on the circumference of the winding core portion, the virtual curvature (W·T)0.5is set to be twice or less of the diameter of the wire. In other words, when the diameter of the wire is denoted by D, the virtual curvature (W·T)0.5satisfies (W·T)0.5≤2D. Taken the above together, the relation between the wire diameter D and the virtual curvature r=(W·T)0.5of each corner portion of the winding core portion at least satisfies 0.75D≤(W·T)0.52D. Under this condition, the lower-layer turns of the wire40cannot slip easily in the axial direction of the winding core portion2when the wire40is wound into the bank winding. In addition, the starting point of the wire40, at which the wire40is returned in the direction opposite to the proceeding direction of helical winding of the wire so that the wire40can go up from the lower layer to the upper layer, can be easily stabilized at the predetermined position on the circumference of the winding core portion2. Thus, stable bank winding can be carried out. InFIG.8B, reference sign W denotes the distance from a virtual point of intersection V of virtual extensions of adjacent sides (e.g., the fourth side S4and first side S1) to one of the adjacent sides (e.g., the fourth side S4), and reference sign T denotes the distance from the virtual point of intersection V to the other one of the adjacent sides (e.g., the first side S1). Note that although the relation between W and T is W>T in the present embodiment as illustrated inFIG.8B, the relation between W and T may be W<T or W=T. In the present embodiment, as illustrated inFIG.4, a curvature r1of the first round surface R1is greater than a curvature r2of the second round surface R2. However, the size relation between the curvature r1and the curvature r2may be opposite, or the curvature r1may be equal to the curvature r2. The above-described distances W and T and curvatures r1and r2can be adjusted appropriately by changing the design of the punches15and16used in the forming step or by changing the extent of polishing in the polishing step. The following describes the second to the fifth embodiments of the present disclosure with reference toFIGS.9A to9CtoFIGS.12A to12C, respectively. These figures correspond toFIGS.7A to7C. InFIGS.9A to9CtoFIGS.12A to12C, the elements corresponding to those illustrated inFIGS.7A to7Care denoted by the same reference signs, thereby omitting duplicated description. Note that the following description focuses on the first corner portion C1of the winding core portion2and omits description of the second to fourth corner portions C2to C4of the winding core portion2since they have the same configuration as that of the first corner portion C1. The embodiment illustrated inFIGS.9A to9Cis different from that illustrated inFIGS.7A to7C. In the embodiment illustrated inFIGS.7A to7C, a relatively wide flat portion remains on the upper surface of the shoulder31after polishing, which is shown especially inFIG.7B. In the embodiment illustrated inFIGS.9A to9C, however, there remains almost no flat portion on the upper surface of the shoulder31after polishing, which is shown especially inFIG.9B. Note that it is difficult to specify an upper limit of size of the flat surface remaining on each upper surface of the shoulders31to34between respective first and second round surfaces R1and R2since the border of the flat surface is not necessarily distinctive. Tentatively, however, the upper limit of size of the flat surface may be set to be equal to the virtual curvature (W·T)0.5of the corner portions C1to C4or to be equal to the curvature of the first round surface R1. In the embodiment illustrated inFIGS.10A to10C, a slope45is formed in the forming step so as to extend from the first round surface R1to the shoulder31, which is shown especially inFIGS.10A and10B. In addition, as illustrated inFIG.10B, a relatively wide flat portion remains on the upper surface of the shoulder31after polishing. In the embodiment illustrated inFIGS.11A to11C, a slope46is formed in the forming step so as to extend from the first round surface R1to the shoulder31, which is shown especially inFIGS.11A and11B. In addition, as illustrated especially inFIG.11B, there remains almost no flat portion on the upper surface of the shoulder31after polishing. In the embodiment illustrated inFIGS.12A to12C, as are the cases illustrated inFIGS.10A to10Cand inFIGS.11A to11C, a slope47is formed so as to extend from the first round surface R1to the shoulder31, which is shown especially inFIGS.12A and12B. In this embodiment, however, the slope47is integrated into the first round surface R1. The second to fifth embodiments described above can be implemented by changing the design of the punches15and16used in the forming step. The embodiments of the present disclosure have been described with reference to the drawings. The embodiments illustrated are examples and are changeable in various ways. For example, in the case of the winding core portion having the quadrangular cross section, the first round surface and the second round surface, which are a characteristic part of the disclosure, may be formed only in a single corner portion instead of being formed in all of the four corner portions. This configuration can also provide the advantageous effect that the wire can be wound around stably. Accordingly, it is sufficient that the first round surface and the second round surface are formed at at least one corner portion. Moreover, round surfaces having different curvatures, instead of the round surfaces having the same curvature, may be formed at different corner portions. In the embodiments illustrated, the winding core portion having a quadrangular cross section has been described, by way of example, as having an interior angle of 90 degrees between adjacent ones of four sides on the cross section. However, the present disclosure can be applied to a winding core portion of a core having a polygonal cross section with four corners or more at which the interior angles are 90 degrees or more and less than 120 degrees (i.e., from 90 degrees to 120 degrees). A regular hexagon has the corners with an interior angle of 120 degrees. The present disclosure can be applied advantageously to a winding core portion having corner portions of which the interior angle is smaller than that of the regular hexagon. In the embodiments illustrated, the wire40is wound in the aligned bank winding. However, the present disclosure can be applied also to an inductor component in which a wire is wound into a single layer. Moreover, in the embodiments illustrated, the inductor component1includes two terminal electrodes41and42. However, the present disclosure can be also applied to an inductor component having four or more terminal electrodes. Configurations can be substituted or combined partially with each other between the different embodiments described above. While preferred embodiments of the disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the disclosure, therefore, is to be determined solely by the following claims. | 27,571 |
11862377 | DESCRIPTION OF EMBODIMENTS The following clearly describes the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. In the descriptions of this application, “/” means “or” unless otherwise specified. For example, A/B may represent A or B. In this specification, “and/or” describes only an association relationship for describing associated objects and represents that three relationships may exist. For example, A and/or B may represent the following three cases: Only A exists, both A and B exist, and only B exists. In addition, in the descriptions of this application, “a plurality of” means two or more unless otherwise specified. A left side, a right side, an upper side, a lower side, a clockwise direction, a counterclockwise direction, being perpendicular to paper inward, being perpendicular to paper outward, and the like in this application are all described by using examples in the accompanying drawings as examples. In some cases, for example, when an accompanying drawing is rotated by 180 degrees for viewing, the left side may be switched to the right side; or when an accompanying drawing provided in the embodiments of this application is viewed in an opposite direction, the clockwise direction may be switched to the counterclockwise direction. Therefore, the foregoing directional descriptions are defined with reference to the accompanying drawings in the embodiments of this application for a person skilled in the art to clearly understand the solutions, and the foregoing directional descriptions do not constitute any limitation on the embodiments of this application. Currently, with development of communications devices, a more advanced communications device has a smaller size accompanied with capacity expansion, and there is an increasing strong requirement for increasing a power density of a power supply unit (referred to as a power supply) that supplies power to the communications device. With continuous capacity expansion of the communications device, the communications device is continuously reduced in size per unit capacity. However, the power supply unit on a board of the communications device has smaller available space. Therefore, it is increasingly important to increase the power density of the power supply unit. Currently, the power density of the power supply unit increases from hundreds of watts/inch{circumflex over ( )}3 to thousands of watts/inch{circumflex over ( )}3. As shown inFIG.1, a power supply unit mainly includes a primary-side switch circuit, a secondary-side rectifier circuit with an auxiliary heat dissipation component (not shown inFIG.1), a power magnetic element, a control and detection component, and an input filtering and protection component. The input filtering and protection component is a passive component. The input filtering and protection component is mostly in a standard configuration, and therefore it is less probably to reduce a volume and it is costly. The control and detection component is a resistance-capacitance component, and is not a bottleneck for increasing a power density. Sizes and heat dissipation capabilities of the primary-side switch circuit and the secondary-side rectifier circuit depend on development of basic semiconductor technologies and material technologies, and depend on whether to match a pace of an evolution of a product power density. The power magnetic element accounts for approximately 30% of a total volume of the entire power supply unit. That the power magnetic element is designed to reduce an overall volume of the power magnetic element and increase the power density of the power supply unit is a main direction for breakthrough currently. A power magnetic element is usually referred to as a transformer. To reduce the volume of the power magnetic element, a switching frequency continuously increases from tens of kHz to hundreds of kHz and then to MHz. As the frequency increases, a winding loss percentage has exceeded 50%. How to reduce a winding loss becomes a difficult problem. Reducing a quantity of turns of a secondary-side winding (or referred to as a secondary-side winding) is an effective way to reduce the winding loss. However, when the quantity of the turns is reduced to 1, it is difficult to further reduce the quantity of the turns from a perspective of a turn ratio design. Due to impact of a skin effect and a proximity effect of a conductor as the frequency is high, it is ineffective to increase an area of the conductor, and it is costly. Therefore, how to make a breakthrough in reducing a quantity of turns to less than 1 has become a research direction in the industry. In recent years, a fractional turn mechanism has been described in detail in related documentation published by many research institutions and scholars. Broadly speaking, the fractional turn is a relative concept to an integral turn. However, a prior-art fractional turn has low engineering feasibility, and is costly in implementation, resulting in restrictions in commercial application. The integral turn means that a quantity of turns of a secondary-side winding is positive integer, and the fractional turn means that a quantity of turns of a secondary-side winding is a positive fraction. In this application, as it is reached how to make a breakthrough in reducing the quantity of turns of a secondary-side winding to less than 1 winding, in the following solution, a fractional turn means that the quantity of the turns of the secondary-side winding is less than 1, that is, the quantity of the turns of the secondary-side winding is greater than 0 and less than 1. In addition, in the embodiments of this application, a primary-side winding is a winding that generates a magnetic flux in a magnetic core after the winding being powered on, and the secondary-side winding is a winding that generates an induced current by inducting the magnetic flux in the magnetic core. In some embodiments, a primary side may also be a primary side, and a secondary side may also be a secondary side. Although the solution to reducing a winding loss by using a fractional turn has been proposed in the industry, in a currently provided solution, a magnetic cylinder distribution structure of a magnetic core is unreasonable, still causing problems. For example, in a solution, with reference to a view of a transformer in a top view of a central magnetic cylinder provided inFIG.2and a side view of a magnetic core of the transformer provided inFIG.3. A primary-side winding La and secondary-side windings Lb1to Lb4are wound around the central magnetic cylinder. As shown inFIG.3, two ends of a magnetic cylinder1and two ends of the central magnetic cylinder are coupled by using a first magnetic cover on an upper side and a second magnetic cover on a lower side, to form a magnetic flux loop on a left side; and two ends of a magnetic cylinder2and the two ends of the central magnetic cylinder are coupled by using the first magnetic cover on the upper side and the second magnetic cover on the lower side, to form a magnetic flux loop on the right side. The primary-side winding La and a primary-side switch circuit that is connected to the primary-side winding La form a power loop at a primary side. Secondary-side switches (for example, switching transistors) Q1and Q3, the secondary-side winding Lb1connected to Q1, the secondary-side winding Lb3connected to Q3, and capacitor groups C1and C2(the capacitor group may include a series-parallel connection structure of one or more capacitors) form a half-cycle power loop at a first secondary side. Secondary-side switches (for example, switching transistors) Q2and Q4, the secondary-side winding Lb2connected to Q2, the secondary-side winding Lb4connected to Q4, and the capacitor groups C1and C2form a half-cycle power loop at a second secondary side. When the primary-side switch circuit outputs an alternating current to the primary-side winding, the primary-side switch circuit inputs a current of a first direction (for example, a current direction on La is from a to b) to the primary-side winding La within one half cycle, so that a magnetic flux perpendicular to paper inward is generated in the central magnetic cylinder. In this half cycle, Q1and Q3are turned on, so that the half-cycle power loop at the first secondary-side is in a working state. The primary-side switch circuit inputs a current of a second direction to the primary-side winding La (for example, a current direction on La is from b to a) within the other half cycle, so that a magnetic flux perpendicular to paper outward is generated in the central magnetic cylinder. In this half cycle, Q2and Q4are turned on, so that the half-cycle power loop at the second secondary side is in a working state. In this way, the two power loops at the secondary side (the half-cycle power loop at the first secondary side and the half-cycle power loop at the second secondary side) work alternately with a current of the power loop at the primary side. The secondary-side winding and the primary-side winding are wound around the central magnetic cylinder. A winding width is restricted by a magnetic core window (referring toFIG.3, the magnetic core window refers to space inside an annulus constituted by coupling the central magnetic cylinder to the magnetic cylinder1,FIG.3only schematically marks the magnetic core window on the left side, and space inside an annulus constituted by coupling the central magnetic cylinder to the magnetic cylinder2is also referred to as the magnetic core window), and therefore utilization of the magnetic core window is low. The primary-side winding and the secondary-side winding crossly lead out. Affected by a layout of the magnetic cylinder1on the left side, a terminal (for example, referring toFIG.2, wiring from node a on La to the primary-side switch circuit and wiring from node b on La to the primary-side switch circuit) of the primary-side winding is long, and consequently a high-frequency effect of the terminal is great and losses are large. In addition, a safety spacing is difficult to set in a scenario in which safety isolation and insulation is required. When power needs to be increased, only a quantity of winding turns can be increased, resulting in an increase in a height of a power magnetic element. This is unfavorable to a flat design of the power magnetic element. In addition, if a printed circuit board (printed circuit board, PCB) is used as a winding, costs are increased. In another solution, with reference to a view of a transformer in a top view of a central magnetic cylinder provided inFIG.4, a primary-side winding La is wound around the central magnetic cylinder, a secondary-side winding Lb1and a secondary-side winding Lb2are wound around a magnetic cylinder1, and a secondary-side winding Lb3and a secondary-side winding Lb4are wound around a magnetic cylinder2. A side view of a magnetic core of the transformer is the same as the magnetic core inFIG.3. That is, in this solution, two ends of the magnetic cylinder1and two ends of the central magnetic cylinder are coupled by using a first magnetic cover on an upper side and a second magnetic cover on a lower side, to form a magnetic flux loop on a left side; and two ends of the magnetic cylinder2and the two ends of the central magnetic cylinder are coupled by using the first magnetic cover on the upper side and the second magnetic cover on the lower side, to form a magnetic flux loop on the right side, where the central magnetic cylinder is separately coupled with the magnetic cylinder1and the magnetic cylinder2. A magnetic flux generated by the secondary-side winding being coupled to a ½ primary-side winding implements an effect of a ½ turn of the secondary-side winding by means of voltage magnetic division. The primary-side winding La and a primary-side switch circuit form a power loop at a primary side. A power loop constituted by a secondary-side switch (for example, a switching transistor) Q1, the secondary-side winding Lb1connected to Q1, and C2, and a power loop constituted by Q3, the secondary-side winding Lb3connected to Q3, and C4form a half-cycle power loop at a first secondary side. A power loop constituted by a secondary-side switch (for example, a switching transistor) Q2, the secondary-side winding Lb2connected to Q2, and C1, and a power loop constituted by Q4, the secondary-side winding Lb4connected to Q4, and C3form a half-cycle power loop at a second secondary side. The primary-side switch circuit inputs a current of a first direction (for example, a current direction on La is from a to b) to the primary-side winding La within one half cycle, so that a magnetic flux perpendicular to paper inward is generated in the central magnetic cylinder. In this half cycle, Q1and Q3are turned on, so that the half-cycle power loop at the first secondary side is in a working state. The primary-side switch circuit inputs a current of a second direction (for example, a current direction on La is from b to a) to the primary-side winding La within the other half cycle, so that a magnetic flux (a magnetic flux) perpendicular to paper outward is generated in the central magnetic cylinder. In this half cycle, Q2and Q4are turned on, so that the half-cycle power loop at the second secondary side is in a working state. The two power loops at the secondary side (the half-cycle power loop at the first secondary side and the half-cycle power loop at the second secondary side) work alternately with a current of the power loop at the primary side. However, the primary-side winding and the secondary-side winding are wound on different magnetic cylinders, resulting in poor coupling and large leakage inductance. The primary-side winding and a secondary-side winding are not fully overlapped, and consequently a winding equivalent alternating current resistance (ACR) and a winding loss are large. Fluxes of the magnetic cylinders on both sides are unbalanced in consideration of the voltage magnetic division. With reference to the foregoing problem, an embodiment of this application provides a transformer, so as to reduce the winding loss by using a fractional turn, and to provide a structure that is more convenient to implement, thereby reducing product costs. Specifically,FIG.5provides a view of a transformer in a top view of a magnetic core, andFIG.6provides a structural side view of a magnetic core of the transformer. The transformer includes a magnetic core, a primary-side winding La, and secondary-side windings Lb1to Lb8. The magnetic core includes a first magnetic cylinder41and a second magnetic cylinder42. One end of the first magnetic cylinder41is coupled to one end of the second magnetic cylinder42, and the other end of the first magnetic cylinder41is coupled to the other end of the second magnetic cylinder42, to form an annulus. At least one or more primary-side windings La are wound around the first magnetic cylinder41and the second magnetic cylinder42, where the primary-side winding is connected to a primary-side switch circuit43. When the primary-side switch circuit43supplies power to the primary-side winding La, a magnetic flux is generated around the primary-side winding La on the first magnetic cylinder41and the second magnetic cylinder42. A direction of a magnetic flux generated on the first magnetic cylinder41is the same as a direction of a magnetic flux generated on the second magnetic cylinder42. A secondary-side windings Lb is separately wound around the first magnetic cylinder41and the second magnetic cylinder42, the secondary-side winding Lb is configured to induce the magnetic flux on the first magnetic cylinder41or the magnetic flux on the second magnetic cylinder42to generate a current, and there are fractional turns of the secondary-side winding Lb. It should be noted that there are fractional turns of the secondary-side winding Lb. For example, the quantity of the turns of the secondary-side winding is greater than 0 and less than 1, specifically, 0.5 turn. When the primary-side switch circuit43supplies power to the primary-side winding La, the direction of the magnetic flux generated on the first magnetic cylinder41and the direction of the magnetic flux generated on the second magnetic cylinder42are the same. The direction of the magnetic flux is also referred to as a magnetic path. Certainly, there may be another definition manner in the technical field. For example,FIG.7is a structural side view of a magnetic core of the transformer. According to an annular structure constituted by coupling the first magnetic cylinder41and the second magnetic cylinder42, the direction of the magnetic flux is a counterclockwise direction. In this case, in the transformer shown inFIG.5, the direction of the magnetic flux of the first magnetic cylinder41is perpendicular to paper inward, and the direction of the magnetic flux of the second magnetic cylinder42is perpendicular to paper outward. Referring toFIG.8,FIG.8is a structural side view of a magnetic core of the transformer. According to an annular structure constituted by coupling the first magnetic cylinder41and the second magnetic cylinder42, the direction of the magnetic flux is a clockwise direction. In this case, in the transformer shown inFIG.5, the direction of the magnetic flux of the first magnetic cylinder41is perpendicular to paper outward, and the direction of the magnetic flux of the second magnetic cylinder42is perpendicular to paper inward. Therefore, the primary-side winding is separately wound around two magnetic cylinders in opposite directions. That is, as shown inFIG.5, the primary-side winding La is wound around the first magnetic cylinder in the clockwise direction, and the primary-side winding La is wound around the second magnetic cylinder in the counterclockwise direction. The primary-side winding forms one turn of winding on the first magnetic cylinder41and the primary-side winding forms one turn of winding on the second magnetic cylinder42. When the primary-side windings are powered on, two turns of windings separately form a same direction of a magnetic flux generated on the magnetic cylinders that the two turns of the windings are wound around.FIG.5further shows input voltages (Vin+ and Vin−) of the primary-side switch circuit43. In addition, as shown inFIG.6, to implement coupling the first magnetic cylinder41to the second magnetic cylinder42, the magnetic core further includes a first magnetic core cover45and a second magnetic core cover46. The first magnetic cylinder41and the second magnetic cylinder42are disposed between the first magnetic core cover45and the second magnetic core cover46. One end of the first magnetic cylinder41is connected to the first magnetic core cover45, and the other end of the first magnetic cylinder41is connected to the second magnetic core cover46. One end of the second magnetic cylinder42is connected to the first magnetic core cover45, and the other end of the second magnetic cylinder42is connected to the second magnetic core cover46. In this way, when a winding loss is reduced by using a fractional turn, because both the primary-side winding and the secondary-side winding can be wound around the first magnetic cylinder and both the primary-side winding and the secondary-side winding can be wound around the second magnetic cylinder, the primary-side winding can directly generate the magnetic flux by using an annular structure constituted by coupling the first magnetic cylinder to the second magnetic cylinder, so that the secondary-side winding generates an induced current. In comparison with the prior art, this structure provides a simpler magnetic cylinder distribution structure of a magnetic core. In addition, the primary-side winding may be wound around the first magnetic cylinder or the second magnetic cylinder starting from any position. In comparison with the prior art, it can be avoided that a terminal is excessively long, providing good winding distribution and a wire inlet and outlet channel. In addition, the secondary-side winding is wound around the magnetic cylinder. In comparison with the prior art in which the secondary-side winding is wound around only the central magnetic cylinder or the magnetic cylinders on both sides, this increases utilization of a magnetic core window. In addition, because both the primary-side winding and the secondary-side winding can be wound around the first magnetic cylinder, and both the primary-side winding and the secondary-side winding can be wound around the second magnetic cylinder, problems of poor coupling and insufficient overlapping, resulting from that the primary-side winding and the secondary-side winding are wound around different magnetic cylinders. In addition, a problem that magnetic flux is unbalanced resulting from that the secondary-side winding is separately wound around the central magnetic cylinder and the magnetic cylinders on both sides is avoided. FIG.9is a view of a transformer in a top view of a magnetic core, where a secondary-side winding is connected to a secondary-side rectifier circuit44. The secondary-side rectifier circuit44includes eight switches, where the eight switches may be switching transistors, including a first switch Q1, a second switch Q2, a third switch Q3, a fourth switch Q4, a fifth switch Q5, a sixth switch Q6, a seventh switch Q7, an eighth switch Q8, and four capacitor groups (C1-C4). Each capacitor group includes at least one capacitor or at least two capacitors connected in parallel. The foregoing switches may be the switching transistors, such as field effect transistors. A first secondary-side winding Lb1, a second secondary-side winding Lb2, a third secondary-side winding Lb3, and a fourth secondary-side winding Lb4are wound around a first magnetic cylinder41. One end of the first secondary-side winding Lb1is connected to a positive pole of a second capacitor group C2, and the other end of the first secondary-side winding Lb1is connected to a negative pole of a first capacitor group C1by using the first switch Q1; and one end of the second secondary-side winding Lb2is connected to the positive pole of the second capacitor group C2, and the other end of the second secondary-side winding Lb2is connected to the negative pole of the first capacitor group C1by using the second switch Q2, where the first secondary-side winding Lb1and the second secondary-side winding Lb2are wound around the first magnetic cylinder41, and the first secondary-side winding Lb1and the second secondary-side winding Lb2are symmetric on a central line of a cross section that is perpendicular to a direction of a magnetic flux on the first magnetic cylinder41. One end of the third secondary-side winding Lb3is connected to a positive pole of the first capacitor group C1, and the other end of the third secondary-side winding Lb3is connected to a negative pole of the second capacitor group C2by using the third switch Q3; and one end of the fourth secondary-side winding Lb4is connected to the positive pole of the first capacitor group C1, and the other end of the fourth secondary-side winding Lb4is connected to the negative pole of the second capacitor group C2by using the fourth switch Q4, where the third secondary-side winding Lb3and the fourth secondary-side winding Lb4are wound around the first magnetic cylinder41, and the third secondary-side winding Lb3and the fourth secondary-side winding Lb4are symmetric on the central line of the cross section that is perpendicular to the direction of the magnetic flux on the first magnetic cylinder41. A fifth secondary-side winding Lb5, a sixth secondary-side winding Lb6, a seventh secondary-side winding Lb7, and an eighth secondary-side winding Lb8are wound around a second magnetic cylinder42. One end of the fifth secondary-side winding Lb5is connected to a positive pole of a fourth capacitor group C4, and the other end of the fifth secondary-side winding Lb5is connected to a negative pole of a third capacitor group C3by using the fifth switch Q5; and one end of the sixth secondary-side winding Lb6is connected to the positive pole of the fourth capacitor group C4, and the other end of the sixth secondary-side winding Lb6is connected to the negative pole of the third capacitor group C3by using the sixth switch Q6, where the fifth secondary-side winding Lb5and the sixth secondary-side winding Lb6are wound around the second magnetic cylinder42, and the fifth secondary-side winding Lb5and the sixth secondary-side winding Lb6are symmetric on a central line of a cross section that is perpendicular to the direction of the magnetic flux on the second magnetic cylinder42. One end of the seventh secondary-side winding Lb7is connected to a positive pole of the third capacitor group C3, and the other end of the seventh secondary-side winding Lb7is connected to a negative pole of the fourth capacitor group C4by using the seventh switch Q7; and one end of the eighth secondary-side winding Lb8is connected to the positive pole of the third capacitor group C3, and the other end of the eighth secondary-side winding Lb8is connected to the negative pole of the fourth capacitor group C4by using the eighth switch Q8, where the seventh secondary-side winding Lb7and the eighth secondary-side winding Lb8are wound around the second magnetic cylinder42, and the seventh secondary-side winding Lb7and the eighth secondary-side winding Lb8are symmetric on the central line of the cross section that is perpendicular to the direction of the magnetic flux on the second magnetic cylinder42. As shown inFIG.9, the transformer may include one primary-side winding La. The primary-side winding La is separately wound around two magnetic cylinders in opposite directions, to form one turn of winding on a first magnetic cylinder41and one turn of winding on a second magnetic cylinder42. Two turns of windings separately form a same direction of the magnetic flux generated on the magnetic cylinders that the two turns of the windings are wound around. The primary-side winding La and a primary-side switch circuit43form a power loop at a primary side. Secondary-side switches Q1, Q3, Q6, and Q8, secondary-side windings Lb1, Lb3, Lb6, and Lb8that are respectively connected to Q1, Q3, Q6, and Q8, and capacitor groups C1, C2, C3, and C4that are respectively connected to Q1, Q3, Q6, and Q8form a half-cycle power loop at a secondary side. Secondary-side switches Q2, Q4, Q5, and Q7, secondary-side windings Lb2, Lb4, Lb5, and Lb7that are respectively connected to Q2, Q4, Q5, and Q7, and the capacitor groups C1, C2, C3, and C4that are respectively connected to Q2, Q4, Q5, and Q7form the other half-cycle power loop at the secondary side. The two half-cycle power loops at the secondary side work alternately with a current of the power loop at the primary side. The capacitor groups C1, C2, C3, and C4are connected in parallel to output a load current. Referring toFIG.10andFIG.11, working currents of the two half-cycle power loops of the transformer are described as follows. When a direction in which the primary-side switch circuit43supplies power to the primary-side winding La is a first direction (for example, as shown inFIG.10, the first direction at a first magnetic cylinder is a clockwise direction, and the first direction at a second magnetic cylinder is a counterclockwise direction), Q1, Q3, Q6, and Q8are turned on. A current of the primary-side winding La and a current of the second primary-side winding La2flow around the first magnetic cylinder41on a left side in a clockwise direction, and flow around the second magnetic cylinder42on a right side in a counterclockwise direction, so that a direction of a magnetic flux generated on the first magnetic cylinder41is perpendicular to paper inward (for example, indicated by a dot at a center of the first magnetic cylinder41inFIG.10), and a direction of a magnetic flux generated on the second magnetic cylinder42is perpendicular to paper outward (for example, indicated by a symbol x at a center of the second magnetic cylinder42inFIG.10). Directions of magnetic fluxes in a loop constituted by coupling the two magnetic cylinders are the same. That is, as shown inFIG.7, the directions of the magnetic fluxes on the two magnetic cylinders are both counterclockwise directions. The switches Q1, Q3, Q6, and Q8are turned on, and Q2, Q4, Q5, and Q7are turned off. In a power loop that is constituted by the switches Q1and Q3, two secondary-side windings that are respectively connected to Q1and Q3, and the capacitor groups C1and C2, a current flows in a counterclockwise direction; and in a power loop that is constituted by the switches Q6and Q8, two secondary-side windings that are respectively connected to Q6and Q8, and the capacitor groups C3and C4, a current flows in a clockwise direction. When the direction in which the primary-side switch circuit43supplies power to the primary-side winding La is a second direction (for example, as shown inFIG.11, the second direction at the first magnetic cylinder is a counterclockwise direction, and the second direction at the second magnetic cylinder is a clockwise direction), Q2, Q4, Q5, and Q7are turned on. A current of the primary-side winding La and a current of the second primary-side winding La2flow around the first magnetic cylinder41on a left side in a counterclockwise direction, and flow around the second magnetic cylinder42on a right side in a clockwise direction, so that a direction of a magnetic flux generated on the first magnetic cylinder41on the left side is perpendicular to paper outward (for example, indicated by a symbol at a center of the first magnetic cylinder41inFIG.11), and a direction of a magnetic flux generated on the second magnetic cylinder42on the right side is perpendicular to paper inward (for example, indicated by a symbol x at a center of the second magnetic cylinder42inFIG.11). Directions of magnetic fluxes in the loop constituted by coupling the two magnetic cylinders are the same. That is, as shown inFIG.8, the directions of the magnetic fluxes on the two magnetic cylinders are both clockwise directions. The switches Q1, Q3, Q6, and Q8are turned off, and Q2, Q4, Q5, and Q7are turned on. In a power loop that is constituted by the switches Q2and Q4, two secondary-side windings that are respectively connected to Q2and Q4, and the capacitor groups C1and C2, a current flows in a clockwise direction; and in a power loop that is constituted by the switches Q5and Q7, two secondary-side windings that are respectively connected to Q5and Q7, and the capacitor groups C3and C4, a current flows in a counterclockwise direction. In this embodiment of this application, actual measured data of a transformer is provided.FIG.12a schematic size diagram of a magnetic core of a transformer. A size of the magnetic core of the transformer is shown in Table 1, where an I sheet is a magnetic core cover. In this embodiment, a first magnetic core cover may have a same size with a second magnetic core cover. In addition, Ae in the following table indicates an effective cross-sectional area. To ensure conversion efficiency of a magnetic flux, an effective cross-sectional area (Ae of the I sheet) of the magnetic core cover is the same as or close to Ae (Ae of a first magnetic cylinder and Ae of a second magnetic cylinder) of a magnetic cylinder. TABLE 1ParametersValuesUnitsRemarksa15.00mmLength of a magnetic coreb25.55mmWidth of a magnetic corea113.00mmSize 1 of an I sheetb113.95mmSize 2 of an I sheeta212.00mmLength of a magnetic cylinderb25.80mmWidth of a magnetic cylinderb319.75mmCentral distance of a magnetic cylinderh11.5mmHeight of a magnetic core windowh26.00mmHeight of a magnetic corer11.00mmChamfer of a magnetic cylinderAe367.5mm{circumflex over ( )}2Ae of an I sheetAe168.74mm{circumflex over ( )}2Ae of a magnetic cylindergap0.2mmGap of a magnetic coreMagneticFerrite with 1 MHzmaterial It should be noted that metal conducting-wire windings may be used for a primary-side winding and a secondary-side winding. In addition, PCB windings may also be used for both the primary-side winding and the secondary-side winding.FIG.13,FIG.14, andFIG.15are drawings of a primary-side winding and a secondary-side winding that are implemented by using a PCB. The primary-side winding is constituted by Wp (Wp1and Wp2) shown inFIG.13and Wx shown inFIG.14andFIG.15. Because chart layers shown inFIG.13,FIG.14, andFIG.15separately represent different metal layers on the PCB board, for a primary-side winding La inFIG.5, Wp1and Wp2that are inFIG.13may be connected in series by using Wx inFIG.14and/orFIG.15to form the primary-side winding La. For example, a welding through hole h3and a welding through hole h4are disposed on Wx, a welding through hole h1is disposed at a projective position on Wp1corresponding to h3, and a welding through hole h2is disposed at a projective position on Wp2corresponding to h4. In this way, the welding through hole h1and the welding through hole h3are connected, and the welding through hole h2and the welding through hole h4are connected, so that Wp1and Wp2that are inFIG.13are connected. Certainly, Wp1and Wp2may alternatively be connected by using Wx (for example, Wx inFIG.15) in another metal layer. A specific manner is similar to the foregoing manner, and details are not described again. As shown inFIG.14andFIG.15, The secondary-side winding is constituted by Ws1and Ws2. Specifically, referring toFIG.14, the secondary-side winding is connected to a positive pole of C2inFIG.5by using a through hole at Sb1, the secondary-side winding is connected to Q1inFIG.5by using a through hole at Sb2, the secondary-side winding is connected to Q2inFIG.5by using a through hole at Sb3, the secondary-side winding is connected to a positive pole of C4inFIG.5by using a through hole at Sb4, the secondary-side winding is connected to Q5inFIG.5by using a through hole at Sb5, and the secondary-side winding is connected to Q6inFIG.5by using a through hole at Sb6. In this case, a secondary-side winding Lb1is formed between Sb1and Sb2, a secondary-side winding Lb2is formed between Sb1and Sb3, a secondary-side winding Lb5is formed between Sb4and Sb5, a secondary-side winding Lb5is formed between Sb4and Sb5, and a secondary-side winding Lb6is formed between Sb4and Sb6. The secondary-side winding is connected to a positive pole of C1inFIG.5by using a through hole at Sa1, the secondary-side winding is connected to Q4inFIG.5by using a through hole at Sa2, the secondary-side winding is connected to Q3inFIG.5by using a through hole at Sa3, the secondary-side winding is connected to a positive pole of C3inFIG.5by using a through hole at Sa4, the secondary-side winding is connected to Q8inFIG.5by using a through hole at Sa5, and the secondary-side winding is connected to Q7inFIG.5by using a through hole at Sa6. In this case, a secondary-side winding Lb4is formed between Sa1and Sa2, a secondary-side winding Lb3is formed between Sa1and Sa3, a secondary-side winding Lb8is formed between Sa4and Sa5, and a secondary-side winding Lb7is formed between Sa4and Sa6. In addition, it should be noted thatFIG.13further shows a through hole at P11and a through hole at P12, and the through hole at P11and the through hole at P12are configured to connect to a primary-side switch circuit43. In addition, Wx is not connected to Ws1or Ws2. Design parameters of the PCB such as a specific size, a thickness, and a quantity of turns are shown in Table 2. Directions of working currents of two half cycles are shown inFIG.16andFIG.17. Referring toFIG.16, in one half cycle, the flow direction of the current in a primary-side winding La is from P11to P12, and the flow directions in a secondary-side winding are from Sb2to Sb1, from Sa3to Sa1, from Sa5to Sa4, and from Sb6to Sb4. Referring toFIG.17, in the other half cycle, the flow direction of the current in the primary-side winding is from P12to P11, and the flow directions in the secondary-side winding are from Sa2to Sa1, from Sb3to Sb1, from Sb5to Sb4, and from Sa6to Sa4.FIG.18is a structural diagram of a layout of a power supply. A primary-side switch circuit is arranged on a left side of a magnetic core of a transformer, and secondary-side rectifier circuits are arranged on the upper side of the magnetic core of the transformer and the lower side of the magnetic core of the transformer. The foregoing P11and the foregoing P12are through holes through which the primary-side winding is connected to the primary-side switch circuit; and Sa1to Sa6and Sb1to Sb6are through holes through which the secondary-side winding is connected to a secondary-side filter circuit. Certainly,FIG.13,FIG.14, andFIG.15are described by using only the primary-side winding and the secondary-side winding that are shown in a drawing of one PCB layer as an example. It may be understood that, to increase a current capacity of the winding, a plurality of PCB layers that are the same may be connected in parallel to be used as the primary-side winding and the secondary-side winding. For example, the plurality of PCB layers that are shown inFIG.13and that are connected in parallel are used as the primary-side winding, and Wp in all layers are connected in parallel; the plurality of PCB layers that are shown inFIG.14and that are connected in parallel are used as the secondary-side winding, and Ws1in all layers are connected in parallel; and the plurality of PCB layers that are shown inFIG.15and that are connected in parallel are used as the secondary-side winding, and Ws2in all layers are connected in parallel. Parameters of a PCB winding are shown in the following Table 2. TABLE 2SpecificationsValuesPCB length76.00mmPCB width25.40mmPCB thickness2.5mmPCB layer quantity16layersPCB copper thickness20oz Based on the foregoing parameters, it can be learned from measured data that an equivalent direct current resistance DCR (a resistance at 20 Hz) of a PCB planar transformer is 1.27, an ACR (a resistance at 0.9 MHz) is 6.54, and an ACR (a resistance at 1.0 MHz) is 6.63, a copper loss may be reduced by approximately 50%, and an overall efficiency may be expected to exceed 98%. In addition,FIG.19is a view of a transformer in a top view of a magnetic core. The transformer may further include two primary-side windings. In this case, a first primary-side winding La1and a second primary-side winding La2are wound around a first magnetic cylinder41, and the first primary-side winding La1and the second primary-side winding La2are wound around a second magnetic cylinder42. When a first primary-side switch circuit43-1of the first primary-side winding La1supplies power to the first primary-side winding La1, and a second primary-side switch circuit43-2of the second primary-side winding La2supplies power to the second primary-side winding La2, a direction of a magnetic flux generated by the first primary-side winding La1on the first magnetic cylinder41is the same as a direction of a magnetic flux generated by the second primary-side winding La2on the second magnetic cylinder42. In other words, the first primary-side winding La1is separately wound around two magnetic cylinders in opposite directions, to form one turn of winding on the first magnetic cylinder41and one turn of winding on the second magnetic cylinder42. Directions of magnetic fluxes generated on the two turns of windings wound around the respective magnetic cylinders are the same. The second primary-side winding La2is separately wound around the two magnetic cylinders in opposite directions, to form one turn of winding on the first magnetic cylinder41and one turn of winding on the second magnetic cylinder42. Directions of magnetic fluxes generated on the two turns of windings wound around the respective magnetic cylinders are the same. In addition, a direction of the magnetic flux generated on the first primary-side winding La1wound around on the first magnetic cylinder41and the second magnetic cylinder42is the same as a direction of the magnetic flux generated on the second primary-side winding La2wound around on the first magnetic cylinder41and the second magnetic cylinder42. To provide more uniform heat dissipation distribution, the first primary-side switch circuit43-1is located on a side that is of the first magnetic cylinder41and that is away from the second magnetic cylinder42, that is, on a left side of the transformer shown inFIG.13; and the second primary-side switch circuit43-2is located on a side that is of the second magnetic cylinder42and that is away from the first magnetic cylinder41, that is, on a right side of the transformer shown inFIG.13. In this way, referring toFIG.19, the first primary-side winding La1that leads out from a left side of the magnetic core is wound around the two magnetic cylinders in the opposite directions to form two turns of primary-side windings. As shown inFIG.19, directions of magnetic fluxes generated by the two turns of the windings on the magnetic core are the same. A first primary-side winding La1and the first primary-side switch circuit43-1form a first power loop at a primary side. A second primary-side winding La2that leads out from a right side of the magnetic core is wound around the two magnetic cylinders in opposite directions to form two turns of primary-side windings. The directions of the magnetic fluxes generated by the two turns of the windings on the magnetic core are the same. The second primary-side winding La2and the second primary-side switch circuit43-2form a second power loop at the primary side. The first power loop at the primary side and the second power loop at the primary side are connected in parallel to synchronously work, and have same and synchronous directions of magnetic fluxes. Secondary-side switches Q1, Q3, Q6, and Q8, secondary-side windings Lb1, Lb3, Lb6, and Lb8that are respectively connected to Q1, Q3, Q6, and Q8, and capacitor groups C1, C2, C3, and C4that are respectively connected to Q1, Q3, Q6, and Q8form a half-cycle power loop at a secondary side. Secondary-side switches Q2, Q4, Q5, and Q7, secondary-side windings Lb2, Lb4, Lb5, and Lb7that are respectively connected to Q2, Q4, Q5, and Q7, and the capacitor groups C1, C2, C3, and C4that are respectively connected to Q2, Q4, Q5, and Q7form the other half-cycle power loop at the secondary side. The two half-cycle power loops at the secondary side work alternately with a current of the power loop at the primary side. The capacitor groups C1, C2, C3, and C4are connected in parallel to output a load current. Working currents of the two half-cycle power loops are shown inFIG.20andFIG.21. Referring toFIG.20, when a direction in which the first primary-side switch circuit43-1supplies power to the primary-side winding La1is a first direction, and a direction in which the second primary-side switch circuit43-2supplies power to the primary-side winding La2is the first direction, a current of the first primary-side winding La1and a current of the second primary-side winding La2flow around the first magnetic cylinder41on a left side in a clockwise direction, and flow around the second magnetic cylinder42on a right side in a counterclockwise direction, so that a direction of a magnetic flux generated on the first magnetic cylinder41is perpendicular to paper inward (for example, indicated by a symbol x at a center of the first magnetic cylinder41inFIG.20), and a direction of a magnetic flux generated on the second magnetic cylinder42is perpendicular to paper outward (for example, indicated by a dot at a center of the second magnetic cylinder42inFIG.20). Directions of magnetic fluxes in a loop constituted by coupling the two magnetic cylinders are the same. That is, as shown inFIG.7, the directions of the magnetic fluxes on the two magnetic cylinders are both counterclockwise directions. The switches Q1, Q3, Q6, and Q8are turned on, and Q2, Q4, Q5, and Q7are turned off. In a power loop that is constituted by the switches Q1and Q3, two secondary-side windings that are respectively connected to Q1and Q3, and the capacitor groups C1and C2, a current flows in a counterclockwise direction; and in a power loop that is constituted by the switches Q6and Q8, two secondary-side windings that are respectively connected to Q6and Q8, and the capacitor groups C3and C4, a current flows in a clockwise direction. Referring toFIG.21, when a direction in which the first primary-side switch circuit43-1supplies power to the primary-side winding La1is a second direction, and a direction in which the second primary-side switch circuit43-2supplies power to the primary-side winding La2is the second direction, a current of the first primary-side winding La1and a current of the second primary-side winding La2flow around the first magnetic cylinder41on a left side in a counterclockwise direction, so that a direction of a magnetic flux generated on the first magnetic cylinder41on the left side is perpendicular to paper outward (for example, indicated by a symbol at a center of the first magnetic cylinder41inFIG.11), and a direction of a magnetic flux generated on the second magnetic cylinder42on the right side is perpendicular to paper inward (for example, indicated by a symbol x at a center of the second magnetic cylinder42inFIG.11). Directions of magnetic fluxes in the loop constituted by coupling the two magnetic cylinders are the same. That is, as shown inFIG.8, the directions of the magnetic fluxes on the two magnetic cylinders are both clockwise directions. The switches Q1, Q3, Q6, and Q8are turned off, and Q2, Q4, Q5, and Q7are turned on. In a power loop that is constituted by the switches Q2and Q4, two secondary-side windings that are respectively connected to Q2and Q4, and the capacitor groups C1and C2, a current flows in a clockwise direction; and in a power loop that is constituted by the switches Q5and Q7, two secondary-side windings that are respectively connected to Q5and Q7, and the capacitor groups C3and C4, a current flows in a counterclockwise direction. When the primary-side winding and the secondary-side winding are implemented by using a PCB, a drawing of the first primary-side winding and a drawing of the second primary-side winding are similar to the drawing inFIG.13. Drawings of the secondary-side windings are similar to the drawing inFIG.14and the drawing inFIG.15. In addition, design parameters of the PCB such as a specific size, a thickness, and a quantity of layers may also refer to Table 2. Flow directions of working currents of two half-cycle power loops on a PCB are shown inFIG.22andFIG.23. Wp1and Wp2located on a same layer are connected by using Wx (for example, Wx of a layer on which Ws1is located) of another layer to form a first primary-side winding La1. Wp3and Wp4located on a same layer are connected by using Wx (for example, Wx of a layer on which Ws2is located) of another layer to form a second primary-side winding La2. Referring toFIG.22andFIG.23, both central positions of PCB layers on which Ws1and Wx2are located include Wx. It can be learned that a welding through hole is disposed on Wx. A function of the welding through hole refers to descriptions inFIG.13andFIG.14. Details are not described herein again, in addition, Wx is not connected to Ws1or Ws2. In one half cycle, a flow direction of the current in the first primary-side winding La1is from P11to P21, and a flow direction of the current in the second primary-side winding La2is from P12to P22; and the flow directions in the secondary-side winding are from Sb2to Sb1, from Sa3to Sa1, from Sa5to Sa4, and from Sb6to Sb4. In the other half cycle, a flow direction of the current in the first primary-side winding La1is from P21to P11, and a flow direction of the current in the second primary-side winding La2is from P22to P12; and the flow directions in the secondary-side winding are from Sa2to Sa1, from Sb3to Sb1, from Sb5to Sb4, and from Sa6to Sa4. A diagram of a layout of a power supply is shown inFIG.24. A first primary-side switch circuit43-1is arranged on the left side of a magnetic core of a transformer, a second primary-side switch circuit43-2is arranged on the right side of the magnetic core of the transformer, and secondary-side rectifier circuits44are arranged on the upper side of the magnetic core of the transformer and the lower side of the magnetic core of the transformer. The forgoing P11and the foregoing P21are through holes through which the first primary-side winding is connected to the primary-side switch circuit; P12and P22are through holes through which the second primary-side winding is connected to the primary-side switch circuit; and Sa1to Sa6and Sb1to Sb6are through holes through which the secondary-side winding is connected to a secondary-side filter circuit. Based on the parameters in Table 1 and Table 2, it can be learned from the measured data of the transformer provided inFIG.18that, the DCR (20 Hz) of the PCB planar transformer is 1.27, the ACR (0.9 MHz) is 6.54, and the ACR (1.0 MHz) is 6.63. The copper loss may be reduced by approximately 50%, and the overall efficiency may be expected to exceed 98%. In addition, because the two primary-side windings are respectively disposed on two sides of the magnetic core, thermal balance on a board is better. As shown inFIG.25, a power supply is provided, including a foregoing transformer51, a primary-side switch circuit52that is connected to a primary-side winding of the transformer51, and a secondary-side rectifier circuit53that is connected to a secondary-side winding of the transformer51. Certainly, as shown inFIG.1, the power supply may further include other structures such as an input filtering and protection component and a control and detection component. Details are not described in this application again. The foregoing descriptions are merely specific implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims. | 50,547 |
11862378 | DETAILED DESCRIPTION OF THE EMBODIMENTS Prior art resonant coil100ofFIG.1can obtain high performance with use of low-loss dielectric materials, as discussed above. However, it can be difficult and/or expensive to manufacture this resonant coil with low-loss dielectric materials. For example, in typical high-performance implementations of resonant coil100, thicknesses of first and second conductor sublayers102,104are less than 20 microns. These small thicknesses make it difficult to handle first and second conductor sublayers102,104while keeping them flat. Thus, an attractive method for manufacturing resonant coil100is to start with a laminate including a first foil conductor layer, a layer of dielectric, and a second foil conductor layer. The foil conductor layers are then etched in complimentary C shapes to form sections including first and second conductor sublayers102,104, and the sections are stacked in an alternating manner with additional dielectric rings. The sections can be made using a standard printed circuit board (PCB) process. Unfortunately, standard dielectrics used in the PCB industry, such as polyimide and FR4 epoxy fiberglass composite, have relatively high dielectric loss. Consequently, prior art resonant coil100cannot achieve high-performance, e.g., high quality factor (Q), when formed using standard PCB manufacturing techniques. While low-loss laminate materials, such as liquid-crystal polymers and PTFE, are available for specialized high-frequency PCBs, these materials are very expensive. Additionally, very thin dielectric is needed in many designs, which can further increase material cost, PCB processing cost, and post-processing handling cost, when forming resonant coil100using standard PCB manufacturing techniques. Applicant has developed new resonant coils with integrated capacitance which at least partially overcome the drawbacks to prior art resonant coil100discussed above. These new resonant coils minimize electric field in dielectric material between selected conductor sublayers, such that dissipation losses between the selected conductor sublayers do not significantly affect resonant coil performance Consequentially, high-performance can be obtained even if dielectric between the selected conductor sublayers is formed of a high-loss material, such as FR4 or polyimide, thereby enabling use of low-cost manufacturing techniques and materials. Additionally, certain embodiments of the new resonant coils are relatively simple to construct, thereby further promoting low cost. FIG.6is a top plan view of a resonant coil600with integrated capacitance, which is one embodiment of the new resonant coils developed by Applicant.FIG.7is an exploded perspective view of the resonant coil, andFIG.8is a cross-sectional view of the resonant coil taken along line8A-8A ofFIG.6. Resonant coil600has a radius602and a thickness604, and resonant coil600includes at least one separation dielectric layer606and a plurality of conductor layers608stacked in an alternating manner in the thickness604direction. Each conductor layer608includes a first conductor sublayer610and a second conductor sublayer612separated in the thickness604direction by a sublayer dielectric layer614.FIG.9is a top plan view of one first conductor sublayer610instance, andFIG.10is a top plan view of one second conductor sublayer612instance. First and second conductor sublayers610,612are formed, for example, of copper foil, aluminum foil, or another electrically conductive material, laminated to sublayer dielectric layer614. It is anticipated that dielectric layers606,614will typically extend slightly, such as one to five millimeters, beyond the edges of conductor sublayers610,612to minimize the likelihood of arcing between the edges of adjacent conductor sublayers. Conductor sublayers610,612have respective thicknesses616,618(seeFIG.8) that are typically smaller than their skin depths at an intended operating frequency, thereby promoting efficient use of conductor sublayers610,612and corresponding low power loss. Proximity losses increase with increasing values of thicknesses616and618, while DC losses decrease with increasing values of thicknesses616and618. First and second conductor sublayers610,612have at least substantially similar notched annular ring shapes. Conductor sublayers610,612and dielectric layers606,614are each disposed around a common center axis620extending in the thickness604direction. Each first conductor sublayer610forms a first discontinuity or notch622such that the first conductor sublayer does not completely encircle center axis620, and each second conductor sublayer612forms a second discontinuity or notch624such that the second conductor sublayer does not completely encircle center axis620. Importantly, within a given conductor layer608instance, first conductor sublayer610is angularly aligned with second conductor sublayer612with respect to center axis620, such that notches622,624of first and second conductor sublayers610,612, respectively, are also angularly aligned. Consequently, first and second conductor sublayers610,612of a given conductor layer608instance are commonly aligned when resonant coil600is viewed cross-sectionally in the thickness604direction. The common alignment of first and second conductor sublayers610,612within a given conductor layer608instance causes there to be negligible electric field between the first and second conductor sublayers, resulting in minimal excitation of the capacitance between the conductor sublayers. As a result, dielectric loss of sublayer dielectric layer614does not significantly affect performance of resonant coil600. Consequently, sublayer dielectric layer614can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, sublayer dielectric layer614can be of essentially any desired thickness without materially affecting performance, since capacitance of sublayer dielectric layer614is minimally excited during operation, which facilitates use of standard PCB processing techniques and materials when forming resonant coil600, thereby further promoting low cost and ease of manufacturing. In prior art resonant coil100ofFIG.1, in contrast, thickness of sublayer dielectric layers110directly affects capacitance values, thereby constraining thickness and composition of sublayer dielectric layers110to those required to achieve desired electrical properties of resonant coil100. The plurality of conductor layers608in resonant coil600have alternating opposing orientations, where notches622,624of one conductor layer608instance are angularly displaced from notches622,624of an adjacent conductor layer608instance, with respect to center axis620. In particular, first conductor layer608(1) has a first orientation with notches622,624at about zero degrees with respect to center axis620, second conductor layer608(2) has an opposite second orientation with notches622,624at about 180 degrees with respect to center axis620, third conductor layer608(3) has the first orientation, and so on, as seen when resonant coil600is viewed cross-sectionally in the thickness604direction. Such alternating opposing orientation of adjacent conductor layers608results in an electric field between adjacent conductor layers608, thereby achieving integrated capacitance of resonant coil600, as discussed below with respect toFIG.11. Adjacent conductor layers608may be angularly offset from each other at angles other than 180 degrees without departing from the scope hereof, as long as adjacent conductor layers608have different orientations. In contrast to sublayer dielectric layers614, separation dielectric layers606must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance, because there is significant electric field between conductor layers608during operation of resonant coil600. However, low-loss dielectric films without metal foil laminated thereto are much less expensive than low-loss dielectric films laminated with foil. For example, PTFE film is readily available at low cost, but laminating it with copper is very expensive because it is difficult to adhere copper to the PTFE. Accordingly, separation dielectric layers606can be formed of low-loss dielectric material at a much lower cost than sublayer dielectric layers614. Resonant coil600forms a center aperture626, such that conductor sublayers610,612are wound around the aperture and center axis620. It is anticipated that in many embodiments, a magnetic core (not shown) will extend through aperture626, to help direct the magnetic field produced by resonant coil600to where it is needed and to help prevent stray magnetic flux. Use of a magnetic core potentially also helps shape the magnetic field in the region of resonant coil600such that the magnetic flux above, below, and within resonant coil600travels approximately parallel to conductor layers610,612, thereby promoting even conductor current distribution and low eddy current losses in the conductors. A magnetic core can also be used to help achieve a desired reluctance in applications requiring a particular reluctance value, such as in applications where resonant coil600forms an inductive-capacitive resonant device. One possible material for use in a magnetic core is manganese zinc ferrite material, which has low losses at any frequency below about one megahertz, at flux densities up to about 200 millitesla. Another possible material for use in a magnetic core is nickel zinc ferrite material, which has lower losses than manganese zinc ferrite material at higher frequencies. However, use of a magnetic core is not required. Additionally, in some alternate embodiments, such as in embodiments intended for use without a core, dielectric layers606,614are solid disc shaped as opposed to annular shaped, such that resonant coil600does not form an aperture that extends along the entirety of thickness604. Although resonant coil600is illustrated as including three conductor layers608, resonant coil600could be modified to have any number of conductor layers608greater than one. Additionally, resonant coil600could be modified to have one or more incomplete conductor layers608, such as an incomplete conductor layer including first conductor sublayer610and sublayer dielectric layer614instances, but no second conductor sublayer612instance. Additionally, since dielectric layers606,614need only separate adjacent conductor sublayers, in some alternate embodiments, dielectric layers606,614have a notched annular shape similar to those of conductor sublayers610,612, where the dielectric layer notch is generally aligned with the notch of an adjacent conductor sublayer610,612. Furthermore, although each conductor sublayer610,612instance is shown as having the same thickness616,618, thickness could vary among conductor sublayer instances, or even within a given conductor sublayer. For example, in a particular alternate embodiment including a magnetic core, conductor sublayers610,612instances near the bottom of resonant coil600have greater thicknesses616,618than conductor sublayer610,612instances near the top of resonant coil600, to promote low DC resistive losses within conductor sublayers610,612without incurring excessive eddy-current-induced losses. In particular, the magnetic core causes conductor sublayer610,612instances near the bottom of resonant coil600to be subject to less magnetic flux than conductor sublayer610,612instances near the top of resonant coil600, such that instances near the bottom of resonant coil600can be relatively thick without incurring excessive eddy-current losses. Moreover, while it is anticipated that each sublayer dielectric layer614instance will typically have the same thickness632, thickness632could vary among sublayer dielectric layer614instances without departing from the scope hereof. Similarly, separation dielectric layer606thicknesses630could either be the same or vary among separation dielectric layer606instances. Only some instances of thicknesses616,618,630,632are labeled inFIG.8to promote illustrative clarity. Resonant coil600forms one or more sections634, depending on the number of conductor layers608, where each section634includes a respective instance of first conductor sublayer610, second conductor sublayer612, and separation dielectric layer606. Accordingly, the embodiment illustrated inFIGS.6-8has two sections634.FIG.11is an electrical model1100of the illustrated embodiment of resonant coil600. As shown inFIG.11, each section634includes a winding turn1102electrically coupled in parallel with two series-coupled capacitors1104and1106. Winding turns1102are magnetically coupled, as symbolically represented by a core1108. Core1108is a magnetic core in embodiments where resonant coil600includes a magnetic core. On the other hand, in embodiments where resonant coil600does not include a magnetic core, core1108represents magnetic coupling without use of a magnetic core, such that core1108is an “air core.” Proximity losses increase with increasing number of sections634, while DC losses increase with decreasing number of sections634. It should be noted that first conductor sublayer610(1) and second conductor sublayer612(3) do not materially contribute to the electrical characteristics of resonant coil600since these two conductor sublayers are not part of a section634. Additionally, capacitance between first conductor sublayer610(1) and second conductor sublayer612(1), capacitance between first conductor sublayer610(2) and second conductor sublayer612(2), and capacitance between first conductor sublayer610(3) and second conductor sublayer612(3) are not shown inFIG.11because such capacitance is not materially excited and therefore does not significantly affect electrical characteristics of resonant coil600. FIG.12shows a top plan view of resonant coil600with left and right portions1202,1204of resonant coil600approximately delineated by dashed lines. Left and right portions1202,1204are separated by notches622,624in conductor sublayers610,612(seeFIGS.9and10). Capacitor1104(1) represents capacitance between conductor sublayers612(1),610(2) in left portion1202, and capacitor1104(2) represents capacitance between conductor sublayers612(2),610(3) in left portion1202. Similarly, capacitor1106(1) represents capacitance between conductor sublayers612(1),610(2) in right portion1204, and capacitor1106(2) represents capacitance between conductor sublayers612(2),610(3) in right portion1204. The capacitance values of capacitors1104,1106can be adjusted during the design of resonant coil600, such as to achieve a desired resonance. For example, capacitance can be increased by decreasing separation dielectric layer606thickness630and/or by increasing surface area of overlapping portions of conductor sublayers610,612within sections634, such as by adjusting widths of notches622,624. Assuming symmetrical construction, the capacitance value of capacitor1104is essentially identical to the capacitance value of capacitor1106in each conductor layer608. An AC electric power source1110is optionally electrically coupled to resonant coil600to drive the resonant coil, such that power source1110and resonant coil600collectively form a system for generating a magnetic field, or such that power source1110and resonant coil600form part of a resonant electrical circuit. AC electric power source1110may be electrically coupled in parallel with conductor sublayers610,612of one section634, such that electric power source1110is effectively electrically coupled in parallel with one winding turn1102. For example, AC electric power source1110may be electrically coupled in parallel with conductor sublayers612(1) and610(2), such that source1110is effectively electrically coupled in parallel with winding turn1102(1), as shown inFIG.11. Although only one winding turn1102is directly connected to AC electric power source1110in theFIG.11example, the remaining winding turns1102are also effectively coupled in parallel with source1110, due to magnetic coupling of winding turns1102. Each winding turn1102's capacitors1104,1106, for example, collectively serve as a resonant capacitor electrically coupled in parallel with the winding turn. WhileFIG.11shows AC electric power source1110electrically coupled in parallel with winding turn1102(1), electric power source1110could alternately be electrically coupled to one or more different conductor sublayers610,612. Furthermore, AC electrical power source1110could be configured to indirectly drive resonant coil600, such as via another winding that is separate from, but magnetically coupled to, resonant coil600. For example, in certain embodiments, resonant coil600includes a magnetic core (not shown), and AC electrical power source1110is electrically coupled to an additional winding wound around center axis620and disposed in thickness604direction between a last section634and the magnetic core, such that the additional winding is largely outside of the magnetic flux path of resonant coil600. Such relative isolation of the additional winding from the magnetic flux path enables the additional winding to be formed of relatively thick metal to promote low DC resistive losses, without incurring excessive eddy-current-induced losses. It may be desirable for resonant coil600to have a high quality factor in certain applications, such as in wireless power transfer applications, as discussed below. Certain embodiments of resonant coil600advantageously achieve a significantly higher quality factor than conventional resonant coils of similar size. For example,FIG.13shows a graph1300of theoretical values of quality factor at 7 MHz for one embodiment of resonant coil600as a function of number of sections634and thicknesses616and618of first and second conductor sublayers610,612, respectively. The vertical axis1302of graph1300corresponds to thicknesses616and618of first and second conductor sublayers610,612, respectively, and the horizontal axis1304of graph1300corresponds to number of sections634. The numbers on the curves in graph1300correspond to quality factor at 7 MHz. As evident fromFIG.13, values of quality factor higher than 1,000 are theoretically achievable in certain embodiments of resonant coil600. Possible applications of resonant coil600include, but are not limited to, use as a resonant coil in a power converter and use as a resonant coil in a wireless power transfer system. The high quality factor values achievable by certain embodiments of resonant coil600may be particularly beneficial in wireless power transfer applications because high quality factor promotes high efficiency in such applications. In particular, theoretical maximum efficiency nmaxin a wireless power transfer application is given by EQN. 1 below, where Q1is the quality factor of the sending resonant coil, Q2is the quality factor of the receiving resonant coil, and k is the coupling coefficient of the sending and receiving resonant coils. As evident from EQN. 1, increasing values of Q1and/or Q2increases maximum efficiency nmax. nmax=(Q1Q2k)2(1+1+(Q1Q2k)2)2EQN.1 FIG.14shows a graph1400of theoretical wireless power transfer efficiency as a function of coil separation distance for three different resonant coil types, where coil separation distance is a distance between a sending resonant coil and a receiving resonant coil. Curve1402corresponds to the sending and receiving resonant coils each being conventional resonant coil having a quality of factor of 100, and curve1404corresponds to the sending and receiving resonant coils each being conventional state-of-the-art resonant coil having a quality of factor of 185. Curve1406corresponds to the sending and receiving resonant coils each being an embodiment of resonant coil600having a quality of factor1177. As can be appreciated from graph1400, resonant coil600can achieve remarkably higher efficiency in wireless power transfer applications than conventional resonant coils, especially at large separation distances. In an alternate embodiment of resonant coil600, one or more instances of first and second conductor sublayers610,612are replaced with multiple notched annular ring-shaped conductors concentrically wound around center axis620. For instance,FIGS.15and16respectively illustrate first and second conductor sublayers1510,1612, which may be used in place of first and second conductor sublayers610,612, respectively, in resonant coil600. First conductor sublayer1510includes a plurality of annular ring-shaped conductors1511concentrically wound around center axis620. Similar, second conductor sublayer1612includes a plurality of annular ring-shaped conductors1613wound around center axis620. Such division of first and second conductor sublayers610,612into multiple parallel-coupled conductors promotes equal current sharing in the radial602direction. Each annular ring-shaped conductor1511has a respective width1515in the radial direction, and each annular ring-shaped conductor1613has a respective width1617in the radial direction. Only one instance of width1515is labeled inFIG.15, and only one instance of width1617is labeled inFIG.16, to promote illustrative clarity. The number of annular ring-shaped conductors1511and annular ring-shaped conductors1613may be varied without departing from the scope hereof. FIG.52is a graph5200of simulated current crowding factor of conductor sublayers1510and1612as a function of widths1515and1617, respectively, in a wireless power transfer application.FIG.53is a graph5300of simulated current crowding factor of conductor sublayers1510and1612as a function of number of “traces,” i.e., number of first conductor sublayers1510and second conductor sublayers1612, respectively, in a wireless power transfer application. Current crowding factor in graphs5200and5300is the ratio of (a) simulated AC resistance including lateral current crowding to (b) calculated AC resistance not including lateral current crowding. As evident from graphs5200and5300, current crowding factor may vary significantly as a function of widths1515and1617and number of conductor sublayers1510and1612. In certain embodiments, small current crowding factor is promoted by configuring conductor sublayers1510and1612such that respective widths1515and1617are small, i.e., close to their skin depths under anticipated operating conditions. Resonant coil600could be modified to have a different geometry without departing from the scope hereof, as long as conductor sublayers610,612within each conductor layer608have a common orientation, and adjacent conductor layers608have different orientations. For example, first and second conductor sublayers610,612could be modified to have a rectangular shape instead of a ring shape. As another example,FIG.17is a top plan view of a resonant coil1700with integrated capacitance and including a plurality of concentric tubular conductor layers.FIG.18is a cross-sectional view of resonant coil1700taken along line18A-18A ofFIG.17, andFIG.19is a cross-sectional view of resonant coil1700taken along line19A-19A ofFIG.18. Resonant coil1700includes a plurality of tubular conductor layers1702concentrically stacked around a common axis1704in a radial1714direction extending from common axis1704. Although resonant coil1700is illustrated as including two tubular conductor layers1702, resonant coil1700could include additional tubular conductor layers1702without departing from the scope hereof. Common axis1704forms a loop around a center axis1706of resonant coil1700, such that resonant coil1700has a toroidal shape. Each tubular conductor layer1702includes a first tubular conductor sublayer1708and a second tubular conductor sublayer1710concentrically stacked around common axis1704. In some embodiments, first and second tubular conductor sublayers1708,1710are formed of conductive foil or conductive film. The conductive foil or film typically has a thickness smaller than its skin depth at an intended operating frequency, thereby promoting efficient use of foil conductor sublayers1708,1710and corresponding low power loss. In some embodiments, thickness of the foil or conductive film is inversely proportional to the square root of the number of tubular conductor layers1702, such that thickness decreases as the number of tubular conductor layers increases. A separation dielectric layer1712separates each pair of adjacent tubular conductor layers1702in the radial1714direction. Consequentially, tubular conductor layers1702and separation dielectric layers1712are concentrically stacked in an alternating manner in the radial direction. A sublayer dielectric layer1713separates adjacent first and second tubular conductor sublayers1708,1710in the radial1714direction within each tubular conductor layer1702. Each first tubular conductor sublayer1708forms a first discontinuity1716, and each second tubular conductor sublayer1710forms a second discontinuity1718, in the toroidal direction, so that conductor sublayers1708,1710do not completely encircle center axis1706, as illustrated inFIG.19. Within each tubular conductor layer1702instance, first and second discontinuities1716,1718are angularly aligned with respect to center axis1706, such that first and second tubular conductor sublayers1708,1710have a common alignment. Consequently, there is minimal electric field to excite capacitance between first and second tubular conductor sublayers1708,1710within a given tubular conductor layer1702. Therefore, sublayer dielectric layer1713can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layer1713can be varied during the design of resonant coil1700without materially affecting electrical properties of the coil. Tubular conductor layers1702having alternating opposing orientations, to excite capacitance between adjacent tubular conductor layers1702and thereby achieve integrated capacitance of resonant coil1700. In particular, first tubular conductor layer1702(1) has a first orientation with discontinuities1716(1),1718(1) at about zero degrees with respect to center axis1706, and second tubular conductor layer1702(2) has an opposite second orientation with discontinuities1716(2),1718(2) at about 180 degrees with respect to center axis1706. A third tubular conductor layer1702(not shown) would have the first orientation, a fourth tubular conductor layer1702(not shown) would have the second orientation, and so on. Adjacent tubular conductor layers1702may be angularly offset from each other at angles other than 180 degrees without departing from the scope hereof, as long as adjacent tubular conductor layers1702have different orientations. Separation dielectric layers1712must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance, because there is significant electric field between conductor tubular layers1702during operation of resonant coil1700. Capacitance of resonant coil1700is proportional to the area of overlap of adjacent tubular conductor layers1702. Accordingly, capacitance values can be adjusted during the design of resonant coil1700by varying the respective widths1720of first and second discontinuities1716,1718in the toroidal direction. (SeeFIG.19). For instance, if smaller capacitance values are desired, widths1720of first and second discontinuities1716,1718can be made larger. Although it is anticipated that each first and second discontinuity1716,1718will have the same width1720, it is possible for discontinuity width1720to vary among tubular conductor layer1702instances without departing from the scope hereof. Capacitance is also inversely proportional to radial separation1717of adjacent tubular conductor layers1702(seeFIG.18), and capacitance can therefore be adjusted during resonant coil1700's design by varying radial separation distance1717. In the embodiment ofFIGS.17-19, common axis1704forms a circle around center axis1706such that common axis1704forms a closed loop, as illustrated inFIGS.17and19, and each tubular conductor sublayer1708,1710has a circular cross-section perpendicular to common axis1704, such that resonant coil1700has a toroidal shape. However, the shape of the loop formed by common axis1704and/or the cross-sectional shape of tubular conductor sublayers1708,1710could be varied without departing from the scope hereof. For example, in one alternate embodiment, common axis1704forms a non-planar closed loop. The fact that first and second tubular conductor sublayers1708,1710do not completely encircle center axis1706causes current to flow through resonant coil1700in the direction of common axis1704, or in other words, causes current to flow in the toroidal direction. Resonant coil1700optionally includes electrical terminals1722,1724electrically coupled to opposing ends of second tubular conductor sublayer1710(2), as illustrated inFIG.17, to provide electrical access to resonant coil1700. A magnetic field generated by current flowing through second tubular conductor sublayer1710(2) induces current through the remaining first and second tubular conductor sublayers1708,1710, and it therefore may be unnecessary to couple the other tubular conductor sublayers to electrical terminals. However, alternate or additional tubular conductor sublayers could be electrically coupled to electrical terminals1722,1724without departing from the scope hereof. A magnetic core (not shown) is optionally disposed partially or completely around resonant coil1700to achieve a desired reluctance and/or to help contain the magnetic field. For example, in some embodiments, a cylindrical magnetic core is disposed in center1726of resonant coil1700. In applications where resonant coil1700forms a resonant induction coil for induction heating, it is expected that the workpiece would be disposed in center1726to realize maximum magnetic field strength at the workpiece location. The magnetic field also extends along center axis1706, decreasing in magnitude with distance above resonant coil1700. In some resonant induction coil applications, the magnetic field in the region above resonant coil1700is used, for example, for wireless power transfer or for magnetic hyperthermia. FIG.20is a top plan view of a resonant coil2000with integrated capacitance including a plurality of concentric tubular conductor layers, andFIG.21is a cross-sectional view of resonant coil2000taken along line21A-21A ofFIG.20. Resonant coil2000is similar to resonant coil1700ofFIGS.17-19, but with tubular conductor layers1702replaced with tubular conductor layers2002. As discussed below, tubular conductor sublayer discontinuities of resonant coil2000are formed along poloidal axes such that each tubular conductor sublayer does not completely encircle common axis1704, so that the current flow and magnetic field paths of resonant coil2000differ from those of resonant coil1700. Each tubular conductor layer2002includes a first tubular conductor sublayer2008and a second tubular conductor sublayer2010concentrically stacked around common axis1704in the radial1714direction. In some embodiments, first and second tubular conductor sublayers2008,2010are formed of conductive foil or conductive film. The conductive foil or film typically has a thickness smaller than its skin depth at an intended operating frequency, thereby promoting efficient use of foil conductor sublayers2008,2010and corresponding low power loss. In some embodiments, thickness of the foil or conductive film is inversely proportional to the square root of the number of tubular conductor layers2002, such that thickness decreases as the number of tubular conductor layers increases. A separation dielectric layer1712separates each pair of adjacent tubular conductor layers2002, and a sublayer dielectric layer1713separates first and second tubular conductor sublayers2008,2010within each tubular conductor layer. Each first tubular conductor sublayer2008forms a first notch or discontinuity2016, and each second tubular conductor sublayer2010forms a second notch or discontinuity2018, so that each tubular conductor sublayer2008,2010does not completely encircle common axis1704, as illustrated inFIG.21. Within each tubular conductor layer2002instance, first and second discontinuities2016,2018are angularly aligned with respect to common axis1704, such that first and second tubular conductor sublayers2008,2010have a common alignment. Consequently, there is minimal electric field to excite capacitance between first and second tubular conductor sublayers2008,2010, within a given tubular conductor layer2002. Therefore, sublayer dielectric layer1713can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layer1713can be selected as desired without materially affecting electrical properties of resonant coil2000. Tubular conductor layers2002have alternating opposing orientations, to excite capacitance between adjacent tubular conductor layers and thereby achieve integrated capacitance of resonant coil2000. In particular, first tubular conductor layer2002(1) has a first orientation with discontinuities2016(1),2018(1) at about zero degrees with respect to common axis1704, and second conductor layer2002(2) has an opposite second orientation with discontinuities2016(2),2018(2) at about 180 degrees with respect to common axis1704. A third conductor layer2002(not shown) would have the first orientation, a fourth conductor layer2002(not shown) would have the second orientation, and so on. Adjacent tubular conductor layers2002may be angularly offset from each other at angles other than 180 degrees without departing from the scope hereof, as long as adjacent tubular conductor layers2002have different orientations. Separation dielectric layers1712must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance, because there is significant electric field between conductor tubular layers2002during operation of resonant coil2000. Capacitance values can be adjusted during the design of multilayer conductor2000by varying the respective widths2020of first and second discontinuities in the poloidal direction, in a manner similar to that discussed above with respect to multilayer conductor1700. Additionally, capacitance can be adjusted during resonant coil2000's design by varying the radial1714separation of tubular conductor layers2002, similar to as discussed above with respect to resonant coil1700. The fact that first and second discontinuities2016,2018do not completely encircle common axis1704causes current to flow through resonant coil2000around common axis1704, or in other words, causes current to flow in the poloidal direction. The magnetic field, in turn, is directed along common axis1704, or in other words, in the toroidal direction, within a center portion2015of concentric tubular conductor layers2002. A magnetic core (not shown) is optionally disposed within center2015of tubular conductor layers2002to achieve a desired reluctance. Resonant coil2000optionally includes electrical terminals2022,2024electrically coupled to opposing ends of second tubular conductor sublayer2010(2), as illustrated inFIG.21, to provide electrical access to resonant coil2000. A magnetic field generated by current flowing through second tubular conductor sublayer2010(2) induces current through the remaining first and second tubular conductor sublayers2008,2010, and it therefore may be unnecessary to couple the other tubular conductor sublayers to electrical terminals. However, alternate or additional tubular conductor sublayers could be electrically coupled to electrical terminals without departing from the scope hereof. FIGS.22-26illustrate a magnetic device2200including a resonant coil2201with integrated capacitance.FIG.22is a perspective view of magnetic device2200,FIG.23is a side elevational view of magnetic device2200, andFIG.24is a top plan view of magnetic device2200.FIG.25is a cross-sectional view of magnetic device2200taken along line25A-25A ofFIG.23, andFIG.26is a cross-sectional view of the magnetic device along line26A-26A ofFIG.24. Resonant coil2201includes a plurality of tubular conductor layers2202concentrically stacked around a common or center axis2204in a radial2212direction, as illustrated inFIGS.25and26. Resonant coil2201has a cylindrical shape as seen when viewed cross-sectionally along center axis2204. Although resonant coil2201is illustrated as including two tubular conductor layers2202, resonant coil2201could include additional tubular conductor layers2202without departing from the scope hereof. Each tubular conductor layer2202includes a first tubular conductor sublayer2206and a second tubular conductor sublayer2208concentrically stacked in the radial2212direction around center axis2204. In some embodiments, first and second tubular conductor sublayers2206,2208are formed of conductive foil or conductive film. The conductive foil or film typically has a thickness smaller than its skin depth at an intended operating frequency, thereby promoting efficient use of foil conductor sublayers2206,2208and corresponding low power loss. In some embodiments, thickness of the foil or conductive film is inversely proportional to the square root of the number of tubular conductor layers2202, such that thickness decreases as the number of tubular conductor layers increases. A separation dielectric layer2210separates each pair of adjacent tubular conductor layers2202in the radial2212direction. Consequentially, tubular conductor layers2202and separation dielectric layers2210are concentrically stacked around center axis2204. A sublayer dielectric layer2211separates adjacent first and second tubular conductor sublayers2206,2208in the radial2212direction within each tubular conductor layer. Each first tubular conductor sublayer2206forms a first notch or discontinuity2214, such that the first tubular conductor sublayer does not completely encircle center axis2204, as illustrated inFIG.25. Similarly, each second tubular conductor sublayer2208forms a second notch or discontinuity2216, such that the second tubular conductor sublayer does not completely encircle center axis2204, as also illustrated inFIG.25. Although discontinuities2214and2216are illustrated as being filled with air, discontinuities2214and2216could be filled with another material, such as material forming sublayer dielectric layers2211or material forming separation dielectric layers2210, without departing from the scope hereof. Within each tubular conductor layer2202instance, first and second discontinuities2214,2216are angularly aligned with respect to center axis2204, such that first and second tubular conductor sublayers2206,2208have a common alignment. Consequently, there is minimal electric field to excite capacitance between first and second tubular conductor sublayers2206,2208, within a given tubular conductor layer2202. Therefore, sublayer dielectric layer2211can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layer2211can be selected as desired without materially affecting electrical properties of resonant coil2201. Tubular conductor layers2202have alternating opposing orientations, to excite capacitance between adjacent tubular conductor layers and thereby achieve integrated capacitance of resonant coil2200. In particular, first tubular conductor layer2202(1) has a first orientation with discontinuities2214(1),2216(1) at about zero degrees with respect to center axis2204, and second conductor layer2202(2) has an opposite second orientation with discontinuities2214(2),2216(2) at about 180 degrees with respect to center axis2204. A third tubular conductor layer2202(not shown) would have the first orientation, a fourth tubular conductor layer2202(not shown) would have the second orientation, and so on. Adjacent tubular conductor layers2202may be angularly offset from each other at angles other than 180 degrees without departing from the scope hereof, as long as adjacent tubular conductor layers2202have different orientations. Separation dielectric layers2210must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance, because there is significant electric field between conductor tubular layers2202during operation of resonant coil2201. Capacitance values can be adjusted during the design of resonant coil2201by varying the respective widths2218of first and second discontinuities2214,2216, in a manner similar to that discussed above with respect to resonant coil1700. Additionally, capacitance can be adjusted during resonant coil's2201design by varying radial2212separation distance2215of the tubular conductor sublayers, similar to as discussed above with respect to resonant coil1700. Although not required, magnetic device2200typically includes a magnetic core2220enclosing tubular conductor layers2202to help achieve desired reluctance, to help contain a magnetic field generated by current flowing through tubular conductor layers2202, and/or to influence the shape of the magnetic field lines in the region of tubular conductor layers2202to be substantially parallel to the layers. For example, in some embodiments, magnetic core2220has a hollow cylindrical shape and is centered with respect to center axis2204, as illustrated inFIGS.25and26. In these embodiments, magnetic core2220includes a first end magnetic element2222, a second end magnetic element2224, and an outer ring2226. First end magnetic element2222opposes second end magnetic element2224in a thickness2228direction parallel to center axis2204. Outer ring2226is centered with respect to center axis2204, and outer ring2226also joins first and second end magnetic elements2222,2224in the thickness2228direction. Accordingly, resonant coil2201is disposed between first and second end magnetic elements2222,2224and within outer ring2226. A magnetic center post2230is disposed in a center2232of tubular conductor layers2202along center axis2204. Magnetic center post2230at least partially joins first and second end magnetic elements2222,2224in the thickness2228direction. Magnetic flux generated by current flowing through tubular conductor layers2202flows in a loop through magnetic center post2230, first end magnetic element2222, outer ring2226, and second end magnetic element2224. Although not required, additional dielectric material2231,2233typically separates tubular conductor layers2202from magnetic center post2230and outer ring2226, respectively. AlthoughFIG.26delineates magnetic center post2230from first end magnetic element2222and second end magnetic element2224to help the viewer distinguish the magnetic center post from the end magnetic elements, the magnetic center post could be joined with one or more of the end magnetic elements without departing from the scope hereof. Additionally, although outer ring2226and end magnetic elements2222,2224are illustrated as being part of a single-piece magnetic core, magnetic core2220could be formed from two or more magnetic pieces that are joined together. Magnetic center post2230could have the same composition as magnetic core2220to simplify construction. Alternately, magnetic center post2230could have a different composition from magnetic core2220, such as to help achieve a desired reluctance. For example, in some embodiments, magnetic core2220is formed of a high permeability ferrite material, and magnetic center post2230is formed of a lower permeability material including magnetic materials disposed in a non-magnetic binder, such that the magnetic center post has a distributed non-magnetic “gap.” In these embodiments, a desired reluctance is achieved, for example, by adjusting the ratio of magnetic material and non-magnetic binder forming magnetic center post2230. Magnetic center post2230could also form a discrete gap (not shown) filled with non-magnetic material, or with material having a lower magnetic permeability than the remainder of the magnetic center post, to help achieve a desired reluctance. However, a single gap may cause magnetic field lines, which generally flow in the thickness2228direction through magnetic center post2230, to curve in the vicinity of the gap, such that the magnetic field lines induce eddy current losses in tubular conductor layers2202. Such eddy-current losses can be reduced by forming a quasi-distributed gap from multiple small gaps (not shown), instead of a single large gap, in magnetic center post2230. Additionally, magnetic center post2230could even be completely omitted. In an alternate embodiment of device2200, first and second end magnetic elements2222,2224are each formed of a high permeability magnetic material, and outer ring2226and magnetic center post2230are each formed of a low permeability magnetic material. The low permeability magnetic material in this embodiment includes, for example, a low permeability homogenous magnetic material, a low permeability composite magnetic material, a high permeability magnetic material including multiple gaps forming a quasi-distributed gap, or air. Device2200optionally includes electrical terminals (not shown) electrically coupled to opposing ends of one or more tubular conductor sublayers2206,2208, to provide electrical access to resonant coil2201. A magnetic field generated by current flowing through one tubular conductor sublayer2206or2208induces current through the remaining first and second tubular conductor sublayers2206,2208. Therefore, it may be unnecessary to couple all other tubular conductor sublayers to electrical terminals. Although magnetic device2200is shown as being cylindrical, it could alternately have a different shape without departing from the scope hereof. For example, tubular conductor layers2202could alternately have an oval or rectangular cross-section, instead of a circular cross-section, as seen when viewed cross-sectionally along line25A-25A ofFIG.23. Additionally, although magnetic center post2230is illustrated as having a cylindrical shape, it could also have a different shape without departing from the scope hereof. For instance,FIG.27is a cross-sectional view analogous toFIG.25of a magnetic device2700including a resonant coil2701with integrated capacitance. Magnetic device2700is one alternate embodiment of device2200having a rectangular shape, as seen when viewed cross-sectionally along a common or center axis2704. Magnetic device2700includes a plurality of tubular conductor layers2702concentrically stacked around a common or center axis2704, where each tubular conductor layer2702includes a first tubular conductor sublayer2706and a second tubular conductor sublayer2708concentrically stacked around center axis2704. A separation dielectric layer2710separates each pair of adjacent tubular conductor layers2702, and a sublayer dielectric layer2711separates adjacent first and second tubular conductor sublayers2706,2708within each tubular conductor layer. Each first tubular conductor sublayer2706forms a first notch or discontinuity2714, and each second tubular conductor sublayer2708forms a second notch or discontinuity2716. Although discontinuities2714and2716are illustrated as being filled with air, discontinuities2714and2716could be filled with another material, such as material forming sublayer dielectric layers2711or material forming separation dielectric layers2710, without departing from the scope hereof. Within each tubular conductor layer2702instance, first and second discontinuities2714,2716are angularly aligned with respect to center axis2704, such that first and second tubular conductor sublayers2706,2708have a common alignment. Tubular conductor layers2702have alternating opposing orientations, to excite capacitance between adjacent tubular conductor layers and thereby achieve integrated capacitance of resonant coil2700. Tubular conductor layers2702, dielectric layer2710, and sublayer dielectric layers2711are analogous to tubular conductor layers2202, dielectric layer2210, and sublayer dielectric layers2211, respectively, of device2200. Device2700could include additional tubular conductor layers2702without departing from the scope hereof. Although not required, device2700typically includes a magnetic core2720analogous to magnetic core2220of device2200. Magnetic core2720includes a rectangular hollow outer magnetic element2726joining first and second end magnetic elements (not shown) in the thickness direction. A magnetic center post2730at least partially joins the first and second end magnetic elements in the thickness direction.FIG.28is a cross-sectional view of a device2800which is like device2700but with magnetic core2720and magnetic center post2730omitted. The resonant coils discussed above have a parallel-resonant electric topology, i.e., with integrated capacitance electrically coupled in parallel with winding turns, as symbolically illustrated in theFIG.11electrical model. However, any of the resonant coils discussed above could be modified to have a series-resonant electric topology, i.e. with the integrated capacitance effectively coupled in series with the winding turns. For example,FIG.29is a cross-sectional view of a magnetic device2900including a resonant coil2901with integrated capacitance, andFIG.30is a cross-sectional view of device2900taken along30A-30A ofFIG.29. Magnetic device2900is similar to magnetic device2700ofFIG.27, but resonant coil2901of magnetic device2900has a series resonant topology. Resonant coil2900includes one or more first conductor layers2902, one or more second conductor layers2904, one or more third conductor layers2906, and one or more fourth conductor layers2907. First conductor layers2902are separated from second conductor layers2904in a widthwise2908direction. Third conductor layers2906are interdigitated with first conductor layers2902in the widthwise2908direction, and fourth conductor layers2907are interdigitated with second conductor layers2904in the widthwise2908direction. First conductor layers2902are electrically coupled in parallel to a first electrical terminal2910via a conductor2911, and second conductor layers2904are electrically coupled in parallel to a second electrical terminal2912via a conductor2913. Third conductor layers2906and fourth conductor layers2907are electrically coupled in parallel with each other via a conductor2915. Although not required, it is anticipated that third conductor layers2906and fourth conductor layers2907will typically be floating, i.e., not directly electrically connected to external circuitry. The number of first, second, third, and fourth conductor layers2902,2904,2906,2907may be varied without departing from the scope hereof. Each conductor layer2902,2904,2906,2907includes a two conductor sublayers2914separated from each other in the widthwise2908direction by a sublayer dielectric layer2916instance. Conductor sublayers2914are formed, for example, of conductive foil or film, which typically has a thickness smaller than its skin depth at an intended operating frequency. Adjacent conductor layers2902,2904,2906,2907are separated from each other in the widthwise2908direction by separation dielectric layers2918. Thus, conductor layers2902,2904,2906,2907and separation dielectric layers2918are stacked in an alternating direction in the widthwise2908direction. Only some instances of conductor sublayers2914, sublayer dielectric layers2916, and separation dielectric layers2918are labeled inFIGS.29and30to promote illustrative clarity. Within each conductor layer2902,2904,2906,2907instance, both conductor sublayers2914have approximately the same electrical potential at a given point along a length2920of resonant coil2900. Consequently, there is minimal electric field to excite capacitance between conductor sublayers2914within a given conductor layer2902,2904,2906,2907. Therefore, sublayer dielectric layers2916can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layers2916does not materially affect electrical properties of resonant coil2900, which allows further flexibility is selecting sublayer dielectric layers2916. There is significant electric field between first conductor layers2902and third conductor layers2906, as well as between second conductor layers2904and fourth conductor layers2907, during operation of resonant coil2900. Therefore, adjacent first conductor layers2902and third conductor layers2906form integrated capacitors, and adjacent second conductor layers2904and fourth conductor layers2907form integrated capacitors. Separation dielectric layers2918must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance, due to the significant electric field between conductor layers2902,2904,2906,2907during operation of resonant coil2900. Capacitance values can be adjusted during the design of resonant coil2900by varying size and/or separation of adjacent conductor layers2902,2904,2906,2907. Resonant coil2900optionally includes a magnetic core, such as magnetic core2922illustrated inFIG.29. Magnetic core2922is similar to magnetic core2220of device2200, and magnetic core2922includes a center post2924and a rectangular hollow outer element2926joined by opposing first and second end magnetic elements2928and2930in a thickness2932direction. In certain embodiments, magnetic core2922includes one or more openings (not shown) for first and second electrical terminals2910and2912to extend therethrough. Magnetic core2922could be modified without departing from the scope hereof. For example,FIG.31is a cross-sectional view analogous to that ofFIG.30of a magnetic device3100which is similar to magnetic device2900but with magnetic core2922replaced with a magnetic core3122. Magnetic core3132includes first and second end magnetic elements3128and3130, but magnetic core3132does not include a center post or a hollow outer magnetic element. FIG.32is a cross-sectional view of a magnetic device3200including a resonant coil3201with integrated capacitance. Magnetic device3200is similar to magnetic device2900ofFIG.29, but with third conductor layers3206in place of third and fourth conductor layers2906,2907ofFIG.29. Each third conductor layer3206is wound around a center axis3228of magnetic device3200such that (1) a first end of the third conductor layer is interdigitated with one or more first conductor layers2902in the widthwise2908direction, and (2) a second end of the third conductor layer is interdigitated with one or more second conductor layers2904in the widthwise2908direction. Thus, conductor layers2902,3206,2904and separation dielectric layers2918are stacked in an alternating direction in the widthwise2908direction. Each third conductor layer3206includes two conductor sublayers2914separated by a sublayer dielectric layer2916. Center axis3228extends in a thickness direction orthogonal to each of the widthwise2908direction and the lengthwise2920direction. FIG.33is a cross-sectional view of a magnetic device3300including a resonant coil3301with integrated capacitance. Magnetic device3300is another alternate embodiment of magnetic device2700ofFIG.27. Resonant coil3301includes one or more first conductor layers3302and one or more second conductor layers3304. First ends3306of first conductor layers3302are electrically coupled in parallel to an electrical terminal3308via an electrical conductor3310, and second ends3312of second conductor layers3304are electrically coupled in parallel to an electrical terminal3314via an electrical conductor3316. First conductor layers3302and second conductor layers3304are concentrically stacked around a center axis3314in an alternating manner, such that first and second conductor layers3302,3304are interdigitated. Center axis3314extends in a thickness direction orthogonal to each of the widthwise2908direction and the lengthwise2920direction. Separation dielectric layers3318separate adjacent conductor layers3302,3304. Each conductor layer3302,3304includes a two conductor sublayers3320separated from each other by a sublayer dielectric layer3322. Conductor sublayers3320are formed, for example, of conductive foil or film, which typically has a thickness smaller than its skin depth at an intended operating frequency. Only some instances of conductor sublayers3320, sublayer dielectric layers3322, and separation dielectric layers3318are labeled inFIG.33to promote illustrative clarity. Within each conductor layer3302,3304instance, there is minimal electric field to excite capacitance between conductor sublayers3320. Therefore, sublayer dielectric layers3322can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layers3322does not materially affect electrical properties of resonant coil3301, which further promotes flexibility in selecting sublayer dielectric layer3322material. There is significant electric field between first conductor layers3302and second conductor layers3304during operation of resonant coil3300. Therefore, capacitance between adjacent first and second conductor layers3302,3304forms integrated capacitance of resonant coil3301. Consequently, separation dielectric layers3318must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance of resonant coil3301. Capacitance values can be adjusted during the design of resonant coil3301by varying size and/or separation of conductor layers3302,3304. Device3300optionally includes a magnetic core, such as magnetic core3320, as illustrated. Magnetic core3320is similar to magnetic core2220of device2200, and magnetic core3320includes a center post3322and a hollow outer magnetic element3324joined by opposing first and second end magnetic elements (not shown). FIG.34is a cross-sectional view of a resonant coil3400, which is an alternate embodiment of resonant coil600(FIGS.6-8) and is configured to have a series-resonant electrical topology. The position of theFIG.34cross-section is analogous to that ofFIG.8. Resonant coil3400includes three conductor layers3408concentrically stacked in an alternating manner around a center axis3420in a thickness3404direction, with adjacent conductor layers3408separated from each other in the thickness direction by a separation dielectric layer606. Each conductor layer3408includes two instances of first conductor sublayer610separated in the thickness3404direction by a sublayer dielectric layer614. First conductor sublayers610could be replaced with second conductor sublayers612without departing from the scope hereof. Each first conductor sublayer610of conductor layer3408(1) is electrically coupled to an electrical terminal3450via a conductor3452. Similarly, each first conductor sublayer610of conductor layer3408(3) is electrically coupled to an electric terminal3454via a conductor3456. Conductor sublayers610of conductor layer3408(2) are electrically coupled together via a conductor3458. Conductors3452and3456are angularly aligned with respect to center axis3420, while conductor3458is angularly offset from conductors3452and3456with respect to center axis3420. There is minimal electric field between first conductor sublayers610within a given conductor layer3408, during operation of resonant coil3400. Consequentially, sublayer dielectric layers614can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layers614does not materially affect electrical properties of resonant coil3400, which further promotes flexibility in selecting sublayer dielectric layer614material. There is significant electric field between conductor layers3408during operation of resonant coil3400. Consequently, separation dielectric layers606must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance of resonant coil3400. Capacitance values can be adjusted during the design of resonant coil3400by varying size and/or separation of conductor layers3408. Although resonant coil3400is shown as including only three conductor layers3408to promote illustrative clarity, it is anticipated that resonant coil3400will typically have additional conductor layers3408. In such embodiments, conductor layers3408are electrically coupled to achieve a series resonant topology in a manner similar to that illustrated inFIG.29,32, or33. FIG.35is a cross-sectional view of a resonant coil3500, which is an alternate embodiment of resonant coil1700(FIGS.17-19) and is configured to have a series resonant topology. The position of theFIG.35cross-section is analogous to that ofFIG.19. Resonant coil3500includes two conductor layers3502concentrically stacked in an alternating manner around a common axis3504, with adjacent conductor layers3502separated from each other in a radial3514direction by separation dielectric layers3512. Radial direction3514is orthogonal to common axis3504, and common axis3504forms a loop around a center axis3506. Each conductor layer3502includes two instances of first conductor sublayer3508separated in the radial3514direction by a sublayer dielectric layer3513. Each first conductor sublayer3508of conductor layer3502(1) is electrically coupled to a terminal3550via a conductor3552. Similarly, each first conductor sublayer3508of conductor layer3502(2) is electrically coupled to a terminal3554via a conductor3556. There is minimal electric field between first conductor sublayers3508within a given conductor layer3502, during operation of resonant coil3500. Consequentially, sublayer dielectric layers3513can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layers3513does not materially affect electrical properties of resonant coil3500, which further promotes flexibility in selecting sublayer dielectric layer3513material. There is significant electric field between conductor layers3502during operation of resonant coil3500. Consequently, separation dielectric layers3512must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance of resonant coil3500. Capacitance values can be adjusted during the design of resonant coil3500by varying size and/or separation of conductor layers3502. Although resonant coil3500is shown as including only two conductor layers3502to promote illustrative clarity, it is anticipated that resonant coil3500will typically have additional conductor layers3502. In such embodiments, conductor layers3502are electrically coupled to achieve a series resonant topology in a manner similar to that illustrated inFIG.29,32, or33. FIG.36is a cross-sectional view of a resonant coil3600, which is an alternate embodiment of resonant coil2000(FIGS.20and21) configured to have a series resonant topology. The position of theFIG.36cross-section is analogous to that ofFIG.21. Resonant coil3600includes two conductor layers3602concentrically stacked in an alternating manner around a common axis3604, with adjacent conductor layers3602separated from each other in a radial3614direction by a separation dielectric layer3612. Radial direction3614is orthogonal to common axis3604, and common axis3604forms a loop around a center axis3606. Each conductor layer3602includes two instances of first conductor sublayer3608separated in the radial3614direction by a sublayer dielectric layer3613. Each first conductor sublayer3608of conductor layer3602(1) is electrically coupled to a terminal3650, and each first conductor sublayer3608of conductor layer3602(2) is electrically coupled to a terminal3652. There is minimal electric field between first conductor sublayers3608within a given conductor layer3602, during operation of resonant coil3600. Consequentially, sublayer dielectric layers3613can be formed of low-cost, industry standard dielectric materials having relatively high-loss, such as FR4 or polyimide, without negatively impacting performance Additionally, thickness of sublayer dielectric layers3613does not materially affect electrical properties of resonant coil3600, which further promotes flexibility in selecting sublayer dielectric layer3613material. There is significant electric field between conductor layers3602during operation of resonant coil3600. Consequently, separation dielectric layers3612must be formed of a low-loss dielectric material, such as PTFE, PFA, ETFE, FEP, polypropylene, polyethylene, polystyrene, glass, or ceramic, to achieve high performance of resonant coil3600. Capacitance values can be adjusted during the design of resonant coil3600by varying size and/or separation of conductor layers3602. Although resonant coil3600is shown as including only two conductor layers3602to promote illustrative clarity, it is anticipated that resonant coil3600will typically have additional conductor layers3602. In such embodiments, conductor layers3602are electrically coupled to achieve a series resonant topology in a manner similar to that illustrated inFIG.29,32, or33. New Magnetic Cores Applicant has additionally developed new magnetic cores and associated magnetic devices which help prevent lateral current crowding associated with conventional magnetic cores. These new magnetic cores do not completely enclose conductor layers wound in the magnetic cores, thereby promoting low cost, ease of manufacturing, and cooling of the conductor layers. To help appreciate these new magnetic cores, considerFIG.37which illustrates an axis-symmetric finite element analysis of a portion of a magnetic device3700including a multi-layer winding3702disposed in a conventional pot magnetic core3704. Pot magnetic core3704extends above multi-layer winding3702by a relatively small height3706to minimize a total height3708of magnetic device3700. Curves3710represent simulated magnetic field. Only two instances of curves3710are labeled inFIG.37to promote illustrative clarity. It is desired that the magnetic field be substantially parallel to multi-layer winding3702along a width3712of multi-layer winding3702to minimize inducement of eddy currents and resulting current crowding in multi-layer winding3702. However, the relatively small value of height3706causes the magnetic field to be significantly non-parallel to multi-layer winding3702near an edge3714of multi-layer winding3702, as illustratedFIG.37. Consequently, significant eddy currents may flow along a width3712of multi-layer winding, resulting in current crowding near edges of multi-layer winding3702, which increases effective resistance of the winding. Non-parallel magnetic field lines can increase effective resistance of a multi-layer winding significantly more than they can increase effective resistance of a single-layer winding because the additional layers of a multi-layer winding provide additional conductive paths for eddy currents to circulate. Consequentially, non-parallel magnetic field lines may be particularly detrimental to a magnetic device including multiple conductor layers. The new magnetic core cores developed cores developed by Applicant at least partially overcome the above-discussed drawbacks associated with conventional magnetic cores. In particular, the new magnetic cores include magnetic extensions which shape magnetic fields to help minimize eddy currents and associated current crowding in conductor layers disposed in the magnetic cores, without completely enclosing the conductor layers. FIGS.38-40illustrate a magnetic device3800including one embodiment of the new magnetic cores including magnetic extensions. In particular,FIG.38is a top plan view of magnetic device3800,FIG.39is a side elevational view of magnetic device3800, andFIG.40is a cross-sectional view of magnetic device3800taken along line40A-40A ofFIG.38. Magnetic device3800includes a magnetic core3802, a plurality of conductor layers3804, and one or more separation dielectric layers3818. Magnetic core3802includes an end magnetic element3806, a center post3808, a hollow outer magnetic element3810, an inner magnetic extension3812, and an outer magnetic extension3814. Center post3808is disposed on end magnetic element3806and extends away from end magnetic element3806in a thickness3816direction. Hollow outer magnetic element3810, which is concentric with center post3808, is also disposed on end magnetic element3806and extends away from end magnetic element3806in the thickness3816direction. Center post3808is disposed within hollow outer magnetic element3810, as seen when magnetic device3800is viewed cross-sectionally in the thickness3816direction. Each of inner magnetic extension3812and outer magnetic extension3814are concentric with center post3808. Outer magnetic extension3814is disposed between hollow outer magnetic element3810and center post3808, as seen when magnetic device3800is viewed cross-sectionally in the thickness3816direction. Inner magnetic extension3812is disposed between outer magnetic extension3814and center post3808, as seen when magnetic device3800is viewed cross-sectionally in the thickness3816direction Additionally, inner magnetic extension3812is separated from outer magnetic extension3814as seen when magnetic device3800is viewed cross-sectionally in the thickness3816direction. In certain embodiments, outer magnetic extension3814is attached to hollow outer magnetic element3810, and inner magnetic extension3812is attached to center post3808, as illustrated. However, in some other embodiments, outer magnetic extension3814is separated from hollow outer magnetic element3810by a gap, and/or inner magnetic extension3812is separated from center post3808by a gap. Magnetic core3802is formed, for example, of a ferrite magnetic material or a powder iron magnetic material. The lines separating the various elements of magnetic core3802are included to facilitate identification of the elements of magnetic core3802and do not necessarily represent discontinuities in magnetic core3802. Conductor layers3804are wound around center post3808, such that conductor layers3803are disposed, in the thickness3816direction, between (a) end magnetic element3806and (b) inner and outer magnetic extensions3812and3814. Separation dielectric layers3818separate adjacent conductor layers3804. Details of conductor layers3804and separation dielectric layers3818are not shown to promote illustrative clarity. In particular embodiments, separation dielectric layers3818and conductor layers3804are stacked in an alternating manner along a common axis3820extending in the thickness3816direction, such as in a manner similar to that illustrated inFIG.5,8, or34. In some other embodiments, separation dielectric layers3818and conductor layers3804are stacked around common axis3820such that separation dielectric layers3818and conductor layers3804are concentric with common axis3240, such as in a manner similar to that illustrated inFIG.25or27. Inner magnetic extension3812has an inner extension width3822orthogonal to the thickness3816direction, and outer magnetic extension3814has an outer extension width3824orthogonal to the thickness3816direction. Inner magnetic extension3812also has an inner extension height3828in the thickness3816direction, and outer magnetic extension3814has an outer extension height3830in the thickness3816direction. While not required, it is anticipated that inner extension width3822will typically be essentially equal to outer extension width3824, and that inner extension height3828will typically be equal to outer extension height3830, such that magnetic device3800has symmetrical geometry. Conductor layers3804are separated from magnetic core3802by a gap width3826. Inner magnetic extension3812and outer magnetic extension3814shape magnetic fields generated by current flowing through conductor layers3804to help achieve magnetic fields which are substantially parallel to conductor layers3804near edges of the conductor layers, thereby potentially significantly reducing current crowding associated with use of conventional magnetic cores. Applicant has determined that certain ratios of outer extension width3824to gap width3826may be particularly advantageous in some embodiments of magnetic device3800with symmetrical geometry. In particular,FIG.41is a graph of figure of merit (FoM) and Quality Factor (Q) as a function of the ratio of outer extension width3824to gap width3826in an embodiment of magnetic device3800where conductor layers3804include ten sections, the magnetic device has a total height of 3 millimeters, and the magnetic device has an overall diameter of 6.6 centimeters. FoM is equal to product of Q and coupling coefficient (k) associated with magnetic device3800. Vertical axis4102represents FoM, vertical axis4104represents Q, horizontal axis4106represents ratio of outer extension width3824to gap width3826, curve4108represents FoM, and curve4110represents Q. As evident fromFIG.41, FoM and Q each have peak values when ratio of outer extension width3824to gap width3826is about 1.5. The shape of magnetic device3800could be varied without departing from the scope hereof. For example, although hollow outer magnetic element3810and conductor layers3804are illustrated as having a ring-shape, these two elements could be modified to have a rectangular shape, as seen when magnetic device3800is viewed cross-sectionally in the thickness3816direction. As another example, the shape of center post3808could be changed from round to rectangular, as seen when magnetic device3800is viewed cross-sectionally in the thickness3816direction. FIG.42is a cutaway perspective view, andFIG.43is an exploded cutaway perspective view, of a magnetic device4200, which is one embodiment of magnetic device3800. Magnetic device4200includes an end magnetic element4206, a center post4208, a hollow outer magnetic element4210, an inner magnetic extension4212, and an outer magnetic extension4214, which are embodiments of end magnetic element3806, center post3808, hollow outer magnetic element3810, inner magnetic extension3812, and outer magnetic extension3814, respectively. Magnetic device4200additionally includes a plurality of conductor layers4204and a plurality of separation dielectric layers4218, which are embodiments of conductor layers3804and separation dielectric layers3818, respectively, stacked in an alternating manner in the thickness4216direction. Each conductor layer4204includes a respective first conductor sublayer4222, a sublayer dielectric layer4224, and second conductor sublayer4226, stacked in the thickness4216direction. Adjacent conductor layers4204are separated in the thickness4216direction by a separation dielectric layer4218. Each first conductor sublayer4222forms a first discontinuity or notch4228, and each second conductor sublayer4226forms a second discontinuity or notch4230. Only some instances of conductor layers4204, separation dielectric layers4218, first conductor sublayers4222, sublayer dielectric layers4224, second conductor sublayers4226, first notches4228, and second notches4230are labeled to promote illustrative clarity. Within a given conductor layer4204instance, first conductor sublayer4222is angularly aligned with second conductor sublayer4226with respect to common axis4220, such that notches4228,4230of first and second conductor sublayers4222,4226, respectively, are also angularly aligned. However, the plurality of conductor layers4204in magnetic device4200have alternating opposing orientations, where notches4228,4230of one conductor layer4204instance are angularly displaced from notches4228,4230of an adjacent conductor layer4204instance, with respect to common axis4220. FIGS.44-48illustrate a magnetic device4400including another embodiment of the new magnetic cores with magnetic extensions. In particular,FIG.44is a top plan view of a magnetic device4400,FIG.45is a side elevational view of a side4401of magnetic device4400as labeled inFIG.44,FIG.46is a side elevational view of a side4403of magnetic device4400as labeled inFIG.44,FIG.47is a cross-sectional view of magnetic device4400taken along line47A-47A ofFIG.45,FIG.48is a cross-sectional view of magnetic device4400taken along line48A-48A ofFIG.44, andFIG.49is a cross-sectional view of magnetic device4400taken along line49A-49A ofFIG.44. Magnetic device4400includes a magnetic core4402, one or more first conductor layers4404, one or more second conductor layers4405, one or more third conductor layers4407, and one or more separation dielectric layers4406. Separation dielectric layers4406separate adjacent conductor layers. Each third conductor layer4407is wound around a center axis4422of magnetic device4440such that (1) a first end of the third conductor layer is interdigitated with one or more first conductor layers4404in a widthwise4450direction, and (2) a second end of the third conductor layer is interdigitated with one or more second conductor layers4405in the widthwise4450. The widthwise direction is orthogonal to a thickness direction4420. Conductor layers4404,4405,4407and separation dielectric layers4406are stacked in an alternating direction in the widthwise4450direction. Each conductor layer4404,4405, and4407includes two conductor sublayers4444separated by a sublayer dielectric layer4446. First conductor layers4404are electrically by a conductor4409, and a first electrical terminal (not shown) is optionally electrically coupled to conductor4409. Second conductor layers4405are electrically by a conductor4411, and a second electrical terminal (not shown) is optionally electrically coupled to conductor4411. The first and second electrical terminals, when included, provide electrical interface to magnetic device4400. The number of conductor layers4404,4405, and4407and the number of separation dielectric layers4406may be varied without departing from the scope hereof. Conductor layers4404,4405, and4407are optionally separated from magnetic core4402by additional dielectric material4413. Magnetic core4402includes a first end magnetic element4408, a second end magnetic element4410, a first inner magnetic extension4412, a first outer magnetic extension4414, a second inner magnetic extension4416, and a second outer magnetic extension4418. First and second end magnetic elements4408and4410are separated from each other in a thickness4420direction by a separation distance4421. First inner magnetic extension4412is disposed on first end magnetic element4408and extends toward second end magnetic element4410, and first outer magnetic extension4414is disposed on first end magnetic element4408and extends toward second end magnetic element4410. Similarly, second inner magnetic extension4416is disposed on second end magnetic element4410and extends toward first end magnetic element4408, and second outer magnetic extension4418is disposed on second end magnetic element4410and extends toward first end magnetic element4408. First and second inner magnetic extensions4412and4416are collinear with a center axis4422extending in the thickness4420direction. First inner magnetic extension4412is separated from second inner magnetic extension4416in the thickness4420direction, and first outer magnetic extension4414is separated from second outer magnetic extension4418in the thickness4420direction. Magnetic core4402is formed, for example, of a ferrite magnetic material or a powder iron magnetic material. The lines separating the various elements of magnetic core4402are to facilitate identification of the elements and do not necessarily represent discontinuities in magnetic core4402. Conductor layers are separated about center axis4422by a first gap width4448in the widthwise direction4450. Additionally, conductor layers4404,4405, and4407are separated from magnetic core4402in the thickness4420direction by second gap thickness4449. Each of first and second inner magnetic extensions4412and4416has an inner extension width4452in the widthwise4450direction. Each of first and second outer magnetic extensions4414and4418has an outer extension height4454in the thickness4420direction. Inner magnetic extensions4412and4416and outer magnetic extensions4414and4418shape magnetic fields generated by current flowing through conductor layers4404,4405, and4407to help achieve magnetic fields which are substantially parallel to conductor layers4404,4405, and4407near edges of the conductor layers, thereby potentially significantly reducing current crowding associated with use of conventional magnetic cores. Applicant has found that configuring magnetic core4402such that (a) inner extension width4452is approximately equal to gap width4448and (b) outer gap height4454is approximately equal to second gap thickness4449may promote low effective resistance of conductor layers4404,4405, and4407. The configuration of conductor layers and/or separation dielectric layers in magnetic device4400may be varied without departing from the scope hereof. For example, in some alternate embodiments, the conductor layers and separation dielectric layers have respective configurations similar to the conductor layers and separation dielectric layers ofFIG.25,27,29, or33. For instance,FIG.50is a cross-sectional view analogous to theFIG.47cross-sectional view of a magnetic device5000which is like magnetic device4400but has a parallel-resonant electric topology instead of a series-resonant electrictopology. Magnetic device5000includes a plurality of conductor layers5004concentrically stacked around center axis4422, where each conductor layer5004includes a first conductor sublayer5005and a second conductor sublayer5007concentrically stacked around center axis4422. A separation dielectric layer5006separates each pair of adjacent conductor layers5004, and a sublayer dielectric layer5046separates adjacent first and second conductor sublayers5005,5007within each conductor layer5006. Each first conductor sublayer5005forms a first notch or discontinuity5015, and each second conductor sublayer5007forms a second notch or discontinuity5017. Although discontinuities5015and5017are illustrated as being filled with air, discontinuities5015and5017could be filled with another material, such as material forming sublayer dielectric layers5046or material forming separation dielectric layers5006, without departing from the scope hereof. Within each conductor layer5004instance, first and second discontinuities5015,5017are angularly aligned with respect to center axis4422, such that first and second conductor sublayers5005,5007have a common alignment. Conductor layers5004have alternating opposing orientations, to excite capacitance between adjacent tubular conductor layers and thereby achieve integrated capacitance of magnetic device5000. Magnetic device5000could include additional conductor layers5004without departing from the scope hereof. Returning toFIGS.44-48, the shape of magnetic device4400could be varied without departing from the scope hereof. For example, although magnetic device4400is illustrated as having a rectangular-shape as seen when viewed in the thickness4420direction, magnetic device4400could be modified to have a circular shape as seen when viewed in the thickness4420direction. As another example, magnetic core4402could be modified to include passageways, such as for electrical conductors to extend through magnetic core4402. For instance,FIG.51is a cross-sectional view analogous to theFIG.47cross-sectional view of a magnetic device5100which is like magnetic device4400but including a second outer magnetic extension5118in place of second outer magnetic extension4418. Second outer magnetic extension5118forms a passageway5119on a left side of magnetic device5100. Combinations of Features Features described above may be combined in various ways without departing from the scope hereof. The following examples illustrate some possible combinations:(A1) A resonant coil with integrated capacitance may include at least one separation dielectric layer and a plurality of conductor layers stacked in an alternating manner Each of the plurality of conductor layers includes a first conductor sublayer and second conductor sublayer having common orientation and a sublayer dielectric layer separating the first and second conductor sublayers. Adjacent conductor layers of the plurality of conductor layers have different orientations.(A2) In the resonant coil denoted as (A1), the at least one separation dielectric layer may be formed of a first material, the sublayer dielectric layer of each of the plurality of conductor layers may be formed of a second material, where the first material has a lower dielectric loss than the second material.(A3) In the resonant coil denoted as (A2), the second material may be selected from the group consisting of polyimide and FR4 epoxy fiberglass composite.(A4) In any one of the resonant coils denoted as (A1) through (A3), the at least one separation dielectric layer and the plurality of conductor layers may be concentrically stacked in an alternating manner around a common axis.(A5) In the resonant coil denoted as (A4), the common axis may form a loop around a center axis of the resonant coil, and the resonant coil may have a toroidal shape.(A6) In the resonant coil denoted as (A5), each first conductor sublayer may form a first discontinuity along the common axis, such that the first conductor sublayer does not completely encircle the center axis, each second conductor sublayer may form a second discontinuity along the common axis, such that the second conductor sublayer does not completely encircle the center axis, and within each of the plurality of conductor layers, each first discontinuity may be angularly aligned with each second discontinuity around the center axis.(A7) In the resonant coil denoted as (A5), each first conductor sublayer may form a first discontinuity, such that the first conductor sublayer does not completely encircle the common axis, each second conductor sublayer may form a second discontinuity, such that the second conductor sublayer does not completely encircle the common axis, and within each of the plurality of conductor layers, each first discontinuity may be angularly aligned with each second discontinuity around the common axis.(A8) In the resonant coil denoted as (A4), each first conductor sublayer may form a first discontinuity, such that the first conductor sublayer does not completely encircle the common axis, each second conductor sublayer may form a second discontinuity, such that the second conductor sublayer does not completely encircle the common axis, and within each of the plurality of conductor layers, each first discontinuity may be angularly aligned within each second discontinuity around the common axis.(A9) In the resonant coil denoted as (A8), the resonant coil may have a cylindrical shape, as seen when the resonant coil is viewed cross-sectionally along the common axis.(A10) In the resonant coil denoted as (A8), the resonant coil having a rectangular shape, as seen when the resonant coil is viewed cross-sectionally along the common axis.(A11) In any of the resonant coils denoted as (A1) through (A3), the at least one separation dielectric layer and the plurality of conductor layers may be stacked in an alternating manner in a thickness direction.(A12) In the resonant coil denoted as (A11), within each of the plurality of conductor layers, each of the first and second conductor sublayers may be a foil conductor having a C-shape, and the first conductor sublayer may be aligned with the second conductor sublayer, as seen when the resonant coil is viewed cross-sectionally in the thickness direction.(A13) In the resonant coil denoted as (A12), within each of the plurality of conductor layers, the first conductor sublayer may form a first notch, the second conductor sublayer may form a second notch, and the first notch may be angularly aligned with the second notch around a center axis extending in the thickness direction.(A14) In the resonant coil denoted as (A13), the first and second notches of a first conductor layer of the plurality of conductor layers may be angularly displaced with the first and second notches of a second conductor layer of the plurality of conductor layers, around the center axis.(B1) A resonant coil with integrated capacitance may include first and second terminals and at least one separation dielectric layer and a plurality of conductor layers stacked in an alternating manner in a first direction. Each of the plurality of conductor layers may include (a) a first conductor sublayer and second conductor sublayer and (b) a sublayer dielectric layer separating the first and second conductor sublayers in the first direction. At least one of the plurality of conductor layers may be electrically coupled to the first terminal, and at least one of the plurality of conductor layers may be electrically coupled to the second terminal, such that the resonant coil has a series-resonant electrical topology as seen from the first and second terminals.(B2) In the resonant coil denoted as (B1), within each of the plurality of conductor layers, the first and second conductor sublayer may be electrically coupled in parallel.(B3) In any one of the resonant coils denoted as (B1) and (B2), the at least one separation dielectric layer may be formed of a first material, and the sublayer dielectric layer of each of the plurality of conductor layers may be formed of a second material, where the first material has a lower dielectric loss than the second material.(B4) In the resonant coil denoted as (B3), the second material may be selected from the group consisting of polyimide and FR4 epoxy fiberglass composite.(B5) In any one of the resonant coils denoted as (B1) through (B4), the plurality of conductor layers may include (a) a plurality of first conductor layers, (b) a plurality of second conductor layers, (c) a plurality of third conductor layers interdigitated with the plurality of first conductor layers in the first direction, and (d) a plurality of fourth conductor layers interdigitated with the plurality of second conductor layers in the first direction. The plurality of third conductor layers may be electrically coupled in parallel with the plurality of fourth conductor layers.(B6) In any one of the resonant coils denoted as (B1) through (B4), the plurality of conductor layers may include (a) a plurality of first conductor layers, (b) a plurality of second conductor layers, and (c) a plurality of third conductor layers wound around a center axis of the resonant coil, the center axis being orthogonal to the first direction. Each of the plurality of third conductor layers may have a respective first end interdigitated with the plurality of first conductor layers in the first direction and a respective second end interdigitated with the plurality of second conductor layers in the second direction.(C1) A magnetic device may include a magnetic core and any one of the resonant coils denoted as (A1) through (A14) and (B1) through (B6).(D1) A magnetic device may include a magnetic core, including (a) an end magnetic element, (b) a center post extending away from the end magnetic element in a thickness direction, (c) a hollow outer magnetic element concentric with the center post and extending away from the end magnetic element in the thickness direction, and (d) an inner magnetic extension and an outer magnetic extension each concentric with the center post. Each of the inner magnetic extension and the outer magnetic extension may be disposed between the hollow outer magnetic element and the center post as seen when the magnetic device is viewed cross-sectionally in the thickness direction. The magnetic device may further include a plurality of conductor layers wound around the center post.(D2) In magnetic device denoted as (D1), the inner magnetic extension may be attached to the center post, and the outer magnetic extension may be attached to the hollow outer magnetic element.(D3) In any one of the magnetic devices denoted as (D1) and (D2), the outer magnetic extension may be separated from the inner magnetic extension, as seen when the magnetic device is viewed cross-sectionally in the thickness direction.(D4) In any one of the magnetic devices denoted as (D1) through (D3), the plurality of conductor layers may be disposed, in the thickness direction, between (a) the end magnetic element and (b) the inner and outer magnetic extensions.(D5) In any one of the magnetic devices denoted as (D1) through (D4), the hollow outer magnetic element may have a shape selected from the group consisting of a circular shape and a rectangular shape, as seen when the magnetic device is viewed cross-sectionally in the thickness direction.(D6) Any one of the magnetic devices denoted as (D1) through (D5) may further include least one separation dielectric layer, where the at least one separation dielectric layer and the plurality of conductor layers stacked in an alternating manner around a common axis extending in the thickness direction.(D7) In the magnetic device denoted as (D6), each of the plurality of conductor layers may include a first conductor sublayer and second conductor sublayer having common orientation and a sublayer dielectric layer separating the first and second conductor sublayers. Adjacent conductor layers of the plurality of conductor layers may have different orientations.(D8) In the magnetic device denoted as (D6), each of the at least one separation dielectric layer and the plurality of conductor layers may be concentric with respect to the common axis.(D9) In the magnetic device denoted as (D6), the at least one separation dielectric layer and the plurality of conductor layers may be stacked in an alternating manner in the thickness direction.(E1) A magnetic device may include a magnetic core, including (a) first and second end magnetic elements separated from each other in a first direction, (b) a first inner magnetic extension disposed on the first end magnetic element and extending toward the second end magnetic element, (c) a first outer magnetic extension disposed on the first end magnetic element and extending toward the second end magnetic element, (d) a second inner magnetic extension disposed on the second end magnetic element and extending toward the first end magnetic element, and (e) a second outer magnetic extension disposed on the second end magnetic element and extending toward the first end magnetic element. The magnetic device may further include plurality of conductor layers disposed, as seen when the magnetic device is viewed cross-sectionally in the first direction, (a) outside of the first and second inner magnetic extensions and (b) inside the first and second outer magnetic extensions.(E2) In the magnetic device denoted as (E1), the first and second inner magnetic extensions may be collinear with a common axis extending in the first direction, and the plurality of conductor layers may be wound around the common axis.(E3) In the magnetic device denoted as (E2), the first inner magnetic extension may be separated from the second inner magnetic extension in the first direction, and the first outer magnetic extension may be separated from the second outer magnetic extension in the first direction.(E4) Any one of the magnetic devices denoted as (E2) and (E3) may further include at least one separation dielectric layer, where the at least one separation dielectric layer and the plurality of conductor layers stacked in an alternating manner around a common axis extending in the first direction.(E5) In the magnetic device denoted as (E4), each of the plurality of conductor layers may include a first conductor sublayer and second conductor sublayer having common orientation and a sublayer dielectric layer separating the first and second conductor sublayers. Adjacent conductor layers of the plurality of conductor layers may have different orientations.(E6) In the magnetic device denoted as (E5) each of the at least one separation dielectric layer and the plurality of conductor layers may be concentric with respect to the common axis. Changes may be made in the embodiments disclosed above without departing from the scope hereof. It should thus be noted that the matter contained in the above description and shown in the accompanying drawings should be interpreted as illustrative and not in a limiting sense. The following claims are intended to cover generic and specific features described herein, as well as all statements of the scope of the present method and system, which, as a matter of language, might be said to fall therebetween. | 98,144 |
11862379 | DESCRIPTION OF THE SYMBOLS 10Drum core12Winding shaft14a,14bFlange part15a,15bInner face17aOuter face16Center18Center20Axial center22to28Side face32to38Side face40Coil42Winding part44a,44bLead part46Conductive wire50Exterior resin60a,60bExternal electrode80Circuit board82Electrode84Solder100,200Coil component300Electronic device DETAILED DESCRIPTION OF EMBODIMENTS Examples of the present invention are explained below by referring to the drawings. Example 1 First, the coil component in a comparative example is explained.FIG.1Ais a perspective plane view of the coil component pertaining to the comparative example, andFIG.1Bis a perspective side view ofFIG.1Afrom direction A. As shown inFIGS.1A and1B, the coil component500in the comparative example comprises a drum core510and a coil540. The drum core510includes a winding shaft512, and flange parts514a,514bprovided at both ends of the winding shaft512. The axial center of the winding shaft512corresponds to the centers of the inner faces515a,515b, on which the winding shaft512is provided, of the flange parts514a,514b. Here, the “inner faces515a,515b” include the parts where the winding shaft512is provided. The centers of the inner faces515a,515bof the flange parts514a,514brepresent the centroids of the inner faces515a,515bof the flange parts514a,514b, for example. In one example, the inner faces515a,515bof the flange parts514a,514bare quadrilaterals, in which case their centroids are each a point of intersection between the two diagonal lines. The coil540includes a winding part542constituted by a conductive wire being wound around the winding shaft512, and lead parts544a,544bthat are parts of the conductive wire being led out from the winding part542. The lead parts544a,544bare bent toward the flange part514a, and connected to external electrodes560a,560bthat are provided on an outer face517a, which is the face opposite the inner face515a, of the flange part514a. Since the axial center of the winding shaft512corresponds to the center of the inner face515aof the flange part514a, the shortest distance L2between the outermost periphery of the winding part542and the side face of the flange part514atoward which the lead parts544a,544bthat have been led out in one direction are bent, is equal to the shortest distance L1between the outermost periphery of the winding part542and the side face of the flange part514aopposite the direction in which the lead parts544a,544bare led out. The coil540is covered by an exterior resin550provided around the drum core510. The coil component500in the comparative example is such that the lead parts544a,544bare led out from the winding part542to project outward beyond the flange parts514a,514b, after which the lead parts544a,544bare bent toward the flange part514a. When the lead parts544a,544bare led out from the winding part542to project outward beyond the flange parts514a,514b, the elasticity of the conductive wire may cause the winding in the winding part542to loosen. Especially in recent years, the trend is to use rectangular wires and other conductive wires of greater thickness, and also to use alpha-winding and other structures where the conductive wire is wound by applying hardly any force in the bending direction, which affects the wound condition in the winding part542and makes this part particularly vulnerable to loosening. This can lead to deterioration in the inductance and other electric properties. FIGS.2A and2Bare perspective plane views of the coil component pertaining to Example 1.FIG.2Ais a perspective plane view from the side opposite the mounting face, whileFIG.2Bis a perspective plane view from the mounting face side.FIG.3Ais a perspective side view ofFIG.2Afrom direction A,FIG.3Bis a view of cross-section B-B inFIG.2A, andFIG.3Cis a view of cross-section C-C inFIG.2A. As shown in FIGS.2A,2B, and3A to3C, the coil component100in Example 1 is an inductor element comprising a drum core10, a coil40, an exterior resin50, and a pair of external electrodes60a,60b. The drum core10includes a winding shaft12, as well as a flange part14abeing a first flange part, and a flange part14bbeing a second flange part, which together constitute a pair of flange parts provided at both ends of the winding shaft12in the axial direction. The winding shaft12has a columnar shape whose bottom face is defined by straight lines and two arcs. The flange part14abeing the first flange part has four side faces including a side face22being a first side face, a side face24being a second side face which is the face opposite the side face22across the winding shaft12, a side face26, and a side face28. The flange part14bbeing the second flange part has four side faces including a side face32being a third side face, a side face34being a fourth side face which is the face opposite the side face32across the winding shaft12, a side face36, and a side face38. The bottom face of the winding shaft12has a length of approx. 1.40 mm in the long direction, and a length of approx. 0.60 mm in the short direction. The winding shaft12has a height of approx. 0.50 mm. It should be noted that preferably the value AB obtained by dividing the long-direction length A, by the short-direction length B, of the bottom face of the winding shaft12, is 1.1 or greater but no greater than 2.6. The flange parts14a,14bare each shaped as a prism having thickness in the axial direction of the winding shaft12. For example, the flange parts14a,14bare each shaped as a quadrangular prism. The bottom faces of the flange parts14a,14bhave a length of approx. 2.0 mm in the long direction, and a length of approx. 1.20 mm in the short direction. The flange parts14a,14bhave a thickness of approx. 0.15 mm. The flange parts14a,14bare shaped as rectangles of roughly the same size in a plane view from the axial direction of the winding shaft12, and the centers16,18of these rectangles roughly correspond to each other in the axial direction of the winding shaft12. It should be noted that “roughly the same” and “roughly correspond” include deviations within manufacturing errors or so. The winding shaft12is provided in the flange part14aat a position offset, in the short direction of the flange part14a, from the center16of the inner face15aof the flange part14aon which the winding shaft12is provided, and also provided in the flange part14bat a position offset, in the short direction of the flange part14b, from the center18of the inner face15bof the flange part14bon which the winding shaft12is provided. In other words, the axial center20of the winding shaft12is positioned in a manner offset from the center16of the inner face15aof the flange part14aon which the winding shaft12is provided, toward one side face22between the pair of side faces22,24that are facing each other in the short direction, and also positioned in a manner offset from the center18of the inner face15bof the flange part14bon which the winding shaft12is provided, toward one side face32between the pair of side faces32,34that are facing each other in the short direction. It should be noted that the inner faces15a,15binclude the parts where the winding shaft12is provided. The side face22of the flange part14a, and the side face32of the flange part14b, are positioned on the same side of the winding shaft12and roughly flush with each other. The drum core10is formed by a magnetic material. The drum core10is formed by, for example, a ferrite material, magnetic metal material, or resin containing magnetic metal grains. For example, the drum core10is formed by a Ni—Zn or Mn—Zn ferrite, Fe—Si—Cr, Fe—Si—Al, Fe—Si—Cr—Al, or other soft magnetic alloy, Fe, Ni, or other magnetic metal, amorphous magnetic metal, nanocrystal magnetic metal, or resin containing metal magnetic grains. If the drum core10is formed by a soft magnetic alloy, magnetic metal, amorphous magnetic metal, or nanocrystal magnetic metal, its grains may be insulation-treated. The coil40includes a winding part42constituted by a conductive wire46being wound around the winding shaft12of the drum core10, and a pair of lead parts44a,44bthat represent both ends of the conductive wire46and are led out from the winding part42. The conductive wire46is a rectangular wire whose cross-section has a rectangular shape, for example, but it may be something else such as a round wire whose cross-section has a circular shape. The conductive wire46has a width W of approx. 0.02 mm to 0.2 mm, for example, and a thickness T of approx. 0.02 mm to 0.2 mm, for example. The conductive wire46has its metal wire surface covered with an insulating film. Examples of materials for the metal wire include copper, silver, palladium, silver-palladium alloy, etc., while examples of materials for the insulating film include polyester imide, polyamide, etc. The coil40is such that the conductive wire46, which is a rectangular wire, is alpha-wound around the winding shaft12of the drum core10, for example; however, it may be wound by other winding methods. The lead parts44a,44bare led out toward the side face22of the flange part14aand toward the side face32of the flange part14b, respectively. To shorten the distance between the outermost periphery of the winding part42on the side to which the lead parts44a,44bare led out, and the side face22of the flange part14a, the axial center20of the winding shaft12is set in a manner offset from the center16of the inner face15aof the flange part14aon which the winding shaft12is provided. This way, the relationship of L3>L4holds between the shortest distance L4, between the outermost periphery of the winding part42and the side face22of the flange part14atoward which the lead parts44a,44bthat have been led out in one direction are bent, and the shortest distance L3, between the outermost periphery of the winding part42and the side face24of the flange part14aopposite the direction in which the lead parts44a,44bare led out. In other words, the shortest distance L4between the outermost periphery of the winding part42and the side face22of the flange part14atoward which the lead parts44a,44bare bent, is shorter than the shortest distance L3between the outermost periphery of the winding part42and the side face24of the flange part14aopposite the side face22. In the example ofFIG.2B, the outermost periphery of the winding part42, and the side face22of the flange part14atoward which the lead parts44a,44bthat have been led out in one direction are bent, roughly correspond to each other over a distance that prevents winding of the conductive wire46by one more loop; that is, over a distance equal to or smaller than the thickness of the conductive wire46in the direction vertical to the axial center20of the winding shaft12. This means that the distance between the outermost periphery of the winding part42and the side face22of the flange part14ais designed the smallest with respect to the maximum dimension of the winding part42that considers winding variation, which makes this an ideal example of the relationship of L3>L4where L4is even smaller. The lead parts44a,44bare bent toward the flange part14aalong the side face22of the flange part14a, and connected to a pair of external electrodes60a,60bthat are provided on the outer face17a, opposite the inner face15aon which the winding shaft12is provided, of the flange part14a. This way, the coil40is electrically connected to the external electrodes60a,60b. The external electrodes60a,60bare each formed by, for example, a multi-layer metal film constituted by a solder barrier layer and a solder wetting layer, provided in this order on a base layer. Examples of materials for the base layer include copper, silver, palladium, silver-palladium alloy, etc. Examples of materials for the solder barrier layer include nickel. Examples of materials for the solder wetting layer include tin, lead, tin-lead alloy, silver, copper, zinc, etc. The winding part42is roughly flush with the side faces22,32on the side face22side of the flange part14aand on the side face32side of the flange part14b, but on the sides of the side faces24,26,28, other than the side face22, of the flange part14a, and also on the sides of the side faces34,36,38, other than the side face32, of the flange part14b, the winding part42stays on the inner side of these side faces. The difference (X1−X2) between the distance X1between the side face24of the flange part14aand the winding shaft12, and the distance X2between the side face22of the flange part14aand the winding shaft12, is equal to or greater than the thickness T of the conductive wire46(T (X1−X2)). Similarly, the difference (X3−X4) between the distance X3between the side face34of the flange part14band the winding shaft12, and the distance X4between the side face32of the flange part14band the winding shaft12, is equal to or greater than the thickness T of the conductive wire46(T (X3−X4)). In other words, the axial center20of the winding shaft12is offset, by roughly an equivalent of the thickness T of the conductive wire46, from the center16of the inner face15aof the flange part14awhere the winding shaft12is provided, and from the center18of the inner face15bof the flange part14bwhere the winding shaft12is provided, toward the side face22of the flange part14aand toward the side face32of the flange part14b, respectively. The exterior resin50is provided between the flange parts14a,14bin a manner covering the winding part42of the coil40. Furthermore, the exterior resin50may be provided along the side face22of the flange part14ain a manner covering the lead parts44a,44bthat have been bent toward the flange part14a. For example, the exterior resin50is provided between the flange parts14a,14bin a manner completely covering the periphery of the winding part42of the coil40, but it only needs to be provided at least partially between the flange parts14a,14b. Preferably on any one or all of the side faces24,26,28of the flange part14aand the side faces34,36,38of the flange part14b, the exterior resin50does not project outward beyond, but stays on the inner side of, the side faces excluding the side face22of the flange part14aand the side face32of the flange part14b. On the side face22side of the flange part14aand on the side face32side of the flange part14b, the exterior resin50projects outward beyond the side face22of the flange part14aand the side face32of the flange part14band covers the lead parts44a,44b. The exterior resin50is formed by, for example, a resin containing magnetic grains (such as a ferrite material, magnetic metal material, or insulating resin, such as epoxy resin, containing magnetic metal grains, etc.). Here, projecting outward beyond a side face of a flange part means the exterior resin exists in the outward direction beyond the side face of the flange part, where the outward direction represents the direction from the axial center of the winding shaft of the coil component toward the side face of the flange part. For example, the projecting exterior resin, by covering the side face of the flange part, can constitute a part of the outer configuration of the coil component. Next, a method for manufacturing the coil component100in Example 1 is explained. First, a drum core10is formed using dies. Next, a conductive wire46is wound around the winding shaft12of the drum core10, while both ends of the conductive wire46are bent, to form a coil40that includes a winding part42where the wire is wound around the winding shaft12, and lead parts44a,44bthat are led out from the winding part42and bent toward the flange part14a. Next, a tray having multiple recessed storage parts is prepared, and a drum core10in which a coil40has been formed is placed in each of the multiple storage parts. Here, each drum core10is placed in a storage part with its flange part14afacing up. Next, a resin is applied over the tray to form an exterior resin50covering the coils40. Next, the exterior resin50, and the tray, are ground from the top face side and bottom face side of the tray, to expose the flange part14a,14bsurfaces of the drum cores10. Next, external electrodes60a,60bto be connected to the lead parts44a,44bof the coils40are formed on the flange part14asurfaces using the printing method, etc. Thereafter, the multiple storage parts are separated into individual pieces using a dicer, etc., to form coil components100according to Example 1. Loosening of winding in the winding part42that can occur when the lead parts44a,44bare led out from the winding part42and bent toward the flange part14a, can be reduced by shortening the distance from the part of the winding part42from which the lead parts44a,44bare led out, to the side face22of the flange part14atoward which the lead parts44a,44bare bent. When this distance is short, the location clamped by the bending jig to perform bending can be set closer to the winding part42, which reduces loosening of winding in the winding part42and also improves the bending accuracy. In the comparative example, the bending jig must be placed in the limited space between the flange part514aand the flange part514b; in Example 1, on the other hand, the bending jig can be placed not only between the flange part14aand the flange part14b, but also on the side face22side of the flange part14aby avoiding contact with the flange part14a, and therefore the bending accuracy can be improved with ease. In the comparative example, the shortest distance L2between the side face of the flange part514atoward which the lead parts544a,544bare led out and the outermost periphery of the winding part542, is equal to the shortest distance L1between the opposite side face of the flange part514aacross the axial center of the winding shaft512toward which the lead parts544a,544bare not led out and the outermost periphery of the winding part542(L2=L1). According to Example 1, on the other hand, the shortest distance L4between the side face22of the flange part14atoward which the lead parts44a,44bare led out and the outermost periphery of the winding part42, is shorter than the shortest distance L3between the side face24, which is the face opposite the side face22across the axial center of the winding shaft12, of the flange part14a, and the outermost periphery of the winding part42(L3>L4), as shown inFIG.2B. This means that, in Example 1, the distance from the part of the winding part42from which the lead parts44a,44bare led out, to the side face22of the flange part14atoward which the lead parts44a,44bare bent, can be shortened, which in turn prevents loosening of winding in the winding part42. As a result, dropping of the inductance can be prevented. As shown inFIG.2B, preferably the shortest distance L4between the side face22of the flange part14aand the outermost periphery of the winding part42is equal to or smaller than the thickness of the conductive wire46in the direction vertical to the axial center of the winding shaft12. In other words, the shortest distance between the side face22of the flange part14aand the outermost periphery of the winding part42represents a distance that prevents winding of the conductive wire46by one more loop. In essence, the shortest distance L4between the side face22of the flange part14aand the outermost periphery of the wound part42, roughly corresponds to a distance equal to or smaller than the thickness of the conductive wire46in the direction vertical to the axial center20of the winding shaft12. As a result, the distance from the part of the winding part42from which the lead parts44a,44bare led out, to the side face22of the flange part14atoward which the lead parts44a,44bare bent, becomes shorter and therefore loosening of winding in the winding part42can be prevented effectively. In the interest of effectively preventing loosening of winding in the winding part42, preferably the side face22of the flange part14aroughly corresponds to the outermost periphery of the winding part42, which means L4≈0, as shown inFIG.2B. This way, the distance from the part of the winding part42from which the lead parts44a,44bare led out, to the side face22of the flange part14atoward which the lead parts44a,44bare bent, can be shortened. The shorter the distance from the part of the winding part42from which the lead parts44a,44bare led out, to the side face22of the flange part14atoward which the lead parts44a,44bare bent, the further prevented is loosening of winding in the winding part42which may otherwise occur due to the elasticity of the conductive wire46, and therefore L4=0 is more preferable. Also, a rectangular wire or other conductive wire having a thick cross-section in the direction vertical to the axial center20of the winding shaft12may be used for the conductive wire46that constitutes the coil40, or alpha-winding or other structure that allows the conductive wire46to be wound by applying hardly any force in the bending direction may be used, in which case the elasticity of the conductive wire46may increase. In these cases, however, adopting a structure that achieves the relationship of L3>L4prevents loosening of winding in the winding part42when the lead parts44a,44bare led out from the winding part42, which can consequently prevent the inductance from deteriorating. It is clear fromFIG.2Bthat, to shorten the distance L4between the outermost periphery of the winding part42on the side toward which the lead parts44a,44bare led out and the side face22of the flange part14a, preferably the axial center20of the winding shaft12is set in a manner offset from the center16of the inner face15aof the flange part14a. Preferably, as shown inFIG.2A, the shortest distance L6between the side face32of the flange part14bwhich is the side toward which the lead parts44a,44bare led out and the outermost periphery of the winding part42is shorter than the shortest distance L5between the side face34opposite the side face32of the flange part14bwith respect to the winding shaft12and the outermost periphery of the winding part42. This way, the winding part42on the side face32side of the flange part14bbecomes closer to the side face32, and consequently the jig for bending the lead parts44a,44btoward the flange part14acan be placed by avoiding contact with the flange part14aor the flange part14b, and this, in turn, permits easy, accurate bending of the lead parts44a,44btoward the flange part14a. Because there is no need to consider the possibility of the bending jig making contact, the bending jig can be given more degrees of freedom and bending can be performed by factoring in return movements, and this, in turn, permits accurate formation of the lead parts44a,44b. With regard to the winding shaft12, preferably the axial center20is offset from the center16of the inner face15a, toward the side face22, of the flange part14a, and also from the center18of the inner face15b, toward the side face32, of the flange part14b. The side face22of the flange part14aand the side face32of the flange part14bare positioned on the same side of the winding shaft12. Because the axial center20is offset this way, the drum core10can be easily aligned in the same orientation by detecting how much the axial center20is offset. When a coil40is subsequently formed in the orientationally aligned drum core10, the shortest distance L4between the side face22of the flange part14aand the outermost periphery of the winding part42can be made shorter, while the shortest distance L6between the side face32of the flange part14band the outermost periphery of the winding part42can also be made shorter. Here, a coil40and lead parts44a,44bcan be produced easily by, for example, using a round conductive wire with a spindle or flyer, or a rectangular wire that has been alpha-wound, and by combining a conventional winding method with a conventional bending jig. Furthermore, this ability to accurately form lead parts44a,44balso helps prevent loosening of winding in the winding part42. As shown inFIGS.3B and3C, preferably an exterior resin50is provided which covers the coil40and is formed by a resin containing magnetic grains. And, preferably the exterior resin50covers the lead parts44a,44bon the side face22side of the flange part14a, and on the side face22of the flange part14a, the exterior resin50projects outward beyond the side face22of the flange part14a. This way, magnetic flux leakage can be effectively prevented and the electrical properties can be improved. Also, the exterior resin50secures the lead parts44a,44bin place, to protect the conductive wire. As shown inFIGS.3B and3C, preferably the minimum value T1of the thickness of the exterior resin50covering the lead parts44a,44bon the side face22side of the flange part14a, is greater than the minimum values T2, T3, T4of the thickness of the exterior resin50covering the winding part42on the side face24,26,28sides of the flange part14a. It should be noted that, here, the “thickness of the exterior resin50” refers to the thickness in the direction perpendicular to the axial center20of the winding shaft12, and represents the length dimension from the outermost periphery surface of the conductive wire46(including the lead parts44a,44b) to the surface of the exterior resin50, as measured in the direction perpendicular to the axial center20of the winding shaft12. In general, the minimum value of the thickness of the exterior resin on a side face of a flange part corresponds to the thickness in a direction which, among other directions perpendicular to the axial center of the winding shaft, also intersects at right angles the side face of the flange part. By increasing the thickness of the exterior resin50covering the lead parts44a,44b, magnetic flux leakage can be effectively prevented and the electrical properties can be improved. FIG.4shows the result of a simulation evaluating the relationship between the thickness of the exterior resin covering the lead parts, and the inductance. The horizontal axis inFIG.4represents the minimum value T1of the thickness of the exterior resin50covering the lead parts44a,44b(refer toFIG.3B). The vertical axis inFIG.4represents the rate of change in inductance, calculated by dividing the amount of change (ΔL) between the inductance L0when no exterior resin50is provided and the inductance Lt after an exterior resin50of thickness t has been provided (ΔL=Lt−L0), by the inductance Lt (ΔL/Lt). The simulation assumes that the drum core10is formed by a magnetic material with a specific magnetic permeability of 35, and that the exterior resin50is formed by a combined resin and magnetic material with a specific magnetic permeability of 28. As for the structure of the coil40, the conductive wire46from which it is formed, is assumed to be a copper wire whose surface is covered with polyimide. It is clear fromFIG.4that a higher inductance can be achieved by making the exterior resin50covering the lead parts44a,44bthicker. This is probably because, as the exterior resin50becomes thicker, it serves as a more effective magnetic path to reduce the magnetic field disturbances generating in the coil40as a whole due to generation of magnetic fluxes by the lead parts44a,44bin directions different from those of the magnetic fluxes generating in the winding part42of the coil40. It is also shown that the rate of change (rate of increase) in the inductance value compared to when the thickness of the exterior resin50is 0 mm, becomes small, smaller, and even smaller when the minimum value T1of the thickness of the exterior resin50is 0.2 mm or greater, 0.3 mm or greater, and 0.4 mm or greater, respectively. It should be noted that, even when materials other than those assumed by the simulation are used, similar results are still obtained regarding the thickness of the exterior resin50. In other words, this simulation is only an example and the magnetic permeabilities assumed therein only represent examples of magnetic permeabilities achieved when the aforementioned general magnetic material and resin material are used. Within the ranges of magnetic permeabilities achieved when the aforementioned general magnetic material and resin material are used, largely similar results are obtained regarding the thickness of the exterior resin50. For example, the simulation assumes that the drum core10has a specific magnetic permeability of 35, but when designing a coil component meeting higher performance requirements, the specific magnetic permeability of the drum core10must be higher than 35, in which case the obtained results are still similar. Furthermore, the simulation assumes that the exterior resin has a specific magnetic permeability of 28, but if the thickness of the exterior resin50is 0 mm, the magnetic permeability of the air in this area is used in place of the magnetic permeability of the exterior resin50. Considering that the magnetic permeability of this air is 1, the magnetic permeability of the exterior resin50only needs to be at least several times higher, and even higher performance can be achieved when the ratio of the magnetic permeability of the exterior resin50to the magnetic permeability of the drum core10is 0.5 or greater. Accordingly, the minimum value T1of the thickness of the exterior resin50covering the lead parts44a,44bis preferably 0.2 mm or greater, or more preferably 0.3 mm or greater, or even more preferably 0.4 mm or greater. In the interest of making the coil component100smaller, on the other hand, the minimum value T1of the thickness of the exterior resin50covering the lead parts44a,44bis preferably 0.6 mm or smaller, or more preferably 0.5 mm or smaller, or even more preferably 0.4 mm or smaller. As shown inFIGS.2A and2B, preferably the winding part42of the coil40stays between the flange parts14a,14band does not project outward beyond the side face22of the flange part14aor the side face32of the flange part14b. Because the magnetic permeabilities of the flange parts14a,14bare higher than the magnetic permeability of the exterior resin50, the fact that the winding part42stays between the flange parts14a,14bserves to improve the inductance and other electrical properties. As shown inFIGS.3B and3C, preferably on the side face22side of the flange part14aand on the side face32side of the flange part14b, the exterior resin50projects outward beyond the side face22of the flange part14aand the side face32of the flange part14b. On the other hand, preferably on at least one side face among the side faces24,26,28, excluding the side face22, of the flange part14a, the exterior resin50does not project outward beyond the side face22of the flange part14aor the side face32of the flange part14b, but stays between the flange parts14a,14binstead. This way, magnetic flux leakage can be prevented to prevent drop in inductance, while the component size can be reduced at the same time. As shown inFIG.2B, the difference (X1−X2) between the distance X1between the side face24of the flange part14aand the winding shaft12, and the distance X2between the side face22of the flange part14aand the winding shaft12, is equal to or greater than the thickness T of the conductive wire46that constitutes the coil40; preferably, however, it is roughly the same as the thickness T of the conductive wire46that constitutes the coil40. Similarly, as shown inFIG.2A, the difference (X3−X4) between the distance X3between the side face34of the flange part14band the winding shaft12, and the distance X4between the side face32of the flange part14band the winding shaft12, is equal to or greater than the thickness T of the conductive wire46that constitutes the coil40; preferably, however, it is roughly the same as the thickness T of the conductive wire46that constitutes the coil40. This way, the coil component100can be made smaller, and the lead parts44a,44bcan also be bent toward the flange part14a. It should be noted that “roughly the same” includes deviations within manufacturing errors or so, or specifically errors of approx. 10% to 20%, for example. As shown inFIGS.2B and3C, preferably the external electrodes60a,60bare not provided on, among the surfaces of the coil component100, the surfaces other than those that include the outer face17awhich is the face opposite the inner face15aof the flange part14aon which the winding shaft12is provided. This outer face17amay be partially recessed or projecting, or its corners and sides may be tapered or rounded. By thus providing the external electrodes60a,60bonly on the surfaces that include the outer face17aof the flange part14a, among the surfaces of the coil component100, the coil component100can be made smaller. Additionally, this prevents the coil component100from shorting with components adjacent to it when mounted on a circuit board, etc., which permits high-density mounting. As shown inFIGS.2A and2B, the winding shaft12has a cross-section shape defined by straight lines and two arcs in a plane view from the axial direction. In other words, the cross-section of the winding shaft12in contact with the inner faces15a,15bof the flange parts14a,14bhas a shape defined by straight lines and two arcs. It should be noted, however, that this is not the only case.FIGS.5A to5Dare plane views showing other cross-section shapes of the winding shaft. As shown inFIG.5A, the winding shaft12may have an oval shape cross-section in a plane view from the axial direction. As shown inFIG.5B, the winding shaft12may have a circular shape cross-section in a plane view from the axial direction. As shown inFIG.5C, the winding shaft12may have an oblong, square, or other rectangular shape cross-section in a plane view from the axial direction. As shown inFIG.5D, the winding shaft12may have a rectangular shape cross-section in a plane view from the axial direction, where a pair of sides facing each other are projecting outward. FIG.3Dis a perspective side view of a variation of the coil component pertaining to Example 1, which has the same configurations as those described in Example 1 except that the second flange is eliminated, wherein a drum core10′ is constituted by the winding shaft12and the first flange part14awithout the second flange part14b, and an exterior resin50′ fully occupies the portion occupied by the second flange part14b. A coil component without a second flange part exhibits excellent effects substantially similar to those described above in relation to the coil component of Example 1. Example 2 FIG.6is a cross-sectional view of the coil component pertaining to Example 2. It should be noted thatFIG.6is a cross-sectional view of a location corresponding to B-B inFIG.2Aillustrating Example 1. In Example 1, the flange parts14a,14bare shaped as rectangles of roughly the same size in a plane view from the axial direction of the winding shaft12, and the centers16,18of these rectangles roughly correspond to each other in the axial direction of the winding shaft12. As shown inFIG.6, however, the coil component200in Example 2 is such that the flange parts14a,14bare shaped as rectangles of different sizes in a plane view from the axial direction of the winding shaft12, and the centers16,18of these rectangles do not correspond to each other in the axial direction of the winding shaft12. The axial center20of the winding shaft12is offset from the center16of the inner face15aon which the winding shaft12is provided, toward the side face22, of the flange part14a. On the other hand, the axial center20of the winding shaft12corresponds to the center18of the inner face15bon which the winding shaft12is provided, of the flange part14b, or the axial center20of the winding shaft12is offset by an amount different from the amount of offset from the center16of the inner face15aon which the winding shaft12is provided, toward the side face22, of the flange part14a. The remaining constitutions are the same as those of the coil component100in Example 1, and are therefore not explained. In Example 1, the axial center20of the winding shaft12is offset from the center16of the inner face15aon which the winding shaft12is provided, toward the side face22, of the flange part14a, and also offset from the center18of the inner face15bon which the winding shaft12is provided, toward the side face32, of the flange part14b. However, this is not the only case and, so long as the axial center20of the winding shaft12is offset from the center16of the inner face15aon which the winding shaft12is provided, toward the side face22, of the flange part14a, the axial center20may be positioned at the center18of the inner face15bof the flange part14bon which the winding shaft12is provided, or it may be offset by an amount different from the amount of offset from the center16of the inner face15aon which the winding shaft12is provided, toward the side face22, of the flange part14a, as in Example 2. Example 3 FIG.7is a cross-sectional view of the electronic device pertaining to Example 3. As shown inFIG.7, the electronic device300in Example 3 comprises a circuit board80, and a coil component100in Example 1 mounted on the circuit board80. The coil component100is mounted on the circuit board80as its external electrodes60a,60bare joined to an electrode82on the circuit board80by a solder84. According to the electronic device300in Example 3, where the coil component100in Example 1 is mounted on the circuit board80, an electronic device comprising a coil component which has a small mounting space owing to a structure where the lead parts provided on a single face are connected to the external electrodes60a,60b, respectively, and which also prevents deterioration in inductance, can be obtained. Also, the distances from the lead parts44a,44bof the coil component100to the circuit board80can be shortened, which in turn allows resistance generated in the conductive wire to be lowered. Also, in the case of a low-inductance coil component, the distances from the lead parts44a,44bto the circuit board80can be made especially shorter, to prevent resistance from increasing due to mounting. It should be noted that, while Example 3 provides an example of mounting the coil component100in Example 1 on the circuit board80, the coil component200in Example 2 may be mounted instead. The foregoing described the examples of the present invention in detail; however, the present invention is not limited by these specific examples, and various modifications and changes may be added to the extent that the results do not deviate from the key points of the present invention described in “What Is Claimed Is.” In the present disclosure where conditions and/or structures are not specified, a skilled artisan in the art can readily provide such conditions and/or structures, in view of the present disclosure, as a matter of routine experimentation. Also, in the present disclosure including the examples described above, any ranges applied in some embodiments may include or exclude the lower and/or upper endpoints, and any values of variables indicated may refer to precise values or approximate values and include equivalents, and may refer to average, median, representative, majority, etc. in some embodiments. Further, in this disclosure, “a” may refer to a species or a genus including multiple species, and “the invention” or “the present invention” may refer to at least one of the embodiments or aspects explicitly, necessarily, or inherently disclosed herein. The terms “constituted by” and “having” refer independently to “typically or broadly comprising”, “comprising”, “consisting essentially of”, or “consisting of” in some embodiments. In this disclosure, any defined meanings do not necessarily exclude ordinary and customary meanings in some embodiments. It will be understood by those of skill in the art that numerous and various modifications can be made without departing from the spirit of the present invention. Therefore, it should be clearly understood that the forms of the present invention are illustrative only and are not intended to limit the scope of the present invention. | 40,046 |
11862380 | DETAILED DESCRIPTION First Embodiment With reference toFIG.1toFIG.4, an inductor11according to a first embodiment of the present disclosure will be described. The inductor11includes a component body12. The component body12is made of, for example, a non-conductive material containing at least one type of glass, resin, and ferrite. In addition, in a case where the component body12is a molded body formed of resin or the like, the molded body may contain a non-magnetic filler such as silica, or a magnetic filler such as ferrite or a metal magnetic material. Further, the molded body may have a structure formed with a combination of a plurality of materials among glass, ferrite and resin. The component body12has a substantially rectangular parallelepiped shape. For example, the substantially rectangular parallelepiped shape may be a shape in which rounded or chamfered portions are provided at a ridge portion and a corner portion. More specifically, as shown inFIG.1, the component body12having the substantially rectangular parallelepiped shape includes a mounting surface13facing a side of a mounting substrate, a top surface14facing the mounting surface13, a first side surface15and a second side surface16connecting between the mounting surface13and the top surface14and facing each other, and a first end surface17and a second end surface18facing each other and connecting both between the mounting surface13and the top surface14and between the first side surface15and the second side surface16. As shown inFIG.2, the component body12has a laminated structure in which a plurality of non-conductive material layers19is laminated. The plurality of non-conductive material layers19extends in an extending direction of the first end surface17and the second end surface18and is laminated in a direction parallel to the mounting surface13. A coil conductor20extending in a substantially spiral shape is disposed inside the component body12. The coil conductor20includes a first end portion21and a second end portion22opposite to each other, and includes a plurality of circulating portions23extending so as to form a part of an annular orbit along an interface of any of the plurality of non-conductive material layers19between the first end portion21and the second end portion22, and a plurality of via hole conductors24penetrating through any of the non-conductive material layers19in a thickness direction. The coil conductor20is given a form extending in the substantially spiral shape by alternately connecting the circulating portions23and the via hole conductors24described above. A via pad25having a relatively large area for connection with the via hole conductor24is provided at each of each end portion and a specific portion of each of the plurality of circulating portions23. InFIG.2, the via hole conductors24are indicated by dashed-dotted lines for an electrical connection state thereof. A first extended conductor27and a second extended conductor28are respectively connected to the first end portion21and the second end portion22of the coil conductor20. The first extended conductor27and the second extended conductor28are provided by extension portions of the circulating portion23positioning the first end portion21and the second end portion22of the coil conductor20, respectively. The first extended conductor27and the second extended conductor28are respectively connected to a first internal terminal conductor29and a second internal terminal conductor30. The internal terminal conductors29and30are to be terminals of the inductor11, and are partially exposed on the outer surface of the component body12while being disposed so as to be embedded inside the component body12. In this embodiment, the first internal terminal conductor29and the second internal terminal conductor30are separated from each other and are respectively exposed to a side of the first end surface17and a side of the second end surface18on the mounting surface13of the component body12, and the first internal terminal conductor29is exposed on the first end surface17while continuing to the portion exposed on the mounting surface13, and the second internal terminal conductor30is exposed on the second end surface18while continuing to the portion exposed on the mounting surface13. In this manner, each of the internal terminal conductors29and30is formed substantially in an L-shape as shown inFIG.2andFIG.3. In this manner, according to a configuration in which each of the internal terminal conductors29and30is exposed over adjacent two surfaces of the component body12, when the inductor11is mounted on the mounting substrate, a solder fillet in an appropriate form can be formed, so that a highly reliable mounting state can be obtained in both electrical connection and mechanical joint. As shown inFIG.1,FIG.3, andFIG.4, as appropriate, a first external terminal conductor31and a second external terminal conductor32may be provided so as to cover the exposed portions of the first internal terminal conductor29and the second internal terminal conductor30, respectively. The external terminal conductors31and32can have functions of improving solder wettability of the internal terminal conductors29and30containing silver, for example, as a conductive component, and preventing solder erosion. Additionally, when the external terminal conductors31and32are made of plating films, with the exposed portions of the internal terminal conductors29and30used as an base for deposition of an electroplating film, the external terminal conductors31and32can be efficiently formed at required locations. Each of the external terminal conductors31and32is configured with, for example, a nickel plating layer33as the base and a tin plating layer34thereon, as shown inFIG.4. According to this configuration, it is possible to advantageously cause the external terminal conductors31and32to exhibit the above-described functions of improving the solder wettability and preventing the solder erosion. Note that a copper plating layer may be formed instead of the nickel plating layer33, and a copper plating layer may be formed between the nickel plating layer33and the tin plating layer34. As an example of dimensions of some portions of an actual product of the inductor11, a dimension in a longitudinal direction of each of mounting surface13and top surface14is 0.6±0.03 mm, and a dimension in a width direction of each of them is 0.3±0.03 mm, a dimension in a height direction of each of the side surfaces15and16is 0.4±0.02 mm, a dimension in a height direction of each of the external terminal conductors31and32on the end surfaces17and18is 0.2±0.03 mm, and a dimension in a width direction of each of them is 0.24±0.03 mm, and a dimension of each of the external terminal conductors31and32on the mounting surface13is 0.15±0.03 mm when measured in a longitudinal direction of the mounting surface13. As a characteristic configuration of this embodiment, a first anchor conductor35and a second anchor conductor36which respectively extend from the first internal terminal conductor29and the second internal terminal conductor30in a state where they are in contact with the component body12but, not connected to the coil conductor20are provided. Since the anchor conductors35and36are in contact with the component body12, fixing force of the internal terminal conductors29and30to the component body12is increased, and as a result, it is possible to prevent the internal terminal conductors29and30from slipping off from the component body12due to temperature change or thermal shock. The first anchor conductor35and the second anchor conductor36are preferably provided inside the component body12in a state in which they are not exposed on the outer surface of the component body12. According to this configuration, a contact area between each of the anchor conductors35and36and the component body12can be widened, and a configuration can be implemented in which the anchor conductors35and36are held in specific portions of the component body12. Therefore, the fixing force of the internal terminal conductors29and30to the component body12can be further enhanced. Boundaries among the coil conductor20, the extended conductors27and28, the internal terminal conductors29and30, and the anchor conductors35and36, as described above, may be understood from forms of the coil conductor20, the extended conductors27and28, the internal terminal conductors29and30, and the anchor conductor36which are schematically illustrated inFIG.3by using different hatchings from each other. As described above, although the component body12has the laminated structure in which the plurality of non-conductive material layers19is laminated, the interfaces between the plurality of non-conductive material layers19which embody the laminated structure almost disappear in the actual product through a sintering process or a solidification process in many cases. However, for the sake of convenience for explanation, on the assumption that the laminated structure of the non-conductive material layers19exists, the non-conductive material layer19and its associated configuration will be described for each non-conductive material layer19mainly with reference toFIG.2. Note that, in the following description, when it is necessary to focus on and describe a specific one of the plurality of non-conductive material layers19, reference signs, such as “19-1”, “19-2”, . . . , for which sub-numbers are assigned to “19” are used. Also, for each of the plurality of circulating portions23, the plurality of via hole conductors24, the plurality of via pads25, the plurality of first anchor conductors35, and the plurality of second anchor conductors36, the similar usage of the reference signs to that in the above-described case of the non-conductive material layer19is adopted. InFIG.2, 11 non-conductive material layers19-1,19-2, . . . ,19-11are illustrated. These non-conductive material layers19-1,19-2, . . . ,19-11are laminated from the first side surface15toward the second side surface16in this order. The two non-conductive material layers19-1and19-11located at the endmost positions are colored different from the other non-conductive material layers19by addition of pigment, for example, such as cobalt. This is to facilitate detection when the inductor11is overturned or the like in mounting. Hereinafter, a formation mode of a conductor such as the coil conductor20will be described in the order from the non-conductive material layer19-1to the non-conductive material layer19-11. (1) On the interface between the non-conductive material layers19-2and19-3, the first extended conductor27and the circulating portion23-1continuing thereto and having less than one turn are provided, and the via pad25-1is provided at the end portion of the circulating portion23-1. Although not shown in detail, the via hole conductor24-1penetrating through the non-conductive material layer19-3in the thickness direction is provided so as to be connected to the via pad25-1. The first extended conductor27is connected to the first internal terminal conductor29. In the non-conductive material layer19-3, a first terminal conductor piece29-1which is a part of the first internal terminal conductor29and a second terminal conductor piece30-1which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-3in the thickness direction, that is, in the laminating direction. (2) On the interface between the non-conductive material layers19-3and19-4, the circulating portion23-2exceeding one turn is provided, and the via pads25-2and25-3are individually provided at both end portions of the circulating portion23-2. The via pad25-2is connected to the via hole conductor24-1described above. On the other hand, the via hole conductor24-2penetrating through the non-conductive material layer19-4in the thickness direction is provided so as to be connected to the via pad25-3. In the non-conductive material layer19-4, a first terminal conductor piece29-2which is a part of the first internal terminal conductor29and a second terminal conductor piece30-2which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-4in the thickness direction. Further, the first anchor conductor35-1extending from the first internal terminal conductor29and the second anchor conductor36-1extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-3and19-4. (3) On the interface between the non-conductive material layers19-4and19-5, the circulating portion23-3exceeding one turn is provided, and the via pads25-4and25-5are individually provided at both end portions of the circulating portion23-3. The via pad25-4is connected to the via hole conductor24-2described above. On the other hand, the via hole conductor24-3penetrating through the non-conductive material layer19-5in the thickness direction is provided so as to be connected to the via pad25-5. In the non-conductive material layer19-5, a first terminal conductor piece29-3which is a part of the first internal terminal conductor29and a second terminal conductor piece30-3which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-5in the thickness direction. Further, the first anchor conductor35-2extending from the first internal terminal conductor29and the second anchor conductor36-2extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-4and19-5. (4) On the interface between the non-conductive material layers19-5and19-6, the circulating portion23-4exceeding one turn is provided, and the via pads25-6and25-7are individually provided at both end portions of the circulating portion23-4. The via pad25-6is connected to the via hole conductor24-3described above. On the other hand, the via hole conductor24-4penetrating through the non-conductive material layer19-6in the thickness direction is provided so as to be connected to the via pad25-7. In addition, the via pad25-8is provided in an intermediate portion of the circulating portion23-4described above. In the non-conductive material layer19-6, the via hole conductor24-5penetrating through the non-conductive material layer19-6in the thickness direction is provided so as to be connected to the via pad25-8. In the non-conductive material layer19-6, a first terminal conductor piece29-4which is a part of the first internal terminal conductor29and a second terminal conductor piece30-4which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-6in the thickness direction. Further, the first anchor conductor35-3extending from the first internal terminal conductor29and the second anchor conductor36-3extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-5and19-6. (5) On the interface between the non-conductive material layers19-6and19-7, the circulating portion23-5exceeding one turn is provided, and the via pads25-9and25-10are individually provided at both end portions of the circulating portion23-5. The via pad25-9is connected to the via hole conductor24-5described above. On the other hand, the via hole conductor24-6penetrating through the non-conductive material layer19-7in the thickness direction is provided so as to be connected to the via pad25-10. In addition, the via pad25-11is provided in an intermediate portion of the circulating portion23-5described above. The via pad25-11is connected to the via hole conductor24-4described above. In the non-conductive material layer19-7, a first terminal conductor piece29-5which is a part of the first internal terminal conductor29and a second terminal conductor piece30-5which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-7in the thickness direction. Further, the first anchor conductor35-4extending from the first internal terminal conductor29and the second anchor conductor36-4extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-6and19-7. (6) On the interface between the non-conductive material layers19-7and19-8, the circulating portion23-6exceeding one turn is provided, and the via pads25-12and25-13are individually provided at both end portions of the circulating portion23-6. The via pad25-12is connected to the via hole conductor24-6described above. On the other hand, the via hole conductor24-7penetrating through the non-conductive material layer19-8in the thickness direction is provided so as to be connected to the via pad25-13. In the non-conductive material layer19-8, a first terminal conductor piece29-6which is a part of the first internal terminal conductor29and a second terminal conductor piece30-6which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-8in the thickness direction. Further, the first anchor conductor35-5extending from the first internal terminal conductor29and the second anchor conductor36-5extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-7and19-8. (7) On the interface between the non-conductive material layers19-8and19-9, the circulating portion23-7exceeding one turn is provided, and the via pads25-14and25-15are individually provided at both end portions of the circulating portion23-7. The via pad25-14is connected to the via hole conductor24-7described above. On the other hand, the via hole conductor24-8penetrating through the non-conductive material layer19-9in the thickness direction is provided so as to be connected to the via pad25-15. In the non-conductive material layer19-9, a first terminal conductor piece29-7which is a part of the first internal terminal conductor29and a second terminal conductor piece30-7which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-9in the thickness direction. Further, the first anchor conductor35-6extending from the first internal terminal conductor29and the second anchor conductor36-6extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-8and19-9. (8) On the interface between the non-conductive material layers19-9and19-10, the circulating portion23-8having less than one turn and the second extended conductor28continuing thereto are provided, and the via pad25-16is provided at the end portion of the circulating portion23-8. The via pad25-16is connected to the via hole conductor24-8described above. The second extended conductor28is connected to the second internal terminal conductor30. A first terminal conductor piece29-8which is a part of the first internal terminal conductor29and a second terminal conductor piece30-8which is a part of the second internal terminal conductor30are provided in the non-conductive material layer19-10. As shown inFIG.2, the first terminal conductor piece29-8and the second terminal conductor piece30-8may be provided along the interface between the non-conductive material layers19-9and19-10, or may be provided so as to penetrate through the non-conductive material layer19-10in the thickness direction. In the above-described (4) and (5), it has been described that the via pad25-8is provided in the intermediate portion of the circulating portion23-4, and the via hole conductor24-5is provided so as to be connected to the via pad25-8, and the via pad25-11is provided in the intermediate portion of the circulating portion23-5, and the via hole conductor24-4is provided so as to be connected to the via pad25-11. That is, the end portion of the circulating portion23-4is connected to the intermediate portion of the circulating portion23-5by the via hole conductor24-4, and the intermediate portion of the circulating portion23-4is connected to the end portion of the circulating portion23-5by the via hole conductor24-5. This is because the coil conductor20is made to have a shape that is substantially 180 degrees rotationally symmetric so that the inductor11does not have directivity. In the inductor11having the above configuration, the coil axis provided by the coil conductor20extends in a direction parallel to the mounting surface13of the component body12. Therefore, when the inductor11is mounted on the mounting substrate, a direction of magnetic flux generated in the coil conductor20is parallel to the mounting surface. Since the first internal terminal conductor29and the second internal terminal conductor30are respectively configured with an assembly of a plurality of first terminal conductor pieces29-1to29-8and an assembly of a plurality of second terminal conductor pieces30-1to30-8, they are provided so as to penetrate through the plurality of non-conductive material layers19in the laminating direction. Accordingly, the first internal terminal conductor29and the second internal terminal conductor30can form a relatively wide exposed surface on the outer surface of the component body12. Further, the number of turns of the coil conductor20may be increased or decreased as necessary. For example, the circulating portions23-2and23-3provided in connection with the non-conductive material layers19-4and19-5may be omitted, and the circulating portions23-6and23-7provided in connection with the non-conductive material layers19-8and19-9may be omitted, to reduce the number of turns of the coil conductor20. Conversely, circulating portions corresponding to the circulating portions23-2and23-3described above may be added, and circulating portions corresponding to the circulating portions23-6and23-7may be added, to increase the number of turns of the coil conductor20. Additionally, some non-conductive material layers19that are not provided with conductors such as the coil conductor20or the internal terminal conductors29and30may also be disposed between the non-conductive material layers19-1and19-2as well as between the non-conductive material layers19-10and19-11as necessary. As described above, the first anchor conductor35and the second anchor conductor36are provided on an interface between adjacent non-conductive material layers of the plurality of non-conductive material layers19. In this case, as shown inFIG.4for the plurality of first anchor conductors35-1to35-6, the plurality of first anchor conductors35and the plurality of second anchor conductors36form a plurality of strip conductors extending from the first internal terminal conductor29and the second internal terminal conductor30substantially in a strip shape, respectively. That is, the non-conductive material layer19is interposed between adjacent strip conductors of the plurality of strip conductors. According to this configuration, the contact area between each of the anchor conductors35and36and the component body12can be increased, and the fixing force of the internal terminal conductors29and30to the component body12can be further enhanced. In addition, as shown inFIG.2,FIG.3, andFIG.4, the first anchor conductor35and the second anchor conductor36extend from the first internal terminal conductor29and the second internal terminal conductor30toward the top surface14of the component body12, respectively. Therefore, stress due to thermal shock in a reflow process in mounting can be released to a portion away from the mounting surface13, so that the internal terminal conductors29and30can be prevented from slipping off. In addition, in a case where force applied to the internal terminal conductors29and30is in a direction particularly from the top surface14of the component body12toward the mounting surface13, it can be said that an effect of improving the fixing force by the anchor conductors35and36can be further exhibited. Moreover, as shown inFIG.2andFIG.4, the plurality of strip conductors formed with the respective anchor conductors35and36extends parallel to each other, and has tip end positions where distances to the top surface14of the component body12are different from each other. In short, the strip conductors formed with the respective anchor conductors35-1,35-3,35-5,36-2,36-4and36-6are shorter than the strip conductors formed with the respective anchor conductors35-2,35-4,35-6,36-1,36-3and36-5. According to such a configuration, for example, stress concentration due to the thermal shock is alleviated, so that the internal terminal conductors29and30can be further prevented from slipping off. Note that the plurality of strip conductors is not limited to two types of long and short strip conductors, but may be strip conductors having three or more types of lengths. As described above, the first anchor conductor35and the second anchor conductor36may not be provided on an interface between adjacent non-conductive material layers of the plurality of non-conductive material layers19, but may be provided so as to penetrate through the non-conductive material layer19in the laminating direction. As a result, as shown inFIG.5for the plurality of first anchor conductors35-1to35-6, the plurality of first anchor conductors35and the plurality of second anchor conductors36extend from the first internal terminal conductor29and the second internal terminal conductor30in a wide state, respectively. In this case, as shown inFIG.5, a distance from the tip end position to the top surface14of the component body12may be different for each of the plurality of first anchor conductors35and the plurality of second anchor conductors36. Also with this configuration, the contact area between each of the anchor conductors35and36and the component body12can be increased, and, for example, the stress concentration due to the thermal shock is alleviated, so that the fixing force of the internal terminal conductors29and30to the component body12can be further enhanced. Although not shown, the first anchor conductor35and the second anchor conductor36provided on an interface between adjacent non-conductive material layers of the plurality of non-conductive material layers19, and the first anchor conductor35and the second anchor conductor36provided so as to penetrate through the non-conductive material layer19in the laminating direction may coexist. In addition, as can be seen fromFIG.2andFIG.3, the first anchor conductor35and the second anchor conductor36are positioned so as to at least partially respectively overlap the first extended conductor27and the second extended conductor28when the component body12is seen from the first side surface15toward the second side surface16in a perspective view. In this embodiment, as can be seen from a fact that the first anchor conductor35is hidden behind the first extended conductor27and the second extended conductor28is hidden behind the second anchor conductor36inFIG.3, the first anchor conductor35and the second anchor conductor36are positioned so as to respectively overlap the first extended conductor27and the second extended conductor28in a direction parallel to the mounting surface13. According to such a configuration, it is possible to dispose the conductors in a balanced manner in the component body12having the laminated structure. Note that it is preferable that the first anchor conductor35and the second anchor conductor36are entirely disposed inside the component body12as shown in the figure, but a part thereof may be exposed on the outer surface of the component body12. The inductor11is manufactured, for example, as follows.FIG.6AtoFIG.6Fshow several processes included in a method for manufacturing the inductor11.FIG.6AtoFIG.6Fare cross-sectional views, in which cross sections at typical four portions are shown as one figure via break lines. First, as shown inFIG.6A, the non-conductive material layer19-2is laminated on the non-conductive material layer19-1. As a material of the non-conductive material layer19including the non-conductive material layers19-1and19-2, for example, electrically insulating paste obtained by adding ferrite or a metal magnetic material to glass such as borosilicate glass is used. Instead of the glass, resin may also be used. As described above, pigment such as cobalt, for example, is added to the non-conductive material layer19-1and the non-conductive material layer19-11which will be described later. Next, as shown inFIG.6B, a conductive film made of conductive paste containing conductive metal such as silver, for example, is formed on the non-conductive material layer19-2as a conductive component, and is patterned. By this patterning, in a region shown inFIG.6B, the circulating portion23-1of the coil conductor20, the via pad25-1which is a part thereof, and a part of the first terminal conductor piece29-1and a part of the second terminal conductor piece30-1are formed. Also, to patterning of the conductor film as described above and patterning of the non-conductive material layer19to be described later, for example, a photolithography method, a semi-additive method, a screen printing method, a transfer method, or the like is applied. Next, as shown inFIG.6C, the non-conductive material layer19-3is formed on the non-conductive material layer19-2, and is patterned. By this patterning, a through hole41for the via hole conductor24-1is formed at a position corresponding to the via pad25-1which is the part of the circulating portion23-1, and cavities42and43for respectively exposing the terminal conductor pieces29-1and30-1are formed. Next, as shown inFIG.6D, a conductive film is formed and patterned so as to cover the non-conductive material layer19-3. By this patterning, the circulating portion23-2, and the via pads25-2and25-3which are respective parts of the circulating portion are formed, and a remaining portion of the first terminal conductor piece29-1and a remaining portion of the second terminal conductor piece30-1are formed. Moreover, conductive paste is introduced into the through hole41to form the via hole conductor24-1. Next, as shown inFIG.6E, the non-conductive material layer19-4is formed on the non-conductive material layer19-3, and is patterned. By this patterning, a through hole44for the via hole conductor24-2is formed at a position corresponding to the via pad25-3which is the part of the circulating portion23-2, and cavities45and46for respectively exposing the terminal conductor pieces29-1and30-1are formed. Next, as shown inFIG.6F, a conductive film is formed and patterned so as to cover the non-conductive material layer19-3. By this patterning, the circulating portion23-3, and the via pads25-4and25-5which are respective parts of the circulating portion are formed, and the first terminal conductor piece29-2and the second terminal conductor piece30-2are formed. Moreover, conductive paste is introduced into the through hole44to form the via hole conductor24-2. After that, a process similar to the process shown inFIG.6Eand a process similar to the process shown inFIG.6Fare repeated a required number of times, and finally, the non-conductive material layers19-10and19-11are laminated to obtain a mother multilayer body. Next, the mother multilayer body is cut along cutting lines47indicated by dashed-dotted lines inFIG.6AtoFIG.6Fand a cutting line perpendicular to the cutting lines47, and a plurality of multilayer body chips to be the component body12is taken out. According to the cutting along the cutting lines47shown in the figure, a surface exposed to a side of the first end surface17in the first internal terminal conductor29and a surface exposed to a side of the second end surface18in the second internal terminal conductor30appear. On the other hand, according to the cutting along the cutting line (not shown) perpendicular to the cutting lines47, surfaces exposed to sides of the mounting surface13in the first internal terminal conductor29and in the second internal terminal conductor30appear. When the non-conductive material layers19contain glass, the multilayer body chips are then sintered. The component body12obtained in such a manner is subjected to a barrel polishing process as necessary to form the external terminal conductors31and32, and the inductor11is completed. Second Embodiment With reference toFIG.7andFIG.8, an inductor11aaccording to a second embodiment of the present disclosure will be described.FIG.7is a diagram corresponding toFIG.2.FIG.8is a cross-sectional view of the inductor11a, as in the case ofFIG.4, and shows a cross section corresponding to the cross section along the plane B-B inFIG.1. InFIG.7andFIG.8, constituent elements corresponding to the constituent elements shown inFIG.2andFIG.4are denoted by similar reference signs, and duplicate description thereof will be omitted. The inductor11ashown inFIG.7andFIG.8differs from the inductor11shown inFIG.2andFIG.4in the positions and extending directions of the anchor conductors. More specifically, in the inductor11a, a first anchor conductor37extends from the first internal terminal conductor29toward the second end surface18along the mounting surface13of the component body12, and the second anchor conductor38extends from the second internal terminal conductor30toward the first end surface17along the mounting surface13. Therefore, in particular, it is possible to expect improvement in the fixing force of the internal terminal conductors29and30to the component body12in a vicinity of the mounting surface13, and it is also possible to prevent the internal terminal conductors29and30from slipping off due to the thermal shock in the reflow process in mounting. In addition, in a case where the force applied to the internal terminal conductors29and30is in a direction particularly along the mounting surface13of the component body12, it can also be said that an effect of improving the fixing force by the anchor conductors37and38can be further exhibited. In the inductor11a, similarly to the inductor11described with reference toFIG.2andFIG.4, the first anchor conductor37and the second anchor conductor38are provided on an interface between adjacent non-conductive material layers of the plurality of non-conductive material layers19. In this case, as shown inFIG.8, the plurality of first anchor conductors37and the plurality of second anchor conductors38form a plurality of strip conductors extending from the first internal terminal conductor29and the second internal terminal conductor30substantially in a strip shape, respectively. That is, the non-conductive material layer19is interposed between adjacent strip conductors of the plurality of strip conductors. According to this configuration, a contact area between each of the anchor conductors37and38and the component body12can be increased, and the fixing force of the internal terminal conductors29and30to the component body12can be further enhanced. Additionally, as shown inFIG.7andFIG.8, the plurality of strip conductors formed with the first anchor conductors37extends parallel to each other and has tip end positions where distances to the second end surface18of the component body12are different from each other. Similarly, the plurality of strip conductors formed with the second anchor conductors38extends parallel to each other and has tip end positions where distances to the first end surface17of the component body12are different from each other. In short, the strip conductors formed with the respective anchor conductors37-1,37-3,37-5,37-7,38-1,38-3,38-5, and38-7are longer than the strip conductors formed with the respective anchor conductors37-2,37-4,37-6,38-2,38-4, and38-6. According to such a configuration, for example, stress concentration due to the thermal shock is alleviated, so that the internal terminal conductors29and30can be further prevented from slipping off. Additionally, the anchor conductors37and38shown inFIG.7andFIG.8have features in that the first anchor conductors37-1,37-3,37-5, and37-7forming longer strip conductors and the second anchor conductors38-1,38-3,38-5, and38-7forming longer strip conductors respectively face each other, and the first anchor conductors37-2,37-4, and37-6forming shorter strip conductors and the second anchor conductors38-2,38-4, and38-6forming shorter strip conductors respectively face each other. Note that the plurality of strip conductors is not limited to two types of long and short strip conductors, but may be strip conductors having three or more types of lengths. The first anchor conductor37and the second anchor conductor38are not provided on an interface between adjacent non-conductive material layers of the plurality of non-conductive material layers19as described above, but may be provided so as to penetrate through the non-conductive material layer19in the laminating direction, although not shown in the figure. Accordingly, the plurality of first anchor conductors37and the plurality of second anchor conductors38extend from the first internal terminal conductor29and the second internal terminal conductor30in a wide state, respectively. In this case, distances from the tip end positions of the plurality of first anchor conductors37and the tip end portions of the plurality of second anchor conductors38to the first end surface17or the second end surface18of the component body12may be different from each other. Also with this configuration, the contact area between each of the anchor conductors37and38and the component body12can be increased, and, for example, the stress concentration due to the thermal shock is alleviated, so that the fixing force of the internal terminal conductors29and30to the component body12can be further enhanced. Further, the first anchor conductor37and the second anchor conductor38provided on an interface between adjacent non-conductive material layers of the plurality of non-conductive material layers19, and the first anchor conductor37and the second anchor conductor38provided so as to penetrate through the non-conductive material layer19in the laminating direction may coexist. For forms of the anchor conductors37and38, a first modification shown inFIG.9or a second modification shown inFIG.10may be employed. The first modification shown inFIG.9has a feature in which the first anchor conductors37-1,37-3,37-5, and37-7forming longer strip conductors and the second anchor conductors38-1,38-3,38-5, and38-7forming shorter strip conductors respectively face each other, and the first anchor conductors37-2,37-4, and37-6forming shorter strip conductors and the second anchor conductors38-2,38-4, and38-6forming longer strip conductors respectively face with each other. The second modification shown inFIG.10has a feature in which the above-described feature of the first modification shown inFIG.9is differentiated. More specifically, the first anchor conductor37-3forming the longer strip conductor is positioned between the second anchor conductors38-2and38-4forming the longer strip conductors, and the first anchor conductor37-5forming the longer strip conductor is positioned between the second anchor conductors38-4and38-6forming the longer strip conductors. Also, the second anchor conductor38-2forming the longer strip conductor is positioned between first anchor conductors37-1and37-3forming the longer strip conductors, the second anchor conductor38-4forming the longer strip conductor is positioned between the first anchor conductors37-3and37-5forming the longer strip conductors, and the second anchor conductor38-6forming the longer strip conductor is positioned between the first anchor conductors37-5and37-7forming the longer strip conductors. That is, the second modification has a feature in that tip end portions of the strip conductors formed by the first anchor conductor37include a tip end portion positioned between adjacent strip conductors of the plurality of strip conductors formed by the second anchor conductor38, and tip end portions of the strip conductors formed by the second anchor conductor38include a tip end portion positioned between the adjacent strip conductors of the plurality of strip conductors formed by the first anchor conductor37. According to the second modification, since a positional relationship in which the plurality of first anchor conductors37and the plurality of second anchor conductors38are engaged with each other is achieved, for example, not only the stress concentration due to the thermal shock can be alleviated, but also the fixing force of the internal terminal conductors29and30to the component body12can be increased, thereby making it possible to further prevent the internal terminal conductors29and30from slipping off. Third Embodiment With reference toFIG.11, an inductor11baccording to a third embodiment of the present disclosure will be described.FIG.11is a diagram corresponding toFIG.2. InFIG.11, constituent elements corresponding to the constituent elements shown inFIG.2are denoted by similar reference signs, and duplicate description thereof will be omitted. The inductor11bshown inFIG.11has, in simple terms, a first feature in that the inductor11bhas a portion in which an inner diameter of the coil conductor20is larger than those of the inductors11and11adescribed above. With reference toFIG.11, the inductor11bincludes the component body12as in the cases of the inductors11and11a. The component body12includes the mounting surface13facing the side of the mounting substrate, the top surface14facing the mounting surface13, the first side surface15and the second side surface16connecting between the mounting surface13and the top surface14and facing each other, and the first end surface17and the second end surface18connecting between the mounting surface13and top surface14and between the first side surface15and the second side surface16and facing each other. The component body12has the laminated structure in which the plurality of non-conductive material layers19is laminated. The plurality of non-conductive material layers19extends in an extending direction of the first end surface17and the second end surface18and is laminated in a direction parallel to the mounting surface13. The coil conductor20extending in a substantially spiral shape is disposed inside the component body12. The coil conductor20includes the first end portion21and the second end portion22opposite to each other, and includes the plurality of circulating portions23extending so as to form a part of an annular orbit along an interface of any of the plurality of non-conductive material layers19between the first end portion21and the second end portion22, and the plurality of via hole conductors24penetrating through any of the non-conductive material layers19in a thickness direction. The coil conductor20is given a form extending in the substantially spiral shape by alternately connecting the circulating portions23and the via hole conductors24described above. The via pad25having a relatively large area for connection with the via hole conductor24is provided at each end portion of the plurality of circulating portions23. InFIG.11, the via hole conductors24are indicated by dashed-dotted lines for an electrical connection state thereof. The first extended conductor27and the second extended conductor28are respectively connected to the first end portion21and the second end portion22of the coil conductor20. The first extended conductor27and the second extended conductor28are respectively connected to the first internal terminal conductor29and the second internal terminal conductor30. The internal terminal conductors29and30are partially exposed on the outer surface of the component body12while being disposed so as to be embedded inside the component body12. Also in this embodiment, the first internal terminal conductor29and the second internal terminal conductor30are separated from each other and are respectively exposed to a side of the first end surface17and a side of the second end surface18on the mounting surface13of the component body12, and the first internal terminal conductor29is exposed on the first end surface17while continuing to the portion exposed on the mounting surface13, and the second internal terminal conductor30is exposed on the second end surface18while continuing to the portion exposed on the mounting surface13. Although not shown, an external terminal conductor may be provided so as to cover each of the exposed portions of the first internal terminal conductor29and the second internal terminal conductor30. In the following description, when it is necessary to focus on and describe a specific one of the plurality of non-conductive material layers19, reference signs such as “19-1”, “19-2”, . . . , for which sub-numbers are assigned to “19” are used. Also, for the plurality of circulating portions23, the plurality of via hole conductors24, the plurality of via pads25, and the like, the similar usage of reference signs to that in the above-described case of the non-conductive material layer19is adopted. InFIG.11, 12 non-conductive material layers19-1,19-2, . . . ,19-12are illustrated. These non-conductive material layers19-1,19-2, . . . ,19-12are laminated from the first side surface15toward the second side surface16in this order. The non-conductive material layers19-1and19-12located at the endmost positions are colored different from the other non-conductive material layers19, for example, by addition of pigment such as cobalt. Hereinafter, a formation mode of a conductor such as the coil conductor20will be described in the order from the non-conductive material layer19-1to the non-conductive material layer19-12. Note that in the inductor11bshown inFIG.11, a positional relationship between the first extended conductor27and the second extended conductor28is opposite to that in the case of the inductor11shown inFIG.2. (1) In the non-conductive material layers19-2to19-4, each of the second terminal conductor pieces30-1to30-3which is a part of the second internal terminal conductor30is provided so as to penetrate through the non-conductive material layers19-2to19-4in the thickness direction, that is, in the laminating direction. Although not shown, the first terminal conductor pieces that are a part of the first internal terminal conductor29are also provided at symmetrical positions with respect to the second terminal conductor pieces30-1to30-3in the non-conductive material layers19-2to19-4. (2) On an interface between the non-conductive material layers19-4and19-5, the first extended conductor27and the circulating portion23-1continuing thereto and having less than one turn are provided, and the via pad25-1is provided at an end portion of the circulating portion23-1. Although not shown in detail, the via hole conductor24-1penetrating through the non-conductive material layer19-5in the thickness direction is provided so as to be connected to the via pad25-1. The first extended conductor27is connected to the first internal terminal conductor29. The first terminal conductor piece29-4which is a part of the first internal terminal conductor29and the second terminal conductor piece30-4which is a part of the second internal terminal conductor30are provided in the non-conductive material layer19-5so as to penetrate through the non-conductive material layer19-5in the thickness direction. (3) The circulating portion23-2having less than one turn is provided on an interface between the non-conductive material layers19-5and19-6, and the via pads25-2and25-3are individually provided at both end portions of the circulating portion23-2. The via pad25-2is connected to the via hole conductor24-1described above. On the other hand, the via hole conductor24-2penetrating through the non-conductive material layer19-6in the thickness direction is provided so as to be connected to the via pad25-3. In the non-conductive material layer19-6, the first terminal conductor piece29-5which is a part of the first internal terminal conductor29and the second terminal conductor piece30-5which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-6in the thickness direction. Further, the first anchor conductor35-1extending from the first internal terminal conductor29and the second anchor conductor36-1extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-5and19-6. (4) The circulating portion23-3having less than one turn is provided on an interface between the non-conductive material layers19-6and19-7, and the via pads25-4and25-5are individually provided at both end portions of the circulating portion23-3. The via pad25-4is connected to the via hole conductor24-2described above. On the other hand, the via hole conductor24-3penetrating through the non-conductive material layer19-7in the thickness direction is provided so as to be connected to the via pad25-5. In the non-conductive material layer19-7, the first terminal conductor piece29-6which is a part of the first internal terminal conductor29and the second terminal conductor piece30-6which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-7in the thickness direction. (5) The circulating portion23-4having less than one turn is provided on an interface between the non-conductive material layers19-7and19-8, and the via pads25-6and25-7are individually provided at both end portions of the circulating portion23-4. The via pad25-6is connected to the via hole conductor24-3described above. On the other hand, the via hole conductor24-4penetrating through the non-conductive material layer19-8in the thickness direction is provided so as to be connected to the via pad25-7. In the non-conductive material layer19-8, the first terminal conductor piece29-7which is a part of the first internal terminal conductor29and the second terminal conductor piece30-7which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-8in the thickness direction. Further, the first anchor conductor35-2extending from the first internal terminal conductor29and the second anchor conductor36-2extending from the second internal terminal conductor30are provided on the interface between the non-conductive material layers19-7and19-8. (6) On an interface between the non-conductive material layers19-8and19-9, the circulating portion23-5having less than one turn and the second extended conductor28continuing thereto are provided, and the via pad25-8is provided at an end portion of the circulating portion23-5. The via pad25-8is connected to the via hole conductor24-4described above. The second extended conductor28is connected to the second internal terminal conductor30. In the non-conductive material layer19-9, the first terminal conductor piece29-8which is a part of the first internal terminal conductor29and the second terminal conductor piece30-8which is a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layer19-9in the thickness direction. (7) In the non-conductive material layers19-10and19-11, the second terminal conductor pieces30-9and30-10which are a part of the second internal terminal conductor30are provided so as to penetrate through the non-conductive material layers19-10and19-11in the thickness direction, respectively. Although not shown, the first terminal conductor pieces which are a part of the first internal terminal conductor29are also provided at symmetrical positions with respect to the second terminal conductor pieces30-9and30-10in the non-conductive material layers19-10and19-11. In the inductor11bhaving the structure described above, when attention is paid to the circulating portions23-1,23-3, and23-5, each of the circulating portions23-1,23-3, and23-5has a larger inner diameter than those of the circulating portions23-2and23-4. That is, when the configuration of the inductor11bis generalized, in a case where the component body12is perspectively viewed from the first side surface15toward the second side surface16, the coil conductor20includes the circulating portion23which overlaps at least one of the first extended conductor27and the second extended conductor28or which is closer to the outer surface of the component body12than at least one of the first extended conductor27and the second extended conductor28. As described above, when the inner diameter of the circulating portion23provided in the coil conductor20is increased, an inductance value to be obtained by the inductor11bcan be increased, and a Q value can be increased. The inductor11bhas the following features. That is, on each of the interfaces between the non-conductive material layers19provided with the respective circulating portions23-1,23-3, and23-5having the larger inner diameter, a space in which the anchor conductor35is to be provided is provided to increase the inner diameter of the circulating portion23. Therefore, the anchor conductor35is provided only on each interface between the non-conductive material layers19forming the respective circulating portions23-2and23-4which do not increase the inner diameter. From the above description, it appears that the inductor11bshown inFIG.11cannot support increasing the inner diameter of the circulating portion and providing the anchor conductor at the same time. However, as a modification of the third embodiment, it is also possible to support both increasing the inner diameter of the circulating portion and providing the anchor conductor on a specific interface between the non-conductive material layers19. That is, when the inner diameter of the circulating portion is increased only on the side of the first end surface17, for example, and the anchor conductor is provided on the side of the second end surface18, both increasing the inner diameter of the circulating portion and providing the anchor conductor can be supported at the same time. Further, as shown inFIG.7, when the anchor conductors37and38are transferred to positions along the mounting surface13, the inner diameter of the circulating portion23can be increased without being disturbed by the anchor conductors37and38, so that both increasing the inner diameter of the circulating portion and providing the anchor conductor can be supported at the same time. According to the present disclosure, the first anchor conductor and the second anchor conductor enhance the fixing force of the first internal terminal conductor and the second internal terminal conductor to the component body. Therefore, it is possible to prevent the internal terminal conductor from slipping off due to temperature change or thermal shock. Although the present disclosure has been described in connection with the illustrated embodiments, other various modifications are possible within the scope of the present disclosure. Also, the embodiments and the modifications described herein are merely exemplary and partial replacement or combination of the configurations is possible among the embodiments and the modifications. While preferred embodiments of the disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the disclosure, therefore, is to be determined solely by the following claims. | 55,939 |
11862381 | DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS FIG.1shows a view from above of one embodiment of a symmetric-asymmetric transformer, or balun BLN. The balun BLN belongs to a plane P comprising an axis X forming an axis of symmetry for the whole architecture of this embodiment, and is fabricated on a semiconductor substrate SC. The balun BLN comprises a primary inductive circuit L1formed by metal tracks whose disposition forms an octagonal loop, which is wound and unwound while making three complete rotations, or three turns. The primary circuit L1comprises two terminals SE and GND designed to be connected in asymmetric, or single-ended, mode respectively to a load and to ground. For example, the load may be a transmitting or receiving antenna. The terminals SE and GND of the primary circuit L1are disposed side-by-side in a symmetrical manner with respect to the axis X, on an external side of the balun BLN. The balun BLN also comprises a secondary inductive circuit L2, formed by metal tracks whose disposition forms an octagonal loop which is wound and unwound while making two turns, in an interleaved manner with the turns of the loop of the primary circuit L1. The metal tracks P11-P15, P21-P25forming the turns of the primary L1and secondary L2circuits are situated in the same metallization level. Furthermore, the octagonal geometries of the loops of the primary and secondary circuits are given by way of a non-limiting example, and may take another polygonal or circular form. The secondary circuit L2comprises two terminals PA1and PA2designed to be connected in a symmetric, or differential, mode to transistors of a power amplifier circuit, for example. A biasing terminal VCC is connected to a mid-point of the secondary circuit L2and is designed to receive a common-mode DC voltage. The terminals PA1, VCC and PA2of the secondary circuit L2are respectively disposed side-by-side in a symmetrical manner with respect to the axis X. This is on an external side of the balun BLN, opposite to the side comprising the terminals SE, GND of the primary circuit L1. Thus, the interleaved nature of the primary L1and secondary L2inductive circuits provides an arrangement in which the metal tracks of the turns of the primary circuit L1are disposed on either side of, and directly next to, the track of each turn of the secondary circuit L2. The winding and unwinding of the turns of the primary and secondary circuits introduce crossing points for metal tracks. Thus, the metal tracks are stacked, notably in the crossing regions, passing over and under the metallization level of the turns, in respectively higher and lower levels of metallization. It is nevertheless considered that the balun BLN is included within a plane P and that the symmetry with respect to the axis X does not take into account the differences in height of the levels of metallization. This is commonly admitted in microelectronics due to the very small vertical dimensions of the architecture. Thus, the balun BLN comprises two crossing regions CR1and CR2in which the metal tracks cross one another, via metal tracks referred to as connection tracks. The first crossing region CR1is situated in the turns on the side of the terminals SE, GND of the primary circuit and comprises a crossing of the primary circuit L1and a crossing of the secondary circuit L2. The second crossing region CR2is situated in the turns on the side of the terminals of the secondary circuit L2and comprises a crossing of the primary circuit, passing vertically on either side of the biasing terminal VCC. The primary circuit L1runs from the terminal SE to the terminal GND via a track P11which arrives at the second crossing region CR2. A metal connection track PL6directs the turn towards the interior of the loop and connects the track P11to a track P23which runs to the first crossing region CR1. In the crossing region CR1, a connection track PL4directs the turn towards the interior and connects the track P23to a track P15. The primary circuit L1has described a first turn (one complete circuit). The circuit then describes a second turn according to two half-turns formed by the tracks P15and P25connected together at a mid-point. The loop of the primary circuit has so far been wound and then starts to unwind. The track P25arrives at the first crossing region CR1, in which a connection track PL3directs the turn towards the exterior and connects the track P25to a track P13. The track P13runs to the second crossing region CR2, in which the connection track PL5directs the turn towards the exterior and connects the track P13to a track P21. The track P21then arrives at the ground terminal GND. The tracks of the primary circuit L1have thus formed a loop of three turns which is wound and unwound. The secondary circuit runs from the terminal PA1to the terminal PA2passing under the track P11to join with a track P12which arrives at the first crossing region CR1. In the crossing region CR1, a connection plate PIA directs the turn towards the interior and connects the track P12to a track P24. The track P24follows a half-turn up to a mid-point position connected to the biasing terminal VCC. Here, the secondary circuit L2has formed a first turn by winding and starts to unwind. A track P14starts from the mid-point and arrives at the first crossing region CR1in which a connection plate PL2directs the turn towards the exterior and connects the track P14to a track P22. The track P22arrives at the terminal PA2after passing under the track P21. The tracks of the secondary circuit are disposed between the tracks of the primary circuit. In particular, the track P12is situated between the track P11and P13, the track P14is situated between the tracks P13and P15, the track P22is situated between the track P21and P23, and the track P24is situated between the tracks P23and P25. A constant gap separates, from edge to edge, the tracks of the primary circuit and the tracks of the secondary circuit. Such a configuration forms a structure such that, over all of the positions of the secondary circuit at which a coupling with the primary circuit takes place, the sum of the distances from one terminal of the primary circuit to the corresponding coupled positions of the primary circuit is equal to the sum of the distances from the other terminal of the primary circuit to the same coupled positions. In this configuration, the secondary circuit is coupled with the primary circuit in equal proportions at positions of the primary circuit close to one terminal and positions of the primary circuit close to the other terminal. In other words, the signal on the secondary circuit sees the ground terminal GND as much as the load terminal SE of the primary circuit. Thus, when a signal travels over the secondary circuit, this signal is coupled in a uniform manner with the whole of the primary circuit, providing good phase and amplitude symmetries. This allows excellent behaviors with regard to balance of phases and balance of amplitudes to be obtained, and notably for power amplifier applications. Moreover, the tracks P11, P21, P15and P25of the primary circuit L1are narrower than the other tracks. Their width is approximately half of the width of a track of the secondary circuit L2. Narrower metal tracks notably allow the stray capacitance existing between the metal tracks and the substrate to be reduced. The current flowing in the primary circuit is usually lower than that flowing in the secondary circuit. Thus, an advantageous decrease in the width of the tracks over certain parts of the primary circuit is not detrimental with respect to current flow. It is also possible to form each of the tracks P13and P23in the form of two narrow parallel tracks. Each narrow parallel track may be separated from the edge of the tracks of the secondary circuit by the same constant separation. In this embodiment, the tracks for connecting the primary circuit can have the same thickness as the tracks of the secondary circuit. This is advantageous with regard to noise signals. FIG.2shows a perspective view of the first crossing region CR1in which the interleaved and stacked metal tracks are shown in transparency for a better understanding of the architecture of this embodiment. In the first crossing region CR1, the metal track of the secondary circuit P14is connected to the metal track P22via a connection plate PL2. The metal track of the secondary circuit P24is connected to the track P12via another connection plate PL1. The connection plate PL2is formed at the same level of metal as the metal tracks forming the turns of the primary and secondary inductive circuits, and takes the form of a rectangular plate. The tracks P14and P22are connected to the connection plate PL2on two opposing sides of the rectangular plate, each on one respective end of the side, with the ends being diagonally opposite. The connection plate PL1is formed on a level of metal that is higher than the level of the metal tracks of the primary and secondary inductive circuits. The connection plate PL1also takes the form of a rectangular plate additionally comprising two wings respectively on two opposing sides of the rectangular plate. Each wing is on one end of the respective side, and with the ends being diagonally opposite. The tracks P12and P24are connected to the connection plate PIA on the lower surface of the respective wings. Furthermore, the connection plates PIA and PL2are the same size and are aligned in a vertical axis perpendicular to the plane. The diagonals along which the tracks of the secondary circuit are connected to one connection plate or another opposite to each other. Moreover, in this non-limiting representation, the wings of the connection plate PIA each have a bevel1and2at their attachment with the rectangular plate PIA. This configuration is advantageous with regard to current flow and is not detrimental to the balanced aspect of the couplings implemented by the disclosure. Indeed, although not being strictly geometrically symmetric with respect to the axis X, this configuration is balanced with regard to coupling between the primary and secondary circuits. FIG.3shows a perspective view of the second crossing region CR2in which the interleaved and stacked metal tracks are also shown in transparency for a better understanding of the architecture provided for this embodiment. In the second crossing region CR2, the metal track of the primary circuit PAA is connected to the metal track P23via a connection track PL6. The connection track PL6is at a lower level than the metallization level of the tracks forming the turns of the circuit, passing under the biasing terminal VCC. The metal track P13is connected to the track P21via a connection track PL5, passing over the biasing terminal VCC, in a higher metallization level than the metallization level of the tracks forming the turns of the circuit. The biasing terminal VCC takes the form of a rectangular plate and is connected along one of its widths in such a manner as to be centered on the mid-point of the secondary circuit. The width of the rectangular plate of the biasing terminal measures around twice the width of a metal track due to the high current flowing on the biasing terminal. Thus, the connection tracks PL5and PL6cross each other on either side of the biasing terminal VCC in a symmetrical manner with respect to the axis X. This provides good performance characteristics with regard to phase and amplitude symmetries. The connection tracks PL5and PL6may take the form of rectangular plates of identical size to the plate of the biasing terminal VCC, superposed over each other and with the biasing terminal. All three are aligned along a vertical axis perpendicular to the plane P. The disclosure may advantageously be employed for any power application in radio frequency (RF) telecommunications systems, andFIG.4shows one example of an input or output stage of such a system SYS. For example, the system is of the cellular mobile telephone or tablet type, and comprises a balun BLN according to the disclosure. The terminal SE of the primary circuit L1of the balun BLN is connected to an antenna ANT, typically with an impedance of5oOhms, and the terminal GND is connected to an external ground. The antenna may be used both as a transmitter and a receiver. The terminals PA1and PA2of the secondary circuit L2are, on the other hand, connected to processing circuit or a processor MTD in differential mode. This may comprise, for example, a low-noise amplifier LNA. The mid-point of the secondary circuit L2is connected to a decoupling capacitor Cap connected to the ground GND PA associated with the differential-mode circuit connected to the terminals of the secondary circuit L2. The balun BLN thus supplies an output signal in a differential mode (or in single-ended mode) starting from an input signal received in a single-ended mode (or in differential mode) with very little losses, excellent phase and amplitude symmetries, while at the same time allowing the passage of a current of high intensity. Such performance characteristics allow the efficiency of power amplifiers combined with the transformer BLN according to the disclosure to be optimized. Furthermore, the disclosure is not limited to the embodiments that have just been described but encompasses all their variations. Thus, a balun comprising a primary circuit with three turns and a secondary circuit with two turns has been described, but it is possible, notably in order to design the impedance transformation ratio of the balun BLN, for the primary circuit to comprise N+1 turns and the secondary circuit to comprise N turns. N is an integer number greater than or equal to 2. The number of first crossing regions and of second crossing regions comprising the features previously described may vary as a function of the number of turns on the primary and secondary circuits. | 13,993 |
11862382 | DETAILED DESCRIPTION Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, various alterations and modifications may be made to the embodiments. Here, the embodiments are not meant to be limited by the descriptions of the present disclosure. The embodiments should be understood to include all changes, equivalents, and replacements within the idea and the technical scope of the disclosure. The terminology used herein is for the purpose of describing particular embodiments only and is not to be limiting of the embodiments. The singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises/comprising” and/or “includes/including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof. Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments belong. It will be further understood that terms, such as those defined in commonly-used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. When describing the examples with reference to the accompanying drawings, like reference numerals refer to like constituent elements and a repeated description related thereto will be omitted. In the description of the embodiments, a detailed description of well-known related structures or functions will be omitted when it is deemed that such description will cause ambiguous interpretation of the present disclosure. FIG.1is a diagram illustrating a structure of a spiral coil100according to an embodiment. FIG.1shows the structure of the spiral coil100according to an embodiment. The spiral coil100may be formed as a circle in which a conducting wire has a constant radius. For example, the conducting wire may form one or more coil turns.FIG.1shows the spiral coil100in which a coil turn N of the conducting wire is 2. An inductance of the spiral coil100may be improved by increasing a length of the conducting wire. The structure may have an advantage in that the spiral coil100may be designed with conducting wires having different radii. In order to increase the intensity of a magnetic field, a coil in which the same conducting wire is wound several times with the same diameter is physically formed in a helical structure having a plurality of layers, and thus it may be difficult to embed in a small device. The spiral coil100with the structure illustrated inFIG.1may solve this problem by designing a single-layer or two-layer structure with different radii of conducting wires. In this case, a distance from a center of the spiral coil100as shown inFIG.1to a first conducting wire may represent an internal diameter (Rin) and a distance to a last conducting wire may represent an external diameter (Rout). FIG.2is a cross-sectional view illustrating a wireless power transmission and reception circuit according to an embodiment. For example, the cross-section of the spiral coil100illustrated inFIG.2may represent a cross-section of A-A′ inFIG.1.FIG.1may represent an example of the spiral coil100including conducting wires110and120wound with two turns and the cross-section of the spiral coil100illustrated inFIG.2may represent the conducting wire110corresponding to one turn and conducting wire120corresponding to two turns. For example, in the conducting wire wound with the number of N turns of the spiral coil100, a plurality of conducting wires corresponding to each turn may be disposed at regular intervals. FIG.2may be understood as illustrating a cross-sectional view of an embodiment in which the spiral coil100of the wireless power transmission and reception circuit according to various embodiments is connected to a printed circuit board (PCB)200. For example, the wireless power transmission and reception circuit may include the spiral coil100and the PCB200. For example, the PCB may include at least one of a wire210, a dielectric220, and a via-hole230. The wire210of the PCB200may be formed on one side or both sides of the dielectric220, may mean a path for transmitting an electrical signal or power, and may include a metal material. The wire210may form a path for transmitting an electrical signal or power according to a pattern. In the PCB200, the wire210positioned above and under the dielectric220may be electrically connected through the via-hole230. As shown inFIG.2, the spiral coil100may be connected to the wire210of the PCB200. Referring toFIG.2, the conducting wires110and120, according to an embodiment, may have one side in a central portion direction of the spiral coil100and the other side in an opposite direction to a central portion of the spiral coil100having different heights in each of the coil turns. InFIG.2, in the conducting wires110and120corresponding to coil turn 1 or coil turn 2, a side in a central portion direction of the spiral coil100may refer to one side and a side in an opposite direction to a central portion of the spiral coil100may refer to the other side. As shown inFIG.2, the one side and the other side of the conducting wire110corresponding to the coil turn 1 may have different heights. As shown inFIG.2, the one side and the other side of the conducting wire120corresponding to the coil turn 2 may have different heights. For example, in the conducting wire120corresponding to the coil turn 2 shown in an enlarged view inFIG.2, a height h1of the one side may be higher than a height h2of the other side. The height of the one side of the conducting wires110and120shown inFIG.2is the same as h1and the height of the other side is h2, but the height of the one side and the height of the other side of the conducting wire110and the conducting wire120may be different. Referring toFIG.2, the conducting wire according to an embodiment may include at least one slot130formed due to an empty space between the one side and the other side. InFIG.2, the slot130formed due to an empty space between the one side and the other side of each of the conducting wires110and120corresponding to the coil turn 1 or coil turn 2 is shown. For example, referring to a portion of the conducting wire120corresponding to the enlarged coil turn 2, the slot130may be formed between the one side and the other side. Referring toFIG.2, the conducting wires110and120may be positioned above the one side and the other side and include an upper surface connecting the one side and the other side. As shown inFIG.2, the conducting wires110and120corresponding to each turn may include the one side, the other side, and the upper surface connecting the one side and the other side. The spiral coil100illustrated inFIG.2may lower resistance by having different heights from the one side and the other side. The spiral coil100according to an embodiment may lower resistance due to the proximity effect by having different heights from the one side and the other side corresponding to each turn. Since a height of the other side of the conducting wire110and a height of the one side of the conducting wire120facing each other are different, it is possible to prevent an increase in resistance due to the proximity effect. The spiral coil100illustrated inFIG.2may include the slot130to lower resistance. When the height of the conductive wires110and120of the spiral coil100increases and becomes greater than the thickness of the skin, the effect of reducing the resistance may decrease, or rather the resistance may increase. The conducting wires110and120of the spiral coil100may include the slot130to maintain a thickness t of the conducting wire and reduce resistance. For example, a difference between the height of the one side and the height of the other side of the conducting wires110and120may be proportional to a width of the conducting wires110and120. Referring toFIG.2, a vertical cross-section of the upper surface of the conducting wires110and120may be formed to have a constant height variation. When the vertical cross-section of the upper surface of the conducting wires110and120has a constant height variation, the height difference between the one side and the other side of the conducting wires110and120may be proportional to the width of the conducting wire. As another example, the difference between the height of the one side and the height of the other side of the conducting wires110and120may not be proportional to the width of the conducting wires110and120. For example, the height of the upper surface is maintained at h1in a direction from the one side to the other side of the conducting wires110and120and the height is reduced by the constant height variation and may be connected to the other side. As another example, the height of the upper surface is maintained at h1in a direction from the one side to the other side of the conducting wires110and120and may extend toward the PCB200in a form bent in a vertical direction toward the PCB200at a certain point (e.g., half the width of the conducting wires110and120). The upper surface extending toward the PCB200may be bent and extended in a direction of the other side at a height h2and may be connected to the other side. For example, the upper surface may connect the one side and the other side in a step shape. As another embodiment shown inFIG.2, the vertical cross-section of the upper surface of the conducting wires110and120may be formed to have an inconstant height variation. For example, the height of the upper surface from the one side to the other side of the conducting wires110and120may increase from h1to h1+h, and then decrease to h2. FIG.3is a cross-sectional view illustrating a wireless power transmission and reception circuit according to an embodiment. In the followingFIGS.3to7, although descriptions of the same contents as those described with reference toFIGS.1and2are omitted, substantially the same may be applied. For example, the PCB200ofFIG.3may include the wire210, the dielectric220, or the via-hole230. Referring toFIG.3, the spiral coil100according to an embodiment may include a plurality of slots130. For example, each of the conducting wires of the spiral coil100shown inFIG.3may include two slots130. Each of the conducting wires110and120shown inFIG.3represents an embodiment including two slots130but is not limited thereto and each of the conducting wires110and120may include one or three or more slots130. FIG.4is a cross-sectional view illustrating a wireless power transmission and reception circuit according to an embodiment. Referring toFIG.4, a height of the one side of the conducting wires110and120of the spiral coil100according to an embodiment may be lower than a height of the other side. As shown inFIG.4, it may be seen that each of a height h1of the one side of the conducting wire110corresponding to the coil turn 1 and the one side of the conducting wire120corresponding to the coil turn 2 is lower than a height h2of the other side. FIG.5is a cross-sectional view illustrating a wireless power transmission and reception circuit according to an embodiment. Referring toFIG.5, the conducting wires110and120according to an embodiment may be positioned under the one side and the other side and may include a lower surface connecting the one side and the other side. InFIG.5, a height of the one side of the conducting wires110and120is h1and a height of the other side is h2, and the height h1of the one side may be higher than the height h2of the other side. The lower surface is positioned under the one side and the other side and may connect the one side and the other side. InFIG.5, one or more slots130may be formed between the one side and the other side. Although the lower surface shown inFIG.5illustrates an example having a flat shape, the lower surface may have a shape different from that of the lower surface illustrated inFIG.5. As another embodiment shown inFIG.5, the conducting wires110and120including the lower surface may include the plurality of slots130. For example, the plurality of slots130may be formed by forming a separator extending upward from the lower surface of the conducting wires110and120. As another embodiment shown inFIG.5, the height of the one side of the conducting wires110and120including the lower surface may be lower than the height of the other side. As another embodiment shown inFIG.5, the lower surface may have a non-flat shape. For example, the lower surface may extend horizontally from a lower end of the one side to a certain width (e.g., half the width of the conducting wire) of the conducting wires110and120in a direction to the other side, may extend from a certain width of the conducting wires110and120to a certain height in a vertical direction, may extend horizontally in a direction to the other side and may be connected to a lower end of the other side. As described above, the lower surface may be connected to the lower end of the other side in a step shape from the lower end of the one side. When the lower surface has a step shape as described above, the lower surface of the conducting wires110and120may be connected to the wire210in some regions. FIGS.6A to6Care diagrams illustrating a wireless power transmission and reception circuit according to an embodiment. FIG.6Aillustrates the spiral coil100according to an embodiment,FIG.6Billustrates the wire210formed on the PCB200according to an embodiment,FIG.6Cis a cross-sectional view illustrating a wireless power transmission and reception circuit including the PCB200and the spiral coil100connected to the PCB200.FIGS.6A and6Bmay be understood as showing an upper side view of the spiral coil100and the wire210. Referring toFIG.6, the wire210according to an embodiment may be formed to have the same shape as the spiral coil100. For example, the wire210may be formed on the one side of the dielectric220in the same shape as the shape of the spiral coil100. The shape of the wire210ofFIG.6Bmay have the same shape as the shape of the spiral coil100inFIG.6A. As shown inFIG.6C, the spiral coil100ofFIG.6Amay be connected to the wire210formed in the shape ofFIG.6Bon the PCB200. For example, soldering240may be further formed between the wire210of the PCB200and the spiral coil100. FIGS.7A to7Dare diagrams illustrating a wireless power transmission and reception circuit according to an embodiment. Referring toFIG.7, the wire210according to an embodiment may be formed at a fixed position determined to correspond to the shape of the spiral coil100. FIG.7Ais a diagram illustrating a shape of the spiral coil100according to an embodiment, andFIG.7Bis a diagram illustrating a shape of the wire210according to an embodiment. The wire210ofFIG.7Bmay be formed at fixed positions corresponding to the shape of the spiral coil100. The wire210shown inFIG.7Bmay be formed on the one side of the dielectric220of the PCB200. As shown inFIG.7CorFIG.7D, the spiral coil100ofFIG.7Amay be connected to the wire210formed in the shape ofFIG.7Bon the PCB200. For example, as shown inFIG.7C, the wire210and the spiral coil100may be directly connected or the soldering240between the wire210and the spiral coil100of the PCB200as shown inFIG.7Dmay be further formed. As shown inFIGS.7C and7D, a portion of the spiral coil100corresponding to the wire210formed at a fixed position may be connected to the wire210of the PCB200. For example, in the cross-section of the wireless power transmission and reception circuit, the conducting wire110may not be connected to the wire210but the conducting wire120may be connected to the wire210. In the cross-section of the wireless power transmission and reception circuit at another location, unlike the embodiment shown inFIG.7C or7D, a cross-section in which the conducting wire110is connected to the wire210and the conducting wire120is not connected to the wire210may appear. InFIGS.6and7, examples in which the height of the one side of the conducting wire shown inFIG.3is higher than the height of the other side, and the spiral coil100including two slots130is connected to the PCB200are shown, but the spiral coil100, different from the spiral coil shown inFIGS.6and7, may be connected to the PCB200substantially the same as those shown inFIGS.6and7. For example, the connection of the spiral coil100to the PCB200may mean a mechanical connection and/or electrical connection between the PCB200and the spiral coil100. The spiral coil100described above may be manufactured using 3D metal printing. For example, the spiral coil100may be easily manufactured by the 3D metal printing, and due to the shape of the conducting wire of the spiral coil100, the spiral coil100may have a low resistance. The components described in the embodiments may be implemented by hardware components including, for example, at least one digital signal processor (DSP), a processor, a controller, an application-specific integrated circuit (ASIC), a programmable logic element, such as a field programmable gate array (FPGA), other electronic devices, or combinations thereof. At least some of the functions or the processes described in the embodiments may be implemented by software, and the software may be recorded on a recording medium. The components, the functions, and the processes described in the embodiments may be implemented by a combination of hardware and software. Although the present specification includes details of a plurality of specific to embodiments, the details should not be construed as limiting any invention or a scope that can be claimed, but rather should be construed as being descriptions of features that may be peculiar to specific embodiments of specific inventions. Specific features described in the present specification in the context of individual embodiments may be combined and implemented in a single embodiment. On the contrary, various features described in the context of a single embodiment may be implemented in a plurality of embodiments individually or in any appropriate sub-combination. Furthermore, although features may operate in a specific combination and may be initially depicted as being claimed, one or more features of a claimed combination may be excluded from the combination in some cases, and the claimed combination may be changed into a sub-combination or a modification of the sub-combination. Likewise, although operations are depicted in a specific order in the drawings, it should not be understood that the operations must be performed in the depicted specific order or sequential order or all the shown operations must be performed in order to obtain a preferred result. In specific cases, multitasking and parallel processing may be advantageous. In addition, it should not be understood that the separation of various device components of the aforementioned embodiments is required for all the embodiments, and it should be understood that the aforementioned program components and apparatuses may be integrated into a single software product or packaged into multiple software products. The embodiments disclosed in the present specification and the drawings are intended merely to present specific examples in order to aid in understanding of the present disclosure, but are not intended to limit the scope of the present disclosure. It will be apparent to those skilled in the art that various modifications based on the technical spirit of the present disclosure, as well as the disclosed embodiments, can be made. | 19,956 |
11862383 | DETAILED DESCRIPTION The present disclosure relates to a wireless charging coil and methods of making same. As discussed in more detail below in connection withFIGS.1-7, the stamped metal wireless charging coil comprises a series of parallel traces connected in a bifilar fashion. In other words, the wireless charging coil includes first and second coils that are parallel, closely spaced, and connected in series such that the first and second coils have parallel currents. The first and second coils could be stacked or planar and connected in series and/or parallel to meet performance requirements (e.g., electrical requirements, power requirements, etc.). The wireless charging coil could be used in any battery powered device, particularly in mobile devices (e.g., smartphones, tablets, watches, etc.). The wireless charging coil can be made to be Qi compliant, but could be adjusted to comply with any wireless transfer protocol. A wireless charging coil with a greater amount of conductive material, such as copper, can be positioned within a given space by varying (e.g., increasing) the thickness of the coil, which increases energy availability. Compared with other wireless charging coils, the wireless charging coils described herein exhibit an increased magnetic coupling effectiveness (e.g., magnetic field strength) and thereby transmit energy at a higher efficiency. FIG.1is a diagram showing processing steps10for manufacturing a wireless charging coil of the present disclosure. In step12, a metal sheet is stamped to form a first coil with tie bars. The metal sheet could be any of a variety of materials suitable for wireless power transfer (e.g., copper, copper alloy, aluminum, aluminum alloy, etc.). In step14, a metal sheet (e.g., the same metal sheet or a different metal sheet) is stamped to form a second coil with tie bars. In step16, the first coil is stamped to remove the tie bars. In step18, the second coil is stamped to remove the tie bars. In step20, the first and second coils are assembled together. In step22, the assembled coil is applied to a ferrite substrate. In step24, jumpers (e.g., leads) are attached to electrically connect the first and second coils in series (e.g., an inside end of the first coil is electrically connected to the outside end of the second coil via a jumper). The steps described above could be interchanged, consolidated, or omitted completely. For example, the coils could be stamped without first forming tie bars, and/or the first and second coils could be applied directly to the ferrite (without being assembled first), etc. Additionally, the coil could be photo-chemically etched or machined instead of stamped, or made by any other suitable manufacturing process. FIG.2is a view of a first stamped coil30with tie bars. The first coil30can be a generally rectangular planar spiral trace31, although the trace31could form any suitable shape (e.g., circular planar spiral). The dimensions of the coil30could vary depending on the application of the coil30(e.g., as used in mobile devices, wearable devices, cars, etc.). The coil30could be of any suitable thickness, such as between 0.003 in. and 0.020 in., etc., but could be thicker for higher powered applications. The coil30could be of any suitable overall dimensions, such as between 0.25 in. and 4 in. in width and/or between 0.25 in. and 4 in. in height. The trace31could also be of any suitable dimensions. For example, the trace31could be between 0.005 in. and 0.250 in. in width. The dimensions could vary depending on physical and performance requirements of the mobile device (e.g., required frequency). The coil30could be made of any suitable material for wireless power transfer, such as, for example, copper, copper alloy, aluminum, aluminum alloy, tempered copper alloy (e.g., C110), etc. The trace31of the coil30revolves around a center any number of times (e.g., 5, 10, etc.), such as to comply with any inductive or resonant power requirements. The trace31spirals to form an inside portion32at the center of the coil30. As a result, the coil30has an inside end34and an outside end36. The spaces38between the trace31are configured to be wide enough (e.g., 0.0285 in.) to accommodate the second stamped coil (described in more detail below). Tie bars40can be positioned at a plurality of locations throughout these spaces38to maintain the general shape of the coil30(e.g., prevent unwinding or deformation of the shape), such as during transportation of the coil30between locations or between stations. The outside end36could extend out at an angle, such as a generally ninety degree angle. The inside end34and outside end36can be disposed towards the same side of the coil30, but could be at any of a variety of locations in the coil30. FIG.3is a view of a second stamped coil50with tie bars. The second coil50shares most of the same features and characteristics of the first coil shown inFIG.2. The second coil50can be a generally rectangular planar spiral trace51, although the trace51could form any suitable shape (e.g., circular planar spiral). The dimensions of the coil50could vary depending on the application of the coil50(e.g., as used in mobile devices, wearable devices, cars, etc.). The coil50could be of any suitable thickness, such as between 0.003 in. and 0.020 in., etc., but could be thicker for higher powered applications. The coil50could be of any suitable overall dimensions, such as between 0.25 in. and 4 in. in width and/or between 0.25 in. and 4 in. in height. The trace51could also be of any suitable dimensions. For example the trace51could be between 0.005 in. and 0.250 in. in width. The dimensions could vary depending on physical and performance requirements of the mobile device (e.g., required frequency). The coil50could be made of any suitable material for wireless power transfer, such as, for example, copper, copper alloy, aluminum, aluminum alloy, tempered copper alloy (e.g., C110), etc. The trace51of the coil50revolves around a center any number of times (e.g., 5, 10, etc.), such as to comply with any inductive or resonant power requirements. The trace51spirals to form an inside portion52at the center of the coil50. As a result, the coil50has an inside end54and an outside end56. The spaces58between the trace51are configured to be wide enough (e.g., 0.0285 in.) to accommodate the first stamped coil30(described above). Tie bars60can be positioned at a plurality of locations throughout these spaces58to maintain the general shape of the coil50(e.g., prevent unwinding or deformation of the shape), such as during transportation of the coil50between locations or between stations. The outside end56does not extend out as with the first coil30(but could). The inside end54and outside end56can be disposed towards the same side of the coil50, but could be at any of a variety of locations in the coil50. FIG.4is a view of an assembled coil170after the tie bars of the first and second stamped coils130,150have been removed. As shown, the first and second coils130,150fit into each other. More specifically, the first coil130fits into the space formed between the trace151of the second coil150, and conversely, the second coil150fits into the space formed between the trace131of the first coil130. However, when assembled, there are small gaps between the trace131of the first coil130and the trace151of the second coil150(e.g., 0.003 in., 0.004 in., etc.), as discussed below in more detail. As a result, together the first and second coils130,150together form a parallel planar spiral. Also shown, the inside end134of the first coil130is adjacent to the inside end154of the second coil150, and the outside end136of the first coil130is adjacent to the outside end156of the second coil150. However, the ends could be any relative distance from one another. This stamping method could have an average space width variation of at least approximately 0.003 in. for the assembled coil170. The maximum and minimum variance are dependent on the assembled coil170dimensions (e.g., overall height and width). The tight tolerances and rectangular cross-sectional shape of the traces130,131could result in a fill ratio (e.g., 85%) greater than current industry coils (e.g., 65%), such as wound coils, etched coils, etc. For example, the rectangular cross-sectional shape achieved from stamping (seeFIG.9below) provides a potentially greater fill ratio than the circular cross-sectional shape of a round wire (e.g., round copper wire). More specifically, a 0.010 in. diameter insulated round wire (0.009 diameter in. wire with 0.0005 in. insulation) could provide a 65% fill ratio, compared to a stamped coil with a rectangular cross section having a 0.006 thickness and 0.003 spacing gap. Further, the wireless charging coil170can operate under higher ambient temperatures than other current industry wires (e.g., Litz wire), and is not susceptible to degradation by vibration, shock, or heat. This is partly because the wireless charging coil170is made of a single-monolithic conductor (e.g., not a multi-strand wire). This can be compared to the individual strands of a Litz wire, which has insulation material separating each of the individual wire strands which cannot withstand higher temperatures. FIG.5is a view of the assembled wireless charging coil270with jumpers attached. Although not shown, a jumper could be attached to the first outside end236. As shown, the inside end234of the first coil230is electrically connected to the outside end256of the second coil250by a first jumper274. These ends234,256are relatively proximate to one another, and disposed on the same side of the coil270to allow for a short jumper274. A second jumper276is then used to electrically connect the inside end254of the second coil with the mobile device circuitry. The outside end236and inside end254are relatively proximate and disposed towards the same side of the coil270, to provide for a short jumper276and for ease of electrical wiring with the electronic device. The result is a pair of parallel, closely spaced coils230,250connected in series such that the first and second traces230,250have parallel currents (e.g., the currents of each trace are in the same clockwise or counter-clockwise direction). When fully assembled with the other components of the electronic device, the inside portion272of the assembled coil270is insulated (e.g., by plastic and glue) to ensure proper performance. The assembled wireless charging coil270can have any number of windings, depending upon electrical requirements. The wireless charging coil270could be used in any battery powered device, such as smartphones. The assembled coil270could be of any suitable overall dimensions (e.g., 1.142 in. width and 1.457 in. height, etc.). The coil length could be of any suitable length (e.g., 48.459 in.). FIG.6is a close up view of portion A ofFIG.5. As shown, there are very small gaps278(e.g., voids) between the trace231of the first coil230and the trace251of the second coil250(e.g., 0.003 in., 0.004 in., etc.), although there could be increased gaps280at the corners to account for the bends in the traces231,251(e.g., such that the gap increase alternates). These tight tolerances could result in a fill ratio greater than current industry methods. The assembled wireless charging coil270could provide direct current (DC) resistance (ohms), alternating current (AC) resistance, and/or AC/DC resistance ratios at a number of different values depending on the dimensions of the charging coil270and material(s) used in construction of the charging coil. The values could be adjusted to achieve high AC/DC ratios to meet induction standards. The coil dimensions could be varied to achieve varying resistance depending on the performance characteristics required. For example, for a resistance of 0.232 ohms using C110 alloy, the traces230,250could have a cross section of 0.0001234 in.2(e.g., 0.005 in. thickness and 0.0246 in. width, or 0.004 in. thickness and 0.0308 in. width, etc.), and for a resistance of 0.300 ohms using C110 alloy, the traces230,250could have a cross section of 0.0000953 in.2(e.g., 0.005 in. thickness and 0.019 in. width, or 0.004 in. thickness and 0.0238 in. width, etc.). The stamped wireless charging coil270can achieve a high trace thickness and/or high overall aspect ratio compared to other current industry methods (e.g., printed circuit board (PCB) etched coils). FIG.7is a view of an electrical component assembly390including a wireless charging coil370. More specifically, the wireless charging coil370is attached to ferrite substrate392and in conjunction with a near field communication (NFC) antenna394having contact paddles. The wireless charging coil370and NFC antenna394could have contact pads (e.g., gold) to connect the wireless charging coil370and NFC antenna394to the circuitry of the mobile device. The assembly comprises a first jumper374, a second jumper376, and a third jumper377connecting the various ends of the coil370, as explained above in more detail. There could be a film (e.g., clear plastic) over the wireless charging coil370and NFC antenna394, with the jumpers374,376,377on top of the film and only going through the film at the points of connection. This prevents accidentally shorting any of the electrical connections of the coil370. Alternatively, the jumpers374,376,377could be insulated so that a film is not needed. To minimize space, the wireless charging coil370is within the NFC antenna394with jumpers376,377that extend to the outside of the NFC antenna394. However, the wireless charging coil370and jumpers376,377could be placed at any location relative to the NFC antenna394. The total thickness of the assembly could vary depending on various potential needs and requirements. For example, the jumpers could be 0.05-0.08 mm thick, the film could be 0.03 mm thick, the NFC antenna394and coil370could be 0.08 mm thick, and the ferrite392could be 0.2 mm thick for a total wireless charging coil thickness of approximately 0.36 mm. FIG.8is a schematic view of an assembled wireless charging coil470with planar bifilar coils. As discussed above, the wireless charging coil470includes a first coil430(e.g., trace) and a second coil450(e.g., trace). The assembled coil470is manufactured and operates in the manner discussed above with respect toFIGS.1-7. The first coil430and the second coil450can have any desired thickness, such as to meet different power requirements. The first coil430and second coil450could be connected in series or parallel. The width of the first and/or second coil430,450could vary along the length of the coil to optimize performance of the assembled wireless charging coil470. Similarly, the thickness of the first and second coils430,450could change over the length of the coil. For example, the width (and/or thickness) of the first coil430could gradually increase (or narrow) from a first end434towards a middle of the coil430, and the width (and/or thickness) could likewise gradually narrow (or increase) from the middle to the second end436of the coil430(e.g., a spiral coil of wide-narrow-wide), thereby varying the cross-sectional area throughout. Any variation of width (e.g., cross-section) or thickness could be used, and/or these dimensions could be maintained constant over portions of the coil, according to desired performance characteristics. Additionally (or alternatively), the spaces between the windings of the coil could be varied to optimize performance of the wireless charging coil470. For example, the gap width between the traces could be wider towards the outside of the first coil430and narrower towards the inside of the first coil430(or the opposite). Similarly, the distance between the first coil430and second coil450in the assembled coil470could also be varied to optimize performance. Further, the geometry of the edges of the coil could be varied (e.g., scalloped, castellated, etc.), such as to reduce eddy currents. FIG.9is a cross-sectional view of a portion of the wireless charging coil ofFIG.8. The first coil430comprises sections414-424and the second coil450comprises sections402-412. As shown, the cross-section of the first coil430becomes gradually wider and then narrower from a first end to a second end of the first coil430. As a result, sections414and424are the narrowest (e.g., 0.025 in.), followed by sections404and422(e.g., 0.030 in.), and sections418and420are the widest (e.g., 0.035 in.). In the same way, the cross-section of the second coil450becomes gradually wider and then narrower from a first end to a second end of the second coil450. As a result, sections402and412are the narrowest, and sections406and408are the widest. Changes in the dimensions of the cross section of the antenna can likewise be varied in other manners. FIG.10is a schematic view of an assembled wireless charging coil570with stacked bifilar coils. As discussed above, the wireless charging coil570includes a first coil530and a second coil550. The assembled coil570is manufactured and operates in the manner discussed above with respect toFIGS.1-7, as well as that discussed inFIGS.8-9, except that the first and second coils530,550are stacked instead of planar. The first coil530includes a first end534and a second end536, and the second coil550includes a first end554and a second end556. Further, varying the skew or offset (e.g., stacking distance) of the first coil530relative to the second coil550can affect the performance of the wireless charging coil570. The first coil530and second coil550could be connected in series or parallel. FIG.11is a cross-sectional view of a portion of the wireless charging coil ofFIG.10. This coil570is similar to that ofFIGS.8-9, including a first coil530with sections514-524and a second coil550with sections502-512, except that the first and second coils530,550are stacked instead of planar. FIGS.12-13are views showing an electrical component assembly690. More specifically,FIG.12is a perspective view of an electrical component assembly690. The electrical component assembly690comprises a ferrite shield692, a pressure sensitive adhesive (PSA) layer602positioned on the ferrite shield692, an assembled coil670(e.g., bifilar coil) positioned therebetween, and jumpers674,676positioned on the PSA layer602. FIG.13is an exploded view of the electrical component assembly690ofFIG.12. The bifilar coil670includes a first coil630having an inside end634and an outside end636interconnected with a second coil650having an inside end654and an outside end656. The inside and outside ends are on the same side of the assembled coil670for ease of use and assembly (e.g., minimize the distance to electrically connect the ends). Ferrite shield692includes a first hole696and a second hole698positioned to correlate with the placement of the inside end634of the first coil630and the inside end654of the second coil650(e.g., when the coil670is placed onto the ferrite shield692. Although holes696,698are shown as circular, any shape and size openings could be used (e.g., one rectangular opening, etc.). These holes696,698facilitate assembly and welding of the electrical component assembly690. PSA layer602and ferrite shield692are similarly sized to one another, and although shown as rectangular, both could be of any shape (e.g., circular). PSA layer secures the relative placement of the assembled coil670to the ferrite shield692. PSA layer602could have adhesive on one or both sides, and could include a polyethylene terephthalate (PET) film area604free of adhesive on one or both sides. PET film area604facilitates assembly and welding of the electrical component assembly690 PSA layer602includes a first hole606and a second hole608in the PET film area604which correlate in position with the placement of the inside end634of the first coil630and the inside end654of the second coil650(as well as the first hole696and second hole698of the ferrite substrate692). Although holes606,608are shown as circular, any shape and size openings could be used (e.g., one rectangular opening). Holes606,608provide access through the PSA layer602to electrically connect jumpers674,676with the inside ends634,654of the assembled coil670. The PET film area604facilitates attachment of the jumpers674,676to the assembly690. FIG.14is a perspective view of a resonant coil730. Resonant coil730could be a generally rectangular planar spiral trace731, although the trace731could form any suitable shape. The resonant coil730includes an inside end734and an outside end736. The trace731is stamped on a strip or sheet of metal (e.g., copper, aluminum, etc.). The dimensions of the coil730could vary depending on the application of the coil730. The coil730could be of any suitable thickness, and of any suitable overall dimensions. The trace731could also be of any suitable dimensions. The dimensions could vary depending on physical and performance requirements. The coil730could be made of any suitable material for wireless power transfer, such as, for example, copper, copper alloy, aluminum, aluminum alloy, tempered copper alloy (e.g., C110), etc. The gaps between the windings of the trace731are larger for a resonant coil than for other types of inductive coils due to performance requirements. Stamping provides a scalable process for high volume production with high yields. The stamped trace731is not prone to unwinding and can allow for a thicker trace. This is advantageous compared with other existing technologies. For example, winding wire (e.g., copper) to a specific pattern on a surface is difficult and the wound wire can unwind. Further, etched copper is expensive and could be limited to a maximum thickness (e.g., 0.004 in. thick). The trace731of the resonant coil730includes a first side737and a second side739offset from the first side737by angled portions741of the trace731. The angled portions741are aligned with one another (e.g., occur along line B-B), and angled in the same direction. In other words, angled portions741are all angled toward a particular side of the coil730(e.g., towards one side of line A-A), such that a first portion737(e.g., upper portion) of the coil730is shifted relative to a second portion739(e.g., lower portion) of the coil730. FIG.15is a perspective view of a resonant coil assembly790, including the first resonant coil730fromFIG.14. The resonant coil assembly790includes a first coil730and a second coil750, which are identical to one another (which minimizes manufacturing costs). The resonant coil assembly790could be laminated such that the first coil730and second coil750are laminated to a film702(e.g., PET film), such as by an adhesive (e.g., heat activated, pressure sensitive, etc.) to provide more stability in downstream operations. The first coil730could be adhered to one side of the film702and the second coil750could be adhered to the opposite side of the film702. The first coil730includes an outside end736and an inside end734, and the second coil750includes an outside end756and an inside end754. The first coil730and second coil750could be exactly the same size and shape coil, except that the second coil750is rotated 180 degrees about line D-D. In this way, the trace731of the first coil730is positioned between the gap formed by the windings of the trace751of the second coil750(and vice-versa), except at the angled portions of each coil along line D-D, where the traces cross one another. The inside end734of the first coil730could be adjacent to (and in electrical connection with) the inside end754of the second coil750, and the outside end736of the first coil730could be adjacent to the outside end756of the second coil750. FIGS.16-18are views of a stamped resonant coil870.FIG.16is a perspective view of a folded stamped resonant coil870. The coil870comprises connector sheet871, a first set of traces831of a first coil portion830with ends thereof connected to an edge of the connector sheet871at connection points873, and a second set of traces851of a second coil portion850with ends thereof connected to the same edge of the connector sheet871at connection points873. To create the stamped resonant coil870, a (single) sheet of metal is stamped to form the first set of traces831and the second set of traces851(e.g., such that the arcs of each trace of the first and second sets of traces831,851are oriented in the same direction). The ends of the first and second set of traces831,851are then connected to the same edge of connector sheet871(e.g., insulation material). The connector sheet871facilitates wiring of the sets of traces831,851to each other, as well as facilitates the connection of the stamped resonant coil870to electronic circuitry. The ends of the first and second set of traces831,851are then wired to each other, such as by using a series of jumpers and/or traces. For example, the jumpers and/or traces could be in the connector sheet871and could run parallel to the connector sheet (and perpendicular to the first and second sets of traces831,851). FIG.17is a perspective view of the coil870ofFIG.16partially opened. As shown, the first set of traces831of the first coil portion830are bent at connection points873.FIG.18is a perspective view of the coil870ofFIG.16fully opened. As shown, the first set of traces831of the first coil portion830continue to be bent at connection points873until the first coil portion830is planar with the second coil portion850. Bending of the traces could result in fracturing on the outside surface thereof, in which case, ultrasonic welding could be used to ensure electrical conductivity. Alternatively, the first and second sets of traces831,851could connect to opposing edges of the connector sheet871, such that bending could not be required. Stamping (and bending) in this way reduces the amount of scrap generated, thereby increasing material utilization. FIG.19is an exploded view of a low profile electrical component assembly990. More specifically, the low profile electrical component assembly990comprises a substrate992(e.g., PET layer), a filler material layer933(e.g., rubber, foam, durometer, etc.), a coil930(e.g., resonant coil), and a protective layer902. The protective layer902could be partly translucent and could comprise a tab (e.g., for applying or removing). FIG.20is a perspective view of the filler material933ofFIG.19. Filler material933comprises grooves935which correspond in size and shape to that of the coil930. In this way, the coil930is nested in filler material933, which protects the coil shape from bending and/or deformation. Such an assembly facilitates handling of the coil930for subsequent operations. FIG.21is a diagram showing processing steps1000for manufacturing a wireless charging coil with adhesive (e.g., glue). In step1002, a metal sheet is stamped to form a first coil with tie bars. In step1004, a metal sheet is stamped to form a second coil with tie bars. In step1006, a first coil is applied to a first laminate (e.g., plastic substrate, Transilwrap) with an adhesive layer to adhere thereto. In step1008, a second coil is applied to a second laminate (e.g., plastic substrate, Transilwrap) with an adhesive layer to adhere thereto. In step1010, the first coil is stamped to remove tie bars. In step1012, the second coil is stamped to remove tie bars. Accordingly, the first coil and second coil are fixed in place as a result of the adhesive layer on the plastic laminate. In step1014the first coil with the laminate adhered thereto, is assembled with the second coil with the laminate adhered thereto. More specifically, as discussed above, the first coil with a spiral trace fits into the space formed between a trace of a second coil, and conversely, the second coil fits into the space formed between the trace of the first coil, thereby forming an assembled coil. As a result, the assembled coil is positioned between (e.g., sandwiched between) the first laminate and the second laminate. In step1016, a heat press is applied to the assembled coil to displace and set the adhesive layer from the first and second laminates. More specifically, the heat applied should be hot enough to melt the adhesive (e.g., more than 220-250° F.), but not hot enough to melt the plastic laminate. The pressure applied pushes the first coil towards the second laminate, such that the adhesive of the second laminate positioned in between the trace of the second coil is displaced and forced between the spaces between the first trace of the first coil and the second trace of the second coil. Squeezing the first and second coils together (e.g., with heat and/or pressure) migrates the adhesive to the spaces in between the traces (e.g., to insulate them from one another). This covers or coats the traces of the first coil and the second coil, and bonds the first coil to the second coil. The pressure, heat, and duration could vary depending on the desired cycle time for manufacturing the assembled coil. It is noted that such a process could result in a planar offset of the first coil from the second coil when assembled together. FIG.22is a partial cross-sectional view of a first stamped coil1130when applied to a first laminate1123. The first laminate1123includes an adhesive layer1127applied to a surface thereof. When the first stamped coil1130is applied to the first laminate1123, some of the adhesive1127is displaced to the sides, such that the displaced adhesive1127accumulates against the sides of the trace1131of the first stamped coil1130. Accordingly, the adhesive1127on the sides and underneath the trace1131of the first stamped coil1130prevents the trace1131from moving relative to the first laminate1123. FIG.23is a partial cross-sectional view of an assembled coil positioned between a first laminate1123and second laminate1125. As described above, when assembled, the first coil1130with a first trace1131fits into the space formed between a second trace1151of a second coil1150, and conversely, the second coil1150fits into the space formed between the first trace1131of the first coil1130, thereby forming an assembled coil1170. As a result, the assembled coil1170is positioned between (e.g., sandwiched between) the first laminate1123and the second laminate1125. This displaces the first adhesive1127between the first trace1131of the first coil1130, and displaces the second adhesive1129between the second trace1151of the second coil1150. When the first and second adhesive layers1127,1129are set (e.g., by pressure and/or heat), the adhesive covers the surface of the traces1131,1151(e.g., by melting), and acts as an insulator and stabilizer for the traces1131,1151. In other words, the first and second coils1130,1150are bonded together. This prevents relative movement of the traces1131,1151, which prevents the first stamped coil1130from contacting the second stamped coil1150and shorting out the assembled coil1170. As an example, the first and second stamped coils1130,1150could each be 0.0125 in. thick, and each adhesive layer1127,1129could be 0.0055 in. thick, for a total thickness of 0.0225 in. After pressure and/or heat have been applied, the total thickness could be 0.0205 in., with a total adhesive displacement of 0.002 in. FIGS.24-25are partial views of an assembled coil1170. More specifically,FIG.24is partial cross-sectional view of an assembled coil1170, andFIG.25is a partial top view of the assembled coil1170ofFIG.24. The assembled coil1170comprises (as discussed above) a first coil1130with a spiral trace1131, which fits into the space formed between a trace1151of a second coil1150, and conversely, the second coil1150fits into the space formed between the trace1131of the first coil1130. Accordingly, the first and second coils1130,1150form a parallel planar spiral. As discussed above, a first laminate1123(e.g., Transilwrap) with a first adhesive layer is applied to the first stamped coil1130, and a second laminate1125(e.g., Transilwrap) with a second adhesive layer applied to the second stamped coil1150. As a result, the first and second stamped coils1130,1150are positioned between the first and second laminates1123,1125. When the first and second coils1130,1150are assembled with one another, the adhesive1127(dyed black for clarity) is displaced to fill the spaces between the first and second traces1131,1151. FIG.25shows the displacement of adhesive1127when the first coil1130and second coil1150are assembled. More specifically, the adhesive1127(dyed black for clarity) is shown between the first trace1131and the second trace1151. Further, in the particular example shown, more pressure has been exerted on the left side first and second traces1131a,1151a, than the right side traces1131b,1151b. As a result, less adhesive1127has been displaced on the right side than the left side, thereby making the right side trace1151bless visible than the left side trace1151a(as a result of the black dyed adhesive1127). FIG.26is a top view of an assembled coil1270of the present disclosure. As discussed above, the assembled coil1270comprises a first coil1230with a first spiral trace1231having an inside end1234and an outside end1236, a second coil1250with a second spiral trace1251having an inside end1254and an outside end1256, a first jumper1277attached to the outside end1236of the first coil1230, a second jumper1274attached to the inside end1234of the first coil1230and the outside end1256of the second coil1250, and a third jumper1276attached to the inside end1254of the second coil1250. The first and second spiral coils1230,1250forming an inside portion1272. A laminate1227(e.g., film, adhesive film, plastic film, etc.) covers the assembled coil1270including the inside portion1272. As explained above, the adhesive layer of the laminate1227stabilizes the first coil1230and second coil1250and insulates them. This prevents relative movement of the first and second coil1230,1250and prevents the first and second coils1230,1250from accidentally contacting one another and shorting out the assembled coil1270 The laminate1227could define one or more cutouts. More specifically, the laminate1227could define an inside cutout1223to provide access to (e.g., expose) the first inside end1234of the first coil1230and the second inside end1254of the second coil1250. The laminate1227could also define an outside cutout1225to provide access to (e.g., expose) the first outside end1236of the first coil1230and the second outside end1256of the second coil1250. The first cutout1223could extend to substantially of the inside portion1272. The assembled coil1270(and the first and second coils1230,1250thereof) could be of any material and/or style (e.g., A6 style coil). FIGS.27-33are directed to another wireless charging coil assembly1300of the present disclosure.FIGS.27-29and31are respectively perspective, front, side, and exploded views of the wireless charging coil assembly1300.FIG.30is an enlarged view of Area30-30ofFIG.29. The wireless charging coil assembly1300includes a first coil1302a, a second coil1302b, and a film1304. FIG.32is a front view of the first and second coils1302a,1302b, which can be identical in structure to minimize manufacturing costs. The first and second coils1302a,1302beach include an inside end1306a,1306b, an outside end1308a,1308b, and a trace1310a,1310bextending from the respective inside end1306a,1306b, to the respective outside end1308a,1308b. The inside ends1306a,1306bof the first and second coils1302a,1302bcan be first portions of the respective traces1310a,1310b, while the outside ends1308a,1308bof the first and second coils1302a,1302bcan be second portions of the respective traces1310a,1310b. The inside ends1306a,1306bcan be formed as a tab that is wider than the trace, while the outside ends1308a,1308bcan be formed as elongated tabs. In this regard, the inside ends1306a,1306bcan have any suitable shape such as a square shape, while the outside ends1308a,1308bcan have any suitable shape such as a rectangular shape. The first and second coils1302a,1302bare stamped from a strip or sheet of metal, and can be made of any suitable material for wireless power transfer, such as, for example, copper, copper alloy, aluminum, aluminum alloy, tempered copper alloy (e.g., C110), etc. The dimensions of the first and second coils1302a,1302bcould vary depending on the application of the wireless charging coil assembly1300. The traces1310a,1310bcould also be of any suitable dimensions depending on physical and performance requirements. The first and second coils1302a,1302bcan be exactly the same size and shape, with the second coil1302brotated 180 degrees when the wireless charging coil assembly1300is formed, as discussed in greater detail below. FIG.33is a front view of the film1304. The film1304can be a thin dielectric film that includes a body1312having a first side1314, a second side1316, an inner aperture1318, and an outer aperture1320. The first and second sides1314,1316can include an adhesive thereon that allows each of the first and second coils1302a,1302bto be secured to one of the first and second sides1314,1316. The inner aperture1318extends through the body1312, e.g., from the first side1314to the second side1316, and is sized and shaped to match the size and shape of the inside ends1306a,1306bof the first and second coils1302a,1302b. The inner aperture1318is positioned in the body1312to correlate with the placement of the inside ends1306a,1306bof the first and second coils1302a,1302b, e.g., when the first coil1302ais placed on the first side1314of the film1304and the second coil1302bis placed on the second side1316of the film1304. The outer aperture1320extends through the body1312, e.g., from the first side1314to the second side1316, and is sized and shaped to match the size and shape of the outside ends1308a,1308bof the first and second coils1302a,1302bwhen the outside ends1308a,1308bare positioned adjacent to each other. As such, the outer aperture1320is positioned in the body1312to correlate with the placement of the outside ends1308a,1308bof the first and second coils1302a,1302b, e.g., when the first coil1302ais placed on the first side1314of the film1304and the second coil1302bis placed on the second side1316of the film1304. The inner aperture1318facilitates assembly and electrical connection (e.g., through welding, soldering, electrical bonding, or other means) of the wireless charging coil assembly1300, and the outer aperture1320provides access to the outside ends1308a,1308bof the first and second coils1302a,1302bfrom both sides1314,1316of the film1304, e.g., the outside ends1308a,1308bcan be contacted by or connected to another electrical component from either or both sides1314,1316of the film1304. While the inner aperture1318is shown as square and the outer aperture1320is shown as rectangular, it should be understood by a person of ordinary skill in the art that any suitable size and shape openings could be utilized so long as they generally match the shape of the inside ends1306a,1306bof the coils1302a,1302b(for the inner aperture1318) and the outside ends1308a,1308bof the coils1302a,1302b(for the outer aperture1320). As shown inFIGS.27-31, the wireless charging coil assembly1300is constructed such that the first coil1302ais adhered to the first side1314of the film1304, e.g., by adhesive on the first side1314, and the second coil1302bis adhered to the second side1316of the film1304, e.g., by adhesive on the second side1316, but rotated 180 degrees with respect to the first coil1302a. As shown inFIGS.28and30, the film1312generally extends beyond the first and second coils1302a,1302b. The first coil1302ais adhered to the film1304with the inside end1306athereof positioned adjacent the inner aperture1318of the film1304and the outside end1308athereof positioned adjacent the outer aperture1320of the film1304. The second coil1302bis adhered to the film1304with the inside end1306bthereof positioned adjacent the inner aperture1318of the film1304overlapping the inside end1306aof the first coil1302a, and the outside end1308bthereof positioned adjacent the outer aperture1320of the film1304adjacent the outside end1308aof the first coil1302a. The inside ends1306a,1306bof the first and second coils1302a,1302bare secured to each other (e.g., through welding, soldering, electrical bonding, or other means) such that they are electrically connected and the first and second coils1302a,1302bform a single circuit. The outside ends1308a,1308bof the first and second coils1302a,1302bare positioned adjacent each other in the outer aperture1320such that they can be engaged from both sides of the wireless charging coil assembly1300. For any of the embodiments discussed above, the wireless charging coil (e.g., bifilar coil) could be constructed and then (e.g., at a different location and/or time) the first and second coils of the wireless charging coil, whether stacked or planar, could be electrically connected to each other in series or parallel depending on electrical requirements. Having thus described the system and method in detail, it is to be understood that the foregoing description is not intended to limit the spirit or scope thereof. It will be understood that the embodiments of the present disclosure described herein are merely exemplary and that a person skilled in the art may make any variations and modification without departing from the spirit and scope of the disclosure. All such variations and modifications, including those discussed above, are intended to be included within the scope of the disclosure. | 41,652 |
11862384 | DETAILED DESCRIPTION OF THE EMBODIMENT(S) Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, in the description of the drawings, the same reference numerals denote the same or equivalent elements, duplicated descriptions thereof will be omitted. FIG.1is a perspective view showing a schematic configuration in the case of full-bridge rectification in the transformer according to the present embodiment.FIG.2is a circuit diagram showing a schematic configuration in the case of full-bridge rectification in the transformer according to the present embodiment.FIG.3is a perspective view showing a schematic configuration in the case of center-tapped rectification in the transformer according to the present embodiment.FIG.4is an exploded perspective view showing a schematic configuration of a secondary coil and a bus bar in the case of center-tapped rectification in the transformer according to the present embodiment (the primary coil is omitted).FIG.5is a circuit diagram showing a schematic configuration in the case of center-tapped rectification in the transformer according to the present embodiment. The transformer10according to the present embodiment is mounted on a power supply device for use. As shown inFIGS.1to5, the transformer10becomes a structure comprising a primary coil and two secondary coils (a first secondary coil11and a second secondary coil12) (The end of the primary coil to which a switching circuit is connected is the upper terminal part ofFIGS.1and3). In addition, in the present embodiment, a transformer having such a structure is shown as an example, but it is not limited thereto, and various coil components such as an inductor having such a structure may be used. In addition, in the present embodiment, a switching circuit that transmits power supplied from an input power supply to the first secondary coil11and the second secondary coil12is connected to the primary coil. In this way, by switching between ON/OFF of the switching circuit, it is possible to control such that the power supplied from the input power supply is transmitted from the primary coil to the first secondary coil11and the second secondary coil12. In addition, the first secondary coil11composed of a winding of a metal plate includes: a first plate coil111; a second plate coil112and a first holding portion113formed between one end111aof the first plate coil111and one end112aof the second plate coil112. The second secondary coil12composed of a winding of a metal plate includes: a third plate coil121; a fourth plate coil122; and a second holding portion123formed between one end121aof the third plate coil121and one end122aof the fourth plate coil122, and has a connection hole124that is notched. The first secondary coil is formed such that the first plate coil and the second plate coil are opposed to each other substantially in parallel, the second secondary coil is formed such that the third plate coil and the fourth plate coil are opposed to each other substantially in parallel. The first secondary coil11is arranged between the third plate coil121and the fourth plate coil122of the second secondary coil12. The other end111bof the first plate coil111and the other end121bof the third plate coil121are connected by solder, and the other end112bof the second plate coil112and the other end122bof the fourth plate coil122are connected by solder. That is, the two secondary coils11and12in the present embodiment are combined with each other to form a parallel structure by installing the first secondary coil11inside the second secondary coil12as the winding of the metal plate, and connecting the first secondary coil11and the second secondary coil12with solder. In addition, considering the skin effect of the high-frequency current, it is preferable that the two secondary coils have a parallel connection structure to reduce the loss caused by the skin effect. However, it is not limited to thereto, and the secondary coil may be appropriately thickened to adopt a single secondary coil structure. In addition, in the present embodiment, in order to rectify the power transmitted from the primary coil to the first secondary coil11and the second secondary coil12and output it to a smoothing circuit equipped with output terminals, a secondary-side rectifier circuit is connected to the transformer10. Also, according to the location where the secondary-side rectifier circuit is connected, the secondary-side rectifier circuit is divided into a center-tapped rectifier circuit and a rectifier circuit other than the center-tapped rectifier circuit. Specifically, when the secondary-side rectifier circuit is connected to the outputs terminals4and6of the secondary coil (that is, the end where the other end111bof the first plate coil111and the other end121bof the third plate coil121are connected by solder, and the end where the other end112bof the second plate coil112and the other end122bof the fourth plate coil122are connected by solder), the secondary-side rectifier circuit is referred to as a rectifier circuit other than the center-tap rectifier circuit. As an example, a full-bridge rectifier circuit as shown inFIG.2can be cited. In addition, when the secondary-side rectifier circuit is connected to the output terminals4and6of the secondary coil, the first holding portion113and the second holding portion123are connected by solder through the connection hole124provided in the second holding portion123, wherein the first holding portion113is formed between one end111aof the first plate coil111and one end112aof the second plate coil112, the second holding portion123is formed between one end121aof the third plate coil121and one end122aof the fourth plate coil122. In addition, the first plate coil111and the third plate coil121and the second plate coil112and the fourth plate coil122are separated from each other by insulating tapes, respectively. On the other hand, when the secondary-side rectifier circuit is connected not only to the output terminals4and6of the secondary coil, but also connected to the intermediate terminal5of the secondary coil, that is, when the first holding portion113formed between one end111aof the first plate coil111and one end112aof the second plate coil112, the second holding portion123formed between one end121aof the third plate coil121and one end122aof the fourth plate coil122, and one end of the bus bar13described below are connected to the other end of the bus bar13connected by solder through the connection hole124provided in the second holding portion123, the secondary-side rectifier circuit is referred to as a center-tapped rectifier circuit. As an example, a full-wave rectifier circuit as shown inFIG.5can be cited. That is, it is possible to switch the secondary-side rectification method between, for example, a full-bridge rectification method and a center-tapped rectification method by providing a bus bar on the intermediate end side of the secondary coil. In this way, the other end of the first plate coil and the other end of the third plate coil are connected by solder, and the other end of the second plate coil and the other end of the fourth plate coil are connected by solder, when the secondary-side rectifier circuit is a center-tapped rectifier circuit, the first holding portion, the second holding portion, and the bus bar are connected by solder through the connection hole, when the secondary-side rectifier circuit is a rectifier circuit other than the center-tapped rectifier circuit, the first holding portion and the second holding portion are connected by solder through the connection hole, so that the screw fastening structure is not used, and the secondary coil is connected by solder to be used as a set of secondary coils. As a result, the end portions111b,122band the bus bar13are directly soldered to the substrate with solder to reduce the current line loss and improve the heat dissipation, and the center-tapped rectification can be used as well as the rectification in the structure where the intermediate terminal of the secondary coil is connected by solder and the two ends of the secondary coil are output (that is, the case where center-tapped rectification is not used). In addition, in the present embodiment, it is preferable that the bus bar13is thicker than the thickness of the respective plates of the first plate coil111, the second plate coil112, the third plate coil121, and the fourth plate coil122, and is arranged between the substrate on which the transformer10is mounted and the second holding portion123, or between the substrate on which the transformer10is mounted and the drawn out portion of the other end of at least either one of the third plate coil and the fourth plate coil. By using a bus bar thicker than the thickness of the plate of the plate coil, the heat of each plate coil is easily dissipated to the bus bar, and the line loss of the current flowing in the bus bar can also be reduced. Therefore, the heat dissipation effect of the transformer is further improved. In addition, by arranging the bus bar between the substrate on which the transformer is mounted and the holding portion of the coil, or between the substrate on which the transformer is mounted and the drawn out portion of the end (terminal) of the coil, effective utilization of the substrate space and miniaturization of the substrate can be achieved. The preferred embodiments of the present invention have been described above. However, various changes and modifications can be made without departing from the gist of the present invention. | 9,690 |
11862385 | DETAILED DESCRIPTION Technical solutions of embodiments of the present disclosure will be clearly and completely described below. Obviously, the described embodiments are merely some embodiments, but not all embodiments of the present disclosure. Based on the embodiments of the present disclosure, all of the other embodiments obtained by one of ordinary skill in the art without making any creative work belong to the protection scope of the present disclosure. According to a first aspect of the present disclosure, an electromagnetic device is provided, wherein the electromagnetic device comprises: a substrate defining a plurality of annular receiving grooves, wherein each annular receiving groove divides the substrate into a central portion surrounded by the annular receiving groove and a peripheral portion surrounding the annular receiving groove, each central portion defines a plurality of inner via holes running through the substrate, and each peripheral portion defines a plurality of outer via holes running through the substrate; a plurality of magnetic cores each received in a corresponding one of the plurality of annular receiving grooves; at least two transmission line layers, wherein each of two opposite sides of the substrate is provided with one of the transmission line layers, each transmission line layer comprises a plurality of wire patterns arranged spacedly, and each wire pattern is bridged between one of the inner via holes and one of the outer via holes corresponding to each other; and a plurality of conductive members, which are respectively disposed in each of the inner via holes and each of the outer via holes, and are configured to sequentially connect the wire patterns on the two transmission line layers so as to form a coil circuit capable of surrounding the magnet cores; wherein, the plurality of central portions on the substrate, the peripheral portions corresponding thereto, the plurality of magnet cores, the plurality of conductive members, and the transmission line layers located at the two opposite sides of the substrate form a plurality of transformers and/or a plurality of filters; wherein, the electromagnetic device further comprises a first side surface being perpendicular to the transmission line layers, the first side surface is provided with an insertion slot, the insertion slot runs through the electromagnetic device along an axial direction of one of the inner via holes, and the insertion slot is configured to fix and connect the first adapter plate. In some embodiments, the electromagnetic device further comprises a second side surface and a first conductive pin, the second side surface is parallel to the transmission line layers; the first conductive pin is disposed on at least one of a side wall of the electromagnetic device surrounding the insertion slot and the second side surface, and the first conductive pin is electrically connected with at least one of the transmission line layers. In some embodiments, the first conductive pin is disposed on the second surface or disposed on both the side wall and the second surface, and extends to a junction between the second side surface and the side wall. According to a second aspect of the present disclosure, a connector is provided, wherein the connector comprises a first adapter plate, at least one connector assembly, and at least one electromagnetic device according to the first aspect of the present disclosure; wherein, one end of the first adapter plate is inserted in the insertion slot of the at least one electromagnetic device, and is electrically connected with the at least one electromagnetic device; another end of the first adapter plate extends out of the insertion slot and is fixed to and connected with the at least one connector assembly; the at least one electromagnetic device is electrically connected with the at least one connector assembly through the first adapter plate. In some embodiments, the first adapter plate and the connector assembly are an integrated structure. In some embodiments, the insertion slot is provided therein with a connection layer, and the connection layer is sandwiched between the first adapter plate and the side wall of the insertion slot. In some embodiments, the connector assembly comprises a casing and a first conductive joint; the first conductive joint includes a first conductive connecting portion and a second conductive connecting portion, the second conductive connecting portion is disposed in the casing, and the second conductive connecting portion has one end electrically connected with the first adapter plate and another end electrically connected with the first conductive connecting portion; the first conductive connecting portion extends out of the casing, and an included angle between the first conductive connecting portion and the second conductive connecting portion is less than 90°. In some embodiments, the connector comprises at least two electromagnetic devices, the at least two electromagnetic devices are arranged to be stacked along an axial direction of the inner via hole, and the insertion slots of the at least two electromagnetic devices are aligned with each other. In some embodiments, the connector comprises at least two connector assemblies; one end of the first adapter plate is inserted in the at least two insertion slots, an end of the first adapter plate extending out of the insertion slot is sandwiched between the two connection assemblies, and the two connector assemblies are respectively fixed to and electrically connected with the first adapter plate. In some embodiments, both two opposite surfaces of the first adapter plate being in contact with each connector assembly are provided with a first pad and a second pad, the first pad is electrically connected with the second pad; wherein, the first pad is located out of the insertion slot, and the second pad is located in the insertion slot; the first pad is welded with a corresponding second conductive connecting portion, and the second pad is welded with a corresponding first conductive pin, so that the second conductive connecting portion is electrically connected with a corresponding first conductive pin. In some embodiments, the connector further comprises a second adapter plate, the at least two electromagnetic devices are fixed on the second adapter plate, and are electrically connected with the second adapter plate. In some embodiments, wherein, the second conductive connecting portion of each connector assembly is parallel to the second adapter plate. In some embodiments, the electromagnetic device further comprises a third side surface being perpendicular to the transmission line layer, the third side surface is disposed adjacently to the first side surface; the third side surface is provided thereon with a second conductive pin, and the second conductive pin is electrically connected with at least one transmission line layer; the second adapter plate is provided with a third pad, the third pad is welded with the second conductive pin, so that the electromagnetic device is fixed on the second adapter plate. In some embodiments, both the first conductive pin and the second conductive pin run through the electromagnetic device, and a clearance is provided between every two adjacent electromagnetic devices, so that two corresponding first conductive pins or two corresponding second conductive pins on the two adjacent electromagnetic devices are insulated from each other. In some embodiments, the connector further comprises an insulating layer, the insulating layer is sandwiched between every two adjacent electromagnetic devices. In some embodiments, a sum of lengths of the first conductive pin and the second conductive pin of adjacent electromagnetic devices is less than a thickness of the electromagnetic device. In some embodiments, a surface of the second adapter plate being away from the third pad is provided with a conductive needle, the conductive needle is electrically connected with the third pad, and the conductive needle is configured to electrically connect the connector with an external circuit. In some embodiments, at least one side of the connector having the transmission line layer is provided with a joint layer configured to fix and electrically connect an electronic device; the joint layer is located in the same layer as, not overlapped with, and electrically connected with the transmission line layer at the side. In some embodiments, the connector further comprises a composite layer disposed on at least one side of the connector having the transmission line layer, and configured to dispose the electronic component so that the electronic component is electrically connected with at least one transmission line layer; the composite layer includes a connection layer and a conductive layer, the connection layer is located between the conductive layer and a corresponding transmission line layer, and the electronic component is attached on the conductive layer. According to a third aspect of the present disclosure, an electronic device is provided, wherein the electronic device comprises a mother board and at least one connector according to the second aspect of the present disclosure; wherein the mother board is provided with an external circuit, and the external circuit is electrically connected with the at least one connector. In one aspect, the present disclosure provides an electromagnetic device100. As shown inFIG.1andFIG.2, in this embodiment, the electromagnetic device100can mainly comprise: a substrate10, a plurality of magnetic cores20embedded in the substrate10, two transmission line layers30located at two opposite sides of the substrate10, and a plurality of conductive members40. Wherein, referring toFIG.3, in this embodiment, the substrate10is provided thereon with a plurality of annular receiving grooves12, each annular receiving groove12divides the substrate10into a central portion14surrounded by the annular receiving groove12and a peripheral portion16corresponding to the central portion14. In this embodiment, as shown inFIG.3, the substrate is provided thereon with four annular receiving grooves12, such that the substrate10is divided into four central portions14and four peripheral portions16; wherein, the central portions14are in one-to-one correspondence with the peripheral portions16. In this embodiment, the central portion14and the peripheral portion16can be an integrated structure, that is, by defining the annular receiving groove12at a center of the substrate10, the substrate10is divided into the central portion14and the peripheral portion16. Of course, in other embodiments, the central portion14and the peripheral portion16can be split structures, for example, after a circle receiving groove is defined at a center of the substrate10, the central portion14is fixed in the circle receiving groove by means of, for example, adhesion, such that the annular receiving groove12is formed between the central portion14and the peripheral portion16, and end surfaces of the central portion14and the peripheral portion16are flush. Continuing to referFIGS.1-3, each central portion14is provided with a plurality of inner via holes15running through the substrate10, the plurality of inner via holes15are disposed adjacent to an outer sidewall of the central portion14, and are arranged along a circumferential direction of the central portion14. Correspondingly, each peripheral portion16is provided with a plurality of outer via holes17running through the substrate10, and the plurality of outer via holes17are disposed adjacent to an inner sidewall of the peripheral portion16. That is, the inner via holes15are disposed on a top surface of the central portion14and surrounds a top inner circumferential wall of the annular receiving groove12, and the outer via holes17are disposed on a top surface of the peripheral portion16and surround a top outer circumferential wall of the annular receiving groove12. Each magnetic core20is received in one annular receiving groove12on the substrate10correspondingly, a shape of a section of the magnetic core20is approximately identical to a shape of a section of the annular receiving groove12, so that the magnetic core20can be received in the annular receiving groove12. Wherein, the shape of the section of the magnetic core29can be a circle loop, a square loop, an ellipse, etc. Correspondingly, a shape of the annular receiving groove12can be a circle loop, a square loop, an ellipse, etc. In this embodiment, the annular magnet core20can be formed by a plurality of annular thin pieces stacked in turn, and can also be formed by coiling narrow and long metal materials, and can also be formed by sintering a mixture of several metals. There can be multiple kinds of methods for forming the annular magnet core20, and can be flexibly selected according to different materials, the present disclosure is not limited. The magnetic core20can be an iron core, and can also be composed of various magnetic metal oxides, such as manganese-zinc ferrite, nickel-zinc ferrite, etc. Among them, manganese-zinc ferrite has the characteristics of high magnetic permeability, high magnetic flux density and low loss, and nickel-zinc ferrite has the characteristics of extremely high resistivity and low magnetic permeability. The magnetic core20in this embodiment is made of manganese-zinc ferrite as a raw material and made by being sintered at a high temperature. As shown inFIG.1andFIG.2, in this embodiment, two opposite sides of the substrate10are respectively provided with a transmission line layer30. Wherein, the transmission line layer30can be made of metal materials. The metal materials for forming the transmission line layer30comprise, but are not limited to, copper, aluminum, iron, nickel, gold, silver, platinum group, chromium, magnesium, tungsten, molybdenum, lead, tin, indium, zinc or any alloys thereof, etc. Furthermore, one of the conductive members40is disposed in one of the inner via holes15to form an inner conductive hole18, and one of the conductive members40is disposed in one of the outer via holes17to form an outer conductive hole19. The inner conductive hole18and the outer conductive hole19electrically connect the transmission line layers30located at two sides of the substrate10. In this embodiment, the conductive members40can be metal layers. Specifically, referring toFIG.2, the conductive members40can be formed on inner walls of the inner via holes15and of the outer via holes17by means of, for example, electroplating, coating, etc., so as to electrically connect the transmission line layers30located at two opposite sides of the substrate10. The materials of the metal layers comprise, but are not limited to, copper, aluminum, iron, nickel, gold, silver, platinum group, chromium, magnesium, tungsten, molybdenum, lead, tin, indium, zinc or any alloys thereof, etc. In another embodiment, the conductive member40can be metal posts, and a diameter of a metal post corresponding to each inner via hole15or each outer via hole17is less than or equal to a diameter of the inner via hole15or the outer via hole17where it locates. The materials of the metal posts are the same as the materials of the metal layers of the previous embodiment, and are not repeated here. Continuing to refer toFIG.1andFIG.2, each transmission line layer30includes a plurality of wire patterns32; wherein, each wire pattern32is bridged between an inner conductive hole18and an outer conductive hole19which correspond to each other, and has one end connected with the conductive member40in the inner via hole15and another end connected with the conductive member40in the outer via hole17. Therefore, the conductive member40in the inner via hole15and the conductive member40in the outer via hole17are sequentially connected with the wire pattern32on the transmission line layers30located at two opposite sides of the substrate10, such that a coil circuit capable of surrounding the magnetic core20is formed. In this embodiment, as shown inFIG.2andFIG.4, the transmission line layers30include a first transmission line layer30aand a second transmission line layer30bwhich are respectively located at two opposite sides of the substrate10. The wire patterns32include a first conductive pattern32alocated on the first transmission line layer30aand a second conductive pattern32blocated on the second transmission layer30b. The inner conductive hole18includes a first inner conductive hole (not shown in the drawings) connected with the first conductive pattern32aand a second inner conductive hole (not shown in the drawings) connected with the second conductive pattern32b; the outer conductive hole19includes a first outer conductive hole (not shown in the drawings) connected with the first conductive pattern32aand a second outer conductive hole (not shown in the drawings) connected with the second conductive pattern32b. Specifically, the coil circuit includes a plurality circles of coils connected sequentially. In this embodiment, each circle of coil includes a first inner conductive hole, a first conductive pattern32a, a first outer conductive hole, a second outer conductive hole, a second conductive pattern32b, and a second inner conductive hole. Wherein, the first outer conductive hole and the second outer conductive hole in each circle of coil share the same outer conductive hole19(that is, the outer conductive holes19of the plurality of circles of coils coincide). The first inner conductive hole and the second inner conductive hole in each circle of coil are respectively shared by adjacent coils (that is, two adjacent circles of coils coincide with adjacent inner conductive holes18respectively). That is, two ends of each inner conductive hole18are respectively connected with the wire patterns32in adjacent circles of coils, and the two wire patterns32are respectively located on the transmission line layers32on two sides of the substrate10. Alternatively, the outer conductive hole19is located on a vertical line of two inner conductive holes18of the same circle of coil. Specifically, each circle of coil is connected with an inner conductive hole18of a previous adjacent coil, and at the same time, is connected with an inner conductive hole18of a next adjacent coil, such that each circle of coil has two inner conductive holes18shared with adjacent circles of coils, and the outer conductive hole19in each circle of coil is located on a vertical line of the two inner conductive holes18. Advantages of such an arrangement is that: it is possible to make the outer conductive holes19be uniformly distributed on the substrate, so that the distribution is more reasonable, the number of the wire patterns32on the transmission line layers30is more, thereby improving performance of the electromagnetic device100. Wherein, the number of the coil circuits surrounding each magnet core20can be one or more. For example, when the number of the coil circuit is one, an inductor component is formed. When the number of the coil circuit is multiple, a transformer or a filter is formed. Continuing to referFIG.1toFIG.4, one central portion14on the substrate10, its corresponding peripheral portion16, one magnet core20, a plurality of conductive members40, and wire patterns32located on the two transmission line layers30and corresponding to each magnetic core20can form one transformer52or filter54. Wherein, the transformer52differs from the filter54in that connection manners of connection terminals of coil circuits are different. In the transformer52, two terminals of one coil circuits serve as input ends, and two terminals of another coil circuits serve as output ends. In the filter54, one terminal of any coil circuit serves as an input end, and the other terminal serves as an output end. The annular receiving grooves12on the substrate10can be all used to form transformers52, and can also be all used to form filters54, and it is also possible that some of them are used to form transformers52and others of them are used to form filters54, this is not limited here. Therefore, the plurality of central portions14on the substrate10, their corresponding peripheral portions16, the plurality of magnet cores20, the plurality of conductive members40, and the transmission line layers30located at two opposite sides of the substrate10can form a plurality of transformers52and/or a plurality of filters54arranged according to a predetermined arrangement rule. In one embodiment, a plurality of transformers52and a plurality of filters54are simultaneously formed on one substrate10. That is, the plurality of transformers52and the plurality of filters54share the same substrate10. At this time, the transformers52and the filters54in the electromagnetic device100are located in the same layer. One transformer52and one filter54on the substrate10are electrically connected so as to form a group of electromagnetic assembly50. In this embodiment, referring toFIG.4, two groups of electromagnetic assemblies50are formed on the substrate10, each group of electromagnetic assembly50includes a transformer52and a filter54. The transformer52and the filter54in each group of electromagnetic assembly50are in electrical connection, while different groups of electromagnetic assemblies50are not electrically connected with each other. In another embodiment, a plurality of transformers52or a plurality of filters54are simultaneously formed on one substrate10, that is, there are only transformers52or are only filters54on the electromagnetic device100. In this embodiment, a thickness of the transmission line layer30is 17-102 μm (micron). In one embodiment, in order to enhance coupling extent of the transformer52so as to dispose more wire patterns32on the transmission line layer30, the thickness of the transmission line layer30can be 17-34 μm. In other embodiments, in order to improve over-current capacity of the transmission line layer30, the thickness of the transmission line layer30can also be 40-100 μm. Alternatively, the thickness of the transmission line layer30is 65-80 μm, because when etching the transmission line layer30to form the wire patterns32, if the thickness is too large (i.e., larger than 80 μm) and a distance between two adjacent wire patterns32on the same transmission line layer30is small, it may be caused that the etching is not clean and connection between two adjacent wire patterns32occurs, thereby causing short-circuit; if the thickness is too small (i.e., less than 40 μm), current carrying capability of the wire patterns32may be lowered. In this embodiment, the metal material of the transmission line layer30and the material of the conductive members40in the inner via holes15and the outer via holes17can adopt the same material. Taking copper as an example, it is possible to use the substrate10as a cathode and place the substrate10in salt solution containing copper ions to perform electroplating, so that the transmission line layers30are formed on two sides of the substrate10, and the conductive members40are simultaneously formed in inner walls of each inner via hole15and each outer via hole17. In another embodiment, the material of the transmission line layer30and the material of the conductive members40in the inner via holes15and the outer via holes17can also adopt different materials. Also referring toFIG.1, in this embodiment, the electromagnetic device100includes a first side surface110being perpendicular to the transmission line layers30and a second side surface120being parallel to the transmission line layers30, and the first side surface110is provided with an insertion slot112. Wherein, the insertion slot112runs through the electromagnetic device100along an axial direction of the inner via holes15. A first conductive pin116is disposed on at least one of a side wall114defining the insertion slot112and the side wall120, and the first conductive pin116is electrically connected with at least one transmission line layer30. Wherein, the first conductive pin116is used to connect the electromagnetic device100with external circuits, for example, electrically connect with a crystal joint by means of, for example, welding, conductive adhesive bonding, etc. In this embodiment, the first conductive pin116can be only disposed on the side wall114defining the insertion hole112. Specifically, the first conductive pin116can be a metal sheet having a first predetermined length, the number of the metal sheet can be one or more. In this embodiment, there are a plurality of metal sheets, and the plurality of metal sheets are disposed to be spaced from each other, each metal sheet is electrically connected with at least one transmission line layer30. Wherein, the first predetermined length can be larger than one fifth of a height of the electromagnetic device100along the axial direction of the inner via hole15, while less than or equal to the height of the electromagnetic device100along the axial direction of the inner via hole15. That is, the length of the first conductive pin116can be larger than one fifth of the height of the electromagnetic device100. In this embodiment, as shown inFIG.1, the length of the first conductive pin116is equal to a height of the substrate10along the axial direction of the inner via hole15. That is, the first conductive pin116having the same height as the substrate10is disposed on a whole sub-sidewall, so as to make an area of the first conductive pin116be the largest, such that welding is more stable when the first conductive pin116is welded with an external circuit. In other embodiments, the first conductive pin116can also be in the form of pads, mechanical contacts, and so on, the pads or mechanical contacts are also electrically connected with at least one transmission line layer30. Wherein, a shape of the insertion slot112can be approximately U-shaped, and can also be semicircle, arc, etc. In this embodiment, referring toFIG.1, the shape of the insertion slot112is U-shaped, that is, the insertion slot has two sub-sidewalls disposed oppositely, and both the two sub-sidewalls are perpendicular to the first side surface110. The first conductive pin116is disposed on at least one sub-sidewall, for example, the first conductive pin116can be disposed on only one of the sub-sidewalls, and can also be disposed on both the two sub-sidewalls. In this embodiment, both the two oppositely disposed sub-sidewalls are provided thereon with a plurality of first conductive pins116. Of course, in other embodiments, the two oppositely disposed sub-sidewalls of the insertion slot112can also be not perpendicular to the first side surface110For example, the shape of the insertion slot112can be an irregular quadrilateral, which has two opposite sub-sidewalls, but the two opposite sub-sidewalls are not perpendicular to the first side surface110. Furthermore, as shown inFIG.1, in this embodiment, the insertion slot112has an opening, and the opening is disposed at a middle portion of the first surface110. Of course, in other embodiments, the opening of the insertion slot112can also be disposed at portions of the first side surface110being dose to a top or a bottom thereof, the present disclosure does not specifically limit here. In this embodiment, the opening of the insertion slot112is disposed at the middle portion of the first side surface110, a length of a wire for connecting the transformer and/or filter in the electromagnetic device100with the first conductive pin116in the insertion slot112can be reduced, thereby improving electrical performance of the transformer and/or the filter. The first conductive pin116can be directly welded on the sub-sidewall, and it is also possible to adopt other manners to fix the first conductive pin116on the sub-sidewall. In this embodiment, as shown inFIG.1, the two sub-sidewalls are respectively provided thereon with a first arc groove117adapted to each first conductive pin116, and the first conductive pin116is disposed in the first arc groove117. Specifically, in this embodiment, a plurality of first arc grooves117can be first defined in the two sub-sidewalls, and thus the first conductive pins116is formed in the first arc grooves117by means of, for example, coating or electroplating. Advantages of using the coating or electroplating means is that the shape of the first conductive pin116is identical to the shape of the first arc slot117, that is, the first conductive pin116is arc-shaped; the arc-shaped first conductive pin116, when receiving filled solder to perform welding, can increase a welding area and makes welding be more firm. Of course, in other embodiments, it is also possible to weld the first conductive pin116in the first arc groove117by means of such as welding in the first arc groove117. The present disclosure does not specifically limit the method for forming the first conductive pin116. Alternatively, the first conductive pin116can be only disposed on the second side surface120. Wherein, the first conductive pin116can be a pad, each pad is electrically connected with at least one transmission line layer30of the electromagnetic device100. Specifically, the first conductive pin116extends to a junction between the second side surface120and a side wall114. Alternatively, the first conductive pin116can also be simultaneously disposed on the side wall114and the second side surface120of the insertion slot112. Specifically, as shown inFIG.1, in this embodiment, the first conductive pin116includes a conductive main body119disposed on the side wall114of the insertion slot112and a conductive extending portion118disposed on the second side surface120. The conductive extending portion118is used to electrically connect with an external circuit, so that a contact area between the conductive main body119and the external circuit is further increased, and connection stability is improved. In this embodiment, as shown inFIG.1, a plurality of conductive extending portions118are disposed on the second side surface120. Wherein, each conductive extending portion118extends to a junction between the second side surface120and the side wall114, and is connected with a corresponding conductive main body119. The conductive extending portion118can be in the form of, for example, pads or mechanical contacts, the present disclosure does not specifically limit here. Furthermore, the substrate10further has a third side surface130. The third side surface130is adjacent to the first side surface110and is perpendicular to the transmission line layer30. The third side surface130is provided thereon with a second conductive pin122, the second conductive pin is electrically connected with at least one transmission line layer30. Wherein, connection manners for electrically connecting the second conductive pin122with at least one transmission line layer30comprise: directly connecting the second conductive pin122with at least one transmission line layer30to implement electrical connection; or indirectly connecting the second conductive pin122with at least one transmission line layer30through other components to implement electrical connection. In this embodiment, the first conductive pin122is used to connect the electromagnetic device100with external circuits, for example, electrically connect with a circuit board by means of, for example, welding, conductive adhesive bonding, etc. In this embodiment, the second conductive pin122can be a metal sheet having a second predetermined length; wherein, the number of the metal sheet can be one or more. In this embodiment, there are a plurality of metal sheets, and the plurality of metal sheets are disposed to be spaced from each other, each metal sheet is electrically connected with at least one transmission line layer30. In this embodiment, the second predetermined length of the second conductive pin122can be larger than one fifth of a height of the electromagnetic device100along the axial direction of the inner via hole15, while less than or equal to the height of the electromagnetic device100along the axial direction of the inner via hole15. That is, the length of the second conductive pin122can be larger than one fifth of the height of the electromagnetic device100. In this embodiment, the second predetermined length can be equal to, and can also be not equal to, the first predetermined length, that is, a length range of the second conductive pin122can be equal to, and can also be not equal to, a length range of the first conductive pin116, the present disclosure has no specifically limitation. In this embodiment, the length of the second conductive pin122is equal to the length of the first conductive pin116, and is equal to a height of the electromagnetic device100along the axial direction of the inner via hole15, so as to make an area of the second conductive pin122be the largest, such that welding is more stable when the second conductive pin122is welded with an external circuit. In other embodiments, the second conductive pin122can also be in the form of pads, mechanical contacts, and so on, the pads or mechanical contacts are also electrically connected with at least one transmission line layer30. Furthermore, referring toFIG.1, in this embodiment, the third side surface130is provided with a second arc groove124adapted to each second conductive pin122, and each second conductive pin122is disposed in a corresponding second arc groove124. Wherein, structures and forming methods of the second conductive pin122and the second arc groove124are identical to structures and forming methods of the first conductive pin116and the first arc groove117, please refer to the structures of the first conductive pin116and the first arc groove117, and are not repeated here. The present disclosure further provides a connector300, as shown inFIG.7andFIG.8, the connector300mainly comprises: at least one electromagnetic device100, a first adapter plate320electrically connected with the electromagnetic device100, and at least one connector assembly340electrically connected with the first adapter plate320. Wherein, the structure of the electromagnetic device100is the same as the structure of the electromagnetic device100described above, and is not repeated here. In this embodiment, the connector can be an R145 connector; wherein, the RJ45 connector is a kind of network connector which has the widest application range at present, and is widely applied for data transmission between networks. In other embodiments, the connector can also be an RJ11 connector. RJ11 connectors are usually used for connections between telephones and communication lines or between telephones and microphones. Of course, the connector can also be in other types, and embodiments of the present disclosure has no specific limitation. In this embodiment, the connector300comprises at least two electromagnetic devices100. For example, at least one transformer and at least one filter can be comprised, the transformer and the filter are combined to process signals flowing into the connector, thereby improving signal processing effect of the connector300. In this embodiment, the insertion slot112of each electromagnetic device100is arranged in alignment, so that it is convenient for one end of the first adapter plate320to be simultaneously inserted into the insertion slot112of each electromagnetic device100. Furthermore, when the first conductive pin116and the second conductive pin122of two adjacent electromagnetic devices100all run through the electromagnetic devices100, that is, lengths of the first conductive pin116and of the second conductive pin122are all equal to thicknesses of the electromagnetic devices100, in order to prevent contacts from forming between the first conductive pin116of one electromagnetic device100and the corresponding first conductive pin116of another electromagnetic device100being adjacent thereto, and between the second conductive pin122of one electromagnetic device100and the corresponding second conductive pin122of another electromagnetic device100being adjacent thereto, and generating short-circuit, a clearance is usually provided between adjacent electromagnetic devices100. In one embodiment, a width of a clearance between every two adjacent electromagnetic devices100can be set to be larger than or equal to 0.5 mm, wherein the width of the clearance is a width of the least clearance between every two adjacent electromagnetic devices100. When the width of the least clearance between every two adjacent electromagnetic devices100is larger than or equal to 0.5 mm, corresponding first conductive pins116which are respectively disposed on the two adjacent electromagnetic devices100are insulated from each other, and corresponding second conductive pins122which are respectively disposed on the two adjacent electromagnetic devices100are insulated from each other. In another embodiment, an insulating layer350can also be disposed between every two adjacent electromagnetic devices100, the insulating layer350is sandwiched between every two adjacent electromagnetic devices100. The insulating layer350makes corresponding first conductive pins116which are respectively disposed on the two adjacent electromagnetic devices100be insulated from each other, and corresponding second conductive pins122which are respectively disposed on the two adjacent electromagnetic devices100be insulated from each other. Wherein, the insulating layer350can be insulating resin, green oil, polymer resin, insulating glue, etc., and the insulating layer350can be fixed between two adjacent electromagnetic devices100by means of hot pressing, coating, etc. Furthermore, in this embodiment, as shown inFIG.9, the insulating layer can be only disposed at positions in the electromagnetic device100where the first conductive pin116and the second conductive pin122are disposed, so that the first conductive pin116of one electromagnetic device100and the corresponding first conductive pin116of another electromagnetic device100being adjacent thereto are insulated from each other, and the second conductive pin122of one electromagnetic device100and the corresponding second conductive pin122of another electromagnetic device100being adjacent thereto are insulated from each other. By disposing the local insulating layer350, effect of reducing used amount of the insulating layer350and thus reducing production cost can be provided. In another embodiment, when adjacent electromagnetic devices100are connected tightly, that is, a width of the least clearance between adjacent electromagnetic devices100is zero, a back drilling treatment can be performed at mutually close ends of the first conductive pin116and of the second conductive pin122of at least one of the electromagnetic devices100, such that lengths of the first conductive pin116and the second conductive pin122subjected to the back drilling treatment are less than a thickness of the electromagnetic device100. Wherein, a depth of the back drilling treatment is larger than or equal to 0.05 mm, that is, after performing the back drilling treatment, a distance between the first conductive pin116of one electromagnetic device100and the corresponding first conductive pin116of another electromagnetic device100being adjacent thereto along a stack direction is larger than or equal to 0.05 mm, and a distance between the second conductive pin122of one electromagnetic device100and the corresponding second conductive pin122of another electromagnetic device100being adjacent thereto along a stack direction is larger than or equal to 0.05 mm. Wherein, the distance between the first conductive pin116of one electromagnetic device100and the corresponding first conductive pin116of another electromagnetic device100being adjacent thereto along a stack direction refers to the least distance between a distance between the first conductive pin116of one electromagnetic device100and the corresponding first conductive pin116of another electromagnetic device100being adjacent thereto along a stack direction. By the above three disposing manners, the first conductive pin116and the second conductive pin122of one electromagnetic device100can be respectively enabled to mutually insulate from the corresponding first conductive pin116and second conductive pin122of another electromagnetic device100being adjacent thereto. Of course, it is also possible to adopt other manners to achieve the purpose that the first conductive pin116and the second conductive pin122of one electromagnetic device100respectively mutually insulate from the corresponding first conductive pin116and second conductive pin122of another electromagnetic device100being adjacent thereto. The preset disclosure has no limitation here. As shown inFIG.7andFIG.8, in this embodiment, specifically, one end of the first adapter plate320is simultaneously inserted in the insertion slots112, and is respectively electrically connected with the electromagnetic devices100. Another end of the first adapter plate320extends out of the insertion slots112, and is respectively fixed to and electrically connected with the connector assemblies340. Thus, electrical connection between each electromagnetic device100and a corresponding connector assembly340can be implemented through the first adapter plate320. When an electromagnetic device100in the connector300includes both a transformer and a filter, a first end of the transformer is electrically connected with the first conductive pin116in the insertion slot112, and a second end of the transformer is electrically connected with a first end of the filter; a second end of the filter is electrically connected with a second connection terminal121. In this embodiment, the connector assembly340is detachably connected with the first adapter plate320.FIG.10specifically shows a structure of the first adapter plate340. In combination withFIGS.8-10, in this embodiment, a surface of the end of the first adapter320extending out of the insertion slot112, which is in contact with each connector assembly340, is provided with a first pad322, and each connector assembly340is welded with a corresponding first pad322located at the same side of the first adapter plate320, thereby implementing electrical connection between the first adapter plate320and each connector assembly340. In further combination withFIG.8andFIG.10, the end of the first adapter plate320inserted in the insertion slot112is provided thereon with a second pad324, and each second pad324is electrically connected with a corresponding first pad322. Wherein, the second pad324can be disposed on one surface of the first adapter plate320, or both two opposite surfaces are provided thereon with the second pads324. The second pad324is welded with a corresponding first conductive pin116located on the side wall114of the insertion slot112, thereby implementing electrical connection between the electromagnetic device100and the first adapter plate320. In above, the first pad322is electrically connected with a corresponding second pad324, the second pad324is electrically connected with a corresponding first conductive pin116, thereby implementing electrically connection between each first pad322and a corresponding first conductive pin116. Wherein, the numbers of the first pad322and of the second pad324can be only one or more, the present disclosure has no limitation here. In this embodiment, a plurality of first pads322and a plurality of second pads324are disposed, thereby making connections be more stable. Wherein, a length of the first adapter plate320along a stack direction of the electromagnetic device100can be equal to a thickness of a stacked electromagnetic device100. At this time, each first conductive pin116on the first adapter plate320is correspondingly welded with one of the second pads324to implement electrical connection. In another embodiment, the length of the first adapter plate320along a stack direction of the electromagnetic device100can also be larger than the thickness of a stacked electromagnetic device100. Specifically, the first adapter plate320has one part accommodated in the insertion slot112and another part exposed out of the insertion slot112. The second pad324is disposed on the part exposed out of the insertion slot112. At this time, the first conductive pin116of the electromagnetic device100is only disposed on the second side surface120, and the second pad324located out of the insertion slot112can be connected with a corresponding first conductive pin116by means of solder paste or the like, thereby implementing electrical connection. In another embodiment, the length of the first adapter plate320along a stack direction of the electromagnetic device100can also be larger than the thickness of a stacked electromagnetic device100. Specifically, each second pad324on the first adapter plate320has one part accommodated in the insertion slot112and another part exposed out of the insertion slot112. At this time, the first conductive pin116of the electromagnetic device100includes the conductive main body119and the conductive extending portion118. Wherein, the part of the second pad324in the insertion slot112is welded with a corresponding conductive main body119for electrical connection; the part of the second pad324located out of the insertion slot112can be connected with a corresponding conductive extending portion118by means of solder paste or the like, thereby implementing electrical connection. The advantage of such arrangements is that: a part of the first adapter plate320located in the insertion slot112is welded with the electromagnetic device100in a direction being perpendicular to the transmission line layer30, and a part of the first adapter plate320located out of the insertion slot112is welded with the electromagnetic device100in a direction being parallel to the transmission line layer30, so that welding in two directions being perpendicular to each other is implemented, and the connection stability is further improved. Furthermore, in this embodiment, the connector300further comprises a connection layer360sandwiched between the first adapter plate320and the side wall114of the insertion slot112, the connection layer360is used to fixedly connect the first adapter plate320and the electromagnetic device100. Wherein, in one embodiment, the connection layer360can be disposed between the first adapter plate320and the two sub-sidewalls, and the connection layer360does not interfere with the second pad324disposed on the first adapter plate320. In this embodiment, as shown inFIG.9, the connection layer360is disposed between a side surface of the first adapter plate320which is inserted in the insertion slot112and is provided with no second pad324and the side wall114of the insertion slot112. At this time, the connection layer360is not located at the same side surface as the second pad324, and thus can avoid from interfering with the second pad324. In this embodiment, the surface of the first adapter plate320being provided with the second pad324is perpendicular to the transmission line layer of the electromagnetic device100, that is, the first adapter plate320is perpendicular to the transmission line layer of the electromagnetic device100. FIGS.7-8further specifically shows a structure of the connector assembly340. As show inFIGS.7-8, in this embodiment, each connector assembly340includes a casing342and a first conductive joint344. Wherein, the connector assembly340implements electrical connection with the first adapter plate320through the first conductive joint344. The number of the first conductive joint344can be one or more, the present disclosure has no limitation here. In this embodiment, a plurality of first conductive joints344are provided, so that connection between the connector assembly340and the first adapter plate320is more stable. FIG.11specifically shows a structure of the first conductive joint344. In this embodiment, a plurality of first conductive joints344are arranged side by side, each first conductive joint344can include a first conductive connecting portion3441and a second conductive connecting portion3442. The second conductive connecting portion3442is disposed in the casing342, and the first conductive connecting portion3441extends out of the casing. Wherein, the second conductive connecting portion3442has one end connected with the first conductive connecting portion3441, and another end electrically connected with the first adapter plate320. There is an included angle between the first conductive connecting portion3441and the second conductive connecting portion3442, and the included angle is less than 90°. Specifically, in this embodiment, each second conductive connecting portion3442in each connector assembly340is parallel to the first adapter plate320, and each second conductive connecting portion3442is further welded with a corresponding first pad322located at the same side of the first adapter plate320, thereby implementing electrical connection between the connector assembly340and the first adapter plate320. In another embodiment, the connector assembly340and the first adapter plate320can also be an integrated structure. Specifically, the casing342of the connector assembly340and the first adapter plate320can be integrally injection molded by means of injection molding. The advantage of such an arrangement manner is that: welding between the connector assembly340and the first adapter plate320can be reduced, so that assembly is more convenient, and connection is more stable. In this embodiment, referring toFIG.7andFIG.8, the connector300can comprises two connector assemblies340and two electromagnetic devices100. Wherein, the two electromagnetic devices100are arranged to be stacked along an axial direction of the inner via hole. The two connector assemblies340sandwich the end of the first adapter plate320extending out of the insertion slot112, and are respectively fixed to and electrically connected with the first adapter plate320, so that the two connector assemblies340can be connected with the two electromagnetic devices100through the first adapter320. In this embodiment, continuing to refer toFIGS.7-8, the second conductive connecting portions3442in the two connector assemblies340are parallel to each other, and the first conductive connecting portions3441in the two connector assemblies340are arranged as mirror-images. In this embodiment, by disposing the connector assemblies340at two sides of the first adapter plate320respectively, it is possible to make the number of signal channels of the electromagnetic device100be increased, so that signal processing efficiency is improved in the case that an area of space occupied by the electromagnetic device100is unchanged. Of course, in other embodiments, the connector300can also comprise only one connector assembly340and two electromagnetic devices100. Wherein, the two electromagnetic devices100are arranged to be stacked along an axial direction of the inner via hole. Wherein, the connector assembly340can be fixed on any surface of the first adapter plate320. Specifically, any surface of the end of the first adapter plate320extending out of the insertion slot112can be provided thereon with a plurality of aforesaid first pads322, and each second conductive connecting portion3442in the connector assembly340is welded with a corresponding first pad322, so that the connector assembly340can be electrically connected with the first adapter plate320. In this embodiment, the connector300further comprises a second adapter plate330, a side of the second adapter plate330is fixed to and electrically connected with the electromagnetic device100. Specifically, referring toFIG.7andFIG.8, in this embodiment, a side of the second adapter plate330is provided with a third pad332, and the third pad332is correspondingly welded with the second conductive pin122of the electromagnetic device100, so that the second adapter plate330is welded on the third side surface130of the electromagnetic device100. Wherein, the number of the third pad32can be one or more, the present disclosure does not make any specific limitation here. In this embodiment, a plurality of third pads332and a plurality of second conductive pins122are provided, so as to make connection between the electromagnetic device100and the second adapter plate330be more stable. In this embodiment, a surface of the second adapter plate330being provided with the third pad332is parallel to an axis of a magnetic core (not shown), that is, the second adapter plate330is parallel to the axis of the magnetic core. Since the axis of the magnetic core is perpendicular to the transmission line layer, the surface of the second adapter plate330being provided with the third pad332is perpendicular to the transmission line layer of the electromagnetic device100; that is, the second adapter plate330is perpendicular to the transmission line layer of the electromagnetic device100. Additionally, as described above, since the first adapter plate320is perpendicular to the transmission line layer of the electromagnetic device100, and the second adapter plate330is perpendicular to the transmission line layer of the electromagnetic device100, the first adapter plate320is parallel to the second adapter plate330. Furthermore, since the second conductive connecting portion3442of each connector assembly340is parallel to the first adapter plate320, the second conductive connecting portion3442of each connector assembly340is then parallel to the second adapter plate330. Further referring toFIGS.7-8, a side of the second adapter plate330being away from the electromagnetic device100is further provided with conducive needles334, and the conductive needles334are electrically connected with corresponding third pads332. That is, a surface of the second adapter plate330being away from the third pad332is provided thereon with the conductive needles334electrically connected with the corresponding third pads332. The conductive needles334are spacedly disposed on the second adapter plate330, are perpendicular to the second adapter plate330, and are used to connect the connector300with external circuits. Wherein, the number of the conductive needles334can be one or more, and the present disclosure does not make any specific limitation here. In this embodiment, a plurality of conductive needles334and a plurality of third pads332are provided, so that connections between the connector300and external circuits are more stable. Further referring toFIG.5andFIG.7, in this embodiment, at least one side of the connector300having the transmission line layer (not shown in these figures) is further provided with a joint layer60configured to fix and electrically connect an electronic component200. Specifically, the joint layer60is directly disposed on the at least one side of the connector300having the transmission line layer, and the electronic component300is directly connected to the joint layer60. Wherein, “directly connected” herein refers to that the electronic component200is connected to the joint layer60without the help of other intermediate medium. Actually, the electronic component200comprises leading-out terminals (not shown in these figures), and the leading-out terminals is directly connected to the joint layer60. For example, in the embodiment shown inFIG.5, the connector300has the transmission line layer and the joint layer60disposed in the same layer, wherein, the electronic component200is directly connected on the joint layer60. The joint layer60is located in the same layer as, not overlapped with, and electrically connected with the transmission line layer at a side thereof. Wherein, “not overlapped with” refers to that a projection area of the joint layer60on the substrate10is not overlapped with a projection area of the transmission line layer at the same side on the substrate10, and the joint layer60can also be electrically connected with the transmission line layer located in the same layer through, for example, conductive connecting wires. In other embodiments, the joint layer60can also be electrically connected with a transmission line layer on another side of the connector300. For example, it is possible to define conductive holes in the joint layer60, and implement electrical connection with a transmission line layer at a side of the connector300being away from the joint layer60through the conductive holes, this not limited here. In another embodiment, as shown inFIG.6andFIG.7, the connector300further comprises a composite layer70, wherein the composite layer70is disposed on at least one side of the connector300having the transmission line layer30. The composite layer70is used to dispose the electronic component200, so that the electronic component200is electrically connected with at least one transmission line layer30being adjacent to the composite layer70. In this embodiment, the composite layer70includes a connection layer72and a conductive layer74, wherein, the connection layer72is located between the conductive layer74and a corresponding transmission line layer30, and is used to fix the conductive layer74on the transmission line layer30of the connection300and separate the conductive layer74from the transmission line layer30to prevent short-circuit. The electronic component200is disposed on the conductive layer74. Furthermore, in other embodiments, the connector300can further comprise the electronic component200, and the electronic component200is disposed on the joint layer60as shown inFIG.5or the composite layer70as shown inFIG.6. In one embodiment, the conductive layer74of the composite layer70is a pad layer, and the electronic component200is attached or welded on the conductive layer74. The number of the electronic component200disposed on the joint layer60or the conductive layer74is one or more, and the electronic component200can include, but is not limited to, resistors, capacitors, inductors, etc. Moreover, a plurality of electronic components200can also be connected with each other to form a circuit having a certain function, such as a filtering circuit. When a plurality of electronic components200are connected to form a filtering circuit, interfering signals in signals after being processed by the electromagnetic device100can be filtered, thereby improving performance of the connector300. The present disclosure further provides an electronic device, the electronic device comprises at least one connector and a mother board. Wherein, the mother board is provided with an external circuit, and each connector is electrically connected with the external circuit on the mother board. Wherein, the specific structure of the connector can refer to the structure of the connector300in the above embodiments, and is not repeated here. In conclusion, in the present disclosure, the first side surface110of the electromagnetic device100being perpendicular to the transmission line layers30is provided with the insertion slot112, which is used to fix and connect the first adapter plate320. The first conductive pin116electrically connected with at least one transmission line layer30is disposed in the insertion slot112or on the second side surface120being parallel to the transmission line layer30, by the electrical connection between the first conductive pin116and the first adapter plate320, the electrical connection between the first conductive pin116and the first adapter plate320is implemented. Another end of the first adapter plate320extends out of the insertion slot112, and is fixed to and electrically connected with the connector assembly340. Since the connector assembly340is fixedly in the insertion slot112through the first adapter plate320, the insertion slot112makes both two sides of the first adapter plate320be subjected to uniform forces, so that the connection between the connector assembly340and the electromagnetic device100is more stable. The above are merely embodiments of the present disclosure and are not intended to limit the patent scope of the present disclosure. Any equivalent structure or equivalent process transformation made with content of the specification and drawings of the present disclosure, or direct or indirect use in other relating technical fields, are all similarly included in the patent protection scope of the present disclosure. | 60,639 |
11862386 | DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. In the drawings, an L direction refers to a first direction or a length direction, a W direction refers to a second direction or a width direction, and a T direction refers to a third direction or a thickness direction. Hereinafter, a coil component according to an exemplary embodiment in the present disclosure will be described in detail with reference to the accompanying drawings. In describing an exemplary embodiment in the present disclosure with reference to the accompanying drawings, components that are the same as or correspond to each other will be denoted by the same reference numerals, and an overlapped description thereof will be omitted. Various types of electronic components may be used in electronic devices. Various types of coil components may be appropriately used for the purpose of noise removal or the like between such electronic components. That is, a coil component in the electronic device may be used as a power inductor, a high frequency (HF) inductor, a general bead, a high frequency (GHz) bead, a common mode filter, or the like. First Exemplary Embodiment FIG.1is a perspective view schematically illustrating a coil component according to a first exemplary embodiment in the present disclosure.FIG.2is a view illustrating a cross section taken along a line I-I′ ofFIG.1.FIG.3is a view illustrating a cross section taken along a line II-II′ ofFIG.1.FIG.4is an enlarged view of a part A ofFIG.2. Referring toFIGS.1through4, a coil component1000according to an exemplary embodiment in the present disclosure may include a body100, a coil part200, bonded conductive layers310and320, external electrodes400and500, and insulating layers610,620, and630, and may further include an internal insulating layer IL and an insulating film IF. The body100may form an outer shape of the coil component1000according to the present exemplary embodiment and may have the coil part200embedded therein. The body100may be formed in a hexahedral shape as a whole. Hereinafter, a first exemplary embodiment in the present disclosure will be described on the assumption that the body100has illustratively the hexahedral shape. However, such a description does not exclude a coil component including a body formed in a shape other than the hexahedral shape from the scope of the exemplary embodiment in the present disclosure. Referring toFIG.1, the body100may include a first surface and a second surface opposing each other in a length direction L, a third surface and a fourth surface opposing each other in a width direction W, and a fifth surface and a sixth surface opposing each other in a thickness direction T. The first to fourth surfaces of the body100may correspond to wall surfaces of the body100connecting the fifth surface and the sixth surface of the body100to each other. The wall surfaces of the body100may include the first surface and the second surface, which are both end surfaces opposing each other, and the third surface and the fourth surface, which are both side surfaces opposing each other. The body100may be illustratively formed so that the coil component1000according to the present exemplary embodiment in which the external electrodes400and500to be described below are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. The body100may contain a magnetic material and a resin. Specifically, the body100may be formed by stacking one or more magnetic composite sheets in which the magnetic material is dispersed in the resin. However, the body100may also have a structure other than the structure in which the magnetic material is dispersed in the resin. For example, the body100may also be formed of the magnetic material such as a ferrite. The magnetic material may be a ferrite or a metallic magnetic powder. The ferrite may include at least one or more of a spinel type ferrite such as Mg—Zn based, Mn—Zn based, Mn—Mg based, Cu—Zn based, Mg—Mn—Sr based, Ni—Zn based, or the like, a hexagonal type ferrite such as Ba—Zn based, Ba—Mg based, Ba—Ni based, Ba—Co based, Ba—Ni—Co based, or the like, and garnet type ferrite such as Y-based or the like, and Li-based ferrite. The metallic magnetic powder may include one or more selected from a group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic powder may include at least one or more of pure iron powder, Fe—Si based alloy powder, Fe—Si—Al based alloy powder, Fe—Ni based alloy powder, Fe—Ni—Mo based alloy powder, Fe—Ni—Mo—Cu based alloy powder, Fe—Co based alloy powder, Fe—Ni—Co based alloy powder, Fe—Cr based alloy powder, Fe—Cr—Si based alloy powder, Fe—Si—Cu—Nb based alloy powder, Fe—Ni—Cr based alloy powder, Fe—Cr—Al based alloy powder, and the like. The metallic magnetic powder may be amorphous or crystalline. For example, the metallic magnetic powder may be Fe—Si—B—Cr based amorphous alloy powder, but is not necessarily limited thereto. Each of the ferrite and the metallic magnetic powder may have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto. The body100may include two or more kinds of magnetic materials dispersed in the resin. Here, a meaning that the magnetic materials are different kinds means that the magnetic materials dispersed in the resin are distinguished from each other by any one of an average diameter, a composition, a crystallinity and a shape. The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., alone or in combination. The body100may include a core110penetrating through the coil part200to be described below. The core110may be formed by filling a through-hole of the coil part200with the magnetic composite sheet, but is not limited thereto. The coil part200to be described below may format least one turn around the core110. The coil part200may be embedded in the body100to manifest the characteristics of the coil component. For example, in a case in which the coil component1000is utilized as a power inductor, the coil part200may serve to stabilize power of the electronic device by storing an electric field as a magnetic field and maintaining an output voltage. The coil part200may include a first coil pattern211, a second coil pattern212, and a via220, and the first coil pattern211and the second coil pattern212may be sequentially stacked along a thickness direction T of the body100. Each of the first coil pattern211and the second coil pattern212may be in the form of a plane spiral having at least one turn formed around the core110. As an example, the first coil pattern211may form at least one turn around the core110on a lower surface of the internal insulating layer IL. The via220may penetrate through the internal insulating layer IL to electrically connect the first coil pattern211and the second coil pattern212to each other and may be in contact with the first coil pattern211and the second coil pattern212, respectively. As a result, the coil part200applied to the present exemplary embodiment may be formed as a single coil generating a magnetic field in the thickness direction (T) of the body100. At least one of the first coil pattern211, the second coil pattern212, and the via220may include one or more conductive layers. As an example, in a case in which the second coil pattern212and the via220are formed by plating, the second coil pattern212and the via220may include a seed layer of an electroless plating layer and an electroplating layer. Here, the electroplating layer may have a single layer structure or a multilayer structure. The electroplating layer having the multilayer structure may also be formed in a conformal film structure in which the other electroplating layer covers any one electroplating layer, or may also be formed in a shape in which the other electroplating layer is stacked only on one surface of any one electroplating layer. The seed layer of the second coil pattern212and the seed layer of the via220may be integrally formed without forming a boundary therebetween, but are not limited thereto. The electroplating layer of the second coil pattern212and the electroplating layer of the via220may be integrally formed without forming a boundary therebetween, but are not limited thereto. As another example, in a case in which the first coil pattern211and the second coil pattern211are separately formed and are then stacked together on the internal insulating layer IL to form the coil portion200, the via220may include a high melting point metal layer and a low melting point metal layer having a melting point lower than the melting point of the high melting point metal layer. Here, the low melting point metal layer may be formed of a solder including a lead (Pb) and/or tin (Sn). The low melting point metal layer is at least partially melted due to the pressure and temperature at the time of stacking together of the first coil pattern211and the second coil pattern212, such that an inter metallic compound (IMC) layer may be formed between the low melting point metal layer and the second coil pattern212. As an example, the first coil pattern211and the second coil pattern212may protrude on a lower surface and an upper surface of the internal insulating layer IL, respectively, as illustrated inFIGS.2and3. As another example, the first coil pattern211is embedded in the lower surface of the internal insulating layer IL such that a lower surface of the first coil pattern211may be exposed to the lower surface of the internal insulating layer IL, and the second coil pattern212may protrude on the upper surface of the internal insulating layer IL. In this case, a concave portion may be formed in the lower surface of the first coil pattern211. As a result, the lower surface of the internal insulating layer IL and the lower surface of the first coil pattern211may not be positioned on the same plane. As another example, the first coil pattern211is embedded in the lower surface of the internal insulating layer IL such that the lower surface of the first coil pattern211may be exposed to the lower surface of the internal insulating layer IL, and the second coil pattern212is embedded in the upper surface of the internal insulating layer IL such that an upper surface of the second coil pattern212may be exposed to the upper surface of the internal insulating layer IL. End portions of the first coil pattern211and the second coil pattern212, respectively, may be exposed to the first surface and the second surface of the body100. The end portion of the first coil pattern211exposed to the first surface of the body100may be in contact with a first external electrode400to be described above, such that the first coil pattern211may be electrically connected to the first external electrode400. The end portion of the second coil pattern212exposed to the second surface of the body100may be in contact with a second external electrode500to be described above, such that the second coil pattern212may be electrically connected to the second external electrode500. Each of the first coil pattern211, the second coil pattern212, and the via220may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but is not limited thereto. The internal insulating layer IL may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be formed of an insulating material having a reinforcement material such as a glass fiber or an inorganic filler impregnated in the insulating resin. As an example, the internal insulating layer IL may be formed of an insulating material such as prepreg, Ajinomoto Build-up Film (ABF), FR-4, Bismaleimide Triazine (BT) resin, photo imagable dielectric (PID), or the like. As an inorganic filler, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (AlOH3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3) may be used. In a case in which the internal insulating layer IL is formed of the insulating material including the reinforcement material, the internal insulating layer IL may provide more excellent rigidity. In a case in which the internal insulating layer IL is formed of an insulating material that does not include the glass fiber, the internal insulating layer IL may be advantageous for thinning the total thickness of the coil part200. In a case in which the internal insulating layer IL is formed of the insulating material including the photosensitive insulating resin, the number of processes for forming the coil part200may be reduced, which is advantageous in reducing the production cost, and a fine via220may be formed. The insulating film IF may be formed along the surfaces of the first coil pattern211, the internal insulating layer IL, and the second coil pattern212. The insulating film IF, which protects and insulates the respective coil patterns211and212, may include a known insulating material such as parylene. The insulating material included in the insulating film IF may be any material and is not particularly limited. The insulating film IF may be formed by vapor deposition or the like, but is not limited thereto, and may also be formed by stacking an insulating film on both surfaces of the internal insulating layer IL on which the first and second coil patterns211and212are formed. Meanwhile, although not illustrated, at least one of the first coil pattern211and the second coil pattern212may be formed in plural. For example, the coil part200may have a structure in which a plurality of first coil patterns211are formed and the other of the first coil patterns is stacked on the lower surface of one of the first coil patterns. In this case, a separate insulating layer may be disposed between the plurality of first coil patterns211, but is not limited thereto. The insulating layers610,620, and630may be formed on surfaces of the body100. According to the present exemplary embodiment, the insulating layers610,620, and630may include a first insulating layer610disposed on the sixth surface of the body100, a second insulating layer620disposed on the fifth surface of the body100, and a third insulating layer630disposed on the third and fourth surfaces of the body100, respectively. The insulating layers610,620, and630may be formed of a thermoplastic resin such as a polystyrene based, a vinyl acetate based, a polyester based, a polyethylene based, a polypropylene based, a polyamide based, a rubber based, and an acrylic based, a thermosetting resin such as a phenol based, an epoxy based, a urethane based, a melamine based, and an alkyd based, a photosensitive resin, parylene, SiOx, or SiNx. The insulating layers610,620, and630may be formed by applying a liquid insulating resin to the body100, stacking an insulating film such as a dry film (DF) on the body100, or forming an insulating resin on the surfaces of the body by vapor deposition. As the insulating film, an Ajinomoto Build-up Film (ABF) or a polyimide film that does not include the photosensitive insulating resin may also be used. Each of the insulating layers610,620, and630may be formed in a range of a thickness of 10 nm to 100 μm. In a case in which the thickness of the insulating layers610,620, and630is less than 10 nm, characteristics of the coil component such as a Q factor may be reduced, and in a case in which the thickness of the insulating layers610,620, and630exceeds 100 μm, the total length, width, and thickness of the coil parts increase, which is disadvantageous for thinning. The bonded conductive layers310and320may be disposed on the first insulating layer610. Specifically, a first bonded conductive layer310may be disposed between the first insulating layer610and the first external electrode400to be described below, and a second bonded conductive layer320may be disposed between the first insulating layer610and the second external electrode500to be described below. A surface roughness of one surface of each of the bonded conductive layers310and320which are in contact with the first insulating layer610may be greater than the surface roughness of the other surface opposing one surface. That is, referring toFIGS.2and5, the surface roughness of an upper surface of the first bonded conductive layer310which is in contact with the first insulating layer610may be greater than the surface roughness of a lower surface of the first bonded conductive layer310. This will be described below in detail. According to the present exemplary embodiment, the bonded conductive layers310and320and the first insulating layer610may be formed by stacking an intermediate material having an insulating film attached to one surface of a conductive film on the sixth surface of the body100, such as resin coated copper (RCC). At this time, a copper film of RCC may have one surface which is in contact with the insulating film, and the other surface opposing one surface. A relatively high surface roughness may be formed on one surface of the copper film in order to maintain bonding force with the insulating film. As a result, a relatively high surface roughness may be formed on interfaces between the bonded conductive layers310and320and the first insulating layer610. However, the description above is merely illustrative, and a case in which the bonded conductive layers310and320and the first insulating layer610are formed of an intermediate material having the insulating film attached to one surface of a conductive film other than the copper film is not excluded from the scope of the present disclosure. In addition, the description above does not exclude a case in which each of the bonded conductive layers310and320and the first insulating layer610is formed of a separate intermediate material from the scope of the present disclosure. An area of one surface of each of the bonded conductive layers310and320may be greater than an area of the other surface of each of the bonded conductive layers310and320. In addition, the area of each of the bonded conductive layers310and320may be reduced from one surface of each of the bonded conductive layers310and320to the other surface of each of the bonded conductive layers310and320. This will be described. The first and second bonded conductive layers310and320may be disposed to be spaced apart from each other on the sixth surface of the body100by selectively removing a portion of the copper film of RCC described above. As an example, an etching resist may be formed on the copper film of RCC attached to the body100with the dry film, and one region of the copper film exposed through an opening of the etching resist may be removed with a copper etching solution. At this time, the other surface of the copper film may be exposed to the copper etching solution for a relatively longer time than one surface of the copper film which is in contact with the first insulating layer610. Therefore, an amount of removed copper film may be increased on the other side of the copper film than on one side of the copper film. As a result, as illustrated inFIG.5, the area of one surface of each of the bonded conductive layers310and320which are in contact with the first insulating layer610may be greater than the area of the other surface of each of the bonded conductive layers310and320, and the area of each of the bonded conductive layers310and320may be reduced from one surface of each of the bonded conductive layers310and320to the other surface thereof. The bonded conductive layers310and320may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), iron (Fe), chromium (Cr), niobium (Nb), or alloys including at least one thereof, but are not limited thereto. The external electrodes400and500may be connected to the coil patterns211and212and may be disposed to be spaced apart from each other on the lower surface of the body100. The external electrodes400and500may include a first external electrode400connected to the first coil pattern211and a second external electrode500connected to the second coil pattern212. Specifically, the first external electrode400may include a first connection portion420disposed on the first surface of the body100and connected to an end portion of the first coil pattern211, and a first extension portion410extending from the first connection portion420to the sixth surface of the body100and covering the first bonded conductive layer310. The second external electrode500may include a second connection portion520disposed on the second surface of the body100and connected to an end portion of the second coil pattern212, and a second extension portion510extending from the second connection portion520to the sixth surface of the body100and covering the second bonded conductive layer320. Since the first extension portion410and the second extension portion510are spaced apart from each other on the lower surface of the first insulating layer610, the first external electrode400and the second external electrode500may not be in contact with each other. Each of the extension portions410and510may have one end connected to each of the connection portions420and520, and the other end opposing one end, and the extension portions410and510may cover the bonded conductive layers310and320. The external electrodes400and500may be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited thereto. The external electrodes400and500may be formed by vapor deposition such as sputtering or the like, or electroplating. In forming the external electrodes400and500, each of the connection portions420and520and the extension portions410and510may be formed by a separate process, such that a boundary may be formed therebetween. Alternatively, the connection portions420and520and the extension portions410and510may be formed by the same process, such that the connection portions420and520and the extension portions410and510may have a boundary formed therebetween and may be integrally formed. By doing so, the coil component1000according to the present exemplary embodiment may have an insulation distance between the external electrodes400and500improved by the first insulating layer610and improve a breakdown voltage (BDV). In addition, in the coil component1000according to the present exemplary embodiment, surfaces of the extension portions410and510of the external electrodes disposed on the lower surface of the body100, which is a mounting surface, that is, the sixth surface of the body100may be relatively flatly formed. That is, according to the present exemplary embodiment, since the first insulating layer610is disposed on the sixth surface of the body100and the extension portions410and510are formed on the first insulating layer610, the first insulating layer610may prevent the relatively high surface roughness of the sixth surface of the body100from being transferred to the extension portions410and510. In addition, as described above, the other surface of each of the bonded conductive layers310and320opposing one surface of each of the bonded conductive layers310and320which are in contact with the first insulating layer610may have a relatively low surface roughness. Since the extension portions410and510are formed on the other surface of each of the bonded conductive layers310and320, the surfaces of the extension portions410and510of the external electrodes may be additionally flatly formed. As a result, a printed circuit board or an electronic package in which the electronic component is embedded may be more easily and precisely implemented using the coil component1000according to the present exemplary embodiment. That is, in the case of the printed circuit board or the electronic package in which the electronic component is embedded, after the electronic component is surrounded by an insulating member to fix the electronic component, a hole machining may be optically performed on the insulating member for connection with the electronic component. Since the extension portions410and510of the external electrodes400and500applied to the coil component1000according to the present exemplary embodiment are relatively flatly formed due to the above mentioned reasons, scattering of light may be reduced, and the hole machining may be more precisely performed. Second Exemplary Embodiment FIG.5is a cross-sectional view schematically illustrating a coil component according to a second exemplary embodiment in the present disclosure.FIG.6is a bottom view schematically illustrating the coil component according to the second exemplary embodiment in the present disclosure.FIG.5corresponds toFIG.2illustrating the cross section according to the first exemplary embodiment in the present disclosure. Referring toFIGS.5through6, a coil component2000according to the present exemplary embodiment is different from the coil component1000according to the first exemplary embodiment in the present disclosure in the bonded conductive layers310and320and the external electrodes400and500. Therefore, in describing the present exemplary embodiment, only the bonded conductive layers310and320and the external electrodes400and500will be described. The description of the first exemplary embodiment in the present disclosure may be applied to the remaining configuration of the present exemplary embodiment as it is. According to the present exemplary embodiment, the bonded conductive layers310and320may extend to an inner side of one region of the first insulating layer610corresponding to the core110. That is, referring toFIG.5, the first bonded conductive layer310may extend from a boundary between the first insulating layer610and the first surface of the body100to the second surface of the body100, and one end of the first bonded conductive layer310may be disposed in a region of the lower surface of the first insulating layer610corresponding to the core110. Referring toFIG.5, the second bonded conductive layer320may extend from a boundary between the first insulating layer610and the second surface of the body100to the first surface of the body100, and one end of the second bonded conductive layer320may be disposed in a region of the lower surface of the first insulating layer610corresponding to the core110. The region of the insulating layer610corresponding to the core110may refer to a region in which the core110is projected onto the first insulating layer610. Since one end of each of the bonded conductive layer310and320is disposed in the region of the lower surface of the first insulating layer610corresponding to the core110, the end portions of the extension portions410and510of the external electrodes400and500may be disposed in the region of the lower surface of the first insulating layer610corresponding to the core110(b inFIGS.5and6). According to the present disclosure, the insulation distance between the external electrodes400and500may be increased by the first insulating layer610. Therefore, even if a spaced distance between the external electrodes400and500is reduced, the risk of electric short between the external electrodes400and500may be reduced. Therefore, according to the present exemplary embodiment, the bonded conductive layers310and320, and the extension portions410and510of the external electrodes400and500may extend into the region of the lower surface of the first insulating layer610corresponding to the core110. By doing so, according to the present exemplary embodiment, a magnetic flux leaked in the thickness direction of the body100may be reduced. Third Exemplary Embodiment FIG.7is a perspective view schematically illustrating a coil component according to a third exemplary embodiment in the present disclosure.FIG.8is a view illustrating a cross section taken along a line III-III′ ofFIG.7.FIG.9is a view illustrating a cross section taken along a line IV-IV′ of FIG.7. Referring toFIGS.7through9, a coil component3000according to the present exemplary embodiment is different from the coil components1000and2000according to the first and second exemplary embodiments in the present disclosure in the bonded conductive layers and the external electrodes. Therefore, in describing the present exemplary embodiment, only the bonded conductive layers310,320,310′, and320′ and the external electrodes400and500will be described. The description of the first and second exemplary embodiments in the present disclosure may be applied to the remaining configuration of the present exemplary embodiment as it is. According to the present exemplary embodiment, the bonded conductive layers310,320,310′, and320′ may be disposed on the fifth surface and the sixth surface of the body100, respectively. That is, referring toFIG.8, the bonded conductive layers310′ and320′ may also be disposed on the upper surface of the body100. Band portions430and530of the external electrodes400and500to be described below may be formed on the upper bonded conductive layers310′ and320′, respectively. The external electrodes400and500may further include the band portions430and530disposed on the sixth surface of the body100. That is, the external electrodes400and500may have a shape of ⊏. The band portions430and530may be formed integrally with the connection portions420and520. Alternatively, the band portions430and530may form boundaries between the band portions430and530and the connection portions420and520. The coil component3000according to the present exemplary embodiment may reduce a magnetic flux leaked to the fifth surface and the sixth surface of the body100. That is, the leaked magnetic flux may be more efficiently reduced as compared with other exemplary embodiments in the present disclosure. As set forth above according to an exemplary embodiment in the present disclosure, the breakdown voltage (BDV) of the coil component may be improved. In addition, according to the present disclosure, the shielding structure that reduces the leakage magnetic flux may be easily formed. In addition, according to the present disclosure, the flatness of the mounting surface may be improved. While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims. | 31,185 |
11862387 | DESCRIPTION OF THE EMBODIMENTS Various embodiments of the present invention will be hereinafter described with reference to the accompanying drawings. Reference characters designating corresponding components are repeated as necessary throughout the drawings for the sake of consistency and clarity. For convenience of explanation, the drawings are not necessarily drawn to scale. A coil component1according to one embodiment of the invention will be hereinafter described with reference toFIGS.1and2.FIG.1is a schematic perspective view of the coil component1, andFIG.2is a schematic plan view of the coil component1.FIG.2illustrates a magnetic base body10and a coil conductor25in a plan view (viewed from a coil axis Ax direction described later), the periphery of the coil component is made transparent to show them therein inFIG.2. In the illustrated embodiment, the coil component1is a planar coil having a coil conductor wound several or more times in a plane. The coil component1includes the magnetic base body10, the coil conductor25provided in the magnetic base body10, an external electrode21disposed on the surface of the magnetic base body10, and an external electrode22disposed on the surface of the magnetic base body10at a position spaced apart from the external electrode21. In this specification, a “length” direction, a “width” direction, and a “height” direction of the coil component1correspond to the “L axis” direction, the “W axis” direction, and the “T axis” direction inFIG.1, respectively, unless otherwise construed from the context. The coil component1is mounted on a mount substrate2. A circuit board according to one embodiment includes the coil component1and the mount substrate on which the coil component1is mounted. InFIG.1, the mount substrate is not shown. The mount substrate has two land portions and the coil component1is mounted on the mount substrate2by bonding the external electrodes21,22to the corresponding land portions3of the mount substrate2. The circuit board can be installed in various electronic devices. Electronic devices in which the circuit board2may be installed include smartphones, tablets, game consoles, electrical components of automobiles, and various other electronic devices. The coil component1may be applied to inductors, transformers, filters, reactors, and various other coil components. The coil component1may also be applied to coupled inductors, choke coils, and various other magnetically coupled coil components. The coil component1may be, for example, an inductor used in a DC/DC converter. Applications of the coil component1are not limited to those explicitly described herein. In one embodiment, the base body10is made mainly of a magnetic material and formed in a substantially rectangular parallelepiped shape. The term “rectangular parallelepiped” or “rectangular parallelepiped shape” used herein is not intended to mean solely “rectangular parallelepiped” in a mathematically strict sense. The base body10has a first principal surface10a, a second principal surface10b, a first end surface10c, a second end surface10d, a first side surface10e, and a second side surface10f. These six surfaces define the outer periphery of the base body10. The first principal surface10aand the second principal surface10bare at the opposite ends in the height direction, the first end surface10cand the second end surface10dare at the opposite ends in the length direction, and the first side surface10eand the second side surface10fare at the opposite ends in the width direction. The first principal surface10aopposes the second principal surface10b, the first end surface10copposes the second end surface10d, and the first side surface10eopposes the second side surface10f. The first end surface10cconnects an end of the first principal surface10asituated in a positive direction of the L axis and an end of the second principal surface10bin the positive direction of the L axis. The first principal surface10a, the second principal surface10b, the first end surface10c, the second end surface10d, the first side surface10e, and the second side surface10fare an example of a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, respectively described in the claims. In one embodiment, the first principal surface10aextends in the L axis direction and the W axis direction. In one embodiment, a dimension L1 of the first principal surface10ain the L axis direction is larger than a dimension W1 in the W axis direction. In one embodiment, the base body10has a length (the dimension in the L axis direction) of 1.0 to 4.5 mm, a width (the dimension in the W axis direction) of 0.5 to 3.2 mm, and a height (the dimension in the T axis direction) of 0.5 to 5.0 mm. The dimensions of the base body10are not limited to those specified herein. In one embodiment, the magnetic base body10is made of a composite magnetic material containing a plurality of metal magnetic particles and a binder. The metal magnetic particles may be a particle mixture obtained mixing together two or more types of metal magnetic particles having different average particle sizes. When the metal magnetic particles include large-diameter metal magnetic particles and small-diameter metal magnetic particles, the average particle size of the large-diameter metal magnetic particles is, for example, 10 μm, and the average particle size of the small-diameter metal magnetic particles is, for example, 1 μm. The binder binds the plurality of metal magnetic particles to each other. The binder is, for example, a thermosetting resin having a high insulating property. The magnetic base body10may be a compact in which the metal magnetic particles are bonded to each other without using the binder. The metal magnetic particles can be formed of various soft magnetic materials. For example, a main ingredient of the metal magnetic particles is Fe. Specifically, the metal magnetic particles are particles of (1) a metal such as Fe or Ni, (2) a crystalline alloy such as a Fe—Si—Cr alloy, an Fe—Si—Al alloy, or an Fe—Ni alloy, (3) an amorphous alloy such as an Fe—Si—Cr—B—C alloy or an Fe—Si—Cr—B alloy, or (4) a mixture thereof. The composition of the metal magnetic particles contained in the magnetic base body10is not limited to those described above. An insulating film made of glass, resin, or any other material having excellent insulating properties may be provided on the surface of each metal magnetic particle. The coil conductor25includes a winding portion25awound around the coil axis Ax extending along the thickness direction (T-axis direction), a lead-out portion25b1that connects one end of the winding portion25ato the external electrode21, and a lead-out portion25b2that connects the other end of the winding portion25ato the external electrode22. In the illustrated embodiment, the coil axis Ax intersects the first principal surface10aand the second principal surface10b, but does not intersect the first end surface10c, the second end surface10d, the first side surface10e, and the second side surface10f. In other words, the first end surface10c, the second end surface10d, the first side surface10e, and the second side surface10fextend in the direction along the coil axis Ax. In one embodiment, the coil axis Ax passes through the intersection of two diagonal lines of the base body10when the base body10is viewed in plan. In the illustrated embodiment, the winding portion25ais wound around the coil axis Ax for a plurality of turns in a plane extending along an LW plane. In the illustrated embodiment, the winding portion25ahas a substantially oval shape. The shape of the winding portion25ais not limited to one shown. The winding portion25amay have, for example, an elliptical shape. In one embodiment, the winding portion25ahas a uniform cross-sectional area cut in a direction perpendicular to the direction in which the current flows. In one embodiment, the winding portion25ahas a first portion25a1facing the first end surface10c, a second portion25a2facing the second end surface10d, a third portion25a3facing the first side surface10e, and a fourth portion25a4facing the second side surface10fin a plan view (that is, when viewed from the direction of the coil axis Ax). In the illustrated embodiment, the first portion25a1in a first turn of the winding counted from the lead-out portion25b1extends counterclockwise from one end to the other end of the first portion, and is connected to the lead-out portion25b1at its one end. The third portion25a3in the first turn of the winding extends counterclockwise from one end to the other end of the third portion, and its one end is connected to the other end of the first portion25a1in the first turn. The second portion25a2in the first turn of the winding extends counterclockwise from one end to the other end of the second portion, and its one end is connected to the other end of the third portion25a3in the first turn. The fourth portion25a4in the first turn of the winding extends counterclockwise from one end to the other end of the fourth portion, and its one end is connected to the other end of the second portion25a2in the first turn. The first portion25a1in a second turn of the winding extends counterclockwise from one end to the other end of the first portion, and its one end is connected to the fourth portion25a4in the first turn. In the same manner, the winding portion25aextends and is wound until its end is connected to the lead-out portion25b2. The third portion25a3and the fourth portion25a4connect the first portion25a1and the second portion25a2, respectively. In one embodiment, as shown in the drawing, the first portion25a1has a curved surface26that is convexly curved toward the first end surface10cand faces the first end surface10c. In one embodiment, as shown in the drawing, the second portion25a2has a curved surface27that is convexly curved toward the second end surface10dand faces the second end surface10d. The curved surface26of the first portion25a1and the curved surface27of the second portion25a2may have the same or substantially the same radius of curvature. When a difference between the curvature radius of the curved surface26of the first portion25a1and the curvature radius of the curved surface27of the second portion25a2is 10% or less of the curvature radius of the curved surface26of the first portion25a1, it can be said that the curvature radii of them are substantially the same. In one embodiment, as shown in the drawing, the third portion25a3has a planar surface28that extends parallel to the first side surface10eand faces the first side surface10e. The planar surface28may occupy the entire or a part of the surface of the third portion25a3that faces the first side surface10e. The surface of the third portion25a3facing the first side surface10emay be a composite surface in which the planar surface28and the curved surface are connected. In one embodiment, the surface of the third portion25a3facing the first side surface10emay be a curved surface that curves convexly toward the first side surface10e. In one embodiment, as shown in the drawing, the fourth portion25a4has a planar surface29that extends parallel to the second side surface10fand faces the second side surface10f. Similarly to the third portion25a3, the planar surface29may occupy the entire or a part of the surface of the fourth portion25a4that faces the second side surface10f. The surface of the fourth portion25a4facing the second side surface10fmay be a composite surface in which the planar surface29and the curved surface are connected. In one embodiment, the surface of the fourth portion25a4facing the second side surface10fmay be a curved surface that curves convexly toward the second side surface10f. In one embodiment, the radius of curvature of the first portion25a1is smaller than the radius of curvature of the third portion25a3and the fourth portion25a4. In a more specific embodiment, the curvature radius of the curved surface26of the first portion25a1is smaller than the curvature radius of the surface of the third portion25a3that faces the first side surface10eand the radius of curvature of the surface of the fourth portion25a4that faces the second side surface10f. In one embodiment, the radius of curvature of the second portion25a2is smaller than the radius of curvature of the third portion25a3and the fourth portion25a4. In a more specific embodiment, the curvature radius of the curved surface27of the second portion25a2is smaller than the curvature radius of the surface of the third portion25a3that faces the first side surface10eand the radius of curvature of the surface of the fourth portion25a4that faces the second side surface10f. When the radius of curvature of the first portion25a1is not constant, the average of the curvature radii at each of a plurality of points (for example, three or five points) evenly distributed around the coil axis Ax in the first portion25a1may be defined as the radius of curvature of the first portion25a1, or the maximum value among the curvature radii of the first portion25a1may be defined as the radius of curvature of the first portion25a1. When the radii of curvature of the second portion25a2, the third portion25a3, and the fourth portion25a4are not constant, the radius of curvature of the second portion25a2, the third portion25a3and the fourth portion25a4can be respectively determined in the same manner as the above case where the radius of curvature of the first portion25a1is not constant. In one embodiment, the first portion25a1includes an intersection P1of a perpendicular line drawn from the coil axis Ax to the first end surface10cand the outermost turn of the winding portion25a. In one embodiment, the second portion25a2includes an intersection P2of a perpendicular line drawn from the coil axis Ax to the second end surface10dand the outermost turn of the winding portion25a. In one embodiment, the third portion25a3includes an intersection P3of a perpendicular line drawn from the coil axis Ax to the first side surface10eand the outermost turn of the winding portion25a. In one embodiment, the fourth portion25a4includes an intersection P4of a perpendicular line drawn from the coil axis Ax to the second side surface10fand the outermost turn of the winding portion25a. Boundaries between adjacent portions of the first portion25a1, the second portion25a2, the third portion25a3, and the fourth portion25a4can be defined, for example, as follows. When viewed from the direction of the coil axis Ax, virtual lines connecting the coil axis Ax and the four corners of the base body10are drawn, and these four virtual lines may be defined as the boundary lines between the adjacent portions of the first portion25a1, the second portion25a2, the third portion25a3, and the fourth portion25a4. For example, a virtual line connecting the upper left corner of the base body10with the coil axis Ax from the viewpoint ofFIG.2may be defined as the boundary line between the first portion25a1and the fourth portion25a4. Similarly, from the viewpoint ofFIG.2, virtual lines connecting between the upper right corner, the lower right corner, and the lower left corner of the base body10with the coil axis Ax may be defined as the boundary line between the fourth portion25a4and the second portion25a2, the boundary line between the second portion25a2and the third portion25a3, and the boundary line between the third portion25a3and the first portion25a1, respectively. In one embodiment, a first end margin E1 representing the distance between the first portion25a1of the winding portion25aand the first end surface10cof the base body10is larger than a first side margin S1 representing the distance the distance between the third portion25a3of the winding portion25aand the first side surface10eof the base body10, and a second side margin S2 representing the distance between the fourth portion25a4of the winding portion25aand the second side surface10fof the base body10. In one embodiment, a second end margin E2 representing the distance between the second portion25a2of the winding portion25aand the second end surface10dof the base body10is larger than any of the first side margin S1 and the second side margin S2. In one embodiment, the end margin E1 and the end margin E2 are both in the range of 1.5 to 10 times the side margin S1 and the side margin S2. In one embodiment, the first end margin E1 and the second end margin E2 may be the same or substantially the same. When a difference between the first end margin E1 and the second end margin E2 is 10% or less of the first end margin E1, it can be considered that the first end margin E1 and the second end margin E2 are substantially the same. In one embodiment, the first side margin S1 and the second side margin S2 may be the same or substantially the same. When a difference between the first side margin S1 and the second side margin S2 is 10% or less of the first side margin S1, it can be considered that the first side margin S1 and the second side margin S2 are substantially the same. As shown, in one embodiment, the lead-out portion25b1extends along the coil axis Ax. In one embodiment, the lead-out portion25b2extends along the coil axis Ax. If the area occupied by the lead-out portion in the cross section perpendicular to the coil axis Ax becomes too large, the inductance of the coil component1may deteriorate because the lead-out portion obstructs the passage of magnetic flux. According to the illustrated embodiment, since one end of the winding portion25aand the external electrode21are coupled to each other via the lead-out portion25b1extending along the coil axis Ax, it is possible to prevent degradation of inductance due to the lead-out portion that connects the one end of the winding portion25aand the external electrode21. Further, according to the illustrated embodiment, since the other end of the winding portion25aand the external electrode22are coupled to each other via the lead-out portion25b2extending along the coil axis Ax, it is possible to prevent degradation of inductance due to the lead-out portion that connects the other end of the winding portion25aand the external electrode22. In one embodiment, the ratio of the area of the winding portion25ato the area of the first principal surface10aviewed from the direction of the coil axis Ax is 0.3 or more. When the shape of the first principal surface10aviewed from the direction of the coil axis Ax is rectangular, the dimension in the L-axis direction is L1 and the dimension in the W-axis direction is W1, so that the area S1 of the first principal surface10ais represented as S1=L1×W1. When the area of the winding portion25aviewed from the direction of the coil axis Ax is S2, S2/S1 is 0.3 or more in one embodiment. There is a demand for coil components that allow a large current to run therethrough while keeping the coil components small in their external dimensions. In order to realize such a coil component, the sectional area of its coil conductor is likely to be increased. As the sectional area of the coil conductor is increased, the area S2 of the winding portion25aviewed from the direction of the coil axis Ax is also increased. In particular, when S2 is increased as much as S2/S1 becomes 0.3 or more and if the side margin and the end margin are the same, a sufficient area through which the magnetic flux passes cannot be secured, and the inductance may be deteriorated. Thus, when S2/S1 is 0.3 or more, it is effective to optimize the ratio of the side margin to the end margin and design the coil conductor such that a sufficient area for the magnetic flux is secured. When S2/S1 is less than 0.3, a sufficient area through which the magnetic flux passes is secured even if the side margin and the end margin are the same. Therefore the inductance will not be deteriorated so much that it will not become a practical problem. An example of manufacturing method of the coil component1according to one embodiment of the invention will now be described. The following describes an example of the manufacturing method of the coil component1using a compression molding process. To begin with, metal magnetic particles are prepared. An insulating film may be provided on surfaces of the metal magnetic particles as necessary. The metal magnetic particles may be a particle mixture obtained by mixing together two types of metal magnetic particles having different average particle sizes. The prepared metal magnetic particles, a resin material, and a diluting solvent are then mixed to prepare a composite magnetic material. Subsequently, the coil conductor25prepared in advance is placed in a molding die, and a molding pressure is applied thereto at a temperature of, for example, 50 to 150° C., and then further heated 150 to 400° C. for curing. In this way, the magnetic base body10including the coil conductor25thereinside can be obtained. The coil conductor25is configured and arranged such that the first end margin E1 and the second end margin E2 are larger than any of the first side margin S1 and the second side margin S2 when viewed from the direction of the coil axis Ax. The heat treatment for obtaining the magnetic base body10may be performed in two steps as described above or in one step. When the heat treatment is performed in one step, molding and curing are performed during the heat treatment. In the base body10, the resin contained in the composite magnetic material is cured and serves as the binder. The base body10may be warm molded at a temperature of, for example, around 80° C. The molding pressure for molding is, for example, 50 to 200 MPa. The molding pressure can be appropriately adjusted to obtain a desired filling factor. The molding pressure is, for example, 100 MPa. Next, a conductor paste is applied to a surface of the magnetic base body10, which is produced in the above-described manner, to form the external electrodes21and22. The external electrode21is electrically connected to one end of the coil conductor25inside the magnetic base body10, and the external electrode22is electrically connected to the other end of the coil conductor25inside the magnetic base body10. The coil component1is obtained, as described above. The coil component1manufactured is mounted on the mount substrate2by a reflow process. In this process, the mount substrate having the coil component1provided thereon passes at a high speed through a reflow furnace heated to, for example, a peak temperature of 260° C., and then the external electrodes21,22are soldered to the corresponding land portions3of the mount substrate. In this way, the coil component1is mounted on the mount substrate, and thus the circuit board is manufactured. Next, a description is given of inductor characteristics of the coil component1in one embodiment. For a simulation of inductor characteristics, four evaluation models (evaluation models #1 to #4) were created. Each of the valuation models #1 to #4 is a model of the coil component1. Each of the evaluation models #1 to #4 has a rectangular parallelepiped base body corresponding to the base body10, a conductor corresponding to the coil conductor25, and two electrodes corresponding to the external electrodes21and22. The length dimension (dimension in the L-axis direction) of the base body was 2.0 mm, the width dimension (dimension in the W-axis direction) was 1.2 mm, and the height dimension (dimension in the T-axis direction) was 1.2 mm. In each evaluation model, the conductor corresponding to the coil conductor25is wound around a coil axis corresponding to the coil axis Ax by 10.5 turns. In the evaluation model #1, the distance from the conductor to the surface of the base body when viewed from the direction of the coil axis was set to 0.25 mm. That is, in the evaluation model #1, both the end margin and the side margin were set to 0.25 mm. In each evaluation model, when the end margin and the side margin are equal to each other, the end margin (or the side margin) is referred to as a reference margin. In the evaluation models #2 to #4, the reference margins were set to 0.2 mm, 0.15 mm, and 0.1 mm, respectively. For each of the evaluation models #1 to #4 configured as described above, the end margin and the side margin are increased or reduced by 0.05 mm while maintaining the total of the end margin and the side margin at a constant value (twice the reference margin). The inductance L after changing the end margin and the side margin in this way was calculated by simulation. The simulation results are shown inFIG.3.FIG.3is a graph showing the simulation results of the inductance L of the evaluation models #1 to #4. The horizontal axis shows the ratio of the end margin E to the side margin S on a logarithmic scale, and the vertical axis shows the calculated inductance. InFIG.3, for the evaluation model #1 in which the reference margin was set to 0.25 mm, the simulation result of the inductance when the end margin and the reference margin were equal is plotted at the origin (E/S=1) of the X axis. To the right of the plot at the origin, the inductance resulted from a simulation in which the end margin is increased by 0.05 from the reference margin to 0.30 mm, and the side margin is reduced from the reference margin by 0.05 to 0.20 mm is plotted at X=1.5 (=0.3/0.2) on the X axis. Other simulation results were calculated in the same manner, and the calculated simulation results are plotted in the graph ofFIG.3. When the end margin or the side margin becomes zero by subtracting 0.05 mm, 0.01 was used instead of zero for convenience of calculation. As shown in the figure, in any case where the reference margin was 0.10 to 0.25 mm, it was found that the inductance was improved by increasing the dimension corresponding to the end margin relative to the side margin. Next, a coil component101relating to another embodiment of the present invention will be described with reference toFIGS.4and5. The coil component101is different from the coil component1in that it includes a coil conductor wound in a spiral pattern unlike the coil conductor25awound a plurality of turns in a plane. As shown inFIGS.4and5, the coil component101includes a coil conductor125provided in a magnetic base body110, an external electrode121provided on the magnetic base body110, and an external electrode122provided on the surface of the magnetic base body110at a position spaced apart from the external electrode121. The magnetic base body110is made of a magnetic material similarly to the magnetic base body10. The coil component101may be mounted on a mount substrate2a. The mount substrate2ahas two land portions3provided thereon. The coil component101is mounted on the mount substrate2aby bonding the external electrodes121,122to the corresponding land portions3of the mount substrate2a. The circuit board2is configured by mounting the coil component101on the mount substrate2a. The circuit board2according to one embodiment includes the coil component101and the mount substrate2aon which the coil component101is mounted. The circuit board2may include any electronic components in addition to the coil component101. The magnetic base body110has a substantially rectangular parallelepiped shape. The magnetic base body110has a first principal surface110a, a second principal surface110b, a first end surface110c, a second end surface110d, a first side surface110e, and a second side surface110f. The outer surface of the magnetic base body110is defined by these six surfaces. The first principal surface110aand the second principal surface110bare at the opposite ends in the height direction, the first end surface110cand the second end surface110dare at the opposite ends in the length direction, and the first side surface110eand the second side surface110fare at the opposite ends in the width direction. The description of the magnetic base body10also applies to the magnetic base body110where it is possible. The coil conductor125includes a winding portion125awound around the coil axis Ax extending along the thickness direction (T-axis direction), a lead-out portion125b1that connects one end of the winding portion125ato the external electrode121, and a lead-out portion125b2that connects the other end of the winding portion125ato the external electrode122. Similarly to the winding portion25a, the winding portion125aincludes a first portion125a1facing the first end surface110c, a second portion125a2facing the second end surface110d, a third portion125a3facing the first side surface110e, and a fourth portion125a4facing the second side surface110f. In the illustrated embodiment, the fourth portion125a4in a first turn of the winding counted from the lead-out portion125b1extends clockwise from one end to the other end of the fourth portion, and is connected to the lead-out portion125b1at its one end. The second portion125a2in the first turn of the winding extends clockwise from one end to the other end of the second portion, and its one end is connected to the other end of the fourth portion125a4in the first turn. The third portion125a3in the first turn of the winding extends clockwise from one end to the other end of the third portion, and its one end is connected to the other end of the second portion125a2in the first turn. The third portion125a1in the first turn of the winding extends clockwise from one end to the other end of the first portion, and its one end is connected to the other end of the third portion125a3in the first turn. The third portion125a3in the second turn of the winding extends clockwise from one end to the other end of the third portion, and its one end is connected to the other end of the first portion125a1in the first turn. In the same manner, the winding portion125aextends and is wound until its end is connected to the lead-out portion125b2. As described above, the third portion125a3and the fourth portion125a4connect the first portion125a1and the second portion125a2, respectively. Boundaries between adjacent portions of the first portion125a1, the second portion125a2, the third portion125a3, and the fourth portion125a4can be defined, for example, in the same manner as the portions of the winding portion25a. For example, when viewed from the direction of the coil axis Ax, virtual lines connecting the coil axis Ax and the four corners of the base body110are drawn, and these four virtual lines may be defined as the boundary lines between the adjacent portions of the first portion125a1, the second portion125a2, the third portion125a3, and the fourth portion125a4. In one embodiment, as shown in the drawing, the first portion125a1has a curved surface126that is convexly curved toward the first end surface110cand faces the first end surface110c. In one embodiment, as shown in the drawing, the second portion125a2has a curved surface127that is convexly curved toward the second end surface110dand faces the second end surface110d. In one embodiment, as shown in the drawing, the third portion125a3has a curved surface128that is convexly curved toward the first side surface110eand faces the first side surface110e. In one embodiment, as shown in the drawing, the fourth portion125a4has a curved surface129that is convexly curved toward the second side surface110fand faces the second side surface110f. In one embodiment, the radius of curvature of the first portion125a1is smaller than the radius of curvature of any of the third portion125a3and the fourth portion125a4. In a more specific embodiment, the curvature radius of the curved surface126of the first portion125a1is smaller than the curvature radius of the curved surface128of the third portion125a3and the radius of curvature of the curved surface129of the fourth portion125a4. In one embodiment, the radius of curvature of the second portion125a2is smaller than the radius of curvature of any of the third portion125a3and the fourth portion125a4. In a more specific embodiment, the curvature radius of the curved surface127of the second portion125a2is smaller than the curvature radius of the curved surface128of the third portion125a3and the radius of curvature of the curved surface129of the fourth portion125a4. When the radius of curvature of the first portion125a1is not constant, the average of the curvature radii at each of a plurality of points (for example, three or five points) evenly distributed around the coil axis Ax in the first portion125a1may be defined as the radius of curvature of the first portion125a1, or the maximum value among the curvature radii of the first portion125a1may be defined as the radius of curvature of the first portion125a1. When the radii of curvature of the second portion125a2, the third portion125a3, and the fourth portion125a4are not constant, the radius of curvature of the second portion125a2, the third portion125a3and the fourth portion125a4can be respectively determined in the same manner as the above case where the radius of curvature of the first portion125a1is not constant. The arrangement of the winding portion125ain the base body110of the coil component101is the same as the arrangement of the winding portion25ain the base body10of the coil component1described above. In one embodiment, the first end margin E1 representing the distance between the first portion125a1of the winding portion125aand the first end surface110cof the base body110is larger than the first side margin S1 representing the distance the distance between the third portion125a3of the winding portion125aand the first side surface110eof the base body110, and the second side margin S2 representing the distance between the fourth portion125a4of the winding portion125aand the second side surface110fof the base body110. In one embodiment, the second end margin E2 representing the distance between the second portion125a2of the winding portion125aand the second end surface110dof the base body110is larger than any of the first side margin S1 and the second side margin S2. The coil component101may be manufactured by a compression molding process in the same manner as the coil component1. The coil component101manufactured is mounted on the mount substrate2by a reflow process. In this process, the mount substrate2having the coil component101provided thereon passes at a high speed through a reflow furnace heated to, for example, a peak temperature of 260° C., and then the external electrodes121,122are soldered to the corresponding land portions3of the substrate2. In this way, the coil component101is mounted on the mount substrate, and thus the circuit board2is manufactured. Next, with reference toFIGS.6to8, a description is given of a coil component201according to another embodiment of the present invention. The coil component201is a laminated coil. As shown, the coil component201includes a magnetic base body210, a coil conductor225disposed in the magnetic base body210, an external electrode221disposed on the magnetic base body210, and an external electrode222disposed on the magnetic base body210at a position spaced apart from the external electrode221. The magnetic base body210is made of a magnetic material similarly to the magnetic base body10. The magnetic base body210is formed of a magnetic material in a rectangular parallelepiped shape. The magnetic base body210includes a magnetic layer220having a coil225embedded therein, an upper cover layer218formed on the upper surface of the magnetic layer220and made of a magnetic material, and a lower cover layer219formed on the lower surface of the magnetic layer220and made of a magnetic material. The upper cover layer218includes magnetic films218ato218dmade of a magnetic material, and the lower cover layer219includes magnetic films219ato219dmade of a magnetic material. The boundary between the magnetic layer220and the upper cover layer218and the boundary between the magnetic layer220and the lower cover layer219may not be clearly identified depending on the manufacturing method used to fabricate the magnetic base body10. The magnetic base body210is generally shaped as a rectangular parallelepiped and has a first principal surface210a, a second principal surface210b, a first end surface210c, a second end surface210d, a first side surface210e, and a second side surface210f. The outer surface of the magnetic base body210is defined by these six surfaces. The first principal surface210aand the second principal surface210bare at the opposite ends in the height direction, the first end surface210cand the second end surface210dare at the opposite ends in the length direction, and the first side surface210eand the second side surface210fare at the opposite ends in the width direction. The description of the magnetic base body10also applies to the magnetic base body210where it is possible. The magnetic layer220includes magnetic films211to214. In the magnetic layer220, the magnetic films211,212,213, and214are stacked in the stated order from the positive side to the negative side in the T-axis direction. On the respective upper surfaces of the magnetic films211to214, conductor patterns C11 to C14 are formed. The conductor patterns C11 to C14 are formed by, for example, printing a conductive paste made of a highly conductive metal or alloy via screen printing. The conductive paste may be made of Ag, Pd, Cu, Al, or an alloy thereof. The magnetic films211to213are provided with vias V1 to V3, respectively, at a predetermined position therein. The vias V1 to V3 are formed by forming a through-hole at the predetermined position in the magnetic films211to213so as to extend through the magnetic films211to213in the T axis direction and filling the through-holes with a conductive material. Each of the conductor patterns C11 to C14 is electrically connected to the respective adjacent conductor patterns through the vias V1 to V3. The conductor patterns C11 to C14 connected in this manner form the spiral coil conductor225. As shown inFIG.7, the coil conductor225includes a winding portion225awound around the coil axis Ax extending along the thickness direction (T-axis direction), a lead-out portion225b1that connects one end of the winding portion225ato the external electrode221, and a lead-out portion225b2that connects the other end of the winding portion225ato the external electrode222. Similarly to the winding portion25a, the winding portion225aincludes a first portion225a1facing the first end surface210c, a second portion225a2facing the second end surface210d, a third portion225a3facing the first side surface210e, and a fourth portion225a4facing the second side surface210f. In the illustrated embodiment, the first portion225a1in a first turn of the winding extends clockwise from one end to the other end of the first portion, and is connected to the lead-out portion225b1at its one end. The fourth portion225a4in the first turn of the winding extends clockwise from one end to the other end of the fourth portion, and its one end is connected to the other end of the first portion225a1in the first turn. The second portion225a2in the first turn of the winding extends clockwise from one end to the other end of the second portion, and its one end is connected to the other end of the fourth portion225a4in the first turn. The third portion225a3in the first turn of the winding extends clockwise from one end to the other end of the third portion, and its one end is connected to the other end of the second portion225a2. The first portion225a1in the second turn of the winding extends clockwise from one end to the other end of the first portion, and its one end is connected to the other end of the third portion225a3in the first turn. In the same manner, the winding portion225aextends and is wound until its end is connected to the lead-out portion225b2. As described above, the third portion225a3and the fourth portion225a4connect the first portion225a1and the second portion225a2, respectively. Boundaries between adjacent portions of the first portion225a1, the second portion225a2, the third portion225a3, and the fourth portion225a4can be defined, for example, in the same manner as the portions of the winding portion25a. For example, when viewed from the direction of the coil axis Ax, virtual lines connecting the coil axis Ax and the four corners of the base body210are drawn, and these four virtual lines may be defined as the boundary lines between the adjacent portions of the first portion225a1, the second portion225a2, the third portion225a3, and the fourth portion225a4. In one embodiment, as shown in the drawing, the first portion225a1has a curved surface226that is convexly curved toward the first end surface210cand faces the first end surface210c. In one embodiment, as shown in the drawing, the second portion225a2has a curved surface227that is convexly curved toward the second end surface210dand faces the second end surface210d. In one embodiment, as shown in the drawing, the third portion225a3has a curved surface228that is convexly curved toward the first side surface210eand faces the first side surface210e. In one embodiment, as shown in the drawing, the fourth portion225a4has a curved surface229that is convexly curved toward the second side surface210fand faces the second side surface210f. In one embodiment, the radius of curvature of the first portion225a1is smaller than the radius of curvature of any of the third portion225a3and the fourth portion225a4. In a more specific embodiment, the curvature radius of the curved surface226of the first portion225a1is smaller than the curvature radius of the curved surface228of the third portion225a3and the radius of curvature of the curved surface229of the fourth portion225a4. In one embodiment, the radius of curvature of the second portion225a2is smaller than the radius of curvature of any of the third portion225a3and the fourth portion225a4. In a more specific embodiment, the curvature radius of the curved surface227of the second portion225a2is smaller than the curvature radius of the curved surface228of the third portion225a3and the radius of curvature of the curved surface229of the fourth portion225a4. When the radius of curvature of the first portion225a1is not constant, the average of the curvature radii at each of a plurality of points (for example, three or five points) evenly distributed around the coil axis Ax in the first portion225a1may be defined as the radius of curvature of the first portion225a1, or the maximum value among the curvature radii of the first portion225a1may be defined as the radius of curvature of the first portion225a1. When the radii of curvature of the second portion225a2, the third portion225a3, and the fourth portion225a4are not constant, the radius of curvature of the second portion225a2, the third portion225a3and the fourth portion225a4can be respectively determined in the same manner as the above case where the radius of curvature of the first portion225a1is not constant. The arrangement of the winding portion225ain the base body210of the coil component201is the same as the arrangement of the winding portion25ain the base body10of the coil component1described above. For example, in one embodiment, the first end margin E1 representing the distance between the first portion225a1of the winding portion225aand the first end surface210cof the base body210is larger than the first side margin S1 representing the distance the distance between the third portion225a3of the winding portion225aand the first side surface210eof the base body210, and the second side margin S2 representing the distance between the fourth portion225a4of the winding portion225aand the second side surface210fof the base body210. In one embodiment, the second end margin E2 representing the distance between the second portion225a2of the winding portion225aand the second end surface210dof the base body210is larger than any of the first side margin S1 and the second side margin S2. Next, a description is given of an example of a manufacturing method of the coil component201. The coil component201can be produced by, for example, a lamination process. An example is hereinafter described of the production method of the coil component201using the lamination process. To begin with, sheets of a magnetic material are formed, which are to be used as the magnetic films218ato218dconstituting the upper cover layer218, the magnetic films211to214constituting the magnetic layer220, and the magnetic films219ato219dconstituting the lower cover layer219. These sheets of a magnetic material are made of a composite magnetic material containing a binder and a plurality of metal magnetic particles. The magnetic sheets for the coil component201can be produced in the same manner as the magnetic sheets used in the manufacturing process of the coil component1. The coil conductor is then provided in the sheets of the magnetic material. Specifically, a through-hole is formed in the respective sheets of the magnetic material, which are to be used as the magnetic films211to213, at a predetermined position so as to extend through the sheets in the direction of the axis T. Following this, a conductive paste is printed by screen printing on the upper surface of each of the sheets of the magnetic material, which are to be used as the magnetic films211to214, so that an unfired conductor pattern is formed on each sheet of the magnetic material. Also, the through-hole formed in each sheet of the magnetic material is filled with the conductive paste. Subsequently, the sheets of the magnetic material, which serve as the magnetic films211to214, are stacked to obtain a coil laminated body. The sheets of the magnetic material, which serve as the magnetic films211to214, are stacked such that the conductor patterns C11 to C14 formed on the respective sheets of the magnetic material are each electrically connected to the adjacent conductor patterns through the vias V1 to V3. Following this, a plurality of sheets of a magnetic material are stacked to form an upper laminated body, which is to be used as the upper cover layer218. Similarly, a plurality of sheets of a magnetic material are stacked to form a lower laminated body, which is to be used as the lower cover layer219. Next, the lower laminated body, the coil laminated body, and the upper laminated body are stacked in the stated order in the direction of the T axis from the negative side to the positive side, and these stacked laminated bodies are bonded together by thermal compression using a pressing machine to produce a main laminated body. Instead of forming the lower, coil and upper laminated bodies, the main laminated body may be formed by sequentially stacking all of the sheets of the magnetic material prepared in advance and bonding the stacked sheets of the magnetic material collectively by thermal compression. Next, the body laminate is diced to a desired size using a cutter such as a dicing machine or a laser processing machine to produce a chip laminate. Next, the chip laminate is subjected to degreasing, and the chip laminate thus degreased is heat-treated. The end portions of the chip laminate are polished by barrel-polishing or the like, if necessary. Next, a conductive paste is applied to both end portions of the chip laminate to form the external electrodes221and222. The coil component201is obtained, as described above. Advantageous effects of the above embodiments will now be described. Conventional coil components are designed such that the end margin and the side margin are the same in order to magnetically effectively use each region of the substrate and to avoid concentration of magnetic flux in a specific region of the substrate. Further, in the conventional coil component, in order to prevent the winding portion of the coil conductor from being exposed from the substrate and to prevent a short circuit between the winding portion and external conductive members, a certain margin is provided between the winding portion and the end and side surfaces of the substrate. When the coil component is fabricated by the laminating process, a printed conductor pattern may deviate from the initial position, the positions of the magnetic sheets may be misaligned when laminating multiple magnetic sheets, and a position to dice may deviate when pieces are separated from each other in the manufacturing process. Since such deviations occur evenly in the length direction (L-axis direction) and the width direction (W-axis direction), in order to avoid defects caused by such deviation (for example, exposure of the winding portion), the margins provided between the winding portion and the surfaces of the base body are set to be the same in the length direction and the width direction. When the coil component is made by a compression molding process using a mold, it is required to have a certain distance between the wall of the mold in which the composite magnetic material is provided and the winding portion of the coil conductor inserted into the mold. The required distances between the wall of the mold and the winding portion are also set to be the same in the length direction and the width direction. As described above, the conventional coil components are designed such that the end margin and the side margin are the same or substantially the same. Whereas the coil conductor may have an oval or elliptical shape when viewed from the coil axis direction, which is a shape in which the dimension in one direction perpendicular to the coil conductor is larger than the dimension in the other direction perpendicular to the coil conductor. Thus the winding portion of the coil conductor may include a portion having a relatively small radius of curvature and a portion having a relatively large radius of curvature. When the current flowing through the coil conductor changes, the magnetic flux tends to concentrate around the portion having a relatively small radius of curvature rather than the portion having a relatively large radius of curvature. In one or more embodiments of the invention, the winding portions25a,125a,225ainclude the first portions25a1,125a1,225a1and the second portions25a2,125a2,225a2respectively that have relatively small radii of curvature, and the third portions25a3,125a3,225a3and the fourth portions25a4,125a4,225a4, respectively that have relatively large radii of curvature. Therefore, in the base bodies10,110,210, magnetic flux tends to concentrate in the region between the first portions25a1,125a1,225a1and the first end surfaces10c,110c,210crespectively, and the region between the second portions25a2,125a2,225a2and the second end surfaces10d,110d,210d, respectively. In one or more embodiments of the invention, the end margin E1, which is the distance between the first portions25a1,125a1,225a1of the winding portions25a,125a,225aand the first end surfaces10c,110c,210c, is larger than the side margin S1, which is the distance between the third portions25a3,125a3,225a3and the first side surfaces10e,110e,210e, and the side margin S2, which is the distance from the fourth portions25a4,125a4,225a4. Therefore it is possible to prevent concentration of magnetic flux in the region between the first portions25a1,125a1,225a1having a relatively small radius of curvature in the winding portions25a,125a,225aand the surfaces of the base bodies10,110and210. Further, in one or more embodiments of the invention, the end margin E2, which is the distance between the second portions25a2,125a2,225a2of the winding portions25a,125a,225aand the second end surfaces10d,110d,210d, is larger than the side margin S1 and the side margin S2. Therefore it is possible to prevent concentration of magnetic flux in the region between the second portions25a2,125a2,225a2having a relatively small radius of curvature in the winding portions25a,125a,225aand the surfaces of the base bodies10,110,210. Further, in one or more embodiments of the invention, the side margins S1 and S2 are smaller than the end margins E1 and E2 so that the external dimensions of the base body are smaller than those of the conventional coil component in which the side margin and the end margin are equal. In other words, the end margin E1 that contributes to the area of the region between the first portion25a1,125a1,225a1and the first end surfaces10c,110c,210c, and the end margin E2 that contributes to the area of the region between the second portions25a2,125a2,225a2and the second end surfaces10d,110d,210d, where the magnetic flux tends to concentrate, are selectively increased in order to prevent degradation of inductance without increasing the width direction size of the base body10. As described above, according to one or more embodiments of the invention, by making the end margins E1 and E2 larger than the side margins S1 and S2, it is possible to prevent concentration of magnetic flux in the region between the first portions25a1,125a1,225a1and the first end surfaces10c,110c,210cand the region between the second portions25a2,125a2,225a2and the second end surfaces10d,110d,210d, thus it is possible to prevent degradation of inductance while reducing the external dimensions of the base bodies10,110,210. As discussed above, according to the one or more embodiments, it is possible to provide the coil components1,101,201having a reduced size while preventing degradation of inductance. The dimensions, materials, and arrangements of the constituent elements described for the above various embodiments are not limited to those explicitly described for the embodiments, and these constituent elements can be modified to have any dimensions, materials, and arrangements within the scope of the present invention. Furthermore, constituent elements not explicitly described herein can also be added to the above-described embodiments, and it is also possible to omit some of the constituent elements described for the embodiments. | 54,084 |
11862388 | DETAILED DESCRIPTION The function of electromagnetic devices such as electrically actuated valves, motors, generators, or transformers is enabled by the controlled magnetization of ferromagnetic cores, or “irons”, made of ferromagnetic materials, preferably laminated. Typically, the stator of a conventional permanent magnet electric motor is made of a plurality of arms of irons each wound with a coil of wire. Current flowing through the coil creates a magnetic field. The presence of the iron or ferromagnetic material with a high magnetic permeability enhances the strength of the coil's magnetic field to provide a larger magnetic flux density. The magnetic flux in the arm then either attracts or repulses the permanent magnets mounted in the rotor of the motor creating a force that produces the desired mechanical motion. Conversely in a typical electrical generator, when the rotor spins, the motion of its permanent magnets induces in each arm of iron a varying magnetic flux and subsequently in each coil, a varying current and voltage. Implementations disclosed and contemplated herein divides the single set of conventional wire coil windings into multiple sets of smaller independent and electrically isolated safe windings (31,32,33. . . ) wrapped around the arms101of the iron1.FIG.1Ais a cross-section of a stator (non-moving component) of an intrinsically safe 12-pole electrical motor according to one implementation. The rotor7or8(moving component) assembly housing multiple permanent magnets are shown inFIGS.1C and1D. The stator cross section shows an iron (ferromagnetic core)1, featuring twelve centrally connected T-shaped arms101, sets of electrical insulating layers2between each arm101, and five separate safe wire windings31,32,33,34,35wound around each iron arm101, featuring multiple turns of wire301for each safe winding31,32,33,34,35. According to some implementations, the five separate safe wire windings are electrically isolated from the arms101and from one another and by a monolithic structure2made of an electrical insulating material as shown inFIG.1B. Voltage and current applied to every safe winding (31,32,33. . . ) is limited to the maximum values obtained from the applicable ignition curves for electrical circuits having equivalent inductance, resistance, and capacitance to those of each safe winding circuit. Page 52 of the ACRI2001 document (version: 2008 Nov. 4), shows the ignition curves (short circuit current vs. open circuit voltage) for inductive circuits. See alsoFIG.9. An electrical or electronics circuit is considered intrinsically safe if the maximum short circuit current possible—as for example in case a point of the circuit breaks—and the maximum open circuit voltage of their power sources (considered all together if there were several of them) remain below the ignition curve corresponding to the inductance in the circuit. ACRI2001 is published by the U.S. Department of Labor, Mine Safety and Health Administration and sets forth the “CRITERIA FOR THE EVALUATION AND TEST OF INTRINSICALLY SAFE APPARATUS AND ASSOCIATED APPARATUS”. ACRI2001 is incorporated herein by reference in its entirety. When appropriately energized, the cooperative effect of all the safe windings around the same iron arm and all the individual motor arms will create magnetic fields and magnetize the motor's iron core in a manner providing a magnetic flux and associated mechanical power similar to conventional electromagnetic devices while preventing any current diversions capable of igniting an explosion. Each safe winding will not exceed the corresponding ignition limits for voltage and current. In the instance where the rotor moves so that the device behaves as a generator, the voltage and current generated by the windings will remain lower than the ignition limit, even spinning at the maximum speed of the rotor, as there is a symmetrical physical behavior between motor function and generator function. In other words, the specified number of turns associated with each safe winding (31,32,33. . . ) limits the power that can be generated by each safe winding (31,32,33. . . ) so that it must remain below the ignition threshold of any present explosive gases or combustible dusts or mists provided the magnetization oscillation frequency (i.e. speed of the rotor in the case of a motor) does not exceed its maximum design limit. The safe windings (31,32,33. . . ) are additionally electrically insulated by sets of electrical insulating layers2inserted between them preventing potential current deviations or short-circuits. The thickness of the electrical insulating layers2of the present invention are thick enough to prevent current deviation in the worst voltage condition, and are typically thicker than a minimum value mandated by the applicable regulations for the nominal circuit voltage. Similarly, the iron1and iron arms101are also insulated from the safe windings (31,32,33. . . ) by sets of electrically insulating layers2with a thickness necessary to prevent current diversion or short circuits between them. FIG.2shows a three-dimensional and sectioned view of only the motor stator (again without a rotor). The drawing indicates the five separate safe windings (31,32,33,34,35) wound around each T-shaped arm101, each in a separate insulated compartment defined by the insulating layers2. These insulated layers2are shown to be higher than the windings ensuring a creepage distance between windings greater than a minimum value required by explosive atmosphere regulations. Interconnections between coils are not shown. In the present invention every single set of safe windings (31,32,33. . . ) is connected to an independent intrinsically safe circuit. Safe windings (31,32,33. . . ) are connected to safe windings around other arms according to the well-known, conventional rules for construction of multiphase electromagnetic devices, for instance employing either “Δ” or “Y” three-phase circuit connections. In this way, an intrinsically safe circuit will contain no more than a single safe winding (31,32,33. . . ) wound around a single iron arm101. FIG.8is a diagram of the electrical connections envisioned for an implementation of an application of four intrinsically safe motors (81,82,83,84) employed to power an unmanned aerial vehicle. Every single set of safe windings (31,32,33,34,35) is connected separately and respectively to an independent intrinsically safe electronic speed controller (41,42,43,44,45) which is each respectively powered by an independent intrinsically safe direct current (DC) battery (51,52,53,54,55). (In the context of the present invention, an intrinsically safe power supply, such as an intrinsically safe battery, is one having a maximal voltage and short-circuit current that is less than limits specified as necessary to prevent ignition of explosive atmospheres or materials.) A flight controller6sends the four control signals corresponding to the four intrinsically safe motors (81,82,83,84) through respective insulated cables (71,72,73,74). Each of the separate motor control signals is provided to the five electronic speed controllers (41,42,43,44,45) of each intrinsically safe motor (81,82,83,84). Only those of motor81are numbered inFIG.8. The controller6is powered by an independent intrinsically safe battery56. As explained above, the implementation ofFIG.8includes a set of safe windings31is connected to an electronic speed controller41which is powered by an independent intrinsically safe direct current (DC) battery51. A second set of safe windings32is connected to an electronic speed controller42which is powered by an independent intrinsically safe battery52. This circuit architecture can be repeated to create as many intrinsically safe circuits as needed for a given application. In an implementation of an intrinsically safe permanent magnet motor, the electrical insulating layers2to space safe windings (31,32,33. . . ) in the stator may be configured as independent strips or as assemblies combining several strips that can be inserted axially before completing the coil winding process. This insulation configuration offers the advantage of ensuring effective insulation while potentially being efficient to manufacture and assemble. FIG.3shows a top view of the motor stator (without a rotor) indicating the necessary isolation of neighboring safe windings and their “Δ” connections wires (311,321,331,341,351) whose path is essentially contained in a transverse plane and associated axial “Δ” connection wires (312,322,332,342,352); as corresponding to a three-phase delta motor circuit configuration. Additionally, as shown inFIGS.4-7, an implementation for a three-phase intrinsically safe permanent magnet motor will be provided with a series of insulating caps (91,92,93and94) characterized by having their individual thicknesses equal to or greater than the minimum thickness required to prevent current deviation for the applied voltage and additionally provided with holes to let some wires cross it axially and provided with concentric circular grooves where other wires and their connections are hosted. In such an implementation for the case of a motor with either “Δ” or “Y” circuit connections, as shown inFIG.4the first insulating layer91is placed to cover the nearest neighboring safe winding circuit connection wires (311,321,331,341,351) the trajectory of which is contained in an essentially transverse plane. Insulating layer91will be provided with holes to let axial connection wires (312,322,332,342,352) to pass through. The first insulating layer lid91is provided with a set of concentric circular grooves where a first set of safe winding “Δ” connection wires (312-1,322-1,332-1,342-1,352-1) lie and are connected to a set of first phase axial insulated wires (313-1,323-1,333-1,343-1,353-1) as well as the other two sets of still axial safe windings “Δ” connection wires (312-2,322-2,332-2,342-2,352-2) and (312-3,322-3,332-3,342-3,352-3). As shown inFIG.5, a second insulating layer lid92is placed on top of the layer lid91and the abovementioned first set of safe windings “Δ” connection wires (312-1,322-1,332-1,342-1,352-1), and provided with holes to let the set of first phase axial insulated wires (313-1,323-1,333-1,343-1,353-1) as well as the second set of safe windings “Δ” connection wires (312-2,322-2,332-2,342-2,352-2) and third set of safe windings “Δ” connection wires (312-3,322-3,332-3,342-3,352-3) to cross though the cap layer92. The insulating layer lid92is additionally provided with a set of concentric circular grooves where a second set of safe windings “Δ” connection wires (312-2,322-2,332-2,342-2,352-2) lie and are connected to a set of second phase axial insulated wires (313-2,323-2,333-2,343-2,353-2). As shown inFIG.6, a third insulating layer lid93placed on top of layer lid92and the abovementioned second set of safe windings “Δ” connection wires (312-2,322-2,332-2,342-2,352-2) and provided with a plurality of holes to let the set of first phase axial insulated wires (313-1,323-1,333-1,343-1,353-1) and the set of second phase axial insulated wires (313-2,323-2,333-2,343-2,353-2) as well as the third set of safe windings “Δ” connection wires (312-3,322-3,332-3,342-3,352-3) to pass through the cap layer93. The insulating cap layer93is additionally provided with a set of concentric circular grooves where the third set of safe windings “Δ” connection wires (312-3,322-3,332-3,342-3,352-3) lie and are connected to a set of third phase axial insulated wires (313-3,323-3,333-3,343-3,353-3). As shown inFIG.7, a fourth insulating layer lid94is provided on top of the third insulating layer lid93and the third set of safe windings “Δ” connection wires (312-3,322-3,332-3,342-3,352-3) and provided with a plurality of holes to let the set of first phase axial insulated wires (313-1,323-1,333-1,343-1,353-1), the set of second phase axial insulated wires (313-2,323-2,333-2,343-2,353-2), and the set of third phase axial insulated wires (313-3,323-3,333-3,343-3,353-3) pass through the insulating layer lid94. The repeated combination of concentric grooves and holes in each of the insulating layers lids (91,92,93,94) has the advantage of maintaining the mandated separation distances between all individual safe circuits while enabling the necessary circuit connections. The intrinsically safe electric device according to the present invention may also be employed as an intrinsically safe electric generator for multiple intrinsically safe circuits. As electrical energy generation in each of the individual safe circuits is proportional to the magnetization variation frequency, current and voltage of every single circuit composed of safe windings can be limited by limiting the rotational speed of the permanent magnet rotor. | 12,868 |
11862389 | DETAILED DESCRIPTION OF THE EMBODIMENTS As discussed above, conventional techniques for improving switching power converter light load efficiency generally have undesirable drawbacks. Applicants have discovered, however, that light load efficiency can often be improved by use of a light load enhancer. Unlike the conventional techniques discussed above, use of a light load enhancer typically does not materially degrade heavy load efficiency. One possible application of a light load enhancer is in a buck-type DC-to-DC switching power converter. For example,FIG.3illustrates a buck DC-to-DC switching power converter300including a light load enhancer302. As discussed below, light load enhancer302operates in certain operating modes of converter300to promote efficient light load operation. Converter300includes an input power port304for electrically coupling to an input power source (not shown), and an output power port306for electrically coupling to a load (not shown). Input power port304is electrically coupled across input and common power nodes308,310, and output power port306is electrically coupled across an output power node312and common power node310. In some embodiments, common power node310is electrically coupled to ground, such that common power node310is a ground node. Converter300further includes a first control switching device314, a first freewheeling switching device316, a first inductor318, and a capacitor320. In the context of this disclosure, a switching device includes, but is not limited to, a bipolar junction transistor, a field effect transistor (e.g., a N-channel or P-channel metal oxide semiconductor field effect transistor, a junction field effect transistor, a metal semiconductor field effect transistor), an insulated gate bipolar junction transistor, a thyristor, or a silicon controlled rectifier. Additionally, in the context of this document, a freewheeling device, such as a freewheeling switching device or a freewheeling diode, is a device that performs a freewheeling function. That is, a freewheeling device provides a path for current flowing through one or more inductors when a control switching device electrically coupled to the one or more inductors is in its non-conductive state. First control switching device314is electrically coupled between input power node308and a first switching node Vx1, and first freewheeling switching device316is electrically coupled between first switching node Vx1 and common power node310. First inductor318is electrically coupled between first switching node Vx1 and output power node312, and capacitor320is electrically coupled between output power node312and common power node310. Light load enhancer302includes a second control switching device322, a second freewheeling switching device324, and a second inductor326. Second control switching device322is electrically coupled between input power node308and a second switching node Vx2, and second freewheeling switching device324is electrically coupled between second switching node Vx2 and common power node310. Second inductor326is electrically coupled between second switching node Vx2 and first switching node Vx1, such that first and second inductors318,326are electrically coupled in series. First and second inductors318,326are physically separate components in some embodiments. However, in some other embodiments, first and second inductors318,326are part of a common magnetic device, such as discussed below with respect toFIGS.29-95. A controller328controls operation of switching power converter300. Although controller328is symbolically shown as a single element, in some embodiments, controller328encompasses a number of separate elements. For example, in certain embodiments where the switching devices include transistors, controller328includes: (1) driver circuitry for causing the transistors to switch between their conductive and non-conductive states, and (2) control logic for controlling the driver circuitry. Converter300has at least a first and a second operating mode. Controller328is typically adapted to operate converter300in its first operating mode under moderate or heavy load operating conditions, and to operate converter300in its second operating mode under light load operating conditions. FIG.4illustrates operation of converter300in its first operating mode. Second switching devices322,324are adapted to operate in their non-conductive states in the first operating mode. Specifically, controller328causes second switching devices322,324to remain in their non-conductive states in the first operating mode, thereby causing light load enhancer302to be inactive. Accordingly, second switching devices322,324are replaced with capacitors422,424inFIG.4, to represent that these devices remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the first operating mode. Controller328also controls switching of first control and freewheeling switching devices314,316such that these switching devices, along with first inductor318and capacitor320, collectively form a first buck sub-converter330transferring power from input power port304to output power port306, in the first operating mode. Specifically, controller328causes first control switching device314to repeatedly switch between its conductive and non-conductive states to cause current through first inductor318to ramp up and down, and controller328causes first freewheeling switching device316to repeatedly switch between its conductive and non-conductive states to perform a freewheeling function. In other words, controller328controls first freewheeling switching device316such that it provides a path for current flowing through first inductor318when first control switching device314is in its non-conductive state, in the first operating mode. Thus, first switching devices314,316are adapted to repeatedly switch between their conductive and non-conductive states in the first operating mode. FIG.5illustrates operation of converter300in its second operating mode. First switching devices314,316are adapted to operate in their non-conductive states in the second operating mode. Specifically, controller328causes first switching devices314,316to remain in their non-conductive states in the second operating mode. Accordingly, first switching devices314,316are replaced with capacitors514,516inFIG.5, to represent that switching devices314,316remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the second operating mode. Controller328also controls operation of light load enhancer302such that it, along with first inductor318and capacitor320, collectively form a second buck sub-converter332transferring power from input power port304to output power port306, in the second operating mode. Specifically, controller328causes second control switching device322to repeatedly switch between its conductive and non-conductive states to cause current through both first and second inductors318,326to ramp up and down, and controller328causes second freewheeling device324to repeatedly switch between its conductive and non-conductive states to provide a path for current through first and second inductors318,326when second control switching device322is in its non-conductive state. Thus, second switching devices322,324are each adapted to repeatedly switch between their conductive and non-conductive states in the second operating mode. Thus, first buck sub-converter330, which includes first inductor318, transfers power from input power port304to output power port306, in the first operating mode. On the other hand, second buck sub-converter332, which includes both first and second inductors318,326, transfers power from input power port304to output power port306, in the second operating mode. As discussed above, large energy storage inductor values promote high light load efficiency. However, large energy storage inductance values degrade converter transient response, and transient response is often an important converter parameter under heavy load conditions, or when transitioning from light load to heavy load conditions. Additionally, large energy storage inductor values often degrade heavy load efficiency, due to large inductor winding resistance that typically accompanies large inductance values. Thus, in short, large energy storage inductance values are beneficial at light load, but are undesirable at heavy load. Use of light load enhancer302, however, enables certain embodiments of converter300to obtain the benefits of high energy storage inductance at light loads, without the drawbacks at heavy loads. In particular, in the converter's first operating mode, which corresponds to moderate or heavy load operation, converter300has an effective energy storage inductance corresponding to the inductance value of first inductor318. However, in the converter's second operating mode, which corresponds to light load operation, converter300has an effective energy storage inductance corresponding to the sum of the inductance value of first inductor318and the inductance value of second inductor326. Because the of sum inductor318and326values is greater than the value of inductor318alone, converter300has a larger energy storage inductance value at light loads than at moderate or heavy loads. Thus, light load enhancer302enables converter300to operate with a relatively large inductance value at light load and relatively small inductance value at heavy load. The ability to have different energy storage inductance values at light and heavy loads enables inductance to be optimized for both light and heavy loads. For example, in some embodiments, second inductor326has a larger inductance value than first inductor318, to maximize both light and heavy load efficiency and promote good heavy load transient response. Additionally, output voltage Vo ripple will be smaller in the second operating mode than in the first operating mode, assuming constant frequency, continuous conduction mode operation in both operating modes, due to effective energy storage inductance being greater in the second operating mode than in the first operating mode. Thus, converter300's switching frequency could be reduced in the second operating mode while maintaining the same ripple voltage magnitude as in the first operating mode, thereby further increasing light load efficiency. Accordingly, in some embodiments, controller328is adapted to operate converter300at a lower switching frequency in the second operating mode than in the first operating mode. Use of light load enhancer302also promotes low inductor core losses at light load by reducing voltage applied across energy storage inductors. Inductor magnetic flux density is proportional to voltage across the inductor, and core losses are approximately proportional to between the second and third power of flux density. Thus, reducing voltage across an inductor by one half will reduce core losses in the inductor to one fourth to one eighth of their full voltage value. In conventional buck converters, the input-output voltage differential (Vin−Vout) is applied across a single inductor under all load conditions. In converter300, in contrast, the input-output voltage differential is applied across two inductors at light load. In particular, the input-output voltage differential is divided between first and second inductors318,326according to their inductance value, when second control switching device322is in its conductive state. For example, in an embodiment where first and second inductors318,326have the same inductance value, the voltage differential is evenly divided between the two inductors, thereby reducing voltage across each inductor by one half, and reducing core losses in each inductor by a factor of four to eight, compared to a conventional converter where the entire voltage differential is applied across a single inductor. While the reduction in core losses in each inductor318,326is partially offset by the fact that there are two inductors, use of two inductors at light load still reduces net core loss by a factor two to four, assuming otherwise identical inductor core material, construction, and total inductance value, compared to a conventional converter where the entire voltage differential is applied across a single inductor. It is anticipated that in many applications, second inductor326can have a relative low current rating because light load enhancer302is inactive in the first operating mode. A low inductor current rating helps negate the impact of winding resistance, thereby potentially allowing use of a large number of winding turns. A large number of winding turns helps achieve large inductance values. Additionally, a large number of winding turns results in relatively low magnetic flux density levels, thereby potentially allowing use of a small size magnetic core. Thus, in certain embodiments, second inductor326has a smaller core size and a greater number of winding turns than first inductor318, such that second inductor326has a larger inductance value and smaller current rating than first inductor318. FIG.6shows a plot of estimated efficiency versus output current Io for both conventional converter100(FIG.1) and converter300with light load enhancer302(FIG.3). Curve602(solid line) corresponds to converter100, and curve604(dashed line) corresponds to converter300. Both converters have essentially the same efficiency curves at heavy load, thereby showing that incorporation of light load enhancer302in converter300does not materially impact heavy load efficiency. However, converter300has a significantly higher efficiency than converter100over much of the light load range, thereby showing that light load enhancer302can significantly improve light load efficiency. A step606change in efficiency resulting from converter300switching between its first and second operating modes at output current level Iacan be seen inFIG.6. In some embodiments, controller328is adapted to switch converter300between the first and second operating modes. For example, in certain embodiments, controller328determines or estimates the magnitude of a load powered from output port306, or a characteristic associated with load, such as output current magnitude, and sets the converter's operating mode accordingly. In these embodiments, controller328switches converter300from its first to its second operating mode if output power, or a related characteristic, falls below a first threshold value, and controller328switches converter300from its second to its first operating mode if output power, or a related characteristic, rises above a second threshold value. The second threshold value is typically greater than the first threshold value to create hysteresis in the transition between operating modes. Output power is determined or estimated, for example, from one or more of converter input voltage Vin, converter input current Iin, converter output current Io, and converter output voltage Vo. In some other embodiments, controller328is adapted to switch converter300between its first and second operating modes in response to one or more external signals, such as a signal representing actual or expected power consumption of a load powered by converter300. For example, in certain embodiments where converter300powers a processor, such as an information technology device processor, controller328switches between the first and second operating modes in response to a signal, such as a “sleep” signal, from or associated with the processor. In some embodiments, controller328is operable to switch converter300from its second to its first operating mode before an expected load increase, thereby causing converter300to have relatively small energy storage inductance and high potential output current at the time of the load increase. In many embodiments, controller328is operable to regulate a converter operating characteristic, such as input voltage Vin, output voltage Vo, input current In, and/or current output current Io. In these embodiments, controller328achieves regulation by controlling switching of first control switching device314in the first operating mode, and by controlling switching of second control switching device322in the second operating mode. In some embodiments, controller328causes converter300to operate in a continuous conduction mode (CCM) in both the first and second operating modes. As known in the art, CCM operation promotes fast transient response and low ripple voltage magnitude. However, in some alternate embodiments, controller328is operable to cause converter300to operate in a discontinuous conduction mode (DCM) in one or both of the first and second operating modes, to promote efficiency. For example, in a certain embodiment, controller328is adapted to operate converter300in either CCM or DCM sub-modes, as characterized by TABLE 1 below: TABLE 1First Operating ModeSecond Operating ModeLoadHeavyModerateLightVery LightCCM orCCMDCMCCMDCMDCM? In the embodiment characterized by TABLE 1, converter300operates in its first operating mode at heavy and moderate load conditions, and the converter operates in its second operating mode at light and very light load conditions. In its first operating mode, converter300has a first sub-mode characterized by CCM operation at heavy loads, and a second sub-mode characterized by DCM operation at moderate loads. In its second operating mode, converter300has a first sub-mode characterized by CCM operation at light loads, and a second sub-mode characterized by DCM operation at very light loads. In some embodiments supporting DCM, controller328is adapted to switch converter300from its second operating mode to its first operating mode based at least partially on DCM operating conditions. For example, in a certain embodiment, controller328switches converter300from its second operating mode to its first operating mode if DCM pulses exceed a predetermined frequency, or if time between successive DCM pulses is less than a predetermined value. The additional effective energy storage inductance of the second operating mode will cause output voltage Vo ripple to be greater in the second operating mode than in the first operating mode in embodiments supporting peak current mode control DCM. In these embodiments, the DCM peak current threshold can be adjusted to achieve a desired maximum ripple voltage magnitude. In a certain embodiment supporting DCM, controller328sets the DCM peak current threshold such that it is lower in the second operating mode than in the first operating mode, to prevent excessive ripple voltage magnitude in the second operating mode. As discussed above, reducing converter switching device size, such as transistor size, can improve light load efficiency by reducing switching losses associated with parasitic switch capacitance and switch drivers. However, use of small switching devices typically degrades heavy load efficiency because the switching loss reduction associated with small switching devices is typically more than offset by high conduction losses associated with series resistance of small switching devices. Thus, while small switching devices are typically favored at light loads, large switching devices are often preferred at heavy loads. Use of light load enhancer302, however, can enable converter300to realize the benefits of both small and large switching devices. In particular, in some embodiments, first control switching device314and first freewheeling switching device316are relatively large, while second control switching device322and second freewheeling switching device324are relatively small. In these embodiments, converter300therefore operates with relatively large switching devices in its first operating mode, thereby promoting low conduction losses at heavy load, while operating with relatively small switching devices in its second operating mode, thereby promoting low switching losses at light load. Additionally, second inductor326largely prevents parasitic capacitance associated with first control and freewheeling switching devices314,316, which is symbolically shown by capacitors514,516inFIG.5, from being charged and discharged during switching transitions of second pair of switching devices322,324in the second operating mode, thereby further promoting light load efficiency. Parasitic capacitance514,516will, however, help filter voltage spikes generated by switching of second switching node Vx2, thereby reducing potential for electromagnetic interference and/or converter control difficulties from Vx2 voltage spikes. Features of converter300can be varied without departing from the scope hereof. For example, one or both of freewheeling switching devices316,324are replaced with or supplemented by one or more freewheeling diodes in some alternate embodiments, to reduce complexity with the possible tradeoff of increased conduction losses. The freewheeling diodes perform a freewheeling function similar to first and second freewheeling switching devices316,324. In a certain alternate embodiment, first freewheeling switching device316is replaced with a first freewheeling diode electrically coupled between common power node310and first switching node Vx1, and second freewheeling switching device324is replaced with a second diode electrically coupled between common power node310and second switching node Vx2. As another example, in some alternate embodiments, both first and second buck sub-converters330,332are active in the first operating mode to simplify system control. FIG.7illustrates a DC-to-DC switching power converter700, which is similar to converter300ofFIG.3, but with light load enhancer302electrically coupled to output power node312, instead of to first switching node Vx1. Controller328controls operation of converter700such that the converter has at least first and second operating modes, similar to those of converter300. Specifically, in the first operating mode, which is illustrated inFIG.8, first switching devices314and316, first inductor318, and capacitor320collectively form first buck sub-converter330, which transfers power from input power port304to output power port306. Second switching devices322,324remain in their non-conductive states in the first operating mode, and therefore replaced with capacitors822,824inFIG.8, to represent that the switching devices remain in their non-conductive states, but nevertheless exhibit parasitic capacitance. In the second operating mode, which is illustrated inFIG.9, light load enhancer302and capacitor320collectively form a second buck sub-converter734, which transfers power from input power port304to output power port306. First switching devices314,316remain in their non-conductive states in the second operating mode, and are therefore replaced with capacitors914,916inFIG.9to represent that the switching devices remain in their non-conductive states, but nevertheless exhibit parasitic capacitance. In contrast to second buck sub-converter332of converter300, second buck sub-converter734of converter700does not include first inductor318. Accordingly, converter700may allow more freedom in selecting first and second inductors318,326than converter300. However, the fact that second buck sub-converter734includes only a single inductor prevents converter700from realizing light load core loss reduction associated with use of two inductors. Converter700can be adapted to support CCM and/or DCM operation, in a manner similar to that converter300. In some alternate embodiments of converter700, controller328is adapted to control converter700such that both first and second buck sub-converters330,734are active in the first operating mode, while only second buck sub-converter734is active in the second operating mode. Operating both buck sub-converters330,734in the first operating mode promotes large power handling capability in the first operating mode. In embodiments where both buck sub-converters are operable in the first operating mode, controller328is optionally adapted to operate the first and second buck sub-converters out of phase with respect to each other, to enable ripple current cancelation in capacitor320and fast transient response. Light load enhancers can also be used in switching power converters including multiple power stages electrically coupled in parallel, such as in a multi-phase DC-to-DC switching converter. For example,FIG.10illustrates a DC-to-DC switching power converter1000include N power stages1001electrically coupled in parallel, where N is an integer greater than one. In this disclosure, specific instances of an item may be referred to by use of a numeral in parentheses (e.g., power stage1001(1)) while numerals without parentheses refer to any such item (e.g., power stages1001). Converter1000includes an input power port1004for electrically coupling to an input power source (not shown), and an output power port1006for electrically coupling to a load (not shown). Input power port1004is electrically coupled across input and common power nodes1008,1010, and output power port1006is electrically coupled across output and common power nodes1012,1010. Each power stage1001is similar to converter300ofFIG.3. Specifically, each power stage1001includes a first control switching device1014, a first freewheeling switching device1016, and a first inductor1018. The first control switching device1014is electrically coupled between input power node1008and a first switching node Vx1, and the first freewheeling switching device1016is electrically coupled between the first switching node and common power node1010. The first inductor1018is electrically coupled between the first switching node and output power node1012, and a capacitor1020is electrically coupled across output and common power nodes1012,1010. Each power stage1001further includes a light load enhancer1002including a second control switching device1022, a second freewheeling switching device1024, and a second inductor1026. The second control switching device1022is electrically coupled between input power node1008and a second switching node Vx2, and the second freewheeling switching device1024is electrically coupled between the second switching node and common power node1010. Second inductor1026is electrically coupled between second switching node Vx2 and first switching node Vx1, such that first and second inductors1018,1026of each power stage1001are electrically coupled in series. A controller1028controls operation of switching power converter1000. Although controller1028is symbolically shown as a single element, in some embodiments, controller1028encompasses a number of separate elements, such as respective control circuitry in each power stage1001. Like converter300ofFIG.3, converter1000also has a first operating mode corresponding to moderate and heavy load operating conditions, and a second operating mode corresponding to light load operating conditions.FIG.11illustrates operation of converter1000in its first operating mode. In the first operating mode, second switching devices1022,1024are adapted to remain in their non-conductive states. Specifically, controller1028causes second switching devices1022,1024of each power stage1001to remain in their non-conductive states in the first operating mode, such that light load enhancers1002are inactive. Thus, second switching devices1022,1024are replaced with capacitors1122,1124inFIG.11, to represent that these devices remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the first operating mode. Controller1028also controls each power stage1001such that first control and freewheeling switching devices1014,1016, along with first inductor1018and capacitor1020, collectively form a first buck sub-converter1036of the power stage transferring power from input power port1004to output power port1006, in the first operating mode. Specifically, controller1028causes first control switching device1014of each power stage1001to repeatedly switch between its conductive and non-conductive states to cause current through first inductor1018of the power stage to ramp up and down, and controller1028causes first freewheeling switching device1016of the power stage to repeatedly switch between its conductive and non-conductive states to perform a freewheeling function. In other words, controller1028controls first freewheeling switching device1016of the power stage such that it provides a path for current flowing through first inductor1018when first control switching device1014is in its non-conductive state, in the first operating mode. Thus, first switching devices1014,1016of each power stage1001are adapted to repeatedly switch between their conductive and non-conductive states in the first operating mode. FIG.12illustrates operation of converter1000in its second operating mode. First switching devices1014,1016are adapted to operate in their non-conductive states in the second operating mode. Specifically, controller1028causes first switching devices1014,1016to remain in their non-conductive states in the second operating mode, such that first buck sub-converters1036are inactive. Accordingly, first switching devices1014,1016are replaced with capacitors1214,1216inFIG.12, to represent that switching devices1014,1016remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the second operating mode. Controller1028also controls operation of light load enhancer1002of each power stage1001such that it, along with first inductor1018and capacitor1020of the power stage, collectively form a second buck sub-converter1038of the power stage transferring power from input power port1004to output power port1006, in the second operating mode. Specifically, controller1028causes second control switching device1022of each power stage1001to repeatedly switch between its conductive and non-conductive states to cause current through both first and second inductors1018,1026of the power stage to ramp up and down. Controller1028also causes second freewheeling device1024of the power stage to repeatedly switch between its conductive and non-conductive states to provide a path for current through first and second inductors1018,1026when second control switching device1022is in its non-conductive state. Thus, second switching devices1022,1024are adapted to repeatedly switch between their conductive and non-conductive states in the second operating mode. In a manner like that of converter300, use of light load enhancers1002enables certain embodiments of converter1000to obtain the benefits of high energy storage inductance at light loads, without the drawbacks at heavy loads. In particular, in the first operating mode, which corresponds to moderate or heavy load operating conditions, each power stage1001has an effective energy storage inductance corresponding to the inductance value of first inductor1018of the power stage. However, in the second operating mode, which corresponds to light load operating conditions, each power stage1001has an effective energy storage inductance corresponding to the sum of the inductance value of first inductor1018and the inductance value of second inductor1026. Because the sum of inductor1018and1026values is greater than the value of inductor1018alone, each power stage has a larger energy storage inductance value at light loads than at moderate or heavy loads. Thus, light load enhancers1002enable converter1000to operate with a relatively large inductance at light load and relatively small inductance at heavy load. In some embodiments, controller1028is adapted to control operation of power stages1001such that each power stage is switched out of phase with respect to each other power stage in the first and/or second operating modes, such that converter1000is a “multi-phase” converter, and each power stage can be considered a “phase.” Such phasing of power stages promotes ripple current cancelation in output capacitors1020and fast transient response. It is anticipated that all first inductors1018will typically have a common first inductance value and that all second inductors1026will typically have a common second inductance value, such as to achieve maximum ripple current cancelation in embodiments with phase shifting between power stages1001. However, first inductance values and/or second inductance values can vary among power stage1001instances. In some embodiments of converter1000, controller1028is operable to support both DCM and CCM operation, such as is a manner similar to that discussed above with respect toFIG.3. Additionally, controller1028is optionally adapted to shut down one or more power stages1001during light load conditions, to further promote light load efficiency. For example, in one particular embodiment including four power stages1001, controller1028causes all four power stages to operate under heavy load operating conditions and only one of the four power stages to operate under light load operating conditions. As another example, in one particular embodiment including three power stages1001, controller1028causes all three power stages to operate under heavy load operating conditions, two of the three power stages to operate under light load operating conditions, and one of the three power stages to operate under very light load operating conditions. Variations in converter1000are possible. For example, although each power stage1001is shown with its own output capacitor1020, in some alternate embodiments, one or more power stages1001(1) share common output capacitance. Furthermore, in certain alternate embodiments, all power stages1001share a common output capacitance. As another example, some or all of first and second freewheeling switching devices1016,1024are replaced with freewheeling diodes in some alternate embodiments to reduce converter complexity, with the possible tradeoff of increased conduction losses. Two or more inductors can also be replaced with a common coupled inductor to increase effective converter switching frequency, as taught in U.S. Pat. No. 6,362,986 to Schultz et al., which is incorporated herein by reference. For example,FIG.13illustrates a converter1300, which is similar to converter1000, but where first inductors1018are replaced with first inductors1318, which are part of a common coupled inductor including a magnetic core1319. Some or all of second inductors1026could also be replaced with a common coupled inductor in a similar manner. Additionally, converter1000can be modified such that light load enhancers1002are electrically coupled to output power node1012, instead of to a respective first switching node, in a manner similar to that of converter700(FIG.7). For example,FIG.14illustrates a switching power converter1400, which is similar to converter1000(FIG.10), but with light load enhancers1002electrically coupled to output power node1012. Converter1400operates in the same manner as converter1000, although each power stage1401has an effective energy storage inductance value equal to the value of second inductor1026, instead of the sum of the values of first and second inductors1018,1026, in the second operating mode. Accordingly, second inductors1026typically have larger inductance values than first inductors1018to realize high light load efficiency. Some alternate embodiments of converter1000include one or more power stages without a light load enhancer, such as to increase converter power capacity. For example,FIG.15illustrates a DC-to-DC switching power converter1500including two power stages1001and one additional power stage1501, electrically coupled in parallel. In contrast to power stages1001, power stage1501does not include a light load enhancer, and as discussed below, power stage1501is active only in a first operating mode of converter1500. Additional power stage1501includes a first switching device1514electrically coupled between input power node1008and a first switching node1515, and a first control switching device1516electrically coupled between first switching node1515and common power node1010. Additional power stage1501further includes a first inductor1518electrically coupled between switching node1515and output power node1012, and a capacitor1520electrically coupled between output power node1012and common power node1010. A controller1528controls operation of converter1500. In the first operating mode of converter1500, power stages1001form respective first buck sub-converters1036in the same manner as described above with respect toFIG.11. Additional power stage1501also operates as a first buck sub-converter transferring power from input power port1004to output power port1006, in the first operating mode. Specifically, controller1528causes first control switching device1514to repeatedly switch between its conductive and non-conductive states to cause current through first inductor1518to ramp up and down, and controller1528causes first freewheeling switching device1516to repeatedly switch between its conductive and non-conductive states to perform a freewheeling function. Thus, first switching devices1514,1516are adapted to repeatedly switch between their conductive and non-conductive states in the first operating mode. In a second operating mode of converter1500, power stages1001form respective second buck sub-converters1038in the same manner as described above with respect toFIG.12. However, controller1528causes switching devices1514,1516of additional power stage1501to remain in their non-conductive states in the second operating mode, such that additional power stage1501is inactive in the second operating mode. Thus, switching devices1514,1516are adapted to operate in their non-conductive states in the second operating mode. The number of power stages and the number of power stages with light load enhancers can be varied without departing from the scope hereof. Thus, converter1500can be modified to have N power stages, where M of the N power stages include light load enhancers, N is an integer greater than one, and M is an integer greater than or equal to one and less than or equal to N. In some embodiments of converters including multiple power stages and one or more light load enhancers, power stage components are distributed among two or more integrated circuits. For example,FIG.16illustrates a DC-to-DC switching power converter1600including three “slave” integrated circuits1603and one “master” integrated circuit1605. Each slave1603includes a control switching device1614and a freewheeling switching device1616operating under the command of a controller1628in master1605. Master1605also includes a control and freewheeling switching device1622,1624, which form part of a light load enhancer1602electrically coupled to a first slave1603(1). Thus, a first power stage1601(1), which includes light load enhancer1602, includes components distributed among first slave1603(1) and master1605. Incorporation of light load enhancer circuitry in a master integrated circuit chip may enable implementation of a light load enhancer in a converter including standard slave integrated circuit chips, instead of requiring use of one or more slaves with light load enhancer circuitry, thereby promoting ease of component procurement and/or low component cost. Additionally, incorporation of light load enhancer circuitry in a master integrated chip may facilitate control of the light load enhancer, such as when switching between operating modes. Converter1600includes an input power port1604electrically coupled across input and common power nodes1608,1610, and output power port1606electrically coupled across an output power node1612and a common power node1610. Each power stage1601includes a first control switching device1614electrically coupled between input power node1608and a first switching node Vx1, and a first freewheeling switching device1616electrically coupled between the first switching node and common power node1610. Each power stage1601further includes a first inductor1618electrically coupled between the first switching node and output power node1612, and a capacitor1620electrically coupled between output power node1612and common power node1610. Power stage1601(1) also includes a light load enhancer1602partially integrated in master1605. Light load enhancer1602includes a second control switching device1622electrically coupled between input power node1608and a second switching node Vx2, a second freewheeling switching device1624electrically coupled between second switching node Vx2 and common power node1610, and a second inductor1626electrically coupled between second switching node Vx2 and first switching node Vx1(1). Converter1600operates in a similar manner to that of converter1500. Specifically, in a first operating mode of converter1600corresponding to moderate or heavy load operating conditions, first control switching device1614, first freewheeling switching device1616, first inductor1618, and capacitor1620of each power stage1601form a respective buck sub-converter for transferring power from input power port1604to output power port1606. Light load enhancer1602is inactive in the first operating mode. In a second operating mode of converter1600corresponding to light load operating conditions, light load enhancer1602, first inductor1618(1), and capacitor1620(1) collective form a second buck sub-converter of power stage1601(1) for transferring power from input power port1604to output power port1606. Remaining power stages1601(2),1601(3) are inactive in the second operating mode. A light load enhancer can be used in a switching power converter having a topology other than a buck topology, such as in a boost converter or a buck-boost converter. For example,FIG.17illustrates a boost DC-to-DC switching power converter1700including a light load enhancer1702. Converter1700includes an input power port1704electrically coupled across input and common power nodes1708,1710, and an output power port1706electrically coupled across output power node1712and common power node1710. Converter1700further includes a first inductor1718, first control and freewheeling switching devices1714,1716, a capacitor1720, and a controller1728. First inductor1718is electrically coupled between input power node1708and a first switching node Vx1, and first control switching device1714is electrically coupled between first switching node Vx1 and common power node1710. First freewheeling switching device1716is electrically coupled between first switching node Vx1 and output power node1712, and capacitor1720is electrically coupled between output and common power nodes1712,1710. Light load enhancer1702includes a second inductor1726, a second control switching device1722, and a second freewheeling switching device1724. Second inductor1726is electrically coupled between first switching node Vx1 and a second switching node Vx2, such that first and second inductors1718,1726are electrically coupled in series. Second control switching device1722is electrically coupled between second switching node Vx2 and common power node1710, and second freewheeling switching device1724is electrically coupled between second switching node Vx2 and output power node1712. Converter1700has at least a first operating mode corresponding to moderate or heavy load operating conditions, and a second operating mode corresponding to light load operating conditions.FIG.18illustrates operation of converter1700in its first operating mode. In the first operating mode, second switching devices1722,1724are adapted to operate in their non-conductive states. Specifically, controller1728causes second switching devices1722,1724of light load enhancer1702to remain in their non-conductive states in the first operating mode, such that light load enhancer1702is inactive. Thus, second switching devices1722,1724are replaced with capacitors1822,1824inFIG.18, to represent that these devices remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the first operating mode. Controller1728also controls first control and freewheeling switching devices1714,1716, such that these switching devices, along with first inductor1718and capacitor1720, collectively form a first boost sub-converter1730transferring power from input power port1704to output power port1706, in the first operating mode. Specifically, controller1728causes first control switching device1714to repeatedly switch between its conductive and non-conductive states to cause current through first inductor1718to ramp up and down, and controller1728causes first freewheeling switching device1716to repeatedly switch between its conductive and non-conductive states to perform a freewheeling function. In other words, controller1728controls first freewheeling switching device1716such that it provides a path for current flowing through first inductor1718when first control switching device1714is in its non-conductive state, in the first operating mode. Thus, first switching devices1714,1716are adapted to repeatedly switch between their conductive and non-conductive states in the first operating mode. FIG.19illustrates operation of converter1700in its second operating mode. First switching devices1714,1716are adapted to operate in their non-conductive states in the second operating mode. Specifically, controller1728causes first switching devices1714,1716to remain in their non-conductive states in the second operating mode, such that first boost sub-converter1730is inactive. Accordingly, first switching devices1714,1716are replaced with capacitors1914,1916inFIG.19, to represent that switching devices1714,1716remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the second operating mode. Controller1728also controls operation of light load enhancer1702such that it, along with first inductor1718and capacitor1720, collectively form a second boost sub-converter1732transferring power from input power port1704to output power port1706, in the second operating mode. Specifically, controller1728causes second control switching device1722to repeatedly switch between its conductive and non-conductive states to cause current through both first and second inductors1718,1726to ramp up and down, and controller1728causes second freewheeling device1724to repeatedly switch between its conductive and non-conductive states to provide a path for current through first and second inductors1718,1726when second control switching device1722is in its non-conductive state. Thus, second switching devices1722,1724are adapted to repeatedly switch between their conductive and non-conductive states in the second operating mode. Thus, light load enhancer1702enables certain embodiments of converter1700to obtain the benefits of high energy storage inductance at light loads, without the drawbacks at heavy loads. In particular, in the first operating mode, which corresponds to moderate or heavy load conditions, converter1700has an effective energy storage inductance corresponding to the inductance value of first inductor1718. However, in the second operating mode, which corresponds to light load conditions, converter1700has an effective energy storage inductance corresponding to the sum of the inductance value of first inductor1718and the inductance value of second inductor1726. Because the of sum inductor1718and1726is greater than the value of inductor1718alone, converter1700has a larger energy storage inductance value at light load than at moderate or heavy load. Thus, light load enhancer1702enables converter1700to operate with a relatively large inductance at light load and relatively small inductance at heavy load. Features of converter1700can be varied without departing from the scope hereof. For example, in some alternate embodiments, light load enhancer1702is electrically coupled to input power node1708instead of to first switching node Vx1, such that effective inductance in the second operating mode is equal to the value of second inductor1726. As another example, one or more of freewheeling switching devices1716,1724are replaced with freewheeling diodes in some alternate embodiments. Additionally, converter1700can be modified to include additional power stages with or without light load enhancers, such as to form a multi-phase boost converter. FIG.20illustrates a buck-boost DC-to-DC switching power converter2000including a light load enhancer2002. Converter2000also includes an input power port2004electrically coupled across input and common power nodes2008,2010, and an output power port2006electrically coupled across output power node2012and common power node2010. Converter2000further includes a first control switching device2014, a first freewheeling switching device2016, a first inductor2018, a capacitor2020, and a controller2028. First control switching device2014is electrically coupled between input power node2008and a first switching node Vx1, and first freewheeling switching device2016is electrically coupled between first switching node Vx1 and output power node2012. First inductor2018is electrically coupled between first switching node Vx1 and common power node2010, and capacitor2020is electrically coupled between output power node2012and common power node2010. Light load enhancer2002includes a second control switching device2022, a second freewheeling switching device2024, and a second inductor2026. The second control switching device is electrically coupled between first input power node2008and a second switching node Vx2, and the second freewheeling switching device is electrically coupled between second switching node Vx2 and output power node2012. Second inductor2026is electrically coupled between second switching node Vx2 and first switching node Vx1, such that first and second inductors2018,2026are electrically coupled in series. Converter2000has a first operating mode corresponding to moderate or heavy load operating conditions, and a second operating mode corresponding to light load operating conditions.FIG.21illustrates operation of converter2000in its first operating mode. Second switching devices2022,2024are adapted to operate in their non-conductive states in the first operating mode. Specifically, controller2028causes second switching devices2022,2024of light load enhancer2002to remain in their non-conductive states in the first operating mode, such that light load enhancer2002is inactive. Thus, second switching devices2022,2024are replaced with capacitors2122,2124inFIG.21, to represent that these devices remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the first operating mode. Controller2028also controls first control and freewheeling switching devices2014,2016such that these switching devices, along with first inductor2018and capacitor2020, collectively form a first buck-boost sub-converter2030transferring power from input power port2004to output power port2006, in the first operating mode. Specifically, controller2028causes first control switching device2014to repeatedly switch between its conductive and non-conductive states to cause current through first inductor2018to ramp up and down, and controller2028causes first freewheeling switching device2016to repeatedly switch between its conductive and non-conductive states to perform a freewheeling function. In other words, controller2028controls first freewheeling switching device2016such that it provides a path for current flowing through first inductor2018when first control switching device2014is in its non-conductive state, in the first operating mode. Thus, first switching devices2014,2016are adapted to repeatedly switch between their conductive and non-conductive states in the first operating mode. FIG.22illustrates operation of converter2000in its second operating mode. First switching devices2014,2016are adapted to operate in their non-conductive states in the second operating mode. Specifically, controller2028causes first switching devices2014,2016to remain in their non-conductive states in the second operating mode, such that first buck-boost sub-converter2030is inactive. Accordingly, first switching devices2014,2016are replaced with capacitors2214,2216inFIG.22, to represent that switching devices2014,2016remain in their non-conductive states, but nevertheless exhibit parasitic capacitance, in the second operating mode. Controller2028also controls operation of light load enhancer2002such that it, along with first inductor2018and capacitor2020, collectively form a second buck-boost sub-converter2032transferring power from input power port2004to output power port2006, in the second operating mode. Specifically, controller2028causes second control switching device2022to repeatedly switch between its conductive and non-conductive states to cause current through both first and second inductors2018,2026to ramp up and down, and controller2028causes second freewheeling device2024to repeatedly switch between its conductive and non-conductive states to provide a path for current through first and second inductors2018,2026when second control switching device2022is in its non-conductive state. Thus, second switching devices2022,2024are adapted to repeatedly switch between their conductive and non-conductive states in the second operating mode. Thus, light load enhancer2002enables certain embodiments of converter2000to obtain the benefits of high energy storage inductance at light loads, without the drawbacks at heavy loads. In particular, in the first operating mode, which corresponds to moderate or heavy load conditions, converter2000has an effective energy storage inductance corresponding to the inductance value of first inductor2018. However, in the second operating mode, which corresponds to light load conditions, converter2000has an effective energy storage inductance corresponding to the sum of the inductance value of first inductor2018and the inductance value of second inductor2026. Because the of sum inductor2018and2026values is greater than value of inductor2018alone, converter2000has a larger energy storage inductance value at light loads than at moderate or heavy loads. Thus, light load enhancer2002enables converter2000to operate with a relatively large inductance at light load and relatively small inductance at heavy load. Features of converter2000can be varied without departing from the scope hereof. For example, in some alternate embodiments, at least one of freewheeling switching devices2016,2024is replaced with a freewheeling diode. As another example, in certain alternate embodiments, light load enhancer2002is electrically coupled to common power node2010, instead of to first switching node Vx1, such that converter2000has an effective inductance equal to the value of second inductor2026, in the second operating mode. Additionally, converter2000can be modified to include additional power stages with or without light load enhancers, such as to form a multi-phase buck-boost converter. The switching converters with light load enhancers discussed above can be modified to realize magnetic coupling between first and second inductors, thereby promoting large energy storage inductance values at light load. For example,FIG.23illustrates a switching converter2300including a light load enhancer2302. Converter2300is similar to converter300ofFIG.3, but includes magnetically coupled first and second inductors2318,2326in place of discrete first and second inductors318,326. First and second inductors2318,2326are part of a common coupled inductor including a magnetic core2321. First and second inductors2318,2326are also arranged such that they are in-phase when electrically coupled in series, as shown, for example, by the winding polarity dots inFIG.23. Converter2300has first and second operating modes similar to those of converter300.FIG.24illustrates converter2300in its first operating mode, where first control and freewheeling switching devices314,316, first inductor2318, and capacitor320collectively form a first buck sub-converter2330transferring power from input power port304to output power port306, in a manner similar to that discussed above with respect toFIG.4.FIG.25illustrates converter2300in its second operating mode, where light load enhancer2302, first inductor2318, and capacitor320collectively form a second buck sub-converter2332transferring power from input power port304to output power port306, in a manner similar to that discussed above with respect toFIG.5. First and second inductors2318,2326collectively form a single inductor in the second operating mode, where the single inductor has a number of turns equal to the sum of the number of turns first inductor2318and the number of turns of inductor2326, assuming strong magnetic coupling of first and second inductors2318,2326. Magnetic coupling of first and second inductors2318,2326promotes a large energy storage inductance value in the second operating mode. For example, consider an embodiment where first and second inductors2318,2326are part of a symmetrical coupled inductor, where first inductor2318includes a winding forming a single turn, and second inductor2326includes a winding forming two turns. Inductance is roughly proportional to the square of the number of winding turns. Thus, inductance is expressed as follows, where N is the number of winding turns, and LTis the inductance of a single turn: L=LT(N)2EQN. 1 In the first operating mode, N is one, and first buck sub-converter2330has an effective energy storage inductance Leff1given by: Leff1=LT(1)2=LTEQN. 2 In the second operating mode, first and second inductors2318,2326collectively form an inductor with a three-turn winding such that N is three, assuming strong magnetic coupling between all three windings. Therefore, second buck sub-converter2332has an effective energy storage inductance Leff2in the second operating mode given by: Leff2=LT(3)2=9LTEQN. 3 Thus, the effective energy storage inductance value of the second operating mode is nine times that of the first operating mode, thereby promoting light load efficiency. In contrast, consider an alternate embodiment where first and second inductors2318,2326are replaced with first and second discrete (non-coupled) inductors including windings forming one and two turns, respectively. Assuming these discrete inductors have the same corresponding core cross sections and air gaps as the coupled inductor they replaced, effective energy storage inductance in the first operating mode Leff1is given by: Leff1=LT(1)2=LTEQN. 4 However, in the second operating mode, effective energy storage inductance Leff2is equal to the following, since the first and second inductors are discrete: Leff2=LT(2)2+LT(1)2=5LTEQN. 5 Thus, the effective energy storage inductance value of the second operating mode is only five times that of the first operating mode in this alternate embodiment. Accordingly, in embodiments where first and second inductors2318,2326have one and two winding-turns, respectively, strong magnetic coupling of the two inductors can increase effective energy storage inductance by a factor of approximately 1.8, compared to an otherwise similar embodiment with no magnetic coupling between the inductors. Significant increases in effective energy storage inductance are also potentially obtainable with other numbers of winding turns. Although magnetic coupling of first and second inductors2318,2326can significantly boost effective energy storage inductance relative to an otherwise similar converter without the magnetic coupling, undesired diode conduction may occur in embodiments where one or more of second switching devices322,324includes a diode. For example, consider switching converter2600ofFIG.26, which is an embodiment of converter2300(FIG.23), where second control and freewheeling switching devices322,324are implemented by control and freewheeling transistors2622,2624, respectively. Each transistor include a respective body diode2623,2625which will conduct current in the first operating mode, due to magnetic coupling of first and second inductors2318,2326. In particular, when first control switching device314is in its conductive state, a positive voltage across first inductor2318is reflected across second inductor2326, causing body diode2623to be forward biased and conduct current. The voltage across second inductor2326, however, is forced to be equal to the voltage drop across body diode2623, since inductor2326is electrically coupled in parallel with diode2623under this condition. Thus, the ratio of voltage across first inductor2318to voltage across second inductor2326likely differs from the ratio of number of winding turns of first inductor2318to number of winding turns of second inductor2326. This ratio disparity causes energy to be stored primarily in the small parasitic leakage inductance between windings, instead of in the relatively large magnetizing inductance of the coupled inductor. Such operation with small energy storage inductance severely impacts converter waveforms, causing large ripple current magnitude and impairing converter efficiency. Similarly, when first freewheeling switching device316is in its conductive state, a negative voltage across first inductor2318is reflected across second inductor2326, causing body diode2625to be forward biased and conduct current. Conduction of body diode2625in the first operating mode impairs converter performance in a similar manner to that discussed above with respect to body diode2623. Thus, conduction of body diodes2623,2625in the first operating mode is typically undesirable. Undesired body diode conduction in the first operating mode can be prevented, for example, by adding an additional switching device in series with each of the control and freewheeling switching devices of the light load enhancer. For example,FIG.27illustrates a switching converter2700including a light load enhancer2702. Converter2700in similar to converter2600ofFIG.26, but further includes an additional switching device in the form of an additional transistor2727electrically coupled in series with control transistor2622, and an additional switching device in the form of an additional transistor2731electrically coupled in series with freewheeling transistor2624. Thus, control transistor2622is electrically coupled to second switching node Vx2 via additional transistor2727, and freewheeling transistor2624is electrically coupled to common power node310via additional transistor2731. In certain alternate embodiments, the position of control transistor2622and additional transistor2727are swapped, such that control transistor2622is electrically coupled to input power node308via additional transistor2727. Similarly, in some alternate embodiments, the position of freewheeling transistor2624and additional transistor2731are swapped such that freewheeling transistor2624is electrically coupled to second switching node Vx2 via additional transistor2731. Additional transistors2727,2731are adapted to operate in their non-conductive states in the first operating mode of converter2700, to prevent body diodes2623,2625from conducting current in the first operating mode. Specifically, controller328causes additional transistors2727,2731to operate in their non-conductive states in the first operating mode, such that the anodes of body diodes2623,2625are electrically de-coupled from the remainder of the converter. Body diodes2729,2733of additional transistors2727,2731each have an electrical orientation opposing that of body diodes2623,2625, so that body diodes2729,2733also do not conduct current in the first operating mode. In other words, body diode2729is electrically coupled in series to body diode2623such that both diodes2623,2729cannot simultaneously conduct current, and body diode2733is electrically coupled in series to body diode2625such that both diodes2625,2733cannot simultaneously conduct current. In the second operating mode of converter2700, additional transistors2727,2731are adapted to operate in their conductive states. In particular, controller328causes additional transistor2727to operate in its conductive state at least whenever control transistor2622is operating in its conductive state. Additionally, controller328also causes additional transistor2731to operate in its conductive state at least whenever freewheeling transistor2624operates in its conductive state. Thus, additional transistors2727,2731do not affect the operation of light load enhancer2702in the second operating mode, neglecting losses, such as conduction losses, associated with the additional transistors. In certain embodiments, controller328is adapted to cause additional transistors2727,2731to continuously operate in their conductive states in the second operating mode, thereby essentially eliminating switching losses associated with additional transistors2727,2731. Continuous conduction of additional transistors2727,2731in the second operating mode also allows for clamping of voltage spikes on second switching node Vx2 via body diodes2623,2625, such as during dead-time when both control and freewheeling transistors2622,2624are in their non-conductive states. The type and/or configuration of control and/or freewheeling transistors2622,2624can be varied without departing from the scope hereof. For example, in some alternate embodiments, N-channel control transistor2622is replaced with a P-channel control transistor to ease transistor driving requirements. As another example, in certain alternate embodiments, single control transistor2622is replaced with a pair of control transistors electrically coupled in parallel. Furthermore, the type and/or configuration of additional transistors2727,2731can be varied without departing from the scope hereof, as long as the additional transistors prevent conduction of body diodes2623,2625in the first operating mode. Moreover, additional transistors2727,2731could even be replaced with switching devices other than transistors, as long as the switching devices prevent conduction of body diodes2623,2625in the first operating mode. Although magnetic coupling of first and second inductors is discussed with respect to converters similar to those ofFIG.3, other switching converters with light load enhancers could also be modified in a similar manner to realize magnetic coupling between first and second inductors. For example, converter1000(FIG.10) could be modified such that first and second inductors1018,1026in each power stage1001are magnetically coupled. As another example, converter2000(FIG.20) could be modified such that first and second inductors2018,2026of converter2000are magnetically coupled. FIG.28shows a method2800for transferring power from an input power port to an output power port using a first and a second switching sub-converter. Method2800is used, for example, to power a processor electrically coupled to the output power port. Method2800includes steps2802and2804representing a first and second operating mode, respectively. In step2802, the first switching sub-converter is operated to transfer power from the input power port to the output power port, while the second switching sub-converter is operated in an inactive mode. One example of step2802is operating first buck sub-converter330of converter300(FIGS.3and4) to transfer power from input power port304to output power port306, while operating the second buck sub-converter332of converter300(FIGS.3and5) in its inactive mode. Another example of step2802is operating the N first buck sub-converters1036of converter1000(FIGS.10and11) to transfer power from input power port1004to output power port1006, while operating the N second buck sub-converters1038of converter1000(FIGS.10and12) in their inactive modes. In step2804, the second switching sub-converter is operated to transfer power from the input power port to the output power port, while the first switching sub-converter is operated in an inactive mode. One example of step2804is operating second buck sub-converter332of converter300to transfer power from input power port304to output power port306, while operating first buck sub-converter330of converter300in its inactive mode. Another example of step2804is operating the N second buck sub-converters1038of converter1000to transfer power from input power port1004to output power port1006, while operating the N first buck sub-converters1036of converter1000in their inactive modes. One possible application of light load enhancer equipped switching power converters and associated methods is in information technology applications, such as in computing and telecommunication applications. Information technology devices often spend significant amounts of time in low power states and may therefore significantly benefit from a light load efficiency improvement potentially obtainable by use of a light load enhancer. For example, mobile information technology devices, such as tablet computers and smart phones, are particularly battery life sensitive. These devices often include a primary processor that operates in a sleep mode except when running an application or making a call. A switching power converter with a light load enhancer could be used, for example, to power the primary processor and promote efficient operation during sleep mode, thereby helping prolong battery life. In these applications, the switching power converter is switched between its first and second operating modes, for example, in response to a sleep signal provided by, or associated with, the primary processor. Discussed below are examples of some possible magnetic devices that may be used with switching power converters including light load enhancers. Certain of these magnetic devices advantageously include two or more inductors in a common package, thereby promoting low cost, small size, and ease of component procurement, while minimizing or eliminating interaction (i.e., magnetic coupling) between inductors, thereby helping prevent undesired diode conduction, such as discussed above with respect toFIG.26. It should be understood, however, that light load enhancers are not limited to use with the magnetic devices described below. Furthermore, the magnetic devices described below are not limited to use in light load enhancer applications. FIG.29shows a top plan view of a magnetic device2900including two inductors which may be used, for example, in a switching power converter including a light load enhancer.FIG.30shows a side view of device2900, andFIG.31shows a cross-sectional view of device2900taken along line A-A ofFIG.30. Magnetic device2900has a depth2901, a width2903, and a height2905(seeFIGS.29and30). Magnetic device2900includes first and second foil “staple” windings2902,2904wound through a magnetic core2906in the depth2901direction. First winding2902and magnetic core2906collectively form a first inductor2908, and second winding2904and magnetic core2906collectively form a second inductor2910, as illustrated inFIG.30. The dashed lines ofFIG.30only approximately delineate the portions of device2900forming first and second inductors2908,2910; in actuality, there is some overlap in portions of magnetic core2906forming first and second inductors2908,2910.FIG.32shows a side view of magnetic core2906without windings2902,2904. As discussed below, magnetic device2900is typically configured to magnetically isolate first and second windings2902and2904from each other, thereby minimizing magnetic coupling between first and second inductors2908,2910. First inductor2908has a relatively small inductance value and a relatively large current handling capability, which may make this inductor particular suitable for use in heavy load applications. Second inductor2910, on the other hand, has a relatively large inductance value and a relatively small current handling capability, which may make this inductor particularly suitable for use in light load applications. Thus, one possible application of first inductor2908is in a switching sub-converter intended for use at moderate or heavy loads, such as in first buck sub-converter330of converter300(FIG.4), and one possible application of second inductor2910is in a switching sub-converter intended for use at light loads, such as in second buck sub-converter332of converter300(FIG.5). Accordingly, some embodiments of converter300incorporate magnetic device2900such that first inductor2908of device2900is first inductor318of converter300, and second inductor2910of device2900is second inductor326of converter300. Magnetic device2900may also be used in a similar manner in the other switching power converters with light load enhancers discussed herein without magnetic coupling between the first and second inductors. For example, in some embodiments of converter1000(FIG.10), each power stage1001includes an instance of magnetic device2900forming first and second inductors1018,1026of the power stage. First winding2902has a first width2912, and second winding2904has a second width2914(seeFIG.31). First width2912is typically greater than second width2914to promote large current handling capability of first inductor2908. Magnetic core2906forms a first gap2916in the primary magnetic flux path2918of first inductor2908to help control inductance of first inductor2908and to help prevent magnetic saturation, and the core forms a second gap2920in the primary magnetic flux path2922of second inductor2910to help control inductance of second inductor2910and to help prevent magnetic saturation. First and second gaps2916,2920are respectively disposed in opposing first and second outer portions2917,2919of core2906. First winding2902is disposed between first outer portion2917and a core center portion2921in the width2903direction, and second winding2904is disposed between center portion2921and second outer portion2919in the width2903direction. Each gap2916,2920is at least partially filled with a non-magnetic material, such as air, paper, plastic, and/or adhesive, or a magnetic material having a lower magnetic permeability than material forming magnetic core2906. Gaps2916,2920have respective thicknesses2924,2926and respective widths2928,2930(seeFIG.32). Inductance is roughly inversely proportional to gap thickness. Thus, first gap2916thickness2924is typically greater than second gap2920thickness2926to promote inductance disparity among first and second inductors2908,2910, i.e., to promote first inductor2908having a smaller inductance value than second inductor2910. On the other hand, width2928of first gap2916is typically greater than width2930of second gap2920to promote high current capability of first inductor2908, since large gap cross-section reduces susceptibility to magnetic saturation at high current levels. Center portion2921of magnetic core2906typically includes little or no gap so that center portion2921acts as a low-reluctance “magnetic short,” thereby magnetically isolating first winding2902from second winding2904. In the context of this document, windings are “magnetically isolated” from each other when no more than ten percent of magnetic flux generated by current flowing through any one winding links any of other winding. Magnetic flux takes the path of least reluctance, and presence of low-reluctance center portion2921causes magnetic flux associated with first inductor2908to take primary magnetic flux path2918which does not link second winding2904. Similarly, low-reluctance of center portion2921causes magnetic flux associated with second inductor2910to take primary magnetic flux path2922which does not link first winding2902. Thus, presence of low-reluctance center portion2921prevents magnetic coupling of inductors2908and2910, even though the two inductors are part of a common magnetic device and share common magnetic core2906. Core losses in center portion2921can be minimized by connecting and operating magnetic device2900such that magnetic flux associated with first inductor2908and magnetic flux associated with second inductor2910flow in opposite directions in center portion2921. Such opposing flow of magnetic flux causes net magnetic flux in center portion2921to be smaller than magnetic flux associated with either first inductor2908or second inductor2910. Smaller net magnetic flux, in turn, allows cross-sectional area of center portion2921to be reduced while maintaining given core losses, or allows core losses to be reduced while maintaining a given cross-sectional area of center portion2921. Alternately, magnetic device2900can be connected and operated such that both magnetic flux associated with first inductor2908and magnetic flux associated with second inductor2910flow in a common direction in center portion2921, to boost inductance to greater than the sum of the inductance of first inductor2908and the inductance of second inductor2910, when first and second inductors2908and2910are electrically coupled in series. Magnetic device2900can be modified to have windings other than staple style windings. For example,FIGS.33-35show a magnetic device3300, which is similar to magnetic device2900, but includes first and second wire windings3302,3304embedded in a monolithic powder magnetic core3306, in place of staple style windings.FIG.33shows a top plan view of magnetic device3300,FIG.34shows a side view of magnetic device3300, andFIG.35shows a cross-sectional view of magnetic device3300taken along line A-A ofFIG.34. Magnetic device3300has a depth3301, a width3303, and a height3305(seeFIGS.33and34). First winding3302and magnetic core3306collectively form a first inductor3308, and second winding3304and magnetic core3306collectively form a second inductor3310, as illustrated inFIG.35. The dashed lines ofFIG.35only approximately delineate the portions of device3300forming first and second inductors3308,3310; in actuality, there is some overlap in portions of magnetic core3306forming first and second inductors3308,3310. Magnetic core3306is a single-piece, monolithic magnetic core that typically does not form any discrete gaps. However, the material forming core3306typically includes a mixture of magnetic particles and spacers, or a mixture of magnetic particles and other non-magnetic material, such that magnetic core3306effectively has a distributed gap. Inductance of inductors3308,3310is controlled, in part, by varying the number of turns forming windings3302,3304, since inductance is roughly proportional to the square of the number of winding turns. Thus, second winding3304typically forms more turns than first winding3302so that second inductor3310has a larger inductance value than first inductor3308. Additionally, first winding3302is typically formed of thicker (lower gauge) wire or conductive foil than second winding3304, and an area3334enclosed by first winding3302is typically greater than an area3336enclosed by seconding winding3304, as seen when magnetic device3300is viewed cross-sectionally in the height3305direction, to promote large current carrying capability of first inductor3308. Accordingly, magnetic device3300is used in some embodiments of the switching power converters including light load enhancers disclosed herein, where first inductor3308of device3300is a first inductor of the converter, and second inductor3310of device3300is a second inductor of the converter. For example, in some embodiments of converter300, first inductor3308of device3300is first inductor318of converter300, and second inductor3310of device3300is second inductor326of converter300. Opposing ends of each winding3302,3304are electrically coupled to a respective solder tab3338. Solder tabs3338are adapted, for example, for surface mount soldering to a substrate, such as a printed circuit board. In certain alternate embodiments, one or more of solder tabs3338are replaced with an alternative connector, such as a thru-hole pin or a socket pin. Magnetic device3300is formed, for example, by forming magnetic core material, such as powdered iron within a binder, around windings3302,3304, and then curing the binder, such as by exposing the binder to pressure, heat, electromagnetic radiation, and/or curing chemicals. For instance, in some embodiments, a mold is use to form magnetic core material around windings3302,3304, such that device3300has a “molded” magnetic core3306. Magnetic device3300is typically designed to magnetically isolate first and second windings3302,3304by having a significant widthwise separation distance3340between the windings, such that a sum of areas3334and3336is less than an area3342outside of areas3334and3346, as seen when magnetic device3300is view cross-sectionally in the height3305direction (seeFIG.35). The monolithic nature of magnetic core3306causes magnetic flux to flow as closely as possible to windings3302and3304, and therefore, separation of windings3302and3304minimizes magnetic coupling of the windings. Furthermore, in some alternate embodiments, magnetic core3306is a non-homogenous magnetic core, with portions of magnetic core between first and second windings3302and3304having higher magnetic permeability than other portions of magnetic core3306, to act as a magnetic “short” and thereby further minimize magnetic coupling of windings3302and3304, and/or to allow for reduction in separation distance3340while maintaining magnetic isolation between the two windings. FIG.36shows a perspective view andFIG.37shows an exploded perspective view of a magnetic device3600including multiple single-turn windings which can be configured as a multi-turn inductor. Magnetic device3600has a depth3601, a width3603, and a height3605. Magnetic device3600includes a magnetic core3602including a first magnetic element3604, a second magnetic element3606, and a top magnetic element3608disposed over first and second magnetic elements3604,3606in the height3605direction. A first gap3610separates top magnetic element3608from first magnetic element3604in the height3605direction, and a second gap3612separates top magnetic element3608from second magnetic element3606in the height direction. A first winding3614is wound around first magnetic element3604, and a plurality of second windings3616are wound around second magnetic element3606.FIG.38is a perspective view of first winding3614separated from the remainder of magnetic device3600, andFIG.39shows a perspective view of second windings3616separated from the remainder of magnetic device3600. First and second windings3614,3616are single-turn windings to promote manufacturing simplicity. FIG.40symbolically shows one possible application of magnetic device3600when used as a two-inductor magnetic device. In this application, first winding3614, first magnetic element3604, and top magnetic element3608collectively form a single-turn first inductor3622. Second windings3616, second magnetic element3606, and top magnetic element3608collectively form a three-turn second inductor3624, in this application. Second windings3616are electrically coupled in series by connectors3626, which in some embodiments are printed circuit board conductive traces, such that second windings3616collectively form a three turn winding. The dashed lines ofFIG.40only approximately delineate the portions of top magnetic element3608forming first and second inductors3622,3624; in actuality, there is some overlap in portions of top magnetic element3608forming first and second inductors3622,3624. Inductance is roughly proportional to the square of the number of winding turns. Thus, in certain embodiments, three-turn second inductor3624has a larger inductance value than single-turn first inductor3622. First winding3614is typically wider and/or thicker than second windings3616to promote large current carrying capability of first inductor3622. Additionally, a cross section3628of first magnetic element3604is typically larger than a cross section3630of second magnetic element3606to further promote high current capability of first inductor3622, since large cross-section reduces susceptibility to saturation at high current levels. Cross-section3628is defined by height3632and depth3634of first magnetic element3604, and cross-section3630is defined by height3636and depth3638of second magnetic element3606. Magnetic device3600is used in some embodiments of the switching power converters with light load enhancers disclosed herein, where first inductor3622of device3600is a first inductor of the converter, and second inductor3624of device3600is a second inductor of the converter. For example, in some embodiments of converter300, first inductor3622of device3600is first inductor318of converter300, and second inductor3624of device3600is second inductor326of converter300. Each gap3610,3612is at least partially filled with a non-magnetic material, such as air, paper, plastic, and/or adhesive. Inductance of first inductor3622may be varied by changing the thickness of first gap3610, and inductance of second inductor3624may be varied by changing thickness of second gap3612. Respective thicknesses of first and second gaps3610,3612may differ to achieve desired inductance values of first and second inductors3622,3624. Opposing ends of the windings3614,3616form respective solder tabs3640for surface mount soldering to a substrate, such as a printed circuit board (seeFIGS.38and39). In some embodiments, solder tabs3640of adjacent pairs of second windings3616are laterally adjacent to facilitate short connections between adjacent windings when connecting the second windings in series. In certain alternate embodiments, one or more of solder tabs3640are replaced with an alternative connector, such as a thru-hole or socket pin. A gap3640separates first magnetic element3604from second magnetic element3606in the depth3601direction. Gap3640which is, for example, filled with a non-magnetic material, or a magnetic material having a lower magnetic permeability than that forming magnetic core3602, acts as a “magnetic open” which essentially blocks flow of magnetic flux between first winding3614and second windings3616, to magnetically isolate first winding3614from second windings3616. Consequentially, gap3640prevents magnetic coupling of first inductor3622and second inductor3624, even though both inductors are part of common magnetic device3600. The number of single-turn windings wound around magnetic element3604and/or3606may be varied, such as to achieve a desired inductance value, without departing from the scope hereof. For example, certain alternate embodiments of device3600include only two second windings3616wound around second magnetic element3606to achieve smaller inductance values of second inductor3624. Additionally, although magnetic device3600is shown with foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope thereof. For example, in some alternate embodiments, one or more of windings3614,3616are replaced with round cross-section windings. FIG.41shows a perspective view andFIG.42shows an exploded perspective view of another magnetic device4100including multiple single-turn windings which can be configured as a multi-turn inductor. Magnetic device4100has a depth4101, a width4103, and a height4105. Magnetic device4100includes a magnetic core4102including a first magnetic element4104and a second magnetic element4106disposed on first magnetic element4104in the height4105direction. A first single-turn winding4108and a plurality of second single-turn windings4110are wound around first magnetic element4104.FIG.43is a perspective view of first winding4108separated from the remainder of magnetic device4100, andFIG.44is a perspective view of second windings4110separated from the remainder of magnetic device4100. FIG.45symbolically shows one possible application of magnetic device4100when used as a two-inductor magnetic device. In this application, first winding4108, first magnetic element4104, and second magnetic element4106collectively form a single-turn first inductor4114. Second windings4110, first magnetic element4104, and second magnetic element4106collectively form a two-turn second inductor4116, in this application. Second windings4110are electrically coupled in series by a connector4118, which in some embodiments is a printed circuit board conductive trace, such that second windings4110collectively form a two turn winding. The dashed lines ofFIG.45only approximately delineate the portions of first and second magnetic elements4104,4106forming first and second inductors4114,4116; in actuality, there is some overlap in portions of first and second magnetic element4104,4106forming first and second inductors4114,4116. Inductance is roughly proportional to the square of the number of winding turns. Thus, two-turn second inductor4116typically has a larger inductance value than single-turn first inductor4114. First winding4108is typically wider and/or thicker than each second winding4110to promote large current carrying capability of first inductor4114. Thus, magnetic device4100is used in some embodiments of the switching power converters with light load enhancers disclosed herein, where first inductor4114of device4100is a first inductor of the converter, and second inductor4116of device4100is a second inductor of the converter. For example, in some embodiments of converter300, first inductor4114of device4100is first inductor318of converter300, and second inductor4116of device4100is second inductor326of converter300. Magnetic core4102includes a center portion4120and opposing first and second outer portions4122,4124separated from each other in the width4103direction. First winding4108is disposed between center and first outer portions4120,4122, and second windings4110are disposed between center and second outer portions4120,4124, in the width direction. Magnetic flux linking first winding4108flows primarily in a loop including first outer portion4122and center portion4120, and magnetic flux linking second windings4110flows primarily in a loop including center portion4120and second outer portion4124. Accordingly, center portion4120acts as a low-reluctance magnetic “short,” thereby essentially magnetically isolating first winding4108from second windings4110so that inductors4114and4116are not magnetically coupled, even though both inductors are part of common magnetic device4100. A first gap4126separates first and second magnetic elements4104,4106in core first outer portion4122, and a second gap4128separates first and second magnetic elements4104,4106in core second outer portion4124. Core center portion4120typically does not have a significant gap between first and second magnetic elements4104,4106to minimize reluctance of center portion4120, thereby minimizing interaction between first and second inductors4114,4116. Each gap4126,4128is at least partially filled with a non-magnetic material, such as air, paper, plastic, and/or adhesive. Inductance of first inductor4114may be varied by changing the thickness of first gap4126, and inductance of second inductor4116may be varied by changing thickness of second gap4128. First and second gaps4126,4128may have different thicknesses to achieve desired inductance values for first and second inductors4114,4116. In some embodiments first gap4126has a larger thickness than that of second gap4128. Opposing ends of windings4108,4110form respective solder tabs4130for surface mount soldering to a substrate, such as a printed circuit board (seeFIGS.43and44). In some embodiments, solder tabs4130of second windings4110are laterally adjacent to facilitate short connections between adjacent windings when connecting the second windings in series. In certain alternate embodiments, one or more of solder tabs4130are replaced with an alternative connector, such as a thru-hole or socket pin. Additional single-turn windings are optionally wound around first magnetic element4104without departing from the scope thereof. For example, some alternate embodiments include additional instances of second windings4110, such as to achieve a larger inductance value in second inductor4116. Additionally, although magnetic device4100is shown with foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope hereof. For example, in some alternate embodiments, one or more of windings4108,4110are replaced with round cross-section windings. In some embodiments of inductor4100, first and second magnetic elements4104,4106have the same size, and/or first and second gaps4126,4128have the same size. Additionally, in some alternate embodiments, first and second windings4108,4110have the same size and configuration, thereby allowing a single winding type to be used for both first and second windings4108,4110. Such configurations promote manufacturing simplicity, ease of component procurement, and/or low cost. However, these configurations may also result in first inductor4114having insufficient current handling capability and/or excessive inductance value, in applications similar to that shown inFIG.45. Accordingly, some alternate embodiments include two or more instances of first winding4108wound around first magnetic element4104, such that multiple first windings4108can be electrically coupled in parallel to achieve sufficiently high current capability and sufficiently low inductance values for first inductor4114. For example, one alternate embodiment includes a symmetrical magnetic core4102, two instances of first winding4108, and two instances of second winding4110. Assuming first windings4108are electrically coupled in parallel and second windings4110are electrically coupled in series, second inductor4116will have roughly four times the inductance of first inductor4114.FIG.46shows a side view of one alternate embodiment of magnetic device4100including a magnetic core4102with symmetric gaps4126,4128, two instances of first winding4108, and two instances of second winding4110. FIG.47shows a top plan view andFIG.48shows a side view of another magnetic device4700including multiple single-turn windings. In contrast to magnetic device4100discussed above, magnetic device4700is intended for use in a coupled inductor application. Magnetic device4700has a depth4701, a width4703, and a height4705(seeFIGS.47and48). Magnetic device4700includes a magnetic core4702including a first magnetic element4704and a second magnetic element4706disposed on first magnetic element4704in the height4705direction. Four single-turn windings4708are wound around first magnetic element4704.FIG.49is a side view of magnetic device4700with windings4708removed, to better show magnetic core4702. FIG.50symbolically shows one possible application of magnetic device4700when used as a two-inductor magnetic device. In this application, single-turn windings4708(1),4708(2) are electrically coupled in parallel by connectors4710(1),4710(2), and single-turn windings4708(3),4708(4) are electrically coupled in series by a connector4710(3). In some embodiments, connectors4710are printed circuit board conductive traces. Windings4708(1),4708(2), first magnetic element4704, and second magnetic element4706collectively form a single-turn first inductor4712. Windings4708(3),4708(4), first magnetic element4704, and second magnetic element4706collectively form a two-turn second inductor4714, in this application. The dashed lines ofFIG.50only approximately delineate the portions of first and second magnetic elements4704,4706forming first and second inductors4712,4714; in actuality, there is some overlap in portions of first and second magnetic element4704,4706forming first and second inductors4712,4714. First and second inductors4712and4714are magnetically coupled. One possible application of magnetic device4700is in a switching converter including a light load enhancer with magnetically coupled inductors. For example, in some embodiments of converter2300(FIG.23), first inductor4712of device4700is first inductor2318of converter2300, and second inductor4714of device4700is second inductor2326of converter2300. In these embodiments, second buck sub-converter2332will have an effective energy storage inductance that is approximately nine times that of first buck sub-converter2330, due to first and second inductors4712,4714being magnetically coupled. Magnetic core4702typically forms first and second gaps4716,4718in opposing first and second magnetic core outer portions4720,4722. Gaps4716,4718are at least partially filled with a non-magnetic material such as air, paper, plastic, and/or adhesive. Gaps4716,4718help control inductance of first and second inductors4712,4714and help prevent saturation of magnetic core4702at high current levels. In certain embodiments, gaps4716,4718have the same size and configuration to promote symmetrical operation of device4700. Opposing ends of each winding4708form respective solder tabs (not shown) for surface mount soldering to a substrate, such as a printed circuit board. However, in certain alternate embodiments, one or more of the solder tabs are replaced with an alternative connector, such as a thru-hole or socket pin. The number of windings4708may be varied without departing from the scope thereof. For example, some alternate embodiments only include two instances of windings4708, such that both first and second inductors4712,4714are single-winding, single-turn inductors. Additionally, although magnetic device4700is shown with foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope hereof. For example, in some alternate embodiments, one or more of windings4708are replaced with round cross-section windings. FIG.51shows a top plan view of a magnetic device5100including four inductors which may be used, for example, in a switching power converter including three power stages and a light load enhancer.FIG.52shows a cross-sectional view of magnetic device5100taken along line51A-51A ofFIG.51, andFIG.53shows a cross-sectional view of magnetic device5100taken along line52A-52A ofFIG.52. Magnetic device5100has a depth5101, a width5103, and a height5105(seeFIGS.51and52). Magnetic device5100includes a magnetic core5102including a first rail5104, a second rail5106, a third rail5108, a plurality of rungs5110, a center post5112, a plurality of leakage teeth5114, and two outer posts5116. Each rung5110joins first and second rails5104,5106in the height5105direction to form a “ladder” portion of magnetic core5102, and each leakage tooth5114is disposed in the height direction between first and second rails5104,5106. Center post5112and each outer post5116joins first rail5104and third rail5108in the height5105direction, with center post5112disposed between outer posts5116in the widthwise5103direction. Second rail5106and third rail5108are separated in the widthwise5103direction by a gap5118filled with non-magnetic material and/or with material having a lower magnetic permeability than that of magnetic core5102. A respective first winding5120is wound around each rung5110, and a second winding5122is wound around center post5112. Although magnetic device5100is shown with windings5120and5122being foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope thereof. For example, in some alternate embodiments, one or more of windings5120,5122are replaced with round cross-section windings. Windings5120, first rail5104, second rail5106, rungs5110, and leakage teeth5114collectively form a three-winding, first inductor5124, as illustrated inFIG.52. First rail5104, second rail5106, and rungs5110collectively magnetically couple first windings5120together, such that first inductor5124is a coupled inductor including three windings. Each leakage tooth5114provides a path for leakage magnetic flux between first and second rails5104,5106to help achieve leakage inductance. Although not required, each leakage tooth5114is typically separated from first rail5104and/or second rail5106by a gap to achieve desired leakage inductance values and to help prevent magnetic saturation at high current levels. Leakage teeth5114can be omitted, such as if small leakage inductance values are desired. Additionally, leakage teeth5114can be replaced with, or supplemented by, one more alternative magnetic structures providing a path for leakage magnetic flux between first and second rails5104,5106. Furthermore, the number of rungs5110and respective windings5120can be varied, such as to change the number of “phases” supported by first inductor5124, as long as the inductor includes at least two rungs5110and respective windings5120. First rail5104, third rail5108, center post5112, outer posts5116, and second winding5122collectively form a second inductor5126, as also illustrated inFIG.52. Although not required, each outer post5116is typically separated from first rail5104and/or from third rail5108by a gap to achieve a desired inductance value of second inductor5126and to prevent magnetic saturation at high current levels. In some alternate embodiments, center post5112is separated from first rail5104and/or from third rail5108by a gap. The dashed lines ofFIG.52only approximately delineate the portions of magnetic device5100forming first and second inductors5124,5126. Gap5118substantially prevents magnetic flux associated with first inductor5124from interacting with magnetic flux associated with second inductor5126. Consequentially, first windings5120are magnetically isolated from second winding5122, and first inductor5124and second inductor5126are not magnetically coupled, even though the two inductors share magnetic core5102. First windings5120are single-turn, relatively thick windings, while second winding5122is a relatively thin, two-turn winding. Therefore, first inductor5124has relatively small leakage inductance values and a relatively large current handling capability, which may make this inductor particular suitable for use in heavy load, multi-phase applications. Second inductor5126, on the other hand, has a relatively large inductance value and a relatively small current handling capability, which may make this inductor particularly suitable for use in light load applications. Thus, one possible application of first inductor5124is in switching sub-converters intended for use at moderate or heavy loads, such as in first buck sub-converters1036of converter1000(FIGS.10and11), and one possible application of second inductor5126is in a switching sub-converter intended for use at light loads, such as in one of second buck sub-converters1038of converter1000(FIGS.10and12). FIG.54shows a top-plan view of a magnetic device5400, andFIG.55shows a cross-sectional view of magnetic device5400taken along lines54A-54A ofFIG.54. Magnetic device5400has a depth5401, a width5403, and a height5405. Magnetic device5400includes four inductors like magnetic device5100ofFIGS.51-53, but magnetic device5400has a different magnetic core structure than magnetic device5100. In particular, magnetic device5400includes a monolithic magnetic core5402including a plurality of magnetic film layers5404stacked in the height5405direction (seeFIG.55). A plurality of non-magnetic structures5406are embedded in monolithic magnetic core5402to form a column5408extending in the height5405direction, where adjacent non-magnetic structures5406are optionally separated from each other by one or more magnetic film layers5404. Non-magnetic structures5406are formed of non-magnetic material or of magnetic material having a lower magnetic permeability than the material forming magnetic film layers5404. Only some instances of magnetic film layers5404and non-magnetic structures5406are labeled to promote illustrative clarity. In some alternate embodiments, monolithic magnetic core5402is formed of a powder magnetic material, instead of magnetic film layers5404. A plurality of first windings5420and one second winding5422are embedded in monolithic magnetic core5402. First windings5420and second windings5422are formed, for example, of one or more layers of conductive ink or film disposed on respective magnetic film layers5404, where different layers of conductive ink or film are connected in the height5405direction by conductive vias (not shown). First and second windings5420and5422may include multiple turns, as illustrated. The turns of each winding5420and5422are electrically coupled in series and/or parallel, to achieve desired inductance values and requisite current carrying capability. In some embodiments, two or more turns of each first winding5420are electrically coupled in parallel to achieve relatively small inductance values and to achieve relatively high current carrying capabilities, while the turns of second winding5422are electrically coupled in series to achieve a relatively large inductance value. The number of windings5420can be varied as long as magnetic device5400includes at least two first winding5420instances. Additionally, the number of turns of each winding5420,5422can be varied without departing from the scope hereof. Column5408of non-magnetic structures5406divides magnetic device5400into a first inductor5424and a second inductor5426. First inductor5424includes each first winding5420and a portion5410of magnetic core5402to the left of column5408, as seen inFIG.55. Second inductor5426includes second winding5422and a portion5412of magnetic core5402to the right of column5408, as also seen inFIG.55. The dashed lines ofFIG.55only approximately delineate the portions of magnetic device5400forming first and second inductors5424,5426. Magnetic core5402magnetically couples first windings5420together such that first inductor5424is a three-winding coupled inductor. Second inductor5426, in contrast, is a single-winding inductor. Column5408magnetically isolates first windings5420from second winding5422. Consequentially, first inductor5424and second inductor5426are not magnetically coupled, even though the two inductors share magnetic core5402. In some embodiments, non-magnetic structures5414are additionally embedded in magnetic core5402, such that non-magnetic structures5414are disposed in some or all of portion5410not enclosed by first windings5420, as seen when magnetic device5400is viewed cross-sectionally in the height5405direction. Non-magnetic structures5414are formed of non-magnetic material or of material having a lower magnetic permeability than the material of magnetic film layers5404. Consequentially, non-magnetic structures5414help prevent flow of magnetic flux outside of areas enclosed by first windings5420, thereby promoting strong magnetic coupling of first windings5420. One possible application of first inductor5424is in switching sub-converters intended for use at moderate or heavy loads, such as in first buck sub-converters1036of converter1000(FIGS.10and11), and one possible application of second inductor5426is in a switching sub-converter intended for use at light loads, such as in one of second buck sub-converters1038of converter1000(FIGS.10and12). Magnetic coupling of inductors sharing a magnetic core in a magnetic device can also be minimized by configuring the magnetic device so that the magnetic flux path of each inductor is orthogonal to the magnetic flux path of each other inductor. This technique for minimizing magnetic coupling can be effective even in applications where several windings share a common magnetic core, thereby promoting small magnetic device size and low magnetic device cost. In this document, the term “orthogonal” is considered encompass embodiments that substantially orthogonal, i.e., within ten degrees of being orthogonal, unless otherwise indicated. Consider, for example,FIG.56, which schematically illustrates a magnetic device5600including a first inductor5602and a second inductor5604. First inductor5602has magnetic flux paths5606, and second inductor5604has magnetic flux paths5608which are substantially orthogonal to magnetic flux paths5606. Therefore, net magnetic flux associated with second inductor5604is near zero in first inductor5602, and net magnetic flux associated with first inductor5602is near zero in second inductor5604. Consequentially, first and second inductors5602,5604are not magnetically coupled, even though both inductors are part of a common magnetic device5600. FIG.57is a perspective view of a magnetic device5700including two inductors with orthogonal magnetic flux paths. Magnetic device5700includes a magnetic core5702, which is, for example, formed of one or more ferrite magnetic elements. Magnetic device5700has a depth5701, a width5703, and a height5705. FIG.58shows a perspective view of magnetic device5700with magnetic core5702shown in wire view, i.e., only the outline of magnetic core5702is shown, to show the interior of magnetic device5700. A first winding5704extends through magnetic core5702in the widthwise5703direction, such that first winding5704forms a turn around a first winding center axis5706extending in the depth5701direction. Two second windings5708are each wound around at least side outer surfaces5711and5713and top outer surface5715of magnetic core5702in the depth5701direction, such that each second winding5708forms a respective turn around a common second winding center axis5710extending in the widthwise5703direction. Second windings5708partially enclose first winding5704.FIGS.59and60show perspective views of first winding5704and second windings5708, respectively, when separated from the remainder of the magnetic device5700. The number of second windings5708may be varied without departing from the scope hereof, such as to achieve a desired inductance value. First winding5704and magnetic core5702collectively form a first inductor, and second windings5708and magnetic core5702collective form a second inductor. Second windings5708are typically electrically coupled in series and/or parallel to achieve desired characteristics of the second inductor. For example, second windings5708may be electrically coupled in series by a printed circuit board conductive trace6002, as illustrated inFIG.60, to achieve a relatively large inductance value of the second inductor. One possible application of magnetic device5700is in power converter300(FIG.3), where the first inductor of magnetic device5700serves as first inductor318, and the second inductor of magnetic device5700serves as second inductor326. First winding center axis5706is orthogonal to second winding center axis5710. Therefore, magnetic flux induced by current flowing through the turn of first winding5704is orthogonal to magnetic flux induced by current flowing through the turns of second windings5708, neglecting second order effects, and first winding5704is therefore not magnetically coupled with second windings5708. Consequentially, the first inductor is not magnetically coupled with the second inductor, even though both windings share a common magnetic core5702and are wound around a common portion of the magnetic core.FIG.59illustrates the approximate magnetic flux path5902of first winding5704when current flows through the turn of first winding5704as illustrated.FIG.60illustrates the approximate magnetic flux path6004of second windings5708when current flows through the turns of second windings5708as illustrated, neglecting magnetic flux associated with current flowing through printed circuit board conductive trace6002.FIG.61illustrates magnetic flux path5902of first winding5704superimposed on magnetic flux path6004of second windings5708, showing that the two magnetic flux paths are orthogonal. Opposing ends of first winding5704form respective solder tabs5712(seeFIG.59), and opposing ends of each second winding5708form respective solder tabs5714(seeFIG.60). In certain embodiments, solder tabs5714(2) and5714(3) are laterally adjacent, as illustrated, to facilitate connecting second windings5708(1) and5708(2) in series by a short conductive trace. Although magnetic device5700is shown with first winding5704and second windings5708being foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope thereof. FIG.62is a perspective view of a magnetic device6200, which is like magnetic device5700ofFIGS.57-61, but further includes a top magnetic plate6202formed of magnetic material. Magnetic device6200has a depth6201, a width6203, and a height6205. Top magnetic plate6202is disposed over top outer surface5715of magnetic core5702in the height6205direction, such that portions of second windings5708are sandwiched between top outer surface5715and top magnetic plate6202. Accordingly, top magnetic plate6202decreases reluctance of the magnetic flux path of second windings5708, thereby promoting large inductance values of the second inductor, as well as electromagnetic compatibility of magnetic device6200with adjacent electrical circuitry. The magnetic flux path of first winding5704in magnetic device6200is essentially the same as in magnetic device5700. However, presence of top magnetic plate6202in magnetic device6200causes the magnetic flux path of second windings5708to be concentrated around the top of magnetic device6200.FIG.63illustrates approximate magnetic flux paths of magnetic device6200resulting from current flowing through winding turns. Magnetic flux path6204of first winding5704is orthogonal to magnetic flux path6206of second windings5708, thereby causing first winding5704to not be magnetically coupled with second windings5708, even though both windings share common magnetic core5702. FIG.64is a perspective view of a magnetic device6400, which is like magnetic device5700ofFIGS.57-61, but further including opposing side magnetic plates6402formed of magnetic material. Magnetic device6400has a depth6401, a width6403, and a height6405. Side magnetic plate6402(1) is disposed on a side outer surface5713of magnetic core5702in the depth6401direction, while side magnetic plate6402(2) is disposed on side outer surface5711of magnetic core5702in the depth direction6401. In the embodiment illustrated inFIG.64, side outer surface5711opposes side outer surface5713. Similar to the top magnetic plate of magnetic device6200(FIG.62), side magnetic plates6402decrease reluctance of the magnetic flux path of second windings5708, thereby promoting large inductance values of the second inductor, as well as electromagnetic compatibility of magnetic device6400with adjacent electrical circuitry. Side magnetic plates6402in magnetic device6400cause the magnetic flux path of second windings5708to be concentrated along the sides of magnetic device6400.FIG.65illustrates approximate magnetic flux paths of magnetic device6400resulting from current flowing through the winding turns. A magnetic flux path6404of first winding5704is orthogonal to a magnetic flux path6406of second windings5708, thereby causing the first and second windings to not be magnetically coupled with each other. FIG.66is a perspective view of a magnetic device6600, which is similar to magnetic device5700ofFIGS.57-61, but with second windings extending through a magnetic core6602of the device. Magnetic core6602is, for example, formed of one or more ferrite magnetic elements. In some embodiments, magnetic core6602includes a first portion6607and a second portion6609joined together, as shown. Magnetic device6600has a depth6601, a width6603, and a height6605. FIG.67shows a perspective view of magnetic device6600with magnetic core6602show in wire view, i.e., only the outline of magnetic core6602is shown, to show the interior of magnetic device6600. A first winding6604extends through magnetic core6602in the widthwise6603direction, such that first winding6604forms a turn around a first winding center axis6606extending in the depth6601direction. Two second windings6608each extend through magnetic core6602in depth6601direction, such that each second winding6608forms a turn around a second winding center axis6610extending in the widthwise6603direction. First winding6604partially encloses second windings6608. Disposing second windings6608within magnetic core6602, instead of on the magnetic core outer surface, promotes a low reluctance, controlled path for magnetic flux associated with current flowing through second windings6608, thereby promoting large inductance values and electromagnetic capability with adjacent electrical circuitry. The number of second windings6608may be varied without departing from the scope hereof, such as to achieve a desired inductance value. Although magnetic device6600is shown with first winding6604and second winding6608being foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope thereof. First winding6604and magnetic core6602collectively form a first inductor, and second windings6608and magnetic core6602collectively form a second inductor. Second windings6608are typically electrically coupled in series and/or parallel to achieve desired characteristics of the second inductor. For example, second windings6608may be electrically coupled in series by a printed circuit board conductive trace, to achieve a relatively large inductance value of the second inductor. One possible application of magnetic device6600is in power converter300(FIG.3), where the first inductor of magnetic device6600serves as first inductor318, and the second inductor of magnetic device6600serves as second inductor326. First winding center axis6606is orthogonal to second winding center axis6610. Therefore, magnetic flux induced by current flowing through the turn of first winding6604is orthogonal to magnetic flux induced by current flowing through the turns of second windings6608, neglecting second order effects, and first winding6604is not magnetically coupled with second windings6608. Consequentially, the first inductor of magnetic device6600is not magnetically coupled with the second inductor of magnetic device6600, even though both inductors share a common magnetic core6602and are wound around a common portion of the magnetic core.FIG.68illustrates a magnetic flux path6802associated with current flowing through the turn of first winding6604superimposed on a magnetic flux path6804associated with current flowing through the turns of second windings6608, showing that the two magnetic flux paths are orthogonal. FIG.69shows a perspective view of a magnetic device6900, which is another magnetic device including two inductors with orthogonal magnetic flux paths. Magnetic device6900includes a monolithic magnetic core6902, which is, for example, formed of powder magnetic material. Magnetic core6902is shown in wire view, i.e., only its outline is shown, to show the interior of magnetic device6900. Magnetic device6900has a depth6901, a width6903, and a height6905. A first winding6904and a second winding6908are embedded in monolithic magnetic core6902. First winding6904forms one or more turns around a first winding center axis6906extending in the height6901direction, and second winding6908forms one or more turns around a second winding center axis6910extending in the widthwise6903direction. Second winding6908typically at least partially encloses first winding6904to minimize required size of magnetic core6902.FIGS.70and71show perspective views of first winding6904and second windings6908, respectively, when separated from the remainder of magnetic device6900. The number of turns of each winding6904and6908may be varied without departing from the scope hereof. First winding6904and monolithic magnetic core6902collectively form a first inductor, and second winding6908and monolithic magnetic core6902collectively form a second inductor. Although not required, it is anticipated that second winding6908will form more turns than first winding6904, so that the second inductor has a greater inductance value than the first inductor. Additionally, in certain embodiments, first winding6904is thicker, e.g., formed of lower gauge wire, than second winding6908, so that the first inductor has a higher current handling capability than the second inductor. According, one possible application of magnetic device6900is in power converter300(FIG.3), where the first inductor of magnetic device6900serves as first inductor318, and the second inductor of magnetic device6900serves as second inductor326. First winding center axis6906is orthogonal to second winding center axis6910. Therefore, magnetic flux induced by current flowing through the turns of first winding6904is orthogonal to magnetic flux induced by current flowing through the turns of second winding6908, neglecting second order effects. See, for example,FIGS.70and71, which respectively show an approximate first path7002of magnetic flux through the turns of first winding6904and an approximate second path7102of magnetic flux through the turns of second winding6908. First path7002is orthogonal to second path7104, as can be seen when comparingFIGS.70and71, and first winding6904is therefore not magnetically coupled with second winding6908. Consequentially, the first inductor of magnetic device6900is not magnetically coupled with the second inductor of magnetic device6900, even though both inductors share a common monolithic magnetic core6902and are wound around a common portion of the magnetic core. Magnetic device6900could be modified to include additional instances of first winding6904and/or second winding6908. For example,FIG.72shows a perspective view of a magnetic device7200, which is similar to magnetic device6900ofFIG.69, but includes three first winding instances. Magnetic device7200has a depth7201, a width7203, and a height7205. Three first windings7204and one second winding7208are embedded in a monolithic magnetic core7202, which is formed, for example, of powder magnetic material. Monolithic magnetic core7202is shown in wire view inFIG.72, i.e., only the outline is shown inFIG.72, to show the interior of magnetic device7200. Each first winding7204forms one or more turns around a respective first winding center axis7206extending in the height7205direction, and second winding7208forms one or more turns around a second winding center axis7210extending in the widthwise7203direction. Second winding7208typically at least partially encloses first windings7204.FIGS.73and74show perspective views of first windings7204and second winding7208, respectively, when separated from the remainder of magnetic device7200. The number of turns of each winding7204and7208may be varied without departing from the scope hereof. First windings7204and monolithic magnetic core7202collectively form a first inductor, and second winding7208and monolithic magnetic core7202collective form a second inductor. Each first winding center axis7206is parallel to each other first winding center axis7206, and accordingly, monolithic magnetic core7202magnetically couples each first winding7204with each other first winding. Therefore, the first inductor of magnetic device7200is a coupled inductor including three first windings7204. Second winding center axis7210is orthogonal to each first winding center axis7206. Therefore, magnetic flux induced by current flowing through the turns of first windings7204is orthogonal to magnetic flux induced by current flowing through the turns of second winding7208, neglecting second order effects. See, for example,FIGS.73and74, which respectively show approximate paths7302of magnetic flux through the turns of first windings7204and an approximate path7402of magnetic flux through the turns of second winding7208. Each path7302is orthogonal to path7404, as can be seen when comparingFIGS.73and74. Consequentially, although first windings7204are magnetically coupled with each other, first windings7204are not magnetically coupled with second winding7208, even though second winding7208and each first winding7204are wound around a common respective portion of magnetic core7202. One possible application of the first inductor of magnetic device7200is in switching sub-converters intended for use at moderate or heavy loads, such as in first buck sub-converters1036of converter1000(FIGS.10and11). One possible application of the second inductor of magnetic device7200is in a switching sub-converter intended for use at light loads, such as in one of second buck sub-converters1038of converter1000(FIGS.10and12). FIG.75shows a perspective view of a magnetic device7500, which is similar to magnetic device7200ofFIG.72, but where the second winding does not enclose the first windings. Magnetic device7500has a depth7501, a width7503, and a height7505. Two first windings7504and one second winding7508are embedded in a monolithic magnetic core7502, which is formed, for example, of powder magnetic material. Monolithic magnetic core7502is shown in wire view inFIG.75, i.e., only the outline is shown inFIG.75, to show the interior of magnetic device7500. Each first winding7504forms one or more turns around a respective first winding center axis7506extending in the height7505direction, and second winding7508forms one or more turns around a second winding center axis7510extending in the widthwise7503direction.FIGS.76and77show perspective views of first windings7504and second winding7508, respectively, when separated from the remainder of magnetic device7500. The number of turns of each winding7504and7508may be varied without departing from the scope hereof. First windings7504and monolithic magnetic core7502collectively form a first inductor, and second winding7508and monolithic magnetic core7502collectively form a second inductor. Each first winding center axis7506is parallel to each other first winding center axis7506, and accordingly, monolithic magnetic core7502magnetically couples each first winding7504with each other first winding7504. Therefore, the first inductor of magnetic device7500is a coupled inductor including two first windings7504. Second winding center axis7510is orthogonal to each first winding center axis7506. Therefore, magnetic flux induced by current flowing through the turns of first windings7504is orthogonal to magnetic flux induced by current flowing through the turns of second winding7508, neglecting second order effects. See, for example,FIGS.76and77, which respectively show approximate paths7602of magnetic flux from currently flowing through the turns of first windings7504and an approximate path7702of magnetic flux from current flowing through the turns of second winding7508. Paths7602are each orthogonal to path7702, as can be seen when comparingFIGS.76and77. Consequentially, although first windings7504are magnetically coupled with each other, first windings7504are not magnetically coupled with second winding7508, even though all windings are embedded in monolithic magnetic core7502. The fact that second winding7508does not enclose first windings7504helps minimize overlap of magnetic flux associated with first windings7504and magnetic flux associated with second winding7508. Consequentially, magnetic device7500may have higher saturation current ratings than magnetic device7200, assuming otherwise similar configuration. Magnetic device7500will typically be larger than magnetic device7200, however, because first windings7504and second winding7508each require a respective portion of magnetic core7502. FIG.78shows a perspective view of a magnetic device7800, which is another magnetic device including inductors with orthogonal magnetic flux paths. Magnetic device7800has a depth7801, a width7803, and a height7805. Magnetic device7800includes a magnetic core7802including a first end magnetic element7804, a second end magnetic element7806, a plurality of rungs7808, and a top magnetic element7810.FIG.79shows a perspective view of magnetic device7800with magnetic core7802shown in wire view, i.e. where only the outline of magnetic core7802is shown, to show the interior of magnetic device7800.FIG.80shows an exploded perspective view of magnetic device7800with first end magnetic element7804, top magnetic element7810, and second windings7818separated from the reminder of the magnetic device. Each rung7808joins first end magnetic element7804and second magnetic element7806in the depth7801direction. Therefore, first and second end magnetic elements7804,7806and legs7808collectively form a “ladder” magnetic core, where first and second end magnetic elements7804,7806are analogous to ladder rails and rungs7808are analogous to ladder rungs. Top magnetic element7810is disposed over some or all of rungs7808in the height7805direction, such that top magnetic element7810provides a path in the depth7801direction for magnetic flux between first end magnetic element7804and second end magnetic element7806. A respective first winding7812is wound around each rung7808, such that each first winding forms a turn around a respective first center winding axis7814extending in the depth7801direction (seeFIG.79). Only some first center winding axes7814are shown to promote illustrative clarity. First and second end magnetic elements7804,7806and rungs7808collectively magnetically couple first windings7812together. Top magnetic element7810, on the other hand, provides paths for leakage magnetic flux associated with first windings7812. Accordingly, first windings7812and magnetic core7802collectively from a first inductor, which is a coupled inductor. Although not required, one or more gaps7816are typically formed in series with the magnetic flux path of top magnetic element7810, such as to achieve desired leakage inductance values of first windings7812and/or to achieve resistance to magnetic saturation. Magnetic device7800further includes one or more second windings7818, where each second winding7818is wound around first and second end magnetic elements7804,7806and top magnetic element7810in the depth7801direction, such that each second winding7818forms one or more turns around a common second winding center axis7820extending in the width7803direction. Second windings7818and magnetic core7802collectively form a second inductor. Second windings7818are typically electrically coupled in series and/or parallel to achieve desired characteristics of the second inductor. For example, second windings7818may be electrically coupled in series by a printed circuit board conductive trace to achieve a relatively large inductance value of the second inductor. One possible application of the first inductor of magnetic device7800is in a switching sub-converter intended for use at moderate or heavy loads, such as in first buck sub-converters1036of converter1000(FIGS.10and11). One possible application of the second inductor of magnetic device7800is in a switching sub-converter intended for use at light loads, such as in one of second buck sub-converters1038of converter1000(FIGS.10and12). The relationship between the turns of first windings7812, the turns of second windings7818, and magnetic core7802causes first windings7812to not be magnetically coupled with second windings7818, even though all windings are wound around portions of common magnetic core7802. In particular, net coupling magnetic flux associated with first windings7812is essentially zero in the turns of second windings7818. Furthermore, magnetic flux associated with second windings7818is substantially orthogonal to leakage magnetic flux associated with first windings7812. To help appreciate these features, first considerFIG.81, which is a perspective view of first windings7812and second windings7818without magnetic core7802. Leakage magnetic flux associated with each first winding7812flows in loops around each turn of the winding and primarily through top magnetic element7810, as approximated by leakage flux paths8102. Magnetizing flux associated first windings7812, in contrast, links turns of first winding7812instances. An approximate path8104is shown inFIG.81for magnetizing flux linking first windings7812(3) and7812(4). Next considerFIG.82, which is a perspective view of second windings7818without magnetic core7802, where second windings7818are connected in series by a printed circuit board conductive trace8202. Leakage magnetic flux paths8102and coupling magnetic flux path8104fromFIG.81are superimposed onFIG.82. Magnetic flux associated with current flowing through the turns of second windings7818is approximated by magnetic flux paths8204. Leakage magnetic flux paths8102are orthogonal to magnetic flux paths8204. Therefore, leakage magnetic flux associated with first windings7812does not materially link second windings7818. Additionally, net magnetizing flux associated with first windings7812is substantially zero in the turns of second windings7818, as shown, for example, by magnetizing flux path8104being symmetric within each second winding7818. Therefore, magnetizing flux associated with first windings7812does not link second windings7818. Accordingly, first windings7812are not magnetically coupled with second windings7818. It should be appreciated the lack of interaction between first windings7812and second windings7818applies irrespective of the location and number of second windings7818along the width7803of magnetic device7800. Accordingly, the number of second windings7818and the location of second windings7818along width7803may be varied without departing from the scope hereof. Opposing ends of first windings7812form respective solder tabs7822, and opposing ends of each second winding7818form respective solder tabs7824(seeFIG.80). Only some solder tabs7822are visible in the perspective views herein, however. In certain embodiments, solder tabs7824(2) and7824(3) are laterally adjacent, such as illustrated inFIGS.80and82, to facilitate connecting second windings7818in series by a short conductive printed circuit board trace. Although magnetic device7800is shown with first windings7812and second windings7818being foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope thereof. FIG.83shows a perspective view of a magnetic device8300having a depth8301, a width8303, and a height8305. Magnetic device8300is similar to magnetic device7800ofFIGS.78-82, but with top magnetic element7810replaced with top magnetic element8310, and with second windings7818replaced with second windings8318.FIG.84shows a perspective view of magnetic device8300with magnetic core8302shown in wire view, i.e. where only the outline of magnetic core8302is shown, to show the interior of magnetic device8300. Top magnetic element8310extends at least partially over each of first end magnetic element7804and second end magnetic element7806, to provide a path in the depth8301direction for magnetic flux between first end magnetic element7804and second end magnetic element7806. While not required, top magnetic element8310is typically separated from each of first end magnetic element7804and second end magnetic element7806by a respective gap8316, to achieve desired leakage inductance values and/or to achieve resistance to magnetic saturation. Each second winding8318is wound around first and second end magnetic elements7804and7806in the depth direction, such that each second winding8318forms one or more turns around a second winding center axis8320extending in the width8303direction. Top magnetic element8310is disposed over second windings8318in the height8305direction, which helps achieve a low reluctance of a magnetic flux path associated with second windings8318. Accordingly, the second inductor of magnetic device8300, which is collectively formed of second windings8318and magnetic core8302, may have a larger inductance value than the second inductor of magnetic device7800, assuming otherwise similar magnetic device configuration. Additionally, presence of top magnetic element8310over second windings8318helps contain magnetic flux within magnetic core8302, thereby promoting electromagnetic compatibility between magnetic device8300and adjacent circuitry. Applicants have further discovered that interaction between a coupled inductor and a co-packaged additional inductor can be minimized by strongly coupling the additional inductor with the coupled inductor, so that essentially all magnetizing flux associated with the coupled inductor links the winding of the additional inductor. Such configuration causes net magnetizing flux linking the winding of the additional inductor to be near zero, assuming the ratio of magnetizing inductance to leakage inductance of the coupled inductor is large. Consequentially, a voltage applied across any winding of the coupled inductor will result in a relatively small (ideally zero) voltage across the additional inductor's winding. Therefore, operation of the coupled inductor will have minimal effect on operation of the additional inductor. Furthermore, magnetic flux associated with the additional inductor is divided among the various windings of the coupled inductor. As a result, voltage applied across the winding of the additional inductor is divided among the various windings of the coupled inductor, causing only a relatively small voltage to be induced across any one winding of the coupled inductor. Furthermore, in cases where the additional inductor's winding has more turns than each winding of the coupled inductor, magnitude of voltage induced across the coupled inductor's windings is further decreased according to the ratio of turns of the coupled inductor to turns of the additional inductor. ConsiderFIG.85, for example, which schematically illustrates a magnetic device8500including a coupled inductor and an additional inductor. The coupled inductor includes three first windings8502symbolically shown by respective boxes, and the additional inductor includes a single second winding8504symbolically shown by a box. A magnetic core (not shown) magnetically couples first windings8502together. Additionally, the magnetic core strongly couples second winding8504with first windings8502, such that essentially all magnetizing flux associated with first windings8502links second winding8504. Assume that (1) the magnetizing inductance is much greater than leakage inductance in the coupled inductor, (2) current through first winding8502(1) generates a magnetizing flux Φ1, and (3) that the magnetic core is symmetrical. Magnetizing flux Φ1 will divide roughly equally into magnetizing flux Φ2and Φ3flowing in the opposite direction of magnetizing flux Φ1, where magnetizing flux Φ2links first winding8502(2), and magnetizing flux Φ3links first winding8502(3). Each of magnetizing flux Φ1, Φ2, and Φ3links second winding8504, since second winding8504is strongly magnetically coupled to first windings8502. Therefore, net magnetizing flux net through second winding8504is equal to the sum of Φ1, Φ2and Φ3. Net magnetizing flux Φnetis substantially zero because each of Φ2and Φ3is roughly half of Φ1, and because each of Φ2and Φ3flows in the opposite direction of Φ1. Therefore, current flowing through coupled inductor winding8502(1) induces relatively little voltage on additional inductor winding8504. Similarly, current flowing through each of coupled inductor windings8502(2) and8502(3) also induces relatively little voltage on additional inductor winding8504. On the other hand, magnetic flux (not shown) associated with current flowing through second winding8504will divide roughly evenly between each of first windings8502. Therefore, current flowing through second winding8504will generate relatively little magnetic flux linking any one first winding8502, and current flowing through second winding8504will therefore induce relatively little voltage on any one first winding8502. The above discussion of magnetic device8500assumes that leakage inductance is negligible. However, a practical coupled inductor will necessarily have some leakage inductance, such as to achieve energy storage in switching power converter applications. Although net leakage magnetic flux within the turns of second winding8504will likely not be zero, leakage magnetic flux within the turns of second winding8504will tend to average, such that leakage magnetic flux has a relatively minor effect on magnetic device8500operation, in typical switching power converter applications. FIG.86shows a perspective view of a magnetic device8600, which includes a coupled inductor and an additional inductor strongly magnetically coupled thereto. Magnetic device8600has a depth8601, a width8603, and a height8605. Magnetic device8600includes a magnetic core8602including a first end magnetic element8604, a second end magnetic element8606, a plurality of rungs8608, and top magnetic element8610.FIG.87shows a perspective view of magnetic device8600with magnetic core8602shown in wire view, i.e. where only the outline of magnetic core8602is shown, to show the interior of magnetic device8600.FIG.88shows an exploded perspective view of magnetic device8600with first end magnetic element8604and top magnetic element8610separated from the reminder of the magnetic device. Each rung8608joins first end magnetic element8604and second magnetic element8606in the depth8601direction. Therefore, first and second end magnetic elements8604,8606and legs8608collectively form a “ladder” magnetic core, where first and second end magnetic elements8604,8606are analogous to ladder rails and where rungs8608are analogous to ladder rungs. Top magnetic element8610is disposed over some or all of rungs8608in the height direction, such that top magnetic element8610provides a path in the depth8601direction for magnetic flux between first end magnetic element8604and second end magnetic element8606. A respective first winding8612is wound around each rung8608, such that each first winding forms a first winding turn8613having a first center winding axis8614extending in the depth8601direction (seeFIG.87). Only some first center winding axes8614are shown to promote illustrative clarity. First and second end magnetic elements8604,8606and rungs8608collectively magnetically couple first windings8612together. Top magnetic element8610, on the other hand, provides paths for leakage magnetic flux associated with first windings8612. Accordingly, first windings8612and magnetic core8602collective from a first inductor, which is a coupled inductor. Although not required, one or more gaps8616are typically formed in series with the magnetic flux path of top magnetic element8610, such as to achieve desired leakage inductance values of first windings8612and/or to achieve resistance to magnetic saturation. Magnetic device8600further includes a second winding8618wound around all rungs8608such that second winding8618forms a second winding turn8619. Each first winding turn8613is within second winding turn8619, as seen when magnetic device8600is viewed cross-sectionally in the depth8601direction. Accordingly, each first winding turn8613encloses a respective first area, second winding turn8619encloses a second area, and the second area overlaps each first area, when magnetic device8600is viewed cross-sectionally in the depth8601direction.FIG.89shows a perspective view of second winding8618separated from the remainder of magnetic device8600. Second winding8618and magnetic core8602collectively form a second inductor. The fact that each first winding turn8613is within second winding turn8619causes magnetizing flux linking each first winding8612to also link second winding8618, thereby strongly magnetically coupling second winding8618with each first winding8612. Therefore, net magnetizing flux associated with first windings8612is substantially zero within second winding turn8619, and operation of the first inductor will have relatively little effect on operation of the second inductor, even though both inductors share magnetic core8602. Additionally, magnetic flux linking second winding8618is divided among first windings8612, such that relatively little magnetic flux associated with current flowing through second winding8618links each first winding8612. As a result, operation of the second inductor will have relatively little effect on operation of the first inductor, even though both inductors share common magnetic core8602. Opposing ends of first winding8612form respective solder tabs8622, and opposing ends of second winding8618form respective solder tabs8624(seeFIGS.87-89). Only some solder tabs8622are visible in the perspective views herein, however. Second winding8618diagonally crosses rungs8608so that solder tabs8624do not interfere with solder tabs8622on a bottom of magnetic device8600. The configuration of second winding8618could be modified, however, as long as it forms at least one common turn around all rungs8608. Although magnetic device8600is shown with first windings8612and second winding8618being single-turn foil windings to help minimize conduction losses at high frequencies, the winding style may be varied without departing from the scope thereof. Additionally, the number of first windings8612may be varied, as long as magnetic device8600includes at least two first windings8612. One possible application of the first inductor of magnetic device8600is in switching sub-converters intended for use at moderate or heavy loads, such as in first buck sub-converters1036of converter1000(FIGS.10and11). One possible application of the second inductor of magnetic device8600is in a switching sub-converter intended for use at light loads, such as in one of second buck sub-converters1038of converter1000(FIGS.10and12). FIG.90shows a top-plan view of a magnetic device9000, which is another magnetic device including a coupled inductor and an additional inductor strongly magnetically coupled thereto.FIG.91shows a cross-sectional view of magnetic device9000taken along lines90A-90A ofFIG.90, andFIG.92shows a cross-sectional view of magnetic device9000taken along lines91A-91A ofFIG.91. Magnetic device9000has a depth9001, a width9003, and a height9005(seeFIGS.90and91). Magnetic device9000includes a monolithic magnetic core9002including a plurality of magnetic film layers9004stacked in the height9005direction (seeFIG.91). Only some magnetic film layers9004are labeled to promote illustrative clarity. Two first windings9006and one second winding9008are embedded in monolithic magnetic core9002. Each first winding9006forms a respective first winding turn9013around a respective first winding center axis9007extending in the height9005direction, and second winding9008forms a second winding turn9019around a second winding center axis9011extending in the height direction (seeFIG.92). First windings9006and second winding9008are formed, for example, of one or more layers of conductive ink or film disposed on respective magnetic film layers9004, where different layers of conductive ink or film are connected in the height9005direction by conductive vias9009. Several examples of conductive vias9009are shown in the cross-sectional view ofFIG.92, although not all via instances are labeled to promote illustrative clarity. First windings9006and magnetic core9002collectively form a first inductor, and second winding9008and magnetic core9002collectively form a second inductor. Magnetic core9002magnetically couples first windings9006together. Thus, the first inductor is a two-winding coupled inductor. First windings9006are separated from each other in the width9003direction. Each first winding turn9013is within second winding turn9019, as seen when magnetic device9000is viewed cross-sectionally in the height9005direction (seeFIG.92). Accordingly, each first winding turn9013encloses a respective first area9021, second winding turn9019encloses a second area9023, and second area9023overlaps each first area9021, when magnetic device9000is viewed cross-sectionally in the height9005direction. Consequentially, magnetizing flux linking each first winding9006also links second winding9008, thereby strongly magnetically coupling second winding9008with each first winding9006. As a result, net magnetizing flux associated with first windings9006is substantially zero within area9023, and operation of the first inductor will have relatively little effect on operation of the second inductor, even though both inductors share magnetic core9002. Additionally, magnetic flux linking second winding9008is divided among first windings9006, such that relatively little magnetic flux associated with current flowing through second winding9008links any given first winding9006. As a result, operation of the second inductor will have relatively little effect on operation of the first inductor, even though both inductors share common magnetic core9002. In some embodiments, non-magnetic structures9010are additionally embedded in monolithic magnetic core9002, such that non-magnetic structures9010are disposed in some or all of portions of monolithic magnetic core9002outside of areas9021enclosed by first winding turns9013, as seen when magnetic device9000is viewed cross-sectionally in the height9005direction. Non-magnetic structures9010are formed of non-magnetic material or of material having a lower magnetic permeability than the material of magnetic film layers9004. Consequentially, non-magnetic structures9010help prevent flow of magnetic flux outside of areas9021enclosed by first winding turns9013, thereby promoting strong magnetic coupling of first windings9006. Each first winding9006and second winding9008may include multiple turns, as illustrated. The turns of each winding9006and9008are electrically coupled in series and/or parallel, to achieve desired inductance values and requisite current carrying capability. In some embodiments, two or more turns of each first winding9006are electrically coupled in parallel to achieve relatively small inductance values and to achieve relatively high current carrying capabilities, while the turns of second winding9008are electrically coupled in series to achieve a relatively large inductance value. The number of first windings9006can be varied as long as magnetic device9000includes at least two first winding9006instances. Additionally, the number of turns of each first winding9006and of second winding9008can be varied without departing from the scope hereof. One possible application of first inductor of magnetic device9000is in a switching sub-converter intended for use at moderate or heavy loads, such as in first buck sub-converters1036of converter1000(FIGS.10and11), and one possible application of the second inductor of magnetic device9000is in a switching sub-converter intended for use at light loads, such as in one of second buck sub-converters1038of converter1000(FIGS.10and12). FIG.93shows a perspective view of a magnetic device9300having a depth9301, a width9303, and a height9305. Magnetic device9300is similar to magnetic device9000ofFIGS.90-92, but magnetic device9300includes a monolithic magnetic core9302formed of powder magnetic material, instead of magnetic film layers. Monolithic magnetic core9302is shown in wire view, i.e., only the outline of magnetic core9302is shown, to show the interior of magnetic device9300. Three first windings9306and one second winding9308are embedded in monolithic magnetic core9302. Each first winding9306forms a respective first winding turn9313wound around a respective winding center axis9307extending in the height9305direction, and second winding9308forms a second winding turn9319wound around a winding center axis9307(2) of first winding9306(2), such that second winding turn9319and first winding turn9313(2) are wound around the same winding center axis. First windings9306and monolithic magnetic core9302collectively form a first inductor, and second winding9308and monolithic magnetic core9302collectively form a second inductor. Monolithic magnetic core9302magnetically couples first windings9306together. Thus, the first inductor is a three-winding coupled inductor. First windings9306are separated from each other in the width9303direction. Each first winding turn9313is within second winding turn9319, as seen when magnetic device9300is viewed cross-sectionally in the height direction. As a result, magnetizing flux linking each first winding9306also links second winding9308, thereby strongly magnetically coupling second winding9308with each first winding9306. Consequentially, net magnetizing flux associated with first windings9306is substantially zero within second winding turn9319, and operation of the first inductor will have relatively little effect on operation of the second inductor, even though both inductors share common magnetic core9302. Additionally, magnetic flux linking second winding9308is divided among first windings9306, such that relatively little magnetic flux associated with current flowing through second winding9308links any given first winding9306. As a result, operation of the second inductor will have relatively little effect on operation of the first inductor, even though both inductors share common magnetic core9302. Each first winding9306and second winding9308may include multiple turns, as illustrated.FIG.94shows a perspective view of first windings9306separated from the remainder of magnetic device9300, andFIG.95shows a perspective view of second winding9308separated from the remainder of magnetic device9300. The number of first windings9306can be varied as long as magnetic device9300includes at least two first winding9306instances. Additionally, the number of turns of each first winding9306and second winding9308can be varied without departing from the scope hereof. Combinations of Features Features described above as well as those claimed below may be combined in various ways without departing from the scope hereof. The following examples illustrate some possible combinations: (A1) A power converter may include first and second switching sub-converters. The first switching sub-converter may be adapted to transfer power from an input power port to an output power port in a first operating mode of the power converter, and the first switching sub-converter may be adapted to operate in an inactive mode in a second operating mode of the power converter. The second switching sub-converter may be adapted to transfer power from the input power port to the output power port in the second operating mode of the power converter, and the second switching sub-converter may be adapted to operate in an inactive mode in the first operating mode of the power converter. (A2) In the power converter denoted as (A1), an effective energy storage inductance value of the second switching sub-converter may be greater than an effective energy storage inductance value of the first switching sub-converter. (A3) Either of the power converters denoted as (A1) or (A2) may be adapted to switch between the first and second operating modes in response to an external signal. (A4) In any of power converters denoted as (A1) through (A3), the first operating mode may correspond to a moderate or heavy load operating condition of the power converter, and the second operating mode may correspond to a light load operating condition of the power converter. (A5) In any of the power converters denoted as (A1) through (A4), each of the first and second switching sub-converters may have a buck-type topology. (A6) In any of the power converters denoted as (A1) though (A5), the first switching sub-converter may include a first inductor, the second switching sub-converter may include both the first inductor and a second inductor, and the first and second inductors may be electrically coupled in series. (A7) In any of the power converters denoted as (A1) through (A5), the first switching sub-converter may include a first inductor, the second switching sub-converter may include both the first inductor and a second inductor, and the first and second inductors may be part of a common coupled inductor. (A8) In the power converter denoted as (A7), the first and second inductors may collectively form a single multi-turn inductor, in the second operating mode of the power converter. (B1) A power converter may include first and second inductors, first and second control switching devices, and first and second freewheeling devices. The first inductor may be electrically coupled to a first switching node, and the first control switching device may be electrically coupled between a first power node and the first switching node. The second inductor may be electrically coupled to a second switching node, and the second control switching device may be electrically coupled between the first power node and the second switching node. The first control switching device may be adapted to (1) repeatedly switch between its conductive and non-conductive states in a first operating mode of the power converter, and (2) operate in its non-conductive state in a second operating mode of the power converter. The second control switching device may be adapted to (1) operate in its non-conductive state in the first operating mode of the power converter, and (2) repeatedly switch between its conductive and non-conductive states in the second operating mode of the power converter. The first freewheeling device may be adapted to provide a path for current flowing through the first inductor when the first control switching device is in its non-conductive state, in the first operating mode of the power converter. The second freewheeling device may be adapted to provide a path for current flowing through the second inductor when the second control switching device is in its non-conductive state. (B2) In the power converter denoted as (B1), the second inductor may be electrically coupled between the first and second switching nodes, and the second freewheeling device may be adapted to provide a path for current flowing through both of the first and second inductors when the second control switching device is in its non-conductive state. (B3) In either of the power converters denoted as (B1) or (B2), the first power node may be selected from the group consisting of an input power node and a common power node. (B4) In the power converter denoted as (B3), the common power node may be a ground node. (B5) In any of the power converters denoted as (B1) through (B4), the first control switching device may include a transistor electrically coupled between the first power node and the first switching node, the second control switching device may include a transistor electrically coupled between the first power node and the second switching node. (B6) In any of the power converters denoted as (B1) through (B5), the first freewheeling device may be electrically coupled between a second power node and the first switching node, the second power node may be selected from the group consisting of a common power node and an output power node, and the second freewheeling device may be electrically coupled between the second power node and the second switching node. (B7) In the power converter denoted as (B6), the first freewheeling device may include a first freewheeling switching device electrically coupled between the second power node and the first switching node, and the second freewheeling device may include a second freewheeling switching device electrically coupled between the second power node and the second switching node. (B8) In the power converter denoted as (B6), the first freewheeling device may include a first freewheeling diode electrically coupled between the second power node and the first switching node, and the second freewheeling device may include a second freewheeling diode electrically coupled between the second power node and the second switching node. (B9) In any of the power converters denoted as (B1) through (B8), the first inductor may have a first inductance value, and the second inductor may have a second inductance value that is larger than the first inductance value. (B10) In any of the power converters denoted as (B1) through (B9), the first operating mode may correspond to a moderate or heavy load operating condition of the power converter, and the second operating mode may correspond to a light load operating condition of the power converter. (B11) Any of the power converters denoted as (B1) through (B10) may further include a controller for controlling at least the first and second control switching devices. (B12) In the power converter denoted as (B11), each of the first and second control switching devices may include a transistor, and the controller may include circuitry for driving the transistors between their conductive and non-conductive states. (B13) In either of the power converters denoted as (B11) or (B12), the controller may be adapted to switch the power converter between the first and second operating modes. (B14) In the power converter denoted as (B13) the controller may be adapted to switch the power converter between the first and second operating modes in a response to an external signal. (B15) In the power converter denoted as (B13), the controller may be adapted to switch the power converter between the first and second operating modes in a response to a signal generated by or associated with a processor. (B16) In the power converter denoted as (B15), the processor may be a processor of an information technology device. (B17) In the power converter denoted as (B16), the information technology device may be selected from the group consisting of a tablet computer and a smart phone. (B18) In any of the power converters denoted as (B1) through (B17), the first inductor may be electrically coupled between the first switching node and an output power node, and the power converter may further include a capacitor electrically coupled to the output power node. (B19) In the power converter denoted as (B18), the first inductor, the first control switching device, the first freewheeling device, and the capacitor may be configured to collectively form at least part of a first buck sub-converter. (B20) In the power converter denoted as (B19), the first buck sub-converter may be operable to operate in a discontinuous conduction mode during at least one of the first and second operating modes of the power converter. (B21) In either of the power converters denoted as (B19) or (B20), the second inductor, the second control switching device, the second freewheeling device, and the capacitor may be configured to collectively form at least part of a second buck sub-converter. (B22) In the power converter denoted as (B21), the first and second inductors may be electrically coupled in series and collectively form an energy storage inductance for the second buck sub-converter. (B23) In either of the power converters denoted as (B21) or (B22), the second buck sub-converter may be operable to operate in a discontinuous conduction mode during the second operating mode of the power converter. (B24) In any of the power converters denoted as (B1) through (B17), the first inductor, the first freewheeling device, and the first control switching device may collectively form part of a DC-to-DC sub-converter selected from the group consisting of a boost sub-converter and a buck-boost sub-converter. (B25) Any of the power converters denoted as (B1) through (B24) may further include a third inductor, a third control switching device, and a third freewheeling device. The third inductor may be electrically coupled to a third switching node, and the third control switching device may be electrically coupled between the first power node and the third switching node. The third control switching device may be adapted to (1) repeatedly switch between its conductive and non-conductive states in the first operating mode of the power converter, and (2) operate in its non-conductive state in the second operating mode of the power converter. The third freewheeling device may be adapted to provide a path for current flowing through the third inductor when the third control switching device is in its non-conductive state, in the first operating mode of the power converter. (B26) The power converter denoted as (B25) may further include a fourth inductor electrically coupled to a fourth switching node, a fourth control switching device electrically coupled between the first power node and the fourth switching node, and a fourth freewheeling device. The fourth control switching device may be adapted to (1) operate in its non-conductive state in the first operating mode of the power converter, and (2) repeatedly switch between its conductive and non-conductive states in the second operating mode of the power converter. The fourth freewheeling device may be adapted to provide a path for current flowing through the fourth inductor when the fourth control switching device is in its non-conductive state. (B27) In the power converter denoted as (B26), the fourth inductor may be electrically coupled between the third and fourth switching nodes, and the fourth freewheeling device may be adapted to provide a path for current flowing through both of the third and fourth inductors when the fourth control switching device is in its non-conductive state. (B28) In any of the power converters denoted as (B25) through (B27), the first and third inductors may be part of a common coupled inductor. (B29) In any of the power converters denoted as (B1) through (B28), the first and second inductors may be part of a common magnetic device. (B30) In the power converter denoted as (B29), the common magnetic device may include a magnetic core and first and second windings. (B31) In the power converter denoted as (B30), the magnetic core and the first winding may collectively form the first inductor, and the magnetic core and the second winding may collectively form the second inductor. (B32) In any of the power converters denoted as (B30) through (B32), the magnetic core may have opposing first and second outer portions. (B33) In the power converter denoted as (B32), the magnetic core may have a center portion, the first winding may be disposed between the first outer portion and the center portion, and the second winding may be disposed between the center portion and the second outer portion. (B34) In either of the power converters denoted as (B32) and (B33), the magnetic core may form first and second gaps in the first and second outer portions, respectively. (B35) In the power converter denoted as (B34), the first and second gaps may have different respective thicknesses. (B36) In the power converter denoted as (B34), the first gap may have a first thickness, and the second gap may have a second thickness that is smaller than the first thickness. (B37) In any of the power converters denoted as (B30) through (B36), the first winding may have a first width, and the second winding may have a second width that is different from the first width. (B38) In any of the power converters denoted as (B30) through (B36), the first winding may have first width, and the second winding may have a second width that is smaller than the first width. (B39) In the power converter denoted as (B30), the first winding may form a first number of turns, and the second winding may form a second number of turns that is different from the first number of turns. (B40) In the power converter denoted as (B30), the first winding may form a first number of turns, and the second winding may form a second number of turns that is greater than the first number of turns. (B41) In either of the power converters denoted as (B39) or (B40), the first may winding may enclose a first area, and the second winding may enclose a second area having a different size than the first area. (B42) In either of the power converters denoted as (B39) or (B40), the first winding may enclose a first area, and the second winding may enclose a second area that is smaller than the first area. (B43) In any of the power converters denoted as (B39) through (B42), the magnetic core may be a monolithic magnetic core, and the first and second windings may be embedded in the monolithic magnetic core. (B44) In the power converter denoted as (B29), the common magnetic device may include a magnetic core, a first single-turn winding, and at least two second single-turn windings. (B45) In the power converter denoted as (B44), the magnetic core may include first and second magnetic elements, where the first single-turn winding is wound around the first magnetic element, and each second single-turn winding is wound around the second magnetic element. (B46) In the power converter denoted as (B45), the magnetic core may further include a top magnetic element disposed over the first and second magnetic elements. (B47) In the power converter denoted as (B46): (1) the first single-turn winding, the first magnetic element, and the top magnetic element may collectively form the first inductor, (2) the second single-turn windings may be electrically coupled in series, and (3) the second single-turn windings, the second magnetic element, and the top magnetic element may collectively form the second inductor. (B48) In either of the power converters denoted as (B46) or (B47), the top magnetic element may be separated from the first magnetic element by a first gap, and the top magnetic element may be separated from the second magnetic element by a second gap, where the first gap has a thickness that is different from that of the second gap. (B49) In either of the power converters denoted as (B46) or (B47), the top magnetic element may be separated from the first magnetic element by a first gap, and the top magnetic element may be separated from the second magnetic element by a second gap, where the first gap has a thickness that is greater than that of the second gap. (B50) In any of the power converters denoted as (B45) through (B49), the first magnetic element may have a first cross-sectional area, the second magnetic element may have a second cross-sectional area, and the first cross-sectional area may be larger than the second cross-sectional area. (B51) In the power converter denoted as (B44), the magnetic core may include first and second magnetic elements, and each of the first and second single-turn windings may be wound around the first magnetic element. (B52) In the power converter denoted as (B51): (1) the first single-turn winding, the first magnetic element, and the second magnetic element may collectively form the first inductor, (2) the second single-turn windings may be electrically coupled in series, and (3) the second single-turn windings, the first magnetic element, and second magnetic element may collectively form the second inductor. (B53) In either of the power converters denoted as (B51) or (B52): (1) the magnetic core may include opposing first and second outer portions and a middle portion between the outer portions, (2) the first single-turn winding may be disposed between the first outer portion and the center portion, and (3) the second single-turn winding may be disposed between the center portion and the second outer portion. (B54) In the power converter denoted as (B53): (1) the first magnetic element may be separated from the second magnetic element by a first gap in the first outer portion of the magnetic core, (2) the first magnetic element may be separated from the second magnetic element by a second gap in the second outer portion of the magnetic core, (3) the first and second gaps may have first and second thicknesses, respectively, and (4) the first thickness may be different from the second thickness. (B55) In the power converter denoted as (B54), the first thickness may be larger than the second thickness. (B56) In the power converter denoted as (B29), the first and second inductors may be part of a common coupled inductor. (B57) In the power converter denoted as (B56): the second control switching device may include a control transistor; the second freewheeling device may include a freewheeling transistor; and the power converter may further include (1) a first additional transistor electrically coupled in series with the control transistor, the first additional transistor adapted to prevent a body diode of the control transistor from conducting current in the first operating mode of the power converter, and (2) a second additional transistor electrically coupled in series with the freewheeling transistor, the second additional transistor adapted to prevent a body diode of the freewheeling transistor from conducting current in the first operating mode of the power converter. (B58) In the power converter denoted as (B57), the first and second additional transistors may be further adapted to continuously operate in their conductive states in the second operating mode of the power converter. (B59) In either of the power converters denoted as (B57) or (B58), the first and second additional transistors may be further adapted to continuously operate in their non-conductive states in the first operating mode of the power converter. (B60) In any of the power converters denoted as (B56) through (B59), the common coupled inductor may include first and second magnetic elements, and at least two windings wound around the first magnetic element. (B61) In the power converter denoted as (B60), the first inductor may include at least two single-turn windings electrically coupled in parallel and wound around the first magnetic element. (B62) In either of the power converters denoted as (B60) or (B61), the second inductor may include at least two single-turn windings electrically coupled in series and wound around the first magnetic element. (B63) In any of the power converters denoted as (B1) through (B27), the first and second inductors may be part of a common magnetic device denoted as any one of (E1) through (E12) below, where: (1) the one or more first windings and the magnetic core collectively form the first inductor, and (2) the one or more second windings and the magnetic core collectively form the second inductor (B64) In any of the power converters denoted as (B1) through (B27), the first and second inductors may be part of a common magnetic device denoted as any one of (F1) through (F4) below, where: (1) the plurality of first windings and the magnetic core collectively form the first inductor, and (2) the second winding and the magnetic core collectively form the second inductor. (B65) In any of the power converters denoted as (B1) through (B27), the first and second inductors may be part of a common magnetic device denoted as any one of (G1) through (G7) below, where: (1) the one or more first windings and the magnetic core collectively form the first inductor, and (2) the one or more second windings and the magnetic core collectively form the second inductor. (C1) A power converter may include N first inductors, M second inductors, N first control switching devices, N first freewheeling devices, M second control switching devices, and M second freewheeling devices. N may be an integer greater than one, and M may be an integer greater than or equal to one and less than or equal to N. Each of the N first control switching devices may be electrically coupled between a first power node and a respective one of the N first inductors, and each of the M second control switching devices may be electrically coupled between the first power node and a respective one of the M second inductors. Each of the N first control switching devices may be adapted to: (1) repeatedly switch between its conductive and non-conductive states in a first operating mode of the power converter, and (2) operate in its non-conductive state in a second operating mode of the power converter. Each of the M second control switching devices may be adapted to: (1) operate in its non-conductive state in the first operating mode of the power converter, and (2) repeatedly switch between its conductive and non-conductive states in the second operating mode of the power converter. Each of the N first freewheeling devices may be adapted to provide a path for current flowing through a respective one of the N first inductors when the first control switching device electrically coupled to the first inductor is in its non-conductive state, in the first operating mode of the power converter. Each of the M second freewheeling devices may be adapted to provide a path for current flowing through a respective one of the M second inductors when the second control switching device electrically coupled to the second inductor is in its non-conductive state. (C2) In the power converter denoted as (C1), at least two of the N first inductors may be part of a common coupled inductor. (C3) In either of the power converters denoted as (C1) or (C2), each of the M second inductors may be electrically coupled in series with a respective one of the N first inductors, and each of the M second freewheeling devices may be adapted to provide a path for current flowing through both a respective one of the N first inductors and a respective one of the M second inductors when the second control switching device electrically coupled to the second inductor is in its non-conductive state. (C4) In any of the power converters denoted as (C1) through (C3), each of the N first inductors may be electrically coupled between an output power node and a respective one of the N first control switching devices, and the power converter may further include a capacitor electrically coupled to the output power node. (C5) In the power converter denoted as (C4), the N first control switching devices, the N first inductors, the N first freewheeling devices, and the capacitor may collectively form at least part of N first buck sub-converters. (C6) In the power converter denoted as (C5), at least one of the N first buck sub-converters may be operable to operate in a discontinuous conduction mode during at least one of the first and second operating modes of the power converter. (C7) In any of the power converters denoted as (C4) through (C6), the M second control switching devices, the M second freewheeling devices, and the M second inductors may collectively form part of M second buck sub-converters. (C8) In the power converter denoted as (C7), at least one of the M second buck sub-converters may be operable to operate in a discontinuous conduction mode during the second operating mode of the power converter. (C9) Any of the power converters denoted as (C1) through (C8) may further include a master controller for at least partially controlling at least the N first control switching devices. (C10) In the power converter denoted as (C9), the master controller may include the M second control switching devices. (C11) Either of the power converters denoted as (C9) or (C10) may further include at least one slave integrated circuit, separate from the master controller, including the N first control switching devices. (C12) In any of the power converters denoted as (C1) through (C11), the first power node may be selected from the group consisting of an input power node and a common power node. (C13) In the power converter denoted as (C12), the common power node may be a ground node. (C14) In any of the power converters denoted as (C1) through (C13), each of the N first control switching devices may include a first transistor, and each of the M second control switching devices may include a second transistor. (C15) In any of the power converters denoted as (C1) through (C14), the first operating mode may correspond to a moderate or heavy load operating condition of the power converter, and the second operating mode may correspond to a light load operating condition of the power converter. (C16) In any of the power converters denoted as (C1) through (C15), each of the N first freewheeling devices may include a first freewheeling switching device electrically coupled between a respective one of the N first inductors and a second power node, each of the M second freewheeling devices may include a second freewheeling switching device electrically coupled between a respective one of the M second inductors and the second power node, and the second power node may be selected from the group consisting of a common power node and an output power node. (C17) In any of the power converters denoted as (C1) through (C15), each of the N first freewheeling devices may include a first freewheeling diode electrically coupled between a second power node and a respective one of the N first inductors, each of the M second freewheeling devices may include a second freewheeling diode electrically coupled between the second power node and a respective one of the M second inductors, and the second power node may be selected from the group consisting of a common power node and an output power node. (C18) In any of the power converters denoted as (C1) through (C17), at least one of the N first inductors and at least one of the M second inductors may be part of a common coupled inductor. (C19) In the power converter denoted as (C18): each of the M second control switching devices may include a control transistor; each of the M second freewheeling devices may include a freewheeling transistor; and the power converter may further include (1) M first additional transistors, where each of the M first additional transistors is electrically coupled in series with a respective control transistor and adapted to prevent a body diode of the control transistor from conducting current in the first operating mode of the power converter, and (2) M second additional transistors, where each of the M second additional transistors is electrically coupled in series with a respective freewheeling transistor and adapted to prevent a body diode of the freewheeling transistor from conducting current in the first operating mode of the power converter. (C20) In the power converter denoted as (C19), each of the M first and second additional transistors may be further adapted to continuously operate in its conductive state in the second operating mode of the power converter. (C21) In either of the power converters denoted as (C19) or (C20), each of the M first and second additional transistors may be further adapted to continuously operate in its non-conductive state in the first operating mode of the power converter. (D1) A method for transferring power from an input power port to an output power port using a first and a second switching sub-converter may include the following steps: (1) in a first operating mode, operating the first switching sub-converter to transfer power from the input power port to the output power port, while operating the second switching sub-converter in an inactive mode; and (2) in a second operating mode, operating the second switching sub-converter to transfer power from the input power port to the output power port, while operating the first switching sub-converter in an inactive mode. (D2) In the method denoted as (D1): (1) the step of operating the first switching sub-converter to transfer power from the input power port to the output power port may include causing a first control switching device electrically coupled between a power node and a first inductor to repeatedly switch between its conductive and non-conductive states; and (2) the step of operating the first switching sub-converter in an inactive mode may include causing the first control switching device to remain in its non-conductive state. (D3) In the method denoted as (D2): (1) the step of operating the second switching sub-converter to transfer power from the input power port to the output power port may include causing a second control switching device electrically coupled between the power node and a second inductor to repeatedly switch between its conductive and non-conductive states; and (2) the step of operating the second switching sub-converter in an inactive mode may include causing the second control switching device to remain in its non-conductive state. (D4) In the method denoted as (D1), the step of operating the second switching sub-converter to transfer power from the input power port to the output power port may include using energy storage inductance of the first switching sub-converter and energy storage inductance of the second switching sub-converter to transfer power from the input power port to the output power port. (D5) Any of the methods denoted as (D1) through (D4) may further include powering an information technology device processor from the output power port. (D6) Any of the methods denoted as (D1) through (D5) may further include switching between the first and second operating modes in response to a signal provided by, or associated with, the processor. (D7) In the method denoted as (D6), the signal may be a processor sleep signal. (D8) In any of the methods denoted as (D1) through (D7), the first operating mode may correspond to a moderate or heavy load operating condition, and the second operating mode may correspond to a light load operating condition. (E1) A magnetic device may include: (1) a magnetic core, (2) one or more first windings wound around at least a portion of the magnetic core, each of the one or more first windings forming a respective first turn around a respective first winding center axis, and (3) one or more second windings wound around at least a portion of the magnetic core, each of the one or more second windings forming a respective second turn around a common second winding center axis that is orthogonal to each first winding center axis. (E2) In the magnetic device denoted as (E1), at least one first winding and at least one second winding may be wound around a common portion of the magnetic core. (E3) In either of the magnetic devices denoted as (E1) or (E2), the one or more second windings may at least partially enclose the one or more first windings. (E4) In any of the magnetic devices denoted as (E1) through (E3), the one or more first windings may include a plurality of first windings separated from each other along a width of the magnetic device. (E5) In any of the magnetic devices denoted as (E1) through (E3), the one or more first windings may extend though the magnetic core, and the one or more second windings may be wrapped around top and side outer surfaces of the magnetic core. (E6) The magnetic device denoted as (E5) may further include a top magnetic plate disposed on the magnetic core, such that portions of the one or more second windings are sandwiched between the top outer surface of the magnetic core and the top magnetic plate. (E7) The magnetic device denoted as (E5) may further include first and second side magnetic plates respectively disposed on opposing first and second side outer surfaces of the magnetic core, such that: (1) first portions of the one or more second windings are sandwiched between the first side outer surface of the magnetic core and the first side magnetic plate; and (2) second portions of the one or more second windings are sandwiched between the second side outer surface of the magnetic core and the second side magnetic plate. (E8) In any of the magnetic devices denoted as (E1) through (E3): (1) the magnetic device may have depth and width, (2) each of the one or more first windings may extend through the magnetic core in the width direction, and (3) each of the one or more second windings may extend through the magnetic core in the depth direction. (E9) In any of the magnetic devices denoted as (E1) through (E3), the magnetic core may be a monolithic magnetic core, and each first turn and each second turn may be embedded in the monolithic magnetic core. (E10) In any of the magnetic devices denoted as (E1) through (E3): (1) the magnetic core may include first and second end magnetic elements and a plurality of rungs, each rung joining the first and second end magnetic elements, and (2) the one or more first windings may include a respective first winding wound around each of the plurality of rungs. (E11) In the magnetic device denoted as (E10), the one or more second windings may be wound around the first and second end magnetic elements. (E12) The magnetic device denoted as (E1l) may further include a top magnetic element disposed over at least a portion of the first end magnetic element and a least a portion of the second end magnetic element, where portions of the one or more second windings are sandwiched between the first and second end magnetic elements and the top magnetic element. (F1) A magnetic device may include: (1) a magnetic core, (2) a plurality of first windings forming respective first winding turns around respective portions of the magnetic core, and (3) a second winding forming a second winding turn around a portion of the magnetic core, where each of the plurality of first winding turns is within the second winding turn, as seen when the magnetic device is viewed cross-sectionally in a first direction. (F2) In the magnetic device denoted as (F1): (1) each first winding turn may enclose a respective first area, as seen when the magnetic device is viewed cross-sectionally in the first direction, (2) each first area may be non-overlapping with other first area, as seen when the magnetic device is viewed cross-sectionally in the first direction, (3) the second winding turn may enclose a second area, as seen when the magnetic device is viewed cross-sectionally in the first direction; and (4) the second area may overlap each first area. (F3) In either of the magnetic devices denoted as (F1) or (F2): (1) the magnetic core may include first and second end magnetic elements and a plurality of rungs, each rung joining the first and second end magnetic elements; (2) each first winding turn may be wound around a respective one of the plurality of rungs, and (3) the second winding turn may be wound around all of the plurality of rungs. (F4) In either of the magnetic devices denoted as (F1) or (F2), the magnetic core may be a monolithic magnetic core, and each first winding turn and each second winding turn may be embedded in the monolithic magnetic core. (G1) A magnetic device may include: (1) a magnetic core, (2) one or more first windings wound around respective portions of the magnetic core, and (3) one or more second windings wound around respective portions of the magnetic core, where the one or more first windings are magnetically isolated from the one or more second windings. (G2) In the magnetic device denoted as (G1): (1) the magnetic core may include first, second, and third magnetic elements, where the third magnetic element is disposed on both of the first and second magnetic elements in a first direction, (2) the one or more first windings may be wound around the first magnetic element, (3) the one or more second windings may be wound around the second magnetic element, and (4) the first and second magnetic elements may be at least partially separated from each other in a second direction by a material having a lower magnetic permeability than material forming the first, second, and third magnetic elements, where the second direction is orthogonal to the first direction. (G3) In magnetic device denoted as (G1): (1) the magnetic core may include a first rail, a second rail, a third rail, a plurality of rungs, and a center post, (2) each of the plurality of rungs may join the first and second rails in a first direction, (3) the center post may join the first and third rails in the first direction, (4) each of the one or more first windings may be wound around a respective one of the plurality of rungs, (5) the one or more second windings may be wound around the center post, and (6) the second and third rails may be separated from each other in a second direction by a material having a lower magnetic permeability than material forming the first, second, and third rails, the second direction being orthogonal to the first direction. (G4) In magnetic device denoted as (G1): (1) the magnetic core may be a monolithic magnetic core, (2) the one or more first windings may be embedded in a first portion of the monolithic magnetic core, (3) the one or more second windings may be embedded in a second portion of the monolithic magnetic core, and the magnetic device may further include one or more non-magnetic structures embedded in the monolithic magnetic core and separating the first portion of the monolithic magnetic core from the second portion of the monolithic magnetic core. (G5) In magnetic device denoted as (G1): (1) the magnetic core may include opposing first and second outer portions and a middle portion between the outer portions, (2) the one or more first windings may be disposed between first outer portion and the center portion, (3) the one or more second windings may be disposed between the center portion and the second outer portion, (4) the magnetic core may form a first gap in the first outer portion, and (5) the magnetic core may form a second gap in second outer portion. (G6) In magnetic device denoted as (G5), a thickness of the first gap may be greater than a thickness of the second gap. (G7) In magnetic device denoted as (G1): (1) the magnetic core may be a monolithic magnetic core, (2) the one or more first windings may include a first winding embedded in the monolithic magnetic core, where the first winding encloses a first area as seen when the magnetic device is viewed cross-sectionally in a first direction, (3) the one or more second windings may include a second winding embedded in the monolithic magnetic core, where the second winding encloses a second area as seen when the magnetic device is viewed cross-sectionally in the first direction, and (4) an area of the monolithic magnetic core outside of the first and second areas, as seen when the magnetic device is viewed cross-sectionally in the first direction, may be greater than a sum of the first and second areas. Changes may be made in the above methods and systems without departing from the scope hereof. For example, converter controllers can be modified such that converter first and second operating modes do not necessarily correspond to heavy and light load conditions, respectively. Therefore, the matter contained in the above description and shown in the accompanying drawings should be interpreted as illustrative and not in a limiting sense. The following claims are intended to cover generic and specific features described herein, as well as all statements of the scope of the present method and system, which, as a matter of language, might be said to fall therebetween. | 195,276 |
11862390 | DETAILED DESCRIPTION Examples of the disclosure relate to a charging apparatus101for inductively charging a separate, mobile apparatus201. The charging apparatus101comprises a flexible diaphragm103which is configured to generate an air flow to enable cooling of the mobile apparatus201during inductive charging. FIG.1shows a charging apparatus101according to examples of the disclosure. The example charging apparatus101comprises one or more charging coils103, one or more ferrite shields107and a flexible diaphragm105. It is to be appreciated that only components referred to in the following description are shown inFIG.1and that the charging apparatus101can comprise additional components that are not shown inFIG.1. The one or more charging coils103are configured to transfer power to a mobile apparatus. The one or more charging coils103enable inductive charging of a separate, mobile apparatus when the mobile apparatus is positioned close to the charging apparatus101. In some examples the charging coils103enable charging of the mobile apparatus by near-field inductive power transfer or any other suitable type of inductive charging method. When the mobile apparatus is being charged it is positioned adjacent to the charging apparatus101so that one or more corresponding charging coils within the mobile apparatus can receive power from the charging coils103in the charging apparatus101. In the example ofFIG.1the mobile apparatus can be positioned on, or adjacent to, a surface of the charging apparatus101. The one or more charging coils103can comprise any suitable electrically conductive material such as copper. The at least one ferrite shield107is provided between the one or more charging coils and the flexible diaphragm. In the example shown inFIG.1the at least one ferrite shield is provided underneath the one or more charging coils103. The ferrite shield107can be configured to protect electronic components in the charging apparatus101from the electromagnetic fields of the one or more charging coils103. The ferrite shield107can be configured to, at least partially, block a magnetic field generated by the one or more charging coils103from impinging circuitry within the charging apparatus101. the ferrite shield107can be configured to direct a magnetic field generated by the one or more charging coils103towards the mobile apparatus101. The ferrite shield107can comprise any suitable material with high magnetic permeability and low electrical conductivity. The charging apparatus101also comprises a flexible diaphragm105. The flexible diaphragm105is configured so that it can oscillate about an equilibrium position. The flexible diaphragm105is configured so that, when the charging apparatus101is in use, oscillation of the flexible diaphragm105directs air flow towards the mobile apparatus being charged. The flexible diaphragm105can comprise any suitable flexible and electrically insulating material. In some examples the flexible diaphragm105can comprise rubber or any other suitable material. In the example shown inFIG.1the one or more charging coils103are provided on the flexible diaphragm105. The ferrite shield107can also be provided on the flexible diaphragm105. The ferrite shield107is provided between the flexible diaphragm105and the one or more charging coils103. The charging coils103and ferrite shield107can be printed on the flexible diaphragm105using an electro deposition process or any other suitable process. In this example when the flexible diaphragm105is moving this will create an air flow towards the mobile apparatus to cause cooling of the mobile apparatus and will also cause movement of the charging coils103. The charging coils103will oscillate about a mean position during movement of the flexible diaphragm105so that the average power transmitted to the mobile apparatus over a period of time does not change. It is to be appreciated that in other examples the one or more charging coils103could be provided in other locations within the charging apparatus101. FIG.2illustrates a charging apparatus101being used to charge a separate mobile apparatus201. The mobile apparatus201could be a mobile telephone, a laptop, a smart watch or any other suitable electronic mobile apparatus201. The mobile apparatus201is portable so that it can be easily carried by a user. The mobile apparatus201is separate to the charging apparatus101in that it can function independently of the charging apparatus101. In the example shown inFIG.2the mobile apparatus201comprises one or more charging coils205. Only components of the mobile apparatus201that are referred to in the following description are shown inFIG.2. It is to be appreciated that the mobile apparatus201could comprise additional components that are not shown inFIG.2. For instance, the mobile apparatus201could comprise components such as, batteries, control circuitry, user interfaces and transceiver circuitry or any other suitable components. The charging coil205of the mobile apparatus201is provided close to a surface of the mobile apparatus201so as to enable inductive charging of a battery of the mobile apparatus201when the mobile apparatus201is positioned close to the charging apparatus101as shown inFIG.2. In the example ofFIG.2the mobile apparatus201is positioned adjacent to the charging apparatus101so that power can be transferred from the charging coils103of the charging apparatus101to the corresponding charging coils205and circuitry within the mobile apparatus201. The charging apparatus101comprises charging coils103, a flexible diaphragm105and a ferrite shield107which can be as shown inFIG.1and described above. The charging apparatus101also comprises circuitry203. The circuitry203can comprise electronic components such as a controller comprising a processor and memory. The controller can enable control of the charging apparatus101. The controller can control power provided to the charging coils103. In some examples the controller can enable actuation of the flexible diaphragm105. For example, the controller can control when the flexible diaphragm105is moved. The controller can be configured to control the frequency with which the flexible diaphragm105is actuated. In the example ofFIG.2the circuitry203is provided underneath the flexible diaphragm105. The circuitry203is provided on an opposite side of the flexible diaphragm105to the charging coils103The ferrite shield107is provided between the charging coils103and the circuitry203so as to protect the circuitry203from electromagnetic fields of the charging coils103. The charging apparatus101also comprises vents207,209configured to enable air flow towards the mobile apparatus201. In the example ofFIG.2a first set of vents209are provided in the side of the charging apparatus101, these enable air to be drawn into the charging apparatus101. A second vent207is provided in an upper surface of the charging apparatus101. The second vent207is positioned within the charging apparatus101so that when the charging apparatus101is in use the second vent207is positioned in proximity to the mobile apparatus201. The second vent207is configured to enable air to be directed out of the charging apparatus101and towards the mobile apparatus201. In the example shown inFIG.2the vents207,209are configured to direct air flow towards the mobile apparatus201. It is to be appreciated that in other examples vents could be provided to direct air flow in other directions. For example, one or more vents could be provided to enable air flow to be directed towards the circuitry203within the charging apparatus101. Such vents could be provided beneath the flexible diaphragm. This can enable the air flow generated by the flexible diaphragm105to be used to cool both the mobile apparatus101and the circuitry203within the charging apparatus101. FIG.3illustrates the flexible diaphragm105of the charging apparatus101being used to generate air flow to cool the separate mobile apparatus201. The flexible diaphragm105oscillates about an equilibrium position. This causes air to be drawn into the charging apparatus101through the first vent209and directed out of the charging apparatus101and towards the mobile apparatus201through the second vent207as indicated by the arrows301. This air flow enables cooling of the mobile apparatus201. In the example shown inFIG.3the flexible diaphragm105is oscillating in a first bending mode. In this first bending mode nodes303are only provided at the edge of the flexible diaphragm105. The maximum displacement of the flexible diaphragm105occurs at the centre of the flexible diaphragm105. In the example ofFIG.3the vents207of the charging apparatus101are arranged so that the location of the maximum displacement of the flexible diaphragm105is positioned underneath the first vent207. This enables the displacement of the flexible diaphragm105to force the air flow through the vent207and towards the mobile apparatus201. In the example ofFIG.3the charging coils103are mounted on the flexible diaphragm105so that the oscillation of the flexible diaphragm105also causes movement of the charging coils103. This can cause the power transferred from the charging coils103to the mobile apparatus201to fluctuate over time. FIG.4illustrates the flexible diaphragm105of the charging apparatus101being used in a higher bending mode to generate air flow to cool the separate mobile apparatus201. In this higher bending mode first nodes303are provided at the edge of the flexible diaphragm105and second nodes401are provided at positions along the length of the flexible diaphragm105. In the example ofFIG.4the second nodes401are provided at about a quarter of the way along the length of the flexible diaphragm105from the edge of the charging apparatus101. In the example ofFIG.4the charging coils103are mounted on the flexible diaphragm105in the position of the second nodes401or close to the position of the second nodes401. This reduces the movement of the charging coils103and so reduces fluctuations in the power transferred to the mobile apparatus201. It is to be appreciated that other modes of oscillation of the flexible diaphragm105can be used in other examples of the disclosure. In some examples the charging coils103can be positioned on the flexible diaphragm105so as to enable control of the bending modes of the flexible diaphragm105. This can help to ensure that the displacement of the flexible diaphragm105is sufficient to provide a flow of cooling air towards the mobile apparatus201. FIGS.5A to5Dshow another example charging apparatus101being used to charge a mobile apparatus201according to examples of the disclosure. FIG.5Ashows a charging apparatus101and corresponding mobile apparatus201. The example charging apparatus101comprises one or more charging coils103, a flexible diaphragm105and a ferrite shield107which can be as described above. In the example ofFIG.5Athe charging apparatus301also comprises actuating circuitry501. The actuating circuitry501is configured to actuate movement of the flexible diaphragm105. In the example ofFIG.5Athe actuating circuitry501comprises one or more actuating coils503and one or more magnetic portions505. The one or more actuating coils503are provided underneath the flexible diaphragm105so that when the charging apparatus101is in use the flexible diaphragm105and charging coils103are positioned between the actuating coils503and the mobile apparatus201. The one or more magnetic portions505are positioned relative to the actuating coils503so that when a current is provided to the actuating coils503this generates a varying magnetic field that interacts with the magnetic portions505so as to cause movement of the magnetic portions505. In the example ofFIG.5Athe magnetic portions505are provided on the flexible diaphragm105so that movement of the magnetic portions505causes movement of the flexible diaphragm105. In the example ofFIG.5Athe ferrite shield107is provided between the magnetic portions505and the one or more charging coils103. This prevents the magnetic fields from the actuating coils503from interacting with the one or more charging coils103. In the example shown onFIG.5Athe flexible diaphragm105is in the equilibrium position. In this example the flexible diaphragm105is not moving so there is no air flow being directed towards the mobile apparatus201. In the example shown inFIG.5Athe charging apparatus101is in use so that power is being transferred from the one or more charging coils103in the charging apparatus101to the corresponding charging coils205in the mobile apparatus201as indicated by the arrow507. The charging coils103of the charging apparatus101and the charging coils205of the mobile apparatus201can also be configured to enable transfer of data511between the mobile apparatus201and the charging apparatus101. In the example shown inFIG.5Adata511is transferred from the mobile apparatus201to the charging apparatus101as indicated by the arrow509. In some examples the data511can be transferred from the mobile apparatus201to the charging apparatus101via backscattering or any other suitable process. The data511transferred from the mobile apparatus201to the charging apparatus101can comprise any data511that can be used to help control the charging apparatus101. In some examples the data511that is transferred can comprise data511relating to the temperature of the mobile apparatus201or the temperature of one or more components of the mobile apparatus201. This temperature information can then be used by the charging apparatus101to determine the level of cooling required by the mobile apparatus201. This temperature information can then be used to determine whether or not to actuate the flexible diaphragm105. In some examples the temperature information can be used to determine an actuation sequence for the flexible diaphragm105. The actuation sequence can comprise the frequency and duration of movements of the flexible diaphragm105. It is to be appreciated that other information can also be transmitted between the mobile apparatus201and the charging apparatus101. For example, the mobile apparatus201can provide information about charging rates and levels which can indicate how effectively power is being transferred from the charging apparatus101to the mobile apparatus201. FIG.5Bshows the functions of the charging coils103of the charging apparatus101over a period of time. During a first period of time521the charging coils103are transmitting power to the charging coils205of the mobile apparatus201. During a second period of time523the charging coils103are receiving data511from the charging coils205of the mobile apparatus201. The data511can comprise data relating to the temperature of the mobile apparatus201or any other suitable data. During a third period of time525the charging coils103return to the function of transmitting power to the charging coils205of the mobile apparatus201. It is to be appreciated that the functions of transmitting power and receiving data511can be repeated as many times as is necessary. FIG.5Cshows the charging apparatus101being used to cool mobile apparatus201. In this example an input signal has been provided to the actuator coils503. The input signal can be provided in response to the data511received from the mobile apparatus201. For example, the data511received from the mobile apparatus201can indicate that the temperature of the mobile apparatus201, or components within the mobile apparatus201, has exceeded a threshold and that cooling of the mobile apparatus201is required. In this example the input signal comprises a short pulse of current that is provided to the actuator coils503. This pulse of current through the actuator coil503causes a varying magnetic field which causes movement of the magnetic portions505. As the magnetic portions505are coupled to the flexible diaphragm105the movement of the magnetic portions505causes movement of the flexible diaphragm105. The movement of the diaphragm105causes the movement of the air as shown by the arrows301inFIG.5C. The air flow enables cooling of the mobile apparatus201. FIG.5Dshows the functions of the charging coils103of the charging apparatus101over a period of time during which the charging apparatus101provides cooling air flow for the mobile apparatus201. During a first period of time531the charging coils103are transmitting power to the charging coils205of the mobile apparatus201. During a second period of time533the actuating coils503receive an input signal. The input signal causes a varying magnetic field that causes movement of the magnetic portions505and the flexible diaphragm105. The movement of the flexible diaphragm105also causes movement of the charging coils103which therefore changes the power transferred to the mobile apparatus201. During a third period of time535the flexible diaphragm105returns to the stationary equilibrium position and the charging coils103continue transmitting power to the charging coils205of the mobile apparatus201. During a fourth period of time537the charging coils103are receiving data511from the charging coils205of the mobile apparatus201. The data511can comprise data relating to the temperature of the mobile apparatus201or any other suitable data511. Following the data511being received from the mobile apparatus201the charging coils103return to the charging mode and repeat the sequence shown in the first three periods of time531,533,535. It is to be appreciated that the functions of transmitting power, moving the flexible diaphragm105and receiving data511can be repeated as many times as is necessary. FIGS.6A to6Cshow another example charging apparatus101being used to charge a mobile apparatus201according to examples of the disclosure. FIG.6Ashows a charging apparatus101and corresponding mobile apparatus201. The example charging apparatus101comprises one or more charging coils103, a flexible diaphragm105and a ferrite shield107which can be as described above. The example charging apparatus101also comprises actuating circuitry501configured to actuate movement of the flexible diaphragm105. The actuating circuitry501can be as shown inFIG.5Aand described above. Other types of actuating circuitry501can be provided in other examples of the disclosure. In the example ofFIG.6Athe flexible diaphragm105resonates in a first bending mode with a node303at the edge of the flexible diaphragm105and a region of maximum displacement601in the centre of the flexible diaphragm105. The region of maximum displacement601of the diaphragm105is positioned underneath the vent209that directs air towards the mobile apparatus201. This enables movement of the flexible diaphragm105to force the air flow through the vent209towards the mobile apparatus201. FIGS.6B and6Cshow the displacement of the centre of the flexible diaphragm105and the timing of the input signals to the actuating circuitry501. FIG.6Bshows that an interval is provided between the input signals to the actuating circuitry501. The interval between consecutive input signals is long enough that the flexible diaphragm105returns to its equilibrium position and is stationary between consecutive input signals. InFIG.6Cthe interval between the input signals is decreased so that the flexible diaphragm105does not return to stationary between consecutive input signals. As shown inFIG.6Cthere is some damping of the oscillations over time, however the next input signal is provided before the flexible diaphragm105returns to stationary. The frequency of the input signals can be determined by the data that is received from the mobile apparatus201. The frequency of the input signals can be determined by the temperature of the mobile apparatus201or any other suitable factor. FIGS.7A to7Bshow another example charging apparatus101according to examples of the disclosure. In the example ofFIGS.7A and7Bat least part of the actuating circuitry501is provided on the flexible diaphragm105. In the example ofFIGS.7A and7Bthe actuating coils503are provided on the flexible diaphragm105. The charging coils103, ferrite shield107and magnetic portions505are all provided on a fixed portion of the charging apparatus101. In the example shown inFIGS.7A and7Bthe charging coils103are provided on the surface of the charging apparatus101while the ferrite shield107and magnetic portions505are provided underneath the charging coils103. It is to be appreciated that other configurations of the actuating circuitry501and the charging coils103could be used in other examples of the disclosure. In this example when an input signal is provided to the actuating coils503the force generated by the magnetic portions505in the varying magnetic field causes movement of the actuating coils503and thereby causes the displacement of the flexible diaphragm105. This therefore causes an air flow as shown by the arrows301. FIG.7Bshows the flexible diaphragm105oscillating in a first bending mode. In this first bending mode nodes303are provided at the edge of the flexible diaphragm105while the region of maximum displacement601is provided towards the centre of the flexible diaphragm105. It is to be appreciated that other bending modes could be used in other examples of the disclosure. The actuating coils503can be positioned to control the bending modes of the flexible diaphragm105. Examples of the disclosure therefore provide a charging apparatus101that enables cooling of the mobile apparatus201during charging. This helps to prevent overheating of the mobile apparatus201. As the charging coils103or the actuating circuitry503can be provided on the flexible diaphragm105this enables the cooling to be provided with few additional components being added to the charging apparatus101. In this description the term coupled means operationally coupled. Any number or combination of intervening elements can exist between coupled components including no intervening elements. The term “comprise” is used in this document with an inclusive not an exclusive meaning. That is any reference to X comprising Y indicates that X may comprise only one Y or may comprise more than one Y. If it is intended to use “comprise” with an exclusive meaning then it will be made clear in the context by referring to “comprising only one . . . ” or by using “consisting”. In this description, reference has been made to various examples. The description of features or functions in relation to an example indicates that those features or functions are present in that example. The use of the term ‘example’ or ‘for example’ or ‘can’ or ‘may’ in the text denotes, whether explicitly stated or not, that such features or functions are present in at least the described example, whether described as an example or not, and that they can be, but are not necessarily, present in some of or all other examples. Thus ‘example’, ‘for example’, ‘can’ or ‘may’ refers to a particular instance in a class of examples. A property of the instance can be a property of only that instance or a property of the class or a property of a sub-class of the class that includes some but not all of the instances in the class. It is therefore implicitly disclosed that a feature described with reference to one example but not with reference to another example, can where possible be used in that other example as part of a working combination but does not necessarily have to be used in that other example. Although examples have been described in the preceding paragraphs with reference to various examples, it should be appreciated that modifications to the examples given can be made without departing from the scope of the claims. Features described in the preceding description may be used in combinations other than the combinations explicitly described above. Although functions have been described with reference to certain features, those functions may be performable by other features whether described or not. Although features have been described with reference to certain examples, those features may also be present in other examples whether described or not. The term ‘a’ or ‘the’ is used in this document with an inclusive not an exclusive meaning. That is any reference to X comprising a/the Y indicates that X may comprise only one Y or may comprise more than one Y unless the context clearly indicates the contrary. If it is intended to use ‘a’ or ‘the’ with an exclusive meaning then it will be made clear in the context. In some circumstances the use of ‘at least one’ or ‘one or more’ may be used to emphasis an inclusive meaning but the absence of these terms should not be taken to infer any exclusive meaning. The presence of a feature (or combination of features) in a claim is a reference to that feature or (combination of features) itself and also to features that achieve substantially the same technical effect (equivalent features). The equivalent features include, for example, features that are variants and achieve substantially the same result in substantially the same way. The equivalent features include, for example, features that perform substantially the same function, in substantially the same way to achieve substantially the same result. In this description, reference has been made to various examples using adjectives or adjectival phrases to describe characteristics of the examples. Such a description of a characteristic in relation to an example indicates that the characteristic is present in some examples exactly as described and is present in other examples substantially as described. Whilst endeavoring in the foregoing specification to draw attention to those features believed to be of importance it should be understood that the Applicant may seek protection via the claims in respect of any patentable feature or combination of features hereinbefore referred to and/or shown in the drawings whether or not emphasis has been placed thereon. | 25,962 |
11862391 | DETAILED DESCRIPTION OF THE EMBODIMENTS OF THE DISCLOSURE In the following description, the various embodiments of the present disclosure will be described with respect to the enclosed drawings. As required, detailed embodiments of the embodiments of the present disclosure are discussed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the embodiments of the disclosure that may be embodied in various and alternative forms. The figures are not necessarily to scale and some features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present disclosure. The particulars shown herein are by way of example and for purposes of illustrative discussion of the embodiments of the present disclosure only and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the present disclosure. In this regard, no attempt is made to show structural details of the present disclosure in more detail than is necessary for the fundamental understanding of the present disclosure, such that the description, taken with the drawings, making apparent to those skilled in the art how the forms of the present disclosure may be embodied in practice. As used herein, the singular forms “a,” “an,” and “the” include the plural reference unless the context clearly dictates otherwise. For example, reference to “a magnetic material” would also mean that mixtures of one or more magnetic materials can be present unless specifically excluded. Except where otherwise indicated, all numbers expressing quantities used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by embodiments of the present disclosure. At the very least, and not to be considered as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should be construed in light of the number of significant digits and ordinary rounding conventions. Additionally, the recitation of numerical ranges within this specification is considered to be a disclosure of all numerical values and ranges within that range (unless otherwise explicitly indicated). For example, if a range is from about 1 to about 50, it is deemed to include, for example, 1, 7, 34, 46.1, 23.7, or any other value or range within the range. As used herein, the indefinite article “a” indicates one as well as more than one and does not necessarily limit its referent noun to the singular. As used herein, the terms “about” and “approximately” indicate that the amount or value in question may be the specific value designated or some other value in its neighborhood. Generally, the terms “about” and “approximately denoting a certain value is intended to denote a range within ±5% of the value. As one example, the phrase “about 100” denotes a range of 100±5, i.e., the range from 95 to 105. Generally, when the terms “about” and “approximately are used, it can be expected that similar results or effects according to the disclosure can be obtained within a range of ±5% of the indicated value. As used herein, the term “and/or” indicates that either all or only one of the elements of said group may be present. For example, “A and/or B” shall mean “only A, or only B, or both A and B”. In the case of “only A”, the term also covers the possibility that B is absent, i.e., “only A, but not B”. The term “substantially parallel” refers to deviating less than 20° from parallel alignment and the term “substantially perpendicular” refers to deviating less than 20° from perpendicular alignment. The term “parallel” refers to deviating less than 5° from mathematically exact parallel alignment. Similarly, “perpendicular” refers to deviating less than 5° from mathematically exact perpendicular alignment. The term “at least partially” is intended to denote that the following property is fulfilled to a certain extent or completely. The terms “substantially” and “essentially” are used to denote that the following feature, property or parameter is either completely (entirely) realized or satisfied or to a major degree that does not adversely affect the intended result. The term “comprising” as used herein is intended to be non-exclusive and open-ended. Thus, for instance a coating composition comprising a compound A may include other compounds besides A. However, the term “comprising” also covers the more restrictive meanings of “consisting essentially of” and “consisting of”, so that for instance “a coating composition comprising a compound A” may also (essentially) consist of the compound A. The various embodiments disclosed herein can be used separately and in various combinations unless specifically stated to the contrary. FIG.1shows an exemplary magnet array structure (MAS) that includes a plurality of magnet arrays in accordance with aspects of the disclosure. The plurality of magnet arrays can include a first magnet array1and a second magnet array3. As shown inFIG.1, first magnet array1may include a first repeatable magnet arrangement2, and the second magnet array3comprises a second repeatable magnet arrangement4. First and second repeatable magnet arrangements2and4are shown here configured as a modified Halbach array. FIG.2shows a plurality of magnetic elements, which can be configured in repeatable magnet arrangements in accordance with aspects of the disclosure. Each magnetic element configuration (MEC) in the repeatable magnet arrangements is a customized magnet, characterized by certain dimensions and remnant magnetization strength. An arrow shown in each MEC depicts the direction of magnetic flux (or magnetization direction). For example, a first MEC11has an arrow pointing downwards (along the page), indicating a downwardly-directed magnetic flux. The plurality of magnetic elements inFIG.2includes first MEC11and a second MEC12. First MEC11has a first width90and a first height95and second MEC12has a width equal to (or approximately equal to) first width90and a height equal to (or approximately equal to) the first height95. However, while first MEC11has a downwardly-directed magnetic flux, second MEC12has an upwardly-directed magnetic flux. The plurality of magnetic elements further includes a third MEC13, a fourth MEC14, a fifth MEC15, a sixth MEC16, a seventh MEC17, an eighth MEC18, a ninth MEC19, and a tenth MEC20, each of which have a width equal to (or approximately equal to) a second width91and a height equal to (or approximately equal to) the first height95. In the illustrated arrangement of the plurality of magnetic elements, third MEC13has a left and downwardly-directed magnetic flux; fourth MEC14has a leftwardly-directed magnetic flux; fifth MEC15has a left and upwardly-directed magnetic flux; sixth MEC16has an upwardly-directed magnetic flux; seventh MEC17has a right and upwardly-directed magnetic flux; eighth MEC18has a rightwardly-directed magnetic flux; ninth MEC19has a right and downwardly-directed magnetic flux; and tenth MEC20has a downwardly-directed magnetic flux. Additionally, the plurality of magnetic elements can include an eleventh MEC21, a twelfth MEC22, a thirteenth MEC23, a fourteenth MEC24, a fifteenth MEC25, and a sixteenth MEC26, each of which have a width equal to (or approximately equal to) a third width92and a height equal to (or approximately equal to) the first height95. In the illustrated arrangement of the plurality of magnetic elements, eleventh MEC21has a right and downwardly-directed magnetic flux; twelfth MEC22has a downwardly-directed magnetic flux; thirteenth MEC23has a left and downwardly-directed magnetic flux; fourteenth MEC24has a left and upwardly-directed magnetic flux; fifteenth MEC25has an upwardly-directed magnetic flux; and sixteenth MEC26has a right and upwardly-directed magnetic flux. As is apparent fromFIG.2, while each MEC in this exemplary embodiment has a same or approximately same height95, first width90(of MECs11,12) is approximately three times as long as second width91(of MECs13-20), which is approximately three times as long as third width92(MECs21-26). It should be understood that the varying widths are exemplary, in that the first, second, and third widths90,91,92demonstrate that the plurality of magnetic elements can comprise MECs with varying widths and magnetic fluxes in order to achieve desired magnetic field strengths. Further, the individual MECs can be arranged adjacent each other via adhesive bonding or gluing and/or coupled together via arrangement in a housing or mechanically coupled via connectors. In embodiments, not all MECs depicted inFIG.2are used to create the MAS. Additionally, alternative magnetic arrays can be created by modifying embodiments of this disclosure to include additional MECs. FIG.3shows first repeatable magnet arrangement2and second repeatable magnet arrangement4in accordance with aspects of the disclosure. In this exemplary embodiment, first repeatable magnet arrangement2includes a first plurality of magnetic elements, such as a first MEC31, a second MEC32, a third MEC33, a fourth MEC34, a fifth MEC35, a sixth MEC36, a seventh MEC37, an eighth MEC38, a ninth MEC39, a tenth MEC40, an eleventh MEC41, a twelfth MEC42, a thirteenth MEC43, a fourteenth MEC44, a fifteenth MEC45, and a sixteenth MEC46. By way of non-limiting example, it is noted that, starting from MEC31, the magnetic flux of which is pointing downward, the magnetic flux of each successive MEC (moving to the right) is offset 45° from its adjacent MECs, such that the magnetic flux “rotates” counter-clockwise, consistent with an “M8 Halbach” magnetic array. Second repeatable magnet arrangement2in this exemplary embodiment includes a second plurality of magnetic elements, such as a seventeenth MEC47, an eighteenth MEC48, a nineteenth MEC49, a twentieth MEC50, a twenty-first MEC51, a twenty-second MEC52, a twenty-third MEC53, a twenty-fourth MEC54, a twenty-fifth MEC55, a twenty-sixth MEC56, a twenty-seventh MEC57, a twenty-eighth MEC58, a twenty-ninth MEC59, a thirtieth MEC60, a thirty-first MEC61, and a thirty-second MEC62. By way of non-limiting example, it is noted that, starting from MEC47, the magnetic flux of which is pointing downward, the magnetic flux of each successive MEC (moving to the right) is offset 45° from its adjacent MECs, such that the magnetic flux “rotates” clockwise, consistent with an “M8 Halbach” magnetic array. In the exemplary embodiment ofFIG.3, first and seventeenth MECs31,47generally correspond to the first MEC11depicted inFIG.2; second and thirty-second MECs32,62generally correspond to third MEC13inFIG.2; third, eleventh, twenty-third, and thirty-first MECs33,41,53,61generally correspond to fourth MEC14inFIG.2; fourth, twelfth, twenty-second, and thirtieth MECs34,42,52,60generally correspond to fifth MEC15inFIG.2; fifth, thirteenth, twenty-first, and twenty-ninth MECs35,43,51,59generally correspond to sixth MEC16inFIG.2; sixth, fourteenth, twentieth, and twenty-eighth MECs36,44,50,58generally correspond to seventh MEC17inFIG.2; seventh, fifteenth, nineteenth, and twenty-seventh MECs37,45,49,57generally correspond to eighth MEC18inFIG.2; eighth and twenty-sixth MECs38,56generally correspond to eleventh MEC21inFIG.2; ninth and twenty-fifth MECs39,55generally correspond to twelfth MEC22inFIG.2; tenth and twenty-fourth MECs40,54generally correspond to thirteenth MEC23inFIG.2; and sixteenth and eighteenth MEC46,48generally correspond to ninth MEC19inFIG.2. FIG.3further shows that first repeatable magnet arrangement2and the second repeatable magnet arrangement4have similar magnetic element configurations. However, to mitigate attractive forces between first magnet array1and second magnet array3, second repeatable magnet arrangement4can be longitudinally offset from first repeatable magnet arrangement2. In the exemplary embodiment, MEC47of second repeatable magnet arrangement4can be arranged opposite MECs37-41of first repeatable magnet arrangement3. FIG.4shows first and second magnet arrays1,3of the MAS. Moreover, a magnetic field7generated between the magnetic elements of the longitudinally offset first and second repeatable magnet arrangements2,4of first and second magnet arrays1,3is depicted. FIG.5shows a free-body diagram of the magnetic elements of first repeatable magnetic arrangement2in accordance with aspects of the disclosure. Second repeatable magnetic arrangement4, the constituent magnetic elements of which are not shown inFIG.5, is shown in its location offset, as inFIG.3, from first repeatable magnetic arrangement2. A direction of resulting magnetic forces acting on the magnetic elements of first repeatable magnet arrangement2is depicted in each magnetic element. This resulting magnetic force acting on the magnetic elements results from the offset arrangement of the first and second repeatable magnet arrangements2,3. A reference line101runs through and parallel to first repeatable magnet arrangement2. A magnetic force acts on each magnetic element of first repeatable magnet arrangement2. This magnetic force results from the proximately arranged magnetic elements within first repeatable magnet arrangement2and from the proximately arranged magnetic elements within oppositely arranged and offset second repeatable magnet arrangement4. Thus, it is understood that each magnetic force comprises a first force component in a direction parallel to reference line101and a second force component in a direction perpendicular to reference line101. A first magnetic force211is applied to first MEC31; a second magnetic force212is applied to second MEC32; a third magnetic force213is applied to third MEC33; a fourth magnetic force214is applied to fourth MEC34; a fifth magnetic force215is applied to fifth MEC35; a sixth magnetic force216is applied to sixth MEC36; a seventh magnetic force217is applied to seventh MEC37; an eighth magnetic force218is applied to eighth MEC38; a ninth magnetic force219is applied to ninth MEC39; a tenth magnetic force220is applied to tenth MEC40; an eleventh magnetic force221is applied to eleventh MEC41; a twelfth magnetic force222is applied to twelfth MEC42; a thirteenth magnetic force223is applied to thirteenth MEC43; a fourteenth magnetic force224is applied to fourteenth MEC44; a fifteenth magnetic force225is applied to fifteenth MEC45; a sixteenth magnetic force226is applied to sixteenth MEC46. For the force components parallel to reference line101, second magnetic force212cancels sixteenth magnetic force226, third magnetic force213cancels fifteenth magnetic force225, fourth magnetic force214cancels fourteenth magnetic force224, fifth magnetic force215cancels thirteenth magnetic force223, sixth magnetic force216cancels twelfth magnetic force222, seventh magnetic force217cancels eleventh magnetic force221, and eighth magnetic force218cancels tenth magnetic force220. Further, in the direction parallel to reference line101, first and ninth magnetic forces211,219are negligible. The result is no net magnetic forces on magnetic arrangement2parallel to reference line101, as they are locally canceled out. For the force components perpendicular to reference line101, the first, second, fourth, sixth, twelfth, fourteenth, and sixteenth magnetic forces211,212,214,216,222,224,226are negligible. Further, for the force components perpendicular to reference line101, third and fifteenth magnetic force213,225oppose the fifth and thirteenth magnetic forces215,223, and the seventh, eighth, tenth, and eleventh magnetic forces217,218,220,221oppose the ninth magnetic force219. The result is no net magnetic forces on magnetic arrangement2parallel to reference line101, as they are locally canceled out. In embodiments, the magnetic elements in first repeatable magnet arrangement2and second repeatable magnet arrangement4are formed together and are encased within a fixed magnet housing structure, such as an electric motor or custom designed rigid part. As shown inFIG.5, a large magnetic force (the ninth magnetic force219) is focused within ninth magnetic element39. The seventh, eighth, tenth, and eleventh magnetic forces217,218,220,221are arranged to oppose the ninth magnetic force219, which transfers an overall force applied to first repeatable magnet into multiple opposing shear forces that are applied to the first plurality of magnetic elements. Any residual magnetic force that is not locally cancelled out can be countered by the fixed magnet housing. Because first repeatable magnet arrangement2can be repeated within first magnet array1and second repeatable magnet arrangement4can be repeated within second magnet array2—and because first magnet array1and second magnet array2have a fixed orientation—the magnetic field7described inFIG.4and the plurality of magnetic forces demonstrated inFIG.5repeat throughout first magnet array1. Deviations in magnetic field7and the plurality of magnetic forces can arise due to irregularities in magnetic elements—such as width and strength—and due to being near the beginning or end of the MAS. Further, since first repeatable magnet arrangement2and second repeatable magnet arrangement4are similar, the magnitude of magnetic forces applied to second repeatable magnet arrangement4will be similar to the magnitude of magnetic forces applied to first repeatable magnet arrangement2. However, because the second plurality of magnetic elements in second repeatable magnet arrangement4have different orientations than the magnetic elements in first repeatable magnet arrangement2, the direction of magnetic forces applied to the second repeatable magnet arrangement4may differ. Despite the differing orientations of the magnetic forces applied to second repeatable magnet arrangement4, these magnetic forces will cancel out locally (similarly to the magnetic forces applied to first repeatable magnet arrangement2). One or more embodiments of the disclosure may be referred to herein, individually and/or collectively, by the term “invention” merely for convenience and without intending to voluntarily limit the scope of this application to any particular invention or inventive concept. Moreover, although specific embodiments have been illustrated and described herein, it should be appreciated that any subsequent arrangement designed to achieve the same or similar purpose may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all subsequent adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the description. The above disclosed subject matter is to be considered illustrative, and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments which fall within the true spirit and scope of the present disclosure. Thus, to the maximum extent allowed by law, the scope of the present disclosure is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description. Accordingly, the novel architecture is intended to embrace all such alterations, modifications and variations that fall within the spirit and scope of the appended claims. Furthermore, to the extent that the term “includes” is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term “comprising” as “comprising” is interpreted when employed as a transitional word in a claim. While the disclosure has been described with reference to specific embodiments, those skilled in the art will understand that various changes may be made and equivalents may be substituted for elements thereof without departing from the true spirit and scope of the disclosure. While exemplary embodiments are described above, it is not intended that these embodiments describe all possible forms of the embodiments of the disclosure. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the disclosure. In addition, modifications may be made without departing from the essential teachings of the disclosure. Furthermore, the features of various implementing embodiments may be combined to form further embodiments of the disclosure. While the specification describes particular embodiments of the present invention, those of ordinary skill can devise variations of the present invention without departing from the inventive concept. Insofar as the description above and the accompanying drawing disclose any additional subject matter that is not within the scope of the claims below, the embodiments are not dedicated to the public and the right to file one or more applications to claim such additional embodiments is reserved. | 21,592 |
11862392 | DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS The invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are illustrated. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure is thorough, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals in the drawings denote like elements. At least one embodiment of the present disclosure seeks to address the above issues and to provide a coil assembly for vehicle braking and a brake apparatus having the same that reduces the overall manufacturing process costs while the coil assembly for vehicle braking has a 3-axis degree of freedom. Some exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings. In the following description, like reference numerals preferably designate like elements, although the elements are illustrated in different drawings. Further, in the following description of some embodiments, a detailed description of known functions and configurations incorporated herein will be omitted for the purpose of clarity and for brevity. Additionally, alphanumeric code such as first, second, i), ii), (a), (b), etc., in numbering components are used solely for the purpose of differentiating one component from the other but not to imply or suggest the substances, the order or sequence of the components. Throughout this specification, when a part “includes” or “comprises” a component, the part is meant to further include other components, not excluding thereof unless there is an explicit description contrary thereto. Terms such as “upper,” “lower,” “top,” “bottom,” “side,” and so forth may be used for identification of certain sides of a given figure but are not meant to be limiting in that the device or apparatus must always be positioned in a given direction. For example, what is labeled “upper” in one figured may be a “lower” portion or a “side” portion in another figure or in use of the actual device of the device or apparatus. In addition, control of a braking pressure may be achieved by installing various solenoid valves on a hydraulic circuit formed between a wheel cylinder that holds and restrains a disk wheel and a master cylinder that generates hydraulic pressure. Herein, the control of the solenoid valves is performed by an ECU (Electronic Control Unit), and the braking pressure can be adjusted by performing control of the opening and closing of the solenoid valves by the ECU. The solenoid valves generally consist of a coil assembly and a valve assembly combined. FIG.1is an exploded perspective view of a coil assembly for vehicle braking. FIG.2is a cross-sectional view of a braking device including a coil assembly for vehicle braking taken along the Y axis. Referring toFIG.1, a coil assembly for vehicle braking10includes a bobbin100, a plurality of lead pins140, an upper case160, and a lower case180. A coil120is wound around the bobbin100to produce an electromagnetic field when current is applied to the coil120, and the lead pins140are for supplying current to the coil120. The upper case160and the lower case180protect the bobbin100, release heat generated from the coil120, and transmit an electromagnetic field produced in the coil to the valve assembly (200inFIG.2). Referring toFIG.2, a braking device including a coil assembly for vehicle braking10includes a valve assembly200capable of opening and closing an internal flow path by using an electromagnetic field produced in the coil120and a pump housing220which may contact the lower case180. Because current flows through the coil120, it is desired to dissipate heat generated from the coil120. Therefore, it is desirable to have a degree of freedom in the Z-axis direction so that the lower case180surrounding the outer circumferential surface of the coil120can be in close contact with the outer surface of the pump housing220. In addition, when the pump housing220and the ECU housing (not illustrated) are assembled, the height of the coil120may become different from that of a normal case due to variations between products. Because such a height tolerance of the coil120is the main cause of an ECU performance deviation and noise, it is desirable to minimize the tolerance. When the coil assembly for vehicle braking10has a degree of freedom in the Z-axis direction, the above tolerance can be compensated. Meanwhile, in order to prevent interference caused by assembling the coil assembly for vehicle braking10and the valve assembly200, it is desirable that the coil assembly for vehicle braking10be configured to have degrees of freedom in the X and Y axes. However, in case that the outer circumferential surface of the coil120is surrounded by the lower case180as with the coil assembly for vehicle braking10, this structure should be manufactured by using a deep drawing method. This increases the material cost and process cost for manufacturing the coil assembly for vehicle braking10. Therefore, it is desired to configure the coil assembly to have X-axis, Y-axis and Z-axis degrees of freedom without using such a deep drawing method. FIG.3is an exploded perspective view illustrating a coil assembly for vehicle braking according to an embodiment of the present disclosure. FIG.4is a front view illustrating a coil assembly for vehicle braking according to an embodiment of the present disclosure. FIG.5is a plane view illustrating a coil assembly for vehicle braking according to an embodiment of the present disclosure. FIG.6is a side view illustrating a coil assembly for vehicle braking according to an embodiment of the present disclosure. Referring toFIGS.3to6, the coil assembly30for vehicle braking according to at least one embodiment of the present disclosure includes all or part of a bobbin300, a case340, a plurality of lead pins360and a pin assembly unit380. The bobbin300is configured to allow a coil320to be wound along its outer circumferential surface. Because the bobbin300is of a hollow type, a bobbin central hole305is formed in a center of the bobbin. A valve assembly (not illustrated) may be assembled in the bobbin central hole305, and the valve assembly is configured to control the opening and closing of an oil flow path by using a magnetic field generated by a current flowing through the coil320. The bobbin300may be injection-molded using a plastic material, and at least one engagement protrusion302may be formed on an upper surface301and/or a lower surface303of the bobbin300. InFIG.3, it is illustrated that two engagement protrusions302are formed on the upper surface301of the bobbin300. The at least one engagement protrusion302, however, is not limited to the example configuration illustrated inFIG.3. Specifically, the at least one engagement protrusion302may also be formed on the lower surface303of the bobbin300, and the number of engagement protrusions302is not limited to two. The case340is configured to surround at least a portion of the bobbin300. The case340is formed to be bent in an upper portion341and a lower portion343thereof in a first direction to thereby be attached to the upper surface301and lower surface303of the bobbin300. Here, the first direction may mean, for example, the Y-axis direction inFIG.3. Accordingly, as illustrated inFIG.6, when viewed from the side, the case340may have a “C” shape. However, the direction in which the upper portion341and lower portion343of the case340are bent is not necessarily the Y-axis direction inFIG.3, and the bending direction may be changed depending on the position of the at least one coupling protrusion302and the position of the pin assembly unit380to be described later. Meanwhile, the valve assembly is assembled in the bobbin central hole305and configured to control the opening and closing of an oil flow path. Therefore the case central hole345may be formed at a position corresponding to the bobbin central hole305on the bent surface of the case340. Herein, it is desirable that the center of the case central hole345and that of the bobbin central hole305coincide with each other. The case340may include at least one engagement hole342to engage with the at least one engagement protrusion302. Here, the at least one engagement hole342may include one or multiple, and is desirably formed to correspond to the number and position of the at least one engagement protrusions302. As the at least one engagement protrusion302and the at least one engagement hole342are engaged, the case340is attached to the upper surface301and the lower surface303of the bobbin300and may be firmly engaged without an additional fixing component. As the case340is attached to and engaged to the bobbin300, heat generated from the coil320can be dissipated via the case340. In the manufacturing of a previous case, the case has a cylindrical shape in order to correspond to the shape of the bobbin300, and therefore a deep drawing method should be applied. In such a case, even after the application of the deep drawing method, additional processes such as a cleaning process for removing drawing oil and a zinc plating for improving erosion resistance are required, and therefore the overall process cost increases. However, in the coil assembly30according to an embodiment of the present disclosure, the case340surrounding the bobbin300need not be configured in a cylindrical shape that corresponds to the shape of the bobbin300. Therefore, there is no need to use a deep drawing method when manufacturing the case340, and it may be manufactured by using, for example, a pre-plated steel plate, thereby reducing the overall process cost. The lead pins360are coupled with the bobbin300to supply current to the coil320. The lead pins360may be include a plurality, for example, two. One end of the lead pins360may be connected to a printed circuit board (not illustrated), and the other end of the lead pins360may be connected to the coil320. In addition, for the sake of structural stability, it is desirable that the lead pins360are configured to be symmetrical to each other with respect to the first direction that passes along the center of the bobbin300. An upper surface301or a bottom surface303of the bobbin300may have multiple side ends on which to mount the pin assembly units380. The pin assembly units380may be formed at two side ends of the bobbin300and are configured to fix the lead pins360and connect the lead pins360to the coil320. The pin assembly units380may be configured in the plural, and the number of the pin assembly units380is preferably the same as the number of the lead pins360. In this case, the lead pins360may be fixed to the pin assembly units380and may be connected to the bobbin300and coil320by using the pin assembly units380. In addition, in order to fix the lead pins360, the pin assembly units380are configured to be engaged with the lead pins360by inserting the lead pins360into the pin assembly units380. Meanwhile, when the lead pins360are configured to be symmetrical to each other with respect to the first direction that passes along the center of the bobbin300, it is desirable that the pin assembly units380are also configured to be symmetrical to each other with respect to the first direction that passes along the center of the bobbin300. Herewith, when the pin assembly units380are formed on both side ends of the bobbin300, an interference may occur between the case340and the pin assembly units380in a process in which the bobbin300and the case340are engaged. Referring toFIG.5, for avoidance of the above interference, the case340may include a step difference500formed on both sides of the case340to narrow the width of the upper portion341or lower portion343to be engaged with the engagement protrusion302. Due to the step difference500in the case340, a sufficient space can be secured for the pin assembly units380. In addition, interference between the case340and the pin assembly units380may be prevented while the bobbin300and the case340are combined. Meanwhile, each of the lead pins360may include a fixing portion366, an elastic portion364, and a coil connecting portion362. The fixing portion366is formed to be elongated in a second direction and configured to be coupled with the printed circuit board. Here, the second direction refers to the Z-axis direction inFIG.3. The second direction is a height direction of the bobbin300, and the first direction and the second direction are perpendicular to each other. However, the second direction need not be configured in a direction perpendicular to the first direction. The fixing portion366includes a protruding portion368protruding from the fixing portion366. This is configured to prevent the fixing portion366from being separated from the printed circuit board if the fixing portion366is press-fitted or soldered to the printed circuit board. Meanwhile, referring toFIGS.3to6, the protruding portion368is illustrated to be formed at a point corresponding to approximately a middle of the fixing portion366. As long as the protruding portion368protrudes from the fixing portion366, however, the position of the protruding portion368is not limited thereto. The elastic portion364is formed to extend in a direction perpendicular to the second direction from the fixing portion366. The elastic portion364may be configured to be elastically deformable by an external force. Referring toFIGS.3to6, the coil assembly30is configured to be movable according to the deformation direction of the elastic portion364. For example, when a force is applied in the −Z axis direction to the elastic portion364, the elastic portion364is deformed in the −Z axis direction, so that the coil assembly30can accordingly move in the −Z axis direction. Therefore, in the process of assembling a pump housing (not illustrated) and an ECU (Electronic Control Unit) housing (not illustrated), a problematic occurrence of the height tolerance of the coil320may be prevented. In addition, it becomes easier to dissipate heat generated from the coil320because the case340is in close contact with the pump housing. In addition, referring toFIGS.5and6, the elastic portion364is configured to be deformable in the second direction as well as the first direction, for example the Y-axis direction when the second direction is the height direction of the bobbin300, that is, the Z-axis direction. Further, the elastic portion364can also be deformed in a third direction perpendicular to the first and second directions, for example, the X-axis direction. When a force in the X-axis and/or Y-axis direction is applied to the elastic portion364, the elastic portion364is deformed in the X-axis and/or Y-axis direction, so that the coil assembly30can be moved in the X-axis and/or Y-axis direction. Therefore, the above configuration helps prevent an interference between the valve assembly and the bobbin300when assembling the valve assembly in the bobbin central hole305. The coil connecting portion362extends in the second direction from the elastic portion364and is configured to be coupled with the pin assembly units380. The coil connecting portions362are coupled with the pin assembly units380by inserting the coil connecting portion362into the pin assembly units380, and are connected to the coil320passing through the pin assembly units380. For example, the coil320may be connected to the coil connecting portion362while being wound around the coil connecting portion362. In order to fix the coil320to the coil connecting portion362, the coil320may be bonded with the coil connecting portion362by using a resistance welding. However, the bonding method of the coil320is not necessarily limited to the resistance welding, and, for example, a soldering method may be used. According to an embodiment of the present disclosure, the lead pins360include the above configuration, and the elastic portion364is deformable in the X-axis, Y-axis, and Z-axis, so that a 3-axis degree of the freedom of the coil assembly30for vehicle braking can be secured. In order to expand a movable range of the coil assembly30, it is desirable that the length of the elastic portion364is sufficiently secured. Therefore, the pin assembly units380may be formed at both side ends of the bobbin300and configured to be symmetrical to each other with respect to the first direction that passes along the center of the bobbin300. Further, the elastic portion364may be configured to extend in a diagonal direction with respect to the first direction from the fixing portion366as illustrated inFIG.5. Because the pin assembly units380and the elastic portion364are configured as described above, the length of the elastic portion364may be sufficiently secured. Specifically, it is desirable that the pin assembly units380are formed on both side ends of the bobbin300and the elastic portion364is configured to extend in the diagonal direction with respect to the first direction in order to secure structural stability and a sufficient length of the elastic portion364, in a state that the coupling position of the fixing portion366and the printed circuit board is determined. Meanwhile, referring toFIG.7, according to an embodiment of the present disclosure, the braking apparatus may include the coil assembly30, a first housing700and a second housing (not illustrated). The description of the coil assembly30is the same as described above, and therefore it will be omitted hereinafter. The first housing700includes the printed circuit board720that can be coupled with the lead pins360by use of press-fitting or soldering, and is configured to accommodate the coil assembly30therein. InFIG.7, it is shown that the coil assembly30does not include the case340, however, the coil assembly30may include the case340. In this case, the shape of the portion of the first housing700accommodating the coil assembly30can be changed. Each of the lead pins360may include the protruding portion368protruding from each of the lead pins360. Each of the lead pins360may be coupled with the first housing700using the protruding portion368. Because the protruding portion368is coupled with the first housing, the lead pins360cannot be easily separated from the printed circuit board720. A detailed description of the protruding portion368has been described above, and therefore it will be omitted hereinafter. The second housing includes the valve assembly accommodated in the bobbin300and configured to control the opening and closing of the oil flow path. The second housing is coupled with the first housing so that the outer surface may contact the case340. The braking apparatus including the above configuration is configured to automatically and electronically control the opening and closing of the oil flow path, and therefore an anti-lock brake system (ABS) of the vehicle becomes implementable. In addition, because there is no need to apply the deep drawing method when manufacturing the coil assembly30, manufacturing process costs may be reduced compared to that of previous braking apparatuses. As described above, according to the exemplary embodiment of the present disclosure, the coil assembly30for vehicle braking has a three-axis degree of freedom while reducing the overall manufacturing process cost. Although exemplary embodiments of the present disclosure have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions, and substitutions are possible, without departing from the idea and scope of the claimed invention. Therefore, exemplary embodiments of the present disclosure have been described for the sake of brevity and clarity. The scope of the technical idea of the present embodiments is not limited by the illustrations. Accordingly, one of ordinary skill would understand the scope of the claimed invention is not to be limited by the above explicitly described embodiments but by the claims and equivalents thereof. | 20,205 |
11862393 | DETAILED DESCRIPTION FIG.1to9show a ring-shaped coil assembly altogether marked with the reference number1, which is preferably employed individually or in multiples in valves in order to drive an actuation member of the actuation device of this valve in a linear or rotary operating movement as part of an actuation device of the respective valve. The energized coil assembly1can, for this purpose, provide for this purpose a magnetic field which is not illustrated in the figures, which interacts with the actuation member in order to drive the same to perform the operating movement. FIG.1shows a perspective view of a preferred exemplary embodiment of the coil assembly1. The coil assembly1is annular in shape and defines a central main longitudinal axis34entered with dashed line. The coil assembly1has a coil supply connection58, on which exemplarily a connection cable59coupled with a supply device can be plugged on, in order to realise the energy supply, i.e. in particular energizing of the coil assembly1. Furthermore, the coil assembly1has a coil arrangement2for providing the said magnetic field, the coil arrangement2comprising at least one electrically energizable coil3consisting of a multiplicity of circumferential metallic individual wire windings about a coil centre axis4of the coil3, a coil ring carrier6receiving this coil arrangement2and a multi-part flux conducting device16, which serves for conducting magnetic field lines of the magnetic field provided by means of the coil arrangement6. It is at least conceivable that the coil arrangement2for optimising the magnetic field is equipped with more than one coil3, for example two or three such coils3can be provided. Here, the coils3, the coil ring carrier6and the flux conducting device16are axial to one another and thus define the said main longitudinal centre axis34of the coil assembly1. By way of this, the said components of the coil assembly1, except for the coil supply connection58, have a common central main longitudinal centre axis34, which with respect to the components of the coil assembly1can form a symmetry axis if applicable. FIG.2shows a longitudinal section through the coil assembly1fromFIG.1with view in the direction of arrows II entered there. This allows in particular viewing the coil ring carrier6in more detail. The same comprises a pair of coaxial flat coil ring plates7arranged with a longitudinal distance from one another, which are material-integrally connected to one another by way of a circumferential side circumference wall8of the coil ring carrier6about a coil ring carrier centre axis9of the coil ring carrier. Here, the side circumference wall8is each fixed to coil ring plate inner edges10of the two coil ring plates7located with respect to the coil ring carrier centre axis9radially inside, so that the coil ring carrier6forms or delimits a coil carrier receiving inner space11that is open radially to the outside for receiving the at least one coil3and, radially inside, a central passage68running coaxially to the coil ring carrier centre axis9. Furthermore, the coil ring carrier6has receiving pockets12,13oriented radially towards the inside which open into the passage68for inserting pole ring inner teeth62of a pole ring17of the flux conducting device16and counter-pole ring inner teeth65of a counter-pole ring25of the flux conducting device16explained in the following. The receiving pockets12,13are arranged in alternating order round about the coil ring carrier centre axis9on the radial inner side of the side circumference wall8oriented towards the passage68, so that in the circumferential direction about the coil ring carrier centre axis9, a receiving pocket12for a pole ring inner tooth62of the pole ring17is always alternately followed by a receiving pocket13for a counter-pole ring inner tooth65of the counter-pole ring25. As is noticeable, furthermore, inFIG.2, each receiving pocket12,13is equipped with a pocket bottom14that is angularly tilted with respect to the coil ring carrier centre axis9, against which in each case a pole ring inner tooth62of the pole ring17or a counter-pole ring inner tooth65of the counter-pole ring25touchingly lies. For example, the pocket bottoms14are tilted with respect to the coil ring carrier centre axis9by angles7of greater than zero up to including 5°. Furthermore, each receiving pocket12,13has a pocket wall15framing the respective pocket bottom14at least in sections projecting away from the respective pocket bottom14. The respective receiving pockets12,13are either embodied integrally on the coil ring carrier6or subsequently worked in by a machining method. The coil ring carrier6can be produced in particular from a plastic, a metal material coated with an insulating layer or a composite material. The flux conducting device16noticeable inFIG.2in section has the purpose of conducting and forming, in particular bundling the magnetic field generated by means of the coil arrangement2. For this purpose, it comprises, as indicated, a pole ring17and a counter-pole ring25exemplarily configured almost identically. Both the pole ring17and also the counter-pole ring25are produced in one piece and out of a material having ferromagnetic properties, suitable are for example alloys with contents of iron, cobalt and/or nickel. Exemplarily, it is a steel material, in particular a plate semi-finished product that has been stamped and reshaped. The pole ring17of the coil assembly1produced out of a steel plate shown inFIG.4in a perspective individual view has a ring base plate18, which is centrally penetrated completely by a circular clearance19. The ring base plate18, furthermore, has multiple pole ring outer teeth24distributed round about a longitudinal centre axis20of the pole ring17exemplarily running centrically through the clearance19and which with respect to the ring base plate18stand up perpendicularly, arranged on an outer edge22of the ring base plate18that is oriented with respect to the longitudinal centre axis20radially to the outside and angularly bent over at fold-over outer edge regions23of the ring base plate18. Exemplarily, the pole ring outer teeth24are bent over with respect to the longitudinal centre axis20by exactly 90°. Each of these pole ring outer teeth24is realised as a flat body52, which on the foot side is integrally connected to the outer edge22of the ring base plate18. On the head side, they each have a free tooth end53. On these free tooth ends53, a mounting bevel54each located radially inside is provided. These mounting bevels54are oriented with respect to the longitudinal centre axis20transversely, in particular at a right angle and can, furthermore, be each formed by a multi-way chamfer57. The mounting bevels54facilitate the mounting of the coil assembly1. The pole ring17, furthermore, comprises in the region of its central clearance19multiple pole ring inner teeth62, which, distributed round about the longitudinal centre axis20in the circumferential direction21, are arranged on a circumferential inner edge63of the ring base plate18about the clearance19oriented with respect to the longitudinal centre axis20radially towards the inside, and are each angularly bent over on a fold-over inner edge region64of the ring base plate18. Exemplarily, the pole ring inner teeth62are bent over in the same direction as the pole ring outer teeth24and with respect to the longitudinal centre axis20by exactly 90°. Exemplarily, deviating angles α can also be set, or angles between the pole ring inner teeth62and the longitudinal centre axis20in the range greater than zero up to including 10°. The counter-pole ring25of the coil assembly1fromFIG.1produced from a steel plate shown in a perspective individual view inFIG.5is substantially constructed analogously to the pole ring17. It has a counter-ring base plate26, which is centrally penetrated completely by a circular counter-clearance27. Furthermore, the counter-ring base plate26has multiple counter-pole ring outer teeth32distributed about a counter-longitudinal centre axis28of the counter-pole ring25exemplarily running centrically through the counter-clearance27and standing up perpendicularly with respect to the counter-ring base plate26arranged on a counter-outer edge30of the counter-ring base plate26oriented with respect to the counter-longitudinal centre axis28radially to the outside and angularly bent over on counter-fold-over outer edge regions31of the counter-ring base plate26. Exemplarily, the counter-pole ring outer teeth32, like the pole ring outer teeth24are bent over with respect to the counter-longitudinal centre axis28by approximately or exactly 90°. Each of these counter-pole ring outer teeth32is realised as a flat body52, which are each integrally connected on the foot side to the counter-outer edge30of the counter-ring base plate26. On the head side, they each form a free counter-tooth end55. On the free counter-tooth ends55of the counter-pole ring outer teeth32, a mounting bevel56each located radially inside is also provided. These mounting bevels56are oriented with respect to the counter-longitudinal centre axis28, transversely, in particular at a right angle. The mounting bevels56can each be formed by a multi-way chamfer57. The mounting bevels56facilitate the mounting of the coil assembly1. In the region of its central counter-clearance27, the counter-pole ring25comprises multiple counter-pole ring inner teeth65, which, distributed round about the counter-longitudinal centre axis28, are arranged on a circumferential counter-inner edge66of the counter-ring base plate26about the counter-clearance27oriented with respect to the counter-longitudinal centre axis28radially to the inside and are each angularly bent over at a counter-fold-over inner edge region67. Exemplarily, the counter-pole ring inner teeth65are bent over in the same direction as the counter-pole ring outer teeth32and with respect to the counter-longitudinal centre axis28by approximately or exactly 90°. Exemplarily, deviating angles α can also be set, for example angles between the counter-pole ring inner teeth65and the counter-longitudinal centre axis28in the range greater than zero up to including 10°. Both the pole ring outer teeth24and also the counter-pole ring outer teeth32are embodied flat, i.e. curvature-free. Equally, the pole ring inner teeth62and the counter-pole ring inner teeth65can be embodied flat, i.e. curvature-free. In the assembled state33of the coil assembly1illustrated inFIGS.1and2, the pole ring17and the counter-pole ring25are oriented coaxially to one another and to the main longitudinal centre axis34of the coil assembly1, i.e. to the remaining components of the coil assembly1and arranged spaced apart from one another in the axial direction35of the main longitudinal centre axis34. Because of this, a coil receiving space36is formed or delimited between them, in which the mentioned coil arrangement2and the coil ring carrier6carrying the coil arrangement2are arranged. Furthermore, it is noticeable in the twoFIGS.1and2that the pole ring outer teeth24and the counter-pole ring outer teeth32in the assembled state33of the coil assembly1are intermeshed, wherein the pole ring outer teeth24are arranged in the axial direction35without contact on the counter-ring base plate26and in a radial direction38that is oriented transversely with respect to the main longitudinal centre axis34are elastically preloaded and in the radial direction38clamped on to the counter-ring base plate26. In a counter-axial direction36that is opposite with respect to the axial direction35, the counter-pole ring outer teeth32are arranged on the ring base plate18free of contact and elastically preloaded in the radial direction38and in the radial direction38clamped to the ring base plate18, see alsoFIG.3. The fact that the pole ring outer teeth24are arranged on the counter-ring base plate26free of contact in the axial direction35exemplarily means that seen in the axial direction35no components of the coil assembly1, in particular of the counter-pole ring25or the counter-ring base plate26of the same, touchingly butt-up against axial front faces72of the pole ring outer teeth24or against free tooth ends53of the pole ring outer teeth24. The fact that the counter-pole ring outer teeth32are arranged on the ring base plate18free of contact in the counter-axial direction36exemplarily means that seen in the counter-axial direction36no components of the coil assembly1, in particular of the pole ring17or of the ring base plate18of the same, touchingly butt-up against counter-axial front faces73of the counter-pole ring outer teeth32or against free tooth ends55of the counter-pole ring outer teeth32. The pole ring inner teeth62and the counter-pole ring inner teeth65likewise intermesh, however, they are configured so that they touch one another neither in the axial direction35or counter-axial direction36nor in the circumferential direction. Instead, they each clampingly engage in the mentioned receiving pockets12,13. Because of this, the coil assembly1is compact and firmly mounted. Because of the fact that the pole ring outer teeth24and the counter-pole ring outer teeth32touchingly lie against the ring base plate18or the counter-ring base plate26from radially outside, i.e. laterally, the flux conducting device16of the coil arrangement1can optimally conduct or form the said magnetic field so that the coil assembly1is optimised with respect to its energy requirement or its efficiency. Because of this, for example the said actuation member of the valve can either be actuated relatively protective of resources or a relatively powerful actuation movement of the actuation member be achieved. Because of this, the coil assembly1is relatively efficient. Through this configuration, a relatively favourable mounting of the coil assembly1is possible, furthermore. FIG.3shows an extract framed with dashed line of the coil assembly1fromFIG.1in enlarged representation with view in the direction of an arrow III entered there. Substantially, the ring base plate18of the pole ring17is noticeable and that the counter-pole ring outer teeth32are clamped on to the ring base plate18without gap and flat between two fold-over outer edge regions23of the ring base plate18adjacent in the circumferential direction21. It is also noticeable that between the two neighbouring fold-over outer edge regions23of the ring base plate18a clamping surface39is formed, on to which the counter-pole ring outer tooth32is clamped without gap, areally and elastically preloaded, from radially outside. Analogously to this, the counter-pole ring25comprises on the counter-ring base plate26, counter-clamping surfaces40on which in each case a pole ring outer tooth24is clamped without a gap, flat and elastically preloaded, from radially outside. For the more accurate description of the mentioned clamping surfaces39and counter-clamping surfaces40,FIG.6exemplarily shows an extract framed with dashed line of the pole ring17of the coil assembly1fromFIG.4in enlarged representation and with view in the direction of an arrow VI entered there. A corresponding extract of the counter-pole ring25fromFIG.5could also be utilised. At any rate, it is noticeable inFIG.6that between two fold-over outer edge regions23of the ring base plate18adjacent in the circumferential direction21a said clamping surface39is formed. The same is configured curvature-free, i.e. flat. In the assembled state33of the coil assembly1, seeFIGS.1and2, this makes possible that a counter-pole ring outer tooth32, elastically preloaded, can be clamped on from radially outside, wherein the pole ring outer teeth24are clamped on to a respective clamping surface39without a gap and areally. The same applies to the counter-pole ring25. It has a curvature-free counter-clamping surface40in each case between two counter-fold-over outer edge regions31of the counter-ring base plate26adjacent in the counter-circumferential direction29a curvature-free counter-clamping surface40, on to which in the assembled state33of the coil assembly1a pole ring outer tooth24of the pole ring17, elastically preloaded, is clamped on from radially outside, wherein the pole ring outer teeth24are also clamped on to a respective counter-clamping surface40without gap and areally. InFIG.3to6it is additionally noticeable that the clamping surfaces39project from the ring base plate18in the radial direction38towards the outside (in particularFIG.6) and that the counter-clamping surfaces40project from the counter-ring base plate26in the radial direction38towards the outside (in particularFIG.5). The ring base plate18of the pole ring17visible inFIG.4exemplarily has two large ring surfaces41oriented in opposite direction, a circumferential inner lateral surface42radially inside with respect to the longitudinal centre axis20, which forms the said inner edge63of the ring base plate18, and a circumferential outer lateral surface43radially outside with respect to the longitudinal centre axis20, which forms the outer edge22of the ring base plate18. The said clamping surfaces39are now arranged on projections47projecting in the circumferential direction21between the fold-over outer edge regions23and in the radial direction38from the outer lateral surface43of the ring base plate18towards the outside, see in particularFIG.6, wherein the clamping surfaces39there are each formed by front faces48of these projections47pointing in the radial direction38towards the outside. Analogously to this, the counter-ring base plate26of the counter-pole ring25visible inFIG.5has two opposite counter-large ring surfaces44, a circumferential counter-inner lateral surface45with respect to the counter-longitudinal centre axis28radially inside, which forms the counter-inner edge66of the counter-ring base plate26, and a circumferential counter-outer lateral surface46with respect to the counter-longitudinal centre axis28radially outside, wherein the latter forms the counter-outer edge30of the counter-ring base plate26. The said counter-clamping surfaces40are arranged analogously to the clamping surfaces39on counter-projections49projecting between the counter-fold-over outer edge regions31and in the radial direction38from the counter-outer lateral surface46of the counter-ring base plate26, wherein the counter-clamping surfaces40there are each formed by front faces50of these counter-projections49pointing in the radial direction38towards the outside. In particular inFIG.1it is additionally noticeable that the pole ring17and the counter-pole ring25form or delimit a common clearance60for the coil supply connection58so that the coil arrangement2can be electrically contacted with the coil supply connection58through the clearance60.FIG.1additionally shows that at least the ring base plate18comprises a rotation positive-locking cut-out61penetrating the same at least in sections or completely for positioning the pole ring17on the coil ring carrier6. The rotation positive-locking cut-out61interacts, in particular when the pole ring17is placed on to the coil ring carrier6or in the assembled state33of the coil assembly1, with the coil ring carrier6in such a manner that the pole ring17is non-rotatably held on the coil ring carrier6. By way of this, a simple anti-rotation means is achieved. InFIG.7, an extract VII of the coil assembly one fromFIG.2framed with dashed line is shown in enlarged representation. It is noticeable that the pole ring outer teeth24and/or the counter-pole ring outer teeth32in the assembled state33of the coil assembly1are elastically deflected out of their state bent over with respect to the longitudinal centre axis20or the counter-longitudinal centre axis28by approximately or exactly 90°, so that the pole ring outer teeth24and/or the counter-pole ring outer teeth32are clamped in the radial direction38with elastic preload on to the clamping surfaces39of the pole ring17and/or the counter-clamping surfaces40of the counter-pole ring25. For example, the pole ring outer teeth24and/or the counter-pole ring outer teeth32are each deflected by an angle β between themselves and the longitudinal centre axis20or the counter-longitudinal centre axis28of greater than zero up to including 5. Finally,FIG.8shows an extract as inFIG.7, however this is a further preferred exemplary embodiment of a coil assembly1. It is characterised in that the pole ring outer teeth24and the counter-pole ring outer teeth32are bent over exactly by 90° to the ring base plate18or to the counter-ring base plate26and that in the assembled state33of the coil assembly1no elastic deflection of the pole ring outer teeth24and of the counter-pole ring outer teeth32has taken place, so that they run quasi-parallel to the longitudinal centre axis20or counter-longitudinal centre axis28. Because of this, the pole ring17and the counter-pole ring25can be practically mounted without joining force and laterally clampingly lie flat, in particular over the full surface area, against the respective outer edges of the respective ring base plates. Finally,FIG.9shows a further embodiment of a coil assembly1according to the invention in an installation situation not described in more detail, which is largely identical with the embodiments described above. In contrast with the preceding embodiments, the pole ring outer teeth24however each have a curvature101embodied about a curvature axis100. These curvature axes100, of which inFIG.9a single one is realised in plan view and therefore as a dot, are each oriented at a right angle with respect to the longitudinal centre axis20of the pole ring17. The pole ring inner teeth62could each also have a curvature or arch embodied about a curvature inner axis, wherein the said curvature inner axes would then each be oriented at a right angle with respect to the longitudinal centre axis20of the pole ring17, however this is not embodied here. Furthermore, the counter-pole ring outer teeth32in contrast with the preceding embodiments each have a curvature105embodied about a counter-curvature axis104. The said counter-curvature axes104are oriented with respect to the counter-longitudinal centre axis28of the counter-pole ring25at a right angle. Furthermore, the counter-pole ring inner teeth65could each also have a curvature embodied about a counter-curvature inner axis, wherein the said counter-curvature inner axes would each be oriented at a right angle with respect to the counter-longitudinal centre axis28of the counter-pole ring25even if this is not embodied here. | 22,608 |
11862394 | FIG.1is a diagram illustrating the formation of a biofilm. Initially, a few bacteria or Planktonic cells attach to a substrate that is suitable for biofilm growth such as a carbon-based porous substrate. In a second stage a mature biofilm is formed. Eventually, in a third stage the biofilm releases bacteria. In turn the dispersed bacteria may attach to the substrate to form another biofilm. The bacteria produce a wide variety of redox-active metabolites. For instance, many bacteria, such as Pseudomonas produce phenazines and phenazines derivatives. FIG.2illustrates the oxidoreduction reactions of phenazine derivatives.FIG.2(a)shows the backbone molecular structure of a phenazine molecule.FIG.2(b)shows the redox reaction of phenazine-1-carboxamide at pH7.FIG.2(c)shows the redox reaction of pyocyanin at pH 7. FIG.3is a cutaway side view of an electrochemical capacitor300for use with a biofilm. The electromechanical capacitor300has a structure providing for both a pseudocapacitance and a double-layer capacitance; and may be referred to as a pseudo capacitor or a faradaic supercapacitor. The electrochemical capacitor300includes an electrolyte layer310sandwiched between a first stack320and a second stack330. It will be appreciated that the diagram ofFIG.3is not a scaled representation of the supercapacitor and that the relative size of each layers relative to each other may vary depending specific applications. The first stack320may be formed by a first electrode324provided between a first substrate322and a first porous redox active layer326. A first pin328extends through the first substrate322and through a portion of the first electrode324to provide electrical contact to the electrode324. Similarly, the second stack330may be formed by a second electrode334provided between a second substrate332and a second porous redox active layer336. A second pin338extends through the second substrate332and through a portion of the second electrode334to provide electrical contact to the electrode334. A current source350may be coupled to the first and second pins328and338to provide a charging current I_charge. For instance, the first electrode324may be an anode and the second electrode334may be a cathode. The electrolyte layer310may be a biocompatible solution or a biocompatible gel. For instance, the electrolyte may be a gel such as a glucose and citrate gel or a bacterial gel allowing a formation of a biofilm. Alternatively the electrolyte may be provided by citrate or an ionic liquid or an inorganic salts or buffer or other bacterial growth media. The electrolyte310should be electrochemically stable and preferably have a wide potential window. The supercapacitor may be designed as a flexible and biocompatible device. For instance, the first and second stacks320,330may be made of flexible materials. A separator, such as a porous film, may be provided between the first stack320and the second stack330. The substrate layers322and332may be flexible membranes such as polyurethane based membranes. The electrodes324,334may comprise a carbon-based material such as graphite. The porous redox active layers326,336may be formed by a gel such as a hydrogel or polymer matrix that includes a nanomaterial such as a carbon nanoparticle or a metallic nanoparticle. Example of suitable nanoparticles may be gold, copper or silver nanoparticles. A polymer matrix may include polyurethane. In the layer326provided at the anode, the nanomaterial can be linked physically or chemically with a redox mediator such as a metal oxide redox mediator. Examples of metal oxide mediators include Manganese oxides, Copper oxides, Iron oxides and ferrocenes. If graphene oxide is used a mediator may not be required. The porous redox active layer326is pseudocapacitive and can store charges. The porous redox active layer336provided at the cathode does not contain a mediator. The redox porous layers326and336have cavities allowing the biofilm to attach to the layer326. For instance, the cavities may have a size that is in the order of the size of a bacterium, for example the cavities may have an average diameter ranging from about 0.2 μm to about 10 μm. For instance, an active layer may be formed by a silanized polyvinyl alcohol gel (PVA) incorporated with graphene oxide or gold. Graphene oxide (GO) for instance may be dissolved into a hydrogel gel network. This biocompatible material provides good electrical conductivity, high young's modulus, large specific area and stability for wide temperature range. The energy E stored in the supercapacitor may be expressed as a function of the capacitance C, and the potential window V as: E=½CV2(1) The power density of the device is proportional to the square of the voltage, as P=V2/4Rs(2) In which Rsis the internal resistance of the supercapacitor. The ions in the electrolyte310should preferably be present in high enough concentration and the solvated ionic radius of the ions should be small so as to exploit all available pores in the electrode structure. The electrolyte310should have suitable mechanical properties such as low viscosity and volatility. Commonly used aqueous electrolytes such as potassium hydroxide KOH or sulfuric acid H2SO4, are unsuitable for biocompatible devices. In order to optimise the electrolyte solution an imidazolium cation-based Room Temperature Ionic Liquid (RTIL) with bromide counter ion may be used. The RTIL allows increasing the voltage window and stabilises the glucose/citrate gel in silanized polyvinyl alcohol gels (PVA). The RTIL provided in the GO/PVA composite is also used to induce pore opening. In operation, the negatively charged bacteria grow a biofilm314on the porous layer326coupled to the anode324. The biofilm314releases electrons from redox active groups molecules such as phenazines. The electrons may be stored in the layer326. The circuit starts pulsing when redox reactions and electron transfer occurs. The circuit keep pulsing as long as there is enough metabolites present in the electrolyte310. Below is an exemplary protocol for making a supercapacitor of 2 mm thickness by sandwiching an electrolyte gel between two stacks, each stack comprising two layers, layer 1 and layer 2, on a flexible thin film. The electrode layer, layer 1, is obtained by mixing 2.86 g of Tecoflex SG 80 with 15 ml of Tetrahydrofuran (THF). The mixture is then heated to form a clear and viscous liquid melt. Once cooled, 64 mg of graphite powder (particle size of 40 micrometres) is added together with 200 μl of 1-ethyl-3-methyl imidazolium bromide (IL-EMImBr) and mixed with the melt to form the electrode layer. Alternatively, other RTILs may be used such as 1-butyl-3-methylimidazolium bis(trifluoromethane) sulfonimide (or nitrate). The porous redox layer, layer 2, is obtained by first dispersing 100 mg of dried Graphene oxide (GO) and 200 μl of IL-EMImBr in 15 ml of distilled water and then by sonicating the solution for 4 hours. This dispersion is then slowly added to a Polyvinyl alcohol (PVA) solution prepared by dissolving 3.25 g of PVA in 85 ml distilled water at 90° C. and cooled to 50° C. Graphene oxide GO may be prepared using the Hummers method. Alternatively the Graphene oxide may be replaced by metallic nanoparticles such as gold, copper or silver nanoparticles. The gel electrolyte may be obtained by adding 2 g of glucose or sodium citrate dehydrate and 75 ml of IL-EMImBr to a solution of PVA cooled to 50° C. A platinum point wire is then inserted into the electrode layer for providing electrical connections. FIG.4shows a scanning microscopy image of the electrode layer424(layer 1) and the porous redox layer426(layer 2). The ions present in the electrolyte form electrostatic double-layers of opposite polarity. For instance, a double-layer forms at the interface between the electrolyte and the porous layer426. The double-layer capacitance contributes to the total capacitance of the supercapacitor. In addition, the porous layer426is adapted to perform Faradaic electron charge transfer with redox reactions. The Faradaic reactions can arise from a biocompatible redox reaction for example glucose or from the biofilm itself. The electrochemical capacitance also contributes to the total capacitance of the supercapacitor. For instance, if the electrolyte is a glucose electrolyte, then the porous matrix426allows diffusion of glucose within the layer426. This permits glucose to be reduced into gluconic acid at the electrode424by GO, present in the porous matrix426. Upon formation of a biofilm, additional reactions may take place. The porous redox active layer426includes a large number of pores also referred to as channels460. The size of these pores or channels is sufficient to allow redox-active metabolites such as phenazines and phenazines derivatives to penetrate the layer426and reach the electrode424. In turn the redox-active metabolites may be reduced or oxidized. For example the channels may have an average diameter ranging from about 0.2 μm to about 10 μm. The performance of the supercapacitor may be checked using various techniques that includes Cyclic Voltametry (CV), charge and discharge at short time scales and electrical impedance spectroscopy (EIS). FIG.5illustrates the cyclic voltammograms of a supercapacitor obtained after one cycle, 510, 20 cycles 520 and 50 cycles. The cyclic voltammograms show a reversible waveform. The capacitance of the super capacitor may be calculated using the following equation: C=12v(Vf-Vi)∫ViVfI(V)dV,(3) in which C is the capacitance in Farad, Vfand Viare the limits of the potential window in Volts, v is the scan rate in Vs−1and I is the current in Amperes. Ideal supercapacitor's have rectangular cyclic voltammograms. Deviation from this rectangular shape indicates the presence of some pseudocapacitive behaviour. The capacitance calculated using equation (3) was 0.17, 0.11, 0.07, 0.03, 0.02 μF/cm2for scan rates of 20, 50, 100, 250 and 500 mVs−1respectively. Therefore, the capacitance decreases with increased scanned rates indicating increasing diffusion resistance for ionic motion into electrode pores at higher sweep rates. Calculation of capacitance using equation (3) showed very little change in capacitance between 25th and 50th cycle, demonstrating good life cycle of the supercapacitor. Any change in capacitance is attributed to charge consumption due to Faradic reactions with unbounded functional groups at electrode/electrolyte surfaces. FIG.6shows the Galvanostatic charge and discharge profiles of the supercapacitor obtained using the above-mentioned protocol. The measurements were performed using a two electrodes configuration in a Faraday cage in order to minimize interferences. The measurements were performed for charging currents varying from 1 μA to 10 mA and working potential window varying from 1 to 5 V. Measurements610,630and650were obtained for a citrate gel and a charging current of 1 μA, 10 μA and 100 μA respectively. Measurements620,640,660,670,680were obtained for a glucose gel and a charging current of 1 μA, 10 μA, 100 μA, 1 mA, and 10 mA respectively. The capacitance of an electrochemical capacitor may be calculated using the following equation: C=IdtdV(t)(4) in which C is the capacitance in Farad, I is the charging current, t is the charging time and V is the change in potential on charge. Capacitance values for different charging current may be obtained using equation 4. For instance, a capacitance of 0.74 mF was calculated for a 10 mA charging current. The pseudocapacitance associated with the reduction of GO adds to the total capacitance of the capacitor. FIG.7shows the charge-discharge measurements obtained for an electrochemical capacitor provided with a charging current of 10 μA. The measurements were obtained using an electrochemical capacitor as described inFIG.3provided with a gel of live bacteria, measurement710and a gel of dying bacteria, measurement720. The measurement710displays six transient pulses having a maximum amplitude of about 4.7 Volts and a full width half maximum of about 300 ms. In contrast, the measurement720displays six transient pulses having a maximum amplitude of about 15 mV, hence about 300 times smaller. An additional measurement730is provided for a blank gel, hence without bacteria. In this case the discharge pulses have an amplitude of about 4 mV. Therefore, the proposed supercapacitor can be used to destroy a biofilm by providing a succession of short pulses. A supercapacitor may also be obtained by replacing GO with Manganese dioxide MnO2deposited on a carbon-based substrate such as a graphite or a Carbone Nanotubes CNTs substrate. FIG.8is a schematic representation of a reaction occurring at the electrode of an MnO2modified multi walled carbon nanotube supercapacitor. A biofilm has grown on a redox active layer that includes MnO2modified graphene pores. The biofilm generates electrons from redox active groups such as phenazines. The electrolyte for instance a glucose gel generates electrons allowing glucose to be transformed into gluconolactone. FIG.9is a set of cyclic voltammograms CVs obtained for an MnO2modified carbon nanotube supercapacitor.FIG.9shows a first CV,910obtained before exposure to the bacteria, a second CV920obtained after exposing the CN:MnO2substrate to the bacteria for 48 hours; and a third CV930obtained after exposing the CN:MnO2substrate to the bacteria for 72 hours. The capacitance of the CN:MnO2supercapacitor was calculated using equation 3 above. The background capacitance was calculated at 79±7 μF g−1of activated CNT. After 48 hours exposure, the pseudocapacitance of the supercapacitor decreased in the presence of the biofilm down to 51±5 μF g−1. This decrease in capacitance implies that the biofilm is impeding the electrical charging of the double layer by blocking the electrode surface. After a 72 hours exposure the capacitance increases to 170±9 μF g−1at the electrode surface. This suggests the establishment of a biofilm that is undergoing quorum sensing and the emergence of redox-active structures. The emergence of redox-active molecules within the bacterial community facilitates electron transfer to the electrode surface and subsequently contribute to charge storage. A capacitance of 170 μF g−1corresponds to an energy density that is sufficient to power small electronic devices such as a portable/wearable device. Similar experiments show that the inclusion of MnO2within a graphite paste increased the pseudocapacitance of the supercapacitor in the presence of a biofilm, from 14.5±0.2 mF g−1for a graphite only electrode to 56.2±0.8 mF g−1for a graphite:MnO2electrode of ratio 4:1 by mass. This can be attributed to the intercalation redox processes of the electrolyte cations that adsorb onto MnO2molecules at the surface of the electrode. The pseudocapacitive nature of MnO2contributes to charge storage. Compared with graphite electrodes, MWCNTs electrodes have a greater accessible surface area. As a result, MWCNTs provide a greater area over which the double layer can form, leading to increased charge storage. The electrochemical capacitor described above with reference toFIGS.3to9may be used in various applications. FIG.10(a)is a bottom view of a patch1000to be applied on a skin portion of a subject.FIG.10(b)is a cutaway view of the patch1000. The patch has a support layer or membrane1010for applying the patch to a skin portion of the subject. One or more supercapacitors1030are attached to the membrane1010. The supercapacitors may be as described with respect toFIG.3. In an exemplary embodiment the membrane has an adhesive film (not shown) located on its inner surface. The supercapacitor is initially charged with static charges. The patch1000does not require any additional battery. In use the patch1000is applied to a skin portion of the subject, for instance the patch may be applied to cover a wound or an inflamed region of the skin. In the presence of bacteria, a biofilm may grow between the electrodes of the supercapacitor. As the biofilm grows, the capacitor generates transient pulses automatically. These pulses disrupt or destroy the biofilm. In turn, the healing of the wound or inflamed skin region is facilitated. Once the biofilm has been destroyed, the amount of redox-active metabolites present in the electrolyte falls below a certain level, and the supercapacitor stops pulsing. The patch1000may be a disposable patch for use over a limited time period. In another embodiment a patch may be adapted to sense the formation of a biofilm. In this case the patch would need to be coupled to a current source. FIG.11illustrates a supercapacitor device1100that includes a set of three unit-cells labelled1110,1120and1130coupled in parallel. Each unit cell is formed by interdigitated electrodes providing a plurality of pseudo capacitors. In this example, the device includes three unit-cells, however it will be appreciated that more cells can be added depending on the requirements of the application. The interdigitated electrodes have a first set of parallel arms and a second set of parallel arms. The first set is placed opposite to the second set. For instance cell1130includes a first set1130ato receive a positive current and a second set1130bto receive a negative current. FIG.12is a wireless device, in this example an implantable device1200such as a pacemaker. The implantable device1200is provided with a power unit1210. The power unit1210includes one or more supercapacitors as described above with respect toFIGS.3to9. The relatively high capacitance value of the supercapacitor describes above makes the supercapacitor an ideal candidate as a power source. The sharp charge and discharge peaks of the supercapacitor provides a large amount of power in a short time, as required by wireless devices. In an exemplary embodiment the supercapacitor includes a biofilm. The supercapacitor uses the redox-active metabolites secreted by the bacteria as a source of energy. A skilled person will appreciate that variations of the disclosed electrochemical capacitor are possible without departing from the disclosure. Accordingly, the above description of the specific embodiments is made by way of example only and not for the purposes of limitation. | 18,351 |
11862395 | DETAILED DESCRIPTION OF EMBODIMENTS Selected embodiments will now be explained with reference to the drawings. It will be apparent to those skilled in the art from this disclosure that the following descriptions of the embodiments are provided for illustration only and not for the purpose of limiting the invention as defined by the appended claims and their equivalents. Referring initially toFIG.1, an integrated supercapacitor-battery structure1is illustrated in accordance with a first embodiment. The integrated supercapacitor-battery structure1includes a first insulating layer2a, a supercapacitor3, a second insulating layer2b, electrode layers4, electrolyte layer5and insulator6. Electrode layers4and electrolyte layer5together form the battery portion of the integrated supercapacitor-battery structure. The integrated supercapacitor-battery structure1further includes a metal shell7, battery leads8aand8band supercapacitor leads9aand9b. The integrated supercapacitor-battery structure1may be used alone or in combination with other similar integrated supercapacitor-battery structures to store energy, for example, in a power bank or an energy bank of a vehicle. In this embodiment, the battery portion formed by electrode layers4and electrolyte layer5is formed around the supercapacitor3in a core-shell configuration such that the supercapacitor3forms a core and the battery portion forms a shell around the supercapacitor3. However, it should be understood that the supercapacitor may alternatively be formed around the battery portion in a core-shell configuration such that the battery portion forms the core and the supercapacitor forms the shell. The first insulating layer2ais formed of any suitable insulating material. For example, the first insulating layer2ais formed of polypropylene, polyvinylpyrrolidone (“PVP”), Teflon, or polyimide, preferably polypropylene. As shown inFIG.1, the first insulating layer2ais provided on an innermost, central portion of the integrated supercapacitor-battery structure1. The first insulating layer2amay be formed in the central portion of the integrated supercapacitor-battery structure1in any suitable manner. For example, the first insulating layer2amay be wound with the supercapacitor3and the second insulating layer2b. The first insulating layer2has a thickness of approximately 50 μm to 100 μm in an unwound state. The supercapacitor3is a cylindrical structure, preferably a wound structure formed by winding a layered structure that includes an anode, a cathode and an electrolyte provided between the anode and the cathode. The layered structure may also include metal foil layers on opposite sides of the anode and the cathode such that the foil layers form opposite exterior layers of the layered structure. The foil layers may be formed of any suitable metal, such as aluminum or copper. The supercapacitor3includes a plurality of layers each formed of a graphene-metal oxide composite material. At least one of the anode and the cathode, preferably at least the cathode, in the supercapacitor3includes a plurality of layers formed of the graphene-metal oxide composite material. The graphene-metal oxide composite material includes graphene and from 5 wt % to 30 wt % of a metal oxide that includes at least one transition metal selected from the group consisting of ruthenium, manganese, and cobalt. The metal oxide is preferably ruthenium oxide (RuO2). The graphene-metal oxide composite material may further include nitrogen. The layers formed of the graphene-metal oxide composite material include pores and each have a porosity of approximately 10% to 40%. The second insulating layer2bis formed of any suitable insulating material that insulates the supercapacitor3from the battery layers4and5. For example, the second insulating layer2bis formed of polypropylene, PVP, Teflon, or polyimide, preferably polypropylene. As shown inFIG.1, the second insulating layer2bis formed on the outer surface of the cylindrical supercapacitor3between the supercapacitor3and an innermost electrode layer4a. The second insulating layer2bmay be formed between the supercapacitor3and the innermost electrode layer4ain any suitable manner. For example, the second insulating layer2bmay be wound with the supercapacitor3and the first insulating layer2a. Alternatively, the second insulating layer2bmay be formed around the supercapacitor3by three-dimensional printing or by additive manufacturing. The second insulating layer2bhas a thickness of approximately 50 μm to 100 μm in an unwound state. As shown inFIG.1, the electrode layers4include an innermost electrode layer4athat is closest to and in contact with the second insulating layer2b, and an outermost electrode layer4bthat is closest to the metal shell7. The innermost electrode layer4ais a cathode layer, and the outermost electrode layer4bis an anode layer. However, it should be understood that the innermost electrode layer4amay be the anode layer, and the outermost electrode layer4bmay be the cathode layer. Furthermore, the integrated supercapacitor-battery structure1may include additional electrode layers4and electrolyte layers5. For example, the integrated supercapacitor-battery structure1may include a plurality of anode layers, a plurality of cathode layers, and a plurality of electrolyte layers. The electrode layers4and the electrolyte layer5may be formed in any suitable manner. For example, the electrode layers4and the electrolyte layer5may be formed by electrophoretic deposition on the metal shell7. The innermost electrode layer4aincludes a cathode active material. For example, the innermost electrode layer4aincludes at least one of the following cathode active materials: LiTiS2, LiCoO2, LiNiO2, LiMnO2, LiNi0.33Mn0.33Co0.33O2(“NMC”), LiNi0.8Co0.15Al0.05O2, Li2MnO3, LiMn2O4, LiCo2O4, LiFePO4, and LiMnPO4, preferably NMC. The innermost electrode layer4amay also optionally include a binder such as polyvinylidene fluoride (“PVDF”) and/or an additive such as acetylene black. The innermost electrode layer4ahas a thickness of approximately 50 μm to 70 μm. The outermost electrode layer4bincludes an anode active material. For example, the outermost electrode layer4bincludes at least one of the following anode active materials: lithium, graphite, silicon, and lithium titanium oxide such as Li4Ti5O12. The outermost electrode layer4bmay also optionally include a binder such as PVDF and/or an additive such as acetylene black. The outermost electrode layer4bhas a thickness of approximately 0.5 μm to 70 μm. For example, when the outermost electrode layer4bis a lithium foil, the thickness is preferably 0.5 μm to 20 μm, and when the outermost electrode layer4bis formed of graphite, the thickness of the layer4bis preferably 50 μm to 70 μm. The electrolyte layer5is formed between the innermost electrode layer4aand the outermost electrode layer4band is formed of any suitable electrolyte material. For example, the electrolyte material is lithium hexafluorophosphate (LiPF6), ethylene carbonate, propylene carbonate, ethyl methyl carbonate or any other suitable electrolyte material for a lithium-ion battery. The electrolyte layer5has a thickness of approximately 20 μm to 50 μm. The insulator6is formed of any suitable insulating material. For example, the insulator6is formed of polypropylene film or polyester film, preferably polypropylene. As shown inFIG.1, the insulator6is provided between the metal shell7and the outermost electrode layer4b. The insulator6may be formed in any suitable manner. For example, the insulator6may formed by electrophoretic deposition or three-dimensional printing. The insulator6has a thickness of approximately 50 μm to 100 μm. The metal shell7is formed of any suitable metal, such as aluminum, stainless steel or copper. For example, the metal shell7is preferably formed of aluminum due to its high conductivity. The metal shell7has a hexagonal shape due to the hexagonal shape of the battery formed by electrode layers4and electrolyte layer5. Although the metal shell7may have any suitable shape, a hexagonal shape is preferable in order to minimize the gaps or voids between multiple integrated supercapacitor-battery structures all having the same structure as the integrated supercapacitor-battery structure1when they are used as part of an energy or power storage bank. The metal shell7has a thickness of approximately 0.1 cm to 2 cm. The battery leads8aand8bare electrode leads for the battery portion of the integrated supercapacitor-battery structure1. The battery lead8ais a positive electrode lead that is electrically connected to the cathode layer5a. The battery lead8bis a negative electrode lead that is electrically connected to the anode layer5b. The battery leads8aand8bmay be formed of any suitable material, such as a metal. The supercapacitor leads9aand9bare electrode leads for the supercapacitor3of the integrated supercapacitor-battery structure1. The supercapacitor lead9ais a positive electrode lead that is electrically connected to the cathode of the supercapacitor3. The supercapacitor lead9bis a negative electrode lead that is electrically connected to the anode of the supercapacitor3. Second Embodiment Referring now toFIGS.2A-2D, an integrated supercapacitor-battery structure10in accordance with a second embodiment will now be explained. As shown inFIG.2A, the integrated supercapacitor-battery structure10includes a metal shell11, a first insulator12, a battery13, a third insulator32and a supercapacitor50. The integrated supercapacitor-battery structure10may be used alone or in combination with other similar integrated supercapacitor-battery structures to store energy, for example, in a power bank or an energy bank of a vehicle. In this embodiment, the battery13is formed around the supercapacitor50in a core-shell configuration such that the supercapacitor50forms a core and the battery13forms a shell around the supercapacitor50. However, it should be understood that the supercapacitor may alternatively be formed around the battery in a core-shell configuration such that the battery forms the core and the supercapacitor forms the shell. The metal shell11is formed of any suitable metal, such as aluminum, stainless steel or copper. For example, the metal shell11is preferably formed of aluminum due to its high conductivity. The metal shell11has a hexagonal shape due to the hexagonal shape of the battery13. Although the metal shell11may have any suitable shape, a hexagonal shape is preferable in order to minimize the gaps or voids between multiple integrated supercapacitor-battery structures all having the same structure as the integrated supercapacitor-battery structure10when they are used as part of an energy or power storage bank. The metal shell11has a thickness of approximately 0.1 cm to 2 cm. The first insulator12is formed of any suitable insulation material. For example, the first insulator12is formed of polypropylene, polyethylene, PVP, Teflon, or polyimide, preferably polypropylene. As shown inFIG.2A, the first insulator12is formed on the metal shell11between the metal shell11and the battery13. The first insulator12may be formed on the metal shell11in any suitable manner. For example, the first insulator12may be formed by electrophoretic deposition on the metal shell11. The first insulator12has a thickness of approximately 50 μm to 100 μm and is preferably a polypropylene film or a polyethylene film. The battery13includes an anode current collector14, a first anode16, a first electrolyte18, a first cathode20, a second insulator22, a second anode24, a second electrolyte26, a second cathode28and a cathode current collector30. It should be understood that the battery13may also include additional anode, cathode and electrolyte layers, as long as the anode and cathode layers are separated by an electrolyte and anode and cathode current collectors are provided at opposite ends of the battery13. The battery13is a lithium-ion battery. However, it should be understood that any suitable battery may be used as the battery13. For example, the battery13may alternatively be a solid state battery or a combination of a lithium-ion and all solid state battery. The anode current collector14, first anode16, first electrolyte18, first cathode20, second insulator22, second anode24, second electrolyte26, second cathode28and the cathode current collector30are formed in any suitable manner, for example, by electrophoretic deposition. The anode current collector14is formed on the first insulator12and is made of any suitable metal. For example, the anode current collector14may be formed of copper foil. The anode current collector14has a thickness of approximately 10 μm to 20 μm. The first anode16is formed on the anode current collector14and includes an anode active material. For example, the first anode16includes at least one of the following anode active materials: lithium, graphite, silicon, and lithium titanium oxide such as Li4Ti5O12. The first anode16may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The first anode16has a thickness of approximately 0.5 μm to 70 μm, preferably 10 μm to 30 μm. For example, when the first anode16is a lithium foil, the thickness is preferably 0.5 μm to 20 μm, and when the first anode16is formed of graphite, the thickness of the first anode16is preferably 50 μm to 70 μm. The first electrolyte18is formed on the first anode16between the first anode16and the first cathode20and is made of any suitable electrolyte material. For example, the electrolyte material is lithium hexafluorophosphate (LiPF6), ethylene carbonate, propylene carbonate, ethyl methyl carbonate or any other suitable electrolyte material for a lithium-ion battery. The first electrolyte18has a thickness of approximately 20 μm to 50 μm. The first cathode20is formed on the first electrolyte18and includes a cathode active material. For example, the first cathode20includes at least one of the following cathode active materials: LiTiS2, LiCoO2, LiNiO2, LiMnO2, LiNi0.33Mn0.33Co0.33O2(NMC), LiNi0.8Co0.15Al0.05O2, Li2MnO3, LiMn2O4, LiCo2O4, LiFePO4, and LiMnPO4, preferably NMC. The first cathode20may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The first cathode20has a thickness of approximately 10 μm to 150 μm, preferably 50 μm to 70 μm. As shown inFIG.2A, the second insulator22is formed on the first cathode20and is made of any suitable insulation material. For example, the second insulator22is formed of polypropylene film or polyethylene film, preferably polypropylene. The second insulator22has a thickness of approximately 50 μm to 100 μm. The second anode24is formed on the second insulator22and includes an anode active material. The anode active material of the second anode24may be the same as the anode active material of the first anode16. For example, the second anode24includes at least one of the following anode active materials: lithium, graphite, silicon, and lithium titanium oxide such as Li4Ti5O12. The second anode24may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The second anode24has a thickness of approximately 0.5 μm to 70 μm. For example, when the second anode24is a lithium foil, the thickness is preferably 0.5 μm to 20 μm, and when the second anode24is formed of graphite, the thickness of the second anode24is preferably 50 μm to 70 μm. The second electrolyte26is formed on the second anode24between the second anode24and the second cathode28and is made of any suitable electrolyte material. The second electrolyte26may be formed of the same electrolyte material as the first electrolyte18. For example, the electrolyte material is lithium hexafluorophosphate (LiPF6), ethylene carbonate, propylene carbonate, ethyl methyl carbonate or any other suitable electrolyte material for a lithium-ion battery. The second electrolyte26has a thickness of approximately 20 μm to 50 μm. The second cathode28is formed on the second electrolyte26and includes a cathode active material. The cathode active material of the second cathode28may be the same as the cathode active material of the first cathode20. For example, the second cathode28includes at least one of the following cathode active materials: LiTiS2, LiCoO2, LiNiO2, LiMnO2, LiNi0.33Mn0.33Co0.33O2(NMC), LiNi0.08Co0.15Al0.05O2, Li2MnO3, LiMn2O4, LiCo2O4, LiFePO4, and LiMnPO4, preferably NMC. The second cathode28may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The second cathode28has a thickness of approximately 50 μm to 70 μm. The cathode current collector30is formed on the second cathode28and is made of any suitable metal. The cathode current collector30may be formed of the same material as the anode current collector14. For example, the cathode current collector30may be formed of copper foil. The cathode current collector30has a thickness of approximately 10 μm to 20 μm. The third insulator32is formed on the cathode current collector30and is made of any suitable insulation material. For example, the third insulator32is formed of polypropylene film or polyethylene film, preferably polypropylene. The third insulator32has a thickness of approximately 50 μm to 100 μm. The supercapacitor50is a cylindrical structure, preferably a wound structure formed by winding a layered structure. As shown in detail inFIG.2B, the supercapacitor is a wound structure that includes an insulator52, a metal layer54, an anode56, a separator58, a cathode60, a metal layer62and an insulator64. The insulator52and insulator64are wound together with the metal layer54, the anode56, the separator58, the cathode60and the metal layer62to form the cylindrical supercapacitor50. FIG.2Cshows the supercapacitor50in an unwound state. The insulator52is formed of any suitable insulation material. For example, the insulator52is formed of polypropylene, PVP, Teflon, or polyimide, preferably polypropylene. The insulator52has a thickness of approximately 50 μm to 100 μm. The metal layer54is formed of any suitable metal material. For example, the metal layer54is formed of an aluminum foil or a copper foil. The metal layer54has a thickness of approximately 200 μm to 300 μm. The anode56is formed on the metal layer54and includes an anode active material. For example, the anode56has a porosity of approximately 10% to 40% and includes at least one of the following anode active materials: lithium, graphite, silicon, and lithium titanium oxide such as Li4Ti5O12. The anode56may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The anode56may include a single layer or a plurality of layers. The anode56is formed in any suitable manner. For example, the anode56may be formed by mixing the anode active material, the binder and the additive with a solvent such as N-methyl-2-pyrolidone (“NMP”), homogenizing the mixture and casting the homogenized mixture onto the metal layer54using a doctor blade. The total thickness of the anode56is approximately 20 μm to 50 μm. The separator58is formed between the anode56and the cathode60and is made of any suitable membrane for separating a cathode and an anode. For example, the separator may be formed of cellulose, polyethylene terephthalate (“PET”), propylene, polypropylene, PVDF, polyethylene, polyimide, or any mixture thereof, preferably propylene. The separator58has a thickness of approximately 20 μm to 50 μm. The cathode60is formed on the separator58. As shown in detail inFIG.2D, the cathode60includes five layers70,72,74,76and78. The five layers70,72,74,76and78have the same material composition. However, it should be understood that the cathode60can be formed of any suitable number of layers depending on the length of a unit cell, and the layers may have the same or different material compositions. Each of the layers70,72,74,76and78has a porosity of approximately 10% to 40% and includes a graphene-metal oxide composite material as a cathode active material. The graphene-metal oxide composite material includes graphene and from 5 wt % to 30 wt % of a metal oxide relative to a total weight of the composite material. The metal oxide includes at least one transition metal selected from the group consisting of: ruthenium, manganese, and cobalt. The metal oxide is preferably ruthenium oxide (RuO2). The graphene-metal oxide composite material may further include nitrogen. For example, the graphene-metal oxide composite material can be doped with nitrogen such that the composite material includes 1 wt % to 5 wt % of nitrogen. Each of the layers70,72,74,76and78may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The thickness of the layers70,72,74,76and78, as well as the number of the graphene-composite oxide layers included in the cathode60, can be varied as long as the total thickness of the cathode60is approximately 20 μm to 50 μm. In this embodiment, the supercapacitor50has an asymmetric configuration in which the anode56and the cathode60are formed of different active materials. However, it should be understood that the supercapacitor50may also have a symmetric configuration in which the anode56and the cathode60are both formed of a plurality of layers that include the graphene-composite oxide material as an active material. The cathode60is formed in any suitable manner. For example, the cathode60may be formed by mixing the graphene-metal oxide composite material, the binder and the additive with a solvent such as NMP, homogenizing the mixture and casting the homogenized mixture onto the metal layer62using a doctor blade. The metal layer62is formed of any suitable metal material. For example, the metal layer62is formed of an aluminum foil or a copper foil. The metal layer62has a thickness of approximately 200 μm to 300 μm. The insulator64is formed of any suitable insulation material. For example, the insulator64is formed of polypropylene, PVP, Teflon, or polyimide, preferably polypropylene. The insulator64has a thickness of approximately 50 μm to 100 μm. Third Embodiment Referring now toFIG.3, an integrated supercapacitor-battery structure100in accordance with a third embodiment will now be explained. As shown inFIG.3, the integrated supercapacitor-battery structure100includes a first insulator105, a battery110, a second insulator122and a supercapacitor150. The integrated supercapacitor-battery structure100may be used alone or in combination with other similar integrated supercapacitor-battery structures to store energy, for example, in a power bank or an energy bank of a vehicle. In this embodiment, the battery110is formed around the supercapacitor150in a core-shell configuration such that the supercapacitor150forms a core and the battery110forms a shell around the supercapacitor150. However, it should be understood that the supercapacitor may alternatively be formed around the battery in a core-shell configuration such that the battery forms the core and the supercapacitor forms the shell. Although not shown in the perspective view ofFIG.3, it should be understood that the edge of the first insulator105, the battery110, the second insulator122and the supercapacitor is surrounded by a metal shell having a hexagonal shape similar to the metal shell7of the first embodiment and the metal shell11of the second embodiment. For example, the metal shell in the integrated supercapacitor-battery structure100is formed of any suitable metal, such as aluminum, stainless steel or copper, preferably aluminum due to its high conductivity. The integrated supercapacitor-battery structure100of the third embodiment can be used with other integrated supercapacitor-battery structures all having the same structure as the integrated supercapacitor-battery structure100as part of an energy or power storage bank. The first insulator105is formed ofany suitable insulation material. For example, the first insulator105is formed of polypropylene film or polyethylene film, preferably polypropylene. The first insulator105has a thickness of approximately 50 μm to 100 μm. The battery110includes a cathode current collector112, a cathode114, an electrolyte116, an anode118and an anode current collector120. It should be understood that the battery110may also include additional anode, cathode and electrolyte layers, as long as the anode and cathode layers are separated by an electrolyte and anode and cathode current collectors are provided at opposite ends of the battery110. The battery110is an all solid state battery. However, it should be understood that any suitable battery may be used as the battery110. For example, the battery110may alternatively be a lithium-ion battery or a combination of a lithium-ion and all solid state battery. The cathode current collector112, cathode114, electrolyte116, anode118and the anode current collector120are formed in any suitable manner, for example, by electrophoretic deposition or three-dimensional printing, preferably electrophoretic deposition when the battery110is an all solid state battery. The cathode current collector112is formed on the first insulator105and is made of any suitable metal. For example, the cathode current collector112may be formed of copper foil. The cathode current collector112has a thickness of approximately 10 μm to 20 μm. The cathode114is formed on the cathode current collector112and includes a cathode active material. For example, the cathode114includes at least one of the following cathode active materials: LiS, LiCoO2, LiNi0.33Co0.33Mn9.33O2, LiMn2O4, and LiNi0.8Co0.15Al0.05O2. The cathode114may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The cathode114is a solid state composite and has a thickness of approximately 70 μm to 150 μm. The electrolyte116is formed on the cathode114between the cathode114and the anode118and is made of any suitable solid electrolyte material for an all-solid-state battery. For example, the solid electrolyte material is Li7La3Zr2O12, Li10GeP2S12, Li7La3Zr2O12, Li6.75La3Zr1.75Nb0.25O12, Li7.06La3Y0.06Zr1.94O12, Li6.6La3Zr1.6Sb0.4O12, Li6.28Al0.24La3Zr2O12, Li5.9Al0.2La3Zr1.75W0.25O12, Li6.25Ga0.25La3Zr2O12, Li6.20Ga0.30La2.95Rb0.05Zr2O12, LiZr2(PO4)3, Li3xLa2/3-xTiO3(“LLTO”), Li14Zn(GeO4)4, Li4-xGe1-xPxS4(0<x<1), and Li6PS5X (X=Cl, Br, or I). The electrolyte116has a thickness of approximately 5 μm to 30 μm. The anode118is formed on the electrolyte116and includes an anode active material. For example, the anode118includes at least one of the following anode active materials: Li, Si or graphite, preferably lithium. The anode118may also optionally include a binder such as PVDF and/or an additive such as acetylene black. The anode118has a thickness of approximately 10 μm to 30 μm. The insulator120is formed on the anode118and is made of any suitable insulation material. For example, the insulator120is formed of polypropylene film or polyethylene film, preferably polypropylene. The insulator120has a thickness of approximately 50 μm to 100 μm. The supercapacitor150has the same structure and composition as the supercapacitor50of the second embodiment. For example, the supercapacitor150is a cylindrical structure, preferably a wound structure formed by winding a layered structure that includes a first insulator, a first metal layer, an anode, a separator, a cathode, a second metal layer and a second insulator. Fourth Embodiment Referring now toFIGS.4A-4C, an integrated supercapacitor-battery energy bank200in accordance with a fourth embodiment will now be explained. As shown inFIG.4A, the integrated supercapacitor-battery energy bank200includes a metal frame210, and a plurality of integrated supercapacitor-battery structures215. Each of the integrated supercapacitor-battery structures215includes a metal support220, a battery230, battery leads235on opposite sides of the integrated supercapacitor-battery structure, a supercapacitor240and supercapacitor leads245on opposite sides of the integrated supercapacitor-battery structure. As shown inFIG.4A, the integrated supercapacitor-battery structures215form a network of integrated energy storage devices for the energy bank200. The integrated supercapacitor-battery structures215are each surrounded by a portion of the metal support220. The metal frame210is formed of any suitable metal, such as aluminum, stainless steel or copper. For example, the metal frame210is preferably formed of aluminum due to its high conductivity. The metal support220is a network of metal having a plurality of holes formed therein. As shown inFIG.2A, the holes each have a hexagonal shape designed to surround the integrated supercapacitor-battery structures215. Although the holes in the metal support220may have any suitable shape, a hexagonal shape is preferable in order to minimize the gaps or voids between the integrated supercapacitor-battery structures215. The metal support220has a thickness of approximately 0.1 cm to 2 cm. In this embodiment, for each of the integrated supercapacitor-battery structures215, the battery230is formed around the supercapacitor240in a core-shell configuration such that the supercapacitor240forms a core and the battery230forms a shell around the supercapacitor240. However, it should be understood that the supercapacitor may alternatively be formed around the battery in a core-shell configuration such that the battery forms the core and the supercapacitor forms the shell. The battery230may be the same as the battery13of the second embodiment and includes at least one anode layer, at least one electrolyte layer, and at least one cathode layer. It should be understood that the battery230may include a plurality of anode, cathode and electrolyte layers, as long as the anode and cathode layers are separated by an electrolyte. The battery230is a lithium-ion battery. However, it should be understood that any suitable battery may be used as the battery230. For example, the battery230may alternatively be a solid state battery or a combination of a lithium-ion and all solid state battery. The battery230may be formed in any suitable manner, for example by electrophoretic deposition. The battery leads235are electrode leads for the batteries230of the integrated supercapacitor-battery structures215. As shown inFIGS.4B and4C, the battery leads235include a positive electrode lead and a negative electrode lead on opposite sides of each battery230of the integrated supercapacitor-battery structures215. The battery leads235may be formed of any suitable material, such as a metal. As shown inFIG.4B, each of the integrated supercapacitor-battery structures215includes an insulator238formed between the battery230and the supercapacitor240and in a central portion of the supercapacitor240. The insulator238is formed of any suitable insulation material and may be the same as the insulator52or the insulator64of the second embodiment. For example, the insulator238is formed of polypropylene, PVP, Teflon, or polyimide, preferably polypropylene. The insulator238provided between the battery230and the supercapacitor240has a thickness of approximately 50 μm to 100 μm. The insulator238may be formed in any suitable manner. For example, the insulator238may be wound together with the layers of the supercapacitor240or formed by three-dimensional printing or additive manufacturing, preferably winding with the supercapacitor240. The supercapacitor240is a cylindrical structure, preferably a wound structure formed by winding a layered structure. The supercapacitor240may be the same as the supercapacitor50of the second embodiment and includes an anode, a cathode and a separator formed between the anode and the cathode. The supercapacitor leads245are electrode leads for the supercapacitors240of the integrated supercapacitor-battery structures215. As shown inFIGS.4B and4C, the supercapacitor leads245include a positive electrode lead and a negative electrode lead on opposite sides of each supercapacitor240of the integrated supercapacitor-battery structures215. The supercapacitor leads245may be formed of any suitable material, such as a metal. As shown inFIGS.4A and4B, in this embodiment, the energy bank200includes a plurality of battery leads235and a plurality of supercapacitor leads245that are each connected to each other to form flow passages therebetween for coolant to flow over the energy bank200. However, it should be understood that instead of a plurality of battery leads235and supercapacitor leads245, a single battery lead235may be provided on each of the top and bottom sides of the integrated supercapacitor-battery structures215to connect to each of the batteries230, and a single supercapacitor lead245may be provided on each of the top and bottom sides of the integrated supercapacitor-battery structures215to connect to each of the supercapacitors240. As shown inFIG.4C, the internal structure of the metal support220includes a wall250, a coolant outlet252, a top coolant space254, a plurality of vertical coolant passages256, a bottom coolant space258, and a coolant inlet260. The wall250is porous. The coolant outlet252is a pipe protruding out of the top of the metal support220. The coolant outlet252may be formed by any suitable material, such as a metal. For example, the coolant outlet252may be formed of the same material as the metal support220. The size of the coolant outlet252is not particularly limited and may be any suitable size for cooling the integrated supercapacitor-battery structures215. The top coolant space254, the plurality of vertical coolant passages256, and the bottom coolant space258are each formed as holes or voids in the wall250of the metal support220. The size and number of vertical coolant passages256is not particularly limited and may be any suitable size and number to cool the integrated supercapacitor-battery structures215. The coolant inlet260is a pipe protruding out of the bottom of the metal support220. The coolant inlet260may be formed by any suitable material, such as a metal. For example, the coolant inlet260may be formed of the same material as the metal support200. The size of the coolant inlet260is not particularly limited and may be any suitable size for cooling the integrated supercapacitor-battery structures215. In this embodiment, a coolant flows into the coolant inlet260to the bottom coolant space258, is distributed to each of the vertical coolant passages256, flows upward into the top coolant space254, and exits through the coolant outlet252. The coolant may be any suitable coolant for cooling the integrated supercapacitor-battery structures215. For example, the coolant may be air, water or refrigerant. In this embodiment, the metal support220is provided with the internal wall250having the structure for coolant flow shown inFIG.4Cfor each of the integrated battery-supercapacitor structures215. However, it should be understood that the internal wall250ofFIG.4Cmay be provided for only one or more than one but less than all of the integrated battery-supercapacitor structures215of the energy bank200, as long as the energy bank200is sufficiently cooled. Fifth Embodiment Referring now toFIGS.5A-5B, a vehicle300including an integrated supercapacitor-battery energy bank305in accordance with a fifth embodiment will now be explained. As shown inFIG.5A, the vehicle300includes an integrated supercapacitor-battery energy bank305having a metal frame310and a plurality of integrated supercapacitor-battery structures315. As shown in detail inFIG.5B, each of the integrated supercapacitor-battery structures315includes a metal support portion320, a battery330, battery leads335on opposite sides of the integrated supercapacitor-battery structure315, an insulator338, a supercapacitor340and supercapacitor leads345on opposite sides of the integrated supercapacitor-battery structure315. As shown inFIG.5Bthe integrated supercapacitor-battery structures315form a network of integrated energy storage devices for the energy bank305. The integrated supercapacitor-battery structures315are each surrounded by a portion of the metal support320. The metal frame310can be the same as the metal frame210of the fourth embodiment and is formed of any suitable metal, such as aluminum, stainless steel or copper. For example, the metal frame310is preferably formed of aluminum due to its high conductivity. The metal support320can be the same as the metal support220of the fourth embodiment and is a network of metal having a plurality of holes formed therein. As shown inFIG.5A, the holes each have a hexagonal shape designed to surround the integrated supercapacitor-battery structures315. Although the holes in the metal support320may have any suitable shape, a hexagonal shape is preferable in order to minimize the gaps or voids between the integrated supercapacitor-battery structures315. The metal support320has a thickness of approximately 0.1 cm to 2 cm. In this embodiment, for each of the integrated supercapacitor-battery structures315, the battery330is formed around the supercapacitor340in a core-shell configuration such that the supercapacitor340forms a core and the battery330forms a shell around the supercapacitor340. However, it should be understood that the supercapacitor may alternatively be formed around the battery in a core-shell configuration such that the battery forms the core and the supercapacitor forms the shell. The battery330may be the same as the battery230of the fourth embodiment and includes at least one anode layer, at least one electrolyte layer, and at least one cathode layer. It should be understood that the battery330may include a plurality of anode, cathode and electrolyte layers, as long as the anode and cathode layers are separated by an electrolyte. The battery330is a lithium-ion battery. However, it should be understood that any suitable battery may be used as the battery330. For example, the battery330may alternatively be a solid state battery or a combination of a lithium-ion and all solid state battery. The battery330may be formed in any suitable manner, for example by electrophoretic deposition. The battery leads335can be the same as the battery leads235of the fourth embodiment and are electrode leads for the batteries330of the integrated supercapacitor-battery structures315. As shown inFIG.5B, the battery leads335include a positive electrode lead and a negative electrode lead on opposite sides of each battery330of the integrated supercapacitor-battery structures315. The battery leads335may be formed of any suitable material, such as a metal. As shown inFIG.5B, each of the integrated supercapacitor-battery structures315includes an insulator338formed between the battery330and the supercapacitor340and in a central portion of the supercapacitor340. The insulator338is formed of any suitable insulation material and may be the same as the insulator238of the fourth embodiment. For example, the insulator338is formed of polypropylene, PVP, Teflon, or polyimide, preferably polypropylene. The insulator338provided between the battery330and the supercapacitor340has a thickness of approximately 50 μm to 100 μm. The insulator338may be formed in any suitable manner. For example, the insulator338may be wound together with the layers of the supercapacitor340. The supercapacitor340is a cylindrical structure, preferably a wound structure formed by winding a layered structure. The supercapacitor340may be the same as the supercapacitor240of the fourth embodiment and includes an anode, a cathode and a separator formed between the anode and the cathode. The supercapacitor leads345are electrode leads for the supercapacitors340of the integrated supercapacitor-battery structures315. As shown inFIG.5B, the supercapacitor leads345include a positive electrode lead and a negative electrode lead on opposite sides of each supercapacitor240of the integrated supercapacitor-battery structures215. The supercapacitor leads245may be formed of any suitable material, such as a metal. As shown inFIG.5B, in this embodiment, the energy bank305includes a plurality of battery leads335and a plurality of supercapacitor leads345that are each connected to each other to form flow passages370and380therebetween. However, it should be understood that instead of a plurality of battery leads335and supercapacitor leads345, a single battery lead335may be provided on each of the top and bottom sides of the integrated supercapacitor-battery structures315to connect to each of the batteries330, and a single supercapacitor lead345may be provided on each of the top and bottom sides of the integrated supercapacitor-battery structures315to connect to each of the supercapacitors340. The vehicle300also includes a powertrain350and a fan360. The powertrain350includes a gasoline engine, a power generator, an inverter and an electric motor. The vehicle300is a partial electric vehicle (“EV”) in which the wheels are completely driven by the electric motor and the gasoline engine is used to charge the integrated battery-supercapacitor structures325of the energy batik305. Thus, both the energy batik305and the gasoline engine are used to power the vehicle300. The fan360is used to cool the energy bank305. As shown in detail inFIG.5B, the fan360is used to provide air flow into the gas flow passages370and380between the battery leads335and the supercapacitor leads345. In understanding the scope of the present invention, the term “comprising” and its derivatives, as used herein, are intended to be open ended terms that specify the presence of the stated features, elements, components, groups, integers, and/or steps, but do not exclude the presence of other unstated features, elements, components, groups, integers and/or steps. The foregoing also applies to words having similar meanings such as the terms, “including”, “having” and their derivatives. Also, the terms “part,” “section,” “portion,” “member” or “element” when used in the singular can have the dual meaning of a single part or a plurality of parts. Also as used herein to describe the above embodiment(s), the following directional terms “top”, “bottom”, “forward”, “rearward”, “above”, “downward”, “vertical”, “horizontal” and “below” as well as any other similar directional terms refer to those directions of a vehicle equipped with the integrated battery-supercapacitor structure or an energy bank including a plurality of the integrated battery-supercapacitor structures. Accordingly, these terms, as utilized to describe the present invention should be interpreted relative to a vehicle equipped with the with the integrated battery-supercapacitor structure or an energy bank including a plurality of the integrated battery-supercapacitor structures. The term “configured” as used herein to describe a component, section or part of a device includes hardware and/or software that is constructed and/or programmed to carry out the desired function. The terms of degree such as “substantially”, “about” and “approximately” as used herein mean a reasonable amount of deviation of the modified term such that the end result is not significantly changed. While only selected embodiments have been chosen to illustrate the present invention, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made herein without departing from the scope of the invention as defined in the appended claims. For example, the size, shape, location or orientation of the various components can be changed as needed and/or desired. Components that are shown directly connected or contacting each other can have intermediate structures disposed between them. The functions of one element can be performed by two, and vice versa. The structures and functions of one embodiment can be adopted in another embodiment. It is not necessary for all advantages to be present in a particular embodiment at the same time. Every feature which is unique from the prior art, alone or in combination with other features, also should be considered a separate description of further inventions by the applicant, including the structural and/or functional concepts embodied by such feature(s). Thus, the foregoing descriptions of the embodiments according to the present invention are provided for illustration only, and not for the purpose of limiting the invention as defined by the appended claims and their equivalents. | 44,630 |
11862396 | DETAILED DESCRIPTION Definitions In the drawings, like reference numerals designate identical or corresponding parts throughout the several views. Further, as used herein, the words “a,” “an” and the like generally carry a meaning of “one or more,” unless stated otherwise. Furthermore, the terms “approximately,” “approximate,” “about,” and similar terms generally refer to ranges that include the identified value within a margin of 20%, 10%, or preferably 5%, and any values there between. Light Harvesting Supercapacitor According to a first aspect, the present disclosure is directed towards a self-charging light harvesting supercapacitor300that does not need any external bias for its operation. The terms “light harvesting supercapacitor” or a “supercapacitive solar cell” have been used interchangeably though out the draft. The light harvesting supercapacitor300also referred to as a “device” is fabricated using a TiO2semiconductor as a host material and polyaniline (PAM) nanoparticles coated on TiO2through adsorption method. The TiO2/PANI film deposited on an FTO conductive glass acts as a photo anode. A back electrode is an activated carbon with a large surface area on aluminum foil. The photo anode and the back electrode are joined together in an asymmetric configuration through an electrolyte layer, including a solid separator and an electrolyte. In general, the transparent substrate may be any suitable transparent substrate known to one of ordinary skill in the art. The transparent substrate may be rigid or may be flexible. The transparent substrate should be substantially transparent in the visible and/or UV regions. That is, the substrate should permit at least 75%, preferably at least 80%, preferably at least 85%, preferably at least 90%, preferably at least 95%, preferably at least 97.5%, preferably at least 99%, preferably at least 99.5% of incident visible and/or UV radiation to pass through the transparent substrate. Examples of suitable rigid transparent substrates include glass, FTO glass, ITO glass, sapphire (crystalline alumina), aluminum doped zinc oxide (AZO), yttria, silica, yttrium aluminum garnet (YAG), diamond, quartz, poly(methyl methacrylate), polycarbonate, polyethylene, polyethylene terephthalate, polylactic acid, polyvinyl butyral, poly(3,4-ethylenedioxythiophene) (PEDOT) and mixtures or copolymers thereof such as poly(3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA) and poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS), and the like. In some embodiments, the transparent substrate is fluorine-doped tin oxide (FTO) coated glass. In some embodiments, the transparent substrate is polyethylene terephthalate. In some embodiments, the polyethylene terephthalate is flexible and/or stretchable. The device300further includes a thin film of an active layer on the transparent substrate. The thickness of the active film may be in a range of a few hundred micrometers to nanometers. In some embodiments, the active layer comprises a TiO2sub-layer comprising the TiO2nanoparticles and a polyaniline (PANT) sub-layer comprising the polyaniline (PANT) nanoparticles. In some embodiments, the TiO2sub-layer is disposed on the transparent substrate and the polyaniline sub-layer is disposed on the TiO2sub-layer such that the polyaniline sub-layer does not contact the transparent substrate. In some embodiments, the active layer has a thickness of 1 to 500 μm, preferably 2.5 to 490 μm, preferably 5 to 480 μm, preferably 7.5 to 470 μm, preferably 10 to 460 μm, preferably 12.5 to 450 μm, preferably 15 to 440 μm, preferably 17.5 to 430 μm, preferably 20 to 420 μm, preferably 22.5 to 410, preferably 25 to 400 μm. For example, the active layer may have a thickness from 27.5 to 390 μm, or 30 to 380 μm, or 32.5 to 370 μm, or 35 to 360 μm, or 37.5 to 350 μm, or 40 to 340 μm, or 42.5 to 330 μm, or 45 to 320 μm, or 47.5 to 310 μm, or 50 to 300 μm, or 52.5 to 290 μm, or 55 to 280 μm, or 57.5 to 270 μm, or 60 to 260 μm, or 62.5 to 250 μm, or 65 or 240 μm, or 67.5 to 230 μm, or 70 to 220 μm, or 72.5 to 210 μm, or 75 to 200 μm. In some embodiments, the TiO2sub-layer has a thickness of 0.5 to 490 μm, preferably 1 to 480 μm, preferably 2.5 to 470 μm, preferably 5 to 460 μm, preferably 7.5 to 450 μm, preferably 10 to 440 μm, preferably 12.5 to 430 μm, preferably 15 to 420 μm, preferably 17.5 to 410 μm, preferably 17.5 to 400 μm, preferably 20 to 400 μm. For example, the TiO2sub-layer may have a thickness from 22.5 to 390 μm, or 25 to 380 μm, or 27.5 to 370 μm, or 30 to 360 μm, or 32.5 to 350 μm, or 35 to 340 μm, or 37.5 to 330 μm, or 40 to 320 μm, or 42.5 to 310 μm, or 45 to 300 μm, or 47.5 to 290 μm, or 50 to 280 μm, or 52.5 to 270 μm, or 55 to 260 μm, or 57.5 to 250 μm, or 60 to 240 μm, or 62.5 to 230 μm, or 65 to 220 μm, or 67.5 to 210 μm, or 70 to 200 μm. In some embodiments, the polyaniline sub-layer has a thickness of 0.5 to 490 μm, preferably 1 to 480 μm, preferably 2.5 to 470 μm, preferably 5 to 460 μm, preferably 7.5 to 450 μm, preferably 10 to 440 μm, preferably 12.5 to 430 μm, preferably 15 to 420 μm, preferably 17.5 to 410 μm preferably 17.5 to 400 μm preferably 20 to 400 μm. For example, the polyaniline sub-layer may have a thickness from 22.5 to 390 μm, or 25 to 380 μm, or 27.5 to 370 μm, or 30 to 360 μm, or 32.5 to 350 μm, or 35 to 340 μm, or 37.5 to 330 μm, or 40 to 320 μm, or 42.5 to 310 μm, or 45 to 300 μm, or 47.5 to 290 μm, or 50 to 280 μm, or 52.5 to 270 μm, or 55 to 260 μm, or 57.5 to 250 μm, or 60 to 240 μm, or 62.5 to 230 μm, or 65 to 220 μm, or 67.5 to 210 μm, or 70 to 200 μm. In general, the TiO2nanoparticles can be any shape known to one of ordinary skill in the art. Examples of suitable shapes the TiO2nanoparticles may take include spheres, spheroids, lentoids, ovoids, solid polyhedra such as tetrahedra, cubes, octahedra, icosahedra, dodecahedra, hollow polyhedral (also known as nanocages), stellated polyhedral (both regular and irregular, also known as nanostars), triangular prisms (also known as nanotriangles), hollow spherical shells (also known as nanoshells), tubes (also known as nanotubes), nanosheets, nanoplatelets, nanodisks, rods (also known as nanorods), and mixtures thereof. In the case of nanorods, the rod shape may be defined by a ratio of a rod length to a rod width, the ratio being known as the aspect ratio. For TiO2nanoparticles of the current invention, nanorods should have an aspect ratio less than 1000, preferably less than 750, preferably less than 500, preferably less than 250, preferably less than 100, preferably less than 75, preferably less than 50, preferably less than 25. Nanorods having an aspect ratio greater than 1000 are typically referred to as nanowires and are not a shape that the TiO2nanoparticles are envisioned as having in any embodiments. In some embodiments, the TiO2nanoparticles have uniform shape. Alternatively, the shape may be non-uniform. As used herein, the term “uniform shape” refers to an average consistent shape that differs by no more than 10%, by no more than 5%, by no more than 4%, by no more than 3%, by no more than 2%, by no more than 1% of the distribution of TiO2nanoparticles having a different shape. As used herein, the term “non-uniform shape” refers to an average consistent shape that differs by more than 10% of the distribution of TiO2nanoparticles having a different shape. In one embodiment, the shape is uniform and at least 90% of the TiO2nanoparticles are spherical or substantially circular, and less than 10% are polygonal. In another embodiment, the shape is non-uniform and less than 90% of the TiO2nanoparticles are spherical or substantially circular, and greater than 10% are polygonal. In some embodiments, the TiO2nanoparticles have a mean particle size of 1 to 100 nm, preferably 2.5 to 75 nm, preferably 5 to 60 nm, preferably 7.5 to 50 nm, preferably 10 to 40 nm, preferably 12.5 to 35 nm, preferably about 15 to 30 nm. In embodiments where the TiO2nanoparticles are spherical, the particle size may refer to a particle diameter. In embodiments where the TiO2nanoparticles are polyhedral, the particle size may refer to the diameter of a circumsphere. In some embodiments, the particle size refers to a mean distance from a particle surface to particle centroid or center of mass. In alternative embodiments, the particle size refers to a maximum distance from a particle surface to a particle centroid or center of mass. In some embodiments where the TiO2nanoparticles have an anisotropic shape such as nanorods, the particle size may refer to a length of the nanorod, a width of the nanorod, an average of the length and width of the nanorod. In some embodiments in which the TiO2nanoparticles have non-spherical shapes, the particle size refers to the diameter of a sphere having an equivalent volume as the particle. In some embodiments in which the TiO2nanoparticles have non-spherical shapes, the particle size refers to the diameter of a sphere having an equivalent diffusion coefficient as the particle. In some embodiments, the TiO2nanoparticles of the present disclosure are monodisperse, having a coefficient of variation or relative standard deviation, expressed as a percentage and defined as the ratio of the particle size standard deviation (σ) to the particle size mean (μ) multiplied by 100 of less than 25%, preferably less than 10%, preferably less than 8%, preferably less than 6%, preferably less than 5%, preferably less than 4%, preferably less than 3%, preferably less than 2%. In some embodiments, the TiO2nanoparticles of the present disclosure are monodisperse having a particle size distribution ranging from 80% of the average particle size to 120% of the average particle size, preferably 90-110%, preferably 95-105% of the average particle size. In some embodiments, the TiO2nanoparticles are not monodisperse. In general, the particle size may be determined by any suitable method known to one of ordinary skill in the art. In some embodiments, the particle size is determined by powder X-ray diffraction (PXRD). Using PXRD, the particle size may be determined using the Scherrer equation, which relates the full-width at half-maximum (FWHM) of diffraction peaks to the size of regions comprised of a single crystalline domain (known as crystallites) in the sample. In some embodiments, the crystallite size is the same as the particle size. For accurate particle size measurement by PXRD, the particles should be crystalline, comprise only a single crystal, and lack non-crystalline portions. Typically, the crystallite size underestimates particle size compared to other measures due to factors such as amorphous regions of particles, the inclusion of non-crystalline material on the surface of particles such as bulky surface ligands, and particles which may be composed of multiple crystalline domains. In some embodiments, the particle size is determined by dynamic light scattering (DLS). DLS is a technique which uses the time-dependent fluctuations in light scattered by particles in suspension or solution in a solvent, typically water to measure a size distribution of the particles. Due to the details of the DLS setup, the technique measures a hydrodynamic diameter of the particles, which is the diameter of a sphere with an equivalent diffusion coefficient as the particles. The hydrodynamic diameter may include factors not accounted for by other methods such as non-crystalline material on the surface of particles such as bulky surface ligands, amorphous regions of particles, and surface ligand-solvent interactions. Further, the hydrodynamic diameter may not accurately account for non-spherical particle shapes. DLS does have an advantage of being able to account for or more accurately model solution or suspension behavior of the particles compared to other techniques. In some embodiments, the particle size is determined by electron microscopy techniques such as scanning electron microscopy (SEM) or transmission electron microscopy (TEM). In some embodiments, the TiO2nanoparticles are crystalline by PXRD. In some embodiments, the crystalline TiO2nanoparticles adopt the anatase crystal structure. In some embodiments, the TiO2nanoparticles are present in the TiO2sub-layer as individual nnaoparticles. In some embodiments, the TiO2nanoparticles are present in the TiO2sublayer as a monolith, framework, extended network, or other 3D structure comprising TiO2nanoparticles connected to each other. Such connection can be, for example, as a result of agglomeration or sintering. Such connection may involve contact between adjacent TiO2nanoparticles such that there is no intervening material, such as organic binders, residual organic solvent, organic plasticizers, and the like. In some embodiments, the 3D structure is porous, the pores being formed from spaces between adjacent TiO2nanoparticles. In some embodiments, the TiO2sublayer is substantially free of organic material. In some embodiments, the TiO2sub-layer is disposed on the transparent substrate (FTO conductive glass) by a coating method. The coating method may dispose the TiO2nanoparticles as individual nanoparticles. Such individual nanoparticles may be in the form of a suspension or dispersion in an appropriate a dispersing medium, the suspension or dispersion taking the form of a spreadable material such as a viscous fluid, paste, or gel. Examples of components of suspensions or dispersion of TiO2nanoparticles include, but are not limited to solvents, surfactants, binders, humectants such as ethylene glycol and sorbitol, biocides, viscosity builders such as polyethylene glycol, colorants, pH adjusters, drying agents, defoamers or combinations thereof. Examples of surfactants include, but are not limited to polyether/polysiloxane copolymers, alkyl-aryl modified methyl-polysiloxanes, acylated polysiloxanes, sorbitan tristearate, sorbitan monopalmitate, sorbitan triolate, mono glyceride stearate, polyoxyethylene nonylphenyl ether, alkyl-di(aminoethyl) glycine, alkyl polyaminoethylglycine hydrochloride, 2-alkyl-n-carboxyethyl-N-hydroxyethyl imidazolinium betaine, and N-tetradecyl-N, N-substituted betaine Examples of binders include, but are not limited to epoxy resins, modified epoxy resins, polyester resins, novolak resins, cellulosic materials, hydroxypropylcellulose, hydroxyethylcellulose, hydroxypropylmethylcellulose, carboxymethylcellulose, copolymers of vinylidene chloride and acrylonitrile, acrylic acid resins, polyvinyl resins, silicone resins, polyamide resins, vinyl alcohol resins, resol resins, acetal resins, polyacrylonitrile resins, formaldehyde resins, polycarbonate resins, polyimide resins, polyethyleneimine, poly(ethyloxazoline), gelatin, starches, dextrin, amylogen, gum arabic, agar, algin, carrageenan, fucoidan, laminaran, corn hull gum, gum ghatti, karaya gum, locust bean gum, pectin, guar gum, epoxy resins produced by the condensation of epichlorohydrin and Bisphenol A or F, epoxy novolak resins, rubber modified epoxy resins, Bisphenol A based polyester resins, epoxydized o-cresylic novolaks, urethane modified epoxy resins, phosphate modified Bisphenol A epoxy resins, cellulose esters, copolymers of vinylidene chloride and acrylonitrile, poly(meth)acrylates, polyvinyl chloride, silicone resins, polyesters containing hydroxy or carboxy groups, polyamides comprising amino groups or carboxy groups, polymers and copolymers of vinyl alcohol, polyvinylimidazole, polyvinylpyrrolidone, polymers and copolymers of vinylphenol, acrylamide, methylol acrylamide, methylol methacrylamide, polyacrylic acid, methacrylic acid, hydroyethyl acrylate, hydroxethyl methacrylate, maleic anhydride/vinyl methyl ether copolymers, novolak resin, resol resin, polyvinyl phenol resin, copolymers of acrylic acid, polyacetal, poly(methyl methacrylate), polymethacrylic acid, polyacrylonitrile, cellulose acetate, cellulose acetate butyrate, cellulose acetate propionate, melamine formaldehyde resins, polycarbonates, polyimides and urea formaldehyde resins In some embodiments, heat treatment at an elevated temperature is used following the coating method to remove the non-TiO2components of the suspension or dispersion, such as organic solvents or binders. PANI is a conductive polymer and has been used as a light harvesting agent. In some embodiments, the PANI nanoparticles are prepared using pulsed laser ablation in liquid (PLAL). The pulsed laser ablation in liquid forms PANI nanoparticles from a bulk sample of PANI by ablation followed by stabilization of small particles in the liquid. In general, the PANI nanoparticles may be any suitable shape as described above. In some embodiments, the PANI nanoparticles are substantially spherical. In some embodiments, The PANI nanoparticles have a mean particle size of 5 to 200 nm, preferably 10 to 175 nm, preferably 15 to 150 nm, preferably to 130 nm, preferably 25 to 125 nm. In some embodiments, the PANI nanoparticles of the present disclosure are monodisperse, having a coefficient of variation or relative standard deviation, expressed as a percentage and defined as the ratio of the particle size standard deviation (σ) to the particle size mean (μ) multiplied by 100 of less than 25%, preferably less than 10%, preferably less than 8%, preferably less than 6%, preferably less than 5%, preferably less than 4%, preferably less than 3%, preferably less than 2%. In some embodiments, the PANI nanoparticles of the present disclosure are monodisperse having a particle size distribution ranging from 80% of the average particle size to 120% of the average particle size, preferably 90-110%, preferably 95-105% of the average particle size. In some embodiments, the PANI nanoparticles are not monodisperse. In general, the PANI nanoparticles may be formed of PANI having any suitable mean molecular weight. For example, the PANI nanoparticles may be formed from PANI having a mean molecular weight of ˜1,000, ˜5,000, ˜10,000, ˜15,000, ˜20,000, ˜25,000, ˜30,000, ˜35,000, ˜40,000, ˜50,000, ˜55,000, ˜60,000, ˜65,000, ˜70,000, ˜75,000, ˜80,000, ˜90,000, ˜100,000, ˜110,000, ˜125,000, ˜150,000, ˜175,000, ˜200,000, ˜225,000, or ˜250,000. Here, the mean molecular weight being “approximately X” or “˜X” refers to “X+/−10%”. In some embodiments, the mean molecular weight is a number average. In some embodiments, the mean molecular weight is a weight average. Polyaniline (PANT) may exist in a number of idealized oxidation states. Referring to structure (1) above, the oxidation state of the PANI may be determined by n and m, where 0≤n,m≤1. Leucoemeraldine with n=1, m=0 is the fully reduced state. Pernigraniline is the fully oxidized state (n=0, m=1) with imine links instead of amine links. The emeraldine form of polyaniline is intermediate between these two (0<n,m<1), ideally with n=m=0.5. Often, it referred to as emeraldine base (EB) if neutral, see structure (2) below. If protonated, it is typically referred to as emeraldine salt (ES), with the imine nitrogens protonated by an acid, see structure (3) below. In structure (3), X−represents anions associated with the positively charged PANI, such as halide anions, nitrate anions, carboxylate anions, or sulfonate anions. Leucoemeraldine and pernigraniline are poor conductors, even when doped with an acid. Preferably, the PANI is an emeraldine PANI. In preferred embodiments, the PANI is an emeraldine salt PANI. The electrolyte includes polyvinyl alcohol and at least one ionic material selected from the group consisting of phosphoric acid, sulfuric acid, hydrochloric acid, hydrobromic acid, hydroiodic acid, an alkali metal phosphate salt, an alkali metal sulfate salt, an alkali metal hydroxide, an alkali metal halide, and a mixture of a halogen and an alkali metal halide disposed on the active layer. In some embodiments, the ionic material is phosphoric acid. In some embodiments, the ionic material is a mixture of iodine (I2) and potassium iodide. Such a mixture may form triiodide (I3−) anions which are useful as charge carriers. Such an electrolyte may be referred to as an “iodide/triiodide” electrolyte. The solid separator may be any suitable porous material. In The solid separator may provide structural integrity, such as rigidity or a barrier or container for the electrolyte, to the electrolyte layer. The solid separator should be capable of allowing the electrolyte to exist within the pores of and about an exterior or the solid separator such that electrical continuity and therefore electrical conduction is possible through the electrolyte layer. Such electrical conduction may be mediated by the ionic substance which exists as positive and negative ions. In some embodiments, the positive and/or negative ions of the ionic substance are capable of moving within the electrolyte and/or the solid separator. Examples of suitable materials which may for the solid separator include, but are not limited to fabrics such as cotton, nylon, and polyesters; materials formed from glass fibers such as fiberglass; polymers such as polyethylene, polypropylene, poly(tetrafluoroethylene), and polyvinyl chloride; ceramics; and naturally occurring substances such as rubber, asbestos, and wood. In some embodiments, the solid separator is paper. In some embodiments, the electrolyte layer308includes a paper separator soaked with polyvinyl alcohol and phosphoric acid. In this context, “soaked” refers to the solid separator being exposed to the electrolyte such that the electrolyte enters and exists within the pores of the solid separator. In some embodiments, the soaking refers to immersing the paper in or otherwise exposing the paper to a mixture of the polyvinyl alcohol and the ionic substance such that the polyvinyl alcohol and ionic substance exist within spaces between the fibers which form the paper such that continuous pathways exist for electrical charge to flow from one side of the paper to another side of the paper, the electrical charge flow being mediated by the ionic substance and the polyvinyl alcohol. The device300further includes a carbon electrode disposed on the electrolyte layer. In some embodiments, the carbon electrode comprises a carbon material and a binder. Examples of carbon nanomaterials include carbon nanotubes, carbon nanobuds, carbon nanoscrolls, carbon dots, activated carbon, carbon black, conductive carbon, graphene, graphene oxide, reduced graphene oxide, and nanodiamonds. The carbon nanotubes may, in general, be any suitable carbon nanotubes known to one of ordinary skill in the art. Carbon nanotubes may be classified by structural properties such as the number of walls or the geometric configuration of the atoms that make up the nanotube. Classified by their number of walls, the carbon nanotubes can be single-walled carbon nanotubes (SWCNT) which have only one layer of carbon atoms arranged into a tube, or multi-walled carbon nanotubes (MWCNT), which have more than one single-layer tube of carbon atoms arranged so as to be nested, one tube inside another, each tube sharing a common orientation. Closely related to MWNTs are carbon nanoscrolls. Carbon nanoscrolls are structures similar in shape to a MWCNT, but made of a single layer of carbon atoms that has been rolled onto itself to form a multi-layered tube with a free outer edge on the exterior of the nanoscroll and a free inner edge on the interior of the scroll and open ends. The end-on view of a carbon nanoscroll has a spiral-like shape. For the purposes of this disclosure, carbon nanoscrolls are considered a type of MWCNT. Classified by the geometric configuration of the atoms that make up the nanotube, carbon nanotubes can be described by a pair of integer indices n and m. The indices n and m denote the number of unit vectors along two directions in the honeycomb crystal lattice of a single layer of carbon atoms. If m=0, the nanotubes are called zigzag type nanotubes. If n=m, the nanotubes are called armchair type nanotubes. Otherwise they are called chiral type nanotubes. In some embodiments, the carbon nanotubes are metallic. In other embodiments, the carbon nanotubes are semiconducting. In some embodiments, the carbon nanotubes are SWCNTs. In other embodiments, the carbon nanotubes are MWCNTs. In some embodiments, the carbon nanotubes are carbon nanoscrolls. In some embodiments, the carbon nanotubes are zigzag type nanotubes. In alternative embodiments, the carbon nanotubes are armchair type nanotubes. In other embodiments, the carbon nanotubes are chiral type nanotubes. Graphene may be in the form of graphene nanosheets. Graphene nanosheets may consist of stacks of graphene sheets, the stacks having an average thickness and a diameter. In some embodiments, the stacks comprise 1 to 60 sheets of graphene, preferably 2 to 55 sheets of graphene, preferably 3 to 50 sheets of graphene. Graphene may be in the form of graphene particles. The graphene particles may have a spherical shape, or may be shaped like blocks, flakes, ribbons, discs, granules, platelets, angular chunks, rectangular prisms, or some other shape. In some embodiments, the graphene particles may be substantially spherical, meaning that the distance from the graphene particle centroid (center of mass) to anywhere on the graphene outer surface varies by less than 30%, preferably by less than 20%, more preferably by less than 10% of the average distance. In some embodiments, the graphene particles may be in the form of agglomerates. Graphene may be pristine graphene. Pristine graphene refers to graphene that has not been oxidized or otherwise functionalized. Pristine graphene may be obtained by methods such as exfoliation, chemical vapor deposition synthesis, opening of carbon nanotubes, unrolling of carbon nanoscrolls, and the like. Alternatively, the graphene may be functionalized graphene. Functionalized graphene is distinguished from pristine graphene by the presence of functional groups on the surface or edge of the graphene that contain elements other than carbon and hydrogen. In other alternative embodiments, the graphene is graphene oxide. Graphene oxide refers to graphene that has various oxygen-containing functionalities that are not present in pristine graphene. Examples of such oxygen-containing functionalities include epoxides, carbonyl, carboxyl, and hydroxyl functional groups. Graphene oxide is sometimes considered to be a type of functionalized graphene. Alternatively, the graphene may be reduced graphene oxide. Reduced graphene oxide (rGO) refers to graphene oxide that has been chemically reduced. It is distinct from graphene oxide in it contains substantially fewer oxygen-containing functionalities compared to graphene oxide, and it is distinct from pristine graphene by the presence of oxygen-containing functionalities and structural defects in the carbon network. Reduced graphene oxide is sometimes considered to be a type of functionalized graphene. In preferred embodiments, the carbon nanomaterial is reduced graphene oxide. The reduced graphene oxide may exist as nanosheets, particles having a spherical shape, or may be shaped like blocks, flakes, ribbons, discs, granules, platelets, angular chunks, rectangular prisms, or some other shape as described above, agglomerates as described above, or any other shape known to one of ordinary skill in the art. The carbon nanomaterial may be activated carbon. Activated carbon refers to a form of porous carbon having a semi-crystalline, semi-graphitic structure and a large surface area. Activated carbon may be in the form of particles or particulate aggregates having micropores and/or mesopores. Activated carbon typically has a surface area of approximately 500 to 5000 m2/g. The activated carbon particles may have a spherical shape, or may be shaped like sheets, blocks, flakes, ribbons, discs, granules, platelets, angular chunks, rectangular prisms, or some other shape. In some embodiments, the activated carbon particles may be substantially spherical, meaning that the distance from the activated carbon particle centroid (center of mass) to anywhere on the activated carbon particle outer surface varies by less than 30%, preferably by less than 20%, more preferably by less than 10% of the average distance. The carbon nanomaterial may be carbon black. Carbon black refers to having a semi-crystalline, semi-graphitic structure and a large surface area. Carbon black may be distinguished from activated carbon by a comparatively lower surface area, typically 15 to 500 m2/g for carbon black. Additionally, carbon black may lack the requisite micropores and mesopores of activated carbon. The carbon black particles may have a spherical shape, or may be shaped like sheets, blocks, flakes, ribbons, discs, granules, platelets, angular chunks, rectangular prisms, or some other shape. The carbon nanomaterial may be conductive carbon. Conductive carbon refers to a specific type of activated carbon or carbon black which is amorphous and is a good conductor of electricity, typically having a volume resistivity of 0.01 to 0.1 Ωm. In some embodiments, a single type of carbon nanomaterial is used as described above. In alternative embodiments, mixtures of types of carbon nanomaterials are used. Examples of binders commonly used with carbon electrodes include, but are not limited to polyvinylalochol (PVA), sulfosuccinic-acid (SSA), polytetrafluoroethylene (PTFE), polyvinylidenefluoride (PVDF), and phenolic/resol type polymers crosslinked with, for example poly(methyl vinyl ether-alt-maleic anhydride), poly(methyl vinyl ether-alt-maleic acid), and/or poly(acrylamide-co-diallyldimethylammonium chloride) (PDADAM). In some embodiments, the carbon electrode comprises activated carbon, conductive carbon, and PVDF. The light harvesting supercapacitor further includes a metal layer disposed on the (activated) carbon electrode. In general the metal lay may be any suitable metal known to one of ordinary skill in the art. In some embodiments, the metal layer is an aluminum layer. In some embodiments, the light harvesting supercapacitor has a specific capacitance of 75 to 125 F/g, preferably 85 to 122.5 F/g, preferably 95 to 120 F/g, preferably 100 to 117.5 F/g, preferably 105 to 115 F/g, preferably 107.5 to 112.5 F/g, preferably 109 to 110 F/g at a current density of 0.3 to 0.5 A/g, preferably 0.325 to 0.475 A/g, preferably 0.35 to 0.45 A/g, preferably 0.375 to 0.425 A/g, preferably 0.4 A/g. In some embodiments, the light harvesting supercapacitor has an energy density of 17.5 to 27.5 W·h/Kg, preferably 18 to 27 W·h/Kg, preferably 18.5 to 26.5 W·h/Kg, preferably 19 to 26 W·h/Kg, preferably 19.5 to 25.5 W·h/Kg, preferably 20 to 25 W·h/Kg, preferably 20.5 to 24.5 W·h/Kg, preferably 21 to 24 W·h/Kg, preferably 21.5 to 23.5 W·h/Kg, preferably 22 to 23 W·h/Kg, preferably 22.5 to 22.75 W·h/Kg, preferably 22.6 W·h/Kg. In some embodiments, the light harvesting supercapacitor has a power density of 11,000 to 14,000 W/Kg, preferably 11,250 to 13,750 W/Kg, preferably 11,500 to 13,500 W/Kg, preferably 11,750 to 13,250 W/Kg, preferably 12,000 to 13,000 W/Kg, preferably 12,100 to 12,900 W/Kg, preferably 12,200 to 12,800 W/Kg, preferably 12,250 to 12,750 W/Kg, preferably 12,300 to 12,700 W/Kg, preferably 12,350 to 12,650 W/Kg, preferably 12,400 to 12,600 W/Kg, preferably 12,450 to 12,550 W/Kg preferably 12,500 W/Kg. In some embodiments, the light harvesting supercapacitor has a bandgap of 2.5 to 2.95 eV, preferably 2.55 to 2.85 eV, preferably 2.6 to 2.8 eV, preferably 2.625 to 2.775 eV, preferably 2.65 to 2.75 eV, preferably 2.675 to 2.725 eV, preferably 2.70 eV. In some embodiments, the device300of the present disclosure forms part of a photovoltaic cell. The photovoltaic cell may further comprise any other suitable components which would be recognized by one of ordinary skill in the art as useful for forming a solar cell using the light harvesting supercapacitor. Method of Forming the Light Harvesting Supercapacitor Referring toFIG.1, a schematic flow diagram of the method100of preparing the light harvesting supercapacitor300is illustrated. The order in which the method100is described is not intended to be construed as a limitation, and any number of the described method steps may be combined in any order to implement the method100. Additionally, individual steps may be removed or skipped from the method100without departing from the spirit and scope of the present disclosure. At step102, the method100includes coating the transparent substrate with a paste comprising the TiO2nanoparticles to form a coated substrate. The transparent substrate may be as described above. The paste comprising the TiO2nanoparticles may be as described above. In some embodiments, the transparent substrate is FTO coated glass. In general, the method of coating may be any suitable method of coating a substrate with a paste. Examples of such coating method include, but are not limited to, spin coating, doctor blade-coating, dip coating, screen printing, inkjet printing, aerosol jet printing, metering rod coating, slot casting, and spray coating. In some embodiments, the coating is doctor blade coating. At step104, the method100includes heating the coated substrate to form an intermediate structure. In some embodiments, the coated substrate is heated to a temperature range of 400° C. to 600° C., preferably 425 to 575° C., preferably 450 to 550° C., preferably 475 to 525° C., preferably 490 to 510° C., preferably 500° C. to form the intermediate structure. The heating may be performed by any of the methods conventionally known in the art. The heating may be useful for removing non-TiO2constituents of the paste as described above. At step106, the method100includes immersing the first intermediate structure in a dispersion comprising the PANI nanoparticles and a solvent to form a first device portion. In some embodiments, the thickness of the first device portion can be adjusted by controlling the size of the PANI nanoparticles. In some embodiments, the PANI nanoparticles are prepared by a pulsed laser ablation in liquid (PLAL) technique. The PLAL technique involves exposing a suspension of PANI in a nanoparticle synthesis solvent to a pulsed laser having a wavelength of 520 nm to 550 nm, preferably 522 to 546 nm, preferably 524 to 542 nm, preferably 526 to 538 nm, preferably 528 to 536 nm, preferably 530 to 534 nm, preferably 532 nm and a pulse energy of 275 mJ/pulse to 425 mJ/pulse, preferably 280 to 420 mJ/pulse, preferably 285 to 415 mJ/pulse, preferably 290 to 410 mJ/pulse, preferably 295 to 405 mJ/pulse, preferably 300 to 400 mJ/pulse, preferably 305 to 395 mJ/pulse, preferably 310 to 390 mJ/pulse, preferably 315 to 385 mJ/pulse, preferably 320 to 380 mJ/pulse, preferably 325 to 375 mJ/pulse, preferably 330 to 370 mJ/pulse, preferably 335 to 365 mJ/pulse, preferably 340 to 360 mJ/pulse, preferably 345 to 355 mJ/pulse, preferably 350 mJ/pulse. In some embodiments, the nanoparticle synthesis solvent is an alcohol having 1 to 4 carbon atoms. Examples of such alcohols include, but are not limited to methanol, ethanol, n-propanol, 2-propanol, n-butanol, 2-butanol, ethylene glycol, propylene glycol, diethylene glycol, and glycerol. In some embodiments, the alcohol having 1 to 4 carbon atoms is ethanol. In some embodiments, the polyaniline is present in the suspension in an amount of 1 to 4 mg/mL, preferably 1.25 to 3.75 mg/mL, preferably 1.5 to 3.5 mg/mL, preferably 1.75 to 3.25 mg/mL, preferably 2 to 3 mg/mL, preferably 2.1 to 2.9 mg/mL, preferably 2.2 to 2.8 mg/mL, preferably 2.3 to 2.7 mg/mL, preferably 2.4 to 2.6 mg/mL, preferably 2.5 mg/mL of suspension. In some embodiments, the first intermediate structure is immersed in the dispersion for a period of 12 to 48 hours. The first intermediate structure i.e., the FTO conductive glass disposed with the TiO2/PANI film forms the photoanode. At step108, the method100includes disposing the carbon electrode on a metal substrate to form a second device portion. In general, the disposing may be performed by any suitable technique, such as those described above. In some embodiments, the carbon electrode includes an activated carbon, conductive carbon, and PVDF, as described above. In such embodiments, the activated carbon, conductive carbon, and PVDF may be mixed to form a composite material which is then disposed on the metal substrate. In some embodiments, the metal substrate is aluminum as described above. The carbon electrode together with the metal substrate forms the back electrode in the device300. At step110, the method100includes sandwiching the electrolyte layer308between the active layer (30of the first device portion and the carbon electrode310of the second device portion to form the light harvesting supercapacitor300. The electrolyte layer308includes a solid separator and an electrolyte comprising polyvinyl alcohol and at least one ionic material selected from the group consisting of phosphoric acid, sulfuric acid, hydrochloric acid, hydrobromic acid, hydroiodic acid, an alkali metal phosphate salt, an alkali metal sulfate salt, an alkali metal hydroxide, an alkali metal halide, and a mixture of a halogen and an alkali metal halide disposed on the active layer. The examples below are intended to further illustrate protocols for preparing and characterizing the light harvesting supercapacitor and are not intended to limit the scope of the claims. Where a numerical limit or range is stated herein, the endpoints are included. Also, all values and subranges within a numerical limit or range are specifically included as if explicitly written out. Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that, within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein. EXAMPLES The following examples describe and demonstrate exemplary embodiments of the light harvesting self-charging supercapacitor as described herein. The examples are provided solely for the purpose of illustration and are not to be construed as limitations of the present disclosure, as many variations thereof are possible without departing from the spirit and scope of the present disclosure. Materials Used PANI (emeraldine salt), ethanol, Acetone and isopropanol were purchased from Sigma Aldrich™. TiO2nano paste and FTO conductive glass slides were purchased from Solaronix. 1-Methyl-2-pyrrolidone (NMP), N,N-Dimethyl acetamide (DMAc) were purchased from Merck™, PVDF (polyvinylidene fluoride) binder, HSV 900, timical super C65 (conductive additive) and active carbon were purchased from MTI Corp™. All the chemicals were of analytical grade and were used without any further purification Method of Preparation of Photo Anode Facile, green and environmentally friendly method (200) of pulsed laser ablation (PLAL) in liquid was used to synthesize nano PANI. For this purpose, at step202, 50 mg of PANI was dispersed in 20 ml of ethanol followed by 1 hour of sonication to obtain a mixture. At step204, the mixture was further irradiated by nano second Nd-YAG laser operating at a second harmonic (532 nm wavelength) under the fluence of 350 mJ energy per pulse. At step206, the mixture was stirred continuously using a magnetic stirrer to achieve homogenous ablation (PANT nano-dispersion). The nano synthesis was completed after 20 min of laser ablation. FTO conductive glass slide was used as a substrate to deposit TiO2/PANI film. For this purpose, the FTO glass was cleaned with de-ionized water, ethanol, acetone and isopropanol followed by 30 min of sonication to remove all possible organic pollutants. At step208, TiO2nano paste was coated on FTO slide using a spin coater (provided by Laurell technology corp.). The total area coated by TiO2nano paste was maintained at 1 square centimeter (cm2). At step210, the FTO slide with TiO2film was heated at a temperature of 500° C. to remove all the organic binders. At step212, the FTO conductive glass slide with the TiO2film was cooled slowly to room temperature to obtain a TiO2film. At step214, the TiO2film was immersed in PANI nano-dispersion for 24 hours to obtain a PANI adsorbed film (216). Architecture of the Light Harvesting Supercapacitor The device300was fabricated in an asymmetric configuration (FTO/TiO2+PANI/separator/AC/Al) as shown inFIG.3. The photo anode was prepared by the PLAL method, by immersing the FTO conductive glass slide302with the TiO2film304into PANI dispersion306. The back electrode or a counter electrode was prepared by coating activated carbon slurry310on Al current collector using an automatic doctor blade coating machine. An activated carbon paste310was prepared using PVDF, active carbon (AC), conductive carbon (CC) and NMP. The electrolyte layer308was sandwiched between the active layer of the first device portion and the carbon electrode310of the second device portion to form the light harvesting supercapacitor300. The electrolyte layer308was polyvinyl alcohol-phosphoric acid (PVA-H3PO4), which acted as a mediator between the photo anode and the back electrode. Schematic Diagram Explaining Light Harvesting Mechanism FIGS.4A-4Bare schematic diagrams depicting the light harvesting and charge storage ability of the device300. TiO2is a well-known semi-conductor with a band gap in UV region. On the other hand, the PANI is a narrow band gap semi-conductor with its conduction band slightly above the conduction band of the TiO2according to eV v/s NHE scale. When the light is turned ON, PANI absorbs a photon in the visible region and excites its electron to the conduction band of the PANI306. This electron is then transferred to the conduction band of the TiO2304and is further transferred to FTO coated glass302. This electron further moves to the outer circuit and reaches the counter electrode (310and312). The resistance between the counter electrode (310and312) and photo anode (302,304, and306) was high enough to delay the recombination of that electron, thereby giving a temporary effect of charge storage (FIG.4A). When the light is turned OFF, the device300showed capacitance because of the slow recombination rate of electrons and holes (FIG.4B). Material Characterization The optical properties of the synthesized materials were investigated using UV-vis spectrophotometry. The TiO2shows an absorption peak in the UV region of the spectrum504because of its large band gap, well known from the literature. The addition of PANI to TiO2shows an extra wide peak in the visible region of light502because of the small band gap energy of PANI (as shown in theFIG.5. The absorption peak in the visible region confirms the optical activity of the device300in the visible region of spectrum. The morphology of the synthesized nano material was investigated using TEM. The nano sized PANI particles after laser ablation can be observed in theFIG.6Aby contrast produced by the grain boundaries of the nano particles. The nano spheres of TiO2with size ranging from 25 nm to 50 nm have been shown in theFIG.6B. The crystal structure of the synthesized nano materials was studied using XRD, and the results of this study were presented in theFIG.7A. The XRD spectra for FTO conductive glass706, TiO2nano powder704, and TiO2/PANI coated FTO conductive glass or TiO2sensitized PANI702is shown inFIG.7A. TiO2major peaks at101,004,200,105, and211confirm its anatase phase. The corresponding peaks of FTO702and TiO2704have been mentioned in the spectrum of the composite sample. The XRD spectrum for pure PANI708is depicted in theFIG.7B. Device Characterization The supercapacitive solar cell or the device300was further characterized using cyclic voltammetry (CV), galvanostatic charge discharge (GCD) and electrochemical impedance spectroscopy (EIS). The CV curves for the device300at different scan rates ranging for 400 mV s−1(818), 300 mV s−1(816), 250 mV s−1(814), 200 mV s−1(812), 150 mV s−1(810), 100 mV s−1(808)), 75 mV s−1(806), 50 mV s−1(804), and 20 mV s−1(802) in a potential range of 0 V to 1.5 V are depicted in theFIG.8. The CV curves show no extra unwanted peak demonstrating the stability of the device300within the applied potential window. EIS was used to understand the resistance analysis of the device300by drawing a Nyquist plot as shown inFIG.9A. The Nyquist plot determines the internal resistance of the device300. The enlarged graph was shown in theFIG.9B. The non-zero intersection on the X-axis that is around ˜28Ω shows the resistance offered by the FTO electrode. The radius of the semi-circle in the Nyquist plot gives charge transfer resistance that is measured to be Rct≈4.5Ω. FIG.10Ashows the GCD measurement of the device300in a potential window of 0 V to 1.5 V at different current densities ranging from 0.4 A/g to 4.2 A/g, particularly, 0.4 A g−1(1002), 0.8 A g−1(1004), c) 1.3 A g−1(1006), 2.5 A g−1(1008), and e) 4.2 A g−1(1010). The dependence of the specific capacitance (Cs) on the current density value has been explained by plotting a graph between specific capacitance and current density, as shown inFIG.10B. The specific capacitance decreased only slightly by increasing the current density indicating that the device300works efficiently even at higher current densities. Self-Charging Under Visible Light The device300was tested under visible light regarding self-charging ability using 150-watt xenon lamp, which is comparable to sunlight. The device300demonstrated excellent charging and discharging response under visible light as shown in theFIG.11A. The device300was charged to −270 mV by shining light on it, and then the device300was allowed to discharge by turning off the light. The photo generated current under successive ON and OFF cycles of light is depicted in theFIG.11B. The photo generated current went on increasing with time and reached to a saturation value of 0.22 mA, comparable to the current produced under sunlight. Self-Charging Under UV The device300was tested under UV regarding self-charging and photo generated current as shown in theFIG.12AandFIG.12B. The device300charges itself up to −150 mV just by shining UV on it without any external bias. The discharging time was found to be even higher than charging time, that is more or less a battery like behavior, demonstrating a longer working time of the device300, once it is charged, as shown in theFIG.12A. The UV generated current under successive ON and OFF cycles of UV is depicted in theFIG.12B. The device300reached a maximum current at ˜0.16 mA as soon as the UV was shined on it, and it remained constant for the rest of the cycles. Iodide/Tri-Iodide Electrolyte-Based Device with the Same Architecture Another device having iodide/tri-iodide as a electrolyte (a light harvesting material) was fabricated. Since both the photo anode and the electrolyte contribute to the light harvesting ability of the device, it was believed that this device would enhance the light harvesting ability. The photo generated current of this device under UV (1304) and visible light (1302) was shown in theFIG.13A. The UV generated current (1304) was found to be very high (i.e., 1.1 mA), whereas the visible light generated current (1302) was around 0.2 mA. No response was observed under dark the conditions (1306), as can be observed from theFIG.13B, confirming the light responsive behavior of the device300. The CV curve for this device is obtained in a potential window of 0.2 V and 0.1 mV/s scan rate as shown in theFIG.14. The charging and discharging measurement of the device300was obtained using Metrohm auto lab in a potential window of 0.4 V, as shown in theFIG.15. The charging and discharging were very fast demonstrating the true capacitive nature of the device. | 47,969 |
11862397 | DETAILED DESCRIPTION In order to achieve downsizing and high capacity, recently, a thickness of internal electrode layers and a thickness of dielectric layers are reduced. Thus, the high capacity is achieved. However, insulation resistance may be degraded due to breaking of the internal electrode layers (for example, see Samantaray, Malay M. et al., Journal of the American Ceramic Society 95 1 (2012):264-268). Insulation resistance of the dielectric layers may be degraded. In order to solve the problem, a different element is solid-solved in a dielectric material, and the insulation resistance is improved (for example, see Hiroshi Kishi et al., 2003 Jpn. J. Appl. Phys. 42 1). However, in the above-mentioned technologies, the degradation of the reliability caused by the breaking of the internal electrode layers is not solved. An interface resistance between the internal electrode layers and the dielectric layers is larger than a grain boundary resistance and a resistance inside of a grain of the dielectric layers. Therefore, the above-mentioned technologies are not sufficient because the grain boundary resistance and the resistance inside of the grain are reduced when the thickness of the dielectric layers is reduced. A description will be given of an embodiment with reference to the accompanying drawings. EMBODIMENT FIG.1illustrates a perspective view of a multilayer ceramic capacitor100in accordance with an embodiment, in which a cross section of a part of the multilayer ceramic capacitor100is illustrated.FIG.2illustrates a cross sectional view taken along a line A-A ofFIG.1.FIG.3illustrates a cross sectional view taken along a line B-B ofFIG.1. As illustrated inFIG.1toFIG.3, the multilayer ceramic capacitor100includes a multilayer chip10having a rectangular parallelepiped shape, and a pair of external electrodes20aand20bthat are respectively provided at two end faces of the multilayer chip10facing each other. In four faces other than the two end faces of the multilayer chip10, two faces other than an upper face and a lower face of the multilayer chip10in a stacking direction are referred to as side faces. The external electrodes20aand20bextend to the upper face, the lower face and the two side faces of the multilayer chip10. However, the external electrodes20aand20bare spaced from each other. InFIG.1, an X-axis direction (first direction) is a longitudinal direction of the multilayer chip10. The X-axis direction is a direction in which the external electrode20ais opposite to the external electrode20b. A Y-axis direction (second direction) is a width direction of the internal electrode layers. A Z-axis direction is a stacking direction. The X-axis direction, the Y-axis direction and the Z-axis direction are vertical to each other. The multilayer chip10has a structure designed to have dielectric layers11and internal electrode layers12alternately stacked. The dielectric layer11includes ceramic material acting as a dielectric material. The internal electrode layers12include a base metal material. End edges of the internal electrode layers12are alternately exposed to a first end face of the multilayer chip10and a second end face of the multilayer chip10that is different from the first end face. In the embodiment, the first end face is opposite to the second end face. The external electrode20ais provided on the first end face. The external electrode20bis provided on the second end face. Thus, the internal electrode layers12are alternately conducted to the external electrode20aand the external electrode20b. Thus, the multilayer ceramic capacitor100has a structure in which a plurality of dielectric layers11are stacked and each two of the dielectric layers11sandwich the internal electrode layer12. In a multilayer structure of the dielectric layers11and the internal electrode layers12, two of the internal electrode layers12are positioned at outermost layers in a stacking direction. The upper face and the lower face of the multilayer structure that are the internal electrode layers12are covered by cover layers13. A main component of the cover layer13is a ceramic material. For example, a main component of the cover layer13is the same as that of the dielectric layer11. For example, the multilayer ceramic capacitor100may have a length of 0.25 mm, a width of 0.125 mm and a height of 0.125 mm. The multilayer ceramic capacitor100may have a length of 0.4 mm, a width of 0.2 mm and a height of 0.2 mm. The multilayer ceramic capacitor100may have a length of 0.6 mm, a width of 0.3 mm and a height of 0.3 mm. The multilayer ceramic capacitor100may have a length of 1.0 mm, a width of 0.5 mm and a height of 0.5 mm. The multilayer ceramic capacitor100may have a length of 3.2 mm, a width of 1.6 mm and a height of 1.6 mm. The multilayer ceramic capacitor100may have a length of 4.5 mm, a width of 3.2 mm and a height of 2.5 mm. However, the size of the multilayer ceramic capacitor100is not limited. The dielectric layers11are mainly composed of a ceramic material that is expressed by a general formula ABO3and has a perovskite structure. The perovskite structure includes ABO3-α, having an off-stoichiometric composition. For example, the ceramic material is a material in which an A site includes at least barium (Ba) and a B site includes at least titanium (Ti). For example, the ceramic material is such as BaTiO3(barium titanate), Ba1-x-yCaxSryTi1-zZrzO3(0≤x≤1, 0≤y≤1, 0≤z≤1) having a perovskite structure. An average thickness of each of the dielectric layers11may be, for example, 0.05 μm or more and 5 μm or less. The average thickness may be 0.1 μm or more and 3 μm or less. The average thickness may be 0.2 μm or more and 1 μm or less. As illustrated inFIG.2, a section, in which a set of the internal electrode layers12connected to the external electrode20aface another set of the internal electrode layers12connected to the external electrode20b, is a section generating electrical capacity in the multilayer ceramic capacitor100. Accordingly, the section is referred to as a capacity section14. That is, the capacity section14is a section in which the internal electrode layers next to each other being connected to different external electrodes face each other. A section, in which the internal electrode layers12connected to the external electrode20aface each other without sandwiching the internal electrode layer12connected to the external electrode20b, is referred to as an end margin15. A section, in which the internal electrode layers12connected to the external electrode20bface each other without sandwiching the internal electrode layer12connected to the external electrode20ais another end margin15. That is, the end margin15is a section in which a set of the internal electrode layers12connected to one external electrode face each other without sandwiching the internal electrode layer12connected to the other external electrode. The end margins15are sections that do not generate electrical capacity in the multilayer ceramic capacitor100. As illustrated inFIG.3, a section of the multilayer chip10from the two sides thereof to the internal electrode layers12is referred to as a side margin16. That is, the side margin16is a section covering edges of the stacked internal electrode layers12in the extension direction toward the two side faces. The side margin16does not generate electrical capacity. The dielectric layer11is formed by firing a dielectric material including ceramic material powder. The internal electrode layer12is formed by firing a paste material including metal powder. In the firing process, a discontinuity17in which a partial breaking occurs may appears in the internal electrode layer12as illustrated inFIG.4.FIG.4illustrates a cross sectional view taken along the XZ plane. Therefore, inFIG.4, the internal electrode layer12seems to be divided into a plurality of parts in the X-axis direction by the discontinuity17. However, the parts may be connected to each other in a cross section of a different position in the Y-axis direction. For example, the discontinuity17has a hole shape in a planar view along the Z-axis direction. The discontinuity17may be a cavity. Alternatively, the dielectric material of the dielectric layer11may be located in the discontinuity17. Electric field concentration tends to occur in the discontinuity17of the internal electrode layer12. The insulation resistance may be reduced in a portion where the electric field concentration occurs. Therefore, the reliability may be degraded. Accordingly, it is thought that a different element is solid-solved in the dielectric material, and the insulation characteristic of the dielectric layer11is improved. However, in the method, the degradation of the reliability caused by the discontinuity17of the internal electrode layer12may not necessarily be solved. The insulation resistance of the interface between the internal electrode layer12and the dielectric layer11is larger than the insulation resistance of the grain boundary or the grain of the dielectric layer11. Moreover, the grain boundary and the grain are downsized due to the thickness reduction of the dielectric layer11. Therefore, the above-mentioned method is insufficient. Accordingly, a main component of the internal electrode layer12of the embodiment includes nickel (Ni). The internal electrode layer12includes tin (Sn). When the internal electrode layer12includes Ni and Sn, resistance to humidity of the multilayer ceramic capacitor100may be improved. For example, when Ni and Sn form an alloy, the condition of the interface between the internal electrode layer12and the dielectric layer11changes. In this case, the resistance to humidity of the multilayer ceramic capacitor100may be improved. And, the reliability of the multilayer ceramic capacitor100may be improved. Moreover, in at least one of the internal electrode layers12, the Sn concentration near the discontinuity17is increased. In concrete, as illustrated inFIG.5A, in at least one of the internal electrode layers12, on a surface exposed to the discontinuity17(an inner wall of a hole formed by the discontinuity17in the internal electrode layer12), an Sn high concentration portion18is provided. The Sn high concentration portion18is a portion which has a larger Sn concentration than the average Sn concentration of the whole of one internal electrode layer12. An potential barrier (Schottky barrier) is increased on an interface between the internal electrode layer12and the dielectric layers11near the discontinuity17, because of the high concentration Sn which is segregated on a surface exposed to the discontinuity17. Thereby, the insulation resistance is increased. Thus, the degradation of the insulation resistance caused by the electric field concentration near the discontinuity17is suppressed. Moreover, when Ti ions near the discontinuity17are replaced with Sn ions near the discontinuity17, energy for generating oxygen vacancy near the discontinuity17is increased. In this case, a concentration of the oxygen vacancy near the discontinuity17gets smaller than the case where Ni diffuses into the dielectric layers11. And, the insulation resistance increases. Accordingly, the reliability of the multilayer ceramic capacitor100is improved. From a viewpoint of enhancing the effect of improving the insulation characteristic by the Sn high concentration portion18, it is preferable that the Sn high concentration portion18continuously extends from the surface exposed to the discontinuity17to at least one of the upper face and the lower face of the internal electrode layer12, as illustrated inFIG.5B. That is, it is preferable that the Sn high concentration portion18extends from the surface exposed to the discontinuity17to the interface between the internal electrode layer12and the dielectric layer11next to the internal electrode layer12. On the other hand, when the Sn high concentration portion18covers the whole of the upper face and the whole of the lower face of the internal electrode layer12, breakdown of the multilayer ceramic capacitor100may occur due to peeling at an interface between the internal electrode layer12and the dielectric layer11. Accordingly, it is preferable that the Sn high concentration portions18extending from the discontinuities17of the internal electrode layer12are spaced from each other on the interface between the internal electrode layer12and the dielectric layer11next to the internal electrode layer12. The Sn concentration in the Sn high concentration portion18is, for example, twice or more of an average Sn concentration of each of the internal electrode layers12. For example, the Sn concentration of the Sn high concentration portion18is 0.2 at % or more with respect to Ni of the Sn high concentration portion18, when the average Sn concentration of each of the internal electrode layers12is 0.1 at %. When the amount of Sn in the internal electrode layers12is excessively large, the continuity modulus of the internal electrode layers12may be reduced. In this case, the capacity may be reduced. Accordingly, it is preferable that the amount of Sn in the internal electrode layers12has an upper limit. For example, it is preferable that the concentration of Sn with respect to Ni in the whole of one internal electrode layer12is 0.1 at % or less. It is more preferable that the concentration of Sn is 0.07 at % or less. It is still more preferable that the concentration of Sn is 0.05 at % or less. The concentration of Sn with respect to Ni is an amount of Sn on a presumption that the amount of Ni+Sn is 100 at %. The thickness of each of the internal electrode layers12may be 0.01 μm or more and 5 μm or less. The thickness may be 0.05 μm or more and 3 μm or less. The thickness may be 0.1 μm or more and 1 μm or less. For example, when the thickness of the internal electrode layers12is 1 μm or less, the continuity modulus tends to be reduced due to breaking during the firing. In this case, the effect of the embodiment may be remarkable. In the multilayer ceramic capacitor100, the number of the stacked internal electrode layers12may be 10 to 5000, 50 to 4000, or 100 to 3000. The internal electrode layers12having the Sn high concentration portion18are formed through the firing process after forming internal electrode patterns by a sputtering, as described later. Therefore, the internal electrode layers12of the embodiment do not include any co-material of ceramic grains. Next, a description will be given of a manufacturing method of the multilayer ceramic capacitor100.FIG.6illustrates a manufacturing method of the multilayer ceramic capacitor100. (Making process of raw material powder) A dielectric material for forming the dielectric layer11is prepared. The dielectric material includes the main component ceramic of the dielectric layer11. Generally, an A site element and a B site element are included in the dielectric layer11in a sintered phase of grains of ABO3. For example, BaTiO3is tetragonal compound having a perovskite structure and has a high dielectric constant. Generally, BaTiO3is obtained by reacting a titanium material such as titanium dioxide with a barium material such as barium carbonate and synthesizing barium titanate. Various methods can be used as a synthesizing method of the ceramic structuring the dielectric layer11. For example, a solid-phase method, a sol-gel method, a hydrothermal method or the like can be used. The embodiment may use any of these methods. An additive compound may be added to the resulting ceramic powder, in accordance with purposes. The additive compound may be an oxide of magnesium (Mg), manganese (Mn), vanadium (V), chromium (Cr) or a rare earth element (yttrium (Y), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium Dy), holmium (Ho), erbium (Er), thulium (Tm) and ytterbium (Yb)), or an oxide of cobalt (Co), nickel (Ni), lithium (Li), boron (B), sodium (Na), potassium (K) and silicon (Si). The additive compound may be a glass including cobalt, nickel, lithium, boron, sodium, potassium or silicon. For example, the resulting ceramic raw material powder is wet-blended with additives and is dried and crushed. Thus, a ceramic material is obtained. For example, the grain diameter may be adjusted by crushing the resulting ceramic material as needed. Alternatively, the grain diameter of the resulting ceramic power may be adjusted by combining the crushing and classifying. With the processes, a dielectric material is obtained. (Stacking process) Next, a binder such as polyvinyl butyral (PVB) resin, an organic solvent such as ethanol or toluene, and a plasticizer are added to the resulting dielectric material and wet-blended. With use of the resulting slurry, a dielectric green sheet52is painted on a base material51by, for example, a die coater method or a doctor blade method, and then dried. The base material51is, for example, PET (polyethylene terephthalate) film. Next, as illustrated inFIG.7A, an internal electrode pattern53is formed on the dielectric green sheet52. InFIG.7A, as an example, four parts of the internal electrode pattern53are formed on the dielectric green sheet52and are spaced from each other. The forming method of the internal electrode pattern53is a sputtering. NiSn alloy may be used as a target of the sputtering. Alternatively, a target of Ni and another target of Sn may be used. In this case, the targets may be used together with each other in a single sputtering. The dielectric green sheet52on which the internal electrode pattern53is used as a stack unit. Next, the dielectric green sheets52are peeled from the base materials51. As illustrated inFIG.7B, the stack units are stacked. Next, a predetermined number (for example, 2 to 10) of a cover sheet is stacked on an upper face and a lower face of a ceramic multilayer structure of the stacked stack units and is thermally crimped. The resulting ceramic multilayer structure is cut into a chip having a predetermined size (for example, 1.0 mm×0.5 mm). InFIG.7B, the multilayer structure is cut along a dotted line. The components of the cover sheet may be the same as those of the dielectric green sheet52. Additives of the cover sheet may be different from those of the dielectric green sheet52. (Firing process) The binder is removed from the ceramic multilayer structure in N2atmosphere. Metal paste to be the base layers of the external electrodes20aand20bis applied to the ceramic multilayer structure by a dipping method. The resulting ceramic multilayer structure is fired for 10 minutes to 2 hours in a reductive atmosphere having an oxygen partial pressure of 10−5to 10−8atm in a temperature range of 1100 degrees C. to 1300 degrees C. In this manner, it is possible to manufacture the multilayer ceramic capacitor100. (Re-oxidizing process) After that, a re-oxidizing process may be performed in N2gas atmosphere in a temperature range of 600 degrees C. to 1000 degrees C. (Plating process) After that, by a plating method, metal layers such as Cu, Ni, Sn or the like may be plated on the external electrodes20aand20b. In the manufacturing method of the embodiment, the internal electrode pattern53including Ni and Sn is formed by the sputtering. In this case, compared to the case where a paste material is fired, the discontinuity17tends to be formed when the internal electrode pattern53formed by the sputtering is fired. Sn which is formed by the sputtering together with Ni is easily diffused into the BaTiO3material. However, the amount of the BaTiO3material is small in the discontinuity17. Therefore, a driving force for diffusion gets smaller. In this case, Sn is left in the discontinuity17. Accordingly, as described inFIG.5AandFIG.5B, the Sn high concentration portion18is formed near the discontinuity17. Moreover, Sn tends to be left in a discontinuity formed by firing the sputtering film, compared to the discontinuity formed by firing the paste material. It is thought that this is because the co-material in the paste material suppresses the diffusion of Sn into the dielectric layers11. In the embodiments, the multilayer ceramic capacitor is described as an example of ceramic electronic devices. However, the embodiments are not limited to the multilayer ceramic capacitor. For example, the embodiments may be applied to another electronic device such as varistor or thermistor. Although the embodiments of the present invention have been described in detail, it is to be understood that the various change, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention. | 20,682 |
11862398 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS 1. Multilayer Ceramic Capacitor A multilayer ceramic capacitor according to a preferred embodiment of this invention will be described. The multilayer ceramic capacitor according to the present preferred embodiment is a three-terminal multilayer ceramic capacitor. FIG.1is an external perspective view showing a multilayer ceramic capacitor (three-terminal multilayer ceramic capacitor) according to a preferred embodiment of this invention.FIG.2is a top view showing a multilayer ceramic capacitor (three-terminal multilayer ceramic capacitor) according to a preferred embodiment of this invention.FIG.3is a side view showing a multilayer ceramic capacitor (three-terminal multilayer ceramic capacitor) according to a preferred embodiment of this invention.FIG.4is a cross-sectional view along the line IV-IV inFIG.1.FIG.5is a cross-sectional view along the line V-V inFIG.1.FIG.6is a cross-sectional view along the line VI-VI inFIG.4.FIG.7is a cross-sectional view along the line VII-VII inFIG.4.FIG.8shows a modification of a second internal electrode layer shown inFIG.7. As shown inFIGS.1to3, a multilayer ceramic capacitor10includes a multilayer body12in a shape, for example, of a parallelepiped and an external electrode30. Multilayer body12includes a plurality of layered dielectric layers14and a plurality of internal electrode layers16layered on dielectric layer14. Multilayer body12includes a first main surface12aand a second main surface12bopposed to each other in a height direction x, a first side surface12cand a second side surface12dopposed to each other in a width direction y orthogonal or substantially orthogonal to height direction x, and a first end surface12eand a second end surface12fopposed to each other in a length direction z orthogonal or substantially orthogonal to height direction x and width direction y. Multilayer body12includes a corner and a ridgeline that are rounded. The corner refers to a portion where three adjacent surfaces of the multilayer body meet one another and the ridgeline refers to a portion where two adjacent surfaces of the multilayer body meet each other. Projections and recesses or the like may be provided in a portion or an entirety of first main surface12aand second main surface12b, first side surface12cand second side surface12d, and first end surface12eand second end surface12f. A dimension of multilayer body12is not particularly limited. Multilayer body12includes an inner layer portion18and a first main-surface-side outer layer portion20aand a second main-surface-side outer layer portion20bthat sandwich inner layer portion18in height direction x. Inner layer portion18includes a plurality of dielectric layers14and a plurality of internal electrode layers16. Inner layer portion18includes internal electrode layers from internal electrode layer16located closest to first main surface12ain height direction x to internal electrode layer16located closest to second main surface12b. In inner layer portion18, the plurality of internal electrode layers16are opposed to each other with dielectric layer14being interposed therebetween. Inner layer portion18is a portion that produces a capacitance and substantially defines and functions as a capacitor. First main-surface-side outer layer portion20ais located on a side of first main surface12a. First main-surface-side outer layer portion20ais an assembly including a plurality of dielectric layers14located between first main surface12aand internal electrode layer16closest to first main surface12a. Second main-surface-side outer layer portion20bis located on a side of second main surface12b. Second main-surface-side outer layer portion20bis an assembly including a plurality of dielectric layers14located between second main surface12band internal electrode layer16closest to second main surface12b. Dielectric layers14included in each of first main-surface-side outer layer portion20aand second main-surface-side outer layer portion20bmay be the same or substantially the same as dielectric layers14included in inner layer portion18. Multilayer body12includes a first side-surface-side outer layer portion22alocated on a side of first side surface12cand including a plurality of dielectric layers14located between first side surface12cand an outermost surface of inner layer portion18on the side of first side surface12c. Similarly, multilayer body12includes a second side-surface-side outer layer portion22blocated on a side of second side surface12dand including a plurality of dielectric layers14located between second side surface12dand an outermost surface of inner layer portion18on the side of second side surface12d. FIG.5shows a range in width direction y of each of first side-surface-side outer layer portion22aand second side-surface-side outer layer portion22b. Magnitude of a width in width direction y of each of first side-surface-side outer layer portion22aand second side-surface-side outer layer portion22bis also referred to as a W gap or a side gap. Multilayer body12includes a first end-surface-side outer layer portion24alocated on a side of first end surface12eand including a plurality of dielectric layers14located between first end surface12eand an outermost surface of inner layer portion18on the side of first end surface12e. Similarly, multilayer body12includes a second end-surface-side outer layer portion24blocated on a side of second end surface12fand including a plurality of dielectric layers14located between second end surface12fand an outermost surface of inner layer portion18on the side of second end surface12f. FIG.4shows a range in length direction z of each of first end-surface-side outer layer portion24aand second end-surface-side outer layer portion24b. Magnitude of a width in length direction z of each of first end-surface-side outer layer portion24aand second end-surface-side outer layer portion24bis also referred to as an L gap or an end gap. Dielectric layer14may be defined by, for example, a dielectric material as a ceramic material. For example, dielectric ceramics including a component such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3may be included as a dielectric material. When the aforementioned dielectric material is included as a main component, depending on a predetermined characteristic of multilayer body12, for example, a sub-component lower in content than the main component, such as, for example, an Mn compound, an Fe compound, a Cr compound, a Co compound, or an Ni compound may be added. Fired dielectric layer14preferably has a thickness not smaller than about 0.5 μm and not larger than about 10 μm, for example. The number of layered dielectric layers14is preferably not smaller than fifteen and not larger than three hundred, for example. The number of dielectric layers14is a total of the number of dielectric layers14in inner layer portion18and the number of dielectric layers14in first main-surface-side outer layer portion20aand second main-surface-side outer layer portion20b. Multilayer body12includes a plurality of first internal electrode layers16aand a plurality of second internal electrode layers16bas the plurality of internal electrode layers16. First internal electrode layer16ais provided on dielectric layer14. As shown inFIG.6, first internal electrode layer16aincludes a first section26athat extends between first end surface12eand second end surface12fof multilayer body12and corresponds to a central portion thereof, a second section26bthat extends from first section26ato first end surface12eof multilayer body12e, and a third section26cthat extends from first section26ato second end surface12fof multilayer body12. First section26ais located in the central portion on dielectric layer14. Second section26bis exposed at first end surface12eof multilayer body12and third section26cis exposed at second end surface12fof multilayer body12. Therefore, first internal electrode layer16ais not exposed at first side surface12cand second side surface12dof multilayer body12. Although a shape of first internal electrode layer16ais not particularly limited, first internal electrode layer16ais preferably rectangular or substantially rectangular and a corner thereof may be rounded, for example. Second internal electrode layer16bis provided on dielectric layer14different from dielectric layer14on which first internal electrode layer16ais provided. As shown inFIG.7, second internal electrode layer16bincludes a fourth section28athat extends between first side surface12cand second side surface12dof multilayer body12and corresponds to a central portion thereof, a fifth section28bthat extends from fourth section28ato first side surface12c, and a sixth section28cthat extends from fourth section28ato second side surface12d. Fourth section28ahas a rectangular or substantially rectangular shape extending toward first end surface12eand extending toward second end surface12f. Fourth section28ais located in the central portion on dielectric layer14. Fifth section28bis exposed at first side surface12cof multilayer body12and sixth section28cis exposed at second side surface12dof multilayer body12. Therefore, second internal electrode layer16bis not exposed at first end surface12eand second end surface12fof multilayer body12. Although a shape of fourth section28aand a shape of each of fifth section28band sixth section28cof second internal electrode layer16bare not particularly limited, the sections are preferably rectangular or substantially rectangular, for example. The corner of each section may be rounded. First section26aof first internal electrode layer16ais opposed to fourth section28aof second internal electrode layer16b. A width of first section26aof first internal electrode layer16ain width direction y that connects between first side surface12cand second side surface12dmay be equal to or different from a width of fourth section28aof second internal electrode layer16bin width direction y that connects between first side surface12cand second side surface12d. Relationship of A B is preferably satisfied, where A represents a width of fourth section28aof second internal electrode layer16bin length direction z that connects between first end surface12eand second end surface12fand B represents a width of fifth section28band sixth section28cof second internal electrode layer16bin length direction z that connects between first end surface12eand second end surface12f. For example, as shown inFIG.8, in a modification of second internal electrode layer16b, fourth section28aof second internal electrode layer16bmay not extend toward first end surface12eand second end surface12fand width A of fourth section28aof second internal electrode layer16bin length direction z that connects between first end surface12eand second end surface12fmay be equal or substantially equal to width B of each of fifth section28band sixth section28cof second internal electrode layer16bin length direction z that connects between first end surface12eand second end surface12f. Thus, by adjusting only an area of second internal electrode layer16bwithout changing an area of first internal electrode layer16a, a capacitance of multilayer ceramic capacitor10is able to be lowered with a DC resistance remaining low. Although not shown, relationship of A<B may be satisfied. First internal electrode layers16aare larger in number than second internal electrode layers16b, and at least two first internal electrode layers16aare successively layered. Thus, multilayer ceramic capacitor10shown inFIG.1is not only larger in number of first internal electrode layers16aand larger in number of first internal electrode layers16aconnected in parallel while increase in capacitance is significantly reduced or prevented, but also significantly improved in conduction between first internal electrode layers16aand external electrode30, and thus multilayer ceramic capacitor10significantly reduces or prevents an increase in DC resistance. Fifth section28band sixth section28cof second internal electrode layer16bare larger in thickness than fourth section28aof second internal electrode layer16b. Thus, even when the capacitance is lowered, connectivity between second internal electrode layers16band external electrode30is also able to be secured. Though the number of first internal electrode layers16ais not particularly limited, for example, it is preferably not smaller than thirty and not larger than one hundred. The number of second internal electrode layers16bis at least smaller than the number of first internal electrode layers16a. Specifically, though the number of second internal electrode layers16bis not particularly limited, for example, it is preferably not smaller than one and not larger than fifty. Though a thickness of first internal electrode layer16ais not particularly limited, for example, the thickness is preferably not smaller than about 0.5 μm and not larger than about 2.0 μm. Though the thickness of fourth section28aof second internal electrode layer16bis not particularly limited, for example, the thickness is preferably not smaller than about 0.5 μm and not larger than about 2.0 μm. Fifth section28band sixth section28cof second internal electrode layer16bare larger in thickness than fourth section28aof second internal electrode layer16b. Specifically, though the thickness of fifth section28band sixth section28cof second internal electrode layer16bis not particularly limited, for example, the thickness is preferably not smaller than about 1 μm and not larger than about 3 μm. The thickness of fourth section28aof second internal electrode layer16band the thickness of fifth section28band sixth section28cof second internal electrode layer16bpreferably satisfy relationship of the thickness of the fifth section and the sixth section of the second internal electrode layer/the thickness of the fourth section of the second internal electrode layer≥about 1.2. Thus, even when a smaller number of second internal electrode layers16bare layered, connectivity between second internal electrode layers16band external electrode30is able to be further improved. Inner layer portion18of multilayer body12includes a capacitance forming portion19in which first internal electrode layer16aand second internal electrode layer16bare opposed to each other with dielectric layer14being interposed therebetween to define a capacitance and an internal electrode layered portion25which is a region where at least two first internal electrode layers16aare successively layered. Multilayer ceramic capacitor10exhibits characteristics of the capacitor due to capacitance forming portion19. Internal electrode layered portion25is divided into a plurality of internal electrode layered portions by second internal electrode layers16b. Since an assembly of first internal electrode layers16ais thus distributed, a heat radiation effect is able to be improved and a reduction or prevention of a temperature increase is able to be provided. In multilayer ceramic capacitor10shown inFIG.1, internal electrode layered portion25is divided by two second internal electrode layers16binto a first internal electrode layered portion25a, a second internal electrode layered portion25b, and a third internal electrode layered portion25cas shown inFIG.4. A single second internal electrode layer16bmay divide internal electrode layered portion25which is the region where at least two first internal electrode layers16aare successively layered. A larger number of first internal electrode layers16ais thus able to be layered and a DC resistance lowering effect is able to be provided. At least two second internal electrode layers16bmay be successively layered to divide internal electrode layered portion25which is the region where at least two first internal electrode layers16aare successively layered. Thus, even when the number of second internal electrode layers16bis smaller, connectivity between second internal electrode layers16band external electrode30is able to be increased. Second internal electrode layer16bmay be provided in internal electrode layered portion25which is the region where at least two first internal electrode layers16alocated on the side of first main surface12aof multilayer body12are successively layered, that is, between first internal electrode layered portion25aand first main surface12a, and in internal electrode layered portion25which is the region where at least two first internal electrode layers16alocated on the side of second main surface12bof multilayer body12are successively layered, that is, between third internal electrode layered portion25cand second main surface12b. Since capacitance forming portion19is thus able to be provided also around first main-surface-side outer layer portion20aand second main-surface-side outer layer portion20b, some of the capacitance is provided, a current path to a mount substrate is able to be relatively short, and a relatively low ESL effect is able to be provided. Second internal electrode layer16bdoes not have to be provided in internal electrode layered portion25which is the region where at least two first internal electrode layers16alocated on the side of first main surface12aof multilayer body12are successively layered, that is, between first internal electrode layered portion25aand first main surface12a, and in internal electrode layered portion25which is the region where at least two first internal electrode layers16alocated on the side of second main surface12bof multilayer body12are successively layered, that is, between third internal electrode layered portion25cand second main surface12b. A distance from the surface of multilayer body12to capacitance forming portion19where the capacitance is formed is thus longer. Therefore, even when a crack runs from the surface of multilayer body12due to external load, an effect of lower tendency toward deterioration of insulation resistance is able to be provided. Dielectric layer14adjacent to second internal electrode layer16bis preferably larger in thickness than dielectric layer14lying between first internal electrode layers16a. A larger number of first internal electrode layers16ais thus able to be layered, and the DC resistance lowering effect is able to further increased. First internal electrode layer16aand second internal electrode layer16bmay be made of an appropriate conductive material including, for example, a metal such as Ni, Cu, Ag, Pd, or Au and an alloy including at least one of those metals, such as an Ag—Pd alloy. External electrode30is provided on the side of each of first end surface12eand second end surface12fas well as on the side of each of first side surface12cand second side surface12dof multilayer body12. External electrode30includes a first external electrode30a, a second external electrode30b, a third external electrode30c, and a fourth external electrode30d. First external electrode30ais provided on first end surface12eof multilayer body12. First external electrode30aextends from first end surface12eof multilayer body12to cover a portion of each of first main surface12a, second main surface12b, first side surface12c, and second side surface12d. First external electrode30ais electrically connected to second section26bof first internal electrode layer16aexposed at first end surface12eof multilayer body12. First external electrode30amay be provided only on first end surface12eof multilayer body12. Second external electrode30bis provided on second end surface12fof multilayer body12. Second external electrode30bextends from second end surface12fof multilayer body12to cover a portion of each of first main surface12a, second main surface12b, first side surface12c, and second side surface12d. Second external electrode30bis electrically connected to third section26cof first internal electrode layer16aexposed at second end surface12fof multilayer body12. Second external electrode30bmay be provided only on second end surface12fof multilayer body12. Third external electrode30cis provided on first side surface12cof multilayer body12. Third external electrode30cextends from first side surface12cto cover a portion of each of first main surface12aand second main surface12b. Third external electrode30cis electrically connected to fifth section28bof second internal electrode layer16bexposed at first side surface12cof multilayer body12. Third external electrode30cmay be provided only on first side surface12cof multilayer body12. Fourth external electrode30dis provided on second side surface12dof multilayer body12. Fourth external electrode30dextends from second side surface12dto cover a portion of each of first main surface12aand second main surface12b. Fourth external electrode30dis electrically connected to sixth section28cof second internal electrode layer16bexposed at second side surface12dof multilayer body12. Fourth external electrode30dmay be provided only on second side surface12dof multilayer body12. Since second internal electrode layer16bis larger in thickness than first internal electrode layer16a, connectivity between fifth section28bof second internal electrode layer16band third external electrode30cprovided on first side surface12cis able to be provided and connectivity between sixth section28cof second internal electrode layer16band fourth external electrode30dprovided on second side surface12dis able to be provided. As long as the thickness of first internal electrode layer16aand the thickness of second internal electrode layer16bsatisfy relationship of the thickness of the second internal electrode layer/the thickness of the first internal electrode layer about 1.2, connectivity between fifth section28bof second internal electrode layer16band third external electrode30cprovided on first side surface12cis able to be provided and connectivity between sixth section28cof second internal electrode layer16band fourth external electrode30dprovided on second side surface12dis able to be provided even when the number of second internal electrode layers16bis relatively low. External electrode30includes an underlying electrode layer32provided on the surface of multilayer body12and a plated layer34covering underlying electrode layer32. Underlying electrode layer32includes a first underlying electrode layer32a, a second underlying electrode layer32b, a third underlying electrode layer32c, and a fourth underlying electrode layer32d. First underlying electrode layer32ais provided on the surface of first end surface12eof multilayer body12and extends from first end surface12eto cover a portion of each of first main surface12a, second main surface12b, first side surface12c, and second side surface12d. Second underlying electrode layer32bis provided on the surface of second end surface12fof multilayer body12and extends from second end surface12fto cover a portion of each of first main surface12a, second main surface12b, first side surface12c, and second side surface12d. First underlying electrode layer32amay be provided only on the surface of first end surface12eof multilayer body12and second underlying electrode layer32bmay be provided only on the surface of second end surface12fof multilayer body12. Third underlying electrode layer32cis provided on the surface of first side surface12cof multilayer body12and extends from first side surface12cto cover a portion of each of first main surface12aand second main surface12b. Fourth underlying electrode layer32dis provided on the surface of second side surface12dof multilayer body12and extends from second side surface12dto cover a portion of each of first main surface12aand second main surface12b. Third underlying electrode layer32cmay be provided only on the surface of first side surface12cof multilayer body12and fourth underlying electrode layer32dmay be provided only on the surface of second side surface12dof multilayer body12. Underlying electrode layer32includes at least one selected from a baked layer, a conductive resin layer, a thin layer, and the like. A construction in which underlying electrode layer32is formed from the baked layer, the conductive resin layer, or the thin layer will be described below. Baked Layer The baked layer includes a glass component and a metal component. The glass component for the baked layer includes, for example, at least one selected from B, Si, Ba, Mg, Al, Li, and the like. The metal component for the baked layer includes at least one selected, for example, from Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, and the like. The baked layer may include a plurality of layers. The baked layer is provided by applying a conductive paste including a glass component and a metal component to multilayer body12and baking the conductive paste. The baked layer may be provided by simultaneously firing a multilayer chip including internal electrode layers16and dielectric layers14and the conductive paste applied to the multilayer chip, or may be provided by firing a multilayer chip including internal electrode layers16and dielectric layers14to provide multilayer body12and thereafter applying a conductive paste to multilayer body12and baking multilayer body12. When the baked layer is provided by simultaneously firing the multilayer chip including internal electrode layers16and dielectric layers14and the conductive paste applied to the multilayer chip, the baked layer is preferably formed, for example, by baking a material to which a dielectric material is added instead of the glass component. A thickness in the direction of connection between first end surface12eand second end surface12f, of first underlying electrode layer32alocated on first end surface12eat the central portion in height direction x is preferably not smaller than about 3 μm and not larger than about 70 μm, for example. A thickness in the direction of connection between first end surface12eand second end surface12f, of second underlying electrode layer32blocated on second end surface12fat the central portion in height direction x is preferably not smaller than about 3 μm and not larger than about 70 μm, for example. When underlying electrode layer32is provided on a portion of first main surface12aand a portion of second main surface12bas well as on a portion of first side surface12cand a portion of second side surface12d, a thickness of first underlying electrode layer32alocated on first main surface12aand second main surface12band on first side surface12cand second side surface12din the height direction of connection between first main surface12aand second main surface12bat a central portion in length direction z is preferably, for example, not smaller than about 3 μm and not larger than about 40 μm. When underlying electrode layer32is provided on a portion of first main surface12aand a portion of second main surface12bas well as on a portion of first side surface12cand a portion of second side surface12d, a thickness of second underlying electrode layer32blocated on first main surface12aand second main surface12band on first side surface12cand second side surface12din the height direction of connection between first main surface12aand second main surface12bat a central portion in length direction z is preferably, for example, not smaller than about 3 μm and not larger than about 40 μm. Conductive Resin Layer The conductive resin layer may include a plurality of layers. The conductive resin layer may be provided on the baked layer to cover the bakes layer, or may directly be provided on multilayer body12. The conductive resin layer includes a thermosetting resin and a metal. The conductive resin layer may completely cover underlying electrode layer32or may cover a portion of underlying electrode layer32. Since the conductive resin layer includes a thermosetting resin, it is more flexible than a conductive layer formed, for example, from a plated film or a fired product of a conductive paste. Therefore, even though a physical shock or a shock originating from a thermal cycle is applied to multilayer ceramic capacitor10, the conductive resin layer defines and functions as a buffer layer and is able to significantly reduce or prevent a crack in multilayer ceramic capacitor10. For example, Ag, Cu, Ni, Sn, Bi, or an alloy thereof may be included as a metal to be included in the conductive resin layer. Alternatively, metal powders with a surface coated with Ag are also able to be included. In including metal powders having a surface coated with Ag, Cu, Ni, Sn, Bi, or powders of an alloy thereof is/are preferably used for the metal powders, for example. Conductive metal powders of Ag are used as a conductive metal because Ag is suitable as an electrode material because of its specific resistance lowest among metals and Ag which is a precious metal is not oxidized and highly weather resistant and because a metal as a base material is relatively inexpensive while the characteristics of Ag are maintained. Cu or Ni subjected to antioxidation treatment can also be used as a metal included in the conductive resin layer. Metal powders having a surface coated with, for example, Sn, Ni, or Cu are also able to be used as a metal to be included in the conductive resin layer. In providing metal powders having a surface coated with Sn, Ni, or Cu, Ag, Cu, Ni, Sn, or Bi or powders of an alloy thereof is/are preferably provided for the metal powders, for example. The conductive resin layer preferably includes at least about 35 vol % and at most about 75 vol % of metal with respect to a volume of the conductive resin as a whole, for example. An average particle size of the metal included in the conductive resin layer is not particularly limited. A conductive filler may have an average particle size, for example, not smaller than about 0.3 μm and not larger than about 10 μm. The metal included in the conductive resin layer mainly provides for current conduction in the conductive resin layer. Specifically, a current conduction path is formed in the conductive resin layer as a result of contact between the conductive fillers. Although the metal included in the conductive resin layer may be spherical or may have a flat profile, spherical metal powders and metal powders having a flat profile are preferably used as being mixed, for example. Various known thermosetting resins, for example, an epoxy resin, a phenol resin, a urethane resin, a silicone resin, and a polyimide resin are able to be used as the resin in the conductive resin layer. Among these, the epoxy resin excellent in heat resistance, moisture resistance, and adhesiveness is one of most appropriate resins. The conductive resin layer preferably includes at least about 25 vol % and at most about 65 vol % of resin with respect to the volume of the conductive resin as a whole, for example. The conductive resin layer preferably includes a hardening agent together with the thermosetting resin, for example. When the epoxy resin is provided as a base resin, various known compounds, for example, a phenol-based compound, an amine-based compound, an acid anhydride-based compound, an imidazole-based compound, an active-ester-based compound, and an amide-imide-based compound may be included as the hardening agent for the epoxy resin. The conductive resin layer located in the central portion in height direction x of multilayer body12located on each of first end surface12eand second end surface12fhas a thickness, for example, preferably not smaller than about 10 μm and not larger than about 150 μm. Thin Layer When a thin layer is provided as underlying electrode layer32, the thin layer is not larger than about 1 μm that is provided by deposition of metal particles by a thin film formation method, for example, sputtering or vapor deposition. Plated layer34includes a first plated layer34a, a second plated layer34b, a third plated layer34c, and a fourth plated layer34d. First plated layer34a, second plated layer34b, third plated layer34c, and fourth plated layer34dinclude at least one selected, for example, from Cu, Ni, Sn, Ag, Pd, an Ag—Pd alloy, Au, and the like. First plated layer34acovers first underlying electrode layer32a. Second plated layer34bcovers second underlying electrode layer32b. Third plated layer34ccovers third underlying electrode layer32c. Fourth plated layer34dcovers fourth underlying electrode layer32d. Plated layer34may include a plurality of layers. In this case, plated layer34preferably has a two-layered structure including a lower plated layer of Ni plating provided on underlying electrode layer32and an upper plated layer of Sn plating provided on the lower plated layer, for example. Specifically, first plated layer34aincludes a first lower plated layer and a first upper plated layer located on a surface of the first lower plated layer. Second plated layer34bincludes a second lower plated layer and a second upper plated layer located on a surface of the second lower plated layer. Third plated layer34cincludes a third lower plated layer and a third upper plated layer located on a surface of the third lower plated layer. Fourth plated layer34dincludes a fourth lower plated layer and a fourth upper plated layer located on a surface of the fourth lower plated layer. The lower plated layer of Ni plating is included to significantly reduce or prevent corrosion of underlying electrode layer32by solder that mounts of multilayer ceramic capacitor10and the upper plated layer of Sn plating is included to increase wettability of solder that mounts of multilayer ceramic capacitor10. One plated layer has a thickness preferably not smaller than about 2.0 μm and not larger than about 15.0 μm, for example. External electrode30may be provided only from a plated layer without providing underlying electrode layer32. A structure where a plated layer is provided without underlying electrode layer32will be described below, although it is not shown. Any one or each of first external electrode30ato fourth external electrode30dmay include no underlying electrode layer32, and may include the plated layer directly provided on the surface of multilayer body12. In other words, multilayer ceramic capacitor10may be structured to include a plated layer electrically connected to first internal electrode layer16aand second internal electrode layer16b. In such a case, the plated layer may be formed after a catalyst is provided on the surface of multilayer body12as pre-treatment. When the plated layer is formed directly on multilayer body12without providing underlying electrode layer32, reduction in thickness by magnitude of the thickness of underlying electrode layer32is able to provide a lower profile, that is, decrease in thickness, or into a thickness of multilayer body12, that is, a thickness of inner layer portion18. Therefore, a degree of freedom in design of a thin chip is able to be significantly improved. The plated layer preferably includes a lower plated electrode formed on the surface of multilayer body12and an upper plated electrode formed on a surface of the lower plated electrode, for example. Each of the lower plated electrode and the upper plated electrode preferably includes at least one metal selected, for example, from Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn or an alloy including such a metal. The lower plated electrode preferably includes Ni that provides a solder barrier and the upper plated electrode preferably includes Sn or Au excellent in solderability, for example. For example, when first internal electrode layer16aand second internal electrode layer16binclude Ni, the lower plated electrode preferably includes Cu that is well joined to Ni, for example. The upper plated electrode should only be included as necessary, and each of first external electrode30ato fourth external electrode30dmay be formed only from the lower plated electrode. The upper plated electrode may define and function as and define an outermost layer of the plated layer, or another plated electrode may further be formed on a surface of the upper plated electrode. When external electrode30is formed only from the plated layer without underlying electrode layer32, one plated layer without including underlying electrode layer32has a thickness preferably not smaller than about 1 μm and not larger than about 15 μm, for example. The plated layer preferably includes no glass, for example. A ratio of a metal per unit volume of the plated layer is preferably not lower than about 99 volume %, for example. A dimension in length direction z of multilayer ceramic capacitor10including multilayer body12and first external electrode30ato fourth external electrode30dis defined as an L dimension, a dimension in height direction x of multilayer ceramic capacitor10including multilayer body12and first external electrode30ato fourth external electrode30dis defined as a T dimension, and a dimension in width direction y of multilayer ceramic capacitor10including multilayer body12and first external electrode30ato fourth external electrode30dis defined as a W dimension. Although the dimension of multilayer ceramic capacitor10is not particularly limited, for example, multilayer ceramic capacitor10has the L dimension in length direction z not smaller than about 1.0 mm and not larger than about 3.2 mm, the W dimension in width direction y not smaller than about 0.5 mm and not larger than about 2.5 mm, and the T dimension in height direction x not smaller than about 0.3 mm and not larger than about 2.5 mm. The dimension of multilayer ceramic capacitor10may be measured with a microscope. In multilayer ceramic capacitor10shown inFIG.1, the number of first internal electrode layers16ais larger than the number of second internal electrode layers16band at least two first internal electrode layers16aare successively layered. Therefore, multilayer ceramic capacitor10provides improved conduction from first internal electrode layer16aand second internal electrode layer16bto external electrode30while increase in capacitance thereof is reduced or prevented, and thus multilayer ceramic capacitor10reduces or prevents an increase in DC resistance. In multilayer ceramic capacitor10shown inFIG.1, fifth section28band sixth section28cof second internal electrode layer16bare larger in thickness than fourth section28aof second internal electrode layer16b. Therefore, even when the number of second internal electrode layers16bis reduced in order to lower the capacitance of multilayer ceramic capacitor10, connectivity between second internal electrode layers16band third external electrode30cand connectivity between second internal electrode layers16band fourth external electrode30dis able to be provided. 2. Method of Manufacturing Multilayer Ceramic Capacitor A method of manufacturing a multilayer ceramic capacitor according to a preferred embodiment of the present invention will now be described. Initially, a dielectric sheet for a dielectric layer and a conductive paste for an internal electrode are prepared. The dielectric sheet and the conductive paste for the internal electrode layer include a binder and a solvent. A known binder or a known solvent may be used. The conductive paste for the internal electrode layer is printed in a prescribed pattern on the dielectric sheet, for example, by screen printing or gravure printing. The dielectric sheet having a pattern of the first internal electrode layer formed and the dielectric sheet having a pattern of the second internal electrode layer formed are thus prepared. More specifically, a screen plate to print the first internal electrode layer and a screen plate to print the second internal electrode layer are separately prepared, and the pattern of each internal electrode layer may be printed by a printer that is able to perform separate printing with the two types of screen plates. A portion to be the fifth section and the sixth section of the pattern of the second internal electrode layer is printed as being larger in thickness than a portion to be the fourth section of the pattern of the second internal electrode layer. By layering the sheets each having the first internal electrode layer printed and the sheets each having the second internal electrode layer printed to provide a desired structure, a portion to be inner layer portion18is formed. The sheet having the first internal electrode layer printed is larger in number than the sheet having the second internal electrode layer printed, and at least two sheets having the first internal electrode layer printed are successively layered. Then, a prescribed number of dielectric sheets with no pattern of the internal electrode layer printed are layered to define a portion to be second main-surface-side outer layer portion20bon the side of the second main surface. Thereafter, the portion to be inner layer portion18formed in the step described above is layered on the portion to be second main-surface-side outer layer portion20b, and a prescribed number of dielectric sheets having no pattern of the internal electrode layer printed are layered on the portion to be inner layer portion18. A portion to be first main-surface-side outer layer portion20aon the side of the first main surface is thus formed. A layered sheet is thus provided. In succession, the layered sheet is pressed in a direction of layering, for example, by isostatic pressing, to provide a multilayer block. Then, the multilayer block is cut in a prescribed size to provide a multilayer chip. A corner and a ridgeline of the multilayer chip may be rounded by barrel polishing. Then, the cut multilayer chip is fired to provide multilayer body12. A temperature of firing is preferably not lower than about 900° C. and not higher than about 1400° C., for example, although it is dependent on a material of dielectric layer14or internal electrode layer16. Underlying Electrode Layer In succession, third underlying electrode layer32cof third external electrode30cis formed on first side surface12cof multilayer body12provided by firing, and fourth underlying electrode layer32dof fourth external electrode30dis formed on second side surface12dof multilayer body12. In forming the baked layer as underlying electrode layer32, a conductive paste including a glass component and a metal component is applied and thereafter baked to define the baked layer as underlying electrode layer32. A temperature of baking at this time is preferably not lower than about 700° C. and not higher than about 900° C., for example. Various methods may be implemented as the method of forming the baked layer. For example, a method of extruding a conductive paste through a slit and applying the conductive paste may be applied. In this method, by increasing an amount of the extruded conductive paste, underlying electrode layer32is able to be formed not only on first side surface12cand second side surface12dbut also on a portion of first main surface12aand a portion of second main surface12b. A roller transfer method is also able be implemented. In the roller transfer method, in forming underlying electrode layer32not only on first side surface12cand second side surface12dbut also on a portion of first main surface12aand a portion of second main surface12b, by increasing a pressure in pressing in roller transfer, underlying electrode layer32may be formed as far as a portion of first main surface12aand a portion of second main surface12b. Then, first underlying electrode layer32aof first external electrode30ais formed on first end surface12eof multilayer body12provided by firing and second underlying electrode layer32bof second external electrode30bis formed on second end surface12fof multilayer body12. In forming the baked layer as underlying electrode layer32as in forming underlying electrode layer32of each of third external electrode30cand fourth external electrode30d, a conductive paste including a glass component and a metal component is applied and thereafter baked to define the baked layer as underlying electrode layer32. A temperature of baking at this time is preferably not lower than about 700° C. and not higher than about 900° C., for example. In a method of forming the baked layer as underlying electrode layer32of each of first external electrode30aand second external electrode30b, a method of extruding a conductive paste through a slit and applying the conductive paste or a roller transfer method may be applied. In baking, third underlying electrode layer32cof third external electrode30c, fourth underlying electrode layer32dof fourth external electrode30d, first underlying electrode layer32aof first external electrode30a, and second underlying electrode layer32bof second external electrode30bmay simultaneously be baked, or third underlying electrode layer32cof third external electrode30cand fourth underlying electrode layer32dof fourth external electrode30dmay be baked separately from first underlying electrode layer32aof first external electrode30aand second underlying electrode layer32bof second external electrode30b. Conductive Resin Layer When underlying electrode layer32is formed from a conductive resin layer, the conductive resin layer is able to be formed by a method below. The conductive resin layer may be formed on a surface of the baked layer or the conductive resin layer alone may directly be formed on multilayer body12without forming the baked layer. In the method of forming a conductive resin layer, the conductive resin layer is formed by applying a conductive resin paste including a thermosetting resin and a metal component onto the baked layer or multilayer body12, subjecting the conductive resin paste to heat treatment at a temperature not lower than about 250° C. and not higher than about 550° C., for example, and thermally curing the resin. An N2 atmosphere is preferably provided as an atmosphere for heat treatment, for example. In order to prevent scattering of the resin and oxidation of various metal components, a concentration of oxygen is preferably reduced to about 100 ppm or lower, for example. For example, the method of extruding a conductive resin paste through a slit and applying the conductive resin paste or the roller transfer method is able to be applied as the method of applying the conductive resin paste, as in the method of forming underlying electrode layer32from the baked layer. Thin Layer In forming underlying electrode layer32from a thin layer, the underlying electrode layer is able to be formed at a predetermined location where external electrode30is to be formed by using masking or the like, with a thin film formation method, for example, sputtering or vapor deposition. The underlying electrode layer formed from the thin layer is a layer not larger than about 1 μm that results from deposition of metal particles. Plated Electrode A plated electrode may be provided in second section26b, third section26c, fifth section28b, and sixth section28cwhere internal electrode layer16of multilayer body12is exposed, without providing underlying electrode layer32. In this case, the plated electrode is able to be formed by a method below. First end surface12eand second end surface12fof multilayer body12are plated to form lower plated electrodes on second section26band third section26cwhich are the exposed portions of first internal electrode layer16a, respectively. Similarly, first side surface12cand second side surface12dof multilayer body12are plated to form lower plated electrodes on fifth section28band sixth section28cwhich are the exposed portions of second internal electrode layer16b, respectively. In plating, any of electrolytic plating and electroless plating may be used. Electroless plating, however, is disadvantageous due to its complicated process, because it requires pre-treatment with a catalyst to improve a rate of precipitation of plating. Therefore, electrolytic plating is preferably used, for example. Barrel plating is preferably used as a plating method, for example. An upper plated electrode formed on a surface of the lower plated electrode may similarly be formed. In succession, plated layer34may be formed on the surface of underlying electrode layer32, the surface of the conductive resin layer or the surface of the lower plated electrode, and the surface of the upper plated electrode. More specifically, in the present preferred embodiment, an Ni plated layer is formed as the lower plated layer on underlying electrode layer32which is the baked layer and an Sn plated layer is formed as the upper plated layer. The Ni plated layer and the Sn plated layer are successively formed, for example, by barrel plating. In plating, any of electrolytic plating and electroless plating may be used. Electroless plating, however, is disadvantageous due to its complicated process, because it requires pre-treatment with a catalyst to improve a rate of precipitation of plating. Therefore, electrolytic plating is preferably applied, for example. Multilayer ceramic capacitor10according to the present preferred embodiment is manufactured as described above. 3. Experimental Example In order to check advantageous effects of a multilayer ceramic capacitor according to a preferred embodiment of the present invention described above, a multilayer ceramic capacitor was manufactured as a sample in an experiment, and a heat generation characteristic test (variation in temperature with variation in current), a test to measure a DC resistance (Rdc) of the internal electrode layer, and a test to check connection between the internal electrode layer and the external electrode were conducted. (1) Specifications of Sample in Example A multilayer ceramic capacitor according to Example of a preferred embodiment of the present invention with specifications as below was initially made in accordance with the method of manufacturing the multilayer ceramic capacitor described above. EXAMPLE Structure of multilayer ceramic capacitor: three-terminal (seeFIG.1)Dimension LXWXT of multilayer ceramic capacitor (including a designed value): about 1.6 mm X about 0.8 mm X about 0.6 mmMaterial for dielectric layer: BaTiO3Capacitance: see Example 1 to Example 12 in Table 1Rated voltage: see Example 1 to Example 12 in Table 1Structure of LT cross-section: seeFIG.4(the second internal electrode layers dividing the region where at least two first internal electrode layers were successively layered (internal electrode layered portion) into a plurality of regions),FIG.4showing Example 6Structure of internal electrodeFirst internal electrode layerMaterial: NiShape: seeFIG.6Number of layers: see Example 1 to Example 12 in Table 1Thickness: about 1.0 μmSecond internal electrode layerMaterial: NiShape: seeFIG.7for Example 1 to Example 6 and seeFIG.8for Example 7 to Example 12Number of layers: see Example 1 to Example 12 in Table 1Thickness: thickness of fourth section: about 1.0 μmThickness of fifth and sixth sections: about 1.5 μmStructure of external electrodeFirst external electrode and second external electrodeUnderlying electrode layer: baked layer including conductive metal (Cu) and glass componentThickness of end surface in central portion: about 45 μmPlated layer: two-layered structure of Ni plated layer and Sn plated layerThickness of Ni plated layer: about 4 μmThickness of Sn plated layer: about 4 μmThird external electrode and fourth external electrodeUnderlying electrode layer: baked layer including conductive metal (Cu) and glass componentThickness of end surface in central portion: about 30 μmPlated layer: two-layered structure of Ni plated layer and Sn plated layerThickness of Ni plated layer: about 4 μmThickness of Sn plated layer: about 4 μm (2) Specifications of Sample in Comparative Example In succession, multilayer ceramic capacitors according to Comparative Example 1 and Comparative Example 2 with specifications as below were made. Comparative Example 1 As compared with the multilayer ceramic capacitor according to Example, the multilayer ceramic capacitor according to Comparative Example is a three-terminal multilayer ceramic capacitor identical to the multilayer ceramic capacitor in Example except for alternate layering of the first internal electrode layers and the second internal electrode layers and difference in number of internal electrode layers. FIG.9is a cross-sectional view showing a multilayer ceramic capacitor (Comparative Example 1-3) according to Comparative Example 1. A multilayer ceramic capacitor1A according to Comparative Example 1 includes a multilayer body2in a parallelepiped shape, an external electrode3provided on each of opposing end surfaces, and an external electrode4provided on each of opposing side surfaces. Multilayer body2includes a plurality of layered dielectric layers5and a plurality of first internal electrode layers6aand a plurality of second internal electrode layers6blayered on dielectric layer5. First internal electrode layers6aand second internal electrode layers6bare alternately layered with dielectric layers5being provided between first internal electrode layers6aand second internal electrode layers6b. Details of the specifications will be shown below.Structure of multilayer ceramic capacitor: three-terminal (seeFIG.9)Dimension LXWXT of multilayer ceramic capacitor (including a designed value): about 1.6 mm X about 0.8 mm X about 0.6 mmMaterial for dielectric layer: BaTiO3Capacitance: see Comparative Example 1-1 to Comparative Example 1-12 in Table 2Rated voltage: see Comparative Example 1-1 to Comparative Example 1-12 in Table 2Structure of LT cross-section: seeFIG.9(the first internal electrode layer and the second electrode layer being alternately layered),FIG.9showing Comparative Example 1-3 in Table 2Structure of internal electrodeFirst internal electrode layerMaterial: NiShape: seeFIG.6Number of layers: see Comparative Example 1-1 to Comparative Example 1-12 in Table 2Thickness: about 1.0 μmSecond internal electrode layerMaterial: NiShape: seeFIG.7for Comparative Example 1-1 to Comparative Example 1-6 and seeFIG.8for Comparative Example 1-7 to Comparative Example 1-12Number of layers: see Comparative Example 1-1 to Comparative Example 1-12 in Table 2Thickness: thickness of fourth section: about 1.0 μmThickness of fifth and sixth sections: about 1.0 μmStructure of external electrodeFirst external electrode and second external electrodeUnderlying electrode layer: baked layer including conductive metal (Cu) and glass componentThickness of end surface in central portion: about 45 μmPlated layer: two-layered structure of Ni plated layer and Sn plated layerThickness of Ni plated layer: about 4 μmThickness of Sn plated layer: about 4 μmThird external electrode and fourth external electrodeUnderlying electrode layer: baked layer including conductive metal (Cu) and glass componentThickness of end surface in central portion: about 30 μmPlated layer: two-layered structure of Ni plated layer and Sn plated layerThickness of Ni plated layer: 4 μmThickness of Sn plated layer: 4 μm Comparative Example 2 As compared with the multilayer ceramic capacitor according to Example, a multilayer ceramic capacitor according to Comparative Example is a three-terminal multilayer ceramic capacitor identical to the multilayer ceramic capacitor in Example except for a thickness identical between the fourth section of the second internal electrode layer and the fifth and sixth sections of the second internal electrode layer. FIG.10is a cross-sectional view showing a multilayer ceramic capacitor (Comparative Example 2-3) according to Comparative Example 2. A multilayer ceramic capacitor1B according to Comparative Example 2 includes multilayer body2in a parallelepiped shape, external electrode3provided on each of opposing end surfaces, and external electrode4provided on each of opposing side surfaces. Multilayer body2includes a plurality of layered dielectric layers5and a plurality of first internal electrode layers6aand a plurality of second internal electrode layers6blayered on dielectric layers5. First internal electrode layers6aare larger in number than second internal electrode layers6band at least two first internal electrode layers6aare successively layered. In multilayer ceramic capacitor1B shown inFIG.10, second internal electrode layers6bdivide an internal electrode layered portion7which is a region where at least two first internal electrodes6aare successively layered into a plurality of internal electrode layered portions7a,7b,7c, . . . , and7i. Details of the specifications will be shown below.Structure of multilayer ceramic capacitor: three-terminal (seeFIG.10)Dimension L×W×T of multilayer ceramic capacitor (including a designed value): about 1.6 mm×about 0.8 mm×about 0.6 mmMaterial for dielectric layer: BaTiO3Capacitance: see Comparative Example 2-1 to Comparative Example 2-12 in Table 3Rated voltage: see Comparative Example 2-1 to Comparative Example 2-12 in Table 3Structure of LT cross-section: seeFIG.10(the second internal electrode layers dividing the region (internal electrode layered portion) where at least two first internal electrode layers were successively layered into a plurality of regions),FIG.10showing Comparative Example 2-3 in Table 3Structure of internal electrodeFirst internal electrode layerMaterial: NiShape: seeFIG.6Number of layers: see Comparative Example 2-1 to Comparative Example 2-12 in Table 3Thickness: about 1.0 μmSecond internal electrode layerMaterial: NiShape: seeFIG.7for Comparative Example 2-1 to Comparative Example 2-6 and seeFIG.8for Comparative Example 2-7 to Comparative Example 2-12Number of layers: see Comparative Example 2-1 to Comparative Example 2-12 in Table 3Thickness of fourth section: about 1.0 μmThickness of fifth and sixth sections: about 1.0 μm Structure of external electrodeFirst external electrode and second external electrodeUnderlying electrode layer: baked layer including conductive metal (Cu) and glass componentThickness of end surface in central portion: about 45 μmPlated layer: two-layered structure of Ni plated layer and Sn plated layerThickness of Ni plated layer: about 4 μmThickness of Sn plated layer: about 4 μmThird external electrode and fourth external electrodeUnderlying electrode layer: baked layer including conductive metal (Cu) and glass componentThickness of end surface in central portion: about 30 μmPlated layer: two-layered structure of Ni plated layer and Sn plated layerThickness of Ni plated layer: about 4 μmThickness of Sn plated layer: about 4 μm Tables 1 to 3 show samples in Example, Comparative Example 1, and Comparative Example 2 used in the present experimental example. TABLE 1The Number ofThe Number ofRatedCapac-Layered FirstLayered SecondVoltageitanceInternal ElectrodeInternal Electrode(V)(nF)Layers (Count)Layers (Count)Example 1162207025Example 2251005920Example 325478310Example 45022658Example 55015746Example 65010794Example 7504.705710Example 8502.20805Example 9501.00863Example 10500.47653Example 11500.22702Example 12500.10702 TABLE 2The Number ofThe Number ofRatedCapac-Layered FirstLayered SecondVoltageitanceInternal ElectrodeInternal Electrode(V)(nF)Layers (Count)Layers (Count)Comparative162202425Example 1-1Comparative251001920Example 1-2Comparative2547910Example 1-3Comparative502278Example 1-4Comparative501556Example 1-5Comparative501034Example 1-6Comparative504.70910Example 1-7Comparative502.2045Example 1-8Comparative501.0023Example 1-9Comparative500.4723Example 1-10Comparative500.2212Example 1-11Comparative500.1012Example 1-12 TABLE 3The Number ofThe Number ofRatedCapac-Layered FirstLayered SecondVoltageitanceInternal ElectrodeInternal Electrode(V)(nF)Layers (Count)Layers (Count)Comparative162207025Example 2-1Comparative251005920Example 2-2Comparative25478310Example 2-3Comparative5022658Example 2-4Comparative5015746Example 2-5Comparative5010794Example 2-6Comparative504.705710Example 2-7Comparative502.20805Example 2-8Comparative501.00863Example 2-9Comparative500.47653Example 2-10Comparative500.22702Example 2-11Comparative500.10702Example 2-12 (3) Heat Generation Characteristic Test (Variation in Temperature with Variation in Current) In samples according to Example and samples according to Comparative Example 1 and Comparative Example 2, a thermocouple was brought in contact with the surface of the multilayer body of each sample, a DC current was fed between the first external electrode and the second external electrode, and increase in surface temperature of each sample was measured. Magnitude of the current to each sample was between 0 A and about 5 A, and variation in temperature of each sample was measured for each magnitude of the current. The samples in the heat generation characteristic test were as follows. In Example, the sample (having the capacitance of about 10 nF and including seventy-nine layered first internal electrode layers and four layered second internal electrode layers) in Example 6 was provided. In Comparative Example 1, the sample (having the capacitance of about 47 nF and including nine layered first internal electrode layers and ten layered second internal electrode layers) in Comparative Example 1-3 was provided. In Comparative Example 2, the sample (having the capacitance of about 47 nF and including eighty-three layered first internal electrode layers and ten layered second internal electrode layers) in Comparative Example 2-3 was provided. Three samples each were used, and an average value of the samples was calculated. A temperature increase value (ΔT) was calculated by subtraction of a surface temperature of the multilayer body—room temperature. (4) Test for Measuring DC Resistance (Rdc) of Internal Electrode Layer In the samples according to Example and the samples according to Comparative Example 1, a potential difference between the first external electrode and the second external electrode was measured while a current of 100 mA was fed between the first external electrode and the second external electrode, and a value of the potential difference/100 mA was calculated as the DC resistance (Rdc). As shown in Tables 1 and 2, a value of the capacitance was different among the samples in Example and Comparative Example 1. Twenty samples were prepared for each capacitance of the samples in Example and Comparative Example 1 and an average value of the samples was calculated. (5) Test for Checking Connection Between Internal Electrode Layer and External Electrode Among the samples according to Example and the samples according to Comparative Example 2, a sample having the DC resistance equal to or higher than a prescribed threshold value was determined as defective in connection, and a ratio of occurrence of defective connection to the total number of samples in the whole lot was calculated. As shown in Tables 1 and 3, the number of layered second internal electrode layers was different among the samples in Example and Comparative Example 2. In order to set each sample to have a prescribed capacitance, the number of layered first internal electrode layers was also varied. Ten thousand samples according to each of Example and Comparative Example 2 were prepared for each number of layered second internal electrode layers. Regarding an evaluation result, Table 4 andFIG.11show results of the heat generation characteristic test, Tables 5 and 6 andFIG.12show results of the test to measure the DC resistance of the internal electrode layer, and Tables 7 and 8 andFIG.13show results of the test to check connection between the internal electrode layers and the external electrode. TABLE 4Temperature Increase(° C.)ComparativeComparativeCurrent(A)Example 1-3Example 2-3Example 60000130.90.7293.22.53196.15.843212.211.355018.917.6 TABLE 5CapacitanceDC Resistance(nF)(mΩ)Example 12204.5Example 21005.2Example 3473.5Example 4224.6Example 5154.1Example 6103.7Example 74.705.3Example 82.204.1Example 91.003.3Example 100.474.5Example 110.224.1Example 120.104.1 TABLE 6CapacitanceDC Resistance(nF)(mΩ)Comparative Example 1-12207.6Comparative Example 1-21009.8Comparative Example 1-34720.7Comparative Example 1-42224.8Comparative Example 1-51534.2Comparative Example 1-61054.0Comparative Example 1-74.7065.0Comparative Example 1-82.2075.0Comparative Example 1-91.0096.7Comparative Example 1-100.47122.0Comparative Example 1-110.22149.4Comparative Example 1-120.10158.1 TABLE 7The Number ofRatio ofLayered SecondDefectiveInternal ElectrodeConnectionLayers (Count)(%)Example 1250.00Example 2200.00Example 3100.00Example 480.00Example 560.00Example 640.00Example 7100.00Example 850.00Example 930.00Example 1030.01Example 1120.01Example 1220.03 TABLE 8The Number ofRatio ofLayered SecondDefectiveInternal ElectrodeConnectionLayers (Count)(%)Comparative Example 2-1250.00Comparative Example 2-2200.00Comparative Example 2-3100.01Comparative Example 2-480.27Comparative Example 2-560.11Comparative Example 2-640.37Comparative Example 2-7100.05Comparative Example 2-850.17Comparative Example 2-931.29Comparative Example 2-1030.57Comparative Example 2-1120.63Comparative Example 2-1220.17 (6) Results of Experiment (a) Results in Heat Generation Characteristic Test According to Table 4 andFIG.11, it was determined that, since the sample of the multilayer ceramic capacitor in each of Example and Comparative Example 2 included the internal electrode layered portion which was the region where at least two first internal electrode layers were successively layered, not only a larger number of first internal electrode layers were provided and a larger number of first internal electrode layers connected in parallel were provided but also conduction between the internal electrode layers and the external electrode was excellent, and hence the DC resistance was reduced and accordingly an amount of heat generation was reduced at any current value and increase in temperature could relatively be reduced. Increase in temperature was slightly less in each sample in Example than in each sample in Comparative Example 2. This may be because, unlike each sample in Comparative Example 2, in each sample in Example, the fifth section and the sixth section of the second internal electrode layer were larger in thickness than the fourth section of the second internal electrode layer, and hence heat in the multilayer ceramic capacitor conducted to the second internal electrode layer and heat was readily radiated from the third external electrode and the fourth external electrode. On the other hand, the sample of the multilayer ceramic capacitor in Comparative Example 1 was structured such that the first internal electrode layers and the second internal electrode layers were alternately layered. Therefore, in the sample as in Comparative Example 1-3 including a relatively small number of layered internal electrode layers of each type and being low in capacitance, not only the number of first internal electrode layers was small and the number of first internal electrode layers connected in parallel was small but also conduction between the internal electrode layers and the external electrode was lowered and hence the DC resistance was higher. It was accordingly determined that the amount of heat generation greatly increased with increase in current value and the sample in Comparative Example 1 was larger in increase in temperature than the samples in Example and Comparative Example 2. (b) Results of Test for Measuring DC Resistance of Internal Electrode Layer It was determined according to Table 5 andFIG.12that, since the sample of the multilayer ceramic capacitor in Example included the internal electrode layered portion which was the region where at least two first internal electrode layers were successively layered, not only a larger number of first internal electrode layers were provided and a larger number of first internal electrode layers connected in parallel were provided but also conduction between the internal electrode layers and the external electrode was excellent and hence the value of the DC resistance in Example 1 to Example 12 was relatively as low as 5.5 mΩ, or lower at any capacitance. On the other hand, it was determined according to Table 6 andFIG.12that, since the sample of the multilayer ceramic capacitor in Comparative Example 1 was structured such that the first internal electrode layers and the second internal electrode layers were alternately layered and the number of layered first internal electrode layers and the number of layered second internal electrode layers decreased in the order from Comparative Example 1-1 to Comparative Example 1-6 and from Comparative Example 1-7 to Comparative Example 1-12 to lower the capacitance, the value of the DC resistance greatly increased. (c) Results of Test for Checking Connection Between Internal Electrode Layer and External Electrode It was determined according to Table 7 andFIG.13that, since the fifth section of the second internal electrode layer connected to the third external electrode and the sixth section of the second internal electrode layer connected to the fourth external electrode were larger in thickness than the fourth section of the second internal electrode layer in the sample of the multilayer ceramic capacitor in Example, defective connection did not occur in Examples 1 to 9 and substantially no defective connection occurred as exemplified as a ratio of defective connection being 0.01% in Example 10 where three second internal electrode layers were layered, a ratio of defective connection being 0.01% in Example 11 where two second internal electrode layers were layered, and a ratio of defective connection being 0.03% in Example 12 where two second internal electrode layers were layered. On the other hand, it was determined according to Table 8 andFIG.13that, in the sample of the multilayer ceramic capacitor in Comparative Example 2, the thickness of the fifth section of the second internal electrode layer connected to the third external electrode and the sixth section of the second internal electrode layer connected to the fourth external electrode was identical to the thickness of the fourth section of the second internal electrode layer which was relatively small, and in particular in Comparative Examples 2-4 to 2-6 and Comparative Examples 2-8 to 2-12, the number of layered second internal electrode layers was eight or smaller, and therefore the ratio of defective connection was 0.1% or higher and defective connection between the second internal electrode layer and the external electrode was likely. As set forth above, it was determined that, in the sample of the multilayer ceramic capacitor according to Example, the first internal electrode layers were larger in number than the second internal electrode layers and at least two first internal electrode layers were successively layered, and hence not only a larger number of first internal electrode layers were provided and a larger number of first internal electrode layers connected in parallel were provided while increase in capacitance of the multilayer ceramic capacitor was significantly reduced or prevented, but also conduction between the internal electrode layers and the external electrode was significantly improved and increase in DC resistance could be significantly reduced or prevented. It was determined that, in the multilayer ceramic capacitor according to the preferred embodiments of the present invention, the fifth section and the sixth section of the second internal electrode layer were larger in thickness than the fourth section of the second internal electrode layer, and hence even when the number of the second internal electrode layers was reduced to lower the capacitance of the multilayer ceramic capacitor, connectivity between the second internal electrode layer and the third external electrode and connectivity between the second internal electrode layer and the fourth external electrode could sufficiently be secured. While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims. | 72,565 |
11862399 | DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described as follows with reference to the attached drawings. The present disclosure may, however, be exemplified in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. In the drawings, the shapes and dimensions of elements may be exaggerated for clarity. Further, in the drawings, elements having the same functions within the same scope of the inventive concept will be designated by the same reference numerals. In the drawings, irrelevant descriptions will be omitted to clearly describe the present disclosure, and to clearly express a plurality of layers and areas, thicknesses may be magnified. The same elements having the same function within the scope of the same concept will be described with use of the same reference numerals. Throughout the specification, when a component is referred to as “comprise” or “comprising,” it means that it may include other components as well, rather than excluding other components, unless specifically stated otherwise. In the drawings, a first direction may be defined as a stacked direction or a thickness (T) direction, a second direction may be defined as a length (L) direction, and a third direction may be defined as a width (W) direction. Dielectric Composition A dielectric composition according to some embodiments of the present disclosure includes a BaTiO3-based main component and a first subcomponent, wherein the first subcomponent includes BaCO3and SiO2, and a content of BaCO3is 4.0 mole % or more, relative to 100 mole of Ti of the main component, while a content of SiO2is 7.0 mole % or more, relative to 100 mole of Ti of the main component. In general, it is known that an increase in dissipation factor (DF), an increase in effective capacitance change rate, and a decrease in breakdown voltage are due to the distribution of dielectric grain size accompanied by abnormal grain growth. In addition, it is known that the addition of liquid elements such as BaCO3, SiO2and the like, induces abnormal grain growth. Therefore, conventionally, it has been common to add a small amount of liquid elements such as BaCO3, SiO2and the like. On the other hand, in the present disclosure, by adding a large amount of liquid elements to simultaneously induce abnormal grain growth, a uniform microstructure was secured through uniform grain growth rather than selective growth of some grains due to grain impingement. Accordingly, effects such as a reduction in dissipation factor (DF), a reduction in effective capacitance change rate, and an increase in a breakdown voltage can be secured, thereby improving the reliability of the multilayer electronic component. According to some embodiments of the present disclosure, by adding 4.0 mole % or more of BaCO3, relative to 100 mole of Ti of the main component, and 7.0 mole % or more of SiO2to 100 mole of Ti of the main component, a uniform abnormal grain growth system of dielectric grains can be implemented. Accordingly, effects such as a reduction in dissipation factor (DF), a reduction in effective capacitance change rate, and an increase in a breakdown voltage can be secured, thereby improving the reliability of the multilayer electronic component. Hereinafter, each component of the dielectric composition according to some embodiments of the present disclosure will be described in more detail. a) Main Component A dielectric composition according to some embodiments of the present disclosure may include a main component represented by BaTiO3. According to some embodiments of the present disclosure, the main component may include one or more selected from a group consisting of BaTiO3, (Ba1-xCax) (Ti1-yCay)O3(where x is 0≤x≤0.3, y is 0≤y≤0.1), (Ba1-xCax) (Ti1-yZry)O3(where x is 0≤x≤0.3, y is 0≤y≤0.5), and Ba (Ti1-yZry)O3(where, 0<y≤0.5), but is not necessarily limited thereto. In particular, when the dielectric layer is thinly formed to a thickness of less than 0.6 μm in accordance with the demand for miniaturization and high capacitance, fine powder of 100 nm or less is generally used. Accordingly, the possibility of the occurrence of abnormal grain growth may increase, and it may be difficult to obtain a uniform microstructure. However, as described below, when a large amount of liquid elements are added, abnormal grain growth is simultaneously may be induced, such that a uniform microstructure can be secured through uniform grain growth rather than selective growth of some grains due to grain impingement. Therefore, when an average particle diameter of the main component powder is 100 nm or less, an effect of implementing the uniform grain growth system according to the present disclosure may be more effective. b) First Subcomponent According to some embodiments of the present disclosure, the dielectric composition may include BaCO3and SiO2as first subcomponent elements, wherein the content of BaCO3is 4.0 mole % or more, relative to 100 mole of Ti of the main component, and the content of SiO2is 7.0 mole % or more, relative to 100 mole of Ti of the main component. As excessive amounts of BaCO3and SiO2, liquid-forming elements, are added, grain growth behavior according to temperature becomes slower, a sintering window may be widened, and abnormal grain growth may be simultaneously induced, such that a uniform microstructure can be secured through uniform grain growth rather than selective growth of some grains due to grain impingement. Accordingly, a uniform abnormal grain growth system of dielectric grains can be implemented, and effects such as a reduction in dissipation factor (DF), a reduction in effective capacitance change rate, an increase in breakdown voltage, and the like, can be secured, thereby improving the reliability of a multilayer electronic component. When the content of BaCO3is less than 4.0 mole %, relative to 100 mole of Ti of the main component, or when the content of SiO2is less than 7.0 mole %, relative to 100 mole of Ti of the main component, an effect of inducing abnormal grain growth may be insufficient, such that grain impingement may be insufficient, and accordingly it may be difficult to secure a uniform microstructure. In addition, as BaCO3and SiO2satisfy the content range described above, a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer after sintering may be 55% or more with respect to a total number of the dielectric grains included in the dielectric layer. In some embodiments, the content of BaCO3may be 4.0 mole % or more and 5.0 mole % or less, relative to 100 mole of Ti of the main component, and the content of SiO2may be 7.0 mole % or more and 9.5 mole % or less, relative to 100 mole of Ti of the main component. Accordingly, it is possible to secure a high dielectric constant while improving reliability. When the content of BaCO3exceeds 5.0 mole %, relative to 100 mole of Ti of the main component, or when the content of SiO2exceeds 9.5 mole %, relative to 100 mole of Ti of the main component, a more uniform microstructure can be secured, but the dielectric constant may be lowered, which may cause insufficient capacitance in an MLCC. In addition, as BaCO3and SiO2satisfy the content range described above, a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer after sintering may be 55% or more and 65% or less with respect to a total number of the dielectric grains included in the dielectric layer. Meanwhile, a dielectric constant at room temperature of the dielectric composition according to some embodiments of the present disclosure is not particularly limited, but, for example, the dielectric constant at room temperature may be 2000 or higher. c) Second Subcomponent According to some embodiments of the present disclosure, the dielectric composition may include an oxide or carbonate containing at least one of Mn, V, Cr, Fe, Ni, Co, Cu, and Zn as a second subcomponent. As the second subcomponent, at least one of the oxides or carbonates containing at least one of Mn, V, Cr, Fe, Ni, Co, Cu, and Zn may be included in an amount of 0.1 to 2.0 mole %, relative to 100 moles of Ti of the main component. The second subcomponent may serve to lower a sintering temperature and improve high-temperature withstand voltage characteristics of the multilayer ceramic capacitor to which the dielectric composition is applied. The content of the second subcomponent is an amount included, with respect to 100 mole of Ti of the main component, and may be particularly defined as mole of metal ions included in each subcomponent. When the content of the second subcomponent is lower than 0.1 mole % relative to 100 moles of Ti of the main component, a sintering temperature may increase and the high-temperature withstand voltage characteristics may be slightly decrease. When the content of the second subcomponent is 2.0 mole % or more relative to 100 moles of Ti of the main component, high-temperature withstand voltage characteristics and room temperature specific resistivity may decrease. In particular, the dielectric composition according to some embodiments of the present disclosure may include a second subcomponent having a content of 0.1 to 2.0 mole %, relative to 100 mole of the main component, thereby enabling low temperature sintering and obtaining high high-temperature withstand voltage characteristics. d) third subcomponent According to some embodiments of the present disclosure, the dielectric ceramic composition may include a third subcomponent including one or more selected from a group of consisting of oxides and carbonates of at least one element of Y, Dy, Ho, Sm, Gd, Er, La, Ce, Tb, Tm, Yb, and Nd. The third subcomponent may be included in an amount of 4.0 mole % or less, relative to 100 mole of Ti of the main component. The content of the third subcomponent may be relative to the content of Y, Dy, Ho, Sm, Gd, Er, La, Ce, Tb, Tm, Yb, and Nd included in the third subcomponent, regardless of a form of Y, Dy, Ho, Sm, Gd, Er, La, Ce, Tb, Tm, Yb, and Nd such as oxides or carbonates. For example, a sum of the contents of elements Y, Dy, Ho, Sm, Gd, Er, La, Ce, Tb, Tm, Yb, and Nd included in the third subcomponent may be 4.0 mole % or less, relative to 100 mole of Ti of the main component. The third subcomponent may serve to prevent deterioration of the reliability of the multilayer ceramic capacitor to which the dielectric ceramic composition is applied in some embodiments of the present disclosure. When the content of the third subcomponent exceeds 4.0 mole %, with respect to 100 mole of Ti of the main component, high-temperature withstand voltage characteristics may be deteriorated by generation of a pyrochlore (RE2Ti2O7) secondary phase (where RE is an element of at least one element of Y, Dy, Ho, Sm, Gd, Er, La, Ce, or Nd). e) Fourth Subcomponent According to some embodiments of the present disclosure, the dielectric composition may include an oxide containing Al as a fourth subcomponent. The dielectric composition may further include a fourth subcomponent of 0.5 mole % or less, which is an oxide containing Al, relative to 100 mole of Ti as the main component. A content of the fourth subcomponent may be relative to a content of the element of Al contained in the fourth subcomponent, regardless of a form of addition such as glass, oxide, or carbonate. The fourth subcomponent may serve to lower a sintering temperature and improve high-temperature withstand voltage characteristics of the multilayer ceramic capacitor to which the dielectric composition is applied. When the content of the fourth subcomponent exceeds 0.5 mole %, relative to 100 mole of the main component, problems, such as a decrease in sinterability and density, and generation of a secondary phase, may occur, which is not preferable. Multilayer Electronic Component FIG.1is a schematic perspective view of a multilayer electronic component according to some embodiments of the present disclosure. FIG.2schematically illustrates a cross-sectional view taken along line I-I′ ofFIG.1. FIG.3schematically illustrates a cross-sectional view taken along line II-II′ ofFIG.1. FIG.4is an exploded perspective view schematically illustrating a body of a multilayer electronic component according to some embodiments of the present disclosure. Hereinafter, a multilayer electronic component according to some embodiments of the present disclosure will be described in detail referring toFIGS.1to4. However, portions overlapping with those described in the above-described dielectric composition will be omitted in order to avoid redundant explanations. In addition, a multilayer ceramic capacitor is described as an example of a multilayer electronic component. However, the present disclosure may be applied to various electronic products using the above-described dielectric composition, such as, an inductor, a piezoelectric element, a varistor, a thermistor, or the like. A multilayer electronic component100according to some embodiments of the present disclosure includes a body110including a dielectric layer111and internal electrodes121and122alternately disposed with the dielectric layer; and external electrodes131and132disposed on the body, wherein a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer. The body110is formed such that the dielectric layer111and the internal electrodes121and122are alternately stacked. The specific shape of the body110is not particularly limited, but as illustrated, the body110may have a hexahedral shape, or a shape similar thereto. Due to shrinkage of ceramic powder included in the body110during a sintering process, the body110may have a substantially hexahedral shape, but may not have a hexahedral shape having completely straight lines. The body110may have first and second surfaces1and2opposing each other in a first direction, third and fourth surfaces3and4connected to the first and second surfaces1and2and opposing each other in a second direction, and fifth and sixth surfaces5and6connected to the first and second surfaces1and2, connected to the third and fourth surfaces3and4and opposing each other in a third direction. The plurality of dielectric layers111forming the body110are in a sintered state, and a boundary between adjacent dielectric layers111may be integrated, such that it may be difficult to confirm without using a scanning electron microscope (SEM). The dielectric layer111may be formed using the above-described dielectric composition. A ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer111is 55% or more with respect to the total number of dielectric grains included in the dielectric layer111. Accordingly, effects such as a reduction in dissipation factor (DF), a reduction in an effective capacitance change rate, and an increase in a breakdown voltage can be secured, thereby improving the reliability of the multilayer electronic component. If the ratio of the number of dielectric grains in the size of 100 to 250 nm included in the dielectric layer and having is less than 55% with respect to the total number of dielectric grains included in the dielectric layer111, the microstructure is uneven, and there is a concern that the reliability may be degraded. A ratio of the number of dielectric grains of a size of 100 to 250 nm may be measured from an image obtained by scanning centers in the first and second directions of the cross-section of the body cut in the first and second directions with a scanning electron microscope (SEM). Specifically, in an image scanned at50kmagnification using ZEISS's SEM, a distribution of the dielectric grains according to size was analyzed by using a feret diameter of each dielectric grain measured using Zootos, a type of grain size measurement software, as the size of the dielectric grain. In some embodiments, a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer111may be 55% or more and 65% or less with respect to the total number of the dielectric grains included in the dielectric layer. Accordingly, it is possible to secure a high dielectric constant while improving reliability. When the ratio of the number of dielectric grains of 100 to 250 nm exceeds 65%, there is a concern that the dielectric constant may decrease. Meanwhile, a thickness td of the dielectric layer111needs not be particularly limited. However, in general, when the dielectric layer is formed thinly to have a thickness of less than 0.6 μm, in particular, when the thickness of the dielectric layer is 0.45 μm or less, there was a concern that reliability may decrease. As described above, according to some embodiments of the present disclosure, effects such as a reduction in dissipation factor (DF), a reduction in effective capacity change rate, and an improvement in breakdown voltage can be secured, even when the thickness of the dielectric layer111is 0.45 μm or less, excellent reliability can be secured. Therefore, when the thickness of the dielectric layer111is 0.45 μm or less, the reliability improvement effect according to the present embodiment may be more remarkably improved. The thickness td of the dielectric layer111may refer to an average thickness of the dielectric layer111disposed between the first and second internal electrodes121and122. The average thickness of the dielectric layer111may be measured by scanning an image of the length direction—the thickness direction (L-T cross-section) of the body110with a scanning electron microscope (SEM). For example, with regard to an arbitrary dielectric layer extracted from the image obtained by scanning the cross-section in the first and second directions (length and thickness directions) of the body110cut in a central portion in the third direction (width direction) with a scanning electron microscope (SEM), an average value of the internal electrodes121and122may be measured by measuring the thickness thereof at 30 points having equal intervals in the third direction. The 30 points having equal intervals may be measured at the capacitance formation portion A, meaning a region in which the internal electrodes121and122overlap each other. The body110may include a capacitance formation portion A disposed in the body110and including a first internal electrode121and a second internal electrode122disposed to oppose each other with the dielectric layer111interposed therebetween and having capacitance formed therein and cover portions112and113formed in upper and lower portions of the capacitance formation portion A. In addition, the capacitance formation portion A is a portion serving to contribute to capacitance formation of the capacitor, and may be formed by repeatedly laminating a plurality of first and second internal electrodes121and122with a dielectric layer111interposed therebetween. The cover portions112and113may include an upper cover portion112disposed above the capacitance formation portion A in the first direction, and a lower cover portion113disposed below the capacitance formation portion A in the first direction. The upper cover portion112and the lower cover portion113may be formed by laminating a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance formation portion A in a thickness direction, respectively, and the upper cover portion112and the lower cover portion113may serve to basically prevent damage to the internal electrodes due to physical or chemical stress. The upper cover portion112and the lower cover portion113may not include internal electrodes, and may include the same material as that of the dielectric layer111. That is, the upper cover portion112and the lower cover position113may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material. Meanwhile, the thickness of the cover portions112and113need not be particularly limited. However, the thickness tp of the cover portions112and113may be 20 μm or less in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component. In addition, margin portions114and115may be disposed on a side surface of the capacitance formation portion A. The margin portions may include a margin portion114disposed on the sixth surface6of the body110and a margin portion115disposed on the fifth surface5of the body110. That is, the margin portions114and115may be disposed on both side surfaces of the body110in a width direction. The margin portions114and115may mean regions between an interface of both ends of the first and second internal electrodes121and the body110in a cross-section of the body110in a width-thickness (W-T) direction, as shown inFIG.3. The margin portions114and115may basically serve to prevent damages to the internal electrodes due to physical or chemical stresses. The margin portions114and115may be formed by applying a conductive paste onto the ceramic green sheet to form an internal electrode, except where margin portions are to be formed. In addition, in order to suppress a step by the internal electrodes121and122, after the internal electrodes are cut so as to be exposed to the fifth and sixth surfaces5and6of the body after lamination, the margin portions114and115may also be formed by laminating a single dielectric layer or two or more dielectric layers on both side surfaces of the capacitance formation portion A in the width direction (third direction). The internal electrodes121and122are alternately laminated. The internal electrodes may include first and second internal electrodes121and122. The first and second internal electrodes121and122may be alternately disposed to oppose each other with the dielectric layer111constituting the body110interposed therebetween, and may be exposed to the third and fourth surfaces3and4of the body110, respectively. Referring toFIG.2, the first internal electrode121may be spaced apart from the fourth surface4and exposed through the third surface3, and the second internal electrode122may be spaced apart from the third surface3and exposed through the fourth surface4. In this case, the first and second internal electrodes121and122may be electrically separated from each other by a dielectric layer111disposed in the middle. Referring toFIG.4, the body110may be formed by alternately laminating a ceramic green sheet on which the first internal electrode121is printed and a ceramic green sheet on which the second internal electrode122is printed, and then sintering. A material forming the internal electrodes121and122is not particularly limited, but a material having excellent electrical conductivity may be used. For example, it may be formed by printing a conductive paste for internal electrodes containing at least one or more of palladium (Pd), nickel (Ni), copper (Cu), or alloys thereof on a ceramic green sheet. In addition, the internal electrodes121and122may be formed by printing a conductive paste for internal electrodes including one or more of nickel (Ni), copper (Cu palladium (Pd) Ter (kg), gold (Au), platinum (Pt), tin (S tungsten (W), titanium (Ti), or alloys thereof on a ceramic green sheet. The conductive paste for internal electrodes may be formed by a screen printing method or a gravure printing method, but the present disclosure is not limited thereto. Meanwhile, the thickness to of the internal electrodes may need not to particularly limited. However, in general, when the internal electrode is formed to have a thickness of less than 0.6 μm, in particular, when the thickness of the internal electrode is 0.45 μm or less, there is a concern that reliability may decrease. As described above, according to some embodiments of the present disclosure, since effects such as a reduction in dissipation factor (DF), a reduction in effective capacitance change rate, an improvement in breakdown voltage, and the like can be secured, even when the thickness of the internal electrodes121and122is 0.45 μm less, excellent reliability can be secured. Therefore, when the thickness of the internal electrodes121and122is 0.45 μm or less, the effect according to the present disclosure may be more remarkably improved, and miniaturization and high capacitance of the multilayer electronic component may be more easily achieved. The thicknesses to of the internal electrodes121and122may mean an average thickness of the first and second internal electrodes121and122. The average thickness of the internal electrodes121and122may be measured by scanning an image of a cross-section in the length and thickness direction (L-T) of the body110with a scanning electron microscope (SEM). For example, with regard to arbitrary first and second internal electrodes121and122extracted from the image obtained by scanning the third direction—the first direction cross-section (W-T cross-section) of the body110cut in a central portion in the second direction (L direction) with a scanning electron microscope (SEM), an average value of the internal electrodes121and122may be measured by measuring the thickness thereof at 30 points having equal intervals in the third direction. The 30 points having equal intervals may be measured at the capacitance formation portion A, meaning a region in which the internal electrodes121and122overlap each other. External electrodes131and132are disposed in the body110and connected to the internal electrodes121and122. The external electrodes131and132may be respectively disposed on the third and fourth surfaces3and4of the body110, and may include first and second external electrodes131and132respectively connected to the first and second internal electrodes121and122. Referring toFIG.1, the external electrodes131and132may be disposed to cover both end surfaces of the side margin portions114and115, respectively, in the second direction. In the present embodiment, a structure in which the multilayer electronic component100has two external electrodes131and132is described, but the number or shape of the external electrodes131and132may be changed according to the shape of the internal electrodes121and122or other purposes. Meanwhile, the external electrodes131and132may be formed using any material such as metal, or the like, as long as they have electrical conductivity, and a specific material may be determined in consideration of electrical characteristics, structural stability, and the like, and further may have a structure having multi-layers. For example, the external electrodes131and132may include electrode layers131aand132adisposed in the body110and plating layers131band132bformed on the electrode layers131aand132a. More specifically with respect to the electrode layers131aand132a, for example, the electrode layers131aand132amay be sintered electrodes including a conductive metal or glass, or a resin-based electrode including a conductive metal and a resin. In addition, the electrode layers131aand132amay be formed in such a manner that a sintered electrode and a resin-based electrode are sequentially formed on the body. In addition, the electrode layers131aand132amay be formed by transferring a sheet including a conductive metal onto a body, or may be formed by transferring a sheet including a conductive metal onto a sintering electrode. A material having excellent electrical conductivity may be used as the conductive metal included in the electrode layers131aand132a, and it is not particularly limited. For example, the conductive metal may include one or more of nickel (Ni), copper (Cu), or alloys thereof. The plating layers131band132bmay serve to improve mounting characteristics. The type of the plating layers131band132bis not particularly limited, and may be a plating layer including at least one of Ni, Sn, Pd or alloys thereof, and may be formed of a plurality of layers. For a more specific example of the plating layers131band132b, the plating layers131band132bmay be a Ni plating layer or an Sn plating layer, and may have a form in which a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layers131aand132a, and may have a form in which the Sn plating layer, the Ni plating layer, and the Sn plating layer are sequentially formed. In addition, the plating layers131band132bmay also include a plurality of Ni plating layers and/or a plurality of Sn plating layers. A size of the multilayer electronic component100needs not be particularly limited. However, in order to achieve miniaturization and high capacitance at the same time, since it is necessary to increase the number of stacked dielectric layers by reducing the thickness of the dielectric layer and the internal electrode, in the multilayer electronic component100having a size of 0402 (a length×a width, 0.4 mm×0.2 mm) or less, the reliability and an insulation resistance improvement effect according to the present disclosure may be more remarkably improved. Accordingly, when the length of the multilayer electronic component100is 0.44 mm or less and the width is 0.22 mm or less, considering manufacturing errors and sizes of external electrodes, and the like, a reliability improvement effect according to the present disclosure may be more remarkably improved. Here, the length of the multilayer electronic component100may refer to the maximum size of the multilayer electronic component100in the second direction, and the width of the multilayer electronic component100may refer to the maximum size of the multilayer electronic component100in the third direction. Example In Example of the present disclosure, a dielectric composition containing barium titanate (BaTiO3) as a main component, and having a content of BaTiO3and SiO2as shown in Table 1, relative to 100 mole of Ti as the main component, was prepared, and then a proto-type multilayer ceramic capacitor (MLCC) in which a dielectric layer is formed using a ceramic green sheet including the dielectric composition, was prepared. A dielectric constant, a DF, and an effective capacitance change rate were measured for Test Nos. 1 to 4, which are specimens of the proto-type multilayer ceramic capacitor (MLCC) completed as described above, were shown in Table 1 below. The effective capacitance and DF are values measured using a measuring device, and the dielectric constant is a value converted into a dielectric thickness and a dielectric grain size. TABLE 1EffectivecapacitanceTestBaCO3SiO2Dielectricchange rate (%)number(mole %)(mole %)constantDF(%)1 Vdc3 Vdc1*2.04.042506.39−16.1−59.924.07.032504.61−7.9−47.535.09.520002.65−2.1−24.647.011.013001.78−1.5−15.9(*comparative example) In the case of Test No. 1, the content of BaCO3was less than 4.0 mole %, and the content of SiO2was less than 7.0 mole %, so that it can be seen that the DF and effective capacitance change rate is large and thus reliability is deteriorated. On the other hand, in the case of Test Nos. 2 to 4, it can be seen that the content of BaCO3is 4.0 mole % or more, and the content of SiO2is 7.0 mole % or more, so that the DF and effective capacitance change rate are low and reliability is excellent. However, in the case of Test No. 4, the dielectric constant was slightly low at 1300. Therefore, in order to improve reliability and secure a high dielectric constant, it may be desirable that the content of BaCO3is 4.0 mole % or more and 5.0 mole % or less, relative to 100 mole of Ti of the main component, and the content of SiO2is 7.0 mole % or more and 9.5 mole % or less, relative to 100 mole of Ti of the main component. FIG.5shows an image of a sample chip of Test No. 1 scanned at 50 k magnification using a SEM of a ZEISS company in the central portion in the first and second directions of a cross-section cut in the first and second directions from the center in the third direction.FIG.6is a photograph of measuring a feret diameter of each dielectric grain of Test No. 1 using Zootos, which is a particle diameter measurement software, andFIG.7is a graph of analyzing a distribution of dielectric grains of Test No. 1 according to size using the feret diameter of each dielectric grain measured using Zootos as the size of the dielectric grain. FIGS.8to10are graphs analyzing the distribution of dielectric grains according to size for Test Nos. 2 to 4, respectively, and are graphs obtained by analyzing the same method as inFIG.7. Referring toFIGS.7to10, it can be seen that the size distribution of dielectric grains gradually becomes uniform and smaller as the content of BaCO3and SiO2increase. In addition, in summary with the results in Table 1 above, it can be seen that when a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer, the dielectric composition exhibits improved reliability. In addition, when the ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer, it can be confirmed that a high dielectric constant can be secured while improving reliability. As set forth above, according to some embodiments of the present disclosure, as one of various effects of the present disclosure, the reliability of the multilayer electronic component and the dielectric composition can be improved. While the exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims. | 34,291 |
11862400 | DETAILED DESCRIPTION According to one embodiment, an electronic component includes an element, a first lead, and a second lead. The element includes a first electrode and a second electrode. The first lead is electrically connected with the first electrode, and has a flattened cross section. The second lead is electrically connected with the second electrode. The first lead includes a first connection portion, a first bonding portion, and a first extension portion. The first connection portion is connected with the first electrode. The first bonding portion is configured to be bonded with a substrate. The first bonding portion extends in an extension direction perpendicular to a first counter direction. The first counter direction connects the first electrode and the second electrode. The first extension portion is located between the first connection portion and the first bonding portion. The first extension portion extends in the extension direction. A longitudinal direction of the first bonding portion is different from a longitudinal direction of the first extension portion. The longitudinal direction of the first extension portion crosses a second counter direction. The second counter direction connects the first lead and the second lead. Various embodiments are described below with reference to the accompanying drawings. The drawings are schematic and conceptual; and the relationships between the thickness and width of portions, the proportions of sizes among portions, etc., are not necessarily the same as the actual values. The dimensions and proportions may be illustrated differently among drawings, even for identical portions. In the specification and drawings, components similar to those described previously or illustrated in an antecedent drawing are marked with like reference numerals, and a detailed description is omitted as appropriate. First Embodiment FIGS.1A and1Bare perspective views showing an electronic component according to a first embodiment. As shown inFIGS.1A and1B, the electronic component100according to the first embodiment includes a first lead1, a second lead2, and an element10. The element10includes a first electrode11and a second electrode12. The first lead1and the second lead2are electrically connected respectively to the first and second electrodes11and12. The first lead1and the second lead2are separated from each other. In the description of embodiments hereinbelow, an XYZ coordinate system is used for the purpose of explanation. A direction that connects the first electrode11and the second electrode12is taken as an X-direction (a first counter direction). A direction that connects the first lead1and the second lead2is taken as a Y-direction (a second counter direction). A direction perpendicular to the X-direction and the Y-direction is taken as a Z-direction (an extension direction). The X-direction and the Y-direction are not always limited to being orthogonal. The element10is, for example, a capacitor. A ceramic13is located between the first electrode11and the second electrode12. The first electrode11and the second electrode12face each other in the X-direction via the ceramic13. In the electronic component100, the element10is a single-plate or stacked ceramic capacitor. The element10spreads along a plane crossing the X-direction. In other words, the length in the X-direction of the element10is less than the lengths of the element10in the Y-direction and the Z-direction. The first electrode11, the second electrode12, and the ceramic13may be covered with an insulating resin. As shown inFIG.1A, the first lead1includes a first connection portion1a, a first extension portion1c, and a first bonding portion1e. The first connection portion1ais electrically connected with the first electrode11. At least a portion of the first connection portion1acontacts the first electrode11. For example, the first bonding portion1eis configured to be bonded to an external substrate by solder. The first extension portion1cis located between the first connection portion1aand the first bonding portion1e. The first extension portion1cand the first bonding portion1eextend in the Z-direction. The first lead1has a flattened cross section. In other words, the length in one direction of the first lead1is different from the length in another direction of the first lead1at a cross section perpendicular to the direction in which the first lead1extends. The lengths will now be described more specifically with reference toFIGS.2A to2C. FIGS.2A to2Care cross-sectional views of the first and second leads. More specifically,FIGS.2A to2Care cross-sectional views of the first and second leads1and2cut by the X-Y plane passing respectively through line A1-A2, line B1-B2, and line C1-C2shown inFIGS.1A and1B. Line A1-A2, line B1-B2, and line C1-C2are perpendicular to the X-direction. In the electronic component100, the cross section of the first lead1is rectangular. Therefore, as shown inFIGS.2A to2C, the first lead1includes first to fourth surfaces S1to S4. The second surface S2is located at the side opposite to the first surface S1. The fourth surface S4is located at the side opposite to the third surface S3. A distance D1L between the first surface S1and the second surface S2is different from a distance D1S between the third surface S3and the fourth surface S4. The distance D1L is greater than the distance D1S. The direction that connects the first surface S1and the second surface S2is a transverse direction SD1of the first lead1. The direction that connects the third surface S3and the fourth surface S4is a longitudinal direction LD1of the first lead1. In the electronic component100as shown inFIG.1A, the contact portion of the first connection portion1awith the first electrode11is oblique to the Z-direction. Another portion of the first connection portion1ais curved. Thereby, the longitudinal direction LD1and the transverse direction SD1at one end of the first connection portion1aare perpendicular to the Z-direction.FIG.2Ashows the cross section of the first connection portion1aat the one end. As shown inFIGS.2B and2C, the longitudinal directions LD1and the transverse directions SD1of the first extension portion1cand the first bonding portion1ealso are perpendicular to the Z-direction. As shown inFIGS.2A and2B, the longitudinal direction LD1of the first extension portion1cis different from the longitudinal direction LD1of the first connection portion1a. As shown inFIG.1A, this is because a first intermediate portion1bis located between the first connection portion1aand the first extension portion1c. The first intermediate portion1bis twisted to cause a change of the longitudinal direction LD1of the first lead1. As shown inFIG.1A, a first interference portion1dis located between the first extension portion1cand the first bonding portion1e. The first interference portion1dis twisted so that the first interference portion1dinterferes with a substrate when the electronic component100is mounted to the substrate. In other words, when mounting, the first interference portion1dcatches on a hole provided in the substrate. Also, due to the twist of the first interference portion id as shown inFIGS.2B and2C, the longitudinal direction LD1of the first bonding portion1eis different from the longitudinal direction LD1of the first extension portion1c. The longitudinal direction LD1of the first bonding portion1emay be different from the longitudinal direction LD1of the first connection portion1aor may be parallel to the longitudinal direction LD1of the first connection portion1a. The second lead2has a structure similar to the first lead1. Specifically, as shown inFIG.1B, the second lead2includes a second connection portion2a, a second intermediate portion2b, a second extension portion2c, a second interference portion2d, and a second bonding portion2e. The second connection portion2ais electrically connected with the second electrode12. At least a portion of the second connection portion2acontacts the second electrode12. Also, a portion of the second connection portion2ais curved. The second bonding portion2eis configured to be bonded to the substrate. The second extension portion2cis located between the second connection portion2aand the second bonding portion2e. The second extension portion2cand the second bonding portion2eextend in the Z-direction. The second intermediate portion2bis located between the second connection portion2aand the second extension portion2c. The second interference portion2dis located between the second extension portion2cand the second bonding portion2e. The second lead2has a flattened cross section. As shown inFIGS.2A to2C, the second lead2includes fifth to eighth surfaces S5to S8. The sixth surface S6is located at the side opposite to the fifth surface S5. The eighth surface S8is located at the side opposite to the seventh surface S7. A distance D2L between the seventh surface S7and the eighth surface S8is greater than a distance D2S between the fifth surface S5and the sixth surface S6. The direction that connects the fifth surface S5and the sixth surface S6is a transverse direction SD2of the second lead2. The direction that connects the seventh surface S7and the eighth surface S8is a longitudinal direction LD2of the second lead2. The second intermediate portion2bis twisted to cause a change of the longitudinal direction LD2of the second lead2. Therefore, the longitudinal direction LD2of the second extension portion2cis different from the longitudinal direction LD2of the second connection portion2a. The second interference portion2dis twisted so that the second interference portion2dinterferes with the substrate when mounting. Therefore, the longitudinal direction LD2of the second bonding portion2eis different from the longitudinal direction LD2of the second extension portion2c. The longitudinal direction LD2of the second bonding portion2emay be different from the longitudinal direction LD2of the second connection portion2aand may be parallel to the longitudinal direction LD2of the second connection portion2a. As shown inFIG.2B, the first extension portion1cand the second extension portion2cface each other in the Y-direction. The longitudinal direction LD1of the first extension portion1cand the longitudinal direction LD2of the second extension portion2ccross the Y-direction. The longitudinal direction LD2of the second extension portion2cmay be different from the longitudinal direction LD1of the first extension portion1c. Favorably, the longitudinal direction LD1of the first extension portion1cand the longitudinal direction LD2of the second extension portion2care perpendicular to the Y-direction. In such a case, the second surface S2of the first extension portion1cand the fifth surface S5of the second extension portion2csquarely face each other. Advantages of the first embodiment will now be described. When the electronic component100is mounted, solder wets upward toward the element10from the first and second bonding portions1eand2e. The first lead1and the second lead2respectively include the first extension portion1cand the second extension portion2cto avoid shorts of the element10. The first extension portion1cand the second extension portion2cextend in the Z-direction. By including the first and second extension portions1cand2c, the distance between the substrate and the element10can be increased, and shorts of the element10can be more reliably avoided. There are cases where the electronic component100is used in environments in which vibrations occur. An inertial force is applied to the electronic component100when the electronic component100vibrates. In particular, compared to the first and second leads1and2, a greater inertial force is applied to the element10that is larger and heavier. The inertial force that is applied to the element10is transmitted to the first and second leads1and2and disperses in the substrate. At this time, the load that is applied to the first and second leads1and2becomes large when the distance between the substrate and the element10is long. In particular, the load that is applied to the first and second leads1and2is even greater when the element10is large in size and weight. There is a possibility that the first lead1and the second lead2may be damaged when a large load is applied to the first and second leads1and2. For example, when the electronic component100vibrates in a direction (a cross direction) crossing the Y-direction, an inertial force is generated in the cross direction. Compared to an inertial force generated in the Y-direction, the load and the like on the first and second leads1and2are greater when the inertial force is generated in the cross direction. Therefore, there is a higher likelihood of damage of the first and second leads1and2. For this problem, in the electronic component100, the longitudinal direction LD1of the first extension portion1cis different from the longitudinal direction LD1of the first connection portion1a. The longitudinal direction LD1of the first extension portion1ccrosses the Y-direction that connects the first lead1and the second lead2. The rigidity of the first lead1in the cross direction can be increased by setting the longitudinal direction LD1of the first extension portion1cto cross the Y-direction. The damage of the first lead1when the inertial force is generated in the cross direction can be suppressed thereby. In other words, the likelihood of damage to the first lead1can be reduced. The reliability of the electronic component100can be increased thereby. To further suppress damage of the first lead1, it is also favorable for the distance between the substrate and the element10to be correctly set when mounting the electronic component100. The distance between the substrate and the element10affects the load on the first lead1. A larger load than expected is applied to the first lead1when the electronic component100is mounted if the distance between the substrate and the element10is greater than the design value. The likelihood of damage to the first lead1is increased thereby. FIGS.3A and3Bare perspective views showing the electronic component according to the first embodiment when mounting. FIGS.3A and3Bshow portions of the electronic component100when viewed from mutually-different directions. In the electronic component100as shown inFIG.3A, the longitudinal direction LD1of the first bonding portion1eis different from the longitudinal direction LD1of the first extension portion1c. Therefore, the first interference portion1dbetween the first extension portion1cand the first bonding portion1einterferes with a substrate150when the first bonding portion1eis mounted to the substrate150. The Z-direction position of the first lead1with respect to the substrate150is determined thereby. As a result, the fluctuation of the distance between the substrate and the element10with respect to the design value can be suppressed. FIGS.4A and4Bare perspective views showing the electronic component according to the first embodiment. To further increase the rigidity of the first lead1in the cross direction, it is favorable for the first intermediate portion1bto be more proximate to the element10. For example, as shown inFIG.4A, it is favorable for a length L1in the Z-direction to the first intermediate portion1bfrom the contact portion between the first connection portion1aand the first electrode11to be less than ½ of a length L2in the Z-direction from the contact portion to the first interference portion1d. More favorably, the length L1is less than ⅓ of the length L2. To further increase the rigidity of the first lead1in the cross direction, it is favorable for the distance D1L to be greater than 2 times the distance D1S. On the other hand, it may be difficult to form or mount the first lead1if the distance D1L is too long compared to the distance D1S. It is therefore favorable for the distance D1L to be less than 10 times the distance D1S. For the second lead2of the electronic component100according to the first embodiment as well, similarly to the first lead1, the longitudinal direction LD2of the second extension portion2cis different from the longitudinal direction LD2of the second connection portion2a. The longitudinal direction LD2of the second extension portion2ccrosses the Y-direction. The rigidity of the second lead2in the cross direction can be increased thereby, and damage of the second lead2can be suppressed. As shown inFIG.3B, the second interference portion2dbetween the second extension portion2cand the second bonding portion2eis caused to interfere with the substrate150by setting the longitudinal direction LD2of the second bonding portion2eto be different from the longitudinal direction LD2of the second extension portion2c. The Z-direction position of the second lead2with respect to the substrate150is determined thereby. By determining the positions of both the first and second leads1and2, the fluctuation of the distance between the substrate and the element10can be further suppressed. To further increase the rigidity of the second lead2in the cross direction, it is favorable for the second intermediate portion2bto be more proximate to the element10. For example, as shown inFIG.4B, it is favorable for a length L3in the Z-direction to the second intermediate portion2bfrom the contact portion between the second connection portion2aand the second electrode12to be less than ½ of a length L4in the Z-direction from the contact portion to the second interference portion2d. More favorably, the length L3is less than ⅓ of the length L4. To further increase the rigidity of the second lead2in the cross direction, it is favorable for the distance D2L to be greater than 2 times the distance D2S. On the other hand, it may be difficult to form or mount the second lead2if the distance D2L is too long compared to the distance D2S. It is therefore favorable for the distance D2L to be less than 10 times the distance D2S. The load on the first and second leads1and2is greatest when the inertial force is generated in a direction (an orthogonal direction) orthogonal to the Y-direction. It is therefore favorable for the rigidity of the first extension portion1cand the rigidity of the second extension portion2cto be large in the orthogonal direction. FIG.5is a cross-sectional view of the extension portion of the electronic component according to the first embodiment.FIG.6is a schematic planar view showing the electronic component according to the first embodiment. For the first lead1inFIG.6, the first extension portion1cis shown by a broken line overlapping one end of the first connection portion1a. For the second lead2, the second extension portion2cis shown by a broken line overlapping one end of the second connection portion2a. InFIGS.5and6, a length h is the dimension in the longitudinal direction of the first extension portion1c. A length b is the dimension in the transverse direction of the first extension portion1c. Here, the length h is set to 3 times the length b. A length e1is the distance between a straight line Li1and a straight line Li2. A length e2is the distance between the straight line Li1and a straight line Li3. The straight line Li1is parallel to the Y-direction that passes through the longitudinal-direction center and the transverse-direction center of the first extension portion1c. The straight line Li2is parallel to the Y-direction and passes through one orthogonal-direction end of the first extension portion1c. The straight line Li3is parallel to the Y-direction and passes through the other orthogonal-direction end of the first extension portion1c. Here, the length e1is equal to the length e2. An angle θ is the angle between the Y-direction and the bending axis. The angle θ corresponds to the angle between the longitudinal direction of the first extension portion1cand the direction of the load applied to the first extension portion1c. A second area moment I of the first extension portion1cwhen a load is applied to the first extension portion1cis represented by the following formula 1. I=bh(h2cos2θ+b2sin2θ)12[Formula1] FIG.7shows calculation results of the change of the second area moment with respect to the angle θ. The relationship between the angle θ and the second area moment I according to the formula is illustrated inFIG.7. As shown inFIG.7, the second area moment I has a maximum when the angle θ is 0 degrees. The second area moment I decreases as the angle θ increases. Generally, a safety margin is added to the required strength of a product by considering the manufacturing error, the degradation over time, etc. When the electronic component100is designed so that the angle θ is 0 degrees, by considering the design safety margin, a reduction of about 10% of the second area moment I is acceptable. InFIG.7, the dot-dashed line indicates a value of 0.9 times the maximum second area moment I. As shown inFIG.7, the second area moment I is 0.9 times the maximum second area moment I when the angle θ is about 20 degrees. It is therefore favorable for the angle between the longitudinal direction and the orthogonal direction of the first extension portion1cto be less than 20 degrees. The calculation results described above are applicable to the second extension portion2cas well. It is therefore favorable for the angle between the longitudinal direction and the orthogonal direction of the second extension portion2cto be less than 20 degrees. More favorably, the angle between the longitudinal direction and the orthogonal direction of the first extension portion1cis less than 10 degrees, and the angle between the longitudinal direction and the orthogonal direction of the second extension portion2cis less than 10 degrees. Most favorably, the longitudinal direction LD1of the first extension portion1cand the longitudinal direction LD2of the second extension portion2care perpendicular to the Y-direction. In other words, it is most favorable for the angle θ to be 0 degrees. Damage of the first and second leads1and2can be further suppressed thereby. In this specification, perpendicular (orthogonal) and parallel include not only exactly perpendicular and parallel but also, for example, the fluctuation of manufacturing processes, etc. It is sufficient for the longitudinal direction LD1of the first extension portion1cand the longitudinal direction LD2of the second extension portion2cto be substantially parallel to the orthogonal direction. For example, an error of less than 1 degree is acceptable as the manufacturing fluctuation. FIGS.8A to8Dare schematic views for describing a favorable structure. FIG.8Ashows cross-sectional shapes of the first connection portion1aand the first extension portion1csimilar toFIGS.2A and2B. The first connection portion1ais illustrated by a broken line. To reduce the load on the first intermediate portion1band to suppress damage of the first intermediate portion1b, it is favorable for the angle of the change of the longitudinal direction at the first intermediate portion1bto be less than 90 degrees. In other words, it is favorable for an angle θ1between the longitudinal direction LD1(the broken line) of the first connection portion1aand the longitudinal direction LD1(the solid line) of the first extension portion1cto be less than 90 degrees. Also, it is favorable for a portion of the first connection portion1aand a portion of the first extension portion1cto overlap when viewed along the Z-direction. FIG.8Bshows cross-sectional shapes of the second connection portion2aand the second extension portion2csimilar toFIGS.2A and2B. The second connection portion2ais illustrated by a broken line. To reduce the load on the second intermediate portion2band to suppress damage of the second intermediate portion2b, it is favorable for the angle of the change of the longitudinal direction at the second intermediate portion2bto be less than 90 degrees. In other words, it is favorable for an angle θ2between the longitudinal direction LD2(the broken line) of the second connection portion2aand the longitudinal direction LD2(the solid line) of the second extension portion2cto be less than 90 degrees. Also, it is favorable for a portion of the second connection portion2aand a portion of the second extension portion2cto overlap when viewed along the Z-direction. FIG.8Cshows cross-sectional shapes of the first extension portion1cand the first bonding portion1esimilar toFIGS.2B and2C. The first extension portion1cis illustrated by a broken line. To reduce the load on the first interference portion1dand suppress damage of the first interference portion1d, it is favorable for the angle of the change of the longitudinal direction at the first interference portion1dto be less than 90 degrees. In other words, it is favorable for an angle θ3between the longitudinal direction LD1(the broken line) of the first extension portion1cand the longitudinal direction LD1(the solid line) of the first bonding portion1eto be less than 90 degrees. Also, it is favorable for a portion of the first extension portion1cand a portion of the first bonding portion1eto overlap when viewed along the Z-direction. FIG.8Dshows cross-sectional shapes of the second extension portion2cand the second bonding portion2esimilar toFIGS.2B and2C. The second extension portion2cis illustrated by a broken line. To reduce the load on the second interference portion2dand suppress damage of the second interference portion2d, it is favorable for the angle of the change of the longitudinal direction at the second interference portion2dto be less than 90 degrees. In other words, it is favorable for an angle θ4between the longitudinal direction LD2(the broken line) of the second extension portion2cand the longitudinal direction LD2(the solid line) of the second bonding portion2eto be less than 90 degrees. Also, it is favorable for a portion of the second extension portion2cand a portion of the second bonding portion2eto overlap when viewed along the Z-direction. To suppress damage of the first interference portion1d, it is favorable for the angle of the twist of the first interference portion1dto be small enough that the first interference portion1dinterferes with the substrate. For example, the angle θ3is less than the angle θ1. Similarly, to suppress damage of the second interference portion2d, it is favorable for the angle of the twist of the second interference portion2dto be small enough that the second interference portion2dinterferes with the substrate. For example, the angle θ4is less than the angle θ2. It is favorable for the orientation of the twist of the first interference portion1dto be the same as the orientation of the twist of the first intermediate portion1b. By having the same twist orientation, the first bonding portion1eis positioned further outward from the electronic component100. Similarly, it is favorable for the orientation of the twist of the second interference portion2dto be the same as the orientation of the twist of the second intermediate portion2b. Thereby, the second bonding portion2eis positioned further outward from the electronic component100. The distance in the Y-direction between the first bonding portion1eand the second bonding portion2eis increased, and the stability of the mounted electronic component100is increased. Compared to when a portion of each lead is bent to make a portion that interferes with the substrate, the length of each lead can be reduced by twisting to make the interfering portion. By reducing the length of each lead, the load that is applied to each lead when the electronic component100vibrates can be reduced. FIGS.9A to9Dare schematic views for describing a favorable structure. As shown inFIG.9A, in the Z-direction, a center C1ain the longitudinal direction LD1of the first connection portion1aoverlaps a center C1cin the longitudinal direction LD1of the first extension portion1c. Favorably, the center position in the X-Y plane of the first connection portion1amatches the center position in the X-Y plane of the first extension portion1c. The rotation center of the twist of the first intermediate portion1bmatches the center in the X-Y plane of the first connection portion1aor the first extension portion1c. As shown inFIG.9C, in the Z-direction, the center C1cin the longitudinal direction LD1of the first extension portion1coverlaps a center C1ein the longitudinal direction LD1of the first bonding portion1e. Favorably, the center position in the X-Y plane of the first extension portion1cmatches the center position in the X-Y plane of the first bonding portion1e. The rotation center of the twist of the first interference portion1dmatches the center in the X-Y plane of the first extension portion1cor the first bonding portion1e. For the second lead2as well, similarly to the first lead1, in the Z-direction, a center C2ain the longitudinal direction LD2of the second connection portion2aoverlaps a center C2cin the longitudinal direction LD2of the second extension portion2cas shown inFIG.9B. Favorably, the center position in the X-Y plane of the second connection portion2amatches the center position in the X-Y plane of the second extension portion2c. The rotation center of the twist of the second intermediate portion2bmatches the center in the X-Y plane of the second connection portion2aor the second extension portion2c. As shown inFIG.9D, in the Z-direction, the center C2cin the longitudinal direction LD2of the second extension portion2coverlaps a center C2ein the longitudinal direction LD2of the second bonding portion2e. Favorably, the center position in the X-Y plane of the second extension portion2cmatches the center position in the X-Y plane of the second bonding portion2e. The rotation center of the twist of the second interference portion2dmatches the center in the X-Y plane of the second extension portion2cor the second bonding portion2e. By twisting the first intermediate portion1bso that the center C1aoverlaps the center C1cin the Z-direction, the dimension in the X-direction and the dimension in the Y-direction of the first intermediate portion1bcan be reduced. In other words, the length of the first lead1can be reduced. By reducing the length of the first lead1, the load applied to the first lead1when the electronic component100vibrates can be reduced. Similarly, by twisting the first interference portion1dso that the center C1coverlaps the center C1ein the Z-direction, the length of the first lead1can be reduced. By twisting the second intermediate portion2bso that the center C2aoverlaps the center C2cin the Z-direction, the length of the second lead2can be reduced. By twisting the second interference portion2dso that the center C2coverlaps the center C2ein the Z-direction, the length of the second lead2can be reduced. In the electronic component100as shown inFIG.2A, the longitudinal direction LD1of the first connection portion1aand the longitudinal direction LD2of the second connection portion2aare parallel to each other. The longitudinal direction LD1of the first bonding portion1eand the longitudinal direction LD2of the second bonding portion2eare parallel to each other. However, the relationship between the longitudinal direction LD1of the first connection portion1aand the longitudinal direction LD2of the second connection portion2ais arbitrary as long as the first connection portion1aand the second connection portion2acan be connected respectively to the first and second electrodes11and12. The relationship between the longitudinal direction LD1of the first bonding portion1eand the longitudinal direction LD2of the second bonding portion2eis arbitrary as long as the first bonding portion1eand the second bonding portion2ecan be bonded to the substrate. The angle of the twist of the first intermediate portion1bmay be the same as the angle of the twist of the second intermediate portion2bor may be different from the angle of the twist of the second intermediate portion2b. The angle of the twist of the first interference portion1dmay be the same as the angle of the twist of the second interference portion2dor may be different from the angle of the twist of the second interference portion2d. Dimension Examples Dimension examples of the electronic component100will now be described. The first embodiment is especially favorable when a large element10is used. For example, a length L5of the element10in a direction perpendicular to the X-direction and the Z-direction shown inFIG.4Ais greater than 3 mm and less than 30 mm. A distance D3between the first lead1(the first extension portion1c) and the second lead2(the second extension portion2c) is greater than 3 mm and less than 40 mm. The lengths L2and L4each are greater than 1 mm and less than 15 mm. Lengths L6and L7in the Z-direction of the first and second extension portions1cand2ceach are greater than 0.5 mm and less than 10 mm. FIGS.10A to10Care cross-sectional views showing cross-sectional shapes of the first and second leads. The cross-sectional shapes in the X-Y plane of the first and second leads1and2may be rounded rectangles as shown inFIG.10A. By having rounded corners, damage of the first lead1, the second lead2, or the substrate when bonding can be suppressed. Here, the rounded rectangle shown inFIG.10Aalso is treated as substantially a rectangle. The cross-sectional shapes in the X-Y plane of the first and second leads1and2may be ovals as shown inFIG.10B. In the cross-sectional shapes shown inFIG.10B, the length of the first extension portion1cin the direction perpendicular to the direction connecting the first surface S1and the second surface S2is greater than the distance between the first surface S1and the second surface S2. The perpendicular direction corresponds to the longitudinal direction LD1of the first extension portion1c. The direction that connects the first surface S1and the second surface S2corresponds to the transverse direction SD1of the first extension portion1c. The length of the second extension portion2cin the direction perpendicular to the direction connecting the fifth surface S5and the sixth surface S6is greater than the distance between the fifth surface S5and the sixth surface S6. The perpendicular direction corresponds to the longitudinal direction LD2of the second extension portion2c. The direction that connects the fifth surface S5and the sixth surface S6corresponds to the transverse direction SD2of the second extension portion2c. The cross-sectional shapes in the X-Y plane of the first and second leads1and2may be ellipses as shown inFIG.10C. In such a case, the major-axis direction of the ellipse corresponds to the longitudinal direction. The minor-axis direction of the ellipse corresponds to the transverse direction. The specific cross-sectional shapes of the first and second leads1and2are arbitrary as long as the first lead1and the second lead2have some flattened cross section. Favorably, the cross-sectional shapes in the X-Y plane of the first and second leads1and2are rectangles as shown inFIGS.2A to2CorFIG.10A. This is because leads that have rectangular cross-sectional shapes are easy to manufacture and form, and the rigidity in the cross direction can be most improved. Modifications FIG.11is a perspective view showing an electronic component according to a modification of the first embodiment. The electronic component110according to the modification includes an element10a. The shape of the element10ais different from the shape of the element10. The element10ais a stacked ceramic capacitor. Similarly to the element10, the element10aincludes the first electrode11, the second electrode12, and the ceramic13. The first electrode11, the second electrode12, and the ceramic13may be covered with an insulating resin. In the electronic component110, the X-direction that connects the first electrode11and the second electrode12is parallel to the Y-direction connecting a first lead1vand a second lead2v. The first lead1vhas a flattened cross section and includes the first connection portion1a, the first extension portion1c, the first interference portion1d, and the first bonding portion1e. The first lead1vis different from the first lead1, and does not include the first intermediate portion1b. Therefore, the longitudinal direction of the first connection portion1ais, for example, parallel to the longitudinal direction of the first extension portion1c. Similarly, the second lead2vhas a flattened cross section and includes the second connection portion2a, the second extension portion2c, the second interference portion2d, and the second bonding portion2e. InFIG.11, the second connection portion2ais shown by a broken line. The second lead2vis different from the second lead2and does not include the second intermediate portion2b. Therefore, the longitudinal direction of the second connection portion2ais, for example, parallel to the longitudinal direction of the second extension portion2c. The portion of the first lead1vbetween the first connection portion1aand the first extension portion1cand the portion of the second lead2vbetween the second connection portion2aand the second extension portion2cmay be curved to adjust the distance between the first bonding portion1eand the second bonding portion2e. The longitudinal direction of the first extension portion1cof the first lead1vand the longitudinal direction of the second extension portion2cof the second lead2vcross the Y-direction. The rigidity of the first and second leads1vand2vin the cross direction crossing the Y-direction can be increased thereby. The longitudinal direction of the first bonding portion1eis different from the longitudinal direction of the first extension portion1c. The first lead1vinterferes with an external substrate at the first interference portion1d. The longitudinal direction of the second bonding portion2eis different from the longitudinal direction of the second extension portion2c. The second lead2vinterferes with the external substrate at the second interference portion2d. The Z-direction positions of the first and second leads1vand2vwith respect to the substrate are determined thereby. According to the modification, similarly to the first embodiment described above, damage of the electronic component110can be suppressed, and the reliability of the electronic component110can be increased. FIG.12is a perspective view showing an electronic device according to the first embodiment. As shown inFIG.12, the electronic device200according to the first embodiment includes the electronic component100and the substrate150. The substrate150includes holes151and152. The first and second bonding portions1eand2eof the electronic component100are inserted respectively into the holes151and152and are bonded with wiring on the substrate by solder. The solder and the wiring are not illustrated inFIG.12. When mounting the electronic component100, the position of the electronic component100with respect to the substrate150is determined by the first interference portion1dand the second interference portion2dinterfering with the substrate150. In the electronic device200according to the first embodiment, damage of the first and second leads1and2of the electronic component100can be suppressed. The reliability of the electronic device200can be increased. FIGS.13A to13Care plan views showing substrates of the electronic device according to the first embodiment. The shapes of the holes151and152of the substrate150are arbitrary as long as the first bonding portion1eand the second bonding portion2ecan be inserted and interference with the first interference portion1dand the second interference portion2dis possible. For example, the shapes of the holes151and152may be the rounded rectangles shown inFIG.13Aor the ovals shown inFIG.13B. The shapes of the holes151and152may be shapes made of multiple overlapping circles as shown inFIG.13C. Second Embodiment FIGS.14A and14Bare perspective views showing an electronic component according to a second embodiment. The structures of the first interference portion1dof the first lead1and the second interference portion2dof the second lead2of the electronic component100aaccording to the second embodiment are different from those of the electronic component100according to the first embodiment. FIGS.15A and15Bare schematic views showing the structure of the electronic component according to the second embodiment. FIG.15Ashows the cross-sectional shapes of the first extension portion1cand the first bonding portion1e. The first extension portion1cis illustrated by a broken line. In the electronic component100a, in the Z-direction, the center C1cin the longitudinal direction LD1of the first extension portion1cis shifted from the center C1ein the longitudinal direction LD1of the first bonding portion1e. A rotation center R1of the twist of the first interference portion1dis outside the first interference portion1d. Therefore, the position of the end portion in the longitudinal direction LD1of the first lead1is greatly changed as shown by arrow A1. FIG.15Bshows the cross-sectional shapes of the second extension portion2cand the second bonding portion2e. The second extension portion2cis illustrated by a broken line. For the second lead2as well, similarly to the first lead1, in the Z-direction, the center C2cin the longitudinal direction LD2of the second extension portion2cis shifted from the center C2ein the longitudinal direction LD2of the second bonding portion2e. A rotation center R2of the twist of the second interference portion2dis outside the second interference portion2d. Therefore, the position of the end portion in the longitudinal direction LD2of the second lead2is greatly changed as shown by arrow A2. FIG.16is a perspective view showing an electronic device according to the second embodiment.FIG.17is a plan view showing the substrate of the electronic device according to the second embodiment. As shown inFIG.16, the electronic device200aaccording to the second embodiment includes the electronic component100aand a substrate150a. The first and second bonding portions1eand2eof the electronic component100aare respectively inserted into holes151aand152aof the substrate150aand are bonded with wiring on the substrate by solder. The solder and the wiring are not illustrated inFIG.16. As shown inFIG.17, the holes151aand152aare circular at the X-Y plane. For example, the shapes in the X-Y plane of the holes151aand152aare substantially perfect circles. FIGS.18A and18Bare plan views showing the electronic device according to the second embodiment.FIG.18Acorresponds to an X-Y cross-sectional view passing through the first bonding portion1eand the substrate150a.FIG.18Bcorresponds to an X-Y cross-sectional view passing through the second bonding portion2eand the substrate150a. As shown inFIG.18A, a portion of the first extension portion1coverlaps the substrate150aoutside the hole151awhen viewed along the Z-direction. In other words, the first interference portion1dinterferes with the edge of the hole151a. Similarly, as shown inFIG.18B, a portion of the second extension portion2coverlaps the substrate150aoutside the hole152awhen viewed along the Z-direction. The second interference portion2dinterferes with the edge of the hole152a. Advantages of the second embodiment will now be described. Other than the flattened shapes shown inFIGS.12A to12C, the shapes of the holes into which the first bonding portion1eand the second bonding portion2eare inserted may be circular as shown inFIG.17. Compared to flattened holes, circular holes are easy to form. Also, there are cases where a metal foil is located at the periphery of the hole. Compared to a metal foil that is located along a circular hole, the metal foil easily delaminates when the metal foil is located along a flattened hole. Therefore, from the perspective of the reliability and the ease of manufacture, a circular hole is more favorable than a flattened hole. FIGS.19A and19Bare plan views showing an electronic device according to a reference example. When the holes are circular, the first interference portion1dand the second interference portion2ddo not easily interfere with the substrate.FIGS.19A and19Bshow the electronic component100mounted to the substrate150athat has circular holes. In such a case, as shown inFIGS.19A and19B, the first bonding portion1eand the first extension portion1cundesirably pass through the hole151a; and the second bonding portion2eand the second extension portion2cundesirably pass through the hole152a. The first interference portion1dand the second interference portion2ddo not interfere with the substrate150a. For this problem, in the electronic component100aaccording to the second embodiment, the rotation center of the twist of the first interference portion1dis positioned outside the first interference portion1d. Thereby, as shown inFIG.18A, a portion of the first extension portion1cis positioned outside the hole151a; and the first interference portion1dcan be caused to interfere with the substrate150a. Also, the rotation center of the twist of the second interference portion2dis positioned outside the second interference portion2d. Thereby, as shown inFIG.18B, a portion of the second extension portion2cis positioned outside the hole152a; and the second interference portion2dcan be caused to interfere with the substrate150a. Although the rotation center of the twist of the first interference portion1dmay be positioned inside the first interference portion1d, it is favorable for the rotation center to be positioned outside the first interference portion1d. Compared to when the rotation center of the twist of the first interference portion1dis positioned inside the first interference portion1d, the angle of the twist necessary for the interference can be reduced when the rotation center is positioned outside the first interference portion1d. By reducing the angle of the twist, the reduction of the strength of the first interference portion1dcan be suppressed. Similarly, compared to when the rotation center of the twist of the second interference portion2dis positioned inside the second interference portion2d, the angle of the twist necessary for the interference can be reduced when the rotation center is positioned outside the second interference portion2d; and the reduction of the strength of the second interference portion2dcan be suppressed. While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the invention. The above embodiments can be practiced in combination with each other. | 47,297 |
11862401 | DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described as follows with reference to the attached drawings. However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Accordingly, the shapes and dimensions of elements in the drawings may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements. Further, the same reference numerals are used throughout the drawings for the elements having similar functions and activities. In the specification, unless otherwise specifically indicated, when a certain part “includes” a certain component, it is understood that other components may be further included but are not excluded. To clearly describe the example embodiments, X, Y and Z indicated in the drawings are defined to represent a length direction, a width direction and a thickness direction, respectively, of the multilayer capacitor. Additionally, the Z direction may be used in the same sense as a lamination direction in which the dielectric layers are stacked up. FIG.1is a schematic perspective view of a multilayer capacitor according to an example embodiment of the present disclosure.FIG.2Ais a cross-sectional view taken along line I-I′ ofFIG.1according to an example embodiment of the present disclosure.FIG.2Bis a cross-sectional view taken along line I-I′ ofFIG.1according to a modified embodiment of the present disclosure.FIG.3is a cross-sectional view taken along line II-II′ ofFIG.1.FIG.4Ais a plan view of first and second internal electrodes of a multilayer ceramic capacitor according to an exemplary embodiment.FIG.4Bis a plan view of first and second internal electrodes of a multilayer ceramic capacitor according to a modified embodiment.FIG.5Ais a plan view illustrating the first and second internal electrodes being overlapped according to an embodiment.FIG.5Bis a plan view illustrating the first and second internal electrodes being overlapped according to a modified embodiment.FIG.6is a schematic perspective view of a structure of a multilayer capacitor in which first and second internal electrodes are laminated.FIG.7is a perspective view of the multilayer capacitor ofFIG.1mounted on a board. Referring toFIGS.1,2A,3,4A,5A, and6, a multilayer capacitor100according to an exemplary embodiment of the present disclosure includes a capacitor body110including dielectric layers111and first and second internal electrodes121and122, first and second side portions141and142, first and second external electrodes131and132, and first and second step-compensating portions121aand122a. The capacitor body110is formed by laminating a plurality of the dielectric layers111in the Z direction and plasticizing the same. A configuration and a size of such capacitor body110and a number of the laminated dielectric layers111are not limited to those illustrated in the drawings. Further, a plurality of the dielectric layers111forming the capacitor body110are sintered, and may be integrated with each other so that boundaries between adjacent dielectric layers111are not readily apparent without using a scanning electron microscope (SEM). The configuration of the capacitor body110is not particularly limited, but may be hexahedral. For convenience of description, surfaces of the capacitor body110opposing each other are defined as first and second surfaces 1 and 2, those opposing each other and connected to the first and second surfaces 1 and 2 are defined as third and fourth surfaces 3 and 4, and those opposing each other and connected to the first to fourth surfaces 1 to 4 are defined as fifth and sixth surfaces 5 and 6. The dielectric layers111may contain ceramic powder, for example, BaTiO3-based ceramic powder, or the like. The BaTiO3-based ceramic powder may be (Ba1-xCax) TiO3, Ba(Ti1-yCay)O3, (Ba1-xCax) (Ti1-yZry)O3or Ba(Ti1-yZry)O3, or the like, in which calcium (Ca), zirconium (Zr), or the like, is included in BaTiO3(BT), but is not limited thereto. In addition to the ceramic powder, a ceramic additive, an organic solvent, a plasticizer, a binder and a dispersant, or the like, may be further included in the dielectric layers111. The ceramic additive may include, for example, a transition metal oxide or a transition metal carbide, rare-earth element, magnesium (Mg), aluminum (Al), or the like. The capacitor body110may include an active region including the first and second internal electrodes121and122and the dielectric layers111as a portion contributing to generation of capacity of a capacitor, and upper and low cover regions112and113disposed on upper and lower surfaces of the active region as a margin portion. The upper and lower cover regions112and113may be formed of a material and may have a configuration the same as those of the dielectric layers111of the active region, except that the upper and lower cover regions112and113do not include internal electrodes. The upper and lower cover regions112and113may be formed by laminating a single dielectric layer or at least two dielectric layers on an upper surface and a lower surface of the active region in the Z direction. Such upper and lower cover regions112and113may prevent damage to the first and second internal electrodes121and122caused by physical or chemical stress. The first and second internal electrodes121and122are electrodes having different polarities and are formed by printing a conductive paste containing a conductive metal on the dielectric layers to a predetermined thickness. The first and second internal electrodes121and122may be alternately laminated in the lamination direction with respective dielectric layers111interposed therebetween, and may be electrically insulated by the dielectric layers111interposed therebetween. The first internal electrode121is formed to expose through the third and fifth surfaces 3 and 5 of the capacitor body110. The first internal electrode121may be exposed through a corner connecting the third and fifth surfaces 3 and 5 of the capacitor body110. The first step-compensating portion121ais formed on a margin portion in a Y direction on the dielectric layer on which the second internal electrode122is formed on the first internal electrode121. The first step-compensating portion121amay be formed to extend to an upper surface of the first internal electrode121in the Z direction. For example, the first step-compensating portion121amay be made of the same material as the first internal electrode121. The present disclosure, however, is not limited thereto. For another example, the first step-compensating portion121aand the dielectric layer111may be made of the same material. A thickness of the first step-compensating portion121amay be the same as or smaller than that of the dielectric layer111. If the first step-compensating portion121ais thicker than the dielectric layer111, the first step-compensating portion121amay give rise to a concave shape due to hyper-compensation, thereby causing an exterior defect of the capacitor body110. The second internal electrode122is formed to expose through the fourth and sixth surfaces 4 and 6 of the capacitor body110. The second internal electrode122may be exposed through a corner connecting the fourth and sixth surfaces 4 and 6 of the capacitor body110. The second step-compensating portion122amay be formed on a margin portion in a Y direction on the dielectric layer on which the first internal electrode121is formed on the second internal electrode122. For example, the second step-compensating portion122amay be made of the same material as the second internal electrode122. The present disclosure, however, is not limited thereto. For another example, the second step-compensating portion122aand the dielectric layer111may be made of the same material. The second step-compensating portion122amay be formed to extend to an upper surface of the second internal electrode122in the Z direction. A thickness of the second step-compensating portion122amay be the same as or less than that of the dielectric layer111. If the second step-compensating portion122ais thicker than the dielectric layer111, the second step-compensating portion122amay give rise to a concave shape due to hyper-compensation, thereby causing an exterior defect of the capacitor body110. In other words, the first and second internal electrodes121and122are configured to be alternately offset in the Y direction viewed on a Y-Z plane of the capacitor body110in order to reduce difference in density between the active region in which the internal electrodes are formed and the margin portions in which the internal electrodes are not formed. As in the exemplary embodiment, the presence of the first and second internal electrodes121and122gives rise to not only an increased basic surface area of the first and second internal electrodes121and122but also an increased surface area of an overlapping area of the first and second internal electrodes121and122, thereby increasing capacity of the multilayer capacitor100. Further, the first and second step-compensating portions121aand122areduce a step generated by the internal electrodes and thus increase accelerated life of insulation resistance, thereby preventing delamination between layers or occurrence of a crack and deterioration of reliability of high temperature acceleration and moisture resistance loading. By enhancing BDV characteristics, insulation breakdown may also be prevented. The first and second internal electrodes121and122may be in contact with and electrically connected to the first and second external electrodes131and132, respectively, through the portion exposed through the third and fourth surfaces 3 and 4 of the capacitor body110. Accordingly, when voltage is applied to the first and second external electrodes131and132, charge is accumulated between the first and second internal electrodes121and122facing each other. Capacitance of the multilayer capacitor100is proportional to the surface area of the area where the first and second internal electrodes overlap. One of silver (Ag), palladium (Pd), platinum (Pt), nickel (Ni) and copper (Cu) or alloys thereof may be used for the conductive metal contained in the conductive paste forming the first and second internal electrodes121and122, but it is not limited thereto. A method for printing the conductive paste may be a screen-printing method, a gravure printing method, or the like, but is not limited thereto. A first side portion141is disposed on the fifth surface 5 of the capacitor body110. The first side portion141is in contact with the fifth surface 5 of the capacitor body110so as to cover the portion exposed through the fifth surface 5 of the capacitor body110in the first internal electrode121. The first side portion141may be formed of ceramic slurry or an insulating polymer material, or the like, but is not limited thereto. Such first side portion141may compensate a margin on the fifth surface 5 of the capacitor body110in the Y direction, which is reduced by the offset arrangement of the first internal electrode121. A second side portion142is disposed on the sixth surface 6 of the capacitor110. Further, the second side portion142in contact with the sixth surface 6 of the capacitor body110so as to cover the portion exposed through the sixth surface 6 of the capacitor body110in the second internal electrode122. The second side portion142may be formed of ceramic slurry or an insulating polymer material, or the like, but is not limited thereto. Such second side portion142may compensate a margin on the sixth surface 6 of the capacitor body110in the Y direction, which is reduced by the offset arrangement of the second internal electrode122. The first and second side portions141and142may protect the capacitor body110and the first and second internal electrodes121and122from external shock, or the like, and secure insulativity and moisture resistance reliability around the capacitor body110. The first and second external electrodes131and132are provided with voltage with different polarities and are disposed on the third and fourth surfaces 3 and 4 of the capacitor body110, and are respectively connected to the portion of the first and second internal electrodes121and122, which is exposed through the third and fourth surfaces 3 and 4 of the capacitor body110. The first external electrode131may include a first connection portion131aand a first band portion131b. The first connection portion131ais disposed on the third surface 3 of the capacitor body110and is in contact with an end portion of the first internal electrode121, which is exposed externally through the third surface 3 of the capacitor body110, to physically and electrically connect the first internal electrode121and the first external electrode131. The first band portion131bextends from the first connection portion131ato a portion of the first surface 1 of the capacitor body110. The first band portion131b, if necessary, may further extend toward the second, fifth and sixth surfaces 2, 5 and 6 of the capacitor body110so as to partially cover one end portion of the first and second side portions141and142for improvement of adhesive strength. The second external electrode132may include a second connection portion132aand a second band portion132b. The second connection portion132ais disposed on the fourth surface 4 of the capacitor body110and is in contact with an end portion of the second internal electrode122, which is exposed externally through the fourth surface 4 of the capacitor body110, to physically and electrically connect the second internal electrode122and the second external electrode132. The second band portion132bextends from the first connection portion132ato a portion of the first surface 1 of the capacitor body110. The second band portion132b, if necessary, may further extend toward the second, fifth and sixth surfaces 2, 5 and 6 of the capacitor body110so as to partially cover the other end portion of the first and second side portions141and142for improvement of adhesive strength. Such first and second external electrodes131and132may be formed by a conductive paste containing a conductive metal. The conductive metal may be Ag, Ni, Cu or alloys thereof, but is not limited thereto. Meanwhile, a plating layer (not illustrated) may be formed on the first and second external electrodes131and132, if necessary. The plating layer is for improvement of mutual adhesive strength between the multilayer capacitor100and a printed circuit board when mounting the multilayer capacitor100on the printed circuit board as a solder. Such a plating layer may have a structure in which a nickel (Ni)-plating layer is formed on the first and second external electrodes131and132and a tin (Sn)-plating layer is formed on the Ni-plating layer, but is not limited thereto. Meanwhile, in the exemplary embodiment, an average thickness of the first and second internal electrodes121and122may be 0.41 μm or less. The multilayer capacitor100of the exemplary embodiment has a structure in which the first and second internal electrodes121and122are exposed through the fifth and sixth surfaces 5 and 6 of the capacitor body110. Referring toFIGS.2B,4B, and5B, a multilayer capacitor according to a modified embodiment of the present disclosure may further include third and fourth step-compensating portions121band122b, as compared to the above-described embodiment. A detailed description of the contents overlapping those described above is thus omitted. The third step-compensating portion121band the fourth step-compensating portion122bmay be disposed on opposing edge portions of the capacitor body110in an X direction. The third step-compensating portion121bis formed on an edge portion in the X direction on the dielectric layer on which the second internal electrode122is formed on the first internal electrode121. The third step-compensating portion121bmay be exposed from the third surface 3 and be spaced apart from the second internal electrode122. The third step-compensating portion121bmay extend from the first step-compensating portion121ain the Y direction. The third step-compensating portion121bmay be formed to extend to an upper surface of the first internal electrode121in the Z direction. For example, the third step-compensating portion121bmay be made of the same material as the first internal electrode121. The present disclosure, however, is not limited thereto. For another example, the third step-compensating portion121band the dielectric layer111may be made of the same material. A thickness of the third step-compensating portion121bmay be the same as or smaller than that of the dielectric layer111. If the third step-compensating portion121bis thicker than the dielectric layer111, the third step-compensating portion121bmay give rise to a concave shape due to hyper-compensation, thereby causing an exterior defect of the capacitor body110. The fourth step-compensating portion122bmay be formed on another edge portion in the X direction on the dielectric layer on which the first internal electrode121is formed on the second internal electrode122. For example, the fourth step-compensating portion122bmay be made of the same material as the second internal electrode122. The present disclosure, however, is not limited thereto. For another example, the fourth step-compensating portion122band the dielectric layer111may be made of the same material. The fourth step-compensating portion122bmay be exposed from the fourth surface 4 and be spaced apart from the first internal electrode121. The fourth step-compensating portion122bmay extend from the second step-compensating portion122ain the Y direction. The fourth step-compensating portion122bmay be formed to extend to an upper surface of the second internal electrode122in the Z direction. A thickness of the fourth step-compensating portion122bmay be the same as or less than that of the dielectric layer111. If the fourth step-compensating portion122bis thicker than the dielectric layer111, the fourth step-compensating portion122bmay give rise to a concave shape due to hyper-compensation, thereby causing an exterior defect of the capacitor body110. Accordingly, as the margin portions are alternately laminated in the Y direction, saddle generated around the side portions of conventional multilayer capacitor can be resolved by reducing occurrence of a step in the end portions of the internal electrodes. In addition, reliability would not be an issue even when the thickness of the first and second internal electrodes121and122is reduced and multilayered. In this regard, reliability can be secured for the multilayer capacitor100and capacity thereof can be increased. Based onFIG.7, a board, on which the multilayer capacitor of the exemplary embodiment is mounted, includes a board210having first and second electrode pads221and222on one surface thereof and a multilayer capacitor100mounted on a top surfaces of the board210so as that the first and second external electrodes131and132are connected to the first and second electrode pads221and222, respectively. In the exemplary embodiment, the multilayer capacitor100is illustrated and described as being mounted on the board210by solders231and232; however, if necessary, a conductive paste may be used instead thereof. According to the present disclosure, due to the side portions additionally attached after the internal electrodes are exposed through one surface of the capacitor body in the width direction, the surface area of the overlapped area of the internal electrodes is maximized, thereby increasing the capacity of the multilayer capacitor. Further, step-compensating portions are formed in the margin portions in the width direction, in which the internal electrodes are facing each other, so that occurrence of a step at an interface between the internal electrodes and the margin portions is reduced. Accordingly, deterioration of reliability of the multilayer capacitor and likelihood of dielectric breakdown and short circuit fault rate can be reduced. While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims. | 20,673 |
11862402 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. A multilayer ceramic capacitor1according to a preferred embodiment of the present invention will be described.FIG.1is a schematic perspective view of the multilayer ceramic capacitor1of the present preferred embodiment.FIG.2is a cross-sectional view taken along the line II-II of the multilayer ceramic capacitor1shown inFIG.1.FIG.3is a cross-sectional view taken along the line of the multilayer ceramic capacitor1inFIG.1. The multilayer ceramic capacitor1has a rectangular or substantially rectangular parallelepiped shape, and includes a multilayer body2, and a pair of external electrodes3provided at both ends of the multilayer body2. The multilayer body2includes an inner layer portion11including a plurality of sets of dielectric layers14and internal electrode layers15. In the following description, as terms representing the orientations of the multilayer ceramic capacitor1, a direction in which the pair of external electrodes3are provided is defined as a length direction L. A direction in which the dielectric layers14and the internal electrode layers15are laminated (stacked) is defined as a lamination (stacking) direction T. A direction intersecting both the length direction L and the lamination direction T is defined as a width direction W. In the present preferred embodiment, the width direction is perpendicular or substantially perpendicular to both the length direction L and the lamination direction T. Furthermore, a cross-section extending in the length direction L and the lamination direction T is defined as an LT cross-section, a cross-section extending in the length direction L and the width direction W is defined as an LW cross-section, and a cross-section extending in the width direction W and the lamination direction T is defined as a WT cross-section.FIG.2is an LT cross-sectional view at the middle portion in the width direction W of the multilayer ceramic capacitor1.FIG.3is a WT cross-section at the middle portion in the length direction L of the multilayer ceramic capacitor1. Furthermore, among the six outer surfaces of the multilayer body2, a pair of outer surfaces opposing each other in the lamination direction T is defined as a first main surface Al and a second main surface A2, a pair of outer surfaces opposing each other in the width direction W is defined as a first side surface B1and a second side surface B2, and a pair of outer surfaces opposing each other in the length direction L is defined as a first end surface C1and a second end surface C2. When it is not necessary to particularly distinguish the first main surface A1and the second main surface A2from each other, they are collectively referred to as the main surface A, when it is not necessary to particularly distinguish between the first side surface B1and the second side surface B2, they are collectively referred to as a main surface B, and when it is not necessary to particularly distinguish between the first end surface C1and the second end surface C2, they are collectively referred to as an end surface C. The dimension of the multilayer ceramic capacitor1is not particularly limited. However, for example, it is preferable that the dimension in the length direction L is about 0.2 mm or more and about 1.2 mm or less; the dimension in the width direction W is about 0.1 mm or more and about 0.7 mm or less, and the dimension in the lamination direction T is about 0.1 mm or more and about 0.7 mm or less. Multilayer Body2 The multilayer body2includes a laminate chip10, and side gap portions20provided on both sides in the width direction W of the laminate chip10. In the multilayer body2, ridge portions R1of the two surfaces of the main surface A, the side surface B, and the end surface C are chamfered and rounded. Laminate Chip10 The laminate chip10includes the inner layer portion11, an upper outer layer portion12ain the vicinity of the first main surface A1of the inner layer portion11, and a lower outer layer portion12bin the vicinity of the second main surface A2of the inner layer portion11. When it is not necessary to particularly distinguish between the upper outer layer portion12aand the lower outer layer portion12b,they are collectively referred to as an outer layer portion12. Inner Layer Portion11 The inner layer portion11includes the plurality of sets of dielectric layers14and internal electrode layers15which are alternately laminated along the lamination direction T. Dielectric layer14 The dielectric layers14each preferably have a thickness of, for example, about 0.4 μm or more and about 1.0 μm or less, and more preferably, about 0.4 μm or more and about 0.6 μm or less. The dielectric layers14are each made of a ceramic material. As the ceramic material, for example, a dielectric ceramic including BaTiO3as a main component is used. The number of dielectric layers14of the laminate chip10in addition to the upper outer layer portion12aand the lower outer layer portion12bis preferably, for example, 15 or more and 700 or less. In the present preferred embodiment, the dielectric layers14do not include Ni (nickel), or alternatively, the Ni content in the dielectric layers14is less than the Ni content in the outer layer portion12. Thus, it is possible to increase the size of the particles of the dielectrics in the dielectric layers14, such that it is possible to increase the capacitance. Internal Electrode Layer15 The internal electrode layer15preferably has a thickness of, for example, about 0.2 μm or more and about 0.8 μm or less. The number of the internal electrode layers15is preferably, for example, 15 or more and 700 or less. The average thickness of each of the plurality of internal electrode layers15and the plurality of dielectric layers14is measured as follows. First, a cross section perpendicular or substantially perpendicular to the length direction L of the multilayer body2exposed by polishing is observed by a scanning electron microscope. Next, the thicknesses of the total of five lines including a center line along the lamination direction T passing through the center of the cross-section of the multilayer body2, and two lines respectively drawn on both sides at equal or substantially equal intervals from the center line are measured. The average of these five measurements is calculated. To obtain a more accurate average thickness, the above five measurements are obtained at each of the upper portion, the middle portion, and the lower portion in the lamination direction T are obtained, and the average value of these measurements is used as the average thickness. The internal electrode layer15includes a plurality of first internal electrode layers15A and a plurality of second internal electrode layers15B. The first internal electrode layers15A and the second internal electrode layers15B are alternately provided. When it is not necessary to particularly distinguish between the first internal electrode layer15A and the second internal electrode layer15B, they will be collectively referred to as an internal electrode layer15. The first internal electrode layers15A each include a first opposing portion152afacing the second internal electrode layer15B, and a first lead-out portion151aextending from the first opposing portion152atoward the first end surface C1. The end portion of the first lead-out portion151ais exposed to the first end surface C1, and electrically connected to the first external electrode3A to be described later. The second internal electrode layers15B each include a second opposing portion152bfacing the first internal electrode layer15A, and a second lead-out portion151bextending from the second opposing portion152btoward the second end surface C2. The end portion of the second lead-out portion151bis electrically connected to the second external electrode3B to be described later. Furthermore, a charge is accumulated in the first opposing portion152aof the first internal electrode layer15A and the second opposing portion152bof the second internal electrode layer15B, and the characteristics of the capacitor are provided. FIG.4is an enlarged view of the portion Q1ofFIG.3. As shown inFIG.4, in the WT cross-section at the middle portion in the length direction L, the positional deviation d1between the end portions of the adjacent internal electrode layers15in the width direction W is, for example, about 5 μm or less. Furthermore, the positional deviation d2between the end portion which is in the vicinity of the side surface B and located outermost in the width direction W and the end portion which is located innermost in the width direction W among all of the internal electrode layers15is, for example, about 10 μm or less. That is, the end portions in the width direction W of the laminated internal electrode layers15are located at the same or substantially the same position in the width direction W. In other words, the positions of the end portions are aligned or substantially aligned in the lamination direction T. In the present preferred embodiment, the internal electrode layers15are, for example, made mainly of Ni (nickel) including Sn (tin). However, the present invention is not limited thereto, and the internal electrode layers15may be made of, for example, a metallic material such as Cu, Ag, Pd, a Ag—Pd, and Au. Furthermore, Mg (magnesium) included in the side gap portions20is segregated at the side gap portions20on both side surfaces of the internal electrode layers15. Sn-layer16Extending from Internal Electrode Layer15 FIG.5is an enlarged view of the circled portion Q2ofFIG.2. The Sn-layer16is provided on the surfaces of the internal electrode layers15. The Sn-layer16is formed by migrating from the inside to the surface during firing. The Sn-layer16extends from the surfaces of the internal electrode layers15to a boundary region Z1between the external electrode3, and the dielectric layers14and the internal electrode layers15adjacent to one another in the lamination direction T. Furthermore, the Sn-layer16also covers the boundary surfaces of the internal electrode layers15with the external electrode3. It should be noted that it is not necessary for the Sn-layer16to cover the entire internal electrode layers15, and the Sn-layer16can only cover a portion of the internal electrode layers15. Effect of Sn-layer16 In the multilayer ceramic capacitor1of the present preferred embodiment, since the Sn-layer16extends to the boundary region Z1between the dielectric layers14and the external electrode3, for example, it is possible to reduce or prevent moisture through the boundary surface between the external electrode3and the multilayer body2from flowing in the interior of the inner layer portion11, which provides high humidity resistance. In the present preferred embodiment, the Sn-layer16extending from one of the internal electrode layers15is not coupled to the Sn-layer16extending from another internal electrode layer15adjacent to the one internal electrode layer15, and there is also a portion where the Sn-layer16is not provided in the boundary region Z1between the dielectric layer14and the external electrode3. However, it is sufficiently effective to improve the humidity resistance of the multilayer ceramic capacitor1even in such a case. Outer Layer Portion12 The thickness of the outer layer portion12is preferably about 9.5 μm or more and about 30 μm or less, and more preferably about 9.5 μm to about 20 μm, for example, for both the upper outer layer portion12aand the lower outer layer portion12b. Ni in Outer Layer Portion12 Both the upper outer layer portion12aand the lower outer layer portion12bof the outer layer portion12are made of a dielectric ceramic material including BaTiO3as a main component, similar to the dielectric layer14of the inner layer portion11, for example. However, the upper outer layer portion12aand the lower outer layer portion12bdiffer from the dielectric layer14of the inner layer portion11in that the former includes Ni, or the content of Ni is higher in the former than in the latter. As schematically shown inFIG.4, Ni is not provided in a region Z3in a vicinity of the internal electrode layer15in the outer layer portion12, since Ni is absorbed by the internal electrode layer15. That is, Ni is distributed unevenly rather than entirely in the outer layer portion12. Furthermore, the density of Ni is highest in the middle portion of the outer layer portion12in the lamination direction T. Advantageous Effects Since the multilayer ceramic capacitor1of the present preferred embodiment includes Ni in the outer layer portion12, particles of the dielectric ceramic after firing are densified. Furthermore, since the pores provided in the dielectric ceramic in the outer layer portion12are filled with Ni, humidity resistance is increased in the multilayer ceramic capacitor1. Furthermore, Ni in the outer layer portion12is diffused into the Cu-layer of the external electrode3, such that the adhesion with the external electrode3is improved. Although Mg is not included in the outer layer portion12in the present preferred embodiment, Mg may be included in the outer layer portion12. Side Gap Portion20 The side gap portions20include side gap portions20which are respectively provided in the vicinity of the first side surface B1of the laminate chip10and the second side surface B2of the laminate chip10. When it is not necessary to particularly distinguish between the first side gap portion20aand the second side gap portion20b,they will be collectively referred to as a side gap portion20. Component of Side Gap Portion20 The side gap portions20each cover, along the end portions, the end portions in the width direction W of the internal electrode layers15exposed at the both side surfaces of the laminate chip10. There is an interface U shown inFIGS.3and4between the laminate chip10and the side gap portion20. The side gap portions20are made of, for example, a dielectric ceramic material including BaTiO3as a main component, similarly to the dielectric layers14, but further include Mg as a sintering aid. The content of Mg is, for example, about 0.2 mol % or more and about 2.8 mol % or less with respect to 100 moles of Ti at the middle portion in the length direction L of the side gap portion20. When Mg is about 2.8 mol % or less, since the grain growth of the dielectric is not reduced or prevented in the dielectric layer14in the vicinity of the outermost layer of the internal electrode layers15, a capacitance decrease is less likely to occur. Furthermore, Mg of the side gap portion20and Ni of the outer layer portion12are segregated in a boundary region Z2between the side gap portion20and the outer layer portion12during firing. A portion of the segregated Ni and a portion of the segregated Mg provides a Ni—Mg oxide. That is, Ni—Mg oxide is segregated in the boundary region Z2. A portion of Ni segregated in the boundary region Z2is present in the form of Ni in the boundary region Z2. A portion of Mg segregated in the boundary region Z2is present in the form of Mg in the boundary region Z2. Therefore, Ni—Mg oxide, Ni, and Mg are segregated in the boundary region Z2. Ni is not included in the dielectric layer14. Therefore, the segregation of Ni and Ni-Mg oxide in the boundary region between the dielectric layer14and the side gap portion20is smaller than the segregation of Ni and Ni—Mg oxide in the boundary region Z2. Since the dielectric layers14do not include Ni, the grain growth of the particles of the dielectric layers14is not reduced or prevented. Therefore, the particles of the dielectric layers14become large, such that it is possible to increase the capacitance of the multilayer ceramic capacitor1. A Ni—Mg alloy, which is an alloy of Mg included in the side gap portion20and Ni included in the outer layer portion12, is segregated in the boundary region Z2between the side gap portion20and the outer layer portion12. The boundary region Z2tends to become the penetration path of moisture. A portion of the pores in the boundary region Z2is filled with Ni-Mg oxide. A portion of the pores present in the boundary region Z2is filled with Ni or Mg. Thus, the multilayer ceramic capacitor1of the present preferred embodiment has high humidity resistance. Boundary Region Z2 Regarding the end portions of the internal electrode layers15as described above, the positional deviation d1between the adjacent internal electrode layers15on the WT cross-section including the width direction W and the lamination direction T at the middle portion in the length direction L shown inFIG.4, is, for example, about 5 μm less. Furthermore, the positional deviation d2among the end portion which is located outermost in the width direction W of the internal electrode layer15, the end portion which is located innermost in the width direction W of the internal electrode layer15, and all of the internal electrode layers15, is, for example , about 10 μm or less. The boundary region Z2between the side gap portion20and the outer layer portion12is a substantially band-shaped region of about 3 μm in the width direction W around the extended line e extending in the lamination direction T on the middle in the width direction W between the end portion of the internal electrode layer15located outermost in the width direction W, and the end portion of the internal electrode layer15located innermost in the width direction W. The segregation of Ni—Mg oxide, the segregation of Ni, and the segregation of Mg can be observed by WDX (wavelength-dispersive X-ray spectrometry). External Electrode3 The external electrodes3each include a first external electrode3A provided on the first end surface C1of the multilayer body2, and a second external electrode3B provided on the second end surface C2of the multilayer body2. When it is not necessary to particularly distinguish between the first external electrode3A and the second external electrode3B, they will be collectively referred to as an external electrode3. The external electrode3covers not only the end surface C, but also covers portions of the main surface A and the side surface B which are in the vicinity of the end surface C. As described above, the end portion of the first lead-out portion151aof the first internal electrode layer15A is exposed at the first end surface C1, and electrically connected to the first external electrode layer3A. Furthermore, the end portion of the second lead-out portion151bof the second internal electrode layer15B is exposed at the second end surface C2, and is electrically connected to the second external electrode3B. Thus, a plurality of capacitor elements are electrically connected in parallel between the first external electrode3A and the second external electrode3B. External Electrode3 Connection Ratio Between Internal Electrode layer15and External electrode3 FIG.6is an LW cross-sectional view through the internal electrode layers15of the multilayer ceramic capacitor1.FIG.3provides a WT cross-section at a position W1passing through the middle portion in the width direction W ofFIG.6. A position W2inFIG.6is a position passing through the end portion of the internal electrode layer15in the width direction W. Since the internal electrode layers15are each thin, a plurality of pores15aare actually extending through the lamination direction T. Therefore, when viewed in the LT cross-section as inFIG.2, not all of the internal electrode layers15are connected to the external electrode3. As shown by position P1inFIG.2, the internal electrode layer15may be separated from the external electrode3. However, although the internal electrode layer15and the external electrode3are not connected to each other at the position P1, the internal electrode layer15and the external electrode3are connected at a position shifted in the width direction W from the position P1. Here, the number of all of the internal electrode layers15extending to one of the external electrodes3in the LT cross-section shown inFIG.2at a certain location in the width direction W inFIG.6is defined as N0, and the number of the internal electrode layers15connected to the one of the external electrodes3among them is defined as N. Then, the connection ratio at the certain location is defined as N/N0. For example, when the number of all of the internal electrode layers15extending to one of the external electrodes3in the LT cross-section shown inFIG.2at the position W1passing through the middle portion in the width direction W inFIG.6is defined as N0, and the number of the internal electrode layers15connected to the one of the external electrodes3among them is N1, the connection ratio at the position W1is defined as N1/N0. Furthermore, similarly to the above, when the number of all of the internal electrode layers15extending to one of the external electrodes3in the LT cross-section shown inFIG.2at the position W2passing through the end portions in the width direction W inFIG.6is defined as N0, and the number of the internal electrode layers15connected to the one of the external electrodes3among them is defined as N2, the connection ratio at the position W2is defined as N2/N0. In common multilayer ceramic capacitors that differ from the present preferred embodiment, for example, the connection ratio N1/N0 in the LT cross-section at the position W1passing through the middle portion in the width direction W, and the connection ratio N2/N0 in the LT cross-section at the position W2passing through the end portions in the width direction W are greater than about 90% when expressed as a percentage. Furthermore, for example, the difference between the connection ratio N1/N0 at the position W1passing through the middle portion in the width direction W, and the connection ratio N2/N0 at the position W2passing through the end portion in the width direction W is smaller than about 10%. When the connection ratio is smaller than about 90%, and the difference in the connection ratio differs greatly by the position, the connectivity between the internal electrode layer15and the external electrode3is deteriorated, the flow of electricity is reduced or prevent or becomes unstable, such that the equivalent series resistance (ESR) of the multilayer ceramic capacitor may increase. However, in the multilayer ceramic capacitor1of the present preferred embodiment, the connection ratio N1/N0 at the position W1passing through the middle portion in the width direction W, and the connection ratio N2/N0 at the position W2passing through the end portion in the width direction W are about 90% or more when expressed as a percentage. Furthermore, the difference between the connection ratio N1/N0 at the position W1passing through the middle portion in the width direction W, and the connection ratio N2/N0 at the position W2passing through the end portion in the width direction W is about 10% or less. Therefore, according to the multilayer ceramic capacitor1of the present preferred embodiment, the contact area between the internal electrode layer15and the external electrode3is sufficiently secured, there is no variation in the connection ratio, a good connection ratio is ensured, electricity flows well, and the equivalent series resistance (ESR) of the multilayer ceramic capacitor can also be reduced. Detection Method The connection ratio between the external electrode3and the internal electrode layer15is detected as follows. Connection Ratio at Position W1 Polishing starts at the LT side surface of the multilayer ceramic capacitor1, and the internal electrode layers15begin to be exposed, such that the resultant LT cross-section polished about 5 μm is exposed. Then, the number of the internal electrode layers15extending to one of the external electrodes3in the LT cross-section and connecting with the one of the external electrodes3is defined as N1. The total number of the internal electrode layers15connected to the external electrode3provided on the same side is defined as N0. With N1 and N0 above, the connection ratio N1/N0 at the position W1is obtained. Connection Ratio at Position W2 Polishing starts at the LT side surface of the multilayer ceramic capacitor1, and continues up to the middle portion of the internal electrode layers15in the width direction, such that the resultant LT cross-section is exposed. Then, the number of the internal electrode layers15extending to one of the external electrodes3in the LW cross-section and connecting with the one of the external electrodes3is defined as N2. The total number of the internal electrode layers15connected to the external electrode3provided on the same side is defined as N0. With N2 and N0 above, the connection ratio N2/N0 at the position W1is obtained. In a case in which the number of the internal electrode layers15is large, it is acceptable to check about 20 pieces of the internal electrode layers15in the region of the outermost layer and about 40 pieces of the internal electrode layers15at the middle portion in the lamination direction T to obtain the number of the internal electrode layers connected to the external electrode3and calculate the average value. In the multilayer ceramic capacitor1of the present preferred embodiment, a result of actual measurement showed that the connection ratios at the position W1and the position W2were about 90% or more. The reason why it is possible to obtain high connection ratios in this way will be described in the manufacturing method described later. Structure of External Electrode3 The external electrode3includes a base electrode layer30and a plated layer31in order from the multilayer body2. As shown inFIGS.2and6, the base electrode layer30is divided into a first region30aof, for example, about 0.1 μm to about 5 μm, a second region30b,and a third region30cof, for example, about 0.1 μm to about 5 μm in order from the multilayer body2. The thickness of the second region30bis not limited to about 0.1 μm to about 5 μm. The thickness of the second region30bcorresponds to the remaining thickness obtained by eliminating the first region30aand the third region30cfrom the external electrode3. The plated layer31includes a Ni plated layer31aand a Sn plated layer31bin order from the base electrode layer30. The external electrode3including these layers covers not only the end surface C, but also covers portions of the main surface A and the side surface B in the vicinity of the end surface C. Furthermore, the first region30a,the second region30b, and the third region30cmay be divided according to the ratio of glass G. For example, in the LT cross-section, when the area ratio of glass to Cu in the entire base electrode layer30(area of glass/area of Cu) is defined as P, the first region30amay be defined as a region of about 0.1 P or less, the second region30bmay be defined as a region of about 1.2 P or more, and the third region30cmay be defined as a region lower than about 1.0 P. It should be noted that a second region may or may not be included. The second region can belong to the first region or the third region when the second region satisfies either one of the defined thickness or P of them. Material of External Electrode3 The first region30a,the second region30b,and the third region30cof the base electrode layer30are formed by firing a Cu paste in which glass G including Ba (barium) for densification is mixed, and thus, are electrodes by post-fire which are separately fired after the firing of the multilayer body2. First Region30a The thickness of the first region30ain the length direction L is, for example, about 0.1 μm or more and about 5 μm or less. As schematically shown inFIG.5, the first region30aincludes Ni, which is a metal included in the internal electrode layers15, in a larger amount than the second region30band the third region30c.When detected by WDX, the intensity ratio of Ni to Cu is preferably about 20% or more, for example. Ni is included in a higher density, in particular, on a side of the first region30ain the vicinity of the inner layer portion11, than in the other regions such as a side of the first region30ain the vicinity of the second region30b,the second region30b,and the third region30c.A Ni-rich layer is provided on the side of the first region30ain the vicinity of the inner layer portion11. Furthermore, the density of Ni near the internal electrode layers15in the side of the first region30ain the vicinity of the inner layer portion11is higher than the density of Ni adjacent to the dielectric layers14in the side of the first region30ain the vicinity of the inner layer portion11. Furthermore, Ni makes a solid solution with Cu in the first region30a,and is alloyed. As described above, the first region30aincludes a Ni component more than the second region30band the third region30c. Therefore, the internal electrode layers15and the base electrode layer30have a better connection ratio. Particle Size of Cu being Large in Side in the Vicinity of Multilayer body2 Furthermore, the particle size of Cu in the first region30ais larger than that in the second region30band the third region30c.In addition, the thickness decreases as approaching the second region30band the third region30c. The particle size of Cu is specified based on the area in the LT cross-section shown inFIG.5. Second Region30b The second region30bcorresponds to a region other than the first region30aand the third region30c.The second region30bis preferably thicker than the total value of the thicknesses of the first region30aand the third region30c,and is, for example, about 10 μm or more and about 40 μm or less. The second region30bincludes more glass G than the first region30aand the third region30c.When the area ratio of glass to Cu (area of glass/area of Cu) in the entire base electrode layer30in the LT cross-section is P, the glass G is, for example, equal to or larger than about 1.2 P. The ratio of the glass G is obtained by measuring the area of Si by WDX, and calculating the area of Si with respect to the total area. Third Region30c The third region30cincludes more Cu than the first region30aand the second region30b.The content of the glass is, for example, less than about 1.0 P in the LT cross-section shown inFIG.5. The third region30cincludes more Cu than the second region30band the third region30c.Therefore, the connection ratio when mounting the multilayer ceramic capacitor1on a board is favorable. Furthermore, it is possible to determine the adhesiveness of the Ni plated layer31aby counting portions where plating is not provided by visually checking100locations on the surface of the plated layer31. The third region30ccontains Cu in the greatest amount. Therefore, the Ni plated layer31aon the outer side is easily adhered thereto. Furthermore, the plated layer31overall is hardly peeled off therefrom. In the present preferred embodiment, there was no portion without plating. In the multilayer ceramic capacitor1of the present preferred embodiment, since the ratio of the glass G in the second region30bis, for example, about 1.2 P or more, the multilayer ceramic capacitor1has a high sealability property and high moisture resistance. Regarding humidity resistance of the multilayer ceramic capacitor1, it was determined that the humidity resistance was low when a voltage of about 6.3V was applied and the resistance was below about 100 MΩ under an environment of temperature about 85° C. and humidity about 85%. The threshold of about 100 MΩ is for the case of a capacitance of about 1 μF. Unlike the present preferred embodiment, among 100 pieces of the multilayer ceramic capacitors1for comparison having the ratio of glass G smaller than about 1.2 P in the second region30b,the resistance was below about 100 MΩ in eleven pieces of the multilayer ceramic capacitors. Among 100 pieces of the multilayer ceramic capacitors1in the present preferred embodiment having the ratio of glass G of equal to or larger than about 1.2 P in the second region30b,there was no multilayer ceramic capacitors in which the resistance is below about 100 MΩ. As described above, the multilayer ceramic capacitor1of the present preferred embodiment has favorable moisture resistance because the ratio of the glasses G in the second regions30b,for example, about 1.2 P or more. Protective Layer33 In the third region30cin the multilayer ceramic capacitor1of the present preferred embodiment, protective layers33including S (sulfur) and Ba (barium) are each provided on a surface of the glass G facing the Ni plated layer31a.The protective layers33cover about 50% or more of the portions containing the glass G on the surface of the third region30c, that is, the surface of the base electrode layer30, and preferably cover about 70% or more thereof. The thicknesses of the protective layers33are, for example, each about 10 nm or more and about 1 μm or less. Confirmation Method of Protective Layer33 The protective layers33can be confirmed by imaging a region including glass G, the third region30c,and the Ni plated layer31ain the region within the region in the external electrode in the LT cross-section in the middle portion in the width direction by TEM (Transmission Electron Microscope)-EDX (Energy Dispersive X-ray Spectroscopy). Thickness of Protective Layer33 The thickness of the protective layer33is obtained by measuring the thicknesses of S and Ba from the glass G toward the interior of the Ni plated layer31abased on the observed S and Ba images. When the surface of the glass G is a curved surface, the thickness in the normal direction is used. If the thickness varies depending on locations, average values of the regions divided into three equal portions in the lamination direction in the LT cross section may be used. Coverage of Protective Layer33 The coverage of the protective layer33can be obtained by dividing the length of the protective layer33by the length of the surface of the base electrode layer30including the surface of the glass G, measured on the LT cross-section. Plated Layer31 The plated layer31includes, for example, the Ni plated layer31aand the Sn plated layer31bin order from the base electrode layer30. Method of Manufacturing Multilayer Ceramic Capacitor1 FIG.7provides a flowchart showing a method of manufacturing the multilayer ceramic capacitor1. The method of manufacturing the multilayer ceramic capacitor1includes a multilayer body preparing step S1of preparing the multilayer body2, a barrel step S2, a base electrode layer forming step S3, and a plated layer forming step S4. Multilayer Body Preparing Step S1 The multilayer body preparing step S1includes a material sheet preparing step S11, a material sheet laminating step S12, a mother block forming step S13, a mother block cutting step S14, a side gap portion forming step S15, and the firing step S16.FIG.8is a diagram for explaining the multilayer body preparing step S1and the barrel step S2. Material Sheet Preparing Step S11 A ceramic slurry including a ceramic powder including, for example, BaTiO3as a main component, a binder, and a solvent is prepared. In the present preferred embodiment, the ceramic slurry does not include Ni, or the Ni content therein is smaller than that in the outer layer portions12. The ceramic slurry is molded into a sheet shape or substantially a sheet shape using, for example, a die coater, a gravure coater, a micro gravure coater, etc. on a carrier film, such that an inner layer ceramic green sheet101is manufactured. Furthermore, an upper outer layer portion ceramic green sheet112defining and functioning as the upper outer layer portion12a,and a lower outer layer portion ceramic green sheet113defining and functioning as the lower outer layer portion12bare also manufactured in the same or substantially the same manner. The upper outer layer portion ceramic green sheet112and the lower outer layer portion ceramic green sheet113are manufactured by a ceramic slurry including, for example, a ceramic powder including BaTiO3as a main component, a binder, and a solvent, similarly to the inner layer ceramic green sheet101. However, unlike the inner layer ceramic green sheet101, the upper outer layer portion ceramic green sheet112and the lower outer layer portion ceramic green sheet113include Ni, or have a higher Ni content than the inner layer ceramic green sheet101. Subsequently, the conductive paste102including Ni glass (Si oxide), and Sn is printed by, for example, screen-printing, ink jet printing, gravure printing, or the like, so as to have a strip-shaped pattern or substantially a strip-shaped pattern, on the inner layer ceramic green sheet101. Thus, the material sheet103is prepared by printing the conductive paste102defining and functioning as the internal electrode layer15on the surface of the inner layer ceramic green sheet101defining and functioning as the dielectric layer14. Material Sheet Laminating Step S12 Next, in the material sheet laminating step S12, a plurality of material sheets103are laminated. Specifically, the plurality of material sheets103are stacked such that the strip-shaped conductive pastes102are directed in the same or substantially the same direction and shifted by half pitch in the width direction between the adjacent material sheets103. Furthermore, the upper outer layer portion ceramic green sheet112defining and functioning as the upper outer layer portion12ais stacked on one side of the plurality of laminated material sheets103, and the lower outer layer portion ceramic green sheet113defining and functioning as the lower outer layer portion12bis stacked on the other side thereof. Mother Block Forming Step S13 Subsequently, in the mother block forming step S13, the upper outer layer portion ceramic green sheet112, the plurality of stacked material sheets103, and the lower outer layer portion ceramic green sheet113are subjected to thermocompression bonding. As a result, the mother block110is formed. Mother Block Cutting Step S14 Then, in the mother block cutting step S14, the mother block110is cut along a cutting line X and a cutting line Y intersecting the cutting line X corresponding to the dimension of the laminate chip10. As a result, the laminate chip10is manufactured. It should be noted that, in the present preferred embodiment, the cutting line Y is perpendicular or substantially perpendicular to the cutting line X. Side Gap Portion Forming Step S15 Next, a ceramic slurry in which Mg is added as a sintering aid to the dielectric powder, which is the same or substantially the same as that of the inner layer ceramic green sheet101, is prepared. Then, the ceramic slurry is applied on a resin film, and dried to manufacture a side gap portion ceramic green sheet. It should be noted that a plurality of side gap portion ceramic green sheets may be manufactured. Then, the side gap portion ceramic green sheet is affixed on the side portion where the internal electrode layers15of the laminate chip10are exposed, such that a layer defining and functioning as the side gap portion20is formed. Thus, the side gap portion20is affixed to the LT side surface of the laminate chip10, such that the multilayer body2in a state before firing is formed. Firing Step S16 The layer defining and functioning as the side gap portion20is formed in the laminate chip10, and the resultant body is subjected to degreasing treatment in a nitrogen atmosphere under a predetermined condition, and then fired and sintered at a predetermined temperature in a nitrogen-hydrogen-steam mixed atmosphere to form the multilayer body2. Since the side gap portion20is affixed to the laminate chip10including the dielectric layers14, there is an interface between the side gap portion20and the laminate chip10even after firing. Here, a Ni—Mg alloy, which is an alloy of Mg included in the side gap portion20and Ni included in the outer layer portion12, is segregated in the boundary region Z2between the side gap portion20and the outer layer portion12. The boundary region Z2tends to become the penetration path of moisture. Therefore, the pores existing in this portion are filled, and the moisture resistance becomes high. Here, as shown inFIG.4, since Ni is included in the outer layer portion12, particles of the dielectric ceramic after firing are densified. Furthermore, since the pores provided in the dielectric ceramic in the outer layer portion12are filled with Ni, moisture resistance of the multilayer ceramic capacitor1is increased. As shown inFIG.5, the Sn-layer16which has migrated from the interior to the surface is formed on the surfaces of the internal electrode layers15. Barrel Step S2 Next, barrel polishing is performed on the multilayer body2. As a result, the ridge portion R1of the multilayer body2is rounded. Since the internal electrode layer15shrinks during the firing step S16, a portion of the internal electrode layers15may not be exposed at the end surface C. However, since the barrel step S2is provided, the end surface C of the multilayer body2is also polished, such that the number of the internal electrode layers15which are not exposed at the end surface C is reduced. Furthermore, the positional deviation d2between the end portion which is in the vicinity of the side surface B and located outermost in the width direction W and the end portion which is located innermost in the width direction W among all of the internal electrode layers15is, for example, about 10 μm or less. That is, the end portions in the width direction W of the laminated internal electrode layers15are located at the same or substantially the same position in the width direction W. In other words, the positions of the end portions are aligned or substantially aligned in the lamination direction T. Base Electrode Layer Forming Step S3 The base electrode layer forming step S3includes a first region forming step S31, a second region forming step S32, a third region forming step S33, and a firing step S34. FIG.9is a diagram showing the base electrode layer forming step S3and a plated layer forming step S4. First Region Formation Step S31 In the first region forming step S31, both end surfaces C of the multilayer body2are immersed in a glass-containing Cu paste to form the first region30a.To form the first region30a, the Cu paste including Cu particles having a small particle size is used. The particle size of the Cu particles is, for example, about 0.05 μm or more and about 3 μm or less. Furthermore, it is preferable that the thickness is, for example, about 0.05 μm or more and about 1 μm or less. Here, the positional deviation d of the internal electrode layers15in the vicinity of the end surface C is smaller in the barrel step. However, there is a possibility that the positional deviation d remains somewhat in the internal electrode layers15in the vicinity of the end surface C. In the present preferred embodiment, since the Cu paste having a small particle size is used, the Cu paste can enter the portion of the positional deviation d remaining in the internal electrode layers15in the vicinity of the end surface C, leading to the favorable contact with the internal electrode layers15. Second Region Forming Step S32 Next, in the second region forming step S32, both end surfaces C of the multilayer body2are immersed in Cu pastes, each having a higher glass content than that of the first region30aand the third region30c,to form the second region30b. The second region30bincludes more glass G than the first region30aand the third region30c.In the LT cross-section, when the area ratio of glass to Cu in the entire base electrode layer30(area of glass/area of Cu) is defined as P, the second region30bmay be defined as a region of, for example, about 1.2 P or more. Since the ratio of the glass G in the second region30bis about 1.2 P or more, the sealing property and the moisture resistance are improved. However, in order to reduce or prevent the deterioration of the conductivity of the second region30b,the ratio of the glasses G in the second region30bis preferably, for example, about 2.5 P or less. It should be noted that the particle size of the Cu particles included in the Cu paste may be the same or substantially the same as the particle size of the Cu particles included in the Cu paste, or may be larger than the particle size of the Cu particles included in the Cu paste. Third Region Forming Step S33 Next, in the third region forming step S33, both end surfaces C of the multilayer body2are immersed in a Cu paste having a higher Cu content than the Cu pastes of the second region30band the third region30c,to form the third region30c.The Cu paste118includes glass G. The glass G includes, for example, BaO—B2O3—SiO2glass or BaO—B2O3—SiO2—LiO—NaO glass including Ba. In addition, sulfur (S) is included in the glass G. Firing Step S34 Then, the resultant body is heated for a predetermined time in a nitrogen atmosphere at a set firing temperature. As a result, the base electrode layer30is burned onto the multilayer body2. At this time, the Sn-layer16formed on the surfaces of the internal electrode layers15extends from the surfaces of the internal electrode layers15to the boundary region Z1between the external electrode3, and the internal electrode layers15and the dielectric layers14adjacent to the internal electrode layers15in the lamination direction T. Furthermore, as schematically shown inFIG.5, Cu in the first region30ais coupled, and the mass of Cu is larger than the second region30band the third region30c,such that the thickness in the lamination direction T is larger than the thickness of the internal electrode layers15. Plated Layer Forming Step S4 The plated layer forming step S4includes a Ni plated layer forming step S41, and a Sn plated layer forming step S42. Ni Plated Layer Forming Step S41 In the Ni plated layer forming step S41, the third region30cof the base electrode layer30is immersed in a plating solution for forming the plated layer31, to form the Ni plated layer31on the outer periphery of the external electrode3. At this time, the third region30cincludes more Cu than the first region30aand the second region30b.The amount of Cu can be measured by calculating the area of Cu detected by WDX. The third region30cincludes more Cu than the second region30band the third region30c.Therefore, the connection ratio when mounting the multilayer ceramic capacitor1on a board is preferable. Here, when the third region30cof the base electrode layer30is immersed in a process liquid in which the plating solution and S (sulfur) are mixed, the mixed process liquid containing the plating solution and S erodes the glass G which is exposed at the surface of the third region30c. However, according to the present preferred embodiment, since the glass G includes S and Ba, the S and Ba begin to gradually form the protective layer33on the surface of the glass G on which the erosion by the plated layer31is progressing. When the formation of the protective layer33progresses, the erosion of the glass G by the plating solution is gradually reduced or prevented, and once the protective layer33is formed to have a predetermined thickness, the glass G is hardly eroded. On the other hand, unlike the present preferred embodiment, if the protective layer33is not formed, the plating solution continues to erode the glass G, and advances to the second region30band the first region30ain the interior of the base electrode layer30. However, according to the present preferred embodiment, at an initial stage in which the third region30cof the base electrode layer30is immersed in the plating solution in this way, the protective layer33is formed by the process liquid including Ba and S included in the glass G. Furthermore, the protective layer33defining and functioning as a barrier of the glass G to the plating solution, and thus, further erosion of the glass G by the plating solution is reduced or prevented. Therefore, it is possible to obtain the multilayer ceramic capacitor1in which the erosion of the base electrode layer30by the plating solution is small, and the heat resistance, the water resistance, and the moisture resistance are high. The third region30cincludes Cu in the most amount. Therefore, the Ni plated layer31aon the outer side is easily adhered thereto. Furthermore, the plated layer31overall is hardly peeled off therefrom. Sn Plated Layer Forming Step S42 Then, the Sn plated layer31bis formed on the outer side of the Ni plated layer31a. Through the above steps, the multilayer ceramic capacitor1of the present preferred embodiment is manufactured. Although preferred embodiments of the present invention have been described above, the present invention is not limited to this preferred embodiment, and various modifications may be made within the scope thereof. For example, in the present preferred embodiment, the base electrode layer30is provided with the three regions. However, the present invention is not limited to this, and the base electrode layer30may include only the first region30aand the third region30cwithout the second region30b.Furthermore, the base electrode layer30may include only one region. In the present preferred embodiment, the base electrode layer30including the three regions is manufactured by three coating steps of the first region forming step S31, the second region forming step S32, and the third region forming step S33. However, the present invention is not limited to this, and the base electrode layer30including a plurality of regions may be manufactured by adjusting the material and the temperature profile, for example. In the present preferred embodiment, the glass G includes Ba. However, the glass G may not include Ba. In this case, the protective layer33does not include Ba. However, the protective layer33includes S by the process liquid including S. In the present preferred embodiment, the Cu paste having a small particle size is used in the barrel step when the first region30aof the base electrode layer30. However, the present invention is not limited thereto. In order to improve the connection ratio, for example, either one of performing the barrel step or using a Cu paste having a small size may be used. In the present preferred embodiment, the multilayer ceramic capacitor1is manufactured by manufacturing the laminate chip10following which the side gap portions20are affixed on both sides of the laminate chip10. However, the present invention is not limited to this, and the side gap portions20may be manufactured together at the time of manufacturing the laminate chip10. In the present preferred embodiment, two plated layers are provided. However, the present invention is not limited thereto, and the plated layer may include a single layer. Furthermore, the size of the multilayer ceramic capacitor1, and the thickness and the number of layers of the internal electrode layers15, the dielectric layers14, the outer layer portions12, and the external electrodes3, which are specified in the present preferred embodiment, are not limited to the numerical values described, and may vary therefrom. Furthermore, the components included in each layer are not limited to those described in the present preferred embodiment. While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims. | 51,928 |
11862403 | DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described as follows with reference to the attached drawings. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention, although different, are not necessarily mutually exclusive. For example, structures, shapes, and sizes described as examples in embodiments in the present disclosure may be implemented in another exemplary embodiment without departing from the spirit and scope of the present disclosure. Further, modifications of positions or arrangements of elements in exemplary embodiments may be made without departing from the spirit and scope of the present disclosure. The following detailed description is, accordingly, not to be taken in a limiting sense, and the scope of the present invention are defined only by appended claims, appropriately interpreted, along with the full range of equivalents to which the claims are entitled. In the drawings, same elements will be indicated by same reference numerals. Also, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily make the gist of the present disclosure obscure will be omitted. In the accompanying drawings, some elements may be exaggerated, omitted or briefly illustrated, and the sizes of the elements do not necessarily reflect the actual sizes of these elements. The terms, “include,” “comprise,” “is configured to,” or the like of the description are used to indicate the presence of features, numbers, steps, operations, elements, portions or combination thereof, and do not exclude the possibilities of combination or addition of one or more features, numbers, steps, operations, elements, portions or combination thereof. In the drawings, the first direction may be defined as a lamination direction or a thickness (T) direction, the second direction may be defined as a width (W) direction, and the third direction may be defined as a length (L) direction. Referring toFIGS.1to4, a multilayer ceramic capacitor100may include a ceramic body110including a dielectric layer111and a plurality of internal electrodes121and122laminated in a first direction with the dielectric layer111interposed therebetween, margin portions112and113disposed on opposite surfaces of the ceramic body110opposing in a second direction perpendicular to the first direction, and external electrodes131and132disposed on opposite surfaces opposing each other in a third direction perpendicular to the first and second directions and connected to the internal electrodes121and122. Also, the ceramic body110may contribute to formation of capacitance of the multilayer ceramic capacitor100and may include a capacitance forming portion Ac formed by alternately laminating the plurality of internal electrodes121and122with the dielectric layer111interposed therebetween, and upper and lower cover portions114and115laminated on the upper and lower surfaces of the capacitance forming portion Ac in the first direction or in the thickness direction, respectively. Generally, the margin portions112and113may be formed by physically compressing the ceramic green sheet for forming the margin portions112and113on the ceramic body110and performing a heat treatment. Also, the margin portions112and113may be formed using a ceramic green sheet having the same dielectric composition as that of the ceramic green sheet forming the dielectric layer111. Accordingly, physical filling density of the dielectric material in the margin portions112and113may be low, such that density of the margin portions112and113may be lowered, and accordingly, moisture resistance reliability of the multilayer ceramic capacitor100may degrade. To address the above issue, in the exemplary embodiment, by preventing a step difference caused by the internal electrodes121and122and improving density of the margin portions112and113, a method of manufacturing a multilayer ceramic capacitor having improved moisture resistance reliability and a multilayer ceramic capacitor may be provided. In the description below, a method of manufacturing a multilayer ceramic capacitor according to an exemplary embodiment will be described in greater detail with reference toFIGS.5A to5E. A method of manufacturing a multilayer ceramic capacitor in an exemplary embodiment may include preparing a ceramic green sheet211in which a plurality of internal electrode patterns221and222are formed with a predetermined distance therebetween, forming a ceramic laminate220by laminating the ceramic green sheets211in a first direction; cutting the ceramic laminate220to have a side surface on which an end of each of the internal electrode patterns221and222is exposed in a second direction perpendicular to the first direction, forming margin portions212and213on the side surfaces on which the ends of the internal electrode patterns221and222are exposed, and forming a ceramic body including a dielectric layer and an internal electrode by firing the cut-out ceramic laminate220, and the forming the margin portions212and213may include flowing ceramic paste22and23from an upper portion to a lower portion of the cut-out ceramic laminate220. As illustrated inFIG.5A, a plurality of first internal electrode patterns221may be formed on the ceramic green sheet211with a predetermined distance therebetween. In this case, the first internal electrode pattern may have a stripe pattern, and the plurality of first internal electrode patterns221may be formed parallel to each other. The ceramic green sheet211may be formed by mixing ceramic powder, a binder, and a solvent and forming a sheet having a thickness of several μm by a doctor blade method. When the ceramic green sheet211is fired, the ceramic green sheet211may become the dielectric layer111included in the ceramic body110. The ceramic powder may not be limited to any particular material as long as sufficient electrostatic capacitance may be obtained. For example, a barium titanate-based powder, a lead composite perovskite-based powder, or a strontium titanate-based powder may be used. The barium titanate-based powder may include BaTiO3ceramic powder, and an example of the ceramic powder may include BaTiO3, (Ba1-xCax) TiO3, Ba (Ti1-yCay) O3, (Ba1-xCax) (Ti1-yZry) O3or Ba (Ti1-yZry) O3in which Ca (calcium) or Zr (zirconium) is partially dissolved in BaTiO3. In this case, an average thickness td of the ceramic green sheet211may be arbitrarily changed in consideration of the size and capacitance of the multilayer ceramic capacitor, and may be 0.6 μm or less for miniaturization and high capacitance of the multilayer ceramic capacitor, but an exemplary embodiment thereof is not limited thereto. The average thickness td of the ceramic green sheet211may be measured from an image obtained by scanning the ceramic green sheet211using a scanning electron microscope (SEM), and the average value may be measured by measuring the thicknesses in a plurality of points of a single ceramic green sheet211. Also, a more generalized average value may be measured by extending the measurement of the average value to a plurality of ceramic green sheets211. Since the thickness td of the ceramic green sheet satisfies 0.6 μm or less, the average thickness of the dielectric layer111after firing may be 0.4 μm or less. The first internal electrode pattern221may be formed using a conductive paste for internal electrodes including a conductive metal. A method of forming the first internal electrode pattern221on the ceramic green sheet211is not limited to any particular example, and may be formed by a screen-printing method or a gravure printing method, for example. Also, the conductive paste for internal electrodes may include a common material powder, a dispersant, and a solvent, but an exemplary embodiment thereof is not limited thereto. The conductive metal may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) or alloys thereof, but an exemplary embodiment thereof is not limited thereto. Also, although not illustrated, the second internal electrode pattern222may be formed on another ceramic green sheet211with a predetermined distance. The ceramic green sheet211on which the first internal electrode pattern221is formed may be referred to as a first ceramic green sheet, and the ceramic green sheet211on which the second internal electrode pattern222is formed may be referred to as a second ceramic green sheet. In the description below, as illustrated inFIG.5B, the first and second ceramic green sheets211may be alternately laminated in the first direction such that the first internal electrode pattern221and the second internal electrode pattern222may be alternately laminated. After firing, the first and second internal electrode patterns221and222may become the first and second internal electrodes121and122of the ceramic body110. In this case, an average thickness te of the internal electrode patterns221and222may be arbitrarily changed in consideration of the size and capacitance of the multilayer ceramic capacitor, and may be 0.5 μm or less for miniaturization and high capacitance of the multilayer ceramic capacitor, but an exemplary embodiment thereof is not limited thereto. The average thickness te of the internal electrode patterns221and222may be measured from an image obtained by scanning the internal electrode patterns221and222using a scanning electron microscope (SEM), and the average value may be measured by measuring thicknesses at a plurality of points of each of the internal electrode patterns221and222. Also, a more generalized average value may be measured by extending the measurement of the average value to the plurality of internal electrode patterns221and222. Since the thickness te of the internal electrode patterns221and222satisfies 0.6 μm or less, the average thickness of the internal electrodes121and122after firing may be 0.4 μm or less. In the description below, referring toFIG.5C, a plurality of the ceramic green sheets211on which the first and second internal electrode patterns221and222are formed may be laminated in the first direction, thereby forming the ceramic laminate220. Thereafter, as illustrated inFIG.5D, the ceramic laminate220may be cut along lines C1-C1and C2-C2orthogonal to each other such that the ends of the internal electrode patterns221and222may have side surfaces exposed in the second direction. More specifically, the ceramic laminate220may be divided into the laminate bodies210having a plurality of laminated bars by cutting along line C1-C1. In this case, ends of the first and second internal electrode patterns221and222may be exposed to the cut-out surfaces of the laminate body210. Thereafter, the ceramic laminate220may be cut along line C2-C2, thereby dividing into the laminate bodies210having a form of a plurality of laminate chips. In the description below, as illustrated inFIG.5E, first and second margin portions212and213may be formed on the side surfaces of the plurality of laminated bodies210from which the ends of the internal electrode patterns221and222are exposed, respectively. In this case, the forming the first and second margin portions212and213may include flowing ceramic paste22and23from an upper portion to a lower portion of the cut-out ceramic laminate220. Generally, the margin portions212and213may be formed by firing a region other than the regions of the ceramic green sheet211in which the internal electrode patterns221and222are formed. However, in the process of laminating, compressing, and cutting the ceramic green sheets211formed in several tens to several hundreds of layers, a step difference may be formed such that the internal electrode patterns221and222may be bent. Also, generally, to address the issue of the step difference, the margin portions212and213may be formed by attaching the ceramic green sheet for forming the margin portion by physical compression and performing a high temperature heat treatment. Accordingly, when adhesive force between the ceramic green sheet for forming the margin portion and the laminate body210is insufficient, exterior defects and cracks may occur and moisture resistance reliability may degrade. In an exemplary embodiment, after cutting the ceramic laminate220to have side surfaces from which the ends of the internal electrode patterns221and222are exposed, ceramic pastes22and23may be allow to flow from an upper portion to a lower portion of the cut-out ceramic laminate220, thereby forming the first and second margin portions212and213. Accordingly, a step difference caused by the internal electrode patterns221and222may be prevented such that a ceramic capacitor having improved reliability may be provided. Also, since the first and second margin portions212and213are formed by flowing the ceramic paste22and23from an upper portion to a lower portion of the cut-out ceramic laminate220, exterior defects and cracks caused by separation of the margin portions212and213may be prevented, and moisture resistance reliability of the multilayer ceramic capacitor may improve. Also, in an exemplary embodiment, the margin portions212and213may be formed using the ceramic pastes22and23having a high filling rate of the ceramic powder. Since the ceramic pastes22and23in a liquid state may have a filling rate and dispersibility of ceramic powder higher than those of the ceramic slurry for forming the ceramic green sheet211, the margin portions212and213including less pores and having high sintering density may be implemented when the margin portions212and213are formed. Accordingly, after firing, the margin portions112and113of the multilayer ceramic capacitor100may have density higher than that of the dielectric layer111. After firing, the average thickness of the margin portions112and113may be arbitrarily changed in consideration of the size and capacitance of the multilayer ceramic capacitor100, and may be 2 μm to 15 μm. The average thickness of the margin portions112and113may be measured from images obtained by scanning cross-sectional surface of the multilayer ceramic capacitor100taken in the first and second directions using a scanning electron microscope (SEM), and the thicknesses of the margin portions112and113may be measured and an average value thereof may be measured. In an exemplary embodiment, the ceramic pastes22and23may have viscosity higher than that of the ceramic slurry forming the ceramic green sheet211. The high viscosity of the ceramic pastes22and23may indicate that the ceramic pastes22and23may have a filling rate of ceramic powder higher than that of the ceramic slurry. Since the ceramic pastes22and23may have viscosity higher than that of the ceramic slurry forming the ceramic green sheet211, the ceramic pastes22and23may be prevented from being drawn to the lower region of the side surface of the laminate body210due to gravity. Accordingly, the ceramic pastes22and23may be uniformly applied to the upper and lower regions of the side surface of the laminate body210, and the margin portions212and213having sintering density may be formed through the ceramic pastes22and23having an excellent filling rate and excellent dispersibility of the ceramic powder. Generally, viscosity of ceramic slurry may be in the range of 1,000 to 3,000 CPS (10 rpm), but viscosity of the ceramic pastes22and23in an exemplary embodiment may be 20,000 to 40,000 CPS (10 rpm). When viscosity of the ceramic pastes22and23is within the above range, it may be difficult to apply the ceramic pastes22and23to the side surface of the laminate body210by a general manufacturing method due to high viscosity. Accordingly, the ceramic pastes22and23may be applied to the side surface of the laminate body210by including the process of flowing from an upper portion to a lower portion of the ceramic laminate body220. Accordingly, the multilayer ceramic capacitor100having high density of the margin portions112and113after firing may be implemented. In an exemplary embodiment, the forming the margin portions212and213may further include suctioning the ceramic paste22and23from the lower portion of the cut-out ceramic laminate220. More specifically, a suction device300may be disposed between the plurality of laminate bodies210formed by cutting the ceramic laminate body220and may suction the ceramic pastes22and23. When the ceramic pastes22and23have high viscosity due to a high filling rate of the ceramic powder, the ceramic pastes may not flow from the upper portion to the lower portion of the side surface of the laminate body210simply by gravity. In this case, the method may further include suctioning the ceramic pastes22and23with the suction device300to apply the ceramic pastes22and23to the side surfaces of the laminate body210in a uniform thickness. In this case, referring toFIG.6A, the forming the margin portions212and213may include preparing the laminate body210in the state of a plurality of laminated bars formed by cutting the ceramic laminate body220, and applying the ceramic pastes22and23to the laminate body210in the state of a plurality of laminated bars by flowing the ceramic pastes22and23from the upper portion to the lower portion of the side surface of the laminate body210. The laminate body210in the state of a plurality of laminated bars may be formed by cutting the ceramic laminate body220along line C1-C1. Also, referring toFIG.6B, the forming the margin portions212and213may include preparing the laminate body210in the state of a plurality of laminated chips formed by cutting the ceramic laminate body220, and applying the ceramic pastes22and23to the laminate body210in the state of a plurality of laminated chips by flowing the ceramic pastes22and23from the upper portion to the lower portion of the side surface of the laminate body210. The laminate body210in the state of a plurality of laminated chips may be formed by cutting the ceramic laminate body220along lines C1-C1and C2-C2. Thereafter, by sintering the plurality of cut-out laminate bodies210, the ceramic body110including the dielectric layer111and the internal electrodes121and122may be formed. Also, in the ceramic body110, the first and second external electrodes131and132may be formed on the fifth and sixth surfaces5and6of the ceramic body110to which the first and second internal electrodes121and122are alternately exposed. The first and second external electrodes131and132may be formed by dipping the ceramic body110in a conductive paste for external electrodes and firing the ceramic body110, but an exemplary embodiment thereof is not limited thereto. The external electrodes131and132may be formed by a method of attaching or transferring a sheet or an electroless plating method or a sputtering method. Hereinafter, a multilayer ceramic capacitor according to another exemplary embodiment will be described in greater detail. According to another exemplary embodiment, the multilayer ceramic capacitor including a ceramic body110including a dielectric layer111and a plurality of internal electrodes121and122laminated in the first direction with the dielectric layer interposed therebetween, and margin portions112and113disposed on opposite surfaces of the ceramic body110opposing in the second direction perpendicular to the first direction, and external electrodes131and132disposed on opposite surfaces opposing in the third direction perpendicular to the first and second directions and connected to the internal electrodes121and122may be provided, where the margin portions112and113may have density higher than that of the dielectric layer111. The shape of the ceramic body110may not be limited to any particular shape, but as illustrated, the ceramic body110may have a hexahedral shape or a shape similar to a hexahedral shape. Due to reduction of ceramic powder included in the ceramic body110or grinding of corners thereof during a firing process, the ceramic body110may not have an exact hexahedral shape formed by linear lines but may have a substantially hexahedral shape. The ceramic body110may have first and second surfaces1and2opposing each other in the first direction, third and fourth surfaces3and4connected to the first and second surfaces1and2and opposing in the second direction, and fifth and sixth surfaces5and6connected to the first and second surfaces1and2and the third and fourth surfaces3and4and opposing each other in the third direction. The plurality of dielectric layers111forming the ceramic body110may be in a fired state, and a boundary between the adjacent dielectric layers111may be integrated with each other such that the boundary may not be distinct without using a scanning electron microscope (SEM). The internal electrodes121and122may be alternately disposed with the dielectric layer111, and the first internal electrode121and the second internal electrode122may oppose face each other with the dielectric layer111interposed therebetween. That is, the first and second internal electrodes121and122may be configured as a pair of electrodes having different polarities, and may be formed to be alternately exposed through the fifth and sixth surfaces5and6of the ceramic body110along the lamination direction of the dielectric layer111with the dielectric layer111interposed therebetween by printing a conductive paste for internal electrodes including a conductive metal in a predetermined thickness. The external electrodes131and132may be formed externally of the ceramic body110and may be connected to the internal electrodes121and122, and specifically, may include the first and second external electrodes131and132disposed on the fifth and sixth surface5and6of the ceramic body110opposing each other in the third direction, respectively. Accordingly, the first external electrode131may be connected to the plurality of first internal electrodes121exposed through the fifth surface5of the ceramic body110, and the second external electrode132may be connected to the plurality of second internal electrodes122exposed through the sixth surface6of the ceramic body110. In this case, the external electrodes131and132may be configured as fired electrodes including a conductive metal and glass, and as the conductive metal, one of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni) and copper (Cu) or an alloy thereof may be used, but an exemplary embodiment thereof is not limited thereto. The external electrodes131and132may include a plurality of layers, and a plating layer may be disposed on the external electrodes131and132. The plating layer may improve mounting properties of the multilayer ceramic capacitor100. The plating layer may include at least one of Ni, Sn, Cu, Pd, and alloys thereof, and may include a plurality of layers. In particular, the plating layer may include a nickel (Ni) plating layer and a tin (Sn) plating layer laminated in order on the external electrodes131and132. The margin portions112and113may include the first margin portion112and the second margin portion113disposed on the third and fourth surfaces3and4of ceramic body110opposing each other in the second direction, respectively, and may prevent damages to the internal electrodes121and122due to physical or chemical stress together with the upper and lower cover portions114and115. In this case, the margin portions112and113may have density higher than that of the dielectric layer111. Also, the margin portions112and113may have density higher than that of the upper and lower cover portions114and115. As an example of a method of measuring a density of a target area, a cross-sectional surface of the ceramic body110taken in the first direction and the second direction may be imaged using a scanning electron microscope (SEM), and from the SEM images, the density may be be measured by measuring a ratio of a dielectric area excluding a pore area to a total area of the target area in the margin portions112and113or in the dielectric layer111or the upper and lower cover portions114and115, using a computer program such as SigmaScan Pro, but an exemplary embodiment thereof is not limited thereto. The margin portions112and113may be formed by firing a ceramic paste having a high filling rate of ceramic powder, and the dielectric layer111may be formed by firing a ceramic green sheet having a lower filling ratio of ceramic powder than that of the ceramic paste. Accordingly, the portions112and113may have sintered density higher than that of the dielectric layer111. In this case, a density at the interfacial surface between the margin portions112and113and the ceramic body110may be 98% or more. Accordingly, permeation of external moisture from a boundary between the margin portions112and113and the ceramic body110may be prevented such that the multilayer ceramic capacitor100having improved moisture resistance reliability may be provided. As an example of a method of measuring a density at the interfacial surface, density may be measured from the area obtained by multiplying a length in the first direction by a length in the second direction (e.g., 10 μm×10 μm) with reference to the interfacial surface on the cross-sectional surface of the ceramic body110in the first direction and the second direction, where the interfacial surface is a surface at which the margin portions112and113are in contact with the ceramic body110, but an exemplary embodiment thereof is not limited thereto. Also, as described above, density at the interfacial surface between the margin portions112and113and the ceramic body110may obtained by imaging the cross-sectional surface of the ceramic body110taken in the first direction and the second direction using a scanning electron microscope (SEM), and measuring the SEM image using a computer program such as SigmaScan Pro. In this case, when the average value is obtained by measuring density in the plurality of cross-sectional surface taken in the first direction and the second direction, density at the interfacial surface between the margin portions112and113and the ceramic body110may be further generalized. The multilayer ceramic capacitor100in another exemplary embodiment may have the same configuration as that of the above-described multilayer ceramic capacitor100according to the exemplary embodiment. Therefore, overlapping descriptions will not be provided. Embodiment The ceramic laminate220was formed by laminating the ceramic green sheets211on which the internal electrode patterns221and222were formed, the ceramic laminate was cut to form a plurality of laminated bodies210, and margin portions212and213were formed on the side surfaces of the laminate body210. Thereafter, the laminate body210was calcined at 400° C. or less in a nitrogen atmosphere, was fired under conditions of temperature of 1250° C. or less, and a hydrogen concentration of 1% H2, thereby preparing a ceramic body110including the dielectric layer111and the internal electrodes121and122. In this case, moisture resistance reliability and density of the exemplary embodiment manufactured according to exemplary embodiments of the present disclosure, in which the ceramic pastes22and23were allowed to flow from the upper portion to the lower portion of the cut-out ceramic laminate220, were compared with moisture resistance reliability and density of the comparative example, in which the margin portion was formed by attaching the ceramic green sheet as in the general method. In this case, moisture resistance reliability was tested in 1 to 2Vr, 8585 conditions (85° C. and relative humidity 85%). 7A is a graph of testing moisture resistance reliability of the comparative example, andFIG.7Bis a graph testing moisture resistance reliability of the exemplary embodiment. According toFIGS.7A and7B, it is indicated that, in the comparative example, there was a problem in moisture resistance reliability, and in the exemplary embodiment, moisture resistance reliability was excellent. FIG.8Ais an image of a portion of the interfacial surface between the margin portions112and113and the ceramic body110on the cross-sectional surface of the ceramic body110of the comparative example in the first and second directions, obtained using a scanning electron microscope (SEM).FIG.8Bis an image of a portion of the interfacial surface between the margin portions112and113and the ceramic body110on the cross-sectional surface of the ceramic body110of the exemplary embodiment in the first and second directions, obtained using an SEM. Thereafter, from the SEM image, by measuring the ratio of the dielectric area in an area of a predetermined size excluding pores on the interfacial surface between the margins112and113and the ceramic body110to the total measured area using the SigmaScan Pro program, the density at the interfacial surface between the margin portions112and113and the ceramic body110was measured. For example, the density may be measured in three samples (the number of sample is not limited thereto) in the exemplary embodiment and the comparative example, and was measured in the area having a length in the first direction and a length in the second direction (e.g., 10 μm×10 μm) with reference to the interfacial surface on which the margin portions112and113are in contact with the ceramic body110. In the comparative example, the average value of density at the interfacial surface between the margin portions112and113and the ceramic body110was 97.4%, and in the exemplary embodiment, the average value of density at the interfacial surface between the margin portions112and113and the ceramic body110was 98.92%. Accordingly, in the exemplary embodiment, it is confirmed that density at the interfacial surface between the margin portions112and113and the ceramic body110was improved. According to the aforementioned exemplary embodiments, moisture resistance reliability may be secured by improving sintering density of the margin portion of the multilayer ceramic capacitor. Also, high reliability of the multilayer ceramic capacitor may be secured by preventing cracks caused by a step difference and pores. While the exemplary embodiments have been illustrated and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present invention as defined by the appended claims. | 30,511 |
11862404 | DETAILED DESCRIPTION Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present disclosure may be modified to have various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Further, embodiments of the present disclosure may be provided for a more complete description of the present disclosure to the ordinarily skilled artisan. Therefore, shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings may be the same elements. In the drawings, portions not related to the description will be omitted for clarification of the present disclosure, and a thickness may be enlarged to clearly show layers and regions. The same reference numerals will be used to designate the same components in the same reference numerals. Further, throughout the specification, when an element is referred to as “comprising” or “including” an element, it means that the element may further include other elements as well, without departing from the other elements, unless specifically stated otherwise. In the drawing, an X direction may be defined as a second direction, an L direction, or a longitudinal direction, a Y direction may be defined as a third direction, a W direction, or a width direction, and a Z direction may be defined as a first direction, a stacking direction, a T direction, or a thickness direction. Multilayer Electronic Component FIG.1is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment. FIG.2is a cross-sectional view taken along line I-I′ inFIG.1. FIG.3is a schematic exploded perspective view of a body, in which dielectric layers and internal electrodes are stacked, according to an exemplary embodiment. FIG.4is an enlarged view of region P inFIG.2. Hereinafter, a multilayer electronic component100according to an exemplary embodiment will be described with reference toFIGS.1to4. A multilayer electronic component100according to an exemplary embodiment may include a body110including dielectric layers111, and first and second internal electrodes121and122alternately stacked with respective dielectric layers interposed therebetween, and having first and second surfaces1and2opposing each other in a stacking direction, third and fourth surfaces3and4connected to the first and second surfaces1and2and opposing each other, and fifth and sixth surfaces5and6connected to the first to fourth surfaces1,2,3, and4and opposing each other. The multilayer electronic component100may further include a first external electrode131including a first electrode layer131aconnected to the first internal electrode121and a first conductive resin layer131bdisposed on the first electrode layer131a, and having a first connection portion A1disposed on the third surface3of the body110and a first band portion B1extending from the first connection portion A1to a portion of each of the first, second, fifth, and sixth surfaces1,2,5, and6. The multilayer electronic component100may further include a second external electrode132including a second electrode layer132aconnected to the second internal electrode122and a second conductive resin layer132bdisposed on the second electrode layer132a, and having a second connection portion A2disposed on the fourth surface4of the body110and a second band portion B2extending from the second connection portion A2to a portion of each of the first, second, fifth, and sixth surfaces1,2,5, and6. The multilayer electronic component100may still further include a silicon (Si) organic compound layer140having a body cover portion143disposed on a region of external surfaces of the body110between the first and second electrode layers131aand132a, a first extending portion141disposed to extend from the body cover portion143between the first electrode layer131aand the first conductive resin layer131bof the first band portion B1, and a second extending portion142disposed to extend from the body cover portion143between the second electrode layer132aand the second conductive resin layer132bof the second band portion B2. In the body110, the dielectric layers111and the internal electrodes121and122are alternately stacked. The body110is not limited in shape, but may have a hexahedral shape or a shape similar thereto. Due to shrinkage of ceramic powder particles included in the body110during sintering, the body110may have a substantially hexahedral shape rather than a hexahedral shape having complete straight lines. The body110may have the first and second surfaces1and2opposing each other in a thickness direction (a Z direction), the third and fourth surfaces3and4connected to the first and second surfaces1and2and opposing each other in a width direction (a Y direction), and the fifth and sixth surfaces5and6connected to the first and second surfaces1and2and as well as to the third and fourth surfaces3and4and opposing each other in a length direction (an X direction). The plurality of dielectric layers111, constituting the body110, is in a sintered state and may be integrated with each other such that boundaries therebetween may not be readily apparent without using a scanning electron microscope (SEM). According to an exemplary embodiment, a raw material forming the dielectric layer111is not limited as long as sufficient capacitance may be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like, may be used. Various ceramic additives, organic solvents, plasticizers, binders, dispersants, or the like may be added to the powder of barium titanate (BaTiO3), and the like, according to the purpose of the present disclosure, as the material for forming the dielectric layer111. The body110may have a capacitance forming portion disposed in the body110and including the first and second internal electrodes121and122, disposed to oppose each other with the dielectric layer111interposed therebetween, to form capacitance, and upper and lower protective layers112and113disposed above and below the capacitance forming portion. The capacitance forming portion may contribute to capacitance formation of a capacitor, and may be formed by repeatedly laminating the plurality of first and second internal electrodes121and122with the dielectric layer111interposed therebetween. The upper protective layer112and the lower protective layer113may be formed by laminating a single dielectric layer or two or more dielectric layers on upper and lower surfaces of the capacitance forming portion, respectively, in the vertical direction, and may basically play a role in preventing damage to the internal electrodes due to physical or chemical stress. The upper protective layer112and the lower protective layer113may not include an internal electrode, and may include the same material as the dielectric layer111. The plurality of internal electrodes121and122may be disposed to oppose each other with the dielectric layer111interposed therebetween. The internal electrodes121and122may include first and second internal electrodes121and122alternately disposed to oppose each other with respective dielectric layers interposed therebetween. The first and second internal electrodes121and122may be exposed to the third and fourth surfaces3and4, respectively. Referring toFIG.2, the first internal electrode121may be spaced apart from the fourth surface4and may be exposed through the third surface3, and the second internal electrode122may be spaced apart from the third surface3and may be exposed through the fourth surface4. The first external electrode131may be disposed on the third surface3of the body110to be connected to the first internal electrode121, and the second external electrode132may be disposed on the fourth surface4of the body110to be connected to the second internal electrode122. For example, the first internal electrode121is not connected to the second external electrode132and is connected to the first external electrode131, and the second internal electrode122is not connected to the first external electrode131and is connected to the second external electrode132. Thus, the first internal electrode121is formed to be spaced apart from the fourth surface4by a predetermined distance, and the second internal electrode122is formed to be spaced apart from the third surface3by a predetermined distance. The first and second internal electrodes121and122may be electrically isolated from each other by the dielectric layer111disposed therebetween. Referring toFIG.3, the body110may be formed by alternately laminating the dielectric layer111, on which the first internal electrode121is printed, and the dielectric layer111, on which the second internal electrode122is printed, in a thickness direction (a Z direction) and sintering the dielectric layers111. The material forming the first and second internal electrodes121and122is not limited. For example, the first and second internal electrodes121and122may be formed using a conductive paste containing a noble metal material such as palladium (Pd), a palladium-silver (Pd—Ag) alloy, or the like, nickel (Ni), and copper (Cu). A method of printing the conductive paste may be a screen-printing method, a gravure printing method, or the like, but is not limited thereto. The external electrodes131and132are disposed on the body110and include electrode layers131aand132aand conductive resin layers131band132b. The external electrodes131and132may include first and second external electrodes131and132, respectively connected to the first and second internal electrodes121and122. The first external electrode131includes a first electrode layer131aand a first conductive resin layer131b, and the second external electrode132includes a second electrode layer132aand a second conductive resin layer132b. When the first external electrode131is divided depending on a position in which it is disposed, the first external electrode131has a first connection portion A1, disposed on the third surface3of the body, and a band portion B1extending from the first connection portion A1to a portion of the first, second, fifth, and sixth surfaces1,2,5, and6. When the second external electrode132is divided depending on a position in which it is disposed, the second external electrode132has a second connection portion A2, disposed on the fourth surface4of the body, and a band portion B2extending from the second connection portion A2to a portion of the first, second, fifth, and sixth surfaces1,2,5, and6. The first and second electrode layers131aand132amay be formed using any material as long as it is a material having electrical conductivity such as a metal or the like, and a specific material may be determined in consideration of electrical characteristics, structural stability, and the like. For example, the first and second electrode layers131aand132amay include a conductive metal and glass. A conductive metal, used for the electrode layers131aand132a, is not limited as long as it may be electrically connected to the internal electrodes121and122to form capacitance and may include at least one selected from the group consisting of, for example, copper (Cu), silver (Ag), nickel (Ni), and alloys thereof. The electrode layers131aand132amay be formed by applying a conductive paste, prepared by adding a glass frit, to the conductive metal powder particles and sintering the conductive paste. When the first and second electrode layers131aand132ainclude a conductive metal and glass, corner portions, at which the connection portions A1and A2and the band portions B1and B2meet, may be formed to be thin, or lifting may occur between ends of the band portions B1and B2and the body110. Therefore, since humidity resistance reliability may be problematic, an effect of improving the humidity reliability may be more effective when the first and second electrode layers131aand132ainclude a conductive metal and glass. The first and second electrode layers131aand132amay be formed by means of atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD) sputtering, or the like. In addition, the electrode layers131aand132amay include a conductive metal and glass. The conductive resin layers131band132bmay include a conductive metal and a base resin. The conductive metal, included in the conductive resin layers131band132b, serves to electrically connect the conductive resin layers131band132bto the electrode layers131aand132a. The conductive metal, included in the conductive resin layers131band132b, is not limited as long as it may be electrically connected to the electrode layers131aand132aand may include at least one selected from the group consisting of, for example, copper (Cu), silver (Ag), nickel (Ni), and alloys thereof. The conductive metal, included in the conductive resin layers131band132b, may include at least one of spherical powder particles and flake powder particles. For example, the conductive metal may include only flake powder particles, or spherical powder particles, or a mixture of flake powder particles and spherical powder particles. The spherical powder particles may have an incompletely spherical shape and may have, for example, a shape in which a ratio of a length of a major axis to a length of a minor axis (the major axis/the minor axis) is 1.45 or less. The flake powder particles refer to powder particles, each having a flat and elongated shape, and is not limited to a specific shape and, for example, a ratio of a length of a major axis and a length of a minor axis (the major axis/the minor axis) may be 1.95 or more. The lengths of the major axes and the minor axes of the spherical powder particles and the flake powder particles may be measured from an image obtained by scanning a cross section (an L-T cross section), taken from a central portion of a multilayer electronic component in a width (Y) direction, in X and Z directions with a scanning electron microscope (SEM). The base resin, included in the conductive resin layers131band132b, serves to secure adhesion and to absorb impact. The base resin, included in the conductive resin layers131band132b, is not limited as long as it has adhesion and impact absorption and is mixed with conductive metal powder particles to prepare a paste and may include, for example, an epoxy-based resin. The first external electrode131may further include first plating layers131cand131ddisposed on the first conductive resin layers131b, and the second external electrode132may further include second plating layers132cand132ddisposed on the second conductive resin layer132b. The first and second plating layers131c,131d,132c, and132dserve to improve mounting characteristics. The first and second plating layers131c,131d,132c, and132dmay be Ni plating layers or Sn plating layers, or may include Ni plating layers131cand132cand Sn plating layers131dand132d, respectively and sequentially formed on the first and second conductive layers131band132b. Alternatively, the first and second plating layers131c,131d,132c, and132dmay include a plurality of Ni plating layers and/or a plurality of Sn plating layers. A silicon (Si) organic compound layer140has a body cover portion143disposed in a region, in which the first and second electrode layers131aand132aare not disposed, of external surfaces of the body110, a first extending portion141disposed to extend from the body cover portion143between the first electrode layer131aand the first conductive resin layer131bof the first band portion B1, and a second extending portion142disposed to extend from the body cover portion143between the second electrode layer132aand the second conductive resin layer132bof the second band portion B2. The Si organic compound layer140serves to prevent stress, generated when a substrate is deformed by thermal and physical impacts while the multilayer electronic component100is mounted on the substrate, from propagating to the body110and to prevent cracking. In addition, the Si organic compound layer140serves to improve humidity resistance by blocking a humidity permeation path. The base resin, included in the conductive resin layers131band132b, also plays a role in absorbing impacts, but the role of the base resin is limited because the first conductive resin layer131band the second conductive resin layer132bmust be disposed to be insulated. Meanwhile, since the body cover portion143does not include a conductive metal and is disposed in the region, in which the first and second electrode layers131aand132aare not disposed, of the external surface of the body110, the body cover portion143is disposed in a wider region to be more effective in absorbing impact and suppressing stress propagation. In addition, the body cover part143may prevent humidity from permeating into the body110through the external surface of the body100by sealing fine pores or cracking of the body110. The first extending portion141is disposed to extend from the body cover portion143between the first electrode layer131aand the first conductive resin layer131bof the first band part B1, serving to suppress stress propagation to the body110and to prevent cracking. In addition, the first extending portion141serves to suppress lifting between an end of the first electrode layer131a, disposed on the first band portion B1, and the body110to improve humidity resistance reliability. The second extending portion142is disposed to extend from the body cover portion143between the second electrode layer132aand the second conductive resin layer132bof the second band portion B2, serving to suppress stress propagation to the body110and to prevent cracking. In addition, the second extension portion142serves to improve humidity resistance reliability by suppressing lifting between an end of the second electrode layer132a, disposed in the second band portion B2, and the body110. The Si organic compound layer140may be formed by forming the first and second electrode layers131aand132ain the body110including dielectric layers and internal electrodes, forming a silicon (Si) organic compound layer140on an exposed external surface of the body110and the connection portions A1and A2of the first and second electrode layers131aand132a, and removing the Si organic compound layer140formed on the connection portions A1and A2of the first and second electrode layers131aand132a. A method of removing the organic compound layer140may be, for example, laser processing, mechanical polishing, dry etching, wet etching, shadowing deposition using a tape protective layer, or the like. The Si organic compound layer140may include alkoxy silane. Accordingly, the Si organic compound layer140has a polymeric form including a plurality of silicon carbide bonding structures, and has hydrophobicity. The alkoxy silane prevents humidity permeation and contamination, and permeates into various inorganic substrates and is then cured to protect products and to increase durability. In addition, the alkoxy silane may react with a hydroxyl group (OH), and thus, may form a strong chemical bond to improve durability. As compared with an epoxy resin or an inorganic compound, the epoxy resin is difficult to effectively suppress humidity permeation because it has no water repellent effect, a large amount of CO2gas may be generated during curing to cause lifting, and the inorganic compound has no functional group capable of reacting with a hydroxyl group when applied to a surface of the body110, and thus, it is difficult to adhere to the surface of the body110and a chemical bond is not formed. Accordingly, it may be difficult to apply the epoxy resin or the inorganic compound to the present disclosure. Therefore, as the Si organic compound layer140may include alkoxy silane, an effect of sealing fine pores or cracking may be further improved and bending stress and humidity resistance reliability may be further improved. When a thickness of the first conductive resin layer131bon the first electrode layer131aof the first band portion B1is defined as Ta and a thickness of the first extending portion141is defined as Tb, Tb/Ta may be 0.5 or more to 0.9 or less. FIG.4is an enlarged view of region P inFIG.2. Referring toFIG.4, thicknesses of the first conductive resin layer131band the first extending portion141on the first electrode layer131aof the first band portion B1will be described in detail. However, the above detailed description may be identically applied to thicknesses of the second conductive resin layer132band the second extending portion142on the second electrode layer132aof the second band portion B2. After preparing sample chips while changing the ratio of the thickness Tb of the first extending portion141to the thickness Ta of the first conductive resin layer131bon the first electrode layer131aof the first band portion B1(Tb/Ta), bending strength and equivalent series resistance (ESR) were evaluated, and the results are shown in Tables 1 and 2, respectively. The bending strength was measured using a bending strength measuring method through a piezoelectric effect. After mounting samples of a multilayer ceramic capacitor on a substrate, a distance from a central portion pressed during bending was set to be 6 mm to observe whether cracking occurs in the sample chips. The number of sample chips, in which cracking occurred, to the total number of sample chips is shown. According to the ESR evaluation, a sample chip was maintained at a temperature of −55° C. for 30 minutes and increased to a temperature of 125° C. and was then maintained for 30 minutes, which was one cycle. After 500 cycles were applied, a sample having ESR greater than 50 mΩ was determined to be defective. The number of sample chips having defective ESR to the total number of sample chips was shown. TABLE 1Bending Strength EvaluationNo.Tb/TaA LotB LotC LotD LotE LotSum10.31/600/600/602/600/603/30020.50/600/600/600/600/600/30030.70/600/600/600/600/600/30040.90/600/600/600/600/600/30051.10/600/600/600/600/600/30061.30/600/600/600/600/600/300 Referring to Table 1, in Test No. 1 in which Tb/Ta was 0.3, cracking occurred in three sample chips among a total of 300 sample chips. On the other hand, in Test Nos. 2 to 6 in which Tb/Ta was 0.5 or more, there was no sample chip in which cracking occurred. Accordingly, bending strength was excellent. TABLE 2ESR EvaluationNo.Tb/TaA LotB LotC LotD LotE LotSum10.30/3200/3200/3200/3200/3200/160020.50/3200/3200/3200/3200/3200/160030.70/3200/3200/3200/3200/3200/160040.90/3200/3200/3200/3200/3200/160051.15/3200/3203/3200/3203/32011/160061.30/3207/3202/3200/3200/3209/1600 Referring to Table 2, in Test No. 5 in which Tb/Ta was 1.1, an ESR defect occurred in eleven sample chips among a total of 1600 sample chips. In Test No. 6 in which Tb/Ta was 1.3, an ESR defect occurred in nine sample chips among a total of 1600 sample chips. On the other hand, In Test Nos. 1 to 4 in which Tb/Ta was 0.9 or less, there was no sample chip in which an ESR defect occurred. Accordingly, ESR characteristics were excellent. Therefore, to secure excellent ESR characteristics while improving bending strength, the ratio of the thickness Tb of the first extending portion141to the thickness Ta of the first conductive resin layer131bon the first electrode layer131aof the first band portion B1(Tb/Ta) may be, in detail, 0.5 or more to 0.9 or less. FIG.5is a schematic perspective view of a multilayer electronic component according to another exemplary embodiment. FIG.6is a cross-sectional view taken along line II-II′ inFIG.5. FIG.7is a schematic perspective view illustrating a modified example of a multilayer electronic component according to another exemplary embodiment. FIG.8is a cross-sectional view taken along line III-III′ inFIG.7. Hereinafter, a multilayer electronic component100′ according to another exemplary embodiment 100′ and a modified example 100″ thereof will be described with reference toFIGS.5to8. However, descriptions common to the multilayer electronic component100according to the embodiment will be omitted to avoid duplicate descriptions. A multilayer electronic component100′ according to an exemplary embodiment may include a body110including dielectric layers111, and first and second internal electrodes121and122alternately stacked with respective dielectric layers interposed therebetween, and having first and second surfaces1and2opposing each other in a stacking direction, third and fourth surfaces3and4connected to the first and second surfaces1and2and opposing each other, and fifth and sixth surfaces5and6connected to the first to fourth surfaces1,2,3, and4and opposing each other. The multilayer electronic component100′ may further include a first external electrode131including a first electrode layer131aconnected to the first internal electrode121and a first conductive resin layer131bdisposed on the first electrode layer131a, and having a first connection portion C1disposed on the third surface3of the body110and a first band portion B1extending from the first connection portion C1to a portion of each of the first, second, fifth, and sixth surfaces1,2,5, and6. The multilayer electronic component100′ may further include a second external electrode132including a second electrode layer132aconnected to the second internal electrode122and a second conductive resin layer132bdisposed on the second electrode layer132a, and having a second connection portion C2disposed on the fourth surface4of the body110and a second band portion B2extending from the second connection portion C2to a portion of each of the first, second, fifth, and sixth surfaces1,2,5, and6. The multilayer electronic component100′ may still further include a silicon (Si) organic compound layer140′ having a body cover portion143disposed in a region, in which the first and second electrode layers131aand132aare not disposed, of external surfaces of the body110, a first extending portion141′ disposed to extend from the body cover portion143between the first electrode layer131aand the first conductive resin layer132b, and a second extending portion142′ disposed to extend from the body cover portion143between the second electrode layer132aand the second conductive resin layer132b. The first and second extending portions141′ and142′ have first and second openings H1and H2, respectively. The first conductive resin layer131bmay be in contact with the first electrode layer131athrough the first opening H1, and the second conductive resin layer132bmay be in contact with the second electrode layer132athrough the second opening H2. For example, the first opening H1may be filled with the first conductive resin layer131b, and the second opening H2may be filled with the second conductive resin layer132b. The Si organic compound layer140′ may be formed by forming the first and second electrode layers131aand132ain the body110including dielectric layers and internal electrodes, forming a silicon (Si) organic compound layer on an exposed external surface of the body110and the first and second electrode layers131aand132a, and removing a portion of the Si organic compound layer formed on the first and second electrode layers131aand132ato form the first and second openings H1and H2. A method of removing a region, in which the openings H1and H2to be formed, may be, for example, laser processing, mechanical polishing, dry etching, wet etching, shadowing deposition using a tape protective layer, or the like. In this case, an area of the first opening H1may be 20 to 90% of an area of the first extending portion141′, an area of the second opening H2may be 20 to 90% of an area of the second extending portion142′. When the area of the first opening H1is less than 20% of the area of the first extending portion141′, electrical connectivity between the first electrode layer131aand the first conductive resin layer131bis deteriorated to increase ESR. On the other hand, when the area of the first opening H1is greater than 90% of the area of the first extension portion141′, an effect of improving bending strength and humidity resistance reliability of the Si organic compound layer140′ may be insufficient. When the area of the second opening H2is less than 20% of the area of the second extending portion142′, electrical connectivity between the second electrode layer132aand the second conductive resin layer132bmay be deteriorated to increase ESR. On the other hand, when the area of the second opening H2is greater than 90% of the area of the second extending portion142′, an effect of improving the bending strength and the humidity resistance reliability of the Si organic compound layer140′ may be insufficient. The first opening H1may be disposed in any one or more of the first band portion B1and the first connection portion C1of the first electrode layer, and the second opening H2may be disposed in any one or more of the second band portion B2and the second connection portion C2. As illustrated inFIG.6, the first extending portion141′ may have a form in which the first opening portion H1is only disposed in the first connecting portion A1, and the second extending portion142′ may have a form in which a second opening portion H2is only disposed in the second connection portion C2. In addition, as illustrated inFIG.8, a multilayer electronic component100″ according to another exemplary embodiment may include a silicon (Si) organic compound layer140″ having a body cover portion143disposed in a region, in which the first and second electrode layers131aand132aare not disposed, of external surfaces of the body110, a first extending portion141″ disposed to extend from the body cover portion143between the first electrode layer131aand the first conductive resin layer131b, and a second extending portion142″ disposed to extend from the body cover portion143between the second electrode layer132aand the second conductive resin layer132b. The first extending portion141″ may have a form in which the first opening portion H1is disposed in both the first connection portion C1and the first band portion B1, and the second extending portion142″ may have a form in which the second opening H2is disposed in both the second connection portion C2and the second band portion B2. The shape and the number of the openings H1and H2are not limited, and each of the openings H1and H2may have a shape such as a circle, a rectangle, an ellipse, a rectangle having rounded corners, and the like, and may have an irregular shape. As described above, a multilayer electronic component may include a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength. In addition, the Si organic compound layer may be provided to improve humidity resistance reliability. While embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the present disclosure as defined by the appended claims. | 31,600 |
11862405 | DETAILED DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same functions are denoted with the same reference numerals and overlapped explanation is omitted. A configuration of a high-voltage feed-through capacitor HC1according to an embodiment will be described with reference toFIG.1andFIG.2.FIG.1is an exploded perspective view illustrating a high-voltage feed-through capacitor according to the present embodiment.FIG.2is a diagram illustrating a cross-sectional configuration of the high-voltage feed-through capacitor according to the present embodiment. The high-voltage feed-through capacitor HC1includes an element body10, an electrode11, an electrode12, a metal fitting20, a plurality of through-conductors30and40, a plurality of electrode connectors31and41, a plurality of tubes37and47, a case50, a cover60, a resin70, and a resin80. In the present embodiment, the high-voltage feed-through capacitor HC1includes two through-conductors30and40, two electrode connectors31and41, and two tubes37and47. The element body10includes a main surface10aand a main surface10bopposing each other. In the present embodiment, the main surface10aand the main surface10boppose each other in a first direction D1. The main surface10aand the main surface10bdefine both end surfaces of the element body10in the first direction D1. The element body10includes a side wall surface10c. The side wall surface10cextends in the first direction D1to couple the main surface10aand the main surface10bin the first direction D1. The side wall surface10cdefines an outer periphery of the element body10when viewed in the first direction D1. Herein, a direction toward the main surface10afrom the main surface10bis an upward direction. The main surface10ais located above the main surface10bin the upward direction. For example, when the main surface10aconstitutes a first main surface, the main surface10bconstitutes a second main surface. The element body10includes, for example, an insulating material. The element body10includes, for example, ceramic. The ceramic includes, for example, BaTiO3, BaZrO3, CaTiO3, or MgTiO3. The element body10may include an additive added to the ceramic. The additive includes, for example, Si, Mg, Zr, Zn, Y, V, Al, or Mn. The electrode11is disposed on the main surface10a. The electrode12is disposed on the main surface10b. The electrode11and the electrode12oppose each other in the first direction D1. The element body10is located between the electrode11and the electrode12. Therefore, the electrode11and the electrode12indirectly oppose each other in the first direction D1in a state in which the element body10is located between the electrode11and the electrode12. The electrode11includes a pair of conductors13and14. The conductors13and14are disposed on the main surface10a. The conductors13and14are separated from each other on the main surface10a. In the present embodiment, the conductors13and14are separated from each other in a second direction D2intersecting the first direction D1. The conductor13opposes the electrode12in the first direction D1. The conductor14opposes the electrode12in the first direction D1. For example, when the electrode11constitutes a first electrode, the electrode12constitutes a second electrode. The electrode11and the electrode12include an electrically conductive metal material. The electrically conductive metal material includes, for example, Ag. The electrode11and the electrode12may include a magnetic material in addition to the conductive metal material. The magnetic material includes, for example, Fe, Co, Ni, Cu, or Sr. For example, the magnetic material may include at least two or more elements selected from the group consisting of Fe, Co, Ni, Cu, and Sr. For example, the electrode11and the electrode12are formed through sintering a conductive paste applied to the main surface10aand the main surface10b. The conductive paste for forming the electrode11and the electrode12contains the above-described electrically conductive metal material. As illustrated inFIG.1andFIG.2, the element body10is formed with a plurality of through-holes15and16. In the present embodiment, two through-holes15and16are formed in the element body10. The element body10includes an inner surface15adefining the through-hole15, and an inner surface16adefining the through-hole16. The through-hole15is opened at the main surface10aand the main surface10b. The through-hole15passes through the element body10from the main surface10ato the main surface10b. The through-hole16is opened at the main surface10aand the main surface10b. The through-hole16passes through the element body10from the main surface10ato the main surface10b. The through-holes15and16have a circular shape when viewed in the first direction D1. The through-holes15and16may have a shape other than the circular shape. The element body10is formed with a groove17. In the present embodiment, the groove17is formed in the element body10to be located between the conductor13and the conductor14when viewed in the first direction D1. In the present embodiment, the first direction D1coincides with a direction orthogonal to the main surface10a. The conductor13and the conductor14are separated from each other by the groove17. An electrode is not formed in the groove17. The element body10includes a wall surface17adefining the groove17. The groove17extends in a third direction D3intersecting the first direction D1and the second direction D2. The groove17reaches both ends of the main surface10ain the third direction D3. In the present embodiment, the first direction D1, the second direction D2, and the third direction D3are orthogonal to each other. The metal fitting20is electrically connected to the electrode12. The metal fitting20supports the element body10. As illustrated inFIG.1, the metal fitting20includes a protruding portion21and a peripheral portion22. The peripheral portion22surrounds the protruding portion21. The protruding portion21protrudes from the peripheral portion22toward the element body10when viewed in the second direction D2. The protruding portion21is formed with an opening23. An opening23is formed in the protruding portion21. The opening23passes through the protruding portion21in the first direction D1. In the present embodiment, the opening23is located in the central region of the protruding portion21when viewed in the first direction D1. The metal fitting20has a rectangular shape when viewed in the first direction D1. The rectangular shape includes a shape in which a corner is rounded or a shape in which a corner is chamfered. The metal fitting20may have a shape other than the rectangular shape. The metal fitting20includes an electrically conductive metal material. The electrically conductive metal material includes, for example, Fe, Cu, or a Cu—Zn alloy. The element body10is disposed on the metal fitting20in such a manner that the electrode12is electrically connected to the metal fitting20. In the present embodiment, the element body10is supported by the metal fitting20in such a manner that the protruding portion21is in contact with the electrode12. The metal fitting20is arranged to be grounded. The protruding portion21and the electrode12are coupled to each other through a solder. The through-conductor30is inserted into the through-hole15and passes therethrough, and has an outer diameter smaller than an inner diameter of the through-hole15. The through-conductor30is electrically connected to the electrode11. The through-conductor30includes a portion32located inside the through-hole15, a portion33protruding from the main surface10b, a tab portion34, and a caulking portion35. The portion32is separated from the inner surface15a. In the present embodiment, the portion32is integral with the portion33. Each of the portion32and the portion33includes an electrical conductor. The portion32and the portion33have a cylindrical shape when viewed in the first direction D1. The portion32and the portion33may have a shape other than the cylindrical shape. The tab portion34includes a tab connector. The caulking portion35electrically and physically connects the portions32and33and the tab portion34. For example, when the portion32constitutes a first portion, the portion33constitutes a second portion. The through-conductor30is electrically connected to the conductor13. The portions32and33of the through-conductor30are inserted into the electrode connector31, the through-hole15, and the opening23and pass therethrough. The electrode connector31electrically connects the tab portion34and the caulking portion35, and the conductor13. For example, the through-conductor30includes an electrically conductive metal material. The electrically conductive metal material includes, for example, Fe, Cu, or a Cu—Zn alloy. The through-conductor40is inserted into the through-hole16and passes therethrough, and has an outer diameter smaller than an inner diameter of the through-hole16. The through-conductor40is electrically connected to the electrode11. The through-conductor40includes a portion42located inside the through-hole16, a portion43protruding from the main surface10b, a tab portion44, and a caulking portion45. The portion42is separated from the inner surface16a. In the present embodiment, the portion42is integral with the portion43. Each of the portion42and the portion43includes an electrical conductor. The portion42and the portion43have a cylindrical shape when viewed in the first direction D1. The portion42and the portion43may have a shape other than the cylindrical shape. The tab portion44includes a tab connector. The caulking portion45electrically and physically connects the portions42and43, and the tab portion44. For example, when the portion42constitutes a first portion, the portion43constitutes a second portion. The through-conductor40is electrically connected to the conductor14. The portions42and43of the through-conductor40are inserted into the electrode connector41, the through hole16, and the opening23and pass therethrough. The electrode connector41electrically connects the tab portion44and the caulking portion45, and the conductor14. For example, the through-conductor40includes an electrically conductive metal material. The electrically conductive metal material includes, for example, Fe, Cu, or a Cu—Zn alloy. The tube37covers the through-conductor30, and has an electrical insulation property. That is, the tube37is electrically insulating. The tube37covers the portion32and the portion33. In the present embodiment, the tube37covers the entirety of the portion32and a part of the portion33. A region included in the through-conductor30and covered with the tube37is inserted into the through-hole15and the opening23and passes therethrough. The region covered with the tube37includes the entirety of the portion32and the part of the portion33. The tube47covers the through-conductor40, and has an electrical insulation property. That is, the tube47is electrically insulating. The tube47covers the portion42and the portion43. In the present embodiment, the tube47covers the entirety of the portion42and a part of the portion43. A region included in the through-conductor40and covered with the tube47is inserted into the through-hole16and the opening23and passes therethrough. The region covered with the tube47includes the entirety of the portion42and the part of the portion43. Each of the tubes37and47includes an insulating rubber. The insulating rubber includes, for example, a silicone rubber. The case50has a hollow tubular shape. The case50may have a shape other than the hollow tubular shape. The case50houses the element body10, and the electrodes11and12therein. The case50includes a housing surrounding the element body10, and the electrodes11and12. In the present embodiment, the case50houses the entirety of the element body10, the entirety of the electrodes11and12, a part of the metal fitting20, and a part of the cover60therein. The case50is disposed above the cover60. The case50is disposed to surround the element body10. That is, the case50surrounds the element body10. In the present embodiment, the case50surrounds the element body10, the electrode11, the electrode12, the protruding portion21, the electrode connectors31and41, the portions32and42, the tab portions34and44, and the caulking portions35and45. The case50is physically connected to the metal fitting20. The case50is connected to the metal fitting20in such a manner that an inner side surface of the case50is in contact with an outer side surface of the protruding portion21. The inner side surface of the case50includes a region being in contact with the outer side surface of the protruding portion21. The region being in contact with the outer side surface of the protruding portion21is located at a lower end portion of the case50. A lower end surface of the case50is in contact with an upper surface of the peripheral portion22. The cover60has a hollow tubular shape. The cover60may have a shape other than the hollow tubular shape. The cover60is disposed to surround the portion33and the portion43. That is, the cover60surrounds the portion33and the portion43. In the present embodiment, the cover60surrounds the portions33and43, and the tubes37and47. The cover60is physically connected to the metal fitting20. The cover60is connected to the metal fitting20in such a manner that an outer side surface of the cover60is in contact with an inner side surface of the protruding portion21when viewed in the second direction D2and the third direction D3. The outer side surface of the cover60includes a region being in contact with the inner side surface of the protruding portion21. The region being in contact with the inner side surface of the protruding portion21is located at an upper end portion of the outer side surface of the cover60. The cover60includes a housing surrounding the portions33and43. The case50and the cover60include an electrically insulating material. The case50and the cover60have an electrical insulation property. That is, the case50and the cover60are electrically insulating. The insulating material includes, for example, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), or modified melamine. The insulating material may include an inorganic material. The inorganic material includes, for example, a glass powder or a ceramic powder. The glass powder includes, for example, an industrial glass powder. The ceramic powder includes, for example, a SiO2powder, an Al2O3powder, talc (Mg3Si4O10(OH)2), aluminum nitride (AlN), or silicon nitride (Si3N4). As illustrated inFIG.2, the resin70is contained in the case50. An inner side of the case50is partially filled with the resin70. In the present embodiment, the resin70is contained in the case50to coat the element body10. That is, the resin70coats the element body10. The resin70is disposed between the case50, and the element body10, protruding portion21, electrode connectors31and41, tab portions34and44, and caulking portions35and45. The resin70fills a space between the case50, and the protruding portion21, element body10, electrode connectors31and41, tab portions34and44, and caulking portions35and45. The resin70is in contact with the element body10, the electrode11, the metal fitting20, the electrode connectors31and41, the through-conductors30and40, and the case50. In the present embodiment, the resin70is in contact with the side wall surface10c, the wall surface17a, the electrode11, the protruding portion21, the electrode connectors31and41, the tab portions34and44, the caulking portions35and45, and the case50. An upper edge of the resin70is located at a height at which the caulking portions35and45are embedded. A lower edge of the resin70is in contact with the protruding portion21. The upper edge of the resin70represents an edge located on an upward side between both edges of the resin70in the first direction D1. The lower edge of the resin70represents an edge located on a downward side between both the edges of the resin70in the first direction D1. The resin80is contained in the cover60. The inside of case50is partially filled with the resin70. An inner side of the cover60is partially filled with the resin80. In the present embodiment, the resin80is contained in the cover60and is located in a space between the inner surface15aand the portion32and a space between the inner surface16aand the portion42. The resin80is located in a space between the inner surface15aand the tube37, and a space between the inner surface16aand the tube47. The resin80fills a space between the cover60, and the protruding portion21, inner surfaces15aand16a, and tubes37and47. The resin80is in contact with the element body10, the electrode12, the metal fitting20, the tubes37and47, and the cover60. In the present embodiment, the resin80is in contact with the inner surfaces15aand16a, the electrode12, the protruding portion21, the tubes37and47, and the cover60. A portion included in the tube37and being in contact with the resin80is located at least at the inside of the through-hole15. A portion included in the tube47and being in contact with the resin80is located at least at the inside of the through-hole16. An upper edge of the resin80is in contact with lower surfaces of the electrode connectors31and41. A lower edge of the resin80is located on a downward side of a lower surface of the peripheral portion22. The upper edge of the resin80represents an edge located on an upward side between both edges of the resin80in the first direction D1. The lower edge of the resin80represents an edge located on a downward side between both the edges of the resin80in the first direction D1. For example, when the resin70constitutes a first resin, the resin80constitutes a second resin. The resin70and the resin80include an electrically insulating material. The resin70and the resin80have an electrical insulation property. That is, the resin70and the resin80are electrically insulating. The insulating material includes, for example, a thermosetting resin. The thermosetting resin includes, for example, an epoxy resin, a urethane resin, a phenolic resin, or a silicone resin. The resin70and the resin80may respectively include insulating materials different from each other. In the present embodiment, the resin70and the resin80include the epoxy resin. Next, description will be given of a relationship between an electrical resistivity of each of the resins70and80, and the tubes37and47, and an intensity of an electric field formed between the electrode12and the through-conductors30and40. The present inventors have conducted a simulation to clarify the above-described relationship. The simulation uses a model including the element body10, the electrodes11and12, the through-conductor40, the tube47, and the resins70and80in accordance with the configuration of the high-voltage feed-through capacitor HC1. In the model, the intensity of an electric field that is formed between the electrode12and the through-conductor40when applying a voltage between the electrode11and the electrode12was obtained. A DC voltage of 10 kV was applied between the electrode11and the electrode12. Results of the simulation are illustrated inFIG.3.FIG.3is a table illustrating a relationship between an electrical resistivity and an electric field intensity. The model used in the above-described simulation does not include the through-conductor30and the tube37. However, it can be understood that the results illustrated inFIG.3are obtained even in a case of conducting the simulation by using a model including the through-conductor30and the tube37instead of the model including the through-conductor40and the tube47as long as a first condition and a second condition are satisfied. In the first condition, a shape and a size of the through-conductor30and the tube37are set to be equivalent to a shape and a size of the through-conductor40and the tube47. In the second condition, a positional relationship between the through-conductor30, and the element body10and the electrodes11and12is set to be equivalent to a positional relationship between the through-conductor40, and the element body10and the electrodes11and12. In Example 1, an electrical resistivity ρ1of the resin70is 1.0×1013Ω·m, an electrical resistivity ρ2of the resin80is 1.0×107Ω·m, and an electrical resistivity ρ3of the tube47is 1.0×1011Ω·m. In this case, an intensity E of an electric field formed between the electrode12and the through-conductor40is 2.9×106V/m. Hereinafter, the intensity E of the electric field formed between the electrode12and the through-conductor40is referred to as “electric field intensity E”. In Example 2, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×109μm, and the electrical resistivity ρ3is 1.0×1011Ω·m. In this case, the electric field intensity E is 3.1×106V/m. In Example 3, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×1011Ω·m, and the electrical resistivity ρ3is 1.0×1011Ω·m. In this case, the electric field intensity E is 7.1×106V/m. In Example 4, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×1013Ω·m, and the electrical resistivity ρ3is 1.0×1011Ω·m. In this case, the electric field intensity E is 1.2×107V/m. In Example 5, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×1015Ω·m, and the electrical resistivity ρ3is 1.0×1011Ω·m. In this case, the electric field intensity E is 1.2×107V/m. In Example 6, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×109Ω·m, and the electrical resistivity ρ3is 1.0×1015Ω·m. In this case, the electric field intensity E is 2.8×106V/m. In Example 7, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×1011Ω·m, and the electrical resistivity ρ3is 1.0×1015Ω·m. In this case, the electric field intensity E is 2.3×106V/m. In Example 8, the electrical resistivity ρ1is 1.0×1015Ω·m, the electrical resistivity ρ2is 1.0×109Ω·m, and the electrical resistivity ρ3is 1.0×1015Ω·m. In this case, the electric field intensity E is 2.8×106V/m. In Example 9, the electrical resistivity ρ1is 1.0×1015Ω·m, the electrical resistivity ρ2is 1.0×1011Ω·m, and the electrical resistivity ρ3is 1.0×1015Ω·m. In this case, the electric field intensity E is 2.3×106V/m. In Example 10, the electrical resistivity ρ1is 1.0×1015Ω·m, the electrical resistivity ρ2is 1.0×1013Ω·m, and the electrical resistivity ρ3is 1.0×1015Ω·m. In this case, the electric field intensity E is 2.3×106V/m. In Example 11, the electrical resistivity ρ1is 1.0×107Ω·m, the electrical resistivity ρ2is 1.0×1013Ω·m, and the electrical resistivity ρ3is 1.0×1011Ω·m. In this case, the electric field intensity E is 1.2×107V/m. In Example 12, the electrical resistivity ρ1is 1.0×109Ω·m, the electrical resistivity ρ2is 1.0×1013Ω·m, and the electrical resistivity ρ3is 1.0×1011Ω·m. In this case, the electric field intensity E is 1.2×107V/m. In Example 13, the electrical resistivity ρ1is 1.0×1011Ω·m, the electrical resistivity ρ2is 1.0×1013Ω·m, and the electrical resistivity ρ3is 1.0×1011Ω·m. In this case, the electric field intensity E is 1.2×107V/m. In Example 14, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×1011Ω·m, and the electrical resistivity ρ3is 1.0×1013Ω·m. In this case, the electric field intensity E is 2.4×106V/m. In Example 15, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×1011Ω·m, and the electrical resistivity ρ3is 1.0×1015Ω·m. In this case, the electric field intensity E is 2.3×106V/m. In Example 16, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×109Ω·m, and the electrical resistivity ρ3is 1.0×109Ω·m. In this case, the electric field intensity E is 9.8×106V/m. In Example 17, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×109Ω·m, and the electrical resistivity ρ3is 1.0×1013Ω·m. In this case, the electric field intensity E is 2.8×106V/m. In Example 18, the electrical resistivity ρ1is 1.0×1013Ω·m, the electrical resistivity ρ2is 1.0×109Ω·m, and the electrical resistivity ρ3is 1.0×1015Ω·m. In this case, the electric field intensity E is 2.8×106V/m. In Examples 4, 5, and Examples 11 to 13, in which the electrical resistivity ρ2is equal to or greater than the electrical resistivity ρ1, the electric field intensity E is 1.0×107V/m or greater as also illustrated inFIG.4. The electric field intensity E is 1.0×107V/m or greater represents that the intensity of the electric field formed between the electrode12and the through-conductor40is high. According to a finding obtained by the present inventors, in the configuration in which the electric field intensity E is 1.0×107V/m or greater, dielectric breakdown tends to occur in a high-voltage feed-through capacitor. In contrast, in Examples 1 to 3, Examples 6 to 10, and Examples 14 to 18, in which the electrical resistivity ρ2is lower than the electrical resistivity ρ1, the electric field intensity E is less than 1.0×107V/m as also illustrated inFIG.5. A configuration in which the electric field intensity E is less than 1.0×107V/m represents that the intensity of the electric field formed between the electrode12and the through-conductor40is low. Therefore, it could be understood that dielectric breakdown tends not to occur in a high-voltage feed-through capacitor in which the electrical resistivity ρ2is lower than the resistivity ρ1. FIG.4is a diagram illustrating an example of simulation results of the electric field intensity.FIG.5is a diagram illustrating another example of simulation results of the electric field intensity. InFIG.4andFIG.5, a region where the electric field intensity E is 1.0×107V/m or greater is hatched. As described above, in Examples 1 to 3 and Examples 9 to 13, the electric field intensity E is less than 1.0×107V/m. Therefore, inFIG.5, a hatched region does not exist. The following points can be understood based on Examples 1 to 3, Examples 6 to 10, and Examples 14 to 18. In a high-voltage feed-through capacitor in which the electrical resistivity ρ2is equal to or greater than 1×107Ω·m and equal to or less than 1×1013Ω·m, the dielectric breakdown tends not to occur. In a high-voltage feed-through capacitor in which a ratio of the electrical resistivity ρ2to the electrical resistivity ρ1is equal to or greater than 0.000001 and equal to or less than 0.01, the dielectric breakdown tends not to occur. The following points can be understood based on Examples 1 to 3, Examples 6 to 10, and Examples 14 to 18. In a high-voltage feed-through capacitor in which the electrical resistivity ρ3is equal to or greater than the electrical resistivity ρ2, the dielectric breakdown tends not to occur. In a high-voltage feed-through capacitor in which the electrical resistivity ρ3is equal to or greater than 1×109Ω·m and equal to or less than 1×1015Ω·, the dielectric breakdown tends not to occur. In a high-voltage feed-through capacitor in which the ratio of the electrical resistivity ρ2to the electrical resistivity ρ3is equal to or greater than 0.000001 and equal to or less than 1, the dielectric breakdown tends not to occur. In a high-voltage feed-through capacitor in which the ratio of the electrical resistivity ρ2to the electrical resistivity ρ3is equal to or greater than 0.000001 and equal to or less than 0.01, the dielectric breakdown further tends not to occur. As described above, the high-voltage feed-through capacitor HC1includes a configuration in which the resin80have the electrical resistivity less than the electrical resistivity of the resin70. Therefore, the high-voltage feed-through capacitor HC1decreases the intensity of the electric field formed between the electrode12and the through-conductor40and the intensity of the electric field formed between the electrode12and the through-conductor30, and thus improves reliability. The high-voltage feed-through capacitor HC1may include a configuration in which the electrical resistivity of the resin80is equal to or greater than 1×107Ω·m and equal to or less than 1×1013Ω·m. The high-voltage feed-through capacitor HC1including this configuration simply and reliably realizes a configuration in which the dielectric breakdown is tends not to occur. The high-voltage feed-through capacitor HC1may include a configuration in which the ratio of the electrical resistivity of the resin80to the electrical resistivity of the resin70is equal to or greater than 0.000001 and equal to or less 0.01. The high-voltage feed-through capacitor HC1including this configuration simply and reliably realizes a configuration in which the dielectric breakdown tends not to occur. The high-voltage feed-through capacitor HC1may include a configuration in which the electrical resistivity of the tubes37and47is equal to or greater than the electrical resistivity of the resin80. The high-voltage feed-through capacitor HC1including this configuration simply and reliably realizes a configuration in which the dielectric breakdown tends not to occur. The electrical resistivity of the tube37may be equivalent to the electrical resistivity of the tube47. “Equivalent” does not necessarily represent that values are equal to each other. Even in a case where a minute difference within a range set in advance, a manufacturing error, or a measurement error is included in values, the values may be considered to be equivalent to each other. The electrical resistivity of the tube37and the electrical resistivity of the tube47may be different from each other. The high-voltage feed-through capacitor HC1may include a configuration in which the electrical resistivity of each of the tubes37and47is equal to or greater than 1×109Ω·m and equal to or less than 1×1015Ω·m. The high-voltage feed-through capacitor HC1including this configuration simply and reliably realizes a configuration in which the dielectric breakdown tends not to occur. The high-voltage feed-through capacitor HC1may include a configuration in which the ratio of the electrical resistivity of the resin80to the electrical resistivity of each of the tubes37and47is equal to or greater than 0.000001 and equal to or less than 1. The high-voltage feed-through capacitor HC1including this configuration simply and reliably realizes a configuration in which the dielectric breakdown tends not to occur. The high-voltage feed-through capacitor HC1may include a configuration in which the ratio of the electrical resistivity of the resin80to the electrical resistivity of each of the tubes37and47is equal to or greater than 0.000001 and equal to or less than 0.01. The high-voltage feed-through capacitor HC1including this configuration simply and reliably realizes a configuration in which the dielectric breakdown further tends not to occur. The high-voltage feed-through capacitor HC1may include a configuration in which the resin70and the resin80include epoxy resin. The high-voltage feed-through capacitor HC1including this configuration simply realizes the resin70and the resin80having electrical resistivities are different from each other. Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the embodiment, and the embodiment can be variously changed without departing from the scope of the invention. The high-voltage feed-through capacitor HC1includes the two through-conductors30and40, but the high-voltage feed-through capacitor HC1may include three or more through-conductors. The high-voltage feed-through capacitor HC1may include any one through-conductor of the two through-conductors30and40. That is, the high-voltage feed-through capacitor HC1may include a single through-conductor. The number of each of the through holes formed in the element body10, the tubes, the conductors included in the electrode11, and the electrode connectors may be set to correspond to the number of through-conductors. | 32,289 |
11862406 | DESCRIPTION OF EMBODIMENTS Novel features of the present disclosure are set forth in the appended claims. Meanwhile both construction and content of the present disclosure will be better understood by the following detailed description with the drawings, taken in conjunction with other objectives and features of the present disclosure. An anode foil of a capacitor element includes a porous part disposed on a surface of a base material part. The porous part includes many voids. In the anode section of the anode foil on which the solid electrolyte layer is not disposed, the electrode terminal is connected. Air may enter into the capacitor element from the electrode terminal side through the voids of the porous part, and thus the conductive polymer included in the solid electrolyte layer may be deteriorated. Such deterioration of the conductive polymer is remarkable particularly in a high-temperature environment. In the solid electrolytic capacitor according to the first aspect of the present disclosure, the separation section is disposed between the anode section and the cathode formation section in the anode foil of the capacitor element, and the first insulating material is disposed on a surface of the porous part in the separation section. Note that in the separation section, a region where the first insulating material is disposed is defined as a first region, a region between the first insulating material (or first region) and the cathode formation section is defined as a second region, and a region closer to the anode section than the first insulating material (or first region) is defined as a third region. In the solid electrolytic capacitor, at least a part of the first region of the porous part, which is covered with the first insulating material, includes the second insulating material. Since the porous part of the first region includes the second insulating material, entry of air through the first region into the capacitor element is suppressed. The solid electrolytic capacitor according to the above aspect can be formed by impregnating voids of the porous part in the first region with the second insulating material after forming a capacitor element in which the first insulating material is disposed on a surface of the separation section. From the viewpoint of enhancing the effect of suppressing the entry of air, the porous part (more specifically, voids of porous part) of the first region may be filled with the second insulating material. The solid electrolytic capacitor according to the second aspect of the present disclosure includes the separation section located between the anode section and the cathode formation section in the anode foil of the capacitor element. A first insulating material is disposed on or included in at least a part of the separation section. The capacitor element includes a second insulating material in at least a part of a region (third region) that is closer to the anode section than the first insulating material in the separation section. As a result, it is possible to suppress entry of air into the capacitor element from the anode section side. The solid electrolytic capacitor according to the second aspect can be manufactured by compressing and/or removing at least a part of the porous part of the separation section, disposing the first insulating material in at least a part of the separation section or impregnating the at least a part of the separation section with the first insulating material, forming the solid electrolyte layer and the cathode lead-out layer, and then disposing the second insulating material in separation section or impregnating the separation section with the second insulating material. The second insulating material is disposed in or used to impregnate at least a part of the third region. In the solid electrolytic capacitor according to the third aspect of the present disclosure, the first insulating material is disposed on or included in at least a part of the separation section, and at least a part of a region (i.e., second region of separation unit) of the separation section that is closer to the cathode formation section than the first insulating material (or first region) is covered with the solid electrolyte layer. Additionally, in the solid electrolytic capacitor according to the fourth aspect of the present disclosure, the first insulating material is disposed on or included in at least a part of the separation section, the second groove is formed to be adjacent to the first insulating material at a side close to the cathode formation section in the separation section, and the solid electrolyte layer is disposed in at least a part of the second groove. The second groove is formed in the second region. In these solid electrolytic capacitors, since the solid electrolyte layer is disposed in at least a part of the second region, entry of air through the second region is suppressed. From the viewpoint of enhancing the effect of suppressing the entry of air, the second groove may be filled with the solid electrolyte layer. In the solid electrolytic capacitor according to the fifth aspect of the present disclosure, the first insulating material is disposed on or included in at least a part of the separation section, the third groove is formed in at least a part of the cathode formation section, and the solid electrolyte layer is disposed in at least a part of the third groove. In such a solid electrolytic capacitor, entry of air through a region located closer to the anode section than the third groove is suppressed. From the viewpoint of enhancing the effect of suppressing the entry of air, the third groove may be filled with the solid electrolyte layer. In the solid electrolytic capacitor according to the sixth aspect of the present disclosure, the first insulating material is disposed on or included in at least a part of the separation section, the second groove is formed to to be adjacent to the first insulating material at a side close to the cathode formation section in the separation section, and the second insulating material is disposed in at least a part of the second groove. The second groove is formed in the second region. In such a solid electrolytic capacitor, since the second insulating material is disposed in at least a part of the second region, entry of air through the second region is suppressed. From the viewpoint of enhancing the effect of suppressing the entry of air, the second groove may be filled with the second insulating material. As described above, with the solid electrolytic capacitors of these aspects, entry of air into the capacitor element is suppressed. This increases the effect of suppressing degradation of the conductive polymer included in the solid electrolyte layer even after the solid electrolytic capacitor is exposed to a high temperature environment. Hence, a decrease in capacitance after the heat resistance test can be suppressed. Additionally, since the heat resistance of the solid electrolyte layer is improved, an increase in equivalent series resistance (ESR) and dielectric loss tangent (tan δ) after the heat resistance test can be reduced. Note that the phrase “the porous part, the separation section, the capacitor element, or the like includes the insulating material” is used in a broad sense including a case where the porous part, the separation section, or the capacitor element (more specifically, voids thereof) is impregnated with the insulating material and a case where the porous part, the separation section, or the capacitor element is filled with the insulating material. Hereinafter, a solid electrolytic capacitor according to the above aspects of the present disclosure and a method for manufacturing the same will be described more specifically with reference to the drawings as necessary. [Solid Electrolytic Capacitor] (Capacitor Element) A capacitor element included in a solid electrolytic capacitor includes an anode foil, a dielectric layer formed on at least a part of a surface of the anode foil, a solid electrolyte layer covering at least a part of the dielectric layer, and a cathode lead-out layer covering at least a part of the solid electrolyte layer. The anode foil includes a base material part and a porous part disposed on a surface of the base material part. Further, the anode foil is defiled into a cathode formation section in which the solid electrolyte layer is formed, an anode section in which the solid electrolyte layer is not formed, and a separation section located between the anode section and the cathode formation section. The separation section may have, for example, a part (thin part) where the thickness of the porous part is small. The thin part is formed by compressing or partially removing the porous part. A part obtained by compressing the porous part may be referred to as a compressed part. A recess formed in the separation section by compressing and/or removing the porous part may be referred to as a groove. The groove may be formed on the base material part with the porous part interposed therebetween. Alternatively, the groove may be directly formed on the base material part without the porous part interposed therebetween. In a part where a groove is formed (or thin part), the passage of air is reduced as compared with other parts, and thus it is advantageous to provide the groove from the viewpoint of suppressing entry of air. FIG.1is a cross-sectional view schematically illustrating a structure of a solid electrolytic capacitor according to a first exemplary embodiment of the present disclosure.FIG.2is an enlarged cross-sectional view schematically illustrating capacitor element2included in the solid electrolytic capacitor ofFIG.1. Solid electrolytic capacitor1includes capacitor element2, exterior body3that seals capacitor element2, and anode lead terminal4and cathode lead terminal5each of which is at least partially exposed to the outside of exterior body3. Exterior body3has a substantially rectangular parallelepiped outer shape, and solid electrolytic capacitor1also has a substantially rectangular parallelepiped outer shape. Capacitor element2includes anode foil6, a dielectric layer (not shown) covering a surface of anode foil6, and cathode part8covering the dielectric layer. The dielectric layer is formed, at minimum, on at least a part of the surface of anode foil6. Cathode part8includes solid electrolyte layer9and cathode lead-out layer10. Solid electrolyte layer9is formed so as to cover at least a part of the dielectric layer. Cathode lead-out layer10is formed so as to cover at least a part of solid electrolyte layer9. Cathode lead-out layer10has carbon layer11and metal paste layer12. Cathode lead terminal5is electrically connected to cathode part8via adhesive layer14made of a conductive adhesive. Anode foil6includes base material part6aand porous part6bformed on a surface of base material part6a.Anode foil6has anode section16aon which solid electrolyte layer9is not formed, cathode formation section16bon which solid electrolyte layer9(or cathode part8) is formed, and separation section16clocated between anode section16aand cathode formation section16b.Anode lead terminal4is electrically connected to anode section16aof anode foil6by welding. First insulating material13is disposed on a surface of porous part6bin separation section16c.First insulating material13restricts (electrical) contact between anode section16aand cathode part8by preventing the conductive polymer from creeping toward anode section16awhen solid electrolyte layer9is formed. In the illustrated example, separation section16chas thin part26, and first insulating material13is disposed on thin part26. First insulating material13may be disposed on at least a part of thin part26. Note that separation section16cdoes not necessarily have to have thin part26. In the present exemplary embodiment, at least a part of a region of porous part6bof first region36acovered with first insulating material13includes second insulating material7. More specifically, porous part6bof first region36aincludes second insulating material7. Porous part6bincludes voids. Hence, porous part6bincludes second insulating material7in a state where the voids are impregnated with second insulating material7. Since porous part6bof first region36aincludes second insulating material7, entry of air into the capacitor element through first region36ais suppressed. As a result, deterioration of the conductive polymer included in solid electrolyte layer9due to oxygen is suppressed, so that heat resistance of solid electrolyte layer9can be enhanced. A decrease in capacitance of the solid electrolytic capacitor after the heat resistance test can be suppressed. Additionally, an increase of ESR and a dielectric loss tangent after the heat resistance test can be reduced. Second insulating material7is included, at minimum, in at least porous part6bof first region36a.Second insulating material7may also be included at least around first region36a.In this case, entry of air into capacitor element2through porous part6baround first region36ais suppressed. Further, second insulating material7may be included in at least a part of cathode lead-out layer10. From this, it is possible to suppress entry of air into capacitor element2through cathode lead-out layer10. For example, second insulating material7may be included in porous part6bbetween first insulating material13and cathode lead-out layer10(in other words, porous part6bof second region36blocated between first insulating material13of porous part6band cathode lead-out layer10). Further, second insulating material7may be included in porous part6bof a region located closer to anode section16athan first insulating material13(in other words, porous part6bof third region36clocated closer to anode section16athan first insulating material13of porous part6b). In this case, depending on the position of first insulating material13, the part including second insulating material7may be located in porous part6bof any of anode section16aor porous part6bof separation section16c. Second insulating material7may be included at these positions in an impregnated state or in a filled state. FIG.3is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a second exemplary embodiment. Since cathode part8of capacitor element2includes a plurality of layers and has a thickness to some extent, a recess (neck) is formed between cathode part8and separation section16c(or first insulating material13). As shown inFIG.3, a surface of the recess (neck) may be covered with third insulating material17. At least a part of the surface of the recess, at minimum, is covered with third insulating material17, and the recess may be filled with third insulating material17. Third insulating material17may adhere to at least the periphery of first region36a.Further, third insulating material17may cover at least a part of at least one of cathode lead-out layer10or solid electrolyte layer9. For example, as shown inFIG.3, an end of cathode lead-out layer10or an end of solid electrolyte layer9at a side close to anode section16aand its periphery may be covered with third insulating material17. Third insulating material17may cover at least a part of a surface of solid electrolyte layer9that is not covered with cathode lead-out layer10. For example, near the end of cathode lead-out layer10at a side close to anode section16a,there is a part where solid electrolyte layer9is not covered with cathode lead-out layer10. In such a case, at least a part of solid electrolyte layer9may be covered with third insulating material17disposed between first insulating material13(or first region36a) and the end of cathode lead-out layer10at a side close to anode section16a.In the case ofFIG.3, as the same in the case ofFIGS.1and2, second insulating material is included in porous part6bof first region36a,second region36b,and third region36c. Capacitor element2inFIG.3is the same as capacitor element2inFIG.2except that at least a part of the recess (neck) and the end of cathode lead-out layer10and/or solid electrolyte layer9at a side close to anode section16aand its periphery is covered with third insulating material17. Hence, the description ofFIGS.1and2can be referred to. Note that although not shown, at least a part of porous part6bthat is located closer to anode section16athan first insulating material13may be covered with third insulating material17. FIG.4is an enlarged cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a third exemplary embodiment. InFIG.4, third insulating material17covers a surface of first insulating material13, a surface of porous part6bbetween first insulating material13and the end of cathode lead-out layer10at a side close to anode section16a,and a surface of porous part6blocated next to first insulating material13at a side close to on anode section16a.Further, a second insulating material is also included in porous part6bof second region36band third region36c. Since metal paste layer12is not dense, voids exist in metal paste layer12. Hence, when an insulating material is supplied to a surface of cathode lead-out layer10, metal paste layer12is impregnated with the insulating material. The impregnated insulating material corresponds to second insulating material7. InFIG.4, entirety of metal paste layer12is impregnated with second insulating material7. Note that second insulating material7does not necessarily have to be included in the entirety of metal paste layer12, and is included, at minimum, in at least a part of metal paste layer12. When metal paste layer12includes second insulating material, it is possible to suppress entry of air into capacitor element2through metal paste layer12, and it is possible to suppress a decrease in heat resistance of solid electrolyte layer9even more. Further, an insulating material may be attached to the surface of cathode lead-out layer10. The insulating material covering at least a part of cathode lead-out layer10corresponds to third insulating material17. The second insulating material supplied from at least one of separation section16c,anode section16a,and cathode lead-out layer10penetrates into porous part6b,so that porous part6bin at least one of first region36a,second region36b,third region36c,and cathode formation section16bis impregnated or filled with the second insulating material. The second insulating material supplied to the surface of cathode lead-out layer10may penetrate into cathode lead-out layer10, solid electrolyte layer9, and the like to impregnate or fill porous part6bin cathode formation section16b. FIG.5is a cross-sectional view schematically illustrating a capacitor element included in a solid electrolytic capacitor according to a fourth exemplary embodiment. InFIG.5, three capacitor elements102A,102B, and102C are laminated. InFIG.5, only the laminated body part of these capacitor elements is illustrated for the sake of convenience. The configuration ofFIG.5is different from the configurations ofFIGS.2to4in that three capacitor elements are laminated and the region covered with an insulating material is different. However, the description ofFIGS.1to4can be referred to for the rest of the configuration. InFIG.5, each of capacitor elements102A,102B, and102C includes anode foil6, a dielectric layer covering anode foil6, solid electrolyte layer9covering the dielectric layer, and cathode lead-out layer10covering solid electrolyte layer9, as the same in the case ofFIG.2. Anode foil6is defined into anode section16a,cathode formation section16b,and separation section16ctherebetween. First insulating material13is disposed on porous part6bof separation section16c. Fourth insulating material117covers a part of a surface of the laminated body of capacitor elements102A,102B, and102C. More specifically, fourth insulating material117covers a part of a surface of first insulating material13, porous part6bbetween first insulating material13and the end of solid electrolyte layer9at a side close to anode section16a,and a part of a surface of solid electrolyte layer9. Fourth insulating material117may cover at least a part of cathode lead-out layer10. Fourth insulating material117may cover at least a part of the laminated body. Even in the case of the laminated body of the capacitor elements, at least a part of the surface is covered with fourth insulating material117, so that entry of air into each capacitor element is suppressed, and a decrease in heat resistance of solid electrolyte layer9can be suppressed. Further, after the laminated body of the capacitor elements is connected to a lead frame, at least a part of surfaces of the laminated body and the lead frame may be covered with fourth insulating material117. The position of fourth insulating material117in the laminated body is not limited to these cases. For example, in the laminated body, at least one of a part between adjacent capacitor elements, between first insulating materials13of adjacent capacitor elements, between third insulating materials17of adjacent capacitor elements, and the entire surface of the laminated body may be covered with fourth insulating material117. In the laminated body, at least a part of cathode lead-out layer10(e.g., silver paste layer) may include a second insulating material. By supplying the insulating material to the surface of the laminated body, the insulating material penetrates into porous part6b,and the first region, the second region, porous part6bof cathode formation section16b,and the like are also impregnated or filled with the insulating material. The impregnated or filled insulating material corresponds to the second insulating material. Further, in the laminated body, at least a part of the periphery of at least first region36a,cathode lead-out layer10, solid electrolyte layer9, and the like may be covered with an insulating material (corresponding to third insulating material). Although the following exemplary embodiments shown inFIGS.6to14are different fromFIGS.2to4in that a groove part is formed in an anode section, or a position of an insulating material, a region covered by a solid electrolyte layer, or the like is different, the description ofFIGS.1to4can be referred to for the rest of the configuration. In these exemplary embodiments, as the same in the case ofFIGS.2to4, first insulating material13is disposed on a surface of porous part6b(more specifically, thin part26). Meanwhile, the present invention is not limited to such a case. First insulating material13may be disposed on at least a part of separation section16cor may be included in at least a part of separation section16c.First insulating material13may be disposed on at least a part of thin part26. Further, separation section16cdoes not necessarily have to have thin part26. First insulating material13does not necessarily have to be disposed on the surface of porous part6b,and may be disposed directly on base material part6awithout interposing porous part6b.Note that the capacitor elements shown in these exemplary embodiments may be used as the capacitor elements forming the laminated body ofFIG.5. FIG.6is an enlarged cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a fifth exemplary embodiment. In the present exemplary embodiment, in separation section16c,second insulating material7is included in at least a part of third region36cthat is located closer to anode section16athan first region36awhere first insulating material13is disposed. Since second insulating material7is included in third region36c,entry of air into capacitor element2from anode section16ais suppressed. Second insulating material7may be disposed in third region36c,and at least a part of third region36cmay be impregnated or filled with second insulating material7. In the illustrated example, thin part26is formed in third region36cas well, whereby groove (first groove)19is formed adjacent to first insulating material13. First groove19is filled with second insulating material7. Since second insulating material7is included in first groove19as described above, entry of air into capacitor element2through porous part6bin third region36cis suppressed even more. Second insulating material7does not necessarily have to be included so as to fill the entire first groove19as shown inFIG.6, and second insulating material7is disposed, at minimum, in at least a part of first groove19. For example, second insulating material7may be disposed so as to cover at least a part of first groove19. Alternatively, first groove19may be impregnated with second insulating material7. For example, second insulating material7may be filled so as to partially fill first groove19, or second insulating material7may be disposed on at least a part of an inner surface of first groove19. Porous part6baround first groove19may include second insulating material7in an impregnated (or filled) state. It is possible to suppress entry of air into capacitor element2through porous part6baround first groove19. For example, in third region36c,porous part6bexisting below first groove19may include second insulating material7in an impregnated (or filled) state. Further, at least a part (such as a part close to third region36c) of porous part6bin first region36amay include second insulating material7in an impregnated (or filled) state. Further, at least a part of cathode lead-out layer10may include second insulating material7in an impregnated or filled state. Although not shown, at least a part of cathode lead-out layer10may be covered with third insulating material17. In at least one of these cases, entry of air into capacitor element2from cathode lead-out layer10can be suppressed. For example, porous part6bbetween first insulating material13and cathode lead-out layer10(in other words, second region36bbetween first insulating material13of porous part6band cathode lead-out layer10) may include second insulating material7in an impregnated or filled state. Further, porous part6bof a part of anode section16aadjacent to separation section16cmay include second insulating material7in an impregnated or filled state. In the case ofFIG.6, a surface of a recess (neck) may also be covered with third insulating material17as the same in the case ofFIG.3. Further, third insulating material17may adhere to at least the periphery of first region36a.Third insulating material17may cover at least a part of at least one of cathode lead-out layer10or solid electrolyte layer9. The position of third insulating material17can be referred to in the description ofFIG.3or4. At least a part of a surface of first insulating material13may be covered with third insulating material17. FIG.7is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a sixth exemplary embodiment. InFIG.7, first groove19is formed by removing porous part6bin third region36c.That is, there is no porous part6bbelow first groove19. Meanwhile, the rest of the configuration is the same as inFIG.6, and the description ofFIGS.1and6can be referred to. In the case ofFIG.7, second insulating material7is included in first groove19as the same in the case ofFIG.6. Hence, entry of air can be suppressed. Alternatively, at least a part of porous part6bin first region36amay include second insulating material7in an impregnated (or filled) state. FIG.8is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a seventh exemplary embodiment.FIG.9is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to an eighth exemplary embodiment. These drawings show an example of a case where porous part6bexists in a part below first groove19. These exemplary embodiments are the same asFIG.6except that the structure of first groove19is different, and the description ofFIGS.1and6can be referred to. InFIG.8, in a part of third region36cwhich is close to first region36a,porous part6bexists below first groove19. In the remaining part of third region36cwhich is close to anode section16a,porous part6bdoes not exist below first groove19. A recess which is close to anode section16ais formed at a bottom part of first groove19. Since the recess is filled with second insulating material7, entry of air can be suppressed. Porous part6bbelow first groove19may be impregnated (or filled) with second insulating material in a part of third region36cwhich is close to first region36a. InFIG.9, porous part6bexists below first groove19in a part of third region36cwhich is close to anode section16a,and porous part6bdoes not exist below first groove19in the remaining part of third region36cwhich is close to first region36a.In a bottom part of first groove19, a recess which is close to first region36ais formed because porous part6bdoes not exist. That is, only the position of porous part6b(or recess) below first groove19is different from that inFIG.8, and the rest of the configuration is the same as inFIG.8. The recess which is close to first region36ais filled with second insulating material7, so that entry of air can be suppressed. Porous part6bbelow first groove19in a part of third region36cwhich is close to anode section16amay include second insulating material7in an impregnated (or filled) state. While these drawings show a state in which the recess of the bottom part of first groove19is filled with second insulating material7, the present invention is not limited to this case. For example, at least a part of first groove19may be covered with second insulating material7. At least a part of first groove19may be impregnated or filled with second insulating material7, or the entirety of first groove19may be filled with second insulating material7. WhileFIGS.6to9show the case where first groove19is formed at a position adjacent to first insulating material13, the present invention is not particularly limited to this case. First groove19may be formed to be apart from first insulating material13. An example of this case is shown inFIG.10. FIG.10is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a ninth exemplary embodiment. InFIG.10, first groove19is formed to be apart from first insulating material13. First groove19is filled with second insulating material7, whereby entry of air is suppressed. While porous part6bexists in a part of third region36cwhich is close to first region36a,this part may include second insulating material7in an impregnated (or filled) state. Although porous part6bdoes not exist below first groove19, the present invention is not limited to this case, and porous part6bmay be provided below first groove19. Porous part6bbelow first groove19may include the second insulating material in an impregnated (or filled) state. The rest of the configuration is the same as inFIG.6, and the description ofFIGS.1and6can be referred to. FIG.11is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a tenth exemplary embodiment.FIG.12is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to an eleventh exemplary embodiment. These drawings show an example of a state in which solid electrolyte layer9is disposed in at least a part of a region (i.e., second region36b) in separation section16cwhich is closer to cathode formation section16bthan first insulating material13. By disposing solid electrolyte layer9in at least a part of second region36bin separation section16c,entry of air into second region36bis suppressed. InFIG.11, thin part26is formed in separation section16c,and first insulating material13is disposed on a surface of a part of thin part26which is close to anode section16a.In second region36b,second groove29is formed adjacent to first insulating material13. Solid electrolyte layer9is formed so as to enter into second groove29, so that solid electrolyte layer9is disposed in at least a part of second region36b. FIG.12is different fromFIG.11in that, in second region36b,second groove29is formed by removing porous part6b,and porous part6bdoes not exist below second groove29. Meanwhile, the rest of the configuration is the same as inFIG.11, and the description ofFIG.11can be referred to. Solid electrolyte layer9is disposed, at minimum, in at least a part of second region36b.For example, solid electrolyte layer9may enter into at least a part of second groove29. Further, solid electrolyte layer9may be disposed so as to cover at least a part of second groove29. From the viewpoint of enhancing the effect of suppressing entry of air, it is preferable that solid electrolyte layer9enters into the entirety of second groove29(in other words, second groove29is filled with solid electrolyte layer9). InFIGS.11and12, although not shown, second insulating material7may also be disposed in at least a part of second groove29. In this case, the leakage current of the solid electrolytic capacitor can be suppressed even more. FIG.13is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a twelfth exemplary embodiment. InFIG.13, thin part26is formed in separation section16c,and first insulating material13is disposed on a surface of thin part26. In the illustrated example, a groove (third groove39) is formed by removing porous part6bin at least a part of cathode formation section16b.When solid electrolyte layer9is formed so as to enter into third groove39, solid electrolyte layer9is disposed in at least a part of third groove39. Solid electrolyte layer9may enter into at least a part of third groove39, or may be disposed so as to cover at least a part of third groove39. From the viewpoint of enhancing the effect of suppressing entry of air, it is preferable that at least the entire surface of porous part6baround third groove39(in other words, entire inner wall of third groove39) be covered with solid electrolyte layer9. From the same viewpoint, it is more preferable that solid electrolyte layer9enters into the entirety of third groove39(in other words, third groove39is filled with solid electrolyte layer9). Further, by filling third groove39with solid electrolyte layer9, an effective area of solid electrolyte layer9can be increased. The shape of third groove39is not particularly limited, but may be a columnar shape (e.g., cylindrical shape or prismatic shape) or a shape in which the diameter decreases from the surface of porous part6btoward base material part6a(e.g., tapered cross section). In third groove39, it is preferable that solid electrolyte layer9enters into a part having a small diameter as well, and solid electrolyte layer9be disposed therein. From the viewpoint of easily securing a higher effect for suppressing entry of air into capacitor element2, it is preferable that third groove39be formed at a position closer to separation section16cin the length direction of cathode formation section16b.For example, when the length of cathode formation section16bis L, it is preferable to form third groove39in a region ranging from the boundary of separation section16cand cathode formation section16bto a position of length 0.3 L (preferably 0.25 L) from the boundary. Third groove39may be formed in the entire region ranging from the boundary of separation section16cand cathode formation section16bto the position of length 0.3 L (preferably 0.25 L) from this boundary, or may be formed in a part of this region. Third groove39may be formed as a single groove extending over the entire region. In cathode formation section16b,single third groove39may be formed, or a plurality of third grooves39may be formed. The width of third groove39is, for example, equal to or more than 0.01 μm. The width of third groove39may be equal to or more than 0.1 μm, equal to or more than 1 μm, or equal to or more than 5 μm. The width of the third groove39is preferably equal to or less than 0.3 L or equal to or less than 0.25 L, and may be equal to or less than 50 μm or equal to or less than 30 μm. The lower limit value and the upper limit value can be arbitrarily combined. Note that the width of third groove39is a length of third groove39in a direction along the length direction of cathode formation section16b. Although porous part6bdoes not exist below third groove39in the illustrated example, the present invention is not limited to this case, and porous part6bmay be provided below third groove39. From the viewpoint of enhancing the effect of suppressing entry of air, the thickness of porous part6bbelow third groove39is preferably small. For example, when the thickness of porous part6bis T, the depth of third groove39is preferably equal to or more than 0.95 T, and may be equal to or more than 0.98 T. The depth of third groove39is equal to or less than T, for example. From the viewpoint of enhancing the effect of suppressing entry of air even more, it is preferable that porous part6bdo not exist below third groove39. AlthoughFIG.13shows an example in which third groove39is formed at a position away from separation section16c,the present invention is not limited to this case. Third groove39may be formed at a position in cathode formation section16badjacent to separation section16c. In the tenth exemplary embodiment, the eleventh exemplary embodiment, and the twelfth exemplary embodiment, separation section16cdoes not need to include second insulating material7unlike in the fifth to ninth exemplary embodiments. Meanwhile, the present invention is not limited to this case, and separation section16cmay include second insulating material7as shown in the fifth to ninth exemplary embodiments. In FIGS.11to13, the states of second region36band third region36care different from those inFIG.6, but the rest of the configuration is the same as inFIG.6. Hence, the description ofFIGS.1and6can be referred to. In the twelfth exemplary embodiment, second groove29may also be formed, and solid electrolyte layer9may enter into second groove29as in the tenth exemplary embodiment or the eleventh exemplary embodiment. Further, second insulating material7may also be disposed in at least a part of second groove29. Note that in the first to ninth exemplary embodiments, second groove29and/or third groove39may be formed, and solid electrolyte layer9may enter into these grooves as shown in the tenth exemplary embodiment, the eleventh exemplary embodiment, or the twelfth exemplary embodiment. Further, second insulating material7may also be disposed in at least a part of second groove29. FIG.14is a cross-sectional view schematically illustrating capacitor element2included in a solid electrolytic capacitor according to a thirteenth exemplary embodiment. InFIG.14, thin part26is formed in separation section16c,and first insulating material13is disposed on a surface of thin part26. InFIG.14, at least in second region36b,second groove29is formed by removing porous part6b.Second groove29is formed at a position adjacent to first insulating material13(or first region36a). Second groove29is filled with second insulating material7, whereby entry of air is suppressed. In the illustrated example, second groove29is formed so as to straddle second region36band cathode formation section16b.Meanwhile, the present invention is not limited to this case, and there may be a case where second groove29is formed only in second region36b.Further, second groove29may be formed in a part of second region36bor may be formed in the entirety of second region36b. Second insulating material7does not necessarily have to be included so as to fill the entirety of second groove29as shown inFIG.14, and may be disposed in at least a part of second groove29. Second insulating material7may be disposed so as to cover at least a part of second groove29. Alternatively, second groove29may be impregnated with second insulating material7. For example, second insulating material7may be included so as to partially fill second groove29, or second insulating material7may be disposed on at least a part of an inner surface of second groove29. Although porous part6bexists in a part of cathode formation section16badjacent to second groove29, this part may include second insulating material7in an impregnated (or filled) state. Although porous part6bdoes not exist below second groove29inFIG.14, the present invention is not limited to this case, and porous part6bmay be provided below second groove29. In the case where porous part6bis provided below second groove29, porous part6bmay include second insulating material7in an impregnated (or filled) state. From the viewpoint of enhancing the effect of suppressing entry of air, it is preferable that porous part6bdo not exist below second groove29. In the case ofFIG.14, a surface of a recess (neck) may be covered with third insulating material17as the same in the case ofFIG.3. Further, third insulating material17may adhere to at least the periphery of first region36a.Third insulating material17may cover at least a part of at least one of cathode lead-out layer10or solid electrolyte layer9. The position of third insulating material17can be referred to in the description ofFIG.3or4. InFIG.14, the states of second region36band third region36care different from those inFIG.6, but the rest of the configuration is the same as inFIG.6. Hence, the description ofFIGS.1and6can be referred to. Further, inFIG.14, third region36cdoes not need to include second insulating material7unlike in the fifth to ninth exemplary embodiments. Meanwhile, the present invention is not limited to this case, and third region36cmay include second insulating material7as shown in the fifth to ninth exemplary embodiments. In the thirteenth exemplary embodiment, too, second groove29and/or third groove39may be formed, and solid electrolyte layer9may enter into these grooves as shown in the tenth exemplary embodiment, the eleventh exemplary embodiment, or the twelfth exemplary embodiment. Hereinafter, the configuration of the solid electrolytic capacitor will be described in more detail. (Capacitor Element2,102A to102C) Capacitor elements2,102A to102C each include anode foil6, a dielectric layer, and cathode part8. Cathode part8includes solid electrolyte layer9and cathode lead-out layer10covering solid electrolyte layer9. The solid electrolytic capacitor has, at minimum, at least one capacitor element2, and may have a plurality of capacitor elements (capacitor elements102A to102C and the like) as shown inFIG.5. The number of capacitor elements included in the solid electrolytic capacitor may be determined according to the application. (Anode Foil6) Anode foil6can include a valve metal, an alloy including a valve metal, a compound including a valve metal, and the like. These materials can be used singly or in combination of two or more kinds thereof. As the valve metal, for example, aluminum, tantalum, niobium, and titanium are preferably used. Anode foil6including porous part6bon a surface of base material part6ais obtained by roughening a surface of a metal foil including a valve metal by etching, for example. (Dielectric Layer) The dielectric layer is formed by anodizing the valve metal on the surface of anode foil6by anodizing treatment or the like. The dielectric layer is formed, at minimum, so as to cover at least a part of anode foil6. The dielectric layer is usually formed on the surface of anode foil6. Since the dielectric layer is formed on the surface of the porous part of anode foil6, the dielectric layer is formed along the inner wall surface of pores or pits on the surface of anode foil6. The dielectric layer includes an oxide of a valve metal. For example, when tantalum is used as the valve metal, the dielectric layer includes Ta2O5, and when aluminum is used as the valve metal, the dielectric layer includes Al2O3. Note that the dielectric layer is not limited thereto, and any dielectric layer may be used as long as the dielectric layer functions as a dielectric body. When the surface of anode foil6is porous, the dielectric layer is formed along the surface (including inner wall surface of hole) of anode foil6. (First Insulating Material13) As first insulating material13, an insulating resin or the like is used. From the viewpoint of easily disposing on the surface of porous part6bof separation section16c,an insulating tape (resist tape or the like) is preferably used as first insulating material13, but first insulating material is not limited thereto. First insulating material13may be a coating film of a coating agent including first insulating material13. First insulating material13may be a thermoplastic resin (or thermoplastic resin composition), or may be a curable resin (or curable resin composition) or a cured product (including semi-cured product) thereof. The curable resin (or curable resin composition) may be a thermosetting resin or a photocurable resin. Examples of the insulating resin include a curable resin (epoxy resin, polyimide, and the like), a photoresist, and a thermoplastic resin (e.g., polyolefin, polyester, polyamide, thermoplastic polyimide, and the like). The curable resin may be either a thermosetting resin or a photocurable resin. The photocurable resin may be cured by visible light or ultraviolet light. As the insulating resin, a composition of a curable resin may be used. The insulating resin may be used alone, or may be used in combination of two or more kinds thereof. (Second Insulating Material7) As second insulating material7, an insulating resin or the like is used. From the viewpoint of easily securing high permeability or penetrability into porous part6b,first groove19, or second groove29, second insulating material7is preferably a cured product (including semi-cured product) of a curable resin or a composition thereof. The curable resin may be a thermosetting resin or a photocurable resin. Examples of the photocurable resin or the composition thereof include those cured by ultraviolet rays, visible light, or the like. From the viewpoint of easily impregnating or filling first groove19or second groove29, it is preferable to use a photocurable (in particular, ultraviolet curability) resin or a composition thereof. Examples of the curable resin include those described later. The curable resin composition may include, for example, at least one selected from the group consisting of a curing agent, a curing accelerator, a catalyst, and an additive. (Third Insulating Material17) As third insulating material17, an insulating resin or the like is used. Third insulating material17may be a thermoplastic resin, or may be a cured product of a curable resin or a composition thereof. Third insulating material17may be the same as or different from second insulating material7. Examples of the curable resin include those exemplified later for second insulating material7. Examples of the thermoplastic resin include at least one selected from the group consisting of vinyl resin (e.g., vinyl chloride, vinyl acetate, and aromatic vinyl resin), polyolefin (e.g., polyethylene and polypropylene), acrylic resin, polyamide, polycarbonate, thermoplastic polyimide, and polyamideimide. Examples of the aromatic vinyl resin include polystyrene and an acrylonitrile-butadiene-styrene copolymer (ABS resin). (Fourth Insulating Material117) Fourth insulating material117can be selected from those exemplified as third insulating material17, for example. From the viewpoint of easily forming a thin film, fourth insulating material117is preferably a cured product of a curable resin or a composition thereof. The curable resin may be thermosetting or photocurable. Fourth insulating material117may be the same as or different from second insulating material7. Fourth insulating material117may be the same as or different from third insulating material17. (Cathode Part8) (Solid Electrolyte Layer9) Solid electrolyte layer9constituting cathode part8includes a conductive polymer, but may also include a dopant, an additive, or the like as necessary. Examples of the conductive polymer include polypyrrole, polythiophene, polyaniline, and derivatives thereof. Solid electrolyte layer9can be formed by chemical polymerization and/or electrolytic polymerization of a raw material monomer, for example. Alternatively, solid electrolyte layer9can be formed by bringing the dielectric layer into contact with a solution in which the conductive polymer is dissolved or a dispersion liquid in which the conductive polymer is dispersed. Solid electrolyte layer9is formed, at minimum, so as to cover at least a part of the dielectric layer. In the case of electrolytic polymerization, a conductive precoat layer may be formed prior to electrolytic polymerization. Solid electrolyte layer9may be formed directly on the dielectric layer or may be formed with a precoat layer interposed therebetween. (Cathode Lead-Out Layer10) Cathode lead-out layer10constituting cathode part8includes carbon layer11and metal paste layer12. Carbon layer11has, at minimum, conductivity, and can be made of, for example, a conductive carbon material such as graphite. Metal paste layer12may be a silver paste layer. For the silver paste layer, a composition including a silver powder and a binder resin (epoxy resin or the like) can be used, for example. Note that cathode lead-out layer10is not limited to this configuration, and may be configured in any way as long as it has a current collecting function. Cathode lead-out layer10is formed so as to cover at least a part of solid electrolyte layer9. (Exterior Body3) Exterior body3covers a part of capacitor element2and lead terminals4,5. From the viewpoint of suppressing entry of air into exterior body3, it is preferable that capacitor element2and a part of each of lead terminals4,5are sealed with exterior body3. AlthoughFIGS.1and2show the case where exterior body3is a resin exterior body, the present invention is not limited to this case, and exterior body3may be a case or the like capable of housing capacitor element2. The resin exterior body is formed by sealing capacitor element2and a part of each of lead terminals4and5with a resin material. Examples of the case include a combination of a container that houses capacitor element2and a sealing body that covers an opening of the container. The container and the sealing body are formed of a metal material or a resin material, for example. The resin exterior body preferably includes a cured product of a curable resin composition, and may include a thermoplastic resin or a composition including the thermoplastic resin. Examples of the resin material forming the case include a thermoplastic resin or a composition including the thermoplastic resin. Examples of the metal material forming the case include metals such as aluminum, copper, and iron, or alloys thereof (also including stainless steel, brass, and the like). (Lead Terminals4,5) One end of each of lead terminals4,5is electrically connected to capacitor element2, and the other end of lead terminals4,5is drawn out of exterior body3. In solid electrolytic capacitor1, the one end of each of lead terminals4,5is covered with exterior body3together with capacitor element2. A lead terminal usually used in a solid electrolytic capacitor can be used as lead terminals4,5, without particular limitation. And a so-called lead frame, for example, may be used as lead terminals4,5. Examples of the material of lead terminals4,5include a metal such as copper or an alloy thereof. [Method for Manufacturing Solid Electrolytic Capacitor] The solid electrolytic capacitor can be manufactured, for example, by a manufacturing method including: a step (first step) of preparing a capacitor element, a step (second step) of electrically connecting a lead terminal to the capacitor element, and a step (third step) of covering a part of the capacitor element and the lead terminal with an exterior body. Hereinafter, each step will be described in more detail. (First Step) In the first step, capacitor elements2,102A to102C are produced. The first step can include a step of preparing anode foil6, a step of forming a dielectric layer, a step of forming separation section16c,a step of disposing or impregnating with first insulating material13, a step of forming solid electrolyte layer9, and a step of forming cathode lead-out layer10. The first step can include a step of disposing or impregnating at least a part of separation section16cwith the second insulating material. The first step may include a step of covering at least a part of first insulating material13, solid electrolyte layer9, cathode lead-out layer10, or the like with third insulating material17. (Step of Preparing Anode Foil6) Anode foil6can be prepared, for example, by roughening a surface of a metal foil including a valve metal. Porous part6bis formed on a surface of base material part6aby roughening. The roughening may be performed in any way as long as irregularities can be formed on the surface of the base material part. The roughening may be performed by etching (e.g., electrolytic etching) the surface of the metal foil, for example. (Step of Forming Dielectric Layer) In this step, a dielectric layer is formed on anode foil6. The dielectric layer is formed by anodizing anode foil6. The anodization can be performed by a known method such as an anodizing treatment. The anodizing treatment can be performed, for example, by immersing anode foil6in an anodizing solution and applying a voltage between anode foil6as an anode and a cathode immersed in the anodizing solution. As the anodizing solution, for example, a phosphoric acid aqueous solution or the like is preferably used. (Step of Forming Separation Section16c) Anode foil6on which the dielectric layer is formed is defined into anode section16a,cathode formation section16b,and separation section16clocated between anode section16aand cathode formation section16b.Then, at least a part of porous part6bis compressed and/or removed in at least a part of separation section16c.For example, in at least a part of separation section16c,porous part6bmay be compressed or partially removed to form a groove (or thin part26). If necessary, compression and removal may be combined. The compression can be performed by press working or the like. The removal of porous part6bcan be performed by cutting, laser processing, or the like. In a case where first groove19is formed in third region36c,first groove19may be formed in this step. First groove19can be formed by compressing or removing porous part6bin third region36c,as the same in the case of the groove described above. First groove19may be formed continuously with first region36aor may be formed to be apart from first region36a. In a case where second groove29is formed in second region36b,second groove29may be formed in this step. Second groove29can be formed by compressing or removing porous part6bin second region36b,as the same in the case of the groove described above. Second groove29may be formed continuously with first region36aor may be formed apart from first region36a. In a case where third groove39is formed in cathode formation section16b,third groove39may be formed in this step. Third groove39can be formed by compressing or removing porous part6bin cathode formation section16b,as the same in the case of the groove described above. Third groove39may be formed continuously with second region36bor may be formed apart from second region36b. Note that first groove19and second groove29do not necessarily have to be formed in this step, and may be formed after this step and before the step of forming solid electrolyte layer9. Third groove39does not necessarily have to be formed in this step, and may be formed after the step of forming the dielectric layer and before the step of forming solid electrolyte layer9. (Step of Disposing or Impregnating with First Insulating Material13) First insulating material13is disposed in or used to impregnate at least a part of separation section16c.First insulating material13is preferably disposed on a surface of thin part26. For example, first insulating material13may be disposed by attaching an insulating tape (such as resist tape) to a surface of separation section16c,or may be disposed on a surface of porous part6bby coating with a coating agent including first insulating material13. By disposing first insulating material13prior to the step of forming solid electrolyte layer9, it is possible to suppress the creeping of the conductive polymer toward anode section16awhen solid electrolyte layer9is formed. Examples of the first insulating material include an insulating resin. In the solid electrolytic capacitor according to a second aspect of the present disclosure, first insulating material13may be formed by impregnating at least a part of separation section16cwith a coating agent including first insulating material13. Alternatively, first insulating material13may be disposed by attaching an insulating tape to the surface of separation section16c,and at least a part of separation section16cmay be impregnated with a coating agent including first insulating material13. Any of the impregnation with the coating agent and the placement of the insulating tape can be performed first. (Step of Forming Solid Electrolyte Layer9) In this step, solid electrolyte layer9is formed on the dielectric layer. Solid electrolyte layer9is formed, at minimum, so as to cover at least a part of the dielectric layer. Solid electrolyte layer9includes a conductive polymer, but may also include a dopant, an additive, or the like as necessary. As the conductive polymer, for example, polypyrrole, polythiophene (poly (3,4-ethylenedioxythiophene) (PEDOT), and the like), polyaniline, derivatives thereof, and the like are used. As the dopant, for example, paratoluenesulfonic acid, naphthalenesulfonic acid, polystyrenesulfonic acid (PSS), or the like is used. Solid electrolyte layer9can be formed by chemical polymerization and/or electrolytic polymerization of a raw material monomer, for example. Alternatively, the solid electrolyte layer9can be formed by bringing the dielectric layer into contact with a solution in which the conductive polymer is dissolved or a solution or dispersion liquid in which the conductive polymer is dissolved or dispersed in a liquid medium (solvent or the like). Examples of the liquid medium include water, an organic solvent, and a mixture thereof. In particular, at the outer surface (the surface opposite to dielectric layer) of the solid electrolyte layer, the electrolytic polymerization easily proceeds and thus solid electrolyte layer9tends to be densely formed. On the other hand, at the inside surface of the solid electrolyte layer, the electrolytic polymerization hardly proceeds, and thus voids in the solid electrolyte layer tend to be generated. Hence, air easily enters capacitor element2through the voids. From this, the effect of filling porous part6bwith the second insulating material is remarkably exhibited particularly when solid electrolyte layer9is formed by electrolytic polymerization. Note that in the case of electrolytic polymerization, a precoat layer may be formed on the dielectric layer prior to electrolytic polymerization. The precoat layer is made of a conductive material (conductive polymer, inorganic conductive material, and the like), for example. The conductive material constituting the precoat layer is not particularly limited, and a known material can be used, for example. When solid electrolyte layer9is disposed in at least a part (e.g., at least a part of second groove29) of second region36bin separation section16c,solid electrolyte layer9can be formed in second region36bby, for example, performing chemical polymerization or electrolytic polymerization while second region36bis in contact with a polymerization liquid, or bringing a solution or dispersion liquid containing a conductive polymer into contact with second region36b. When solid electrolyte layer9is disposed in at least a part of third groove39, solid electrolyte layer9can be formed in third groove39by, for example, performing chemical polymerization or electrolytic polymerization while third groove39is in contact with a polymerization liquid, or bringing a solution or dispersion liquid containing a conductive polymer into contact with third groove39. (Step of Forming Cathode Lead-Out Layer10) In this step, carbon layer11and metal paste layer12are sequentially laminated on solid electrolyte layer9to form cathode lead-out layer10. Note that as shown inFIG.5, when a plurality of capacitor elements are laminated, a laminated body of the capacitor elements may be prepared in the first step by producing each capacitor element as described above and then laminating the plurality of capacitor elements. (Step of Disposing or Impregnating with Second Insulating Material) The second insulating material may be disposed in or used to impregnate at least a part of separation section16c.When second groove29is provided so as to straddle separation section16cand cathode formation section16b,second groove29may be impregnated with second insulating material7. In this case, second insulating material7is included not only in a part of separation section16cbut also in a part of cathode formation section16b. The method for manufacturing a solid electrolytic capacitor according to a first aspect of the present disclosure can include a step of impregnating porous part6bof at least first region36awith the second insulating material. Porous part6bof at least first region36amay be impregnated (or filled) with the second insulating material. Porous part6bof at least first region36ais filled with the second insulating material by impregnating the periphery of first insulating material13with the second insulating material. At this time, porous part6bof at least one of second region36bat a side close to cathode formation section16bor third region36cat a side close to anode section16amay be impregnated (or filled) with the second insulating material. Further, as in the case ofFIG.4, metal paste layer12may be impregnated with the second insulating material. When manufacturing the solid electrolytic capacitor according to the second aspect of the present disclosure, second insulating material7may be disposed in or used to impregnate at least a part of a region located closer to anode section16athan first insulating material13(i.e., third region36c) in separation section16c.For example, first groove19may be formed in at least a part of third region36c,and second insulating material7may be disposed in at least a part of first groove19. At this time, second insulating material7may be disposed so as to cover at least a part of first groove19. Alternatively, porous part6bin at least a part of third region36cmay be impregnated with second insulating material7. These configurations may be combined. Second insulating material7may be disposed in or used to impregnate at least third region36c.First groove19is preferably impregnated or filled with second insulating material7. First region36aand/or second region36bat a side close to cathode formation section16bmay be impregnated or filled with second insulating material7. For example, first region36amay be filled with second insulating material7by impregnating the periphery of first insulating material13with second insulating material7. Porous part6blocated closer to anode section16athan third region36cmay be impregnated or filled with second insulating material7. When manufacturing the solid electrolytic capacitor according to a fifth aspect of the present disclosure, second insulating material7is disposed in at least a part of second groove29formed to be adjacent to first insulating material13(or first region36a) at a side close to cathode formation section16bin separation section16c.At least a part of second groove29may be covered with second insulating material7. Second groove29may be impregnated or filled with second insulating material7. By impregnating second groove29with the second insulating material, at least a part of cathode formation section16blocated adjacent to second groove29may be impregnated or filled with the second insulating material. The step of impregnating with second insulating material7may be performed after the step of forming cathode lead-out layer10. Metal paste layer12may be impregnated with second insulating material7. Note that when the step of impregnating with second insulating material7is performed after the step of forming cathode lead-out layer10, second insulating material7may be disposed so as to cover at least a part of solid electrolyte layer9or cathode lead-out layer10. Second insulating material7may be disposed so as to cover at least a part of a surface of a recess (neck) between cathode part8and separation section16c(or first insulating material13). Second insulating material7disposed so as to cover at least a part of solid electrolyte layer9, cathode lead-out layer10, the neck, and the like corresponds to third insulating material17inFIG.3or4. Third insulating material17disposed in this manner is the same material as second insulating material7. The second insulating material can be supplied to the surfaces of first region36a,second region36b,third region36c,porous part6b,and capacitor element2by a known coating method. The second insulating material is supplied by using, for example, a coating method or a dispensing method using various coaters or dispenses, immersion, transfer (roller transfer or the like), or the like. From the viewpoint of easily impregnating first groove19, second groove29, or porous part6bwith the second insulating material, it is preferable to use a curable resin (or a composition thereof) as the second insulating material. The curable resin may be a photocurable resin or a thermosetting resin. Examples of the curable resin include, but are not limited to, epoxy resin, phenol resin, unsaturated polyester resin, thermosetting polyurethane resin, and thermosetting polyimide. The curable resins may be used alone, or may be used in combination of two or more kinds thereof. The curable resin may be a one-component curable resin or a two-component curable resin. The curable resin composition may include, for example, at least one selected from the group consisting of a curing agent, a curing accelerator, a catalyst, and an additive. From the viewpoint of easily impregnating first groove19, second groove29, or porous part6bwith the second insulating material, the curable resin (or composition) supplied to porous part6bpreferably has a low viscosity. The viscosity of the curable resin (or composition) at 25° C. is equal to or less than 300 mPa·s, and more preferably equal to or less than 100 mPa·s, for example. Note that the viscosity of the curable resin (or composition) can be measured under the condition of a rotation speed of 60 rpm using a cone-plate viscometer. Since it is preferable that the thermosetting resin (or composition) have a low viscosity, the thermosetting resin (or composition) may include a solvent. From the viewpoint of easily and efficiently filling many voids included in first groove19, second groove29, or porous part6bwith the second insulating material, a solvent-free curable resin (or composition) is preferably used. The curable resin includes, for example, a polyfunctional compound having two or more polymerizable functional groups involved in the curing reaction and/or a monofunctional compound having one polymerizable functional group. From the viewpoint of lowering the viscosity of the curable resin (or composition), the curable resin (or composition) preferably includes at least a monofunctional compound. The curable resin may include a monofunctional compound and a polyfunctional compound. In the case of epoxy resin, for example, a monofunctional glycidyl compound (glycidyl ether of monohydroxy compound, glycidyl amine, and the like) and a polyfunctional glycidyl compound (polyglycidyl ether of polyhydroxy compound, polyglycidyl amine, and the like) may be combined. The polyfunctional compound may have, for example, 2 to 4 or 2 or 3 polymerizable functional groups. The proportion of the monofunctional compound in the curable resin is, for example, preferably equal to or more than 50 mass %, and may be equal to or more than 70 mass %. When the proportion of the monofunctional compound is in such a range, the viscosity of the curable resin (or composition) can be lowered even if the content of the solvent is low (in particular, even when solvent-free curable resin (or composition) is used). The proportion of the monofunctional compound in the curable resin is, for example, equal to or less than 90 mass %, and may be equal to or less than 85 mass %. The lower limit value and the upper limit value can be arbitrarily combined. The curable resin composition preferably includes a curing agent. The curing agent is selected according to the type of the curable resin. For example, in the case of epoxy resin, examples of the curing agent include at least one selected from the group consisting of an amine compound, an acid anhydride, a phenol compound, a polymerized catalyst, and a latent curing agent. The curing agent may be combined with a curing accelerator. The curing accelerator is selected according to the type of the curable resin. Examples of the curing accelerator include tertiary amines or salts thereof, imidazole, phosphine, phosphonium salts, and sulfonium salts. The thermosetting resin (or composition) that has been supplied to the surface of capacitor element2or the second insulating material that has filled first groove19, second groove29, or porous part6bmay be cured in at least one of this step or the subsequent step, as necessary. (Step of Covering Solid Electrolyte Layer9, Cathode Lead-Out Layer10or Other Parts with Third Insulating Material) The first step may include a step of covering, with third insulating material17, at least a part of at least one selected from the group consisting of the first insulating material, solid electrolyte layer9, cathode lead-out layer10, and the neck. Third insulating material17may be the same as or different from the second insulating material. This step may be performed after the step of forming cathode lead-out layer10. By coating, with a coating agent including third insulating material17, at least a part of a surface of at least one selected from the group consisting of the first insulating material, solid electrolyte layer9, cathode lead-out layer10, and the neck, the surface can be covered with the third insulating material. Third insulating material17is supplied to the surface using, for example, a coating method or a dispensing method using various coaters or dispenses, immersion, transfer (roller transfer, or the like), or the like. The curable resin (or curable resin composition) disposed on the surface by coating or the like may be cured in at least one of this step or the subsequent step, as necessary. (Step of Covering a Part of Laminated Body with Fourth Insulating Material117) As shown inFIG.5, when a plurality of capacitor elements are laminated, the first step may further include a step of covering at least a part of a surface of the laminated body with fourth insulating material117. In this case, fourth insulating material117may be the same as or different from second insulating material7. Further, fourth insulating material117may be the same as or different from third insulating material17. For example, as in the case of third insulating material17, a coating agent including fourth insulating material117is coated on at least a part of the surface of the laminated body, whereby a film of fourth insulating material117is formed on the surface of the laminated body. The curable resin (or curable resin composition) disposed so as to cover at least a part of the surface of the laminated body by coating or the like may be cured in at least one of this step or the subsequent step, as necessary. (Second Step) In the second step, each of anode lead terminal4and cathode lead terminal5is electrically connected to capacitor elements2,102A to102C. The lead terminals may be connected after the capacitor element is produced in the first step. While cathode lead terminal5is connected to the capacitor element after the capacitor element is produced, anode lead terminal4may be connected to anode foil6at an appropriate stage in the step of producing the capacitor element. When a laminated body of a plurality of capacitor elements is used, anode lead terminal4can be connected to anode foil6in the same manner as described above. Cathode lead terminal5may be connected to a capacitor element in the same manner as described above, or one end of cathode lead terminal5may be connected to a laminated body of a plurality of capacitor elements in which cathode parts8are electrically connected to each other. (Third Step) In the third step, capacitor elements2,102A to102C and a part of each of lead terminals4,5are covered with exterior body3, so that the capacitor elements are sealed with exterior body3. The sealing can be performed according to the type of exterior body3. For example, when a case-shaped exterior body including a container and a sealing body is used, a capacitor element is housed in the container, and an opening of the container can be covered and sealed with a sealing body in a state where the other end of a lead terminal connected to the capacitor element is drawn out from a through hole formed in the sealing body. When the resin exterior body is adopted, capacitor element2and lead terminals4,5are electrically connected to each other, and then capacitor element2and a part of each of lead terminals4,5are covered with a resin forming the resin exterior body to be sealed. The resin exterior body can be formed by using a molding technique such as injection molding, insert molding, or compression molding. EXAMPLES Hereinafter, the present disclosure will be specifically described based on examples and comparative examples, but the present disclosure is not limited to the following examples. Example 1 Solid electrolytic capacitor A1 including a laminated body in which seven capacitor elements2shown inFIG.2were laminated was produced in the following manner. (1) Production of Capacitor Element2 An aluminum foil (thickness of 100 μm) was prepared as a base material, and a surface of the aluminum foil was subjected to an etching treatment to obtain anode foil6including porous part6b.Anode foil6was immersed in a phosphoric acid solution (liquid temperature of 70° C.) having a concentration of 0.3 mass %, and a direct-current voltage of 70 V was applied for 20 minutes to form a dielectric layer including aluminum oxide (Al2O3) on a surface of anode foil6. Anode foil6was defined into anode section16a,cathode formation section16b,and separation section16ctherebetween, and a part of separation section16cwas compressed by press working to form thin part26. Insulating resist tape (first insulating material)13was attached to thin part26. Anode foil6on which the dielectric layer was formed was immersed in a liquid composition including a conductive material to form a precoat layer. A polymerization liquid containing pyrrole (monomer of conductive polymer), naphthalenesulfonic acid (dopant), and water was prepared. Anode foil6on which the dielectric layer and the precoat layer were formed was immersed in the obtained polymerization liquid, and electropolymerization was performed at an applied voltage of 3 V to form solid electrolyte layer9. A dispersion liquid in which graphite particles were dispersed in water was applied to solid electrolyte layer9, and then solid electrolyte layer9was dried to form carbon layer11on a surface of solid electrolyte layer9. Then, a silver paste containing silver particles and a binder resin (epoxy resin) was applied onto a surface of carbon layer11, and then the binder resin was cured by heating to form metal paste layer (silver paste layer)12. Cathode lead-out layer10composed of carbon layer11and metal paste layer12was thus formed. Cathode part8formed of solid electrolyte layer9and cathode lead-out layer10was thus formed. Then, a two-component curable epoxy resin (solvent-free type, viscosity (25° C.): 100 mPa·s) was supplied around the resist tape by roller transfer to impregnate porous part6bof anode foil6with the epoxy resin. As a result, porous part6b(porous part6bof second region36band third region36c) around the resist tape and the region of porous part6bof first region36acovered with the resist tape were impregnated with the epoxy resin. Then, the impregnated epoxy resin was cured. In this way, capacitor element2was formed. Note that as the epoxy resin, liquid A composed of 4-tert butyl phenyl glycidyl ether: bisphenol F type epoxy resin (mass ratio)=75:25 and liquid B containing an acid anhydride curing agent and an imidazole curing accelerator were mixed and used. (2) Assembly of Solid Electrolytic Capacitor1 Anode lead terminal4, cathode lead terminal5, and adhesive layer14were also disposed on capacitor element2obtained in (1). Exterior body3was formed by sealing, with a resin, a laminated body in which seven such capacitor elements2were laminated, thereby completing solid electrolytic capacitor A1. Example 2 Solid electrolytic capacitor A2 including a laminated body in which seven capacitor elements2shown inFIG.4were laminated was produced. After cathode lead-out layer10was formed, capacitor element2was immersed in the same epoxy resin as the epoxy resin used in Example 1 up to the periphery of the resist tape (first insulating material13) at a side close to anode section16a,was taken out, and then the epoxy resin was cured. Other than this, solid electrolytic capacitor1was completed in the same manner as in Example 1. In Example 2, porous part6b(porous part6bof second region36band third region36c) around the resist tape and the region of porous part6bof first region36acovered with the resist tape are impregnated with the epoxy resin. Further, a surface of the solid electrolyte layer or the first insulating material between the first insulating material and the end of cathode lead-out layer10at a side close to the anode section is covered with the epoxy resin. Metal paste layer12is also impregnated with the epoxy resin. Comparative Example 1 A solid electrolytic capacitor R1 was produced in the same manner as in Example 1 except that the epoxy resin was not supplied to the periphery of the resist tape or a surface of the capacitor element. [Evaluation] For the solid electrolytic capacitors of Examples 1 and 2 and Comparative Example 1 produced above, the change rates in capacitance, ESR, and dielectric loss tangent tan δ were evaluated in the following procedure. Under an environment of 20° C., an initial capacitance value C0 (μF), an initial ESR value X0 (mΩ) at a frequency of 100 kHz and an initial dielectric loss tangent tan δ0 at 120 kHz with respect to the solid electrolytic capacitor were measured using an LCR meter for 4-terminal measurement. Next, a rated voltage was applied to the solid electrolytic capacitor at a temperature of 145° C. for 1000 hours (heat resistance test). Thereafter, a capacitance value C1 (μF), an ESR value X1 (mΩ), and a dielectric loss tangent tan δ1 were measured in the same manner as described above. Then, a value obtained by subtracting the initial capacitance value C0 from the capacitance value C1 was divided by the initial capacitance value Cand multiplied by 100 to obtain a change rate (%) of the capacitance. Further, a value obtained by subtracting the initial ESR value X0 from the ESR value X1 was divided by the ESR value X0 and multiplied by 100 to obtain a change rate (%) of the ESR. Further, a value obtained by subtracting the initial dielectric loss tangent tan δ0 from the dielectric loss tangent tan δ1 was divided by the dielectric loss tangent tan δ0 and multiplied by 100 to obtain a change rate (%) of the dielectric loss tangent tan δ. The results are shown in Table 1. TABLE 1Change rate ofChange rate ofChange rate ofcapacitance (%)ESR (%)tanδ (%)A1−12.655.412.6A2−5.636.348.6R1−38.24484.31505.6 In Examples 1 and 2, the change rate in each of capacitance, ESR, and tan δ was smaller than that in Comparative Example 1. In Examples 1 and 2, it is considered that by impregnating porous part6bof first region36aand other parts with the second insulating material (epoxy resin), the contact of air with solid electrolyte layer9was suppressed, and the deterioration of the conductive polymer was suppressed, so that heat resistance of the solid electrolytic capacitor was improved. Example 3 A solid electrolytic capacitor including a laminated body in which seven capacitor elements2shown inFIG.6were laminated was produced in the following manner. In step (1) of Example 1, insulating resist tape (first insulating material)13was attached to a part of thin part26at a side close to cathode formation section16b.Thus, first groove19is formed by thin part26and the resist tape in a region located closer to anode section16athan the resist tape. Then, a two-component curable epoxy resin (solvent-free type, viscosity (25° C.): 100 mPa·s) was supplied to first groove19by roller transfer to impregnate porous part6bof anode foil6with the epoxy resin. As a result, first groove19was impregnated with the epoxy resin, and porous part6baround first groove19(porous part6bof third region36c,part of porous part6bof first region36a,and porous part6bat a side close to anode section16aadjacent to third region36c) was impregnated with the epoxy resin. Then, the impregnated epoxy resin was cured. Other than these, a solid electrolytic capacitor (electrolytic capacitor A3) was produced in the same manner as in Example 1. Comparative Example 2 A solid electrolytic capacitor (solid electrolytic capacitor R2) was produced in the same manner as in Example 3 except that the epoxy resin was not supplied to the periphery of the resist tape or a surface of the capacitor element. Example 4 A solid electrolytic capacitor including a laminated body in which seven capacitor elements 2 shown inFIG.12were laminated was produced in the following manner. In step (1) of Example 3, a part (second region36b) of cathode formation section16bin thin part26was laser-etched to form second groove29. A resist tape was attached to the entire surface of thin part26. Further, no epoxy resin was supplied around the resist tape or to the surface of the capacitor element. Other than these, a solid electrolytic capacitor (solid electrolytic capacitor A4) was produced in the same manner as in Example 3. Examples 3 and 4 and Comparative Example 2 were evaluated in the same manner as in Example 1. The results are shown in Table 2. TABLE 2Change rate ofChange rate ofChange rate ofcapacitance (%)ESR (%)tanδ (%)A3−1.268016A4−1.360019R2−6.6800320 In Examples 3 and 4, the change rate in each of capacitance, ESR, and tan δ was smaller than that in Comparative Example 2. In Example 3, it is considered that by impregnating third region36cwith the second insulating material (epoxy resin), the contact of air with solid electrolyte layer9was suppressed, and the deterioration of the conductive polymer was suppressed, so that heat resistance of the solid electrolytic capacitor was improved. Further, in Example 4, it is considered that since the conductive polymer was disposed in second groove29, air hardly entered second region36b,and deterioration of the conductive polymer in solid electrolyte layer9at a side close to cathode formation section16bwas suppressed. Although the present invention has been described in terms of presently preferred exemplary embodiments, such disclosure should not be construed in a limiting manner. Various modifications and alterations will undoubtedly become apparent to those skilled in the art to which the present invention belongs upon reading the above disclosure. Accordingly, the appended claims are to be construed to cover all modifications and alterations without departing from the true spirit and scope of the present invention. In the solid electrolytic capacitor according to the present disclosure, deterioration of the conductive polymer included in the solid electrolyte layer is suppressed even when the solid electrolytic capacitor is exposed to a high-temperature atmosphere, and a decrease in capacitance can be suppressed. It is also possible to suppress an increase in ESR and an increase in tan δ. Hence, the electrolytic capacitor can be used in various applications such as applications requiring low ESR and high capacitance of the solid electrolytic capacitor, and applications exposed to heat. These applications are merely examples, and the present invention is not limited thereto. | 85,674 |
11862407 | LIST OF REFERENCE NUMERALS 1—back electrode;2—hole transport layer;3—perovskite layer;4—electron transport layer;5—transparent conductive electrode;6—glass DETAILED DESCRIPTION OF EMBODIMENTS Hereafter, embodiments of a method for preparing a perovskite film, and a related perovskite film, solar cell and solar cell device of the present application are specifically disclosed in the detailed description with reference to the accompanying drawings as appropriate. However, unnecessary detailed illustrations may be omitted in some instances. For example, there are situations where detailed description of well known items and repeated description of actually identical structures are omitted. This is to prevent the following description from being unnecessarily verbose, and facilitates understanding by those skilled in the art. Moreover, the accompanying drawings and the descriptions below are provided for enabling those skilled in the art to fully understand the present application, rather than limiting the subject matter disclosed in claims. “Ranges” disclosed in the present application are defined in the form of lower and upper limits, and a given range is defined by selection of a lower limit and an upper limit, the selected lower and upper limits defining the boundaries of the particular range. Ranges defined in this manner may be inclusive or exclusive, and may be arbitrarily combined, that is, any lower limit may be combined with any upper limit to form a range. For example, if the ranges of 60-120 and 80-110 are listed for a particular parameter, it should be understood that the ranges of 60-110 and 80-120 are also contemplated. Additionally, if minimum range values 1 and 2 are listed, and maximum range values 3, 4, and 5 are listed, the following ranges are all contemplated: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5. In the present application, unless stated otherwise, the numerical range “a-b” denotes an abbreviated representation of any combination of real numbers between a and b, where both a and b are real numbers. For example, the numerical range “0-5” means that all real numbers between “0-5” have been listed herein, and “0-5” is just an abbreviated representation of combinations of these numerical values. In addition, when a parameter is expressed as an integer of ≥2, it is equivalent to disclosing that the parameter is, for example, an integer of 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, and the like. All the implementations and optional implementations of the present application can be combined with one another to form new technical solutions, unless otherwise stated. All technical features and optional technical features of the present application can be combined with one another to form a new technical solution, unless otherwise stated. Unless otherwise stated, all the steps of the present application can be performed sequentially or randomly, preferably sequentially. For example, the method including steps (a) and (b) indicates that the method may include steps (a) and (b) performed sequentially, and may also include steps (b) and (a) performed sequentially. For example, reference to “the method may further include step (c)” indicates that step (c) may be added to the method in any order, e.g., the method may include steps (a), (b) and (c), steps (a), (c) and (b), and also steps (c), (a) and (b), etc. The terms “comprise” and “include” mentioned in the present application are open-ended or closed-ended, unless otherwise stated. For example, “comprise” and “include” may mean that other components not listed may further be comprised or included, or only the listed components may be comprised or included. The term “not less than” and “not more than” used in the present application includes the number itself. For example, “not less than one” means one or more, and “at least one of A and B” means “A”, “B” or “A and B”. In the present application, the term “or” is inclusive unless otherwise specified. For example, the phrase “A or B” means “A, B, or both A and B”. More specifically, a condition “A or B” is satisfied by any one of the following: A is true (or present) and B is false (or not present); A is false (or not present) and B is true (or present); or both A and B are true (or present). The inventors of the present application have found in practical operations that: in a solar cell using a perovskite film, in order to improve the conversion efficiency of the solar cell, different solar cells require perovskite films with different parameters, such as a band gap width. However, the preparation methods for the perovskite film in the prior art are of poor controllability in term of process conditions, and difficult to meet the needs of different working conditions. In the actual production, this deficiency, for one thing, results in the increase of the preparation costs of the perovskite films, and for another, may cause the resulting product to be poor in quality, which in turn leads to a solar cell with low conversion efficiency. For example, the solution-chemical method for preparing the perovskite films not only involves the use of a toxic solvent, but is difficult to control the formation uniformity of large-area films, which greatly limits the actual application of the perovskite solar cell in the industry. After a lot of research, the inventors have found a novel method for preparing the perovskite film, and the preparation method has significantly improved process stability and controllability compared to the prior art. In addition, the inventors further improve the processing steps and corresponding process parameters, which significantly enhances the uniformity of the obtained film layer and improves the properties of the film layer, such that the solar cell comprising the resulting film layer has a higher conversion efficiency. [Preparation Method for Perovskite Film] In a first aspect, the present application provides a method for preparing a perovskite film, including the steps of(1) providing a target material comprising the following elements: lead, a halogen, and one or more alkali metals;(2) sputtering using the target material in step (1), where a process gas is a noble gas, optionally, argon, so as to obtain a film; (3) subjecting the film obtained in step (2) to a chemical bath treatment, wherein the chemical bath is a solution of AX, A is selected from one or more of formamidine or methylamine, and X is a halogen; and(4) sputtering on the film obtained in step (3) using a tin metal, where a process gas is a noble gas, optionally, a mixture of argon and a halogen gas, so as to obtain the perovskite film. The above preparation method for the perovskite film combines different processing steps flexibly, and thus allows various process parameters to be adjusted in a relatively wide range, such that the process stability and controllability are significantly improved compared to the prior art. In addition, the inventors have found in the further research that, the adjustment of various process parameters of the preparation method can further enhance the uniformity of the obtained film and improve the quality of the film formation, such that the solar cell comprising the resulting film layer has a higher conversion efficiency. In some embodiments, optionally, the target material in step (1) comprises 10-40% of an alkali metal, 10-40% of lead and 50-90% of halogen, with a total of 100%, based on the total moles of various elements in the target material. Although the mechanism is still unclear, the inventors have found in the research that when the contents of the elements, especially the alkali metal and lead, are within the above ranges, the perovskite film prepared by the method of the present application with the target material has more uniform film formation, and the finally manufactured solar cell has a higher conversion efficiency. In some embodiments, optionally, in step (1), the halogen is one or more of chlorine, bromine or iodine, and the alkali metal is one or more of potassium, rubidium or cesium. In the present application, a preliminary sputtering is performed in step (2) to obtain a film layer. It should be noted that the present application has no special requirement for the equipment for the sputtering step, and any equipment commonly used in the art can be used. For example, step (2) may be performed in magnetron sputtering equipment. In addition, for the sputtering using the target, some kind of substrates may be used generally, and the film formed on the surface of the substrate is the film described in step (2) of the present application. Herein, the selection of the substrate is not particularly limited. For example, the substrate may be a substrate commonly used in the art, such as a ceramic, a glass, tin dioxide, doped tin dioxide, etc. In the method of the present application, the temperature for step (2) is not specially required, for example, the step may be performed at room temperature. However, a person skilled in the art understands that, the temperature should not be too low to avoid a too low sputtering rate. In some embodiments, optionally, a noble gas, optionally argon, is used in step (2) as the process gas. The presence of the process gas is beneficial for improving the uniformity of the resulting perovskite film. In some embodiments, optionally, the flow rate of the process gas in (2) is 100-500 sccm, optionally, 150-300 sccm. In some embodiments, optionally, when step (2) is performed in magnetron sputtering equipment, the corresponding power of the magnetron sputtering equipment is 100 W-20 kW, optionally, 500 w-5 kw. In some embodiments, optionally, step (2) is performed with a chamber pressure in the equipment of 0-200 Pa, excluding 0 Pa. In some embodiments, optionally, the sputtering thickness in step (2) is 10-300 nm. In the method of the present application, the film layer obtained in step (2) is subjected to a chemical bath treatment, which can introduce organic ions, for example, methylamine ions (CH3NH3+, MA+) or formamidine ions (FA+), into the film layer, so as to improve the quality of the film layer, such that the conversion efficiency of the corresponding solar cell is further improved. In some embodiments, optionally, the solution of AX in step (3) has a concentration of 10-100 mg/ml, optionally, 20-70 mg/ml. When the concentration of the solution of AX is lower than the above ranges, the performance of the film layer is not obviously improved by the chemical bath treatment, and the conversion efficiency of the corresponding solar cell is relatively low. When the concentration of the solution of AX is too high, this may lead to the introduction of too many methylamine ions or formamidine ions, which will damage the quality of the film layer. Optionally, when the concentration of the solution of AX is 10-100 mg/ml, optionally, 20-70 mg/ml, the improvement in film layer quality is better. In some embodiments, optionally, the solvent in the solution of AX is a solvent commonly used in the art, for example, one or more of an aromatic compound, such as xylene, toluene, or alkylnaphthalene; a chlorinated aromatic hydrocarbon or a chlorinated aliphatic hydrocarbon, such as chlorobenzene, vinyl chloride, or dichloromethane; an alcohol, such as butanol, iso-propyl alcohol, or ethylene glycol; and an ether or an ester; a ketone, such as acetone, methyl ethyl ketone, methyl iso-butyl ketone or cyclohexanone; a strong polar solvent, such as dimethylformamide and dimethyl sulfoxide, as well as water. Optionally, the solvent is one or more of iso-propyl alcohol or chlorobenzene. In some embodiments, optionally, the chemical bath treatment in step (3) is carried out at a temperature of 40° C.-120° C., optionally 50° C.-80° C. A suitable temperature for the chemical bath treatment is beneficial for accelerating the permeation and migration of the doped ions towards the film layer, so as to improve the quality of the film layer. When the temperature for the chemical bath treatment is too low, for example, lower than room temperature, the chemical bath treatment is performed slowly. When the chemical bath treatment is carried out at a temperature higher than 150° C., it may deteriorate the film layer, worsen the properties of the film layer, and then result in a significantly reduction in conversion efficiency of the solar cell. The method of the present application further includes a step (4) of post-treating the film layer obtained by the chemical bath treatment. Different from step (2), the sputtering treatment in step (4), for one thing, can improve the film layer in term of the quality defects thereof caused by, for example, possible inappropriate operations in the preceding processing steps, and for another, can introduce metal tin, halogens, etc., to further improve the quality of the film layer, such that the prepared perovskite film can have an uniform film formation thickness, an excellent film quality, so as to improve the conversion efficiency of the corresponding solar cell. In some embodiments, optionally, in the step (4), the volume ratio of the noble gas, optionally argon, to a halogen gas is 10:1 to 5:1. In the present application, the noble gas, optionally argon, for one thing, functions for protection to avoid damage to equipment or safety accidents due to high temperature, and for another, it can be used to generate ions by bombardment, for example, the bombardment of the target material or the halogen gas, so as to dope the film layer to improve the quality of the film layer. Optionally, in the present application, in a case where the total amount of the mixed gas of the noble gas (optionally, argon) and the halogen gas remains the same, the adjustment of the volume ratio of the two gases is beneficial for improving the quality of the film layer. In particular, when the volume ratio of the noble gas, optionally argon, to a halogen gas is 10:1 to 5:1, the quality of the film layer is more significantly improved. In some embodiments, optionally, the halogen gas in step (4) includes one or more of iodine vapor, bromine vapor or chlorine vapor. In some embodiments, optionally, the halogen gas in step (4) is a mixture of bromine vapor and iodine vapor, where the bromine vapor and the iodine vapor are in a volume ratio of 1:3 to 3:1. In some embodiments, optionally, the flow rate of the process gas in step (4) is 100-500 sccm, optionally, 150-300 sccm. In some embodiments, optionally, step (4) is carried out at a temperature of 50° C.-250° C., optionally 100° C.-200° C. When step (4) is carried out within the above temperature ranges, for one thing, the corresponding sputtering reaction rate is relatively fast, which is beneficial for improving the equipment efficiency, and for another, a high temperature facilitates to accelerate the ion migration, thus accelerating the annealing treatment to the overall film layer. In addition, suitable operation temperature also helps to avoid coagulation and the deterioration of the film layer performance, so as to avoid worsening the conversion efficiency of the solar cell. In some embodiments, optionally, when step (4) is performed in magnetron sputtering equipment, the corresponding power of the magnetron sputtering equipment is 600 W-5 kW. In some embodiments, optionally, the step (4) is performed with a chamber pressure in the equipment is 0-200 Pa, excluding 0 Pa. In some embodiments, optionally, the sputtering thickness in step (4) is 120-200 nm, optionally, 150-170 nm. [Perovskite Film] In a second aspect, the present application provides a perovskite film, which can be prepared by the method of the first aspect of the present application. In some embodiments, optionally, the perovskite film has a thickness of 200-500 nm, optionally 400-500 nm, more optionally 450-470 nm. It should be noted that, in the present application, “the thickness of the perovskite film” refers to the corresponding thickness of the film obtained after all steps (1)-(4) are performed. In some embodiments, optionally, the perovskite film has a perovskite layer band gap of 1.2-1.6 eV, optionally 1.4-1.5 eV. [Solar Cell] In a third aspect, the present application provides a solar cell comprising the following components provided successively from bottom to top:a transparent conductive electrode;a hole transport layer;a perovskite layer;an electron transport layer; anda back electrode;wherein the hole transport layer and the electron transport layer may be positioned interchangeably, and the perovskite layer is a perovskite film prepared by the method of the first aspect of the present application or the perovskite film of the second aspect of the present application. In some embodiments, optionally, the transparent conductive electrode is selected from one or more of indium tin oxide, or fluorine-doped tin dioxide. In some embodiments, optionally, the hole transport layer is selected from one or more of poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), polytriarylamine (PTAA), CuSCN, NiOx, CuT, or MoOx. In some embodiments, optionally, the electron transport layer is selected from one or more of 2,2′,7,7′-tetrakis[N,N-di(4-methoxyphenyl)amino]-9,9′-spirobifluorene (spiro-OMeTAD), WO3, polyethyleneimine ethoxylated (PETE), polyethyleneimine (PEI), ZnO, TiO2, [6,6]-phenyl-C61-butyric acid isomethyl ester (PCBM), SnO2, or fluorine-doped SnO2. In some embodiments, optionally, the back electrode is selected from one or more of indium tin oxide, tungsten-doped indium oxide, aluminum-doped zinc oxide (AZO), Au, Ag, Cu, Al, Ni, Cr, Bi, Pt, or Mg. In some embodiments, optionally, the solar cell of the present application can be prepared by a method commonly used in the art. For example, the transparent conductive electrode, the hole transport layer, the perovskite layer, the electron transport layer, and the back electrode layer may be successively stacked, wound and pressed, wherein the hole transport layer and the electron transport layer may be positioned interchangeably. [Solar Cell Device] Perovskite films are widely used in the field of functional materials, especially in optoelectronics. As an example, the present application studies the use of the perovskite film prepared by the method of the present application in the field of solar cells. It should be understood that, the example provided by the present application is merely for explaining the use of the perovskite film prepared by the method of the present application, and a person skilled in the art would understand that the use of the perovskite film is not limited to the exemplary use as provided. In a fourth aspect, the present application provides a solar cell device, comprising one or more of the perovskite films prepared by the method of the first aspect of the present application, the perovskite film of the second aspect of the present application, or the solar cell of the third aspect of the present application. EXAMPLES Hereinafter, the examples of the present application will be explained. The examples described below are exemplary and are merely for explaining the present application, and should not be construed as limiting the present application. The techniques or conditions that are not specified in examples are according to the techniques or conditions described in documents in the art or the product introduction. The reagents or instruments used, if they are not marked with the manufacturer, are common products that are commercially available. The sources of the raw materials used in examples are shown in the table as below: ChemicalNameformulaManufacturerSpecificationFluorine-—Huaian YaokeA fluorinedoped tinOptoelectronic Co.,doping amountdioxideLtd.of 10%, based(FTO)on the weight ofthe tin dioxideC60Fullerene C60Xi'an Polymer LightTechnology Corp.BCP2,9-dimethyl-Xi'an Polymer Lightpowder4,7-biphenyl-Technology Corp.1,10-phenanthrolineTargetCesium leadZhongNuo Advanced10 mol % ofmaterial 1halideMaterial (Beijing)cesium, 30Technology Co., Ltd.mol % of lead,and 60 mol %of iodine Example 1-1 Preparation of the Perovskite Film (1) A group of electrically conductive glass of fluorine-doped tin dioxide (FTO, with a fluorine doping amount of 10%, based on the weight of the tin dioxide) with a specification of 1.5 cm*1.5 cm*2.2 mm are taken, and part of each FTO is etched with a laser marking machine (the unetched area is a square area that starts from the center of the 1.5 cm*1.5 cm surface of the FTO and extends 0.5 cm to each of the four sides); the etched FTO electrically conductive glass piece is successively washed with acetone and iso-propyl alcohol several times, and finally immersed into deionized water for sonication for 10 min, until the glass surface is free of foreign objects and dirts, and the resulting material is dried and used as a substrate.(2) The substrate obtained in step (1) is subject to a sputtering treatment with a target material 1 in magnetron sputtering equipment. A radio frequency power supply is used with a power of 3 kW, the pressure in the chamber of the magnetron sputtering equipment is 0.3 Pa, the process gas is argon, the flow rate of the argon is 500 sccm, the film coating time (i.e., the time for the sputtering treatment) is 10 min, and the thickness of the resulting film is 200 nm.(3) The film layer obtained in step (2) is transferred into a 100 ml solution of iodoformamidine in iso-propyl alcohol for a chemical bath treatment, the solution has a concentration of 60 mg/ml, the bath treatment is performed at a temperature of 50° C., for a time of 20 min, followed by drying to remove the solvent.(4) The film layer obtained in step (3) is subjected to a sputtering treatment in magnetron sputtering equipment. The tin metal is used as the target material, and the process gas is a mixed gas of argon:iodine vapor:bromine vapor at a volume ratio of 20:1:1, and in the process gas, the flow rate of the argon is 200 sccm, and those of the iodine vapor and the bromine vapor are both 10 sccm. A radio frequency power supply is used with a power of 2 kw, the temperature in the chamber of the magnetron sputtering equipment is 100° C. and the chamber pressure is 0.3 Pa, and the film coating time (i.e., the time for the sputtering treatment) is 40 min. The film thickness is increased by 150 nm after the sputtering treatment in this step. By the above steps, the perovskite film of the present application can be obtained. Preparation of the Perovskite Solar Cell (1) A group of electrically conductive glasses of fluorine-doped tin dioxide (FTO, with a fluorine doping amount of 10%, based on the weight of the tin dioxide) with a specification of 1.5 cm*1.5 cm*2.2 mm are taken, and part of each FTO is etched with a laser marking machine (the unetched area is a square area that starts from the center of the FTO and extends 0.5 cm to each of the four sides); the etched FTO electrically conductive glass piece is successively washed with acetone and iso-propyl alcohol several times, and finally immersed into deionized water for sonication for 10 min, until the glass surface is free of foreign objects and dirts, and the resulting material is used as a substrate.(2) The FTO electrically conductive glass piece obtained in step (1) is dried in a blast drying oven to remove the moisture, and then transferred to the magnetron sputtering equipment for nickel oxide sputtering; wherein a radio frequency power supply is used with a power of 1.5 kW, the temperature in the chamber of the magnetron sputtering equipment is 50° C. and the chamber pressure is 0.2 Pa, the flow rate of the argon is 300 sccm and that of the oxygen is 50 sccm, the film coating time is 5 min, and the resulting film layer has a thickness of 30 nm.(3) The resulting FTO electrically conductive glass with nickel oxide sputtering in step (2) is used as the substrate, and the perovskite film of the present application is prepared on the substrate; the preparation process is the same as that of the aforementioned perovskite film.(4) The resulting piece with the perovskite film obtained by sputtering in step (3) is placed into a vacuum coating machine. Then 20 g of C60 (Fullerene C60) and 20 g of a BCP powder (2,9-dimethyl-4,7-biphenyl-1,10-phenanthroline) are respectively placed into the magnetron sputtering equipment, the C60 is first evaporated at 0.05 Å/s until a thickness of 5 nm, and then at 0.1 Å/s until a thickness of 30 nm. Then the BCP powder is evaporated, at A/s until a thickness of 2 nm, and then at 0.1 Å/s until a thickness of 8 nm.(5) The piece obtained in step (4) is placed into an evaporation coating machine, and have a layer of Ag electrode evaporated, wherein the Ag electrode has a thickness of 50 nm. By the above steps, the perovskite solar cell of the present application can be obtained. Measuring Method for Related Parameters Band Gap Tests of Perovskite Films The UV-3600 spectrophotometer from Shimadzu, Japan, is used, to measure the transmittance and absorption spectrum of the film. A 5 cm*5 cm*2.2 mm of white glass coated with a layer of perovskite film is selected and placed on the testing window, a setting of 300-1100 nm of transmittance and absorption is selected in the software, and then the test is performed to obtain the transmittance and absorption spectrum of the perovskite film layer. The band gap value of the perovskite film can be obtained by converting the Tauc curve and then taking the intersection of a tangent and the energy axis. Efficiency Tests of Perovskite Solar Cells According to the standard IEC61215: 2016 efficiency test methods, the efficiency of the components is tested using the IVS-KA6000 from Guangyan Technology Co., Ltd. Examples 1-2 to 1-5 Except that in the process of preparing the perovskite film, the concentration of the solution of iodoformamidine in iso-propyl alcohol is 10 mg/ml, 20 mg/ml, 70 mg/ml and 100 mg/ml respectively, other conditions of Examples 1-2 to 1-5 are the same as those of Example 1-1. Examples 1-6 to 1-9 Except that in the process of preparing the perovskite film, the temperature for the chemical bath treatment is 40° C., 80° C., 100° C. and 120° C. respectively, other conditions of Examples 1-6 to 1-9 are the same as those of Example 1-1. Comparative Example 1 Except that in the process of preparing the perovskite film, the concentration of the solution of iodoformamidine in iso-propyl alcohol is 5 mg/ml, other conditions of Comparative example 1 are the same as those of Example 1-1. Comparative Examples 2-3 Except that in the process of preparing the perovskite film, the temperature for the chemical bath treatment is 150° C. and 170° C. respectively, other conditions of Comparative examples 2-3 are the same as those of Example 1-1. Comparative Example 4 Except that in the process of preparing the perovskite film, the chemical bath treatment is not performed, other conditions of Comparative example 4 are the same as those of Example 1-1. TABLE 1Test results of Examples 1-1 to 1-9 and Comparative Examples 1-4Temperaturefor chemicalConcentrationbathof solutiontreatmentBand(mg/ml)(° C.)gap (eV)EfficiencyExample 1-160501.4218.9%Example 1-210501.4110.7%Example 1-320501.4012.1%Example 1-470501.3917.3%Example 1-5100501.4114.9%Example 1-660401.4215.6%Example 1-760801.4315.6%Example 1-8601001.4514.7%Example 1-9601201.4210.6%Comparative5501.436.21%example 1Comparative601501.425.23%example 2Comparative601701.410%example 3Comparative——1.447.21%example 4 It can be seen from Table 1 that, the resulting perovskite film is treated with the chemical bath, such that the conversion efficiency of the solar cell can be effectively improved. However, when the concentration of the solution of AX is too low or the temperature for the chemical bath treatment is too high, adding the step of chemical bath treatment may instead worsen the performance of the perovskite film, resulting in a decrease in the conversion efficiency of solar cells. Examples 2-1 to 2-5 Except that in the process of preparing the perovskite film, the volume ratio of argon:iodine vapor:bromine vapor during the post-treatment process of step (4) is 20:1:1, 10:1:1, 20:0.5:0.5, 20:1.5:0.5, 10:0:1, respectively, other conditions of Examples 2-1 to 2-5 are the same as those of Example 1-1. Comparative Examples 5-6 Except that in the process of preparing the perovskite film, the volume ratio of argon:iodine vapor:bromine vapor during the post-treatment process of step (4) is 0:0:0 and 1:0:0, respectively, other conditions of Comparative examples 5-6 are the same as those of Example 1-1. TABLE 2Test results of Examples 2-1 to 2-5 and Comparative Examples 5-6Argon:iodine vapor:bromineBand gapvapor(eV)EfficiencyExample 2-120:1:11.4218.9%Example 2-210:1:11.5016.3%Example 2-320:0.5:1.51.4717.9%Example 2-420:1.5:0.51.4217.0%Example 2-510:0:11.4015.3%Comparative0:0:01.3413.5%example 5Comparative1:0:01.2110.6%example 6The numerical values are the volume ratio of the various gases, and the total flow rate of the mixed gas is 220 sccm. It can be seen from Table 2 that, in the process of the post-treatment of step (4), when argon and the halogen gas are present simultaneously, the performance of the perovskite film can be effectively improved, thus improving the efficiency of the solar cell. In particular, when the volume ratio of the argon to the halogen gas is 10:1 to 5:1, the conversion efficiency of the solar cell can be further improved. Examples 3-1 to 3-4 Except that in the process of preparing the perovskite film, the sputtering temperature during the post-treatment of step (4) is 50° C., 150° C., 200° C. and 250° C. respectively, other conditions of Examples 3-1 to 3-4 are the same as those of Example 1-1. Comparative Examples 7-8 Except that in the process of preparing the perovskite film, the sputtering temperature during the post-treatment of step (4) is 30° C. and 300° C. respectively, other conditions of Comparative examples 7-8 are the same as those of Example 1-1. TABLE 3Test results of Examples 3-1 to 3-4 and Comparative Examples 7-81Sputteringtemperature(° C.)Band gap (eV)EfficiencyExample 3-1501.3110.6%Example 3-21501.2617.4%Example 3-32001.2816.3%Example 3-42501.2715.6%Comparative301.278.21%example 7Comparative3001.295.32%example 8Note1refers to the sputtering temperature during the post-treatment, i.e., the step (4). It can be seen from Table 3 that, in the process of the post-treatment of step (4), when the sputtering temperature is 50° C.-250° C., it is beneficial for improving the performance of the perovskite film, such that the efficiency of the solar cell can be improved. In particular, when the sputtering temperature is 100° C.-200° C., the improvement in the efficiency of the solar cell is more obvious. It should be noted that the present application is not limited to the above embodiments. The above embodiments are exemplary only, and any embodiment that has substantially same constitutions as the technical ideas and has the same effects within the scope of the technical solution of the present application falls within the technical scope of the present application. In addition, without departing from the gist of the present application, various modifications that can be conceived by those skilled in the art to the embodiments, and other modes constructed by combining some of the constituent elements of the embodiments also fall within the scope of the present application. | 31,650 |
11862408 | DETAILED DESCRIPTION It should be understood at the outset that although an illustrative implementation of one or more embodiments is provided below, the disclosed systems, methods, and/or apparatuses described with respect toFIGS.1-5may be implemented using any number of techniques, whether currently known or not yet in existence. The disclosure should in no way be limited to the illustrative implementations, drawings, and techniques illustrated below, including the exemplary designs and implementations illustrated and described herein, but may be modified within the scope of the appended claims along with their full scope of equivalents. In the following description, reference is made to the accompanying drawings that form a part hereof, and in which are shown, by way of illustration, specific embodiments which may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the inventive subject matter, and it is to be understood that other embodiments may be utilized, and that structural, logical, and electrical changes may be made without departing from the scope of the present disclosure. The following description of example embodiments is, therefore, not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims. As used herein, the term “dry contact” (e.g., as used in connection with an interlock such as a relay or contactor) refers to a contact that is only carrying load current when closed. Such contact may not switch the load and may not make or break under load current. As used herein, the term “wet contact” (e.g., as used in connection with an interlock such as a relay or contactor) refers to a contact carrying load current when closed as well as switching load current during the make and break transitions. Examples of power contact fault clearing devices and components utilized therein and in conjunction with power contact fault clearing devices are disclosed herein. Examples are presented without limitation and it is to be recognized and understood that the embodiments disclosed are illustrative and that the circuit and system designs described herein may be implemented with any suitable specific components to allow for the circuit and system designs to be utilized in a variety of desired circumstances. Thus, while specific components are disclosed, it is to be recognized and understood that alternative components may be utilized as appropriate. An optimal way to address the shortcomings of a single contactor is to replace it with dual contactors or relays—a “wet” contact switch and a “dry” contact switch. Techniques disclosed herein relate to the design and configuration of a power contact fault clearing device to ensure better interlock performance and sequenced deactivation of the wet and dry contacts upon detecting a fault condition. More specifically, upon detecting a fault condition such as overcurrent and/or a fault arc, the power contact fault clearing device may use sequenced deactivation of the contacts so that the wet contact breaks first and the dry contact breaks last. In some aspects, in order to detect the fault condition, the power contact fault clearing device may include a current sensor measuring current through the main power load coupled to the contacts as well as one or more voltage sensors configured to detect a voltage across the wet or dry contacts. Additionally, multiple fault processing profiles associated with multiple fault conditions may be configured so that the power contact fault clearing device can determine/detect a fault condition from the multiple fault conditions based on the current and/or voltage sensed by the current sensor and the one or more voltage sensors and using one of the fault processing profiles. In some aspects, the disclosed power contact fault clearing device may incorporate an arc suppression circuit (also referred to as an arc suppressor) coupled to the wet contact, to protect the wet contact from arcing during the make and break transitions and to reduce deleterious effects from contact arcing. The arc suppressor incorporated with the power contact fault clearing device discussed herein may include an arc suppressor as disclosed in the following issued U.S. Patents—U.S. Pat. Nos. 8,619,395 and 9,423,442, both of which are incorporated herein by reference in their entirety. Even though the figures depict a power contact fault clearing device1with an internal arc suppressor, the disclosure is not limited in this regard and the power contact fault clearing device1may also use an external arc suppressor. In some aspects, a power contact fault clearing device1discussed herein may include elements of a wet/dry power contact sequencer. In some aspects, a power contact fault clearing device1discussed herein is a hybrid power switching circuit breaker using an internal or an external arc suppressor. In some aspects, a power contact fault clearing device1discussed herein is a hybrid power contactor using an internal or an external arc suppressor. In some aspects, a power contact fault clearing device1discussed herein is a hybrid power relay using an internal or an external arc suppressor. FIG.1is a diagram of a system100including a power contact fault clearing device1with an arc suppressor, according to some embodiments. Referring toFIG.1, the system100may include a power contact fault clearing device1coupled to an auxiliary power source2, a relay coil driver3, a main power source4, a dry relay5, a wet relay6, a main power load7, and a data communication interface19. The dry relay5may include a dry relay coil coupled to dry relay contacts, and the wet relay6may include a wet relay coil coupled to wet relay contacts. The dry relay5may be coupled to the main power source4via the power contact fault clearing device1. The dry relay5may be coupled in series with the wet relay6, and the wet relay6may be coupled to the main power load7via the power contact fault clearing device1. Additionally, the wet relay6may be protected by an arc suppressor coupled across the wet relay contacts of the wet relay6(e.g., as illustrated inFIG.2). Without an arc suppressor connected, the wet contactor or relay6contacts may become sacrificial and the dry contactor or relay5contacts may remain in excellent condition during normal operation of the power contact fault clearing device1, ensuring that the device clears a fault condition in the case where the wet relay contacts have failed. The main power source4may be an AC power source or a DC power source. Sources four AC power may include generators, alternators, transformers, and the like. Source four AC power may be sinusoidal, non-sinusoidal, or phase controlled. An AC power source may be utilized on a power grid (e.g., utility power, power stations, transmission lines, etc.) as well as off the grid, such as for rail power. Sources for DC power may include various types of power storage, such as batteries, solar cells, fuel cells, capacitor banks, and thermopiles, dynamos, and power supplies. DC power types may include direct, pulsating, variable, and alternating (which may include superimposed AC, full wave rectification, and half wave rectification). DC power may be associated with self-propelled applications, i.e., articles that drive, fly, swim, crawl, dive, internal, dig, cut, etc. Even thoughFIG.1illustrates the main power source4as externally provided, the disclosure is not limited in this regard and the main power source may be provided internally, e.g., a battery or another power source. Additionally, the main power source4may be a single-phase or a multi-phase power source. Even thoughFIG.1illustrates the power contact fault clearing device1coupled to a dry relay5and a wet relay6that include a relay coil and relay contacts, the disclosure is not limited in this regard and other types of interlock arrangements may be used as well, such as switches, contactors, or other types of interlocks. In some aspects, a contactor may be a specific, heavy duty, high current, embodiment of a relay. The dry and wet contacts associated with the dry and wet relays inFIG.1may each include a pair of contacts, such as electrodes. In some aspects, the main power load7may be a general-purpose load, such as consumer lighting, computing devices, data transfer switches, etc. In some aspects, the main power load7may be a resistive load, such as a resistor, heater, electroplating device, etc. In some aspects, the main power load7may be a capacitive load, such as a capacitor, capacitor bank, power supply, etc. In some aspects, the main power load7may be an inductive load, such as an inductor, transformer, solenoid, etc. In some aspects, the main power load7may be a motor load, such as a motor, compressor, fan, etc. In some aspects, the main power load7may be a tungsten load, such as a tungsten lamp, infrared heater, industrial light, etc. In some aspects, the main power load7may be a ballast load, such as a fluorescent light, a neon light, a light emitting diode (LED), etc. In some aspects, the main power load7may be a pilot duty load, such as a traffic light, signal beacon, control circuit, etc. The auxiliary power source2is an external power source that provides power to the wet and dry relay coils (of the wet relay6and the dry relay5, respectively) according to the power contact fault clearing device1. The first auxiliary power source node21may be configured as a first coil power termination input (e.g., to the auxiliary power termination and protection circuit12inFIG.2). The second auxiliary power source node22may be configured as the second coil power termination input. The auxiliary power source2may be a single-phase or a multi-phase power source. Additionally, the coil power source2may be an AC power type or a DC power type. The relay coil driver3is the external relay coil signal source which provides information about the energization status for the wet relay6coil and the dry relay5coil according to the control of the power contact fault clearing device1. In this regard, the relay coil driver3is configured to provide a control signal. The first relay coil driver node31is a first coil driver termination input (e.g., to relay coil termination and protection circuit14inFIG.2). The second relay coil driver node32may be configured as the second coil driver termination input. The relay coil driver3may be a single-phase or a multi-phase power source. Additionally, the relay coil driver3may be an AC power type or a DC power type. The data communication interface19is an optional element that is coupled to the power contact fault clearing device1via one or more communication links182. The data communication interface19may be coupled to external memory and may be used for, e.g., storing and retrieving data, such as fault processing profiles80, . . . ,82for detecting fault conditions as well as fault clearing algorithms for sequencing activation or deactivation of the dry and wet contacts upon detecting the fault conditions. An example fault clearing algorithm is discussed in connection with the timing diagram inFIG.3. Data communication may not be required for the full functional operation of the power contact fault clearing device1. In some aspects, the data communication interface19can include one or more of the following elements: a digital signal isolator, an internal transmit data (TxD) termination, an internal receive data (RxD) termination, an external receive data (Ext RxD) termination, and an external transmit data (Ext TxD) termination. Data signal filtering, transient, over-voltage, over-current, and wire termination are not shown in the example data communication interface19inFIG.1andFIG.2. In some aspects, the data communications interface19can be configured as an interface between the power contact fault clearing device1and one or more of the following: a Bluetooth controller, an Ethernet controller, a General Purpose Data Interface, a Human-Machine-Interface, an SPI bus interface, a UART interface, a USB controller, and a Wi-Fi controller. The dry relay5may include two sections—a dry relay coil and dry relay contacts. As mentioned above, “dry” refers to the specific mode of operation of the contacts in this relay which makes or breaks the current connection between the contacts while not carrying current. The first dry relay node51is the first dry relay5coil input from the power contact fault clearing device1. The second dry relay node52is the second dry relay5coil input from the power contact fault clearing device1. The third dry relay node53is the first dry relay contact connection with the main power source4. The fourth dry relay node56is the second dry relay contact connection (e.g., with the wet relay6). The dry relay5may be configured to operate with a single-phase or a multi-phase power source. Additionally, the dry relay5may be an AC power type or a DC power type. The wet relay6may include two sections—a wet relay coil and wet relay contacts. As mentioned above, “wet” refers to the specific mode of operation of the contacts in this relay which makes or breaks the current connection between the contacts while carrying current. The first wet relay node61is the first wet relay6coil input from the power contact fault clearing device1. The second wet relay node62is the second wet relay6coil input from the power contact fault clearing device1. The third wet relay node63is the first wet relay contact connection (e.g., with the dry relay). The fourth wet relay node66is the second wet relay contact connection (e.g., with the current sensor127). The wet relay6may be configured to operate with a single-phase or a multi-phase power source. Additionally, the wet relay6may be an AC power type or a DC power type. In some aspects, the power contact fault clearing device1is configured to detect a fault condition using current and voltage sensor data in connection with a fault processing profile selected from a plurality of available fault processing profiles80, . . . ,82. After the fault condition is detected, the power contact fault clearing device1may control the off timing sequencing of two contacts (either in series or in parallel) for the purpose of having the wet contact break the connection under current while the dry contact breaks the connection under no current. In some aspects, fault processing profile data (used to detect a fault condition) and specific power contact fault clearing algorithm data (used for sequencing the deactivation of multiple contacts based on the detected fault condition) may be located either in internal or external microcontroller/processor memory. Even thoughFIG.1illustrates the plurality of available fault processing profiles80, . . . ,82as being located outside of the power contact fault clearing device1(e.g., as may be stored in external memory), the disclosure is not limited in this regard and the plurality of available fault processing profiles80, . . . ,82may be stored within the power contact fault clearing device1. In some aspects, and as illustrated inFIG.2, a current sensor (e.g.,127) may be used to sense current through the wet relay contacts. Additionally, a voltage sensor (e.g.,125) may be used to monitor the voltage across the wet relay contacts. The power contact fault clearing device1may use data from the current sensor and/or the voltage sensor to detect a fault condition (e.g., an overcurrent, a fault arc, or other types of fault conditions) based on a fault processing profile selected from the plurality of available fault processing profiles80, . . . ,82. The selected fault processing profile (e.g., fault processing profile80) may specify one or more threshold values (e.g., threshold values84, . . . ,86) associated with the detected current (e.g., current through the main power load or through the dry or wet relay contacts) and/or voltage (e.g., voltage across the wet relay contacts). When current, voltage, a combination or function of the current and voltage, or other monitored parameters, exceed the threshold value(s) (e.g.,84, . . . ,86) specified in a fault processing profile, a fault condition is determined to be present. The power contact fault clearing device1may, within a few milliseconds of determining that a fault condition is present, apply a power contact fault clearing algorithm to sequence the deactivation of the wet and dry relay contacts for system turn-off. In some aspects, the plurality of fault processing profiles80, . . . ,82may be configured based on a type of load used as the main power load7(e.g., different fault processing profiles may be configured for motor loads, transformer loads, capacitive loads, etc.). In some aspects, a fault processing profile (e.g.,80) of the plurality of fault processing profiles80, . . . ,82may be based on current and power load type. For example, the current through a pair of contacts (e.g., the wet relay6contacts) may be measured and compared with a trip point current threshold (e.g., one of thresholds84, . . . ,86). The fault processing profile80may specify that no action is taken for x milliseconds after the detected current reaches a value above the trip point current threshold. The fault processing profile80may also specify that sequenced deactivation of the wet and dry relay contacts is initiated after y milliseconds after the detected current reaches a value above the trip point current threshold. The sequenced deactivation can be based on a fault clearing algorithm, such as the fault clearing algorithm discussed in connection withFIG.3. In some aspects, a fault processing profile (e.g.,80) of the plurality of fault processing profiles80, . . . ,82may be based on a charge amount (e.g., expressed in Ampere-second) when the main power load7is configured for charge limiting. When the charge (e.g., as determined based on sensed current through the wet relay6contacts for a specific period of time) is higher than a threshold charge (e.g., configured as one of thresholds84, . . . ,86), then sequenced deactivation of the wet and dry relay contacts is initiated. The sequenced deactivation can be based on a fault clearing algorithm, such as the fault clearing algorithm discussed in connection withFIG.3. In some aspects, a fault processing profile (e.g.,80) of the plurality of fault processing profiles80, . . . ,82may be based on detecting a fault in a power condition. For example, a voltage designation for system100for open load configurations may be known in advance. The complex power (e.g., as measured in VA) may be calculated using the detected current (e.g., current measured through the wet relay6contacts). When the complex power (e.g., as determined based on the sensed current and the voltage designation) is higher than a threshold power (e.g., configured as one of thresholds84, . . . ,86), then sequenced deactivation of the wet and dry relay contacts is initiated. The sequenced deactivation can be based on a fault clearing algorithm, such as the fault clearing algorithm discussed in connection withFIG.3. In some aspects, a fault processing profile (e.g.,80) of the plurality of fault processing profiles80, . . . ,82may be based on detecting a fault in an energy condition. For example, the power contact fault clearing device1may determine energy (e.g., as measured in kWh or Wsec) based on sensed current (e.g., current measured through the wet relay6contacts) and sensed voltage (e.g., the voltage measured across the wet relay6contacts). When the determined energy is higher than a threshold energy value (e.g., configured as one of thresholds84, . . . ,86), then sequenced deactivation of the wet and dry relay contacts is initiated. The sequenced deactivation can be based on a fault clearing algorithm, such as the fault clearing algorithm discussed in connection withFIG.3. In some aspects, a fault processing profile (e.g.,80) of the plurality of fault processing profiles80, . . . ,82may be based on detecting a fault arc across a pair of contacts (e.g., across the wet relay6contacts that are coupled to an arc suppressor126). A fault arc may occur when the wet contacts are closed and current is high enough that the contact material melts and floats above the contacts, pushing the contacts apart. If the contacts momentarily separate and the voltage across the contacts is high enough (e.g., greater than 12V), a fault arc occurs. In this regard, conditions that may lead to a fault arc include sensed current above 100 mA and voltage across the contacts greater than 12V. Such threshold current and voltage values may be stores as thresholds84, . . . ,86. When the sensed current and voltage across the contacts (e.g., wet relay6contacts) is detected to be higher than the current and voltage threshold values associated with creating a fault arc, then a fault arc is determined to have occurred and a sequenced deactivation of the wet and dry relay contacts is initiated. The sequenced deactivation can be based on a fault clearing algorithm, such as the fault clearing algorithm discussed in connection withFIG.3. In various examples of the power contact fault clearing device1, stand-alone-operation does not necessarily require additional connections, devices or manipulations other than those outlined in the present specification. In some aspects, various implementations of the power contact fault clearing device1(e.g., in connection with various embodiments as illustrated inFIG.1andFIG.2) may be configured to provide one or more of the following functionalities or features: AC or DC coil power and contact operation; authenticity and license control mechanisms; auto-detect functions; automatically generate service and maintenance calls; provide automatic fault detection; provide automatic power failure coil signal bypass; provide auto mode settings; provide a bar graph indicator; provide a behavior pattern learning resulting in out-of-pattern detection and indication; provide a Bluetooth interface; calculate, store and display historical data, values, and ranges for all signal inputs; calculate, store, and display statistical data, values, and ranges for all signal inputs; provide a code verification chip; provide coil fault detection and indication; provide communication access control; data communication interfaces and protocols; provide date and time event logging; enabling off-site troubleshooting; enabling faster cycle times; enabling lower duty cycles; enabling heavy duty operation with lighter duty contactors or relays; enabling high dielectric operation; enabling high power operation; enabling low leakage operation; enabling relays to replace contactors; encrypted data transmissions; provide an Ethernet interface; provide failure alarms; provide fault alerts; provide fault code clearing mechanisms; provide fault detection for out-of-spec or out-of-range parameters (e.g., chatter, cycle time, duty cycle, cycle speed, on duration, off duration, etc.); provide fault indication flash codes; provide fault history and statistics; provide hours-of-service counter; utilize hybrid power relays, contactors, and circuit breakers; utilize hybrid-power-switching controllers; provide LAN/WAN connectivity; provide connectivity for local or remote firmware upgradability, register access, system diagnostics, and remote troubleshooting; provide mode control selection; provide multi-phase configuration; provide operating mode indication; provide parameter history and statistics; provide power indication; provide processor status indication color codes; provide relay coil driver history and statistics; provide relay coil driver fault detection and indication; provide relay coil parameter history and statistics; provide relay coil state indication; provide processor status indication color codes; provide single-phase configuration; provide high dielectric isolation between power source and power load; support low leakage current between power source and power load; provide an SPI bus interface; provide triggering of automatic service calls; provide a universal data interface, such as Universal Asynchronous Receiver/Transmitter (UART) interface; and provide a USB interface, user access control, and a Wi-Fi interface. FIG.2is a block diagram of an example power contact fault clearing device1with an arc suppressor, according to some embodiments. Referring toFIG.2, the power contact fault clearing device1comprises an auxiliary power termination and protection circuit12, a relay coil termination and protection circuit14, a logic power supply15, a coil signal converter16, mode control switches17, a controller (also referred to as microcontroller or microprocessor)18, data communication interface19, a status indicator110, a code control chip120, a voltage sensor123, an overcurrent protection circuit124, a voltage sensor125, an arc suppressor126, a current sensor127, a dry coil power switch111, a dry coil current sensor113, a wet coil power switch112, and a wet coil current sensor114. The auxiliary power termination and protection circuit12is configured to provide external wire termination and protection to all elements of the power contact fault clearing device1. The first auxiliary power termination and protection circuit12node121is the first logic power supply15input, the first coil power switch111input, and the first coil power switch112input. The second auxiliary power termination and protection circuit12node122is the second logic power supply15input, the second coil power switch111input, and the second coil power switch112input. In some aspects, the auxiliary power termination and protection circuit12is includes one or more of the following elements: a first relay coil driver terminal, a second relay coil driver terminal, an overvoltage protection, an overcurrent protection, a reverse polarity protection, optional transient and noise filtering, optional current sensor, and optional voltage sensor. The relay coil termination and protection circuit14provides external wire termination and protection to all elements of the power contact fault clearing device1. The first coil termination and protection circuit14node141is the first coil signal converter circuit16input. The second coil termination and protection circuit14node142is the second coil signal converter16input. In some aspects, the relay coil termination and protection circuit14includes one or more of the following elements: a first relay coil driver terminal, a second relay coil driver terminal, an overvoltage protection, an overcurrent protection, a reverse polarity protection, optional transient and noise filtering, optional current sensor, and optional voltage sensor. The logic power supply15is configured to provide logic level voltage to all digital logic elements of the power contact fault clearing device1. The first logic power supply output151is the positive power supply terminal indicated by the positive power schematic symbol inFIG.2. The second logic power supply output152is the negative power supply terminal indicated by the ground reference symbol inFIG.2. In some aspects, the logic power supply15includes one or more of the following elements: an AC-to-DC converter, input noise filtering, and transient protection, input bulk energy storage, output bulk energy storage, output noise filtering, a DC-to-DC converter (alternative), an external power converter (alternative), a dielectric isolation (internal or external), an overvoltage protection (internal or external), an overcurrent protection (internal or external), product safety certifications (internal or external), and electromagnetic compatibility certifications (internal or external). The coil signal converter circuit16converts a signal indicative of the energization status of the wet and dry coils from the relay coil driver3into a logic level type signal communicated to the controller18via node187for further processing. In some aspects, the coil signal converter16is comprised of one or more of the following elements: current limiting elements, dielectric isolation, signal indication, signal rectification, optional signal filtering, optional signal shaping, and optional transient and noise filtering. The mode control switches17allow manual selection of specific modes of operation for the power contact fault clearing device1. In some aspects, the mode control switches17include one or more of the following elements: push buttons for hard resets, clearings or acknowledgements, DIP switches for setting specific modes of operation, and (alternatively in place of push buttons) keypad or keyboard switches. The controller18comprises suitable circuitry, logic, interfaces, and/or code and is configured to control the operation of the power contact fault clearing device1through, e.g., software/firmware-based operations, routines, and programs. The first controller node181is the status indicator110connection. The second controller node182is the data communication interface19connection. The third controller node183is the dry coil power switch111connection. The fourth controller node184is the wet coil power switch112connection. The fifth controller node185is the dry coil current sensor113connection. The sixth controller node186is the wet coil current sensor114connection. The seventh controller node187is the coil signal converter circuit16connection. The eight controller node188is the code control chip120connection. The ninth controller node189is the mode control switches17connection. The tenth controller node1810is the overcurrent voltage sensor123connection. The eleventh controller node1811is the voltage sensor125connection. The twelfth controller node1812is the arc suppressor126lock connection. The thirteenth controller node1813is the first current sensor127connection. The fourteenth controller node1814is the second current sensor127connection. In some aspects, controller18may be configured to control one or more of the following operations associated with the power contact fault clearing device1: operation management; authenticity code control management; auto-detect operations; auto-detect functions; automatic normally closed or normally open contact form detection; auto mode settings; coil cycle (Off, Make, On, Break, Off) timing, history, and statistics; coil delay management; history management; contact sequencing; coil driver signal chatter history and statistics; data management (e.g., monitoring, detecting, recording, logging, indicating, and processing); data value registers for present, last, past, maximum, minimum, mean, average, standard deviation values, etc.; date and time formatting, logging, and recording; embedded microcontroller with clock generation, power on reset, and watchdog timer; error, fault, and failure management; factory default value recovery management; firmware upgrade management; flash code generation; fault indication clearing; fault register reset; hard reset; interrupt management; license code control management; power-on management; power-up sequencing; power hold-over management; power turn-on management; reading from inputs, memory, or registers; register address organization; register data factory default values; register data value addresses; register map organization; soft reset management; SPI bus link management; statistics management; system access management; system diagnostics management; UART communications link management; wet/dry relay coil management; and writing to memory, outputs, and registers. The status indicator110provides audible, visual, or other user alerting methods through operational, health, fault, code indication via specific colors or flash patterns. In some aspects, the status indicator110may provide one or more of the following types of indications: bar graphs, graphic display, LEDs, a coil driver fault indication, a coil state indication, a dry coil fault indication, a mode of operation indication, a processor health indication, and wet coil fault indication. The dry coil power switch111connects the externally provided coil power to the dry relay coil5via nodes51and52based on the signal output from controller18via command output node183. In some aspects, the dry coil power switch111includes one or more of the following elements: solid-state relays, current limiting elements, and optional electromechanical relays. The wet coil power switch112connects the externally provided coil power to the wet relay coil6via nodes61and62based on the signal output from controller18via command output node184. In some aspects, the wet coil power switch112includes one or more of the following elements: solid-state relays, current limiting elements, and optional electromechanical relays. The dry coil current sensor113is configured to sense the value and/or the absence or presence of the dry relay coil5current. In some aspects, the dry coil current sensor113includes one or more of the following elements: solid-state relays, a reverse polarity protection element, optoisolators, optocouplers, Reed relays and/or Hall effect sensors (optional), SSR AC or DC input (alternative), and SSR AC or DC output (alternative). The wet coil current sensor114is configured to sense the value and/or the absence or presence of the dry relay coil6current. In some aspects, the wet coil current sensor114includes one or more of the following elements: solid-state relays, a reverse polarity protection element, optoisolators, optocouplers, Reed relays and/or Hall effect sensors (optional), SSR AC or DC input (alternative), and SSR AC or DC output (alternative). The code control chip120is an optional element of the power contact fault clearing device1, and it is not required for the fully functional operation of the device. In some aspects, the code control chip120may be configured to include application or customer specific code with encrypted or non-encrypted data security. In some aspects, the code control chip120function may be implemented externally via the data communication interface19. In some aspects, the code control chip120may be configured to store the following information: access control code and data, alert control code and data, authentication control code and data, encryption control code and data, chip control code and data, license control code and data, validation control code and data, and/or checksum control code and data. In some aspects, the code control chip120may be implemented as an internal component of controller18or may be a separate circuit that is external to controller18(e.g., as illustrated inFIG.2). The voltage sensor123is configured to monitor the condition of the overcurrent protection124. In some aspects, the voltage sensor123includes one or more of the following elements: solid-state relays, a bridge rectifier, current limiters, resistors, capacitors, reverse polarity protection elements, optoisolators, optocouplers, Reed relays and analog to digital converters (optional). The overcurrent protection circuit124is configured to protect the power contact fault clearing device1from destruction in case of an overcurrent condition. In some aspects, the overcurrent protection circuit124includes one of more of the following elements: fusible elements, fusible printed circuit board traces, fuses, and circuit breakers. The voltage sensor125is configured to monitor the voltage across the wet relay6contacts. In some aspects, the voltage sensor125includes one or more of the following elements: solid-state relays, a bridge rectifier, current limiters, resistors, capacitors, reverse polarity protection elements, and alternative or optional elements such as optoisolators, optocouplers, solid-state relays, Reed relays, and analog-to-digital converters. The arc suppressor126is configured to provide arc suppression for the wet relay6contacts. The arc suppressor126may be either external to the power contact fault clearing device1or, alternatively, may be implemented as an integrated part of the power contact fault clearing device1. The arc suppressor126may be configured to operate with a single-phase or a multi-phase power source. Additionally, the arc suppressor8may be an AC power type or a DC power type. In some aspects, the arc suppressor126may be deployed for normal load conditions. In some aspects, the arc suppressor126may or may not be designed to suppress a contact fault arc in an overcurrent or contact overload condition. In some aspects, the connection1812between the arc suppressor126lock and the controller18may be used for enabling (unlocking) the arc suppressor (e.g., when the relay coil driver signal is active) or disabling (locking) the arc suppressor (e.g., when the relay coil driver signal is inactive). In some aspects, the arc suppressor126may detect a fault arc that has formed at the wet relay6contacts and may send a notification of the fault arc to the controller18for initiating a sequenced deactivation of the wet and dry relay contacts. In other aspects, the controller18may determine there is a fault arc (as a fault condition) based on using one of the fault protection profiles80, . . . ,82(e.g., based on current from current sensor127and voltage from voltage sensor125being above threshold values. In some aspects, the arc suppressor126may be a single-phase or a multi-phase arc suppressor. Additionally, the arc suppressor may be an AC power type or a DC power type. The current sensor127is configured to monitors the current through the wet relay6contacts. In some aspects, the current sensor126includes one of more of the following elements: solid-state relays, a bridge rectifier, current limiters, resistors, capacitors, reverse polarity protection elements, and alternative or optional elements such as optoisolators, optocouplers, Reed relays, and analog-to-digital converters. In some aspects, the controller18status indicator output pin (SIO) pin181transmits the logic state to the status indicators110. SIO is the logic label state when the status indicator output is high, and /SIO is the logic label state when the status indicator output is low. In some aspects, the controller18data communication interface connection (TXD/RXD)182transmits the data logic state to the data communications interface19. RXD is the logic label state identifying the receive data communications mark, and /RXD is the logic label state identifying the receive data communications space. TXD is the logic label state identifying the transmit data communications mark, and /TXD is the logic label state identifying the transmit data communications space. In some aspects, the controller18dry coil output (DCO) pin183transmits the logic state to the dry coil power switch111. DCO is the logic label state when the dry coil output is energized, and /DCO is the logic label state when the dry coil output is de-energized. In some aspects, the controller18wet coil output pin (WCO)184transmits the logic state to the wet coil power switch112. WCO is the logic state when the wet coil output is energized, and /WCO is the logic state when the wet coil output is de-energized. In some aspects, the controller18dry coil input pin (DCI)185receives the logic state of the dry coil current sensor113. DCI is the logic state when the dry coil current is absent, and /DCI is the logic state when the dry coil current is present. In some aspects, the controller18wet coil input pin (WCI)186receives the logic state of the wet coil current sensor114. WCI is the logic label state when the wet coil current is absent, and /WCI is the logic label state when the wet coil current is present. In some aspects, the controller18coil driver input pin (CDI)187receives the logic state of the coil signal converter16. CDI is the logic state of the de-energized coil driver. /CDI is the logic state of the energized coil driver. In some aspects, the controller18code control connection (CCC)188receives and transmits the logic state of the code control chip120. CCR is the logic label state identifying the receive data logic high, and /CCR is the logic label state identifying the receive data logic low. CCT is the logic label state identifying the transmit data logic high, and /CCT is the logic label state identifying the transmit data logic low. In some aspects, the controller18mode control switch input pin (S) 189 receives the logic state from the mode control switches17. S represents the mode control switch open logic state, and /S represents the mode control switch closed logic state. In some aspects, the controller18connection1810receives the logic state from the overcurrent protection (OCP) voltage sensor123. OCPVS is the logic label state when the OCP is not fused open, and /OCPVS is the logic label state when the OCP is fused open. In some aspects, the controller18connection1811receives the logic state from the wet contact voltage sensor (VS)125. WCVS is the logic label state when the VS is transmitting logic high, and /WCVS is the logic label state when the VS is transmitting logic low. In some aspects, the controller18connection1812transmits the logic state to the arc suppressor126lock. ASL is the logic label state when the lock is locked, and /ASL is the logic label state when the lock is unlocked. In some aspects, the controller18connections1813and1814receive the logic state from the contact current sensor127. CCS is the logic label state when the contact current is absent, and /CCS is the logic label state when the contact current is present. In some aspects, the controller18may configure one or more timers (e.g., in connection with detecting a fault condition and sequencing the deactivation of the wet and dry contacts). Example timer labels and definitions of different timers that may be configured by controller18include one or more of the following timers. In some aspects, the coil driver input delay timer delays the processing for the logic state of the coil driver input signal. COIL_DRIVER_INPUT_DELAY_TIMER is the label when the timer is running. In some aspects, the switch debounce timer delays the processing for the logic state of the switch input signal. SWITCH_DEBOUNCE_TIMER is the label when the timer is running. In some aspects, the receive data timer delays the processing for the logic state of the receive data input signal. RECEIVE_DATA_DELAY_TIMER is the label when the timer is running. In some aspects, the transmit data timer delays the processing for the logic state of the transmit data output signal. TRANSMIT_DATA_DELAY_TIMER is the label when the timer is running. In some aspects, the wet coil output timer delays the processing for the logic state of the wet coil output signal. WET_COIL_OUTPUT_DELAY_TIMER is the label when the timer is running. In some aspects, the wet current input timer delays the processing for the logic state of the wet current input signal. WET_CURRENT_INPUT_DELAY_TIMER is the label when the timer is running. In some aspects, the dry coil output timer delays the processing for the logic state of the dry coil output signal. DRY_COIL_OUTPUT_DELAY_TIMER is the label when the timer is running. In some aspects, the dry current input timer delays the processing for the logic state of the dry current input signal. DRY_CURRENT_INPUT_DELAY_TIMER is the label when the timer is running. In some aspects, the signal indicator output delay timer delays the processing for the logic state of the signal indicator output. SIGNAL_INDICATOR_OUTPUT_DELAY_TIMER is the label when the timer is running. FIG.3depicts a timing diagram300for sequencing dry and wet contacts based on detecting a fault condition using the example power contact fault clearing device ofFIG.2, according to some embodiments. Referring toFIG.3, the timing diagram300includes timing for load current302, relay coil driver input304, dry relay coil output306, and with the relay coil output308. Prior to time T1, the relay coil driver input304(from relay coil driver3) is OFF (indicating idle, non-energizing state of the contacts). At time T1, the relay coil driver input304is ON (indicating active, energizing state for the contacts). After a short propagation delay (tpd1), the dry relay coil output306changes from OFF to ON and the dry relay contact closes. After the wet relay coil on time delay (td_wet_on), at time T2, the wet relay coil output308changes from OFF to ON and the wet relay contacts close. At time T2the load current302changes from absent to present. During the load current “present” state, an over-current fault condition occurs. After a short propagation delay (tpd2), the load current302is high enough to activate the fault level trip point310(e.g., the current level is higher than a threshold value in one of the fault processing profiles80, . . . ,82), resulting in overcurrent detection. Depending on the short circuit current rating of the contact, a fault arc may or may not have occurred at that time. After a short propagation delay (tpd3), at time T3, the wet relay coil output308changes from ON to OFF. The arc suppressed wet relay6contact opens and interrupts the fault current (and also interrupting a possible fault arc). At time T3, the load current changes from present to absent. After the dry coil off time delay (td_dry_off), at time T4, the dry relay5coil output306changes from ON to OFF. After time T4, both the wet and dry contacts are presenting an open contact condition with high dielectric isolation and with extremely low leakage current. The power contact fault clearing device1has thus cleared the overcurrent fault condition. In some aspects, the power contact fault clearing device1registers may be located internally or externally to the controller18. For example, the code control chip120can be configured to store the power contact fault clearing device1registers that are described hereinbelow. In some aspects, address and data may be written into or read back from the registers through a communication interface using either UART, SPI or any other processor communication method. In some aspects, the registers may contain data for the following operations: calculating may be understood to involve performing mathematical operations; controlling may be understood to involve processing input data to produce desired output data; detecting may be understood to involve noticing or otherwise detecting a change in the steady state; indicating may be understood to involve issuing notifications to the users; logging may be understood to involve associating dates, times, and events; measuring may be understood to involve acquiring data values about physical parameters; monitoring may be understood to involve observing the steady states for changes; processing may be understood to involve performing controller or processor-tasks for one or more events; and recording may be understood to involve writing and storing events of interest into mapped registers. In some aspects, the power contact fault clearing device1registers may contain data arrays, data bits, data bytes, data matrixes, data pointers, data ranges, and data values. In some aspects, the power contact fault clearing device1registers may store control data, default data, functional data, historical data, operational data, and statistical data. In some aspects, the power contact fault clearing device1registers may include authentication information, encryption information, processing information, production information, security information, and verification information. In some aspects, the power contact fault clearing device1registers may be used in connection with external control, external data processing, factory use, future use, internal control, internal data processing, and user tasks. In some aspects, reading a specific register byte, bytes, or bits may reset the value to zero (0). The following are example registers that can be configured for the power contact fault clearing device1. In some aspects, a mode register (illustrated in TABLE 1) may be configured to contain the data bits for the selected sequencer mode. For example, the sequencer may be shut down in order to reduce the current draw to a minimum level. Shutting down the sequencer powers down all active components of the power contact fault clearing device1, including the controller18. In this mode, the module may not respond to any external input or communication command. A temporary transition to the high state on the sequencer's external reset switch/pin is required to bring the power contact fault clearing device1back to normal operation. The power contact fault clearing device1may be pre-loaded with register default settings. In the default mode, the power contact fault clearing device1may operate stand-alone and independently as instructed by the factory default settings. In some aspects, the following Read and Write commands may be used in connection with the mode register: Read @ 0x60, and Write @ 0x20. TABLE 1Mode RegisterBIT NUMBERFUNCTION76543210INDICATE_FAULTS & FAILURES1———————None0———————INDICATE_NONE—1——————None—0——————INDICATE_ALL——1—————None——0—————STOP_ON_FAILURE———1————None———0————HALT_ON_FAULT————1———None————0———RESET—————1——None—————0——CLEAR——————1—None——————0—DEFAULT———————1None———————0 In some aspects, an alert register (illustrated in TABLE 2) may be configured to contain the data bits for the selected alert method. In some aspects, the following Read and Write commands may be used in connection with the alert register: Read @ 0x61, and Write @ 0x21. TABLE 2Alert RegisterBIT NUMBERFUNCTION76543210VOICE1———————None0———————COMM—1——————None—0——————BUZZER——1—————None——0—————SPEAKER———1————None———0————RECORD————1———None————0———SOUND—————1——None—————0——DISPLAY——————1—None——————0—LED———————1None———————0 In some aspects, a code control register (illustrated in TABLE 3) may be configured to contain the data array pointers for the selected code type. In some aspects, the following Read and Write commands may be used in connection with the code control register: Read @ 0x62, and Write @ 0x22. TABLE 3Code Control RegisterBIT NUMBERFUNCTION76543210CHECKSUM1———————None0———————VALIDATION—1——————None—0——————LICENSE——1—————None——0—————CHIP———1————None———0————ENCRYPT————1———None————0———AUTHENTIC—————1——None—————0——ALERT——————1—None——————0—ACCESS———————1None———————0 In some aspects, a contact limits register (illustrated in TABLE 4) may be configured to contain the data array pointers for the selected contact limit specification. In some aspects, the following Read and Write commands may be used in connection with the contact limits register: Read @ 0x63, and Write @ 0x23. TABLE 4Contact Limits RegisterBIT NUMBERFUNCTION76543210MAX_MECH_LIFE1———————None0———————MAX_ELEC_LIFE—1——————None—0——————MAX_CYCLES_PER_MINUTE——1—————None——0—————MAX_DUTY_CYCLE———1————None———0————MIN_DUTY_CYCLE————1———None————0———MIN_OFF_DURATION—————1——None—————0——MIN_ON_DURATION——————1—None——————0—MIN_CYCLE_TIME———————1None———————0 In some aspects, a data communication register (illustrated in TABLE 5) may be configured to contain the data bits for the selected data communications method. In some aspects, the following Read and Write commands may be used in connection with the data communication register: Read @ 0x64; and Write @0x24. TABLE 5Data Comm RegisterBIT NUMBERFUNCTION76543210PROTOCOL1———————None0———————HMI—1——————None—0——————BLUETOOTH——1—————None——0—————ETHERNET———1————None———0————WIFI————1———None————0———USB—————1——None—————0——SPI——————1—None——————0—UART———————1None———————0 In some aspects, a coil driver parameter register (illustrated in TABLE 6) may be configured to contain the data array pointers for the selected coil driver parameter specification. In some aspects, the following Read and Write commands may be used in connection with the coil driver parameter register: Read @ 0x65, and Write @0x25. TABLE 6Coil Driver Parameters RegisterBIT NUMBERFUNCTION76543210COIL_DRIVER_PATTERN1———————None0———————COIL_DRIVER_OFF_CHATTER—1——————None—0——————COIL_DRIVER_ON_CHATTER——1—————None——0—————COIL_DRIVER_FREQUENCY———1————None———0————COIL_DRIVER_CYCLE_TIME————1———None————0———COIL_DRIVER_DUTY_CYCLE—————1——None—————0——COIL_DRIVER_ON_DURATION——————1—None——————0—COIL_DRIVER_OFF_DURATION———————1None———————0 In some aspects, a coil driver pattern register (illustrated in TABLE 7) may be configured to contain the data bits for the selected coil driver pattern condition. In some aspects, the following Read and Write commands may be used in connection with the coil driver pattern register: Read @ 0x66, and Write @ 0x26. TABLE 7Coil Driver Pattern RegisterBIT NUMBERFUNCTION76543210COIL_DRIVER_PATTERN_AQUIRED1———————None0———————COIL_DRIVER_PATTERN_DETECTED—1——————None—0——————COIL_DRIVER_PATTERN_LEARNED——1—————None——0—————OUT_OF_COIL_DRIVER_PATTERN———1————None———0————IN_COIL_DRIVER_PATTERN————1———None————0———NO_COIL_DRIVER_PATTERN—————1——None—————0——AQUIRE_COIL_DRIVER_PATTERN——————1—None——————0—IGNORE_COIL_DRIVER_PATTERN———————1None———————0 In some aspects, a dry coil output delay timer register (illustrated in TABLE 8) may be configured to contain the values for the dry delay timing. In some aspects, the following Read and Write commands may be used in connection with the dry relay register: Read @ 0x67, and Write @ 0x27. TABLE 8Dry Delay Coil OutputDelay Time RegisterBIT NUMBERVALUE76543210Maximum: 2550 ms11111111Default: 100 ms00001010Minimum: 0 ms00000000 In some aspects, a fault register (illustrated in TABLE 9) may be configured to contain the data bits for the selected fault condition. In some aspects, the following Read and Write commands may be used in connection with the fault register: Read @ 0x68, and Write @ 0x28. TABLE 9Fault RegisterBIT NUMBERFUNCTION76543210COMM_FAULT1———————None0———————POWER_BROWN_OUT—1——————None—0——————WATCH_DOG_TIMER——1—————None——0—————POWER_FAULT———1————None———0————DEVICE_HEALTH————1———None————0———COIL_DRIVER_FAULT—————1——None—————0——DRY_COIL_FAULT——————1—None——————0—WET_COIL_FAULT———————1None———————0 In some aspects, a flash code register (illustrated in TABLE 10) may be configured to contain the data bits for the selected LED flash code colors. In some aspects, the following Read and Write commands may be used in connection with the flash code register: Read @ 0x69, and Write @ 0x29. TABLE 10LED Flash Code RegisterBIT NUMBERFUNCTION76543210FLASH_CODE71———————None0———————FLASH_CODE6—1——————None—0——————FLASH_CODE5——1—————None——0—————FLASH_CODE4———1————None———0————FLASH_CODE3————1———None————0———FLASH_CODE2—————1——None—————0——FLASH_CODE1——————1—None——————0—FLASH_CODE0———————1None———————0 In some aspects, a history register (illustrated in TABLE 11) may be configured to contain the data array pointers for the selected history information. In some aspects, the following Read and Write commands may be used in connection with the history register: Read @ 0x6A, and Write @ 0x2A. TABLE 11History RegisterBIT NUMBERFUNCTION76543210STATUS1———————None0———————STATE—1——————None—0——————MODE——1—————None——0—————FAULT———1————None———0————OUTPUT————1———None————0———INPUT—————1——None—————0——DRIVER——————1—None——————0—MODE———————1None———————0 In some aspects, an input register (illustrated in TABLE 12) may be configured to contain the data bits for the selected input status. In some aspects, the following Read and Write commands may be used in connection with the input register: Read @ 0x6B, and Write @ 0x2B. TABLE 12Input RegisterBIT NUMBERFUNCTION76543210DCI1———————None0———————WCI—1——————None—0——————RXD——1—————None——0—————S2C———1————None———0————S2B————1———None————0———S2A—————1——None—————0——S1——————1—None——————0—CDI———————1None———————0 In some aspects, an LED color register (illustrated in TABLE 13) may be configured to contain the data bits for the selected LED color. In some aspects, the following Read and Write commands may be used in connection with the LED color register: Read @ 0x6C, and Write @ 0x2C. TABLE 13LED Color RegisterBIT NUMBERFUNCTION76543210RED1———————None0———————RED_ORANGE—1——————None—0——————ORANGE_YELLOW——1—————None——0—————ORANGE———1————None———0————YELLOW————1———None————0———YELLOW_GREEN—————1——None—————0——GREEN_YELLOW——————1—None——————0—GREEN———————1None———————0 In some aspects, an output register (illustrated in TABLE 14) may be configured to contain the data bit for the selected output status. In some aspects, the following Read and Write commands may be used in connection with the output register: Read @ 0x6D, and Write @ 0x2D. TABLE 14Output RegisterBIT NUMBERFUNCTION76543210WET_COIL_OUTPUT1———————None0———————DRY_COIL_OUTPUT—1——————None—0——————TXD——1—————None——0—————ARC_SUPPRESOR_LOCK———1————None———0————Reserved————1———None————0———SIGNAL_INDICATOR_OUTPUT2—————1——None—————0——SIGNAL_INDICATOR_OUTPUT1——————1—None——————0—Reserved———————1None———————0 In some aspects, a state register (illustrated in TABLE 15) may be configured to contain the data array pointers for the selected state information. In some aspects, the following Read and Write commands may be used in connection with the state register: Read @ 0x6E, and Write @ 0x2E. TABLE 15State RegisterBIT NUMBERFUNCTION76543210WET_COIL_ON1———————None0———————WET_COIL_OPN—1——————None—0——————WET_COIL_OFF——1—————None——0—————DRY_COIL_ON———1————None———0————DRY_COIL_OPN————1———None————0———DRY_COIL_OFF—————1——None—————0——DRIVER_INPUT_ON——————1—None——————0—DRIVER_INPUT_OFF———————1None———————0 In some aspects, a statistics register (illustrated in TABLE 16) may be configured to contain the data array pointers for the selected statistics information. In some aspects, the following Read and Write commands may be used in connection with the statistics register: Read @ 0x6F; and Write @ 0x2F. TABLE 16Statistics RegisterBIT NUMBERFUNCTION76543210STATUS1———————None0———————STATE—1——————None—0——————MODE——1—————None——0—————FAULT———1————None———0————OUTPUT————1———None————0———INPUT—————1——None—————0——DRIVER——————1—None——————0—MODE———————1None———————0 In some aspects, a status register (illustrated in TABLE 17) may be configured to contain the data array pointers for the selected status information. In some aspects, the following Read and Write commands may be used in connection with the status register: Read @ 0x70, and Write @ 0x30. TABLE 17Status RegisterBIT NUMBERFUNCTION76543210CYCLE_COUNT1———————None0———————OPERATION_HALTED—1——————None—0——————SYSTEM_READY——1—————None——0—————FAILURES———1————None———0————FAILURE————1———None————0———FAULTS—————1——None—————0——FAULT——————1—None——————0—ALL_SYSTEMS_OK———————1None———————0 In some aspects, a version register (illustrated in TABLE 18) may be configured to contain the data array pointers for the version information. In some aspects, the following Read and Write commands may be used in connection with the version register: Read @ 0x71, and Write @ 0x31. TABLE 18Version RegisterBIT NUMBERFUNCTION76543210PCB_REVISION1———————None0———————ASSEMBLY_REVISION—1——————None—0——————DATE_CODE——1—————None——0—————LOT_NUMBER———1————None———0————SERIAL_NUMBER————1———None————0———HARDWARE_VERSION—————1——None—————0——SOFTWARE_VERSION——————1—None——————0—FIRMWARE_VERSION———————1None———————0 In some aspects, a wet coil output delay timer register (illustrated in TABLE 19) may be configured to contain the values for the wet delay timing. In some aspects, the following Read and Write commands may be used in connection with the wet coil output delay timer register: Read @ 0x72, and Write @ 0x32. TABLE 19Wet Coil Output DelayTimer RegisterBIT NUMBERVALUE76543210Maximum: 2550 ms11111111Default: 100 ms00001010Minimum: 0 ms00000000 In some aspects, a switch debounce timer register (illustrated in TABLE 20) may be configured to contain the values for the switch debounce timing. In some aspects, the following Read and Write commands may be used in connection with the switch debounce timer register: Read @ 0x73, and Write @0x33. TABLE 20Switch Debounce Timer RegisterBIT NUMBERVALUE76543210Maximum: 255 ms11111111Default: 10 ms00001010Minimum: 0 ms00000000 In some aspects, a receive data timer register (illustrated in TABLE 21) may be configured to contain the values for the receive data timing. In some aspects, the following Read and Write commands may be used in connection with the receive data timer mode register: Read @ 0x74, and Write @0x34. TABLE 21Receive Data Timer RegisterBIT NUMBERVALUE76543210Maximum: 255 ms11111111Default: 10 ms00001010Minimum: 0 ms00000000 In some aspects, a transmit data delay timer register (illustrated in TABLE 22) may be configured to contain the values for the transmit data timing. In some aspects, the following Read and Write commands may be used in connection with the transmit data delay timer register: Read @ 0x75, and Write @ 0x35. TABLE 22Transmit Data DelayTimer RegisterBIT NUMBERVALUE76543210Maximum: 255 ms11111111Default: 10 ms00001010Minimum: 0 ms00000000 In some aspects, a wet coil current input delay timer register (illustrated in TABLE 23) may be configured to contain the values for the wet coil output timing. In some aspects, the following Read and Write commands may be used in connection with the wet coil current input delay timer register: Read @ 0x76, and Write @ 0x36. TABLE 23Wet Coil Current InputDelay Timer RegisterBIT NUMBERVALUE76543210Maximum: 255 ms11111111Default: 10 ms00001010Minimum: 0 ms00000000 In some aspects, a dry coil current input delay timer register (illustrated in TABLE 24) may be configured to contain a one or more-byte value. In some aspects, the following Read and Write commands may be used in connection with the dry coil current input delay timer register: Read @ 0x77, and Write @ 0x37. TABLE 24Dry Coil Current InputDelay Timer RegisterBIT NUMBERVALUE76543210Maximum: 255 ms11111111Default: 10 ms00001010Minimum: 0 ms00000000 In some aspects, a signal indicator output delay timer register (illustrated in TABLE 25) may be configured to contain any one or more-byte value. In some aspects, the following Read and Write commands may be used in connection with the signal indicator output delay timer register: Read @ 0x78, and Write @ 0x38. TABLE 25Signal Indicator OutputDelay Timer RegisterBIT NUMBERVALUE76543210Maximum: 255 ms11111111Default: 10 ms00001010Minimum: 0 ms00000000 In some aspects, a sensor input register (illustrated in TABLE 26) may be configured to contain the data bits for the selected sensor status. In some aspects, the following Read and Write commands may be used in connection with the sensor input register: Read @ 0x79, and Write @ 0x39. TABLE 26Sensor Input RegisterBIT NUMBERFUNCTION76543210Reserved1———————None0———————Reserved—1——————None—0——————Reserved——1—————None——0—————Reserved———1————None———0————FAULT_ARC_DETECTED————1———None————0———WET_CONTACT_CURRENT_SENSOR_BIT—————1——None—————0——WET_CONTACT_VOLTAGE_SENSOR_BIT——————1—None——————0—OCP_VOLTAGE_SENSOR_BIT———————1None———————0 In some aspects, an overcurrent protection voltage sensor register (illustrated in TABLE 27) may be configured to contain a one or more-byte value. In some aspects, the following Read and Write commands may be used in connection with the overcurrent protection (OCP) voltage sensor register: Read @ 0x7A, and Write @ 0x3A. TABLE 27OCP Voltage Sensor RegisterBIT NUMBERVALUE76543210Maximum: Max Volts11111111Default: nonexxxxxxxxMinimum: Min Volts00000000 In some aspects, a wet contact voltage sensor register (illustrated in TABLE 28) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the wet contact voltage sensor register: Read @ 0x7B, and Write @ 0x3B. TABLE 28Wet Contact VoltageSensor RegisterBIT NUMBERVALUE76543210Maximum: Max Volts11111111Default: nonexxxxxxxxMinimum: Min Volts00000000 In some aspects, a wet contact current sensor register (illustrated in TABLE 29) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the wet contact current sensor register: Read @ 0x7C, and Write @ 0x3C. TABLE 29Wet Contact CurrentSensor RegisterBIT NUMBERVALUE76543210Maximum: Max Amps11111111Default: nonexxxxxxxxMinimum: Min Amps00000000 In some aspects, a fault arc parameter register (illustrated in TABLE 30) may be configured to contain the data bits for the selected sensor status. In some aspects, the following Read and Write commands may be used in connection with the fault arc parameter register: Read @ 0x7D, and Write @0x3D. TABLE 30Fault Arc Parameter RegisterBIT NUMBERFUNCTION76543210FAULT_ARC_ENERGY1———————None0———————FAULT_ARC_DURATION—1——————None—0——————FAULT_ARC_POWER——1—————None——0—————FAULT_ARC_RESISTANCE_GRADIENT———1————None———0————FAULT_ARC_RESISTANCE————1———None————0———FAULT_ARC_CURRENT—————1——None—————0——FAULT_ARC_VOLTAGE_GRADIENT——————1—None——————0—FAULT_ARC_VOLTAGE———————1None———————0 In some aspects, an amperage trip point register (illustrated in TABLE 31) may be configured to contain the one or more-byte value for the specific trip point setting. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the amperage trip point register: Read @ 0x7E, and Write @0x3E. TABLE 31AMPERAGE TRIPPOINT REGSITERBIT NUMBERVALUE76543210Maximum: Max Amps11111111Set-Amperage: none selectedxxxxxxxxMinimum: Min Amps00000000 In some aspects, an amperage trip delay register (illustrated in TABLE 32) may be configured to contain the one or more-byte value for the specific trip point setting. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the amperage trip delay register: Read @ 0x7F, and Write @0x3F. TABLE 32Amperage Trip Delay RegisterBIT NUMBERVALUE76543210Maximum: 255 ms11111111Set-Amperage TripxxxxxxxxDelay: none selectedMinimum: 0 ms00000000 In some aspects, a fault arc voltage register (illustrated in TABLE 33) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc voltage register: Read @ 0x80, and Write @ 0x40. TABLE 33Fault Arc Voltage RegisterBIT NUMBERVALUE76543210Maximum: Max Volts11111111Default: nonexxxxxxxxMinimum: Min Volts00000000 In some aspects, a fault arc voltage gradient register (illustrated in TABLE 34) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc voltage gradient register: Read @ 0x81, and Write @ 0x41. TABLE 34Fault Arc Voltage Gradient RegisterBIT NUMBERVALUE76543210Maximum: Max dV/dt11111111Default: nonexxxxxxxxMinimum: Min dV/dt00000000 In some aspects, a fault arc current register (illustrated in TABLE 35) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc current register: Read @ 0x82, and Write @ 0x42. TABLE 35Fault Arc Current RegisterBIT NUMBERVALUE76543210Maximum: Max Amps11111111Default: nonexxxxxxxxMinimum: Min Amps00000000 In some aspects, a fault arc resistance register (illustrated in TABLE 36) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc resistance register: Read @ 0x83, and Write @0x43. TABLE 36Fault Arc Resistance RegisterBIT NUMBERVALUE76543210Maximum: Max Ohms11111111Default: nonexxxxxxxxMinimum: Min Ohms00000000 In some aspects, a fault arc resistance gradient register (illustrated in TABLE 37) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc resistance gradient register: Read @ 0x84, and Write @ 0x44. TABLE 37Fault Arc ResistanceGradient RegisterBIT NUMBERVALUE76543210Maximum: Max dΩ/dt11111111Default: nonexxxxxxxxMinimum: Min dΩ/dt00000000 In some aspects, a fault arc power register (illustrated in TABLE 38) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc power register: Read @ 0x85, and Write @ 0x45. TABLE 38Fault Arc Power RegisterBIT NUMBERVALUE76543210Maximum: Max Watts11111111Default: nonexxxxxxxxMinimum: Min Watts00000000 In some aspects, a fault arc duration register (illustrated in TABLE 39) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc duration register: Read @ 0x86, and Write @ 0x46. TABLE 39Fault Arc Duration RegisterBIT NUMBERVALUE76543210Maximum: Max seconds11111111Default: nonexxxxxxxxMinimum: Min seconds00000000 In some aspects, a fault arc energy register (illustrated in TABLE 40) may be configured to contain a one or more-byte value. The value may be expressed for example but not limited to as average, mean, median, rms or peak. In some aspects, the following Read and Write commands may be used in connection with the fault arc energy register: Read @ 0x87, and Write @ 0x47. TABLE 40Fault Arc Energy RegisterBIT NUMBERVALUE76543210Maximum: Max Joules11111111Default: nonexxxxxxxxMinimum: Min Joules00000000 FIG.4depicts a packaging example of a power contact fault clearing device1, according to some embodiments. FIG.5is a flowchart of a method500for detecting a fault condition during operation of a power contact fault clearing device, according to some embodiments. At operation502, a signal converter circuit (e.g.,16) is coupled to a pair of terminals (e.g., the terminals coupled to the relay coil driver3). The signal converter circuit is configured to convert a signal indicative of energization status of a first set of switchable contacts (e.g., the dry relay5contacts) and a second set of switchable contacts (e.g., the wet relay6contacts) into a logic level control signal. The signal indicative of energization status is received from a driver circuit (e.g.,3) via the pair of terminals. At operation504, a current sensor (e.g.,127) is coupled to the second set of switchable contacts (e.g., the wet relay6contacts). The current sensor is configured to measure a power load current associated with a power load (e.g.,7) coupled to the second set of switchable contacts. At operation506, a voltage sensor (e.g.,125) is coupled to the second set of switchable contacts. The voltage sensor is configured to measure contact voltage across the second set of switchable contacts. At operation508, a controller circuit (e.g.,18) is coupled to the current sensor (e.g.,127) and the voltage sensor (e.g.,125). The controller circuit is configured to detect a fault condition based on one or both of the contact voltage and the power load current. For example, the controller circuit18may use one or more of the fault processing profiles80, . . . ,82with corresponding thresholds (e.g.,84, . . . ,86) to detect a fault condition. The controller circuit may then sequence activation or deactivation of the first set of switchable contacts and the second set of switchable contacts based on the logic level control signal and the detected fault condition. At operation510, a status indicator (e.g.,110) is coupled to the controller circuit. The status indicator may be configured to provide an indication of the detected fault condition and/or an indication when the contacts have been deactivated as a result of the fault condition. Additional Examples The description of the various embodiments is merely exemplary in nature and, thus, variations that do not depart from the gist of the examples and detailed description herein are intended to be within the scope of the present disclosure. Such variations are not to be regarded as a departure from the spirit and scope of the present disclosure. Example 1 is an electrical circuit, comprising: a first pair of terminals adapted to be connected across a first set of switchable contacts; a second pair of terminals adapted to be connected across a second set of switchable contacts, the second set of switchable contacts coupled to an arc suppressor; a current sensor adapted to be connected between a power load and the second set of switchable contacts, the current sensor configured to measure a power load current associated with the power load; and a controller circuit operatively coupled to the current sensor and the first and second pairs of terminals, the controller circuit configured to: detect a fault condition based at least on the power load current; and sequence deactivation of the first set of switchable contacts and the second set of switchable contacts based on the detected fault condition, wherein during the deactivation, the second set of switchable contacts is deactivated prior to deactivation of the first set of switchable contacts. In Example 2, the subject matter of Example 1 includes, wherein the fault condition is based on a current level, and to detect the fault condition the controller circuit is configured to: retrieve a fault processing profile from a plurality of available fault processing profiles, the retrieved fault processing profile comprising a preconfigured current threshold level. In Example 3, the subject matter of Example 2 includes, wherein to detect the fault condition the controller circuit is configured to: determine the power load current is higher than the preconfigured current threshold level for a preconfigured time duration. In Example 4, the subject matter of Example 3 includes, wherein the preconfigured time duration is based on a type of load associated with the power load. In Example 5, the subject matter of Examples 1-4 includes, wherein the fault condition is based on a charge amount associated with the power load current, and to detect the fault condition the controller circuit is configured to: determine the charge amount is greater than a preconfigured charge threshold level. In Example 6, the subject matter of Examples 1-5 includes, wherein the fault condition is based on a power condition associated with the power load current, and to detect the fault condition the controller circuit is configured to: determine power associated with the power load current and a voltage designation of the electrical circuit is greater than a preconfigured power threshold level. In Example 7, the subject matter of Examples 1-6 includes, a voltage sensor adapted to be connected between the second set of switchable contacts and determine voltage across the second set of switchable contacts. In Example 8, the subject matter of Example 7 includes, wherein the fault condition is based on power associated with the power load current and the voltage across the second set of switchable contacts. In Example 9, the subject matter of Example 8 includes, wherein to detect the fault condition the controller circuit is configured to: determine the power associated with the power load current and the voltage across the second set of switchable contacts is greater than a preconfigured power threshold level. In Example 10, the subject matter of Examples 7-9 includes, wherein the fault condition is based on a presence of a fault arc in the arc suppressor. In Example 11, the subject matter of Example 10 includes, wherein to detect the fault condition the controller circuit is configured to: determine the power load current is higher than a preconfigured current threshold level; and determine the voltage across the second set of switchable contacts is higher than a preconfigured voltage threshold level. In Example 12, the subject matter of Examples 1-11 includes, an over-current protection circuit comprising a plurality of fusible elements and configured to couple the first set of switchable contacts with a power source. In Example 13, the subject matter of Examples 1-12 includes, wherein the controller circuit is configured to sequence activation or deactivation of the first set of switchable contacts and the second set of switchable contacts based on a contact control signal, wherein during the activation, the first set of switchable contacts is activated prior to activation of the second set of switchable contacts, and during the deactivation, the second set of switchable contacts is deactivated prior to deactivation of the first set of switchable contacts. In Example 14, the subject matter of Example 13 includes, a first power switching circuit operatively coupled to the first pair of terminals and the controller circuit, the first power switching circuit configured to switch power from an external power source and to trigger the activation or the deactivation of the first set of switchable contacts based on a first logic state signal from the controller circuit. In Example 15, the subject matter of Example 14 includes, wherein the first power switching circuit is configured to supply power to the first pair of terminals to trigger the activation of the first set of switchable contacts when the first logic state signal from the controller circuit comprises a logic high state. In Example 16, the subject matter of Examples 14-15 includes, wherein the first power switching circuit is configured to disconnect power to the first pair of terminals to trigger the deactivation of the first set of switchable contacts when the first logic state signal from the controller circuit comprises a logic low state. In Example 17, the subject matter of Examples 14-16 includes, a second power switching circuit operatively coupled to the second pair of terminals and the controller circuit, the second power switching circuit configured to switch power from the external power source and to trigger the activation or the deactivation of the second set of switchable contacts based on a second logic state signal from the controller circuit. In Example 18, the subject matter of Example 17 includes, wherein the second power switching circuit is configured to supply power to the second pair of terminals to trigger the activation of the second set of switchable contacts when the second logic state signal from the controller circuit comprises a logic high state. In Example 19, the subject matter of Example 18 includes, wherein the second power switching circuit is configured to disconnect power to the second pair of terminals to trigger the deactivation of the second set of switchable contacts when the second logic state signal from the controller circuit comprises a logic low state. In Example 20, the subject matter of Example 19 includes, wherein the first logic state signal and the second logic state signal are generated based on the contact control signal. In Example 21, the subject matter of Examples 17-20 includes, wherein the controller circuit is configured to: configure the first logic state signal to trigger the activation of the first set of switchable contacts, when the contact control signal indicates an energized state for the first and second set of switchable contacts and the first and second set of switchable contacts are unpowered; initiate a first timer based on the activation of the first set of switchable contacts; and configure the second logic state signal to trigger the activation of the second set of switchable contacts, when the first timer expires. In Example 22, the subject matter of Example 21 includes, wherein the controller circuit is to: configure the second logic state signal to trigger the deactivation of the first set of switchable contacts, when the contact control signal indicates a de-energized state for the first and second set of switchable contacts and the first and second set of switchable contacts are powered via the external power source; initiate a second timer based on the deactivation of the second set of switchable contacts; and configure the first logic state signal to trigger the deactivation of the first set of switchable contacts, when the second timer expires. In Example 23, the subject matter of Examples 1-22 includes, wherein the first set of switchable contacts are configured to break or make a first connection under no current, and the second set of switchable contacts are configured to break or make a second connection under current. In Example 24, the subject matter of Examples 1-23 includes, wherein the first set of switchable contacts comprises a first relay coil and first relay contacts, and the second set of switchable contacts comprises a second relay coil and second relay contacts, the second relay contacts coupled to the arc suppressor. In Example 25, the subject matter of Examples 13-24 includes, wherein the contact control signal is a logic level control signal, and the electrical circuit further comprises: a signal converter circuit configured to convert a signal indicative of energization status of the first set of switchable contacts and the second set of switchable contacts into the logic level control signal. In Example 26, the subject matter of Example 25 includes, wherein the signal converter circuit comprises a plurality of current limiting elements coupled to a bridge rectifier. In Example 27, the subject matter of Examples 1-26 includes, a first current sensor operatively coupled to the first pair of terminals, the first current sensor configured to generate a first sensed current signal associated with detected current across the first set of switchable contacts; and a second current sensor operatively coupled to the second pair of terminals, the second current sensor configured to generate a second sensed current signal associated with detected current across the second set of switchable contacts. In Example 28, the subject matter of Example 27 includes, wherein the first sensed current signal is indicative of a magnitude of the detected current across the first set of switchable contacts, and the second sensed current signal is indicative of a magnitude of the detected current across the second set of switchable contacts. In Example 29, the subject matter of Examples 27-28 includes, wherein the first sensed current signal is indicative of presence or absence of current across the first set of switchable contacts, and the second sensed current signal is indicative of presence or absence of current across the second set of switchable contacts. In Example 30, the subject matter of Examples 27-29 includes, wherein the first current sensor comprises a first reverse polarity protection element coupled to a first solid state relay, and wherein the first solid state relay is configured to output the first sensed current signal. In Example 31, the subject matter of Example 30 includes, wherein the second current sensor comprises a second reverse polarity protection element coupled to a second solid state relay, and wherein the second solid state relay is configured to output the second sensed current signal. In Example 32, the subject matter of Examples 1-31 includes, a status indicator coupled to the controller circuit, the status indicator configured to provide an indication of the detected fault condition. Example 33 is a system, comprising: a first pair of terminals adapted to be connected across a first set of switchable contacts; a second pair of terminals adapted to be connected across a second set of switchable contacts; an arc suppressor adapted to be coupled to the second set of switchable contacts; a current sensor configured to measure a power load current associated with a power load coupled to the second set of switchable contacts; a voltage sensor configured to measure contact voltage across the second set of switchable contacts; and a controller circuit operatively coupled to the current sensor, the voltage sensor, and the first and second pairs of terminals, the controller circuit configured to: detect a fault condition based on one or both of the power load current and the contact voltage; and sequence deactivation of the first set of switchable contacts and the second set of switchable contacts based on the detected fault condition. In Example 34, the subject matter of Example 33 includes, wherein the fault condition is based on a current level, and to detect the fault condition the controller circuit is configured to: determine the power load current is higher than a preconfigured current threshold level. In Example 35, the subject matter of Example 34 includes, wherein to detect the fault condition the controller circuit is configured to: determine the power load current is higher than the preconfigured current threshold level for a preconfigured time duration. In Example 36, the subject matter of Examples 33-35 includes, wherein the fault condition is based on a charge amount associated with the power load current, and to detect the fault condition the controller circuit is configured to: determine the charge amount is greater than a preconfigured charge threshold level. In Example 37, the subject matter of Examples 33-36 includes, wherein the fault condition is based on a power condition associated with the power load current, and to detect the fault condition the controller circuit is configured to: determine power associated with the power load current and a voltage designation of the first and second sets of switchable contacts is greater than a preconfigured power threshold level. In Example 38, the subject matter of Examples 33-37 includes, wherein the fault condition is based on power associated with the power load current and the voltage across the second set of switchable contacts, and to detect the fault condition the controller circuit is configured to: determine the power associated with the power load current and the voltage across the second set of switchable contacts is greater than a preconfigured power threshold level. In Example 39, the subject matter of Examples 33-38 includes, wherein the fault condition is based on a presence of a fault arc in the arc suppressor, and to detect the fault condition the controller circuit is configured to: determine the power load current is higher than a preconfigured current threshold level; and determine the voltage across the second set of switchable contacts is higher than a preconfigured voltage threshold level. In Example 40, the subject matter of Examples 33-39 includes, wherein during the deactivation, the second set of switchable contacts is deactivated prior to deactivation of the first set of switchable contacts. Example 41 is a method, comprising: coupling a signal converter circuit to a pair of terminals, the signal converter circuit configured to convert a signal indicative of energization status of a first set of switchable contacts and a second set of switchable contacts into a logic level control signal, the signal received from a driver circuit via the pair of terminals; coupling a current sensor to the second set of switchable contacts, the current sensor configured to measure a power load current associated with a power load coupled to the second set of switchable contacts; coupling a voltage sensor to the second set of switchable contacts, the voltage sensor configured to measure contact voltage across the second set of switchable contacts; coupling a controller circuit to the current sensor and the voltage sensor, the controller circuit configured to detect a fault condition based on one or both of the contact voltage and the power load current, and sequence activation or deactivation of the first set of switchable contacts and the second set of switchable contacts based on the logic level control signal and the fault condition; and coupling a status indicator to the controller circuit, the status indicator configured to provide an indication of the detected fault condition. In Example 42, the subject matter of Example 41 includes, coupling an arc suppressor in parallel with the second set of switchable contacts. In Example 43, the subject matter of Example 42 includes, wherein the fault condition is based on a presence of a fault arc in the arc suppressor, and to detect the fault condition the controller circuit is configured to: determine the power load current is higher than a preconfigured current threshold level; and determine the voltage across the second set of switchable contacts is higher than a preconfigured voltage threshold level. In Example 44, the subject matter of Examples 41-43 includes, wherein the fault condition is based on a current level, and to detect the fault condition the controller circuit is configured to determine the power load current is higher than a preconfigured current threshold level. Example 45 is at least one machine-readable medium including instructions that, when executed by processing circuitry, cause the processing circuitry to perform operations to implement of any of Examples 1-44. Example 46 is an apparatus comprising means to implement of any of Examples 1-44. Example 47 is a system to implement of any of Examples 1-44. Example 48 is a method to implement of any of Examples 1-44. The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments. These embodiments are also referred to herein as “examples.” Such examples may include elements in addition to those shown and described. However, the present inventor also contemplates examples in which only those elements shown and described are provided. All publications, patents, and patent documents referred to in this document are incorporated by reference herein in their entirety, as though individually incorporated by reference. In the event of inconsistent usages between this document and those documents so incorporated by reference, the usage in the incorporated reference(s) should be considered supplementary to that of this document; for irreconcilable inconsistencies, the usage in this document controls. In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. In addition, techniques, systems, subsystems, and methods described and illustrated in the various embodiments as discrete or separate may be combined or integrated with other systems, modules, techniques, or methods without departing from the scope of the present disclosure. Other items shown or discussed as coupled or directly coupled or communicating with each other may be indirectly coupled or communicating through some interface, device, or intermediate component whether electrically, mechanically, or otherwise. Other examples of changes, substitutions, and alterations are ascertainable by one skilled in the art and could be made without departing from the scope disclosed herein. The above description is intended to be, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to comply with 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, the inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment. | 94,043 |
11862409 | DETAILED DESCRIPTION OF THE INVENTION Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting the present disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises”, “includes”, or the like when used herein, specify the presence of stated features, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, or combinations thereof. According to an embodiment of the present disclosure, an operation apparatus for a vehicle, a vehicle including the same, etc. may be provided. The operation apparatus may be used to operate various devices included in a vehicle. For example, devices operated by the operation apparatus (hereinafter referred to as a device to be operated) may include a navigation device, an air conditioning device, a sound device, a lighting device, a door lock device, a door opening or closing device, a motor/engine starting device, a driving speed control device, etc. Therefore, the vehicle according to the embodiment of the present disclosure may include the operation apparatus and at least one or more devices to be operated by the operation apparatus. The operation apparatus and the device to be operated may be electrically connected to each other. The operation apparatus is installed in a vehicle and includes a button manipulated by a user. The operation apparatus may be provided to constitute a part of a vehicle. The part to which the operation apparatus is applied may be primarily an interior part of a vehicle. For example, the interior part may be a door trim, a ceiling panel, a dashboard, a console, a seat, an armrest, and the central part of a steering wheel (hub), etc. Embodiments of the present disclosure will be mainly focused on application of the operation apparatus to an interior part of a vehicle. The structure and operation of the operation apparatus are exemplified inFIGS.1to6. As illustrated inFIG.1, the operation apparatus includes: a panel1constituting an interior part of a vehicle; and at least one operation module assembly5provided on the panel1. The panel1has a panel surface and a panel back surface. The panel1may be configured such that, depending on the type, shape, etc. of the interior part, the panel surface provides only a part of the surface of an interior part or the panel surface provides the entire surface of the interior part. The panel1has a first opening2A (shown inFIGS.4-6) and a second opening2B. Each of these openings2A,2B is provided to penetrate the panel1through the panel surface and the panel back surface. The operation module assembly5includes a first operation module10A (shown inFIGS.4-6) and a second operation module10B. The operation modules10A and10B respectively include buttons11A (shown inFIGS.4-6) and11B manipulated by a user and are configured to operate, for example in a touch manner. The first button11A, which is a button of the first operation module10A, is disposed at the front end of the first operation module10A, and the second button11B, which is a button of the second operation module10B, is disposed at the front end of the second operation module10B, thus the first operation module10A and the second operation module10B have the front parts including the front ends composed of the button11A and the button11B, respectively. The first operation module10A and the second operation module10B are moved in the front-back direction (refer to the Y-axis direction) with respect to the first opening2A and the second opening2B, respectively, of the panel1, and the buttons11A and11B that move together with the operation modules10A and10B, respectively, may appear and disappear through the first opening2A and the second opening2B, respectively. In order to make the buttons11A and11B appear and disappear, the buttons11A and11B may protrude in an embossed form with respect to the panel surface to reveal their positions and/or shapes (seeFIGS.5and6). The buttons11A and11B may be recessed in an engraved form rather than an embossed form with respect to the panel surface in order to reveal their positions and/or shapes. Depending on the implementation conditions, etc., the first opening2A and the second opening2B may be provided in one integrated form, and the first operation module10A and the second operation module10B may be moved in the front-back direction (refer to the Y-axis direction) with respect to the integrated opening. The operation apparatus further includes a skin30covering the surface of the panel and the buttons11A and11B to provide a finished surface. The skin30may be sized to cover some or all of the panel surface including the openings2A and2B of the panel1. The skin30is flexible so that when the buttons11A and11B are moved, each of the parts covering the buttons11A and11B (the parts that block the openings2A and2B) is deformed by the buttons11A and11B, respectively, and the shape of the finished surface may change. For example, parts covering the buttons11A and11B may be protruded by the buttons11A and11B in a generally flat shape of the finished surface (refer toFIGS.5and6). When the finished surface is restored to the generally flat shape, the shapes of the buttons11A and11B are hidden, and thus it is possible to prevent the interior of the vehicle from being cluttered with the buttons11A and11B (seeFIGS.1and4). The skin30may be bonded to the panel surface. In addition, the skin30may be precisely deformed and moved together with the buttons11A and11B when each of the parts covering the buttons11A and11B (the parts that block the openings2A and2B) is bonded to the surfaces of the buttons11A and11B, respectively. In particular, bonding of the skin30to the surface of the buttons11A and11B may be desired when the buttons11A and11B are retractable against the panel surface. The bonding of the skin30to the panel surface and/or the bonding of the skin30to the surfaces of the buttons11A and11B may be made firmly by an adhesive or the like. As illustrated inFIGS.1,4,5and6, the operation module assembly5further includes a base21disposed at a rear of the panel1, and a base cover22detachably coupled to the base21at a rear of the base21. The base21and the base cover22constitute the case20. The base21and the base cover22coupled to each other are configured to provide an accommodating space23therebetween which is partially or wholly blocked from the outside. The base21may be mounted on the back side of the panel by means of fastening elements24such as bolts. The base21has a first through region25A and a second through region25B respectively facing the openings2A and2B of the panel1. For example, the through regions25A and25B may be provided in the form of a hole. Depending on implementation conditions, etc., the first through region25A and the second through region25B may be provided in an integrated form. The first operation module10A and the second operation module10B are, in a state of being inserted into the first through region25A and the second through region25B respectively of the base21, provided to be movable between a first position and a second position spaced apart from each other in the front-back direction (refer to the Y-axis direction) through the opening2of the panel1. The first position is a position where the buttons11A and11B are accommodated in the openings2A and2B, and the buttons11A and11B are formed such that the surfaces thereof are flush with the panel surface when the operation modules10A and10B are located in the first position. The second position is located forward of the first position and is a position where the buttons11A and11B protrude from the panel surface. When the operation modules10A and10B are located in the first position, the skin30may hide the buttons11A and11B by providing a finished surface in a generally flat shape (seeFIGS.1and4). When the operation modules10A and10B are moved to the second position so that the buttons11A and11B protrude from the panel surface, the skin30may be deformed into a shape in which parts covering the buttons11A and11B protrude by the buttons11A and11B to reveal the positions of the buttons11A and11B (seeFIGS.5and6). Depending on implementation conditions, etc., the second position may be a position in which the buttons11A and11B are recessed with respect to the panel surface while being located rearward of the first position. In this case, when the operation modules10A and10B are moved to the second position, the skin30may be deformed into a shape in which the parts covering the buttons11A and11B are recessed to reveal the positions of the buttons11A and11B. The first operation module10A and the second operation module10B are arranged at regular intervals so as to be spaced apart from each other in the left-right direction (refer to the X-axis direction), which is one of the directions orthogonal to the front-back direction (refer to the Y-axis direction). The first opening2A and the second opening2B for the protruding and retracting of the first operation module10A and the second operation module10B, and the first through region25A and the second through region25B into which the first operation module10A and the second operation module10B are inserted are also arranged in the left-right direction (refer to the X-axis direction). For example, each of the first operation module10A and the second operation module10B, the first opening2A and the second opening2B, and the first through region25A and the second through region25B may be arranged in the up-down direction (refer to the Z-axis direction) as another direction orthogonal to the front-back direction, or in another direction other than the left-right direction and the up-down direction. Although not shown, the first operation module10A and the second operation module10B may be precisely moved in the front-back direction (refer to the Y-axis direction) with respect to the openings2A and2B by a first guide and a second guide, respectively. For example, each of the guides may include guide pins provided on the base21. The guide pins of the first guide for guiding the first operation module10A and the guide pins of the second guide for guiding the second operation module10B may be respectively arranged around the first through region25A and the second through region25B in the accommodating space23. The first operation module10A and the second operation module10B each have guide holes into which the guide pins of the first guide are inserted and the guide pins of the second guide are inserted, and may be moved according to the guidance of the guide pins. The operation module assembly5further includes a drive unit40for moving the operation modules100A and10B in the front-back direction with respect to the openings2A and2B to position the operation modules10A and10B in the first position or the second position. For reference, the drive unit40is schematically represented inFIGS.4to6. By the drive unit40, the operation modules10A and10B may move forward from the first position to the second position. Accordingly, when the operation modules10A and10B are located in the second position, the buttons11A and11B protrude from the panel surface, and the skin30is deformed into a shape in which parts covering the buttons11A and11B protrude (seeFIGS.5and6). Of course, if the second position is a position located rearward of the first position and the buttons11A and11B are recessed with respect to the panel surface, the skin30may be deformed into a shape in which the parts covering the buttons11A and11B are recessed when the operation modules10A and10B are located in the second position. Conversely, by the drive unit40, the operation modules10A and10B may be move backward from the second position to the first position. Accordingly, when the operation modules10A and10B are located in the first position, the surfaces of the buttons11A and11B are flush with the panel surface, and the skin30is restored to provide a generally flat finished surface (seeFIGS.1and4). Referring toFIGS.1and2, the operation apparatus further includes: a user detection sensor50for detecting a user's action state for manipulating the buttons11A and11B; and a control unit60for controlling the operation modules10A and10B and the drive unit40on the basis of a detection signal from the user detection sensor50. As shown inFIG.1, the user detection sensor50may be provided on the side of the openings2A,2B in the panel surface. The user detection sensor50may include at least one sensing element. For example, the user detection sensor50may include a first sensing element for detecting a user's action state for manipulating the first button11A and a second sensing element for detecting a user's action state for manipulating the second button11B, and the first and second sensing elements may be respectively disposed around the first opening2A and the second opening2B. Alternatively, the user detection sensor50may be configured to detect both the user's action state for manipulating of the first button11A and the user's action state for manipulating of the second button11B using a single sensing element. In the user detection sensor50, the sensing element may be a proximity sensor that detects whether a user's body, such as a hand, is in proximity to the first button11and to the second button11B. To be specific, the user detection sensor50may be an optical proximity sensor, a magnetic proximity sensor, an ultrasonic proximity sensor, a high frequency oscillation proximity sensor, a capacitive proximity sensor, or the like. For reference, among these sensors, the optical proximity sensor may include a light emitting element and a light receiving element receiving light from the light emitting element. The light emitting element may be a light emitting diode, and the light receiving element may be a phototransistor. When a detection signal is input from the user detection sensor50while the operation modules10A and10B are located in the first position, the control unit60determines that the user attempts to manipulate the first button11A or the second button11B, and moves the first operation module10A or the second operation module10B from the first position to the second position by the control of the drive unit40(seeFIGS.5and6). When the button11is not manipulated for a preset time after the first operation module10A or the second operation module10B is located in the second position, the control unit60determines that the user does not want to manipulate the button11A or the button11B, and moves the first operation module10A or the second operation module10B from the second position to the first position by the control of the drive unit40(seeFIGS.1and4). The operation modules10A and10B are kept in an inactive state in the first position and are kept in an active state in the second position. To switch the state of the operation modules10A and10B, the control unit60may set the operation modules10A and10B to be in an inactive state when the operation modules10A and10B are in the first position, and control the operation modules10A and10B to be in an active state when the operation modules10A and10B are in the second position. Due to the configuration that allows switching between active and inactive states with respect to the operation modules10A and10B, the user may manipulate the buttons11A and11B to operate a device to be operated when the operation modules10A and10B are located in the second position, and while the operation modules10A and10B are waiting in the first position, it is possible to prevent the buttons11A and11B from being actuated unintentionally by the user, thereby preventing a device to be operated from being unintentionally operated. As illustrated inFIGS.4,5and6, the first operation module10A further includes a light source12A for providing light, and the second operation module10B includes a light source12B for providing light. The light sources12A and12B may be built into the buttons11A and11B to emit the lights toward the surfaces of the buttons11A and11B. The light sources12A and12B may provide lights of various colors. For example, the light sources12A and12B may include at least one light emitting diode. As illustrated inFIG.3, the first button11A and the second button11B are provided with light-transmitting areas13A and13B, respectively, through which lights from the light sources12A and12B pass and light-blocking areas14A and14B, respectively, that block lights from the light sources12A and12B on the surface thereof. Each of the light-transmitting areas10A and13B may be formed to have the shape of characters and/or figures indicating the function of the buttons11A and11B. In the operation modules10A and10B, the light sources12A and12B are maintained in an off state in the first position, and the light sources12A and12B are maintained in an on state in the second position. For this change of state of the light sources12A and12B, the control unit60may control the light sources12A and12B to be turned off when the operation modules10A and10B are located in the first position, and control the light sources12A and12B to be turned on when the operation modules10A and10B are located in the second position. Due to the configuration that allows switching between off and on states with respect to the light sources12A and12B, when the operation modules10A and10B are located in the second position, the active states of the operation modules10A and10B and the positions of the buttons11A and11B may be more accurately recognized by the user. The skin30has a constant light transmittance so that light from the light sources12A and12B may pass through the skin30, and although the user detection sensor50is provided around the openings2A and2B in the panel surface, the user's action state for manipulating the buttons11A and11B may be detected by the user detection sensor50. For example, the skin30may be a sheet having light transmittance by being woven with fibers having flexibility. As illustrated inFIGS.4to6, the drive unit40is configured to have a common drive source43, and to move the selected one of the first operation module10A and the second operation module10B in the front-back direction (refer to the Y-axis direction) by transmitting a drive force from the common drive source43. As previously described, the first operation module10A and the second operation module10B are arranged in the left-right direction (refer to the X-axis direction). The drive source43includes a moving body44that linearly moves in a left-right direction that is the same as the arrangement direction of the first operation module10A and the second operation module10B. The drive source43may be a linear actuator including the moving body44. The moving body44may be moved more precisely in the left-right direction by a guide (X-axis guide,49). The drive source43may further include a rotary motor45. The rotation motor45has male thread formed on the outer periphery of a motor shaft, and the moving body44may have a female screw hole for screwing with the male thread formed on the motor shaft of the rotary motor45. At this time, rotation of the moving body44may be restricted by the guide49guiding the left-right movement of the moving body44or a separate guide. Accordingly, the moving body44may be moved to the left or moved to the right according to the rotation direction of the rotary motor45. The drive unit40further includes a first contact block41A, a second contact block41B, a pressure block46, a first elastic member48A, and a second elastic member48B. The first contact block41A is provided at the rear of the first operation module10A, and the second contact block41B is provided at the rear of the second operation module10B. The first contact block41A and the second contact block41B are arranged in the same left-right direction (refer to the X-axis direction) as the arrangement direction of the first operation module10A and the second operation module10B. The pressure block46is disposed in the region between the first contact block41A and the second contact block41B, is moved in the left-right direction by the drive source43, and comes into contact with the first contact block41A to press the first contact block41A or comes into contact with the second contact block41B to press the second contact block41B, depending on the moving direction. The first contact block41A and the second contact block41B may protrude rearward from the rear portion of the first operation module10A and the rear portion of the second operation module10B, respectively. The pressure block46may be coupled to the moving body44of the drive source43to move together with the moving body44. The first contact block41A has a tapered surface42A that induces forward movement of the first contact block41A as a contact surface pressed by the pressure block46when in contact with the pressure block46, and the second contact block41B has a tapered surface42B that induces forward movement of the second contact block41B as a contact surface pressed by the pressure block46when in contact with the pressure block46. The pressure block46has a first tapered surface47A that presses the first contact block41A when in contact with the first contact block41A to move the first contact block41A forward, and a second tapered surface47B that presses the second contact block41B when in contact with the second contact block41B to move the second contact block41B forward. When the pressure block46is moved toward the first contact block41A in the left-right direction (refer to the X-axis direction) by the drive source43, the first tapered surface47A comes into contact with the tapered surface42A of the first contact block41A, and when the pressure block46is moved toward the second contact block41B in the left-right direction by the drive source43, the second tapered surface47B comes into contact with the tapered surface42B of the second contact block41B. The tapered surface42A of the first contact block41A and the first tapered surface47A of the pressure block46are formed to have inclinations corresponding to each other, while the tapered surface42B of the second contact block41B and the second tapered surface47B of the pressure block46are formed to have inclinations corresponding to each other. To be specific, in order to move the contact blocks41A,41B forward, the first tapered surface47A of the pressure block46is formed in a shape rearwardly inclined at a constant angle as the first tapered surface47A reaches the first contact block41A side from a center of the pressure block46in the left-right direction, and the second tapered surface47B of the pressure block46is formed in a shape rearwardly inclined at a constant angle as the second tapered surface47B reaches the second contact block41B side from center of the pressure block46in the left-right direction. The first tapered surface47A and the second tapered surface47B may be disposed on the left front portion and right front portion of the pressure block46, respectively. The tapered surface42A of the first contact block41A may be disposed opposite to the first tapered surface47A at a rear portion of the first contact block41A. The tapered surface42B of the second contact block41B may be disposed opposite to the second tapered surface47B at the rear portion of the second contact block41B. The tapered surface42A of the first contact block41A and the tapered surface42B of the second contact block41B, as well as the first tapered surface47A and the second tapered surface47B of the pressure block46are for converting the pressing direction of the pressure block46from the left-right direction (refer to the X-axis direction) to the front-back direction (refer to the Y-axis direction). Depending on implementation conditions, etc., the tapered surface42A of the first contact block41A and the tapered surface42B of the second contact block41B may be excluded from the drive unit40, and the first tapered surface47A and the second tapered surface47B of the pressure block46may be excluded from the drive unit40. At least one first elastic member48A is interposed between the first operation module10A and the base21to give an elastic force to the first operation module10A rearward along the front-back direction (refer to the Y-axis direction), while at least one second elastic member48B is interposed between the second operation module10B and the base21to give an elastic force to the second operation module10B rearward along the front-back direction. For example, the first elastic member48A and the second elastic member48B may be coil springs. The drive unit40configured as described above may stand by in a state in which the first tapered surface47A is spaced apart from the tapered surface42A of the first contact block41A and the second tapered surface47B is spaced apart from the tapered surface42B of the second contact block41B as the pressure block46is located in the middle of the region between the first contact block41A and the second contact block41B. At this time, the operation modules10A,10B are both moved rearwardly in the front-back direction by the action of the elastic members48A,48B, and are maintained in the first position (seeFIG.4). In this state, when the drive source43moves the pressure block46in the left-right direction (refer to the X-axis direction) toward the first contact block41A so that the first tapered surface47A of the pressure block46presses the tapered surface42A of the first contact block41A, the first operation module10A is moved forward (move from the first position to the second position) along the front-back direction (refer to the Y-axis direction), and the first elastic member48A is compressed. This is the operation of the drive unit40by the control of the control unit60when the user detection sensor50detects a user's action state for manipulating the first button11A. By this operation, the first operation module10A is positioned in the second position (active state, the first light source is turned on), and the second operation module10B remains in the first position as it is (inactive state, the second light source turned off) (seeFIG.5). On the other hand, when the drive source43moves the pressure block46in the left-right direction (refer to the X-axis direction) toward the second contact block41B so that the second tapered surface47B of the pressure block46presses the tapered surface42B of the second contact block41B, the second operation module10B is moved forward (move from the first position to the second position) along the front-back direction (refer to the Y-axis direction), and the second elastic member48B is compressed. This is the operation of the drive unit40by the control of the control unit60when the user detection sensor50detects a user's action state for manipulating the second button11B. By this operation, the first operation module10A remains in the first position as it is (inactive state, the first light source is turned off), and the second operation module10B is positioned in the second position (active state, the second light source is turned on) (seeFIG.6). When the button11A or11B is not actuated for a set time after the first operation module10A or the second operation module10B is positioned in the second position, the pressure block46moved toward the first contact block41A or the second contact block41B in the left-right direction (refer to the X-axis direction) is moved to the middle of the region between the first contact block41A and the second contact block41B by the drive source43, and the first operation module10A or the second operation module10B in the second position is moved rearward (move from the second position to the first position) along the front-back direction (refer to the Y-axis direction) by the restoring force of the elastic member48A or48B. Meanwhile, the operation apparatus may have a front region and a rear region, in which the second position with respect to the first operation module10A and the second position with respect to the second operation module10B are positioned relatively forward and positioned relatively rearward, respectively. Of course, the rear region is located behind the front region. The operation apparatus is configured such that, the buttons11A and11B may protrude at different heights as the operation modules10A and10B are moved from the first position to a first distance or a second distance to be located in the front region or the rear region of the second position. That is, the buttons11A and11B may protrude to a second height when the operation modules10A and10B are located in the front region, and may protrude to a first height that is lower than the second height when the operation modules10A and10B are located in the rear region. In this case, if the second position is a position located rearward of the first position and a position where the buttons11A and11B are recessed with respect to the panel surface, the buttons11A and11B may be recessed to different heights (depths). In this regard, the operation apparatus is configured such that, the operation modules10A and10B may be moved the first distance from the first position according to the detection signal of the user detection sensor50to be located in the rear region of the second position, and the buttons11A and11B may protrude to the first height, or the operation modules10A and10B may be moved the second distance from the first position according to the detection signal of the user detection sensor50to be located in the front region of the second position, and the buttons11A and11B may protrude to the second height. In addition, depending on whether the operation modules10A and10B are located in the rear region or in the front region, the buttons11A and11B may be manipulated to perform a first function and a second function as different operating functions. For example, a first device to be operated and a second device to be operated may be operated as respective operations corresponding to the first function and the second function of the first button11A, and a third device to be operated and a fourth device to be operated may be operated as respective operations corresponding to the first function and the second function of the second button11B. As another example, when the devices to be operated are a sound device and a lighting device, the volume increase and volume decrease of the sound device are performed as respective operations corresponding to the first function and the second function of the first button11A, while the lighting device may be turned on and off as each operation corresponding to the first function and the second function of the second button11B. With this configuration, since multiple functions may be performed with one button, the number of buttons required to be provided may be reduced. To implement multiple functions with one button, the user detection sensor50may detect, on the basis of the user's action state for manipulating the first button11A, whether a user's hand or the like that is in the proximity of the first button11A is located in a first range or in a second range based on the first button11A, and on the basis of the user's action state for manipulating the second button11B, whether a user's hand or the like that is in the proximity of the second button11B is located in a third range or in a fourth range based on the second button11B. For example, the region of the first range and the region of the third range may be a range in which the user's hand or the like that is in the proximity of the first button11A is at a relatively close distance based on the first button11A and a range in which the user's hand or the like that is in the proximity of the second button11B is at a relatively close distance based on the second button11B, respectively, and the region of the second range and the region of the fourth range may be a range in which the user's hand or the like that is in the proximity of the first button11A is at a relatively long distance based on the first button11A and a range in which the user's hand or the like that is in the proximity of the second button11B is at a relatively long distance based on the second button11B, respectively. As another example, the first range and the second range may be an upper region and a lower region based on the first button11A, and the third range and the fourth range may be an upper region and a lower region based on the second button11B. In this regard, when the user detection sensor50detects that the user's hand is positioned in the first range (or the second range) while the operation modules10A and10B are located in the first position, the control unit60may determine that the user is attempting to manipulate a device so that the first function (or the second function) of the first button11A is performed and may move the first operation module10A to the rear region (or the front region) of the second position by the control of the drive unit40. Alternatively, when the user detection sensor50detects that the user's hand is positioned in the third range (or the fourth range), the control unit60may determine that the user is attempting to manipulate another device so that the first function (or the second function) of the second button11B is performed and may move the second operation module10B to the rear region (or the front region) of the second position by the control of the drive unit40. In addition, by the control unit60, the operation modules10A and10B may be maintained in a state in which the light sources12A and12B emit lights of different colors depending on whether the operation modules10A and10B are located in the front region or in the rear region of the second position. The first light source12A may emit the light of a first color and the light of a second color depending on whether the first operation module10A is located in the rear region or in the front region, respectively, while the second light source12B may emit the light of a third color and the light of a fourth color depending on whether the second operation module10B is located in the rear region or in the front region, respectively. Due to this configuration, it is possible for the user to more accurately recognize whether the operation modules10A and10B are located in the front region or in the rear region. The effects of the present disclosure is not limited to the disclosed embodiments and the accompanying drawings and may be variously modified by those skilled in the art without departing from the technical spirits of the present disclosure. In addition, the technical spirits described in the embodiments of the present disclosure may be implemented independently, or may be implemented in combination of two or more. | 35,291 |
11862410 | DESCRIPTION OF THE EMBODIMENTS FIG.1is an exploded view of a key structure according to an embodiment of the disclosure.FIG.2depicts the key structure ofFIG.1from another viewing angle.FIG.3is a side view of the key structure ofFIG.1after the key structure is assembled. With reference toFIG.1toFIG.3together, in this embodiment, a key structure100A includes a base110, a light sensing module120, a carrier130, a magnetic member141, a cap150, and a scissor structure160. The base110includes a support114and a thin film circuit112disposed thereon, and the support114overlaps the thin film112and enables a related engaging part114ato be connected to the scissor structure160. The light sensing module120is disposed below the base110and corresponds to an opening111. The carrier130is located above the base110. The magnetic member141is disposed on the carrier130. The scissor structure160is connected (pivotally connected) between the base110and the carrier130. The cap150is disposed on the carrier130. The cap150includes a cap body151and a spring152, and the cap body151is propped against the thin film circuit112through the spring152. Accordingly, the carrier130and the cap150disposed thereon may move up and down relative to the base110through the scissor structure160. With reference toFIG.1, when an external force is applied to the key structure100A, the cap150and the carrier130drive the scissor structure160to change its state and to move in a negative Z axis direction until the cap150activates a switch of the thin film circuit112. In contrast, when the external force being pressed on the key structure100A is released, an elastic force that the spring152accumulates when pressing is applied may drive the cap150and the carrier130to move in a positive Z axis direction and may drive the scissor structure160to restore an original state and return to an original position. The switch of thin film circuit112is turned off as well. Moreover, in this embodiment, the cap150is adapted to be assembled to the carrier130through a magnetic attracting force of the magnetic member141or is adapted to be detached from the carrier130via overcoming the magnetic attracting force of the magnetic member141. In other words, a user may replace the cap150in the key structure100A of this embodiment, so the key structure100A may be conveniently used in a different operating environment as required, and related description is provided in a later paragraph in detail. In this embodiment, the key structure100A further includes a magnetic member142disposed on an inner surface of the cap150and is located next to a sensing region171, and a region where the magnetic member142is disposed at the cap150is required to be misaligned with the sensing region171so that the two do not overlap. Herein, the magnetic members141and142are configured to generate a required magnetic attracting force so that the cap150may be securely assembled onto the carrier130; nevertheless, the embodiment is not intended to limit how the magnetic members are disposed. For instance, in an embodiment that is not shown, only one magnetic member may be provided and is disposed at only one of the cap or the carrier, the other one of the cap and the carrier is made of a material exhibiting magnetic permeability, and the magnetic attracting force which is required during assembly may also be generated in this way. In this embodiment, after the light sensing module120projects light on the sensing region171of the cap150along a path, the sensing region171projects reflected light to the light sensing module120along the path. To be specific, the light sensing module120of this embodiment includes a light source and a receiver (not shown) and is, for example, a light-emitting diode (LED) or a photodiode (PD). As shown inFIG.1andFIG.2, the dot-dashed lines extending from the light sensing module120to the cap150are configured to depict paths and ranges of light. The light emitted from the light source of the light sensing module120sequentially passes through the opening111, an internal part of the scissor structure160, a passing-through region131of the carrier130, and the sensing region171on the cap150. Since the sensing region171exhibits certain optical properties and thus reflects the light, the reflected light is transmitted back to the light sensing module120along the abovementioned path in an opposite direction, so that the PD may sense the reflected light. Herein, the optical properties include at least one of a pattern or a color level. Accordingly, in order to ensure that a traveling path of the light or the reflected light is unobstructed and is not blocked, related members along the light path are required to be defined in the key structure100A of this embodiment. The base110has the opening111so that the light is allowed to pass through. The carrier130is located on the traveling path and cannot be avoided, so the carrier130is actually made of a light transmissive material, such as transparent polycarbonate (PC). In this way, at least part (e.g., the passing-through region131) of or the entire region of the carrier130is light transmissive. That is, at least part of the carrier130is transparent and is located on the path. Moreover, an orthogonal projection of the magnetic member141on the base110is not overlapped with an orthogonal projection of the light sensing module120on the base110, so that the magnetic member141is not located on the traveling path of the light. That is, the magnetic member141located on the carrier130is required to be misaligned and not to be overlapped with the passing-through region131. Similarly, the above restrictions applied to the magnetic member141are also applied to the magnetic member142. Note that the scissor structure160of this embodiment is neither located on the traveling path of the light nor the traveling path of the reflected light, so the scissor structure160is prevented from blocking the light or the reflected light. To be specific, the scissor structure160includes a first linking member161and a second linking member162pivotally connected to each other and are both pivotally connected to the engaging part114aof the support114of the base110. Herein, the carrier130is pivotally connected to the first linking member161and the second linking member162, and the second linking member162has an avoidance space to allow the light or the reflected light to pass through. Specifically, orthogonal projections of the first linking member161and the second linking member162on the base110together form a closed contour, and an orthogonal projection of the avoidance space on the base110belongs to one part of the closed contour. That is, as shown inFIG.1andFIG.2, the dot-dashed line representing the traveling path of the light or the reflected light passes through internal ranges of the first linking member161and the second linking member162and is adjacent to an inner edge space of the second linking member162. In the scissor structure160of this embodiment, since the light or the reflected light is closer to the second linking member162than the first linking member161, a volume of the second linking member162has to be further limited so that the avoidance space may be formed. That is, as the volume of the second linking member162is limited, an area of the orthogonal projection of the second linking member162on the base110is substantially less than an area of the orthogonal projection of the first linking member161(not requiring the avoidance space) on the base110. Accordingly, the second linking member162of this embodiment is made of a metal material, and the first linking member161is made of a plastic material or made of polyoxymethylene (POM), so that the second linking member162may still feature structural strength of a certain degree with a less volume. A manner of manufacturing the first linking member161and the second linking member162is not limited herein. Generally, the linking member (e.g., the first linking member161but is not limited thereto) not requiring to the avoidance space may feature a larger volume and may be made of a plastic or POM material, and the linking member (e.g., the second linking member162but is not limited thereto) in need of the avoidance space may feature a smaller volume but may still be made of a metal material on the premise that the structural strength is required to be maintained. In this regard, insert molding may be adopted for the scissor structure160to combine the first linking member161with the second linking member162. Certainly, in another embodiment that is not shown, the first linking member and the second linking member of the scissor structure may both be made of a metal material and may both include avoidance spaces. Accordingly, an assembly direction is not required to be considered when the key structure is assembled, and that assembly may be performed more conveniently. FIG.4is an exploded view of a key structure according to another embodiment of the disclosure. With reference toFIG.4, most of the members of a key structure100B of this embodiment are identical to the members of the key structure100A provided in the foregoing embodiments and thus are not described herein. The key structure100B has a cap250and a scissor structure260which are different from that of the key structure100A, and description of the cap250is provided in a later paragraph. In this embodiment, the scissor structure260is transparent, and a part of the scissor structure260is located on the traveling path of the light or the reflected light. To be specific, the scissor structure260of this embodiment includes a first linking member261and a second linking member262pivotally connected to an engaging part114bof the support114of the base110respectively. Moreover, a part of the first linking member261and a part of the second linking member262are both transparent and are both located on the traveling path of the light or the reflected light. As shown inFIG.4, the first linking member261has a passing-through part261aand a non-passing-through part261b, and the second linking member262has a passing-through part262aand a non-passing through part262b. Herein, the passing-through parts261aand262aare located at a same side, and the non-passing-through parts261band262bare located at the other opposite side. Herein, each of the first linking member261and the second linking member262is formed through two-material injection molding, that is, the transparent polycarbonate (PC) is combined with the nontransparent plyoxymethylene (POM). The passing-through parts261aand262aare formed on the transparent PC, and the non-passing-through parts261band262bare formed on the nontransparent POM. In this way, in each of the first linking member261and the second linking member262, the transparent material is combined with the non-transparent material, and a portion of the transparent material is located on the traveling paths of the light and the reflected light, so that the light or the reflected light may pass through the passing-through parts261aand262a. In an embodiment that is not shown, the entire scissor structure may be designed to be transparent, so that the assembly direction is not required to be considered during assembly, and that assembly may be performed more conveniently. FIG.5is a schematic view of a keyboard according to an embodiment of the disclosure.FIG.6is a schematic view of electrical connections among part of members of the keyboard ofFIG.5.FIG.7is a flow chart of cap replacement in a keyboard according to an embodiment of the disclosure. As described in the foregoing embodiments, types of the caps150and250of the key structure100A and the key structure100B are different, so that the user may perform replacement for different usage scenarios. Herein, in a keyboard10of this embodiment, when the user intends to replace a key structure100, the keyboard10may accordingly determine a type of a cap and thus provides a corresponding function command in the following operations. Specifically, the keyboard10of this embodiment further includes a control unit180electrically connected to the thin film circuit112and the light sensing module120of the key structure100, and the key structure100provided herein is similar to the key structure100A or the key structure100B as described above. Note that as described above, the key structure100A differs from the key structure100B in the cap150and the cap250. The cap150includes the cap body151and the spring152(e.g., a linear spring), and a linear key structure is thereby formed. In the linear key structure provided herein, the key structure100A may continuous control speed, strength of action, direction, and process of action along with different degrees of pressing applied to the cap150. From another perspective, the cap250includes the cap body151and a rubber dome252, and the key structure100B formed by the cap250and other members belongs to a standard key structure, that is, a simple command of turning on/off is provided only. Since the cap150and the cap250are both assembled to the carrier130through a magnetic attracting force, the user may replace the cap150or the cap250any time as required. Accordingly, when step S01is performed by the user, a cap is replaced (for example, the cap150and the cap250may be replaced with each other). Next, in step S02, as the caps150and250are different in types, optical properties of the sensing regions171and172are different. For instance, different patterns or different color levels are provided, and different sensing results are therefore produced after the light sensing module120senses the reflected light. As such, the control unit180may determine the type of a cap (the cap150or the cap250) according to the reflected light generated by the cap (e.g., the cap150or the cap250) and received by the light sensing module120. In addition, with reference toFIG.3again, at the right side of the figure, the cap250ofFIG.4is depicted, so that comparison may be conveniently made. In this embodiment, the control unit180determines the type of the cap according to the optical properties of the reflected light. The optical properties provided herein are properties presented within a period of time after the light sensing module120emits light which is projected to the cap150or250and receives the reflected light, and that a height of the cap150or the cap250relative to the base110is accordingly determined. As shown inFIG.3, the cap body151of the cap150of the key structure100A has a height d1relative to the thin film circuit112of the base110. When the key250of the key structure100B is used for replacement, it can be seen that the key250has a height d2relative to the thin film circuit112, and the height d2is less than the height d1. For instance, when the control unit180accordingly determines that the key structure100A is provided, step S03is performed. The control unit180keeps the light sensing module120activated, and that the light sensing module120continuously senses the cap150. As such, the control unit180accordingly determines pressing applied to the cap150or a position of the cap150relative to the base110. In this way, the control unit180accordingly drives the thin film circuit112to provide a corresponding command, and that an effect produced by the linear key structure is achieved. When the control unit180accordingly determines that the key structure100B is provided, step S04is performed. That is, the control unit180turns off the light sensing module120since the key structure100B at this time requires only a command corresponding to turning on/off. In addition, when the control unit180cannot accordingly determine which key structure is provided, it means that a cap is not assembled to the carrier or other assembly errors may exist. At this time, step S05is performed, and the control unit180sends a warning message to the user through a warning unit and waits for confirmation of a state of the key structure performed by the user. In view of the foregoing, in the embodiments of the disclosure, through the magnetic member disposed on the carrier of the key structure, the cap may be assembled to the carrier thanks to the magnetic attracting force generated by the magnetic member, or the cap may be detached from the carrier by being applied by an external force and overcoming the magnetic attracting force. Further, the light sensing module is disposed at the base and is configured to provide light to the cap and then receive light reflected from the cap, so as to accordingly determine the type of the cap and further drive the thin film circuit to provide a corresponding command to the key structure. Further, in the key structure provided by the embodiments, the orthogonal projection of the magnetic member on the base is not overlapped with the orthogonal projection of the light sensing module on the base, and in this way, the traveling path of the light is unobstructed and is not blocked. In addition, each of the related members on the traveling path of the light or the reflected light is required to have a small volume or is required to be made of a transparent material so that the light (or the reflected light) may pass through easily, and that the sensing process of the light sensing module may thereby be smoothly performed. The scissor structure may be designed to have a small volume according to needs but may be made of a metal material so that structural strength of the scissor structure is ensured. In addition, two-plastic material injection may be adopted for the scissor structure, so that each of the first linking member and the second linking member has both the passing-through region and the non-passing-through region. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents. | 18,148 |
11862411 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Please refer toFIGS.1to7.FIG.1is a schematic top view illustrating the outer appearance of a keyboard device according to an embodiment of the present invention.FIG.2is a schematic perspective view illustrating a key structure of the keyboard device as shown inFIG.1.FIG.3is a schematic exploded view illustrating the membrane circuit board of the key structure as shown inFIG.2.FIG.4is a schematic cross-sectional view illustrating the membrane circuit board of the key structure as shown inFIG.2and taken along the line AA.FIG.5is a schematic top view illustrating a portion of an assembled structure of the membrane circuit board as shown inFIG.3.FIG.6is a schematic top view illustrating another portion of an assembled structure of the membrane circuit board as shown inFIG.3.FIG.7is a schematic top view illustrating a third portion of an assembled structure of the membrane circuit board as shown inFIG.3. For succinctness, only a single key structure and associated components are shown inFIG.2 As shown inFIGS.1and2, the keyboard device1comprises plural key structures10. Each key structure10comprises a keycap11, a base plate12, an elastic element13, a connecting member14and a membrane circuit board15. The base plate12is located under the keycap11. The elastic element13is arranged between the keycap11and the membrane circuit board15. The connecting member14is connected between the keycap11and the base plate12. The membrane circuit board15is arranged between the elastic element13and the base plate12. In an embodiment, these key structures10are classified into some types, e.g., ordinary keys, numeric keys and function keys. When one of the key structures10is depressed by the user's finger, the keyboard device1generates a corresponding text input signal to a computer, and thus the computer executes a corresponding function. For example, when an ordinary key is depressed, a corresponding English letter or symbol is inputted into the computer. When a numeric key is depressed, a corresponding number is inputted into the computer. In addition, the function keys (F1˜F12) can be programmed to provide various quick access functions. Alternatively, the key further includes a Space key, a Shift key or any other similar multiple key with the larger area and length. The components of the key structure10and the relationships between the associated components are similar to those of the conventional technologies, and not redundantly described herein. The membrane circuit board15of the key structure10will be described in more details as follows. Please refer toFIGS.3to7. In an embodiment, the membrane circuit board15comprises a first membrane substrate151, a spacer substrate152, a second membrane substrate153and a third membrane substrate154, which are sequentially stacked on each other from top to bottom. The first membrane substrate151comprises a first gas channel G1and a first conductive contact C1. The first conductive contact C1of the first membrane substrate151is aligned with the first gas channel G1. The spacer substrate152is located under the first membrane substrate151. In addition, the spacer substrate152comprises a first gas hole H1and a second gas hole H2. The first gas channel G1of the first membrane substrate151is in communication with the first gas hole H1and the second gas hole H2. The second membrane substrate153is located under the spacer substrate152. Moreover, the second membrane substrate153comprises a second gas channel G2, a second conductive contact C2, a third gas hole H3and a fourth gas hole H4. The second conductive contact C2of the second membrane substrate153is aligned with the second gas channel G2. The second gas channel G2is in communication with the third gas hole H3and the fourth gas hole H4. Moreover, the second gas channel G2is in communication with the first gas channel G1through the first gas hole H1and the second gas hole H2of the spacer substrate152. The third membrane substrate154is located under the second membrane substrate153. Moreover, the third membrane substrate154comprises a third gas channel G3. The third gas channel G3of the third membrane substrate154is in communication with the second gas channel G2through the third gas hole H3and the fourth gas hole H4of the second membrane substrate153. Please refer toFIGS.3and4again. In an embodiment, the first membrane substrate151further comprises a first flexible circuit board1511and a first adhesive layer1512. The first adhesive layer1512is arranged between the first flexible circuit board1511and the spacer substrate152. The first flexible circuit board1511is adhered on a top surface of the spacer substrate152through the first adhesive layer1512. In an embodiment, the first conductive contact C1of the first membrane substrate151is installed on the first flexible circuit board1511. Particularly, the first conductive contact C1is formed on the surface of the first flexible circuit board1511facing the spacer substrate152. The first gas channel G1is formed in the first adhesive layer1512. Please refer toFIGS.3and4again. In an embodiment, the second membrane substrate153further comprises a second flexible circuit board1531and a second adhesive layer1532. The second adhesive layer1532is arranged between the second flexible circuit board1531and the spacer substrate152. The spacer substrate152is arranged between the first adhesive layer1512and the second adhesive layer1532. The second flexible circuit board1531is adhered on a bottom surface of the spacer substrate152through the second adhesive layer1532. In an embodiment, the second conductive contact C2of the second membrane substrate153is installed on the second flexible circuit board1531. In addition, the third gas hole H3and the fourth gas hole H4of the second membrane substrate153is formed in the second flexible circuit board1531. Particularly, the second conductive contact C2is formed on the surface of the second flexible circuit board1531facing the spacer substrate152. The second conductive contact C2is arranged between the third gas hole H3and the fourth gas hole H4. Moreover, the second gas channel G2is formed in the second adhesive layer1532. Please refer toFIGS.3and4again. In an embodiment, the third membrane substrate154further comprises a third flexible circuit board1541and a third adhesive layer1542. The third adhesive layer1542is arranged between the second flexible circuit board1531and the third flexible circuit board1541. The second flexible circuit board1531is arranged between the second adhesive layer1532and the third adhesive layer1542. The third flexible circuit board1541is adhered on a bottom surface of the second flexible circuit board1531through the third adhesive layer1542. In an embodiment, the third gap channel G3is formed in the third adhesive layer1542. Please refer toFIGS.3and4again. In an embodiment, the spacer substrate152is arranged between the first flexible circuit board1511and the second flexible circuit board1531. Consequently, the first conductive contact C1on the first flexible circuit board1511and the second conductive contact C2on the second flexible circuit board1531are separated from each other by a spacing distance D. Moreover, the spacer substrate152comprises a perforation1520corresponding to the first conductive contact C1and the second conductive contact C2. The first gas channel G1and the second gas channel G2are in communication with the perforation1520of the spacer substrate152. When the first conductive contact C1is penetrated through the perforation1520of the spacer substrate152and contacted with the second conductive contact C2, the corresponding membrane switch is turned on. In an embodiment, the first flexible circuit board1511, the second flexible circuit board1531and the spacer substrate152are made of polyethylene terephthalate (PET) or any other appropriate material. Please refer toFIGS.3and4again. In an embodiment, the first gas hole H1and the second gas hole H2are respectively located at a first side S1and a second side S2of the first spacer substrate152. The first side S1and the second side S2are opposed to each other. Moreover, the first gas hole H1and the second gas hole H2are aligned with each other. Moreover, the third gas hole H3and the fourth gas hole H4are respectively located at a third side S3and a fourth side S4of the second flexible circuit board1531. The third side S3and the fourth side S4are opposed to each other. Moreover, the third gas hole H3and the fourth gas hole H4are aligned with each other. In an embodiment, the first gas hole H1of the spacer substrate152is aligned with the third gas hole H3of the second flexible circuit board1531, and the second gas hole H2of the spacer substrate152is aligned with the fourth gas hole H4of the second flexible circuit board1531. That is, the first gas hole H1and the third gas hole H3are concentric with each other, and the second gas hole H2and the fourth gas hole H4are concentric with each other. Please refer toFIGS.3,4and5. In an embodiment, the first gas channel G1comprises a first middle channel part G11, a first lateral channel part G12and a second lateral channel part G13. The first middle channel part G11is in communication with the first lateral channel part G12and the second lateral channel part G13. The first conductive contact Cl is aligned with the first middle channel part G11. The first lateral channel part G12is in communication with the first gas hole H1of the spacer substrate152. The second lateral channel part G13is in communication with the second gas hole H2of the spacer substrate152. In an embodiment, the first membrane substrate151further comprises a first metal conductor line W1. The first metal conductor line W1is extended from the first conductive contact C1. Moreover, a portion of the first metal conductor line W1is aligned with the first lateral channel part G12of the first middle channel part G11. It is noted that numerous modifications may be made while retaining the teachings of the present invention. For example, in another embodiment, a portion of the first metal conductor line W1is aligned with the second lateral channel part G13of the first gas channel G1. Please refer toFIGS.3,4and6. In an embodiment, the second gas channel G2comprises a second middle channel part G21, a third lateral channel part G22and a fourth lateral channel part G23. The second middle channel part G21is in communication with the third lateral channel part G22and the fourth lateral channel part G23. The second conductive contact C2is aligned with the second middle channel part G21. The third lateral channel part G22is in communication with the third gas hole H3of the second flexible circuit board1531. The fourth lateral channel part G23is in communication with the fourth gas hole H4of the second flexible circuit board1531. In an embodiment, the second membrane substrate153further comprises a second metal conductor line W2. The second metal conductor line W2is extended from the second conductive contact C2. Moreover, a portion of the second metal conductor line W2is aligned with the fourth lateral channel part G23of the second gas channel G2. It is noted that numerous modifications may be made while retaining the teachings of the present invention. For example, in another embodiment, a portion of the second metal conductor line W2is aligned with the third lateral channel part G22of the second gas channel G2. In an embodiment, the first metal conductor line W1and the second metal conductor line W2are silver paste conductor lines. It is noted that the examples of the first metal conductor line W1and the second metal conductor line W2are not restricted. Moreover, the circuit pattern composed of the first conductive contact C1and the first metal conductor line W1is formed on the first flexible circuit board1511by a printing process and determined according to the designated shape. Similarly, the circuit pattern composed of the second conductive contact C2and the second metal conductor line W2is formed on the second flexible circuit board1531by a printing process and determined according to the designated shape. It is noted that the methods of forming the associated circuit patterns are not restricted. Please refer toFIGS.3,4and7again. In an embodiment, the third gas channel G3is an annular gas channel that is arranged along a periphery region of the third adhesive layer1542and formed in the third adhesive layer1542. Moreover, the orthographic projection of the first conductive contact C1or the second conductive contact C2on the third adhesive layer1542forms a projection area R on the third adhesive layer1542. The third gas channel G3is arranged around the projection area R. The operations of the key structure10will be described as follows. When any key structure10as shown inFIG.2is pressed down, the membrane circuit board15is subjected to deformation. Consequently, the first conductive contact C1and the second conductive contact C2are electrically connected with each other, and the corresponding membrane switch is triggered and turned on. Meanwhile, a compressed gas is formed in the region between the first flexible circuit board1511and the second flexible circuit board1531. The first gas channel G1, the second gas channel G2, the first gas hole H1, the second gas hole H2, the third gas hole H3, the fourth gas hole H4and the third gas channel G3are in communication with each other to define plural gas exhaust paths. Consequently, the compressed gas is exited to the surroundings of the membrane circuit board15through the gas exhaust paths simultaneously. Please refer toFIG.4again. In this embodiment, the compressed gas is exited to the surroundings of the membrane circuit board15through the following four gas exhaust paths simultaneously. In the first gas exhaust path, the compressed gas is exited to the surroundings of the membrane circuit board15through the first middle channel part G11, the first lateral channel part G12, the first gas hole H1, the third gas hole H3and the third gas channel G3sequentially (i.e., along the arrow direction A1). In the second gas exhaust path, the compressed gas is exited to the surroundings of the membrane circuit board15through the first middle channel part G11, the third lateral channel part G13, the second gas hole H2, the fourth gas hole H4and the third gas channel G3sequentially (i.e., along the arrow direction A2). In the third gas exhaust path, the compressed gas is exited to the surroundings of the membrane circuit board15through the second middle channel part G21, the third lateral channel part G22, the third gas hole H3and the third gas channel G3sequentially (i.e., along the arrow direction A3). In the fourth gas exhaust path, the compressed gas is exited to the surroundings of the membrane circuit board15through the second middle channel part G21, the fourth lateral channel part G23, the fourth gas hole H4and the third gas channel G3sequentially (i.e., along the arrow direction A4). FIG.8is a schematic perspective view illustrating a membrane circuit board according to another embodiment of the present invention. The structure of the membrane circuit board15aas shown inFIG.8is similar to that of the membrane circuit board15as shown inFIGS.2to7. In comparation with the membrane circuit board15as shown inFIGS.2to7, the membrane circuit board15aof this embodiment further comprises at least one light-emitting element155. In this embodiment, the at least one light-emitting element155is installed on the third membrane substrate154. The light beam emitted by the at least one light-emitting element155is transmitted through the keycap11(as shown inFIG.2) and outputted to the surroundings. Consequently, each key structure10of the keyboard device1is in a luminous state. In some other embodiments, the third membrane substrate154is made of a light-guiding material, and the third membrane substrate154and the at least one light-emitting element155are collaboratively formed as a backlight module. From the above descriptions, the membrane circuit board of the present invention has a four-layered structure. In comparison with the three-layered structure of the conventional membrane circuit board, the membrane circuit board of the present invention further comprises a gas channel in the third membrane substrate. Due to this structural design, the area of the first gas channel in the first adhesive layer and the area of the second gas channel in the second adhesive layer are effectively and largely reduced. Since the area of the first gas channel and the area of the second gas channel are largely reduced, the area of the first adhesive layer and the area of the second adhesive layer are correspondingly increased. Under this circumstance, the structural strength of the first adhesive layer and the structural strength of the second adhesive layer are increased, and the waterproof performance is enhanced. Consequently, the circuit patterns in the membrane circuit board are effectively protected. Moreover, when the first conductive contact and the second conductive contact of the membrane circuit board are electrically connected with each other and the corresponding membrane switch is triggered and turned on, a compressed gas is generated. The compressed gas can be easily exited to the surroundings of the membrane circuit board through the gas exhaust paths that are defined through the communication of the first gas channel, the second gas channel and the third gas channel. Consequently, the electrical problems caused by the unsmooth escape of air in the confined space (i.e., the trapped air) and the electrical problems of the circuit patterns caused by the high temperature and the high voltage of the long-time and rapid keystrokes will be effectively avoided. While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures. | 18,420 |
11862412 | In describing the various embodiments of the invention which are illustrated in the drawings, specific terminology will be resorted to for the sake of clarity. However, it is not intended that the invention be limited to the specific terms so selected and it is understood that each specific term includes all technical equivalents which operate in a similar manner to accomplish a similar purpose. For example, the word “connected,” “attached,” or terms similar thereto are often used. They are not limited to direct connection but include connection through other elements where such connection is recognized as being equivalent by those skilled in the art. DETAILED DESCRIPTION The various features and advantageous details of the subject matter disclosed herein are explained more fully with reference to the non-limiting embodiments described in detail in the following description. The subject matter disclosed herein describes a mechanical linkage within a switch that provides for smoother operation over an extended range of motion of the actuator. The mechanical linkage includes a transfer member configured to receive the force applied to a rotary handle of the switch. The transfer member is slidably mounted within the switch. In an Off position, the transfer member engages a rocker arm. As the transfer member rotates between the Off and On positions, the transfer member causes the rocker arm to rotate between the Off and On positions. When the rocker arm has reached the On position, the transfer member is slidably moved away from the rocker arm, disengaging the rocker arm. As the rocker arm rotates along with the transfer member between the Off and On positions, the rocker arm engages a mechanical linkage connected between the rocker arm and a plunger. The plunger moves in a first direction and closes the electrical contacts of the switch, causing the switch to transition between the Off and On states. When the switch is transferred from the On state back to the Off state, a boss engages a slot in the rocker arm. The boss begins applying the rotational force in the opposite direction to the slot in the rocker arm. As the rocker arm begins rotating from the On state to the Off state, the mechanical linkage begins transitioning back to the Off state. After a short period of rotation, the rocker arm and mechanical linkage transition from a stable position to a position in which at least one spring in the switch applies a force to and causes the mechanical linkage to jump back to the Off state. The mechanical linkage returning to the Off state, in turn, causes the rocker arm to also jump back to the Off state. The handle of the switch continues rotating to the Off state. When the handle of the switch reaches the Off state, the transfer member slides back toward the rocker arm and reengages the rocker arm. This combination of transfer member, rocker arm, and mechanical linkage results in a reduced level of torque required to rotate the actuator over the extended range of motion when transitioning from the Off state to the On state. The reduced level of torque, in turn, provides a more uniform and easier operational feel during actuation. The jump back to the Off state provides a quick disconnection of the internal contacts and a reduce force required to rotate the handle back to the Off state. Turning initially toFIG.1, electrical switches10may be mounted in a cabinet and used to control industrial equipment. Group installation allows multiple motors15or other loads to be connected to a single branch circuit protection device20. A power supply25supplies power to the branch circuit protection device20, and power is distributed from the branch circuit protection device20to each of the branch circuits. According to the illustrated embodiment, each branch circuit includes a circuit breaker10and a contactor30connected between the branch circuit protection device20and a motor15. Each circuit breaker10is configured to be manually actuated while each contactor30is configured to be electronically actuated. As illustrated inFIGS.2and3, the circuit breaker is an electrical switch10including a housing35with an opening extending through a front surface of the housing. A rotary actuator40extends through the opening, providing a switch handle45external to the housing35. The switch handle45is rotatable between an Off position41and an On position43. An additional, Trip position42is located between the Off position41and the On position43, providing an indication to a technician when the circuit breaker has tripped. An inner rotational member47couples to the switch handle45and receives a force applied to the switch handle. Rotation of the switch handle45between the Off position41and the On position43similarly causes the inner rotational member47to transition between a first position and a second position. The inner rotational member47engages a mechanical linkage50(seeFIG.4) which, in turn, causes the contacts55in the circuit breaker to selectively open and close in the Off and On positions, respectively. With reference next toFIGS.4and5, one embodiment of the circuit breaker10is illustrated in an Off state (FIG.4) and an On state (FIG.5). The mechanical linkage50includes a gear65which is rotatably mounted within the switch. The gear65includes a single gap67configured to receive a complementary tooth49extending from the inner rotational member47of the rotary actuator. It is another aspect of the invention, that the tooth and gap may be mounted in an opposite configuration, such that a tooth (not shown) may extend from the gear65and engage a gap (not shown) on the inner rotational member47. In either configuration, rotation of the inner rotational member47in a first plane causes rotation of the gear65in a second plane. The gear65is mounted with an axis of rotation75orthogonal to an axis of rotation46of the rotary actuator. The engagement of the tooth49with the gap67translates the torque received by the rotary actuator about the first axis of rotation46to the gear65for rotation about the second axis of rotation75. A first opening69in the gear65is configured to receive a boss85from a transfer member70which is also rotatably mounted within the switch. A second opening68in the gear65is configured to align with an opening77(see alsoFIG.15) in the transfer member70. A mounting pin57(see alsoFIG.6) may be inserted through the openings68,77in the gear65and transfer member70, respectively, such that the gear and transfer member are rotatably mounted around the same axis of rotation75within the switch. As further illustrated inFIG.6, a rocker arm110is still another rotational member mounted within the switch. The rocker arm110includes an opening115(see alsoFIG.7) which may also be aligned with the openings68,77in the gear65and transfer member70, respectively, such that the gear65, transfer member70, and rocker arm110are all mounted within the switch by the mounting pin57and each of the gear65, transfer member70, and rocker arm110rotate about the same axis of rotation75. As will be discussed in more detail below, the transfer member70is configured to engage the rocker arm110as the transfer member70rotates between an Off position and an On position. Rotation of the transfer member70, in turn, causes rotation of the rocker arm110. The rocker arm110engages a lever arm150pivotally mounted within the switch. The switch10also includes a plunger60configured to move reciprocally, back-and-forth, along an axis56. According to the illustrated embodiment shown inFIGS.4and5, the switch10is a three-phase switch, where a plunger60moves three prongs up and down in three parallel axes56A,56B,56C. A first end of the plunger60engages an end154of the lever arm150and a second end of the plunger includes each of the three prongs to reciprocally move a lower contact55B along the respective axis56. It is contemplated that the end of the prong may fit into a plunger seat or, optionally directly engage the lower contact55B. As the plunger60is moved in a downward direction, the lower contact55B separates from the upper contact55A, opening the circuit and putting the switch into the Off state. As the plunger60moves in an upward direction, the lower contact55B engages the upper contact55A, establishing an electrical connection between the contacts55and putting the switch into the On state. The illustrated plunger60is intended to be exemplary only. It is contemplated that multiple plungers60may be mechanically connected or formed as a single member to open and close multiple contacts55in tandem. It is further contemplated that the geometry of the plunger60may take other forms or the plunger60may include an offset segment along the length of the plunger such that a force is applied at a first end of the plunger60along a first axis and the second end of the plunger60moves reciprocally along a second axis where the second axis is parallel to but offset from the first axis. Although illustrated as a circuit breaker, the rotary actuator40and mechanical linkage50may be implemented on other switching devices such as a motor protection circuit, an electrical contactor, or the like. Terms such as upper, lower, inner, outer, front, rear, left, right, and the like will be used herein with respect to the illustrated switching device10. These terms are relational with respect to the illustrated switching device and are not intended to be limiting. It is understood that the switching device10may be installed in different orientations, such as vertical or horizontal, or may be rotated one hundred eighty degrees without deviating from the scope of the invention. Turning next toFIGS.14-18, one embodiment of a transfer member70is illustrated. The transfer member70has a first side71and a second side73opposite the first side. The transfer member70has an irregular geometric outer periphery79with generally arcuate surfaces extending between the first and second sides. A first boss protrudes for a first length74from the first side71, and a second boss76protrudes for a second length78from the first side71. The second length78is greater than the first length74. The first and second bosses72,76are positioned on the first side such that they engage an elongated slot120(see alsoFIG.24) in the rocker arm110when the transfer member70and rocker arm110are mounted within the switch10. The first boss72and the second boss76are also referred to herein as coupling portions of the transfer member, and the elongated slot120is a complementary coupling portion on the rocker arm110configured to receive the bosses72,76at least partly within the slot120. According to the illustrated embodiment, the first boss72and the second boss76are generally cylindrical. The elongated slot120on the transfer member70has an arcuate profile such that the bosses72,76may slide within the slot120. It is contemplated that other geometrical shapes may be utilized as long as the shape of the boss72,76and the shape of the slot120are complementary such that the boss72,76may be inserted and/or removed from the slot as will be discussed further below. The transfer member70also includes a third boss80projecting from the first side71. The third boss80is referred to herein as an engagement member. The third boss80further includes an engagement surface81which is sloped with respect to an edge of the lever arm150with which it will engage. The transfer member70further includes a fourth boss85extending from the second side73. According to the illustrated embodiment, the fourth boss85is generally cylindrical and is configured to slidably engage the opening69in the gear65. Optionally, the fourth boss85may have other geometric shapes as long as the opening69in the gear65has a complementary geometry in which the fourth boss85may be slidably received. Turning next toFIGS.19-23, one embodiment of a lever arm150is illustrated. The lever arm150has a first side160and a second side162, where the second side is opposite the first side. The lever arm150has an irregular geometric periphery extending between the first and second sides160,162. According to the illustrated embodiment, the lever arm150is formed as a single member but will be descried herein as three different segments. A first segment is the upper portion155, a second segment is the middle portion151, and a third segment is the lower portion153. The upper portion155of the lever arm150is generally hook-shaped. The lever arm150extends upward from the middle portion151toward a first end152of the lever arm. At the first end152of the lever arm150, the upper portion155curls back on itself forming the hook portion of the lever arm. A recess-portion163extends along a portion of the second side162of the lever arm at the first end152before the upper portion155bends back toward the middle portion151. At an end164of the hook portion, an engagement member165protrudes from the first side160of the upper portion155. According to the illustrated embodiment, the engagement member165is generally cylindrical and extends from the first side160a sufficient distance to engage with the rocker arm110, as will be discussed in more detail below. The middle portion151of the lever arm150includes a pivotal mount157protruding from the second side162of the lever arm. The pivotal mount157is fit through an opening in a side plate (not shown) of the switch and a pin or clip is used to secure the lever arm150to the side plate. The lever arm150pivots about the pivotal mount157within the switch10as it moves between an Off state and an On state. The lower portion153of the lever arm is an elongated member and is configured to engage a plunger within the switch. In an Off state, the lower portion153holds the plunger in a down, or extended position, such that the contacts55in the switch are open. In the On state, the lower portion153releases the plunger and springs in the switch push the plunger upward, or in a retracted position, such that the contacts55in the switch close, establishing an electrical connection between upper contacts55A an lower contacts55B. Turning next toFIGS.24-27, one embodiment of a rocker arm110is illustrated. The rocker arm110includes a body portion125and an elongated member130. The body portion125includes a first side126and a second side127, where the second side is opposite the first side. Similarly, the elongated member130includes a first side131and a second side132, where the second side is opposite the first side. The first side126of the body portion125is generally parallel to but offset from the first side131of the elongated member130. Similarly, the second side127of the body portion125is generally parallel to but offset from the second side132of the elongated member130. Each of the body portion125and the elongated member130have an irregular geometric outer periphery extending between the respective first and second sides. The outer periphery129of the body portion125has generally arcuate shapes and extends for a first width128between the first and second sides126,127. The outer periphery134of the of the elongated member has a first generally planar segment and a second generally planar segment extending away from the body portion125, where the width between the first and second generally planar segments is greater proximate the body portion125and tapers toward an end135distal from the body portion. The end135distal from the body portion is generally arcuate in shape. The elongated member130has a second width133, where the second width133is less than the first width128. The body portion125further includes the opening115extending therethrough by which the rocker arm110is mounted within the switch10. The elongated member130includes a second opening137extending therethrough near the end135distal from the body portion125. The second opening137is configured to be coupled to an arm190, as seen inFIG.13. Turning next toFIGS.28-31, another embodiment of the circuit breaker is illustrated in the OFF state. The mechanical linkage250includes a gear265which is rotatably mounted within the switch. The gear265includes an opening268through which a mounting pin257is inserted and about which the gear265rotates. The gear265includes a single gap267configured to receive a complementary tooth49extending from the inner rotational member47of the rotary actuator40. It is another aspect of the invention, that the tooth and gap may be mounted in an opposite configuration, such that a tooth (not shown) may extend from the gear265and engage a gap (not shown) on the inner rotational member47. In either configuration, rotation of the inner rotational member47in a first plane causes rotation of the gear265in a second plane. The gear265is mounted with an axis of rotation75orthogonal to an axis of rotation46of the rotary actuator40. The engagement of the tooth49with the gap267translates the torque received by the rotary actuator40about the first axis of rotation46to the gear265for rotation about the second axis of rotation75. The gear265includes an elongated channel269configured to receive a transfer member270. The transfer member270is slidably mounted within the elongated channel269. The transfer member has a first end272oriented away from a rocker arm310and a second end274which selectively engages the rocker arm310. The mechanical linkage250also includes the rocker arm310. The rocker arm310includes an opening315(see alsoFIG.38) which is aligned with the opening268in the gear265and configured to receive the mounting pin257. The gear265and rocker arm310are mounted within the switch by the mounting pin257, and both the gear265and rocker arm310rotate about the same axis of rotation75. As will be discussed in more detail below, the transfer member270, slidably mounted within the gear265, is configured to engage the rocker arm310as the gear265rotates between an Off position and an On position. Rotation of the gear265and engagement of the transfer member270, in turn, causes rotation of the rocker arm310. The rocker arm310engages a further mechanical linkage360to selectively activate a plunger60which, in turn, selectively opens and closes one or more contacts within the switch. Turning next toFIG.32, another embodiment of the transfer member270is illustrated. The transfer member270has a generally cylindrically configuration. The transfer member270extends between the first end272and the second end274. A first portion271of the transfer member270has a first diameter, and a second portion273of the transfer member has a second diameter. The first diameter corresponds to a diameter of the elongated channel269in the gear265in which the transfer member270is mounted. The outer periphery of the first portion271of the transfer member270engages the inner periphery of the elongated channel269as the transfer member270slides within the elongated channel. The second diameter is less than the first diameter, such that a spring350(SeeFIG.41) may be mounted around the second portion273of the transfer member270within the elongated channel269of the gear265. A transition276between the first portion271and the second portion273provides a seat for a first end of the spring. A ring around the end of the elongated channel269proximate the second end274of the transfer member270provides a seat for a second end of the spring. When mounted within the elongated channel269, the spring applies a biasing force on the transfer member270in a direction toward the first end272of the transfer member270. Turning next toFIGS.33-37, one embodiment of the gear265, which is configured to hold the transfer member270is illustrated. As previously discussed, the gear265includes an opening268through which a mounting pin257is inserted and about which the gear rotates. The gear265includes a gap267which acts as an engagement portion with the tooth49of the rotary actuator40. The elongated channel269acts as a coupling portion to slidably receive the transfer member270. According to the illustrated embodiment, the gear265extends between a first end281and a second end283. The gear265further includes an arcuate boss280protruding from the second end283. Turning next toFIGS.38-40, another embodiment of the rocker arm310is illustrated. The rocker arm310includes an upper portion325and a lower portion330. The rocker arm310also includes a first side326and a second side327, where the second side is opposite the first side. The rocker arm310has an irregular geometric outer periphery extending between the respective first and second sides. As previously discussed, an opening315extends through the rocker arm310which is configured to receive the mounting pin257about which the rocker arm310rotates. The rocker arm310includes a second opening337extending therethrough near the lower portion of the rocker arm310. The second opening337is configured to be coupled to a further mechanical linkage, as seen inFIG.31. A recess340is located in the upper portion325of the rocker arm310, and the recess340is configured to receive the second end274of the transfer member270. An elongated slot345is also present in the upper portion325of the rocker arm310. The elongated slot345is arcuate and curves around the opening315for the mounting pin257. The elongated slot345is configured to receive the arcuate boss280from the gear265. In operation, the transfer member70and rocker arm110work together to provide a switch10that provides for smoother operation over an extended range of motion of the rotary actuator40. Turning next toFIGS.8-13one embodiment of the mechanical linkage50within the switch10is illustrated in stages transitioning from an Off state to an On state. To start, the switch10is shown in an Off state (FIGS.8-9). The inner rotational member47of the rotary actuator40is in a first position, or the Off state. The tooth49extending downward is either not engaging the gap67of the gear65or may be positioned within the gap in the Off state. As the rotary actuator40begins turning, the tooth49engages the side wall of the gap67and begins to cause rotation of the gear65. The engagement of the tooth49from the rotary actuator40with the gear65is felt by the operator and begins transferring a first force applied to the rotary actuator to the mechanical linkage50. The transference of the first force between the rotary actuator and the mechanical linkage50begins at about twenty to thirty degrees of rotation, where ninety degrees of rotation completes the transition between states. The gear65is initially coupled to the transfer member70and to the rocker arm110while in the Off state, such that rotation of the gear65from the Off state to the On state causes rotation of the transfer member70and the rocker arm110. The boss85, protruding from the second side73of the transfer member70, is inserted in the opening69of the gear65, creating a coupling between the transfer member70and the gear65. Rotation of the gear65causes rotation of the transfer member70. The first boss72and the second boss76, protruding from the first side71of the transfer member70, are each positioned within the slot120of the rocker arm110. As the transfer member70begins rotating in response to the rotation of the gear65, the first boss72engages a side of the slot120, causing rotation of the rocker arm110. The transfer member70is slidably mounted within the switch10such that it may move axially back and forth between the gear65and the rocker arm110. As previously discussed, a mounting pin57extends through the gear65, transfer member70, and rocker arm110, providing a common axis of rotation75about which each of the three members rotates within the switch. According to the illustrated embodiment, a spring90is mounted around the mounting pin57and between the gear65and the transfer member70. The spring90applies a biasing force on the transfer member70, axially positioning the transfer member70towards the rocker arm110. It is contemplated that the spring90may be mounted, for example, on the boss85and between the transfer member70and gear65. Optionally, other types of springs, rather than the illustrated coil spring90, may be utilized to apply the biasing force on the transfer member70without deviating from the scope of the invention. The spring90applies a biasing force such that the first boss72of the transfer member70is initially located within the slot120of the rocker arm110. As the transfer member70rotates, the engagement member80of the transfer member70contacts a complementary engagement portion of the lever arm150. More specifically, a tapered engagement surface81of the engagement member80contacts the first end152of the lever arm150. Continued rotation of the transfer member70causes the engagement surface81to slide down from the first end152and adjacent to the second side162of the lever arm150. The tapered engagement surface81allows for some variation in alignment of the transfer member70with the first end152of the lever arm150while still achieving successful engagement between surfaces. The tapered engagement surface81also causes the transfer member to compress the spring90and slide away from the rocker arm110along the axis of rotation75as the engagement member80rotates down to the second send162of the lever arm150. The transfer member70is slidably mounted on the mounting pin57and the boss85mounted on the second side73of the transfer member is slidably mounted within the opening69in the gear65. As the transfer member70slides away from the rocker arm110, the first boss72on the first side71of the transfer member exits the slot120and stops causing further rotation of the rocker arm110. During rotation, the rocker arm110engages the lever arm150which, in turn, allows the contacts55on the switch10to close. As discussed above, rotation of the transfer member70will initially cause rotation of the rocker arm110due to the first boss72of the transfer member70engaging the slot120of the rocker arm. As the rocker arm110rotates about the axis of rotation75, the elongated member130engages the engagement member165of the lever arm150. The lever arm150pivots around the pivotal mount157. As the second end154of the lever arm150moves from the Off position to the On position, the plunger60is released and the contacts55close. The contacts close when the rotary actuator40has completed greater than eighty degrees of rotation. Thus, rotation of the rotary actuator40in a first direction spreads out actuation of the switch from about twenty to thirty degrees of rotation to over eighty degrees of rotation, while still providing for a quick closure of the contacts55due to the spring force applied against the plunger60. The primary force required by the switch10to transition from the Off state to the On state occurs, therefore, over a range of fifty to sixty degrees of rotation in the first direction. In the ON state, the mechanical linkage50is in a stable position, allowing the mechanical linkage50to remain in the ON state until a second force is applied in the opposite direction. To turn the switch Off, the second force is applied to the rotary actuator40in the opposite direction. As the rotary actuator40begins rotating in the opposite direction, the tooth49again engages the gap67of the gear65. As illustrated inFIG.7, the gear65includes a boss66protruding toward the rocker arm110as well. This boss66extends past the transfer member70and is configured to slide within the elongated slot120of the rocker arm110. The gear65and the transfer member70are configured to rotate in tandem as a result of the boss85on the transfer member slidably engaging the opening69in the gear65. It is contemplated, therefore, that the transfer member70may be configured to extend further in the direction of the boss66from the gear65and include an additional boss to replace the boss66from the gear65. In either embodiment, the boss66(as illustrated) or an additional boss from the transfer member is configured to engage the opposite end of the slot120used to turn the switch On. The boss66transfers the second force from the gear65to the rocker arm110to begin rotation of the rocker arm110from the On position to the Off position. As the rocker arm110begins rotating from the On position to the Off position, the elongated member130of the rocker arm110no longer applies a force against the engagement member165of the lever arm150. A spring200is mounted to the lower portion153of the rocker arm150applying a biasing force to the rocker arm110toward the Off position. The spring200causes the engagement member165of the rocker arm110to follow the elongated member130as the elongated member is rotated away from the rocker arm110. After the rocker arm110and lever arm150rotate a short distance, the mechanical linkage50passes a stable position, such that additional springs and the corresponding spring forces within the switch10cause the lever arm150and rocker arm110to jump back to the Off state. The jump also causes the lever arm150to force the plunger60downward, separating the contacts55in the switch10and putting the switch back in the Off state. This jump occurs when the rotary actuator40has reached about the same position at which the contacts55close or slightly before the rotary actuator has returned to the eighty degree position. The primary force required by the switch10to transition from the On state to the Off state occurs, therefore, over about ten degrees of rotation in the second direction. As the rotary actuator40continues turning back to the full Off position, the gear65continues turning the transfer member70back to the off position. The first boss72of the transfer member70is biased against the second side127of the body portion125of the rocker arm110by the spring90. The first boss72slides along the second side127until it again reaches the slot120. The spring90forces the transfer member70away from the gear65and toward the rocker arm110causing the first boss72to again engage the slot120on the rocker arm. Turning next toFIGS.28-31another embodiment of the mechanical linkage250within the switch10is illustrated in the Off state. The inner rotational member47of the rotary actuator40is in a first position, or the Off state. The tooth49extending downward is either not engaging the gap267of the gear265or may be positioned within the gap in the Off state. As the rotary actuator40begins turning, the tooth49engages the side wall of the gap267and begins to cause rotation of the gear265. The engagement of the tooth49from the rotary actuator40with the gear265is felt by the operator and begins transferring a first force applied to the rotary actuator to the mechanical linkage250. The transference of the first force between the rotary actuator and the mechanical linkage250begins at about twenty to thirty degrees of rotation, where ninety degrees of rotation completes the transition between states. The transfer member270is slidably mounted within the gear265. In the Off state, the first end272of the transfer member270engages an interference member290. The interference member290applies a force to the first end272of the transfer member270that is sufficient to overcome the biasing force from the spring350mounted within the elongated channel269of the gear265. The interference member290causes the transfer member270to slide toward the rocker arm310, inserting the second end274of the transfer member270into the recess340on the rocker arm. According to the illustrated embodiment, the interference member290is a flat spring. The force applied by the flat spring exceeds the force applied by the coil spring350, causing the transfer member270to slide toward the rocker arm310and compressing the coil spring350. Optionally, a rigid member may be utilized for the interference member290, where the rigid member has an angled form similar to that seen in the top view ofFIG.29. The transfer member270couples the gear265to the rocker arm310in the OFF state. Consequently, as the gear265begins rotation from the OFF state to the ON state, the rocker arm310similarly begins rotation between the OFF state and the ON state. As the gear265rotates, the first end272of the transfer member270rotates along the interference member290. As seen inFIG.29, the interference member290has a first end292and a second end294. The first end292of the interference member is located proximate the first end272of the transfer member in the OFF state. As the gear265rotates, the transfer member270travels along the interference member290from the first end292toward the second end294. The interference member290has a first bend291proximate the first end292and a second bend293proximate the second end294. The interference member290is shaped such that the surface of the interference member290is angled away from the gear265between the first bend291and the second bend293. As a result, the interference member290allows the spring350within the elongated channel269to slide the transfer member270away from the rocker arm310during rotation of the gear265and rocker arm310. After the gear265and rocker arm310have reached the ON state, the first end272of the transfer member270either no longer engages the interference member290or the displacement of the second end294of the interference member from the rocker arm310is sufficient to allow the second end274of the transfer member270to be completely removed from the recess340in the rocker arm310, and the transfer member270no longer transfers force from the gear265to the rocker arm310. During rotation, the rocker arm310engages a further mechanical linkage360which, in turn, allows the contacts55on the switch10to close. As discussed above, rotation of the transfer member270will initially cause rotation of the rocker arm310due to the transfer member270engaging the recess340of the rocker arm. As the rocker arm310rotates about the axis of rotation75, the lower portion330of the rocker arm310pivots around the mounting opening315. The second opening337proximate the lower end of the rocker arm310serves as an engagement portion of the rocker arm310and is coupled to the additional mechanical linkage360. Rather than a single lever arm150, as discussed above with respect to one embodiment of the invention, multiple linkages are pivotally or slidably connected to transfer the force from the rocker arm310to the plunger60. A linking member of the additional mechanical linkage360is fixedly, and pivotally mounted within the second opening337to serve as an engagement portion of the additional mechanical linkage360. Rotation of the lower portion330of the rocker arm310causes one end of the linking member to move right and the other end of the linking member to rotate downward to engage a lever arm, which, in turn, engages the plunger60. When the rocker arm310reaches the On state, the additional mechanical linkage360has allowed the plunger60to release and the contacts55within the switch10to close. The contacts close when the rotary actuator40has completed greater than eighty degrees of rotation. Thus, rotation of the rotary actuator40in a first direction spreads out actuation of the switch from about twenty to thirty degrees of rotation to over eighty degrees of rotation, while still providing for a quick closure of the contacts55due to the spring force applied against the plunger60. The primary force required by the switch10to transition from the Off state to the On state occurs, therefore, over a range of fifty to sixty degrees of rotation in the first direction. In the ON state, the mechanical linkage250is in a stable position, allowing the mechanical linkage250to remain in the ON state until a second force is applied in the opposite direction. To turn the switch Off, the second force is applied to the rotary actuator40in the opposite direction. As the rotary actuator40begins rotating in the opposite direction, the tooth49again engages the gap267of the gear265. The arcuate boss280of the gear265is positioned within the arcuate slot345of the rocker arm310. One end of the arcuate boss280engages a side wall of the arcuate slot345, transferring the second force from the gear265to the rocker arm310to begin rotation of the rocker arm310from the On position to the Off position. As the rocker arm310begins rotating from the On position to the Off position, the lower portion330of the rocker arm310pivots away from the additional mechanical linkage360. Further, because the second opening337is coupled to the additional mechanical linkage360, the rocker arm310causes the additional mechanical linkage to begin returning to the Off position. One or more springs connected to the additional mechanical linkage360apply a biasing force on the mechanical linkage360to return to the Off position. After the gear367and rocker arm310rotate a short distance, the rocker arm310draws the additional mechanical linkage360past a stable position, such that the additional springs and the corresponding spring forces within the switch10cause the additional mechanical linkage360and the rocker arm310, connected to the additional mechanical linkage, to jump back to the Off state. The jump also forces the plunger60downward, separating the contacts55in the switch10and putting the switch back in the Off state. This jump occurs when the rotary actuator40has reached about the same position at which the contacts55close or slightly before the rotary actuator has returned to the eighty degree position. The primary force required by the switch10to transition from the On state to the Off state occurs, therefore, over about ten degrees of rotation in the second direction. As the rotary actuator40continues turning back to the full Off position, the gear265continues turning toward the Off position. The second end274of the transfer member270slides along the first side326of the rocker arm310. The first end272of the transfer member270engages the interference member290causing compression of the spring350in the elongated channel269. The second end274of the transfer member270continues to slide along the first side326of the rocker arm310until the transfer member270is again positioned in front of the recess340in the rocker arm310. The second end374of the transfer member270then slides into the recess340on the rocker arm310returning the switch to the Off position. It should be understood that the invention is not limited in its application to the details of construction and arrangements of the components set forth herein. The invention is capable of other embodiments and of being practiced or carried out in various ways. Variations and modifications of the foregoing are within the scope of the present invention. It also being understood that the invention disclosed and defined herein extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present invention. The embodiments described herein explain the best modes known for practicing the invention and will enable others skilled in the art to utilize the invention. In the preceding specification, various embodiments have been described with reference to the accompanying drawings. It will, however, be evident that various modifications and changes may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the claims that follow. The specification and drawings are accordingly to be regarded in an illustrative rather than restrictive sense. | 39,541 |
11862413 | DETAILED DESCRIPTION FIG.1shows a facility for sterilization1of objects2through exposure to radiation. The facility for sterilization1includes a conveyor system4to transport the objects2along the conveyor line. The facility for sterilization1has one or more radiation sources6that are arranged to sterilize the objects2. Each radiation source6is specifically arranged to expose one or more objects2to radioactive radiation in order to achieve sterilization of the object2. The conveyor system4comprises more than one level, such as two levels. For example, the conveyor system4is configured to transport each object2from an entrance8along a conveyor line to a first level, as symbolized specifically by the arrows10. At a reversal area12, the conveyor line comprises the conveyor system4, such as an elevator14that transports each object2from the first level to a second level. The second level is located above or below the first level, for example. According to one execution example, the conveyor system4is configured to transport each object2from the reversal area12along a conveyor line onto the second level, as specifically symbolized by the arrows16. For example, each object2is a sterilization unit that comprises a medical object. The facility for sterilization1further comprises one or more detection devices18. The detection device18is configured to detect the position of one or more moving objects2. In particular, the detection device18is configured to detect the position of the moving object2, while moving object2is being transported by at least one conveyor system4along the conveyor line. FIGS.2and3show an execution example of the detection device18. The detection device18comprises a base20, an arm22, and a sensor24. In one execution example, the base20comprises a metal plate that is configured to carry the arm22and the sensor24. The arm22is mounted rotatable to the base20. The arm22is rotatable around a first rotational axis26, in particular between a first rotational position P1of the arm22and a second rotational position P2, as shown in the example inFIG.4. The first rotational axis26is specifically orthogonal to a level that comprises the metal plate of the base20. In the execution example inFIGS.2and3, the arm22is in the first rotational position P1. The arm22has a longitudinal axis27. The longitudinal axis27of the arm22in the first rotational position P1has an angle W between 10% and 90% compared to the second rotational position P2. According to execution examples, the shaft39has an adjustment device52. Using the adjustment device52, the arm22is adjustable in relation to the shaft39, in particular the adjustment device of the arm22at one level vertical to the first rotational axis26. The adjustment device52is configured to rotate with the shaft39. In one embodiment, the adjustment device52is arranged in such a way that the arm22is adjustable to the shaft39in equal steps, such as through a raster50. For example, the steps may have an angle of between 2 and 20 degrees, and in particular between 5 and 15 degrees. In the example shown inFIG.3, the steps have an angle of 9 degrees. The raster50is provided by a tooth system. For example, the arm22is fastened to an inner gear54with external teeth. An external ring56with internal teeth is non-rotatably connected to the shaft39. The external teeth of the internal gear54and the internal teeth mesh together. Using the number of external teeth and internal teeth, the desired raster or step angle can be selected. As described further below, the internal gear54can be formed by a shaft profile60of the shaft39or by other means that clearly establish the position of the arm22relative to the internal gear54or allows the arm22to be attached only in a specific direction of rotation on the gear54. To set the (rotational) position of the arm22, the internal gear54is inserted in an appropriate position into the outer ring56and then the arm22is placed on the internal gear54according to the specified (rotational) position. According to execution examples, the shaft profile60with the internal gear54and external ring56are arranged such that when the arm22rotates around the first rotational axis26, they also rotate around the first rotational axis26. Still other adjustment devices52are conceivable, such as one or more grooves or protrusions that work together with the arm22. Triggering of a switch42(described below) is specially adjustable. According to variants, the adjustment device52is configured to allow setting between 10° and 90°. This means, for example, that triggering/actuation of the switch42can be set between 10° and 90° without a raster. For example, the arm22has a longitudinal opening29for installing the arm22to the base20. The arm22is specifically adjustable against the base20in the direction of the longitudinal axis27. For example, the arm22is configured to be slid in the direction of the longitudinal axis27, depending on the size of the object2and/or the course of the conveyor line of object2. The arm22has a free end28for contact with the moving object2. For example, at the free end28the arm22has a roller30that is configured to form a contact point for the moving object2. The roller30has a rotational axis32against the arm22. The rotational axis32of the roller30, for example, is parallel to the first rotational axis26, as can be seen in the execution example inFIGS.2and3. In one execution example, the direction of the rotational axis32of the roller30in a level containing the longitudinal axis27of the arm22and the first rotational axis26can be varied. For example, the detection device18is configured to detect the position of the moving object2when it moves in a horizontal direction, and in particular in a horizontal direction orthogonal to the longitudinal axis27in the first rotational position P1of the arm22. By this movement of the detection device18, the arm22is arranged, for example, to be deflected between the first and second rotational position P1, P2. According to one execution example, the arm22has a first section34and a second section36. For example, the first section34is mounted rotatable to the base20. The second section36extends the first section34, for example. In particular, the second section36extends from the first section34in the direction of the free end28. In particular, the second section36is mounted rotatable to the first section34around a second rotational axis38. The second longitudinal axis38is specifically orthogonal to the first rotational axis26, in particular the rotational axis32of the roller30at the level that contains the longitudinal axis27of the arm22and the first rotational axis26. When the second section36rotates around the second rotational axis38, the roller30also rotates in the direction of the rotational axis32of the roller30. For example, the roller30is configured to come into contact with the moving object2. The arm22is in particular configured to be deflected upon contact with the moving object2and to be rotated around the first and/or second rotational axis26,38. For example, the arm22is arranged for multi-axis movement, in particular by means of the second section36, which is rotatable in relation to the first section34. Upon contact with the moving object2, wherein the moving object2is moving in a direction that includes a vertical component, the arm22is for example configured to be deflected according to the movement of the object2. “Vertical component” is understood to mean a component of a direction parallel to the first rotational axis26. According to execution examples, the arm22is mounted to the base20by at least one form-fitting component. For example, the arm22, and in particular the first section34of the arm22, is mounted by a shaft39rotatable to the base20. The shaft39is specifically form fit to the arm22. For example, the shaft39is form fit in the longitudinal axis27of the arm22. In particular, the shaft39is connected form-fitting to the arm22, such that the arm22is slidable only toward the longitudinal axis27. According to one embodiment, the shaft39has a shaft profile60that includes the internal gear54, for example. The shaft profile60is suitable for creating a form-fitting connection between the arm22and the shaft39, as shown in the example inFIG.5. The shaft profile60has, in particular, a complementary surface61to at least one surface62, in particular two preferentially parallel surfaces62of the arm22. For example, the longitudinal opening29has at least one surface62on its interior. The complementary surface61specifically forms what is called a key face for the arm22. In another embodiment, the arm22can provide surfaces62on its outer side that interact with a corresponding section of the shaft39. According to one embodiment, the shaft profile60forms an attachment of the shaft39, that is connected form-fitting to a bolt63of shaft39. The form-fitting connection between arm22and shaft39allows connection without play, so that the detection device18operates precisely. A form-fitting connection between the arm22and the shaft39in particular allows a requirement to be met regarding standard EN ISO 13849 the safety requirements of safety-related parts of controls. This means that the detection device18is suitable for use as a safety-relevant device. Furthermore, the detection device18has, for example, at least one bearing (not shown in the figures), in particular two bearings, for mounting the shaft39on the base. For example, each bearing is a sliding bearing that specifically has a sliding bearing bushing. For example, each bearing is a dry plain bearing without lubrication. The sensor24of the detection device18is configured to detect rotation of the arm22relative to the base20, and thereby in particular detect the position of the moving object2. The sensor24has a first part and a second part. The first part is arranged so that it moves with the arm22, and the second part is attached to the base20. For example, the first part is attached to the shaft39. The first part is a first component of a magnet (40) switch (42) pair and the second part is the other component of the magnet (40) switch (42) pair. According to one execution example, the first part is a magnet40and the second part is an electrical switch42. According to an alternative execution example, the first part is the electrical switch42and the second part is the magnet40. The magnet40is specifically a permanent magnet. According to execution examples, the magnet40is of any magnet type that is a passive component without a provided energy supply and that is configured to create a magnetic field. The electrical switch42is configured to be actuated by the magnetic field of the magnet40. The electrical switch42is in an initial state when the arm22is in the first rotational position P1, and in a second state when the arm22is in the second rotational position P2. In particular, the axis39is in an initial predefined position when the arm22is in the first rotational position P1, and in a second predefined position when the arm22is in the second rotational position P2. The position of the axis39is in particular independent of angle fixation of the arm22relative the shaft39by means of the adjustment device52. In the first predefined position, the electrical switch42is in the first state, and in the second predefined position, the electrical switch42is in the second state. The first state, for example, is an “OFF” state of the electrical switch42, wherein the electrical switch42does not detect the moving object2. The second state, for example, is an “ON” state of the electrical switch42, wherein the electrical switch42detects the moving object2. For example, when the arm22is rotated around the W angle, the electrical switch42triggers. According to execution examples, the electrical switch comprises a glass tube and metal contact tongue fused into the glass tube, such as one made of an iron-nickel alloy. The contact tongue is configured to be actuated by the magnetic field. The electrical switch42comprises a reed switch, for example. For example, the electrical switch42is configured to be connected to a control device by ceramic terminals and/or glass fibreglass cables. For example, this allows the detection device's temperature and radiation resistance to be further increased. According to execution examples, at least the arm22, the shaft39or the bearing partially consists of metal. According to one execution example, both the arm22and the shaft39and the bearing are made at least partially, preferentially completely, of metal. This particularly increases the detection device's resistance to radioactive radiation, because metal, in comparison to polymers, for example, is not degraded by radioactive radiation. According to execution examples, the detection device18further has at least one reset device, in particular a spring (not shown), that is configured to move the arm22from the second rotational position P2back to the first rotational position P1. According to execution examples, the detection device18further has a housing44, which is specifically mounted to a base20, such as that shown inFIG.3. The housing44is arranged specifically to cover the magnet40and the electrical switch42. The first and second parts of the sensor24are therefore specifically located in the housing44. For example, the arm22extends in a direction orthogonal to the first rotational axis26through extension of the housing44in this direction. For example, the detection device18is configured to resist a gamma dose up to 20 kGy/h. To “withstand a gamma dose of 20 kGy/h” is understood to mean that the detection device18can detect the position of the moving object2up to a dose that high. For example, the detection device18is configured to resist a temperature of up to 200° C. To “permanently withstand a temperature of 200° C.” is understood to mean that beyond such a temperature load the detection device18can detect the position of the moving object2, in particular after such a temperature load over a period of a year. The present disclosure has a number of advantages. Movement of the moving object2along the detection device18causes rotation of the arm22and thereby allows detection of the position of the moving object2. The detection device18has high radiation resistance and/or high resistance to high temperatures, in particular because of the sensor24, which comprises the magnet40and the electrical switch42, wherein the electrical switch42is configured to be actuated by the magnetic field of the magnet40. When a detection device18is used, the detection device18detects a position of the moving and/or transported object2in a facility for sterilization1. | 14,801 |
11862414 | The achievement of the purpose of the present disclosure, functional characteristics and advantages will be further described with reference to the accompanying drawings in conjunction with embodiments. DETAILED DESCRIPTION OF THE EMBODIMENTS The technical solutions of the embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. It is obvious that the embodiments to be described are only some rather than all of the embodiments of the present disclosure. All other embodiments obtained by persons skilled in the art based on the embodiments of the present disclosure without creative efforts shall fall within the scope of the present disclosure. It should be noted that if there are directional indications, such as up, down, left, right, front, back, etc., involved in the embodiments of the present disclosure, the directional indications are only used to explain a certain posture as shown in the accompanying drawings. If the specific posture changes, the directional indication also changes accordingly. In addition, if there are descriptions related to “first”, “second”, etc. in the embodiments of the present disclosure, the descriptions of “first”, “second”, etc. are only for the purpose of description, and should not be construed as indicating or implying relative importance or implicitly indicates the number of technical features indicated. Thus, a feature delimited with “first”, “second” may expressly or implicitly include at least one of that feature. Besides, the meaning of “and/or” appearing in the disclosure includes three parallel scenarios. For example, “A and/or B” includes only A, or only B, or both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist or fall within the scope of protection claimed in this disclosure. The present disclosure provides a rocker device. In an embodiment of the present disclosure, as shown inFIGS.1to9, the rocker device10includes a mounting seat assembly300, an electric control board400, an upper shell500and a bottom shell600. The mounting seat assembly300is provided with a first groove301and an arc-shaped groove302for mounting a rocker arm assembly200. The electric control board400is arranged in the first groove301. The upper shell500covers a top area of the mounting seat assembly300, fixes two ends of the rocker arm assembly200in the arc-shaped groove302, and confines the electric control board400to the first groove301. A first connecting portion510is provided at an outer periphery of the upper shell500. The mounting seat assembly300is disposed in the bottom shell600, and the bottom shell600is clamped with the first connecting portion510. Generally, the rocker device10includes a rocker100, the rocker arm assembly200and a sensing component. The rocker arm assembly200is sleeved on the rocker100. The rocker arm assembly200is pushed by the rocker100to swing in a first direction and a second direction perpendicular to the first direction. The sensing component is used to detect the rocker arm assembly200to output a control signal, the sensing component usually being a sensor. In an embodiment, the sensing component is a magnetic induction assembly900, which includes a Hall element910and a magnet920. The magnet920is mounted on the rocker arm assembly200, the Hall element910is disposed on the electric control board400corresponding to the magnet920and is electrically connected with the electric control board400. Furthermore, the rocker arm assembly200includes a first rocker arm210and a second rocker arm220, both are provided with the magnetic induction assembly900. For ease of description, hereinafter, the magnetic induction assembly900disposed on the first rocker arm210is the first magnetic induction assembly, and the magnetic induction assembly900disposed on the second rocker arm210is the second magnetic induction assembly. The second magnetic induction assembly includes a second magnet and a second Hall element. The first Hall element is used to generate and output a first electrical signal corresponding to a change in a distance between the first magnet and the first magnetic induction element caused by a swing of the first magnet, and the second Hall element is used to generate and output a second electrical signal corresponding to a change in a distance between the second magnet and the second magnetic induction element caused by a swing of the second magnet. In addition, it can be understood that in order to fix two ends of the rocker arm assembly200on the arc-shaped groove302through the upper shell500, the upper shell is also provided with an arc-shaped groove, corresponding to the arc-shaped groove302on the mounting seat assembly300. The two arc-shaped grooves cover the two ends of the first rocker arm210and the second rocker arm220. Further, referring toFIG.3, the mounting seat assembly300includes a base310, a first protruding portion320and a clamping block340. The first protruding portion320and the arc-shaped groove302are disposed on a same side of the base310. The arc-shaped groove302is formed on one side of the first protruding portion320and the clamping block340away from the base310. An elastic sheet700is disposed on one side of the electric control board400away from the base. The clamping block340is movably installed on the upper shell500corresponding to the elastic sheet700, and when the rocker arm assembly200is driven by the rocker100to press down, the elastic sheet700is pressed by the clamping block340to be deformed and make the elastic sheet contact with the electric control board400to form a loop. The mounting seat assembly300includes three first protruding portions320, the clamping block340and the three first protruding portions320are evenly spaced along the circumference of the base310, and the rocket arm assembly is pushed by the rocker to swing in the first direction and the second direction perpendicular to the first direction. In an embodiment, in order to facilitate a rapid installation of the bottom shell600on the upper shell500, the first connecting portion510is clamped with the upper shell500. In an embodiment, the first connecting portion510is the clamping portion, and the bottom shell600is provided with a clamping groove engaged with the clamping portion. In an embodiment, the first connecting portion is provided with a clamping groove, and the bottom shell is provided with a clapping portion engaged with the clamping groove. In other embodiments, the bottom shell600and the upper shell500can also be installed in other manners. In an embodiment, the electric control board400, the rocker device100and the rocker arm assembly200are preinstalled on the mounting seat assembly300, the upper shell500is installed on the mounting seat assembly300. The upper shell500and the mounting seat assembly300are locked by the bottom shell600. Therefore, in technical solutions of the present disclosure, components originally mounted on the bottom shell600are mounted on the mounting seat assembly300, thereby simplifying the structure of the bottom shell600. In addition, the mounting seat assembly300is cooperated with the bottom shell600, so that an internal structure of the rocker device10is more compact, thereby avoiding the rocker device from shaking during use to a certain extent. Referring toFIG.2, in an embodiment, in order to facilitate an installation of the base310and the upper shell500, an abutting surface of the first protruding portion320and the upper shell500are inclined. Referring toFIG.1andFIG.3, in an embodiment, in order to make a connection part of the rocker device10more reliable, the bottom shell600includes a bottom plate610and a side plate620connected to the bottom plate610. The mounting seat assembly300is installed on the bottom plate610, and an engaging portion or the clamping groove is provided on the side plate620. A folding ear630is formed on one end of the side plate620away from the bottom plate610, and a second groove501is concavely formed on a top surface of the upper shell500, in which the folding ear630is buckled. In this way, a connection between the bottom shell600, the upper shell500, and the mounting seat assembly300is strengthened, thereby the connection component of the rocker device10can be made more reliable. In an embodiment, the base310is provided with a first side and a second side opposite to the first side. The first protruding portion320and the clamping block340are located on the first side. The bottom plate610is abutted against the second side, on which a second protruding portion330is disposed. A first limiting hole is disposed on the bottom plate610corresponding to the second protruding portion330. The second protruding portion330is disposed through the first limiting hole611. In this way, through the second protruding portion330, a fitting between the base310and the bottom shell600can be more closely. That applying the rocker device10to the controller can be used for positioning, so as to install the rocker device10on the controller. In other embodiments, the bottom shell600further includes a second connecting portion640for a connection with other components of the controller. It can be understood that the electric control board400is provided with a pin, through which the electric control board400is connected with a printed circuit board (PCB) in the controller. In an embodiment, a limiting convex520is disposed on one side of the upper shell500close to the electric control board400, and a second limiting hole303is provided for an inserting of the limiting convex520. In this way, through the limiting convex520and the second limiting hole303, a mounting relationship between the base310and the upper shell500can be made more reliable. It can be understood that, in this embodiment, a third limiting hole401is disposed on the electric control board400corresponding to the limiting convex520. The third limiting hole401is a through hole, through which the limiting convex520extends into the second limiting hole303. A mating connection of the third limiting hole401also confines the electronic control board400in the first groove301. Referring toFIG.2, the rocker100includes a sliding seat120and a rod body110fitted with the sliding seat120. An installation through hole111is formed in the rod body110. One end of the sliding seat120is extendingly disposed into the installation through hole111. In an embodiment, in order to improve a use feeling of the rocker device10, an annular groove112is formed on one end of a circumference of the rod body110near the sliding seat120. The installation through hole111is surrounded by the annular groove112. The rocker device10further includes a spring800sleeved on the sliding seat120and extending into the annular groove112. In this way, when the rocker100is pressed or swung, an end of the spring800extending into the annular groove112is more evenly stressed with the rocker100, thereby improving the use feel of the rocker device10. In addition, the present disclosure also provides a handle controller, which includes the rocker device10. The specific structure of the rocker device10refers to the above-mentioned embodiments. Because the handle controller adopts all the technical solutions of all the above-mentioned embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are provided, which will not be repeated here. The application fields of the handle controller include but are not limited to game handles, drone controllers, VR handles, etc. The above descriptions are only embodiments of the present disclosure, and are not intended to limit the scope of the present disclosure. Under the inventive concept of the present disclosure, any equivalent structural transformations made by using the contents of the description and drawings of the present disclosure, or direct/indirect disclosures in other related technical fields are included in the scope of patent protection of the present disclosure. | 12,366 |
11862415 | DESCRIPTION OF EMBODIMENTS Referring toFIG.1toFIG.22, a keyswitch device and keyboard of an embodiment will be explained. In the present embodiment, a keyswitch device which is arranged at the keyboard is explained as an example. FIG.1is a perspective view of the keyboard in the present embodiment when cutting along its part.FIG.1shows the state where a cover member etc. at the surface of the keyboard is detached and keytops10are detached from some of the keyswitch devices1. The keyboard81in the present embodiment includes a plurality of keyswitch devices1. The plurality of keyswitch devices1are arranged aligned. The keyboard81in the present embodiment has a base member21. The base member21in the present embodiment has the plurality of keyswitch devices1attached to it. FIG.2is a cross-sectional view of a keyswitch device in the present embodiment. The keyswitch device1shown inFIG.1andFIG.2is provided with a keytop10functions as a moving member which moves when the user pushes it down. In the keyswitch device1of the present embodiment, movement of the keytop10causes electrical connection of the contact pair which is arranged inside of the keyswitch device1. The keyswitch device of the present embodiment is provided with a support mechanism that includes a gear link which supports the keytop10in a movable manner. The gear link mechanism includes a plurality of link members11and12. The keytop10is supported by the base member21through the link members11and12. At the downside of the base member21, a support member22is arranged. An elastic member including a rubber cup51is arranged between the support member22and the keytop10. The rubber cup51has elasticity and biases the keytop10in a direction where the keytop is separated from the base member21. The support member22supports the rubber cup51. The support member22is formed with a hole22aso that the rubber cup51can contact a membrane sheet23. At the downside side of the support member22, an electrical connection member, namely the membrane sheet23is arranged. The membrane sheet23in the present embodiment, as explained later, is formed so that a single key operation enables a plurality of contact pairs to be substantially simultaneously and individually connected. The keytop10in the present embodiment is formed in a box shape. The keytop10has a pushing part10awhich pushes the rubber cup51. The pushing part10ain the present embodiment is arranged in a region at the approximate center of the inside of the keytop10. The pushing part10aincludes an insert part10bwith a notched end. A frame21ais formed at the front surface of the base member21. The link members11and12have slide shafts11aand12aat one end and have pivot shafts11band12bat the other end respectively. The slide shafts11aand12aof the link members11and12are inserted to the frame parts21aof the base member21and are supported to be able to slide along the front surface of the base member21. Each of the pivot shafts11band12bof the link members11and12is inserted into the insert part10bwhich is formed at the pushing part10aand is pivotally supported at the insert part10b. FIG.3is a cross-sectional view when cutting the keyswitch device at the part where the plurality of link members11and12are arranged. The support mechanism in the present embodiment has an engagement part where the link members11and12engage with each other. The link members11and12in the present embodiment have tooth parts11cand12cat the front ends of the other ends. The engagement part is formed so that the tooth part11cand the tooth part12cmesh with each other. In the keyswitch device1shown inFIG.2andFIG.3, the keytop10moves toward the base member21as shown by arrow101when a user pushes the keytop10. At this time, the pivot shafts11band12bof the link members11and12are pushed by the keytop10and the link members11and12are driven. When the link members11and12are driven, the slide shafts11aand12aslide at the frame parts21aas shown by arrows102. Further, as shown inFIG.3, since the tooth part11cof the link member11and the tooth part12cof the link member12engage, when one of the link members11and12is driven, the other is driven through the engagement part. For example, even when the keytop10is pushed in a slanted direction, since the tooth part11cand the tooth part12care engaged, the link members11and12may simultaneously move. That is, the link members11and12are interlinked through the tooth parts11cand12c. Thus, the keytop10moves in a direction substantially vertically with respect to the front surface of the base member21as shown by arrow101. FIG.4is a perspective view of a first rubber cup in the present embodiment as seen from a front side.FIG.5is a perspective view of the first rubber cup in the present embodiment when seen from a back side.FIG.6is a cross-sectional view of the first rubber cup in the present embodiment. The first rubber cup51shown inFIGS.4to6is formed by a deformable material. The first rubber cup51has an abutting part13awhich abuts against the keytop10. The abutting part13ais formed in a ring shape. The abutting part13aof the rubber cup51is pushed by the pushing part10aof the keytop10. The first rubber cup51has a flange13ffor supporting the rubber cup51from the downside. The rubber cup51is fastened by the flange13fbeing clamped between the support member22and the base member21. Further, the flange13fincludes recesses13cthrough which air passes when the rubber cup51is deformed. The rubber cup51has a first deforming part including a deforming part13dwhich is formed between the abutting part13aand the part13f. The deforming part13dis formed so as to deform when the abutting part13ais pushed and to supply reactive force to the keytop10. The deforming part13dis formed so as to deform by buckling when the abutting part13ais pushed and to return to its original shape when the pushing force is released. The first rubber cup51has a second deforming part including a deforming part13e. The deforming part13ein the present embodiment is arranged inside of the abutting part13a. The deforming part13eshown inFIG.5is in a substantially conical shape and v-shape in cross-section. The rubber cup51has a pushing part13bat the end of the deforming part13e. The pushing part13bis arranged so as to face the membrane sheet23. The pushing part13bis a part which pushes the membrane sheet23. In the state where the pushing part13bcontacts the membrane sheet23, the deforming part13edeforms by pushing the keytop10. The deforming part13eis formed so as to deform by the pushing force of the keytop10and the reactive force from the membrane sheet23. FIG.7is an enlarged cross-sectional view of the first membrane sheet in the present embodiment. The first membrane sheet23is arranged beneath the support member22. The membrane sheet23includes an upper layer24, a lower layer26, and a spacer25which forms a gap between the upper layer24and the lower layer26. The spacer25is formed with a hole25a. A gap91is formed between the upper layer24and the lower layer26. Inside the region where the gap91is formed, a contact31aof the upper electrode is formed on a surface of the upper layer24facing the lower layer26. Further, a contact30aof the lower electrode is formed on the surface of the lower layer26. One contact part31aof the upper electrode and one contact part30aof the lower electrode configure one contact pair. A plurality of contact pairs is formed on the first membrane sheet23for a single rubber cup51. In the present embodiment, the contact of the upper electrode and the contact of the lower electrode have substantially the same planar shapes. Further, the contact of the upper electrode and the contact of the lower electrode face each other. FIG.8is an explanatory view of patterns of the electrodes of the first membrane sheet.FIG.8is a bottom view of the upper layer24. In the present embodiment, a plurality of electrodes each of which is included in different electrical circuits are formed for enabling connections of contact pairs with one operation of one keyswitch device1. In the example of the upper layer24shown inFIG.8, two upper electrodes31and32which are included in two different electrical circuits are formed. The upper electrode31has a contact31a, while the upper electrode32has a contact32a. A region92shown inFIG.8is a region which is pushed by the pushing part13bof the rubber cup51. At the inside of the region92, the contact parts31aand32aof the upper electrodes31and32and the corresponding contacts of the lower electrodes are brought into contact. Further, the region93is a region in the membrane sheet23where the hole25aof the spacer25is formed. That is, the region93is a region where the upper layer24deforms when the membrane sheet23is pushed. The contact31aand contact32ashown inFIG.8are respectively formed in semicircular planar shapes. Each of the contact part31aand contact part32aare formed so that at least its portion is arranged inside of the region92. InFIG.8, entire portions of the contact31aand contact32aare formed inside of the region92. The keyswitch device1in the present embodiment is arranged at a control device which controls an apparatus44. The control device in the present embodiment includes a drive circuit41. The keyswitch device1is included in the drive circuit41. The drive circuit41is used to drive the apparatus44. The drive circuit41in the present embodiment includes a plurality of electrical circuits, namely, a first control circuit42and second control circuit43. In the present embodiment, the first control circuit42and the second control circuit43are mutually independent electrical circuits and are formed to output respective control signals. The drive circuit41in the present embodiment drives the apparatus44according to the control signals when the control signal output from the first control circuit42and the control signal output from the second control circuit43match. That is, the drive circuit41in the present embodiment drives the apparatus44when both the first control circuit42and the second control circuit43are operating normally. The drive circuit41controls the apparatus44to stop if one or more of the first control circuit42and the second control circuit43experience an abnormality. The first control circuit42has a first electrode that includes the upper electrode31. Further, the second control circuit43has a second electrode that includes the upper electrode32. By the contact part31aof the upper electrode31and the corresponding contact part30aof the lower electrode contacting each other, the contact pair of the first control circuit42is connected. Further, by the contact part32aof the upper electrode32and the corresponding contact part of the lower electrode contacting each other, the contact pair of the second control circuit43is connected. The rubber cup51which is shown inFIG.6toFIG.8is arranged between the keytop10and the membrane sheet23. When the user pushes the keytop10, the pushing part10aof the keytop10pushes the abutting part13aof the rubber cup51and the deforming part13dof the rubber cup51deforms. The pushing part13bof the rubber cup51moves toward the membrane sheet23as shown by arrow101. The pushing part13bcontacts the upper layer24of the membrane sheet23to push the upper layer24. The deforming part13edeforms when the pushing part13bcontacts the upper layer24. The membrane sheet23deforms at the upper layer24, and the plurality of the upper electrodes31and32which are formed at the upper layer24and the lower electrodes which are formed at the lower layer26and correspond to the upper electrodes31and32contact each other. That is, the mutually facing contacts of the upper electrodes and contacts of the lower electrodes individually contact each other and are electrically connected. In the present embodiment, the contact pair of the first control circuit42and the contact pair of the second control circuit43are substantially simultaneously connected. When the user releases his or her finger from the keytop10, the rubber cup51returns to its original shape, and the contact pair of first control circuit42and the contact pair of the second control circuit43open. The keyswitch device1in the present embodiment enables the contact pairs to be simultaneously connected or disconnected by a single operation of the keytop10, as a plurality of contact pairs are arranged for a single keytop10. In this case, the electrical circuits have contact pairs which are connected or disconnected individually for the respective electrical circuits. In this regard, the keyswitch device1of the present embodiment has to connect a plurality of contact pairs when the pushing part13bof the rubber cup51pushes the membrane sheet23. For this reason, the membrane sheet23is preferably pushed more stably than with a keyswitch device which connects a single contact pair. For example, the keytop10preferably pushes the rubber cup51in a direction substantially vertical to the surface of the membrane sheet23as shown by arrow101. That is, the pushing part13bof the rubber cup51preferably pushes the center of the region where the contacts31aand32aare formed. Further, the amount of pushing of the keytop10is preferably made to an amount which is sufficiently large for the contacts of the upper electrodes and the contacts of the lower electrodes to contact each other. In the keyswitch device1of the present embodiment, a gear link mechanism is employed as the support mechanism which supports the keytop10. The support mechanism in the present embodiment is configured so that the drive of one link member enables the other link member to be driven through the tooth parts. For this reason, the keytop10can be kept from tilting while the keytop10is moving. The rubber cup51can be pushed in a direction substantially vertical to the surface of the membrane sheet23. For example, even when the user pushes an end part of the keytop10, the keytop10can be made to move in a direction substantially vertical to the surface of the membrane sheet23. The keytop10can be used to stably push the rubber cup51. For this reason, even if the membrane sheet23is formed with a plurality of contact pairs, the plurality of contact pairs can be connected or disconnected stably. Furthermore, since the support mechanism in the present embodiment enables suppression of tilting of the keytop10and make the keytop10move in the desired direction, the amount of pushing of the rubber cup51can be increased. For example, even when the keytop10is pushed in a direction tilted from the direction vertical to the surface of the membrane sheet23, the keytop10can move in a direction vertical to the surface of the membrane sheet23so as to keep the amount of movement of the keytop10from becoming smaller. For example, in a keyswitch device which is not provided with link members and the rubber cup alone is used to support the keytop, the keytop may be pushed while in a slanted state. In such a state, the pushing part of the rubber cup may be deviated from the center of the region in which the contacts are arranged, and the contact pair cannot be connected. For example, if the pushing part of the rubber cup pushes a position which deviates from the center of the hole of the spacer, one of the contact pairs may not be connected even if the other contact pair is connected. As opposed to this, the keyswitch device of the present embodiment can stably connect and disconnect the mutually independent contact pairs. The gear link in the present embodiment comprises link members which are arranged in a V-shape when viewed by a side view, but the invention is not limited to this. The embodiment may also have a mechanism by which link members engage through the tooth parts (gears). The electrodes of the upper layer24and the lower layer26of the membrane sheet23may be formed by any methods. The upper layer24and the lower layer26in the present embodiment are formed by polyethylene terephthalate (PET) films. Further, the upper electrodes and the lower electrodes are formed by printing the surfaces of these layers with conductor paste. Alternatively, the lower layer26may be formed with electrodes by etching of the circuit board or other board. For example, by forming a copper film on the surface of the lower layer26, coating a resist which corresponds to the shapes of the lower electrodes, and etching, it is also possible to remove the unnecessary parts of the copper film and form the desired shapes of the lower electrodes. The upper electrodes and lower electrodes in the first membrane sheet23have contacts which are formed into semispherical parts, but the invention is not limited to this. Electrodes of any patterns can be formed. Next, other shapes of the contacts of the electrodes will be illustrated. FIG.9is a bottom view of the upper layer of a second membrane sheet in the present embodiment. The upper layer62of the second membrane sheet includes the upper electrodes33and34. The contact33aof the upper electrode33and the contact34aof the upper electrode34are formed in linear shapes. The contact33aand the contact34aare formed so as to extend in parallel with each other and are arranged so as to be alternately aligned. At the inside of the region92where the pushing part13bof the rubber cup51pushes, the contact33aand the contact34aare arranged so as to face each other. FIG.10is a bottom view of an upper layer of a third membrane sheet in the present embodiment. The upper layer63of the third membrane sheet includes upper electrodes35and36. Similar to the electrodes of the second membrane sheet, the contact part35aof the upper electrode35and the contact part36aof the upper electrode36are formed into linear shapes. Further, the contact35aand the contact36aare arranged so as to be alternately aligned. FIG.11is a bottom view of an upper layer of a fourth membrane sheet in the present embodiment. The upper layer64of the fourth membrane sheet includes upper electrodes37and38having contacts37aand38a, respectively. The contacts37aand38aare formed with fan shapes. The upper electrode37is branched into two pieces and two contacts37aare formed. The electrode38is branched into two pieces and two contacts38aare formed. The two contact parts37aare the same in potential and are arranged so as to face each other. Further, the two contact parts38aare the same in potential and are arranged so as to face each other. The respective contact parts37aand38ahave shapes of a circle divided into four equal parts. The contact parts37aand contact parts38aare arranged alternating with each other along the circumferential direction. FIG.12is a bottom view of the upper layer of a fifth membrane sheet in the present embodiment. The upper layer65of the fifth membrane sheet includes the upper electrodes39and40. Similar to the electrodes of the fourth membrane sheet, the upper electrode39is branched into four pieces and four contacts39aare formed, and the upper electrode40is branched into four pieces and four contacts40aare formed. The four contact parts39aare the same in potential. Further, the four contact parts40aare the same in potential. The contact parts39aand contact parts40aare respectively formed into fan shapes. The respective contact parts39aare40ahave shapes of a circle divided into eight equal parts. The shapes of the contact parts of the electrodes may employ shapes obtained by dividing circles or other geometric shapes or linear shapes. Further, when one electrode includes a plurality of contact parts, rather than have the contact parts arranged adjoining each other, it is preferable to arrange them dispersed within the region92which is pushed by the pushing part13bof the rubber cup51. Next, the rubber cup of the keyswitch device in the present embodiment will be explained. The deforming part13eand pushing part13bof the first rubber cup51shown inFIGS.4to6are formed in conical shapes, but the invention is not limited to this. The pushing part of the rubber cup may employ any shape which can push the membrane sheet23. FIG.13is a perspective view of the second rubber cup in the present embodiment when seen from the back side. The second rubber cup52has a columnar shaped pushing part13gand a deforming part13h. The pushing part13gis formed so that the surface which pushes the membrane sheet23becomes a planar surface. The second rubber cup52can push the membrane sheet23over a wide area. FIG.14is a perspective view of the third rubber cup in the present embodiment when seen from the back side. The third rubber cup53includes a pushing part13i. The pushing part13ihas a substantially three-sided prismatic shape when seen by a perspective view as shown inFIG.14. The top part of the pushing part13ihas a ridge which extends straight in a single direction shown by arrow103. The top part which extends in a line in the pushing part13ifaces the membrane sheet23. The pushing part13ihas a V-shaped cross-sectional shape when cut in a direction vertical to the direction in which the ridge extends. FIG.15is a view which explains the direction of arrangement of the third rubber cup in the present embodiment.FIG.15shows the upper layer24of the first membrane sheet (seeFIG.8). The contact parts31aand32aof the upper electrodes31and32of the first membrane sheet23face each other. The third rubber cup53is preferable for electrodes where contact parts31aand32aface each other as illustrated inFIG.15. When using the third rubber cup53, the region92of the upper layer24which is pushed by the pushing part13ibecomes rectangular. The region92has a shape which extends corresponding to the straight top part of the pushing part13bas shown by arrow103. In the example ofFIG.15, the rubber cup53is arranged so that the direction in which the top part of the pushing part13bof the rubber cup53extends and the direction in which the contact part31aand the contact part32aface each other become substantially parallel. Due to this configuration, it is possible to more stably push the plurality of contact parts. In the first rubber cup51shown inFIG.5andFIG.6, the pushing part13bis pointed, so pushes the membrane sheet23in a point manner. For this reason, sometimes part of the contact pairs among the plurality of contact pairs will not be sufficiently stably connected. For example, in the upper layer24of the first membrane sheet shown inFIG.8, the first rubber cup51pushes the membrane sheet23centered about the region between the contact part31aand the contact part32a. For this reason, sometimes the pushing operation of the contact part31aor the contact part32abecomes insufficient. Further, in the second rubber cup52shown inFIG.13, the pushing part13gis formed in a columnar shape. The second rubber cup52is planar in shape at the part which pushes the membrane sheet23. For this reason, it is possible to push the membrane sheet23over a large region, but the force of pushing the membrane sheet23is dispersed and sometimes the upper layer24insufficiently deforms. As opposed to this, in the third rubber cup53in the present embodiment, the region which pushes the membrane sheet23becomes rectangular in shape. The membrane sheet can be pushed over a wider range than the first rubber cup51. Further, with the second rubber cup52, since the top part of the pushing part13gis planar, the force is dispersed, while with the third rubber cup53, the top part of the pushing part13iis linear, so dispersion of the force can be suppressed. As a result, the contact part of the upper electrode and the contact part of the lower electrode can be made to contact more reliably. In particular, by arranging the third rubber cup53so that the top part of the pushing part extends along the direction in which the contact parts face each other, the contact parts can be made to contact each other more reliably and the plurality of contact pairs can be connected more stably. FIG.16is a view which explains the direction of arrangement of the third rubber cup in the present embodiment.FIG.16shows the upper layer62of the second membrane sheet (seeFIG.9). The contact parts33aand34aof the upper electrodes33and34of the second membrane sheet are formed into linear shapes and are arranged in parallel with each other. The third rubber cup53is suitable even for electrodes which a plurality of contact parts33aand34aextend in a single direction. The third rubber cup53can be arranged so that the longitudinal direction of the region92by which the pushing part13ipushes the membrane sheet23becomes substantially parallel with the direction in which the plurality of contact parts33aand34aface each other. That is, the third rubber cup53enables the direction in which the linear top part of the pushing part13iextends to be set vertical to the direction in which the contact parts33aand34aextend. In this configuration as well, the contact parts can be made to contact each other more reliably and a plurality of contact pairs can be connected more stably. FIG.17is a perspective view when viewing the fourth rubber cup in the present embodiment when seen from the back side. The fourth rubber cup54has two pushing parts13j. The respective pushing parts13jare formed to be pointed. The two pushing parts13jare arranged aligned in the direction which is shown by arrow104. The fourth rubber cup54can push the membrane sheet23centered about the plurality of pushing parts13j. FIG.18is a view which explains the direction of arrangement of the fourth rubber cup in the present embodiment.FIG.18shows the upper layer24of the first membrane sheet23(seeFIG.8). The fourth rubber cup54is arranged so that the direction in which the two pushing parts13jare arranged, shown by arrow104, and the direction in which the plurality of contact parts31aand32aface each other become substantially parallel. The regions96which are pushed by the pushing parts13jof the rubber cup54can be arranged right over the contact parts31aand32a. In this way, it is possible to form a plurality of pushing parts13jso as to correspond to the positions of the plurality of contact parts31aand32a. Due to this configuration, it is possible to electrically connect the plurality of contact pairs more reliably. FIG.19is a perspective view of the fifth rubber cup in the present embodiment when seen from the back side. The fifth rubber cup55has a plurality of pushing parts13k. The pushing parts13khave pointed front ends and are formed into peak shapes. In the fifth rubber cup55as well, in the same way as the fourth rubber cup, the plurality of pushing parts13kcan be formed so as to correspond to the positions of the plurality of contact parts31a,32aof the upper electrodes31and32. Next, push characteristics of the keyswitch device in the present embodiment will be explained.FIG.20is a graph shows the load when operating the keyswitch device in the present embodiment.FIG.20is a graph of the push characteristics. The abscissa shows the amount of movement of the keytop10, while the ordinate shows the load when pushing the keytop10. The keytop10is formed to be able to move up to the amount of movement X4. That is, X4 corresponds to the stroke of the keytop10. FIG.21is a cross-sectional view of the rubber cup pushing the keyswitch device in the present embodiment.FIG.21shows the second rubber cup (seeFIG.13). The second rubber cup52has a columnar shaped pushing part13g. The pushing part13gpushes the membrane sheet23. As shown inFIG.20andFIG.21, when the user starts to push the keytop10, the load gradually increases. Up until the amount of movement of the keytop10becomes X1, deformation of the outside deforming part13dincreases the load. Further, at the amount of movement X1, the deforming part13dbuckles and deforms, so when the amount of movement exceeds X1, the load will fall. Next, when the amount of movement reaches X2, the pushing part13gof the rubber cup52contacts the upper layer24of the membrane sheet23. Due to the pushing part13gpushing the membrane sheet23, the upper layer24deforms and a force is generated in an opposite direction to the direction of pushing the membrane sheet23. Further, the inside deforming part13hdeforms and balances with the force due to the membrane sheet23. The force due to deformation of the deforming part13his transmitted to the abutting part13aand corresponds to part of the load. At the amount of movement X3, the load due to deformation of the deforming parts13dand13hbecomes local minimum value. Further, in the example shown inFIG.20, at the amount of movement X3, the contact part of the upper electrode of the membrane sheet23contacts the contact part of the lower electrode. That is, electrical connection is achieved by a local minimum point95of load. When the keytop10is further pushed and the amount of movement becomes larger than X3, the force in a direction opposite to the direction of pushing the membrane sheet23becomes larger and the load rises until the amount of movement becomes X4. The auxiliary line94shows the load in the case where there is no deforming part13h. Further, the load L shows the load for causing deformation of the upper layer24of the membrane sheet23. When pushing the keytop10, if electrical connection is obtained by an amount of movement of the local minimum point95of the load or an amount of movement smaller than the local minimum point95, a good feeling of operation can be obtained. On the other hand, if electrical connection is achieved by an amount of movement larger than the amount of movement of the local minimum point95of the load when the keytop10is pushed, sometimes an odd feeling arises in operation. For example, if the upper layer24of the membrane sheet23is large in elasticity, the amount of deformation of the deforming part13hup until the contact part of the upper electrode and the contact part of the lower electrode contact will become larger. That is, the amount of movement of the keytop10when electrical connection is achieved becomes larger. In this case, the electrical connection is achieved by a range of amount of movement larger than the local minimum point95of the load and an odd feeling arises in operation. Further, if the position at which electrical connection is achieved is too deep, sometimes the amount by which the keytop10is pushed will be insufficient and electrical connection will not be achieved. In particular, sometimes, when the keytop10is not sufficiently pushed, electrical connection will not be achieved. For example, in a keyboard81which has a plurality of keyswitch devices1, the keyswitch devices1which are arranged at the outer periphery of the keyboard81will sometimes be pushed by a smaller force than the keyswitch devices1which are arranged at the center part of the keyboard81. If the position of electrical connection is too deep, sometimes electrical connection will not be sufficiently achieved in the keyswitch devices1which are arranged at the outer periphery. In the keyswitch device1of the present embodiment, the upper layer24is formed so as to give an elastic force whereby electrical connection is achieved in the region of not more than the amount of movement of local minimum point95. Further, the deforming part13his formed so as to give an elastic force whereby electrical connection is achieved in a region of not more than the amount of movement of the local minimum point95. In this way, the membrane sheet23and rubber cup52in the present embodiment are selected in shape or material so that electrical connection is obtained by an amount of movement of less than the local minimum point95of the load. Due to this configuration, it is possible to operate the keyswitch device by a good operating feeling. Alternatively, it is possible to achieve electrical connection reliably. Further, while pushing the membrane sheet23, the pushing part of the rubber cup will sometimes deform. For example, the first rubber cup51shown inFIG.6has a shape with a pointed pushing part13b. For this reason, the pushing part13bboth pushes the membrane sheet23and deforms. Due to deformation of the pushing part13b, a force is generated in an opposite direction to the direction pushing the keytop10. Even when using a rubber cup which has such a deformable pushing part, in the push characteristics of the keytop, it is preferable to achieve electrical connection in a region of not more than the amount of movement of the local minimum point95of the load. That is, the pushing part is preferably selected to a material and shape by which electrical connection is achieved in a region of not more than the amount of movement of the local minimum point95. For example, as shown inFIG.7, in the membrane sheet23in the present embodiment, the diameter “d” of the hole25aof the spacer25is formed to be 4.3 mm. The gap G between the contact part31aand the contact part30ais formed to be 50 μm. The upper layer24is formed by a PET film with a thickness of about 75 μm. By forming such a membrane sheet23, in a single contact pair, the contact part of the upper electrode and the contact part of the lower electrode can be made to contact each other by a load of 20 g or less. As a result, in the push characteristics, it is possible to obtain electrical connection in a region of not more than the amount of movement of the local minimum point95. The contact part of the upper electrode and the contact part of the lower electrode in the present embodiment have substantially the same shapes, but the invention is not limited to this. It is sufficient that it be formed so that the contact part of the upper electrode and the contact part of the lower electrode can contact each other. For example, the shape of the contact part of the upper electrode and the shape of the contact part of the lower electrode may be different from each other. Further, as the support mechanism which supports the keytop in the above-mentioned keyswitch device, a gear link mechanism is employed, but the invention is not limited to this. A pantograph mechanism may also be employed. FIG.22is a cross-sectional view of another keyswitch device in the present embodiment. The other keyswitch device shown inFIG.22employs a support member, which is a pantograph mechanism which supports the keytop10. The keytop10is supported at the base member21through the plurality of link members15and16. At the downside of the base member21, the support member22and membrane sheet23are arranged. Between the keytop10and the support member22, an elastic member, namely the rubber cup51is arranged. The link members15and16have slide shafts15aand16aat one ends. The link members15and16have pivot shafts15band16bat the other ends. The slide shafts15aare slidably supported at the frames10cwhich are formed at the keytop10. The slide shafts16aare slidably supported at the frames21awhich are formed at the base member21. The pivot shaft15bis pivotally supported at an insert part21bwhich is formed in the base member21. The pivot shaft16bis pivotally supported at an insert part10bwhich is formed in the keytop10. The link member15and the link member16are arranged so as to intersect each other when viewed by a side view. The link members15and16are supported by the support shaft17. The support shaft17is arranged at a part where the link members15and16intersect. The link members15and16engage with each other through the support shaft. The part where the link members15and16intersect and the support shaft17is arranged corresponds to the engagement part. In the pantograph mechanism, when the keytop10is pushed in the direction shown by arrow101, the slide shafts15aand16amove in the directions shown by arrows102. Further, the rotary shafts15band16bturn and the link members15and16are driven. As the link members15and16are engaged through the support shaft17, when one link member is driven, the other link member is driven linked with this through the support shaft17. For example, if an end part of the keytop10is pushed and the link member15starts to be driven, the link member16is also driven through the support shaft17. Due to the linkage of the link members15and16, the keytop10can be made to move in a direction substantially vertical to the surface of the membrane sheet23. In this way, even when the support mechanism of the keytop is a pantograph mechanism, it is possible to stably push the rubber cup in the same way as the gear link mechanism. Even when connecting a plurality of contact pairs by a single operation in the membrane sheet23, stable connection can be achieved. The keyboard and keyswitch device in the present embodiment can, for example, be suitably used for the control panel of industrial machinery or the control panel of medical equipment, etc. The keyswitch device in the present embodiment is arranged at a keyboard, but the invention is not limited to this. It is possible to employ it for any keyswitch device which performs key input. Note that, when arranging a plurality of keyswitch devices at a keyboard, the plurality of rubber cups may also be integrally formed. The above embodiments may be suitably combined. In the above figures, the same or corresponding parts are assigned the same reference numerals. Note that the above embodiments are illustrations and do not limit the invention. Further, in the embodiments, the changes which are shown in the claims are included. | 37,394 |
11862416 | DETAILED DESCRIPTION OF THE INVENTION In order to make the purpose, the technical solution and the advantages of the present invention more clearly and unambiguously, the present invention is further clarified by the specific embodiments in combination with the following drawings. FIG.1is a block diagram of a hybrid DC circuit breaker according to a preferred embodiment of the present invention. As shown inFIG.1, the hybrid DC circuit breaker1comprises a mechanical switch11connected to a first current branch, and a semiconductor switch13and a forced resonant injection circuit14which are connected to a second current branch. The forced resonant injection circuit14comprises a terminal1461and a terminal1462, the terminal1461of the forced resonant injection circuit14is connected to one end of the semiconductor switch13, and the other end of the semiconductor switch13and the terminal1462of the forced resonant injection circuit14are connected to two ends of the mechanical switch11respectively. The hybrid DC circuit breaker1further comprises a surge arrester12connected in parallel with the semiconductor switch13. For convenience of the following description, inFIG.1, directions of a current ISW in the mechanical switch11, a current IA in the surge arrester12, a current IB in the semiconductor switch13, an injection current IC output by the forced resonant injection circuit14and a current ICB in the hybrid DC circuit breaker1are identified by arrows respectively. The forced resonant injection circuit14is controlled to output the gradually increasing injection current IC, wherein the injection current IC, with a direction opposite to that of the current ISW in the mechanical switch11, flows into the mechanical switch11and is used for enabling the current ISW in the mechanical switch11to gradually decrease to zero in a predetermined commutation time. FIG.2is a current curve versus time in the hybrid DC circuit breaker shown inFIG.1. As shown inFIG.2, before the time t1, the DC power supply system is in a normal power supply state, no fault current exists in the circuit, the mechanical switch11is in a switch-on state, the semiconductor switch13is in a turn-off state, and the DC power supply system normally supplies power to a load (not shown inFIG.1) through the conducted mechanical switch11; and at this time, the current IA in the surge arrester12, the current IB in the semiconductor switch13and the injection current IC output by the forced resonant injection circuit14are all zero, and the current ISW in the mechanical switch11is equal to the current ICB in the hybrid DC circuit breaker1. As the current in the forced resonant injection circuit14is zero, the power consumption of the forced resonant injection circuit14is zero in the normal power supply process. At the time t1, when a short circuit occurs on the load, the current ISW in the mechanical switch11and the current ICB in the hybrid DC circuit breaker1sharply increase. At the time t2, when the current ISW in the mechanical switch11increases to a tripping current, and a control device or a tripping circuit (not shown inFIG.1) starts to control the mechanical switch11to be switched off. At the times t2-t3, contacts of the mechanical switch11are in a separating process, and the current ISW in the mechanical switch11and the current ICB in the hybrid DC circuit breaker1gradually increase. At the time t3, the semiconductor switch13is controlled to be switched on, and the forced resonant injection circuit14is controlled to start to output the injection current IC from the time t3at the same time. A direction of the injection current IC is that the injection current IC flows from the terminal1461to the terminal1462and is injected into the mechanical switch11in a direction opposite to that of the current ISW in the mechanical switch11. At the times t3-t4, the injection current IC output by the forced resonant injection circuit14and the current IB in the semiconductor switch13gradually increase; and as the direction of the injection current IC is opposite to that of the current ISW in the mechanical switch11, the current ISW in the mechanical switch11gradually decreases. In this process, the current ISW in the mechanical switch11is gradually commutated to the semiconductor switch13, and the current IB in the semiconductor switch13and the current ICB in the hybrid DC circuit breaker1continue to rise. At the time t4, the current ISW in the mechanical switch11is zero, the current commutation process is completed at this time, the injection current IC output by the forced resonant injection circuit14is equal to zero, and the current is stopped from being injected into the mechanical switch11. At the times t4-t5, a short-circuit current only flows through the semiconductor switch13in the switch-on state; and at this time, the current IB in the semiconductor switch13continues to increase, and the current ICB in the hybrid DC circuit breaker1gradually increases. In this process, a moving contact of the mechanical switch11continues to be opened at several meters per second, and an pitch between the moving contact and a static contact reaches a predetermined contact pitch at the time t5. As the injection current IC output by the forced resonant injection circuit14enables the current ISW in the mechanical switch11to have been already commutated to the semiconductor switch13, and the mechanical switch11would not withstand high current interruption in this process, that is, the mechanical switch11does not require to be switched off at a high current. Specifically, the mechanical switch11would achieve zero current switch-off and no-arc switch-off. At the time t5, the control device (not shown inFIG.1) controls the semiconductor switch13to be in the turn-off or switch-off state, the current IB in the semiconductor switch13decreases to zero, and at this time, the current ICB in the hybrid DC circuit breaker1reaches its maximum value. At the times t5-t6, as there is no zero-crossing point of potential in the DC power supply system, at this time, residual electric energy in the DC power supply system is discharged through the surge arrester12and the terminals1461,1462of the forced resonant injection circuit14, and the surge arrester12starts to consume the electric energy in the DC power supply system, so that the current IA in the surge arrester12gradually decreases to zero, and the current ICB in the hybrid DC circuit breaker1gradually decreases to zero at the same time. Finally, at the time t6, a fault is cleared. In the hybrid DC circuit breaker1of the present invention, the two terminals1461,1462of the forced resonant injection circuit14and the semiconductor switch13are connected in series to the second current branch and are not connected to the first current branch, at which the mechanical switch11is located, so that in the normal power supply or direct current transmission process, the DC power supply system only supplies power to the load through the mechanical switch11, and the power consumption of the forced resonant injection circuit14is zero. In addition, in the switching-off process of the mechanical switch11, the forced resonant injection circuit14of the present invention can controllably inject the gradually increasing injection current IC with the direction opposite to that of the current ISW into the mechanical switch11and can control the current ISW in the mechanical switch11to be commutated to the semiconductor switch13from the time t3to the time t4, that is, the forced resonant injection circuit14can control the current commutation time. The forced resonant injection circuit14can control a current change rate of the current IB in the semiconductor switch13at the end time t4of current commutation; and with a relatively small current change rate, the mechanical switch11has a relatively strong rapid switching-off ability and a relatively small switching-off loss. At the end time (i.e. time t4) of current commutation, recovery voltages at two ends of the mechanical switch11depend on a resistance of the semiconductor switch13and the current IB in the semiconductor switch13so as to be capable of being relatively small, for example, being a few volts to tens of volts. At the end time of current commutation, the current change rate of the mechanical switch11is relatively small, and relatively small recovery voltages are provided at two ends of the mechanical switch11, so that the mechanical switch11can be safely and reliably switched off. The time period from the time t4to the time5is a turn-off delay time of the hybrid DC circuit breaker1and is used for enabling the pitch between the moving contact and the static contact of the mechanical switch11to reach the predetermined contact pitch in the turn-off delay time, wherein the predetermined contact pitch and the turn-off delay time depend on the recovery voltages of the mechanical switch11and an opening speed of the moving contact. When the hybrid DC circuit breaker1is used for a bidirectional DC power supply system, for example, when the direction of the current in the hybrid DC circuit breaker1is opposite to that of the above current ICB, the forced resonant injection circuit14is controlled to output the gradually increasing injection current by the terminal1461. FIG.3is a specific block diagram of a forced resonant injection circuit in the hybrid DC circuit breaker shown inFIG.1. As shown inFIG.3, the forced resonant injection circuit24comprises a DC power supply241, a DC bus capacitor C1connected between a DC bus, an inverter242, a resonant circuit243, a rectification circuit244, a polarity module245and an output module246, wherein an input end of the inverter242is connected to the DC power supply241, and an output end is connected to an input end of the rectification circuit244through the resonant circuit243; an output end of the rectification circuit244is connected to an input end of the polarity module245; an output end of the polarity module245is connected to an input end of the output module246; and one terminal2461of the output module246is connected to one end of a semiconductor switch23, and the other terminal2462is connected to one end of a mechanical switch21. Power supplied to the DC power supply241is from direct voltage on the first current branch or an external power supply so as to charge the DC bus capacitor C1; and the DC bus capacitor C1provides a current to the forced resonant injection circuit through the DC bus, wherein an equivalent resistor, an equivalent capacitor and an equivalent inductor of the inverter242, the resonant circuit243, the rectification circuit244, the polarity module245and the output module246form an underdamped resonant circuit. The control device (not shown inFIG.3) provides a pulse width modulated signal at a high frequency (for example, of 10-100 KHz), i.e. a switching pulse, to the inverter242, so that the inverter242inverts a direct current on the DC bus capacitor C1to an alternating current, i.e. a square-wave periodic voltage pulse of alternating polarities, wherein a frequency of the square-wave periodic voltage pulse depends on a resonant frequency of the underdamped resonant circuit, so that the resonant circuit243outputs a resonant current IRES. The output module246is configured to generate switch-off of a current between the input end of the output module246and the first current branch. FIG.4is a waveform diagram of a resonant current output by a resonant circuit in the forced resonant injection circuit shown inFIG.3. As shown inFIG.4, the resonant current IRES is an alternating current with a gradually increasing amplitude, and the resonant frequency of the resonant current IRES is determined by an inherent frequency of an inductor, a capacitor and an equivalent resistor (for example, a bulk resistor of the inductor and the capacitor) of an equivalent load circuit. When oscillation is started, the inverter242outputs voltage to the resonant circuit243, and thus the resonant circuit243starts to generate an oscillating current. When the resonant current IRES passes zero each time, the inverter242is controlled to switch a polarity of the output voltage, and the electric energy on the DC bus capacitor C1is output to the resonant circuit243through the inverter242, so that the electric energy is supplied in each switching period, and the amplitude of the resonant current IRES output by the resonant circuit243gradually increases. The rectification circuit244is used for rectifying the resonant current IRES output by the resonant circuit243into the pulsating direct current. FIG.5is a waveform diagram of a rectified current output by a rectification circuit in the forced resonant injection circuit shown inFIG.3. As shown inFIG.5, the rectified current IR is the pulsating direct current, of which a direction is invariable, and the amplitude periodically increases. The polarity module245comprises a positive input terminal, a negative input terminal, a polarity terminal2451and a polarity terminal2452; and the positive input terminal and the negative input terminal of the polarity module245are connected to the positive output terminal and the negative output terminal of the rectification circuit244respectively. The polarity module245controllably enables the polarity terminals2451,2452to serve as the positive output terminal and the negative output terminal or the negative output terminal and the positive output terminal respectively. Thus, the polarity module245outputs a non-inverted or inverted pulsating direct current of the pulsating direct current output by the rectification circuit244. The output module246is used for filtering or reducing the alternating component in the pulsating direct current output by the polarity module245, and thus outputting a smooth direct current with a gradually increasing amplitude. FIG.6is a waveform diagram of an injection current output by an output module in the forced resonant injection circuit shown inFIG.3. As shown inFIG.6, the injection current IC output by the output module246is the smooth direct current, of which the amplitude gradually increases over time. The injection current IC is output from the terminal2462of the output module246and flows into the mechanical switch21, so that the current in the mechanical switch21gradually decreases to zero in the current commutation time. By supplying the pulse width modulated signal at the high frequency (for example, 10-100 KHz) to the inverter242, the output module246can output the gradually increasing and smooth direct current in several periods of the switching frequency, so that a fault current in the mechanical switch21can be rapidly commutated to the semiconductor switch23. In other embodiments of the present invention, when the hybrid DC circuit breaker2is used for a one-way DC power supply system, the hybrid DC circuit breaker2may not have the polarity module245, and the semiconductor switch23may be a one-way controllable semiconductor switch. FIG.7is a specific circuit diagram of a hybrid DC circuit breaker according to a first embodiment of the present invention. As shown inFIG.7, the semiconductor switch33is a bidirectional controllable semiconductor switch, comprising an insulated gate bipolar transistor T31with an antiparallel diode and an insulated gate bipolar transistor T32with an antiparallel diode, wherein an emitter of the insulated gate bipolar transistor T31is connected to an emitter of the insulated gate bipolar transistor T32. Through conduction of the insulated gate bipolar transistor T31or T32, one-way conduction of the direct current is achieved. The inverter342is a full-bridge inverter formed by four field effect transistors. The resonant circuit343comprises an inductor L3and a capacitor C3connected in series. By selecting the inductor L3and the capacitor C3with suitable parameters, the underdamped resonant circuit is formed when the condition that R′<2√{square root over (L′/C′)}is satisfied, wherein R′, L′ and C′ are an equivalent resistance value, an equivalent inductance value and an equivalent capacitance value of the inverter342, the resonant circuit343, the rectification circuit344, the polarity module345and the output module346respectively. For example, when the equivalent resistance value, the equivalent inductance value and the equivalent capacitance value are 3.5 ohms, 150 μH and 82 nF respectively, at this time, the underdamped resonant circuit is formed. The switching frequency of the inverter342depends on the resonant frequency of the underdamped resonant circuit, for example, if the inductor L3of 150 μH and the capacitor C3of 82 nF are selected, the switching frequency of the inverter342is ½π√{square root over (L′/C′)}, i.e. about 45 KHz. When the two diagonal insulated gate bipolar transistors in the inverter342are controlled to be switched on, the DC power supply341outputs the electric energy through the two diagonal conducted insulated gate bipolar transistors, and thus the resonant circuit343outputs a current of a first polarity. When the other two diagonal insulated gate bipolar transistors in the inverter342are controlled to be switched on, the DC power supply341outputs the electric energy through the two conducted insulated gate bipolar transistors, and thus the resonant circuit343outputs a current of a second polarity and with an increased amplitude. The insulated gate bipolar transistors in the inverter342are controlled to be alternately switched on in the above two modes, so that the resonant circuit343outputs an alternating current with a gradually increasing amplitude in a plurality of switching periods of the pulse width modulated signal. The rectification circuit344is a full-wave rectification circuit, comprising four diodes. The polarity module345comprises a full-bridge circuit, controlled to change polarities of an input current and an output current of the polarity module. Specifically, the polarity module345comprises four insulated gate bipolar transistors T33, T34, T35and T36with antiparallel diodes and diodes D33, D34, D35and D36connected in series with the insulated gate bipolar transistors T33, T34, T35and T36respectively, wherein a node N1formed by connecting the insulated gate bipolar transistor T33and the diode D33connected in series with the insulated gate bipolar transistor T34and the diode D34connected in series serves as the polarity terminal3451of the polarity module345, and a node N2formed by connecting the insulated gate bipolar transistor T35and the diode D35connected in series with the insulated gate bipolar transistor T36and the diode D36connected in series serves as the polarity terminal3452of the polarity module345; wherein when the diagonal insulated gate bipolar transistors T33and T36are controlled to be switched on, the polarity terminals3451,3452serve as the positive output terminal and the negative output terminal of the polarity module345respectively, and when the diagonal insulated gate bipolar transistors T34and T35are controlled to be switched on, the polarity terminals3451,3452serve as the negative output terminal and the positive output terminal of the polarity module345respectively. The output module346is an autotransformer which is coreless to prevent magnetic saturation. The autotransformer comprises a winding L31and a winding L32, a dotted terminal of the winding L31is connected to the node N1, a dotted terminal of the winding L32is connected with an undotted terminal of the winding L31and serves as the terminal3461of the output module346, and an undotted terminal of the winding L32is connected to the node N2and serves as the terminal3462of the output module346. When the polarity terminal3452of the polarity module345outputs a current I31, and the current I31flows into the undotted terminal of the winding L32, the current I31flows to the dotted terminal of the winding L31from the undotted terminal of the winding L31; a current I32is provided from the dotted terminal of the winding L32to the undotted terminal of the winding L32; and the terminal3462outputs the injection current IC, wherein the injection current IC is equal to a sum of the current I31and the current I32. The injection current IC is injected into the mechanical switch31, so that the current ISW in the mechanical switch31gradually decreases to zero in the current commutation time. FIG.8is a specific circuit diagram of a polarity module in a hybrid DC circuit breaker according to a second embodiment of the present invention. As shown inFIG.8, the polarity module445comprises four insulated gate bipolar transistors T43, T44, T45and T46without antiparallel diodes, wherein the insulated gate bipolar transistors T43and T44are connected to form a bridge arm, and the insulated gate bipolar transistors T45and T46are connected to form another bridge arm. Specifically, collectors of the insulated gate bipolar transistors T43and T45are connected and used for being connected to the positive output terminal of the rectification circuit; emitters of the insulated gate bipolar transistors T44and T46are connected and used for being connected to the negative output terminal of the rectification circuit; a node N41formed by connecting an emitter of the insulated gate bipolar transistor T43with a collector of the insulated gate bipolar transistor T44serves as one polarity terminal4451of the polarity module445; and a node N42formed by connecting an emitter of the insulated gate bipolar transistor T45with a collector of the insulated gate bipolar transistor T46serves as the other polarity terminal4452of the polarity module445. When the diagonal insulated gate bipolar transistors T43and T46are controlled to be switched on, and the insulated gate bipolar transistors T44and T45are controlled to be turned off, the polarity terminals4451and4452serve as the positive output terminal and the negative output terminal respectively, wherein the current flows out from the polarity terminal4451and flows in from the polarity terminal4452. When the other diagonal insulated gate bipolar transistors T44and T45are controlled to be switched on, and the insulated gate bipolar transistors T43and T46are controlled to be turned off, the polarity terminals4451and4452serve as the negative output terminal and the positive output terminal respectively, wherein the current flows out from the polarity terminal4452and flows in from the polarity terminal4451. FIG.9is a specific circuit diagram of an output module in a hybrid DC circuit breaker according to a third embodiment of the present invention. As shown inFIG.9, the output module446is a coreless transformer, comprising a primary winding L41and a secondary winding L42, wherein a dotted terminal and an undotted terminal of the primary winding L41are used for being connected to the positive output terminal and the negative output terminal of the rectification circuit244respectively or the two polarity terminals2451,2452of the polarity module245respectively; and a dotted terminal and an undotted terminal of the secondary winding L42serve as output terminals4461,4462respectively and are used for being connected to the semiconductor switch and the mechanical switch respectively. When the current flows from the undotted terminal of the primary winding L41to the dotted terminal, the current in the secondary winding L42flows from the output terminal4461to the output terminal4462. The coreless transformer446has a galvanic isolation function and can further lower the power consumption of the high-frequency resonant circuit IRES in the transmission process at the same time. FIG.10is a specific circuit diagram of a semiconductor switch in a hybrid DC circuit breaker according to a fourth embodiment of the present invention. As shown inFIG.10, the semiconductor switch43comprises a bridge circuit formed by connecting four diodes D41, D42, D43and D44and the insulated gate bipolar transistor T41. The collector of the insulated gate bipolar transistor T41is connected to negative poles of the diodes D41and D43, and the emitter of the insulated gate bipolar transistor T41is connected to positive poles of the diodes D42and D44. When the insulated gate bipolar transistor T41is controlled to be switched on, one conductive pathway is that the current flows in from the terminal431and flows to the terminal432with passing through the diode D41, the conducted insulated gate bipolar transistor T41and the diode D44; and the other conductive pathway is that the current flows in from the terminal432and flows to the terminal431with passing through the diode D43, the conducted insulated gate bipolar transistor T41and the diode D42. FIG.11is a specific circuit diagram of an inverter in a hybrid DC circuit breaker according to a fifth embodiment of the present invention. As shown inFIG.11, the inverter442is a half-bridge inverter, comprising insulated gate bipolar transistors T47, T48and capacitors C41and C42, wherein a positive input terminal and a negative input terminal of the half-bridge inverter442are electrically connected to a positive pole and a negative pole of the DC power supply241respectively and used for inverting the direct current output by the DC power supply241to the alternating current. The half-bridge inverter442only has two switching transistors, and thus the cost of a device can be saved. In other embodiments of the present invention, the inverter may further be a single-level, double-level or multi-level full-bridge (H bridge) inverter. In another embodiment of the present invention, the insulated gate bipolar transistors in the semiconductor switch33and/or the polarity module345in the above embodiments may be substituted with the switching transistors, including metal-oxide-semiconductor field effect transistors (MOSFET). In yet another embodiment of the present invention, the hybrid DC circuit breaker may comprise a plurality of semiconductor switches33connected in series. In yet another embodiment of the present invention, the rectification circuit244may employ a rectification circuit such as a half-wave rectification circuit to rectify the alternating current to the pulsating direct current. While the present invention has been described by way of the preferred embodiments, the present invention is not limited to the embodiments described herein, and various alterations and modifications can be made without departing from the scope of the present invention. | 26,579 |
11862417 | MODE FOR IMPLEMENTING THE INVENTION A vacuum interrupter according to an embodiment of the present invention is explained in detail with reference to the drawings. The drawings shown inFIG.1toFIG.4are views schematically showing a vacuum interrupter according to an embodiment of the present invention. The dimensions shown in the drawings do not necessarily correspond to the actual dimensions. As shown inFIG.1, a vacuum interrupter1according to an embodiment of the present invention is equipped with a vacuum container2, and a fixed electrode3and a movable electrode4that are provided in the vacuum container2. The vacuum container2is equipped with a cylindrical insulating tube5formed of ceramic material or the like, and a fixed-side end plate6and a movable-side end plate7that are respectively provided at end portions of the insulating tube5. The fixed-side end plate6is hermetically joined to one end portion of the insulating tube5, and the movable-side end plate7is hermetically joined to the other end portion of the insulating tube5. In this manner, the inside of the vacuum container2is sealed by the fixed-side end plate6and the movable-side end plate7to have vacuum. An end portion of the insulating tube5is equipped with a projection portion5aalong an outer periphery of the insulating tube5to project in the axial direction of the insulating tube5. An end plate joining portion5bis provided on an inner peripheral side of a base end portion of the projection portion5a. To the end plate joining portion5b, the fixed-side end plate6(or the movable-side end plate7) is joined. The radial thickness of the insulating tube5is formed to become thick, for example, at a projection portion of the end plate joining portion5b, and then gradually become the same thickness as that of a center portion of the insulating tube5from an end portion of the end plate joining portion5bon an inner side of the insulating tube5. It suffices to provide the end plate joining portion5bto project from an inner wall of the insulating tube5toward the radially inner side of the insulating tube5. Thus, for example, it is also possible to have a mode in which the end plate joining portion5bis made to project such that not only a surface of the end plate joining portion5bon an end side of the insulating tube5, but also a surface on an inner side of the insulating tube5become parallel with the radial direction of the insulating tube5. The projection portion5aand the end plate joining portion5bare monolithically formed with the insulating tube5. The end plate joining portion5bis equipped with a metallized layer8to which the fixed-side end plate6(or the movable-side end plate7) is joined by brazing or the like. As a brazing material for joining the fixed-side end plate6(or the movable-side end plate7) by brazing, a silver-based composite material is mainly used. As shown inFIG.2, the end plate joining portion5bis provided to project from a base end portion of the projection portion5atoward an inner side in the radial direction of the insulating tube5. The end plate joining portion5bis equipped with a joining surface5cto which the fixed-side end plate6is joined, and an inner peripheral surface5dthat extends in the axial direction of the insulating tube5from a projection end of the joining surface5c. The joining surface5cof the end plate joining portion5bis a surface extending from a base end portion of the projection portion5atoward an inner side in the radial direction of the insulating tube5, and is formed along an inner periphery of the insulating tube5. The inner peripheral surface5dof the end plate joining portion5bis an end surface projecting toward an inner side in the radial direction of the insulating tube5of the end plate joining portion5b, and is a surface forming a part of an inner peripheral surface of the insulating tube5. The projection portion5aand/or the end plate joining portion5band the metallized layer8at an end portion of the insulating tube5where the movable-side end plate7is provided are the same in shape as the projection portion5aand/or the end plate joining portion5band the metallized layer8at an end portion of the insulating tube5where the fixed-side end plate6is provided. Therefore, similar structures are denoted by the same signs, and their detailed explanations are omitted. The metallized layer8is equipped with a joining portion8aprovided on the joining surface5cof the end plate joining portion5b, and an extension portion8bprovided on the inner peripheral surface5dof the end plate joining portion5b. That is, the metallized layer8is equipped with the joining portion8aextending in the radial direction of the insulating tube5, and the extension portion8bextending in the axial direction of the insulating tube5from an end portion on an inner peripheral side of the insulating tube5of the joining portion8a. The joining portion8aand the extension portion8bare formed into one piece. As shown inFIG.1, the fixed electrode3and the movable electrode4are disposed in the vacuum container2such that they are opposed to each other. To the fixed electrode3, a fixed electrode rod3ais joined by brazing. Furthermore, to the movable electrode4, a movable electrode rod4ais joined by brazing. Furthermore, an intermediate shield9is provided in the inside of the vacuum container2to cover the fixed electrode3and the movable electrode4, thereby preventing contamination of an inner surface of the vacuum container2with a metal vapor that is generated by an arc between the fixed electrode3and the movable electrode4. The fixed electrode rod3ais an electrode shaft that supports the fixed electrode3in the insulating tube5, and is provided to pass through the fixed-side end plate6. The fixed electrode rod3ais provided with an electric field relaxation shield10. The electric field relaxation shield10is provided to be opposed to the metallized layer8(i.e., the extension portion8bof the metallized layer8) formed on a projecting end surface of the end plate joining portion5b. The movable electrode rod4ais an electrode shaft that supports the movable electrode4in the insulating tube5, and is provided to pass through the movable-side end plate7. The movable electrode rod4ais moved in the axial direction by an outside operation mechanism not shown in the drawings. By moving the movable electrode rod4ain the axial direction, the fixed electrode3and the movable electrode4are brought into contact or separated, thereby conducting a switching action (supply and shutdown) of the vacuum interrupter1. A bellows11is provided between the movable-side end plate7and the movable electrode rod4ato cover an outer periphery of the movable electrode rod4a. The bellows11is made into a serpentine shape with a thin stainless steel, and makes it possible to move the movable electrode rod4ain the axial direction while keeping vacuum sealing of the inside of the vacuum container2. Although not shown in the drawings, the bellows11is provided at its end portion on the side of the movable electrode4with a bellows shield. This bellows shield prevents contamination of the bellows11with a metal vapor that is generated by an arc between the fixed electrode3and the movable electrode4. The fixed-side end plate6is formed into a deep pan shape, and a flange end portion of this deep pan shape is joined by brazing to the metallized layer8(specifically, the joining portion8aof the metallized layer8) provided at the end plate joining portion5b. The fixed-side end plate6is formed with a hole through which the fixed electrode rod3apasses. The movable-side end plate7is formed into a deep pan shape, and a flange end portion of this deep pan shape is joined by brazing to the metallized layer8(specifically, the joining portion8aof the metallized layer8) provided at the end plate joining portion5b. The movable-side end plate7is formed with a hole through which the movable electrode rod4apasses. Furthermore, the movable-side end plate7is provided with an electric field relaxation shield12. The electric field relaxation shield12extends in the vacuum container2to be opposed to the metallized layer8(i.e., the extension portion8bof the metallized layer) formed on a projecting end surface of the end plate joining portion5b, and a tip portion of the electric field relaxation shield12is bent toward the inner side of the vacuum container2. Next, electric field analysis of the vacuum interrupter1according to an embodiment of the present invention was conducted. Electric field analysis was conducted by using an electric field analysis software ElecNet (made by Infolytica Co.). Electric field analysis was conducted by assuming an imaginary ground surface, which is parallel with the center axis (axis of the fixed electrode rod3aand the movable electrode rod4a) of the vacuum interrupter1, at a position away from the insulating tube5of the vacuum interrupter1. As shown inFIG.3(a), as electric field analysis of an end portion (a part surrounded by a circle in the drawing) of the metallized layer8on an outer peripheral side of the insulating tube5was conducted, the electric field value was 7.56%/mm. The electric field value (%/mm) indicates the proportion of electric potential difference change per 1 mm, assuming that the voltage (V) applied between the electrodes of the vacuum interrupter1is 100%. Furthermore, as another embodiment of the vacuum interrupter1of the present invention, an electric field analysis similar to the vacuum interrupter1was conducted on a metallized layer14of a vacuum interrupter13shown inFIG.3(b). As an electric field analysis of an end portion (a part surrounded by a circle in the drawing) of the metallized layer14on an outer peripheral side of the insulating tube5was conducted, the electric field value was 8.28%/mm. The vacuum interrupter13is similar to the vacuum interrupter1in structure, except in that the metallized layer14is not equipped with an extension portion (corresponding to the extension portion8bof the vacuum interrupter1) extending in the axial direction of the insulating tube5. Therefore, structures similar to those of the vacuum interrupter1are denoted by the same signs, and their detailed explanations are omitted. From these two analysis results, it is understood that the vacuum interrupter1is lower than the vacuum interrupter13in electric field value by about 10% by providing the end plate joining portion5bto project inwardly in the radial direction of the insulating tube5and by forming on the end plate joining portion5bthe metallized layer8having the extension portion8b. By forming the end plate joining portion5bto project from an inner peripheral surface of the insulating tube5in the radial direction of the insulating tube5, the vacuum interrupter13is capable of improving withstand voltage performance of the vacuum interrupter13without changing diameter of the vacuum interrupter13. According to the above-mentioned vacuum interrupter1,13according to an embodiment of the present invention, the end plate joining portion5b, to which the fixed-side end plate6(or the movable-side end plate7) is joined, is provided to project inwardly in the radial direction of the insulating tube5, and the fixed-side end plate6(or the movable-side end plate7) having a diameter smaller than outer diameter of the vacuum container2is provided on the end plate joining portion5b. With this, it is possible to improve withstand voltage performance of the vacuum interrupter1,13without changing inner diameter and outer shape of the vacuum container2. By providing the projection portion5aon an end portion of the insulating tube5to project in the axial direction of the insulating tube5, it is possible to conceal the end portion of the metallized layer8on the outer peripheral side of the insulating tube5from an outer peripheral portion of the vacuum container2, thereby making external flashover difficult to occur by barrier effect and improving withstand voltage performance of the vacuum interrupter1,13. In the case of providing the projection portion5aat an end portion of the insulating tube5, it is necessary to enlarge outer shape of the insulating tube5by the thickness of the projection portion5a. In case that the projection portion5ais thin in thickness, the projection portion5atends to be broken. And so, in the vacuum interrupter1,13according to an embodiment of the present invention, the end plate joining portion5bis provided to project inwardly in the radial direction of the insulating tube5. With this, it is possible to improve withstand voltage performance of the vacuum interrupter1without changing inner diameter and outer shape of the vacuum container2. That is, the thickness at the end plate joining portion5bof the insulating tube5is made thicker than the thickness of other parts of the insulating tube5. With this, it is possible to improve withstand voltage performance of the vacuum interrupter1,13without changing inner diameter and outer shape of the vacuum container2. Furthermore, irrespective of inner diameter and outer shape, it is possible to select thickness of the projection portion5a. Therefore, it is possible to improve strength of the projection portion5awithout changing inner diameter and outer shape of the vacuum container2. Furthermore, it is possible by extending the range of the metallized layer8to relax electric field of an end portion of the metallized layer8on an outer peripheral side of the insulating tube5and to improve withstand voltage performance of the vacuum interrupter1. By extending the metallized layer8to a range opposing the electric field relaxation shield10(or the electric field relaxation shield12), it is possible to lower the electric field value of an end portion of the metallized layer8on an outer peripheral side of the insulating tube5. However, the electric field value of an end portion of the metallized layer8on an inner peripheral side of the insulating tube5increases. Thus, the electric field relaxation shield10(or the electric field relaxation shield12) is provided to be opposed to the extension portion8bof the metallized layer8. With this, it is possible to relax electric field at an end portion of the metallized layer8on an inner peripheral side of the insulating tube5. By providing the electric field relaxation shield10(or the electric field relaxation shield12) to cover at least an end portion of the extension portion8b(to be opposed to the end portion of the extension portion8bin the radial direction of the insulating tube5) that extends from the joining portion8ain the axial direction of the insulating tube5, it is possible to suppress lowering of withstand voltage performance at the end portion of the extension portion8bat which electric field concentrates. That is, the formation range of the metallized layer8is extended to form the extension portion8bextended in the axial direction of the insulating tube5, and the electric field relaxation shield10(or the electric relaxation shield12) is provided to be opposed to the extension portion8bof this metallized layer8. With this, it is possible to relax electric field at an end portion of the metallized layer8on an inner peripheral side of the vacuum container2. Furthermore, the projection portion5ais formed on the insulating tube5, and the formation range of the metallized layer8is extended (that is, the metallized layer8is provided with the extension portion8b). With this, it is possible to relax electric field at an end portion of the metallized layer8on an outer peripheral side of the vacuum container2. As above, the vacuum interrupter of the present invention was explained by showing specific embodiments. The vacuum interrupter of the present invention is, however, not limited to the embodiments. It is possible to suitably modify the design to the extent that its feature is not damaged. The modified design also belongs to the technical scope of the present invention. A vacuum interrupter partly having the feature of the vacuum interrupter1explained in the embodiment also belongs to the technical scope of the present invention. For example, vacuum interrupters separately having the shape of the projection portion5aor the end plate joining portion5bof the insulating tube5or the shape of the metallized layer8are capable of separately obtaining the effects obtained by respective structures. Furthermore, as shown inFIG.4, it is also possible to provide a mode in which a connection portion5efor smoothly connecting an inner peripheral surface of the projection portion5aand the joining surface5cof the end plate joining portion5bis provided between the inner peripheral surface of the projection portion5aand the joining surface5cof the end plate joining portion5b, and in which the metallized layer8is provided along the curved surface of this connecting portion5eto extend from the joining surface5ctoward the direction of the inner peripheral surface of the projection portion5a. In this manner, as the metallized layer8is applied along the curved surface of the connecting portion5e, it is possible to prevent a local strengthening of electric field at an end portion of the metallized layer8on an outer peripheral side of the insulating container2, thereby further improving withstand voltage performance of the vacuum interrupter15. Furthermore, in connection with the shape of the projection portion5aand the end plate joining portion5b, it is possible to provide not only a mode that they are formed on both ends of the insulating tube5, but also a mode that they are formed on one of the end portions of the insulating tube5on which the fixed-side end plate6or the movable-side end plate7is provided. Furthermore, the shape of the fixed-side end plate6or the movable-side end plate7is not limited to a deep pan shape, as long as it is capable of hermetically sealing one end of the insulating tube5. For example, it may be a plate-like shape. Furthermore, it is also possible to provide the electric field relaxation shield10on an inner side of the insulating tube5of the fixed-side end plate6. | 18,143 |
11862418 | DESCRIPTION OF THE EMBODIMENTS In order to simplify the reading of the figures, the various elements are not necessarily represented to scale. In these figures, the elements that are identical bear the same references. Certain elements or parameters may be indexed, that is to say designated for example as first element or second element, or even first parameter and second parameter, etc. The purpose of this indexing is to differentiate elements or parameters that are similar, but not identical. This indexing does not imply any priority of one element, or parameter, over another, and the designations can be interchanged. When it is specified that a device comprises a given element, that does not preclude the presence of other elements in that device. FIG.1shows an electrical unit1comprising:a main switch20of a main circuit30,a switching device50,a vacuum interrupter2disposed in parallel with the main switch20. In other words, the vacuum interrupter2is shunt-mounted on the main circuit30of the electrical unit1. The vacuum interrupter2is provided for a medium-voltage, that is to say a voltage lying between 1 kV and 52 kV, electrical equipment item. The electrical unit1can for example be a circuit breaker, a disconnector or a switch. The vacuum interrupter2comprises a jacket forming a vacuum-tight enclosure. That is understood to mean that the pressure prevailing inside the enclosure is less than 10−4millibar. The fixed electrode3comprises a rod23and a contact body extending transversely to the rod. The mobile electrode4comprises a rod24and a contact body extending transversely to the rod. The fixed electrode3and the mobile electrode4are coaxial. The mobile electrode4is mobile in translation along the axis of the rod24. The main circuit30comprises a fixed contact35. The switch20is rotationally mobile between a position P1corresponding to a nominal position of circulation of the electric current in the main circuit30, illustrated in A inFIG.1, and a position P2prohibiting the passage of electrical current in the main electrical circuit30, illustrated in F. In the example represented, the switch20is then connected to an earthing contact40. This earthing contact is optional. FIG.1schematically describes the successively steps in an operation of an opening of the main circuit30. The steps A to F are in chronological order. In B, the main switch20has initiated its rotation. An electrical contact between the switch20and the fixed contact35is still established. An electrical contact between the main switch20and the vacuum interrupter2is also made. An electrical current circulates simultaneously in the main circuit30and in the parallel branch including the vacuum interrupter2. In C, the main switch20has continued its rotation and is no longer in contact with the fixed contact35. All the current passes through the vacuum interrupter2. The contact of the vacuum interrupter2is closed, that is to say that the fixed electrode3and the mobile electrode4are in contact, which corresponds to a position P1′ of the mobile electrode3. In D, the main switch20has triggered the opening of the contact, that is to say that the mobile electrode4has begun to move apart from the fixed electrode3. The current passes in the vacuum interrupter2in the form of an electrical arc. In E, the separation between the mobile electrode4and the fixed electrode3is maximal, corresponding to a position P2′ of the mobile electrode. Shortly after the phase current passes through zero, the current in the vacuum interrupter2is cut. The current in the main circuit30is thus cut. In F, the main switch20has completed its rotational movement and is in contact with the earthing contact40. The present disclosure relates to a switching device50of an electrical unit1, comprising:a main switch20configured to be displaced between a closed position P1allowing a passage of electrical current in a main electrical circuit30of the electrical unit1and an open position P2prohibiting the passage of electrical current in the main electrical circuit30,a vacuum interrupter2comprising:a fixed electrode3,a mobile electrode4, configured to be displaced between:a first position P1′, in which the fixed electrode3and the mobile electrode4are in contact, anda second position P2′, in which the fixed electrode3and the mobile electrode4are apart from one another,a palette5mechanically linked to the mobile electrode4, configured to make the mobile electrode4switch over from the first position P1′ to the second position P2′, the palette5comprising an electrically conductive plate6, the main switch20being configured to drive the palette5via the plate6in the switchover from the closed position P1to the open position P2,a connection wire7electrically linking the plate6and the mobile electrode4, the connection wire7being in electrical contact with a connection tube8disposed in an accommodating recess9of the plate6, wherein the accommodating recess9comprises a wall10exerting an elastic holding force on the connection tube8. When the mobile electrode4is in the first position P1′, the fixed electrode3and the mobile electrode4are in contact with one another so as to allow a passage of electrical current in the vacuum interrupter2. The first position P1′ of the mobile electrode4is called closed position of the vacuum interrupter2. When the mobile electrode4is in the second position P2′, the fixed electrode3and the mobile electrode4are apart from one another so as to prevent a passage of electrical current in the vacuum interrupter2. The second position P2′ of the mobile electrode4is called open position of the vacuum interrupter2. The second position P2′ corresponds to the maximum open position of the vacuum interrupter2. The palette5is driven by the switch20in the displacement travel opening the main circuit30. The palette5is covered by an electrically conductive plate6. The switch20enters into contact with the palette5via the plate6. The switch20comprises two parallel rods23,24, the fixed contact35being inserted between these two rods. The two rods23,24can be seen inFIG.7. The symbols25and25′ denote the contact zones between the switch20and the plate6. The kinematic link between the palette5and the mobile electrode4has not been detailed here. The plate6is electrically linked to the mobile electrode4, in order for the electrical current to be able to pass through the vacuum interrupter2as illustrated by the steps B, C and D ofFIG.1. Thus, during these steps, there is an electrical continuity between the switch20and the mobile electrode4. According to one aspect of the present disclosure, the electrical link between the plate6and the connection wire7involves an intermediate part which is the connection tube8. The plate6comprises an accommodating recess9. The connection tube8is disposed in the accommodating recess9of the plate. The wall10of the accommodating recess9and the connection tube8are shaped such that the wall10exerts an elastic force on the connection tube8. The wall10of the accommodating recess9is elastically deformable. Thus, a robust contact is ensured between the connection tube8and the plate6. The long-term reliability of the switching device is enhanced. In the example described here, a portion11of the connection wire7is disposed inside the connection tube8. An electrical contact between the connection wire7and the connection tube8can be ensured in various ways. In the example represented, the wire7is secured to the connection tube8by crimping. The connection tube8is crimped onto the connection wire7so as to ensure an electrical contact between the connection tube8and the connection wire7. The crimped portion of the connection wire7is stripped. Preferably, all of the portion11of the connection wire7contained inside the connection tube8is stripped. The connection wire7comprises a portion12disposed outside of the connection tube8, and the portion12comprises an insulating sheath. The connection wire7is a stranded wire. The wall10comprises an elastically deformed zone13exerting an elastic holding force on the connection tube. The connection tube8is cylindrical. The connection tube8is, in the example represented, of circular section. According to an embodiment that is not represented, the connection tube8can be of square section. The connection tube8is, here, made of annealed copper. The tube can also be made of aluminium. These materials ensure a good electrical conductivity and a good suitability for crimping. FIG.2details a plate6isolated from the palette5. The plate6is made of metal. The plate6is formed from a metal leaf. The plate6can be made of steel, for example stainless steel. The thickness of the plate6is between 0.2 and 1 millimetre. The nature of the material and the dimensions of the plate are chosen so as to exhibit a good resistance to the repetition of the impacts of the switch20against the plate6as the palette5is driven by the switch. The accommodating recess9extends on a main axis D. The accommodating recess9is cylindrical. The main axis D of the accommodating recess9is at right angles to the movement of the switch20. In particular, the main axis D of the accommodating recess9is at right angles to the axis of rotation about which the switch20can pivot. FIG.8details the profile of the accommodating recess9. The accommodating recess9comprises a substantially U-shaped section. The accommodating recess9has a nominal diameter d_nom of between 2 and 8 millimetres. As detailed in part A ofFIG.8, the nominal diameter d_nom of the accommodating recess9is the diameter of the largest circle that can be inscribed in a cross-section S of the accommodating recess9when the plate6is in the free state, that is to say when the connection tube8is not present in the accommodating recess9. In other words, the free state of the plate6corresponds to the geometry of the plate6before the connection tube8is inserted into the accommodating recess9. In this configuration, the wall10of the accommodating recess9does not exert any force since there is no element constraining the wall10of the accommodating recess9. The expression “inscribed circle” is understood to mean the largest virtual circle that can be represented in a cross-section S of the accommodating recess9without interfering with the walls delimiting the accommodating recess9. The inscribed circle is schematically represented by the symbol C. As detailed inFIG.4and inFIG.5, the connection tube8comprises a first portion21, called thin portion, of outer diameter d21less than a nominal diameter d_nom of the accommodating recess9, and a second portion22, called thick portion, of outer diameter d22greater than the nominal diameter d_nom of the accommodating recess9. As schematically represented inFIG.8, the nominal diameter d_nom of the accommodating recess9is the diameter of the largest circle inscribed in a cross-section S of the accommodating recess9, and measured before the insertion of the connection tube8into the accommodating recess9. According to a first embodiment, illustrated inFIG.4and inFIG.5, the connection tube8is force-fitted into the accommodating recess9such that the wall10exerts an elastic holding force on the connection tube8. The outer diameter of the first portion21of the connection tube8is less than the nominal diameter d_nom of the accommodating recess9when the plate6is in the free state. Thus, there is a radial play between the first portion21of the connection tube8and the accommodating recess9, such that the insertion of the connection tube8into the accommodating recess9is easy. The insertion of the connection tube8into the accommodating recess9is performed by translating the tube8in the direction of its main axis, which is also the direction of the main axis of the recess. As the connection tube8is introduced into the accommodating recess9, the radial play decreases to become zero. Once the contact is established between the tube8and the wall10, by continuing with the insertion of the connection tube8, the wall10of the accommodating recess9is pushed back by the tube8. Thus, once the tube is disposed in the accommodating recess9, the wall10of the recess9exerts an elastic holding force on the connection tube8. This elastic holding force guarantees a contact pressure between the plate6and the connection tube8which guarantees the quality of the electrical contact between these two parts. The elastic reserve guarantees a contact pressure that is substantially constant in time, which guarantees the long-term reliability. The elastic holding force is schematically represented by the symbol F22inFIG.5. The nominal diameter d_nom of the accommodating recess9is the diameter of the section corresponding to a determined position along the axis of the recess9. In other words, the nominal diameter d_nom can change along the axis of the accommodating recess9. In the case where the accommodating recess9is of cylindrical form, the nominal diameter d_nom is constant along the main axis D of the accommodating recess9. The connection tube8comprises a first axial end15at which the connection wire7leads the connection tube8, and a second axial end16opposite the first axial end15, and the first portion21, called thin portion, comprises the second axial end16of the tube. This embodiment is detailed inFIG.4and inFIG.10. The first axial end15of the tube8corresponds to the end at which the wire7leaves the connection tube8in order to join the mobile electrode4. According to the embodiments illustrated, one end of the connection wire7is axially contained between the first axial end15of the connection tube8and the second axial end16of the connection tube8. In other words, one end of the connection wire7is contained inside the connection tube8. In variants that are not illustrated, the connection wire7can run through the connection tube8from one axial end15to the other axial end16. According to the first embodiment, illustrated inFIG.4, the connection tube8comprises a tapered end. According to a variant embodiment of the switching device, illustrated inFIG.10, the connection tube8comprises a frustoconical portion14comprising a large diameter d2and a small diameter d1, the small diameter d1being oriented towards the second axial end16of the connection tube8. In other words, the small diameter d1is closer to the second axial end16of the tube8than the first axial end15. The large diameter d2of the frustoconical portion14of the connection tube8is oriented towards the first axial end15of the connection tube8. In other words, the large diameter d2is closer to the first axial end15of the tube8than the second axial end16. According to a variant that is not represented, the frustoconical portion14can comprise the second axial end16of the connection tube8. In this case, the connection tube8is terminated by the narrowest end of the truncated cone. The tube8thus has an end of nosecone form. According to a particular exemplary implementation, the tapered end of the connection tube8is formed by a removable sleeve. In other words, the tube8, for the mounting thereof, receives a sleeve which forms a thinner portion at the tapered end. The thinner portion is inserted into the tube8, more specifically into the second axial end of the tube. This added thinner portion makes it possible to easily perform the insertion of the tube8into the accommodating recess9. When the tube is fully inserted into the recess9, the added thinner portion emerges axially from the recess, and the removable sleeve can be removed from the tube8. For that, the outer diameter of the removable sleeve is chosen so as to allow a grip in the tube that is sufficient to ensure that the sleeve is held in position while the tube is being mounted in the recess, and that is weak enough to allow the removable sleeve to be extracted at the end of mounting. The removable sleeve can be reused after removal. The added thinner portion allows a cylindrical tube, which is the form that is simplest to manufacture, to be easily inserted into the accommodating recess9. FIG.6andFIG.7illustrate a second embodiment of the switching device50. As can be seen inFIG.7, the connection tube8comprises a first portion21, called thin portion, and two second portions22,22′, called thick portions, the second portions22,22′ being adjacent to the first portion21and disposed axially on either side of the first portion21, and the wall10exerts an elastic holding force on the second portions22,22′. In this embodiment, the first portion21, called thin portion, is formed by crushing of the connection tube8. More specifically, the first portion21, called thin portion, is formed by crushing of the connection tube8on the connection wire7. In other words, the first portion21is formed by a crushed portion of the connection tube8. For that, and as schematically represented inFIG.11and inFIG.12, a tool31, of punch type, bears on the wall of the tube8in applying a radial force, that is to say a force at right angles to the axis D of the tube8. Thus, a single operation of crushing of the connection tube8makes it possible to ensure the electrical link between the connection wire7and the connection tube8, as well as the electrical link between the connection tube8and the plate6. Furthermore, a mechanical holding of the wire7in the tube8is ensured. The second portions22,22′, called thick portions, are formed jointly with the first portion21, called thin portion, by crushing of the connection tube8on the connection wire7.FIG.12schematically illustrates the result obtained after the operation of crushing of the connection tube8. One and the same operation of crushing of the connection tube8makes it possible to jointly form the first portion21, called thin portion, and the second portions22,22′, called thick portions. In fact, the deformation of the wall of the tube8in a radial direction is accompanied by a pushing back of material in an axial direction. The material pushed back during the operation of crushing of the tube8locally increases the diameter of the connection tube8in the zones adjacent to the thin portion21. The material is pushed back on each side of the thin zone, in two opposite directions. Two thick portions are therefore obtained. The thin portion21and the thick portions22,22′ are obtained in a single operation of crushing of the connection tube8. The punching tool31has flanks32that are inclined so as to facilitate the pushing back of the material for creating the thick portions22,22′ of the tube8. The end of the tool is, for example, of trapezoidal form, as illustrated inFIG.11. The crushing of the connection tube8corresponds to a stamping of the connection tube8. The diameter of the connection tube8, before deformation, is greater than the diameter of the connection wire7so as to allow an easy introduction of the connection wire7into the connection tube8. The deformation of the wall of the connection tube8makes it possible to progressively cancel the play between the wall of the tube8and the wire7. By continuing the deformation until the tube is crushed, a compression of the wire7inside the deformed wall of the tube10is obtained. An elastic link between the wire7and the tube8is thus obtained, as is a mechanical holding of the connection wire7. The second portions22,22′, called thick portions, have an outer diameter greater than the nominal diameter d_nom of the accommodating recess9when the plate6is in the free state. Since the thick portions22,22′ have a diameter greater than the nominal diameter d_nom of the accommodating recess9, an elastic holding force is created by the wall10of the accommodating recess9. In other words, the second portions22,22′, called thick portions, of the connection tube8tend to deform the wall10of the accommodating recess9. According to the embodiment ofFIG.7, the connection tube8comprises two first portions21,21′, called thin portions, that are offset along the axis of the connection tube, the two first portions21,21′ being separated by a second portion22, called thick portion. The two first portions21,21′ are separated by a distance of between 10 millimetres and 20 millimetres. This distance is measured along the axis D. The first portion21, called thin portion, extends axially over a distance of between 50% of the nominal diameter d_nom of the tube and 150% of the nominal diameter d_nom of the tube. The wall10of the accommodating recess9comprises an aperture17disposed opposite the connection tube8. The aperture17is opposite the first portion21, called thin portion, of the connection tube8. The aperture17allows the passage of the tool31used to locally deform the connection tube8. In other words, the aperture17makes it possible to deform the connection tube8without deforming the wall10of the accommodating recess9. The force applied by the tool31is thus fully transmitted to the tube8, which limits the total force to be applied to the tool31. As illustrated inFIG.9, the connection tube8comprises a plastically deformed zone18, the plastically deformed zone18being in contact with the connection wire7. This feature is common to all the embodiments. In other words, the electrical contact between the connection wire7and the connection tube8is ensured by crimping, which gives a contact that is reliable over time. The plastically deformed zone18of the connection tube8is in contact with an electrically conductive portion of the wire7. In other words, a stripped portion of the wire7is introduced into the connection tube8and the connection tube8is deformed so as to secure the wire7and the tube8by crimping. The plastically deformed zone18in contact with the connection wire7is offset axially with respect to the elastically deformed zone13of the wall10. In other words, the plastically deformed zone18of the connection tube is offset along the axis of the tube with respect to the elastically deformed zone13of the wall10of the accommodating recess9. In the example ofFIG.9, the wall10of the accommodating recess9comprises a plastically deformed zone19, the plastically deformed zone19being in contact with a plastically deformed zone18of the connection tube8. In other words, in this example, the wall10of the recess9and the connection tube8are simultaneously deformed. The deformation of the wall10of the recess9against the tube8makes it possible to ensure that the tube8is mechanically held. FIG.6schematically represents the main steps of a method of manufacturing a switching device50according to the second embodiment. The method comprises the steps of:(a1) supplying a palette5comprising an electrically conductive plate6, the plate6comprising an accommodating recess9, the accommodating recess9comprising an elastically deformable wall10,(b1) supplying a connection wire7,(c1) supplying a connection tube8,(d1) placing the connection tube8in the accommodating recess9of the plate6of the pallet palette5,(e1) placing the wire7in the connection tube8,(f1) locally deforming the connection tube8so as to create a thin portion21and at least one thick portion22, such that the wall10of the accommodating recess of the plate exerts an elastic holding force on the thick portion of the connection tube. InFIG.6, the step a1is schematically represented by the part A, the steps c1and d1are schematically represented by the parts B and C, the steps b1and e1are schematically represented by the part D, and the step f1is schematically represented by the part E. In the part E of the figure, the thick arrow F schematically represents the application of the local deformation force on the connection tube8. In this embodiment, the tube8is introduced with a radial play into the accommodating recess9, and the crushing of the tube8creates the thin portion21and the adjacent thick portions22. After deformation of the tube, the wall10exerts an elastic holding force on the tube8. The disclosure relates also to a method for manufacturing a switching device50according to the first embodiment. The method comprises the steps of:(a2) supplying a palette5comprising an electrically conductive plate6, the plate6comprising an accommodating recess9, the accommodating recess9comprising an elastically deformable wall10,(b2) supplying a connection wire7,(c2) supplying a connection tube8, the connection tube8comprising a first portion21of outer diameter less than the nominal diameter d_nom of the accommodating recess9of the plate6previously supplied, and a second portion22of outer diameter greater than the nominal diameter d_nom of the accommodating recess9of the plate6previously supplied,(d2) force-fitting the connection tube8into the accommodating recess9of the plate6of the palette5such that the wall10of the accommodating recess9of the plate6exerts an elastic holding force on the second portion22of the connection tube8,(e2) placing the wire7in the connection tube8,(f2) locally deforming the connection tube8so as to obtain a retention force retaining the connection wire7in the connection tube8. Preferably, the step f2of local deformation of the connection tube8jointly produces a local deformation of the wall10of the accommodating recess9of the plate6so as to obtain a retention force retaining the connection tube8in the accommodating recess9. The substep d2of force-fitting of the connection tube in the accommodating recess9can also be performed after the substep f2of deformation of the connection tube. In this case, the step e2of placing of the wire7in the tube8is performed directly after the substep c2of supplying of the connection wire8. | 25,605 |
11862419 | Similar numerals refer to similar parts throughout the Specification. DESCRIPTION An improved vacuum interrupter (VI)4in accordance with a first embodiment of the disclosed and claimed concept is depicted generally inFIGS.1and2. The exemplary vacuum interrupter4includes an envelope8that can be said to include a cylinder12and to further include a pair of end caps that are indicated at the numerals16A and16B. The envelope8has an interior region18having a reduced pressure or a vacuum formed therein. The cylinder12is formed of an insulative material, such as a ceramic or other appropriate material, and thus is itself insulative. While the cylinder12is depicted herein as being of a hollow cylindrical shape and as having both a radial direction and a longitudinal direction with respect thereto, it is understood that in other embodiments the cylinder12can be of a rectangular or other cross-sectional shape and as still having a radial direction and a longitudinal direction without departing from the spirit of the disclosed concept. The vacuum interrupter4further includes a movable contact20and a stationary contact24. The movable contact20is movably situated on the envelope8and extends outwardly through an opening formed in the end cap16A while retaining the reduced pressure within the interior region18. The stationary contact24is stationary with respect to the envelope8and extends outwardly through an opening formed in the end cap16B. The movable contact20is movable with respect to the envelope8to cause the vacuum interrupter4to be movable between an OPEN state, such as is depicted generally inFIG.1, wherein the movable and stationary contacts20and24are electrically disconnected from one another, and a CLOSED state, such as depicted generally inFIG.2, wherein the movable and stationary contacts20and24are electrically connected with one another. In an understood fashion, the movable and stationary contacts20and24are electrically connectable with a protected portion of a circuit. The end caps16A and16B can each be generally characterized as including a planar portion28and a cylindrical portion32, wherein the cylindrical portion32protrudes from a perimeter of the planar portion28. The cylindrical portion32abuts an end of the cylinder12at a junction36. The cylindrical portions32of the end caps16A and16B each form one of the junctions36, which are disposed at opposite ends of the cylinder12. The vacuum interrupter4further includes a coating40that is formed of an insulative material and that is formed on an exterior of the envelope8. The coating40can be said to include a first portion44that is formed generally on an exterior surface of the cylinder12and a pair of second portions that are indicated at the numerals48A and48B that are formed generally on the end caps16A and16B and on the end regions of the cylinder12where the junctions36are situated. As can be understood fromFIG.1, for example, the first portion44is of a first thickness52as measured in a radial direction56with respect to the cylinder12. The first thickness52is of a substantially unvarying dimension in a region of the coating40that extends generally between the second portions48A and48B. In other embodiments, the first portion44or the second portions48A and48B may have an encapsulated shape that additionally includes ribs or watersheds along this length. The benefits of toroidal encapsulation can also be applied here, as long as the substantially largest diameter of the insulation is applied at the triple junctions at both ends as described herein. In contrast to the first portion44, the second portions48A and48B are each of a toroidal profile, meaning that they each have an arcuate outer surface64and a second thickness60A and60B as measured in the radial direction56that varies along a longitudinal direction70with respect to the cylinder12. The aforementioned ribs or watersheds that may exist along the first portion44would be smaller than the toroidal shapes at the second ends48A and48B. Moreover, it can be seen fromFIGS.1and2that the second portions48A and48B each have an apex68, which can be referred to as a region of relatively greatest thickness, at a location along the longitudinal direction70that is adjacent in the radial direction56the corresponding junction36. In the depicted exemplary embodiment, each apex68is situated at a location along the longitudinal direction70to be substantially aligned in the radial direction56with the junction36of the corresponding end of the envelope8. The longitudinal direction can also be seen as being parallel and/or coaxial with an axis that includes the axially-aligned movable and stationary contacts20and24. In the depicted exemplary embodiment, the coating40is formed of a single molding of a silicone insulation material having a high relative permittivity that is in a range of about 2.7 to 5 and, more particularly, may have a relative permittivity that is about 3.5. Such high relative permittivity advantageously deflects electric fields away from the junctions36, which are the triple junctions of the vacuum interrupter4. For instance,FIG.3depicts at the letter X a previous vacuum interrupter that is formed without the first and second portions48A and48B and that includes an end cap B having a triple junction C.FIG.3also depicts a set of equipotential field lines at the numeral A, with one of the equipotential field lines A also being designated with AA that can be seen inFIG.3to be extending at least partially across the end cap B in a direction generally toward where the stationary contact would be. This is undesirable and is alleviated by the disclosed and claimed concept. More specifically,FIG.4depicts at the numeral72a set of equipotential field lines extending from a portion of the vacuum interrupter4. As can be seen inFIG.4, the first portion48A advantageously deflects the electric fields, as represented by the equipotential field lines72, so that they do not flash over the end cap16A and thus advantageously resist damage to the triple junction that can be said to exist at the junction36. The same advantages are provided by the second portion48B and with respect to the end cap16B. This advantageously enables the vacuum interrupter4to be used in relatively higher voltage applications than the vacuum interrupter X ofFIG.3. An improved vacuum interrupter104in accordance with a second embodiment of the disclosed and claimed concept is depicted generally in inFIG.5. The vacuum interrupter104is similar to the vacuum interrupter4in that the vacuum interrupter104includes an envelope108having an insulative cylinder112and a pair of end caps116A and116B that meet the cylinder112at a pair of junctions136, and having a reduced pressure therein. The envelope108likewise includes a coating140having a first portion144and a pair of second portions148A and148B that are likewise of a toroidal shape. However, the second portions148A and148B each additionally have a metallic component indicated at the numerals150A and150B in addition to the silicone insulative material that forms the second portions148A and148B. As with the coating40of the vacuum interrupter4, the first portion144is of a first thickness152in a radial direction156with respect to the cylinder112that is of a substantially unvarying dimension between the first and second portions148A and148B. As noted elsewhere herein, however, the first portion144again can include ribs or watersheds along this length that are smaller than the end toroids. The second portions148A and148B each have a second thickness168and160B, respectively, as measured in the radial direction156that varies along a longitudinal direction170with respect to the cylinder112. As before, the first and second portions148A and148B are each situated along the longitudinal direction170to each have an apex168that is adjacent in the radial direction156the corresponding junction136and which, in the depicted exemplary embodiment, is substantially aligned with the junction136in the radial direction156. The second portions148A and148B each have an outer surface164that is of an arcuate shape and which, in the depicted exemplary embodiment, is of a toroidal profile. The metallic components150A and150B of the exemplary vacuum interrupter104each include a metallic body176that is depicted inFIGS.5and6and that is embedded in the silicone material of each of the second portions148A and148B. Each metallic body176is generally ring-shaped and extends about the cylindrical portion of each end cap116A and116B, and at least a portion of the metallic body176is disposed generally between the junction136and the apex168of the corresponding second portion148A and148B. In the depicted exemplary embodiment, the metallic components150A and150B each further include a metallic covering180that is in the form of a metallic coating that is situated on the outer surface164of the silicone material of each of the second portions148A and148B. It is understood that in other embodiments the metallic components150A and150B might include either the metallic body176or the metallic covering180, or both, without departing from the spirit of the instant disclosure. The metallic body176and the metallic covering180each advantageously assist in further dispersing the electric fields away from the end caps116A and116B and away from the junctions136, which further assists in protecting the vacuum interrupter104from flashover and from a breakdown of the vacuum interrupter104. This is advantageous because it enables the vacuum interrupter104to be used in various high-voltage applications without a risk of breakdown. It is further advantageous, but not required, that the metallic covering be nonmagnetic to prevent eddy current heating during conduction through the VI in its closed state. Other benefits will be apparent. While specific embodiments of the disclosed concept have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of the disclosed concept which is to be given the full breadth of the claims appended and any and all equivalents thereof. | 10,375 |
11862420 | DETAILED DESCRIPTION OF THE INVENTION Mutually corresponding parts are provided with the same reference symbols in the figures. FIG.1shows sectional illustration of an interrupter unit1for a circuit breaker having a first exemplary embodiment of a gas-guiding structure3, wherein the interrupter unit1is illustrated only in a region that is relevant to the invention.FIG.2shows a detail of a perspective illustration of the gas-guiding structure3shown inFIG.1. The interrupter unit1has a gas-insulated housing5, which is fillable with a quenching gas. Amongst other things, contact elements, not illustrated inFIG.1, are arranged in the housing5, which contact elements are movable relative to one another between a switch-off position, in which the contact elements are separated from one another, and a switch-on position, in which the contact elements bear against one another, for opening and closing an electrical circuit. In particular, the interrupter unit1has electric arc contact elements between which an electric arc burns in an electric arc region of the interrupter unit1in the event of separation. The gas-guiding structure1has a guide tube7and a strip-like diverting element9. The guide tube7is arranged between the electric arc region and an end region11of the housing5at a distance from an inner surface10of the housing5. The guide tube7runs in a tubular manner about a longitudinal axis13of the interrupter unit1in order to guide hot gas, which is created in the electric arc region by heating quenching gas by an electric arc. The diverting element9projects from a tube outer surface15of the guide tube7and runs around the longitudinal axis13in a helically wound manner. A diverting surface17of the diverting element9, which diverting surface adjoins the tube outer surface15and faces the electric arc region, projects from the tube outer surface15at a projection angle19that is different from 90 degrees. In the exemplary embodiment shown inFIG.1, the projection angle19is less than 90 degrees. However, as an alternative, the projection angle19can also be greater than 90 degrees. The guide tube7has lateral tube openings21in the region of the strip-like diverting element9. The opening sizes of these tube openings21increase as the distance of the tube openings21from the electric arc region increases. The inner surface10of the housing5has, in the end region11of the housing5, a curved portion23which faces an open guide tube end25of the guide tube7. Hot gas flows from the electric arc region substantially axially, that is to say along the longitudinal axis13, through the guide tube7. A portion of the hot gas flowing through the guide tube7exits from the lateral tube openings21out of the guide tube7to the diverting element9. The other portion of the hot gas exits out of the guide tube end25of the guide tube7and is guided by the inner surface10of the housing5in the direction of the diverting element9. Hot gas exiting from the guide tube7is set by the diverting element9in a circular flow which runs in a helical manner around the longitudinal axis13outside the guide tube7and is mixed with relatively cold quenching gas located there, as a result of which the hot gas is cooled down by so-called turbulent cooling. Directions of flow of the flow of the hot gas are indicated by arrows inFIG.1. FIG.3shows a sectional illustration of an interrupter unit1for a circuit breaker having a second exemplary embodiment of a gas-guiding structure3, wherein the interrupter unit1is once again illustrated only in a region that is relevant to the invention. The gas-guiding structure1has a guide tube7and a turbine-like diverting element27. As in the exemplary embodiment shown inFIG.1, the guide tube7is arranged between the electric arc region and an end region11of the housing5at a distance from an inner surface10of the housing5of the interrupter unit1and runs in a tubular manner about the longitudinal axis13of the interrupter unit1. FIG.4shows a perspective illustration of the diverting element27. The diverting element27runs in an annular manner around the open guide tube end25of the guide tube7, which guide tube end is averted from the electric arc region, and has diverting blades29, which project outward from the guide tube7. The diverting blades29have blade surfaces31,33which are tilted with respect to a plane that is orthogonal to the longitudinal axis13. The diverting element27can be arranged in a stationary manner in relation to the guide tube7or can be designed in a manner rotatable about the longitudinal axis13. The inner surface10of the housing5has, in the end region11of the housing5, a curved portion23which faces the open guide tube end25of the guide tube7. Hot gas flows from the electric arc region substantially axially through the guide tube7, exits from the guide tube end25out of the guide tube7and is guided through the inner surface10of the housing5to the diverting element27. The hot gas is set by the diverting element27in a circular flow which runs in a helical manner around the longitudinal axis13outside the guide tube7and mixed with relatively cold quenching gas located there, as a result of which the hot gas is cooled down by turbulent cooling. Directions of flow of the flow of the hot gas are also indicated by arrows inFIG.3. FIG.5shows a sectional illustration of an interrupter unit1for a circuit breaker having a third exemplary embodiment of a gas-guiding structure3, wherein the interrupter unit1is once again illustrated only in a region that is relevant to the invention. The gas-guiding structure1has a guide tube7, a snail-like diverting element35and a funnel element37. As in the exemplary embodiment shown inFIG.1, the guide tube7is arranged between the electric arc region and an end region11of the housing5at a distance from an inner surface10of the housing5of the interrupter unit1and runs in a tubular manner about the longitudinal axis13of the interrupter unit1. FIG.6shows a perspective illustration of the diverting element35. The diverting element35is arranged in the end region11of the housing5and projects through the open guide tube end25, which is averted from the electric arc region, into the guide tube7. The diverting element35has a groove39which faces the electric arc region and is substantially in the form of a conical spiral which runs around the longitudinal axis13and the diameter of which decreases in the direction of the electric arc region. The funnel element37is arranged in front of the diverting element35on the electric arc region side in the guide tube7and has a funnel opening41, through which the longitudinal axis13runs. The funnel element37tapers conically in the direction of the electric arc region in a region that runs around the funnel opening41. The guide tube7has lateral tube openings21in the region of the diverting element35between the funnel element37and the end region11of the housing5. The opening sizes of these tube openings21increase as the distance of the tube openings21from the electric arc region increases. Hot gas flows from the electric arc region substantially axially through the guide tube7to the funnel element37and through the funnel opening41to the diverting element35. The groove39of the diverting element35sets the hot gas in a circular flow, which follows the groove39, around the longitudinal axis13. A portion of the hot gas exits from the lateral tube openings21out of the guide tube7. The other portion of the hot gas exits out of the guide tube end25of the guide tube7. Outside the guide tube7, hot gas flows in a circular manner around the longitudinal axis13and is mixed with relatively cold quenching gas located there, as a result of which the hot gas is cooled down by turbulent cooling. Directions of flow of the flow of the hot gas are once again indicated by arrows inFIGS.5and6. The exemplary embodiments shown inFIGS.1to6can also be combined with one another. For example, the guide tube7of the exemplary embodiment shown inFIGS.3and4or inFIGS.5and6can have a section on which a strip-like diverting element9shown inFIGS.1and2is arranged. Although the invention has been illustrated and described in more detail by preferred exemplary embodiments, the invention is not restricted by the disclosed examples, and other variations can be derived therefrom by a person skilled in the art without departing from the scope of protection of the invention. | 8,436 |
11862421 | In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing. DETAILED DESCRIPTION The trim circuit for an e-fuse unit according to an embodiment of the present application turns on the driving transistor with a mirroring device (can be realized by a current mirror but is not limited thereto) to melt the e-fuse unit. FIG.1is a circuit diagram of a trim circuit for an e-fuse unit according to an embodiment of the present application. As indicated inFIG.1, the trim circuit for an e-fuse unit100according to an embodiment of the present application includes a mirroring device110and a driving transistor T11. The mirroring device110can be realized by a current mirror but is not limited thereto. The trim circuit for an e-fuse unit100further selectively includes a protection circuit120and a current prohibition circuit130. The mirroring device110receives an enable signal EN. When the mirroring device110is triggered by the enable signal EN, the mirroring device110generates a driving voltage VDRV at logic high level to the driving transistor T11. In a possible example of the present application, the mirroring device110includes a first transistor T12-1and a second transistor T12-2coupled to each other. The first transistor T12-1conducts a current and generates the driving voltage VDRV. The second transistor T12-2mirrors the current of the first transistor T12-1. Each of the first transistor T12-1and the second transistor T12-2can be realized by an NMOS transistor but is not limited thereto. The first transistor T12-1has a first terminal for receiving the enable signal EN, a second terminal coupled to the protection circuit120, and a control terminal coupled to the control terminal of the second transistor T12-2. The first terminal can be realized by a drain terminal but is not limited thereto. The second terminal can be realized by a source terminal but is not limited thereto. The control terminal can be realized by a gate end but is not limited thereto. The second transistor T12-2has a first terminal for receiving the enable signal EN, a second terminal coupled to the protection circuit120, and a control terminal coupled to the control terminal of the first transistor T12-1and the first terminal of the second transistor T12-2. The first terminal can be realized by but is not limited thereto a drain terminal. The second terminal can be realized by a source terminal but is not limited thereto. The control terminal can be realized by a gate end but is not limited thereto. The driving transistor T11is coupled to the mirroring device110. When the mirroring device110generates a driving voltage VDRV at logic high level to the gate of the driving transistor T11, the driving transistor T11is turned on to generate an MOS current to the output node VINK. The output node VINK is further coupled to the e-fuse unit (not illustrated). In response to the MOS current transmitted from the output node VINK, the e-fuse unit is melted to a high impedance state. The driving transistor T11can be realized by an NMOS transistor but is not limited thereto. The driving transistor T11has a first terminal for receiving an input voltage PVIN, a second terminal coupled to the output node VINK, and a control terminal for receiving the driving voltage VDRV generated by the mirroring device110. The first terminal can be realized by a drain terminal but is not limited thereto. The second terminal can be realized by a source terminal but is not limited thereto. The control terminal can be realized by a gate end but is not limited thereto. The protection circuit120is coupled to the driving transistor T11and the mirroring device110. The protection circuit120adjusts the driving voltage VDRV provided to the driving transistor T11to protect the mirroring device110and provides a bias voltage to the mirroring device110. The protection circuit120includes a third transistor T13coupled to the mirroring device110, a first diode D1coupled to the mirroring device110, and a second diode D2coupled to the mirroring device110. The third transistor T13biases the mirroring device110. The first diode D1provides a reverse bias protection to the mirroring device110. The second diode D2provides a forward bias protection to the mirroring device110. The first diode D1can be realized by a Zener diode but is not limited thereto. The second diode D2can be realized by a PN junction diode but is not limited thereto. The third transistor T13further receives a control signal A. When the third transistor T13is controlled by the control signal A, the third transistor T13is turned on to provide a bias voltage to the mirroring device110. The third transistor T13can be realized by an NMOS transistor but is not limited thereto. The third transistor T13has a first terminal coupled to the second terminal of the second transistor T12-2, a second terminal coupled to the first resistor R1, and a control terminal for receiving the control signal A. The first terminal can be realized by a drain terminal but is not limited thereto. The second terminal can be realized by a source terminal but is not limited thereto. The control terminal can be realized by a gate end but is not limited thereto. The first diode D1is coupled between the driving voltage VDRV and the ground terminal. The second diode D2is also coupled between the driving voltage VDRV and the ground terminal. The first diode D1and the second diode D2are connected in parallel. Additionally, the protection circuit120further selectively includes a first resistor R1and a second resistor R2. The first resistor R1is coupled between the second terminal of the third transistor T13and the ground terminal. The second resistor R2is coupled between the second terminal of the first transistor T12-1and the ground terminal. The first resistor R1and the second resistor R2can be used to step down the voltage to avoid the mirroring device110being burning out by an overcurrent. The current prohibition circuit130is coupled to the output node VINK to prohibit the MOS current generated by the driving transistor T11flowing to the protection circuit120. When the current prohibition circuit130is controlled by the control signal A, the current prohibition circuit130is turned off to prohibit the MOS current generated by the driving transistor T11flowing to the protection circuit120. The current prohibition circuit130can be realized by a transistor T14but is not limited thereto. Exemplarily but not restrictively, the transistor T14is a PMOS transistor. The transistor T14includes a first terminal coupled to the power source VDD, a second terminal coupled to the output node VINK, and a control terminal for receiving the control signal A. The first terminal can be realized by a source terminal but is not limited thereto. The second terminal can be realized by a drain terminal but is not limited thereto. The control terminal can be realized by a gate end but is not limited thereto. FIG.2is a signal waveform diagram of a trim circuit for an e-fuse unit according to an embodiment of the present application. As indicated in FIG.2, when the enable signal EN is at logic high level, the mirroring device generates a driving voltage VDRV at logic high level to the driving transistor T11. In response to the driving voltage VDRV at logic high level, the driving transistor T11is turned on (the voltage of the output node VINK is equivalent to the input voltage PVIN) to generate an MOS current and provide a voltage at logic high level to the output node VINK. In response to the MOS current and the voltage at logic high level, the e-fuse unit is melted at the output node VINK. As disclosed above, by using a mirroring device, the circuit area of the trim circuit for an e-fuse unit an embodiment of the present application can be reduced in comparison to the prior art. As disclosed above, by using a mirroring device, the trim circuit for an e-fuse unit according to an embodiment of the present application can operate normally even when one of the transistors of the mirroring device breaks down, so that normal operations of the circuit can be assured. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments. It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims and their equivalents. | 8,802 |
11862422 | DETAILED DESCRIPTION A schematic illustration of an embodiment of the electrical fuse1is shown inFIG.1. The electrical fuse1includes an electro-pyrotechnical detonator2, a separating element3that can be moved by the electro-pyrotechnical detonator2, a busbar4with a separating section5, an inductive coupler6on the busbar4, and a control circuit8. Alternatively, the inductive coupler6can also be placed on the high voltage line20. The electrical fuse1includes a hollow or tunnel-like hole (not shown) for this, through which a section of the high voltage line20can be fed, which does not come in contact with the busbar4. The inductive coupler6is then located at this hollow or tunnel-like hole. The electrical fuse1is in a high voltage line20, for example, connected to the busbar4via connection contacts, between a high voltage source (not shown) and a high voltage component (not shown). The control circuit8includes a semiconductor switch9for switching the detonation current15, a capacitor10, a resistor11connected in parallel to the capacitor10, and a diode12. The diode12is connected to the inductive coupler6at the anode, and to the capacitor10and a control input13for the semiconductor switch9at the cathode. The semiconductor switch9is a MOSFET, by way of example. The control input13is then a gate contact for the MOSFET, and the detonation current15conducted over source and drain contacts in the MOSFET. The control circuit8also includes a voltage connection14, via which a detonation current15can be supplied externally, e.g., from a 12V battery in a motor vehicle. If the current in the busbar4increases to a higher value (a few thousand amperes), e.g., due to a short circuit at the high voltage line20connected thereto, an induction current is induced via the inductive coupler6, which charges the capacitor10via the diode12. The capacitor10can supply a control voltage or current to the control input13in the semiconductor switch9after this charging, such that the semiconductor switch9is switched on, and the detonation current15is applied to the detonator2. The detonator2is detonated by the detonation current15, and the separating element3severs the busbar4in the separating section5through the movement of the separating element3. The resistor11is configured such that the capacitor10is continuously charged in normal operation, i.e. when no increased current change can be distinguished, and only a normal operating current flows over the busbar4. This is necessary for a constant charging of the capacitor10by a current induced in normal operation at least one inductive coupler6, and preventing a faulty triggering of the detonator2as a result. The resistor11must be large enough, however, to prevent a rapid drop in the control voltage built up at the capacitor10caused by discharging the capacitor10via the resistor11in the case of a malfunction, such that the control voltage remains above a threshold voltage for the semiconductor switch9at the control input13in the semiconductor switch9for a long enough time, and the detonation current remains at the detonator2long enough to detonate it. The diode12in the control circuit8ensures that no oscillations are formed in the oscillating circuit formed by the at least one inductive coupler6and the capacitor10, and the semiconductor9is not switched back off after it is switched on. The electrical fuse can be a pyro-element, in which the at least one inductive coupler6and the control circuit8are integrated. This results in a compact, integral module, for example, which can be easily placed in a high voltage line20, without requiring contact to be established with numerous individual parts located therein. A schematic illustration of an embodiment of the inductive couple6that has an air coil16is shown inFIG.2. The air coil16has a (secondary) induction of 40 μH and a width17of 15 millimeters in an exemplary application case. With a diameter18of 30 millimeters, the air coil16spans an adequately long segment of the busbar4, or high voltage line20. Because the busbar4, or high voltage line20normally has an inductance of 10 nH/cm, the (primary) inductance in the busbar4or high voltage line20is 30 nH for the air coil16. This enables a sufficient charging of the capacitor (cf.FIG.1) and the interconnection of the semiconductor switch in the control circuit by means of the capacitor charged through induction in the case of current changes that typically occur in the busbar4or high voltage line20after a short circuit (i.e. changes in the current to ca. 250-450 A at 25° C.). The air coil16is connected to the diode in the control circuit and the ground via contacts22. A schematic illustration of a temporal curve13of a control voltage30and a detonation voltage15when an inductive coupler with an air coil is used for different (secondary) inductances in the air coil is shown inFIG.3under some aspects of the present disclosure. This is based on an operating temperature for a high voltage battery connected to the busbar of −25° C. In the exemplary overview, a (primary) inductance of 30 nH in the busbar4or high voltage line20(cf.FIG.2), and a coupling factor of k=0.26 is assumed. In this example, the capacitor10has a capacitance of 0.2 μF and the resistance is 1 MΩ. It can be seen inFIG.3that, as the control voltage30increases, a detonation current15corresponding to this control voltage30also increases. Assuming this is a typical electro-pyrotechnical detonator (e.g., the “Pyro Safety Switch” from AutoLiv), the detonator is triggered with a detonation current15that is >1.75 A, which must be applied for a period of >0.5 milliseconds. The curves show that a control voltage30of ca. 2.6V is sufficient for this. This is obtained, for example, by a (secondary) inductance in the air coil of 40 μH. In this case, the detonation current15increases to a value greater than the necessary 1.75 A. With these parameters, the electrical fuse can therefore also be triggered in the case of a malfunction at low temperatures (−25° C.) in the high voltage battery, when the current flowing through the busbar4or high voltage line20increases to 250-450 A. FIG.4shows a schematic illustration of an embodiment of the inductive coupler6with a ferrite ring core19. The ferrite ring core19has a diameter of 1.3 cm, and a length21of 1 cm. The ferrite ring core19and a coil encompassing it have a combined (secondary) inductance of 6 μH. Because the busbar4or high voltage line20normally has an inductance of 10 nH/cm, this results in a (primary) inductance for the busbar4or high voltage line20of 10 nH for the ferrite ring core19. With a higher coupling factor of 0.71 in comparison with the air coil, this results in a sufficient charging of the capacitor and a switching on of the semiconductor switch in the control circuit by means of the capacitor charged through induction, when the currents flowing through the high voltage line20increase to ca. 250-450 A, as typically occurs with a short circuit. The ferrite ring core19is connected via contacts22to the diode in the control circuit and the ground. A schematic illustration of a temporal curve31for a control voltage30and a detonation voltage1when suing an inductive coupler with a ferrite ring core19(cf.FIG.4) for an exemplary (secondary) inductance in the ferrite ring core of 6 μH is shown inFIG.5, to clarify the present disclosure. This is based on an operating temperature for a high voltage battery connected to the busbar of −25° C. In this exemplary overview, a (primary) inductance in the busbar4or high voltage line20(cf.FIG.4) of 10 nH and a coupling factor of k=0.71 is assumed. In this example, the capacitor10has a capacitance of 0.2 μF, and the resistance is 1 MΩ. By way of example, the IRFHS8242 25V Single N-Channel HEXFET Power MosFet semiconductor switch from Infineon AG can be used for the semiconductor switch. It can be seen inFIG.5that with these parameters, a control voltage30of ca. 2.8V can be supplied to the control input in the semiconductor switch by increasing the current through the busbar4to 350 A within less than 0.2 milliseconds. This results in an increase in the detonation current15to a value of >3.3 A. If a typical electro-pyrotechnical detonator is used (e.g., the “Pyro Safety Switch” from AutoLiv), the detonator is triggered with a detonation current15that is >1.75 A, which must be applied for a period of >0.5 milliseconds. The electrical fuse can also be triggered with the selected parameters for the ferrite ring core based on an increase in the current through the busbar4or high voltage line20(cf.FIG.4) to 350 A within less than 0.2 milliseconds in the case of a malfunction at low temperatures of −25° C. in the high voltage battery. The embodiments shown herein are to be understood merely as examples. For example with other requirements regarding an increasing (malfunction) current in the high voltage line20, at which the electro-pyrotechnical detonator should be triggered, for example the dimensions and inductances, as well as the capacitance of the capacitor and the resistor, if applicable, the parameters may be different, or need to be adapted to the specific application. A schematic illustration of an embodiment of a traction power network51in a motor vehicle is shown inFIG.6. The traction power network51includes a high voltage power source52, a connection unit53, and high voltage components54. The high voltage components54are an inverter55and an electric machine56. The connection unit53has two electromechanical breakers57,58, a current sensor59, and a control unit60. When the battery is in operation (e.g., while the vehicle is underway, or the battery is being charged), an overloading of the battery cells61in the high voltage battery52and the breakers57,58is prevented in that a maximum current is limited, wherein current boundary conditions are taken into account, e.g., the temperature of the battery cells61. The control unit60detects a current flowing between the battery cells62and the electrical consumers, for example the electric machine56and the inverter55in the motor vehicle, via the current sensor59for this. If the maximum current is exceeded, the breakers57,58are opened by the control unit60after a predefined plausibility check period. This prevents damage to the battery cells61. A fuse1according to the present disclosure also protects the battery cells61and the traction power network51from an overload. The inverter55and electric machine56are connected to the high voltage battery52via a high voltage line20for this, wherein the electrical fuse1protects the high voltage line20. The current circuit in the traction power network51can then be interrupted in the case of a malfunction, e.g., if there is a short circuit in the high voltage line20due to a defect or an accident, precisely at a defined threshold value for the current. A schematic illustration of another embodiment of the electrical fuse1is shown inFIG.7. The electrical fuse1is constructed in principle like the embodiment shown inFIG.1. The same reference symbols therefore indicate the same terms and features. The electrical fuse1in this embodiment also has an additional inductive coupler23on the busbar4. The control circuit8also has an additional capacitor24, an additional resistor25connected in parallel to the additional capacitor24, and an additional diode26. The additional inductive coupler23and the additional capacitor24are selected herein and connected to one another and the semiconductor switch9such that the additional capacitor24can be charged via a current obtained at the additional inductive coupler23via the additional diode26, and the detonation current15necessary for triggering the electro-pyrotechnical detonator2can be supplied via the additional charged capacitor24. For example, due to the additional capacitor24, there is no need for an external power source. With an exemplary detonation current15of >1.75 A, which must be applied to the electro-pyrotechnical detonator2for at least 0.5 milliseconds, an inductance of the additional inductive coupler23must be approx. 1,500 μH and a capacitance of the additional capacitor24must lie approx. in the range of 25 μF, in an embodiment that otherwise has the same properties as that shown inFIG.1, in order to supply the detonation current15necessary for triggering the electro-pyrotechnical detonator15if the currents flowing through the busbar4increase to ˜250-450 A in the case of a malfunction. LIST OF REFERENCE SYMBOLS 1electrical fuse2electro-pyrotechnical detonator3moving separating element4busbar5separating section6inductive coupler8control circuit9semiconductor switch10capacitor11resistor12diode13control input14voltage connection15detonation current16air coil17width18diameter19ferrite ring core20high voltage line21length22contact23additional inductive coupler24additional capacitor25additional resistor26additional diode30control voltage31temporal curve50motor vehicle51traction power network52high voltage power source53connection unit54high voltage components55inverter56electric machine57electromechanical breaker58electromechanical breaker59current sensor60control unit61battery cells | 13,222 |
11862423 | DETAILED DESCRIPTION OF THE INVENTION A relay including a contact functioning as a switch (switching part) is used in a power supply circuit. The relay control circuit opens and closes the contact by applying a voltage across the coil provided in the relay. A non-latch relay used in the power supply circuit needs to continuously apply a voltage across the coil in order to hold a contact state (for example, pickup) during operation. A relay control circuit10of the disclosure reduces the loss of a relay RL1by reducing the voltage to hold the pickup. FIG.1is a diagram illustrating a circuit configuration of a relay control circuit10according to an embodiment of the disclosure.FIG.2is a diagram showing an operation waveform of each portion of the relay control circuit10.FIG.3is a diagram illustrating a configuration of a power supply circuit100including the relay control circuit10. In the disclosure, for the sake of concise description, a “high-voltage power supply HV1” is also simply referred to as “HV1”, for example. Configuration of Relay RL1 As illustrated inFIG.1, the relay control circuit10is connected to the relay RL1. The relay RL1includes a contact FO1and a coil CO1for operating the contact FO1. The relay control circuit10controls opening and closing of the contact FO1provided in RL1by applying a voltage across the coil CO1provided in the relay RL1. RL1is a non-latch relay, and FO1is a normally open contact. Thus, it is necessary to continuously apply the voltage across CO1in order to continue closing (pickup) of FO1. CO1is specified to have a rated voltage of 12 V and a resistance of 320Ω. Definitions of Terms Prior to describing the relay control circuit10, each term is defined in the present specification as follows.Transistor: An element including three terminals of a high-voltage terminal, a low-voltage terminal, and a control terminal described below. The voltage or current control of the control terminal can control a state in which a current flows from the high-voltage terminal to the low-voltage terminal and a state in which the current does not flow. A metal-oxide semiconductor field effect transistor (MOSFET) and a bipolar transistor also fall under this transistor. In a case of an N-channel metal-oxide semiconductor (NMOS), a drain is the high-voltage terminal, a source is the low-voltage terminal, and a gate is the control terminal. In a case where a voltage between the gate and the source of the NMOS is equal to a threshold voltage or greater, a current flows from the high-voltage terminal to the low-voltage terminal. In a case of a P-channel metal-oxide semiconductor (PMOS), the source is the high-voltage terminal, the drain is the low-voltage terminal, and the gate is the control terminal. In a case where the voltage between the gate and the source of the PMOS is equal to the threshold voltage or less, the current flows from the high-voltage terminal to the low-voltage terminal. In a case of PNP bipolar transistors, an emitter is the high-voltage terminal, a collector is the low-voltage terminal, and a base is the control terminal. In a case where a current flows to the control terminal of the PNP bipolar transistor, a current flows from the high-voltage terminal to the low-voltage terminal.High-voltage terminal: Terminal used by applying a voltage higher than that of the low-voltage terminal.Low-voltage terminal: Terminal used by applying a voltage lower than that of the high-voltage terminal.Rectifying element: Element for causing a current to flow from an anode to a cathode represented by a diode. Here, synchronous rectifying elements represented by the NMOS and the PMOS are also included. In the case of the NMOS, the source and the drain can be defined as the anode and the cathode, respectively. In the case of PMOS, the drain and the source can be defined as the anode and the cathode, respectively. Elements Constituting Relay Control Circuit10 As illustrated inFIG.1, the relay control circuit10according to the present embodiment includes HV1, LV1, TR1, TR2, TR3, RC1, RS1, RS2, RS3, RS4, CA1, RF1, DI1, and SI1. In more detail, the relay control circuit10according to the present embodiment includes the following elements. HV1is a high-voltage power supply having a voltage of 12 V. LV1is a low-voltage power supply having a voltage of 4 V. In HV1and LV1, + side is a positive electrode, and − side is a negative electrode. TR1is a first transistor, and is the PMOS in the present embodiment. For TR1, a threshold voltage is −1.55 V, an input capacitance is 25 pF, and an on resistance is 6Ω. RC1is a rectifying element, and is the NMOS in the present embodiment. For RC1, the threshold voltage is 1.6 V, the input capacitance is 20 pF, and the on resistance is 1Ω. TR2is a second transistor, and is the NMOS in the present embodiment. TR3is a third transistor, and is the NMOS in the present embodiment. Each of TR2and TR3has the threshold voltage of 1.35 V, the input capacitance of 9 pF, and the on resistance of 2Ω. DI1is a diode having a forward voltage (VF) of 0.7 V. RS1is a first resistor, and a resistance value is 20 kΩ. RS2is a second resistor, and a resistance value is 510 kΩ. RS3is a third resistor, and a resistance value is 68 kΩ. RS4is a fourth resistor, and a resistance value is 10 kΩ. CA1is a capacitor having electrostatic capacitance of 1 nF. SI1is a signal generator, and outputs 0 V and 3.3 V from a signal output terminal of SI1. RF1is a reference voltage node (0 V). In the relay control circuit10, RS3and RS4are not essential to achieve the effect of the present embodiment. RS3and RS4are components that can be appropriately added to the relay control circuit10or can be appropriately deleted from the relay control circuit10according to characteristics of the first transistor TR1, the second transistor TR2, the third transistor TR3, and the rectifying element RC1included in the relay control circuit10. If not required, direct wiring connection can be employed without using these components. In the relay control circuit10, DI1is also not essential to achieve the effect of the present embodiment. Furthermore, a cathode of DI1may be connected to one end of CO1. Main Circuit Portion of Relay Control Circuit10 In order to picks up FO1of RL1, it is necessary to apply a voltage of 7 V or greater to CO1. In order to prevent dropout of FO1and perform holding of the pickup, it is necessary to apply a voltage of 3 V or greater to CO1. In the relay control circuit10, 12 V of HV1is used to perform the pickup, and 4 V of LV1is used to hold the pickup. TR1includes a high-voltage terminal connected to a positive electrode of HV1and a low-voltage terminal connected to one end of CO1. RC1includes an anode connected to a positive electrode of LV1and a cathode of RC1connected to one end of CO1. A negative electrode of HV1and a negative electrode of LV1are connected to RF1. The other end of CO1is further connected to RF1via TR3. In a case where TR3is not necessary, the other end of CO1can be connected to RF1to operate the circuit. The circuit operation by this connection causes TR1to be turned ON to apply the voltage of 12 V to CO1to perform the pickup of FO1. RC1prevents a short circuit between HV1and LV1due to TR1being turned on. Thereafter, by turning off TR1, an electromotive voltage of the CO1causes RC1to conduct. A voltage of 3.3 V obtained by subtracting 0.7 V of a forward voltage drop of RC1from 4 V of LV1is applied to CO1. Since the contact FO1can be held with 3.3 V in this relay RL1, low loss of the relay RL1can be performed while preventing the dropout of FO1. Application Voltage to High-Voltage Power Supply HV1and Low-Voltage Power Supply LV1 Relay RL1is often affected by temperature in the installation environment. Considering the temperature dependence and variation of CO1, a voltage of HV1is appropriately 1.2 times or more of a pickup voltage of the contact FO1at 25° C. A lower limit of the voltage of LV1is preferably 1.2 times or more of a dropout voltage of the contact FO1at 25° C. Considering an influence to the loss of CO1, a voltage upper limit of LV1is preferably four times or less of the dropout voltage of the contact FO1at 25° C. In addition, 0.9 times or less of the voltage of HV1is preferred. That is, the voltage of the low-voltage power supply LV1is preferably lower than the voltage of the high-voltage power supply HV1. ON/OFF Control Circuit of First Transistor TR1 In TR1not connected to the reference voltage node RF1, ON/OFF switching is difficult with a signal voltage of 3.3 V/0 V. In the present embodiment, an improvement to facilitate ON/OFF switching of TR1is incorporated into the relay control circuit10. A high-voltage terminal of TR2is connected to a control terminal of TR1. The low-voltage terminal of TR2is connected to RF1. The control terminal of TR1is connected to the positive electrode of the high-voltage power supply HV1via RS1. Thus, in a case where the control terminal of TR1is floating, TR1is turned off. Whether the RS3is applied can be selected according to the characteristics of each transistor. In these connections, in a case where TR2is turned on, TR1is also tuned on. in a case where TR2is turned off, TR1is also tuned off. The TR2is connected to the reference voltage node RF1, and thus TR2can be easily turned ON/OFF with 3.3 V/0 V, which are normal signal voltages. Even in a case where TR1is not the PMOS, TR1similarly functions as long as TR1is a transistor such as the PNP bipolar or the like similar to the PMOS. In a case of changing to TR1having different characteristics, it is necessary to adjust the resistance value of RS1and the resistance value of RS3. Synchronous Rectification ON/OFF Control Circuit of Rectifying Element RC1 The voltage drop 0.7 V from the anode to the cathode of RC1can be reduced to 0.01 V by performing synchronous rectification ON (ON of the NMOS). The reduction in the voltage drop allows the voltage of LV1to be lowered, thus enabling further low loss of relay RL1. In the present embodiment, an improvement to facilitate the synchronous rectification ON/OFF switching of the RC1not connected to the reference voltage node RF1is incorporated for performing the synchronous rectification. The control terminal of RC1is connected to the positive electrode of the high-voltage power supply HV1via RS1, RS3, and RS4. The control terminal of RC1is further connected to the high-voltage terminal of TR2via RS4. Whether RS3and RS4are applied to the relay control circuit10can be selected according to the characteristics of each element. In these connections, in a case where TR2is OFF, RC1is turned on with the voltage of the high-voltage power supply HV1. In a case where TR2is turned on, the voltage of the control terminal of RC1is 0 V, which is lower than the voltage of the anode (4 V), and RC1is turned off. The voltage of the control terminal is lower than the voltage of the anode, and thus false ON can be prevented. Thus, malfunction in which the high-voltage power supply HV1and the low-voltage power supply LV1are short circuited can be prevented. Dropout Control Circuit of Contact FO1 The dropout of FO1can be performed by lowering the voltage of LV1. In the present embodiment, a circuit facilitating the performing of the dropout is incorporated into the relay control circuit10. TR3is disposed between the other end of the CO1and RF1. A high-voltage terminal of TR3is connected to the other end of the CO1, and a low-voltage terminal of TR3is connected to RF1. By turning off this TR3, the voltage across CO1is suppressed, and FO1drops out. Circuit for Controlling Second Transistor TR2and Third Transistor TR3with the Same Signal) Each of TR2and TR3can be controlled by a different signal, but in this embodiment, a circuit capable of being controlled with the same signal is incorporated into the relay control circuit10. The control terminal of TR3is connected to the signal output terminal of SI1. The control terminal of TR2is connected to the signal output terminal of SI1via CA1, and is connected to RF1via RS2. The 3.3 V signal of SI1turns on TR3to enable voltage application to CO1, and turns on TR2to turn on TR1. In a case where TR1is turned on, the voltage of HV1can be applied to CO1, and thus the pickup of FO1can be performed. Since the control terminal of TR2is connected to RF1via RS2, TR2is turned off after a lapse of time. In a case where TR2is turned off, TR1is turned off and the synchronous rectification of RC1is turned on. Thus, a series of control from the pickup of FO1to the contact holding with low loss can be performed by the single signal of SI1. Operation Waveform of Relay Control Circuit The operation waveform of the relay control circuit10illustrated inFIG.1will be described below with reference to three graphs shown inFIG.2. Each line of these graphs describes the following items.SI1VO: Voltage of the output terminal of SI1TR2CV: Voltage of the control terminal of TR2TR2HV: Voltage of the high-voltage terminal of TR2TR1VGS: Control terminal voltage with respect to the high-voltage terminal of TR1RC1VGS: Control terminal voltage with respect to the low-voltage terminal of RC1CO1TV: Voltage of one end of CO1HV1IO: Output current of HV1LV1IO: Output current of LV1CO1I: Current of CO1 First Step: Output 3.3 V of the Signal Generator SI1Turns on TR3and TR1, and Turns Off RC1 By setting SI1VO to 3.3 V, the control terminal of TR3exceeds the threshold voltage. Thus, TR3is turned on, and a voltage can be applied to the coil CO1. At the same time as TR3is turned on, TR2CV exceeds the threshold voltage, and TR2HV is reduced to 0 V. TR2HV simultaneously affects TR1VGS and RC1VGS connected to TR2. TR1VGS is −3 V, and TR1is turned ON. RC1VGS is −4 V, and RC1is turned off (OFF of the synchronous rectification). As illustrated in CO1TV, the voltage of HV1is applied to CO1. As a result, CO1IO increases and FO1is picked up. Second Step: OFF of TR1and ON of RC1Due to TR2CV Reduction after a Lapse of Time TR2CV is below the threshold voltage after the lapse of time, and is turned off. Thus, TR1VGS is 0 V, and TR1is turned off. RC1VGS is 8 V, and RC1is turned on (ON of the synchronous rectification). As a result, CO1TV is switched to the voltage of LV1, and the pickup of the contact FO1is held with low loss. Third Step: Drops Out Contact FO1with Output 0 V of Signal Generator SI1 TR3is switched to OFF by setting SI1VO to 0 V. As a result, the other end of CO1is clamped to 4 V by the conduction of DI1. Thus, the voltage across CO1drops, and FO1drops out. Power Supply Circuit100Provided with Relay Control Circuit10 As illustrated inFIG.3, the power supply circuit100includes the relay RL1and the relay control circuit10. In other words, the relay control circuit10constitutes the power supply circuit100together with RL1. In the power supply circuit100, RL1is used as a power supply input changeover switch. By using the relay control circuit10, low loss of RL1can be performed. Thus, loss in the power supply circuit100can be reduced. FormA, which is a normally open is applied to FO1of RL1. The relay control circuit10is also applicable to FormB and FormC according to the application, without being limited to FormA. Note that each numerical value described above is merely an example. In order to adjust the circuit operation, addition of resistors to the wiring lines or addition of capacitors between the wiring lines can be performed as appropriate. While there have been described what are at present considered to be certain embodiments of the invention, it will be understood that various modifications may be made thereto, and it is intended that the appended claims cover all such modifications as fall within the true spirit and scope of the invention. | 15,836 |
11862424 | DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that, in all the drawings for illustrating the embodiments of the present invention, components having the same function are denoted by the same reference signs, and repeated description thereof will be omitted. Additionally, each drawing is schematic, and may be different from the real thing. In addition, the following embodiments exemplify devices and methods for embodying the technological idea of the present invention, and are not intended to limit the configuration to any one of those described below. In other words, the technological idea of the present invention can be modified in various ways within the technological scope described in the claims. Furthermore, in the following embodiments, among three directions orthogonal to each other in a space, a second direction and a third direction orthogonal to each other in the same plane are defined as X direction and Y direction, respectively, and a first direction orthogonal to each of the second direction and the third direction is defined as Z direction. Still furthermore, the following embodiments will describe cases where the present invention is applied to an electromagnetic contactor as an electric device. However, the present invention is not limited to electromagnetic contactors according to the following embodiments, and can also be applied to other electric devices. First Embodiment <<Configuration of Electromagnetic Contactor>> As illustrated inFIGS.1and2, an electromagnetic contactor1according to a first embodiment of the present invention includes a contact unit10, an electromagnet unit20configured to drive the contact unit10, and a main body frame30configured to house the contact unit10and the electromagnet unit20in a housing section30a. The contact unit10and the electromagnet unit20are housed to be arranged in series in the Z direction (first direction) in the housing section30aof the main body frame30. The electromagnetic contactor1opens and closes a three-phase AC circuit. <Contact Unit> As illustrated inFIG.2, the contact unit10includes a pair of fixed contact elements11and12, a bridge type movable contact element13arranged to be capable of contacting with and separating from the pair of fixed contact elements11and12, and a movable contact support14holding the movable contact element13. The pair of fixed contact elements11and12extend in the X direction (second direction), and have a fixed contact at one end side thereof and an external terminal portion at the other end side thereof. Then, the pair of fixed contact elements11and12are fixed to the main body frame30in a state where the respective one end sides thereof face each other and are separated from each other in the X direction. The movable contact element13extends in the X direction, and is provided with a movable contact on one end side thereof and the other end side thereof, respectively. The movable contact on the one end side of the movable contact element13and the fixed contact of the one fixed contact element11are arranged to face each other. The movable contact at the other end side of the movable contact element13and the fixed contact of the other fixed contact element12are arranged to face each other. The movable contact element13is held by the movable contact support14. The pair of fixed contact elements11and12and the movable contact element13form a contact section, and three contact sections are arranged side by side in the Y direction to correspond to the three-phase AC circuit. <Electromagnet Unit> As illustrated inFIG.2, the electromagnet unit20includes a fixed iron core21, a movable iron core22, an electromagnetic coil23, and a return spring26. The fixed iron core21and the movable iron core22are arranged so that respective pole contact surfaces thereof face each other. The electromagnetic coil23generates a magnetic field that attracts the fixed iron core21and the movable iron core22by electromagnetic force. The electromagnetic coil23includes a winding24and a bobbin25. The winding24passes between a central leg portion and an outer leg portion of each of the fixed iron core21and the movable iron core22, and circles around the central leg portion. The bobbin25has the winding24wound thereon. The bobbin25has a cylindrical portion in which the central leg portion of each of the fixed iron core21and the movable iron core22is inserted into an inner diameter side thereof, and the winding24is wound on an outer diameter side thereof. Additionally, the bobbin25is provided with flange portions protruding in a flange shape from both end portions of the cylindrical portion to the outer diameter side thereof. The electromagnetic coil23can be replaced according to the type of power supply used by the customer. The return spring26is an urging means for urging the movable iron core22in a direction away from the fixed iron core21. The return spring26is, for example, a coil spring provided between an upper surface of the bobbin25of the electromagnetic coil23and the movable iron core22. The pair of fixed contact elements11and12and the movable contact element13are electric contacts that switch circuit connection and disconnection by contacting with and separating from each other. As illustrated inFIG.2, the movable contact element13is fixed to one end side of the movable contact support14in the Z direction. Then, the other end side of the movable contact support14in the Z direction is fixed to a back surface portion on an opposite side to the leg portion side of the movable iron core22. The movable contact element13moves in the Z direction in conjunction with movement of the movable iron core22in the Z direction. In other words, the pair of fixed contact elements11and12and the movable contact element13separate from each other in a released state where the fixed iron core21and the movable iron core22are separated from each other, and contact with each other in an energized state where the fixed iron core21and the movable iron core22are in contact with each other. A contact spring is provided on a side of the movable contact element13opposite to the movable iron core22side, although it is not illustrated. <Main Body Frame> As illustrated inFIGS.1and2, the main body frame30includes a first frame31and a second frame41facing each other in the Z direction to form the housing section30aand a snap-fit mechanism50connecting the first frame31and the second frame41to each other. The first frame31is formed by a bottomed cylindrical body in which one end side of a square cylindrical outer peripheral side wall having four side walls31a,31b,31c, and31dis opened and the other end side of the outer peripheral side wall opposite to the one end side thereof is closed by a bottom wall31e. Similarly, the second frame41is also formed by a bottomed cylindrical body in which one end side of a square cylindrical outer peripheral side wall having four side walls41a,41b,41c, and41dis opened and the other end side of the outer peripheral side wall opposite to the one end side thereof is closed by a bottom wall. The side walls31aand41aand the side walls31band41bare located on opposite sides of each other in the X direction. The side walls31cand41cand the side walls31dand41dare located on opposite sides of each other in the Y direction. The first frame31is provided with a primary terminal portion electrically connected to the fixed contact element11, which is one of the pair of fixed contact elements11and12, and a secondary terminal portion electrically connected to the fixed contact element12, which is the other one of the pair of fixed contact elements11and12. A mounting plate portion43having amounting hole is provided at four corners on the bottom wall side of the second frame41. The first frame31and the second frame41are made of, for example, a nylon-based thermoplastic insulating resin excellent in heat resistance and insulation properties. Note that, in this first embodiment, a side housing the contact unit10is the first frame31including a flexible protruding plate portion51, and a side housing the electromagnet unit20is the second frame41including a fitting projection portion55, but on the contrary, the side housing the electromagnet unit20may be the first frame including the flexible protruding plate portion51, and the side housing the contact unit10may be the second frame41including the fitting projection portion55. <Snap-Fit Mechanism> As illustrated inFIGS.3,4A, and4B, the snap-fit mechanism50includes a hook portion53provided with a fitting hole portion (opening portion)52as a fitted portion on a tip side of the flexible protruding plate portion51protruding from the open end of the first frame31, which is the one of the first and second frames31and41, and the fitting projection portion55provided in the second frame41, which is the other one of the first and second frames31and41, and fitted with the fitting hole portion52of the flexible protruding plate portion51. The flexible protruding plate portion51extends along the Z direction, and has a base portion integrated with the first frame31, in which the tip side opposite to the base portion thereof protrudes from the open end side of the first frame31(seeFIG.5). Then, the tip of the flexible protruding plate portion51faces an outer surface of the outer peripheral side wall of the second frame41. The fitting hole portion52penetrates through a front surface and a back surface of the flexible protruding plate portion51facing each other on the tip side of the flexible protruding plate portion51. The fitting projection portion55of the second frame41is fitted into the fitting hole portion52and fits therewith. Note that while this first embodiment uses the fitting hole portion52as the fitted portion, a fitting recessed portion may be used as the fitted portion. The fitting hole portion52and the fitting projection portion55are fitted by bringing the first and second frames31and41into relative proximity in the Z direction (first direction), and the fitting is released by relatively displacing the first and second frames31and41in the X direction (second direction) orthogonal to the Z direction. The flexible protruding plate portion51includes a first inclined surface51athat contacts with the fitting projection portion55to bend the flexible protruding plate portion51outward at the time of the fitting where the fitting hole portion52and the fitting projection portion55are fitted by bringing the first frame31and the second frame41into relative proximity in the Z direction. In other words, the flexible protruding plate portion51includes the first inclined surface51ain the Z direction in which the fitting hole portion52and the fitting projection portion55are fitted. The first inclined surface51ais inclined with an inclination in a direction in which a thickness of the tip portion of the flexible protruding plate portion51gradually increases toward the base portion thereof. The fitting projection portion55includes a second inclined surface55athat comes into contact with an inner surface of the fitting hole portion52to bend the flexible protruding plate portion51outward when releasing the fitting between the fitting hole portion52and the fitting projection portion55by relatively displacing the first frame31and the second frame41in the X direction orthogonal to the Z direction. In other words, the fitting projection portion55includes the second inclined surface55ain the X direction in which the fitting between the fitting hole portion52and the fitting projection portion55is released. The second inclined surface55ais inclined with an inclination in a direction in which a thickness of the fitting projection portion55gradually increases from a position where the flexible protruding plate portion51contacts the surface. The second frame41, which is the other one of the first and second frames31and41that is provided with the fitting projection portion55, includes a third inclined surface56that contacts with the tip side of the flexible protruding plate portion51to bend the flexible protruding plate portion51outward when releasing the fitting between the fitting hole portion52and the fitting projection portion55by relatively displacing the first frame31and the second frame41in the X direction orthogonal to the Z direction. The third inclined surface56is provided on an outer surface side of the outer peripheral side wall of the second frame41. In other words, the snap-fit mechanism50includes the third inclined surface56provided in the second frame41. The third inclined surface56is inclined with an inclination in a direction in which the wall thickness gradually increases toward the side wall surface from a position where the flexible protruding plate portion51contacts the surface. As illustrated inFIG.3toFIG.6, there are provided a total of four snap-fit mechanisms50, each two of which are arranged side by side in the X direction on each of portions of the outer peripheral side wall of the main body frame30located on opposite sides of each other in the Y direction. Specifically, hook portions53each including the flexible protruding plate portion51, the first inclined surface51a, and the fitting hole portion52are spaced apart from each other in the X direction on an outer surface of each of the two side walls31cand31dof the first frame31located on opposite sides of each other in the Y direction (third direction). Additionally, the fitting projection portion55including the second inclined surface55aand the third inclined surface56are spaced apart from each other in the X direction on an outer surface of each of the two side walls41cand41dof the second frame41located on opposite sides of each other in the Y direction. Note that the snap-fit mechanisms50may be provided on one of the two side walls of the main body frame30located on the opposite sides of each other, but preferably, one or more snap-fit mechanisms50are provided on each of the side walls of the main body frame30located on the opposite sides of each other. <Positioning Mechanism> In addition, as illustrated inFIG.7, the main body frame30further includes a positioning mechanism70that positions the first frame31and the second frame41in the X direction. The positioning mechanism70includes a flexible positioning plate portion71that protrudes from the open end of the first frame31and that enters from the open end of the second frame41and faces an inner surface of the outer peripheral side wall of the second frame41when connecting the first frame31to the second frame41. The flexible positioning plate portion71extends along the Z direction, in which a base portion thereof is integrated with the first frame31, and a tip side opposite to the base portion thereof protrudes from the open end side of the first frame31. Then, when connecting the first frame31to the second frame41, the tip side of the flexible positioning plate portion71enters from the open end of the second frame41and faces the inner surface of the outer peripheral side wall of the second frame41. In this first embodiment, there are provided a total of four flexible positioning plate portions71, each two of which are spaced apart from each other in the Y direction on the two side walls31aand31bof the first frame31in the X direction. In other words, the flexible positioning plate portion71is provided at each of four corners of the first frame31. Then, when connecting the first frame31to the second frame41, the tip side of each of the two flexible positioning plate portions71provided on the side wall31aside of the first frame31faces an inner surface of the side wall41aof the second frame41, and the tip side of each of the two flexible positioning plate portions71provided on the side wall31bside of the first frame31faces the inner surface of the side wall41bof the second frame41. In the positioning mechanism70, the tip side of each of the four flexible positioning plate portions71enters from the open end side of the second frame41and comes into contact with the inner surface of the outer peripheral side wall of the second frame41to allow for the positioning of the first frame31and the second frame41. The two flexible positioning plate portions71provided on the side wall31aside of the first frame31have an elastic force that urges the inner surface of the side wall41aof the second frame41, and the two flexible positioning plate portions71provided on the side wall31bside of the first frame31have an elastic force that urges the inner surface of the side wall41bof the second frame41. Note that while the flexible positioning plate portions71are provided on the side walls31aand31bsides, they may be provided on the side walls31cand31dsides. <Connection of First and Second Frames> Next, connection of the first frame31and the second frame41will be described with reference toFIGS.8A,8B,9A, and9B. First, as illustrated inFIGS.8A and8B, the first frame31and the second frame41are arranged along the Z direction so that the respective open end sides thereof face each other. Next, as illustrated inFIGS.9A and9B, the first frame31and the second frame41are brought relatively close to each other in the Z direction to bring the first inclined surface51aat the tip of the flexible protruding plate portion51into contact with the fitting projection portion55. Then, by bringing the first and second frames31and41closer relative to each other in the Z direction, the first inclined surface51aat the tip side of the flexible protruding plate portion51moves in contact with the fitting projection portion55, whereby the flexible protruding plate portion51bends outward. After that, as illustrated inFIGS.3,4A, and4B, the fitting projection portion55is fitted into the fitting hole portion52of the flexible protruding plate portion51and fits therewith, and the fitting hole portion52and the fitting projection portion55are engaged by the elastic force of the flexible protruding plate portion51. As a result, the first frame31and the second frame41are connected and fixed to each other by the snap-fit mechanisms50. In the middle of the connection of the first frame31and the second frame41, the tip side of the flexible positioning plate portion71of the first frame31enters from the open end side of the second frame41and comes into contact with the inner surface of the outer peripheral side wall of the second frame41to position the first frame31and the second frame41. Additionally, when the connection of the first frame31and the second frame41is complete, the flexible positioning plate portion71urges the inner surface of the outer peripheral side wall of the second frame41by its own elastic force, which can thus suppress rattling (vibration) of the first and second frames31and41in the X direction. <Release of Connection of First and Second Frames> Next, release of the connection of the first frame31and the second frame41will be described with reference toFIGS.10A,10B,11A, and11B. Note thatFIGS.10A and11Aillustrate the side walls31cand41csides of the first frame31and the second frame41, respectively, as inFIG.3. First, from the state where the first frame31and the second frame41are connected by the snap-fit mechanisms50(seeFIGS.3,4A, and4B), the first frame31and the second frame41are relatively displaced in the X direction to bring the inner wall surface of the flexible protruding plate portion51into contact with the second inclined surface55aof the fitting projection portion55and bring the flexible protruding plate portion51into contact with the third inclined surface56. Then, by further relatively displacing the first frame31and the second frame41in the X direction, the inner wall surface of the flexible protruding plate portion51moves in contact with the second inclined surface55aof the fitting projection portion55, and the flexible protruding plate portion51moves in contact with the third inclined surface56, whereby the flexible protruding plate portion51bends outward, as illustrated inFIGS.10A and10B. After that, the fitting projection portions55move outward from insides of the fitting hole portions52of the flexible protruding plate portions51. Then, by separating the first frame31and the second frame41relatively from each other in the Z direction, the fitting between the fitting hole portions52of the flexible protruding plate portions51and the fitting projection portions55is released, as illustrated inFIGS.11A and11B. This allows for release of the connection of the first frame31and the second frame41by the snap-fit mechanisms50. In other words, the snap-fit mechanisms50can release the connection of the first frame31and the second frame41by relatively displacing the first and second frames31and41in the X direction, which can therefore eliminate the need to use a tool. <Effects of First Embodiment> Next, main effects of this first embodiment will be described. The electromagnetic contactor1according to this first embodiment includes the snap-fit mechanism50. Then, as described above, the snap-fit mechanism50can release the fitting between the fitting hole portion52and the fitting projection portion55by relatively displacing the first frame31and the second frame41in the X direction. Therefore, it is unnecessary to use a tool to release the fitting as in the conventional art, and there is no need to bend the flexible protruding plate portions51with the tool. Thus, the electromagnetic contactor1according to this first embodiment can facilitate replacement of components such as the electromagnetic coil23in the main body frame30. Additionally, since the fitting between the fitting hole portions52of the flexible protruding plate portions51and the fitting projection portions55can be released without using tools, it is possible to eliminate a concern that the flexible protruding plate portions51may be broken depending on the amount of force applied when the flexible protruding plate portions51are bent with a tool. In addition, by relatively displacing the first frame31and the second frame41in the X direction, the fitting states of the four snap-fit mechanisms50can be released almost simultaneously, so that workability is excellent compared with the case where the plurality of snap-fit mechanisms are released with a tool. The electromagnetic contactor1according to this first embodiment further includes the positioning mechanism70that positions the first frame31and the second frame41in the X direction. Thus, in the electromagnetic contactor1according to this first embodiment, when connecting the first frame31to the second frame41, the positioning of the first and second frames31and41in the X direction can be quickly performed by the positioning mechanism70, which can therefore improve workability when connecting the first frame31to the second frame41by the snap-fit mechanism50. Furthermore, the flexible positioning plate portion71of the positioning mechanism70has the elastic force that urges the inner surface of the outer peripheral side wall of the second frame41after connecting the first frame31to the second frame41. Therefore, even though the first frame and the second frame can be relatively displaced in the X direction by the snap-fit mechanism50, rattling (vibration) of the first and second frames in the X direction can be suppressed by the elastic force of the flexible positioning plate portion71. Note that while the above first embodiment has described the snap-fit mechanism50provided with the fitting hole portion52in the first frame31and the fitting projection portion55in the second frame41, the present invention is not limited to the snap-fit mechanism50of the first embodiment described above. For example, the present invention can be applied to a snap-fit mechanism provided with the fitting projection portion55in the first frame31and the fitting hole portion52in the second frame41. In other words, the present invention can be applied to an electromagnetic contactor including a snap-fit that includes a hook portion in which a fitted portion is provided on the tip side of the flexible protruding plate portion51protruding from the open end side of one frame of the first and second frames31and41and a fitting projection portion provided in the other frame thereof and fitting with the fitted portion. Additionally, the above first embodiment has described the case where each two snap-fit mechanisms50are provided on each of the two side walls31cand31dof the first frame31located on the opposite sides of each other in the Y direction. However, the number of the snap-fit mechanisms50to be provided is not limited to that of the first embodiment described above. For example, each one snap-fit mechanism50may be provided on each of the two side walls31cand31d, or three or more snap-fit mechanisms50may be provided on each thereof. In addition, while the above first embodiment has described the case where the fitting hole portion52is used as the fitted portion of each snap-fit mechanism50, the present invention is not limited to the fitting hole portion52. For example, a fitting recessed portion may be used as the fitted portion. Second Embodiment This second embodiment will describe an example in which the present invention is applied to a case main body of an electromagnetic contactor as a case for an electric device. <<Overall Configuration of Electromagnetic Contactor>> As illustrated inFIGS.12and13, an electromagnetic contactor1A according to the second embodiment of the present invention as an electric device includes the contact unit10and the electromagnet unit20that drives the contact unit10. Additionally, the electromagnetic contactor1A according to the second embodiment of the present invention further includes the main body frame30that houses the contact unit10and the electromagnet unit20in the housing section30a, as a case for an electric device. The contact unit10and the electromagnet unit20are arranged in series in the Z direction (first direction) and housed in the housing section30aof the main body frame30. The electromagnetic contactor1A opens and closes a three-phase AC circuit. <Contact Unit> As illustrated inFIG.13, the contact unit10includes the pair of fixed contact elements11and12, the bridge type movable contact element13arranged to be capable of contacting with and separating from the pair of fixed contact elements11and12, and the movable contact support14holding the movable contact element13. The pair of fixed contact elements11and12extend in the X direction (second direction), and have a fixed contact at one end side thereof and an external terminal portion at the other end side thereof. Then, the pair of fixed contact elements11and12are fixed to the main body frame30in the state where the respective one end sides thereof face each other and are separated from each other in the X direction. The movable contact element13extends in the X direction, and is provided with a movable contact on one end side thereof and the other end side thereof, respectively. The movable contact on the one end side of the movable contact element13and the fixed contact of the one fixed contact element11are arranged to face each other. The movable contact at the other end side of the movable contact element13and the fixed contact of the other fixed contact element12are arranged to face each other. The movable contact element13is held by the movable contact support14. The pair of fixed contact elements11and12and the movable contact element13form a contact section, and three contact sections are arranged side by side in the Y direction to correspond to the three-phase AC circuit. <Electromagnet Unit> As illustrated inFIG.13, the electromagnet unit20includes the fixed iron core21, the movable iron core22, the electromagnetic coil23, and the return spring26. The fixed iron core21and the movable iron core22are arranged so that respective pole contact surfaces thereof face each other. The electromagnetic coil23generates the magnetic field that attracts the fixed iron core21and the movable iron core22by electromagnetic force. The electromagnetic coil23includes the winding24and the bobbin25. The winding24passes between the central leg portion and the outer leg portion of each of the fixed iron core21and the movable iron core22, and circles around the central leg portion. The bobbin25has the winding24wound thereon. The bobbin25has the cylindrical portion in which the central leg portion of each of the fixed iron core21and the movable iron core22is inserted into the inner diameter side thereof, and the winding24is wound on the outer diameter side thereof. Additionally, the bobbin25is provided with the flange portions protruding in the flange shape from both end portions of the cylindrical portion to the outer diameter side thereof. The electromagnetic coil23can be replaced according to the type of power supply used by the customer. The return spring26is an urging means for urging the movable iron core22in a direction away from the fixed iron core21. The return spring26is, for example, a coil spring provided between the upper surface of the bobbin25of the electromagnetic coil23and the movable iron core22. The pair of fixed contact elements11and12and the movable contact element13are electric contacts that switch circuit connection and disconnection by contacting with and separating from each other. As illustrated inFIG.13, the movable contact element13is fixed to one end side of the movable contact support14in the Z direction. Then, the other end side of the movable contact support14in the Z direction is fixed to the back surface portion opposite to the leg portion side of the movable iron core22. The movable contact element13moves in the Z direction in conjunction with movement of the movable iron core22in the Z direction. In other words, the pair of fixed contact elements11and12and the movable contact element13separate from each other in the released state where the fixed iron core21and the movable iron core22are separated from each other, and contact with each other in the energized state where the fixed iron core21and the movable iron core22are in contact with each other. A contact spring is provided on the side of the movable contact element13opposite to the movable iron core22side, although it is not illustrated. <Main Body Frame> As illustrated inFIGS.12and13, the main body frame30includes the first frame31and the second frame41facing each other in the Z direction to form the housing section30aand the snap-fit mechanism50that connects the first frame31to the second frame41. The first frame31is formed by the bottomed cylindrical body in which one end side of the square cylindrical outer peripheral side wall having the four side walls31a,31b,31c, and31dis opened and the other end side opposite to the one end side of the outer peripheral side wall is closed by the bottom wall31e. Similarly, the second frame41is also formed by the bottomed cylindrical body in which one end side of the square cylindrical outer peripheral side wall having the four side walls41a,41b,41c, and41dis opened and the other end side opposite to the one end side of the outer peripheral side wall is closed by a bottom wall. The side walls31aand41aand the side walls31band41bare located on the opposite sides of each other in the X direction. The side walls31cand41cand the side walls31dand41dare located on the opposite sides of each other in the Y direction. The first frame31is provided with a primary terminal portion electrically connected to the fixed contact element11, which is one of the pair of fixed contact elements11and12, and a secondary terminal portion electrically connected to the fixed contact element12, which is the other one of the pair of fixed contact elements11and12. The mounting plate portion43having a mounting hole is provided at the four corners of the second frame41on the bottom wall side. The first frame31and the second frame41are made of, for example, a nylon-based thermoplastic insulating resin excellent in heat resistance and insulation properties. Note that, in this second embodiment, the side housing the contact unit10is the first frame31including the flexible protruding plate portion51, and the side housing the electromagnet unit20is the second frame41including the fitting projection portion55, but on the contrary, the side housing the electromagnet unit20may be the first frame including the flexible protruding plate portion51, and the side housing the contact unit10may be the second frame including the fitting projection portion55. <Snap-Fit Mechanism> As illustrated inFIGS.14,15A, and15B, the snap-fit mechanism50includes the hook portion53provided with the fitting hole portion (opening portion)52as a fitted portion on the tip side of the flexible protruding plate portion51protruding from the open end of the first frame31, which is one of the first and second frames31and41, and the fitting projection portion55provided in the second frame41, which is the other one of the first and second frames31and41, and fitted with the fitting hole portion52of the flexible protruding plate portion51. The flexible protruding plate portion51extends along the Z direction, and has a base portion integrated with the first frame31, in which the tip side opposite to the base portion thereof protrudes from the open end side of the first frame31(seeFIG.16). Then, the tip of the flexible protruding plate portion51faces the outer surface of the outer peripheral side wall of the second frame41. The fitting hole portion52penetrates through the front and back surfaces of the flexible protruding plate portion51facing each other on the tip side of the flexible protruding plate portion51. The fitting projection portion55of the second frame41is fitted into the fitting hole portion52and fits therewith. Note that while this second embodiment uses the fitting hole portion52as the fitted portion, a fitting recessed portion may be used as the fitted portion. The fitting hole portion52and the fitting projection portion55are fitted by bringing the first and second frames31and41into relative proximity in the Z direction (first direction), and the fitting is released by relatively displacing the first and second frames31and41in the X direction (second direction) orthogonal to the Z direction. The flexible protruding plate portion51includes the first inclined surface51athat contacts with the fitting projection portion55to bend the flexible protruding plate portion51outward at the time of the fitting where the fitting hole portion52and the fitting projection portion55are fitted by bringing the first and second frames31and41into relative proximity in the Z direction. In other words, the flexible protruding plate portion51includes the first inclined surface51ain the Z direction in which the fitting hole portion52and the fitting projection portion55are fitted. The first inclined surface51ais inclined with an inclination in the direction in which the thickness of the tip portion of the flexible protruding plate portion51gradually increases toward the base portion thereof. The fitting projection portion55includes the second inclined surface55athat contacts with the inner surface of the fitting hole portion52to bend the flexible protruding plate portion51outward when releasing the fitting between the fitting hole portion52and the fitting projection portion55by relatively displacing the first and second frames31and41in the X direction orthogonal to the Z direction. In other words, the fitting projection portion55includes the second inclined surface55ain the X direction in which the fitting between the fitting hole portion52and the fitting projection portion55is released. The second inclined surface55ais inclined with an inclination in the direction in which the thickness of the fitting projection portion55gradually increases from a position where flexible protruding plate portion51contacts the surface. The second frame41, which is the other one of the first and second frames31and41that is provided with the fitting projection portion55, includes the third inclined surface56that contacts with the tip side of the flexible protruding plate portion51to bend the flexible protruding plate portion51outward when releasing the fitting between the fitting hole portion52and the fitting projection portion55by relatively displacing the first frame31and the second frame41in the X direction orthogonal to the Z direction. The third inclined surface56is provided on the outer surface side of the outer peripheral side wall of the second frame41. In other words, the snap-fit mechanism50includes the third inclined surface56provided in the second frame41. The third inclined surface56is inclined with an inclination in the direction in which the wall thickness gradually increases toward the side wall surface from the position where the flexible protruding plate portion51contacts the surface. As illustrated inFIG.14toFIG.17, there are provided a total of four snap-fit mechanisms50, each two of which are arranged side by side in the X direction on each of the portions of the outer peripheral side wall of the main body frame30located on the opposite sides of each other in the Y direction. In other words, the hook portions53each including the flexible protruding plate portion51, the first inclined surface51a, and the fitting hole portion52are provided away from each other in the X direction on the outer surface of each of the two side walls31cand31dlocated on the opposite sides of each other in the Y direction (third direction) of the first frame31. Additionally, the fitting projection portion55including the second inclined surface55aand the third inclined surface56are provided away from each other in the X direction on the outer surface of each of the two side walls41cand41dof the second frame41located on the opposite sides of each other in the Y direction. Note that the snap-fit mechanism50may be provided on one of the two side walls of the main body frame30located on the opposite sides of each other, but preferably, one or more snap-fit mechanisms50are provided on each of the side walls of the main body frame30located on the opposite sides of each other. <Relative Displacement Suppression Mechanism> As illustrated inFIGS.12and14, the main body frame30further includes a relative displacement suppression mechanism80that suppresses a relative displacement between the connected first and second frames31and41. The relative displacement suppression mechanism80of this second embodiment can suppress, as the relative displacement, a relative displacement in each of the X direction and the Y direction (horizontal misalignment) in a two-dimensional plane orthogonal to the direction (Z direction) of the connection of the first frame31and the second frame41. Additionally, relative displacement in the Z direction (vertical misalignment) can also be suppressed. As illustrated inFIGS.18A and18B, the relative displacement suppression mechanism80includes a first fixing portion81provided on the side wall31aof the first frame31, a second fixing portion85provided on the side wall41aof the second frame41, and a fixed member90that can be detachably attached to the first and second fixing portions81and85. Then, the relative displacement suppression mechanism80has a first state where the fixed member90is fixed to both the first fixing portion81and the second fixing portion85, as illustrated inFIGS.20A and20B, and, as a second state where the fixed member90is fixed to either the first fixing portion81or the second fixing portion85, a second state where the fixed member90is fixed to the first fixing portion81, as illustrated inFIGS.19A and19B. The first fixing portion81and the second fixing portion85are provided to overlap each other in the Z direction when connecting the first frame31to the second frame41. The fixed member90moves from the first fixing portion81side toward the second fixing portion85side and is connected and fixed to each of the first fixing portion81and the second fixing portion85(the first state), which will be described in detail later. In this second embodiment, as illustrated inFIGS.18A,19A, and19B, the fixed member90is detachably held on the first fixing portion81side (the second state). Then, by moving the fixed member90in the held state (the second state) from the first fixing portion81side toward the second fixing portion85side (moving it from the state (the second state) illustrated inFIGS.19A and19Bto the state (the first state) illustrated inFIGS.20A and20B), the relative displacement between the connected first and second frames31and41can be suppressed. Additionally, by moving the fixed member90in this relative displacement suppression state from the second fixing portion85side toward the first fixing portion81side (moving it from the state (the first state) illustrated inFIGS.20A and20Bto the state (the second state) illustrated inFIGS.19A and19B), the relative displacement suppression of the connected first and second frames31and41can be released. The fixed member90slides over the first fixing portion81and the second fixing portion85. In other words, the relative displacement suppression mechanism80can suppress and release the relative displacement between the connected first and second frames31and41without using tools (in a tool-less manner). The first fixing portion81is formed on the side wall31aof the first frame31by integral molding. The second fixing portion85is formed on the side wall41aof the second frame41by integral molding. As illustrated inFIGS.18B and19B, the first fixing portion81is formed by a rectangular parallelepiped three-dimensional structure including a front portion81a, two side face portions81blocated on opposite sides of each other in the Y direction, and two end face portions81clocated on opposite sides of each other in the Z direction. Additionally, the first fixing portion81includes a first piece insertion portion82into which an insertion piece92, which will be described later, is inserted and a first arm insertion portion83into which a flexible arm93, which will be described later, is inserted. Each of the first piece insertion portion82and the first arm insertion portion83is formed by a through hole extending from one end face portion81cside of the first fixing portion81to the other end face portion81cside thereof. Two first piece insertion portions82are provided to be spaced apart from each other in the Y direction. In addition, two first arm insertion portions83are provided to be spaced apart from each other in the Y direction between the two first piece insertion portions82. As illustrated inFIGS.18B and19B, the second fixing portion85is formed by a rectangular parallelepiped three-dimensional structure including a front portion85a, two side face portions85blocated on opposite sides of each other in the Y direction, and two end face portions85clocated on opposite sides of each other in the Z direction. Additionally, the second fixing portion85includes a second piece insertion portion86into which the insertion piece92is inserted and a second arm insertion portion87into which the flexible arm93is inserted. Each of the second piece insertion portion86and the second arm insertion portion87is formed by a through hole extending from one end face portion85cside of the second fixing portion85to the other end face portion85cside thereof. Two second piece insertion portions86are provided to be spaced apart from each other in the Y direction. In addition, two second arm insertion portions87are provided to be spaced apart from each other in the Y direction between the two second piece insertion portions86. Note that, in this second embodiment, each insertion piece92is inserted from the first piece insertion portion82side toward the second piece insertion portion86side. In such a case, the second piece insertion portions86may be formed by recessed portions with bottoms. As illustrated inFIGS.18B and19B, the first fixing portion81and the second fixing portion85have the same exterior shape dimensions so that when the first and second frames31and41are connected to each other, the respective front portions81aand85aare flush with each other and the respective side face portions81band85bare flush with each other in the Z direction. As illustrated inFIG.19B, the first piece insertion portions82and the second piece insertion portions86are configured to be located in straight lines in the Z direction when the first and second frames31and41are connected to each other. In other words, the first piece insertion portions82and the second piece insertion portions86are configured to overlap each other in the Z direction. Additionally, the first arm insertion portions83and the second arm insertion portions87are also configured to be located in straight lines in the Z direction when the first and second frames31and41are connected to each other. In other words, the first arm insertion portions83and the second arm insertion portions87are configured to overlap each other in the Z direction. As illustrated inFIG.20B, the second fixing portion85includes a first engaged portion88onto which a first engaging projection portion93aprovided on a tip side of the flexible arm93is hooked by using flexibility of the flexible arm93. The first engaged portion88is provided on an inner wall of each of the two second arm insertion portions87, and the first engaged portions88are arranged next to each other in the Y direction. As illustrated inFIG.19B, the first fixing portion81includes a second engaged portion84onto which a second engaging projection portion93bprovided on the flexible arm93so as to be spaced apart from the first engaging projection portion93ais hooked by using the flexibility of the flexible arm93. The second engaged portion84is provided on an inner wall of each of the two first arm insertion portions83, and the second engaged portions84are arranged next to each other in the Y direction. As illustrated inFIGS.19B and20B, the first engaged portions88and the second engaged portions84are configured to be positioned in a straight line in the Z direction when the first frame31and the second frame41are connected to each other. In other words, the first engaged portions88and the second engaged portions84are configured to overlap each other in the Z direction. As illustrated inFIGS.18A and18C, the fixed member90includes a member main body91and the insertion piece92and the flexible arm93whose base portions are fixed to the member main body91. The member main body91includes an upper wall91ahaving a two-dimensional planar shape (rectangular shape) whose plane includes a longitudinal direction (for example, the Y direction) and a transverse direction (for example, the X direction), a back wall91bextending from one of two long sides of the upper wall91alocated on opposite sides of each other in the transverse direction in a direction (for example, the Z direction) orthogonal to the upper wall91a, and two side walls91ceach extending along the back wall91bfrom two short sides of the upper wall91alocated on opposite sides of each other in the longitudinal direction thereof. Then, a side of the member main body91opposite to the upper wall91ais opened, and the open end side is the entrance and exit of the first and second fixing portions81and85. In other words, the fixed member90slides on the front portions81aand85aand the side face portions81band85bof the first and second fixing portions81and85, respectively, when moving from the first fixing portion81side toward the second fixing portion85side. Note that, as illustrated inFIGS.18A and19B, when the fixed member90is attached to the first fixing portion81, the longitudinal direction of the fixed member90is the Y direction, and the transverse direction of the fixed member90is the X direction. As illustrated inFIGS.18C and19B, the base portion (root) of each insertion piece92is connected to the upper wall91aby integral molding, and the insertion piece92extends from the base portion toward the open end side of the member main body91. Then, the insertion piece92is inserted into each of the first piece insertion portions82of the first fixing portion81and the second piece insertion portions86of the second fixing portion85by moving the fixed member90from the first fixing portion81side toward the second fixing portion85side (moving it from the state (second state) illustrated inFIGS.19A and19Bto the state (first state) illustrated inFIGS.20A and20B). Additionally, the relative displacement between the first frame31and the second frame41in each of the X and Y directions can be suppressed by the insertion piece92inserted into each of the first and second piece insertion portions82and86. The insertion piece92moves while sliding on an inner wall of each of the first and second piece insertion portions82and86. The insertion pieces92have, for example, a wide plate shape in the longitudinal direction of the upper wall91a. As illustrated inFIGS.18C and19B, the base portion of each flexible arm93is connected to the upper wall91aby integral molding, and the flexible arm93extends from the base portion toward the open end side of the member main body91. Additionally, each flexible arm93includes the first engaging projection portion93aprovided on the tip side thereof opposite to the base portion thereof and the second engaging projection portion93bspaced apart from the first engaging projection portion93aand provided closer to the base portion side than the first engaging projection portion93ain the direction of extension of the flexible arm93. By moving the fixed member90from the first fixing portion81side to the second fixing portion85side (moving it from the state (second state) illustrated inFIGS.19A and19Bto the state (first state) as illustrated inFIGS.20A and20B), the first engaging projection portions93aof the flexible arms93are hooked onto the first engaged portions88of the second fixing portion85by the elastic force of the flexible arms93to maintain the state of engagement thereof with the first engaged portions88, as illustrated inFIGS.20A and20B. Then, maintaining the above engagement state allows for maintaining of the state of the insertion piece92inserted into each of the first piece insertion portions82of the first fixing portion81and the second piece insertion portions86of the second fixing portion85. That is, the relative displacement suppression mechanism80moves the fixed member90from the first fixing portion81side toward the second fixing portion85side, and hooks the first engaging projection portions93aof the flexible arms93onto the first engaged portions88of the second fixing portion85by means of the elastic force of the flexible arms93to put them into the engagement state, thereby maintaining the state where the insertion piece92is inserted in each of the first piece insertion portions82of the first fixing portion81and the second piece insertion portions86of the second fixing portion85and also maintaining the first state where the fixed member90is fixed to both the first and second fixing portions81and85. In other words, the suppression state of the relative displacement between the first and second frames31and41in each of the X and Y directions is maintained. By moving the fixed member90from the second fixing portion85side toward the first fixing portion81side (moving it from the state (first state) illustrated inFIGS.20A and20Bto the state (second state) illustrated inFIGS.19A and19B), the second engaging projection portions93bof the flexible arms93are hooked onto the second engaged portions84of the first fixing portion81by the elastic force of the flexible arms93to maintain the state of engagement thereof with the second engaged portions84, as illustrated inFIGS.19A and19B. Then, maintaining the engagement state allows for maintaining of the state of the insertion pieces92pulled out (removed) from the second piece insertion portions86of the second fixing portion85. That is, the relative displacement suppression mechanism80moves the fixed member90from the second fixing portion85side toward the first fixing portion81side, and hooks the second engaging projection portions93bof the flexible arms93onto the second engaged portions84of the first fixing portion81by the elastic force of the flexible arms93to bring them into the engagement state, thereby maintaining the state where the insertion pieces92are pulled out (removed) from the second piece insertion portions86of the second fixing portion85and also maintaining the second state where the fixed member90is fixed to the first fixing portion81. In other words, the released state of the relative displacement suppression of the first and second frames31and41in each of the X and Y directions is maintained. The flexible arms93have the elastic force that urges the first engaging projection portions93ato the first engaged portions88and urges the second engaging projection portions93bto the second engaged portions84. Then, the first engaging projection portions93aare urged to the first engaged portions88by the elastic force of the flexible arms93to maintain the state of engagement thereof with the first engaged portions88. Additionally, the second engaging projection portions93bare urged to the second engaged portions84by the elastic force of the flexible arms93to maintain the state of engagement thereof with the second engaged portions84. As illustrated inFIGS.18C and19B, two insertion pieces92, two first piece insertion portions82of the first fixing portion81, and two second piece insertion portions86of the second fixing portion85, respectively, are provided side by side in the longitudinal direction (Y direction) of the upper wall91a. Additionally, two flexible arms93, two first arm insertion portions83of the first fixing portion81, and two second arm insertion portions87of the second fixing portion85, respectively, are provided side by side in the longitudinal direction (Y direction) of the upper wall91a. In other words, the relative displacement suppression mechanism80of this first embodiment includes two sets each including the insertion piece92, the first piece insertion portion82, and the second piece insertion portion86and two sets each including the flexible arm93, the first arm insertion portion83, and the second arm insertion portion87. Note that the number of the sets including the insertion piece92, the first piece insertion portion82, and the second piece insertion portion86and the number of the sets including the flexible arm93, the first arm insertion portion83, and the second arm insertion portion87are not limited to the number of the sets of this first embodiment, and, for example, may be one set or three or more sets for each. Furthermore, the number of the sets including the insertion piece92, the first piece insertion portion82, and the second piece insertion portion86may be different from the number of the sets including the flexible arm93, the first arm insertion portion83, and the second arm insertion portion87. As illustrated inFIG.18AtoFIG.20B, the relative displacement suppression mechanism80further includes a positioning projection portion95provided on the side walls of the fixed member90and a stopper portion96provided on the side wall of the first frame31and configured to, when the fixed member90moves from the second fixing portion85side toward the first fixing portion81side, stop the movement of the first fixing portion81by coming into contact with the positioning projection portion95in the state where the insertion pieces92are pulled out from the second piece insertion portions86and the fixed member90is held in the first fixing portion81. In addition, the relative displacement suppression mechanism80further includes a guide recessed portion97provided on the side wall41aof the second frame41to extend in the Z direction and moving the positioning projection portion95along the Z direction. Additionally, the stopper portion96is provided at an end of the guide recessed portion97, and is formed by a step between the first frame31and the guide recessed portion97. When the fixed member90is attached to the first fixing portion81, the positioning projection portion95projects from the side walls91cof the fixed member90toward the second frame41, faces the guide recessed portion97, and moves in the direction of extension of the guide recessed portion97. <Relative Displacement Suppression> Next, relative displacement suppression by the relative displacement suppression mechanism80will be described. First, as illustrated inFIGS.19A and19B, in the state where the first and second frames31and41are connected to each other, the fixed member90is slidably attached to the first fixing portion81side of the first frame31(second state). At this time, the second engaging projection portions93bof the flexible arms93are hooked onto the second engaged portions84of the first fixing portion81by the elastic force of the flexible arms93to maintain the state of engagement of the second engaging projection portions93bof the flexible arms93with the second engaged portions84of the first fixing portion81. Then, by maintaining the engagement state, the fixed member90is held in the first fixing portion81in the state where the insertion pieces92are inserted only into the first piece insertion portions82of the first fixing portion81and pulled out from the second piece insertion portions86of the second fixing portion85, i.e., in a state where the suppression of relative displacement in the X and Y directions (horizontal misalignment) is released. The flexible arms93are inserted into the first arm insertion portions83of the first fixing portion81and the second arm insertion portions87of the second fixing portion85. However, the first engaging projection portions93aof the flexible arms93are located between the first engaged portions88and the second engaged portions84, and not engaged with the first engaged portions, so that the suppression of relative displacement in the Z direction (vertical misalignment) is released. Next, the fixed member90is inserted toward the second fixing portion85side from the state where the relative displacement suppression is released, and is moved from the first fixing portion81side toward the second fixing portion85side, as illustrated inFIGS.20A and20B. By the movement of the fixed member90(from the first fixing portion81side to the second fixing portion85side), the insertion pieces92are moved to the second piece insertion portions86of the second fixing portion85, so that the insertion pieces92are inserted into both the first piece insertion portions82of the first fixing portion81and the second piece insertion portions86of the second fixing portion85. Additionally, by the movement of the fixed member90(from the first fixing portion81side to the second fixing portion85side), the first engaging projection portions93aof the flexible arms93move in contact with the first engaged portions88of the second fixing portion85, and the flexible arms93bend outward opposite to the first engaged portions88. Then, due to the outward bending of the flexible arms93, the first engaging projection portions93agoes over the first engaged portions88. Then, the first engaging projection portions93aof the flexible arms93are hooked onto the first engaged portions88by the elastic force of the flexible arms93to maintain the state of engagement of the first engaging projection portions93aof the flexible arms93with the first engaged portions88of the second fixing portion85. At this time, the upper wall91aof the fixed member90comes into contact with the second engaged portions84of the first fixing portion81to stop the movement of the fixed member90and also position the first engaging projection portions93aand the first engaged portions88. In addition, by the movement of the fixed member90(from the first fixing portion81side to the second fixing portion85side), the second engaging projection portions93bof the flexible arms93move in contact with the second engaged portions84of the first fixing portion81, and the flexible arms93bend outward opposite to the second engaged portions84. Then, due to the outward bending of the flexible arms93, the second engaging projection portions93bgo over the second engaged portions84. Additionally, the second engaging projection portions93bof the flexible arms93move between the second engaged portions84of the first fixing portion81and the first engaged portions88of the second fixing portion85, and the engagement state between the second engaging projection portions93bof the flexible arms93and the second engaged portions84of the first fixing portion81is released. As a result, the insertion pieces92inserted into both the first piece insertion portions82and the second piece insertion portions86can suppress the relative displacement between the first frame31and the second frame41in each of the X and Y directions (horizontal misalignment). In addition, maintaining the engagement of the first engaging projection portions93aof the flexible arms93with the first engaged portions88of the second fixing portion85can also suppress the relative displacement between the first frame31and the second frame41in the Z direction (vertical misalignment). It is also possible to maintain the first state where the fixed member90is fixed to both the first fixing portion81and the second fixing portion85. <Release of Relative Displacement Suppression> Next, release of the relative displacement suppression by the relative displacement suppression mechanism80will be described. First, in the state where the relative displacement is suppressed (seeFIGS.20A and20B), the fixed member90is moved from the second fixing portion85side toward the first fixing portion81side (seeFIGS.19A and19B). By the movement of the fixed member90, the insertion pieces92move from the second piece insertion portion86side of the second fixing portion85to the first piece insertion portion82side of the first fixing portion81, whereby the insertion pieces92are pulled out from the second piece insertion portions86of the second fixing portion85. Additionally, by the movement of the fixed member90(from the second fixing portion85side to the first fixing portion81side), the second engaging projection portions93aof the flexible arms93move in contact with the first engaged portions88of the second fixing portion85, and the flexible arms93bend outward opposite to the first engaged portions88. Then, due to the outward bending of the flexible arms93, the first engaging projection portions93ago over the first engaged portions88. Additionally, the first engaging projection portions93aof the flexible arms93move between the first engaged portions88of the second fixing portion85and the second engaged portions84of the first fixing portion81, and the engagement state between the first engaging projection portions93aof the flexible arms93and the first engaged portions88of the second fixing portion85is released. Additionally, by the movement of the fixed member90(from the second fixing portion85side to the first fixing portion81side), the second engaging projection portions93bof the flexible arms93move in contact with the second engaged portions84of the first fixing portion81, and the flexible arms93bend outward opposite to the second engaged portions84. Then, due to the outward bending of the flexible arms93, the second engaging projection portions93bgo over the second engaged portions84. Additionally, the second engaging projection portions93bof the flexible arms93are hooked onto the second engaged portions84by the elastic force of the flexible arms93to maintain the engagement state between the second engaging projection portions93bof the flexible arms93and the second engaged portions84of the first fixing portion81. In addition, by the movement of the fixed member90(from the second fixing portion85side to the first fixing portion81side), the positioning projection portion95of the fixed member90moves through the guide recessed portion97of the second fixing portion85, and comes into contact with the stopper portion96of the first frame31to stop the movement of the fixed member90and also position the second engaging projection portions93band the second engaged portions84. This allows the insertion pieces92to be pulled out from the second piece insertion portions86, which can thereby release the suppression of the relative displacement between the first frame31and the second frame41in each of the X and Y directions (horizontal misalignment). Additionally, the engagement of the first engaging projection portions93aof the flexible arm93with the first engaged portions88of the second fixing portion85is released, so that the suppression of the relative displacement between the first and second fames31and41in the Z direction (vertical misalignment) can be released. It is also possible to maintain the second state where the fixed member90is fixed to the first fixing portion81. Note that, in the second engaging projection portions93bof the flexible arms93, surfaces that come in contact with the second engaged portions84are R-shaped in order to make it easier to go over the second engaged portions84. Additionally, in the first engaging projection portions93aof the flexible arms93, tip surfaces that come in contact with the first engaged portions88are inclined in order to make it easier to go over the first engaged portions88. Furthermore, the fixed member90is made of, for example, polyamide resin (PA) excellent in flexibility. <Positioning Mechanism> In addition, as illustrated inFIG.21, the main body frame30further includes the positioning mechanism70that positions the first frame31and the second frame41in the X direction. The positioning mechanism70includes the flexible positioning plate portion71that protrudes from the open end of the first frame31and that enters from the open end side of the second frame41and faces the inner surface of the outer peripheral side wall of the second frame41when connecting the first frame31to the second frame41. The flexible positioning plate portion71extends along the Z direction, in which a base portion thereof is integrated with the first frame31, and a tip side opposite to the base portion thereof protrudes from the open end side of the first frame31. Then, when connecting the first and second frames31and41to each other, the tip side of the flexible positioning plate portion71enters from the open end side of the second frame41and faces the inner surface of the outer peripheral side wall of the second frame41. In this second embodiment, there are provided a total of four flexible positioning plate portions71, each two of which are spaced apart from each other in the Y direction on the two side walls31aand31bof the first frame31in the X direction. In other words, the flexible positioning plate portion71is provided at each of four corners of the first frame31. Then, when connecting the first frame31to the second frame41, the tip side of each of the two flexible positioning plate portions71provided on the side wall31aside of the first frame31faces the inner surface of the side wall41aof the second frame41, and the tip side of each of the two flexible positioning plate portions71provided on the side wall31bside of the first frame31faces the inner surface of the side wall41bof the second frame41. In this positioning mechanism70, the tip side of each of the four flexible positioning plate portions71enters from the open end side of the second frame41and comes into contact with the inner surface of the outer peripheral side wall of the second frame41to allow for the positioning of the first frame31and the second frame41. The two flexible positioning plate portions71provided on the side wall31aside of the first frame31have the elastic force that urges the inner surface of the side wall41aof the second frame41, and the two flexible positioning plate portions71provided on the side wall31bside of the first frame31have the elastic force that urges the inner surface of the side wall41bof the second frame41. Note that while the flexible positioning plate portions71are provided on the side walls31aand31bsides, they may be provided on the side walls31cand31dsides. <Connection of First and Second Frames> Next, connection of the first frame31and the second frame41will be described with reference toFIGS.22A,22B,23A, and23B. Note thatFIGS.22A and23Aillustrate the side walls31cand41csides of the first frame31and the second frame41, respectively, similarly toFIG.14. First, as illustrated inFIGS.22A and22B, the first frame31and the second frame41are arranged along the Z direction so that the respective open end sides thereof face each other. Next, as illustrated inFIGS.23A and23B, the first frame31and the second frame41are brought into relative proximity in the Z direction to bring the first inclined surfaces51aat the tips of the flexible protruding plate portions51into contact with the fitting projection portions55. Then, by bringing the first and second frames31and41closer relative to each other in the Z direction, the first inclined surfaces51aat the tip sides of the flexible protruding plate portions51move in contact with the fitting projection portions55, and the flexible protruding plate portions51bend outward. After that, as illustrated inFIGS.14,15A, and15B, the fitting projection portions55are fitted into the fitting hole portions52of the flexible protruding plate portions51and fits therewith. Then, the fitting hole portions52and the fitting projection portions55are engaged by elastic force of the flexible protruding plate portions51. As a result, the first frame31and the second frame41are connected and fixed to each other by the snap-fit mechanisms50. In the middle of the connection of the first frame31and the second frame41, the tip sides of the flexible positioning plate portions71of the first frame31enter from the open end side of the second frame41and come into contact with the inner surface of the outer peripheral side wall of the second frame41, thereby positioning the first frame31and the second frame41. Additionally, when the connection of the first frame31and the second frame41is complete, the flexible positioning plate portions71urge the inner surface of the outer peripheral side wall of the second frame41by means of their own elastic force, so that rattling (vibration) of the first frame31and the second frame41in the X direction can be suppressed. <Release of Connection of First and Second Frames> Next, release of the connection of the first frame31and the second frame41will be described with reference toFIGS.24A,24B,25A, and25B. Note thatFIGS.24A and25Aillustrate the side walls31cand41csides of the first frame31and the second frame41, respectively, similarly toFIG.14. First, from the state where the first frame31and the second frame41are connected to each other by the snap-fit mechanisms50(seeFIGS.14,15A, and15B), the first frame31and the second frame41are relatively displaced in the X direction to bring the inner wall surfaces of the flexible protruding plate portions51into contact with the second inclined surfaces55aof the fitting projection portions55and bring the flexible protruding plate portions51into contact with the third inclined surfaces56. Then, by further relatively displacing the first and second frames31and41in the X direction, the inner wall surfaces of the flexible protruding plate portions51move in contact with the second inclined surfaces55aof the fitting projection portions55, and the flexible protruding plate portions51move in contact with the third inclined surfaces56, whereby the flexible protruding plate portions51bend outward, as illustrated inFIGS.24A and24B. After that, the fitting projection portions55move outward from the insides of the fitting hole portions52of the flexible protruding plate portions51. Then, by separating the first frame31and the second frame41relatively from each other in the Z direction, the fitting between the fitting hole portions52of the flexible protruding plate portions51and the fitting projection portions55is released, as illustrated inFIGS.25A and25B. This allows for release of the connection of the first frame31and the second frame41by the snap-fit mechanisms50. In other words, the snap-fit mechanisms50can release the connection of the first frame31and the second frame41by relatively displacing the first and second frames31and41in the X direction, which can therefore eliminate the need to use a tool. [Effects of Second Embodiment] Next, main effects of this second embodiment will be described. The electromagnetic contactor1A according to this second embodiment includes the snap-fit mechanism50. Then, as described above, the snap-fit mechanism50can release the fitting between the fitting hole portions52and the fitting projection portions55by relatively displacing the first frame31and the second frame41in the X direction. It is therefore unnecessary to use a tool to release the fitting as in the conventional art, and there is no need to bend the flexible protruding plate portions51with the tool. Thus, the electromagnetic contactor1A according to this second embodiment can facilitate replacement of components such as the electromagnetic coil23in the main body frame30. Additionally, since the fitting between the fitting hole portions52of the flexible protruding plate portions51and the fitting projection portions55can be released without using tools, it is possible to eliminate the concern that the flexible protruding plate portions51may be broken depending on the amount of force applied when the flexible protruding plate portions51are bent with a tool. In addition, by relatively displacing the first frame31and the second frame41in the X direction, the fitting states of the four snap-fit mechanisms50can be released almost simultaneously, so that workability is excellent compared with the case where the plurality of snap-fit mechanisms are released with a tool. The electromagnetic contactor1A according to this second embodiment further includes the positioning mechanism70that positions the first frame31and the second frame41in the X direction. Thus, in the electromagnetic contactor1A according to this second embodiment, when connecting the first frame31to the second frame41, positioning of the first frame31and the second frame41in the X direction can be quickly performed by the positioning mechanism70, which can therefore improve workability when connecting the first frame31to the second frame41by the snap-fit mechanism50. Furthermore, the flexible positioning plate portion71of the positioning mechanism70has the elastic force that urges the inner surface of the outer peripheral side wall of the second frame41after connecting the first frame31to the second frame41. Therefore, even though the first frame31and the second frame41can be relatively displaced in the X direction by the snap-fit mechanism50, rattling (vibration) of the first and second frames in the X direction can be suppressed by the elastic force of the flexible positioning plate portion71. The main body frame30of this second embodiment includes the relative displacement suppression mechanism80that suppresses a relative displacement between the first frame31and the second frame41. Then, this relative displacement suppression mechanism80can suppress and release the relative displacement between the connected first and second frames31and41without using tools (in a tool-less manner). Thus, according to the relative displacement suppression mechanism80of this second embodiment, replacement of components such as the electromagnetic coil23(electric component) in the main body frame30can be facilitated. Additionally, this relative displacement suppression mechanism80is configured to insert the insertion piece92in each of the first piece insertion portions82of the first fixing portion81and the second piece insertion portions86of the second fixing portion85by moving the fixed member90from the first fixing portion81side to the second fixing portion85side. Thus, the relative displacement suppression mechanism80of this second embodiment can suppress the relative displacement between the connected first and second frames31and41in each of the X direction and the Y direction. In addition, this relative displacement suppression mechanism80is configured to maintain the state where the insertion piece92is inserted in each of the first piece insertion portions82of the first fixing portion81and the second piece insertion portions86of the second fixing portion85by moving the fixed member90from the first fixing portion81side toward the second fixing portion85side and hooking the first engaging projection portions93aof the flexible arms93onto the first engaged portions88of the second fixing portion85by the elastic force of the flexible arms93to bring them into the engagement state. Thus, the relative displacement suppression mechanism80of this second embodiment can suppress the relative displacement between the connected first and second frames31and41in the Z direction. Here, in the main body frame30of this second embodiment, the first frame31and the second frame41are connected to each other by the snap-fit mechanism50. In such a case, the relative displacement suppression by the relative displacement suppression mechanism80in the Z direction is auxiliary. However, in main body frames (cases for electric devices) without any connection mechanism such as the snap-fit mechanism50, relative displacement suppression in the Z direction by the relative displacement suppression mechanism80of this second embodiment is effective. Additionally, the relative displacement suppression mechanism80of this second embodiment is configured to maintain the state where the insertion pieces92are pulled out from the second piece insertion portions86of the second fixing portion85by moving the fixed member90from the second fixing portion85side toward the first fixing portion81side and hooking the second engaging projection portions93bof the flexible arms93onto the second engaged portions84of the first fixing portion81by the elastic force of the flexible arms93to bring them into the engagement state. Thus, the relative displacement suppression mechanism80of this second embodiment can increase a retaining strength of the fixed member90attached to the first fixing portion81. Furthermore, in the relative displacement suppression mechanism80of this second embodiment, the insertion pieces92for suppressing relative displacement and the flexible arms93for holding the fixed member90on the first and second fixing portions81and85have separate configurations. Thus, the fixed member90can be made into a thick-wall structure, thereby enabling increased strength of the fixed member90itself. Additionally, since this relative displacement suppression mechanism80can suppress the relative displacement between the connected first and second frames31and41, there can be provided a more reliable electromagnetic contactor1A. In addition, the above second embodiment has described the snap-fit mechanism50in which the fitting hole portion52is provided in the first frame31and the fitting projection portion55is provided in the second frame41. However, the present invention is not limited to the snap-fit mechanism50of the above second embodiment. For example, the present invention can be applied to a snap-fit mechanism in which the fitting projection portion55is provided in the first frame31and the fitting hole portion52is provided in the second frame41. In other words, the present invention can be applied to an electromagnetic contactor provided with a snap fit including a hook portion in which a fitted portion is provided on the tip side of the flexible protruding plate portion51protruding from the open end side of one of the first and second frames31and41and a fitting projection portion provided on the other frame thereof and fitting with the fitted portion. Additionally, the above second embodiment has described the case where the two snap-fit mechanisms50are provided on each of the two side walls31cand31dof the first frame31located on the opposite sides of each other in the Y direction. However, the number of the snap-fit mechanisms50to be provided is not limited to that of the above embodiment. For example, one or three or more snap-fit mechanisms50may be provided on each of the two side walls31cand31d. Furthermore, while the above second embodiment has described the case where the fitting hole portion52is used as the fitted portion of the snap-fit mechanism50, the present invention is not limited to the fitting hole portion52. For example, a fitting recessed portion may be used as the fitted portion. Still furthermore, the above second embodiment has described the case where the relative displacement suppression mechanism80is provided over the side walls31aand41a, which are one of each of the two side walls31aand31band41aand41bof the first and second frames31and41located in the X direction. However, the position of the relative displacement suppression mechanism80is not limited to that of the above second embodiment. For example, the relative displacement suppression mechanism80may be provided over the side walls31cand41c, which are one of each of the two side walls of the first and second frames31and41located in the Y direction. Even in this case, relative displacements (positional misalignments) between the connected first and second frames31and41in the X, Y, and Z directions can be suppressed. Additionally, the above second embodiment has described the case of the relative displacement suppression mechanism80in which the second state where the fixed member90is fixed to the first fixing portion81is maintained by inserting the insertion pieces92into the first piece insertion portions82and hooking the second engaging projection portions93bonto the second engaged portions84by the elastic force of the flexible arms93to bring them into the engagement state. However, the present invention is not limited to the second state of this second embodiment, and can also be applied to a case where a second state where the fixed member90is fixed to the second fixing portion85is maintained. Third Embodiment An electromagnetic contactor1B according to a third embodiment of the present invention basically has the same configuration as that of the electromagnetic contactor1A according to the above second embodiment, but is different in the configuration of the relative displacement suppression mechanism. Specifically, as illustrated inFIG.26, the electromagnetic contactor1B according to this third embodiment includes a relative displacement suppression mechanism60instead of the relative displacement suppression mechanism80of the electromagnetic contactor1A illustrated inFIG.12. Other configurations are the same as those in the above second embodiment. As illustrated inFIGS.26and27A, the main body frame30includes the relative displacement suppression mechanism60that suppresses a relative displacement between the connected first and second frames31and41. The relative displacement suppression mechanism60of this third embodiment can suppress, as the relative displacement, a relative displacement between the first and second frames31and41in each of the X direction and the Y direction (horizontal misalignment) in the two-dimensional plane orthogonal to the direction (Z direction) in which the first and second frames31and41are connected to each other. Additionally, relative displacement in the Z direction (vertical misalignment) can also be suppressed. As illustrated inFIGS.27A and27B, the relative displacement suppression mechanism60includes a first fixing portion61provided on the first frame31, a second fixing portion62provided on the second frame41, and a fixed member63that can be detachably attached to the first and second fixing portions61and62. Additionally, the relative displacement suppression mechanism60has a first state where the fixed member63is fixed to both the first fixing portion61and the second fixing portion62, as illustrated inFIGS.27A and27B, and, as a second state where the fixed member63is fixed to either the first fixing portion61or the second fixing portion62, for example, a second state where the fixed member63is fixed to the second fixing portion62, as illustrated inFIGS.28A and28B. The first fixing portion61and the second fixing portion62include guide rails61aand62aextending in the Z direction. Each of the guide rails61aand62ais arranged in a straight line by connecting the first frame31to the second frame41. The fixed member63includes a sliding piece63athat slides on the respective guide rails61aand62aof the first and second fixing portions61and62. The fixed member63moves over the first and second fixing portions61and62as the sliding piece63aslides on the guide rails61aand62a. The fixed member63is slidably held by the second fixing portion62by inserting the sliding piece63ainto the guide rail62afrom an end portion of either one of the first fixing portion61or the second fixing portion62. In this third embodiment, as illustrated inFIGS.28A and28B, the sliding piece63aof the fixed member63is inserted into the guide rail62aof the second fixing portion62from an end portion of the second fixing portion62opposite to the first fixing portion61side to hold the fixed member63by the second fixing portion62. The fixed member63is further moved upward from the above state, and the sliding piece63aof the fixed member63is inserted into the guide rail61aof the first fixing portion61to hold the fixed member63by the first and second fixing portions61and62, as illustrated inFIGS.27A and27B. As illustrated inFIGS.27B and28B, the sliding piece63aincludes an engaging projection portion63a1that engages end portions61a1and62a1of the guide rails61aand62a. Then, as illustrated inFIG.27B, the relative displacement suppression mechanism60maintains the first state where the fixed member63is fixed to both the first and second fixing portions61and62when the engaging projection portion63a1of the sliding piece63aengages the end portion61a1of the guide rail61aof the first fixing portion61. Additionally, as illustrated inFIG.28B, the relative displacement suppression mechanism60maintains the second state where the fixed member63is fixed to the second fixing portion62when the engaging projection portion63a1of the sliding piece63aengages the end portion62a1of the guide rail62aof the second fixing portion62. Note that, contrary to this third embodiment, when the sliding piece63aof the fixed member63is inserted into the guide rail61aof the first fixing portion61from an end portion of the first fixing portion61opposite to the second fixing portion62side to hold the fixed member63by the first fixing portion61, the engaging projection portion63a1of the sliding piece63ais caused to engage the end portion of the guide rail61aof the first fixing portion61to maintain the second state where the fixed member63is fixed to the first fixing portion61. As illustrated inFIGS.27A and27B, the relative displacement suppression mechanism60can suppress the relative displacement between the first and second frames31and41in the X direction by bringing the fixed member63into a state (first state) where it is held on the first and second fixing portions61and62. Then, as illustrated inFIGS.28A and28B, the relative displacement suppression mechanism60can release the suppression of the relative displacement between the first and second frames31and41in the X direction by bringing the fixed member63into a state (second state) where it is held only by the second fixing portion62. In other words, the relative displacement suppression mechanism60can suppress and release the relative displacement between the connected first and second frames31and41without using tools (in a tool-less manner). Thus, even in the relative displacement suppression mechanism60of this third embodiment, replacement of components such as the electric coil23(electric component) in the main body frame30can be facilitated, as in the above first embodiment. In addition, this relative displacement suppression mechanism60is configured so that the fixed member63is fixed to each of the first and second fixing portions61and62by moving the fixed member63from the second fixing portion62side to the first fixing portion61side. Accordingly, even in the relative displacement suppression mechanism60of this third embodiment, the relative displacement between the connected first and second frames31and41in each of the X, Y, and Z directions can be suppressed. Additionally, since this relative displacement suppression mechanism60can suppress the relative displacement between the connected first and second frames31and41, there can be provided a more reliable electromagnetic contactor1B. While the present invention has been described in detail based on the above embodiments, the present invention is not limited to the above embodiments, and it is obvious that various modifications can be made without departing from the gist thereof. REFERENCE SIGNS LIST 1: Electromagnetic contactor10: Contact unit11,12: Fixed contact element13: Movable contact element14: Movable contact support20: Electromagnet unit21: Fixed iron core22: Movable iron core23: Electromagnetic coil24: Winding25: Bobbin26: Return spring30: Main body frame30a: Housing section31: First frame31a,31b,31c,31d: Side wall31e: Bottom wall41: Second frame41a,41b,41c,41d: Side wall43: Mounting plate portion50: Snap-fit mechanism51: Flexible protruding plate portion51a: First inclined surface52: Fitting hole portion53: Hook portion55: Fitting projection portion55a: Second inclined surface56: Third inclined surface60: Relative displacement suppression mechanism61: First fixing portion61a: Guide rail61a1: End portion62: Second fixing portion62a: Guide rail62a1: End portion63: Fixed member63a: Sliding piece63a1: Engaging projection portion70: Positioning mechanism71: Flexible positioning plate portion80: Relative displacement suppression mechanism81: First fixing portion82: First piece insertion portion83: First arm insertion portion84: Second engaged portion85: Second fixing portion86: Second piece insertion portion87: Second arm insertion portion88: First engaged portion90: Fixed member (fixed piece)91: Member main body91a: Upper wall (top plate portion)91b: Back wall91c: Side wall92: Insertion piece93: Flexible arm93a: First engaging projection portion93b: Second engaging projection portion95: Positioning projection portion96: Stopper portion97: Guide recessed portion | 91,056 |
11862425 | DESCRIPTION OF THE EMBODIMENTS According to at least one embodiment, excellent waterproofness can be provided. The inventors have made earnest investigations such that excellent waterproofness can be obtained. As a result of the investigations, the inventors have found that placing a switch into a housing while pressing the switch against the bottom surface of the housing is effective in improving waterproofness. However, the inventors have also found that, if the entire bottom surface of the switch contacts the bottom surface of the housing, water entering the housing may be unable to be discharged, and thus, it may be difficult to obtain desired waterproofness. The present invention is made based on such new findings. In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the specification and the drawings, elements having substantially the same functions or configurations are denoted by the same reference numerals, and the description thereof will not be repeated. In the present disclosure, an X1-X2 direction, a Y1-Y2 direction, and a Z1-Z2 direction are perpendicular to each other. Further, a plane including the X1-X2 direction and the Y1-Y2 direction is referred to as an XY-plane, a plane including the Y1-Y2 direction and the Z1-Z2 direction is referred to as a YZ-plane, and a plane including the Z1-Z2 direction and the X1-X2 direction is referred to as a ZX-plane. For convenience, the Z1-Z2 direction is the vertical direction. A plan view means that an object is viewed from the Z1 side. First Embodiment A first embodiment will be described first. The first embodiment relates to a switch device.FIG.1andFIG.2are perspective views illustrating a configuration of the switch device100according to the first embodiment.FIG.3is an exploded perspective view illustrating the configuration of the switch device100according to the first embodiment. The switch device100according to the first embodiment is a vehicle switch device. The switch device100switches between an on-state and an off-state in accordance with the movement of an object present in a vehicle. Accordingly, the switch device100can detect the current state of the object. The switch device100is waterproof, and is suitable for use outside the vehicle. For example, the switch device100can be used as an opening and closing detection device configured to detect the open/close state of a vehicle's hood, door, trunk, or the like. As illustrated inFIG.1throughFIG.3, the switch device100includes a housing110, a switch structure160, and a lever140. FIG.4is a top view illustrating a configuration of the housing110.FIG.5andFIG.6are perspective cross-sectional views illustrating the configuration of the housing110. The housing110is a molded part formed of a rigid insulating material (such as a resin). The switch structure160is housed in the housing110, and the lever140is attached to the housing110. The housing110is a container having an opening at the top, and the switch structure160is housed in the housing110through the opening. The housing110has a first bottom surface111and a second bottom surface112at the bottom of the housing110. The second bottom surface112is provided around the first bottom surface111in plan, view, and the first bottom surface111is deeper than the second bottom surface112. That is, an outer edge112A of the second bottom surface112is located outward relative to an outer edge111A of the first bottom surface111. Therefore, there is a step between the first bottom surface111and the second bottom surface112. The first bottom surface111has an opening114A and an opening114B. A lead wire150A passes through the opening114A, and a lead wire150B passes through the opening114B. An annular raised portion115A is formed around the opening114A and an annular raised portion115B is formed around the opening114B. Three or more, in this example, five dome-shaped projections113are formed on the second bottom surface112. For example, at least three projections113of the three or more projections113are not on the same straight line. The projections113project to the Z1 side, that is, the side opposite to the first bottom surface111side (Z2 side). The projections113are parts of the second bottom surface112. The housing110has a side plate116AB and a side plate116CD parallel to the ZX plane. A fitting hole118A and a fitting hole118B are formed in the side plate116AB. Further, an inclined surface117A and an inclined surface117B are formed on a surface, facing the side plate116CD, of the side plate116AB. The inclined surface117A is located above the fitting hole118A, and the inclined surface117B is located above the fitting hole118B. The inclined surface117A and the inclined surface117B are inclined away from the side plate116CD as the inclined surface117A and the inclined surface117B approach the upper end of the side plate116AB. A fitting hole118C and a fitting hole118D are formed in the side plate116CD. Further, an inclined surface117C and an inclined surface117D are formed on a surface, facing the side plate116AB, of the side plate116CD. The inclined surface117C is located above the fitting hole118C, and the inclined surface117D is located above the fitting hole118D. The inclined surface117C and the inclined surface117D are inclined away from the side plate116AB as the inclined surface117C and the inclined surface117D approach the upper end of the side plate116CD. The side plate116AB and the side plate116CD are flexible and can be curved in the thickness direction (Y1-Y2 direction) of the side plate116AB and the side plate116CD. FIG.7is a perspective view illustrating a configuration of the switch structure160.FIG.8AandFIG.8Bare perspective views illustrating a configuration of a switch120.FIG.9is a perspective view illustrating the relationship between the switch120and the lead wires150A and150B.FIG.10is a bottom view illustrating the relationship between the housing110and the lead wires150A and150B. As described above, the switch structure160is housed in the housing110. The switch structure160includes the switch120, a sealing member130, the lead wire150A, and the lead wire150B. The switch120includes a case120A, a button121, a wafer123, a terminal122A, and a terminal122B. The case120A has a substantially rectangular shape having two flat surfaces parallel to the ZX plane and two flat surfaces parallel to the YZ plane. Of the two flat surfaces parallel to the ZX plane, a boss124A and a boss124B are formed on the flat surface on the Y2 side of the case120A, and a boss124C and a boss124D are formed on the flat surface on the Y1 side of the case120A. The boss124A is fitted into the fitting hole118A, the boss124B is fitted into the fitting hole118B, the boss124C is fitted into the fitting hole118C, and the boss124D is fitted into the fitting hole118D. The boss124A through the boss124D are an example of a fitting projection. The terminal122A and the terminal122B are flat plate-shaped members that project from the bottom surface of the case120A. The lead wire150A is electrically and physically connected to the terminal122A, and the lead wire150B is electrically and physically connected to the terminal122B. For example, the lead wire150A and the lead wire150B are respectively connected to the terminal122A and the terminal122B with solder. The lead wire150A and the lead wire150B may be respectively fixed to the terminal122A and the terminal122B by welding. The terminal122A and the terminal122B are formed of an electrically conductive rigid material (such as a metallic material). The button121is a member that projects from the top surface of the case120A of the switch120and can be pressed such that the switch120switches between an on-state and an off-state. For example, upon the button121being pressed, the switch120switches the state to the on-state (that is, the terminal122A is electrically connected to the terminal122B). Upon the button121being released, the switch120switches the state to the off-state (that is, the terminal122A is not electrically connected to the terminal122B). The wafer123is provided on the bottom surface of the case120A, and supports the terminal122A and the terminal122B in an upright position. Each of the case120A and the wafer123is a molded part formed of a rigid insulating material (such as a resin). The sealing member130seals a portion of the lead wire150A fixed to the terminal122A and a portion of the lead wire150B fixed to the terminal122B. The sealing member130is elastic. For example, the sealing member130can include a hot melt adhesive. The sealing member130includes a base portion131and a protruding portion132. The shape of the base portion131in the XY plane conforms to the shape of the case120A in the XY plane, and the protruding portion132protrudes downward (to the Z2 side) from the center of the bottom surface of the base portion131along the lead wire150A and the lead wire150B. The base portion131has a substantially rectangular shape. Basically, the protruding portion132is housed in a space formed by the step between the first bottom surface111and the second bottom surface112. The base portion131and the case120A are housed in a space above the second bottom surface112. The opening114A is wider than the outer periphery of the lead wire150A, and the opening114B is wider than the outer periphery of the lead wire150B. Therefore, a gap151A is provided between the opening114A and the lead wire150A, and a gap151B is provided between the opening114B and the lead wire150B. The lever140is a member formed of a metallic material having a thin plate shape. The lever140extends over the button121of the switch120, and one end of the lever140is supported by the housing110. Upon the other end of the lever140being pressed down from the outside, the button121of the switch120can be pressed down. Note that the lever140can be shaped according to the vehicle mode, the object to be detected, and the like. In the following, a method for placing the switch structure160into the housing110will be described. When the switch structure160is placed into the housing110, first, the lead wire150A is inserted into the opening114A, and the lead wire150B is inserted into the opening114B. Next, the boss124A is brought into contact with the inclined surface117A, the boss124B is brought into contact with the inclined surface117B, the boss124C is brought into contact with the inclined surface117C, and the boss124D is brought into contact with the inclined surface117D. In this state, the switch structure160is pushed further into the housing110. As a result, the bosses124A through124D move down along the inclined surfaces117A through117D, and the side plate116AB and the side plate116CD deflect outward. Upon the switch structure160being pushed further into the housing110, the sealing member130abuts the projections113. Because the sealing member130is elastic, the sealing member130is compressed in the Z1-Z2 direction. In this state, upon the switch structure160being pushed further into the housing110, the boss124A is fitted into the fitting hole118A, the boss124B is fitted into the fitting hole118B, the boss124C is fitted into the fitting hole118C, and the boss124D is fitted into the fitting hole118D. As a result, the outward pressure exerted on the side plate116AB and the side plate116CD by the bosses124A through124D is released, and the switch120is snap-fitted into the housing110. When pressing the switch structure160is stopped, the sealing member130compressed in the Z1-Z2 direction attempts to return to the original shape. However, because the bosses124A through124D are fitted into the fitting holes118A through118D, the sealing member130remains compressed. Accordingly, the sealing member130adheres firmly to the wafer123of the switch120. FIG.11is a perspective cross-sectional view illustrating the relationship between the sealing member130and the housing110into which the switch120is snap-fitted.FIG.12is a front cross-sectional view illustrating the relationship between the sealing member130and the housing110into which the switch120is snap-fitted. As illustrated inFIG.11andFIG.12, the bottom surface of the base portion131abuts the projections113provided on the second bottom surface112, and portions, abutting the projections113, of the base portion131are recessed. That is, the sealing member130is compressed in the Z1-Z2 direction between the switch120and the second bottom surface112. Further, the vicinities of the portions, pushed up by the projections113, of the bottom surface of the base portion131are spaced apart from the second bottom surface112. Thus, a second space162is provided between the second bottom surface112and the bottom surface of the base portion131. In addition, the upper surfaces of the raised portion115A and the raised portion115B are spaced apart from the bottom surface of the protruding portion132. Thus, a first space161is provided between the upper surfaces of the raised portions115A and115B and the bottom surface of the protruding portion132. Note that the second bottom surface112may have a drain passage such as a groove connecting the outer edge and the inner edge of the second bottom surface112in plan view. A space in such a drain passage may also function as the second space. Further, the first bottom surface111may have a drain passage such as a groove leading to the opening114A or the opening114B. A space in such a drain passage may also function as the first space. Further, in addition to the opening114A and the opening114B, an opening for drainage may be formed in the first bottom surface111. As described above, in the switch device100according to the first embodiment, the opening114A through which the lead wire150A passes and the opening114B through which the lead wire150B passes are formed in the first bottom surface111, and the sealing member130abuts the second bottom surface112. Further, the second bottom surface112is located closer to the switch120than the first bottom surface111. With this configuration, even if water enters the housing110, the water can be discharged from the first bottom surface111, through the gap151A between the opening114A and the lead wire150A and the gap151B between the opening114B and the lead wire150B, to the outside. Further, on the outside of the housing110, the lead wire150A and the lead wire150B are subjected to tensile loads in various directions. However, the adhesion between the sealing member130and the lead wires150A and150B can be well maintained, and the adhesion between the sealing member130and the switch120can also be well maintained. For example, if the lead wire150A and the lead wire150B are subjected to a tensile load in the Z2 direction, the switch120causes the sealing member130to be compressed against the second bottom surface112because the lead wire150A and the lead wire150B are fixed to the terminal122A and the terminal122B with solder or the like. Therefore, as the fixed portions are reinforced with solder or the like, the lead wire150A and the lead wire150B are not readily removed from the sealing member130, and the sealing member130is not readily removed from the switch120. Further, if the lead wire150A and the lead wire150B are subjected to a tensile load in a given direction in the XY plane, this tensile load is converted into a tensile load in the Z2 direction within the opening114A and the opening114B. Therefore, similar to the above case where the lead wire150A and the lead wire150B are subjected to the tensile load in the Z2 direction, because the fixed portions are reinforced with solder or the like, the lead wire150A and the lead wire150B are not readily removed from the sealing member130, and the sealing member130is not readily removed from the switch120. Accordingly, it is possible to improve the strength against tensile loads in various directions while maintaining waterproofness. Further, in plan view, the second bottom surface112is provided around the first bottom surface111, and the outer edge112A of the second bottom surface112is located outward relative to the outer edge111A of the first bottom surface111. Accordingly, the switch structure160can be readily placed into the housing110from above the housing110. Further, because the first space161is provided between the sealing member130and the first bottom surface111, water entering the housing110can be securely discharged to the outside. Further, the first bottom surface111may have a drain passage leading to a space outside the housing110. Accordingly, water entering the housing110can be securely discharged to the outside through the drain passage. Further, the sealing member130is elastic, and the switch120is snap-fitted into the housing110with the sealing member130being compressed between the switch120and the second bottom surface112. Accordingly, the sealing member130adheres firmly to the switch120. Therefore, even if a tensile load is applied to the lead wire150A and the lead wire150B, the sealing member130is highly unlikely to be removed from the switch120, thus providing excellent waterproofness. Further, the housing110has the side plate116AB and the side plate116CD. The side plate116AB and the side plate116CD contact the side surfaces of the switch120, the side plate116AB has the fitting hole118A and the fitting hole118B, and the side plate116CD has the fitting hole118C and the fitting hole118D. The switch120has the bosses124A through124D on the side surfaces of the switch120, and the bosses124A through124D are fitted into the fitting holes118A through118D. With this configuration, the switch120can be more securely snap-fitted into the housing110. Further, the second space162is provided between the second bottom surface112and the sealing member130. Accordingly, water entering the housing110can be readily discharged from the second bottom surface112toward the first bottom surface111. Further, the second bottom surface112has the projections113that project to the side (Z1 side) opposite to the first bottom surface111side (Z2 side), and the sealing member130abuts the projections113. Accordingly, the second space162can be secured between the second bottom surface112and the sealing member130. In addition, the projections113push the sealing member130up, thus improving the adhesion strength between the sealing member130and the switch120. Second Embodiment Next, a second embodiment will be described. The second embodiment relates to an opening and closing detection device that includes the switch device100.FIG.13is a perspective view of the exterior of an opening and closing detection device200(when the hood of a vehicle is open) according to the second embodiment.FIG.14is a perspective view of the exterior of the opening and closing detection device200(when the hood of the vehicle is closed) according to the second embodiment. The opening and closing detection device200according to the second embodiment is configured to detect the open/close state of the hood of the vehicle. As illustrated inFIG.13, the opening and closing detection device200includes the switch device100according to the first embodiment, a base plate210, and a cam plate220. The base plate210is a member formed of a metallic material having a thin plate shape. The base plate210fixes the switch device100to the vicinity of the hood of the vehicle. In addition, the base plate210rotatably supports the cam plate220. The base plate210can be shaped according to the vehicle model, the installation position, and the like. That is, the opening and closing detection device200according to the present embodiment can be applied to any of a plurality of vehicle models and used at any of a plurality of installation positions by appropriately changing the shape of the base plate210. The base plate210is an example of a fixing member. The cam plate220is a member formed of a metallic material having a thin plate shape. A shaft220A of the cam plate220is supported by the base plate210. Therefore, the cam plate220is rotatable about the shaft220A. The cam plate220includes a U-shaped lever222capable of engaging a striker300of the hood. Therefore, the cam plate220is rotatable upon the lever222being moved by the striker300at the time of opening or closing of the hood. The cam plate220further includes a cam portion221that projects radially relative to the other portions of the cam plate220. The cam portion221presses the lever140of the switch device100down as the cam plate220rotates. With this configuration, the cam plate220can convert an opening and closing movement of the hood into a switching movement of the switch120of the switch device100. The cam plate220is an example of a conversion member. As illustrated inFIG.13, when the hood is closed, the lever222of the cam plate220engages the striker300of the hood. Thus, the cam plate220is maintained at a predetermined angle of rotation. In this state, the cam portion221of the cam plate220is in a position where the cam portion221does not press the lever140of the switch device100down. Accordingly, the switch device100is in the off-position. Conversely, as illustrated inFIG.14, when the hood is open, the striker300of the hood is pulled up, thus causing the lever222of the cam plate220to be pulled up. As a result, the cam plate220rotates clockwise about the shaft220A, and the cam portion221of the cam plate220presses the lever140of the switch device100down. Accordingly, the switch device100is in the on-position. Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the particulars of the above-described embodiments. Variations and replacements may be applied to the above-described embodiments without departing from the scope of the present invention. Further, in the above-described embodiments, the switch device according to the present invention is applied to the opening and closing detection device200configured to detect the open/close state of the hood of the vehicle; however, the present invention is not limited thereto. For example, the switch device according to the present invention may be applied to any other detection device configured to detect the state of a door (such as a trunk) other than the hood of the vehicle. Further, the switch device according to the present invention is not necessarily applied to the vehicle, and may be applied to any other device (such as an aircraft, a ship, an industrial machine, or a home appliance). Further, for example, in the switch device100according to the above-described embodiments, the lever140is not necessarily provided depending on a device to which the switch device100is applied (that is, the button121of the switch120may be directly pressed from the outside). Further, for example, in the switch device100according to the above-described embodiments, a switch including three or more terminals may be used instead of the switch120including the two terminals, and the number of lead wires may be changed accordingly. Further, for example, in the switch device100according to the above-described embodiments, any other type of switch (such as a toggle switch or a rocker switch) may be used instead of the switch120(push button switch). | 23,361 |
11862426 | DESCRIPTION This disclosure is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article1, Section8). The present disclosure provides electron source devices, electron source assemblies, and/or methods for generating electrons. The generated electrons can be used to facilitate spectroscopy, such as mass spectrometry, including mass selection or ion mobility. The present disclosure will be described with reference toFIGS.1-5. Referring first toFIG.1, a block diagram of an analytical instrument10is shown. Analytical instrument10includes a sample preparation ionization section14configured to receive a sample12and convey a prepared and/or ionized sample to an analyzer16. Instrument10can be configured as a mass spectrometer or an ion mobility spectrometer and analyzer16can be configured to separate ionized samples for detection by detector18. Analyzer16can be a mass filter, mass separator or an ion mobility separator. In combination with the devices, assemblies, and/or methods of the present disclosure, mass selective detection or ion mobility mass spectrometry may be utilized. As depicted inFIG.1, a sample12can be introduced into section14. For purposes of this disclosure, sample12represents any chemical composition including both inorganic and organic substances in solid, liquid and/or vapor form. Specific examples of sample12suitable for analysis include volatile compounds, such as toluene, or the specific examples include highly-complex non-volatile protein based structures, such as bradykinin. In certain aspects, sample12can be a mixture containing more than one substance or in other aspects, sample12can be a substantially pure substance. Analysis of sample12can be performed according to exemplary aspects described below. Sample preparation ionization section14can include an inlet system (not shown) and an ion source device. The inlet system can introduce an amount of sample12into instrument10. Depending upon sample12, the inlet system may be configured to prepare sample12for ionization. Types of inlet systems can include batch inlets, direct probe inlets, chromatographic inlets, and permeable or capillary membrane inlets. The inlet system may be configured to prepare sample12for analysis in the gas, liquid and/or solid phase. In some aspects, the inlet system may be combined with the ion source device. The ion source device can be configured to receive sample12and convert components of sample12into analyte ions by exposing the sample to electrons generated by the ion source device. This conversion can include the bombardment of components of sample12with the electrons. The ion source device may provide, for example, electron ionization (EI, typically suitable for the gas phase ionization). Referring next toFIG.2, an electron source device22according to an embodiment of the disclosure can include a cathode member24. Cathode member24can be constructed of conductive material such as stainless steel, aluminum, gold, copper, and/or beryllium-copper alloys. In accordance with the implementation ofFIG.2, cathode member24can define a fluid conduit25and this fluid conduit can extend the length of cathode member24. Fluid conduit25can extend along longitudinal axis28, for example, and thereby be operatively aligned anode member26. Anode member26can be constructed of material such as stainless steel, aluminum, gold, copper, and/or beryllium-copper alloys; and can define another fluid conduit27and this fluid conduit can extend the length of anode member26. Fluid conduit27can also extend along longitudinal axis28to operatively align with cathode member24. A pressure differential30can extend between members24and26, with the pressure within conduit27being lower than the pressure within conduit25, thus facilitating fluid flow between member24and26. In accordance with example implementations, this pressure differential can be facilitated by providing a fluid source to conduit25. The fluid source can be an inert gas such as helium for example, but other gases such as air, nitrogen, and/or carbon dioxide may be utilized. In accordance with other implementations, a vacuum may be provided to conduit27, perhaps as part of the analysis portion of the instrument. The vacuum can facilitate the flow of fluid operatively connected with conduit25. Referring next toFIG.3, an assembly32within an electron source device is depicted. Assembly32may be used as part of the device ofFIG.2, for example. Assembly32can include a cathode member34. Cathode member34may be considered a hollow cathode for example, or may be configured as cathode member24. As part of an electron source device, cathode member34can be operatively aligned with an anode member (not shown). Cathode member34can extend along a longitudinal axis38with axis38defining a center of member34in at least one cross section. Assembly32can also include a lens36that is conductively associated with member34. For example, member34and lens36can form a portion of the cathode of the electron source device. Lens36can be constructed of conductive material such as stainless steel, aluminum, gold, copper, and/or beryllium-copper alloys. Lens36can define at least one opening40that is offset from the center of member34. In accordance with example implementations, lens36can define additional openings that are offset from the center of member34, such as an opposing opening or an opening across from the center of member34. Cathode member34can define sidewalls35for example. One or more of the openings within lens36can be associated with one or more of these sidewalls. For example, a center axis42of opening40can be aligned between axis38and sidewall35for example. In accordance with example implementations, during operation, electrons emanating from sidewalls35can be effectively directed to opening40associated with the sidewall. Referring next toFIG.4, assembly43of an electron source is depicted. Assembly43can include cathode member44. As depicted in this Figure, member44can be a flat or stub cathode, however, hollow or cathode member24may be utilized as well. Cathode member44can be aligned along a longitudinal axis52and in accordance with at least one implementation, axis52can represent a center of member24. Member44can be operatively aligned along this axis with anode46defining opening58defined therein. A pair of lens48and50can be conductively associated with cathode member44and may form part of the cathode sharing the conductivity of same. Lens48defines at least one opening54offset from the center defined by axis52and lens50defines an opening56at the center. This alignment can provide a tortured path for electrons emanating from cathode member44. With regard to lens48, additional openings can be defined, and in accordance with some implementations, these openings may be associated with cathode sidewalls when utilized. Referring next toFIG.5, an exploded view of an electron source device60is shown. Device60includes a cathode assembly62operatively associated along longitudinal axis68with anode assembly64with insulators66and70operatively engaged therewith. Cathode assembly62can include cathode member having a conduit therethrough along axis68conductively engaged with lens74and76. Lens74can define openings offset from the center defined by axis68in at least one cross section, and lens76can include at least one opening aligned on the center. A spacer ring78can be provided between lens74and76for example and this ring can be constructed of Viton (is a brand of synthetic rubber and fluoropolymer elastomer commonly used in O-rings. The name is a registered trademark of The Chemours Company. Viton fluoroelastomers are categorized under the ASTM D1418 and ISO 1629 designation of FKM), for example. To provide pressure differential80, fluid such as helium may be provided via fluid source82. Anode assembly64can include a flow limiting lens84conductively associated with anode member86. Viton O-rings78can be utilized to separate anode assembly64from insulator66. In accordance with example configurations, a pressure of less than 1 torr can be maintained within the conduit of the cathode assembly when providing electrons to a sample to prepare analytes. Analytes prepared by exposing sample to electrons from the devices of the present disclosure can proceed to analyzer16. Analyzer16can include an ion transport gate (not shown), and a mass separator (not shown). The ion transport gate can be configured to gate the analyte beam of ions generated by the ion source. The ion transport gate can be configured to gate positive or negative analyte ions as generated from the ion source. Analyzer16can be any of those described in U.S. Pat. No. 7,582,867 issued Sep. 1, 2009, the entirety of which is incorporated by reference herein. Analytes may proceed to detector18. Exemplary detectors include electron multipliers, Faraday cup collectors, photographic and stimulation-type detectors. The detector can be configured as described herein with positive or negative voltages. The progression of analysis from sample preparation and ionization14through analyzer16and to detector18can be controlled and monitored by a processing and control unit20. Unit20can be configured to provide the specific configurations of the ion source device, the ion transporter, the analyzer and the detector as described herein. These configurations can include the specific polarity of voltages applied to each component. Acquisition and generation of data according to the present disclosure can be facilitated with processing and control unit20. Processing and control unit20can be a computer or mini-computer that is capable of controlling the various elements of instrument10. This control includes the specific application voltages and may further include determining, storing and ultimately displaying mass spectra. Processing and control unit20can contain data acquisition and searching software. In one aspect, such data acquisition and searching software can be configured to perform data acquisition and searching that includes the programmed acquisition of the total analyte count. In another aspect, data acquisition and searching parameters can include methods for correlating the amount of analytes generated to predetermined programs for acquiring data. In compliance with the statute, embodiments of the invention have been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the entire invention is not limited to the specific features and/or embodiments shown and/or described, since the disclosed embodiments comprise forms of putting the invention into effect. | 10,778 |
11862427 | DESCRIPTION OF EMBODIMENTS Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise represented. The implementations set forth in the following description of exemplary embodiments do not represent all implementations consistent with the invention. Instead, they are merely examples of apparatuses and methods consistent with aspects related to the subject matter as recited in the appended claims. Embodiments of the present disclosure provide a detector having an array architecture. The detector may enable field reconfiguration of sensing elements included on an array surface of the detector. The detector may comprise switching elements, such as elements configured to connect pairs of sensing elements. Switching elements can control an electrical connection between the two sensing elements of the pair. Switching elements may comprise switches. Switches configured to connect two sensing elements can be formed in a switch matrix adjacent a sensing layer of a detector array, where the sensing layer contains the sensing elements. The switch matrix may be configured as an application specific integrated circuit (ASIC) composed of electrical components fabricated with standard device processes. Switches need not be embedded in the sensing layer. Thus, manufacturing of a detector array may be simplified. Switching elements may comprise any of electrically operated switches. For example, a switch may comprise a relay, a transistor, an analog switch, a solid-state relay, or semiconductor devices capable of connecting or disconnected an electrical circuit. A switch may have an element for operating the switch that is controlled by logical elements. The sensing elements can form an arbitrary number of groups with arbitrary shapes and an arbitrary number of sensing elements in each group. A control circuit for each switch may be located beside each corresponding switch. The control circuit may comprise logical elements. The switch between pairs of sensing elements can be addressed by row control and/or line control wires. The control circuit and the switches may be contained in a common circuit die. An array of sensing elements can be formed as a sensor layer in a substrate. The control circuit may be formed as a circuit layer in a substrate. The switching elements may be formed in the circuit layer. Alternatively, the switching elements may be formed as a separate layer sandwiched between the sensing layer and the circuit layer. In an arrangement consistent with aspects of the present disclosure, interconnections in the circuit layer can be simplified. Output signal of each group of sensing elements can be routed through multiple output wires connected to the group. The output wires, together with connections between sensing elements formed by the switches in the group, can form a network having a low equivalent output serial resistance and serial inductance. For example, in some embodiments, a control circuit may form a network that has reduced equivalent output serial resistance and serial inductance compared to a conventional methods. Output impedance of grouped sensing elements can be reduced such that wide band operation is facilitated. Embodiments of the present disclosure provide an electron beam tool with an electron detector. A circuit layer may be provided which is coupled with the electron detector. The electron detector can be configured to receive backscattered primary electrons and secondary electrons emitted from a sample. The received electrons form one or more beam spots on a surface of the detector. The surface of the detector can include a plurality of electron sensing elements configured to generate electrical signals in response to receiving the electrons. In some embodiments, the circuit layer may comprise pre-processing circuitry and signal processing circuitry that are used to configure grouping of the plurality of electron sensing elements. For example, the pre-processing circuitry and signal processing circuitry can be configured to generate indications related to the magnitude of the generated electrical signals. Such circuitry may comprise logic blocks, such as a gate associated with two sensing elements of the plurality of sensing elements. The gate may be configured to determine a connection state based on signals generated from the sensing elements. The gate may be controlled such that the two sensing elements are electrically connected or disconnected via the switching element configured to connect the two sensing elements. Electrical signals generated from the sensing elements may be configured to pass through the switching element. Determinations may be made based on electrical signals from the sensing elements. Post-processing circuitry may be configured to interact with a controller configured to acquire an image of beams or beamlets based on the output of the sensing elements. The controller may reconstruct an image of the beam. The controller may be configured to determine beam boundaries based on the reconstructed image, for example primary and secondary boundaries of a beam spot. Further implementations of post-processing circuitry may comprise one or more circuits that can be configured to determine, based on generated indications from the pre-processing circuitry, which of the electron sensing elements lie within a boundary of a beam spot, for example a primary boundary. Processing may be carried out to generate a value representing the intensity of a beam spot based on the determined primary boundary. In some embodiments, a grouping can be used to determine which of the electron sensing elements lie outside the primary boundary of the beam spot. Noise signals may be estimated based on the output of sensing elements determined to be outside the primary boundary. Post-processing circuitry can compensate for the estimated noise signals when generating the intensity data of the beam spot. Grouping of sensing elements may be based on electrical signals generated by the sensing elements in response to being hit by electrons of an electron beam. Grouping may be based on electrical signals passing through the switching element configured to connect neighboring sensing elements. Grouping may also be based on determinations by post-processing circuitry. For example, in some embodiments, primary and/or secondary beam spot boundaries may be determined based on output signals of the sensing elements. Local control logic associated with a pixel may generate an indication of the signal level of the corresponding sensing element. This indication can be used to determine whether two adjacent sensing elements should be connected by the switching element. In this manner, groups can be formed. Based on the formed groups of sensing elements, a primary boundary can be determined. Furthermore, in some embodiments, gradient information can be obtained and used to determine a secondary boundary. Electrons of an incident electron beam may have different properties, e.g., different energy due to different generation processes. Distribution or concentrations of electrons with different properties may vary at different locations. Thus, within an electron beam, an intensity pattern in the detected electron beam spot may correspond to primary or secondary boundaries. Primary and secondary beam spot boundaries can be used to group output signals of corresponding electron sensing elements. The groups can be formed so that their geometrical arrangement matches the pattern of the corresponding electron beam spot. As an example, a portion of the electron beam spot detected by electron sensing elements within the secondary beam boundary may consist almost entirely of backscattered electrons while a portion of the electron beam spot detected by electron sensing elements between the primary and secondary beam boundaries may consist almost entirely of secondary electrons. The formed groups can therefore yield intensity information of the entire detected beam and also the intensity information corresponding to the backscattered and secondary electron portions of the electron beam. Accordingly, some embodiments can provide information about the detected electron beam spots and properties of the sample under investigation. Reference will now be made in detail to the example embodiments, which are illustrated in the accompanying drawings. Although the following embodiments are described in the context of utilizing electron beams, the disclosure is not so limited. Other types of charged particle beams can be similarly applied. Furthermore, detectors consistent with aspects of the present disclosure are applicable in environments for sensing x-rays, photons, and other forms of energy. Reference is now made toFIG.1, which illustrates an exemplary electron beam inspection (EBI) system100consistent with embodiments of the present disclosure. As shown inFIG.1, EBI system100includes a main chamber101a load/lock chamber102, an electron beam tool104, and an equipment front end module (EFEM)106. Electron beam tool104is located within main chamber101. EFEM106includes a first loading port106aand a second loading port106b. EFEM106may include additional loading port(s). First loading port106aand second loading port106breceive wafer front opening unified pods (FOUPs) that contain wafers (e.g., semiconductor wafers or wafers made of other material(s)) or samples to be inspected (wafers and samples are collectively referred to as “wafers” hereafter). One or more robot arms (not shown) in EFEM106may transport the wafers to load/lock chamber102. Load/lock chamber102is connected to a load/lock vacuum pump system (not shown) which removes gas molecules in load/lock chamber102to reach a first pressure below the atmospheric pressure. After reaching the first pressure, one or more robot arms (not shown) may transport the wafer from load/lock chamber102to main chamber101. Main chamber101is connected to a main chamber vacuum pump system (not shown) which removes gas molecules in main chamber101to reach a second pressure below the first pressure. After reaching the second pressure, the wafer is subject to inspection by electron beam tool104. Electron beam tool104may be a single-beam system or a multi-beam system. A controller109is electronically connected to the electron beam tool104. The controller109may be a computer configured to execute various controls of the EBI system. Reference is now made toFIG.2, which illustrates an electron beam tool104(also referred to herein as apparatus104) that may be configured for use in a multi-beam image (MBI) system. Electron beam tool104comprises an electron source202, a gun aperture204, a condenser lens206, a primary electron beam210emitted from electron source202, a source conversion unit212, a plurality of beamlets214,216, and218of primary electron beam210, a primary projection optical system220, a wafer stage (not shown inFIG.2), multiple secondary electron beams236,238, and240, a secondary optical system242, and an electron detection device244. Primary projection optical system220can comprise a beam separator222, deflection scanning unit226, and objective lens228. Electron detection device244can comprise detection sub-regions246,248, and250. Electron source202, gun aperture204, condenser lens206, source conversion unit212, beam separator222, deflection scanning unit226, and objective lens228can be aligned with a primary optical axis260of apparatus104. Secondary optical system242and electron detection device244can be aligned with a secondary optical axis252of apparatus104. Electron source202can comprise a cathode, an extractor or an anode, wherein primary electrons can be emitted from the cathode and extracted or accelerated to form a primary electron beam210with a crossover (virtual or real)208. Primary electron beam210can be visualized as being emitted from crossover208. Gun aperture204can block off peripheral electrons of primary electron beam210to reduce Coulomb effect. The Coulomb effect can cause an increase in size of probe spots270,272, and274. Source conversion unit212can comprise an array of image-forming elements (not shown inFIG.2) and an array of beam-limit apertures (not shown inFIG.2). The array of image-forming elements can comprise an array of micro-deflectors or micro-lenses. The array of image-forming elements can form a plurality of parallel images (virtual or real) of crossover208with a plurality of beamlets214,216, and218of primary electron beam210. The array of beam-limit apertures can limit the plurality of beamlets214,216, and218. Condenser lens206can focus primary electron beam210. The electric currents of beamlets214,216, and218downstream of source conversion unit212can be varied by adjusting the focusing power of condenser lens206or by changing the radial sizes of the corresponding beam-limit apertures within the array of beam-limit apertures. Objective lens228can focus beamlets214,216, and218onto a wafer230for inspection and can form a plurality of probe spots270,272, and274on surface of wafer230. Beam separator222can be a beam separator of Wien filter type generating an electrostatic dipole field and a magnetic dipole field. In some embodiments, if they are applied, the force exerted by electrostatic dipole field on an electron of beamlets214,216, and218can be equal in magnitude and opposite in direction to the force exerted on the electron by magnetic dipole field. Beamlets214,216, and218can therefore pass straight through beam separator222with zero deflection angle. However, the total dispersion of beamlets214,216, and218generated by beam separator222can also be non-zero. Beam separator222can separate secondary electron beams236,238, and240from beamlets214,216, and218and direct secondary electron beams236,238, and240towards secondary optical system242. Deflection scanning unit226can deflect beamlets214,216, and218to scan probe spots270,272, and274over a surface area of wafer230. In response to incidence of beamlets214,216, and218at probe spots270,272, and274, secondary electron beams236,238, and240can be emitted from wafer230. Secondary electron beams236,238, and240can comprise electrons with a distribution of energies including secondary electrons (energies ≤50 eV) and backscattered electrons (energies between 50 eV and landing energies of beamlets214,216, and218). Secondary optical system242can focus secondary electron beams236,238, and240onto detection sub-regions246,248, and250of electron detection device244. Detection sub-regions246,248, and250may be configured to detect corresponding secondary electron beams236,238, and240and generate corresponding signals used to reconstruct an image of surface area of wafer230. Reference is now made toFIG.3A, which illustrates an exemplary structure of a sensor surface300that can form a detection surface of electron detection device244. Sensor surface300can be divided into four regions302A-D (2×2 rectangular grid), each region302capable of receiving a corresponding beam spot304emitted from a particular location from wafer230. All beam spots304A-D may exhibit an ideal round shape and have no loci offset. While four regions are displayed, it is appreciated that any plurality of regions could be used. Furthermore, a division of sensor surface300into four regions is arbitrary. An arbitrary selection of sensing elements306can be taken to form a particular region. Detection sub-regions246,248,250in detector244may be constituted by such regions. Each sensor region can comprise an array of electron sensing elements306. The electron sensing elements may comprise, for example, a PIN diode, avalanche diode, electron multiplier tube (EMT), etc., and combinations thereof. Moreover, it is appreciated that whileFIG.3Ashows each region302being separated from each other as predefined regions having their own sensing elements306, these predefined regions may not exist, e.g., such as surface sensor400ofFIG.3C. For example, instead of having4predefined regions each having81sensing elements (a 9×9 grid of sensing elements), a sensor surface could have one 18×18 grid of sensing elements, still capable of sensing four beam spots. Electron sensing elements306can generate a current signal commensurate with the electrons received in the sensor region. A pre-processing circuit can convert the generated current signal into a voltage signal (representing the intensity of received electron beam spot). The pre-processing circuit may comprise, for example, a high speed transimpedance amplifier. A processing system can generate an intensity signal of the electron beam spot by, for example, summing the currents generated by the electron sensing elements located within a sensor region, correlate the intensity signal with a scan path data of the primary electron beam incident on the wafer, and construct an image of the wafer based on the correlation. While electron sensing element306is described as receiving electrons from an electron beam, in the case of other types of detectors, a sensor surface may be configured to generate a signal in response to receiving other types of irradiation. For example, a detector may react to charged particles having a particular charge. Also, a detector may be sensitive to flux, spatial distribution, spectrum, or other measurable properties. Thus, a detector sensing element may be configured to generate a signal in response to receiving a certain type or level of energy, for example, electrons having a predetermined amount of energy. In some embodiments, the processing system can selectively sum the signals generated by some of the electron sensing elements306to generate an intensity value of a beam spot. The selection can be based on a determination of which of the electron sensing elements are located within the beam spot. In some embodiments, the processing system can identify which of the electron sensing elements are located outside a beam spot, and which of the electron sensing elements are located within the beam spot, by identifying a boundary of the beam spot. For example, referring toFIG.3B, the processing system can identify primary boundaries312A,312B and secondary boundaries314A,314B for beam spots304A and304B, respectively. Primary boundary312can be configured to enclose a set of electron sensing elements306of which the signal outputs are to be included to determine an intensity of the beam spot. Secondary boundary314can be configured to enclose a center portion of the beam spot, and can be used to provide certain geometric information of the beam spot. The geometric information may include, for example, a shape of the beam spot, one or more loci of the beam spot, etc. Here, the loci may refer to a predetermined location within the beam spot, such as a center. The processing system may also determine primary boundary312based on secondary boundary314. Moreover, based on the loci information, the processing system can also track a drift in the location of a beam spot304due to, for example, imperfections within the electron optics components or the electron optics system. Imperfections may be those introduced during manufacturing or assembling processes. Furthermore, there may be drift introduced during long-term operation of the system. The processing system can update the boundary determinations, and the set of electron sensing elements to be included in the intensity determination, to mitigate the effects of the drifting on the accuracy of intensity determination. Further, the processing system may track shifts in the electron beam spots. The selection of the electron sensing elements306that are used to form each set of electron sensing elements surrounded by primary or secondary boundaries312and314can be determined by a designated electron collection ratio of each beam spot, which is related to the overall image signal strength and signal to noise ratio, the signal crosstalk of the adjacent electron beams, and the corresponding shape and locus of each electron beam spot. Selection of electron sensing elements may be controlled by processing circuitry located adjacent to the sensing elements or by an external controller, for example. The formation of each set may be static or may vary dynamically. Shape and locus variation information of beam spots may be used, for example, to monitor performance of the electron optical system (e.g., primary projection optical system220). Information collected regarding the positioning and shape of the beam can be used, for example, in making adjustments to the electron optical system. Accordingly, whileFIG.3Bshows beam spot304B having a shape deviating from a round shape, such types of deviations such as location, shape, and grid information due to drift in the electron optical system or imperfections of the components in the electron optical system can be compensated for. Reference is now made toFIG.3D, which illustrates an exemplary structure of a sensor surface500which can be used on electron detection device244. Sensor surface500has an array structure comprising a plurality of sensing elements, including sensing elements501,502,503, and so on, each capable of receiving at least a part of a beam spot. Sensing elements501,502,503may be configured to generate an electrical signal in response to receiving energy. The sensing element may comprise, for example, a PIN diode, avalanche diode, electron multiplier tube (EMT), and the like, and combinations thereof. For example, sensing elements501,502,503may be electron sensing elements. Electron sensing elements can generate a current signal commensurate with the electrons received in the sensor active area. A processing circuit can convert the generated current signal into a voltage signal (representing the intensity of the received electron beam spot). A processing system can generate an intensity signal of the electron beam spot by, for example, summing the currents generated by the electron sensing elements located within a sensor region, correlate the intensity signal with a scan path data of the primary electron beam incident on the wafer, and construct an image of the wafer based on the correlation. As shown inFIG.3D, area525may be provided between adjacent sensing elements. Area525may be an isolation area to isolate the sides and corners of neighboring pixels from one another. Although sensor surface500is depicted as having a rectangular grid arrangement, various geometric arrangements may be used. For example, sensing elements may be arranged in a hexagonal grid. Accordingly, individual sensing elements may have correspondingly different sizes and shapes. Sensing elements may also be arranged with octagonal tiling, triangular tiling, rhombic tiling, etc. Sensing elements need not be provided as uniform shapes and with regular packing. For example, pentagonal tiling with semiregular hexagons may be used. It is to be understood that these examples are exemplary, and various modifications may be applied. Reference is now made toFIG.4A, which illustrates a simplified illustration of a layer structure of a detector600. Detector600may be provided as detector244as shown inFIG.2. Detector600may be configured to have a plurality of layers stacked in a thickness direction, which may be substantially parallel to an incidence direction of an electron beam. The plurality of layers may include a sensor layer610and a circuit layer620. Sensor layer610may be provided with sensor surface500, as described above. Sensing elements, for example sensing elements611,612, and613may be provided in sensing layer610. Switching elements619may be provided arranged between adjacent sensing elements in the cross sectional direction. For example, each of sensing elements611,612, and613may be configured as diodes. Furthermore, switching elements619may be configured as transistors, such as a MOSFET. Each of sensing elements611,612,613may comprise outputs for making electrical connections to circuit layer620. Outputs may be integrated with switching elements619, or may be provided separately. Outputs may be integrated in a bottom layer of sensor layer610which may be a metal layer. In one example, as illustrated inFIG.4B, sensing elements611,612,613may be configured as PIN diodes. A detector device600A may include semiconductor devices. For example, a semiconductor device constituting a PIN diode device may be manufactured as a substrate with a plurality of layers. Additionally, sensing elements611,612,613, and/or switching elements619may be configured as a plurality of discrete semiconductor devices. The discrete semiconductor devices may be configured to be directly adjacent each other. Detector device600A may comprise a metal layer601as a top layer. Metal layer601is a layer for receiving electrons incident on the electron detection device244. Thus, metal layer601is configured as a detection surface. A material of metal layer601may be aluminum, for example. When aluminum is used in metal layer601, an oxidized layer may be formed on the exterior of the surface so as to protect electron detection device244. Detector device600A may also comprise metal layer605as a bottom layer of sensor layer610. A material of metal layer605may be copper, for example. Metal layer605may comprise output lines for carrying induced current from each of the sensing elements611,612,613. Individual sensing elements611,612,613may be separated by area625in the cross sectional direction, where area625may be an isolation area. In operation of a PIN diode device that may constitute sensing element611, for example, a P+ region is formed adjacent to metal layer601. P+ region may be a p-type semiconductor layer. An intrinsic region is formed adjacent to P+ region. Intrinsic region may be an intrinsic semiconductor layer. An N+ region is formed adjacent to intrinsic region. N+ region may be an n-type semiconductor layer. Thus, the intrinsic region is sandwiched between the P+ region and N+ region. When electrons are incident on the top surface of metal layer601, the intrinsic region is flooded with charge carriers from P+ region. Thus, the area under metal layer601in the region irradiate will be activated. A sensor layer of electron detection device244may be formed as the layers of metal layer601, metal layer605, and the various P+ regions, intrinsic regions, and N+ regions contained in sensing elements. Circuit layer620is provided adjacent to sensor layer610. Circuit layer620comprises line wires and various electronic circuit components. Circuit layer620may be provided as a semiconductor device. Circuit layer620may also comprise a processing system. Circuit layer620may be configured to receive the output current detected in sensor layer610. While the above descriptions discuss a metal or metal layers, it is apparent that alternatives could be used, for example, a conductive material. In some embodiments, switching elements619may be formed in a separate die. As illustrated inFIG.4C, for example, a switch die630is provided. Switch die630comprises the plurality of switching elements619. Switch die630is sandwiched between sensor layer610and circuit layer620. Switch die630is electrically connected to sensor layer610and circuit layer620. A circuit schematic is shown inFIG.5A. A dashed line represents a division between a sensor die701and a circuit die702. A layout such as that shown in circuit die702, for example, may represent a circuit provided in circuit layer620. A layout such as that shown in sensor die701, for example, may represent a plurality of sensing elements. For example, sensor layer610may be configured in a sensor die. A further circuit schematic is shown inFIG.5B. A layout shown in circuit die702may include an additional comparator771, as shall be discussed later. A simplified circuit diagram is shown inFIG.6. As shown inFIG.6, a plurality of pixels P1, P2, P3, P4may be provided. Pixels P1, P2, P3, P4may represent pixels of a sensing array, each of which may be associated with a sensing element. In an exemplary process of detecting signal intensity from a sensing element, a sensing element in a sensor layer is configured to gather current induced by incident charged particles. Other types of energy conversion may be used. Current is output from the sensing element to a circuit layer configured to analyze the output from the sensing element. The circuit layer may comprise a wiring layout and a plurality of electronic components to analyze the output from the sensing element. A process of signal intensity detection will be discussed with reference toFIG.5A. One pixel may be associated with one sensing element of a sensing element array. Thus, a first pixel is configured to generate a PIN diode current711. At the start of a process for PIN diode signal intensity detection, a switch721and a switch731are set to be open, while a switch741is set to be closed. Thus, voltage of a capacitor735can be reset to Vref2. Next, switch721and switch741are set to be open, while switch731is set to be closed. In this state, capacitor735begins charging and generates a voltage. Capacitor735may be configured to charge for a predetermined period of time, for example t_charge, after which switch731is set to be open. Then, comparator736compares the voltage at capacitor735to a reference value Vref1. Reference value Vref1may be set as a predetermined signal level. Based on the reference value, a circuit may be configured to output a signal that indicates that the sensing element is gathering current from an incident electron beam. Thus, the reference value may be a suitable value that indicates that the signal level from the PIN diode is high enough to be considered to be gathering current from an incident electron beam included within a beam spot. In comparator736, if voltage from capacitor735is higher than Vref1, an output signal is sent to block750. Vref1can be set so that each sensing element can be controlled to be included within an outer boundary of a beam spot. The value t_charge can be determined based on local logic or an external circuit, for example through a data line752communicating with block750. Logic blocks and circuitry components may be set so that functions such as signal intensity detection and pixel grouping determination can occur locally. However, signal intensity of each sensing element can be collected and determinations can be made via an external path. For example, an analog signal path and ADC may communicate with an external controller via an analog signal line and a data line. As described herein, each pixel in a sensing array may be associated with a sensing element that generates current based on incident electrons on the sensing element, and communicates with a circuit layer. Pixels may be connected to circuitry such as that discussed above with reference to the first pixel configured to generate PIN diode current711. Thus, a second pixel may be configured to generate a PIN diode current712, and so on. PIN diode current712may be connected to corresponding circuit elements, for example, switch721b, switch731b, switch741b, capacitor735b, comparator736b, block750b, etc. Generation and setting of a status indicator will be discussed, again with reference toFIG.5A. Using the output current from the sensing element, the circuit layer is configured to generate a status indicator. The status indicator may be configured to trigger a function for implementing grouping of pixels. Various methods for achieving sensing element grouping can be provided. In a first method for grouping, sensing element grouping may be achieved according to a signal strength flag in a local logic circuit. If a first pixel and a second pixel have a strong signal strength, the two pixels may be grouped. For example, PIN diode current711and PIN diode current712may both have high current values. Namely, voltage at capacitor735and voltage at capacitor735hmay both be higher than Vref1. Then, a switch767is set to be closed so as to merge the two pixels. If at least one of the first pixel and the second pixel has a weak signal, that is, either voltage at capacitor735or capacitor735bis less than Vref1, switch767is set to be open so that the two pixels are not merged. Switch767is configured as an element to implement a switch between two sensing elements. Switch767is located in circuit die702. Switch767may be configured as a transistor, such as a MOSFET. Switch767may also be configured as a relay, an analog switch, a solid-state relay, or other semiconductor devices. Switch767may be triggered by local logic in the circuit die702. Output from comparator736and output from comparator736bmay be routed to a block for activating switch767. For example, as illustrated inFIG.5A, an AND gate760is provided. AND gate760is arranged in circuit die702. AND gate760is associated with two pixels, and is associated with one switch between the two pixels. Output from comparator736and736bmay be routed, directly or through other blocks, to AND gate760. Based on signals input to AND gate760, for example status indicator751and status indicator751b, AND gate760is configured to toggle switch767. When switch767is a transistor, such as a field effect transistor, the switch may be toggled by application of voltage to its gate. A gate of the transistor may be arranged such that at least a contact of the gate is embedded in metal layer605. Thus, in the configuration ofFIG.4B, for example, voltage may be applied to a gate having a contact located in metal layer605. Additionally, in the configuration ofFIG.4C, for example, metal layers may be provided on a top and bottom of switch die630. In this configuration, a gate of the transistor switch may be arranged such that at least a contact of the gate is embedded in the metal layer on the bottom of switch die630. While an AND gate is illustrated, it should be appreciated that various components may be used to achieve controlling a switch between sensing elements based on output signals from the sensing elements. For example,FIG.6is a simplified circuit diagram illustrating an arrangement of four pixels in an array. In the array, a first pixel P1may be configured to generate a PIN diode current711, and output a status signal S1based thereon. Status signal S1may correspond to status indicator75L A second pixel P2may be configured to generate PIN diode current712, and output a status signal S2based thereon. Status signal S2may correspond to status indicator751b. Status signal S1from first pixel P1and status signal S2from second pixel P2are input to an AND gate760. Status signal S1and status signal S2can be generated based on signals generated at each of pixel P1and pixel P2, for example, a current signal may be induced by electrons incident on the surface of the pixel. Status signal S1may be generated based on whether current at pixel P1reaches a predetermined threshold. Similarly, status signal S2may be generated based on whether current at pixel P2reaches a predetermined threshold. AND gate760outputs a signal based on status signal S1and status signal S2to switch767. Thus, switch767is configured to be controlled based on input signals generated from at least two pixels. Such an input signal may be a voltage. It will be apparent that various other blocks or electrical components could be used to achieve control of switch767. Similar components may be provided for other pixels of the array. For example, a switch767dis provided between pixel P3and pixel P4. Pixel P3and pixel P4may be configured to output status signals S3and S4, respectively, similar to pixels P1and P2. Furthermore, a pixel may be in communication with multiple other pixels. For example, in addition to switch767configured to connect pixels P1and P2, a switch767bmay be provided between pixels P1and P3, and so on. Status signal S1may be configured to be sent to multiple neighboring pixels. In a second method for grouping, sensing element grouping may be achieved according to external logic circuits. For example, inFIGS.5A and5B, block750may be a digital logic block. Block750may communicate with external components via data line752and an address signal753. Status indicator751can be overwritten by external logic circuitry via data line752to control the status of switch767. Such external logic circuitry may also be provided in circuit die702, or may be provided as a separate system attached to block750by an input/output device. In some embodiments, local control logic associated with each pixel generates an indication of signal level of its corresponding sensing element. This indication can be used to determine whether two adjacent sensing elements should be connected by the switch configured to connect them. In this way, groups of sensing elements can be formed. Based on the formed groups, a primary boundary can be formed. To generate gradient information on signal intensity, additional comparator771may be provided, as shown inFIG.5B. A result from comparator771can be fed to logic blocks750and750b. With an arrangement including comparator771, processing may be carried out to generate a value representing the intensity of a beam spot based on the determined primary boundary. Grouping can be carried out based on which electron sensing elements are determined to lie outside the primary boundary of the beam spot. In electron beam imaging, beamlet image acquisition may be carried out. A process of image acquisition will be discussed with reference toFIG.5A. Initially, switch721and switch731are set to be open, while switch741is set to be closed. For each row of a detector array, switch721(or a corresponding switch) is set to be closed, one-by-one. By sequentially closing switch721and corresponding switches, electronic scanning of a detector surface can be carried out. Scanning may be implemented to read the analog signal of each pixel. For example, analog output line722may be configured to be read by an analog path, output to external devices, or sent to an analog-to-digital converter (ADC). Based on signals output from analog output line722, image reconstruction of beams or beamlets can be achieved. A controller may be used to conduct image acquisition based on the reconstructed image. The reconstructed image can be used to determine the boundary of a group of sensing elements. For example, one group can be defined to correspond to one beamlet. Summed signal intensity of the sensing elements in the group is thus representative of the current of the one beamlet. The reconstructed image can also be used to evaluate the performance of the electron optical system. For example, primary projection optical system220and/or secondary optical system242may be adjusted based on the reconstructed image. The reconstructed image may be used to compensate for imperfections or drift in electron optical sub-systems. Moreover, a low impedance output path of current signal from groups of pixels can be achieved. For example, a plurality of switches, such as switch721, may be provided for a plurality of pixels in the same group. Pixels of the same group may be in close proximity. A plurality of analog signal lines, such as analog output line722, may be routed to a grouped output. Additionally, the plurality of analog signal lines may be connected when they are grouped to the same group of the plurality of pixels. For example, switch767may be configured to group together a first sensing element and a second sensing element. Accordingly, PIN diode current711and PIN diode current712may be routed together through circuit die702. An output signal path for conveying PIN diode current711may comprise analog output line722and/or other output lines depending on which of switches721and731are open/closed. The output signal path may be part of the circuit die702. Output signal paths for grouped sensing elements may be connected via their corresponding switching element. While an example has been discussed with reference to electron beam inspection systems, it should be noted that for photo image sensor applications, a buffer can be added after switch721to improve performance. In an exemplary embodiment of a detector array, individual sensing elements in the detector array can be enabled or disabled. In normal operation for electron beam imaging, certain sensing elements may be enabled to detect incident beam current. For example, with reference toFIG.5A, a pixel may be enabled when voltage at capacitor735is greater than or equal to Vref1. A pixel may also be enabled by external logic circuits, for example in an override mode. In override mode, switch721may be open or closed depending on a control signal from external logic to decide the signal output routing. In override mode, switch731may be set to be open and switch741may be set to be closed. A pixel may be disabled when voltage at capacitor735is lower than Vref1. A pixel may also be disabled by external logic circuits, for example in an override mode. In an override mode for disabling, switch721may be set to be open. Switch731and switch741may be set to be closed. Operation in override modes may be conducted when, for example, it is determined that crosstalk is present in the sensing elements. Crosstalk can occur when a beam partially overlaps with an adjacent beam due to aberration, dispersion, and the like. In some embodiments, a processing system can detect the occurrence of partial overlapping based on primary or secondary beam spot boundaries. The processing system can exclude outputs from some sensing elements that are located in the area where beam spots overlap when determining intensity values of beam spots. Reference is now made toFIG.7, which illustrates a diagram relating location data of sensing elements. A detector array may comprise a plurality of sensing elements arranged to form J×K pixels having M×N channels. A single sensing element may be represented by pixel P1. Pixel P1has an address column AC_1. Pixel P2has an address column AC_2, and so on. For example, in the exemplary array having J×K pixels, pixel PJKhas an address column AC_J and an address row AR_K. Each column may have an analog column. For example, pixel P1has analog column AnC_1, which carries output current from the sensing element of pixel P1. Each sensing element can be selected by address column and address row signals. For example, pixel P1may be addressed by AC_1and AR_1. Data can be read and written by data row signals to each local logic circuit associated with each sensing element. For example, data can be sent to and received from pixel P1via data row DR_1. Digital logic DL may control data read/write, etc. Analog signal from each sensing element may travel through corresponding analog column lines to reach a multiplexer Mux. Multiplexer Mux may be located in the detector array. Multiplexer Mux may also be external to the detector array. Multiplexer Mux may have J inputs and M×N outputs. Pixels can be identified and grouped by their respective address line information. Any two pixels in a detector array can be in communication. Thus, grouping between any arbitrary number of pixels, in any arbitrary locations, can be achieved. Location information of the plurality of sensing elements may be used in various ways. For example, location information may be correlated with beam intensity to determine boundaries of beam spots. Additionally, based on the locations of the electron sensing elements that give rise to signal intensity comparator decisions, the processing system can identify a location on the sensor surface where a transition between the intensity gradients occurs. Intensity gradient information can be used for determinations involving primary and secondary boundaries. In some embodiments, location data may also be used to operate in override modes to control switching elements between two pixels independently of local logic. A processing system, for example, a processor embedded in circuit die702or externally connected may perform processing to determine identified locations as part of a beam boundary. The processing system may comprise an arrangement of comparators configured to perform processing based on voltage comparisons for each row and column of electron sensing elements to determine a set of locations on the detector array surface that may make up a beam boundary. In some embodiments, the processing system can also improve the fidelity of image reconstruction by compensating for the effect of noise signals using boundary information. The processing system can exclude signals received from outputs of electron sensing elements that are determined to be located outside a beam primary boundary. This can improve fidelity of image reconstruction by eliminating the random noise signals from electron sensing elements outside the primary boundary. InFIG.7, lines interconnecting a plurality of sensing elements, for example lines illustrated as AC_1, AR_1, DR_1, AnC_1, etc. may be wire lines patterned by printing a conductive material on a substrate. Wire lines can be manufactured in various manners, such as by normal processes used in fabricating a MOSFET. The wire lines may be part of a circuit layer of a detector array. Reference is now made toFIG.8, which illustrates a detection system900using a detector array comprising a plurality of sensing elements. A detector array may be provided having a detector surface500that can be used on electron detection device244. The detector array may comprise J×K pixels, and have M×N outputs to be connected with a multiplexer, for example multiplexer Mux. The detector array may be constructed as a substrate including a sensor layer and a circuit layer, as discussed herein. The detector array may be connected to a switch matrix905. Switch matrix905may be an analog switch matrix comprising local pixel circuits, and having J×K inputs with and M×N outputs. Switch matrix905may be connected to a signal conditioning circuit array910. Signal conditioning circuit array910may have M×N inputs and outputs so as to match the output from switch matrix905. Since switching control can be implemented in switch matrix905, output from switch matrix905may be simplified. When signal conditioning circuit array910follows switch matrix905, signal preconditioning occurring in signal condition circuit array can be simplified. Signal conditioning circuit array910may be connected to a parallel analog signal processing path array920for providing gain and offset control. Parallel analog signal processing path array920may have M×N inputs and outputs so that signals from all groups of electron sensing elements are processed. Parallel analog signal processing path array920may be connected to a parallel ADC array930, which may have M×N inputs and outputs so that signals from all groups of electron sensing elements are digitized. Parallel ADC array930may be connected to digital control unit940. Digital control unit940may comprise a controller941which can communicate with parallel analog signal processing path array920, parallel ADC array930, and with switch matrix905. Digital control unit940may send and receive communications from a deflection and image control (DIC) unit via a transceiver. An external controller, such as controller941, may be configured to execute imaging control. For example, controller941may be configured to generate an image of detected beamlets. Furthermore, grouping can be determined on the basis of primary and secondary beam spot boundaries. WhileFIG.8illustrates an arrangement where switch matrix905precedes signal conditioning circuit array910, it should be appreciated that this sequence could be reversed. Switch matrix905may comprise a circuit layout such as that shown in circuit die702ofFIG.5A, or in circuit die702ofFIG.5B, or a similar arrangement Switch matrix905provide signal strength comparison between electron sensing elements and a threshold voltage, for example Vref1. Switch matrix905may also provide signal strength comparison between adjacent electron sensing elements. Further, switch matrix905may provide analog signal selection for analog-to-digital conversion. Analog-to-digital conversion may then be implemented at parallel ADC array930. Switch matrix905may also provide, from a local digital logic circuit, signal strength status reading, such as comparisons between electron sensing elements and threshold voltage, and comparisons between electron sensing element pairs. Local switch status can be read or overwritten by external digital control circuits. In some embodiments, switching matrix905can enable a simplified architecture for detection system900. For example, reconfiguration of electron sensing elements can be implemented without an overly complex switch matrix design. The output signal of each sensing element group can go through multiple output wires connected to the group. These wires in conjunction with the connections between sensing elements in the group may form a network that largely reduces the equivalent output serial resistance and serial inductance. Accordingly, in some embodiments, output impedance of a group of pixels can be reduced dramatically. Furthermore, since J×K pixels are initially grouped in M×N groups in the detector, the number of output may be reduced. Output from a plurality of pixels that are grouped may have a common output. For example, an arrangement having M×N outputs can be achieved. Connection nodes between the electron detector array and signal conditioning circuits (TIA) can be dramatically reduced. The total number of outputs may be largely reduced compared to conventional detector arrays. Thus, a construction which is more apt for being scaled up can be achieved. Additionally, a more practical layout can be achieved, which may reduce the risk and cost involved in developing new devices. Furthermore, a reduced number of signal conditioning circuits may result in reduced total power consumption of an ASIC. In addition, a trade-off relationship between pixel count and difficulties of detector array manufacture can be eliminated. For example, pixel count limit may be related to the number of contacts formed with a switch matrix. Thus, by reducing the number of contacts and output lines used, higher pixel counts can be achieved. Also, higher tolerance to individual pixel failure may be achieved. The detector array may comprise its own memory so that the detector array can store an arrangement of the plurality of sensing elements and their associated circuitry. For example, the status of local indication751, and the grouping of sensing elements can be stored in the memory. A state of switches can be stored in the memory. Moreover, a switch matrix construction can be implemented with standard device processing, as would be understood to those having ordinary skill in the relevant art. Therefore, an increase in manufacturing difficulty and increased costs can be avoided. The embodiments may further be described using the following clauses:1. A detector comprising:a substrate comprising a plurality of sensing elements including a first element and a second element; anda switching element configured to connect the first element and the second element,wherein the first element is configured to generate a first signal in response to the first element detecting first charged particles that indicate a beam, and the second element is configured to generate a second signal in response to the second element detecting second charges particles that indicate the beam, andwherein the switching element is configured to be controlled based on the first signal and the second signal.2. The detector of clause 1, further comprising:a sensor die that includes the substrate; anda circuit die that includes the switching element and one or more circuits configured to control the switching element.3. The detector of any one of clauses 1 and 2, wherein the switching element comprises a switch configured to connect the first element and the second element.4. The detector of any one of clauses 1-3, wherein the substrate comprises a diode.5. The detector of any one of clauses 1-4, whereinthe first element is configured to generate the first signal in response to the first element receiving first charged particles with a first predetermined amount of energy, and the second element is configured to generate the second signal in response to receiving second charged particles with a second predetermined amount of energy.6. The detector of any one of clauses 1-4, whereinthe first element is configured to generate the first signal in response to the first element receiving first electrons with a first predetermined amount of energy, and the second element is configured to generate the second signal in response to receiving second electrons with a second predetermined amount of energy.7. The detector of any one of clauses 1-6, whereinin a thickness direction, the substrate comprises: a top metal layer configured as a detection surface, and a bottom metal layer, andin a cross section, an area between the top metal layer and the bottom metal layer is a charge carrier region.8. The detector of any one of clauses 1-7, wherein the switching element comprises a field effect transistor, wherein the field effect transistor comprises at least a contact of a gate fabricated in a metal layer.9. A detector comprising:a sensor layer comprising an array of sensing elements including a first element and a second element wherein the first element and the second element are adjacent;a circuit layer comprising one or more circuits electrically connected to the first element and the second element; anda switching element configured to connect the first element and the second element,wherein the one or more circuits is configured to:generate a first status indicator when the first element receives charged particles with a predetermined amount of energy,generate a second status indicator when the second element receives charged particles with a predetermined amount of energy, andcontrol the switching element based on the first status indicator and the second status indicator.10. The detector of clause 9, wherein the switching element comprises a transistor.11. The detector of clause 9, wherein the circuit layer comprises the switching element.12. The detector of any one of clauses 9 and 10, wherein in a cross section of the substrate, the sensor layer and the circuit layer sandwich the switching element.13. A detector system, comprisinga detector array comprising a plurality of sensing elements including a first element and a second element;a switching element configured to connect the first element and the second element;one or more circuits configured to generate a first signal in response to the first element detecting first charged particles that indicate a beam, and generate a second signal in response to the second element detecting second charged particles that indicate the beam; anda controller connected to the one or more circuits.14. The system of clause 13, further comprising a circuit layer comprising the switching element and the one or more circuits.15. The system of any one of clauses 13 and 14, whereinthe controller is configured to control the switching element based on an address of any of the first element and the second element.16. The system of any one of clauses 13-15, whereinthe controller is configured to acquire an image based on the beam, and generate a command signal based on the image; andthe one or more circuits are configured to control the switching element based on the command signal.17. The system of any one of clauses 13-16, whereinthe detector array comprises a first number of pixels configured to be grouped in a second number of groups, the second number being less than the first number.18. The system of clause 17, further comprising:a signal conditioning circuit array;a parallel analog signal processing path array;a parallel analog-to-digital converter array; anda digital control unit,wherein the signal conditioning circuit array, the parallel analog signal processing path array, the parallel analog-to-digital converter array, and the digital control unit are connected to the detector array via a plurality of channels, a number of the plurality of channels being greater than or equal to the second number.19. The system of any one of clauses 13-18, wherein the controller is configured to override a local logic of the one or more circuits.20. The system of any one of clauses 13-19, wherein the one or more circuits comprise the controller.21. The system of any one of clauses 13-19, wherein the controller is external to the detector array.22. The system of any one of clauses 13-19, wherein the first element and the second element have a common output.23. The system of clause 18, wherein the number of the plurality of channels is equal to the second number.24. A detector comprising:a substrate comprising a plurality of sensing elements including a first element and a second element; anda switching element configured to connect the first element and the second element,wherein the first element is configured to generate a first signal in response to the first element detecting an input, and the second element is configured to generate a second signal in response to the second element detecting an input,wherein the switching element is configured to group together the first element and the second element.25. The detector of clause 24, further comprising:a first output signal path connected to the first element; anda second output signal path connected to the second element,wherein the switching element is configured to connect the first output signal path and the second output signal path.26. The detector of any one of clauses 24 and 25, further comprising:one or more circuits configured to control the switching element based on the first signal and the second signal.27. The detector of any one of clauses 24-26, further comprising:a circuit die comprising the switching element.28. The detector of clause 25, further comprising:a circuit die comprising the switching element, the first output signal path, and the second output signal path.29. The detector of any one of clauses 24-28, wherein the detector comprises a first number of pixels configured to be grouped in a second number of groups, the second number being less than the first number.23. The detector of any one of clauses 5 or 6, wherein the first predetermined energy and the second predetermined energy are a same predetermined energy.24. The detector of any one of clauses 5 or 6, wherein the first predetermined energy and the second predetermined energy are different predetermined energies.25. The detector of clause 5, wherein the charged particles are electrons.26. The detector of clause 13, wherein the one or more circuits comprises a plurality of circuits, and wherein the controller being connected to the one or more circuits includes the controller being connected to any of the plurality of circuits. The block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer hardware/software products according to various exemplary embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code which comprises one or more executable instructions for implementing the specified logical functions. It should be understood that in some alternative implementations, functions indicated in the block may occur out of the order noted in the Figures. For example, two blocks shown in succession may be executed or implemented substantially concurrently, or two blocks may sometimes be executed in reverse order, depending upon the functionality involved. It should also be understood that each block of the block diagrams, and combination of the blocks, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or by combinations of special purpose hardware and computer instructions. It will be appreciated that the present invention is not limited to the exact construction that has been described above and illustrated in the accompanying drawings, and that various modifications and changes can be made without departing from the scope thereof. For example, while an exemplary detector has been set forth and described with respect to an electron beam system, a detector consistent with aspects of the present disclosure may be applied in a photo detector system, x-ray detector system, and other detection systems for high energy ionizing particles, etc. Detectors according to aspects of the present disclosure may be applied in a scanning electron microscope (SEM), a CMOS image sensor, a consumer camera, a specialized camera, or industry-use camera, etc. It is intended that the scope of the invention should only be limited by the appended claims. | 61,427 |
11862428 | DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS The system described herein is now shown using a material processing device which is embodied as a particle beam apparatus or which includes a particle beam apparatus. Particle beam apparatuses in the form of an SEM and in the form of a combination apparatus that include an electron beam column and an ion beam column are explained in more detail below. Express reference is made to the fact that the invention can be used with any particle beam apparatus, in particular in any electron beam apparatus and/or any ion beam apparatus. FIG.1shows a schematic representation of a material processing device2000according to the system described herein. The material processing device2000is provided for processing an object and includes a movable object holder2001for arranging the object. Moreover, the material processing device2000according to the system described herein includes a determination device2002that determines a region of interest of the object. By way of example, the determination device2002is designed such that the position or the suspected position of a region of interest is able to be entered into the determination device2002. In addition or as an alternative thereto, the determination device2002includes a device for non-destructive examination of the object for the purposes of determining a region of interest. In particular, provision is made for the determination device2002to include an x-ray device2002A, an ultrasound device2002B and/or a lock-in thermography device2002C to determine the region of interest. Expressed differently, the position of the region of interest in the object is determined using the aforementioned determination device2002. The material processing device2000according to the system described herein also includes an ablation device2003for ablating material. The ablation device2003for example includes a laser device2003A and/or a mechanical ablation device2003B. By way of example, the mechanical ablation device2003B is embodied as a microtome. In addition or as an alternative thereto in turn, provision is made for the ablation device2003to include an ion beam device2003C with a high-current ion beam (for example ranging from 1 nA to 10 μA, the interval limits being included in the aforementioned interval). In addition or as an alternative thereto, the ion beam device2003C is embodied as a plasma ion beam device with a plasma beam generator. In addition or as an alternative thereto, provision is made for the ablation device2003to include a beam device2003D with a beam of neutral particles. Additionally or alternatively in turn, provision is made for the ablation device2003to include an etching device2003E for chemical etching. Moreover, the material processing device2000according to the system described herein includes a particle beam apparatus2004with at least one beam generator for generating a particle beam with charged particles. The charged particles are electrons or ions, for example. Embodiments of the particle beam apparatus2004will be explained in greater detail below. The material processing device2000according to the system described herein also includes a control device2005having a processor2005A in which a computer program product is loaded, the latter, upon execution in the processor2005A, controlling the material processing device2000in such a way that a method according to the system described herein is carried out. This is discussed in more detail further below. The material processing device2000is embodied as for example an electron beam apparatus and/or an ion beam apparatus. In addition or as an alternative thereto, provision is made for the material processing device2000to be embodied as the particle beam apparatus2004. Expressed differently, the material processing device2000is formed by the particle beam apparatus2004itself. In addition or as an alternative thereto in turn, the material processing device2000is designed for processing frozen, cooled, cold or vitrified objects. Expressed differently, the material processing device2000can be used within the scope of using cryo-technology. FIG.2shows a schematic representation of the particle beam apparatus2004in the form of an SEM100. The SEM100includes a first beam generator in the form of an electron source101, which is embodied as a cathode. Further, the SEM100is provided with an extraction electrode102and with an anode103, which is placed onto one end of a beam guiding tube104of the SEM100. By way of example, the electron source101is embodied as a thermal field emitter. However, the invention is not restricted to such an electron source101. Rather, any electron source is utilizable. Electrons emerging from the electron source101form a primary electron beam. The electrons are accelerated to the anode potential on account of a potential difference between the electron source101and the anode103. In the embodiment depicted inFIG.2, the anode potential is 100 V to 35 kV, e.g., 5 kV to 15 kV, in particular 8 kV, relative to a ground potential of a housing of a sample chamber120. However, alternatively the anode potential could also be at ground potential. Two condenser lenses, specifically a first condenser lens105and a second condenser lens106, are arranged at the beam guiding tube104. InFIG.2, proceeding from the electron source101as viewed in the direction of a first objective lens107, the first condenser lens105is arranged first, followed by the second condenser lens106. It is expressly pointed out that further embodiments of the SEM100may include only a single condenser lens. A first aperture unit108is arranged between the anode103and the first condenser lens105. Together with the anode103and the beam guiding tube104, the first aperture unit108is at a high voltage potential, specifically the potential of the anode103, or connected to ground. The first aperture unit108has numerous first apertures108A, of which one is depicted inFIG.2. By way of example, two first apertures108A are present. Each one of the numerous first apertures108A has a different aperture diameter. An adjustment mechanism (not depicted) may be used to set a desired first aperture108A onto an optical axis OA of the SEM100. Reference is explicitly made to the fact that, in further embodiments, the first aperture unit108may be provided with only a single aperture108A. In the embodiment shown inFIG.2, an adjustment mechanism may be absent. The first aperture unit108is then designed to be stationary. A stationary second aperture unit109is arranged between the first condenser lens105and the second condenser lens106. As an alternative thereto, provision is made for the second aperture unit109to be embodied in a movable fashion. The first objective lens107includes pole pieces110, in which a hole is formed. The beam guiding tube104is guided through the hole. A coil111is arranged in the pole pieces110. An electrostatic retardation device is arranged in a lower region of the beam guiding tube104. The electrostatic retardation device includes an individual electrode112and a tube electrode113. The tube electrode113is arranged at one end of the beam guiding tube104, the end facing an object125that is arranged at an object holder114embodied in a movable fashion. By way of example, the object holder114is the object holder2001of the material processing device2000. Together with the beam guiding tube104, the tube electrode113is at the potential of the anode103, while the individual electrode112and the object125are at a lower potential in relation to the potential of the anode103. In the present case, the lower potential is the ground potential of the housing of the sample chamber120. In this manner, the electrons of the primary electron beam can be decelerated to a desired energy which is required for examining the object125. The SEM100further includes a scanning device115that deflects the primary electron beam and scans over the object125. Here, the electrons of the primary electron beam interact with the object125. As a consequence of the interaction, interaction particles and/or interaction radiation arises/arise, which is/are detected. In particular, electrons are emitted from the surface of the object125or from regions of the object125close to the surface—so-called secondary electrons—or electrons of the primary electron beam are backscattered—so-called backscattered electrons—as interaction particles. The object125and the individual electrode112can also be at different potentials and at potentials different from ground. It is thereby possible to set the location of the retardation of the primary electron beam in relation to the object125. By way of example, if the retardation is carried out quite close to the object125, imaging aberrations become smaller. A detector arrangement that includes a first detector116and a second detector117is arranged in the beam guiding tube104to detect the secondary electrons and/or the backscattered electrons. Here, the first detector116is arranged on the source side along the optical axis OA, while the second detector117is arranged on the object side along the optical axis OA in the beam guiding tube104. The first detector116and the second detector117are arranged offset from one another in the direction of the optical axis OA of the SEM100. Both the first detector116and the second detector117have a respective passage opening, through which the primary electron beam can pass. The first detector116and the second detector117are approximately at the potential of the anode103and of the beam guiding tube104. The optical axis OA of the SEM100extends through the respective passage openings. The second detector117serves principally for detecting secondary electrons. Upon emerging from the object125, the secondary electrons initially have a low kinetic energy and random directions of motion. A strong extraction field emanating from the tube electrode113accelerates the secondary electrons in the direction of the first objective lens107. The secondary electrons enter the first objective lens107approximately parallel. The beam diameter of the beam of the secondary electrons remains small in the first objective lens107as well. The first objective lens107then has a strong effect on the secondary electrons and generates a comparatively short focus of the secondary electrons with sufficiently steep angles with respect to the optical axis OA, such that the secondary electrons diverge far apart from one another downstream of the focus and strike the second detector117on the active area thereof. By contrast, only a small proportion of electrons that are backscattered at the object125—that is to say backscattered electrons which have a relatively high kinetic energy in comparison with the secondary electrons upon emerging from the object125—are detected by the second detector117. The high kinetic energy and the angles of the backscattered electrons with respect to the optical axis OA upon emerging from the object125have the effect that a beam waist, that is to say a beam region having a minimum diameter, of the backscattered electrons lies in the vicinity of the second detector117. A large portion of the backscattered electrons passes through the passage opening of the second detector117. Therefore, the first detector116substantially serves to detect the backscattered electrons. In a further embodiment of the SEM100, the first detector116can additionally be embodied with an opposing field grid116A. The opposing field grid116A is arranged at the side of the first detector116directed toward the object125. With respect to the potential of the beam guiding tube104, the opposing field grid116A has a negative potential such that only backscattered electrons with a high energy pass through the opposing field grid116A to the first detector116. In addition or as an alternative thereto, the second detector117includes a further opposing field grid, which has an analogous embodiment to the aforementioned opposing field grid116A of the first detector116and which has an analogous function. Further, the SEM100includes, in the sample chamber120, a chamber detector119, for example an Everhart-Thornley detector or an ion detector, which has a detection surface that is coated with metal and blocks light. The detection signals generated by the first detector116, the second detector117and the chamber detector119are used to generate an image or images of the surface of the object125. It is expressly pointed out that the apertures of the first aperture unit108and of the second aperture unit109, as well as the passage openings of the first detector116and of the second detector117, are depicted in exaggerated fashion. The passage openings of the first detector116and of the second detector117have an extent perpendicular to the optical axis OA in the range of 0.5 mm to 5 mm. By way of example, the passage openings are of circular design and have a diameter in the range of 1 mm to 3 mm perpendicular to the optical axis OA. The second aperture unit109is configured as a pinhole aperture unit in the embodiment depicted inFIG.2and is provided with a second aperture118for the passage of the primary electron beam, which has an extent in the range from 5 μm to 500 μm, e.g., 35 μm. As an alternative thereto, provision is made in a further embodiment for the second aperture unit109to be provided with a plurality of apertures, which can be displaced mechanically with respect to the primary electron beam or which can be reached by the primary electron beam by the use of electrical and/or magnetic deflection elements. The second aperture unit109is embodied as a pressure stage aperture unit, which separates a first region, in which the electron source101is arranged and in which there is an ultra-high vacuum (10−7hPa to 10−12hPa), from a second region, which has a high vacuum (10−3hPa to 10−7hPa). The second region is the intermediate pressure region of the beam guiding tube104, which leads to the sample chamber120. The sample chamber120is under vacuum. For the purposes of producing the vacuum, a pump (not depicted) is arranged at the sample chamber120. In the embodiment depicted inFIG.2, the sample chamber120is operated in a first pressure range or in a second pressure range. The first pressure range includes only pressures of less than or equal to 10−3hPa, and the second pressure range includes only pressures of greater than 10−3hPa. To ensure said pressure ranges, the sample chamber120is vacuum-sealed. The object holder114is arranged at a sample stage122. The sample stage122has movement units such that the object holder114is embodied to be movable in three directions arranged perpendicular to one another, specifically in an x-direction (first stage axis), in a y-direction (second stage axis) and in a z-direction (third stage axis). Moreover, the sample stage122has movement units such that the object holder114can be rotated about two axes of rotation (stage axes of rotation) arranged perpendicular to one another. The invention is not restricted to the sample stage122described above. Rather, the sample stage122can have further translation axes and axes of rotation along which or about which the object holder114can move. The SEM100further includes a third detector121, which is arranged in the sample chamber120. More precisely, the third detector121is arranged downstream of the sample stage122, viewed from the electron source101along the optical axis OA. The sample stage122, and hence the object holder114, can be rotated in such a way that the primary electron beam can radiate through the object125arranged on the object holder114. When the primary electron beam passes through the object125to be examined, the electrons of the primary electron beam interact with the material of the object125to be examined. The electrons passing through the object125to be examined are detected by the third detector121. Arranged at the sample chamber120is a radiation detector500, which is used to detect interaction radiation, for example x-ray radiation and/or cathodoluminescent light. The radiation detector500, the first detector116, the second detector117, and the chamber detector119are connected to a control unit123, which includes a monitor124. The third detector121is also connected to the control unit123, which is not depicted inFIG.2for reasons of clarity. The control unit123processes detection signals that are generated by the first detector116, the second detector117, the chamber detector119, the third detector121and/or the radiation detector500and displays the detection signals in the form of images or spectra on the monitor124. The control unit123furthermore has a database126, in which data are stored and from which data are read out. By way of example, the control unit123is embodied as the control device2005of the material processing device2000. The control unit123includes a processor127, which for example is embodied as the processor2005A and/or in which a computer program product with a program code is loaded which, upon execution, controls the material processing device2000and/or the SEM100in such a way that the method according to the system described herein is carried out. This is discussed in more detail below. The SEM100includes a gas feed device1000, which serves to feed a gaseous precursor to a specific position on the surface of the object125. The gas feed device1000includes a gas reservoir in the form of a precursor reservoir1001. By way of example, the precursor is received as a solid, gaseous or liquid substance in the precursor reservoir1001. By heating and/or cooling the precursor, the equilibrium between the solid phase, the liquid phase and the gaseous phase is adjusted in such a way that the required vapor pressure is available. By way of example, phenanthrene is used as precursor. Essentially a layer of carbon or a carbon-containing layer then deposits on the surface of the object125. As an alternative thereto, by way of example, a precursor having metal can be used to deposit a metal or a metal-containing layer on the surface of the object125. However, the depositions are not limited to carbon and/or metals. Rather, arbitrary substances can be deposited on the surface of the object125, for example semiconductors, non-conductors or other compounds. Furthermore, provision is also made for the precursor to be used for ablating material of the object125upon interaction with the particle beam. The gas feed device1000is provided with a feed line1002. The feed line1002has, in the direction of the object125, an acicular hollow tube1003, which is able to be brought into the vicinity of the surface of the object125for example at a distance of 10 μm to 1 mm from the surface of the object125. The hollow tube1003has a feed opening, the diameter of which is for example in the range of 10 μm to 1000 μm, in particular in the range of 100 μm to 600 μm. The feed line1002has a valve1004in order to regulate the flow rate of gaseous precursor into the feed line1002. Expressed differently, when the valve1004is opened, gaseous precursor from the precursor reservoir1001is introduced into the feed line1002and guided via the hollow tube1003to the surface of the object125. When the valve1004is closed, the flow of the gaseous precursor onto the surface of the object125is stopped. The gas feed device1000is furthermore provided with an adjusting unit1005, which enables an adjustment of the position of the hollow tube1003in all 3 spatial directions—namely an x-direction, a y-direction and a z-direction—and an adjustment of the orientation of the hollow tube1003using a rotation and/or a tilting. The gas feed device1000and thus also the adjusting unit1005are connected to the control unit123of the SEM100. In further embodiments, the precursor reservoir1001is not arranged directly at the gas feed device1000. Rather, in the further embodiments, provision is made for the precursor reservoir1001to be arranged for example at a wall of a space in which the SEM100is situated. The gas feed device1000includes a temperature measuring unit1006. By way of example, an infrared measuring apparatus or a semiconductor temperature sensor is used as temperature measuring unit1006. However, the invention is not restricted to the use of such temperature measuring units. Rather, any suitable temperature measuring unit which is suitable for the invention can be used as temperature measuring unit. In particular, provision can be made for the temperature measuring unit1006not to be arranged at the gas feed device1000itself, but rather to be arranged for example at a distance from the gas feed device1000. The gas feed device1000also includes a temperature setting unit1007. By way of example, the temperature setting unit1007is a heating device, in particular a conventional infrared heating device. As an alternative thereto, the temperature setting unit1007is embodied as a heating and/or cooling device, which includes a heating wire and/or a Peltier element, for example. However, the invention is not restricted to the use of such a temperature setting unit1007. Rather, any suitable temperature setting unit can be used for the invention. FIG.3shows a schematic representation of the particle beam apparatus2004in the form of a combination apparatus200. The combination apparatus200includes two particle beam columns. Firstly, the combination apparatus200is provided with the SEM100, as already depicted inFIG.2, but without the sample chamber120. Rather, the SEM100is arranged at a sample chamber201. The sample chamber201is under vacuum. For the purposes of producing the vacuum, a pump (not depicted) is arranged at the sample chamber201. In the embodiment depicted inFIG.3, the sample chamber201is operated in a first pressure range or in a second pressure range. The first pressure range includes only pressures of less than or equal to 10−3hPa, and the second pressure range includes only pressures of greater than 10−3hPa. To ensure maintaining the pressure ranges, the sample chamber201is vacuum-sealed. Arranged in the sample chamber201is the chamber detector119which is embodied, for example, in the form of an Everhart-Thornley detector or an ion detector and which has a detection surface coated with metal that blocks light. Further, the third detector121is arranged in the sample chamber201. The SEM100serves to generate a first particle beam, specifically the primary electron beam described above, and has the optical axis, specified above, which is provided with the reference sign709inFIG.3and which is also referred to as first beam axis below. Secondly, the combination apparatus200is provided with an ion beam apparatus300, which is likewise arranged at the sample chamber201. The ion beam apparatus300likewise has an optical axis, which is provided with the reference sign710inFIG.3and which is also referred to as second beam axis below. The SEM100is arranged vertically in relation to the sample chamber201. By contrast, the ion beam apparatus300is arranged in a manner inclined by an angle of approximately 0° to 90° in relation to the SEM100. An arrangement of approximately 50° is depicted by way of example inFIG.3. The ion beam apparatus300includes a second beam generator in the form of an ion beam generator301. Ions, which form a second particle beam in the form of an ion beam, are generated by the ion beam generator301. The ions are accelerated using an extraction electrode302, which is at a predefinable potential. The second particle beam then passes through an ion optical unit of the ion beam apparatus300, where the ion optical unit includes a condenser lens303and a second objective lens304. The second objective lens304ultimately generates an ion probe, which is focused onto the object125being arranged at an object holder114. The object holder114is arranged at a sample stage122. By way of example, the object holder114is embodied as the object holder2001of the material processing device2000. An adjustable or selectable aperture unit306, a first electrode arrangement307and a second electrode arrangement308are arranged above the second objective lens304(i.e., in the direction of the ion beam generator301), where the first electrode arrangement307and the second electrode arrangement308are embodied as scanning electrodes. The second particle beam is scanned over the surface of the object125using the first electrode arrangement307and the second electrode arrangement308, with the first electrode arrangement307acting in a first direction and the second electrode arrangement308acting in a second direction, which is counter to the first direction. Thus, scanning is carried out in an x-direction, for example. The scanning in a y-direction perpendicular thereto is brought about by further electrodes (not depicted), which are rotated by 90°, at the first electrode arrangement307and at the second electrode arrangement308. As explained above, the object holder114is arranged at the sample stage122. In the embodiment shown inFIG.3, too, the sample stage122has movement units such that the object holder114is embodied to be movable in three directions arranged perpendicular to one another, specifically in an x-direction (first stage axis), in a y-direction (second stage axis) and in a z-direction (third stage axis). Moreover, the sample stage122has movement units such that the object holder114can be rotated about two axes of rotation (stage axes of rotation) arranged perpendicular to one another. The distances depicted inFIG.3between the individual units of the combination apparatus200are depicted in exaggerated fashion in order to better illustrate the individual units of the combination apparatus200. Arranged at the sample chamber201is a radiation detector500, which is used to detect interaction radiation, for example x-ray radiation and/or cathodoluminescenct light. The radiation detector500is connected to a control unit123, which includes a monitor124. By way of example, the control unit123is embodied as the control unit2005of the material processing device2000. The control unit123processes detection signals that are generated by the first detector116, the second detector117(not depicted inFIG.3), the chamber detector119, the third detector121and/or the radiation detector500and displays the detection signals in the form of images or spectra on the monitor124. The control unit123furthermore has a database126, in which data are stored and from which data are read out. Moreover, the control unit123includes a processor127, which for example is embodied as the processor2005A and/or in which a computer program product with a program code is loaded which, upon execution, controls the material processing device2000and/or the combination apparatus200in such a way that the method according to the system described herein is carried out. This is discussed in more detail further below. The combination apparatus200includes a gas feed device1000, which serves to feed a gaseous precursor to a specific position on the surface of the object125. The gas feed device1000includes a gas reservoir in the form of a precursor reservoir1001. By way of example, the precursor is received as a solid, gaseous or liquid substance in the precursor reservoir1001. By heating and/or cooling the precursor, the equilibrium between the solid phase, the liquid phase and the gaseous phase is adjusted in such a way that the required vapor pressure is available. By way of example, phenanthrene is used as precursor. Essentially a layer of carbon or a carbon-containing layer then deposits on the surface of the object125. As an alternative thereto, by way of example, a precursor having metal can be used to deposit a metal or a metal-containing layer on the surface of the object125. However, the depositions are not limited to carbon and/or metals. Rather, arbitrary substances can be deposited on the surface of the object125, for example semiconductors, non-conductors or other compounds. Furthermore, provision is also made for the precursor to be used for ablating material of the object125upon interaction with one of the two particle beams. The gas feed device1000is provided with a feed line1002. The feed line1002has, in the direction of the object125, an acicular hollow tube1003, which is able to be brought into the vicinity of the surface of the object125for example at a distance of 10 μm to 1 mm from the surface of the object125. The hollow tube1003has a feed opening, the diameter of which is for example in the range of 10 μm to 1000 μm, in particular in the range of 100 μm to 600 μm. The feed line1002has a valve1004in order to regulate the flow rate of gaseous precursor into the feed line1002. Expressed differently, when the valve1004is opened, gaseous precursor from the precursor reservoir1001is introduced into the feed line1002and guided via the hollow tube1003to the surface of the object125. When the valve1004is closed, the flow of the gaseous precursor onto the surface of the object125is stopped. The gas feed device1000is furthermore provided with an adjusting unit1005, which enables an adjustment of the position of the hollow tube1003in all 3 spatial directions—namely an x-direction, a y-direction and a z-direction—and an adjustment of the orientation of the hollow tube1003using a rotation and/or a tilting. The gas feed device1000and thus also the adjusting unit1005are connected to the control unit123of the combination apparatus200. In further embodiments, the precursor reservoir1001is not arranged directly at the gas feed device1000. Rather, in the further embodiments, provision is made for the precursor reservoir1001to be arranged for example at a wall of a space in which the combination apparatus200is situated. The gas feed device1000includes a temperature measuring unit1006. By way of example, an infrared measuring apparatus or a semiconductor temperature sensor is used as temperature measuring unit1006. However, the invention is not restricted to the use of such temperature measuring units. Rather, any suitable temperature measuring unit which is suitable for the invention can be used as temperature measuring unit. In particular, provision can be made for the temperature measuring unit1006not to be arranged at the gas feed device1000itself, but rather to be arranged for example at a distance from the gas feed device1000. The gas feed device1000also includes a temperature setting unit1007. By way of example, the temperature setting unit1007is a heating device, in particular a conventional infrared heating device. As an alternative thereto, the temperature setting unit1007is in the form of a heating and/or cooling device, which includes a heating wire and/or a Peltier element, for example. However, the invention is not restricted to the use of such a temperature setting unit1007. Rather, any suitable temperature setting unit can be used for the invention. FIG.4shows a schematic representation of the particle beam apparatus2004in the form of a further particle beam apparatus. The embodiment ofFIG.4of the particle beam apparatus is provided with the reference sign400and includes a mirror corrector for correcting, e.g., chromatic and/or spherical aberration. The particle beam apparatus400includes a particle beam column401, which is embodied as an electron beam column and which substantially corresponds to an electron beam column of a corrected SEM. However, the particle beam apparatus400is not restricted to an SEM with a mirror corrector. Rather, the particle beam apparatus400may include any type of corrector units. The particle beam column401includes a particle beam generator in the form of an electron source402(cathode), an extraction electrode403, and an anode404. By way of example, the electron source402is embodied as a thermal field emitter. Electrons emerging from the electron source402are accelerated to the anode404on account of a potential difference between the electron source402and the anode404. Accordingly, a particle beam in the form of an electron beam is formed along a first optical axis OA1. The particle beam is guided along a beam path, which corresponds to the first optical axis OA1, after the particle beam has emerged from the electron source402. A first electrostatic lens405, a second electrostatic lens406, and a third electrostatic lens407are used to guide the particle beam. Furthermore, the particle beam is set along the beam path using a beam guiding device. The beam guiding device of the embodiment shown inFIG.4includes a source setting unit with two magnetic deflection units408arranged along the first optical axis OA1. Moreover, the particle beam apparatus400includes electrostatic beam deflection units. A first electrostatic beam deflection unit409, which is also embodied as a quadrupole in a further embodiment, is arranged between the second electrostatic lens406and the third electrostatic lens407. The first electrostatic beam deflection unit409is likewise arranged downstream of the magnetic deflection units408. A first multi-pole unit409A in the form of a first magnetic deflection unit is arranged at one side of the first electrostatic beam deflection unit409. Moreover, a second multi-pole unit409B in the form of a second magnetic deflection unit is arranged at the other side of the first electrostatic beam deflection unit409. The first electrostatic beam deflection unit409, the first multi-pole unit409A, and the second multi-pole unit409B are set for the purposes of setting the particle beam in respect of the axis of the third electrostatic lens407and the entrance window of a beam deflection device410. The first electrostatic beam deflection unit409, the first multi-pole unit409A and the second multi-pole unit409B can interact like a Wien filter. A further magnetic deflection element432is arranged at the entrance to the beam deflection device410. The beam deflection device410is used as a particle beam deflector, which deflects the particle beam in a specific manner. The beam deflection device410includes a plurality of magnetic sectors, specifically a first magnetic sector411A, a second magnetic sector411B, a third magnetic sector411C, a fourth magnetic sector411D, a fifth magnetic sector411E, a sixth magnetic sector411F, and a seventh magnetic sector411G. The particle beam enters the beam deflection device410along the first optical axis OA1and the particle beam is deflected by the beam deflection device410in the direction of a second optical axis OA2. The beam deflection is performed using the first magnetic sector411A, using the second magnetic sector411B, and using the third magnetic sector411C through an angle of 30° to 120°. The second optical axis OA2is oriented at the same angle with respect to the first optical axis OA1. The beam deflection device410also deflects the particle beam which is guided along the second optical axis OA2, to be precise in the direction of a third optical axis OA3. The beam deflection is provided by the third magnetic sector411C, the fourth magnetic sector411D, and the fifth magnetic sector411E. In the embodiment inFIG.4, the deflection with respect to the second optical axis OA2and with respect to the third optical axis OA3is provided by deflection of the particle beam at an angle of 90°. Hence, the third optical axis OA3extends coaxially with respect to the first optical axis OA1. However, it is pointed out that the particle beam apparatus400according to the system described here is not restricted to deflection angles of 90°. Rather, any suitable deflection angle can be selected by the beam deflection device410, for example 70° or 110°, such that the first optical axis OA1does not extend coaxially with respect to the third optical axis OA3. In respect of further details of the beam deflection device410, reference is made to WO 02/067286 A2. After the particle beam has been deflected by the first magnetic sector411A, the second magnetic sector411B, and the third magnetic sector411C, the particle beam is guided along the second optical axis OA2. The particle beam is guided to an electrostatic mirror414and travels on a path of the particle beam to the electrostatic mirror414along a fourth electrostatic lens415, a third multi-pole unit416A in the form of a magnetic deflection unit, a second electrostatic beam deflection unit416, a third electrostatic beam deflection unit417, and a fourth multi-pole unit416B in the form of a magnetic deflection unit. The electrostatic mirror414includes a first mirror electrode413A, a second mirror electrode413B, and a third mirror electrode413C. Electrons of the particle beam which are reflected back at the electrostatic mirror414once again travel along the second optical axis OA2and re-enter the beam deflection device410. Then, the electrons are deflected to the third optical axis OA3by the third magnetic sector411C, the fourth magnetic sector411D, and the fifth magnetic sector411E. The electrons of the particle beam emerge from the beam deflection device410and the electrons are guided along the third optical axis OA3to an object425that is intended to be examined and is arranged in an object holder114. By way of example, the object holder114is embodied as the object holder2001of the material processing device2000. On the path to the object425, the particle beam is guided to a fifth electrostatic lens418, a beam guiding tube420, a fifth multi-pole unit418A, a sixth multi-pole unit418B, and an objective lens421. The fifth electrostatic lens418is an electrostatic immersion lens. By way of the fifth electrostatic lens418, the particle beam is decelerated or accelerated to an electric potential of the beam guiding tube420. The objective lens421focuses the particle beam into a focal plane in which the object425is arranged. The object holder114is arranged at a movable sample stage424. The movable sample stage424is arranged in a sample chamber426of the particle beam apparatus400. The sample stage424has movement units such that the object holder114is embodied to be movable in three directions arranged perpendicular to one another, specifically in an x-direction (first stage axis), in a y-direction (second stage axis) and in a z-direction (third stage axis). Moreover, the sample stage424has movement units such that the object holder114can be rotated about two axes of rotation (stage axes of rotation) arranged perpendicular to one another. The sample chamber426is under vacuum. For the purposes of producing the vacuum, a pump (not depicted) is arranged at the sample chamber426. In the embodiment depicted inFIG.4, the sample chamber426is operated in a first pressure range or in a second pressure range. The first pressure range includes only pressures of less than or equal to 10−3hPa, and the second pressure range includes only pressures of greater than 10−3hPa. To ensure achieving the pressure ranges, the sample chamber426is vacuum-sealed. The objective lens421can be embodied as a combination of a magnetic lens422and a sixth electrostatic lens423. The end of the beam guiding tube420can furthermore be an electrode of an electrostatic lens. After emerging from the beam guiding tube420, particles of the particle beam apparatus are decelerated to a potential of the object425. The objective lens421is not restricted to a combination of the magnetic lens422and the sixth electrostatic lens423. Rather, the objective lens421may assume any suitable embodiment. By way of example, the objective lens421can also be embodied as a purely magnetic lens or as a purely electrostatic lens. The particle beam which is focused onto the object425interacts with the object425. Interaction particles are generated. In particular, secondary electrons are emitted from the object425or backscattered electrons are backscattered at the object425. The secondary electrons or the backscattered electrons are accelerated again and guided into the beam guiding tube420along the third optical axis OA3. In particular, the trajectories of the secondary electrons and the backscattered electrons extend on the route of the beam path of the particle beam in the opposite direction to the particle beam. The particle beam apparatus400includes a first analysis detector419, which is arranged between the beam deflection device410and the objective lens421along the beam path. Secondary electrons traveling in directions oriented at a large angle with respect to the third optical axis OA3are detected by the first analysis detector419. Backscattered electrons and secondary electrons which have a small axial distance with respect to the third optical axis OA3at the location of the first analysis detector419—i.e., backscattered electrons and secondary electrons which have a small distance from the third optical axis OA3at the location of the first analysis detector419—enter the beam deflection device410and are deflected to a second analysis detector428by the fifth magnetic sector411E, the sixth magnetic sector411F and the seventh magnetic sector411G along a detection beam path427. By way of example, the deflection angle is 90° or 110°. The first analysis detector419generates detection signals which are largely generated by emitted secondary electrons. The detection signals which are generated by the first analysis detector419are guided to a control unit123and are used to obtain information about the properties of the interaction region of the focused particle beam with the object425. In particular, the focused particle beam is scanned over the object425using a scanning device429. Using the detection signals generated by the first analysis detector419, an image of the scanned region of the object425can then be generated and displayed on a display unit. The display unit is, for example, a monitor124that is arranged at the control unit123. By way of example, the control unit123is embodied as the control unit2005of the material processing device2000. The second analysis detector428is also connected to the control unit123. Detection signals of the second analysis detector428are passed to the control unit123and used to generate an image of the scanned region of the object425and to display the image on a display unit. The display unit is for example the monitor124that is arranged at the control unit123. Arranged at the sample chamber426is a radiation detector500, which is used to detect interaction radiation, for example x-ray radiation and/or cathodoluminescent light. The radiation detector500is connected to the control unit123, which includes the monitor124. The control unit123processes detection signals of the radiation detector500and displays the detection signals in the form of images and/or spectra on the monitor124. The control unit123furthermore has a database126, in which data are stored and from which data are read out. Moreover, the control unit123includes a processor127, which for example is embodied as the processor2005A and/or in which a computer program product with a program code is loaded which, upon execution, controls the material processing device2000and/or the particle beam apparatus400in such a way that the method according to the system described herein is carried out. This is discussed in more detail further below. The particle beam apparatus400includes a gas feed device1000, which serves to feed a gaseous precursor to a specific position on the surface of the object425. The gas feed device1000includes a gas reservoir in the form of a precursor reservoir1001. By way of example, the precursor is received as a solid, gaseous or liquid substance in the precursor reservoir1001. By heating and/or cooling the precursor, the equilibrium between the solid phase, the liquid phase and the gaseous phase is adjusted in such a way that the required vapor pressure is available. By way of example, phenanthrene is used as precursor. Essentially a layer of carbon or a carbon-containing layer then deposits on the surface of the object425. As an alternative thereto, by way of example, a precursor having metal can be used to deposit a metal or a metal-containing layer on the surface of the object425. However, the depositions are not limited to carbon and/or metals. Rather, arbitrary substances can be deposited on the surface of the object425, for example semiconductors, non-conductors or other compounds. Furthermore, provision is also made for the precursor to be used for ablating material of the object425upon interaction with a particle beam. The gas feed device1000is provided with a feed line1002. The feed line1002has, in the direction of the object425, an acicular hollow tube1003, which is able to be brought into the vicinity of the surface of the object425for example at a distance of 10 μm to 1 mm from the surface of the object425. The hollow tube1003has a feed opening, the diameter of which is for example in the range of 10 μm to 1000 μm, in particular in the range of 100 μm to 600 μm. The feed line1002has a valve1004in order to regulate the flow rate of gaseous precursor into the feed line1002. Expressed differently, when the valve1004is opened, gaseous precursor from the precursor reservoir1001is introduced into the feed line1002and guided via the hollow tube1003to the surface of the object425. When the valve1004is closed, the flow of the gaseous precursor onto the surface of the object425is stopped. The gas feed device1000is furthermore provided with an adjusting unit1005, which enables an adjustment of the position of the hollow tube1003in all 3 spatial directions—namely an x-direction, a y-direction and a z-direction—and an adjustment of the orientation of the hollow tube1003using a rotation and/or a tilting. The gas feed device1000and thus also the adjusting unit1005are connected to the control unit123of the particle beam apparatus400. In further embodiments, the precursor reservoir1001is not arranged directly at the gas feed device1000. Rather, in the further embodiments, provision is made for the precursor reservoir1001to be arranged for example at a wall of a space in which the particle beam apparatus400is situated. The gas feed device1000includes a temperature measuring unit1006. By way of example, an infrared measuring apparatus or a semiconductor temperature sensor is used as temperature measuring unit1006. However, the invention is not restricted to the use of such temperature measuring units. Rather, any suitable temperature measuring unit which is suitable for the invention can be used as temperature measuring unit. In particular, provision can be made for the temperature measuring unit1006not to be arranged at the gas feed device1000itself, but rather to be arranged for example at a distance from the gas feed device1000. The gas feed device1000further includes a temperature setting unit1007. By way of example, the temperature setting unit1007is a heating device, in particular a conventional infrared heating device. As an alternative thereto, the temperature setting unit1007is embodied as a heating and/or cooling device, which includes a heating wire and/or a Peltier element, for example. However, the invention is not restricted to the use of such a temperature setting unit1007. Rather, any suitable temperature setting unit can be used for the invention. Now, the sample stage122of the SEM100, the sample stage122of the combination apparatus200and the sample stage424of the particle beam apparatus400are discussed below. The sample stage122,424is embodied as a sample stage with movement units, which is depicted schematically inFIGS.5and6. Reference is made to the fact that the invention is not restricted to the sample stage122,424described here. Rather, the invention can have any movable sample stage that is suitable for the invention. Arranged on the sample stage122,424is the object holder114with the object125,425. The sample stage122,424has movement units that ensure a movement of the object holder114in such a way that a region of interest on the object125,425can be examined and/or processed using a particle beam. The movement units are depicted schematically inFIGS.5and6and are explained below. The sample stage122,424has a first movement unit600on a housing601of the sample chamber120,201,426, in which the sample stage122,424is arranged. The first movement unit600enables a movement of the object holder114along the z-axis (third stage axis). Further, provision is made of a second movement unit602. The second movement unit602enables a rotation of the object holder114about a first stage axis of rotation603, which is also referred to as a tilt axis. This second movement unit602serves to tilt the object125,425about the first stage axis of rotation603. Arranged on the second movement unit602, in turn, is a third movement unit604that is embodied as a guide for a slide and that ensures that the object holder114is movable in the x-direction (first stage axis). The aforementioned slide is a further movement unit in turn, specifically a fourth movement unit605. The fourth movement unit605is embodied in such a way that the object holder114is movable in the y-direction (second stage axis). To this end, the fourth movement unit605has a guide in which a further slide is guided, a holder609with the object holder114and the object125,425in turn being arranged on the latter. The holder609is embodied, in turn, with a fifth movement unit606that facilitates a rotation of the holder609about a second stage axis of rotation607. The second stage axis of rotation607is oriented perpendicular to the first stage axis of rotation603. On account of the above-described arrangement, the sample stage122,424of the embodiment discussed here has the following kinematic chain: first movement unit600(movement along the z-axis)—second movement unit602(rotation about the first stage axis of rotation603)—third movement unit604(movement along the x-axis)—fourth movement unit605(movement along the y-axis)—fifth movement unit606(rotation about the second stage axis of rotation607). In a further embodiment (not depicted), provision is made for further movement units to be arranged at the sample stage122,424such that movements along further translational axes and/or about further axes of rotation are made possible. It is clear fromFIG.6that each of the aforementioned movement units is connected to a stepper motor. Thus, the first movement unit600is connected to a first stepper motor M1and driven on account of a driving force that is provided by the first stepper motor M1. The second movement unit602is connected to a second stepper motor M2, which drives the second movement unit602. The third movement unit604is connected, in turn, to a third stepper motor M3. The third stepper motor M3provides a driving force for driving the third movement unit604. The fourth movement unit605is connected to a fourth stepper motor M4, wherein the fourth stepper motor M4drives the fourth movement unit605. Further, the fifth movement unit606is connected to a fifth stepper motor M5. The fifth stepper motor M5provides a driving force that drives the fifth movement unit606. The aforementioned stepper motors M1to M5are controlled by a control unit608(seeFIG.6). As already mentioned above, the SEM100, the combination apparatus200and/or the particle beam apparatus400itself can be embodied as the material processing device2000. In this case, the SEM100, the combination apparatus200and/or the particle beam apparatus400has or have all features explained above or below in respect of the material processing device2000. Embodiments of the method according to the system described herein are explained in more detail below in relation to the material processing device2000in the form of the combination apparatus200. The method according to the system described herein is carried out in analogous fashion in relation to the SEM100and/or the particle beam apparatus400. FIG.7shows a schematic representation of a procedure of one embodiment of the method according to the system described herein.FIG.8shows a schematic representation of the object125. In a method step S1, a region of interest2006of the object125arranged on or in a first material region2007of the object125is determined using the determination device2002of the material processing device2000. Expressed differently, the position of the region of interest2006is determined in or on the object125. By way of example, the region of interest2006is a precipitate in the material of the object125, a pore in the material of the object125, an impurity phase in the material of the object125, an interface in the material of the object125or a defect in the material of the object125. By way of example, an at least partly cylindrical material region is used as the first material region2007. In addition or as an alternative thereto, an at least partly conical material region is used as the first material region2007. By way of example, the region of interest2006is determined using the determination device2002with specified data about the object125or with data of a model of the object125. By way of example, this embodiment of the method according to the system described herein is used if the structural build of the object125is known or approximately known. Then it is for example possible to accurately determine or approximately determine the position of the region of interest2006in or on the object125. By way of example, the determined or suspected position of the region of interest2006is entered into the determination device2002and/or read from an external database. A further embodiment of the method according to the system described herein additionally or alternatively provides for the region of interest2006to be determined using the determination device2002to perform a non-destructive examination. By way of example, the region of interest2006is determined using the x-ray device2002A, using the ultrasound device2002B and/or using the lock-in thermography device2002C. As mentioned above, the region of interest2006is arranged in or on the first material region2007of the object125. The first material region2007adjoins a second material region2009. By way of example, the second material region2009encompasses the first material region2007at least in part. In particular, provision is made for the second material region2009to fully encompass the first material region2007. Further, provision is made for the first material region2007to have a first portion2007A and a second portion2007B that adjoins the first portion2007A. The region of interest2006is arranged in the first portion2007A. By way of example, the second portion2007B encompasses the first portion2007A at least in part. In particular, provision is made for the second portion2007B to fully encompass the first portion2007A. The embodiment of the method according to the system described herein now provides for method step S2to be carried out after method step S1or for method step S1A to be carried out first and then method step S2. Method step S1A is explained first. In method step S1A, a marking is arranged on the object125by using the ion beam.FIG.9shows a schematic representation of the object125, the schematic representation being based onFIG.8. The same reference signs denote the same components. This embodiment of the method according to the system described herein is advantageous, in particular, if the region of interest2006is arranged in the first material region2007of the object125, and not at the surface125A of the object125. To be able to recognize the approximate location of the region of interest2006in an image representation of the object125, a marking2008is arranged at the surface125A of the object125where the projection of the region of interest2006on the surface125A is arranged. Alternatively, provision is made for the marking2008to be arranged on the surface125A with an offset from the projection of the region of interest2006on the surface125A. With regard to the projection, reference is made to the comments further above, which also apply here. Explicit reference is made to the fact that this embodiment of the method according to the system described herein can also be carried out if the region of interest2006is arranged on the surface125A of the object125. By way of example, provision is made for material deposition to be used as the marking2008, with the material deposition being arranged at the surface125A of the object125by the ion beam and/or the electron beam of the combination apparatus200using the gas feed device1000. By way of example, the marking2008then also serves as a protective layer for the region of interest2006while the method is carried out. In addition or as an alternative thereto, provision is made for a material ablation to be used as the marking2008, with the material ablation being generated by the ion beam and/or the electron beam of the combination apparatus200. To apply the marking2008to the surface125A of the object125, the gaseous precursor is guided for example by the gas feed device1000to the location on the surface125A of the object125where the projection of the region of interest2006on the surface125A is arranged. As mentioned above, phenanthrene for example is used as precursor. Essentially a layer of carbon or a carbon-containing layer then deposits on the surface125A of the object125. As an alternative thereto, by way of example, a precursor having metal can be used to deposit a metal or a metal-containing layer on the surface125A of the object125. However, the depositions are not limited to carbon and/or metals. Rather, any desired substances can be deposited on the surface125A of the object125, for example semiconductors, non-conductors or other compounds. Further, provision is also made for the precursor, while interacting with the electron beam and/or the ion beam, to be used to ablate material from the site of the surface125A of the object125where the region of interest2006and/or the projection of the region of interest2006on the surface125A of the object125are/is arranged. In method step S2, material is then ablated from the second material region2009of the object125using the ablation device2003of the material processing device2000. By way of example, the ablation device2003orients itself using coordinates of the sample stage122and/or the marking2008. In particular, provision is made for the ablation device2003to scan a structure, for example in the form of a circular ring with a specifiable internal diameter and with a specifiable external diameter, and ablate into the depth, the center of the circular ring being the marking2008. Reference is made to the fact that the invention is not restricted to the aforementioned structure. Instead, any structured that is suitable for the invention can be used for the invention. As mentioned above, the ablation device2003for example includes the laser device2003A and/or the mechanical ablation device2003B. By way of example, the mechanical ablation device2003B is embodied as a microtome. In addition or as an alternative thereto in turn, provision is made for the ablation device2003to include the ion beam device2003C with the high-current ion beam (for example ranging from 1 nA to 10 μA, the interval limits being included in the aforementioned interval). In addition or as an alternative thereto, the ion beam device2003C is embodied as the plasma ion beam device2003C with a plasma beam generator. In addition or as an alternative thereto in turn, the ablation device2003includes the beam device2003D with a beam of neutral particles and/or the etching device2003E for chemical etching. By way of example, provision is made for the material of the second material region2009of the object125to be ablated extensively in a few ablation steps, in particular of the order of several 100 μm. Expressed differently, the material in the second material region2009of the object125is ablated in a few coarse steps within the scope of the method step of the method according to the system described here, and so an extensive structure is generated in the object125. By way of example, this structure has maximum dimensions of the order of several 100 μm.FIG.10shows a schematic representation of the object125after the second material region2009was extensively ablated. In this embodiment, the material of the second material region2009has been ablated around the first material region2007of the object125, in such a way that a structure with a depth of approximately 120 μm and with a diameter of approximately 500 μm is formed in the object125. The first material region2007is arranged approximately in the center of this structure.FIG.11shows a detailed representation of the first material region2007, on which the marking2008has been arranged. In method step S3, an expected geometric shape of the first material region2007is searched for in a plan view of the first material region2007, following the ablation or during the ablation of the material from the second material region2009, using the control unit123. Subsequently, the geometric shape is recognized. By way of example, an image and/or pattern recognition method known from the prior art is used to this end. Expressed differently, the control unit123is used to determine the geometric shape of the first material region2007in a plan view of the first material region2007following the ablation or during the ablation of the material from the second material region2009. With regard to the plan view, reference is made to the comments further above, which also apply here. By way of example, the geometric shape is recognized on account of imaging of the first material region2007by the electron beam and/or the ion beam of the combination apparatus200. The geometric shape has a center. The center is arranged at a first position. Expressed differently, the center has a first relative position in space. By way of example, a two-dimensional shape is recognized as the geometric shape of the first material region2007. In particular, the two-dimensional shape is a circular ring2010A (cf.FIG.12) and/or a frame-shaped structure2010B (cf.FIG.13), that is to say basically a shape with corners equivalent to the circular ring2010A, and/or a polygon2010C (cf.FIG.14). However, the invention is not restricted to the aforementioned two-dimensional shapes. Rather, any two-dimensional shape which is suitable for the invention can be used for the invention. In addition or as an alternative thereto in turn, provision is made for a central point and/or a centroid to be used as the center2011A,2011B,2011C of the geometric shape2010A,2010B,2010C (cf.FIGS.12to14). By way of example, the centroid is a centroid of an area. Alternatively, a point in the interior of the geometric shape2010A,2010B,2010C is used as the center2011A,2011B,2011C of the geometric shape2010A,2010B,2010C, the point having a predetermined position relative to an edge of the geometric shape2010A,2010B,2010C. Now, the following applies with regard to the center2011A,2011B,2011C: What firstly applies, for example, is that the region of interest2006is arranged at the center2011A to2011C of the geometric shape2010A to2010C. Should the region of interest2006be arranged in the first material region2007of the object125(i.e., be arranged in the interior of the first material region2007of the object125), provision is for example made for the projection of the region of interest2006on the surface125A of the first material region2007of the object125to be arranged at the center2011A to2011C of the geometric shape2010A to2010C. Secondly, if the region of interest2006or the projection of the region of interest2006on the surface125A of the first material region2007is not arranged at the center2011A,2011B,2011C of the geometric shape2010A,2010B,2010C, the region of interest2006or the projection of the region of interest2006on the surface125A of the first material region2007is defined as the center2011A,2011B,2011C of the geometric shape2010A,2010B,2010C and the geometric shape2010A,2010B,2010C is arranged around the defined center2011A,2011B,2011C. Expressed differently, (a) the region of interest2006or a projection of the region of interest2006is already arranged at the center2011A,2011B,2011C of the geometric shape2010A,2010B,2010C or (b) the region of interest2006or its projection is defined as the center2011A,2011B,2011C, about which the geometric shape2010A,2010B,2010C is arranged. By way of example, the aforementioned projection is a perpendicular projection of the region of interest2006on the surface125A of the first material region2007. In an alternative, the projection is a projection of the region of interest2006on the surface125A of the first material region2006at any definable angle. Method step S4is carried out after method step S3in this embodiment of the method according to the system described herein. Material is ablated from the second portion2007B of the first material region2007using the ion beam of the combination apparatus200in method step S4, optionally with a gas being fed by the gas feed device1000. Expressed differently, material is ablated from the second portion2007B of the first material region2007using the ion beam of the combination apparatus200, with material not being ablated from the first portion2007A of the first material region2007. Accordingly, no material is ablated from the region in which the region of interest2006is arranged (i.e., from the first portion2007A of the first material region2007). The material of the second portion2007B of the first material region2007is ablated along the determined geometric shape2010A to2010C or along a further geometric shape that can be specified as desired. Expressed differently, the material is ablated from the second portion2007B in such a way that the material is ablated from the second portion2007B in the shape of the determined geometric shape2010A to2010C or a further geometric shape that can be specified as desired. By ablating the material from the second portion2007B of the first material region2007along the determined geometric shape2010A to2010C or a further geometric shape that can be specified as desired, the first portion2007A of the first material region2007is in principle exposed, the region of interest2006being arranged in the first portion2007A of the first material region2007(cf.FIG.15). The first portion2007A has a first subregion and a second subregion, the region of interest being arranged in the first subregion. In principle, the aforementioned corresponds to a geometry as depicted inFIG.9, with the first subregion being denoted by reference sign2007A′ and the second subregion being denoted by reference sign2007B′. By way of example, the second subregion2007B′ encompasses the first subregion2007A′ at least in part. In particular, provision is made for the second subregion2007B′ to fully encompass the first subregion2007A′. In method step S5, a further geometric shape of the first material region2007is also recognized, following the ablation and/or during the ablation of the material from the second portion2007B, in a plan view of the first material region2007using the control unit123. By way of example, an image and/or pattern recognition method known from the prior art is used to this end. Expressed differently, the control unit123is used to search for and determine the further geometric shape of the first material region2007in a plan view of the first material region2007, following the ablation and/or during the ablation of the material from the second portion2007B. With regard to the plan view, reference is made to the comments further above, which also apply here. By way of example, the further geometric shape is recognized on account of imaging of the first material region2007by the electron beam and/or the ion beam of the combination apparatus200. In particular, the further geometric shape is the outer shape of the first material region2007remaining following the ablation of the material from the second portion2007B, and/or the further geometric shape is for example the marking2008of the region of interest2006or of the aforementioned projection of the region of interest2006. The further geometric shape has a further center. The further center is arranged at a second position. Expressed differently, the further center has a second relative position in space. However, the further geometric shape has a smaller area than the aforementioned geometric shape, for example on account of a smaller diameter or a smaller area diagonal. By way of example, a two-dimensional shape is recognized as the further geometric shape of the first material region2007. In particular, the two-dimensional shape is a circular ring2010A (cf.FIG.12) and/or a frame-shaped structure2010B (cf.FIG.13), that is to say basically a shape with corners equivalent to the circular ring2010A, and/or a polygon2010C (cf.FIG.14). However, the invention is not restricted to the aforementioned two-dimensional shapes. Rather, any two-dimensional shape which is suitable for the invention can be used for the invention. In method step S6, the object125is positioned using the object holder114and/or the ion beam is positioned using the ion beam apparatus300, in such a way that the first position of the center corresponds to the second position of the further center so that one of the following features is applicable in respect of the further center: (i) the region of interest2006is arranged at the further center of the further geometric shape2010A to2010C or (ii) the projection of the region of interest2006on the surface125of the first material region2007is arranged at the further center of the further geometric shape2010A to2010C. In method step S7, material is ablated from the second subregion2007B′ of the first material region2007using the ion beam of the ion beam apparatus300, the material of the second subregion2007B′ of the first material region2007being ablated for example along the further geometric shape or a further geometric shape that can be specified as desired in turn. The first subregion2007A′ is not ablated in the process. Now, a check is carried out in method step S8as to whether the specified number of iteration steps and/or the desired end shape of the object125resulting from the processing of the object125have/has been obtained. If the desired end shape of the object125and/or the specified number of iteration steps have/has not yet been obtained, method steps S5to S8are repeated. In this case, the material of the remaining first material region2007—for example the first subregion2007A′—is ablated further, with for example the current and the energy of the ion beam incrementally decreasing during each iteration of steps S5to S8. This is explained below. When method step S5is carried out again, a yet further geometric shape of the first material region2007is recognized, following the ablation and/or during the ablation of the material from the second subregion2007B′, in a plan view of the first material region2007using the control unit123. By way of example, an image and/or pattern recognition method known from the prior art is used to this end. Expressed differently, the control unit123is used to search for a yet further geometric shape and determine the yet further geometric shape of the first material region2007in a plan view of the first material region2007, following the ablation and/or during the ablation of the material from the second subregion2007B′. By way of example, the yet further geometric shape is recognized using imaging of the first material region2007by the electron beam and/or the ion beam of the combination apparatus200. In particular, the yet further geometric shape is the outer shape of the first material region2007remaining following the ablation of the material from the second subregion2007B′, and/or the yet further geometric shape is for example the marking2008of the region of interest2006or of the aforementioned projection of the region of interest2006. The yet further geometric shape has a yet further center. The yet further center is arranged at a third position. Expressed differently, the yet further center has a third relative position in space. However, the yet further geometric shape has a smaller area than the further geometric shape recognized in the previously carried out method step S5, for example on account of a smaller diameter or a smaller area diagonal. By way of example, a two-dimensional shape is recognized as the yet further geometric shape of the first material region2007. In particular, the two-dimensional shape is a circular ring2010A (cf.FIG.12) and/or a frame-shaped structure2010B (cf.FIG.13), that is to say basically a shape with corners equivalent to the circular ring2010A, and/or a polygon2010C (cf.FIG.14). However, the invention is not restricted to the aforementioned two-dimensional shapes. Rather, any two-dimensional shape which is suitable for the invention can be used for the invention. In method step S6, the object125is positioned using the object holder114and/or the ion beam is positioned using the ion beam apparatus300, in such a way that the second position of the further center corresponds to the third position of the yet further center so that one of the following features is applicable in respect of the yet further center: (i) the region of interest2006is arranged at the yet further center of the yet further geometric shape2010A to2010C or (ii) the projection of the region of interest2006on the surface125of the first material region2007is arranged at the yet further center of the yet further geometric shape2010A to2010C. In method step S7, material is now ablated from a further second subregion2007B″ of the first material region2007using the ion beam of the ion beam apparatus300, the material of the further second subregion2007B″ of the first material region2007being ablated for example along the further geometric shape or a further geometric shape that can be specified as desired. As mentioned above, a current that is lower than the current of the ion beam used during the previous iteration of method step S7is generally chosen for the current of the ion beam. The first subregion2007A has a further first subregion2007A″ and the aforementioned further second subregion2007B″, the region of interest2006being arranged in the further first subregion2007A″. In principle, the aforementioned corresponds to a geometry as depicted inFIG.9, with the further first subregion being denoted by reference sign2007A″ and the further second subregion being denoted by reference sign2007B″. By way of example, the further second subregion2007B″ encompasses the further first subregion2007A″ at least in part. In particular, provision is made for the further second subregion2007B″ to fully encompass the further first subregion2007A′. The further first subregion2007A″ is not ablated in the method step S7. Now, a check is carried out in method step S8as to whether a specified number of iteration steps and/or the desired end shape of the object125resulting from the processing of the object125have/has been obtained. Method steps S5to S8are repeated if the desired end shape of the object125has not yet been obtained and/or the iteration has not yet been completed as further steps should still be carried out. By way of example, when method steps S3to S5are run through again, the ablation of the material from the first material region2007in the form of hollow cylinders with reducing diameters and heights is chosen such that, in particular, a tip is generated in the first material region2007of the object125. As mentioned above, a check is carried out in method step S8as to whether the specified number of iteration steps and/or the desired end shape of the first material region2007of the object125have/has been achieved. Should this be the case, the first material region2007for example has the shape of a tip with a tip radius of the order of 10 nm to 100 nm, for example. This is depicted schematically inFIG.16. In an embodiment of the method according to the system described herein, the tip of the object125is analyzed using atom probe tomography in the combination apparatus200(method step S9). To this end, an electric field with a voltage whose field strength just does not suffice to bring about a detachment of atoms from the tip is applied to the tip in the combination apparatus200. Now a short voltage pulse is applied to the tip in addition to the aforementioned voltage. This causes an increase in the field strength, the latter then being sufficient to detach individual ions at the tip by field evaporation. The use of a short laser pulse as an alternative to the short voltage pulse is also known. An atom that has been detached as a charged ion is steered to a position-sensitive detector by the electric field. Since the time of the voltage pulse or the laser pulse is known, the time at which the ion was detached from the tip is also known. Then, the mass of the ion can be determined from a time of flight, to be determined, of the ion from the tip to the detector. The x- and y-position of the atom at the tip can be determined from the location of incidence of the ion on the position-sensitive detector. The z-position of the atom in the tip is determined with knowledge of the evaporation sequence carried out. Expressed differently, ions striking the position-sensitive detector at a later time are arranged further within the tip than ions striking the position-sensitive detector at an earlier time. Alternatively, the object125is removed and introduced into an examination device, in which the tip is then analyzed using atom probe tomography. FIG.17shows a further embodiment of the method according to the system described herein. The embodiment of the method according to the system illustrated inFIG.17is based on the embodiment of the method according to the system illustrated inFIG.7. Therefore, reference is made to the explanations given above. The explanations given above also apply to the method according to the system illustrated in accordance withFIG.17. In contrast to the embodiment of the method according to the system illustrated in accordance withFIG.7, the embodiment of the method according to the system illustrated in accordance withFIG.17includes method step S3A, which is carried out after method step S3. In method step S3A the object125is positioned using the moveable object holder114and/or the ion beam is positioned using the combination apparatus200following the recognition of the geometric shape of the first material region2006, in such a way that the ion beam is directed at the first material region2007. In particular, provision is made for the object125and/or the ion beam to be positioned using at least one structure that has arisen when ablating the material from the second material region2009of the object125using the ablation device2003, the structure being formed as a marking. Expressed differently, at least one structure is used as a marking in this embodiment of the method according to the system described herein, in order to position the object125and/or the ion beam, to be precise in such a way that, for example, the ion beam is directed at the first material region2007. Following the step S3A, method step S4is carried out. Firstly, the system described herein ensures extensive ablation of material of the object125for example of the order of several 100 μm using the ablation device2003. In particular, the system described herein ensures the material of the second material region2009of the object125is ablated extensively in a few ablation steps, for example of the order of several 100 μm. Expressed differently, the material in the second material region2009of the object125is ablated in a few coarse steps within the scope of the method according to the system described herein and so an extensive structure is generated in the object125. By way of example, this structure has dimensions of the order of several 100 μm. Secondly, the system described herein ensures for example automated fine ablation of material from the second portion2007B of the first material region2007, of the order of several nm to several μm, using the ion beam of the combination apparatus200, with the first portion2007A, in which the region of interest2006is arranged, not being ablated. Consequently, the time taken for production of a determined shape of the object125, for example a tip of the object125for the purposes of analysis using atom probe tomography, can be reduced in comparison with the prior art, for example to minutes or a few hours. Further, the system described herein facilitates determination of the geometric form and the centration of the region of interest2006or the projection of the region of interest2006at the center2011A to2011C of the geometric shape2010A to2010C, such that adequate relative positioning of the electron beam and/or of the ion beam relative to the object125is made possible without a reference marking necessarily having to be arranged on the object125. The system described herein ensures production of any shape of the object125by processing the object125within a relatively short period of time, in particular production of a tip of the object125which is then analyzable using atom probe tomography, for example. The system described herein also takes into account that the object125is processed multiple times for the purposes of producing a desired shape of the object125. On account of mechanical and/or electronic drifts of components of the material processing device2000and/or the choice of different ablation conditions in the material processing device2000, the relative position of the region of interest2006may change in relation to the ion beam of the combination apparatus200while the method according to the system described herein is carried out. If the object125is processed multiple times, this may possibly lead to a non-desired shape of the object125being produced following processing without appropriate position correction or drift correction. As a result of recognizing the geometric shapes and arranging the center of the geometric shapes at a position, the system described herein, in particular, provides a solution that considers such drifts without use of a reference marking being mandatory. None of the described embodiments of the method according to the invention are restricted to the aforementioned sequence of the explained method steps. Rather, any sequence of the aforementioned method steps suitable for the invention can be chosen in the method according to the invention. The features of the invention disclosed in the present description, in the drawings and in the claims may be essential for the realization of the invention in the various embodiments thereof both individually and in arbitrary combinations. The invention is not restricted to the described embodiments. The invention can be varied within the scope of the claims and taking into account the knowledge of the relevant person skilled in the art. | 83,397 |
11862429 | DETAILED DESCRIPTION It is to be understood that the following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific embodiments or examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, dimensions of elements are not limited to the disclosed range or values, but may depend upon process conditions and/or desired properties of the device. Moreover, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed interposing the first and second features, such that the first and second features may not be in direct contact. Various features may be arbitrarily drawn in different scales for simplicity and clarity. Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. In addition, the term “being made of” may mean either “comprising” or “consisting of” In the present disclosure, a phrase “one of A, B and C” means “A, B and/or C” (A, B, C, A and B, A and C, B and C, or A, B and C), and does not mean one element from A, one element from B and one element from C, unless otherwise described. An ion implantation apparatus or an ion implanter is used to implant at least a species of ion into a material to change the physical property of the material. For example, boron is implanted into silicon to change its electrical property by making the boron doped silicon more conductive such that a p-n junction or a transistor can be made for a complicated circuit of a device. Calibration of an ion implanter requires changing gas cylinders for providing different species of ions for acquiring sufficient number of data points for different ion masses and performing vacuum experiments to obtain sufficient number of data points for plotting a calibration curve. Thus, calibration of an ion implanter requires at least 12 hours. During the data taking for the calibration of the ion implanter, the production process has to be completely stopped. Therefore, an efficient method or apparatus for tuning the ion implanter is demanded, especially when there are more than one ion implanters to be tuned. FIG.1shows a top plan view of an ion implanter, according to an embodiment of the present disclosure. The ion implanter inFIG.1is used for medium current type, high current type, and high energy type ion implantations, according to some embodiments of the present disclosure. Medium energy current type ion implantations are mainly used for formation of channels, channel stoppers, and wells. High current type ion implantations are mainly used for formation of sources and drains of transistors or contacts of a device. High energy type ion implantations are mainly used for formation of deep wells and photodiodes. The ion implanter inFIG.1is a batch wafer type ion implanter, according to some embodiments of the present disclosure. The ion implanter includes a user interface100for inputting the parameters and viewing the data obtained by the ion implanter, according to some embodiments of the present disclosure. The user interface100includes a wired or wireless desktop computer, a notebook computer, a tablet, a smartphone, and a remote control device, according to some embodiments of the present disclosure. The user interface100includes a display for viewing the data obtained by the ion implanter and for inputting or adjusting parameters of the ion implanter, according to some embodiments of the present disclosure. The display includes a cathode ray tube (CRT) display, liquid crystal display (LCD), light emitting diode (LED), organic light emitting diode (OLED) display, plasma display, and optical projector such as light-bulb projector or laser projection, according to some embodiments of the present disclosure. The user interface100includes a data input device, according to some embodiments of the present disclosure. The data input device includes a keyboard, voice command input microphone, iris scanning device, and a facial recognition device, according to some embodiments of the present disclosure. The data input device also includes a cursor control device including a mouse, a touch pad, and a touch screen, according to some embodiments of the present disclosure. The data input device of the user interface100is connected to the user interface100through electrical wires or wirelessly, according to some embodiments of the present disclosure. The ion implanter further includes an ion source loading chamber110for providing ion source materials for the ion implanter, according to some embodiments of the present disclosure. The ion source material is loaded by opening the chamber110and placed on a container130, according to some embodiments of the present disclosure. The container130includes a crucible, according to some embodiments of the present disclosure. Also, the container130includes a heater (not shown) for evaporation of the ion source material, according to some embodiments of the present disclosure. The container130containing a loaded ion source material is moved through a transition tunnel120between the external environment and the internal environment of the ion implantation chamber160, according to some embodiments of the present disclosure. Then, the container130containing the ion source material is positioned inside the arc chamber140in which ions for the implanter are formed by heating the ion source material in the container130and applying a voltage to an extraction electrode150to extract the required ions for the ion implanter, according to some embodiments of the present disclosure. The generated ion stream passes into a region covered by magnetic field lines of an analyzer magnet170and the analyzer magnet170selects the appropriate ions based on the desired ion mass and charge by applying and adjusting a magnetic field (and thus by Lorentz force), according to some embodiments of the present disclosure. Only the ions having the desired ion mass and charge can pass into the quadrupole lens (Q lens) region180, according to some embodiments of the present disclosure. The ion stream then passes into a region surrounded by scanning electrode190, according to some embodiments of the present disclosure. The scanning electrode190uses electrostatic method to uniformly scan the ion beam in a frequency of 100 kHz throughout the area of each of the wafers. The scanning pattern of the scanning electrode190depends on the desired outcome of the ion implanted wafers. The scanning electrode190includes at least a pair of horizontal electrodes for controlling the horizontal scanning and at least a pair of vertical electrodes for controlling the vertical scanning. Then the ion stream passes into a region covered by parallel lens200, according to some embodiments of the present disclosure. The Q lens region180and the parallel lens200function to shape the ion beam, according to some embodiments of the present disclosure. The scanning electrode190functions to scan the ion beam to cover the entire wafer width of the wafer W1, according to some embodiments of the present disclosure. The ion beam then passes into a region surrounded by an acceleration/deceleration column210for adjusting the speed of the ion beam, according to some embodiments of the present disclosure. Then, the ion beam passes into a region covered the magnetic field lines of a final energy magnet (FEM)220, according to some embodiments of the present disclosure. The FEM220functions to adjust the energy of the ions for ion implantation into the wafer W1located on a rotating disk240inside a sample chamber230, according to some embodiments of the present disclosure. The wafers located on the rotating disk240are rotated at a speed so as to allow all the wafers including wafer W2to face the ions incoming from the FEM220, according to some embodiments of the present disclosure. If the ion beam misses the wafers and rotation disk240, the ion beam may continue to pass to impact on beam stopper250. The wafers on the rotation disk240, e.g. W1and W2, are loaded on a container (not shown) in a wafer loading chamber280. Then, the wafer is carried through a transition tunnel270between the external environment of the ion implanter and the internal environment of the ion implanter. The transition tunnel270includes a valve or door (not shown) for prevention of contamination, according to some embodiments of the present disclosure. The wafers are then carried into a wafer chamber230and are loaded onto the rotating disk240by a robotic arm260, according to some embodiments of the present disclosure. The rotating disk240does not rotate when the wafers are loaded onto the rotating disk240, according to some embodiments of the present disclosure. FIG.2shows a top plan view of an ion implanter, according to another embodiment of the present disclosure.FIG.2shows a top plan view of an ion implanter, according to an embodiment of the present disclosure. The ion implanter inFIG.2is used for medium current type, high current type, and high energy type ion implantations, according to some embodiments of the present disclosure. Medium energy current type ion implantations are mainly used for formation of channels, channel stoppers, and wells. High current type ion implantations are mainly used for formation of sources and drains of transistors or contacts of a device. High energy type ion implantations are mainly used for formation of deep wells and photodiodes. The ion implanter inFIG.2is a batch wafer type ion implanter, according to some embodiments of the present disclosure. The ion implanter includes a user interface100for inputting the parameters and viewing the data obtained by the ion implanter, according to some embodiments of the present disclosure. The user interface100includes a wired or wireless desktop computer, a notebook computer, a tablet, a smartphone, and a remote control device, according to some embodiments of the present disclosure. The user interface100includes a display for viewing the data obtained by the ion implanter and for inputting or adjusting parameters of the ion implanter, according to some embodiments of the present disclosure. The display includes a cathode ray tube (CRT) display, liquid crystal display (LCD), light emitting diode (LED), organic light emitting diode (OLED) display, plasma display, and optical projector such as light-bulb projector or laser projection, according to some embodiments of the present disclosure. The user interface100includes a data input device, according to some embodiments of the present disclosure. The data input device includes a keyboard, voice command input microphone, iris scanning device, and a facial recognition device, according to some embodiments of the present disclosure. The data input device also includes a cursor control device including a mouse, a touch pad, and a touch screen, according to some embodiments of the present disclosure. The data input device of the user interface100is connected to the user interface100through electrical wires or wirelessly, according to some embodiments of the present disclosure. The ion implanter further includes an ion source loading chamber110for providing ion source materials for the ion implanter, according to some embodiments of the present disclosure. The ion source material is loaded by opening the ion source loading chamber110and placed on a container130, according to some embodiments of the present disclosure. The container130includes a crucible, according to some embodiments of the present disclosure. Also, the container130includes a heater (not shown) for evaporation of the ion source material, according to some embodiments of the present disclosure. The container130containing a loaded ion source material is moved through a transition tunnel120between the external environment and the internal environment of the ion implantation chamber160, according to some embodiments of the present disclosure. Then, the container130containing the ion source material is positioned inside the arc chamber140in which ions for the implanter are formed by heating the ion source material in the container130and applying a voltage to an extraction electrode150to extract the required ions for the ion implanter, according to some embodiments of the present disclosure. The generated ion stream passes into a region covered by magnetic field lines of an analyzer magnet170and the analyzer magnet170selects the appropriate ions based on the desired ion mass and charge by applying and adjusting a magnetic field (and thus by Lorentz force), according to some embodiments of the present disclosure. Only the ions having the desired ion mass and charge can pass into the quadrupole lens (Q lens) region180, according to some embodiments of the present disclosure. The ion stream then passes into a region surrounded by scanning electrode190, according to some embodiments of the present disclosure. The scanning electrode190uses electrostatic method to uniformly scan the ion beam in a frequency of 100 kHz throughout the area of each of the wafers. The scanning pattern of the scanning electrode190depends on the desired outcome of the ion implanted wafers. The scanning electrode190includes at least a pair of horizontal electrodes for controlling the horizontal scanning and at least a pair of vertical electrodes for controlling the vertical scanning. Then the ion stream passes into a region covered by parallel lens200, according to some embodiments of the present disclosure. The Q lens region180and the parallel lens200function to shape the ion beam, according to some embodiments of the present disclosure. The scanning electrode190functions to scan the ion beam to cover the entire wafer width of the wafer W, according to some embodiments of the present disclosure. The ion beam then passes into a region surrounded by an acceleration/deceleration column210for adjusting the speed of the ion beam, according to some embodiments of the present disclosure. Then, the ion beam passes into a region covered the magnetic field lines of a final energy magnet (FEM)220, according to some embodiments of the present disclosure. The FEM220functions to adjust the energy of the ions for ion implantation into the wafer W located inside a sample chamber230, according to some embodiments of the present disclosure. The position of the wafer W is maintained during the ion implantation, according to some embodiments of the present disclosure. If the ion beam misses the wafer W may continue to pass to impact on beam stopper250. The wafer W is located on a container (not shown) in a wafer loading chamber280. Then, the wafer is carried through a transition tunnel270between the external environment of the ion implanter and the internal environment of the ion implanter. The transition tunnel270includes a valve or door (not shown) for prevention of contamination, according to some embodiments of the present disclosure. The wafers are then carried into a wafer chamber230by a robotic arm260, according to some embodiments of the present disclosure. FIG.3shows a graph of tool (x-axis) versus energy E (y-axis), indicating variation of energy ΔE obtained from the final energy magnet (FEM) of various ion implanters (i.e. tools A, B, C, D, E, and F), according to some embodiments of the present disclosure.FIG.3shows the energy data points measured for various ion implanters (i.e. tools A, B, C, D, E, and F). For each of the tools, e.g. tool A, numerous data points are taken and the error bars are averaged values over the data points, indicating the energy shift ΔE of less than 2%. Tools B, C, D, E, and F have energy shift ΔE greater than 2%. Only tool A is measured to have energy shift ΔE less than 2%. For an ion implanter to properly function to produce accurate products, the energy shift ΔE is preferably to be less than 2%. For an energy shift ΔE larger than 2%, the depth of the ion implantation and the dose cannot be accurately controlled and the products produced by the ion implanter would be defective or having quality deviated from the quality desired by customers. When a user applies a magnetic field in the FEM220, the user inputs the parameters to achieve the desired energy based on the equation of ion electromagnetic rigidity ρ, i.e. ρ=Br Eq. (1) where B is the applied magnetic field and r is the radius of trajectory of the ion beam. The generated magnetic field B is always not the same as the desired applied magnetic field. Therefore, a shift of magnetic field AB occurs. This shift of magnetic field AB causes the generated magnetic field from the FEM220to be different from the desired applied magnetic field and the energy of the ions outgoing from the FEM220would not be the same as the desired value. Thus, an energy shift ΔE occurs. This energy shift ΔE is required to be corrected so as to achieve an accurate energy value of the implanted ions. FIG.4shows a graph of applied magnetic field B (x axis) versus ion energy E (y axis). In the graph, a calibration curve is shown and the curve indicates the relationship between the measured magnetic field B by a magnetic field probe positioned at the central region of the FEM220and the ion energy E obtained by measuring the radius of curvature r of the ion trajectory and the implanted depth and coverage, according to some embodiments of the present disclosure. When a user operates an ion implanter, the user inputs the parameters to control the applied magnetic field at a value at point410and expects to obtain the desired implantation energy420. However, the actual applied magnetic field measured by a magnetic field probe positioned at the central region of the FEM220is a value at point430due to an energy shift ΔE and the ion energy is thus lowered to point440. Therefore, it may be necessary to control the energy of the ions to have an energy shift ΔE less than 2% and one of the methods to control the energy is by controlling the FEM220, according to some embodiments of the present disclosure. FIG.5shows a sequential process for calibrating the ion implantation apparatus, according to an embodiment of the present disclosure. It is understood that additional operations can be provided before, during, and after processes shown byFIG.5, and some of the operations described below can be replaced or eliminated, for additional embodiments of the method. The order of the operations/processes may be interchangeable. FIG.5shows a flow chart of operations of a method for calibration of the FEM220, according to an embodiment of the present disclosure. In the method, an operation S510is carried out to apply a wafer acceptance test (WAT) recipe to test the sample wafer W1after a test run of ion implantation, according to some embodiments of the present disclosure. The purpose of the WAT is to determine the ion trajectory radius, implantation coverage, and the actually applied magnetic field Bactual, according to some embodiments of the present disclosure. The actually applied magnetic field Bactualcan be used to determine the actual ion energy Eactual, according to some embodiments of the present disclosure. With the values of the ion trajectory radius, implantation coverage, and the actually applied magnetic field Bactualdetermined, operation S520is carried out to calculate the DC recipe, i.e. the nominal parameters of the DC FEM220in the event of ion implantation of the sample W1subjected to WAT, according to some embodiments of the present disclosure. Based on the calculated DC recipe, the nominal applied magnetic field Bnominalis calculated. In this way, the nominal ion energy Enominalis calculated. Then, an operation S530is carried out to calculate the actual ion energy Eactualbased on the results of the WAT of the sample wafer W1, e.g. the actually applied magnetic field Bactual. Then, an operation S540is carried out to verify the tool energy shift ΔE (i.e. |Eactual−Enominal|). Then, an operation S550is carried out to tune the ion implantation apparatus using the tool energy shift ΔE. Then, an operation S560is carried out to obtain the spectrum of the DC FEM220. FIG.6shows a sequential process for calibrating the ion implantation apparatus, according to an embodiment of the present disclosure. It is understood that additional operations can be provided before, during, and after processes shown byFIG.6, and some of the operations described below can be replaced or eliminated, for additional embodiments of the method. The order of the operations/processes may be interchangeable.FIG.6shows a flow chart of operations of a method for calibration of the FEM220, according to an embodiment of the present disclosure. In the method, a calibration curve (with ion energy E being they axis and the applied magnetic field B being the x axis) is obtained in an operation S610, according to some embodiments of the present disclosure. The operation is carried out by running test implantation using various species of gas of different ion masses, e.g. boron and xenon. The actually applied magnetic field B is measured by magnetic field probe positioned at the central region of the FEM220, according to some embodiments of the present disclosure. The actual ion energy E is measured by examining sample wafers during the test runs of the ion implantation. Then, an operation S620is carried out to apply a servo loop to adjust the FEM220based on the calibration curve obtained in the operation S610. Then, a test run on a sample wafer W1is obtained and an operation S630is carried out to apply a wafer acceptance test (WAT) recipe to test the sample wafer W1after a test run of ion implantation, according to some embodiments of the present disclosure. The purpose of the WAT is to determine the ion trajectory radius, implantation coverage, and the actually applied magnetic field Bactual, according to some embodiments of the present disclosure. The actually applied magnetic field Bactualcan be used to determine the actual ion energy Eactual, for example, using the calibration curve obtained from the operation S610, according to some embodiments of the present disclosure. With the values of the ion trajectory radius, implantation coverage, and the actually applied magnetic field Bactualdetermined, operation S640is carried out to calculate the DC recipe, i.e. the nominal parameters of the DC FEM220in the event of ion implantation of the sample W1subjected to WAT, according to some embodiments of the present disclosure. Based on the calculated DC recipe, the nominal applied magnetic field Bnominalis calculated. In this way, the nominal ion energy Enominalis calculated, for example, using the calibration curve obtained from the operation S610. Then, an operation S650is carried out to calculate the actual ion energy Eactualbased on the results of the WAT of the sample wafer W1, e.g. the actually applied magnetic field Bactual. Then, an operation S660is carried out to verify the tool energy shift ΔE (i.e. |Eactual−Enominal|). Then, an operation S670is carried out to tune the ion implantation apparatus using the tool energy shift ΔE. Then, an operation S680is carried out to obtain the spectrum of the DC FEM220. FIG.7shows a graph of applied magnetic field B (x axis) versus ion energy E (y axis) after the operations ofFIG.5orFIG.6. In the graph, a calibration curve of applied magnetic field B (x axis) versus ion energy E (y axis) is shown and the curve indicates the relationship between the applied magnetic field B measured by a magnetic field probe positioned at the central region of the FEM220and the ion energy E obtained by measuring the radius of curvature r of the ion trajectory and the implanted depth and coverage, according to some embodiments of the present disclosure. When a user operates the tuned ion implanter, the user inputs the parameters to control the applied magnetic field at a value at point710and expects to obtain the desired implantation energy at point720. In the ion implanter tuned by using the operations ofFIG.5or6, the actual applied magnetic field measured by a magnetic field probe positioned at the central region of the FEM220is a value at point710due to the fact that the energy shift ΔE becomes nearly zero or less than 2% and the ion energy is thus not lowered and is at point720. Therefore, through operations ofFIG.5or6, the ion implanted is tuned to have an energy shift ΔE less than 2% and the tuned ion implanter produces accurate product with controllable ion implantation depth and dose. FIG.8shows a calibration unit of the FEM220, according to some embodiments of the present disclosure. InFIG.8, a wafer acceptance test (WAT) instrument810is operated to test the wafer W1to obtain the radius of trajectory of the ion beam, ion implantation coverage, and ion implantation depth. The WAT instrument810is a hardware machine to test the sample wafer W1by using optical or tunneling electron method to measure the ion implantation depth, estimated implantation energy, radius of trajectory of ions, etc., according to some embodiments of the present disclosure. The WAT instrument810calculates the applied magnetic field using Eq. (1) based on the radius of trajectory and the ion electromagnetic rigidity, according to some embodiments of the present disclosure. Then, the data resulted from the WAT instrument810is transferred to a DC real energy calculator830to calculate the actual ion energy, according to some embodiments of the present disclosure. In some embodiments, the DC real energy calculator830includes a calibration curve. The DC real energy calculator830includes hardware component such as processor for performing the function of calculation, according to some embodiments of the present disclosure. Then, the data resulted from the DC real energy calculator830are transferred to the tool energy shift verifier840, according to some embodiments of the present disclosure. A DC recipe calculator820functions to perform calculation of nominal applied magnetic field based on the parameters inputted to the ion implanter by the user, according to some embodiments of the present disclosure. The DC recipe calculator820includes hardware component such as processor for performing the function of calculation, according to some embodiments of the present disclosure. Then, the data resulted from the DC recipe calculator820are transferred to the tool energy shift verifier840, according to some embodiments of the present disclosure. The tool energy shift verifier840then calculates the energy shift based on the results obtained from the DC recipe calculator820and DC real energy calculator830, according to some embodiments of the present disclosure. Then, the tool energy shift verifier840outputs result to the ion implantation apparatus tuning unit850which tune the parameters of the ion implanter by, for example, increase/decrease the parameters inputted by the user after the user inputs the parameters, according to some embodiments of the present disclosure. Then, ion implantation apparatus tuning unit850outputs the results to the DC FEM spectrum generator860to generate a spectrum of FEM220. The magnetic spectrum of the FEM220accurately adjusts the ion energy to the user-desired value. FIG.9shows a calibration unit of the FEM220, according to some embodiments of the present disclosure. InFIG.9, a calibration curve obtaining unit910functions to obtain a calibration curve of applied magnetic field (x axis) versus ion energy (y axis). The calibration curve obtaining unit910functions to run test implantation using various species of gas of different ion masses, e.g. boron and xenon. The calibration curve obtaining unit910includes hardware component such as a magnetic field probe and a processor. The actually applied magnetic field B is measured magnetic field probe positioned at the central region of the FEM220, according to some embodiments of the present disclosure. The actual ion energy E is measured by examining sample wafers during the test runs of the ion implantation. The calibration curve obtaining unit910then outputs the result to servo loop unit920. The servo loop unit920functions to adjust the FEM220using a servo loop to adjust the parameters based on the calibration curve obtained from the calibration curve obtaining unit910. The servo loop unit920includes hardware component such as processor to control the parameters of the FEM220. The servo loop unit920then outputs the calibration curve and the parameters obtained from the servo loop operation to a wafer acceptance test (WAT) instrument930. The units and operations930-980ofFIG.9are the same as or similar to the units and operations810-860ofFIG.8. The WAT instrument930is operated to test the wafer W1to obtain the radius of trajectory of the ion beam, ion implantation coverage, and ion implantation depth. The WAT instrument930is a hardware machine to test the sample wafer W1by using optical or tunneling electron method to measure the ion implantation depth, estimated implantation energy, radius of trajectory of ions, etc., according to some embodiments of the present disclosure. The WAT instrument930calculates the applied magnetic field using Eq. (1) based on the radius of trajectory and the ion electromagnetic rigidity, according to some embodiments of the present disclosure. Then, the data resulted from the WAT instrument930is transferred to the DC real energy calculator950to calculate the actual ion energy, according to some embodiments of the present disclosure. In some embodiments, the DC real energy calculator950includes a calibration curve. The DC real energy calculator950includes hardware component such as processor for performing the function of calculation, according to some embodiments of the present disclosure. Then, the data resulted from the DC real energy calculator950are transferred to the tool energy shift verifier960, according to some embodiments of the present disclosure. A DC recipe calculator940functions to perform calculation of nominal applied magnetic field based on the parameters inputted to the ion implanter by the user, according to some embodiments of the present disclosure. The DC recipe calculator940includes hardware component such as processor for performing the function of calculation, according to some embodiments of the present disclosure. Then, the data resulted from the DC recipe calculator940are transferred to the tool energy shift verifier960, according to some embodiments of the present disclosure. The tool energy shift verifier960then calculates the energy shift based on the results obtained from the DC recipe calculator940and DC real energy calculator950, according to some embodiments of the present disclosure. Then, the tool energy shift verifier960outputs result to the ion implantation apparatus tuning unit970which tune the parameters of the ion implanter by, for example, increase/decrease the parameters inputted by the user after the user inputs the parameters, according to some embodiments of the present disclosure. Then, ion implantation apparatus tuning unit970outputs the results to the DC FEM spectrum generator980to generate a spectrum of FEM220. The magnetic spectrum of the FEM220accurately adjusts the ion energy to the user-desired value. FIG.10shows a computer hardware diagram of an ion implantation apparatus, according to some embodiments of the present disclosure. As schematically shown inFIG.10, a generic computer of the ion implanter, e.g. the computer100(FIGS.1and2), includes several functional units connected in parallel to a data communication bus1010, for example of the PCI type. In particular, a Central Processing Unit (CPU)1020, typically comprising a microprocessor, controls the operation of the computer100, a working memory1030, typically a RAM (Random Access Memory) is directly exploited by the CPU1020for the execution of programs and for temporary storage of data, and a Read Only Memory (ROM)1040stores a basic program for the bootstrap of the computer100. The computer100comprises several peripheral units, connected to the bus1010by means of respective interfaces. Particularly, the peripheral units that allow the interaction with a human user are provided, such as a display device1050(for example a cathode ray tube (CRT), a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, or a plasma monitor), a keyboard1060and a pointing device1070(for example a mouse or a trackpoint). The computer100also includes peripheral units for local mass-storage of programs (operating system, application programs) and data, such as one or more magnetic Hard-Disk Drivers (HDD)1080driving magnetic hard disks, a memory card reader1090, and a CD-ROM/DVD driver2000, or a CD-ROM/DVD juke-box, for reading/writing CD-ROMs/DVDs. Other peripheral units may be present, such as a floppy-disk driver for reading/writing floppy disks, a memory card reader for reading/writing memory cards and the like. The computer100is further equipped with a Network Interface Adapter (NIA) card2100for the connection to the data communication network2200such as internet; alternatively, the computer100may be connected to the data communication network2200by means of a MODEM. The system, method, computer program product, and propagated signal described in the present disclosure may, of course, be embodied in hardware; e.g., within or coupled to a Central Processing Unit (“CPU”), microprocessor, microcontroller, System on Chip (“SOC”), or any other programmable device. Additionally, the system, method, computer program product, and propagated signal may be embodied in software (e.g., computer readable code, program code, instructions and/or data disposed in any form, such as source, object or machine language) disposed, for example, in a computer usable (e.g., readable) medium configured to store the software. Such software enables the function, fabrication, modeling, simulation, description and/or testing of the apparatus and processes described herein. For example, this can be accomplished through the use of general programming languages (e.g., C, C++), GDSII databases, hardware description languages (HDL) including Verilog HDL, VHDL, AHDL (Altera HDL) and so on, or other available programs, databases, nanoprocessing, and/or circuit (i.e., schematic) capture tools. Such software can be disposed in any known computer usable medium including semiconductor, magnetic disk, optical disc (e.g., CD-ROM, DVD-ROM, etc.) and as a computer data signal embodied in a computer usable (e.g., readable) transmission medium (e.g., carrier wave or any other medium including digital, optical, or analog-based medium). As such, the software can be transmitted over communication networks including the Internet and intranets. A system, method, computer program product, and propagated signal embodied in software may be included in a semiconductor intellectual property core (e.g., embodied in HDL) and transformed to hardware in the production of integrated circuits. Additionally, a system, method, computer program product, and propagated signal as described herein may be embodied as a combination of hardware and software. Any suitable programming language can be used to implement the routines of the present invention including C, C++, Java, assembly language, etc. Different programming techniques can be employed such as procedural or object oriented. The routines can execute on a single processing device or multiple processors. Although the steps, operations or computations may be presented in a specific order, this order may be changed in different embodiments. In some embodiments, multiple steps shown as sequential in this specification can be performed at the same time. The sequence of operations described herein can be interrupted, suspended, or otherwise controlled by another process, such as an operating system, kernel, etc. The routines can operate in an operating system environment or as stand-alone routines occupying all, or a substantial part, of the system processing. In the description herein, numerous specific details are provided, such as examples of components and/or methods, to provide a thorough understanding of embodiments of the present invention. One skilled in the relevant art will recognize, however, that an embodiment of the invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention. A “computer-readable medium” for purposes of embodiments of the present invention may be any medium that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, system or device. The computer readable medium can be, by way of example only but not by limitation, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, system, device, propagation medium, or computer memory. A “processor” or “process” includes any human, hardware and/or software system, mechanism or component that processes data, signals or other information. A processor can include a system with a general-purpose central processing unit, multiple processing units, dedicated circuitry for achieving functionality, or other systems. Processing need not be limited to a geographic location, or have temporal limitations. For example, a processor can perform its functions in “real time,” “offline,” in a “batch mode,” etc. Portions of processing can be performed at different times and at different locations, by different (or the same) processing systems. Reference throughout this specification to “one embodiment”, “an embodiment”, or “a specific embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention and not necessarily in all embodiments. Thus, respective appearances of the phrases “in one embodiment”, “in an embodiment”, or “in a specific embodiment” in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined in any suitable manner with one or more other embodiments. It is to be understood that other variations and modifications of the embodiments of the present invention described and illustrated herein are possible in light of the teachings herein and are to be considered as part of the spirit and scope of the present invention. Embodiments of the invention may be implemented by using a programmed general purpose digital computer, by using application specific integrated circuits, programmable logic devices, field programmable gate arrays, optical, chemical, biological, quantum or nanoengineered systems, components and mechanisms may be used. In general, the functions of the present invention can be achieved by any means as is known in the art. Distributed, or networked systems, components and circuits can be used. Communication, or transfer, of data may be wired, wireless, or by any other means. It will also be appreciated that one or more of the elements depicted in the drawings/figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application. It is also within the spirit and scope of the present invention to implement a program or code that can be stored in a machine-readable medium to permit a computer to perform any of the methods described above. Additionally, any signal arrows in the drawings/Figures should be considered only as exemplary, and not limiting, unless otherwise specifically noted. Furthermore, the term “or” as used herein is generally intended to mean “and/or” unless otherwise indicated. Combinations of components or steps will also be considered as being noted, where terminology is foreseen as rendering the ability to separate or combine is unclear. As used in the description herein and throughout the claims that follow, “a”, “an”, and “the” includes plural references unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise. Using the above mentioned methods, e.g. inFIGS.5and6, the calibration of the FEM220involves mostly computer calculation without the need to change gas cylinders for performing numerous laborious experiments to obtain a graph of calibration curve. The calibration methods thus reduce the time needed for calibration of ion implantation apparatus, especially when there are numerous ion implantation apparatus that needed to be calibrated. It will be understood that not all advantages have been necessarily discussed herein, no particular advantage is required for all embodiments or examples, and other embodiments or examples may offer different advantages. According to some embodiments of the present disclosure, a method of tuning an ion implantation apparatus is disclosed. The method includes an operation of applying a wafer acceptance test (WAT) recipe to a test sample. An operation of calculating a recipe for a direct current (DC) final energy magnet (FEM). An operation of calculating a real energy of the DC FEM. An operation of verifying a tool energy shift. An operation of tuning the ion implantation apparatus based on the verified tool energy shift. An operation of obtaining a magnetic spectrum of the DC FEM. The method further includes an operation of obtaining a calibration curve of the DC FEM. The method further includes an operation of performing servo loop to adjust parameters of the DC FEM. The recipe for the DC FEM includes an applied magnetic field. The tool energy shift is verified by calculating a difference between a nominal energy and the real energy. The nominal energy is obtained by calculating a nominal applied magnetic field. The nominal applied magnetic field is calculated based on parameters entered by a user. The real energy is obtained by calculating an actual applied magnetic field by data obtained from the process of applying the WAT recipe to a test sample. According to some embodiments of the present disclosure, a method of tuning a final energy magnet (FEM) is disclosed. The method includes an operation of obtaining a calibration curve of the DC FEM. An operation of performing servo loop to adjust parameters of the DC FEM. An operation of applying a wafer acceptance test (WAT) recipe to a test sample. An operation of calculating a recipe for a direct current (DC) final energy magnet (FEM). An operation of calculating a real energy of the DC FEM. An operation of verifying a tool energy shift. An operation of tuning the DC FEM based on the verified tool energy shift. An operation of obtaining a peak spectrum of the DC FEM. The recipe for the DC FEM includes an applied magnetic field. The tool energy shift is verified by calculating a difference between a nominal energy and the real energy. The nominal energy is obtained by calculating a nominal applied magnetic field. The nominal applied magnetic field is calculated based on parameters entered by a user. The real energy is obtained by calculating an actual applied magnetic field by data obtained from the process of applying the WAT recipe to a test sample. According to some embodiments of the present disclosure, an ion implantation system is disclosed. The system includes a sample platform, an ion gun, an electrostatic linear accelerator, and a direct current (DC) final energy magnet (FEM) tuned by operations of applying a wafer acceptance test (WAT) recipe to a test sample on the sample platform, calculating a recipe for the DC FEM, calculating a real energy of the DC FEM, verifying a tool energy shift of the DC FEM, tuning the DC FEM based on the verified tool energy shift, and obtaining a peak spectrum of the DC FEM. The system further includes that the DC FEM is tuned by obtaining a calibration curve of the DC FEM. Also, the system further includes that the DC FEM is tuned by performing servo loop to adjust parameters of the DC FEM. The recipe for the DC FEM includes an applied magnetic field. The tool energy shift is verified by calculating a difference between a nominal energy and the real energy. The nominal energy is obtained by calculating a nominal applied magnetic field. The foregoing outlines features of several embodiments or examples so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments or examples introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. | 46,496 |
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