patent_id
stringlengths 7
8
| description
stringlengths 125
2.47M
| length
int64 125
2.47M
|
|---|---|---|
11862833 | A component or a feature that can be common to more than one embodiment or drawing is indicated with the same reference number in each of the drawings and the detailed descriptions thereof. DETAILED DESCRIPTION OF THE DISCLOSURE FIG.1shows a perspective view of a coupling assembly101according to the present disclosure. Coupling assembly101has a first portion10that can be connected and disconnected via a bayonet locking mechanism by a user, easily by hand to a second portion50. First portion10has a first waveguide portion15that is joined to and/or connectable to a hollow cylindrical portion20. The first waveguide portion15of coupling assembly101is circular, so that the waveguide portion15is a hollow cylindrical tube. In some embodiments, waveguide portion15has an outer diameter that is less than the outer diameter of hollow cylindrical portion20. At the interface or point of connection between portion15and portion20, there is a flat surface16that is perpendicular to a central axis of the coupling assembly101that extends through the center of the hollow circular waveguide15. Flat surface16has a varying surface area, that increases when the outer diameter of waveguide portion15decreases and decreases when the outer diameter of waveguide portion15increases. In some embodiments, waveguide portion15, flat surface16and cylindrical portion20are a single unitary piece. In some embodiments, first waveguide portion15provides a connection for a first device such as an antenna. In some embodiments, cylindrical portion20has four protrusions25, for use in locking and unlocking first portion10and second portion50together. In some embodiments, cylindrical portion20has at least one, or least two or at least four protrusions25. In some embodiments, four protrusions are preferred, as this embodiment allows axial alignment of the antenna and radio in 90-degree steps reflecting Vertical and Horizontal polarization planes of the linear polarization of both electromagnetic waves radiating from the antenna and fields inside of the waveguides. Protrusions25are located on the outer edge of the circumference of the cylindrical portion20that is closest to the second portion50when the first and second portions are connected. Protrusions25extend outward from the cylindrical portion20in a perpendicular direction to the central axis of the coupling assembly101. If more than one protrusion25is present in a particular embodiment of the coupling assembly, then these protrusions are spaced equidistant from each other along the circumference of the cylindrical portion20. Cylindrical portion20, has a width21. Each protrusion25has a width26that is less than width21of Cylindrical portion20. Protrusion25is part of a first portion of a bayonet locking mechanism that works in conjunction with the second portion of the mechanism located on second portion50. Second portion50has a second waveguide portion55that is joined to and/or connectable to a hollow cylindrical portion70. The second waveguide portion55of coupling assembly101is circular, so that the waveguide portion55is a hollow cylindrical tube. In some embodiments, waveguide portion55has an outer diameter that is less than the outer diameter of hollow cylindrical portion70. At the interface or point of connection between portion55and portion70, there is a flat surface56that is perpendicular to the central axis of the coupling assembly101that extends through the center of the waveguide55. In some embodiments, flat surface56has a varying surface area, that increases when the outer diameter of waveguide portion55decreases and decreases when the outer diameter of waveguide portion55increases. In some embodiments, waveguide portion55, flat surface56and cylindrical portion70are a single unitary piece. In some embodiments, second waveguide portion55provides a connection for a second device such as a radio. Second portion50has an inner cylindrical tube portion80that interconnects with the inner portion of hollow cylindrical portion20and the inner portion of first waveguide portion15, when the second portion50is connected via the bayonet locking mechanism to the first portion10. In some embodiments, the inner diameter of the cylindrical tube portion80matches the inner diameter of the waveguide portion15. In some embodiments, the inner diameter of the cylindrical tube portion80is less than the inner diameter of the first waveguide portion15. In some embodiments, the inner cylindrical tube portion80and the second waveguide portion55, are joined as a single unitary piece, that is connected as shown inFIG.1, with cylindrical tube portion70. Cylindrical tube portion70has a flat surface56on the side adjacent to second waveguide portion55as shown inFIG.1. On the other side of flat surface56, flat surface75is the inner flat surface of cylindrical tube portion70as shown inFIG.1. Cylindrical tube portion70has an outer diameter and an inner diameter. Tabs60extend inward from the inner diameter of cylindrical tube portion70, towards the inner cylindrical tube portion80. Gaps65are present where the tabs60are absent and are spaced equidistant from each other depending on the number of gaps65. In some preferred the number of gaps65match the number of protrusions25. In some embodiments, the number of protrusions25do not match the number of gaps65. Cylindrical tube portion70has a width dimension71. Gaps65remain gaps until flat surface75. Tabs60have a width61that is less than the full width71of Cylindrical tube portion70. The gap between the Tabs60and the flat surface75is width62. Width62is at least equal to or greater than width26of the protrusion25, so that when the bayonet locking mechanism is engaged to lock or unlock the coupling assembly portion10and50together, protrusion25can fit into the gap or width62between tab60and flat surface75. To engage the bayonet locking mechanism the first portion10is first aligned so that each protrusion25aligns with each gap65on the second portion50. The first portion10and second portion50are then brought closer together so that the protrusions25pass through the gaps65, and the cylindrical tube portion80passes through the center of the cylindrical tube portion20, so that the cylindrical tube portion80is adjacent to the inner portion of first waveguide portion15. The first portion10or second portion50is turned either clockwise or counterclockwise to lock portions10and50together. When portions10and50are locked together, each protrusion25is between a respective tab60and surface75, so that the portions10and50cannot be disengaged without turning the portions10or50clockwise or counterclockwise, so that the protrusions align again with gaps65, so that the portions10and50can be separated. FIG.2shows a front view and side cross sectional view of coupling assembly101. In some embodiments, cylindrical tube portion20and/or the inner portion of first waveguide portion15have a cut out or recess portion19to receive a portion of cylindrical tube portion80, so that no gaps between the inner wall of waveguide15and cylindrical tube portion80occur as shown inFIG.2, when cylindrical tube portion80is fully inserted. In some embodiments, when cylindrical tube portion80is fully inserted into recess portion19, recess portion19provides a stopping point for the insertion of tube portion80, so that protrusions25can be inserted past gaps65, and the bayonet locking mechanism is rotated to lock the portions10and50together with a frictional force. In some embodiments, due to the surface contact between protrusion25, tab60and the interior portion of the tube portion70, frictional forces are created that ensure the locking mechanism remains locked and does not rotate out of place without a user manually unlocking the mechanism by rotating the coupling assembly101. Referring toFIG.3, the embodiment of coupling assembly102is identical to the embodiment of coupling assembly101shown inFIGS.1-2, except that the waveguide15and tube portion80of embodiment102, each have outer and inner diameters that are smaller when compared to the outer and inner diameters of the corresponding waveguide15and tube portion80of embodiment101as shown inFIGS.1-2. Furthermore, the areas of flat surface16and75is greater in embodiment102as compared to corresponding areas of embodiment101, since the diameters of waveguide portion15and tube portion80is smaller, and since the outer diameters of the tube portions20and70remain the same as in embodiment101. Referring toFIG.4, the embodiment of coupling assembly103is identical to the embodiment of coupling assembly102shown inFIG.3, except that the waveguide15and tube portion80of embodiment103, each have outer and inner diameters that are smaller when compared to the outer and inner diameters of the corresponding waveguide15and tube portion80of embodiment102as shown. Furthermore, the areas of flat surface16and75is greater in embodiment103as compared to corresponding areas of embodiment102, since the diameters of waveguide portion15and tube portion80is smaller, and since the outer diameters of the tube portions20and70remain the same as in embodiment102and101. Referring toFIG.5an embodiment of a coupling assembly201having a non-circular waveguide is shown. In particular coupling assembly201has a first portion210that can be connected to a second portion250. Coupling assembly201is identical to coupling assembly101as shown inFIGS.1-2, except that first wave guide portion215, inner guide portion280and second waveguide portion255are square shaped, and not circular. Referring toFIG.6an embodiment of a coupling assembly202having a non-circular waveguide is shown. Assembly202is identical to assembly201, except that first waveguide215, inner guide portion280, and second waveguide portion255has a smaller square perimeter than assembly201ofFIG.5. Assemblies201and202ofFIGS.5and6can be joined together in same manner as described above with regards to assemblies101,102and103ofFIGS.1-4. While coupling assemblies101,102, and103have circular waveguides, and coupling assemblies201and202have square waveguides, other waveguide shapes such as triangular, oblong and elliptical, or other waveguide shapes can be used along with the coupling assembly of the present disclosure. FIGS.7A-7F,8A-8F,9A-9F,10A-10F,11A-11F, and12A-12Fas described below, refer to the embodiments101,102, and103as described above, and further describe additional information and alterations to the above embodiments such as but not limited to the use of spacers, casings, integrated spacers, and the use of different sized or varying inner diameters. Referring toFIG.7A, a top cross-sectional view of an embodiment of coupling assembly101is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. Second waveguide portion55and inner tube portion80can be a unitary single piece that are connected to cylindrical portion70through a central circular hole in portion70. At the boundary between the outer diameter of second waveguide55and the outer diameter of tube portion80, is protrusion57that is at the diameter of the second waveguide55. Protrusion57comes into contact with flat surface56, so as to prevent second waveguide portion55from passing through the central hole in portion70and keeps waveguide portion55within casing90as shown. The central hole in cylindrical portion70is at the same diameter size as the outer diameter of inner tube portion80. Coupling assembly101as shown inFIG.7A, has a first waveguide portion15with an inner diameter17, that is the same as the inner diameter of inner tube portion80and second waveguide portion55. Recess19has a diameter that is equal to the outer diameter of inner tube portion80and can receive a portion of tube80. Referring toFIG.7B, a top cross-sectional view of an embodiment of coupling assembly102is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. Second waveguide portion55and inner tube portion80can be a unitary single piece that are connected to cylindrical portion70through a central circular hole in portion70. As shown inFIG.7B, the inner diameter of the first wave guide15, inner tube portion80and second waveguide portion55have the same inner diameter17. The inner diameter17of coupling assembly102is smaller than the inner diameter17of coupling assembly101. At the boundary between the greater outer diameter of second waveguide55and the lesser outer diameter of tube portion80, is protrusion57that is at the diameter of the second waveguide55. The central hole in cylindrical portion70of coupling assembly102as shown inFIG.7Bis the same size as the central hole portion70as shown in the coupling assembly101as shown inFIG.7A. Due to the difference in diameters of the hole in cylindrical portion70in coupling102and the outer diameter of tube portion80in coupling assembly102, a spacer95must be placed between the central hole in portion70and the outer portion of tube80, to keep tube80in place and keeps waveguide portion55within casing90as shown. Protrusion57comes into contact with spacer95, and spacer95comes into contact with flat surface56. When spacer95is placed between the hole and tube80, spacer95bridges the gap between the hole and the diameter of tube80, while a portion of spacer95fits around second waveguide55and contacts surface56. Recess19of coupling assembly102has a diameter that is equal to the outer diameter of inner tube portion80of coupling assembly102so that the recess19can receive a portion of inner tube80. Referring toFIG.7C, a top cross-sectional view of an embodiment of coupling assembly103is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. Second waveguide portion55and inner tube portion80can be a unitary single piece that are connected to cylindrical portion70through a central hole in portion70. Coupling assembly103as shown inFIG.7C, as a first waveguide portion15with an inner diameter17, that is the same as the inner diameter of inner tube portion80and second waveguide portion55. The inner diameter17of coupling assembly103is smaller than the inner diameter17of coupling assembly102. At the boundary between the outer diameter of second waveguide55and the outer diameter of tube portion80, is protrusion57that is at the diameter of the second waveguide55of coupling assembly103. The central hole in cylindrical portion70of coupling assembly103as shown inFIG.7Cis the same size as the central hole in portion70of coupling assembly101as shown inFIG.7A. Due to the difference in diameters of the central hole in cylindrical portion70in coupling assembly103and the outer diameter of tube portion80in coupling assembly103, a spacer95must be placed between the central hole in portion70and the outer portion of tube80, to keep tube80in place. When spacer95is placed between the hole and tube80, spacer95bridges the gap between the hole and the diameter of tube80, while a portion of spacer95fits around second waveguide55and contacts surface56. Protrusion57comes into contact with spacer95, and spacer95comes into contact with flat surface56. Spacer95of coupling assembly103is greater in size than the spacer95of coupling assembly102. Recess19of coupling assembly103has a diameter that is equal to the outer diameter of inner tube portion80of coupling assembly103so that the recess19can receive a portion of inner tube80. Referring toFIG.7D, a perspective view of the embodiment101ofFIG.7Ais shown. Referring toFIG.7E, a perspective view of the embodiment102ofFIG.7Bis shown. Referring toFIG.7F, a perspective view of the embodiment103ofFIG.7Cis shown. Referring toFIG.8A, a top cross-sectional view of an embodiment of coupling assembly101is shown, that is identical to the embodiment of coupling assembly101as shown inFIG.7Aand described above. Referring toFIG.8B, a top cross-sectional view of an embodiment of coupling assembly102is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. As shown inFIG.8B, the inner diameter of the first wave guide15, inner tube portion80and second waveguide portion55have the same inner diameter17. The inner diameter17of coupling assembly102is smaller than the inner diameter17of coupling assembly101ofFIG.8A. At the boundary between the greater outer diameter of second waveguide55and the lesser outer diameter of tube portion80, is an integrated spacer96, or referred to as protrusion96. Protrusion57ofFIG.8Ais not present in the embodiments shown inFIGS.8B and8C. The central hole in cylindrical portion70of coupling assembly102as shown inFIG.8Bis the same size as the central hole portion70as shown in the coupling assembly101as shown inFIG.8A. Due to the difference in diameters of the hole in cylindrical portion70in coupling102and the outer diameter of tube portion80in coupling assembly102, protrusion96increases the diameter, to keep tube80in place and keeps waveguide portion55within casing90as shown. Protrusion96comes into contact with flat surface56. Protrusion96is part of a single unitary piece that includes inner tube80, and second waveguide55. Recess19of coupling assembly102has a diameter that is equal to the outer diameter of inner tube portion80of coupling assembly102so that the recess19can receive a portion of inner tube80. Referring toFIG.8C, a top cross-sectional view of an embodiment of coupling assembly103is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. Coupling assembly103as shown inFIG.8C, has a first waveguide portion15with an inner diameter17, that is the same as the inner diameter of inner tube portion80and second waveguide portion55. The inner diameter17of coupling assembly103as shown inFIG.8Cis smaller than the inner diameter17of coupling assembly102as shown inFIG.8B. At the boundary between the greater outer diameter of second waveguide55and the lesser outer diameter of tube portion80, is protrusion96. The central hole in cylindrical portion70of coupling assembly103as shown inFIG.8Cis the same size as the coupling assembly101as shown inFIG.8A. Due to the difference in diameters of the hole in cylindrical portion70in coupling103and the outer diameter of tube portion80in coupling assembly103, protrusion96increases the diameter of tube80, to keep tube80in place and keeps waveguide portion55within casing90as shown. Protrusion96comes into contact with flat surface56. Protrusion96is part of a single unitary piece that includes inner tube80, and second waveguide55. Protrusion96of coupling assembly103is greater in size than the Protrusion96of coupling assembly102. Recess19of coupling assembly103has a diameter that is equal to the outer diameter of inner tube portion80of coupling assembly103so that the recess19can receive a portion of inner tube80. Referring toFIG.8D, a perspective view of the embodiment101ofFIG.8Ais shown. Referring toFIG.8E, a perspective view of the embodiment102ofFIG.8Bis shown. Referring toFIG.8F, a perspective view of the embodiment103ofFIG.8Cis shown. Referring toFIG.9A, a top cross-sectional view of an embodiment of coupling assembly101is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. Second waveguide portion55and inner tube portion80can be a unitary single piece that are connected to cylindrical portion70through a central circular hole in portion70. At the boundary between the outer diameter of second waveguide55and the outer diameter of tube portion80, is protrusion57that is at the diameter of the second waveguide55. Protrusion57comes into contact with flat surface56, so as to prevent second waveguide portion55from passing through the central hole in portion70and keeps waveguide portion55within casing90as shown. The central hole in cylindrical portion70is at the same diameter size as the outer diameter of inner tube portion80. Coupling assembly101as shown inFIG.9A, has a first waveguide portion15with an inner diameter17, that is larger than the inner diameter81of inner tube portion80. The inner diameter81of tube portion80is the same as the inner diameter of the second waveguide portion55. The embodiment of coupling assembly101as shown inFIG.9Adoes not have a recess19to receive a portion of tube80. In some embodiments, the outer diameter of tube portion80is the same as the inner diameter17of first waveguide portion15. The coupling assembly101as shown inFIG.9Atherefore has two varying inner diameters17and81. In some embodiments, a varying inner diameter also referred to as an offset diameter can be useful for specific purposes such as impedance matching, and waveguide mode conversion and can be changed as needed for a particular antenna design. Referring toFIG.9B, a top cross-sectional view of an embodiment of coupling assembly102is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. Second waveguide portion55and inner tube portion80can be a unitary single piece that are connected to cylindrical portion70through a central hole in portion70. As shown inFIG.9B, the inner diameter17of the first wave guide15, is larger than the inner diameter81of tube portion80. Tube portion80and second waveguide portion55have the same inner diameter81. The inner diameter17of coupling assembly102as shown inFIG.9Bis smaller than the inner diameter17of coupling assembly101as shown inFIG.9A. At the boundary between the outer diameter of second waveguide55and the outer diameter of tube portion80, is protrusion57that is at the diameter of the second waveguide55. The central hole in cylindrical portion70of coupling assembly102as shown inFIG.9Bis the same size as the central hole portion70as shown in the coupling assembly101as shown inFIG.9A. Due to the difference in diameters of the hole in cylindrical portion70in coupling102and the outer diameter of tube portion80in coupling assembly102, a spacer95must be placed between the central hole in portion70and the outer portion of tube80, to keep tube80in place and keeps waveguide portion55within casing90as shown. Protrusion57comes into contact with spacer95, and spacer95comes into contact with flat surface56. When spacer95is placed between the hole and tube80, spacer95bridges the gap between the hole and the diameter of tube80, while a portion of spacer95fits around second waveguide55and contacts surface56. The embodiment of coupling assembly102as shown inFIG.9Bdoes not have a recess19to receive a portion of tube80. In some embodiments, the outer diameter of tube portion80is the same as the inner diameter17of first waveguide portion15. The coupling assembly102as shown inFIG.9Btherefore has two varying inner diameters17and81with diameter17being greater than diameter81. The inner diameter17and inner diameter81of coupling assembly102as shown inFIG.9Bis smaller than the inner diameter17and inner diameter81of coupling assembly101as shown inFIG.9A. Referring toFIG.9C, a top cross-sectional view of an embodiment of coupling assembly103is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. Second waveguide portion55and inner tube portion80can be a unitary single piece that are connected to cylindrical portion70through a central hole in portion70. As shown inFIG.9C, the inner diameter17of the first wave guide15, is larger than the inner diameter81of tube portion80. Tube portion80and second waveguide portion55have the same inner diameter81. The inner diameter17of coupling assembly102as shown inFIG.9Cis smaller than the inner diameter17of coupling assembly101as shown inFIG.9B. At the boundary between the outer diameter of second waveguide55and the outer diameter of tube portion80, is protrusion57that is at the diameter of the second waveguide55. The central hole in cylindrical portion70of coupling assembly102as shown inFIG.9Cis the same size as the central hole portion70as shown in the coupling assembly101as shown inFIG.9A. Due to the difference in diameters of the hole in cylindrical portion70in coupling assembly103and the outer diameter of tube portion80in coupling assembly103, a spacer95must be placed between the central hole in portion70and the outer portion of tube80, to keep tube80in place and keeps waveguide portion55within casing90as shown. Protrusion57comes into contact with spacer95, and spacer95comes into contact with flat surface56. When spacer95is placed between the hole and tube80, spacer95bridges the gap between the hole and the diameter of tube80, while a portion of spacer95fits around second waveguide55and contacts surface56. The embodiment of coupling assembly103as shown inFIG.9Cdoes not have a recess19to receive a portion of tube80. In some embodiments, the outer diameter of tube portion80is the same as the inner diameter17of first waveguide portion15. The coupling assembly103as shown inFIG.9Ctherefore has two varying inner diameters17and81with diameter17being greater than diameter81. The inner diameter17and inner diameter81of coupling assembly103as shown inFIG.9Cis smaller than the inner diameter17and inner diameter81of coupling assembly102as shown inFIG.9B. Spacer95of coupling assembly103as shown inFIG.9Cis greater in size than the spacer95of coupling assembly102as shown inFIG.9B. Referring toFIG.9D, a perspective view of the embodiment101ofFIG.9Ais shown. Referring toFIG.9E, a perspective view of the embodiment102ofFIG.9Bis shown. Referring toFIG.9F, a perspective view of the embodiment103ofFIG.9Cis shown. Referring toFIG.10A, a top cross-sectional view of an embodiment of coupling assembly101is shown, that is identical to the embodiment of coupling assembly101as shown inFIG.9Aand described above. Referring toFIG.10B, a top cross-sectional view of an embodiment of coupling assembly102is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. The inner diameter17and inner diameter81of coupling assembly102as shown inFIG.10Bis smaller than the inner diameter17and inner diameter81of coupling assembly101as shown inFIG.10A. At the boundary between the outer diameter of second waveguide55and the smaller outer diameter of tube portion80, is protrusion96. Protrusion57is not present in the embodiments shown inFIGS.10B and10C. The central hole in cylindrical portion70of coupling assembly102as shown inFIG.10Bis the same size as the central hole in portion70in the coupling assembly101as shown inFIG.10A. Due to the difference in diameters of the central hole in cylindrical portion70in coupling assembly102and the outer diameter of tube portion80in coupling assembly102, protrusion96is required to increase the diameter of tube80, to keep tube80in place and keeps waveguide portion55within casing90as shown. A portion of protrusion96comes into contact with flat surface56. Protrusion96is part of a single unitary piece that includes inner tube80, and second waveguide55. The embodiment of coupling assembly102as shown inFIG.10Bdoes not have a recess19to receive a portion of tube80. In some embodiments, the outer diameter of tube portion80is the same as the inner diameter17of first waveguide portion15. The coupling assembly102as shown inFIG.10Bhas two varying inner diameters17and81with diameter17being greater than diameter81. Referring toFIG.10C, a top cross-sectional view of an embodiment of coupling assembly103is shown. In some embodiments, cylindrical portion70is connected to an outer casing90. Outer casing90, in some embodiments, can be a housing for a device such as a radio. The inner diameter17and inner diameter81of coupling assembly103as shown inFIG.10Cis smaller than the inner diameter17and inner diameter81of coupling assembly101as shown inFIG.10B. At the boundary between the outer diameter of second waveguide55and the smaller outer diameter of tube portion80, is protrusion96. The central hole in cylindrical portion70of coupling assembly103as shown inFIG.10Cis the same size as the central hole in portion70as shown in the coupling assembly101as shown inFIG.10A. Due to the difference in diameters of the central hole in cylindrical portion70in coupling103and the outer diameter of tube portion80in coupling assembly103, protrusion96is required to increase the diameter of tube80, to keep tube80in place and keeps waveguide portion55within casing90as shown. A portion of protrusion96comes into contact with flat surface56. Protrusion96is part of a single unitary piece that includes inner tube80, and second waveguide55. The embodiment of coupling assembly103as shown inFIG.10Cdoes not have a recess19to receive a portion of tube80. In some embodiments, the outer diameter of tube portion80is the same as the inner diameter17of first waveguide portion15. The coupling assembly103as shown inFIG.10Ctherefore has two varying inner diameters17and81, with diameter17being greater than diameter81. Referring toFIG.10D, a perspective view of the embodiment101ofFIG.10Ais shown. Referring toFIG.10E, a perspective view of the embodiment102ofFIG.10Bis shown. Referring toFIG.10F, a perspective view of the embodiment103ofFIG.10Cis shown. Referring toFIG.11A, a coupling assembly101is shown with a touch contact type connection. The coupling assembly101as shown inFIG.11Ais identical to the coupling assembly101as shownFIG.7A, except that no insert portion or recess19is present. Furthermore, a bottom flat surface of the inner portion80, contacts the flat inner surface18of waveguide15as shown. Referring toFIG.11B, a coupling assembly102is shown with a touch contact type connection. Coupling assembly102is identical to coupling assembly101, as shown inFIG.11A, except the that waveguide55, inner portion80, and waveguide15have a smaller size or diameter. As the cylindrical locking portions70and20are the same size as in the embodiment of coupling assembly101, a spacer95must be used to bridge the distance between the hole in surface56and the diameter of waveguide55as described above. Referring toFIG.11C, a coupling assembly103is shown with a touch contact type connection. Coupling assembly103is identical to coupling assembly102as shown inFIG.11B, except the that waveguide55, inner portion80, and waveguide15have a smaller size or diameter. As the cylindrical locking portions70and20are the same size as in the embodiment of coupling assembly101, a larger spacer95must be used to bridge the distance as described above. Referring toFIG.11D, a perspective view of the embodiment101ofFIG.11Ais shown. Referring toFIG.11E, a perspective view of the embodiment102ofFIG.11Bis shown. Referring toFIG.11F, a perspective view of the embodiment103ofFIG.11Cis shown. Referring toFIG.12A, a coupling assembly101is shown with a touch contact type connection that is identical to the embodiment as shown inFIG.11A. Referring toFIG.12B, a coupling assembly102is shown with a touch contact type connection that is identical to the embodiment as shown inFIG.11B, except that an integrated spacer96is used instead of a separate spacer95ofFIG.11B. Referring toFIG.12C, a coupling assembly103is shown with a touch contact type connection that is identical to the embodiment as shown inFIG.11C, except that an integrated spacer96is used instead of a separate spacer95ofFIG.11C. Referring toFIG.12D, a perspective view of the embodiment101ofFIG.12Ais shown. Referring toFIG.12E, a perspective view of the embodiment102ofFIG.12Bis shown. Referring toFIG.12F, a perspective view of the embodiment103ofFIG.12Cis shown. Referring toFIG.13A, a coupling assembly501of the contact touch type is shown. Examples of the contact touch type501are shown and described inFIGS.11A-11F and12A-12F, andFIG.14. In some embodiments, the contact touch type allows easier connection of non-circular waveguides, such as square, triangular or other shapes, as the insertion type coupling assembly502(FIG.13B) or offset diameter type503(FIG.13C) may not allow a non-circular waveguide to rotate during locking or other types of adjustments. Referring toFIG.13B, a coupling assembly of the insertion type coupling assembly502is shown. Examples of the insertion type coupling assembly502are shown and described inFIGS.7A-7F and8A-8F. Referring toFIG.13C, a coupling assembly of the diameter offset type coupling assembly503is shown. Examples of the diameter offset type coupling assembly503are shown and described inFIGS.9A-9F and10A-10F. Referring toFIG.14, a coupling assembly201with square waveguides255,215and square inner portion280is shown, connected with a contact touch type coupling501as described above. For square, and other non-circular wave guide configurations, a contact touch type coupling501is used, along with an additional gap22between the wall of inner portion280and the inner wall of cylindrical portion20, so that the inner portion280may freely rotate within the internal area between portions20and70, when portions210and250are connected. Referring toFIG.15Aa perspective view of a cross sectional portion of a second waveguide portion55is shown in contact with a cross sectional portion of a separate spacer95. Protrusions57of the wave guide portion55come into contact with an indented portion94on a first side pf the spacer95as shown inFIG.16A. Indented portions97on a second side of the spacer95come in contact with the flat surface56of the coupling. The spacer95retains the second waveguide portion55in place when the waveguide size or diameter is smaller than the hole in the standard sized locking portion70as described above. Waveguide portion55and spacer95are shown and described inFIGS.7B,7E,9B,9E,11B and11E. Referring toFIG.15Ba perspective view of a cross sectional portion of a smaller second waveguide portion55is shown in contact with a cross sectional portion of a separate larger spacer95. Waveguide portion55and spacer95are shown and described inFIGS.7C,7F,9C,9F,11C and11F. Referring toFIG.16Aa top view and side cross sectional view of the spacer95as shown inFIG.15Ais illustrated. Referring toFIG.16Ba top view and side cross sectional view of the spacer95as shown inFIG.15Bis illustrated. Referring toFIG.17Aa perspective view of a cross sectional portion of a waveguide55is shown, with an integrated spacer96. Indented portions97on the integrated spacer96come in contact with the flat surface56of the coupling. Waveguide portion55and integrated spacer96are shown and described inFIGS.8B,8E,10B,10E,12B and12E. Referring toFIG.17Ba perspective view of a cross sectional portion of a smaller waveguide55is shown with a larger integrated spacer96. Waveguide portion55and integrated spacer96are shown and described inFIGS.8C,8F,10C,10F,12C and12F. Referring toFIG.18, a coupling assembly600is shown. Coupling assembly600is a example of the coupling assemblies101,102,103,201, and202as described above, and has a first waveguide portion615, and a second waveguide portion655that are connected together by a locking mechanism610. Coupling assembly600can have any sized or shaped waveguide615connected to any sized and shaped waveguide portion655, connected together by a locking mechanism610that remains that same size and shape, regardless of whether the waveguide portions on either end of the locking mechanism are reduced in size, or vary in shape, size or diameter, thereby providing a quick swappable interface for changing waveguide shapes and sizes as needed for field installations. This feature also allows for easier manufacturing of the locking mechanism, and first and second waveguide portions, thereby reducing costs. While locking mechanism610is shown to be a twist type locking mechanism similar to those described above, locking mechanism610can be any type of locking mechanism such as for example those described inFIGS.19and20Abelow. Similarly, while only square and circular waveguides are shown at615and655, any shaped waveguide can be used, such as triangular, rectangular, oblong, elliptical and other commonly used waveguide shapes. Referring toFIG.19, three examples of possible locking mechanisms610are shown as mechanisms710,720and730. Locking mechanism710can be connected together by screws or bolts through holes711around the circumference of the locking mechanism. Locking mechanism720can be connected by twisting a first portion with threads721into a second portion with corresponding grooves (also referred to with number721) around the circumference of the locking mechanism. Locking mechanism730is similar to the twist type locking mechanism as shown and described inFIGS.1-14, with the addition of a locking tab protrusion731on both protrusions25and tabs60. When cylindrical portions20and70and locked together by twisting, protrusions731located on protrusions25and tabs60come into contact with each other and prevent further rotation. A further locking mechanism800is described inFIGS.20A and20B. Referring toFIGS.20A and20B, a locking mechanism800is shown that can be used as a locking mechanism610as shown inFIG.18. Locking mechanism800has a first portion820and second portion870. First portion820can have a first circular waveguide portion815. On the side of first portion820that interfaces with and locks together with second portion870, multiple ridges821ofFIG.20Bare provided, and spaced apart by gaps822(FIG.20B) that are arranged circumferentially around the center of waveguide portion815. A locking end823(FIG.20B) is present adjacent and connected to each ridge821and preceding each gap822. A center axis of the locking mechanism passes through a center of the waveguide815. The ridges821are formed perpendicularly to the center axis and extend away from the center of the first locking portion820. Locking end823connects to the ridges821and extends parallel to the center axis of the locking portion820. Second portion870can have a circular waveguide portion880and has flexible protrusions860(FIG.20A) that extend outward from the second portion870toward the direction of first portion820when the locking mechanism800is aligned to join together. Protrusions860have a portion861that extends inward toward the center of second portion870. Protrusions860can be slightly curved as shown to match the curvature of ridges821(FIG.20B). Protrusions860are separated by curved protrusions865which match the curvature of the circular gap824in portion820. In some embodiments, the number of protrusions860match the number of ridges821, and gaps822(FIG.20B). A center axis of the locking mechanism passes through a center of the waveguide880. The protrusions860extend in a plane parallel to the center axis towards locking portion820when portions820and870are aligned to connect. A connection portion861of each protrusion860extends toward the center of the locking mechanism in a plane perpendicular to the center axis of the locking mechanism, so that each portion861is parallel to the ridges821. Referring toFIG.21A, a first step for connecting the first and second portions820and870of locking mechanism800is shown. First portion870is aligned so that protrusions860align with gaps822so that when portion870is moved in direction901, protrusions860go through gaps822, protrusions865go through circular gap824and waveguide880comes to rest and into contact with surface818. Locking tab825has an angled surface portion that comes into contact with portion861when the locking mechanism is connected and then twisted. When at rest an upward biasing force in the opposite direction of arrow901, ensures the top portion of the angled surface of locking tab25contacts an inner surface of ridge821. The biasing force can be provided by various means, such as a spring, or the bias of materials of the locking tab825. Referring toFIG.21B, a second step for connecting the first and second portions820and870of locking mechanism800is shown. Once the portions820and870are brought together, protrusions860go through gaps822(FIG.20B), protrusions865go through circular gap824and waveguide880comes to rest and into contact with surface818. Locking mechanism800is a touch contact type locking mechanism501. Referring toFIG.21C, a third step for connecting the first and second portions820and870of locking mechanism800is shown.FIG.21Cshows the beginning of the twisting motion902a user must use on portion870, while keeping portion820from moving. In some embodiments, the twisting motion902for turning portion870is a clockwise motion. During twisting, each portion861of each protrusion860meets an inner surface of each ridge821. The flexible structure of protrusion860provides a biasing or clamping force when protrusions860come into contact with the inner surfaces of ridges821, so that the protrusions860pull the ridges821in a direction opposite of direction901as shown inFIG.21A. During the twisting motion902, protrusions860come into contact with an angled surface of locking tab825, and force the locking tab downward in direction901, as the protrusion860passes over the angled surface. Referring toFIG.21D, a fourth and final step for connecting the first and second portions820and870of locking mechanism800is shown. Rotation in clockwise direction902is completed when each protrusion860comes into contact with and is stopped by locking end portion823. Locking end portion823connects each ridge821to the rest of portion820as shown. Once protrusion860comes into contact with locking portion823, it no longer has contact with the angled portion of locking tab825, and therefore no longer presses locking tab825downward. Locking tab825then returns to its initial resting position by moving back upwards in a direction opposite direction901, and comes into contact with the inner surface of ridge821. The protrusion860is then locked in place, preventing movement in a counter clock wise direction opposite that of direction902. In some embodiments, a locking tab825is present at each location that a ridge821is present. In some embodiments, only one locking tab825is present to lock only one protrusion860. The number of locking tabs825can vary as needed. In some embodiments, one, two, three, four or more locking tabs can be used in a locking mechanism800. A locking release mechanism (not shown) can be used by a user to release or lower the locking tab825to free each locked protrusion860, thereby allowing the locking mechanism800to be disconnected. In some embodiments, a user can turn the portion870with enough force to overcome the biasing force of locking tab825, thereby forcing the locking tab down in a direction901, thereby releasing each locked protrusion860. Locking mechanism800can be used with non-circular waveguides such as square, triangular, oblong, elliptical, and other commonly used waveguide shapes. It should also be noted that the terms “first”, “second”, “third”, “upper”, “lower”, and the like may be used herein to modify various elements. These modifiers do not imply a spatial, sequential, or hierarchical order to the modified elements unless specifically stated. While the present disclosure has been described with reference to one or more exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment(s) disclosed as the best mode contemplated, but that the disclosure will include all embodiments falling within the scope of the appended claims. | 44,293 |
11862834 | The present disclosure will be described with reference to the accompanying drawings. Generally, the drawing in which an element first appears is typically indicated by the leftmost digit(s) in the corresponding reference number. DETAILED DESCRIPTION OF THE EMBODIMENTS Exemplary embodiments of the present invention overcome the deficiencies of prior solutions. In one aspect, the embodiments enable a distributed LC filter structure providing simultaneously a distributed inductance and a distributed capacitance in the same structure. Accordingly, discrete passive elements are eliminated and high, homogenous integration is achieved. In another aspect, rather than treating the inductance resulting from the distributed capacitance as a parasitic (and attempting to reduce it), embodiments tailor the interconnections between the distributed inductance and capacitance to leverage this parasitic inductance to increase the overall inductance of the distributed LC filter structure. Similarly, the interconnections between the distributed inductance and capacitance are tailored to leverage the parasitic capacitance resulting from the distributed inductance to add up with the distributed capacitance augmenting the overall capacitance of the structure. FIG.3is a circuit diagram that illustrates an example distributed LC filter structure300according to an exemplary embodiment. In general, distributed LC filter structure300may be used as a low-pass filter, for example. In an embodiment, distributed LC filter structure300may be used as an output filtering stage of a DC-DC buck converter. In another embodiment, distributed LC filter structure300is coupled to a Power Management Integrated Circuit (PMIC) flip-chip bonded onto a substrate. As shown inFIG.3, example LC filter structure300includes a distributed inductor302and distributed capacitor304. Distributed inductor302includes a plurality of series inductive components302-1, . . . ,302-n. Each inductive component302-1, . . . ,302-nmay have an associated parasitic resistance306-1, . . . ,306-n. Distributed capacitor304includes a plurality of parallel capacitive components304-1, . . . ,304-n. Each capacitive component304-1, . . . ,304-nmay have an associated parasitic resistance308-1, . . . ,308-n. Accordingly, distributed LC filter structure300is based on serializing the filter inductor in the horizontal path and parallelizing the shunt capacitor in the vertical path. The plurality of inductive components302-1, . . . ,302-nmay each further include a respective parasitic capacitance, and the plurality of capacitive components304-1, . . . ,304-nmay each further include a respective parasitic inductance. In an embodiment (not shown inFIG.3), interconnections between distributed inductor302and distributed capacitor304are made such that, in addition to enabling the circuit shown inFIG.3, they allow the parasitic capacitances of the plurality of inductive components302-1, . . . ,302-nto be coupled in parallel with the plurality of capacitive components304-1, . . . ,304-n. Additionally or alternatively, in another embodiment, the interconnections between distributed inductor302and distributed capacitor304are made such that the parasitic inductances of the plurality of capacitive components304-1, . . . ,304-nare coupled in series with the plurality of inductive components302-1, . . . ,302-n. Accordingly, rather than attempting to reduce the parasitic inductance of the shunt capacitor and/or the parasitic capacitance of the filter inductor, the parasitics are leveraged to increase the filter inductance and/or the shunt capacitance of the LC filter. Performance of the resulting LC filter is thereby improved. FIGS.4and5, further described below, illustrate pattern layouts of an example distributed LC filter structure according to an exemplary embodiment. The distributed LC filter structure illustrated inFIGS.4and5may be an embodiment of distributed LC filter structure300. FIG.4is a top view of a first pattern layout400of the example distributed LC filter structure. First pattern layout400shows the layouts of a trench pattern404, a first conductive layer402, a second conductive layer406, and a third conductive layer408of the LC filter structure. In an embodiment, first conductive layer402, second conductive layer406, and third conductive layer408provide first, second, and third electrodes that form at least one capacitive cell of the LC filter structure. For the purpose of presentation, intervening layers, such as isolation layers between the different conductive layers, are omitted. In an exemplary embodiment, trench pattern404is formed by etching a top surface of a substrate. First conductive layer402is then disposed over the top surface of the substrate and into the trenches formed by trench pattern404. A pattern layout resulting from first conductive layer402and trench pattern404is illustrated inFIG.10A. Trench pattern404allows to extend, vertically into the substrate, the surfaces of the capacitors formed by the LC filter structure. As such, the capacitance of the resulting LC filter structure is increased. In another embodiment, however, the LC filter structure can be formed without etching trench pattern404into the substrate. Returning toFIG.4, after a first insulator layer (not shown) is disposed on top of first conductive layer404, second conductive layer406is disposed on top of the first insulator layer, and into the trenches formed by trench pattern404, according to the shown pattern. In an exemplary embodiment, the first insulator layer and second conductive layer406form a first insulator-metal structure of the LC filter structure. As shown inFIG.4, second conductive layer406is disposed along the entire top surface of the substrate, save for first hexagonal areas that surround a first contact array CA1, disposed to connect first conductive layer402to a first metal layer (not shown, discussed further below) of the structure.FIG.10Billustrates a pattern layout resulting from first conductive layer402, trench pattern404, and second conductive layer406. The first hexagonal areas that surround first contact area CA1(not shown inFIG.10B) are denoted by the numeral1002. As would be understood by a person skilled in the art, areas1002may have other than a hexagonal shape, such as a square, rectangular, or circular shape for example. Returning toFIG.4, a second insulator layer (not shown) is then disposed on top of second conductive layer406, and third conductive layer408is disposed on top of the second insulator layer. Third conductive layer408is disposed into the trenches formed by trench pattern404. In an embodiment, the second insulator layer and third conductive layer408form a second insulator-metal structure of the LC filter structure. As shown inFIG.4, third conductive layer408is disposed along the entire top surface of the substrate, save for second hexagonal areas that surround the first contact array CA1(the second hexagonal areas encompass the first hexagonal areas formed by the absence of second conductive layer406) and third hexagonal areas that surround a second contact array CA2disposed to connect second conductive layer406to a second metal layer (discussed further below) of the structure. FIG.10Cillustrates a pattern layout resulting from first conductive layer402, trench pattern404, second conductive layer406, and third conductive layer408. The second hexagonal areas are denoted by the numeral1006and the third hexagonal areas are denoted by the numeral1004. As would be understood by a person skilled in the art, areas1004and/or1006may have other than a hexagonal shape, such as a square, rectangular, or circular shape for example. Returning toFIG.4, a third contact array CA3is then disposed to connect third conductive layer408to the first metal of the structure as shown by the pattern CA3.FIG.10Dillustrates a pattern layout resulting from first conductive layer402, trench pattern404, second conductive layer406, third conductive layer408, first contact array CAL second contact array CA2, and third contact array CA3. In an embodiment, first contact array CAL second contact array CA2, and third contact array CA3have equal contact density (defined as the number of contacts per surface unit). In another embodiment, first contact array CAL second contact array CA2, and third contact array CA3have equal contact surface (defined as the cumulative surface of contacts per surface unit). In a further embodiment, first contact array CAL second contact array CA2, and third contact array CA3have equal contact pitch (defined as the distance in between the contacts). In an embodiment, as shown inFIG.10D, first contact array CA1is staggered relative to second contact array CA2and aligned horizontally with third contact array CA3, which is aligned vertically with second contact array CA2. FIG.5is a top view of a second pattern layout500of an example distributed LC filter structure according to an exemplary embodiment. Second pattern layout400shows the layouts of a first metal layer502, a second metal layer504, and an inter-metal insulation layer of the LC filter structure. Second pattern layout500is a complementary layout to first pattern layout400shown inFIG.4, with second pattern layout500formed above first pattern layout400in the distributed LC filter structure. For ease of presentation, first conductive layer402is shown inFIG.5as it defines the bottom most layer of the structure. In an exemplary embodiment, first metal layer502is deposited on top of a first insulation layer (not shown), which is deposited along the top surface of the substrate. In an embodiment, the first insulation layer is deposited along the entire top surface of the substrate, except in areas corresponding to the aggregate pattern formed by first contact array CAL second contact array CA2, and third contact array CA3. As shown inFIG.5, first metal layer502has a pattern that corresponds to the top surface of the substrate, save for areas in which the pattern is interrupted to form hexagonal shaped islands. FIG.10Eillustrates a pattern layout resulting from first conductive layer402, trench pattern404, first metal layer502, first contact array CAL second contact array CA2, and third contact array CA3. In this pattern layout, first metal layer502includes islands that are rectangular shaped, instead of hexagonal shaped as inFIG.5. Returning toFIG.5, a second insulation layer (inter-metal dielectric) is then formed on top of first metal layer502. InFIG.5, the second insulation layer is formed along the entire surface of the substrate except for square openings defined by pattern506. In an embodiment, pattern506corresponds to the location of second contact array CA2, which as mentioned above, connects second conductive layer506to second metal layer504. A pattern layout resulting from first conductive layer402, trench pattern404, first metal layer502, and the second insulation layer is shown inFIG.10Faccording to an exemplary embodiment. As shown inFIG.10F, in this embodiment, the pattern506further includes bands in which the second insulation layer is also interrupted. Returning toFIG.5, second metal layer504is then deposited on top of the second insulation layer. As shown inFIG.5, second metal layer504has a linear shape with a length (l) and a width (W) with l being larger than W by a factor of at least 100. A pattern layout resulting from trench pattern404, first metal layer502, second metal layer504, and the second insulation layer is shown inFIG.10G. In an exemplary embodiment, second metal layer504serves to provide a distributed inductance of the distributed LC filter structure. The inductance value L is related to the length l and the width W by the equation L=f(l/W), where f represents the frequency. In other embodiment, second metal layer504can have different layouts, like a meander pattern, a planar loop, or a spiral. FIG.6is a cross section view600of an example distributed LC filter structure according to an embodiment. In an exemplary embodiment, cross section view600corresponds to a cross section of the LC filter structure illustrated inFIGS.4and5above along the line C-C′ shown inFIG.5. As shown inFIG.6, first conductive layer402, second conductive layer406, and third conductive layer408are disposed in a trench. First conductive layer402and second conductive layer406are separated by the first insulator layer (not shown), and second conductive layer406and third conductive layer408are separated by the second insulator layer (not shown). Layer604corresponds to the first insulation layer (first inter-metal dielectric) which is deposited above third conductive layer408. Layer604is deposited along the top surface of the substrate except for openings through which first, second, and third contact arrays CA1, CA2, and CA3extend vertically to contact first conductive layer402, second conductive layer406, and third conductive layer408, respectively. In other words, the pattern of layer604is the complement of the aggregate pattern of contact arrays CA1, CA2, and CA3. InFIG.6, two openings through layer602corresponding to second contact array CA2can be seen. First metal layer502is disposed above layer604according to the pattern discussed above with respect toFIG.5. Layer602corresponds to the second insulation layer (second inter-metal dielectric) which is deposited above first metal layer502. As shown, layer602is deposited along the top surface of the substrate except for square openings corresponding to pattern506inFIG.5. This allows second metal layer504to contact second conductive layer406. FIG.7is a cross section view700of an example distributed LC filter structure according to an exemplary embodiment. In an embodiment, cross sectional view700corresponds to a cross section of the LC filter structure described with reference toFIGS.4and5above. For ease of presentation, trenches are not shown in cross section view700. As shown inFIG.7, the distributed LC filter structure includes a first conductive layer702, a first insulator layer704, a second conductive layer706, a second insulator layer708, a third conductive layer710, a first insulation layer712, a first metal layer714, a second insulation layer716, a second metal layer718, a first contact array724, a second contact array720, and a third contact array722. In an exemplary embodiment, first conductive layer702, second conductive layer706, third conductive layer710, first metal layer714, second metal layer718, first contact array724, second contact array720, and third contact array722correspond respectively to first conductive layer402, second conductive layer406, third conductive layer408, first metal layer502, second metal layer504, first contact array CA1, second contact array CA2, and third contact array CA3described with reference toFIGS.4,5, and6above. In an exemplary embodiment, first conductive layer702is disposed on a top surface of a substrate (not shown). In another embodiment, the substrate has a trench etched in its top surface and first conductive layer702is disposed into the trench. First insulator layer704is disposed on top of first conductive layer702, and second conductive layer706is disposed on top of first insulator layer704. In an exemplary embodiment, first insulator layer704and second conductive layer706form a first insulator-metal structure of the distributed LC filter structure. In an embodiment, the first insulator-metal structure is disposed in the trench etched into the substrate. Second insulator layer708is disposed on top of second conductive layer706, and third conductive layer710is disposed on top of second insulator layer708. In an embodiment, second insulator layer708and third conductive layer710form a second insulator-metal structure of the distributed LC filter structure. In an embodiment, the second insulator-metal structure is also disposed in the trench etched into the substrate. First insulation layer712is deposited along the top surface of the substrate above third conductive layer710, and first metal layer714is deposited on top of the first insulation layer712. First contact array724is formed to connect first metal layer714to first conductive layer702, and third contact array722is formed to connect first metal layer714to third conductive layer710. Second insulation layer716is deposited on top of the first metal layer714, and second metal layer718is deposited on top of the second insulation layer716. Second contact array720is formed to connect second metal layer718to second conductive layer706. In an embodiment, second metal layer718provides an inductance of the distributed LC filter structure. In an exemplary embodiment, first conductive layer702, second conductive layer706, and third conductive layer710provide first, second, and third electrodes, respectively, which form a first capacitive cell of the distributed LC filter. As shown inFIG.7, the first capacitive cell includes a first capacitance formed by the first and second electrodes and a second capacitance formed by the second and third electrodes. Because the first and third electrodes are both connected to first metal layer714, the first capacitance and the second capacitance are in parallel. In another exemplary embodiment, the first, second, and third electrodes form a second capacitive cell (not shown) of the distributed LC filter, in parallel with the first capacitive cell. In cross section view700ofFIG.7, the second capacitance cell would be located to the left or the right of the shown first capacitance cell. In a further exemplary embodiment, parallel capacitive cells underlie the entire length of second metal layer718to create a uniformly distributed structure. In another embodiment, the capacitive cells underlie only a portion of second metal layer718to create a non-uniformly distributed structure. For example,FIG.9is a cross section view900of a non-uniformly distributed LC filter structure according to an embodiment. As shown inFIG.9, the capacitive cells are provided in a portion902and discontinued in a portion904of the structure. As such, in portion904, only an inductance is formed. The resulting structure is therefore an LC+L structure. As would be understood by a person of skill in the art based on the teachings herein, other structures can be formed by forming/interrupting the formation of capacitive cells in one or more portions of the structure. For example, the distributed LC filter structure can be designed to include an L+LC, an LC+L, or an L+LC+L filter structure. In an exemplary embodiment, as shown inFIG.7for example, first metal layer714is connected to a ground terminal via a ground path728and second metal layer718is connected to an input signal via a signal path726. In one implementation, as inFIG.7, signal connections are designed so as to increase the mutual inductance between the ground path728and the signal path726. In another implementation, shown inFIG.8, signal connections are designed so as to reduce the mutual inductance between the ground path802and the signal path726. In another exemplary embodiment, in order to enhance the LC distributed filter structure from an Electromagnetic Interference (EMI) emission point of view, especially at high frequency, a ground plane layer (not shown) is disposed above signal path726(i.e., above second metal layer718). As such, the electromagnetic field is confined and interference with other components is reduced. In an exemplary embodiment, at least one of the first contact array724, second contact array720, and third contact array722is configured such that a parasitic inductance of at least one of the first and second capacitive cells is coupled in series with the inductance provided by the second metal layer718. Alternatively or additionally, at least one of the first contact array724, second contact array720, and third contact array722may be configured such that a parasitic capacitance of second metal layer718is coupled in parallel with the first and second capacitive cells. In general, exemplary embodiments of the distributed LC filter structure can be tuned to obtain a filter with an equivalent frequency response as a lumped LC filter. Additionally, the distributed capacitive design combined with a creative routing technique between capacitive cells permits a very flexible tuning of the filter envelope. The filter rejection may be increased while maintaining high efficiency and improving output ripples. In the exemplary embodiments described above, the distributed LC structure has been described for signal filtering use primarily. However, the structure is not limited to filtering applications and can be used in a variety of other applications as would be understood by a person of skill in the art. For example, the structure may be used to provide distributed capacitive decoupling along an interconnection line, a transmission line having strong capacitive coupling to ground, a low-pass single pole filter, or a low-pass cell in a higher pole order filter. It is noted that the foregoing description of the embodiments will so fully reveal the general nature of the disclosure that others can, by applying knowledge within the skill of the art, readily modify and/or adapt the embodiments for various applications, without undue experimentation, without departing from the general concept of the present disclosure. It is to be understood that the phraseology or terminology herein is for the purpose of description and not of limitation, such that the terminology or phraseology of the present specification is to be interpreted by the skilled artisan in light of the teachings and guidance. The breadth and scope of embodiments of the present disclosure should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims. | 21,961 |
11862835 | It should be noted that all the figures are diagrammatic. Relative dimensions and proportions of parts of the drawings have been shown exaggerated or reduced in size, for the sake of clarity and convenience in the drawings. The same reference signs are generally used to refer to corresponding or similar features in modified and different embodiments. DETAILED DESCRIPTION In following detailed description of the present invention, reference is made to the accompanying drawings which form a part hereof and is shown by way of illustration and specific embodiments in which the invention may be practiced. These embodiments are described in sufficient details to enable those skilled in the art to practice the invention. Dimensions and proportions of certain parts of the drawings may have been shown exaggerated or reduced in size, for the sake of clarity and convenience in the drawings. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims. As used in various embodiments of the present disclosure, the expressions “include”, “may include” and other conjugates refer to the existence of a corresponding disclosed function, operation, or constituent element, and do not limit one or more additional functions, operations, or constituent elements. Further, as used in various embodiments of the present disclosure, the terms “include”, “have”, and their conjugates are intended merely to denote a certain feature, numeral, step, operation, element, component, or a combination thereof, and should not be construed to initially exclude the existence of or a possibility of addition of one or more other features, numerals, steps, operations, elements, components, or combinations thereof. Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It should be readily understood that these meanings such as “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner such that “on” not only means “directly on” something but also includes the meaning of “on” something with an intermediate feature or a layer therebetween, and that “above” or “over” not only means the meaning of “above” or “over” something but can also include the meaning it is “above” or “over” something with no intermediate feature or layer therebetween (i.e., directly on something). While expressions including ordinal numbers, such as “first” and “second”, as used in various embodiments of the present disclosure may modify various constituent elements, such constituent elements are not limited by the above expressions. For example, the above expressions do not limit the sequence and/or importance of the elements. The above expressions are used merely for the purpose of distinguishing an element from the other elements. For example, a first user device and a second user device indicate different user devices although both of them are user devices. For example, a first element may be termed a second element, and likewise a second element may also be termed a first element without departing from the scope of various embodiments of the present disclosure. It should be noted that if it is described that an element is “coupled” or “connected” to another element, the first element may be directly coupled or connected to the second element, and a third element may be “coupled” or “connected” between the first and second elements. Conversely, when one component element is “directly coupled” or “directly connected” to another component element, it may be construed that a third component element does not exist between the first component element and the second component element. Firstly, please refer collectively toFIGS.1-3, which are the schematic isometric view, cross-sectional view in a first direction D1and cross-sectional view in a second direction D2of a combline filter respectively in accordance with the preferred embodiment of present invention. The filter100of present invention includes a dielectric block102as the main body. As shown inFIG.1, the dielectric block102is preferably a low-profile rectangular cuboid bounded by six quadrilateral faces and with its length, depth and height extending respectively in a third direction D3, the first direction D1and the second direction D2, wherein the first, second and third directions D1, D2, D3are preferably perpendicular to each other. The material of dielectric block102may be ceramic, such as BaSmTi, ZrTiSn or MgSi with loss tangent ranging from 10−4to 10−5. In comparison to common FR4 material used in PCB with loss tangent of 10−3, these materials are more suitable for high-frequency and high-rejection bandpass filter required in the application of 5G telecommunication. It should be note that the present invention may also be implemented using PCB process. Refer still toFIGS.1-3. A series of multilayer resonators104are formed in the dielectric block102. In the present invention, the multilayer resonators104are preferably aligned and closely spaced in the third direction D3in the dielectric block102. The multilayer resonator104may be a transverse electromagnetic resonator in a column shape extending in the first direction D1into the dielectric block102. One end of the columned multilayer resonator104is electrically opened inside the dielectric block102and the other end of the columned multilayer resonator104is shorted to a ground electrode106. In the present invention, the ground electrode106may be a metallic shielding cladding or soldering on the outer surface of the dielectric block102to minimize the noise coupling and to achieve acceptable stopbands and satisfactory harmonic performance. The multilayer resonators104in the dielectric block102connect the ground electrode106at the surface of dielectric block102through its ground terminal104cat rear end. The ground terminal104cmay be electrically connected with the ground electrode106through ground structures (not shown) like ground path or ground layer. Alternatively, in some embodiments, the ground terminal104cof the multilayer resonator104may not extend outside of the dielectric block102. The material of ground electrode106may be the conductive material including but not limited to aluminum, steel, copper, silver and nickel, as well as metal alloys. During use, wireless/microwave signals enter the filter shielding and follow a signal pathway around/through the multilayer resonators104. Depending on the position and configuration of the resonators, the frequency response of the filter can be tailored to suit specific operational needs. Refer still toFIGS.1-3. In the preferred embodiment of present invention, the multilayer resonators104are capacitively coupled with each other in series through capacitors107set between the multilayer resonators104. Alternatively, in other embodiment, the multilayer resonators104may be directly connected with each other in series through the metal layers extending from and between the multilayer resonators104. More specifically, in the embodiment of present invention, each multilayer resonator104has a first signal terminal104aand a second signal terminal104bat two lateral ends respectively. The first signal terminal104aof one multilayer resonator104and the second signal terminal104bof an adjacent multilayer resonator104may be directly connected through a metal layer or capacitively coupled through capacitor or inductively coupled through inductor. The resonance characteristic of LC or RLC is provided between the first signal terminal104aand the second signal terminal104b. The bandwidth and response of the filter is determined by the amount of coupling of each multilayer resonator104to its immediate neighbor, which in turn is dependent on resonator size, resonator spacing, and ground plane separation. Furthermore, a first signal electrode108and a second signal electrode110are set respectively at opposite sides of the dielectric block102in the third direction D3. In the preferred embodiment of present invention, the first signal electrode108may be an input pad and the second signal electrode110may be an output pad to input and output the signals to be filtered and resonated by the filter100. Similarly, the first signal electrode108and the second signal electrode110may be directly connected or capacitively or inductively coupled to the first signal terminal104aor second signal terminal104bof the multilayer resonators104through metal layers or capacitors. In combline filter, the first signal (input) electrode108is coupled to the first signal terminal104aof the first multilayer resonators104on one side of the dielectric block102and the second signal electrode110is coupled to the second signal terminal104bof the last multilayer resonators104on the other side of the dielectric block102in the series. The first signal electrode108and the second signal electrode110may be further electrically connected to external PCB or devices to receive and transmit signals. Please note that the first signal electrode108and the second signal electrode110are not electrically connected with the ground terminal (shielding)106although they are all set on outer surfaces of the dielectric block102. Please refer toFIG.2. In the embodiment of present invention, the ratio of a total height H of the multilayer resonator104in the second direction D2and a spacing S between the multilayer resonator104and an outer surface of the dielectric block102(shielded by the ground electrode106like a ground structure) in the second direction D2is preferred 1:1 to 1:2 (H:S), in order to achieve an optimal filtration efficiency. In addition, please refer toFIG.3, the length L of multilayer resonators104in the first direction D1is preferably and nominally λ/4 at the centre frequency, wherein λ is the wavelength of the signal. Now, please refer toFIG.4, which is an enlarged cross-sectional view of the multilayer resonator104in the preferred embodiment of present invention. The multilayer resonator104of the present invention is particularly constituted by multiple metal layers112. As shown in the figure, the metal layers112preferably parallel and overlap each other in the second direction D2, which is perpendicular to the first direction D1in which the multilayer resonator104extends. The metal layers112may have the same length in the first direction D1, however, their width in the third direction D3may be different in order to render required cross-sectional shape for the multilayer resonator104. Take the circular cross-sectional shape in the figure for example, the metal layer112has a width different in the third direction D3from the widths of adjacent metal layers. The percentage difference of lengths in the first direction D1of adjacent metal layers112in each multilayer resonator104may be 0%˜15%, and the multilayer resonator104is preferably constituted by at least six metal layers112in order to provide good resonant efficiency. The first signal terminal104aand the second signal terminal104bof a multilayer resonator104may be two ends of a metal layer112, especially the metal layer112with max width in the third direction D3in a multilayer resonator104. In addition, as shown inFIG.4, a straight via114is formed extending in the second direction D2from a topmost metal layer112to a bottommost metal layer112in each multilayer resonator104. The via114electrically connects every metal layers112in the multilayer resonator104so that these metal layers112may constitute and function in entirety like a normal cylindrical resonator. The via114is preferably formed in the middle of the multilayer resonator104in the width direction (third direction D3), that is, aligning with a vertical diameter of the circular multilayer resonator104. In some embodiments, a via114in a multilayer resonator104may be divided into several via sections (not shown) offset each other in the third direction D3and connecting all of the metal layer112in the multilayer resonator104(i.e. the metal layers112are not connected by a single, straight via). The via sections connecting three adjacent metal layers may have overlapping portions in the second direction D2. Moreover, please refer toFIG.6, a multilayer resonator104may include a plurality of vias114, wherein these vias114are preferably aligned and spaced apart in the first (length) direction D1to provide better resonant efficiency. Also, in order to improve manufacturing yield, these vias114are preferably set at a position at least half length of the multilayer resonator104in the first direction D1away from the ground electrode106or ground terminal104c(i.e. the ground-shorted end). In some embodiments, these vias114may be set along the whole length in the first direction D1with the same spacing to achieve better characteristics. For the same reason, as shown in the figure, the capacitors107or metal layers coupling or connecting the first or second signal terminals104a,104bof the multilayer resonators104are preferably set at the open-circuited end of the multilayer structures104, and the via114may be set at a position on 50%˜60% width of the multilayer resonator104in the third direction D3, preferably the position on 50% width (i.e. middle position). Please refer back toFIG.4. In the embodiment of present invention, the capacitor107between multilayer resonators104may also be constituted by the metal layers112. As shown in the figure, the capacitor107between the two multilayer resonators104is constituted by three metal layers112, wherein some of these metal layers112may be a part of metal layers112extending from the multilayer resonators104(especially the metal layer for providing the first signal terminal104aand the second signal terminal104b). In other embodiment, the two multilayer resonators104may be directly connected through common metal layers with the first signal terminal104aand the second signal terminal104brather than capacitively coupled by the capacitor107. In the present invention, the material of metal layers112may be the conductive material including but not limited to aluminum, steel, silver, copper and nickel, as well as metal alloys. In addition, the cross-sectional shape of the multilayer resonators104is preferably but not limited to circular. For example, in other embodiments as shown inFIG.5, the cross-sectional shape of the multilayer resonator104is oval constituted by the metal layers112with different widths in the third direction D3. In fact, any regular shape such as rectangle or polygon in bilateral symmetry is well suited for the multilayer resonators104in the present invention. In the present invention, the multilayer resonators104formed of multiple metal layers112in the dielectric block102may be realized by using PCB (printed circuit board) process or LTCC (low temperature co-fired ceramics) process. In comparison to conventional forming process that the resonators are formed by filling up or plating inner surface of the drilled resonant cavities in the dielectric block with metal materials, the components of resonators in the present invention, including metal layers112and vias114, may be formed and patterned layer by layer through image transfer and screen printing on multiple thin green tapes in LTCC process. The entire dielectric block102is formed by sintering laminated green tapes having patterns of the resonators formed therein. The advantage of this approach is that it can easily manufacture the resonators in complex and customized patterns or shapes with great accuracy. No secondary processing or machining like manual tuning and calibration are required after the resonators are formed. Furthermore, the concept of constituting a resonator through multiple metal layers makes it possible to reduce the weight and scale the size of whole dielectric filter, thereby making it well suited for the application of 5G telecommunication systems that employs Massive MIMO requiring individual filters for compact antenna units. Next, please refer collectively toFIGS.7-9, which are respectively the schematic isometric view, cross-sectional view in the first direction D1and cross-sectional view in the second direction D2of a combline filter in accordance with another embodiment of present invention. In this embodiment, coupling structures are added in the filter100to enhance or tuning the coupling degree between the multilayer resonators104. As shown in the figure, a coupling structure116is formed above (or below) every two of the multilayer resonators104, wherein each of the coupling structures116consists of a short metal bar116aformed in an additional dielectric layer118on the dielectric block102and two coupling vias116bconnecting two end of the metal bar116aand extending in the second direction D2into the dielectric block102toward the corresponding two multilayer resonators104. Please refer toFIG.8. The dielectric layer118may be a part of the dielectric block102, with a ground layer119set therebetween to isolate the metal bar116aand the dielectric block10. The material of dielectric layer118may be the same or different from the material of dielectric block102. Furthermore, the two coupling vias116bof the coupling structure116may extend and pass in the second direction D2through the holes on the ground layer119toward the multilayer resonators104. Preferably, the coupling via116bis set right above or below the vias114that connects the metal layers in the multilayer resonator104, especially the via114closest to the open-circuited end of the multilayer resonator104. In addition to the coupling structures116, please refer still toFIGS.7-9, a coupling metal bar120may be formed below (or above) the multilayer resonators104in the dielectric block102. Unlike the coupling structure116that couples only two multilayer resonators104, the coupling metal bar120extends in the third direction D3over at least two or all multilayer resonators104and couples them collectively. Preferably, the coupling metal bar120is set behind or not overlapping the multilayer resonators104in the first direction D1or in the second direction D2as shown inFIG.9. Lastly, please refer toFIG.10, which is a frequency response curves for the combline dielectric filter100of the present invention. A frequency response is provided having frequency measured in gigahertz (GHz) along the x-axis between 3 GHz and 4 GHz. Insertion/Return loss, measured in dB, is provided along the y-axis and ranges between 0 and −100 along the area of interest. As shown in the figure, the graph reveals that a viable filter response for a high rejection dielectric filter may be achieved in the frequency range of interest. At 5G frequencies, for example, a bandwidth of about 3.5 GHz is realized. The graph also shows reasonable insertion loss values and good stopbands. According to the embodiments described above, the present invention provides a novel combline dielectric filter with enhanced high rejection and excellent selectivity in the filter's frequency response. The dielectric filter may offer greater design freedom and options to produce custom filters with unique specification requirements, and the accuracy of the dielectric filter may be well-controlled to provide improved yield and excellent uniformity since it is not formed by conventional mechanical drilling method. The present invention is particularly well suited for 5G wireless telecommunications field involving equipment that operates at higher and higher frequencies and which requires filters that are smaller in volume, contain less material, have smaller footprints, and have a lower profile on the circuit board, while still providing high performance and meeting increasingly strict specifications. Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims. | 20,420 |
11862836 | DETAILED DESCRIPTION As part of developing embodiments herein, a switch network for TDD operation and requirements on isolation for inter-band unsynchronized operation will be discussed first. FIG.1shows a switch network100according to prior art. The switch network100comprises an antenna110, an antenna diplexer120, a first band-pass filter131for operating at a first band X, a second band-pass filter132for operating at a second band Y, a first band switch141, a second band switch142, a transmitting diplexer151, a receiving diplexer152, a power amplifier (PA)160, and a low noise amplifier (LNA)170. For MB unsynchronized operation, transmitter cannot be turned off. For example, when band Y is in transmitting (TX) mode, band X is in receiving (RX) mode, the PA160is on. Transmitted signal in one carrier will not be confined into this carrier but also leak into neighboring carriers or frequency bands due to impairments in transmitter circuits. Normally, this leakage is much smaller than the transmitted signal, but the leakage may still be large compared to a weak signal potentially received by a receiver. Therefore spurious emission from PA160may cause blocking or desensitization of the LNA170. To achieve needed isolation, e.g. 100 dB, between the transmitter and receiver, the first and second band switches141,142must be special, expensive and high quality switches. FIG.2is block diagram showing a radio unit200according to embodiments herein for unsynchronized TDD multi-band operation in a wireless communication system. As illustrated inFIG.2, the radio unit200comprises a first resonator arrangement210, e.g. a first cavity filter, comprising one or more resonators211,212,213tuned for operating at a first frequency band X. A first terminal of the first resonator arrangement210is coupled to an antenna element260. The radio unit200further comprises a second resonator arrangement220, e.g. a second cavity filter, comprising one or more resonators221,222,223tuned for operating at a second frequency band Y. A first terminal of the second resonator arrangement220is coupled to the antenna element260. The radio unit200further comprises a tunable resonator arrangement230comprising at least four tunable resonators231,232,233,234, e.g. tunable cavity filters. First terminals of the first and second tunable resonators231,232are coupled to a second terminal of the first resonator arrangement210, first terminals of the third and fourth tunable resonators233,234are coupled to a second terminal of the second resonator arrangement220, second terminals of the second and third tunable resonators232,233are coupled to a receiving frontend240, second terminals of the first and fourth tunable resonators231,234are coupled to a transmitting frontend250. The at least four tunable resonators231,232,233,234in the tunable resonator arrangement230are tuned according to different operating modes. The block diagram inFIG.2is an illustration from architecture point of view. It shall be noticed that one cavity filter in the diagram may physically be composed of one or several cavities. Although the block diagram shows an example of dual bands, the radio unit200may comprises a third or more resonator arrangements in parallel with the first and second resonator arrangements210,220, as shown a radio unit300inFIG.3, where a third resonator arrangement310is shown in parallel with the first and second resonator arrangements210,220. The third resonator arrangement310comprises one or more resonators tuned for operating at a certain frequency band. The tunable resonator arrangement230now denoted as330may then comprise at least six or more tunable resonators and are tuned according to different operating modes. According to some embodiments herein, there may be a common cavity filter340at the antenna element side to combine or split signals from the resonator arrangements210,220,310, a common cavity filter350at the receiving frontend side and a common cavity filter360at the transmitting frontend side to combine or split signals from the tunable resonators in the tunable resonator arrangement330. The radio units200,300are applicable for LTE and NR, and are applicable for both BSs and UE. The radio unit200,300according to the embodiment herein uses tunable filters to realize, or achieve, the isolation between transmitting and receiving for each individual band, at the same time uses the tunable filter to realize isolation from one band in transmitting mode to the other bands in receiving mode. Resonators211,212,213are dedicated for band X, resonators221,222,223are dedicated for band Y. Resonators211,212,213,221,222,223frequency responses may already be tuned respectively for fixed frequencies in production or guaranteed by designers. They may not need to be re-tuned, and may be fixed cavity filters. For tunable resonators231,232,233,234, their frequency responses may be re-tuned according to DL or UL time slots during operation. These tunable resonators realize isolation between transmitting and receiving for each individual band, and at the same time to realize isolation from one band transmitting to the other band receiving. This makes sure that LNA performance in the receiving frontend240will not get any visible degradation from PA output in the transmitting frontend250. The output from the PA may be PA noise floor, PA nonlinear products, PA output signals from all other RF transmitting bands etc. Normally the PA output noise floor is much higher than the LNA input noise, therefore measures may be taken to protect the LNA. Depending on different frequency bands, e.g. band X and band Y, working at UL or DL time slot, the radio unit may operate in different modes. Mode 1: Transmitting (TX) only mode. In this mode, both the first band X and the second band Y work at transmitting mode, e.g. DL time slot for BS, or UL time slot for UE. The tunable resonators231,232,233,234are tuned in the following way:The first tunable resonator231is tuned to resonate at the first frequency band X;The fourth tunable resonator234is tuned to resonate at the second frequency band Y;The second tunable resonator232is tuned to resonate at other frequency than the first frequency band X, i.e. to resonate away from the first frequency band X. This means that this resonator may have two resonate frequencies, one is resonate at band X, another is resonate to another frequency such as 2*X frequency to protect LNA in the receiving frontend240;The third tunable resonator233is tuned to resonate away from the second frequency band Y to protect LNA in the receiving frontend240. Mode 2: Receiving (RX) mode only mode. In this mode, both the first band X and the second band Y work at receiving mode, e.g. UL time slot for BS, or DL time slot for UE. The tunable resonators231,232,233,234are tuned in the following way:The second tunable resonator232is tuned to resonate at the first frequency band X;The third tunable resonator233is tuned to resonate at the second frequency band Y;The first tunable resonator231is tuned to resonate away from the first frequency band X to isolate the transmitting frontend250from receiving band X signals from the antenna element260.The fourth tunable resonator234is tuned to resonate away from the second frequency band Y to isolate the transmitting frontend250from receiving band Y signals from the antenna element260. Mode3: Transmitting and receiving (TX/RX) mode. In this mode, one band works at receiving mode, e.g. UL time slot for BS, or DL time slot for UE, while the other band works at transmitting mode, e.g. DL time slot for BS, or UL time slot for UE. This mode dimensions the isolation requirement. As shown inFIG.1, it may need around 100 dB isolation from one band TX to the other band RX.According to some embodiments herein, when the first band X works at RX mode, while the second band Y works at TX mode, the tunable resonators231,232,233,234are tuned in the following way:The second tunable resonator232is tuned to resonate at the first frequency band X;The fourth tunable resonator234is tuned to resonate at the second frequency band Y;The first tunable resonator231is tuned to resonate away from the first and the second frequency bands to mitigate band Y TX spurious emission leakage to band X receiver and to mitigate band Y TX signal leakage to band X receiver;The third tunable resonator233is tuned to resonate away from the first and the second frequency bands to mitigate band Y TX spurious emission leakage to band X receiver and to mitigate band Y TX signal leakage to band X receiver. TX signal leakage here means that the leakage signal has the same frequency as the transmitting signal. TX spurious emission leakage here means that the leakage signal is not the same as the transmitting signal, i.e. the frequency of the spurious emission is different compare to the transmitting signal. According to some embodiments herein, when the first band X works at TX mode, while the second band Y works at RX mode, the tunable resonators231,232,233,234are tuned in the following way:The first tunable resonator231is tuned to resonate at the first frequency band X;The third tunable resonator233is tuned to resonate at the second frequency band Y;The second tunable resonator232is tuned to resonate away from the first and the second frequency bands to mitigate band X TX spurious emission leakage to band Y receiver and to mitigate band X TX signal leakage to band Y receiver;The fourth tunable resonator234is tuned to resonate away from the first and the second frequency second bands to mitigate band X TX spurious emission leakage to band Y receiver and to mitigate band X TX signal leakage to band Y receiver. To realize around 100 dB isolation, several physical tunable cavities may be needed for the first and third tunable resonators231,233. The number of fixed cavity that may be needed in each of the first and second resonator arrangements210,229for each band may depend on the TX and RX out of band rejection requirements. According to some embodiments herein, the tunable resonators231,232,233,234may be implemented by cavity filters, Varactor diodes, P-Intrinsic-N (PIN) diodes and microelectromechanical systems (MEMS) switches. A combined switch and capacitor may also be used. The radio unit200according to embodiments herein is applicable for unsynchronized MBs TDD operation. It uses tunable filters to mitigate one band TX spurious emission leakage to the other bands RX. Compared with the synchronized MB TDD operation, each frequency band may reach a relatively high performance, and have increased flexibility and reduced dependence. Note that most of the frequency bands for 5G NR are TDD frequency bands. The radio unit200according to embodiments herein is also applicable for general TDD operation. It replaces TDD switches with tunable filters, to mitigate one band TX signal leakage to this band RX. The radio unit200according to embodiments herein may reach high performance since tunable resonators e.g. cavity filters are used, no need for TDD switches. The Q value of the tunable resonators is high, so the insertion loss is low for both DL and UL signals. The radio unit200according to embodiments herein has better sensitivity and less power consumption. The radio unit200,300according to the embodiments herein may be employed in various radio or electronic apparatuses.FIG.4shows a block diagram of a radio or electronic apparatus400. The radio or electronic apparatus400comprises one or more radio units200,300. The radio or electronic apparatus400may be a radio base station or a wireless communication device, e.g. a user equipment or a mobile device, for a cellular communications system/network. The radio or electronic apparatus400may comprise other units, such as a memory420and a processing unit430as shown inFIG.4. Those skilled in the art will understand that the radio unit200,300according to embodiments herein may be implemented by any technology not limited by semiconductor. When using the word “comprise” or “comprising” it shall be interpreted as non-limiting, i.e. meaning “consist at least of”. The embodiments herein are not limited to the above described preferred embodiments. Various alternatives, modifications and equivalents may be used. Therefore, the above embodiments should not be taken as limiting the scope of the invention, which is defined by the appended claims. | 12,460 |
11862837 | DETAILED DESCRIPTION Embodiments of apparatuses and methods related to hierarchical network signal routing and power splitters/combiners are described herein. In embodiments, a substrate for phased array antennas includes a first layer having a first plurality of electrically conductive traces of a first portion of a plurality of hierarchical networks, and a second layer having a second plurality of electrically conductive traces of a second portion of the plurality of hierarchical networks. The first plurality of traces is orientated in a first direction and the second plurality of traces is orientated in a second direction different from the first direction. A plurality of vias electrically connects the first plurality of traces of the first layer to the respective second plurality of traces of the second layer to define the plurality of hierarchical networks. These and other aspects of the present disclosure will be more fully described below. While the concepts of the present disclosure are susceptible to various modifications and alternative forms, specific embodiments thereof have been shown by way of example in the drawings and will be described herein in detail. It should be understood, however, that there is no intent to limit the concepts of the present disclosure to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives consistent with the present disclosure and the appended claims. References in the specification to “one embodiment,” “an embodiment,” “an illustrative embodiment,” etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may or may not necessarily include that particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. Additionally, it should be appreciated that items included in a list in the form of “at least one A, B, and C” can mean (A); (B); (C); (A and B); (B and C); (A and C); or (A, B, and C). Similarly, items listed in the form of “at least one of A, B, or C” can mean (A); (B); (C); (A and B); (B and C); (A and C); or (A, B, and C). Language such as “top surface”, “bottom surface”, “vertical”, “horizontal”, and “lateral” in the present disclosure is meant to provide orientation for the reader with reference to the drawings and is not intended to be the required orientation of the components or to impart orientation limitations into the claims. In the drawings, some structural or method features may be shown in specific arrangements and/or orderings. However, it should be appreciated that such specific arrangements and/or orderings may not be required. Rather, in some embodiments, such features may be arranged in a different manner and/or order than shown in the illustrative figures. Additionally, the inclusion of a structural or method feature in a particular figure is not meant to imply that such feature is required in all embodiments and, in some embodiments, it may not be included or may be combined with other features. Many embodiments of the technology described herein may take the form of computer- or controller-executable instructions, including routines executed by a programmable computer or controller. Those skilled in the relevant art will appreciate that the technology can be practiced on computer/controller systems other than those shown and described above. The technology can be embodied in a special-purpose computer, controller or data processor that is specifically programmed, configured or constructed to perform one or more of the computer-executable instructions described above. Accordingly, the terms “computer” and “controller” as generally used herein refer to any data processor and can include Internet appliances and hand-held devices (including palm-top computers, wearable computers, cellular or mobile phones, multi-processor systems, processor-based or programmable consumer electronics, network computers, mini computers and the like). Information handled by these computers can be presented at any suitable display medium, including a cathode ray tube (CRT) display or liquid crystal display (LCD). FIG.1Ais a schematic illustration of a phased array antenna system100in accordance with embodiments of the present disclosure. The phased array antenna system100is designed and configured to transmit or receive a combined beam B composed of signals S (also referred to as electromagnetic signals, wavefronts, or the like) in a preferred direction D from or to an antenna aperture110. (Also see the combined beam B and antenna aperture110inFIG.1B). The direction D of the beam B may be normal to the antenna aperture110or at an angle θ from normal. Referring toFIG.1A, the illustrated phased array antenna system100includes an antenna lattice120, a mapping system130, a beamformer lattice140, a multiplex feed network150(or a hierarchical network or an H-network), a combiner or distributor160(a combiner for receiving signals or a distributor for transmitting signals), and a modulator or demodulator170. The antenna lattice120is configured to transmit or receive a combined beam B of radio frequency signals S having a radiation pattern from or to the antenna aperture110. In accordance with embodiments of the present disclosure, the phased array antenna system100may be a multi-beam phased array antenna system, in which each beam of the multiple beams may be configured to be at different angles, different frequency, and/or different polarization. In the illustrated embodiment, the antenna lattice120includes a plurality of antenna elements122i. A corresponding plurality of amplifiers124iare coupled to the plurality of antenna elements122i. The amplifiers124imay be low noise amplifiers (LNAs) in the receiving direction RX or power amplifiers (PAs) in the transmitting direction TX. The plurality of amplifiers124imay be combined with the plurality of antenna elements122iin for example, an antenna module or antenna package. In some embodiments, the plurality of amplifiers124imay be located in another lattice separate from the antenna lattice120. Multiple antenna elements122iin the antenna lattice120are configured for transmitting signals (see the direction of arrow TX inFIG.1Afor transmitting signals) or for receiving signals (see the direction of arrow RX inFIG.1Afor receiving signals). Referring toFIG.1B, the antenna aperture110of the phased array antenna system100is the area through which the power is radiated or received. In accordance with one embodiment of the present disclosure, an exemplary phased array antenna radiation pattern from a phased array antenna system100in the u/v plane is provided inFIG.1B. The antenna aperture has desired pointing angle D and an optimized beam B, for example, reduced side lobes Ls to optimize the power budget available to the main lobe Lm or to meet regulatory criteria for interference, as per regulations issued from organizations such as the Federal Communications Commission (FCC) or the International Telecommunication Union (ITU). (SeeFIG.1Ffor a description of side lobes Ls and the main lobe Lm.) Referring toFIG.1C, in some embodiments (see embodiments120A,120B,120C,120D), the antenna lattice120defining the antenna aperture110may include the plurality of antenna elements122iarranged in a particular configuration on a printed circuit board (PCB), ceramic, plastic, glass, or other suitable substrate, base, carrier, panel, or the like (described herein as a carrier112). The plurality of antenna elements122i, for example, may be arranged in concentric circles, in a circular arrangement, in columns and rows in a rectilinear arrangement, in a radial arrangement, in equal or uniform spacing between each other, in non-uniform spacing between each other, or in any other arrangement. Various example arrangements of the plurality of antenna elements122iin antenna lattices120defining antenna apertures (110A,110B,110C, and110D) are shown, without limitation, on respective carriers112A,112B,112C, and112D inFIG.1C. The beamformer lattice140includes a plurality of beamformers142iincluding a plurality of phase shifters145i. In the receiving direction RX, the beamformer function is to delay the signals arriving from each antenna element so the signals all arrive to the combining network at the same time. In the transmitting direction TX, the beamformer function is to delay the signal sent to each antenna element such that all signals arrive at the target location at the same time. This delay can be accomplished by using “true time delay” or a phase shift at a specific frequency. Following the transmitting direction of arrow TX in the schematic illustration ofFIG.1A, in a transmitting phased array antenna system100, the outgoing radio frequency (RF) signals are routed from the modulator170via the distributer160to a plurality of individual phase shifters145iin the beamformer lattice140. The RF signals are phase-offset by the phase shifters145iby different phases, which vary by a predetermined amount from one phase shifter to another. Each frequency needs to be phased by a specific amount in order to maintain the beam performance. If the phase shift applied to different frequencies follows a linear behavior, the phase shift is referred to as “true time delay”. Common phase shifters, however, apply a constant phase offset for all frequencies. For example, the phases of the common RF signal can be shifted by 0° at the bottom phase shifter145iinFIG.1A, by4aat the next phase shifter145iin the column, by24aat the next phase shifter, and so on. As a result, the RF signals that arrive at amplifiers124i(when transmitting, the amplifiers are power amplifiers “PAs”) are respectively phase-offset from each other. The PAs124iamplify these phase-offset RF signals, and antenna elements122iemit the RF signals S as electromagnetic waves. Because of the phase offsets, the RF signals from individual antenna elements122iare combined into outgoing wave fronts that are inclined at angle ϕ from the antenna aperture110formed by the lattice of antenna elements122i. The angle ϕ is called an angle of arrival (AoA) or a beamforming angle. Therefore, the choice of the phase offset Δα determines the radiation pattern of the combined signals S defining the wave front. InFIG.1B, an exemplary phased array antenna radiation pattern of signals S from an antenna aperture110in accordance with one embodiment of the present disclosure is provided. Following the receiving direction of arrow RX in the schematic illustration ofFIG.1A, in a receiving phased array antenna system100, the signals S defining the wave front are detected by individual antenna elements122i, and amplified by amplifiers124i(when receiving signals the amplifiers are low noise amplifiers “LNAs”). For any non-zero AoA, signals S comprising the same wave front reach the different antenna elements122iat different times. Therefore, the received signal will generally include phase offsets from one antenna element of the receiving (RX) antenna element to another. Analogously to the emitting phased array antenna case, these phase offsets can be adjusted by phase shifters145iin the beamformer lattice140. For example, each phase shifter145i(e.g., a phase shifter chip) can be programmed to adjust the phase of the signal to the same reference, such that the phase offset among the individual antenna elements122iis canceled in order to combine the RF signals corresponding to the same wave front. As a result of this constructive combining of signals, a higher signal to noise ratio (SNR) can be attained on the received signal, which results in increased channel capacity. Still referring toFIG.1A, a mapping system130may be disposed between the antenna lattice120and the beamformer lattice140to provide length matching for equidistant electrical connections between each antenna element122iof the antenna lattice120and the phase shifters145iin the beamformer lattice140, as will be described in greater detail below. A multiplex feed or hierarchical network150may be disposed between the beamformer lattice140and the distributor/combiner160to distribute a common RF signal to the phase shifters145iof the beamformer lattice140for respective appropriate phase shifting and to be provided to the antenna elements122ifor transmission, and to combine RF signals received by the antenna elements122i, after appropriate phase adjustment by the beamformers142i. In accordance with some embodiments of the present disclosure, the antenna elements122iand other components of the phased array antenna system100may be contained in an antenna module to be carried by the carrier112. (See, for example, antenna modules226aand226binFIG.2B). In the illustrated embodiment ofFIG.2B, there is one antenna element122iper antenna module226a. However, in other embodiments of the present disclosure, antenna modules226amay incorporate more than one antenna element122i. Referring toFIGS.1D and1E, an exemplary configuration for an antenna aperture120in accordance with one embodiment of the present disclosure is provided. In the illustrated embodiment ofFIGS.1D and1E, the plurality of antenna elements122iin the antenna lattice120are distributed with a space taper configuration on the carrier112. In accordance with a space taper configuration, the number of antenna elements122ichanges in their distribution from a center point of the carrier112to a peripheral point of the carrier112. For example, compare spacing between adjacent antenna elements122i, D1to D2, and compare spacing between adjacent antenna elements122i, d1, d2, and d3. Although shown as being distributed with a space taper configuration, other configurations for the antenna lattice are also within the scope of the present disclosure. The system100includes a first portion carrying the antenna lattice120and a second portion carrying a beamformer lattice140including a plurality of beamformer elements. As seen in the cross-sectional view ofFIG.1E, multiple layers of the carrier112carry electrical and electromagnetic connections between elements of the phased array antenna system100. In the illustrated embodiment, the antenna elements122iare located the top surface of the top layer and the beamformer elements142iare located on the bottom surface of the bottom layer. While the antenna elements122imay be configured in a first arrangement, such as a space taper arrangement, the beamformer elements142imay be arranged in a second arrangement different from the antenna element arrangement. For example, the number of antenna elements122imay be greater than the number of beamformer elements142i, such that multiple antenna elements122icorrespond to one beamformer element142i. As another example, the beamformer elements142imay be laterally displaced from the antenna elements122ion the carrier112, as indicated by distance M inFIG.1E. In one embodiment of the present disclosure, the beamformer elements142imay be arranged in an evenly spaced or organized arrangement, for example, corresponding to an H-network, or a cluster network, or an unevenly spaced network such as a space tapered network different from the antenna lattice120. In some embodiments, one or more additional layers may be disposed between the top and bottom layers of the carrier112. Each of the layers may comprise one or more PCB layers. Referring toFIG.1F, a graph of a main lobe Lm and side lobes Ls of an antenna signal in accordance with embodiments of the present disclosure is provided. The horizontal (also the radial) axis shows radiated power in dB. The angular axis shows the angle of the RF field in degrees. The main lobe Lm represents the strongest RF field that is generated in a preferred direction by a phased array antenna system100. In the illustrated case, a desired pointing angle D of the main lobe Lm corresponds to about 20°. Typically, the main lobe Lm is accompanied by a number of side lobes Ls. However, side lobes Ls are generally undesirable because they derive their power from the same power budget thereby reducing the available power for the main lobe Lm. Furthermore, in some instances the side lobes Ls may reduce the SNR of the antenna aperture110. Also, side lobe reduction is important for regulation compliance. One approach for reducing side lobes Ls is arranging elements122iin the antenna lattice120with the antenna elements122ibeing phase offset such that the phased array antenna system100emits a waveform in a preferred direction D with reduced side lobes. Another approach for reducing side lobes Ls is power tapering. However, power tapering is generally undesirable because by reducing the power of the side lobe Ls, the system has increased design complexity of requiring of “tunable and/or lower output” power amplifiers. In addition, a tunable amplifier124ifor output power has reduced efficiency compared to a non-tunable amplifier. Alternatively, designing different amplifiers having different gains increases the overall design complexity and cost of the system. Yet another approach for reducing side lobes Ls in accordance with embodiments of the present disclosure is a space tapered configuration for the antenna elements122iof the antenna lattice120. (See the antenna element122iconfiguration inFIGS.1C and1D.) Space tapering may be used to reduce the need for distributing power among antenna elements122ito reduce undesirable side lobes Ls. However, in some embodiments of the present disclosure, space taper distributed antenna elements122imay further include power or phase distribution for improved performance. In addition to undesirable side lobe reduction, space tapering may also be used in accordance with embodiments of the present disclosure to reduce the number of antenna elements122iin a phased array antenna system100while still achieving an acceptable beam B from the phased array antenna system100depending on the application of the system100. (For example, compare inFIG.1Cthe number of space-tapered antenna elements122ion carrier112D with the number of non-space tapered antenna elements122icarried by carrier112B.) FIG.1Gdepicts an exemplary configuration of the phased array antenna system100implemented as a plurality of PCB layers in lay-up180in accordance with embodiments of the present disclosure. The plurality of PCB layers in lay-up180may comprise a PCB layer stack including an antenna layer180a, a mapping layer180b, a multiplex feed network layer180c, and a beamformer layer180d. In the illustrated embodiment, mapping layer180bis disposed between the antenna layer180aand multiplex feed network layer180c, and the multiplex feed network layer180cis disposed between the mapping layer180band the beamformer layer180d. Although not shown, one or more additional layers may be disposed between layers180aand180b, between layers180band180c, between layers180cand180d, above layer180a, and/or below layer180d. Each of the layers180a,180b,180c, and180dmay comprise one or more PCB sub-layers. In other embodiments, the order of the layers180a,180b,180c, and180drelative to each other may differ from the arrangement shown inFIG.1G. For instance, in other embodiments, beamformer layer180dmay be disposed between the mapping layer180band multiplex feed network layer180c. Layers180a,180b,180c, and180dmay include electrically conductive traces (such as metal traces that are mutually separated by electrically isolating polymer or ceramic), electrical components, mechanical components, optical components, wireless components, electrical coupling structures, electrical grounding structures, and/or other structures configured to facilitate functionalities associated with the phase array antenna system100. Structures located on a particular layer, such as layer180a, may be electrically interconnected with vertical vias (e.g., vias extending along the z-direction of a Cartesian coordinate system) to establish electrical connection with particular structures located on another layer, such as layer180d. Antenna layer180amay include, without limitation, the plurality of antenna elements122iarranged in a particular arrangement (e.g., a space taper arrangement) as an antenna lattice120on the carrier112. Antenna layer180amay also include one or more other components, such as corresponding amplifiers124i. Alternatively, corresponding amplifiers124imay be configured on a separate layer. Mapping layer180bmay include, without limitation, the mapping system130and associated carrier and electrical coupling structures. Multiplex feed network layer180cmay include, without limitation, the multiplex feed network150and associated carrier and electrical coupling structures. Beamformer layer180dmay include, without limitation, the plurality of phase shifters145i, other components of the beamformer lattice140, and associated carrier and electrical coupling structures. Beamformer layer180dmay also include, in some embodiments, modulator/demodulator170and/or coupler structures. In the illustrated embodiment ofFIG.1G, the beamformers142iare shown in phantom lines because they extend from the underside of the beamformer layer180d. Although not shown, one or more of layers180a,180b,180c, or180dmay itself comprise more than one layer. For example, mapping layer180bmay comprise two or more layers, which in combination may be configured to provide the routing functionality discussed above. As another example, multiplex feed network layer180cmay comprise two or more layers, depending upon the total number of multiplex feed networks included in the multiplex feed network150. In accordance with embodiments of the present disclosure, the phased array antenna system100may be a multi-beam phased array antenna system. In a multi-beam phased array antenna configuration, each beamformer142imay be electrically coupled to more than one antenna element122i. The total number of beamformer142imay be smaller than the total number of antenna elements122i. For example, each beamformer142imay be electrically coupled to four antenna elements122ior to eight antenna elements122i.FIG.2Aillustrates an exemplary multi-beam phased array antenna system in accordance with one embodiment of the present disclosure in which eight antenna elements222iare electrically coupled to one beamformer242i. In other embodiments, each beamformer142imay be electrically coupled to more than eight antenna elements122i. FIG.2Bdepicts a partial, close-up, cross-sectional view of an exemplary configuration of the phased array antenna system200ofFIG.2Aimplemented as a plurality of PCB layers280in accordance with embodiments of the present disclosure. Like part numbers are used inFIG.2Bas used inFIG.1Gwith similar numerals, but in the200series. In the illustrated embodiment ofFIG.2B, the phased array antenna system200is in a receiving configuration (as indicated by the arrows RX). Although illustrated as in a receiving configuration, the structure of the embodiment ofFIG.2Bmay be modified to be also be suitable for use in a transmitting configuration. Signals are detected by the individual antenna elements222aand222b, shown in the illustrated embodiment as being carried by antenna modules226aand226bon the top surface of the antenna lattice layer280a. After being received by the antenna elements222aand222b, the signals are amplified by the corresponding low noise amplifiers (LNAs)224aand224b, which are also shown in the illustrated embodiment as being carried by antenna modules226aand226bon a top surface of the antenna lattice layer280a. In the illustrated embodiment ofFIG.2B, a plurality of antenna elements222aand222bin the antenna lattice220are coupled to a single beamformer242ain the beamformer lattice240(as described with reference toFIG.2A). However, a phased array antenna system implemented as a plurality of PCB layers having a one-to-one ratio of antenna elements to beamformer elements or having a greater than one-to-one ratio are also within the scope of the present disclosure. In the illustrated embodiment ofFIG.2B, the beamformers242iare coupled to the bottom surface of the beamformer layer280d. In the illustrated embodiment, the antenna elements222iand the beamformer elements242iare configured to be on opposite surfaces of the lay-up of PCB layers280. In other embodiments, beamformer elements may be co-located with antenna elements on the same surface of the lay-up. In other embodiments, beamformers may be located within an antenna module or antenna package. As previously described, electrical connections coupling the antenna elements222aand222bof the antenna lattice220on the antenna layer280ato the beamformer elements242aof the beamformer lattice240on the beamformer layer280dare routed on surfaces of one or more mapping layers280b1and280b2using electrically conductive traces. Exemplary mapping trace configurations for a mapping layer are provided in layer130ofFIG.1G. In the illustrated embodiment, the mapping is shown on top surfaces of two mapping layers280b1and280b2. However, any number of mapping layers may be used in accordance with embodiments of the present disclosure, including a single mapping layer. Mapping traces on a single mapping layer cannot cross other mapping traces. Therefore, the use of more than one mapping layer can be advantageous in reducing the lengths of the electrically conductive mapping traces by allowing mapping traces in horizontal planes to cross an imaginary line extending through the lay-up280normal to the mapping layers and in selecting the placement of the intermediate vias between the mapping traces. In addition to mapping traces on the surfaces of layers280b1and280b2, mapping from the antenna lattice220to the beamformer lattice240further includes one or more electrically conductive vias extending vertically through one or more of the plurality of PCB layers280. In the illustrated embodiment ofFIG.2B, a first mapping trace232abetween first antenna element222aand beamformer element242ais formed on the first mapping layer280b1of the lay-up of PCB layers280. A second mapping trace234abetween the first antenna element222aand beamformer element242ais formed on the second mapping layer280b2of the lay-up of PCB layers280. An electrically conductive via238aconnects the first mapping trace232ato the second mapping trace234a. Likewise, an electrically conductive via228aconnects the antenna element222a(shown as connecting the antenna module226aincluding the antenna element222aand the amplifier224a) to the first mapping trace232a. Further, an electrically conductive via248aconnects the second mapping trace234ato RF filter244aand then to the beamformer element242a, which then connects to combiner260and RF demodulator270. Of note, via248acorresponds to via148aand filter244acorresponds to filter144a, both shown on the surface of the beamformer layer180din the previous embodiment ofFIG.1G. In some embodiments of the present disclosure, filters may be omitted depending on the design of the system. Similar mapping connects the second antenna element222bto RF filter244band then to the beamformer element242a. The second antenna element222bmay operate at the same or at a different value of a parameter than the first antenna element222a(for example at different frequencies). If the first and second antenna elements222aand222boperate at the same value of a parameter, the RF filters244aand244bmay be the same. If the first and second antenna elements222aand222boperate at different values, the RF filters244aand244bmay be different. Mapping traces and vias may be formed in accordance with any suitable methods. In one embodiment of the present disclosure, the lay-up of PCB layers280is formed after the multiple individual layers280a,280b,280c, and280dhave been formed. For example, during the manufacture of layer280a, electrically conductive via228amay be formed through layer280a. Likewise, during the manufacture of layer280d, electrically conductive via248amay be formed through layer280d. When the multiple individual layers280a,280b,280c, and280dare assembled and laminated together, the electrically conductive via228athrough layer280aelectrically couples with the trace232aon the surface of layer280b1, and the electrically conductive via248athrough layer280delectrically couples with the trace234aon the surface of layer280b2. Other electrically conductive vias, such as via238acoupling trace232aon the surface of layer280b1and trace234aon the surface of layer280b2can be formed after the multiple individual layers280a,280b,280c, and280dare assembled and laminated together. In this construction method, a hole may be drilled through the entire lay-up280to form the via, metal is deposited in the entirety of the hole forming an electrically connection between the traces232aand234a. In some embodiments of the present disclosure, excess metal in the via not needed in forming the electrical connection between traces232aand234acan be removed by back-drilling the metal at the top and/or bottom portions of the via. In some embodiments, back-drilling of the metal is not performed completely, leaving a via “stub”. Tuning may be performed for a lay-up design with a remaining via “stub”. In other embodiments, a different manufacturing process may produce a via that does not span more than the needed vertical direction. As compared to the use of one mapping layer, the use of two mapping layers280b1and280b2separated by intermediate vias238aand238bas seen in the illustrated embodiment ofFIG.2Ballows for selective placement of the intermediate vias238aand238b. If these vias are drilled though all the layers of the lay-up280, they can be selectively positioned to be spaced from other components on the top or bottom surfaces of the lay-up280. FIGS.3A and3Bare directed to another embodiment of the present disclosure.FIG.3Aillustrates an exemplary multi-beam phased array antenna system in accordance with one embodiment of the present disclosure in which eight antenna elements322iare electrically coupled to one beamformer342i, with the eight antenna elements322ibeing into two different groups of interspersed antenna elements322aand322b. FIG.3Bdepicts a partial, close-up, cross-sectional view of an exemplary configuration of the phased array antenna system300implemented as a stack-up of a plurality of PCB layers380in accordance with embodiments of the present disclosure. The embodiment ofFIG.3Bis similar to the embodiment ofFIG.2B, except for differences regarding interspersed antenna elements, the number of mapping layers, and the direction of signals, as will be described in greater detail below. Like part numbers are used inFIG.3Bas used inFIG.3Awith similar numerals, but in the300series. In the illustrated embodiment ofFIG.3B, the phased array antenna system300is in a transmitting configuration (as indicated by the arrows TX). Although illustrated as in a transmitting configuration, the structure of the embodiment ofFIG.3Bmay be modified to also be suitable for use in a receiving configuration. In some embodiments of the present disclosure, the individual antenna elements322aand322bmay be configured to receive and/or transmit data at different values of one or more parameters (e.g., frequency, polarization, beam orientation, data streams, receive (RX)/transmit (TX) functions, time multiplexing segments, etc.). These different values may be associated with different groups of the antenna elements. For example, a first plurality of antenna elements carried by the carrier is configured to transmit and/or receive signals at a first value of a parameter. A second plurality of antenna elements carried by the carrier are configured to transmit and/or receive signals at a second value of the parameter different from the first value of the parameter, and the individual antenna elements of the first plurality of antenna elements are interspersed with individual antenna elements of the second plurality of antenna elements. As a non-limiting example, a first group of antenna elements may receive data at frequency f1, while a second group of antenna elements may receive data at frequency f2. The placement on the same carrier of the antenna elements operating at one value of the parameter (e.g., first frequency or wavelength) together with the antenna elements operating at another value of the parameter (e.g., second frequency or wavelength) is referred to herein as “interspersing”. In some embodiments, the groups of antenna elements operating at different values of parameter or parameters may be placed over separate areas of the carrier in a phased array antenna. In some embodiments, at least some of the antenna elements of the groups of antenna elements operating at different values of at least one parameter are adjacent or neighboring one another. In other embodiments, most or all of the antenna elements of the groups of antenna elements operating at different values of at least one parameter are adjacent or neighboring one another. In the illustrated embodiment ofFIG.3A, antenna elements322aand322bare interspersed antenna elements with first antenna element322acommunicating at a first value of a parameter and second antenna element322acommunicating at a second value of a parameter. Although shown inFIG.3Aas two groups of interspersed antenna elements322aand322bin communication with a single beamformer342a, the phased array antenna system300may be also configured such that one group of interspersed antenna elements communicate with one beamformer and another group of interspersed antenna elements communicate with another beamformer. In the illustrated embodiment ofFIG.3B, the lay-up380includes four mapping layers380b1,380b2,380b3, and380b4, compared to the use of two mapping layers280b1and280b2inFIG.2B. Mapping layers380b1and380b2are connected by intermediate via338a. Mapping layers380b3and380b4are connected by intermediate via338b. Like the embodiment ofFIG.2B, the lay-up380of the embodiment ofFIG.3Bcan allow for selective placement of the intermediate vias338aand338b, for example, to be spaced from other components on the top or bottom surfaces of the lay-up380. The mapping layers and vias can be arranged in many other configurations and on other sub-layers of the lay-up180than the configurations shown inFIGS.2B and3B. The use of two or more mapping layers can be advantageous in reducing the lengths of the electrically conductive mapping traces by allowing mapping traces in horizontal planes to cross an imaginary line extending through the lay-up normal to the mapping layers and in selecting the placement of the intermediate vias between the mapping traces. Likewise, the mapping layers can be configured to correlate to a group of antenna elements in an interspersed configuration. By maintaining consistent via lengths for each grouping by using the same mapping layers for each grouping, trace length is the only variable in length matching for each antenna to beamformer mapping for each grouping. Two-Layer Multiplex Feed Networks FIG.4Adepicts an example of a signal feed network400according to some embodiments of the present disclosure.FIG.4Bdepicts additional details of a portion402of the signal feed network400according to some embodiments of the present disclosure. In the example network ofFIG.4A, signal feed network400may comprise a single H-network having a plurality of pads408and a plurality of signal combiners or splitters404interconnected to each other via a respective plurality of traces406. Network400may include a plurality of H-network portions402, in which a number of portions402in a first direction (N) may be the same or different from a number of portions402in a second direction perpendicular to the first direction (M). If a plurality of signal feed networks is to be implemented, each signal feed network of the plurality of signal feed networks may be provided on a separate base or layer, as depicted inFIG.5. The configuration ofFIG.5may comprise a conventional scheme for implementing a plurality of signal feed networks. For example, network400ofFIG.4B(e.g., one H-network) may be provided on a base/layer410, a H-network412may be provided on a base/layer414, and a H-network416may be provided on a base/layer418. Base/layer414may be disposed between bases/layers410and418in a direction perpendicular to the major plane of base/layer414. Bases/layers410,414,418may comprise printed circuit boards (PCBs). The number of H-network portions (e.g., portion402) associated with each of networks400,412,416may be the same as each other. Since each signal feeder network requires a distinct base or layer, as the number of such networks increases, so does the number of layers required for networks to be formed. For instance, if 16 signal feeder networks may be required for an antenna system, then 16 layers of signal feeder network PCBs may be included in the antenna system. Inclusion of greater number of PCB layers introduces signal degradation or loss potential, higher costs, higher manufacturing time, assembly complexity, increased weight, increased size, misalignment potential, and/or the like. Instead of configuring a single signal feeder network per layer, a plurality of signal feeder networks may be provided on two layers, which results in reduction in the total number of layers required for networks. Signal feeder networks may also be referred to as multiplex feed networks or the like. In some embodiments, multiplex feed network layer180cinFIG.1Gmay comprise a plurality of multiplex feed networks arranged on more than one layer. For example, multiplex feed network layer180cmay include four, five, eight, or more multiplex feed networks. Each multiplex feed network of the plurality of multiplex feed networks may comprise, without limitation, electrically conductive traces arranged or configured as a hierarchical network, a fractal network, a self-similar fractal network, a tree network, a star network, a hybrid network, a rectilinear network, a curvilinear network, a H-network (also referred to as a H-tree network), a rectilinear H-network, a curvilinear H-network, or other networks in which each signal inputted to a network traverses through the same length of traces to avoid spurious signal delays caused by different trace lengths. In some embodiments, for three or more multiplex feed networks included in the multiplex feed network layer180c, the number of layers used to provide the electrical conductive traces (also referred to as traces) of all the multiplex feed networks may be equal to the number of different or unique orientations or directions of the traces of the plurality of multiplex feed networks. All of the multiplex feed networks included in the multiplex feed network layer180cmay be decomposed or deconstructed in accordance with different/unique orientations or directions of the traces in respective layers. As an example, if the multiplex feed network layer180ccomprises a plurality of H-networks, all of the traces of the H-networks may be formed on two layers. Hence, if the multiplex feed network layer180ccomprises four H-networks, for example, all of the traces associated with the four H-networks may be formed using two layers instead of four layers as in the conventional scheme (one layer for each of the four H-networks). Similarly, if the multiplex feed network layer180ccomprises eight H-networks, for example, all of the traces associated with the eight H-networks may be formed using two layers instead of eight layers as in the conventional scheme (one layer for each of the eight H-networks). FIG.6Adepicts a top view of an example of the multiplex feed network layer180c, according to some embodiments of the present disclosure. A multiplex feed network stack600may comprise the multiplex feed network layer180ccomposed of four H-networks610,612,614, and616. H-networks610,612,614,616may be electrically isolated from each other. In some embodiments, radio frequency (RF) signals602may comprise the input signals to the multiplex feed network stack600. RF signals602may be provided by a modulator (e.g., modulator170) when the multiplex feed network stack600is included in a transmitter panel of a phase array antenna system. Stack600may be configured to provide or feed the received RF signals602to other layers or components (e.g., beamformer layer180dor beamformer lattice140,240, or340) included in the phase array antenna system. RF signals602may be the same or different frequencies from each other. If the multiplex feed network stack600is configured in a receiver panel of the phase array antenna system, RF signals602may comprise output signals received from a beamformer lattice or layer to be inputted to a demodulator (e.g., demodulator170). Each RF signal of the RF signals602may be associated with a different beam or channel. All of the traces associated with H-networks610,612,614, and616may comprise traces arranged in a horizontal direction/orientation (e.g., traces604in an x-direction of the Cartesian coordinate system) and traces arranged in a vertical direction/orientation (e.g., traces606in a y-direction of the Cartesian coordinate system). Because H-networks610,612,614,616may comprise a rectilinear configuration, the shape of traces604,606may be linear or straight lines and the direction/orientation of traces604and606may be perpendicular to each other in the x-y plane. Traces extending from the last/end nodes of the H-networks610,612,614, and616may be referred to as termination trace segments601. The ends of the termination trace segments601opposite to the last/end nodes may comprise termination ends608of the termination trace segments601. In some embodiments, termination ends608may include a pad, end cap, or other structure to facilitate electrical and/or physical coupling with vias that extend between layers (e.g., vias that extend in the z-direction). Alternatively, H-networks610,612,614,616may be configured as a curvilinear network, in which the shape of traces604and606may be curved or non-linear and the direction/orientation of traces604,606may be perpendicular to each other in the x-y plane. In some embodiments, traces606(the vertical traces) of H-networks610,612,614,616may be provided on a layer620, as shown inFIG.6B, while traces604(the horizontal traces) of H-networks610,612,614,616may be provided on a layer630, as shown inFIG.6C. Layer620may be disposed above or over layer630along a z-direction of the Cartesian coordinate system, and configured to align traces604and606associated with respective H-networks610,612,614, and616to each other. Each of layers620,630may include a PCB, substrate, base, baseboard, carrier, or other structures in addition to respective traces606,604to facilitate fabrication, electrical isolation, structural support or integrity, and/or grounding of respective traces606,604on separate layers. Thus, traces associated with H-networks610,612,614,616may be fabricated using fewer than four layers. Traces having a vertical orientation/direction may be fabricated on a different plane from traces having a horizontal orientation/direction. Although multiplex feed network stack600is shown having layer620disposed above layer630, layer620may be disposed below layer630in alternative embodiments. Note that references to “vertical” and “horizontal” herein are used merely to aid in describing the present disclosure. If multiplex feed network stack600is rotated by 90 degrees in the x-y plane, for example, then the designation of “vertical” and “horizontal” would be reversed. In some embodiments, the number of nodes (or number of termination ends) of H-networks610,612,614, and/or616may be the same or different from one or both of number of antenna elements122iincluded in antenna layer180aand the number of beamformers142iincluded in beamformer layer180d. The number of nodes of each of H-networks610,612,614,616may be 2N, and thus, scale as a power of 2, e.g., 16, 32, 64, 128, 256, etc., in which N is the number of stages/levels of a H-network. In cases where the number of termination ends exceeds the number of connections between H-networks610,612,614, and/or616to other structures/components of the phase array antenna system, the unused termination ends may be terminated (e.g., terminated to ground) to avoid unwanted signal reflections. FIG.7Adepicts a top view of another example of the multiplex feed network layer180c, according to some embodiments of the present disclosure. A multiplex feed network stack700may comprise the multiplex feed network layer180ccomposed of eight H-networks710,712,714,716,718,720,722, and724formed using two layers. H-networks710,712,714,716,718,720,722, and724may be electrically isolated from each other. Multiplex feed network stack700may be similar to multiplex feed network stack600except a greater number of H-networks may be included than in stack600. In some embodiments, radio frequency (RF) signals702may comprise the input/output signals to the multiplex feed network stack700. RF signals702may be the same or different frequencies from each other. All of the traces associated with rectilinear H-networks710,712,714,716,718,720,722, and724may comprise traces arranged in a horizontal direction/orientation (e.g., traces704in an x-direction of the Cartesian coordinate system) and traces arranged in a vertical direction/orientation (e.g., traces706in a y-direction of the Cartesian coordinate system). Each of the traces704that comprise a termination or end segment (e.g., termination trace segments721) of H-networks710,712,714,716,718,720,722, and724may include a termination end708. Similar to the discussion above for H-networks610,612,614,616, H-networks710,712,714,716,718,720,722, and724may alternatively be configured as a curvilinear network, and traces704,706may comprise curved or non-linear shaped traces which may be perpendicular to each other in the x-y plane. FIG.7Bdepicts a top view of a portion750of the H-networks710,712,714,716,718,720,722,724shown inFIG.7A. In some embodiments, traces706of H-networks710,712,714,716,718,720,722,724may be provided on a layer720, as shown inFIG.7C, while traces704of H-networks710,712,714,716,718,720,722,724may be provided on a layer730, as shown inFIG.7D. Layer720may be disposed above or over layer730along a z-direction of the Cartesian coordinate system, and configured to align traces704and706associated with respective H-networks710,712,714,716,718,720,722,724to each other. Each of layers720,730may include a PCB, substrate, base, baseboard, carrier, or other structures in addition to respective traces706,704to facilitate fabrication, electrical isolation, structural support or integrity, and/or grounding of respective traces706,704on separate layers. Thus, traces associated with H-networks710,712,714,716,718,720,722,724may be fabricated using fewer than eight layers. InFIG.7A, each of the H-networks710,712,714,716,718,720,722,724comprises a five stage/level H-network. Since the number of terminating ends of an H-network is 2N, for N=5 stages/levels, there are 25=32 terminating ends (e.g., termination ends708) for each of the eight H-networks. And a combined total of 32*8=256 terminating ends for the eight H-networks. Accordingly, termination or end trace segments721may extend from the last nodes (e.g., 5thnodes) of each of the H-networks, and terminate or end at termination ends708. In some embodiments, each of the termination ends708may include an end cap, pad, or other structure to facilitate electrical and/or physical coupling with a via that extends between particular inputs of beamformers142iin the beamformer layer180d. Although five stages/levels are shown, H-networks710,712,714,716,718,720,722,724may comprise fewer or more than five stages/levels. H-networks710,712,714,716,718,720,722,724may comprise fewer or more than eight networks. Each of H-networks710,712,714,716,718,720,722,724may include an input or output702. Input/output702may comprise an input when the H-networks are configured in a receiver panel and an output when the H-networks are configured in a transmitter panel. Each input/output702may be associated with a signal having particular parameters. For instance, without limitation, the respective signals may differ from each other in frequency. Each input/output702or corresponding signal may be associated with a different beam or channel. Hence, a phased antenna array system including eight H-networks may be capable of up to eight channel operation. Signals S5, S6, S2, S1, S8, S7, S3, S4may be associated with respective inputs/outputs702from left to right inFIG.7A. Returning toFIG.7B, termination ends708may comprise the outputs/inputs of the H-networks710,712,714,716,718,720,722,724. For example, if input/output702associated with signal S1is configured as the input for the particular H-network associated with signal S1, then termination ends708included in such H-network may be considered to be outputs of such H-network. Conversely, if input/output702associated with signal S1is configured as the output for the particular H-network associated with signal S1, termination ends708included in such H-network may be considered to be inputs of such H-network. Although multiplex feed network stack700is shown having layer720disposed above layer730, layer720may be disposed below layer730in alternative embodiments. In embodiments in which the multiplex feed network may include traces in more than two different orientations/directions, the number of different layers or planes in which the traces may be fabricated may be in accordance with the number of different orientations/directions of the traces. For instance, if the multiplex feed network comprises traces in three different orientations/directions, then three layers may be implemented to provide the traces. The traces of the multiplex feed network also need not be linear. Non-linear or curved traces may also be decomposed from the rest of the traces of the multiplex feed network in different layers from each other. FIG.8depicts a cross-sectional view of an example multiplex feed network stack800, according to some embodiments of the present disclosure. Multiplex feed network stack800may comprise multiplex feed network stack600or700. Multiplex feed network stack800may comprise layers810,820,830, and840, in which layer830may be disposed between layers820and840, and layer820may be disposed between layers810and830. Layer810may comprise a top layer of the stack800and layer840may comprise a bottom layer of the stack800. In some embodiments, layer820may be similar to layer620or720, and layer830may be similar to layer630or730. In addition to the two trace layers820,830, a plurality of vias, such as vias824and826, may be located in and/or extend between layers820and830. Vias824and826may comprise electrically conductive vias configured to electrically interconnect traces located in layers820to traces located in layer830. As described in more detail below, at least one via of the plurality of vias may be associated with each combination of a vertical trace and a horizontal trace of H-networks included in the stack800where an intersection may occur if the vertical and horizontal traces were located on the same plane. In other words, each perpendicular path (e.g., along the z-axis) from a vertical trace of layer820to a horizontal trace of layer830may identify an electrical interconnection or coupling location to be provided by one or more vias. Examples of such “intersection” areas are depicted as intersection areas650,652,654inFIG.6Aand intersection areas750,752inFIG.7A. Each of layers810and840may include a ground layer or plane, an electrical isolation layer, an adhesive layer, and/or the like. In some embodiments, layers810and/or840may include structures such as electrical isolation vias or Faraday cage structures. Layer810may be optional, for example, if no layer may be disposed above stack800. Likewise, layer840may be optional, for example, if no layer may be disposed below stack800. Layers810,820,830, and/or840may include a PCB, substrate, base, baseboard, carrier, or other material in addition to the structures/components discussed above to facilitate fabrication, electrical isolation, structural support or integrity, and/or grounding of respective structures/components includes in respective layers. Although not shown, in some embodiments, stack800may include one or more additional layers. For instance, a pad layer comprising a plurality of conductive pads distributed to align with termination area or end caps608and/or708. As another example, one or more layers including routing and/or interconnect structures to electrically couple with layer(s) including beam forming components, phase shifting components, or the like. Multi-Layer Power Splitter/Combiner FIG.9depicts a block diagram of an example power splitter/combiner900included in the stack800, according to some embodiment of the present disclosure. Each “intersection” or junction between a trace of layer820and a trace of layer830(e.g., at intersection area650,652,654,750, or752) may be associated with a power splitter/combiner900configured to handle the routing of the RF signal at that location between the different layers820and830. Accordingly, a plurality of power splitters/combiners may be included in the stack800, each power splitter/combiner of the plurality of power splitters/combiners associated with a respective “intersection” of vertical and horizontal traces of the multiplex feed networks. In some embodiments, power splitter/combiner900may be configured to divide or split an incoming/input RF signal provided in a first layer into two output RF signals outputted at a second layer different from the first layer, in which each of the two output RF signals has half the power of the power associated with the incoming RF signal, each of the two output RF signals has the same frequency as the input RF signal, impedance match is maintained among all of the three lines or ports of the power splitter/combiner900(the input line/port in which the incoming RF signal is received and the two output lines/ports in which the two output RF signals are outputted), and electrical isolation is maintained among the lines or ports. As shown inFIG.9, a trace902included in layer820of stack800may provide the input RF signal to the power splitter/combiner900. Trace902may be electrically coupled to an input line/port/trace of the power splitter/combiner900. Trace902may comprise, for example, a single trace606or706. Traces904,906included in layer830of stack800may receive respective first and second output RF signals generated by the power splitter/combiner900. Traces904,906may be electrically coupled to respective first and second output lines/ports/traces of the power splitter/combiner900. Traces904and906together may comprise, for example, a single trace604or704with an isolation resistor included (as described in detail below in connection withFIG.10) to ensure isolation of the first and second output RF signals from each other. Power splitter/combiner900may be located in layers820and830, as described in detail below. In some embodiments, the overall dimensions of the power splitter/combiner900may be symmetrical and the power splitter/combiner900may be centered in the x-y plane with respect to traces902,904, and906. Dimensions910(d1),912(d2),914(d3),916(d4),918(d5), and920(d6) of the power splitter/combiner900may be equal to each other. Alternatively, one or more of dimensions910-920may be different from each other. In this configuration, power splitter/combiner900may be slightly larger since the output lines may include a (further) curvature. In some embodiments, the overall dimensions or size of the power splitter/combiner900may determine the distance between adjacent traces of the multiplex feed network, and thus the density of the multiplex feed networks. The smaller the size of the power splitter/combiner900, the greater the multiplex feed network density may be possible. Power splitter/combiner900may also be referred to as a power splitter, signal divider, signal splitter, power or signal combiner, power divider/combiner, a signal splitter/combiner, a signal divider/combiner, multiple-input and multiple-output (MIMO) power splitter/combiner/splitter/combiner, Wilkinson splitter/divider or combiner, or the like. Power splitter/combiner900may comprise a reciprocal component in which signal propagation may also occur in reverse from that described above such that the power splitter/combiner900may function as a power or signal combiner. Two input RF signals may be received by the power splitter/combiner900(from traces904,906) and the power splitter/combiner900may generate a single output RF signal outputted to trace902having the combined power of the powers associated with the two input RF signals, while impedance match and electrical isolation are maintained among all the lines/ports/traces of the power splitter/combiner900. FIG.10depicts an isometric view of the power splitter/combiner900and associated traces, according to some embodiments of the present disclosure. InFIG.10, one or more materials, structures, and/or layers surrounding power splitter/combiner900are not shown to ease illustration of the power splitter/combiner900structure. In some embodiments, power splitter/combiner900may comprise an input line1001(also referred to as an input trace or port), a first output line1004(also referred to as a first output trace, port, or branch), and a second output line1006(also referred to as a second output trace, port, or branch). Input line1001may be located in layer820, and each of first and second output lines1004,1006may be located in layers820and830. Input line1001may be electrically coupled to trace902. First and second output lines1004,1006may be electrically coupled to and extend from each side of the input line1001, and also electrically couple to traces904,906, respectively. In the illustrated embodiment, first and second output lines1004,1006comprise identical or symmetrical structures which are mirrored on opposing sides of the input line1001. In some embodiments, first output line1004may include a top portion1010, a mid portion1012, and a bottom portion1014. Top portion1010may be located in layer820. Top portion1010may comprise a trace having an arc or curved shape that perpendicularly extends from the end of the input line1001and curves back toward the input line1001. Mid portion1012may be located in layers820and830. Mid portion1012may comprise a via, such as via824or826shown inFIG.8. Mid portion1012may be configured to electrically interconnect with the end of the top portion1010that curves back toward the input line1001and with an end of the bottom portion1014. Bottom portion1014may be located in layer830. Bottom portion1014may comprise a trace having an arc or curved shape that (perpendicularly) intersects with trace904. Top and bottom portions1010,1014may be oriented parallel to a major surface of layers820,830, respectively, and mid portion1012may be oriented, at least in part, perpendicular to a major surface of layer820. Accordingly, an input RF signal provided by the trace902may be converted into a first output RF signal by the first output line1004via traversal of a signal pathway1000. Second output line1006may be similar to first output line1004except mirrored around the opposite side of the input line1001. Second output line1004may include a top portion1020similar to top portion1010, a mid portion1022similar to mid portion1012, and a bottom portion1024similar to bottom portion1014. The input RF signal provided by the trace902may be converted into a second output RF signal by the second output line1006via traversal of a signal pathway1002. Input line1001, top portions1010,1020, and/or bottom portions1014,1024may comprise electrical conductive traces which may be fabricated simultaneously as a continuous trace with traces902,904, and/or906in respective layers820,830. For example, trace902, input line1001, top portion1010, and top portion1020may be formed simultaneously as a continuous trace in layer820. Bottom portion1014, bottom portion1024, trace904, and trace906may be formed simultaneously as a continuous trace in layer830. Mid portions1012,1022may be formed by selectively drilling or etching into the material of layers820and/or830and filling (or at least coating the inner surfaces) with conductive material to form vias that extend between layers820and830. Accordingly, power splitter/combiner900may also be referred to as a symmetric double curve power splitter/combiner or symmetric double curve multiplex power splitter/combiner. In some embodiments, a signal pathway length associated with each of the first and second output lines1004,1006may comprise λ/4, and thus, lines1004,1006may also be referred to as quarter wave lines. The signal pathway length (also referred to as an electrical pathway length, signal length, output length, or the like) associated with the first output line1004may extend from one end of the first output line1004from the intersection/junction of the input line1001and first and second output lines1004,1006in layer820to the opposite end of the first output line1004that intersects with trace904in layer830. A similar signal pathway length may also be defined for the second output line1006. In some embodiments, a distance1026between mid portions1012and1022may be approximately 2.5 mm and a width of the input line1001, trace902, first input line1004, second input line1006, trace904, or trace906may be in the range of 0.4-1.5 mm. In some embodiments, an isolation resistor1028may be included in an area in layer830located approximately perpendicular below the intersection of input line1001with first and second output lines1004,1006, and which coincides with the intersection of traces904and906. As mentioned above, traces904and906may comprise a single trace604or704. Isolation resistor1028may be configured to “cut” the single trace into two traces, at least for purposes of electrically isolating first and second output RF signals from each other. Alternatively, traces904,906may be formed as separate traces and isolation resistor1028may be formed between traces904,906within layer830. As another alternative, isolation resistor1028may be optional if traces904,906may be electrically isolated from each other. Isolation resistor1028may comprise a resistive material printed in layer830, having a same width as traces904,906, and/or a 100 ohm resistance. In some embodiments, a resistance associated with each of the input line1001and first and second output lines1004,1006may be 50 Ohm. Power splitter/combiner900may, thus, comprise a first electrically conductive trace902included in a first layer, second and third electrically conductive traces904,906included in a second layer disposed above or below the first layer, and first and second electrically conductive vias1022,1012. Power splitter/combiner900may comprise a three port or branch structure, in which first, second, and third ports intersect with each other. A first port comprises a first portion of the first electrically conductive trace902(e.g., input line1001); a second port comprises a second portion of the first electrically conductive trace902(e.g., input line1001), second electrically conductive trace906(e.g., second output line1006), and first electrically conductive via1022; and a third port comprises a third portion of the first electrically conductive trace902(e.g., input line1001), third electrically conductive trace904(e.g., first output line1004), and second electrically conductive via1012. In this manner, the signal length associated with each of the first and second output lines1004,1006may be longer than otherwise possible given the pitch (distance between adjacent traces) and/or frequency associated with power splitter/combiner900than if power splitter/combiner900is located all in a single layer of stack800. The signal length of each of the first and second output lines1004,1006may be larger than a pitch associated with traces902,904/906. The curvature, shape, or contour of each of the first and second output lines1004,1006extending between and among layers820and830may be configured in accordance with a particular pitch, frequency, and/or other design parameters. The configuration of the power splitter/combiner900spanning more than one layer or plane may facilitate compact design and higher trace density. If the second or third output line1004,1006of power splitter/combiner900is configured in a single layer or plane, such as layer1100(L1) inFIG.11, then 100% of the length of either of such lines is located in the single layer/plane1100. In contrast, because each of the second and third output lines1004,1006is provided in at least two layers/planes, the total length of either of such lines may be distributed or spread out among the at least two layers/planes. The right side ofFIG.11illustrates a layer1102(L1) disposed over a layer1104(L2) with a via1106disposed at least partially in between layers1102,1104. Each of layers1102,1104may carry less than 100% of the total length of either of such lines. In some embodiments, approximately 25-60% of the total length may be located in layer1102, approximately 25-60% of the total length may be located in layer1104, and approximately 5-35% of the total length may be located in/by via1106. Because less than 100% of the total length of a line/port/branch is implemented in any layer, the corresponding planar area required to locate the line/port/branch in each layer may be smaller than the planar area associated with 100% of the total length implemented in a single layer1100. Hence, the multi-layer configuration of power splitter/combiner900comprises a miniaturization technique. Reduced size power splitters/combiners and/or reduced overall size of an H-network which includes multi-layer power splitters/combiners may be achieved. FIG.12depicts an isometric view of power splitter/combiner900shown in the context of layers820,822, and830, according to some embodiments of the present disclosure. Layer822may comprise a dielectric or non-conductive material which may be included to at least provide structure upon which at least portions of the power splitter/combiner900included in layer820may be formed and/or supported after fabrication. Layer822may be disposed between layer820and layer830of stack800. In alternative embodiments where portions of the power splitter/combiner900included in layer820may otherwise be formed and/or be structurally stable without the dielectric or non-conductive material, then such dielectric or non-conductive material may be optional. As still another alternative, dielectric or non-conductive material may be included in layer820below the trace902, input line1001, and first and second output lines1004,1006. FIG.13Adepicts a top view of the stack800showing the top layer of the power splitter/combiner900(e.g., layer820) and at least a portion of the layer810, according to some embodiments of the present disclosure. In some embodiments, trace902, input line1001, top portion1010, and top portion1020may be disposed above dielectric or non-conductive material1204. Dielectric or non-conductive material1204may be formed as a layer and then selectively removed to have a width slightly wider than that of the trace902, input line1001, top portion1010, and top portion1020, as shown inFIG.12. Or dielectric or non-conductive material1204may be printed having the desired shape and selective removal may be omitted. In some embodiments, one or more isolation vias may be configured to form a Faraday cage around or electrically isolate one or more portions of the power splitter/combiner900. Isolation vias may be associated with one or both of the bottom and top layers of the power splitter/combiner900. Alternatively, isolation vias may be optional. FIG.13Bdepicts a top view of a plurality of power splitters/combiners associated with four H-networks, according to some embodiments of the present disclosure. Each power splitter/combiner of the plurality of power splitters/combiners along with associated structures—collectively denoted as an area1202—may correspond to the top view shown inFIG.13A. The four power splitters/combiners may be associated with a respective “intersection” of vertical and horizontal traces of respective H-networks610,612,614, and616, which may be denoted as an intersection area656inFIG.6A. Such set of four power splitters/combiners may be provided at each intersection area of H-networks610,612,614, and616. In this manner, signals may be appropriately split and propagated between layers820and830at each intersection location. Conversely, signals may be appropriately combined and propagated between layers820and830for each intersection location. FIGS.14A-14Bdepict isometric views of the set of four power splitters/combiners ofFIG.13Bshown within the context of various layers of stack800, according to some embodiments of the present disclosure. InFIGS.14A-14B, the locations of the vertical traces1402and horizontal traces1404associated with respective power splitters/combiners are shown. In some embodiments, a distance or pitch1406between adjacent power splitters/combiners or vertical traces may be approximately 3 mm (e.g., 2.99 mm to 3.01 mm). Distance or pitch1406may also be referred to as an x-direction pitch. A distance or pitch1408(also referred to a y-direction pitch) between adjacent power splitters/combiners or horizontal traces may also be approximately 3 mm. The x- and y-direction pitches may be the same or different from each other. In some embodiments, a total width of approximately 10.8 mm may be achieved for four traces (also referred to as transmission lines) located in parallel to each other. FIGS.15A-15Bdepict each of the power splitters/combiners configured in a package or other encasing structure, according to some embodiments of the present disclosure. Dimensions associated with the set of four power splitters/combiners of a four H-network configuration (such as inFIG.6A) are denoted.FIG.15Aillustrates a plurality of power splitters/combiners1520located at intersections of horizontal and vertical traces. Each of the power splitter/combiner1520is centered or aligned to the intersection location. The distance between adjacent horizontal traces may define the pitch1408. The distance between adjacent vertical traces may define the pitch1406. Each power splitter/combiner1520, which may be similar to power splitter/combiner900, may have a first overall dimension1504along the x-direction of approximately 4.4 mm and a second overall dimension1506along the y-direction of approximately 3.13 mm.FIG.15Bdepicts each of the power splitters/combiners, such as a power splitter/combiner1522which may comprise an asymmetric single curve multiplex power splitter/combiner, configured in an offset position relative to its associated intersection location. Power splitter/combiner1522may be offset in the y-direction to be located (e.g., centered) between its associated horizontal trace and a horizontal trace immediately adjacent or next to the associated horizontal trace. Otherwise, power splitter/combiner1522may be similar to power splitter/combiner1520. FIG.15Cdepicts an example of packaged eight power splitters/combiners associated with an eight H-network configuration (such as shown inFIG.7A), according to some embodiments of the present disclosure. In some embodiments, a distance or pitch1530between adjacent horizontal traces may be approximately 1.5 mm, and a distance or pitch1532between adjacent vertical traces may be approximately 1.5 mm. For each of the power splitters/combiners, such as a power splitter/combiner1533, a first overall dimension1534along the x-direction may be approximately 1.52 mm and a second overall dimension1535along the y-direction may be approximately 4.71 mm. FIG.15Ddepicts an example of packaged power splitters/combiners configured in an overlapping configuration, according to some embodiments of the present disclosure. Power splitters/combiners1540,1542may comprise adjacent power splitters/combiners positioned to provide signal traversal between horizontal and vertical traces. In order to facilitate compact design (e.g., to reduce horizontal and/or vertical pitches of H-networks), the packages associated with the power splitters/combiners1540,1542may be positioned relative to each other to include an overlap area1544. Overlap area1544may comprise an empty spatial area within the package in which no portion of a power splitter/combiner may be located. A pitch associated with one or both of the vertical and horizontal traces may be approximately 3 mm or less. It is understood that the dimensions disclosed herein are for illustration purposes only and other dimensions may be possible. In some embodiments, a plurality of power splitters/combiners may be packaged together rather than a package of a single power splitter/combiner. For example, for the intersection area656inFIG.6A, a group of four power splitters/combiners may be arranged along a diagonal line consistent with the intersection locations and packaged together. Such a grouped package may include four inputs and eight outputs or, conversely, eight inputs and four outputs. The packaging of power splitters/combiners mentioned above forFIGS.15A-15Dmay, in the alternative, comprise outlines or representations of the overall size of the power splitters/combiners and the power splitters/combiners need not be in enclosures or other packaging structures. FIG.16depicts a flow diagram showing an example process1600for performing power dividing or splitting of signals using electrical conductive traces or lines located in more than one layers or planes, according to some embodiments of the present disclosure. At block1602, a power splitter/combiner (e.g., power splitter/combiner900) may receive an input signal (e.g., a RF signal) from a trace (e.g., trace902) located in a first layer of a multiplex feed network stack (e.g., layer820). In response, the power splitter/combiner may be configured to divide or split the input signal, in the first layer, into two divided or split signals, at block1604. Next, at block1606, one of the two divided or split signals may propagate through or traverse a first branch of the power splitter/combiner (e.g., first output line1004). The first branch may comprise an electrically conductive trace, line, or pathway configured to start at the first layer, extend through a second layer (e.g., layer822or via1012), and end at a third layer (e.g., layer830). The electrically conductive trace, line, or pathway of the first branch may be configured to be λ/4 in signal pathway length and be impedance matched with an input electrically conductive trace, line or pathway of the power splitter/combiner. Then at block1608, a first output signal may be generated and transmitted in the third layer. At the output end of the first branch at the third layer, the signal propagated in block1606may comprise the first output signal of the power splitter/combiner. The first output signal may comprise a signal having the same frequency as the input signal and half the power of the input signal. The first output signal may be provided to a trace electrically coupled to the first branch at the third layer (e.g., trace904). Blocks1610and1612may be similar to respective blocks1606and1608except blocks1606,1608may involve the propagation of the other of the two divided or split signals through a second branch (e.g., second output line1006) of the power splitter/combiner to generate a second output signal at the end of the second branch at the third layer. The second branch may comprise an electrically conductive trace, line, or pathway configured to start at the first layer, extend through the second layer (e.g., layer822or via1022), and end at the third layer. The electrically conductive trace, line, or pathway of the second branch may be configured to be λ/4 in signal pathway length and be impedance matched with an input electrically conductive trace, line or pathway and the first output line. The second output signal may also comprise a signal having the same frequency as the input signal and half the power of the input signal. The second output signal may be provided to a trace electrically coupled to the second branch at the third layer (e.g., trace906). In alternative embodiments, power splitter/combiner900may be configured to split or divide the signal in a layer different from the layer including the input line, rather than splitting/dividing the signal in the same layer in which the input line is included. Such a power splitter/combiner may be configured to include an input line in the first layer, a single via (electrically coupled to the input line) in the second layer disposed between the first and third layers, and first and second output lines (electrically coupled to the single via) provided in the third layer. One end of each of the first and second output lines may form an intersection or junction with an end of the single via in the third layer. The opposite end of each of the first and second output lines may intersect with respective (horizontal) traces in the third layer. In this manner, the incoming signal received from a (vertical) trace included in the first layer may be split/divided after traversing through the first and second layers, upon arrival in the same layer as the layer that includes the (horizontal or other direction) trace (e.g., third layer). Process1600may be performed in reverse order from that discussed above, in which two input signals are received at respective first and second output lines1004,1006and be combined into a single output signal that is provided to the input line1002. Four-Layer Multiplex Feed Networks Configuring the plurality of multiplex feed networks in two layers, such as eight H-networks710,712,714,716,718,720,722,724inFIG.7A, may be associated with a receiver panel, for a certain number of beamformers (e.g., less than 256 beamformers), for a certain number of antenna elements, and/or the like. In alternative embodiments, the multiplex feed network layer180cmay comprise more than two layers, and in particular, four layers. FIG.17Adepicts multiplex feed networks configured in four layers aligned to a beamformer layer according to some embodiments of the present disclosure. The plurality of beamformers (e.g., beamformers142i,242i, or342i) and associated structures included in a beamformer lattice (e.g., beamformer140,240, or340) may be organized as a plurality of beamformer cells1700.FIG.17Adepicts a block diagram of a portion of a beamformer lattice including a plurality of beamformer cells1700. The beamformer lattice may be implemented in a layer1701. Layer1701may be a layer similar to beamformer layer180dand which may be included in a PCB layer stack similar to lay-up180ofFIG.1G. The Cartesian coordinate system denoted inFIG.17Acorresponds to that shown inFIG.1G, in whichFIG.17Aillustrates a bottom view of layer1701viewed upward from the underside of layer1701toward the layers above (e.g., viewed toward a multiplex feed network such as those implemented in multiplex feed network layer180c). A multiplex feed network1720is represented as dotted lines to denote its location in layers different from layer1701. Each beamformer cell of the plurality of beamformer cells1700may include a beamformer1702, first filters1704, second filters1708, vias1706, vias1710, vias1711,1712,1713,1714,1715,1716,1717,1718, and electrically conductive traces between beamformer1702and the vias1706,1710,1711-1718. Beamformer cell1700may be similar to beamformer cell142i. Beamformer1702may comprise an integrated circuit (IC) chip having a plurality of inputs and a plurality of outputs (e.g., chip pins). Beamformer1702may include eight inputs (denoted as RFin) and eight outputs (denoted at RFout). The eight inputs electrically couple to respective vias1711,1712,1713,1714,1715,1716,1717,1718using traces502. The eight outputs electrically couple to respective vias1706,1710. Disposed between each output and via1706/1710is the first or second filter1704,1708. For the eight outputs, four of the first filters1704and four of the second filters1708may be implemented. The vias electrically coupling to first filters1704are denoted as vias1706, and vias electrically coupling to second filters1708are denoted as vias1710. In some embodiments, the inputs and outputs of beamformer1702may be distributed on all sides of the beamformer1702. As illustrated inFIG.17A, two opposing sides proximate to vias1711-1718may be configured with inputs and the remaining two opposing sides may be configured with outputs. First and second filters1704,1708may comprise RF filters operating at or tuned to first (f1) and second frequencies (f2), respectively. First and second filters1704,1708may be configured to filter RF signals to extract portions of RF signals at or around the first and second frequencies, respectively. First and second frequencies may be the frequencies associated with the particular antenna elements that electrically couple to particular outputs of the beamformer1702using vias1706,1710. In some embodiments, first and second frequencies may be the same frequency, because all antenna elements that electrically couple to the beamformer1702outputs may operate at the same frequency. In such implementation, first and second filters1704,1708may be the same as each other. In other embodiments, first and second frequencies may be different from each other, because first and second subsets of the plurality of antenna elements included in the antenna lattice may operate at first and second frequencies, respectively. And in particular, antenna elements included in the first subset may electrically couple to vias1706and antenna elements included in the second subset may electrically couple to vias1710. Hence, first and second filters1704,1708may be different from each other. As an example, first and second subsets of antenna elements may comprise antenna elements configured in an interspersed arrangement, with first frequency ranging from approximately 11.95 to 12.2 Gigahertz (GHz) and second frequency ranging from approximately 10.95 to 11.2 GHz. Vias1706,1710may comprise electrically conductive vias that extend between layer1701and particular antenna elements located in an antenna lattice layer. The lengths of vias1706,1710may extend perpendicular to the major plane of layer1701, and in particular, in the negative z-direction (e.g., into the page) if implemented within a stack as configured inFIG.1G. Vias1706may electrically couple to particular antenna elements associated with the first frequency (see first filters1704disposed in the output pathway to vias1706). Vias1710may electrically couple to particular antenna elements associated with the second frequency (see second filters1708disposed in the output pathway to vias1710). Vias1706,1710may also be referred to as output vias, antenna vias, antenna element vias, antenna element connecting vias, or the like. Vias1711-1718may comprise electrically conductive vias that extend between layer1701and particular ends of traces of the last stage/level of the multiplex feed network1720. Each trace of the last stage/level comprises a trace segment between a last node at one end and the end of such trace at the other end. The end of the trace opposite the last node may be open or floating, and may be referred to as a termination or terminating end of the multiplex feed network. Such trace segments may also be referred to as termination, terminating, last, or end trace segments of the multiplex feed network. InFIG.17A, ends of traces of the last stage/level of the multiplex feed network1720comprise ends of traces that are vertical traces. Vias1711-1718may also be referred to as input vias. In some embodiments, the configuration of the beamformer cells1700with multiplex feed network1720may be associated with a transmitter panel, embodiments in which the multiplex feed networks are configured within four PCB layers, embodiments in which the total number of multiplex feed networks cannot be implemented within two PCB layers due to spacing, manufacturing, or other constraints or design preferences, for a certain number of beamformers (e.g., more than 256 beamformers), for a certain number of antenna elements, and/or the like. It is understood that the number of inputs and outputs of the beamformer1202may be the same or different from each other. For instance, a beamformer configured to couple to eight antenna elements may have less or more than eight inputs. Each beamformer input may or may not couple to a different multiplex feed network from each other. For instance, a beamformer including eight inputs may collectively couple to six multiplex feed networks, rather than eight multiplex feed networks. In contrast to the eight H-networks provided in two layers, multiplex feed network1720to which the beamformer cells1700are electrically coupled may comprise eight H-networks configured in four PCB layers. Two sets of two-layer H-networks may be implemented, in which each set may include four H-networks for a total of eight H-networks within the two sets. Because fewer H-networks are provided in a given set of two PCB layers than in the layers ofFIGS.7A-7D, the pitch between the horizontal traces (also referred to as the y pitch or horizontal pitch) and/or the pitch between the vertical traces (also referred to as the x pitch or vertical pitch) may be greater than corresponding pitch(es) of traces inFIGS.7A-7D. As an example, the y pitch may be approximately 3.1 mm and the x pitch may be approximately 6.3 mm. FIG.17Bdepicts a perspective view of a portion of the stack including the multiplex feed network1720configured as eight H-networks according to some embodiments of the present disclosure. Multiplex feed network1720may comprise a first subset1740and a second subset1743, in which each of the first and second subsets1740,1743may include a plurality of multiplex feed networks. For example, each of the first and second subsets1740,1743may include four H-networks. First subset1740may be disposed above the second subset1743. First subset1740may include two PCB layers1741,1742and second subset1743may include two PCB layers1744,1745. Layer1742may be disposed between layers1741and1744, and layer1744may be disposed between layers1742and1745. In the first subset1740, layer1741may include vertical traces1724of the four H-networks of the first subset1740while layer1742may include the horizontal traces1722of the four H-networks of the first subset1740. The four H-networks of the first subset1740may comprise H-networks in which signals S6, S1, S7, and S4may be carried. The numbers denoted next to vertical traces1724correspond to the numbers denoted to particular vias1711-1718as shown inFIG.17Aand specifies the particular trace to via coupling. For example, vertical trace1724denoted with number “6” electrically couples to via1716, vertical trace1724denoted with number “1” electrically couples to via1711, and so forth. Similarly, layer1744may include vertical traces1734of the four H-networks of the second subset1743while layer1745may include the horizontal traces1732of the four H-networks of the second subset1743. The four H-networks of the second subset1743may comprise H-networks in which signals S5, S2, S8, and S3may be carried. The numbers denoted next to vertical traces1734correspond to the numbers denoted to particular vias1711-1718as shown inFIG.17Aand specifies the particular trace to via coupling. For example, vertical trace1734denoted with number “8” electrically couples to via1718, vertical trace1734denoted with number “3” electrically couples to via1713, and so forth. Moreover, first filters1704or the first frequency associated with first filters1704may be associated with signals S5, S2, S6, and S1, in which signals S5and S2may be carried by a different set of H-network layers than signals S6and S1. Second filters1708or the second frequency associated with second filters1708may be associated with signals S8, S3, S7, and S4, in which signals S8and S3may be carried by a different set of H-network layers than signals S7and S4. Although not shown, one or more additional PCB layers, grounding planes, adhesive layers, electrical isolation layers, and/or other layers may be disposed above, within, or below the layers of multiplex feed network1720. The number of multiplex feed networks in the first and second subsets1740,1743may be the same or different from each other. In some embodiments, the orientation of the H-networks of the first and second subsets1740,1743may be the same as each other so that traces are overlaid over each other except as discussed below. Hence, the traces of the first and second subsets1740,1743may align and be collinear to each other in a direction perpendicular to the major plane of the stack (e.g., along the z-axis). For instance,FIGS.17A-17Bshow horizontal traces1722and1732located directly over each other. Vertical traces and nodes of the first and second subsets1740,1743may also be collinear with each other except for the termination trace segments and termination ends of the first and second subsets1740,1743. If the termination ends of the first and second subsets1740,1743are collinear with each other, then termination ends of the second subset1743may not be accessible using vertical vias from layer1701and/or electrically coupling with a termination end in the second subset1743by a vertical via from layer1701may also comprise electrically coupling with the termination end in the first subset1740that is located between such vertical via and such termination end in the second subset1743. Thus, in order for each of the vias1711-1718to electrically couple with a particular one of the termination ends in the first or second subsets1740,1743(e.g., alternating between a termination end in the first and second subsets1740,1743for adjacent vias), corresponding termination ends in the first and second subsets1740,1743may be configured to be offset or non-collinear from each other in a direction perpendicular to the major plane of layer1701. Vertical traces1724,1734shown inFIG.17Bmay comprise the traces at the termination ends. From left to right, adjacent termination ends in the first and second subsets1740,1743are displaced or spaced apart from each other along the x-axis and also alternate between being located in the first subset1740or the second subset1743(along the z-axis). In order for corresponding termination ends of the first and second subsets1740,1743to be offset from each other, the termination trace segments associated with the corresponding termination ends may be configured to prescribe different trace pathways or have different shapes from each other. The corresponding termination trace segments, and all termination trace segments of the multiplex feed networks1720, in general, may still have the same trace lengths so that the signal pathway length associated with each multiplex feed network of the plurality of multiplex feed networks1720from the input/output to the output/input will be length matched to each other. For example, termination ends to electrically couple with respective vias1715and1716may be offset from each other and termination trace segments associated with such termination ends may prescribe a different trace path from each other to locate such termination ends at non-collinear locations, even though the remaining traces of the two H-networks associated with such termination ends may be collinear to each other. FIGS.17C-17Ddepict example shapes or contours of termination trace segments1750,1760included in the multiplex feed networks1720according to some embodiments of the present disclosure. In some embodiments, one end of a termination trace segment1750may comprise a termination end1752and the opposite end of the termination trace segment1750may comprise a last or end node1754of the multiplex feed network in which the termination trace segment1750is included. One end of a termination trace segment1760may comprise a termination end1762and the opposite end of the termination trace segment1760may comprise a last or end node1764of the multiplex feed network in which the termination trace segment1760is included. Termination trace segment1750may have a shape or contours different from termination trace segment1760. Each of the termination trace segments1750,1760may include one or more straight segments, one or more curved segments, one or more angled segments, and/or the like. Because the termination trace segments1750,1760may have a shape other than a straight line (all of the non-termination trace segments having a straight line shape), termination trace segments1750,1760may also be referred to as meandering traces or traces having meandering shape, contours, or the like. Termination trace segments1750,1760may be configured in accordance with contour, manufacturing, location, and/or the like requirements or constraints. As an example, the signal pathway (also referred to as the electrical path or pathway) lengths of termination trace segments1750,1760are to be equal to each other or be within a certain tolerance range, such as 1.55 mm. As another example, if the (line) width of termination trace segments1750,1760is 0.2 mm, then a minimum radius of curvature (ROC) of any curves included in the termination trace segments1750,1760is to be at least 0.5 mm. As still another example, locations of termination trace segments1750,1760may be configured so that vias, such as vias1706and/or1710associated with beamformer cells1700, may extend through the multiplex feed network layers to particular antenna elements located in the antenna lattice layer. FIG.17Ddepicts an example arrangement of termination trace segments1750,1760from the same viewpoint as inFIG.17Aexcept with layer1701omitted, according to some embodiments of the present disclosure. In the upper group of termination trace segments, termination trace segment1760may comprise a trace included in the second subset1743and may be disposed below termination trace segment1750included in the first set1740. In the lower group of termination trace segments, termination trace segment1750may comprise a trace included in the second subset1743and may be disposed below termination trace segment1760included in the first set1740. In this manner, termination ends1762,1752may be offset from each other and also located (e.g., located along a diagonal line) to align with particular of vias1711-1718. For instance, termination ends1770,1772may electrically couple to vias1715,1716, respectively, and termination ends1774,1776may electrically couple to vias1718,1717, respectively. As another example, termination ends1770,1772may electrically couple to vias1712,1711, respectively, and termination ends1774,1776may electrically couple to vias1713,1714, respectively. Not only are termination trace segments1750,1760length matched to each other, the total signal pathway length associated with each multiplex feed network of the plurality of multiplex feed networks1720is also length matched to each other. Such length matching applies to power splitters/combiners included in the multiplex feed networks1720as well. Illustrative examples of the apparatuses, systems, and methods of various embodiments disclosed herein are provided below. An embodiment of the apparatus, system, or method may include any one or more, and any combination of, the examples described below. Example 1 is a power splitter/combiner, which includes:a first electrically conductive trace included in a first layer;second and third electrically conductive traces included in a second layer;a first via electrically coupled to the first and second electrically conductive traces; anda second via electrically coupled to the first and third electrically conductive traces,wherein a first portion of the first electrically conductive trace comprises a first port of the power splitter/combiner,wherein a second portion of the first electrically conductive trace, the first via, and the second electrically conductive trace comprises a second port of the power splitter/combiner, andwherein a third portion of the first electrically conductive trace, the second via, and the third electrically conductive trace comprises a third port of the power splitter/combiner. Example 2 includes the subject matter of Example 1, and wherein a signal pathway length associated with the second portion of the first electrically conductive trace in the first layer or the second electrically conductive trace in the second layer is less than a total signal pathway length associated with the second port. Example 3 includes the subject matter of any of Examples 1-2, and wherein the first, second, and third ports are impedance matched to each other. Example 4 includes the subject matter of any of Examples 1-3, and wherein a first signal at the first port splits into second and third signals at the second and third ports, respectively, and wherein each of the second and third signals has a power that is half of a power of the first signal. Example 5 includes the subject matter of any of Examples 1-4, and wherein the first, second, and third electrically conductive traces are included in a multiplex feed network configured on the first and second layers. Example 6 includes the subject matter of any of Examples 1-5, and wherein the first, second, and third portions of the first electrically conductive trace intersect with each other in the first layer. Example 7 includes the subject matter of any of Examples 1-6, and wherein one or both of the second or third portions of the first electrically conductive trace includes an orientation that contours toward the first portion of the first electrically conductive trace. Example 8 includes the subject matter of any of Examples 1-7, and wherein a width of the power splitter/combiner in a direction perpendicular to an orientation of the first portion of the first electrically conductive trace is reduced by the contour of one or both of the second and third portions of the first electrically conductive trace toward the first portion of the first electrically conductive trace. Example 9 includes the subject matter of any of Examples 1-8, and wherein one or both of the second or third electrically conductive trace includes an orientation that contours toward the first portion of the first electrically conductive trace. Example 10 includes the subject matter of any of Examples 1-9, and wherein a width of the power splitter/combiner in a direction perpendicular to an orientation of the first portion of the first electrically conductive trace is reduced by the contour of one or both of the second or third electrically conductive trace toward the first portion of the first electrically conductive trace. Example 11 includes the subject matter of any of Examples 1-10, and herein one or both of the first or second layers includes a base layer to electrically isolate the first or second layers from adjacent layers. Example 12 includes the subject matter of any of Examples 1-11, and wherein the base layer comprises a printed circuit board (PCB), a dielectric material, or a non-conductive material. Example 13 includes the subject matter of any of Examples 1-12, and wherein the first, second, and third ports of the power splitter/combiner are included in a package, and the package is positioned at a location of a printed circuit board (PCB) at which electrically conductive traces located in two different layers are collinear to each other in a direction perpendicular to a plane of the layers in which the electrically conductive traces are provided. Example 14 is an apparatus, which includes:a first electrical signal path branch included in a first layer;a second electrical signal path branch included in the first layer and a second layer; anda third electrical signal path branch included in the first and second layers,wherein the first, second, and third electrical signal path branches electrically couple to each other in the first layer, and wherein signal pathway lengths associated with the second and third electrical signal path branches are quarter wavelength signal pathway lengths. Example 15 includes the subject matter of Example 14, and wherein the first, second, and third electrical signal path branches are impedance matched. Example 16 includes the subject matter of any of Examples 14-15, and wherein at least a portion of the first, second, or third electrical signal path branches comprises an electrically conductive trace. Example 17 includes the subject matter of any of Examples 14-16, and wherein at least a portion of the second and third electrical signal path branches comprises a via that extends between the first and second layers. Example 18 includes the subject matter of any of Examples 14-17, and wherein the second electrical signal path branch comprises first, second, and third portions, and wherein the first portion is included in the first layer, the second portion extends between the first and second layers, and the third portion is included in the second layer. Example 19 includes the subject matter of any of Examples 14-18, and wherein the first and third portions comprise electrically conductive traces and the second portion comprises a via. Example 20 includes the subject matter of any of Examples 14-19, and wherein one or both of the first and second portions includes an orientation that contours toward the first electrical signal path branch. Example 21 includes the subject matter of any of Examples 14-20, and wherein the second electrical signal path branch includes a linear orientation portion and a non-linear orientation portion. Example 22 includes the subject matter of any of Examples 14-21, and wherein the second and third electrical signal path branches are symmetrical along opposing sides of the first electrical signal path branch. Example 23 includes the subject matter of any of Examples 14-22, and wherein a first signal inputted to the first electrical signal path branch is converted into second and third signals at the second and third electrical signal path branches, respectively, and wherein each of the second and third signals have half the power of a power of the first signal. Example 24 includes the subject matter of any of Examples 14-23, and wherein the first, second, and third signals comprise radio frequency (RF) signals. Example 25 includes the subject matter of any of Examples 14-24, and wherein second and third signals inputted to the second and third electrical signal path branches, respectively, are combined into a first signal at the first electrical signal path branch, and wherein the first signal has a power that is a sum of powers of the second and third signals. Example 26 includes the subject matter of any of Examples 14-25, and wherein ends of the first, second, and third electrical signal path branches opposite to the ends that intersect with each other electrically couple to a first electrical conductive trace included in the first layer, a second electrical conductive trace included in the second layer, and a third electrical conductive trace included in the second layer, respectively. Example 27 is a method of routing signals, which includes:in response to receipt of a first signal in a first layer, splitting the first signal into second and third signals;causing to propagate the second signal from the first layer to a second layer disposed above or below the first layer; andcausing to propagate the third signal from the first layer to the second layer,wherein each of the second and third signals has half the power of a power of the first signal. Example 28 includes the subject matter of Example 27, and wherein the first, second, and third signals comprise radio frequency (RF) signals, and wherein a same frequency is associated with the first, second, and third signals. Example 29 includes the subject matter of any of Examples 27-28, and wherein splitting the first signal into the second and third signals comprises splitting the first signal in the first layer. Example 30 includes the subject matter of any of Examples 27-29, and wherein causing to propagate the second signal from the first layer to the second layer comprises causing to propagate the second signal through a first conductive line included in the first layer, a first via extending between the first and second layers, and a second conductive line included in the second layer. Example 31 includes the subject matter of any of Examples 27-30, and wherein the first signal is received at a third conductive line, and wherein causing to propagate the third signal from the first layer to the second layer comprises causing to propagate the third signal through a fourth conductive line included in the first layer, a second via extending between the first and second layers, and a fifth conductive line included in the second layer. Example 32 includes the subject matter of any of Examples 27-31, and wherein the third conductive line; the first conductive line, the first via, and the second conductive line; and the fourth conductive line, the second via, and the fifth conductive line are impedance matched to each other. Example 33 is an apparatus, which includes:a first layer having a first plurality of electrically conductive traces comprising a first portion of a plurality of hierarchical networks;a second layer having a second plurality of electrically conductive traces comprising a second portion of the plurality of hierarchical networks, wherein the first plurality of electrically conductive traces is orientated in a first direction and the second plurality of electrically conductive traces is orientated in a second direction different from the first direction; anda plurality of vias electrically connecting the first plurality of electrically conductive traces of the first layer to the respective second plurality of electrically conductive traces of the second layer to define the plurality of hierarchical networks. Example 34 includes the subject matter of Example 33, and wherein the plurality of hierarchical networks comprise H-networks, fractal networks, self-similar fractal networks, tree networks, star networks, or hybrid networks. Example 35 includes the subject matter of any of Examples 33-34, and wherein the plurality of hierarchical networks comprises at least three hierarchical networks. Example 36 includes the subject matter of any of Examples 33-35, and wherein respective traces of the first plurality of electrically conductive traces are parallel and offset from one another, and wherein respective traces of the second plurality of electrically conductive traces are parallel and offset from one another. Example 37 includes the subject matter of any of Examples 33-36, and wherein hierarchical networks of the plurality of hierarchical networks are electrically isolated from one another. Example 38 includes the subject matter of any of Examples 33-37, and wherein the plurality of vias comprises a first plurality of vias, and wherein the second plurality of traces electrically couples to a plurality of electrical components included in a layer different from the first and second layers via a second plurality of vias. Example 39 includes the subject matter of any of Examples 33-38, and further comprising: a plurality of isolation vias adjacent at least some of the first plurality of traces and the second plurality of traces. Example 40 includes the subject matter of any of Examples 33-39, and wherein the plurality of vias and certain portions of the first and second plurality of electrically conductive traces comprise a plurality of power splitters/combiners. Example 41 includes the subject matter of any of Examples 33-40, and wherein the plurality of hierarchical networks comprises a first plurality of hierarchical networks and the plurality of vias comprises a first plurality of vias, and further comprising:a third layer having a third plurality of electrically conductive traces comprising a first portion of a second plurality of hierarchical networks;a fourth layer having a fourth plurality of electrically conductive traces comprising a second portion of the second plurality of hierarchical networks, wherein the third plurality of electrically conductive traces is orientated in the first direction and the fourth plurality of electrically conductive traces is orientated in the second direction; anda second plurality of vias electrically connecting the third plurality of electrically conductive traces of the third layer to the respective fourth plurality of electrically conductive traces of the fourth layer to define the second plurality of hierarchical networks. Example 42 includes the subject matter of any of Examples 33-41, and wherein open ends of the first or second traces at a last stage of the first plurality of first hierarchical networks comprise a plurality of first ends and open ends of the third or fourth traces at a last stage of the second plurality of hierarchical networks comprise a plurality of second ends, and wherein a first end of the plurality of first ends and a corresponding second end of the plurality of second ends are non-collinear to each other in a direction perpendicular to a major plane of the first layer. Example 43 includes the subject matter of any of Examples 33-42, and wherein at least one of the first or second traces at the last stage of the first plurality of hierarchical networks has a different shape than at least one of the third or fourth traces at the last stage of the second plurality of hierarchical networks. Example 44 includes the subject matter of any of Examples 33-43, and further comprising a plurality of antenna elements included in a third layer disposed above the first and second layers and arranged in a configuration independent of a configuration of the plurality of hierarchical networks, wherein the plurality of hierarchical networks is configured to transmit or receive multiple, isolated radio frequency (RF) signals to or from the plurality of antenna elements. Example 45 is an apparatus, which includes:a first electrically conductive trace having a first orientation included in a first layer;a second electrically conductive trace having a second orientation, different from the first orientation, included in a second layer; anda power splitter/combiner included in the first and second layers, wherein a first portion of the power splitter/combiner included in the first layer electrically connects to the first electrically conductive trace, a second portion of the power splitter/combiner included in the second layer electrically connects to the second electrically conductive trace, and a third portion of the power splitter/combiner comprises a via that extends between the first and second layers. Example 46 includes the subject matter of Example 45, and wherein the first and second electrically conductive traces comprise traces associated with a hierarchical network. Example 47 includes the subject matter of any of Examples 45-46, and further comprising an isolation resistor included in the second layer configured to electrically isolate a first portion of the second electrically conductive trace from a second portion of the second electrically conductive trace, wherein the second portion of the power splitter/combiner included in the second layer comprises first and second branches, and wherein the first and second portions of the second electrically conductive trace electrically couple with respective first and second branches. Example 48 includes the subject matter of any of Examples 45-47, and wherein the via comprises a first via and wherein the third portion of the power splitter/combiner further comprises a second via that extends between the first and second layers. Example 49 includes the subject matter of any of Examples 45-48, and further comprising:a third electrically conductive trace included in the first layer, and having the first orientation and immediately adjacent to the first electrically conductive trace;a fourth electrically conductive trace included in the second layer, and having the second orientation and immediately adjacent to the second electrically conductive trace; anda second power splitter/combiner included in the first and second layers, wherein the second power splitter/combiner is associated with routing signals between the third and fourth electrically conductive traces. Example 50 includes the subject matter of any of Examples 45-49, and wherein the second portion of the power splitter/combiner included in the second layer comprises first and second branches, wherein first and second portions of the second electrically conductive trace electrically couple with respective first and second branches, and wherein a pitch associated with one or both of the first and third electrically conductive traces or the second and fourth electrically conductive traces is smaller than a signal pathway length associated with one or both of the first or second branches. Example 51 includes the subject matter of any of Examples 45-50, and wherein the first and second electrically conductive traces are associated with a first hierarchical network and the third and fourth electrically conductive traces are associated with a second hierarchical network, and wherein the first and second hierarchical networks are electrically isolated from each other. Example 52 includes the subject matter of any of Examples 45-51, and wherein the first hierarchical network comprises an H-network. Example 53 includes the subject matter of any of Examples 45-52, and wherein the power splitter/combiner is located at portions of the first and second electrically conductive traces that are collinear to each other in a direction perpendicular to a plane of the first layer. Example 54 is a method for routing signals, which includes:routing a first signal through a first hierarchical network to a first plurality of electrical components, wherein routing the first signal through the first hierarchical network includes routing the first signal through a first electrically conductive trace oriented in a first direction in a first layer, a first via located between the first layer and a second layer, and a second electrically conductive trace oriented in a second direction, different from the first direction, in the second layer; androuting a second signal through a second hierarchical network to a second plurality of electrical components, wherein routing the second signal through the second hierarchical network includes routing the second signal through a third electrically conductive trace oriented in the first direction in the first layer, a second via located between the first layer and the second layer, and a fourth electrically conductive trace oriented in the second direction in the second layer,wherein the first and third electrically conductive traces are offset from each other in the first layer and the second and fourth electrically conductive traces are offset from each other in the second layer. Example 55 includes the subject matter of Example 54, and wherein the first and second vias comprise portions of a plurality of power splitters/combiners included in each of the first and second hierarchical networks. Example 56 includes the subject matter of any of Examples 54-55, and wherein the first and second hierarchical networks comprise H-networks, fractal networks, self-similar fractal networks, tree networks, star networks, hybrid networks, rectilinear H-networks, or curvilinear H-networks. Example 57 includes the subject matter of any of Examples 54-56, and wherein the first and second hierarchical networks are electrically isolated from each other. Example 58 includes the subject matter of any of Examples 54-57, and wherein each of the first and second signals comprises a plurality of radio frequency (RF) signals. Example 59 includes the subject matter of any of Examples 54-58, and wherein routing the first signal through the first hierarchical network further includes routing the first signal through a first electrically conductive trace oriented in a first direction in a first layer, through a power splitter/combiner including the first via and a third via located between the first and second layers, and through opposing directions of first and second portions of the second electrically conductive trace. Example 60 includes the subject matter of any of Examples 54-59, and further comprising:routing third signals from the first plurality of electrical components through the first hierarchical network; androuting fourth signals from the second plurality of electrical components through the second hierarchical network. Although certain embodiments have been illustrated and described herein for purposes of description, a wide variety of alternate and/or equivalent embodiments or implementations calculated to achieve the same purposes may be substituted for the embodiments shown and described without departing from the scope of the present disclosure. This application is intended to cover any adaptations or variations of the embodiments discussed herein. Therefore, it is manifestly intended that embodiments described herein be limited only by the claims. | 118,454 |
11862838 | DETAILED DESCRIPTION An electronic device such as electronic device10ofFIG.1may be provided with wireless circuitry. The wireless circuitry may include antennas. Electronic device10may be a computing device such as a laptop computer, a desktop computer, a computer monitor containing an embedded computer, a tablet computer, a cellular telephone, a media player, or other handheld or portable electronic device, a smaller device such as a wristwatch device, a pendant device, a headphone or earpiece device, a device embedded in eyeglasses, goggles, or other equipment worn on a user's head such as a head mounted (display) device, or other types of wearable or miniature device, a television, a computer display that does not contain an embedded computer, a gaming device, a navigation device, an embedded system such as a system in which electronic equipment with a display is mounted in a kiosk or automobile, a wireless internet-connected voice-controlled speaker, a wireless base station or access point, equipment that implements the functionality of two or more of these devices, or other electronic equipment. As shown inFIG.1, device10may include control circuitry12. Control circuitry12may include storage such as storage circuitry16. Storage circuitry16may include hard disk drive storage, nonvolatile memory (e.g., flash memory or other electrically-programmable-read-only memory configured to form a solid-state drive), volatile memory (e.g., static or dynamic random-access-memory), etc. Control circuitry12may include processing circuitry such as processing circuitry14. Processing circuitry14may be used to control the operation of device10. Processing circuitry14may include on one or more microprocessors, microcontrollers, digital signal processors, host processors, baseband processor integrated circuits, application specific integrated circuits, central processing units (CPUs), etc. Control circuitry12may be configured to perform operations in device10using hardware (e.g., dedicated hardware or circuitry), firmware, and/or software. Software code for performing operations in device10may be stored on storage circuitry16(e.g., storage circuitry16may include non-transitory (tangible) computer readable storage media that stores the software code). The software code may sometimes be referred to as program instructions, software, data, instructions, or code. Software code stored on storage circuitry16may be executed by processing circuitry14. Control circuitry12may be used to run software on device10such as satellite navigation applications, internet browsing applications, voice-over-internet-protocol (VOIP) telephone call applications, email applications, media playback applications, operating system functions, etc. To support interactions with external equipment, control circuitry12may be used in implementing communications protocols. Communications protocols that may be implemented using control circuitry12include internet protocols, wireless local area network (WLAN) protocols (e.g., IEEE 802.11 protocols—sometimes referred to as Wi-Fi®), protocols for other short-range wireless communications links such as the Bluetooth® protocol or other wireless personal area network (WPAN) protocols, IEEE 802.11ad protocols, cellular telephone protocols, MIMO protocols, antenna diversity protocols, satellite navigation system protocols (e.g., global positioning system (GPS) protocols, global navigation satellite system (GLONASS) protocols, etc.), or any other desired communications protocols. Each communications protocol may be associated with a corresponding radio access technology (RAT) that specifies the physical connection methodology used in implementing the protocol. Device10may include input-output circuitry18. Input-output circuitry18may include input-output devices20. Input-output devices20may be used to allow data to be supplied to device10and to allow data to be provided from device10to external devices. Input-output devices20may include user interface devices, data port devices, and other input-output components. For example, input-output devices20may include touch sensors, displays (e.g., touch-sensitive displays), light-emitting components such as displays without touch sensor capabilities, buttons (mechanical, capacitive, optical, etc.), scrolling wheels, touch pads, key pads, keyboards, microphones, cameras, buttons, speakers, status indicators, audio jacks and other audio port components, digital data port devices, motion sensors (accelerometers, gyroscopes, and/or compasses that detect motion), capacitance sensors, proximity sensors, magnetic sensors, force sensors (e.g., force sensors coupled to a display to detect pressure applied to the display), etc. In some configurations, keyboards, headphones, displays, pointing devices such as trackpads, mice, and joysticks, and other input-output devices may be coupled to device10using wired or wireless connections (e.g., some of input-output devices20may be peripherals that are coupled to a main processing unit or other portion of device10via a wired or wireless link). Input-output circuitry18may include wireless circuitry22to support wireless communications. Wireless circuitry22may include radio-frequency (RF) transceiver circuitry24formed from one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive RF components, one or more antennas such as antenna40, transmission lines such as transmission line26, and other circuitry for handling RF wireless signals. Wireless signals can also be sent using light (e.g., using infrared communications). While control circuitry12is shown separately from wireless circuitry22in the example ofFIG.1for the sake of clarity, wireless circuitry22may include processing circuitry that forms a part of processing circuitry14and/or storage circuitry that forms a part of storage circuitry16of control circuitry12(e.g., portions of control circuitry12may be implemented on wireless circuitry22). As an example, control circuitry12(e.g., processing circuitry14) may include baseband processor circuitry or other control components that form a part of wireless circuitry22. Radio-frequency transceiver circuitry24may include wireless local area network transceiver circuitry that handles 2.4 GHz and 5 GHz bands for Wi-Fi® (IEEE 802.11) or other WLAN communications bands and may include wireless personal area network transceiver circuitry that handles the 2.4 GHz Bluetooth® communications band or other WPAN communications bands. If desired, radio-frequency transceiver circuitry24may handle other bands such as cellular telephone bands, near-field communications bands (e.g., at 13.56 MHz), millimeter or centimeter wave bands (e.g., communications at 10-300 GHz), and/or other communications bands. If desired, radio-frequency transceiver circuitry24may include radio-frequency transceiver circuitry for handling communications in unlicensed bands such as Industry, Science, and Medical (ISM) bands, a frequency band around 6 GHz such as a frequency band that includes frequencies from about 5.925 GHz to 7.125 GHz, or other frequency bands up to about 8-9 GHz. Radio-frequency transceiver circuitry24may also include ultra-wideband (UWB) transceiver circuitry that supports communications using the IEEE 802.15.4 protocol and/or other ultra-wideband communications protocols. Ultra-wideband radio-frequency signals may be based on an impulse radio signaling scheme that uses band-limited data pulses. Ultra-wideband signals may have any desired bandwidths such as bandwidths between 499 MHz and 1331 MHz, bandwidths greater than 500 MHz, etc. The presence of lower frequencies in the baseband may sometimes allow ultra-wideband signals to penetrate through objects such as walls. In an IEEE 802.15.4 system, a pair of electronic devices may exchange wireless time stamped messages. Time stamps in the messages may be analyzed to determine the time of flight of the messages and thereby determine the distance (range) between the devices and/or an angle between the devices (e.g., an angle of arrival of incoming radio-frequency signals). The ultra-wideband transceiver circuitry may operate (i.e., convey radio-frequency signals) in frequency bands such as an ultra-wideband communications band between about 5 GHz and about 8.5 GHz (e.g., a 6.5 GHz UWB communications band, an 8 GHz UWB communications band, and/or at other suitable frequencies). Communications bands may sometimes be referred to herein as frequency bands or simply as “bands.” Wireless circuitry22may include one or more antennas such as antenna40. In general, radio-frequency transceiver circuitry24may be configured to cover (handle) any suitable communications (frequency) bands of interest. Radio-frequency transceiver circuitry24may convey radio-frequency signals using antennas40(e.g., antennas40may convey the radio-frequency signals for transceiver circuitry24). The term “convey radio-frequency signals” as used herein means the transmission and/or reception of the radio-frequency signals (e.g., for performing unidirectional and/or bidirectional wireless communications with external wireless communications equipment). Antennas40may transmit the radio-frequency signals by radiating the radio-frequency signals into free space (or to freespace through intervening device structures such as a dielectric cover layer). Antennas40may additionally or alternatively receive the radio-frequency signals from free space (e.g., through intervening devices structures such as a dielectric cover layer). The transmission and reception of radio-frequency signals by antennas40each involve the excitation or resonance of antenna currents on an antenna resonating element in the antenna by the radio-frequency signals within the frequency band(s) of operation of the antenna. Antennas such as antenna40may be formed using any suitable antenna types. For example, antennas in device10may include antennas with resonating elements that are formed from loop antenna structures, patch antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, monopole antenna structures, strip antenna structures, dipole antenna structures, hybrids of these designs, etc. Parasitic elements may be included in antennas40to adjust antenna performance. If desired, antenna40may be provided with a conductive cavity that backs the antenna resonating element of antenna40(e.g., antenna40may be a cavity-backed antenna such as a cavity-backed slot antenna). Different types of antennas may be used for different bands and combinations of bands. For example, one type of antenna may be used in forming a local wireless link antenna and another type of antenna may be used in forming a remote wireless link antenna. In some configurations, different antennas may be used in handling different bands for radio-frequency transceiver circuitry24. Alternatively, a given antenna40may cover one or more bands. As shown inFIG.1, radio-frequency transceiver circuitry24may be coupled to antenna feed32of antenna40using transmission line26. Antenna feed32may include a positive antenna feed terminal such as positive antenna feed terminal34and may include a ground antenna feed terminal such as ground antenna feed terminal36. Transmission line26may be formed from metal traces on a printed circuit, cables, or other conductive structures. Transmission line26may have a positive transmission line signal path such as path28that is coupled to positive antenna feed terminal34. Transmission line26may have a ground transmission line signal path such as path30that is coupled to ground antenna feed terminal36. Path28may sometimes be referred to herein as signal conductor28and path30may sometimes be referred to herein as ground conductor30. Transmission line paths such as transmission line26may be used to route antenna signals within device10(e.g., to convey radio-frequency signals between radio-frequency transceiver circuitry24and antenna feed32of antenna40). Transmission lines in device10may include coaxial cables, microstrip transmission lines, stripline transmission lines, edge-coupled microstrip transmission lines, edge-coupled stripline transmission lines, transmission lines formed from combinations of transmission lines of these types, etc. Transmission lines in device10such as transmission line26may be integrated into rigid and/or flexible printed circuit boards. In one suitable arrangement, transmission lines such as transmission line26may also include transmission line conductors (e.g., signal conductors28and ground conductors30) integrated within multilayer laminated structures (e.g., layers of a conductive material such as copper and a dielectric material such as a resin that are laminated together without intervening adhesive). The multilayer laminated structures may, if desired, be folded or bent in multiple dimensions (e.g., two or three dimensions) and may maintain a bent or folded shape after bending (e.g., the multilayer laminated structures may be folded into a particular three-dimensional shape to route around other device components and may be rigid enough to hold its shape after folding without being held in place by stiffeners or other structures). All of the multiple layers of the laminated structures may be batch laminated together (e.g., in a single pressing process) without adhesive (e.g., as opposed to performing multiple pressing processes to laminate multiple layers together with adhesive). Filter circuitry, switching circuitry, impedance matching circuitry, and other circuitry may be interposed within the paths formed using transmission lines such as transmission line26and/or circuits such as these may be incorporated into antenna40(e.g., to support antenna tuning, to support operation in desired frequency bands, etc.). During operation, control circuitry12may use radio-frequency transceiver circuitry24and antenna(s)40to transmit and receive data wirelessly. Control circuitry12may, for example, receive wireless local area network communications wirelessly using radio-frequency transceiver circuitry24and antenna(s)40and may transmit wireless local area network communications wirelessly using radio-frequency transceiver circuitry24and antenna(s)40. Electronic device10may be provided with electronic device housing38. Housing38, which may sometimes be referred to as a case, may be formed of plastic, glass, ceramics, fiber composites, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or a combination of these materials. Housing38may be formed using a unibody configuration in which some or all of housing38is machined or molded as a single structure or may be formed using multiple structures (e.g., an internal frame structure covered with one or more outer housing layers). Configurations for housing38in which housing38includes support structures (a stand, leg(s), handles, frames, etc.) may also be used. In one suitable arrangement that is described herein as an example, housing38includes a curved dielectric cover layer. Antenna40may transmit radio-frequency signals through the curved dielectric cover layer and/or may receive radio-frequency signals through the curved dielectric cover layer. In practice, the number of frequency bands that are used to convey radio-frequency signals for device10tends to increase over time. In some scenarios, device10may include a different respective antenna40for handling each of these bands. However, increasing the number of antennas40in device10may consume an undesirable amount of space, power, and other resources in device10. If desired, a given antenna40in device10may handle communications in multiple frequency bands to optimize resource consumption within device10. In one suitable arrangement that is described herein as an example, a given antenna40in device10may be configured to handle WLAN frequency bands at 2.4 GHz and 5.0 GHz, unlicensed bands around 6 GHz (e.g., between 5.925 and 7.125 GHz), and/or UWB communications bands at 6.5 GHz and 8.0 GHz. However, it can be challenging to provide an antenna40with structures that exhibit sufficient bandwidth to cover each of these frequency bands (e.g., from below 2.4 GHz to above 9.0 GHz) with satisfactory antenna efficiency, particularly when the size of the antenna is constrained by the form factor of device10. FIG.2is a diagram of an illustrative antenna40that may exhibit a sufficiently wide bandwidth so as to cover each of these frequency bands with satisfactory antenna efficiency. As shown inFIG.2, antenna40may include an antenna resonating element such as antenna resonating element46and ground structures such as antenna ground42. Antenna resonating element46may sometimes be referred to herein as antenna radiating element46or antenna element46. Antenna ground42may sometimes be referred to herein as ground plane42or ground structures42. Antenna resonating element46and antenna ground42may be formed from conductive traces patterned onto a lateral surface such as surface45of an underlying dielectric substrate such as dielectric substrate44. Dielectric substrate44may sometimes be referred to herein as dielectric support structure44, dielectric carrier44, or antenna carrier44. Dielectric substrate44may be formed from plastic, ceramic, or any other dielectric materials. If desired, antenna ground42and/or antenna resonating element46may be formed from conductive traces patterned onto a flexible printed circuit that is layered over surface45of dielectric substrate44. Surface45may be planar or curved, may have planar and curved portions, or may have any other desired geometry. Examples in which surface45is curved are described herein as an example. Surface45may be curved in three dimensions about multiple axes if desired (e.g., surface45may be spherically curved, aspherically curved, freeform curved, etc.). Antenna40may be fed using antenna feed32. Antenna feed32may be coupled between antenna resonating element46and antenna ground42(e.g., across gap58at surface45of dielectric substrate44). For example, antenna resonating element46may have a feed segment such as feed segment72. Feed segment72may extend along a corresponding longitudinal axis (e.g., a longitudinal axis oriented parallel to the X-axis ofFIG.2) and may be separated from antenna ground42by gap58. Positive antenna feed terminal34of antenna feed32may be coupled to feed segment72whereas ground antenna feed terminal36is coupled to antenna ground42(e.g., at opposing sides of gap58). Antenna resonating element46may have multiple arms or branches. In the example ofFIG.2, antenna resonating element46includes a first arm (branch)52extending from feed segment72, a second arm (branch)50extending from first arm52, and a third arm48extending from feed segment72. Arms52,50, and48may sometimes be referred to herein as antenna resonating element arms or antenna arms. As shown inFIG.2, first arm52may have a first segment74extending from an end of feed segment72(e.g., first segment74may have a first end at the end of feed segment72that is opposite to antenna feed32). First segment74may extend at a non-parallel angle (e.g., a perpendicular angle) with respect to feed segment72(e.g., the longitudinal axis of first segment74may extend parallel to the Y-axis ofFIG.2and perpendicular to the longitudinal axis of feed segment72). First arm52may have a second segment76extending from an end of first segment74(e.g., first segment74may have a second end opposite feed segment72, and second segment76may have a first end at the second end of first segment74). Second segment76may extend at a non-parallel angle (e.g., a perpendicular angle) with respect to first segment74(e.g., the longitudinal axis of second segment76may extend parallel to the X-axis and feed segment72, and may extend perpendicular to the longitudinal axis of first segment74ofFIG.2). First arm52may also have a third segment78extending from an end of second segment76(e.g., second segment76may have a second end opposite first segment74, and third segment78may have a first end at the second end of second segment76). Third segment78may extend at a non-parallel angle (e.g., a perpendicular angle) with respect to second segment76(e.g., the longitudinal axis of third segment78may extend parallel to the Y-axis and the longitudinal axis of first segment74ofFIG.2). Third segment78may have a second end opposite second segment76. The second end of third segment78may be coupled to antenna ground42(e.g., at a grounding location). This may configure first arm52to form a loop-shaped path56(with feed segment72and antenna ground42) for antenna currents flowing between positive antenna feed terminal34and ground antenna feed terminal36. Loop-shaped path56may run around central opening77at surface45of dielectric substrate44. Second arm50may have a first segment80extending from the second end of segment74of first arm52and extending from the first end of segment76of first arm52(e.g., first segment80of second arm50may have a first end at the ends of segments74and76of first arm52). First segment80of second arm50may extend parallel to segment76of first arm52(e.g., first segment80of second arm50may extend along a longitudinal axis oriented parallel to the longitudinal axis of segment76of first arm52). Second arm50may have a second segment82extending from an end of first segment80to tip84of second arm50(e.g., first segment80may have a second end at second segment82of second arm50). Second segment82of second arm50may extend at a non-parallel angle with respect to first segment80of second arm50(e.g., along a longitudinal axis parallel to the Y-axis). First segment80of second arm50may be separated from segment76of first arm52(e.g., along the entire length of first segment80) by gap64. Second segment82of second arm50may also be separated from segment78of first arm52by gap64if desired. Gap64may form a distributed capacitance along the length of first segment80of second arm50(e.g., a distributed capacitance between segment80of second arm50and segment76of first arm52). The distributed capacitance formed by gap64may be used to tune the frequency response of first arm52and/or second arm50. Third arm48may have a first segment68extending from feed segment72(e.g., first segment68of third arm48may have a first end at feed segment72). First segment68of third arm48may extend at a non-parallel angle (e.g., a perpendicular angle) with respect to feed segment72(e.g., the longitudinal axis of first segment68of third arm48may be oriented parallel to the longitudinal axes of segments74and78of first arm52and segment82of second arm50). Third arm48may also have a second segment70extending from a second end of first segment68to tip66of third arm48. Second segment70of third arm48may extend at a non-parallel angle (e.g., a perpendicular angle) with respect to first segment68(e.g., second segment70may extend along a longitudinal axis oriented parallel to the longitudinal axes of feed segment72, segment76of first arm52, and segment80of second arm50). In other words, third arm48may be an L-shaped strip (e.g., an L-shaped arm) extending from feed segment72. A portion of second segment70of third arm48(e.g., at tip66) may be separated from second arm50by gap62. During signal transmission, antenna feed32receives radio-frequency signals from radio-frequency transceiver circuitry24ofFIG.1. Corresponding (radio-frequency) antenna currents may flow on antenna resonating element46and antenna ground42. The antenna currents may radiate the radio-frequency signals (e.g., as wireless signals) that are transmitted into free space. During signal reception, antenna resonating element46may receive (wireless) radio-frequency signals from free space. Corresponding antenna currents are then produced on antenna resonating element46. The radio-frequency signals corresponding to the antenna currents are then transmitted to radio-frequency transceiver circuitry24(FIG.1) via antenna feed32. The lengths of first arm52, second arm50, third arm48, and/or feed segment72may be selected so that antenna40operates in (handles) desired frequency bands of interest. For example, the length of antenna40from positive antenna feed terminal34to ground antenna feed terminal36through feed segment72, segments74,76, and78of first arm52, and antenna ground42(e.g., the length of loop path56) may be selected to configure antenna resonating element46to resonate in a first frequency band. The length of loop path56may, for example, be approximately equal to (e.g., within 15% of) one-half of the effective wavelength corresponding to a frequency in the first frequency band. The effective wavelength is equal to a free space wavelength multiplied by a constant value that is determined based on the dielectric constant of dielectric substrate44. The first frequency band may, for example, include frequencies between about 5.0 GHz and 6.0 GHz (e.g., for conveying signals in a 5.0 GHz wireless local area network band and/or unlicensed frequencies within the first frequency band). The first frequency band may sometimes be referred to herein as the midband of antenna40. During signal transmission, antenna currents in the first frequency band may flow along loop path56(e.g., along the perimeter of the conductive structures forming loop path56). Loop path56may radiate corresponding (wireless) radio-frequency signals in the first frequency band. Similarly, during signal reception, radio-frequency signals received from free space in the first frequency band may cause antenna currents in the first frequency band to flow along loop path56. In this way, feed segment72, segments74,76, and78of first arm52, and the portion of antenna ground42extending from segment78to ground antenna feed terminal36may form a loop antenna resonating element for antenna40(e.g., first arm52may form part of the loop antenna resonating element). If desired, gap64may introduce a (distributed) capacitance to loop path56that serves to tune the frequency response of loop path56in the first frequency band. Increasing the width of gap64may decrease this capacitance whereas decreasing the width of gap64may increase the capacitance. Gap64may, for example, have a width of 0.01-0.10 mm (e.g., approximately 0.05 mm), 0.01-0.50 mm, greater than 0.50 mm, etc. At the same time, the length of antenna resonating element46from positive antenna feed terminal34to tip84of second arm50through feed segment72, segment74of first arm52, and segments80and82of second arm50(e.g., the length of path60) may be selected to configure antenna resonating element46to resonate in a second frequency band. The length of path60may, for example, be approximately equal to (e.g., within 15% of) one-quarter of the effective wavelength corresponding to a frequency in the second frequency band. The second frequency band may, for example, include frequencies below 2.5 GHz (e.g., for conveying signals in a 2.4 GHz wireless local area network band). The second frequency band may sometimes be referred to herein as the low band of antenna40. During signal transmission, antenna currents in the second frequency band may flow along path60between positive antenna feed terminal34and tip84(e.g., along the perimeter of the conductive structures forming path60of antenna resonating element46). Path60may radiate corresponding (wireless) radio-frequency signals in the second frequency band. Similarly, during signal reception, radio-frequency signals received from free space in the second frequency band may cause antenna currents in the second frequency band to flow along path60. Segments76and78of first arm52may form a return path to antenna ground42for the antenna currents in the second frequency band (e.g., portions of first arm52may form a return path to ground for second arm50in the second frequency band while concurrently resonating in the first frequency band with the remainder of loop path56). In this way, second arm50and first arm52may collectively form an inverted-F antenna resonating element in the second frequency band for antenna40(e.g., first arm52may form both part of a loop antenna resonating element in the first frequency band and part of an inverted-F antenna resonating element in the second frequency band). If desired, gap64may introduce a (distributed) capacitance to second arm50that serves to tune the frequency response of path60in the second frequency band. In addition, the length of third arm48(e.g., path54) may be selected to configure antenna resonating element46to resonate in a third frequency band. The length of third arm48(e.g., path54) may, for example, be approximately equal to (e.g., within 15% of) one-quarter of the effective wavelength corresponding to a frequency in the third frequency band. The third frequency band may, for example, include frequencies between about 5.0 GHz and 9.0 GHz (e.g., for conveying signals in a 5.0 GHz wireless local area network band, for conveying signals in an unlicensed band such as a frequency band between 5.925 and 7.125 GHz, for conveying signals in a 6.5 GHz UWB communications band, and/or for conveying signals in an 8.0 GHz UWB communications band). The third frequency band may sometimes be referred to herein as the high band of antenna40. Third arm48may sometimes be referred to herein as the high band arm of antenna40. Second arm50may sometimes be referred to herein as the low band arm of antenna40. First arm52may sometimes be referred to herein as the midband arm of antenna40. During signal transmission, antenna currents in the third frequency band may flow along path54between positive antenna feed terminal34and tip66(e.g., along the perimeter of the conductive structures forming third arm48). Third arm48(e.g., path54) may radiate corresponding (wireless) radio-frequency signals in the third frequency band. Similarly, during signal reception, radio-frequency signals received from free space in the third frequency band may cause antenna currents in the third frequency band to flow along path54. In this way, third arm48may form a monopole antenna resonating element (e.g., an L-shaped antenna resonating element) in the third frequency band for antenna40. If desired, gap62may introduce a capacitance to third arm48that serves to tune the frequency response of third arm48and/or that serves to perform impedance matching for third arm48in the third frequency band. When configured in this way, antenna40may convey (e.g., transmit and/or receive) radio-frequency signals in each of the first, second, and third frequency bands with satisfactory antenna efficiency. Antenna40may, for example, exhibit a wideband response and may exhibit satisfactory antenna efficiency from the lower limit of the second frequency band to the upper limit of the third frequency band (e.g., from below 2.4 GHz to over 9.0 GHz). The example ofFIG.2in which third arm48extends from feed segment72of antenna resonating element46is merely illustrative. In another suitable arrangement, feed segment72may be omitted and third arm48may extend from antenna ground42. FIG.3is a diagram showing how third arm48of antenna40may extend from antenna ground42. As shown inFIG.3, feed segment72ofFIG.2may be omitted and positive antenna feed terminal34may be coupled to the first end of segment74of first arm52. Segments74,76, and78of first arm52and the segment of antenna ground42from segment78to ground antenna feed terminal36may form loop path90. The length of antenna resonating element46from positive antenna feed terminal34to ground antenna feed terminal36through first arm52and antenna ground42(e.g., the length of loop path90) may be selected to configure antenna resonating element46to resonate in the first frequency band. In this way, first arm52and the portion of antenna ground42extending from segment78to ground antenna feed terminal36(e.g., loop path90) may form a loop antenna resonating element for antenna40that resonates in the first frequency band. The length of antenna resonating element46from positive antenna feed terminal34to tip84of second arm50through segment74of first arm52and through second arm50(e.g., the length of path92) may be selected to configure antenna resonating element46to resonate in the second frequency band. Segments76and78of first arm52may form a return path to antenna ground42for antenna currents in the second frequency band on second arm50(e.g., portions of first arm52may form a return path to ground for second arm50in the second frequency band while concurrently resonating in the first frequency band with the remainder of loop path90). In this way, second arm50and first arm52may collectively form an inverted-F antenna resonating element in the second frequency band for antenna40(e.g., first arm52may form both part of a loop antenna resonating element in the first frequency band and part of an inverted-F antenna resonating element in the second frequency band). Gap64may introduce a distributed capacitance that serves to tune the frequency response of loop path90in the first frequency band and/or that serves to tune the frequency response of path92in the second frequency band. As shown inFIG.3, segment68of third arm48may be coupled to antenna ground42(at a grounding location) located at the side of antenna feed32opposite to segment78of first arm52(e.g., antenna feed32may be laterally interposed between segment68and segment78on dielectric substrate44). The length of third arm48(e.g., path88) may be selected to configure antenna resonating element46to resonate in the third frequency band. If desired, gap62may introduce a capacitance to third arm48that serves to tune the frequency response of third arm48and/or that serves to perform impedance matching for third arm48in the third frequency band. Antenna feed32may, for example, indirectly feed antenna currents in the third frequency band for third arm48via near-field electromagnetic coupling (e.g., across gap62). The example ofFIG.3in which antenna feed32is interposed between third arm48and segment78of first arm52is merely illustrative. In another suitable arrangement, third arm48may be located within central opening77of first arm52.FIG.4is a diagram showing how third arm48may be located within central opening77of first arm52. As shown inFIG.4, segment68of third arm48may be coupled to antenna ground42at a location that is laterally interposed between antenna feed32and segment78of first arm52(e.g., third arm48may be located within central opening77of first arm52). The length of third arm48(e.g., path94) may be selected to configure antenna resonating element46to resonate in the third frequency band. In the examples ofFIGS.2-4, all three of arms52,50, and48share the same antenna feed32(e.g., antenna feed32feeds radio-frequency signals for each of arms52,50, and48). Antenna feed32conveys the radio-frequency signals for each of arms52,50, and48between antenna40and transceiver circuitry24(FIG.1) (e.g., antenna feed32transmits radio-frequency signals that are received by arms52,50, and48from free space to transceiver circuitry24and antenna feed32transmits radio-frequency signals that are received from transceiver circuitry24over arms52,50, and48). The examples ofFIGS.2-4are merely illustrative. In general, first arm52, second arm50, and third arm48may have other shapes following any desired paths (e.g., paths having any desired number of curved and/or straight segments and that extend at any desired angles). The edges of the conductive material in antenna resonating element46may have any desired shape (e.g., may include any desired number of straight and/or curved portions extending at any desired angles). Antenna resonating element46may cover additional frequency bands if desired. FIG.5is a plot of antenna performance as a function of frequency for antenna40ofFIGS.2-4. As shown inFIG.5, curve96plots antenna performance (e.g., voltage standing wave ratio (VSWR)) as a function of frequency for antenna40. As shown by curve96, antenna40may exhibit response peaks that are below a threshold VSWR value TH from a first frequency F1to a second frequency F2. Frequency F1may, for example, be less than 2.4 GHz. Frequency F2may, for example, be greater than 9.0 GHz. Antenna40may exhibit satisfactory antenna efficiency at each frequency for which the VSWR of the antenna is below threshold value TH. Antenna40may therefore exhibit satisfactory antenna efficiency across bandwidth98from frequency F1to frequency F2. For example, as shown by curve96, antenna40may exhibit a response peak in first frequency band B1between about 5.0 GHz and 6.0 GHz due to the contribution (resonance) of first arm52ofFIGS.2-4. Antenna40may also exhibit a response peak in second frequency band B2at 2.4 GHz due to the contribution (resonance) of second arm50(and first arm52in serving as a return path for second arm50). Similarly, antenna40may exhibit a response peak in third frequency band B3between about 5.0 GHz and 9.0 GHz due to the contribution (resonance) of third arm48. At the same time, antenna40may exhibit satisfactory antenna efficiency at other frequencies across bandwidth98. This may allow antenna40to also convey radio-frequency signals at any other desired frequency bands between frequencies F1and F2with satisfactory antenna efficiency, while also occupying a relatively small amount of space within device10. The example ofFIG.5is merely illustrative. Curve96may have other shapes. Antenna40may convey radio-frequency signals in any desired number of frequency bands at any desired frequencies. FIG.6is a cross-sectional side view (e.g., as taken in the direction of arrow86ofFIGS.2-4) showing how antenna40may be integrated into device10. As shown inFIG.6, dielectric substrate44may have a curved surface such as surface45and at least one additional surface such as bottom surface102. Antenna resonating element46may be formed from conductive traces patterned onto surface45of dielectric substrate44. Antenna ground42may be formed from conductive traces patterned onto surface45and bottom surface102of dielectric substrate44. The conductive traces of antenna ground42and antenna resonating element46may be patterned onto dielectric substrate44using a Laser Direct Structuring (LDS) process if desired (e.g., dielectric substrate44may be formed from an LDS plastic material). In another suitable arrangement, antenna ground42and antenna resonating element46may be patterned onto one or more flexible printed circuits that are layered onto surfaces45and102of dielectric substrate44. Antenna ground42and dielectric substrate44may include a hole or opening such as hole104. A fastening structure such as screw100may extend through hole104to secure antenna ground42and dielectric substrate44to other device components such as system ground116. Screw100may be a conductive screw that serves to short antenna ground42to system ground116(e.g., system ground116may form part of the ground plane for antenna40). Screw100may be replaced by any desired conductive fastening structures such as a conductive clip, a conductive spring, a conductive pin, a conductive bracket, conductive adhesive, welds, solder, combinations of these, etc. Device10may include a dielectric cover layer such as dielectric cover layer110. Dielectric cover layer110may form part of housing38ofFIG.1for device10. Dielectric cover layer110may have an interior surface112at the interior of device10and may have an exterior surface114at the exterior of device10. Interior surface112and/or exterior surface114may be curved surfaces (e.g., three-dimensional curved surfaces that are curved along any desired axes such as spherically curved surfaces, aspherically curved surfaces, freeform curved surfaces, etc.). Interior surface112and exterior surface114may have the same curvature if desired. Dielectric cover layer110may be formed from any desired dielectric materials such as plastic, ceramic, rubber, glass, wood, fabric, sapphire, combinations of these or other materials, etc. Dielectric substrate44may be mounted within device10such that surface45faces dielectric cover layer110. Antenna resonating element46may be separated from interior surface112of dielectric cover layer110by distance106. Antenna40may convey radio-frequency signals108through dielectric cover layer110. Surface45of dielectric substrate44may be curved. The curvature of surface45may be selected to match the curvature of interior surface112of dielectric cover layer110(e.g., surface45may be a three-dimensional curved surface that is curved along any desired axes such as a spherically curved surface, aspherically curved surface, freeform curved surface, etc.). In other words, an entirety of the lateral area of surface45overlapping antenna resonating element46may extend parallel to the portion of interior surface112overlapping antenna resonating element46. This configures antenna resonating element46to be separated from interior surface112by the same distance106across the entire lateral area of antenna resonating element46(e.g., across the lateral area of at least arms52,50and70). This may ensure that a uniform impedance transition is provided from antenna resonating element46through dielectric cover layer110and to free space across the entire lateral area of antenna resonating element46. This may serve to maximize the antenna efficiency for antenna40despite the presence of a curved impedance boundary such as dielectric cover layer110. The foregoing is merely illustrative and various modifications can be made to the described embodiments. The foregoing embodiments may be implemented individually or in any combination. | 41,802 |
11862839 | DETAILED DESCRIPTION OF SEVERAL EMBODIMENTS Antenna alignment measurement is generally predicated on a proper coupling between the antenna and the antenna alignment device. The existing mounts are too restrictive—generally configured for antennas with ideal planar form factors—and therefore not be compatible with antennas having curved form factors or having other imperfections in their form factors. Described herein are examples of mounts that attempt to reduce such incompatibility and allow for more flexibility in coupling to different types of antenna form factors. The several examples of mounts described herein may provide a more flexible mounting arrangement between an antenna alignment device and antennas with different form factors. An example mount may include a clamp, e.g., a strap clamp, a lip clamp, an extension clamp, and/or any other type of clamp, which may have a first portion (e.g., strap) that may engage with a first external surface of an antenna. For instance, the first portion may include a strap that may wrap around the antenna. A second portion of the mount may include a base structure (e.g., a strap base) that may engage with a second external surface of the antenna. For instance, the base structure may have one or more components that may abut against the second external surface of the antenna. For example, the base structure of the mount may comprise a canted wall. The canted wall may be at an angle to other walls in the base structure, e.g., the canted wall may not necessarily be perpendicular to the other walls. When the base is engaged to the antenna at a corresponding external surface, an edge of the canted wall may abut against the external surface at a single point or a single line of contact. In other words, the entirely of the canted wall may not have to be flush with the external surface of the antenna. Because of the single point (or single line) of contact in the external surface of the antenna, the antenna does not have to be in a planar form factor. The mount has flexibility to be engaged with curved surfaces, protruding surfaces, and surfaces with imperfections. The base structure may comprise a second canted wall that may couple to the antenna alignment device. The second canted wall, based on its angled orientation to the other parts of the base structure, may facilitate an angled mounting of the antenna alignment device. Such angled mounting may be desired when the antenna has a larger form factor that may physically interfere with the antenna alignment device. For instance, cylindrical antennas with larger radii may have curvatures that may obstruct a non-angular mounting of the antenna alignment devices. The second canted wall may further allow for another layer of flexibility of mounting the antenna alignment device at an angled orientation. Although the below description has several examples of mounts using strap clamps, these are just provided for illustrative purposes only; and any other form of clamping mechanism (e.g., lip clamp, extension clamp) should be considered within the scope of this disclosure. FIG.1shows an example environment100for antenna alignment, based on the principles disclosed herein. The example environment100includes an antenna104, which may be disposed on a pole106. The pole106is just an example, and the antenna104may be located on any type of structure such as an antenna tower, rooftop, treetop, building wall, vehicle top, satellite, and/or any other type of structure. Furthermore, the antenna104can be any type of antenna, including a dome antenna, a sector antenna, a microwave antenna, an omnidirectional antenna, a loop antenna, a multibeam antenna, a Yagi-type antenna, and/or any type of antenna that may have to be aligned for optimal performance. An antenna alignment device102may be used for aligning the antenna104. The antenna alignment device102may output alignment information such as roll, tilt, and/or azimuth. Using the alignment information, a user may align the antenna104such that it may have a desired roll, tilt, and/or azimuth. The antenna alignment device102may be coupled to the antenna104using a mount108. The mount108may be any kind of mechanical coupling equipment (e.g., mounting bracket) that may allow the antenna alignment device102to be coupled to the antenna104, decoupled from the antenna104, and or adjusted vis-à-vis the antenna104. The mount108may include any type of coupling mechanism such as lip clamps, extension clamps, and strap clamps. The antenna104may not necessarily have planar external surfaces, and this disclosure describes several non-limiting examples of mounts108that that may couple the antenna104with non-planar external surface with the antenna alignment device102. FIGS.2A-2Cshow different perspective views of an example environment200of using a mount for coupling an antenna alignment device with an antenna, based on the principles disclosed herein. Particularly,FIG.2Ashows a front view,FIG.2Bshows a back view, andFIG.2Cshows a top view of a mount208coupling an antenna alignment device202with an antenna204. In the illustrated example environment200, the antenna204may be a 3 foot diameter microwave antenna. The mount208may include a strap212and a strap base218. The strap212may engage with the external surface of the antenna204. To facilitate the engagement, the strap212may be connected to the strap base218. Within the strap base218, there may be a ratchet216that may be used to tighten or loosen the engagement of the strap212with the external surface of the antenna204. The strap base218may also provide a coupling (e.g., a housing to receive a screw) for the antenna alignment device202. The strap base218may further comprise a canted wall210. The canted wall210may be at an angle (e.g., not necessarily perpendicular) to the other walls of the strap base218. Due to this angle, the canted wall210may have only one point of contact (alternatively, a single line of contact) with the external surface of the antenna204. The point of contact (or line of contact) may be along an edge of the canted wall210that may abut against the external surface of the antenna. This edge abutment along a single point (or single line) of contact may allow the mount208to be coupled to antennas of non-planar form factors. For instance, the mount208may be coupled to a curved external surface of the antenna204. The curved surface may not necessarily be the designed form factor of the antenna204. The curved surface (or any other type of non-planar surface) may also be formed by warping and/or other imperfections within the surface of the antenna, and the canted wall210may be generally abutted to any point in the curve. The canted wall210may allow for more flexibility and convenience of attachment compared to conventional planar brackets (often having perpendicular walls) that may have to be flush with the planar surfaces of an antenna. Because of the single point (or a single line) of contact, the form factor of the canted wall210does not necessarily have to match the form factor of the antenna, unlike the conventional planar brackets. Furthermore, as a flush (or a snug) fit is not necessarily required, the canted wall210may allow the strap base218to be clear from other obstructions within the antenna204. For example, there may be components protruding from the external surface of the antenna204such as wires, imperfections, and/or the shape of the antenna204itself; and the canted wall210may allow for the strap base218to be clear of the protruding components. As shown, the strap212may engage with a first portion of the external surface of the antenna204and the canted wall210may engage with a second portion of the external surface of the antenna204. The first portion and the second portion may be different to maintain a separate engagement of the strap212and the canted wall210with the antenna204. Alternatively, the first and second portions may be at least partially overlapping for the strap212and the canted wall210to engage the antenna204at nearby locations or the same location. The force of engagement of the strap212and the canted wall210may be controlled using the ratchet216. For example, when the ratchet216is tightened, the abutment force between the canted wall210and the corresponding portion of the external surface of the antenna204may increase. When the ratchet216is loosened, the abutment force between the canted wall210and the corresponding portion of the external surface of the antenna204may decrease. The strap base218may also include a second canted wall214that may be also be used for coupling the antenna alignment device202with the strap base218. Although not shown inFIGS.2A-2C, the coupling of the antenna alignment device202with the canted wall214may facilitate an angular orientation of the antenna alignment device202with respect to the antenna204(e.g., as shown inFIGS.5A-5C). FIGS.3A-3Cshow different perspective views of another example environment300of using a mount for coupling an antenna alignment device with an antenna, based on the principles disclosed herein. Particularly,FIG.3Ashows a front view,FIG.3Bshows a back view, andFIG.3Cshows a top view of a mount308coupling an antenna alignment device302with an antenna304. In the illustrated example environment300, the antenna304may be 76 mm omnidirectional antenna. The mount308may include a strap312and a strap base318. The strap312may engage with the external surface of the antenna304. To facilitate the engagement, the strap312may be connected to the strap base318. Within the strap base318, there may be a ratchet316that may be used to tighten or loosen the engagement of the strap312with the external surface of the antenna304. The strap base318may also provide a coupling (e.g., a housing to receive a screw) for the antenna alignment device302. The strap base318may further comprise a canted wall310. The canted wall310may be at an angle (e.g., not necessarily perpendicular) to the other walls of the strap base318. Due to this angle, the canted wall310may have only one point of contact (alternatively, a single line of contact) with the external surface of the antenna304. The point of contact (or line of contact) may be along an edge of the canted wall310that may abut against the external surface of the antenna. This edge abutment along a single point (or single line) of contact may allow the mount308to be coupled to antennas of non-planar form factors. For instance, the mount308may be coupled to a curved external surface of the antenna304. The curved surface may not necessarily be the designed form factor of the antenna304. The curved surface (or any other type of non-planar surface) may also be formed by warping and/or other imperfections within the surface of the antenna, and the canted wall310may generally be abutted to any point in the curve. The canted wall310may allow for more flexibility and convenience of attachment compared to conventional planar brackets (often having perpendicular walls) that may have to be flush with the planar surfaces of an antenna. Because of the single point (or a single line) of contact, the form factor of the canted wall310does not necessarily have to match the form factor of the antenna, unlike the conventional planar brackets. Furthermore, as a flush (or a snug) fit is not necessarily required, the canted wall310may allow the strap base318to be clear from other obstructions within the antenna304. For example, there may be components protruding from the external surface of the antenna304such as wires, imperfections, and/or the shape of antenna304itself; and the canted wall310may allow for the strap base318to be clear of the protruding components. As shown, the strap312may engage with a first portion of the external surface of the antenna304and the canted wall310may engage with a second portion of the external surface of the antenna304. The first portion and the second portion may be different to maintain a separate engagement of the strap312and the canted wall310with the antenna304. Alternatively, the first and second portions may be at least partially overlapping for the strap312and the canted wall310to engage the antenna304at nearby locations or the same location. The force of engagement of the strap312and the canted wall310may be controlled using the ratchet316. For example, when the ratchet316is tightened, the abutment force between the canted wall310and the corresponding portion of the external surface of the antenna304may increase. When the ratchet316is loosened, the abutment force between the canted wall310and the corresponding portion of the external surface of the antenna304may decrease. The strap base318may also include a second canted wall314that may be also be used for coupling the antenna alignment device302with the strap base318. Although not shown inFIGS.3A-3C, the coupling of the antenna alignment device302with the canted wall314may facilitate an angular orientation of the antenna alignment device302with respect to the antenna304(e.g., as shown inFIGS.5A-5C). FIGS.4A-4Cshow different perspective views of another example environment400of using a mount for coupling an antenna alignment device with an antenna, based on the principles disclosed herein. Particularly,FIG.4Ashows a front view,FIG.4Bshows a back view, andFIG.4Cshows a top view of a mount408coupling an antenna alignment device402with an antenna404. In the illustrated example environment400, the antenna404may be a 200 mm sector antenna. The mount408may include a strap412and a strap base418. The strap412may engage with the external surface of the antenna404. To facilitate the engagement, the strap412may be connected to the strap base418. Within the strap base418, there may be a ratchet416that may be used to tighten or loosen the engagement of the strap412with the external surface of the antenna404. The strap base418may also provide a coupling (e.g., a housing to receive a screw) for the antenna alignment device402. The strap base418may further comprise a canted wall410. The canted wall410may be at an angle (e.g., not necessarily perpendicular) to the other walls of the strap base418. Due to this angle, the canted wall410may have only one point of contact (alternatively, a single line of contact) with the external surface of the antenna404. The point of contact (or line of contact) may be along an edge of the canted wall410that may abut against the external surface of the antenna404. This edge abutment along a single point (or single line) of contact may allow the mount408to be coupled to antennas of non-planar form factors. For instance, the mount408may be coupled to a curved external surface of the antenna404. The curved surface may not necessarily be the designed form factor of the antenna404. The curved surface (or any other type of non-planar surface) may also be formed by warping and/or other imperfections within the surface of the antenna, and the canted wall410may generally be abutted to any point in the curve. The canted wall410may allow for more flexibility and convenience of attachment compared to conventional planar brackets (often having perpendicular walls) that may have to be flush with the planar surfaces of an antenna. Because of the single point (or a single line) of contact, the form factor of the canted wall410does not necessarily have to match the form factor of the antenna, unlike the conventional planar brackets. Furthermore, as a flush (or a snug) fit is not necessarily required, the canted wall410may allow the strap base418to be clear from other obstructions within the antenna404. For example, there may be components protruding from the external surface of the antenna404such as wires, imperfections, or the shape of antenna404itself; and the canted wall410may allow for the strap base418to be clear of the protruding components. As shown, the strap412may engage with a first portion of the external surface of the antenna404and the canted wall410may engage with a second portion of the external surface of the antenna404. The first portion and the second portion may be different to maintain a separate engagement of the strap412and the canted wall410with the antenna404. Alternatively, the first and second portions may be at least partially overlapping for the strap412and the canted wall410to engage the antenna404at nearby locations or the same location. The force of engagement of the strap412and the canted wall410may be controlled using the ratchet416. For example, when the ratchet416is tightened, the abutment force between the canted wall410and the corresponding portion of the external surface of the antenna404may increase. When the ratchet416is loosened, the abutment force between the canted wall410and the corresponding portion of the external surface of the antenna404may decrease. FIGS.5A-5Cshow different perspective views of another example environment500of using a mount for coupling an antenna alignment device with an antenna, based on the principles disclosed herein. Particularly,FIG.5Ashows a front view,FIG.5Bshows a back view, andFIG.5Cshows a top view of a mount508coupling an antenna alignment device502with an antenna504. In the illustrated example environment500, the antenna504may be a 457 mm sector antenna. The mount508may include a strap512and a strap base518. The strap512may engage with the external surface of the antenna504. To facilitate the engagement, the strap512may be connected to the strap base518. Within the strap base518, there may be a ratchet516that may be used to tighten or loosen the engagement of the strap512with the external surface of the antenna504. The strap base518may also provide a coupling (e.g., a housing to receive a screw) for the antenna alignment device502. The strap base518may further comprise a canted wall510. The canted wall510may be at an angle (e.g., not necessarily perpendicular) to the other walls of the strap base518. Due to this angle, the canted wall510may have a single point of contact (alternatively, a single line of contact) with the external surface of the antenna504. The point of contact (or line of contact) may be along an edge of the canted wall510that may be abutted against the external surface of the antenna504. This edge abutment along a single point (or single line) of contact may allow the mount508to be coupled to antennas of non-planar form factors. For instance, the mount508may be coupled to a curved external surface of the antenna504. The curved surface may not necessarily be the designed form factor of the antenna504. The curved surface (or any other type of non-planar surface) may also be formed by warping and/or other imperfections within the surface of the antenna, and the canted wall510may generally be abutted to any point in the curve. The canted wall510may allow for more flexibility and convenience of attachment compared to conventional planar brackets (often having perpendicular walls) that may have to be flush with the planar surfaces of an antenna. Because of the single point (or a single line) of contact, the form factor of the canted wall510does not necessarily have to match the form factor of the antenna, unlike the conventional planar brackets. Furthermore, as a flush (or a snug) fit is not necessarily required, the canted wall510may allow the strap base518to be clear from other obstructions within the antenna504. For example, there may be components protruding from the external surface of the antenna504such as wires, imperfections, or the shape of antenna504itself; and the canted wall510may allow for the strap base518to be clear of the protruding components. As shown, the strap512may engage with a first portion of the external surface of the antenna504and the canted wall510may engage with a second portion of the external surface of the antenna504. The first portion and the second portion may be different to maintain a separate engagement of the strap512and the canted wall510with the antenna504. Alternatively, the first and second portions may be at least partially overlapping for the strap512and the canted wall510to engage the antenna504at nearby locations or the same location. The force of engagement of the strap512and the canted wall510may be controlled using the ratchet516. For example, when the ratchet516is tightened, the abutment force between the canted wall510and the corresponding portion of the external surface of the antenna504may increase. When the ratchet516is loosened, the abutment force between the canted wall510and the corresponding portion of the external surface of the antenna504may decrease. The strap base518may also include a second canted wall514that may be also be used for coupling the antenna alignment device502with the strap base518. As seen inFIGS.5B-5C, the coupling of the antenna alignment device502to the second canted wall514allows for an angular orientation of the antenna alignment device502with respect to the antenna504(compared to the orientation shown inFIGS.4A-4C). This angular orientation may allow the antenna alignment device502to clear the physical interference from the relatively larger external surface of the antenna504. FIGS.6A-6Dshow different perspective views of yet another example environment600of using a mount for coupling an antenna alignment device with an antenna, based on the principles disclosed herein. Particularly,FIG.6Ashows a front view,FIG.6Bshows a back view,FIG.6Cshows a top left hand view, andFIG.6Dshows a top right hand view of a mount608coupling an antenna alignment device602with an antenna604. In the illustrated example environment600, the antenna504may be 640 mm multibeam antenna. The mount608may include a strap612and a strap base618. The strap612may engage with the external surface of the antenna604. To facilitate the engagement, the strap612may be connected to the strap base618. Within the strap base618, there may be a ratchet616that may be used to tighten or loosen the engagement of the strap612with the external surface of the antenna604. The strap base618may also provide a coupling (e.g., a housing to receive a screw) for the antenna alignment device602. The strap base618may further comprise a canted wall610. The canted wall610may be at an angle (e.g., not necessarily perpendicular) to the other walls of the strap base618). Due to this angle, the canted wall610may have a single point of contact (alternatively, a single line of contact) with the external surface of the antenna604. The point of contact (or line of contact) may be along an edge of the canted wall610that may abut against the external surface of the antenna604. This edge abutment along a single point (or single line) of contact may allow the mount608to be coupled to antennas of non-planar form factors. For instance, the mount608may be coupled to a curved external surface of the antenna604. The curved surface may not necessarily be the designed form factor of the antenna604. The curved surface (or any other type of non-planar surface) may also be formed by warping and/or other imperfections within the surface of the antenna, and the canted wall610may be generally abutted to any point in the curve. The canted wall610may allow for more flexibility and convenience of attachment compared to conventional planar brackets (often having perpendicular walls) that may have to be flush with the planar surfaces of an antenna. Because of the single point (or a single line) of contact, the form factor of the canted wall610does not necessarily have to match the form factor of the antenna, unlike the conventional planar brackets. Furthermore, as a flush (or a snug) fit is not necessarily required, the canted wall610may allow the strap base618to be clear from other obstructions within the antenna604. For example, there may be components protruding from the external surface of the antenna604such as wires, imperfections, and/or the shape of the antenna604itself; and the canted wall610may allow for the strap base618to be clear of the protruding components. As shown, the strap612may engage with a first portion of the external surface of the antenna604and the canted wall610may engage with a second portion of the external surface of the antenna604. The first portion and the second portion may be different to maintain a separate engagement of the strap612and the canted wall610with the antenna604. Alternatively, the first and second portions may be at least partially overlapping for the strap612and the canted wall610to engage the antenna604at nearby locations or the same location. The force of engagement of the strap612and the canted wall610may be controlled using the ratchet616. For example, when the ratchet616is tightened, the abutment force between the canted wall610and the corresponding portion of the external surface of the antenna604may increase. When the ratchet616is loosened, the abutment force between the canted wall610and the corresponding portion of the external surface of the antenna604may decrease. The strap base618may also include a second canted wall614that may be also be used for coupling the antenna alignment device602with the strap base618. Although not shown inFIGS.6A-6D, the coupling of the antenna alignment device602with the canted wall614may facilitate an angular orientation of the antenna alignment device602with respect to the antenna604(e.g., as shown inFIGS.5A-5C). While various embodiments have been described above, it should be understood that they have been presented by way of example and not limitation. It will be apparent to persons skilled in the relevant art(s) that various changes in form and detail can be made therein without departing from the spirit and scope. In fact, after reading the above description, it will be apparent to one skilled in the relevant art(s) how to implement alternative embodiments. For example, other steps may be provided, or steps may be eliminated, from the described flows, and other components may be added to, or removed from, the described systems. Accordingly, other implementations are within the scope of the following claims. In addition, it should be understood that any figures which highlight the functionality and advantages are presented for example purposes only. The disclosed methodology and system are each sufficiently flexible and configurable such that they may be utilized in ways other than that shown. Although the term “at least one” may often be used in the specification, claims and drawings, the terms “a”, “an”, “the”, “said”, etc. also signify “at least one” or “the at least one” in the specification, claims and drawings. Finally, it is the applicant's intent that only claims that include the express language “means for” or “step for” be interpreted under 35 U.S.C. 112(f). Claims that do not expressly include the phrase “means for” or “step for” are not to be interpreted under 35 U.S.C. 112(f). | 26,957 |
11862840 | DETAILED DESCRIPTION It will be readily understood that the solution described herein and illustrated in the appended figures could involve a wide variety of different configurations. Thus, the following more detailed description, as represented in the figures, is not intended to limit the scope of the present disclosure, but is merely representative of certain implementations in various different scenarios. While the various aspects are presented in the drawings, the drawings are not necessarily drawn to scale unless specifically indicated. The solution concerns a compact reflector which uses one or more storable extendible members (SEM) to facilitate deployment and support of the reflector structure. The reflector is a perimeter truss reflector in which one or more longerons which comprise the truss are each formed from an SEM. The SEM comprising the longeron is flattened and bent where it extends around the truss corners. Each of these corners is respectively associated with a corresponding one of a plurality of battens. The SEM is stowed on a spool at a single location on the periphery. During deployment, the elongated length of each longeron is free to move around each truss corner in a direction transverse to the length of the batten, thereby expanding all the bays. At full deployment, a spacing between the battens is fixed by a network of tension members and the mesh surface of the reflector. An illustrative example of a deployable reflector100is shown inFIGS.1-4. The reflector100includes a perimeter truss assembly (PTA)102comprised of a plurality of battens104and an SEM deployment member (SEM-DM)106. The battens and the SEM-DM are rigid members, each having an elongated length. As such, these structures can be comprised of a strong lightweight material such as an aluminum alloy and/or a composite material. The battens104and the SEM-DM106are connected by a plurality of tension members124,126,128and one or more longerons112so as to form a hoop-like structure. In some scenarios, tension members128can be disposed within or adjacent to the longerons. Each of the battens104and the SEM-DM106can traverse a PTA thickness t as defined along a direction aligned with a reflector central axis108. In some scenarios, the battens104can be linear elements aligned with the reflector central axis108. However, the solution is not limited in this respect and in other scenarios the battens can be curved along at least a portion of their overall length. In the example shown inFIG.1, the PTA includes two longerons112, which are disposed respectively at opposing upper and lower end portions120,122of the battens104. The longerons112each extend circumferentially around at least a portion of a periphery of the PTA102. In the example shown, each longeron112extends completely around the periphery of the PTA, but other scenarios are possible.FIG.16shows an example of a similar reflector800in which a single longeron112extends circumferentially around a PTA802, comprised of battens804and SEM-DM806. As explained below in greater detail, each of the longerons112are advantageously comprised of an SEM. As used herein, an SEM can comprise any of a variety of deployable structure types that can be flattened and stowed on a spool for stowage, but when deployed or unspooled will exhibit beam-like structural characteristics whereby they become stiff and capable of carrying bending and column loads. Deployable structures of this type come in a wide variety of different configurations which are known in the art. Examples include slit-tube or Storable Tubular Extendible Member (STEM), Triangular Rollable and Collapsible (TRAC) boom, Collapsible Tubular Mast (CTM), and so on. Each of these SEM types are well-known and therefore will not be described here in detail. SEMs offer important advantages in deployable structures used in spacecraft due to their ability to be compactly stowed, retractable capability, and relatively low cost. The longerons112can be comprised of metallic SEMs but such metallic SEMs are known to require complex deploying mechanism to ensure that the metallic SEM deploys properly. Accordingly, it can be advantageous in the reflector solution described herein to employ SEMs which are formed of composite materials. For example, the SEMs can be comprised of a fiber-reinforced polymer (FRP). Such composite SEMs can be composed of several fiber lamina layers that are adhered together using a polymer matrix. In a slit-tube or STEM scenario, the slit in the tube allows the cross section to gradually open or transition from a circular cross section to a flat or partially flattened cross section. When fully opened or transitioned to the flat or partially flattened cross section, the STEM can be curved or rolled around an axis perpendicular to the elongated length of the STEM. The flattened state is sometimes referred to herein as the planate state. For convenience the solution will be described in the context of a STEM which transitions between a circular state and a flat or flattened, planate state. It should be understood, however, that the solution presented is not limited to this particular configuration of STEM shown. Any other type of SEM design can be used (whether now know, or known in the future) provided that it offers similar functional characteristics, whereby it is bendable when flattened, rigid when un-flattened or deployed. Each longeron112is flattened and open where it changes direction at each batten104. For a PTA which has the shape of a regular polygon, the longerons112will form an equal interior angle α at each batten. The batten advantageously include guide members160which include one or more contact surfaces161,163,165that are offset from the batten to enforce this angle α between the longeron sections on either side. The longerons112each gradually transition back to a circular cross section on either side of each batten104. The longerons112can be securely attached to one side of the SEM-DM106by means of a lug146and on an opposing end is driven outwardly from a spool. In the stowed state, the longerons112may not be long enough to transition back to circular and therefore could be largely flat between the battens. In a solution disclosed herein, a collapsible reflector110is secured to the PTA such that reflector surface114is shaped to concentrate RF energy in a predetermined pattern. The collapsible reflector110is advantageously formed of a pliant RF reflector material, such as a conductive metal mesh. As such, the reflector is110is sometimes referred to herein as a collapsible mesh reflector. The collapsible mesh reflector can be supported by a front net130comprised of a network of cords or straps. The front net130and the collapsible mesh reflector110which supports it can be secured to an upper portion120of each of the battens104and the SEM-DM106. A rear net115, which is also comprised of a network of cords or straps, can be attached to a lower portion122of each of the battens, opposed from the front net130and the reflector surface114. A plurality of tie cords118can extend from the rear net116to the front net130to help conform the reflector surface to a dish-like shape that is suited for reflecting RF energy. InFIGS.1-4, most of the tie cords118are omitted to facilitate greater clarity in the drawing. The PTA102is comprised of a plurality of sides or bays132which extend between adjacent pairs of the battens104. In each bay132, the PTA102includes a plurality of truss cords which extend between adjacent battens104. For example, the plurality of truss cords can include a plurality of truss diagonal tension cords124which extends between a first and second batten (which together comprise an adjacent batten pair) from an upper portion of the first batten, to a lower portion of the second batten. A second truss diagonal tension cord126can extend between the lower portion of the first batten and an upper portion of the second batten. These truss diagonal extension cords124,126can also extend between the SEM-DM106and its closest adjacent battens104. Each bay132can also include at least one truss longitudinal tension cord128which extends between adjacent batten104in a plane which is orthogonal to a reflector central axis108. In some scenarios, these truss longitudinal tension cords128can be disposed so that that a first cord128extends between the upper portion120of each batten104, and a second cord128extends between the lower portions122of each batten. InFIGS.1-4, some of the truss cords124,126,128are omitted to facilitate greater clarity. However, it should be understood that each bay132will generally include a similar arrangement of diagonal and longitudinal truss cords124,126,128. The PTA102inFIGS.1-4is shown in an expanded state. However, it should be understood that the PTA is advantageously configured to transition to this expanded state from a collapsed configuration or state, which is shown inFIG.5. It can be observed inFIG.5that when the PTA102is in the collapsed configuration, the battens104are closely spaced with respect to one another (and with respect to the SEM-DM106). Consequently, an area enclosed by the PTA can be relatively small in the collapsed configuration. This ensures that the PTA can have a very compact size when it is stowed onboard a spacecraft. Conversely, in the expanded configuration shown inFIG.1-4, a distance between the battens104, and the area enclosed by the PTA, is substantially increased as compared to the collapsed configuration. The larger area is useful for maximizing the size of a collapsible mesh reflector110when the reflector is positioned on orbit after deployment. According to one aspect, the collapsible mesh reflector110can be attached to the battens104by resilient members, such as springs (not shown) so as to isolate hard structure (e.g., the battens104and SEM-DM106) from precision shaping elements (e.g., front and rear nets,130,115and attaching cords118). According to another aspect, the tie cords188could include a resilient member, such as springs (not shown), to provide forces between the front net115and the rear net130that are less sensitive to the position of the hard structure (e.g., the battens104and SEM-DM106). The transition of the PTA102from the collapsed state to its expanded state is facilitated by the longerons112. This transition process is partially shown inFIGS.6A-6C. The longerons112are configured to urge the collapsible mesh reflector surface110and the plurality of truss cords124,126,128to a condition of tension when the SEM which comprises each longeron is extended from a stowed configuration to a deployed configuration. The longerons are considered to be in a stowed configuration when a major portion of the longeron is disposed on a spool contained within the SEM-DM106. The longerons are considered to be in a deployed configuration when a major portion of each longeron is extended from the spool. In this regard, it can be observed inFIGS.6A-6Cthat the extension of the longerons can progressively urge the battens104to become further separated in distance as the extended length of the longeron is increased. This arrangement will now be described in greater detail. When in a planate state the SEM comprising the longeron112will have a flattened configuration in which a length and width of the SEM are relatively broad as compared to the thickness of the SEM. When in this condition, the longeron can be rolled on a spool to reduce the overall volume of the structure. InFIGS.2-3and5, it can be observed that when in the planate state the SEM comprising each longeron112can also be mechanically flattened at each of the truss corners133to allow the longeron112to be bent or curved around an axis169of each batten. When flattened, the SEM can be rolled around an axis which extends in a direction perpendicular to the elongated length of the SEM. Consequently, the SEM can be conveniently spooled in an SEM-DM106for efficient stowage, as shown and described in relation toFIG.7. The SEM (which is a slit-tube or STEM in this scenario) can be rolled toward the concave side of the of the extended tube as shown or it can be rolled away from the concave side. In the absence of a force or curvature that keeps the SEM in its planate state, the SEM can tend to revert or transition to a deployed state. For example, the SEM deployed state in the solution shown inFIGS.1-5is substantially tubular with a slit extending down the elongated length of the tube. This deployed state of the SEM can be best observed for example inFIGS.2and3at locations along the length of each longeron112which are spaced some distance apart from the truss corners133. When in this deployed state, the SEM exhibits substantial rigidity and forms stable structural members which are resistant to bending and compressive forces exerted along an elongated length of the SEM. The reflector system100is an example reflector system incorporating one type of SEM having a cylindrical or semi-cylindrical profile when in the deployed state. However, it should be understood that many different types of SEMs are possible and the solution is not limited to the particular type of SEM that is shown. For example, a tape measure used in carpentry is a SEM where only a shallow angle of curvature is used. Any suitable SEM type which is now know or known in the future can be used to form the longerons112. An illustrative SEM-DM106shown inFIG.7can comprise one or more spools137,140. A major length of each longeron112is disposed on these spools when the longerons are in the stowed configuration. In some scenarios, the spools137,140can be journaled on one or more drive shaft139,140so that the spools can rotate with respect to the SEM-DM106. The rotation of these drive shafts and spools137,140can be controlled by at least one motor142which is disposed within the SEM-DM. In some scenarios, the motor142can be an electric motor. The motor142is advantageously configured so that upon activation, it will urge rotation of the spools137,140in directions142,144. For example, this rotation can be facilitated by applying a rotation force through the one or more drive shafts139,141. The rotation of the spools as described will cause the longerons112to deploy from the spools in the direction indicated by arrows134,136. In some scenarios, the longerons112can deploy from an interior of the SEM-DM106through a slot or channel148. The longerons move through the slots148in directions134,136as they extend or deploy from the spools. A tip end113of each longeron112that is distal from an opposing root end attached to a spool137,140can be firmly secured to the structure of the SEM-DM106by means of a suitable anchor member or lug146. As shown inFIGS.1-5the PTA102will include a plurality of truss corners133. Each of the truss corners133is respectively defined at a corresponding one of the plurality of battens104. A truss corner133is also defined at the SEM-DM106. According to one aspect of the solution presented herein, the one or more longerons112are bent or curved around each of the battens104where the longeron extends around the truss corners. Further, the PTA is configured so that an elongated length of each of the one or more longerons112will move transversely with respect to the elongated length of each of the battens. Stated differently, the longerons112will move transversely to an axis169aligned with the length of each batten. For example, such movement can occur as the PTA102is transitioned from the collapsed or stowed configuration shown inFIG.5to the expanded configuration shown inFIG.1. Each of the battens104can optionally be comprised of a friction-reducing member The friction reducing member is configured to reduce a friction force exerted on the longeron112as the longeron moves transversely around the truss corner. As shown inFIGS.8and9a friction reducing member can in some scenarios be implemented as a roller guide, such as batten roller150. The batten roller150can be configured to rotate about a rotation axis156in a direction152with respect to the batten104. This rotation action allows the longeron112to move easily around the truss corner133as it is guided along the roller surface154of the batten roller. In a scenario shown inFIGS.8and9, a contact surface can in some scenarios be configured as a rotating member in the form of a pinch roller138. The pinch roller138can be configured to rotate about an axis158in a bearing provided within the guide member160. To facilitate greater clarity, the guide member160is omitted inFIGS.8and9. However, it will be appreciated that the arrangement of the pinch roller138can facilitate rotation of the pinch roller138in a direction as indicated by arrow164. The combination of the friction-reducing member (e.g., batten roller150) and the pinch member (e.g., pinch roller138) can form a pinch zone166. The pinch zone comprises a limited cross-sectional area through which the longeron travels as the longeron moves transversely with respect to the batten105. The dimensions of the pinch zone are chosen such that the longeron112is flattened as it travels around the truss corner in directions156a,156band passes between the two opposing rollers138,150. InFIGS.8and9only the batten roller and pinch roller at the upper portion120of the batten104are shown. However, it should be understood that similar configurations of batten rollers and pinch rollers can be provided at other locations along the length of the batten where the batten is traversed by a longeron. For example, in the scenario shown inFIG.1, a similar configuration of batten roller and pinch roller could be provided at a lower portion122of the batten. Conversely, in the scenario shown inFIG.16, only a single batten roller and pinch roller would be required at each batten. Of course, other configurations are possible and the solution is not intended to be limited to the roller configuration shown inFIGS.8and9. For example,FIG.10shows an example in which a friction-reducing member150can be a fixed surface having a convex face170. Such convex or curved face170can be comprised of a polished metal surface and/or a low-friction polymer material. Examples of such low-friction polymer materials can include polyoxymethylene (POM), acetal, nylon, polyester, and/or polytetrafluoroethylene (PTFE) among others. In such a scenario, the pinch member168can be comprised of a fixed guide member having a concave face172. A pinch zone174is defined in the space between the friction reducing member150and the fixed guide member168to flatten the SEM which comprises the longeron. Referring now toFIG.11, it can be observed that each guide member160will define a plurality of contact surfaces161,163,165to maintain the angle between the longeron112on either side. In some scenarios, one or more of these contact surfaces161,165can be disposed on arms180a,180b,182a,182bwhich comprise part of a frame184. The arms180a,180b,182a,182bcan be configured to extend on either side of the batten104as shown. According to one aspect shown inFIG.11, the arms180a,180b,182a,182bcan define a rigid frame184whereby the contact surfaces can be configured to remain in a fixed location during stowage and deployment. However, in other scenarios (not shown) the arms can have a deployable configuration such that contact surfaces161,165are located closer to the batten104when the PTA is in its stowed configuration, and are extended further away from the batten104when the PTA in the deployed state. For example, the extension of the contact surfaces could be urged by the deployment of the batten or by springs (not shown) that drive the contact surfaces outward from the batten during deployment. The contact surfaces161,165,168can be configured so that they touch the concave side, convex side or the edges of the longeron112. Further, the contact surfaces may engage the longeron in the transition zone where the longeron is in the process of transitioning to a flattened state, or after the longeron has returned to the deployed state where it has a circular cross section. As an example, each of the contact surfaces161,165could comprise curved slot in a rigid face186,188that the longeron passes through. However, the solution is not limited in this regard and in other scenarios there could be one or more discrete contact surfaces. In some scenarios, these contact surfaces could be comprised of a low friction material so that they slide over the surface of the longeron. Alternatively, the contact surfaces could be configured to be rollers or bearings. In the SEM-DM the deployment of two or more longerons112can be coordinated by disposing the spools137,140on a common drive shaft139/141. However, in some scenarios it can be advantageous to exercise additional control over the deployment of the longerons at each batten104. As such, it can be advantageous to coordinate the travel of each longeron112as it passes through one or more pinch zones associated with a particular batten104. To facilitate this result, the rotation of a first batten roller150(e.g., at an upper portion120of the batten) can be coordinated with a rotation of a second batten roller150(disposed for example at a lower portion122of the batten). In an example shown inFIGS.8and9, this coordination can be facilitated by an axle shaft155which synchronizes the rotation of the all roller battens150disposed within a particular batten104. If such coordination is desired in a particular scenario, the roller surface154and/or a material comprising a surface of the pinch roller can be chosen to be a relatively high friction material so that any transverse movement of the longeron through the pinch zone is only possible with a corresponding rotation of the batten roller and pinch roller. From the foregoing it will be understood that a longeron112is free to move transversely with respect to the batten104as the deployed length of the longeron112is increased. As a longeron112is unspooled in this way, the perimeter of the PTA will increase and urge the battens104to the expanded state which is shown inFIG.1. Note that the resulting spacing s between adjacent battens104is fixed at full deployment by a tension member network including the mesh surface110, diagonal truss members124,126and longitudinal truss members128. The angle between the adjacent faces is enforced by the contact surfaces161,163,165that maintain the angle of the longerons. Turning now toFIGS.12A-12C(collectivelyFIG.12), there is illustrated a first series of drawings which are useful for understanding a progressive transition of the PTA102from a collapsed configuration to a fully expanded configuration.FIG.12shows an example in which the PTA102is configured so that all bays expand with uniform spacing between battens. In such a scenario, symmetry among each of the bays or sides can be enforced during and after the expansion process by means of the guide members160, which ensure that an equal interior angle α is maintained at each batten. Consequently, the sides or bays of the PTA102all extend at the same rate. In another scenario illustrated inFIGS.13A-13D(collectivelyFIG.13), the operation of the longerons112can be relatively uncontrolled so that the bays or sides do not all necessarily increase at the same time and/or at the same rate during the longeron deployment. In the example shown, it can be observed inFIG.13Bthat bays812,814expand first, followed inFIG.13Cby bays816,818. The final configuration is shown inFIG.13Din which it can be observed that an equal interior angle α is established at all of the battens. The growth order shown inFIG.13is presented by way of illustration only and it should be understood that the actual order in which particular sides812,814,816,818are grown can vary from that which is illustrated inFIG.13without limitation. Also, it should be understood that in the scenarios illustrated with respect toFIGS.12and13, a suitable type of detent mechanism can be applied to selectively restrict deployment to a desired sequence. Various mechanisms can be employed to control an order in which the various sides of the PTA102are extended. For example, in one scenario the batten roller150and pinch roller138associated with different battens104can designed so that each presents a different amount of resistance or friction to transverse travel of the longeron through the pinch zone. To facilitate such variations in friction forces, different materials having different coefficients of friction can be selected in some scenarios for the contact surfaces161,163,165which are associated with each guide member160. In other scenarios in which a roller (e.g. roller150) is used at a batten104, a friction brake shoe153can interact with a surface of the roller to apply a drag force. Accordingly, a longeron can be caused to fully (or partially) extend along some sides or bays of the PTA102before fully extending along other sides. Structural cross cords, hoop cords, and surface shaping cord net can be used to determine the final spacing of the battens when fully deployed. An example of such a configuration is illustrated inFIGS.14A-14I(collectivelyFIG.14). InFIG.14, friction or resistance associated with the deployment of the longeron along the length of certain bays can be modified at one or more of the guide members160so as to cause the bay nearest to the SEM-DM106to deploy first, followed serially by each adjacent bay in a counter-clockwise direction as shown. The maximum deployment of each bay is stopped with a corresponding limit cord820provided for each bay. One example of a STEM used to form the longerons112herein can comprise a semi-tubular structure as shown inFIG.15. The STEM830can be disposed about a central longitudinal axis832. The STEM830has opposed internal and external curved surfaces834,836which define an arc disposed between a pair of longitudinal edges838,840. The curved surfaces can have an arc length which varies depending upon the degree to which the STEM is in the planate state as compared to the flattened or deployed state. For example, the illustrative STEM inFIG.15can have a substantially tubular configuration844when in the deployed state in which the opposed internal and external curved surfaces can define a circular arc having an arc length of between about 90 degrees and 360 degrees. When in a planate state846the STEM can be substantially or completely planar. Of course,FIG.15is just one example of an SEM which can be used to form the longerons in the solution described herein. Many other types of SEM designs are known in the art and any other suitable type of SEM (whether now know or known in the future) can be used to form the longerons112, without limitation. The solution is not limited to the scenario described inFIGS.1-16in which a longeron extends continuously around the perimeter of the PTA from a single SEM-DM. In other scenarios. For example,FIGS.17A-17Cillustrate a scenario in which the plurality of battens104in a reflector900can be replaced by a plurality of SEM-DMs106a-106f. In such a scenario, the SEM-DMs106a-106fcan be understood to function as battens at each corner of the reflector. The SEM-DMs106a-106fcan each have a configuration which is similar to the SEM-DM106which is shown inFIG.7. In such a scenario, each of the SEM-DMs106a-106fcan respectively stow at least one longeron112a-112ffor a single bay or side. As in the previous examples, the longerons can be comprised of an SEM. When the reflector900is to be deployed, each SEM-DM106a-106fcan unspool a respective one of the longerons112a-112fin respective direction912a-912bas shown. Similarly, other solutions are possible. For example, shown inFIG.18is a reflector920in which two (2) SEM-DM906a,906bare disposed on opposing corners of the PTA structure. In this example, each SEM-DM906a,906bstows at least one longeron932a,932b. Each of these longerons932a932bis configured so that it will, when unspooled, extend through half of the bays or sides as shown. For example, SEM-DM906awill extend longeron932aalong path922athrough a first half of the sides or bays forming the reflector, whereas SEM-DM906bwill extend longeron932bthrough path922bthrough a second half of the bays or sides which form the reflector920. It's also possible to design an SEM spool that sends out a longeron in more than one direction (e.g., by wrapping the longerons interleaved on top of each other in the spool). In such a scenario a single SEM-DM could unspool the longerons to the bays on either side of the SEM-DM.FIG.19illustrates such a configuration in which SEM-DM956aextend longerons962a1,962a2, SEM-DM956bextends longerons962b1,962b2, and SEM-DM956cextends longerons962c1,962c2. More particularly, longerons962a1,962a2extend respectively in directions964a1,964a2, longerons962b1,962b2extend respectively in directions964b1,964b2and longerons962c1,962c2extend respectively in directions964c1,964c2. Each of the longerons can be securely attached at a tip end (distal from the SEM-DM) to a batten954by means of a suitable lug. Such a configuration can eliminate the need for the longerons to be bent around each of the corners comprising the PTA. Although the systems and methods have been illustrated and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. Thus, the breadth and scope of the disclosure herein should not be limited by any of the above descriptions. Rather, the scope of the invention should be defined in accordance with the following claims and their equivalents. | 30,057 |
11862841 | DETAILED DESCRIPTION Generally speaking, the mechanisms of this disclosure improve accessibility to, and simplify maintenance of, electronic devices installed outdoors. The techniques of this disclosure are particularly useful in application to wireless routers installed on exterior structures (especially utility poles) and powered by solar panels. As discussed below, an example solar-powered electronic system of the present disclosure include several mechanisms that allow for one person to set up and replace electronic modules. Additionally, the solar-powered electronic system is designed to withstand rain, dust, sand, and (in some cases) submersion. FIG.1is a perspective view of a solar-powered electronic system100in accordance with the present disclosure. The solar-powered electronic system100includes a mount102, a tube104, and a solar panel106having a proximal end107aand a distal end107b. As shown, the solar-powered electronic system100is mounted to a utility pole108; however, the solar-powered electronic system100in other situations can be mounted on lamp posts, trees, etc. The mount102includes a pair of hose clamps or steel banding to secure the mount102to the utility pole108. Additionally, in other examples, the solar-powered electronic system100is mounted onto other surfaces such as buildings and other infrastructure, or even vehicles. In such examples, bolts can pass through mount102into a flat surface to secure the mount102to the building or other infrastructure. Additionally, both the tube104and the solar panel106are both disposed on the mount102. FIGS.2and3are alternative views of the solar-powered electronic system100ofFIG.1in accordance with the present disclosure. The mount102ofFIGS.1and2includes a mounting clamp204controlled by a clamping knob206. The mounting clamp204and clamping knob206(discussed in greater detail below) secure the tube104in the mount102. The mount102includes an opening208that is generally semi-circular. As a result, in operation, the mounting clamp204closes off the opening208and also secures the tube104to an upper end of the mount102. In some examples, the mount102includes an additional mounting feature220. The mounting feature220can include various slots and connections to attach modules to the mount102. These modules can further increase the modularity of the solar-powered electronic system100. Additionally, the solar-powered electronic system100includes a power connection230disposed on mounting bracket1010(discussed in greater detail in connection withFIG.10) can facilitate power connections between the solar panel106and the mount102and/or modules disposed on the mounting feature220. FIG.4is a perspective view of the tube104ofFIG.1. In some examples, the tube104is an aluminum tube, but generally the tube104can be manufactured using various materials. In preferential alternatives, the tube104is made of material with a high thermal conductivity. The tube104includes a first end402having a first key403and a second end404having a second key405. As shown inFIG.4, the tube104includes windows410disposed proximate the first end402. In some examples, the tube104further includes windows412disposed on the second end404. The tube104also includes a non-metallic cover414disposed over the windows410. The non-metallic cover414seals the window from exterior environment. In some examples, the non-metallic cover414is transparent such that numerous electromagnetic waves can pass through the non-metallic cover414(e.g., optical electromagnetic waves, radio waves, etc.). For example, the non-metallic could be a transparent polycarbonate. In other examples, the non-metallic cover414is not transparent to some electromagnetic waves (e.g., optical electromagnetic waves) but still transparent to other electromagnetic waves (e.g., radio waves). FIG.5is a side view of an enclosed wireless router500or electronic module configured for use with the solar-powered electronic system ofFIG.1. The enclosed wireless router500includes the tube104ofFIG.4, a first cap502disposed adjacent the first end402of the tube104, and a second cap504disposed adjacent the second end404. The first cap502includes a cam510connected to a shaft514. The cam510can be actuated between a first position and a second position to actuate the shaft514. The shaft514passes through the tube104along the longitudinal axis of the tube104, and terminates at the second cap504. For example, the shaft514terminates at a nut518disposed on the second cap504. The shaft514is discussed in greater detail in connection withFIGS.6and7. FIG.6is a side view of the enclosed wireless router500configured for use with the solar-powered electronic system ofFIG.1andFIG.2. The enclosed wireless router500includes a first seal assembly602, a second seal assembly604, and an electronics module606. As shown, the first seal assembly602is disposed adjacent to the first cap502and the second seal assembly604is disposed adjacent to the second cap504. In some examples, the seal assembly is integral with the corresponding cap or disposed within the corresponding cap. As shown, the first seal assembly602and the second seal assembly604define radial seals including a sealing ring610disposed between and a first beveled plate612and a second beveled plate614. In some examples, the sealing ring610is a silicone ring. In other examples, the sealing ring610is made of another gasket material. Additionally, the sealing ring610includes a triangular cross-sectional shape. In some examples, the sealing ring610has different cross sectional shapes such as circular, quadrilateral, pentagonal, etc. As a result, movement of the second beveled plate614towards the first beveled plate612displaces the sealing ring610radially outward. The shape of the sealing ring610cooperates with the first beveled plate612and the second beveled plate614to displace the sealing ring610radially outward. The first beveled plate612is movable relative to the second beveled plate614. When disposed within the tube104, the first seal assembly602and the second seal assembly604seals the tube104from the external environment. In some examples, the first seal assembly602and the second seal assembly604cause the tube104to be airtight (i.e., inhibit the movement of gas into or out of the tube104). The first cap502includes the cam510. As shown inFIG.6, the cam510is in a first position. In the first position, the first beveled plate612and the second beveled plate614are pressed together to displace the sealing ring610outward in a sealing position. In a second position, the cam510causes the first beveled plate612and the second beveled plate614to separate and no longer displace the sealing ring610outward. In some examples, the cam510is perpendicular with the longitudinal axis in the first position and parallel with the longitudinal axis in the second position. As shown inFIGS.6and7, the first cap502includes first antennas622and the second cap504includes second antennas624. Additionally, the first cap502and the second cap504are connected by the shaft626. The first cap502, the first antennas622, the second cap504, the second antennas624, and the shaft626comprise the electronics module606. The electronics module606is pivotably and axially movable relative to the tube104, but in some examples, the electronics module is only axially movable relative to the tube104. Additionally, in accordance with the present disclosure, the electronics module606is configured to position at least one of the antennas adjacent to one of the windows (e.g., windows410or windows412). Permanently-placed antennas would require long, flexible cables when attached to a moving electronics module. This window and alignment system keeps the antennas mounted to the same structure as the electronics for short, potentially rigid low-loss antenna cables. As shown inFIGS.6and7, the electronic module606additionally includes various batteries630, circuits, and a heat sink632(discussed in greater detail inFIGS.19and20). The various circuits included in the electronic module606are provided to support the wireless and radiofrequency operations of the solar-powered electronic system100. The various electronic components of the electronic module606are connected to the shaft514and move concurrently with the shaft and electronic module606. The various electronic components of the electronic module606can be adapted for quickly replacing with updated technology. FIGS.8and9are a cross-sectional view of the enclosed wireless router500including a quick-release waterproof seal. A cam-actuated seal allows for immediate, one-handed, opening and closing of the device for modification or repair, while maintaining a waterproof tube. The waterproof tube in some implementations can conform to IP68 requirements. Antennas are affixed to the same internal mount as the electronics and batteries. This entire mount is slid in and out of place. When the internal capsule is fully slid into place, an orientation key on either end locks into the correct orientation. This lines the internal antennas up with cutouts in the aluminum, which have polycarbonate “windows” keeping them waterproof while radio frequency (RF) transparent. In some examples, the tube104includes a first key403and a second key404. The first key403is configured to correspond with the first cap502. As a result, the first key403causes the electronic module606to be aligned with the windows410(shown inFIG.4). Additionally, the tube104can include a second key405configured to correspond with the second cap504. Additionally, in some examples, both the first key403and the second key404are configured to align both the first cap502and the second cap504simultaneously. As a result, electronics (e.g., antennas) disposed on the first cap502and the second cap504can be automatically aligned with windows410and412automatically. FIG.10is a perspective view of the mount102ofFIG.1in accordance with the present disclosure. The mount102includes a mounting panel1010, a gear1012, and a gear shaft1014. As shown inFIG.10, the mounting panel1010includes a proximal end1020, adjacent the mount102and a distal end1022opposite the proximal end1020. The mounting panel1010is secured to the solar panel106via fasteners such as screws or bolts on both the proximal end1020and the distal end1022. The mounting panel is rotationally coupled, relative the mount102, to an axle1024. The axle1024is positioned such that the mounting panel1010is gravity biased to rotate. As shown inFIG.10, the distal end1022of the mounting panel1010is gravity biased to rotate downward, towards the mount102. Additionally, the mounting panel1010is configured to couple with a solar panel, which is also biased to rotate with the mounting panel101. The mounting panel1010provides a flexible solution capable of tolerating higher wind speeds than rigidly mounted solar panels. Additionally, the edge1040of the mount102may include a flexible polymer cover. The flexible polymer cover can bend under pressure to help secure the tube104in the mount, inhibiting the tube104from vibrating under constantly changing wind forces. The mounting panel1010also includes a tensioned variable ribbon1028configured to adjust the angular position of the mounting panel. As shown, the tensioned variable ribbon1028is mechanically coupled to the proximal end1020of the mounting panel1010. As a result, the tensioned variable ribbon1028counteracts the gravity biased rotation of the mounting panel1010. The mount102further includes the gear1012adapted to adjust the tensioned variable ribbon1028and configured to translate between a first position, a second position, and a third position. The gear1012is centrally disposed on the mount in the first position, as shown inFIG.10. The second position and the third position are disposed on either side of the first position. As shown inFIG.10, the tensioned variable ribbon1028includes a plurality of apertures configured to receive the teeth of the gear1012. Additionally, the gear1012is mechanically coupled with a gear shaft1014. Both the gear1012and the gear shaft1014are configured to translate together from the first position to the second position or the third position. Additionally, rotating the gear shaft1014cause the gear1012to rotate. Rotation of the gear1012causes the tensioned variable ribbon1028to translate vertically. As a result, the mounting plate1010pivots about the axle1024. The mount102additionally includes a spring1030adapted to bias the gear1012from the second position to the first position or the third position to the first position. As a result, the gear1012and the gear shaft1014are disposed in the first position as shown inFIG.10, unless actuated by a user against the force exerted by the spring1030. In some examples, the mount102includes pins1042on either side of the variable ribbon1028that inhibit the variable ribbon1028from pivoting to either side of the mount102. Additionally, the variable ribbon1028may include tabs1046(shown in greater detail inFIG.24B) configured to inhibit the unintentional separation of the variable ribbon1028from the mount102. Specifically, when the gear1012is in either the second or third position, the teeth of the gear1012will catch on one of the tabs1046instead of permitting the variable ribbon from disconnecting from the mount102. The gear shaft1014includes a hex bushing (not shown) and the mount102includes a hex socket configured to receive the hex bushing. When the gear shaft1014is disposed in the first position, the hex bushing is disposed in the hex socket. As a result, the gear shaft1014is locked and cannot be rotated when in the first position. Accordingly, the tensioned variable ribbon1028is also locked and the mounting bracket1010is inhibited from pivoting about the axle1024when the gear shaft1014is disposed in the first position. Other similar locking mechanisms are considered within the scope of this disclosure. FIGS.11and12are a perspective view of a single-hand actuated solar angle set system1100in a first and second position in accordance with the present disclosure. As illustrated, the mount102and various other elements are shown as partially cut away. As shown inFIG.11, the gear1012and the gear shaft1014are disposed in a first, locked position. In contrast,FIG.12shows the gear1012and the gear shaft1014disposed in a second, unlocked position in which the gear can be rotated and actuate the tensioned variable ribbon1028. As shown, the gear shaft1014includes a button1102on either end of the gear shaft1014and a gear1012disposed centrally on the gear shaft1014. The gear shaft1014also passes through panels1104of the hub102. The gear shaft1014includes a hex bushing1110corresponding to a hex socket1112disposed in the panels1104of the hub102. As a result, as shown inFIG.11, the hex bushing1110is disposed in the hex socket1112and the gear shaft1014is inhibited from rotating. In contrast, as shown inFIG.12, the gear shaft1014is pushed or pulled via the button1102, moving the gear shaft1014from the first position to the second position. As a result, the hex bushing1110is no longer disposed in the hex socket1112and the gear shaft1014is free to rotate and actuate the tensioned variable ribbon1028. FIGS.13,14, and15are perspective views of the solar panel quick-lock apparatus1300in accordance with the present disclosure. The solar panel quick-lock apparatus1300includes the mounting bracket1010and a locking paddle1302. The mounting bracket1010includes a top surface1310, a first panel1312, and a third panel1314. The first panel1312and the third panel1314include a first slot1316and an aperture1318. The slot1316is configured to receive an axle. The locking paddle1302includes a push surface1320, a second panel1322, and a fourth panel1324. The locking paddle1302also includes a slot1326and an aperture (not shown). As shown, the aperture1318aligns with the aperture of the locking paddle1302such that the mounting bracket1010and the locking paddle1302are pivotable relative to each other. In operation, the first panel1312, including the first slot1316, is configured to receive the axle1024(illustrated inFIGS.10and14) and the first aperture1318disposed adjacent the slot. The second panel1322, pivotable relative to the first panel1312, includes the second slot1326configured to receive the axle1024and a second aperture disposed adjacent to the slot. The second panel1322is pivotable, relative to the first panel1312, between a first position (shown inFIGS.13and14) and a second position (shown inFIG.15). The solar panel quick-lock apparatus1300also includes a pivoting axle (not shown) passing through the first aperture1318and the second aperture of the second panel1322. As shown inFIG.14, the axle1024can be disposed in the first slot1316but not disposed in the second slot1326. But, as shown inFIG.15, when the locking paddle1302is pivoted into the second position, the second slot1326receives the axle1024. The second slot1326in the second position is both aligned with the first slot1316, yet disposed at an angle relative to the first slot1316, thereby closing the first slot1316. The axle1024disposed in both the first slot1316and the second slot1326is locked in place. The push surface1320is disposed on the underside of the solar panel106such that a user can actuate the push surface1320while holding the solar panel on the proximal end107a. FIGS.16and17are a side view of the clamping system1600, in accordance with the present disclosure. The clamping system1600includes a static cradle1602having a tubular slot1604, the mounting clamp204, and an adjustment mechanism1608. The clamping system1600allows a device to be dropped into place and then tightened to the installed mount with a knob and without additional support. Without this, the mounting structure might require multiple people or preassembly. The clamping system1600includes a static cradle1602configured to receive the tube104. After the tube104is lowered into the static cradle1602, the knob on the bottom can be twisted to lift up the far edge of the clamp and lock the enclosure into place. The knob is able to create tension via a sliding T-nut which fits into a slot in the clamp metal, and a compression spring pushing the clamp open. As used in the clamping system1600, the T-nut does not rotate along with the knob, but rather, as the knob rotates the tension is increased as shown inFIGS.16and17. The static cradle1602defines the tubular slot1604having an upper portion1610and a lower portion1612. The mounting clamp204includes a pivotable clamp1606disposed in the lower portion1612of the static cradle1602and pivotable about an axle1616between a first, open position (shown inFIG.16) and a second, secured position (shown inFIG.17). The lower portion1612also includes the adjustment mechanism1608to pivot the pivotable clamp1606from the first position to the second position. The adjustment mechanism1608includes a knob1620, a nut1622, a shaft1624, and a spring1626. Actuating the knob1620causes the nut1622to move along the shaft1624of the actuating mechanism1608. In one example, rotating the knob1620causes the nut1622to move against the spring1626. In such an example, the shaft1624includes a screw mechanism to control the position of the nut1622as the spring1626pushes against the nut1622. The shaft1624may pass through the pivotable clamp1606while the nut1622is too large to pass through the pivotable clamp1606. As a result, when the nut1622is actuated down towards the actuating mechanism1620, the nut1622contacts the pivotable clamp1606and causes the pivotable clamp to pivot about the axle1616. As shown inFIG.16, the pivotable clamp1606is pivoted such that the tube104can be inserted into the tubular slot1604. However, when the pivotable clamp1606is pivoted into the closed position, the tube104is pushed against the upper portion1610, securing the tube in the tubular slot. In some examples, the pivotable clamp1606includes a silicone edge or cover to improve the clamping effect between the pivotable clamp1606and the tube104. Additionally, the pivotable clamp1606secures the tube104in the static cradle1602because the pivotable clamp1606in the second position encloses a portion of the tubular slot1604. FIG.18is a perspective view of the mount102and tube104in accordance with the present disclosure. As shown, the tube104is secured in the mount102because the pivotable clamp1606is disposed in the second position, securing the tube104within the tubular slot1604. FIGS.19and20are perspective views of a sliding heat spreader2000in accordance with the present disclosure. Because the tube104is designed to be waterproof, the sliding heat spreader2000is configured to conduct heat to the outside while not inhibiting movement for assembly and disassembly. Springs continually push the heat spreader against the outer casing for a continuous and dynamic thermal connection. The springs push the heat spreader into the roof of the cylinder with enough force to achieve the necessary thermal conductivity without compromising the ability to shift the electronic module back and forth inside of the tube. As a result, no forced air or liquid cooling is necessary to cool the electronic module. As shown inFIG.1, the tube104is disposed in the shade of the solar panel106when the solar panel106is oriented toward the sun, and the shade of the solar panel106improves the cooling of the tube104and the heat spreader2000. The heat spreader2000includes a heat sink2002and a biasing member2004(e.g., a spring). The biasing member2004is disposed between the heat sink2002and the shaft514. The heat sink2002is made of a thermally conductive material, such as a metallic material. Further, the heat sink2002matches the curvature of the inner radius of the tube104. The heat spreader further includes a rim2006. The rim2006facilitates insertion of the heat sink2002into the tube104. To this end, the rim2006is configured to be inserted into the tube104first. The angle of the rim2006causes the heat sink2002and the biasing member2004to depress when being inserted into the tube104. In various other examples, the rim2006can be rounded. In various embodiments, the heat spreader2000may include a circuit board2020and fasteners2022,2024. As shown, the circuit board2020can be fastened to the biasing member2004via the fasteners2022. As a result, the circuit board2020in some implementations is structurally rigid enough to withstand the stresses and forces exerted by the biasing member2004. Additionally, the circuit board2020can be fastened to the heat sink2002via fasteners2024. Alternatively, the circuit board2020can be fastened to the heat sink2002and/or the biasing member2004via a different securing mechanism, such as an adhesive. As described, the solar-powered electronic system includes electronics and antennas for operation as a wireless router. However, the solar-powered electronic system is not limited to wireless routers. In some examples, the solar-powered electronic system could be used in other industries such as remote weather stations, remote utility computer systems, electrical system infrastructure, etc. Additionally, as shown the solar-powered electronic system can include alternative power source systems such as a wind-powered generator. As a result, the solar-powered electronic system can be used in a variety of outdoor electronic systems to provide an easily mounted, self-powered, and sealed electronic system. | 23,527 |
11862842 | DESCRIPTION OF THE EMBODIMENTS The usages of “approximately,” “similar to,” “essentially,” or “substantially” indicated throughout the specification include the indicated value and an average value having an acceptable deviation range, which is a certain value confirmed by people skilled in the art, and is a certain amount considered the discussed measurement and measurement-related deviation (i.e., the limitation of measurement system). For example, “approximately” may indicate to be within one or more standard deviations of the indicated value, such as being within ±30%, ±20%, ±15%, ±10%, or ±5%. Furthermore, the usages of “approximately,” “similar to,” “essentially,” or “substantially” indicated throughout the specification may refer to a more acceptable deviation scope or standard deviation depending on measurement properties, cutting properties, or other properties, and all properties may not be applied with one standard deviation. In the drawings, for clarity, the thickness of layers, films, plates, areas, and the like are magnified. It should be understood that when an element such as a layer, a film, an area, or a substrate is indicated to be “on” another element or “connected to” another element, it may be directly on another element or connected to another element, or an element in the middle may exist. In contrast, when an element is indicated to be “directly on another element” or “directly connected to” another element, an element in the middle does not exist. As used herein, “to connect” may indicate to physically and/or electrically connect. Furthermore, “electrically connected” may also be used when other elements exist between two elements. Moreover, relative terms such as “below” or “bottom” and “above” or “top” may serve to describe the relation between one element and another element in the text according to the illustration of the drawings. It should also be understood that the relative terms are intended to include different orientations of a device in addition to the orientation shown in the drawings. For example, if a device in the accompanying drawings is flipped, an element described as being on the “lower” side of other elements shall be re-orientated to be on the “upper” side of other elements. Thus, the exemplary term “lower” may cover the orientations of “upper” and “lower,” depending on the specific orientations of the accompanying drawings. Similarly, if a device in the accompanying drawings is flipped, an element described as being “below” other elements shall be re-orientated to be “above” other elements. Thus, the exemplary term “above” or “below” may cover the orientations of above and below. Exemplary embodiments are described with cross-sectional views of schematic illustrations of ideal embodiments. Thus, shape alterations as a result of, for example, manufacturing techniques and/or tolerances can be expected, and the illustrated regions of the embodiments described herein should not be construed to particular shapes but include shape deviations due to, for example, manufacturing. For example, regions shown or described as being flat may generally have rough and/or non-linear features. Furthermore, the acute angles shown may be round. Therefore, the regions illustrated in the drawings are only schematic representations and are not intended to illustrate the exact shapes of the regions or to limit the scope of the claims. References of the exemplary embodiments of the disclosure are to be made in detail. Examples of the exemplary embodiments are illustrated in the drawings. If applicable, the same reference numerals in the drawings and the descriptions indicate the same or similar parts. FIG.1is a schematic view of a display apparatus according to one embodiment of the disclosure.FIG.2is a schematic cross-sectional view of the display apparatus ofFIG.1.FIG.3is an enlarged top view of a partial area of the display apparatus ofFIG.1.FIG.4is an enlarged schematic view of antenna electrodes and a dummy electrode in a partial area I ofFIG.3.FIG.5is a schematic top view of a reflection layer ofFIG.2.FIG.6is a line chart of the radiation efficiency of the antenna electrode of the disclosure to the pitch-spacing ratio of the dummy electrode in a direction X.FIG.7is a schematic top view of antenna electrodes and a dummy electrode according to another embodiment of the disclosure.FIG.8is a schematic top view of antenna electrodes and a dummy electrode according to still another embodiment of the disclosure.FIG.9is a line chart of the radiation efficiency of the antenna electrode of the disclosure to opening widths of breaks of dummy wire segments. For clarity,FIG.1omits a backlight module BLU inFIG.2, andFIG.3only illustrates a substrate205and a conductive layer CL of an antenna module200as well as a transmission line323and a ground electrode325of a circuit flexible board320ofFIG.1. With reference toFIG.1andFIG.2, a display apparatus10includes a display panel100, the antenna module200, and a circuit board300. The display panel100has a display area DA. The antenna module200is disposed on the display panel100. The circuit board300is disposed on the side of the display panel100away from the antenna module200. In this embodiment, the display panel100may be a liquid crystal display panel. For example, the liquid crystal display panel includes a first substrate101, a second substrate102, a liquid crystal layer LCL, a pixel driving layer, and a light-shielding pattern layer BM, but the disclosure is not limited thereto. The liquid crystal layer LCL is disposed between the first substrate101and the second substrate102. The pixel driving layer is disposed on the first substrate101and is located between the first substrate101and the liquid crystal layer LCL. The pixel driving layer includes, for example, multiple data lines DL, multiple scanning lines SL, and multiple pixel structures. For example, the scanning lines SL may be arranged along the direction X and extend in a direction Y, and the data lines DL may be arranged along the direction Y and extend in the direction X, which means the data lines DL intersect the scanning lines SL and define multiple pixel areas PXA. These pixel structures are respectively disposed in correspondence to the pixel areas PXA. The pixel structures have active elements (not shown) electrically connected to each other and pixel electrodes PE. The active elements are also respectively electrically connected to one corresponding data line DL and one corresponding scanning line SL. The pixel electrodes PE are disposed in the pixel areas PXA. To ensure electrical independence between these components, an insulation layer110is disposed between the scanning lines SL and the data lines DL, and an insulation layer120(or a flat layer) may be disposed between the data lines DL and the pixel electrodes PE. It should be noted that in other embodiments, the numbers of insulation layers and flat layers included in the pixel driving layer may be adjusted according to the actual circuit design, and the disclosure is not limited to the content disclosed in the drawings. The light-shielding pattern layer BM is disposed in correspondence to the data lines DL and the scanning lines SL, which means the light-shielding pattern layer BM may also define the aforementioned pixel areas PXA. In this embodiment, the second substrate102is further disposed with a color filter layer130. The color filter layer130includes, for example, multiple color filter patterns (not shown) disposed in correspondence to the pixel areas PXA, and these color filter patterns are adapted to allow light of different colors to pass through to achieve the effect of color display. Since the display panel100of the embodiment is a non-self-luminous display panel, the backlight module BLU is also disposed between the display panel100and the circuit board300. This backlight module BLU is configured to provide multiple illumination beams. Since the backlight module BLU of this embodiment may be a backlight module in any form well known to those skilled in the display technology field, the relevant details are not described herein. In order to allow the pixel structures in each pixel area PXA to respectively control the intensity of light after the illumination beams pass through the display panel100to achieve the display effect, the display panel100further includes two polarizing plates POL1and POL2respectively disposed on the first substrate101and the second substrate102, and the axial directions of the penetration shafts of the two polarizing plates POL1and POL2may be configured according to the operation mode of the liquid crystal layer LCL. It should be noted that the disclosure does not limit the types of the liquid crystal display panel. For example, the display panel100of this embodiment may be a vertical alignment (VA) liquid crystal display panel, an in-plane switching (IPS) liquid crystal display panel, a multidomain vertical alignment (MVA) liquid crystal display panel, a twisted nematic (TN) liquid crystal display panel, a super twisted nematic (STN) liquid crystal display panel, a patterned vertical alignment (PVA) liquid crystal display panel, a fringe field switching (FFS) liquid crystal display panel, or an optically compensated birefringence (OCB) liquid crystal display panel, but the disclosure is not limited thereto. Furthermore, the antenna module200includes a substrate205, an antenna electrode210, a feed line215, a ground electrode220, and a dummy electrode230. The antenna electrode210, the feed line215, the ground electrode220, and the dummy electrode230belong to the conductive layer CL, and the conductive layer CL is disposed on a lateral surface of the substrate205away from the display panel100. The material of the substrate205includes, for example, glass or a light-transmitting polymer material (such as polymethyl methacrylate (PMMA), polycarbonate (PC), or polyimide (PI)). In this embodiment, the antenna module200may include multiple antenna electrodes210and multiple feed lines215, and these antenna electrodes210may be arranged in an antenna array, such as being arranged in a one-dimensional antenna array along the direction X. It should be noted that if each antenna electrode210is used with a phase shifter, the antenna array may adjust the direction of electromagnetic waves in transmission or reception function on the XZ plane, but the disclosure is not limited thereto. In another embodiment not shown, the antenna electrodes210disposed in the display area DA may also be respectively arranged in multiple columns and multiple rows along the direction X and the direction Y to form a two-dimensional antenna array. The two-dimensional antenna array may adjust the direction of electromagnetic waves in transmission or reception function on the XZ plane and/or the YZ plane. In this embodiment, the feeding lines215extend into the display area DA from a side edge area (i.e., a peripheral area PA) of the substrate205and respectively electrically connect the antenna electrodes210. The ground electrode220is disposed between the feed lines215. For example, the feeding lines215and the ground electrode220may form a coplanar waveguide and serve as a transmission structure for electromagnetic wave signals. On the other hand, the antenna module200may transmit electromagnetic waves of the receiving signals to the circuit board300or receive the electromagnetic waves of the transmitting signals from the circuit board300through the circuit flexible board320, and the circuit board300is disposed with, for example, multiple control chips315of radio frequency (RF) antennas. With reference toFIG.3together, the circuit flexible board320may include a flexible substrate321, multiple transmission lines323, and the ground electrode325. For example, the circuit flexible board320may be bonded to the side edge area of the substrate205of the antenna module200where the feed lines215are disposed for the transmission lines323to be respectively electrically connected to the feed lines215and for the ground electrode325to be electrically connected to the ground electrode220on the substrate205, but the disclosure is not limited thereto. In order to reduce the visibility of the antenna electrodes210in the display area DA, the dummy electrode230overlapping the display area DA along a direction Z is disposed around the antenna electrodes210and is electrically separated from the antenna electrodes210. More specifically, the areas in the display area DA of the display panel100without the antenna electrodes210are disposed with the dummy electrode230to increase the concealment of the antenna electrodes210. In order to increase the radiation efficiency of the antenna electrodes210, the dummy electrode230may have a floating potential, which means the dummy electrode230is electrically independent of any power supply or any conductor at a fixed potential. With reference toFIG.4together, the antenna electrode210has multiple wire segments211and multiple wire segments213intersecting each other and forming multiple meshes. In other words, the antenna electrode210is a mesh electrode structure. Similarly, the dummy electrode230is substantially a mesh electrode structure as well, such as being formed by multiple dummy wire segments231and multiple dummy wire segments233whose extension directions intersect each other. It should be noted that unlike the antenna electrode210, the dummy wire segments of the dummy electrode230may have multiple breaks230cto reduce the electrical coupling effect between the antenna electrode210and the dummy electrode230, so as to further enhance the electromagnetic wave radiation efficiency of the antenna electrode210. In detail, the wire segments211or the wire segments213of the antenna electrode210are arranged along the direction X, with their extension directions intersecting each other in the direction X and the direction Y. Every two adjacent wire segments211or wire segments213have a spacing S1xin the direction X (i.e., the width of the mesh in the direction X) and have a spacing S1yin the direction Y (i.e., the width of the mesh in the direction Y). Similarly, the dummy wire segments231or the dummy wire segments233of the dummy electrode230are arranged along the direction X, with their extension directions intersecting each other in the direction X and the direction Y. Every two adjacent dummy wire segments231or dummy wire segments233have a spacing S2xin the direction X and have a spacing S2yin the direction Y. For example, in this embodiment, the spacing S1xof the wire segments211(or the wire segments213) of the antenna electrode210in the direction X may be selectively equal to the spacing S2xof the dummy wire segments231(or the dummy wire segments233) of the dummy electrode230in the direction X, and the spacing Sly of the wire segments211(or the wire segments213) of the antenna electrode210in the direction Y may be selectively equal to the spacing S2yof the dummy wire segments231(or the dummy wire segment233) of the dummy electrode230in the direction Y, but the disclosure is not limited thereto. On the other hand, in this embodiment, a linewidth LW1of the wire segments of the antenna electrode210may also be selectively equal to a linewidth LW2of the dummy wire segments of the dummy electrode230, but the disclosure is not limited thereto. It should be noted that the break230cof the dummy electrode230of this embodiment is disposed at the intersection between the extension direction of the dummy wire segment231and the extension direction of the dummy wire segment233. In detail, every two adjacent breaks230carranged along the direction X have a pitch Px, and every two adjacent breaks230carranged along the direction Y have a pitch Py. In order to obtain better electromagnetic wave radiation efficiency, the ratio of the pitch Px to the spacing S2xmay be less than or equal to 1.25, and the ratio of the pitch Py to the spacing S2ymay be less than or equal to 1.25. For example, in this embodiment, the ratio of the pitch Px to the spacing S2xis equal to 1, and the ratio of the pitch Py to the spacing S2yis equal to 1. In this way, the radiation efficiency of the antenna module200of this embodiment may reach more than 40% (as shown inFIG.6). With reference toFIG.7, in another embodiment, multiple breaks230c-A of a dummy electrode230A are disposed away from the multiple intersections of multiple dummy wire segments231A and multiple dummy wire segments233A. More specifically, for these breaks230c-A, the ratio of a pitch Px-A in the direction X to the spacing S2xis 0.5, and the ratio of a pitch Py-A in the direction Y to the spacing S2yis 0.5. In this way, compared with the dummy electrode230ofFIG.4, the dummy electrode230A ofFIG.7may further increase the electromagnetic wave radiation efficiency of the antenna module to reach more than 45% (as shown inFIG.6). With reference toFIG.8, in another embodiment, although multiple breaks230c-B of a dummy electrode230B are disposed at multiple intersections of multiple dummy wire segments231B and multiple dummy wire segments233B like the breaks230cofFIG.4, the overall number of the breaks230c-B is relatively small. More specifically, in the embodiment ofFIG.8, the dummy electrode230B has multiple break areas respectively extending in the direction X and the direction Y and intersecting each other, and the breaks230c-B are disposed in these break areas. The ratio of a pitch Px-B of the break areas extending in the direction Y and arranged along the direction X to the spacing S2xis 4, and the ratio of a pitch Py-B of the break areas extending in the direction X and arranged along the direction Y to the spacing S2yis 2. As shown inFIG.6, the effect of improving the radiation efficiency of the antenna electrode210by the dummy electrode230B ofFIG.8is less than that of the dummy electrode230ofFIG.4and the dummy electrode230A ofFIG.7. From another point of view, since the dummy electrode is disposed with the breaks, the distance between the dummy electrode and the antenna electrodes may be reduced, which may further reduce the visibility of the antenna electrodes210in the display area DA, and may also ensure the electromagnetic wave radiation efficiency of the antenna electrodes. With reference toFIG.4andFIG.9, on the other hand, the break230cof the dummy electrode230has an opening width W in the direction Y. Preferably, the opening width W is greater than or equal to 7.5 micrometers and less than or equal to 25 micrometers. When the opening width W is less than 7.5 micrometers, the radiation efficiency of the antenna electrode210is lower than 40%. For example, when the opening width W is 3 micrometers, the radiation efficiency is even lower than 12%. When the opening width W is greater than 25 micrometers, the visibility of the breaks in the display area is significantly increased. According toFIG.6andFIG.9, the relatively dense distribution of the breaks of the dummy electrode or the greater opening width of the breaks may improve the radiation efficiency of the antenna electrode. With reference toFIG.2andFIG.5, in order to adjust the radiation field type of electromagnetic waves to improve the utilization efficiency of radiation power, the antenna module200is further disposed with a reflection layer250on a lateral surface of the substrate205away from the antenna electrodes210, and the reflection layer250overlaps the antenna electrodes210along the direction Z. Since the reflection layer250is disposed to reflect electromagnetic waves, a thickness T thereof along the direction Z is greater than 1πfμrμ0σ, where f is the minimum frequency in the electromagnetic wave operating frequency band of the antenna module200, μris the relative permeability of the reflection layer250, μ0is the vacuum permeability, and σ is the conductivity of the reflection layer250. For example, in this embodiment, the reflection layer250may be made of a metal material, such as copper or other metals with suitable conductivity. Since the reflection layer250is disposed in the display area DA in correspondence to the antenna electrodes210, the reflection layer250may also have a mesh configuration to reduce the optical transmittance loss of the display panel100. In other words, the reflection layer250may have multiple wire segments251and multiple wire segments253, and the wire segments251intersect the wire segments253and define multiple meshes. In this embodiment, the reflection layer250may have a ground potential. Other embodiments are described below to explain the disclosure in detail, and the same components will be denoted by the same reference numerals, and the description of the same technical content will be omitted. For the description of the omitted part, reference may be made to the above embodiment, and details are not described in the following embodiments. FIG.10is a schematic top view of antenna electrodes and a dummy electrode according to still another embodiment of the disclosure. With reference toFIG.10, a dummy electrode230D of this embodiment and the dummy electrode230ofFIG.4are different in the linewidth of the dummy wire segments. Specifically, in this embodiment, a linewidth LW2″ of the dummy wire segments231D and the dummy wire segments233D of the dummy electrode230D may be greater than the linewidth LW1of the wire segments of the antenna electrode210. Since the spacing S1xof the wire segments211(or the wire segments213) of the antenna electrode210in the direction X is equal to the spacing S2xof the dummy wire segments231D (or the dummy wire segments233D) of the dummy electrode230D in the direction X, and the spacing S1yof the wire segments211(or the wire segments213) of the antenna electrode210in the direction Y is equal to the spacing S2yof the dummy wire segments231D (or the dummy wire segments233D) of the dummy electrode230D in the direction Y, then the breaks230cdisposed with the dummy electrode230D cause a substantial difference in brightness after light passes through the dummy electrode230D and the antenna electrode210, resulting in an increase in the visibility of the antenna electrode (or the dummy electrode) and a decrease in display quality. Therefore, increasing the linewidth LW2″ of the dummy wire segments of the dummy electrode230D may compensate the change in transmittance of the dummy electrode230D due to the breaks230c, so that the difference in transmittance of light between the antenna electrode210and the dummy electrode230D may be increased, and the concealment of the antenna electrode210may thus be improved. For example, when the mesh widths of the antenna electrode210in the direction X and the direction Y (i.e., the spacing S1xand the spacing Sly) are 120 micrometers and 240 micrometers respectively, if the opening width W of the break230cis increased from 10 micrometers to 20 micrometers, then increasing the linewidth LW2″ of the dummy wire segment from 3.5 micrometers to 4.08 micrometers may maintain the concealment of the antenna electrode210. However, the disclosure is not limited to the above. In other embodiments, if the opening width of the dummy electrode increases, adjusting the arrangement spacing of the wire segment of the antenna electrode (i.e., the width of the mesh in the direction X or the direction Y) may compensate the change in transmittance of the dummy electrode due to the increase in the opening width of the breaks. In other words, the arrangement spacing of the wire segments of the antenna electrode in a direction may be different from the arrangement spacing of the dummy wire segments of the dummy electrode in the same direction. For example, if the opening width W of the break portion230cinFIG.10is increased from 10 micrometers to 20 micrometers, increasing the spacing S1xof the wire segment of the antenna electrode210from 120.21 micrometers to 120.85 micrometers may also maintain the concealment of the antenna electrode210. FIG.11is a schematic cross-sectional view of a display apparatus according to another embodiment of the disclosure.FIG.12is a schematic top view of the display apparatus ofFIG.11. With reference toFIG.11andFIG.12, a display device20of this embodiment and the display device10ofFIG.2is different in that an antenna module200A of the display device20is disposed with, instead of the reflection layer250ofFIG.2, a metal mesh structure formed by the data lines DL and the scanning lines SL in the display panel100as a reflection layer for electromagnetic waves. It should be noted that since the reflection layer of this embodiment is disposed in the display panel100, each layer in the display panel100between the data lines DL (or the scanning lines SL) and the antenna module200A (e.g., the polarizing plate POL2, the second substrate102, the color filter layer130, the insulation layer, and the liquid crystal layer LCL) are required to have the designed effective dielectric constant and dielectric loss so as to reduce the energy loss of electromagnetic waves passing through these layers. In summary, in the display device of an embodiment of the disclosure, the dummy electrode disposed around the antenna electrodes has the dummy wire segments intersecting each other and at least partially disconnected. Therefore, the electrical coupling effect between the antenna electrodes and the dummy electrode may be effectively reduced, thereby improving the electromagnetic wave radiation efficiency of the antenna electrodes. In the antenna module of an embodiment of the disclosure, the visibility of the antenna electrodes may be effectively reduced by having different linewidths or arrangement spacings of the dummy wire segments of the dummy electrode and the wire segments of the antenna electrodes. | 25,890 |
11862843 | DETAILED DESCRIPTION The following description provides detail of various embodiments of the invention, one or more examples of which are set forth below. Each of these embodiments are provided by way of explanation of the invention, and not intended to be a limitation of the invention. Further, those skilled in the art will appreciate that various modifications and variations may be made in the present invention without departing from the scope or spirit of the invention. By way of example, those skilled in the art will recognize that features illustrated or described as part of one embodiment, may be used in another embodiment to yield a still further embodiment. Thus, it is intended that the present invention also cover such modifications and variations that come within the scope of the appended claims and their equivalents. The underground sensor mount and telemetry device10of the present invention is particularly well suited for remote transmission of field condition data or information to a remote collecting unit or base station. The user installs the containment housing, preferably in an open row between the crop growth soil of adjacent rows of crop. This allows probes or sensors to penetrate into the crop's root zone without disturbing the crop growth soil. This advantage is particularly useful for strip till operations because the containment housing and sensors of the present invention won't interfere with the till strips. Although environment sensors or probes90are positioned underground a breakaway antenna assembly100of the present invention elevates the active element190of the antenna above the crop canopy. The antenna assembly includes pole sections that may be added or removed to vary the overall height of the antenna assembly. Depending upon the crop being grown, the desirable height of the antenna's active element may be varied. The underground sensor mount and telemetry device10of the present invention is particularly well suited to maintain selected sensors in the field and transmitting real-time data even when the field is being worked. Also, the underground sensor mount and telemetry device provides a stable location for the sensor, thereby reducing the need for continuous maintenance. With reference to the Figures, various embodiments according to aspects of the invention will be described in greater detail. With reference toFIGS.1-3, an underground sensor mount and telemetry device10is shown having the antenna assembly100coupled to the containment housing in an upright position (FIG.1). The underground sensor mount and telemetry device10generally includes a containment housing20, environment sensors90, and antenna assembly100. The containment housing may be constructed of varying diameters, heights, shapes and materials dependent upon the particular needs and environment into which the housing will be placed. The antenna assembly generally includes a breakaway base110, pole sections and an active element or RF omni-directional transmit/receive antenna190. The containment housing20includes sidewalls22and open top and bottom ends24. Cover32rests on top of the open top end of the containment housing20. Cover32includes a secondary access lid34that allows a user to access the interior of the containment housing without disturbing as much soil by removing the entire cover. Probes or prongs92of the environment sensor90extend through slots30formed in the sidewall22of the containment housing20. The series of slots30allow for multiple sensors90and the height of the sensors within the soil may be varied. Of course, more than one series of slots may be formed into the hosing to thereby allow penetration of the probe into the soil in various directions. The breakaway base110couples to base pole40extending upward out of cover32and containment housing20. When the base pole is removed a cap or plug (not shown) may cover the hole for the base pole. Lid retainer36engages secondary lid34to maintain the position and orientation of the lid with respect to the cover. Whisker marker38may be engaged to the cover32, secondary lid34or base pole40. The base pole40extends a sufficient amount above the cover32such that soil may be placed over the cover to bury the housing. The top of the base pole may be aligned level or slightly above ground level. The whiskers38are of sufficient length to extend through the soil and above ground level to mark the location of the buried containment housing. Of course, other location markers of known suitable construction may replace or be utilized in conjunction with the whisker markers without departing from the scope of the present invention. The remote data transmit module50of the underground sensor mount and telemetry device10includes a battery power supply that requires re-charging or replacement approximately every three hundred days. Alternatively, a solar panel of known suitable construction may be coupled to the remote data transmit module to provide power to the telemetry device. The wireless aspect of the invention may include RF, wi-fi, z-wave, cellular, Bluetooth or other wireless systems capable of transmitting and receiving data and commands. Operating system apps may also be utilized to create additional functionality for the module. However, some units may be used to simply log and transmit data from the environment sensors90. With reference now toFIGS.4-6the housing interior and orientation of components contained within the housing20are further illustrated. The containment housing20encloses environment sensor90, base pole40and remote data transmit module50therein. The bottom of cover32includes a rim or hub44that extends down into the interior of the containment housing. The rim44holds the cover32in place and restricts the cover from sliding off the top of the housing20. The environment sensor90may be a wireless unit having a sending unit94contained within the housing20and prongs92extending through slots30and into the soil. The remote sending unit50is secured to an inner sidewall of the housing via bracket or pole strap28. The unit50may be hung, fastened or otherwise secured to the bracket28. The bracket28is fixed to the housing and includes a cutout sized to receive the base pole30between the bracket and the inner sidewall of the housing20. The base pole40is of sufficient length to pass through the cutouts such that one end of the pole embeds firmly in the soil under the containment housing bottom opening24while the other end extends out of a hole formed in the cover32. In this manner the base pole40provides a firm anchor for the breakaway base110and the antenna assembly100in general. With reference toFIGS.7and8, the antenna assembly may fold or tilt from the upright position to more than 90 degrees from the upright position. In this manner the antenna may be pushed parallel with the ground allowing an implement to pass over the antenna. An advantage of the breakaway base110of the present invention is that the antenna may be pushed downward in any direction about the base pole40and a tension mechanism returns the antenna to an upright position. Those skilled in the art will appreciate that the antenna assembly may be removed from the field (for example, for storage during the off season), without requiring removal of the containment housing. With reference toFIGS.9-15, the antenna assembly100generally includes breakaway base110, antenna pole assembly150having pole sections154,158, and162, and active element or omni directional antenna190. Depending upon the intended function of the remote data module50, the antenna190may be of known suitable construction having the ability to transmit and/or receive signals representing data from the environment sensor90. The top pole or antenna extension154includes a top pole cap182. The top pole cap has a shoulder that slips down into the hollow interior of the pole and rim184engages the top of the top pole. The diameter of the shoulder may be sized such that the antenna pole cap182is press fit into the top pole154. The cap182includes a bottom pocket186adapted for receiving a bulkhead jack or plug therein and the upper portion of the cap includes a cavity that is adapted for receiving the base192of the active element190. The active element may include a tip196that forms a blunt end of the antenna active element. The tip196may further include a small LED light of known suitable construction to provide visibility of the antenna at night. Middle pole158and bottom extension or pole162include pole mating couplers166. The coupler166includes a rim168that restricts the distance the coupler is inserted in to the pole extensions. Those skilled in the art will appreciate that more or less extensions may be utilized depending upon the overall desired height of the antenna assembly150. A hole170extends through the coupler160thereby allowing a bungee cord, coaxial cable or other elements to pass through the interior of the extension poles between the breakaway base and the active element190. The lower end of the bottom antenna extension162includes a base coupler172that includes a rim174that defines the depth that the coupler extends into the pole. A hole extends through the coupler thereby defining a passageway into the pole. The lower end of the bottom pole162inserts into the breakaway pole spring tube140. The spring tube includes an aperture144that may be used to lock the bottom extension162to the spring tube140. A second aperture142extends through the spring tube140and is adapted for receiving a coaxial cable therethrough. The coaxial cable (not shown) may be routed from the remote data transmit module50, through the cover32, up and into the spring tube140, through the hollow interior of extensions154,158, and162, and electrical coupling with the active element190. The coaxial cable or other suitable wire may have quick connects at both ends and a braided exterior to reduce rodent damage. Further, a bungee cord or other resilient member may be anchored to both ends of the antenna pole assembly150and routed through the interior of the extensions. In this manner, when the extensions are pulled apart the bungee cord stretches allowing the poles to be placed side by side but retaining the poles in close association. Further, in this manner, the bungie cord allows the poles to folded together but reduces the likelihood that the coaxial cable or other wire is pulled out of the poles or otherwise damaged. With reference toFIGS.16-23the breakaway base110will be described in greater detail. The breakaway base110splits unto an upper portion and lower portion. The lower portion includes a base112having a cylindrical collar114extending above the base. A retention disc extends above the collar114and has a diameter larger than the diameter of the collar. The overlapping disc116forms a retention rim118. A base pole coupling is fixed to the bottom of the base112and extends downward from the base. The base pole coupling130includes an inner diameter sized to receive and engage the outer diameter sidewall of the base pole40. The upper portion includes a pivot member120that has a cylindrical hollow interior having a diameter slightly larger than the diameter of the retention rim118. When in the upright position the pivot member120rests on base112and surrounds the collar114and retention disc116. A tension or compression spring122is positioned on a top portion of the pivot member120. Washers124engage the ends of the springs. The tension or compression spring122is contained within the spring tube140which may be fixed or otherwise engaged to the top of the pivot member120. Tension cable routing apertures132are formed through the center of the pivot member120, base112, collar114and retention disc116. The retention cable148is routed through the center of the upper and lower portion, the washers124and the center of the spring122. The lower end of retention cable148is fixed against the base112with a lower cable retention member or ferrule128. Similarly, the upper end portion of the tension cable148is fixed against an upper washer124with an upper cable retention member of ferrule126. The length of the tension cable is defined to apply a desired resting compression against the spring122when the breakaway base110is in an upright position. When a force is applied (directly or indirectly) against the spring tube140, a lower edge of the pivot member slides on the base and engages against the collar. The retention rim118restricts the pivot member from sliding up and off the collar. Further, since the tension cable148has a defined length, when the spring tube140is tilted, a force translates against the spring, thereby compressing the spring. When the force against the tube140is removed the compression force of the spring forces the pivot member120back to the upright position. Retention magnet134is fixed to the base112and pivot magnet136is fixed to an underside of the pivot member120. The two magnets134and136help align the pivot member120with the base112and restricts the antenna pole assembly150from rotating when in an upright position. The magnets further help define the minimal force required to tilt the pivot member120. In this manner the magnets may be selected such that winds in excess of 20 mph do not apply a sufficient force to the antenna pole assembly150to cause the pivot member120to tilt. With reference toFIGS.24and25the remote data transmit module50includes a housing52. The housing52includes a hermetic and water tight seal to the interior of the housing. An integrated circuit72and power supply58are contained within the housing. Outer push button switch76, outer LED lit switch78, coaxial cable out62and cable glands64for quick connection to hard wired sensors are all fixed to the housing and electrically coupled with the integrated circuit72. An internal master switch54coupled to the circuit board controls the power supply to the integrated circuits and all components coupled to the circuit board72. Components such as a transmit module or modem and a GPS transceiver are coupled to the circuit72within the housing52(not shown between the circuit board and the sidewalls of the housing). By way of example and without limitation intended, one example of using the underground sensor mount and telemetry device10will be described in conjunction and reference to irrigating or spraying fertilizer on a field. One or more of the containment housings20of the underground sensor mount and telemetry device10are buried in desired locations in the field. The height of the antenna assembly100is selected dependent upon the particular crop being grown in the field. Further, the particular environment sensors or probes90contained within the housing20are determined by the grower. Once the underground sensor mount and telemetry devices10are positioned within the field, a wireless link may be established between the underground sensor mount and telemetry device10and a remote transceiver or base station. With a link established sensor data or information is transmitted from the field to allow real time monitoring of data from the sensors. Although the sensors are positioned below the crop canopy the breakaway antenna allows transmission of data regardless the height of the canopy. When an irrigation line or fertilizing implement arm passes the underground sensor mount and telemetry device10, the breakaway antenna assembly100folds down rather than breaking off. When the implement is past, the antenna assembly springs back into an upright position. In this manner, the filed may be worked without the necessity to remove the antennas from the field. A landscape filtration fabric may be wrapped about the outside of the containment housing20to reduce the amount of silt seeping into the housing. The probes92of the environment sensor may pierce the fabric and insert into the surrounding soil. Additionally, a lower cover or ring may be engaged to the containment housing to increase the lower surface area of the housing and restrict the edge of the housing from being pressed downward into the soil. In this manner, a force to the top of the housing (such as a tractor or other equipment rolling on the soil above the containment housing) won't tend to shift the housing downward. These and various other aspects and features of the invention are described with the intent to be illustrative, and not restrictive. This invention has been described herein with detail in order to comply with the patent statutes and to provide those skilled in the art with information needed to apply the novel principles and to construct and use such specialized components as are required. It is to be understood, however, that the invention can be carried out by specifically different constructions, and that various modifications, both as to the construction and operating procedures, can be accomplished without departing from the scope of the invention. Further, in the appended claims, the transitional terms comprising and including are used in the open-ended sense in that elements in addition to those enumerated may also be present. Other examples will be apparent to those of skill in the art upon reviewing this document. | 17,250 |
11862844 | With regard to description of drawings, the same or similar components will be marked by the same or similar reference signs. DETAILED DESCRIPTION Hereinafter, various embodiments of the disclosure may be described with reference to accompanying drawings. Accordingly, those of ordinary skill in the art will recognize that modification, equivalent, and/or alternative on the various embodiments described herein can be variously made without departing from the scope and spirit of the disclosure. With regard to description of drawings, similar components may be marked by similar reference numerals. FIGS.1A and1Bschematically illustrate an electronic device according to an embodiment. FIGS.1A and1Billustrate various embodiments of electronic devices100and110including two or more devices101,102,111, and112capable of being coupled to one another.FIG.1Aillustrates the plate-type electronic device100, andFIG.1Billustrates the wearable-type electronic device110. Referring toFIGS.1A and1B, the electronic device100may include the first devices101and111and the second devices102and112are capable of being electrically or physically connected to the first devices101and111. According to various embodiments, the first device101or111and the second device102or112may be coupled to each other to operate as a single electronic device100or111. For example, the first device101may include a first display105and the second device102may include a second display106. While the first device101and the second device102are physically or electrically connected to each other, the first display105and the second display106may function as a single display. For example, the first display105and the second display106may output a continuous screen. According to an embodiment, the first device101or111may be a primary device or a main device, and the second device102may be a secondary device or an auxiliary device that operates in an auxiliary manner. According to an embodiment, the first device101or111may be a device capable of operating independently while being separated from the second device102or112. According to various embodiments, the second device102or112may not operate independently while being separated from the first device101or may perform an operation that is dependent on the operation of the first device101or111. For another example, the first device101or111and the second device102or112may operate independently while being separated from each other. Referring toFIG.1B, the first device111may be physically or electrically coupled to the second device112. The first device111may be coupled such that the length of the first device111extends from the second device112, or the first device111may be coupled to be seated in at least a partial region of the second device112. For example, the second device112may include an opening in at least a part of housing, and the first device111may be coupled to the second device112through the opening. FIGS.1A and1Billustrate a plate-type electronic device or a wearable electronic device, respectively, but the electronic device disclosed in the specification may be implemented in various forms including two or more devices capable of being coupled with each other. Hereinafter, various embodiments will be described using the plate-type electronic device100, but the various embodiments described below may be applied to various types of electronic devices including two or more devices capable of being coupled with each other. FIGS.2A,2B, and2Cillustrate an operating mode of an electronic device according to an embodiment. Referring toFIGS.2A,2B, and2C, the electronic device100(e.g., the electronic device100ofFIG.1) may support at least one of a bar mode (FIG.2A), a dual mode (FIG.2B), or a detach mode (FIG.2C). According to an embodiment, referring toFIG.2A, bar mode may be an operating mode in which the first device101and the second device102are electrically or physically connected to each other to operate together. For example, in bar mode, the antenna elements of the first device101and the second device102may be connected to operate as a single antenna; alternatively, the displays of the first device101and the second device102may be connected to each other to operate as a single display. According to an embodiment, referring toFIG.2B, dual mode may be an operating mode in which the first device101and the second device102are electrically or physically separated from each other, but one device operates in association with the other device. For example, dual mode may be an operating mode in which the second device102transmits a signal to the first device101or the first device101transmits a signal to the second device102to perform an operation associated with each other, while the first device101and the second device102are spaced from each other. According to one implementation, referring toFIG.2C, detach mode may be an operating mode in which the first device101and the second device102are separated from each other to perform independent operations with each other, or to perform an operation that allows only one device to operate. In this case, the operation of any one of the first device101and the second device102may not affect the operation of another device. FIG.3illustrates a configuration of an electronic device according to an embodiment. According to an embodiment, the electronic device100may include the first device101and the second device102that are capable of being coupled to each other. Referring toFIG.3, in the case where the first device101includes a first antenna element321, and the second device102includes a second antenna element341, the first antenna element321and the second antenna element341may be electrically or physically connected to each other when the first device101and the second device102are coupled to each other. For example, a first radiator included in the first antenna element321and a second radiator included in the second antenna element341may be electrically or physically connected to each other. For example, it may be understood that the first radiator and the second radiator are conductive members such as conductive patterns or conductive plates. In this case, the electrical length of the antenna including the first antenna element321may extend to the second antenna element341. An antenna element formed by electrically connecting the first antenna element321to the second antenna element341may transmit and receive antenna signals in a frequency band lower than the frequency bands of the first antenna element321and the second antenna element341. According to an embodiment, the first device101may include first housing310. The first housing310may include a first surface311, a second surface312facing away from the first surface311, a side member313surrounding a space between the first surface311and the second surface312. According to an embodiment, a first display314(e.g., the display105ofFIG.1) may be exposed to the outside through the first surface311. The first display314may be a touch screen display. The first surface311may be the front surface of the first device101; when the first device101is coupled to the second device102, the first surface311may form the front surface of the electronic device100. According to an embodiment, the second surface312may be the rear surface of the first device101. When the first device101is coupled to the second device102, the second surface312may form the rear surface of the electronic device100. According to an embodiment, the side member313may include a plurality of sides. For example, the side member313may include a first side313a, a second side313b, a third side313c, and a fourth side313d. For example, the first device101may be coupled to the second device102through a portion (e.g., the first side313a) of the side member313. According to an embodiment, the first device101may include the first antenna element321including a portion of the first housing310. For example, the first antenna element321may include a portion of the side member313.FIG.3illustrates that the first antenna element321includes at least part of the second side313b, but the first antenna element321may be disposed to be coupled to the second antenna element341of the second device102. Referring toFIG.3, the side member313may include a plurality of conductive regions321,322,323, and324spaced from each other by a non-conductive material. At least one of the plurality of conductive regions321,322,323, and324may operate as an antenna upon supplying an electrical signal. In this case, the first conductive region321among the plurality of conductive regions321,322,323, and324may be the first antenna element321. In this case, it may be understood that the first conductive region321is a radiator of the first antenna element321. At least one of the other conductive regions322,323, and324may be an antenna element having an electrical length different from that of the first conductive region321. For example, the electronic device may transmit or receive a global positioning system (GPS) signal, using the second conductive region322or may transmit or receive a Wi-Fi signal using the fourth conductive region324. According to an embodiment, the second device102may include second housing330. The second housing330may include a first surface331, a second surface332facing away from the first surface331, a side member333surrounding a space between the first surface331and the second surface332. According to an embodiment, a second display334(e.g., the display106ofFIG.1) may be exposed to the outside through the first surface331. The second display334may be a touch screen display. The first surface331may be the front surface of the second device102; when the second device102is combined with the first device101, the first surface331may form the front surface of the electronic device100together with the first surface311of the first device101. In this case, the second display334may operate as a single display together with the first display314. According to an embodiment, the second surface332may be the rear surface of the second device102. The second surface332may form the rear surface of the electronic device100when the second device102is coupled to the first device101. According to an embodiment, the side member333may include a plurality of sides. For example, the side member333may include a fifth side333a, a sixth side333b, a seventh side333c, and an eighth side333d. For example, the second device102may be coupled to the first device101through a portion (e.g., the seventh side333c) of the side member333. According to an embodiment, the second device102may include the second antenna element341including a portion of the second housing330. For example, the second antenna element341may include a portion of the side member333.FIG.3illustrates that the second antenna element341includes at least part of the sixth side333b, but the first antenna element321may be disposed to be coupled to the second antenna element341of the second device102. Referring toFIG.3, the side member333may include at least one conductive region341specified by a non-conductive material. At least one conductive region341may operate as an antenna when an electrical signal is supplied. The second antenna element341may include the at least one conductive region341. In this case, it may be understood that the at least one conductive region341is a radiator of the second antenna element341. According to an embodiment, for example, when the first device101and the second device102are coupled to each other, the first antenna element321and the second antenna element341may form an antenna having one electrical length formed by the first conductive region321and at least one conductive region341. FIG.4is a block diagram illustrating a configuration of an electronic device according to an embodiment. Referring toFIG.4, an electronic device (e.g., electronic device100ofFIGS.1to3) may include the first device101(e.g., the first device101ofFIGS.1to3) and the second device102(e.g., the second device102ofFIGS.1to3). According to an embodiment, the first device101may include the first antenna element321, a communication circuit350, and a first ground member352. In addition, the first device101may include various configurations according to various embodiments disclosed in the specification. For example, the first device101may further include configurations illustrated inFIG.11. For example, the first device101may further include configurations such as a processor, a display, or a battery. According to an embodiment, the first antenna element321may include at least part of the housing of the first device101or may be disposed inside the housing. The first antenna element321may have a first electrical length for transmitting or receiving a signal in a first frequency band. The first antenna element321may function as an antenna by itself or may function as a single antenna by being coupled to another antenna element (e.g., the second antenna element341). According to an embodiment, the communication circuit350may supply an electrical signal to the first antenna element321. For example, the communication circuit350may include a radio frequency (RF) circuit. According to an embodiment, the first ground member352may be at least electrically connected to the first antenna element321. The first ground member352may operate as a ground by itself, or may operate as a ground by being coupled to an additional ground member (e.g., a second ground member360) together. According to an embodiment, the second device102may include the second antenna element341and the second ground member360. In addition, the second device102may include various configurations according to various embodiments disclosed in the specification. For example, the second device102may further include the communication circuit350or configurations illustrated inFIG.11. According to an embodiment, the second antenna element341may include at least part of the housing of the second device102or may be disposed inside the housing. The second antenna element341may have a second electrical length. The second antenna element341may function as an antenna by itself or may function as a single antenna by being coupled to another antenna element (e.g., the first antenna element321). According to an embodiment, the second ground member360may be electrically connected to at least one external antenna element (e.g., the at least first antenna element321). According to an embodiment, the second ground member360may not be electrically connected to the second antenna element341, within the second device102or while the second device102is separated from the first device101. For another example, the second ground member360may be electrically connected to the second antenna element341while the second device102solely communicates with an external device. In this case, a communication circuit capable of supplying an electrical signal to the second ground member360may be included in the second device102. According to an embodiment, while the first device101and the second device102are coupled to each other, the first antenna element321and the second antenna element341may be physically or electrically connected to each other. In this case, the first antenna element321and the second antenna element341may operate as a third antenna element having a third electrical length for transmitting or receiving a signal in a third frequency band together. The frequency of the antenna signal transmitted and received by the third antenna element may have a frequency lower than the frequency of the signal transmitted and received by the first antenna element321and the second antenna element341. For example, the communication circuit350may transmit or receive the same signal at a specific point in time, using the first antenna element321and the second antenna element341. In other words, while the first device101and the second device102are coupled to each other, the electronic device may transmit or receive a signal through an antenna having a relatively long electrical length as compared to a case where the devices are separated from each other. According to an embodiment, while the first device101and the second device102are coupled to each other, and the first antenna element321and the second antenna element341are coupled to each other to operate as a single antenna, the first ground member352and the second ground member360may operate as a single ground layer for the antenna. In this case, the single ground layer may be directly connected to the first antenna element321through the first ground member352. A wider ground region may be formed by connecting the first ground member352and the second ground member360. Accordingly, the performance of the first antenna element321may be improved. According to an embodiment, while the first device101and the second device102are separated from each other, the first device101may transmit or receive a signal, using the first antenna element321. In this case, the first antenna element321may be electrically connected to the communication circuit350and the first ground member352. According to an embodiment, the first antenna element321may solely have an electrical length for transmitting or receiving a signal in the first frequency band. While the first device101and the second device102are separated from each other, the electronic device (or the first device101) may transmit or receive a signal with an external device through a first frequency band. According to an embodiment, the first antenna element321and the second antenna element341may have an electrical length for transmitting or receiving a signal in a second frequency band together. The first device101and the second device102may transmit or receive a signal with an external device through the second frequency band while being coupled to each other. The second frequency band may be a lower frequency band than the first frequency band. FIGS.5A and5Billustrate a connection structure between devices according to an embodiment. Referring toFIGS.5A and5B, the first device101(e.g., the first device101ofFIGS.1to4) and the second device102(e.g., the second device102ofFIGS.1to4) may be connected to each other, using connection structures510and520. According to an embodiment, the connection structures510and520may include at least one of a magnet and a pogo. According to an embodiment, the connection structure510may be disposed in one portion of the first device101(e.g., the first side313aof the side member); the connection structure520may be disposed in one portion (e.g., the seventh side333cof the side member) of the second device102; the connection structure510and the connection structure520may be used to couple the first device101to the second device102. FIGS.6A and6Billustrate a configuration of a connection structure according to an embodiment. FIGS.6A and6Billustrate the configuration of a connection structure applicable to the connection structure510of the first device101and the connection structure520of the second device102. Referring toFIG.6A, the connection structure (e.g., the connection structure510) may include a plurality of connection members511for signal connection between devices and/or a holding member512that enables a structure including the plurality of connection members511to be maintained. According to an embodiment, the plurality of connection members511may include a magnet and/or a pogo. The respective connection member511is electrically or physically connected to the connection member of the second device102; the first device101and the second device102may exchange electrical signals through the connection member511. According to an embodiment, the plurality of connection members511may include at least one of a first connection member electrically connected to the first ground member, a second connection member electrically connected to the first antenna element, and a third connection member for identifying the second device. According to an embodiment, each connection member included in the plurality of connection members511may be referred to as a connection terminal or a pin; each connection terminal or pin may have various electrical functions. One of the plurality of connection members511may be a ground pin used for ground connection, and the other may be an antenna pin used for antenna connection. In addition, the plurality of connection members511may include pins for various purposes. For example, at least one of the plurality of connection members511may be an identification pin (e.g., an ID pin) for performing identification between devices. Hereinafter, Table 1 illustrates the configuration of the plurality of connection members511of the first device101according to various embodiments; Table 2 illustrates the configuration of the plurality of connection members511of the second device102according to various embodiments. TABLE 1PinDescription1VbatPower supply2GNDPower supply (Ground)3I2C (SCL)GPIO I2C clock4I2C(SDA)GPIO I2C data5InterruptGPIO interrupt6AntennaLow-band antenna7GND reinforcementGND reinforcement8IDTA, Accessory ID recognition TABLE 2PinDescription1VbatPower supply2GNDPower supply (Ground)3I2C (SCL)GPIO I2C clock4I2C(SDA)GPIO I2C data5InterruptGPIO interrupt6AntennaLow-band antenna7GND reinforcementGND reinforcement8IDTA, Accessory ID recognition According to an embodiment, the holding member512may allow each configuration of the plurality of connection members511to maintain the structure with strong tensile force. For example, the holding member512may include a guide magnet. The guide magnet may be disposed for each groove of the connection member511. In particular, the guide magnet may be interposed between one connection member and another connection member adjacent to the one connection member. Referring toFIG.6B, the connection structure (e.g., the connection structure510) may include a plurality of connection members513and515for signal connection between devices and/or holding members514and515that enable a structure including the plurality of connection members511to be maintained. According to an embodiment, at least one of a plurality of connection members513and515may be a plate516. Hereinafter, the connection terminal or pin may be referred to as a first connection member, and the plate may be referred to as a second connection member. According to an embodiment, to maintain the structure by the plurality of connection members513and515, an insulator (spacer)514and/or magnet515may be included between a plurality of connection members. FIGS.7to10illustrate an arrangement and configuration of a connection structure according to various embodiments. FIGS.7A to7Dillustrate that connection structures are disposed on the first side313a(e.g., the first side313ainFIG.3) of the first device101and on the seventh side333c(e.g., the seventh side333cofFIG.3) of the second device102, respectively. However, the location where the connection structures are disposed may be variously modified. Referring toFIGS.7A to7D, the first device101may include a first connection structure710, and the second device102may include a second connection structure720. According to an embodiment, the first connection structure710and the second connection structure720may include a plurality of first connection members711and712disposed at regular intervals. For another example, the first connection structure710and the second connection structure720may include at least one second connection members713and714in addition to the plurality of first connection members711and712, respectively. For example, the first connection members711and712may include magnets or pogos, and the second connection members713and714may include plates. According to an embodiment, the plurality of first connection members711may be interposed between at least one second connection member713and at least another second connection member713. For example, the second connection member713may be disposed adjacent to opposite ends of the first side313a. Similarly, the plurality of first connection members712of the second connection structure720may be interposed between at least one second connection member714and at least another second connection member714. For example, the second connection member714may be disposed adjacent to opposite ends of the seventh side333c. Referring to→FIGS.7C and7D, the first device101may include a first connection structure730, and the second device102may include a second connection structure740. According to an embodiment, a plurality of connection members731and741in the connection structures730and740may connect the first device101to the second device102. In this case, the first device101and the second device102may further include additional connection members750and751to support the connection between the first device101and the second device102, respectively. For example, the additional connection members750and751may include a groove or bump. For example, the additional connection member750of the first device101may include a groove, and the additional connection member751of the second device102may include a bump to provide a more rigid connection to the devices. For another example, the first device101may include a bump, and the second device102may include a groove. According to an embodiment, the groove750may be interposed between the plurality of connection members731, and the bump751may be interposed between the plurality of connection members741. For example, the plurality of connection members731may be disposed to be divided into two groups with the groove750interposed therebetween; the plurality of connection members741may be disposed to be divided into two groups with the bump751interposed therebetween. The first connection structure730and the second connection structure740may be configured to correspond to each other. For example, when the first connection structure730and the second connection structure740are connected to each other, the groove750and the bump751may be disposed to be connected to each other, and the plurality of connection members731and741may be disposed in contact with each other. FIG.8illustrates the arrangement and configuration of a connection structure according to an embodiment. Referring toFIG.8, a connection structure810of the first device101and a connection structure820of the second device102may be implemented asymmetrically. According to an embodiment, while the first device101and the second device102are connected to each other, different types of connection members may be disposed at a location where the first device101and the second device102contact each other (or correspond to each other). For example, a first connection member822may be disposed in the second device102in response to a second connection member811of the first device101. FIGS.9A to9Fillustrate an arrangement of a connection member according to various embodiments. FIGS.9A to9Fillustrate a cross-sectional view of the first device101when viewed from above the first side (e.g., the first side313aofFIG.3), and illustrates a cross-sectional view of the second device102when viewed from above the seventh side (e.g., the seventh side333cofFIG.3). Referring toFIGS.9A to9F, the first connection member (e.g., the first connection member731ofFIG.7) and/or the second connection member (e.g., the connection member732ofFIG.7) may be disposed in the first device101and second device102, in various numbers, in various directions, and/or in various arrangements. Referring toFIGS.9B and9B, connection members (e.g., the first connection member) may be disposed in various directions. For example, the connection member may be disposed to have a long length in a direction in which the side of a device extends; alternatively, on the other hand, the connection member may be disposed to have a short length in a direction in which the side extends. Referring toFIGS.9A and9B, the first device101and the second device102may include connection members having the identical or symmetrical structures to each other. Referring toFIGS.9C to9F, the first device101and the second device102may include connection members having different arrangement structures from each other. For example, the first connection member may be disposed in another device corresponding to a second connection member of any one device. Referring toFIGS.9A to9F, connection members may be disposed in various numbers. In other words, the number of first connection members and the number of second connection members may be variously modified. FIGS.10A to10Dillustrate the arrangement and configuration of a connection structure according to an embodiment. Referring toFIGS.10A to10D, a plurality of connection members1011(e.g., the plurality of connection members511ofFIG.6) may be exposed to the outside through at least one portion of a device (e.g., the first device101or the second device102ofFIG.1). For example, the plurality of connection members1011may be exposed to the outside through only one surface (e.g., the first side313aof the side member) of the first device101or may be exposed to the outside through the one surface and the other surface (e.g., the second surface312). The other surface may be a surface connected to the one surface. FIG.10Aillustrates that the plurality of connection members1011are exposed to the outside through only one surface;FIG.10Cillustrates that the plurality of connection members1011are exposed to the outside through the one side and the other side. In the case ofFIG.10A,FIG.10Billustrate the arrangement of the connection members when viewed from above the side313aor333cwhere the connection members of the first device101and the second device (e.g., the second device102ofFIG.1) are arranged; in the case ofFIG.10C,FIG.10Dillustrate the arrangement of the connection member when viewed from above the side313aor333c. According to an embodiment, an electronic device (e.g., the electronic device100or110ofFIG.1) may include a first device (e.g., the first device101or111ofFIG.1) and a second device (e.g., the second device102or112ofFIG.1) that are coupled to each other or spaced from each other. The first device may include a first housing (e.g., the first housing310ofFIG.3), a first antenna element (e.g., the first antenna element321ofFIG.3) having a first electrical length for transmitting or receiving a signal in a first frequency band, a communication circuit disposed inside the first housing and for transmitting and receiving the signal of the first antenna element, and a first ground member (e.g., the first ground member352ofFIG.3) electrically connected to the first antenna element. The second device may include a second antenna element (e.g., the second antenna element341ofFIG.3) having a second electrical length, a second housing (e.g., the second housing330ofFIG.3), and a second ground member (e.g., the second ground member360ofFIG.3) disposed inside the second housing. The first antenna element and the second antenna element may be connected to each other, and operate as a third antenna element having a third electrical length for transmitting and receiving a signal in a second frequency band while the first device and the second device are connected to each other. The first ground member and the second ground member may be electrically connected to each other while the first device and the second device are connected to each other. In the electronic device (e.g., the electronic device100or110ofFIG.1) according to an embodiment, the communication circuit disposed inside the first housing may transmit or receive a signal in the second frequency band through the first antenna element and the second antenna element while the first device and the second device are connected to each other. In the electronic device (e.g., the electronic device100or110ofFIG.1) according to an embodiment, the first device may include a first connection structure (e.g., the first connection structure710ofFIG.7) for a connection to the second device, and the second device may include a second connection structure for a connection to the first device. The first connection structure may include a plurality of first connection members, and the second connection structure includes a plurality of second connection members. In the electronic device according to an embodiment, the plurality of first connection members and the plurality of second connection members may include at least one of a magnet or a pogo. In the electronic device according to an embodiment, the plurality of first connection members may include a holding member between respective connection members. The holding member of the electronic device according to an embodiment may include at least one of a guide magnet and an insulator. The plurality of first connection members of the electronic device according to an embodiment may include a first connection member electrically connected to the first ground member. The plurality of second connection members may include a second connection member electrically connected to the second ground member. In the electronic device according to an embodiment, the plurality of first connection members may include a third connection member electrically connected to the first antenna element. The plurality of second connection members may include a fourth connection member electrically connected to the second antenna element. In the electronic device according to an embodiment, the plurality of first connection members may include a fifth connection member for identifying the second device. The plurality of second connection members may include a sixth connection member for identifying the first device. In the electronic device according to an embodiment, the first connection structure may include a groove (e.g., the groove750ofFIG.7) or a bump (e.g., the bump750ofFIG.7). The second connection structure may include a bump capable of being coupled to the groove, or a groove capable of being coupled to the bump. At least one of the plurality of first connection members of the electronic device according to an embodiment may include a plate. The first device of the electronic device according to an embodiment may include a first display exposed to an outside through the first housing. The second device may include a second display exposed to an outside through the second housing. The first display and the second display may operate as a single display while the first device and the second device are connected to each other. The first antenna element of the electronic device according to an embodiment may include at least part of the first housing. The second antenna element of the electronic device according to an embodiment may include at least part of the second housing. In an embodiment, the second frequency band may be a frequency band lower than the first frequency band. FIG.11is a block diagram illustrating an electronic device1101in a network environment1100according to various embodiments. Referring toFIG.11, the electronic device1101in the network environment1100may communicate with an electronic device1102via a first network1198(e.g., a short-range wireless communication network), or an electronic device1104or a server1108via a second network1199(e.g., a long-range wireless communication network). According to an embodiment, the electronic device1101may communicate with the electronic device1104via the server1108. According to an embodiment, the electronic device1101may include a processor1120, a memory1130, an input device1150, a sound output device1155, a display device1160, an audio module1170, a sensor module1176, an interface1177, a haptic module1179, a camera module1180, a power management module1188, a battery1189, a communication module1190(e.g., the communication circuit350ofFIG.4), a subscriber identification module (SIM)1196, or an antenna module1197. In some embodiments, at least one (e.g., the display device1160or the camera module1180) of the components may be omitted from the electronic device1101, or one or more other components may be added in the electronic device1101. In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module1176(e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device1160(e.g., a display). The processor1120may execute, for example, software (e.g., a program1140) to control at least one other component (e.g., a hardware or software component) of the electronic device1101coupled with the processor1120, and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor1120may load a command or data received from another component (e.g., the sensor module1176or the communication module1190) in a volatile memory1132, process the command or the data stored in the volatile memory1132, and store resulting data in a non-volatile memory1134. According to an embodiment, the processor1120may include a main processor1121(e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor1123(e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor1121. Additionally or alternatively, the auxiliary processor1123may be adapted to consume less power than the main processor1121, or to be specific to a specified function. The auxiliary processor1123may be implemented as separate from, or as part of the main processor1121. The auxiliary processor1123may control at least some of functions or states related to at least one component (e.g., the display device1160, the sensor module1176, or the communication module1190) among the components of the electronic device1101, instead of the main processor1121while the main processor1121is in an inactive (e.g., sleep) state, or together with the main processor1121while the main processor1121is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor1123(e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module1180or the communication module1190) functionally related to the auxiliary processor1123. The memory1130may store various data used by at least one component (e.g., the processor1120or the sensor module1176) of the electronic device1101. The various data may include, for example, software (e.g., the program1140) and input data or output data for a command related thererto. The memory1130may include the volatile memory1132or the non-volatile memory1134. The program1140may be stored in the memory1130as software, and may include, for example, an operating system (OS)1142, middleware1144, or an application1146. The input device1150may receive a command or data to be used by other component (e.g., the processor1120) of the electronic device1101, from the outside (e.g., a user) of the electronic device1101. The input device1150may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen). The sound output device1155may output sound signals to the outside of the electronic device1101. The sound output device1155may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker. The display device1160(e.g., the displays105and106ofFIG.1) may visually provide information to the outside (e.g., a user) of the electronic device1101. The display device1160may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display device1160may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch. The audio module1170may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module1170may obtain the sound via the input device1150, or output the sound via the sound output device1155or an external electronic device (e.g., an electronic device1102) (e.g., speaker of headphone) directly (e.g., wiredly) or wirelessly coupled with the electronic device1101. The sensor module1176may detect an operational state (e.g., power or temperature) of the electronic device1101or an environmental state (e.g., a state of a user) external to the electronic device1101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module1176may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The interface1177may support one or more specified protocols to be used for the electronic device1101to be coupled with the external electronic device (e.g., the electronic device1102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface1177may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface. A connecting terminal1178may include a connector via which the electronic device1101may be physically connected with the external electronic device (e.g., the electronic device1102). According to an embodiment, the connecting terminal1178may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector). The haptic module1179may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module1179may include, for example, a motor, a piezoelectric element, or an electric stimulator. The camera module1180may capture a still image or moving images. According to an embodiment, the camera module1180may include one or more lenses, image sensors, image signal processors, or flashes. The power management module1188may manage power supplied to the electronic device1101. According to one embodiment, the power management module1188may be implemented as at least part of, for example, a power management integrated circuit (PMIC). The battery1189may supply power to at least one component of the electronic device1101. According to an embodiment, the battery1189may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. The communication module1190may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device1101and the external electronic device (e.g., the electronic device1102, the electronic device1104, or the server1108) and performing communication via the established communication channel. The communication module1190may include one or more communication processors that are operable independently from the processor1120(e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module1190may include a wireless communication module1192(e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module1194(e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network1198(e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network1199(e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module1192may identify and authenticate the electronic device1101in a communication network, such as the first network1198or the second network1199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module1196. The antenna module1197may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device1101. According to an embodiment, the antenna module1197may include a plurality of antennas. In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network1198or the second network1199, may be selected, for example, by the communication module1190. The signal or the power may then be transmitted or received between the communication module1190and the external electronic device via the selected at least one antenna. At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)). According to an embodiment, commands or data may be transmitted or received between the electronic device1101and the external electronic device1104via the server1108coupled with the second network1199. Each of the electronic devices1102and1104may be a device of a same type as, or a different type, from the electronic device1101. According to an embodiment, all or some of operations to be executed at the electronic device1101may be executed at one or more of the external electronic devices1102,1104, or1108. For example, when the electronic device1101should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device1101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device1101. The electronic device1101may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example. The electronic device according to various embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above. It should be appreciated that various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It is to be understood that a singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element. As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC). Various embodiments as set forth herein may be implemented as software (e.g., the program1140) including one or more instructions that are stored in a storage medium (e.g., internal memory1136or external memory1138) that is readable by a machine (e.g., the electronic device1101). For example, a processor (e.g., the processor1120) of the machine (e.g., the electronic device1101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a compiler or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium. According to an embodiment, a method according to various embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server. According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added. | 53,282 |
11862845 | DETAILED DESCRIPTION OF EMBODIMENTS It will be understood that when an element or layer is referred to as being “on”, “connected to” or “coupled to” another element or layer, it can be directly on connected or coupled to the other dement or layer, or intervening elements or layers may be present. When an element or layer is referred to as being “directly on”, “directly connected to” or “directly coupled to” another dement or layer, no intervening elements or layers may be present. Like reference numerals refer to like elements throughout this specification. In the figures, the thicknesses, ratios and dimensions of elements may be exaggerated for convenience of description of the present inventive concepts. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. Unless otherwise defined in the specification, these terms may only be used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present inventive concepts. As used herein, the singular forms, “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Spatially relative terms, such as “beneath”, “below”, “lower”, “above”, and “upper”, may be used herein for ease of description to describe the relationship of one element or feature to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. Unless otherwise defined all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present inventive concepts belong. It will be further understood that terms, such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. It will be further understood that the terms “include” or “have”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and or groups thereof. Hereinafter, the present inventive concepts will be explained in detail with reference to the accompanying drawings. FIG.1Ais a perspective view of an electronic device according to an embodiment of the present inventive concepts, andFIG.1Bis a cross-sectional view of an electronic device according to an embodiment of the inventive concept. Referring to the embodiments ofFIG.1AandFIG.1B, an electronic device DD may be a device that is activated according to an electrical signal. For example, in an embodiment the electronic device DD may be a mobile phone, a tablet, a car navigation device, a game machine, or a wearable device. However, embodiments of the present inventive concepts are not limited thereto and the electronic device DD may be various other small, medium or large electronic devices.FIG.1Aillustrates the electronic device DD as a mobile phone for convenience of explanation. The electronic device DD may display an image IM through a display surface DD-IS. The display surface DD-IS may include an active area DD-AA and a peripheral area DD-NAA adjacent to the active area DD-AA. The active area DD-AA may be an area in which the image IM is displayed. The peripheral area DD-NAA may be an area in which the image IM is not displayed. The image IM may include one or more moving image and/or still images. For example, a dock window and software icon images are illustrated inFIG.1Aas an example of the image IM. However, embodiments of the present inventive concepts are not limited thereto. The active area DD-AA may be parallel to a surface defined by a first direction DR1and a second direction DR2crossing the first direction DR1. For example, as shown in the embodiment ofFIG.1A, the second direction DR2may be perpendicular to the first direction DR1. However, embodiments of the present inventive concepts are not limited thereto. A third direction DR3may indicate a normal direction of the active area DD-AA, that is, a thickness direction of the electronic device DD. A front surface (e.g., a top surface) and a rear surface (e.g., a bottom surface) of each of members or units to be described below may be distinguished by the third direction DR3. The third direction DR3may be a direction crossing the first direction DR1and the second direction DR2. For example, the first direction DR1, the second direction DR2, and the third direction DR3may be orthogonal to each other. However, embodiments of the present inventive concepts me not limited thereto. In addition, a surface defined by the first direction DR1and the second direction DR2may be defined as a plane in this specification, and “when viewed in a plane” may be defined as a state of being viewed. In the third direction DR3. As shown in the embodiment ofFIG.1B, the electronic device DD may include a display panel DP, an input sensor IS, and a window WP. The display panel DP may be a component that substantially generates the image IM. In an embodiment, the display panel DP may be a light emitting display panel. However, embodiments of the present inventive concepts are not limited thereto. For example, the display panel DP may include an organic light emitting display panel, a quantum dot display panel, a micro LED display panel, or a nano LED display panel. The input sensor IS may be disposed on the display panel DP (e.g. in the third direction DR3). In an embodiment, the input sensor IS may be disposed directly on the display panel DP and the input sensor IS may be formed on the display panel DP through a continuous process. Alternatively, the input sensor IS may be bonded to the display panel DP by an adhesive member. The adhesive member may include a typical adhesive or a typical detachable adhesive. For example, the adhesive member may be an optically clear adhesive member such as a pressure sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, and an optically clear resin (OCR). However, embodiments of the present inventive concepts are not limited thereto. A sensing area SP and an antenna area AP may be defined in the input sensor IS. Sensors for sensing an external input applied from the outside may be disposed in the sensing area SP. For example, in an embodiment, the external input may be a user input. The user input may include various types of external inputs such as a part of a user's body, light, heat, pen, and pressure. However, embodiments of the present inventive concepts are not limited thereto. When viewed in a plane, the sensing area SP may overlap the active area DD-AA. An antenna ANT for transmitting, receiving, or transmitting and receiving a plurality of wireless communication signals, for example, a plurality of radio frequency signals may be disposed in the antenna area AP. The antenna ANT may be provided in plurality. In an embodiment, the antenna area AP may be disposed adjacent to at least one edge of the sensing area SP. In an embodiment the antenna area AP may be provided in plurality. In this embodiment, the antenna areas AP may be provided to extend from at least two edges of the sensing area SP. In an embodiment, the input sensor IS may include one sensing area SP and one to four antenna areas AP. However, embodiments of the present inventive concepts are not limited thereto and the sensing area SP and the antenna area AP may have various different numbers and configurations. When viewed in a plane, the antenna area AP may overlap the active area DD-AA. Even in embodiments in which the electronic device DD is miniaturized or thinned, or the surface area of the peripheral area DD-NAA is reduced, a space in which the antenna area AP is to be disposed may be secured because the surface area of the active area DD-AA is secured. In an embodiment, the antenna area AP may be formed at the same time as the sensing area SP is formed. However, embodiments of the present inventive concepts are not limited thereto and the antenna area AP may be formed by a process different from that of the sensing area SP in some embodiments. The window WP may be disposed on the input sensor IS. In an embodiment, the window WP may include an optically clear insulating material. For example, the window WP may include glass or plastic. The window WP may have a multilayer structure or a single-layer structure. For example, the window WP may include a plurality of plastic films bonded by an adhesive or may include a glass substrate and a plastic film bonded by an adhesive. FIG.2Ais a perspective view of an electronic device according to an embodiment of the present inventive concepts, andFIG.2Bis a cross-sectional view of an electronic device according to an embodiment of the present inventive concepts. When a description is given about the embodiments ofFIG.2AandFIG.2B, a component described with reference to the embodiments ofFIG.1AandFIG.1Bis denoted by the same reference numeral, and a repeated description thereof may be omitted for convenience of explanation. Referring to the embodiments ofFIG.2AandFIG.2B, an electronic device DDa may display an image IM through a display surface DD-ISa. The display surface DD-ISa may include an active area DD-AAa and a peripheral area DD-NAA adjacent to the active area DD-AAa. As shown in the embodiment ofFIG.2A, a first active area FA and a second active area BA bent from the first active area FA may be defined in the active area DD-AAa. In an embodiment, the second active area BA may be provided in plurality. In this embodiment, the plurality of second active areas BA may be respectively provided bent from at least two sides of the first active area FA. In an embodiment, the active area DD-AAa may include one first active area FA and one to four second active areas BA. However, embodiments of the present inventive concepts are not limited thereto, and the active area DD-AAa may have various different arrangements with respect to the first active area FA and the second active areas BA. The electronic device DDa may include a display panel DPa, an input sensor ISa, and a window WPa. A portion of the display panel DPa overlapping the second active area BA may be bent. A sensing area SPa and an antenna area APa may be defined in the input sensor ISa. When viewed in a plane, the sensing area SPa may overlap the first active area FA and a partial portion of the second active area BA. The antenna area APa may overlap another partial portion of the second active area BA. However, embodiments of the present inventive concepts are not limited thereto. FIG.3is a plan view of a display panel according to an embodiment of the present inventive concepts. Referring to the embodiment ofFIG.3, an active area DP-AA and a peripheral area DP-NAA adjacent to the active area DP-AA may be defined in the display panel DP. The active area DP-AA may be an area in which the image IM (seeFIG.1A) is displayed. A plurality of pixels PX may be arranged m the active area DP-AA. The peripheral area DP-NAA may be an area in which a driving circuit, a driving line, or the like is disposed. When viewed in a plane, the active area DP-AA may overlap the active area DD-AA (seeFIG.1A) of the electronic device DD (seeFIG.1A) or the active area DD-AAa (seeFIG.2A) of the electronic device DDa (seeFIG.2A), and the peripheral area DP-NAA may overlap the peripheral area DD-NAA (seeFIG.1AandFIG.2A). As shown in the embodiment ofFIG.3, the display panel DP may include a base layer SUB, the plurality of pixels PX, a plurality of signal lines GL, DL, PL, and EL, a plurality of display pads PDD, and a plurality of sending pads PDT. In an embodiment, each of the plurality of pixels PX may display one of primary colors or one of mixed colors. For example, the primary colors may include red, green, or blue. The mixed colors may include various colors such as white yellow, cyan, and magenta. However, embodiments of the present inventive concepts are not limited thereto and a color displayed by each of the pixels PX may vary. The plurality of signal lines, such as a plurality of scan lines GL, a plurality of data lines DL, a plurality of power lines PL, and a plurality of light emission control lines EL may be disposed on the base layer SUB. The plurality of signal lines may be connected to the plurality of pixels PX to transmit electrical signals to the plurality of pixels PX. The plurality of signal lines may include a plurality of scan lines GL, a plurality of data lines DL, a plurality of power lines PL, and a plurality of light emission control lines EL. However, embodiments of the present inventive concepts are not limited thereto and the configuration of the plurality of signal lines may vary. For example, in an embodiment of the present inventive concepts, the plurality of signal lines may further include an initialization voltage line. A power pattern VDD may be disposed in the peripheral area DP-NAA. For example, the power pattern VDD may be disposed in a lower portion of the peripheral area DP-NAA (e.g. in the second direction DR2). However, embodiments of the present inventive concepts are not limited thereto. The power pattern VDD may be connected to the plurality of power lines PL. The display panel DP may provide the same power signal to the plurality of pixels PX by including the power pattern VDD. The plurality of display pads PDD may be disposed in the peripheral area DP-NAA. For example, the plurality of display pads PDD may be disposed in a lower portion of the peripheral area DP-NAA (e.g. in the second direction DR2). However, embodiments of the present inventive concepts are not limited thereto. The plurality of display pads PDD may include a first pad PD1and a second pad PD2. The first pad PD1may be provided in plurality. The plurality of first pads PD1may be respectively connected to the plurality of data lines DL. The second pad PD2may be connected to the power pattern VDD to be electrically connected to the plurality of power lines PL. The display panel DP may provide the plurality of pixels PX with electrical signals provided from the outside through the plurality of display pads PDD. Meanwhile, the plurality of display pads PDD may further include pads for receiving other electrical signals in addition to the first pod PD1and the second pad PD2, and are not limited to any one embodiment. A driving chip IC may be mounted in the peripheral area DP-NAA. The driving chip IC may be a timing control circuit in the form of a chip. The plurality of data lines DL may be electrically connected to the plurality of first pads PD1, respectively, through the driving chip IC. However, embodiments of the present inventive concepts are not limited thereto. For example, in an embodiment the driving chip IC may be mounted on a film that is separate from the display panel DP. In this embodiment, the driving chip IC may be electrically connected to the plurality of display pads PDD through the film. The plurality of sensing pads PDT may be disposed in the peripheral area DP-NAA. The plurality of sensing pads PDT may be electrically connected to a plurality of sensing electrodes, respectively, of the input sensor IS (seeFIG.5A) to be described later. The plurality of sensing pads PDT may include a plurality of first sensing pads TD1and a plurality of second sensing pads TD2. FIG.4is a cross-sectional view of a display panel according to an embodiment of the present inventive concepts. Referring to the embodiment ofFIG.4, the display panel DP may include the base layer SUB, a display circuit layer DP-CL, an image implementation layer DP-OLED, and a thin film encapsulation layer TFL. The display panel DP may include a plurality of insulating layers, semiconductor patterns, a conductive pattern, a signal line, and the like. In an embodiment, each of the insulating layers, a semiconductor layer, and a conductive layer may be formed in a method such as coaling and deposition. Thereafter, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned in a photolithography method. In this method, the semiconductor patterns, the conductive pattern, the signal line, and the like, which are included in the display circuit layer DP-CL and the image implementation layer DP-OLED, may be formed. As shown in the embodiment ofFIG.4, the base layer SUB may be a base substrate supporting the display circuit layer DP-CL and the image implementation layer DP-OLED. In an embodiment, the base layer SUB may include a synthetic resin layer. The synthetic resin layer may include thermosetting resin. The base layer SUB may have a multilayer structure. For example, the base layer SUB may include a first synthetic resin layer, a silicon oxide (SiOx) layer disposed on the first synthetic resin layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. However, embodiments of the present inventive concepts are not limited thereto. The silicon oxide layer and the amorphous silicon layer may be referred to as a base banter layer. Each of the first and second synthetic resin layers may include polyimide-based resin. Alternatively, each of the first and second synthetic resin layers may include at least one compound selected from acrylate-based resin, methacrylate-based resin, polyisoprene-based resin, vinyl-based resin, epoxy-based resin, urethane-based resin cellulose-based resin, siloxane-based resin, polyamide-based resin, and perylene-based resin. In this specification, meanwhile, “˜˜”-based resin means that the resin includes a functional group of “˜˜”. In addition, the base layer SUB may include a glass substrate, an organic/inorganic composite material substrate, or the like. At least one inorganic layer may be disposed on a top surface of the base layer SUB. In an embodiment, the inorganic layer may include at least one compound selected from aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed in multiple inorganic layers. The multiple inorganic layers may include a barrier layer and/or a buffer layer. In this embodiment, the display panel DP is illustrated as including a buffer layer BFL. The display circuit layer DP-CL may be disposed on the base layer SUB. The display circuit layer DP-CL may provide a signal for driving a light emitting device OLED included in the image implementation layer DP-OLED. As shown in the embodiment ofFIG.4, the display circuit layer DP-CL may include the buffer layer BFL, a first transistor T1, a second transistor T2, a first insulating layer10, a second insulating layer20, a third insulating layer30, a fourth insulating layer40, a fifth insulating layer50, and a sixth insulating layer60. The buffer layer BFL may increase the bonding force between the base layer SUB and each of the semiconductor patterns. In an embodiment, the buffer layer BFL may include a silicon oxide layer and a silicon nitride layer. For example, the silicon oxide layer and the silicon nitride layer may be alternately laminated. The semiconductor pattern may be disposed on the buffer layer BFL. For example, the semiconductor pattern may be disposed directly on the buffer layer BFL (e.g., in the third direction DR3). The semiconductor pattern may include polysilicon. However, embodiments of the present inventive concepts are not limited thereto and the semiconductor pattern may include various different materials, such as amorphous silicon or metal oxide. FIG.4illustrates only a partial portion of the semiconductor patterns. However, additional semiconductor patterns may be further disposed in another area of the pixel PX when viewed in a plane. In an embodiment, the semiconductor patterns may be arranged in a specific rule across the plurality of pixels PX. The semiconductor pattern may have different electrical properties depending on whether the same is doped. The semiconductor pattern may include a first region having high conductivity and a second region having low conductivity. The first region may be doped with an N-type dopant or a P-type dopant A P-type transistor may include a doped region doped with the P-type dopant, and an N-type transistor may include a doped region doped with the N-type dopant. The second region may be a non-doped region or a region doped in a lower concentration than the first region. In an embodiment, the conductivity of the first region may be higher than the conductivity of the second region, and the first region may substantially serve as an electrode or a signal line. The second region may substantially correspond to an active (or a channel) of the transistor. For example, a partial portion of the semiconductor pattern may be the active of the transistor, another partial portion thereof may be a source or a drain of the transistor, and another partial portion thereof may be a connection electrode or a connection signal line. In an embodiment, each of the plurality of pixels PX (seeFIG.3) may have an equivalent circuit including seven transistors, one capacitor, and a light emitting device. However, embodiments of the present inventive concepts are not limited thereto and the equivalent circuit of the pixel may have various different forms. In the embodiment ofFIG.4, the two transistors, such as the first transistor T1and the second transistor T2, and the light emitting device OLED included in each of the plurality of pixels PX (seeFIG.3) are illustrated. The first transistor T1may include a source S1, an active A1, a drain D1, and a gate G1. The second transistor T2may include a source S2, an active A2, a drain D2, a gate G2, and an upper electrode UE. The source S1, the active A1, and the drain D1of the first transistor T1may be formed from a semiconductor pattern of the semiconductor patterns, and the source S2, the active A2, and the drain D2of the second transistor T2may be formed from a semiconductor pattern of the semiconductor patterns. When viewed on the cross section, the source S1and the drain D1may respectively extend in opposite directions (e.g., the second direction DR2) from the active A1, and the source S2and the drain D2may respectively extend in opposite directions (e.g., the second direction DR2) from the active A2.FIG.4illustrates a portion of a connection signal line SCL formed from the semiconductor pattern. In an embodiment, the connection signal line SCL may be electrically connected to the drain D2of the second transistor T2when viewed in a plane. The first insulating layer10may be disposed on the buffer layer BFL (e.g., directly thereon in the third direction DR3). The first insulating layer10may overlap the plurality of pixels PX in common and may cover the semiconductor pattern. The first insulating layer10may be an inorganic layer and/or an organic layer and may have a single-layer structure or a multilayer structure. In an embodiment, the first insulating layer10may include at least one compound selected from aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer10may be a single-layer silicon oxide layer. In addition to the first insulating layer10, an insulating layer of the display circuit layer DP-CL to be described later may be an inorganic layer and/or an organic layer and may have a single-layer structure or a multilayer structure. The inorganic layer may include at least one of the above-described materials. The gates G1and G2may be disposed on the first insulating layer10(e.g., directly thereon in the third direction DR3). In an embodiment, the gates G1and G2may be portions of a metal pattern. The gates G1and G2may respectively overlap the actives A1and A2(e.g., in the third direction DR3). In an embodiment, in a process of doping the semiconductor patterns, the gates G1and G2may function as a mask. The second insulating layer20may be disposed on the first insulating layer10(e.g., directly thereon in the third direction DR3). The second insulating layer20may cover the gates G1and G2. The second insulating layer20may overlap (e.g. in the third direction DR3) the plurality of pixels PX in common. The second insulating layer20may be an inorganic layer and/or an organic layer and may have a single-layer structure or a multilayer structure. For example, the second insulating layer20may be a single-layer silicon oxide layer. The upper electrode UE may be disposed on the second insulating layer20(e.g., directly thereon in the third direction DR3). The upper electrode UE may overlap the gate G2(e.g. in the third direction DR3). In an embodiment, the upper electrode UE may be a portion of the metal pattern. A portion of the gate G2and the upper electrode UE overlapping the portion may define a capacitor. However, embodiments of the present inventive concepts are not limited thereto. For example, in some embodiments, the upper electrode UE may be omitted. The third insulating layer30may be disposed on the second insulating layer20(e.g., directly thereon in the third direction DR3) Die third insulating layer30may cover the upper electrode UE. In this embodiment, the third insulating layer30may be a single-layer silicon oxide layer. A first connection electrode CNE1may be disposed on the third insulating layer30. As shown in the embodiment ofFIG.4, the first connection electrode CNE1may be connected to the connection signal line SCL through a contact hole CNT-1penetrating the first to third insulating lavers10,20, and30. The fourth insulating layer40may be disposed on the third insulating layer30(e.g., directly thereon in the third direction DR3). The fourth insulating layer40may cover the first connection electrode CNE1. In an embodiment, the fourth insulating layer40may be a single-layer silicon oxide layer. The fifth insulating layer50may be disposed on the fourth insulating layer40(e.g., directly thereon in the third direction DR3). In an embodiment, the fifth insulating layer50may be an organic layer. A second connection electrode CNE2may be disposed on the fifth insulating layer50. As shown in the embodiment ofFIG.4, the second connection electrode CNE2may be connected to the first connection electrode CNE1through a contact hole CNT-2penetrating the fourth insulating layer40and the fifth insulating layer50. The sixth insulating layer60may be disposed on the filth insulating layer50(e.g., directly thereon om the third direction DR3). The sixth insulating layer60may cover the second connection electrode CNE2. In an embodiment, the sixth insulating layer60may be an organic layer. As shown in the embodiment ofFIG.4, the image implementation layer DP-OLED may include a first electrode AE, a pixel defining film PDL, and the light emitting device OLED. The first electrode AE may be disposed on the sixth insulating layer60(e.g., directly thereon in the third direction DR3). As shown in the embodiment ofFIG.4, the first electrode AE may be connected to the second connection electrode CNE2through a contact hole CNT-3penetrating the sixth insulating layer60. An opening OP may be defined in the pixel defining film PDL. The opening OP of the pixel defining film PDL may expose at least a partial portion of the first electrode AE. For example, as shown in the embodiment ofFIG.4, the opening OP may expose a central portion (e.g., in the second direction DR2) of the first electrode AE. The active area DP-AA (seeFIG.3) may include a light emitting area PXA and a light blocking area NPXA adjacent to the light emitting area PXA. The light blocking area NPXA may surround the light emitting area PXA. In this embodiment, the light emitting area PXA is defined to correspond to the portion of the first electrode AE exposed by the opening OP. A hole control layer HCL may be disposed in common in the light emitting area PXA and the light blocking area NPXA. The hole control layer HCL may include a hole transport layer and may further include a hole injection layer. A light emitting layer EML may be disposed on the hole control layer HCL (e.g., directly thereon in the third direction DR3). The light emitting layer EML may be disposed in an area corresponding to the opening OP. Accordingly, the light emitting layer EML may be separately formed in each of the pixels. An electron control layer ECL may be disposed on the light emitting layer EML (e.g., directly thereon in the third direction DR3). In an embodiment the electron control layer ECL may include an electron transport layer and may further include an electron injection layer. In an embodiment, the hole control layer HCL and the electron control layer ECL may be formed in common in the plurality of pixels by using an open mask. A second electrode CE may be disposed on the electron control layer ECL (e.g., directly thereon in the third direction DR3). In an embodiment, the second electrode CE may base an integral shape. For example, the second electrode CE may be disposed in common in the plurality of pixels PX. The thin film encapsulation layer TFL may be disposed on the image implementation layer DP-OLED (e.g., directly thereon in the third direction DR3) to cover the image implementation layer DP-OLED. In an embodiment, the thin film encapsulation layer TFL may include a first inorganic layer, an organic layer, and a second inorganic layer sequentially laminated in the third direction DR3. However, embodiments of the present inventive concepts are not limited thereto and the thin film encapsulation layer TFL may be variously arranged to include at least one inorganic layer and at least one organic layer. For example, the thin film encapsulation layer TFL according to an embodiment of the present inventive concepts may further include a plurality of inorganic layers and a plurality of organic layers. The first inorganic layer may prevent external moisture or oxygen from permeating the image implementation layer DP-OLED. For example, in an embodiment, the first inorganic layer may include silicon nitride, silicon oxide or a compound thereof. The organic layer may be disposed on the first inorganic layer to provide a flat surface. A curve formed on a top surface of the first inorganic layer or particles present on the first inorganic layer may be covered by the organic layer. For example, in an embodiment, the organic layer may include an acrylate-based organic layer. However, embodiments of the present inventive concepts are not limited thereto. The second inorganic layer may be disposed on the organic layer to cover the organic layer. The second inorganic layer may block, moisture or the like emitted from the organic layer to prevent the moisture or the like from being introduced to the outside. In an embodiment, the second inorganic layer may include silicon nitride, silicon oxide, or a compound thereof. However, embodiments of the present inventive concepts are not limited thereto. FIG.5Ais a plan view of an input sensor according to an embodiment of the present inventive concepts, andFIG.5Bis a cross-sectional view taken along line I-I′ ofFIG.5Aaccording to an embodiment of the inventive concepts. Referring to the embodiments ofFIG.5AandFIG.5B, an active area IS-AA and a peripheral area IS-NAA surrounding the active area IS-AA may be defined in the input sensor IS. For example, as shown in the embodiment ofFIG.5A, the peripheral area IS-NAA may completely surround the active area IS-AA (e.g., in the first and second directions DR1, DR2). However, embodiments of the present inventive concepts are not limited thereto. The active area IS-AA may be an area that is activated according to an electrical signal. When viewed in a plane, the active area IS-AA may overlap the active area DP-AA (seeFIG.3) of the display panel DP (seeFIG.3), and the peripheral area IS-NAA may overlap the peripheral area DP-NAA (seeFIG.3) of the display panel DP (seeFIG.3). As shown in the embodiment ofFIG.5A, the active area IS-AA may include the sensing SP and the antenna area AP. A plurality of sensing electrodes, such as first sensing electrodes TE1and second sensing electrodes TE2, may be disposed in the sensing area SP. The plurality of antennas ANT may be disposed in the antenna area AP. For example, as shown in the embodiment ofFIG.5A, the plurality of antennas ANT may be disposed on a left side (e.g., in the first direction DR1) in the active area IS-AA. However, embodiments of the present inventive concepts are not limited thereto and the plurality of antennas ANT may be disposed in the antenna area AP in various different regions of the active area IS-AA. The plurality of antennas ANT may be referred to as a plurality of radio frequency devices ANT which may transmit, receive or transmit and receive radio frequencies. A dummy pattern may be further disposed in the antenna area AP. The dummy pattern may reduce a difference in reflectance between an area in which each of the antennas ANT is disposed and an area in which the antenna ANT is not disposed. Accordingly, the dummy pattern may prevent the antenna ANT from being viewed from the outside by a user. The input sensor IS may include a base insulating layer IS-IL0, the plurality of sensing electrodes, such as the first sensing electrodes TE1and the second sensing electrodes TE2, a plurality of sensing lines, such as first sensing lines TL1and second sensing lines TL2, the plurality of antennas ANT, and a plurality of antenna pads ANP. In an embodiment, the base insulating layer IS-IL0may be an inorganic layer including at least one compound selected from silicon nitride, silicon oxynitride, and silicon oxide. In an embodiment, the base insulating layer IS-IL0may be an organic layer including at least one material selected from epoxy resin, acrylic resin and imide-based resin. In an embodiment, the base insulating layer IS-IL0may be directly formed on the display panel DP (seeFIG.1B). However, embodiments of the present inventive concepts are not limited thereto. For example, in another embodiment, the base insulating layer IS-IL0may be bonded to the display panel DP (seeFIG.1B) by an adhesive member. The plurality of sensing electrodes, such as the first sensing electrodes TE1and the second sensing electrodes TE2, may be disposed in the sensing area SP. In an embodiment, the plurality of sensing electrodes may include the plurality of first sensing electrodes TE1and the plurality of second sensing electrodes TE2. The input sensor IS may obtain information about an external input through a change in capacitance between the plurality of first sensing electrodes TE1and the plurality of second sensing electrodes TE2. As shown in the embodiment ofFIG.5A, each of the plurality of first sensing electrodes TE1may extend in the first direction DR1. The plurality of first sensing electrodes TE1may be arranged in the second direction DR2. Each of the plurality of first sensing electrodes TE1may include a plurality of first ports SP1and a plurality of second parts BP1. Each of the plurality of second sensing electrodes TE2may extend in the second direction DR2. The plurality of second sensing electrodes TE2may be arranged in the first direction DR1. Each of the plurality of second sensing electrodes TE2may include a plurality of sensing patterns SP2and a plurality of bridge patterns BP2. In the embodiment ofFIG.5A, each sensing pattern SP2includes two bridge patterns BP2that are connected to adjacent sensing patterns SP2. However, embodiments of the present inventive concepts are not limited thereto and the plurality of bridge patterns BP2and the plurality of sensing patterns SP2may vary in other embodiments. For example, two adjacent sensing patterns SP2may be connected to each oilier by one bridge pattern BP2. In an embodiment, the plurality of second parts BP1may be disposed in a layer that is different from the layer that the plurality of bridge patterns BP2are disposed thereon. For example, the plurality of bridge patterns BP2may cross the plurality of first sensing electrodes TE1in an insulated manner. For example, the plurality of second parts BP1may respectively cross the plurality of bridge patterns BP2in an insulated manner. As shown in the embodiment ofFIG.5B, the plurality of bridge patterns BP2may be disposed on the base insulating layer IS-IL0. For example, a lower surface of the plurality of bridge patterns BP2may directly contact an upper surface of the base insulating layer IS-IL0. A first insulating layer IS-IL1may be disposed on the base insulating layer IS-IL0. The first insulating layer IS-IL1may cover the plurality of bridge patterns BP2. For example, as shown in the embodiment ofFIG.5B, the first insulating layer IS-IL1may be disposed directly on an upper surface of the base insulating layer IS-IL0and an upper and lateral sides surfaces of the bridge patterns BP2. The first insulating layer IS-IL1may include an inorganic material, an organic material, or a composite material. As shown in the embodiment ofFIG.5B, the plurality of sensing patterns SP2, the plurality of first parts SP1, the plurality of second parts BP1, and the plurality of antennas ANT may be disposed on the first insulating layer IS-IL1. For example, the plurality of sensing patterns SP2, the plurality of first parts SP1, the plurality of second parts BP1, and the plurality of antennas ANT may be disposed directly on the first insulating layer IS-IL1. The plurality of antennas ANT may be disposed in the same layer as the plurality of sensing patterns SP2, the plurality of first parts SP1, and the plurality of second parts BP1. For example, in an embodiment, the plurality of sensing patterns SP2, the plurality of first parts SP1, the plurality of second parts BP1, and the plurality of antennas ANT may have a mesh structure. A plurality of contact holes CNT may be formed by penetrating the first insulating layer IS-IL1in a thickness direction. For example, the thickness direction may be parallel to the third direction DR3(seeFIG.5A). Two adjacent sensing patterns SP2among the plurality of sensing patterns SP2may be electrically connected to a bridge patient BP2through the plurality of contact holes CNT. For example, as shown in the embodiment ofFIG.5B, lower surfaces of the adjacent sensing patterns SP2may contact the bridge patterns BP2through the contact holes CNT. A second insulating layer IS-IL2may be disposed on the first insulating layer IS-IL1. For example, the second insulating layer IS-IL2may be disposed directly on an tipper surface of the first insulating layer IS-IL1and an upper surface and lateral side surfaces of the plurality of sensing patterns SP2, the plurality of first parts SP1, the plurality of second parts BP1, and the plurality of antennas ANT. The second insulating layer IS-IL2may cover the plurality of sensing patterns SP2, the plurality of first parts SP1, the plurality of second parts BP1, and the plurality of antennas ANT. The second insulating layer IS-IL2may have a single-layer structure or a multilayer structure. The second insulating layer IS-IL2may include an inorganic material, an organic material, or a composite material. Although the embodiment ofFIG.5Bincludes a bottom bridge structure in which the plurality of bridge patterns BP2are disposed below the plurality of sensing patterns SP2, the plurality of first parts SP1, and the plurality of second parts BP1, embodiments of the present inventive concepts are not limited thereto and the structure of the input sensor IS may vary. For example, the input sensor IS according to an embodiment of the present inventive concepts may have a top bridge structure in which the plurality of bridge patterns BP2are disposed above the plurality of sensing patterns SP2, the plurality of first parts SP1, and the plurality of second parts BP1and upper surfaces of the plurality of sensing patterns SP2may contact the bridge patterns BP2. Although the embodiment ofFIG.5Bexemplarily illustrates the plurality of antennas ANT disposed on the first insulating layer IS-IL1and covered by the second insulating layer IS-IL2, the structure of the plurality of antennas ANT according to an embodiment of the present inventive concepts is not limited thereto. For example, in an embodiment of the present inventive concepts, the plurality of antennas ANT may be disposed on the base insulating layer IS-IL0and covered by the first insulating layer IS-IL1. For example, the base insulating layer IS-IL0may directly contact an upper surface and lateral side surfaces of each of the plurality of antennas ANT. The plurality of sensing lines may include a plurality of first sensing lines TL1and a plurality of second sensing lines TL2. The plurality of first sensing lines TL1may be electrically connected to the plurality of first sensing electrodes TE1, respectively. The plurality of second sensing lines TL2may be electrically connected to the plurality of second sensing electrodes TE2, respectively. The plurality of first sensing pads TD1(seeFIG.3) may be electrically connected to the plurality of first sensing lines TL1, respectively, through contact holes. The plurality of second sensing pads TD2(seeFIG.3) may be electrically connected to the plurality of second sensing lines TL2, respectively, through contact holes. The plurality of antennas ANT may be electrically connected to the plurality of antenna pads ANP, respectively. In an embodiment, the plurality of antennas ANT may include the same material as at least some of the plurality of first and second sensing electrodes TE1and TE2, and may be formed through the same process as at least some of the plurality of first and second sensing electrodes TE1and TE2. For example, in an embodiment, the plurality of first sensing electrodes TE1and the plurality of antennas ANT may include carbon nanotubes, metal and or a metal alloy, or a composite material thereof, and may have a single-layer structure or a multilayer structure in which titanium (Ti), aluminum (Al), and titanium (Ti) are sequentially laminated. However, embodiments of the present inventive concepts are not limited thereto, and the plurality of antennas ANT according to an embodiment of the present inventive concepts may include a material different from the material of the plurality of first sensing electrodes TE1, and may be formed through a process separate from the process of forming the plurality of first sensing electrodes TE1. For example, the plurality of first sensing electrodes TE1may have a multilayer structure in which titanium (Ti), aluminum (Al), and titanium (Ti) are sequentially laminated, and the plurality of antennas ANT may include carbon nanotubes, metal and/or a metal alloy, or a composite material thereof and may have a single-layer structure or a multilayer structure. For example, the metal material may be at least one compound selected from silver (Ag), copper (Cu), aluminum (Al), gold (Au), and platinum (Pt). However, embodiments of the present inventive concepts are not limited thereto. The plurality of antennas ANT may further include at least one ground electrode disposed below the base insulating layer IS-IL0. However, embodiments of the present inventive concepts are not limited thereto and the structure of the ground electrode may vary. For example, in an embodiment of the present inventive concepts, the ground electrode may be the second electrode CE (seeFIG.4) of the display panel DP (seeFIG.4). The plurality of antenna pads ANP may supply different power levels to the plurality of antennas ANT through the plurality of antenna pads ANP. Therethrough, beamforming of the plurality of antennas ANT may be adjusted. The beamforming may be to form a radio wave beam so that the plurality of antennas ANT have directionality to radiate or receive a signal in a desired specific direction. In an embodiment, the signal radiated or received by the plurality of antennas ANT may be a super high frequency (SHF) signal or an extremely high frequency (EHF) signal having a band of high frequencies. A signal having a band of high frequencies has, in terms of characteristics of the signal, a shorter propagation distance and a lower power of penetration than a signal having a band of low frequencies. According to an embodiment of the present inventive concepts, however, the beamforming of the plurality if antennas ANT may be adjusted by adjusting the power supplied to each of the plurality of antennas ANT. By concentrating a signal that the plurality of antennas ANT receive, transmit, or transmit and receive towards a specific direction, the level of the energy may be increased, and a desired radiation pattern may be formed. Accordingly, the electronic device DD (seeFIG.1A) may be provided which has an increased transmission distance for the signal. Further, according to an embodiment of the present inventive concepts, the plurality of antennas ANT may constitute an array antenna, and an array gain may be increased and interference reduction may be increased. The array gain is a gain obtainable when maximizing a signal to noise ratio (SNR) of a desired received signal among signals transmitted through multiple channels by using spatial signal processing while the channel information of the signals is known. The interference reduction is a gain obtainable by attenuating a signal subject to relatively large interference among signals transmitted through multiple paths. Accordingly, it may the electronic device DD (seeFIG.1A) may have an increased antenna gain. Although the embodiment ofFIG.5Aincludes three antennas ANT and three antenna pads ANP, the number of each of the plurality of antennas ANT and the plurality of antenna pads ANP according to an embodiment of the present inventive concepts are not limited thereto. For example, the numbers of the antennas ANT and the antenna pads ANP may be two or four or more in embodiments of the present inventive concepts. FIG.6illustrates one of a plurality of antennas according to an embodiment of the present inventive concepts.FIG.7Ais a graph showing characteristic impedance and a power transfer ratio according to an embodiment of the present inventive concepts.FIG.7Bis a graph showing an S-parameter according to frequency of one of the antennas according to an embodiment of the present inventive concepts.FIG.7Cis a graph showing a total gain according to frequency of one of the antennas according to an embodiment of the present inventive concepts. Referring to the embodiments ofFIG.6toFIG.7C, the antenna ANT may be configured to transmit, receive, or transmit and receive a signal having a frequency band BW (FIG.7B). As shown in the embodiment ofFIG.7B, the frequency band BW may include a first frequency f1, a second frequency f2, a third frequency f3, and a fourth frequency f4. As shown in the embodiment ofFIG.6, the antenna ANT may include a first antenna portion AP1, a plurality of intermediate antenna portions MAP, and a second antenna portion AP2. The first antenna portion AP1may be disposed at a first end of the antenna ANT. The first antenna portion AP1may include a first pattern portion PP1and a first line portion LP1extending from one side of the first pattern portion PP1in the second direction DR2. The size of the first pattern portion PP1may be vary according to a desired frequency of a signal to be transmitted, received, or transmitted and received. The second antenna portion AP2may be disposed on a second end of the antenna ANT which is opposite (e.g., in the second direction DR2) to the first end of the antenna ANT. The second antenna portion AP2may be connected to an antenna pad ANP (seeFIG.5A). The second antenna portion AP2may be spaced apart from the first antenna portion AP1in the second direction DR2. The second antenna portion AP2may include a second pattern portion PP2and a second line portion LP2extending from one side of the second pattern portion PP2in the second direction DR2. As shown in the embodiment ofFIG.6, the size of the second pattern portion PP2may be substantially the same as the size of the first pattern portion PP1. However, embodiments of the present inventive concepts are not limited thereto and the size of the second pattern portion PP2may be different from the sizes of the first pattern portion PP1. The plurality of intermediate antenna portions MAP may be disposed between the first antenna portion AP1and the second antenna portion AP2(e.g., in the second direction DR2). As shown in the embodiment ofFIG.6, the plurality of intermediate antenna portions MAP may include a first intermediate antenna portion MA1, a second intermediate antenna portion MA2, and a third intermediate antenna portion MA3. The first intermediate antenna portion MA1may be disposed between the first antenna portion AP1and the second intermediate antenna portion MA2(e.g., in the second direction DR2). As shown in the embodiment ofFIG.6, the first intermediate antenna portion MA1may include a first intermediate pattern portion MP1and a first intermediate line portion ML1extending from one side of the first intermediate pattern portion MP1in the second direction DR2. In an embodiment, the size of the first intermediate pattern portion MP1may be substantially the same as the size of the first pattern portion PP1. However, embodiments of the present inventive concepts are not limited thereto, and the size of the first intermediate pattern portion MP1may be different from the sire of the first pattern portion PP1in some embodiments. The second intermediate antenna portion MA2may be disposed between the first intermediate antenna portion MA1and the third intermediate antenna portion MA3(e.g., in the second direction DR2). The second intermediate antenna portion MA2may include a second intermediate pattern portion MP2and a second intermediate line portion ML2extending in the second direction DR2. As shown in the embodiment ofFIG.6, the size of the second intermediate pattern portion MP2may be substantially the same as the size of the first pattern portion PP1. However, embodiments of the present inventive concepts are not limited thereto and the size of the second intermediate pattern portion MP2may be different from the size of the first pattern portion PP1in some embodiments. The third intermediate antenna portion MA3may be disposed between the second antenna portion AP2and the second intermediate antenna portion MA2(e.g., in the second direction DR2). The third intermediate antenna portion MA3may include a third intermediate pattern portion MP3and a third intermediate line portion ML3extending from one side of the third intermediate pattern portion MP3in the second direction DR2. As shown in the embodiment ofFIG.6, the size of the third intermediate pattern portion MP3may be substantially the same as the size of the first pattern portion PP1. However embodiments of the present inventive concepts are not limited thereto and the size of the third intermediate pattern portion MP3may be different from the size of the first pattern portion PP1in some embodiments. Although the embodiment ofFIG.6includes three intermediate antenna portions MAP, the number of the intermediate antenna portions MAP according to an embodiment of the present inventive concepts is not limited thereto. For example, the number of the intermediate antenna portions MAP may be vary according to a desired frequency hand of a signal to be transmitted, received, or transmitted and received. For example, the number of the plurality of intermediate antenna portions MAP may be two or four or more in some embodiments. Furthermore, although the embodiment ofFIG.6shows the first antenna portion AP1, the intermediate antenna portions MAP and the second antenna portion AP2arranged in the second direction DR2with respect to each other, the first antenna portion AP1, the intermediate antenna portions MAP anti the second antenna portion AP2may have various different arrangements with respect to each other. For example, the first antenna portion AP1, the intermediate antenna portions MAP and the second antenna portion AP2may be arranged with respect to each other in another specific direction, such as the first direction DR1or a direction between the first and second directions DR1, DR2. Additionally, the antenna ANT may have a various different shapes. As shown in the embodiment ofFIG.6, the first antenna portion AP1, the first intermediate antenna portion MA1, the second intermediate antenna portion MA2, the third intermediate antenna portion MA3, and the second antenna portion AP2may be arranged in the second direction DR2. The first line portion LP1may connect the first pattern portion PP1and the first intermediate pattern portion MP1to each other. For example, the first line portion LP1may extend from one side of the first pattern portion PP1to an adjacent side of the first intermediate pattern portion MP1. The first intermediate line portion ML1may connect the first intermediate pattern portion MP1and the second intermediate pattern portion MP2. For example, the first intermediate line portion ML1may extend from one side of the first intermediate pattern portion MP1to an adjacent side of the second intermediate pattern portion MP2. The second intermediate line portion ML2may connect the second intermediate pattern portion MP2and the third intermediate pattern portion MP3. For example, the second intermediate line portion ML2may extend from one side of the second intermediate pattern portion MP2to an adjacent side of the third intermediate pattern portion MP3. The third intermediate line portion ML3may connect the third intermediate pattern portion MP3and the second pattern portion PP2. For example, the third intermediate line portion ML3may extend from one side of the third intermediate pattern portion MP3to an adjacent side of the second pattern portion PP2. However, embodiments of the present inventive concepts are not limned thereto. The first line portion LP1may have a first length DS1in the second direction DR2. The second line portion LP2may have a second length DS2in the second direction DR2. In an embodiment, the first length DS1may be substantially the same as the second length DS2. The first intermediate line portion ML1may have a third length DS3in the second direction DR2. The second intermediate line portion ML2may have a fourth length DS4in the second direction DR2. The third intermediate line portion ML3may have a fifth length DS5in the second direction DR2. In an embodiment, the third length DS3, the fourth length DS4, and the fifth length DS5may be substantially the same as the first length DS1and the second length DS2. The first line portion LP1may have a first width WD1in the first direction DR1. The second line portion LP2may have a second width WD2in the first direction DR1. The first intermediate line portion ML1may have a third width WD3in the first direction DR1. The second intermediate line portion ML2may have a fourth width WD4in the first direction DR1. The third intermediate line portion ML3may have a fifth width WD5in the first direction DR1. As shown in the embodiment ofFIG.6, the first width WD1may be smaller than the third width WD3. The third width WD3may be smaller than the fourth width WD4. The fourth width WD4may be smaller than the fifth width WD5. The fifth width WD5may be smaller than the second width WD2. In the embodiment ofFIG.7B, S11may be one of S-parameters. S11may be a ratio of strength of a reflected signal resulting from the reflection of an input signal to strength of the input signal. When determining the operation of the antenna ANT, an S11value of about −10 dB may serve as a reference value. The value of about −10 dB may refer to a case in which the strength of the reflected signal resulting from the reflection of the input signal is about 10% of the strength of the input signal. In an embodiment, when S11is less than about −10 dB, the antenna ANT may be determined as operating at a corresponding frequency. When the antenna ANT is referred to as operating at a frequency, the antenna ANT may resonate at the frequency. The antenna ANT including the first line portion LP1, the second line portion LP2, the first intermediate line portion ML1, the second intermediate line portion ML2and the third intermediate line portion ML3having the first width WD1to the fifth width WD5, respectively, may transmit, receive, or transmit and receive a signal having the frequency band BW including the first frequency f1, the second frequency f2, the third frequency f3, and the fourth frequency f4. The signal may be radiated in the third direction DR3through a standing wave resonance and a traveling wave resonance. For example, in an embodiment the frequency band BW may include about 26.5 GHz (Gigahertz) to about 29.5 GHz and may have a bandwidth in a range of about 2.5 GHz to about 3 GHz. The first antenna portion AP1may be matched at a first impedance IM1equal to intrinsic impedance of free space. The first width WD1may determine characteristic impedance at which the first antenna portion AP1is matched. The intrinsic impedance of free space may be about 377Ω. For example, in an embodiment, the first impedance IM1may be about 377Ω. The first line portion LP1may be configured so that a signal of the first frequency f1is radiated only through the traveling wave resonance. For example, the signal of the first frequency f1may be radiated without a reflected portion of the signal through the first antenna portion AP1matched at the first impedance IM1equal to the intrinsic impedance of free space. In this case, the signal may be referred to as a first signal. As shown in the embodiment ofFIG.7B, the first frequency f1may be a frequency in a range between about 26 GHz to about 27 GHz. For example, the first frequency f1may be about 26.68 GHz. The first intermediate pattern portion MP1, the second intermediate pattern portion MP2, the third intermediate pattern portion MP3, and the second pattern portion PP2may operate at the first frequency f1. The antenna ANT may be matched at a second impedance IM2. For example, the first antenna portion AP1, the first intermediate antenna portion MA1, the second intermediate antenna portion MA2, the third intermediate antenna portion MA3and the second antenna portion AP2may be matched at the second impedance IM2. The second width WD2may determine characteristic impedance at which the antenna ANT is matched. For example, in an embodiment, the second impedance IM2may be about 50Ω. Characteristic impedance of the antenna pad ANP (secFIG.5A) may be about 50Ω. The second antenna portion AP2and the antenna pad ANP (secFIG.5A) may be impedance matched to each other. According to an embodiment of the present inventive concepts, transmission efficiency of a signal may be increased between the second antenna portion AP2and the antenna pad ANP (seeFIG.5A). Accordingly, the electronic device DD (seeFIG.1A) with increased communication efficiency may be provided. The second line portion LP2may be configured so that a signal of the fourth frequency f4is radiated through the standing wave resonance. The fourth frequency f4may be a frequency between about 28.5 GHz and about 29 GHz. For example, the fourth frequency f4may be about 28.86 GHz. The first intermediate pattern portion MP1, the second intermediate pattern portion MP2, the third intermediate pattern portion MP3, and the second pattern portion PP2may operate at the fourth frequency f4. The first antenna portion AP1and the first intermediate antenna portion MA1may be matched at a third impedance IM3. The third width WD3may determine characteristic impedance at which the first antenna portion AP1and the first intermediate antenna portion MA1are matched. In an embodiment, the third impedance IM3may be lower than the first impedance IM1. The first intermediate line portion ML1may be configured so that, at the second frequency f2, a partial portion of a signal is reflected and the remaining portion thereof is transmitted. For example, the third width WD3may be configured so that a third impedance IM3is obtained which has a first power transfer ratio for which, referring toFIG.7A, about 75% of the signal having the second frequency f2is reflected and about 25% thereof is transmitted. For example, in an embodiment, the third impedance IM3may be about 150Ω. The first intermediate line portion ML1may be configured so that the signal of the second frequency f2is radiated through the traveling wave resonance and the standing wave resonance. For example, the signal of the second frequency f2may be partially reflected at the first intermediate antenna portion MA1matched at the third impedance IM3having the first power transfer ratio, and a reflected portion of the signal may be radiated through the standing wave resonance, and a transmitted portion of the signal may be radiated through the traveling wave resonance. In this case, the signal may be referred to as a second signal. In an embodiment, the second frequency f2may be a frequency in a range of between about 27 GHz to about 28 GHz. For example, the second frequency f2may be about 27.44 GHz. The first pattern portion PP1, the second intermediate pattern portion MP2, the third intermediate pattern portion MP3, and the second pattern portion PP2may operate at the second frequency f2. The first antenna portion AP1, the first intermediate antenna portion MA1, and the second intermediate antenna portion MA2may be matched at a fourth impedance IM4. The fourth width WD4may determine characteristic impedance at which the first antenna portion AP1, the first intermediate antenna portion MA1, and the second intermediate antenna portion MA2are matched. In an embodiment, the fourth impedance IM4may be lower than the third impedance IM3. The second intermediate line portion ML2may be configured so that, at the third frequency f3, a partial portion of a signal is reflected and the remaining portion thereof is transmitted. For example, the fourth width VD4may be designed so that a fourth impedance IM4is obtained which has a second power transfer ratio for which, referring to the embodiment ofFIG.7A, about 50% of the signal having the third frequency f3is reflected and about 50% thereof is transmitted. For example, in an embodiment the fourth impedance IM4may be about 91.42Ω. The second intermediate line portion ML2may be confirmed so that the signal of the third frequency f3is radiated through the traveling wave resonance and the standing wave resonance. For example, the signal of the third frequency f3may be partially reflected at the second intermediate antenna portion MA2matched at the fourth impedance IM4having the second power transfer ratio, and a reflected portion of the signal may be radiated through the standing wave resonance, and a transmitted portion of the signal may be radiated through the traveling wave resonance. In an embodiment, the third frequency f3may be a frequency in a range of between about 28 GHZ and about 28.5 GHz. For example, the third frequency f3may be about 28.14 GHz. The first pattern portion PP1, the first intermediate pattern portion MP1, the third intermediate pattern portion MP3, and the second pattern portion PP2may operate at the third frequency f3. The first antenna portion AP1, the first intermediate antenna portion MA1, the second intermediate antenna portion MA2, and the third intermediate antenna portion MA3may be matched at a fifth impedance IM5. The fifth width WD5may determine characteristic impedance at which the first antenna portion AP1, the first intermediate antenna portion MA1, the second intermediate antenna portion MA2, and the third intermediate antenna portion MA3are matched. The fifth impedance IM5may be lower than the fourth impedance IM4and higher than the second impedance IM2. The third intermediate line portion ML3may be configured so that, at the fourth frequency f4, a partial portion of a signal is reflected and the remaining portion thereof is transmitted. For example, the fifth width WD5may be designed so that a fifth impedance IM5is obtained which has a third power transfer ratio for which, referring to the embodiment of FIG.7A, about 25% of the signal having the fourth frequency f4is reflected and about 75% thereof is transmitted. For example, the fifth impedance IM5may be about 65.47Ω. According to an embodiment of the present inventive concepts, a total antenna gain of the antenna ANT may be increased in the frequency band BW by the first pattern portion PP1, the first intermediate pattern portion MP1, the second intermediate pattern portion MP2, the third intermediate pattern portion MP3, and the second pattern portion PP2connected to each other in the second direction DR2. For example as shown in the embodiment ofFIG.7C, the total antenna gam may be maintained at about 12 dB in the frequency band BW. Accordingly, the antenna ANT with reduced loss may be provided in transmitting, receiving, or transmitting and receiving a signal. According to an embodiment of the present inventive concepts, the directionality of the antenna ANT may be increased by the first pattern portion PP1, the first intermediate pattern portion MP1, the second intermediate pattern portion MP2, the third intermediate pattern portion MP3, and the second pattern portion PP2connected to each other in the second direction DR2. The directionality may be a property of the antenna ANT having a directional concentration. For example, the antenna ANT having increased directionality may easily receive, transmit, or transmit and receive a signal having directionality. The antenna ANT may have increased concentration of the antenna gain. Accordingly, the electronic device DD (seeFIG.1A) may be provided which has, for a signal, increased communication efficiency and transmission distance. In addition, according to an embodiment of the present inventive concepts, the bandwidth of a signal the antenna ANT transmits, receives, or transmits and receives may be increased by the first pattern portion PP1, the first intermediate pattern portion MP1, the second intermediate pattern portion MP2, the third intermediate pattern portion MP3, and the second pattern portion PP2connected to each other in the second direction DR2. FIG.8is a plan view illustrating an area AA′ ofFIG.5Aaccording to an embodiment of the present inventive concepts. When a description is given about the embodiment ofFIG.8, a component described with reference to the embodiments ofFIG.4andFIG.6is denoted by the same reference numeral, and a repeated description thereof may be omitted for convenience of explanation. Referring to the embodiment ofFIG.8, the third intermediate line portion ML3may have a mesh structure. AlthoughFIG.8exemplarily illustrates the third intermediate line portion ML3, a description of the third intermediate line portion ML3given with reference to the embodiment ofFIG.8may also be applied to the antenna ANT (seeFIG.5A). Thus, the antenna ANT (seeFIG.5A) may have a mesh structure. The third intermediate line portion ML3may be disposed in the active area DP-AA (seeFIG.3) of the display panel DP (seeFIG.3). The third intermediate line portion ML3may not overlap with the light emitting area PXA. Light emitted from the plurality of pixels PX (seeFIG.3) may pass through the third intermediate line portion ML3. Accordingly, the image IM (seeFIG.1A) provided in the active area DP-AA (seeFIG.3) may be outputted to the outside through a plurality of openings OPA defined in the third intermediate line portion ML3. The light emitting area PXA may be provided in plurality. When viewed in a plane, the plurality of openings OPA may overlap the light emitting areas PXA. The mesh structure may refer to a structure in which the plurality of openings are defined in a predetermined layer. The shape of the antenna ANT (seeFIG.5A) may be changed variously in the active area IS-AA (secFIG.5A), and the design freedom of the antenna ANT (seeFIG.5A) may be increased. FIG.9Ais a cross-sectional view of an electronic device according to an embodiment of the present inventive concepts, andFIG.9Bis a plan view illustrating an antenna layer according to an embodiment of the present inventive concepts. When a description is given about the embodiment ofFIG.9A, a component described with reference to the embodiment ofFIG.1Bis denoted by the same reference numeral, and a repeated description thereof may be omitted for convenience of explanation. Referring to the embodiments ofFIG.9AandFIG.9B, an electronic device DDb may include a display panel DP, an input sensor ISb, an antenna layer ANL, and a window WP. The input sensor ISb may be disposed on the display panel DP. For example, the input sensor ISb may be disposed directly on the display panel DP. The input sensor ISb may sense an external input applied from the outside. For example, the external input may be a user input. However, embodiments of the present inventive concepts are not limited thereto and the user input may include various types of external inputs such as a part of a user's body, light, heat, pen, and pressure. According to an embodiment of the present inventive concepts, the antenna layer ANL may be disposed on the input sensor ISb. For example, the antenna layer ANL may be disposed directly on the input sensor ISb. In an embodiment, the antenna layer ANL may be formed on the input sensor ISb through a continuous process. Alternatively, the antenna layer ANL may be bonded to the input sensor ISb by an adhesive member. The adhesive member may include a typical adhesive or a typical detachable adhesive. For example, the adhesive member may be an optically clear adhesive member such as a pressure sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, and an optically clear resin (OCR). However, embodiments of the present inventive concepts are not limited thereto. The antenna layer ANL may be disposed between the input sensor ISb and the window WP (e.g., in the third direction DR3). An active area ANL-AA and a peripheral area ANL-NAA surrounding the active area ANL-AA may be defined in the antenna layer ANL. For example, as shown in the embodiment ofFIG.9B, the peripheral area ANL-NAA may completely surround the active area ANL-AA (e.g., in the first and second directions DR1, DR2). When viewed in a plane, the active area ANL-AA may overlap the active area DP-AA (seeFIG.3) of the display panel DP (seeFIG.3), and the peripheral area ANL-NAA may overlap the peripheral area DP-NAA (secFIG.3) of the display panel DP (seeFIG.3). A plurality of antennas, such as first to fourth antennas ANT1, ANT2, ANT3, and ANT4, may be disposed in the active area ANL-AA. A plurality of antenna pads, such as first to fourth antenna pads ANP1, ANP2, ANP3, and ANP4, may be disposed in the peripheral area ANL-NAA. The plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4, and the plurality of antenna pads, such as the first to fourth antenna pads ANP1, ANP2, ANP3, and ANP4, may be disposed on a base layer ANL-1. The plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4, may be electrically connected to the plurality of antenna pads, such as the first to fourth antenna pads ANP1, ANP2, ANP3, and ANP4, respectively. The plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4may extend longitudinally in the second direction DR2and may be arranged in the first direction DR1. However, embodiments of the present inventive concepts are not limited thereto, and a direction in which the plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4, are arranged and extend may vary. For example, the first to fourth antennas ANT1, ANT2, ANT3, and ANT4may also be arranged in the second direction DR2and may extend longitudinally in the first direction DR1. The plurality of antenna pads, such as the first to fourth antenna pads ANP1, ANP2, ANP3, and ANP4may supply different powers respectively to the plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4. Therethrough, beamforming of the plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4may be adjusted. The beamforming may be to form a radio wave beam so that the plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4, have directionality to radiate or receive a signal in a desired specific direction. In an embodiment, the signal may be a super high frequency (SHF) signal or an extremely high frequency (EHF) signal having a band of high frequencies. According to an embodiment of the present inventive concepts, however, the beamforming of the plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4may be adjusted by adjusting power supplied to each of the plurality of antennas, and energy may be increased by concentrating a signal toward a specific direction. In addition, radiation efficiency may be increased because a desired radiation pattern may be formed. Accordingly, the electronic device DD (seeFIG.1A) having an increased transmission distance for the signal may be provided. Further, according to an embodiment of the present inventive concepts, the plurality of antennas, such as the first to fourth antennas ANT1, ANT2, ANT3, and ANT4, may constitute an array antenna, and an array gain may be increased and interference reduction may be increased. Accordingly, the electronic device DD (seeFIG.1A) with an increased antenna gain may be provided. FIG.9Cis a plan view illustrating an antenna layer according to an embodiment of the present inventive concepts. When a description is given aboutFIG.9C, a component described with reference toFIG.9Bis denoted by the same reference numeral, and a repeated description thereof may be omitted for convenience of explanation. Referring to the embodiments ofFIG.9AandFIG.9C, a plurality of antennas, such as first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, and a plurality of antenna pads, such as first to fourth antenna pads ANP1, ANP2, ANP3, and ANP4, may be disposed on a base layer ANL-1. The plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may be electrically connected to the plurality of antenna pads, such as the first to fourth antenna pads ANP1, ANP2, ANP3, and ANP4, respectively. The plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may be arranged in the first direction DR1and may extend longitudinally in the second direction DR2. However, the direction in which the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, are arranged and extend may vary. For example, the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may also be arranged in the second direction DR2. Each of the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may include a first antenna portion AP1-1, a second antenna portion AP2-1, and a plurality of intermediate antenna portions MAP-1disposed therebetween (e.g., in the second direction DR2). The plurality of intermediate antenna portions MAP-1may include a first intermediate antenna portion MA1-1, a second intermediate antenna portion MA2-1, and a third intermediate antenna portion MA3-1. As shown in the embodiment ofFIG.9C, each of the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may be disposed in an active area ANL-AA and a peripheral area ANL-NAA. For example, as shown in the embodiment ofFIG.9C, an upper portion (e.g., in the second direction DR2) of each of the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may be disposed in the active area ANL-AA, and the remaining portion thereof, such as a lower portion (e.g., in the second direction DR2) may be disposed in the peripheral area ANL-NAA. For example, the first antenna portion AP1-1, the first intermediate antenna portion MA1-1, and the second intermediate antenna portion MA2-1may be disposed in the active area ANL-AA, and the third intermediate antenna portion MA3-1and the second antenna portion AP2-1may be disposed in the peripheral area ANL-NAA. However, embodiments of the present inventive concepts are not limited thereto. The plurality of antenna pads, such as the first to fourth antenna pads ANP1, ANP2, ANP3, and ANP4, may respectively supply the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, with different powers. Therethrough, beam forming of the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may be adjusted. The beamforming may form a radio wave beam so that the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, have directionality to radiate or receive a signal in a desired specific direction. The signal may be a super high frequency (SHF) signal or an extremely high frequency (EHF) signal having a band of high frequencies. According to an embodiment of the present inventive concepts, however, the beamforming of the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may be adjusted by adjusting power supplied to each of the plurality of antennas, and energy may be increased by concentrating a signal toward a specific direction. In addition, radiation efficiency may be increased because a desired radiation pattern may be formed. Accordingly, the electronic device DD (seeFIG.1A) having an increased transmission distance for the signal may be provided. Further, according to an embodiment of the present inventive concepts, the plurality of antennas, such as the first to fourth antennas ANT1-1, ANT2-1, ANT3-1, and ANT4-1, may constitute an array antenna, and an array gain and interference reduction may be increased. Accordingly, the electronic device DD (seeFIG.1A) with an increased antenna gain may be provided. According to an embodiment of the present inventive concepts, the antenna may include the first pattern portion, the plurality of intermediate pattern portions, and the second pattern portion connected to each other in the first direction. The bandwidth of a signal the antenna transmits, receives, or transmits and receives may be increased, and the total antenna gam of the antenna may be enhanced in the frequency band of the signal. Accordingly, the antenna with reduced loss may be provided in transmitting, receiving, or transmitting and receiving a signal. Also, the directionality of the antenna may be increased. Directionality may be a property of an antenna having directional concentration. For example, an antenna with increased directionality may easily receive, transmit, or transmit and receive a signal having directionality. The antenna may have increased concentration of an antenna gain. Accordingly, the electronic device may have increased communication efficiency and transmission distance for a signal. Although embodiments of the present inventive concepts have been described herein, it is understood that various changes and modifications can be made by those skilled in the art within the spirit and scope of the present inventive concepts. Therefore, the embodiments described herein are not intended to limit the technical spirit and scope of the present inventive concepts. | 80,951 |
11862846 | DESCRIPTION OF EMBODIMENTS Problems to be Solved by the Present Disclosure The above on-vehicle mobile station includes an antenna device (antenna module) mounted at the ceiling (roof) of a vehicle. The antenna device forms an array antenna including a large number of antenna elements, and can form a beam toward a base station. Here, since the antenna device of the on-vehicle mobile station is mounted at the outer surface of the roof or the like of the vehicle, the height of the antenna relative to the outer surface of the vehicle is required to be reduced from the viewpoint of vehicle design and vehicle height limit. The present disclosure has been made in view of such circumstances, and an object of the present disclosure is to provide an antenna module capable of reducing its height relative to the outer surface of a vehicle, and a vehicle. Effects of the Present Disclosure According to the present disclosure, the height relative to the outer surface of the vehicle can be reduced. First, contents of embodiments are listed and described. Summary of Embodiments (1) An antenna module according to an embodiment is an antenna module to be provided to a vehicle, the antenna module including: an array antenna configured to form a beam directed from an aperture provided in an exterior body panel of the vehicle, toward a vehicle outside; and a housing holding the array antenna in a vehicle inside. In the antenna module having the above configuration, since the array antenna configured to form a beam directed toward the vehicle outside is held in the vehicle inside, the height of the array antenna relative to the outer surface of the vehicle can be reduced. (2) When radio waves radiated from the array antenna pass through the vicinity of a metal plate, the energy of the radio waves may be impaired by the metal plate, and the beam formed by the array antenna may become deformed, which may cause a decrease in gain. Therefore, in the antenna module, preferably, the exterior body panel includes a metal plate, the antenna module further includes a control unit configured to control an orientation direction of the beam such that the orientation direction of the beam is directed toward a base station that is a transmission source of a reception wave received by the array antenna, and the control unit corrects the orientation direction of the beam in accordance with a crossing angle between an arrival direction of the reception wave and an aperture plane of the aperture. In this case, even when the crossing angle of the reception wave becomes smaller, resulting in the crossing angle between the orientation direction of the beam and the aperture plane becoming smaller and the beam approaching the metal outer plate so that the beam becomes deformed, the orientation direction of the beam can be corrected so as to compensate for the deformation of the beam, whereby a decrease in gain can be inhibited (3) When transmission waves radiated from the array antenna are radiated to the inner end of the aperture of the exterior body panel, the transmission waves may be reflected in an unintended direction such as to the inside of the housing, and the beam may become deformed, which may cause a decrease in gain. Therefore, the antenna module may further include a guide portion provided at an inner end of the aperture and configured to, when a transmission wave radiated from the array antenna is incident thereon, radiate the incident transmission wave toward the vehicle outside. In this case, the transmission waves that may be radiated to the inner end of the aperture and radiated in an unintended direction can be radiated to the vehicle outside by the guide portion. As a result, the beam can be inhibited from being deformed. (4) (5) In the antenna module, the guide portion may be a reflection element configured to reflect the incident transmission wave toward the vehicle outside, or may be a metamaterial configured to radiate the incident transmission wave toward the vehicle outside. In this case, the transmission wave radiated toward the inner end of the aperture can be effectively radiated to the vehicle outside. (6) In the antenna module, preferably, the housing includes: a bottom portion to which the array antenna is fixed; and a cylindrical side wall portion erected from the bottom portion, a fixing sleeve to which the housing is inserted and fixed is provided at the exterior body panel, and a fixing mechanism for fixing the housing to the fixing sleeve is provided at the side wall portion. In this case, the housing can be easily fixed to the exterior body panel with a simple configuration. (7) In the antenna module, preferably, an annular flange portion extending radially outward and coming into contact with the exterior body panel from the outside of the vehicle is provided at an end of the side wall portion, and the flange portion is flush with an outer surface of the exterior body panel. (8) A vehicle according to another embodiment is a vehicle including the antenna module according to any one of the above (1) to (7). According to this configuration, the vehicle can be used as a mobile station. (9) In the vehicle, in the case where the exterior body panel includes a metal plate, the vehicle preferably further includes a shielding portion provided so as to cover a periphery of the aperture in the outer surface of the exterior body panel and configured to shield a radio wave radiated from the array antenna and the exterior body panel from each other. In this case, when radio waves pass through the vicinity of the outer surface of the exterior body panel, the radio waves and the exterior body panel are shielded from each other by the shielding portion, and the energy of the radio waves can be inhibited from being impaired, so that the beam can be inhibited from being deformed. (10) (11) In the vehicle, the shielding portion may be a radio absorbent material covering the outer surface, or may be an electrical insulator covering the outer surface. In this case, the radio wave and the exterior body panel can be effectively shielded from each other. Details of Embodiments Hereinafter, preferred embodiments will be described with reference to the drawings. At least some parts of the embodiments described below may be combined together as desired. FIG.1is a view showing a vehicle on which an on-vehicle communication apparatus is mounted. InFIG.1, an on-vehicle communication apparatus1is mounted on a vehicle10. The on-vehicle communication apparatus1is a mobile station which performs wireless communication with a base station2of a mobile communication system. Examples of the vehicle10include an ordinary passenger vehicle as well as a bus, a railroad vehicle, etc. The base station2is provided at a relatively high location such as the rooftop of a building, and performs wireless communication with the on-vehicle communication apparatus1on the ground. The wireless communication performed between the on-vehicle communication apparatus1and the base station2is, for example, wireless communication compliant with a 5th-generation mobile communication system. In the 5th-generation mobile communication system, for example, radio waves having a very high frequency of 6 GHz or higher are used, and thus attenuation during propagation is great. Accordingly, the on-vehicle communication apparatus1and the base station2perform beamforming in order to compensate for attenuation of the radio waves. The on-vehicle communication apparatus1can perform control such that the direction of a beam B is directed toward the base station2. The on-vehicle communication apparatus1, which is mounted on the vehicle10, includes a communication device3and an antenna module4. The communication device3performs wireless communication with the base station2by using the antenna module4. In addition, the communication device3performs communication via a wireless LAN or the like with a mobile terminal (not shown) such as a smartphone present in the vehicle10. The communication device3has a function of relaying communication between such a mobile terminal in the vehicle10and the base station2. The communication device3provides a transmission baseband signal to the antenna module4. In addition, the communication device3receives a reception baseband signal provided from the antenna module4. The antenna module4is connected to the communication device3, and the antenna module4modulates the transmission baseband signal provided from the communication device3, into an RF signal, performs signal processing such as phase control and amplification on the RF signal, and wirelessly transmits an RF signal resulting from the signal processing. In addition, the antenna module4receives radio waves transmitted from the base station2, to obtain an RF signal. Then, the antenna module4performs signal processing such as modulation, amplification, and phase control on the RF signal, and provides a reception baseband signal resulting from the signal processing, to the communication device3. Furthermore, the antenna module4has a function of controlling the direction of the beam B (orientation direction of the antenna module4). That is, the antenna module4forms a front-end module in the on-vehicle communication apparatus1. The antenna module4is attached to, for example, an aperture12provided in an exterior body panel11that forms the roof of the vehicle10, for transmission and reception of RF signals. The antenna module4is attached so as to be embedded such that the antenna module4is almost flush with the surface of the exterior body panel11. Antenna Module According to First Embodiment FIG.2is a cross-sectional view of an antenna module4according to a first embodiment. InFIG.2, the antenna module4includes a module body20, a housing21in which the module body20is housed, and a radome22. The exterior body panel11, at which the antenna module4is attached, includes a metal outer plate (metal plate)13that forms an outer surface10aof the vehicle10, and a lining material14that is made of a soundproof material or the like and laminated inside the outer plate13. Thus, the outer surface of the outer plate13is the outer surface10aof the vehicle10. The outer plate13is, for example, a steel plate. The housing21is a member made of resin or the like, and is formed in a rectangular box shape having a rectangular aperture21ain one surface thereof. The housing21is attached to the aperture12of the exterior body panel11such that the aperture21ais open on a vehicle outside. As for the size of the housing21, for example, the plane dimension is about 100 mm to 200 mm, and the height dimension is about several tens of millimeters. A projection15is formed on the side surface of the housing21so as to project from the side surface. The projection15positions the housing21relative to the exterior body panel11by coming into contact with an inner surface13aof the outer plate13. In addition, the projection15is located between the outer plate13and the lining material14and fixes the housing21to the exterior body panel11. The radome22is a rectangular plate-shaped member made of resin or the like, and closes the aperture21aof the housing21. The radome22protects the module body20from the outside while allowing radio waves transmitted/received by the module body20to pass therethrough. The radome22is disposed at an aperture plane23defined by the aperture21a. The peripheral edge of the radome22is fixed to an end edge portion21dof the housing21. The end edge portion21dholds the radome22such that the radome22is attached and fixed at the aperture plane23. A surface22aof the radome22is formed to be almost flush with the surface of the exterior body panel11. Here, being flush refers to substantially being flush, and includes, for example, the case where the radome22has a curved surface slightly protruding relative to a curved surface along the surface shape of the exterior body panel11, and the case where the radome22slightly protrudes or dents from the surface of the exterior body panel11depending on the attachment method, the manufacturing method for each part, or the like. FIG.3is a perspective view showing the module body20. As shown inFIG.2andFIG.3, the module body20includes four antenna bases25and a circuit substrate26. Each antenna base25is formed in a rectangular plate shape by laminating electrical insulators such as glass fabric base epoxy resin material, for example. A plurality of radiating elements27are provided on a radiation surface25aof the antenna base25. Each radiating element27is, for example, a planar antenna. Each of the antenna bases25forms an array antenna by the plurality of radiating elements27, and is capable of beamforming individually. Each antenna base25, which is an array antenna, forms a beam directed from the aperture12, which is provided in the exterior body panel11, toward the outside of the vehicle10. The antenna base25is held in a vehicle inside by the housing21. Therefore, the antenna module4according to the present embodiment allows the height of the antenna base25relative to the outer surface10aof the vehicle10to be reduced. The vehicle inside means an inner side with respect to the outer surface10a, of the vehicle10, which is formed by the outer plate13, and the vehicle outside means an outer side with respect to the outer surface10a. The four antenna bases25are connected to the circuit substrate26via band-like flexible substrates28. Each flexible substrate28is formed, for example, by a dielectric film that has flexibility and is deformable to be bent (flexed). FIG.4is a cross-sectional view of the flexible substrate28. As shown inFIG.4, the antenna base25includes a first dielectric layer29, a second dielectric layer30, a third dielectric layer31, a fourth dielectric layer32, and a fifth dielectric layer33. The radiating elements27are mounted on the first dielectric layer29having a surface that forms the radiation surface25a, of the dielectric layers. The second dielectric layer30protrudes from an end surface of the antenna base25and extends toward the circuit substrate26side. The flexible substrate28is composed of the part of the second dielectric layer30that extends from the end surface of the antenna base25toward the circuit substrate26side. That is, the flexible substrate28is formed so as to be integrated with the second dielectric layer30. Here, while the first dielectric layer29, the third dielectric layer31, the fourth dielectric layer32, and the fifth dielectric layer33are formed of an electrical insulator such as glass fabric base epoxy resin material, the second dielectric layer30is formed of a dielectric film. Thus, the flexible substrate28is formed of the dielectric film. The flexible substrate28is laminated on a dielectric layer36of the circuit substrate26and forms a part of layers of the circuit substrate26. Thus, the flexible substrate28is formed so as to be integrated with the circuit substrate26. Thus, the flexible substrate28is formed so as to be integrated with the antenna base25and the circuit substrate26, and connects the antenna base25and the circuit substrate26. A power feed line37made of a conductor is formed between the first dielectric layer29and the second dielectric layer30. The power feed line37is a line for feeding power to each radiating element27. InFIG.4, a cross section of one power feed line37is shown, but, in the flexible substrate28, a plurality of power feed lines37are formed correspondingly for the radiating elements27provided on the antenna base25. The power feed line37is connected to the radiating element27via a through hole or the like (not shown). The power feed line37is formed so as to extend from the antenna base25via the flexible substrate28to the circuit substrate26. Moreover, a ground pattern38made of a conductor is provided between the second dielectric layer30and the third dielectric layer31. The ground pattern38is also formed so as to extend from the antenna base25via the flexible substrate28to the circuit substrate26. The ground pattern38is connected to a ground pattern34of the antenna base25via a through hole or the like (not shown). In addition, the ground pattern38is connected to a ground pattern39formed at the dielectric layer36of the circuit substrate26, via a through hole or the like (not shown). The ground pattern38is provided so as to be opposed to the power feed line37, over the antenna base25, the flexible substrate28, and the circuit substrate26. Accordingly, the power feed line37serves as a microstrip line. InFIG.2andFIG.3, the power feed line37is not shown. The flexible substrate28connects the antenna base25and the circuit substrate26so as to allow power feeding therebetween by the power feed line37. As shown inFIG.2andFIG.3, the circuit substrate26is a rectangular plate-shaped substrate, and is formed of an electrical insulator such as glass fabric base epoxy resin material. A control circuit41for performing signal processing for transmission/reception of the RF signals described above is mounted on the circuit substrate26. The circuit substrate26in the present embodiment has an almost square plate shape. The circuit substrate26is fixed to an inner surface21b1of a bottom portion21bof the housing21. The power feed line37, which extends from the antenna base25via the flexible substrate28to the circuit substrate26, is connected to the control circuit41. That is, each radiating element27is connected to the control circuit41via the power feed line37. The inner surface21b1is formed so as to be almost parallel to the aperture plane23. Thus, the circuit substrate26is fixed so as to be almost parallel to the aperture plane23. In addition, the circuit substrate26is fixed so as to be almost parallel to a horizontal plane. Therefore, the aperture plane23is also almost parallel to the horizontal plane. Here, the horizontal plane refers to the horizontal plane when the vehicle10is in a horizontal state. A connector42for connecting the control circuit41and the communication device3is provided on an outer surface21b2of the bottom portion21bof the housing21. The flexible substrate28is connected to each side end of the circuit substrate26. Thus, the antenna base25is connected to each side end of the circuit substrate26via the flexible substrate28. The antenna base25is inclined relative to the circuit substrate26by the flexible substrate28being bent (flexed). It is noted that the circuit substrate26is fixed almost horizontally when the vehicle10is stopped on a horizontal road. As described above, each antenna base25is connected to the circuit substrate26via the flexible substrate28, and thus each antenna base25can be inclined using the circuit substrate26as a base end. Each antenna base25is fixed to the housing21so as to be inclined relative to the aperture plane23at which the radome22is attached. The antenna base25is fixed via a bracket43to an inclined portion21crising from the edge of the inner surface21b1. The antenna base25is fixed to the inclined portion21cso as to be almost parallel to the inclined portion21c. Thus, the radiation surface25aof each antenna base25is inclined relative to the aperture plane23. The respective antenna bases25are inclined by being raised in such directions that the radiation surfaces25athereof face each other, using the respective side ends of the circuit substrate26as base ends. Thus, the antenna bases25are inclined in directions different from each other. The state where the antenna bases25are inclined in directions different from each other refers to a state where the normal directions of the antenna bases25described later are different from each other. Thus, since the bendable flexible substrate28is provided on the base end side of each antenna base25, the radiation surfaces25aof the antenna bases25can be easily inclined as compared to the case where, for example, the radiating elements27of the antenna base25are mounted to the circuit substrate26and thus the antenna base25and the circuit substrate26are integrally formed. In addition, the respective antenna bases25are fixed in an inclined state such that the normal directions of the radiation surfaces25across each other on the radiation surface25aside. Thus, the radiation surface25aof each antenna base25faces in one of the four directions, that is, front, rear, right, and left, around the circuit substrate26, in terms of horizontal plane direction, and faces obliquely upward relative to the horizontal direction, in terms of vertical plane direction. Thus, the antenna module4can adapt to orientation directions in a shared manner with the antenna bases25in terms of horizontal plane direction, and the radiation surfaces25aof the antenna bases25face obliquely upward in terms of vertical plane direction, whereby the orientation direction can be directed toward the base station2provided at a high location. It is noted that the normal direction of the radiation surface25arefers to a direction orthogonal to the radiation surface25a. FIG.5AandFIG.5Bare views illustrating the normal directions of the radiation surfaces.FIG.5Ashows the arrangement of the antenna bases25in the present embodiment. As shown inFIG.5A, each antenna base25in the present embodiment is inclined such that the radiation surface25afaces toward the center side of the aperture plane23. Thus, a normal direction D1of one antenna base25(left side in the drawing) and a normal direction D2of another antenna base25(right side in the drawing) cross each other on the radiation surface25aside. That is, one antenna base25and another antenna base25are inclined such that their beams (orientation directions) cross each other. FIG.5Bshows another example of the arrangement of the antenna bases25. InFIG.5B, each antenna base25is inclined such that the radiation surface25afaces toward the side opposite to the center side of the aperture plane23. Thus, a normal direction D1of one antenna base25(left side in the drawing) and a normal direction D2of another antenna base25(right side in the drawing) cross each other on the side opposite to the radiation surface25aside. That is, inFIG.5B, one antenna base25and another antenna base25are inclined such that their beams (orientation directions) do not cross each other. InFIG.5AandFIG.5B, the cases where the antenna bases25are arranged so as to be opposed to each other with the circuit substrate26therebetween have been described. However, the same applies to the case where the antenna bases25are arranged so as to be adjacent to each other on the circuit substrate26. Each antenna base25in the present embodiment is capable of beamforming as described above. In addition, the control circuit41has a function of, on the basis of radio waves received from the base station2, detecting an arrival direction of the radio waves, and, on the basis of the detected arrival direction, controlling the direction of a beam. Here, since the antenna module4is embedded relative to the surface of the exterior body panel11, the vertical plane direction of a beam formed by the radiation surface25aof each antenna base25needs to be directed upward relative to the horizontal direction in order to avoid the antenna base25and the end edge portion21dof the housing21opposed thereto across the circuit substrate26. Moreover, when radio waves radiated from each antenna base25pass through the vicinity of the outer plate13, the energy of the radio waves is impaired by the outer plate13, which is a magnetic material and an electric conductor. FIG.6Ais a diagram showing an example of a beam formed by the antenna base25. As shown inFIG.6A, a beam B1by the antenna base25approaches the outer plate13when a crossing angle θ between an orientation direction L of the beam B1and an aperture plane12aof the aperture12(aperture plane23of the housing21) becomes smaller. The orientation direction of the beam refers to the direction in which the beam intensity of the beam is the highest. The crossing angle refers to the angle at which the orientation direction of the beam by the antenna base25or an arrival direction of reception waves cross the aperture plane12a. When the beam B1approaches the outer plate13, the energy of the radio waves radiated from the antenna base25is impaired by the radio waves passing through the vicinity of the outer plate13. Therefore, for example, the beam in a region R (hatched portion), facing the outer plate13, of the beam B1inFIG.6Ais deformed. FIG.6Bis a diagram showing an example of a deformed beam. InFIG.6B, a beam B2is deformed due to impairment of the energy of radio waves having passed through the vicinity of the outer plate13, so that null occurs near the outer plate13. Therefore, in the beam B2, the gain is partially decreased. The antenna module4according to the present embodiment has a function of correcting the orientation direction of the beam by the antenna base25when the crossing angle θ between the orientation direction of the beam and the aperture plane12ais smaller than a predetermined value. For example, when it is determined that a beam should be formed toward an orientation direction L1assuming that null occurs as shown inFIG.6B, the antenna module4corrects the orientation direction of the beam such that a beam B3directed toward an orientation direction L2that is set to have a crossing angle smaller than that of the beam B2is formed. Accordingly, in the beam B2, the deformed part can be compensated for, and a partial decrease in gain can be inhibited. FIG.7is a function block diagram of the control circuit41. As shown inFIG.7, the control circuit41includes a control unit41aand a modem41b. The modem41bhas a function of demodulating reception waves from the base station2received by the radiating elements27of each antenna base25and providing intensity information indicating the reception intensity of each radiating element27to the control unit41a. The control unit41ais a computer including a processor and a storage unit, and has a function of controlling the orientation direction of a beam such that the orientation direction of the beam is directed toward the base station2, on the basis of the intensity information provided by the modem41b. The control circuit41includes a phase shifter capable of individually adjusting the phases of signals transmitted and received by the radiating elements27of each antenna base25. The control unit41acontrols the orientation direction of a beam by controlling the phase shifter. The control unit41aperforms a correction process for correcting the orientation direction of a beam when controlling the orientation direction of the beam. FIG.8is a flowchart showing an example of the correction process. First, the control unit41aspecifies an arrival direction of reception waves from the base station2on the basis of intensity information, and calculates a crossing angle between the arrival direction of the reception waves and the aperture plane12a(step S1). The intensity information including the relative relationship of the reception intensity of each radiating element27indicates the arrival direction of the reception waves from the base station2. Thus, the control unit41acan specify the arrival direction of the reception waves from the base station2on the basis of the intensity information. Next, the control unit41adetermines whether the crossing angle of the reception waves from the base station2is equal to or less than a predetermined value (step S2). When the control unit41adetermines that the crossing angle of the reception waves from the base station2is not equal to or less than the predetermined value in step S2, the control unit41aproceeds to step S4, and controls the orientation direction of a beam such that the orientation direction of the beam is directed toward the base station2, on the basis of the intensity information (step S4). On the other hand, when the control unit41adetermines that the crossing angle of the reception waves from the base station2is equal to or less than the predetermined value in step S2, the control unit41aproceeds to step S3, and controls the orientation direction of the beam such that the orientation direction of the beam is directed toward a direction corrected with respect to the direction toward the base station2obtained on the basis of the intensity information (step S3). In step S3, the control unit41acorrects the orientation direction of the beam such that a beam having a crossing angle smaller than the crossing angle between the orientation direction of the beam directed toward the base station2at present and the aperture plane12ais formed. For example, it is assumed that, when it is determined in step S2that the crossing angle of the reception waves from the base station2is equal to or less than the predetermined value, the orientation direction L1inFIG.6Bis the orientation direction of the beam B2directed toward the base station2. At this time, the control unit41aperforms control such that the beam B3with the orientation direction L2having a crossing angle θ2smaller than a crossing angle θ1of the beam B2directed toward the base station2is formed. The predetermined value in step S2is set to a crossing angle at which the beam becomes deformed and a decrease in gain begins to occur. In addition, the amount of correction for the crossing angle of the beam by the control unit41ais obtained in advance by simulation with a computer or the like. As described above, the control unit41acorrects the orientation direction of the beam in accordance with the crossing angle of the reception waves from the base station2. Accordingly, even when the crossing angle of the orientation direction of the beam becomes smaller and the beam approaches the outer plate13so that the beam becomes deformed, a partial decrease in gain can be inhibited by correcting the orientation direction of the beam so as to compensate for the deformation of the beam. In the present embodiment, the case of correcting the orientation direction of the beam when the crossing angle of the reception waves from the base station2is equal to or less than the predetermined value has been described as an example. However, for example, the amount of correction for the orientation direction of the beam may be changed in accordance with the crossing angle of the reception waves from the base station2such that the amount of correction is increased as the crossing angle of the reception waves from the base station2becomes smaller. Second Embodiment FIG.9is a partial cross-sectional view of an antenna module4according to a second embodiment, andFIG.10is a top view of a vehicle10. The present embodiment is different from the first embodiment in that a shielding portion50is provided on the outer surface10aof the vehicle10. The shielding portion50is a sheet-like member, and is formed in a rectangular shape. The shielding portion50is composed of, for example, a radio wave absorbing sheet. The shielding portion50is laminated on the outer surface10aof the vehicle10. The shielding portion50is laminated at the peripheral edge of the aperture12and provided so as to surround the aperture12. That is, the shielding portion50is provided so as to surround the periphery of the aperture12in the outer surface of the exterior body panel11(outer plate13). Accordingly, the shielding portion50electrically and magnetically shields the outer plate13and the radio waves radiated from the antenna base25from each other. With this shielding portion50, when the radio waves pass through the vicinity of the outer plate13, the energy of the radio waves can be inhibited from being impaired, and the beam can be inhibited from being deformed. In the present embodiment, the case where the shielding portion50is composed of a radio wave absorbing sheet has been described as an example, but a sheet material composed of an electrical insulator such as resin or rubber may be used. In this case as well, the outer plate13and the radio waves radiated from the antenna base25can be electrically and magnetically shielded from each other. Moreover, the shielding portion50in the present embodiment is provided so as to cover a part of the outer surface10ain the roof of the vehicle10including the peripheral edge of the aperture12. However, it is sufficient that the shielding portion50is provided at least in a range of the outer surface10athat causes deformation of the beam, and the shielding portion50may be provided so as to shield the entire roof. Third Embodiment FIG.11is a partial cross-sectional view of an antenna module4according to a third embodiment. The antenna module4according to the present embodiment is different from the first embodiment in that the antenna module4includes a guide portion55. The guide portion55is a reflection element that reflects radio waves, and is provided at the end edge portion21dof the housing21, which is the inner end (inner end surface) of the aperture12. A projection56for holding the guide portion55is formed on the inner surface of the end edge portion21d. The guide portion55is disposed above each antenna base25along the longitudinal direction of the antenna base25. When transmission waves from the antenna base25disposed so as to be opposed to the guide portion55across the circuit substrate26are incident on the guide portion55, the guide portion55reflects the incident transmission waves toward the outside of the vehicle10. As shown inFIG.11, the guide portion55reflects transmission waves (incident waves) emitted toward the end edge portion21d, to bend the emission path of the transmission waves such that the transmission waves are not applied to the end edge portion21d, thereby guiding the transmission waves to the outside of the vehicle10. Since the antenna module4is embedded relative to the surface of the exterior body panel11, the transmission waves radiated from the antenna base25may be applied to the end edge portion21dof the housing21opposed thereto across the circuit substrate26. When the transmission waves are radiated to the end edge portion21dof the housing21, the transmission waves may be reflected in an unintended direction such as to the inside of the housing21, and the beam may become deformed, which may cause a decrease in gain. In this regard, in the present embodiment, since the guide portion55composed of a reflection element is provided at the end edge portion21dof the housing21which is the inner end of the aperture12, the transmission waves that may be radiated to the inner end of the aperture12and radiated in an unintended direction can be radiated to the vehicle outside. As a result, the beam can be inhibited from being deformed. In the present embodiment, the case where the guide portion55is composed of a reflection element has been described as an example, but, for example, an element made of a metamaterial capable of guiding incident electromagnetic waves in a desired direction may be used. In this case as well, the beam can be inhibited from being deformed. The metamaterial is, for example, an artificial substance in which cells that are sufficiently smaller than the wavelength of electromagnetic waves are periodically arranged and the physical property values for electromagnetic waves can be adjusted. Fourth Embodiment FIG.12is a top view of an antenna module4according to a fourth embodiment. The present embodiment is different from the first embodiment in that the bottom portion21bof the housing21is formed in a disk shape and the entire housing21is formed in a circular shape. The housing21in the present embodiment is formed to include: a disk-shaped bottom portion21bto which the module body20is fixed; and a cylindrical side wall portion21eerected from the periphery of the bottom portion21b. FIG.13is a partial cross-sectional view of the antenna module4according to the present embodiment. The aperture12in the present embodiment is formed in a circular shape corresponding to the housing21. A cylindrical fixing sleeve60into which the housing21is fixed is inserted and fixed to the inner peripheral surface of the aperture12. A female thread60bis formed on an inner peripheral surface60aof the fixing sleeve60. A male thread21fto be screwed into the female thread60bof the fixing sleeve60is formed on an outer peripheral surface21e1of the side wall portion21eof the housing21. The housing21is fixed in the fixing sleeve60and fixed to the exterior body panel11by screwing the male thread21finto the female thread60bof the fixing sleeve60. That is, the male thread21fforms a fixing mechanism, provided on the outer peripheral surface21e1of the side wall portion21e, for fixing the housing21to the fixing sleeve60. Moreover, an annular projection62is formed on the bottom portion21bside of the side wall portion21eso as to project radially outward. The annular projection62is in contact with an end surface of the fixing sleeve60in a state where the housing21is fixed to the exterior body panel11. Thus, the housing21is screwed into the fixing sleeve60from the vehicle inside to be fixed thereto. In addition, at this time, the annular projection62serves as a stopper for axially positioning the housing21relative to the fixing sleeve60. As described above, in the antenna module4according to the present embodiment, the housing21can be easily fixed to the exterior body panel11with a simple configuration. In the present embodiment, the case where the male thread21fis provided as a fixing mechanism, provided on the outer peripheral surface21e1of the side wall portion21e, for fixing the housing21to the fixing sleeve60, has been described as an example. However, as long as the fixing mechanism can fix the housing21to the fixing sleeve60, the fixing mechanism does not have to be a thread, and, for example, a projection to be engaged with a hole provided in the inner peripheral surface of the fixing sleeve60or with the lower end surface of the fixing sleeve60may be provided, as the fixing mechanism, so as to project radially outward from the side wall portion21e. FIG.14is a partial cross-sectional view of an antenna module4according to a modification of the fourth embodiment. In the present modification, the annular projection62is not provided at the side wall portion21eof the housing21, and a flange portion66is provided at an end edge portion21e2which is the end of the side wall portion21e. The flange portion66extends radially outward and is formed in an annular shape. The flange portion66is in contact with the exterior body panel11from the outside of the vehicle10in a state where the housing21is fixed to the fixing sleeve60. A recess68is formed on the exterior body panel11so as to be recessed to match the shape of the flange portion66. An outer surface66aof the flange portion66which is a part of the outer side of the vehicle10is formed so as to be flush with the outer surface10aof the vehicle10(the outer surface of the outer plate13) when the flange portion66is in contact with the recess68. In the present modification, the housing21is screwed into the fixing sleeve60from the vehicle outside to be fixed thereto. In addition, at this time, the flange portion66serves as a stopper for axially positioning the housing21relative to the fixing sleeve60. FIG.15is a partial cross-sectional view of an antenna module4according to another modification of the fourth embodiment. In the present modification, the recess68is not formed on the exterior body panel11, and the flange portion66is in contact with the outer surface10aof the vehicle10. The flange portion66is formed so as to be tapered toward a radial end portion thereof, and thus the outer surface66ais smoothly connected to the outer surface10a. In this case as well, the housing21is screwed into the fixing sleeve60from the outside of the vehicle10to be fixed thereto. In addition, the flange portion66serves as a stopper for axially positioning the housing21relative to the fixing sleeve60. Moreover, in the present modification, since the flange portion66covers the outer plate13, for example, when the flange portion66is formed of an electrical insulator such as resin, the flange portion66can serve as the shielding portion50which electrically and magnetically shields the outer plate13and the radio waves radiated from the antenna base25from each other. Others The embodiments disclosed above are merely illustrative in all aspects and should be considered not restrictive. In the above embodiments, the case where a steel plate is used as the outer plate13which forms the outer surface10aof the vehicle has been described as an example. However, the outer plate13may be formed of another conductive metal material such as an aluminum alloy. In the above embodiments, the case where the antenna module4is provided at the exterior body panel11of the roof of the vehicle10has been described as an example. However, the antenna module4may be provided at an exterior body panel of another part other than the exterior body panel11of the roof, particularly, at a surface that faces upward. For example, in the case of an automobile, the antenna module4may be provided at an exterior body panel such as the trunk or the hood. In the above embodiments, the case where the four antenna bases25are provided has been described as an example. However, three antenna bases25may be provided or five or more antenna bases25may be provided. In this case, the circuit substrate26is preferably formed in a polygonal shape in accordance with the number of the antenna bases25. This is because the antenna bases25can be connected to the respective side ends of the circuit substrate26. In the above embodiments, the case where the flexible substrate28is formed of a bendable dielectric film has been described as an example. However, instead of a dielectric film, the flexible substrate28may be composed of a hinge or the like which rotatably connects the circuit substrate26and the antenna base25and allows power feeding therethrough. The scope of the present disclosure is defined by the scope of the claims rather than the meaning described above, and is intended to include meaning equivalent to the scope of the claims and all modifications within the scope. REFERENCE SIGNS LIST 1on-vehicle communication apparatus2base station3communication device4antenna module10vehicle10aouter surface11exterior body panel12aperture12aaperture plane13outer plate13ainner surface14lining material15projection20module body21housing21aaperture21bbottom portion21b1inner surface21b2outer surface21cinclined portion21dend edge portion21eside wall portion21e1outer peripheral surface21e2end edge portion21fmale thread22radome22asurface23aperture plane25antenna base25aradiation surface26circuit substrate27radiating element28flexible substrate29first dielectric layer30second dielectric layer31third dielectric layer32fourth dielectric layer33fifth dielectric layer34ground pattern36dielectric layer37power feed line38ground pattern39ground pattern41control circuit41acontrol unit41bmodem42connector43bracket50shielding portion55guide portion56projection60fixing sleeve60ainner peripheral surface60bfemale thread62annular projection66flange portion66aouter surface68recessB beamB1beamB2beamB3beamD1normal directionD2normal directionL orientation directionL1orientation directionL2orientation directionθ, θ1, θ2crossing angle | 43,602 |
11862847 | DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS The present disclosure is directed to novel antennas comprising MXene compositions, articles incorporating these antennas, and methods of using these antennas and articles. The present invention may be understood more readily by reference to the following description taken in connection with the accompanying Figures and Examples, all of which form a part of this disclosure. It is to be understood that this invention is not limited to the specific products, methods, conditions or parameters described or shown herein, and that the terminology used herein is for the purpose of describing particular embodiments by way of example only and is not intended to be limiting of any claimed invention. Similarly, unless specifically otherwise stated, any description as to a possible mechanism or mode of action or reason for improvement is meant to be illustrative only, and the invention herein is not to be constrained by the correctness or incorrectness of any such suggested mechanism or mode of action or reason for improvement. Throughout this text, it is recognized that the descriptions refer to compositions and methods of making and using said compositions. That is, where the disclosure describes or claims a feature or embodiment associated with a composition or a method of making or using a composition, it is appreciated that such a description or claim is intended to extend these features or embodiment to embodiments in each of these contexts (i.e., compositions, methods of making, and methods of using). Certain embodiments of the present disclosure include antennas for transmitting and/or receiving electrical signals, each antenna comprising a MXene composition. MXene composition are known but not in applications directed to antennas, and all such compositions are considered within the scope of this invention. In certain embodiments, wherein the MXene composition is any of the compositions described in at least one of U.S. patent application Ser. No. 14/094,966 (filed Dec. 3, 2013), 62/055,155 (filed Sep. 25, 2014), 62/214,380 (filed Sep. 4, 2015), 62/149,890 (filed Apr. 20, 2015), 62/127,907 (filed Mar. 4, 2015) or International Applications PCT/US2012/043273 (filed Jun. 20, 2012), PCT/US2013/072733 (filed Dec. 3, 2013), PCT/US2015/051588 (filed Sep. 23, 2015), PCT/US2016/020216 (filed Mar. 1, 2016), or PCT/US2016/028,354 (filed Apr. 20, 2016), preferably where the MXene composition comprises titanium and carbon (e.g., Ti3C2, Ti2C, Mo2TiC2, etc.). Each of these compositions is considered independent embodiment. Similarly, MXene carbides, nitrides, and carbonitrides are also considered independent embodiments. Various MXene compositions are described elsewhere herein, and these and other compositions, including coatings, stacks, laminates, molded forms, and other structures, described in the above-mentioned references are all considered within the scope of the present disclosure. In other embodiments, the antennas are capable of or actually do transmit and/or receive electrical signals in a radio frequency range, wherein the radio frequency is considered to span the kilohertz to gigahertz frequency range. In specific embodiments, these ranges can be defined in terms of a frequency range of from about 3 kHz to about 300 GHz, including a frequency defined by one or more of the ranges of from 3 kHz to 5 kHz, from 5 kHz to 10 kHz, from 10 kHz to 50 kHz, from 50 kHz to 100 kHz, from 100 kHz to 500 kHz, from 500 kHz to 1 GHz, from 1 GHz to 2 GHz, from 2 GHz to 3 GHz, from 3 GHz to 4 GHz, from 4 GHz to 5 GHz, from 5 GHz to 10 GHz, from 10 GHz to 50 GHz, from 50 GHz to 100 GHz, from 100 GHz to 300 GHz. In preferred embodiments, the electrical signals are in a frequency range of from about 1 GHz to about 10 GHz. Typically, antennas operating in these and other frequency ranges are operably coupled to one or both of a radio transmitter or a radio receiver by at least one transmission line, and such embodiments are considered within the present disclosure. In other embodiments, the receiver is further operably coupled to an amplifier. The antennas of the present disclosure may be configured in any form normally contemplated for antennas operating in the radio frequency range. In independent embodiments, the antenna can be configured as a monopole antenna, a dipole antenna, or as part of an array comprising one or both of these configurations. Whereas the antenna has been described as comprising a MXene composition, that MXene composition may be present as the entire antenna, as a coating of the antenna, or of any part of the antenna. Where the MXene material is present as a coating on a conductive or non-conductive substrate, that MXene coating may cover some or all of the underlying substrate material. Such substrates may be virtually any conducting or non-conducting material, though preferably the MXene coating is positioned adjacent to a non-conductive surface. Such non-conductive surfaces or bodies may comprise virtually any non-electrically conducting organic polymer, inorganic material (e.g., glass or silicon), or synthetic and natural fiber (including fabric) substrates. Since MXene can be produced as a free-standing film, or applied to any shaped surface, in principle the MXene can be applied to almost any substrate material, depending on the intended application, with little dependence on morphology and roughness. In independent embodiments, the substrate may be a non-porous, porous, microporous, or aerogel form of an organic polymer, for example, a fluorinated or perfluorinated polymer (e.g., PVDF, PTFE) or an alginate polymer, a silicate glass, silicon, GaAs, or other low-K dielectric, an inorganic carbide (e.g., SiC) or nitride (Al3N4) or other thermally conductive inorganic material wherein the choice of substrate depends on the intended application. Depending on the nature of the application, low-k dielectrics or high thermal conductivity substrates may be used. While the nature of MXene coatings is not necessarily sensitive to surface roughness, speed and losses may be affected by the nature of the substrate, especially in the GHz range. As with material, the form of the substrate is not necessarily limiting to the antennas used. In some embodiments, the substrate is rigid (e.g., on a silicon wafer). In other embodiments, substrate is flexible (e.g., on a flexible polymer sheet). Substrate surfaces may be organic, inorganic, or metallic, and comprise metals (Ag, Au, Cu, Pd, Pt) or metalloids; conductive or non-conductive metal oxides (e.g., SiO2, ITO), nitrides, or carbides; semi-conductors (e.g., Si, GaAs, InP): glasses, including silica or boron-based glasses; or organic polymers. The coating may be patterned or unpatterned on the substrate. In independent embodiments, the coatings may be applied or result from the application by spin coating, dip coating, roller coating, compression molding, doctor blading, ink printing, painting or other such methods. Multiple coatings of the same or different MXene compositions may be employed. Flat surface or surface-patterned substrates can be used. The MXene coatings may also be applied to surfaces having patterned metallic conductors or wires. Additionally, by combining these techniques, it is possible to develop patterned MXene layers by applying a MXene coating to a photoresist layer, either a positive or negative photoresist, photopolymerize the photoresist layer, and develop the photopolymerized photoresist layer. During the developing stage, the portion of the MXene coating adhered to the removable portion of the developed photoresist is removed. Alternatively, or additionally, the MXene coating may be applied first, followed by application, processing, and development of a photoresist layer. By selectively converting the exposed portion of the MXene layer to an oxide using nitric acid, a MXene pattern may be developed. In short, these MXene materials may be used in conjunction with any appropriate series of processing steps associated with thick or thin film processing to produce any of the structures or devices described herein (including, e.g., plasmonic nanostructures). The methods described in PCT/US2015/051588 (filed Sep. 23, 2015), incorporated by reference herein at least for such teachings, are suitable for such applications. These MXene coatings may be applied or be present on a substrate wherein the MXene coating comprises a binder. Again, while not necessarily limiting, such binders are preferably an organic polymer or glass binder, for example any organic polymer, but in some applications is preferably a fluorinated or perfluorinated (e.g., PVDF, PTFE), silicate glass, or alginate polymers. In certain high frequency applications, the binder has dielectric permittivity of less than 5, preferably less than 4, 3.5, 3, 2.5, or 2 at 1 GHz. In other embodiments, the MXene coatings may be applied or be present on a substrate wherein the MXene coating is binder-free. Such coatings may be applied by any of the methods described above and in PCT/US2015/051588 (filed Sep. 23, 2015). In some embodiment, the binder-free MXene coatings can be laminated and/or coated, for example, with alginate or other organic polymers to make them more durable. In independent embodiment in the context of these antennas, the MXene coating can be present and is operable, in virtually any thickness, from the nanometer scale to hundreds of microns. Within this range, in some embodiments, the MXene may be present at a thickness ranging from 1 nm to 1000 microns, or in a range defined by one or more of the ranges of from 1 nm to 5 nm, from 5 nm to 10 nm, from 10 nm to 15 nm, from 15 nm to 20 nm, from 20 nm to 25 nm, from 25 nm to 50 nm, from 50 nm to 100 nm, from 100 nm to 150 nm, from 150 nm to 200 nm, from 200 nm to 250 nm, from 250 nm to 500 nm, from 500 nm to 1000 nm, from 1000 nm to 1500 nm, from 1500 nm to 2500 nm, from 2500 nm to 5000 nm, from 5 μm to 100 μm, from 100 μm to 500 μm, or from 500 μm to 1000 μm, when additional mechanical robustness of the antenna is required. Typically, in such coatings, the MXene is present as an overlapping array of two or more overlapping layers of MXene platelets oriented to be essentially coplanar with the substrate surface. In specific embodiments, the MXene platelets have at least one mean lateral dimension in a range of from about 0.1 micron to about 50 microns, or in a range defined by one or more of the ranges of from 0.1 to 2 microns, from 2 microns to 4 microns, from 4 microns to 6 microns, from 6 microns to 8 microns, from 8 microns to 10 microns, from 10 microns to 20 microns, from 20 microns to 30 microns, from 30 microns to 40 microns, or from 40 microns to 50 microns. Again, the antenna may also be present such that its body is a molded or formed body comprising the MXene composition. While such compositions may comprise any of the MXene compositions described herein, exemplary methods of making such structures are described in PCT/US2015/051588 (filed Sep. 23, 2015), which is incorporated by reference herein at least for such teachings. In still further embodiments, the disclosed antennas may further be coated or encapsulated by an organic polymer or glass coating. Such coatings serve to protect the antennas from physical abuse and environmental elements, and so potentially any polymer composition suitable for this purpose can be used. In certain embodiments, organic polymers such as acrylates, methacrylates, polyvinyl alcohol, epoxies, or polyurethanes and silicate or borosilicate glasses may be used. These inventive antennas may also be described functionally, in the context of the described compositions. While specific values may depend on the composition and thickness of the MXene compositions described herein, in certain embodiments, the MXene-containing antenna may be characterized as exhibiting a peak return loss of greater than 40, 41, 42, 43, 44, or 45 dB when tested according to the methods described herein. Likewise, the MXene-containing antenna may characterized as exhibiting a peak return loss of at least 95%, 96%, 97%, 98%, or 99% of that of a comparably configured copper antenna, when tested according to the methods described herein. To this point, the invention(s) have been described in terms of the antennas themselves, the invention also contemplates that devices incorporating or comprising these antennas are also within the scope of the invention. Accordingly, devices such as radios (one way and/or two way radio), television sets, communication receivers, radar sets, cell phones, garage door openers, wireless microphones, Bluetooth- or other wireless enabled devices, wireless chargers (for batteries and supercapacitors), wireless computer networks, and even baby monitor, or RFID tags comprising any of the inventive antennas are considered within the scope of the present invention(s). Likewise, any method of transmitting or receiving electromagnetic information using antennas, or apparatuses using such antennas, are within the scope of the present invention. For example, any method comprising applying an electric current oscillating at a radio frequency to any of the antenna described herein, such that the antenna radiates a radio wave is considered an independent embodiment of the present invention. Similarly, any method comprising receiving radio wave information by any of the antenna described herein, and converting the information to a useable audio signal, video signal, or digital data using a radio receiver is considered within the scope of the present invention. Terms In the present disclosure the singular forms “a,” “an,” and “the” include the plural reference, and reference to a particular numerical value includes at least that particular value, unless the context clearly indicates otherwise. Thus, for example, a reference to “a material” is a reference to at least one of such materials and equivalents thereof known to those skilled in the art, and so forth. When a value is expressed as an approximation by use of the descriptor “about,” it will be understood that the particular value forms another embodiment. In general, use of the term “about” indicates approximations that can vary depending on the desired properties sought by the disclosed subject matter and is to be interpreted in the specific context in which it is used, based on its function. The person skilled in the art will be able to interpret this as a matter of routine. In some cases, the number of significant figures used for a particular value may be one non-limiting method of determining the extent of the word “about.” In other cases, the gradations used in a series of values may be used to determine the intended range available to the term “about” for each value. Where present, all ranges are inclusive and combinable. That is, references to values stated in ranges include every value within that range. It is to be appreciated that certain features of the invention which are, for clarity, described herein in the context of separate embodiments, may also be provided in combination in a single embodiment. That is, unless obviously incompatible or specifically excluded, each individual embodiment is deemed to be combinable with any other embodiment(s) and such a combination is considered to be another embodiment. Conversely, various features of the invention that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any sub-combination. Finally, while an embodiment may be described as part of a series of steps or part of a more general structure, each said step may also be considered an independent embodiment in itself, combinable with others. When a list is presented, unless stated otherwise, it is to be understood that each individual element of that list, and every combination of that list, is a separate embodiment. For example, a list of embodiments presented as “A, B. or C” is to be interpreted as including the embodiments, “A,” “B.” “C,” “A or B,” “A or C,” “B or C,” or “A. B, or C.” The transitional terms “comprising,” “consisting essentially of,” and “consisting” are intended to connote their generally in accepted meanings in the patent vernacular; that is, (i) “comprising,” which is synonymous with “including.” “containing,” or “characterized by.” is inclusive or open-ended and does not exclude additional, unrecited elements or method steps; (ii) “consisting of” excludes any element, step, or ingredient not specified in the claim; and (iii) “consisting essentially of” limits the scope of a claim to the specified materials or steps “and those that do not materially affect the basic and novel characteristic(s)” of the claimed invention. Embodiments described in terms of the phrase “comprising” (or its equivalents), also provide, as embodiments, those which are independently described in terms of “consisting of” and “consisting essentially of.” Where the term “consisting essentially of” is used, the basic and novel characteristic(s) of the method is intended to be the antennas which exhibit the properties described herein. Throughout this specification, words are to be afforded their normal meaning, as would be understood by those skilled in the relevant art. However, so as to avoid misunderstanding, the meanings of certain terms will be specifically defined or clarified. While MXene compositions include any and all of the compositions described in the patent applications and issued patents described above, in some embodiments, MXenes are materials comprising or consisting essentially of a Mn+1Xn(Ts) composition having at least one layer, each layer having a first and second surface, each layer comprising a substantially two-dimensional array of crystal cells. each crystal cell having an empirical formula of Mn+1Xn, such that each X is positioned within an octahedral array of M, wherein M is at least one Group 3, 4, 5, 6, or 7, wherein each X is carbon and nitrogen or combination of both and n=1, 2, or 3; wherein at least one of said surfaces of the layers has surface terminations, Ts, independently comprising alkoxide, alkyl, carboxylate, halide, hydroxide, hydride, oxide, sub-oxide, nitride, sub-nitride, sulfide, sulfonate, thiol, or a combination thereof; As described elsewhere within this disclosure, the Mn+1Xn(Ts) materials produced in these methods and compositions have at least one layer, and sometimes a plurality of layers, each layer having a first and second surface, each layer comprising a substantially two-dimensional array of crystal cells: each crystal cell having an empirical formula of Mn+1Xn, such that each X is positioned within an octahedral array of M, wherein M is at least one Group 3, 4, 5, 6, or 7 metal (corresponding to Group IIIB, IVB, VB, VIB or VIIB metal), wherein each X is C and/or N and n=1, 2, or 3; wherein at least one of said surfaces of the layers has surface terminations, Ts, comprising alkoxide, alkyl, carboxylate, halide, hydroxide, hydride, oxide, sub-oxide, nitride, sub-nitride, sulfide, sulfonate, thiol, or a combination thereof. Supplementing the descriptions above, Mn+1Xn(Ts), compositions may be viewed as comprising free standing and stacked assemblies of two dimensional crystalline solids. Collectively, such compositions are referred to herein as “Mn+1Xn(Ts),” “MXene.” “MXene compositions,” or “MXene materials.” Additionally, these terms “Mn+1Xn(Ts),” “MXene,” “MXene compositions.” or “MXene materials” also refer to those compositions derived by the chemical exfoliation of MAX phase materials, whether these compositions are present as free-standing 2-dimensional or stacked assemblies (as described further below). Reference to the carbide equivalent to these terms reflects the fact that X is carbon, C, in the lattice. Such compositions comprise at least one layer having first and second surfaces, each layer comprising: a substantially two-dimensional array of crystal cells; each crystal cell having an empirical formula of Mn+1Xn, where M, X, and n are defined above. These compositions may be comprised of individual or a plurality of such layers. In some embodiments, the Mn+1Xn(Ts) MXenes comprising stacked assemblies may be capable of, or have atoms, ions, or molecules, that are intercalated between at least some of the layers. In other embodiments, these atoms or ions are lithium. In still other embodiments, these structures are part of an energy-storing device, such as a battery or supercapacitor. In still other embodiments these structures are added to polymers to make polymer composites. The term “crystalline compositions comprising at least one layer having first and second surfaces, each layer comprising a substantially two-dimensional array of crystal cells” refers to the unique character of these materials. For purposes of visualization, the two-dimensional array of crystal cells may be viewed as an array of cells extending in an x-y plane, with the z-axis defining the thickness of the composition, without any restrictions as to the absolute orientation of that plane or axes. It is preferred that the at least one layer having first and second surfaces contain but a single two-dimensional array of crystal cells (that is, the z-dimension is defined by the dimension of approximately one crystal cell), such that the planar surfaces of said cell array defines the surface of the layer; it should be appreciated that real compositions may contain portions having more than single crystal cell thicknesses. That is, as used herein. “a substantially two-dimensional array of crystal cells” refers to an array which preferably includes a lateral (in x-y dimension) array of crystals having a thickness of a single cell, such that the top and bottom surfaces of the array are available for chemical modification. Metals of Group 3, 4, 5, 6, or 7 (corresponding to Group IIIB, IVB, VB, VIB, or VIIB), either alone or in combination, said members including Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W. For the purposes of this disclosure, the terms “M” or “M atoms,” “M elements,” or “M metals” may also include Mn. Also, for purposes of this disclosure, compositions where M comprises Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, or mixtures thereof constitute independent embodiments. Similarly, the oxides of M may comprise any one or more of these materials as separate embodiments. For example, M may comprise any one or combination of Hf, Cr, Mn, Mo, Nb, Sc, Ta, Ti, V, W, or Zr. In other preferred embodiments, the transition metal is one or more of Ti, Zr, V, Cr, Mo, Nb, Ta, or a combination thereof. In even more preferred embodiments, the transition metal is Ti, Ta, Mo, Nb, V, Cr, or a combination thereof. In certain specific embodiments, Mn+1Xncomprises Mn+1Cn(i.e., where X═C, carbon) which may be Ti2C, V2C, V2N, Cr2C, Zr2C, Nb2C, Hf2C, Ta2C, Mo2C, Ti3C2, V3C2, Ta3C2, Mo3C2, (Cr2/3Ti1/2)3C2, Ti4C3, V4C3, Ta4C3, Nb4C3, or a combination thereof. In more specific embodiments, the Mn+1Xn(Ts) crystal cells have an empirical formula Ti3C2or Ti2C. In certain of these embodiments, at least one of said surfaces of each layer of these two dimensional crystal cells is coated with surface terminations, Ts, comprising alkoxide, fluoride, hydroxide, oxide, sub-oxide, sulfonate, or a combination thereof. The range of compositions available can be seen as extending even further when one considers that each M-atom position within the overall Mn+1Xnmatrix can be represented by more than one element. That is, one or more type of M-atom can occupy each M-position within the respective matrices. In certain exemplary non-limiting examples, these can be (MAxMBy)2C, (MAxMBy)3C2, or (MAxMBy)4C3, where MAand MBare independently members of the same group, and x+v=1. For example, in but one non-limiting example, such a composition can be (V1/2Cr1/2)3C2. In other embodiments, the MXenes may comprise compositions having at least two Group 4, 5, 6, or 7 metals, and the Mn+1Xn(Ts) composition is represented by a formula M′2M″mXm+1(Ts), where m=n−1. Typically, these are carbides (i.e., X is carbon). Such compositions are described in U.S. Patent Application No. 62/149,890, this reference being incorporated herein by reference for all purposes. In these double transition metal carbides, M′ may be Ti, V, Cr, or Mo. In these ordered double transition metal carbides, M″ may be Ti, V, Nb, or Ta, provided that M′ is different than M″. These carbides may be ordered or disordered. Individual embodiments of the ordered double transition metal carbides include those compositions where M′2M″mXm+1, is independently Mo2TiC2, Mo2VC2, Mo2TaC2, Mo2NbC2, Mo2Ti2C3, Cr2TiC2, Cr2VC2, Cr2TaC2, Cr2NbC2, Ti2NbC2, Ti2TaC2, V2TaC2, V2TiC2, or a combination thereof. In some other embodiments, M′2M″mXm+1, is independently Mo2TiC2, Mo2VC2, Mo2TaC2, Mo2NbC2, Cr2VC2, Cr2TaC2, Cr2NbC2, Ti2NbC2, Ti2TaC2, V2TaC2, V2TiC2, or a combination thereof. In other embodiments, M′2M″mXm+1, is independently Mo2Ti2C3, Mo2V2C3, Mo2Nb2C3, Mo2Ta2C3, Cr2Ti2C3, Cr2V2C3, Cr2Nb2C3, Cr2Ta2C3, Nb2Ta2C3, Ti2Nb2C3, Ti2Ta2C3, V2Ta2C3, V2Nb2C3, V2Ti2C3, or a combination thereof. In still other embodiments, M′2M′mXm+1, is independently Nb2VC2, Ta2TiC2, Ta2VC2, Nb2TiC2or a combination thereof. In still other embodiments, the MXenes may comprise compositions prepared by etching the Group 13 and 14 elements of compositions having lattice cell stoichiometries of:(a) Cr2Ga2C, Cr2Ga2N, Mo2Ga2C, Mo2Ga2N, Nb2Ga2C, Nb2Ga2N, Ta2Ga2C, Ta2Ga2N, Ti2Ga2C, Ti2Ga2N, V2Ga2C, or V2Ga2N;(b) Hf2In2C, Hf2In2N, Hf2Sn2C, Hf2Sn2N, Nb2In2C, Nb2In2N, Nb2Sn2C, Nb2Sn2N, Sc2In2C, Sc2In2N, Ti2In2C, Ti2In2N, Ti2Sn2C, Ti2Sn2N, Zr2In2C, Zr2In2N, Zr2Sn2C, or Zr2Sn2N;(c) Mo2TiC2, Mo2VC2, Mo2TaC2, Mo2NbC2, Mo2Ti2C3, Cr2TiC2, CT2VC2, Cr2TaC2, CrNbC2, Ti2NbC2, Ti2TaC2, V2TaC2, or V2TiC2;(d) Mo2TiC2, Mo2VC2, Mo2TaC2, or Mo2NbC2;(e) Mo2Ti2C3, Mo2V2C3, Mo2Nb2C3, Mo2Ta2C3, Cr2Ti2C3, Cr2V2C3, Cr2Nb2C3, Cr2Ta2C3, Nb2Ta2C3. Ti2Nb2C3, Ti2Ta2C3. V2Ta2C3, V2Nb2C3, or V2Ti2C3; or(f) Mo2Ti2C3, Mo2V2C3, Mo2Nb2C3, Mo2Ta2C3, Ti2Nb2C3, Ti2Ta2C3, or V2Ta2C3. Previously, these MXene materials, described above as either Mn+1Xn(Ts) or M′2M″mXm+1, may be prepared by selectively removing an A group element from a precursor MAX-phase material. Depending on the specific MAX being considered, these A group elements may be independently defined as including Al, As, Cd, Ga, Ge, P, Pb, In, S. Sn, or Tl. These same materials are contemplated as independent embodiments for the A element used in the present invention. Some of these A-group elements may be removed in aqueous media, for example, by a process comprising a treatment with a fluorine-containing acid. For example, Al, As, Ga, Ge, In, P. Pb, S, or Sn may be removed in this way, although Al is especially amenable to such extractions. Aqueous hydrofluoric acid is particularly suitable for this purpose, whether used as provided, or generated in situ by other conventional methods. Such methods include the use of any one or more of the following:(a) aqueous ammonium hydrogen fluoride (NH4F.HF);(b) an alkali metal bifluoride salt (i.e., QHF2, where Q is Li, Na, or K), or a combination thereof; or(c) at least one fluoride salt, such as an alkali metal, alkaline earth metal, or ammonium fluoride salt (e.g., LiF, NaF, KF, CsF, CaF2, tetraalkyl ammonium fluoride (e.g., tetrabutyl ammonium fluoride)) in the presence of at least one mineral acid that is stronger than HF (i.e., has a higher Ka value) and can react with fluorides to form HF in situ (such as HCl, HBr, HI, H3PO4. HNO3, oxalic acid, or H2SO4); or(d) a combination of two or more of (a)-(c), in some cases, the use of molten fluoride salts in inert atmosphere (Ar, N2) may be used to remove the group 13 or 14 element (e.g., at 500-600° C., e.g., above the melting temperature of LiF, NaF, KFCsF, CaF2salts). In specific embodiments, the fluorine-containing acid is derived from lithium fluoride and a strong aqueous mineral acid, such as HCl, HNO3, or H2SO4, preferably HCl. It also appears that the use of aqueous HF in the presence of one or more alkali halides, such as LiCl, provides advantages over using HF alone, or by reacting LiF with aqueous HCl. The use of LiF with aqueous HCl avoids the handling issues associated with the use of aqueous HF and provides higher yields of single-layer flakes, in some cases it may be difficult to remove LiF impurities and the removal of the A-element (e.g., Al) is slower. The use of LiCl with aqueous HF provides more crystalline MXene phases, with better control of the basal spacing (c parameter) and it is easier to vary the procedures especially for those involving ion intercalation. As used herein, the terms “antenna” or “antennas” connote the definitions generally understood by those skilled in the art. An antenna or aerial is an electrical device which converts electric power into radio waves, and vice versa. It is usually used with a radio transmitter or radio receiver. Antennas (or antennae) are used in systems such as radio broadcasting, broadcast television, two-way radio, communications receivers, radar, cell phones, and satellite communications, as well as other devices such as garage door openers, wireless microphones, Bluetooth-enabled devices, wireless computer networks, baby monitors, and RFID tags on merchandise. As used herein, the terms “dipole antenna” or “doublet” is also well understood by those skilled in the art as being the simplest and most widely used class of antenna in radio and telecommunications. Such an antenna consists of two identical conductive elements, which are usually bilaterally symmetrical. The most common form of dipole is two straight rods or wires oriented end to end on the same axis, with the feedline connected to the two adjacent ends. Dipoles are resonant antennas, meaning that the elements serve as resonators, with standing waves of radio current flowing back and forth between their ends and the length of the dipole elements is determined by the wavelength of the radio waves used. The most common form is the half-wave dipole, in which each of the two rod elements is approximately ¼ wavelength long, so the whole antenna is a half-wavelength long. Several different variations of the dipole are also used, such as the folded dipole, short dipole, cage dipole, bow-tie, and batwing antenna. The following listing of Embodiments is intended to complement, rather than displace or supersede, the previous descriptions. Embodiment 1. An antenna for transmitting and/or receiving electrical signals comprising a MXene composition. MXene composition are known but not in applications directed to antennas, and all such compositions are considered within the scope of this invention. In certain Aspects of this Embodiment, wherein the MXene composition is any of the compositions described in at least one of U.S. patent application Ser. No. 14/094,966 (filed Dec. 3, 2013), 62/055,155 (filed Sep. 25, 2014), 62/214,380 (filed Sep. 4, 2015), 62/149,890 (filed Apr. 20, 2015), 62/127,907 (filed Mar. 4, 2015) or International Applications PCT/US2012/043273 (filed Jun. 20, 2012), PCT/US2013/072733 (filed Dec. 3, 2013), PCT/US2015/051588 (filed Sep. 23, 2015), PCT/US2016/020216 (filed Mar. 1, 2016), or PCT/US2016/028,354 (filed Apr. 20, 2016), preferably where the MXene composition comprises titanium and carbon (e.g., Ti3C2, Ti2C, Mo2TiC2, etc.). Each of these compositions is considered independent Aspects of this Embodiment. Similarly, MXene carbides, nitrides, and carbonitrides are also considered independent Aspects of this Embodiment. In certain specific Aspects, the MXene composition comprises: (a) at least one layer having first and second surfaces, each layer described by a formula Mn+1XnTxand comprising: substantially two-dimensional array of crystal cells, each crystal cell having an empirical formula of Mn+1Xn, such that each X is positioned within an octahedral array of M, wherein M is at least one Group IIIB, IVB, VB, or VIB metal, wherein each X is C, N, or a combination thereof; n=1, 2, or 3; and wherein Txrepresents surface termination groups; or (b) at least one layer having first and second surfaces, each layer comprising: a substantially two-dimensional array of crystal cells, each crystal cell having an empirical formula of M′2M″nXn+1Tx, such that each X is positioned within an octahedral array of M′ and M″, and where M″nare present as individual two-dimensional array of atoms intercalated between a pair of two-dimensional arrays of M′ atoms, wherein M′ and M″ are different Group IIB, IVB, VB, or VIB metals (especially where M′ and M″ are Ti, V, Nb, Ta, Cr, Mo, or a combination thereof), wherein each X is C, N, or a combination thereof; n=1 or 2; and wherein Txrepresents surface termination groups. Embodiment 2. The antenna of Embodiment 1, wherein at least one of said surfaces of each layer has surface termination groups (Tx) comprising alkoxide, carboxylate, halide, hydroxide, hydride, oxide, sub-oxide, nitride, sub-nitride, sulfide, thiol, or a combination thereof Embodiment 3. The antenna of Embodiment 1 or 2, wherein each M, M′, and M″ is independently at least one Group IVB, Group VB, or Group VIB metal Embodiment 4. The antenna of any one of Embodiments 1 to 3, wherein M, M′, and M″ is independently Cr, Ti, Mo, Nb, V, or Ta, or a combination thereof. Embodiment 5. The antenna of any one of Embodiments 1 to 4, wherein the MXene composition is described by the formula Mn+1Xn. Embodiment 6. The antenna of Embodiment 5, wherein Mn+1Xnis Ti2C, V2C, V2N, Cr2C, Zr2C, Nb2C, Hf2C, Ta2C, Mo2C, Ti3C2, V3C2, Ta3C2, Mo3C2, (Cr2/3Ti1/2)3C2, Ti4C3, V4C3, Ta4C3, Nb4C3, or a combination thereof, preferably Ti2C, Mo2TiC2, Ti3C2, or a combination thereof. Embodiment 7. The antenna of any one of Embodiments 1 to 4, wherein the MXene composition is described by the formula M′2M″nXn+1Tx. Embodiment 8. The antenna of Embodiment 7, wherein n is 1, M′ is Mo, and M″ is Nb, Ta, Ti, or V, or a combination thereof. Embodiment 9. The antenna of Embodiment 7, wherein n is 2, M′ is Mo, Ti, V, or a combination thereof, and M″ is Cr, Nb, Ta, Ti, or V, or a combination thereof. Embodiment 10. The antenna of Embodiment 7, wherein M′2M″nXn+1comprises Mo2TiC2, Mo2VC2, Mo2TaC2, Mo2NbC2, Mo2Ti2C3, Cr2TiC2, Cr2VC2, Cr2TaC2, Cr2NbC2, Ti2NbC2, Ti2TaC2, V2TaC2, Mo2Ti2C3, Mo2V2C3, Mo2Nb2C3, Mo2Ta2C3, Cr2Ti2C3, Cr2V2C3, Cr2Nb2C3, Cr2Ta2C3, Nb2Ta2C3, Ti2Nb2C3, Ti2Ta2C3, V2Ta2C3, V2Nb2C3, or V2Ti2C3, or a nitride or carbonitride analog thereof. Embodiment 11. The antenna of any one of Embodiments 1 to 10, wherein the electrical signals are in a radio frequency range, wherein the radio frequency is considered to span the kilohertz to gigahertz frequency range. Embodiment 12. The antenna of any one of Embodiments 1 to 10, wherein the electrical signals are in a frequency range of from about 3 kHz to about 300 GHz, including a frequency defined by one or more of the ranges of from 3 kHz to 5 kHz, from 5 kHz to 10 kHz, from 10 kHz to 50 kHz, from 50 kHz to 100 kHz, from 100 kHz to 500 kHz, from 500 kHz to 1 GHz, from 1 GHz to 2 GHz, from 2 GHz to 3 GHz, from 3 GHz to 4 GHz, from 4 GHz to 5 GHz, from 5 GHz to 10 GHz, from 10 GHz to 50 GHz, from 50 GHz to 100 GHz, from 100 GHz to 300 GHz. Embodiment 13. The antenna of any one of Embodiments 1 to 12, wherein the electrical signals are in a frequency range of from about 1 GHz to about 10 GHz. Embodiment 14. The antenna of any one of Embodiments 1 to 13, wherein the antenna is transmitting or receiving electrical signals in a range of from about 3 kHz to about 300 GHz, including a frequency defined by one or more of the ranges of from 3 kHz to 5 kHz, from 5 kHz to 10 kHz, from 10 kHz to 50 kHz, from 50 kHz to 100 kHz, from 100 kHz to 500 kHz, from 500 kHz to 1 GHz, from 1 GHz to 2 GHz, from 2 GHz to 3 GHz, from 3 GHz to 4 GHz, from 4 GHz to 5 GHz, from 5 GHz to 10 GHz, from 10 GHz to 50 GHz, from 50 GHz to 100 GHz, from 100 GHz to 300 GHz. Embodiment 15. The antenna of any one of Embodiments 1 to 14, wherein the antenna is operably coupled to a radio transmitter or a radio receiver by at least one transmission line. Embodiment 16. The antenna of Embodiment 15, wherein the receiver is further operably coupled to an amplifier. Embodiment 17. The antenna of any one of Embodiments 1 to 16, wherein the antenna is a monopole antenna. Embodiment 18. The antenna of any one of Embodiments 1 to 16, wherein the antenna is a dipole antenna. Embodiment 19. The antenna of any one of claims1to18, wherein the MXene composition comprises any composition described in U.S. patent application Ser. No. 14/094,966, filed Dec. 3, 2013, or its precursors. Embodiment 20. The antenna of any one of Embodiments 1 to 18, wherein the MXene composition comprises any composition described in PCT/US2015/051588, filed Sep. 23, 2015, or its precursors. Embodiment 21. The antenna of any one of Embodiments 1 to 18, wherein the MXene composition comprises any composition described in PCT/US2016/020216, filed Mar. 1, 2016, or its precursors. Embodiment 22. The antenna of any one of Embodiments 1 to 18, wherein the MXene composition comprises any composition described in PCT/US2016/028354, filed Apr. 20, 2016, or its precursors. Embodiment 23. The antenna of any one of Embodiments 1 to 22, wherein the MXene composition is present as a coating on a conductive or non-conductive substrate, preferably a non-conductive substrate including a substrate comprising organic polymer, inorganic (e.g., glass or silicon), or fabric (including synthetic and natural fiber) substrates. Since MXene can be produced as a free-standing film, in principle the antenna can be applied to almost any substrate material, depending on the intended application, with little dependence on morphology and roughness, though speed and losses may be affected by the nature of the substrate, especially in the GHz range. In independent Aspects of this Embodiment, the substrate may be a non-porous, porous, microporous, or aerogel form of an organic polymer, for example, a fluorinated or perfluorinated polymer (e.g., PVDF, PTFE) or an alginate polymer, a silicate glass, silicon, GaAs, or other low-K dielectric, an inorganic carbide (e.g., SiC) or nitride (Al3N4) or other thermally conductive inorganic material wherein the choice of substrate depends on the intended application. Embodiment 24. The method of Embodiment 23, wherein the substrate is rigid. Embodiment 25. The method of Embodiment 23, wherein the substrate is flexible. Embodiment 26. The method of any one of Embodiments 23 to 25, wherein the coating is areal; i.e., coating an unpatterned area of the substrate. Embodiment 27. The method of any one of Embodiments 23 to 25, wherein the coating is patterned on the substrate Embodiment 28. The antenna of any one of Embodiments 23 to 27, wherein the MXene coating comprises a binder, preferably an organic polymer or glass binder. In principle, the nature of the binder is not limiting, though in some Aspects of this Embodiment, the binders can be any organic polymer, but is preferably a fluorinated or perfluorinated (e.g., PVDF, PTFE), silicate glass, or alginate polymers. In other Aspects of this Embodiment, the binder has dielectric permittivity of less than 5, preferably less than 4, 3.5, 3, 2.5, or 2 at 1 GHz. Embodiment 29. The antenna of any one of Embodiments 23 to 27, wherein the MXene coating is binder-free. In some Aspects of this Embodiment, the binder-free MXene coatings can be laminated and/or coated, for example, with alginate or other organic polymers to make them more durable. Embodiment 30. The antenna of any one of Embodiments 23 to 29, wherein the MXene coating is present as a thickness in range of from 25 nm to 1000 microns, or in a range defined by one or more of the ranges of from 1 nm to 1000 microns, or in a range defined by one or more of the ranges of from 1 nm to 5 nm, from 5 nm to 10 nm, from 10 nm to 15 nm, from 15 nm to 20 nm, from 20 nm to 25 nm, from 25 nm to 50 nm, from 50 nm to 100 nm, from 100 nm to 150 nm, from 150 nm to 200 nm, from 200 nm to 250 nm, from 250 nm to 500 nm, from 500 nm to 1000 nm, from 1000 nm to 1500 nm, from 1500 nm to 2500 nm, from 2500 nm to 5000 nm, from 5 μm to 100 μm, from 100 μm to 500 μm, from 500 μm to 1000 μm, depending on the functioning or environmental stresses applied to the antenna when additional mechanical robustness of the antenna is required. Embodiment 31. The antenna of any one of Embodiments 23 to 30, wherein the MXene is present in the coating as an overlapping array of two or more overlapping layers of MXene platelets oriented to be essentially coplanar with the substrate surface. Embodiment 32. The antenna of Embodiment 31, wherein the MXene platelets have at least one mean lateral dimension in a range of from about 0.1 micron to about 50 microns, or in a range defined by one or more of the ranges of from 0.1 to 2 microns, from 2 microns to 4 microns, from 4 microns to 6 microns, from 6 microns to 8 microns, from 8 microns to 10 microns, from 10 microns to 20 microns, from 20 microns to 30 microns, from 30 microns to 40 microns, or from 40 microns to 50 microns. Embodiment 33. The antenna of any one of Embodiments 1 to 22, wherein the antenna is a molded or formed body comprising the MXene composition. Embodiment 34. The antenna of any one of Embodiments 1 to 33, wherein the MXene composition is covered by an organic polymer or glass coating. Again, potentially any polymer composition can be used, but protection from the environmental influence is desired. In certain Aspects of this Embodiment, polymers such as acrylates, methacrylates, polyvinyl alcohol, epoxies, or polyurethanes can be used, applied for example by spin coating, dip-coating, painting, or other such application. Embodiment 35. A radio (one way and/or two way radio), a television, a communication receiver, a radar set, a cell phone, garage door opener, wireless microphone, Bluetooth-enabled device, wireless enabled device, wireless charger (for batteries and supercapacitors), wireless computer network, baby monitor, or RFID tag comprising the antenna of any one of Embodiments 1 to 34. Embodiment 36. A method of transmitting electromagnetic information comprising applying an electric current oscillating at a radio frequency to the antenna of any one of Embodiments 1 to 34, such that the antenna radiates a radio wave. Embodiment 37. A method comprising receiving radio wave information by the antenna of any one of Embodiments 1 to 34, and converting the information to a useable audio signal, video signal, or digital data using a radio receiver. EXAMPLES The following Examples are provided to illustrate some of the concepts described within this disclosure. While each Example is considered to provide specific individual embodiments of composition, methods of preparation and use, none of the Examples should be considered to limit the more general embodiments described herein. Example 1. Experimental Details Example 1.1. Antenna Fabrication Example 1.1.1. MXene and Copper Film Dipoles To create MXene antennas, Ti3C2, Ti2C, Mo2TiC2MXene films of were first cut into strips, 3 mm in width and 30 mm in length. Two strips were arranged with a 2.5 mm gap between them and attached to polyethylene terephthalate (PET transparency sheet) using a double-sided Scotch tape as an adhesive to form the arms of the dipole structure with an initial total length of 62.5 mm (FIGS.1(A-C)). As a control, a copper film diploe was made following the same pattern (width and length). A gold-plated SubMiniature version A (SMA) connector was fixed to the PET substrate using conductive epoxy glue. The thicknesses of the all MXene films were about 5 μm and the copper film thickness was about 60 μm. Example 1.1.2. Ti3C2Spray-Coated Film Dipoles Four similar Ti3C2antennas (similar length and width) with different thicknesses were fabricated by spray coating Ti3C2ink (Ti3C2flakes colloidal solution in water). To do so, Ti3C2antenna dipole pattern with arms of 3 mm wide×30 mm length were spray coated on a PET sheet, with four different thicknesses of ˜70 nm, 150 nm, 250 nm and 500 nm. A gold-plated SubMiniature version A (SMA) connector was fixed to the PET substrate using conductive epoxy glue. Example 2. Antenna Measurements The return loss (S11) of the MXene film antennas was considered as the initial performance metric, illustrating the amount of power accepted by the antenna rather than reflected back to the source (FIG.3). The return loss of the sample antennas was measured with an Agilent N5230A vector network analyzer. Copper film dipole exhibited a peak return loss of over 47 dB. The Ti3C2MXene film dipole exhibited a peak return loss of over 45 dB. On a linear scale, a return loss of 45 dB equates to more than 99.99% of the incident signal not having returned to the source. Ti3C2had a conductivity of about 4800 S/cm, which is about two orders of magnitude smaller than that of copper at 600,000 S/cm. Ti2C and Mo2TiC2MXene film dipoles with a thickness of ˜5 μm were also tested and they showed a return loss of 18 dB and 20 dB, respectively. The MXene antennas outperformed the return loss of previously reported carbon nanomaterials such as graphene, onion-like carbon (OLC) and carbon nanotubes (CNT) film diploes. Both OLC and CNT had a return loss at or below 10 dB. See N. A. Vacirca, et al., Onion-like carbon and carbon nanotube film antennas.Applied Physics Letters,103, 073301 (2013). Moreover, a compressed graphene laminate film dipole, which its conductivity was improved to ˜430 S/cm by rolled compression, still exhibited a return loss of ˜12 dB. See X. Huang, et al. Binder-free highly conductive graphene laminate for low cost printed radio frequency applications.Applied Physics Letters106, 203105 (2015). In comparison, even Mo2TiC2MXene at ˜100 S/cm, which is the lowest conductivity among the tested MXenes, showed better return loss (20 dB). Moreover, Ti3C2flake size can be controlled. Ti3C2with flake size smaller than 1 μm (small flake Ti3C2) and larger flake size with average size of 3-6 μm (large flake Ti3C2) were fabricated as shown inFIG.4AandFIG.4B. The return loss of small flake Ti3C2was measured to be 25 dB, which is still very high (>99% efficiency). Decreasing the efficiency can be due to the lower conductivity of the smaller Ti3C2flakes film, which is around ˜ 3000 S/cm. Return loss results also show that using smaller flake Ti3C2can increase the bandwidth of the antenna (FIG.3). To maintain energy conservation, antenna power must either be radiated from the antenna or lost in another form, such as heat. Though a small amount of heat will be generated in any real, non-ideal system, a measurement of the antenna's radiation pattern can confirm that power is indeed radiating out from the antenna. This measurement is made by rotating the sample antenna about an axis and measuring the power received by a calibrated stationary receiver antenna. Reflections and outside interference are minimized by performing this procedure within an anechoic chamber. Experimental measurements were performed in an anechoic chamber by aligning the substrate and dipole arms vertically normal to the receiver antenna and stepping the device through a full rotation in the elevation plane. Measurements sampled from this rotation represent a cross-section of the 3-dimensional toroidal radiation pattern. All experimental radiation measurements (FIGS.5(A-F)) were made relative to the peak gain of a cylindrical reference dipole with a peak gain at 2.4 GHz of 2.5 dBi (FIGS.5(A-F)). The Ti3C2film dipole (with a thickness of ˜5 μm) exhibits a peak gain of 1.1 dBi (FIG.5A), almost similar to that of the copper film dipole at 1.7 dBi (FIG.5B). To measure the required thickness for Ti3C2to achieve a good peak gain, spray-coated Ti3C2films with different thicknesses were tested. Peak gains of 0.1 dBi, −1.41 dBi, −4.97 dBi, and −5.2 dBi were measured for the 500, 250, 150 and 70 nm thickness films, respectively (FIGS.5(C-F)). Peak gain measured for Ti3C2is among the highest measured for synthetic nanomaterials. For example, OLC and CNT film dipoles showed peak gains of −1.48 dBi and −2.76 dBi, respectively. Moreover, the peak gain of compressed graphene film with a thickness of 6 μm was also measured to be ˜−0.6 to −1.0 dBi, which is less than that of the Ti3C2film dipole with 500 nm thickness. Example 3. Additional Comments The following features are relevant to the disclosed invention(s): This work demonstrated the fabrication of dipole antennas made from different MXene compositions of Ti3C2, Ti2C, Mo2TiC2as exemplars of the general MXene family. The films exemplified here were binder free and fabricated simply from the MXene colloidal solutions in water (MXene ink). Since MXenes can be made in colloidal aqueous and non-aqueous (e.g., organic solvent) solutions, they can be used as ink to print, spray paint, etc. any shape, design and thickness to fabricate very thin, flexible and transparent antennas in one simple step. Any kind of antenna fabrication method can be employed, for example printing, spraying, coating, painting, rolling MXene clay into films, cutting complicated shapes for different antenna designs. MXene return loss and peak gain outperformed any synthetic materials. Although MXenes are theoretically not as conductive as copper, the present work showed that MXene outperforms copper, the mostly used and very well-known antenna material. The as synthesized binder free titanium carbide (Ti3C2) MXene film dipole antenna showed a return loss of about 50 dB. The MXene antenna's radiation pattern measurements showed a peak gain similar to the copper dipole antenna. Such a high antenna performance has never been reported for any nanomaterials. With the variety of MXene composition, it was and will be possible to tune the antenna for different applications. By controlling the flake size, the bandwidth of the antenna can further be controlled. Fabricating MXene-polymer composites can protect MXene from oxidation and can further improve its flexibility. In order to make MXenes films mechanically more robust, 2D MXene flakes can be embedded in polymer matrices. Moreover, using a polymer as a matrix can further improve the oxidation resistance of MXenes. Example 4 A variety of antennae comprising MXene materials have been tested to transmit and receive RF signal in a wide frequency range. Two exemplary configurations include dipole antennas (FIG.6A) and transmission lines (FIG.6B). In the former configurations, dipole antennas were prepared with filtered Ti3C2film of various thicknesses. The optimal dimensions are shown inFIG.6A. Two stripes of dipole antenna were connected with conductive silver epoxy to the connector SMA-SJEDM-11BS00. Dipole antennas were analyzed with Agilent VNA with input impedance 50 Ohm. With these antennae, it was possible to achieve reflection coefficients of about −65 dB which makes MXene dipole antennas more efficient than the printed graphene, laminated graphene, graphene/PANI or silver ink printed. The highest reflection was obtained with a 12-μm Ti3C2film. The Q factor for this device which represent the quality of antenna was 2500. Two different dipole antennas were also prepared with different thicknesses of 8 μm and 128 μm and their performances were compared to the 12-μm thick film dipole antenna. While antennae having MXene thicknesses ranging from 8 μm to 128 μm were found to show good performance, the antenna having a thickness of 12-μm was found to be the optimum required thickness for MXene antennas (FIG.7B). To show how MXene can transmit radio frequency signal, Ti3C2transmission lines (TLs) were prepared as shown inFIG.6B. Transmission lines are basic devices designed to carry signal through the material and essential for signal transmission, impedance matching network, resonators, filters etc. The stripe in the middle conducts the signal whereas other two stripes represent the grounding (FIG.6B). The main characteristics of TLs are transmission coefficient, or S21parameter, and attenuation. The measurements were done with 2 port Agilent VNA in the range between 0.5 GHz to 8 GHz. Attenuation was calculated using equation: Attenuation=1-❘"\[LeftBracketingBar]"S11❘"\[RightBracketingBar]"2❘"\[LeftBracketingBar]"S21❘"\[RightBracketingBar]"2 where S21and S11parameters (S-parameters) represent transmission and reflection coefficients, respectively. Calculated attenuation is also known as insertion loss. MXene TLs were prepared by spraying MXene water based ink containing Ti3C2flakes on a PET sheet with a thickness of 0.12 mm and dielectric constant of 3.4. The thickness of the sprayed MXene film was measured by scanning electron microscopy (SEM) to be 2 μm. The smooth surface of PET allowed for the production of well aligned film with bulk conductivity in the range of 5000 S/cm.FIG.8Ashows reflection and transmission coefficients of the sprayed Ti3C2MXene on PET. The film was annealed in vacuum for 24 hours at 200° C. The attenuation was calculated using MATLAB from the measured coefficients.FIG.8Bshowed MXene attenuation was almost constant throughout the entire frequency range tested, up to 8 GHz. This indicated that MXene attenuation, unlike graphene or silver ink, is frequency independent which opens a wide range of applications for MXenes as antenna. Sprayed Ti3C2on PET substrate showed less losses that printed graphene or silver ink which makes it more attractive for RF systems (FIG.8B). Thicker MXene films were also tested as TLs. To do so, Ti3C2MXene clay powder was rolled into a film and placed on paper substrate and vacuum dried at 150° C. for 5 hours. The thickness of the rolled clay film was 30 μm, which was 10 times thicker than the sprayed one. The performance of the thicker film is comparable with the thin sprayed sample (FIGS.8C-D), which proved that the thickness of the skin depth was not a limitation factor for MXene antennas. Moving towards wearable devices, samples were also prepared using printing paper as a substrate for making MXene TLs. Spraying MXene ink on paper led to penetration of Ti3C2solution into the fiber texture of the paper. The flakes were matching randomly distributed paper microfibers which led to lower conductivity (see Table 1). However,FIGS.8E-Fshow comparable performance with the aligned sprayed MXene film. TABLE 1Resistance and conductivity values for the materials for transmission lineSubstrateThickness, mmResistance, Ohms/sqBulk conductivity, S/cmPaper0.2477140.4811454PET0.00215000Rolled film0.030.41250 According to these results, TLs and dipole antennas comprising MXene were shown to be good candidates for RFID antennas. The designed and fabricated MXene RFID antennas as shown inFIG.9. The RFID chip is UCODE7, the working range is from 860 MHz to 960 MHz. With sprayed MXene ink solution on paper it was possible to reach the working distance 8 meters. The following references may be useful in understanding some of the concepts described in this application. They do not constitute any admission of prior art to this application1. Lamminen. Antti, et al. “Graphene-Flakes Printed Wideband Elliptical Dipole Antenna for Low Cost Wireless Communications Applications.”IEEE Antennas and Wireless Propagation Letters(2017).2. Huang, Xianjun, et al. “Binder-free highly conductive graphene laminate for low cost printed radio frequency applications”Applied Physics Letters106.20 (2015) 203105.3. Shin. Keun-Young, Sunghun Cho, and Jyongsik Jang. “Graphene/Polyanilne/Poly (4-styrenesulfonate) Hybrid Film with Uniform Surface Resistance and Its Flexible Dipole Tag Antenna Application.”small9.22 (2013) 3792-3798.4. Sidén, Johan, et al. “Reduced amount of conductive ink with gridded printed antennas.”Polymers and Adhesives in Microelectronics and Photonics, Polytronic.2005. Polytronic 2005. 5th International Conference on. IEEE, 2005.5. Pozar, David M.Microwave engineering. John Wiley & Sons. 2009.6. Huang. Xianjun, et al. “Graphene radio frequency and microwave passive components for low cost wearable electronics.” 2D Materials3.2 (2016): 025021.7. Chiolerio, Alessandro, et al. “Ag nanoparticle-based inkjet printed planar transmission lines for RF and microwave applications, considerations on ink composition, nanoparticle size distribution and sintering time.”Microelectronic Engineering97 (2012): 8-15.8. Ghidiu, Michael, et al “Conductive two-dimensional titanium carbide ‘clay’ with high volumetric capacitance.”Nature516.7529 (2014): 78. As those skilled in the art will appreciate, numerous modifications and variations of the present invention are possible in light of these teachings, and all such are contemplated hereby. For example, in addition to the embodiments described herein, the present invention contemplates and claims those inventions resulting from the combination of features of the invention cited herein and those of the cited prior art references which complement the features of the present invention. Similarly, it will be appreciated that any described material, feature, or article may be used in combination with any other material, feature, or article, and such combinations are considered within the scope of this invention. The disclosures of each patent, patent application, and publication cited or described in this document and the Appendices attached to this specification are hereby incorporated herein by reference, each in its entirety, for all purposes, or at least for the purpose described in the context in which the reference was presented. | 57,995 |
11862849 | DETAILED DESCRIPTION Certain embodiments relate to a mmW radome that may exhibit enhanced performance, especially under adverse weather conditions, such as wind. The radome may protect a beam-forming antenna system having at least one operating frequency (e.g., including at least one antenna having at least one operating frequency) and associated electronics from the weather conditions. In certain embodiments, a mmW radome may have a body, an aperture in the body, a film covering the aperture, and a support at least partially in the aperture. The film and the support are made from materials which have a low loss at the desired frequency of operation, e.g., at a first frequency of the at least one operating frequency and/or at more than one of the at least one operating frequency. According to certain embodiments, the aperture may be positioned at or near a boresight of the beam-forming antenna system. The film may be thin and backed by the support, to mitigate distortion of the film, such as deflection from wind loading, and therefore mitigate impact upon the transmission characteristics of the radome and, therefore, upon the beam formed by the antenna. The radome may therefore be thin and light and provide improved RF transmission characteristics as compared to a thick radome, and be more resistant to adverse effects from weather conditions and provide improved RF transmission characteristics as compared to a thick radome. Certain embodiments relate to a method of making a mmW radome. Certain embodiments include molding a radome body with an aperture and a film included therein. In certain embodiments a support may be installed at least partially into the aperture as part of a subsequent molding process. According to an embodiment, a mmW radome has a body, an aperture in the body, a film covering the aperture, and a support installed into the aperture. Such a radome may protect one or more beam-forming antennae and associated electronics from weather conditions. The film and the support may be made from materials which have a low transmission loss at a desired frequency of operation of a protected beam-forming antenna. The support may provide backing, support, and rigidity for the film, so that distortion of the film by weather conditions, such as wind, is reduced. Thus, the integrity of the beam formed by the antenna may be preserved. FIG.1is an illustration of radome10according to an embodiment. Radome10includes radome body12(often referred to herein as “body12”), such as conventional radome structure, aperture14in body12, film16covering aperture14, and support18at least partially in aperture14. Film16and support18may be made from materials which have a low loss at a desired frequency of operation of an associated antenna structure, such as phased array circuit board20, which includes a plurality of beamforming Application Specific Integrated Circuits (ASICs)22. ASICs22may transmit and/or receive RF signals at the desired operating frequency or frequencies and phase), shown as RF signal24. According to an embodiment, phased array circuit board20can steer the antenna pattern from boresight to provide a desired coverage area (the “beam steering range”) in a conventional manner. According to an embodiment aperture14may be large enough to accommodate the beam steering range of board20. FIG.2is an illustration of radome10according to an embodiment. Again, radome10includes body12, aperture14in body12, film16covering aperture14, and support18. Also shown are Phased Array Antenna Module (PAAM) frame26, PAAM printed circuit board28, and PAAM antenna cavity30for board28. In the embodiment ofFIG.2, two supports18are shown, but a single support or other number of supports may be used. The shading of components26and30is for clarity of illustration. According to an embodiment, PAAM printed circuit board28can steer a corresponding antenna pattern from boresight to provide a desired coverage area. According to an embodiment, aperture14and PAAM antenna cavity30may be large enough to accommodate PAAM28beam steering range. Gaps (not numbered) are shown between the various components shown inFIGS.1and2. Although these gaps may provide clarity of illustration, in certain embodiments there may be no gaps between ones of the various components, or gaps may be present between ones of the various components. For example, there may be no intentional gap between film16and foam support18in certain embodiments. Further, “low loss”, as used herein means that attenuation of an RF signal at a desired operating frequency by a component does not unacceptably impair the operation of a system transmitting and/or receiving at that desired operating frequency. The degree of attenuation which is acceptable may be based on, for example, the transmitter power, the received signal strength, the sensitivity of the receiver, the amount of heating which the component can tolerate due to absorption of the transmitted signal, atmospheric attenuation, and/or the desired operating range (distance) of the system. A component may exhibit low loss as a result of, for example, its dielectric constant, or its thickness. Referring toFIGS.1and2, body12may take the form of a conventional radome and be made of, for example, a conventional radome material which has a low loss at the desired antenna operating frequency, and which is mechanically robust enough to survive the conditions of the area where radome10is to be used, such as wind, rain, snow, ice, and sun. For example, radome body12may be injection molded with a PC/ABS resin, such as, Makrolon 6020, available from Covestro LLC (Baytown, Texas), or SABIC EXL9134, available from Tekra, LLC. (New Berlin, Wisconsin). According to certain embodiments, body12may be thin, taking into consideration its size and the conditions that it may endure. For example, body12may have a thickness of approximately ½ wavelength at the operating frequency, giving due consideration to the dielectric constant of body12. While radome body12may be sufficiently thick to have sufficient structural integrity to mitigate physical distortion, such as would otherwise occur from, for example, weather conditions. Film16, which covers aperture14, and support18, which is at least partially within aperture14, are supported by radome body12, such that structural requirements for these components may be reduced. This may allow for use of materials selected to reduce transmission loss and distortion of RF signal24as compared to radome body12. According to certain embodiments, overall radome design may thus be less sensitive to the actual dimensions of the antenna structure, as compared to a monolithic radome. Aperture14, film16, and support18, can be tailored to a desired operating frequency and beam steering range. Materials used for a conventional radome that provide for low loss may not provide structural stability, whereas materials that provide adequate structural stability may not provide for low loss. In contrast, however, in radome10described herein, film16and support18can be made from materials that reduce transmission loss and distortion of RF signal24, and radome body12can be made from materials that provide structural stability, thus providing a physically robust radome10which provides low loss RF signal transmission. Thus, radomes according to certain embodiments may be suitable for use across a wider range of frequencies, with less attenuation and distortion of RF signal24, than a conventional monolithic-structure radome design. In an embodiment, film16may be thin, and support18may take the form of a foam, so the combined film16and support18have a low combined dielectric constant. Aperture14may be sized based at least partially upon the frequency of operation and the desired steering range. For example, for a desired operating frequency of 28.5 GHz, and a beam steering range of ±60 degrees, aperture14may be about 101.479 mm high by 124.272 mm wide. The size of aperture14may at least partially depend upon the desired beam steering range and the distance between the front of aperture14(i.e., film16) and ASICs22. Film16may be composed of a material having a low loss at the desired communications operating frequency, which can be applied to body12in a label-type form, and which can withstand the environmental conditions that it should endure. The thickness of film16may be selected in view of the environmental conditions and the expected or specified operational duration of film16or radome10. Film16should be thick enough to securely bond to radome body12and to support18, and thick enough to resist wind and other environmental conditions. The lower the dielectric constant of film16, and/or the thinner film16is, the better it may operate. The thickness of film16may be selected, at least in part, upon the desired frequency of operation, such as by being less than a small fraction of a wavelength at the frequency of operation, when the dielectric constant of film16is considered. For example, assuming an operating frequency of approximately 28.5 GHz, film16may have a thickness of about 100 μm to about 250 Film16is thin so, for a large range of dielectric constants, any distortion of the film, and/or any deflection of position of the film, such as by wind, will have minimal effect on the RF performance of radome10. The degree to which film16overlaps body12may be selected based upon, at least in part, structural, environmental and materials used for body12and film16considerations, as well as the process of application of film16to body12. A very windy environment where rain or drizzle can freeze may require more overlap than a calm, moderate, drier environment. In an embodiment, film16may overlap body12by approximately 0.25 inches. In-mold labeling of film16to body12may, however, utilize less bonding area than adhesive bonding of film16to body12. According to an embodiment, an adhesive applied to at least a portion of a periphery of film16and/or around aperture14may adhere film16to body12. The materials selected for film16and body12should be structurally matched; e.g., both should be suitable for use with the desired manufacture method, such as in-mold labeling or by using a selected adhesive. Support18may be composed of a material that provides for low signal loss at the desired operating frequency and which, when at least partially retained in aperture14, provides support, or backing, for film16, such that distortion (e.g., deflection) of film16is minimized under expected or specified environmental operating conditions. The thickness of support18may be selected at least partially based upon the desired frequency of operation, such as an integer multiple of a half-wavelength at the frequency of operation when the dielectric constant of support18is considered. According to certain embodiments, film16and support18may have a combined thickness, and aperture14may have a size, such that radome10provides the desired beam steering range while minimizing signal distortion and loss. In an exemplary environment, operating conditions for radome10are: wind speeds up to 120 miles per hour, with debris impact; temperatures from −40 degrees C. to +100 degrees C.; rainfall of 60 inches/year; and 8,000 hours of sunlight exposure, including exposure to ultraviolet light. In an embodiment, the strain in film16due to environmental operating conditions is less than 90% of the proportional strain limit as determined by film tensile testing and published by the film manufacturer. According to certain embodiments, support18may extend beyond the front of body12. According to certain embodiments, support18may extend beyond the rear of body12. According to certain embodiments, support18may extend both beyond the front of body12and the rear of body12. Support18is contained within radome10, so it is not exposed to moisture (e.g., rain or snow) and this allows for a wider range of materials that may be used for support18. Support18may be composed of a material which is not degraded by the expected environmental temperature range, operating frequency, or transmitter power levels. Such a support may be composed of a material that does not attract or retain moisture. Such a support has a thickness of about 2 mm to about 3 mm and takes the form of a low density rigid polyurethane foam. Such a foam may provide a low density with good structural performance and bond well to film16during molding (discussed below). Also, although a thinner, lower profile support may provide better RF transmission characteristics than a thicker support, in certain embodiments the support may be sufficiently thick to maintain film16at a desired distance from ASICs22, so that any deflection of film16does not cause detuning of ASICs22. Such a distance may be, for example, about ½ wavelength at the operating frequency of interest. According to certain embodiments, for an operating frequency of about 28 GHz, ½ wavelength is approximately 5.35 mm. According to an embodiment radome10may be suitable for use on a communications tower, where it may experience a number of varying weather conditions. The frequency of operation, e.g., the desired frequency, may be, for example, between about 6 GHz and about 100 GHz. For example, the desired frequency may be suitable for cellular telephone 5G band communications. For example, such a radome may be useful for communications at or around a desired operating frequency of 28.5 GHz. Also, for example, such a radome may be useful for communications in the 3rd Generation Partnership Project (3GPP) New Radio (NR) Frequency Range 2 (FR2) bands, such as, for example, bands N257-261, which have respective frequency ranges of: 26,500 MHz-29,500 MHz; 24,250 MHz-27,500 MHz; 39,500 MHz-43,500 MHz; 37,000 MHz-40,000 MHz; and 27,500 MHz-28,350 MHz. According to an embodiment, such radome10may have radome body12in the form of a flat plate, and dimensions of approximately 120 mm by 145 mm. The dimensions may depend, at least in part, upon the particular environment, such as the number of communication cells in an area, and the number of communication devices on a communication tower. Signal transmission is a function of at least the material of radome body12, the thickness of the material, the design (flat, tapered, convex, etc.) of radome body12, and the frequency of operation. For a given material, determining the thickness to achieve maximum transmission at a given directional angle and a given frequency is fairly straightforward. Achieving maximum transmission over a wider range of angles and over a wider range of frequencies, however, generally requires a compromise as one thickness and/or dielectric constant may optimize transmission for a given directional angle and frequency but at the expense of transmission for another directional angle and/or frequency. For example, for a phased array antenna system, in the 28 GHz frequency band, with a flat plate design, a thickness of 3.2 mm with a given dielectric constant may optimize transmission at 0 degrees directional angle, but a thickness of 3.7 mm may optimize transmission at ±60 degrees directional angle. Therefore, according to a certain embodiment, the radome material has a thickness of 3.5 mm. Also, when giving consideration to the operating frequency, the range of directional angles, and acceptable losses, the dielectric constant and/or thickness of radome body12may be determined mathematically and/or empirically. According to a certain embodiment, radome body12is injection molded and is a thermoplastic polycarbonate with a dielectric constant above 2.7 and a thickness of 2 to 3 mm. According to an embodiment, such radome10may include film16. Such a film may have dimensions of about 114.179 mm by about 136.972 mm. Such a film may take the form of a polycarbonate film which is about 100 μm to about 250 μm thick. Such a film may be selected to withstand typical or projected weather conditions. Such a film may be selected to withstand typical or projected weather conditions for at least seven years. According to an embodiment film16may take the form of a commercially available film. An example of a commercially available film product for in-mold labeling is SABIC Lexan HP92 W, HP12 W Tekra film, available from Tekra, LLC (New Berlin, Wisconsin). An example of a commercially available film product for adhesive bonding is 3M 7735, available from Tekra, LLC, and from the 3M Company (St. Paul, Minnesota). The dielectric constant of a polycarbonate film is typically in the range of 2.4 to 3.3. The dielectric constant of film16may not significantly affect system performance if the thickness of film16is less than about 500 μm. According to a certain embodiment, film16may be integrally molded to body12by fusing film16to body12, such as by using in-mold labeling to apply film16to body12. According to an embodiment, such radome10may have support18having dimensions suitable for use with an aperture about 101.479 mm high by about 124.272 mm wide (assuming a beam steering range of about ±60 degrees). In an embodiment, such support18may take the form of a foam having a dielectric constant between about 1.05 and about 1.25. In certain embodiments, support18may take the form of a foam having a dielectric constant of about 1.05 to about 1.15 and a thickness of about 6 mm to about 10 mm. A foam with a higher dielectric constant may be used if any loss due to the higher dielectric constant is acceptable. Such a support may take the form of a low-density polyurethane foam. According to an embodiment, such a support may take the form of a commercially available low density polyurethane foam, such as that sourced from General Plastics Manufacturing Company (Tacoma, Washington). Thus, the radomes disclosed herein combine the structural strength of a mold injection housing or body12with signal transmission properties of a very thin film16over the primary radiating region of the antenna. The radomes disclosed herein also provide less RF loss at 28.5 GHz than conventional radomes. The radomes disclosed herein also allow for use of a beamforming antenna that provides better signal transmission and reception than conventional radomes, even at high scan angles. The radomes disclosed herein also provide a physical structure that is resistant to wind deflection. Referring now toFIG.3, there is shown a flowchart of a method300of manufacture of mmW radome10according to certain embodiments. Materials are selected at operation302: a first material for radome body; a second material for the film; and a third material for the support. The second material and the third material may each have a low loss at the desired frequency. The first material may also, if desired, have a low loss at the desired frequency. As noted herein, the materials may be selected based upon, for example, the operating frequency, the desired angles of transmission, acceptable loss, and environmental factors. At operation304, radome body12is formed with aperture14and film16included therein by an in-mold labeling process. Film16may be placed in a mold form for radome body12before or during the molding process for radome body12. When the mold gives shape to radome body12, including aperture14, film16is applied to radome body12. Thus, radome body12is formed with film16therein/thereon. In certain embodiments, film16may thus become an integral part with radome body12. At operation306, support18is molded into aperture14and to film16in a molding subsequent to the molding process of body12at operation304, such as by an injection molding process. This provides for direct fusion of support18to film16. This can also provide for direct fusion or bonding of support18to the walls of radome body12surrounding aperture14. Referring now toFIG.4, there is shown a flowchart of a method400of manufacture of radome10according to an embodiment. Materials are selected at operation402: a first material for radome body12; a second material for film16; and a third material for support18. The second material and the third material may each have a low loss at the desired frequency. The first material may also, if desired, have a low loss at the desired frequency. Radome body12with aperture14is provided at operation404. Radome body12may be provided by obtaining radome body12with aperture14, obtaining radome body12and having aperture14cut therein, obtaining radome body12and cutting aperture14therein, forming radome body12with aperture14therein, or forming radome body12and cutting aperture14therein, all by way of non-limiting examples. Radome body12may be formed by injection molding or other suitable techniques. Film16is applied over aperture14of radome body12at operation406. In certain embodiments, an adhesive may be applied to the outer edges of the inner surface of film16and/or to the outer surface of radome body12around aperture14, and then film16pressed against radome body12. In certain embodiments, film16may be fastened to body12by heat sealing or other suitable coupling techniques. According to certain embodiments, support18may be composed of foam and may be injected at operation408into aperture14and against film16. According to certain embodiments support18may be composed of foam and may be injected at operation408into aperture14and against film16, and substantially seal itself to film16. According to certain embodiments, support18may be composed of foam block which may be inserted at operation408into aperture14and held in place by a press fit. According to certain embodiments, support18may be foam block which may be inserted at operation408into aperture14and be held in aperture14by an adhesive applied to the body in the interior of aperture14. FIG.5is a flowchart of a method500of manufacture of radome10. Materials are selected at operation502: a first material for radome body12; a second material for film16; and a third material for support18. The second material and the third material may each have a low loss at the desired frequency. The first material may also, if desired, have a low loss at the desired frequency. Radome body12with aperture14is provided at operation504. Radome body12may be provided by obtaining radome body12with aperture14, obtaining radome body12and having aperture14cut therein, obtaining radome body12and cutting aperture14therein, forming radome body12with aperture14therein, or forming radome body12and cutting aperture14therein, all by way of non-limiting examples. Radome body12may be formed by injection molding or other suitable techniques. According to certain embodiments, support18may be applied to aperture14at operation506, and then film16applied to both body12and support18at operation508. According to certain embodiments, support18may be composed of foam and may be injected at operation506into aperture14. According to certain embodiments, support18may be composed of foam block which may be inserted at operation506into aperture14and held in place by a press fit. According to certain embodiments, support18may be foam block which may be inserted at operation506into aperture14and be held in aperture14by an adhesive applied to body12in the interior of aperture14. Film16is applied over aperture14of radome body12at operation508. In certain embodiments, an adhesive may be applied to the outer edges of the inner surface of the film16and/or to the outer surface of the radome body12around the aperture14, and then the film16pressed against the radome body12. In certain embodiments, the film16may be fastened to the body12by heat sealing or other suitable coupling techniques. The figures and descriptions provided herein may have been simplified to illustrate aspects that are relevant for a clear understanding of the herein described devices, systems, and methods, while eliminating, for the purpose of clarity, other aspects that may be found in typical devices, systems, and methods. Those of ordinary skill may recognize that other elements and/or operations may be desirable and/or necessary to implement the devices, systems, and methods described herein. Because such elements and operations may be well known in the art, and because they do not facilitate a better understanding of the present disclosure, a discussion of such elements and operations is not provided herein. The present disclosure is deemed to inherently include all such elements, variations, and modifications to the described aspects that would be known to those of ordinary skill in the art, particularly in view of reading the present disclosure. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an”, and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed. When an element or layer is referred to as being “on”, “engaged to”, “connected to” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to”, “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the exemplary embodiments. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this subject matter belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the specification and relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein. For brevity and/or clarity, well-known functions or constructions may not be described in detail herein. The terms “for example” and “such as” mean “by way of example and not of limitation.” The subject matter described herein is provided by way of illustration for the purposes of teaching, suggesting, and describing, and not limiting or restricting. Combinations and alternatives to the illustrated embodiments are contemplated, described herein, and set forth in the claims. For convenience of discussion herein, when there is more than one of a component, that component may be referred to herein either collectively or singularly by the singular reference numeral unless expressly stated otherwise or the context clearly indicates otherwise. For example, components N (plural) or component N (singular) may be used unless a specific component is intended. Also, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless expressly stated otherwise or the context indicates otherwise. The terms “includes,” “has,” “having,” or “exhibits,” or variations in form thereof are intended to be inclusive in a manner similar to the term “comprises” as that term is interpreted when employed as a transitional word in a claim. It will be understood that when a component is referred to as being “connected” or “coupled” to another component, it can be directly connected or coupled or coupled by one or more intervening components unless expressly stated otherwise or the context clearly indicates otherwise. The term “and/or” includes any and all combinations of one or more of the associated listed items. As used herein, phrases such as “between X and Y” and “between about X and Y” should be interpreted to include X and Y unless expressly stated otherwise or the context clearly indicates otherwise. Terms such as “about”, “approximately”, “around”, and “substantially” are relative terms and indicate that, although two values may not be identical, their difference is such that the apparatus or method still provides the indicated or desired result, or that the operation of a device or method is not adversely affected to the point where it cannot perform its intended purpose. As an example, and not as a limitation, if a height of “approximately X inches” is recited, a lower or higher height is still “approximately X inches” if the desired function can still be performed or the desired result can still be achieved. While the terms vertical, horizontal, upper, lower, bottom, top, and the like may be used herein, it is to be understood that these terms are used for ease in referencing the drawing and, unless otherwise indicated or required by context, does not denote a required orientation. The different advantages and benefits disclosed and/or provided by the implementation(s) disclosed herein may be used individually or in combination with one, some or possibly even all of the other benefits. Furthermore, not every implementation, nor every component of an implementation, is necessarily required to obtain, or necessarily required to provide, one or more of the advantages and benefits of the implementation. Conditional language, such as, among others, “can”, “could”, “might”, or “may”, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments preferably or optionally include certain features, elements and/or steps, while some other embodiments optionally do not include those certain features, elements and/or steps. Thus, such conditional language indicates, in general, that those features, elements and/or step may not be required for every implementation or embodiment. The subject matter described herein is provided by way of illustration only and should not be construed as limiting the nature and scope of the claims herein. While different embodiments have been provided above, it is not possible to describe every conceivable combination of components or methodologies for implementing the disclosed subject matter, and one of ordinary skill in the art may recognize that further combinations and permutations that are possible. Furthermore, the nature and scope of the claims is not necessarily limited to implementations that solve any or all disadvantages which may have been noted in any part of this disclosure. Various modifications and changes may be made to the subject matter described herein without following, or departing from the spirit and scope of, the exemplary embodiments and applications illustrated and described herein. Although the subject matter presented herein has been described in language specific to components used therein, it is to be understood that the scope of the claims is not necessarily limited to the specific components or characteristics thereof described herein; rather, the specific components and characteristics thereof are disclosed as example forms of implementing the disclosed subject matter. Accordingly, the disclosed subject matter is intended to embrace all alterations, modifications, and variations, that fall within the scope and spirit of any claims that may be written therefor. The foregoing Detailed Description is intended only to convey to a person having ordinary skill in the art the fundamental aspects of the disclosed subject matter and is not intended to limit, and should not be construed as limiting, the scope of the claims herein. Further, in the foregoing Detailed Description, various features may be grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, patentable subject matter may lie in less than all features of a single disclosed embodiment. Thus the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment. | 33,759 |
11862850 | DETAILED DESCRIPTION In a situation where a wireless communication device dissipates heat, it is common to bring a heat source into contact with a member having a large heat capacity to conduct heat. However, communication devices mounted on vehicles have been demanded to be miniaturized due to space restrictions. In general, in a device sign procedure, functional components are arranged firstly, and heat dissipation countermeasure are performed after the arrangement of functional components. Therefore, heat conductive members or heat dissipating members are added later, and it is necessary to consider enlarging the product size depending on the parts to which these members are added. A wireless communication device according to an aspect of the present disclosure includes: an antenna that is disposed on an antenna board; a communication module that executes wireless communication; and a shield case that stores the communication module inside the shield case. The antenna board is disposed to be in thermal contact with the shield case. According to such a configuration, the heat generated by the communication processing through the communication module is conducted to the antenna board through the shield case. Therefore, it is possible that the antenna board and the antenna provide contribution to heat dissipation. As the antenna board and the shield case are stacked, the wireless communication device can be miniaturized by efficiently forming a three dimensional structure. In the wireless communication device according to the above aspect of the present disclosure, the heat dissipation efficiency can be further enhanced by adopting a ceramic antenna having enhanced heat conductivity as the antenna. The following describes multiple embodiments with reference to the drawings. Hereinafter, in the respective embodiments, substantially the same configurations are denoted by identical symbols, and repetitive description will be omitted. First Embodiment As illustrated inFIG.1, a wireless communication device1according to a first embodiment of the present embodiment is mounted on, for example, a vehicle. The wireless communication device1includes a communication unit4having an NAD (Network Access Device)3corresponding to a communication module. The communication unit4is disposed on a board2. The NAD3is stored inside a shield case5made of metal. An antenna portion8including an antenna board6and a patch antenna7is disposed above the shield case5. The patch antenna7is, for example, a ceramic antenna and is used for wireless communication for GPS (Global Positioning System). As illustrated inFIG.2, on the board2, other peripheral circuits of the NAD3including DC-DC converter11, a battery backup manager12, an electrolytic capacitor13, a coaxial connector14, a telephone antenna15, a CAN (trademark) transceiver16, a BLE (Bluetooth Low Energy: trademark) unit17, a capacitor18, an antenna19for BLE and V2X as inter-vehicle communication, diplexer20, and LNA (Low Noise Amp, not shown) mounted on the board2. The shield case5is connected to a circuit ground of the NAD3. A ground at the antenna side is disposed on the antenna board6, and the antenna board6and the shield case5are electrically connected. Therefore, the ground at the antenna side and the circuit ground of the NAD3are connected. Along with this arrangement, the antenna board6and the shield case5are thermally connected, the heat generated by the communication processing through the NAD3is conducted in a path from the circuit ground, the shield case5, the antenna board6, the ground at the antenna side and the patch antenna7in order, and is then dissipated. The wireless communication device1is stored inside, for example, a shark fin (not shown) arranged on a roof of the vehicle. As illustrated inFIG.3, in a comparative configuration, a CCU (Center Console Unit)21is disposed inside an instrument panel of a vehicle, multiple wiring cables are needed for interconnecting the GPS and telephone communication antenna22disposed at the front side of the vehicle, an additional telephone communication antenna23disposed at the rear side of the vehicle, and a TCU communication unit24. On the other hand, as illustrated inFIG.4, in the wireless communication device1according to the present embodiment, since the communication unit4, which are equipped with a telephone antenna15and the antenna19for BLE and V2X, and the patch antenna7are integrally formed, the connection with the CCU21may be done by only a single wiring cable25. As described above, according to the present embodiment, the wireless communication device1includes the patch antenna7formed on the antenna board6, the NAD3connected to the patch antenna7for executing the wireless communication and the shield case5for storing the NAD3inside the shield case5. The antenna board3is arranged to be in thermal contact with the shield case5. Since the heat generated by the communication processing through the NAD3is conducted to the antenna board6through the shield case5, it is possible that the antenna board6and the patch antenna7provide contribution to heat dissipation. As the antenna board6and the shield case5are stacked, it is possible to efficiently form a three-dimensional structure and miniaturize the wireless communication device1. Since a ceramic antenna with enhanced heat conductivity is adopted as the patch antenna7, it is possible to enhance the efficiency of heat dissipation. Second Embodiment Hereinafter, the same components as those of the first embodiment are denoted by the same reference numerals, and descriptions of the same components will be omitted, and different portions will be described. As illustrated inFIGS.5and6, in a wireless communication device31according to the second embodiment, an antenna board32, which is in replacement of the antenna board6, is stored inside an antenna shield33made of metal. The antenna shield33is connected to the ground at the antenna side. The antenna shield33is electrically and thermally in contact with the shield case5. As shown inFIG.5, respective connectors34and35for cable connection and antenna connection and a Bluetooth unit36for Bluetooth (registered trademark) are mounted on the rear surface of the substrate2. A canopy roof of the vehicle is below these components, and is indicated by a dashed two-dotted line. FIG.6corresponds to a part of the A-A cross sectional view ofFIG.2, but the configuration according to the first embodiment does not include the antenna shield33. As illustrated inFIG.6, multiple LNAs37are mounted on the antenna board32at the other side of the surface of the antenna board32where the patch antenna7is disposed. According to the second embodiment as described above, since the antenna board32includes the antenna shield33disposed at the surface of the antenna board32opposing the shield case5, it is possible to dissipate heat efficiently. Third Embodiment As illustrated inFIG.7, a wireless communication device41according to a third embodiment includes a thermal and electrical conductive sheet42, which corresponds to a heat conductive member between the antenna shield33and the shield case5. As a result, the thermal conductivity from the shield case5to the antenna shield33is further enhanced. Fourth Embodiment Fourth to seventh embodiments described in the following illustrate a situation where the patch antenna7in the wireless communication device31according to the second embodiment is replaced by an antenna with different structure. In the fourth embodiment shown inFIG.8, the inverted-F antenna51is adopted. As is well known, the inverted-F antenna51has a configuration in which an “inverted-F” shaped antenna element53is connected to an antenna shield52which is a rectangular ground conductor plate. The antenna shield52is also the ground of the inverted-F antenna51. The antenna element53includes a connecting conductive plate53a, a first radiating conductor plate53b, a second radiating conductive plate53c, and a feeding pin53d. The connecting conductive plate53ahas one end connected to the antenna shield52perpendicularly. The first and second radiating conductive plates53b,53care bent and extended at the right angle from the other end of the connecting conductive plate53a, and sandwich a rectangular notch portion between the first and second radiating conductive plates53b,53c. The feeding pin53has one end connected to the feeding point at the rear surface side of the antenna shield52, and has the other end penetrating through the hole of the antenna shield52and connected to the first radiating conductive plate53b. The antenna shield52is electrically connected to the shield case5. Fifth Embodiment In the fifth embodiment shown inFIG.9, the monopole antenna54is adopted. As is well known, the monopole antenna54includes an antenna shield55as a rectangular ground conductive plate and a rod-shaped antenna element56. The antenna shield55may also be the ground of the antenna54. The antenna element56has one end connected to a feeding point at the rear surface side of the antenna shield55, and has the other end protruding to the main surface side of the antenna shield55through a hole of the antenna shield55. The antenna shield55is electrically connected to the shield case5. Sixth Embodiment In the sixth embodiment illustrated inFIG.10, a pattern antenna57is adopted. The pattern antenna57is formed by arranging patterns60,61of a metal material such as copper at one surface of the antenna board59erected on an antenna shield58as a flat ground conductor plate. The antenna board59is a glass epoxy resin such as FR4. The antenna pattern60includes a linear pattern60ahaving one end being in contact with the antenna shield58, and a fan-shaped pattern60bspreading out from the other end of the linear pattern60ain a direction to the an upper part of the drawing. Foot patterns61aand61bare disposed at a lower side of the antenna board59, and are respectively at both sides of the antenna board59with the linear pattern60ain between. The foot patterns61a,61bare also connected to the antenna shield58by, for example, soldering. A signal source62is connected between the foot pattern61aand the linear pattern60a. The antenna shield58is also the ground of the pattern antenna57, and is electrically connected to the shield case5. Seventh Embodiment In a seventh embodiment illustrated inFIG.11, a dielectric holding antenna63is adopted. The dielectric holding antenna63is formed by stacking a rectangular dielectric65and substantially rectangular antenna element66on an antenna shield64as a rectangular ground conductive plate. The dielectric65is, for example, ABS resin or polycarbonate. The antenna element66has one end that extends from one end of the dielectric65to the bottom side of the drawing, and that is connected to the antenna shield64. The antenna shield64is also the ground of the dielectric holding antenna63, and is electrically connected to the shield case5. Multiple screw holes64a, which are for connecting and fixing to the shield case5with screws (not shown), are formed at the antenna shield64. Additionally, multiple screw holes66a, which are also for connecting and fixing to the dielectric65, are formed at the antenna element66. Since the dielectric holding antenna63has the dielectric65having a relatively large heat capacity, the heat generated by the communication processing through the NAD3can be dissipated efficiently. Other Embodiments The patch antenna7is not limited to the ceramic antenna. The communication module is not limited to NAD3. Further, the peripheral circuit of NAD3may be appropriately modified according to the individual design. In the second embodiment, the LNA34may be mounted on the same surface as the patch antenna7. A fan35may be provided if necessary. The wireless communication device is not limited to be equipped into a vehicle. The configuration of the first and third embodiments may be applied to the fourth to seventh embodiments. Although the present disclosure has been described in accordance with the examples, it is understood that the present disclosure is not limited to such examples or structures. The present disclosure encompasses various modifications and variations within the scope of equivalents. In addition, various combinations and forms, and further, other combinations and forms including only one element, or more or less than these elements are also within the scope and the scope of the present disclosure. | 12,538 |
11862851 | DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS FIG.1is a perspective view of an antenna device according to an embodiment of the disclosure,FIG.2Ais a cross-sectional view along a line segment A-A ofFIG.1, andFIG.2Bis a cross-sectional view along a line segment B-B ofFIG.1. It should be noted that some components ofFIG.1are drawn in a perspective manner for the purposes of clear representation and convenient description. Please refer toFIG.1toFIG.2B. An antenna device100of this embodiment includes a case assembly110, a first waveguide assembly120, and a second waveguide assembly130. A cavity C (FIG.2AandFIG.2B) is defined by an interior of the case assembly110, and a first side111of the case assembly110has a slot116penetrating the case assembly110. In this embodiment, the case assembly110of the antenna device100has an opening113on a second side112, and the case assembly110includes a first conductor layer114located on the first side111and a first cavity wall structure115located between the first conductor layer114and the opening113. The first cavity wall structure115is connected to a periphery of the opening113and the first conductor layer114, and the cavity C is located between the first cavity wall structure115, the first conductor layer114, and the opening113. In other words, the first cavity wall structure115, the first conductor layer114, and the opening113jointly form the range of the cavity C. Further, the first cavity wall structure115of this embodiment includes multiple first conductor pillars1151and a third conductor layer1152. The third conductor layer1152defines the opening113. The first conductor pillars1151are connected to the third conductor layer1152and the first conductor layer114at equal spacings, and the heights of the first conductor pillars1151are equal. The arrangement manner of the first conductor pillars1151is suitable for defining the range of the cavity C. In this embodiment, the antenna device100is suitable for being operated in a radiation frequency band, an opening width W1(FIG.2AandFIG.2B) of the opening113is substantially equal to ½ times a wavelength belonging to the radiation frequency band, a height H1(FIG.2AandFIG.2B) of the first cavity wall structure115is substantially equal to ¼ times the wavelength belonging to the radiation frequency band, and a height H2(FIG.2AandFIG.2B) of the first waveguide assembly120is substantially equal to ¼ times the wavelength belonging to the radiation frequency band. In this embodiment, the opening width W1is ½ times the wavelength, the height H1is ¼ times the wavelength, and the height H2is also ¼ times the wavelength, which is not limited by the disclosure. In each embodiment of the disclosure, being substantially equal refers to being within an error of ±5% (inclusive of two ends). FIG.3is a schematic top view of a slot of the antenna device ofFIG.1. Please refer toFIG.1andFIG.3. The slot116of this embodiment extends along a direction Y, the slot116includes two end parts117in opposite and a middle segment118located between the two end parts117, and the width of each end part117is greater than the width of the middle segment118. Specifically, a length L3(FIG.3) of the slot116is substantially equal to ½ times the wavelength belonging to the radiation frequency band, and a maximum width W2(FIG.3) of the slot116is less than ¼ times the wavelength belonging to the radiation frequency band. It is worth mentioning that the appearance of the slot116of this embodiment is symmetrical along both a direction X and the direction Y, and this design enables the antenna device100to have a symmetrical field distribution. In addition, if the length L3of the slot116is longer or the maximum width W2is narrower, the antenna device100can thus have a greater equivalent capacitance. The length L3and the maximum width W2of the slot116of the antenna device100may be adjusted during manufacturing according to the user requirements for impedance to change the capacitance of the antenna device100, so as to achieve a customized design. In addition, please refer toFIG.1toFIG.2B. At least part of the first waveguide assembly120of this embodiment is located within the cavity C and is connected to the first side111of the case assembly110. As shown inFIG.2A, a projection of the first waveguide assembly120to the first side111of the case assembly110is symmetrically located on two sides of the slot116. The first waveguide assembly120is disposed on the two sides of the slot116of the case assembly110as shown inFIG.1. In this embodiment, the first waveguide assembly120includes two conductor components121, which are respectively a conductor component121A and a conductor component121B. As shown inFIG.2A, the conductor component121A and the conductor component121B are respectively symmetrically connected to a first side edge1161of the slot116and a second side edge1162of the slot116opposite to the first side edge1161, and the conductor component121A and the conductor component121B are parallel to each other and are perpendicular to a plane where the opening113(FIG.1andFIG.2A) is located. Specifically, each of the conductor component121A and the conductor component121B includes multiple second conductor pillars122and a conductor plate123. A first end1221of each second conductor pillar122is connected to the first side edge1161or the second side edge1162of the slot116. The conductor plate123is connected to a second end1222of each second conductor pillar122, and the position of the second end1222is located opposite to the first end1221. Thereby, each of the conductor component121A and the conductor component121B of this embodiment may be equivalent to a whole metal wall due to the arrangement manner of the second conductor pillar122and the conductor plate123. The conductor component121A and the conductor component121B, which are equivalent to two metal walls, are respectively symmetrically disposed on the first side edge1161and the second side edge1162of the slot116. An antenna signal may be transmitted and reflected between the conductor components121respectively located on the first side edge1161and the second side edge1162, and then transmitted to the cavity C. Since the conductor component121A and the conductor component121B are symmetrically disposed on the two sides of the slot116, the antenna signal can have a more stable and symmetrical field distribution. It is worth mentioning that if a spacing L1(FIG.2A) between the two conductor components121of this embodiment is narrower or a length L2(FIG.2B) jointly formed by the second conductor pillar122and the conductor plate123is longer, the first waveguide assembly120can have a greater capacitance. If the thickness or the number of the second conductor pillar122is increased, the first waveguide assembly120can have a smaller inductance. The antenna device100may adjust the capacitance and the inductance of the first waveguide assembly120during manufacturing according to the user requirements for impedance, so as to achieve a customized design. The height H2of the first waveguide assembly120of this embodiment is equal to the height H1of the first cavity wall structure115as shown inFIG.2A, and the first waveguide assembly120is connected to the first side edge1161of the slot116and the second side edge1162opposite to the first side edge1161. However, in other embodiments of the disclosure, the height H2of the first waveguide assembly120may be higher or lower than the height H1of the first cavity wall structure115, and the position of the first end1221(FIG.2AandFIG.2B) of the first waveguide assembly120may exceed the first conductor layer114and extend toward the direction of a second conductor layer131, which is not limited by the disclosure. In addition, the second waveguide assembly130of this embodiment is located outside the case assembly110, and the second waveguide assembly130is close to the first side111and is connected to the slot116. The second waveguide assembly130is suitable for transmitting an antenna signal (not shown) to the cavity C through the slot116and the first waveguide assembly120. The antenna signal then resonates in the cavity C and radiates outward from the second side112of the cavity C opposite to the first side111. The second waveguide assembly130of this embodiment includes the second conductor layer131and a second cavity wall structure132. The second conductor layer131is located outside the case assembly110and is located next to the first side111. The second conductor layer131has a fixed voltage. For example, the second conductor layer131is a ground layer with a fixed voltage of zero. The second cavity wall structure132is located between the second conductor layer131and the first side111of the case assembly110, and connects the second conductor layer131and the first side111of the case assembly110. The second cavity wall structure132includes multiple third conductor pillars133separated from each other. It should be noted that in addition to the function of defining the range of the second waveguide assembly130, the third conductor pillars133of this embodiment also have the effect of electrically connecting the first conductor layer114to the second conductor layer131, so that the first conductor layer114and the second conductor layer131both have a fixed voltage. In addition, since the first conductor pillar1151is electrically connected to the first conductor layer114, the first conductor pillar1151and the third conductor layer1152also have the same fixed voltage as the first conductor layer114and the second conductor layer131. In this embodiment, the positions of the first conductor pillars1151and the positions of the third conductor pillars133correspond to each other as shown inFIG.1. However, in other embodiments of the disclosure, the positions of the first conductor pillars1151and the positions of the third conductor pillars133may also be staggered, which is not limited by the disclosure. FIG.4is a top view of the antenna device ofFIG.1. It should be noted that some components ofFIG.4are drawn in a perspective manner for the purposes of clear representation and convenient description. Please refer toFIG.1andFIG.4. The antenna device100of this embodiment further includes a feeding portion140, which is isolated from the second conductor layer131and is at least partially located within the second cavity wall structure132as shown inFIG.1. Further, the feeding portion140is located outside the case assembly110and is close to the first side111, and a projection of the feeding portion140to the first side111is staggered from the slot116as shown inFIG.4. The slot116extends along the direction Y, and a line connecting the projection of the feeding portion140on the first side111and the center of the slot116is perpendicular to the direction Y. In other words, the line connecting the projection of the feeding portion140on the first side111and the center of the slot116is parallel to the direction X. One end of the feeding portion140of this embodiment close to the second conductor layer131is flush with the second conductor layer131as shown inFIG.2. However, in other embodiments of the disclosure, one end of the feeding portion140close to the second conductor layer131may extend beyond the range of the second waveguide assembly130toward a direction away from the first conductor layer114, which is not limited by the disclosure. In the antenna device100of this embodiment under the abovementioned configuration manner, the antenna signal has good signal transmission during the process of being sequentially transmitted in the second waveguide assembly130, the slot116, the first waveguide assembly120, and the cavity C. In addition, since the first waveguide assembly120is symmetrically disposed on the two sides of the slot116, the antenna signal can have a more stable and symmetrical field distribution. The antenna device100can have good signal transmission and a stable and symmetrical field distribution. It should be noted that the form of the case assembly of the antenna device is not limited toFIG.1, and other forms of the case assembly are introduced below.FIG.5is a perspective view of a case assembly of an antenna device according to another embodiment of the disclosure. Please refer toFIG.1andFIG.5. Compared with the first cavity wall structure115shown inFIG.1, a first cavity wall structure115A shown inFIG.5replaces the third conductor layer1152(FIG.1) of the first cavity wall structure115(FIG.1) with a conductor ring1153. The first cavity wall structure115A includes multiple first conductor pillars1151and the conductor ring1153. The conductor ring1153defines an opening113of a case assembly110A, and the conductor ring1153and the opening113are circular in shape. The first conductor pillars1151are connected to the conductor ring1153and the first conductor layer114at equal spacings, and the heights of the first conductor pillars1151are equal. FIG.6Ais a perspective view of a case assembly of an antenna device according to another embodiment of the disclosure, andFIG.6Bis a top view of the case assembly ofFIG.6A. Please refer toFIG.5toFIG.6B. Compared with the case assembly110A shown inFIG.5, the shapes of a conductor ring1153A and an opening113A of a case assembly110B shown inFIG.6AandFIG.6Bare symmetrical polygons, and the number of sides of the symmetrical polygon must be an even number. The disclosure does not limit the number of even-numbered sides. It is worth noting that an extending direction of a long side of a slot116(FIG.6B) needs to be parallel to the direction of a line segment S1. The line segment S1may cut the shape of the opening113A into two symmetrical halves as shown inFIG.6B. The extending direction of the long side of the slot116(FIG.6B) is designed to be parallel to the direction of the line segment S1, which enables the antenna device to have a symmetrical field pattern. FIG.7Ais a perspective view of a case assembly of an antenna device according to another embodiment of the disclosure, andFIG.7Bis a top view of the case assembly ofFIG.7A. Please refer toFIG.6AtoFIG.7B. A case assembly110C shown inFIG.7AandFIG.7Bis compared with the case assembly110B shown inFIG.6A, and the difference between the two is that an extending direction of a long side of a slot116(FIG.7B) is parallel to the direction of a line segment S2. The line segment S2may also cut the shape of an opening113A into two symmetrical halves as shown inFIG.7B. It is worth mentioning that since the shape of the opening113A is a symmetrical polygon with an even number of sides, the opening113A has a line segment S1formed by connecting midpoints of two corresponding sides and the line segment S2formed by connecting junctions of corresponding sides. The extending direction of the long side of the slot116(FIG.6BandFIG.7B) may be parallel to the direction of the line segment S1or the direction of the line segment S2, which both enable the antenna device to have a symmetrical field pattern. FIG.8is a perspective view of a case assembly of an antenna device according to another embodiment of the disclosure, andFIG.9AandFIG.9Bare perspective views of a case assembly of an antenna device according to another embodiment of the disclosure. Please refer toFIG.8. A first cavity wall structure115C shown inFIG.8includes at least one annular conductor wall1154, and the at least one annular conductor wall1154has a single height. Further, since the shape of the annular conductor wall1154of the first cavity wall structure115C is circular, the number of the conductor wall1154is one. Please refer toFIG.8andFIG.9A. A case assembly110E shown inFIG.9Ais compared with a case assembly110D shown inFIG.8, and the difference between the two is that a first cavity wall structure115D (FIG.9A) includes at least one conductor wall1154A in a symmetrical polygonal shape. The number of the conductor wall1154A is plural, and the number of sides of the symmetrical polygon must be an even number. The disclosure does not limit the number of even-numbered sides. It is worth noting that an extending direction of a long side of a slot116(FIG.9A) needs to be parallel to a line segment S1(FIG.9A). The line segment S1may cut the shape of an opening113A into two symmetrical halves. The extending direction of the long side of the slot116(FIG.9A) is designed to be parallel to the direction of the line segment S1, which enables the antenna device to have a symmetrical field pattern. Please refer toFIG.9AandFIG.9B. A case assembly110F shown inFIG.9Bis compared with a case assembly110E shown inFIG.9A, and the difference between the two is that an extending direction of a long side of a slot116(FIG.9B) is parallel to a line segment S2(FIG.9B). A line segment S1and the line segment S2may both cut an opening113A into two symmetrical halves. The extending direction of the long side of the slot116(FIG.9AandFIG.9B) may be parallel to the direction of the line segment S1(FIG.9A) or the direction of the line segment S2(FIG.9B), which enables the antenna device to have a symmetrical field pattern. Furthermore, the slot may also have different forms.FIG.10AtoFIG.10Care schematic top views of slots according to another embodiment of the disclosure, andFIG.11AtoFIG.11Bare schematic top views of slots according to another embodiment of the disclosure. Please refer toFIG.3andFIG.10A. A slot116A shown inFIG.10Ais compared with the slot116shown inFIG.3, and the difference between the two is that the slot116A extends along a direction Y as shown inFIG.10A, and the slot has equal width along the direction Y. Please refer toFIG.10AandFIG.10B. A slot116B shown inFIG.10Bis compared with the slot116A shown inFIG.10A, and the difference between the two is that the shape of an end part117A of the slot116B is stepped as shown inFIG.10B. In addition, please refer toFIG.10BandFIG.10C. A slot116C shown inFIG.10Cis compared with the slot116B shown inFIG.10B, and the difference between the two is that the shape of an end part117B of the slot116C is circular as shown inFIG.10C. It is worth mentioning that the shape of the slot may also be a trapezoid (not shown) tapered with an inclined line segment from the end part toward a middle segment direction, which is not limited by the disclosure. Please refer toFIG.10AandFIG.11A. A slot116D shown inFIG.11Ais compared with the slot116A shown inFIG.10A, and the difference between the two is that the width of each end part117C of the slot116D is less than the width of a middle segment118C as shown inFIG.11A. Please refer toFIG.11AandFIG.11B. A slot116E shown inFIG.11Bis compared with the slot116D shown inFIG.11A, and the difference between the two is that the shape of an end part117D of the slot116E may be stepped as shown inFIG.11B. In addition, the shape of the slot may also be a trapezoid (not shown) that gradually expands with an inclined line segment from the end part toward a middle segment direction, which is not limited by the disclosure. It is worth mentioning that the shapes of the slots shown inFIG.10AtoFIG.11Bare symmetrical whether along the long side direction or the width direction of the slots, which enables the antenna device to have a stable and symmetrical field pattern. FIG.12is a relationship graph of gain against angle of the antenna device ofFIG.1. Please refer toFIG.1andFIG.12. The antenna device100(FIG.1) of this embodiment is rotated by specific angles with axes of a section line AA and a section line BB respectively projected on the first conductor layer114as rotation axes, so as to obtain the gain effects shown by a curve A (FIG.12) and a curve B (FIG.12), which show good performance in both gain effect and symmetry. FIG.13is a relationship graph of gain against frequency of the antenna device ofFIG.1, andFIG.14is a relationship graph of return loss (S11) against frequency of the antenna device ofFIG.1. A curve D inFIG.14shows the return loss (S11) of the antenna device100at each frequency when the length L3(FIG.3) of the slot116of this embodiment is substantially equal to 0.5 times the wavelength belonging to the radiation frequency band. A curve E shows the return loss (S11) of the antenna device100at each frequency when the length L3(FIG.3) of the slot116is substantially equal to 0.52 times the wavelength belonging to the radiation frequency band, that is, the length L3is substantially equal to an error of 5%. A curve F shows the return loss (S11) of the antenna device100at each frequency when the length L3(FIG.3) of the slot116is substantially equal to 0.48 times the wavelength belonging to the radiation frequency band, that is, when the length L3is substantially equal to an error of −5%. Please refer toFIG.13andFIG.14. The gain effects of the antenna device100of this embodiment at each frequency band are all greater than 5, and the return losses (S11) of the antenna device100at frequencies respectively corresponding to a first resonant mode M1, a second resonant mode M2, and a third resonant mode M3are all less than −10 dB, which show good performance. In detail, the cavity C, the slot116, and the first waveguide assembly120of the antenna device100respectively contribute to the performances of the first resonant mode M1, the second resonant mode M2, and the third resonant mode M3in terms of the return losses. In summary, in the antenna device of the disclosure, the antenna signal has good signal transmission during the process of being sequentially transmitted in the second waveguide assembly, the slot, the first waveguide assembly, and the cavity. In addition, since the first waveguide assembly is symmetrically disposed on the two sides of the slot, the antenna signal can have a more stable and symmetrical field distribution. Furthermore, the antenna device of an embodiment may adjust the capacitance and the inductance of the first waveguide assembly during manufacturing or change the length and the maximum width of the slot to adjust the capacitance of the antenna device according to the user requirements for impedance, so as to achieve a customized design. In addition, the first cavity wall structure and the slot of an embodiment are both symmetrically designed, which enables the antenna device to have a stable and symmetrical field pattern. | 22,365 |
11862852 | DETAILED DESCRIPTION In general, according to one embodiment, a cable antenna according to the present embodiment is a cable antenna an end part of which is connected to an oscillator that supplies a high-frequency current, including: an inner conductor extending in a cable-like configuration; an insulating layer covering the inner conductor; and an outer conductor covering the insulating layer, and an exposed part is formed in a middle part of the cable antenna in a longitudinal direction, the exposed part being formed by removing at least the outer conductor. A distance L between a tip end of the cable antenna and an end of the exposed part on a side closer to the tip end may be an odd multiple of a quarter of a wavelength2, of the high-frequency current. A length G of the exposed part in the longitudinal direction may satisfy the following formula (1). λ/20≤G<L(1)where λ denotes the wavelength (mm) of the high-frequency current, L denotes the distance (mm) between the tip end of the cable antenna and the end of the exposed part on the side closer to the tip end. The cable antenna may be bent at a plurality of bends in such a manner that sections on both sides of a bend are not parallel to each other. The cable antenna may form one or more openings having the shape of a rectangle all of four sides of which have a length equal to a half of the wavelength λ. The rectangle may be a square. The cable antenna may form two or more of the openings, and one of diagonals of each of the rectangles and a corresponding one of diagonals of an adjacent rectangle may be aligned with each other in plan view. A gate antenna according to the present embodiment includes: a conductive reflector plate; a non-conductive first spacer member stacked on the reflector plate on one side in a perpendicular direction, the perpendicular direction being perpendicular to front and back surfaces of the reflector plate; the cable antenna according to any one of claims4to6, the cable antenna being stacked on the first spacer member on one side in the perpendicular direction; a second spacer member that is not conductive and is stacked on the cable antenna on one side in the perpendicular direction; and a parasitic element that is conductive and is stacked on the second spacer member on one side in the perpendicular direction. The reflector plate may have a rectangular shape extending in a lateral direction and a longitudinal direction, and the parasitic element may include: a plurality of first members that extends in the lateral direction and spaced apart from each other in the longitudinal direction; and a plurality of second members that extends in the longitudinal direction and connects end parts of the plurality of first members to each other alternately on either side along the longitudinal direction. The cable antenna may form three or more of the openings, and the gate antenna may be bent at parts where connections between outermost rectangles in the longitudinal direction of the cable antenna and adjacent rectangles in the longitudinal direction are located so that opposite end parts of the gate antenna in the longitudinal direction stand. An antenna unit according to the present embodiment includes a plurality of the gate antennas described above, and the plurality of gate antennas may be arranged in different postures. A gate antenna according to the present embodiment includes the cable antenna described above. An automatic conveyor shelf according to the present embodiment includes: the gate antenna described above; and an automatic guided robot. An unmanned cash register according to the present embodiment includes the gate antenna described above. The cable antenna according to the present embodiment has the exposed part formed by removing the outer conductor in the middle thereof in the longitudinal direction. Since there is no electromagnetic wave produced by the outer conductor in the exposed part, the electromagnetic wave produced by the inner conductor is not canceled but is radiated from the exposed part to the outside. This allows the cable antenna to communicate with radio communication tags arranged around the cable antenna. In this way, electromagnetic waves can be radiated in all directions around the cable antenna with a simple arrangement. A cable antenna1according to an embodiment of the present invention will be described with reference to the drawings. As shown inFIG.1, the cable antenna1according to this embodiment and a radio IC chip3mounted on a radio communication tag2form a part of a communication reader that performs radio communication through transmission and reception of an electromagnetic wave.FIG.1is a diagram showing an appearance of the cable antenna1according to this embodiment. As an example of such radio communication, in this embodiment, an RFID system that uses an electromagnetic wave having a frequency in the UHF band ranging from 300 MHz to 3 GHz will be described. As the radio IC chip3, any chip commonly used in the RFID system can be used. An oscillator4that supplies a high-frequency current is connected to one end of the cable antenna1. The cable antenna1is bent at a plurality of bends1A in such a manner that the parts on both sides of each bend are not parallel to each other. In the example shown, the cable antenna1has a so-called serpentine shape. InFIG.1, a plurality of radio communication tags2is arranged in random orientations around the cable antenna1. As shown inFIG.2, the cable antenna1has an inner conductor11, an insulating layer12, and an outer conductor13.FIG.2is a diagram for illustrating a cross-sectional structure of the cable antenna1. As shown by straight arrows inFIG.2, currents flow in the inner conductor11and the outer conductor13in the opposite directions. The oscillator4is connected to the inner conductor11and the outer conductor13, and the inner conductor11and the outer conductor13each form one continuous current path. The inner conductor11is a conductor wire extending like a cable, and an annealed copper wire can be used as the material of the inner conductor11, for example. However, the material of the inner conductor11can be any other material that can be used as a conductor wire. The insulating layer12is an insulating member that covers the inner conductor11from radially outside thereof, and foamed polyurethane can be used as the material of the insulating layer12, for example. However, the material of the insulating layer12can be any other material that can be used as an insulating member. The outer conductor13is a conductive body that covers the insulating layer12from radially outside thereof, and an aluminum foil or an aluminum braid can be used as the material of the outer conductor13, for example. However, the material of the outer conductor13can be any other material that can be used as a conductive body. The outer conductor13is covered with an insulating outer jacket14. As shown inFIG.3, the cable antenna1has an exposed part15in the middle in the longitudinal direction, the exposed part15being formed by removing at least the outer conductor13.FIG.3is a diagram showing a part of the cable antenna1at a tip end thereof. In the example shown, in the exposed part15, the insulating layer12as well as the outer conductor13is removed, and the inner conductor11is exposed. That is, the exposed part15means a part in which a component located on the radially inner side of the outer conductor13is exposed. In the exposed part15, the outer conductor13and the insulating layer12are removed along the entire circumference of the cable antenna1in the circumferential direction about the central axis of the cable antenna1. As shown inFIG.3, the part of the cable antenna1closer to the tip end than the exposed part15extends straight from the exposed part15. The cable antenna1has only one exposed part15. As such a cable antenna1, the so-called coaxial cable, which is a shielded cable used for telecommunication, can be additionally worked and used. The coaxial cable has the internal structure shown inFIG.2, and the cable antenna1according to the present embodiment can be provided simply by removing a predetermined length G of the outer conductor of the coaxial cable. For example, a predetermined length of the outer jacket14is removed from the coaxial cable, and then the same length of the outer conductor13is removed. The length is a dimension in the longitudinal direction. In general, in the coaxial cable, a magnetic field produced by the current flowing in the inner conductor11and a magnetic field produced by the current flowing in the outer conductor13, whose direction is opposite to that of the magnetic field produced by the current in the inner conductor11, cancel each other. Therefore, no electromagnetic energy is radiated to the outside, and the coaxial cable can efficiently transmit signals. As shown inFIG.4, when a part of the outer conductor13of the coaxial cable is removed, the balance between the circumferential magnetic field around the outer conductor13and the circumferential magnetic field around the inner conductor11, which would otherwise cancel each other, is lost.FIG.4is an enlarged view of a tip end part of the cable antenna1. As a result, the circumferential magnetic field around the inner conductor11is not canceled in the exposed part15, and this state can be regarded as a state where an annular magnetic field is occurring only in the exposed part15of the cable antenna1. This state is equivalent in functionality to a state where the exposed part15is connected to a power supply, and a voltage is applied between the front and the end of exposed part15, regardless of the actual positional relationship between the cable antenna1and the oscillator4. Therefore, as shown inFIG.3, the current is distributed in the entire cable antenna1to be smaller in the tip end part and larger in the exposed part15. The current flows in the longitudinal direction through the outer jacket14of the cable antenna1. As shown inFIG.4, a distance L (mm) between the tip end of the cable antenna1and the end of the exposed part15on the side closer to the tip end is preferably an odd multiple of a quarter of a wavelength λ of the high-frequency current. This can increase the amplitude of the current. By adjusting the length G of the exposed part15according to the overall diameter of the cable antenna1used, the radiated electric field strength can be adjusted. Here, the length G of the exposed part15in the longitudinal direction satisfies the following formula (1). λ/20≤G<L(1) In this formula, λ denotes the wavelength (mm) of the high-frequency current, and L denotes the distance (mm) between the tip end of the cable antenna and the end of the exposed part15on the side close to the tip end as described above. When the length G of the exposed part15in the longitudinal direction is too small, the effect of the exposed part15may be insufficient. This is because when the length G of the exposed part15is small, the outer conductors13on the opposite sides of the exposed part15in the longitudinal direction are electrically conducting even though the outer conductor13is physically removed in the exposed part15. Therefore, the condition that λ/20≤G in the formula (1) is required. When the length G of the exposed part15in the longitudinal direction is too large, the electromagnetic wave radiated to the outside may be weak. This is because when the dimension of the exposed part15is large, the annular magnetic field produced in the exposed part15is dispersed and has reduced effect. Therefore, the condition that G<L in the formula (1) is required. (Verification Tests) Next, evaluation results of antenna input characteristics of the cable antenna1according to this embodiment will be described. In these tests, variations of antenna characteristics with the distance L between the tip end of the cable antenna1and the exposed part15were evaluated. First, in a first verification test, the transition of the reflection loss S11was evaluated for four samples whose distance L from the exposed part15to the tip end was 10 mm, 80 mm, 160 mm, and 240 mm. Here, the reflection loss S11is a value indicating the ratio of the reflected power from the cable to the power supply to the input power to the cable in units of decibels, and calculated according to the following formula (2). The smaller the value of the reflection loss, the higher the efficiency of the cable antenna1is. S11=10×reflectedpowerinputpowertocable[db](2) In this verification test, an electromagnetic wave having a frequency of 850 MHz to 1000 MHz was input. As the results of this test, transitions of the reflection loss S11are shown inFIG.5. As shown inFIG.5, S11assumes a large value when L=10 mm and L=160 mm. This means that when a power is fed from the power supply to the cable, the reflected power is extremely high. In these cases, the power is not efficiently injected into the cable, so that the electromagnetic wave radiation from the cable antenna1decreases as can be seen. On the other hand, S11assumes a small value when L=80 mm and L=240 mm. In these cases, the input power is efficiently injected into the cable antenna1, and the electromagnetic wave radiation from the cable antenna1increases as can be seen. Here, when L=80 mm, the distance L is approximately equal to a quarter of the wavelength λ of the electromagnetic wave at a frequency at which S11significantly decreases. Therefore, it can be confirmed that matching between the cable antenna1and the oscillator4is good when L is an odd multiple of a quarter of the wavelength of the electromagnetic wave. Here, that matching is good means that impedance matching is achieved. Next, in a second verification test, distributions of the current induced on the cable antenna1for different distances L from the exposed part15to the tip end were evaluated. As in the first verification test, four evaluation samples whose L was 10 mm, 80 mm, 160 mm, and 240 mm were used. As the results of this test, distributions of the current induced on the cable are shown inFIG.6. Provided that the maximum amplitude of the induced current that varies with the magnitude of L is 1,FIG.6shows relative current distributions at a distance D from the tip end of the cable antenna1. As confirmed inFIG.6, when L is an odd multiple of λ/4, matching between the cable antenna1and the oscillator4is improved, and the induced current, which is a source of the electromagnetic wave radiation, increases as can be seen. From this fact, it can be considered that it is desirable that the distance L between the tip end of the cable antenna1and the end of the exposed part15on the side closer to the tip end be set to be an odd multiple of a quarter of the wavelength of the electromagnetic wave used. As described above, the cable antenna1according to this embodiment has the exposed part15formed by removing the outer conductor13in the middle thereof in the longitudinal direction. Since there is no electromagnetic wave produced by the outer conductor13in the exposed part15, the electromagnetic wave produced by the inner conductor11is not canceled but is radiated from the exposed part15to the outside. This allows the cable antenna1to communicate with the radio communication tags2arranged around the cable antenna1. In this way, electromagnetic waves can be radiated in all directions around the cable antenna1with a simple arrangement. When the cable antenna1according to the present embodiment is arranged in the configuration shown inFIG.1, the cable antenna1can communicate along the total length thereof, such as several to a dozen meters. Thus, if the cable antenna1is used for identification or management of the radio communication tags2, an RFID tag system can probably be constructed with extremely low cost. In addition, since the distance L between the tip end of the cable antenna1and the end of the exposed part15on the side closer to the tip end is an odd multiple of a quarter of the wavelength λ of the high-frequency current, the amplitude of the current induced at the exposed part15can be increased. In addition, since the length G in the longitudinal direction of the exposed part15satisfies the formula (1), electromagnetic waves can be effectively emitted from the exposed part15. In addition, the cable antenna1is arranged in a serpentine configuration and bent at a plurality of bends1A in such a manner that the parts on both sides of each bend1A are not parallel to each other. Therefore, an electromagnetic wave caused by a current excited by an annular magnetic field produced in the exposed part15is radiated to the periphery of the cable antenna1. Although the electromagnetic wave radiated in this way reaches a sufficient level in the vicinity of the cable antenna1, the electromagnetic wave is weak at a position distant from the cable antenna1unlike a case of a handheld reader in which signals are injected into an antenna that efficiently radiates an electromagnetic wave in a particular direction. However, the magnetic field (electric field) produced by the cable antenna1is not uniform. Therefore, even though the directions of electromagnetic waves produced by each of the radio communication tags2arranged in random orientations in the vicinity of the cable antenna1differ, the cable antenna1is expected to be able to accommodate the difference and identify all information from the large number of radio communication tags2arranged in the vicinity of the cable antenna1. Thus, when the cable antenna1having such characteristics is disposed on a shelf, for example, and radio communication tags2are attached to commodities displayed on the shelf, the cable antenna1is expected to make a contribution to efficient merchandise management. FIG.7is a diagram showing the current on the cable antenna1shown inFIG.6in different colors for different sections (#1, #2, and so on) of the cable antenna1, for the sake of convenience. As shown inFIG.7, the distribution of effective current flowing in the cable antenna1is sinusoidal and periodically varies along the cable. Although the direction of the effective current varies with time, the directions of the effective current in odd-numbered or even-numbered sections coincide with each other at a certain instant. Next, a gate antenna50(seeFIG.10) formed by the cable antenna1will be described. First, the shape of the cable antenna1used for the gate antenna50will be described with reference toFIG.8.FIG.8is a plan view of the cable antenna1arranged to form a plurality of openings30. As shown inFIG.8, the gate antenna50according to the present embodiment is formed by the cable antenna1arranged and bent so as to form a plurality of rectangular openings30. More specifically, the cable antenna1is configured so that one of the diagonals of each rectangle is aligned with the corresponding one of the diagonals of the adjacent rectangles in plan view. In the example shown, the rectangular openings30formed by the cable antenna1have a square shape all of the four sides of which have the same length. The length (a dimension S shown inFIG.7) of the sides of the rectangle is a half of the wavelength λ. That is, the amplitude of the current is the minimum at the ends of each side of the rectangle. Although the opening30has a square shape in the example shown, the opening30may have a rhombus shape all of the four sides of which have the same length. Alternatively, the rectangle may be an oblong rectangle or a parallelogram the four sides of which do not all have the same length. Furthermore, the shape of the opening30is not limited to the rectangle and may be a triangle, a circle or the like as far as all the openings30have the same current distribution. When the cable antenna1is arranged as described above, parts of the cable forming adjacent sides of the square openings30are not parallel to each other, and therefore, the electromagnetic interference therebetween is controlled to be small. Therefore, the direction of the current in each side of the opening30is the same as that of the cable antenna1arranged on a straight line. On the other hand, any combination of sides that are parallel to each other is a combination of odd-numbered sections or a combination of even-numbered sections inFIG.7(a combination of white sinusoidal waves or a combination of hatched sinusoidal waves inFIG.7), and therefore is complementary to each other, so that a strong electromagnetic wave radiation can be stably produced along the array of square openings30. Furthermore, the electromagnetic waves radiated from the sides of the openings30are generally perpendicular to each other, so that stable communication can be provided regardless of the orientations of the small antenna and the radio tags placed in parallel with the sheet ofFIG.8. AlthoughFIG.8shows an example where there are four square openings30, the number of square openings30can be arbitrarily chosen as far as the number is equal to or greater than one. Furthermore, the electromagnetic wave radiation caused by the current flowing in the square openings30formed by the cable antenna1according to the present embodiment will be described in detail. Currents flowing in two opposed sides A and A′ of the square opening30and electromagnetic wave radiations caused by the currents are as shown in the cross-sectional views shown in the box inFIG.9. In these cross-sectional views, the solid lines indicate an electromagnetic wave radiation caused by the left current, and the dashed lines indicate an electromagnetic wave radiation caused by the right current. As shown in the cross-sectional view (a) inFIG.9, in the upward direction (the direction perpendicular to the sheet of the drawing from above to below or from below to above the plane of the square opening30), the electromagnetic waves are radiated from the sides A and A′ in a complementary relationship. On the other hand, as shown in the cross-sectional view (b) in the box, in the direction from the side A to the side A′ or the opposite direction (the direction parallel to the plane of the square opening30in any case), the length of the side, that is, the distance between the sides A and A′ is about λ/2. Therefore, the phase of the sinusoidal electromagnetic wave radiated from the side A′ is shifted by 180° at the position of the side A and is 180° out of phase with the sinusoidal electromagnetic wave radiated from the side A, and thus the sinusoidal electromagnetic waves radiated from the sides A and A′ cancel each other. When the cable antenna1forms the array of square openings30shown inFIGS.8and9, the radiations are satisfactorily provided in the direction perpendicular to the sheet of the drawing, although the radiations in the direction parallel to the sheet of the drawing are suppressed. For example, when the array of square openings30formed by the cable antenna1is placed on a shelf or the like, a radio tag placed in any orientation in parallel to the plane of the array of square openings30can be well identified. On the other hand, a radio tag placed outside the array of square openings30is difficult to be identified even if the radio tag is placed on the same shelf, and therefore, the cable antenna1can be advantageously used for determination of the position of a commodity with a radio tag on the shelf. Next, a configuration of the gate antenna50including the cable antenna1having such openings30will be described. The electromagnetic wave radiations from the array of openings30formed by the cable antenna1are basically radiations in the opposite directions perpendicular to the plane of the openings. When the cable antenna1is used on a shelf or the like, the cable antenna1desirably radiates electromagnetic waves only in one direction in which commodities are located, in order to identify only commodities with a radio tag on the shelf. Therefore, as shown inFIGS.10, a reflector plate51is advantageously arranged immediately below the array of openings30formed by the cable antenna1. Specifically, as shown inFIGS.10, with the gate antenna50according to the present embodiment, the reflector plate51that is conductive, the cable antenna1, and a conductive parasitic element52are stacked in a perpendicular direction, which is perpendicular to the front and back surfaces of the reflector plate51. As shown inFIG.10(b), a first non-conductive spacer member53is sandwiched and stacked between the reflector plate51and the cable antenna1in the perpendicular direction. In addition, a second non-conductive spacer member54is sandwiched and stacked between the cable antenna1and the parasitic element52in the perpendicular direction. InFIGS.10(a)and11, illustration of the first spacer member53and the second spacer member54is omitted. The reflector plate51has a rectangular shape extending in the lateral direction and the longitudinal direction. The first spacer member53is a non-conductive plate-like member stacked on the reflector plate51on one side thereof in the perpendicular direction. The cable antenna1is stacked on the first spacer member53on one side thereof in the perpendicular direction. Since the first spacer member53is provided, the cable antenna1is spaced apart from the reflector plate51in the perpendicular direction and is not in direct contact with the reflector plate51. The second spacer member54is a non-conductive plate-like member stacked on the cable antenna1on one side thereof in the perpendicular direction. Since the second spacer member54is provided, the cable antenna is spaced apart from the parasitic element52in the perpendicular direction and is not in direct contact with the parasitic element52. The parasitic element52is stacked on the second spacer member54on one side thereof in the perpendicular direction. The parasitic element52is formed by a first member52A and a second member52B. A plurality of first members52A extends in the lateral direction and is spaced apart from each other in the longitudinal direction. A plurality of second members52B extends in the longitudinal direction and connects the lateral ends of the plurality of first members52A to each other. The second members52B connect the plurality of first members52A alternately on either side along the longitudinal direction. Next, a function of the parasitic element52will be described. When the array of openings30formed by the cable antenna1and the reflector plate51are incorporated, a linear cable part that is not involved in the formation of the array of openings30and the reflector plate51may interact with each other to compromise the uniformity of the strength of the radiated electric field. This may cause deflection of the radiation in the longitudinal direction or the lateral direction of the reflector plate51. To avoid this, as shown inFIGS.10(a) and10(b), the parasitic element52that is made of conductor and is not in electrical contact with the cable antenna1is brought closer to the cable antenna1. In this way, the uniformity of the strength of the radiated electric field can be improved, and the one-side radiation can be enhanced. The radiated electric field, or specifically, whether to enhance the radiated electric field in the longitudinal direction of the reflector plate51or enhance the radiated electric field in the lateral direction of the reflector plate51, can be adjusted by adjusting the dimension ratio (M1:M2) between the second members52B shown inFIG.10(a). The gate antenna50formed by the array of openings formed by the stack of the cable antenna1, the reflector plate51, the parasitic element52and the like can generally identify a radio tag placed in parallel to the reflector plate51, even if the radio tag is oriented in any direction. However, a radio tag placed perpendicularly to the reflector plate51may be difficult to identify. To cope with this, as shown inFIG.11, by taking advantage of the intrinsic flexibility of the cable antenna1, the end part of the gate antenna50can be bent upward. This allows the cable antenna1to stably identify a radio tag three-dimensionally oriented in any direction. InFIG.11, illustration of the parasitic element52, the first spacer member53and the second spacer member54is omitted. Specifically, a gate antenna50B according to a variation is bent at parts where connections between the outermost rectangles in the longitudinal direction of the cable antenna1and the adjacent rectangles in the longitudinal direction are located so that opposite end parts of the gate antenna50B in the longitudinal direction stand. Therefore, the gate antenna50B has a U-shape in front view. If a shopping basket or container containing a commodity with a radio tag is placed in the bottom part of the U-shape of the gate antenna50B formed by bending the end parts of the plate-like electromagnetic wave radiating element as shown inFIG.12(a), the radio tag can be identified and managed regardless of the orientation of the tag attached to the commodity. That is, at an unmanned cash register provided with the gate antenna50B, commodities in the shopping basket100can be detected with high precision. The gate antenna used for the unmanned cash register may be the gate antenna50having a planar shape, rather than the U-shape described above. In that case, again, similar effects can be attained. A plurality of such gate antennas50B may be used to form an antenna unit. As shown inFIG.12(b), an antenna unit according to the present embodiment has a plurality of gate antennas50B, and the plurality of gate antennas50B is arranged in different postures. That is, the gate antennas50B may be used in such orientations that the bottom parts of the U-shaped gate antennas50B form a U-shape in plan view as shown inFIG.12(b). As shown inFIG.12(b), two U-shaped gate antennas are arranged in opposite orientations with the bottom parts of the U-shaped gate antennas opposed to each other. The shopping basket100or container is put in the cavity inside the gate antennas50B and irradiated with electromagnetic waves from four directions. Therefore, the reliability of the identification of commodities with a radio tag in the shopping basket100or container can be improved. Alternatively, as shown inFIG.12(c), three or more U-shaped gate antennas50B may be used, and the shopping basket100or container put inside the cavity inside the gate antennas may be irradiated with electromagnetic waves from five directions, that is, below, front, back, left and right, thereby improving the reliability of the identification of commodities with a radio tag contained in the shopping basket100or container. The gate antennas50and50B according to the present embodiment has simpler configurations than conventional antennas and therefore can be manufactured at a significantly reduced cost. When the cable antenna1is bent to form the array of square openings30as described above, the radiated electric field formed by a combination of white sinusoidal currents (indicated by white arrows inFIG.8) and the radiated electric field formed by a combination of hatched sinusoidal currents (indicated by black arrows inFIG.8) are perpendicular to each other. If the sections between the bends of the cable antenna1have a length of approximately λ/2, the radiated electric fields substantially synchronously vary in an oscillating manner. On the other hand, as shown inFIG.13, if the bending period of the cable antenna1is increased by about 0.1, that is, if the length of the side of the square is increased to 0.6, the oscillation of the electric field indicated by the black arrow lags behind the oscillation of the electric field indicated by the white arrow by about 0.2 periods. This lag is equivalent to a difference in phase angle close to 90°, so that a composite electric field formed by the electric field indicated by the white arrow and the electric field indicated by the black arrow is an electric field temporally and spatially rotating. Therefore, an antenna can be formed which is capable of radiating a circularly polarized wave similar to that of an identification antenna commonly used in the RFID system which is advantageous for identifying a radio tag oriented in an arbitrary direction. Although the array of openings30formed by the cable antenna1is desirably rotationally symmetrical in order to form a circularly polarized wave, the opening30may have a polygonal or circular shape, other than a square shape. The embodiment described above is just an example of representative embodiments of the present invention. Therefore, various modifications can be made to the embodiment described above without departing from the spirit of the present invention. For example, although the cable antenna1has a serpentine configuration as shown inFIG.1in the embodiment described above, the present invention is not limited to the configuration. The cable antenna1may be arranged in a loop configuration, that is, a circular configuration, in plan view, for example. Alternatively, the cable antenna1may be arranged in a rectangular configuration in plan view with two parallel sides being at a particular distance. If the cable antenna1is arranged in a spiral configuration, the cable antenna1can perform efficient radio communication with radio communication tags2three-dimensionally arranged. Although in the embodiment described above, the cable antenna1has been described by taking as an example an RFID system using an electromagnetic wave in the UHF band, the present invention is not limited to such a configuration. The electromagnetic wave used for radio communication can have any other frequency. Although in the embodiment described above, an arrangement has been described in which the insulating layer12as well as the outer conductor13is removed in the exposed part15, the present invention is not limited to such an arrangement. In the exposed part15, the insulating layer12may be left intact, and only the outer conductor13may be removed. The exposed part15may be provided at a bend1A. Although in the embodiment described above, an arrangement has been described in which the gate antenna includes the reflector plate51, the first spacer member53, the cable antenna1, the second spacer member54and the parasitic element52, the present invention is not limited to such an arrangement. That is, the gate antenna need not include the reflector plate51, the first spacer member53, the second spacer member54and the parasitic element52. Specifically, as an inexpensive gate antenna, the cable antenna1according to the present invention may be configured in such a manner that one of the diagonals of each rectangle is aligned with the corresponding one of the diagonals of the adjacent rectangles in plan view, and the cable antenna may be covered with a protective material. The cable antenna having such a configuration can also sufficiently serve as a gate antenna. If such an inexpensive gate antenna is used in an unmanned cash register, the manufacturing cost of the unmanned cash register can be reduced. Next, an example application of the cable antenna1will be described with reference toFIG.14.FIG.14is a perspective view of an automatic conveyor shelf60according to the present embodiment. The automatic conveyor shelf60is a shelf that automatically moves in a warehouse. As shown inFIG.14, the automatic conveyor shelf60includes a shelf main unit61, an automatic guided robot62(automatic guided vehicle: AGV) and the cable antenna1. In the shelf main unit61, a plurality of shelf compartments63is arranged in the vertical direction and the horizontal direction. Various commodities or supplies are housed in the compartments63. The automatic guided robot62has an internal power supply and an artificial intelligence (AI) installed therein, and is automatically controlled to travel in a warehouse in which the shelf main unit61is placed. In the example shown, the automatic guided robot62is disposed below the shelf. A movement of the automatic guided robot62will be described with reference toFIGS.15and16. FIG.15is a first diagram for illustrating a movement of the automatic conveyor shelf60in use.FIG.16is a second diagram for illustrating the movement of the automatic conveyor shelf60in use. As shown inFIG.15, the automatic guided robot62travels to below the shelf in which a commodity wanted by a user is stored. The automatic guided robot62then projects an upper part thereof upward to push the shelf main unit61upward from below. As a result, the legs of the shelf main unit61are slightly lifted off the floor of the warehouse. In this state, as shown inFIG.16, the automatic guided robot62moves with the shelf main unit61to a pick-up space where the user is located. The user then takes the commodity wanted by the user from the compartment63of the shelf main unit61. The automatic guided robot62then guides the shelf main unit61to a prescribed storage location and ceases pushing the shelf main unit61upward. In this way, the shelf main unit61is placed at the prescribed storage location. The automatic guided robot62then returns to a prescribed charging station and is charged. As shown inFIG.14, the cable antenna1is provided on the bottom of each of the plurality of compartments63provided in the automatic conveyor shelf60. The cable antenna1is arranged on the bottom of each of the plurality of compartments63, and an RFID tag is attached to the commodities stored in the compartments63. Therefore, whether a commodity is stored in each compartment63can be automatically instantly grasped. The cable antenna1may have the structure of the inexpensive gate antenna described above. End parts of the plurality of cable antennas1provided on the bottoms of the plurality of compartments63are arranged on the bottom of the shelf main unit61. When the automatic guided robot62pushes the shelf main unit61from below, a connector provided on an upper surface of the automatic guided robot62and a connector connected to the end parts of the plurality of cable antennas1are coupled to each other, and the internal power supply incorporated in the automatic guided robot62supplies a current to the cable antennas. The automatic guided robot62has an RFID reader. Therefore, the RFID reader can read information from the RFID tags detected by the antennas supplied with the current, and transmit the information to the outside through radio communication. The RFID reader may be incorporated in or externally added to the automatic guided robot62. In this way, the automatic conveyor shelf60provided with the cable antennas1can automatically detect what kinds of commodities are stored in the compartments63, and therefore automatic stocktaking or automatic receipt/shipment management can be performed. The present invention is not limited to the variations described above, and some of these variations may be selected and appropriately combined or may be further modified. APPENDIX An automatic conveyor shelf system, comprising:an automatic conveyor shelf;an automatic guided robot; andthe cable antenna according to claim3or the gate antenna according to claim7or11,wherein a reader/writer provided in the unmanned automatic guided robot is connected by wire to any of the antennas described above and automatically reads RFID commodity information from a commodity or article placed on the shelf, and the read commodity/article information is transferred to an upper system by a radio system to perform automatic management of information about receipt/shipment or inventory. | 39,742 |
11862853 | DESCRIPTION OF A PREFERRED EMBODIMENT OF THE INVENTION An example embodiment of a broad band directional antenna is generally designated by the reference numeral10inFIGS.1,6,7and8. Referring toFIG.1, the antenna comprises a conductive ground plane12having a main axis14extending perpendicularly to the conductive ground plane12. At least one active radiator13is axially spaced from the conductive ground plane in one direction A. A metamaterial ground plane assembly16has a surface area. The metamaterial ground plane assembly comprises a metamaterial ground plane17having a periphery18. A first conductive wall20is located immediately adjacent the periphery18, such that the first conductive wall20abuts the periphery of the metamaterial ground plane17. The first conductive wall has a bottom22and a top24. A second wall26comprising at least two mutually electrically insulated conductive wall parts26.1and26.2is located spaced from and outside of the first conductive wall20relative to the metamaterial ground plane17. The metamaterial ground plane assembly16is arranged such that the bottom22of the first conductive wall20is located between the conductive ground plane12and the metamaterial ground plane17and the top24of the conductive first wall20is located beyond the at least one active radiator13in the one direction A. There is provided at least one conductive pillar28.1(seeFIGS.2and3) between the bottom22of the first conductive wall20and the conductive ground plane12. In the example embodiment, the metamaterial ground plane17comprises an electrically insulating substrate31and a plurality of mutually spaced rectangular or square conductive pads33printed on the substrate in a matrix pattern. Each pad defines a matrix of four holes exposing the underlying substrate. It has been found that a thickness t of the substrate should preferably be as small as possible, without compromising a mechanical strength of the substrate that may be required. A conventional printed circuit board with copper pads may be used. As will become clearer below, the conductive ground plane12and the metamaterial ground plane assembly16may have any suitable shape and/or dimensions. However, shape, dimensions and relative spacing of the conductive ground plane12, the at least one active radiator13and the metamaterial ground plane assembly16and its constituent parts are selected to improve antenna bandwidth, pattern consistency or stability and gain. In the example embodiment shown, the conductive ground plane12is square having four equi-dimensioned sides12.1,12.2,12.3and12.4. As best shown inFIGS.2and3, the first conductive wall20is a continuous wall having four first wall parts20.1,20.2,20.3and20.4circumscribing the metamaterial ground plane17. Also as shown in these figures, there is provided a conductive pillar28.1between first wall part20.1of wall20and the middle of corresponding side12.1of the conductive ground plane12. Similarly, there are provided conductive pillars28.2to28.4between first wall parts20.2to20.4of wall20and the middle of corresponding sides12.2to12.4of the conductive ground plane12. As best shown inFIGS.1to3, the second wall comprises mutually insulated wall parts26.1to26.4. In the example embodiment shown, wall part26.1extends parallel to first wall part20.1of first wall20. Similarly, parts26.2to26.4extend parallel to first wall parts20.2to20.4respectively. Each of the wall parts26.1to26.4are secured to the metamaterial ground plane17by insulating arms30. Referring toFIGS.1,4and5, the at least one active radiator13comprises first and second cross polarized dipole radiators13.1and13.2which are driven at respective centre points32.1and32.2. One conductive element of each of the dipoles is provided on a top surface of substrate34, whereas the other element is provided on a bottom surface of the substrate. Referring toFIGS.1and6, the example embodiment of the antenna10comprises at least one passive radiator36which is spaced from the at least one active radiator30in the one direction A. In a preferred embodiment, the at least one passive radiator is of the same shape and configuration as the at least one active radiator, but smaller in size. Referring toFIGS.1,6,7and8, the example embodiment of antenna10comprises an active low frequency patch type radiator38having a surface area and which patch type radiator38is axially spaced from the conductive ground plane12in a direction B opposite the one direction A. The surface area of the patch type radiator38is preferably larger than the surface area of the metamaterial ground plane assembly16. Known feeds for the patch type radiator are shown at40. Still referring toFIGS.1,6,7and8, the example embodiment of the antenna10may comprise an optional passive patch type radiator42which may be provided between the active patch type radiator38and the conductive ground plane12. The example embodiment of the antenna10further comprises a known support structure44with diplexer46, which structure is spaced from the patch type radiator38in the other or opposite direction B. The example embodiment of the antenna10is designed to operate in the frequency band 1.7 GHz to 3.7 GHz. InFIG.9, there is shown a plot of antenna gain against frequency (shown by the solid line) for the example embodiment of the antenna10with the conductive pillars28.1to28.4in position as shown inFIGS.2and3compared to that (shown in broken lines) of an adapted antenna without such pillars, but with bottom22of the first wall20in conductive contact with conductive ground plane12, thereby effectively cavity backing the metamaterial ground plane. The graph clearly indicates a large increase in gain of about 5 dB for frequencies below 3.2 GHz for the example embodiment of the antenna. The polar diagrams inFIGS.10(a),10(b),11(a) and11(b)also clearly illustrate far more stable radiation patterns for the case inFIG.10(a)andFIG.11(a)with the conductive pillars, as opposed to the case inFIGS.10(b) and11(b)with the bottom22of wall20in direct contact with the conductive ground plane12. It is believed that the pillars28.1to28.4serve to suppress pseudo surface waves that propagate on the conductive ground plane12and which cause unwanted radiation and thereby negatively affects the radiation pattern. InFIG.12, there is shown a plot of antenna gain against frequency (shown by the solid line inFIG.12for the example embodiment of the antenna10compared to that (shown in broken lines) of a similar antenna, but adapted to lack the passive radiator36. The plot clearly indicates an increase in bandwidth for the antenna with the passive radiator36. The polar diagrams inFIG.13(a)(for the example embodiment of the antenna) andFIG.13(b)(for the adapted antenna) also illustrate more stable radiation patterns for the case inFIG.13(a)with the radiator36, as opposed to the case without the radiator inFIG.13(b). It has also been found that the parasitic dipole36increases the gain by 4-5 dB in the frequency band 3.4 GHz-3.8 GHz. | 7,016 |
11862854 | DETAILED DESCRIPTION Embodiments of the subject invention provide novel and advantageous antenna arrays, antenna elements for said arrays, and methods of fabricating and using the same. Antenna arrays can be operated at multiple frequencies, such as at two different frequencies for Radio Detection And Ranging (RADAR) communication and for imaging applications. Each antenna element (e.g., each unit cell having a single antenna element) can include a driven patch that is excited directly and a parasitic patch that is excited by the driven patch. Slots (e.g., gaps between conducive material) can be included to reduce the higher-order current in the parasitic patch. FIGS.1,2A,3,4A, and4Bshow top views of an antenna element, according to embodiments of the subject invention; andFIG.2Bshows an enlarged view of the feeding source. ThoughFIGS.2A,2B, and3list values for certain dimensions, these are for exemplary purposes only and should not be construed as limiting. Also, though the outer cutout portions135are depicted inFIG.3as white boxes, this is for emphasis only; the outer cutout portions135show where material of the driven patch130is absent, and the substrate110would be seen here (as depicted inFIGS.1,2A,2B,4A, and4B). Referring toFIGS.1-4B, an antenna element100(e.g., a unit cell having a single antenna or antenna element) can include a feeding source120, a driven patch130, and a parasitic patch140disposed on a substrate110. The substrate110can be disposed on a bottom layer conductor. The bottom layer conductor can be, for example, a ground plane. The substrate110can be sandwiched between the bottom layer conductor and the top layer conductor (which includes the feeding source120, the driven patch130, and the parasitic patch140). The feeding source can be, for example, a coplanar waveguide (CPW)-based feeding source and can include a grounded CPW (GCPW). The GCPW can include two coplanar source patches121(i.e., the upper surface of each source patch121is in the same plane as the other source patch121) and a source microstrip feedline122. Each source patch121can include a grounded via123, which can be formed in a through hole125through the respective source patch121. The grounded via123can comprise a conductive material (for example, a metal (e.g., silver (Ag), aluminum (Al), copper (Cu), or similar), such as a metal paste). The grounded vias123can be electrically connected to the bottom layer conductor. Gaps (or slots) can be formed between the source microstrip feedline122and each source patch121(the gap between the microstrip feedline122and the leftmost source patch121is labeled inFIG.2Bas “25”, showing that a possible width of the gap is 25 μm). The source microstrip feedline122and the source patches121can comprise a conductive material (for example, a metal (e.g., gold (Au), platinum (Pt), Ag, Al, Cu, or similar). The driven patch130can include a main patch131and an inset feedline133(e.g., an inset microstrip feedline) connected directly to the main patch131and extending towards the feeding source120(e.g., in the y-direction as depicted in the figures). The main patch131can have, for example, a polygonal shape, such as a rectangular shape (in a cross-section taken parallel to the upper surface of the substrate110(i.e., in the x-y plane as depicted in the figures)). The driven patch130can be electrically connected to the feeding source120, such as by direct physical connection between the inset feedline133and the source microstrip feedline122. In some embodiments, the driven patch130can have two inner cutout portions134where material of the driven patch130is absent, thereby forming two extension portions132extending towards the feeding source120(e.g., in the y-direction as depicted in the figures) but physically separated from the feeding source120. The driven patch130can further include two outer cutout portions135where material of the driven patch130is absent, thereby resulting in the extension portions132being thinner and conserving material of the driven patch130. Though the outer cutout portions135are depicted inFIG.3as white boxes, this is for emphasis only; the outer cutout portions135show where material of the driven patch130is absent, and the substrate110would be seen here (as depicted inFIGS.1,2A,2B,4A, and4B). The inset feedline133and the extension portions132can each have, for example, a polygonal shape, such as a rectangular shape (in the x-y plane as depicted in the figures). The main patch131, the inset feedline133, and the extension portions132can comprise a conductive material (for example, a metal (e.g., Au, Pt, Ag, Al, Cu, or similar). The inner cutout portion(s)134is/are included for inset feed and to reduce the coupling on both sides of inset feedline133. The parasitic patch140can be disposed on an opposite side of the driven patch130as the feeding source120is. That is, the parasitic patch140can be disposed on a side of the driven patch130having the radiating edge (of the driven patch130). The parasitic patch140can be physically separated from the driven patch130by a gap (labeled “gp” inFIG.2A). The gap gp can be much smaller than a smallest width of the parasitic patch140in the x-y plane (e.g., the gap gp can be less than 10% as large as the width of the parasitic patch140in the y-direction as depicted in the figures). The parasitic patch140can have a smaller length (in the y-direction as depicted in the figures) than the driven patch130does. At least two of the respective upper surfaces of the driven patch130, the parasitic patch140, the source microstrip feedline122, and the source patches121can be disposed in the same plane as each other. In some embodiments, all of the respective upper surfaces of the driven patch130, the parasitic patch140, the source microstrip feedline122, and the source patches121can be disposed in the same plane as each other. In an embodiment, any antenna element (e.g., unit cell having a single antenna element) (e.g., a unit cell comprising a single antenna element) or an entire antenna array can be fabricated using a proto laser (e.g., a U4 proto laser machine). Compared to related art techniques (e.g., photolithography and nanofabrication), which require a lot of wait time to fabricate a small volume, a proto laser is much faster. An extrusion plating method (e.g., a low-cost extrusion plating method) can be used to plate the via123. The dual-band tuning can be implemented using a parasitic patch excitation technique. The driven patch can be excited directly (by the feeding source), and the parasitic patch140can be excited by driven patch130. Gaps can be included to reduce the higher-order current in the parasitic patch140. The gaps can include, for example, a first gap between the parasitic patch140and the driven patch130(labeled “gp” inFIG.2A), a second gap between the source microstrip feedline122and one of the source patches121(see also the “25” label inFIG.2B), and a third gap between the source microstrip feedline122and the other source patch121). The antenna array can be used at two different frequencies at the W band. An antenna array can comprise an array of antenna elements, where each antenna element is as described herein (see alsoFIGS.1-4B). The antenna array can include a corporate feed network to excite multiple dual-band antenna elements of the antenna array (e.g., all antenna elements of the antenna array). A corporate feeding network equally splits the power at each junction of the antenna array for uniform distribution. The array feeding network can all be disposed on the same plane, making the overall structure more compact (particularly in the thickness direction (perpendicular to the x-y plane depicted in the figures). In some embodiments, the antenna array may have a single substrate that is shared by all antenna elements. The antenna array may also have a single bottom conductor that is shared by all antenna elements. The respective feeding sources120of the antenna elements100can all be electrically connected to each other (e.g., the respective the source microstrip feedlines122of the antenna elements100can all be electrically connected to each other). For example, the source microstrip feedline122of each antenna element100can be physically connected to the source microstrip feedline122of at least one other antenna element100of the antenna array. When ranges are used herein, such as for dose ranges, combinations and subcombinations of ranges (e.g., subranges within the disclosed range), specific embodiments therein are intended to be explicitly included. When the term “about” is used herein, in conjunction with a numerical value, it is understood that the value can be in a range of 95% of the value to 105% of the value, i.e. the value can be +/−5% of the stated value. For example, “about 1 kg” means from 0.95 kg to 1.05 kg. A greater understanding of the embodiments of the subject invention and of their many advantages may be had from the following examples, given by way of illustration. The following examples are illustrative of some of the methods, applications, embodiments, and variants of the present invention. They are, of course, not to be considered as limiting the invention. Numerous changes and modifications can be made with respect to embodiments of the invention. Example 1 A single antenna element as depicted inFIGS.2A-4Bwas fabricated. A single substrate (material=Rogers 3003) having a thickness of 0.25 millimeters (mm) was used, and the substrate was sandwiched between the top layer conductor (including the feed source, the driven patch, and the parasitic patch) and the bottom layer conductor. The substrate had a length SubW (in the y-direction) and width SubL (in the x-direction) of 3.05 mm and 4.29 mm, respectively. The top layer conductor was a single dual-band antenna with a GCPW based feeding source. The dual-band antenna operated at 78 GHz and 94 GHz. The corporate feed network was optimized for 78 GHz and 94 GHz. The GCPW configuration was used, where a width of the source microstrip feedline was 80 micrometers (μm), and the gap between the source microstrip feedline and each source patch was 25 μm (see alsoFIG.2B). The diameter of each ground via in the GCPW was 0.2 mm. In order to simulate the design, AnSys high-frequency structure simulator (HFSS) was used. Referring toFIG.2A, the length pl1(in the y-direction as depicted in the figures) and width pw1(in the x-direction) of the driven patch were 0.91 mm and 1.02 mm, respectively. The length ifl1(in the y-direction) of the inset feedline was 0.34 mm, and the width ifw1(in the x-direction) between the extension portions was 0.22 mm. The length cpw_fl (in the y-direction) of the source microstrip feedline was 0.69 mm. The length rcl (in the y-direction) and width rcw (in the x-direction) of the parasitic patch were 0.56 mm and 1.12 mm, respectively. The gap gp (in the y-direction) between the parasitic patch and the driven patch was 34 Referring toFIG.3, the length psl12(in the y-direction) of each outer cutout portion was 0.364 mm. The GCPW was aligned to a ground-signal-ground (GSG) probe of an anechoic chamber to measure the radiation pattern of the antenna. The size of the GCPW was chosen due to the fixed GSG probe dimension so that it could measure the antenna pattern properly. The input impedance at the driven patch was calculated as 73 Ohms (Ω). The planar dual-band antenna was implemented at the frequencies of 78 GHz and 94 GHz in order to be useful for RADAR communication and imaging applications. At 78 GHz, the driven patch radiates but, due to its smaller length (compared to the driven patch), the parasitic patch does not contribute to the radiation. At 94 GHz, the radiation pattern is directional. The driven patch contributes to generating the higher order mode. The corners of the driven patch are cut out close to the inset feedline (to give the outer cutout portions) in order to reduce the higher order mode. The minimum trace size in the antenna element was 25 so it is very difficult to find processes in the art capable of such a small trace. The antenna element was fabricated using a U4 proto laser machine at Florida International University (FIU) in Miami, FL. A template for thick Rogers 3003 substrate was optimized. In order to do this, the laser power, frequency, overlay speed, and cut repetition is optimized. After fabricating the antenna element including the through holes in the source patches, the vias were formed. Via plating methods (e.g., using a plating machine such as a Leiterplatten-Kopierfrasen (LPKF) machine) can be expensive, and with the through hole diameter being 0.2 mm, they were difficult to see with the naked eye. The via filling process was done under a microscope machine using Ag paste by an extrusion method (see alsoFIGS.4A and4B). The via filling process was performed in the mechanical department at FIU. A simulation was run on the antenna element to simulate its reflection coefficient (S11) across different frequencies and to determine its realized gain at different zenith angles (θ). The realized gain was determined at azimuthal angles (φ) of 0 degrees and 90 degrees for frequencies of 78 GHz and 94 GHz. Referring toFIGS.5-7, the antenna element showed good performance in reflection coefficient and radiation gain at 78 GHz and 94 GHz. The bandwidths achieved around 78 GHz and 94 GHz were about 5.0 GHz and 9 GHz, respectively. The return loss had minimum values of −41 dB and −11 dB at 78 GHz and 94 GHz, respectively (FIG.5). The maximum gain was 7.3 decibels relative to isotropic (dBi) and 7.3 dBi at 78 GHz and 94 GHz, respectively (FIGS.6and7). It should be understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application. All patents, patent applications, provisional applications, and publications referred to or cited herein are incorporated by reference in their entirety, including all figures and tables, to the extent they are not inconsistent with the explicit teachings of this specification. | 14,287 |
11862855 | DETAILED DESCRIPTION The following disclosure provides for many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,” “down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,” “lower,” “upper,” “over,” “under,” and so forth, are indicated with respect to the orientation shown in the figures unless otherwise specified. It should be understood that the spatial descriptions used herein are for purposes of illustration only, and that practical implementations of the structures described herein can be spatially arranged in any orientation or manner, provided that the merits of embodiments of this disclosure are not deviated from by such arrangement. The following description involves an antenna module and a semiconductor device package having the antenna module. FIG.1Aillustrates a cross-sectional view of an antenna module1in accordance with some embodiments of the present disclosure. The antenna module1may include a substrate10, antennas11,12, and dielectric layers13,14. The substrate10has a surface101and a surface102opposite the surface101. In some embodiments, the substrate10may be, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. In some embodiments, the substrate10may include an interconnection structure, such as a redistribution layer (RDL), a grounding layer, and a feeding line. In some embodiments, the substrate10may include one or more conductive pads (not illustrated in the figures) in proximity to, adjacent to, or embedded in and exposed at the surface102of the substrate10. The substrate10may include solder resists (or solder mask) (not illustrated in the figures) on the surface102of the substrate10to fully expose or to expose at least a portion of the conductive pads for electrical connections. One or more electrical contacts (e.g., solder balls) may be disposed on the surface102of the substrate10and electrically connected to the conductive pads of the substrate10. The antennas11and12may be disposed on the surface101of the substrate10. In some embodiments, each of the antennas11and12may include a patch antenna, such as a planar inverted-F antenna (PIFA) or other feasible kinds of antennas. In some embodiments, each of the antennas11and12may include a conductive material such as a metal or metal alloy. Examples of the conductive material include gold (Au), silver (Ag), aluminum (Al), copper (Cu), platinum (Pt), Palladium (Pd), other metal(s) or alloy(s), or a combination of two or more thereof. In some embodiments, the antenna11and the antenna12may have different frequencies (or operating frequencies) or bandwidths (or operating bandwidths). For example, the antenna12(which can be referred to as a high-band antenna) may have a frequency higher than a frequency of the antenna11(which can be referred to as a low-band antenna). For example, the antenna12may be operated in a frequency of about 39 GHz. For example, the antenna12may be configured to transmit or receive electromagnetic waves with a frequency of about 39 GHz. For example, the antenna11may be operated in a frequency of about 28 GHz. For example, the antenna11may be configured to transmit or receive electromagnetic waves with a frequency of about 28 GHz. By incorporating the antennas having different operating frequencies, the antenna module1may achieve a multi-bandwidth (or multi-frequency) radiation. In some embodiments, the antenna11and the antenna12may have different dimensions. For example, the antenna11has a surface111(or a top surface) facing away from the substrate10, a surface112(or a bottom surface) opposite the surface111, and a surface113(or lateral surface) extending between the surface111and the surface112. In some embodiments, the surface113may be perpendicular to the surface111and/or the surface112. In some embodiments, the surface113may angled at an acute or an obtuse angle to the surface111. In some embodiments, the surface113may angled at an acute or an obtuse angle to the surface112. The antenna11may have a thickness11tmeasured between the surface111and the surface112and a width11wmeasured between two surfaces113from a side view as shown inFIG.1A. Similarly, the antenna12may have a thickness12tmeasured between the top surface121and the bottom surface122of the antenna12. The antenna12may have a width12wmeasured between two lateral surfaces123from a side view as shown inFIG.1A. In some embodiments, the thickness11tmay be greater than the thickness12t. In some embodiments, the thickness12tmay be smaller than the thickness12t. In some embodiments, the width11wmay be greater than the width12w. In some embodiments, the width12wmay be smaller than the width11w. In some embodiments, the antennas11and12may define an antenna array. For example, the antennas11and12may be arranged in an array. For example, they may be arranged alternately or staggered with each other. For example, a high-band antenna and a low-band antenna may be arranged alternately or staggered with each other. For example, the antenna11may be disposed in intervals between two of the antennas12. For example, the antenna12may be disposed in intervals between two of the antennas11. For example, the antenna11and the antenna12may be spaced apart. For example, the antenna11and the antenna12may be physically disconnected with each other. In some embodiments, a part of the surface101of the substrate10may be exposed from a recess10rbetween the antenna11and the antenna12. In some embodiments, the antennas11and12may be arranged randomly or irregularly. The patterns or sequences of the antennas may be different from the above descriptions, and the illustrations and the patterns or sequences of the antennas may be not limited thereto. In some embodiments, antennas of more than two different frequencies or bandwidths may be incorporated in the antenna module1. The dielectric layer13and the dielectric layer14may be element configured to focus an electromagnetic wave transmitted or received by the antenna11and the antenna12. The dielectric layer13may be disposed on the surface101of the substrate10and cover the antenna11. For example, the dielectric layer13may be in contact with (such as in direct contact with) the surface111of the antenna11. For example, the dielectric layer13may be in contact with (such as in direct contact with) the surface113of the antenna11. For example, the dielectric layer13may be in contact with (such as in direct contact with) the surface101of the substrate10. In some embodiments, the antenna11may be surrounded by the dielectric layer13. The dielectric layer14may be disposed on the surface101of the substrate10and cover the antenna12. For example, the dielectric layer14may be in contact with (such as in direct contact with) the surface121of the antenna12. For example, the dielectric layer14may be in contact with (such as in direct contact with) the surface123of the antenna12. For example, the dielectric layer14may be in contact with (such as in direct contact with) the surface101of the substrate10. In some embodiments, the antenna12may be surrounded by the dielectric layer14. In some embodiments, the dielectric layer13and the dielectric layer14may be arranged alternately or staggered with each other. In some embodiments, the dielectric layer13and the dielectric layer14may be spaced apart by the recess10r. In some embodiments, each of the dielectric layers13and14may include pre-impregnated composite fibers (e.g., pre-preg), Borophosphosilicate Glass (BPSG), silicon oxide, silicon nitride, silicon oxynitride, Undoped Silicate Glass (USG), any combination of two or more thereof, or the like. In some embodiments, each of the dielectric layers13and14may include a dielectric ceramic such as Al2O3, Mg2SiO4, MgAl2O4, CoAl2O4, or other feasible dielectric ceramics that have a standard Q-value. In some embodiments, the dielectric layer13and the dielectric layer14may have the same material. In some embodiments, the dielectric layer13and the dielectric layer14may have different materials. In some embodiments, the dielectric layer13and the dielectric layer14may have different dielectric constants (Dk). For example, the dielectric layer13(which can be referred to as a low-Dk dielectric layer) may include a material having a Dk between about 17 and about 19. For example, the dielectric layer14(which can be referred to as a high-Dk dielectric layer) may include a material having a Dk between about 37 and about 40. In some embodiments, the dielectric layer13and the dielectric layer14may have different dimensions. For example, the portion of the dielectric layer13that is over the surface111of the antenna11may have a thickness13t, which is measured between the topmost point (such as a surface131thereof) of the dielectric layer13and the surface111of the antenna11. The dielectric layer13may have a width13wmeasured between two lateral surfaces of the dielectric layer13from a side view as shown inFIG.1A. Similarly, the portion of the dielectric layer14that is over the surface121of the antenna12may have a thickness14t, which is measured between the topmost point (such as a surface141thereof) of the dielectric layer14and the surface121of the antenna12. The dielectric layer14may have a width14wmeasured between two lateral surfaces of the dielectric layer14from a side view as shown inFIG.1A. In some embodiments, the thickness13tmay be greater than the thickness14t. In some embodiments, the thickness14tmay be smaller than the thickness13t. In some embodiments, the width13wmay be greater than the width14w. In some embodiments, the width14wmay be smaller than the width13w. In some embodiments, since the thickness11tof the antenna11is different from the thickness12tof the antenna12, the dielectric layer13and the dielectric layer14are at different elevations with respect to the substrate10. In some embodiments, the dielectric layer13may have the surface131facing away from the substrate10and the dielectric layer14may have the surface141facing away from the substrate10. The surface131and the surface141may be at different elevations with respect to the substrate10. For example, the surface131may be higher or farther than the surface141with respect to the substrate10. For example, the total amount of the thickness11tand the thickness13tmay be different from the total amount of the thickness12tand the thickness14t. In some embodiment, antennas of different frequencies or bandwidths may be covered by the same dielectric layer (e.g., same material and/or dimension). Since the electrical characteristics (i.e., permittivity (ε) and permeability (μ)) of the electromagnetic waves transmitted or received by the antennas are different, the transmission losses of the electromagnetic waves propagating through the dielectric layer are different (i.e., according to the Friis transmission equation), and the same dielectric layer may not be able to meet the performance requirements of the antennas. In some embodiments as shown inFIG.1A, dielectric layers13and14(which may have different dimensions and/or different materials) are disposed on the antennas11and12(which may have different frequencies) separately. Thus, it is possible to optimize or improve the performance of both of the antennas11and12by proper adjustment of the electrical characteristics of the electromagnetic waves transmitted or received. For example, the electrical characteristics of the electromagnetic waves may be adjusted by separately altering the dimensions, the compositions, the particle sizes, and/or the sintering temperatures of the dielectric layers13and14. In some embodiments, the electromagnetic wave transmitted or received by the antenna11and the antenna12may separately propagate and resonate in the dielectric layer13and the dielectric layer14. In some embodiments, the dielectric layer13and the dielectric layer14may help to separately focus the electromagnetic waves transmitted or received by the antenna11and the antenna12. In some embodiments, the dielectric layer13and the dielectric layer14may help to separately compensate for phase shifts of the electromagnetic waves transmitted or received by the antenna11and the antenna12. In some embodiments, the dielectric layer13and the dielectric layer14may help to separately increase the gain of the antenna11and the antenna12. In some embodiments as shown in the top view ofFIG.1B, the antenna11may be covered by the dielectric layer13and the antenna12may be covered by the dielectric layer14. For example, a vertical projection of the antenna11on the substrate10may be overlapped with a vertical projection of the dielectric layer13on the substrate10. For example, a vertical projection of the antenna12on the substrate10may be overlapped with a vertical projection of the dielectric layer14on the substrate10. For example, a vertical projection of the antenna11on the substrate10may be within a vertical projection of the dielectric layer13on the substrate10. For example, a vertical projection of the antenna12on the substrate10may be within a vertical projection of the dielectric layer14on the substrate10. For example, a vertical projection of the antenna11on the substrate10may be greater than a vertical projection of the dielectric layer13on the substrate10. For example, a vertical projection of the antenna12on the substrate10may be greater than a vertical projection of the dielectric layer14on the substrate10. In some embodiments, a vertical projection of the antenna11on the substrate10and a vertical projection of the dielectric layer13on the substrate10may be substantially the same. A vertical projection of the antenna12on the substrate10and a vertical projection of the dielectric layer14on the substrate10may be substantially the same. FIG.1Cillustrates a cross-sectional view of an antenna module1′ in accordance with some embodiments of the present disclosure. The antenna module1′ is similar to the antenna module1inFIG.1Aexcept that the dielectric layer13and the dielectric layer14are in contact with each other. For example, the surface101of the substrate10is not exposed between the antenna11and the antenna12. For example, the surface101of the substrate10is not exposed between the dielectric layer13and the dielectric layer14. In some embodiments, the surface131and the surface141may define a stepped structure. In some embodiments, the surface131and the surface141may be not coplanar. However, in some embodiments, the surface131and the surface141may be coplanar (as shown inFIG.2B). In some embodiments, the electromagnetic wave transmitted or received by the antenna11(such as a low-band antenna) may propagate through the dielectric layer13(such as a low-Dk dielectric layer) and partially or entirely reflect from the interface between the dielectric layer14(such as a high-Dk dielectric layer) and the dielectric layer13. In some embodiments, the electromagnetic waves transmitted or received by the antenna12(such as a high-band antenna) may propagate through the dielectric layer14and partially or entirely be reflected by the interface between the dielectric layer14and the dielectric layer13. In some embodiments, the reflection of the electromagnetic waves may help to increase the gain of the antenna11and the antenna12. FIG.1Dillustrates a cross-sectional view of an antenna module1″ in accordance with some embodiments of the present disclosure. The antenna module1″ is similar to the antenna module1inFIG.1Aexcept that the dielectric layer13is attached to the antenna11through an adhesive layer13aand the dielectric layer14is attached to the antenna12through an adhesive layer14a. In some embodiments, the adhesive layer13amay cover the antenna11. For example, the adhesive layer13amay be in contact with (such as in direct contact with) the top surface of the antenna11. For example, adhesive layer13amay be in contact with (such as in direct contact with) the lateral surface of the antenna11. For example, adhesive layer13amay be in contact with (such as in direct contact with) the surface101of the substrate10. In some embodiments, the antenna11may be surrounded by the adhesive layer13a. The adhesive layer14amay cover the antenna12. For example, the adhesive layer14amay be in contact with (such as in direct contact with) the top surface of the antenna12. For example, the adhesive layer14amay be in contact with (such as in direct contact with) the lateral surface of the antenna12. For example, the adhesive layer14amay be in contact with (such as in direct contact with) the surface101of the substrate10. In some embodiments, the antenna12may be surrounded by the adhesive layer14a. In some embodiments, the adhesive layer13aand the adhesive layer14amay be alternately or staggerly arranged with each other. In some embodiments, the adhesive layer13aand the adhesive layer14amay be spaced apart. In some embodiments, a part of the adhesive layer13aand a part of the adhesive layer14amay be connected with each other. For example, the adhesive layer13amay be in contact with (such as in direct contact with) the adhesive layer14a. In some embodiments, each of the adhesive layer13aand the adhesive layer14amay have a material as listed above for the dielectric layer13and the dielectric layer14. In some embodiments, the adhesive layer13amay include a material having a Dk substantially equal to the Dk of the dielectric layer13. For example, the adhesive layer13amay include a material having a Dk between about 17 and about 19. In some embodiments, the adhesive layer14amay include a material having a Dk substantially equal to the Dk of the dielectric layer14. For example, the adhesive layer14amay include a material having a Dk between about 37 and about 40. In some embodiments, the adhesive layer13aand the adhesive layer14amay help to secure the dielectric layer13and the dielectric layer14. The size or area of the adhesive layer13aand the adhesive layer14amay be enough to hold the dielectric layer13and the dielectric layer14while not affecting the propagation of the electromagnetic waves. In some embodiments, since the dielectric layer13and the dielectric layer14do not have to surround the antenna11and the antenna12, the device dimensions and the cost of the antenna module1″ can be reduced. FIG.2Aillustrates a cross-sectional view of an antenna module2in accordance with some embodiments of the present disclosure. The antenna module2is similar to the antenna module1inFIG.1Aexcept that the antenna11and the antenna12are covered by a protection layer20. In some embodiments, the protection layer20may include a solder resist or solder mask. In some embodiments, the antenna11and the antenna12may be encapsulated by the protection layer20. For example, the thickness of the protection layer20may be greater than the thickness11tof the antenna11. The thickness of the protection layer20may be greater than the thickness12tof the antenna12. In some embodiments, the protection layer20may have a surface substantially coplanar with a surface of the substrate10. The dielectric layer13and the dielectric layer14may be disposed on the protection layer20. The dielectric layer13and the dielectric layer14may be respectively aligned to the antenna11and the antenna12. In some embodiments, a projection area of the dielectric layer13on the substrate10may overlap a projection area of the antenna11on the substrate10. In some embodiments, a projection area of the dielectric layer14on the substrate10may overlap a projection area of the antenna12on the substrate10. In some embodiments, the width11wof the antenna11may be within the projection area of the dielectric layer13on the substrate10such that the antenna11is entirely positioned below the dielectric layer13. In some embodiments, the width12wof the antenna12may be within the projection area of the dielectric layer14on the substrate10such that the antenna12is entirely positioned below the dielectric layer14. The dielectric layer13and the dielectric layer14may be spaced apart. A part of the protection layer20may be exposed from a gap between the dielectric layer13and the dielectric layer14. In some embodiments, the protection layer20may help to protect the antenna11and the antenna12from oxidization or contamination during transportation. In some embodiments, since the dielectric layer13and the dielectric layer14do not have to surround the antenna11and the antenna12, the device dimensions and the cost of the antenna module1″ can be reduced. FIG.2Billustrates a cross-sectional view of an antenna module2′ in accordance with some embodiments of the present disclosure. The antenna module2′ is similar to the antenna module2inFIG.2Aexcept the dielectric layer13and the dielectric layer14are in contact with each other. For example, the protection layer20is not exposed between the dielectric layer13and the dielectric layer14. In some embodiments, the surface131and the surface141may be coplanar. However, in some embodiments, the surface131and the surface141may define a stepped structure. In some embodiments, the surface131and the surface141may be not coplanar (as shown inFIG.1C). In some embodiments, the electromagnetic waves transmitted or received by the antenna11(such as a low-band antenna) may propagate through the protection layer20, the dielectric layer13(such as a low-Dk dielectric layer), and partially or entirely be reflected by the interface between the dielectric layer14(such as a high-Dk dielectric layer) and the dielectric layer13. In some embodiments, the electromagnetic waves transmitted or received by the antenna12(such as a high-band antenna) may propagate through the protection layer20, the dielectric layer14, and partially or entirely be reflected by the interface between the dielectric layer14and the dielectric layer13. In some embodiments, the reflection of the electromagnetic waves may help to increase the gain of the antenna11and the antenna12. FIG.3Aillustrates a cross-sectional view of a semiconductor device package3in accordance with some embodiments of the present disclosure. The semiconductor device package3includes a carrier30, an antenna module31, electronic components32,33, and electrical contact34. The carrier30has a surface301and a surface302opposite the surface301. The carrier30may be, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. In some embodiments, the carrier30may include an interconnection structure, such as a RDL, a grounding layer, and a feeding line. The antenna module31may be disposed on the surface301of the carrier30. The antenna module31may be one of the antenna module1, the antenna module1′, the antenna module1″, the antenna module2, and the antenna module2′. For example, as shown in the enlarged view inFIG.3A, the antenna module31may have antennas11and12, and dielectric layers13and14. The electronic component32may be disposed on the surface302of the carrier30. The electronic component33may be disposed on the surface301of the carrier30. The electronic component33and the antenna module31may be disposed side-by-side. The electronic component33and the antenna module31may be located at different areas of the carrier30. Each of the electronic components32and33may be a chip or a die including a semiconductor substrate, one or more integrated circuit devices and one or more overlying interconnection structures therein. The integrated circuit devices may include active devices such as transistors and/or passive devices such as resistors, capacitors, inductors, or a combination thereof. In some embodiments, each of the electronic components32and33may be a transmitter, a receiver, or a transceiver. In some embodiments, each of the electronic components32and33may include an RF IC. Although there are two electronic components inFIG.3A, the number of the electronic components is not limited thereto. In some embodiments, there may be any number of electronic components depending on design requirements. Each of the electronic components32and33may be electrically connected to one or more of other electrical components and to the carrier30and the electrical connections may be attained by way of flip-chip or wire-bond techniques. Each of the electronic components32and33may be electrically connected to the antenna module31. In some embodiments, the signal transmission path between each of the electronic components32and33and the antenna module31may be attained by a feeding line in the carrier30. In some embodiments, the feeding line may include, but not limited to, a metal pillar, a bonding wire or stacked vias. In some embodiments, the feeding line may include Au, Ag, Al, Cu, or an alloy thereof. The electrical contact34(e.g. a solder ball) is disposed on the surface302of the carrier30and can provide electrical connections between the semiconductor package device3and external components (e.g. external circuits or circuit boards). In some embodiments, the electrical contact34includes a controlled collapse chip connection (C4) bump, a ball grid array (BGA) or a land grid array (LGA). In some embodiments, the antenna module31and the electrical contact34may be disposed on the same side of the carrier30. In some embodiments, the electrical contact34may be omitted. FIG.3Billustrates a cross-sectional view of a semiconductor device package3′ in accordance with some embodiments of the present disclosure. The semiconductor device package3is similar to the semiconductor device package3inFIG.3Aexcept that the antenna module31and the electronic component33are disposed on opposite surface of the carrier30and that the electrical contact34as shown inFIG.3Ais omitted. As used herein, the singular terms “a,” “an,” and “the” may include a plurality of referents unless the context clearly dictates otherwise. As used herein, the terms “conductive,” “electrically conductive” and “electrical conductivity” refer to an ability to transport an electric current. Electrically conductive materials typically indicate those materials that exhibit little or no opposition to the flow of an electric current. One measure of electrical conductivity is Siemens per meter (S/m). Typically, an electrically conductive material is one having a conductivity greater than approximately 104S/m, such as at least 105S/m or at least 106S/m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature. As used herein, the terms “approximately,” “substantially,” “substantial” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation of less than or equal to ±10% of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two numerical values can be deemed to be “substantially” the same or equal if a difference between the values is less than or equal to ±10% of an average of the values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, “substantially” parallel can refer to a range of angular variation relative to 0° that is less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, “substantially” perpendicular can refer to a range of angular variation relative to 90° that is less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. Additionally, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity and should be understood flexibly to include numerical values explicitly specified as limits of a range, but also to include all individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly specified. While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations do not limit the present disclosure. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not be necessarily drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus due to manufacturing processes and tolerances. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure. | 31,630 |
11862856 | DETAILED DESCRIPTION Before describing in detail exemplary embodiments, it is noted that the embodiments reside primarily in combinations of apparatus components and processing steps related to an antenna-filter array module and a method of its manufacture. Accordingly, components have been represented where appropriate by conventional symbols in the drawings, showing only those specific details that are pertinent to understanding the embodiments so as not to obscure the disclosure with details that will be readily apparent to those of ordinary skill in the art having the benefit of the description herein. As used herein, relational terms, such as “first” and “second,” “top” and “bottom,” and the like, may be used solely to distinguish one entity or element from another entity or element without necessarily requiring or implying any physical or logical relationship or order between such entities or elements. Referring again to the drawing figures, where like reference numerals denote like elements,FIG.6shows one embodiment of an antenna-filter array module30that solves the above-mentioned problems of CTE mismatch and large span between solder balls32both causing unreliability, without introducing problems such as dirty underfill, expensive solder-coated polymer balls, and antenna element misalignment. Components of the antenna-filter array module30include LTCC antenna-filter elements34, one module PCB36and two layers of solder balls/bumps32or other solder structure at suitable soldering sites. As shown inFIG.6, the antenna-filter array module30has antenna-filter units (elements)34, each antenna-filter unit (element)34having an antenna design on a top layer38and a filter design on the lower layer39of the antenna-filter unit34. In some embodiments, routing circuits for the antenna38and filter39array, such as transmission lines and splitters/combiners, etc., can be designed within the module PCB36if preferred. Also, the two layers of solder balls/bumps32can have different melting temperatures depending on the radio PCB40assembly process. Note that althoughFIG.6discloses only one antenna element per antenna-filter unit34, it is noted that there can be more than one antenna element per antenna-filter unit. Different arrays of antenna elements may make up an antenna-filter unit. For example, see the 2×2 antenna-filter unit ofFIG.8, discussed below in detail. Note also that radio PCB40can be a known/existing radio PCB such as radio PCB16. In other words, the LTCC antenna-filter module disclosed herein is backward compatible, being able to couple to existing radio PCBs, and forward compatible, being able to couple to radio PCBs yet to be developed. FIGS.7A-7Cshow steps of one embodiment of a method for manufacturing the LTCC antenna-filter array module30disclosed herein. The method starts with an LTCC tile42having an array of at least two antenna elements with their underlying filters (antenna-filter element34, for example).Step1(FIG.7A): Mount the LTCC tile42to a first side of a module PCB36via soldering structures at soldering sites, where the module PCB36is chosen to have a CTE that is the same as or close to the CTE of an expected radio PCB.Step2(FIG.7B): Dice (cut) the LTCC tile42into antenna-filter units34that have the same dimension as the identified maximum LTCC antenna-filter array size that does not have reliability issues. Such an antenna-filter unit is called a reliability-issue-free (RIF) unit46. Note that this step may be performed after Step1, to avoid the situation ofFIG.5, where the mounting occurs after the cutting. Thus, the dicing lines44denote boundaries of RIF units46.Step3(FIG.7C): Clean up all dicing debris and create soldering sites on a second side of the module PCB36opposite the first side of the module PCB36. It is noted that Step2and Step3inFIGS.7B and7Cdepict only one embodiment, where the reliability-issue-free unit is a single antenna element (a 1×1 array), the smallest array size. In general, the reliability-issue-free unit can be an N×M array, where N and M are integers that may be equal. The size of the RIF unit may depend on what LTCC material and what PCB material are used. FIG.8illustrates a top view and sectional side view of an LTCC antenna-filter array module30, where the RIF unit46is a 2×2 array. Thus, in the example ofFIG.8, the LTCC tile that has 16 dual-polarized antenna elements, and which is cut into four quadrants each quadrant occupied by a different RIF unit46. Note that in some embodiments, the 16 dual-polarized antenna elements may each consist of two perpendicular antennas. Other differently polarized antenna elements may be employed. Thus, once bound to the module PCB36, the LTCC tile42is diced to create small mechanically independent units, defined inFIG.7by dicing lines44, where each such unit is reliability-issue-free (RIF). For these units, there will be no reliability issue due to thermal expansion mismatch or too large of a span between edge soldering sites (such as soldering balls or bumps) on the first side of the module PCB36, since no unit is greater than the identified maximum LTCC antenna-filter array size that does not have reliability issues. When the LTCC antenna-filter module is mounted on the radio PCB through the second side solder sites as shown inFIG.6andFIG.9, for example, and when the module PCB36has a CTE that is equal to or close to the CTE of the radio PCB40, there is no thermal mismatch or small thermal mismatch between the module PCB36and the radio PCB40. Thus, the second set of solder structures on the second side of the module PCB36should not have a reliability issue. As result of the above, the entire LTCC antenna-filter array module30as manufactured according to the above recited steps should not have reliability issues when mounted on the radio PCB40. Thus, some embodiments provide a comprehensive approach to solving the reliability issues of the LTCC antenna-filter array module30mounted on a radio PCB40. The LTCC antenna-filter array module30described herein may be mounted simply on the radio PCB40at low cost. Also, in at least some embodiments, the LTCC antenna-filter array module30has higher beamforming performance than the existing solution proposals described above, because all antenna-filter units are aligned and because the gaps between adjacent antenna-filter units impede surface-traveling electromagnetic waves that degrade beamforming performance. Further, because the LTCC antenna-filter array module is a physical module, the assembly yield of the radio manufacture will not be affected by the presence of the module. FIG.10is a flowchart of an exemplary process for manufacturing an antenna-filter array module. The process includes soldering an LTCC tile42having the at least two antenna elements34to a first side of a module PCB, the soldering including soldering at first soldering sites lying between the LTCC tile42and the module PCB36, the module PCB36having a size at least as great as a size of the LTCC tile42(Block S100). The process also includes cutting the LTCC tile42into reliability issue free, RIF, units46, each RIF unit46having a size not greater than a predetermined largest reliable size (Block S102). The process further includes forming a plurality of second soldering sites (e.g., solder balls/bumps32) configured to couple with the radio PCB40on a second side of the module PCB36opposite the first side of the module PCB (Block S104). FIG.11is a flowchart of an alternative exemplary process for manufacturing an antenna-filter array module30. The process (Block S106) includes bonding a low temperature co-fired ceramic, LTCC, tile42having a plurality of antennas and corresponding filters (to form an antenna-filter element34) to a first side of the module PCB36via a first set of solder balls32, a coefficient of thermal expansion, CTE, of the module PCB36being within a predetermined amount of a CTE of the radio PCB40. The process further includes cutting the LTCC tile42into a plurality of reliability units46after the bonding, each reliability unit46having a size that is less than a predetermined largest reliable size. Therefore, some embodiments described herein include LTCC antenna-filter modules designed at low cost, small size and with high-performance in the mmWave 5G spectrum with NR AAS, thereby removing a last reliability problem of the LTCC module over the radio PCB. According to one aspect, a method of manufacturing an antenna-filter array module30that includes at least two antenna elements on a low temperature co-fired ceramic, LTCC, tile42couplable to a radio printed circuit board, PCB40, in an antenna array, includes soldering an LTCC tile42having the at least two antenna elements to a first side of a module PCB36, the soldering including soldering at first soldering sites lying between the LTCC tile42and the module PCB36, the module PCB36having a size at least as great as a size of the LTCC tile42. Following the soldering, the method includes cutting the LTCC tile42into reliability issue free, RIF, units46, each RIF unit46having a size not greater than a predetermined largest reliable size. The method further includes forming a plurality of second soldering sites configured to couple with the radio PCB40on a second side of the module PCB36opposite the first side of the module PCB36. According to this aspect, in some embodiments, the method further includes coupling the module PCB36to the radio PCB, the coupling including soldering at the plurality of second soldering sites. In some embodiments, a difference between a coefficient of thermal expansion, CTE, of the module PCB36and a CTE of the radio PCB is less than a predetermined amount. In some embodiments, the module PCB36and the radio PCB40are of the same material and have the same CTE. In some embodiments, a size of the module PCB36is greater than an area of the LTCC tile42. In some embodiments, the size of an RIF unit46is a size of one antenna element. In some embodiments, the size of an RIF unit46is a size of two rows of two antenna elements per row. In some embodiments, the size of an LTCC tile42is N rows of M antenna elements per row, where N and M are integers. In some embodiments, the size of an RIF unit46is a size of an antenna element of the at least two antenna elements. In some embodiments, a module PCB36has a size of at least two RIF units. In some embodiments, the solder structures are solder balls or bumps. According to another aspect, an antenna-filter array module30is provided. The antenna-filter array module includes a module printed circuit board, PCB36, having a first side and a second side, the first side having first soldering structures and configured to be soldered to a low-temperature co-fired ceramic, LTCC, tile42, the second side having second soldering structures, the second side configured to be coupled to a radio PCB. The antenna-filter array module further includes an LTCC tile42having at least two antenna elements and corresponding filters, the LTCC tile42being soldered to the first side of the module PCB36at the first soldering structures and cuttable into reliability issue free, RIF, units46, each RIF unit being of a size not greater than a predetermined largest reliable size. According to this aspect, in some embodiments, a difference between a coefficient of thermal expansion, CTE, of the module PCB36and a CTE of the radio PCB is chosen to be less than a predetermined amount. In some embodiments, the module PCB36and the radio PCB40are of the same material and have the same CTE. In some embodiments, a size of the module PCB36is greater than an area of an LTCC tile42. In some embodiments, the size of an RIF unit is a size of one antenna element. In some embodiments, the size of an RIF unit is a size of two rows of two antenna elements per row. In some embodiments, the size of an LTCC tile42is a size of N rows of M antenna elements per row. In some embodiments, the size of an RIF unit is a size of an antenna element of the at least two antenna elements. In some embodiments, a module PCB36has a size equal to the LTCC tile42before cutting. According to yet another aspect, a method of manufacturing an antenna-filter array module configured to be coupled to a radio printed circuit board, PCB, the antenna-filter array module having a module PCB36having a first side on which a first set of solder balls are positioned and having a second side on which a second set of solder balls are positioned, is provided. The method includes bonding a low temperature co-fired ceramic, LTCC, tile having a plurality of antennas and corresponding filters to a first side of the module PCB36via a first set of solder balls, a coefficient of thermal expansion, CTE, of the module PCB36being within a predetermined amount of a CTE of the radio PCB40. The method further includes cutting the LTCC tile42into a plurality of reliability units after the bonding, each reliability unit having a size that is less than or equal to a predetermined largest reliable size. According to this aspect, in some embodiments, a size of the module PCB36is a size of an LTCC tile42. In some embodiments, the module PCB36and the radio PCB40are of the same material and have the same CTE. Many different embodiments have been disclosed herein, in connection with the above description and the drawings. It will be understood that it would be unduly repetitious and obfuscating to literally describe and illustrate every combination and subcombination of these embodiments. Accordingly, all embodiments can be combined in any way and/or combination, and the present specification, including the drawings, shall be construed to constitute a complete written description of all combinations and subcombinations of the embodiments described herein, and of the manner and process of making and using them, and shall support claims to any such combination or subcombination. AbbreviationExplanationAASAdvanced Antenna SystemCTECoefficient of Thermal ExpansionEMElectromagneticLTCCLow Temperature Co-fired Ceramics It will be appreciated by persons skilled in the art that the embodiments described herein are not limited to what has been particularly shown and described herein above. In addition, unless mention was made above to the contrary, it should be noted that all the accompanying drawings are not to scale. A variety of modifications and variations are possible in light of the above teachings without departing from the scope of the following claims. | 14,558 |
11862857 | DETAILED DESCRIPTION Techniques are discussed herein for multi-band antenna system operation. For example, stacked patches may be used for operation in one frequency band, e.g., a lower frequency band, with the stacked patches including an active patch and a parasitic patch. The active patch is coupled to an energy coupler, for example, so that the active patch may be driven or so that energy received by the active patch may be conveyed to the energy coupler for provision to circuitry for processing the energy (e.g., communication signals, positioning signals, etc.). At least a portion of the parasitic patch may be used for operation in another frequency band, e.g., a higher frequency band. Thus, at least a portion of the parasitic patch is shared for operation in more than one frequency band. For example, the shared patch may include multiple, physically separate pieces at least some of which are used as an active component for the other frequency. The physically separate pieces may be used, for example, as one or more dipoles. As another example, the shared patch (that is a parasitic patch for one frequency band), may provide one or more slots for operation in the other frequency band. As yet another example, the shared patch may provide one or more slots and one or more dipoles may overlap (e.g., being disposed in) the one or more slots and be used for operation in the other frequency band. Each of the different frequency bands may extend over a large range of frequencies (e.g., for a range over 15% (e.g., over about 60%) of the lowest frequency in the band), and the different frequency bands may be separated by a range of frequencies. For example, a highest frequency of one band being 10 GHz or more less than a lowest frequency of the other band. As another example, the highest frequency of one band may be about 90% of the lowest frequency of the other band. Other configurations, however, may be used. Items and/or techniques described herein may provide one or more of the following capabilities, as well as other capabilities not mentioned. For example, multi-band antenna operation may be provided using co-located antenna components. At least a portion of an antenna system may be used for radiation or receipt of wireless signals of one frequency band and also used for radiation or receipt of wireless signals of a different frequency band. Broadband, multi-band antenna operation may be provided in a compact form factor, e.g., with high gain, a low profile, and/or low manufacturing cost. Other capabilities may be provided and not every implementation according to the disclosure must provide any, let alone all, of the capabilities discussed. Further, it may be possible for an effect noted above to be achieved by means other than that noted, and a noted item/technique may not necessarily yield the noted effect. Referring toFIG.1, a communication system10includes mobile devices12, a network14, a server16, and access points (APs)18,20. The system10is a wireless communication system in that components of the system10can communicate with one another (at least some times using wireless connections) directly or indirectly, e.g., via the network14and/or one or more of the access points18,20(and/or one or more other devices not shown, such as one or more base transceiver stations). For indirect communications, the communications may be altered during transmission from one entity to another, e.g., to alter header information of data packets, to change format, etc. The mobile devices12shown are mobile wireless communication devices (although they may communicate wirelessly and via wired connections) including mobile phones (including smartphones), a laptop computer, and a tablet computer. Still other mobile devices may be used, whether currently existing or developed in the future. Further, other wireless devices (whether mobile or not) may be implemented within the system10and may communicate with each other and/or with the mobile devices12, network14, server16, and/or APs18,20. For example, such other devices may include internet of thing (IoT) devices, medical devices, home entertainment and/or automation devices, etc. The mobile devices12or other devices may be configured to communicate in different networks and/or for different purposes (e.g., 5G, Wi-Fi communication, multiple frequencies of Wi-Fi communication, satellite positioning, one or more types of cellular communications (e.g., GSM (Global System for Mobiles), CDMA (Code Division Multiple Access), LTE (Long-Term Evolution), etc.), Bluetooth® communication, etc.). Referring toFIG.2, an example of one of the mobile devices12shown inFIG.1includes a top cover52, a display layer54, a printed circuit board (PCB) layer56, and a bottom cover58. The mobile device12as shown may be a smartphone or a tablet computer but embodiments described herein are not limited to such devices. The top cover52includes a screen53. The bottom cover58has a bottom surface59. Sides51,57of the top cover52and the bottom cover58provide an edge surface. The top cover52and the bottom cover58comprise a housing that retains the display layer54, the PCB layer56, and other components of the mobile device12that may or may not be on the PCB layer56. For example, the housing may retain (e.g., hold, contain) or be integrated with antenna systems, front-end circuits, an intermediate-frequency circuit, and a processor discussed below. The housing may be substantially rectangular, having two sets of parallel edges in the illustrated embodiment, and may be configured to bend or fold. In this example, the housing has rounded corners, although the housing may be substantially rectangular with other shapes of corners, e.g., straight-angled (e.g., 45°) corners, 90°, other non-straight corners, etc. Further, the size and/or shape of the PCB layer56may not be commensurate with the size and/or shape of either of the top or bottom covers or otherwise with a perimeter of the device. For example, the PCB layer56may have a cutout to accept a battery. Those of skill in the art will therefore understand that embodiments of the PCB layer56other than those illustrated may be implemented. Referring also toFIG.3, an example of the PCB layer56includes a main portion60and two antenna systems62,64. In the example shown, the antenna systems62,64are disposed at opposite ends63,65of the PCB layer56, and thus, in this example, of the mobile device12(e.g., of the housing of the mobile device12). The main portion60comprises a PCB66that includes front-end circuits70,72(also called a radio frequency (RF) circuit), an intermediate-frequency (IF) circuit74, and a processor76. The front-end circuits70,72may be configured to provide signals to be radiated to the antenna systems62,64and to receive and process signals that are received by, and provided to the front-end circuits70,72from, the antenna systems62,64. The front-end circuits70,72may be configured to convert received IF signals from the IF circuit74to RF signals (amplifying with a power amplifier as appropriate), and provide the RF signals to the antenna systems62,64for radiation. The front-end circuits70,72are configured to convert RF signals received by the antenna systems62,64to IF signals (e.g., using a low-noise amplifier and a mixer) and to send the IF signals to the IF circuit74. The IF circuit74is configured to convert IF signals received from the front-end circuits70,72to baseband signals and to provide the baseband signals to the processor76. The IF circuit74is also configured to convert baseband signals provided by the processor76to IF signals, and to provide the IF signals to the front-end circuits70,72. The processor76is communicatively coupled to the IF circuit74, which is communicatively coupled to the front-end circuits70,72, which are communicatively coupled to the antenna systems62,64, respectively. In some embodiments, transmission signals may be provided from the IF circuit74to the antenna system62and/or the antenna system64by bypassing the front-end circuit70and/or the front-end circuit72, for example when further upconversion is not required by the front-end circuit70and/or the front-end circuit72. Signals may also be received from the antenna system62and/or the antenna system64by bypassing the front-end circuit70and/or the front-end circuit72. In other embodiments, a transceiver separate from the IF circuit74is configured to provide transmission signals to and/or receive signals from the antenna system62and/or the antenna system64without such signals passing through the front-end circuit70and/or the front-end circuit72. In some embodiments, the front-end circuits70,72are configured to amplify, filter, and/or route signals from the IF circuit74without upconversion to the antenna systems62,64. Similarly, the front-end circuits70,72may be configured to amplify, filter, and/or route signals from the antenna systems62,64without downconversion to the IF circuit74. InFIG.3, the dashed lines separating the antenna systems62,64from the PCB66indicate functional separation of the antenna systems62,64(and the components thereof) from other portions of the PCB layer56. Portions of the antenna systems62,64may be integral with the PCB66, being formed as integral components of the PCB66. One or more components of the antenna system62and/or the antenna system64may be formed integrally with the PCB66, and one or more other components may be formed separate from the PCB66and mounted to the PCB66, or otherwise made part of the PCB layer56. Alternatively, each of the antenna systems62,64may be formed separately from the PCB66and coupled to the front-end circuits70,72, respectively. In some examples, one or more components of the antenna system62may be integrated with the front-end circuit70, e.g., in a single module or on a single circuit board separate from the PCB66. For example, the front-end circuit70may be physically attached to the antenna system62, e.g., attached to a back side of a ground plane of the antenna system62. Also or alternatively, one or more components of the antenna system64may be integrated with one or more components of the front-end circuit72, e.g., in a single module or on a single circuit board. For example, an antenna of the antenna system62may have front-end circuitry electrically (conductively) coupled and physically attached to the antenna while another antenna may have the front-end circuitry physically separate, but electrically coupled to the other antenna. The antenna systems62,64may be configured similarly to each other or differently from each other. For example, one or more components of either of the antenna systems62,64, may be omitted. As an example, the antenna system62may include 4G and 5G radiators while the antenna system64may not include (may omit) a 5G radiator. In other examples, an entire one of the antenna systems62,64may be omitted. While the antenna systems62,64are illustrated as being disposed at the top and bottom of the mobile device12, other locations of the antenna system62and/or the antenna system64may be implemented. For example, one or more antenna systems may be disposed on a side of the mobile device12. Further, more antenna systems than the two antenna systems62,64may be implemented in the mobile device12. A display61(seeFIG.2) of the display layer54may roughly cover the same area as the PCB66, or may extend over a significantly larger area (or at least over different regions) than the PCB66, and may serve as a system ground plane for portions, e.g., feed lines or other components, of the antenna systems62,64(and possibly other components of the device12). The PCB66may also provide a ground plane for components of the system. The display61may be coupled to the PCB66to help the PCB66serve as a ground plane. The display61may be disposed below the antenna system62and above the antenna system64(with “above” and “below” being relative to the mobile device12as illustrated inFIG.3, i.e., with a top of the mobile device12being above other components regardless of an orientation of the device12relative to the Earth). In some embodiments, the antenna systems62,64may have widths approximately equal to a width of the display61. The antenna systems62,64may extend less than about 10 mm (e.g., 8 mm) from edges, here ends77,78, of the display61(shown inFIG.3as coinciding with ends of the PCB66for convenience, although ends of the PCB66and the display61may not coincide). This may provide sufficient electrical characteristics for communication using the antenna systems62,64without occupying a large area within the device12. In some embodiments, one or more of the antenna systems62,64partially or wholly overlaps with the PCB66and/or the display61. In some embodiments, one or more antenna systems are disposed to the side (relative to the mobile device12as illustrated inFIG.3) of the PCB66and/or the display61. In some embodiments, one or more antenna systems wrap around a corner of the mobile device12such that the antenna system is disposed either above or below the PCB66and/or the display61and also to the side of the PCB66and/or the display61. The antenna system62includes one or more antenna elements80and one or more corresponding energy couplers81, and the antenna system64includes one or more antenna elements82and one or more corresponding energy couplers83. The antenna elements80,82may be referred to as “radiators” although the antenna elements80,82may radiate energy and/or receive energy. The energy couplers may be referred to as “feeds,” but an energy coupler may convey energy to a radiator from a front-end circuit, or may convey energy from a radiator to the front-end circuit. An energy coupler may be conductively connected to a radiator or may be physically separate from the radiator and configured to reactively (capacitively and/or inductively) couple energy to or from the radiator. Example Antenna System—Stacked Patches Including Multi-Piece Parasitic Patch Referring toFIG.4, with further reference toFIG.3, an antenna system100is an example of the antenna system62(or the antenna system64). The antenna system100is a stacked-patch antenna system including patch antenna elements102,104, and energy couplers106,108. The antenna system100may be configured to operate over multiple frequency bands, with broadband operation in each band. For example, the antenna system100may operate in frequency bands where frequencies in a first band (a higher frequency band) are about twice frequencies in a second band (a lower frequency band). That is, frequencies in the second band are about half frequencies in the first band, such as a 28 GHz band (e.g., from 28 GHz to 44 GHz) and a 60 GHz band (e.g., from 57.5 GHz to 67.5 GHz). The antenna system100may be configured to operate over multiple frequency bands in that a return loss for radiation (even if the system is not used for radiation) may be below a threshold level, e.g., −3 dB, or −5 dB, or −10 dB (or other value) over the frequency bands of operation, and/or the system100may have a resonance in each frequency band of operation. Sub-systems of the system100for operation in different bands are co-located, e.g., being disposed at the same location, and in examples discussed herein, the sub-systems share one or more components. The patch antenna element104may be configured to provide additional bandwidth (e.g., for 5G operation) in comparison to a configuration in which the patch antenna element102is used without the patch antenna element104. Further, the patch antenna element104here includes multiple (smaller) patch elements and one or more of the smaller patch elements, e.g., one or more subsets of the smaller patch elements, may be used to provide antenna operation in a different band, e.g., a 60 GHz band. Thus, the antenna system100is configured such that at least a portion of the patch antenna element104may be shared for operation in both the lower frequency band and the higher frequency band (i.e., as part of a first frequency band antenna sub-system and as part of a second frequency band antenna sub-system). For example, the patch antenna elements102,104, in conjunction with the energy coupler106, may operate as an active patch and a parasitic patch in a first frequency band, e.g., the 28 GHz band, and portions of the patch antenna element104, in conjunction with the energy coupler108, may operate as one or more dipoles in another frequency band, e.g., the 60 GHz frequency band. One or more elements of the patch antenna element104(separately or together) may operate as a parasitic patch, being configured to radiate due to energy reactively (capacitively and/or inductively) coupled from another (e.g., patch) radiator, and not being electrically connected to, or disposed to be an active radiator that is configured to be a primary recipient of energy from, an energy coupler (here the energy coupler106) that is configured to provide energy of a frequency for which the element is a parasitic element. The shared component(s) for the different frequency bands of operation may help the antenna system100provide a compact, low-profile antenna system. The stacked patches may help the antenna system provide broadband performance. Sharing one or more components may help a small form-factor system provide multi-band performance. The patch antenna element102is electrically conductive and sized and shaped for operation over a desired frequency band. For example, the patch antenna element102may radiate more than half of the energy provided to the patch antenna element102in the desired frequency band, or may have a resonance in the desired frequency band, etc. In the example shown, the patch antenna element102is rectangular, in this case being substantially square, with side lengths116each within 5% in length of each other and each of about half of a wavelength (e.g., 40%-60% of the wavelength) of a signal having a frequency in the desired frequency band (e.g., the lower frequency band) and traveling in a substrate of the antenna system100, e.g., a dielectric on which or in which the patch antenna element102is disposed. For example, the wavelength may be a wavelength in a substrate (not shown) separating the patch antenna elements102,104. The side lengths in this example are edge lengths of edges configured to radiate or receive electromagnetic signals. The patch antenna element104, in this example, is a parasitic patch antenna element and comprises multiple (here, four) physically separate electrically conductive portions111,112,113,114. The portions111-114of the patch antenna element104are each conductive, and may be sized, shaped, and disposed relative to each other to reactively couple to each other. The patch antenna element104may be sized, shaped, and disposed relative to the patch antenna element102to serve as a parasitic patch element for the patch antenna element102. The patch antenna element104may be shaped (here substantially as a square) similarly to the patch antenna element102, e.g., the patch antenna element102has a perimeter with a shape that is similar to a perimeter shape of a perimeter bounding the patch antenna element104(enclosing all of the portions111-114and gaps between the portions111-114; see the discussion below of the perimeter151). The perimeter shapes may be substantially square, e.g., with side lengths all within 5% of each other. The patch antenna element104may have a side length118that is longer than the side length116, with the relative lengths depending on several factors including spacing between the patch antenna elements102,104and desired resonating profile. The patch antenna element104, and the combination of the patch antenna elements102,104, may have a resonant frequency different from a resonant frequency of the patch antenna element102, which may help increase an overall bandwidth of the combination of the elements102,104. For example, the combination of the patch antenna elements102,104may resonate at about 24 GHz (e.g., 22-26 GHz) while the patch antenna element102may resonate at about 35 GHz (e.g., 33-37 GHz). Here, each of the portions111-114of the patch antenna element104is also substantially square (e.g., with sides within 5% in length of each other), with pairs of the portions111-114separated by gaps120,122. The size(s) of the gaps120,122may be selected, e.g., empirically, to affect coupling between the portions111-114to achieve one or more desired performance characteristics (e.g., return loss, or antenna pattern, etc.). Side lengths119of each of the portions111-114may be about one-half of a wavelength (e.g., 40%-60% of the wavelength) of a signal having a frequency in a desired frequency band (e.g., the higher frequency band) and traveling in a substrate of the antenna system100, e.g., a dielectric on which or in which the portions111-114are disposed. The side lengths116,119may be sized relative to each other and may depend on the frequency bands of operation. For example, the side lengths116may be about twice (e.g., twice ±5%) each of the side lengths119with the lower frequency band being from 28 GHz to 44 GHz and the higher frequency band being from 57.5 GHz to 67.5 GHz. As a parasitic patch element, the patch antenna element104may improve the bandwidth of the patch antenna element102. The bandwidth may be improved by the frequency band over which the patch antenna element102converts energy between electrical signals and electromagnetic waves. That is, the antenna system100may receive electrical signals and radiate corresponding electromagnetic waves with acceptable loss over a wider range of frequencies than without the patch antenna element104, and/or may receive electromagnetic waves and convey corresponding electrical signals over a range of frequencies with less loss than without the patch antenna element104. The patch antenna element104may not be directly electrically connected to receive or convey energy in the lower frequency band, e.g., from or to one or more other components such as front-end circuitry (e.g., the front-end circuit70or the front-end circuit72). The patch antenna element104may be reactively coupled to receive and/or convey energy in the lower frequency band, e.g., from and/or to the patch antenna element102, and may be directly electrically connected (e.g., to the energy coupler108) to receiver and/or convey energy in the higher frequency band from or to one or more other components such as a front-end circuit. Here, the patch antenna element104overlaps the patch antenna element102, with both of the antenna elements102,104being centered about an axis124perpendicular to both of the antenna elements102,104. The patch antenna element104is a split antenna element. The patch antenna element104is segmented, in this example into the four portions111-114. Thus, the patch antenna element104is non-contiguous, comprising not a monolithic conductor (e.g., conductive sheet), but multiple discontinuous conductive portions, here substantially square conductive sheet portions. While the patch antenna element102, the patch antenna element104, and the portions111-114in this example are all substantially square, other shapes may be used. For example, other non-square rectangular shapes of patches may be used. In some embodiments, the two lengths of the sides of the non-square rectangles may be configured to radiate at two respective frequencies, thereby creating a dual resonance and in some embodiments effectively extending the bandwidth across the two respective frequencies. As another example, shapes for the patch antenna element104that are rotationally symmetric about the axis124with portions that are equidistant from the axis124along orthogonal lines intersecting at the axis124may be used. In some embodiments, the portions111-114are elliptical and the element104is arranged in a clover or bowtie shape. The energy couplers106,108are configured and disposed to provide energy to and/or receive energy from the patch antenna elements102,104, respectively. The energy coupler106may directly or indirectly provide energy to and/or receive energy from the patch antenna element102. For example, the energy coupler106may comprise one or more electrically-conductive transmission lines, e.g., a microstrip line, a conductive rod, etc., physically connected to the patch antenna element102. Alternatively, the energy coupler106may comprise a device that is physically separate from the patch antenna element102and that is configured and disposed to reactively couple energy to and/or from the patch antenna element102. The energy coupler108may directly or indirectly provide energy to and/or receive energy from the patch antenna element104. For example, the energy coupler108may comprise a plurality of electrically-conductive transmission lines physically connected to the patch antenna element104. The energy coupler may comprise one or more pairs of conductors coupled to respective pairs of the portions111-114. For example, one pair of conductors may be connected to the portions111and114, and another pair of conductors may be connected to the portions112and113, e.g., to operate the pair of the portions111,114as one dipole and the pair of the portions112,113as another dipole. For example, the energy coupler108may be connected to the portions111-114near the axis124, and may pass through the patch antenna element102(e.g., as discussed further below). The patch antenna element104and the energy coupler108are configured such that at least a part of the patch antenna element104may be operated in the higher frequency band in one mode without exciting a mode (at least with significant energy, e.g., sufficient to significantly negatively affect the higher-frequency operation) in the patch antenna element102. The different modes may help provide isolation between operation in the different frequency bands. For simplicity of the figure, other possible features of the antenna system100are not shown inFIG.4. For example, a substrate on and/or in which components of the system100may be disposed is not shown. As another example, a ground plane may be useful for operation of the antenna system100but may not be part of the antenna system100itself. For example, a ground plane of another component of an apparatus in which the antenna system100is disposed may serve as a ground plane for the antenna system100. For example, the display61(seeFIG.2) or a ground plane of the PCB66(seeFIG.3) may serve as a ground plane for the antenna system100. In other embodiments, a ground plane separate from the display61and the PCB66is disposed relative to the antenna system100. For example, a ground plane may be configured in a substrate on which the antenna elements102,104are implemented, or otherwise within a module in which the antenna system100is packaged. Examples of Stacked Patches Including a Multi-Piece Parasitic Patch Referring toFIGS.5-7, with further reference toFIGS.3-4, an antenna system150is an example of the antenna system100shown inFIG.4. The antenna system150is a multi-band antenna system configured to operate over a lower frequency band and a higher frequency band. The antenna system150includes patch antenna elements152,154, energy couplers156,158, and a ground plane160, and optionally includes a tuning element159and a connection layer196. The patch antenna elements152,154are configured to operate in tandem as an active patch antenna element and a parasitic patch antenna element, respectively. The patch antenna element154is a multi-purpose element configured to serve at least dual purposes, to operate as both the parasitic patch antenna element for the patch antenna element152and as one or more antenna elements, here dipoles, configured to radiate and/or receive wireless signals. The patch antenna element154may be parasitically coupled to the patch antenna element152for operation in one mode (e.g., as a stacked-patch antenna in the lower frequency band) and directly coupled to an energy coupler for operation in another mode (e.g., as a dipole for the higher frequency band). For the sake of simplicity of the figure, a substrate170that separates the ground plane160from the patch antenna element152, and the patch antenna element152from the patch antenna element154(and the tuning element159if present) is not shown inFIG.5, but is shown inFIG.7. The substrate170includes substrate layers172,174of dielectric material. The layers172,174may comprise the same material, or may comprise different materials, e.g., with different dielectric constants. Depending upon the location of a signal in the substrate170and geometry of the substrate170(e.g., the thicknesses of the layers172,174), a wavelength of a signal in the substrate170may be a wavelength in the layer of the signal or may be an effective wavelength due to an effective dielectric constant of multiple layers of the substrate170. For example, an effective dielectric constant may be a combination of the dielectric constants of the layers172,174. The patch antenna elements152,154, in conjunction with the ground plane160and the energy coupler156, may comprise a stacked-patch antenna. The patch antenna element152is an active patch in that the energy coupler156is configured to provide energy to and/or receive energy from the patch antenna element152either by direct connection (e.g., physical conductive connection) or indirect connection (e.g., reactive coupling). In the embodiment illustrated inFIGS.5-7the energy coupler156includes a conductor180that is directly conductively connected to the patch antenna element152. The patch antenna element152may comprise a planar conductor disposed on the substrate layer172and configured to radiate and receive energy in orthogonal polarizations. In this example, the patch antenna element152is substantially square, with side lengths153(seeFIG.6) about one-half of a wavelength (e.g., 40%-60% of the wavelength), in the substrate170, of signals in the lower frequency band, e.g., from 27.5 GHz to 44 GHz. For example, the side lengths153may be about one-half of a wavelength (e.g., 40%-60% of the wavelength), in the substrate170, of a signal having a frequency of about 35 GHz (e.g., between 34.5 GHz and 35.5 GHz). The patch antenna element154may be disposed a distance176from the ground plane160where the distance176is about one-third of the wavelength, in the substrate170, of a frequency in the lower frequency band. The energy coupler156may further include a tuning stub182. The tuning stub182may itself be conductive and is connected to the conductor180by a line184, and together with the line184may form a tuner that is configured (e.g., sized and disposed) to improve coupling (e.g., improve an impedance match) between the conductor180and the patch antenna element152compared to not having the tuning stub182connected to the conductor180by the line184. The tuning stub182and the line184are separated from the ground plane160, e.g., by a thin layer of the substrate170(seeFIG.7). The energy coupler156may be connected to the front-end circuit70(seeFIG.3) by one or more appropriate conductors in the connection layer196. The patch antenna element152may thus be directly electrically connected by the conductor180to the connection layer196and thus to the front-end circuit70to receive energy (in the lower frequency band) from and/or convey energy (in the lower frequency band) to the front-end circuit70. While in this example, the energy coupler156comprises a single conductor180, another similar conductor (and optionally a similar corresponding tuning stub) may be provided and connected to the patch antenna element152. For example, this other conductor (and optional tuning stub) may be connected to the patch antenna element152to operate the patch antenna element152with an orthogonal polarization compared to that induced by the conductor180such that the patch antenna element152may be operated as an orthogonally-polarized patch antenna element. In some embodiments, this other conductor (and optional tuning stub) may form an additional energy coupler to operate the patch antenna element152, in conjunction with the energy coupler156. Further, while the conductor180is illustrated as being directly conductively connected to the patch antenna element152, the conductor180(or one or more of the multiple conductors, for example when another conductor is used to provide an orthogonal polarization) may be coupled to the patch antenna element152in other manners. For example, the conductor180may extend up to a region that is aligned with (e.g., in a same plane as) a plane of the patch antenna element152, but may be separated from the patch antenna element152by a gap so as to form a proximity feed (or gap feed) for the patch antenna element152. In other embodiments, the conductor180does not extend all the way up to a plane of the patch antenna element152, but rather is physically separated from (the plane and) the patch antenna element152, and communicatively coupled thereto. The patch antenna element154may be configured and disposed to operate in conjunction with the patch antenna element152. The patch antenna element154may be configured and disposed to operate as a parasitic patch antenna element, for example to improve a bandwidth of the patch antenna element152. Here, the patch antenna element154has a perimeter151(seeFIG.6) that is substantially the same shape as the patch antenna element152, here being substantially square, with the patch antenna element154having side lengths155(seeFIGS.6-7) that are longer than the side lengths153of the patch antenna element152. Other shapes of patch antenna elements, e.g., circles, may be used. The patch antenna element154may include multiple separate conductive planar portions, in this example four antenna element portions161,162,163,164, disposed on the substrate layer174. In this example, each of the portions161-164is disposed in a respective quadrant of the perimeter151. Each of the antenna element portions161-164in this example may be conductive patches that are substantially square, being separated from each other by gaps166,167, and having side lengths168. The antenna element portions161-164may be disposed such that the gaps166,167permit reactive coupling between adjacent ones of the antenna element portions161-164such that portions161-164of the patch antenna element154can effectively operate as a single unit over the frequencies of the lower frequency band. In some embodiments, the width of the gaps166,167(e.g., a distance between adjacent conductive patches) is approximately equal to or less than ⅛th, 1/16th, 1/20th, or 1/32nd(or less) of a wavelength of signals in the higher frequency band. The antenna system150may not include any substrate disposed on the substrate layer174or the patch antenna element154, and thus the patch antenna element154may be exposed to free space (although perhaps also exposed to a case, which may have a low dielectric constant, of a mobile device inside which the antenna system150is disposed, or a shield or other packaging component formed over the antenna system150or a portion thereof). The patch antenna element154may be disposed relative to the patch antenna element152with the elements152,154overlapping, being centered about a common axis, and oriented with edges of each of the elements152,154being parallel or perpendicular to edges of the other antenna element152,154. The side lengths155of the patch antenna element154may be about one-half of a wavelength (e.g., 40%-60% of a wavelength) of a frequency in the lower frequency band in the substrate layer174. For example, for a frequency of 30 GHz, and a dielectric constant of 3.4 for the substrate layer174, the side lengths155may be about 2.47 mm (with one-half of a wavelength at 30 GHz in a 3.4 dielectric constant substrate being about 2.71 mm). In this example, the side lengths153of the patch antenna element152may be about 2 mm. The side lengths153may be less than one-half of the wavelength due to an opening190(discussed further below) provided by the patch antenna element152that makes the patch antenna element152more inductive than without the opening190. The patch antenna element152defines the opening190through which portions of the energy coupler158are disposed. The patch antenna element152provides the opening190in a center of the patch antenna element152to help limit electrical effects of passage of the portions of the energy coupler158through the patch antenna element152. A central portion of the patch antenna element152will have vanishing electric field (toward a center line, e.g., see the axis124inFIG.4) in use such that the opening190and the presence of the energy coupler158through the opening190will have little if any consequence on the operation (e.g., antenna pattern, return loss) of the patch antenna element152. A size of the opening190may be selected, e.g., empirically, as a tradeoff between operation of the patch antenna element104in the higher frequency band (e.g., as one or more dipoles) and operation (e.g., antenna pattern, return loss) of the combination of the patch antenna elements152,154in the lower frequency band. As the size of the opening190is increased, a resonant frequency of the patch antenna element152may decrease and the inductance of the patch antenna element152may increase, which may be compensated by making the size of the patch antenna element152smaller. The opening190in this example is circular, although other shapes of openings may be used. The patch antenna element152may be (although not required to be) symmetric about a center of the patch antenna element152, e.g., about a center of a perimeter of the patch antenna element152, for dual-polarization operation. The energy coupler158may be configured to couple energy to and/or from respective ones of the antenna element portions161-164. In this example, the energy coupler is configured to couple energy to/from the antenna element portions161and164, but in other examples the energy coupler158may be configured to couple energy to the antenna element portions162and163instead of, or in addition to, the antenna element portions161and164. The energy coupler158is configured to couple energy to and/or from one or more subsets of the antenna element portions161-164, here each subset comprising a pair (i.e., two) of the portions161-164in diagonally disposed quadrants of the perimeter151. Here, the energy coupler158includes a pair of conductors202,204that are directly conductively connected to the antenna element portions161,164, respectively, of the patch antenna element154. The conductors202,204may be parallel conductive lines, e.g., twin lines, and may be connected to the front-end circuit70by appropriate conductors in the connection layer196. The patch antenna element154may thus directly electrically connect the conductors202,204to the connection layer196and thus to the front-end circuit70to receive energy (in the higher frequency band) from and/or convey energy (in the higher frequency band) to the front-end circuit70. The conductors202,204are disposed in the opening190and displaced from (being physically separate from, not connected to) the patch antenna element152to inhibit coupling between the conductors202,204and the patch antenna element152. While in this example, the energy coupler158comprises two conductors202,204, more conductors (and optionally one or more other corresponding tuning stubs, discussed further below) may be provided for further operation of the patch antenna element154, e.g., with orthogonal polarizations such as with conductors connected to the antenna element portions162,163to operate the portions162,163as another dipole. In that case, conductors may be connected to distinct subsets of the portions161-164, e.g., with the conductors202,204connected to the portions161,164and the other conductors connected to the antenna element portions162,163. The subsets are respective kitty-corner portions of the patch antenna element154, e.g., the portions161,164diagonally opposite in one subset and the portions162,163diagonally opposite in the other subset. The different sets of conductors may be connected to the front-end circuit70to be differentially fed to inhibit coupling between the conductors, i.e., the conductors202,204as one set for the dipole of the antenna element portions161,164and the other conductors as another set for the dipole of the antenna element portions162,163. That is, the respective pairs of conductors may be fed 180° out of phase with respect to each other. The conductors202,204may be shielded, even if operated differentially. While the conductors202,204are illustrated as being directly conductively connected to the antenna element portions161,164, the conductors202,204may be coupled to the patch antenna element154in other manners. For example, the conductors202,204may extend up to a region that is aligned with (e.g., in a same plane as) a plane of the antenna element154, but may be separated from the antenna element portions161,164, respectively by a gap so as to form a proximity feed (or gap feed) for the antenna element portions161,164. In other embodiments, one or more of the conductors202,204do not extend all the way up to a plane of the antenna element154, but rather are physically separated from (the plane and) the antenna element portions161and/or164, and communicatively coupled thereto. The energy coupler158further includes a tuning stub206, connected to the conductors202,204by lines208,210, respectively. The tuning stub206together with the lines208,210form a tuner that is configured (e.g., sized and disposed) to improve coupling (e.g., improve impedance matches) between the conductors202,204and the antenna element portions161,164compared to not having the tuning stub206connected to the conductors202,204by the lines208,210. The tuning stub206and the lines208,210are separated from the ground plane160, e.g., by a thin layer of the substrate170(seeFIG.7). The tuning stub206is connected to both of the conductors202,204, but in other configurations, separate tuning stubs may be connected to the conductors202,204. The antenna element portions161,164are configured to operate in conjunction with the energy coupler158as an antenna element, here a dipole, separate from the patch antenna element154. The antenna element portions161,164may receive energy in the higher frequency band from the energy coupler158and radiate energy in the higher frequency band. Also or alternatively, the antenna element portions161,164may receive energy in the higher frequency band and provide energy in the higher frequency band to the energy coupler158for conveyance to the front-end circuit70. Each of the antenna element portions161,164may comprise a planar conductor disposed on the substrate layer174and configured to radiate and/or receive energy in orthogonal polarizations. In this example, each of the antenna element portions161,164is substantially square, with side lengths168(seeFIG.6) about one-half of a wavelength (e.g., 40%-60% of the wavelength), in the substrate170, of signals in the higher frequency band, e.g., from 57.5 GHz to 67.5 GHz. For example, for a frequency of 60 GHz, and a dielectric constant of 3.4 for the substrate layer174, the side lengths168may be about 1.55 mm (with one-half of a wavelength at 60 GHz in a 3.4 dielectric constant substrate being about 1.35 mm). The portions161,164are configured to radiate energy received from the conductors202,204, respectively, along edges230,232and234,236, respectively, and/or to receive energy along the edges230,232and234,236and provide the received energy to the conductors202,204, respectively. The edges230,236may act in concert as a full-wavelength antenna element as may the edges232,234. The combination of the edges230,236and the edges232,234may result in a full-wavelength dipole antenna element and a full-wavelength slot, with polarizations of the dipole and the slot being reversed. The dipole formed by the antenna element portions161,164, being a full wavelength dipole (as the side lengths168are each about one-half wavelength long), may have an antenna pattern similar to that of a full-wavelength slot, with a null at boresight (e.g., in a direction perpendicular to a plane of the patch antenna element154, e.g., such as the axis124shown inFIG.4) absent some compensating structure. The tuning element159(also referred to as a tuner) may be a quarter-wavelength tuner, connected to and extending away from each of the conductors202,204by about a quarter of a wavelength (e.g., a quarter wavelength ±10% or less) in the substrate170at the higher frequency band (e.g., about 63 GHz). The tuning element159may comprise one or more conductive, e.g., metal, strips. The optional tuning element159may help fill, at least partially, the null in the antenna pattern of the dipole comprising the portions161,164, and a dipole comprising the portions162,163, and thus may help the system150provide broadband operation in the higher frequency band. For example, as shown inFIG.8, a null220(of about −8.5 dB) near boresight (0°) in a plot222of antenna gain of the dipole comprising the portions161,164without the tuning element159present is reduced to a null224(of about −5 dB) in a plot226of antenna gain of the dipole comprising the portions161,164with the tuning element159present. Further, while only one tuning element159is shown, more than one tuning element159may be used. For example, two tuning elements159could be disposed between the patch antenna element152and the patch antenna element154, e.g., with similar orientation, overlapping each other, but in different layers of the antenna system150. Referring also toFIG.9, the antenna system150may have low return loss over multiple frequency bands, here over both 28 GHz and 60 GHz bands. Plots shown inFIG.9are approximations of computer-simulated return loss for components of the antenna system150. As shown by a plot250, the stacked-patch combination of the patch antenna elements152,154of the antenna system150has a return loss (S11) below −10 dB over a range from about 28 GHz to about 48 GHz and below −7 dB over a range from about 27.5 GHz to about 53 GHz. Thus, the patch antenna elements152,154may be said to radiate well (e.g., with a return loss less than −7 dB) over the 5G frequency range from 27.5 GHz to 44 GHz. Further, as shown by a plot252, the dipole of the portions161,164of the patch antenna element154has a return loss below −8 dB over the frequency range from 57 GHz to 68 GHz, and indeed over a range from about 54 GHz to 68 GHz. Depending on a threshold corresponding to what is considered “radiation” or to “radiate well,” the antenna system150may be considered to be configured to radiate or to radiate well over various frequency bands. For example, if a threshold of −5 dB return loss is used, then the antenna system150may be considered to radiate, or radiate well, over at least a range from 27.5 GHz to 68 GHz, with the stacked patch antenna elements152,154radiating well over 27.5 GHz (or less) to about 57 GHz, and the dipole portion of the patch antenna element154radiating well over a range from about 40.5 GHz to at least 68 GHz. Array Using Multi-Band Stacked Patch Antenna with Multi-Piece Parasitic Patch Referring toFIG.10, with further reference toFIGS.3-7, an example of the antenna system62(or the antenna system64) includes an array310including multi-band antenna cells312, a first set of higher-frequency-band antenna cells314, and a second set of higher-frequency band cells316. Each of the cells312may be configured to operate in a lower frequency band (e.g., a 28 GHz band) and a higher frequency band (e.g., a 60 GHz band). For example, each of the cells312may be an example of the antenna system100, e.g., may be configured similarly to the antenna system150discussed above. Each of the cells314,316may be an antenna system configured to operate in the higher frequency band. An example of one of the cells314is discussed further below with respect toFIG.11. In the example shown inFIG.10, each of the cells316is a dipole, having conductive arms320,322, and configured to operate in a 60 GHz band, although other configurations of antenna type (e.g., other than a dipole) may be used and/or configurations for other frequency bands may be used. Other quantities of cells than that shown may be used. For example, two or more of the cells312along with one or more of the cells314may be used. As another example, one of the cells312and one of the cells314may be used. As yet another example, the number of the cells312and the number of the cells314may differ by more than one, e.g., if one of the cells312is used and more than two of the cells314is used (e.g., with multiple consecutive ones of the cells314being adjacent to each other, i.e., not interlaced with one or more of the cells312). As yet another example, a portion of an array may have cells312,314interlaced, and another portion with only cells314(not interlaced with any cells312). Still other examples may be used. In further examples, the cells316may be omitted from any of the configurations described above. The cells of the array310are disposed to provide improved antenna gain (e.g., compared to a single cell) while inhibiting grating lobes. For example, the cells312are interlaced with the cells314, with the cells312,314alternating along a length of the array310. The cells312may be disposed with a center-to-center spacing330of about a half of a free-space wavelength at a frequency in the lower frequency band. Here, with the cells312configured for operation in the 28 GHz band and the 60 GHz band, the center-to-center spacing330may be about a half of a free-space wavelength at 30 GHz, e.g., about 5 mm. The cells314may be disposed with a center-to-center spacing332of about a half of a free-space wavelength at a frequency in the higher frequency band relative to each adjacent antenna component or sub-system configured to operate in the same band in which the cells314are configured to operate (e.g., a portion of one of the cells312or an adjacent cell314). Here, with the cells314configured for operation in the 60 GHz band and a portion of each of the cells312configured to operate in the 60 GHz band, the center-to-center spacing332may be about a half of a free-space wavelength at 60 GHz, e.g., about 2.5 mm. Referring also toFIG.11, an antenna system350is an example of one of the cells314. The antenna system350may be configured to operate over a desired frequency band such as the 60 GHz band. In this example, the antenna system350includes stacked patches including a patch antenna element352and a patch antenna element354, and further includes energy couplers356,358and a ground plane360. The patch antenna element354is configured and disposed to operate as a parasitic patch in conjunction with the patch antenna element352that is configured and disposed to operate as an active patch. The patch antenna element354includes multiple portions362, which may increase a bandwidth provided by the antenna system350compared to the patch antenna element354comprising a monolithic conductive piece. The patch antenna element354may, however, have other configurations such as being a monolithic conductive sheet, or comprising a different quantity of separate portions rather than the 16 separate portions362shown inFIG.11. In the example shown inFIG.11, the antenna system350includes the two energy couplers356,358that are each configured similarly to the energy coupler156shown inFIG.5, with the energy couplers356,358being directly connected to the patch antenna element352for operation of the patch antenna element352in orthogonal polarizations. Although the two energy couplers356,358are included in this example, other quantities of energy couplers, such as one energy coupler, may be used. Further, other coupling mechanisms may be employed. Details of the antenna system350are omitted fromFIG.11for the sake of simplicity. For example, a substrate in or on which the patch antenna elements352,354are disposed is not shown, nor are details of a connection layer364that is configured and coupled to the energy couplers356,358to convey energy between the energy couplers356,358and front-end circuitry, e.g., the front-end circuit70(FIG.3). While the antenna system350has been described above as an example of one of the cells314, in other embodiments the antenna system350may be configured as an example of one of the cells312. For example, the patch antenna element352may be configured (e.g., sized and shaped) to radiate with a frequency in the range of 20-30 GHz. In some embodiments, the patch antenna element352is configured similarly to the patch antenna element152. Further, the patch antenna element352may have an opening or hole (not illustrated inFIG.11) formed therein to allow multiple feeds (not illustrated inFIG.11) to couple from the connection layer364to several portions362of the patch antenna element354. For example, a first feed may be coupled from the connection layer364through an opening in the patch antenna element352to a first portion372of the portions362, and a second feed may be coupled from the connection layer364through the same opening or a different opening in the patch antenna element352to a second portion374of the portions362. In such embodiment, the portions362may be smaller than the conductive/antenna element portions (e.g., the antenna element portions161-164) illustrated in earlier figures, and thus the first and second portions372,374may be configured to radiate at a different (e.g., higher) frequency than the portions illustrated in previous figures. As will be apparent to one of skill in the art, the embodiments illustrated in previous figures are thus not limited to implemented four conductive/antenna element portions. Further, embodiments of antenna systems described herein may include conductive/antenna portions of different shapes and/or sizes. In some embodiments, the portions372,374are sized and/or shaped (e.g., in a square shape) to behave as a full wavelength dipole for signals having a frequency somewhere in the range of about 70 GHz-100 GHz when fed appropriately (e.g., pursuant to methods and configurations described above). In some such embodiments, the portions376,378are sized and shaped (e.g., as a square) the same as the portions372,374and may or may not also be fed so as the cause the portions376,378to behave as a full wavelength dipole. The portions of the patch antenna element354other than the portions372-378(e.g., those portions forming a perimeter) may be smaller and/or shaped differently than the portions372-378. For example, the corner portions may be squares of a smaller size and the other portions may be rectangular bars having two sides with a length the same as a side of the portion372and a two other sides with a length the same as a side of the corner square portions. This may allow for two of more of the portions372-378to be configured for communication in a desired frequency band while also allowing for the overall size and/or shape of the patch antenna element354to be configured such that it operates (e.g., parasitically) with the patch antenna element352in a second desired frequency band and/or extends the bandwidth in which the patch antenna element352can operate. Operation of Stacked Patches Including Multi-Piece Parasitic Patch Referring toFIG.12, with further reference toFIGS.1-11, a method380of operating an antenna system includes the stages shown. The method380is, however, an example only and not limiting. The method380may be altered, e.g., by having stages added, removed, rearranged, combined, performed concurrently, and/or having single stages split into multiple stages. Still other alterations to the method380as shown and described may be possible. At stage382, the method380includes operating a first patch antenna element to send or receive first energy having a first frequency. For example, the processor76may cause the IF circuit74to send signals to the antenna system62and/or the antenna system64via the front-end circuit70and/or the front-end circuit72, respectively. The front-end circuit(s)70,72may provide signals to the antenna system(s)62,64, e.g., to the energy coupler(s)81,83, that provide the signals to the antenna element(s)80,82. For example, energy in a lower frequency band may be provided to the patch antenna element152via the energy coupler156(or to multiple instances of the patch antenna element152via respective instances of the energy coupler156in an array such as the array310). Also or alternatively, energy may be received by the patch antenna element152and provided via the energy coupler156(e.g., the energy coupler81or the energy coupler83), the front-end circuit70(or72), and the IF circuit74to the processor76. At stage384, the method380includes operating a second patch antenna element as a parasitic patch to the first patch antenna element. For example, energy may be provided to the patch antenna element154as a parasitic patch due to radiation from the patch antenna element152, and the patch antenna element154may re-radiate some of the energy received by the patch antenna element154from the patch antenna element152. Also or alternatively, the energy may be received by the patch antenna element154and some of the received energy coupled (radiated) to the patch antenna element152from the patch antenna element154. The patch antenna elements152,154(and possibly the energy coupler156) may comprise first means for radiating and/or receiving first energy (e.g., in a lower frequency band). The patch antenna element154may comprise parasitic means, for the first means, for parasitically radiating and/or receiving at least a portion of the first energy. At stage386, the method380includes operating a first portion of the second patch antenna element as a first dipole antenna to send or receive second energy having a second frequency. For example, the processor76may cause the IF circuit74to send signals to the antenna system62and/or the antenna system64via the front-end circuit70and/or the front-end circuit72, respectively. The front-end circuit(s)70,72may provide signals to the antenna system(s)62,64, e.g., to the energy coupler(s)81,83, that provide the signals to the antenna element(s)80,82. For example, energy in a higher frequency band may be provided to the patch antenna element154, and in particular the portions161,164, via the energy coupler158(or to multiple instances of the patch antenna element154, and possibly one or more instances of the antenna system350, via respective instances of the energy coupler158or one or more of the energy couplers356,358in an array such as the array310). Also or alternatively, energy may be received by the patch antenna element154, e.g., the portions161,164, and provided via the energy coupler158(e.g., the energy coupler81or the energy coupler83), the front-end circuit70(or72), and the IF circuit74to the processor76. The portions161,164(and/or other portions such as the portions162,163) of the patch antenna element154(and possibly the energy coupler158) may provide second means for radiating and/or receiving the second energy in a second frequency band using a subset of pieces of the parasitic means. The method380may include one or more other features, such as one or more of the following features. For example, the method380may include operating a second portion of the second patch antenna element as a second dipole antenna to send or receive third energy having the second frequency. In this case, for example, the portions162,163, along with a corresponding energy coupler, may also be used to radiate and/or receive energy of the second frequency, e.g., in the second frequency band. Third means for radiating and/or receiving third energy may comprise the portions162,163and the corresponding energy coupler, with the third energy having the second frequency (e.g., having a frequency in the second frequency band). Operating the first dipole antenna and operating the second dipole antenna may comprise radiating (and/or receiving) the second energy and the third energy from the first dipole antenna and the second dipole antenna, respectively, with orthogonal polarizations. For example, two sets of energy couplers (e.g., including the energy coupler158) may be used to excite the portions161,164(disposed in diagonally opposite quadrants) in one polarization and the portions162,163(disposed in the other diagonally opposite quadrants) in another, orthogonal polarization. Operating the first and second dipoles may comprise differentially feeding the first and second dipoles relative to each other. For example, the conductors202,204feeding the portions161,164may be fed differentially (e.g., 180° out of phase) with respect to conductors feeding the portions162,163. Differentially feeding the first and second dipoles may comprise feeding the dipoles through an opening defined in the first patch antenna element with respective pairs of conductive lines. For example, the conductors202,204feeding the portions161,164and the conductors feeding the portions162,163may pass through the opening190in the first patch antenna152. The second frequency (of signals sent and/or received by the first portion of the second patch antenna) may be about twice the first frequency (of signals sent and/or received by the first patch antenna and the second patch antenna). Other Configurations The examples discussed above are non-exhaustive examples and numerous other configurations may be used. The discussion below is directed to some of such other configurations, but is not exhaustive (by itself or when combined with the discussion above). Example Antenna System—Stacked Patches Including Parasitic Patch with Slot(s)/Dipole(s) Referring toFIG.13, with further reference toFIG.3, an antenna system400is an example of the antenna system62(or the antenna system64). The antenna system400may have several similarities to the antenna system100shown inFIG.4, but also has significant differences. Also, similar to withFIG.4, other possible features of the antenna system400(e.g., a substrate, a ground plane) are not shown inFIG.13. The antenna system400is a stacked-patch antenna system including patch antenna elements402,404, and energy couplers406,408. The antenna system400may be configured to operate over multiple frequency bands, with broadband operation in each band. For example, the antenna system400may operate in frequency bands where frequencies in a first band (a higher frequency band) are about twice frequencies in a second band (a lower frequency band). That is, frequencies in the second band are about half frequencies in the first band, such as a 28 GHz band (e.g., from 28 GHz to 44 GHz) and a 60 GHz band (e.g., from 57.5 GHz to 67.5 GHz). Sub-systems of the system400for operation in different bands are co-located, e.g., being disposed at the same location, and in examples discussed herein, the sub-systems share one or more components. For example, the patch antenna element404(or one or more portions thereof) may be shared between sub-systems for operation at the different frequency bands. The patch antenna element404may be configured to provide additional bandwidth for the patch antenna element402(e.g., for 5G operation). The patch antenna element404may be configured to provide antenna operation in a different frequency band, e.g., a 60 GHz band. For example, the patch antenna element404may provide one or more slots412,414for operation in the different frequency band. Optionally, one or more dipoles416,418may overlap, or even be disposed in, the one or more slots412,414, respectively, defined by the patch antenna element404for operation in the different frequency band. The one or more dipoles416,418may act as one or more portions of the patch antenna element404for operation of the frequency band of the patch antenna element402. For example, the patch antenna elements402,404(including the one or more dipoles416,418, if present), in conjunction with the energy coupler406, may operate as a patch and a parasitic patch in a first frequency band, e.g., the 28 GHz band. The one or more slots412,414and/or the one or more dipoles416,418(if present), in conjunction with the energy coupler408, may operate in another frequency band, e.g., the 60 GHz frequency band. The patch antenna element404is a parasitic patch, being configured to radiate due to energy reactively coupled from another (patch) radiator, and not being electrically connected to, or disposed to be a primary recipient of energy from, an energy coupler (here the energy coupler406) that is configured to provide energy of a frequency for which the element is a parasitic element. The patch antenna element402and the energy coupler406may be configured similarly to the patch antenna element and the energy coupler106shown inFIG.4and discussed above. For example, the energy coupler406may include the energy coupler156and, optionally, another instance of the energy coupler156, shown inFIGS.5-7and discussed above. The patch antenna element402may be electrically conductive, and sized and shaped for operation over a desired frequency band. For example, the patch antenna element402may radiate more than half of the energy provided to the patch antenna element402in the desired frequency band, or may have a resonance in the desired frequency band, etc. In this example shown, the patch antenna element402is substantially square with sides each of about half of a wavelength (e.g., 40%-60% of the wavelength) of a signal having a frequency in the desired frequency band (e.g., a lower frequency band such as 27.5 GHz to 44 GHz) and traveling in a substrate of the antenna system400. The patch antenna element404is sized, shaped, and disposed relative to the patch antenna element402to serve as a parasitic patch element for the patch antenna element402. The patch antenna elements402,404may be separated by about 90° in electrical length. The patch antenna element404may be shaped (here substantially as a square) similarly to the patch antenna element402. The patch antenna element404may have sides that are longer (e.g., between 5% and 20% longer) than the sides of the patch antenna element402. The patch antenna element404may have a resonant frequency different from a resonant frequency of the patch antenna element402, which may help increase an overall bandwidth of the combination of the elements402,404. For example, the resonant frequency of the patch antenna element402may be greater than three times the resonant frequency of the patch antenna element404. As a parasitic patch element, the patch antenna element404may improve the bandwidth of the patch antenna element402similar to the discussion above with respect to the patch antenna element104. Also similar to the discussion above with respect to the patch antenna element104, the patch antenna element404may be configured, disposed, and coupled (e.g., reactively coupled and not directly electrically coupled) relative to the patch antenna element402similar to the patch antenna element104relative to the patch antenna element102. The energy couplers406,408are configured and disposed to provide energy to and/or receive energy from the patch antenna element402and the one or more slots412,414or the one or more dipoles416,418. The energy coupler406may directly or indirectly provide energy to and/or receive energy from the patch antenna element402, e.g., as discussed above with respect to the energy coupler106and the patch antenna element102. The energy coupler408may indirectly provide energy to and/or receive energy from the one or more slots412,414as discussed further below. Alternatively, the energy coupler408may couple energy to and/or receive energy from the one or more dipoles416,418as discussed further below, e.g., being directly electrically connected to the one or more dipoles416,418. The one or more slots412,414or the one or more dipoles416,418may be configured to operate at a higher frequency band than a frequency band at which the patch antenna elements402,404are configured to operate. For example, the one or more slots412,414may have lengths of about half of a wavelength in a substrate of the antenna system400corresponding to the higher frequency band (e.g., the 60 GHz band) while the patch antenna elements402,404are configured to operate at the lower frequency band (e.g., the 28 GHz band). For example, lengths of the slots412,414may be about half of lengths403of sides of the patch antenna element402. Similarly, lengths of the dipoles416,418may be about half of the lengths403of sides of the patch antenna element402, in which case the slots in which the dipoles416,418reside or overlap may be longer than the dipoles416,418. The slots412,414may be bigger if the dipoles416,418are present than if the dipoles416,418are not present (and thus the slots412,414themselves are used for radiating and/or receiving energy). The antenna system400(including examples discussed below) may be used as a component of an antenna array. For example, the antenna system400may be substituted for one or more of the cells312shown inFIG.10. The cells314may be configured as discussed above, or may be of a different configuration, e.g., of just the patch antenna element404of the system400with one or more of the slots412,414or with one or more of the slots412,414and one or more of the dipoles416,418, or with just a patch or dipole configured to radiate at the higher frequency. Examples of Stacked Patches Including Parasitic Patch with Slot(s) Referring toFIG.14, with further reference toFIG.13, an antenna system450is an example of the antenna system400shown inFIG.13. The antenna system450is a multi-band antenna system that may be configured to operate over a lower frequency band and a higher frequency band. The antenna system450may include patch antenna elements452,454, energy couplers456,457,458, a ground plane460, and a substrate462. The substrate462may be a portion (e.g., a layer) of a larger substrate of the antenna system450, similar to the substrate170shown inFIG.7. Other layers may be used, e.g., a layer between the patch antenna element452and coupling strips (discussed below), and a layer between the coupling strips and the patch antenna element454, with different layers potentially comprising different materials and/or having different dielectric constants. The patch antenna elements452,454are configured to operate in tandem as an active patch antenna element and a parasitic patch antenna element, respectively. The patch antenna element454is a multi-purpose element configured to serve at least dual purposes, to operate as both the parasitic patch antenna element for the patch antenna element452and to provide one or more slots for operation in a different frequency band than the patch antenna element452. The patch antenna element454may be parasitically coupled to the patch antenna element452for operation in one mode (e.g., stacked patch antenna in the lower frequency band) and have slots472,474coupled to the energy couplers457,458for operation in another mode (e.g., for the higher frequency band). For the sake of simplicity of the figure, a substrate that separates the patch antenna element452from the patch antenna element452is not shown inFIG.14. A bandwidth of the stacked patch antenna elements452,454may be affected by various characteristics of the antenna system450, e.g., one or more dielectric constants of one or more layers of a substrate of the antenna system450, thickness of each layer of substrate, thickness of each of the patch antenna elements452,454, etc. A thickness of the antenna system450, e.g., from the patch antenna element452to the ground plane460may be about a quarter of a wavelength in the substrate (which may be a combination of different substrate layers) at a desired frequency, e.g., a frequency in the higher frequency band such as 60 GHz. While the patch antenna element454defines the two slots472,474as shown, the patch antenna element454may define another quantity of slots, e.g., one slot (e.g., for single polarization operation). In another embodiments, several slots that are approximately parallel may be formed in the patch antenna element454. The patch antenna elements452,454, in conjunction with the ground plane460and the energy coupler456, may comprise a stacked-patch antenna. The patch antenna element452is an active patch in that the energy coupler456is configured to convey (provide) energy to and/or receive energy from the patch antenna element452either by direct connection (e.g., physical conductive connection) or indirect connection (e.g., reactive coupling). Here, the energy coupler456includes a conductor480that is directly conductively connected to the patch antenna element452. The patch antenna element452comprises a planar conductor disposed on the substrate462and configured to radiate and receive energy, possibly in orthogonal polarizations, e.g., if another energy coupler456is connected to the patch antenna element452. In this example, the patch antenna element452is rectangular, here substantially square, with side lengths453about one-half of a wavelength (e.g., 40%-60% of the wavelength), in the substrate462, of signals in the lower frequency band, e.g., from 27.5 GHz to 44 GHz. For example, the side lengths453may be about one-half of a wavelength (e.g., 40%-60% of the wavelength), in the substrate462, of a signal having a frequency of about 35 GHz (e.g., between 34.5 GHz and 35.5 GHz). While not shown in this example, the energy coupler456may include a tuning stub similar to the tuning stub182included in the energy coupler156discussed above. The conductor480may be coupled to front-end circuitry (e.g., the front-end circuit70) via a connection layer (not shown), e.g., similar to the connection layer196shown inFIGS.5and7. The conductor480may comprise plated through vias through the substrate462. The patch antenna element454defines the slots472,474for operation in the higher frequency band. The slots472,474are centered about a center of the patch antenna element454(that is rectangular, here substantially square), and are cross slots, being disposed substantially perpendicularly (orthogonally) relative to each other, with each slot being substantially orthogonal to, and intersecting, the other slot at a midpoint of each of the slots. The slots472,474may be configured, as here, for orthogonal polarization operation (e.g., for circular polarization). The slots472,474may be formed, e.g., by etching of the patch antenna element454, that may be a metal (e.g., copper) layer on the substrate of the antenna system450. The slots472,474are sized and shaped for operation (e.g., radiating and/or receiving) energy in the higher frequency band. For example, the slots472,474may have lengths484that are similar to each other and that are about one-half (e.g., 45%-55%) of a wavelength at a frequency in the higher frequency band in the substrate of the antenna system450(e.g., about half a wavelength at 60 GHz in the substrate). For example, each of the lengths484may be about half (e.g., 45%-55%) of the lengths453of the sides of the patch antenna element452(i.e., the length453may be about twice (190%-210%) of the length484of the slots472,474). In other embodiments, the lengths of the slots472,474may differ from each other such that one slot is configured to radiate at a first higher frequency and the other slot is configured to radiate at a second higher frequency. The energy couplers457,458(which may be an example of the energy coupler408inFIG.13) may be configured and disposed to couple energy to and/or from (e.g., convey to and/or receive from) the slots472,474. The energy couplers457,458include conductors490,491and conductive coupling lines492,493, respectively. The coupling lines492,493are disposed between the patch antenna element452and the patch antenna element454. The coupling lines492,493may be conductive strips such as microstrips, and may be disposed to overlap the slots472,474partially, e.g., being transverse to the slots472,474at a sufficient angle and near enough to electromagnetically couple energy to and/or from the slots472,474. Here, the coupling lines492,493are disposed substantially perpendicularly (e.g., 85°-95° relative) to the slots472,474, respectively. For example, the coupling line492may be formed so as to be approximately parallel to the slot474and positioned such that it crosses the slot472at approximately the location which the numeral472is pointing to inFIG.14, and the coupling line493may be formed so as to be approximately parallel to the slot472and positioned such that it crosses the slot474at approximately the location which the numeral474is pointing to inFIG.14The conductors490,491may comprise plated through vias through the substrate (not shown) between the coupling lines492,493and the patch antenna element452, and in the substrate462. The conductors490,491may pass through the patch antenna element452along a null plane for electric field of the patch antenna element452. The conductors490,491may pass through an opening (not shown) defined by the patch antenna element452(e.g., similar to the opening190defined by the patch antenna element152shown inFIG.5). The conductors490,491may be separated from the patch antenna element452, e.g., by an insulator such as some of the substrate of the antenna system450, or by shielding disposed about the conductors490,491, or other means. Examples of Stacked Patches Including Parasitic Patch with Dipole(s) in Slot(s) Referring toFIG.15, with further reference toFIGS.13and14, an antenna system510is an example of the antenna system400shown inFIG.13. The antenna system510is a multi-band antenna system that may be configured to operate over a lower frequency band and a higher frequency band. The antenna system510may include patch antenna elements512,514, energy couplers516,518, a ground plane520, and a substrate522. As withFIG.14, a substrate between the patch antenna element512and the patch antenna element514is not shown in order to simplify the figure. The substrate may be configured such that the patch antenna element514may be separated from the ground plane520by about a quarter of a wavelength in the substrate at a frequency of the higher frequency band (e.g., about 60 GHz). A length513of each side of the patch antenna element512may be about a half of a wavelength in the substrate at a frequency in the lower frequency band (e.g., about 28 GHz in some embodiments, about 35 GHz in some embodiments, or at other frequencies in other embodiments). Further, as withFIG.14, connections from the energy couplers516,518(e.g., for connection to front-end circuitry) are not shown in order to simplify the figure. The antenna system510is similar to the antenna system450shown inFIG.14, but with dipoles530,532disposed in slots534,536defined by the patch antenna element514. Thus, the dipoles530,532may be surrounded by the patch antenna element514. The patch antenna elements512,514, in conjunction with the ground plane520and the energy coupler516, may comprise a stacked-patch antenna. The patch antenna element512may be an active patch and the patch antenna element514may be a parasitic patch. The slots534,536may be larger (e.g., longer and possibly wider) than the slots472,474of the antenna system450in order to work with (e.g., receive) the dipoles530,532. Lengths of the dipoles530,532may each be about a half of a wavelength at a frequency in the higher frequency band in the substrate of the antenna system510. The length513of a side of the patch antenna element512may thus be about twice (e.g., 190%-210%) the length of each of the dipoles530,532. The dipoles530,532at least partially overlap the slots534,536and may be disposed in (received by) the slots534,536. The slots534,536may be larger than the dipoles530,532, e.g., to receive the dipoles530,532with the dipoles530,532being displaced from walls of the slots534,536. For example, widths of the slots534,536may be about three times widths of arms of the dipoles530,532, e.g., to inhibit coupling between the dipoles530,532and the patch antenna element514. The dipole530includes dipole arms551,552and the dipole532includes dipole arms553,554. The dipole arms551-554may be conductive strips, and may be formed in a same layer of a substrate (and thus in a same plane) as the patch antenna element514. While the antenna system510is shown with the patch antenna element514defining the two slots534,536and including the two dipoles530,532, other quantities of slots and dipoles may be used, e.g., one slot and one dipole. Further, while the dipoles530,532are described herein as being disposed in the slots534,536, the dipoles530,532may be displaced from a plane of the patch antenna element514in some embodiments. The energy coupler516may be similar to the energy coupler456and is configured to convey energy to and/or receive energy from the patch antenna element512. The energy coupler516may further include a tuning stub (not shown). Further, the antenna system510may include more than one energy coupler516, e.g., to operate the patch antenna element512with orthogonal polarizations. The energy coupler518(which may be an example of the energy coupler408inFIG.13) may be configured and disposed to couple energy to and/or from the dipoles530,532. The energy coupler518includes conductors541,542,543,544, with the conductors541,542connected to the dipole arms551,552of the dipole530, and the conductors543,544connected to the dipole arms553,554of the dipole532, with these connections indicated by dashed lines inFIG.15to help simplify the figure. Other quantities of conductors may be used in the energy coupler518, e.g., two conductors if only one dipole is included in the antenna system510. The conductors541-544may be plated through vias through the substrate (layers) to connection circuitry (not shown), such as balanced microstrip lines, for connection to further components, e.g., front-end circuitry. The conductors541-544may pass through the patch antenna element512near null planes of the electric field of the patch antenna element512, e.g., to inhibit distortion of the electric field of the patch antenna element512due to the presence of the conductors541-544. The conductors541-544may pass through an opening (not shown) defined by the patch antenna element512(e.g., similar to the opening190defined by the patch antenna element152shown inFIG.5). Operation of Stacked Patches Including Parasitic Patch with Slot(s)/Dipole(s) Referring toFIG.16, with further reference toFIGS.3,10, and13-15, a method580of operating an antenna system includes the stages shown. The method580is, however, an example only and not limiting. The method580may be altered, e.g., by having stages added, removed, rearranged, combined, performed concurrently, and/or having single stages split into multiple stages. Still other alterations to the method580as shown and described may be possible. At stage582, the method580includes operating a first patch antenna element to send or receive first energy having a first frequency. For example, the processor76may cause the IF circuit74to send signals to the antenna system62and/or the antenna system64via the front-end circuit70and/or the front-end circuit72, respectively. The front-end circuit(s)70,72may provide signals to the antenna system(s)62,64, e.g., to the energy coupler(s)81,83, that provide the signals to the antenna element(s)80,82. For example, energy in a lower frequency band may be provided to the patch antenna element452,512via the energy coupler456,516, respectively (or to multiple instances of the patch antenna element452,512via respective instances of the energy coupler456,516in an array such as the array310). Also or alternatively, energy may be received by the patch antenna element452,512and provided via the energy coupler456,516(e.g., the energy coupler81or the energy coupler83), the front-end circuit70(or72), and the IF circuit74to the processor76. At stage584, the method580includes operating a second patch antenna element as a parasitic patch to the first patch antenna element. For example, energy may be provided to the patch antenna element454,514as a parasitic patch due to radiation from the patch antenna element452,512, and the patch antenna element454,514may re-radiate some of the energy received by the patch antenna element454,514from the patch antenna element452,512. Also or alternatively, the energy may be received by the patch antenna element454,514and some of the received energy coupled (re-radiated) to the patch antenna element452,512from the patch antenna element454,514. The patch antenna elements452,454or512,514may comprise first means for radiating and/or receiving first energy (e.g., in a lower frequency band). The patch antenna element454may comprise parasitic means, for the first means, for parasitically radiating and/or receiving at least a portion of the first energy. At stage586, the method580includes operating either a first dipole disposed in a first slot defined by the second patch antenna element to send or receive second energy having a second frequency, or the first slot to send or receive the second energy having the second frequency. For example, the processor76may cause the IF circuit74to send signals to the antenna system62and/or the antenna system64via the front-end circuit70and/or the front-end circuit72, respectively. The front-end circuit(s)70,72may provide signals to the antenna system(s)62,64, e.g., to the energy coupler(s)81,83, that provide the signals to the antenna element(s)80,82. For example, energy in a higher frequency band may be provided to the patch antenna element454, and in particular the slot472, via the energy coupler457, e.g., the conductor490and the coupling strip492. Energy in the higher frequency band may be provided to multiple slots, e.g., the slots472,474via the energy couplers457,458. Also or alternatively, energy may be provided to multiple instances of the patch antenna element454, and possibly one or more instances of the antenna system450, via respective instances of the energy coupler457, or one or more of the energy couplers457,458(or other configuration of the antenna system450) in an array such as the array310. Also or alternatively, energy may be received by the patch antenna element454, e.g., one or both of the slots472,474, and provided via the energy coupler(s)457,458(e.g., the energy coupler81or the energy coupler83), the front-end circuit70(or72), and the IF circuit74to the processor76. The slot472(and/or the slot474) of the patch antenna element454may provide at least part of second means for radiating and/or receiving the second energy in a second frequency band using a subset of pieces of the parasitic means. The energy coupler(s)457,458may provide one or more further portions of the second means for radiating and/or receiving the second energy. As another example of stage586, energy in the higher frequency band may be provided to the dipole530, via the energy coupler518, e.g., the conductors541,542. Energy in the higher frequency band may be provided to multiple dipoles, e.g., the dipoles530,532via the energy coupler518(using the conductors541-544). Also or alternatively, energy may be provided to one or more instances of the antenna system510, via respective instances of the energy coupler518, or two or more of the conductors541-544(or other configuration of the antenna system510) in an array such as the array310. Also or alternatively, energy may be received by one or both of the dipoles530,532, and provided via the energy coupler518(e.g., the energy coupler81or the energy coupler83), the front-end circuit70(or72), and the IF circuit74to the processor76. The dipole530(and/or the dipole532) of the patch antenna element514may provide at least part of second means for radiating and/or receiving the second energy in a second frequency band, and one or more of the dipole arms551-554may provide conducting means. The energy coupler518may provide one or more further portions of the second means for radiating and/or receiving the second energy. The method580may include one or more other features, such as one or more of the following features. For example, the method580may include operating multiple slots or multiple dipoles for orthogonal polarization of the higher frequency band energy. The second frequency may be about twice the first frequency. Still other features may be implemented. As described, operation of a stacked patch antenna and a dipole may enable use of an aperture for communications at multiple frequencies. Further, the aperture may be utilized for communications of orthogonal polarizations at each of the multiple frequencies. Other Considerations The techniques and discussed above are examples, and not exhaustive. Configurations other than those discussed may be used. As used herein, “or” as used in a list of items prefaced by “at least one of” or prefaced by “one or more of” indicates a disjunctive list such that, for example, a list of “at least one of A, B, or C,” or a list of “one or more of A, B, or C” means A or B or C or AB or AC or BC or ABC (i.e., A and B and C), or combinations with more than one feature (e.g., AA, AAB, ABBC, etc.). The systems and devices discussed above are examples. Various configurations may omit, substitute, or add various procedures or components as appropriate. For instance, features described with respect to certain configurations may be combined in various other configurations. Different aspects and elements of the configurations may be combined in a similar manner. Also, technology evolves and, thus, many of the elements are examples and do not limit the scope of the disclosure or claims. Specific details are given in the description to provide a thorough understanding of example configurations (including implementations). However, configurations may be practiced without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail in order to avoid obscuring the configurations. This description provides example configurations only, and does not limit the scope, applicability, or configurations of the claims. Rather, the preceding description of the configurations provides a description for implementing described techniques. Various changes may be made in the function and arrangement of elements without departing from the scope of the disclosure. | 90,889 |
11862858 | DESCRIPTION OF EMBODIMENTS Embodiments according to the present disclosure will be described in detail on the basis of the drawings. The present invention is not limited to the particular embodiments described herein. Constituent elements in the following embodiments include elements that can be replaced by the skilled person and obvious ones, or substantially the same ones. The constituent elements described hereinafter may be properly used in combination and, when a plurality of embodiments exist, some of the embodiments may be combined. First Embodiment A polarization direction measuring device1and a polarization direction measuring method according to a first embodiment serve as a device and a method for measuring a polarization direction of a received wave serving as a linearly polarized wave and received at circularly polarized antennas5. The received wave is a radio wave and, for example, a beam of a detection radar. The measuring device1is provided in, for example, a transport machine, such as an airplane, a vehicle, and a ship. The received wave in a predetermined arrival direction is received at the circularly polarized antennas5, and the arrival direction of the received wave is determined by an angle (AZ angle) in an azimuth direction (hereinafter referred to as “AZ direction”) and an angle (EL angle) in an elevation direction (hereinafter referred to as “EL direction”). FIG.1is a schematic block diagram illustrating part of a polarization direction measuring device according to a first embodiment.FIG.2is a cross-sectional view taken along line A-A inFIG.1.FIG.3is a cross-sectional view taken along line B-B inFIG.1.FIG.4is an explanatory drawing relating to the polarization direction measuring device and the polarization direction measuring method according to the first embodiment.FIG.5is a diagram illustrating a first intensity ratio table relating to a vertically polarized component of the received wave.FIG.6is a diagram illustrating a second intensity ratio table relating to a horizontally polarized component of the received wave.FIG.7is an explanatory drawing relating to a polarization direction of the received wave.FIG.8is a schematic block diagram of a device used for a method for acquiring intensity ratio tables. Polarization Direction Measuring Device As illustrated inFIG.1toFIG.3, the measuring device1includes a plurality of circularly polarized antennas5and a radome6. The circularly polarized antennas5have one-dimensional arrangement in which a plurality of circularly polarized antennas5are arranged in a straight line along the AZ direction (x direction inFIG.1) and one circularly polarized antenna5is provided in the EL direction (z direction inFIG.1toFIG.3). The first embodiment adopts one-dimensional arrangement to suppress the height in the EL direction, but arrangement is not particularly limited thereto. The number of circularly polarized antennas5is two or more. The first embodiment illustrates the structure using two circularly polarized antennas5. The circularly polarized antennas5are arranged at a predetermined interval in the AZ direction. The radome6is provided on, for example, a wing of an airplane. The radome6functions as an intensity ratio providing unit providing different intensity ratios to the signal intensity ratio between the circularly polarized antennas5according to the arrival direction of a received wave. The wing length direction of the wing of the airplane serves as the AZ direction. Specifically, the radome6has a non-uniform shape in a three-dimensional space including the AZ direction and the EL direction. As illustrated inFIG.2, in a cross-sectional shape of the radome6cut in a position on a wing root side (left side inFIG.1) in the AZ direction, the inner space is broad in the EL direction. By contrast, as illustrated inFIG.3, in a cross-sectional shape of the radome6cut in a position on a wing tip side (right side inFIG.1) in the AZ direction, the inner space is narrow in the EL direction. For this reason, the radome6causes the incident angle of the received wave on an incident surface of the radome6on which the received wave is made incident to differ in a three-dimensional manner. In addition, also in the cross sections illustrated inFIG.2andFIG.3, the thickness of the radome6is not fixed, but is different in the EL direction. When the incident angle of the linearly polarized received wave differs on the incident surface of the radome6, the incident angle characteristic of the transmittance of the received wave transmitted through the radome6differs between a vertically polarized component and a horizontally polarized component of the received wave. For this reason, by varying the incident angle of the received wave made incident on the circularly polarized antennas5, it is possible to vary the intensity ratio of the signal intensity of the received wave to be received at one circularly polarized antenna5to a signal intensity of the received wave to be received at the other circularly polarized antenna5. The radome6has a layered structure, and may be provided with different intensity ratios according to the arrival direction of the received wave by varying the shape, varying the layered structure, or varying both the shape and the layered structure. In addition, as illustrated inFIG.4, the measuring device1includes a detector10, a storage unit11, an acquiring unit12, and an arithmetic unit13. The detector10is connected to the two circularly polarized antennas5, and detects an intensity ratio of signal intensities of the two circularly polarized antennas5. In the first embodiment, “antenna1” and “antenna2” are applied as the two circularly polarized antennas5. Specifically, in the first embodiment, the detector10detects an intensity ratio of “antenna1” to “antenna2” as an intensity ratio of the two circularly polarized antennas5. Although the detector10detects an intensity ratio, it suffices that the detector10detects at least the intensity ratio, and the detector10may detect the frequency, if necessary. The storage unit11stores therein a first intensity ratio table T1illustrated inFIG.5and a second intensity ratio table T2illustrated inFIG.6. The first intensity ratio table T1is data associating an intensity ratio (TV) of a vertically polarized component of the received wave between the two circularly polarized antennas5with the arrival direction of the received wave. InFIG.5, the horizontal axis indicates the AZ angle, and the vertical axis indicates the EL angle. In addition, the first intensity ratio table T1is formed of a plurality of cells each associated with the AZ angle and the EL angle. Each of the cells is associated with an intensity ratio. For this reason, the AZ angle and the EL angle are associated with the cell to which the intensity ratio is associated. The first intensity ratio table T1is prepared at least for each of frequencies. In the first embodiment, the first intensity ratio table T1for the “antenna1” and the “antenna2” is prepared as the first intensity ratio table T1. The second intensity ratio table T2is data associating an intensity ratio (TH) of a horizontally polarized component of the received wave between the two circularly polarized antennas5with the arrival direction of the received wave. InFIG.6, the horizontal axis indicates the AZ angle, and the vertical axis indicates the EL angle, in the same manner asFIG.5. The second intensity ratio table T2is a table acquired by replacing the vertically polarized component of the first intensity ratio table T1with the horizontally polarized component, and substantially the same as the first intensity ratio table T1. For this reason, an explanation of the second intensity ratio table T2will be omitted. In addition, although illustration thereof is omitted, the storage unit11stores therein a program to measure the polarization direction of the received wave using the measuring device1. The first intensity ratio table T1and the second intensity ratio table T2include mathematical expressions based on the first intensity ratio table T1and the second intensity ratio table T2, as well as the first intensity ratio table T1illustrated inFIG.5and the second intensity ratio table T2illustrated inFIG.6. The acquiring unit12acquires the arrival direction of the received wave. Specifically, the acquiring unit12is a direction detection unit that detects the arrival direction of the received wave on the basis of the received wave to be received at a plurality of antennas15. The acquiring unit12calculates the arrival direction of the received wave from a predetermined calculation expression, on the basis of a phase difference ΔΘ and a wavelength λ of the received wave to be received in the antennas15and a distance d between the antennas15. The predetermined calculation expression is an expression of phase difference direction detection generally known, and “Θ=sin−1(Δ·λ/2πd)” or the like is used. The acquiring unit12has a structure in which the antennas15are arranged in a two-dimensional manner, that is, three antennas15are arranged adjacent to each other in the AZ direction and the EL direction, as illustrated inFIG.4, to acquire the arrival direction of the received wave in the three-dimensional direction. The arithmetic unit13calculates a polarization direction of the received wave. Specifically, the arithmetic unit13acquires an intensity ratio (TV) of a vertically polarized component of the received wave from the first intensity ratio table T1, and acquires an intensity ratio (TH) of a horizontally polarized component of the received wave from the second intensity ratio table T2, on the basis of the arrival direction of the received wave acquired with the acquiring unit12. The arithmetic unit13also acquires an intensity ratio (M) of the received wave acquired with the detector10. The arithmetic unit13calculates the polarization direction of the received wave from the predetermined calculation expression on the basis of the intensity ratio (M) of the received wave, the intensity ratio (TV) of the vertically polarized component of the received wave, and the intensity ratio (TH) of the horizontally polarized component of the received wave. The predetermined calculation expression is the following expression (1) to determine the ratio of the horizontally polarized component PH and the following expression (2) to determine the ratio of the vertically polarized component PV. PH=(M−TV)/(TH−TV) (1) PV=1−PH(2) As illustrated inFIG.7, the arithmetic unit13calculates the polarization direction of the received wave from the ratio of the horizontally polarized component determined with the expression (1) and the ratio of the vertically polarized component determined with the expression (2). Method of Acquiring Intensity Ratio Table The following is an explanation of a method for acquiring intensity ratio tables to acquire the first intensity ratio table T1and the second intensity ratio table T2used for the measuring device1, with reference toFIG.8. An acquiring device21illustrated inFIG.8is used for acquiring the first intensity ratio table T1and the second intensity ratio table T2. In the following explanation, the tables are also simply referred to as “intensity ratio tables T1and T2”. The acquiring device21includes a transmitter22, a receiver23, an operating unit24, and a measuring unit25. The transmitter22transmits a radio wave (received wave) serving as a linearly polarized wave having a predetermined polarization direction to the receiver23. The receiver23is equivalent to the circularly polarized antennas5and the radome6of the measuring device1, and acquires the received radio wave as a received wave. The operating unit24moves the receiver23such that the position of the transmitter22as viewed from the receiver23has a predetermined AZ angle and a predetermined EL angle. The measuring unit25sets the transmission frequency and the polarization direction of the transmitter22, acquires the intensity ratio of the received wave to be received in the receiver23, and acquires the AZ angle and the EL angle in the acquisition. In the method for acquiring the intensity ratio tables T1and T2, the acquiring device21executes a step of operating the operating unit24such that the receiver23including the two circularly polarized antennas5is positioned in the arrival direction having the predetermined AZ angle and the predetermined EL angle. Thereafter, in the acquiring method, a step is executed to generate a radio wave having the predetermined frequency and the predetermined polarization direction from the transmitter22serving as the radio wave source. In addition, in the acquiring method, a step is executed to receive the radio wave having the predetermined frequency and the predetermined polarization direction as the received wave with the receiver23. In the acquiring method, when the received wave is received with the receiver23, the measuring unit25measures an intensity ratio of each of the vertically polarized components and the horizontally polarized component of the received wave between the two circularly polarized antennas5. In the acquiring method, a step is executed to associate the AZ angle and the EL angle in the acquisition with the measured intensity ratio of the vertically polarized component of the received wave between the two circularly polarized antennas5, and acquire the information as the first intensity ratio table T1for each of frequencies of the received wave. In addition, in the acquiring method, a step is executed to associate the AZ angle and the EL angle in the acquisition with the measured intensity ratio of the horizontally polarized component of the received wave between the two circularly polarized antennas5, and acquire the information as the second intensity ratio table T2for each of frequencies of the received wave. The intensity ratio tables T1and T2prepared for the respective frequencies of the received wave may be subjected to interpolation to interpolate a difference in intensity between the frequencies. Although each of the cells in the intensity ratio tables T1and T2is associated with the arrival direction formed of the AZ angle and the EL angle, interpolation may be executed to interpolate the AZ angle and the EL angle between the cells. Polarization Direction Measuring Method The following is an explanation of a polarization direction measuring method of measuring the polarization direction of a linearly polarized received wave with the measuring device1, with reference toFIG.4. In the measuring method, first, step S1is executed to receive the received wave with the two circularly polarized antennas5. Thereafter, in the measuring method, step S2is executed with the detector10to detect an intensity ratio between the two circularly polarized antennas5on the basis of the received wave to be received at the two circularly polarized antennas5. In addition, in the measuring method, step S3is executed with the acquiring unit12to acquire the arrival direction of the received wave. In the measuring method, step S4is executed with the arithmetic unit13to acquire the intensity ratio of the vertically polarized component of the received wave from the first intensity ratio table T1stored in the storage unit11and acquire the intensity ratio of the horizontally polarized component of the received wave from the second intensity ratio table T2, on the basis of the acquired arrival direction of the received wave. At step S4, the arithmetic unit13calculates the polarization direction of the received wave, on the basis of the intensity ratio (M) of the received wave, the intensity ratio (TV) of the vertically polarized component of the received wave, and the intensity ratio (TH) of the horizontally polarized component of the received wave, from the predetermined calculation expression. In the measuring method according to the first embodiment, the corresponding first intensity ratio table T1and the second intensity ratio table T2may be used on the basis of the frequency of the received wave. Second Embodiment The following is an explanation of a second embodiment with reference toFIG.9. In the second embodiment, parts different from those of the first embodiment will be explained to avoid overlapping description, and parts serving as the same structural elements as that of the first embodiment will be explained with the same reference numerals.FIG.9is an explanatory drawing of an example relating to a polarization direction measuring device and a polarization direction measuring method according to the second embodiment. In the measuring device1according to the first embodiment, the acquiring unit12acquires the arrival direction of the received wave using the antennas15. In a measuring device40according to the second embodiment, an acquiring unit12acquires the arrival direction of the received wave using a plurality of circularly polarized antennas5. Specifically, in the second embodiment, the circularly polarized antennas5are used to detect the intensity ratio of the received wave and acquire the arrival direction of the received wave. Specifically, the acquiring unit12is a direction detection unit that detects the arrival direction of the received wave on the basis of the received wave to be received at the circularly polarized antennas5. In the same manner as the first embodiment, the acquiring unit12calculates the arrival direction of the received wave from a predetermined calculation expression, on the basis of a phase difference ΔΘ and a wavelength λ of the received wave to be received in the circularly polarized antennas5and a distance d between the antennas5. The acquiring unit12has a structure in which the circularly polarized antennas5are arranged in a two-dimensional manner, that is, three circularly polarized antennas5are arranged adjacent to each other in the AZ direction and the EL direction, in the same manner asFIG.4, to acquire the arrival direction of the received wave in the three-dimensional direction. Third Embodiment The following is an explanation of a third embodiment with reference toFIG.10. In the third embodiment, parts different from those of the first and the second embodiments will be explained to avoid overlapping description, and parts serving as the same structural elements as those of the first and the second embodiments will be explained with the same reference numerals.FIG.10is an explanatory drawing of an example relating to a polarization direction measuring device and a polarization direction measuring method according to the third embodiment. In the third embodiment, a plurality of circularly polarized antennas5are provided to form two or more combinations (pairs) each including two circularly polarized antennas5. Specifically, at least three circularly polarized antennas5are provided to form two different antenna pairs.FIG.10illustrates a predetermined antenna pair as “antenna pair (1)” and the other predetermined antenna pair as “antenna pair (2)”. In the third embodiment, the arithmetic unit13changes a predetermined combination of the circularly polarized antennas5to the other combination of the circularly polarized antennas5on the basis of a prescribed changing condition, and calculates the polarization direction of the received wave. In the third embodiment, for example, the arithmetic unit13changes the antenna pair from the antenna pair (1) to the antenna pair (2). Specifically, in the third embodiment, the changing condition is a condition that the intensity ratio (TV) of the vertically polarized component of the received wave acquired from the first intensity ratio table T1coincides with the intensity ratio (TH) of the horizontally polarized component of the received wave acquired from the second intensity ratio table T2. Specifically, as illustrated in the expression (1) of the first embodiment, in the case where “TV=TH” is satisfied, the polarization direction of the received wave cannot be calculated because the denominator of the right side of the expression (1) is 0. For this reason, in the case of using the changing condition that the intensity ratio (TV) coincides with the intensity ratio (TH), the arithmetic unit13changes the antenna pair from the antenna pair (1) satisfying “TV=TH” to the antenna pair (2) satisfying “TV≠TH”. In this manner, the arithmetic unit13prevents the denominator of the right side of the expression (1) from being set to 0 to calculate the polarization direction of the received wave. Fourth Embodiment The following is an explanation of a fourth embodiment with reference toFIG.11. In the fourth embodiment, parts different from those of the first to the third embodiments will be explained to avoid overlapping description, and parts serving as the same structural elements as those of the first to the third embodiments will be explained with the same reference numerals.FIG.11is an explanatory drawing of an example relating to a polarization direction measuring device and a polarization direction measuring method according to the fourth embodiment. In the fourth embodiment, a plurality of circularly polarized antennas5are provided to form two or more combinations (pairs) each including two circularly polarized antennas5, in the same manner as the third embodiment. In the fourth embodiment, the arithmetic unit13changes a predetermined combination of the circularly polarized antennas5to the other combination of the circularly polarized antennas5on the basis of the prescribed changing condition, and calculates the polarization direction of the received wave. In the fourth embodiment, for example, the arithmetic unit13changes the antenna pair from the antenna pair (1) to the antenna pair (2). Specifically, in the fourth embodiment, the changing condition is a condition that a difference between the intensity ratio (TV) of the vertically polarized component of the received wave acquired from the first intensity ratio table T1and the intensity ratio (TH) of the horizontally polarized component of the received wave acquired from the second intensity ratio table T2is smaller in the predetermined combination of the circularly polarized antennas5than the difference in the other combination of the circularly polarized antennas5. Specifically, when the difference in intensity between TV and TH is small as illustrated inFIG.11, an influence of an error increases and causes a decrease in the accuracy of calculation of the polarization direction of the received wave. For this reason, when the difference in intensity between the intensity ratio (TV) and the intensity ratio (TH) satisfies the changing condition described above, the arithmetic unit13changes the antenna pair from the antenna pair (1) having a small difference in intensity to the antenna pair (2) having a larger difference in intensity than that of the antenna pair (1). This increases the difference in intensity between TV and TH and causes the arithmetic unit13to suppress an influence of an error and secure the accuracy of calculation of the polarization direction of the received wave. In the fourth embodiment, a plurality of polarization directions of the received wave may be calculated from a plurality of antenna pairs, and processing may be executed to average the calculated polarization directions of the received wave. Fifth Embodiment The following is an explanation of a fifth embodiment with reference toFIG.12. In the fifth embodiment, parts different from those of the first to the fourth embodiments will be explained to avoid overlapping description, and parts serving as the same structural elements as those of the first to the fourth embodiments will be explained with the same reference numerals.FIG.12is a cross-sectional view illustrating examples of a shape of a radome of a measuring device according to the fifth embodiment. In the measuring methods according to the first to the fourth embodiments, the radome6provides different intensity ratios according to the arrival direction of the received wave, but the structure may include a region provided with no different intensity ratios or a region in which provision of ratios is insufficient according to the arrival direction of the received wave. For this reason, the fifth embodiment has a structure in which a material to change an electrical characteristic is added to the radome6of the measuring device1, as illustrated inFIG.12. For example, a dielectric or a good conductor, such as metal, may be used as the material to change an electrical characteristic. The following explanation illustrates the embodiment as a structure in which a dielectric31is added. The dielectric31may be any dielectric as long as it can provide different intensity ratios according to the arrival direction of the received wave. For example, each of dielectrics31ato31c,32, and33inFIG.12may be disposed. In a radome6ainFIG.12, a dielectric31ais provided to follow the inside of the radome6a, and the dielectric31aincludes an inner surface being a curved surface. In a radome6binFIG.12, a dielectric31bis provided in a block shape projecting from the inside of the radome6b. In a radome6cinFIG.12, a dielectric31cis provided to follow the inside of the radome6c. The dielectric31cincludes an inner surface opposed to the circularly polarized antenna5and being a flat surface, and surfaces connected to both sides of the flat surface in the EL direction are also flat surfaces. In a radome6dinFIG.12, dielectrics32serving as separate members are attached to the inside of the radome6d. A radome6einFIG.12is provided with a cap-like dielectric33covering the circularly polarized antenna5. Although illustration thereof is omitted, a material to change an electrical characteristic, such as a dielectric31, may be disposed on the outside of the radome6. For example, in the case where the measuring device1is mounted on an airplane, the airframe disposed outside the radome6may be used as the material to change the electrical characteristic. Specifically, the airframe disposed outside the radome6may function as an intensity ratio providing unit providing different intensity ratios according to the arrival direction of the received wave. As another embodiment of the intensity ratio providing unit, the circularly polarized antennas5themselves may be caused to function as an intensity ratio providing unit by setting the gain of the elements of the circularly polarized antennas5to a gain that is spatially non-uniform. The intensity ratio providing unit is capable of generating different intensity ratios according to the arrival direction, because the gain is spatially non-uniform. As another example, the material to change the electrical characteristic according to the fifth embodiment may be applied in the case of providing different phase differences according to the arrival direction of the received wave, when a plurality of circularly polarized antennas5are used to acquire the arrival direction of the received wave as described in the second embodiment. Specifically, different phase differences may be provided according to the arrival direction of the received wave, by adding the material to change the electrical characteristic to the radome6. As another example, even when a plurality of circularly polarized antennas5are used to acquire the arrival direction of the received wave as described in the second embodiment, no different phase differences may be provided according to the arrival direction of the received wave, but only the intensity ratios may be provided. Specifically, whether to apply the fifth embodiment may be selected according to the structure of the acquiring unit12. As another example, only the intensity ratios may be provided, or both intensity ratios and phase differences may be provided, even when the fifth embodiment is applied. In the first to the fifth embodiments, the polarization direction of the received wave is measured using the intensity ratio tables T1and T2formed by acquiring intensity ratios in the respective cells while the AZ angle and the EL angle are changed, but the structure is not limited thereto. For example, the intensity ratio tables T1and T2may be generated by acquiring intensity ratios in the respective cells while the radome6is deformed under load, and the polarization direction of the received wave may be measured using the generated intensity ratio tables T1and T2in consideration of the deformation under the load of the radome6. As described above, the polarization direction measuring devices1and40, the method of acquiring the intensity ratio tables T1and T2, the polarization direction measuring method, and the a computer-readable storage medium described in the embodiments are recognized, for example, as follows. Each of the polarization direction measuring devices1and40according to a first aspect is a polarization direction measuring device1or40for measuring a polarization direction of a linearly polarized received wave with a plurality of circularly polarized antennas5, and including: an intensity ratio providing unit (radome6, dielectric31, a good conductor, an antenna element having a gain that is spatially non-uniform) that provides, to the plurality of circularly polarized antennas5, intensity ratios different depending on an arrival direction for the received wave to be received at the plurality of circularly polarized antennas; a storage unit11that stores a first intensity ratio table T1in which an intensity ratio of a vertically polarized component of the received wave between two of the circularly polarized antennas is associated with the arrival direction of the received wave and a second intensity ratio table T2in which an intensity ratio of a horizontally polarized component of the received wave between the two circularly polarized antennas is associated with the arrival direction of the received wave; a detector10that acquires an intensity ratio of the received wave between two of the circularly polarized antennas5; an acquiring unit that acquires the arrival direction of the received wave; and an arithmetic unit13that acquires an intensity ratio of the vertically polarized component of the received wave from the first intensity ratio table T1based on the acquired arrival direction of the received wave, acquires an intensity ratio of the horizontally polarized component of the received wave from the second intensity ratio table T2based on the acquired arrival direction of the received wave, and calculates the polarization direction of the received wave from a predetermined calculation expression based on the intensity ratio of the received wave acquired by the detector, the intensity ratio of the vertically polarized component of the received wave, and the intensity ratio of the horizontally polarized component of the received wave. This structure enables measurement of the polarization direction of the received wave even when the received wave serving as a linearly polarized wave is received using the circularly polarized antennas5. As a second aspect, the acquiring unit12is a direction detection unit that detects the arrival direction of the received wave based on the received wave to be received at the circularly polarized antennas5. This structure simplifies the structure because the circularly polarized antennas5can be used for detection of the intensity ratio of the received wave and acquisition of the arrival direction of the received wave. As a third aspect, the plurality of circularly polarized antennas5are provided to form two or more combinations each including two of the circularly polarized antennas5, and the arithmetic unit13changes one of the combinations to another combination based on a prescribed changing condition to calculate the polarization direction of the received wave. This structure enables the setting of the combination of the circularly polarized antennas5to a proper combination on the basis of a prescribed changing condition, and the calculation of the polarization direction of the received wave using the proper combination of the circularly polarized antennas5. As a fourth aspect, the changing condition is a condition that the intensity ratio of the vertically polarized component of the received wave acquired from the first intensity ratio table T1coincides with the intensity ratio of the horizontally polarized component of the received wave acquired from the second intensity ratio table T2. This structure enables calculation of the polarization direction of the received wave by setting the combination of the circularly polarized antennas5to a proper combination, even when the calculation of the polarization direction of the received wave is difficult. As a fifth aspect, the changing condition is a condition that a difference between the intensity ratio of the vertically polarized component of the received wave acquired from the first intensity ratio table T1and the intensity ratio of the horizontally polarized component of the received wave acquired from the second intensity ratio table T2is smaller for the one combination than for the other combination. This structure enables suppression of decrease in calculation accuracy by setting the combination of the circularly polarized antennas5to a proper combination, even when the calculation accuracy for the polarization direction of the received wave decreases. As a sixth aspect, the first intensity ratio table T1and the second intensity ratio table T2are stored for each of frequencies of the received wave, the detector10detects a frequency of the received wave, and the arithmetic unit13acquires, based on the frequency detected by the detector, the first intensity ratio table T1and the second intensity ratio table T2corresponding to the frequency, and acquires, from the acquired first intensity ratio table and the acquired second intensity ratio table, the intensity ratio of the vertically polarized component of the received wave and the intensity ratio of the horizontally polarized component of the received wave corresponding to the arrival direction of the received wave acquired by the acquiring unit12. This structure enables the acquisition of the proper intensity ratios corresponding to the frequency, and calculation of the polarization direction of the received wave corresponding to the intensity ratios with accuracy, because the first intensity ratio table T1and the second intensity ratio table T2can be acquired for each of the frequencies. As a seventh aspect, the intensity ratio providing unit includes a radome6that houses the circularly polarized antennas5, and the radome6has a non-uniform shape or a non-uniform structure in three-dimensional space. This structure enables the provision of different intensity ratios according to the arrival direction of the received wave, with the radome6having a non-uniform shape or a non-uniform structure in the three-dimensional space. As an eighth aspect, the intensity ratio providing unit is disposed in a radome6that houses the circularly polarized antennas5, and has a material (dielectric31, a good conductor) that changes an electrical characteristic of the received wave. This structure enables the simple provision of different intensity ratios according to the arrival direction of the received wave, with the material changing the electrical properties and provided in the radome6. As a ninth aspect, the intensity ratio providing unit implemented as elements of the circularly polarized antennas5having gains which are spatially non-uniform. This structure easily causes each of the circularly polarized antennas5themselves to function as the intensity ratio providing unit by setting the gain of the element of each of the circularly polarized antennas5to a gain that is spatially non-uniform. Specifically, this structure enables easy acquisition of differences in intensity different according to the arrival direction of the received wave by setting the gains of the elements of the circularly polarized antennas5to gains different between the elements. As a tenth aspect, the arrival direction of the received wave is defined by an AZ angle, which is an angle in an azimuth direction, and an EL angle, which is an angle in an elevation direction orthogonal to the azimuth direction, and each of the first intensity ratio table T1and the second intensity ratio table T2has a plurality of cells each identified by an AZ angle and an EL angle, an intensity ratio is set in each cell, and intensity ratios are interpolated between the cells. This structure enables proper interpolation of the intensity ratios between the cells, and acquisition of the intensity ratio corresponding to the arrival direction of the received wave with accuracy. As an eleventh aspect, when the first intensity ratio table T1and the second intensity ratio table T2are prepared for each frequency of the received wave, intensity ratios are interpolated between the frequencies in each of the first intensity ratio table T1and the second intensity ratio table T2. This structure enables proper interpolation of the intensity ratios between the frequencies, acquisition of the intensity ratio between the frequencies with accuracy, and proper acquisition of the intensity ratio corresponding to the arrival direction of the received wave. A method of acquiring intensity ratio tables T1and T2according to a twelfth aspect is a method of acquiring intensity ratio tables T1and T2used in the polarization direction measuring device1or40described above, the method comprising: setting up a radio wave source for generating the received wave so that the received wave is in a predetermined arrival direction and has a predetermined polarization with respect to the plurality of circularly polarized antennas; causing the radio wave source to generate the received wave; receiving the received wave with the plurality of circularly polarized antennas; and acquiring the first intensity ratio table T1in which an intensity ratio of a vertically polarized component of the received wave between two of the circularly polarized antennas5is associated with an arrival direction of the received wave, and the second intensity ratio table T2in which an intensity ratio of a horizontally polarized component of the received wave between the two circularly polarized antennas5is associated with an arrival direction of the received wave. This structure enables the acquisition of the intensity ratio tables T1and T2properly associating the intensity ratio with the arrival direction of the received wave. A polarization direction measuring method according to a thirteenth aspect is a polarization direction measuring method of measuring a polarization direction of a received wave with the polarization direction measuring device1or40described above, the polarization direction method comprising: step S1of receiving the received wave with the plurality of circularly polarized antennas5; step S2of detecting, by the detector10, an intensity ratio between two of the circularly polarized antennas of the received wave to be received at the plurality of circularly polarized antennas5; step S3of acquiring, by the acquiring unit12, an arrival direction of the received wave; and step S4of acquiring, by the arithmetic unit13, an intensity ratio of a vertically polarized component of the received wave from the first intensity ratio table T1stored in the storage unit11based on the acquired arrival direction of the received wave, acquiring, by the arithmetic unit12, an intensity ratio of a horizontally polarized component of the received wave from the second intensity ratio table T2stored in the storage unit11based on the acquired arrival direction of the received wave, and calculating, by the arithmetic unit13, the polarization direction of the received wave from the predetermined calculation expression based on the intensity ratio of the received wave acquired by the detector10, the intensity ratio of the vertically polarized component of the received wave, and the intensity ratio of the horizontally polarized component of the received wave. This structure enables measurement of the polarization direction of the received wave, even when the received wave serving as a linearly polarized wave is received using the circularly polarized antennas5. Each of the measuring device1and40for a polarization direction described above may include a computer including at least a processor and a memory; the polarization direction measuring program may be stored on a computer-readable storage medium, such as a magnetic disk, an optical disc, or a semiconductor memory, to be executed by the computer. A non-transitory computer-readable storage medium according to a fourteenth aspect stores a polarization direction measuring program for measuring a polarization direction of a received wave, the polarization direction measuring program, when executed by a computer of the polarization direction measuring device1or40described above, causing the polarization direction measuring device to: receive the received wave with the plurality of circularly polarized antennas; detect an intensity ratio between two of the circularly polarized antennas5of the received wave to be received at the plurality of circularly polarized antennas5; acquire an arrival direction of the received wave; acquire an intensity ratio of a vertically polarized component of the received wave from the first intensity ratio table T1stored in the storage unit11based on the acquired arrival direction of the received wave; acquire an intensity ratio of a horizontally polarized component of the received wave from the second intensity ratio table T2stored in the storage unit11based on the acquired arrival direction of the received wave; and calculate the polarization direction of the received wave from the predetermined calculation expression based on the intensity ratio of the received wave acquired by the detector10, the intensity ratio of the vertically polarized component of the received wave, and the intensity ratio of the horizontally polarized component of the received wave. This structure enables measurement of the polarization direction of the received wave even when a received wave serving as a linearly polarized wave is received using the circularly polarized antennas5. REFERENCE SIGNS LIST 1,40Measuring device5Circularly polarized antenna6Radome10Detector11Storage unit12Acquiring unit13Arithmetic unit15Antenna21Acquiring device22Transmitter23Receiver24Operating unit25Measuring unit31ato31c,32,33DielectricT1First intensity ratio tableT2Second intensity ratio table | 42,830 |
11862859 | DESCRIPTION OF EMBODIMENTS A description will hereinafter be made with reference to the drawings about examples of embodiments in which the present invention is applied to an antenna device that is usable in a wide frequency band from 698 MHz and frequencies before and after 698 MHz to 6 GHz and frequencies before and after 6 GHz. First Embodiment An antenna device of a first embodiment is used in a state in which an antenna unit is accommodated in a thin profile case that can be installed in any posture at any position inside a room or a vehicle compartment, for example. The thin profile case includes a case body formed of a member having electric wave permeability, such as an ABS resin, and a holding part formed appropriately according to an installation position. The case body includes, for example, a bottomed rectangular parallelepiped-shaped casing having an accommodation space for accommodating the antenna unit therein, and a cover body for sealing the accommodation space. The cover body is provided to any one of four side surfaces of the casing or one main surface having the largest width of the casing, and seals the accommodation space. FIG.1Aillustrates an example of a shape of the case body.FIG.1Bis a cross-sectional view of one side portion (a vertical side L1 in this example) ofFIG.1A. A case body10is an example of a case having a vertical side L1 of about 90 mm, a horizontal side L2 of about 90 mm, and a depth L3 of about 13 mm. As illustrated inFIG.1B, the case10is in an internal size of about 87 mm in inner side L11 of the vertical side L1, and about 10 mm in inner depth L31. The case body is sealed with the cover body after the antenna unit is accommodated in the case body. On a mounting portion of the case body, one of plural prepared holding parts (not illustrated) is mounted according to a shape on a plane of a dashboard, for example. The antenna unit to be accommodated in the case body10will be described.FIGS.2A to2Deach are a diagram illustrating a configuration example of the antenna unit.FIG.2Ais a front view,FIG.2Bis a rear view ofFIG.2A,FIG.2Cis a top view, andFIG.2Dis a perspective view. For convenience, an orthogonal coordinate system including x, y, and z axes is defined. The antenna unit includes a pair of first elements that are arranged on a first plane100, and a pair of second elements that are arranged on a second plane200parallel to the first plane100so that a polarized wave direction of the pair of second elements is orthogonal to that of the pair of first elements. Each configuration of the pair of first elements and the pair of second elements will be described with reference toFIGS.3A and3B. A predetermined portion of each element (in the illustrated example, portions on the respective pair of first elements that are closest to each other and portions on the respective pair of second elements that are closest to each other) is a portion to which a feed point is connectable. Such a portion is referred to as a “proximal end portion.” When it is particularly necessary to distinguish between proximal end portions of the pair of first elements and proximal end portions of the pair of second elements, the former may be referred to as “first proximal end portions,” and the later may be referred to as “second proximal end portions.” One of the pair of first elements (for convenience, referred to as “one first element”) includes two arms101aand102athat extend in a direction away from the corresponding first proximal end portion, and open end portions are formed at respective distal ends of the arms101aand102a. The other of the pair of first elements (for convenience, referred to as “the other first element”) also includes two arms101band102bthat extend in a direction away from the corresponding first proximal end portion, and open end portions are formed at respective distal ends of the arms101band102b. Each of the two arms (for example,101aand102a) included in the one first element has a width that is continuously or gradually increased as being away from the first proximal end portion. That is, each width is larger in a region far from the first proximal end portion than in a region close to the first proximal end portion. Additionally, a facing distance between the two arms is continuously or gradually increased as being away from the first proximal end portion. That is, the facing distance between the two arms is larger in the region far from the first proximal end portion than in the region close to the first proximal end portion. This is to cause the arms101aand102ato act as a self-similarity antenna such as a biconical antenna or a bow-tie antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. The similar applies to the two arms (for example,101band102b) of the other first element. Additionally, the two arms (for example,101aand102a) included in the one first element extend in directions away from each other from the two arms (for example,101band102b) included in the other first element. The pair of second elements have shape and structure similar to those of the pair of first elements. That is, one of the pair of second elements (for convenience, referred to as “one second element”) includes two arms201aand202athat extend in a direction away from the corresponding second proximal end portion, and open end portions are formed at respective distal ends of the arms201aand202a. Each of the two arms (for example,201aand202a) included in the one second element has a width that is continuously or gradually increased as being away from the second proximal end portion. That is, each width is larger in a region far from the second proximal end portion than in a region close to the second proximal end portion. Additionally, a facing distance between the two arms is continuously or gradually increased as being away from the second proximal end portion. That is, the facing distance between the two arms is larger in the region far from the second proximal end portion than in the region close to the second proximal end portion. This is to cause the arms201aand202ato act as a self-similarity antenna such as a biconical antenna or a bow-tie antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. The similar applies to two arms (for example,201band202b) of the other second element. Additionally, the two arms (for example,201aand202a) included in the one second element extend in directions away from each other from the two arms (for example,201band202b) included in the other second element. Next, arrangements of the pair of first elements and the pair of second elements will be described. A midpoint of a distance between the first proximal end portion of the one first element and the first proximal end portion of the other first element is referred to as a first center portion. Additionally, an approximate midpoint of a distance between the second proximal end portion of the one second element and the proximal end portion of the other second element is referred to as a second center portion. The first center portion is a feed point K1 for the first elements, and the second center portion is a feed point K2 for the second elements. The first center portion and the second center portion overlap each other when viewed from the plane (for example, the front side or the rear side). The pair of second elements are arranged to face the pair of first elements in a state in which the pair of second elements are turned by approximately 90 degrees from a position at which a second center portion is aligned with the first center position while maintaining a space D11. Therefore, split rings (each having a ring shape in which a portion thereof is cut so that the split portions face each other) are formed between the first elements and the second elements facing one another. The polarized wave direction of the first elements is orthogonal to that of the second elements. That is, for example, when the polarized wave direction of the first elements is perpendicular (perpendicularly polarized wave), the polarized wave direction of the second elements is horizontal (horizontally polarized wave). Conversely, when the polarized wave direction of the first elements is horizontal (horizontally polarized wave), the polarized wave direction of the second elements is perpendicular (perpendicularly polarized wave). The term “approximately 90 degrees” means that it is not necessarily strictly 90 degrees. A size obtained by connecting outer edges (outer edge size) of the first elements is similar to an outer edge size of the second elements. Therefore, the outer edge size is the same before and after turning of the pair of second elements. Each element is, for example, a conductive plate having a thickness of 0.5 mm, and the outer edge size is a size enough to be accommodated in the accommodation space of the case body10illustrated inFIG.1. In one example, the outer edge size of each element is about 87 mm×about 87 mm×about 10 mm. The space D11 between the first plane100and the second plane200corresponds to an inner depth L31 of the above-described case body10, that is, is about 9 mm. Next, each element structure of the pair of first elements and the pair of second elements will be described in detail.FIGS.3A and3Beach are a diagram illustrating a structure example of the second elements. The pair of second elements are configured as illustrated inFIG.3B, by joining or integrally forming the two arms201aand202aincluded in the one second element and the two arms201band202bincluded in the other second element symmetrically about the second proximal end portions (feed point K2) as illustrated inFIG.3A. A portion from each of the arms201a,202a,201b, and202bto the corresponding distal end is an open end. The portion of the distal end is referred to as an “open end portion.” Each open end portion is formed so that the first element and the second element each mainly have a certain area or more to secure a low frequency band (to allow use in a lower frequency band). In this example, the open end portion is formed in an L shape. However, the shape of the open end portion is not limited to an L shape, and may be a trapezoid, a rhombus, an oval, a circle, a triangle, or the like. Each of the two arms201aand202aincluded in the one second element and the two arms201band202bincluded in the other second element has a width that is continuously or gradually increased in a region from the corresponding second proximal end portion to the corresponding open end portion, as being away from the corresponding second proximal end portion. That is, each of the two arms201aand202aincluded in the one second element and the two arms201band202bincluded in the other second element is configured so that the width is larger in a region far from the corresponding second proximal end portion and close to the corresponding open end portion than in a region close to the corresponding second proximal end portion and far from the corresponding open end portion. Additionally, the facing distance between the two arms201aand202aincluded in the one second element and the facing distance between the two arms201band202bincluded in the other second element are continuously or gradually increased as being away from the respective second proximal end portions. That is, each of the facing distance between the two arms201aand202aincluded in the one second element and the facing distance between the two arms201band202bincluded in the other second element is larger in the region far from the corresponding second proximal end portion than in the region close to the corresponding second proximal end portion. Such a configuration enables the second elements to act as a self-similarity antenna such as a biconical antenna or a bow-tie antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. In this way, the two arms201aand202aincluded in the one second element and the two arms201band202bincluded in the other second element form substantially V shapes, respectively, together with the respective second proximal end portions. The pair of first elements also have the element structure similar to that inFIGS.3A and3B. FIGS.4A to4Ceach show antenna characteristics in the case where the one second element (for example, the two arms201aand202a) ofFIG.3Ais used alone as an antenna.FIG.4Ais a graph showing a VSWR characteristic,FIG.4Bis a graph showing a radiation efficiency characteristic, andFIG.4Cis a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the antenna ofFIG.3A. In each of the graphs, the horizontal axis represents a frequency (MHz). The average gain is an average gain in the horizontal plane (the similar shall apply hereinafter). As shown inFIGS.4A and4B, when only the second element is used alone as an antenna, an operation as a resonant antenna is dominant in the vicinity of about 900 MHz, and an operation as a non-resonant antenna is dominant at about 2500 MHz or more. As can be seen inFIG.4C, the average gain is about −2 dBi or more in a frequency band of about 900 MHz to 4500 MHz, which is in a practically usable level comparable to the MIMO antenna device disclosed in Patent Literature 1. FIGS.5A to5Cshow antenna characteristics in the case where the pair of second elements illustrated inFIG.3Bare acted as antennas.FIG.5Ais a graph showing a VSWR characteristic,FIG.5Bis a graph showing a radiation efficiency characteristic, andFIG.5Cis a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the antenna ofFIG.3B. In each of the graphs, the horizontal axis represents a frequency (MHz). As can be seen inFIGS.5A to5C, in the case where the pair of second elements are acted as antennas, the VSWR, the radiation efficiency, and the average gain (dBi) in the vicinity of a frequency of about 1500 MHz are more significantly improved than the case where one second element illustrated inFIG.3Ais used. The similar antenna characteristics can be obtained with respect to the pair of first elements. Next, the antenna characteristics of the antenna unit configured as illustrated inFIGS.2A to2Dwill be described. In the antenna unit, the pair of second elements face the pair of first elements in a state in which the pair of second elements are turned by approximately 90 degrees from a position at which the second proximal end portions are aligned with the first proximal end portions while maintaining the space D11. That is, the split rings are formed between the first elements and the second elements facing one another. Therefore, the frequency band expands to the low frequency side, whereby the antenna unit can act as a broadband antenna. The polarized wave of the first elements is orthogonal to that of the second elements. For example, when the polarized wave of the first elements is a perpendicularly polarized wave, the polarized wave of the second elements is a horizontally polarized wave. Conversely, when the polarized wave of the first elements is a horizontally polarized wave, the polarized wave of the second elements is a perpendicularly polarized wave. Therefore, the mutual interference can be reduced. For example, the isolation can be more significantly improved than the case where the second proximal end portions are not turned. Hereinafter, the characteristic example of the antenna unit of the first embodiment will be specifically described.FIG.6Ais a graph showing a VSWR characteristic of the feed point K1, andFIG.6Bis a graph showing a VSWR characteristic of the feed point K2. In each of the graphs, the horizontal axis represents a frequency (MHz). According to the antenna unit of the first embodiment, an available frequency band of a reception wave or a transmission wave expands to the low frequency side. FIG.7Ais a graph showing a radiation efficiency characteristic of the feed point K1, andFIG.7Bis a graph showing a radiation efficiency characteristic of the feed point K2. In each of the graphs, the horizontal axis represents a frequency (MHz). In the antenna unit of the first embodiment, the radiation efficiency in the vicinity of 698 MHz is about 0.85 (in the example ofFIG.4B, about 0.17, and in the example ofFIG.5B, about 0.3). It is found that the available frequency expands in the lower frequency direction. FIG.8Ais a graph showing a passing power characteristic from the feed point K1 to the feed point K2, andFIG.8Bis a graph showing a passing power characteristic from the feed point K2 to the feed point K1. The vertical axis ofFIG.8Arepresents 20 Log|S21| (dB), the vertical axis ofFIG.8Brepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.8A and8Brepresents a frequency (MHz). “S21” is an S parameter representing a transmission coefficient from the feed point K1 for the first elements to the feed point K2 for the second elements, and “20 Log|S21|” represents the passing power characteristic in decibels. Additionally, “S12” is an S parameter representing a transmission coefficient from the feed point K2 for the second elements to the feed point K1 for the first elements, and “20 Log|S12|” represents the passing power characteristic in decibels. In the antenna unit of the first embodiment, the isolation between the feed point K1 and the feed point K2 is about −30 dB to about −70 dB or less over a wide frequency band from 698 MHz and frequencies before and after 698 MHz to about 6 GHz and frequencies equal to or more than about 6 GHz. That is, the interference between the antennas is extremely small while the feed point K1 and the feed point K2 are close to each other. The antenna unit of the first embodiment is installed on the z-plane that extends vertically upward with respect to the x-y plane parallel to the ground, but the present inventors have verified how much the antenna characteristics change when the antenna unit is inclined by a predetermined angle on the z-plane. FIG.9Ais a front view of the antenna unit of the embodiment, and is the same asFIG.2A.FIG.9Bis a diagram illustrating a state in which the antenna unit is inclined by a predetermined angle θ, for example, by approximately 45 degrees in the counterclockwise direction.FIG.10Ais a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the feed point K1 in the arrangement ofFIG.9A.FIG.10Bis a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the feed point K2 in the arrangement ofFIG.9A. In each of the graphs, the vertical axis represents an average gain (dBi), and the horizontal axis represents a frequency (MHz). In the pair of first elements, for example, the average gain in the vicinity of 698 MHz is about 1 dBi, and for example, the average gain in the vicinity of 6 GHz is about −3 dBi. The gain variation within the above-described frequency range is smaller than that shown inFIGS.4C and5C. In the pair of second elements, for example, the average gain in the vicinity of 698 MHz is about −2 dBi, and for example, the average gain in the vicinity of 6 GHz is −2 dBi. The average gain variation within the above-described frequency range is also smaller than that shown inFIGS.4C and5C. FIG.11Ais a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the feed point K1 when the antenna unit is inclined, that is, in a state ofFIG.9B.FIG.11Bis a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the feed point K2 in a state ofFIG.9B. As compared withFIGS.10A and10B, in both of the first elements and the second elements, the gain in the frequency band of 5 GHz or more is higher than that before turning of the antenna unit. Additionally, the difference between the maximum value and the minimum value of the gain is about 6 dB before turning of the antenna unit, whereas it is reduced to about 4 dB in the turned state. That is, it is found that when the antenna unit is inclined by approximately 45 degrees and fixed, the average gain variation can be reduced while increasing the average gain. The term “approximately 45 degrees” means that it is not necessarily strictly 45 degrees. Here, to describe the characteristic operation of the antenna unit of the first embodiment, an antenna unit in a comparative example which has a structure similar to that of the antenna unit of the first embodiment will be described.FIG.12Ais a front view of the antenna unit of the comparative example,FIG.12Bis a rear view of the antenna unit of the comparative example,FIG.12Cis a top view of the antenna unit of the comparative example, andFIG.12Dis a perspective view of the antenna unit of the comparative example. The antenna unit of the comparative example includes a pair of first bow-tie antennas and a pair of second bow-tie antennas, each which has the same frequency, material, and longitudinal and lateral sizes as the antenna unit of the first embodiment. The size is a size enough to be accommodated in the case body10illustrated inFIG.1. The pair of first bow-tie antennas501and502having a semicircular plate shape are arranged on a first plane500so that respective diameter portions thereof face outwardly. The pair of second bow-tie antennas601and602having a semicircular plate shape are arranged on a second plane600so that respective diameter portions thereof face outwardly. The bow-tie antennas are arranged to face the other bow-tie antennas in a state in which the other bow-tie antennas are turned by approximately 90 degrees from a position at which arc portions in which the other bow-tie antennas are closest to each other (for example, arc portions to which the feed point K2 is connected) are aligned with arc portions in which the bow-tie antennas are closest to each other (for example, arc portions to which the feed point K1 is connected) while maintaining the space D11. FIG.13Ais a graph showing a VSWR characteristic of the antenna unit of the comparative example, andFIG.13Bis an enlarged graph showing a low frequency portion ofFIG.13A.FIG.14Ais a graph showing a radiation efficiency characteristic of the antenna unit of the comparative example, andFIG.14Bis an enlarged graph showing a low frequency portion ofFIG.14A. In each of the graphs, the horizontal axis represents a frequency (MHz). The measurement conditions for each characteristic are similar to those of the antenna unit of the first embodiment. A broken line in each graph represents the characteristics in the case where only the pair of first bow-tie antennas501and502are used, and a solid line in each graph represents the characteristics in the case where the pair of first bow-tie antennas501and502and the pair of second bow-tie antennas601and602face each other. These measurement results show that even only the pair of bow-tie antennas (for example, the first bow-tie antennas501and502) can be used as broadband antennas, and that reduction in the VSWR and the radiation efficiency may be unable to be prevented only by arranging one pair of bow-tie antennas and the other pair of bow-tie antennas to face each other in a state in which the other bow-tie antennas are turned by approximately 90 degrees from a position at which the arc portions in which the other pair of bow-tie antennas are closest to each other are aligned with the arc portions in which the one bow-tie antennas are closest to each other while maintaining the space D11. In particular, in the low frequency band, the VSWR is minimized near 1000 MHz, and specifically, is about 6. The radiation efficiency becomes 0.5 or less. Second Embodiment Next, a second embodiment of the present invention will be described. An antenna unit of the second embodiment is similar to the antenna unit of the first embodiment in that a pair of first elements and a pair of second elements are provided, in which respective polarized wave directions are orthogonal to each other, and each element includes a portion that acts as a self-similarity antenna, but is different from the antenna unit of the first embodiment in the shape and structure of each element. However, the antenna unit of the second embodiment has a size similar to the antenna unit of the first embodiment. That is, the case body10illustrated inFIG.1can also accommodate the antenna unit of the second embodiment. For the convenience of the description, members which correspond to the members of the antenna unit of the first embodiment are described by using the same member names and denoting the same reference numerals thereto. FIG.15Ais a front view of the antenna unit according to the second embodiment,FIG.15Bis a rear view of the antenna unit according to the second embodiment,FIG.15Cis a top view of the antenna unit according to the second embodiment, andFIG.15Dis a perspective view of the antenna unit according to the second embodiment. The antenna unit of the second embodiment includes a pair of first elements and a pair of second elements. The pair of second elements face the pair of first elements in a state in which the pair of second elements are turned by approximately 90 degrees from a position at which a second center portion (a portion or port to which a feed point K2 is connected) is aligned with a first center portion (a portion or port to which a feed point K1 is connected) while maintaining a space D11. The outer edge size of the antenna unit is the same before and after turning of the second elements. The pair of first elements will be described. One first element includes two arms101cand101dthat extend in a direction away from each other from a first proximal end portion thereof. The other first element also includes two arms102cand102dthat extend in a direction away from each other from a first proximal end portion thereof. The arm101cof the one first element extends in a direction away from the arm102cof the other first element that is closest to the arm101c. The arm101dalso extends in a direction away from the arm102din the similar manner. Each of the one first element and the other first element is arranged symmetrically about a first center portion, and is formed in a substantially C shape when viewed from the front side. Each of the arms101c,101d,102c, and102dis a conductive plate having a uniform width, and a distal end thereof is an open end portion that is formed in a predetermined shape, for example, an L shape. The open end portion of the arm101cand the open end portion of the arm101dface each other, and the open end portion of the arm102cand the open end portion of the arm102dface each other. Additionally, bent regions1011c,1011d,1021c, and1021dare formed in parts of the respective open end portions. Each of the bent regions1011c,1011d,1021c, and1021dis formed by being bent by approximately 90 degrees in a thickness direction of the antenna unit, that is, a direction toward the second elements which will be described later. This is to reduce the overall size while maintaining the performance. The pair of second elements will be described. One second element includes two arms201cand201dthat extend in a direction away from each other from a second proximal end portion thereof. The other second element also includes two arms202cand202dthat extend in a direction away from each other from a second proximal end portion thereof. The arm201cof the one second element extends in a direction away from the arm202cof the other second element that is closest to the arm201c. The arm201dalso extends in a direction away from the arm202din the similar manner. Each of the one second element and the other second element is arranged symmetrically about a second center portion, and is formed in a substantially C shape when viewed from the front side. Each of the arms201c,201d,202c, and202dis a conductive plate having a uniform width, and a distal end thereof is an open end portion that is formed in a predetermined shape, for example, an L shape. The open end portion of the arm201cand the open end portion of the arm201dface each other, and the open end portion of the arm202cand the open end portion of the arm202dface each other. Additionally, bent regions2011c,2011d,2021c, and2021dare formed in parts of the respective open end portions. Each of the bent regions2011c,2011d,2021c, and2021dis formed by being bent by approximately 90 degrees in a thickness direction of the antenna unit, that is, a direction toward the first elements. This is to reduce the overall size while maintaining the performance. Similarly to the antenna unit of the first embodiment, also in the antenna unit of the second embodiment, split rings are formed, whereby an available frequency band can expand to the low frequency side. FIGS.16A to19Beach show antenna characteristics of the antenna unit of the second embodiment.FIG.16Ais a graph showing a VSWR characteristic of a feed point K1, andFIG.16Bis a graph showing a VSWR characteristic of a feed point K2.FIG.17Ais a graph showing a radiation efficiency characteristic of the feed point K1, andFIG.17Bis a graph showing a radiation efficiency characteristic of the feed point K2. In each of the graphs, the horizontal axis represents a frequency (MHz). Additionally,FIG.18Ais a graph showing a passing power characteristic from the feed point K1 for the first elements to the feed point K2 for the second elements, andFIG.18Bis a graph showing a passing power characteristic from the feed point K2 for the second elements to the feed point K1 for the first elements. The vertical axis ofFIG.18Arepresents 20 Log|S21| (dB) described above, the vertical axis ofFIG.18Brepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.18A and18Brepresents a frequency (MHz).FIG.19Ais a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the feed point K1 in the arrangement ofFIG.15A.FIG.19Bis a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the feed point K2 in the arrangement ofFIG.15A. In each of the graphs, the horizontal axis represents a frequency (MHz). The bent regions1011c,1011d,1021c,1021d,2011c,2011d,2021c, and2021dmay be provided in the antenna unit of the first embodiment. It is confirmed that when the antenna unit of the second embodiment is inclined by approximately 45 degrees and fixed on the Z surface as illustrated inFIG.15B, the average gain in the horizontal plane (x-y plane) is stably increased. Third Embodiment Next, a third embodiment of the present invention will be described. An antenna unit of the third embodiment is similar to the antenna units of the first embodiment and the second embodiment in that a pair of first elements and a pair of second elements are provided, in which respective polarized wave directions are orthogonal to each other, and each element includes a portion that acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna, but is different from the antenna unit of the first embodiment in the shape and structure of each element. As one of the features, in the antenna unit of the third embodiment, the first element and the second element are different from each other in shape, structure, and size. The outer edge size of the antenna unit is formed in a rectangular shape when viewed from the front side. Therefore, the antenna unit has long side portions and short side portions. The antenna case10illustrated inFIGS.1A and1Bhas a rectangular parallelepiped shape in which the long side portion is relatively long. However, for the convenience of the description, members which correspond to the members of the antenna units of the first embodiment and the second embodiment are described by using the same member names and denoting the same reference numerals thereto. FIG.20Ais a front view of the antenna unit according to the third embodiment,FIG.20Bis a side view of the long side portion of the antenna unit according to the third embodiment,FIG.20Cis a side view of the short side portion of the antenna unit according to the third embodiment, andFIG.20Dis a perspective view of the antenna unit according to the third embodiment. The antenna unit of the third embodiment includes a pair of first elements and a pair of second elements. The pair of second elements face the pair of first elements in a state in which the pair of second elements are turned by approximately 90 degrees from a position at which a second center portion (a portion or port to which a feed point K2 is connected) is aligned with a first center portion (a portion or port to which a feed point K1 is connected) while maintaining a predetermined space. The predetermined space is the same as the space D11 described in the first embodiment. The pair of first elements will be described. One first element includes two arms101cand101dthat extend in a direction away from each other from a first proximal end portion thereof. The other first element includes two arms102cand102dthat extend in a direction away from each other from a first proximal end portion thereof. Each of the two arms101cand101dincluded in the one first element and the two arms102cand102dincluded in the other first element has a width that is continuously or gradually increased as being away from the corresponding first proximal end portion. That is, each width of the two arms101cand101dincluded in the one first element and the two arms102cand102dincluded in the other first element is larger in a region far from the corresponding first proximal end portion than in a region close to the corresponding first proximal end portion. Additionally, a facing distance between the one first element and the other first element is continuously or gradually increased as being away from the first proximal end portions. That is, the facing distance between the one first element and the other first element is larger in the region far from the first proximal end portions than in the region close to the first proximal end portions. The arm101cof the one first element extends in a direction away from the arm102cof the other first element that is closest to the arm101c. Such a configuration enables the first elements to act as a self-similarity antenna such as a biconical antenna or a bow-tie antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. Open end portions are formed at respective distal end portions of the arms101c,101d,102c, and102d. Each open end portion is formed in a predetermined shape, for example, an L shape. The open end portion of the arm101cand the open end portion of the arm101dface each other, and the open end portion of the arm102cand the open end portion of the arm102dface each other. In this way, each of the pair of two arms101cand101dincluded in the one first element and the pair of arms102cand102dincluded in the other first element is arranged symmetrically about a first center portion, and is formed in a substantially C shape when viewed from the front side. Next, the pair of second elements will be described. Each of a facing distance between the two arms201cand202cincluded in the one second element and a facing distance between the two arms201dand202dincluded in the other second element is continuously or gradually increased as being away from the corresponding second proximal end portion. That is, each of the facing distance between the two arms201cand202cincluded in the one second element and the facing distance between the two arms201dand202dincluded in the other second element is larger in the region far from the corresponding second proximal end portion than in the region close to the corresponding second proximal end portion. The arm201cof the one second element extends in a direction away from the arm201dof the other second element that is closest to the arm201c. In this way, each of the facing distance between the arms201cand202cand the facing distance between the arms201dand202dis larger in a region in the vicinity of the open end portions than in a region in the vicinity of the proximal end portion. Such a configuration enables the second elements to act as a self-similarity antenna such as a biconical antenna or a bow-tie antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. In this way, each of the pair of two arms201cand202cincluded in the one second element and the pair of arms201dand202dincluded in the other second element is arranged symmetrically about a second center portion, and is formed in a substantially C shape when viewed from the front side. Open end portions are formed at respective distal end portions of the arms201c,201d,202c, and202d. A change rate of the width from the region in the vicinity of the second proximal end portion to the region in the vicinity of the open end portion in each of the arms201c,201d,202c, and202dis smaller than the change rate of the width from the region in the vicinity of the first proximal end portion to the region in the vicinity of the open end portion in the first element. A bent region2011cin the long side and a bent region2012cin the short side are formed in a part of the open end portion of the arm201c. The bent region2011cin the long side is formed by being bent by 90 degrees in the thickness direction of the antenna unit, that is, a direction toward the first element that is closest to the bent region2011c. The bent region2012cin the short side is formed by being bent by 90 degrees in a direction from the bent region2011cin the long side toward the other first element. Also in each open end portion of the other arms202c,201d, and202d, the bent regions having the same structure as the open end portion of the arm201care formed. That is, a bent region2021cin the long side and a bent region2022cin the short side are formed in a part of the arm202c. A bent region2011din the long side and a bent region2012din the short side are formed in a part of the arm201d. A bent region2021din the long side and a bent region2022din the short side are formed in a part of the arm202d. When these bent regions2011c,2012c,2021c,2022c,2011d,2012d,2021d, and2022dare formed, the overall size can be reduced while maintaining the antenna performance that is obtained in the case where these bent regions are not formed. Additionally, the split rings are formed using the pair of first elements and the pair of second elements, whereby an available frequency band can expand to the low frequency side. FIGS.21A to24Beach show antenna characteristics of the antenna unit of the third embodiment.FIG.21Ais a graph showing a VSWR characteristic of a feed point K1, andFIG.21Bis a graph showing a VSWR characteristic of a feed point K2.FIG.22Ais a graph showing a radiation efficiency characteristic of the feed point K1, andFIG.22Bis a graph showing a radiation efficiency characteristic of the feed point K2. In each of the graphs, the horizontal axis represents a frequency (MHz). Additionally,FIG.23Ais a graph showing a passing power characteristic from the feed point K1 for the first elements to the feed point K2 for the second elements, andFIG.23Bis a graph showing a passing power characteristic from the feed point K2 for the second elements to the feed point K1 for the first elements. The vertical axis ofFIG.23Arepresents 20 Log|S21| (dB), the vertical axis ofFIG.23Brepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.23A and23Brepresents a frequency (MHz).FIG.24Ais a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the feed point K1 in the arrangement ofFIG.20A.FIG.24Bis a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the feed point K2 in the arrangement ofFIG.20A. In each of the graphs, the horizontal axis represents a frequency (MHz). Fourth Embodiment Next, a fourth embodiment of the present invention will be described. An antenna unit of the fourth embodiment is similar to the antenna unit of the first embodiment in that a pair of first elements and a pair of second elements are provided, in which respective polarized wave directions are orthogonal to each other, and each element includes a portion that acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna, but is different from the antenna unit of the first embodiment in the shape and structure of each element. However, for the convenience of the description, members which correspond to the members of the antenna units of the first embodiment are described by using the same member names and denoting the same reference numerals thereto. FIG.25Ais a front view of the antenna unit according to the fourth embodiment,FIG.25Bis a top view of the antenna unit according to the fourth embodiment, andFIG.25Cis a perspective view of the antenna unit according to the fourth embodiment. The antenna unit of the fourth embodiment has a basic structure similar to the antenna unit of the first embodiment. A space between the pair of first elements and the pair of second elements, and an outer edge size of the pair of first elements and the pair of second elements are similar to the antenna unit of the first embodiment. The antenna unit of the fourth embodiment is different from the antenna unit of the first embodiment in that each open end portion of arms included in the first elements is conductively connected to one of open end portions of arms included in the second elements that is closest to the above-described open end portion of the first element, and each open end portion of the arms included in the first elements and the corresponding open end portion of the second element are formed integrally with each other, thereby being formed in a loop shape including a portion that acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. Therefore, in the antenna unit according to the fourth embodiment, the above-described split rings are not formed. FIGS.26A to29Beach show antenna characteristics of the antenna unit of the fourth embodiment.FIG.26Ais a graph showing a VSWR characteristic of a feed point K1, andFIG.26Bis a graph showing a VSWR characteristic of a feed point K2.FIG.27Ais a graph showing a radiation efficiency characteristic of the feed point K1, andFIG.27Bis a graph showing a radiation efficiency characteristic of the feed point K2. In each of the graphs, the horizontal axis represents a frequency (MHz). Additionally,FIG.28Ais a graph showing a passing power characteristic from the feed point K1 for the first elements to the feed point K2 for the second elements, andFIG.28Bis a graph showing a passing power characteristic from the feed point K2 for the second elements to the feed point K1 for the first elements. The vertical axis ofFIG.28Arepresents 20 Log|S21| (dB), the vertical axis ofFIG.28Brepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.28A and28Brepresents a frequency (MHz).FIG.29Ais a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the feed point K1 in the arrangement ofFIG.24A.FIG.29Bis a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the feed point K2 in the arrangement ofFIG.24A. In each of the graphs, the horizontal axis represents a frequency (MHz). Fifth Embodiment Next, a fifth embodiment of the present invention will be described. An antenna unit of the fifth embodiment is similar to the antenna unit of the first embodiment in an arrangement relation between a pair of first elements and a pair of second elements, and the shape, structure, and size of each element, but is different from the antenna unit of the first embodiment in how to combine each of the pairs of elements. Additionally, the forms of the feed points are embodied. For convenience, members which correspond to the members of the antenna unit of the first embodiment are described by using the same member names and denoting the same reference numerals thereto. FIG.30Ais a perspective view illustrating a configuration example of the antenna unit according to the fifth embodiment, andFIG.30Bis a perspective view when viewingFIG.30Afrom the rear side. In the first embodiment, the one first element and the other first element are arranged symmetrically about the first center portion so that the two elements have a V shape and an inverted V shape, respectively. However, in the antenna unit of the fifth embodiment, one of the pair of first elements includes two arms101aand101b, and the other first element includes two arms102aand102b, so that the two elements have respective substantially C shapes formed symmetrically about a first center portion. The similar applies to the pair of second elements. That is, one second element includes two arms201aand201b, and the other second element includes two arms202aand202b, so that the two elements have respective substantially C shapes formed symmetrically about a second center portion. Also in such a combination of the elements, a polarized wave direction of a signal receivable or transmittable by the pair of first elements is orthogonal to a polarized wave direction of a signal receivable or transmittable by the pair of second elements, and each element includes a portion that acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. Therefore, the fifth embodiment can acquire actions and effects similar to those of the first embodiment. Additionally, a first feeder F11around which a ferrite core is wound is connected to a feed point of the first center portion, and a second feeder F21around which a ferrite core is wound at an angle of substantially 90 degrees with respect to the first feeder F11is connected to a feed point of the second center portion. This can prevent leakage currents in the low frequency range including 698 MHz in which a resonant operation is performed, and stabilize and improve the radiation characteristic. “L11” and “L21” inFIGS.30A and30Brepresent coaxial cables which are examples of feeders F11and F21, respectively. Modification Example 1 In the first, second, fourth, and fifth embodiments, the description has been made assuming that the first element and the second element have the same shape, structure and size, but these embodiments are not limited thereto. When the elements each include a portion that acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna, their polarized wave directions are orthogonal to each other, and an overlapping area between the elements is small, one of the elements may be different from the other in size. In the first, second, fourth, and fifth embodiments, the description has been made assuming that the pair of first elements and the pair of second elements each are formed in a substantially V shape or a substantially C shape, but may be formed in a substantially D shape, a substantially U shape, a substantially semicircular shape, a substantially semiellipse shape, a substantially triangular shape, or a substantially quadrangular shape. Additionally, in these embodiments, the description has been made assuming that two feed points are provided, but a configuration may be adopted in which only one feed point is provided. Since the first element and the second element are electrically connected to each other, an operation similar to that in the case where the two feed points are provided can be achieved. In the first embodiment, an example has been described in which the antenna characteristics are improved by installing the antenna unit on the z-plane in a state of being inclined by approximately 45 degrees. However, also in each of the second to fifth embodiments, the antenna unit may be installed in a state of being inclined in the similar manner to the first embodiment. Also in the case where not only the pair of first elements or the pair of second elements but also one arm or two arms included in each element are used as antennas, the antenna unit may be installed by being inclined in the similar manner. Effects of Antenna Device According to First to Fifth Embodiments In the antenna unit of each of the first to fifth embodiments, the pair of first elements and the pair of second elements are arranged so that the respective polarized wave directions are orthogonal to each other, whereby the mutual interference between the elements can be reduced, the antenna device can be reduced in thickness. Additionally, since each element of the pair of first elements and the pair of second elements includes a portion that acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna, the antenna unit can receive or transmit the signals over a wide frequency band, and can operate stably over a wide frequency band. Each element of the pair of first elements and the pair of second elements includes two arms that extend in directions away from each other from the proximal end portion to which the feed point is connectable, which enables size reduction of the elements. As in the antenna unit of the comparative example illustrated inFIGS.12A to12D, in the case where the pair of second bow-tie antennas601and602are arranged to face the first bow-tie antennas501and502in a state in which the pair of second bow-tie antennas601and602are turned by approximately 90 degrees with respect to a state of being aligned with the pair of first bow-tie antennas501and502, conductors are generated circumferentially between the first bow-tie antennas501and502and the second bow-tie antennas601and602. On the other hand, when the pair of second elements in the antenna unit12of the first to fifth embodiment are arranged to face the pair of first elements in a state in which the pair of second elements are turned by approximately 90 degrees with respect to a state of being aligned with the pair of first elements, an overlapping area between both elements when being brought close to each other can be reduced. That is, conductors are not generated circumferentially between the first elements and the second elements. Accordingly, since scatters are not introduced between both elements, the reactance variation can be reduced, whereby the impedance is stabilized. Therefore, a wide frequency band can be attained. Since the antenna unit can be accommodated in a case having electric wave permeability (case body10) in size of 90 mm in vertical and horizontal sides and 13 mm in thickness or less, the interference is reduced while reducing the size and thickness of the antenna unit, whereby the antenna device in which the two antennas excellent in isolation are accommodated can be provided. The antenna device can be also installed, for example, at any place in a vehicle or at any portion in a room to be used for a MIMO using a frequency band of LTE or 5G. Since the antenna unit of the first and second embodiment has excellent stable antenna characteristics over a frequency band from a low frequency band to a high frequency band of LTE and 5G, as shown inFIGS.6A to8BandFIGS.16A to19B, the antenna unit of the first and second embodiment can be used as antenna devices for Japan and foreign countries without need to make any design changes. Since each width is increased as being away from the feed point K1 (K2), in particular, the VSWR on the high frequency side can be reduced, the radiation efficiency and the average gain can be increased, and these variations can be reduced. Since a configuration is adopted in which the pair of first elements and the pair of second elements are provided, and the pair of second elements are arranged to face the pair of first elements in a state in which the pair of second elements are turned by approximately 90 degrees with respect to a state of being aligned with the pair of first elements so that both elements are brought close to each other, each end portion of the first elements and the corresponding end portion of the second elements facing each other are electrically connected to each other, to form a loop shape, which can widen the available frequency band in a direction of a low frequency in the vicinity of 698 MHz. The antenna device having such a configuration can expand the available frequency band to the low frequency side, and further widen the available frequency band, which would be difficult for the conventional antenna devices, for example. Since the two arms (for example,101aand101b) have respective distal ends that are formed in a predetermined shape determined according to the shape of the installation position, the element area required in each arm can be secured while increasing the flexibility of the element shape. The term “element area required” is determined according to the resonant frequency of the split ring expanding the low frequency band. Since a portion of a region farthest from the feed point (for example, K1) in each of the two arms (for example,101cand101d) is bent in a direction of the other arms (for example,201c,201d) that face the two arms, the frequency band can be expanded to the low frequency side without changing sizes of the vertical and horizontal sides and the thickness of the entire antenna unit (and the case body10). In the antenna unit of the comparative example described in the first embodiment, in the case where each of the pair of bow-tie antennas and the other pair of bow-tie antennas that are arranged at approximately 90 degrees with respect to each other is used as a broadband antenna while being spaced apart from each other by 40 mm or more, the antenna characteristics of a practical level can be obtained. In the first to fifth embodiments, the description has been made assuming that the minimum frequency in the LTE is 698 MHz. However, in the case where the available frequency is expanded to the low frequency side up to about 450 MHz while maintaining the performance of the antenna of each embodiment, such expansion can be implemented by increasing the size (outer edge size) when viewing the antenna unit from the front side or rear side according to the ratio of the wavelength, without changing the space D11 of the antenna unit. Although being inferior to the performance of the antenna unit of each embodiment, the available frequency can be expanded to the low frequency side up to about 450 MHz by providing appropriate width of each arm and appropriate area of a portion corresponding to each open end portion without changing the size (outer edge size) of the antenna unit. Sixth Embodiment Next, a sixth embodiment of the present invention will be described. In the sixth embodiment, the description will be made about an antenna unit having a configuration designed in consideration of the simplification of a creation process of the elements in addition to the actions and effects of the antenna unit of each of the first to fifth embodiments. The antenna unit of the sixth embodiment is generally similar to the antenna unit of the first to fifth embodiment in providing a pair of first elements and a pair of second elements, an arrangement relation between these elements, and a feeding system. For convenience, members which correspond to the members of the antenna unit of each embodiment described above are described by using the same member names and denoting the same reference numerals thereto. FIG.31Ais a perspective view of the antenna unit in the sixth embodiment,FIG.31Bis a front view illustrating a feeding state of the pair of first elements, andFIG.31Cis a front view illustrating a feeding state of the pair of second elements. The antenna unit has a size enough to be accommodated in a box-shaped resin case (for example, the case10illustrated inFIGS.1A and1B) having a z-direction length of 60 mm, an x-direction length of 80 mm, and a y-direction length of 15 mm. Referring toFIGS.31A to31C, one first element of the pair of first elements includes a proximal end region101ewhich is a first region in which a proximal end portion of the one first element is formed in a mountain shape in a direction (x-axis direction) toward a proximal end portion of the other first element, an extending region101fwhich is a second region to be conductively connected to one end portion of the proximal end region101e, and an extending region101gto be conductively connected to the other end portion of the proximal end region101e. The other first element also includes a proximal end region102ein which the proximal end portion of the other first element is formed in a mountain shape in the direction toward the proximal end portion of the one first element, an extending region102fto be conductively connected to one end portion of the proximal end region102e, and an extending region102gto be conductively connected to the other end portion of the proximal end region102e. The electrical connection can be made by a solder connection or a conductive via hole. Both regions may be conductively connected to each other using a conductive screw or bolt and nut, a conductive adhesive, or a conductive wire. The proximal end regions101eand102ecorrespond to partial regions of arms including portions to which the feed point is to be connected in the embodiments described above, that is, regions in the vicinity of the above-described first proximal end portions or second proximal end portions. The extending regions101f,101g,102f, and102gcorrespond to the remaining regions of the above-described partial regions in the arms in the embodiments described above. After a stripe is printed on each of front and rear surfaces of one board PB1, the proximal end region101eis mutually conductively connected to the board PB1through a plurality of conductive via holes1011ein this example. In this example, the board PB1is a printed circuit board (PCB; the same applies hereinafter) having a substantially rectangular shape. The proximal end region102eis also mutually conductively connected to the board PB1through a plurality of conductive via holes1021eafter a stripe is printed on each of the front and rear surfaces of the board PB1. A portion at which the two proximal end regions101eand102eare closest to each other becomes the above-described first center portion (a portion or port to which a feed point K1 is connected). A signal line F111of a coaxial cable F114as an example of the feeder is conductively connected to the proximal end region102e. A ground line F112of the coaxial cable F114is conductively connected to the proximal end region101e. This enables the pair of first elements to act as two dipole antennas. Additionally, the proximal end region101eand the extending regions101fand101g, and the proximal end region102eand the extending regions102fand102gact as two tapered-slot antennas. A ferrite core F113is attached to the coaxial cable F114, which can block a current leaking from an outer jacket of the coaxial cable F114. To increase the gain in the low frequency band in the vicinity of 698 GHz, the size of the antenna unit is generally increased. Attaching the ferrite core F113enables the size reduction of the antenna unit while securing the gain on the low frequency side. In the coaxial cable F114, a connection point with the first elements is regarded as the feed point K1, and an end portion opposite to the feed point K1 is regarded as an output end. In general, an impedance matching circuit is mounted on the printed circuit board, but the antenna of the embodiment does not require the impedance matching circuit, and the signal line F111and the ground line F112of the coaxial cable is directly connected to the proximal end regions101eand102eformed on the board PB1, respectively. Therefore, a configuration of the entire antenna unit can be simplified. The extending regions101f,101g,102f, and102gare substantially perpendicular to the board PB1, have metal plates having a width in a direction of the second elements, and are each formed by a sheet metal. Open end portions are formed at portions in the vicinity of distal ends of the extending regions101f,101g,102f, and102g, respectively. The open end portions include first end portions1011f,1011g,1021f, and1021ghaving a trapezoidal shape on planes perpendicular to the board PB1, and second end portions1012f,1012g,1022f, and1022ghaving a substantially triangular shape on a plane parallel to the board PB1, and being formed by bending from the respective first end portions. The objects of forming the second end portions1012f,1012g,1022f, and1022gin a substantially triangular shape are to maintain a self-similar shape to keep the impedance constant, whereby the antenna performance (VSWR, radiation efficiency, gain) is improved. To avoid connection between the second end portions1012fand1012gfacing each other and connection between the second end portions1022fand1022gfacing each other, the second end portions1012f,1012g,1022f, and1022gmay be formed in a shape close to a trapezoidal shape by cutting a part of a tip of the triangular shape. The width of each end portion is increased toward the distal end of the corresponding extending region. When the second end portions1012f,1012g,1022f, and1022gare formed in a substantially triangular shape, the entire antenna unit can continuously maintain the similar shape to keep the impedance constant, whereby the antenna characteristics, especially, the VSWR can be improved. The two extending regions101fand101gincluded in the one first element and the two extending regions102fand102gincluded in the other first element are arranged symmetrically about the first center portion, and each is formed in a substantially C shape when viewed from the front side (y-axis direction). Next, the pair of second elements will be described. One second element of the pair of second elements includes a proximal end region201ein which a proximal end portion of the one second element is formed in a mountain shape in a direction (z-axis direction) toward a proximal end portion of the other second element, an extending region201fto be conductively connected to one end portion of the proximal end region201e, and another extending region201gto be conductively connected to the other end portion of the proximal end region201e. The other second element also includes a proximal end region202ein which the proximal end portion of the other second element is formed in a mountain shape in the direction toward the proximal end portion of the one second element, an extending region202fto be conductively connected to one end portion of the proximal end region202e, and another extending region202gto be conductively connected to the other end portion of the proximal end region202e. The proximal end region201eis formed on a board PB2that is arranged on a plane parallel to the board PB1and is inclined by about 90 degrees about the first center portion. The board PB2is a PCB having a substantially rectangular shape in which the long side extends in a direction perpendicular to the board PB1. The proximal end region201eis mutually conductively connected to the board PB2through a plurality of conductive via holes2011eafter a stripe is printed on each of front and rear surfaces of the board PB2. The proximal end region202eis also mutually conductively connected to the board PB2through a plurality of conductive via holes2021eafter a stripe is printed on each of the front and rear surfaces of the board PB2. A portion at which the two proximal end regions201eand202eare closest to each other becomes the above-described second center portion (a portion or port to which a feed point K2 is connected). A signal line F211of a coaxial cable F214as an example of the feeder is conductively connected to the proximal end region202e. A ground line F212of the coaxial cable F214is conductively connected to the proximal end region201e. This enables the pair of second elements to act as two dipole antennas or two tapered-slot antennas. A ferrite core F213is attached to the coaxial cable F214. The effects are similar to the case of the first elements. Additionally, the proximal end region201eand the extending regions201fand201g, and the proximal end region202eand the extending regions202fand202gact as two tapered-slot antennas. In the coaxial cable F214, a connection point with the second elements is regarded as the feed point K2, and an end portion opposite to the feed point K2 is regarded as an output end. The extending regions201f,201g,202f, and202gare perpendicular to the board PB2, have metal plates having a width in a direction of the first elements, and are each formed by a sheet metal. Open end portions are formed at portions in the vicinity of distal ends of the extending regions201f,201g,202f, and202g, respectively. The open end portions include first end portions2011f,2011g,2021f, and2021ghaving a trapezoidal shape on planes perpendicular to the board PB2, and second end portions2012f,2012g,2022f, and2022ghaving a substantially triangular shape on a plane parallel to the board PB2, and being formed by bending from the respective first end portions. A fact that a part of a tip of the triangular shape may be cut to form a shape close to a trapezoidal shape can be also applied to the second elements. The width of each end portion is increased toward the distal end of the corresponding extending region. The two extending regions201fand201gincluded in the one second element and the two extending regions202fand202gincluded in the other second element are arranged symmetrically about the second center portion, and each is formed in a substantially C shape when viewed from the front side (y-axis direction). A split ring is formed among the first end portion1011f,1011g,1021f,1021gand the second end portion1012f,1012g,1022f,1022gof the first element and the first end portion2021f,2021g,2011f,2011gand the second end portion2022f,2022g,2012f,2012gof the second element which is closest to the first element. That is, both regions are not conductively connected to each other, but are capacitively coupled. In this way, the pair of first elements and the pair of second elements act as a loop antenna, as a whole. The split ring serves to expand the available frequency band of the antenna unit to the low frequency side. Also in the antenna unit of the sixth embodiment, the pair of first elements are inclined by approximately 90 degrees with respect to the pair of second elements, similarly to the antenna unit of each embodiment described above. Therefore, a polarized wave direction of a signal receivable or transmittable by the pair of first elements is orthogonal to a polarized wave direction of a signal receivable or transmittable by the pair of second elements, and a part or whole of each element acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. In the case where each element that acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna is formed by a sheet metal, it is required to make the width as narrow as possible in the vicinity of the proximal end portion to which the feed point is connected. Therefore, it becomes difficult to form the element by a sheet metal. However, in the antenna unit of the sixth embodiment, the proximal end regions101eand102e, and the proximal end regions201eand202eare formed by being printed on the boards PB1and PB2, respectively, and the proximal end region101e, the proximal end region102e, the proximal end region201e, and the proximal end region202eare conductively connected to the extending regions101fand101g, the extending regions102fand102g, the extending regions201fand201g, and the extending regions202fand202g, respectively. Therefore, each element can be easily formed by a sheet metal. Additionally, each of the proximal end regions101e,102e,201e, and202eis configured in which two prints formed on the front and rear surface of the corresponding one of the boards PB1and PB2are conductively connected through the corresponding ones of the conductive via holes1011e,1021e,2011e, and2021e. Therefore, the radiation resistance and the inductance are increased as compared with the case where each of the proximal end regions is configured only by one print, and the radiation efficiency is improved. Partial regions of at least one pair of elements of the pair of first elements and the pair of second elements may be formed on the corresponding board PB1, PB2. Each of the proximal end regions101e,102e,201e, and202emay be formed on one side of the corresponding board PB, PB2. In this case, the conductive via holes1011e,1021e,2011e, and2021eare unnecessary. Next, the antenna characteristics of the antenna of the sixth embodiment will be described. FIG.32Ais a graph showing a VSWR characteristic of the output end of the coaxial cable F114, andFIG.32Bis a graph showing a VSWR characteristic of the output end of the coaxial cable F214.FIG.32Cis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F114, andFIG.32Dis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). Additionally,FIG.32Eis a graph showing a passing power characteristic from the output end of the coaxial cable F114to the output end of the coaxial cable F214, andFIG.32Fis a graph showing a passing power characteristic from the output end of the coaxial cable F214to the output end of the coaxial cable F114. The vertical axis ofFIG.32Erepresents 20 Log|S21| (dB), the vertical axis ofFIG.32Frepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.32E and32Frepresents a frequency (MHz).FIG.32Gis a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the output end of the coaxial cable F114in the arrangement ofFIG.31A.FIG.32His a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). As can been understood from these antenna characteristics, although the antenna unit has an extremely small size having the z-direction length of less than 60 mm, the x-direction length of less than 80 mm, and the y-direction length of less than 15 mm, it can be used and practically used in a low frequency region including 698 MHz and the frequencies before and after 698 MHz, for example. A configuration in which the antenna unit includes the proximal end regions formed on the boards and the extending regions formed by a sheet metal and these regions are electrically connected can be applied to examples other than the example illustrated inFIGS.31A to31C. The above-described configuration can be also applied to an antenna unit having another configuration in which one first element and one second element are provided, for example. Seventh Embodiment In a seventh embodiment, an example will be described in which each element of an antenna unit is formed by a print on a board, as an application of the sixth embodiment.FIG.33Ais a front view of a pair of first elements in the seventh embodiment,FIG.33Bis a front view of a pair of second elements,FIG.33Cis a front view illustrating a feeding state of the pair of first elements, andFIG.33Dis a front view illustrating a feeding state of the pair of second elements.FIG.33Eis a perspective view for illustrating the overall state of the first elements and the second elements, andFIG.33Fis a side view of the antenna unit. A board is a square-shaped PCB having a thickness of 0.8 mm and a side length of 87 mm. For convenience, components which are similar to those of the antenna unit of each embodiment described above are described by denoting the same reference numerals thereto. In the antenna unit of the seventh embodiment, the pair of first elements are formed by being printed on one side (front surface) of a board PB3having planar front and rear surfaces, and the pair of second elements are formed by being printed on the other side (rear surface) of the board PB3, in which the polarized wave direction of the pair of second elements is orthogonal to that of the pair of first elements. Referring toFIG.33A, one first element of the pair of first elements includes two arms101jand101kthat extend in a direction away from each other from a proximal end portion to which a feed point is connectable. The arm101jincludes a region1011jin which a width is increased as being away from the proximal end portion, and an open end portion1012jthat is straightly cut from another corner of the board PB3to a center portion of the board PB3. The arm101kincludes a region1011kin which a width is increased as being away from the proximal end portion, and an open end portion1012kthat is straightly cut from one corner of the board PB3to the center portion of the board PB3. The other first element includes two arms102jand102kthat extend in a direction away from each other from a proximal end portion to which the feed point is connectable. The arm102jincludes a region1021jin which a width is increased as being away from a proximal end portion thereof, and an open end portion1022jthat is straightly cut from another corner of the board PB3to the center portion of the board PB3. The arm102kincludes a region1021kin which a width is increased as being away from the proximal end portion, and an open end portion1022kthat is straightly cut from another corner of the board PB3to the center portion of the board PB3. Each element of the pair of first elements acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. A signal line F111of the coaxial cable F114is conductively connected to the proximal end portion of the one first element, as illustrated inFIG.33C. A ground line F112of the coaxial cable F114is conductively connected to the proximal end portion of the other first element. This enables the pair of first elements to act as two dipole antennas or two tapered-slot antennas. A ferrite core F113is attached to the coaxial cable F114. In the coaxial cable F114, a connection point with the first elements is regarded as a feed point K1, and an end portion opposite to the feed point K1 is regarded as an output end. Referring toFIG.33B, one second element of the pair of second elements includes two arms201jand201kthat extend in a direction away from each other from a proximal end portion to which a feed point is connectable. The arm201jincludes a region2011jin which a width is increased as being away from the proximal end portion, and an open end portion2012jthat is straightly cut from another corner of the board PB3to a center portion of the board PB3. The arm201kincludes a region2011kin which a width is increased as being away from the proximal end portion, and an open end portion2012kthat is straightly cut from one corner of the board PB3to the center portion of the board PB3. The other second element includes two arms202jand202kthat extend in a direction away from each other from a proximal end portion to which the feed point is connectable. The arm202jincludes a region2021jin which a width is increased as being away from a proximal end portion thereof, and an open end portion2022jthat is straightly cut from another corner of the board PB3to the center portion of the board PB3. The arm202kincludes a region2021kin which a width is increased as being away from the proximal end portion, and an open end portion2022kthat is straightly cut from another corner of the board PB3to the center portion of the board PB3. Each element of the pair of second elements acts as a self-similarity antenna or an antenna that acts based on similar operating principle to the self-similarity antenna. A signal line F211of a coaxial cable F214is conductively connected to the proximal end portion of the one second element, as illustrated inFIG.33D. A ground line F212of the coaxial cable F214is conductively connected to the proximal end portion of the other second element. This enables the pair of second elements to act as two dipole antennas. A ferrite core F213is attached to the coaxial cable F214. In the coaxial cable F214, a connection point with the second elements is regarded as a feed point K2, and an end portion opposite to the feed point K2 is regarded as an output end. As illustrated inFIG.33E, a split ring is formed between an open end portion (for example, the open end portion1012j) of the arm of the first element on the front surface side of the board PCB3and an open end portion (for example, the open end portion2012j) of the arm of the second element on the rear surface side of the board PCB3, the arm of the second element being closest to the arm of the first element. Therefore, the first element and the second element are not conductively connected to each other, but are capacitively coupled, and act as a loop antenna. The antenna characteristics of the antenna unit of the seventh embodiment will be described.FIG.34Ais a graph showing a VSWR characteristic of the output end of the coaxial cable F114, andFIG.34Bis a graph showing a VSWR characteristic of the output end of the coaxial cable F214.FIG.34Cis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F114, andFIG.34Dis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). Additionally,FIG.34Eis a graph showing a passing power characteristic from the output end of the coaxial cable F114to the output end of the coaxial cable F214, andFIG.34Fis a graph showing a passing power characteristic from the output end of the coaxial cable F214to the output end of the coaxial cable F114. The vertical axis ofFIG.34Erepresents 20 Log|S21| (dB), the vertical axis ofFIG.34Frepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.34E and34Frepresents a frequency (MHz).FIG.34Gis a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the output end of the coaxial cable F114in the arrangement ofFIG.33A.FIG.34His a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). As can been understood from these antenna characteristics, as shown inFIG.33F, although the square-shaped antenna unit has an extremely small size having one side length of 87 mm and is formed in a thin profile having a thickness in which a thickness of a printed portion is added to 0.8 mm, it can be used and practically used in a low frequency region including 698 MHz and the frequencies before and after 698 MHz, for example. In the seventh embodiment, the description has been made assuming that the first elements and the second elements are formed on the front surface and rear surface of one board, respectively, but they may be formed using two boards. That is, the pair of first elements are formed by a conductive pattern on a first surface of one of the boards, and the pair of second elements are formed by a conductive pattern on a second surface of the other board facing the first surface, so that the conductive patterns may be conductively connected to each other through a conductive through hole or the like. Modification Example of Seventh Embodiment In the seventh embodiment, the description has been made assuming that there is not conductive connection (a split ring is formed) between an open end portion (for example, the open end portion1012j) of the arm of the first element on the front surface side of the board PCB3and an open end portion (for example, the open end portion2012j) of the arm of the second element on the rear surface side of the board PCB3, the arm of the second element being closest to the arm of the first element. Hereinafter, as the modification example, the description will be made assuming that an open end portion (for example, the open end portion1012j) of the arm of the first element on the front surface side of the board PCB3is conductively connected to an open end portion (for example, the open end portion2012j) of the arm of the second element on the rear surface side of the board PCB3, the arm of the second element being closest to the arm of the first element. The conductive connection between the open end portion (for example, the open end portion1012j) of the arm of the first element on the front surface side of the board PCB3and the open end portion (for example, the open end portion2012j) of the arm of the second element on the rear surface side of the board PCB3, the arm of the second element being closest to the arm of the first element, can be performed by solder, conductive via holes, or the like. FIGS.35A to35Heach show antenna characteristics of the antenna unit of the modification example of the seventh embodiment. The measurement conditions are similar to those of the seventh embodiment.FIG.35Ais a graph showing a VSWR characteristic of the output end of the coaxial cable F114, andFIG.35Bis a graph showing a VSWR characteristic of the output end of the coaxial cable F214.FIG.35Cis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F114, andFIG.35Dis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). Additionally,FIG.35Eis a graph showing a passing power characteristic from the output end of the coaxial cable F114to the output end of the coaxial cable F214, andFIG.35Fis a graph showing a passing power characteristic from the output end of the coaxial cable F214to the output end of the coaxial cable F114. The vertical axis ofFIG.35Erepresents 20 Log|S21| (dB), the vertical axis ofFIG.35Frepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.35E and35Frepresents a frequency (MHz).FIG.35Gis a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the output end of the coaxial cable F114in the arrangement ofFIG.33A.FIG.35His a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). As can been understood from the VSWR characteristics of the antenna, in the antenna of the seventh embodiment, the available frequency band is expanded to the frequency band of less than about 1 GHz as compared between the case where the open end portions of the arms that are closest to each other are conductively connected to each other and the case where the open end portions of the arms that are closest to each other are not conductively connected to each other as in the antenna unit of the seventh embodiment. Eighth Embodiment In an eighth embodiment, the description will be made about an antenna unit having a configuration in which the open end portion of the first element on the front surface of the board is conductively connected to the open end portion of the second element of the rear surface of the board, the open end portion of the second element being closest to the open end portion of the first element, in the antenna unit of the sixth embodiment.FIG.36Ais a perspective view illustrating an example of an overall configuration of the antenna unit of the eighth embodiment,FIG.36Bis a front view illustrating a feeding state of a pair of first elements, andFIG.36Cis a front view illustrating a feeding state of a pair of second elements. The antenna unit of the eighth embodiment is different from the antenna unit of the sixth embodiment in that no split ring is formed between the open end portion of the first element on the front surface of the board and the open end portion of the second element on the rear surface of the board, the open end portion of the second element being closest to the open end portion of the first element, that is, the first end portions in the open end portions that are closest to each other are conductively connected to each other, and in that the second end portions1012f,1012g,1022f, and1022gof the first elements and the second end portions2012f,2012g,2022f, and2022gof the second elements are not provided, the second end portions being formed on the surfaces parallel to the board PB1by being bent from the respective first end portions and having a substantially triangular shape. The antenna characteristics of the antenna unit of the eighth embodiment are as shown inFIGS.37A to37H. The measurement conditions are similar to those of the sixth embodiment.FIG.37Ais a graph showing a VSWR characteristic of the output end of the coaxial cable F114, andFIG.37Bis a graph showing a VSWR characteristic of the output end of the coaxial cable F214.FIG.37Cis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F114, andFIG.37Dis a graph showing a radiation efficiency characteristic of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). Additionally,FIG.37Eis a graph showing a passing power characteristic from the output end of the coaxial cable F114to the output end of the coaxial cable F214, andFIG.37Fis a graph showing a passing power characteristic from the output end of the coaxial cable F214to the output end of the coaxial cable F114. The vertical axis ofFIG.37Erepresents 20 Log|S211 (dB), the vertical axis ofFIG.37Frepresents 20 Log|S12| (dB), and each horizontal axis ofFIGS.37E and37Frepresents a frequency (MHz).FIG.37Gis a graph showing an average gain characteristic in a horizontal plane (x-y plane) of the output end of the coaxial cable F114in the arrangement ofFIG.36A.FIG.37His a graph showing an average gain characteristic in the horizontal plane (x-y plane) of the output end of the coaxial cable F214. In each of the graphs, the horizontal axis represents a frequency (MHz). As can been understood from the VSWR characteristics of the antenna, in the antenna of the eighth embodiment, the available frequency band is expanded to the frequency band of less than about 1 GHz as compared between the antenna unit of the eighth embodiment in which the open end portions of the arms that are closest to each other are conductively connected to each other and the antenna unit of the sixth embodiment in which the open end portions of the arms that are closest to each other are not conductively connected to each other. Ninth Embodiment In a ninth embodiment, a structure of assembly of an antenna unit in a case and a feeding system of the antenna unit will be described in detail. Here, not the case10illustrated inFIGS.1A and1Bbut a combination type case illustrated inFIGS.38to40will be described. The case is made of a plastic having electric wave permeability. As seen inFIG.38, which is a diagram including a front view, a rear view, a plan view, a bottom view, a right-side view, and a left-side view of the case, and as seen in an exploded view illustrated inFIG.39, the case includes a first case body10aand a second case body10bin which respective open ends seal an accommodation space therein, the case body10aand the second case body10bhaving a substantially rectangular shape.FIG.40Ais a perspective view of an inside of the first case body10ain a state in which the pair of first elements are fixed, when viewed from the rear side.FIG.40Bis a front view of the inside of the first case body10a.FIG.40Cis a perspective view of an inside of the second case body10bin a state in which the pair of second elements are fixed.FIG.40Dis a front view of the inside of the second case body10b. Four screw receiving bosses10a1to10a4in which screw receiving portions are threaded are formed in the second case body10b. The sealing is performed by inserting and tightening screws10cfrom a rear surface of the second case body10b, but may be performed using an adhesive. The size of the first case body10aand the second case body10bafter the sealing is 60 mm in long side, 80 mm in short side, and 15 mm in thickness, which size does not include the coaxial cables F114, F214exposed. The antenna unit to be accommodated in the case bodies10aand10bis the antenna unit of the sixth embodiment that is partially changed in shape. That is, in the pair of first elements, a pair of through holes are formed at or near both ends of the proximal end region101eon the board PB1. A pair of through holes are also formed at or near both ends of the proximal end region102eon the board PB1. Metal pawls PB to PB are formed integrally on the proximal end portions of the extending regions101f,101g,102f, and102geach formed by a sheet metal, the pawls PB1ato PB1dpassing through the above-described respective through holes, and then being deformable (bendable) at or near the respective distal ends thereof. After passing through the respective through holes, the pawls PB to PB are bent at or near the respective distal ends thereof above the proximal end regions101eand102eof the board PB1. In this way, the extending regions101fand101gand the extending regions102fand102gare fixed to the proximal end region101eand the proximal end region102eon the board PB1, respectively, in a state in which the extending regions101fand101gand the extending regions102fand102gare conductively connected to the proximal end region101eand the proximal end region102e, respectively. At this time, the pawls PB1ato PB1dmay be fixed to the proximal end regions101eand102eby solder. As described above, the impedance matching circuit is not mounted on the board PB1, and the signal line and the ground line of the coaxial cable F114are directly connected to one and the other of the proximal end regions101eand102e. The coaxial cable F114is fixed to a side close to one end of short sides of the first case body10atogether with the ferrite core F113. The first end portions1011f,1011g,1021f, and1021gand the second end portions1012f,1012g,1022f, and1022geach are formed in a shape along the bottom surface or side surface of the first case body10a. The length of the board PB1and the length of the extending regions101fand101gor the extending regions102fand102gare longer than a configuration corresponding to each configuration in the second elements. On the other hand, in each of the extending regions101f,101g,102f, and102g, the length of a portion (region after branching) branching off from and extending in a direction away from the corresponding proximal end region101e,102eis shorter than the configuration corresponding to each configuration in the second element. As described above, in the second end portions1012f,1012g,1022f, and1022g, facing tip portions of the second end portions1012fand1012gand facing tip portions of the second end portions1022fand1022gare partially changed to be formed in a substantially trapezoidal shape, since the capacitive and inducibility are adjusted to secure a desired frequency band. The pair of second elements are accommodated in the second case body10bhaving the structure almost similar to the first case body. That is, in the pair of second elements, a pair of through holes are formed at or near both ends of the proximal end region201eon the board PB2. A pair of through holes are also formed at or near both ends of the proximal end region202eon the board PB2. Metal pawls PB2ato PB2dare formed integrally on the proximal end portions of the extending regions201f,201g,202f, and202geach formed by a sheet metal, the pawls PB2ato PB2dpassing through the above-described respective through holes. After passing through the respective through holes, the pawls PB2ato PB2dare bent at or near the respective distal ends thereof above the proximal end regions201eand202eof the board PB2. In this way, the extending regions201fand201gand the extending regions202fand202gare fixed to the proximal end region201eand the proximal end region202eon the board PB2, respectively, in a state in which the extending regions201fand201gand the extending regions202fand202gare conductively connected to the proximal end region201eand the proximal end region202e, respectively. At this time, the pawls PB2ato PB2dmay be fixed to the proximal end regions201eand202eby solder. The impedance matching circuit is not mounted on the board PB1, and the signal line and the ground line of the coaxial cable F214are directly connected to one and the other of the proximal end regions201eand202e. The coaxial cable F214is fixed to a side close to the other end of short sides of the second case body10btogether with the ferrite core F213. In this way, the direct distance from the coaxial cable F114is kept as far as possible. The first end portions2011f,2011g,2021f, and2021gand the second end portions2012f,2012g,2022f, and2022geach are formed in a shape along the bottom surface or side surface of the second case body10b. As described above, in the second end portions2012f,2012g,2022f, and2022g, facing tip portions of the second end portions2012fand2012gand facing tip portions of the second end portions2022fand2022gare partially changed to be formed in a substantially trapezoidal shape, since the capacitive and inducibility are adjusted to secure a desired frequency band. In the pair of first elements and the pair of second elements, the open end portions (for example, the second end portion1012fand the second end portion20220that are closest to each other are not conductively connected to each other, and act as a split ring. That is, such open end portions are capacitively coupled, and act as a loop antenna. As described above, the antenna unit of the embodiment operates on different operating principles according to a frequency band to be used or in a state in which the different operating principles are combined. For example, in a frequency band in which the first end portions1011f,1011g,1021f, and1021gand the second end portions1012f,1012g,1022f, and1022gof the pair of first elements and the first end portions2011f,2011g,2021f, and2021gand the second end portions2012f,2012g,2022f, and2022gof the pair of second elements are capacitively coupled, the pair of first elements and the pair of second elements integrally act as a loop antenna (operation A). The pair of first elements and the pair of second elements act as two dipole antennas, respectively (operation B). In this case, as, in the two extending regions101fand101gand two extending regions102fand102geach formed by a sheet metal, the length of the portion branching off from and extending in a direction away from the respective proximal end regions101eand102eis increased, the antenna characteristics (VSWR and the like) in the middle frequency band are shifted to the low frequency side. That is, the frequency band in which the antenna characteristics are stable is expanded. Furthermore, the proximal end region101eand the extending regions101fand101g, and the proximal end region102eand the extending regions102fand102gact as two tapered-slot antennas (operation C). In this case, as the lengths of the boards PB1and PB2and the lengths of the two extending regions101fand101gand the two extending regions102fand102g, which extend while facing, are increased, the antenna characteristics (VSWR and the like) in the high frequency range approaches those in the low frequency side. That is, the frequency band in which the antenna characteristics are stable is expanded. In this way, the antenna device having one antenna unit acts mainly as a loop antenna in the low-frequency band side, acts mainly as a dipole antenna in the middle frequency band side, and acts mainly as a tapered-slot antenna in the high-frequency band side. In the mid-frequency band, the antenna device acts as a complex antenna in which their operating principles are combined. That is, in a range from the low frequency band to the middle frequency band, the antenna device acts mainly as the complex antenna in which the operating principle of the loop antenna and the operation principle of the dipole antenna are combined. In a range from the middle frequency band to the high frequency band, the antenna device acts mainly as the complex antenna in which the operating principle of the dipole antenna and the operating principle of the tapered-slot antenna are combined. The coaxial cable F114connected to the pair of first elements and the coaxial cable F214connected to the pair of second elements are fixed at respective locations farthest from each other in the first case body10aand the second case body10b, and are used outside the first case body10aand the second case body10b, in a state of being separated from each other. This can reduce mutual interference of unnecessary radio waves caused by current flowing the outer jackets of the coaxial cables F114and F214. In the case where the ferrite cores F113and F213are not attached to the coaxial cables F114and F214, respectively, the radiation efficiency is reduced in the lowest frequency side of the available frequency band, but the antenna device is operable. Therefore, the antenna device may be used without attaching the ferrite cores F113and F213to the coaxial cables F114and F214, in applications that allow the reduction of the radiation efficiency in the low frequency band. In the ninth embodiment, feeding ports are provided to the first element and the second element, respectively, and the coaxial cables F114and F214are connected to the respective feeding ports. In other words, the antenna device including the antenna unit of the ninth embodiment includes the ports, and the feeding coaxial cables F114and F214are connected to the two ports, respectively. However, when the branch circuit is mounted, the antenna device is operable by feeding with one coaxial cable. In this case, it is necessary to detach the coaxial cable connected to any one of the two ports. The description has been made assuming that the lengths of the boards PB1and PB2, and the lengths of extending regions101f,101g,102f,102g,201f,201g,202f, and202gare different between the pair of first elements and the pair of second elements, but the present invention is not limited thereto. For example, in the case where the first case body10aand the second case body10bhave a substantially square shape, these lengths may be the same between the pair of first elements and the pair of second elements. | 99,168 |
11862860 | DETAILED DESCRIPTION Disclosed herein are technologies for wireless mesh networks that serve as the basis for communication systems configured to provide various types of services to end users, including but not limited to telecommunication services such as high-speed internet. For instance, the wireless mesh network technologies disclosed herein may form the basis for a data communication system capable of providing multigigabit internet speeds through a mesh network of infrastructure nodes interconnected via wireless point-to-point (ptp) and/or point-to-multipoint (ptmp) links, such as the example communication system100illustrated inFIG.1. As shown, communication system100inFIG.1includes Tower/fiber access points101and102, which may each also be referred to as a fiber Point of Presence (“PoP”). Tower/fiber access points101and102can be co-located or can be located at different physical locations. Tower/fiber access points101and102have access to a high-bandwidth dark (or lit) fiber capable of providing up to several hundred gigabits/second of data throughput. Tower/fiber access points101and102provide backhaul connectivity to a core network/data center (not shown in theFIG.1for the sake of simplicity). In accordance with the present disclosure, Tower/Fiber access points101and102may host respective wireless communication equipment that enables Tower/Fiber access points101and102to operate as wireless communication nodes of a wireless mesh network. In this respect, the Tower/Fiber access points101and102that are installed with the wireless communication equipment for operating as wireless mesh nodes may each be referred to herein as a “fiber PoP node” of the wireless mesh network shown inFIG.1. For instance, as shown, Tower/Fiber access points101and102may host respective sets of wireless communication equipment122and123for establishing ptp links with a next tier of wireless communication nodes in the wireless mesh network (which, as noted below, may be referred to as the “seed nodes” of the wireless communication network). The respective sets of wireless communication equipment121and124are capable of reception and transmission of high bandwidth (multiple gigahertz) signals operating at very high frequencies (e.g., 6 Ghz˜100 Ghz such as 28 Ghz, V band, E band, etc.). The respective sets of wireless communication equipment121and124may each comprise a baseband/digital unit equipped with components including but not limited to a processor, memory, etc. The respective sets of wireless communication equipment121and124also each comprise an RF unit and an antenna unit for establishing at least one ptp link with another wireless communication node of the wireless mesh network. In at least some embodiments, the antenna subsystem of each respective set of wireless communication equipment121and124is capable of reception and transmission of directional signals where a significant portion of the signal energy is concentrated within a few degrees around the antenna boresight (e.g., within a range of 0.5 degrees to 5 degrees), both in vertical and horizontal directions, in contrast to omni directional antennas where signal energy is close to evenly spread across 360° degrees. As further shown inFIG.1, communication system100includes seed homes111and115. Examples of seed homes include detached single-family homes, non-detached residential buildings such as multi-dwelling units (MDUs), commercial buildings such as small/medium businesses (SMB), or some other private property or infrastructure, where communication equipment can be deployed on rooftops of such seed homes among other possibilities. (In this respect, it will be appreciated that a “seed home” need not necessarily be a residential home.) In accordance with the present disclosure, seed homes111and115may host respective wireless communication equipment that enables seed homes111and115to operate as wireless communication nodes of a wireless mesh network. In this respect, the seed homes111and115that are installed with the respective wireless communication equipment for operating as wireless mesh nodes may each be referred to herein as a “seed node” of the wireless mesh network shown inFIG.1. For instance, as shown inFIG.1, seed homes111and115may host respective sets of wireless communication equipment122and123for establishing ptp links with the fiber PoP nodes of the wireless mesh network, which may be considered a different tier of the wireless mesh network. The respective sets of wireless communication equipment122and123are each capable of reception and transmission of high bandwidth (multiple gigahertz) signals operating at very high frequencies (e.g., 6 Ghz˜100 Ghz such as 28 Ghz, V band, E band, etc.), which are commonly referred to as millimeter-wave frequencies. The respective sets of wireless communication equipment122and123may each comprise a baseband/digital unit equipped with components including but not limited to a processor, memory, etc. The respective sets of wireless communication equipment122and123may also comprise an RF unit and antenna unit for establishing at least one ptp link with another wireless communication node in the wireless mesh network. In at least some embodiments, the antenna subsystem of each respective set of wireless communication equipment122and123may be capable of reception and transmission of directional signals where a significant portion of the signal energy is concentrated within a few degrees around the antenna boresight (e.g., within a range of 0.5 degrees to 5 degrees), both in vertical and horizontal directions, in contrast to omni directional antennas where signal energy is close to evenly spread across 360° degrees. For example, wireless communication equipment121residing at Tower/fiber access point101and wireless communication equipment122residing at seed home111may work together to form a bi-directional high-bandwidth communication ptp data link141that provides connectivity between Tower/fiber access point101and seed home111. Similarly, wireless communication equipment124residing at Tower/fiber access point102and wireless communication equipment123residing at seed home115may work together to form a bi-directional high-bandwidth communication ptp data link142that provides connectivity between Tower/fiber access point102and seed home115. As further shown inFIG.1, seed homes111and115, in addition to wireless communication equipment122and123, may also host respective, second sets of wireless communication equipment131and135for establishing ptp and/or ptmp links with a next tier of wireless communication nodes in the wireless mesh network (which, as noted below, may be referred to as “anchor nodes” of the wireless mesh network). In the example ofFIG.1, the respective, second sets of wireless communication equipment131and135may each comprise multiple independent transmission/reception submodules for establishing multiple ptp and/or ptmp links, which may also be referred to as “radio modules.” However, it should be understood that the respective, second sets of wireless communication equipment131and135could also each comprise a single radio module for establishing a single ptp or ptmp link, as opposed to multiple radio modules. Each module of the respective, second sets of wireless communication equipment131and135is capable of reception and transmission of high bandwidth (multiple gigahertz) signals operating at very high frequencies (e.g., 6 Ghz˜100 Ghz such as 28 Ghz, V band, E band, etc.), which as noted above are commonly referred to as millimeter-wave frequencies. Each module of the respective, second sets of wireless communication equipment131and135comprises an independent baseband/digital unit equipped with components including but not limited to a processor, memory, etc. Each module in the respective, second sets of wireless communication equipment131and135also comprises an independent RF unit and independent antenna unit for establishing at least one ptp link or ptmp link with another wireless communication node (or perhaps multiple other wireless communication nodes) in the wireless mesh network. In at least some embodiments, the antenna subsystem of one or more modules of the second set of wireless communication equipment131may be a ptp antenna unit that is capable of reception and transmission of directional signals where a significant portion of the signal energy is concentrated within a few degrees around the antenna boresight (e.g., within a range of 0.5 degrees to 5 degrees), both in vertical and horizontal directions, in contrast to omni directional antennas where signal energy is close to evenly spread across 360° degrees. However, in other embodiments, the antenna subsystem of one or more modules of the second set of wireless communication equipment131may be a ptmp antenna unit that is capable of beamforming and creating multiple beams simultaneously in different directions. As described in further detail below, the second set of wireless communication equipment131may take various other forms as well. Communication system100also includes multiple anchor homes112,113and114. As with seed homes111and115, anchor homes112,113and114may include detached single-family homes, non-detached residential buildings such as MDUs, commercial buildings such as SMBs, or some other private property or infrastructure, where wireless communication equipment can be deployed on rooftops of such anchor homes among other possibilities. (In this respect, it will be appreciated that an “anchor home” need not necessarily be a residential home.) Further, as with seed homes111and115, anchor homes112,113and114may host respective wireless communication equipment that enables anchor homes112,113and114to operate as wireless communication nodes of a wireless mesh network. However, unlike seed homes111and115, anchor homes are generally not installed with wireless communication equipment that provides a direct wireless connectivity to any Tower/Fiber access point. Instead, anchor homes112,113and114are typically only installed with wireless communication equipment for establishing ptp and/or ptmp links with seed nodes and/or with other wireless communication nodes in the same tier of the wireless mesh network, where such wireless communication equipment may be similar to the respective, second sets of wireless communication equipment131and135for establishing ptp and/or ptmp links that is installed at each of the seed homes111and115. The anchor homes112,113and114that are installed with the respective wireless communication equipment for operating as wireless mesh nodes may each be referred to herein as an “anchor node” of the wireless mesh network shown inFIG.1. For example, anchor home112hosts wireless communication equipment132. A first module of wireless communication equipment132residing at anchor home112and another module of wireless communication equipment131residing at seed home111may work together to form a bi-directional high bandwidth communication ptp data link151that provides wireless connectivity between seed home111and anchor home112. Similarly, as another example, a second module of wireless communication equipment132residing at anchor home112and a module of wireless communication equipment133residing at anchor home113may work together to form a bi-directional high bandwidth communication ptp data link153that provides wireless connectivity between anchor home112and anchor home113. As yet another example, a third module of wireless communication equipment132residing at anchor home112and a module of wireless communication equipment135residing at seed home115may work together to form a bi-directional high bandwidth communication ptp data link154that provides wireless connectivity between anchor home112and seed home115. As a further example, another module of wireless communication equipment131residing at seed home111and a module of wireless communication equipment134residing at anchor home114work together to form a bi-directional high bandwidth communication ptp data link152that provides wireless connectivity between anchor home114and seed home111. As still another example, another module of wireless communication equipment134residing at anchor home114and a module of wireless communication equipment135residing at seed home115may work together to form a bi-directional high bandwidth communication ptp data link155that provides wireless connectivity between anchor home114and seed home115. Other examples are possible as well. Bi-directional communication links141,142,151,152,153,154&155shown inFIG.1can use various different multiple access schemes for transmission and reception including but not limited to frequency division multiple access (FDMA), time division multiple access (TDMA), single carrier FDMA (SC-FDMA), single carrier TDMA (SC-TDMA), code division multiple access (CDMA), orthogonal frequency division multiple access (OFDMA), and/or non-orthogonal multiple access (NOMA) as described in various generations of communication technologies including 1 G, 2 G, 3 G, 4 G, 5 G and 6 G, etc. Further, in at least some embodiments, bi-directional communication links141,142,151,152,153,154&155may each comprise a millimeter-wave link. Further yet, bi-directional communication links141,142,151,152,153,154&155formed by a set of communication nodes comprising two or more of121,122,123,124,131,132,133,134, and/or135are capable of data information transfer via a variety of digital transmission schemes, including but not limited to amplitude modulation (AM), phase modulation (PM), pulse amplitude modulation/quadrature amplitude modulation (PAM/QAM), and/or ultra-wide band (UWB) pulse modulation (pico-second pulses), etc. InFIG.1, two Tower/fiber access points101&102, two seed homes111&115and three anchor homes112,113&114and seven bi-directional ptp data links141,142,151,152,153,154&155are shown to illustrate an example of a communication system that is based on the wireless mesh network technologies disclosed herein. However, in general, it should be understood that communication system100can include a different number of Tower/fiber PoP nodes, seed nodes, anchor nodes, and/or communication links, which may depend on the specific layout of a particular instantiation of the communication system deployed in the field. Similarly, although,FIG.1shows a particular arrangement of communication equipment121,122,123&124that provides connectivity between a Tower/fiber access point (e.g., Tower/fiber access points101,102) and a seed home, as well as a particular arrangement of communication equipment131,132,133,134&135that provides connectivity between two anchor homes or between an anchor and a seed home, the wireless communication equipment that is installed at the nodes of a wireless mesh network can vary from one communication system to another communication system, which may depend on the specific size and layout of a particular instantiation of the communication system. It should also be understood that communication system100may also contain other nodes (e.g., network switches/routers, etc.) that are omitted here for the sake of simplicity. In line with the discussion above, communication system100ofFIG.1may be utilized to provide any of various types of services to end users, including but not limited to telecommunication services such as high-speed interne. In this respect, it should be understood that one pool of end users of the service(s) provided by communication system100may be individuals that reside (or work) at the seed homes and anchor homes ofFIG.1. Additionally, although not shown inFIG.1, it should be understood that communication system ofFIG.1may also include client nodes that connect to certain nodes of the communication system (e.g., anchor nodes) via wireless ptp or ptmp links so as to enable other end users to receive the service(s) provided by communication system100. These client nodes may take various forms, examples of which may include fixed-location customer premise equipment (CPE) and mobile computing devices, among other possibilities. Referring toFIG.2, one possible example of a wireless communication node ofFIG.1is shown as a wireless communication node200installed with wireless communication equipment that comprises a module labelled as “Module A,” which is one type of ptp radio module. As shown, Module A comprises a base band unit or digital unit201which runs the physical layer level protocol including digital modulation/demodulation (modem) and other higher layer protocols such as a MAC layer, etc. Base band unit201interacts with other nodes of a communication system that are external to the node at which the wireless communication equipment200is installed via a wired medium. Module A also includes RF unit202which, among other things, performs processing of intermediate frequency (IF) signals and defines the frequency range of the radio signals that can be transmitted or received via Module A. RF unit202is capable of operating over a wide range of frequencies (e.g., V band frequencies ranging from 57 Ghz to 71 Ghz). Further, as shown, Module A also comprises antenna unit203which performs the transmission and reception of over the air radio signals. Antenna unit203is capable of transmitting and receiving extremely narrow beam of signals. Antenna unit203may be constructed with metamaterials that have excellent properties of controlling the directionality of radio signals that cannot be exhibited by ordinary antennas. Module A with the help of antenna unit203is capable of establishing ptp links with a different module residing at a different node of the communication system. Referring toFIG.3, an example of an antenna pattern of Module A created by antenna unit203is shown. It can be seen from the antenna pattern inFIG.3that the beam width of antenna unit203of Module A is extremely narrow (less than a degree) and the side lobe power levels start to drop at a rapid rate. For instance, as shown, approximately 5-6 degrees from the main lobe, power levels may drop by more than 30 dB. It should be understood that the antenna pattern of antenna unit203shown inFIG.3is just one example showing the extremely narrow beam antenna pattern generation capability of Module A. In other instances, due to a change in antenna elements, size, frequency, etc., different patterns may be generated. Further, while Module A can be constructed using metamaterials described above, it should be understood that Module A can be constructed using a parabolic antenna or other types of antennas. However, it should be understood that the main characteristic of generation of extremely narrow antenna beam pattern is common to all the instances of Module A. Referring toFIG.4, a ptp wireless communication link400established between two wireless communication nodes401and402is shown. Wireless communication nodes401and402each host a single communication module (i.e., “Module A”) that may take the form similar to Module A depicted inFIG.2and described above. As shown inFIG.4, due to the antenna unit characteristics of each respective Module A in the wireless communication nodes401and402, the bi-directional ptp link400may have an extremely narrow beam. This transmission and reception capability of radio signals over an extremely narrow beam via ptp link400provides interference immunity in scenarios where there are a large number of wireless communication links established by multiple wireless communication nodes concentrated in a small area and operating in the same frequency. In some implementations, Module A can additionally provide beam steerability characteristics in addition to the capability of transmitting and receiving data over extremely narrow beams as explained above and illustrated in the context ofFIGS.2-4. For example, referring toFIG.5, a wireless communication node501comprising Module A, a second wireless communication node502comprising Module A, and a third wireless communication node503comprising Module A is shown. During time T1, Module A of wireless communication node501and Module A of wireless communication node502work together to establish an extremely narrow beam based bi-directional link500for the exchange of information data between wireless communication nodes501and502. Due to some trigger, Module A of wireless communication node501may invoke the beam steering capability of the module and change the direction of the antenna transmission and reception beam towards wireless communication node503and work together with Module A of wireless communication node503to dynamically establish a bi-directional extremely narrow beam-based link500between wireless communication node501and wireless communication node503during time T2. The trigger for this beam steering can be due to changes in the link condition between wireless communication node501and wireless communication node502, which may involve various factors, including but not limited to, a change from a LOS path to a non-LOS path due to a change in environment, increased interference, a change in a position of wireless communication node502with respect to wireless communication node501, and/or instructions from higher layers, etc. In one embodiment, wireless communication node503can be different than wireless communication node502. In another embodiment, wireless communication node503can be the same as wireless communication node502but in a different physical location. In some embodiments, wireless communication nodes defined above and discussed in the context ofFIGS.2-5can host more than one module. This allows a wireless communication node to communicate simultaneously with multiple other wireless communication nodes of the communication system by establishing multiple extremely narrow beam bi-directional links with the help of multiple modules (e.g., multiple Module As) belonging to different wireless communication nodes working together. As one example to illustrate, referring toFIG.6, wireless communication nodes601and602each host two Module As labeled “1” and “2,” while wireless communication nodes603and604each host a single Module A. As shown, a Pt Module A of wireless communication node601and a 1stModule A of wireless communication node602work together to establish extremely narrow bi-directional beam-based link600to provide a wireless connection between wireless communication node601and602. Similarly, a 2ndModule A of wireless communication node601and602and a 1st(and only) Module A of wireless communication nodes603and604respectively work together to establish extremely narrow bi-directional beam-based links610and620to provide wireless connections between wireless communication nodes601-603and602-604, respectively. In one embodiment, the 1stand 2ndModule A of wireless communication nodes601and602can be inside the same physical enclosure and in other embodiments, the 1stModule A of wireless communication nodes601and603can be inside one physical enclosure and the 2ndModule A of wireless communication nodes601and603can be inside a different physical enclosure. In embodiments where different Module As belonging to the same wireless communication node are contained in separate physical enclosures, these Module As can be connected via a wired link as they are co-located in the same seed home or anchor home. InFIG.6, a maximum of two Module As are shown to be contained in a wireless communication node that enables the wireless communication node to establish two independent bi-directional links with different wireless communication nodes simultaneously. However, it should be understood that a wireless communication node can host more than two Module As and the maximum number of Module As that a wireless communication node can host may depend on the maximum total power available to the wireless communication node. Further, it should be understood that in one embodiment, all Module As belonging to the same wireless communication node may operate on the same carrier frequencies of a frequency band, and in other embodiments, different Module As belonging to same wireless communication node may operate on different carrier frequencies of a frequency band. Referring toFIG.7, another possible example of a wireless communication node ofFIG.1is shown as a wireless communication node700installed with wireless communication equipment that comprises a single module labeled as “Module B,” which is one type of ptmp radio module. For purposes of illustration only, wireless communication node700ofFIG.7is shown to be engaging in over-the-air transmission and/or reception with multiple other wireless communication nodes710to7N0. Module B comprises base band unit or digital unit701which runs the physical layer level protocol including digital modulation/demodulation (modem) and other higher layer protocols such as a MAC layer, etc. Base band unit701interacts with other nodes of a communication system that are external to the node at which the wireless communication node700is installed via wired medium. Module B also includes RF unit702, which among other things processes IF signals and defines the frequency range of the radio signals that can be transmitted or received with Module B. RF unit702is capable of operating over a wide range of frequencies (e.g., V band frequencies ranging from 57 Ghz to 71 Ghz). Further, Module B comprises antenna unit703, which performs the transmission and reception of over the air radio signals. Antenna unit703may be an active antenna system (AAS) that comprises a phased array of transmitters and receivers that are capable of beamforming and creating multiple beams simultaneously in different directions. By virtue of the simultaneous creation of multiple beams in different directions, AAS of antenna unit703enables the wireless communication node700to establish ptmp wireless communication links with multiple wireless communication nodes. Hence Module B with the help of antenna unit703is capable of establishing ptmp links with a different module residing in a different wireless communication node. As further shown inFIG.7, Module B residing in wireless communication node700is shown to create1to N multiple beams with the help of AAS of antenna unit703. Value N depends on the number of transmit and receive antennas in AAS of antenna unit703. Specifically, it can be seen that wireless communication unit700is connected to wireless communication unit710, wireless communication unit720, and wireless communication unit7N0via bi-directional beam1, beam2and beam N respectively. It can also be seen from the antenna pattern inFIG.7that the beam width of the ptmp beams of antenna unit703of Module B are not extremely narrow (e.g., 3 dB beam width of 7˜10 degree) and side lobes power levels do not start to drop at a rapid rate, which is in contrast to the antenna pattern of the antenna unit belonging to Module A described above and discussed in the context ofFIGS.2-6. Further, Module B of wireless communication node700also differs from Module A (discussed above in the context ofFIGS.2-6) in that the multiple bi-directional links operate in a single frequency range at a given time. For example, signal beams1to N that connect wireless communication node700to wireless communication nodes710to7N0respectively may only operate within the same frequency range at a given instant of time. It is to be noted that at a different instant, all beams1to N can switch to operate at a frequency range different from the frequency range used in the previous time instant, however, frequency range of an individual beam remains the same as the frequency range of all the other N−1 beams at a given instant of time. Hence, with respect to Module B, although due to phased antenna arrays can create multiple beams to create point-to-multi point links to connect one wireless communication node with multiple wireless communication nodes as shown inFIG.7, an interference profile at the receiver side with such a ptmp arrangement is inferior to an interference profile of an arrangement where a wireless communication node hosts multiple Module As and creates multiple ptp links as shown inFIG.6, where wireless communication node601uses two Module As to connect to wireless communication node602and wireless communication node603simultaneously. The main reasons of high interference with Module B may be due to (1) individual phased antenna array-based beams that are not as narrow as extremely narrow beams generated by metamaterial-based antenna of Module A and/or (2) all beams of Module B belonging to one wireless communication unit that cannot operate at different frequency ranges unlike multiple ptp narrow beams of wireless communication node that host multiple Module As. Referring toFIG.8, still another possible example of a wireless communication node ofFIG.1is shown as a wireless communication node800installed with wireless communication equipment that comprises a module labeled as “Module C,” which is another type of ptp radio module. For purposes of illustration only, wireless communication node800ofFIG.8is shown to be engaging in over-the-air transmission and/or reception with another wireless communication node810that is also hosting a Module C type of ptp radio module. Module C comprises a base band unit or digital unit which runs the physical layer level protocol including digital modulation/demodulation (modem) and other higher layer protocols such as MAC layer etc. Module C's baseband unit interacts with other nodes of a communication system that are external to the wireless communication node800via wired medium. Module C also includes an ultra-wide band antenna embedded with the baseband unit. Module C is capable of generation, transmission, and reception of extremely short duration pulses (a few picoseconds long) and uses pulse modulation (and its variations such as pulse amplitude modulation, etc.) to transmit data at extremely high rates (e.g., greater than 100 Gbps) by transmitting signals over a very wide range of frequencies. In one embodiment, pulses used for communication by Module C can use frequencies ranging from few hundred megahertz to few hundred gigahertz. One of ordinary skill in the art will appreciate that the range of frequencies used by pulses generated by Module C of wireless communication unit800can take a different range as well. Moreover, multiple module Cs can be placed together to create a 1-, 2-, or 3-dimensional array. Elements of this array (e.g., module C) are capable of performing a time synchronized transmission for beam forming. This allows the RF signal energy of the Pico second/UWB pulses to focus in a desired (receiver) direction and can also enable the creation of null or low RF signal energy of the Pico second/UWB pulse in other directions to avoid interference. One fundamental difference between the characteristic of signals generated by Module C and signals generated by Module A and/or Module B is that these signals generated by Module C are ultra wide band (UWB) signals and their power spectral density over the entire range of frequencies is very low. In this respect, these UWB signals do not create interference with other signals operating on a narrow band of frequencies as these UWB signals are treated as noise by receivers of normal wireless communication nodes. As further shown inFIG.8, Module C of wireless communication node800and Module C of wireless communication unit810establish a link801by working together. As explained above, such a communication link801operates over an ultra-wide range of frequencies. However, even in the presence of other wireless communication nodes (not shown inFIG.8) such as wireless communication nodes with Module A or Module B that operate on a narrow band of frequencies compared to Module C of wireless communication node800, network performance is not impacted as power spectral density over the frequency range of communication link801that overlaps with frequency ranges on which a nearby wireless communication node using narrow band signals using for example Module A and/or Module B operates is very low and is treated as noise by the receivers of Module A and/or Module B. In another embodiment, and in line with the discussion above, a wireless communication node ofFIG.1can host multiple types of modules. This allows a wireless communication node to communicate simultaneously with multiple wireless communication nodes and with two different interference profiles. As one example to illustrate, referring toFIG.9, an example wireless communication node910is shown that hosts one Module A and one Module B. As shown inFIG.9, Module A of wireless communication node910and a communication module of an example wireless communication node920may work together to establish an extremely narrow bi-directional beam-based link901to provide wireless connection between wireless communication nodes910and920. Additionally, Module B of wireless communication node910, which is based on AAS and generates multiple beams simultaneously, may create a ptmp link that connects wireless communication node910with example wireless communication nodes930,940,950and960. Specifically, Module B of wireless communication node910coordinates with (1) a module of wireless communication node930to establish bi-directional beam902, (2) a module of wireless communication node940to establish bi-directional beam903, (3) a module of wireless communication node950to establish bi-directional beam904, and (4) a module of wireless communication node960to establish bi-directional beam905. In one embodiment, extremely narrow beam901and group of beams including902,903,904and905may all operate within the same range of carrier frequencies at a given time. In another embodiment, extremely narrow beam901may operate within a different range of frequencies compared to the range of frequencies used by the group of beams including902,903,904and905at a given time. In one embodiment, Module A and Module B of wireless communication node910can be inside the same physical enclosure. In other embodiments, Module A and Module B of wireless communication node910can be inside two separate physical enclosures. In such embodiments where Module A and Module B belong to the same wireless communication node contained in separate physical enclosures, Module A and Module B can be connected via a wired link as they are co-located in the same seed home or anchor home. InFIG.9, a total of two modules (i.e., a single Module A and a single Module B) are shown to be part of a wireless communication node910that enables the wireless communication node to establish two independent and different types of bi-directional links with different wireless communication nodes simultaneously. However, it should be understood that wireless communication node910can host more than two modules (e.g., a combination of one or more Module As and one or more Module Bs) and the maximum number of total modules that a wireless communication node can host may depend on various factors, including but not limited to the maximum total power available to the wireless communication node. Further, it should be understood that in one embodiment, all modules belonging to same wireless communication node may operate on the same carrier frequencies of a frequency band but in other embodiments, different modules belonging to the same wireless communication node may operate on different carrier frequencies of a frequency band. As noted above, a wireless communication node ofFIG.1can host more than one type of module. This allows a wireless communication node to communicate simultaneously with multiple wireless communication nodes and with different interference profiles. As another example to illustrate, referring toFIG.10, an example wireless communication node1010is shown that hosts one Module C and one Module B. As shown inFIG.10, Module C of wireless communication node1010and Module C of an example wireless communication node1020may work together to establish extremely high data rate ultra-wide frequency and low power spectral density beam-based link1001to provide wireless connection between wireless communication nodes1010and1020. Additionally, Module B of wireless communication node1010, which is based on AAS and generates multiple beams simultaneously, may create a ptmp link that connects wireless communication node1010with example wireless communication nodes1030,1040,1050and1060. Specifically, Module B of wireless communication node1010coordinates with (1) a module of wireless communication node1030to establish bi-directional beam1002, (2) a module of wireless communication node1040to establish bi-directional beam1003, (3) a module of wireless communication node1050to establish bi-directional beam1004, and (4) a module of wireless communication node1060to establish bi-directional beam1005. In one embodiment, Module C and Module B of wireless communication node1010can be inside same physical enclosure. In other embodiments, Module C and Module B of wireless communication node1010can be inside two separate physical enclosures. In such an embodiment where Module C and Module B belong to the same wireless communication node contained in separate physical enclosures, Module C and Module B can be connected via a wired link as they are co-located in same seed home or anchor home. InFIG.10, a total of two modules (i.e., a single Module C and a single Module B) are shown to be part of a wireless communication node1010that enables the wireless communication node to establish two independent and different types of bi-directional links with different wireless communication nodes simultaneously. However, it should be understood that wireless communication node1010can host more than two types of modules (e.g., a combination of Module A, Module B and/or Module C) and the maximum number of total modules that a wireless communication node can host may depend on various factors, including the maximum total power available to the wireless communication node. It should be also understood that in one embodiment, all modules belonging to same wireless communication node may operate on same carrier frequencies of a frequency band, while in other embodiments, different modules belonging to same wireless communication node may operate on different carrier frequencies of a frequency band. In another embodiment, a wireless communication node ofFIG.1can host more than one type of module and dynamically change the type of link between wireless communication nodes. This allows a wireless communication node to communicate simultaneously with multiple wireless communication nodes and with different interference profiles and to adapt with changes in the network environment. As one example to illustrate, referring toFIG.11A, an example wireless communication node1110is shown that hosts a Module C or Module A along with a Module B. During time T1, Module A/Module C of wireless communication node1110and a communication module of an example wireless communication node1120may work together to establish either an extremely high date rate ultra-wide frequency low power spectral density beam or an extremely narrow beam-based link1101to provide a wireless connection between wireless communication nodes1110and1120. At substantially the same time duration T1, Module B of wireless communication node1110, which is based on AAS and generates multiple beams simultaneously, may create a ptmp link that connects wireless communication node1110with example wireless communication nodes1130,1140,1150and1160. Specifically, Module B of wireless communication node1110coordinates with (1) a module of wireless communication node1130to establish bi-directional beam1102, (2) a module of wireless communication node1140to establish bi-directional beam1103, (3) a module of wireless communication node1150to establish bi-directional beam1104, and (4) a module of wireless communication node1160to establish bi-directional beam1105. Referring toFIG.11B, at a different time T2, due to some trigger, Module A/Module C of wireless communication node1110may dynamically switch its wireless link from wireless communication node1120to wireless communication node1140by steering the beam towards wireless communication node1140. At the same time or after receiving instructions from a higher layer, Module B of wireless communication node1110disconnects its link with wireless communication node1140via beam1103and generates a new beam1113in the direction of wireless communication node1120and establishes connection with wireless communication node1120. Trigger for this beam steering can be due to changes in the link condition between wireless communication node1110and wireless communication node1120or1140, which may involve various factors, including but not limited to change from a LOS path to a non-LOS path due to a change in environment, increased interference, a change in position of wireless communication node1120or1140with respect to wireless communication node1110, instructions from higher layers, etc. As shown inFIGS.11A-B, dynamic link switching may occur between wireless communication nodes1110,1120and1140. However, it should be understood that dynamic switching can also occur between different communication nodes. In some instances, one or more wireless communication nodes ofFIG.1may leave the wireless mesh network. In such case, links between nodes may be dropped and the communication network may dynamically re-align itself by adjusting/switching link types between the remaining number of wireless communication nodes in the wireless mesh network to best suit the needs to the wireless communication nodes and the wireless mesh network. In some embodiments, wireless communication nodes1120,1130,1140,1150and1160can host multiple modules of the same or different types. For example, one or more of wireless communication nodes1120,1130,1140,1150and1160can host one Module A and one Module B. Hence, when wireless communication node1110makes a ptp link using its Module A or Module C with a first communication module (e.g., Module A or C) of wireless communication nodes1120,1130,1140,1150and1160, then a second communication module (e.g., Module B) of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptmp wireless communication links with other modules of wireless communication nodes in the communication system that are not shown here. Similarly, when wireless communication node1110makes a ptmp link using its Module B with the first communication module (e.g., Module A or C) of wireless communication nodes1120,1130,1140,1150and1160, then the second communication module (e.g., Module B) of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptmp wireless communication links with other modules of wireless communication nodes in the communication system that are not shown here. As another example, one or more of wireless communication nodes1120,1130,1140,1150and1160can host two Module As or Module Cs. Hence, when wireless communication node1110makes a ptp link using its Module A or Module C with the first Module A or C of wireless communication nodes1120,1130,1140,1150and1160, then the second Module A or Module C of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptp wireless communication links with other modules of wireless communication nodes in the communication system that are not shown here. Similarly, when wireless communication node1110makes a ptmp links using its Module B with the first communication modules (Module A or C) of wireless communication nodes1120,1130,1140,1150and1160, then the second Module A or C of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptp wireless communication links with other modules of wireless communication nodes in the communication system that are not shown here. As yet another example, wireless communication nodes1120,1130,1140,1150and1160can host multiple Module As or Module Cs and a Module B. For instance, one or more of wireless communication nodes1120,1130,1140,1150and1160can host two Module As or Module Cs and one Module B. Hence, when wireless communication node1110makes a ptp link using its Module A or Module C with a first Module A or C of wireless communication nodes1120,1130,1140,1150and1160, then a second Module A or Module C of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptp wireless communication links with a third communication module (e.g., Module B) of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptmp wireless communication links with other modules of wireless communication nodes in the wireless mesh network that are not shown here. Similarly, when wireless communication node1110makes a ptmp link using its Module B with the first communication module (e.g., Module A or C) of wireless communication nodes1120,1130,1140,1150and1160, then the second communication module (e.g., Module A or C) of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptp wireless communication links with other modules of wireless communication nodes in the mesh network that are not shown here and a third communication module (e.g., Module B) of wireless communication nodes1120,1130,1140,1150and1160can simultaneously create ptmp wireless communication links with other modules of wireless communication nodes in the mesh network that are not shown here. It is to be noted that wireless communication links established by Module A or Module C have high reliability due to interference immunity either due to extremely narrow beams or due to transmission of data over ultra-high bandwidth. These features make these links more suitable to carry control information and data for multiple users of a communication system that is based on the wireless mesh network technologies disclosed herein. Hence links established by Module A or Module C can act as a wireless backhaul for a communication system while links established with Module B can provide access to individual users of the communication system. In one embodiment, an entire wireless mesh network can be composed of ptp links where both links providing backhaul and access have interference immunity. Although such links are more expensive due to the requirement of separate modules to establish individual links, such links are suitable when certain high service quality or reliability is required to be ensured for all end users of the service(s) delivered via the wireless mesh network. For example,FIG.12shows a site1200at which a seed or an anchor node of a wireless mesh network has been deployed. Site1200hosts a wireless communication node1201that includes a total of 6 communication modules that each take the form of a Module A or Module C type of ptp module. Hence wireless communication node1201is capable of establishing six ptp links. As shown, wireless communication node1201uses a 1stand 4thModule A/Module C to establish connections with site1200and site1260that serve as backhaul links, while wireless communication node1201uses a 2nd, 3rd, 5thand 6thModule A/Module C to establish ptp links with sites1220,1230,1250and1240to provide access links. In this respect, links between sites1200and1220, sites1200and1230, sites1200and1240, and sites1200and1250only carry data for individual users, whereas links between sites1200and1260and sites1200and1210carry signaling and data for all the sites including1200,1210,1220,1230,1240,1250and1260. In another embodiment, a wireless mesh network can be composed of combination of ptp links and ptmp links, where the ptp links generally serve as backhaul links for carrying aggregated mesh access traffic for the wireless mesh access network and the ptmp links generally serve as access links for carrying individual mesh access traffic to individual users. In this respect, the ptp links and ptmp links may be considered to define different “layers” (or “segments”) of the wireless mesh access network. Although such a wireless mesh network does not necessarily provide interference immunity to all the end users of the service(s) delivered via the wireless mesh network due to presence of ptmp links, such a wireless mesh network is less expensive due to the non-requirement of separate modules to establish individual links and may also be better suited for adding client nodes that do not have predefined locations. For example,FIG.13shows a site1300at which a seed or an anchor node of a wireless mesh network has been deployed. Site1300hosts a wireless communication node1301that includes a total of 4 communication modules, two of which take the form of ptp modules (e.g., Module A and/or Module C) and two of which take the form of ptmp modules (e.g., Module B). Hence this wireless communication node is capable of establishing two ptp links and two ptmp links. As shown, wireless communication node1301uses a 1stand 4thModule A/Module C to establish connections with site1310and site1360that serve as backhaul links, while wireless communication node1301uses a 2ndModule B to establish ptmp links with sites1320,1330and uses a 3rdModule B to establish ptmp links with sites1350and1340to provide access links. In other words, links between sites1300and1320, sites1300and1330, sites1300and1340and sites1300and1350only carry data for individual users, whereas links between sites1300and1360and sites1300and1310carry signaling and data for all the sites including1300,1310,1320,1330,1340,1350and1360. Referring toFIG.14, another possible example of a wireless communication node ofFIG.1is shown as a wireless communication node1400installed with wireless communication equipment that comprises a single module labeled as “Module D.” Module D comprises base band unit or digital unit1401which runs the physical layer level protocol including digital modulation/demodulation (modem) and other higher layer protocols such as MAC layer, etc. Base band unit1401interacts with other nodes of the communication system that are external to the wireless communication node1400via wired medium. Module D also includes RF unit1402, which among other things processes IF signals and defines the frequency range of the radio signals that can be transmitted or received with the Module D. RF unit1402is capable of operating over a wide range of frequencies (e.g., 5 Ghz band frequencies ranging from 5 Ghz to 6 Ghz). Further, as shown, Module D also comprises antenna unit1403which performs the transmission and reception of over the air radio signals. Antenna unit1403is capable of transmitting and receiving extremely narrow beam of signals. Antenna unit1403may be constructed with either 1-dimensional or 2-dimensional antenna element arrays that have excellent properties of controlling the directionality of radio signals using beam forming and can propagate even in a non-line of sight environment. Module D with the help of antenna unit1403is capable of establishing ptmp links with a tower capable of performing massive MIMO (multiple input multiple output) beams. In one embodiment, Module D can be designed and manufactured at least in part using ASIC (Application specific integrated circuit) and an integrated RF unit called RFIC. Referring toFIG.15, an example of multiple Module Ds connected to a tower1500is shown. Specifically, wireless communication node1501hosting a Module D described above is connected to tower1500via massive MIMO beam link1510that can be both line-of-sight and non-line-of-sight, wireless communication node1502hosting a Module D described above is connected to tower1500via massive MIMO beam link1520that can be both line-of-sight and non-line-of-sight, and wireless communication node1503hosting a Module D described above is connected to tower1500via massive MIMO beam link1530that can be both line-of-sight and non-line-of-sight. The tower1500is equipped with a Massive MIMO module that can create multiple bi-directional narrow beam links simultaneously in all directions with 360 degrees of coverage area. In one embodiment, tower1500can operate in the 5 Ghz band including frequencies ranging from 5000 Mhz to 6000 Mhz. In other embodiments, tower1500and associated wireless communication nodes1501,1502and1503can operate within a different frequency band. It should be understood that whileFIG.15shows only one tower and three wireless communication nodes hosting Module D in the communication system, a given communication system can have multiple towers similar to tower1500and these towers can each be connected to a large number of wireless communication nodes hosting various other modules. In accordance with the present disclosure, the route that a particular packet takes from a source to a destination may be dynamically selected based on factors including but not limited to link quality, loading, latency etc. For example, referring toFIG.16, communication system1600is shown that is similar to communication system100and has all the components described in the context ofFIG.1. Additionally, communication system1600ofFIG.16includes a tower1610which is similar to tower1500described in the context ofFIG.15. In contrast to communication system100inFIG.1, the wireless communication equipment131,132,133,134and135at the seed and anchor nodes of the communication system may include an additional Module D besides Module A/Module B or Module C that enables these wireless communication nodes to optionally establish bi-directional links having the features described in the context ofFIGS.14-15with tower1610using massive MIMO beamforming capabilities. Such links labeled as1601,1602,1603,1604and1605can work in both line-of-sight and non-line of sight environment and can provide alternate communication paths to the seed and/or anchor nodes of the communication system in an event where a ptp or ptmp link that connects one such wireless communication node to a peer wireless communication node to form a wireless mesh network fails or experiences performance degradation due to various reasons including but not limited to a change in the line-of-sight profile of a millimeter-wave link between two wireless communication nodes. InFIG.16, only one tower (i.e., tower1610) capable of massive MIMO ptmp communication is shown to be connected to the five wireless communication nodes of the communication system. However, it should be understood that a communication system can also have more than one tower, each connected to multiple different wireless communication nodes hosting various other modules. In areas within tower1500's (and other towers of same type) coverage area, a given communication system can initially start in a ptmp manner, where tower1500(and other towers of same type) provides access to individual customers using sub 6 Ghz massive MIMO ptmp beams. Later, nodes in the given communication system can opportunistically connect with other nodes using regular modules (e.g., Module A/Module B/Module C) in the presence of line-of-sight. This way, the given communication system may evolve to form a wireless mesh network with ptp and ptmp connections between nodes in addition to each communication node having a path directly (non-line-of-sight) to tower1500(and other towers of same type) that fall within the coverage area. One of ordinary skill in the art will appreciate that a route a given packet takes from a source to a destination in this communication system may be optimized by considering various factors including latency, congestion, reliability etc. One of ordinary skill in the art will also appreciate that a given communication system can later add seed nodes (e.g., the seed nodes hosted at seed homes111and115inFIG.1) along with tower/fiber access points101and102to provide alternate backhaul as per need basis. In another embodiment, instead of providing massive MIMO ptmp networking capability using a terrestrial tower, ptmp massive MIMO capability to wireless communication nodes can also be provided by a satellite, such as a low earth orbit (LEO) satellite. For example, referring toFIG.17, communication system1700is shown that is similar to communication system100and has all the components described in the context ofFIG.1. Additionally, communication system1700ofFIG.17includes a satellite1710which is capable of massive MIMO transmission and reception on frequencies including but not limited to 5-6 Ghz, similar to tower1500described in the context ofFIG.15. In contrast to communication system100inFIG.1, the wireless communication equipment131,132,133,134and135at the seed and anchor nodes of the communication system may include an additional Module D (besides Module A/Module B or Module C) that enables these wireless communication nodes to optionally establish bi-directional links having the features described in the context ofFIGS.14-15with satellite1710using massive MIMO beamforming capabilities. Such links labelled as1701,1702,1703,1704and1705can provide alternate communication paths to the seed and/or anchor nodes of the communication system in an event where a ptp or ptmp link that connects one such wireless communication node to a peer wireless communication node to form a wireless mesh network fails or experiences performance degradation due to various reasons including but not limited to a change in the line-of-sight profile of a millimeter-wave link between two wireless communication nodes. InFIG.17, only one satellite1710capable of massive MIMO ptmp communication is shown to be connected to the five wireless communication nodes of the communication system. However, it should be understood that a communication system can also have more than one satellite, each connected to multiple different wireless communication nodes hosting various other modules. In another embodiment, some of the wireless communication nodes that provide backhaul functionality can be equipped with multiple communication modules that enable these wireless communication nodes to transport backhaul data between an end user and a core network using multiple different types of communication links. For example, referring toFIG.18, communication system1800is shown that is similar to communication system100and has all the components described in the context ofFIG.1. Additionally, communication system1800ofFIG.18includes a satellite1810which is capable of massive MIMO transmission and reception on frequencies including but not limited to 5-6 Ghz, similar to tower1500described in the context ofFIG.15. Communication system1800also includes a massive MIMO cable tower1820which is also similar to tower1500described in the context ofFIG.15. In contrast to communication system100inFIG.1, the wireless communication equipment131,132,133,134and135at the seed and anchor nodes of the communication system may include an additional Module D (besides Module A/Module B or Module C) that enables these wireless communication nodes to optionally establish bi-directional links having the features described in the context ofFIGS.14-15with satellite1810and tower1820using massive MIMO beamforming capabilities. Such links labeled as1801,1802,1803and1804can provide alternate communication paths to the seed and/or anchor nodes of the communication system in an event where a ptp or ptmp link that connects one such wireless communication node to a peer wireless communication node to form a wireless mesh network fails or experiences performance degradation due to various reasons, including but not limited to change in the line-of-sight profile of a millimeter-wave link between two wireless communication nodes. Specifically, satellite1810inFIG.18is connected to the seed node hosted at seed home115using wireless communication equipment135via link1804and to the anchor node hosted at anchor home112using wireless communication equipment132via link1803. In this respect, the seed node hosted at seed home115has multiple options to route backhaul traffic to the core network. In one embodiment, the seed node hosted at seed home115can pick a satellite link1804to transport backhaul data at a given time, and based on some trigger at a different time, can cause its wireless communication equipment135/123to switch links for backhaul data transmission from satellite link1804to wireless link142(which as noted above may be a ptp or ptmp millimeter-wave-based link such as an E-band link) coupled to the fiber PoP node hosted at tower/fiber access point102. Such trigger may include latency, bandwidth, packet loss requirements, etc. of a particular application. FIG.18also shows an anchor node hosted at an anchor home113where the node's wireless communication equipment133may exchange data with the anchor node hosted at anchor home112using its wireless communication equipment132. If the anchor node at anchor home112receives end-user data from the anchor node at anchor home113, the anchor node at anchor home112may then have multiple options to transport end-user data to the core network via its wireless communication equipment132, including (1) directly sending the end-user data to the core network via satellite link connection1803, (2) indirectly sending the end-user data to the core network via the seed node at seed home115, which may send the end-user data to the core network either via satellite link connection1804or via link142with the fiber PoP node hosted at access point102, or (3) indirectly sending the end-user data to the core network via the seed node at seed home111, which may send the end-user data to the core network either via link connection1802or via link141with the fiber PoP node hosted at access point101, among other options. In one embodiment, wireless communication equipment132of the anchor node at anchor home112can also dynamically switch its connection link to route data to and from the anchor node at anchor home113. For example, due to some trigger similar to the triggers described above, wireless communication equipment132can dynamically switch from directly communicating data between the anchor node at anchor home113and the core network via satellite link1803to indirectly communicating data between the anchor node at anchor home113via the seed node at seed home115and satellite link1804, as one possible implementation. It should be understood that links1803and1804can be part of same massive MIMO beam or links1803and1804can be part of different massive MIMO beams. It should also be understood that satellite links1803and1804can use the same frequency range of communications or can operate in different frequency ranges. Further, whileFIG.18shows only one satellite (i.e., satellite1810) capable of massive MIMO ptmp communication that is connected to two wireless communication nodes132and135, it should be understood that a communication system can also have more than one satellite, each connected to multiple different wireless communication nodes hosting various other modules. As further shown inFIG.18, tower1820is connected to the seed node at seed home111via link1801and to the anchor node at anchor home112via link1802. This provides the anchor node at anchor home114with options to route packets to the core network in multiple ways including (a) indirectly through one of the seed nodes at seed homes111and115through links152or155(which as noted above may be ptp or ptmp millimeter-wave-based links), and (b) directly to tower1820via massive MIMO based link1802. Similarly, the seed node hosted at seed home111has multiple options to route backhaul traffic to the core network. In one embodiment, the seed node hosted at seed home111can pick link1801to transport backhaul data at a given time, and based on some trigger at a different time, can cause its wireless communication equipment131/122to switch links for backhaul data transmission from link1801to wireless link141which as noted above may be a ptp or ptmp millimeter-wave-based link such as an E-band link) coupled to the fiber PoP node hosted at tower/fiber access point101. Such trigger may include latency, bandwidth, packet loss requirements, etc. of a particular application. InFIG.18, only one tower (i.e., tower1820) capable of massive MIMO ptmp communication is shown to be connected to two wireless communication nodes. However, it should be understood that a communication system can also have a different number of massive MIMO towers, each connected to multiple different wireless communication nodes hosting various other modules. In another embodiment, one or more wireless communication nodes described above and discussed with respect toFIGS.1-18may additionally be an edge computing node by hosting a processor (separate or shared), memory, digital contents, software, and storage, among other components for computing, and other required operations for edge computing, in addition to the high speed low latency networking capability that has already been described above. This enables a given communication system to provide cloud services in a distributed manner closer to an end user as wireless communication nodes are distributed across the network and provide an interface between the network and an end-user. This memory unit can store a copy of local digital contents and can additionally store portions of digital content that that are not local. The non-local digital contents among other things can include digital content belonging to other nodes. This provides content redundancy in a communication system. Hence, when an end user of a communication system requests for digital content, then this edge computing mechanism allows a request to be fulfilled in a variety of different ways, including a request processed by a local node and/or remote node based on various criteria including but not limited to latency, network congestion, etc. of the application making the request. In another embodiment, one or more wireless communication nodes described above and discussed with respect toFIGS.1-18can additionally be a blockchain node by hosting a computer comprising at least one processor, memory, digital content, software, etc., which is connected to a blockchain network comprising a client that is capable of storing, validating and/or relaying transactions in addition to the high-speed low latency networking capability that has already been described above. This enables the communication system and its nodes described in this disclosure and discussed in the context ofFIGS.1-18to provide an ideal platform for blockchain databases, enterprise blockchain databases, permissioned/private blockchains, hybrid and other similar types of databases given that (1) file/data/record storage space is inherently distributed as wireless communication nodes are distributed across the geographical coverage area and (2) low latency communication between the nodes and across the network due to high speed wireless links enable improved latency and improves the transaction throughput of the blockchain based databases. In another embodiment, one or more wireless communication nodes can additionally act as blockchain-based distributed data storage node by adding dedicated or shared storage capacity capability to these nodes. One key advantage of implementing blockchain-based distributed data storage on a given communication system and the wireless communication nodes described in this disclosure is that storage nodes are inherently distributed, and due to the low latency and high bandwidth of the wireless communication links between the wireless communication node described above and the proximity of the storage location nodes to an end-user, accessing the data content can be faster compared to other approaches. In accordance with the present disclosure, the wireless communication equipment (ptp link modules, ptmp link modules, multiple ptp link modules, combination of multiple ptp and ptmp links, antennas for cellular small cells/CPEs and millimeter-wave equipment, cable, mounts, power supply boxes, etc.) that gets deployed and installed at a seed or anchor home can be consumer financed. For instance, in case of a customer meeting a certain credit score threshold (or any other credit checking criteria), the equipment required to add a millimeter-wave mesh node at the customer's premises (i.e., to add the customer to the wireless mesh network) and provide high speed internet service may be financed by a bank on the behalf of the customer, and the customer may agree with the financing bank to re-pay the amount financed by the bank over a certain time period by making periodic (e.g. monthly) payments based on the terms and conditions of the agreement. This way, the customer becomes owner of the equipment (a wireless mesh network node) once the full financed amount is made to the financing bank. This customer can in one embodiment lease back the wireless mesh network node equipment installed on its property to the wireless mesh network operator that installed the wireless mesh network equipment on its property and provide high speed internet data service. In another embodiment, this customer can lease back the wireless mesh network node equipment installed on its property to the wireless mesh network operator that installed the wireless mesh network equipment on its property and provide high speed internet data service for a certain term (e.g., 18 months, 24 months, 36 months, etc.). In some instances, this customer may be required to lease back the equipment to only that operator which originally installed the equipment at the customer location and provided high speed internet data services. In other instances, this customer can lease back the equipment to any wireless internet network operator. In another instance, lease back of the equipment to an operator other than the operator which originally installed the network equipment at the customer location may only occur with the permission of the wireless internet network operator that originally installed that equipment at customer location. In yet another instance, such lease back to a different wireless internet network operator may only occur after expiration of the lease term with the original wireless internet network operator. For a wireless internet network operator building and operating a wireless mesh network, the type of customer financing-based network deployment described above becomes a crowd sourcing or crowdfunding-based infrastructure roll out mechanism, where instead of one or few large entities, CAPEX is sourced from a pool of individuals who in some instances are the customers of the wireless mesh network operator. Such customers can get high speed internet data service from the wireless mesh network operator (operating using ptp/ptmp modules, other communication nodes and equipment and various variations discussed earlier in this disclosure) at a subsidized/discounted rate. In certain cases, such customers may get two separate bills periodically, one for the high-speed internet data service and other for the equipment financing from bank. In another case, customers can get a single consolidated bill from a wireless mesh operator. In some instances, all customers of a wireless mesh operator can be based on consumer financing explained above in a neighborhood or market where wireless mesh operator offers its high-speed internet data service. In other instances, wireless mesh network's customers in a market or neighborhood can be financed through a variety of different ways including operator financing where wireless mesh operator pays for the equipment of the wireless mesh node, financed through bundling with a private utility or service that has a relatively smaller market size (e.g. home security/automation, solar energy, etc.) compared to market size of the high speed internet where a bundled service is offered and wireless mesh operator uses the marketing/sales commission received from the private utility or service provider to fund the wireless mesh node equipment, financed through the revenue generated from running blockchain platform based services on the wireless mesh network nodes along with the consumer/customer based financing that is explained earlier in the disclosure. Further, in accordance with the present disclosure, the communications equipment including various types of ptp/ptmp modules, cellular small cell, etc. that were described above can be used to establish multiple ptp and/or point-to-multiple links where both network nodes of a wireless link, one from where a link originates and the second from where a link terminates (in general, nodes can switch roles dynamically between link originator and link terminator based on the direction of data flow), are located at the different customer locations and providing high speed internet service to the dwellers of the property where wireless mesh network node is deployed and installed. In some cases, one of the two nodes of the link can be at a location where the deployed equipment provides high speed internet service to the dwellers of the property at that location. In other instances, both nodes of the link may be at a location where the deployed equipment does not provide high speed internet service to the dwellers of the property at that location. It should be understood that the length of the communication links of a wireless mesh network disclosed herein may vary. For instance, the length of the communication links of a wireless mesh network established with the help of the various communication modules and equipment described above may be less than 300 meters on average. Alternatively, the length of the communication links of a wireless mesh network can be greater than 300 meters on average as well. Many other lengths of the communication links are possible as well. In accordance with the present disclosure, further disclosed herein are communication modules that employ direct RF (microwave/millimeter wave)-to-optical and direct Optical-to-RF (microwave/millimeter wave) conversion. In one example implementation, the high-speed photo detectors can be used that directly translate an optical signal into a microwave signal. One of ordinary skill in the art will appreciate that other approaches can be used for direct optical-to-RF conversion. Similarly, a dipole antenna directly coupled to a plasmonic modulator allows direct conversion from the RF to the optical world. One of ordinary skill in the art will appreciate that different approaches can be used for direct conversion of RF signals to optical signals. This direct optical-to-RF and direct RF-to-Optical conversion modules eliminate the need of the use of analog to digital and digital to analog (ADC/DAC) modules that are required by traditional modem implementations. These mixed signal components (i.e., ADC/DAC) consume high amount of power and also increase the cost as each antenna is required to be connected to a separate ADC/DAC module. FIG.19shows a communication module based on direct RF-to-Optical and direct Optical-to-RF conversion. Communication module ofFIG.19contains a single direct RF-to-Optical sub-module and a single Optical-to-RF sub-module. However, communication module ofFIG.19can host any integer number of direct RF-to-Optical sub-modules greater than or equal to zero and any integer number of direct Optical-to-RF sub-modules greater than or equal to zero. In one example embodiment, this direct RF-to-Optical and direct Optical-to-RF conversion technology can be implemented is an integrated Circuit (IC) or chip. Based on the above explanation with respect to the example communication module ofFIG.19, in an example embodiment, the core of a wireless mesh network can be a wireline optical or wired router/switch where each port is mapped, either through a direct connection or over optical/wired line, to an individual direct conversion Optical-to-RF or RF-to-Optical chip that then focuses, on both receiver and transmitter side, all RF energy into a high gain narrow beam that can be both fixed or steerable. In one example embodiment, a standard 8-port×10 G router/switch could be used, with one port being used as a data drop to local building/site and the other 7 ports being connected over a fiber optic cable to various Optical-to-RF or RF-to-Optical end points that are located at multiple distributed locations external (and/or internal) on/in the building/site as shown inFIG.20. One of ordinary skill in the art will understand that the router/switch can have a different number of ports as well. These multiple distributed locations can be determined in advance based on the use of connection potentiality optimization algorithms, where the algorithm understands the relationship between end point placement and potentially connection partners. Also, the individual ptp beams can be dynamically steered among potential ptp connection partners to facilitate path optimization algorithms and/or to respond to network congestion and/or network element failures. In one embodiment, these Optical-to-RF or RF-to-Optical end points that establish ptp/ptmp beams can be placed below a roof's eaves and in other embodiments, these end points can be placed above a roof's eaves. In some other embodiments, some of the Optical-to-RF or RF-to-Optical end points can be placed below a roof's eaves and some can be placed above a roofs eaves and actual placement may depend upon the line-of-sight profile of the location/site. It should be understood that the example communication module discussed in the context ofFIGS.19-20can be implemented in other communication modules that were discussed in the context ofFIGS.1-18. For instance, the modules discussed in the context ofFIGS.1-18can have direct RF-to-Optical and direct Optical-to-RF technology embedded such that the narrow beam, extremely narrow beam, and/or ptp/ptmp/multiple ptp links can be established without the need for ADC/DAC mixed signal circuitry that consumes a high amount of power and requires to be connected individually with each antenna. In accordance with the present disclosure, a modified version of the communication nodes discussed earlier for forming a wireless mesh network will now be discussed. In one embodiment, a communication node can host flexible millimeter-wave radio equipment capable of establishing multiple ptp and/or ptmp links operating over millimeter-wave frequencies and can comprise 3 different sub-modules: (1) digital/network module, (2) ptp radio module, and (3) ptmp radio module. A digital/network module is responsible for interfacing the above millimeter-wave radio box (and thus the communication node) with a core network (which may also at times be referred to as a backhaul or fiber network). Specifically, it provides switching capability to direct traffic between the ptp or ptmp radio modules of the millimeter-wave radio box (communication node) and the core network. The connectivity between a single or multiple ptp and/or ptmp radio modules of the millimeter-wave radio box and the core network can be based over a variety of interfaces including but not limited to PCI/PCI express bus interface and ethernet. In one embodiment, PCI/PCIe can be used when a ptp or ptmp radio that needs to be connected is enclosed in the same box with a digital/network module and separation between the digital/network module and the ptp module is limited to few inches such as 3-6 inches or less. In one embodiment, a digital/network module provides connectivity to a single ptp or ptmp module over a single PCI/PCIe bus interface. In a different embodiment, a digital/network module provides connectivity to 3 ptp or 3 ptmp or a combination of 3 ptp/ptmp modules over three separate PCI/PCIe bus interfaces. In another embodiment, a digital/network module provides connectivity to N ptp or N ptmp or a combination of N ptp/ptmp modules over N separate PCI/PCIe bus interfaces, where N is a positive integer number greater than zero. An ethernet interface such as an RJ45 port with multi-gigabit support, including but not limited to 1 Gb, 2.5 Gb, 5 Gb, 10 Gb, etc., can be used to connect ptp or ptmp radio modules with a digital/network module. In one embodiment, an ethernet interface can be used when the ptp or ptmp radio that needs to be connected is not enclosed in the same box with a digital/network module and separation between digital/network module and the ptp module is greater than 3-6 inches. In some embodiments, the length can be 10 meters or more. In one embodiment, a digital/network module provides capability of connecting up to 4 ptp/ptmp radios or up to 3 ptp/ptmp radio and a small cell over 4 ethernet interfaces. In a different embodiment, a digital/network module provides capability of connecting up to N ptp/ptmp radios or up to N−1 ptp/ptmp radio and a small cell over N ethernet interfaces, where N is a positive integer number greater than zero. Digital/network module also contains SFP/SFP+ interface or any other interface to connect digital/network module with the core network. The ptmp radio module of the communication node discussed above is responsible for establishing ptmp millimeter-wave-based bi-directional links to connect to peer millimeter-wave radios in a wireless mesh network. The ptmp radio module comprises a baseband sub-module and RF module. Baseband module handles the baseband processing and among other aspects is responsible for baseband processing related to beamforming. RF module contains phased antenna array that works in conjunction with baseband module to generate ptmp millimeter-wave beams. The ptp radio module of the communication node described above is responsible for establishing ptp millimeter-wave-based bi-directional links to connect to a peer millimeter-wave radio in a wireless mesh network. The ptp radio module comprises a baseband sub-module, RF module and beam narrowing module. The baseband module handles the baseband processing and, among other aspects, is responsible for baseband processing related to beamforming. RF module contains phased antenna array that works in conjunction with baseband module to generate ptp millimeter-wave beam. A beam narrowing module is responsible for narrowing the beam by focusing most of the radiated signal energy in the desired direction and lowering the antenna side lobes to minimize the interference in a wireless mesh network. In one embodiment, the beam narrowing module can be a lens antenna integrated with an RF module. In another embodiment, the beam narrowing module can be a parabolic antenna integrated with an RF module. In yet another embodiment, the beam narrowing module could be a module other than a lens or parabolic antenna and rely on a different approach to narrow the beam originating from a phased array-based RF module. Referring toFIG.21, a logical block diagram of the flexible millimeter-wave communication equipment described above is shown. As explained earlier, a flexible millimeter-wave radio node contains within an enclosure (typically outdoor) a digital/network module that has a network processing unit (at times referred to as an “NPU” for short, or at other times may be referred to as a “brain unit”) and is configured to provide network switch operations between the fiber optic backhaul interface and the ptp or ptmp radio modules either connected via PCI/PCIe interface or via multi gigabit ethernet ports. A flexible millimeter-wave radio module also contains within the enclosure 3 ptp or ptmp radios. For providing mesh network deployment flexibility, a node can also be connected to external ptp/ptmp radios via ethernet ports. A node can be solar powered or can be powered via electric power outlet of the home where the node is installed.FIG.21also shows that this flexible millimeter-wave radio node may only need a single NPU that controls all the ptp or ptmp RF modules either connected via a PCI/PCIe interface or via a multi gigabit ethernet interface. Hence this example flexible millimeter-wave radio node removes the need for using a dedicated NPU for each ptp/ptmp RF module. FIG.22shows a block diagram of a ptmp radio module of the communication node described above. As shown, this radio module contains a baseband module and a RF module that has the phased antenna array for providing beamforming capability. FIG.23shows a block diagram of the ptp radio module of the communication node discussed above. This radio module contains a baseband module, an RF module that has the phased antenna array for providing beamforming capability, along with a beam narrowing module. The beam narrowing module, based on various techniques discussed earlier, narrows the beam generated by the phased antenna array of the RF module. Referring toFIG.24, various different use cases of the communication nodes described above and explained in the context ofFIGS.21-23is shown.FIG.24shows a wireless mesh network comprising 5 communication nodes3700. Communication nodes3700may each be a flexible millimeter-wave communication node that has been discussed earlier. At “Site A” of the wireless mesh network, a communication node3700may be solar powered and mounted on the pole. This node3700at Site A may have 3 ptp links generated by 3 ptp radio modules integrated with the digital/network module. At “Site B,” a communication node3700may be powered with an electric power outlet of the home and may have one ptp link via a single integrated ptp radio module and 2 ptmp links via two ptmp radio modules that are not integrated with a digital/network module but instead connected via ethernet interface to the communication node. Similarly, at “Site C,” a communication node3700may be powered with an electric power outlet of the home and may have two ptp links via two integrated ptp radio module and one ptmp radio module integrated with a digital/network module. At “Site E,” a communication node3700may be powered with an electric power outlet of the home and may have two ptp links via two integrated ptp radio module. Further, at “Site D,” a communication node3700may be powered with an electric power outlet of the home and may have two ptp links via two integrated ptp radio module and one ptmp radio module integrated with the digital/network module. Referring toFIG.25A, another use case of the communication node described above is shown. In particular,FIG.25Ashows an example wireless mesh network that includes communication nodes3700at the 5 sites previously described with respect toFIG.24, as well as an additional communication node3700at “Site A2.” Similar to communication node3700at “Site A,” communication node3700at “Site A2” may be mounted on a pole (among other possibilities). Based on the preceding disclosure (e.g., the disclosure in connection withFIGS.5-7,9-11,13, and16-18), one of ordinary skill in the art will appreciate that each communication node3700at a given site may have the capability to communicate with multiple other communication nodes at multiple other sites. For instance, communication node3700at “Site B” may have the capability to communicate with the respective communication nodes3700at both “Site A” and communication node3700at “Site A2.” Similarly, the respective communication node3700at each of “Site C,” “Site D,” and “Site E” may have the capability to communicate with the respective communication nodes3700at both of “Site A” and “Site A2.” Furthermore, based on the preceding disclosure (e.g., the disclosure in connection withFIGS.5,11, and18), one of ordinary skill in the art will appreciate that each communicate node3700at a given site (e.g., communication node3700at “Site B”) may have the capability to dynamically switch its active communication link from a first communication node3700at a first site (e.g., communication node3700at “Site A”) to a second communication node3700at a second site (e.g., communication node3700at “Site A2”) based on some trigger that is similar to the triggers described above (e.g., changes in link condition such as a change from a LOS path to a non-LOS path due to a change in environment, increased interference, instructions from higher layers, latency, bandwidth, and/or packet loss requirements of a particular application, etc.). For instance, in the scenario shown inFIG.25A, the respective communication node3700at each of “Site B,” “Site C,” “Site D,” and “Site E” may initially be configured to actively communicate with the communication node3700at “Site A” (which may function to route backhaul traffic to and/or from such other sites). However, at some later point in time, the communication node3700may dynamically switch its active communication link from the communication node3700at “Site A” to the communication node3700at “Site A2” (which may also function to route backhaul traffic to and/or from such other sites) due to some trigger similar to the triggers described above. Such a scenario is shown inFIG.25B. It should be understood thatFIGS.24-25are described in such a manner for the sake of clarity and explanation and that the example wireless mesh networks described inFIGS.24-25may take various other forms as well. For instance, the example wireless mesh networks may include more or less communication nodes, and a given communication node may take various other forms and may be mounted in various other manners and/or mounted on various other objects as well (e.g., mounted on a pedestal). Further, in line with the preceding disclosure, one or more of the communication nodes (e.g., the communication nodes3700at “Site A” and “Site A2) may be mounted to an object that is at or near a fiber access point. Further yet, the example mesh networks may have various different configurations of ptp or ptmp modules either integrated or connected via an ethernet interface and powered via various different power options. Another important aspect of communication node3700is that the integrated radio modules can be pluggable. In other words, based on a specific use case, the number and types of radio modules integrated with a digital/network module via PCI/PCIe interface can easily be changed by plugging in the desired number and type of radio modules with full flexibility instead of having one specific configuration. So far, the modified version of communication nodes discussed above and also described in the context ofFIGS.21-25assumes that the ptp or ptmp modules connected to a digital/network module with an NPU via a high speed interface (e.g., PCI/PCIe/Thunderbolt) are also located inside a same enclosure. It should be understood that the ptp or ptmp modules connected to a digital/network module via high speed interface can also be located outside the digital/network module with the NPU and inside an independent box/enclosure connected via an outdoor cable supporting the PCI/PCIe/Thunderbolt high speed communication protocol to the enclosure of the digital/network module. As one example,FIG.26depicts a modified version of a flexible millimeter-wave radio box, where the ptp or ptmp RF modules are located outside a digital/network module with NPU enclosure and inside separate independent box/enclosure and connected via an outdoor wired cable capable of supporting high speed communication interface (e.g., PCI/PCIe/Thunderbolt Interface). As shown, 3 ptp or ptmp modules are connected via PCIe/Thunderbolt interfaces to the digital/network module with the NPU using a compatible outdoor cable. In general, it should be understood that N number of ptp or ptmp modules in separate independent enclosures can be connected via a PCIe/Thunderbolt compatible outdoor cable, where N is an integer greater than zero. It should also be understood that the length of the outdoor cable compatible with high speed communication protocol, such as PCIe/thunderbolt, depends on the maximum limit defined by the technology. In one embodiment, PCIe/thunderbolt cable can be up to 3 meters. In other embodiments, the length of the outdoor PCI/PCIe/thunderbolt compatible cable can be less than or greater than 3 meters. In yet another embodiment of the present disclosure, a wireless mesh network may include ultra-high-capacity nodes that are capable of establishing ultra-high-capacity links (e.g., ptp or ptmp bi-directional communication links) using a millimeter-wave spectrum, including but not limited to 28 Ghz, 39 Ghz, 37/42 Ghz, 60 Ghz (including V band), or E-band frequencies, as examples. These ultra-high-capacity links may have a larger range as compared to other ptp or ptmp links, including but not limited to ptp or ptmp links of the type discussed above with reference toFIGS.1-26. For instance, as one possibility, a ptp or ptmp link of the type discussed above with reference toFIGS.1-26may have an average range of up to 100 meters, whereas an ultra-high-capacity link may have a range of more than 100 meters. As another possibility, a ptp or ptmp link of the type discussed above with reference toFIGS.1-26may have an average range of up to 500 meters, whereas an ultra-high-capacity link may have a range of more than 500 meters. As yet another possibility, a ptp or ptmp link of the type discussed above with reference toFIGS.1-26may have an average range of up to 1000 meters, whereas an ultra-high-capacity link may have a range of more than 1000 meters. However, in other implementations, it is possible that the length of an ultra-high-capacity link may be similar to the length of a ptp or ptmp links of the type discussed above with reference toFIGS.1-26, but may nevertheless provide higher capacity such that a fewer number of ultra-high-capacity nodes/links may be used (as compared to the ptp or ptmp nodes/links of the type discussed above with reference toFIGS.1-26) to build a main high capacity backbone through the mesh (i.e., the ultra-high-capacity nodes/links may be sparser). The higher capacity and/or extended range of these ultra-high-capacity nodes/links may be achieved via various advanced signal processing techniques, including but not limited to multiple input multiple output (MIMO) such as 2×2 MIMO, 4×4 MIMO, 8×8 MIMO or an even higher order MIMO, use of vertical and horizontal polarization (V & H), higher switch capacity of the digital network module due to higher processing power such as support of 8×25 Gbps port (200 Gbps aggregate traffic flow), higher order modulation including 16 QAM, 64 QAM, 256 QAM, 512 QAM, 1024 QAM, orbital angular momentum (OAM) multiplexing, and/or higher antenna gains, among other possibilities. Further, in some implementations, the higher capacity and/or extended range of these ultra-high-capacity nodes/links can be achieved using a subset of the advanced signal processing techniques mentioned above. These ultra-high-capacity nodes/links may be used in conjunction with other ptp and/or ptmp links, including but not limited to ptp or ptmp links of the type discussed above with reference toFIGS.1-26, to add another layer to a wireless mesh network. To illustrate with an example,FIG.27shows one example of a multi-layer wireless mesh network in which triple-compound links represent the ultra-high-capacity links described above, double-compound rings represent ptp links of the type discussed above with reference toFIGS.1-26, and single-line links represent ptmp links of the type discussed above with reference toFIGS.1-26. In this respect, each of the different types of links may be considered to define a different layer of the multi-layer wireless mesh network (e.g., an ultra-high-capacity layer, a standard ptp layer, and a standard ptmp layer). As shown inFIG.27, longer ultra-high-capacity links may be used bring a high level of capacity to the wireless mesh network, which can then be delivered to an end user/customer via a shorter ptp or point to multi point link (which may not be ultra-high-capacity). It should also be understood that while the ptmp links may primarily serve to provide flexibility in building the wireless mesh network due to the capability of beam steering and ability to establish multiple links from a single radio, these ptmp links may also be used to indirectly connect two ptp links via multiple ptmp link hops that can add additional reliability to the network. Further, it should be understood that a multi-layer wireless mesh network such as the one illustrated inFIG.27can be deployed in various manners. For instance, in one implementation, different layers of the multi-layer mesh network can be deployed in parallel. In another implementation, different layers of the multi-layer wireless mesh network can be deployed in different phases. For example, a deployment approach for a multi-layer wireless mesh network may involve first building a core network backbone (e.g., an ultra-high-speed network) using ultra-high-capacity nodes/links and then densifying the network during one or more subsequent phases using other types of ptp or ptmp nodes/links, including but not limited to ptp or ptmp radio links of the type discussed above with reference toFIGS.1-26. In another example, a deployment approach for a multi-layer wireless mesh network may involve first building a network of ptp nodes/links that are not ultra-high capacity and then later upgrading capacity by adding ultra-high-capacity nodes/links. A multi-layer wireless mesh network can be deployed in other manners as well. One variation of the multi-layer mesh architecture described above is that the ultra-high-capacity links can be designed to create specific paths based on a traffic requirement and/or some other criteria defined by the operator. To illustrate with an example,FIG.28shows another example of a multi-layer wireless mesh network in which some of the preexisting, non-ultra-high-capacity ptp links included in the example multi-layer wireless mesh network ofFIG.27are replaced by ultra-high-capacity links (shown as triple-compound links) to provide ultra-high capacity to specific segments of the wireless mesh network. This can be done either by supplementing the hardware of the preexisting, non-ultra-high-capacity nodes at the customer location with new hardware (e.g., a new radio or other associated hardware) capable of establishing ultra-high-capacity links or by replacing the hardware of the preexisting, non-ultra-high-capacity nodes at the customer location with new hardware (e.g., a new radio or other associated hardware) capable of establishing ultra-high-capacity links. Another variation of the multi-layer mesh architecture described above is that different layers of the wireless mesh network may be deployed at different heights, which may create physical-link separation by allowing re-use of the available frequency spectrum. For instance, in one implementation, a multi-layer wireless mesh network can have at least 2 layers of ultra-high-capacity links operating in the same frequency range, but at different heights. To illustrate with an example, a first layer of ultra-high-capacity links can be deployed at a lower height, such as by installing the required hardware at a lower height within a structure hosting the wireless mesh hardware (e.g., on a lower floor of a building), and a second layer of the ultra-high-capacity links can be deployed at a higher height, such as by installing the required hardware at a higher height of the structure hosting the wireless mesh hardware (e.g., at higher floor of the building). In this respect, the deployment of these different layers of ultra-high-capacity links at different heights may serve to increase the capacity of the multi-layer wireless mesh network. While the foregoing example involves the deployment of multiple different layers of ultra-high-capacity links at multiple different heights, it should be understood that this example is merely provided for purposes of illustration, and that multiple layers of wireless mesh links of any type may be deployed at different heights in order to enhance the overall capacity of the multi-layer wireless mesh network, including but not limited to layers of ultra-high-capacity links, non-ultra-high-capacity ptp links, and/or non-ultra-high-capacity ptmp links. Yet another variation of the multi-layer mesh architecture described above is that the ptmp links that are not ultra-high capacity (which are shown inFIGS.27and28as single-line links) may be replaced by wired links, such as a coaxial wire loop, fiber loop or some other type of wired link. To illustrate with an example, a multi-layer mesh network may include wired links that comprise the coaxial portion of the HFC (Hybrid Fiber Coax) used by the cable companies, in which case this coaxial portion of the HFC may bring mesh network connectivity to end users while the fiber portion of the HFC may bring the high-speed internet to the neighborhood. In this respect, the wireless mesh links consisting of ultra-high-capacity links (which are shown inFIGS.27and28as triple-compound links) and/or non-ultra-high-capacity ptp links may play the role of the fiber equivalent portion of the HFC by bring high capacity from a fiber POP to the neighborhood. As noted above, the wireless communication equipment that is utilized to deploy the wireless communication nodes disclosed herein may take any of various forms, and in at least some examples, that wireless communication equipment may include a radio module that is based on a phased antenna array. For example, as discussed above with reference toFIG.7, a wireless communication node's equipment may include a Module B type of ptmp radio module that is based on a phased antenna array. As another example, as discussed above with reference toFIGS.21-23and26, a wireless communication node's equipment may include flexible millimeter-wave ptp and/or ptmp radios that are based on phased antenna arrays. Other examples of radio modules based on phased antenna arrays that can be utilized to deploy the wireless communication nodes disclosed herein are possible as well. In accordance with yet another aspect of the present disclosure, a radio module of any of the wireless communication nodes disclosed herein can be made more flexible by using a phased antenna array comprising antenna elements having multiple different polarizations. For example, in one implementation, some phased antenna array elements of a radio module can have a vertical polarization and other phased antenna array elements of the radio module can have a horizontal polarization. In another implementation, the phased antenna array elements of a radio module can have slant/cross polarizations. For example, some phased antenna array elements of a radio module can have a +45 degree polarization and other phased antenna array elements of the radio module can have −45 degree polarization. Other implementations are possible as well, including but not limited to (i) implementations where the polarizations of the phased antenna array's antenna elements are something other than other than horizontal/vertical or slant/cross polarization, and/or (ii) implementations where the phased antenna array includes antenna elements belonging to more than two different polarizations (e.g., four respective sets of antenna elements having horizontal, vertical, +45 degree, and −45 degree polarizations). Further, the phased antenna array comprising antenna elements having two or more different polarizations may be fed by an RF module comprising a plurality of RF chains, which may take any of various forms. In one implementation, each individual antenna element of the phased antenna array described above can be connected to a dedicated RF chain having a dedicated power amplifier. For example, in a 16-element antenna array, each antenna element may be connected to a dedicated RF chain, such that the radio module comprises 16 separate RF chains that feed the 16 antenna elements of the phased array. In another implementation, multiple antenna elements of the phased antenna array may be grouped together for purposes of the RF chains, where each group of multiple antenna elements may be connected to a respective RF chain such that the antenna elements in group share a power amplifier and other RF elements of the group's respective RF chain. For example, in a 16-element antenna array, the antenna elements may be arranged into groups of two antenna elements for purposes of the RF chains, such that the radio module comprises 8 separate RF chains that feed the grouped-by-two 16 antenna elements of the phased array. In conjunction with the phased antenna array comprising antenna elements having two or more different polarizations and the RF module that feeds the antenna elements, a radio module designed in accordance with this aspect of the present disclosure may further comprise a control unit that is configured to dynamically control an activation state (e.g., the activation/deactivation) of the RF chains and their corresponding antenna elements in order to alter the polarization and/or emission pattern of the radiated signal. This control unit may comprise hardware, software, or some combination thereof, among other possibilities. Further, in practice, the control unit may be configured to dynamically control the activation state of the RF chains and their corresponding antenna elements in response to an instruction from an NPU of the radio module, a digital module of the radio module, or the like, among various other possibilities. For instance, in one implementation where each antenna element of the phased antenna array has one of two possible polarizations (e.g. either horizontal or vertical), the control unit may be configured to (i) activate (or maintain activation of) all of the antenna elements having one polarization by activating (or maintaining activation of) whichever RF chain(s) feed the antenna elements to be activated and (ii) de-activate all of the antenna elements having the other polarization by deactivating whichever RF chains feed the antenna elements to be deactivated, such that antenna elements having only one of the two possible polarizations are activated in the phased antenna array and the antenna output belongs to that one polarization only. For example, based on a given instruction received from an NPU or digital module of the radio module, the control unit may function to (i) activate (or maintain activation of) all antenna elements having a horizontal polarization by activating (or maintaining activation of) whichever RF chains feed such antenna elements and (ii) deactivate all antenna elements having a vertical polarization by deactivating whichever RF chains feed such antenna elements, which may result in an antenna output belonging to the horizontal polarization only. As another example, based on a given instruction received from an NPU or digital module of the radio module, the control unit may function to (i) activate (or maintain activation of) all antenna elements having a vertical polarization by activating (or maintaining activation of) whichever RF chains feeds such antenna elements and (ii) deactivate all antenna elements having a horizontal polarization by deactivating whichever RF chain(s) feeds such antenna elements, which may result in an antenna output belonging to the vertical polarization only. The control unit may also be configured to perform similar functionality with respect to antenna elements having other polarization values (e.g., slant/cross polarizations). In another implementation, instead of activating all of the antenna elements of the phased antenna array having a particular polarization (e.g., all of the horizontal antenna elements or all of the vertical antenna elements), the control unit could be configured to activate less than all of the antenna elements having a particular polarization. For instance, consider an example of a phased antenna array that includes one set of antenna elements having a horizontal polarization (e.g., 8 horizontal antenna elements) and another set of antenna elements having a vertical polarization (e.g., 8 vertical antenna elements). In such an arrangement, the control unit may be configured to independently activate (or maintain activation of) two or more different subsets of the antenna elements having the horizontal polarization and/or two or more different subsets of the antenna elements having the vertical polarization. For example, the control unit may function to activate (or maintain activation of) one particular subset of antenna elements having the horizontal polarization (e.g., 4 of the 8 available horizontal elements) while deactivating all of the other antenna elements having the horizontal polarization as well as all of the antenna elements having the vertical polarization. As another example, the control unit may function to activate (or maintain activation of) one particular subset of antenna elements having the vertical polarization (e.g., 4 of the 8 available vertical elements) while deactivating all of the other antenna elements having the vertical polarization as well as all of the antenna elements having the horizontal polarization. As yet another example, the control unit may function to activate (or maintain activation of) multiple subsets of antenna elements having the horizontal polarization or multiple subsets of antenna elements having the vertical polarization. Other examples are possible as well. The control unit may also be configured to perform similar functionality with respect to antenna elements having other polarization values (e.g., slant/cross polarizations). This capability to activate different subsets of antenna elements having a particular polarization may provide various benefits, including but not limited to the capability to establish multiple separate wireless links using the different subsets of antenna elements having the particular polarization. In yet another implementation, instead of keeping antenna elements having only one single polarization activated at any given time, the control unit could be configured to activate (and maintain activation of) antenna elements having multiple different polarizations at the same time. For instance, consider an example of a phased antenna array that includes one set of antenna elements having a horizontal polarization (e.g., 8 horizontal antenna elements) and another set of antenna elements having a vertical polarization (e.g., 8 vertical antenna elements). In such an arrangement, the control unit may be configured to activate (or maintain activation of) both (i) antenna elements having the horizontal polarization and (ii) antenna elements having the vertical polarization. The control unit may also be configured to perform similar functionality with respect to antenna elements having other polarization values (e.g., slant/cross polarizations). This capability to activate (or maintain activation of) antenna elements having multiple different polarizations may provide various benefits, including but not limited to the capability for a radio module to perform (i) signal reception over an established bi-directional link using antenna elements having one of two possible polarizations and (ii) signal transmission over the established bi-directional link using antenna elements having the other of two possible polarizations. In such an implementation where a radio module uses antenna elements having one polarization for signal reception and antenna elements having another polarization for signal transmission, the radio module may utilize any of various different multiple access techniques to carry out such signal reception and/or transmission, including but not limited to time division duplexing (TDD), frequency division duplexing (FDD), Multiuser Superposition Transmission (MUST), CDMA, (FDMA), (TDMA), (SC-FDMA), (SC-TDMA), OFDMA, and/or (NOMA), among other possibilities. It should also be understood that the foregoing implementations could be implemented together. For instance, the control unit could be configured to activate both a particular subset of antenna elements having a horizontal polarization and a particular subset of antenna elements having a vertical polarization, while other subsets of antenna elements having horizontal and vertical polarizations are deactivated. Other implementations are possible as well. In some embodiments, the output of the phased antenna array's antenna elements can also be fed into one or more beam narrowing modules that are included as part of a radio module designed in accordance with this aspect of the present disclosure. For instance, in one implementation, a radio module may include a single beam narrowing module, and the output of all of the phased antenna array's antenna elements may be fed into that single beam narrowing module. In another implementation, a radio module may include multiple separate beam narrowing modules, and the output of different sets and/or subsets of the phased antenna array's antenna elements may be fed into the multiple separate beam narrowing modules. For example, in an implementation where the phased antenna array includes antenna elements that each have one of two possible polarizations, a radio module may include at least one respective beam narrowing module corresponding to each of the two possible polarizations, where the output of a first set of antenna elements having a first polarization is fed into a first beam narrowing module and the output of a second set of antenna elements having a second polarization is fed into a second beam narrowing module. As another example, in an implementation where different subsets of antenna elements having a same given polarization can be activated/deactivated independently from one another, a radio module may include multiple beam narrowing modules corresponding to a single polarization, where the output of each different subset of antenna elements having the given polarization is fed into a different beam narrowing module. Other example arrangements of multiple beam narrowing modules are possible as well—including but not limited to the possibility that a radio module may include multiple beam narrowing modules corresponding to each possible polarization of the antenna elements (e.g., a first set of two or more beam narrowing modules corresponding to a horizontal polarization and a second set of two or more beam narrowing modules corresponding to a vertical polarization). Each of the one or more beam narrowing modules that are included as part of a radio module designed in accordance with this aspect of the present disclosure can take any of various forms, examples of which may include a lens antenna, a parabolic antenna, or a different type of antenna, among other possibilities. Further, in operation, each beam narrowing module may function to consolidate the signals emitted from different active antenna elements of the phased antenna array into a single narrow beam composite signal. For instance, in an implementation where the output of all of the phased antenna array's antenna elements are fed into a single beam narrowing module, then that single beam narrowing module may function to consolidate the signals emitted from whichever of the phased antenna array's antenna elements are active at any given time into a single narrow beam composite signal. For example, in a scenario where the control unit has activated all of the antenna elements having one of two possible polarizations and deactivated all of the antenna elements having the other of the two possible polarization, the single beam narrowing module may function to consolidate the signals emitted from the all of the antenna elements having that one polarization into a single narrow beam composite signal, such that the output of the beam narrowing module belongs to that one polarization only. Further, in an implementation where the module has two beam narrowing modules corresponding to the two possible polarizations of the antenna elements, then a first beam narrowing module may function to consolidate the signals emitted from a first set of antenna elements having a first polarization (e.g., horizontal) into a first narrow beam composite signal at times when such antenna elements are active, and a second beam narrowing module may function to consolidate the signals emitted from a second set of antenna elements having a second polarization (e.g., vertical) into a second narrow beam composite signal at times when such antenna elements are active. Further yet, in an implementation where the module has multiple beam narrowing modules that correspond to a same given polarization and are each configured to receive the output from a different subset of antenna elements having that given polarization, each such beam narrowing module may function to consolidate the different individual signals emitted from a respective subset of antenna elements having the given polarization into a respective narrow beam composite signal at times when such antenna elements are active. To illustrate, consider an example where the phrase antenna array has a set of 8 antenna elements having a horizontal polarization, where these 8 antenna elements are grouped into two subsets of 4 antenna elements that can be activated/deactivated independently of one another via the control unit and RF module. In this example, the radio module may include two different beam narrowing modules corresponding to the horizontal polarization, where a first beam narrowing module functions to consolidate the signals emitted from the first subset of 4 antenna elements having the horizontal polarization into a first narrow beam composite signal at times when such antenna elements are active and a second beam narrowing module functions to consolidate the different individual signals emitted from the second subset of 4 antenna elements having the horizontal polarization into a second narrow beam composite signal at times when such antenna elements. Many other examples are possible as well. Some possible examples of radio module designed in accordance with this aspect of the present disclosure are illustrated inFIGS.29A,29B, and29C. Beginning withFIG.29A, a first example of a radio module2900is shown that includes a control unit2910, an RF module2920comprising a plurality of RF chains, a phased antenna array2940comprising a first set of antenna elements having a horizontal polarization (marked “H” and depicted by a slanted line pattern) and a second set of antenna elements having a vertical polarization (marked “V” and depicted by a solid pattern), and a single beam narrowing module (“BN module”)2950. As shown, in this example, the output of both the first set of antenna elements having the horizontal polarization and the second set of antenna elements having the vertical polarization are fed into the single BN module2950, which then functions to consolidate the signals emitted by whichever of these antenna elements are active at any given time into a single narrow beam composite signal2960. In line with the description above, the control unit2910may be configured to activate and de-activate specific antenna elements of the phased antenna array2940by correspondingly activating and de-activating the particular RF chains that feeds those specific antenna elements. For instance, in the example shown inFIG.29A, the control unit2910may be configured to activate only antenna elements having a given one of the two possible polarizations at a given time. For instance, the control unit2910may be configured to either (i) activate all of the antenna elements that have the horizontal polarization while deactivating all of the antenna elements that have the vertical polarization or (ii) activate all of the antenna elements that have the vertical polarization while deactivating all of the antenna elements that have the horizontal polarization. Regardless of which set of antenna elements is activated, the corresponding antenna output from those antenna elements (either horizontal or vertical polarization) is fed into the BN module2950, which then consolidates the multiple signals received from the activated antenna elements into a single narrow beam composite signal2960. However, the control unit2910may function to place the phased antenna array2940into other activation states as well (e.g., activation states in which a combination of horizontal and vertical antenna elements are activated at the same time). In some implementations, the radio module2900may include an equal number of RF chains and antenna elements, in which case each of the antenna elements of the phased antenna array2940may be fed by a dedicated RF chain, and the control unit2910may activate and deactivate a given antenna element by activating and deactivating the dedicated RF chain that feeds the given antenna element. In other implementations, the radio module2900may include less RF chains than antenna elements, in which case the antenna elements of the phased antenna array2940may be grouped together (e.g., into groups of two or more antenna elements having the same polarization) for purposes of the RF chains, such that each respective RF chain may be configured to feed multiple antenna elements. The control unit2910may then activate and deactivate a given group of antenna elements by activating and deactivating the respective RF chain that feeds the given group of antenna elements. The RF feeds of the radio module2900may be arranged in other manners as well. Turning toFIG.29B, a second example of a radio module2902is shown that includes a control unit2910, an RF module2920comprising a plurality of RF chains2921-2936, a phased antenna array2940comprising a first set of antenna elements having a horizontal polarization (marked “H” and depicted by a slanted line pattern) and a second set of antenna elements having a vertical polarization (marked “V” and depicted by a solid pattern), and two BN modules2951and2952that respectively correspond to signals received by antenna elements having the horizontal and vertical polarizations. As shown, in this example, output of the first set of antenna elements having the horizontal polarization is fed into the first BN module2951, which then functions to consolidate the signals emitted by that first set of antenna elements into a first narrow beam composite signal2961when such antenna elements are active, and the output of the second set of antenna elements having the vertical polarization are fed into the second BN module2952, which then functions to consolidate the signals emitted by that second set of antenna elements into a second narrow beam composite signal2962when such antenna elements are active. In line with the description above, the control unit2910may be configured to activate and de-activate specific antenna elements of the phased antenna array2940by correspondingly activating and de-activating the particular RF chains that feeds those specific antenna elements. For instance, in the example ofFIG.29B, the control unit2910may be configured to activate both the first set of antenna elements having the horizontal polarization and the second set of antenna elements having the vertical polarization at the same time, such as in a scenario where one set of antenna elements is used for signal reception on a bi-directional wireless link and the other set of antenna elements is used for signal transmission on the bi-directional wireless link. Alternatively, the control unit2910may be configured to activate only a given one of the first or second set of antenna elements corresponding to a given polarization at a given time. The control unit2910may function to place the phased antenna array2940into other activation states as well (e.g., activation states in which a combination of horizontal and vertical antenna elements are activated at the same time). In some implementations, the radio module2902may include an equal number of RF chains and antenna elements, in which case each antenna element of the phased antenna array2940may be fed by a dedicated RF chain, and the control unit2910may activate and deactivate a given antenna element by activating and deactivating the dedicated RF chain that feeds the given antenna element. In other implementations, the radio module2902may include less RF chains than antenna elements, in which case the antenna elements of the phased antenna array2940may be grouped together (e.g., into groups of two or more antenna elements having the same polarization) for purposes of the RF chains, such that each respective RF chain may be configured to feed multiple antenna elements. The control unit2910may then activate and deactivate a given group of antenna elements by activating and deactivating the respective RF chain that feeds the given group of antenna elements. The RF feeds of the radio module2902may be arranged in other manners as well. Turning toFIG.29C, a third example of a radio module2904is shown that includes a control unit2910, an RF module2920comprising a plurality of RF chains2921-2936, a phased antenna array2940comprising a first set of antenna elements having a horizontal polarization (marked “H” and depicted by a slanted line pattern) and a second set of antenna elements having a vertical polarization (marked “V” and depicted by a solid pattern), and four BN modules2953,2954,2955, and2956. As shown, in this example, the first and second sets of antenna elements of the phased antenna array2940may each be grouped into different subsets that each output signals to a respective BN module. For example, the first set of antenna elements having the horizontal polarization may be grouped into a first subset (depicted by a dashed box) and a second subset (depicted by a dotted box), and the second set of antenna elements having the vertical polarization may likewise be grouped into a first subset (depicted by a dashed box) and a second subset (depicted by a dotted box). The antenna array elements in each of these subsets may then output signals to a respective BN module. For example, as shown inFIG.29C, (i) the first subset of antenna elements that have the horizontal polarization may output (when activated) signals to BN module2953, which then consolidates the received signals into a single narrow beam composite signal2963, (ii) the first subset of antenna elements that have the vertical polarization may output (when activated) signals to BN module2954, which then consolidates the received signals into a single narrow beam composite signal2964, (iii) the second subset of antenna elements that have the horizontal polarization may output (when activated) signals to BN module2955, which then consolidates the received signals into a single narrow beam composite signal2965, and (iv) the second subset of antenna elements that have the vertical polarization may output (when activated) signals to BN module2956, which then consolidates the received signals into a single narrow beam composite signal2966. In the example ofFIG.29C, the control unit2910may be configured to separately control each subset of antenna elements and thereby facilitate establishing multiple different bi-directional links between the radio module2904and one or more other radio modules in the wireless mesh network. For example, the control unit2910may be configured to activate both (i) the first subset of antenna elements having the horizontal orientation to transmit signals over a first bi-directional link and (ii) the first subset of antenna elements having the vertical orientation to receive signals over the first bi-directional link. Similarly, the control unit2910may be configured to activate both (i) the second subset of antenna elements having the horizontal orientation to transmit signals over a second bi-directional link and (ii) the second subset of antenna elements having the vertical orientation to receive signals over the second bi-directional link. In this way, the radio module2904may establish multiple different bi-directional links for signal transmission and signal reception with one or more other radio modules. The control unit2910may also function to place the phased antenna array2940into other activation states as well (e.g., activation states in which a combination of horizontal and vertical antenna elements are activated at the same time). In line with the description above, the control unit2910may be configured to activate and de-activate specific antenna elements of the phased antenna array2940by correspondingly activating and de-activating the particular RF chains that feeds those specific antenna elements. For instance, in the example ofFIG.29C, the control unit2910may be configured to activate both the first set of antenna elements having the horizontal polarization and the second set of antenna elements having the vertical polarization at the same time, such as in a scenario where one set of antenna elements is used for signal reception on a bi-directional wireless link and the other set of antenna elements is used for signal transmission on the bi-directional wireless link. Alternatively, the control unit2910may be configured to activate only a given one of the first or second set of antenna elements corresponding to a given polarization at a given time. The control unit2910may function to place the phased antenna array2940into other activation states as well (e.g., activation states in which a combination of horizontal and vertical antenna elements are activated at the same time). In some implementations, the radio module2904may include an equal number of RF chains and antenna elements, in which case each antenna element of the phased antenna array2940may be fed by a dedicated RF chain, and the control unit2910may activate and deactivate a given antenna element by activating and deactivating the dedicated RF chain that feeds the given antenna element. In other implementations, the radio module2902may include less RF chains than antenna elements, in which case the antenna elements of the phased antenna array2940may be grouped together (e.g., into groups of two or more antenna elements having the same polarization) for purposes of the RF chains, such that each respective RF chain may be configured to feed multiple antenna elements. The control unit2910may then activate and deactivate a given group of antenna elements by activating and deactivating the respective RF chain that feeds the given group of antenna elements. The RF feeds of the radio module2904may be arranged in other manners as well. FIGS.29A,29B, and29Ceach depict one embodiment of a radio module having a phased antenna array as disclosed herein. It should be understood that other examples in accordance with this disclosure are also possible. CONCLUSION Example embodiments of the disclosed innovations have been described above. At noted above, it should be understood that the figures are provided for the purpose of illustration and description only and that various components (e.g., modules) illustrated in the figures above can be added, removed, and/or rearranged into different configurations, or utilized as a basis for modifying and/or designing other configurations for carrying out the example operations disclosed herein. In this respect, those skilled in the art will understand that changes and modifications may be made to the embodiments described above without departing from the true scope and spirit of the present invention, which will be defined by the claims. Further, to the extent that examples described herein involve operations performed or initiated by actors, such as humans, operators, users or other entities, this is for purposes of example and explanation only. Claims should not be construed as requiring action by such actors unless explicitly recited in claim language. | 132,259 |
11862861 | DETAILED DESCRIPTION Although utilizing multiple antenna arrays may increase spatial coverage of an electronic device or increase a quantity of frequency bands supported by the electronic device, it may be challenging to design a wireless transceiver to support the multiple antenna arrays and fit within a size constraint of the electronic device without adversely impacting system performance or increasing cost. Some wireless transceiver architectures include separate or dedicated transceiver chains for each antenna element within the multiple antenna arrays. These separate transceiver chains, however, occupy space and may limit a quantity of antenna arrays that can be supported within smaller electronic devices. Consequently, this approach may be impractical for electronic devices that place a premium on small size or low weight. Other wireless transceiver architectures may utilize switches to connect a shared transceiver chain to different antenna elements of different antenna arrays. The switches, however, add an additional cost to the wireless transceiver and add insertion loss, which degrades system performance. In this case, amplifier stages within the wireless transceiver are shared with different antenna elements of different antenna arrays. However, because the switches are coupled between the antenna arrays and the amplifier stages, the wireless transceiver architecture can experience degraded gain, output power, linearity, or noise figure performance. To address such challenges, techniques for a hybrid wireless transceiver architecture that supports multiple antenna arrays are described herein. The described techniques implement a wireless transceiver with dedicated circuitry coupled to the multiple antenna arrays and shared circuitry coupled to the dedicated circuitry. The dedicated circuitry includes dedicated components that condition signals for different antenna arrays. In contrast, shared components within the shared circuitry condition the signals for multiple antenna arrays. While the dedicated components enable the wireless transceiver to achieve a target linearity and noise figure performance, use of the shared circuitry can appreciably reduce a total size of the wireless transceiver. In this way, the hybrid architecture enables the wireless transceiver to be implemented within space-constrained devices and still support a larger quantity of antenna arrays relative to other wireless transceiver architectures. With a larger quantity of antenna arrays, an electronic device may increase spatial coverage for one or more frequency bands (e.g., a millimeter-wave (mmW) frequency band). FIG.1illustrates an example environment100for utilizing a hybrid wireless transceiver architecture to support multiple antenna arrays. In the example environment100, a computing device102communicates with a base station104through a wireless communication link106(wireless link106). In this example, the computing device102is depicted as a smart phone. However, the computing device102may be implemented as any suitable computing or electronic device, such as a modem, cellular base station, broadband router, access point, cellular phone, gaming device, navigation device, media device, laptop computer, desktop computer, tablet computer, wearable computer, server, network-attached storage (NAS) device, smart appliance or other internet of things (IoT) device, medical device, vehicle-based communication system, radar, radio apparatus, and so forth. The base station104communicates with the computing device102via the wireless link106, which may be implemented as any suitable type of wireless link. Although depicted as a tower of a cellular network, the base station104may represent or be implemented as another device, such as a satellite, server device, terrestrial television broadcast tower, access point, peer-to-peer device, mesh network node, fiber optic line, and so forth. Therefore, the computing device102may communicate with the base station104or another device via a wired connection, a wireless connection, or a combination thereof. The wireless link106can include a downlink of data or control information communicated from the base station104to the computing device102, or an uplink of other data or control information communicated from the computing device102to the base station104. The wireless link106may be implemented using any suitable communication protocol or standard, such as second-generation (2G), third-generation (3G), fourth-generation (4G), fifth-generation (5G), IEEE 802.11 (e.g., Wi-Fi™), IEEE 802.15 (e.g., Bluetooth™), IEEE 802.16 (e.g., WiMAX™), and so forth. In some implementations, the wireless link106may wirelessly provide power and the base station104may comprise a power source. As shown, the computing device102includes an application processor108and a computer-readable storage medium110(CRM110). The application processor108may include any type of processor, such as a multi-core processor, that executes processor-executable code stored by the CRM110. The CRM110may include any suitable type of data storage media, such as volatile memory (e.g., random access memory (RAM)), non-volatile memory (e.g., Flash memory), optical media, magnetic media (e.g., disk), and so forth. In the context of this disclosure, the CRM110is implemented to store instructions112, data114, and other information of the computing device102, and thus does not include transitory propagating signals or carrier waves. The computing device102may also include input/output ports116(I/O ports116) and a display118. The I/O ports116enable data exchanges or interaction with other devices, networks, or users. The I/O ports116may include serial ports (e.g., universal serial bus (USB) ports), parallel ports, audio ports, infrared (IR) ports, user interface ports such as a touchscreen, and so forth. The display118presents graphics of the computing device102, such as a user interface associated with an operating system, program, or application. Alternately or additionally, the display118may be implemented as a display port or virtual interface, through which graphical content of the computing device102is presented. A wireless transceiver120of the computing device102provides connectivity to respective networks and other electronic devices connected therewith. Alternately or additionally, the computing device102may include a wired transceiver, such as an Ethernet or fiber optic interface for communicating over a local network, intranet, or the Internet. The wireless transceiver120may facilitate communication over any suitable type of wireless network, such as a wireless local area network (LAN) (WLAN), peer-to-peer (P2P) network, mesh network, cellular network, wireless wide-area-network (WWAN), and/or wireless personal-area-network (WPAN). In the context of the example environment100, the wireless transceiver120enables the computing device102to communicate with the base station104and networks connected therewith. However, the wireless transceiver120can also enable the computing device102to communicate “directly” with other devices or networks. The wireless transceiver120includes circuitry and logic for transmitting and receiving communication signals via at least two antenna arrays122-1to122-N. Components of the wireless transceiver120can include amplifiers, switches, mixers, analog-to-digital converters, filters, and so forth for conditioning the communication signals (e.g., for generating or processing signals). The wireless transceiver120may also include logic to perform in-phase/quadrature (I/Q) operations, such as synthesis, encoding, modulation, decoding, demodulation, and so forth. In some cases, components of the wireless transceiver120are implemented as separate receiver and transmitter entities. Additionally or alternatively, the wireless transceiver120can be realized using multiple or different sections to implement respective receiving and transmitting operations (e.g., separate transmit and receiver chains). In general, the wireless transceiver120processes data and/or signals associated with communicating data of the computing device102over the antenna arrays122-1and122-N. Although not explicitly depicted, the wireless transceiver120may also include a processor to perform high-rate sampling processes that can include analog-to-digital conversion, digital-to-analog conversion, gain correction, skew correction, frequency translation, and so forth. The processor can provide communication data to the wireless transceiver120for transmission and can process a baseband version of a signal received via the wireless transceiver120to generate data. The data can be provided to other parts of the computing device102via a communication interface for wireless communication. In example implementations, the wireless transceiver120includes dedicated circuitry124-1to124-N and shared circuitry126. The dedicated circuitry124-1to124-N are respectively coupled to the antenna arrays122-1to122-N. For example, the dedicated circuitry124-1includes at least a first component dedicated to a first antenna array122-1and the dedicated circuitry124-N includes at least an Nth component dedicated to the antenna array122-N (shown inFIGS.3-1and3-2). The first component and the second component can each comprise an active component or a passive component. In general, the dedicated circuitry124-1to124-N includes dedicated components that are respectively coupled to individual antenna elements of the antenna arrays122-1and122-N. These dedicated components individually condition signals for respective ones of different antenna arrays122-1to122-N. A signal that is conditioned by a dedicated component propagates to or from the antenna array that the dedicated component is associated with and does not substantially propagate to or from another antenna array for which the dedicated component is not associated with. In contrast, the shared circuitry126includes at least one component that is common to, or shared with, at least two antenna arrays or more (e.g., shared with both the antenna arrays122-1and122-2). Generally, the shared component is coupled to multiple antenna elements associated with different antenna arrays122-1to122-N via the dedicated components of the dedicated circuitry124-1to124-N. The shared component conditions signals that propagate to or from one or more of the multiple antenna arrays122-1to122-N at a same time period or at different time periods. The dedicated circuitry124-1to124-N and the shared circuitry126can at least partially implement the hybrid wireless transceiver architecture that supports multiple antenna arrays122-1to122-N, as further described with respect toFIGS.2,4-1,4-2, and5-1to5-3. The wireless transceiver120also includes control circuitry128, which may be implemented within or separate from the wireless transceiver120as a modem, a general-purpose processor, a controller, fixed logic circuitry, hard-coded logic, some combination thereof, and so forth. Components of the control circuitry128can be localized at one module or one integrated circuit chip or can be distributed across multiple modules or chips. Although not explicitly shown, the control circuitry128can include at least one CRM (e.g., the CRM110), can include a portion of the CRM110, or can access the CRM110to obtain computer-readable instructions (e.g., instructions112). The control circuitry128controls the wireless transceiver120and enables wireless communication to be performed. In general, the control circuitry128can control an operational mode of the wireless transceiver120or has knowledge of a current operational mode. Different types of operational modes may include a transmission mode, a reception mode, different spatial coverage modes, different frequency modes (e.g., a high frequency mode or a low frequency mode), different power modes (e.g., a low-power mode or a high-power mode), different resource control states (e.g., a connected mode, an inactive mode, or an idle mode), different modulation modes (e.g., a lower-order modulation mode such as quadrature phase-shift keying (QPSK) modes or higher-order modulation modes such as 64 quadrature amplitude modulation (QAM) or 256 QAM), and so forth. Some or all of these modes may be associated with different antenna arrays122-1to122-N. Therefore, to support a particular operational mode, the control circuitry128enables the corresponding antenna arrays122-1to122-N to be utilized. The antenna arrays122-1and122-N can be selected for use during a same time period or during different time periods. The control circuitry128ensures that signals can propagate between the dedicated components of the dedicated circuitry124-1to124-N and the shared circuitry126without introducing significant losses. The control circuitry128can also ensure that the propagation between the dedicated circuitry124-1to124-N and the shared circuitry126achieve intended functions like power splitting or power combining. In some cases, the control circuitry128indirectly controls the propagation of the signals by causing the dedicated components associated with the selected antenna array122-1or122-N to be in an active state (e.g., to be powered on) and causing the other dedicated components to be in an inactive state (e.g., to be powered off). In other cases, the control circuitry128directly controls the propagation of the signals between the dedicated circuitry124-1to124-N and the shared circuitry126via an interface circuit, which is further described with respect toFIGS.4-2and5-3. The wireless transceiver120and the antenna arrays122-1and122-N are further described with respect toFIG.2. FIG.2illustrates an example integration of a portion of the wireless transceiver120and the antenna arrays122-1and122-N for supporting multiple antenna arrays with a hybrid wireless transceiver architecture. In the depicted configuration, the wireless transceiver120includes at least one integrated circuit202, which is implemented on a transceiver die204. In this case, the integrated circuit202includes the dedicated circuitry124-1to124-N and the shared circuitry126. If the wireless transceiver120includes other integrated circuits, other portions of the shared circuitry126may be implemented within these other integrated circuits. The integrated circuit202can be mounted to a substrate206, which includes an interface208with multiple terminals and the antenna arrays122-1to122-N. The interface208, which is disposed on a surface of the substrate206, is configured to accept and connect to the transceiver die204. The multiple terminals of the interface208are represented as terminals210-1to210-A and terminals212-1to212-B, where “A” and “B” are integers that may or may not be equal to each other. The values of “A” and “B” are based on a total quantity of antenna elements of the antenna arrays122-1and122-N. Each of the dedicated circuitry124-1to124-N includes one or more dedicated components that are respectively associated with the antenna arrays122-1to122-N. The terminals210-1to210-A of the interface208connect the antenna elements of the antenna array122-1to nodes216-1to216-A of the dedicated circuitry124-1. Likewise, the terminals212-1to212-B of the interface208connect the antenna elements of the antenna array122-N to nodes218-1to218-B of the dedicated circuitry124-N. The nodes216-1to216-A and218-1to218-B are connected to respective front ends of multiple transceiver chains within the wireless transceiver120, as shown inFIGS.5-1to5-3. Within the dedicated circuitry124-1to124-N, these multiple transceiver chains have separate communication paths that connect the nodes216-1to216-A and218-1to218-B to nodes220-1to220-C, where “C” is a positive integer. In order to use the shared circuitry126for multiple antenna arrays122-1to122-N, at least one of the nodes216-1to216-A and at least one of the nodes218-1and218-B are coupled to one of the nodes220-1to220-C, although one or more dedicated components of the dedicated circuitry124-1to124-N may be coupled between a respective node216and node218and the corresponding node220. In some implementations, one or more interface components may be used to couple the dedicated components of the respective dedicated circuitry124-1to124-N to the corresponding node220. Generally, the dedicated circuitry124-1is operationally coupled to the first antenna array122-1and operationally decoupled from the other antenna arrays (e.g., the Nth antenna array122-N). Similarly, the dedicated circuitry124-N is operationally coupled to the Nth antenna array122-N and operationally decoupled from the other antenna arrays (e.g., the first antenna array122-1). Within the integrated circuit202, the shared circuitry126is coupled to the dedicated circuitry124-1to124-N via the nodes220-1to220-C. In this way, the shared circuitry126is coupled to both the antenna arrays122-1and122-N through the dedicated circuitry124-1to124-N. At the nodes220-1to220-C, the multiple transceiver chains within the wireless transceiver120have shared communication paths through the shared circuitry126. At the nodes220-1to220-C, a communication path within the shared circuitry126transitions to separate communication paths in the dedicated circuitry124-1to124-N that are coupled to the associated antenna arrays122-1and122-N. Although not explicitly depicted, the interface208can include additional terminals to connect the dedicated circuitry124-1to124-N or the shared circuitry126to other components, such as another integrated circuit that is a part of the wireless transceiver120or the control circuitry128(not shown). In some aspects, the antenna elements within the antenna arrays122-1to122-N can be directly connected to the terminals210-1to210-A and212-1to212-B of the interface208. In other aspects, one or more active or passive components can be coupled between the antenna elements of the antenna arrays122-1to122-N and the terminals210-1to210-A and212-1to212-B. InFIG.2, the antenna arrays122-1and122-N are respectively tuned to mmW frequency bands222-1and222-N. In some cases, the mmW frequency bands222-1and222-N may be different frequency bands or may be a same frequency band. In general, a frequency band is a continuous spectrum that may have a dedicated purpose defined by a government and may be publicly or privately owned (e.g., unlicensed or licensed). Example mmW frequency bands include the mmW frequency bands for fifth-generation standards, such as a 24 gigahertz (GHz) frequency band, a 28 GHz frequency band, a 31 GHz frequency band, a 39 GHz frequency band, a 43 GHz frequency band, a 47 GHz frequency band, and so forth. Although the antenna arrays122-1and122-N and the wireless transceiver120described herein can support the mmW frequency bands222-1and222-N, other implementations may support other frequency bands, such as those that include frequencies below 24 GHz or above 47 GHz. The antenna arrays122-1and122-N are further described with respect toFIGS.3-1to3-2. FIG.3-1illustrates example implementations of two antenna arrays122-1and122-2that are supported by a hybrid wireless transceiver architecture. In the depicted configuration, the first antenna array122-1includes antenna elements302-1,302-2. . .302-A and the second antenna array122-2includes antenna elements304-1,304-2. . .304-B. The antenna elements302-1to302-A and304-1to304-B can comprise active or passive antenna elements. In some implementations, an antenna element spacing306-1between adjacent elements within the first antenna array122-1may be approximately a fraction of a center wavelength associated with the mmW frequency band222-1. Likewise, an antenna element spacing306-2between adjacent elements within the second antenna array122-2may be approximately a fraction of a center wavelength associated with the mmW frequency band222-2. The antenna arrays122-1and122-2may comprise linear arrays, uniform linear arrays, two-dimensional arrays, or a combination thereof. Within the antenna arrays122-1and122-2, a patch antenna element308, a dipole antenna element310, or a bowtie antenna element312may be used to implement one or more of the antenna elements302-1to302-A and304-1to304-B. Other types of antenna elements may also be implemented, including slot antenna elements, cross-patch antenna elements, and so forth. The antenna elements302-1to302-A and304-1to304-B may be single-polarized antenna elements, dual-polarized antenna elements, or a combination thereof. The antenna elements302-1to302-A and304-1to304-B are respectively shown to be coupled to the terminals210-1,210-2. . .210-A and212-1,212-2. . .212-B ofFIG.2. Although not shown, the antenna elements302-1to302-A or304-1to304-B that include multiple feed ports may be coupled to additional terminals of the interface208and other portions of the dedicated circuitry124-1to124-N that are not explicitly shown inFIG.2. The antenna arrays122-1and122-2may have similar orientations or different orientations. In some cases the antenna arrays122-1and122-2may be located in different areas of the computing device102. For example, the first antenna array122-1may be located along a top side of the computing device102while the second antenna array122-2is located along a left side or a right side of the computing device102. In other cases, the antenna arrays122-1and122-2may be co-located or proximate to one another, an example of which is further described with respect toFIG.3-2. FIG.3-2illustrates an example arrangement of the antenna arrays122-1and122-2within the computing device102that utilizes a hybrid wireless transceiver architecture. In the depicted configuration, the antenna arrays122-1and122-2are both positioned in an upper-left corner of the computing device102and include different types of antenna elements in different arrangements. In this manner, the antenna arrays122-1and122-2provide different spatial coverages as described below. The first antenna array122-1includes four dipole antenna elements314-1to314-4positioned along a top side316and a left side318of the computing device102. The dipole antenna elements314-1and314-2can transmit and receive signals along a vertical direction or Y axis while the dipole antenna elements314-3and312-4can transmit and receive signals along a horizontal direction or X axis. The second antenna array122-2includes four patch antenna elements320-1to320-4arranged in a two-dimensional shape with respect to a front side322of the computing device102. The patch antenna elements320-1to320-4can transmit and receive signals above the page along a Z axis. By utilizing multiple antenna arrays122-1and122-2, the computing device102may realize a target spatial coverage for transmitting and receiving signals associated with one or more mmW frequency bands222-1to222-2. The control circuitry128may dynamically select which antenna array122-1and122-2to use based on a current situation. If the control circuitry128determines a portion of one of the antenna arrays122-1and122-2is obstructed (e.g., by a user's appendage), the control circuitry128can cause the wireless transceiver120to transmit and receive signals via the unobstructed antenna array122-1or122-2. As another example, the control circuitry128can select the antenna array122-1or122-2that provides spatial coverage along a direction to the base station104ofFIG.1or supports a particular mmW frequency band222-1to222-N. The wireless transceiver120is further described with respect toFIG.4-1. FIG.4-1illustrates an example wireless transceiver120that utilizes a hybrid wireless transceiver architecture to support the antenna arrays122-1and122-N. The wireless transceiver120includes at least two transceiver chains402-1to402-M, where “M” is a positive integer that is based on a total quantity of antenna elements of the antenna arrays122-1and122-N. The transceiver chains402-1to402-M are coupled to the antenna arrays122-1and122-N via the nodes216-1to216-A and218-1to218-B ofFIG.2and are distributed through portions of a baseband circuit404, an intermediate-frequency (IF) circuit406(IF circuit406), and a radio-frequency (RF) circuit408(RF circuit408) of the wireless transceiver120. In some cases, the baseband circuit404, the IF circuit406, and the RF circuit408may be implemented in separate integrated circuits. For example, the RF circuit408may be implemented in the integrated circuit202ofFIG.2. The baseband circuit404, the IF circuit406, and the RF circuit408include components that enable the wireless transceiver120to condition signals that are provided to or accepted from the antenna arrays122-1and122-N. Although not shown, the baseband circuit404may be coupled to a modem or a processor within the computing device102. In general, the IF circuit406upconverts baseband signals to an intermediate frequency and downconverts intermediate-frequency signals to baseband. The intermediate frequency can be on the order of several gigahertz, such as between approximately 5 and 15 GHz. Likewise, the radio-frequency circuit408upconverts intermediate-frequency signals to radio frequencies and downconverts radio-frequency signals to intermediate frequencies. The radio frequencies can include frequencies in the extremely-high frequency (EHF) spectrum, such as mmW frequencies between approximately 24 and 300 GHz. Each transceiver chain402-1to402-M within the RF circuit408can include at least one power amplifier418(PA418), which may comprise a single amplifier or multiple amplifiers. In this example, the power amplifier418includes at least a first-stage amplifier420and a last-stage amplifier422. The transceiver chains402-1to402-M within the RF circuit408can also respectively include at least one low-noise amplifier424(LNA424), which may similarly comprise a single amplifier or multiple amplifiers. In this example, the low-noise amplifier424includes at least a first-stage amplifier426and a last-stage amplifier428. Along a transmit path, which is shown traveling from right to left, the baseband circuit404generates a digital baseband signal410-1. Based on the digital baseband signal410-1, the baseband circuit404generates an analog baseband signal412-1. The IF circuit406upconverts the analog baseband signal412-1to produce an intermediate-frequency signal414-1(IF signal414-1). The RF circuit408upconverts the IF signal414-1to generate a radio-frequency signal416-1(RF signal416-1). The RF signal416-1is transmitted via one of the antenna arrays122-1or122-N. In some cases, the RF signal416-1may represent an uplink signal that is transmitted to the base station104ofFIG.1. Along the receive path, which is shown traveling from left to right, the RF circuit408receives another radio-frequency signal416-2(RF signal416-2). The RF signal416-2may represent a downlink signal that is received from the base station104. The RF circuit408downconverts the RF signal416-2to generate an intermediate-frequency signal414-2(IF signal414-2). The IF circuit406downconverts the IF signal414-2to generate the analog baseband signal412-2. The baseband circuit404digitizes the analog baseband signal412-2to generate the digital baseband signal410-2. As shown via the multiple upconversion and downconversion stages of the wireless transceiver120, the wireless transceiver120implements a superheterodyne transceiver. Alternatively, the wireless transceiver120may be implemented as a direct conversion transceiver without the IF circuit406(e.g., with the RF circuit408coupled to the baseband circuit404). Within the wireless transceiver120, the dedicated circuitry124-1to124-N implement respective front ends of the transceiver chains402-1to402-M and include at least a portion of the components within the RF circuit408. The shared circuitry126can include other components within the RF circuit408and/or components within the IF circuit406and the baseband circuit404. Example components that are considered part of the dedicated circuitry124-1to124-N and the shared circuitry126are further described with respect toFIG.4-2. FIG.4-2illustrates example components within the dedicated circuitry124-1to124-N, the shared circuitry126, and an interface circuit450for supporting multiple antenna arrays122-1to122-N with a hybrid wireless transceiver architecture. In the depicted configuration, the dedicated circuitry124-1to124-N includes dedicated components430, such as the power amplifier418or a last-stage amplifier422of the power amplifier418within each of the transceiver chains402-1to402-M ofFIG.4-1. The dedicated components430may also include the low-noise amplifier424or the first-stage amplifier426of the low-noise amplifier424within each of the transceiver chains402-1to402-M. The shared circuitry126includes shared components432, such as an amplifier434or other beginning-stage amplifiers of the power amplifier418(e.g., the first-stage amplifier420). The shared components432may also include an amplifier436or ending-stage amplifiers of the low-noise amplifier424(e.g., the last-stage amplifier428). The amplifiers434and436may be implemented as variable-gain amplifiers, passive amplifiers, or active amplifiers within the RF circuit408, the IF circuit406or the baseband circuit404. Generally, the amplifiers434and436are respectively implemented within the transmit path prior to the power amplifier418and implemented within the receive path following the low-noise amplifier424. Other types of shared components432may include at least one power combiner438or power splitter440, phase shifter442, mixer444, local oscillator446, filter448, and so forth. In some implementations, multiple phase shifters442may be implemented within respective communication paths (e.g., coupled between the mixer444and the power amplifier418or coupled between the mixer444and the low-noise amplifier424) or within a path between the local oscillator446and the mixer444(e.g., coupled between the local oscillator446and the mixer444). The shared components432are part of multiple transceiver chains402-1to402-M and at least one of the shared components432is coupled to two or more dedicated components430associated with two or more antenna arrays122-1to122-N. The dedicated components430and the shared components432may be fully integrated within an integrated circuit, partially integrated within the integrated circuit, or composed of discrete components. In some implementations, the wireless transceiver120includes an interface circuit450, which can include one or more interface components452to couple the shared components432to the dedicated components430. Example types of interface components452include a switch454and a multiplexer456. The switch454can be implemented using one or more transistors, such as metal-oxide-semiconductor field-effect transistors (MOSFETs), junction field-effect transistors (JFETs), bipolar junction transistors (BJTs), and so forth. For example, the switch454can comprise an n-channel metal-oxide-semiconductor field-effect transistor (NMOSFET) or a p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET) and can have a thin or thick gate oxide layer. The interface circuit450is further described with respect toFIG.5-3. Example implementations of the dedicated circuitry124-1and124-2, and the shared circuitry126are shown inFIGS.5-1to5-3. FIG.5-1illustrates an example implementation of the radio-frequency circuit408that utilizes a hybrid wireless transceiver architecture for supporting multiple antenna arrays122-1to122-2. For simplicity, two transceiver chains402-1and402-2respectively associated with the antenna element302-1of the first antenna array122-1and the antenna element304-1of the second antenna array122-2are shown. The first transceiver chain402-1is coupled to the antenna element302-1via the node216-1, and the second transceiver chain402-2is coupled to the antenna element304-1via the node218-1. The transceiver chains402-1and402-2are implemented with separate dedicated components430and with at least a portion of the shared components432as further described below. Within the dedicated circuitry124-1, the first transceiver chain402-1includes the power amplifier418-1, which is coupled between the node216-1and the node220-1, and the low-noise amplifier424-1, which is coupled between the node216-1and the node220-2. Likewise, the second transceiver chain402-2within the dedicated circuitry124-2includes the power amplifier418-2, which is coupled between the node218-1and the node220-1, and the low-noise amplifier424-2, which is coupled between the node218-1and the node220-2. Within the shared circuitry126, both of the transceiver chains402-1and402-2include the mixers444-1and444-2and the local oscillator446. The mixers444-1and444-2are respectively coupled between the nodes220-1and220-2and other components (not shown inFIG.5-1) of the wireless transceiver120. If the antenna arrays122-1and122-2support different mmW frequency bands222-1and222-2, the local oscillator446may generate local oscillator signals with different frequencies in some implementations. In this manner, the intermediate-frequency signals414-1and414-2(ofFIG.4-1) may have respective frequencies that are independent of which antenna array122-1or122-2is selected. In other implementations, the local oscillator446may generate a single local oscillator signal with a frequency that is used to upconvert the intermediate-frequency signal414-1or downconvert the radio-frequency signal416-2if either of the antenna arrays122-1or122-2is selected. In this implementation, the control circuitry128is coupled to the power amplifiers418-1and418-2and the low-noise amplifiers424-1and424-2. To cause signals to propagate to or from the antenna element302-1via the first transceiver chain402-1, the control circuitry128can cause the power amplifier418-2and the low-noise amplifier424-2of the second transceiver chain402-2to be in an inactive state and can cause the power amplifier418-1or the low-noise amplifier424-1of the first transceiver chain402-1to be in an active state. The inactive state or the active state can be triggered via the control circuitry128by, for instance, respectively disabling or enabling power that is supplied to an amplifier. The control circuitry128may generate a control signal, which may be a multi-bit signal with each bit or group of bits configured to control a state of the amplifiers418-1,418-2,424-1, and424-2. In some implementations, the transceiver chains402-1and402-2may share some gain stages within the power amplifiers418-1and418-2or the low-noise amplifiers424-1and424-2, as further described with respect toFIG.5-2. FIG.5-2illustrates another example implementation of the radio-frequency circuit408that utilizes a hybrid wireless transceiver architecture for supporting multiple antenna arrays122-1to122-2. In contrast toFIG.5-1, the power amplifiers418-1and418-2(not explicitly indicated inFIG.5-2) respectively include the last-stage amplifiers422-1and422-2within the dedicated circuitry124-1and124-2, and jointly include the first-stage amplifier420within the shared circuitry126. Likewise, the low-noise amplifiers424-1and424-2(not explicitly indicated inFIG.5-2) respectively include the first-stage amplifiers426-1and426-2within the dedicated circuitry124-1and124-2, and jointly include the last-stage amplifier428within the shared circuitry126. By sharing the first-stage amplifier420and the last-stage amplifier428, a total size of the radio-frequency circuit408may be reduced relative to other architectures that include separate first-stage amplifiers420or last-stage amplifiers428for different transceiver chains402-1and402-2. In this implementation, the antenna arrays122-1and122-2may be individually activated via the control circuitry128by activating or deactivating the last-stage amplifiers422-1or422-2or the first-stage amplifiers426-1and426-2. In other implementations, the wireless transceiver120may include the interface circuit450ofFIG.4-2, to control which of the antenna arrays122-1and122-2are selected, as further described with respect toFIG.5-3. FIG.5-3illustrates an additional example implementation of the radio-frequency circuit408that utilizes a hybrid wireless transceiver architecture for supporting multiple antenna arrays. In the depicted configuration, the radio-frequency circuit408includes the interface circuit450, which is coupled between the dedicated circuitry124-1and124-2and the shared circuitry126. The interface circuit450includes a switch454-1, which is coupled between the node220-1and both of the power amplifiers418-1and418-2. The interface circuit450also includes a switch454-2, which is coupled between the node220-2and both of the low-noise amplifiers424-1and424-2. In some cases, the switches454-1and454-2can couple the nodes220-1to220-2or the dedicated circuitry124-1and124-2to ground while in an open state. Instead of controlling a state of the power amplifiers418-1and418-2and low-noise amplifiers424-1and424-2, the control circuitry128controls the states of the switches454-1and454-2to select one of the antenna arrays122-1or122-2and enable signals to propagate via the associated transceiver chain402-1or402-2. To select the first antenna array122-1, for example, the control circuitry128causes the switch454-1to connect the node220-1to the power amplifier418-1or causes the switch454-2to connect the node220-2to the low-noise amplifier424-1. By implementing the interface circuit450along the communication paths between the dedicated circuitry124-1to124-N and the shared circuitry126, losses associated with the interface circuitry450have less of an impact on system linearity or noise figure performance relative to other wireless transceiver architectures that have the interface circuit coupled to the antenna arrays122-1and122-2. Although only one antenna element of each of the antenna arrays122-1and122-2are shown inFIGS.5-1to5-3, a similar architecture may exist between other antenna elements of the antenna arrays122-1and122-2, such as between second antenna elements302-2and304-2of the first antenna array122-1and the second antenna array122-2, respectively. In this aspect, other dedicated circuitry are respectively coupled to the second antenna elements302-2and304-2and another shared circuitry is coupled to the other dedicated circuitry. Furthermore, this architecture can be applied to more than two antenna arrays such that other antenna elements of other antenna arrays are also coupled to the nodes220-1and220-2with or without an interface circuit450. FIG.6is a flow diagram illustrating an example process600for supporting multiple antenna arrays via a hybrid wireless transceiver architecture. The process600is described in the form of a set of blocks602-610that specify operations that can be performed. However, operations are not necessarily limited to the order shown inFIG.6or described herein, for the operations may be implemented in alternative orders or in fully or partially overlapping manners. Operations represented by the illustrated blocks of the process600may be performed by a wireless transceiver120(e.g., ofFIG.1,2, or4-1) or multiple antenna arrays122-1to122-N (e.g., ofFIG.1or2). More specifically, the operations of the process600may be performed by dedicated circuitry124-1to124-N and shared circuitry126ofFIG.1,2, or5-1to5-3. At block602, a first signal is passed via an antenna element of a first antenna array. For example, the antenna element302-1of the first antenna array122-1passes the radio-frequency signal416-1or416-2ofFIG.4-1. The antenna element302-1may transmit the radio-frequency signal416-1, which is produced via the transceiver chain402-1, or may receive the radio-frequency signal416-2, which is accepted by the transceiver chain402-1. At block604, the first signal is conditioned using a first dedicated component of a wireless transceiver. For example, the power amplifier418-1inFIG.5-1or the last-stage amplifier422-1of the power amplifier418-1inFIG.5-2can comprise a dedicated component430that amplifies the radio-frequency signal416-1. To condition the signal, the control circuitry128activates the power amplifier418-1or the last-stage amplifier422-1. Alternatively, if the wireless transceiver120includes the interface circuit450, as shown inFIG.5-3, the control circuitry128causes the switch454-1to connect the node220-1to the dedicated component430associated with the antenna element302-1(e.g., to the power amplifier418-1or the last-stage amplifier422-1). Additionally or alternatively, the low-noise amplifier424-1inFIG.5-1or the first-stage amplifier426-1of the low-noise amplifier424-1inFIG.5-2can comprise the dedicated component430that amplifies the radio-frequency signal416-2. At block606, a second signal is passed via another antenna element of a second antenna array. For example, the antenna element304-1of the second antenna array122-2passes the radio-frequency signal416-1or416-2ofFIG.4-1. The antenna element304-1may transmit the radio-frequency signal416-1, which is produced via the transceiver chain402-2, or receive the radio-frequency signal416-2, which is accepted by the transceiver chain402-2. At block608, the second signal is conditioned using a second dedicated component of the wireless transceiver. For example, the power amplifier418-2inFIG.5-1or the last-stage amplifier422-2of the power amplifier418-2inFIG.5-2can comprise a dedicated component430that amplifies the radio-frequency signal416-1. To condition the signal, the control circuitry128activates the power amplifier418-2or the last-stage amplifier422-2. Alternatively if the wireless transceiver120includes the interface circuit450, as shown inFIG.5-3, the control circuitry128causes the switch454-2to connect the node220-2to the dedicated component430associated with the antenna element304-1(e.g., to the power amplifier418-2or the last-stage amplifier422-2). Additionally or alternatively, the low-noise amplifier424-2inFIG.5-1or the first-stage amplifier426-2of the low-noise amplifier424-2inFIG.5-2can comprise the dedicated component430that amplifies the radio-frequency signal416-2. At block610, the first signal and the second signal at are conditioned using at least one shared component of the wireless transceiver. For example, the at least one shared component432of the wireless transceiver120conditions the first signal and the second signal. The at least one shared component432can comprise the mixer444-1or444-2inFIGS.5-1to5-3, the first-stage amplifier420of the power amplifiers418-1and418-2inFIG.5-2, the last-stage amplifier428of the low-noise amplifiers424-1and424-2inFIG.5-2, or any of the other shared components432shown inFIG.4-2or described herein. In some situations, the antenna arrays122-1and122-2can be used during a same time period such that steps602to610are performed during this time period. In other situations, the antenna arrays122-1and122-2can be used at different time periods such that the steps602to604are performed during a first time period and the steps606and608are performed during a second time period. As such, the at least one shared component432can condition the first signal during the first time period and condition the second signal during the second time period. Unless context dictates otherwise, use herein of the word “or” may be considered use of an “inclusive or,” or a term that permits inclusion or application of one or more items that are linked by the word “or” (e.g., a phrase “A or B” may be interpreted as permitting just “A,” as permitting just “B,” or as permitting both “A” and “B”). Further, items represented in the accompanying figures and terms discussed herein may be indicative of one or more items or terms, and thus reference may be made interchangeably to single or plural forms of the items and terms in this written description. Finally, although subject matter has been described in language specific to structural features or methodological operations, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or operations described above, including not necessarily being limited to the organizations in which features are arranged or the orders in which operations are performed. | 44,307 |
11862862 | DESCRIPTION OF EXEMPLARY EMBODIMENTS The communication device of the present invention will be described in detail by way of examples with reference to the accompanying drawings. In the drawings, the same reference signs are applied to the same constituent elements, and therefore detailed descriptions thereof will be omitted here. First Exemplary Embodiment FIG.1shows a communication device1according to the first exemplary embodiment of the present invention, which provides a pathway switch device100to a first antenna element131and a second antenna element132. The pathway switch device100includes a first phase shifter121, a second phase shifter122, and a 180-degree hybrid circuit110. The 180-degree hybrid circuit110having a bandpass filtering function is connected to the first phase shifter121and the second phase shifter122. The first antenna element131is connected to a first terminal used to receive or transmit a sigma (Σ) signal serving as a sum signal from the 180-degree hybrid circuit110. When the first phase shifter121outputs a signal A while the second phase shifter122outputs a signal B, the 180-degree hybrid circuit110generates a sum signal, i.e. an in-phase composite signal (A+B), such that a phase difference between the signal A and the signal B becomes zero degrees. Upon expressing a phase of a signal X as ∠X, a phase difference of zero degrees with respect to phases ∠A, ∠B of the signals A, B means ∠A−∠B=0 degrees. The communication device1generates an in-phase composite signal (A+B) in a transmission mode. In a reception mode, the received signal is in-phase-equally delivered to the first phase shifter121and the second phase shifter122with a phase difference of zero degrees. The second antenna element132is connected to a second terminal used to transmit or receive a delta (Δ) signal serving as a difference signal from the 180-degree hybrid circuit100. When a phase difference between the output signal A of the first phase shifter121and the output signal B of the second phase shifter122is equal to 180 degrees (i.e. ∠A−∠B=180 degrees), an antiphase composite signal (A−B) is generated as the difference signal. Due to antiphase composition setting a phase difference between the signal A and the signal B at 180 degrees, a signal intensity equals |A−B|=√(A2+B2), i.e. substantially the same signal intensity as the sum signal. In a transmission mode, the communication device1generates an antiphase composite signal (A−B). In a reception mode, the received signal is differentially-equally delivered to the first phase shifter121and the second phase shifter122with a phase difference of 180 degrees. In this connection,FIG.1shows the pathway switch device100with its minimum configuration to be shared between the communication devices according to the other exemplary embodiments of the present invention. The 180-degree hybrid circuit110is configured to generate and output a Σ signal serving as a sum signal of two input signals and a Δ signal serving as a difference signal of two input signals. At this time, the 180-degree hybrid circuit110is configured to solely pass signals in a passable band therethrough due to the bandpass filtering function. The first phase shifter121and the second phase shifter122are each configured to adjust the phase of input signals thereof. Specifically, input signals are adjusted in phase such that a phase difference between the output signal of the first phase shifter121and the output signal of the second phase shifter122becomes equal to 0 degrees or 180 degrees. The received signal of the first antenna element131is sent to the first terminal used to receive or transmit a Σ signal (or a sum signal) received or transmitted with the 180-degree hybrid circuit110. In addition, the first antenna element131radiates into the air a transmission signal as a Σ signal output from the first terminal of the 180-degree hybrid circuit110. The second antenna element132has the same configuration and the same function as the first antenna element131. The received signal of the second antenna element132is sent to the second terminal used to receive or transmit a Δ signal (or a difference signal) with the 180-degree hybrid circuit110. In addition, the second antenna element132radiates into the air a transmission signal as a Δ signal output from the second terminal of the 180-degree hybrid circuit110. As described above, the communication device1according to the first exemplary embodiment of the present invention includes the pathway switch device100, and therefore it is possible to transmit signals having a frequency corresponding to at least one of a sum signal (or a Σ signal) and a difference signal (or a Δ signal) which are each generated from a signal passing through the first phase shifter121and a signal passing through the second phase shifter122due to the bandpass-filtering function of the 180-degree hybrid circuit110. For this reason, it is possible to selectively output a Σ signal or a Δ signal by means of the 180-degree hybrid circuit110configured to transmit signals having a frequency corresponding to at least one of the Σ signal and the Δ signal which are each generated from a signal passing through the first phase shifter121and a signal passing through the second phase shifter122. At this time, the bandpass-filtering function of the 180-degree hybrid circuit110can be achieved by a bandpass filter having a single configuration shared by the Σ signal and the Δ signal. Accordingly, it is unnecessary for the communication devices according to the exemplary embodiments of the present invention to prepare bandpass filters for the Σ signal and the Δ signal respectively (in other words, it is possible to reduce the number of filters installed in communication devices), and the therefore it is possible to reduce the size of communication devices. In addition, the communication device1equipped with the first antenna element131applicable to the Σ signal and the second antenna element132applicable to the Δ signal does not need any switches configured to switch over the Σ signal and the Δ signal, and therefore it is possible to reduce signal loss. Second Exemplary Embodiment Next, the second exemplary embodiment of the present invention will be described below. The second exemplary embodiment is similarly applied to the communication device1of the first exemplary embodiment, in which the 180-degree hybrid circuit110has a magic-T circuit having a bandpass-filtering function. As a magic-T circuit having a bandpass-filtering function, it is possible to employ a magic-T circuit disclosed in Non-Patent Document 1. As shown inFIG.2, this magic-T circuit includes an excitation opening110aof a first electromagnetic-field mode and an excitation opening110bof a second electromagnetic-field mode. As shown inFIG.2, the excitation opening110aand the excitation opening110bare aligned in a T-shape manner. Due to the T-shape alignment, it is possible for the excitation openings110a,110bto independently handle two frequency signals which may occur in two electromagnetic-field modes orthogonal to each other. Non-Patent Document 1 assumes TE201 mode and TE202 mode as two orthogonal electromagnetic-field modes. In this connection, the TE mode stands for “Transverse-Electric Mode”. For example, two orthogonal electromagnetic-field modes will be referred to as a first electromagnetic-field mode and a second electromagnetic-field mode. In this case, one excitation opening (e.g. the excitation opening110a) between two excitation openings is allocated to the first electromagnetic-field mode while the other excitation opening (e.g. the excitation opening110b) is allocated to the second electromagnetic-field mode. Accordingly, one excitation opening is able to solely handle signals occurring in the first electromagnetic-field mode while the other excitation opening is able to solely handle signals occurring in the second electromagnetic-field mode. In this connection, the frequency of signals occurring in the first electromagnetic-field mode may be identical to or different from the frequency of signals occurring in the second electromagnetic-field mode. According to the second exemplary embodiment described above, the 180-degree hybrid circuit110includes a magic-T circuit having a bandpass-filtering function, in which one excitation opening between two excitation openings110a,110bis allocated to the Σ signal while the other excitation opening is allocated to the Δ signal. This makes it possible for the magic-T circuit to independently handle the Σ signal and the Δ signal. That is, it is possible to handle polarization 1 and polarization 2 as two polarized waves. For this reason, it is possible to independently handle the frequency of the Σ signal and the frequency of the Δ signal. By changing the shape of the excitation opening110aand the shape of the excitation opening110b, it is possible to independently change the frequency of the Σ signal and the frequency of the Δ signal. Third Exemplary Embodiment Next, the communication device1according to the third exemplary embodiment will be described below.FIG.3is a circuit diagram of the communication device1according to the third exemplary embodiment of the present invention. The communication device1includes a first pathway switch device101, a second pathway switch device102, the first antenna element131, the second antenna element132, a third antenna element133, a fourth antenna element134, an attenuator141, a first directional coupler161, a second directional coupler162, a phase comparator171, a first switch181, a second switch182, and a signal processor190. In this connection, the first pathway switch device101and the second pathway switch device102may serve as an example of a “communicator” while the attenuator141may serve as an example of a “connector”. In addition, each of the first directional coupler161and the second directional coupler162has three terminals, which will be referred to as a first terminal through a third terminal. As shown inFIG.3, a first terminal of the first pathway switch device101is connected to the first antenna element131while a second terminal thereof is connected to the second antenna element132and one end of the attenuator141. A third terminal of the first pathway switch device101is connected to the first terminal of the first directional coupler161. A first terminal of the second pathway switch device102is connected to the third antenna element133while a second terminal thereof is connected to the fourth antenna element134and another end of the attenuator141. A third terminal of the second pathway switch device102is connected to a first terminal of the second directional coupler162. A second terminal of the first directional coupler161is connected to a first terminal of the phase comparator171while a third terminal of the first directional coupler161is connected to a first terminal of the first switch181. A second terminal of the second directional coupler162is connected to a second terminal of the phase comparator171while a third terminal of the second directional coupler162is connected to a first terminal of the second switch182. A second terminal of the first switch181is connected to a first terminal of the signal processor190while a second terminal of the second switch182is connected to a second terminal of the signal processor190. The first pathway switch device101includes the 180-degree hybrid circuit110, the first phase shifter121, the second phase shifter122, a first bidirectional amplifier151, and a second bidirectional amplifier152. The second pathway switch device102includes a 180-degree hybrid circuit111, a third phase shifter123, a fourth phase shifter124, a third bidirectional amplifier153, and a fourth bidirectional amplifier154. Each of the 180-degree hybrid circuits110and111has fourth terminals, which will be referred to as a first terminal through a fourth terminal. The first terminal of the first pathway switch device101is connected to a first terminal (or a Σ port) of the 180-degree hybrid circuit110while the second terminal of the first pathway switch device101is connected to a second terminal (or a Δ port) of the 180-degree hybrid circuit110. A third terminal of the 180-degree hybrid circuit110is connected to a first terminal of the first bidirectional amplifier151while a fourth terminal of the 180-degree hybrid circuit110is connected to a first terminal of the second bidirectional amplifier152. A second terminal of the first bidirectional amplifier151is connected to a first terminal of the first phase shifter121while a second terminal of the second bidirectional amplifier152is connected to a first terminal of the second phase shifter122. A third terminal of the first pathway switch device101is connected to a second terminal of the first phase shifter121and a second terminal of the second phase shifter122. The first terminal of the second pathway switch device102is connected to a first terminal (or a Σ port) of the 180-degree hybrid circuit111while the second terminal of the first pathway switch device102is connected to a second terminal (or a Δ port) of the 180-degree hybrid circuit111. A third terminal of the 180-degree hybrid circuit111is connected to a first terminal of the third bidirectional amplifier153while a fourth terminal of the 180-degree hybrid circuit111is connected to a first terminal of the fourth bidirectional amplifier154. A second terminal of the third bidirectional amplifier153is connected to a first terminal of the third phase shifter123while a second terminal of the fourth bidirectional amplifier154is connected to a first terminal of the fourth phase shifter124. A third terminal of the second pathway switch device102is connected to a second terminal of the third phase shifter123and a second terminal of the fourth phase shifter124. In the first pathway switch device101, the first bidirectional amplifier151amplifies a signal input from the first phase shifter121so as to output the amplified signal to the 180-degree hybrid circuit110. In addition, the first bidirectional amplifier151amplifies a signal input from the 180-degree hybrid circuit110so as to output the amplified signal to the first phase shifter121. The second bidirectional amplifier152operates similar to the first bidirectional amplifier151. That is, the second bidirectional amplifier152amplifies a signal input from the second phase shifter122so as to output the amplified signal to the 180-degree hybrid circuit110. In addition, the second bidirectional amplifier152amplifies a signal input from the 180-degree hybrid circuit110so as to output the amplified signal to the second phase shifter122. The first directional coupler161branches a signal transmitted over a line laid between the first pathway switch device101and the signal processor190, thus sending a branched signal to the phase comparator171. The switch181is laid between the first pathway switch device101and the signal processor190and configured to switch between a state capable of transmitting or receiving signals and another state incapable of transmitting or receiving signals. Closing the first switch181makes it possible to transmit or receive signals between the first pathway switch device101and the signal processor190. In contrast, opening the first switch181may block signals to be transmitted or received between the first pathway switch device101and the signal processor190. The second pathway switch device102operates similar to the first pathway switch device101. The 180-degree hybrid circuit111corresponds to the 180-degree hybrid circuit110. The third bidirectional amplifier153corresponds to the first bidirectional amplifier151while the fourth bidirectional amplifier154corresponds to the second bidirectional amplifier152. The third phase shifter123corresponds to the first phase shifter121while the fourth phase shifter124corresponds to the second phase shifter122. The third antenna element133operates similar to the first antenna element131. The third antenna element133sends its received signal to the first terminal (or the Σ port) of the 180-degree hybrid circuit111. In addition, the third antenna element133radiates into the air a transmission signal as the Σ signal output from the first terminal of the 180-degree hybrid circuit111. The fourth antenna element134operates similar to the second antenna element132. The fourth antenna element134sends its received signal to the second terminal (or the Δ port) of the 180-degree hybrid circuit111. In addition, the fourth antenna element134radiates into the air a transmission signal as the Δ signal output from the second terminal of the 180-degree hybrid circuit111. The third bidirectional amplifier153amplifies an input signal from the third phase shifter123so as to send the amplified signal to the third terminal of the 180-degree hybrid circuit111. In addition, the third bidirectional amplifier153amplifies an output signal from the third terminal of the 180-degree hybrid circuit111so as to send the amplified signal to the third phase shifter123. The fourth bidirectional amplifier154amplifies an input signal from the fourth phase shifter124so as to send the amplified signal to the fourth terminal of the 180-degree hybrid circuit111. In addition, the fourth bidirectional amplifier154amplifies an output signal from the fourth terminal of the 180-degree hybrid circuit111so as to send the amplified signal to the fourth phase shifter124. The second directional coupler162operates similar to the first directional coupler161. The second directional coupler162branches a signal transmitted over a line laid between the second pathway switch device102and the signal processor190, thus sending a branched signal to the phase comparator171. The second switch182operates similar to the first switch181. The second switch182switches between a state capable of transmitting or receiving signals between the second pathway switch device102and the signal processor190and another state incapable of transmitting or receiving signals therebetween. Closing the second switch182makes it possible to transmit or receive signals between the second pathway switch device102and the signal processor190. In contrast, opening the second switch182may block signals to be transmitted or received between the second pathway switch device102and the signal processor190. The signal processor190is configured to carry out signal processing necessary to communicate with an external device. For example, the signal processor is configured to generate a transmission signal via a modulation process in a transmission mode. In a reception mode, the signal processor190is configured to carry out a demodulation process of the received signal. In this connection, the signal processor190may generate a calibration signal used for calibration of the communication device1. The phase comparator171is configured to compare two input signals in phase. For example, the phase comparator171compares the phase of the branched signal from the first directional coupler161with the phase of the branched signal from the second directional coupler162. Next, the transmission/reception process of the communication device1will be described with reference toFIG.4. Herein, the transmission/reception process of the communication device1will be described with respect to the situation in which the phase of the output signal of the first phase shifter121is identical to the phase of the output signal of the second phase shifter122. In a transmission/reception mode of the communication device1, both the first switch181and the second switch182are closed. (Transmission Process of Communication Device1) First, the transmission process of the communication device1will be described below. In the transmission mode of the communication device1, the signal processor190generates a transmission signal. The signal processor190transmits the transmission signal to the first pathway switch device101through the first directional coupler161. In addition, the signal processor190transmits the transmission signal to the second pathway switch device102through the second directional coupler162. In the first pathway switch device101, the first phase shifter121and the second phase shifter122may receive the transmission signal from the signal processor190. The first phase shifter121and the second phase shifter122are configured to adjust the phase of the transmission signal respectively. For example, the first phase shifter121shifts the phase of the transmission signal by a predetermined phase value θ1(i.e. a phase value measured from a reference phase at zero). The second phase shifter122shifts the phase of the transmission signal by the predetermined phase value θ1to achieve the same phase as the first phase shifter121. The first phase shifter121sends its phase-shifted transmission signal to the first bidirectional amplifier151while the second phase shifter122sends its phase-shifted transmission signal to the second bidirectional amplifier152. Upon receiving the phase-shifted transmission signal from the first phase shifter121, the first bidirectional amplifier151amplifies its amplitude by a predetermined gain. Upon receiving the phase-shifted transmission signal from the second phase shifter122, the second bidirectional amplifier152amplifies its amplitude by a predetermined gain. The first bidirectional amplifier151sends its amplitude-amplified transmission signal to the third terminal of the 180-degree hybrid circuit110while the second bidirectional amplifier152sends its amplitude-amplified transmission signal to the fourth terminal of the 180-degree hybrid circuit110. The 180-degree hybrid circuit110receives the amplitude-amplified transmission signals from the first bidirectional amplifier151and the second bidirectional amplifier152. The 180-degree hybrid circuit110generates a sum signal (or a Σ signal) and a difference signal (or a Δ signal) using the transmission signals from the first bidirectional amplifier151and the second bidirectional amplifier152. Subsequently, the 180-degree hybrid circuit110radiates the Σ signal into the air by means of the first antenna131. The second pathway switch device102carries out a similar process as the first pathway switch device101. In the second pathway switch device102, the third phase shifter123and the fourth phase shifter124receive the transmission signals from the signal processor190. The third phase shifter123and the fourth phase shifter124adjust their transmission signals in phase. For example, the third phase shifter123shifts the phase of the transmission signal by a predetermined phase value θ2(i.e. a phase value measured from the reference phase at zero). The fourth phase shifter124shifts the phase of the transmission signal by the predetermined phase value θ2to achieve the same phase as the third phase shifter123. The third phase shifter123sends its phase-shifted transmission signal to the third bidirectional amplifier153while the fourth phase shifter124sends its phase-shifted transmission signal to the fourth bidirectional amplifier154. Upon receiving the phase-shifted transmission signal from the third phase shifter123, the third bidirectional amplifier153amplifies its amplitude by a predetermined gain. Upon receiving the phase-shifted transmission signal from the fourth phase shifter124, the fourth bidirectional amplifier154amplifies its amplitude by a predetermined gain. The third bidirectional amplifier153sends its amplitude-amplified transmission signal to the third terminal of the 180-degree hybrid circuit111while the fourth bidirectional amplifier154sends its amplitude-amplified transmission signal to the fourth terminal of the 180-degree hybrid circuit111. The 180-degree hybrid circuit111receives the amplitude-amplified transmission signals from the third bidirectional amplifier153and the fourth bidirectional amplifier154respectively. The 180-degree hybrid circuit111generates a sum signal (or a Σ signal) and a difference signal (or a Δ signal) using the transmission signals from the third bidirectional amplifier153and the fourth bidirectional amplifier154. Subsequently, the 180-degree hybrid circuit111radiates the Σ signal into the air by means of the third antenna element133. The first antenna element131and the third antenna element133may form an array antenna. A radiation signal of the first antenna element131and a radiation signal of the third antenna element133are synthesized in the air and transmitted through the air as radio waves having directivity. The directivity of radio waves is determined according to a difference between the phase of transmission signals depending on phase adjustment in the first phase shifter121and the second phase shifter122and the phase of transmission signals depending on phase adjustment in the third phase shifter123and the fourth phase shifter124. By adjusting the phase of transmission signals in the first phase shifter121and the second phase shifter122and the phase of transmission signals in the third phase shifter123and the fourth phase shifter124, it is possible to realize an arbitrary directivity of radio waves to be radiated into the air. Reception Process of Communication Device1 Next, the reception process of the communication device1will be described below. The reception process of the communication device1is inverse to the aforementioned transmission process. The first antenna element131and the third antenna element133are configured to receive radio waves propagating in the air. In the first pathway switch device101, the 180-degree hybrid circuit110receives the reception signal of the first antenna element131at the first terminal (or the Σ port). According to the reception process inverse to the transmission process, the 180-degree hybrid circuit110sends its reception signal to the first bidirectional amplifier151and the second bidirectional amplifier152. The first bidirectional amplifier151attenuates an amplitude of the reception signal from the 180-degree hybrid circuit110by a predetermined gain. The second bidirectional amplifier152attenuates the amplitude of the reception signal from the 180-degree hybrid circuit110by a predetermined gain. The first bidirectional amplifier151sends its amplitude-attenuated reception signal to the first phase shifter121while the second bidirectional amplifier152sends its amplitude-attenuated reception signal to the second phase shifter122. The first phase shifter121adjusts the phase of the amplitude-attenuated reception signal from the first bidirectional amplifier151while the second phase shifter122adjusts the phase of the amplitude-attenuated reception signal from the second bidirectional amplifier152. The first phase shifter121and the second phase shifter122carry out phase adjustment with the reception signal which is inverse to the foregoing phase adjustment of the transmission signal. The first phase shifter121sends its phase-adjusted reception signal to the signal processor190through the first directional coupler161while the second phase shifter122sends its phase-adjusted reception signal to the signal processor190through the first directional coupler161. The signal processor190receives a composite signal combining the phase-adjusted reception signal from the first phase shifter121and the phase-adjusted reception signal from the second phase shifter122through the first directional coupler16. The second pathway switch device102carries out a similar process as the first pathway switch device101. In the second pathway switch device102, the 180-degree hybrid circuit111receives the reception signal of the third antenna element133at the first terminal (or the Σ port). The 180-degree hybrid circuit111carries out a reception process inverse to the foregoing transmission process, thus sending the reception signal to the third bidirectional amplifier153and the fourth bidirectional amplifier154. The third bidirectional amplifier153attenuates the amplitude of the reception signal from the 180-degree hybrid circuit111by a predetermined gain. The fourth bidirectional amplifier154attenuates the amplitude of the reception signal from the 180-degree hybrid circuit111by a predetermined gain. The third bidirectional amplifier153sends the amplitude-attenuated reception signal to the third phase shifter123while the fourth bidirectional amplifier154sends the amplitude-attenuated reception signal to the fourth phase shifter124. The third phase shifter123carries out phase adjustment with the amplitude-attenuated reception signal from the third bidirectional amplifier153while the fourth phase shifter124carries out phase adjustment with the amplitude-attenuated reception signal from the fourth bidirectional amplifier154. The third phase shifter123and the fourth phase shifter124carry out phase adjustment with the reception signal which is inverse to the foregoing phase adjustment with the transmission signal. The third phase shifter123sends its phase-adjusted reception signal to the signal processor190through the second directional coupler162while the fourth phase shifter124sends its phase-adjusted reception signal to the signal processor190through the second directional coupler162. The signal processor190receives a composite signal combining the phase-adjusted reception signal from the third phase shifter123and the phase-adjusted reception signal from the fourth phase shifter124through the second directional coupler162. Subsequently, the signal processor190carries out a demodulation process with two composite signals received through the first directional coupler161and the second directional coupler162. Calibration Process of Communication Device1 Next, the calibration process of the communication device1will be described with reference toFIG.5. In a calibration mode of the communication device1, the first switch181is closed while the second switch182is opened. The signal processor190is configured to generate a calibration signal used for calibration. The signal processor190sends the calibration signal to the first pathway switch device101through the first directional coupler161. At this time, the first directional coupler161branches the calibration signal from the signal processor190to the phase comparator171. The first phase shifter121and the second phase shifter122may receive the calibration signal from the signal processor190so as to adjust its phase. For example, the first phase shifter121shifts the phase of the calibration signal by a predetermined phase value θ1(i.e. a phase value measured from a reference phase at zero). The second phase shifter122shifts the phase of the calibration signal by a predetermined phase value (θ1+180°) so as to achieve an inverse phase than the first phase shifter121. The first phase shifter121sends its phase-shifted calibration signal to the first bidirectional amplifier151while the second phase shifter122sends its phase-shifted calibration signal to the second bidirectional amplifier152. The first bidirectional amplifier151amplifies the amplitude of the phase-shifted calibration signal from the first phase shifter121by a predetermined gain. In addition, the second bidirectional amplifier152amplifies the amplitude of the phase-shifted calibration signal from the second phase shifter122by a predetermined gain. The first bidirectional amplifier151sends its amplitude-amplified calibration signal to the third terminal of the 180-degree hybrid circuit110while the second bidirectional amplifier152sends its amplitude-amplified calibration signal to the fourth terminal of the 180-degree hybrid circuit110. Upon receiving the amplitude-amplified calibration signal from the first bidirectional amplifier151and the amplitude-amplified calibration signal from the second bidirectional amplifier152, the 180-degree hybrid circuit110may generate a sum signal (or a Σ signal) and a difference signal (or a Δ signal). Subsequently, the 180-degree hybrid circuit110sends the Δ signal to the second pathway switch device102via the attenuator141. In the second pathway switch device102, the 180-degree hybrid circuit111receives the calibration signal (or the Δ signal) from the first pathway switch device101at the second terminal (or the Δ port) so as to carry out a similar process as the foregoing process in the reception mode, thus sending the calibration signal to the third bidirectional amplifier153and the fourth bidirectional amplifier154. The third bidirectional amplifier153attenuates the amplitude of the calibration signal from the 180-degree hybrid circuit111by a predetermined gain. The fourth bidirectional amplifier154attenuates the amplitude of the calibration signal from the 180-degree hybrid circuit111by a predetermined gain. The amplitude-amplified calibration signal from the third bidirectional amplifier153is sent to the third phase shifter123while the amplitude-amplified calibration signal from the fourth bidirectional amplifier154is send to the fourth phase shifter124. The third phase shifter123and the fourth phase shifter124carries out phase adjustment of the calibration signal, which is similar to the foregoing phase adjustment of the reception signal. The third phase shifter123and the fourth phase shifter124send their phase-adjusted calibration signals to the phase comparator171through the second directional coupler162. The phase comparator171receives the calibration signal from the first directional coupler161and the calibration signal from the second directional coupler162. The phase comparator171compares two calibration signals in phase so as to produce a comparison result. Even when the comparison result of the phase comparator171is not a desired result, the present embodiment may produce a desired result by changing a setting of pathways transmitting calibration signals. To obtain a desired comparison result, for example, the present embodiment is designed to change phase adjustments of the first phase shifter121, the second phase shifter122, the third phase shifter123, and the fourth phase shifter124. As described above, the communication device1according to the third exemplary embodiment of the present invention includes the first pathway switch device101, the second pathway switch device102, and the attenuator141provided therebetween. Due to the provision of the first pathway switch device101and the second pathway switch device102, it is possible to reduce the size of the communication device1to be smaller than the foregoing configuration requiring a bandpass filter for each polarization. In addition, it is possible to independently set the frequency of a sum signal (or a Σ signal) and the frequency of a difference signal (or a Δ signal), and therefore it is possible to receive or transmit signals according to a setting of frequencies. Moreover, due to the provision of the attenuator141connected between the first pathway switch device101and the second pathway switch device102, it is possible to grasp how a setting of signal propagation pathways will be changed in the communication device1, and therefore it is possible to obtain desired signals by changing a setting of signal propagation pathways. In a transmission/reception mode of the third exemplary embodiment of the present invention, phase adjustment is carried out such that the first phase shifter121and the second phase shifter122may produce their output signals having the same phase while phase adjustment is carried out such that the third phase shifter123and the fourth phase shifter124may produce their output signals having the same phase. In a calibration mode, phase adjustment is carried out such that the first phase shifter121and the second phase shifter122may produce their output signals having reverse phases while phase adjustment is carried out such that the third phase shifter123and the fourth phase shifter124may produce their output signals having reverse phases. It is possible to modify the communication device1of the third exemplary embodiment of the present invention with the configuration shown inFIG.6. The configuration ofFIG.6may seem to be identical to the configuration ofFIG.3, whereas the configuration ofFIG.6realizes different functions with the first and second terminals of the 180-degree hybrid circuits110,111. That is, inFIG.6, the first antenna element131is connected to the Δ port of the 180-degree hybrid circuit110while the third antenna element133is connected to the Δ port of the 180-degree hybrid circuit111. In addition, the second antenna element132is connected to the Σ port of the 180-degree hybrid circuit111while the fourth antenna element134is connected to the Σ port of the 180-degree hybrid circuit111. In addition, the attenuator141is provided between the Σ port of the 180-degree hybrid circuit110and the Σ port of the 180-degree hybrid circuit111. In a transmission/reception mode, phase adjustment is carried out such that the first phase shifter121and the second phase shifter122may produce their output signals having reverse phases while phase adjustment is carried out such that the third phase shifter123and the fourth phase shifter124may produce their output signals having reverse phases. In a calibration mode, phase adjustment is carried out such that the first phase shifter121and the second phase shifter122may produce their output signals having the same phase while phase adjustment is carried out such that the third phase shifter123and the fourth phase shifter124may produce their output signals having the same phase. As described above, according to a variation of the third exemplary embodiment shown inFIG.6similar to the third exemplary embodiment shown inFIG.3, it is possible to realize both the transmission/reception process and the calibration process. Fourth Exemplary Embodiment Next, the communication device1according to the fourth exemplary embodiment of the present invention will be described below.FIG.7is a circuit diagram of the communication device1according to the fourth exemplary embodiment of the present invention. As shown inFIG.7, the communication device1includes the first pathway switch device101, the second pathway switch device102, the first antenna element131, the second antenna element132, the third antenna element133, the fourth antenna element134, the attenuator141, the first directional coupler161, the second directional coupler162, the phase comparator171, the first switch181, the second switch182, and the signal processor190. In addition, the communication device1further includes a third pathway switch device103, a fifth antenna element135, a sixth antenna element136, an attenuator142, a third directional coupler163, a phase comparator172, a third switch183, and a switch191. The third pathway switch device103operates similar to the first pathway switch device101. The fifth antenna element135is similar to the first antenna element131while the sixth antenna element136is similar to the second antenna element132. The attenuator142operates similar to the attenuator141. The third directional coupler163operates similar to the first directional coupler161. The phase comparator172operates similar to the phase comparator171. The third switch183operates similar to the first switch181. The third pathway switch device103includes a 180-degree hybrid circuit11, a fifth phase shifter125, a sixth phase shifter126, a fifth bidirectional amplifier155, and a sixth bidirectional amplifier156. The first terminal of the third pathway switch device103is connected to the first terminal (or the Σ port) of the 180-degree hybrid circuit112while the second terminal of the third pathway switch device103is connected to the third terminal (or the Δ port) of the 180-degree hybrid circuit112. The third terminal of the 180-degree hybrid circuit112is connected to the first terminal of the fifth bidirectional amplifier155while the fourth terminal of the 180-degree hybrid circuit112is connected to the first terminal of the sixth bidirectional amplifier156. The second terminal of the fifth bidirectional amplifier155is connected to the first terminal of the fifth phase shifter125while the second terminal of the sixth bidirectional amplifier156is connected to the first terminal of the sixth phase shifter126. The second terminal of the fifth phase shifter125and the second terminal of the sixth phase shifter126are connected to the third terminal of the third pathway switch device103. The communication device1of the fourth exemplary embodiment shown inFIG.7includes the configuration of the communication device1of the third exemplary embodiment shown inFIG.3, whereas the switch191is provided between the attenuator141and the 180-degree hybrid circuit111. In addition, the communication device1of the fourth exemplary embodiment differs from the communication device1of the third exemplary embodiment such that the second directional coupler162branches a signal transmitted over a line laid between the second pathway switch device102and the signal processor190towards the phase comparator171and the phase comparator172. That is, the second directional coupler162further includes a fourth terminal connected to the first terminal of the phase comparator172in addition to the third terminal connected to the phase comparator171. The switch191is interposed between the attenuator141, the attenuator142, and the 180-degree hybrid circuit111. Specifically, the first terminal of the switch191is connected to the second terminal (or the Δ port) of the 180-degree hybrid circuit111; the second terminal of the switch191is connected to the attenuator141; the third terminal of the switch191is connected to the attenuator142. The first terminal of the third pathway switch device103is connected to the fifth antenna element135while the second terminal of the third pathway switch device103is connected to the sixth antenna element136and the attenuator142. The third terminal of the third pathway switch device103is connected to the first terminal of the third directional coupler163. The second terminal of the third directional coupler163is connected to the third switch183. The third terminal of the third directional coupler163is connected to the second terminal of the phase comparator172. The second terminal of the third switch183is connected to the signal processor190. The communication device1of the third exemplary embodiment of the present invention is equipped with the first pathway switch device101and the second pathway switch device102each serving as a signal transmission device, while the communication device1of the fourth exemplary embodiment of the present invention further includes the third pathway switch device103, and therefore the signal processor190is configured to carry out signal processing with respect to three signals transmitted through the first pathway switch device101, the second pathway switch device102, and the third pathway switch device103. The operation of the communication device1of the fourth exemplary embodiment is similar to the operation of the communication device1of the third exemplary embodiment, wherein the third exemplary embodiment is designed to carry out the transmission/reception process with two signals transmitted through two pathway switch devices101,102while the fourth exemplary embodiment is designed to carry out the transmission/reception process with three signals transmitted through three pathway switch devices101,102, and103. When the first terminal is connected to the second terminal in the switch191, the calibration process of the communication device1of the fourth exemplary embodiment is similar to the calibration process of the communication device1of the third exemplary embodiment. When the first terminal is connected to the third terminal in the switch191, the second terminal (or the Δ port) of the third pathway switch device101is connected to the second terminal (or the Δ port) of the third pathway switch device103through the attenuators141,142, in other words, the first pathway switch device101should be connected to the third pathway switch device103instead of the second pathway switch device102. That is, the function of the second pathway switch device102is replaced with the third pathway switch device103, wherein a calibration signal (or a Δ signal) from the first pathway switch device101is sent to the third pathway switch device103through the attenuators141,142, and then the calibration signal is sent to the phase comparator172through the third directional coupler163, thus implementing a phase comparison process. As described above, the communication device1of the fourth exemplary embodiment of the present invention includes the first pathway switch device101, the second pathway switch device102, and the third pathway switch device103, and therefore it is possible to reduce the size of the communication device compared to the foregoing configuration including a bandpass filter for each polarization. In addition, it is possible for the communication device1to carry out the transmission/reception process by independently setting the frequency of a sum signal (or a Σ signal) and the frequency of a difference signal (or a Δ signal). Providing the switch191in the communication device1, it is possible to connect the first pathway switch device101to either the second pathway switch device102or the third pathway switch device103. Accordingly, it is possible to grasp how to change a setting of signal transmission pathways in the communication device1, and therefore it is possible to obtain a desired signal by changing a setting of signal transmission pathways. In a transmission/reception mode, the fourth exemplary embodiment of the present invention is designed to carry out phase adjustment such that the first phase shifter121and the second phase shifter122may produce their output signals having the same phase, phase adjustment such that the third phase shifter123and the fourth phase shifter124may produce their output signals having the same phase, and phase adjustment such that the fifth phase shifter125and the sixth phase shifter126may produce their output signals having the same phase. In a calibration mode, the fourth exemplary embodiment of the present invention is designed to carry out phase adjustment such that the first phase shifter121and the second phase shifter122may produce their output signals having reverse phases, phase adjustment such that the third phase shifter123and the fourth phase shifter124may produce their output signals having reverse phases, and phase adjustment such that the fifth phase shifter125and the sixth phase shifter126may produce their output signals having reverse phases. It is possible to modify the communication device1of the fourth exemplary embodiment of the present invention with the configuration shown inFIG.8. The configuration ofFIG.8seems to be identical to the configuration ofFIG.7, whereas the first and second terminals of the 180-degree hybrid circuits110,111have different functions. InFIG.8, the first antenna element131is connected to the Δ port of the 180-degree hybrid circuit110; the third antenna element133is connected to the Δ port of the 180-degree hybrid circuit111; the fifth antenna element135is connected to the Δ port of the 180-degree hybrid circuit112. In addition, the second antenna element132is connected to the Σ port of the 180-degree hybrid circuit110; the fourth antenna element134is connected to the Σ port of the 180-degree hybrid circuit111; the sixth antenna element136is connected to the Σ port of the 180-degree hybrid circuit112. Moreover, the attenuator141is provided between the Σ port of the 180-degree hybrid circuit110and the Σ port of the 180-degree hybrid circuit111while the attenuator142is provided between the Σ port of the 180-degree hybrid circuit111and the Σ port of the 180-degree hybrid circuit112. That is, the switch191changes the connection destination of the attenuators141,142from the Δ port to the Σ port. In a transmission/reception mode, phase adjustment is carried out such that the first phase shifter121and the second phase shifter122may produce their output signals having reverse phases; phase adjustment is carried out such that the third phase shifter123and the fourth phase shifter124may produce their output signals having reverse phases; phase adjustment is carried out such that the fifth phase shifter125and the sixth phase shifter126may produce their output signals having reverse phases. In a calibration mode, phase adjustment is carried out such that the first phase shifter121and the second phase shifter122may produce their output signals having the same phase; phase adjustment is carried out such that the third phase shifter123and the fourth phase shifter124may produce their output signals having the same phase; phase adjustment is carried out such that the fifth phase shifter125and the sixth phase shifter126may produce their output signals having the same phase. Similar to the fourth exemplary embodiment shown inFIG.7, a variation of the fourth exemplary embodiment shown inFIG.8is able to achieve both the transmission/reception process and the calibration process. As described heretofore, the communication device of the present invention has been described by way of the first exemplary embodiment to the fourth exemplary embodiment, whereas it is possible to appropriately change constituent elements, functional parts as well as connection orders and processing procedures. For example, the signal processor190is configured to store signal processing and data in advance, but a storage unit (or a storage device) configured to store information and data may not be necessarily arranged inside the communication device and can be arranged outside the communication device. In addition, it is possible to disperse information and data and to store multiple pieces of information and data on multiple storage devices. In the foregoing embodiments, the signal processor190and the other controller (not shown) may include a computer system therein, and therefore programs demonstrating the foregoing processes can be stored on computer-readable storage media. In this case, the computer system may read and execute programs from storage media, thus achieving the foregoing functions. FIG.9is a block diagram showing the diagrammatical configuration of a computer5realizing the functions of the communication device1according to the foregoing exemplary embodiments. The computer5includes a CPU6, a main memory7, a storage8, and an interface9. The foregoing functions of the signal processor190and the foregoing functions of other control devices are implemented by the computer5. The foregoing steps of processes are stored on the storage8in the form of programs. The CPU6reads programs from the storage8to expand and execute programs on the main memory7. The CPU6may secure a plurality of storage areas on the main memory7according to programs. As the storage8, for example, it is possible to mention HDD (Hard Disk Drive), SSD (Solid State Drive), magnetic disks, magneto-optical disks, CD-ROM, DVD-ROM, and semiconductor memory. The storage8may be internal storage media directly connected to buses of the computer5or external storage media connected to the computer5through communication lines or the interface9. When the foregoing programs are delivered to the computer5through communication lines, the computer5may expand programs on the main memory7to achieve the foregoing steps of processes. When the foregoing embodiments are applied to the computer5, the storage8may be a non-transitory tangible storage medium. The foregoing programs may achieve part of the foregoing functions of a communication device. Alternatively, the foregoing programs may be differential programs (or differential files) to achieve the foregoing functions when combined with pre-installed programs already stored in a computer system. Lastly, the function and the configuration of a communication device according to the present invention is not necessarily limited to the foregoing embodiments, which may not necessarily limit the scope of the invention. The foregoing embodiments may embrace various additions, omissions, replacements, and modifications without departing from the essence of the invention. The present application claims the benefit of priority on Japanese Patent Application No. 2018-168805 filed on Sep. 10, 2018, the subject matter of which is hereby incorporated herein by reference. INDUSTRIAL APPLICABILITY The present invention is applied to a communication device holding radio communication using different polarizations, wherein the communication device can be embedded in various types of electronic devices such as portable terminal devices, mobile phones, and in-vehicle devices other than radio communication devices. REFERENCE SIGNS LIST 1communication device100pathway switch device101first pathway switch device102second pathway switch device110,111,112180-degree hybrid circuit121first phase shifter122second phase shifter123third phase shifter124fourth phase shifter125fifth phase shifter126sixth phase shifter131first antenna element132second antenna element133third antenna element134fourth antenna element135fifth antenna element136sixth antenna element141,142attenuator151first bidirectional amplifier152second bidirectional amplifier153third bidirectional amplifier154fourth bidirectional amplifier155fifth bidirectional amplifier156sixth bidirectional amplifier161first directional coupler162second directional coupler163third directional coupler171,172phase comparator181first switch182second switch183third switch190signal processor191switch | 53,897 |
11862863 | DETAILED DESCRIPTION A calibration method and apparatus for an antenna array is disclosed herein. Antenna calibration, as generally described, refers to the process of ensuring an antenna will produce accurate measurements and results. Calibration is used for antennas in a variety of applications, wherein calibration is used to ensure proper operation of an antenna system, such as in a system having a feed network that supplies an antenna array. The feed network provides different length paths to the different array portions, thereby introducing differences that may result in operational performance variances throughout the array. As the array, or subarrays, combine to form a radiation beam, these performance variances may impact the gain, angle with respect to boresight, side lobes and so forth. Calibration systems are designed for the application, antenna construction and array specifics. In various implementations, antenna calibration is a process of supplying a series of transmission signals to an antenna array where each element of the array or portion of the array is tested for a range of operation. The voltage and phase of the transmission signals are varied and the resultant radiation signals are measured in the far-field. This may be performed in a closed system or in-situ type test setting. In one example implementation, antenna calibration performed to determine a series of voltages to apply phase shifters in a beam steering radar for autonomous driving applications. The beam steering radar is capable of generating narrow, directed beams that can be steered to any angle (i.e., from 0° to 360°) across a Field of View (“FoV”) to detect objects. The beams are generated and steered in the analog domain, while processing of received radar signals for object identification is performed with advanced signal processing and machine learning techniques. It is appreciated that the detailed description set forth below is intended as a description of various configurations of the subject technology and is not intended to represent the only configurations in which the subject technology may be practiced. The appended drawings are incorporated herein and constitute a part of the detailed description. The detailed description includes specific details for the purpose of providing a thorough understanding of the subject technology. However, the subject technology is not limited to the specific details set forth herein and may be practiced using one or more implementations. In one or more instances, structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject technology. In other instances, well-known methods and structures may not be described in detail to avoid unnecessarily obscuring the description of the examples. Also, the examples may be used in combination with each other. Referring now toFIG.1A, a calibration configuration for an antenna system is described. Test system100is an anechoic chamber that absorbs reflections of electromagnetic waves and isolates signals from the surrounding environment. For an antenna calibration process, a transmitting antenna102is positioned at a distance from a receive antenna. Signals are radiated from the transmitting antenna102and the received signals are measured. In an antenna array implementation illustrated inFIG.1B, an array104includes multiple layers, where radiating elements are configured in an array on layer106and positioned over a slotted waveguide layer108. The array104is adapted to generate signals for an electromagnetic system, such as a radar system for a vehicle. Radar signals are used to detect and identify objects in the path and environment of a vehicle. In some implementations, the antenna systems, radar systems and detection and identification methods are used to provide driver assist signals and information, such as in an Automated Driver Assist System (“ADAS”). Alternate applications include machinery, avionics and so forth, where the ability to detect objects in the path of the machine is needed. The applications incorporate transceiver functionality and antennas, with typically one or more antenna arrays used for transmissions while another one or more antenna arrays used for receipt of signals, such as echoes from the radar signals. The use of an antenna array involves power divider circuitry to provide one or more signals to the antenna unit for transmission over-the-air. In automotive radar applications, the purpose is to transmit a signal of known parameters and determine a range, or distance, to an object, or target, as well as movement information, such as displacement from a position at a given time along with a trajectory over time. In some implementations, a radar unit can also provide acceleration information, with a radar cross-sectional area indicating a size of the object, a reflectivity of the object and so forth. From this information a classification engine is used to identify the target as a person, car, bicycle and so forth. FIG.2is an antenna system200having a power distribution network204which receives a transmission signal and feeds the signal through multiple paths to the antenna array202. The antenna array202includes multiple antenna or radiating elements210. The array202is configured with transmission lines208coupling multiple antenna elements210. Each of the transmission lines208is coupled to one of the transmission paths of the power distribution network204. There are multiple vias206positioned proximate one or more of the transmission lines208to couple to a slotted waveguide layer proximate (not shown). This example is not meant to be limiting, but rather to provide a full example of the application of the disclosed implementations. In the present example, the antenna system200may be positioned within a vehicle to comprehend the environment in which the vehicle is operating. In this way, the size, cost, power consumption, latency, footprint and so forth of the antenna system200determine application for use in a particular vehicle. These and other dimensions and parameters may be customized according to the use case. A method300for calibration of an antenna array is illustrated inFIG.3starting by determining an application for the antenna (302). The process then selects an appropriate optimization algorithm based on the antenna array, the antenna system and the application (304). The optimization algorithm may be a known optimization algorithm, modification thereof, or a custom designed algorithm, including, without limitation, a gradient descent algorithm, a genetic algorithm, a particle swarm method, and so forth. In one example implementation, the gradient descent algorithm can be used to calibrate an antenna array for a beam steering radar, as described in more detail herein below. This enables the method300to identify an insertion loss and accommodate voltage and phase values for phase shifters in the beam steering radar accordingly. There is a relationship between insertion loss and voltage offset for a given phase shift. In a noisy environment, convergence may be difficult to achieve, but by adjusting the initial conditions, and applying the proper parameters of the algorithm, the chances of convergence can be improved. Calibration generally includes a linear array of N antenna elements. In the present implementations, the antenna is an antenna array of M sets of N connected antenna elements, wherein the antenna array may be linear, structured, or other design, and wherein the N antenna elements of each of the M sets are electrically connected. The model for calibration determines a theoretical pattern for each element or each array set, and also an ideal pattern for beams formed therefrom. The model and optimization algorithms are selected and designed from these patterns. The antenna must operate as specified over a range of transmission angles. There is also an array of angles to be transmitted from the antenna, as each of these must conform to the antenna specifications. For example, there may be a good match between measured and ideal patterns at a first angle but a poor match at a second angle. The antenna must perform within specification across all angles in the specified range. The calibration is intended to determine settings that compensate for noise, uneven distance paths, and coupling between elements. In some implementations, voltage control and input, as well as non-idealities of the phase shift method, such as active components, affect the complex amplitudes of processed signals. There are many other conditions and parameters of a manufactured antenna system that may cause operation to deviate from the ideal operation. Some calibration measurements consider a correlation function to determine antenna transmission properties, such as side lobe measures. As there are a variety of antenna structures and applications, these may each have their own specific or desired optimization algorithm that works well for each situation and use case. In the example implementation where a gradient descent optimization algorithm is used, the change in results of the measured radiation iteratively moves in the direction of steepest descent, along a negative gradient. Gradient-descent is thus one example method to determine a set of input voltages and phases that result in the signal meeting the desired criteria for a beam steering radar. Typically, such criteria include gain, S21, side lobe level, transmit/receive angles and so forth, such as to find the set of values that results in a low input impedance between the power division portion and antenna elements. The learning rate of such an optimization algorithm is determined by the input set of values, the antenna system configuration, application, convergence threshold and so forth. An optimization algorithm model uses various parameters to make decisions and the success of a given model is measured by its cost function, which indicates how the model performs in predicting a given set of parameters. Calibration testing starts with the selection of a first transmit beam angle (306). The process determines a set of input voltages (308) for controlling phase shifters to each antenna element, such as phase shifters in a beam steering radar as described in more detail below. In this example, each input voltage produces a given phase shift angle. This initiates the testing and the algorithm optimizes the voltage and phase shift for each antenna element (310), wherein the signal is received at a measurement unit, e.g., a receive antenna (312). This is implemented by first testing an initial pool of voltages and calculating an error measure. The next pool of voltages is selected based on the combination that gives the least error. The measurement calculation is for power output-to-power input, S21, of the resultant radiation beam measured at the receive antenna. The process applies the set of input voltages iteratively to converge on a maximum gain solution for each power distribution path. When a set of input voltages converges (314), the voltage values and corresponding transmit beam angles are stored (316), such as, for example, at a Look-Up Table (“LUT”). The process then continues to increment the transmit beam angle (318), through all of the desired transmit beam angles, where angles are measured in steps. In some implementations, the transmit beam angle has a 360° range and the measurements take 2° steps. If the measured S21, does not converge (314), processing continues to update the set of input voltages (320), returning to step312. A convergence criteria or threshold may be predetermined according to application, use, parameters of operation and so forth. The convergence criteria for each angle determines when the set of input voltage values is at an optimum point sufficient for operation. FIG.4is an antenna system400having calibration capabilities with variable modules communicating through bus418. The calibration process employs an optimization module402operational to determine input voltages and phase value sets. The testing control module408determines the test voltages, sets up the testing and communicates with other modules in the system400. The measurement unit406measures received signals and provides data to evaluation unit416. The voltage control unit404is responsible for implementing the voltage set and the transmit beam angle control412controls the angle under test, both of these operating under direction of the testing control module408. The data of input voltages set for transmission and the measured received values of the measurement unit406are stored in LUT410on convergence of the optimization algorithm and are stored for later retrieval in actual operation. In this way, when the antenna system is in operation, a desired transmission angle is mapped to a set of input voltages. The system400also includes convergence threshold values414storing values used in optimization processing. FIG.5illustrates a calibration system500or testing an antenna array512. A test generator504controls the set of voltages to input to the antenna array512. A calibration probe510is configured to provide input to the antenna array512, which may also include a feed network or power division circuit as inFIG.2. The probe510is coupled to a switch506that determines which portions of the antenna array512are under test. In some implementations, the calibration probe510is coupled to each of the antenna elements in the antenna array512and therefore a switch is not used. In other examples, the switch506enables probes to couple to one or more antenna elements. The optimization algorithm is stored and controlled by optimization module502. Controller508controls operation of the calibration system500, including evaluation unit514and test generator504, which implements algorithms from optimization module502. The measurement unit516measures the transmit signal from antenna array512, and is controlled by an internal control unit518. The results of measurement are provided to evaluation unit514and used to determine convergence of the algorithm. System500may employ any of a variety of optimization algorithms, including some of those described herein. The optimization module502selects the algorithm, then instructs the test generator504as to input voltage sets and convergence criteria. In some implementations, the antenna array512includes a power division circuit, also referred to as a feed structure, and may include impedance matching elements coupled to the transmission array elements, such as transmission lines or other structures incorporating radiating elements. The impedance matching element may be configured to match the input signal parameters with radiating elements, and therefore, there are a variety of configurations and locations for this element, which may include a plurality of components. Attention is now directed toFIG.6, which illustrates a schematic diagram of a beam steering radar system in accordance with various examples. Beam steering radar600is a “digital eye” with true 3D vision and capable of a human-like interpretation of the world. The “digital eye” and human-like interpretation capabilities are provided by two main modules: radar module602and a perception engine604. Radar module602is capable of both transmitting RF signals within a FoV and receiving the reflections of the transmitted signals as they reflect off of objects in the FoV. With the use of analog beamforming in radar module602, a single transmit and receive chain can be used effectively to form a directional, as well as a steerable, beam. A transceiver606in radar module602is adapted to generate signals for transmission through a series of transmit antennas608as well as manage signals received through a series of receive antennas610-614. Beam steering within the FoV is implemented with phase shifter (“PS”) circuits616-618coupled to the transmit antennas608on the transmit chain and PS circuits620-624coupled to the receive antennas610-614on the receive chain, respectively. Careful phase and amplitude calibration of transmit antennas608and receive antennas610-614can be performed as described above with reference toFIGS.3-5. The goal of calibration is to match voltages input into PS circuits616-618and620-624to corresponding phase shift angles. The use of PS circuits616-618and620-624enables separate control of the phase of each element in the transmit and receive antennas. Unlike early passive architectures, the beam is steerable not only to discrete angles but to any angle (i.e., from 0° to 360°) within the FoV using active beamforming antennas. A multiple element antenna can be used with an analog beamforming architecture where the individual antenna elements may be combined or divided at the port of the single transmit or receive chain without additional hardware components or individual digital processing for each antenna element. Further, the flexibility of multiple element antennas allows narrow beam width for transmit and receive. The antenna beam width decreases with an increase in the number of antenna elements. A narrow beam improves the directivity of the antenna and provides the radar600with a significantly longer detection range. The major challenge with implementing analog beam steering is to design PSs to operate at 77 GHz. PS circuits616-618and620-624solve this problem with a reflective PS design implemented with a distributed varactor network currently built using GaAs materials. Each PS circuit616-618and620-624has a series of PSs, with each PS coupled to an antenna element to generate a phase shift value of anywhere from 0° to 360° for signals transmitted or received by the antenna element. The PS design is scalable in future implementations to SiGe and CMOS, bringing down the PS cost to meet specific demands of customer applications. Each PS circuit616-618and620-624is controlled by a Field Programmable Gate Array (“FPGA”)626, which provides a series of voltages to the PSs in each PS circuit that results in a series of phase shifts. In various examples, a voltage value is applied to each PS in the PS circuits616-618and620-624to generate a given phase shift and provide beam steering. The voltages applied to the PSs in PS circuits616-618and620-624are stored in LUTs in the FPGA606. These LUTs are generated by an antenna calibration process as described above with reference toFIGS.3-5that determines which voltages to apply to each PS to generate a given phase shift under each operating condition. Note that the PSs in PS circuits616-618and620-624are capable of generating phase shifts at a very high resolution of less than one degree. This enhanced control over the phase allows the transmit and receive antennas in radar module602to steer beams with a very small step size, improving the capability of the radar600to resolve closely located targets at small angular resolution. In various examples, the transmit antennas608and the receive antennas610-614may be a meta-structure antenna, a phase array antenna, or any other antenna capable of radiating RF signals in millimeter wave frequencies. A meta-structure, as generally defined herein, is an engineered structure capable of controlling and manipulating incident radiation at a desired direction based on its geometry. Various configurations, shapes, designs and dimensions of the antennas608-614may be used to implement specific designs and meet specific constraints, such as, for example, antenna104ofFIG.1and antenna202ofFIG.2. The transmit chain in radar600starts with the transceiver606generating RF signals to prepare for transmission over-the-air by the transmit antennas608. The RF signals may be, for example, Frequency-Modulated Continuous Wave (“FMCW”) signals. An FMCW signal enables the radar600to determine both the range to an object and the object's velocity by measuring the differences in phase or frequency between the transmitted signals and the received/reflected signals or echoes. Within FMCW formats, there are a variety of waveform patterns that may be used, including sinusoidal, triangular, sawtooth, rectangular and so forth, each having advantages and purposes. Once the FMCW signals are generated by the transceiver606, they are provided to power amplifiers (“PAs”)628-632. Signal amplification is needed for the FMCW signals to reach the long ranges desired for object detection, as the signals attenuate as they radiate by the transmit antennas608. From the PAs628-632, the signals are divided and distributed through feed networks634-636, which form a power divider system to divide an input signal into multiple signals, one for each element of the transmit antennas608. The feed networks634-636may divide the signals so power is equally distributed among them or alternatively, so power is distributed according to another scheme, in which the divided signals do not all receive the same power. Each signal from the feed networks634-636is then input into a PS in PS circuits616-618, where they are phase shifted based on voltages generated by the FPGA626under the direction of microcontroller638and then transmitted through transmit antennas608. Microcontroller638determines which phase shifts to apply to the PSs in PS circuits616-618according to a desired scanning mode based on road and environmental scenarios. Microcontroller638also determines the scan parameters for the transceiver to apply at its next scan. The scan parameters may be determined at the direction of one of the processing engines650, such as at the direction of perception engine604. Depending on the objects detected, the perception engine604may instruct the microcontroller638to adjust the scan parameters at a next scan to focus on a given area of the FoV or to steer the beams to a different direction. In various examples and as described in more detail below, radar600operates in one of various modes, including a full scanning mode and a selective scanning mode, among others. In a full scanning mode, both transmit antennas608and receive antennas610-614scan a complete FoV with small incremental steps. Even though the FoV may be limited by system parameters due to increased side lobes as a function of the steering angle, radar600is able to detect objects over a significant area for a long range radar. The range of angles to be scanned on either side of boresight as well as the step size between steering angles/phase shifts can be dynamically varied based on the driving environment. To improve performance of an autonomous vehicle (e.g., an ego vehicle) driving through an urban environment, the scan range can be increased to keep monitoring the intersections and curbs to detect vehicles, pedestrians or bicyclists. This wide scan range may deteriorate the frame rate (revisit rate), but is considered acceptable as the urban environment generally involves low velocity driving scenarios. For a high-speed freeway scenario, where the frame rate is critical, a higher frame rate can be maintained by reducing the scan range. In this case, a few degrees of beam scanning on either side of the boresight would suffice for long-range target detection and tracking. In a selective scanning mode, radar600scans around an area of interest by steering to a desired angle and then scanning around that angle. This ensures the radar600is to detect objects in the area of interest without wasting any processing or scanning cycles illuminating areas with no valid objects. Since the radar600is capable of detecting objects at a long distance, e.g., 300 m or more at boresight, if there is a curve in a road, direct measures do not provide helpful information. Rather, the radar600steers along the curvature of the road and aligns its beams towards the area of interest. In various examples, the selective scanning mode may be implemented by changing the chirp slope of the FMCW signals generated by the transceiver306and by shifting the phase of the transmitted signals to the steering angles needed to cover the curvature of the road. Objects are detected with radar600by reflections or echoes that are received at the series of receive antennas610-614, which are directed by PS circuits620-624. Low Noise Amplifiers (“LNAs) are positioned between receive antennas610-614and PS circuits620-624, which include PSs similar to the PSs in PS circuits616-618. For receive operation, PS circuits610-624create phase differentials between radiating elements in the receive antennas610-614to compensate for the time delay of received signals between radiating elements due to spatial configurations. Receive phase-shifting, also referred to as analog beamforming, combines the received signals for aligning echoes to identify the location, or position of a detected object. That is, phase shifting aligns the received signals that arrive at different times at each of the radiating elements in receive antennas610-614. Similar to PS circuits616-618on the transmit chain, PS circuits620-624are controlled by FPGA626, which provides the voltages to each PS to generate the desired phase shift. FPGA626also provides bias voltages to the LNAs638-642. The receive chain then combines the signals received at receive antennas612at combination network644, from which the combined signals propagate to the transceiver606. Note that as illustrated, combination network644generates two combined signals646-648, with each signal combining signals from a number of elements in the receive antennas612. In one example, receive antennas612include 48 radiating elements and each combined signal646-648combines signals received by 24 of the 48 elements. Other examples may include 8, 16, 24, 32, and soon, depending on the desired configuration. The higher the number of antenna elements, the narrower the beam width. Note also that the signals received at receive antennas610and614go directly from PS circuits620and624to the transceiver606. Receive antennas610and614are guard antennas that generate a radiation pattern separate from the main beams received by the 48 element receive antenna612. Guard antennas610and614are implemented to effectively eliminate side-lobe returns from objects. The goal is for the guard antennas610and614to provide a gain that is higher than the side lobes and therefore enable their elimination or reduce their presence significantly. Guard antennas610and614effectively act as a side lobe filter. Once the received signals are received by transceiver606, they are processed by processing engines650. Processing engines650include perception engine604which detects and identifies objects in the received signal with neural network and artificial intelligence techniques, database652to store historical and other information for radar600, and a Digital Signal Processing (“DSP”) engine654with an Analog-to-Digital Converter (“ADC”) module to convert the analog signals from transceiver606into digital signals that can be processed to determine angles of arrival and other valuable information for the detection and identification of objects by perception engine604. In one or more implementations, DSP engine654may be integrated with the microcontroller638or the transceiver606. Radar600also includes a Graphical User Interface (“GUI”)658to enable configuration of scan parameters such as the total angle of the scanned area defining the FoV, the beam width or the scan angle of each incremental transmission beam, the number of chirps in the radar signal, the chirp time, the chirp slope, the chirp segment time, and so on as desired. In addition, radar600has a temperature sensor660for sensing the temperature around the vehicle so that the proper voltages from FPGA626may be used to generate the desired phase shifts. The voltages stored in FPGA626are determined during calibration of the antennas under different operating conditions, including temperature conditions. A database662may also be used in radar600to store radar and other useful data. The present disclosure provides methods and apparatuses for calibration of an antenna array, such as in a beam steering radar in automotive applications or in wireless communications, having an array of radiating elements and a feed structure. The feed structure distributes the transmission signal throughout the transmission array, wherein the transmission signal propagates along the rows of the transmission array and discontinuities are positioned along each row. The calibration applies an optimization algorithm to prepare a set of input voltages for a variety of transmission angles. The algorithm avoids the prior calibration methods that tested a large number of combinations to determine operation of an antenna. It is appreciated that the beam steering radar system described herein above supports autonomous driving with improved sensor performance, all-weather/all-condition detection, advanced decision-making algorithms and interaction with other sensors through sensor fusion. These configurations optimize the use of radar sensors, as radar is not inhibited by weather conditions in many applications, such as for self-driving cars. The radar described here is effectively a “digital eye,” having true 3D vision and capable of human-like interpretation of the world. The previous description of the disclosed examples is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these examples will be readily apparent to those skilled in the art, and the m spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the examples shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. As used herein, the phrase “at least one of” preceding a series of items, with the terms “and” or “or” to separate any of the items, modifies the list as a whole, rather than each member of the list (i.e., each item). The phrase “at least one of” does not require selection of at least one item; rather, the phrase allows a meaning that includes at least one of any one of the items, and/or at least one of any combination of the items, and/or at least one of each of the items. By way of example, the phrases “at least one of A, B, and C” or “at least one of A, B, or C” each refer to only A, only B, or only C; any combination of A, B, and C; and/or at least one of each of A, B, and C. Furthermore, to the extent that the term “include,” “have,” or the like is used in the description or the claims, such term is intended to be inclusive in a manner similar to the term “comprise” as “comprise” is interpreted when employed as a transitional word in a claim. A reference to an element in the singular is not intended to mean “one and only one” unless specifically stated, but rather “one or more.” The term “some” refers to one or more. Underlined and/or italicized headings and subheadings are used for convenience only, do not limit the subject technology, and are not referred to in connection with the interpretation of the description of the subject technology. All structural and functional equivalents to the elements of the various configurations described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and intended to be encompassed by the subject technology. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the above description. While this specification contains many specifics, these should not be construed as limitations on the scope of what may be claimed, but rather as descriptions of particular implementations of the subject matter. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub combination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a sub combination or variation of a sub combination. The subject matter of this specification has been described in terms of particular aspects, but other aspects can be implemented and are within the scope of the following claims. For example, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. The actions recited in the claims can be performed in a different order and still achieve desirable results. As one example, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. Moreover, the separation of various system components in the aspects described above should not be understood as requiring such separation in all aspects, and it should be understood that the described program components and systems can generally be integrated together in a single hardware product or packaged into multiple hardware products. Other variations are within the scope of the following claim. | 33,719 |
11862864 | DESCRIPTION OF EXAMPLE EMBODIMENTS OF THE DISCLOSURE Overview The systems, methods and devices of this disclosure each have several innovative embodiments, no single one of which is solely responsible for all of the desirable attributes disclosed herein. Details of one or more implementations of the subject matter described in this specification are set forth in the description below and the accompanying drawings. TTD phase shifters are commonly implemented using switched transmission lines. To that end, a TTD component may include, for example, two transmission lines of different lengths to provide a reference signal path (via the shorter transmission line) and a delayed signal path (via the longer transmission line). The TTD component may also include switches to select between the two transmission lines. By switching to the different paths, a phase shift proportional to the additional transmission line length can be achieved. One disadvantage with using switched transmission lines is that the insertion loss can be high (e.g., due to the longer transmission line used for providing the longer delay). In some examples, the insertion loss for switched transmission lines can be about 10-15 decibels (dBs) when operating in a frequency range of about 30-40 GHz. Further, the linearity of switched transmission lines-based TTD phase shifter can be limited by the nonlinearity of switches that are used to switch between the transmission lines. The present disclosure describes mechanisms for providing TTD phase shifters in a manner that can address the insertion loss and linearity issues discussed above. One aspect of the present disclosure provides a TTD phase shifter using a microstrip transmission line with switchable ground planes to achieve a low insertion loss and a high linearity (e.g., an infinite linearity). For example, a TTD phase shifter structure may include a signal conductive line disposed on a first layer of the structure. The TTD phase shifter structure may further include at least a first switchable ground plane including a first conductive plane (e.g., a metal sheet) disposed on a second layer of the structure and a second switchable ground plane (e.g., another metal sheet) including a second conductive plane disposed on a third layer of the structure. The first, second, and third layers are different or separate layers (e.g., separate conductive layers or metal layers) of the structure. Each of the first switchable ground plane and the second conductive planes can be switched between a ground state or a floating state. At any given time, the first switchable ground plane or the second switchable ground plane can be switched to a ground state and the other one of the first switchable ground plane or the second switchable ground plane can be switched to a floating state. To that end, the TTD structure may further include a plurality of switches to selectively switch one of the first switchable ground plane or the second switchable ground plane to the respective ground state and the other one of the first switchable ground plane or the second switchable ground plane to the respective floating state. For instance, a first switch of the plurality of switches may be coupled between the first switchable ground plane and a first ground element that is disposed on the second layer. Similarly, a second switch of the plurality of switches may be coupled between the second switchable ground plane and a second ground element that is disposed on the third layer In some aspects, the first, second, and third layers are spaced apart from each other vertically (e.g., above or below one another). For instance, the second layer including the first switchable ground plane may be below the first layer including the signal conductive line by a first distance, and the third layer including the second switchable ground plane may be below the second layer. Further, each of the first switchable ground plane and the second switchable ground plane may at least partially overlap with the signal conducting line to provide a return path for a signal travelling through the signal conductive line. Because the signal conductive line is closer to the first switchable ground plane than the second switchable ground plane, a larger capacitance (e.g., parasitic capacitance) may be generated when the first switchable ground plane is switched to a ground state (to operate as a ground plane for the signal conductive line) than when the second switchable ground plane is switched to a ground state (to operate as a ground plane for the signal conductive line). The speed of signal propagation may be dependent on (or counter-proportional to) the capacitance. For instance, the larger the capacitance, the slower the signal propagation speed. Because the first switchable ground plane can generate a larger capacitance than the second switchable ground plane, the first switchable ground plane can provide an increased delay compared to the second switchable ground plane. Thus, in some instances, the second switchable ground plane can be referred to as a reference ground plane, and the first switchable ground plane can be referred to as a slow-wave ground plane. Stated differently, when the first switchable ground plane is in a float stating and the second switchable ground plane is in a ground state, the TTD phase shifter structure may operate in a reference mode. Conversely, when the first switchable ground plane is in a ground state and the second switchable ground plane is in a floating state, the TTD phase shifter structure may operate in a slow mode or delayed mode. In some aspects, to further increase a delay difference between the first and the second switchable ground planes, the first conductive plane (of the first switchable ground plane) may be configured with a slow-wave structure. For instance, the first conductive plane may include a first elongated conductive segment, a second elongated conductive segment, and a plurality of elongated conductive segments spaced apart from each other, where opposite ends of each of the plurality of elongated conductive segments are each connected to a different one of the first elongated conductive segment or the second elongated conductive segment. To couple the slow-wave structure (the first switchable ground plane) to the first ground element, the first switch can be arranged between the first or second elongated conductive segment and the first ground element. Further, the first switchable ground plane can be arranged such that a signal propagation axis of the signal conductive line is non-parallel (e.g., about perpendicular) with a signal propagation axis of the plurality of elongated conductive segments of the slow-wave structure to provide the increased delay. In some aspects, the plurality of switches for switching the first switchable ground plane between a ground state and a floating state and the second switchable ground plane between a ground state and a floating state may be implemented using field-effect transistors (FETs). In some aspects, the first switch (coupled between the first switchable ground plane and the first ground element) and the second switch (coupled between the second switchable ground plane and the second ground element) can be sized to the insertion loss variation between the reference mode and the delayed mode. In some aspects, the TTD phase shifter structure can further include a capacitor connected in parallel with the second switch, for example, coupled between the second switchable ground plane and the second ground element to further increase (or enhance) the time delay when a signal is travelling in the delayed mode. In some aspects, the TTD phase shifter may be integrated as part of a multi-bit phase shifter, as part of a beamforming integrated device, and/or as part of a phase antenna array system. The systems, schemes, and mechanisms described herein advantageously provide TTD phase shifters with a lower insertion loss and a higher linearity (e.g., an infinite linearity) by utilizing switchable ground planes to provide different transmission delays instead of switched transmission lines. Further, utilizing a microstrip transmission line topology (where the first and second switchable ground planes are vertically stacked with the signal conductive line) can allow for a reduced die area compared to a coplanar waveguide topology. Example Switched Transmission Line-Based TTD Phase Shifter FIG.1is schematic diagram illustrating an exemplary TTD phase shifter100with switched transmission lines. The TTD phase shifter100may be part of an integrated circuit device. In some instances, the TTD phase shifter100may be part of a multi-bit phase shifter. In some instances, the TTD phase shifter100may be part of a radio frequency (RF) device. The TTD phase shifter100may utilize a switched transmission line topology to provide two different output delay states or modes (e.g., a reference state or reference mode and a delayed state or delayed mode). As shown, the TTD phase shifter100may include an input node102, an output node104, a first signal path101arranged between the input node102and the output node104, and a second signal path103arranged between the input node102and the output node104. The first signal path101may include a transmission line110, a switch114acoupled between the transmission line110and the input node102, and another switch114bcoupled between the transmission line110and the output node104. The switches114aand114bmay each be controlled by (or responsive to) a first control signal106(shown as Vctrl). For instance, a switch114may be switched on when the first control signal106is a logic high and may be switched off when the first control signal106is a logic low. In some aspects, the switches114may be implemented as FETs or any suitable types of transistors. The second signal path103may include another transmission line120, a switch124acoupled between the transmission line120and the input node102, and another switch124bcoupled between the transmission line120and the output node104. As shown, the transmission line120may have a longer length than the transmission line110. Accordingly, a signal may take a longer time to travel through the transmission line120than the transmission line110, and thus providing a delay in time. The switches124aand124bmay each be controlled by (or responsive to) a second control signal108(shown as Vctrl_bar). The second control signal108may be an inverted signal of the first control signal106so that a single one of the first signal path101or the second signal path103may be selected at any given time. In other words, the TTD phase shifter100may be configured to transmit an input signal via the transmission line110with a first transmission delay or via the transmission line120with a second transmission delay greater than the first transmission delay. In some aspects, the switches124may also be implemented as FETs or any suitable types of transistors. As explained above, TTD phase shifters that utilize switched transmission lines may have a high insertion loss and a limited linearity. Accordingly, the present disclosure provides techniques to implement a TTD phase shifter using switchable ground planes to overcome the insertion loss and linearity issues with the switched transmission line topology. Example Low-Loss, High-Linearity Switchable Around Plane-Based TTD Phase Shifter FIGS.2A-2C,3A-3C, and4-5are discussed in relation to each other to illustrate a low-loss, high-linearity TTD phase shifter structure that utilizes a microstrip transmission line with tunable or switchable ground planes to provide selectable delays.FIG.2Ais a cross-sectional view of an exemplary TTD phase shifter structure200with switchable ground planes (e.g., a switchable reference ground plane212and a switchable slow-wave ground plane232), according to some embodiments of the present disclosure.FIG.2Billustrates an equivalent model of the TTD phase shifter structure200operating in a reference mode, according to some embodiments of the present disclosure.FIG.2Cillustrates an equivalent model of the TTD phase shifter structure200operating in a delayed mode, according to some embodiments of the present disclosure.FIG.3Ais a perspective view of the TTD phase shifter structure200, according to some embodiments of the present disclosure.FIG.3Billustrates an expanded view330of a portion of the switchable slow-wave ground plane232, according to some embodiments of the present disclosure.FIG.3Cillustrates an expanded view340of a portion of the switchable reference ground plane212, according to some embodiments of the present disclosure.FIG.4is a top view of the TTD phase shifter structure200, according to some embodiments of the present disclosure.FIG.5is another top view of TTD phase shifter structure200, according to some embodiments of the present disclosure. The TTD phase shifter structure200may be part of an integrated circuit device (e.g., a semiconductor device). In some instances, the TTD phase shifter structure200may be part of a multi-bit phase shifter. In some instances, the TTD phase shifter structure200may be part of a radio frequency (RF) device (e.g., the phased array system700ofFIG.7). For simplicity,FIG.2Aillustrates the TTD phase shifter structure200including two switchable ground planes212and232to provide two different output delay states or modes (e.g., a reference state or reference mode and a delayed state or delayed mode). However, the TTD phase shifter structure200can be scaled to include any suitable number of switchable ground plane (e.g., 3, 4 or more) to provide various delays. Referring toFIG.2A, the cross-sectional view is taken along the axis301ofFIG.3. The TTD phase shifter structure200may include a plurality of conductive layers (e.g., metal layers) arranged vertically above or under one another. For simplicity,FIG.2Aillustrates the TTD phase shifter structure200including four layers210,220,230, and240shown as M1, M2, M3, and M4, respectively. However, the TTD phase shifter structure200may include any suitable number of layers (e.g., 3, 5, 6, 7, 8 or more). As shown, the TTD phase shifter structure200may further include a signal line242disposed on the layer240, a switchable slow-wave ground plane232disposed on the layer230, and a switchable reference ground plane212disposed on the layer210. The TTD phase shifter structure200may further include ground elements234aand234bdisposed on the layer230, ground elements224aand224bdisposed on the layer220, and ground elements214aand214bdisposed on the layer210, where the ground elements234,224, and214may be interconnected with each other by vias206. The ground elements234,224, and214are fixed ground elements that are arranged, for example, at the edges of corresponding layers of the TTD phase shifter structure200(shown inFIG.3). That is, the ground elements234,224, and214are always in a ground state during operations of the TTD phase shifter structure200. The TTD phase shifter structure200may further include switches250aand250b(shown as S1) disposed on the layer230and switches252aand252b(shown as switch S2) disposed on the layer210. In some aspects, the layer220may include other traces and/or components but unrelated to the reference or delay mode, and hence are not shown for simplicity. In some aspects, the layer240including the signal line242may further include ground elements similar to the ground elements234,224, and214but unrelated to the reference mode or delayed mode, and hence are not shown for simplicity. The switches250and252are implemented as FETs. As shown, each of the switches250aand250bmay be coupled between the switchable slow-wave ground plane232and a respective ground element234aor234b. More specifically, the source terminal of each of the FETs250aand250bmay be coupled to the ground element234aand234b, respectively, and the drain terminal of each of the FETs250aand250bmay be coupled to the switchable slow-wave ground plane232. The gate terminals of the FETs250aand250bare controlled by a first control signal202(shown as Vctrl). For instance, each switch250a,250bmay be switched on when the respective gate terminal receives a logic high (e.g., Vctrl is a logic high) and may be switched off when the respective gate terminal receives a logic low (e.g., Vctrl is a logic low). In a similar way, each of the switches252aand252bmay be coupled between the switchable reference ground plane212and a respective ground element214aor214b. More specifically, the source terminal of each of the FETs252aand252bmay be coupled to the ground elements234aand234b, respectively, and the drain terminal of each of the FETs252aand252bmay be coupled to the switchable reference ground plane212. The gate terminals of the FETs252aand252bare controlled by a second control signal204(shown as Vctrl_bar). The second control signal204may be an inverted signal of the first control signal202so that one of the switchable slow-wave ground plane232or the switchable reference ground plane212may be selected at any given time. Each of the switchable slow-wave ground plane232and the switchable reference ground plane212may be switched between a ground state or a floating state (e.g., a non-ground state) via the switches250and252, respectively. For instance, when the first control signal202is a logic high, the switchable slow-wave ground plane232may be switched to a ground state and operate as a ground plane. That is, the signal line242may use the switchable slow-wave ground plane232as a ground plane (to provide a return signal path). At the same time, the second control signal204is a logic low (inverted from the first control signal202), and thus the switchable reference ground plane212may be in a floating state. Conversely, when the first control signal202is a logic low, the switchable slow-wave ground plane232may be in a floating state. At the same time, the second control signal204is a logic high (inverted from the first control signal202), and thus the switchable reference ground plane212may be switched to a ground state and operate as a ground plane. That is, the signal line242may use the switchable reference ground plane212as a ground plane (to provide a return signal path). As shown, the layer230including the switchable slow-wave ground plane232is vertically below the layer240including the signal line242, and the layer210including the switchable reference ground plane212is vertically below the layer230. More specifically, the switchable slow-wave ground plane232is spaced apart from the signal line242by a distance260, and the switchable reference ground plane212is spaced apart from the signal line242by a distance262greater than the distance260. Further, each of the switchable slow-wave ground plane232and the switchable reference ground plane212may overlap with the signal line242to provide a return signal path when the respective ground plane is in a ground state. The overlap between the signal line242and the switchable slow-wave ground plane232or the switchable reference ground plane212can create a capacitive coupling. Because the signal line242is closer to the switchable slow-wave ground plane232than the switchable reference ground plane212, a larger capacitance (e.g., parasitic capacitance) may be generated when the switchable slow-wave ground plane232is switched to a ground state than when the switchable reference ground plane212is switched to a ground state. As explained above, the speed of signal propagation may be counter-proportional to the capacitance to ground. Accordingly, an increased time delay can be provided when the signal line242utilizes the switchable slow-wave ground plane232as a ground plane instead of the switchable reference ground plane212. Stated differently, the TTD phase shifter structure200may operate in the reference mode when the switchable reference ground plane212is in a ground state and the switchable slow-wave ground plane232is in a floating state. Conversely, the TTD phase shifter structure200may operate in the delayed mode when the switchable slow-wave ground plane232is in a ground state and the switchable reference ground plane212is in a floating state. In some aspects, to further increase a delay difference between the switchable slow-wave ground plane232and the switchable reference ground plane212, the switchable slow-wave ground plane232may include a slow-wave structure as will be discussed more fully below with reference toFIGS.3A and3B. Additionally or alternatively, additional capacitors254(shown as254aand254b) can be arranged in parallel with the switches252to further enhance the time delay difference between the reference mode and the delayed mode. More specifically, the capacitor254acan be connected between the source and drain terminals of the switch252a, and the capacitor254bcan be connected between the source and drain terminals of the switch252b. To better understand the enhanced time delay provided by the additional capacitors254,FIGS.2B and2Cprovide equivalent models of the TTD phase shifter structure200. FIG.2Billustrates the equivalent model of the TTD phase shifter structure200ofFIG.2Aoperating in a reference mode. In the reference mode, the switches250aand250bare switched off to decouple the switchable slow-wave ground plane232from the ground elements234while the switches252aand252bare switched on to couple the switchable reference ground plane212to the ground elements214. As shown inFIG.2B, the switches250aand250bin an off-state may be modelled (e.g., lumped circuitry equivalent) as capacitors Coff1, and the switches252aand252bin an on-state may be modelled as resistors Ron2. The resistors Ron2may have a very small resistance and thus can be neglected. The capacitors254aand254bconnected in parallel with the switches252aand252bmay be represented by Cadded. As further shown inFIG.2B, the TTD phase shifter structure200may have a parasitic capacitance Cslowbetween the signal line242and the switchable slow-wave ground plane232and another parasitic capacitance Crefbetween the signal line242and the switchable reference ground plane212. The total parasitic capacitance at the signal line242may be Cslowin series with Coff1and further in parallel with Cref. As such, the total capacitance at the signal line242in the reference mode may represented as shown below: 11Cslow+12×Coff1+Cref.(1) FIG.2Cillustrates the equivalent model of TTD phase shifter structure200ofFIG.2Aoperating in a delayed mode. In the delayed mode, the switches250aand250bare switched on to couple the switchable slow-wave ground plane232to the ground elements234while the switches252aand252bare switched off to decouple the switchable reference ground plane212from the ground elements214. As shown inFIG.2C, the switches250aand250bin an on-state may be modelled as resistors Ron1, and the switches252aand252bin an off-state may be modelled as capacitors Coff2. The resistors Ron2may have a very small resistance and thus can be neglected. Similar toFIG.2B, the TTD phase shifter structure200may have a parasitic capacitance Cslowbetween the signal line242and the switchable slow-wave ground plane232and another parasitic capacitance Crefbetween the signal line242and the switchable reference ground plane212. The total parasitic capacitance at the signal line242may be Crefin series with the parallel connected Coff1and Caddedand further in parallel with Cslow. As such, the total capacitance at the signal line242in the delayed mode may represented as shown: 11Cref+12×(Coff2+Cadded)+Cslow.(2) As can be observed from equation (2), by adding a Caddedin parallel with the switch252aand a Caddedin parallel with the switch252b, the overall value of Crefin series with (Coff2+Cadded) is increased. As explained above, the higher the capacitance, the slower the signal propagation speed. Accordingly, the addition of the capacitors254aand254b(e.g., Cadded) to the TTD phase shifter structure200can enhance the time delay for the delayed mode. WhileFIG.2Aillustrates the switches250and252implemented using negative-positive-negative (NPN) transistors, the switches250and252can be implemented using any suitable types of transistors such as positive-negative-positive (PNP) transistors, metal-oxide-semiconductor (MOS) devices, and/or complementary-metal-oxide-semiconductor (CMOS) devices. Further, whileFIG.2Aillustrates one layer220between the switchable slow-wave ground plane232and the switchable reference ground plane212, the switchable slow-wave ground plane232and the switchable reference ground plane212may be separated by any suitable number of conductive layers (e.g., 2, 3 or more) and may be arranged on any suitable layers of the TTD phase shifter structure200. In the case where the TTD phase shifter structure200includes more than two layers with switchable ground planes (e.g., to provide a reference mode with multiple different delayed modes), the TTD phase shifter structure200may include switches that can be controlled to select a single one of the switchable ground planes to operate as a ground plane at any given time. FIG.3Aprovides a perspective view of the TTD phase shifter structure200and a more detailed view of the switchable slow-wave ground plane232and the switchable reference ground plane212. Details unrelated to the reference mode and delayed mode are not shown for simplicity. As shown inFIG.3A, the layers210,220,230, and240are vertically stacked along the z-axis. The signal line242may extend in a direction along the x-axis. As explained above, the switchable slow-wave ground plane232can include a slow-wave structure (where an expanded view is shownFIG.3B) to further increase a delay difference between the switchable slow-wave ground plane232and the switchable reference ground plane212. To that end, the switchable slow-wave ground plane232may be a conductive plane that includes a first elongated conductive segment302and a second elongated conductive segment304each extending in a direction along the x-axis, and a plurality of elongated conductive segments306spaced apart from each other (e.g., about parallel to each other) and extending in a direction along the y-axis, where opposite ends of the plurality of conductive segments306are each connected to a different one of the first conductive segment302or the second conductive segment304, for example, in a “ladder” configuration. Further, the conductive segments306are at least partially overlapping with the signal line242(e.g., directly below the signal line242). That is, each of the conductive segments306may cross the signal line242to provide the further delay. As an example, a signal310(e.g., a current signal) received at an input port312may travel along the signal line242from the input port312to the output port314along a signal propagation axis303. When the switchable slow-wave ground plane232is switched to a ground state to operate as a ground plane (e.g., by activating the switches250), a returned signal (e.g., a return current) may travel along the segments306(of the switchable slow-wave ground plane232) from one direction to another along a signal propagation axis305, for example, in a “zig-zag” manner as shown inFIG.3B. For instance, the returned signal may travel in a first direction along a first conductive segment306, then in a second, opposite direction along a second conductive segment306adjacent to the first conductive segment306, and so on as shown by the dashed arrows inFIG.3Bto provide an additional level of delays. Accordingly, utilizing the slow-wave structure for the switchable slow-wave ground plane232can increase the delay using the same die area. As further shown inFIG.3A, the switchable reference ground plane212may include a conductive plane (e.g., a metal sheet) with holes (or cut-outs)308, for example, arranged in a grid pattern as shown. However, the conductive plane can include holes arranged in any suitable pattern or without holes depending on the process and/or allowable density for the conductive plane, for example. The conductive plane may be arranged to be overlapping with the signal line242provide a return signal path, which is shown by the dashed arrow in the expanded view340ofFIG.3C. As can be observed, the return signal path being a straight path (in a reverse direction of the signal path along the signal line242from the input port312to the output port314) can provide a shorter delay compared to the zig-zag return signal path of the switchable slow-wave ground plane232shown inFIG.3B. As further shown inFIG.3A, the layer230further includes two additional switches250(shown as250cand250d) coupled between the switchable slow-wave ground plane232and the ground elements234. Similarly, the layer210further includes two additional switches252(shown as252cand252d) coupled between the switchable reference ground plane212and the ground elements214. In general, each of the layers230or210may include any suitable number of respective switches250or252(e.g., about 3, 5, or more) arranged in any suitable locations on the respective layers230or210. Additionally, while the ground elements234are shown as ground lines or strips arranged at the edges of the layer230, the ground elements234can be arranged in any suitable configuration on the layer230(e.g., three edges or all four edges). Similarly, while the ground elements214are shown as ground lines or strips arranged at the edges of the layer210, the ground elements214can be arranged in any suitable configuration on the layer210(e.g., three edges or all four edges). Further, additional capacitors254cand254dmay be connected in parallel to the switches252cand252d, respectively. WhileFIG.3Aillustrates that each of the switches252is connected in parallel with a respective capacitor254, in some instances, one or more of the switches252may not have a capacitor254connected in parallel. In some aspects, the switches250and252can be sized to achieve a small insertion loss variation between the reference mode and the delayed mode. For instance, the switches250(S1) for selective coupling of the switchable slow-wave ground plane232to the ground elements234and235can have a smaller size than the switches252(S2) for selective coupling of the switchable reference ground plane212to the ground elements214. In some aspects, the switches250and the switches252may be arranged on their respective layers230and210such that the switches250and the switches252are at least partially overlapping or non-overlapping or aligned with each other vertically. FIG.4shows a top view of the TTD phase shifter structure200.FIG.4illustrates the layer240including the signal line242and the layer230including the switchable slow-wave ground plane232but without the layers210and220to avoid cluttering the figure. As shown, the signal line242extends in a direction of the x-axis from the input port312to the output port314with a signal propagation axis303, while the slow-wave structure of the switchable slow-wave ground plane232may include a signal propagation axis305that is about perpendicular to the signal propagation axis303. FIG.5shows a top view of the TTD phase shifter structure200.FIG.5illustrates the layer240including the signal line242and the layer210including the switchable reference ground plane212but without the layers220and230to avoid cluttering the figure. As shown, the signal line242may have a signal propagation axis303. As discussed above with reference toFIGS.3A and3C, the switchable reference ground plane212may provide a return signal path in a reverse direction of the signal path along the signal line242from the input port312to the output port314. For instance, a signal (a current signal) may travel along the signal line242from the input port312to the output port314, and a return signal (return current) may travel along the switchable reference ground plane212in the reverse direction as shown by the dashed arrow. Example Multi-Bit Phase Shifter FIG.6is schematic diagram illustrating an exemplary multi-bit TTD phase shifter circuitry600, according to some embodiments of the present disclosure. The multi-bit TTD phase shifter circuitry600may be part of an integrated circuit device. In some instances, the multi-bit TTD phase shifter circuitry600may be part of an RF device (e.g., the phased array system700ofFIG.7). As shown, the multi-bit TTD phase shifter circuitry600may include an input node602, an output node604, and a plurality of adjustable or switchable phase shifter circuities610,620,630,640,650, and660connected in series between the input node602and the output node604. Each of the phase shifter circuities610,620,630,640,650, and660may provide a different delay (and hence a different phase-shift) responsive to a respective control signal or control bit. For instance, the phase shifter circuitry610may be configured to provide a delay of about 2.778 picosecond (ps) based on a control signal614(shown as Vctrl4) being a logic high or a logic low, respectively, or vice versa. The phase shifter circuitry620may be configured to provide a delay of about 0.347 ps based on a control signal611(shown as Vctrl1) being a logic high or a logic low, respectively, or vice versa. The phase shifter circuitry630may be configured to provide a delay of about 0.694 based on a control signal616(shown as Vctrl2) being a logic high or a logic low, respectively, or vice versa. The phase shifter circuitry640may be configured to provide a delay of about 11.1 ps based on a control signal616(shown as Vctrl6) being a logic high or a logic low, respectively, or vice versa. The phase shifter circuitry650may be configured to provide a delay of about 1.388 ps based on a control signal613(shown as Vctrl3) being a logic high or a logic low, respectively, or vice versa. The phase shifter circuitry660may be configured to provide a delay of about 5.582 ps based on a control signal615(shown as Vctrl5) being a logic high or a logic low, respectively, or vice versa. Accordingly, the multi-bit TTD phase shifter circuitry600can provide up to a delay of about 21.88 picosecond (ps), which may correspond to about 354.375 degrees at 45 GHz. In some aspects, the multi-bit TTD phase shifter circuitry600may utilize a combination of the switchable ground plane topology as discussed above with reference toFIGS.2,3A-3C, and4-5and the switched transmission line topology as discussed above with reference toFIG.1in the phase shifter circuitries610,620,630,640,650, and660. The reason for using a combination of the switchable ground plane topology and the switched transmission line topology is that the switched transmission topology may have too high of an insertion loss for small-delay cells while transmission lines with switchable ground planes have too high of an insertion loss for large time-delay cells. To that end, the phase shifter circuities610,640, and660(shown by the patterned circles) with the higher delays can be implemented using the switched transmission line topology, while the phase shifter circuities620,630, and650(shown by the empty-filled circles) with the lower delays can be implemented using the switchable ground plane topology. Accordingly, combining the switchable ground plane topology with the switched transmission line topology can provide the multi-bit TTD phase shifter circuitry600with an optimal insertion loss. In some aspects, each of the control signals611,612,613,614,615, and616may be generated according to a separate control bit of a control word (e.g., with bits b0, b1, b2, b3, b4, and b5) for configuring the multi-bit TTD phase shifter circuitry600. As an example, the control signals611,612,613,614,615, and616may each be controlled by b0, b1, b2, b3, b4, and b5, respectively. A control signal611,612,613,614,615, or616may be set to a logic high when a corresponding bit is 1 and may set to a logic low when the corresponding bit is 0, or vice versa. In some aspects, the phase shifter circuitries610,620,630,640,650, and660may be arranged in an order based on the insertion loss and/or a return loss of the individual circuit blocks. However, in general, the phase shifter circuitries610,620,630,640,650, and660may be arranged in any suitable order and corresponding control signals615,611,616,613,612, and614may be mapped to any suitable bits of the control word. In operation, the phase shifter circuitry600may receive an input signal at the input node602. The input signal may be delayed (or phase-shifted) by one or more of the phase shifter circuitries610,620,630,640,650, and660depending on whether each of the control signals611,612,613,614,615, or616is a logic high or a logic low, respectively. The phase shifter circuitry600may output an output signal at the output node604, where the output signal may correspond to a time-delayed version (or phase-shifted version) of the input signal. WhileFIG.6illustrates the multi-bit phase shifter circuitry600as a 6-bit phase shifter including six phase shifter circuitries610,620,630,640,650, and660controlled by a 6-bit control word, aspects are not limited thereto. In general, a multi-bit phase shifter may include any suitable number of phase shifter circuitries (e.g., 4, 5, 7, 8 or more) and may use any suitable combinations of switched transmission topology and switchable ground plane topology. Example Phased Array System FIG.7is a block diagram illustrating an exemplary phased array system700, according to some embodiments of the present disclosure. The phased array system700may be part of an RF system. In some instances, the phase shifter circuitry may correspond to a portion of a wireless communication device. In other instances, the phased array system700may correspond to a portion of a base station. The phased array system700may operate in any suitable frequency range. In some aspects, the phased array system700may operate over a Ku band and/or a Ka band. As shown, the system700may include a transmitter740, a receiver750, an analog frontend (AFE)760, and an antenna array724. The transmitter740may include a multiple-input and multiple-output (MIMO) encoder702and a digital-to-analog converter (DAC)704. The receiver750may include a MIMO decoder732and an analog-to-digital converter (ADC)734. The AFE760may include a switch710(shown as SW), a multiplier712, a phase-locked loop (PLL)706, another switch708(shown as SW), a plurality of digital step attenuators (DSAS)714(shown as714aand714b), a plurality of phase shifters716(shown as716aand716b), a plurality of power amplifiers (PAs)718, a plurality of low-noise amplifiers (LNAs)720, and a plurality of switches722(shown as SW). The MIMO encoder702and the MIMO decoder732may be implemented using a combination of hardware and/or software. The rest of the components in the system700may be implemented in hardware and at least some of the component can be controlled by software. In a transmit direction, the MIMO encoder702may generate a plurality of data streams (e.g., about 2, 4, 8, 16 or more). The DAC704may be coupled to the MIMO encoder and may convert the data streams into analog signals for transmission. The switch710may switch between the transmitter740and the receiver750. The multiplier712may multiply (or mix) the transmit analog signals with a PLL signal generated by the PLL706. The switch708may be selected to couple the output signal of the multiplier712to the DSAs714a. The DSAs714amay be programmed to various attenuation steps to attenuate corresponding signals. The phase shifters716amay each be coupled to one of the DSAs714aand controlled to shift the phase of a corresponding signal by a certain phase-shift (by delaying a corresponding signal, e.g., by, 0.347 ps, 0.694 ps, 1.388 ps, etc.). In some aspects, the phase shifter716amay be similar to the multi-phase shifter circuitry600discussed above with reference toFIG.6. In some aspects, at least one of the phase shifters716amay be implemented using the switchable ground plane topology discussed above with reference toFIGS.2,3A-3C, and4-5. The PAs718may each be coupled to one of the phase shifters716ato amplify a corresponding phase-shifted signal for transmission. In some aspects, the DSAs714a, the phase shifters716a, and the PAs718may be configured together to beamform in a certain spatial direction for transmission. The switches722may be selected to couple the phase-shifted signals to the antenna array724for transmission. The antenna array724may include a plurality of antenna elements725(e.g., arranged in a plurality of rows and a plurality of columns as shown). The antenna array724may include any suitable number of antenna elements (e.g., 4, 8, 16, 64, 128, 1024 or more). Each antenna element725may be configured to transmit a signal with a different phase-shift (e.g., from the phase shifters716a) to achieve beamforming in a certain spatial direction. For instance, the antenna array724may transmit a signal carried in any one of the beams726. In a receive direction, a signal may be received by the antenna array724via the antenna elements725. The switches722may be selected to couple various antenna elements725to the LNAs720. The LNAs720may amplify the received signals. The phase shifters716bmay be substantially similar to the phase shifters716aand may apply various phase shifts (or time delays) to the received signals. Similarly, The DSAs714bmay be substantially similar to the DSAs714aand may each be coupled to one of the phase shifters716bto provide signal attenuations. In some aspects, the DSAs714b, the phase shifters716b, and the LNAs720may be configured together to beamform in a certain spatial direction for reception, for example, to receive a signal using any one of the beams726. The switch708may be selected to couple the received signals to the multiplier712for mixing with a PLL signal generated by the PLL706. The SW710can be selected to couple the received signals to the receiver750. At the receiver750, the ADC734may convert the received signal from an analog domain to a digital domain. The MIMO decoder732may be coupled to the ADC734and may decode information from the received digital signals (e.g., about 2, 4, 8, 16 or more). In some aspects, the DSAs714aand714b, the phase shifters716aand716b, the PAs718, and the LNAs720may be integrated onto a single integrated circuit device, for example, for transmit beamforming and/or receive beamforming. WhileFIG.7illustrates four transmit paths (e.g., each including a DSA714a, a phase shifter716a, and a PA718) and four receive paths (e.g., each including a DSA714b, a phase shifter716b, and an LNA720) in the system700, a phased array system can include any suitable number of paths. In some examples, a phase array system may include 2, 8, 16 or more paths for transmission and 2, 8, 16 or more paths for reception. Since each transmit path or each receive path may include a phase shifter, using the switchable ground plane topology for at least some of the phase shifters716aand/or716bdisclosed herein can advantageously reduce the size of a phased array system or a beamforming integrated device. Example Phase-Shifting Method FIG.8is a flow diagram of a method800for performing phase-shifting, according to some embodiments of the present disclosure. The method800can be implemented by phase circuitries having a structure similar to the TTD phase shifter structure200discussed above with reference toFIGS.2,3A-3C, and4-5, respectively, multi-phase shifter circuitry similar to the multi-bit phase shifter circuitry600discussed above with reference toFIG.6, and/or a phase array system similar the phased array system700discussed above with reference toFIG.7, and/or any suitable wireless device. Although the operations of the method800may be illustrated with reference to particular embodiments of the phase shifter circuitries disclosed herein, the method800may be performed using any suitable hardware components and/or software components. Operations are illustrated once each and in a particular order inFIG.8, but the operations may be performed in parallel, reordered, and/or repeated as desired. During a first time interval, the method800may perform the operations of802,804, and806to switch one switchable ground plane (e.g., a first switchable ground plane) to a ground state and another switchable ground plane (e.g., a second switchable ground plane) to a floating state. For instance, at802, a first switch coupled between the first switchable ground plane and a first ground element may be closed, wherein the first switchable ground plane and the first ground element are disposed on a first metal layer of a device. In a first example, the first switch may correspond to one of the switches250, the first switchable ground plane may correspond to the switchable slow-wave ground plane232, and the first metal layer may correspond to the layer230. In a second example, the first switch may correspond to one of the switches252, the first switchable ground plane may correspond to the switchable reference ground plane212, and the first metal layer may correspond to the layer210. At804, a second switch coupled between the second switchable ground plane and a second ground element may be opened, where the second switchable ground plane and the second ground element are disposed on a second metal layer of the device. In the first example, the second switch may correspond to one of the switches252, the second switchable ground plane may correspond to the switchable reference ground plane212, and the first metal layer may correspond to the layer210. In the second example, the second switch may correspond to one of the switches250, the second switchable ground plane may correspond to the switchable slow-wave ground plane232, and the first metal layer may correspond to the layer230. At806, a first signal may be transmitted via a first signal conductive line while the first switch is closed and the second switch is opened, wherein the first signal conductive line is disposed on a third metal layer of the device. The first, second, and third metal layers may be spaced apart from each other (e.g., vertically). In the first or second example, the first signal conductive line may correspond to the signal line242, and the third metal layer may correspond to the layer240. During a second time interval different from the first time interval, the method800may perform the operations of812,814, and816to switch the other switchable ground plane (e.g., the second switchable ground plane) to a ground state. For instance, at812, the first switch coupled between the first switchable ground plane and the first ground element may be opened. At814, the second switch coupled between the second switchable ground plane and the second ground element may be closed. At816, a second signal may be transmitted via the first signal conducting line while the first switch is opened and the second switch is closed. In some aspects, the closing the first switch at802and opening the second switch at804may be based on (or responsive to) a first control bit value associated with a first transmission delay, and the opening the first switch at812and closing the second switch at814may be based on (or responsive to) a second control bit value associated with a second transmission delay different from the first transmission delay. In some aspects, the first switchable ground plane is between the first signal conducting line and the second switchable ground plane. That is, the first signal conductive line may be closer to the first switchable ground plane than the second switchable ground plane. As explained above, the switchable ground plane closer to the signal line may generate a larger capacitance, and hence may slow down a signal propagation speed. To further increase the delay, the first switchable ground plane may include a first elongated conductive segment coupled to the first switch, a second elongated conductive segment, and a plurality of elongated conductive segments spaced apart from each other, where opposite ends of each of the plurality of elongated conductive segments are each connected to a different one of the first elongated conductive segment or the second elongated conductive segment. For instance, the first elongated conductive segment may correspond to one of the conductive segments302or304, the second elongated conductive segment may correspond to the other conductive segment302or304, and the plurality of spaced apart conductive segments may correspond to the conductive segments306discussed above with reference toFIGS.3A,3B, and4. In some aspects, the device may be multi-bit phase shifter similar to the multi-bit TTD phase shifter circuitry600utilizing a combination of a switched transmission line topology and a switchable ground plane topology as discussed above with reference toFIG.6. As such, the method800may further include closing a third switch to couple the first signal conducting line to a second signal conducting line. The method800may further include opening a fourth switch to decouple the first signal conducting line from a third signal conducting line, where the third signal conducting line and the second signal conducting line have different lengths. The method800may further include transmitting first signal further, via the second signal conducting line while the third switch is closed and the fourth switch is opened, the first signal. For example, the third switch may correspond to one of the switches114or124, the fourth switch may correspond to the other one of the switches114or124, the second signal conductive line may correspond to one of the transmission lines110or120, and the third signal conductive line may correspond to the other one of the transmission lines110or120. In some aspects, the closing the first switch and opening the second switch may be based on a first control bit, and the closing the third switch and opening the fourth switch is based on a second control bit separate from the first control bit. In some aspects, the first time interval during which the operations of802,804, and806are performed and the second time interval during which the operations of812,814, and816are performed may correspond to different radio frames, different subframes, or different time slots (e.g., in the context of LTE or 5G). For instance, the first signal may carry first data information (e.g., first encoded data bits) in the first time interval, and the second signal may carry second data information (e.g., second encoded data bits) in the second time interval. In some instances, the first data information can be different from the second data information. In some other instances, the first data information can be the same as the second data information, where the second signal is a retransmission of the first data information. EXAMPLES Example 1 includes a true time-delay (TTD) phase shifter structure. The TTD phase shifter structure includes a signal conductive line disposed on a first layer of the structure; a first switchable ground plane including a first conductive plane disposed on a second layer of the structure; a second switchable ground plane including a second conductive plane disposed on a third layer of the structure, where the first, second, and third layers are separate layers of the structure; a first switch coupled between the first switchable ground plane and a first ground element, the first ground element disposed on the second layer; and a second switch coupled between the second switchable ground plane and a second ground element, the second ground element disposed on the third layer. Example 2 includes the TTD phase shifter structure of Example 1, where the first switchable ground plane and the second switchable ground plane are associated with different transmission delays. Example 3 includes the TTD phase shifter structure of any of Examples 1-2, where each of the first switchable ground plane and the second switchable ground plane at least partially overlaps with the signal conductive line. Example 4 includes the TTD phase shifter structure of any of Examples 1-3, where the first switchable ground plane is between the signal conductive line and the second switchable ground plane; and the first conductive plane of the first switchable ground plane includes a first elongated conductive segment coupled to the first switch; a second elongated conductive segment; and a plurality of elongated conductive segments spaced apart from each other, where opposite ends of each of the plurality of elongated conductive segments are each connected to a different one of the first elongated conductive segment or the second elongated conductive segment. Example 5 includes the TTD phase shifter structure of any of Examples 1-4, where a signal propagation axis of the signal conductive line is non-parallel with a signal propagation axis of the plurality of elongated conductive segments of the first switchable ground plane. Example 6 includes the TTD phase shifter structure of any of Examples 1-5, where a signal propagation axis of the signal conductive line is perpendicular to a signal propagation axis of the plurality of elongated conductive segments of the first switchable ground plane. Example 7 includes the TTD phase shifter structure of any of Examples 1-6, where the signal conductive line at least partially overlaps with the plurality of elongated conductive segments of the first switchable ground plane. Example 8 includes the TTD phase shifter structure of any of Examples 1-7, where the second conductive plane of the second switchable ground plane includes a layer of conductive material with holes. Example 9 includes the TTD phase shifter structure of any of Examples 1-8 and further includes one or more conductive layers between the first switchable ground plane and the second switchable ground plane. Example 10 includes the TTD phase shifter structure of any of Examples 1-9, where the first switch is in a closed state to switch the first conductive plane to a ground state while the second switch is in an opened state to switch the second conductive plane to a floating state. Example 11 includes the TTD phase shifter structure of any of Examples 1-10, where the first switch is in an opened state to switch the first conductive plane to a floating state while the second switch is in a closed state to switch the second conductive plane to a ground state. Example 12 includes the TTD phase shifter structure of any of Examples 1-12, where the first switch coupled between the first switchable ground plane and the first ground element has a different size than the second switch coupled between the second switchable ground plane and the second ground element. Example 13 includes the TTD phase shifter structure of any of Examples 1-13, where the second switchable ground plane is spaced apart from the signal conductive line by a greater distance than the first switchable ground plane; the second switch coupled between the second switchable ground plane and the second ground element includes a field effect transistor (FET); and the TTD phase shifter structure further includes a capacitor coupled across a drain and a source of the FET. Example 14 an integrated circuit device including a first metal layer including a first signal conductive line; a second metal layer including a first ground plane switchable between a respective ground state and a respective floating state, where the second metal layer is vertically below the first metal layer; a third metal layer including a second ground plane switchable between a respective ground state and a respective floating state, where the third metal layer is vertically below the second metal layer; and a plurality of switches to selectively switch one of the first ground plane or the second ground plane to the respective ground state and the other one of the first ground plane or the second ground plane to the respective floating state. Example 15 includes the integrated circuit device of Example 14, where the first ground plane includes a first elongated conductive segment coupled to at least a first switch of the plurality of switches; a second elongated conductive segment; and a plurality of elongated conductive segments spaced apart from each other, where a first end of each of the plurality of elongated conductive segments is connected to the first elongated conductive segment and a second end of each of the plurality of elongated conductive segments is connected to the second elongated conductive segment. Example 16 includes the integrated circuit device of any of Examples 14-15, where a signal propagation axis of the first signal conductive line is non-parallel with a signal propagation axis of the plurality of elongated conductive segments of the first ground plane. Example 17 includes the integrated circuit device of Example 14 and further includes one or more other metal layers between the first ground plane and the second ground plane. Example 18 includes the integrated circuit device of any of Examples 14-17, where the second metal layer further includes a first ground element, where a first switch of the plurality of switches is coupled between the first ground plane and the first ground element; and the third metal layer further includes a second ground element, and where a second switch of the plurality of switches is coupled between the second ground plane and the second ground element. Example 19 includes the integrated circuit device of any of Examples 14-18, where the second switch coupled between the second ground plane and the second ground element includes a field effect transistor (FET); and the integrated circuit device further includes a capacitor coupled across a drain and a source of the FET. Example 20 includes the integrated circuit device of any of Examples 14-19, where the integrated circuit device is a multi-bit phase shifter device including a first phase shifter, where the first signal conductive line, the first ground plane, the second ground plane, and the plurality of switches are part of the first phase shifter; and a second phase shifter including a second signal conductive line and a third signal conductive line of different lengths; and one or more switches to select the second signal conductive line or the third signal conductive line. Example 21 includes the integrated circuit device of any of Examples 14-20, where the first phase shifter is associated with a shorter transmission time delay than the second phase shifter. Example 22 includes the integrated circuit device of any of Examples 14-21, where the first phase shifter is responsive to a first control bit; and the second phase shifter is responsive to a second control bit separate from the first control bit. Example 23 includes a method for performing phase-shifting, the method including closing a first switch coupled between a first switchable ground plane and a first ground element, where the first switchable ground plane and the first ground element are disposed on a first metal layer of a device; opening a second switch coupled between a second switchable ground plane and a second ground element, where the second switchable ground plane and the second ground element are disposed on a second metal layer of the device; and transmitting, via a first signal conductive line, a first signal while the first switch is closed and the second switch is opened, where the first signal conductive line is disposed on a third metal layer of the device, where the first, second, and third metal layers are spaced apart from each other. Example 24 includes the method of Example 23 and further includes opening the first switch coupled between the first switchable ground plane and the first ground element; closing the second switch coupled between the second switchable ground plane and the second ground element; and transmitting, via the first signal conductive line, a second signal while the first switch is opened and the second switch is closed. Example 25 includes the method of any of Examples 23-24, where the closing the first switch and opening the second switch is based on a first control bit value associated with a first transmission delay; and the opening the first switch and closing the second switch is based on a second control bit value associated with a second transmission delay different from the first transmission delay. Example 26 includes the method of any of Examples 23-25, where the first switchable ground plane is between the first signal conductive line and the second switchable ground plane; and the first switchable ground plane includes a first elongated conductive segment coupled to the first switch; a second elongated conductive segment; and a plurality of elongated conductive segments spaced apart from each other, where opposite ends of each of the plurality of elongated conductive segments are each connected to a different one of the first elongated conductive segment or the second elongated conductive segment. Example 27 includes the method of any of Examples 23-26 and further includes closing a third switch to couple the first signal conductive line to a second signal conductive line; opening a fourth switch to decouple the first signal conductive line from a third signal conductive line, where the third signal conductive line and the second signal conductive line have different lengths; and transmitting further, via the second signal conductive line while the third switch is closed and the fourth switch is opened, the first signal. Example 28 includes the method of any of Examples 23-27, where the closing the first switch and opening the second switch is based on a first control bit; and the closing the third switch and opening the fourth switch is based on a second control bit separate from the first control bit. Variations and Implementations While embodiments of the present disclosure were described above with references to exemplary implementations as shown inFIGS.1,2A-2C,3A-3C, and4-8, a person skilled in the art will realize that the various teachings described above are applicable to a large variety of other implementations. In certain contexts, the features discussed herein can be applicable to automotive systems, safety-critical industrial applications, medical systems, scientific instrumentation, wireless and wired communications, radio, radar, industrial process control, audio and video equipment, current sensing, instrumentation (which can be highly precise), and other digital-processing-based systems. In the discussions of the embodiments above, components of a system, such as switches, transmission lines, ground elements, conductive planes, capacitors, and/or other components can readily be replaced, substituted, or otherwise modified in order to accommodate particular circuitry needs. Moreover, it should be noted that the use of complementary electronic devices, hardware, software, etc., offer an equally viable option for implementing the teachings of the present disclosure related to TTD phase shifters, in various communication systems. Parts of various systems for implementing TTD phase shifters as proposed herein can include electronic circuitry to perform the functions described herein. In some cases, one or more parts of the system can be provided by a processor specially configured for carrying out the functions described herein. For instance, the processor may include one or more application specific components, or may include programmable logic gates which are configured to carry out the functions describe herein. The circuitry can operate in analog domain, digital domain, or in a mixed-signal domain. In some instances, the processor may be configured to carrying out the functions described herein by executing one or more instructions stored on a non-transitory computer-readable storage medium. In one example embodiment, any number of electrical circuits of the present figures may be implemented on a board of an associated electronic device. The board can be a general circuit board that can hold various components of the internal electronic system of the electronic device and, further, provide connectors for other peripherals. More specifically, the board can provide the electrical connections by which the other components of the system can communicate electrically. Any suitable processors (inclusive of DSPs, microprocessors, supporting chipsets, etc.), computer-readable non-transitory memory elements, etc. can be suitably coupled to the board based on particular configuration needs, processing demands, computer designs, etc. Other components such as external storage, additional sensors, controllers for audio/video display, and peripheral devices may be attached to the board as plug-in cards, via cables, or integrated into the board itself. In various embodiments, the functionalities described herein may be implemented in emulation form as software or firmware running within one or more configurable (e.g., programmable) elements arranged in a structure that supports these functions. The software or firmware providing the emulation may be provided on non-transitory computer-readable storage medium comprising instructions to allow a processor to carry out those functionalities. In another example embodiment, the electrical circuits of the present figures may be implemented as stand-alone modules (e.g., a device with associated components and circuitry configured to perform a specific application or function) or implemented as plug-in modules into application specific hardware of electronic devices. Note that particular embodiments of the present disclosure may be readily included in a system on chip (SOC) package, either in part, or in whole. An SOC represents an IC that integrates components of a computer or other electronic system into a single chip. It may contain digital, analog, mixed-signal, and often RF functions: all of which may be provided on a single chip substrate. Other embodiments may include a multi-chip-module (MCM), with a plurality of separate ICs located within a single electronic package and configured to interact closely with each other through the electronic package. It is also imperative to note that all of the specifications, dimensions, and relationships outlined herein (e.g., the number of components of phase shifters shown inFIGS.1,2A-2C,3A-3C, and4-6and/or the phased array system shown inFIG.7) have only been offered for purposes of example and teaching only. Such information may be varied considerably without departing from the spirit of the present disclosure, or the scope of the appended claims. It should be appreciated that the system can be consolidated in any suitable manner. Along similar design alternatives, any of the illustrated circuits, components, modules, and elements of the present figures may be combined in various possible configurations, all of which are clearly within the broad scope of this specification. In the foregoing description, example embodiments have been described with reference to particular processor and/or component arrangements. Various modifications and changes may be made to such embodiments without departing from the scope of the appended claims. The description and drawings are, accordingly, to be regarded in an illustrative rather than in a restrictive sense. Note that with the numerous examples provided herein, interaction may be described in terms of two, three, four, or more electrical components. However, this has been done for purposes of clarity and example only. It should be appreciated that the system can be consolidated in any suitable manner. Along similar design alternatives, any of the illustrated components, modules, and elements of the FIGURES may be combined in various possible configurations, all of which are clearly within the broad scope of this Specification. In certain cases, it may be easier to describe one or more of the functionalities of a given set of flows by only referencing a limited number of electrical elements. It should be appreciated that the electrical circuits of the FIGURES and its teachings are readily scalable and can accommodate a large number of components, as well as more complicated/sophisticated arrangements and configurations. Accordingly, the examples provided should not limit the scope or inhibit the broad teachings of the electrical circuits as potentially applied to a myriad of other architectures. Note that in this Specification, references to various features (e.g., elements, structures, modules, components, steps, operations, characteristics, etc.) included in “one embodiment”, “example embodiment”, “an embodiment”, “another embodiment”, “some embodiments”, “various embodiments”, “other embodiments”, “alternative embodiment”, and the like are intended to mean that any such features are included in one or more embodiments of the present disclosure, but may or may not necessarily be combined in the same embodiments. Also, as used herein, including in the claims, “or” as used in a list of items (for example, a list of items prefaced by a phrase such as “at least one of” or “one or more of”) indicates an inclusive list such that, for example, a list of [at least one of A, B, or C] means A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Various aspects of the illustrative embodiments are described using terms commonly employed by those skilled in the art to convey the substance of their work to others skilled in the art. For example, the term “connected” means a direct electrical connection between the things that are connected, without any intermediary devices/components, while the term “coupled” means either a direct electrical connection between the things that are connected, or an indirect connection through one or more passive or active intermediary devices/components. In another example, the term “circuit” means one or more passive and/or active components that are arranged to cooperate with one another to provide a desired function. Also, as used herein, the terms “substantially,” “approximately,” “about,” etc., may be used to generally refer to being within +/−20% of a target value, e.g., within +/−10% of a target value, based on the context of a particular value as described herein or as known in the art. Numerous other changes, substitutions, variations, alterations, and modifications may be ascertained to one skilled in the art and it is intended that the present disclosure encompass all such changes, substitutions, variations, alterations, and modifications as falling within the scope of the examples and appended claims. Note that all optional features of the apparatus described above may also be implemented with respect to the method or process described herein and specifics in the examples may be used anywhere in one or more embodiments. | 71,099 |
11862865 | DETAILED DESCRIPTION Hereinafter, one embodiment of the present disclosure is described with reference to the accompanying drawings. Basic Configuration First, a basic configuration of a transmission-and-reception system of a target detection device according to this embodiment is described. FIG.1is a view illustrating a configuration of a transmission system according to a reference example. According to the configuration ofFIG.1, a transmission array10in which a plurality of transmission elements10aare lined up in a single line is used. Here, although fourteen transmission elements10aare illustrated for convenience, the number of transmission elements10ais not limited to this number. InFIG.1, the number is given for convenience to each transmission element10ain an order from the top. In this example configuration, four adjacent transmission elements10amay be considered to be one set, and sine-wave electric signals are supplied from transmission circuits20aand20bto each set. Therefore, the four transmission elements10aincluded in one set may function as one transmission area. A pitch between the sets may be more than half of the wave length of the electric signals outputted from the transmission circuits20aand20b. Therefore, the pitch of the transmission area may be more than half of the wave length of the electric signals. Thus, by setting the pitch of the transmission area (the pitch of each set) more than half of the wave length of the electric signals, a grating lobe can be transmitted from the transmission array10. The transmission circuits20aand20beach may output the sine-wave electric signal. The transmission circuits20aand20bmay output the electric signals at the same frequency. The electric signal outputted from the transmission circuit20bmay be advanced by 90° in the phase from the electric signal outputted from the transmission circuit20a. The electric signal may be supplied from the transmission circuit20ato the first and third transmission elements10aamong the four transmission elements10aincluded in one set, and the electric signal may be supplied from the transmission circuit20bto the second and fourth transmission elements10a. The electric signals supplied from the transmission circuits20aand20bto the third and fourth transmission elements10amay be inverted in the phase. The phase inversion is performed, for example, by inverting the polarities of the connections of the signal wires from the transmission circuits20aand20brelative to the transmission elements10a. Note that a phase adjusting circuit for inverting the phase may be provided. Thus, by supplying the electric signal to each transmission element10a, the electric signals may be supplied to each set of four transmission elements10awith the phase being shifted by 90° from each other. Therefore, the transmission waves may be outputted from the transmission array10so that the main lobe is eliminated and only one grating lobe appears on one side. In addition, by changing the frequency of the electric signals outputted from the transmission circuits20aand20b, the direction of the grating lobe can be changed to the arrayed direction of the transmission elements10a. Therefore, an angle between the front direction of the transmission array10and the direction of the transmission waves can be changed so that the transmission wave can scan in the direction of this angle. In this way, the transmitting direction of the transmission waves may be associated with the frequency of the electric signals. Therefore, the transmitting direction of the transmission wave can be identified based on the frequency of the reception signal generated by reception by a receiver of a reflection wave corresponding to the transmission wave. That is, a direction of a target object which caused the reflection wave may be identified with the frequency of the reception signal. Note that, although in the above, the phase shift between the transmission elements10ais set as 90°, the phase shift is not limited to this angle. For example, even if the phase shift between the transmission elements10ais set as 60° or 45°, the main lobe can still be eliminated and only one grating lobe still appears on one side. For example, if the phase shift is set as 60°, six transmission elements10amay be considered to be one set, and the electric signals at the phases of 0°, 60°, 120°, 180°, 240°, and 300° may be supplied to the six transmission elements10aof each set. Moreover, if the phase shift is set as 45°, eight transmission elements10amay be considered to be one set, and the electric signals at the phases of 0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315° may be supplied to the eight transmission elements10aof each set. Also in these cases, by changing the frequency of the electric signal, the direction of the grating lobe can be changed to the arrayed direction of the transmission elements10a, and therefore the transmitting direction of the transmission wave can be changed. Since only one grating lobe scans in the configuration ofFIG.1, a scan range of the transmission wave may be narrow. Therefore, in this embodiment, by supplying a plurality of sets of electric signals with different phase shifts to the plurality of transmission elements10a, a plurality of grating lobes with different directions may be produced. In addition, by changing the frequency of the electric signals of each set, the transmitting direction may be changed for each grating lobe to allow the grating lobe to scan. Thereby, the entire scan range can be expanded. FIG.2is a view illustrating a configuration of a transmission system according to this embodiment. Note that examples of a plurality of angles inFIG.2illustrates phases of the electric signals supplied through the signal wires, when the phase of the electric signal (sine wave) outputted from a transmission circuit21ais 0°. In the example configuration ofFIG.2, a transmission array11in which 72 transmission elements11aare lined up in a single line at equal interval is used. Note that the number of transmission elements11ais not limited to 72. InFIG.2, for convenience, the number is given to each transmission element11ain an order from the top. The 72 transmission elements11amay be grouped conforming to a first grouping configuration and a second grouping configuration. In the first grouping configuration, the 72 transmission elements11amay be grouped into a plurality of groups GR1each having four transmission elements11a. Moreover, in the second grouping configuration, the 72 transmission elements11amay be grouped into a plurality of groups GR2each having six transmission elements11a. Therefore, the 72 transmission elements11aused for the first grouping configuration may be the same as the 72 transmission elements11aused for the second grouping configuration. That is, the common transmission elements11amay be used for the first grouping configuration and the second grouping configuration. Then, a first set of electric signals in which the phase shift is carried out by 90° may be inputted to each group GR1of the first grouping configuration, and a second set of electric signals in which the phase shift is carried out by 60° may be inputted to each group GR2of the second grouping configuration. That is, the plurality of electric signals included in the first group may have the equal phase shift between the electric signals (90° phase shift), and the plurality of electric signals included in the second group may have the equal phase shift between the electric signals (60° phase shift). The electric signals outputted from transmission circuits21aand21bmay be supplied to the transmission elements11aof the group GR1. A pitch of the group GR1may be more than half of the wave length of the electric signals outputted from the transmission circuits21aand21b. The transmission circuits21aand21bmay output the sine-wave electric signal with the 90° phase shift, similar to the transmission circuits20aand20bofFIG.1. The electric signals outputted from the transmission circuits21aand21bmay be converted into two routes of electric signals by a phase adjusting circuit23. The electric signal of the first route with “+” inFIG.2among the electric signals of the two routes may be an electric signal at the same phase as the electric signals outputted from the transmission circuits21aand21b, and the electric signal of the second route with “−” may be an electric signal at the inverted phase of the electric signals outputted from the transmission circuits21aand21b. The electric signal of each route may be inputted into a corresponding mixing circuit24. The electric signals outputted from transmission circuits22a-22cmay be supplied to the transmission elements11aof the group GR2. A pitch of the group GR2may be more than half of the wave length of the electric signals outputted from the transmission circuits22a-22c. The transmission circuits22a-22cmay output the sine-wave electric signals with 60° phase shift. The electric signals outputted from the transmission circuits22a-22cmay be converted into two routes of electric signals by the phase adjusting circuit23similarly to the above. The electric signal of the first route with “+” inFIG.2among the electric signals of the two routes may be an electric signal at the same phase as the electric signals outputted from the transmission circuits22a-22c, and the electric signal of the second route with “−” may be an electric signal at the inverted phase of the electric signals outputted from the transmission circuits22a-22c. The electric signal of each route may be inputted into the corresponding mixing circuit24. FIG.3Ais a view illustrating a configuration of the phase adjusting circuit23. The phase adjusting circuit23may be comprised of a transformer where one coil23ais disposed at the input side and two coils23band23care disposed at the output side. The two coils23band23cat the output side may be mutually reversed in the winding direction. The electric signal outputted from any of the transmission circuits21a,21b, and22a-22cmay be inputted into the coil23aat the input side. The electric signal at the same phase as the inputted electric signal may be outputted from one coil23bat the output side by electromagnetic induction. This electric signal may be the electric signal of the first route. The other coil23cat the output side may be reversed in the winding direction from one coil23b. Therefore, from the other coil23c, the electric signal at the inverted phase of the electric signal inputted into the coil23amay be outputted. This electric signal may be the electric signal of the second route. In this way, the two routes of electric signals with the mutually inverted phases may be outputted from the phase adjusting circuit23. The phase adjusting circuit23is not limited to have the configuration ofFIG.3A, and may have other configurations as long as it can generate the two routes of the electric signals comprised of the electric signal at the same phase as the electric signals outputted from the transmission circuits21a,21b, and22a-22c, and the electric signal at the inverted phase. Returning toFIG.2, the frequencies of the electric signals outputted from the transmission circuits21aand21bmay be mutually the same. The transmission circuits21aand21bmay switch the frequency of the electric signal according to a first frequency table. For example, frequencies of 95, 100, 105, 110, 120, 130, and 145 kHz are assigned to the first frequency table. The transmission circuits21aand21bmay cyclically switch the frequency of the electric signal in the order of the frequencies assigned to the first frequency table. Moreover, the frequencies of the electric signals outputted from the transmission circuits22a-22cmay be mutually the same. The transmission circuits22a-22cmay switch the frequency of the electric signal according to a second frequency table. The frequencies assigned to the second frequency table may be different from the frequencies assigned to the first frequency table. For example, frequencies of 115, 125, 135, and 150 kHz are assigned to the second frequency table. The transmission circuits22a-22cmay cyclically switch the frequency of the electric signal in the order of the frequencies assigned to the second frequency table. FIG.3Bis a view illustrating a configuration of the mixing circuit24. The mixing circuit24may be comprised of a transformer where two coils24aand24bare disposed at the input side and one coil24cis disposed at the output side. The two coils24aand24bat the input side may be the same in the winding direction. The electric signals of the first set and the second set may be inputted to the two coils24aand24bfrom the corresponding phase adjusting circuit23. The electric signals inputted into the coils24aand24bat the input side may be mixed with each other by electromagnetic induction, and may be outputted from the coil24cat the output side. The outputted electric signal may include each frequency component of the two inputted electric signals. Note that, although in the configuration ofFIG.2the phases of the electric signals outputted from the transmission circuits21a,21b, and22a-22care inverted by the phase adjusting circuit23, the phases of the electric signals may be inverted by connecting the transmission circuits21a,21b, and22a-22cwith the coils24aand24bso that currents flowing through the coils24aand24bnormally become in the opposite direction to each other. That is, the output lines of the transmission circuits21a,21b, and22a-22cmay be branched into two routes, one of the output lines may be connected to one of the coils24aand24bin the normal connecting form, and the other output line may be connected to the other coil in the form where current flows in the direction opposite from the normal connecting form. In this case, the phase adjusting circuit23may be omitted. The mixing circuit24is not limited to have the configuration ofFIG.3B, and it may have other configurations, as long as the two routes of electric signals are mixed on each other so that the frequency components of the two electric signals are included. Returning toFIG.2, the number of mixing circuits24(here, twelve) may be the least common multiple of the number of transmission elements11aincluded in the group GR1(here, four) and the number of transmission elements11aincluded in the group GR2(here, six). The electric signals outputted from the twelve mixing circuits24may be inputted into twelve transmission elements11awhich are continuously lined up, respectively. InFIG.2, the electric signals outputted from the twelve mixing circuits24may be inputted into the 1st to 12th transmission elements11a, the 13th to 24th transmission elements11a, the 25th to 36th transmission elements11a, the 37th to 48th transmission elements11a, the 49th to 60th transmission elements11a, and the 61th to 72nd transmission elements11a. Here, different frequencies may be applied to the first set of electric signals inputted into the transmission elements11aof the group GR1(i.e., the electric signals with the 90° phase shift outputted from the transmission circuits21aand21b) and the second set of electric signals inputted into the transmission elements11aof the group GR2(i.e., the electric signals with the 60° phase shift outputted from the transmission circuits22a-22c) based on the first frequency table and the second frequency table. Therefore, even if these electric signals are mixed and inputted into the transmission elements11a, the grating lobe may be individually formed by the electric signals of each set. Therefore, by inputting the electric signals into the 72 transmission elements11aas described above, the grating lobe based on the first set of electric signals with the 90° phase shift may be formed based on the transmission elements11aof the group GR1, and the grating lobe based on the second set of electric signals with the 60° phase shift may be formed based on the transmission elements11aof the group GR2. Then, by changing the frequency of the electric signals of each set according to the corresponding frequency table, each grating lobe can be allowed to scan in the arrayed direction of the transmission elements11a. FIGS.4A to8Bare graphs, each illustrating a simulation result of the direction in which the grating lobe occurs calculated by simulation. InFIGS.4A to8B, the horizontal axis is an angle with the front direction of the transmission array11, and the vertical axis is an intensity of the transmission wave transmitted from the transmission array11. The arrayed direction of the transmission elements11amay be ±90° in the horizontal axis. In this simulation, the pitch of the transmission elements11amay be set as 4.35 mm. The number of transmission elements11amay be set as 72, similarly to the above. Moreover, the first set and the second set of electric signals may be changed to the respective frequencies assigned to the first frequency table and the second frequency table. Moreover, the phase of the electric signal applied to each transmission element11amay be set similar toFIG.2. FIGS.4A to6Care simulation results when applying the first set of electric signals at the frequencies of 95, 100, 105, 110, 120, 130, and 145 kHz to the transmission elements11aof the group GR1. Moreover,FIGS.7A to8Bare simulation results when applying the second set of electric signals at the frequencies of 115, 125, 135, and 150 kHz to the transmission elements11aof the group GR2. As illustrated inFIGS.4A to6C, when the electric signals at the frequencies of 95, 100, 105, 110, 120, 130, and 145 kHz are applied to the transmission elements11aof the group GR1, the grating lobe may occur near different angles D11, D12, D13, D14, D15, D16, and D17. The six grating lobes may cover a range of −65° to −35° in general. Therefore, by changing the frequency of the electric signals applied to the transmission elements11aof the group GR1as described above, the grating lobe occurring from the transmission elements11aof the group GR1can be allowed to scan the range of −65° to −35°. Moreover, as illustrated inFIGS.7A to8B, when the electric signals at the frequencies of 115, 125, 135, and 150 kHz are applied to the transmission elements11aof the group GR2, the grating lobe may occur near different angles D21, D22, D23, and D24. The four grating lobes may cover the range of −30° to −23° in general. Therefore, by changing the frequency of the electric signals applied to the transmission elements11aof the group GR2as described above, the grating lobe occurring from the transmission elements11aof the group GR2can be allowed to scan the range of −30° to −23°. As described above, under the simulation condition described above, the grating lobe formed by the transmission elements11aof the group GR1can cover the angle range of about 30° (−65° to −35°), the grating lobe formed by the transmission elements11aof the group GR2can cover the angle range of about 7° (−30° to −23°). Therefore, adding up the angle ranges of the groups GR1and GR2, the two grating lobes can cover the angle range of about 42° (−65° to −23°). That is, an angle of visibility of 42° can be realized. FIG.9is a view schematically illustrating a range covered by a transmission beam. InFIG.9, a transmission beam TB1may correspond to the grating lobe formed by the transmission elements11aof the group GR1, and a transmission beam TB2may correspond to the grating lobe formed by the transmission elements11aof the group GR2. By changing the frequency of the first set of electric signals supplied to the transmission elements11aof the group GR1within a range of fa to fb, the transmission beam TB1may scan within a range of an angle θ01. Moreover, by changing the frequency of the second set of electric signals supplied to the transmission elements11aof the group GR2within a range of fc to fd, the transmission beam TB2may scan within a range of an angle θ02. Therefore, the transmission beams TB1and TB2can scan the total range (an angle θ0) of the angle θ01and the angle θ02. In the above simulation, the varying range (fa-fb) of the frequency of the first set of electric signals and the varying range (fc-fd) of the frequency of the second set of electric signals are 95 to 145 kHz and 115 to 150 kHz, respectively, the angles θ01and θ02are 30° and 7°, respectively, and the angle θ0is 42°. Note that although in the above configuration and simulation ofFIG.2the phase shift of the first set of electric signals is set as 90° and the phase shift of the second set of electric signals is set as 60°, the phase shift of the second set of electric signals may be set as 45°. In this case, the number of transmission elements11aincluded in the group GR2may be changed according to the change in the number of combinations of the electric signals accompanying the change in the phase shift. Alternatively, the phase shift of the first set of electric signals may be set as 45°. Also in this case, the number of transmission elements11aincluded in the group GR1is changed according to the change in the number of combinations of the electric signals accompanying the change in the phase shift. Moreover, the change in the frequencies of the first set and the second set of electric signals is not limited to the above example, and the frequencies may suitably be changed according to the ranges of the angles θ01and θ02. FIG.10is a view schematically illustrating an example configuration of the transmission-and-reception system. In this example configuration, a reception array31having a plurality of reception elements31amay be provided as a reception system, in addition to the configuration of the transmission system illustrated inFIG.2. The transmission system may be provided with the transmission array11, similar toFIG.2. The transmission array11may be disposed along the X-axis. The reception array31may be disposed immediately above the transmission array11. In this example configuration, the arrayed direction of the reception elements31amay be perpendicular to the arrayed direction of the transmission elements11a. By driving the transmission elements11ain the transmission array11by the method illustrated with reference toFIG.2, a transmission beam TB0may be formed forward of the transmission array11(positive in the Z-axis). Here, the total range of the scan ranges of the transmission beams TB1and TB2illustrated inFIG.9is illustrated as a scan range of the transmission beam TB0. By performing a phase control (beamforming) to the reception signal outputted from each reception element31a, a narrow reception beam RB0may be formed in the circumferential direction centering on the X-axis. Thus, the reception signals in an area where the reception beam RB0and the transmission beam TB0cross may be extracted. According to the phase control, by turning the reception beam RB0in a θ1direction centering on the X-axis, the reception signal at each turning position may be extracted. The turning position of the reception beam RB0may define an incoming direction of the reflection wave in the horizontal direction (θ1direction), of which the transmission wave is reflected on a target object. Moreover, as described with reference toFIG.9, an incoming direction of the reflection wave in a vertical direction (θ0direction) may be defined based on the frequency of the reception signal. Therefore, among the reception signals extracted by the reception beam RB0, the reception signals at the frequencies of the first set and the second set of electric signals may be extracted. In a direction defined by the angle in the vertical direction (an angle in the θ0direction) corresponding to the extracted frequency and the angle in the horizontal direction (an angle in the θ1direction) based on the beamforming, by plotting data based on the intensity of the reception signal at a distance position based on a delay time of the reflection wave, a distribution of intensity data of the reception signals in the range where the reception beam RB0intersects with the transmission beam TB0may be acquired. Then, by turning the reception beam RB0within a detection range in the horizontal direction and acquiring the distribution of the intensity data at the respective turning positions, the intensity data (volume data) which distribute three-dimensionally in all the detection range in the horizontal direction and the vertical direction can be acquired. By imaging the intensity data (volume data), an image indicative of a state of target object(s) in the detection range can be obtained. Concrete Configuration FIG.11is a block diagram illustrating a concrete configuration of the target detection device1. The target detection device1may be provided with the transmission array11as the transmission system. The transmission array11may have the same configuration asFIG.2. The target detection device1may include a signal generator111and a transmission amplifier112, as a configuration for supplying a transmission signal S1to each transmission element11aof the transmission array11. The signal generator111may have the same configuration as the circuitry illustrated inFIG.2. According to the configuration ofFIG.11, the transmission amplifier112for amplifying the electric signal (transmission signal S1) outputted from the mixing circuit24ofFIG.2and supplying it to each transmission element11amay further be provided. Note that the transmission amplifier may be disposed between the transmission circuits21a,21b, and22a-22cofFIG.2, and the phase adjusting circuit23. The controller101may include an arithmetic processing circuit, such as a CPU (Central Processing Unit), and a storage media, such as a ROM (Read Only Memory), a RAM (Random Access Memory), and a hard disk drive. The controller101may be comprised of an integrated circuit, such as a FPGA (Field-Programmable Gate Array). The controller101may cause the transmission circuits21a,21b, and22a-22cillustrated inFIG.2to output the electric signals at the frequencies according to the first frequency table and the second frequency table. Thus, as illustrated with reference toFIG.9, the transmission beams TB1and TB2may be transmitted from the transmission array11. As described above, the transmission beams TB1and TB2may scan the ranges of the angles θ01and θ02by sequentially changing the frequencies of the first set and the second set of electric signals according to the first frequency table and the second frequency table, respectively. Therefore, the transmission beam TB0ofFIG.10may be formed. The target detection device1may be provided with the reception array31described above, as the reception system. The reception array31may have the same configuration asFIG.10. In the reception array31, “m” reception elements31amay be disposed. The reception signals may be outputted from the reception elements31ato the corresponding channels CH1-CHm. The target detection device1may include a plurality of reception processing modules121, a plurality of A/D conversion parts122, a reception signal processing module123(which may also be referred to as processing circuitry), and an image signal processing module124, as a configuration for processing the reception signal outputted from each reception element31aof the reception array31and generating a detection image. The plurality of reception processing modules121may be connected to the channels CH1-CHm, respectively. Each reception processing module121may perform processing for removing an unnecessary band from the inputted reception signal, processing for amplifying the reception signal to a level suitable for A/D conversion, and processing for removing a signal component at a band more than half of a sampling period of the A/D conversion. The plurality of A/D conversion parts122may be associated with the plurality of reception processing modules121, respectively. Each A/D conversion part122may convert the analog reception signal inputted from the corresponding reception processing module121into a digital signal at a given sampling period. The reception signal processing module123may process the reception signals of the channels CH1-CHm inputted from the plurality of A/D conversion parts122, respectively, to calculate the intensity data of the reception signals distributed three-dimensionally over the detection range (volume data). The reception signal processing module123may be comprised of a single integrated circuit (FPGA etc.) together with the controller101. The image signal processing module124may process the intensity data (volume data) inputted from the reception signal processing module123and generate the image data for imaging the state of the target object in the detection range. The image signal processing module124is comprised of a CPU, for example. A display unit125may be comprised of a monitor, and display the detection image according to the image data inputted from the image signal processing module124. FIG.12Ais a functional block diagram illustrating an example configuration of the reception signal processing module123. The reception signal processing module123may include an arithmetic processing circuit and a storage medium. The reception signal processing module123may perform a function of each functional block illustrated inFIG.12Aaccording to a program stored in the storage medium. A part of the functions ofFIG.12Amay be implemented by hardware instead of software. The reception signal processing module123may include a plurality of digital filters201, a buffer202, a plurality of band-pass filters203, and a plurality of beam synthesizing parts204. The plurality of digital filters201may be provided corresponding to the plurality of A/D conversion parts122ofFIG.11. The digital filter201may be a filter sharper than the filtering function of the reception processing module121ofFIG.11, and remove signals of unnecessary bands in the reception signal. The buffer202may temporarily hold the reception signals of the channels CH1-CHm outputted from the plurality of digital filters201. The buffer202may hold the reception signals while the frequencies of the electric signals outputted from the transmission circuits21a,21b, and22a-22care changed into all the frequencies assigned to the first frequency table and the second frequency table (hereinafter, “the reception signals for one scan”), chronologically for a plurality of scans. The buffer202may sequentially supply the reception signals for one scan to the plurality of band-pass filters203, respectively. The buffer202may eliminate the reception signals for one scan, when the reception signals for that one scan are supplied to the plurality of band-pass filters203. The plurality of band-pass filters203may extract the frequency components (frequency reception signals) at frequencies F1-Fn from the reception signals for one scan of the inputted channels CH1-CHm, respectively. The frequencies F1-Fn may correspond to the frequencies assigned to the first frequency table and the second frequency table. The number of band-pass filter203provided may be the total number of frequencies assigned to the first frequency table and the second frequency table. The reception signal at each frequency assigned to the first frequency table and the second frequency table may be extracted by each band-pass filter203. Each band-pass filter203may extract the frequency component (frequency reception signal) at the frequency Fk set in itself from the reception signals for one scan of the channels CH1-CHm, and supply it to the beam synthesizing part204. The plurality of beam synthesizing parts204may be provided corresponding to the plurality of band-pass filters203. The beam synthesizing part204may form the reception beam RB0by the beamforming based on the phase control, and separate the frequency reception signal in the θ1direction ofFIG.10at a given resolution. Thus, the frequency reception signal in the area where the reception beam RB0intersects with the transmission beam TB1or TB2ofFIG.9defined by the band-pass filter203, may be acquired. That is, from the top beam synthesizing part204, the frequency reception signal in the crossing area where the transmission beam (either the transmission beams TB1or TB2) at the angle θ0direction (seeFIG.9) corresponding to the frequency F1intersects with the reception beam RB0in each direction parallel to the horizontal surface (the θ1direction ofFIG.10), may be acquired. The acquired frequency reception signal may change in the intensity on the time axis according to the intensity of the reflection wave from the crossing area. This time axis may correspond to a distance from the reception array31in the crossing area. Therefore, by mapping each intensity on the time axis at the corresponding distance position from the reception array31in the crossing area, the distribution of the intensity data on the crossing area may be acquired. Thus, by integrating the distributions of the intensity data per direction, outputted from the beam synthesizing parts204, the volume data where the intensity data is distributed three-dimensionally over the detection range may be acquired. FIG.12Bis a functional block diagram illustrating another example configuration of the reception signal processing module123. In this example configuration, the band-pass filter203in the example configuration ofFIG.12Amay be replaced by an FFT (Fast Fourier Transform)211and a frequency extracting part212. The FFT211may calculate frequency spectrum from the reception signals for one scan of the channels CH1-CHm. The frequency extracting part212may extract the frequency components (frequency reception signals) at the frequencies F1-Fn from the frequency spectrum of each channel calculated by the FFT211, and supply them to the beam synthesizing part204. Processing of the beam synthesizing part204may be the same asFIG.12A. Also according to this configuration, by integrating the distributions of the intensity data per direction, outputted from the beam synthesizing parts204, the volume data where the intensity data is distributed three-dimensionally over the detection range may be acquired, similar to the configuration ofFIG.12A. Note that, in the example configuration ofFIG.12B, the frequencies at which the frequency reception signals are extracted can be set more finely than the example configuration ofFIG.12A. Therefore, when the number of the plurality of frequencies assigned to the first frequency table and the second frequency table is large, or when these frequencies are close to each other, it is advantageous to use the configuration ofFIG.12B. FIGS.13A and13Bare flowcharts illustrating the transmission processing performed by the controller101ofFIG.11. This processing may be continuously performed during the detection operation, and be ended according to a termination of the detection operation. The processings ofFIGS.13A and13Bmay be performed in synchronization with each other. FIG.13Ais a flowchart illustrating the transmission processing to the transmission elements11aof the group GR1. The controller101may set the electric signals outputted from the transmission circuits21aand21bat the first frequency assigned to the first frequency table (S111), and cause the transmission circuits21aand21bto output the electric signals for a given period (S112). Thus, through the mixing circuit24, the first set of electric signals may be inputted into the transmission elements11aof the group GR1(S113), and the grating lobe (transmission beam TB1) based on the first set of electric signals may be transmitted from the transmission array11. Then, the controller101may wait for the lapse of the given period of the electric signal (S114: NO). When the given period passes and the next transmission timing comes (S114: YES), the controller101may return the processing to Step S111, set the electric signals outputted from the transmission circuits21aand21bat the second frequency assigned to the first frequency table, and perform similar processing. Thus, the transmitting direction of the grating lobe (transmission beam TB1) may change in the angle001direction ofFIG.9. The controller101may repeat similar processing until the final frequency assigned to the first frequency table is applied to the transmission circuits21aand21b(S115: NO). Therefore, the transmitting direction of the grating lobe (transmission beam TB1) may be changed within the range of the angle θ01ofFIG.9, and the range of the angle θ01may be scanned by the grating lobe (transmission beam TB1). Thus, when all the frequencies assigned to the first frequency table are applied to the transmission circuits21aand21band the transmission beam TB1for one scan is transmitted (S115: YES), the controller101may end the processing. In this way, after the final transmission for one scan is performed, the controller101suspends the transmission until a reception period, corresponding to the transmission, ends. Then, when the reception period ends, the controller101may again perform the processing ofFIG.13Ato perform the transmission for the next scan. In this way, the controller101may cause the transmission array11to transmit the grating lobe (transmission beam TB1) while cyclically changing the frequency applied to the transmission circuits21aand21bbased on the frequencies assigned to the first frequency table. Therefore, the range of the angle θ01ofFIG.9may be repeatedly scanned by the transmission beam TB1. FIG.13Bis a flowchart illustrating the transmission processing to the transmission elements11aof the group GR2. The controller101may set the electric signals outputted from the transmission circuits22a-22cat the first frequency assigned to the second frequency table (S121), and cause the transmission circuits22a-22cto output the electric signals for a given period (S122). Therefore, through the mixing circuit24, the second set of electric signals may be inputted into the transmission elements11aof the group GR2(S123), and the grating lobe (transmission beam TB2) based on the second set of electric signals may be transmitted from the transmission array11. Then, similar toFIG.13A, the controller101may repeatedly perform the processing at Steps S121-S124until the final frequency assigned to the second frequency table is applied to the transmission circuits22a-22c(S125: NO). Moreover, when the reception period for the final transmission for one scan ends, the controller101may again perform the processing ofFIG.13Bto repeat similar transmission processing. Thus, the grating lobe (transmission beam TB2) may be transmitted from the transmission array11, while the frequency applied to the transmission circuits22a-22cis cyclically changed based on the frequencies assigned to the second frequency table. In this way, the range of the angle θ02ofFIG.9may be scanned by the grating lobe (transmission beam TB2). Note that since in this embodiment the number of frequencies assigned to the second frequency table is less than the number of frequencies assigned to the first frequency table, the period during which all the frequencies are applied to each transmission circuit may become shorter in the processing ofFIG.13Bthan the processing ofFIG.13A, if the switching timings at Steps S114and S124are the same. Therefore, the controller101may adjust the switching timings at Step S114and S124so that the period during which all the frequencies are applied to each transmission circuit is the same in the processing ofFIG.13Aand the processing ofFIG.13B. Alternatively, after the processing ofFIG.13Bfor one scan ends, the controller101may suspend the processing ofFIG.13Buntil the processing ofFIG.13Ais performed for one scan, and after the processing ofFIG.13Afor one scan is finished, the controller101may start the processing for the next scan ofFIG.13Bat the timing where the final reception period is ended. Therefore, the reception signals for one scan to each processing can be acquired for every fixed period. FIG.14is a flowchart illustrating processing for processing the reception signals and displaying the detection image. This processing may be continuously performed during the detection operation, and be ended according to the termination of the detection operation. The reception signals for one scan may be supplied to the plurality of band-pass filters203from the buffer202(S201). Each band-pass filter203may extract the frequency component (frequency reception signal) at the frequency set in itself from the inputted reception signals of each channel, and supply it to the corresponding beam synthesizing part204(S202). The beam synthesizing part204may extract the signal component in each horizontal direction (θ1direction) by beamforming from the inputted frequency components (frequency reception signals) (S203). Thus, the distribution of the intensity data where the intensity data of the reception signal may be mapped in the range where the transmitting direction defined by each frequency intersects with each direction of the beamforming is acquired. The reception signal processing module123may integrate the intensity data from all the beam synthesizing parts204, and form the volume data where the intensity data is distributed three-dimensionally over the detection range (S204). The reception signal processing module123may supply the volume data to the image signal processing module124. The image signal processing module124may process the volume data to generate the image data for displaying the detecting situation of the target object(s) in the detection range, and supply the generated image data to the display unit125(S205). The display unit125may display the image based on the inputted image data (S206). Therefore, the detecting situation of the target object(s) for one scan in the detection range may be displayed. In this way, the processing for one scan may end. Then, the processing ofFIG.14may be repeated and the detection image for the subsequent scan may be displayed on the display unit125. FIG.15is a view schematically illustrating a configuration of the target detection device1when it is used as a sonar which detects an underwater target object. A transducer300may be installed on the bottom of a ship2. The transducer300may include the transmission array11and the reception array31. The transmission array11may transmit the transmission wave underwater by the processing described above. Here, an acoustic wave (e.g., an ultrasonic wave) may be transmitted as the transmission wave. Therefore, the transmission beams TB1and TB2may be scanned in the range of the angle θ0parallel to the vertical plane. Configurations ofFIG.11other than the transmission array11, the reception array31, and the display unit125may be provided to a control device installed in a control room2aof the ship2. The display unit125may be installed in the control room2a, separately from the control device. The display unit125may also be integrally provided with the control device. According to this configuration, the detection image indicative of a situation of a seabed3and a school of fish4may be displayed on the display unit125. Therefore, a user can grasp the underwater situation. Note that four transducers300which are directed forward, rearward, leftward, and rightward may be installed on the bottom of the ship. In this case, the configurations of the transmission system and the reception system ofFIG.11may be prepared for every transducer300. Thus, the detection image of all directions from the ship can be displayed on the display unit125. Moreover, if the target detection device1is used as a radar which detects a target object in the air, the transducer400may be installed in an upper part of a control room2a, for example. The transducer400may include the transmission array11and the reception array31. The transmission array11may transmit the transmission wave in the air by the processing described above. Here, a radio wave may be transmitted as the transmission wave. The configuration of the circuitry may be installed in the control room2a, similar to the case of the sonar. According to this configuration, the detection image indicative of a situation of an obstacle and a flock of birds may be displayed on the display unit125. Therefore, the user can grasp the situation in the air. Note that the transducer400may be installed on each of front, rear, right, and left side surfaces of the control room2a. In this case, the configuration of the transmission system and the reception system ofFIG.11may be prepared for every transducer400. Therefore, the detection image of a space all around the ship can be displayed on the display unit125. Effects of Embodiment According to this embodiment, the following effects may be demonstrated. The grating lobe transmitted from the transmission elements11agrouped conforming to the first grouping configuration (group GR1), and the grating lobe transmitted from the transmission elements11agrouped conforming to the second grouping configuration (group GR2) can be differentiated in the transmitting direction. Therefore, a plurality of the transmission beams (grating lobes) with different transmitting directions can be transmitted by the single transmission array11. Therefore, the target object can be smoothly detected by the simple configuration. Moreover, since the common transmission elements11aare used for the first grouping configuration and the second grouping configuration, it may not be necessary to separately prepare the transmission elements11afor each of the first grouping configuration and the second grouping configuration. Therefore, the configuration of the transmission array11can be simplified, and the cost can be reduced. Moreover, since the spacing or interval of the transmission elements11ais constant, the grating lobes can appear smoothly in the given transmitting directions by adjusting the phases of the first set and the second set of electric signals. Moreover, as illustrated inFIG.2, since the mixing circuit24, which mixes the electric signal of the first set and the electric signal of the second set and inputs the mixed electric signal into the corresponding transmission element11a, may be provided, the grating lobe (transmission beam TB1) based on the first set of electric signals and the grating lobe (transmission beam TB2) based on the second set of electric signals can be transmitted simultaneously, as illustrated inFIG.9. Therefore, the target object over the detection range can be promptly detected. Moreover, the frequencies of the first set of electric signals assigned to the first frequency table may differ from the frequencies of the second set of electric signals assigned to the second frequency table. Thus, the reception signal processing module123illustrated inFIG.11can extract the reception signals based on the grating lobe of the first set of electric signals and the reception signals based on the grating lobe of the second set of electric signals according to the frequencies. Therefore, even if the two grating lobes are simultaneously transmitted by the mixing of the electric signals by the mixing circuit24, the reception signal processing module123can appropriately extract the reception signals based on each grating lobe, and can smoothly detect the target object which exists in the direction of each grating lobe. As illustrated inFIGS.13A and13B, the signal generator111may change the frequencies of the first set of electric signals according to the first frequency table, and change the frequencies of the second set of electric signals according to the second frequency table. Thus, by changing the frequencies in this way, the transmitting directions of the grating lobes based on the electric signals of the first set and the second set can be changed, as illustrated in the simulation results. Therefore, these grating lobes can each scan the given angle range and can extend the detection range of the target object. As illustrated with reference toFIGS.12A and12B, the reception signal processing module123may extract the reception signals based on the reflection waves of the grating lobe based on the frequency components of the reception signals. Therefore, the reception signals based on each grating lobe transmitted from the transmission array11can be acquired properly. Therefore, the target object can be detected properly based on the reception signals. As illustrated inFIG.10, the reception array31may be different than the transmission array11. The reception array31may include the plurality of reception elements31a, and the reception beam generated based on the reception signal produced from each reception element31amay intersect with the transmission beam generated by the transmission array11. According to this configuration, the distribution of the intensity data based on the intensities of the reflection waves can be calculated in the range where the reception beam RB0and the transmission beam TB0(grating lobe) cross. Therefore, by changing the orientation of the reception beam RB0by the beamforming within the detection range, the intensity data of the reflection waves distributed three-dimensionally over the detection range can be formed. Modification 1 In the above embodiment, as illustrated inFIG.2, the two routes of electric signals may be mixed by the mixing circuit24and inputted into the corresponding transmission elements11a. However, as illustrated inFIG.16, the electric signal inputted into the transmission element11amay be switched in a time-divided manner between the two routes of electric signals. According to such a configuration, while one frequency is applied to the transmission circuits21a,21b, and22a-22c, a switching circuit25may be switched so that the first set of electric signals and the second set of electric signals at the frequency are supplied to the transmission element11ain the time-divided manner. According to this configuration, the transmission beams TB1and TB2illustrated inFIG.9are not transmitted simultaneously, but are alternately transmitted according to the switching of the switching circuit25. Also according to this configuration, by changing the frequency applied to the transmission circuits21a,21b, and22a-22caccording to the first frequency table and the second frequency table, the transmission beams TB1and TB2can scan the ranges of the angles θ01and θ02, similar to the above embodiment. Therefore, it is not necessary to provide a plurality of transmission arrays11, and the target object can be detected with the simple configuration. However, according to this configuration, since the transmission beams TB1and TB2are not transmitted simultaneously but are alternately transmitted according to the switching of the switching circuit25, a period of the transmission beams TB1and TB2scanning the ranges of the angles θ01and θ02may become longer. Therefore, in order to scan more promptly, it is desirable to mix the two routes of electric signals by the mixing circuit24and supply it to the transmission element11asimilarly to the above embodiment. Note that, in the configuration ofFIG.16, the switching circuit25may be comprised of a switching circuit using a multiplexer or a transistor. However, the configuration of the switching circuit25is not limited to this. For example, an electromagnetically driven mechanical switch may be used as the switching circuit25. Note that, according to the configuration of Modification 1, since the first set of electric signals and the second set of electric signals may be inputted in the time-divided manner to the transmission elements11aof the group GR1and the transmission elements11aof the group GR2, the transmission beams TB1and TB2(grating lobe) ofFIG.9may be transmitted in the time-divided manner. Therefore, the reception signal processing module123ofFIG.11may not need to be provided with the configuration for extracting the reception signals based on the first set of electric signals and the reception signals based on the second set of electric signals according to the frequency. The reception signal processing module123may identify the transmitting directions of the transmission beams TB1and TB2according to the transmission timings of the transmission beams TB1and TB2. In this case, for example, the controller101may output the frequency of the transmission beam transmitted at each transmission timing to the reception signal processing module123, and the reception signal processing module123may identify the transmitting directions of the transmission beams TB1nd TB2based on the inputted frequencies. Alternatively, the controller101may transmit to the reception signal processing module123other information from which the transmitting directions of the transmitted transmission beams TB1and TB2can be identified, at each transmission timing, and the reception signal processing module123may identify the transmitting directions of the transmitted transmission beams TB1and TB2based on this information. Modification 2 In the above embodiment, the electric signals at different phases may be inputted to the plurality of transmission elements11awhich constitute the group GR1and the group GR2. However, in Modification 2, the electric signals at the same phase may be inputted to a given number of transmission elements11aamong the plurality of transmission elements11awhich constitute the group GR1and the group GR2. FIG.17is a view illustrating a configuration of a transmission system according to Modification 2. As illustrated inFIG.17, in the first grouping configuration, the group GR1may be comprised of six transmission elements11a, and in the second grouping configuration, the group GR2may be comprised of eight transmission elements11a. The electric signals of the first set at 0° phase may be inputted into three adjacent transmission elements11aamong the six transmission elements11awhich constitute the group GR1, and the first set of electric signals at 180° phase may be inputted into other three adjacent transmission elements11a. Moreover, the second set of electric signals at 0° phase may be inputted into four adjacent transmission elements11aamong the eight transmission elements11awhich constitute the group GR2, and the second set of electric signals at 180° phase may be inputted into other four adjacent transmission elements11a. The electric signals of the first set and the second set may be inputted into the 25th and subsequent transmission elements11aso that similar phase pattern as the 1st to 24th transmission elements11ais repeated. According to the configuration of Modification 2, two kinds of electric signals with different phases may be inputted to the six transmission elements11aincluded in the group GR1. That is, the number (six) of transmission elements11aincluded in the group GR1may be a multiple (three times) of the number (two) of kinds of electric signals of the first set. Moreover, two kinds of electric signals with different phases may be inputted to the eight transmission elements11aincluded in the group GR2. That is, the number (eight) of transmission elements11aincluded in the group GR2may be a multiple (four times) of the number (two) of kinds of electric signals of the second set. Note that, also in the above embodiment, the numbers of transmission elements11aincluded in the group GR1and the group GR2(four and six respectively) are multiple (1 time) of the numbers of kinds of electric signals of the first set and the second set (four and six respectively). Therefore, the number “p” of transmission elements11ain the group GR1may be a multiple of the number of kinds of electric signals of the first set; and the number “q” of transmission elements11ain the group GR2may be a multiple of the number of kinds of electric signals in the second set. The electric signals of the first set may be generated by a transmission circuit26and a phase adjusting circuit28connected to the transmission circuit26. The electric signals of the second set may be generated by a transmission circuit27and a phase adjusting circuit28connected to the transmission circuit27. The phase adjusting circuit28may have the same configuration as the phase adjusting circuit23in the above embodiment. A mixing circuit29may mix and output the inputted electric signals of the two routes. The mixing circuit29may have the same configuration as the mixing circuit24in the above embodiment. The transmission circuits26and27may each output the sine-wave electric signal at 0° phase. The transmission circuit26may change the frequency of the electric signal to be output, based on the frequencies assigned to the first frequency table. For example, frequencies of 130, 140, 150, 160, and 170 kHz are assigned to the first frequency table. The transmission circuit27may change the frequency of the electric signal to be output, based on the frequencies assigned to the second frequency table. For example, the frequencies of 135, 145, 155, and 165 kHz are assigned to the second frequency table. In the configuration ofFIG.17, since the electric signals at the same phase are inputted to the three adjacent transmission elements11aamong the six transmission elements11aof the group GR1, the three adjacent transmission elements11amay function as a single transmission area. Therefore, as for the transmission elements11aof the group GR1, the phase of the electric signals may be changed at a pitch between the transmission areas comprised of the three adjacent transmission elements11a. For example, when the pitch between the transmission elements11ais 2.5 mm, the pitch at which the phase of the electric signal changes is 7.5 mm. Moreover, since the electric signals at the same phase are inputted to the four adjacent transmission elements11aamong the eight transmission elements11aof the group GR2, the four adjacent transmission elements11amay function as a single transmission area. Therefore, as for the transmission elements11aof the group GR2, the phase of the electric signals may be changed at a pitch between the transmission areas comprised of the four adjacent transmission elements11a. For example, when the pitch between the transmission elements11ais 2.5 mm, the pitch at which the phase of the electric signal changes is 10 mm. Thus, in Modification 2, the pitch at which the phase of the electric signals is changed may differ between the case where the first set of electric signals are inputted into the transmission elements11aof the group GR1and the case where the second set of electric signals are inputted into the transmission elements11aof the group GR2. Therefore, the transmitting direction of the grating lobe caused by the transmission elements11aof the group GR1may differ from the transmitting direction of the grating lobe caused by the transmission elements11aof the group GR2. Then, by changing the frequencies of the first set of electric signals and the second set of electric signals according to the first frequency table and the second frequency table, respectively, the transmitting direction of each grating lobe can be changed similarly to the above embodiment. Therefore, the two grating lobes (transmission beams) can scan in the given detection range. FIGS.18A to21Bare views, each illustrating a simulation result of calculating the transmitting direction in which the grating lobe occurs in the configuration of Modification 2. In the simulations, the pitch of the transmission elements11amay be set as 2.5 mm. The number of transmission elements11amay be set as 96. Moreover, the first set of electric signals and the second set of electric signals may be changed to each frequency assigned to the first frequency table and the second frequency table, respectively. Moreover, the phase of the electric signal applied to each transmission element11amay be set similar toFIG.17. FIGS.18A to19Care simulation results when applying the first set of electric signals at the frequencies of 130, 140, 150 160, and 170 kHz to the transmission elements11aof the group GR1. Moreover,FIGS.20A to21Bare simulation results when applying the second set of electric signals at the frequencies of 135, 145, 155, and 165 kHz to the transmission elements11aof the group GR2. As illustrated inFIGS.18A to19C, when the electric signals at the frequencies of 130, 140, 150, 160, and 170 kHz are applied to the transmission elements11aof the group GR1, the grating lobes may occur near different angles D11, D12, D13, D14, and D15. These five grating lobes may cover a range of −50° to −36° in general. Therefore, by changing the frequency of the electric signals applied to the transmission elements11aof the group GR1as described above, the grating lobes occurring from the transmission elements11aof the group GR1can scan the range of −50° to −36°. Moreover, as illustrated inFIGS.20A to21B, when the electric signals at the frequencies of 135, 145, 155, and 165 kHz are applied to the transmission elements11aof the group GR2, the grating lobes may occur near different angles D21, D22, D23, and D24. These four grating lobes may cover a range of −34° to −27° in general. Therefore, by changing the frequency of the electric signals applied to the transmission elements11aof the group GR2as described above, the grating lobes occurring from the transmission elements11aof the group GR2can scan the range of −34° to −27°. As described above, the grating lobes formed by the transmission elements11aof the group GR1under the simulation condition described above can cover an angle range of 14° (−50° to −36°) in general, and the grating lobe formed by the transmission elements11aof the group GR2can cover an angle range of 7° (−34° to −27°) in general. As the angle ranges of the groups GR1and GR2are integrated, the two grating lobes can cover an angle range of 23° (−50° to −27°) in general. That is, the angle of visibility of 23° can be realized. Therefore, also according to the configuration of Modification 2, one of the grating lobes caused by the transmission elements11aof the group GR1and one of the grating lobes caused by the transmission elements11aof the group GR2can scan the angle range of about 23°. Note that, according to the configuration of Modification 2, the two grating lobes may occur by the transmission elements11aof the group GR1and the group GR2as illustrated in the respective simulation results. In this case, as for the detection of the target object, only one of the two grating lobes (e.g., the grating lobe at the minus side in the simulations ofFIGS.18A to21B) is used, for example. For example, the angle range of the reception beam RB0is set so that the other grating lobe falls out from the range of the reception beam RB0. Therefore, by performing the processings ofFIGS.13A to14using similar circuit configuration asFIGS.11to12B, the detection image of the given detection range can be displayed on the display unit125. Other Modifications In the above embodiment, as illustrated inFIGS.12A and12B, after the frequency component at each frequency is extracted from the reception signal, the beamforming processing then performs a separation into the signal in each direction. However, the reception signal may be first separated into the signal in each direction by the beamforming processing, and then the frequency component of each frequency may be extracted from the separated signal in each direction. That is, the band-pass filter203and the beam synthesizing part204ofFIG.12Amay be interchanged, or the FFT211and the frequency extracting part212, and the beam synthesizing part204ofFIG.12Bmay be interchanged. Moreover, in the above embodiment, although the plurality of reception elements31aare provided as illustrated inFIG.10, the reflection wave may be received by a single reception element31a. Note that, in this case, since the beamforming cannot be performed to the reception beam, the bearing of the reception beam (the direction θ1ofFIG.10) is fixed. However, by extracting the frequency component of the reception signal from the reception beam of this bearing, the intensity data in each direction of the vertical direction can be acquired. Therefore, by mapping the intensity data in each direction of the vertical direction, the two-dimensional detection image can be displayed. Moreover, the number of transmission elements11ais not limited to the number illustrated in the above embodiment, and it may be other numbers as long as the plurality of kinds of grouping configurations are realizable. Moreover, three or more kinds of grouping configurations may be set for the plurality of transmission elements11aincluded in the transmission array11, and therefore, the number of transmission elements11aincluded in each group is not limited to the number described in the above embodiment and modifications. In any of the cases, the grating lobes are formed as the transmission waves so as to correspond to the number of grouping configurations. Moreover, the grating lobes formed by the transmission elements11aof each group may not necessarily be clearly separated, and may be partially overlapped. Moreover, although in the above embodiment the transmission array and the reception array are disposed perpendicular to each other, the transmission array and the reception array may be disposed at an angle slightly offset from the perpendicular configuration. Moreover, although inFIG.14the target detection device1(sonar, radar) is disposed in the ship2, the target detection device1(sonar, radar) may be installed in a movable body other than the ship2, or the target detection device1(sonar, radar) may be installed in a structure, other than the movable body, such as a buoy. Note that various modifications are suitably possible for the embodiment of the present disclosure within the scope of the appended claims. Terminology It is to be understood that not necessarily all objects or advantages may be achieved in accordance with any particular embodiment described herein. Thus, for example, those skilled in the art will recognize that certain embodiments may be configured to operate in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other objects or advantages as may be taught or suggested herein. All of the processes described herein may be embodied in, and fully automated via, software code modules executed by a computing system that includes one or more computers or processors. The code modules may be stored in any type of non-transitory computer-readable medium or other computer storage device. Some or all the methods may be embodied in specialized computer hardware. Many other variations than those described herein will be apparent from this disclosure. For example, depending on the embodiment, certain acts, events, or functions of any of the algorithms described herein can be performed in a different sequence, can be added, merged, or left out altogether (e.g., not all described acts or events are necessary for the practice of the algorithms). Moreover, in certain embodiments, acts or events can be performed concurrently, e.g., through multi-threaded processing, interrupt processing, or multiple processors or processor cores or on other parallel architectures, rather than sequentially. In addition, different tasks or processes can be performed by different machines and/or computing systems that can function together. The various illustrative logical blocks and modules described in connection with the embodiments disclosed herein can be implemented or performed by a machine, such as a processor. A processor can be a microprocessor, but in the alternative, the processor can be a controller, microcontroller, or state machine, combinations of the same, or the like. A processor can include electrical circuitry configured to process computer-executable instructions. In another embodiment, a processor includes an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable device that performs logic operations without processing computer-executable instructions. A processor can also be implemented as a combination of computing devices, e.g., a combination of a digital signal processor (DSP) and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. Although described herein primarily with respect to digital technology, a processor may also include primarily analog components. For example, some or all of the signal processing algorithms described herein may be implemented in analog circuitry or mixed analog and digital circuitry. A computing environment can include any type of computer system, including, but not limited to, a computer system based on a microprocessor, a mainframe computer, a digital signal processor, a portable computing device, a device controller, or a computational engine within an appliance, to name a few. Conditional language such as, among others, “can,” “could,” “might” or “may,” unless specifically stated otherwise, are otherwise understood within the context as used in general to convey that certain embodiments include, while other embodiments do not include, certain features, elements and/or steps. Thus, such conditional language is not generally intended to imply that features, elements and/or steps are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements and/or steps are included or are to be performed in any particular embodiment. Disjunctive language such as the phrase “at least one of X, Y, or Z,” unless specifically stated otherwise, is otherwise understood with the context as used in general to present that an item, term, etc., may be either X, Y, or Z, or any combination thereof (e.g., X, Y, and/or Z). Thus, such disjunctive language is not generally intended to, and should not, imply that certain embodiments require at least one of X, at least one of Y, or at least one of Z to each be present. Any process descriptions, elements or blocks in the flow diagrams described herein and/or depicted in the attached figures should be understood as potentially representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or elements in the process. Alternate implementations are included within the scope of the embodiments described herein in which elements or functions may be deleted, executed out of order from that shown, or discussed, including substantially concurrently or in reverse order, depending on the functionality involved as would be understood by those skilled in the art. Unless otherwise explicitly stated, articles such as “a” or “an” should generally be interpreted to include one or more described items. Accordingly, phrases such as “a device configured to” are intended to include one or more recited devices. Such one or more recited devices can also be collectively configured to carry out the stated recitations. For example, “a processor configured to carry out recitations A, B and C” can include a first processor configured to carry out recitation A working in conjunction with a second processor configured to carry out recitations B and C. The same holds true for the use of definite articles used to introduce embodiment recitations. In addition, even if a specific number of an introduced embodiment recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations). It will be understood by those within the art that, in general, terms used herein, are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). For expository purposes, the term “horizontal” as used herein is defined as a plane parallel to the plane or surface of the floor of the area in which the system being described is used or the method being described is performed, regardless of its orientation. The term “floor” can be interchanged with the term “ground” or “water surface.” The term “vertical” refers to a direction perpendicular to the horizontal as just defined. Terms such as “above,” “below,” “bottom,” “top,” “side,” “higher,” “lower,” “upper,” “over,” and “under,” are defined with respect to the horizontal plane. As used herein, the terms “attached,” “connected,” “mated” and other such relational terms should be construed, unless otherwise noted, to include removable, moveable, fixed, adjustable, and/or releasable connections or attachments. The connections/attachments can include direct connections and/or connections having intermediate structure between the two components discussed. Numbers preceded by a term such as “approximately,” “about,” and “substantially” as used herein include the recited numbers, and also represent an amount close to the stated amount that still performs a desired function or achieves a desired result. For example, the terms “approximately,” “about,” and “substantially” may refer to an amount that is within less than 10% of the stated amount. Features of embodiments disclosed herein preceded by a term such as “approximately,” “about,” and “substantially” as used herein represent the feature with some variability that still performs a desired function or achieves a desired result for that feature. It should be emphasized that many variations and modifications may be made to the above-described embodiments, the elements of which are to be understood as being among other acceptable examples. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims. | 74,518 |
11862866 | DESCRIPTION OF THE EMBODIMENTS FIG.1is a schematic view of an antenna module according to an embodiment of the disclosure. Referring toFIG.1, according to this embodiment, an antenna module100is a planar inverted-F (PIFA) antenna. The antenna module100includes a first radiator110, a second radiator120, a third radiator130, and a ground radiator140. The first radiator110, the second radiator120, the third radiator130, and the ground radiator140are sequentially connected in a bent manner to form a stepped shape. The first radiator110includes a first section112and a second section114connected to each other. According to this embodiment, the first section112and the second section114are coplanar, with the first section112extending toward the upper left ofFIG.1and the second section114extending toward the lower right ofFIG.1. The second radiator120is connected in a bent manner between the first section112and the second section114of the first radiator110(position A2). According to this embodiment, the second radiator120is perpendicularly connected between the first section112and the second section114of the first radiator110(position A2). The second radiator120includes a third section122and a fourth section124. According to this embodiment, the third section122and the fourth section124are coplanar, with the third section122extending horizontally toward the upper left ofFIG.1and the fourth section124extending horizontally toward the lower right ofFIG.1. The fourth section124includes a feed end (position A1). According to this embodiment, the feed end (position A1) is electrically connected to a positive signal end of a coaxial transmission line165. The third radiator130is bent, for example, perpendicularly, connected to the third section122of the second radiator120. The ground radiator140is bent, for example, perpendicularly, connected to the third radiator130, and a ground end (position G1) is electrically connected to a negative signal end of the coaxial transmission line. According to this embodiment, the antenna module100is, for example, made of an iron piece integrally formed, but it is not limited thereto. According to other embodiments, the antenna module100may also be formed on a flexible printed circuit (FPC) or fabricated on a housing by laser direct structuring (LDS). It can be seen fromFIG.1that, according to this embodiment, a length L1of the first radiator110is about 27 mm. A width L2is about 1.9 mm. A distance L3between the first radiator110and the ground radiator140is about 3 mm. A distance L4between the second radiator120and the ground radiator140is about 1.1 mm. A size L5of the ground radiator140is about 5 mm. Of course, the size is not limited thereto. It should be noted that, according to this embodiment, the antenna module100is made by, for example, combining an iron piece (the first radiator110, the second radiator120, and the third radiator130) having a length, width, and thickness of about 27 mm, 6 mm, and 0.3 mm with an iron piece (the ground radiator140) having a length, width, and thickness of about 8.5 mm, 5 mm, and 0.3 mm, and bending the iron pieces into a three-dimensional stepped shape, which may be disposed in a space with a length, width, and height of 27 mm, 3 mm, and 4.95 mm respectively. Due to a reduced size of the stepped antenna module100in width, the stepped antenna module100may be disposed in a tablet device with a narrow bezel. Of course, types of devices in which the antenna module100may be applied are not limited thereto. In addition, according to this embodiment, the first section112of the first radiator110and the fourth section124of the second radiator120(a path formed by positions A1to A3) jointly resonate at a low frequency band. The low frequency band is, for example, 2400 MHz to 2484 MHz (e.g., Wi-Fi 2.4 GHz), but is not limited thereto. According to this embodiment, a total length of the first section112of the first radiator110and the fourth section124of the second radiator120(the path formed by the positions A1to A3) is ¼ wavelength of the low frequency band. The second section114of the first radiator110and the fourth section124of the second radiator120(the path formed by the positions A1, A2, and A3) and the second radiator120, the third radiator130, and the ground radiator140(a path formed by positions A1, B1, B2, G3, G2, and G1) jointly resonate at a high frequency band. The high frequency band is, for example, 5150 MHz to 5850 MHz (e.g., Wi-Fi 5 GHz), but is not limited thereto. According to this embodiment, a total length of the second section114of the first radiator110and the fourth section124of the second radiator120is ¼ wavelength of the high frequency band, and a total length of the second radiator120, the third radiator130, and the ground radiator140(the path formed by the positions A1, B1, B2, G3, G2, and G1) is ¼ wavelength to ½ wavelength of the high frequency band. Therefore, the antenna module100may achieve a desired frequency band in a limited space. FIG.2is a schematic view of an electronic device according to an embodiment of the disclosure. Referring toFIG.2, according to this embodiment, an electronic device10is, for example, a tablet computer with a narrow bezel, but is not limited thereto. The electronic device10includes two antenna modules100ofFIG.1and has a multi-antenna structure. The two antenna modules100are located in a bezel region12at an outer edge of a display panel40. A distance L8between the two antenna modules100is between 60 mm and 80 mm, which is about 70 mm. FIG.3is a schematic top view of two antenna modules of the electronic device ofFIG.2disposed on an insulator. Referring toFIG.3, according to this embodiment, the two antenna modules100are disposed on an insulator20. Since the two antenna modules100are of a same shape, they can share a same set of mold to achieve a goal of antenna sharing and cost saving. The two antenna modules100are soldered with two coaxial transmission lines165of 50 mm and 150 mm, respectively, and are connected to a module card (not shown) of a motherboard (not shown) through the two coaxial transmission lines165. FIG.4is a partial three-dimensional schematic view ofFIG.3. Referring toFIG.4, according to this embodiment, the insulator20has a stepped contour. The antenna module100is arranged on the insulator20along the contour of the insulator20. According to this embodiment, the second radiator120includes a positioning hole126located between the third section122and the fourth section124. The positioning hole126may be used for positioning the antenna module100on the insulator20by, for example, passing through a bolt pillar22. In addition, the antenna module100may be fixed to a plastic insulator20by hot-melt, and has good and stable wireless performance. Referring toFIG.5,FIG.5is a schematic cross-sectional view taken along a line A to A′ ofFIG.2. According to this embodiment, the electronic device10includes an insulator20, an antenna module100, a metal back cover30, a display panel40, and a front bezel60. The front bezel60is disposed beside the display panel40. According to this embodiment, a width L9of the front bezel60is about 7.5 mm. The metal back cover30is disposed below the display panel40and the front bezel60. The display panel40is arranged opposite to the metal back cover30. The antenna module100and the insulator20are located in the bezel region12at the outer edge of the display panel40, and are disposed between the front bezel60and the metal back cover30. It should be noted that, as shown inFIG.5, according to this embodiment, the first radiator110of the antenna module100is perpendicular to the display panel40. Since a side of the tablet device needs to be tested for specific absorption rate (SAR), if the antenna module100is in a form of a plane, a radiation pattern will be in a Z-direction (to the right) as shown inFIG.5, and it will be difficult to meet the test standard. Planar antennas often require reduced antenna transmitting power to meet the SAR standard. According to this embodiment, the antenna module100is in a stepped shape and the first radiator110of the antenna module100is perpendicular to the display panel40, such that the radiation pattern is oriented in a Y direction (upward) as shown inFIG.5. In this way, the designer does not need to reduce the antenna transmitting power, a SAR value of the electronic device10at the right side ofFIG.5may meet the standard, and has better performance. In addition, according to this embodiment, the first radiator110of the antenna module100is designed to be perpendicularly away from the metal back cover30, so that radiated energy of the antenna in the Y direction has a characteristic of omnidirectional radiation. It should be noted that, referring toFIG.1andFIG.5, according to this embodiment, the antenna module100further includes an air outlet150formed between the second radiator120and the ground radiator140and located beside the third radiator130. The ground radiator140includes a first edge142connected to the third radiator130, a second edge146adjacent to the first edge142, and a notch144recessed from the first edge142. The notch144is connected to the air outlet150. A length and a width of the notch144are, for example, 2 mm, but not limited thereto. The air outlet150and the notch144are used for air flow to enhance heat dissipation. As shown inFIG.5, according to this embodiment, the metal back cover30includes an opening32corresponding to and connected to the air outlet150. An air flow (such as an arrow inFIG.4andFIG.5) is suitable to flow into or out of the metal back cover30through the opening32of the metal back cover30and the air outlet150and the recess144of the antenna module100to achieve an effect of heat dissipation. Furthermore, returning toFIG.1, according to this embodiment, the antenna module100further includes a first conductor160attached to the ground radiator140and extending to a system ground plane50in a direction away from the third radiator130. The system ground plane50is, for example, a bare copper region of the motherboard, but is not limited thereto. A size L6of a portion of the first conductor160above the ground radiator is about 8.5 mm, and a size L7of a portion of the first conductor160outside the ground radiator is about 3 mm. The first conductor160is, for example, aluminum foil or copper foil, but is not limited thereto. The antenna module100further includes a second conductor162. The ground radiator140includes the second edge146adjacent to the first edge142, and the second edge146is close to the feed end (position A1). The second conductor162is attached to the second edge146of the ground radiator140to ground. Specifically, the second conductor162is attached to the second edge146of the ground radiator140and extends to the metal back cover30(shown inFIG.5). Such a design enhances antenna performance of the antenna module100at Wi-Fi 2.4 GHz and Wi-Fi 5 GHz. The second conductor162is, for example, conductive foam, but is not limited thereto. According to this embodiment, the first conductor160and the second conductor162constitute two inductive grounding, increasing an area of antenna grounding and making a system grounding complete, which may effectively improve stability of a wireless transmission system and wireless transmission performance. FIG.6shows a frequency-return loss relationship of the two antenna modules inFIG.3. Referring toFIG.6, according to this embodiment, the two antenna modules100may have good performance with return loss below −6 dB (VSWR=3). FIG.7shows a frequency-isolation relationship of the two antenna modules inFIG.3. Referring toFIG.3andFIG.7, according to this embodiment, the distance L8between the two antenna modules100inFIG.3is about 70 mm, and isolation may be less than −15 dB, or even close to −20 dB, which has good isolation performance. FIG.8shows a frequency-antenna efficiency relationship of two antenna modules on an electronic device ofFIG.1. Referring toFIG.8, the antenna efficiency of the two antenna modules100may be above −4.5 dBi in both low frequency Wi-Fi 2.4 GHz and high frequency Wi-Fi 5 GHz with good performance. Returning toFIG.2, according to this embodiment, in addition to the two antenna modules100ofFIG.1, the electronic device10may also be provided with two planar antennas70, which together constitute an application of 4×4 MIMO multi-antenna technology. The two planar antennas70are located on both sides of the two antenna modules100, and a distance L10between the planar antenna70and the antenna module100is 20 mm. The planar antenna70may be printed on a circuit board and arranged flat in the bezel region12. Of course, according to other embodiments, the two planar antennas70may be omitted or, alternatively, the two planar antennas70may be replaced by two additional antenna modules100. FIG.9andFIG.10show patterns of the antenna module and a planar antenna of the electronic device ofFIG.1in an X-Y plane at low frequency and high frequency, respectively. Referring toFIG.9first, at low frequency (frequency point at Wi-Fi 2.4 GHz), the antenna module100has better radiation pattern in a +Y direction. Referring toFIG.10, at high frequency (frequency point at Wi-Fi 5 GHz), the antenna module100has better radiation pattern in a +X direction and a −X direction. In summary, the second radiator of the antenna module of the disclosure is connected in a bent manner to a portion between the first section and the second section of the first radiator. The fourth section of the second radiator includes the feed end. The third radiator is connected in a bent manner to the third section of the second radiator, and the ground radiator is connected in a bent manner to the third radiator. The first radiator, the second radiator, the third radiator, and the ground radiator are sequentially connected in a bent manner to form a stepped shape. With the above design, the antenna module of the disclosure can be used in space-constrained environments by reducing the length and width of the module. In addition, the first section of the first radiator and the fourth section of the second radiator jointly resonate at a low frequency band, and the second section of the first radiator, the second radiator, the third radiator, and the ground radiator jointly resonate at a high frequency band, so that the desired frequency band may be achieved in a limited space. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents. | 14,843 |
11862867 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described in detail below with reference to the drawings. FIG.1provides a perspective view of an antenna coupling element20used in an antenna device and a communication terminal apparatus according to a preferred embodiment of the present invention and an exploded perspective view of a portion of the antenna coupling element20. The antenna coupling element20of the present preferred embodiment is a parallelepiped or substantially parallelepiped chip component mounted at a circuit board in a communication terminal apparatus.FIG.1separately shows the outer shape and the internal structure of the antenna coupling element20. A first radiating element connection terminal T1, a feeding circuit connection terminal T2, a ground connection terminal T3, and a second radiating element connection terminal T4are formed at the outer surface of the antenna coupling element20. The antenna coupling element20has a first surface MS1and a second surface MS2that is a surface opposite to the first surface MS1. In this preferred embodiment, the first surface MS1or the second surface MS2is the mounting surface. Conductor patterns L1a, L1b, L2a, and L2bare provided inside the antenna coupling element20. The conductor pattern L1aand the conductor pattern L1bare coupled to each other via an interlayer connection conductor V1. The conductor pattern L2aand the conductor pattern L2bare coupled to each other via an interlayer connection conductor V2. InFIG.1, insulating base layers S11, S12, S21and S22on which the respective conductor patterns are provided are shown separately in the stacking direction. When the antenna coupling element20is provided by using a resin multilayer substrate, the insulating base layer is preferably, for example, a liquid crystal polymer (LCP) sheet, and the conductor patterns L1a, L1b, L2a, and L2bare preferably formed by, for example, patterning copper foils. When the antenna coupling element20is provided by using a ceramic multilayer substrate, the insulating base layer is preferably made of, for example, low temperature co-fired ceramics (LTCC), and the conductor patterns L1a, L1b, L2a, and L2bare formed by, for example, applying a copper paste. Since the base layer is made of a non-magnetic material (not formed of a magnetic ferrite), the antenna coupling element20is able to define a transformer of a predetermined inductance and a predetermined coupling coefficient preferably in a high frequency range of about 0.6 GHz to about 2.7 GHz, for example. The conductor patterns L1a, L1b, L2a, and L2bare provided centrally in the middle layer of the multilayer body, and as a result, an interval is provided between a ground conductor at the circuit board and a first coil L1and a second coil L2in the state in which the antenna coupling element20is mounted at the circuit board. Further, if a metal component or element approaches the upper portion of the antenna coupling element20, an interval still exists between this metal component or element and the first coil L1and the second coil L2. As a result, the magnetic field generated by the first coil L1and the second coil L2described later is less likely to be affected by the outside environment and stable characteristics are able to be provided. FIG.2is a plan view of an antenna device101and a communication terminal apparatus111including the antenna device101. The communication terminal apparatus111includes a first radiating element11, a second radiating element12, a circuit board40, and a housing50. A feeding circuit30is formed at the circuit board40. Additionally, the antenna coupling element20, an inductor L12, and an inductor L11are mounted at the circuit board40. The first radiating element11is formed at a portion of the housing that is electrically independent from the main portion of the housing50of the communication terminal apparatus111. The second radiating element12is provided as a conductor pattern provided at a resin portion in the housing50by employing the laser-direct-structuring (LDS) process, for example. The second radiating element12is not limited to this example and may be provided as a conductor pattern at a flexible printed circuit (FPC) by employing a photoresist process, for example. The first radiating element connection terminal (T1shown inFIG.1) of the antenna coupling element20is coupled to the first radiating element11, the feeding circuit connection terminal (T2shown inFIG.1) is coupled to the feeding circuit30, and the ground connection terminal (T3shown inFIG.1) is coupled to a ground conductor pattern. The inductor L12is coupled between the second radiating element connection terminal (T4shown inFIG.1) and the second radiating element12. The inductor L11is coupled between one end of the first radiating element11and ground. The first radiating element11operates as a loop antenna in conjunction with the inductor L11and the ground conductor pattern provided at the circuit board. The second radiating element12operates as a monopole antenna. A parasitic capacitance C12between radiating elements is provided at a portion PP between a portion of the first radiating element11and the second radiating element12. The first radiating element11and the second radiating element12are coupled to each other via an electric field by the parasitic capacitance C12. The parasitic capacitance C12is provided mainly between a portion of the first radiating element11and a portion of the second radiating element12that are positioned in parallel or substantially in parallel with each other. As shown inFIG.2, when the loop antenna includes the first radiating element11, the space for the first radiating element11is able to be reduced. Furthermore, with the loop antenna structure, changes in antenna characteristics of the first radiating element11due to the proximity of the human body are able to be significantly reduced or prevented. Further, by positioning the second radiating element12having a monopole structure inside the structure with respect to the loop antenna, changes in antenna characteristics of the second radiating element12due to the proximity of the human body are able to be significantly reduced or prevented. FIG.3is a circuit diagram of the antenna device101including the antenna coupling element20. The antenna coupling element20includes the first coil L1and the second coil L2that are coupled to each other via a magnetic field. M inFIG.3indicates this magnetic field coupling. The first radiating element11resonates in frequency ranges of a low band (for example, about 0.60 GHz to about 1.71 GHz) and a high band (for example, about 1.71 GHz to about 2.69 GHz). Specifically, the first radiating element11, to which the first coil L1is coupled, supports a low band that is a frequency band mainly including a “fundamental resonant frequency” and also supports a high band that is a frequency band including a “third harmonic resonant frequency” and a “fifth harmonic resonant frequency”. Here, “resonance of the first radiating element” denotes resonance of the first radiating element11and the antenna coupling element20. In this specification, the resonant frequency of an m-th harmonic wave is referred to as an “m-th resonant frequency”. m is an integer equal to or greater than 1. The fundamental resonant frequency is at m=1. The second radiating element12supports, in conjunction with the antenna coupling element20and the inductor L12, a high band (for example, about 1.71 GHz to about 2.69 GHz) by resonating at the third harmonic. The following description relates to a decrease in the radiation efficiency of the second radiating element12due to currents flowing into the second radiating element12and weakening each other in a condition in which direct coupling due to the parasitic capacitance between the first radiating element11and the second radiating element12and indirect coupling via the antenna coupling element20exist together. FIG.13is a circuit diagram of an antenna device as a comparative example. The first radiating element11is fed with power from the feeding circuit30through the first coil L1. The second radiating element12is fed with power from the second coil L2(power is supplied with a current flowing through the second coil L2). For example, when a current i1flows in the first coil L1, magnetic field coupling between the first coil L1and the second coil L2induces a current i2in the second coil L2, and as a result, the second radiating element12is fed (driven) with power supplied with the current i2. M inFIG.13indicates this magnetic field coupling. In addition, the second radiating element12is coupled to the first radiating element11via an electric field by the parasitic capacitance C12. Due to this electric field coupling, a current i12flows in the second radiating element12through the second coil L2. As shown inFIG.13, when the absolute value of the phase difference between the current i2flowing into the second radiating element12due to electromagnetic field coupling between the first coil L1and the second coil L2and the current i12flowing into the second radiating element12due to electric field coupling exceeds about 90 degrees, the current i12and the current i2weaken each other. In practice, it is difficult to directly measure the current i2induced in the second radiating element12by the electromagnetic field coupling described above without interference with the antenna by using a current probe or the like. To deal with this problem, for example, in the antenna device shown inFIG.13, the first radiating element11and the second radiating element12are physically spaced apart from each other, and the phase of the current i2at a predetermined frequency is determined by measuring the current flowing across the second radiating element12and the second coil L2at a predetermined frequency by using a network analyzer or the like. Specifically, with the structure changed as described above, 2×2 S (Scattering) parameters of two input ends, which are an input end of the first radiating element11(an end on the power supply side of the first radiating element11) and an input end of the second radiating element12(an end on the ground side of the second radiating element12), are measured and 4×4 S parameters of only the antenna coupling element20having the four terminals T1to T4are also measured; accordingly, the phase of the current i2flowing into the radiating element12due to electromagnetic field coupling is determined by performing calculation on a circuit simulator with the use of the S parameters. Alternatively, for example, in the antenna device shown inFIG.13, the antenna coupling element20is removed. Accordingly, the phase of the current i12flowing into the second radiating element12due to electric field coupling is determined by measuring the phase of the current flowing across the second radiating element12and ground at a predetermined frequency by using a network analyzer or the like. However, direct measurement is not easily performed. Accordingly, for example, 2×2 S parameters of two input ends, which are the input end of the first radiating element11and the input end of the second radiating element12, are firstly measured; then, the 2×2 S parameters are measured again in the state in which the antenna coupling element20is removed; and accordingly, the phase of the current i12flowing into the second radiating element12is determined by performing calculation on a circuit simulator by using the S parameters. In the present preferred embodiment, the second radiating element12resonates at the third harmonic with the antenna coupling element20and the inductor L12in a frequency range of the high band (for example, about 1.71 GHz to about 2.69 GHz). In other words, the inductor L12causes the resonance of the second radiating element12and the antenna coupling element20in the high band frequency range to be the resonance at the third harmonic. This resonant frequency is, for example, about 2.1 GHz, which reduces or prevents the currents i12and i2from weakening each other, as will be described below with respect to current distribution. FIG.4shows examples of current distribution with regard to the second radiating element12.FIG.4shows current distributions at a given time with respect to the fundamental resonance to the seventh harmonic resonance of the second radiating element12and the antenna coupling element20. When the fundamental resonance and the third harmonic resonance are compared to each other, the positive current is distributed in the case of the fundamental resonance, while the negative current is dominantly distributed in the case of the third harmonic; in other words, there are more opposite polarity current components in comparison to the fundamental resonance. Thus, under the condition that the fundamental current flowing into the second radiating element12due to electromagnetic field coupling between the first coil L1and the second coil L2and the fundamental current flowing into the second radiating element12due to electric field coupling between the first radiating element11and the second radiating element12weaken each other, that is, under the condition that, for example, in the circuit shown inFIG.13, when the second radiating element12and the antenna coupling element20resonate at the fundamental, the absolute value of the phase difference between the current i2flowing into the second radiating element12due to electromagnetic field coupling between the first coil L1and the second coil L2and the current i12flowing into the second radiating element12due to electric field coupling exceeds about 90 degrees, the third harmonic current flowing into the second radiating element12due to electromagnetic field coupling between the first coil L1and the second coil L2and the current flowing into the second radiating element12due to electric field coupling between the first radiating element11and the second radiating element12are inhibited from weakening each other. While the example of the third harmonic resonance of the second radiating element12has been described with reference toFIG.4, the fifth and seventh harmonics, which indicate opposite polarity current distributions, that is, negative current distributions, are also effective when the positive current is distributed in the case of the fundamental resonance. However, since the negative current is dominantly distributed in the cases of the third and seventh harmonics, the third and seventh harmonics are more preferable, for example, to reduce or prevent the current flowing into the second radiating element12due to electric field coupling between the first radiating element11and the second radiating element12from being weakened. Furthermore, between the third and seventh harmonics, the third harmonic is more preferable, for example, because the third harmonic indicates larger negative current distribution. FIG.5shows the frequency characteristic with respect to the radiation efficiency of the antenna device101. InFIG.5, RE1is the radiation efficiency of only the second radiating element12, RE2is the radiation efficiency of the antenna device of the comparative example, and RE3is the radiation efficiency of the antenna device101of the present preferred embodiment. The antenna device of the comparative example is an antenna device not including the inductor L12, and the third harmonic resonant frequency of a resonance circuit defined by the second radiating element12, the antenna coupling element20, and the inductor L12is outside the communication frequency range of the antenna device of the comparative example. In the antenna device of the comparative example, as shown inFIG.13, the absolute value of the phase difference between the current i12flowing into the second radiating element12due to electromagnetic field coupling between the first coil L1and the second coil L2and the current i2flowing into the second radiating element12due to electric field coupling exceeds about 90 degrees and the current i12and the current i2weaken each other. The resonance of the second radiating element12and the antenna coupling element20is able to be changed by increasing the self-inductance value of the second coil L2. However, the self-resonant frequency of the antenna coupling element20decreases and falls within the communication frequency range of the antenna device101, and as a result, sufficient radiation efficiency may not be provided. InFIG.5, the frequency band of about 0.6 GHz to about 1.0 GHz is a frequency range with high radiation efficiency due to the fundamental resonance of the first radiating element11and the antenna coupling element20and the third harmonic resonance of the second radiating element12, the antenna coupling element20, and the inductor L12(the fundamental resonance of the second radiating element12and the antenna coupling element20in the case of only the second radiating element12without the inductor L12). The frequency band of about 1.7 GHz to about 1.9 GHz is a frequency range with high radiation efficiency due to the third harmonic resonance of the first radiating element11. The frequency band of about 2.4 GHz to about 2.6 GHz band is a frequency range with high radiation efficiency due to the fifth harmonic resonance of the first radiating element11. As seen fromFIG.5, in the antenna device of the comparative example, due to the effect caused by the currents weakening each other in the frequency range of about 1.8 GHz to about 2.5 GHz, the effect of coupling with the use of the antenna coupling element20is relatively low, and as a result, the radiation efficiency is not high. This frequency range is the third harmonic resonant frequency of the resonance circuit defined by the second radiating element12, the antenna coupling element20, and the inductor L12in the antenna device of the present preferred embodiment; in the present preferred embodiment, this frequency range exists between the third harmonic resonant frequency and the fifth harmonic resonant frequency of the first radiating element11. As seen fromFIG.5, in the frequency range of about 0.6 GHz to about 1.8 GHz, the radiation efficiency RE3of the antenna device101of the present preferred embodiment is equal or substantially equal to the radiation efficiency RE2of the antenna device of the comparative example, but at about 1.8 GHz or higher, the antenna device101of the preferred embodiment provides higher radiation efficiency. In this frequency range, in the antenna device101of the present preferred embodiment, the effect of the currents i12and i2weakening each other is decreased, and as a result, the currents i12and i2do not weaken each other but rather strengthen each other. FIG.5shows the example in which the third harmonic resonant frequency of the resonance circuit defined by the second radiating element12, the antenna coupling element20, and the inductor L12exists between the third harmonic resonant frequency and the fifth harmonic resonant frequency of the first radiating element11, but the third harmonic resonant frequency of the resonance circuit may exist between the fundamental resonant frequency and the third harmonic resonant frequency of the first radiating element11. The examples shown inFIG.5and other drawings take the third harmonic resonance as an example of harmonic resonance of the resonance circuit defined by the antenna coupling element20, the inductor L12, and the second radiating element12, but a (2n+1)th harmonic resonant frequency, where n is an integer equal to or greater than 1, for example, the seventh harmonic resonance, may be used. However, as already described with reference toFIG.4, the effect of currents weakening each other is lower in the case of the third and seventh harmonics than in the case of the fifth harmonic. The effect of currents weakening each other due to electric field coupling between radiating elements is relatively lower in the case of a (4n−1)th harmonic resonant frequency. As described with reference toFIG.5, the feeding circuit30shown inFIGS.2and3inputs and outputs communication signals including the resonant frequency of the second radiating element12, the harmonic resonant frequency described above, and the third harmonic resonant frequency and the fifth harmonic resonant frequency of the first radiating element11. As a result, a communication terminal apparatus that handles broadband communication signals is able to be implemented. FIG.6is a circuit diagram of an antenna device according to a preferred embodiment of the present invention. This antenna device differs from the antenna device shown inFIG.3in the position of the inductor L12. In the example shown inFIG.6, the inductor L12is coupled between the ground connection terminal T3of the antenna coupling element20and ground. Other features, components, and elements are the same as or similar to those of the antenna device shown inFIG.3. Since the resonant frequency of the circuitry including the second radiating element12is determined by the circuitry from the open end of the second radiating element12to ground, when the inductor L12is coupled between the ground connection terminal T3of the antenna coupling element20and ground as shown inFIG.6, the resonant frequency of the second radiating element12is also able to be determined by the inductance of the inductor L12. The parasitic capacitance between the first coil L1and the second coil L2of the antenna coupling element20, the first coil L1, the second coil L2, and the inductor L12define a self-resonant circuit RC. Since this self-resonant circuit RC includes the inductor L12, its resonant frequency is lower than the resonant frequency of the self-resonant circuit including the circuitry shown inFIG.3. Accordingly, from the viewpoint of providing an antenna that device supports a wide frequency range, the inductor L12is preferably provided at the position shown inFIG.3, for example. Next, examples of an antenna device including features of individual portions different from those of the antenna devices described above will be provided. FIG.7shows an antenna device according to a preferred embodiment of the present invention. The antenna device102includes the first radiating element11, the second radiating element12, the antenna coupling element20, and the inductor L12. The first radiating element11and the second radiating element12are both monopole radiating elements. Accordingly, the features described herein are able to be similarly applied to the antenna device in which the first radiating element11is also a monopole antenna. FIG.8is a plan view of an antenna device103and a communication terminal apparatus112including the antenna device103according to a preferred embodiment of the present invention. The communication terminal apparatus112includes the first radiating element11, the second radiating element12, a third radiating element13, the circuit board40, and the housing50. The feeding circuit30is provided at the circuit board40. Additionally, the antenna coupling element20, the inductors L12and L11are mounted at the circuit board40. The first radiating element11, the second radiating element12, and the third radiating element13are defined by conductor patterns provided at a resin portion in the housing50by using the laser-direct-structuring (LDS) process. The first radiating element11, the second radiating element12, and the third radiating element13are not limited to this example and may be defined by conductor patterns at a flexible printed circuit (FPC) by employing a photoresist process. The inductor L11is coupled between one end of the first radiating element11and ground. The first radiating element11operates as a loop antenna in conjunction with the inductor L11and the ground conductor pattern provided at the circuit board. The second radiating element12operates as a monopole antenna. The third radiating element13is, for example, a GPS antenna and is coupled to a feeding circuit different from the feeding circuit30. Other features are the same as or similar to those of the antenna device shown inFIG.2and other drawings. As described above, the first radiating element11may be defined by a conductor pattern. FIG.9shows an antenna device104according to a preferred embodiment of the present invention. The antenna device104includes the first radiating element11, the second radiating element12, the antenna coupling element20, inductors L11aand L11b, capacitors C11aand C11b, and a switch4. The switch4selectively connects one of the inductors L11aand L11band the capacitors C11aand C11bto an end of the first radiating element11in accordance with control signals provided from the outside of the antenna device. As a result, the effective length of the antenna is able to be changed by the switch4. The inductors L11aand L11bhave different inductances and the capacitors C11aand C11bhave different capacitances. The resonant frequency of the first radiating element11is able to be changed in accordance with a particular one selected from the reactance elements L11a, L11b, C11aand C11b. Other features are the same as or similar to those shown inFIG.2. FIG.10shows an antenna device105according to a preferred embodiment of the present invention. The antenna device105includes the first radiating element11, the second radiating element12, and the antenna coupling element20. The feeding circuit30is coupled to a feed point PF of the first radiating element11via the first coil L1of the antenna coupling element20. Ends of the first radiating element11are open and a predetermined grounding point PS in the middle of the first radiating element11is grounded. Accordingly, the first radiating element11operates as an inverted F antenna. Furthermore, when the first radiating element11is a conductor extending to have a planar or substantially planar shape, the first radiating element11defines and functions as a planar inverted-F antenna (PIFA). By providing the first radiating element11as an inverted F antenna or PIFA as described above, the impedance of the first radiating element11is able to be set at approximately the same impedance as the impedance of the feeding circuit, and as a result, impedance matching is able to be easily provided. Accordingly, the features described herein are also able to be applied to an antenna device in which the first radiating element11is an inverted F antenna or PIFA. FIG.11shows an antenna device106according to a preferred embodiment of the present invention. The antenna device106includes the first radiating element11, the second radiating element12, and the antenna coupling element20. The feeding circuit30is coupled to the feed point PF of the first radiating element11. The first coil L1of the antenna coupling element20is coupled between the predetermined ground point PS of the first radiating element11and ground. The second radiating element12is coupled to the second coil L2of the antenna coupling element20. Accordingly, the first radiating element11operates as an inverted F antenna. Furthermore, when the first radiating element11is a conductor extending to have a planar or substantially planar shape, the first radiating element11defines and functions as a planar inverted-F antenna (PIFA). The preferred embodiments of the present invention are also able to be applied to an antenna device including an inverted F antenna or PIFA including the features described herein. While the examples described above include the first coil L1and the second coil L2defining the antenna coupling element as one component, the antenna coupling element20may be constructed as a single component including the inductor L12, as shown in a circuit diagram of an antenna coupling element21inFIG.12. The antenna coupling element21includes not only the first coil L1and the second coil L2, which are coupled to each other via an electromagnetic field, but also the inductor L12. The inductor L12is provided between the second coil L2and the second radiating element connection terminal T4. The inductor L12is formed as a coil conductor pattern positioned not to be coupled to the first coil L1and the second coil L2. Alternatively, a wiring portion of a conductor pattern may be provided as the inductor L12. As described above, the inductor L12is preferably positioned to reduce the effect on electromagnetic field coupling, for example. Accordingly, the decrease in the self-resonant frequency of the antenna coupling element20is able to be significantly reduced or prevented. Finally, the foregoing description of the preferred embodiments is illustrative in all respects and not restrictive. Those skilled in the art may implement modifications and changes as appropriate. The scope of the present invention is defined by the claims rather than the preferred embodiments described above. Furthermore, all changes to the preferred embodiments which come within the range of equivalency of the claims are embraced in the scope of the present invention. For example, while the inductor L12is shown as a circuit element in the circuit diagrams, the inductor L12may be provided as a conductor pattern instead of a mounted component, for example, a chip inductor. Moreover, it suffices that the resonant frequency of the circuit defined by the second radiating element12and the antenna coupling element20resonates at the third harmonic within a predetermined frequency range. Accordingly, the effective length of the second radiating element12may be elongated by, for example, reducing the line width of the second radiating element12. While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims. | 30,120 |
11862868 | DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS FIG.1Ais a structural diagram of a multi-feed antenna1according to an embodiment of the disclosure. As shown inFIG.1A, the multi-feed antenna1includes a first conductor layer11, a second conductor layer12, four supporting conductor structures131,132,133,134, and four feeding conductor lines141,142,143,144. The second conductor layer12has a first center position121, and the second conductor layer12is spaced apart from the first conductor layer11at a first interval d1. The four supporting conductor structures131,132,133,134are all located between the first conductor layer11and the second conductor layer12, and electrically connect the first conductor layer11and the second conductor layer12respectively. The four supporting conductor structures131,132,133,134form four electrically connected sections1311,1321,1331,1341at the second conductor layer12. Moreover, the four electrically connected sections1311,1321,1331,1341respectively extend from different side edges1211,1212,1213,1214of the second conductor layer12toward the first center position121, so that the second conductor layer12forms four connected radiating conductor plates122,123,124,125. The supporting conductor structures131,132,133,134are composed of a plurality of conductor lines. The four feeding conductor lines141,142,143,144are all located between the first conductor layer11and the second conductor layer12. The four feeding conductor lines141,142,143,144and the four supporting conductor structures131,132,133,134form an interleaved annular arrangement between the first conductor layer11and the second conductor layer12. Each of the feeding conductor lines141,142,143,144has one end electrically connected to an electrical connection point14111,14211,14311,14411(as shown inFIG.1B) of a coupling conductor plate1411,1421,1431,1441respectively. Each of the coupling conductor plates1411,1421,1431,1441is spaced apart from a different one of the radiating conductor plates122,123,124,125at a coupling interval s1, s2, s3, s4respectively. Each of the feeding conductor lines141,142,143,144has another end electrically connected to a signal source1412,1422,1432,1442respectively. The four feeding conductor lines141,142,143,144excite the second conductor layer12to generate at least four resonant modes14121,14221,14321,14421(as shown inFIG.1C), and the at least four resonant modes14121,14221,14321,14421cover at least one identical first communication band15. The coupling conductor plates1411,1421,1431,1441and the second conductor layer12are located on a common plane. The gap of the coupling intervals s1, s2, s3, s4is between 0.005 wavelength and 0.088 wavelength of the lowest operating frequency of the first communication band15. The four supporting conductor structures131,132,133,134form four different resonant spaces161,162,163,164in the region between the first conductor layer11and the second conductor layer12, and the four feeding conductor lines141,142,143,144are located in different resonant spaces161,162,163,164, respectively. The gap of the first interval d1is between 0.01 wavelength and 0.38 wavelength of the lowest operating frequency of the first communication band15. The area of the second conductor layer12is between 0.25 wavelength squared and 0.99 wavelength squared of the lowest operating frequency of the first communication band15.FIG.1Bis a structural diagram of an enclosed region17formed by connecting lines of the four electrical connection points14111,14211,14311,14411of the four coupling conductor plates1411,1421,1431,1441of the multi-feed antenna1according to an embodiment of the disclosure. The connecting lines of the four electrical connection points14111,14211,14311,14411constitute the enclosed region17whose area is between 0.1 wavelength squared and 0.49 wavelength squared of the lowest operating frequency of the first communication band15. The area of the enclosed region17is smaller than the area of the second conductor layer12. The first conductor layer11and the second conductor layer12may also be implemented on a single-layer or multi-layer dielectric substrate. According to an embodiment of the disclosure, the shape of the second conductor layer12of the multi-feed antenna1is circular, and the shape of the second conductor layer12could also be square, rectangular, elliptical, rhombic, polygonal or other irregular shapes, or a slot shape, or a combination thereof. The signal sources1412,1422,1432,1442could be transmission lines, impedance matching circuits, amplifier circuits, feed-in networks, switch circuits, connector components, filter circuits, integrated circuit chips, or radio frequency front-end modules. The multi-feed antenna1could be configured in one set or multiple sets and applied to a multiple-input multiple-output antenna system, a pattern switching antenna system, or a beamforming antenna system. InFIG.1A, an embodiment of the multi-feed antenna1is disclosed. The multi-feed antenna1is designed with the four supporting conductor structures131,132,133,134to form the four electrically connected sections1311,1321,1331,1341at the second conductor layer12. Moreover, the four electrically connected sections1311,1321,1331,1341respectively extend from different side edges1211,1212,1213,1214of the second conductor layer12toward the first center position121, so that the second conductor layer12forms four mutually connected radiating conductor plates122,123,124,125. Thus, a technical effect of multi-antenna size reduction with the four co-excited and co-existed resonant modes14121,14221,14321,14421could be achieved (as shown inFIG.1C) successfully. The multi-feed antenna1is also designed by arranging the four feeding conductor lines141,142,143,144and the four supporting conductor structures131,132,133,134between the first conductor layer11and the second conductor layer12in an interleaved annular arrangement. Also, the four supporting conductor structures131,132,133,134are designed to form four different resonant spaces161,162,163,164in the region between the first conductor layer11and the second conductor layer12, and the four feeding conductor lines141,142,143,144are located in different resonant spaces161,162,163,164, respectively. Thus, good energy isolation could be achieved among the four resonant modes14121,14221,14321,14421(as shown inFIG.1D). The multi-feed antenna1is designed such that each of the coupling conductor plates1411,1421,1431,1441is spaced apart from a different one of the radiating conductor plates122,123,124,125at a coupling interval s1, s2, s3, s4respectively. Also, the gap of the coupling intervals s1, s2, s3, s4is designed to be between 0.005 wavelength and 0.088 wavelength of the lowest operating frequency of the first communication band15. Thus, good impedance matching could be achieved among the four resonant modes14121,14221,14321,14421(as shown inFIG.1C). The multi-feed antenna1is designed to have the gap of the first interval d1between 0.01 wavelength and 0.38 wavelength of the lowest operating frequency of the first communication band15, and the area of the second conductor layer12between 0.25 wavelength squared and 0.99 wavelength squared of the lowest operating frequency of the first communication band15. Also, the connecting lines of the four electrical connection points14111,14211,14311,14411of the four coupling conductor plates1411,1421,1431,1441are designed to constitute an enclosed region17whose area is between 0.1 wavelength squared and 0.49 wavelength squared of the lowest operating frequency of the first communication band15, and the area of the enclosed region17is smaller than the area of the second conductor layer12. Thus, the multi-feed antenna1could be excited to generate good radiation efficiency characteristics (as shown inFIG.1E). The multi-feed antenna1may be configured in one set or multiple sets and applied to a multiple-input multiple-output antenna system, a pattern switching antenna system, or a beamforming antenna system. Therefore, the multi-feed antenna1according to an embodiment of the disclosure could achieve the technical effect of multi-antenna integration with compatibility characteristics. FIG.1Cis a return loss curve diagram of the multi-feed antenna1according to an embodiment of the disclosure. The following dimensions were chosen for experimentation: the gap of the first interval d1is about 11 mm; the area of the second conductor layer12is approximately 2500 mm2; the area of the enclosed region17is approximately 733 mm2; the coupling intervals s1, s2, s3, s4are all about 2 mm. As shown inFIG.1C, the signal sources1412,1422,1432,1442excite the multi-feed antenna1to generate four resonant modes14121,14221,14321,14421with good impedance matchings, and the four resonant modes14121,14221,14321,14421cover at least one first communication band15. In this embodiment, the frequency range of the first communication band15is 3300 MHz to 5000 MHz, and the lowest operating frequency of the first communication band15is 3300 MHz.FIG.1Dis an isolation curve diagram of the multi-feed antenna1according to an embodiment of the disclosure. As shown inFIG.1D, the isolation curve between the signal source1412and the signal source1422is isolation curve141222, the isolation curve between the signal source1412and the signal source1442is isolation curve141242, and the isolation curve between the signal source1412and the signal source1432is isolation curve141232. As shown inFIG.1D, good isolation could be achieved between the signal source1412, the signal source1422, the signal source1432, and the signal source1442of the multi-feed antenna1.FIG.1Eis a radiation efficiency curve diagram of the multi-feed antenna1according to an embodiment of the disclosure. As shown inFIG.1E, the resonant modes14121and14221excited by the two adjacent signal sources1412and1422could both achieve good radiation efficiencies14122and14222. The positions of the two adjacent signal sources1432and1442are approximately symmetrical to the positions of the signal sources1412and1422. Therefore, the resonant modes14321and14421could also achieve good radiation efficiency characteristics. The operation of communication band and experimental data covered inFIG.1C,FIG.1D, andFIG.1Eare only for the purpose of experimentally verifying the technical effect of the multi-feed antenna1of the embodiment disclosed inFIG.1A. The aforementioned is not used to limit the communication bands, applications, and specifications that the multi-feed antenna1of the disclosure could cover in practical applications. The multi-feed antenna1may be configured in one set or multiple sets and applied to a multiple-input multiple-output antenna system, a pattern switching antenna system, or a beamforming antenna system. FIG.2Ais a structural diagram of a multi-feed antenna2according to an embodiment of the disclosure. As shown inFIG.2A, the multi-feed antenna2includes a first conductor layer21, a second conductor layer22, four supporting conductor structures231,232,233,234, and four feeding conductor lines241,242,243,244. The second conductor layer22has a first center position221, and the second conductor layer22is spaced apart from the first conductor layer21at a first interval d1. The four supporting conductor structures231,232,233,234are all located between the first conductor layer21and the second conductor layer22, and electrically connect the first conductor layer21and the second conductor layer22respectively. The four supporting conductor structures231,232,233,234form four electrically connected sections2311,2321,2331,2341at the second conductor layer22. Moreover, the four electrically connected sections2311,2321,2331,2341respectively extend from different side edges2211,2212,2213,2214of the second conductor layer22toward the first center position221, so that the second conductor layer22forms four mutually connected radiating conductor plates222,223,224,225. The supporting conductor structures231,232,234are all composed of a single conductor plate. The supporting conductor structure233is composed of two conductor plates. Different side edges2212,2214of the second conductor layer22are provided with slot structures22121,22141to reduce the area of the second conductor layer22. The four feeding conductor lines241,242,243,244are all located between the first conductor layer21and the second conductor layer22. The four feeding conductor lines241,242,243,244and the four supporting conductor structures231,232,233,234form an interleaved annular arrangement. Each of the feeding conductor lines241,242,243,244has one end electrically connected to an electrical connection point24111,24211,24311,24411(as shown inFIG.2B) of a coupling conductor plate2411,2421,2431,2441respectively. Each of the coupling conductor plates2411,2421,2431,2441is spaced apart from a different one of the radiating conductor plates222,223,224,225at a coupling interval s1, s2, s3, s4respectively. Each of the feeding conductor lines241,242,243,244has another end electrically connected to a signal source2412,2422,2432,2442respectively. The four feeding conductor lines241,242,243,244excite the second conductor layer22to generate at least four resonant modes24121,24221,24321,24421(as shown inFIG.2C), and the at least four resonant modes24121,24221,24321,24421cover at least one identical first communication band25. The coupling conductor plates2411,2421,2431,2441are located between the first conductor layer21and the second conductor layer22. The gap of the coupling intervals s1, s2, s3, s4is between 0.005 wavelength and 0.088 wavelength of the lowest operating frequency of the first communication band25. The four supporting conductor structures231,232,233,234form four different resonant spaces261,262,263,264in the region between the first conductor layer21and the second conductor layer22, and the four feeding conductor lines241,242,243,244are located in different resonant spaces261,262,263,264, respectively. The gap of the first interval d1is between 0.01 wavelength and 0.38 wavelength of the lowest operating frequency of the first communication band25. The area of the second conductor layer22is between 0.25 wavelength squared and 0.99 wavelength squared of the lowest operating frequency of the first communication band25.FIG.2Bis a structural diagram of an enclosed region27formed by connecting lines of the four electrical connection points24111,24211,24311,24411of the four coupling conductor plates2411,2421,2431,2441of the multi-feed antenna2according to an embodiment of the disclosure. The connecting lines of the four electrical connection points24111,24211,24311,24411constitute an enclosed region27whose area is between 0.1 wavelength squared and 0.49 wavelength squared of the lowest operating frequency of the first communication band25. The area of the enclosed region27is smaller than the area of the second conductor layer22. The gap of the slot structures22121,22141is between 0.005 wavelength and 0.088 wavelength of the lowest operating frequency of the first communication band25. The first conductor layer21and the second conductor layer22may also be implemented on a single-layer or multi-layer dielectric substrate. According to an embodiment of the disclosure, the shape of the second conductor layer22of the multi-feed antenna2is square, and the shape of the second conductor layer22may also be rectangular, circular, elliptical, rhombic, polygonal or other irregular shapes, or a combination of slot shapes. The signal sources2412,2422,2432,2442could be transmission lines, impedance matching circuits, amplifier circuits, feed-in networks, switch circuits, connector components, filter circuits, integrated circuit chips, or radio frequency front-end modules. The multi-feed antenna2may be configured in one set or multiple sets and applied to a multiple-input multiple-output antenna system, a pattern switching antenna system, or a beamforming antenna system. InFIG.2A, an embodiment of the multi-feed antenna2is disclosed. Although the supporting conductor structures231,232,234are designed to be composed of a single conductor plate, the supporting conductor structure233is composed of two conductor plates. Moreover, the different side edges2212,2214of the second conductor layer22are configured with the slot structures22121,22141to reduce the area of the second conductor layer. Also, the coupling conductor plates2411,2421,2431,2441are designed to be located between the first conductor layer21and the second conductor layer22. Therefore, the structure of the multi-feed antenna2of the embodiment and the multi-feed antenna1of the embodiment are not completely the same. However, the multi-feed antenna2is also designed with the four supporting conductor structures231,232,233,234to form the four electrically connected sections2311,2321,2331,2341at the second conductor layer22. Moreover, the four electrically connected sections2311,2321,2331,2341are similarly designed to respectively extend from different side edges2211,2212,2213,2214of the second conductor layer22toward the first center position221, so that the second conductor layer22forms four mutually connected radiating conductor plates222,223,224,225. Thus, a technical effect of reduction of the multi-antenna size with the four co-excited and co-existed resonant modes24121,24221,24321,24421could also be achieved (as shown inFIG.2C). The multi-feed antenna2is also designed by arranging the four feeding conductor lines241,242,243,244and the four supporting conductor structures231,232,233,234between the first conductor layer21and the second conductor layer22in an interleaved annular arrangement. Also, the four supporting conductor structures231,232,233,234are designed to form four different resonant spaces261,262,263,264in the region between the first conductor layer21and the second conductor layer22, and the four feeding conductor lines241,242,243,244are located in different resonant spaces261,262,263,264, respectively. Thus, good energy isolation could be achieved between the four resonant modes24121,24221,24321,24421(as shown inFIG.2D). The multi-feed antenna2is also designed such that each of the coupling conductor plates2411,2421,2431,2441is spaced apart from a different one of the radiating conductor plates222,223,224,225at a coupling interval s1, s2, s3, s4respectively. Also, the gap of the coupling intervals s1, s2, s3, s4is also designed to be between 0.005 wavelength and 0.088 wavelength of the lowest operating frequency of the first communication band25. Thus, good impedance matching of the four resonant modes24121,24221,24321,24421could also be achieved successfully (as shown inFIG.2C). The multi-feed antenna2is also designed to have the first interval d1between 0.01 wavelength and 0.38 wavelength of the lowest operating frequency of the first communication band25, and the area of the second conductor layer22between 0.25 wavelength squared and 0.99 wavelength squared of the lowest operating frequency of the first communication band25. Also, the connecting lines of the four electrical connection points24111,24211,24311,24411of the four coupling conductor plates2411,2421,2431,2441are also designed to constitute an enclosed region27(as shown inFIG.2B) whose area is also between 0.1 wavelength squared and 0.49 wavelength squared of the lowest operating frequency of the first communication band25, and the area of the enclosed region27is also smaller than the area of the second conductor layer22. Thus, the multi-feed antenna2could also be excited to generate good radiation efficiency characteristics (as shown inFIG.2E). The multi-feed antenna2may be configured in one set or multiple sets and applied to a multiple-input multiple-output antenna system, a pattern switching antenna system, or a beamforming antenna system. Therefore, the multi-feed antenna2of an embodiment of the disclosure could also achieve the same technical effect of multi-antenna integration with compatibility characteristics as the multi-feed antenna1of the embodiment. FIG.2Cis a return loss curve diagram of the multi-feed antenna2according to an embodiment of the disclosure. The following dimensions were chosen for experimentation: the gap of the first interval d1is about 10 mm; the area of the second conductor layer22is approximately 1521 mm2; the area of the enclosed region27is approximately 450 mm2; the coupling intervals s1, s2, s3, s4are all about 1 mm; the gap of the slot structures22121,22141is both about 3 mm. As shown inFIG.2C, the signal sources2412,2422,2432,2442excite the multi-feed antenna2to generate four resonant modes24121,24221,24321,24421with good impedance matching, and the four resonant modes24121,24221,24321,24421cover at least one first communication band25. In this embodiment, the frequency range of the first communication band25is 3300 MHz to 5000 MHz, and the lowest operating frequency of the first communication band25is 3300 MHz.FIG.2Dis an isolation curve diagram of the multi-feed antenna2according to an embodiment of the disclosure. As shown inFIG.2D, the isolation curve between the signal source2412and the signal source2422is isolation curve241222, the isolation curve between the signal source2412and the signal source2442is isolation curve241242, and the isolation curve between the signal source2412and the signal source2432is isolation curve241232. As shown inFIG.2D, good isolation could be achieved between the signal source2412, the signal source2422, the signal source2432, and the signal source2442of the multi-feed antenna2.FIG.2Eis a radiation efficiency curve diagram of the multi-feed antenna2according to an embodiment of the disclosure. As shown inFIG.2E, the resonant modes24121and24221excited by the two adjacent signal sources2412and2422both have good radiation efficiencies24122and24222. The configuration and positions of the two other adjacent signal sources2432and2442are approximately symmetrical to the signal sources2412and2422. Therefore, the resonant modes24321and24421could also achieve good radiation efficiency characteristics. The operation of communication band and experimental data covered inFIG.2C,FIG.2D, andFIG.2Eare only for the purpose of experimentally verifying the technical effect of the multi-feed antenna2of the embodiment disclosed inFIG.2A. The aforementioned is not used to limit the communication bands, applications, and specifications that the multi-feed antenna2of the disclosure could cover in practical applications. The multi-feed antenna2may be configured in one set or multiple sets and applied to a multiple-input multiple-output antenna system, a pattern switching antenna system, or a beamforming antenna system. In summary, although the disclosure has been described in detail with reference to the above embodiments, they are not intended to limit the disclosure. Those skilled in the art should understand that it is possible to make changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the protection scope of the disclosure shall be defined by the following claims. | 23,191 |
11862869 | DETAILED DESCRIPTION The detailed explanation of the disclosure is described as following. The described embodiments are presented for purposes of illustrations and description, and are not intended to limit the scope of the disclosure. Terms are used only to describe the specific embodiments, and not to limit the claims appended herewith. Unless otherwise specified, the term “a,” “an,” “one” or “the” of the singular form may also represent the plural form. In the following description and claims, the term “coupled” along with their derivatives, may be used. In some embodiments, “coupled” may be used to indicate that two or more elements are in direct physical or electrical contact with each other, or may also mean that two or more elements may not be in direct contact with each other. In this disclosure, each radiating member is a quarter-wavelength resonant monopole antenna. In addition, each radiating member further has an open slot, and the current may be branched into different paths to generate at least two different frequency bands. That is, the radiating member is capable of multiple frequency bands. The reflective plate array and the grounding plate are grounded jointly to avoid the surface wave effect caused by the voltage difference of different groundings. The substrate, the reflective plates arrayed on the first surface of the substrate, and the grounding plate on the second surface of the substrate form a meta-material structure with a negative refractive index. This meta-material exhibits left-hand characteristics different from the right-hand characteristics. Therefore, the meta-material structure may combine with the radiating member having right-handed characteristics to enable the overall antenna exhibiting combined left and right characteristics, thereby increase the operating bandwidth. In addition, parasitic capacitors generated between two adjacent reflective plates, together with inductive properties of the reflective plates, form a parallel LC circuit. The arrayed reflector plates have an infinite impedance at a resonance frequency and are capable of reflecting electromagnetic waves back to the radiating member. An effect similar to a notch filter is also achieved, such that the overall radiation pattern is directed to the top of the reflective plate array, and hence the antenna gain and the directivity of the antenna structure are further improved. FIGS.1A and1Bare top views respectively of the first surface and the second surface of an antenna structure100in accordance with one embodiment of the disclosure. The antenna structure100includes a substrate110, reflective plates120, a grounding plate130, a radiating member140and conductive vias150. The reflective plates120are on the first surface of the substrate110, and the grounding plate130and the radiating member140are on the second surface of the substrate110. The conductive vias150penetrate through the substrate110to respectively connect the reflective plates120to the grounding plate130. The substrate110contains liquid crystal polymer material, and the thickness of the substrate is ranged from about 100 μm to 400 μm. The reflective plates120are square patches arranged in an array of columns and rows on the first surface of the substrate110. Each reflective plate120has a length L120, and a gap G120is between two adjacent reflective plates120. In other embodiments, the reflective plates120may be rectangular patches with different lengths and widths.FIGS.1A and1Bare examples of 3×3 reflective plates120, i.e., the reflective plates120are arranged in an array of three columns and three rows. In other embodiments, the antenna structure100may have reflective plates120of different numbers and different arrangements. The grounding plate130is a rectangular patch and overlaps with the reflective plates120in a normal direction of the substrate110. Each reflective plate120may be electrically connected to the grounding plate130by the conductive vias150penetrating through the substrate110. The material of the reflective plates120and the grounding plate130may be, for example, copper, silver, gold, platinum, nickel, tin, and/or alloy of above metals or other suitable materials. The radiating member140is physically separated from the grounding plate130and does not overlap with the reflective plates120. The material of the radiating member140may be the same as the reflective plates120and the grounding plates130. The conductive vias150are respectively in the centers of the reflective plates120. However, the positions of the conductive vias150may vary depending on the number of the reflective plates120and/or the size and pattern of the radiating member140and are not limited to shown inFIGS.1A and1B. FIG.1Cis an enlarged top view of the radiating member140. As shown inFIG.1C, the radiating member140is a monopole antenna, which includes two radiating branches141,142, a signal feeding terminal143and an open slot144. The signal feeding terminal143is configured to couple with an external terminal, and the open slot144is defined by the radiating branches141and142, so that the radiating member140may generate at least two different frequency bands. The grounding plate130further has an opening131, the signal feeding terminal143is in the opening131, and a gap G140is between the signal feeding terminal143and the grounding plate130. The radiating branch141has a strip section with a length L1141and a width W1141and a rectangular block section with a length L2141and a width W2141. The radiating branch142has only one straight strip section, with a length L142and a width W142. The signal feeding terminal143is square and has a length L143. The open slot144is L-shaped and includes a first section with a length L1144and a width W144and a second section with a length L2144and a width W144. FIGS.2A and2Bare return loss simulation results respectively of the antenna structure100of an embodiment according to the disclosure and an antenna structure of a comparative example. In this embodiment, the length L120of the reflective plates120is 2.5-3.5 mm, the lengths L1141, L2141and the widths W1141, W2141of the sections of the radiating branch141are 0.5-3.0 mm, 0.25-2.75 mm, 0.05-0.15 mm and 0.15-0.25 mm respectively. The length L142and the width W142of the radiating branch142are respectively 0.40-2.90 mm and 0.05-0.15 mm. The length L1141of the radiating branch141is ranged from 0.23λ1to 0.25λ1, and the length L142of the radiating branch142is ranged from 0.23λ2to 0.25λ2, where λ1and λ2are wavelengths of resonance frequencies respectively corresponding to two different operating frequency bands. The antenna structure of the comparative example is the same as the antenna structure100shown inFIGS.1A and1Bwithout all reflective plates120. As shown inFIGS.2A and2B, the frequency bands corresponding to the first operating frequency and the second operating frequency are respectively 28.68-29.85 GHz and 35.55-42.37 GHz, while those of the comparative example are 28.68-29.85 GHz and 35.79-37.45 GHz. In other words, the bandwidths of this embodiment according to the disclosure are larger by 3.03 GHz and 5.12 GHz. In addition, the antenna gains at the first and second operating frequencies of this embodiment according to the disclosure may reach 4.3 dB and 5 dB respectively, which are 2.6 dB and 2.3 dB higher than those of the comparative example. As a result, the antenna structure100of the embodiment according to the disclosure has a larger bandwidth and a higher antenna gain for both the lower and higher frequencies in comparison to the comparative example. The disclosure may effectively enlarge the bandwidth and the antenna gain for any operating frequencies. FIG.3Ais a top view of the second surface of the antenna structure300in accordance to another embodiment of the disclosure. As shown inFIG.3A, the antenna structure300includes a substrate310, reflective plates320, a grounding plate330, a radiating member340and conductive vias350. The reflective plates320are on the first surface of the substrate310. The grounding plate330and the radiating member340are on the second surface of the substrate310, and are physically separated from each other. The conductive vias350penetrate through the substrate310to respectively connect the reflective plates320and the grounding plate330. The difference between the antenna structure300(shown inFIG.3A) and the antenna structure100(shown inFIGS.1A and1B) is shown inFIG.3B. The radiating member340includes a signal feeding branch341, a square radiating branch342, a signal feeding terminal343and an L-shaped open slot344. The two ends of the signal feeding branch341are respectively coupled to the radiating branch342and the signal feeding terminal343, the signal feeding terminal343is in the opening331of the grounding plate330to couple with an external terminal, and the open slot344is defined by the radiating branch342, so that the radiating member340is configured for generate two operating frequencies. In another embodiment, the radiative branch342may be rectangular with a different length and a different width. The substrate310, the reflective plates320, the grounding plate330and the conductive vias350are arranged similar to the substrate110, the reflective plates120, the grounding plate130and the conductive vias150of the antenna structure100, thus the description of the antenna structure100may be referred to. FIGS.4A and4Bare respectively top views of the first surface and the second surface of an antenna structure400in accordance to another embodiment of the disclosure. As shown inFIGS.4A and4B, the antenna structure400includes a substrate410, reflective plates420, grounding plates430A,430B, radiating members440A,440B and conductive vias450. The reflective plates420, the grounding plate430A and the radiating member440A are on the first surface of the substrate410and are electrically connected to each other. The grounding plate430B and the radiating member440B are on the second surface of the substrate410and are physically separated. The grounding plates430A and430B are overlapped in the normal direction of the substrate410, and the conductive vias450penetrate through the substrate410to respectively connect the reflective plates420and the grounding plate430B. The difference between the antenna structure400(shown inFIGS.4A and4B) and the antenna structure100(shown inFIGS.1A and1B) is that the radiating members440A and440B constitute a dipole antenna. As further shown inFIGS.4C and4D, the radiating member440A includes a strip grounding branch441A, two radiating branches442A,443A and an L-shaped open slot444A, and the radiating member440B includes a strip signal feeding branch441B, a signal feeding terminal442B, two radiating branches443B,444B and an L-shaped open slot445B. In the radiating member440A, the two ends of the grounding branch441A are respectively coupled to the grounding plate430A and the radiating branches442A and443A. In the radiating member440B, the two ends of the signal feeding branch441B are respectively coupled to the signal feeding terminal442B and the radiating branches443B and444B. The signal feeding terminal442B is in the opening431B of the grounding plate430B for coupling with an external terminal. The open slot444A is defined by the radiating branches442A and443A, and the open slot445B is defined by the radiating branches443B and444B, such that the radiating members440A and440B may generate two operating frequencies. In addition, the grounding branch441A and the signal feeding branch441B may be overlapped in the normal direction of the substrate410. The grounding plates430A and430B may be electrically connected with each other via an extra conductive via (not shown) that penetrates through the substrate410. The substrate410, the reflective plates420, the grounding plate430B and the conductive vias450are respectively similar to the substrate110, the reflective plates120, the grounding plate130and the conductive vias150of the antenna structure100, and thus the description of the antenna structure100may be referred to. FIG.5Ais a top view of the second surface of an antenna structure500in accordance to another embodiment of the disclosure. As shown inFIG.5A, the antenna structure500includes a substrate510, reflective plates520, a grounding plate530, a radiating member540and conductive vias550. The reflective plates520are on the first surface of the substrate510, and the grounding plate530and the radiating member540are on the second surface of the substrate510. The conductive vias550penetrate through the substrate510to respectively connect the reflective plates520and the grounding plate530. The difference between the antenna structure500(shown inFIG.5A) and the antenna structure100(shown inFIGS.1A and1B) is that the radiating member540has a signal feeding branch541, a signal feeding terminal542, a grounding branch543, a radiating branch544and an L-shaped open slot545. One end of the signal feeding branch541and one end of the grounding branch543are coupled to the radiating branch544. The other end of the signal feeding branch541is coupled to the signal feeding terminal542, and the other end of the grounding branch543is coupled to the grounding plate530. The signal feeding terminal542is in an opening531of the grounding plate530for coupling with an external terminal, the radiating terminal of the radiating branch544is formed of two radiating branches546,547which define the open slot545, such that the radiating member540can be configured for generate two operating frequencies. The substrate510, the reflective plates520, the grounding plate530and the conductive vias550are similar to the substrate110, the reflective plates120, the grounding plate130and the conductive vias150of the antenna structure100, and thus the description of the antenna structure100may be referred to. FIG.6is a top view of a first surface of an antenna structure600in accordance to another embodiment of the disclosure. The antenna structure600shown inFIG.6includes a substrate610, reflective plates620, a grounding plate630, a radiating member640and conductive vias650. The reflective plates620are on the first surface of the substrate610, and the grounding plate630and the radiating member640are on the second surface of the substrate610and are physically separated. The conductive vias650penetrate through the substrate610to respectively connect the reflective plates620and the grounding plate630. The difference between the antenna structure600(shown inFIG.6) and the antenna structure100(shown inFIGS.1A and1B) is that each reflective plate620is shaped in a cross. The substrate610, the grounding plate630, the radiating member640and the conductive vias650are similar to the substrate110, the grounding plate130, the radiating member140and the conductive vias150of the antenna structure100, and thus the description of the antenna structure100may be referred to. FIG.7is a top view of the first surface of an antenna structure700in accordance to another embodiment of the disclosure. As shown inFIG.7, the antenna structure700includes a substrate710, reflective plates720, a grounding plate730, a radiating member740and conductive vias750. The reflective plates720are on the first surface of the substrate710, and the grounding plate730and the radiating member740are on the second surface of the substrate710and are physically separated. The conductive vias750penetrates through the substrate710to respectively connect the reflective plates720and the grounding plate730. The difference between the antenna structure700(shown inFIG.7) and the antenna structure100(shown inFIGS.1A and1B) is that each reflective plate720is shaped in a circle. The substrate710, the grounding plate730, the radiating member740and the conductive vias750are similar to the substrate110, the grounding plate130, the radiating member140and the conductive vias150of the antenna structure100, and thus the description of the antenna structure100may be referred to. FIG.8is a top view of the first surface of an antenna structure800in accordance to another embodiment of the disclosure. The antenna structure800shown inFIG.8includes a substrate810, reflective plates820, a grounding plate830, a radiating member840and conductive vias850. The reflective plates820are on the first surface of the substrate810, and the grounding plate830and the radiating member840are on the second surface of the substrate810and are physically separated. The conductive vias850penetrate through the substrate810to respectively connect the reflective plates820and the grounding plate830. The difference between the antenna structure800(shown inFIG.8) and the antenna structure100(shown inFIGS.1A and1B) is that the reflective plates820are rectangular frames arranged corresponding to the conductive vias850. The substrate810, the grounding plate830and the radiating member840are similar to the substrate110, the grounding plate130and the radiating member140of the antenna structure100, and thus the description of the antenna structure100may be referred to. FIG.9Ais a top view of the first surface of an antenna structure900in accordance to another further embodiment of the disclosure. The antenna structure900includes a substrate910, reflective plates920, the grounding plate930, the radiating member940and conductive vias950. In comparison to the substrate110of the antenna structure100, the substrate910is bendable and includes a planar portion910A, a bendable portion910B and a protruded portion910C. The reflective plates920, the grounding plate930, the radiating member940and the conductive vias950may be similar to the reflective plates120, the grounding plate130, the radiating member140and the conductive vias150of the antenna structure100. FIGS.9B and9Care a stereoscopic view and a side view of the antenna structure900after being bent. As shown inFIGS.9B and9C, the planar portion910A is approximately perpendicular to the protruded portion910C. The reflective plates920are arranged in the planar portion910A in this embodiment, but may also extend from the planar portion910A to the protruded portion910C through the bendable portion910B in other embodiments. The grounding plate930and the conductive vias950are in the planar portion910A, and the radiating member940is in the protruded portion910C. It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims. | 18,767 |
11862870 | DETAILED DESCRIPTION Embodiments of the subject invention provide novel and advantageous antenna arrays (e.g., reflectarrays, transmitarrays, and phased arrays) with three-dimensional (3D) conformal radiating elements, as well as methods of manufacturing and methods of using the same. An array can include a ground plane and a plurality of unit cells disposed thereon. Each unit cell can include a 3D conformal radiating element. The 3D conformal radiating elements can be, for example, patches (e.g., circular 3D patches), dipoles, or loops, but each radiating element must be conformal on a hemispherical shape. Each radiating element can comprise any suitable conductive material (e.g., copper, silver, aluminum, steel, copper paint, conductive polylactic acid (PLA), or conductive filament). Each unit cell can include a substrate (which can be an electrically insulating substrate, such as a plastic material) on which the conformal radiating elements is disposed, though such a substrate is not required. Each unit cell can be disposed directly adjacent to at least one other unit cell (i.e., in direct physical contact with at least one other unit cell, with no elements disposed therebetween). The need for mobile coverage in challenging locations (e.g., narrow streets) requires high gain aperture antennas with a wide beamwidth coverage (up to 60° beam direction), preferably with a flat (or substantially flat compared to the height of the building) aperture on buildings.FIG.1Ashows an antenna on the side of a building, andFIG.1Bshows an example of multiple antennas on buildings along a road, illustrating the need for up to 60° beam direction wide beamwidth coverage. Embodiments of the subject invention provide relatively flat (relative to the height of a building or streetlight post; e.g., thickness of no more than 50 millimeters (mm), or even no more than 40 mm, no more than 30 mm, no more than 20 mm, no more than 10 mm, no more than 5 mm, or no more than 3 mm) antenna arrays able to provide a beamwidth coverage of at least 60° while maintaining a small footprint (e.g., on buildings or streetlights). Increasing the beamwidth of the radiating elements of the array is a key enabler to enhance the performance of array antennas (e.g., reflectarray, transmitarray, phased array) when designed to have a beam directed toward steep angles (e.g., at least 60°). FIGS.2A and2Bshow a reflectarray, which is an antenna comprising a flat or slightly curved reflecting surface and an illuminating feed antenna. On the reflecting surface, there are many radiating elements, and the feed antenna spatially illuminates these reflectarray elements that are redesigned to reradiate and scatter the incident field with electrical phases that are required to form a planar phase front in the far—field distance. Different methods can be used for reflectarray elements to achieve a planar phase front. One such method is using variable size patches so that elements can have different scattering impedances and, thus, different phases to compensate for the different feed—path delays. Classical flat printed circuit board (PCB) arrays have limited beamsteering performance of no more than 45° if a 3 decibel (dB) gain beamwidth from the broadside is considered. An efficient reflectarray antenna is one in which each unit cell comprises five parallel dipoles, as shown inFIG.3A. Referring toFIG.3B, this unit cell provides a linear reflection phase range up to 440°. Referring toFIGS.4and5, the array has limited beamsteering performance up to 45° if a 3 dB gain beamwidth drop from the broadside is considered. Additionally, beyond 45°, the gain drops drastically with an increase of grating lobes and side lobes levels (SLLs). FIGS.6A and6Bshow a perspective view and a side view, respectively, of a unit cell of an antenna array, the unit cell having a 3D conformal patch radiating element, according to an embodiment of the subject invention. Though certain dimensions are shown inFIGS.6A and6B, this is for exemplary purposes and should not be construed as limiting. Referring toFIGS.6A and6B, the unit cell can include a substrate disposed on a ground plane, and a 3D conformal patch (e.g., a 3D conformal circular patch) disposed on the substrate. The patch can comprise a conductive material, including but not limited to copper, silver, aluminum, steel, copper paint, conductive PLA, and/or conductive filament. The radius or greatest width of each unit cell can be, for example, 0.5 times the wavelength (λ) of the electromagnetic radiation applied to the unit cell. The maximum height of the unit cell, and therefore the thickness of the array, can be, for example, any of the following values, about any of the following values, at least any of the following values, not more than any of the following values, or within any range having any of the following values as endpoints (all numerical values are in mm): 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, 10, 15, 20, 30, 40, or 50. For example, the maximum height of the unit cell, and therefore the thickness of the array, can be 1.5 mm or about 1.5 mm. FIG.7shows a plot of phase versus patch angle size for the unit cell shown inFIGS.6A and6B. Referring toFIG.7, the unit cell can provide a reflection phase range up to 313°. Embodiments of the subject invention can provide array (e.g., phased arrays, reflectarray, and/or transmitarray) unit cells with an increase of the beamwidth scanning to 60° (or even more) with a 3 dB gain drop (or less) from the broadside direction. This corresponds to at least an additional 15° over the reflectarray with unit cells having five parallel dipoles (beamwidth coverage of 45°). Thus, high gain antennas for steep beam directions can be designed and implemented to satisfy 5G/6G backhauling electromagnetic requirements while maintaining a small footprint and flat (e.g., thickness of no more than 50 mm, or in some cases no more than 40 mm, no more than 30 mm, no more than 20 mm, no more than 10 mm, no more than 5 mm, or no more than 3 mm). FIG.8shows an overhead view of a reflectarray antenna made from unit cells where each unit cell is the unit cell fromFIGS.6A and6B. The reflectarray shows many unit cells, where each small circular shape is the conformal patch radiating element of a unit cell.FIG.9shows a plot of realized gain versus theta for the reflectarray shown inFIG.8, with inter-element spacing of 0.5λ, aperture size (D; see also dimension noted inFIG.8) of 30λ, offset feed of 20°; and frequency of 16 gigahertz (GHz), where k is the wavelength of the electromagnetic radiation applied to the array and/or unit cell. Referring toFIG.9, the 3D conformal patch radiating element has an enhanced beamsteering performance of at least 60° if a 3 dB gain beamwidth drop from the broadside is considered. Additionally, the grating lobes levels and SLLs are smaller compared to the five parallel dipoles reflectarray (seeFIGS.3A,3B,4, and5). In certain embodiments, the 3D conformal radiating element of each unit cell can be electrically connected with the 3D conformal radiating element of at least one adjacent unit cell of the array. In certain embodiments, the substrate of each unit cell can be in direct, physical contact with the substrate of at least one adjacent unit cell of the array. In certain embodiments, the 3D conformal radiating element of each unit cell can be in direct, physical contact with the 3D conformal radiating element of at least one adjacent unit cell of the array. In certain embodiments, the array can comprise a single, monolithic ground plane on which each unit cell is disposed. FIGS.10A and10Bshow, respectively, overhead views of a flat PCB reflectarray antenna (made from unit cells where each unit cell is the unit cell fromFIG.3A) and a reflectarray antenna made from unit cells where each unit cell is the unit cell fromFIGS.6A and6B. The table inFIG.11shows a comparison in performance of the reflectarray ofFIG.10A(the columns labeled “parallel dipoles”) and the reflectarray ofFIG.10B(the columns labeled “curved patch”; a reflectarray according to an embodiment of the subject invention). Referring toFIG.11, the 3D conformal patch radiating element has an enhanced beamsteering performance of at least 60° if a 3 dB gain beamwidth drop from the broadside is considered. Specifically, between 40° and 60° beam angles, the 3D conformal patch radiating element reflectarray provides a higher gain while the grating lobes levels and SLLs are smaller compared to the five parallel dipoles reflectarray. Further the 3D conformal patch radiating element array can achieve the same gain as classical planar reflectarrays while using an aperture that is three times smaller or two times smaller if the desired beam direction is at 50° or 60°, respectively. Though a unit cell with a 3D conformal patch (e.g., a 3D conformal circular patch) is discussed in detail herein, embodiments are not limited thereto. Any type of radiating element can be used, such as dipoles and/or loops. The only requirement is that the radiating element must be 3D and must be conformal on a hemispherical shape. The array can be made by, for example, printing it (e.g., 3D printing) with a polymer (e.g., a plastic such as a thermoplastic and/or amorphous polymer such as acrylonitrile butadiene styrene (ABS)) or a similar material (which can serve as the substrate). The array can then be metallized with one or more metals as the conductive material for the radiating elements. FIGS.12A and12Bshow a perspective view and a side view, respectively, of a unit cell of an antenna array, the unit cell having a 3D conformal radiating element, according to an embodiment of the subject invention.FIG.12C shows a plot of phase versus angle size for the unit cell shown inFIGS.12A and12B. Referring toFIGS.12A and12B, the conformal element can have portions cut out or missing (e.g., four cut-out portions spaced equidistantly from each other circumferentially around the conformal element). The portion labeled “via” inFIGS.12A and12Bcan be part of the radiating element (i.e., formed of a conductive material, which can be the same or different from that of the “conformal element”), or it can a substrate. That is, the substrate can be omitted, with the “via” being in direct physical contact with the ground plane. FIG.13shows a perspective view of a unit cell of an antenna array, the unit cell having 3D conformal radiating elements, according to an embodiment of the subject invention. The unit cell inFIG.13has curved parallel dipoles in air. Although three curved parallel dipoles are depicted inFIG.13, this is for exemplary purposes and should not be construed as limiting.FIG.14shows a plot of phase versus angle size for the unit cell shown inFIG.13. Referring toFIG.13, the curved dipoles can be disposed in a staggered manner such that the base portion in direct physical contact with the ground plane are not all aligned with each other in a lateral direction parallel to the upper surface of the ground plane (e.g., in the example inFIG.13, the leftmost and rightmost dipoles have their base portions are aligned, or disposed along the same imaginary line in the lateral direction, while the base portion of the middle dipole is not aligned, such that it is not disposed along the same imaginary line in the lateral direction with the base portions of the other two dipoles). In an embodiment, an active array (e.g., active reflectarray) can dynamically steer its beam.FIGS.15A-15D and16show an example of a unit cell of such an array. Referring toFIGS.15A-15D and16, a plurality of conformal dipole arms can be disposed on a substrate, which can be disposed on a ground plane. Each dipole arm can be connected to an electrically conductive center section via a respective switch (e.g., radio frequency (RF) switch) that can be switched on or off. When the switch is on for a particular dipole arm, that dipole arm is active, and when the switch is off for a particular dipole arm, that dipole arm is passive (i.e., not active). A given state of the unit cell can include, for example two diametrically opposed dipole arms being active while the remaining dipole arms are passive, as depicted inFIGS.15C,15D, and16. The example depicted inFIGS.15A-15D and16shows eighteen dipole arms (nine diametrically opposed pairs), and this is for exemplary purposes only; any suitable number of dipole arms could be used, and each diametrically opposed dipole pair can provide a different state. FIG.17shows top views of the unit cell shown inFIGS.15A-15C, in nine different states based on which dipoles are active. In each state, the active dipoles are labeled, and all unlabeled dipoles are passive. Also, as seen inFIG.17, in each state a diametrically opposed dipole pair (or linear dipole pair) is active. The different states (e.g., nine states) of phase for beamsteering reflectarray applications can be achieved by integrating switches (e.g., RF switches) in a rotation-invariant geometry, so that selectively actuating some of the lumped elements implements the “electromagnetic rotation” of the element. Eighteen RF switches are present on the unit cell in the example depicted inFIGS.15-17(two RF switches for each linear dipole or a set of a reflection phase) to achieve nine operation states. The unit cell has nine dipoles, the arms of each dipole being connected to its linear dipole (or diametrically opposed dipole) using two switches. Depending on the state of the switch, the dipole arm is either active (switch is on) or passive (switch is off). FIG.18shows a top view of a reflectarray, each unit cell of which is the unit cell shown inFIGS.15A-15C. Each unit cell can have any pair of dipoles active according to the needs of the user. The active dipoles can be changed when needed/desired using the RF switches within each respective unit cell. ThoughFIG.18shows a 4×3 reflectarray, this is for exemplary purposes and should not be construed as limiting. Each unit cell can have the same dipole pair active as every other unit cell; or the unit cells can have different dipole pairs active at any given time (where some unit cells may have the same dipole pair active as some other unit cells). Depending on the states of the unit cells, the reflectarray can steer a circularly polarized beam. The array can steer the beam at least 60° while maximizing gain, thereby improving link performance. In an embodiment, a transmitarray can comprise a 3D conformal radiating element on each surface of the ground plane.FIGS.19A and19Bshow a perspective view and a side view, respectively, of a unit cell of a transmitarray, the unit cell having a 3D conformal patch radiating element, according to an embodiment of the subject invention. Referring toFIGS.19A and19B, a transmitting layer can be disposed on a first surface of the ground plane and a receiving layer can be disposed on a second surface of the ground plane opposite to the first surface. Each of the transmitting layer and receiving layer can comprise a substrate disposed on the ground plane and a 3D conformal radiating element (e.g., a 3D conformal patch) disposed on the substrate. The unit cell can include a via going through the substrate of the transmitting layer, the ground plane, and the substrate of the receiving layer, electrically connecting the 3D conformal radiating element of the transmitting layer with the 3D conformal radiating element of the receiving layer. The via can be in direct physical contact with the 3D conformal radiating element of the transmitting layer and/or the 3D conformal radiating element of the receiving layer Embodiments of the subject invention provide antenna arrays that are low cost and easy to fabricate. Unit cells as disclosed herein have not been used in the related art for reflectarrays or transmitarrays. The unit cells of the arrays can achieve high gain and efficiency offering a beamwidth coverage of at least 60°. The arrays can provide enhanced capabilities in existing mobile (e.g., 5G/6G) and satellite communications systems. The term 3D radiating element (or 3D conformal radiating element), as used herein, requires that the radiating element extends significantly (e.g., a distance that is at least 25% of a diameter or greatest width of the radiating element) above the surface of the ground plane on which it is disposed. That is, while traditional radiating elements (e.g., patch-style, dipole-style, and loop-style radiating elements) may in some cases have some incidental amount of conductive material that extends above the surface of the ground plane, this will be negligible in height compared to the width of the radiating element and, therefore, traditional radiating elements are not included in the term 3D radiating elements. The transitional term “comprising,” “comprises,” or “comprise” is inclusive or open-ended and does not exclude additional, unrecited elements or method steps. By contrast, the transitional phrase “consisting of” excludes any element, step, or ingredient not specified in the claim. The phrases “consisting” or “consists essentially of” indicate that the claim encompasses embodiments containing the specified materials or steps and those that do not materially affect the basic and novel characteristic(s) of the claim. Use of the term “comprising” contemplates other embodiments that “consist” or “consisting essentially of” the recited component(s). When ranges are used herein, such as for dose ranges, combinations and subcombinations of ranges (e.g., subranges within the disclosed range), specific embodiments therein are intended to be explicitly included. When the term “about” is used herein, in conjunction with a numerical value, it is understood that the value can be in a range of 95% of the value to 105% of the value, i.e. the value can be +/−5% of the stated value. For example, “about 1 kg” means from 0.95 kg to 1.05 kg. It should be understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application. All patents, patent applications, provisional applications, and publications referred to or cited herein are incorporated by reference in their entirety, including all figures and tables, to the extent they are not inconsistent with the explicit teachings of this specification. | 18,662 |
11862871 | DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS The present invention generally relates to systems and methods for a digitally beamformed phased array feed. In embodiments, the digitally beamformed phased array feed may be used in conjunction with a parabolic reflector. In embodiments, the present invention generally relates to systems and methods for a large form-factor phased array utilizing a plurality of multi-band software defined antenna array tiles. Digital Beamforming FIG.1is a schematic illustration of the current state of practice for antenna beamforming technology. Existing satellite antennas100are designed to receive or transmit radio waves to or from a flight object108. As used here, the term flight object108refers to satellites, flight test assets, missiles, and airplanes, to name a few. Each satellite antenna100is designed to receive electromagnetic waves having a specific frequency range. For example, a satellite antenna100having an L-band102transmission may receive and transmit frequencies ranging from 1.0 to 2.0 gigahertz (GHz); an antenna100having a C-band104transmission may receive and transmit frequencies ranging from 4.0 to 8.0 GHz; and an antenna100having an S-band106transmission may receive and transmit frequencies ranging from 2.0 to 4.0 GHz. Because of the current limitations on antenna beamforming technology, each satellite antenna100may receive or transmit electromagnetic waves in one frequency range at a time. Additionally, due to existing beamforming techniques, each satellite antenna100may only communicate with one flight object108at a time. FIGS.12-14are schematic illustrations of the current state of practice for antenna beamforming technology. The efficiency and directive qualities of an antenna may be measured by its gain. Gain is the ratio of the power received by the antenna from a source along its beam axis to the power received by a hypothetical lossless isotropic antenna, which is equally sensitive to signals from all directions. The gain of a parabolic antenna is: G=4πAλ2eA where A is the area of the antenna aperture; λ is the wavelength of the radio waves; and eAis aperture efficiency, a dimensionless parameter between 0 and 1 which measures how effective an antenna is at receiving the power of electromagnetic radiation. The ratio is typically expressed in decibels-isotropic (dBi). Referring toFIG.12, when a parabolic surface is under-illuminated, the feed pattern is tight and directive, thereby only illuminating the center of the parabolic surface. Referring toFIG.13, in the case of over illumination of a parabolic surface, radiation from the feed falls outside of the edges of the parabolic surface. This “spillover” of the feed is wasted, reducing the gain of the antenna and increasing the sidelobes of the radiation pattern, which represent unwanted radiation in undesired directions. Spillover may also cause the side lobes to pick up interfering signals, creating high system noise temperature which causes a decrease in performance and aperture efficiency. Referring toFIG.14, for most antenna feeds, the optimal illumination is achieved when the power radiated by the feed horn is 10 dB less at the edge of the dish than its maximum value at the center of the dish. In traditional antenna systems, a parabolic reflector and antenna may be fitted for transmitting and receiving frequencies within a specific bandwidth (e.g., an L-band transmission may have a range of 1.0 to 2.0 GHz) in order to achieve optimal illumination. This means that the antenna and parabolic surface are designed with a focal length to diameter ratio that creates optimal system gain at frequencies within a desired bandwidth. For example, a typical focal length to diameter ratio may range from 0.3 to 0.4, depending on the desired bandwidth. However, these systems are static in that they cannot be adjusted to receive and transmit frequencies at varying bandwidths while maintaining optimal illumination, without physically replacing the feed of the antenna. In embodiments, the digitally beamformed phased array system may use amplitude tapering to broaden an antenna beam, as discussed in further detail below. Traditionally, phased array tapering has provided a method to reduce antenna sidelobes at some expense to increasing the antenna gain and the main lobe beam width. However, it is the object of this invention, in embodiments, to broaden the main lobe beam as much as possible, such that the main lobe of the beam may be controlled and directed to a plurality of frequencies within a plurality of bandwidths simultaneously. Phased array tapering in accordance with embodiments of this invention may be used to apply a complex taper across the aperture to shape the sum main lobe beam based on mission requirements. In embodiments, amplitude tapering through beam broadening tapering may provide a solution to the narrow applicability problem of traditional antenna systems. In embodiments, the digitally beamformed array system may use beam broadening tapering to receive and transmit a plurality of signals having frequencies within a plurality of bandwidths simultaneously. In embodiments, the digitally beamformed phased array system may use amplitude tapering to maximize beam broadening so as to optimize performance of the system. FIGS.1A-1Bare schematic illustrations of a system for a digitally beamformed phased array feed210in accordance with embodiments of the present invention. In embodiments, a wide area scanning parabolic apparatus200which implements the digitally beamformed phased array feed210may receive or transmit frequencies having various transmission bandwidths. In embodiments, for example, the digitally beamformed phased array feed210may receive and transmit L-band102, C-band104, and S-band106frequencies simultaneously. In embodiments, the digitally beamformed phased array feed210may receive and transmit frequencies to and from a plurality of flight objects108(e.g., 4 in this example) at the same time. In embodiments, the digitally beamformed phased array feed210may be fitted on an existing parabolic reflector system having a parabolic reflector114and support pedestal112. In embodiments, the parabolic reflector system may be operatively connected to a digital software system704via a pedestal controller124. In embodiments, parabolic reflector system may receive and transmit angular direction information associated with the parabolic reflector system from the digital software system704via the pedestal controller124. In embodiments, the pedestal controller124may be used to control the movement and rotation of the parabolic reflector system based on the angular direction information transmitted by the digital software system704. FIG.1Cis a schematic illustration of a system for a digitally beamformed phased array feed210in accordance with another embodiment of the present invention. In embodiments, the digitally beamformed phased array feed210may be implemented by a large form-factor phased array terminal120which includes a plurality of utilizing a plurality of multi-band software defined antenna array tiles110, which may be used to scale the scanning capabilities of the system. In embodiments, for example, the plurality of multi-band software defined antenna array tiles110may receive and transmit a plurality of L-band102, C-band104, and S-band106frequencies simultaneously. In embodiments, the plurality of multi-band software defined antenna array tiles110may receive and transmit frequencies to and from various flight objects108at the same time. FIGS.2-2Ais a schematic illustration of a system for a digitally beamformed phased array feed210in conjunction with a wide area scanning parabolic apparatus200in accordance with embodiments of the present invention. In embodiments, the digitally beamformed phased array feed210of the wide area scanning parabolic apparatus200may include a multi-band software defined antenna tile110. FIG.2Bis a schematic illustration of a system for a digitally beamformed phased array feed210in conjunction with a large form-factor phased array120in accordance with another embodiment of the present invention. In embodiments, the large form-factor phased array120may include the plurality of operatively connected multi-band software defined antenna tiles110. In embodiments, the large form-factor phased array120, may for example, be 16 ft. 8 in. long and 6 ft. 8 in. wide. In embodiments, the large form-factor phased array120may be mounted on a flat rack122. FIG.3is a schematic illustration of a cross sectional view of a system for a digitally beamformed phased array feed210in conjunction with a parabolic reflector in accordance with embodiments of the present invention. In embodiments, the digitally beamformed phased array feed210may include a radome302, a multi-band software defined antenna tile110, a thermal management subsystem308, and a power and clock management subsystem314. In embodiments, the radome302may be configured to allow electromagnetic waves to propagate through it. In embodiments the radome302may be configured to protect the elements of the digitally beamformed phased array feed system210from weather or other hazards. In embodiments, the multi-band software defined antenna tile110may include a plurality of coupled dipole array antenna elements304, a plurality of frequency converters310, and a plurality of digital beamformers306. In embodiments, the plurality of coupled dipole array elements304may be configured to receive and transmit a plurality of respective first modulated signals associated with a plurality of respective radio frequencies. In embodiments the plurality of coupled dipole array antenna elements may be tightly coupled relative to the wavelength of operation. In embodiments, the plurality of coupled dipole array antenna elements may be spaced at less than half a wavelength. In embodiments, each coupled dipole array antenna element304may include a principal polarization component304-P oriented in a first direction and an orthogonal polarization component304-O oriented in a second direction. In embodiments, a first pair of the frequency converters310-1of the plurality of frequency converters310may be operatively connected to a respective coupled dipole array element304-1of the plurality of coupled dipole array antenna elements304. In embodiments, the plurality of frequency converters310may include a plurality of pairs of frequency converters310. In embodiments, each pair of frequency converters310-nof the plurality of pairs of frequency converters310may include a principal polarization converter corresponding to a respective principal polarization component310-P of a respective coupled dipole array antenna element304-P, and an orthogonal polarization converter310-O corresponding to a respective orthogonal polarization component304-O of a respective coupled dipole array antenna element. In embodiments, a second pair of frequency converters310-2of the plurality of frequency converters310may be operatively connected to a respective coupled dipole array element304-2of the plurality of coupled dipole array antenna elements304. In embodiments, the second pair of frequency converters310-2may include a principal polarization converter310-2P and an orthogonal polarization converter310-2O. In embodiments, the plurality of pairs of frequency converters310may include thermoelectric coolers which may be configured to actively manage thermally the system noise temperature and increase the system gain over temperature. In embodiments, each respective principal polarization frequency converter310-P and each respective orthogonal polarization frequency converter310-O may include a thermoelectric cooler. In embodiments, the plurality of pairs of frequency converters310may further include a plurality of spatially distributed high-power amplifiers so as to increase the effective isotropic radiated power. In embodiments, each principal polarization converter310-P and each orthogonal polarization converter310-O may be configured to receive respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from the respective coupled dipole array antenna elements304-nof the plurality of antenna elements304. In embodiments, the respective radio frequencies may be between 900 MHz and 6000 MHz. In embodiments, the respective radio frequencies may be between 2000 MHz and 12000 MHz. In embodiments, the respective radio frequencies may be between 10000 MHz and 50000 MHz. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to convert the respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies into respective second modulated signals having a first intermediate frequency. In embodiments, the first intermediate frequency may be between 50 MHz and 1250 MHz. In embodiments, a respective intermediate frequency may be associated with a mission center radio frequency. In embodiments, the mission center radio frequency may be a desired frequency of operation for receiving and transmitting modulated signals associated with a respective coupled dipole array antenna element304-n. For example, in embodiments, a first antenna element304-1may correspond to a desired frequency of operation associated with a first mission center radio frequency, and a second antenna element304-2may correspond to a desired frequency of operation associated with a second mission center radio frequency. Referring toFIG.19, in embodiments, the process of obtaining the mission center radio frequency associated with a respective coupled dipole array antenna element304may begin with step S1902. At step S1902, in embodiments, the process may include receiving, from a digital software system interface704via a system controller412by memory of the digitally beamformed phased array system210, for the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective mission center radio frequency. At step S1904, in embodiments, the process of obtaining the mission center radio frequency may continue with step of storing, by memory operatively connected to the system controller412, the respective mission center radio frequency for the respective coupled dipole antenna array element304-n. At step S1906, in embodiments, the process of obtaining the mission center radio frequency may continue with the step of transporting, from the memory to the respective principal polarization frequency converter310-P and the respective orthogonal polarization frequency converter310-O, the respective mission center radio frequency for the respective coupled dipole array antenna element304-n. In embodiments, the respective intermediate frequency may be a respective mission intermediate frequency corresponding to the respective mission center radio frequency. Referring toFIG.20, in embodiments, the process of obtaining the respective mission intermediate frequency associated with a respective antenna element304may begin with step S2002. At step S2002, in embodiments, the process may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed phased array system210, for the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective mission intermediate frequency. At step S2004, in embodiments, the process of obtaining the mission intermediate frequency may continue with step of storing, by memory operatively connected to the system controller412, the respective mission intermediate frequency for the respective coupled dipole antenna array element304-n. At step S2006, in embodiments, the process of obtaining the mission intermediate frequency may continue with the step of transporting, from the memory to the respective principal polarization frequency converter310-P and the respective orthogonal polarization frequency converter310-O, the respective mission intermediate frequency for the respective coupled dipole array antenna element304-n. In embodiments, the plurality of digital beamformers306may be operatively connected to the plurality of pairs of frequency converters310wherein each digital beamformer306-nmay be operatively connected to one of the respective principal polarization converter310-P and the respective orthogonal polarization converter310-O. In embodiments, each digital beamformer306-nmay be configured to receive the respective second modulated signals associated with the first intermediate frequency. In embodiments, each digital beamformer306-nmay be configured to convert the respective second modulated signal from an analog signal to a digital data format. In embodiments, the digital beamformer306-nmay be configured to convert the respective second modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, each digital beamformer306-nmay be configured to generate a plurality of channels of the digital data by decimation of the digital data using a polyphase channelizer and filter using a plurality of cascaded halfband filters. In embodiments, each digital beamformer306-nmay be configured to select one of the plurality of channels. In embodiments, each digital beamformer306-nmay be configured to select one of the plurality of channels using a multiplexer. In embodiments, the multiplexer selection may be provided by the system controller412. Referring toFIG.21, in embodiments, the process of selecting a respective channel may begin with step S2102. At step2102, in embodiments, the process may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed phased array system210, for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective channel selection. At step S2104, in embodiments, the process of selecting the respective channel may continue with step of storing, by memory operatively connected to the system controller412, the respective mission channel selection for the respective principal polarization component310-P and the respective orthogonal polarization component310-O of the respective coupled dipole antenna array element304-n. At step S2106, in embodiments, the process of selecting the respective channel may continue with step of transporting, the respective channel selection for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-n. In embodiments, the respective channel selection may be associated with a respective tuner channel frequency. In embodiments, the respective tuner channel frequency may correspond to the respective mission intermediate frequency. In embodiments, each digital beamformer306-nmay be configured to apply a first weighting factor to the digital data associated with the selected one of the plurality of channels to generate a first intermediate partial beamformed data stream. In embodiments, a respective weighting factor may be a part of an array of weighting factors. Referring toFIG.22, in embodiments, the process of obtaining the respective weighting factor may begin with step S2202. At step S2202, in embodiments, the process may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed array system210, for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective weighting factor. In embodiments, the array of weighting factors may be generated using a beam broadening tapering formula. In embodiments, the digital software system interface704may calculate and generate the array of weighting factors by using the formula: wm,n=(Am,ntap*Am,ncal)︷Am,n*e-j*(θm,nsteer+θm,ntap+θm,ncal)︷θm,n wherein wm,nis a weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Am,nis an amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Atapis a tapered amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Acalis a calibration weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θm,nis a phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θsteeris a steering phase factor θsteerassociated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θtapis a taper phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n and θcalis a calibration phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n. In embodiments, each respective weighting factor may be generated using a beam broadening tapering formula. In embodiments, the digital software system interface704may calculate and generate the respective weighting factor by using the formula: w(t)=(cosh(πα*1-4t2)cosh(πα))P wherein w(t) is the respective weighting factor at a location t, where t is defined by an array associated with a location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element, α is the respective tuning parameter, and P is the respective power parameter. In embodiments, the respective tuning parameter and the respective power parameter may be applied by the beam broadening tapering formula in the two-dimensional x-y direction of the tapering plane in order to tune the respective digital data or respective transmit digital data to be specific to the desired frequency of operation (e.g., L-band, S-band, and/or C-band, to name a few) for the respective coupled dipole array antenna element304-n. In embodiments, the respective tuning parameter and the respective power parameter may be applied by the beam broadening tapering formula in order to the tune the respective digital data based on the geometry of the parabolic surface that the digitally beamformed phased array system210may be applied to. In embodiments, by applying the beam broadening tapering formula above to generate the respective weighting factors, the system210may achieve maximum amplitude beam broadening for receiving and transmitting a plurality of modulated signals within any desired bandwidth simultaneously. In embodiments, for example,FIGS.15-16depicts exemplary two-dimensional beam amplitude tapering plots illustrating beam amplitude tapering by a digitally beamformed phased array system210in accordance with embodiments of the present invention. In embodiments, by applying the beam broadening taper seen inFIG.15Bto the respective beam, the sum of the respective main lobe beam may be shaped so as to maximize the central lobe width of the main beam. Referring toFIG.15A, by applying a uniform beam taper to the respective beam, the central lobe width of the main beam is drastically reduced compared to the beam broadening taper. Similarly,FIG.16Bdepicts an exemplary three-dimensional beam amplitude tapering plot illustrating beam amplitude tapering by a digitally beamformed phased array system210in accordance with embodiments of the present invention. In embodiments, the uniform taper depicted byFIG.16Ashows a drastically reduced main central lobe width compared to the sum beam pattern created by the beam broadening taper inFIG.16B.FIG.17depicts exemplary beam amplitude tapering plots illustrating beam amplitude tapering by a digitally beamformed phased array system with respect to the application of a uniform taper to a respective beam1702, and the application of a beam broadening taper1704to the respective beam. In embodiments, the beam broadening taper1704creates greater Fairfield directivity relative to the respective geometry of the respective parabolic surface than the uniform taper1702. At step S2204, in embodiments, the process of obtaining the respective weighting factor may continue with the step of storing, by memory operatively connected to the system controller412, the respective weighting factor for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304. At step S2206, in embodiments, the process of obtaining the respective weighting factor may continue with the step of transporting, from the memory to the respective digital beamformer306-n, the respective weighting factor for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304. In embodiments, the digital software system interface704may receive specific mission parameters (e.g., the respective mission center radio frequency, the respective mission intermediate frequency, and/or the respective channel selection, to name a few) for the plurality of coupled dipole array antenna elements as an input. In embodiments, the digital software system interface704may use the specific mission parameters to generate the array of weighting factors. In embodiments, each digital beamformer306-nmay be configured to combine the first intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a first partial beamformed data stream. In embodiments, each digital beamformer306-nmay be configured to apply an oscillating signal to the first partial beamformed data stream to generate a first oscillating partial beamformed data stream. In embodiments, the oscillating signal may be provided by the system controller412. In embodiments, a respective oscillating signal may be associated with a respective oscillating signal frequency. Referring toFIG.23, in embodiments, the process of obtaining the respective oscillating signal frequency may begin with step S2302. At step S2302, in embodiments, the process of obtaining the respective oscillating signal frequency may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed phased array system210, for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective oscillating signal frequency. At step S2304, in embodiments, the process of obtaining the respective oscillating signal frequency may continue with the step of storing, by memory operatively connected to the system controller412, the respective oscillating signal frequency for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array element304-n. At step S2306, in embodiments, the process of obtaining the respective oscillating signal frequency may continue with the step of transporting, from the memory to the respective digital beamformer306-n, the respective oscillating signal frequency for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array element304-n. In embodiments, the respective oscillating signal frequency may correspond to the respective tuner channel frequency. In embodiments, a plurality of oscillating signal frequencies may be received for a plurality of principal polarization components and a plurality of orthogonal polarization components of the plurality of respective coupled dipole array antenna elements304. In embodiments, the digital software system interface704may receive specific mission parameters (e.g., the respective mission center radio frequency, the respective mission intermediate frequency, and/or the respective channel selection, to name a few) for respective coupled dipole array antenna elements304as an input, the digital software system interface704may use the specific mission parameters to generate the respective oscillating signal frequency. FIG.18is a table illustrating exemplary mission parameters used by a digitally beamformed phased array feed system in accordance with embodiments of the present invention. In embodiments, for example, the mission center radio frequency (e.g., 4,398 MHz) may be received as a mission parameter via the system controller412corresponding to a respective coupled dipole array antenna element304-n. Continuing this example, in embodiments, a local oscillator having a respective local oscillator frequency (e.g., 4,900 MHz) may be selected via the system controller412. In embodiments, the mission intermediate frequency (e.g., 502 MHz) may be received as a mission parameter via the system controller412corresponding to the respective coupled dipole array antenna element304-n. In embodiments, the mission intermediate frequency value may be dependent on the other mission parameters received with respect the respective coupled dipole array antenna element304-n(e.g., mission center radio frequency, local oscillator selection, to name a few). In embodiments, the tuner channel selection (e.g., 3) provided by the multiplexer and corresponding to a tuner channel frequency (e.g., 468.75 MHz) may be received as a mission parameter via the system controller412corresponding to the respective coupled dipole array antenna element304-n. In embodiments, the tuner channel frequency may be dependent on the other mission parameters received with respect the respective coupled dipole array antenna element304-n(e.g., mission center radio frequency, local oscillator selection, mission intermediate frequency, to name a few). In embodiments, the oscillating signal frequency (e.g., 33.25 MHz) corresponding to the oscillating signal may be received as a mission parameter via the system controller412corresponding to the respective coupled dipole array antenna element304-n. In embodiments, the oscillating signal frequency may be provided to a numerically controlled oscillator. In embodiments, the numerically controlled oscillator may be used to apply the oscillating signal as an offset frequency value based on the tuner channel selection to the first partial beamformed data stream. In embodiments, the oscillating signal frequency may be dependent on the other mission parameters received with respect to the respective coupled dipole array antenna element304-n. In embodiments, each digital beamformer306-nmay be configured to apply a three-stage halfband filter to the first oscillating partial beamformed data stream to generate a first filtered partial beamformed data stream. In embodiments, each digital beamformer306-nmay be configured to apply a time delay to the first filtered partial beamformed data stream to generate a first partial beam. In embodiments, each digital beamformer306-nmay be configured to transmit the first partial beam along with a first set of a plurality of other partial beams of the first beam to a digital software system interface704via a data transport bus702. In embodiments, each digital beamformer may be configured to transmit the first partial beam of the first beam along with a second set of a plurality of other partial beams of a second beam to the digital software system interface704via the data transport bus702. In embodiments, each digital beamformer306-nmay have a transmit mode of operation associated with converting a plurality of transmit digital data from a digital signal to an analog signal having a plurality of respective intermediate frequencies. In embodiments, each digital beamformer306-nmay be configured to operate in the transmit mode of operation before operating in the receive mode of operation. In embodiments, each digital beamformer306-nmay be configured to operate only in the receive mode of operation. In embodiments, each digital beamformer306-nmay be configured to operate only in the transmit mode of operation. In embodiments, each digital beamformer306-nmay be configured to receive the first partial beam of the first beam along with the first set of the plurality of other partial beams of the first beam from the digital software system interface704via the data transport bus702. In embodiments, each digital beamformer306-nmay be configured to receive the first partial beam of the first beam along with the second set of a plurality of other beams of the second beam from the digital software system interface704via the data transport bus702. In embodiments, each digital beamformer306-nmay be configured to apply a second weighting factor to first transmit digital data associated with the first partial beam of the first beam selected beam of the plurality of beams. In embodiments, each digital beamformer306-nmay be configured to transmit the first transmit digital data to a first digital to analog converter. In embodiments, each digital beamformer306-nmay be configured to convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency. In embodiments, each digital beamformer306-nmay be configured to convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may have a transmit mode of operation associated with transmitting respective modulated signals associated with a plurality of radio frequencies. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to operate in the transmit mode of operation before operating in the receive mode of operation. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to operate only in the receive mode of operation. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to operate only in the transmit mode of operation. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to receive respective third modulated signals associated with the first intermediate frequency from the respective digital beamformer306-nof the plurality of digital beamformers306. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to convert the respective third modulated signals associated with the first intermediate frequency into respective fourth modulated signals having a radio frequency. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to transmit the respective fourth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter310-P and each respective orthogonal polarization converter310-O of the respective pair of frequency converters310-nof the plurality of pairs of frequency converters310to each principal polarization component and each orthogonal polarization component of the respective coupled dipole array antenna element304-nof the plurality of coupled dipole array antenna elements304. In embodiments, each digital beamformer306-nmay be configured to receive a third partial beam of a third beam along with a third set of a plurality of other partial beams of the third beam from the digital software system704interface via the data transport bus702. In embodiments, each digital beamformer306-nmay be configured to receive the third partial beam of the third beam along with a fourth set of a plurality of other beams of a fourth beam from the digital software system interface via the data transport bus. In embodiments, each digital beamformer306-nmay be configured to apply a second weighting factor to second transmit digital data associated with the third partial beam of the third beam. In embodiments, each digital beamformer306-nmay be configured to transmit the second transmit digital data to a second digital to analog converter. In embodiments, each digital beamformer306-nmay be configured to convert, using the second digital to analog converter, the second transmit digital data from a digital signal to an analog signal having a second intermediate frequency. In embodiments, the second intermediate frequency may be between 50 MHz and 1250 MHz. In embodiments, the second intermediate frequency may be the same as the first intermediate frequency. In embodiments, each digital beamformer306-nmay be configured to convert, using the second digital to analog converter, the second digital data from a digital signal to an analog signal having a second intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to receive respective fifth modulated signals associated with the second intermediate frequency from the respective digital beamformer306-nof the plurality of digital beamformers306. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to convert the respective fifth modulated signals associated with the second intermediate frequency into respective sixth modulated signals having a radio frequency. In embodiments, each principal polarization converter310-P and each respective orthogonal polarization converter310-O may be configured to transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter310-P and each respective orthogonal polarization converter310-O of the respective pair of frequency converters310-nof the plurality of pairs of frequency converters310to each principal polarization component304-P and each orthogonal polarization component304-O of the respective coupled dipole antenna element304-nof the plurality of coupled dipole antenna elements304. In embodiments, each coupled dipole antenna array element304-nmay have a transmit mode of operation associated with transmitting a plurality of respective radio frequencies. In embodiments, each principal polarization component304-P and each respective orthogonal polarization component304-O may be configured to operate in the transmit mode of operation before operating in the receive mode of operation. In embodiments, each principal polarization component304-P and each respective orthogonal polarization component304-O may be configured to operate only in the receive mode of operation. In embodiments, each principal polarization component304-P and each respective orthogonal polarization component304-O may be configured to operate only in the transmit mode of operation. In embodiments, each principal polarization component304-P and each respective orthogonal polarization component304-O of the respective coupled dipole antenna array element304-nmay be configured to transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies. In embodiments, the power and clock management subsystem314may be configured to manage power and time of operation. In embodiments the thermal management subsystem308may be configured to dissipate heat generated by the multi-band software defined antenna array tile110. FIG.4is a schematic illustration of a multi-band software defined antenna array tile110in accordance with embodiments of the present invention. In embodiments, the multi-band software defined antenna array tile110may receive a plurality of radio frequencies via a plurality of antenna elements304in a wide band feed (S4000). In embodiments, a radio frequency frontend system including a plurality of pairs of frequency converters310may receive the radio frequencies. In embodiments, the radio frequency frontend may convert the respective radio frequencies into a first intermediate frequency (S4001). In embodiments, a common digital beamformer306may receive the first intermediate frequency from the radio frequency frontend. In embodiments, the common digital beamformer306may generate a first partial beam (S4002), which may be transmitted to an external digital software system interface704along with a plurality of other partial beams (S4003). In embodiments, the external digital software system interface704may include a Government Furnish Equipment (GFE) application408, GFE control410, and a system controller412. FIG.5is a schematic illustration of an exploded view of a multi-band software defined antenna array tile110in accordance with embodiments of the present invention. In embodiments, the multi-band software defined antenna array tile110may include a plurality of antenna elements304, a sub-array circuit card assembly (sub-array CCA)702, a top plate504, a plurality of mini low noise channelizer circuit card assemblies (mLNC)704, a local oscillator/calibration circuit card assembly (LO/CAL)706, a top plate504, an mLNC rack506, a base plate512, an RF node common digital beamformer306, and a common digital beamformer510. In embodiments, for example, the multi-band software defined antenna array tile110may include 8 mLNCs. FIG.6is a schematic illustration of an exploded view of the radio frequency system of a multi-band software defined antenna array tile110in accordance with embodiments of the present invention. In embodiments, the radio frequency system may include the plurality of antenna elements304, the sub array circuit card assembly (sub-array CCA)702, the plurality of mini low noise channelizer circuit card assemblies (mLNC)704, and the local oscillator/calibration circuit card assembly (LO/CAL)706. In embodiments, the sub-array CCA702may accept input modulated signals associated with respective radio frequencies from the plurality of antenna elements304and forms sub-arrays of the modulated signals to be output to the plurality of mLNCs704. In embodiments, for example, if the radio frequency includes 64 antenna elements, the sub-array CCA702may receive 64 radio frequency input signals from the respective antenna elements304. In embodiments, the plurality of mLNCs704may receive the sub-arrays of the modulated signals from the sub-array CCA702and may convert the modulated signals associated with respective radio frequencies into modulated signals having an intermediate frequency. In embodiments, the plurality of mLNCs704may output the modulated signals having an intermediate frequency to the LO/CAL706. In embodiments, the LO/CAL706may take a 100 MHz reference oscillator and creates local oscillator and calibration signals and distribute the signals to the each of the respective modulated signals having an intermediate frequency received from the respective mLNCs704. In embodiments, the LO/CAL706may pass through the respective modulated signals having an intermediate frequency to the digital beamformer306. In embodiments, the LO/CAL706may provide power to the radio frequency system of the multi-band software defined antenna array tile110. FIG.7is a schematic diagram of a process flow of a multi-band software defined antenna array tile110in accordance with embodiments of the present invention.FIG.8is schematic diagram of a process flow of a system for a digitally beamformed phased array feed310in accordance with embodiments of the present invention.FIG.9is a schematic diagram of a process flow of a system for a digitally beamformed phased array feed210in accordance with embodiments of the present invention.FIGS.24A-Dare schematic diagrams for process flows of a system for a digitally beamformed phased array feed210in accordance with embodiments of the present invention. Referring toFIGS.7,8,9, and24A-D together, in embodiments, the method for digital beamforming may include, at step S2400ofFIG.24A, receiving, by a first coupled dipole array antenna element304-1of a plurality coupled dipole array antenna elements304of a multi-band software defined digital antenna array tile110, a plurality of respective modulated signals associated with a plurality of respective radio frequencies (see also step S7000ofFIG.7). In embodiments, the method may further include, prior to the receiving step (a), the steps of: reflecting from a surface of a parabolic reflector114mounted on a support pedestal112, the plurality of respective modulated signals and transmitting the reflected plurality of respective modulated signals through a radome302to the first coupled dipole array antenna element304-1of the plurality of coupled dipole array antenna elements304. In embodiments, each coupled dipole array antenna element304-nof the plurality of coupled dipole array antenna elements304may include a respective principal polarization component304-P oriented in a first direction and a respective orthogonal polarization component304-O oriented in a second direction. In embodiments, the plurality of coupled dipole array antenna elements304may be tightly coupled relative to the wavelength of operation. In embodiments, the plurality of coupled dipole array antenna elements304may be spaced at less than half a wavelength. In embodiments, at step2402A ofFIG.24A, the method may include receiving, by a first principal polarization frequency converter310-1P of a first pair of frequency converters310-1of a plurality of frequency converters310of the multi-band software defined digital antenna array tile110, from a first principal polarization component304-1P of the first coupled dipole array antenna element304-1of the plurality of coupled dipole array antenna elements304respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies (see also step S7001ofFIG.7). In embodiments, each pair of frequency converters310-nof the plurality of pairs of frequency converters310may be operatively connected to a respective coupled dipole array antenna element304-n. In embodiments, each pair of frequency converters310-nof the plurality of pairs of frequency converters310may include a respective principal polarization converter310-P corresponding to a respective principal polarization component304-P and a respective orthogonal polarization converter310-O corresponding to a respective orthogonal polarization component304-O. In embodiments, the method may further include receiving, by a second pair of frequency converters310-2of the multi-band software defined digital antenna array tile110, from a second coupled dipole array antenna element304-2of the plurality of antenna elements304, respective modulated signals associated with the respective radio frequencies of the plurality of radio frequencies. In embodiments, each one of the principal polarization frequency converter310-2P and the orthogonal polarization frequency converter310-2O of the second pair of frequency converters310-2may be operatively connected to a respective principal polarization component304-2P and a respective orthogonal polarization component304-2O of the second coupled dipole array antenna element304-2of the plurality of coupled dipole array antenna elements304. In embodiments, the plurality of pairs of frequency converters310may include thermoelectric coolers which may be configured to actively manage thermally the system noise temperature and increase the system gain over temperature. In embodiments, each respective principal polarization frequency converter310-P and each orthogonal polarization frequency converter310-O may include a thermoelectric cooler. In embodiments, the plurality of pairs of frequency converters may further include a plurality of spatially distributed high-power amplifiers so as to increase the effective isotropic radiated power. In embodiments, at step2404A ofFIG.24A, the method may include converting, by the first principal polarization frequency converter310-1P of the first pair of frequency converters310-1, the respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies into respective second modulated signals having a first intermediate frequency (see also step S7002ofFIG.7). In embodiments, the first intermediate frequency may be between 50 MHz and 1250. In embodiments, the radio frequencies may be between 900 MHz and 6000 MHz. In embodiments, the radio frequencies may be between 2000 MHz and 12000 MHz. In embodiments, the radio frequencies may be between 10000 MHz and 50000 MHz. In embodiments, at step2406A ofFIG.24A, the method may include receiving, by a first digital beamformer306-1of a plurality of digital beamformers306of the multi-band software defined digital antenna array tile110from the first principal polarization frequency converter310-1P, the respective second modulated signals associated with the first intermediate frequency (see also step S9001ofFIGS.8and9). In embodiments, the plurality of digital beamformers306may be operatively connected to the plurality of pairs of frequency converters310. In embodiments, each digital beamformer306-nmay be operatively connected to one of the respective principal polarization frequency converter310-P and the respective orthogonal polarization frequency converter310-O. In embodiments, at step2408A ofFIG.24A, the method may include converting, by the first digital beamformer306-1, the respective second modulated signal from an analog signal to a digital data format (see also step S9002ofFIGS.8and9). In embodiments, the method may further include converting, by the first digital beamformer306-1, the respective modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, at step2410A ofFIG.24A, the method may include generating, by the first digital beamformer306-1, a first plurality of channels of first digital data by decimating the first digital data using a first polyphase channelizer and filtering using a first plurality of cascaded halfband filters (see also step S9003ofFIGS.8and9). In embodiments, at step2412A ofFIG.24B, the method may include selecting, by the first digital beamformer306-1, a first channel of the first plurality of channels (see also step S9004ofFIGS.8and9). In embodiments, the method may include selecting, by the first digital beamformer306-1, the first channel of the first plurality of channels using a first multiplexer. In embodiments, the multiplexer selection may be provided by a system controller412, discussed in further detail below with respect toFIG.21. In embodiments, at step2414A ofFIG.24B, the method may include applying, by the first digital beamformer306-1, a first weighting factor to the first digital data associated with the first channel to generate a first intermediate partial beamformed data stream (see also step S9005ofFIGS.8and9). In embodiments, at step2416A ofFIG.24B, the method may further include combining, by the first digital beamformer306-1, the first intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a first partial beamformed data stream (see also step S9006ofFIGS.8and9). In embodiments, at step2418A ofFIG.24B, the method may include applying, by the first digital beamformer306-1, a first oscillating signal to the first partial beamformed data stream to generate a first oscillating partial beamformed data stream (see also step S9007ofFIGS.8and9). In embodiments, the oscillating signal may be provided by the system controller412, as discussed in further detail below with respect toFIG.23. In embodiments, the method may include, at step2420A ofFIG.24B, applying, by the first digital beamformer306-1, a first three-stage halfband filter to the first oscillating partial beamformed data stream to generate a first filtered partial beamformed data stream (see also step S9008ofFIGS.8and9). In embodiments, at step2422A ofFIG.24B, the method may include applying, by the first digital beamformer306-1, a first time delay to the first filtered partial beamformed data stream to generate a first partial beam (see also step S9009ofFIGS.8and9). In embodiments, at step2424A ofFIG.24B, the method may further include transmitting, by the first digital beamformer via a data transport bus702to a digital software system interface704, the first partial beam of a first beam, which may be transmitted via the data transport bus702along with a first set of a plurality of other partial beams of the first beam (see also step S9010ofFIGS.8and9). In embodiments, the method may further include transmitting, by the first digital beamformer306-1via the data transport bus702to the digital software system interface704, the first partial beam of the first beam, which may be transmitted via the data transport bus702along with a second set of a plurality of other partial beams of a second beam. In embodiments, at step S2402B ofFIG.24C, after the step of receiving the plurality of respective modulated signals associated with the plurality of respective radio frequencies, the method may further include receiving, by a first orthogonal polarization frequency converter310-1O of the first pair of frequency converters310-1of the plurality of pairs of frequency converters310of the multi-band software defined antenna array tile110, from a first orthogonal polarization component304-1O of the first coupled dipole array antenna element304-1of the plurality of coupled dipole array antenna elements304, respective third modulated signals associated with the respective radio frequencies of the plurality of respective radio frequencies (see also step S9001ofFIGS.8and9). In embodiments, at step2404B ofFIG.24C, the method may further include converting, by the first orthogonal polarization frequency converter310-1O of the first pair of frequency converters310-1, the respective third modulated signals associated with the respective radio frequencies of the plurality of frequencies into respective fourth modulated signals having the first intermediate frequency (see also step S9002ofFIGS.8and9). In embodiments, at step S2406B ofFIG.24C, the method may further include receiving, by a second digital beamformer306-2of a plurality of digital beamformers306of the multi-band software defined digital antenna array tile110, from the first orthogonal polarization frequency converter310-1O of the first pair of frequency converters310-1, the respective fourth modulated signals associated with the first intermediate frequency (see also step S9001A ofFIGS.8and9). In embodiments, the plurality of digital beamformers306may be operatively connected to the plurality of pairs of frequency converters310and each digital beamformer306-nmay be operatively connected to one of a respective principal polarization frequency converter310-P and a respective orthogonal polarization frequency converter310-O. In embodiments, at step S2408B ofFIG.24C, the method may include converting, by the second digital beamformer306-2, the respective fourth modulated signal from an analog signal to a digital data format (see also step S9002A ofFIGS.8and9). In embodiments, the method may further include converting, by the second digital beamformer306-2, the respective modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, at step S2410B ofFIG.24C, the method may include generating, by the second digital beamformer306-2, a second plurality of channels of second digital data by decimating the second digital data using a second polyphase channelizer and filtering using a second plurality of cascaded halfband filters (at step S9003A ofFIGS.8and9). In embodiments, at step S2412B ofFIG.24D, the method may include selecting, by the second digital beamformer306-2, a second channel of the second plurality of channels (see also S9004A ofFIGS.8and9). In embodiments, the method may include selecting, by the second digital beamformer306-2, the second channel of the second plurality of channels using a second multiplexer. In embodiments, the multiplexer selection may be provided by the system controller412, as discussed in further detail below with respect toFIG.21. In embodiments, the second channel selection may be the same as the first channel selection. In embodiments, at step S2414B ofFIG.24D, the method may include applying, by the second digital beamformer306-2, a second weighting factor to the second digital data associated with the second channel to generate a second intermediate partial beamform data stream (see also step S9005A ofFIGS.8and9). In embodiments, at step S2416B of FIG.24D, the method may further include combining, by the second digital beamformer306-2, the second intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a second partial beamformed data stream (see also step S9006A ofFIGS.8and9). In embodiments, at step S2418B ofFIG.24D, the method may include applying, by the second digital beamformer306-2, a second oscillating signal to the second partial beamformed data stream to generate a second oscillating partial beamformed data stream (see also step S9007A ofFIGS.8and9). In embodiments, the second oscillating signal may be provided by the system controller412, as discussed in further detail below with respect toFIG.23. In embodiments, the second oscillating signal may be the same as the first oscillating signal. In embodiments, the method may include, at step S2420B ofFIG.24D, applying, by the second digital beamformer306-2, a second three-stage halfband filter to the second oscillating partial beamformed data stream to generate a second filtered partial beamformed data stream (see also step S9008A ofFIGS.8and9). In embodiments, at step S2422B ofFIG.24D, the method may include applying, by the second digital beamformer306-2, a second time delay to the second filtered partial beamformed data stream to generate a second partial beam (see also step S9009A ofFIGS.8and9). In embodiments, at step S2424B ofFIG.24D, the method may further include transmitting, by the second digital beamformer via the data transport bus702to the digital software system interface704, the second partial beam of the first beam, which may be transmitted via the data transport bus702along with a third set of a plurality of other partial beams of the first beam (see also step S9010A ofFIGS.8and9). In embodiments, the method may further include transmitting, by the second digital beamformer via the data transport bus702to the digital software system interface704, the second partial beam of the second beam, which may be transmitted via the data transport bus702along with a fourth set of a plurality of other partial beams of the second beam. In embodiments, each digital beamformer306-nmay have a transmit mode of operation. In embodiments, the method may further include receiving, by the first digital beamformer306-1, the first partial beam of the first beam along with the first set of the plurality of other partial beams of the first beam from the digital software system interface704via the data transport bus702. In embodiments, the method may further include receiving, by the first digital beamformer306-1, the first partial beam of the first beam along with the second set of a plurality of other beams of the second beam from the digital software system interface704via the data transport bus702. In embodiments, the method may further include applying, by the first digital beamformer306-1, a third weighting factor to first transmit digital data associated with the first partial beam of the first beam of the plurality of beams. In embodiments, the method may further include transmitting, by the first digital beamformer306-1, the first transmit digital data to a first digital to analog converter. In embodiments, the method may further include converting, by the first digital to analog converter of the first digital beamformer306-1, the respective modulated signal from a digital signal to an analog signal having the first intermediate frequency. In embodiments, the method may further include converting, by the first digital to analog converter of the first digital beamformer306-1, the respective modulated signal from a digital signal to an analog signal having the first intermediate frequency by performing First-Nyquist sampling. In embodiments, each pair of frequency converters310-nmay have a transmit mode of operation. In embodiments, the method may further include receiving, by one of the respective principal polarization frequency converter310-1P and the respective orthogonal polarization frequency converter310-1O of the first pair of frequency converters310-1, respective modulated signals associated with the first intermediate frequency from the first digital beamformer306-1. In embodiments, the method may further include converting, by one of the respective principal polarization frequency converter310-1P and the respective orthogonal polarization frequency converter310-1O of the first pair of frequency converters310-1, the respective modulated signals associated with the first intermediate frequency into respective modulated signals having a radio frequency. In embodiments, the method may further include transmitting, by one of the respective principal polarization frequency converter310-1P and the respective orthogonal polarization frequency converter310-1O of the first pair of frequency converters310-1, respective modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from the first pair of frequency converters310-1of the plurality of pairs of frequency converters310to the first coupled dipole array antenna element304-1of the plurality of coupled dipole array antenna elements304. In embodiments, the method may further include receiving, by a third digital beamformer306-3, a third partial beam of a third beam along with a fifth set of a plurality of other partial beams of the third beam from the digital software system704interface via the data transport bus702. In embodiments, the method may further include receiving, by the third digital beamformer306-3, the third partial beam of the third beam along with a sixth set of a plurality of other beams of a fourth beam from the digital software system interface704via the data transport bus702. In embodiments, the method may further include applying, by the third digital beamformer306-3, a fourth weighting factor to second transmit digital data associated with the third partial beam of the third beam. In embodiments, the method may further include transmitting, by the third digital beamformer, the second transmit digital data to a second digital to analog converter. In embodiments, the method may further include converting, using the second digital to analog converter of the third digital beamformer306-3, the respective modulated signal from a digital signal to an analog signal having a second intermediate frequency. In embodiments, the second intermediate frequency may be between 50 MHz and 1250 MHz. In embodiments, the second intermediate frequency may be same as the first intermediate frequency. In embodiments, the method may further include converting, using the second digital to analog converter of the third digital beamformer306-3, the respective modulated signal from a digital signal to an analog signal having a second intermediate frequency by performing First-Nyquist sampling. In embodiments, each pair of frequency converters310-nmay have a transmit mode of operation. In embodiments, the method may further include receiving, by one of the respective principal polarization frequency converter310-2P and the respective orthogonal polarization frequency converter310-2O of the second pair of frequency converters310-2, respective modulated signals associated with the second intermediate frequency from the third digital beamformer306-3of the plurality of digital beamformers306. In embodiments, the method may further include converting, by one of the respective principal polarization frequency converter310-2P and the respective orthogonal polarization frequency converter310-2O of the second pair of frequency converters310-2, the respective modulated signals associated with the second intermediate frequency into respective modulated signals having a radio frequency. In embodiments, the method may further include transmitting, by one of the respective principal polarization frequency converter310-2P and the respective orthogonal polarization frequency converter310-2O of the second pair of frequency converters310-2, respective modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from the second pair of frequency converters310-2of the plurality of pairs of frequency converters310to a second coupled dipole antenna element304-2of the plurality of coupled dipole antenna elements304. In embodiments, each coupled dipole antenna array element304-nmay have a transmit mode of operation. In embodiments, the method may further include transmitting, by the second coupled dipole antenna array element304-n, the plurality of respective modulated signals associated with the respective radio frequencies of the plurality of radio frequencies. In embodiments, a respective intermediate frequency may be associated with a respective mission center radio frequency. Referring toFIG.19, in embodiments, the process of obtaining the mission center radio frequency associated with a respective antenna coupled dipole array element304may begin with step S1902. At step S1902, in embodiments, the process may include receiving, from a digital software system interface704via the system controller412by memory of the digitally beamformed phased array system210, for the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective mission center radio frequency. At step S1904, in embodiments, the process of obtaining the mission center radio frequency may continue with step of storing, by memory operatively connected to the system controller412, the respective mission center radio frequency for the respective coupled dipole antenna array element304-n. At step S1906, in embodiments, the process of obtaining the mission center radio frequency may continue with the step of transporting, from the memory to the respective principal polarization frequency converter310-P and the respective orthogonal polarization frequency converter310-O, the respective mission center radio frequency for the respective coupled dipole array antenna element304-n. In embodiments, the respective intermediate frequency may be a mission intermediate frequency corresponding to the mission center radio frequency. Referring toFIG.20, in embodiments, the process of obtaining the mission intermediate frequency associated with a respective antenna element304may begin with step S2002. At step S2002, in embodiments, the process may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed phased array system210, for the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective mission intermediate frequency. At step S2004, in embodiments, the process of obtaining the mission intermediate frequency may continue with step of storing, by memory operatively connected to the system controller412, the respective mission intermediate frequency for the respective coupled dipole antenna array element304-n. At step S1906, in embodiments, the process of obtaining the mission intermediate frequency may continue with the step of transporting, from the memory to the respective principal polarization frequency converter310-P and the respective orthogonal polarization frequency converter310-O, the respective mission intermediate frequency for the respective coupled dipole array antenna element304-n. Referring toFIG.21, in embodiments, the process of selecting a respective channel may begin with step S2102. At step2102, in embodiments, the process may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed phased array system210, for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective channel selection. At step S2104, in embodiments, the process of selecting the respective channel may continue with step of storing, by memory operatively connected to the system controller412, the respective mission channel selection for the respective principal polarization component310-P and the respective orthogonal polarization component310-O of the respective coupled dipole antenna array element304-n. At step S2106, in embodiments, the process of selecting the respective channel may continue with step of transporting, the respective channel selection for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-n. In embodiments, the respective channel selection may be associated with a respective tuner channel frequency. In embodiments, the respective tuner channel frequency may correspond to the respective mission intermediate frequency. In embodiments, a respective weighting factor may be part of an array of weighting factors. Referring toFIG.22, in embodiments, the process of obtaining the respective weighting factor may begin with step S2202. At step S2202, in embodiments, the process may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed array system210, for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective weighting factor. In embodiments, the array of weighting factors may be generated using a beam broadening tapering formula. In embodiments, the digital software system interface704may calculate and generate the array of weighting factors by using the formula: wm,n=(Am,ntap*Am,ncal)︷Am,n*e-j*(θm,nsteer+θm,ntap+θm,ncal)︷θm,n wherein wm,nis a weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Am,nis an amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Atapis a tapered amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Acalis a calibration weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θm,nis a phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θsteeris a steering phase factor θsteerassociated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θtapis a taper phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n and θcalis a calibration phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n. In embodiments, each respective weighting factor may be generated using a beam broadening tapering formula. In embodiments, the digital software system interface704may calculate and generate the respective weighting factor by using the formula: w(t)=(cosh(πα*1-4t2)cosh(πα))P wherein w(t) is the respective weighting factor at a location t, where t is defined by an array associated with a location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element, α is the respective tuning parameter, and P is the respective power parameter. In embodiments, the respective tuning parameter and the respective power parameter may be applied by the beam broadening tapering formula in the two-dimensional x-y direction of the tapering plane in order to tune the respective digital data or respective transmit digital data to be specific to the desired frequency of operation (e.g., L-band, S-band, and/or C-band, to name a few) for the respective coupled dipole array antenna element304-n. In embodiments, the respective tuning parameter and the respective power parameter may be applied by the beam broadening tapering formula in order to the tune the respective digital data based on the geometry of the parabolic surface that the digitally beamformed phased array system210may be applied to. In embodiments, by applying the beam broadening tapering formula above to generate the respective weighting factors, the system210may achieve maximum amplitude beam broadening for receiving and transmitting a plurality of modulated signals within any desired bandwidth simultaneously. In embodiments, for example,FIGS.15-16depicts exemplary two-dimensional beam amplitude tapering plots illustrating beam amplitude tapering by a digitally beamformed phased array system210in accordance with embodiments of the present invention. In embodiments, by applying the beam broadening taper seen inFIG.15Bto the respective beam, the sum of the respective main lobe beam may be shaped so as to maximize the central lobe width of the main beam. Referring toFIG.15A, by applying a uniform beam taper to the respective beam, the central lobe width of the main beam is drastically reduced compared to the beam broadening taper. Similarly,FIG.16Bdepicts an exemplary three-dimensional beam amplitude tapering plot illustrating beam amplitude tapering by a digitally beamformed phased array system210in accordance with embodiments of the present invention. In embodiments, the uniform taper depicted byFIG.16Ashows a drastically reduced main central lobe width compared to the sum beam pattern created by the beam broadening taper shown inFIG.16B.FIG.17depicts exemplary beam amplitude tapering plots illustrating beam amplitude tapering by a digitally beamformed phased array system with respect to the application of a uniform taper to a respective beam, and the application of a beam broadening taper to the respective beam. In embodiments, the beam broadening taper creates greater Fairfield directivity relative to the respective geometry of the respective parabolic surface than the uniform taper. At step S2204, in embodiments, the process of obtaining the respective weighting factor may continue with the step of storing, by memory operatively connected to the system controller412, the respective weighting factor for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304. At step S2206, in embodiments, the process of obtaining the respective weighting factor may continue with the step of transporting, from the memory to the respective digital beamformer306-n, the respective weighting factor for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304. In embodiments, the digital software system interface704may receive specific mission parameters (e.g., the respective mission center radio frequency, the respective mission intermediate frequency, and/or the respective channel selection, to name a few) for the plurality of coupled dipole array antenna elements as an input. In embodiments, the digital software system interface704may use the specific mission parameters to generate the array of weighting factors. In embodiments, a respective oscillating signal may be associated with a respective oscillating signal frequency. Referring toFIG.23, in embodiments, the process of obtaining the respective oscillating signal frequency may begin with step S2302. At step S2302, in embodiments, the process of obtaining the respective oscillating signal frequency may include receiving, from the digital software system interface704via the system controller412by memory of the digitally beamformed phased array system210, for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array antenna element304-nof the plurality of respective coupled dipole array antenna elements304, the respective oscillating signal frequency. At step S2304, in embodiments, the process of obtaining the respective oscillating signal frequency may continue with the step of storing, by memory operatively connected to the system controller412, the respective oscillating signal frequency for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array element304-n. At step S2306, in embodiments, the process of obtaining the respective oscillating signal frequency may continue with the step of transporting, from the memory to the respective digital beamformer306-n, the respective oscillating signal frequency for the respective principal polarization component304-P and the respective orthogonal polarization component304-O of the respective coupled dipole array element304-n. In embodiments, the respective oscillating signal frequency may correspond to the respective tuner channel frequency. In embodiments, a plurality of oscillating signal frequencies may be received for a plurality of principal polarization components and a plurality of orthogonal polarization components of the plurality of respective coupled dipole array antenna elements304. In embodiments, the digital software system interface704may receive specific mission parameters (e.g., the respective mission center radio frequency, the respective mission intermediate frequency, and/or the respective channel selection, to name a few) for respective coupled dipole array antenna elements304as an input, the digital software system interface704may use the specific mission parameters to generate the respective oscillating signal frequency. FIG.9Ais a schematic diagram of a process flow of a system for a digitally beamformed phased array feed in conjunction with a large form-factor phased array in accordance with embodiments of the present invention. In embodiments, the method for digital beamforming described with respect toFIGS.7-9may be repeated so as to combine a plurality of partial beams900-nsystolically in order to create a plurality of beams. FIG.10is a schematic diagram of the system architecture of a multi-band software defined antenna array tile110in accordance with embodiments of the present invention. In embodiments, the components of the multi-band software defined antenna array tile110may include a plurality of coupled dipole array antenna elements304, a plurality of radio frequency support subsystems1002, and a plurality of common digital beamformers1004, and a plurality of system support subsystems1006. In embodiments, the plurality of coupled dipole array antenna elements304may have capabilities such as sub-arraying, dual linear polarizations, and a 6:1 bandwidth. In embodiments, the plurality of radio frequency support subsystems1002may include filtering, frequency conversion, and transmit and receive modules. In embodiments, the plurality of common digital beamformers1004may have capabilities such as radar processing, telemetry demodulation, Electronic Attack (EA) waveform modulation, and Electronic Warfare (EW) processing. In embodiments, the plurality of system support subsystems1006may have capabilities such as Electro-Magnetic Interference/Compatibility (EMI/EMC) filtering, DC-DC conversion, timing, master oscillation, and thermal management. FIG.11is a schematic diagram of the system architecture of a multi-band software defined antenna array tile110in accordance with embodiments of the present invention. In embodiments, the multi-band software defined antenna array tile110may include an RF subsystem1101, a digital subsystem1102, a software system1103, a mechanical subsystem1104, and/or an electrical subsystem1105. In embodiments, the RF subsystem1101may include a plurality of antenna elements1101A and a plurality of RF support elements1101B. In embodiments, the digital subsystem1102may include a plurality of digital hardware elements1102A, a plurality of embedded system elements1102B, and a plurality of network architecture elements1102C. In embodiments, the software subsystem1103may include a plurality of common digital beamformer software elements1103A, a plurality of AppSpace software elements1103B, and a plurality of human machine interface (HMI) software elements1103C. In embodiments, the mechanical subsystem1104may include a plurality of physical subsystem elements1104A and a plurality of thermal subsystem elements1104B. In embodiments, the electrical subsystem1105may include a plurality of power subsystem elements1105A and a plurality of interface sub system elements1105B. In embodiments, a digitally beamformed phased array system may include: (a) a radome configured to allow electromagnetic waves to propagate; (b) a multi-band software defined antenna array tile including: i. a plurality of coupled dipole array antenna elements, wherein each coupled dipole array antenna element includes a principal polarization component oriented in a first direction and an orthogonal polarization component oriented in a second direction, and is configured to receive and transmit a plurality of respective first modulated signals associated with a plurality of respective radio frequencies; ii. a plurality of pairs of frequency converters, each pair of frequency converters associated with a respective coupled dipole array antenna element and including a respective principal polarization converter corresponding to a respective principal polarization component and a respective orthogonal polarization converter corresponding to a respective orthogonal polarization component, and each principal polarization converter and each respective orthogonal polarization converter is configured to: (1) receive respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from the respective coupled dipole array antenna element; and (2) convert the respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies into respective second modulated signals having a first intermediate frequency; iii. a plurality of digital beamformers operatively connected to the plurality of pairs of frequency converters wherein each digital beamformer is operatively connected to one of the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter and each digital beamformer is configured to: (1) receive the respective second modulated signals associated with the first intermediate frequency; (2) convert the respective second modulated signal from an analog signal to a digital data format; (3) generate a plurality of channels of the digital data by decimation of the digital data using a polyphase channelizer and filter using a plurality of cascaded halfband filters; (4) select one of the plurality of channels; (5) apply a first weighting factor to the digital data associated with the selected one of the plurality of channels to generate a first intermediate partial beamformed data stream; (6) combine the first intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a first partial beamformed data stream; (7) apply an oscillating signal to the first partial beamformed data stream to generate a first oscillating partial beamformed data stream; (8) apply a three-stage halfband filter to the first oscillating partial beamformed data stream to generate a first filtered partial beamformed data stream; (9) apply a time delay to the first filtered partial beamformed data stream to generate a first partial beam; (10) transmit the first partial beam of a first beam along with a first set of a plurality of other partial beams of the first beam to a digital software system interface via a data transport bus; (c) a power and clock management subsystem configured to manage power and time of operation; (d) a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and (e) an enclosure assembly. In embodiments, the plurality of coupled dipole array antenna elements are tightly coupled relative to the wavelength of operation. In embodiments, the plurality of coupled dipole array antenna elements are spaced at less than half a wavelength. In embodiments, the plurality of pairs of frequency converters further include thermoelectric coolers configured to actively manage thermally the system noise temperature and increase the system gain over temperature. In embodiments, the plurality of pairs of frequency converters further include a plurality of spatially distributed high power amplifiers so as to increase the effective isotropic radiated power. In embodiments, the first intermediate frequency is between 50 MHz and 1250 MHz. In embodiments, the radio frequencies are between 900 MHz and 6000 MHz. In embodiments, the radio frequencies are between 2000 MHz and 12000 MHz. In embodiments, the radio frequencies are between 10000 MHZ and 50000 MHz. In embodiments, each digital beamformer is configured to convert the respective second modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, each digital beamformer is configured to select one of the plurality of channels using a multiplexer. In embodiments, each digital beamformer is configured to transmit the first partial beam of the first beam along with a second set of a plurality of other partial beams of a second beam to the digital software system interface via the data transport bus. In embodiments, each digital beamformer has a transmit mode of operation associated with converting a plurality of transmit digital data from a digital signal to an analog signal having a plurality of respective intermediate frequencies, and wherein each digital beamformer is further configured to: (11) receive the first partial beam of the first beam along with the first set of the plurality of other partial beams of the first beam from the digital software system interface via the data transport bus; (12) apply a second weighting factor to first transmit digital data associated with the first partial beam of the first beam of the plurality of beams; (13) transmit the first transmit digital data to a first digital to analog converter; and (14) convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency. In embodiments, each digital beamformer is further configured to receive the first partial beam of the first beam along with the second set of a plurality of other beams of the second beam from the digital software system interface via the data transport bus. In embodiments, each digital beamformer is further configured to convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter and each respective orthogonal polarization converter have a transmit mode of operation associated with transmitting respective modulated signals associated with a plurality of radio frequencies, and wherein each principal polarization converter and its respective orthogonal polarization converter is further configured to: (3) receive respective third modulated signals associated with the first intermediate frequency from the respective digital beamformer of the plurality of digital beamformers; (4) convert the respective third modulated signals associated with the first intermediate frequency into respective fourth modulated signals having a radio frequency; and (5) transmit the respective fourth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter and each orthogonal polarization converter of the respective pair of frequency converters of the plurality of pairs of frequency converters to the respective coupled dipole array antenna element of the plurality of coupled dipole array antenna elements. In embodiments, each digital beamformer has a transmit mode of operation associated with converting a plurality of transmit digital data from a digital signal to an analog signal having a plurality of respective intermediate frequencies, and wherein each digital beamformer is further configured to: (15) receive a third partial beam of a third beam along with a third set of a plurality of other partial beams of the third beam from the digital software system interface via the data transport bus; (16) apply a third weighting factor to second transmit digital data associated with the third partial beam of the third beam; (17) transmit the second transmit digital data to a second digital to analog converter; and (18) convert, using the second digital to analog converter, the second transmit digital data from a digital signal to an analog signal having a second intermediate frequency. In embodiments, each digital beamformer is further configured to receive the third partial beam of the third beam along with a fourth set of a plurality of other beams of a fourth beam from the digital software system interface via the data transport bus. In embodiments, the second intermediate frequency is between 50 MHz and 1250 MHz. In embodiments, the second intermediate frequency is the same as the first intermediate frequency. In embodiments, each digital beamformer is further configured to convert, using the second digital to analog converter, the second transmit digital data from a digital signal to an analog signal having a second intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter and each respective orthogonal polarization converter have a transmit mode of operation associated with transmitting respective modulated signals associated with a plurality of radio frequencies, and wherein each principal polarization converter and its respective orthogonal polarization converter is further configured to: (6) receive respective fifth modulated signals associated with the second intermediate frequency from the respective digital beamformer of the plurality of digital beamformers; (7) convert the respective fifth modulated signals associated with the second intermediate frequency into respective sixth modulated signals having a radio frequency; and (8) transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter and each orthogonal polarization converter of the respective pair of frequency converters of the plurality of pairs of frequency converters to each principal polarization component and each orthogonal polarization component of the respective coupled dipole antenna element of the plurality of coupled dipole antenna elements. In embodiments, each coupled dipole antenna array element has a transmit mode of operation associated with transmitting a plurality of respective radio frequencies, and wherein each principal polarization component and each orthogonal polarization component of the respective coupled dipole antenna array element is further configured to transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies. In embodiments, a respective intermediate frequency is associated with a respective mission center radio frequency. In embodiments, the respective mission center radio frequency is obtained by the steps of: (a) receiving, from the digital software system interface via a system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission center radio frequency; (b) storing, by memory operatively connected to the system controller, the respective mission center radio frequency for the respective coupled dipole antenna array element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission center frequency for the respective coupled dipole array antenna element. In embodiments, the respective intermediate frequency is a respective mission intermediate frequency corresponding to the respective mission center radio frequency and is obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission intermediate frequency; (b) storing, by memory operatively connected to the system controller, the respective mission intermediate frequency for the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission intermediate frequency for the respective coupled dipole array antenna element. In embodiments, a respective channel is selected by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective channel selection; (b) storing, by memory operatively connected to the system controller, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective digital beamformer, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective channel selection is associated with a respective tuner channel frequency. In embodiments, the respective tuner channel frequency corresponds to the mission intermediate frequency. In embodiments, a respective weighting factor is part of an array of weighting factors obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective weighting factor; (b) storing, by memory operatively connected to the system controller, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements; and (c) transporting, from the memory to the respective digital beamformer, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements. In embodiments, the respective weighting factor is generated for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element as a function of: i. a respective tuning parameter; ii. a respective power parameter; and iii. a respective location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element with respect to the center of the multi-band software defined antenna array tile. In embodiments, the digital software system interface generates the array of weighting factors by using the formula: wm,n=(Am,ntap*Am,ncal)︷Am,n*e-j*(θm,nsteer+θm,ntap+θm,ncal)︷θm,n wherein wm,nis a weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Am,nis an amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Atapis a tapered amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Acalis a calibration weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θm,nis a phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θsteeris a steering phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θtapis a taper phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, and θcalis a calibration phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n. In embodiments, the digital software system interface generates the respective weighting factor by using the formula: w(t)=(cosh(πα*1-4t2)cosh(πα))P wherein w(t) is the respective weighting factor at a location t, where t is defined by an array associated with a location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element, α is the respective tuning parameter, and P is the respective power parameter. In embodiments, the digital software system interface receives specific mission parameters for the plurality of coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the array of weighting factors. In embodiments, the respective weighting factor is selected from the array of weighting factors. In embodiments, a respective oscillating signal is associated with a respective oscillating signal frequency. In embodiments, the respective oscillating signal frequency is obtained by performing the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective oscillating signal frequency; (b) storing, by memory operatively connected to the system controller, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element; and (c) transporting, from the memory to the respective digital beamformer, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective oscillating signal frequency corresponds to the respective tuner channel frequency. In embodiments, a plurality of oscillating signal frequencies may be received for a plurality of principal polarization components and a plurality of orthogonal polarization components of the plurality of respective coupled dipole array antenna elements. In embodiments, the digital software system interface receives specific mission parameters for respective coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the respective oscillating signal frequency. In embodiments, a large form factor phased array system may include a plurality of multi-band software defined antenna array tiles wherein each multi-band software defined antenna array tile includes: i. a plurality of coupled dipole array antenna elements, wherein each coupled dipole array antenna element includes a principal polarization component oriented in a first direction and an orthogonal polarization component oriented in a second direction, and is configured to receive and transmit a plurality of respective first modulated signals associated with a plurality of respective radio frequencies; ii. a plurality of pairs of frequency converters, each pair of frequency converters associated with a respective coupled dipole array antenna element and including a respective principal polarization converter corresponding to a respective principal polarization component and a respective orthogonal polarization converter corresponding to a respective orthogonal polarization component, and each principal polarization converter and each respective orthogonal polarization converter is configured to: (1) receive respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from the respective coupled dipole array antenna element; and (2) convert the respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies into respective second modulated signals having a first intermediate frequency; iii. a plurality of digital beamformers operatively connected to the plurality of pairs of frequency converters wherein each digital beamformer is operatively connected to one of the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter and each digital beamformer is configured to: (1) receive the respective second modulated signals associated with the first intermediate frequency; (2) convert the respective second modulated signal from an analog signal to a digital data format; (3) generate a plurality of channels of the digital data by decimation of the digital data using a polyphase channelizer and filter using a plurality of cascaded halfband filters; (4) select one of the plurality of channels; (5) apply a first weighting factor to the digital data associated with the selected one of the plurality of channels to generate a first intermediate partial beamformed data stream; (6) combine the first intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a first partial beamformed data stream; (7) apply an oscillating signal to the first partial beamformed data stream to generate a first oscillating partial beamformed data stream; (8) apply a three-stage halfband filter to the first oscillating partial beamformed data stream to generate a first filtered partial beamformed data stream; (9) apply a time delay to the first filtered partial beamformed data stream to generate a first partial beam; and (10) transmit the first partial beam of a first beam along with a first set of a plurality of other partial beams of the first beam to a digital software system interface via a data transport bus. In embodiments, the plurality of coupled dipole array antenna elements are tightly coupled relative to the wavelength of operation. In embodiments, the plurality of coupled dipole array antenna elements are spaced at less than half a wavelength. In embodiments, the plurality of pairs of frequency converters further includes thermoelectric coolers configured to actively manage thermally the system noise temperature and increase the system gain over temperature. In embodiments, the plurality of pairs of frequency converters further includes a plurality of spatially distributed high power amplifiers so as to increase the effective isotropic radiated power. In embodiments, the first intermediate frequency is between 50 MHz and 1250 MHz. In embodiments, the radio frequencies are between 900 MHz and 6000 MHz. In embodiments, the radio frequencies are between 2000 MHz and 12000 MHz. In embodiments, the radio frequencies are between 10000 MHZ and 50000 MHz. In embodiments, each digital beamformer is configured to convert the respective second modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, each digital beamformer is configured to select one of the plurality of channels using a multiplexer. In embodiments, each digital beamformer is configured to transmit the first partial beam of the first beam along with a second set of a plurality of other partial beams of a second beam to the digital software system interface via the data transport bus. In embodiments, each digital beamformer has a transmit mode of operation associated with converting a plurality of transmit digital data from a digital signal to an analog signal having a plurality of respective intermediate frequencies, and wherein each digital beamformer is further configured to: (11) receive the first partial beam of the first beam along with the first set of the plurality of other partial beams of the first beam from the digital software system interface via the data transport bus; (12) apply a second weighting factor to first transmit digital data associated with the first partial beam of the first beam of the plurality of beams; (13) transmit the first transmit digital data to a first digital to analog converter; and (14) convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency. In embodiments, each digital beamformer is further configured to receive the first partial beam of the first beam along with the second set of a plurality of other beams of the second beam from the digital software system interface via the data transport bus. In embodiments, each digital beamformer is further configured to convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter and each respective orthogonal polarization converter have a transmit mode of operation associated with transmitting respective modulated signals associated with a plurality of radio frequencies, and wherein each principal polarization converter and its respective orthogonal polarization converter is further configured to: (3) receive respective third modulated signals associated with the first intermediate frequency from the respective digital beamformer of the plurality of digital beamformers; (4) convert the respective third modulated signals associated with the first intermediate frequency into respective fourth modulated signals having a radio frequency; and (5) transmit the respective fourth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter and each orthogonal polarization converter of the respective pair of frequency converters of the plurality of pairs of frequency converters to the respective coupled dipole array antenna element of the plurality of coupled dipole array antenna elements. In embodiments, each digital beamformer has a transmit mode of operation associated with converting a plurality of transmit digital data from a digital signal to an analog signal having a plurality of respective intermediate frequencies, and wherein each digital beamformer is further configured to: (15) receive a third partial beam of a third beam along with a third set of a plurality of other partial beams of the third beam from the digital software system interface via the data transport bus; (16) apply a third weighting factor to second transmit digital data associated with the third partial beam of the third beam; (17) transmit the second transmit digital data to a second digital to analog converter; and (18) convert, using the second digital to analog converter, the second transmit digital data from a digital signal to an analog signal having a second intermediate frequency. In embodiments, each digital beamformer is further configured to receive the third partial beam of the third beam along with a fourth set of a plurality of other beams of a fourth beam from the digital software system interface via the data transport bus. In embodiments, the second intermediate frequency is between 50 MHz and 1250 MHz. In embodiments, the second intermediate frequency is the same as the first intermediate frequency. In embodiments, each digital beamformer is further configured to convert, using the second digital to analog converter, the second transmit digital data from a digital signal to an analog signal having a second intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter and each respective orthogonal polarization converter have a transmit mode of operation associated with transmitting respective modulated signals associated with a plurality of radio frequencies, and wherein each principal polarization converter and its respective orthogonal polarization converter is further configured to: (6) receive respective fifth modulated signals associated with the second intermediate frequency from the respective digital beamformer of the plurality of digital beamformers; (7) convert the respective fifth modulated signals associated with the second intermediate frequency into respective sixth modulated signals having a radio frequency; and (8) transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter and each orthogonal polarization converter of the respective pair of frequency converters of the plurality of pairs of frequency converters to each principal polarization component and each orthogonal polarization component of the respective coupled dipole antenna element of the plurality of coupled dipole antenna elements. In embodiments, each coupled dipole antenna array element has a transmit mode of operation associated with transmitting a plurality of respective radio frequencies, and wherein each principal polarization component and each orthogonal polarization component of the respective coupled dipole antenna array element is further configured to transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies. In embodiments, a respective intermediate frequency is associated with a respective mission center radio frequency. In embodiments, the respective mission center radio frequency is obtained by the steps of: (a) receiving, from the digital software system interface via a system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission center radio frequency; (b) storing, by memory operatively connected to the system controller, the respective mission center radio frequency for the respective coupled dipole antenna array element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission center frequency for the respective coupled dipole array antenna element. In embodiments, the respective intermediate frequency is a respective mission intermediate frequency corresponding to the respective mission center radio frequency and is obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission intermediate frequency; (b) storing, by memory operatively connected to the system controller, the respective mission intermediate frequency for the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission intermediate frequency for the respective coupled dipole array antenna element. In embodiments, a respective channel is selected by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective channel selection; (b) storing, by memory operatively connected to the system controller, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective digital beamformer, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective channel selection is associated with a respective tuner channel frequency. In embodiments, the respective tuner channel frequency corresponds to the mission intermediate frequency. In embodiments, a respective weighting factor is part of an array of weighting factors obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective weighting factor; (b) storing, by memory operatively connected to the system controller, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements; and (c) transporting, from the memory to the respective digital beamformer, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements. In embodiments, the respective weighting factor is generated for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element as a function of: i. a respective tuning parameter; ii. a respective power parameter; and iii. a respective location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element with respect to the center of the multi-band software defined antenna array tile. In embodiments, the digital software system interface generates the array of weighting factors by using the formula: wm,n=(Am,ntap*Am,ncal)︷Am,n*e-j*(θm,nsteer+θm,ntap+θm,ncal)︷θm,n wherein wm,nis a weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Am,nis an amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Atapis a tapered amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Acalis a calibration weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θm,nis a phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θsteeris a steering phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θtapis a taper phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, and θcalis a calibration phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n. In embodiments, the digital software system interface generates the respective weighting factor by using the formula: w(t)=(cosh(πα*1-4t2)cosh(πα))P wherein w(t) is the respective weighting factor at a location t, where t is defined by an array associated with a location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element, α is the respective tuning parameter, and P is the respective power parameter. In embodiments, the digital software system interface receives specific mission parameters for the plurality of coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the array of weighting factors. In embodiments, the respective weighting factor is selected from the array of weighting factors. In embodiments, a respective oscillating signal is associated with a respective oscillating signal frequency. In embodiments, the respective oscillating signal frequency is obtained by performing the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective oscillating signal frequency; (b) storing, by memory operatively connected to the system controller, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element; and (c) transporting, from the memory to the respective digital beamformer, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective oscillating signal frequency corresponds to the respective tuner channel frequency. In embodiments, a plurality of oscillating signal frequencies may be received for a plurality of principal polarization components and a plurality of orthogonal polarization components of the plurality of respective coupled dipole array antenna elements. In embodiments, the digital software system interface receives specific mission parameters for respective coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the respective oscillating signal frequency. In embodiments, a wide area scanning parabolic apparatus may include: (a) a parabolic reflector mounted on a support pedestal; and (b) a digitally beamformed phased array including: i. a radome configured to allow electromagnetic waves to propagate; ii. a multi-band software defined antenna array tile including: (1) a plurality of coupled dipole array antenna elements, wherein each coupled dipole array antenna element includes a principal polarization component oriented in a first direction and an orthogonal polarization component oriented in a second direction, and is configured to receive and transmit a plurality of respective first modulated signals associated with a plurality of respective radio frequencies; (2) a plurality of pairs of frequency converters, each pair of frequency converters associated with a respective coupled dipole array antenna element and including a respective principal polarization converter corresponding to a respective principal polarization component and a respective orthogonal polarization converter corresponding to a respective orthogonal polarization component, and each principal polarization converter and each respective orthogonal polarization converter is configured to: a. receive respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from the respective coupled dipole array antenna element; and b. convert the respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies into respective second modulated signals having a first intermediate frequency; (3) a plurality of digital beamformers operatively connected to the plurality of pairs of frequency converters wherein each digital beamformer is operatively connected to one of the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter and each digital beamformer is configured to: a. receive the respective second modulated signals associated with the first intermediate frequency; b. convert the respective second modulated signal from an analog signal to a digital data format; c. generate a plurality of channels of the digital data by decimation of the digital data using a polyphase channelizer and filter using a plurality of cascaded halfband filters; d. select one of the plurality of channels; e. apply a first weighting factor to the digital data associated with the selected one of the plurality of channels to generate a first intermediate partial beamformed data stream; f. combine the first intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a first partial beamformed data stream; g. apply an oscillating signal to the first partial beamformed data stream to generate a first oscillating partial beamformed data stream; h. apply a three-stage halfband filter to the first oscillating partial beamformed data stream to generate a first filtered partial beamformed data stream; i. apply a time delay to the first filtered partial beamformed data stream to generate a first partial beam; j. transmit the first partial beam of a first beam along with a first set of a plurality of other partial beams of the first beam to a digital software system interface via a data transport bus; iii. a power and clock management subsystem configured to manage power and time of operation; iv. a thermal management subsystem configured to dissipate heat generated by the multi-band software defined antenna array tile; and v. an enclosure assembly. In embodiments, In embodiments, the plurality of coupled dipole array antenna elements are tightly coupled relative to the wavelength of operation. In embodiments, the plurality of coupled dipole array antenna elements are spaced at less than half a wavelength. In embodiments, the plurality of pairs of frequency converters further includes thermoelectric coolers configured to actively manage thermally the system noise temperature and increase the system gain over temperature. In embodiments, the plurality of pairs of frequency converters further includes a plurality of spatially distributed high power amplifiers so as to increase the effective isotropic radiated power. In embodiments, the first intermediate frequency is between 50 MHz and 1250 MHz. In embodiments, the radio frequencies are between 900 MHz and 6000 MHz. In embodiments, the radio frequencies are between 2000 MHz and 12000 MHz. In embodiments, the radio frequencies are between 10000 MHZ and 50000 MHz. In embodiments, each digital beamformer is configured to convert the respective second modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, each digital beamformer is configured to select one of the plurality of channels using a multiplexer. In embodiments, each digital beamformer is configured to transmit the first partial beam of the first beam along with a second set of a plurality of other partial beams of a second beam to the digital software system interface via the data transport bus. In embodiments, each digital beamformer has a transmit mode of operation associated with converting a plurality of transmit digital data from a digital signal to an analog signal having a plurality of respective intermediate frequencies, and wherein each digital beamformer is further configured to: (11) receive the first partial beam of the first beam along with the first set of the plurality of other partial beams of the first beam from the digital software system interface via the data transport bus; (12) apply a second weighting factor to first transmit digital data associated with the first partial beam of the first beam of the plurality of beams; (13) transmit the first transmit digital data to a first digital to analog converter; and (14) convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency. In embodiments, each digital beamformer is further configured to receive the first partial beam of the first beam along with the second set of a plurality of other beams of the second beam from the digital software system interface via the data transport bus. In embodiments, each digital beamformer is further configured to convert, using the first digital to analog converter, the first transmit digital data from a digital signal to an analog signal having the first intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter and each respective orthogonal polarization converter have a transmit mode of operation associated with transmitting respective modulated signals associated with a plurality of radio frequencies, and wherein each principal polarization converter and its respective orthogonal polarization converter is further configured to: (3) receive respective third modulated signals associated with the first intermediate frequency from the respective digital beamformer of the plurality of digital beamformers; (4) convert the respective third modulated signals associated with the first intermediate frequency into respective fourth modulated signals having a radio frequency; and (5) transmit the respective fourth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter and each orthogonal polarization converter of the respective pair of frequency converters of the plurality of pairs of frequency converters to the respective coupled dipole array antenna element of the plurality of coupled dipole array antenna elements. In embodiments, each digital beamformer has a transmit mode of operation associated with converting a plurality of transmit digital data from a digital signal to an analog signal having a plurality of respective intermediate frequencies, and wherein each digital beamformer is further configured to: (15) receive a third partial beam of a third beam along with a third set of a plurality of other partial beams of the third beam from the digital software system interface via the data transport bus; (16) apply a third weighting factor to second transmit digital data associated with the third partial beam of the third beam; (17) transmit the second transmit digital data to a second digital to analog converter; and (18) convert, using the second digital to analog converter, the second transmit digital data from a digital signal to an analog signal having a second intermediate frequency. In embodiments, each digital beamformer is further configured to receive the third partial beam of the third beam along with a fourth set of a plurality of other beams of a fourth beam from the digital software system interface via the data transport bus. In embodiments, the second intermediate frequency is between 50 MHz and 1250 MHz. In embodiments, the second intermediate frequency is the same as the first intermediate frequency. In embodiments, each digital beamformer is further configured to convert, using the second digital to analog converter, the second transmit digital data from a digital signal to an analog signal having a second intermediate frequency by performing First-Nyquist sampling. In embodiments, each principal polarization converter and each respective orthogonal polarization converter have a transmit mode of operation associated with transmitting respective modulated signals associated with a plurality of radio frequencies, and wherein each principal polarization converter and its respective orthogonal polarization converter is further configured to: (6) receive respective fifth modulated signals associated with the second intermediate frequency from the respective digital beamformer of the plurality of digital beamformers; (7) convert the respective fifth modulated signals associated with the second intermediate frequency into respective sixth modulated signals having a radio frequency; and (8) transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies from each principal polarization converter and each orthogonal polarization converter of the respective pair of frequency converters of the plurality of pairs of frequency converters to each principal polarization component and each orthogonal polarization component of the respective coupled dipole antenna element of the plurality of coupled dipole antenna elements. In embodiments, each coupled dipole antenna array element has a transmit mode of operation associated with transmitting a plurality of respective radio frequencies, and wherein each principal polarization component and each orthogonal polarization component of the respective coupled dipole antenna array element is further configured to transmit the respective sixth modulated signals associated with the respective radio frequencies of the plurality of radio frequencies. In embodiments, a respective intermediate frequency is associated with a respective mission center radio frequency. In embodiments, the respective mission center radio frequency is obtained by the steps of: (a) receiving, from the digital software system interface via a system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission center radio frequency; (b) storing, by memory operatively connected to the system controller, the respective mission center radio frequency for the respective coupled dipole antenna array element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission center frequency for the respective coupled dipole array antenna element. In embodiments, the respective intermediate frequency is a respective mission intermediate frequency corresponding to the respective mission center radio frequency and is obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission intermediate frequency; (b) storing, by memory operatively connected to the system controller, the respective mission intermediate frequency for the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission intermediate frequency for the respective coupled dipole array antenna element. In embodiments, a respective channel is selected by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective channel selection; (b) storing, by memory operatively connected to the system controller, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective digital beamformer, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective channel selection is associated with a respective tuner channel frequency. In embodiments, the respective tuner channel frequency corresponds to the mission intermediate frequency. In embodiments, a respective weighting factor is part of an array of weighting factors obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective weighting factor; (b) storing, by memory operatively connected to the system controller, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements; and (c) transporting, from the memory to the respective digital beamformer, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements. In embodiments, the respective weighting factor is generated for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element as a function of: i. a respective tuning parameter; ii. a respective power parameter; and iii. a respective location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element with respect to the center of the multi-band software defined antenna array tile. In embodiments, the digital software system interface generates the array of weighting factors by using the formula: wm,n=(Am,ntap*Am,ncal)︷Am,n*e-j*(θm,nsteer+θm,ntap+θm,ncal)︷θm,n wherein wm,nis a weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Am,nis an amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Atapis a tapered amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Acalis a calibration weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θm,nis a phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θsteeris a steering phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θtapis a taper phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, and θcalis a calibration phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n. In embodiments, the digital software system interface generates the respective weighting factor by using the formula: w(t)=(cosh(πα*1-4t2)cosh(πα))P wherein w(t) is the respective weighting factor at a location t, where t is defined by an array associated with a location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element, α is the respective tuning parameter, and P is the respective power parameter. In embodiments, the digital software system interface receives specific mission parameters for the plurality of coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the array of weighting factors. In embodiments, the respective weighting factor is selected from the array of weighting factors. In embodiments, a respective oscillating signal is associated with a respective oscillating signal frequency. In embodiments, the respective oscillating signal frequency is obtained by performing the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective oscillating signal frequency; (b) storing, by memory operatively connected to the system controller, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element; and (c) transporting, from the memory to the respective digital beamformer, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective oscillating signal frequency corresponds to the respective tuner channel frequency. In embodiments, a plurality of oscillating signal frequencies may be received for a plurality of principal polarization components and a plurality of orthogonal polarization components of the plurality of respective coupled dipole array antenna elements. In embodiments, the digital software system interface receives specific mission parameters for respective coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the respective oscillating signal frequency. In embodiments, a method for digital beamforming may include: (a) receiving, by a first coupled dipole array antenna element of a plurality coupled dipole array antenna elements of a multi-band software defined antenna array tile, a plurality of respective modulated signals associated with a plurality of respective radio frequencies, wherein each coupled dipole array antenna element of the plurality of coupled dipole array antenna elements includes a respective principal polarization component oriented in a first direction and a respective orthogonal polarization component oriented in a second direction; (b) receiving, by a first principal polarization frequency converter of a first pair of frequency converters of a plurality of pairs of frequency converters of the multi-band software defined antenna array tile, from a first principal polarization component of the first coupled dipole array antenna element of the plurality of coupled dipole array antenna elements, respective first modulated signals associated with the respective radio frequencies of the plurality of respective radio frequencies, wherein each pair of frequency converters of the plurality of pairs frequency converters is operatively connected to a respective coupled dipole array antenna element, and wherein each pair of frequency converters of the plurality of pairs frequency converters includes a respective principal polarization converter corresponding to a respective principal polarization component and a respective orthogonal polarization converter corresponding to a respective orthogonal polarization component; (c) converting, by the first principal polarization frequency converter of the first pair of frequency converters, the respective first modulated signals associated with the respective radio frequencies of the plurality of radio frequencies into respective second modulated signals having a first intermediate frequency; (d) receiving, by a first digital beamformer of a plurality of digital beamformers of the multi-band software defined antenna array tile, from the first principal polarization frequency converter, the respective second modulated signals associated with the first intermediate frequency, wherein the plurality of digital beamformers are operatively connected to the plurality of pairs of frequency converters, and wherein each digital beamformer is operatively connected to one of the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter; (e) converting, by the first digital beamformer, the respective second modulated signal from an analog signal to a digital data format; (f) generating, by the first digital beamformer, a first plurality of channels of first digital data by decimating the first digital data using a first polyphase channelizer and filtering using a first plurality of cascaded halfband filters; (g) selecting, by the first digital beamformer, a first channel of the first plurality of channels; (h) applying, by the first digital beamformer, a first weighting factor to the first digital data associated with the first channel to generate a first intermediate partial beamformed data stream; (i) combining, by the first digital beamformer, the first intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a first partial beamformed data stream; (j) applying, by the first digital beamformer, a first oscillating signal to the first partial beamformed data stream to generate a first oscillating partial beamformed data stream; (k) applying, by the first digital beamformer, a first three-stage halfband filter to the first oscillating partial beamformed data stream to generate a first filtered partial beamformed data stream; (1) applying, by the first digital beamformer, a first time delay to the first filtered partial beamformed data stream to generate a first partial beam; and (m) transmitting, by the first digital beamformer via a data transport bus to a digital software system interface, the first partial beam of a first beam, which is transmitted via the data transport bus along with a first set of a plurality of other partial beams of the first beam. In embodiments, the method further includes, prior to step (a), the steps of: reflecting, from a surface of a parabolic reflector mounted on a support pedestal, the plurality of respective modulated signals and transmitting the reflected plurality of respective modulated signals through a radome to the first coupled dipole array antenna element. In embodiments, the plurality of coupled dipole array antenna elements are tightly coupled relative to the wavelength of operation. In embodiments, the plurality of coupled dipole array antenna elements are spaced at less than half a wavelength. In embodiments, the plurality of pairs of frequency converters further includes thermoelectric coolers configured to actively manage thermally the system noise temperature and increase the system gain over temperature. In embodiments, the plurality of pairs of frequency converters further includes a plurality of spatially distributed high power amplifiers so as to increase the effective isotropic radiated power. In embodiments, the first intermediate frequency is between 50 MHz and 1250 MHz. In embodiments, the radio frequencies are between 900 MHz and 6000 MHz. In embodiments, the radio frequencies are between 2000 MHz and 12000 MHz. In embodiments, the radio frequencies are between 10000 MHZ and 50000 MHz. In embodiments, the method further includes converting, by the first digital beamformer the respective modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, the method further includes selecting, by the first digital beamformer, the first channel of the first plurality of channels using a first multiplexer. In embodiments, the method further includes transmitting, by the first digital beamformer via the data transport bus to the digital software system interface, the first partial beam of the first beam, which is transmitted via the data transport bus along with a second set of a plurality of other partial beams of a second beam. In embodiments, the method further includes, after step (a): (n) receiving, by a first orthogonal polarization frequency converter of the first pair of frequency converters of the plurality of pairs of frequency converters of the multi-band software defined antenna array tile, from a first orthogonal polarization component of the first coupled dipole array antenna element of the plurality of coupled dipole array antenna elements, respective third modulated signals associated with the respective radio frequencies of the plurality of respective radio frequencies; (o) converting, by the first orthogonal polarization frequency converter of the first pair of frequency converters, the respective third modulated signals associated with the respective radio frequencies of the plurality of radio frequencies into respective fourth modulated signals having the first intermediate frequency; (p) receiving, by a second digital beamformer of the plurality of digital beamformers of the multi-band software defined antenna array tile, from the first orthogonal polarization frequency converter of the first pair of frequency converters, the respective fourth modulated signals associated with the first intermediate frequency; (q) converting, by the second digital beamformer, the respective fourth modulated signal from an analog signal to a digital data format; (r) generating, by the second digital beamformer, a second plurality of channels of second digital data by decimating the second digital data using a second polyphase channelizer and filtering using a second plurality of cascaded halfband filters; (s) selecting, by the second digital beamformer, a second channel of the second plurality of channels; (t) applying, by the second digital beamformer, a second weighting factor to the second digital data associated with the second channel to generate a second intermediate partial beamformed data stream; (u) combining, by the second digital beamformer, the second intermediate partial beamformed data stream with the plurality of other intermediate partial beamformed data streams to generate a second partial beamformed data stream; (v) applying, by the second digital beamformer, a second oscillating signal to the second partial beamformed data stream to generate a second oscillating partial beamformed data stream; (w) applying, by the second digital beamformer, a second three-stage halfband filter to the second oscillating partial beamformed data stream to generate a second filtered partial beamformed data stream; (x) applying, by the second digital beamformer, a second time delay to the second filtered partial beamformed data stream to generate a second partial beam; and (y) transmitting, by the second digital beamformer via the data transport bus to the digital software system interface, the second partial beam of the first beam, which is transmitted via the data transport bus along with a third set of a plurality of other partial beams of the first beam. In embodiments, the method further includes converting, by the second digital beamformer, the respective modulated signal from an analog signal to a digital data format by performing First-Nyquist sampling. In embodiments, the method further includes selecting, by the second digital beamformer, the second channel of the second plurality of channels using a second multiplexer. In embodiments, the second oscillating signal is the same as the first oscillating signal. In embodiments, the second channel is the same as the first channel. In embodiments, the method further includes transmitting, by the second digital beamformer via the data transport bus to the digital software system interface, the second partial beam of the second beam, which is transmitted via the data transport bus along with a fourth set of a plurality of other partial beams of the second beam. In embodiments, a respective intermediate frequency is associated with a respective mission center radio frequency. In embodiments, the respective mission center radio frequency is obtained by the steps of: (a) receiving, from the digital software system interface via a system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission center radio frequency; (b) storing, by memory operatively connected to the system controller, the respective mission center radio frequency for the respective coupled dipole antenna array element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission center frequency for the respective coupled dipole array antenna element. In embodiments, the respective intermediate frequency is a respective mission intermediate frequency corresponding to the respective mission center radio frequency and is obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective mission intermediate frequency; (b) storing, by memory operatively connected to the system controller, the respective mission intermediate frequency for the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective principal polarization frequency converter and the respective orthogonal polarization frequency converter, the respective mission intermediate frequency for the respective coupled dipole array antenna element. In embodiments, a respective channel is selected by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective channel selection; (b) storing, by memory operatively connected to the system controller, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element; and (c) transporting, from the memory to the respective digital beamformer, the respective channel selection for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective channel selection is associated with a respective tuner channel frequency. In embodiments, the respective tuner channel frequency corresponds to the respective mission intermediate frequency. In embodiments, a respective weighting factor is part of an array of weighting factors obtained by the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective weighting factor; (b) storing, by memory operatively connected to the system controller, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements; and (c) transporting, from the memory to the respective digital beamformer, the respective weighting factor for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements. In embodiments, the respective weighting factor is generated for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element as a function of: i. a respective tuning parameter; ii. a respective power parameter; and iii. a respective location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element with respect to the center of the multi-band software defined antenna array tile. In embodiments, the digital software system interface generates the array of weighting factors by using the formula: wm,n=(Am,ntap*Am,ncal)︷Am,n*e-j*(θm,nsteer+θm,ntap+θm,ncal)︷θm,n wherein wm,nis a weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Am,nis an amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Atapis a tapered amplitude weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, Acalis a calibration weighting factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θm,nis a phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θsteeris a steering phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, θtapis a taper phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n, and θcalis a calibration phase factor associated with each position in the antenna array expressed as a horizontal position m and a vertical position n. In embodiments, the digital software system interface generates the respective weighting factor by using the formula: w(t)=(cosh(πα*1-4t2)cosh(πα))P wherein w(t) is the respective weighting factor at a location t, where t is defined by an array associated with a location of the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element, α is the respective tuning parameter, and P is the respective power parameter. In embodiments, the digital software system interface receives specific mission parameters for the plurality of coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the array of weighting factors. In embodiments, the respective weighting factor is selected from the array of weighting factors. In embodiments, a respective oscillating signal is associated with a respective oscillating signal frequency. In embodiments, the respective oscillating signal frequency is obtained by performing the steps of: (a) receiving, from the digital software system interface via the system controller by memory of the digitally beamformed phased array system, for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array antenna element of the plurality of respective coupled dipole array antenna elements, the respective oscillating signal frequency; (b) storing, by memory operatively connected to the system controller, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element; and (c) transporting, from the memory to the respective digital beamformer, the respective oscillating signal frequency for the respective principal polarization component and the respective orthogonal polarization component of the respective coupled dipole array element. In embodiments, the respective oscillating signal frequency corresponds to the respective tuner channel frequency. In embodiments, a plurality of oscillating signal frequencies may be received for a plurality of principal polarization components and a plurality of orthogonal polarization components of the plurality of respective coupled dipole array antenna elements. In embodiments, the digital software system interface receives specific mission parameters for respective coupled dipole array antenna elements as an input, and wherein the digital software system interface uses the specific mission parameters to generate the respective oscillating signal frequency. Fine Loop Pointing In embodiments, the digitally beamformed phased array feed210of the wide area scanning parabolic apparatus200, which includes the multi-band software defined antenna tile110, may be used to achieve a higher overall motion profile for tracking flight objects than existing antenna systems. For example, existing satellite antennas100used with a parabolic reflector mounted on a support pedestal may be implemented in high seas environments, such as on ships or other water vessels. In those environments, the wave motion of the body of water beneath the water vessel may affect the operation of the antenna. For example, in order for the antenna to maintain the beam at a fixed point or on an object in the sky or on the horizon, the base of the antenna, including the reflector and support pedestal, must be continuously adjusted to counteract the movement of the water vessel and the base of the antenna caused by the force of the waves. Referring toFIG.26, this requires moving and rotating the parabolic reflector114and support pedestal112, respectively, about the Azimuth (Az) axis (measured in degrees, θ, or radians) and Elevation (El) axis (measured in degrees, θ, or radians) of the Az/El spherical coordinate system, to maintain the antenna beam's desired position on a flight object108in the sky. In many cases, the wave motion may be so severe that the entire existing antenna system, including the pedestal must be implemented such that it may be adjusted continuously so as to rotate around a roll axis, in addition to the Az/El axes. Referring toFIG.26, this may require implementing the antenna system such that the pedestal may rotate about the x and y axes of a 3-dimensional coordinate system. The current practice requires the implementation of highly agile, and often expensive, pedestals on water vessels. This is because existing antenna systems in the current state of practice use beam amplitude and phase control to taper antenna sidelobes at some expense to the antenna gain, while maintaining a narrow main lobe beamwidth for optimal directivity of the beam. However, if the system maintains a narrow main lobe beamwidth, the system's ability to steer the beam to compensate for the movement of the vessel or other volatile base system caused by wave motion is severely limited. The pointing authority of the antenna system that is under electronic control is defined as the inner loop of the antenna system. That is, the inner loop is the electronic ability to steer the beam. The outer loop of the system, on the other hand, includes the physical limits of the antenna system to steer the beam by moving and/or rotating the reflector and pedestal of the antenna system. As discussed above, the outer loop of the system may be increased or widened by implementing the base of the pedestal and/or any other component of the antenna system on a roll axis. In embodiments of the present invention, the use of digital beamforming to steer and control a beam enables fine loop pointing across a wider inner loop allowing more physical leeway to the system. In embodiments, by using beam-broadening techniques, a digitally beamformed phased array feed210may enable a new or existing satellite antenna to scan a wider area of the sky while automatically adjusting and maintaining the physical position of the antenna. The current state of practice requires the use of highly agile, and thereby expensive, pedestals that may need to rotate at, for example, a maximum angular velocity of 40 degrees per second (Az/El), and a maximum angular acceleration of 10 degrees per second squared. Rotation of a parabolic reflector at high angular velocities and accelerations creates excessive kinetic energy and places a significant load and burden on the associated gear box. The system described in embodiments of the present invention allows the use of pedestals that may rotate, for example, at an angular velocity of 15 degrees per second (Az/El), and an angular acceleration of 3 degrees per second squared. However, in embodiments, because the broadened beam formed by the digitally beamformed phased array feed may be steered quickly and digitally, the effective angular velocity and acceleration of the system may exceed the maximum angular velocity and acceleration capabilities of existing pedestals. For example, in embodiments, the digitally beamformed phased array feed210may allow the lower agility pedestal having a maximum angular velocity of 15 degrees per second (Az/El), and a maximum angular acceleration of 3 degrees per second squared, to instead have a maximum effective angular velocity of 100 degrees per second (Az/El), and a maximum effective angular acceleration of 25 degrees per second squared. Another problem facing current beamforming systems is the “keyhole” effect. The keyhole is a region above an antenna where the antenna is unable to adequately track an object due to either physical or digital constraints of the system. As an antenna approaches an elevation angle of 90 degrees, the system will fail, and the antenna will not be able to continue tracking an object through the “keyhole”. In traditional narrow beam antenna systems, if a tracked object passes through a keyhole, an antenna must have high agility (requiring high angular velocity rotation) in order to rotate its support pedestal or gimbal on the azimuth axis and continue tracking the object. Additionally, when the object passes through the keyhole, the antenna will lose communication with the object because the narrow beam of the antenna tracks with the center of the pointing authority of the antenna. In embodiments of the present invention, the wide range of the beam allows for significantly more leeway as an object passes through the keyhole and does not require the system to abandon communication with the flight object at any point. In embodiments, the broad beam may allow a reflector and pedestal with low agility to rotate to avoid the keyhole while maintaining communication with the flight object while it moves through the keyhole. In embodiments, when the parabolic reflector114reaches a maximum elevation angle, the system will calculate the trajectory of the flight object108while it is in the blind region, and using this trajectory, will automatically rotate the parabolic reflector114such that flight object108may continue to be tracked by the beam while it is in the blind region. In embodiments, the system may maintain a constant flow of data without risking the mechanical integrity of the system. In embodiments, the method for fine loop pointing may be implemented with a digitally beamformed phased array feed210described above, or it may be implemented with any other beamforming system. In embodiments, the digital software system704may process the plurality of beams received from the plurality of digital beamformers306via the data transport bus702in order to generate a graphical display340displaying the plurality of beams. In embodiments, the plurality of beams may be assigned different tasks based on the mission parameters delivered to the system via the system controller412. For example, in embodiments, a first beam may be assigned to acquire flight objects located within the range of the plurality of beams. In embodiments, a second beam may be assigned to a flight object108acquired by the acquisition beam in order to receive and process and/or transmit radio frequency signals from the flight object108. In embodiments, a third beam may be assigned to track the movement of the flight object108so that the second beam may be adjusted so as to maintain communication with the flight object108. In embodiments, the plurality of beams may include a plurality of acquisition beams, a plurality of receive and/or transmit beams, and/or a plurality of tracking beams, to name a few. In embodiments, because the systolic digital beam formed by the digitally beamformed phased array feed210is significantly wider than beams formed by traditional beamforming systems (as shown inFIGS.16A and16B), the digital software system704may track a plurality of flight objects108using a plurality of beams simultaneously without requiring substantial physical adjustment of the parabolic reflector114.FIGS.30A-Dare schematic illustrations of a graphical display340generated by a method for fine loop pointing in accordance with embodiments of the present invention. In embodiments, the graphical display340may display a plurality of flight objects108simultaneously. In embodiments, a user of the graphical display340may assign one or more beams to a flight object108in order to receive and/or transmit communications to and/or from the flight object108by the digital software system704. In embodiments, the user may assign a tracking priority to an object108so that the system may prioritize the tracking of one flight object over another flight object. In embodiments, referring toFIG.31, an exemplary process for generating a graphical display340using fine loop pointing may begin with step S3102. At step S3102, in embodiments, the digital software system704may generate a graphical display340during a first time period. In embodiments, the generating step may include a plurality of sub-steps. In embodiments, referring toFIG.31A, the generating step may proceed with step S3102A. At step S3102A, the digital software system704may receive first angular direction information via a pedestal controller124operatively connected to a first parabolic reflector114. In embodiments, the parabolic reflector114may be configured to automatically rotate about an elevation axis between a first range of a plurality of elevation angles between a range of a plurality of angular velocities. In embodiments, the rotation of the parabolic reflector114may be controlled electronically by the pedestal controller124. In embodiments, the pedestal controller124may be operatively connected the digital software system704. In embodiments, the pedestal controller124may be used to control the movement and rotation of the parabolic reflector114based on the angular direction information transmitted by the digital software system704. In embodiments, the first angular direction information may include a first azimuth axis component and a first elevation axis component associated with the first parabolic reflector114during the first time period. In embodiments, the azimuth and elevation components may be in degrees, radians, or any other non-cartesian coordinate system. In embodiments, the first angular direction information may indicate the direction that the centroid270of the parabolic reflector114is pointing. In embodiments, the point at which the first azimuth axis and the first elevation axis intersect is the centroid270of the parabolic reflector114. For example, in embodiments referring toFIG.30A, the angular direction information may indicate that the parabolic reflector114is pointing at an azimuth angle component of 14 degrees, and an elevation angle component of 61 degrees. In embodiments, the centroid270of the parabolic reflector114is the direction of a center point of the parabolic reflector114. In embodiments, the parabolic reflector114described with respect to fine loop pointing may include both the reflector114and a support pedestal112. In embodiments, the parabolic reflector114may rotate about the elevation axis, and the support pedestal112may rotate about the azimuth axis. In embodiments, the parabolic reflector114may rotate about the elevation axis and the azimuth axis using a gimbal. For example, in embodiments, the reflector114may rotate using a gimbal, while the gimbal is positioned on a stationary support pedestal112. In embodiments, referring toFIG.31A, the generating step may continue with step S3102B. At step3102B, the digital software system704may receive a first set of respective first digital data streams associated with a first plurality of partial beams via a data transport bus702. For example, in embodiments, the digital data streams may be transported via the digital transport bus702shown inFIG.7. In embodiments, each respective partial beam may be associated with a respective first digital data stream and data in the respective first digital data stream may be associated with a first plurality of respective modulated radio frequency signals received by a plurality of antenna array elements304. In embodiments, each partial beam may be formed by a respective digital beamformer306-nof the plurality of digital beamformers306, described above with respective to at leastFIG.8. In embodiments, referring again toFIG.31A, the generating step may continue with step S3102C. At step3102C, the digital software system704may process the first set of respective first digital data streams associated with the first plurality of partial beams to generate a second set of respective second digital data streams associated with the first plurality of beams associated with the first plurality of partial beams. In embodiments, each beam of the first plurality of beams is based on at least two respective first digital data streams. In embodiments, each beam may be based on 2 partial beams (for example, an orthogonal polarization component partial beam and a principal polarization component partial beam). In embodiments, referring again toFIG.31A, the generating step may continue with step S3102D. At step3102D, the digital software system704may process the second set of respective second digital data streams associated with the first plurality of beams to determine respective location information for each object of a first set of objects108-nincluding at least a first object108-1. In embodiments, the first set of objects may include simulation objects and tracking objects. In embodiments, simulation objects may be used to test and calibrate the digital software system704. In embodiments, tracking objects may be real objects108. In embodiments, an object108may be a satellite, plane, drone, or any other flight object, to name a few. In embodiments, the respective location information may include an azimuth component and an elevation component relative to the angular direction information associated with the parabolic reflector114. For example, in embodiments referring toFIG.30A, the first plurality of beams may indicate that the first object108-1is located at an azimuth angle of approximately 8 degrees, and an elevation angle of approximately 51 degrees. In embodiments, the plurality of beams may include the wide beam that is generated by the digitally beamformed array feed210using the beam broadening taper. In embodiments, the wide beam allows the other respective beams of the first plurality of beams to receive and transmit radio frequency signals associated with a plurality of flight objects108within the range of the wide beam. In embodiments, the digital software system704may process the second set of respective second digital data streams associated with the first plurality of beams to determine respective location information for each object of the first set objects108-n, including the first object108-1and a second object108-2, for example. In embodiments, there may be additional objects located by the digital software system704. In embodiments, referring again toFIG.31A, the generating step may continue with step S3102E. At step3102E, the digital software system704may generate the graphical display340. In embodiments, referring for example toFIG.30A, the graphical display340may display the first plurality of beams, the first set of objects, including the first object108-1, a first azimuth axis based on the first azimuth axis component, and a first elevation axis based on the first elevation axis component. In embodiments, in the case where the first set of objects includes the first object108-1and the second object108-2, the graphical display340may display the first plurality of beams, the first set objects, including the first object108-1and the second object108-2, the first azimuth axis, and the first elevation axis.FIGS.30B and30Care schematic illustrations of a graphical display340generated by a digital software system704, where the display340shows the respective location of two objects in accordance with embodiments of the present invention. For example, in embodiments referring toFIG.30B, the first plurality of beams may indicate that the first object108-1is located at an azimuth angle of approximately 0 degrees, and an elevation angle of approximately 30 degrees. Continuing this example, in embodiments, the first plurality of beams may indicate that the second object108-2is located at an azimuth angle of approximately 0 degrees, and an elevation angle of approximately 50 degrees. In embodiments, referring again toFIG.31A, the generating step may continue with step S3102F. At step3102F, the digital software system704may provide for a display of at least a portion of the graphical display340, as shown for example inFIG.30A, on a display operably connected to the digital software system704. In embodiments, the display may be a stationary device, mobile device, or any other type of display device. For example, in embodiments, the display may be on a desktop computer, laptop, mobile phone, radio system, or tablet, or any combination thereof, to name a few. In embodiments, referring back toFIG.31, the method may continue with step S3104. At step S3104, in embodiments, the first object108-1may be selected and assigned priority information using the digital software system704. In the case where there are two objects the first object108-1and the second object108-2may be selected and assigned priority information using the digital software system704(discussed below with respect to multiple object tracking). In embodiments, referring toFIG.31B, step S3104may include a plurality of sub-steps. In embodiments, referring toFIG.31B, the process may continue with step S3104A. At step S3104A, the first object108-1displayed by the graphical display340may be selected using the digital software system704. In embodiments, the first object108-1may be selected automatically by the digital software system704based on characteristics of the first object. In embodiments, the characteristics may include object velocity, mass, and/or acceleration, to name a few. In embodiments, the first object108-1may be selected manually by a user using one or more input elements operably connected to the digital software system704via the graphical display340. For example, in embodiments referring toFIGS.30A-30D, the graphical display340may display a list of the objects included in the first set of objects. In embodiments, the user may select an object to track from the list. In embodiments, selection may be based on selection information provided by the user. In embodiments, the selection information may be provided using one or more input devices operatively connected to the digital software system. In embodiments, the input devices may include one or more of a keyboard, mouse, button, switch, and/or touchscreen, to name a few. In embodiments, referring toFIG.31B, the process may continue with step S3104B. At step S3104B, first priority information may be assigned to the first object108-1using the digital software system704. In embodiments, the first priority information may be assigned to the first object108-1automatically by the digital software system704based on the selection in step S3104A, for example. In embodiments, the first priority information may be assigned to the first object108-1manually by a user of the digital software system704using the graphical display340or using any suitable input device. In embodiments, the first priority information may be a weight assigned to the first object108-1. For example, in embodiments, the first priority information may be a primary object weight, a secondary object weight or a ternary object weight. In embodiments, for example the primary object weight may be 1, while the secondary object weight may be 0.5, and the ternary object weight may be 0.25. In embodiments, the weights may be used by the digital software system704when calculating angular direction information for the parabolic reflector114, as described below. In embodiments, the priority information may be based on object characteristics, such as object velocity, mass, and/or acceleration, to name a few. In embodiments, multiple objects may be assigned the same weight. In embodiments, there may be additional object weights. In embodiments, referring toFIG.31B, the process may continue with step S3104C. At step S3104C, the digital software system704may assign a first beam of the plurality of beams to the first object108-1. In embodiments, the first beam will be associated with the first object108-1in order to receive and/or transmit radio frequency signals to/from the object, as further described below. Single Object Pointing In embodiments, if the first set of objects includes only the first object108-1, the process may proceed directly from step S3104C to step S3106(referring toFIG.31). In embodiments, referring back toFIG.31, the method may continue from step S3104C with step S3106. At step S3106, the digital software system704may provide respective direction information associated with the first beam and the first parabolic reflector114. In embodiments, step S3106may include a plurality of sub-steps. In embodiments, referring toFIG.31C, the process may continue with step S3106A. At step S3106A, the digital software system704may generate a respective first weighting factor associated with the first beam as part of a first array of weighting factors associated with the first plurality of beams. In embodiments, the respective first weighting factor may be generated based on the respective location information associated with the first object108-1, the first azimuth axis, and the first elevation axis. In embodiments, the respective first weighting factor will be used by a respective digital beamformer306-n, along with the first array of weighting factors, to direct the first beam to the first object108-1. For example, in embodiments, the respective first weighting factor along with the first array of weighting factors may be generated by the using the formulas discussed above with respect toFIGS.15A-15B,16A-16B. In embodiments, referring toFIG.31C, the process may continue with step S3106B. At step S3106B, the digital software system704may generate second angular direction information associated with the parabolic reflector114. In embodiments, the second angular direction information may include a second azimuth axis component and a second elevation axis component. In embodiments, as noted above, the point at which the second azimuth axis and the second elevation axis intersect is the centroid270of the parabolic reflector114. In embodiments, the second angular direction information may be generated based on the first beam, the respective location information associated with the first object108-1, the first azimuth axis, and the first elevation axis. In embodiments, in the case where there is one object being tracked, the second angular direction information will indicate that the centroid270of the parabolic reflector114will point directly toward the first object108-1. In embodiments, still referring toFIG.31C, the process may continue with step S3106C. At step S3106C, the respective first weighting factor associated with first beam may be transmitted from the digital software system to a respective digital beamformer306-n, for example, of a plurality of digital beamformers via a system controller412. In embodiments, the respective digital beamformer306-nmay be operatively connected to the plurality of antenna array elements and the system controller412. In embodiments, the system controller412may provide the respective first weighting factor to the respective digital beamformer306-nso that the respective digital beamformer306-nmay direct the first beam to the first object108-1. For example, in embodiments, the respective first weighting factor along with the first array of weighting factors may be transmitted to the plurality of digital beamformers306-nas discussed above with respect toFIG.22. In embodiments, still referring toFIG.31C, the process may continue with step S3106D. At step S3106D, the digital software system704may transmit the second angular direction information via the pedestal controller124to the first parabolic reflector114. In embodiments, pedestal controller124may direct the movement and rotation of the parabolic reflector114based on the second angular direction information. For example, in embodiments, the second angular direction information may cause the pedestal controller124to rotate the parabolic reflector114in the elevation angular direction, the azimuth angular direction, or both. In embodiments, referring back toFIG.31, the method may continue with step S3108. At step S3108, the digital software system704may update the graphical display340during a second time period. In embodiments, for example, the first time period may be 5 milliseconds, and the second time period may be the next 5 milliseconds. Therefore, in embodiments, the graphical display340may be updated every 5 milliseconds. In embodiments, the second time period may be different from the first time period. In embodiments, the graphical display340may be updated to reflect movement of the first set of objects108during the second time period. In embodiments, the process may instead begin with step S3108. For example, in embodiments, the process may begin after a graphical display340has already been generated by a digital software system704, and at least one object108-1is already being tracked by the system such that a first beam is already directed to the first object108-1prior to the start of the process. In embodiments, the process may begin with updating the graphical display340to reflect the movement of the object108-1during a time period. In embodiments, step S3108may include a plurality of sub-steps. In embodiments, referring toFIG.31D, the process may continue with step S3108A. At step S3108A, the digital software system704may receive third angular direction information associated with first parabolic reflector114via the pedestal controller124. In embodiments, the third angular direction information may include a third azimuth axis component and a third elevation axis component. In embodiments, the third angular direction information may be the same as the second angular direction transmitted to the parabolic reflector114in step S3106D. In embodiments, the third angular direction information may be different from the second angular direction transmitted to the parabolic reflector114in step S3106D. In embodiments, referring toFIG.31D, the process may continue with step S3108B. At step S3108B, the digital software system704may receive a third set of respective third digital data streams associated with the first plurality of partial beams. In embodiments, each respective partial beam of the first plurality of partial beams may be associated with a respective third digital data stream and data in the respective third digital data stream may be associated with a second plurality of respective modulated signals received by the plurality of antenna array elements304. In embodiments, the second plurality of respective modulated signals are received by the plurality of antenna array elements, processed by the respective digital beamformer306-n, and received by the digital software system704during the second time period. In embodiments, still referring toFIG.31D, the process may continue with step S3108C. At step S3108C, the digital software system704may process the third set of respective third digital data streams associated with the first plurality of partial beams to generate a fourth set of respective fourth digital data streams associated with the first plurality of beams. In embodiments, each beam of the first plurality of beams is based on at least two respective fourth digital data streams. In embodiments, still referring toFIG.31D, the process may continue with step S3108D. At step S3108D, the digital software system704may process the fourth set of respective fourth digital data streams associated with the first plurality of beams to generate first object movement information associated with the first object108-1. In embodiments, the first object movement information may include a first object angular velocity and a first object angular direction. In embodiments, the first object angular direction may include a first object elevation angle component and a first object azimuth angle component. For example in embodiments, one beam of the first plurality of beams may be assigned to be a tracking beam, based on mission parameters received from the digital software system704via the system controller412, as discussed above with respect toFIGS.18-23. In embodiments, the tracking beam may be processed in order to determine the first object movement information during the second time period. In embodiments, still referring toFIG.31D, the process may continue with step S3108E. At step S3108E, the digital software system704may update the graphical display340to display the first plurality of beams, the first set of objects108including the first object108-1, a second azimuth axis, and a second elevation axis. In embodiments, the first set of objects may be displayed based on at least the first object movement information. In embodiments, the second azimuth axis may be displayed based on the third azimuth axis component. In embodiments, the second elevation axis may be displayed based on the third elevation axis component. In embodiments, the updated graphical display may reflect the changes in the movement of the first set of objects and the centroid270of the parabolic reflector114during the second time period. In embodiments, referring back toFIG.31, the method may continue with step S3110. At step S3110, the digital software system704may provide respective updated direction information associated with the first beam and the first parabolic reflector114. In embodiments, step S3110may include a plurality of sub-steps. In embodiments, referring toFIG.31E, the process may continue with step S3110A. At step S3110A, the digital software system704may generate fourth angular direction information associated with the first parabolic reflector114. In embodiments, the fourth angular direction information may include a fourth elevation axis component and a fourth azimuth axis component. In embodiments, in the case where there is one object being tracked, the second angular direction information will indicate that the centroid270of the parabolic reflector114will point directly toward the first object108-1. In embodiments, the fourth angular direction information may be determined by performing a “keyhole” analysis, which provides a technical solution to the technical “keyhole” problem discussed above in accordance with exemplary embodiments of the present invention.FIGS.28A and28Bdepict schematic illustrations of keyhole avoidance by a centroid270of a parabolic reflector114in accordance with embodiments of the present invention.FIG.29depicts a schematic illustration of the adjusted gimbal trajectory280associated with the centroid270of a parabolic reflector114generated based on keyhole avoidance in accordance with embodiments of the present invention. For example, in embodiments, the digital software system704may determine whether the first object108-1will pass through the keyhole associated with the range of motion of the parabolic reflector114based on its angular trajectory. In embodiments, referring toFIG.31F, the process for keyhole avoidance may begin with step S3110A-1. At step S3110A-1, in embodiments, the digital software system704may determine a first angular trajectory (e.g., referred to inFIGS.28A and28Bas gimbal trajectory280) associated with the respective angular direction of the first parabolic reflector114. In embodiments, the first angular trajectory may be determined based on the respective location information associated with the first object108-1, the first object movement information, the third angular direction information, the second azimuth axis, and the second elevation axis. For example, in embodiments, the angular trajectory may be based on current location of the object, how the object moved since the last update of the graphical display340, the direction that the parabolic reflector114was pointing during the second time period, and the location of the centroid270of parabolic reflector114during the second time period. In embodiments, referring toFIG.31F, the keyhole avoidance process may continue with step S3110A-2. In embodiments, the digital software system704may determine whether the first parabolic reflector114is projected to exceed a maximum elevation angle based on the first angular direction trajectory. In embodiments, the maximum elevation angle may be the angle where there the parabolic reflector114will mechanically or electronically fail such that the system will be unable to continue tracking an object. It is critical in antenna systems that the parabolic reflector does not exceed its maximum elevation angle. In embodiments, the maximum elevation angle may be, for example, 85 degrees. In embodiments, the maximum elevation angle may vary based on the specifications of the parabolic reflector114. In embodiments, referring toFIG.31F, in the case where the first parabolic reflector is not projected to exceed the maximum elevation angle, the keyhole avoidance process may continue with step S3110A-3. At step S3110A-3, the digital software system704may generate the fourth angular direction information based on the first beam and the first angular direction trajectory. In embodiments, this step is completed if the angular direction trajectory indicates that the object108-1will not pass through the keyhole, and therefore the angular direction of the reflector114may be calculated by its standard process. After step S3110A-3, the process may continue with step S3110B. In embodiments, referring toFIG.31F, in the case where the first parabolic reflector is projected to exceed the maximum elevation angle, the keyhole avoidance process may continue with step S3110A-4, instead of step S3110A-3. In embodiments, at step S3110A-4, the digital software system704may determine whether the second elevation axis has exceeded a first threshold elevation angle. In embodiments, the threshold elevation angle may indicate a position of the reflector114where the centroid270of the reflector114is approaching the maximum elevation angle, and therefore the keyhole must be avoided by using alternative calculations for the angular direction of the reflector. For example, in embodiments, if the maximum elevation angle of the reflector114is 85 degrees, then the threshold elevation angle may be 80 degrees. In this example, this may indicate that, in embodiments, if the centroid270of the reflector114has passed 80 degrees of elevation, the digital software system704must make a keyhole avoidance determination. In embodiments, the threshold elevation angle may be set manually by a user of the graphical display340. In embodiments, the threshold elevation angle may be set automatically by the digital software system based on received mission parameters or reflector specifications. In embodiments, referring toFIG.31F, in the case where the second elevation axis has not exceeded the first threshold elevation angle, the process may continue with step S3110A-5. At step S3110A-5, in embodiments, the digital software system704may generate the fourth angular direction information based on the first beam and the first angular direction trajectory. In embodiments, if the object is projected to pass through the keyhole but the threshold elevation angle has not yet been exceeded, the fourth angular direction information will be calculated by the standard process based on the angular trajectory of the object. After step S3110A-5, the process may continue with step S3110B. In embodiments, referring toFIG.31F, in the case where the second elevation axis has exceeded the first threshold elevation angle, the process may continue from step S3110A-4with step S3110A-6instead. At step S3110A-6, in embodiments, the digital software system704may calculate a first tangent trajectory (e.g., referred to inFIG.29as adjusted gimbal trajectory290) associated with the respective angular direction of the first parabolic reflector based on the first angular direction trajectory. In embodiments, the first tangent trajectory may include a first azimuth trajectory and a first tangent trajectory. For example, referring toFIGS.28A and28B, in embodiments, when the centroid270exceeds the first maximum threshold angle, the angular direction of centroid270is calculated based on a tangential component of the angular direction. In embodiments, for example, when the centroid270exceeds threshold angle, the digital software system may calculate a nearest tangent, which may be a tangent line to the left of the angular trajectory (e.g., Tl), or a tangent line to the right of the angular trajectory (e.g., Tr). Continuing this example, in embodiments, the digital software system704may then generate the angular direction of the parabolic reflector114such that the angular direction follows the nearest tangent while the first beam maintains its direction toward the first object108-1even while it passes through the keyhole. InFIG.28A, as the centroid270exceeds the threshold elevation angle (e.g., 80 degrees in this example), the digital software system704determines that the nearest tangent is to the left (e.g., Tl) of the angular trajectory. InFIG.28B, which may occur during a next time period afterFIG.28A, the centroid270of the reflector114moves along the tangent line to avoid crossing the maximum elevation angle (e.g., 85 degrees in this example).FIG.29depicts another exemplary embodiment of the process for keyhole avoidance where the maximum elevation angle is 87 degrees. In embodiments, the threshold elevation angle and the maximum elevation angle may be any set of angles. In embodiments, the keyhole avoidance using fine loop pointing allows reflector114to rotate over a longer period of time and at a slower rate because digital software system704is able to continue tracking the first object108-1with the first beam even while the centroid270is not pointing directly at the object. In embodiments, referring toFIG.31F, the process may continue from step S3110A-6with step S3110A-7. In embodiments, at step S3110A-7, the digital software system704may generate the fourth angular direction information based on the first beam and the first tangent trajectory. In embodiments, this angular direction information may indicate that the centroid270will follow the tangent trajectory such that the maximum elevation angle is not exceeded, while maintaining the first beam in the direction of the first object108-1. In embodiments, the fourth angular direction information may be determined by the digital software system based on the following set of computer instructions: static constexpr double T = 5.0;static constexpr double R = 3.0;{ // Keyhole avoidanceif gimbal-elevation > 90.0 − keyhole-radius-tolerancexy-pos-vector p is {sin(gimbal-azimuth)*gimbal-elevation,cos(gimbal-azimuth)*gimbal-elevation);xy-rate-vector r is {sin(target-azimuth-rate)*target-elevation-rate,cos(target-azimuth-rate)*target-elevation-rate};if p intersects circle(keyhole-radius)pos-vector t[2] is tangents(circle(keyhole-radius), p)if angle(t[0], gimbal-xy) < angle(t[1], gimbal)gimbal-xy += (t[0] − gimbal_xy)*gimbal-motion-rateelsegimbal-xy += (t[1] − gimbal_x)*gimbal-motion-rate For example, in embodiments, the computer instructions may be used to first determine whether the centroid270has reached the threshold elevation angle (e.g., “if gimbal-elevation>90.0−keyhole-radius-tolerance). In embodiments, if the threshold has been exceeded, the computer instructions may then be used to determine the left and right tangents of the trajectory of the centroid270(e.g., if angle(t[0], gimbal-xy)<angle(t[1], gimbal)). In embodiments, the computer instructions may then be used to determine the nearest tangent trajectory (e.g., if ((t0[1]*t1[0]−t0[0]*t1[1])*(t0[1]*r[0]−t0[0]*r[1])<0.0)). In embodiments, the computer instructions may then be used to instruct the digital software system704to adjust the centroid270of the parabolic reflector114to the nearest tangent trajectory (e.g., gimbal-xy+=(t[0]−gimbal_xy)*gimbal-motion-rate). In embodiments, referring back toFIG.31E, the process may continue with step S3110B. At step S3110B, in embodiments, the digital software system704may generate a respective second weighting factor associated with the first beam as part of a second array of weighting factors associated with the first plurality of beams. In embodiments, the respective weighting factor may be determined based on the first angular direction trajectory, the fourth angular direction information, the first object movement information, the second azimuth axis, and the second elevation axis. In embodiments, the respective second weighting factor will be used by a respective digital beamformer306-n, along with the second array of weighting factors, to direct the first beam to the first object108-1. In the case where the centroid270is moved away from the direction of the first object108-1based on the tangent trajectory, in embodiments, the second weighting factor will be determined based on the first tangent trajectory such that the first beam will maintain its direction towards the first object108-1. For example, in embodiments, the respective second weighting factor along with the second array of weighting factors may be generated by the using the formulas discussed above with respect toFIGS.15A-15B,16A-16B. In embodiments, referring toFIG.31E, the process may continue with step3110C. At step S3110C, in embodiments, the digital software system704may transmit the fourth angular direction information to the first parabolic reflector114via the pedestal controller124. In embodiments, the fourth angular direction information may cause the first parabolic reflector114to rotate based on the information received via the pedestal controller124. In embodiments, referring toFIG.31E, the process may continue with step3110D. At step S3110D, in embodiments, the digital software system704may transmit the respective second weighting factor to the respective digital beamformer306-nvia the system controller412. In embodiments, the respective second weighting factor received along with the second array of weighting factors may cause an adjustment of the first beam such that the first beam maintains its direction toward the first object108-1. For example, in embodiments, the respective second weighting factor along with the second array of weighting factors may be transmitted to the plurality of digital beamformers306-nas discussed above with respect toFIG.22. Multiple Object Pointing In the case that there are two objects in the set of at least one object, referring toFIG.32Ain embodiments, the process may continue from step S3104C (ofFIG.31B) with step3204A. In embodiments, there may be additional objects in the set of at least one object. At step3204A, in embodiments, the second object108-2displayed by the graphical display340may be selected using the digital software system704. In embodiments, the second object108-2may be selected automatically by the digital software system704based on characteristics of the second object. In embodiments, the characteristics may include object velocity, mass, and/or acceleration, to name a few. In embodiments, the second object108-2may be selected manually by a user using one or more input elements operably connected to the digital software system704via the graphical display340. In embodiments, selection may be based on selection information provided by the user. In embodiments, the selection information may be provided using one or more input devices operatively connected to the digital software system. In embodiments, the input devices may include one or more of a keyboard, mouse, button, switch, and/or touchscreen, to name a few. In embodiments, referring toFIG.32A, in the case that there are two objects in the set of at least one object, the process may continue with step S3204B. At step S3204B, second priority information may be assigned to the second object108-2using the digital software system704. In embodiments, the second priority information may be assigned to the second object108-1automatically by the digital software system704based on characteristics of the second object. In embodiments, the characteristics may include object velocity, mass, and/or acceleration, to name a few. In embodiments, the first priority information may be assigned to the second object108-2manually by a user using one or more input elements operably connected to the digital software system704via the graphical display340. In embodiments, the second priority information may be a weight assigned to the second object108-2. For example, in embodiments, the first priority information may be a primary object weight and the second priority information may be a primary object weight. In embodiments, the first priority information may be a primary object weight and the second priority information may be a secondary object weight. In embodiments, the first priority information may be a primary object weight and the second priority information may be a ternary object weight. In embodiments, the first priority information may be a secondary object weight and the second priority information may be a primary object weight. In embodiments, the first priority information may be a secondary object weight and the second priority information may be a secondary object weight. In embodiments, the first priority information may be a secondary object weight and the second priority information may be a ternary object weight. In embodiments, the first priority information may be a ternary object weight and the second priority information may be a primary object weight. In embodiments, the first priority information may be a ternary object weight and the second priority information may be a secondary object weight. In embodiments, the first priority information may be a ternary object weight and the second priority information may be a ternary object weight. In embodiments, if a first object has a higher priority than a second object, the digital software system704will generate angular direction information such that the centroid270of the reflector114will be weighted toward the first object108-1. In embodiments, if two objects have the same priority level, the digital software system will treat them the same and the angular direction information generated and sent to the reflector114will cause the centroid270to point equidistant from each object. For example, in embodiments, if the first object108-1is assigned a primary object weight of 1, and the second object108-2is assigned a secondary object weight of 0.5, the centroid270will be weighted toward the first object108-1. However, in embodiments, if the first object108-1is assigned a primary object weight of 1, and the second object108-2is assigned a primary object weight of 1, the digital software system704will weigh the objects equally and direct the centroid270equidistant from the two objects.FIG.30Cis a schematic illustration of a graphical display340displaying 2 objects having equal weights. In embodiments, the graphical display340shows a list of the set of at least one object, and a list of options which allow the assignment of priority information (e.g., primary, secondary, and ternary). In embodiments, additional objects may be selected and assigned priority information using the digital software system704and simultaneously tracked. In embodiments, the number of objects that may be tracked simultaneously may equal the number of beams included in the first plurality of beams generated by the respective plurality of digital beamformers306-n. In embodiments, referring toFIG.32A, in the case that there are two objects in the set of at least one object, the process may continue from step S3204B with step S3204C. At step S3204C, the digital software system704may assign a second beam of the plurality of beams to the second object108-2. In embodiments, the second beam will be directed to the second object108-2in order to receive and/or transmit radio frequency signals to/from the object, as further described below. In embodiments, referring toFIG.33, the process of multiple object pointing may continue with step S3306. At step S3306, the digital software system704may provide respective direction information associated with the first beam, the second beam, and the first parabolic reflector114. In embodiments, step S3306may include a plurality of sub-steps. In embodiments, referring toFIG.33A, the process may continue with the sub-step S3306A. At step S3306A, the digital software system704may generate a respective first weighting factor associated with the first beam as part of a first array of weighting factors associated with the first plurality of beams. In embodiments, the respective first weighting factor may be generated based on the respective location information associated with the first object108-1, the first azimuth axis, and the first elevation axis. In embodiments, the respective first weighting factor will be used by a first respective digital beamformer306-1, along with the first array of weighting factors, to direct the first beam to the first object108-1. For example, in embodiments, the respective first weighting factor along with the first array of weighting factors may be generated by the using the formulas discussed above with respect toFIGS.15A-15B,16A-16B. In embodiments, referring toFIG.33A, the process may continue with the sub-step S3306B. At step S3306B, the digital software system704may generate a respective second weighting factor associated with the second beam as part of the first array of weighting factors associated with the first plurality of beams. In embodiments, the respective second weighting factor may be generated based on the respective location information associated with the second object108-2, the first azimuth axis, and the first elevation axis. In embodiments, the respective second weighting factor will be used by a second respective digital beamformer306-2, along with the first array of weighting factors, to direct the second beam to the second object108-2. For example, in embodiments, the respective second weighting factor along with the first array of weighting factors may be generated by the using the formulas discussed above with respect toFIGS.15A-15B,16A-16B. In embodiments, still referring toFIG.33A, the process may continue with sub-step S3306C. At step S3306C, the digital software system704may generate second angular direction information associated with the parabolic reflector114. In embodiments, the second angular direction information may include a second azimuth axis component and a second elevation axis component. In embodiments, the second angular direction information may be generated based on the first beam, the second beam, the respective location information associated with the first object108-1, the respective location information associated with the second object108-2, the first priority information, the second priority information, the first azimuth axis, and the first elevation axis. In embodiments, in the case where there are two objects being tracked, the second angular direction information will indicate that the centroid270of the parabolic reflector114will point in a weighted position between the first object108-1and the second108-1, based on the assigned first and second priority information. In embodiments, for example, if the first object108-1is assigned a higher priority than the second object, the centroid270will be weighted toward the first object108-1. In embodiments, if there are many objects being tracked, the centroid270will be weighted based on the priority information of each object108being tracked. In embodiments, still referring toFIG.33A, the process may continue with step S3306D. At step S3306D, the respective first weighting factor associated with first beam may be transmitted from the digital software system704to a first respective digital beamformer306-nof a plurality of digital beamformers via a system controller412. In embodiments, the first respective digital beamformer306-nmay be operatively connected to the plurality of antenna array elements304-nand the system controller412. In embodiments, the system controller412may provide the respective first weighting factor to the respective digital beamformer306-nso that the first respective digital beamformer306-nmay direct the first beam to the first object108-1. For example, in embodiments, the respective first weighting factor along with the first array of weighting factors may be transmitted to the plurality of digital beamformers306-nas discussed above with respect toFIG.22. In embodiments, still referring toFIG.33A, the process may continue with step S3306E. At step S3306E, the respective second weighting factor associated with second beam may be transmitted from the digital software system704to a second respective digital beamformer306-nof a plurality of digital beamformers via the system controller412. In embodiments, the second respective digital beamformer306-nmay be operatively connected to the plurality of antenna array elements304-nand the system controller412. In embodiments, the system controller412may provide the respective second weighting factor to the second respective digital beamformer306-nso that the second respective digital beamformer306-nmay direct the second beam to the second object108-2. For example, in embodiments, the respective second weighting factor along with the first array of weighting factors may be transmitted to the plurality of digital beamformers306-nas discussed above with respect toFIG.22. In embodiments, still referring toFIG.33A, the process may continue with step S3306F. At step S3306F, the digital software system704may transmit the second angular direction information via the pedestal controller124to the first parabolic reflector114. In embodiments, pedestal controller124may direct the movement and rotation of the parabolic reflector114based on the second angular direction information. For example, in embodiments, the second angular direction information may cause the pedestal controller124to rotate the parabolic reflector114up and down to change the elevation angle, and/or around the azimuth axis to change the azimuth angle. In embodiments, referring back toFIG.33, the method may continue with step S3308. At step S3308, the digital software system704may update the graphical display340during a second time period. In embodiments, for example, the first time period may be 5 milliseconds, and the second time period may be the next 5 milliseconds. Therefore, in embodiments for example, the graphical display340may be updated every 5 milliseconds. In embodiments, the second time period may be different from the first time period. In embodiments, the graphical display340may be updated to reflect movement of the set of at least one object108during the second time period. In embodiments, the process may instead begin with step S3308. For example, in embodiments, the process may begin where a graphical display340has already been generated by a digital software system740, and the first set of objects, including the first object108-1and the second object108-2, is already being tracked by the system such that a first beam is directed to the first object108-1and a second beam is directed to the second object108-2, prior to the start of the process. In embodiments, the process may begin with updating the graphical display340to reflect the movement of the first object108-1and the second object108-2during a next time period. In embodiments, step S3308may include a plurality of sub-steps. In embodiments, referring toFIG.33B, the process may continue with step S3308A. At step S3308A, the digital software system704may receive third angular direction information associated with the first parabolic reflector114via the pedestal controller124. In embodiments, the third angular direction information may include a third azimuth axis component and a third elevation axis component. In embodiments, the third angular direction information may be the same as the second angular direction transmitted to the parabolic reflector114in step S3306F. In embodiments, the third angular direction information may be different from the second angular direction transmitted to the parabolic reflector114in step S3306F. In embodiments, referring toFIG.33B, the process may continue with step S3308B. At step S3308B, the digital software system704may receive a third set of respective third digital data streams associated with the first plurality of partial beams. In embodiments, each respective partial beam of the first plurality of partial beams may be associated with a respective third digital data associated with a second plurality of respective modulated signals received by the plurality of antenna array elements304. In embodiments, second plurality of respective modulated signals are received by the plurality of antenna array elements, processed by the respective digital beamformer306-n, and received by the digital software system704during the second time period. In embodiments, still referring toFIG.33B, the process may continue with step S3308C. At step S3308C, the digital software system704may process the third set of respective third digital data streams associated with the first plurality of partial beams to generate a fourth set of a respective fourth digital data stream associated with the first plurality of beams. In embodiments, each beam of the first plurality of beams is based on at least two respective fourth digital data streams. In embodiments, still referring toFIG.33B, the process may continue with step S3308D. At step S3308D, the digital software system704may process the fourth set of respective fourth digital data streams associated with the first plurality of beams to generate first object movement information associated with the first object108-1, and second object movement information associated with the second object108-2. In embodiments, the first object movement information may include a first object angular velocity and a first object angular direction. In embodiments, the first object angular direction may include a first object elevation angle component and a first object azimuth angle component. In embodiments, the second object movement information may include a second object angular velocity and a second object angular direction. In embodiments, the second object angular direction may include a second object elevation angle component and a second object azimuth angle component. For example in embodiments, one beam of the first plurality of beams may be assigned to be a tracking beam, based on mission parameters received from the digital software system704via the system controller412, as discussed above with respect toFIGS.18-23. In embodiments, the tracking beam may be processed in order to determine the first object movement information and the second object movement information during the second time period. In embodiments, still referring toFIG.33B, the process may continue with step S3308E. At step S3308E, the digital software system704may update the graphical display340to display the first plurality of beams, the first set of objects108, including the first object108-1and the second object108-2, a second azimuth axis, and a second elevation axis. In embodiments, the first set of objects may be displayed based on at least the first object movement information and the second object movement information. In embodiments, the second azimuth axis may be displayed based on the third azimuth axis component. In embodiments, the second elevation axis may be displayed based on the third elevation axis component. In embodiments, the updated graphical display may reflect the changes in the movement of the first set of objects and the centroid270of the parabolic reflector114during the second time period. In embodiments, referring back toFIG.33, the process may continue with step S3310. At step S3310, the digital software system704may determine whether to unassign the first beam from the first object108-1, or the second beam from the second object108-2. In embodiments, referring toFIG.33C, step S3310may include a plurality of sub-steps. In embodiments, the process may continue with sub-step S3310A ofFIG.33C. At step S3310A, in embodiments, the digital software system704may determine whether one of the first object108-1or the second object108-2has exceeded a first maximum distance272from the second elevation axis and the second azimuth axis. In embodiments, the determination by the digital software system704as to whether one of the objects has exceeded the first maximum distance272may be based on the respective location information associated with the first object108-1, the respective location information associated with the second object108-2, the first object movement information, the second object movement information, the second azimuth axis, and the second elevation axis. For example, in embodiments, if the digital software system704determines that one of the objects will fall outside the range of the wide beam, the system must determine which object to abandon tracking.FIGS.27A and27Bare schematic illustrations of the process for multiple object tracking using fine loop pointing in accordance with embodiments of the present invention. InFIG.27A, in embodiments, a primary target108-1, a first secondary target108-2, and a second secondary target108-3are each within the maximum distance272of the centroid270of a parabolic reflector114. Therefore, in embodiments, the digital software system704weights each target based on its respective priority information and directs the centroid270accordingly in order to track each object using a plurality of beams. At some later time, inFIG.27Bin embodiments, the secondary objects have exceeded the maximum distance272from the centroid270and the secondary objects are abandoned in favor of the primary target108-1. In embodiments, the centroid270is adjusted to point directly toward the primary target108-1so that the respective beam may continue pointing toward the primary target108-1. In embodiments, in the case where neither the first object108-1nor the second object108-2has exceeded the first maximum distance272, the process may continue with step S3312ofFIG.33D(as described in greater detail below). In embodiments, in the case where one of the first object108-1and the second object108-2has exceeded the first maximum distance272, referring toFIG.33Cthe process may instead continue with sub-step S3310B. At step S3310B, in embodiments, the digital software system704may determine whether the first object108-1or the second object108-2has higher priority based on the first priority information and the second priority information. In embodiments, in the case where the first object108-1has a higher priority than the second object108-2based on the priority information, the process may continue from step S3310B with step S3310C. At step S3310C, in embodiments, the digital software system704may unassign the second beam from the second object108-2. In embodiments, the digital software system704may then provide respective updated direction information associated with the first beam and the first parabolic reflector114as described with respect to step S3314ofFIG.33F. In embodiments, in the case where the second object108-1has a higher priority than the first object108-1based on the priority information, the process may continue from step S3310B instead with step S3310D. At step S3310D, in embodiments, the digital software system704may unassign the first beam from the first object108-1. In embodiments, the digital software system704may then provide respective updated direction information associated with the second beam and the first parabolic reflector114as described with respect to step S3316ofFIG.33H. In embodiments, where either the first object108-1or the second object108-2has been unassigned, the process may then continue with the single object tracking process, as discussed with respect to the providing step S3110inFIG.31E. Therefore, in embodiments, after step S3310C inFIG.33C, the process may continue to step S3110inFIG.31Eusing only the first object108-1and the first beam. And, in embodiments, after step S3310D inFIG.33C, the process may continue to step S3110inFIG.31Eusing only the second object108-2and the second beam. In embodiments, the determination of whether to unassign one of the objects may be based on the following set of computer instructions: PntVect gimbal_centroid(0);Target *primary_target = nullptr;float weight sum = 0.0;// Sum the gimbal weights of all targets, and determinefirst primary targetfor (Target *target : target_) {weight_sum += target->getGimbalWeightht( );if (primary_target == nullptr && target->getGimbalWeight( ) >= Target::PRIMARY_TARGET)primary_target = target;}// If no targets have gimbal weights, do nothingif (weight_sum == 0.0)return;// Sum the product of the target pointing vector and itsweight gain to determine the weighted centroidfor (Target *target : targets_) {float magnitude = target->getPntVect( ).pos.mag( );float gain = magnitude > 0.0f ? 1.0f /(magnitude*weight_sum) : 0.0f;gimbal_centroid += target->getPntVect( )*target->getGimbalWeight( )*gain;}// If angle between the weighted centroid exceeds threshold,simply point at the first primary targetif (primary_target != nullptr && ang (primary_target->getPntVect( ) .pos, gimbal_centroid) >missionModel_.getPrimaryTargetMaxAngle( ) )gimbal_centroid = primary_target->getPntVect( ) .pos,gimbal centroid);// Point gimbal to this weighted centroidpointingModel_.setGimbalTargetedPntVect(gimbal_centroid); In embodiments, the computer instructions may be used to first determine the total of the priority information for each target (e.g., gimbal weights for all targets). In embodiments, if none of the targets are assigned priority information, then the system does nothing. In embodiments, the computer instructions may then be used to determine the angular direction information (e.g., the centroid270of the parabolic reflector114) based on the location information associated with the objects and the priority information. In embodiments, if one of the objects (including the primary target) exceeds the threshold, the angular direction is calculated in order move the centroid270toward the primary target. In embodiments, referring now toFIG.33D, in the case where neither the first object108-1nor the second object108-2has exceeded the first maximum distance272, the process may continue with step S3312. At step S3312, the digital software system704may provide respective updated direction information associated with the first beam, the second beam, and the first parabolic reflector114. In embodiments, step S3112may include a plurality of sub-steps. In embodiments, referring to sub-step3312A, the process may continue with step S3110A. At step S3110A, the digital software system704may generate fourth angular direction information associated with the first parabolic reflector114. In embodiments, the fourth angular direction information may include a fourth elevation axis component and a fourth azimuth axis component. In embodiments, in the case where there are two objects being tracked, the fourth angular direction information will indicate that the centroid270of the parabolic reflector114will be directed to a weighted point between the first object108-1and the second object108-2depending on the first and second priority information. In embodiments, the fourth angular direction information may be determined by performing a “keyhole” analysis (discussed with respect toFIGS.28A,28B and29above). The same analysis may be applied to avoiding the keyhole while tracking two or more objects. For example, in embodiments, the digital software system704may determine whether the centroid270will pass through the keyhole of the antenna's pointing authority based on the angular trajectory of the set of at least one object. In embodiments, referring toFIG.33E, the process for keyhole avoidance may begin with step S3312A-1. At step S3312A-1, in embodiments, the digital software system704may determine a first angular trajectory (e.g., referred to inFIGS.28A and28Bas gimbal trajectory280) associated with the respective angular direction of the first parabolic reflector114. In embodiments, the first angular trajectory may be determined based on the respective location information associated with the first object108-1, the respective location information associated with the second object108-2, the first priority information, the second priority information, the first object movement information, the second object movement information, the third angular direction information, the second azimuth axis, and the second elevation axis. For example, in embodiments, the angular trajectory may be based on a current location of each object, the priority information associated with each object, how each object has moved since the last update of the graphical display340, the direction that the parabolic reflector114was pointing during the second time period, and the location of the centroid270of parabolic reflector114during the second time period. In embodiments, referring toFIG.33E, the keyhole avoidance process may continue with step S3312A-2. In embodiments, the digital software system704may determine whether the first parabolic reflector114is projected to exceed a maximum elevation angle based on the first angular direction trajectory. In embodiments, the maximum elevation angle may be the angle where there the parabolic reflector114will mechanically or electronically fail such that the system will be unable to continue tracking an object. It is critical in antenna systems that the parabolic reflector does not exceed its maximum elevation angle. In embodiments, the maximum elevation angle may be, for example, 85 degrees. In embodiments, the maximum elevation angle may vary based on the specifications of the parabolic reflector114. In embodiments, referring toFIG.33E, in the case where the first parabolic reflector114is not projected to exceed the maximum elevation angle, the keyhole avoidance process may continue with step S3312A-3. At step S3110A-3, the digital software system704may generate the fourth angular direction information based on the first beam, the second beam, and the first angular direction trajectory. In embodiments, this step is completed if the angular direction trajectory indicates that the centroid270will not pass through the keyhole, and therefore the angular direction of the reflector114may be calculated by its standard process. After step S3312A-3, the process may continue with step S3312B. In embodiments, referring toFIG.33E, in the case where the first parabolic reflector114is projected to exceed the maximum elevation angle, the keyhole avoidance process may continue with step S3312A-4, instead of step S3312A-3. In embodiments, at step S3312A-4, the digital software system704may determine whether the second elevation axis has exceeded a first threshold elevation angle. In embodiments, the first threshold elevation angle may indicate a position of the reflector114where the centroid270of the reflector114is approaching the maximum elevation angle, and therefore the keyhole must be avoided by using alternative calculations for generating the angular direction to transmit to the reflector. For example, in embodiments, if the maximum elevation angle of the reflector114is 85 degrees, then the threshold elevation angle may be 80 degrees. In this example, this may indicate that, in embodiments, if the centroid270of the reflector114has passed 80 degrees of elevation, the digital software system704must make a keyhole avoidance determination. In embodiments, the threshold elevation angle may be set manually by a user of the graphical display340. In embodiments, the threshold elevation angle may be set automatically by the digital software system704based on received mission parameters or reflector specifications. In embodiments, referring toFIG.33E, in the case where the second elevation axis has not exceeded the first threshold elevation angle, the process may continue with step S3312A-5. At step S3312A-5, in embodiments, the digital software system704may generate the fourth angular direction information based on the first beam, the second beam, and the first angular direction trajectory. In embodiments, if the centroid270is projected to pass through the keyhole but the threshold elevation angle has not yet been exceeded, the fourth angular direction information will be calculated by the standard process based on the angular trajectory of the centroid270. After step S3312A-5, the process may continue with step S3312B. In embodiments, referring toFIG.33E, in the case where the second elevation axis has exceeded the first threshold elevation angle, the process may continue from step S3110A-4to step S3312A-6instead. At step S3312A-6, in embodiments, the digital software system704may calculate a first tangent trajectory (e.g., referred to inFIG.29as adjusted gimbal trajectory290) associated with the respective angular direction of the first parabolic reflector114based on the first angular direction trajectory. In embodiments, the first tangent trajectory may include a first azimuth trajectory and a first tangent trajectory. For example, referring toFIGS.28A and28B, in embodiments, when the centroid270exceeds the first maximum threshold angle, the angular direction of centroid270is calculated based on a tangential component of the angular direction. In embodiments, for example, when the centroid270exceeds threshold angle, the digital software system may calculate a nearest tangent, which may be a tangent line to the left of the angular trajectory (e.g., Tl), or a tangent line to the right of the angular trajectory (e.g., Tr). Continuing this example, in embodiments, the digital software system704may then generate the angular direction of the parabolic reflector114such that the angular direction follows the nearest tangent while the first beam maintains its direction toward the first object108-1, and the second beam maintains its direction toward the second object108-2, even while each object passes through the keyhole. As can be seen with reference toFIGS.28A and28B, for example, as the centroid270of the reflector114follows the tangent line, the elevation angle thereof stays at or below the maximum elevation angle. InFIG.28A, as the centroid270exceeds the threshold elevation angle (e.g., 80 degrees in this example), the digital software system704determines that the nearest tangent is to the left (e.g., Tl) of the angular trajectory. InFIG.28B, which may occur during a next time period afterFIG.28A, the centroid270of the reflector114moves along the tangent line to avoid crossing the maximum elevation angle (e.g., 85 degrees in this example) while continuing communication with the first object108-1and the second object108-2.FIG.29depicts another exemplary embodiment of the process for keyhole avoidance where the maximum elevation angle is 87 degrees. In embodiments, the threshold elevation angle and the maximum elevation angle may be any set of angles. In embodiments, the keyhole avoidance using fine loop pointing allows reflector114to rotate over a longer period of time and at a slower rate because digital software system704is able to continue tracking the first object108-1with the first beam and the second object108-2(or more objects) even while the centroid270is not pointing at its normal weighted position between each object. In embodiments, referring toFIG.33E, the process may continue from step S3312A-6with step S3312A-7. In embodiments, at step S3312A-7, the digital software system704may generate the fourth angular direction information based on the first beam, the second beam, and the first tangent trajectory. In embodiments, this angular direction information may indicate that the centroid270will follow the tangent trajectory such that the maximum elevation angle is not exceeded, while maintaining the first beam in the direction of the first object108-1, and the second beam in the direction of the second object108-2. In embodiments, referring back toFIG.33D, after performing a keyhole analysis the process may continue with step S3312B. At step S3312B, in embodiments, the digital software system704may generate a respective third weighting factor associated with the first beam as part of a second array of weighting factors associated with the first plurality of beams. In embodiments, the respective third weighting factor may be determined based on the first angular direction trajectory, the fourth angular direction information, the first object movement information, the second azimuth axis, and the second elevation axis. In embodiments, the respective third weighting factor will be used by the respective first digital beamformer306-n, along with the second array of weighting factors, to direct the first beam to the first object108-1. In the case where the centroid270is moved away from the direction of the first object108-1based on the tangent trajectory, in embodiments, the third weighting factor will be determined based on the first tangent trajectory such that the first beam will maintain its direction towards the first object108-1. For example, in embodiments, the respective third weighting factor along with the second array of weighting factors may be generated by the using the formulas discussed above with respect toFIGS.15A-15B,16A-16B. In embodiments, referring toFIG.33D, the process may continue with step S3312C. At step S3312C, in embodiments, the digital software system704may generate a respective fourth weighting factor associated with the second beam as part of the second array of weighting factors associated with the first plurality of beams. In embodiments, the respective weighting factor may be determined based on the first angular direction trajectory, the fourth angular direction information, the second object movement information, the second azimuth axis, and the second elevation axis. In embodiments, the respective fourth weighting factor will be used by the respective second digital beamformer306-n, along with the second array of weighting factors, to direct the second beam to the second object108-2. In the case where the centroid270is moved away from the direction of the second object108-2based on the tangent trajectory, in embodiments, the fourth weighting factor will be determined based on the first tangent trajectory such that the second beam will maintain its direction towards the second object108-2. For example, in embodiments, the respective fourth weighting factor along with the second array of weighting factors may be generated by the using the formulas discussed above with respect toFIGS.15A-15B,16A-16B. In embodiments, referring toFIG.33D, the process may continue with step3312D. At step S3110C, in embodiments, the digital software system704may transmit the fourth angular direction information to the first parabolic reflector114via the pedestal controller124. In embodiments, the fourth angular direction information may cause the first parabolic reflector114to rotate based on the information received via the pedestal controller124. In embodiments, referring toFIG.33D, the process may continue with step3312E. At step S3312E, in embodiments, the digital software system704may transmit the respective third weighting factor to the respective first digital beamformer306-nvia the system controller412. In embodiments, the respective third weighting factor received along with the second array of weighting factors may cause an adjustment of the first beam such that the first beam maintains its direction toward the first object108-1. For example, in embodiments, the respective third weighting factor along with the second array of weighting factors may be transmitted to the plurality of digital beamformers306-nas discussed above with respect toFIG.22. In embodiments, referring toFIG.33D, the process may continue with step3312F. At step S3312F, in embodiments, the digital software system704may transmit the respective fourth weighting factor to the respective second digital beamformer306-nvia the system controller412. In embodiments, the respective fourth weighting factor received along with the second array of weighting factors may cause an adjustment of the second beam such that the second beam maintains its direction toward the second object108-2. For example, in embodiments, the respective fourth weighting factor along with the second array of weighting factors may be transmitted to the plurality of digital beamformers306-nas discussed above with respect toFIG.22. Now that embodiments of the present invention have been shown and described in detail, various modifications and improvements thereon can become readily apparent to those skilled in the art. Accordingly, the exemplary embodiments of the present invention, as set forth above, are intended to be illustrative, not limiting. The spirit and scope of the present invention is to be construed broadly. | 244,917 |
11862872 | DETAILED DESCRIPTION The disclosed concepts relate generally to surface mountable wireless apparatus including antennas. More specifically, the disclosed concepts provide apparatus and methods for antenna optimization, and associated methods. The terms optimization, tuning, and fine-tuning are used interchangeably in this document to refer to optimizing antenna performance and/or characteristics for a given application or end-use. FIG.1shows a circuit arrangement for a conventional RF module5. The RF module5includes the RF circuit6, the matching circuit7, and the antenna8. The matching circuit7matches the impedance of the RF circuit6to the impedance of the antenna8. The operation of the circuit is well understood and well known to persons of ordinary skill in the art. The antenna8in the module5uses a ground plane as part of resonator and as the radiator. Virtually all antennas are more or less sensitive to size and shape of the ground plane and to capacitive loading, such as from the module's plastic enclosure, printed-circuit board (PCB) conformal coating, or protective potting compound. In normal case (when not using a module) the antenna is tuned particularly for the end product and this Is not a problem. However, when the module5is used, the matching circuit7and the antenna8are embedded (or included or encapsulated) into the module5, and the module integrator does not have any access to the components to change the characteristics of, and optimize, the antenna8. Because the various circuits and components are embedded into the module5, a user or integrator of the module5cannot tune the various characteristics of the circuitry/devices with in the module5because of the lack of physical access mentioned above. Thus, when using the module5with the integral antenna8, there is a trade-off between the convenience of an inclusive module (which includes the RF circuit, the matching circuit, and the antenna) with the performance of the circuit, in particular, the antenna. In exemplary embodiments, antennas may be tuned, fine-tuned or optimized by using one or more components external to a surface mountable module that includes the antenna. In the exemplary embodiments, the antenna constitutes an embedded (into a module) LC loop antenna. By using one or more tuning components (which are external to the module that includes the antenna), the center frequency of the antenna can be adjusted higher or lower, and thus compensate, correct, or minimize the effects of the end-product installation (including the module) or mechanical design (including the module) on the antenna's performance. In exemplary embodiments, the module may be an RF module, as desired. Generally, the module may be an enclosure that does not allow access (or does not allow easy access, say, without opening, disassembling, or removing part of the module) to the antenna components in order to tune the antenna. In exemplary embodiments, ground (GND) radiating loop antennas embedded in a module, which are difficult or impractical or impossible to optimize or tune as noted above, may be tuned by using one or more external tuning components. Generally, the external tuning component(s) is/are coupled in parallel with an antenna component, such as radiator loop component (e.g., a capacitor) or a feeding loop component (e.g., a capacitor). By virtue of using external tuning component(s), in exemplary embodiments the antenna may be tuned without access to the internal (to the module) antenna structures. In other words, without opening, disassembling, removing part of, or otherwise gaining physical access to the circuitry within the module, the antenna may be tuned by using one or more external tuning components. In order to couple the external tuning component(s) to the internal (to the module) antenna component(s), one or more pads (not shown in the figure) of the module may be used. More specifically, the module typically has a set of pads (usually beneath or at the perimeter of the module's physical enclosure). The pads may be used to provide a coupling to one or more internal antenna components. The pads may further be coupled to one or more external tuning components. The internal antenna component(s) is/are therefore coupled to the external tuning component(s). As a result, the antenna may be tuned or optimized without physical access to, or modifying or changing, the antenna components. The number, type, and values of the tuning components depend on factors such as antenna design and specifications (e.g., how may antenna components are used, and their types and values), available materials and components, cost, desired performance, implementation, end-use or target product or market, etc., as persons of ordinary skill in the art will understand. The type and/or values of the tuning components may be determined by using simulation, trial and error, etc., as persons of ordinary skill in the art will understand. FIG.2shows an apparatus200for antenna tuning according to an exemplary embodiment. The apparatus100includes a substrate105. The substrate105may have a variety of forms (e.g., multi-layered) and may be constructed of a variety of materials (e.g., PCB base, FR4, etc.), as persons of ordinary skill in the art will understand. Generally speaking, the substrate105has a non-conducting base (e.g., FR4), with one or more conductive layers formed on and/or below the non-conducting base. A surface mountable module110is affixed or mounted or physically attached to the substrate105. The module110may be an RF module. In that case, the module110may include RF circuitry (receiver, transmitter, or transceiver), impedance matching circuitry, etc., as persons of ordinary skill in the art will understand. As noted above, the module110has a set of pads that are used to electrically couple the module110to other circuitry. In some embodiments, the pads may be used to physically attach the module110to the substrate105(e.g., by using the pads to solder the module110to the substrate105). The substrate105has one or more conductive layers (e.g., copper). Traces may be formed in the conductive layer(s) to couple various circuits or blocks together. For example, traces may be used to couple the module110to other circuitry (not shown) coupled to the substrate105via traces. The module110includes an antenna. The antenna constitutes a ground radiating loop antenna, as noted above. The antenna is formed by using a loop and one or more antenna components150. The loop is coupled to the antenna component(s)150. In the example shown in the figure, two antenna components150are used. The loop is formed by removing (e.g., etching part of a copper layer of the substrate105) part of a conductive layer of the substrate105. The removed part leaves a void (or clearance area)120. In other words, the void120lacks any conductive material (because part of a conductive layer was removed to form the void120) and does not conduct current. As a result, a loop is formed around the void120. The loop is used together with the antenna component(s) to form a ground radiating loop antenna, as persons of ordinary skill in the art will understand. In the example shown in the figure, two tuning components160are used. The tuning components160are coupled to the two respective antenna components. The tuning components160are used to tune the antenna, as noted above. More specifically, the tuning component(s) are used to change the center frequency of the antenna, by either increasing or decreasing its value, in order to tune the antenna for a particular implementation, end-use, product, etc. In the example shown in the figure, the antenna uses two antenna components150. As persons of ordinary skill in the art will understand, however, different numbers of antenna components150may be used, depending on factors such as antenna design and specifications, available materials and components, cost, desired performance, implementation, end-use or target product or market, etc. Furthermore, in the exemplary embodiment shown, two antenna tuning components160are used. As persons of ordinary skill in the art will understand, however, different numbers of tuning components160may be used, depending on factors such as antenna design and specifications, available materials and components, cost, desired performance, implementation, end-use or target product or market, etc. As described below in detail, the tuning components may use a variety of electrical components. In exemplary embodiments, the antenna components150may constitute one or more capacitors, one or more inductors, and/or one or more chip antennas (including a mix of one or more capacitors, one or more inductors, and one or more chip antennas), as persons of ordinary skill in the art will understand. The number, type, values, and configuration or topology of capacitor(s), inductors, and/or chip antenna(s) depends on factors such as antenna design and specifications, available materials and components, cost, desired performance, implementation, end-use or target product or market, etc., as persons of ordinary skill in the art will understand. Furthermore, in exemplary embodiments, the tuning components160may constitute one or more capacitors and/or one or more inductors (including a mix of one of or more capacitors with one or more inductors). The number, type, values, and configuration or topology of capacitor(s) and/or inductor(s) depends on factors such as antenna design and specifications, available materials and components, cost, desired performance, implementation, end-use or target product or market, etc., as persons of ordinary skill in the art will understand. FIG.3shows a circuit arrangement for antenna optimization according to an exemplary embodiment. More specifically, the circuit arrangement shows an antenna that is “symmetrical” or has two branches. In other words, the RF feed is provided to two antenna halves, on the right-side branch and on the left-side branch, respectively, each of which includes one or more antenna components150. Each branch also has a tuning component160coupled in parallel with one or more of the antenna components150. Note that the exemplary embodiment inFIG.3shows one side or end or terminal of the tuning components160coupled to ground. Depending on the number of antenna components150on each branch of the antenna, the tuning components160may alternatively be coupled to one or more antenna components150that do not have one end or side or terminal coupled to ground (e.g., in parallel with a middle capacitor in a cascade of three series-coupled capacitors, i.e., the antenna components150including three series-coupled capacitors). FIG.4shows a circuit arrangement for antenna optimization according to an exemplary embodiment. More specifically, the circuit arrangement shows an antenna that is “asymmetrical” or has one branch. In other words, the RF feed is provided to one or more antenna components150without a mirror or symmetrical branch (as opposed to the “symmetrical case inFIG.3). Referring again toFIG.4, the circuit arrangement includes a tuning component160coupled in parallel with one or more of the antenna components150. Note that the exemplary embodiment inFIG.4shows one side or end or terminal of the tuning components160coupled to ground. Depending on the number of antenna components150, the tuning components160may alternatively be coupled to one or more antenna components150that do not have one end or side or terminal coupled to ground (e.g., in parallel with a middle capacitor in a cascade of three series-coupled capacitors, i.e., the antenna components150including three series-coupled capacitors). FIG.5shows a circuit arrangement for antenna optimization according to an exemplary embodiment. The circuit arrangement is a more specific or specialized case of the embodiment shown inFIG.3. More specifically, the antenna components150on each side or in each branch include three capacitors coupled in cascade or series. The tuning components160includes a single capacitor in this example, which is coupled to the middle capacitor of the antenna components150using pads170of the module110(in other words, pads170were included at the time of manufacture and/or assembly of the module110to facilitate later addition of the tuning components160). FIG.6shows a circuit arrangement for antenna optimization according to an exemplary embodiment. The circuit arrangement is a more specific or specialized case of the embodiment shown inFIG.4. More specifically, the antenna components150on the single antenna branch include three capacitors coupled in cascade or series. The tuning components160includes a single capacitor in this example, which is coupled to the middle capacitor of the antenna components150using pads170of the module110(in other words, pads170were included at the time of manufacture and/or assembly of the module110to facilitate later addition of the tuning components160). Note that the embodiments shown inFIGS.3-6constitute merely exemplary embodiments. As noted and as persons of ordinary skill in the art understand, a variety of structures may be used for ground radiating loop antennas. For example, “symmetrical” or “asymmetrical” configurations may be used, or the topology or configuration or the number of loops used may vary from design to design, as persons of ordinary skill in the art will understand. Regardless of the specific antenna structure used, external (to the module110) one or more tuning components may be used to tune the antenna, as desired. Depending on the number of tuning components used, appropriate or corresponding number of pads170of the module110may be used to couple the tuning components160to the antenna components150in order to tune the antenna after the manufacture or assembly of the module110. As noted above, in exemplary embodiments, the tuning components160may constitute one or more capacitors and/or one or more inductors (including a mix of one of or more capacitors with one or more inductors).FIGS.7-9show some examples. More specifically,FIG.7Ashows a tuning component160that includes a single capacitor C. Conversely,FIG.7Bshows a tuning component160that includes more than one capacitor, as indicated by the cascade coupling of a number of capacitors C (which may or may not have the same values, depending on the application). Note that taps may be used to access one or more of the internal nodes of the tuning component160and couple such node(s) to antenna structures150, as desired. FIG.8Ashows a tuning component160that includes a single inductor L. Conversely,FIG.8Bshows a tuning component160that includes more than one inductor, as indicated by the cascade coupling of a number of inductors L (which may or may not have the same values, depending on the application). Note that taps may be used to access one or more of the internal nodes of the tuning component160and couple such node(s) to antenna structures150, as desired. FIG.9shows a tuning component160that includes both inductors and capacitors. In the example shown more than one inductor and more than capacitor are used. Generally, in exemplary embodiments, one or more inductors and one or more capacitors may be used, as desired. Referring again toFIG.9, the tuning component160includes two inductors and four capacitors, all coupled in cascade. Note that the order of the components in the cascade as well as the type of components may be changed from the exemplary embodiment shown. The components (inductors and capacitors) may or may not have the same values, as desired. In the example shown inFIG.9, three capacitors are used in series fashion. Using a cascade of capacitors allows using larger-value capacitors, which would decrease the sensitivity of the overall capacitor cascade to tolerances of individual capacitors. Note that taps may be used to access one or more of the internal nodes of the tuning component160and couple such node(s) to antenna structures150, as desired. As noted above, the tuning components160may be used to tune a variety of configurations of ground radiating loop antennas.FIGS.10-17show examples of such antennas. Note that a variety of the number of antenna components150and the number and shape/configuration of loop(s) may be used in the antennas, as the examples inFIGS.10-17illustrate. Regardless of the exact configuration of the ground radiating loop antennas, tuning components160may be used to tune such antennas.FIGS.18-21provide examples. More specifically,FIGS.18-21show tuning component(s)160added to the antennas shown inFIGS.10-13, respectively, to tune them. Referring toFIG.18, the antenna has a single antenna component150. Using traces200of the substrate105and the pads170of the module170, a tuning component160is coupled to the antenna component150in order to tune the antenna. Referring toFIG.19, the antenna has three antenna component150. Using traces200of the substrate105and the pads170of the module170, two tuning components160are coupled to the top-most antenna components150in order to tune the antenna. Similarly, referring toFIG.20, the antenna has three antenna component150. Using traces200of the substrate105and the pads170of the module170, two tuning components160are coupled to the top-most antenna components150in order to tune the antenna. Referring toFIG.21, the antenna has four antenna component150. Using traces200of the substrate105and the pads170of the module170, two tuning components160are coupled to the top-most antenna components150in order to tune the antenna. Note that the examples shown inFIGS.10-21are merely illustrative. Different antenna structures, which may have different numbers of antenna components150, and different numbers/configurations of tuning components160may be used in other embodiments, as desired, and as persons of ordinary skill in the art will understand. Referring to the figures, persons of ordinary skill in the art will note that the various blocks shown might depict mainly the conceptual functions and signal flow. The actual circuit implementation might or might not contain separately identifiable hardware for the various functional blocks and might or might not use the particular circuitry shown. For example, one may combine the functionality of various blocks into one circuit block, as desired. Furthermore, one may realize the functionality of a single block in several circuit blocks, as desired. The choice of circuit implementation depends on various factors, such as particular design and performance specifications for a given implementation. Other modifications and alternative embodiments in addition to the embodiments in the disclosure will be apparent to persons of ordinary skill in the art. Accordingly, the disclosure teaches those skilled in the art the manner of carrying out the disclosed concepts according to exemplary embodiments, and is to be construed as illustrative only. Where applicable, the figures might or might not be drawn to scale, as persons of ordinary skill in the art will understand. The particular forms and embodiments shown and described constitute merely exemplary embodiments. Persons skilled in the art may make various changes in the shape, size and arrangement of parts without departing from the scope of the disclosure. For example, persons skilled in the art may substitute equivalent elements for the elements illustrated and described. Moreover, persons skilled in the art may use certain features of the disclosed concepts independently of the use of other features, without departing from the scope of the disclosure. | 19,697 |
11862873 | DESCRIPTION OF EMBODIMENTS Background of the Present Disclosure The patch antenna disclosed in JP-A-2006-135672 is applied to a frequency band of 60 GHz in use. A single frequency in use such as 60 GHz is assumed in JP-A-2006-135672, and JP-A-2006-135672 does not disclose a configuration of an antenna device (a so-called dual band antenna device) that can handle a plurality of different communication frequency bands (for example, two communication frequency bands such as a 2 GHz band and a 5 GHz band). In a configuration of a dual band antenna device, for example, separation accuracy of radio signals is required so that radio signals of respective communication frequency bands that can be handled do not interfere with one another. Therefore, in the following embodiments, an example of an antenna device that can handle a plurality of communication frequency bands and can improve antenna characteristics in a desired direction will be described. Hereinafter, embodiments specifically disclosing an antenna device according to the present disclosure will be described in detail with reference to the drawings as appropriate. Unnecessarily detailed description may be omitted. For example, detailed description of a well-known matter or repeated description of substantially the same configuration may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding for those skilled in the art. It should be noted that the accompanying drawings and the following description are provided for a thorough understanding of the present disclosure by those skilled in the art, and are not intended to limit the subject matter recited in the claims. First Embodiment As an example of the antenna device according to the present disclosure, a patch antenna (in other words, a planar antenna or a microstrip antenna (MSA)) will be described as an example in the first embodiment. The patch antenna may be mounted on, for example, a seat monitor provided on a back surface side of a seat of an aircraft or the like. As will be described later, the patch antenna may be disposed on each of six surfaces of a hexahedral antenna for measuring an arrival direction of radio waves in a space (seeFIG.5). In this manner, a product on which the patch antenna is mounted or to which the patch antenna is applied is not particularly limited. FIG.1is a cross-sectional view showing a stacked structure of a patch antenna5according to the first embodiment as viewed in an I-I direction.FIG.1shows a cross section viewed from a direction of arrows I-I inFIG.2. The patch antenna5according to the first embodiment is an example of an antenna device that handles a plurality of communication frequency bands (for example, a dual band corresponding to communication of two different frequency bands), and that transmits (radiates), for example, a radio signal (in other words, radio waves) of a 2.45 GHz band represented by Wi-Fi (registered trademark) and transmits (radiates) a radio signal (in other words, radio waves) of a 5.3 GHz band represented by Wi-Fi (registered trademark). As shown inFIG.1, the patch antenna5includes a substrate8having a three-layer structure in which a ground face10is stacked on a lowermost layer, a power supply face20is stacked on an intermediate layer, and an antenna face40is stacked on an uppermost layer. The substrate8is a dielectric substrate formed of, for example, a dielectric having a high relative dielectric constant, such as Polyphenyleneoxide (PPO), and the substrate8has a multilayer structure in which a first substrate8aand a second substrate8bare stacked. The ground face10is provided on a lower surface (back surface) side of the first substrate8a, and has a larger area than the antenna face40and the power supply face20. The antenna face40is provided on an upper surface (front surface) side of the second substrate8b. The power supply face20is provided between the upper surface (front surface) side of the first substrate8aand the lower surface (back surface) side of the second substrate8band faces the upper surface (front surface) side of the first substrate8aand the lower surface (back surface) side of the second substrate8b. Therefore, the patch antenna5according to the first embodiment supplies power to the antenna face40by bottom surface excitation from the power supply face20when the patch antenna5radiates radio waves. For example, a thickness of the entire substrate8is 3 mm, a thickness of the first substrate8ais 2.9 mm, and a thickness of the second substrate8bis 0.1 mm. The present invention is not limited thereto. A wireless communication circuit (not shown) that supplies a radio signal for supplying power to the patch antenna5is provided on a lower surface side of the substrate8(that is, a back surface of the ground face10). A via conductor54is provided in a through hole86that passes through the substrate8from the antenna face40disposed on the upper surface (front surface) of the substrate8to the ground face10disposed on the lower surface (back surface) side of the substrate8. The via conductor54is formed into a cylindrical shape by filling, for example, a conductive material in the through hole86. The via conductor54is a single conductor that electrically connects a contact41(that is, an upper end surface of the via conductor54) formed on the antenna face40(specifically, a patch45serving as an example of a first conductor), a power supply point21(that is, an intermediate cross section of the via conductor54) formed on the power supply face20(specifically, an end side of a stub conductor25serving as an example of a second conductor), and a contact11(that is, a lower end surface of the via conductor54) formed on the ground face10. The via conductor54is a power supply conductor for driving the antenna face40(specifically, the patch45described above or a slot SL1(to be described later)) as a patch antenna. The contact11is connected to a power supply terminal (not shown) of a wireless communication circuit (not shown) disposed on the lower surface (back surface) side of the substrate8. FIG.2is a plan view showing the antenna face40of the patch antenna5. The antenna face40is provided with the patch45serving as an example of a rectangular first conductor corresponding to communication in a first frequency band (for example, 2.4 GHz band). The patch45is formed of, for example, a rectangular copper foil. A circular opening44is formed at one position on a surface of the patch45, and the contact41(that is, a tip end surface of the via conductor54) is exposed at the center of the opening44. In other words, the patch45and the contact point41are not electrically connected to each other and are not short-circuited. The patch45and the contact41may be electrically connected to each other (that is, short-circuited). The patch45has characteristics of a parallel resonance circuit, and radiates (transmits) radio waves (radio signals) of a 2.4 GHz band in accordance with an excitation signal supplied from a wireless communication circuit (not shown) to the power supply point21of the power supply face20. In other words, the patch antenna5radiates (transmits) radio waves (radio signals) of the first frequency band (for example, the 2.4 GHz band) by resonating in a portion other than the slot SL1(see below) of the patch45. As shown inFIG.2, the patch45has a length a (seeFIG.4C) in a long-side direction, which is designed on the assumption that the patch45is affected by a wavelength shortening rate effect based on a relative dielectric constant of the substrate8when the length of the patch45is ½ of a wavelength λ1(that is, λ1/2) corresponding to the first frequency band (for example, 2.45 GHz). That is, the length a is equal to or less than λ1/2. The patch45has a length b (seeFIG.4C) in a direction (short-side direction) orthogonal to the long-side direction, which is designed on the assumption that the patch45is affected by the wavelength shortening rate effect based on the relative dielectric constant of the substrate8when the length of the patch45is equal to or less than ¼ of the wavelength λ1(that is, λ1/4) corresponding to the first frequency band (for example, 2.45 GHz). That is, the length b is equal to or less than λ1/4. Here, the length a is, for example, 28 mm, and the length b is, for example, 14 mm. The wavelength λ1indicates a length of a wavelength having a resonance frequency in the first frequency band (for example, 2.45 GHz) of the patch antenna5, and the wavelength λ1is 122 mm when radio waves are transmitted in vacuum. That is, since a resonance due to a signal in the first frequency band (for example, 2.45 GHz) is generated at a portion of the patch45(that is, an electric field is concentrated), the length a in the lateral direction is designed in consideration of the fact that λ1/2 is reduced from 61 (=122/2) mm to 28 mm due to a great influence of the relative dielectric constant of the substrate8serving as a transmission medium (that is, the wavelength shortening rate effect). Similarly, the length b in the vertical direction is designed in consideration of the fact that λ1/4 is reduced from 30.5 mm to 14 mm due to an influence of the relative dielectric constant of the substrate8serving as a transmission medium (that is, the wavelength shortening rate effect). As described above, the patch45of the patch antenna5is formed into a rectangular shape having (length in the long-side direction, length in the short-side direction)=(a, b) [mm: millimeter] (a>b), so that the long-side direction of the patch45is parallel to the long-side direction of the patch antenna5when the patch antenna5is mounted on a communication terminal such as a seat monitor or a hexahedral antenna (see the above description). Accordingly, when the wavelength λ1of the first frequency band (for example, 2.45 GHz) is set in accordance with the length of the patch antenna5in the long-side direction, horizontally polarized radio waves are radiated more strongly in communication of the first frequency band (for example, 2.45 GHz) compared with vertically polarized radio waves. The patch45has the rectangular slot SL1corresponding to communication of a second frequency band (for example, 5.3 GHz) different from the first frequency band at a position (seeFIG.2) facing the other end side opposite to the power supply point21of the power supply face20. That is, the entire area of the patch45is not formed of a copper foil, and the slot SL1is formed by cutting out the copper foil in a region having a certain area. The slot SL1has a length c (seeFIG.4C) in a long-side direction (in other words, a direction parallel to the long-side direction of the patch45), which is designed on the assumption that the patch45is affected by the wavelength shortening rate effect based on the relative dielectric constant of the substrate8when the length c of the slot SL1is ½ of a wavelength λ2(that is, λ2/2) corresponding to the second frequency band (for example, 5.3 GHz). That is, the length c is equal to or less than λ2/2. The slot SL1has a length (for example, 1.5 mm) in a short-side direction (in other words, a direction parallel to the short-side direction of the patch45). Here, the length c is, for example, 23 mm. The wavelength λ2indicates a length of a wavelength having a resonance frequency in a second frequency band (for example, 5.3 GHz) of the patch antenna5, and the wavelength λ2is 56 mm when radio waves are transmitted in vacuum. That is, since a resonance due to a signal in the second frequency band (for example, 5.3 GHz) is generated at a portion of the slot SL1(that is, an electric field is concentrated), the length c in the lateral direction is designed in consideration of the fact that λ2/2 is reduced from 28 (=56/2) mm to 23 mm due to an influence of the relative dielectric constant of the substrate8serving as a transmission medium (that is, the wavelength shortening rate effect). Since the first frequency band (for example, 2.45 GHz) resonates at the portion of the patch45, the influence of the relative dielectric constant of the substrate8(that is, a wavelength shortening rate effect) is large, and since the second frequency band (for example, 5.3 GHz) resonates at the slot SL1, the influence of the relative dielectric constant of the substrate8(that is, a wavelength shortening rate effect) is few, and there is a difference in the wavelength shortening rate effects. The slot SL1is provided at a position away from the power supply point21by about a length of ¼ of the wavelength λ2(that is, λ2/4) corresponding to the second frequency band (for example, 5.3 GHz). The length corresponding to λ2/4 is designed on the assumption that the patch45is affected by the relative dielectric constant of the substrate8described above (that is, the wavelength shortening rate effect). Accordingly, compared with the communication in the first frequency band (for example, 2.45 GHz), resonance in a vertical direction (in other words, an upper-lower direction parallel to the short-side direction of the patch antenna5) is likely to occur, an electric field is strong at a position of the slot SL1, and vertically polarized radio waves are radiated more strongly in the communication of the second frequency band (for example, 5.3 GHz) compared with the horizontally polarized radio waves. FIG.3is a plan view showing the power supply face20of the patch antenna5. The power supply face20is provided with the stub conductor25serving as an example of a second conductor that can also be referred to as a power supply line. The stub conductor25has an impedance matching an impedance of the patch45suitable for the communication in the first frequency band (for example, 2.45 GHz), and has characteristics of a series resonant circuit connected in series with the patch45so as to match the impedance of the patch45. That is, the stub conductor25is electrically coupled in series with the patch45, so that a radiation reactance component of the patch antenna5can be brought close to zero. The stub conductor25is provided with a transmission line portion including the power supply point21provided at one end side of the stub conductor25and a plurality of folded portions starting from the power supply point21. The transmission line portion includes a line in which a plurality of transmission lines are connected in series. The entire length of the stub conductor25is, for example, 3λ1/4. The lengths (line lengths) of the plurality of transmission lines constituting the transmission line portion may not necessarily be the same. The plurality of transmission lines constituting the transmission line portion shown inFIG.3include two transmission lines each having a short line width and one transmission line having a large line width. Since the transmission line having a large line width is provided, it is possible to prevent an increase in the entire length of the stub conductor25compared with a case where the transmission line having a large line width is not provided. A ground conductor15is formed on the ground face10(seeFIG.1). The ground conductor15is formed of a copper foil material, and is formed into a rectangular shape over substantially the entire lower surface (back surface) side of the substrate8(particularly, the first substrate8a). A length of the entire circumference of the ground conductor15is set to be longer than a length of the entire circumference of the patch45by several wavelengths. When the entire circumference of the ground conductor15is long, the patch45is likely to resonate, and the length of the entire circumference of the patch45can also be set in accordance with the ground conductor15. Next, a process of configuring the patch antenna5(seeFIG.4C) according to the first embodiment will be described based on a comparative example (seeFIGS.4A and4B).FIG.4Ais a plan view showing an upper surface (front surface) of a substrate8z1on which a power supply point21z1is disposed near a central portion of the substrate8z1.FIG.4Bis a plan view showing an upper surface (front surface) of a substrate8z2on which a position of a power supply point21z2is changed from a central portion to a position near an end portion.FIG.4Cis a plan view showing an upper surface (front surface) of the first substrate8aon which the position of the power supply point21is changed from a central portion to a position near an end portion and the slot SL1is added at an opposite end portion side. Here, with reference toFIGS.4A to4C, simulation results of antenna characteristics (for example, radiation characteristics of horizontally polarized waves and vertically polarized waves) in a 2 GHz band and a 5 GHz band and study of the simulation results will be described with reference to configuration examples of the dual band patch antennas shown inFIGS.4A,4B, and4C. The first substrate8aand the stub conductor25shown inFIG.4Care provided in the patch antenna5according to the first embodiment. In order to make the comparison description easy to understand, the lengths a in the long-side direction and the lengths b in the short-side direction of the substrate8z1(seeFIG.4A), the substrate8z2(seeFIG.4B), and the first substrate8a(seeFIG.4C) are the same. On the substrate8z1inFIG.4A, the stub conductor25z1is disposed near the central portion of the upper surface (front surface) of the substrate8z1in the vertical direction (in other words, the short-side direction). The patch antenna including the substrate8z1resonates at the entire patch (not shown) having the length a in the long-side direction when radio waves of the 2 GHz band are radiated, and further resonates at two length b portions that are present in the long-side direction of the patch when radio waves of the 5 GHz band are radiated. Therefore, according to the configuration of the patch antenna shown inFIG.4A, with regard to radiation characteristics PTYz12and PTYz15of the 2 GHz band and the 5 GHz band, horizontally polarized waves Hz1are radiated more strongly than vertically polarized waves Vz1in the 2 GHz band, and horizontally polarized waves Hz2are radiated more strongly than vertically polarized waves Vz2in the 5 GHz band in the same manner as in the 2 GHz band. In the 5 GHz band, since a resonance occurs at each of the two length b portions, a node N1where an electric field is weak is generated in a desired direction (for example, a 0 degree direction which is a forward direction), and antenna characteristics of the horizontally polarized waves Hz2deteriorate. On the substrate8z2ofFIG.4B, the stub conductor25z2is disposed closer to an end portion (for example, a lower end portion) from a central portion in the vertical direction (in other words, the short-side direction) on the upper surface (front surface) of the substrate8z2. The patch antenna including the substrate8z2resonates at the entire patch (not shown) having the length a in the long-side direction in the same manner when the radio waves of the 2 GHz band are radiated, and further resonates at each of the two length b portions that are present in the long-side direction of the patch and a length b portion in the short-side direction of a new patch when the radio waves of the 5 GHz band are radiated. That is, compared with the configuration inFIG.4A, the resonance in the vertical direction is newly added in the 5 GHz band. Therefore, according to the configuration of the patch antenna shown inFIG.4B, with regard to the radiation characteristics PTYz22and PTYz25of the 2 GHz band and the 5 GHz band, horizontally polarized waves Hz3are radiated more strongly than vertically polarized waves Vz3in the 2 GHz band, and a resonance in the vertical direction is added in the 5 GHz band, so that characteristics of vertically polarized waves are improved and vertically polarized waves Vz4are radiated more strongly than horizontally polarized waves Hz4. However, in the 5 GHz band, a difference N2between the vertically polarized waves Vz4and the horizontally polarized waves Hz4in a desired direction (for example, a 0 degree direction which is a forward direction) is small, and separation accuracy between the horizontally polarized waves and the vertically polarized waves deteriorates. On the first substrate8ainFIG.4C, the stub conductor25is disposed closer to an end portion (for example, a lower end portion) from a central portion in the vertical direction (in other words, the short-side direction) on the upper surface (front surface) of the first substrate8a, and the slot SL1is disposed at a position of the patch45that faces a position (seeFIGS.2and3) away from the power supply point21by λ2/4. The patch antenna5including the power supply face20provided on the upper surface (front surface) of the first substrate8aresonates at a portion other than the slot SL1of the patch45that has the length a in the long-side direction in the same manner when the radio waves of the 2 GHz band are radiated, and further resonates at a length c portion in the long-side direction of the slot SL1when the radio waves of the 5 GHz band are radiated. That is, compared with the configuration inFIG.4B, the resonance in the slot SL1is dominant in the 5 GHz band. Therefore, according to the configuration of the patch antenna5shown inFIG.4C, with regard to radiation characteristics PTY2and PTYS of the 2 GHz band and the 5 GHz band, horizontally polarized waves H1are radiated more strongly than vertically polarized waves V1in the 2 GHz band, and a resonance in the slot SL1is added in the 5 GHz band, so that characteristics of vertically polarized waves are greatly improved and vertically polarized waves V2are radiated more strongly than horizontally polarized waves H2. Accordingly, in the 5 GHz band, a difference N3between the vertically polarized waves V2and the horizontally polarized waves H2is increased in a desired direction (for example, a 0 degree direction which is a forward direction), separation accuracy between the horizontally polarized waves and the vertically polarized waves is improved, and antenna characteristics are improved. Next, antenna characteristics in a case where a plurality of (for example, two) patch antennas5according to the first embodiment are arranged on a surface constituting a hexahedral antenna will be described with reference toFIGS.5to7.FIG.5is a plan view showing a surface CUB1of a hexahedral antenna in which a plurality of patch antennas are arranged apart from one another in different long-side directions of slots.FIG.6is a diagram showing an example of antenna characteristics in the 2 GHz band of the arrangement inFIG.5.FIG.7is a diagram showing an example of antenna characteristics in the 5 GHz band of the arrangement inFIG.5. A total of four patch antennas5are arranged on the surface CUB1of the hexahedral antenna shown inFIG.5. Specifically, a first patch antenna5A is disposed horizontally at an upper left side inFIG.5, and a second patch antenna5B is disposed vertically at a lower left side inFIG.5. A third patch antenna5C is disposed vertically at an upper right side inFIG.5, and a fourth patch antenna5D is disposed horizontally at a lower right side inFIG.5. The third patch antenna5C and the fourth patch antenna5D are provided for external output. In the first patch antenna5A and the second patch antenna5B, long-side directions of slots SL5A and SL5B are respectively parallel to long-side directions of the first patch antenna5A and the second patch antenna5B. The second patch antenna5B is disposed in a manner in which the first patch antenna5A is rotated clockwise by 90 degrees. In order to prevent signal interference as much as possible, the first patch antenna5A to the fourth patch antenna5D are disposed apart from one another, the first patch antenna5A and the fourth patch antenna5D are disposed in the same direction, and the second patch antenna5B and the third patch antenna5C are disposed in the same direction. Here, antenna characteristics (for example, radiation characteristics and peak gain characteristics) when a radio signal in the 2 GHz band is radiated will be described with reference toFIG.6by taking the first patch antenna5A and the second patch antenna5B as examples. According toFIG.6(that is, the 2 GHz band), when peak gain characteristics PG2Vu of vertically polarized waves of the first patch antenna5A and peak gain characteristics PG2Vd of vertically polarized waves of the second patch antenna5B are compared with each other, the peak gain of the second patch antenna5B is higher than the peak gain of the first patch antenna5A. Therefore, it can be seen that the second patch antenna5B radiates stronger vertically polarized waves than the first patch antenna5A. When radiation characteristics RP2Vu of the vertically polarized waves of the first patch antenna5A and radiation characteristic RP2Vd of the vertically polarized waves of the second patch antenna5B are compared with each other, the second patch antenna5B radiates stronger vertically polarized waves than the first patch antenna5A in a desired direction (for example, a 0 degree direction which is a forward direction). This is because the long-side direction of the patch of the first patch antenna5A is arranged horizontally (so-called horizontally long), and the long-side direction of the patch of the second patch antenna5B is arranged vertically (so-called vertically long). When peak gain characteristics PG2Hu of horizontally polarized waves of the first patch antenna5A and peak gain characteristics PG2Hd of horizontally polarized waves of the second patch antenna5B are compared with each other, the peak gain of the first patch antenna5A is higher than the peak gain of the second patch antenna5B. Therefore, it can be seen that the first patch antenna5A radiates stronger horizontally polarized waves than the second patch antenna5B. When radiation characteristics RP2Hu of the horizontally polarized waves of the first patch antenna5A and radiation characteristics RP2Hd of the horizontally polarized waves of the second patch antenna5B are compared with each other, the first patch antenna5A radiates stronger horizontally polarized waves than the second patch antenna5B in a desired direction (for example, the 0 degree direction which is the forward direction). This is because the long-side direction of the patch of the first patch antenna5A is arranged horizontally (so-called horizontally long), and the long-side direction of the patch of the second patch antenna5B is arranged vertically (so-called vertically long). According toFIG.7(that is, the 5 GHz band), when peak gain characteristics PG5Vu of the vertically polarized waves of the first patch antenna5A and peak gain characteristics PG5Vd of the vertically polarized waves of the second patch antenna5B are compared with each other, the peak gain of the first patch antenna5A is higher than the peak gain of the second patch antenna5B. Therefore, it can be seen that the first patch antenna5A radiates stronger vertically polarized waves than the second patch antenna5B. When radiation characteristics RP5Vu of the vertically polarized waves of the first patch antenna5A and radiation characteristics RP5Vd of the vertically polarized waves of the second patch antenna5B are compared with each other, the first patch antenna5A radiates stronger vertically polarized waves than the second patch antenna5B in a desired direction (for example, a 0 degree direction which is a forward direction). This is because the long-side direction of the slot of the first patch antenna5A is formed horizontally (so-called horizontally long), and the long-side direction of the slot of the second patch antenna5B is formed vertically (so-called vertically long). When peak gain characteristics PG5Hu of the horizontally polarized waves of the first patch antenna5A and peak gain characteristics PG5Hd of the horizontally polarized waves of the second patch antenna5B are compared with each other, the peak gain of the second patch antenna5B is higher than the peak gain of the first patch antenna5A. Therefore, it can be seen that the second patch antenna5B radiates stronger horizontally polarized waves than the first patch antenna5A. When radiation characteristics RP5Hu of the horizontally polarized waves of the first patch antenna5A and radiation characteristics RP5Hd of the horizontally polarized waves of the second patch antenna5B are compared with each other, the second patch antenna5B radiates stronger horizontally polarized waves than the first patch antenna5A in a desired direction (for example, the 0 degree direction which is the forward direction). This is because the long-side direction of the slot of the first patch antenna5A is formed horizontally (so-called horizontally long), and the long-side direction of the slot of the second patch antenna5B is formed vertically (so-called vertically long). As described above, the patch antenna5according to the first embodiment includes a rectangular first conductor (for example, the patch45) corresponding to communication (for example, wireless communication) of a first frequency band (for example, 2.45 GHz), the ground conductor15facing the first conductor (for example, the patch45), and a rectangular second conductor (for example, the stub conductor25) that is disposed between the first conductor (for example, the patch45) and the ground conductor15, faces the first conductor (for example, the patch45) and the ground conductor15, and has the power supply point21. The second conductor (for example, the stub conductor25) is provided in a manner of facing one end side in the upper-lower direction of the first conductor (for example, the patch45). The first conductor (for example, the patch45) is provided, at a position facing the other end side opposite to the second conductor (for example, the stub conductor25), with the rectangular slot SL1corresponding to communication of a second frequency band (for example, 5.3 GHz) that is different from the first frequency band. Accordingly, the patch antenna5resonates at the patch45in the wireless communication of the first frequency band (for example, 2.45 GHz), and resonates at the slot SL1in the wireless communication of the second frequency band (for example, 5.3 GHz), so that antenna characteristics (for example, one of the horizontally polarized waves and the vertically polarized waves has a higher gain than the other one for each frequency band) in a desired direction (for example, a forward direction where a user is present) corresponding to a plurality of communication frequency bands can be improved. For example, a communication terminal equipped with the patch antenna5may be used in a closed space such as an aircraft. However, since radio waves are likely to be reflected and the radio waves are likely to become pitch waves in a closed space, it is desirable that not only gain characteristics of the horizontally polarized waves but also gain characteristics of the vertically polarized waves are high. In particular, since there may be a user (for example, a passenger in an aircraft) in front of the communication terminal, one of the horizontally polarized waves and the vertically polarized waves can be radiated more strongly than the other one for each communication frequency by mounting the dual band patch antenna5, and it is expected to improve usability. The first frequency band (for example, 2.45 GHz) corresponding to the first conductor (for example, patch45) is lower than the second frequency band (for example, 5.3 GHz) corresponding to the slot SL1. Accordingly, in the patch antenna5, since the first conductor (for example, the patch45) can resonate at a portion having a large area, the horizontally polarized waves can be radiated more strongly than the vertically polarized waves, and further, since the slot SL1can resonate at a position away from the power supply point21by about λ2/4 in the vertical direction (the short-side direction of the patch45), the vertically polarized waves can be radiated more strongly than the horizontally polarized waves. Therefore, the patch antenna5can improve separation accuracy between the horizontally polarized waves and the vertically polarized waves in both 2 GHz and 5 GHz (that is, in dual bands), and can improve antenna characteristics. The slot SL1has a length equal to or less than ½ of the wavelength λ2corresponding to the second frequency band (for example, 5.3 GHz) in a direction parallel to the long-side direction of the first conductor (for example, the patch45). The first conductor (for example, the patch45) has a length equal to or less than ½ of the wavelength λ1corresponding to the first frequency band (for example, 2.45 GHz) in a direction parallel to the long-side direction of the first conductor (for example, the patch45). Accordingly, a resonance in the vertical direction (in other words, the upper-lower direction parallel to the short-side direction of the patch antenna5) is likely to occur, an electric field at the position of the slot SL1is strong, and the vertically polarized radio waves are radiated more strongly in the communication of the second frequency band (for example, 5.3 GHz) compared with the horizontally polarized radio waves. The slot SL1is disposed at a position on the first conductor (for example, the patch45) that faces a position away from the power supply point21by a distance of ¼ of the wavelength λ2corresponding to the second frequency band (for example, 5.3 GHz). Accordingly, the slot SL1is disposed in the patch45that faces a position away from the power supply point21by about λ2/4, so that an electric field is likely to be concentrated in the slot SL1, and antenna characteristics (for example, gain) in a desired direction (for example, a forward direction in which a user is present) are improved. The second conductor further includes the stub conductor25having an impedance matching an impedance of the first conductor (for example, the patch45). The first conductor (for example, the patch45) is electrically connected to the stub conductor25via the power supply point21disposed at one end side of the stub conductor25. Accordingly, the stub conductor25is electrically coupled in series with the patch45in the patch antenna5, so that a radiation reactance component of the patch antenna5can be brought close to zero, and a radio wave frequency band in which the patch antenna5can be operated can be widened. Modification of First Embodiment An example of a patch antenna for further reducing a size of the patch antenna5according to the first embodiment will be described as a modification of the first embodiment by referring toFIG.8.FIG.8is a diagram showing an example of antenna characteristics and the upper surface (front surface) of the first substrate8aof a patch antenna according to the modification of the first embodiment in a plan view. Also in the modification of the first embodiment, similarly, the first substrate8aand a first conductor (for example, a patch, not shown inFIG.8) provided on the first substrate8aare disposed in a manner of facing each other, and a ground face10A has a larger area portion than the first conductor (for example, the patch45) in the patch antenna. The first substrate8ainFIG.8has, for example, ½ of a volume of the first substrate8ainFIG.2, and a plurality of via conductors56are arranged in a line at a right side of the first substrate8a. That is, in the modification of the first embodiment, an arrangement of a slot SL1A and positions of a stub conductor25A and a power supply point21A are the same as those of the patch antenna5according to the first embodiment. Therefore, detailed description thereof will be omitted. The via conductor56is a conductor that electrically connects a patch (an example of a first conductor) formed on an antenna face of the patch antenna according to the modification of the first embodiment and a ground conductor provided on the ground face10A, and the plurality of via conductors56are provided at equal intervals in a manner of being arranged in a line (seeFIG.8). A plurality of through holes are formed in the first substrate8athrough which the via conductors56are inserted. Therefore, according to the configuration of the patch antenna according to the modification of the first embodiment shown inFIG.8C, the size of the patch antenna can be reduced compared with the patch antenna5according to the first embodiment, and with regard to radiation characteristics PTY2A and PTY5A of the 2 GHz band and the 5 GHz band, similar to the patch antenna5according to the first embodiment, horizontally polarized waves H1A are radiated more strongly than vertically polarized waves V1A in the 2 GHz band, and since a resonance at the slot SL1A is added in the 5 GHz, characteristics of vertically polarized waves are greatly improved and vertically polarized waves V2A are radiated more strongly than horizontally polarized waves H2A. Accordingly, in the 5 GHz band, a difference between the vertically polarized waves V2A and the horizontally polarized waves H2A is increased in a desired direction (for example, a 0 degree direction which is a forward direction), separation accuracy between the horizontally polarized waves and the vertically polarized waves is improved, and antenna characteristics are improved. Although various embodiments are described above with reference to the drawings, it is needless to say that the present disclosure is not limited to such examples. It will be apparent to those skilled in the art that various alterations, modifications, substitutions, additions, deletions, and equivalents can be conceived within the scope of the claims, and it should be understood that such changes also belong to the technical scope of the present disclosure. Components in the above-described embodiments may be combined optionally within a range not departing from the spirit of the invention. For example, an example of a use case in which the patch antenna5according to the first embodiment or the modification of the first embodiment is applied to an antenna of a transmission device that transmits radio waves has been described above, the patch antenna5may be applied to an antenna of a reception device that receives radio waves. The present disclosure is useful as an antenna device that can improve antenna characteristics in a desired direction corresponding to a plurality of communication frequency bands. | 38,623 |
11862874 | DETAILED DESCRIPTION The detailed explanation of the disclosure is described as following. The described preferred embodiments are presented for purposes of illustrations and description, and they are not intended to limit the scope of the disclosure. Terms used herein are only used to describe the specific embodiments, which are not used to limit the claims appended herewith. Unless limited otherwise, the term “a,” “an,” “one” or “the” of the single form may also represent the plural form. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. In the following description and claims, the term “couple” along with their derivatives, may be used. In particular embodiments, “couple” may be used to indicate that two or more elements are in direct physical or electrical contact with each other, or may also mean that two or more elements may not be in direct contact with each other. “Couple” may still be used to indicate that two or more elements cooperate or interact with each other. It will be understood that, although the terms “first,” “second,” “third” . . . etc., may be used herein to describe various elements and/or components, these elements and/or components, should not be limited by these terms. These terms are only used to distinguish elements and/or components. The document may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, within the descriptions of the figures, similar elements are provided similar names and reference numerals as those of the previous figure(s). Where a later figure utilizes the element in a different context or with different functionality, the element is provided with a different leading numeral representative of the figure number (e.g. 1xx forFIG.1Aand 3xx forFIG.3). The specific numerals assigned to the elements are provided solely to aid in the description and not meant to imply any structural or functional limitations. FIG.1Ais a schematic view of an antenna structure100in accordance with some implementations of the disclosure. The antenna structure100includes a substrate110, a main radiator element120, a parasitic radiator element130, high-impedance members131-134and a feeder140. The substrate110may be formed of one of more dielectric layers, and one of the dielectric layers may be interposed between the main radiator element120and the parasitic radiator element130, such that the main radiator element120and the parasitic radiator element130are physically spaced. The substrate110may be a multi-layered board structure formed of alternately stacked dielectric layers and metal layers for some implementations, in which the main radiator element120and the parasitic radiator element130may be in two of the metal layers, respectively. The dielectric layer(s) of the substrate110may be formed from FR4 material, glass, ceramic, epoxy resin or silicon. The main radiator element120and the parasitic radiator element130may be disposed in/on the substrate110, and/or may be in parallel and overlapped with each other in a normal direction of the substrate110(e.g. the z-axis direction shown inFIGS.1A and1B) for eliminating surface waves in the antenna structure100. In some implementations, as shown inFIG.1A, the main radiator element120and the parasitic radiator element130are rectangular patch radiators. Other shapes and/or types of the main radiator element120and the parasitic radiator element130may be adopted in other implementations. The main radiator element120and the parasitic radiator element130may be physically spaced by one or more of the dielectric layers in the substrate110. The high-impedance members131-134directly contact the parasitic radiator element130, and are configured to be electrically grounded. As shown inFIG.1A, the high-impedance members131-134respectively contact four edges of the parasitic radiator element130. The high-impedance members131-134may be coplanar with the parasitic radiator element130and in the same metal layer. Also, the parasitic radiator element130and the high-impedance members131-134may be formed from the same material and by the same process. The high-impedance members131-134may be high-impedance traces (e.g. straight high-impedance traces) each with an impedance value higher than that of the parasitic radiator element130; the longitudinal direction of the high-impedance members131-132may be parallel to the x-axis direction, and the longitudinal direction of the high-impedance members133-134may be parallel to the y-axis direction. Other shapes (e.g. meandered shapes or tapered shapes), patterns and/or locations of the high-impedance members131-134may be adopted in other implementations. For example, the high-impedance members131-134may extend respectively from four corners of the parasitic radiator element130in some other implementations. The feeder140is disposed in the substrate110for electrically or electromagnetically couple energy to the main radiator element120. The feeder140may be a via structure coupled to the main radiator element120and a feeding source. In addition, the feeder140may electrically couple to other electrical components in the same antenna structure100, such as an active electrical component (e.g. a switch), a passive electrical component (e.g. an inductor), and/or the like, or an electrical device external to the antenna structure100. In some implementations, as shown inFIG.1B, the feeder140directly contacts the main radiator element120for directly coupling energy to the main radiator element120. The feeder140may be changed to be a feeding probe for electromagnetically coupling energy to the main radiator element120. In some implementations, a metal plate with a slot may be interposed between the main radiator element120and the feeder140to form a slot antenna. In addition, various arrangements of high-impedance members for thermal dissipation may be made by referring to the above descriptions related to the antenna structure100as well asFIGS.1A-1B. For example,FIGS.2A-2Dare respective schematic side views of antenna structures200A-200D in accordance with some implementations of the disclosure. InFIG.2A, the antenna structure200A includes a substrate210, a main radiator element220, high-impedance members221-224, a parasitic radiator element230and a feeder240. In the antenna structure200A, the high-impedance members221-224are coplanar with and directly contact the main radiator element220instead of the parasitic radiator element230. The high-impedance members221-224are all grounded, and each of the high-impedance members221-224has an impedance value higher than that of the main radiator element220. The main radiator element220and the high-impedance members221-224may be formed from the same material and by the same process. InFIG.2B, the antenna structure200B includes a substrate210, a main radiator element220, high-impedance members221-224, a parasitic radiator element230, high-impedance members231-234and a feeder240. The high-impedance members221-224and231-234are all grounded. The high-impedance members221-224are coplanar with and directly contact the main radiator element220, and each of the high-impedance members221-224has an impedance value higher than that of the main radiator element220. Similarly, the high-impedance members231-234are coplanar with and directly contact the parasitic radiator element230, and each of the high-impedance members231-234has an impedance value higher than that of the parasitic radiator element230. The main radiator element220and the high-impedance members221-224may be formed from the same material and by the same process, and/or the parasitic radiator element230and the high-impedance members231-234may be formed from the same material and by the same process. InFIG.2C, the antenna structure200C includes a substrate210, a main radiator element220, high-impedance members221-222, a parasitic radiator element230, high-impedance members231-232and a feeder240. The high-impedance members221-222and231-232are all grounded. The high-impedance members221-222are coplanar with and contact the main radiator element220, and each of the high-impedance members221-222has an impedance value higher than that of the main radiator element220. Similarly, the high-impedance members231-232are coplanar with and contact the parasitic radiator element230, and each of the high-impedance members231-232has an impedance value higher than that of the parasitic radiator element230. The longitudinal direction of the high-impedance members221-222and231-232may be substantially the same. InFIG.2D, the antenna structure200D includes a substrate210, a main radiator element220, high-impedance members223-224, a parasitic radiator element230, high-impedance members231-232and a feeder240. The high-impedance members223-224and231-232are all grounded. The high-impedance members223-224are coplanar with and contact the main radiator element220, and each of the high-impedance members223-224has an impedance value higher than that of the main radiator element220. Similarly, the high-impedance members231-232are coplanar with and contact the parasitic radiator element230, and each of the high-impedance members231-232has an impedance value higher than that of the parasitic radiator element230. The longitudinal direction of the high-impedance members223-224may be substantially perpendicular to that of the high-impedance members231-232. FIG.3is a schematic cross-sectional view of an antenna-in-package (AiP)30in accordance with some implementations of the disclosure. The antenna-in-package30may be a packaged module including an antenna structure300and a chip360bonded to each other. The antenna structure300includes a substrate310, a main radiator element320, a parasitic radiator element330, high-impedance members331-334, feeders341-342and a grounding structure350. The substrate310is a multilayer structure formed of alternately stacked metal layers ML and dielectric layers DL. The metal layers ML may be formed form copper, aluminum, nickel and/or another metal, a mixture or a metal alloy thereof, an electrically conductive metallic compound, and/or another suitable material. Each metal layer ML may include one or more radiator elements, one or more conductive traces, one or more active electrical components (e.g. a switch), one or more passive electrical components (e.g. an inductor), and/or another component for electromagnetic radiation. The dielectric layers DL may be formed from FR4 material, glass, ceramic, epoxy resin, silicon, and/or another suitable material. Based on the material type of the dielectric layers DL, the substrate310may be formed by various processes, such as low-temperature cofired ceramic (LTCC), integrated passive device (IPD), multi-layered film, multi-layered PCB or another multi-layered process. In some implementations, as shown inFIG.3, the metal layers ML are alternately stacked with the dielectric layers DL in a normal direction (e.g. the z-axis direction shown inFIG.3) of the antenna structure300. The metal layers ML may be formed from the same material (e.g. copper) or different materials. Similarly, the dielectric layers DL may be formed from the same material (e.g. epoxy resin) or different materials. Another stacked structure with the metal layers ML and the dielectric layers DL may be made according to the antenna structure300shown inFIG.3. For example, two or more of the dielectric layers DL may be interposed between adjacent two of the metal layers ML. The number of the metal layers ML and the number of the dielectric layers DL may be determined based on design requirements for the antenna structure300. Also, the metal layers ML and the dielectric layers DL may include different patterns based on design requirements of the antenna structure. The main radiator element320and the parasitic radiator element330are located in different metal layers ML. The main radiator element320and the parasitic radiator element330may be patches which are arranged in parallel and overlapped with each other in the normal direction of the antenna structure300for eliminating surface waves. In some implementations, the main radiator element320and the parasitic radiator element330are rectangular patch radiators. Other shapes and/or types of the main radiator element320and the parasitic radiator element330may be adopted in other implementations. The high-impedance members331-334directly contact the parasitic radiator element330and the grounding structure350. Each of the high-impedance members331-334is directly coupled between the parasitic radiator element330and the grounding structure350. As shown inFIG.3, the high-impedance members331-334may be coplanar with the parasitic radiator element330, i.e., the parasitic radiator element330and the high-impedance members331-334may be located in the same metal layer ML. In addition, each of the high-impedance members331-334has an impedance value higher than that of the parasitic radiator element330. Similar to the high-impedance members131-134shown inFIGS.1A-1B, the high-impedance members331-334may respectively contact four edges of the parasitic radiator element330, and may extend respectively in different directions. The feeders341-342are directly coupled to the main radiator element320for feeding energy thereto, so as to radiate electromagnetic waves. Each of the feeders341-342may include a via and a trace for electrically coupling other electrical components in the same antenna structure300, such as an active electrical component (e.g. a switch), a passive electrical component (e.g. an inductor), a combination thereof, or an electrical device bonded to the antenna structure300. The main radiator element320, the parasitic radiator element330and the feeders341-342may be configured to form a dual-polarized radiator. In other words, the feeders341-342may be configured to generate a dual-polarized radiation pattern on the substrate310. The grounding structure350laterally surrounds the main radiator element320and the parasitic radiator element330and form a cavity backed aperture for suspending surface wave propagations between the dielectric layers DL and the metal layers ML. The grounding structure350may be a via wall structure which includes longitudinally overlapped strip frames respectively in the metal layers as well as grounding vias coupling the strip frames. Each grounding via of the grounding structure350may be a blind via, a buried via, a stacked via, a staggered via, a combination thereof, or any type of via applicable to the antenna structure300, and may be formed by laser drilling, electroplating, electroless plating, or another suitable technique. In some implementations, each grounding via of the grounding structure350vertically extends from the uppermost metal layer ML to the lowermost metal layer ML. The grounding structure350may have a frame shape in the planar view of the antenna structure300, such as a rectangular frame shape or any other frame shape. As shown inFIG.3, the antenna structure300may be bonded with the chip360through bumps. The chip360is located at the side opposite to the radiation side of the antenna structure300. In other words, the main radiator element320is vertically between the parasitic radiator element330and the chip360. The chip360may be an radio-frequency integrated chip (RFIC), an analog integrated chip (IC), a mixed-signal IC, an application specific IC (ASIC) or the like. The bumps may consist of ground bumps371for electrically coupling the grounding structure350of the antenna structure300and the ground pins (not shown) of the chip360and signal bumps372for electrically coupling the electrical components (such as the feeders341-342) in the antenna structure300and the signal pins (not shown) of the chip360. For the antenna-in-package30shown inFIG.3in which the antenna structure300is bonded with the chip360, heat can be dissipated over the two opposite planar sides of the antenna structure300(e.g. over the parasitic radiator element330and the chip360). The combination of the high-impedance members331-334, the parasitic radiator element330and the uppermost metal layer of the grounding structure350function as a filter (e.g. a low-pass filter) for allowing DC component signals to flow into the grounding structure350(such as the DC current paths shown inFIG.3) but blocking RF signals for helping dissipate heat without disturbing the performance of the antenna structure300at radio frequencies. The antenna structure300may be modified to an aperture-fed antenna structure in which the feeders341-342are substituted with feeding traces that may electromagnetically couple energy to the main radiator element320through two slots defined by a ground plane element of the substrate310for a wideband bandwidth as well as a high antenna gain. Moreover, the antenna structure300may include solder balls (not shown) for bonding to a printed circuit board or the like. FIG.4is a schematic diagram of an antenna array400in accordance with some implementations of the disclosure. InFIG.4, the antenna array400has four antenna cells400A-400D arranged in an array of two rows and two columns. Each of the antenna cells400A-400D may have a structure similar to the antenna structure100shown inFIGS.1A-1B, the antenna structure200A/200B/200C/200D shown inFIG.2A/2B/2C/2D, or the antenna structure300shown inFIG.3for better antenna isolation. The antenna array400may be a stacked structure of plural metal layers and plural dielectric layers. In particular, in some implementations, the metal layers are alternately stacked with the dielectric layers in the normal direction of the antenna array400. In such stacked structure, the antenna cells400A-400D may be concurrently formed, and the stacked metal layers and dielectric layers extend crossing the antenna cells400A-400D. That is, the dielectric layers and the metal layers of the antenna cells400A-400D may be mapped in a one-to-one manner. In other words, the first metal layer of the antenna cell400A may be mapped to the first metal layer of the antenna cell400B, the first dielectric layer of the antenna cell400A may be mapped to the first dielectric layer of the antenna cell400B, the second metal layer of the antenna cell400A may be mapped to the second metal layer of the antenna cell400B, and the like. Another shape, arrangement and/or number of antenna cells may be made for various applications. For example, the antenna array400may be modified to have more than two rows of antenna cells and/or more than two columns of antenna cells, and/or each of the antenna cells400A-400D may be in a rectangular or triangle shape or any other suitable shape. In some other examples, the antenna cells400A-400D may be individual antenna modules. In particular, the antenna cells400A-400D may be physically separated and each may have a structure similar to the antenna structure100shown inFIGS.1A-1B, the antenna structure200A/200B/200C/200D shown inFIG.2A/2B/2C/2D or the antenna-in-package30or the antenna structure300shown inFIG.3. The antenna cells400A-400D may be bonded to a printed circuit board410via solder balls (not shown) to form a packaged antenna array module. FIG.5Ashows the thermal performance of the antenna array400with high-impedance members and a heat sink installed at the back side and operating in a frequency band around 28 GHz, andFIG.5Bshows the thermal performance of a conventional antenna array with a heat sink installed at the back side but without the high-impedance members and operating in a frequency band around 28 GHz. As shown inFIGS.5A-5B, the highest temperature of the conventional antenna array is up to about 143° C., while the highest temperature of the antenna array400is up to about 107° C. Therefore, the high-impedance members adopted in the implementations of the disclosure helps dissipating heat during operation. In addition, the return loss and antenna gain performances for the implementations of the disclosure keep at approximately the same level, and the frequency shift due to the high-impedance members can be easily calibrated by slightly adjusting the electrical components in the antenna structure. FIG.6is a schematic block diagram of an apparatus1in accordance with some implementation of the disclosure. The apparatus1includes a processing circuit2and a radio-frequency (RF) module3. The processing circuit2may be configured to encode data bits to generate a coded baseband signal and decode the signal from the RF module3into data bits according to a protocol stack, such as Radio Resource Control (RRC), Media Access Control (MAC), Radio Link Control (RLC), Service Data Adaptation Protocol (SDAP), Packet Data Convergence Protocol (PDCP), physical layer (PHY) coding and decoding and/or the like. The processing circuit2may be a processor, a microprocessor, an application-specific integrated circuit (ASIC), a digital signal processor (DSP), a field programmable gate array (FPGA), and/or the like. The RF module3may have one or more antennas as well as a circuitry, such as an RFIC, a power amplifier (PA), a low-noise amplifier (LNA), and so on, for modulating the baseband signal outputted by the processing circuit2into an RF signal for radio transmissions through the RF module3, and/or for demodulating the RF signal received through the RF module3to a baseband signal. The antenna of RF module3is configured to perform RF signal transmissions and receptions through air. The RF module3may include a singular antenna with an antenna structure according to the implementations of the disclosure (such as the antenna structure100shown inFIGS.1A-1B, the antenna structure200A/200B/200C/200D shown inFIG.2A/2B/2C/2D, the antenna-in-package30or the antenna structure300shown inFIGS.3A-3B, or the antenna array400shown inFIG.4), plural antennas at least one with an antenna structure according to the implementations of the disclosure (such as the antenna structure100shown inFIGS.1A-1B, the antenna structure200A/200B/200C/200D shown inFIG.2A/2B/2C/2D, the antenna-in-package30or the antenna structure300shown inFIGS.3A-3B, and/or the antenna array400shown inFIG.4). Another antenna structure or antenna array may also or alternatively be arranged in the RF module3of the apparatus1. It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims. | 23,141 |
11862875 | DETAILED DESCRIPTION OF THE DRAWINGS FIG.1shows an exemplary body-centric wireless communication system, which may be referred to as a body-centric wireless network (BCWN), installed on a human body10. The system may comprise one or more node12that is located on the body surface, i.e. a wearable node, one or more node14implanted in the body10, and one or more node16located off the body10. The nodes12,14,16comprise a computing device, or other electronic device, and are enabled for wireless communication with each other, e.g. comprising one or more antenna and any one or more of a receiver, transmitter and transceiver as applicable. The nodes12,14,16may include a controller, e.g. a suitably programmed or configured microprocessor, microcontroller or other processor, for controlling the operation of the node and performing any processing that may be required. Typically, each node12,14,16includes a power source, e.g. a battery. The on-body and off-body nodes12,16are optionally equipped and configured to communication with an external communications network (not shown), for example comprising a local area network (LAN), wide area network (WAN), a telephone network and/or the internet. Each in-body node14typically comprises one or more sensor for monitoring an aspect of the body10, e.g. heart function or intestinal function. Each on-body node12may be configured to serve as a communications node for facilitating communication between the nodes12,14,16, e.g. each on-body node12may act as a repeater. Each on-body node12optionally has one or more sensor for monitoring an aspect of the body10, e.g. heart function, pulse or temperature. In such body-centric wireless communication systems, or body-centric wireless networks (BCWN), three main electromagnetic radiation propagation modes can be identified depending on the relative location of the wirelessly-enabled nodes of the system: 1. communication between nodes12that are on the body surface (known as on-body communication); 2. communication from the body-surface node(s)12to nearby off-body node(s)16(known as off-body communication); 3. communication from the body surface node(s)12and node(s)14implanted within the body10(known as in-body communication). To maintain an efficient communication link with an implanted device14whilst providing receiver placement flexibility, it is desirable that the body surface nodes12support multiple propagation modes, i.e. off-body, on-body and in-body communication. For example, when acting as a repeater, the surface node12may be required to receive wireless signals from one or more in-body node14, and to transmit the received signals (or derivatives thereof) to one or more other surface node12and/or one or more off-body node16. Accordingly, it is desirable that the body surface nodes12include an antenna20that supports multiple propagation modes. In preferred embodiments, the antenna20supports all three propagation modes and is therefore capable of communication with in-body, on-body and off-body devices. To be practical, the antenna20should be suitable (e.g. in terms of size and shape) for incorporation into a wearable device wherein, when worn, the antenna20is close to (usually no more than 5 mm from) the surface of the body10. In preferred embodiments, the antenna20is configured to operate in the Medical Body Area Network (MBAN) frequency band (2360-2400 MHz), although other frequency bands may alternatively be used. In any event, advantageously, the antenna20supports each of the three propagation modes in the same frequency band. It is preferred that the antenna20is fed by a single port21(which may for example comprise an SMA connector), advantageously with no physical switching (such as through the use of P/N diodes). Considerations for the respective propagation modes are as follows: A. In-Body Propagation Mode A co-polar linearly polarized surface antenna may produce the best performance when directly aligned with the antenna of an in-body node14. For in-body propagation, the antenna must have some radiation into the body and so unbalanced antennas with ground planes (e.g. microstrip patch antennas, Planar Inverted F Antennas (PIFAs) and monopole antennas) would not be suitable. A dipole or slot antenna, which have an omnidirectional radiation pattern, would be suitable. If a higher gain into the body was desired, then an inverted patch antenna (i.e. a patch antenna with its radiating patch facing in-body, and its ground plane facing off-body) would be suitable. As antenna misalignment can have a significant detrimental effect on the performance of the in-body link, it is desirable to have a circularly polarised (CP) in-body mode. This is suited to using an inverted patch antenna as the increased into-body gain mitigates the 3 dB CP to linearly polarization attenuation. It is also relatively easy to produce CP radiation with a microstrip patch antenna using techniques such as corner truncating, slotting, amongst others. When an on-body antenna is not aligned with the antenna of an implanted device, then an on-body antenna with radiation normal to the surface of the body is desirable. A monopole-like antenna would be a suitable radiator in this case. B. On-Body Propagation Mode On-body propagation occurs between two antennas mounted on the same human body10. The antennas may be in line-of-sight (LOS) with each other, or may be located on entirely different parts of the body10(e.g. one on the front and one on the back of the human torso). Penetration through the human body is not a viable propagation path due to significant path losses and so propagation via creeping surface wave around the body10is preferred. Antennas with maximum radiation tangential to the body surface tend to provide good coupling between two body surface mounted devices. Antennas such as monopoles or printed antennas that produce monopolar radiation patterns are suited to producing radiation in the tangential direction. As this is the same radiation characteristic required for communication with a misaligned implanted antenna, a surface position flexible in-body antenna can serve as a dual-mode on-into antenna. B. Off-Body Propagation Mode For the off-body mode, maximum gain normal to the body's surface is desired. Accordingly microstrip patch antennas operating in their fundamental resonant mode are suitable for this mode due to their low profile nature and relatively high gain in the off-body direction. Antennas with omnidirectional radiation patterns are also suitable (such as dipole and slot antennas placed parallel to the surface of the human body). A preferred embodiment of the antenna20is now described with reference toFIGS.2to4. The antenna20comprises a first, or top, radiating structure22and a second, or bottom, radiating structure24. The radiating structures22,24are spaced apart from each other in a top-to-bottom direction (which may alternatively be referred to as a first direction or an axial direction) of the antenna, and are preferably substantially parallel with each other. In preferred embodiments the radiating structures22,24are aligned, or substantially aligned, with each other in the top-to-bottom direction, but in any event preferably at least partially overlap with each other in the top-to-bottom direction. Each radiating structure22,24may be formed from any electrically conductive material suitable for antenna radiating structures, typically metal, e.g. copper. When the antenna20is located on (or adjacent) the surface of the body10, the top radiating structure22is intended to face away from the body10, while the bottom radiating structure24faces towards the body10. In preferred embodiments, the top radiating structure22comprises a patch radiating element. The top patch22may be rectangular in shape, or may take other shapes, e.g. circular or elliptical. The patch22may have straight edges (as shown inFIGS.2,2D,3and6) or may have non-straight edges, for example meandered or fractal edges (as shown inFIG.6). Conveniently, the radiating structure22is provided on a substrate26of electrically insulating material, preferably a dielectric material. Typically, the radiating structure22is provided as a conductive, e.g. metallic, portion on a surface, preferably a top surface, of the substrate26. Optionally, one or more slots (not shown) may be formed in the top radiating structure22, for example to enhance frequency selection or minimise size. In preferred embodiments, the bottom radiating structure24comprises a patch radiating element. The bottom patch24may be rectangular in shape, or may take other shapes, e.g. circular or elliptical. The bottom patch24may have straight edges (as shown inFIGS.2,2A,3and6) or may have non-straight edges, for example meandered or fractal edges (as shown inFIG.6). Conveniently, the bottom radiating structure24is provided on a substrate28of electrically insulating material, preferably a dielectric material. Typically, the bottom radiating structure24is provided as a conductive, e.g. metallic, portion on a surface, preferably a bottom surface, of the substrate28. A ground plane30is located between the top and bottom radiating structures22,24. The ground plane30is preferably substantially parallel with the top and bottom feed structures22,24. The ground plane30is spaced apart from each radiating structure22,24in the top-to-bottom direction. In preferred embodiments, the ground plane30is located between the top and bottom radiating structures22,24in the top-to-bottom direction, i.e. sandwiched between the structures22,24. As such the feed line42and the radiating structures22,24at least partially overlap in the top to bottom direction. The ground plane may be formed from any electrically conductive material suitable for forming antenna ground planes, typically metal, e.g. copper. The ground plane30may be connected to electrical ground in any convenient manner. The ground plane30serves as a ground plane to both the top and bottom radiating structures22,24. When the antenna20is located on (or adjacent) the surface of the body10, the ground plane30does not inhibit propagation of radiation into the body10from the bottom radiating structure24(because the bottom radiating structure24is located between the body10and the ground plane30), and does not inhibit off-body or on-body propagation of radiation from the top radiating structure22(because the ground plane30is located below the top radiating structure22). Conveniently, the ground plane30is provided on a substrate32of electrically insulating material, preferably a dielectric material. Typically, the ground plane30is provided as a conductive, e.g. metallic, layer on a surface, preferably a bottom surface, of the substrate32. The antenna20comprises a feed structure40located between the top and bottom radiating structures22,24. The feed structure40is coupled to the port21. In a transmitting mode of the antenna20, the feed structure40receives excitation signals from circuitry such as a transceiver (not shown inFIGS.2to4) via the port21, and feeds the excitation signals to the top and bottom radiating structures22,24for transmission thereby. In a receiving mode of the antenna20, the feed structure40feeds received signals from the top and bottom radiating structures22,24to the external circuitry via port21. The feed structure40comprises a feed line42, typically in the form of a microstrip feed line. The feed line42may be formed from any electrically conductive material, typically metal, e.g. copper. The feed line42extends between, and preferably substantially parallel with, the top and bottom radiating structures22,24. In particular, the feed line42is located between the top and bottom radiating structures22,24in the top-to-bottom direction, i.e. sandwiched between the structures22,24. As such the feed line42and the radiating structures22,24at least partially overlap in the top to bottom direction. The feed line42is spaced apart from each radiating structure22,24in the top-to-bottom direction. The feed line42is spaced apart from the ground plane30in the top-to-bottom direction. The feed line42has a first, or free, end46located between the top and bottom radiating structures22,24, and a second end44(which may be referred to as the feed end) coupled to the port21(in use). In particular, the end46of feed line42is located between the top and bottom radiating structures22,24in the top-to-bottom direction, i.e. sandwiched between the structures22,24. In preferred embodiments, the feed line42is located between the ground plane30and the top radiating structure22(in the top-to-bottom direction). Hence, the feed line advantageously faces off-body relative to the ground plane30to reduce body coupling losses. The feed structure40further includes at least one slot48, or through-aperture, formed in the ground plane30. In preferred embodiments, there is only one slot48, although additional slot(s) may be provided in other embodiments. In preferred embodiments, the, or each, slot48is located between the top and bottom radiating structures22,24in the top-to-bottom direction, i.e. sandwiched between the structures22,24. The slot48preferably overlaps with the feed line42in the top-to-bottom direction of the antenna20. In particular it is preferred that the slot48overlaps with the feed line42substantially at (i.e. at or adjacent) the second end46of the feed line42. The slot48is preferably symmetrical or substantially symmetrical with respect to the feed line42when viewed in the top-to-bottom direction of the antenna20. It is preferred that the centre of the slot48is aligned with the feed line42in the top-to-bottom direction of the antenna20. In particular, it is preferred that the centre of the slot48is aligned with the feed line42substantially at the first end46of the feed line42. The slot48typically has straight edges, but may have non-straight edges, for example meandered or fractal edges. In preferred embodiments, the slot48is substantially X-shaped or cross-shaped, having first and second crossing leg portions48A,48B. The leg portions48A,48B preferably cross each other perpendicularly, but may alternatively cross each other obliquely. The leg portions48A,48B are preferably of the same length, but may alternatively be of different lengths. The leg portions48A,48B are preferably of the same width, but may alternatively be of different widths. The leg portions48A,48B are preferably straight, but one or both may alternatively be curved. Preferably, the slot48is oriented such that neither of the legs48A,48B extends parallelly with the feed line42, i.e. each of the leg portions48A,48B extends obliquely with respect to the feed line42. In preferred embodiments, the cross-shaped slot48is aligned with the feed line42, preferably substantially at the first end46, in the top-to-bottom direction of the antenna20and is symmetrical or substantially symmetrical about the feed line42. In preferred embodiments, the substantially cross-shaped slot48is a single slot. In alternative embodiments, there may be more than one slot. For example two V-shaped slots may be arranged to form a substantially cross-shaped composite slot, or four substantially linear slots may be arranged to form a substantially cross-shaped slot. In preferred embodiments, the top radiating structure22is aligned with the slot48in the top-to-bottom direction of the antenna20, preferably such that the respective centres of the structure22and slot48are aligned with one another in the top-to-bottom direction. Preferably the bottom radiating structure24is aligned with the slot48in the top-to-bottom direction of the antenna20, preferably such that the respective centres of the structure24and slot48are aligned with one another in the top-to-bottom direction. Typically, the feed structure40is provided on a substrate of electrically insulating material, preferably a dielectric material. Typically, the feed line42is provided as a conductive, e.g. metallic, strip on a surface of the substrate. Conveniently, the feed line42is provided on the same substrate32as the ground plane30, on the opposite surface to the ground plane30(i.e. the feed line is formed in the top surface of substrate32in the illustrated embodiment). Hence, the feed line42and the slot(s)48are provided on opposite faces of the same substrate32. In preferred embodiments, the antenna20includes at least one, and typically a plurality of, electrically conductive connectors50connecting the top radiating structure22to the ground plane30. The connectors50create an electrical connection between the structure22and ground plane30. The connectors50short the top radiating structure22to the ground plane30and may be referred to as shorting posts. In preferred embodiments, the antenna20includes first and second shorting posts50, a respective one located on either side of the feed line42. The posts50are preferably located substantially at the first end46of the feed line42. The posts50are preferably symmetrical or substantially symmetrically arranged with respect to the feed line42. In preferred embodiments, a respective post50is located on either side of the slot48. Preferably, the posts50are aligned with the centre of the slot48in a transverse direction that is perpendicular to the direction in which the feed line42extends, and to the top-to-bottom direction of the antenna20. Preferably, the posts are equidistant from the slot48, in particular from the centre of the slot48. In preferred embodiments, two connectors50are provided, preferably in the manner illustrated, although in other embodiments a single connector50may be provided, or more than two connectors50. The, or each connector50does not have to be in the form of a post (or pin), and may for example take any other convenient form, e.g. an elongate strip or wall of conductive material, which may run parallel with the ground plane30. In some embodiments, in particular embodiments where the on-body propagation mode is not required, the connectors50can be omitted. The preferred antenna20comprises a multi-layer structure, with the top layer of the structure typically comprising the top radiating structure22, the bottom layer typically comprising the bottom radiating structure24, and the ground plane30and feed structure40being provided in intermediate layers between the top and bottom layers. Preferably the layers are supported by the substrates26,28,32, which are stacked such that the substrate26provides a top substrate layer, the substrate28provides a bottom substrate layer and the substrate32provides an intermediate substrate layer between the top and bottom substrate layers. In alternative embodiments (not illustrated) the respective components of the layers may be supported by any other suitable support structure(s), not necessarily substrates. In such embodiments, the respective components of the layers may be separated by a respective air gap rather than a layer of dielectric material. In preferred embodiments, the substrates26,28,32form a body of the antenna20, and are preferably uniform in size. The substrates26,28,32are preferably rectangular in shape, but may alternatively take other shapes. The port21and second end44of the feed line42may be located at an edge of the body formed by the substrates. More generally, the port21and second end44of the feed line42may be located at an edge boundary of the antenna20. In preferred embodiments, the posts50extend through apertures formed in the substrates26,32. FIG.7shows a table giving exemplary dimensions for the antenna20shown inFIG.2. These dimensions are suitable for providing the three propagation modes in the 2.38 GHz MBAN band. It will be understood that any one or more of the given dimensions may be altered to suit any given application and/or for any desired optimization purposes. Advantageously, the antenna20is capable of generating all three propagation modes from a single feed structure42at the same frequency. In preferred embodiments, the feed line42feeds the bottom patch24through the slot48to induce orthogonal modes in the bottom patch24, producing CP radiation into the body10. The feed line42also proximity feeds the top patch22to produce the off-body and on-body propagation modes. The top patch22generates a monopolar radiation pattern and so produces the desired on-body radiation mode with an electric (E) field orientated normal to the surface of the patch22(and therefore to the surface of the body10when the antenna is worn). Hence the feed structure42indirectly feeds both the top and bottom radiating structures22,24(via proximity electromagnetic coupling and the slot48respectively) simultaneously. The dual indirect feed structure allows the two separate radiating structures22,24to be optimized almost independently of each other, all while using the same ground plane30. In use, electromagnetic fields extend between the feed line42and the slotted ground plane30. The fields couple through the slot48with the bottom patch24, and with the top patch22by proximity electromagnetic coupling. The width and/or length of the feed line42may be selected to transform the impedance of the antenna20to that of the signal source (typically a transmitter or receiver RF front end—not shown). In typical applications the feed line42is configured to provide a 50 ohm impedance. However, the length and width of the feed line42can be optimised to suit different source impedances as required. In use, the non-metallized region(s) provided by the slot48radiate and couple with other layer(s), in particular the bottom patch22, while still allowing a ground plane to be provided. Advantageously, the slotted ground plane30provides multiple functions: the ground metallisation isolates the tissue loading effect of the body10(i.e. of the person or other mobile platform) from the propagation modes provided by the top radiating structure22; and the non-metalized slot48allows excitation of the bottom radiating structure24by the feed line42. The size, including the length and/or width, or the slot48or slot portions may be adjusted to control impedance and the amount of coupling to the bottom patch22, which in turn affects the extent of the into-body propagation mode. The shorting posts50connect the top radiating structure22to the ground plane30to facilitate production of the on-body propagation mode. The posts50create null regions in the electromagnetic fields between the feed structure42and the upper radiating structure22, which facilitates the on-body mode. The posts50may have any cross-section shape, e.g. circular or rectangular, and their size (width and/or length) may be adjusted to suit the application and/or the optimization of the antenna20. The radiation pattern of any radiating structure with “monopolar” radiation has a characteristic null normal to its ground plane, which in the case of the proximity-fed shorted patch22,122is in the off-body direction. To produce radiation in this direction, the size of the slot(s)48through which the bottom patch24,124is aperture-fed (or slot-fed) may be selected to produce parasitic (but in this case desired) radiation in the off-body direction. In use, the bottom radiating structure22provides the in-body propagation mode. For some applications, including BCWN applications, it is desirable to generate elliptically or circularly polarised in-body radiation. This may be achieved via the orientation of the bottom radiating structure22with respect to the feed line42and/or the slot48. For example, in preferred embodiments in which the bottom radiating patch24is rectangular, the patch24may be orientated such that the edges of the patch24are oblique with respect to the feed line42. Alternatively or in addition, the patch24may be orientated such that the edges of the patch24are parallel or perpendicular, as applicable, with the leg portions of the slot48. An oblique orientation of the radiating structure24supports elliptical or circular polarising currents in the structure24. In such embodiments, the bottom patch24may be oriented with respect to the top patch22such that their respective edges run obliquely with respect to one another. In preferred embodiments, the radiation emitted from the bottom radiating element24balances the amount of radiation emitted by the top radiating element22, i.e. the in-body propagation mode is balanced with the off- and on-body modes. More generally, circular polarisation is an optimisation between the slot48and the bottom radiating patch24. Achieving circular polarisation may involve adjusting the length of the slot arms and orientation of the patch24to cause current to circulate on the radiating element. Optionally, this can be achieved with variations in shape of the radiating patch24. Causing the antenna20to emit elliptically or circularly polarised radiation in the in-body mode means that the antenna20, when mounted on the body10, is significantly less sensitive to the orientation (field polarisation) of the implanted device14with which it communicates, and so makes the placement of the antenna20with respect to the implanted device14less critical for operation of the system. In alternative embodiments, elliptical or circular polarisation of the radiation of the in-body mode is not required. For example, linear polarization of radiation of the in-body mode may be achieved by aligning the bottom radiating structure24with the feed line42, e.g. such that the edges of the structure24are parallel or perpendicular, as applicable, with the feed line42in the case of a rectangular patch24. Parameters of the bottom radiating structure24(e.g. its shape and/or dimensions) can be optimised or otherwise varied to increase or reduce the magnitude of the field into the body10. FIG.5illustrates an alternative embodiment of the antenna, indicated as120, in which like numerals are used to denote like parts and in respect of which the same, or similar, description applies as provided in relation to the antenna20. The antenna120shows some of the variations described above. In particular, the top radiating patch122is circular and the bottom patch124is aligned with the feed line142. The antenna120produces linearly polarised in-body radiation. It will be apparent that antennas20,120embodying the invention are suitable for use in an on-body node12of a BCWN system, the antenna20,120, when worn, being oriented such that the bottom radiating structure24,124faces the body10, and the top radiating structure22,122faces away from the body10. As well as being able to communicate with on-body and off-body nodes12,16, the antennas20,120are capable of reliable communication with the antenna of an implanted device14in an unknown location and/or orientation, thus allowing flexibility in the placement of the body surface node12to maximize user comfort and/or reduce power consumption. In preferred embodiments, the antenna20,120comprises a single, physically compact wearable antenna structure. The single antenna structure may adapt to all the medical propagation requirements and the diverse physiological and morphological parameters of a human host. The preferred single antenna has the function of three antennas, meaning one wearable component as opposed to up to three, leading to less complexity and reduced physical size. The antenna20,120may be part of a repeater device. As such, any data obtained from an implant device14may be transmitted to another node12,16either on-body or off-body. The invention is not limited to the embodiment(s) described herein but can be amended or modified without departing from the scope of the present invention. | 27,730 |
11862876 | The same reference numerals are used to represent the same elements throughout the drawings. DETAILED DESCRIPTION The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness. The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents. It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces. FIG.1illustrates an electronic device in a network environment according to an embodiment of the disclosure. Referring toFIG.1, an electronic device101in a network environment100may communicate with an electronic device102via a first network198(e.g., a short-range wireless communication network), or an electronic device104or a server108via a second network199(e.g., a long-range wireless communication network). The electronic device101may communicate with the electronic device104via the server108. The electronic device101includes a processor120, memory130, an input device150, an audio output device155, a display device160, an audio module170, a sensor module176, an interface177, a haptic module179, a camera module180, a power management module188, a battery189, a communication module190, a subscriber identification module (SIM)196, or an antenna module197. In some embodiments, at least one (e.g., the display device160or the camera module180) of the components may be omitted from the electronic device101, or one or more other components may be added in the electronic device101. In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module176(e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device160(e.g., a display). The processor120may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware or software component) of the electronic device101coupled with the processor120, and may perform various data processing or computation. As at least part of the data processing or computation, the processor120may load a command or data received from another component (e.g., the sensor module176or the communication module190) in volatile memory132, process the command or the data stored in the volatile memory132, and store resulting data in non-volatile memory134. The processor120may include a main processor121(e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor123(e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor121. Additionally or alternatively, the auxiliary processor123may be adapted to consume less power than the main processor121, or to be specific to a specified function. The auxiliary processor123may be implemented as separate from, or as part of the main processor121. The auxiliary processor123may control at least some of functions or states related to at least one component (e.g., the display device160, the sensor module176, or the communication module190) among the components of the electronic device101, instead of the main processor121while the main processor121is in an inactive (e.g., sleep) state, or together with the main processor121while the main processor121is in an active state (e.g., executing an application). The auxiliary processor123(e.g., an ISP or a CP) may be implemented as part of another component (e.g., the camera module180or the communication module190) functionally related to the auxiliary processor123. The memory130may store various data used by at least one component (e.g., the processor120or the sensor module176) of the electronic device101. The various data may include, for example, software (e.g., the program140) and input data or output data for a command related thereto. The memory130may include the volatile memory132or the non-volatile memory134. The program140may be stored in the memory130as software, and may include, for example, an operating system (OS)142, middleware144, or an application146. The input device150may receive a command or data to be used by other component (e.g., the processor120) of the electronic device101, from the outside (e.g., a user) of the electronic device101. The input device150may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen). The audio output device155may output sound signals to the outside of the electronic device101. The audio output device155may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. The receiver may be implemented as separate from, or as part of the speaker. The display device160may visually provide information to the outside (e.g., a user) of the electronic device101. The display device160may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. The display device160may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch. The audio module170may convert a sound into an electrical signal and vice versa. The audio module170may obtain the sound via the input device150, or output the sound via the audio output device155or a headphone of an external electronic device (e.g., an electronic device102) directly (e.g., wiredly) or wirelessly coupled with the electronic device101. The sensor module176may detect an operational state (e.g., power or temperature) of the electronic device101or an environmental state (e.g., a state of a user) external to the electronic device101, and then generate an electrical signal or data value corresponding to the detected state. The sensor module176may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The interface177may support one or more specified protocols to be used for the electronic device101to be coupled with the external electronic device (e.g., the electronic device102) directly (e.g., wiredly) or wirelessly. The interface177may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface. A connection terminal178may include a connector via which the electronic device101may be physically connected with the external electronic device (e.g., the electronic device102). The connection terminal178may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector). The haptic module179may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. The haptic module179may include, for example, a motor, a piezoelectric element, or an electric stimulator. The camera module180may capture an image or moving images. The camera module180may include one or more lenses, image sensors, image signal processors, or flashes. The power management module188may manage power supplied to the electronic device101. The power management module188may be implemented as at least part of, for example, a power management integrated circuit (PMIC). The battery189may supply power to at least one component of the electronic device101. The battery189may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. The communication module190may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device101and the external electronic device (e.g., the electronic device102, the electronic device104, or the server108) and performing communication via the established communication channel. The communication module190may include one or more communication processors that are operable independently from the processor120(e.g., the AP) and supports a direct (e.g., wired) communication or a wireless communication. The communication module190may include a wireless communication module192(e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module194(e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network198(e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network199(e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module192may identify and authenticate the electronic device101in a communication network, such as the first network198or the second network199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the SIM196. The antenna module197may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device101. The antenna module197may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). The antenna module197may include a plurality of antennas. In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network198or the second network199, may be selected, for example, by the communication module190(e.g., the wireless communication module192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module190and the external electronic device via the selected at least one antenna. Another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module197. At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)). Commands or data may be transmitted or received between the electronic device101and the external electronic device104via the server108coupled with the second network199. Each of the electronic devices102and104may be a device of a same type as, or a different type, from the electronic device101. All or some of operations to be executed at the electronic device101may be executed at one or more of the external electronic devices102,104, or108. For example, if the electronic device101should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device101. The electronic device101may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example. An electronic device according to an embodiment may be one of various types of electronic devices. The electronic device may include a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. However, the electronic device is not limited to any of those described above. Various embodiments of the disclosure and the terms used herein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. A singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B, or C”, “at least one of A, B, and C”, and “at least one of A, B, or C” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd”, or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). If an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with”, “coupled to”, “connected with”, or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element. The term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic”, “logic block”, “part”, or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC). Various embodiments as set forth herein may be implemented as software (e.g., the program140) including one or more instructions that are stored in a storage medium (e.g., an internal memory136or an external memory138) that is readable by a machine (e.g., the electronic device101). For example, a processor (e.g., the processor120) of the machine (e.g., the electronic device101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium. A method according to an embodiment of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server. Each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. One or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. Operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added. FIG.2is a block diagram illustrating an electronic device in a network environment including a plurality of cellular networks according to an embodiment of the disclosure. Referring toFIG.2, the electronic device101may include a first communication processor212, second communication processor214, first RFIC222, second RFIC224, third RFIC226, fourth RFIC228, first radio frequency front end (RFFE)232, second RFFE234, first antenna module242, second antenna module244, and antenna248. The electronic device101may include a processor120and a memory130. A second network199may include a first cellular network292and a second cellular network294. According to another embodiment, the electronic device101may further include at least one of the components described with reference toFIG.1, and the second network199may further include at least one other network. According to one embodiment, the first communication processor212, second communication processor214, first RFIC222, second RFIC224, fourth RFIC228, first RFFE232, and second RFFE234may form at least part of the wireless communication module192. According to another embodiment, the fourth RFIC228may be omitted or included as part of the third RFIC226. The first communication processor212may establish a communication channel of a band to be used for wireless communication with the first cellular network292and support legacy network communication through the established communication channel According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor214may establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) of bands to be used for wireless communication with the second cellular network294, and support 5G network communication through the established communication channel According to various embodiments, the second cellular network294may be a 5G network defined in 3GPP. Additionally, according to an embodiment, the first communication processor212or the second communication processor214may establish a communication channel corresponding to another designated band (e.g., about 6 GHz or less) of bands to be used for wireless communication with the second cellular network294and support 5G network communication through the established communication channel According to one embodiment, the first communication processor212and the second communication processor214may be implemented in a single chip or a single package. According to various embodiments, the first communication processor212or the second communication processor214may be formed in a single chip or a single package with the processor120, the auxiliary processor123, or the communication module190. Upon transmission, the first RFIC222may convert a baseband signal generated by the first communication processor212to a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network292(e.g., legacy network). Upon reception, an RF signal may be obtained from the first cellular network292(e.g., legacy network) through an antenna (e.g., the first antenna module242) and be preprocessed through an RFFE (e.g., the first RFFE232). The first RFIC222may convert the preprocessed RF signal to a baseband signal so as to be processed by the first communication processor212. Upon transmission, the second RFIC224may convert a baseband signal generated by the first communication processor212or the second communication processor214to an RF signal (hereinafter, 5G Sub6 RF signal) of a Sub6 band (e.g., 6 GHz or less) to be used in the second cellular network294(e.g., 5G network). Upon reception, a 5G Sub6 RF signal may be obtained from the second cellular network294(e.g., 5G network) through an antenna (e.g., the second antenna module244) and be pretreated through an RFFE (e.g., the second RFFE234). The second RFIC224may convert the preprocessed 5G Sub6 RF signal to a baseband signal so as to be processed by a corresponding communication processor of the first communication processor212or the second communication processor214. The third RFIC226may convert a baseband signal generated by the second communication processor214to an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network294(e.g., 5G network). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network294(e.g., 5G network) through an antenna (e.g., the antenna248) and be preprocessed through the third RFFE236. The third RFIC226may convert the preprocessed 5G Above6 RF signal to a baseband signal so as to be processed by the second communication processor214. According to one embodiment, the third RFFE236may be formed as part of the third RFIC226. According to an embodiment, the electronic device101may include a fourth RFIC228separately from the third RFIC226or as at least part of the third RFIC226. In this case, the fourth RFIC228may convert a baseband signal generated by the second communication processor214to an RF signal (hereinafter, an intermediate frequency (IF) signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and transfer the IF signal to the third RFIC226. The third RFIC226may convert the IF signal to a 5G Above 6RF signal. Upon reception, the 5G Above 6RF signal may be received from the second cellular network294(e.g., a 5G network) through an antenna (e.g., the antenna248) and be converted to an IF signal by the third RFIC226. The fourth RFIC228may convert an IF signal to a baseband signal so as to be processed by the second communication processor214. According to one embodiment, the first RFIC222and the second RFIC224may be implemented into at least part of a single package or a single chip. According to one embodiment, the first RFFE232and the second RFFE234may be implemented into at least part of a single package or a single chip. According to one embodiment, at least one of the first antenna module242or the second antenna module244may be omitted or may be combined with another antenna module to process RF signals of a corresponding plurality of bands. According to one embodiment, the third RFIC226and the antenna248may be disposed at the same substrate to form a third antenna module246. For example, the wireless communication module192or the processor120may be disposed at a first substrate (e.g., main PCB). In this case, the third RFIC226is disposed in a partial area (e.g., lower surface) of the first substrate and a separate second substrate (e.g., sub PCB), and the antenna248is disposed in another partial area (e.g., upper surface) thereof; thus, the third antenna module246may be formed. By disposing the third RFIC226and the antenna248in the same substrate, a length of a transmission line therebetween can be reduced. This may reduce, for example, a loss (e.g., attenuation) of a signal of a high frequency band (e.g., about 6 GHz to about 60 GHz) to be used in 5G network communication by a transmission line. Therefore, the electronic device101may improve a quality or speed of communication with the second cellular network294(e.g., 5G network). According to one embodiment, the antenna248may be formed in an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC226may include a plurality of phase shifters238corresponding to a plurality of antenna elements, for example, as part of the third RFFE236. Upon transmission, each of the plurality of phase shifters238may convert a phase of a 5G Above6 RF signal to be transmitted to the outside (e.g., a base station of a 5G network) of the electronic device101through a corresponding antenna element. Upon reception, each of the plurality of phase shifters238may convert a phase of the 5G Above6 RF signal received from the outside to the same phase or substantially the same phase through a corresponding antenna element. This enables transmission or reception through beamforming between the electronic device101and the outside. The second cellular network294(e.g., 5G network) may operate (e.g., stand-alone (SA)) independently of the first cellular network292(e.g., legacy network) or may be operated (e.g., non-stand alone (NSA)) in connection with the first cellular network292. For example, the 5G network may have only an access network (e.g., 5G radio access network (RAN) or a next generation (NG) RAN and have no core network (e.g., next generation core (NGC)). In this case, after accessing to the access network of the 5G network, the electronic device101may access to an external network (e.g., Internet) under the control of a core network (e.g., an evolved packed core (EPC)) of the legacy network. Protocol information (e.g., LTE protocol information) for communication with a legacy network or protocol information (e.g., new radio (NR) protocol information) for communication with a 5G network may be stored in the memory130to be accessed by other components (e.g., the processor120, the first communication processor212, or the second communication processor214). FIG.3Aillustrates a perspective view showing a front surface of a mobile electronic device according to an embodiment of the disclosure. FIG.3Billustrates a perspective view showing a rear surface of the mobile electronic device shown inFIG.3Aaccording to an embodiment of the disclosure. Referring toFIGS.3A and3B, a mobile electronic device300may include a housing310that includes a first surface (or front surface)310A, a second surface (or rear surface)310B, and a lateral surface310C that surrounds a space between the first surface310A and the second surface310B. The housing310may refer to a structure that forms a part of the first surface310A, the second surface310B, and the lateral surface310C. The first surface310A may be formed of a front plate302(e.g., a glass plate or polymer plate coated with a variety of coating layers) at least a part of which is substantially transparent. The second surface310B may be formed of a rear plate311which is substantially opaque. The rear plate311may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The lateral surface310C may be formed of a lateral bezel structure (or “lateral member”)318which is combined with the front plate302and the rear plate311and includes a metal and/or polymer. The rear plate311and the lateral bezel structure318may be integrally formed and may be of the same material (e.g., a metallic material such as aluminum). The front plate302may include two first regions310D disposed at long edges thereof, respectively, and bent and extended seamlessly from the first surface310A toward the rear plate311. Similarly, the rear plate311may include two second regions310E disposed at long edges thereof, respectively, and bent and extended seamlessly from the second surface310B toward the front plate302. The front plate302(or the rear plate311) may include only one of the first regions310D (or of the second regions310E). The first regions310D or the second regions310E may be omitted in part. When viewed from a lateral side of the mobile electronic device300, the lateral bezel structure318may have a first thickness (or width) on a lateral side where the first region310D or the second region310E is not included, and may have a second thickness, being less than the first thickness, on another lateral side where the first region310D or the second region310E is included. The mobile electronic device300may include at least one of a display301, audio modules303,307and314, sensor modules304and319, camera modules305,312and313, a key input device317, a light emitting device, and connector holes308and309. The mobile electronic device300may omit at least one (e.g., the key input device317or the light emitting device) of the above components, or may further include other components. The display301may be exposed through a substantial portion of the front plate302, for example. At least a part of the display301may be exposed through the front plate302that forms the first surface310A and the first region310D of the lateral surface310C. Outlines (i.e., edges and corners) of the display301may have substantially the same form as those of the front plate302. The spacing between the outline of the display301and the outline of the front plate302may be substantially unchanged in order to enlarge the exposed area of the display301. A recess or opening may be formed in a portion of a display area of the display301to accommodate at least one of the audio module314, the sensor module304, the camera module305, and the light emitting device. At least one of the audio module314, the sensor module304, the camera module305, a fingerprint sensor (not shown), and the light emitting element may be disposed on the back of the display area of the display301. The display301may be combined with, or adjacent to, a touch sensing circuit, a pressure sensor capable of measuring the touch strength (pressure), and/or a digitizer for detecting a stylus pen. At least a part of the sensor modules304and319and/or at least a part of the key input device317may be disposed in the first region310D and/or the second region310E. The audio modules303,307and314may correspond to a microphone hole303and speaker holes307and314, respectively. The microphone hole303may contain a microphone disposed therein for acquiring external sounds and, in a case, contain a plurality of microphones to sense a sound direction. The speaker holes307and314may be classified into an external speaker hole307and a call receiver hole314. The microphone hole303and the speaker holes307and314may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be provided without the speaker holes307and314. The sensor modules304and319may generate electrical signals or data corresponding to an internal operating state of the mobile electronic device300or to an external environmental condition. The sensor modules304and319may include a first sensor module304(e.g., a proximity sensor) and/or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface310A of the housing310, and/or a third sensor module319(e.g., a heart rate monitor (HRM) sensor) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on the second surface310B of the housing310. The fingerprint sensor may be disposed on the second surface310B as well as the first surface310A (e.g., the display301) of the housing310. The electronic device300may further include at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The camera modules305,312and313may include a first camera device305disposed on the first surface310A of the electronic device300, and a second camera module312and/or a flash313disposed on the second surface310B. The camera module305or the camera module312may include one or more lenses, an image sensor, and/or an image signal processor. The flash313may include, for example, a light emitting diode or a xenon lamp. Two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device300. The key input device317may be disposed on the lateral surface310C of the housing310. The mobile electronic device300may not include some or all of the key input device317described above, and the key input device317which is not included may be implemented in another form such as a soft key on the display301. The key input device317may include the sensor module disposed on the second surface310B of the housing310. The light emitting device may be disposed on the first surface310A of the housing310. For example, the light emitting device may provide status information of the electronic device300in an optical form. The light emitting device may provide a light source associated with the operation of the camera module305. The light emitting device may include, for example, a light emitting diode (LED), an IR LED, or a xenon lamp. The connector holes308and309may include a first connector hole308adapted for a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or a second connector hole309adapted for a connector (e.g., an earphone jack) for transmitting and receiving an audio signal to and from an external electronic device. Some modules305of camera modules305and312, some sensor modules304of sensor modules304and319, or an indicator may be arranged to be exposed through a display301. For example, the camera module305, the sensor module304, or the indicator may be arranged in the internal space of an electronic device300so as to be brought into contact with an external environment through an opening of the display301, which is perforated up to a front plate302. In another embodiment, some sensor modules304may be arranged to perform their functions without being visually exposed through the front plate302in the internal space of the electronic device. For example, in this case, an area of the display301facing the sensor module may not require a perforated opening. FIG.3Cillustrates an exploded perspective view showing a mobile electronic device shown inFIG.3Aaccording to an embodiment of the disclosure. Referring toFIG.3C, a mobile electronic device300may include a lateral bezel structure320, a first support member3211(e.g., a bracket), a front plate302, a display301, an electromagnetic induction panel (not shown), a printed circuit board (PCB)340, a battery350, a second support member360(e.g., a rear case), an antenna370, and a rear plate311. The mobile electronic device300may omit at least one (e.g., the first support member3211or the second support member360) of the above components or may further include another component. Some components of the electronic device300may be the same as or similar to those of the mobile electronic device101shown inFIG.1orFIG.2, thus, descriptions thereof are omitted below. The first support member3211is disposed inside the mobile electronic device300and may be connected to, or integrated with, the lateral bezel structure320. The first support member3211may be formed of, for example, a metallic material and/or a non-metal (e.g., polymer) material. The first support member3211may be combined with the display301at one side thereof and also combined with the printed circuit board (PCB)340at the other side thereof. On the PCB340, a processor, a memory, and/or an interface may be mounted. The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communications processor (CP). The memory may include, for example, one or more of a volatile memory and a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and/or an audio interface. The interface may electrically or physically connect the mobile electronic device300with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector. The battery350is a device for supplying power to at least one component of the mobile electronic device300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery350may be disposed on substantially the same plane as the PCB340. The battery350may be integrally disposed within the mobile electronic device300, and may be detachably disposed from the mobile electronic device300. The antenna370may be disposed between the rear plate311and the battery350. The antenna370may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna370may perform short-range communication with an external device, or transmit and receive power required for charging wirelessly. An antenna structure may be formed by a part or combination of the lateral bezel structure320and/or the first support member3211. FIG.4Ais a diagram illustrating a structure of, for example, a third antenna module described with reference toFIG.2according to an embodiment of the disclosure. Referring toFIG.4A, in panel (a) is a perspective view illustrating the third antenna module246viewed from one side, andFIG.4Ain panel (b) is a perspective view illustrating the third antenna module246viewed from the other side.FIG.4Ain panel (c) is a cross-sectional view illustrating the third antenna module246taken along line X-X′ ofFIG.4A. With reference toFIG.4A, in one embodiment, the third antenna module246may include a printed circuit board410, an antenna array430, a RFIC452, and a PMIC454. Alternatively, the third antenna module246may further include a shield member490. In other embodiments, at least one of the above-described components may be omitted or at least two of the components may be integrally formed. The printed circuit board410may include a plurality of conductive layers and a plurality of non-conductive layers stacked alternately with the conductive layers. The printed circuit board410may provide electrical connections between the printed circuit board410and/or various electronic components disposed outside using wirings and conductive vias formed in the conductive layer. The antenna array430(e.g.,248ofFIG.2) may include a plurality of antenna elements432,434,436, or438disposed to form a directional beam. As illustrated, the antenna elements432,434,436, or438may be formed at a first surface of the printed circuit board410. According to another embodiment, the antenna array430may be formed inside the printed circuit board410. According to the embodiment, the antenna array430may include the same or a different shape or kind of a plurality of antenna arrays (e.g., dipole antenna array and/or patch antenna array). The RFIC452(e.g., the third RFIC226ofFIG.2) may be disposed at another area (e.g., a second surface opposite to the first surface) of the printed circuit board410spaced apart from the antenna array. The RFIC452is configured to process signals of a selected frequency band transmitted/received through the antenna array430. According to one embodiment, upon transmission, the RFIC452may convert a baseband signal obtained from a communication processor (not shown) to an RF signal of a designated band. Upon reception, the RFIC452may convert an RF signal received through the antenna array430to a baseband signal and transfer the baseband signal to the communication processor. According to another embodiment, upon transmission, the RFIC452may up-convert an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (e.g.,228ofFIG.2) to an RF signal of a selected band. Upon reception, the RFIC452may down-convert the RF signal obtained through the antenna array430, convert the RF signal to an IF signal, and transfer the IF signal to the IFIC. The PMIC454may be disposed in another partial area (e.g., the second surface) of the printed circuit board410spaced apart from the antenna array430. The PMIC454may receive a voltage from a main PCB (not illustrated) to provide power necessary for various components (e.g., the RFIC452) on the antenna module. The shielding member490may be disposed at a portion (e.g., the second surface) of the printed circuit board410so as to electromagnetically shield at least one of the RFIC452or the PMIC454. According to one embodiment, the shield member490may include a shield can. Although not shown, in various embodiments, the third antenna module246may be electrically connected to another printed circuit board (e.g., main circuit board) through a module interface. The module interface may include a connecting member, for example, a coaxial cable connector, board to board connector, interposer, or flexible printed circuit board (FPCB). The RFIC452and/or the PMIC454of the antenna module may be electrically connected to the printed circuit board through the connection member. FIG.4Bis a cross-sectional view illustrating the third antenna module246taken along line Y-Y′ ofFIG.4Ain panel (a) according to an embodiment of the disclosure. The printed circuit board410of the illustrated embodiment may include an antenna layer411and a network layer413. Referring toFIG.4B, the antenna layer411may include at least one dielectric layer437-1, and an antenna element436and/or a power feeding portion425formed on or inside an outer surface of a dielectric layer. The power feeding portion425may include a power feeding point427and/or a power feeding line429. The network layer413may include at least one dielectric layer437-2, at least one ground layer433, at least one conductive via435, a transmission line423, and/or a power feeding line429formed on or inside an outer surface of the dielectric layer. Further, in the illustrated embodiment, the RFIC452(e.g., the third RFIC226ofFIG.2) ofFIG.4Ain panel (c) may be electrically connected to the network layer413through, for example, first and second solder bumps440-1and440-2. In other embodiments, various connection structures (e.g., solder or ball grid array (BGA)) instead of the solder bumps may be used. The RFIC452may be electrically connected to the antenna element436through the first solder bump440-1, the transmission line423, and the power feeding portion425. The RFIC452may also be electrically connected to the ground layer433through the second solder bump440-2and the conductive via435. Although not illustrated, the RFIC452may also be electrically connected to the above-described module interface through the power feeding line429. FIG.5is a perspective view illustrating an antenna structure according to an embodiment of the disclosure. An antenna module including the antenna structure an and a wireless communication circuit595, shown inFIG.5, may be similar, at least in part, to the third antenna module246ofFIG.2, or may include other embodiments of the antenna module. Referring toFIG.5, the antenna structure500may include a printed circuit board (PCB)590(or a substrate), a conductive pattern510disposed on or in the PCB590(e.g., an antenna element), and at least one dielectric structure660,670,680, and/or690disposed near the PCB590or disposed to support the PCB590at least in part. According to various embodiments, the PCB590may have a first surface591facing a first direction (denoted by {circle around (1)}) and a second surface592facing a second direction (denoted by {circle around (2)}) opposite to the first direction. According to an embodiment, the conductive pattern510may include a dipole antenna disposed in an inner space between the first surface591and the second surface592of the PCB590. According to an embodiment, the conductive pattern510may be disposed in a fill-and-cut region F of the PCB590, which is a non-conductive region separated from a ground region G of the PCB590. According to various embodiments, the wireless communication circuit595may be mounted on the second surface592and electrically connected to the conductive pattern510. In another embodiment, the wireless communication circuit595may be disposed in the inner space of the electronic device (e.g., the electronic device300inFIG.3A) to be spaced apart from the antenna structure500, and electrically connected to the PCB590through an electrical connection member (e.g., a flexible PCB (FPCB) connector). According to various embodiments, the antenna structure500may be disposed in the inner space of the electronic device (e.g., the electronic device300inFIG.3A) to form a beam pattern in a third direction (denoted by {circle around (3)}) perpendicular to the first direction (denoted by {circle around (1)}) through the conductive pattern510. According to an embodiment, the third direction (denoted by {circle around (3)}) may be a direction in which the lateral surface (e.g., the lateral surface310C inFIG.3A) of the electronic device (e.g., the electronic device300inFIG.3A) faces. According to an embodiment, the wireless communication circuit595may be configured to transmit and/or receive a radio signal in a frequency range of about 3 GHz to about 100 GHz through the conductive pattern510. According to various embodiments, the at least one dielectric structure660,670,680, or690may be disposed to support the PCB590at least partially. In another embodiment, the dielectric structure660,670,680, or690may include a support member (e.g., a bracket) made of a polymer material and disposed in the inner space of the electronic device. In another embodiment, the dielectric structure660,670,680, or690may include a support structure made of a polymer material and extended at least in part from the lateral member into the inner space of the electronic device. In yet another embodiment, the dielectric structure660,670,680, or690may include any structure provided separately to improve the beam pattern directivity, beam coverage, and/or gain of the conductive pattern510operating as a dipole antenna. According to an embodiment, the dielectric structure660,670,680, or690may include areas having different dielectric constants at least in part. The dielectric structure660,670,680, or690may provide a propagation induction path resulting from a difference in the dielectric constant and thereby contribute to improving the radiation performance of the antenna. FIG.6is a cross-sectional view partially showing an electronic device600, viewed from the line A-A′ inFIG.3B, according to an embodiment of the disclosure. The electronic device600shown inFIG.6may be similar, at least in part, to the electronic device101ofFIG.1or the electronic device300ofFIG.3A, or may include other embodiments of the electronic device. Referring toFIG.6, the electronic device600may include a housing610that includes a front cover630(e.g., a first cover or a first plate) facing a second direction (denoted by {circle around (2)}) (e.g., the Z-axis direction inFIG.3A), a rear cover640(e.g., a second cover or a second plate) facing a first direction (denoted by {circle around (1)}) (e.g., the negative Z-axis direction inFIG.3B) opposite to the front cover630, and a lateral member620surrounding an inner space6001between the front cover630and the rear cover640. According to an embodiment, the lateral member620may include a conductive portion621disposed at least in part and a polymer portion622(e.g., a non-conductive portion) injected (e.g., insert-injected or double-injected) into the conductive portion621. In another embodiment, the polymer portion622may be replaced with a space or any other dielectric material. In another embodiment, the polymer portion622may be structurally combined with the conductive portion621. According to an embodiment, the lateral member620may include a support member611(e.g., the first support member3211inFIG.3C) extended at least partially into the inner space6001. According to an embodiment, the support member611may be extended from the lateral member620into the inner space6001or formed by a structural coupling with the lateral member620. According to an embodiment, the support member611may be extended from the conductive portion621. According to an embodiment, the support member611may include a conductive member and/or a polymer member at least partially injected into the conductive member. According to an embodiment, the support member611may support at least in part a device substrate650(e.g., a main substrate) and/or a display631disposed in the inner space6001. In another embodiment, the support member611may support at least a portion of a battery (e.g., the battery350inFIG.3C) disposed in the inner space6001. According to an embodiment, the display631may be disposed in the inner space6001to be visible from the outside through at least a portion of the front cover630. According to various embodiments, the antenna structure500may include the PCB590including the conductive pattern510operating as a dipole antenna, and the dielectric structure660,670,680, or690disposed in the inner space6001to support at least in part the PCB590. According to an embodiment, the PCB590may be disposed in parallel with the rear cover640in the inner space6001of the electronic device600. For example, the PCB590may be disposed to be supported by at least a portion of the dielectric structure660,670,680, or690. In another embodiment, the PCB590may be disposed near the dielectric structure660,670,680, or690in the inner space6001of the electronic device600. According to an embodiment, the conductive pattern510may be disposed on or in the PCB590to form a beam pattern in the third direction (denoted by {circle around (3)}) facing the lateral member620and being perpendicular to the first direction (denoted by {circle around (1)}). In another embodiment, the conductive pattern510may be arranged to form a beam pattern directed toward a space between the third direction (denoted by {circle around (3)}) and the second direction (denoted by {circle around (2)}) as well as a beam pattern directed in the third direction (denoted by {circle around (3)}). In another embodiment, the conductive pattern510may be arranged to form a beam pattern directed toward a space between the third direction (denoted by {circle around (3)}) and the first direction (denoted by {circle around (1)}) as well as a beam pattern directed in the third direction (denoted by {circle around (3)}). According to various embodiments, a beam pattern formed in the third direction (denoted by {circle around (3)}) from the conductive pattern510may be subjected to interference and/or distortion due to the conductive portion621of the lateral member620, and may be partially overlapped with another beam pattern formed in another direction from another antenna (e.g., a conductive patch antenna). This may cause a reduction in the beam coverage of the antenna, thereby deteriorating the radiation performance. The electronic device600according to an embodiment of the disclosure includes the dielectric structure660,670,680, or690disposed on a radiation path of the beam pattern formed from the conductive pattern510between the PCB590and the lateral member620in the inner space6001. The dielectric structure660,670,680, or690can increase the directivity and/or gain of the beam pattern and/or expand the beam coverage, thus improving the radiation performance of the antenna. FIG.7is a perspective view illustrating an antenna structure500according to an embodiment of the disclosure. Referring toFIG.7, the antenna structure500may include the PCB590including a conductive pattern (e.g., the conductive pattern510inFIG.5) forming a beam pattern in the third direction (denoted by a), and a dielectric structure660disposed near the PCB590or disposed such that the PCB590is mounted at least in part. According to an embodiment, the dielectric structure660may be formed of a polymer material such as polycarbonate (PC). According to various embodiments, the dielectric structure660may include a first area A1corresponding to the PCB590and disposed on a radiation path of a beam pattern formed from the conductive pattern510, a second area A2adjacent to one side of the first area A1, and/or a third area A3adjacent to the other side of the first area A1. According to an embodiment, between the PCB590and the lateral member (e.g., the lateral member620inFIG.6), the first area A1may encompass the radiation path of the beam pattern formed from the conductive pattern510. According to an embodiment, the first area A1may be overlapped at least in part with the PCB590when the lateral member620is viewed from the outside. According to various embodiments, the first area A1, the second area A2, and/or the third area A3may have different dielectric constants. For example, the first area A1may be formed to have a first dielectric constant. According to an embodiment, the second area A2may be formed to have a second dielectric constant lower than the first dielectric constant. According to an embodiment, the third area A3may also be formed to have a third dielectric constant lower than the first dielectric constant. According to an embodiment, the second dielectric constant and the third dielectric constant may be substantially equal to or different from each other. According to various embodiments, in the dielectric structure660, the second area A2may have a recess662formed lower than a surface661of the first area A1facing the first direction (denoted by {circle around (1)}). The second area A2may be formed to have the second dielectric constant lower than the first dielectric constant of the first area A1through the recess662. According to an embodiment, the recess662may be formed to have a certain width (w1), a certain length (l1), and a certain depth (h1). According to an embodiment, the second dielectric constant of the second area A2may be determined by changing at least one of the width (w1), the length (l1), or the depth (h1) of the recess662. According to an embodiment, the third area A3may also have a recess663formed to resemble the recess662of the second area A2. According to an embodiment, the dielectric structure660may include a filling member that is filled in the recesses662and663of the second and third areas A2and A3and has a dielectric constant lower than the first dielectric constant of the first area A1. According to one embodiment, the filling member may reinforce the rigidity of the dielectric structure660by compensating for a loss of thickness due to the recess. According to various embodiments, the filling member may be disposed in the recesses662and663through injection into or structural coupling with the dielectric structure660. According to various embodiments, the beam pattern formed from the conductive pattern510of the PCB590is arranged on the radiation path along the first area A1having a higher dielectric constant between the second area A2and the third area A3each having a lower dielectric constant. Because radio waves have a property to proceed along the first area A1having a higher dielectric constant, the beam pattern with excellent directivity and extended beam coverage can be induced. FIG.8is a diagram comparing radiation patterns depending on a width and depth of the recess of an antenna structure shown inFIG.7according to an embodiment of the disclosure. Referring toFIG.8, it shows the radiation patterns of the antenna structure500when the width (w1) of each recess662,663formed in each of the second and third area A2and A3of the dielectric structure660is sequentially changed to 2 mm, 4 mm, and 6 mm, and also the depth (h1) is sequentially changed to 0.5 mm and 1 mm. As shown, when the recess has a width of 2 mm and a depth of 0.5 mm, a gain of the antenna structure500is about 5.4 dBi (802graph), whereas when the recess has a width of 6 mm and a depth of 1 mm, a gain is about 7.2 dBi (801graph). As a result, it can be seen that the gain is improved by about 1.8 dB at 90 degrees. Accordingly, as the width w1and depth h1of the recess662,663increase, the antenna structure500has an excellent beam focusing effect. FIG.9is a perspective view illustrating an antenna structure according to an embodiment of the disclosure. Referring toFIG.9, the antenna structure500may include the PCB590and a dielectric structure670(e.g., a first dielectric structure) disposed near the PCB590or disposed such that the PCB590is mounted at least in part. According to an embodiment, the dielectric structure670may include the first area A1corresponding to the PCB590and disposed on the radiation path of the beam pattern formed from the conductive pattern (e.g., the conductive pattern510inFIG.5), the second area A2adjacent to one side of the first area A1, and the third area A3adjacent to the other side of the first area A1. According to an embodiment, between the PCB590and the lateral member (e.g., the lateral member620inFIG.6), the first area A1may encompass the radiation path of the beam pattern formed from the conductive pattern510. According to various embodiments, the first area A1, the second area A2, and the third area A3may have different dielectric constants. For example, through a high-dielectric injected portion671(e.g., a second dielectric structure), the first area A1may be formed to have a dielectric constant higher than dielectric constants of the second and third areas A2and A3. According to an embodiment, the high-dielectric injected portion671may be insert-injected so as not to penetrate a surface of the dielectric structure670facing the second direction (denoted by {circle around (2)}). Thus, the high-dielectric injected portion671may be disposed between the dielectric structure670and the rear cover640in the inner space (e.g., the inner space6001inFIG.6) of the electronic device (e.g., the electronic device600inFIG.6). According to an embodiment, through the high-dielectric injected portion671disposed in the first area A1, the dielectric structure670may have a dielectric constant higher than the dielectric constant of the rear cover640. Because the high-dielectric injected portion671having a relatively high dielectric constant is disposed between the rear cover640and the dielectric structure670having relatively low dielectric constants in the first area A1in the second direction (denoted by {circle around (2)}), it is possible to increase the directivity and gain of the beam pattern formed from the conductive pattern510. According to an embodiment, the dielectric constant (Dk) of the high-dielectric injected portion671may have a range of 5 to 25. According to various embodiments, the high-dielectric injected portion671may be disposed in the first area A1in the form of insert-injection such that its surface coincides with the surface of the dielectric structure670that faces the first direction (denoted by {circle around (1)}). Forming the first area A1containing the high-dielectric injected portion671to have a plane coincident with the second and third areas A2and A3may improve an assembling property. In another embodiment, the high-dielectric injected portion671may be attached onto the dielectric structure670or may be disposed through a structural coupling (e.g., interference fit or tight fit). According to various embodiments, the high-dielectric injected portion671may be formed to have a certain width (w2), a certain length (l2), and a certain thickness (t). According to an embodiment, the dielectric constant of the high-dielectric injected portion671may be determined by changing at least one of the width (w2), the length (l2), or the thickness (t). FIGS.10A and10Bare diagrams comparing radiation patterns depending on a thickness of a high-dielectric injected portion of an antenna structure shown inFIG.9on XY-plane and YZ-plane, respectively according to an embodiment of the disclosure. FIGS.10A and10Bshow, on XY-plane and YZ-plane, a variation of radiation strength when the thickness (t) of the high-dielectric injected portion671having a dielectric constant of 11 is changed to 0.2 mm (case 1) and 0.5 mm (case 2). Referring toFIG.10A, on the XY-plane, the gain is about 5.4 dBi in case of no high-dielectric injected portion (1011graph), is about 6.6 dBi in case of the high-dielectric injected portion671having a thickness of 0.2 mm (1012graph), and is about 7.7 dBi in case of the high-dielectric injected portion671having a thickness of 0.5 mm (1013graph). Accordingly, as the thickness (t) of the high-dielectric injected portion671becomes thicker, the antenna structure500has an improved directivity because of a narrower half power beam width (HPBW) and thus has an excellent beam focusing effect. Referring toFIG.10B, on the YZ-plane, the gain is about 3.9 dBi in case of no high-dielectric injected portion (1014graph), is about 5.2 dBi in case of the high-dielectric injected portion671having a thickness of 0.2 mm (1015graph), and is about 6.6 dBi in case of the high-dielectric injected portion671having a thickness of 0.5 mm (1016graph). Accordingly, as the thickness (t) of the high-dielectric injected portion671becomes thicker, the antenna structure500has an increased radiation strength at 90 to 150 degrees and thus has an improved beam coverage. FIG.11is a perspective view illustrating an antenna structure according to an embodiment of the disclosure. In the antenna structure500ofFIG.11, both the recesses662and663ofFIG.7and the high-dielectric injected portion671ofFIG.9are applied together. Thus, repetition of descriptions may be avoided. Referring toFIG.11, the antenna structure500may include the PCB590and a dielectric structure680disposed near the PCB590or disposed such that the PCB590is mounted at least in part. According to an embodiment, the dielectric structure680may include the first area A1corresponding to the PCB590and disposed on the radiation path of the beam pattern formed from the conductive pattern (e.g., the conductive pattern510inFIG.5), the second area A2adjacent to one side of the first area A1, and the third area A3adjacent to the other side of the first area A1. According to an embodiment, between the PCB590and the lateral member (e.g., the lateral member620inFIG.6), the first area A1may encompass the radiation path of the beam pattern formed from the conductive pattern510. According to various embodiments, through the high-dielectric injected portion671disposed to have a relatively high dielectric constant, the first area A1may be formed to have a dielectric constant higher than dielectric constants of the second and third areas A2and A3. According to an embodiment, each of the second and third areas A2and A3may be formed to have a dielectric constant lower than the dielectric constant of the first area A1through the recesses662and663formed lower than the surface661of the dielectric structure680facing the first direction (denoted by {circle around (1)}). Thus, the first area A1having a relatively high dielectric constant may be disposed vertically between the dielectric structure680and the rear cover640both having relatively low dielectric constants in the first direction (denoted by {circle around (1)}), and also disposed horizontally between the second and third areas A2and A3both having relatively low dielectric constants and having the recesses662and663. It is therefore possible to increase the directivity and gain of the beam pattern formed from the conductive pattern510. According to various embodiments, the high-dielectric injected portion671may be disposed between the dielectric structure680and the rear cover640in the inner space (e.g., the inner space6001inFIG.6) of the electronic device (e.g., the electronic device600inFIG.6). According to an embodiment, through the high-dielectric injected portion671disposed in the first area A1, the dielectric structure680may have a dielectric constant higher than the dielectric constant of the rear cover640. Because the high-dielectric injected portion671having a relatively high dielectric constant is disposed between the rear cover640and the dielectric structure680having relatively low dielectric constants in the first area A1in the second direction (denoted by {circle around (2)}), it is possible to increase the directivity and gain of the beam pattern formed from the conductive pattern510. FIGS.12A and12Bare diagrams comparing radiation patterns of an antenna structure shown inFIG.11and of a typical antenna structure on XY-plane and YZ-plane, respectively. FIGS.12A and12Bshow, on XY-plane and YZ-plane, radiation strength in the 25 GHz band when the thickness (t) and width (w2) of the high-dielectric injected portion671having a dielectric constant of 11 are set to 0.5 mm and 4 mm, respectively, and the width (w1) and depth (h1) of each recess662,663are set to 6 mm and 1 mm, respectively according to various embodiment of the disclosure. Referring toFIG.12A, on the XY-plane, the gain is about 5.4 dBi in case of a typical antenna structure having neither high-dielectric injected portion nor recess (1201graph), and is about 7.8 dBi in case of the antenna structure500having both the high-dielectric injected portion671and the recesses662and663respectively set as above (1202graph). That is, the gain increases by about 2.4 dBi. Accordingly, it can be seen that the antenna structure500, to which both the high-dielectric injected portion671and the recesses662and663are applied, has excellent beam focusing performance in a lateral direction (e.g., the third direction denoted by {circle around (3)} inFIG.11). Referring toFIG.12B, on the YZ-plane, the gain is about 3.9 dBi in case of a typical antenna structure having neither high-dielectric injected portion nor recess (1203graph), and is about 6.3 dBi in case of the antenna structure500having both the high-dielectric injected portion671and the recesses662and663respectively set as above (1204graph). That is, the gain increases by about 2.4 dBi. FIG.13is a perspective view illustrating an antenna structure according to an embodiment of the disclosure. The antenna structure500shown inFIG.13may have the substantially same areas A1, A2, and A3as those of the above-described antenna structures (i.e., the antenna structures500inFIGS.7,9, and11). Embodiments described below relate to various structures capable of changing at least in part the dielectric constants of such areas. Referring toFIG.13, the antenna structure500may include the PCB590and a dielectric structure690disposed near the PCB590or disposed such that the PCB590is mounted at least in part. According to an embodiment, the dielectric structure690may include the first area A1corresponding to the PCB590and disposed on the radiation path of the beam pattern formed from the conductive pattern (e.g., the conductive pattern510inFIG.5), the second area A2adjacent to one side of the first area A1, and the third area A3adjacent to the other side of the first area A1. According to an embodiment, the first area A1may be formed on the radiation path of the beam pattern formed from the conductive pattern510between the PCB590and the lateral member (e.g., the lateral member620inFIG.6). According to various embodiments, the first area A1may include at least one high-dielectric patch691disposed to have a relatively high dielectric constant. Through the high-dielectric patch691having a relatively high dielectric constant, the first area A1may be formed to have a dielectric constant higher than the dielectric constants of the second and third areas A2and A3. According to an embodiment, when the first, second, and third areas A1, A2, and A3of the dielectric structure690are formed (e.g., injected) to have the same dielectric constant, the high-dielectric patch691may be disposed in the first area A1only such that the first area A1has a dielectric constant higher than those of the second and third areas A2and A3. In another embodiment, the high-dielectric patch691may be replaced with the high-dielectric injected portion671previously described inFIG.11. The first area A1having a relatively high dielectric constant may be disposed between the dielectric structure690and the rear cover640both having relatively low dielectric constants in the first direction (denoted by {circle around (1)}). According to various embodiments, the dielectric structure690may include periodic structures692disposed in the second area A2and the third area A3in order to achieve a relatively low dielectric constant than that of the first area A1. According to an embodiment, the periodic structures692may be formed to penetrate the dielectric structure690in the second direction (denoted by {circle around (2)}). In another embodiment, the periodic structures692may be formed to have a certain depth from the upper surface661of the dielectric structure690in the second direction ({circle around (2)}). In an embodiment, the periodic structures692may be formed in a circular shape. In another embodiment, the periodic structures692may be formed in any other shape such as an elliptical shape or a polygonal shape. In an embodiment, the periodic structures692may be formed as air holes containing no filling material. In another embodiment, the periodic structures692may be formed as air holes that contain a filling material having a dielectric constant lower than that of the first area A1. According to an embodiment, the periodic structures692may be periodically arranged along radiation directions from left and right ends of the PCB590, except for the beam pattern direction of the first area A1, in the second and third areas A2and A3. In an embodiment, the first area A1having a relatively high dielectric constant may be disposed vertically in the first direction (denoted by {circle around (1)}) under the rear cover640having a relatively low dielectric constant, and also disposed horizontally between the second and third areas A2and A3both having relatively low dielectric constants because of the periodic structures692, so that the antenna structure500can increase the directivity and gain of the beam pattern formed from the conductive pattern510. FIG.14is a graph comparing gain characteristics depending on a presence or absence of a high-dielectric patch and periodic structures of an antenna structure ofFIG.13according to an embodiment of the disclosure. FIG.14shows gain characteristics of the antenna structure in case where neither high-dielectric patch nor the periodic structures are present (denoted by ‘default integration’), in case where only the periodic structures692are formed (denoted by ‘air holes’), in case where only the high-dielectric patch691is disposed (denoted by ‘patch’), and in case where both the periodic structures692and the high-dielectric patch691are applied (denoted by ‘patch & air holes’). Referring toFIG.14, in the 25 GHz band (denoted by1401), the antenna structure500with only the periodic structures692has a gain increased by about 0.4 dB in comparison with the default antenna structure, and the gain bandwidth is also increased. In an embodiment, the antenna structure500with only the high-dielectric patch691has a gain increased by about 0.7 dB in comparison with the default antenna structure, and the gain bandwidth is also increased. In an embodiment, the antenna structure with both high-dielectric patch691and the periodic structures692has a gain increased by about 0.9 dB in comparison with the default antenna structure. That is, it can be seen that, in the 25 GHz, there is a gain increase effect up to 2 dB. Also, it can be seen that the antenna structure500to which both the high-dielectric patch691and the periodic structures692are applied together has substantially uniform gain characteristics within an operating frequency band of about 22 GHz to about 26.5 GHz. FIG.15is a diagram comparing radiation characteristics depending on a presence or absence of a high-dielectric patch and periodic structures of an antenna structure ofFIG.13according to an embodiment of the disclosure. Referring toFIG.15, in the 25 GHz band (denoted by1501), the antenna structure500to which both the high-dielectric patch691and the periodic structures692are applied has a beam focused in a lateral direction (e.g., the third direction denoted by {circle around (3)} inFIG.13), and also has a narrower half power beam width (HPWB) resulting in an improved directivity. FIGS.16A and16Bare diagrams comparing radiation patterns of an antenna structure shown inFIG.13and of a typical antenna structure according to various embodiments of the disclosure. Referring toFIG.16A, the typical antenna structure to which neither the high-dielectric patch691nor the periodic structures692are applied may cause the main beam to be divided into both sides, resulting in deterioration of directivity. In contrast, referring toFIG.16B, the antenna structure500to which both the high-dielectric patch691and the periodic structures692are applied according to an embodiment may allow the main beam to be focused, thereby maintaining high gain characteristics. FIGS.17A and17Bare diagrams illustrating, on an XY plane, electric field distributions of an antenna structure shown inFIG.13and of a typical antenna structure according to various embodiments of the disclosure. Referring toFIG.17A, the typical antenna structure to which neither the high-dielectric patch691nor the periodic structures692are applied has an electric field distribution that indicates a lateral radiation widely spread left and right. In contrast, referring toFIG.17B, the antenna structure500to which both the high-dielectric patch691and the periodic structures692are applied according to an embodiment has an electric field distribution that indicates a reduced lateral radiation and a radiation guided to the outermost side of the electronic device. FIGS.18A and18Bare diagrams illustrating, on an YX plane, electric field distributions of an antenna structure shown inFIG.13and of a typical antenna structure according to various embodiments of the disclosure. Referring toFIG.18A, the typical antenna structure to which neither the high-dielectric patch691nor the periodic structures692are applied has an electric field distribution that indicates a lateral radiation formed along the rear cover640but weak electric field strength at the outermost by beam splitting. In contrast, referring toFIG.18B, the antenna structure500to which both the high-dielectric patch691and the periodic structures692are applied according to an embodiment has an electric field distribution that indicates the electric field strength guided to the outermost and also the radiation of the maximum power. FIG.19is a diagram illustrating a configuration of periodic structures of an antenna structure according to an embodiment of the disclosure. Referring toFIG.19, based on the configuration of the periodic structures692, the second and third areas A2and A3of the dielectric structure690may have effective dielectric constants lower than the dielectric constant of the first area A1. In an embodiment, the dielectric constant of each of the second and third areas A2and A3may be determined based on the diameter (d1) (i.e., size) of each periodic structure692, the distance (d2) between adjacent periodic structures692, and/or the number of arrangements (r1, r2, . . . , rn) of the periodic structures692. For example, when the distance (d2) between the periodic structures692is decreased, when the diameter (d1) of each periodic structure692is increased, or when the number of arrangements (r1, r2, . . . , rn) of the periodic structures692is increased, the effective dielectric constant of each of the second and third areas A2and A3may be lowered. In another embodiment, if the arrangement density of the periodic structures692is increased, each of the second and third areas A2and A3may have a low effective dielectric constant. FIG.20is a diagram illustrating radiation characteristics depending on the number of arrangements (r1, r2, . . . , rn) of the periodic structures692shown inFIG.19according to an embodiment of the disclosure. Referring toFIG.20, it shows a variation of radiation patterns depending on the number of arrangements (r1, r2, . . . , rn) of the periodic structures692, that is, shows the radiation patterns of the antenna structure500in case where, in each of the second and third areas A2and A3, the periodic structures692are arranged in two rows (2011), in case arranged in four rows (2012), and in case arranged in six rows (2013). As illustrated, when two rows of periodic structures692are additionally arranged in the default antenna structure, the beam focusing effect may not be large. However, when four or more rows of the periodic structures692are arranged, the peak gain of the lateral radiation of the antenna structure500increases. That is, when four rows and six rows are arranged, the peak gains may be increased to 0.85 dB and 1.3 dB, respectively. This means that the effective dielectric constants of the second and third areas A2and A3become lowered only when four or more rows of the periodic structures692are applied. FIG.21is a diagram illustrating radiation characteristics depending on a diameter (d1) of periodic structures shown inFIG.19according to various embodiment of the disclosure. Referring toFIG.21, it can be seen that the antenna structure500has an excellent beam focusing performance when the periodic structures692each having a diameter of 1 mm are arranged in four rows (2112graph) than when there is no periodic structure (2111graph). In addition, it can be seen that even when the periodic structures692each having a diameter of 2 mm are arranged in two rows (2113graph), the antenna structure500has the substantially same beam focusing performance as when the periodic structures692each having a diameter of 1 mm are arranged in four rows (2112graph). According to an embodiment, it can be seen that the effective dielectric constants of the second and third areas A2and A3are lowered in proportion to the area occupied by the periodic structures692. FIG.22is a perspective view illustrating an antenna structure according to an embodiment of the disclosure. Referring toFIG.22, in an antenna structure2200, the same or similar components as those of the antenna structure500shown inFIG.11may be indicated by the same reference numerals, and related descriptions may be omitted. The antenna structure2200may include a pair of PCBs590-1and590-2, and a dielectric structure2210disposed near the pair of PCBs590-1and590-2or disposed such that the pair of PCBs590-1and590-2are mounted at least in part. According to an embodiment, the pair of PCBs may include first and second PCBs590-1and590-2including first and second conductive patterns510-1and510-2, respectively, as dipole antennas. According to an embodiment, the dielectric structure2210may include the first area A1corresponding to the pair of PCBs590-1and590-2and disposed on the radiation path of the beam patterns formed from the conductive patterns510-1and510-2, the second area A2adjacent to one side of the first area A1, and the third area A3adjacent to the other side of the first area A1. According to an embodiment, between the PCBs590-1and590-2and the lateral member (e.g., the lateral member620inFIG.6), the first area A1may encompass the radiation path of the beam patterns formed from the conductive patterns510-1and510-2. According to an embodiment, the first and second PCBs590-1and590-2may be physically separated from each other through a partition wall6611in the first area A1. According to an embodiment, the pair of conductive patterns510-1and510-2may be arranged at half-wavelength intervals. According to various embodiments, through a plurality of high-dielectric injected portions671-1and671-2each disposed to have a relatively high dielectric constant, the first area A1may be formed to have a dielectric constant higher than dielectric constants of the second and third areas A2and A3. According to an embodiment, the plurality of high-dielectric injected portions671-1and671-2may include a first high-dielectric injected portion671-1disposed to face the first PCB590-1in the first area A1, and a second high-dielectric injected portion671-2disposed to face the second PCB590-2in the first area A1. In another embodiment, the first area A1may contain, without the partition wall6611, a single high-dielectric injected portion corresponding to both the first and second high-dielectric injected portions. According to various embodiments, each of the second and third areas A2and A3may be formed to have a dielectric constant lower than the dielectric constant of the first area A1through the recesses662and663formed lower than the surface661of the dielectric structure680facing the first direction (denoted by {circle around (1)}). Thus, the first area A1having a relatively high dielectric constant may be disposed vertically between the dielectric structure2210and the rear cover640both having relatively low dielectric constants in the first direction (denoted by {circle around (1)}), and also disposed horizontally between the second and third areas A2and A3both having relatively low dielectric constants and having the recesses662and663. It is therefore possible to increase the directivity and gain of the beam patterns formed from the conductive patterns510-1and510-2. FIGS.23A and23Bare diagrams comparing radiation patterns of an antenna structure shown inFIG.22and of a typical antenna structure on an XY-plane and a YZ-plane, respectively according to various embodiments of the disclosure. FIGS.23A and23Bshow, on XY-plane and YZ-plane, radiation strength of the antenna structure2200in the 25 GHz band. Referring toFIG.23A, on an XY-plane, the gain is about 8.5 dBi in case of a typical antenna structure having neither high-dielectric injected portion nor recess (2301graph), and is about 9.8 dBi in case of the antenna structure2200having both the high-dielectric injected portions671-1and671-2and the recesses662and663(2302graph). That is, the gain increases by about 1.3 dBi. Accordingly, it can be seen that the antenna structure220, to which the high-dielectric injected portions671-1and671-2and the recesses662and663are applied together, has excellent beam focusing performance in a lateral direction (e.g., the third direction denoted by {circle around (3)} inFIG.22). Referring toFIG.23B, at 90 degrees (i.e., in the third direction {circle around (3)} or in a direction of the lateral member) on the YZ-plane, the gain is about 6.6 dBi in case of a typical antenna structure having neither high-dielectric injected portion nor recess (2303graph), and is about 8.6 dBi in case of the antenna structure2200having both the high-dielectric injected portions671-1and671-2and the recesses662and663(2304graph). That is, the gain increases by about 2.0 dBi. In addition, at 120 degrees (i.e., in the second direction {circle around (2)} or in a direction of the front cover) on the YZ-plane, the gain is about 1.5 dBi in case of a typical antenna structure having neither high-dielectric injected portion nor recess (2303graph), and is about 4.3 dBi in case of the antenna structure2200having both the high-dielectric injected portions671-1and671-2and the recesses662and663(2304graph). That is, the gain increases by about 2.8 dBi. FIG.24is a perspective view illustrating an antenna structure according to an embodiment of the disclosure. Referring toFIG.24, in an antenna structure2400shown inFIG.24, the same or similar components as those of the antenna structure2200shown inFIG.22may be indicated by the same reference numerals, and related descriptions may be omitted. The antenna structure2400may include the plurality of (e.g., first and second) high-dielectric injected portions671-1and671-2separated from each other through the partition wall6611in the first area A1of a dielectric structure2410. According to an embodiment, the antenna structure2400may include a single PCB590-3disposed to face the first area A1of the dielectric structure2410and also face the plurality of high-dielectric injected portions671-1and671-2in common. According to an embodiment, the antenna structure2400may include the pair of conductive patterns510-1and510-2disposed on or in the PCB590-3to face the first and second high-dielectric injected portions671-1and671-2, respectively. FIG.25is a perspective view illustrating an antenna structure according to an embodiment of the disclosure. Referring toFIG.25, an antenna module including the antenna structure1500and a wireless communication circuit1595, shown inFIG.25, may be similar, at least in part, to the third antenna module246ofFIG.2, or may include other embodiments of the antenna module. The antenna structure1500may include a PCB1590, a first antenna array AR1disposed on or in the PCB1590, a second antenna array AR2disposed near the first antenna array AR1on or in the PCB1590, and/or a dielectric structure (e.g., the dielectric structure660inFIG.7,670inFIG.9,680inFIG.11,690inFIG.13, or2410inFIG.24) disposed near the PCB1590or disposed to support the PCB1590at least in part. According to various embodiments, the PCB1590may have a first surface1591facing a first direction (denoted by {circle around (1)}) and a second surface1592facing a second direction (denoted by {circle around (2)}) opposite to the first direction. According to an embodiment, the first antenna array AR1may include a plurality of conductive patterns1510,1520,1530, and1540disposed at regular intervals in an inner space between the first surface1591and the second surface1592of the PCB1590. According to an embodiment, the first antenna array AR1may be disposed in the fill-and-cut region F of the PCB1590that contains a dielectric layer. According to an embodiment, the second antenna array AR2may include a plurality of conductive patches1550,1560,1570, and1580exposed on the first surface1591of the PCB1590or disposed near the first surface1591in an inner space between the first and second surfaces1591and1592. According to an embodiment, the second antenna array AR2may be disposed in the ground region G of the PCB1590that contains a ground layer and adjoins the fill-and-cut region F. According to an embodiment, the plurality of conductive patterns1510,1520,1530, and1540may operate as a dipole antenna. According to an embodiment, the plurality of conductive patches1550,1560,1570, and1580may operate as a patch antenna. According to various embodiments, the wireless communication circuit1595may be mounted on the second surface1592and electrically connected to both the first antenna array AR1and the second antenna array AR2. In another embodiment, the wireless communication circuit1595may be disposed in the inner space of the electronic device (e.g., the electronic device300inFIG.3A) to be spaced apart from the antenna structure1500, and electrically connects to the PCB1590through an electrical connection member (e.g., a flexible PCB (FPCB) connector). According to various embodiments, the antenna structure1500may be disposed in the inner space of the electronic device (e.g., the electronic device300inFIG.3A) to form a beam pattern in a third direction (denoted by {circle around (3)}) perpendicular to the first direction (denoted by {circle around (1)}) through the first antenna array AR1. According to an embodiment, the third direction ({circle around (3)}) may be a direction in which the lateral surface (e.g., the lateral surface310C inFIG.3A) of the electronic device (e.g., the electronic device300inFIG.3A) faces. According to an embodiment, the antenna structure1500may be disposed in the inner space of the electronic device (e.g., the electronic device300inFIG.3A) to form a beam pattern in the first direction ({circle around (1)}) through the second antenna array AR2. According to an embodiment, the first direction ({circle around (1)}) may be a direction in which the rear surface (e.g., the rear surface310B inFIG.3B) of the electronic device (e.g., the electronic device300inFIG.3B) faces. According to an embodiment, the wireless communication circuit1595may be configured to transmit and/or receive a radio signal in a frequency range of about 3 GHz to about 100 GHz through the first antenna array AR1and/or the second antenna array AR2. Although theFIG.25embodiment describes and shows the antenna structure1500that includes the first antenna array AR1composed of four conductive patterns1510,1520,1530, and1540and the second antenna array AR2composed of four conductive patches1550,1560,1570, and1580, this is exemplary only and not to be construed as a limitation. In various alternative embodiments, the antenna structure1500may include, as the first antenna array AR1, three, five, or more conductive patterns, and also include, as the second antenna array AR2, one, two, three, five, or more conductive patches. According to various embodiments, the antenna structure1500may be disposed such that the PCB590is supported at least in part through the dielectric structures660,670,680,690, and2410. According to various embodiments, the dielectric structure (e.g., the dielectric structure660inFIG.7,670inFIG.9,680inFIG.11,690inFIG.13, or2410inFIG.24) may include areas having different dielectric constants at least in part, and may provide a propagation induction path resulting from a difference in the dielectric constant, thereby contributing to improving the radiation performance of the antenna. According to various embodiments of the disclosure, inducing a beam pattern direction to a desired radiation direction by using the dielectric structure disposed in the electronic device can increase the antenna gain, expand the beam coverage, and thereby improve the radiation performance. According to various embodiments, an electronic device (e.g., the electronic device600inFIG.6) may include a housing (e.g., the housing610inFIG.6) including a first cover (e.g., the rear cover640inFIG.6) having a first dielectric constant, and an antenna structure (e.g., the antenna structure500inFIG.6) disposed in an inner space (e.g., the inner space6001) of the housing. The antenna structure may include a printed circuit board (PCB) (e.g., the PCB590inFIG.6), at least one antenna element (e.g., the conductive pattern510inFIG.6) disposed in the PCB to form a beam pattern in a specific direction, a first dielectric structure (e.g., the dielectric structure660inFIG.7) disposed on a radiation path of the beam pattern, formed integrally with or combined with the PCB, and having a second dielectric constant equal to or different from the first dielectric constant, and a second dielectric structure (e.g., the high-dielectric injected portion671inFIG.11) disposed on the radiation path between the first dielectric structure and the first cover, and having a third dielectric constant higher than the first dielectric constant and the second dielectric constant. The electronic device may further include a wireless communication circuit (e.g., the wireless communication circuit595inFIG.5) configured to transmit and/or receive a radio signal through the at least one antenna element. According to various embodiments, the second dielectric structure may include a high-dielectric injected portion injected into the first dielectric structure on the radiation path. According to various embodiments, the third dielectric constant may be determined based on at least one of width (e.g., the width (w2) inFIG.9), length (e.g., the length (l2) inFIG.9), or thickness (e.g., the thickness (t) inFIG.9) of the high-dielectric injected portion. According to various embodiments, the high-dielectric injected portion may be disposed to have an upper surface that coincides with an upper surface (e.g., the upper surface661inFIG.11) of the first dielectric structure. According to various embodiments, the second dielectric structure may include a high-dielectric patch (e.g., the high-dielectric patch691inFIG.13) attached to an upper surface of the first dielectric structure on the radiation path. According to various embodiments, the PCB may be supported at least in part by the first dielectric structure. According to various embodiments, the first dielectric structure may include a low-dielectric structure disposed on both sides of the second dielectric structure and having a fourth dielectric constant lower than the third dielectric constant. According to various embodiments, the low-dielectric structure may be formed as a recess (e.g., the recesses662and663inFIG.11) in the first dielectric structure. According to various embodiments, the fourth dielectric constant may be determined based on at least one of width (e.g., the width (w1) inFIG.7), length (e.g., the length (l1) inFIG.7), or depth (e.g., the depth (h1) inFIG.7) of the recess. According to various embodiments, the low-dielectric structure may include periodic structures (e.g., the periodic structures692inFIG.13) formed at a predetermined depth in the first dielectric structure. According to various embodiments, the periodic structures may include air holes formed at a predetermined depth in the first dielectric structure. According to various embodiments, the periodic structures may include a filling material filled in the air holes and having a dielectric constant lower than the second dielectric constant. According to various embodiments, the fourth dielectric constant may be determined based on at least one of a distance between the periodic structures, a size of each periodic structure, a number of arrangements of the periodic structures, or an arrangement density of the periodic structures. According to various embodiments, the electronic device may further include a second cover (e.g., the front cover630inFIG.6) facing in a direction opposite to the first cover, and a display (e.g., the display631inFIG.6) disposed in the inner space to be visible at least in part from outside through the second cover. According to various embodiments, an electronic device (e.g., the electronic device600inFIG.6) may include a housing (e.g., the housing610inFIG.6) and an antenna structure (e.g., the antenna structure500inFIG.6) disposed in an inner space (e.g., the inner space6001) of the housing. The antenna structure may include a printed circuit board (PCB) (e.g., the PCB590inFIG.6), at least one antenna element (e.g., the conductive pattern510inFIG.6) disposed in the PCB to form a beam pattern in a specific direction, and a dielectric structure (e.g., the dielectric structure660inFIG.7) disposed on a radiation path of the beam pattern, formed integrally with or combined with the PCB, and having a first dielectric constant, wherein the dielectric structure includes a first area (e.g., the first area A1inFIG.7) corresponding to the radiation path, and a low-dielectric structure (e.g., the recesses662and663inFIG.7) disposed on both sides of the first area and having a second dielectric constant lower than the first dielectric constant. The electronic device may further include a wireless communication circuit (e.g., the wireless communication circuit595inFIG.5) configured to transmit and/or receive a radio signal through the at least one antenna element. According to various embodiments, the low-dielectric structure may include a recess formed to be lower than an upper surface of the dielectric structure. According to various embodiments, the second dielectric constant may be determined based on at least one of width, length, or depth of the recess. According to various embodiments, the low-dielectric structure may include periodic structures formed at a predetermined depth from an upper surface of the dielectric structure. According to various embodiments, the second dielectric constant may be determined based on at least one of a distance between the periodic structures, a size of each periodic structure, a number of arrangements of the periodic structures, or an arrangement density of the periodic structures. According to various embodiments, the housing may include a cover, and the electronic device may further include a high-dielectric structure disposed on the radiation path between the dielectric structure and the cover, and having a third dielectric constant higher than the first dielectric constant and a dielectric constant of the cover. While the disclosure has been particularly shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. | 99,400 |
11862877 | DESCRIPTION OF EMBODIMENTS All aspects according to the present disclosure are merely examples, and they are neither intended to exclude the other examples from the present disclosure nor intended to limit technical features of the invention described in Claims. The description about combinations of the aspects according to the present disclosure may be partially omitted. Such omissions are intended to simplify the description, and they are neither intended to exclude them from the present disclosure nor intended to limit the technical scope of the invention described in Claims. All combinations of the aspects according to the present disclosure are included in the present disclosure either explicitly, implicitly or inherently, regardless of whether the omission is made or not. Thus, all combinations of the aspects according to the present disclosure can be directly and clearly conceived from the present disclosure, regardless of whether the omission is made or not. For example, as shown inFIGS.1and2, an antenna according to an aspect of the present disclosure may be an antenna A1comprising antenna elements a2(a2-1, a2-2, a2-3and a2-4) provided on sides of a nearly rectangular shaped conductive board a1, respectively, wherein: each of the antenna elements a2comprises a feeding wire a23(a23-1, a23-2, a23-3or a23-4) and a split-ring conductor a22(a22-1, a22-2, a22-3or a22-4) of a shape which is a ring but is partially cut by a split portion a21(a21-1, a21-2, a21-3or a21-4); the feeding wire a23is electrically connected with the split-ring conductor a22and extends in a direction which traverses a region a24formed inside the split-ring conductor a22; and among four of the antenna elements a2, two of the antenna elements a2, i.e. (a2-1and a2-3) or (a2-2and a2-4), which are arranged on any two of the sides of the conductive board a1opposite to each other are fed via the feeding wires a23respectively provided thereto so that orientations of electric fields in polarization directions thereof are substantially same as each other. For example, the conductive board a1may be provided on a board B1. For example, the antenna element a2may be that ofFIGS.3to14or may be their modification. For example, althoughFIGS.1and2show an example of the antenna A1having sides each of which is provided with the antenna element a2ofFIG.3or its modification, each of the antenna elements a2(a2-1, a2-2, a2-3and a2-4) of the antenna A1may be any one of the antenna elements a2ofFIGS.4to14and their modifications. For example, the split portion a21may be filled with nothing or may be filled with resin, etc. For example, the split portion a21may have any shape and may have a shape such as a straight line, a curved line, or a zigzag line. For example, the split portion a21may have a meander shape. The wording of the meander shape includes concept which is specified by the wordings such as a zigzag shape, a comb tooth shape, and a shape based on an interdigital structure. For example, the meander shape is formed of a combination of a straight line, a curved line, a zigzag line, etc. For example, the split-ring conductor a22may be formed of a metal plate. For example, the split-ring conductor a22may have any shape, may have a shape based on a C-like shape along a rectangular ring, or may have a shape based on the other various rings such as a circular ring, an elliptical ring and a track ring. For example, the region a24formed inside the split-ring conductor a22may have any shape, may have a polygonal shape such as a square or a rectangle, or may have a shape such as a circle or an ellipse. For example, the split-ring conductor a22may comprise an auxiliary conductor provided on parts thereof which sandwich the split portion a21therebetween. The auxiliary conductor may be provided in a layer same as or different from that of the split-ring conductor a22. The phrase of “the feeding wire a23is electrically connected with the split-ring conductor a22” includes both concepts of electrical connection by direct connection of a conductor and electrical connection for wireless feeding such as EM feeding. For example, the feeding wire a23may be connected to any part of the split-ring conductor a22, and impedance of an RF circuit and impedance of the antenna element a2can be adjusted by adjusting the connected position. For example, the feeding wire a23may be provided in a layer different from that of the split-ring conductor a22and may be connected to the split-ring conductor a22through a via, for example. For example, the feeding wire a23may be provided in a layer same as a layer in which the split-ring conductor a22exists, may extend in the region a24and may extend along a clearance formed in the split-ring conductor a22or in the conductive board a1. For example, the feeding wire a23may be formed of a wire such as a transmission line and may be formed of a metal plate. For example, the split-ring conductor a22and the metal plate part of the feeding wire a23may be formed by cutting out them from one conductive board by a laser, etc. For example, the feeding to the antenna elements a2(a2-1, a2-2, a2-3and a2-4) may be implemented in a configuration such as a circuit diagram P ofFIG.15. For example, inFIG.15, the antenna element a2-1and the antenna element a2-3are fed by a feeding point a31, and the antenna element a2-2and the antenna element a2-4are fed by a feeding point a32. The feature of “the antenna element a2-1and the antenna element a2-3are fed via the aforementioned feeding wires a23provided thereto so that orientations of electric fields in polarization directions thereof are substantially same as each other” may be implemented in configurations such as those ofFIGS.16and17and their modifications, for example. Similar implementation can be made for the antenna element a2-2and the antenna element a2-4. For example, the antenna element a2-1and the antenna element a2-3ofFIG.16are simply fed by the feeding point a31so that an orientation E1of an electric field in polarization direction of the antenna element a2-1is substantially same as an orientation E3of an electric field in polarization direction of the antenna element a2-3. Moreover, for example, a feeding wire from the feeding point a31to the antenna element a2-1and another feeding wire from the feeding point a31to the antenna element a2-3are arranged so that their electrical lengths are substantially equal to each other. For example, inFIG.17, the antenna element a2-1is simply fed by the feeding point a31, while the antenna element a2-3is fed by a feeding point a3via a phase shifter a41, for example, a 180 degrees phase shifter. This configuration reduces affection depending on the connected position between the split-ring conductor a22and the feeding wire a23so that E1and E3are substantially same as each other. For example, in an instance where only one of the sides of the conductive board a1of a rectangular shape is provided with one of the antenna elements a2(a2-1), a radiation pattern of polarized wave corresponding to this antenna element a2(a2-1) can be illustrated asFIG.18. Therefore, for example, when dual-polarization is tried by providing additional one of the antenna elements a2(a2-2or a2-4) on another side adjacent to the side on which this antenna element a2(a2-1) is provided, the orthogonality of radiation patterns of two polarized waves might be low. In contrast, according to the antenna A1of an aspect of the present disclosure, radiation patterns of polarized waves corresponding to the antenna element a2-1and the antenna element a2-3can be illustrated asFIG.19, for example, and radiation patterns of polarized waves corresponding to the antenna element a2-2and the antenna element a2-4can be illustrated asFIG.20. Therefore, according to the antenna A1of an aspect of the present disclosure, for example, the orthogonality of radiation patterns of two polarized waves is high. Thus, according to an aspect of the present disclosure, a compact dual-polarized antenna with a split-ring resonator can be provided, for example. For example, as shown inFIG.21, an antenna according to an aspect of the present disclosure, for example, the antenna A1or its modification, may be an antenna A2, wherein a distance L (L12, L23, L34or L41) between the centers01,02,03and04of two of the antenna elements a2, i.e. (a2-1and a2-2), (a2-2and a2-3), (a2-3and a2-4) or (a2-4and a2-1), which are among four of the antenna elements a2and are arranged on any two of the sides of the conductive board a1adjacent to each other, is about one fifth of or less than vacuum wavelength A of an electromagnetic wave at a resonant frequency of this antenna. L12is a length of a line segment which connects the point01and the point02to each other. Thus, L12is a distance between the point01and the point02. L23is a length of a line segment which connects the point02and the point03to each other. Thus, L23is a distance between the point02and the point03. L34is a length of a line segment which connects the point03and the point04to each other. Thus, L34is a distance between the point03and the point04. L41is a length of a line segment which connects the point04and the point01to each other. Thus, L41is a distance between the point04and the point01. For example, according to a dual-polarized antenna in which only adjacent two of the sides of the conductive board a1of a rectangular shape are provided with the antenna elements a2, for example, only a2-1and a2-2, when L such as L12is about one fifth of or less than λ, the orthogonality of radiation patterns of two polarized waves might be low. In contrast, according to the antenna A2of an aspect of the present disclosure, even when L (L12, L23, L34or L41) is about one fifth of or less than λ, for example, the orthogonality of radiation patterns of two polarized waves is high. Thus, according to an aspect of the present disclosure, a more compact dual-polarized antenna with a split-ring resonator can be provided, for example. For example, as shown inFIG.22, an antenna according to an aspect of the present disclosure, for example, the antenna A1, A2or their modification, may be an antenna A3, wherein two of the antenna elements a2, i.e. (a2-1and a2-2), (a2-2and a2-3), (a2-3and a2-4) or (a2-4and a2-1), which are among four of the antenna elements a2and are arranged on any two of the sides of the conductive board a1adjacent to each other, are fed with signals via the feeding wires a23respectively provided thereto, the signals having a phase difference of 90 degrees. For example, this phase difference of 90 degrees may be implemented in a configuration such as a circuit diagram Q ofFIG.22and its modification. From the above, according to an aspect of the present disclosure, a compact, circularly polarized antenna with a split-ring resonator can be provided, for example. For example, as shown inFIG.23, a board according to an aspect of the present disclosure may be the board B1which comprises the nearly rectangular shaped conductive board a1, comprises terminals b1(b1-1, b1-2, b1-3and b1-4) corresponding to ground terminals a25(a25-1, a25-2, a25-3and a25-4) of the antenna elements a2(a2-1, a2-2, a2-3and a2-4) so that the antenna elements a2(a2-1, a2-2, a2-3and a2-4) are attached to sides of the conductive board a1, respectively, and comprises terminals b2(b2-1, b2-2, b2-3and b2-4) corresponding to terminals of the feeding wires a23(a23-1, a23-2, a23-3and a23-4) so that the antenna elements a2(a2-1, a2-2, a2-3and a2-4) are fed via the feeding wires a23(a23-1, a23-2, a23-3and a23-4), respectively, in such a manner that orientations of electric fields in polarization directions of the antenna elements a2, i.e. (a2-1and a2-3) or (a2-2and a2-4), arranged on any two of the sides of the conductive board a1opposite to each other are substantially same as each other, wherein: each of the antenna elements a2comprises the feeding wire a23, the ground terminal a25separated from the conductive board and the split-ring conductor a22of a shape which is a ring but is partially cut by the split portion a21; and the feeding wire a23is electrically connected with the split-ring conductor a22and extends in a direction which traverses the region a24formed inside the split-ring conductor a22. As shown inFIG.23, the wording of “nearly rectangular shaped” includes a shape in which parts corresponding to mounting positions of the antenna elements a2are cut out, for example. For example, the board B1may comprise another layer as well as a layer provided with the conductive board a1. For example, the ground terminals a25-1of the antenna element a2-1may be one or more. Therefore, the terminals b1-1of the board B1which correspond to the ground terminals a25-1may be correspondingly one or more. Similar implementation can be made about the ground terminals a25-2, a25-3and a25-4of the antenna elements a2-2, a2-3and a2-4and about the terminals b1-2, b2-3and b2-4. For example, the board B1may comprise feeding conductive patterns b3each including the terminal b2. For example, the feeding conductive patterns b3may be provided in a layer same as a layer provided with the conductive board a1. For example, as shown inFIG.24, the feeding conductive pattern b3may be provided on a part of the board B1which faces the antenna element a2(including the region a24) a24when the antenna element a2is attached to the board B1. For example, as shown inFIG.25, the feeding conductive pattern b3may be provided on a part of the board B1other than a part which faces the antenna element a2(including the region a24) when the antenna a2is attached to the board B1. For example, a configuration such as circuit diagrams ofFIGS.15to17and their modifications may be formed in a layer of the board B1different from a layer provided with the feeding conductive pattern b3or may be formed in a layer of the board B1different from a layer provided with the feeding conductive pattern b3. For example, as shown inFIG.25, no conductor may exist on a part of the board B1which faces the antenna element a2(including the region a24) a24when the antenna elements a2is attached to the board B1. For example, as shown inFIG.26, a conductor b4may exist on a part of the board B1which faces the antenna element a2(including the region a24) a24when the antenna element a2is attached to the board B1, but the conductor b4may be electrically disconnected from the conductive board a1. For example, as shown inFIGS.27and28, the antenna element a2may be provided on a part of the board B1which faces the antenna element a2(including the region a24) a24, in advance when the antenna element a2is attached to the board B1. From the above, according to an aspect of the present disclosure, current corresponding to fed RF signals can flow through the antenna element a2, for example, by connecting the ground terminals a25to the terminals b1and by connecting the terminal of the feeding wire a23to the corresponding terminal b2as shown inFIGS.29to35. Therefore, according to an aspect of the present disclosure, for example, the antenna element a2can be distributed as a single component and can be flexibly combined in accordance with design requirements. Thus, according to an aspect of the present disclosure, for example, the antenna element a2device can be used as a component. From the above, according to an aspect of the present disclosure, a board for a compact dual-polarized antenna with a split-ring resonator can be provided, for example. For example, as shown inFIG.36, a board according to an aspect of the present disclosure, for example, the board B1or its modification, may be a board B2which is configured so that the distance L (L12, L23, L34or L41) between the centers01,02,03and04of two of the antenna elements a2, i.e. (a2-1and a2-2), (a2-2and a2-3), (a2-3and a2-4) or (a2-4and a2-1), which are arranged on any two of the sides of the conductive board a1adjacent to each other when the antenna elements a2(a2-1, a2-2, a2-3and a2-4) are attached to the respective sides of the conductive board a1, is one fifth of or less than vacuum wavelength of an electromagnetic wave at a resonant frequency of the antenna. From the above, according to an aspect of the present disclosure, a board for a more compact dual-polarized antenna with a split-ring resonator can be provided, for example. For example, a board according to an aspect of the present disclosure, for example, the board B1, B2or their modification, may be a board B3which is configured so that two of the antenna elements a2, i.e. (a2-1and a2-2), (a2-2and a2-3), (a2-3and a2-4) or (a2-4and a2-1), which are arranged on any two of the sides of the conductive board a1adjacent to each other when the antenna elements a2(a2-1, a2-2, a2-3and a2-4) are attached to the respective sides of the conductive board a1, are respectively fed with signals having a phase difference of 90 degrees. For example, this phase difference of 90 degrees may be implemented in a configuration such as the circuit diagram Q ofFIG.22and its modification. For example, a configuration such as the circuit diagram Q ofFIG.22and its modification may be formed in a layer of the board B1different from a layer provided with the feeding conductive pattern b3or may be formed in a layer of the board B1different from a layer provided with the feeding conductive pattern b3. From the above, according to an aspect of the present disclosure, a board for a compact, circularly polarized antenna with a split-ring resonator can be provided, for example. For example, a communication device according to an aspect of the present disclosure may comprise an antenna according to an aspect of the present disclosure, for example, the antenna A1, A2or A3or their modification. From the above, according to an aspect of the present disclosure, a communication device comprising a compact dual-polarized antenna with a split-ring resonator can be provided, for example. Although the present invention has been described above with reference to the embodiments, the present invention is not limited by the description described above. Various modifications, which can be understood by a skilled person in the art within the scope of the invention, can be applied to the configuration and details of the present invention. The present application is based on and claims priority to a Japanese patent application of JP2018-243860 filed on Dec. 27, 2018 before the Japan Patent Office, the content of which is entirely incorporated herein. REFERENCE SIGNS LIST A1, A2, A3: antennaa1: conductive boarda2(a2-1, a2-2, a2-3, a2-4): antenna elementa21(a21-1, a21-2, a21-3, a21-4): split portiona22(a22-1, a22-2, a22-3, a22-4): split-ring conductora23(a23-1, a23-2, a23-3, a23-4): feeding wirea24(a24-1, a24-2, a24-3, a24-4): regiona25(a25-1, a25-2, a25-3, a25-4): ground terminala31, a32: feeding pointa41, a42: phase shifterB1, B2, B3: boardb1(b1-1, b1-2, b1-3, b1-4): terminalb2(b2-1, b2-2, b2-3, b2-4): terminalb3(b3-1, b3-2, b3-3, b3-4): feeding conductive patternb4(b4-1, b4-2, b4-3, b4-4): conductor | 19,158 |
11862878 | DESCRIPTION OF EMBODIMENTS In the conventional technology, as a result of inserting a structure, the antenna configuration increases in size. The present disclosure is related to providing an antenna, an array antenna, a radio communication module, and a radio communication device of a new type. According to the present disclosure, an antenna, an array antenna, a radio communication module, and a radio communication device of a new type can be provided. A plurality of embodiments of the present disclosure are described below. In the drawings, identical constituent elements are referred to by the same reference numerals. As illustrated inFIGS.1and2, an antenna10includes a base20, a radiation conductor30, a ground conductor40, feeding lines50, and a circuit board60. The base20makes contact with the radiation conductor30, the ground conductor40, and the feeding lines50. The radiation conductor30, the ground conductor40, and the feeding lines50are configured to function as an antenna element11. The antenna10is configured to oscillate at a predetermined resonance frequency and to radiate electromagnetic waves. The base20can include either a ceramic material or a resin material as its composition. A ceramic material can include an aluminum-oxide-based sintered compact, an aluminum-nitride-based sintered compact, a mullite-based sintered compact, a glass ceramic sintered compact, a crystalized glass formed by depositing crystalline components in a glass matrix, and a microcrystalline sintered compact such as mica or aluminum titanate. A resin material can include epoxy resin, polyester resin, polyimide resin, polyamide-imide resin, polyetherimide resin, and a hardened form of an uncured material such as liquid crystal polymer. The radiation conductor30and the ground conductor40can include, in its composition, a metallic material, or a metallic alloy, or a hardened material of metallic paste, or a conductive polymer. The radiation conductor30and the ground conductor40can be made of the same material. Alternatively, the radiation conductor30and the ground conductor40can be made of different materials. Still alternatively, some combinations of the radiation conductor30and the ground conductor40can be made of the same material. The metallic material can include copper, silver, palladium, gold, platinum, aluminum, chromium, nickel, cadmium, lead, selenium, manganese, tin, vanadium, lithium, cobalt, and titanium. An alloy includes a plurality of metallic materials. A metallic paste can be a paste formed by kneading the powder of a metallic metal along with an organic solvent and a binder. The binder can include epoxy resin, polyester resin, polyimide resin, polyamide-imide resin, and polyetherimide resin. The conductive polymer can include polythiophene polymer, polyacetylene polymer, polyaniline polymer, and polypyrrole polymer. The radiation conductor30is configured to function as a resonator. The radiation conductor30can be configured as a resonator of the patch type. As an example, the radiation conductor30is positioned on top of the base20. As an example, the radiation conductor30is positioned at an end of the base20in the z direction. As an example, the radiation conductor30can be present within the base20. Some part of the radiation conductor30can be present within the base20and some part can be present outside the base20. Some surface of the radiation conductor30can face the outside of the base20. As an example according to a plurality of embodiments, the radiation conductor30extends in a first plane. The ends of the radiation conductor extend along a first direction and a second direction. In the present embodiment, the first direction (first axis) is treated as the y direction. In the present embodiment, a second direction (third axis) is treated as the x direction. In the present embodiment, the first direction is orthogonal to the second direction. However, in the present disclosure, the first direction need not be orthogonal to the second direction. In the present disclosure, the first direction only needs to intersect with the second direction. In the present embodiment, a third direction (second axis) is treated as the z direction. In the present embodiment, the third direction is orthogonal to the first direction and the second direction. However, in the present disclosure, the third direction need not be orthogonal to the first direction and the second direction. In the present disclosure, the third direction may intersect with the first direction and the second direction. In the present embodiment, the first plane is treated as the x-y plane. In the present embodiment, a second plane is treated as the y-z plane. In the present embodiment, a third plane is treated as the z-x plane. These planes are the planes present in the coordinate space, and do not indicate a specific plate or a specific surface. In the present disclosure, the surface integral in the x-y plane is sometimes called a first surface integral. In the present disclosure, the surface integral in the y-z plane is sometimes called a second surface integral. In the present disclosure, the surface integral in the z-x plane is sometimes called a third surface integral. The surface integral is measured in the unit of square meters. In the present disclosure, the length in the x direction is sometimes simply called the “length”. In the present disclosure, the length in the y direction is sometimes simply called the “width”. In the present disclosure, the length in the z direction is sometimes simply called the “height”. As illustrated inFIG.4, the radiation conductor30has a center O. The center O is the center of the radiation conductor30in the x and y directions. The radiation conductor30can include a first symmetrical axis S1that extends in the x-y plane. The first symmetrical axis S1passes through the center O and extends in the direction intersecting with the x and y directions. The first symmetrical axis S1can extend in the direction that is inclined by 45° from the positive direction of the y axis toward the negative direction of the x axis. The radiation conductor30can include a second symmetrical axis S2in the x-y plane. The second symmetrical axis S2passes through the center O and extends in a direction intersecting with the first symmetrical axis S1. The second symmetrical axis S2can extend in the direction inclined by 45° from the positive direction of the y axis toward the positive direction of the x axis. The radiation conductor30can be half the size of the operating wavelength. The operating wavelength represents the wavelength of electromagnetic waves in the operating frequency of the antenna10. The operating wavelength can be same as the wavelength of the resonance frequency of the antenna10. The operating wavelength can be different from the wavelength of the resonance frequency of the antenna10. For example, the lengths of the radiation conductor30in the x and y directions can be half of the operating wavelength. According to an example of a plurality of embodiments, the ground conductor40can be configured to function as the ground of the antenna element11. As an example according to a plurality of embodiments, the ground conductor40extends in the x-y plane. As illustrated inFIG.2, the ground conductor40faces the radiation conductor30in the z direction. The feeding lines50can be configured to supply electrical signals from the outside to the antenna element11. The feeding lines50can be configured to supply electrical signals from the antenna element11to the outside. The feeding lines50can be through-hole conductors or via conductors. As illustrated inFIG.1, the feeding lines50can include a first feeding line51, a second feeding line52, a third feeding line53, and a fourth feeding line54. Each of the first feeding line51, the second feeding line52, the third feeding line53, and the fourth feeding line54is configured to be electrically connected to the radiation conductor30. However, in the present disclosure, each of the first feeding line51to the fourth feeding line54only needs to be electromagnetically connected to the radiation conductor30. In the present disclosure, “electromagnetic connection” covers electric connection and magnetic connection. As illustrated inFIG.4, the points at which the first feeding line51, the second feeding line52, the third feeding line53, and the fourth feeding line54are connected to the radiation conductor30can be referred to as a feeding point51A, a feeding point52A, a feeding point53A, and a feeding point54A, respectively. The first feeding line51, the second feeding line52, the third feeding line53, and the fourth feeding line54make contact with the radiation conductor30at mutually different positions. As illustrated inFIG.2, the ground conductor40has a plurality of openings40aformed thereon. The first feeding line51, the second feeding line52, the third feeding line53, and the fourth feeding line54are communicated to the outside via the openings40aof the ground conductor40. The first feeding line51to the fourth feeding line54can extend along the z direction. The first feeding line51is configured to contribute at least to supply, to the outside, the electrical signals generated at the time of resonance of the radiation conductor30in the y direction. The second feeding line52is configured to contribute at least to supply, to the outside, the electrical signals generated at the time of resonance of the radiation conductor30in the x direction. The third feeding line53is configured to contribute at least to supply, to the outside, the electrical signals generated at the time of resonance of the radiation conductor30in the y direction. The fourth feeding line54is configured to contribute at least to supply, to the outside, the electrical signals generated at the time of resonance of the radiation conductor30in the x direction. The pair of the first feeding line51and the third feeding line53and the pair of the second feeding line52and the fourth feeding line54are configured to excite the radiation conductor30in different directions. For example, the first feeding line51and the third feeding line53are configured to excite the radiation conductor30in the y direction. The second feeding line52and the fourth feeding line54are configured to excite the radiation conductor30in the x direction. As a result of having the feeding lines50, the antenna10enables reducing the excitation of the radiation conductor30in one direction during the excitation of the radiation conductor30in another direction. The first feeding line51and the third feeding line53are configured to excite the radiation conductor30using a differential voltage. The second feeding line52and the fourth feeding line54are configured to excite the radiation conductor30using a differential voltage. As a result of exciting the radiation conductor30using differential voltages, the antenna10enables achieving reduction in the fluctuation of the electric potential center at the time of excitation of the radiation conductor30from the center O of the radiation conductor30. As illustrated inFIG.4, in the radiation conductor30, the position of the center O can be between the first feeding line51and the third feeding line53. Thus, when viewed from the center O of the radiation conductor30, the third feeding line53is positioned on the substantially opposite side of the first feeding line51in the y direction. A first distance d1between the first feeding line51and the center O is substantially equal to a third distance d3between the third feeding line53and the center O. As illustrated inFIG.4, in the radiation conductor30, the position of the center O can be between the second feeding line52and the fourth feeding line54. When viewed from the center O of the radiation conductor30, the fourth feeding line54is positioned on the substantially opposite side of the second feeding line52in the x direction. A second distance d2between the second feeding line52and the center O is substantially equal to a fourth distance d4between the fourth feeding line54and the center O. The second distance d2can be substantially equal to the first distance d1. The second distance d2can be different from the first distance d1. The first feeding line51and the second feeding line52can be symmetric across the first symmetrical axis S1. The third feeding line53and the fourth feeding line54can be symmetric across the first symmetrical axis S1. For example, the feeding points51A and52A can be axisymmetric with respect to the first symmetrical axis S1serving as the symmetrical axis. For example, the feeding points53A and54A can be axisymmetric with respect to the first symmetrical axis S1serving as the symmetrical axis. The first feeding line51and the fourth feeding line54can be symmetric across the second symmetrical axis S2. The second feeding line52and the third feeding line53can be symmetric across the second symmetrical axis S2. For example, the feeding points51A and54A can be axisymmetric with respect to the second symmetrical axis S2serving as the symmetrical axis. For example, the feeding points52A and53A can be axisymmetric with respect to the second symmetrical axis S2serving as the symmetrical axis. The direction connecting the first feeding line51and the third feeding line53is inclined with respect to the y direction. Because of the inclined arrangement of the first feeding line51and the third feeding line53with respect to the y direction, the first feeding line51and the third feeding line53become able to excite the radiation conductor30in the x direction too. The direction connecting the second feeding line52and the fourth feeding line54is inclined with respect to the x direction. Because of the inclined arrangement of the second feeding line52and the fourth feeding line54with respect to the x direction, the second feeding line52and the fourth feeding line54become able to excite the radiation conductor30in the y direction too. The pair of the first feeding line51and the third feeding line53and the pair of the second feeding line52and the fourth feeding line54enable excitation of the radiation conductor30in two excitation directions. In the antenna10, because of the excitation of the radiation conductor30in two excitation directions, the impedance components in the respective directions act on the feeding lines50. In the antenna10, by cancelling out the impedance components in the respective directions, the impedance at the time of input can be reduced. As a result of a decrease in the impedance at the time of input, isolation of two polarization directions can be enhanced in the antenna10. As illustrated inFIG.2, the circuit board60includes a ground conductor60A. As illustrated inFIG.3, the circuit board60includes a first feeding circuit61and a second feeding circuit62. The circuit board60can include either the first feeding circuit61or the second feeding circuit62. The ground conductor60A is made of any electroconductive material. The ground conductor60A can be made of the same material as the radiation conductor30and the ground conductor40, or can be made of a different material from that of the radiation conductor30and the ground conductor40. Some combination of the ground conductor60A, the radiation conductor30, and the ground conductor40can be made of the same material. The ground conductor60A can be connected to a ground conductor140. The ground conductor60A can be integrated with the ground conductor140. The first feeding circuit61is electrically connected to the first feeding line51and the third feeding line53. The first feeding circuit61is configured to supply reversed-phase signals, which have mutually opposite phases, to the first feeding line51and the third feeding line53. First feeding signals supplied to the first feeding line51are substantially opposite in phase to third feeding signals supplied to the third feeding line53. The first feeding circuit61includes a first inverting circuit63. Based on a single electrical signal input thereto, the first inverting circuit63is capable of outputting two electrical signals having mutually opposite phases. The first inverting circuit63can be a circuit for inverting the phase of a single input electrical signal in the resonance frequency band. The first inverting circuit63can be a circuit for outputting reversed-phase signals, which have substantially opposite phases to each other, from a single input electrical signal. The first inverting circuit63can be a balun, or a power divider circuit, or a delay line memory. The first inverting circuit63can include an inductance element connected to one of the first feeding line51and the third feeding line53, and can include a capacitance element connected to the other of the first feeding line51and the third feeding line53. The second feeding circuit62is configured to be electrically connected to the second feeding line52and the fourth feeding line54. The second feeding circuit62is configured to supply reversed-phase signals, which have mutually opposite phases, to the second feeding line52and the fourth feeding line54. Second feeding signals supplied to the second feeding line52are substantially opposite in phase to fourth feeding signals supplied to the fourth feeding line54. The second feeding circuit62includes a second inverting circuit64. Based on a single electrical signal input thereto, the second inverting circuit64is capable of outputting two electrical signals having mutually opposite phases. The second inverting circuit64can be a circuit for inverting the phase of a single input electrical signal in the resonance frequency band. The second inverting circuit64can be a circuit for outputting reversed-phase signals, which have substantially opposite phases to each other, from a single input electrical signal. The second inverting circuit64can be a balun, or a power divider circuit, or a delay line memory. The second inverting circuit64can include an inductance element connected to one of the second feeding line52and the fourth feeding line54, and can include a capacitance element connected to the other feeding line. In the antenna10, electrical signals of opposite phases are fed to the first feeding line51and the third feeding line53. In the antenna10, when the radiation conductor30resonates along the y direction, there is a decrease in the potential variation in the vicinity of the center O of the radiation conductor30. The antenna10is configured to resonate with the node in the vicinity of the center O. In the antenna10, electrical signals of opposite phases are fed to the second feeding line52and the fourth feeding line54. In the antenna10, when the radiation conductor30resonates along the y direction, there is a decrease in the potential variation in the vicinity of the center O of the radiation conductor30. FIG.5is a perspective view of an antenna110according to an embodiment.FIG.6is a cross-sectional view of the antenna110along L1-L1line illustrated inFIG.5.FIG.7is an exploded perspective view of a portion of the antenna110illustrated inFIG.5.FIG.8is a block diagram of the antenna110illustrated inFIG.5.FIG.9is a planar view for explaining a configuration of a radiation conductor130illustrated inFIG.5. As illustrated inFIGS.5and6, the antenna110includes a base120, the radiation conductor130, the ground conductor140, first connecting conductors155, second connecting conductors156, third connecting conductors157, and fourth connecting conductors158. The antenna110includes feeding lines150and a circuit board160. The radiation conductor130, the ground conductor140, and the feeding lines150function as an antenna element111. The feeding lines150include a first feeding line151, a second feeding line152, a third feeding line153, and a fourth feeding line154. The numbers of the first connecting conductors155to the fourth connecting conductors158included in the antenna110illustrated inFIG.5are each two. However, the numbers of the first connecting conductor155to the fourth connecting conductor158included in the antenna110may be each one or three or more. The antenna element111is configured to oscillate at a predetermined resonance frequency. As a result of oscillation of the antenna element111at a predetermined resonance frequency, the antenna110can be configured to radiate electromagnetic waves. As the operating frequency thereof, the antenna110can use at least one of one or more resonance frequency bands of the antenna element111. The antenna110can radiate electromagnetic waves of the operating frequency. The wavelength of the operating frequency can be the operating wavelength that represents the wavelength of the electromagnetic waves in the operating frequency of the antenna110. As explained later, the antenna element111exhibits an artificial magnetic conductor character with respect to the electromagnetic waves of a predetermined frequency that are incident from the positive direction of the z axis on a surface substantially parallel to the x-y plane of the antenna element111. In the present disclosure, the artificial magnetic conductor character implies the characteristics of a surface that has zero phase difference between the incident waves and the reflected waves in the operating frequency. A surface exhibiting the artificial magnetic conductor character has the phase difference between the incident waves and the reflected waves to be in the range from −90° to +90° in the operating frequency band. The operating frequency band includes the resonance frequency and the operating frequency that exhibit the artificial magnetic conductor character. Since the antenna element111exhibits the artificial magnetic conductor character, as illustrated inFIG.5, even when a ground conductor165(described later) of the circuit board160is positioned on the side of the negative direction of the z axis of the antenna110, the radiation efficiency of the antenna110can be maintained. The base120is made of the same material or a similar material as the base20illustrated inFIG.1. The base120makes contact with the radiation conductor130, the ground conductor140, and the feeding lines150. The base120can have the shape corresponding to the shape of the radiation conductor130. The base120can have the shape of a substantially square prism. The base120has a top surface121and an under surface122. The top surface121and the under surface122can be the top surface and the bottom surface, respectively, of the base120having the shape of a substantially square prism. The top surface121and the under surface122can be substantially parallel to the x-y plane. The top surface121and the under surface122can be substantially square in shape. In the top surface121and the under surface122that are substantially square in shape, one of the two diagonal lines runs along the x direction, while the other diagonal line runs along the y direction. As compared to the under surface122, the top surface121is positioned more on the side of the positive direction of the z axis. The radiation conductor130is configured to function as a resonator. The radiation conductor130is made of the same material or a similar material as the radiation conductor30illustrated inFIG.1. As illustrated inFIG.6, the radiation conductor130can be positioned on the top surface121of the base120. The radiation conductor130extends along the x-y plane. The radiation conductor130is configured to capacitively connect the connecting conductors from the first connecting conductor155to the fourth connecting conductor158. In the x-y plane, the radiation conductor130is surrounded by the first connecting conductor155to the fourth connecting conductor158. The radiation conductor130can be configured to resonate in the y direction when, for example, mutually reversed-phased electrical signals are supplied from the first feeding line151and the third feeding line153. When the radiation conductor130resonates in the y direction; from the radiation conductor130, the first connecting conductor155is seen as an electrical conductor positioned on the side of the negative direction of the y axis, and the third connecting conductor157is seen as an electrical conductor positioned on the side of the positive direction of the y axis. When the radiation conductor130resonates in the y direction; from the radiation conductor130, the side in the positive direction the x axis is seen as magnetic conductor, and the side in the negative direction of the x axis is seen as magnetic conductor. When the radiation conductor130resonates in the y direction, the radiation conductor130is surrounded by two electrical conductors and two magnetic conductors. Hence, the antenna110can be configured to exhibit the artificial magnetic conductor character with respect to the electromagnetic waves of a predetermined frequency that are incident from the positive direction of the z axis on the x-y plane included in the antenna110. The radiation conductor130can be configured to resonate in the x direction when, for example, mutually reversed-phased electrical signals are supplied from the second feeding line152and the fourth feeding line154. When the radiation conductor130resonates in the x direction; from the radiation conductor130, the second connecting conductor156is seen as an electrical conductor positioned on the side of the positive direction of the x axis, and the fourth connecting conductor158is seen as an electrical conductor positioned on the side of the negative direction of the x axis. When the radiation conductor130resonates in the x direction; from the radiation conductor130, the side on the positive direction of the y axis is seen as magnetic conductor, and the negative direction of the y axis is seen as magnetic conductor. When the radiation conductor130resonates in the x direction, the radiation conductor130is surrounded by two electrical conductors and two magnetic conductors. Hence, the antenna110can be configured to exhibit the artificial magnetic conductor character with respect to the electromagnetic waves of a predetermined frequency that are incident from the positive direction of the z axis on the x-y plane included in the antenna110. As illustrated inFIG.9, the radiation conductor130has a center O1. The center O1is the center of the radiation conductor130in the x and y directions. The radiation conductor130can include a first symmetrical axis T1that extends along the x-y plane. The first symmetrical axis T1passes through the center O1and extends in the direction intersecting with the x and y directions. The first symmetrical axis T1can extend in the direction inclined by 45° from the positive direction of the y axis toward the negative direction of the x axis. The radiation conductor130can be half the size of the operating wavelength. For example, of the radiation conductor130, the lengths in the x and y directions can be half of the operating wavelength. As illustrated inFIG.7, the radiation conductor130includes a first conductor131, a second conductor132, a third conductor133, and a fourth conductor134. The radiation conductor130can further include an internal conductor135. The first conductor131to the fourth conductor134, the internal conductor135, the ground conductor140, the first feeding line151to the fourth feeding line154, and the first connecting conductor155to the fourth connecting conductor158can all be made of either the same material or different materials. Some combination of the first conductor131to the fourth conductor134, the internal conductor135, the ground conductor140, the first feeding line151to the fourth feeding line154, and the first connecting conductor155to the fourth connecting conductor158can be made of the same material. The first conductor131to the fourth conductor134can have the same shape, such as a substantially square shape. The two diagonal lines of the substantially square first conductor131and the two diagonal lines of the substantially square third conductor133run along the x and y directions. The length of that diagonal line of the first conductor131which runs along the y direction and the length of that diagonal line of the third conductor133which runs along the y direction can be about one-fourth of the operating wavelength. The two diagonal lines of the substantially square second conductor132and the two diagonal lines of the substantially square fourth conductor134run along the x and y directions. The length of that diagonal line of the second conductor132which runs along the x direction and the length of that diagonal line of the fourth conductor134which runs along the x direction can be about one-fourth of the operating wavelength. At least some part of each of the first conductor131to the fourth conductor134can be exposed to the outside of the base120. Some part of each of the first conductor131to the fourth conductor134can be positioned within the base120. Each of the first conductor131to the fourth conductor134can be entirely positioned within the base120. The first conductor131to the fourth conductor134extend along the top surface121of the base120. As an example, the first conductor131to the fourth conductor134can be arranged in form of a square lattice on the top surface121. In that case, the pair of the first conductor131and the fourth conductor134as well as the pair of the second conductor132and the third conductor133can be arranged along the first diagonal axis T1. The pair of the first conductor131and the second conductor132as well as the pair of the fourth conductor134and the third conductor133can be arranged along the second diagonal axis T2. In the square lattice in which the first conductor131to the fourth conductor134are arranged, the two diagonal directions run along the x and y directions. Of those two diagonal directions, the diagonal direction running along the y direction is referred to as a first diagonal direction. Of those two diagonal direction, the diagonal direction running along the x direction is referred to as a second diagonal direction. The first diagonal direction and the second diagonal direction can intersect at the center O1. The first conductor131to the fourth conductor134are positioned away from each other with predetermined spacing maintained therebetween. For example, as illustrated inFIG.5, the first conductor131and the second conductor132are positioned away from each other with a spacing t1maintained therebetween. The third conductor133and the fourth conductor134are positioned away from each other with the spacing t1maintained therebetween. The first conductor131and the fourth conductor134are positioned away from each other with a spacing t2maintained therebetween. The second conductor132and the third conductor133are positioned away from each other with the spacing t2maintained therebetween. By positioning the first conductor131to the fourth conductor134away from each other with predetermined spacing maintained therebetween, they are configured to be capacitively connected to each other. As illustrated inFIG.7, the internal conductor135faces the first conductor131to the fourth conductor134in the z direction. As compared to the first conductor131to the fourth conductor134, the internal conductor135is positioned more in the negative direction of the z axis. As illustrated inFIG.6, the internal conductor135can be positioned within the base120. However, when each of the first conductor131to the fourth conductor134is entirely positioned within the base120, the internal conductor135can be positioned more in the positive direction of the z axis as compared to the first conductor131to the fourth conductor134. In that case, at least some part of the internal conductor135can be exposed from the top surface121of the base120. The internal conductor135is configured to be capacitively connected to each of the first conductor131to the fourth conductor134. For example, some part of the base120can be present between the internal conductor135and the first conductor131to the fourth conductor134. Because of the presence of some part of the base120between the internal conductor135and the first conductor131to the fourth conductor134, the internal conductor135can be configured to be capacitively connected to each of the first conductor131to the fourth conductor134. The surface integral in the x-y plane of the internal conductor135can be appropriately adjusted by taking into account the desired capacitive coupling strength between the internal conductor135and the first conductor131to the fourth conductor134. The distances between the internal conductor135and the first conductor131to the fourth conductor134in the z direction can be appropriately adjusted by taking into account the desired capacitive coupling strength between the internal conductor135and the first conductor131to the fourth conductor134. The internal conductor135can be substantially parallel to the x-y plane. The internal conductor135can be substantially square in shape. The center of the substantially square internal conductor135can substantially coincide with the center O1in the first conductor131to the fourth conductor134. Of the two diagonal lines of the substantially square internal conductor135, one diagonal line can run along the first diagonal direction and the other diagonal line can run along the second diagonal direction. The ground conductor140is made of the same material or a similar material as the ground conductor40illustrated inFIG.2. The ground conductor140is configured to function as the ground conductor of the antenna element111. As illustrated inFIG.6, the ground conductor140can be configured to be connected to the ground conductor165(described later) of the circuit board160. In that case, the ground conductor140can be integrated with the ground conductor165of the circuit board160. The ground conductor140can be a plate conductor. The ground conductor140is positioned on the under surface122of the base120. As illustrated inFIG.7, the ground conductor140extends along the x-y plane. In the z direction, the ground conductor140faces the radiation conductor130. The base120is present between the ground conductor140and the radiation conductor130. The ground conductor140can have the shape corresponding to the shape of the radiation conductor130. In the present embodiment, the ground conductor140is substantially square in shape corresponding to the substantially square shape of the radiation conductor130. However, the ground conductor140can have an arbitrary shape according to the radiation conductor130. The ground conductor140has openings141,142,143, and144formed thereon. The positions of the openings141to144on the x-y plane can be appropriately adjusted according to the positions of the first feeding line151to the fourth feeding line154, respectively, in the x-y plane. The feeding lines150are made of the same material or a similar material as the feeding lines50illustrated inFIG.1. The feeding lines150can be through-hole conductors or via conductors. The feeding lines150are configured to be able to supply electrical signals from the antenna element111to the circuit board160present on the outside. The first feeding line151to the fourth feeding line154make contact with the radiation conductor130at mutually different positions. For example, as illustrated inFIG.5, the first feeding line151is configured to be electrically connected to the first conductor131. The second feeding line152is configured to be electrically connected to the second conductor132. The third feeding line153is configured to be electrically connected to the third conductor133. The fourth feeding line154is configured to be electrically connected to the fourth conductor134. However, the first feeding line151to the fourth feeding line154can be configured to be magnetically connected to the first conductor131to the fourth conductor134, respectively. The points at which the first feeding line151to the fourth feeding line154are connected to the first conductor131to the fourth conductor134, respectively, can be referred to as a feeding point151A, a feeding point152A, a feeding point153A, and a feeding point154A, respectively. As illustrated inFIG.6, the first feeding line151to the fourth feeding line154are communicated to the outside via the openings141to144, respectively, of the ground conductor140. The first feeding line151to the fourth feeding line154can extend along the z direction. The first feeding line151and the third feeding line153are configured to at least contribute in supplying, to the outside, the electrical signals generated at the time of resonance of the radiation conductor130in the y direction. The second feeding line152and the fourth feeding line154are configured to at least contribute in supplying, to the outside, the electrical signals generated at the time of resonance of the radiation conductor130in the x direction. The pair of the first feeding line151and the third feeding line153and the pair of the second feeding line152and the fourth feeding line154are configured to excite the radiation conductor130in different directions. For example, the first feeding line151and the third feeding line153are configured to excite the radiation conductor130in the y direction. The second feeding line152and the fourth feeding line154are configured to excite the radiation conductor130in the x direction. As a result of having the feeding lines150, the antenna110enables achieving reduction in the occurrence of a situation in which, at the time of exciting the radiation conductor130in one direction, it gets excited in another direction. The first feeding line151and the third feeding line153are configured to excite the radiation conductor130using a differential voltage. The second feeding line152and the fourth feeding line154are configured to excite the radiation conductor130using a differential voltage. As a result of exciting the radiation conductor130using differential voltages, the antenna110enables achieving reduction in the fluctuation of the electric potential center at the time of excitation of the radiation conductor130from the center O of the radiation conductor130. As illustrated inFIG.9, in the y direction, the center O1of the radiation conductor130is positioned between the first feeding line151and the third feeding line153. A first distance D1between the first feeding line151and the center O1is substantially equal to a third distance D3between the third feeding line153and the center O1. As illustrated inFIG.9, in the x direction, the center O1of the radiation conductor130is positioned between the second feeding line152and the fourth feeding line154. A second distance D2between the second feeding line152and the center O1is substantially equal to a fourth distance D4between the fourth feeding line154and the center O1. In the present embodiment, the second distance D2is substantially equal to the first distance D1. However, the second distance D2can be different from the first distance D1. The first feeding line151and the second feeding line152can be symmetric across the first symmetrical axis T1. The third feeding line153and the fourth feeding line154can be symmetric across the first symmetrical axis T1. For example, the feeding points151A and152A as well as the feeding points153A and154A can be axisymmetric with respect to the first symmetrical axis T1. The first feeding line151and the fourth feeding line154can be symmetric across the second symmetrical axis T2. The second feeding line152and the third feeding line153can be symmetric across the second symmetrical axis T2. For example, the feeding points151A and154A as well as the feeding points152A and153A can be axisymmetric with respect to the second symmetrical axis T2. The direction connecting the first feeding line151and the third feeding line153runs along the y direction. The direction connecting the first feeding line151and the third feeding line153runs along the first diagonal direction. The direction connecting the second feeding line152and the fourth feeding line154runs along the x direction. The direction connecting the second feeding line152and the fourth feeding line154runs along the second diagonal direction. However, as explained later with reference toFIG.15, the direction connecting the first feeding line151and the third feeding line153can be inclined with respect to the first diagonal direction. The direction connecting the second feeding line152and the fourth feeding line154can be inclined with respect to the second diagonal direction. As illustrated inFIG.8, the circuit board160includes a first feeding circuit61A and a second feeding circuit62A. As illustrated inFIG.6, the circuit board160includes the ground conductor165. The first feeding circuit61A is configured to be electrically connected to the first feeding line151and the third feeding line153. The first feeding circuit61A includes the first inverting circuit63, first wiring161, and third wiring163. In the present embodiment, the first inverting circuit63can include an inductance element connected to one of the first feeding line151and the third feeding line153, and can include a capacitance element connected to the other feeding line. The first feeding circuit61A is configured to supply reversed-phase signals, which have substantially opposite phases to each other, to the first feeding line151and the third feeding line153. In the antenna110, electrical signals having opposite phases are supplied to the first feeding line151and the third feeding line153. In the antenna110, when the radiation conductor130resonates along the y direction, there is a decrease in the potential variation of the first conductor131to the fourth conductor134in the vicinity of the center O1. When the radiation conductor130resonates along the y direction, the antenna110is configured to resonate with a node in the vicinity of the center O1. The second feeding circuit62A is configured to be electrically connected to the second feeding line152and the fourth feeding line154. The second feeding circuit62A includes the second inverting circuit64, second wiring162, and fourth wiring164. In the present embodiment, the second inverting circuit64can include an inductance element connected to one of the second feeding line152and the fourth feeding line154, and can include a capacitance element connected to the other feeding line. The second feeding circuit62A is configured to supply reversed-phase signals, which have substantially opposite phases to each other, to the second feeding line152and the fourth feeding line154. In the antenna110, electrical signals having opposite phases are supplied to the second feeding line152and the fourth feeding line154. In the antenna110, when the radiation conductor130resonates along the x direction, there is a decrease in the potential variation of the first conductor131to the fourth conductor134in the vicinity of the center O1. When the radiation conductor130resonates along the x direction, the antenna110is configured to resonate with a node in the vicinity of the center O1. The first wiring161to the fourth wiring164are made of an arbitrary electroconductive material. As described later, the first wiring161to the fourth wiring164are formed as wiring patterns. As illustrated inFIG.8, the first wiring161is configured to electrically connect the first inverting circuit63and the first feeding line151. The second wiring162is configured to electrically connect the second inverting circuit64and the second feeding line152. The third wiring163is configured to electrically connect the first inverting circuit63and the third feeding line153. The fourth wiring164is configured to electrically connect the second inverting circuit64and the fourth feeding line154. The wiring length and the width of the first wiring161can be substantially equal to the wiring length and the width of the third wiring163. When the wiring length and the width of the first wiring161is substantially equal to the wiring length and the width of the third wiring163, then the impedance of the first wiring161can become substantially equal to the impedance of the third wiring163. The wiring length and the width of the second wiring162can be substantially equal to the wiring length and the width of the fourth wiring164. When the wiring length and the width of the second wiring162is substantially equal to the wiring length and the width of the fourth wiring164, then the impedance of the second wiring162can become substantially equal to the impedance of the fourth wiring164. The ground conductor165can be made of an arbitrary electroconductive material. The ground conductor165can represent a conductor layer. Of the two surfaces of the circuit board160that are substantially parallel to the x-y plane, the surface positioned on the side of the positive direction of the z axis has the ground conductor165installed thereon. FIG.10is a perspective view of an antenna210according to an embodiment.FIG.11is an exploded perspective view of a portion of the antenna210illustrated inFIG.10. The following explanation is given about the major differences between the antenna210illustrated inFIG.10and the antenna110illustrated inFIG.5. As illustrated inFIGS.10and11, the antenna210includes the base120, a radiation conductor230, the ground conductor140, and the first connecting conductor155to the fourth connecting conductor158. The antenna210includes the first feeding line151, the second feeding line152, the third feeding line153, the fourth feeding line154, and the circuit board160. The radiation conductor230, the ground conductor140, the first connecting conductor155to the fourth connecting conductor158, and the feeding lines150are configured to function as an antenna element211. As illustrated inFIG.11, the radiation conductor230includes the first conductor131to the fourth conductor134and an internal conductor235. The internal conductor235can be made of the same material or a similar material as the internal conductor135illustrated inFIG.7. The internal conductor235includes a first branch portion235a, a second branch portion235b, a first internal conductor236, a second internal conductor237, a third internal conductor238, and a fourth internal conductor239. The first branch portion235a, the second branch portion235b, the first internal conductor236, the second internal conductor237, the third internal conductor238, and the fourth internal conductor239can all be made of either the same material or different materials. Some combination of the first branch portion235a, the second branch portion235b, the first internal conductor236, the second internal conductor237, the third internal conductor238, and the fourth internal conductor239can be made of the same material. The first internal conductor236faces the first conductor131in the z direction. The first internal conductor236is positioned away from the first conductor131in the z direction. In the x-y plane, the entire first internal conductor236can overlap with the first conductor131. The surface integral in the x-y plane of the first internal conductor236can be smaller than the surface integral in the x-y plane of the first conductor131. Since some part of the base120is present between the first internal conductor236and the first conductor131, the first internal conductor236is configured to be capacitively connected to the first conductor131. The position of the first internal conductor236in the x-y plane can be appropriately adjusted according to the position of the first conductor131in the x-y plane. The second internal conductor237faces the second conductor132in the z direction. The second internal conductor237is positioned away from the second conductor132in the z direction. In the x-y plane, the entire second internal conductor237can overlap with the second conductor132. The surface integral in the x-y plane of the second internal conductor237can be smaller than the surface integral in the x-y plane of the second conductor132. Since some part of the base120is present between the second internal conductor237and the second conductor132, the second internal conductor237is configured to be capacitively connected to the second conductor132. The position of the second internal conductor237in the x-y plane can be appropriately adjusted according to the position of the second conductor132in the x-y plane. The third internal conductor238faces the third conductor133in the z direction. The third internal conductor238is positioned away from the third conductor133in the z direction. In the x-y plane, the entire third internal conductor238can overlap with the third conductor133. The surface integral in the x-y plane of the third internal conductor238can be smaller than the surface integral in the x-y plane of the third conductor133. Since some part of the base120is present between the third internal conductor238and the third conductor133, the third internal conductor238is configured to be capacitively connected to the third conductor133. The position of the third internal conductor238in the x-y plane can be appropriately adjusted according to the position of the third conductor133in the x-y plane. The fourth internal conductor239faces the fourth conductor134in the z direction. The fourth internal conductor239is positioned away from the fourth conductor134in the z direction. In the x-y plane, the entire fourth internal conductor239can overlap with the fourth conductor134. The surface integral in the x-y plane of the fourth internal conductor239can be smaller than the surface integral in the x-y plane of the fourth conductor134. Since some part of the base120is present between the fourth internal conductor239and the fourth conductor134, the fourth internal conductor239is configured to be capacitively connected to the fourth conductor134. The position of the fourth internal conductor239in the x-y plane can be appropriately adjusted according to the position of the fourth conductor134in the x-y plane. Each of the first internal conductor236to the fourth internal conductor239can have the shape of a flat plate. Each of the first internal conductor236to the fourth internal conductor239can be substantially square in shape. However, the first internal conductor236to the fourth internal conductor239are not limited to have a square shape. For example, the first internal conductor236to the fourth internal conductor239can be circular or elliptical in shape. The first internal conductor236to the fourth internal conductor239can all have either the same shape or different shapes. The first branch portion235ais configured to electrically connect the first internal conductor236and the third internal conductor238. One end of the first branch portion235ais configured to be electrically connected to one of the four corners of the first internal conductor236. The other end of the first branch portion235ais configured to be electrically connected to one of the four corners of the third internal conductor238. The first branch portion235acan extend along the direction connecting the first feeding line151and the third feeding line153. The first branch portion235acan extend along the y direction. The width of the first branch portion235ain the x direction can be thin enough to be able to maintain the mechanical connection or the electrical connection between the first internal conductor236and the third internal conductor238. The second branch portion235bis configured to electrically connect the second internal conductor237and the fourth internal conductor239. One end of the second branch portion235bis configured to be electrically connected to one of the four corners of the second internal conductor237. The other end of the second branch portion235bis configured to be electrically connected to one of the four corners of the fourth internal conductor239. The second branch portion235bcan extend along the direction connecting the second feeding line152and the fourth feeding line154. The second branch portion235bcan extend along the x direction. The width of the second branch portion235bin the y direction can be thin enough to be able to maintain the mechanical connection or the electrical connection between the second internal conductor237and the fourth internal conductor239. The first branch portion235aand the second branch portion235bcan intersect with each other in the vicinity of the center O1of the radiation conductor230. The first branch portion235aand the second branch portion235bcan have some common part in the vicinity of the center O1. The width of the first branch portion235ain the x direction can be either same as or different from the width of the second branch portion235bin the y direction. In the internal conductor235, the capacitive coupling of the first internal conductor236to the fourth internal conductor239with the first conductor131to the fourth conductor134, respectively, can be greater than the capacitive coupling of the first branch portion235aand the second branch portion235bwith the first conductor131to the fourth conductor134. In the capacitive coupling of the internal conductor235with the first conductor131to the fourth conductor134, the capacitive coupling of the first internal conductor236to the fourth internal conductor239with the first conductor131to the fourth conductor134, respectively, can be dominant. For example, in the assembly process of the antenna210, the positions of the first conductor131to the fourth conductor134in the x-y plane may be misaligned from the position of the internal conductor235in the x-y plane. Even if such misalignment occurs, there can be a decrease in the amount of misalignment of the first internal conductor236to the fourth internal conductor239with respect to the first conductor131to the fourth conductor134, respectively. The decrease in that amount of misalignment enables achieving reduction in the probability that the capacitive coupling of the internal conductor235with the first conductor131to the fourth conductor134deviates from the design value. With such a configuration, in the antenna210, the variability in the capacitive coupling of the internal conductor235with the first conductor131to the fourth conductor134can be reduced. FIG.12is a perspective view of an antenna310according to an embodiment.FIG.13is an exploded perspective view of a portion of a circuit board360illustrated inFIG.12.FIG.14is a cross-sectional view of the circuit board360along L2-L2line illustrated inFIG.13.FIG.15is a planar view for explaining a configuration of a radiation conductor330illustrated inFIG.12. The following explanation is given about the major differences between the antenna310illustrated inFIG.12and the antenna110illustrated inFIG.5. As illustrated inFIGS.12and14, the antenna310includes the base120, the radiation conductor330, the ground conductor140, and the first connecting conductor155to the fourth connecting conductor158. As illustrated inFIG.13, the antenna310includes the first feeding line151, the second feeding line152, the third feeding line153, the fourth feeding line154, and the circuit board360(a multi-layer wiring substrate). The radiation conductor330, the ground conductor140, the first connecting conductor155to the fourth connecting conductor158, and the feeding lines150are configured to function as an antenna element311. As illustrated inFIG.12, the radiation conductor330includes the first conductor131, the second conductor132, the third conductor133, and the fourth conductor134. As illustrated inFIG.15, the radiation conductor330includes the internal conductor135. However, in place of including the internal conductor135, the radiation conductor330can include the internal conductor235illustrated inFIG.11. As illustrated inFIG.15, in the same manner as or in a similar manner to the configuration illustrated inFIG.9, the first conductor131to the fourth conductor134are arranged in form of a square lattice on the top surface121. However, in the configuration illustrated inFIG.15, in the square lattice in which the first conductor131to the fourth conductor134are arranged, the first diagonal direction is inclined with respect to the y direction. As a result of being inclined with respect to the y direction, the first diagonal direction can be inclined with respect to the direction connecting the first feeding line151and the third feeding line153, e.g., with respect to the y direction. Since the direction connecting the first feeding line151and the third feeding line153is inclined with respect to the first diagonal direction, the first feeding line151and the third feeding line153can excite the radiation conductor330in the x direction too. In the configuration illustrated inFIG.15, in the square lattice in which the first conductor131to the fourth conductor134are arranged, the second diagonal direction is inclined with respect to the x direction. As a result of being inclined with respect to the x direction, the second diagonal direction can be inclined with respect to the direction connecting the second feeding line152and the fourth feeding line154, e.g., with respect to the x direction. Since the direction connecting the second feeding line152and the fourth feeding line154is inclined with respect to the second diagonal direction, the second feeding line152and the fourth feeding line154can excite the radiation conductor330in the y direction too. The pair of the first feeding line151and the third feeding line153and the pair of the second feeding line152and the fourth feeding line154enable excitation of the radiation conductor330in two excitation directions. In the antenna10, because of the excitation of the radiation conductor30in two excitation directions, the impedance component in each direction acts on the feeding lines150. In the antenna310, by cancelling out the impedance component in each direction, the impedance at the time of input can be reduced. As a result of a decrease in the impedance at the time of input, isolation in two polarization directions can be enhanced in the antenna310. The angle of inclination of the first diagonal direction with respect to the y direction and the angle of inclination of the second diagonal direction with respect to the x direction can be appropriately adjusted by taking into account the desired gain of the antenna310. As illustrated inFIG.15, of the two diagonal lines of the internal conductor135having a substantially square shape, one diagonal line can run along the first diagonal direction. Of the two diagonal lines of the internal conductor135having a substantially square shape, one diagonal line can be inclined with respect to the y direction in the same manner as or in a similar manner to the first diagonal direction. Of the two diagonal lines of the internal conductor135having a substantially square shape, the other diagonal line can run along the second diagonal direction. Of the two diagonal lines of the internal conductor135having a substantially square shape, the other diagonal line can be inclined with respect to the x direction in the same manner as or in a similar manner to the second diagonal direction. As illustrated inFIG.14, the circuit board360has a structure in which the layers are laminated along the z direction. The lamination direction of the circuit board360can correspond to the z direction. Among the layers of the circuit board360, the layer positioned on the opposite side of the antenna310is called the bottom layer. Among the layers of the circuit board360, the layer positioned on the side of the antenna310is called the top layer. As illustrated inFIG.12, the circuit board360includes a first feeding circuit61B and a second feeding circuit62B. The first feeding circuit61B includes a first inverting circuit63A. The second feeding circuit62B includes a second inverting circuit64A. The first inverting circuit63A and the second inverting circuit64A are baluns. As illustrated inFIG.15, the first inverting circuit63A can be positioned away from the center O1of the radiation conductor330along the x direction. The distance from the center O1of the radiation conductor330to the first inverting circuit63A is referred to as a distance D5. The second inverting circuit64A can be positioned away from the center O1of the radiation conductor330along the y direction. The distance from the center O1of the radiation conductor330to the second inverting circuit64A is referred to as a distance D6. As described later, the distance D5can be different from the distance D6. As illustrated inFIG.13, the circuit board360includes a first wiring pattern361and a dielectric layer361A; a second wiring pattern362and a dielectric layer362A; a third wiring pattern363and a dielectric layer363A; and a fourth wiring pattern364and a dielectric layer364A. As illustrated inFIG.14, the circuit board360includes a ground conductor layer365, conductor layers366and367, a first layer368, and a second layer369. The first wiring pattern361to the fourth wiring pattern364can be same as the first wiring161to the fourth wiring164, respectively, illustrated inFIG.8. The first wiring pattern361is configured to electrically connect the first inverting circuit63A and the first feeding line151. The second wiring pattern362is configured to electrically connect the second inverting circuit64A and the second feeding line152. The third wiring pattern363is configured to electrically connect the first inverting circuit63A and the third feeding line153. The fourth wiring pattern364is configured to electrically connect the second inverting circuit64A and the fourth feeding line154. The points at which the first feeding line151to the fourth feeding line154are connected to the first wiring pattern361to the fourth wiring pattern364, respectively, are referred to as connecting points151B,152B,153B, and154B, respectively. The first wiring pattern361and the third wiring pattern363are positioned in the first layer368illustrated inFIG.14. Within the first layer368, the first wiring pattern361and the third wiring pattern363can extend along the x-y plane. As illustrated inFIG.15, the first wiring pattern361and the third wiring pattern363can be axisymmetric with respect to the symmetrical axis along the direction connecting the center O1of the radiation conductor330and the first inverting circuit63A. Because of the axisymmetric nature of the first wiring pattern361and the third wiring pattern363, the width and the wiring length of the first wiring pattern361can be equal to the width and the wiring length of the third wiring pattern363. The wiring lengths of the first wiring pattern361and the third wiring pattern363can increase and decrease in proportion to the distance D5illustrated inFIG.15. The second wiring pattern362and the fourth wiring pattern364are positioned in the second layer369illustrated inFIG.14. Within the second layer369, the second wiring pattern362and the fourth wiring pattern364can extend along the x-y plane. As illustrated inFIG.15, the second wiring pattern362and the fourth wiring pattern364can be axisymmetric with respect to the symmetrical axis along the direction connecting the center O1of the radiation conductor330and the second inverting circuit64A. Because of the axisymmetric nature of the second wiring pattern362and the fourth wiring pattern364, the width and the wiring length of the second wiring pattern362can be equal to the width and the wiring length of the fourth wiring pattern364. The wiring lengths of the second wiring pattern362and the fourth wiring pattern364can increase and decrease in proportion to the distance D6illustrated inFIG.15. The wiring lengths of the first wiring pattern361and the third wiring pattern363either can be substantially equal to or can be different from the wiring lengths of the second wiring pattern362and the fourth wiring pattern364. If the distances D5and D6illustrated inFIG.15are different, then the wiring lengths of the first wiring pattern361and the third wiring pattern363can be different from the wiring lengths of the second wiring pattern362and the fourth wiring pattern364. In the present embodiment, by appropriately adjusting the distances D5and D6, the relationship of the wiring lengths of the first wiring pattern361and the third wiring pattern363with the wiring lengths of the second wiring pattern362and the fourth wiring pattern364can be adjusted. The dielectric layers361A to364A are made of an arbitrary electroconductive material. The dielectric layers361A to364A surround the first wiring pattern361to the fourth wiring pattern364, respectively. The dielectric layers361A to364A can have the shapes dependent on the shapes of the first wiring pattern361to the fourth wiring pattern364, respectively. In the same manner as or in a similar manner to the first wiring pattern361and the third wiring pattern363, the dielectric layers361A and363A are positioned in the first layer368. In the same manner as or in a similar manner to the second wiring pattern362and the fourth wiring pattern364, the dielectric layers362A and364A are positioned in the second layer369. The ground conductor layer365can be made of the same or similar material as the ground conductor165illustrated inFIG.6. The ground conductor layer365can extend along the x-y plane. The ground conductor layer365can be the topmost layer of the circuit board360. The ground conductor layer365faces the ground conductor140of the antenna310. The ground conductor layer365can be integrated with the ground conductor140of the antenna310. The conductor layers366and367can be made of the same or similar material as the ground conductor165illustrated inFIG.6. The conductor layer366is the lower layer of the first layer368. The conductor layer367is positioned between the first layer368and the second layer369. The conductor layers366and367can extend along the x-y plane. The conductor layers366and367can be configured to be electrically connected to the ground conductor layer365through via holes. The conductor layers366and367are configured to shield the first wiring pattern361and the third wiring pattern363in the z direction. The conductor layer367and the ground conductor layer365are configured to shield the second wiring pattern362and the fourth wiring pattern364in the z direction. The first layer368is a lower layer than the second layer369. In the lamination direction of the circuit board360, for example, in the z direction; the first layer368is positioned farther from the radiation conductor330than the second layer369. The first layer368includes the first wiring pattern361and the dielectric layer361A; the third wiring pattern363and the dielectric layer363A; and a conductor layer368A. The conductor layer368A can be made of the same or similar material as the ground conductor165illustrated inFIG.6. The conductor layer368A can be configured to be electrically connected, using via holes, to the conductor layer366, which is the bottom layer of the first layer368, and to the conductor layer367, which is the top layer of the first layer368. In the first layer368, the conductor layer368A can be configured to fill the places excluding the dielectric layers361A and363A. The conductor layer368A is configured to shield the first wiring pattern361and the third wiring pattern363in the x and y directions. The second layer369includes the second wiring pattern362and the dielectric layer362A; the fourth wiring pattern364and the dielectric layer364A; and a conductor layer369A. The conductor layer369A can be made of the same or similar material as the ground conductor165illustrated inFIG.6. The conductor layer369A can be configured to be electrically connected, using via holes, to the ground conductor layer365, which is the top layer of the second layer369, and to the conductor layer367, which is the bottom layer of the second layer369. In the second layer369, the conductor layer369A can be configured to fill the places excluding the dielectric layers362A and364A. The conductor layer369A is configured to shield the second wiring pattern362and the fourth wiring pattern364in the x and y directions. As illustrated inFIG.13, the first feeding line151and the third feeding line153are configured to be electrically connected to the first wiring pattern361and the third wiring pattern363, respectively. As explained earlier, the first wiring pattern361and the third wiring pattern363are positioned in the same first layer368. Since the first wiring pattern361and the third wiring pattern363are positioned in the same first layer368, the positions of the connecting points151B and153B in the z direction can be substantial same. Because of the substantially same positions of the connecting points151B and153B in the z direction, the positions of the feeding points151A and153A in the z direction can be substantially equal. Consequently, the length of the first feeding line151in the z direction can be substantially equal to the length of the third feeding line153in the z direction. As illustrated inFIG.13, the second feeding line152and the fourth feeding line154are configured to be electrically connected to the second wiring pattern362and the fourth wiring pattern364, respectively. As explained earlier, the second wiring pattern362and the fourth wiring pattern364are positioned in the same second layer369. Since the second wiring pattern362and the fourth wiring pattern364are positioned in the same second layer369, the positions of the connecting points152B and154B in the z direction can be substantial same. Because of the substantially same positions of the connecting points152B and154B in the z direction, the positions of the feeding points152A and154A in the z direction can be substantially equal. Consequently, the length of the second feeding line152in the z direction can be substantially equal to the length of the fourth feeding line154in the z direction. As explained above, the first layer368is a lower layer than the second layer369. Because the first layer368is a lower layer than the second layer369, the connecting points151B and153B positioned on the first layer368are positioned more on the side of the negative direction of the z axis than the connecting points152B and154B positioned on the second layer369. As illustrated inFIG.13, the positions of the feeding points151A,152A,153A, and154A in the z direction can be substantially same. Hence, the lengths of the first feeding line151and the third feeding line153in the z direction can be longer than the lengths of the second feeding line152and the fourth feeding line154in the z direction. The resistance values of the first feeding line151and the third feeding line153can be higher than the resistance values of the second feeding line152and the fourth feeding line154. When the resistance values of the first feeding line151and the third feeding line153are higher than the resistance values of the second feeding line152and the fourth feeding line154, the distance D6can be greater than the distance D5as illustrated inFIG.15. Since the distance D6is greater than the distance D5, the wiring lengths of the second wiring pattern362and the fourth wiring pattern364can be greater than the wiring lengths of the first wiring pattern361and the third wiring pattern363. The resistance values of the second wiring pattern362and the fourth wiring pattern364can be greater than the resistance values of the first wiring pattern361and the third wiring pattern363. With such a configuration, the resistance value from the first inverting circuit63A to each of the feeding points151A and153A can be substantially equal to the resistance value from the second inverting circuit64A to each of the feeding points152A and154A. However, the characteristics of the baluns of the first inverting circuit63A and the second inverting circuit64A may vary within the acceptable error range. In that case, the phase difference between two electrical signals output from the first inverting circuit63A as well as the phase difference between two electrical signals output from the second inverting circuit64A may shift from 180°. If the phase difference of such two electrical signals has shifted from 180°, then the degree of interference among the first wiring pattern361to the fourth wiring pattern364may change as compared to the case in which the phase difference of such two electrical signals has not shifted from 180°. In that case, the distances D5and D6can be appropriately adjusted by taking into account the desired gain of the antenna310in the desired frequency band. Depending on the phase difference between two electrical signals output from the first inverting circuit63A, the direction connecting the center O1of the radiation direction330and the first inverting circuit63A can be inclined with respect to the x direction. For example, the direction connecting the center O1of the radiation direction330and the first inverting circuit63A can be ensured to be inclined with respect to the x direction in such a way that the electrical signals at the feeding point151A have the phase difference of 180° with respect to the electrical signals at the feeding point153A. Depending on the phase difference between two electrical signals output from the second inverting circuit64A, the direction connecting the center O1of the radiation direction330and the second inverting circuit64A can be inclined with respect to the y direction. For example, the direction connecting the center O1of the radiation direction330and the second inverting circuit64A can be ensured to be inclined with respect to the y direction in such a way that the electrical signals at the feeding point152A have the phase difference of 180° with respect to the electrical signals at the feeding point154A. FIG.16is a planar diagram illustrating an array antenna12according to an embodiment. The array antenna12includes a plurality of antenna elements11. However, instead of including the antenna elements11, the array antenna12can include the antenna elements111illustrated inFIG.5, or the antenna elements211illustrated inFIG.10, or the antenna elements311illustrated inFIG.12. The antenna elements11can be lined along the y direction. The antenna elements11can be arranged in the y direction. The antenna elements11can be lined along the x direction. The antenna elements11can be arranged in the x direction. The array antenna12includes at least one circuit board60. The circuit board60includes at least one first feeding circuit61and at least one second feeding circuit62. The array antenna12includes at least one first feeding circuit61and at least one second feeding circuit62. The first feeding circuit61can be configured to be connected to one or more antenna elements11. At the time of feeding power to a plurality of antenna elements11, the first feeding circuit61can be configured to supply the same signal to all antenna elements11. At the time of feeding power to a plurality of antenna elements11, the first feeding circuit61can be configured to supply the same signal to the first feeding line51of each antenna element11. At the time of feeding power to a plurality of antenna elements11, the first feeding circuit61can be configured to supply a signal having a different phase to the first feeding line51of each antenna element11. At the time of feeding power to a plurality of antenna elements11, the first feeding circuit61can be configured to supply the same signal to the third feeding line53of each antenna element11. At the time of feeding power to a plurality of antenna elements11, the first feeding circuit61can be configured to supply a signal having a different phase to the third feeding line53of each antenna element11. The second feeding circuit62can be configured to be connected to one or more antenna elements11. At the time of feeding power to a plurality of antenna elements11, the second feeding circuit62can be configured to supply the same signal to all antenna elements11. At the time of feeding power to a plurality of antenna elements11, the second feeding circuit62can be configured to supply the same signal to the second feeding line52of each antenna element11. At the time of feeding power to a plurality of antenna elements11, the second feeding circuit62can be configured to supply a signal having a different phase to the second feeding line52of each antenna element11. At the time of feeding power to a plurality of antenna elements11, the second feeding circuit62can be configured to supply the same signal to the fourth feeding line54of each antenna element11. At the time of feeding power to a plurality of antenna elements11, the second feeding circuit62can be configured to supply a signal having a different phase to the fourth feeding line54of each antenna element11. FIG.17is a planar view of a radio communication module70according to an embodiment. The radio communication module70includes a driving circuit71, which is configured to drive the antenna element11. Alternatively, the driving circuit71can be configured to drive the antenna element111illustrated inFIG.5, or to drive the antenna element211illustrated inFIG.10, or to drive the antenna element311illustrated inFIG.12. The driving circuit71is configured to be connected, directly or indirectly, to the first feeding circuit61and the second feeding circuit62. The driving circuit71can be configured to feed transmission signals to at least one of the first feeding circuit61and the second feeding circuit62. The driving circuit71can be configured to receive the feed of reception signals from at least one of the first feeding circuit61and the second feeding circuit62. FIG.18is a planar view of a radio communication device80according to an embodiment. The radio communication device80can include the radio communication module70, a sensor81, and a battery82. The sensor81performs sensing operations. The battery82is configured to supply electric power to the parts of the radio communication device80. The driving circuit71can be configured to perform driving when supplied with electrical power from the battery82. FIG.19is a planar view of a radio communication system90according to an embodiment. The radio communication system90includes the radio communication device80and a second radio communication device91. The second radio communication device91is configured to perform radio communication with the radio communication device80. In this way, according to the present disclosure, the antenna10,110,210,310; the array antenna12; the radio communication module70; and the radio communication device80of a new type can be provided. The configuration according to the present disclosure is not limited to embodiments described above, and it is possible to have a number of modifications and variations. For example, the functions included in the constituent elements can be rearranged without causing any logical contradiction. Thus, a plurality of constituent elements can be combined into a single constituent elements, or constituent elements can be divided. The drawings used for explaining the configurations according to the present disclosure are schematic in nature. That is, the dimensions and the proportions in the drawings do not necessarily match with the actual dimensions and proportions. According to the embodiment as illustrated inFIG.1, a patch-type antenna is used as the antenna element11. However, the antenna element11is not limited to a patch-type antenna. Some other type of antenna can be used as the antenna element11. According to the embodiment as illustrated inFIG.16, in the array antenna12, a plurality of antenna elements11can be lined with the same orientation. In the array antenna12, two neighboring antenna elements11can have different orientations. When two neighboring antenna elements11have different orientations, the antenna element11is excited in one direction. In the present disclosure, the terms “first”, “second”, “third”, and so on are examples of identifiers meant to distinguish the configurations from each other. In the present disclosure, regarding the configurations distinguished by the terms “first” and “second”, the respective identifying numbers can be reciprocally exchanged. For example, regarding a first frequency and a second frequency, the identifiers “first” and “second” can be reciprocally exchanged. The exchange of identifiers is performed in a simultaneous manner. Even after the identifiers are exchanged, the configurations remain distinguished from each other. Identifiers can be removed too. The configurations from which the identifiers are removed are still distinguishable by the reference numerals. For example, the first feeding line51can be referred to as the feeding line51. In the present disclosure, the terms “first”, “second”, and so on of the identifiers should not be used in the interpretation of the ranking of the configurations, or should not be used as the basis for having identifiers with low numbers, or should not be used as the basis for having identifiers with high numbers. In the present disclosure, a configuration in which the circuit board60includes the second feeding circuit62but does not include the first feeding circuit61is included. | 81,475 |
11862879 | DETAILED DESCRIPTION Reference will now be made in detail to various aspects, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation, and not limitation of the aspects. In fact, it will be apparent to those skilled in the art that modifications and variations can be made in the described aspects without departing from the scope or spirit thereof. For instance, features illustrated or described as part of one example may be used on another example to yield a still further example. Thus, it is intended that the described aspects cover such modifications and variations as come within the scope of the appended claims and their equivalents. Described herein are various aspects relating to antenna arrays comprising a plurality of antenna elements formed as coupled dipoles or other radiating elements on vertically stacked dielectric boards. The antenna elements can also comprise integrated impedance transformers, baluns, and/or the like to provide transformation of impedance, compatibility with unbalanced transmission lines, etc. Moreover, in some examples, the antenna elements can include one or more resistors or other components to cancel common-mode resonances. The antenna array includes a bottom ground plane to receive the plurality of antenna elements and enable directive radiation from the area that receives the antenna elements, and a dielectric top cover to provide loading on the top or aperture side of the antenna array to increase bandwidth and/or impedance matching. The integrated components of antenna elements can be disposed on a portion of the antenna elements that are situated above the ground plane to reduce bulk of the antenna array below ground plane (e.g., where feed network electronics and/or other electronics are typically deployed), and thus in the total size of the antenna array. Antenna arrays, as described herein, can be used to overcome the limitations of operating a single antenna. For example, dipole antennas allow for improved control of directional radiation over isotropic (omni-directional) antennas, though as the length of the dipole increases, the control of directionality decreases. Hence, control by changing the length of a single antenna may be limited. An arrangement of multiple antennas in an array can provide greater flexibility and control for directing the beam, as well as improved bandwidth. In addition, antenna arrays described herein can include broadband current sheet arrays (CSA) (e.g., tightly coupled dipole arrays) or similar radiating antenna element configurations. FIGS.1and2illustrate perspective views of a portion of an antenna array100including two adjacent antenna elements102, which can also be referred to generally as radiators.FIG.3Aillustrates a front view of an example antenna element102, andFIG.3Billustrates a conceptual view of an example antenna element102. Each antenna element102includes a feed portion104, which can include a connector, resistor, transmit-receive front-end electronic circuits, or other element feed to provide or receive an electrical signal source to/from the antenna element102. The antenna element102can also include one or more antenna arm elements106that form a two-arm symmetrical radiator. In one example, the antenna arm elements106, which can be referred to herein as radiator arms, radiating elements, dipole arms, etc., can include two dipole arms to provide a dipole antenna. The antenna array100can include a ground plane having a top portion108configured to receive the antenna elements102. In one example, the feed portion104can be disposed on the ground plane top portion108, and coupled to the antenna element102inserted into the top portion108. The feed portion104, in one example, can extend through the ground plane to allow attaching of a cable, transmit or receive electronic components, or other signal transmission devices to the feed portion104. Moreover, for example, the antenna elements102can include dielectric boards110that provide various components of the antenna elements102. In an example, the dielectric boards110can be printed circuit boards (PCB) upon which electronics for the various components of the antenna elements102are etched or otherwise printed. The antenna array100also includes a dielectric top cover111that includes one or more layers112and113. The layers112and113can comprise a low-loss dielectric material, which can improve impedance matching and bandwidth enhancement for the antenna elements102. For example, the dielectric top cover111provides dielectric loading in apertures formed by various antenna elements102of the antenna array100through one or more of the layers112and113. As a result, the dipole arms106can be placed above the top portion108of the ground plane at a shorter distance compared to a quarter of wavelength where no top dielectric loading is present. This can reduce substantially forward protrusion and, thus, make the array more conformal by its design. In one specific configuration, an antenna element102may protrude above the top portion108of the ground plane by 0.03-0.05 wavelength (λ) of the lowest operating frequency of the antenna, and the thickness of the dielectric layers112and113can be around 0.05λ; thus, the total antenna height above the ground plane may be 0.1λ or less at a lower end of an operation band (e.g., half of an inch for an array starting to operate from 2 gigahertz (GHz)). Additionally, an example antenna array100can be formed of the antenna elements102described herein as tightly coupled dipoles, which can have an inherent bandwidth of 4:1 and/or wider. This may allow operation at S bands (e.g., 2-4 GHz), X bands (e.g., 8-12 GHz), and/or the like. The tightly coupled dipole elements, as used in examples described herein, can create lines of current across apertures of the antenna array100. In addition, for example, one or more of the antenna elements102can include integrated impedance matching network components to facilitate transforming impedance of the antenna elements102. This can facilitate supporting balanced (differential) transmission lines using unbalanced (e.g., single-ended) ports connected to the feed portion104, such as coaxial transmit/receive connectors, and/or the like. In one configuration illustrated inFIGS.2-4, the antenna elements can include a balun120, a first impedance transformer130on one side of the balun120, and a second impedance transformer140on the other side of the balun120. In an example, the balun120can be a double-Y balun120, as depicted. Integrating such components in the antenna elements102above the ground plane (e.g., above top portion108of the ground plane) can allow for a lower profile structure of the ground plane and/or an area below the ground plane, and thus the antenna array100, as such components need not be included within or below the ground plane. Furthermore, the antenna elements102can include one or more anomaly suppressing components to cancel common-mode resonances exhibited in portions of the antenna elements102during radiation. In an example, the anomaly suppressing components can include conductor branches150,151that are connected to the second impedance transformer140, and/or can also connect to a ground. The conductor branches150,151can include, or can be coupled to, one or more chip resistors (e.g., high impedance resistors), for example, to cancel the common-mode resonances. Thus, a small amount of RF power can be dissipated in the one or more chip resistors used to suppress the common mode resonance, which can be made small and localized in frequency. FIG.4illustrates a front view and a side view of example antenna elements102. The feed portion104may have two leads, which represent an unbalanced transmission line (e.g., microstrip stripline, coaxial cable, etc.). As illustrated inFIG.4, the feed portion104connects directly to a first end119of the first impedance transformer130. The feed portion104can include a standard connector (e.g., a subminiature version A (SMA) connector) so that a signal source can be modularly attached thereto. In one example, the depicted antenna elements102can be disposed adjacent to one another in an antenna array. As described, the antenna elements102can include a feed portion104, radiator arm(s)106, etc., and can be connected in a top portion108of a ground plane. The antenna elements102can also include a balun120, a first impedance transformer130on one side of the balun120, and a second impedance transformer140on the other side of the balun120. As described in one example, the antenna elements102, or portions thereof, can be constructed via microstrip by etching a metal or other conductive material disposed on a PCB. However, the antenna elements102may be constructed by any other method or system and thus, should not be so limited. The first impedance transformer130may include a set of microstrip lines which begin at feed portion104and extend to at least an input portion121of the balun120. The set of microstrip lines can include one or more conductors, such as a center conductor134, a left conductor132, and a right conductor133. The left and right conductors132,133may be co-planar and/or may be of substantially equal dimensions. Additionally, the left and right conductors132,133may be tapered microstrip sections connected with outer portions of the balun120. Moreover, though the left conductor132and right conductor133are shown as substantially trapezoidal in shape, it is to be appreciated that substantially any shape can be used (e.g., rectangular, as shown in other Figures). The center conductor134of the first impedance transformer130can feed an interior portion of the balun120, as depicted. In one example, the length of the set of microstrip lines may be about one third of the height of the antenna elements102. For instance, the first impedance transformer130can match impedance at the feed portion104of an electrical signal source, which is typically 50 Ohms, to the input portion121of the balun120, that could be, for example, in the range of 75-110 Ohms. This may allow for maximum transmission of an electrical signal to the balun120while minimizing signal loss and/or reflection. In addition, as described, a signal in the first impedance transformer130may be unbalanced, according to some examples. In this example, the balun120can convert an unbalanced line (e.g., from the first impedance transformer130) to a balanced line for the radiator arm106. In one example, the balun120transitions from an unbalanced coplanar waveguide (CPW) to a balanced coplanar strip (CPS) for outputting via the radiator arm106. In an example, this implementation of the balun120can be manufactured substantially precisely using minimal metal materials, and relatively small compared to other transitioning devices. In addition, for example, the balun120can include a plurality of ports401-406. For example, in obtaining complete transmission from port401(which may be unbalanced) to port404(which may be balanced), ports402and405can be shorted while ports403and406can be open-circuited. CPW bridges410can be utilized to maintain the outer ground conductors at the same potential, thus preserving a desired mode along the CPW lines. If the impedance of port404and the impedances of the CPW and CPS sections are all substantially equal, then the balun120can be substantially matched at all frequencies across a wide operational band. The length of the open-circuited and shorted ports in the balun120reach approximately one-eighth of a wavelength at the middle frequency of operational band. The positions of the CPW bridges410can help to improve impedance matching being properly adjusted. For example, the impedance matching components (e.g., the balun120, first impedance transformer130, second impedance transformer140, etc.) used in this design can create a distributed electromagnetic system with complex interaction inside an antenna array100that includes many antenna elements102with corresponding impedance matching components. The CPW bridges410can help to achieve desired impedance transformation for the antenna array100. In an example, the left conductor144of the second impedance transformer140can couple the signal potential at the left conductor144, which may be electromagnetically coupled to the center conductor134of the unbalanced line, to one of the radiator arms106of the radiator (e.g., the left leg of the dipole antenna as illustrated inFIG.4). The right conductor143of the second impedance transformer140can couple the signal potential at conductor143, which may be electromagnetically coupled to the two coplanar conductors132and133of the first impedance transformer130, to another radiator arm106, etc. Though some conductors are shown as separated into multiple integral conductor segments, it is to be appreciated that various conductors are not so limited and can include a continuous conductor or greater or lesser number of integral segments. In one specific example, the impedance matching network components can transform an input impedance on the radiator arm106of close to a half of free space wave impedance that is around 200 Ohm to a reference of 50 Ohm impedance of standard coaxial transmit/receive connectors, which may be connected at feed portion104. For instance, the first impedance transformer130can convert an impedance of a signal from the feed portion104to an intermediate impedance (e.g., from 50 Ohm to 100 Ohm). The balun120can balance the unbalanced signal to generate a balanced signal (e.g., of 100 Ohm). The second impedance transformer140can convert the intermediate impedance of the balanced signal to a target impedance (e.g., 200 Ohm). As described, radiator arm106that form the radiator can include one or more dipole arms or other terminals into or from which radio frequency current can flow. The current and the associated voltage can cause an electromagnetic or radio signal to be radiated throughout and/or by antenna element102. For example, a dipole can relate to an antenna element102, or portion thereof, having a resonant length of conductor sized to enable connection to a feed portion104. For resonance, the conductor can have a size approximately one half of the operational wavelength at a higher end of an operation band and/or a smaller fraction at middle and lower end of the operational band. It should be understood that, while a dipole antenna element102is illustrated, any other type of radiators may be employed, and the dipole is shown herein for illustrative purposes. Moreover, in an example, one or more of the dipole arms can include one or more coupling elements170and/or171(e.g., a surface-mount device (SMD) coupling capacitor, inductor, and/or resistor) that can contact or otherwise connect to other dipole arms (or coupling elements thereof) of adjacent antenna elements102. Referring toFIGS.4and5, for example, coupling element170can be disposed on a dipole arm106of the antenna element102and another coupling element171can be disposed on a dipole arm106of an adjacent antenna element102near a point of intersection with a perpendicular antenna element102. The coupling elements170and171can be disposed with some gap to allow passing of the perpendicular antenna element102between the antenna elements with coupling elements170and171for orthogonal polarization. In one example, the capacitance, inductance, and/or resistance value of the coupling elements170and/or171can correspond to an operational band of the antenna array. It is to be appreciated that the coupling element171is not explicitly shown inFIG.5as its view is blocked by the perpendicular antenna element; however, its approximate position is shown at171for reference. As described herein, a ground plane of an antenna array100can be disposed at the base of the antenna elements102. In this regard, substantially all components of the antenna elements102(e.g., the transformers130,140, the balun120, the radiator arm(s)106, etc.) can be located above the ground plane. Previous designs incorporate at least some of these components below the ground plane, which can have negative effects on the electrical performance due to higher power losses and parasitic anomalies in scanning regimes, and can also add bulk to the antenna array. The present design avoids these negative effects by including the components above the ground plane. The Figures show a top portion108of the ground plane, which may include a metal plate or other substantially flat portion upon which the antenna elements102are assembled. It is to be appreciated that additional side and/or bottom portions (not shown) can be provided to substantially enclose the bottom of the antenna array100. The ground plane can serve also as an electrical ground for the antenna array100, a heat sink for high power applications, etc. The ground plane108of the antenna array100may be used to ground any grounding lines. For example, as illustrated inFIGS.2and5, antenna element102can include one or more conductor branches150,151that can operate to suppress anomalies in the form of common-mode resonances. In some radiator arms106, a resonance at a particular frequency may be formed by the nature of the radiator arms106that form resonance loop circuits being electrically connected to other dipole elements in adjacent array cells. As a result, the common mode (unbalanced) current can flow on the conductor vertical branches140instead of wanted differential (balanced) current that may fail power exchange between the radiator arms106and the antenna feed104. To compensate for such issue, conductor branches150,151can be connected to ground (e.g., via the ground plane) and also to the second impedance transformer140. In one example, the branches150,151can couple to the second impedance transformer140via a discrete component (e.g., components160and161respectively disposed inline with branches150,151, and/or conductor arms144and143). For example, the discrete components160and161can include chip resistors, such as a 1K resistor or similar resistor. The discrete components160and161, in one example, can be soldered across gaps that may be formed on the PCB between the conductor arms144and143and the respective branches150and151. The gap width can be selected based at least in part on power for the antenna array (e.g., a 0402 SMD resistor for lower power applications and up to a 1206 SMD resistor for high power applications, etc.). The conductor branches coupled to the transformer140and ground, and having one or more resistors disposed therebetween can effectively suppress the common-mode resonance anomalies and may introduce some minor loss (e.g., 2-3 dB) in a very narrow frequency band around the resonance. As such, the location of connection of the conductor branches150,151can be based on the frequency of resonation and/or a size of the discrete component. Moreover, for example, conductor branch152can connect to or otherwise be in electrical contact with similar conductor branches of other antenna elements102(e.g., adjacent antenna elements102in a row and/or in another perpendicular row in a plane array configuration), in one example, to form a common-mode cancelation network among the antenna elements102. FIG.6illustrates the antenna elements102printed on a PCB. As illustrated, the antenna element is printed on the PCB by providing a PCB and etching the PCB to form the previously-discussed components, conductors, etc. of each antenna element102. In one specific example, the antenna elements102can comprise the components printed on 12-mil Duroid or other RF/microwave substrate of particular thickness. As illustrated inFIG.6, each PCB can include a series of antenna elements102printed thereon. The PCBs can be used as a linear array as inFIG.6to provide single linear polarization. In another example, however, the linear array can be substantially perpendicularly attached together with one or more other linear arrays, as illustrated inFIG.7where the corresponding vertical boards (both in the x and y directions) include antenna elements102to form a plane array100. In one example, the antenna elements102stacked perpendicularly can form a number of cells enclosed by the antenna elements102, and can include reactive and/or resistive overlays at unit cell boundaries. In one example, in this configuration, two orthogonal linear polarizations can be supported by radiating different polarizations using radiator arms106of perpendicularly adjacent antenna elements102. In one example,FIGS.4and5illustrate two PCB boards attached in such manner where one antenna element102is shown front facing while another can be viewed at a side, and the antenna elements102can be point-like electrically interconnected, such that few soldering or other attachment operations may be used to assemble the array. For example, the anomaly suppressing conductors152can be electrically contacting or otherwise connected, as described, to form a common-mode resonance cancelation network across the array100. In another example, a portion of radiator arms106of adjacent antenna elements102may be in electrical contact. Configuration of the PCB boards in perpendicular arrangement can create an eggcrate or grid configuration for dual linear polarized radiation, as shown inFIG.7. The eggcrate configuration can be defined by a plurality of the PCB boards comprising the antenna elements stacked in perpendicular relation at similar spacing. The spacing can correspond to spacing on the antenna elements such that each aperture in the eggcrate configuration comprises an antenna element, as shown inFIG.7. Moreover, the PCBs can have slots (e.g., slot602inFIG.6) to receive perpendicularly aligned PCBs (e.g., in similar slots of the perpendicularly aligned PCBs) such that the stacked perpendicular PCBs achieve a similar height from the ground plane. In addition, the PCBs can include conductors for the point-like electrical connections (e.g., conductors152) such that the conductors of adjacent perpendicular PCBs contact when the PCBs are aligned in the respective slots. This configuration can ease manufacture of the antenna array100because the antenna elements102are printed on a card, and the cards can be stacked in an eggcrate configuration without requiring soldering at each joint. It is to be appreciated that this eggcrate configuration may have a polarization deficiency, which can be mitigated by controlling amplitude/phase of the adjacent antenna elements102. The ground plane is then provided at the bottom of the PCBs, such that the top portion108thereof can serve at least partially as an assembling base (e.g., for stacking the linear array cards). For example, the ground plane can include one or more flat metal sheets used to enable directive radiation from the antenna area. Dielectric layers112and113(FIG.2) are disposed on top of this eggcrate structure to provide dielectric loading of the antenna elements102in the array100, as described. The dielectric layers112and113comprise a few layers of low-loss dielectric material placed on top for improved impedance matching and bandwidth enhancement. The example constructions of a broadband CSA may allow for coverage from 3-6:1 and likely up to 10:1 and greater bandwidth. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more examples of subject matter described herein. While one or more aspects have been described above, it should be understood that any and all equivalent realizations of the presented aspects are included within the scope and spirit thereof. The aspects depicted are presented by way of example only and are not intended as limitations upon the various aspects that can be implemented in view of the descriptions. Thus, it should be understood by those of ordinary skill in this art that the presented subject matter is not limited to these aspects since modifications can be made. Therefore, it is contemplated that any and all such embodiments are included in the presented subject matter as may fall within the scope and spirit thereof. | 24,237 |
11862880 | It is to be understood that both the foregoing general description and the following detailed description are merely exemplary and intended to provide an overview or framework to understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments, and together with the description explain the principles and operation of the various embodiments. DETAILED DESCRIPTION In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols may be used to identify similar components, unless context dictates otherwise. Moreover, the illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. Also, it will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the various accompanying figures, can be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are explicitly contemplated herein. It will be understood that when an element is referred to as being “on”, “attached” to, “connected” to, “coupled” with, “contacting”, etc., another element, it can be directly on, attached to, connected to, coupled with or contacting the other element or intervening elements may also be present. In contrast, when an element is referred to as being, for example, “directly on”, “directly attached” to, “directly connected” to, “directly coupled” with or “directly contacting” another element, there are no intervening elements present. It will be further understood that, although the terms “first”, “second”, etc. may be used herein to describe various elements, components, etc., these elements, components, etc. should not be limited by these terms. These terms are only used to distinguish one element, component, etc. from another element, component, etc. Thus, a “first” element or component discussed below could also be termed a “second” element or component without departing from the teachings disclosed herein. In addition, the sequence of operations (or steps) is not limited to the order presented in the claims unless specifically indicated otherwise. FIGS.1-8show various views of a compressible electrical contact100in accordance with embodiments disclosed herein.FIG.1is an isometric view of the compressible electrical contact100in a substantially relaxed state. The compressible electrical contact100includes a first contact end110, a second contact end120opposing the first contact end110, and a medial portion130disposed between the first contact end110and the second contact end120. The first contact end110includes an inner surface112and an outer surface114. Similarly, the second contact end120includes an inner surface122(FIG.2) and an outer surface124. As shown particularly inFIG.5, in the substantially relaxed state, the compressible electrical contact100has a relaxed length defined as LR1, measured from a first outer edge126ato an opposing outer edge128a. Each contact end110,120is also defined, in part, by top lengths TLCE1, TLCE2and bottom lengths, BLCE1, BLCE2, as particularly shown inFIG.5. Top length TLCE1is measured from the first outer edge126ato a first top inner edge126a′ of the contact100, while top length TLCE2is measured from the second outer edge128ato a second top inner edge128a′ of the contact100. Bottom length BLCE1is measured from the first outer edge126ato a first bottom inner edge126b, while bottom length BLCE2is measured from the second outer edge128ato a second bottom inner edge128b. In preferred configurations, at least a portion of each contact end110,120is cylindrical. Referring particularly toFIGS.1-5, the medial portion130includes a plurality of divaricated-cut sections132with medial elements134adjacent to or therebetween. For further illustration,FIG.2shows an isometric view of the compressible electrical contact100in a substantially relaxed state with its upper right quadrant removed andFIG.3shows an enlarged section of the medial portion130cut away from the first contact end110. In alternative configurations, the compressible electrical contact can include a body without the first and second contact ends. FIGS.1-7also show various views of the compressible electrical contact100in a substantially relaxed state, manufactured according to a divaricating pattern PA (FIG.9) that defines how the plurality of divaricated-cut sections132are cut into a tube300A. Referring particularly toFIG.4, from the first contact end110, an initial divaricated cut132e1(referring to the first divaricated cut on the first contact end110) may be defined by a first end cut angle αe1, which is measured with respect to opposing inner surfaces136a,136b. From the second contact end120, a final divaricated cut132e2(referring to the last divaricated cut on the second contact end120) may be defined by a second end cut angle αe2, which is measured with respect to opposing inner surfaces138a,138b. Inner divaricated-cut sections132in, positioned between the first contact end110and the second contact end120, may be defined by an inner cut angle αin(referring to a plurality of inner divaricated cut angles between the first contact end110and the second contact end120). Each inner cut angle α in is measured with respect to outwardly extending opposing inner surfaces139ain,139bin, between inner divaricated cut-sections132in. In addition, preferably included in each divaricated-cut section is a radiused edge Re1, Rin, Re2disposed between the respective opposing inner surfaces139ain,139bin. Each of the divaricated-cut sections can be further defined with respect to innermost cut distances Ke1I, KNI, Ke2Iand outermost cut distances Ke1O, KNO, Ke2O, where each innermost cut distance is smaller than each outermost cut distance. Although a certain number of sections and medial elements are shown inFIGS.1-8, the number of divaricated-cut sections and medial elements shown should not be construed as limiting. Fewer or additional divaricated-cut sections and medial elements may be included within the overall structure of the compressible electrical contacts disclosed herein. Moreover, the angles of the divaricated-cut sections and the widths of the medial elements may vary. FIG.8shows the compressible electrical contact100, in a substantially compressed state, at a compressed length LC1, where LC1is measured from the first outer edge126ato the second outer edge128aof the contact100when the contact100is substantially compressed. In this state, the inner surfaces136a,136b(FIG.4) nest or collapse inwardly and contact each other such that a first end space140is formed adjacent the first contact end110. Also, inner surfaces138a,138b(FIG.4) nest or collapse inwardly and are in contact such that a second end space142is formed adjacent to the second contact end120. And, inner surfaces139ain,139bin(FIG.4) nest or collapse inwardly such that the compressible electrical contact100also includes interior spaces144informed between interior surfaces139ain,139bin(FIG.4). Accordingly,inthe substantially compressed state, a portion of each inner surface touches such that the end spaces and interior spaces form a plurality of tapered slots150e1(first contact end slot),150in(inner contact slots),150e2(second contact end slot) that extends through the compressible electrical contact100. The plurality of slots150can be further defined to have a tapered-teardrop shape upon compression. In the substantially compressed state, shown inFIG.8, the compressible electrical contact100also remains in a substantially tubular shape without the need for inner and/or outer diameter support structures. The ability of the compressible electrical contact100to maintain a relatively tubular shape is in marked contrast to the jumbled and serpentine undulations commonly seen in coil-type springs when compressed without inner and/or outer diameter support structures. As a result, the medial elements134(FIG.7) act to counter-balance each other throughout a compression stroke, spreading the load of the forces exerted onto the contact across substantially all portions of the contact100. FIG.9illustrates an exemplary divaricating pattern PA for a tube300A. The tube300A includes an outer surface302aand an inner surface (not shown), an overall tube length TL1, a first tube edge326A, and a second tube edge328A. The tube is shown, as being substantially cylindrical. However the tube, may have other outer configurations, including, but not limited to square, hexagonal, and other polygonal tube configurations. The divaricating pattern PA is defined with respect to a central axis CA along the length of the tube300A. A theoretical divaricated cut350A1for a tube end310A may be defined with respect to a first divaricating pattern PAT1, using predefined measurements DAC1, EAC1, FAC1, and GAC1. The first divaricating pattern PAT1includes an upper tapered section370A1and a lower tapered section372A1. The lowered tapered section372A1preferably mirrors and is positioned directly below the upper tapered section370A1. DAC1measures the overall height of the first theoretical divaricated cut350A. EAC1measures the distance of the center of the divaricating pattern PAT1from the first outer edge326A of the tube300A. FAC1is the widest width of the divaricating pattern PAT1and GAC1is narrowest width of the divaricating pattern PAT1. A theoretical divaricating cut360A for a tube medial portion330A may be defined with respect to a second divaricating pattern PAT2, using predefined measurements DAC2, FAC2, and GAC2. DAC2measures the overall height of the theoretical divaricated cut360A. FAC2is the widest width of the divaricating pattern PAT2and GAC2is narrowest width of the divaricating pattern PAT2. The divaricating patterns PAT1, PAT2are further defined with respect to dimensions HAc, DAm, where HAc is the distance between the patterns PAT1, PAT2measured from their respective centerlines and DAM1is the distance from the bottom of divaricating pattern PAT2to a middle line ML where the tapered sections370A1,372A1join, with the line being central axis CA. The theoretical divaricating cut s are further defined with respect to each other at a measurement HAc defined with respect to the centerlines of theoretical end cut350A and theoretical medial cut360A. Preferably, the divaricating patterns are such that they allow the final form of the divaricated-cut compressible electrical contact to exhibit spring-like properties. Moreover, in the embodiments disclosed herein, zig-zag-like tapered patterns are preferred such that the final properties of the contact are spring-like. The divaricating pattern PA is also configured such that the amount of bowing that could occur in the medial portion, after cut ting of the tube and during compression is minimal. Alternative variations and divaricating patterns may, however, be used. FIGS.10-12show various views of a compressible electrical contact200in accordance with embodiments disclosed herein.FIGS.10A and10Bshow top views of the contact200andFIG.11shows a side view of the contact200in a substantially relaxed state. The compressible electrical contact200includes a first contact end210, a second contact end220opposite the first contact end210, and a medial portion230disposed between the first contact end210and the second contact end220. The first contact end210includes an inner surface (not shown) and an outer surface214. Similarly, the second contact end220includes an inner surface (not shown) and an outer surface224. In preferred configurations, at least a portion of each contact end210,220is cylindrical. In the substantially relaxed state, shown inFIGS.10and11, the compressible electrical contact200has a relaxed length defined as LR2, measured from a first outer edge226ato an opposing outer edge228a. Contact end210is defined, in part, by a bottom length, BLDE1measured from the outer edge226ato a bottom inner edge226b. Contact end220is defined, in part, by a top length, TLDE1measured from the outer edge228ato a first top inner edge228b. The medial portion230includes a plurality of divaricated-cut sections232with medial elements234adjacent to or therebetween. As with the first embodiment, the compressible electrical contact200can include just a medial portion without the first and second contact ends. Referring particularly toFIGS.10A and10B, from the first contact end210, an initial divaricated cut232e1(referring to the first divaricated cut on the first contact end210) may be defined by angles δe11, δe1O, which are measured with respect to opposing inner surfaces236a,236b,236c,236d. Extending from inner surface236bis an initial curved surface237. From the second contact end220, a final divaricated cut232e2(referring to the last divaricated cut on the second contact end220) may be defined by angles δe2I, Se2O, which are measured with respect to opposing inner surfaces238a,238b,238c,238d. Extending from inner surface238ais an final curved surface239. Inner divaricated-cut sections232in(referring to a plurality of inner divaricated-cut sections between the first contact end210and the second contact end220) may be defined by two angles δNI, δNO(referring to a plurality of innermost and outermist inner divaricated cut angles between the first contact end210and the second contact end220). Angles δNI, δNOare measured with respect to outwardly extending pairs of opposing inner surfaces241ain,241bin,241cin,241dinlocated between inner divaricated cut-sections232in. Each of the divaricated-cut sections can be further defined with respect to innermost cut distances Ve1I, VNI, Ve2Iand outermost cut distances Ve1O, VNO, Ve2O, where each innermost cut distance is smaller than each outermost cut distance. where each innermost cut distance is smaller than each outermost cut distance. In addition, preferably included in each divaricated-cut section is a radiused edge RBe1, RBin, RBe2(FIG.11) disposed between the respective opposing inner surfaces241ain,241bin. and opposing inner curved surfaces243ain,243bin. FIG.12shows the compressible electrical contact200in a substantially compressed state at a compressed length LC2, measured from the first outer edge226ato the second outer edge228aof the contact200when the contact is substantially compressed. In this state, the inner surfaces236a,236bnest or collapse inwardly and contact each other such that a first end space240is formed adjacent the first contact end210. Also, inner surfaces238a,238bcollapse inwardly and are in contact such that a second end space242is formed adjacent to the second contact end220. And, inner surfaces239ain,239bincollapse inwardly such that the compressible electrical contact200also includes interior spaces244informed between interior surfaces246in,248in. In the substantially compressed state, a portion of each inner surface touches such that the end spaces and interior spaces form a plurality of tapered slots250. The plurality of tapered slots250can be further described to include a first contact end slot250e1, at least one inner contact slot250in, and a second contact end slot250e2that extends through the compressible electrical contact200. The plurality of slots250can be further defined to have a tapered-teardrop shape upon compression. Due to the curved surfaces, however, the slots250are much smaller and narrower compared to the slots150in the first embodiment of the compressible electrical contact. In the substantially compressed state, shown inFIG.12, the compressible electrical contact200remains in substantially tubular without the need for inner and/or outer diameter support structures. As with the first embodiment, the medial elements234(FIG.11) act to counter-balance each other throughout a compression stroke, spreading the load of the forces exerted onto the contact across all portions of the contact200. FIG.13shows another type of divaricating pattern PB, including a plurality of divaricating-cut patterns, that may be used to cut the plurality of divaricated-cut sections232into a tube300B. The tube300B includes an outer surface302B and an inner surface (not shown), an overall tube length TL2, a first tube edge326B, and a second tube edge328B. The divaricating pattern PB is defined with respect to a central axis CB that extends along the length of the tube300B. A theoretical divaricated cut350B for a medial portion330B may be defined with respect to a first divaricating cut pattern PBT1, using predefined measurements DBC1, EBC1, and GBC1. DBC1measures the overall height of the theoretical divaricated cut350B. EBC1measures the maximum width of the divaricated cut350B and GBC1is narrowest width of the of the divaricated cut350B. The first divaricating cut pattern PBT1also includes an upper tapered section370B1, a lower tapered section372B1, and an arc section374B1positioned between the upper tapered section370B1and the lowered tapered section372B1. The arc section374B1includes two arc segments BBT1, BBT2. A theoretical divaricating cut360B for a tube end portion310B may be defined with respect to a second divaricating pattern PBT2, using predefined measurements DBC2, EBC2, FBC2, and GBC2. DBC2measures the overall height of the theoretical divaricated cut360B. EBC2measures the distance from the centerline of the cut360B to the edge of the tube326B. FBC2is the widest width of the divaricating pattern PBT2and GBC2is narrowest width of the divaricating pattern PBT2. Divaricating patterns PBT1, PBT2are further defined with respect to dimensions HBc and DBM2. Measurement HBc is the distance between the patterns PBT1, PBT2measured from their respective centerlines and DBm2is the distance from the bottom of divaricating pattern PBT2to the median of the arc section374B1, which is parallel with central axis CB. Preferably, the divaricating patterns PA, PB may cut at internals in the tube are such that they allow the final form of the divaricated-cut contact to exhibit spring-like properties. Moreover, in the embodiments disclosed herein, zig-zag like patterns are preferable such that the final properties of the contact are spring-like. The divaricating patterns PA, PB are also configured such that the amount of bowing that could occur in the medial portion, after cut ting of the tube and during compression is minimal. Alternative variations and divaricating patterns may, however, be used. The compressible electrical contacts disclosed herein are preferably manufactured from tubes using one or more precision cut ting methods, e.g. laser cut ting. The tube is also preferably manufactured from one or more electrically conductive materials. Suitable materials for the compressible electrical contact include, but are not limited to, brass, copper, beryllium copper and stainless steel. Preferably, these materials have spring-like properties, high strength, high elastic limit, and low moduli. Overall dimensions for the compressible electrical contacts disclosed herein can range from micro- to large scale. Targeted sizes, however, are on a smaller basis given current industry trends. An exemplary tube size has an inner diameter of about 0.006 inches, an outer diameter of about 0.010 inches, and an overall length of about 0.070 inches. When the compressible electrical contact is manufactured, using a tube having these dimensions and incorporating divaricating pattern, PA, the resulting cut angles can be about 5 degrees, the innermost cut distances can be about 0.001 inches and the outermost cut distance can be about 0.002 inches. And, when the compressible electrical contact is manufactured, incorporating divaricating pattern PB, the resulting upper cut angles can range from about 13 degrees to about 15 degrees, the resulting lower cut angles can range from about 1.5 degrees to about 3.0 degrees with the innermost cut distances being about 0.0006 inches and the outermost cut distance being about 0.002 inches. Dimensions of the compressible electrical contacts disclosed herein, however, depend on various factors, including but not limited to the contact's spring rate and the length of travel between a substantially relaxed state and a compressed state. Nonetheless, after compression, the compressible electrical contacts disclosed herein will have an effective inner diameter of about 0.006 inches, an effective outer diameter of about 0.010 inches, and an overall length of about 0.070 inches, when manufactured from a tube having an inner diameter of about 0.006 inches, an outer diameter of about 0.010 inches, and an overall length of about 0.070 inches. FIGS.14-17are cross-sectional views of exemplary connector assemblies, with each assembly, including the compressible electrical contact100in a substantially compressed state. To further emphasize and illustrate the compressive nature of the compressible electrical contact100, the contact100is not shown in cross-section. FIG.14shows an exemplary connector assembly400, including two male pins402,404, the compressible electrical contact100, end dielectrics410,412coupled respectively to pins402,404and a central dielectric414disposed around the compressible electrical contact100. The assembly400further shows contact ends110,120contacting pins402,404at contact points406,408. The assembly600further includes an external housing416, having a central housing body420and housing ends422a,422b. The central body420has a middle section that extends downwardly toward the central dielectric414and central body ends424a,424bthat abut against end dielectrics410,412. Each housing end422a,422bincludes an end opening426a,426bthat is contoured with internal opening diameters configured to accommodate end portions402a,404aof male pins402,404. FIG.15shows another exemplary connector assembly500, including a male pin502A, an end dielectric510coupled to the male pin502A, the compressible electrical contact100, a central dielectric514surrounding the contact100, an external housing516, including a first housing body518and a second housing body520. The second housing body520surrounds the central dielectric514and includes a second housing body end522, having ends520a,520b, coupled to an outer surface of the housing body520. Still referring toFIG.15, the cable505includes a cable center conductor503, a cable dielectric507, and an outer cable sheath509. The housing body end522has an end opening526that is contoured with internal opening diameters configured such that the male pin end502ais routed freely through the end opening526. The assembly500further shows contact ends110,120contacting the male pin502A and the center conductor503at contact points506,508. FIG.16shows yet another exemplary connector assembly600, including the compressible electrical contact100, a male pin602, an end dielectric610surrounding the male pin602, a central dielectric614surrounding the contact100, a housing body620surrounding the end dielectric610and a central dielectric614, a printed circuit board700abutting a second body end620bof the housing body620. The housing body620also includes a first body end620a, having an end opening626that is contoured such that the male pin end602ais routed freely through the end opening626. The assembly600shows ends110,120of the contact100contacting the pin602and the printed circuit board700at contact points606,608. FIG.17shows an exemplary connector assembly800, including the compressible electrical contact100, a first printed circuit board900aabutting against the first contact end110of the contact100, a second printed circuit board900babutting against the second contact end120of the contact100, a central dielectric814surrounding the contact100, and an external housing body820surrounding the central dielectric814and having ends820a,820bthat abut respectively against printed circuit boards900a,900b. Here, contact ends110,120are shown contacting each printed circuit board900a,900bat contact points806,808. FIGS.18and19show results from Voltage Standing Wave Ratio (VWSR) tests, measured in accordance with industry standards, including but not limited to MIL-PRF-39012, Sec. 4.6.11.FIG.18illustrates the relationship of VWSR to Frequency (GHz) for samples of connector assemblies, with each assembly including a compressible electrical contact in accordance with embodiments disclosed herein. Each set of results is based on each respective compressible electrical contact being installed in an assembly between two male pins, where the compressible electrical contact rests at half of its max travel length. For comparative purposes,FIG.19shows the relationship of VWSR to Frequency (GHz) for sample connector assemblies, having the same testing configuration as used for the test results shown inFIG.18. In this assembly, however, the compressible electrical contact has been replaced with a FUZZ BUTTON® interconnect. FUZZ BUTTON® interconnects are manufactured by Custom Interconnect LLC. Accordingly, it will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments and the elements thereof without departing from the scope of the disclosure. Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. It is intended that the specification and examples be considered as exemplary, with a true scope of the present disclosure being indicated by the following claims and their equivalents. | 25,929 |
11862881 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring toFIGS.1-9, an electrical connector100is shown mounted to a PCB300for receiving an FPC200which has a pair of notches201(only one being labeled inFIG.5). The electrical connector100includes an insulative housing10having a slot11, a plurality of contacts20secured in the insulative housing10and exposed to the slot11, and a metallic shell30mounted to the insulative housing10. The insulative housing10has a top wall12, a bottom wall13, a rear wall14, and a pair of side walls15. Each contact20has a contacting potion21, a tail23, and a securing portion22therebetween and is adapted to engage the FPC200in a manner well known in this art. The metallic shell30has a top plate32, a bottom plate33, and a connecting part37connected to the top plate32at an upper end thereof and connected to the bottom plate33at a lower end thereof. In the embodiment shown, the connecting part37is constructed as two separate pieces. The top plate32has a pair of actuating arms36and the connecting part37has a pair of corresponding locking arms38. The locking arm38extends into the slot11and has a latch381for entering the notch201of the FPC200. The top plate32is operable by a user to move about the upper end of the connecting part37so as to move the pair of actuating arms36downward to actuate the pair of locking arms38, thereby disengaging the latches381from the notches201of the FPC200. The FPC200then may be withdrawn from the electrical connector100. After the operation, the top plate32and therefore the pair of actuating arms36, as well as the pair of locking arms38, will resiliently return to their original positions. The latch381has an inclined surface3811for the FPC200during inserting to pass over without hinderance or intervention. As shown inFIG.5, the pair of actuating arms36are in touch with the pair of locking arms38so that the latter is pre-loaded. This helps in controlling a movement of the pair of locking arms38. The metallic shell30in the embodiment shown is of a one-piece construction. The locking arm38has a vertical part382and a horizontal part383; the horizontal part383contains the latch381at an inner end thereof. The actuating arm36is substantially vertical and includes a front part361and a rear part362. The front part361has a bottom face that is in touch with the horizontal part383of the locking arm38. A bottom face of the rear part362is leveled higher than the bottom face of the front part361. The actuating arm36is located inwardly with respect to the vertical part382of the locking arm38. The bottom plate33of the metallic shell30has a pair of openings332that align with the pair of locking arms38to accommodate for downward movements of the horizontal parts383. The metallic shell30may have a pair of side plates35that are bent upward from the bottom plate33but are separated from the top plate32so that the top plate32may have a downward movement independent of the pair of side plates35. Disposed between the top wall12and an associated side wall15is a respective channel121which is opening downwardly to the slot11, passing upwardly through the top wall12, and passing rearward through the rear wall14, so as to receive a corresponding locking arm38and permit a resilient movement of the locking arm38therein. The channel121does not pass forwardly through the top wall12so that a front opening of the slot11has an uninterrupted frame structure122. Behind this uninterrupted frame structure122is a cut-off portion providing a space123for movement of the top plate32when pressed downwardly. The top plate32includes a front portion321, an intermediate portion322, and a rear portion323. Specifically, a respective upper portion of each side wall15has an inclined face351that aligns with the intermediate portion322to limit an over-downward movement of the top plate32. The pair of actuating arms36are formed at two opposite side ends of the front portion321. Each of the side plates35of the metallic shell30has a clip353for latching to a protrusion disposed at the upper portion of the side wall15. A similar latching structure is formed between a respective outer portion of the side wall15and the side plate35. The bottom plate33has a plurality of spring fingers331to passing through the bottom wall13of the insulative housing10to contact a grounding structure of the FPC200and/or support the FPC200. The metallic shell30may further have a rear plate34that bears against the rear wall14of the insulative housing10and a pair of mounting flaps354. | 4,539 |
11862882 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG.1illustrates the first embodiment of a tubular high current female terminal of this invention, generally referred to as reference number1, having an outer terminal3and a core terminal5. The outer terminal3includes an elongated mating portion7and a termination portion9. The elongated mating portion7and the termination portion9are integrally linked therebetween through a transit portion6. The elongated mating portion7has a seamless elongated opening12for allowing the core terminal5to pass therethrough so as to ultimately be accommodated within the elongated mating portion7, as will later be discussed. As also discussed later, the termination portion9is attachable to an electric cable or an electric conductor. Shown inFIG.1is first type of the core terminal5. The term “elongated” is defined herein as a member that has a dimension in which its width is larger than that of its thickness. The high current female terminal1is of a tubular design with an overall profile that can be readily pre-formed with high precision and pre-formed to fit therein an elongated male terminal (for example, as described later, an elongated blade type male terminal or an extended cylindric type male terminal). Material cut-out8in the transit portion6is to ease and facilitate the forming process of the mating portion7and termination portion9with different profiles in the manufacturing of the outer terminal3. The outer terminal3is preferably a single-piece, low profile, and robust in structure or configuration to guide, support and protect the core terminal5upon insertion thereof into the outer terminal3. The outer terminal3is also preferably made of a pre-formed seamless tube without the need for machining, which, as mentioned earlier, is inefficient and low in productivity. The core terminal5includes a plurality of spring contacts24,26, as more fully discussed later. The core terminal5has, at each of opposing ends thereof, an elongated opening13,14that matches so as to fit inside the elongated opening12of the elongated mating portion7of the outer terminal3. Each elongated opening13,14of the core terminal5has two longitudinal sides18,20for mating with an elongated blade type male terminal, as also later discussed. Shown inFIG.2is the first embodiment of the tubular high current female terminal1of this invention having similar members or parts, as described above with respect toFIG.1, except for a core terminal30of a second type. Shown inFIG.2is the core terminal30of the second type having, as with the first type core terminal5, a plurality of spring contacts34,36, and an elongated opening39,40that matches so as to fit inside the elongated opening12of the elongated mating portion7of the outer terminal3. Each elongated opening39,40has two longitudinal sides42,44for mating with an elongated blade type male terminal, as also later discussed (see,FIGS.3and4). Attached to the longitudinal sides42,44of the elongated opening40of the core terminal30of the second type are latches48,50, respectively. As will be discussed later, the latches48,50will be coupled to longitudinal sides49,51, respectively, of the elongated opening12of the elongated mating portion7of the outer terminal3upon full insertion of the core terminal30of the second type into the elongated mating portion7. The tubular high current female terminal1of this invention is shown inFIG.3illustrating the second type of the core terminal30and an elongated blade type male terminal52for insertion into the core terminal30. As shown inFIG.4, the latches48,50of the core terminal30of the second type are attached to the longitudinal sides49,51, respectively, of the elongated opening12of the elongated mating portion7of the outer terminal3. The spring contacts36of the core terminal30of the second type are seen through the elongated opening12of the elongated mating portion7. Also shown inFIGS.3and4are the elongated mating portion7and the termination portion9being integrally linked therebetween through a transit portion6. FIG.5shows the core terminal5of the first type having the plurality of spring contacts24,26. The core terminal5has, at each of opposing ends thereof, an elongated opening13,14that matches so as to fit inside the elongated opening12of the elongated mating portion7of the outer terminal3(see,FIG.1). Each elongated opening13,14of the core terminal5has two longitudinal sides18,20for mating with the elongated blade type male terminal52. The longitudinal sides18,20of the elongated openings13,14of the core terminal5also act as end supports for the plurality of spring contacts24,26. In approximately the middle of the longitudinal sides18,20and the plurality of spring contacts24,26is a spring beam60, which acts as the contact point between the core terminal5and the elongated blade type male terminal52. Maximizing the number of spring contacts24,26ensures the lowest electric contact resistance mating with the elongated blade type male terminal52. As further illustrated inFIG.5, the core terminal5has a non-cylindrical geometry to match or correspond with the elongated opening12of the elongated mating portion7of the outer terminal3and to mate with the elongated blade type male terminal52. Moreover, the core terminal5, when manufactured, is at first a strip, then formed or folded in a formation, as illustrated inFIG.5with a seam65extending between the longitudinal sides18,20of the elongated openings13,14. As described above with respect to the core terminal5inFIG.5, the core terminal30inFIG.6similarly shows the core terminal30of the second type having the plurality of spring contacts34,36. The core terminal30has, at each of opposing ends thereof, an elongated opening39,40that matches so as to fit inside the elongated opening12of the elongated mating portion7of the outer terminal3(see,FIG.2). Each elongated opening39,40of the core terminal30has two longitudinal sides42,44for mating with the elongated blade type male terminal52(see,FIG.4). Attached to the longitudinal sides42,44of the elongated opening40of the core terminal30of the second type are latches48,50, respectively. Each latch48,50is substantially C-shaped in form or configuration capable of attaching to the longitudinal sides49,51, respectively, of the elongated opening12of the elongated mating portion7of the outer terminal3upon full insertion of the core terminal30of the second type into the elongated mating portion7(see,FIG.4). The longitudinal sides42,44of the elongated openings39,40of the core terminal30also act as end supports for the plurality of spring contacts34,36. In approximately the middle of the longitudinal sides42,44and the plurality of spring contacts34,36is a spring beam70, which acts as the contact point between the core terminal30and the elongated blade type male terminal52. Maximizing the number of spring contacts34,36ensures the lowest electric contact resistance mating with the elongated blade type male terminal52. As further illustrated inFIG.6, the core terminal30has a non-cylindrical geometry to match or correspond with the elongated opening12of the elongated mating portion7of the outer terminal3and to mate with the elongated blade type male terminal52. Moreover, the core terminal30, when manufactured, is at first a strip, then formed or folded in a formation, as illustrated inFIG.6with a seam75extending between the longitudinal sides42,44of the elongated openings39,40. FIG.7illustrates the third type of the core terminal80having a plurality of spring contact beams83,85. The core terminal80is non-cylindrical. The core terminal80is stamped and folded along an insertion direction; that is, an insertion direction toward the elongated opening12of the elongated mating portion7of the outer terminal3. Extending across the middle of the plurality of spring contacts83,85are spring beams87,89, respectively, which act as the multiple contact points between the core terminal80and the elongated blade type male terminal52. When the stamped core terminal80is folded, as shown inFIG.7, the upper and lower portions of the folded core terminal80are substantially symmetrical. At the ends of the core terminal80are elongated members100,102; and attached to the elongated members100,102are latches103,105, respectively. As in the core terminal30of the second type, each of the latches103,105of the core terminal80of the third type is substantially C-shaped in form or configuration capable of attaching to the longitudinal sides49,51, respectively, of the elongated opening12of the elongated mating portion7of the outer terminal3upon full insertion of the core terminal80of the third type into the elongated mating portion7(see,FIG.4). As further illustrated inFIG.7, the latches103,105have substantially symmetrical features. Also, the latches103,105have lead-in and guide features when the elongated blade type male terminal52is inserted into the core terminal80. The latches103,105also support the insertion force applied by the elongated blade type male terminal52upon insertion thereof into the core terminal80. Furthermore, the latches103,105efficiently position and latch the core terminal80inside the elongated mating portion7when the latches103,105are attached onto the longitudinal sides49,51, respectively, of the elongated opening12of the elongated mating portion7of the outer terminal3. An end of the core terminal80, opposite the latches103,105, is a leading end108, which faces the elongated opening12of the elongated mating portion7of the outer terminal3upon insertion of the core terminal80, as shown inFIG.8. The leading end108of the core terminal80is, as can be seen inFIGS.7and8, the folded portion of the originally stamped core terminal80and folded at the leading end108along the insertion direction towards the elongated opening12of the elongated mating portion7of the outer terminal3. InFIG.8, the leading end108of the core terminal80of the third type enters the elongated opening12of the elongated mating portion7of the outer terminal3. The core terminal108, in its entirety, enters and is accommodated within the elongated mating portion7of the outer terminal3. Thereafter, the latches103,105efficiently position and latch the core terminal80inside the elongated mating portion7when the latches103,105are attached onto the longitudinal sides49,51, respectively, of the elongated opening12of the elongated mating portion7of the outer terminal3. Upon insertion of the core terminal108inside the elongated mating portion7, the core terminal80is positioned to accept therein the elongated blade type male terminal52. During insertion of the elongated blade type male terminal52, it is lead in and guided by the latches103,105attached to the longitudinal sides49,61of the elongated opening12of the elongated portion7of the outer terminal3. The insertion force applied by the elongated blade type male terminal52is also supported by the latches103,105. Upon full insertion of the elongated blade type male terminal52into the core terminal80, the spring beams87,89that extend across and between the plurality of spring contacts83,85act as the multiple contact points between the core terminal80and the elongated blade type male terminal52. It is preferable that the contact area110of the elongated blade type male terminal52is elongated in shape to maximize the contacts of the elongated blade type male terminal52with the spring beams87,89of the core terminal80. As discussed above, the first embodiment of the tubular high current female terminal1of this invention is comprised of an outer terminal3and a core terminal5,30,80. The outer terminal3includes the elongated mating portion7and the termination portion9. The termination portion9is connected to an electric cable or an electric component115, as shown inFIG.9AandFIG.9B. InFIG.9A, the termination portion9of the outer terminal3is connected, by welding, crimping, or mechanical fastening, to an electric cable115such that the longitudinal directions along which the tubular high current female terminal1and the electric cable115extend are perpendicular. InFIG.9B, the termination portion9of the outer terminal3is connected, by welding, crimping, or mechanical fastening, to the electric cable115such that the longitudinal directions along which the tubular high current female terminal1and the electric cable115extend are parallel. As discussed above with respect to, for example,FIG.4, the tubular high current female terminal1is comprised of the outer terminal3and the core terminal5,30,80. The outer terminal3includes the elongated mating portion7and the termination portion9with the elongated mating portion7housing therein the core terminal5,30,80. InFIG.10, the termination portions9of the outer terminals3of two tubular high current female terminals1of the first embodiment of this invention are fastened together, by welding or mechanical fastening (such as, bolting) so that the longitudinal directions along which the tubular high current female terminals1extend are perpendicular. With the above-discussed structural arrangement, as illustrated inFIG.10, the elongated blade type male terminals52, which respectively mate with the core terminals30,80and are respectively secured inside the core terminals5,30,80, allow the tubular high current female terminals52to respectively mate at substantially 90° with the core terminals30,80. A second embodiment of the tubular high current female terminal200of this invention, as shown inFIG.11, is a single uniform outer terminal210having substantially symmetrical opposite ends each end having an elongated opening212,214for 1800 mating with two opposing elongated blade type male terminals52. Accommodated within the tubular current female terminal200are two core terminals5,30,80(shown inFIG.11is a core terminal of the second type 30 or the third type 80) respectively attached onto the elongated openings212,214with the latches48,50or latches103,105(see,FIGS.6and7). The tubular high current female terminal200is shown inFIG.11in a 180° mating state with two elongated blade type male terminals52, which respectively enter the opposing elongated openings212,214of the single uniform outer terminal210. Although the core terminals5,30,80are described in the second embodiment of the tubular high current female terminal200of this invention as being two core terminals5,30,80, each core terminal5,30,80can also be a single core terminal5,30,80contacting both elongated blade type male terminals52from opposite mating portions respectively having the opposing elongated openings212,214. A third embodiment of the tubular high current female terminal300of this invention, as shown inFIG.12A, is also a single piece outer terminal310having substantially symmetrical opposite ends each end having an elongated opening312,314for mating at any pre-set angle with two opposing elongated blade type male terminals52. The two symmetrical mating portions respectively having the elongated openings312,314are integrally linked therebetween through the transit portion. Accommodated within the tubular high current female terminal300are two core terminals5,30,80(shown inFIG.11is a core terminal30of the second type or a core terminal80of the third type) respectively attached onto the elongated openings312,314with the latches48,50or latches103,105. The tubular high current female terminal300is shown inFIG.12Ain any pre-set angle mating state with two elongated blade type male terminals52, which respectively enter the opposing elongated openings312,314of the single piece outer terminal310. A fourth embodiment of the tubular high current female terminal400of this invention, as shown inFIG.12B, is yet another single piece outer terminal410having substantially symmetrical opposite ends each end having an elongated opening412,414for mating at a substantially 90° angle with two opposing elongated blade type male terminals52. The two symmetrical mating portions respectively having the elongated openings412,414are integrally linked therebetween through the transit portion. Accommodated within the tubular current female terminal400are two core terminals5,30,80(shown inFIG.12Bis a core terminal30of the second type or a core terminal80of the third type) respectively attached onto the elongated openings412,414with the latches48,50or latches103,105(see,FIGS.6and7). The tubular high current female terminal400is shown inFIG.12Bin a pre-set substantially 90-degree angle mating state with two elongated blade type male terminals52, which respectively enter the opposing elongated openings412,414of the single piece outer terminal410. As discussed above in the second embodiment of the tubular high current female terminal200, in the third embodiment300(FIG.12A) and fourth embodiment400(FIG.12B) of the high current female terminal of this invention, each core terminal5,30,80can similarly be a single core terminal5,30,80contacting both elongated blade type male terminals52from opposite mating portions respectively having the opposing elongated openings312,314or opposing elongated openings412,414. A fifth embodiment of the tubular high current female terminal, generally referred to as reference number500and as shown inFIG.13, includes an outer terminal503and the core terminal5. Although the core terminal5of the first type is shown inFIG.13, the core terminals30,80of the second and third types are similarly applicable. The outer terminal503includes an elongated mating portion507, which is structured substantially similarly as the elongated mating portion7of the first embodiment of the tubular high current female terminal1. The termination portion509, however, of this fifth embodiment of the tubular high current female terminal500is in the form of a cylindric tube attachable to an electric cable by, e.g., crimping. The elongated mating portion507and the termination portion509are integrally linked therebetween through a transit portion506. Material cut-out508in the transit portion506is to ease and facilitate the forming process of the mating portion507and termination portion509with different profiles in the manufacturing of the outer terminal503. A sixth embodiment of the tubular high current female terminal, generally referred to as reference number600and as shown inFIG.14, includes an outer terminal603and a core terminal611of a fourth type. The outer terminal603includes an extended cylindrical mating portion607and a termination portion609. It is preferable that the extended cylindrical mating portion607and the termination portion609are integrally linked therebetween through a transit portion606. The extended cylindrical mating portion607has a substantially circular opening612for allowing the core terminal611of the fourth type to pass therethrough so as to ultimately be accommodated within the extended cylindrical mating portion607. As in the core terminals5,30,80, the core terminal603is preferably stamped and folded in a circular form so as to pass through the circular opening612of the extended cylindrical mating portion607and be accommodated therein. An extended cylindric type male terminal620is inserted into the circular opening612of the extended cylindrical mating portion607so as to mate with the core terminal611attached therein. The termination portion609is attachable to an electric cable or an electric conductor (e.g., a busbar terminal, or the like) by welding, crimping, or mechanical fastening. The high current female terminal600is of a tubular design with an overall profile that can be readily pre-formed with high precision and pre-formed to fit therein the extended cylindric type male terminal620. The outer terminal603is preferably a single-piece, low profile, and robust structure or configuration to support and protect the core terminal611. The outer terminal603is also preferably made of a pre-formed tube without the need for machining, which, as mentioned earlier, is inefficient and low in productivity. The core terminal611includes a plurality of spring contacts624; and the core terminal611is preferably folded and configured so as to match and fit inside the circular opening612of the extended cylindrical mating portion607of the outer terminal603. The present invention is not limited to the above-described embodiments; and various modifications in design, structural arrangement or the like may be used without departing from the scope or equivalents of the present invention. | 20,491 |
11862883 | DETAILED DESCRIPTION The present invention is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Various embodiments of the invention are now described in detail. Referring to the drawings, like numbers indicate like components throughout the views. As used in the description herein and throughout the claims that follow, the meaning of “a”, “an”, and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise. Moreover, titles or subtitles may be used in the specification for the convenience of a reader, which shall have no influence on the scope of the present invention. It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Furthermore, relative terms, such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The exemplary term “lower”, can therefore, encompasses both an orientation of “lower” and “upper,” depending of the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. The exemplary terms “below” or “beneath” can, therefore, encompass both an orientation of above and below. As used herein, “around”, “about” or “approximately” shall generally mean within 20 percent, preferably within 10 percent, and more preferably within 5 percent of a given value or range. Numerical quantities given herein are approximate, meaning that the term “around”, “about” or “approximately” can be inferred if not expressly stated. As used herein, the terms “comprising”, “including”, “carrying”, “having”, “containing”, “involving”, and the like are to be understood to be open-ended, i.e., to mean including but not limited to. The description will be made as to the embodiments of the present invention in conjunction with the accompanying drawings inFIGS.1-14. In accordance with the purposes of this invention, as embodied and broadly described herein, this invention, in one aspect, relates to an electrical connector. As shown inFIG.2,FIG.8andFIG.12, in the electrical connector100according to certain embodiments of the present invention, a vertical direction (a direction for the conductive terminals2to be assembled to the insulating body1) and a left-right direction (a horizontal direction) are defined. In other embodiments, the vertical direction and the left-right direction may switch. FIG.1toFIG.6show an electrical connector100according to a first embodiment of the present invention, which includes an insulating body1and a plurality of conductive terminals2accommodated in the insulating body1. The conductive terminals2are arranged in a plurality of rows along a front-rear direction, and the conductive terminals2upward abut a first electronic component200located thereabove and downward abut a second electronic component300located therebelow. As shown inFIG.2,FIG.4andFIG.6, the insulating body1is provided with a plurality of accommodating slots11. Each accommodating slot11has a first receiving space111, a second receiving space112, a third receiving space113and a fixing space114in communication with one another. Two sides of the second receiving space112are respectively in communication with the first receiving space111and the third receiving space113. The fixing space114is in communication with the third receiving space113. A left side of each accommodating slot11is provided with a position limiting portion115, and a lower side of each accommodating slot11is provided with a stopping portion116. As shown inFIG.4,FIG.5andFIG.6, each conductive terminal2includes: a base portion21, located in the third receiving space113; a connecting portion22extending from one side of the base portion21; a first elastic arm24and a second elastic arm25extending from the connecting portion22toward a direction away from the same one side of the base portion21, where the first elastic arm24and the second elastic arm25are suspended in the first receiving space111, and the connecting portion22is suspended in the second receiving space112; the location of the first elastic arm24adjacent to the connecting portion22and the location of the second elastic arm25adjacent to the connecting portion22are connected to form a bridge portion23; and a fixing portion26extending from another side of the base portion21. The fixing portion26and the first elastic arm24are respectively located at different sides of the base portion. Compared to the case where the fixing portion26and the first elastic arm24are located at a same side of the base portion21, in the scenario where the heights of the first elastic arm24and the second elastic arm25are identical, the fixing portion26does not need to occupy a certain height, which is conducive to the thinness of the electrical connector100. Further, the first elastic arm24, the second elastic arm25, the connecting portion22, the base portion21and the fixing portion26are located on the same plane, and are formed by punching and blanking, which are thus easy to manufacture. Further, the normal forces of the first elastic arm24and the second elastic arm25respectively abutting the first electronic component200and the second electronic component300are large. As shown inFIG.4,FIG.5andFIG.6, the connecting portion22is located in the second receiving space112. The connecting portion22extends obliquely from the base portion21toward the second electronic component300and is connected to the first elastic arm24and the second elastic arm25. The connecting portion22is relatively away from the second elastic arm25and close to the first elastic arm24. A width of the connecting portion22is less than a width of the base portion21, the width of the connecting portion22is less than a width of a location of the first elastic arm24adjacent to the connecting portion22, and the width of the connecting portion22is less than a width of a location of the second elastic arm25adjacent to the connecting portion22. Thus, the elasticity of the connecting portion22is good. Further, a first gap G1exists between the connecting portion22and an inner wall of the second receiving space112. When the first elastic arm24abuts the first electronic component200and the second elastic arm25abuts the second electronic component300, the connecting portion22is applied with a force and elastically deform in the first gap G1. As shown inFIG.4,FIG.5andFIG.6, the first elastic arm24and the second elastic arm25are located in the first receiving space111. A second gap G2exists between the first elastic arm24and an inner wall of the first receiving space111, and a third gap G3exists between the second elastic arm25and the inner wall of the first receiving space111. The first gap G1and the third gap G3are directly in communication with each other. The first elastic arm24and the second elastic arm25are suspended in the first receiving space111, and the connecting portion22is suspended in the second receiving space112. When the first elastic arm24abuts the first electronic component200and the second elastic arm25abuts the second electronic component300, the bridge portion23, the connecting portion22, the first elastic arm24and the second elastic arm25are applied with forces and elastically deform altogether on a plane in a force applying direction. The first elastic arm24and the second elastic arm25may perform adjustments at a maximum degree, thereby accurately abut the first electronic component200and the second electronic component300, without having abutting failures. Further, by forming the first elastic arm24and the second elastic arm25by punching and blanking and providing the first elastic arm24and the second elastic arm25symmetrically, the manufacturing is easy, and the normal forces of the first elastic arm24and the second elastic arm25respectively abutting the first electronic component200and the second electronic component300are large to perform compensation. Thus, the elasticity and contact forces are altogether balanced, such that the first electronic component200and the second electronic component300may be electrically connected with each of the conductive terminals2accurately. As shown inFIG.4,FIG.5andFIG.6, the fixing portion26is fixedly provided in the fixing space114. The fixing portion26abuts inner walls of the position limiting portion115and the stopping portion116. The fixing portion26extends toward the second electronic component300and passes beyond the bridge portion23or is flush with the bridge portion23, which is conducive to extending the height of the fixing portion26, such that the contact between the fixing portion26and the corresponding accommodating slot11is more stable, thereby ensuring the stability of each conductive terminal2in the corresponding accommodating slot11. In the assembly and application of the electrical connector100, each conductive terminal2is inserted into the corresponding accommodating slot11downward from top thereof, until the fixing portion26abuts the inner walls of the position limiting portion115and the stopping portion116and is fixed in the fixing space114. The first elastic arm24passes upward beyond the corresponding accommodating slot11to upward abut the first electronic component200, and the second elastic arm25passes downward beyond the corresponding accommodating slot11to downward abut the second electronic component300. FIG.7toFIG.10show an electrical connector100according to a second embodiment of the present invention. As shown inFIG.7,FIG.9andFIG.10, the main differences of this embodiment from the first embodiment exist in that: each accommodating slot11has a first position limiting slot117and a second position limiting slot118, and a width of the first position limiting slot117is less than a width of the second position limiting slot118. The connecting portion22is formed by bending 90° laterally and extending from the base portion21. Each of the first elastic arm24and the second elastic arm25is provided to form a 90° included angle with the base portion21. Two fixing portions261and262respectively extend from different sides of the base portion21, the first fixing portion261is fixed in the first position limiting slot117, and the second fixing portion262is fixed in the second position limiting slot118. A length of the first fixing portion261is less than a length of the second fixing portion262. The connecting portion22is located between the first fixing portion261and the second fixing portion262, and gaps exist between the connecting portion22and the first fixing portion261and between the connecting portion22and the second fixing portion262. The first fixing portion261is fixed in the first position limiting slot117after being inserted into the first position limiting slot117from the second position limiting slot118. The first fixing portion261and the second fixing portion262extend beyond the connecting portion22and abut the inner wall of the corresponding accommodating slot11, such that the fixing of each conductive terminal2is more stable. Compared to the first embodiment, in the second embodiment, each of the first elastic arm24and the second elastic arm25is provided to form a 90° included angle with the base portion21, and the length of each conductive terminal2is reduced. Further, the lengths of the elastic arms almost extend to reach the length of the whole conductive terminal2, thereby achieving density of the conductive terminals2. In other words, the first embodiment and the second embodiment may be used to match with different usage occasions. Other structures of this embodiments are basically identical to those of the first embodiment, and are thus not further hereinafter elaborated. In the assembly and application of the electrical connector100, each conductive terminal2is inserted into the corresponding accommodating slot11downward from top thereof, and the first fixing portion261is fixed in the first position limiting slot117after being inserted into the first position limiting slot117from the second position limiting slot118. The first elastic arm24passes upward beyond the corresponding accommodating slot11to upward abut the first electronic component, and the second elastic arm25passes downward beyond the corresponding accommodating slot11to downward abut the second electronic component300. FIG.11toFIG.14show an electrical connector100according to a third embodiment of the present invention. As shown inFIG.11,FIG.13andFIG.14, the main differences of this embodiment from the second embodiment exist in that: the connecting portion22is formed by bending 180° reversely and extending from the base portion21, and each of the first elastic arm24and the second elastic arm25is provided to form an 180° included angle with the base portion21. The base portion21, the first elastic arm24and the second elastic arm25are parallel to one another. Compared to the second embodiment, in the third embodiment, the connecting portion22bends and extends reversely from the base portion21, and each of the first elastic arm24and the second elastic arm25is provided to form an 180° included angle with the base portion21. The connecting portion22bends and extends reversely from the base portion21, and the base portion21, the first elastic arm24and the second elastic arm25are parallel to one another. In the second embodiment, the width of each conductive terminal2along the front-rear direction is the width of the second fixing portion262. In a scenario where the length of the conductive terminal2is not changed, in the third embodiment, the width of each conductive terminal2along the front-rear direction is less than the width of the second fixing portion262, thereby allowing density of the conductive terminals2. Further, the first fixing portion261and the second fixing portion262extend beyond the connecting portion22and abut the inner wall of the corresponding accommodating slot11, such that the fixing of each conductive terminal2is more stable. Other structures of this embodiments are basically identical to those of the second embodiment, and are thus not further hereinafter elaborated. In sum, the electrical connector100according to certain embodiments of the present invention has the following beneficial effects: (1) The first elastic arm24and the second elastic arm25are formed by punching and blanking, and are thus easy to manufacture. Further, the normal forces of the first elastic arm24and the second elastic arm25abutting the first electronic component200and the second electronic component300are large. The connecting portion22, the first elastic arm24and the second elastic arm25on the plane form gaps with the inner wall of the corresponding accommodating slot11, and the connecting portion22, the first elastic arm24and the second elastic arm25may all elastically deform. Further, the width of the connecting portion22is less than the width of the base portion21, the width of the connecting portion22is less than the width of the location of the first elastic arm24adjacent to the connecting portion22, and the width of the connecting portion22is less than the width of the location of the second elastic arm25adjacent to the connecting portion22. Compared to the case where a conductive terminal2has a connecting portion22with a greater width, the connecting portion22has better elasticity, which is conducive to maintaining the good elastic pressing contact between the first elastic arm24and the contact point of the first electronic component200and between the second elastic arm25and the contact point of the second electronic component300. The fixing portion26and the first elastic arm24are located at different sides of the base portion21. Compared to the case where the fixing portion26and the first elastic arm24are located at a same side of the base portion21, in the scenario where the heights of the first elastic arm24and the second elastic arm25are identical, the fixing portion26in the present invention does not need to occupy a certain height, which is conducive to the thinness of the electrical connector. By reducing the heights thereof, the movements of the first elastic arm24and the second elastic arm25along the vertical direction are not affected by the corresponding distances from the fixing portion26, such that the ranges of the movements are larger, thus maintaining better elasticity of the first elastic arm24and the second elastic arm25. (2) The connecting portion22extends obliquely from the base portion21toward the second electronic component300and is connected to the first elastic arm24and the second elastic arm25, which is conducive to reducing the height of the first elastic arm24, thereby reducing the overall height of each conductive terminal2, and lengthening the first elastic arm24and the second elastic arm25, thereby achieving good elasticity and thinness. (3) The connecting portion22is relatively away from the second elastic arm25and close to the first elastic arm24, and the fixing portion26extends toward the second electronic component300and passes beyond the bridge portion23or is flush with the bridge portion23, which is conducive to extending the height of the fixing portion26, such that the contact between the fixing portion26and the corresponding accommodating slot11is more stable, thereby ensuring the stability of each conductive terminal2in the corresponding accommodating slot11. (4) The connecting portion22is formed by bending 90° laterally and extending from the base portion21, and each of the first elastic arm24and the second elastic arm25is provided to form a 90° included angle with the base portion21. Compared to the case where the base portion21is located behind the first elastic arm24and the second elastic arm25, the length of each conductive terminal2is reduced, and the lengths of the elastic arms almost extend to reach the length of the whole conductive terminal2, thereby achieving density of the conductive terminals2. (5) The connecting portion22is formed by bending 180° reversely and extending from the base portion21, and each of the first elastic arm24and the second elastic arm25is provided to form an 180° included angle with the base portion21. The base portion21, the first elastic arm24and the second elastic arm25are parallel to one another. Compared to the case where the base portion21is located behind the first elastic arm24and the second elastic arm25, the length of each conductive terminal2is reduced, and the lengths of the elastic arms almost extend to reach the length of the whole conductive terminal2, thereby achieving density of the conductive terminals2. Further, the width of each conductive terminal2along the front-rear direction is reduced, which is further conducive to the density of the conductive terminals2. The foregoing description of the exemplary embodiments of the invention has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to explain the principles of the invention and their practical application so as to activate others skilled in the art to utilize the invention and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present invention pertains without departing from its spirit and scope. Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein. | 20,871 |
11862884 | DETAILED DESCRIPTION Embodiments of the disclosed surgical instrument are described in detail with reference to the drawings, wherein like reference numerals designate corresponding elements in each of the several views. As is common in the art, the term “proximal” refers to that part or component closer to the user or operator, e.g., surgeon or physician, while the term “distal” refers to that part or component farther away from the user. FIGS.1-6illustrate a surgical instrument in accordance with an aspect of the disclosure generally designated as reference numeral100. While the surgical instrument100in the accompanying figures is depicted as a surgical stapling instrument, the surgical instrument100of the disclosure is not limited to a surgical stapling instrument; the surgical instrument100may be any suitable surgical instrument including but not limited to a vessel sealing instrument, a surgical grasper, a surgical clip applier, a circular stapling instrument, etc. With particular reference toFIG.1, the surgical instrument100includes a housing105, a handle assembly110, an adapter assembly115, an elongated portion120extending distally from the adapter assembly115and defining a longitudinal axis “A-A,” and a loading unit200engaged with a distal end of the elongated portion120. The loading unit200includes a proximal portion210and an end effector220, and is releasably engageable with the elongated portion120. WhileFIG.1illustrates the surgical instrument100including a powered handle assembly including a first actuator112and a second actuator114, other types of handles can be used such as, for example, those including a pivotable handle, motor-driven, hydraulic, ratcheting, etc. As used herein, “handle assembly” encompasses all types of handle assemblies. Additionally, the surgical instrument100and components thereof are usable as part of a robotic surgical system. Referring now toFIGS.2and3, details of the loading unit200are shown. The proximal portion210of the loading unit200includes a plurality of electrical contacts250adjacent a proximal end212thereof. Each electrical contact of the plurality of electrical contacts250is configured to store and relay information, and may either include or be in electrical communication with an electronic component270via leads272, for instance (shown schematically inFIG.4). The electronic component270may be a storage device, such as an EPROM or any suitable flash storage device, configured to store information relating to the type of end effector220(e.g., used for surgical stapling, vessel sealing, etc.) included on the loading unit200, the length of the loading unit200, the diameter of the loading unit200, the number of fasteners included within the end effector220, etc. In aspects, the electronic component270may be a sensor or an actuator. With reference toFIG.4, each electrical contact of the plurality of electrical contacts250includes an arm252and a finger260. A distal end254of the arm252is engaged with a mounting portion214of the proximal portion210of the loading unit200. The finger260of each electrical contact of the plurality of electrical contacts250extends proximally from a proximal end256of the arm252. In this arrangement, the finger260and parts of the arm252of each electrical contact of the plurality of electrical contacts250are cantilevered thereby enabling portions of the plurality of electrical contacts250to flex toward and away from the longitudinal axis “A-A.” In aspects, the structure of the plurality of electrical contacts250biases the plurality of electrical contacts250radially outward away from the longitudinal axis “A-A.” With particular reference toFIGS.4-6, engagement between the loading unit200and the elongated portion120of the surgical instrument100is shown. For clarity, an outer wall122of the elongated portion120is shown in phantom inFIG.4and is omitted inFIGS.5and6. The elongated portion120includes an engagement interface130that is configured to selectively engage portions of the loading unit200. More particularly, the engagement interface130of the elongated portion120includes a base140, a plurality of electrical contacts150, a loading linkage160, and a biasing element170. In aspects, the number of electrical contacts of the plurality of electrical contacts150of the elongated portion120is equal to the number of electrical contacts of the plurality of electrical contacts250of the loading unit200. In other aspects, the number of electrical contacts of the plurality of electrical contacts150of the elongated portion120is greater than or less than the number of electrical contacts of the plurality of electrical contacts250of the loading unit200. Referring toFIG.4, each electrical contact of the plurality of electrical contacts150of the elongated portion120includes a plurality of segments152. More particularly, in the illustrated aspect, each electrical contact of the plurality of electrical contacts150includes five segments152: a first segment152a, a second segment152b, a third segment152c, a fourth segment152d, and a fifth segment152e. Each electrical contact of the plurality of electrical contacts150may include more or fewer than five segments152. Additionally, in the illustrated aspect, the first segment152a, the third segment152c, and the fifth segment152eare parallel or generally parallel to each other and to the longitudinal axis “A-A,” and the second segment152band the fourth segment152dare disposed at angles relative to their adjoining segments such that the second segment152b, the third segment152c, and the fourth segment152dform a flat-bottom V-shape. Further, in aspects, the plurality of electrical contacts150is made of sheet metal. Upon engagement between the loading unit200and the elongated portion120of the surgical instrument100, the plurality of electrical contacts250of the loading unit200are moved proximally relative to the plurality of electrical contacts150of the elongated portion120. Upon initial engagement, and as shown inFIG.5, the plurality of electrical contacts250of the loading unit200and the plurality of electrical contacts150of the elongated portion120are free from physical contact with each other. Upon continued and full engagement, and as shown inFIGS.4and6, the plurality of electrical contacts250of the loading unit200and the plurality of electrical contacts150of the elongated portion120are in physical contact with each other. More particularly, in this position, the third segment152cof each electrical contact of the plurality of electrical contacts150of the elongated portion120is in physical contact with the finger260of one electrical contact of the plurality of electrical contacts250of the loading unit200(seeFIG.4). This engagement is facilitated by the angled fourth segment152dof the plurality of electrical contacts150of the elongated portion120, by a ramped proximal portion262of the finger260of the plurality of electrical contacts250of the loading unit200, and by the ability of both the plurality of electrical contacts150of the elongated portion120and the plurality of electrical contacts250of the loading unit200to be able to flex relative to the longitudinal axis “A-A,” for instance. With reference toFIGS.5and6, the base140, the loading linkage160, and the biasing element170are shown.FIG.5illustrates initial engagement between the loading unit200and the elongated portion120. Here, the loading linkage160is in a proximal position relative to the base140. In aspects, a portion of the base140may physically contact a portion of the loading linkage160to resist the distally-directed force of the biasing element170. Additionally, as discussed above, in this initial engagement, the plurality of electrical contacts150of the elongated portion120are not in physical contact with the plurality of electrical contacts250of the loading unit200. FIG.6illustrates complete engagement between the loading unit200and the elongated portion120. Here, the biasing element170has urged the loading linkage160to its distal position relative to the base140. Moreover, as discussed above, in this complete or full engagement, each electrical contact of the plurality of electrical contacts150of the elongated portion120is in physical contact with one electrical contact of the plurality of electrical contacts250of the loading unit200. Additionally, upon proper engagement, the information stored on the plurality of electrical contacts250and/or the electronic component270of the loading unit200is electrically communicated through the plurality of electrical contacts150of the elongated portion120, and through leads300(schematically illustrated inFIG.4), to a processor and/or storage unit350(schematically illustrated inFIG.4) which is engaged with the elongated portion120, the housing105, the handle assembly110, and/or the adapter assembly115, thereby allowing the surgical instrument100to receive the information stored on the loading unit200. While the above description contains many specifics, these specifics should not be construed as limitations on the scope of the present disclosure, but merely as illustrations of various embodiments thereof. Therefore, the above description should not be construed as limiting, but merely as exemplifications of various aspects. Those skilled in the art will envision other modifications within the scope and spirit of the claims appended hereto. | 9,419 |
11862885 | DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS First, embodiments of the present disclosure are listed and described. In a first aspect, an electric connection member according to the present disclosure, includes: a bus bar that has at least one terminal portion; a primary molded portion formed in one piece with the bus bar in a state where the terminal portion is exposed; a secondary molded portion formed in one piece with the primary molded portion; and seal member embedded in the secondary molded portion, wherein the primary molded portion includes an exposed portion that is exposed from an opening portion provided in the secondary molded portion, the seal member is shaped to surround the circumference of the exposed portion without a gap, and a boundary portion of the seal member to the secondary molded portion is heat sealed to the secondary molded portion. When molding the secondary molded portion, the primary molded portion and the bus bar can be kept from shifting as a result of using a die to hold the exposed portion of the primary molded portion during the secondary molding. Even if water enters from an opening portion of the secondary molded portion and reaches the exposed portion of the primary molded portion, the circumference of the exposed portion is surrounded, without a gap, by the seal member heat sealed to the secondary molded portion, and thus water is kept from moving past the exposed portion and into the secondary molded portion. Accordingly, the water-proofness of the electric connection member can be further improved. Preferably, in a second aspect of the present disclosure is the electric connection member according to (1), wherein the primary molded portion has a housing cavity that is formed in the shape of a recess and surrounds the circumference of the exposed portion, and the seal member is disposed in the housing cavity. By performing the simple procedure of fitting the seal member into the housing cavity, the seal member can be attached to the primary molded portion, and thus the manufacturing process of the electric connection member can be made more efficient. Preferably, in a third aspect of the present disclosure is the electric connection member according to (2), wherein one of the seal member and a wall surface of the housing cavity is provided with a press-fitting rib protruding toward the other of the seal member and the wall surface of the housing cavity, and the press-fitting rib comes into contact with the other of the seal member and the wall surface of the housing cavity. The seal member is firmly held against the wall surface of the housing cavity by the press-fitting rib. Accordingly, when molding the secondary molded portion, the seal member can be kept from coming loose from the primary molded portion. Preferably, in a fourth aspect of the present disclosure is the electric connection member according to any one of aspects described above, wherein the bus bar has at least two end portions, the two end portions are each provided with a terminal portion, and the exposed portion is provided in a portion of the primary molded portion that is different to where the terminal portions of the two end portions are provided. At least two terminal portions and the exposed portion can be held by the die, and thus the primary molded portion and the bus bar can be further kept from shifting when the secondary molded portion is molded. Preferably, in a fifth aspect of the present disclosure is the electric connection member according to the fourth aspect, wherein the terminal portions respectively provided at the two end portions extend in opposite directions relative to a plate surface of the bus bar, and the exposed portion and the terminal portion of the terminal portions respectively provided at the two end portions closer to the exposed portion are disposed on opposite sides relative to the plate surface of the bus bar. When molding the secondary molded portion, the primary molded portion can be kept from being subjected to an angular moment by the molten synthetic resin. A circuit unit according to a sixth aspect of the present disclosure, including: a case including the electric connection member according to any one of the first to fifth aspects; and a circuit portion housed in the case. Preferably, in a seventh aspect of the present disclosure is a circuit unit according to the sixth aspect, wherein the terminal portion includes an inner terminal portion disposed in the case and connected to the circuit portion, and an outer terminal portion disposed outside of the case and configured to be connected to an external circuit. The external circuit disposed outside of the case and the circuit portion inside the case can be electrically connected in a state where water-proofness is maintained by the electric connection member of the case. Embodiments of the present disclosure will be described below. The present disclosure is not limited to these examples, and is intended to include all modifications that are indicated by the claims and are within the meaning and scope of equivalents of the claims. Embodiment 1 Embodiment 1 of the present disclosure will be described with reference toFIGS.1to12. A circuit unit10is disposed on a power supply path between a power source such as a battery in vehicles including electric vehicles, hybrid vehicles, and gasoline-powered vehicles and a load realized by a vehicle-mounted electrical component such as a lamp or a driving motor. The circuit unit10can be disposed in any orientation, but in the following description, the direction indicated by the X arrow is the left direction, the direction indicated by the Y arrow is the forward direction, and the direction indicated by the Z arrow is the upward direction. When there is more than one of the same members, reference numerals may be given only to some of the members and omitted from other members. Circuit Unit10 As shown inFIG.1, the circuit unit10is provided with a case11and a circuit portion12housed in the case11. A heat dissipating member13that dissipates heat from the circuit unit10is attached to the lower side of the case11. Heat Dissipating Member13 The heat dissipating member13is formed into a plate shape and is made of a metal material with high thermal conductivity such as aluminum, an aluminum alloy, copper, or a copper alloy. As shown inFIG.2, the heat dissipating member13and the case11are screwed together using bolts14. Case11 As shown inFIG.1, for the case11, a lower case15and an upper cover16that closes off the upper side of the lower case15are joined in a liquid-proof state through heat sealing. In the present embodiment, the lower case15and the upper cover16are ultrasonically welded to each other. The lower case15and the upper cover16are integrated into a state where the lower case15and the upper cover16are joined to each other, and thus the lower case15and the upper cover16are marked with the same hatching inFIG.1. As shown inFIG.1, the lower case15includes a bottom wall17and a side wall18that extends upward from the side edge of the bottom wall17. The upper cover16includes an upper wall19and a side wall20that extends downward from the side edge of the upper wall19. The upper edge of the side wall18of the lower case15and the lower end edge of the side wall20of the upper cover16have the same shape, and as described above, are integrally joined through heat sealing. As shown inFIG.1, a circuit board22(an example of the circuit portion12) is housed in a housing space21formed between the lower case15and the upper cover16. A conductive path (not shown) is provided on the circuit board22by using a known printed wiring technique. Electronic devices23are disposed on the upper and lower sides of the circuit board22. The electronic devices23may be soldered to the conductive path. The electronic devices23are semi-conductor relays such as field effect transistors (FETs). The electronic devices23are not limited to semi-conductor relays, and may also be mechanical relays, resistors, coils, capacitors, or the like. A configuration may also be employed in which only the upper side or the lower side of the circuit board22is provided with electrical devices23. As shown inFIG.1, connection terminals24(examples of the circuit portion12) extending upward from the bottom wall17of the lower case15are disposed in the housing space21. The upper end portion of the connection terminals24passes through the circuit board22and extends to the upper side of the circuit board22. The connection terminals24and the conductive path of the circuit board22are soldered to each other. Lower Case15 As shown inFIG.1, the lower case15includes a plurality (four in the present embodiment) of bus bars25, a primary molded portion26formed around the bus bars25, and a secondary molded portion27formed around the primary molded portion26. The rear end portion of the lower case15is provided with a connector portion28(an example of an electric connection member) that is open downward. The connector portion28is configured to be fitted to an external connector (not shown). As shown inFIG.3, the bus bars25are formed by pressing a metal plate material into a predetermined shape. Each bus bar25is formed approximately into an S shape in a side view. As the metal forming the bus bars25, copper, a copper alloy, aluminum, an aluminum alloy, or the like can be selected as suitable. In the present embodiment, the bus bars25are made of copper or a copper alloy. The surface of each bus bar25may be provided with a plating layer. As the metal forming the plating layer, tin, solder, nickel, or the like can be selected as suitable. As shown inFIG.1, the front end portion of each bus bar25is an inner terminal portion29(an example of a terminal portion) that extends upward in the housing space21of the case11. The upper end portion of each inner terminal portion29passes through the circuit board22and extends to the upper side of the circuit board22. The inner terminal portions29and the conductive path of the circuit board22are soldered to each other. The rear end portion of each bus bar25is an outer terminal portion (an example of a terminal portion)30that is disposed extending downward inside the connecter portion28, and is electrically connected to an external circuit as a result of the connector portion28being connected to an external connector. Primary Molded Portion26 As shown inFIG.3, the primary molded portion26, which is made of an insulating thermoplastic resin, is formed in one piece with and surrounding the bus bars25. As the thermoplastic resin forming the primary molded portion26, polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), nylon, polypropylene (PP), polyethylene (PE), and the like can be selected as suitable. The thermoplastic resin forming the primary molded portion26may contain a filler such as glass fibers, talc, mica, or the like. As shown inFIG.4, the front end portion of the primary molded portion26is provided with a downward protruding portion31that extends downward at a position corresponding to the inner terminal portions29of the bus bars25. The downward protruding portion31is provided with a lower through-hole32extending therethrough in the front-rear direction. Front-side through-holes33extending in the vertical direction are provided at positions slightly reward of the downward protruding portion31. The bus bars25are exposed from the front-side through-holes33. As shown inFIG.4, at a position near the rear end portion of the primary molded portion26, rear-side through-holes34extending in the vertical direction are provided at positions slightly forward of the outer terminal portions30of the bus bars25. The bus bars25are exposed from the rear-side through-holes34. As shown inFIG.5, a plurality (two in the present embodiment) of exposed portions35depressed downward in the form of cavities are provided in the upper side of the primary molded portion26at positions near the rear end portion of the primary molded portion26and rearward of the outer terminal portions30of the bus bars25. The exposed portions35each have a circular shape as seen from above. As shown inFIG.6, the bottom surface and the inner wall surface of each exposed portion35are exposed to the outside from a corresponding opening portion36formed in the secondary molded portion27. Circumferential walls37respectively surrounding the exposed portions35are formed extending upward around each exposed portion35. As shown inFIG.7, the upper side of the primary molded portion26is provided with a housing cavity38formed by depressing a portion outward of each circumferential wall37downward. The outer wall surfaces of the circumferential walls37form wall surfaces of the housing cavity38. The housing cavity38is formed around the two exposed portions35. The hole edge portion of the housing cavity38has a racetrack shape that is elongated in the left-right direction, as seen from above. The upper edge of the housing cavity38is provided with an inclined surface39that is inclined upward and outward. Seal Member40 As shown inFIG.6, a seal member40is housed in the housing cavity38of the primary molded portion26. The seal member40is made of a thermoplastic elastomer resin. A polyester-based elastomer resin can be used as the elastomer resin forming the seal member40, for example. As shown inFIG.7, the outer shape of the seal member40matches the inner shape of the housing cavity38, and has a racetrack shape that is elongated in the left-right direction. The seal member40is provided with a plurality (two in the present embodiment) of through-holes41extending therethrough in the vertical direction and spaced apart from each other in the left-right direction. The inner shape of the through-holes41is substantially the same as the outer shape of the circumferential walls37. The inner wall surface of each through-hole41is provided with a plurality of press-fitting ribs42that extend in the vertical direction and are spaced apart from each other in the circumferential direction of the through-hole41. In the present embodiment, four press-fitting ribs42are equidistantly spaced apart from each other. The press-fitting ribs42are configured to abut against the outer wall surface (wall surface of the housing cavity38) of the corresponding circumferential wall37. Accordingly, the seal member40is held in the housing cavity38. In a state where the seal member40is fitted into the housing cavity38, the exposing portions35are surrounded by the seal member40without a gap in the circumference thereof. Secondary Molded Portion27 As shown inFIG.1, the secondary molded portion27, which is made of an insulating thermoplastic resin, is formed in one piece with the primary molded portion26, surrounding the primary molded portion26and the seal member40. The seal member40is embedded in the secondary molded portion27. As the thermoplastic resin forming the secondary molded portion27, polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), nylon, polypropylene (PP), polyethylene (PE), and the like can be selected as suitable. The thermoplastic resin forming the secondary molded portion27may contain a filler such as glass fibers, talc, mica, or the like. In the present embodiment, the secondary molded portion27is made of the same thermoplastic resin forming the primary molded portion26. In the present embodiment, the melting point of the thermoplastic resin forming the secondary molded portion27is higher than the melting point of the thermoplastic elastomer forming the seal member40. It is preferable that the thermoplastic resin forming the secondary molded portion27has high affinity to the thermoplastic resin forming the primary molded portion26. Also, it is preferable that the thermoplastic resin forming the secondary molded portion27has high affinity to the thermoplastic elastomer resin forming the seal member40. As shown inFIG.8, the opening portions36that are open upward are formed on the upper side of the secondary molded portion27at positions near the rear end portion and corresponding to the exposed portions35of the primary molded portion26. The inner shape of each opening portion36is a circular shape as seen from above. The exposed portions35of the primary molded portion26are exposed upward in the opening portions36. As shown inFIG.6, the inner wall surfaces of the opening portions36are formed flush with the inner wall surfaces of the circumferential walls37. As shown inFIG.1, the secondary molded portion27is filled into the lower through-hole32, the front-side through-holes33, and the rear-side through-holes34of the primary molded portion26. Accordingly, the secondary molded portion27, the primary molded portion26, and the bus bars25are firmly fixed. As shown inFIG.1, the connector portion28, which is open downward, is formed at a position near the rear end portion of the secondary molded portion27and corresponding to the outer terminal portions30of the bus bars25. The outer terminal portions30are arranged in the connector portion28. The connector portion28is configured to be fitted to an external connector (not shown). By fitting the external connector to the connector portion28, the outer terminal portions30of the bus bars25are electrically connected to an external circuit. Manufacturing Process of Circuit Unit10 An example of the manufacturing process of the circuit unit10according to the present embodiment is described below. Note that the manufacturing process of the circuit unit10is not limited to the following description. A metal plate material is pressed to form the bus bars25with a predetermined shape. The bus bars25are placed in an un-shown die, and primary molding is performed by pouring a thermoplastic resin into the die. Thus the primary molded portion26is formed (seeFIG.7). As shown inFIG.9, the seal member40is press fitted into the housing cavity38of the primary molded portion26from above. As a result of the press-fitting ribs42provided in the through-holes41of the seal member40abutting against the outer wall surfaces (wall surfaces of the housing cavity) of the circumferential walls37, the seal member40is held in the housing cavity38. As shown inFIG.10, the primary molded portion26is placed in a lower mold45. The lower mold45is provided with an outer terminal portion holding portion43that is open upward. The outer terminal portions30of the primary molded portion26are inserted into the outer terminal portion holding portion43from above. The upper end portion of the outer terminal portion holding portion43is configured to abut against the lower side of the primary molded portion26from below. Accordingly, the thermoplastic resin forming the secondary molded portion is kept from flowing into the connector portion28. Note that, in the present embodiment, the outer terminal portion holding portion43is described as being configured separate from the lower mold45, but the outer terminal portion holding portion43and the lower mold45may be formed in one piece. An upper mold46is brought toward the primary molded portion26placed in the lower mold45from above and a sliding mold47is brought toward the primary molded portion26from the rear side. The upper mold46is provided with an inner terminal portion holding portion44that is open downward. The inner terminal portions29of the primary molded portion26are inserted into the inner terminal portion holding portion44from below. The lower end portion of the inner terminal portion holding portion44is configured to abut against the upper side of the primary molded portion26from above. Accordingly, the thermoplastic resin forming the secondary molded portion is kept from adhering to the inner terminal portions29. The upper mold46is provided with support portions48that protrude downward. Each support portion48has a columnar shape extending downward. The outer diameter of the support portions48is set to be the same as the inner diameter of an exposed portion35. The support portions48are inserted into the exposed portions35from above, respectively. The lower end portions of the support portions48are configured to abut against the bottom surface of the exposed portions35from above, respectively. The side surfaces of the support portions48may abut against the inner wall surfaces of the exposed portions35. Accordingly, the primary molded portion26is kept from being shifted by molten thermoplastic resin during the secondary molding. Note that, in the present embodiment, the inner terminal portion holding portion44and the support portions48are described as being configured separate from the upper mold46, but the inner terminal portion holding portion44and the support portions48may be formed in one piece with the upper mold46. Secondary molding is performed by pouring a molten thermoplastic resin into the lower mold45, the upper mold46, and the sliding mold47. The melting point of the thermoplastic resin forming the secondary molded portion27is higher than the melting point of the thermoplastic elastomer forming the seal member40, and thus portions of the seal member40that come into contact with the thermoplastic resin melt. Then, the thermoplastic resin forming the secondary molded portion27is left to cool to solidify. In doing so, the boundary portion between the seal member40and the secondary molded portion27is heat sealed. As a result, the portions where the seal member40and the secondary molded portion27came into contact with each other are heat sealed and integrated with each other. Also, in the present embodiment, the same material is used for the thermoplastic resin forming the primary molded portion26and the thermoplastic resin forming the secondary molded portion27, and thus, when a molten thermoplastic resin is poured into the lower mold45, the upper mold46, and the sliding mold47and the molten thermoplastic resin comes into contact with the surface of the primary molded portion26, the surface of the primary molded portion26is melted. Then, by leaving the molten thermoplastic resin to cool, the thermoplastic resin forming the secondary molded portion27is solidified. Accordingly, the surface of the primary molded portion26and the secondary molded portion27are integrated with each other. In this way, the secondary molded portion27and the lower case15are formed (seeFIG.11). The connection terminals24are attached to the lower case15. The circuit board22on which the electronic devices23are mounted is soldered to the connection terminals24and the inner terminal portions29. The upper cover16is formed through injection molding using a thermoplastic synthetic resin. By performing ultrasonic vibration in a state in which the lower end edge of the side wall of the upper cover16and the upper edge of the side wall of the lower case15are in contact with each other, the upper cover16and the lower case15are heat sealed to each other (seeFIG.12). The lower case15and the heat dissipation member13are screwed together using bolts14. Accordingly, the circuit unit10is complete (seeFIG.2). Operative Effects of the Present Embodiment Operative effects of the present embodiment will be described below. The connector portion28according to the present embodiment includes: bus bars25that each have an inner terminal portion29and an outer terminal portion30; a primary molded portion26formed in one piece with the bus bars25in a state where the inner terminal portions29and the outer terminal portions30are exposed; a secondary molded portion27formed in one piece with the primary molded portion26; and a seal member40embedded in the secondary molded portion27. The primary molded portion26includes exposed portions35respectively exposed from opening portions36provided in the secondary molded portion27, the seal member40is shaped to surround the circumference of the exposed portions35without a gap, and a boundary portion between the seal member40and the secondary molded portion27is heat sealed to the secondary molded portion27. The circuit unit10according to the present embodiment is provided with a case11that has the connector portion28and a circuit portion12housed in the case11. As a result of holding the exposed portions35of the primary molded portion26by using a die when molding the secondary molded portion27, the primary molded portion26and the bus bars25are kept from being shifted during the secondary molding. Even if water enters through an opening portion36of the secondary molded portion27and reaches an exposed portion35of the primary molded portion26, the circumference of the exposed portion35is surrounded, without a gap, by the seal member40that is thermally sealed to the secondary molded portion27, and thus water is kept from moving past the exposed portion35and into the secondary molded portion27. Thus, the water proofness of the electric connection member can be improved. With the present embodiment, the primary molded portion26includes the housing cavity38that is formed in the shape of a recess and surrounds the circumference of the exposed portions35, and the seal member40is disposed in the housing cavity38. By performing the simple procedure of fitting the seal member40into the housing cavity38, the seal member40can be attached to the primary molded portion26, and thus the manufacturing process of the electric connection member can be made more efficient. With the present embodiment, the inner walls of the through-holes41of the seal member40are provided with press-fitting ribs42that protrude inward in the through-holes41, and the press-fitting ribs42come into contact with the inner walls of the housing cavity38. The seal member40is firmly held in the housing cavity38by the press-fitting ribs42. Accordingly, when molding the secondary molded portion27, the seal member40can be kept from coming loose from the primary molded portion26. According to the present embodiment, each bus bar25has two end portions, and the two end portions are respectively provided with an inner terminal portion29and an outer terminal portion30, and the exposed portions35are provided at a portion of the primary molded portion26different to the portion where the inner terminal portions29and the outer terminal portions30are provided. The inner terminal portions29, the outer terminal portions30, and the exposed portions35can be held by a die, and thus, when molding the secondary molded portion27, the primary molded portion26and the bus bars25can be further kept from shifting. With the present embodiment, each inner terminal portion29extends upward relative to the plate surface of the corresponding bus bar25, each outer terminal portion30extends downward relative to the plate surface of the corresponding bus bar25, and the exposed portions35and the outer terminal portions30closer to the exposed portions35are arranged on opposite sides to each other relative to the plate surfaces of the bus bars25. When molding the secondary molded portion27, the primary molded portion26can be kept from being subjected to an angular moment by the molten synthetic resin. In the circuit unit10according to the present embodiment, the terminal portions include the inner terminal portions29that are disposed inside the case11and connected to the circuit portion12, and the outer terminal portions30that are disposed outside the case11and connected to an external circuit. The external circuit disposed outside the case11and the circuit portion12inside the case11can be electrically connected in a water-proof state by the lower case15included in the case11. Embodiment 2 Next, Embodiment 2 of the present disclosure will be described with reference toFIG.13. A primary molded portion50according to the present embodiment is provided with two exposed portions51. The primary molded portion50is provided with housing cavities52that have an annular shape as seen from above, around the exposed portions51, respectively. Each housing cavity52is configured such that an annular seal member53can be press-fitted into it from above. The internal shapes of the housing cavities52are formed substantially the same as the outer shapes of the seal members53. A through-hole54is formed extending through each seal member53in the vertical direction thereof. The inner surface of each of the through-holes54is provided with press-fitting ribs55that extend in the vertical direction and protrude inward. A plurality (four in the present embodiment) of press-fitting ribs55are provided in each through-hole54, spaced apart from each other in the circumferential direction of the through-hole54. In the present embodiment, the press-fitting ribs55are arranged equidistant from each other. Configurations other than those described above are substantially the same as those of Embodiment 1, and thus like reference numerals are given to like members and redundant descriptions are omitted. With the present embodiment, the seal members53are respectively disposed in the housing cavities52provided at the circumference of the exposed portions51, and thus water can be further kept from entering via the exposed portions51. Embodiment 3 Next, Embodiment 3 of the present disclosure will be described with reference toFIGS.14and15. As shown inFIG.14, in a state where a seal member63is housed in a housing cavity62of a primary molded portion60, a gap is formed between the outer circumferential surface of the seal member63and the wall surface in the housing cavity62. Accordingly, the workability when housing the seal member63in the housing cavity62is improved. The opening edge portion of each housing cavity62according to the present embodiment is not provided with an inclined surface. Accordingly, the opening edge portion of each housing cavity62has an angular corner portion66. As shown inFIG.15, once the secondary molding has been performed, the upper edge of each seal member63is melted by molten thermoplastic resin, and marginally drifts under the pressure of the molten thermoplastic resin. Accordingly, the opening edge portion of each housing cavity62is closed off by the upper edge of the corresponding seal member63. Furthermore, the upper edges of the seal members63and the thermoplastic resin forming the secondary molded portion27are in a heat sealed state, and thus the water-proofness between the primary molded portion60and the secondary molded portion27can be improved. Configurations other than those described above are substantially the same as those of Embodiment 1, and thus like reference numerals are given to like members and redundant descriptions are omitted. Embodiment 4 Next, Embodiment 4 according to the present disclosure will be described with reference toFIGS.16and17. As shown inFIG.16, the depth of each housing cavity72provided in a primary molded portion70from the upper side of the primary molded portion70is set smaller than the height of seal members73in the vertical direction. Accordingly, when a seal member73is press-fitted into a housing cavity72from above, the upper edge of the seal member73protrudes upward past the upper side of the primary molded portion70. Then, when secondary molding is performed, the upper edges of the seal members73are melted by molten thermoplastic resin, and drift under the pressure of the thermal thermoplastic resin. Accordingly, the upper edges of the seal members73are brought to substantially the same height as the upper surface of the primary molded portion70(seeFIG.17). In this state, the upper edges of the seal members73and the secondary molded portion27are heat sealed to each other, and thus the water-proofness between the primary molded portion70and the secondary molded portion27can be improved. Configurations other than those described above are substantially the same as those of Embodiment 1, and thus like reference numerals are given to like members and redundant descriptions are omitted. Embodiment 5 Next, Embodiment 5 according to the present disclosure will be described with reference toFIG.18. In a primary molded portion80according to the present embodiment, the vertical height of a seal member83and the depth of a housing cavity82from the upper side of the primary molded portion80are set to be the same. Accordingly, in a state where a seal member83is press-fitted into a housing cavity82from above, the upper side of the seal member83and the upper side of the primary molded portion80are substantially flush. Then, secondary molding is performed, and the upper edges of the seal members83and the secondary molding portion27are heat sealed to each other. With the present embodiment, the upper edges of the seal members83melt during the secondary molding but do not drift. Thus, a melted and drifting seal member83can be kept from protruding into an exposed portion81from a boundary portion between the primary molded portion80and the secondary molded portion27. Configurations other than those described above are substantially the same as those of Embodiment 1, and thus like reference numerals are given to like members and redundant descriptions are omitted. Embodiment 6 Next, Embodiment 6 according to the present disclosure will be described with reference toFIG.19. As shown inFIG.19, the depth of a housing cavity92provided in a primary molded portion90from the upper side of the primary molded portion90is set greater than the vertical height of a seal member93. Accordingly, when a seal member93is press-fitted into a housing cavity92from above, the upper edge of the seal member93is located at a position lower than the upper side of the primary molded portion90. Then, when secondary molding is performed, molten thermoplastic resin enters the housing cavity92and comes into contact with the upper edge of the seal member93. Then, the upper edge of the seal member93melts, and the upper edge of the seal member93and the secondary molded portion27are heat sealed to each other. With the present embodiment, during secondary molding, the upper edge of the seal member93is kept from melting and drifting. Thus, a melted and drifting seal member93can be kept from protruding into an exposed portion91from a boundary portion between the primary molded portion90and the secondary molded portion27. Configurations other than those described above are substantially the same as those of Embodiment 1, and thus like reference numerals are given to like members and redundant descriptions are omitted. Other Embodiments An embodiment in which the electric connection member is applied to the connector portion28provided on the lower case15was described as an example, but the present disclosure is not limited to this, and the electric connection member may also be applied to a connector in which bus bars25are molded using a synthetic resin material, or may be applied to any electric connection member. A configuration may also be employed where one exposed portion is provided in the primary molded portion, and one seal member surrounds the circumference of the exposed portion. If such a configuration is employed, the step of attaching the seal member to the primary molded portion can be made simpler. A configuration may also be employed where the primary molded portion is provided with three or more exposed portions. In this case, one or two or more seal members may be provided. The number of portions of the primary molded portion supported by support portions increases as the number of exposed portions increases, and thus the primary molded portion is less likely to shift during secondary molding. A configuration may also be employed where press-fitting ribs protrude from a wall surface of a housing cavity and the press-fitting ribs abut against the seal member. Also a configuration in which the press-fitting ribs are omitted may be employed. One bus bar may also have three or more terminal portions. | 35,964 |
11862886 | While the present disclosure is susceptible to various modifications and alternative forms, specific implementations have been shown by way of example in the drawings and will be described in further detail herein. It should be understood, however, that the present disclosure is not intended to be limited to the particular forms disclosed. Rather, the present disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims. DETAILED DESCRIPTION The present disclosure relates to a connector clip with a base and a cover. The connector clip is connectable to a board of an assembly such as Printed Circuit Board Assembly (PCBA) to prevent accidental disengagement of cables connected to the board. When the connector clip is in a closed configuration, the cables are prevented from being disconnected from the board. The cover can be easily open to be in an open configuration to allow easy disengagement of the cables from the board. Thus, the connector clip can be used easily as a mechanism to secure connection of the cables to the board. Various embodiments are described with reference to the attached figures, where like reference numerals are used throughout the figures to designate similar or equivalent elements. The figures are not necessarily drawn to scale and are provided merely to illustrate aspects and features of the present disclosure. Numerous specific details, relationships, and methods are set forth to provide a full understanding of certain aspects and features of the present disclosure, although one having ordinary skill in the relevant art will recognize that these aspects and features can be practiced without one or more of the specific details, with other relationships, or with other methods. In some instances, well-known structures or operations are not shown in detail for illustrative purposes. The various embodiments disclosed herein are not necessarily limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Furthermore, not all illustrated acts or events are necessarily required to implement certain aspects and features of the present disclosure. For purposes of the present detailed description, unless specifically disclaimed, and where appropriate, the singular includes the plural and vice versa. The word “including” means “including without limitation.” Moreover, words of approximation, such as “about,” “almost,” “substantially,” “approximately,” and the like, can be used herein to mean “at,” “near,” “nearly at,” “within 3-5% of,” “within acceptable manufacturing tolerances of,” or any logical combination thereof. Similarly, terms “vertical” or “horizontal” are intended to additionally include “within 3-5% of” a vertical or horizontal orientation, respectively. Additionally, words of direction, such as “top,” “bottom,” “left,” “right,” “above,” and “below” are intended to relate to the equivalent direction as depicted in a reference illustration; as understood contextually from the object(s) or element(s) being referenced, such as from a commonly used position for the object(s) or element(s); or as otherwise described herein. Referring toFIGS.2A,2B, and2C, a connector clip300, according to various embodiments of the present disclosure, has a base310, a cover320, a hinge330, and a fastener340. The base310has a first base side310-1joined to a second base side310-2via a connecting base side310-3. The first and second base sides310-1,310-2extend from opposing ends of the connecting base side310-3. The cover320has a first cover side320-1joined to a second cover side320-2via a connecting cover side320-3. The first and second cover sides320-1,320-2extend from opposing ends of the connecting cover side320-3. The cover320is movable relative to the base310between a closed configuration (FIG.2C) and an open configuration (FIGS.2A and2B). The cover320and the base310form an internal cable opening350in the closed configuration, the internal cable opening being formed in part by the connecting base side310-3and the connecting cover side320-3. The hinge330couples the base310and the cover320. The hinge330is bendable between the open configuration and the closed configuration. In the closed configuration, the connecting base side is parallel to the connecting cover side, as shown inFIG.2(c). In the open configuration, the connecting base side is non-parallel to the connecting cover side, as shown inFIGS.2A and2B. The fastener340is configured to hold the first base side310-1and the first cover side320-1in a fixed position when the connector clip is in the closed configuration. The first base side310-1and the first cover side320-1form a first side of the connector clip300. The internal cable opening350, which is formed when the connector clip300is in the closed configuration, holds a cable200. According to various embodiments of the present invention, the connector clip300is produced by a single-cavity, although the production method is not limited thereto. According to various embodiments, the connector clip300is made of a plastic injection molding material, although the material is not limited thereto. For example, the plastic injection molding material includes acrylic (PMMA), acrylonitrile butadiene styrene (ABS), nylon polyamide (PA), polycarbonate (PC), polyethylene (PE), polyoxymethylene (POM), polypropylene (PP), polystyrene (PS), thermoplastic elastomer (TPE), or thermoplastic polyurethane (TPU) among others. Referring toFIGS.2A,2B, and2C, according to various embodiments of the present disclosure, the fastener340includes a latch340-1and a hook340-2. In various embodiments, the latch340-1is formed at the first base side310-1, and the hook340-2is formed at the first cover side320-1. Alternatively, in some embodiments, the latch is formed at the first cover side, and the hook is formed at the first base side. The latch340-1and hook340-2are engaged with each other in the closed configuration, as shown inFIG.2C. While the latch340-1and hook340-2are not engaged with each other, the cover320is foldable toward the base310via the bendable hinge330, as shown inFIG.2B. The latch340-1and hook340-2of the connector clip300in the closed configuration (shown inFIG.2C) are disengaged from each other to be in the open configuration, as shown inFIGS.2A and2B. In some embodiments, a fastener or locking mechanism that is different from the exemplary fastener340shown inFIGS.2A,2B, and2Cmay be employed in the connector clip300. As shown inFIGS.2A,2B, and2C, a second cover side320-2is coupled to a second base side310-2via the hinge330. The second cover side320-2and the second base side310-2form a second side of the connector clip300. The second cover side320-2is parallel to the first cover side320-1, and the second base side310-2is parallel to the first base side310-1such that the first side and second side of the connector clip300are parallel. Referring toFIG.2C, a first open space is formed at the first side of the connector clip300between the first base side310-1and the first cover side320-1in the closed configuration. A second open space is formed at the second side of the connector clip300between the second base side310-2and the second cover side320-2in the closed configuration. In the closed configuration, a height of the first open space and a height of the second open space are the same. Further, in the closed configuration, a third open space is formed between a third base side310-4of the base310and a third cover side320-4of the cover320forming a third side of the connector clip300. Furthermore, in the closed configuration, the internal cable opening350is formed at a fourth side of the connector clip300that is parallel to the third side of the connector clip. The third and fourth sides of the connector clip300are perpendicular to the first and second sides of the connector clip. Referring toFIGS.2A,2B, and2CandFIGS.3A,3B,3C, and3D, in some embodiments, the hinge330is formed at the second side of the connector clip300near the fourth side of the connector clip. In some embodiments, the fastener340is formed at the first side of the connector clip300near the fourth side of the connector clip, facing the hinge330. In various embodiments, the hinge330and the fastener340are located closer to the fourth side than to the third side of the connector clip300. However, positions of the hinge330and the fastener340are not limited thereto, and the hinge and fastener may be formed at other locations of the connector clip300. For the connector clip300in the closed configuration, a width of the first open space and a width of the second open space are the same. In some embodiments, a height of the internal cable opening350formed at the fourth side of the connector clip300is greater than a height of the third open space that is same as the heights of the first open space and second open space that are formed at first and second sides, respectively, of the connector clip. Referring toFIG.2AandFIG.5, the connector clip300further includes at least one stopper360. For example, a front stopper361is formed at the third cover side320-4. In some embodiments, the connector clip300further includes a first side stopper362-1formed at the first side of the cover320and a second side stopper362-2formed at the second side of the cover. Referring toFIGS.3A,3B,3C, and3D, according to various embodiments of the present invention, a method for securing cables200connected to a Printed Circuit Board Assembly (PCBA)100includes placing the connector clip300that is in the open configuration near at least one cable connected to the PCBA, as shown inFIG.3A. In this state, when the connector clip300is closed to be in the closed configuration, the at least one cable200is held by the connector clip. The method further includes placing the connector clip300in the open configuration to contact a side of a board of the PCBA100. At least one receptacle110is formed on the board, and the connector clip300is brought to a side of the board while the at least one cable200is coupled to the at least one receptacle. Eventually, at least a portion of the fastener340and hinge330of the connector clip300contacts an edge of the side of the board, as shown inFIG.3B. The at least one cable200is coupled to the at least one receptacle110vertically, as exemplified inFIGS.3A-6D,9, and11, or horizontally, as exemplified inFIGS.8and10, via the plug or connector210attached to a distal end of the at least one cable200. The plug or connector210is shaped to mate with the corresponding at least one receptacle110. The types of the plug or connector and the matching receptacle are not limited to ones exemplified in the drawings, and they may be coupled by different mechanisms. Referring toFIG.3C, the method for securing the cables200further includes closing the connector clip300by bringing the cover320closer to the base310such that connecting base side310-3and the connecting cover side320-3become parallel. The closing is performed while the at least a portion of the fastener340and hinge330is in contact with the edge of the side of the board. Finally, referring toFIG.3D, once the connector clip300is closed, the closed connector clip is fastened or locked by fastening the fastener340such that the connector clip is in the closed configuration. As shown inFIG.3D, an open space is formed between the connecting base side310-3and connecting cover side320-3in the closed configuration such that the at least one cable200passes through the open space. Referring toFIGS.3A-5, when the connector clip300is connected to the board of the PCBA100via the first, second, and third open spaces formed in the closed configuration, the fastener340and hinge330are in contact with an edge of the board. It is noted that, in some embodiments, the first, second, and third open spaces form a single open space. In this state, the connector clip300holds at least one cable200passing through the internal cable opening350and the open space, being coupled to at least one receptacle110formed on the board via the plug or connector210formed at a distal end of the at least one cable. Referring toFIG.4, disengagement of the plug or connector210coupled to the at least one receptacle110is prevented while the connector clip300connected to the board is in the closed configuration. Thus, accidental disengagement can be avoided thanks to the connector clip300securing the cables200in their places on the board of the PCBA100. Referring toFIG.5, the front stopper361is configured to constrain movement of the connector clip300in a first (X) direction that is parallel to the first and second sides of the connector clip. Further, the first and second side stoppers362-1,362-2are configured to constrain movement of the connector clip300in a second direction (Y) that is perpendicular to the first direction (X). Furthermore, the cover320placed on top of the plug or connector210coupled to the at least one receptacle110is configured to constrain movement of the connector clip300in a third direction (Z) that is perpendicular to both first (X) and second (Y) directions. In some embodiments, the fastener340and hinge330are configured to prevent disengagement of the plug or connector210from the at least one receptacle110that are coupled horizontally or in the first direction (X), as exemplified inFIGS.8and10. In some embodiments, the cover320is further configured to prevent disengagement of the plug or connector210from the at least one receptacle110when the plug or connector and the at least one receptacle are coupled vertically or in the third direction (Z), as exemplified inFIGS.9and11. Referring toFIGS.6A,6B,6C, and6D, the plug or connector210can be disengaged from the at least one receptacle110when the connector clip300is in the open configuration by releasing the fastener340. As exemplified inFIG.6A, first, the fastener340is unfastened or released, and then, as exemplified inFIG.6B, the connector clip300is open by raising the cover320away from the base310. In this state, the connecting base side310-3and the connecting cover side320-3are no longer parallel. Once the connector clip300is open sufficiently, the connector clip is detached or pulled out from the board of the PCBA100, as exemplified inFIG.6C. Then, the cable200can be disconnected from the board of the PCBA100by uncoupling the plug or connector210from the corresponding receptacle110formed on the board, as exemplified inFIG.6D. Referring toFIG.7, in some embodiments, an outer surface of at least one of the cover320or the base310is coated with a conductive material or a thin metal is added to the outer surface to shield electromagnetic interference (EMI) around a contact point. The contact point is where the plug or connector210attached to a distal end of the cable200is coupled to the receptacle110formed on the board of the PCBA100. Referring toFIG.8, in one embodiment, the connector clip300is used to hold a flat ribbon cable or multiplanar cable400having male and/or female connectors. The ribbon cable400is a flat, thin cable composed of multiple small-grade cables placed parallel to each other. With each core situated side by side, they form a wide-flat cable resembling a piece of ribbon. This type of cable is mostly used in electronic systems that require multiple data buses to link internal peripherals, such as disk drives to their respective drive controllers. In this example shown inFIG.8, the cable400is coupled to the receptacle110horizontally or in the X direction. Movement of the connector clip300is constrained by the front stopper361and rear stopper363. According to an example shown inFIG.9, a cable plug210is coupled to a receptacle110formed on a board of a PCBA100vertically or in the Z direction. That is, the receptacle110is formed such that a coupling/receiving portion of the receptacle faces upward, and the plug210is formed such that a coupling portion of the plug faces downward. Thus, the plug210is pushed down vertically to be coupled to the receptacle110. Thereafter, the connector clip300connected to the board prevents the cable plug210from being uncoupled from the receptacle110because the cover320of the connector clip300is placed on top of the plug210coupled to the receptacle110. In some embodiments, the cover320contacts the top of the plug210coupled to the receptacle110. However, in some embodiments, although the cover320does not contact the top of the plug210coupled to the receptacle110, the cover320is positioned sufficiently close to the top of the plug210to prevent the plug210from being uncoupled from the receptacle110. According to an example shown inFIG.10, a receptacle110formed on a board of a PCBA100is configured to receive a matching cable400horizontally or in the X direction. That is, the receptacle110is formed such that a coupling/receiving portion of the receptacle110faces sideways, and the plug410is formed such that a coupling portion of the plug410faces sideways. Also seeFIG.8. Thus, the receptacle110and a cable plug410are coupled in the X direction, and the connector clip300coupled to the board of the PCBA100and holding the cable400prevents the cable plug from being uncoupled from the receptacle. In this case, at least one stopper360is formed at the connector clip300to block the plug410. Therefore, while the connector clip300is in the closed configuration, it can withstand the pull-out force applied to the cable400, thus securing the connected cable in its position. In some embodiments, at least one of the stopper360or the cover320contacts the plug410coupled to the receptacle110. However, in some embodiments, although the stopper360or the cover320does not contact the plug410coupled to the receptacle110directly, the stopper360and/or the cover320is positioned sufficiently close to the plug410to prevent the plug410from being uncoupled from the receptacle110. Although a ribbon cable is shown inFIG.10, this applies to any type of cable. According to an example shown inFIG.11, a plug or connector410of the cable400is right angled with respect to the cable. Further, a receptacle110formed on a board of a PCBA100is configured to receive the matching cable400vertically or in the Z direction. That is, the receptacle110is formed such that a coupling/receiving portion of the receptacle faces upward, and the plug410is formed such that a coupling portion of the plug faces downward. Thus, the plug410is pushed down vertically to be coupled to the receptacle110. Once the connector clip300is in the closed configuration, holding the cable400, the cable plug410cannot be disconnected from the matching receptacle110because the cover320of the connector clip300is on top of the cable plug coupled to the receptacle. In some embodiments, the cover320contacts the top of the plug410coupled to the receptacle110. However, in some embodiments, although the cover320does not contact the top of the plug410coupled to the receptacle110, the cover320is positioned sufficiently close to the top of the plug410to prevent the plug410from being uncoupled from the receptacle110. Although a ribbon cable is shown inFIG.11, this applies to any type of cable. While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. Numerous changes to the disclosed examples can be made in accordance with the disclosure herein without departing from the spirit or scope of the disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above described examples. Rather, the scope of the disclosure should be defined in accordance with the following claims and their equivalents. One or more elements or aspects or steps, or any portion(s) thereof, from one or more of any of claims below can be combined with one or more elements or aspects or steps, or any portion(s) thereof, from one or more of any of the other claims or combinations thereof, to form one or more additional implementations and/or claims of the present disclosure. Although the disclosed embodiments have been illustrated and described with respect to one or more implementations, equivalent alterations and modifications will occur or be known to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. The terminology used herein is for the purpose of describing particular examples only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms “including,” “includes,” “having,” “has,” “with,” or variants thereof, are used in either the detailed description and/or the claims, such terms are intended to be inclusive in a manner similar to the term “comprising.” Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Furthermore, terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. | 21,908 |
11862887 | DETAILED DESCRIPTION This disclosure generally relates to devices, systems, and methods for protecting the connector pins on a socket prior to and/or during installation of a processor on the socket. A laterally removable pin cover may be installed on the socket. During installation of the processor, the processor may be placed on the socket over the pin cover. The pin cover may prevent the processor from contacting the connector pins when the processor is initially placed on the socket. When the processor is placed on the socket, the pin cover may be laterally removed. The processor may then be installed the rest of the way onto the socket such that the connector pins engage connector pads on the processor. Utilizing a pin cover over the socket may help to prevent damage to the connector pins during transport and assembly of a computing device. FIG.1is a representation of a printed circuit board (PCB)100, according to at least one embodiment of the present disclosure. In some embodiments, the PCB100may be a computing device or a portion of a computing device. The PCB100may have one or more processing assemblies102connected to it. The processing assemblies102may include a processor. In some embodiments, the processor may be any processor used on a computing device. For example, the processor may be a central processing unit (CPU), a graphics processing unit (GPU), a vision processing unit (VPU), an application-specific integrated circuit (ASIC), any other processor, and combinations thereof. The processor may be connected to the PCB100via a socket104. The socket104may include a plurality of connector pins106. The connector pins106may connect the processor to the PCB100. This may allow the processor to interact with other elements of the PCB100, receive power from a power source108(such as a battery), receive information, transmit information, any other interaction, and combinations thereof. In some embodiments, the quantity of connector pins106may be 10, 100, 500, 1,000, 2,000, 3,000, 4,000, 5,000, 10,000, greater than 10,000, or any value therebetween. Modern computing trends have resulted in smaller processors that simultaneously have increased processing capacity. As smaller processors increase in processing capacity, the communication requirements with the PCB100may increase. This may result in a decreased size and an increased density of connector pins106on the socket104. As the pin density increases, the size of individual connector pins106may decrease. The connector pins106may be fragile and easily damaged during transport and/or assembly of the PCB100. For example, a light touch against the connector pins106may bend one or more of the connector pins106. Bent connector pins106may not be able to contact the connector pads on the processor. In some cases, bent connector pins106on a socket104may necessitate replacement of the socket104. This may increase the cost of the PCB100and increase user frustration during assembly of the PCB100. To protect the socket104, a pin cover110may be installed on the socket104. The pin cover110may prevent inadvertent contact with the connector pins106. This may help to reduce damage to the connector pins106. Typically, a conventional pin cover110may need to be removed prior to connecting the processor to the socket104. This may allow for damage to the socket104and/or the connector pins106during the time between removal of the pin cover110and the connection of the processor. For example, a technician may inadvertently misalign the processor with the socket104and bump the socket104, damaging the connector pins106. In accordance with embodiments of the present disclosure, the pin cover110may be removable when the processor is partially connected to the socket104. During installation, the processor may be partially installed on the socket104, such as by placing the processor in a cover removal position. After the processor is partially installed on the socket104, the pin cover110may be removed. After the pin cover110is removed, the processor may be fully installed on the socket so that, in the installed position, the connector pins106contact and electrically connect to the connector pads on the processor. Removing the pin cover110while the processor is partially installed on the socket104may prevent the connector pins106from being exposed during installation. This may help to prevent or reduce inadvertent damage to the connector pins106during installation of the processor. In some embodiments, the pin cover110may be a laterally removable pin cover110. For example, after the processor is partially installed on the socket104, the pin cover110may be pulled laterally (e.g., parallel or approximately parallel to the plane of the PCB100) away from the socket104. In this manner, the pin cover110may be removed while the processor is partially installed on the socket104. FIG.2-1throughFIG.2-5represent a schematic installation sequence to install a processor212on a socket204, according to at least one embodiment of the present disclosure. In the view shown inFIG.2-1, the processor212is located above the socket204and ready to be moved downward to be installed on the socket204. The socket204may include a PCB base214and a pin cover210secured to the PCB base214. The pin cover210may be located over the connector pins206(seeFIG.2-3). Thus, as may be seen, the pin cover210may protect the connector pins206from exposure and/or damage during handling and/or installation of the processor212. The processor212may be a part of a processor assembly213. In the embodiment shown, the processor assembly213includes a processor212connected to a processor support structure218. The processor support structure218may be any support structure connected to a processor212. For example, the processor support structure218may be a heat sink, such as a plurality of heat fins and/or a vapor chamber. The heat sink may collect heat generated during use by the processor212and radiate the heat away. In some embodiments, the heat sink may be connected to one or more heat transfer elements, such as a heat pipe, to further transfer heat away from the processor212. In some embodiments, the processor support structure218may be any other support structure, including a structural support that connects to and reinforces a portion of the associated computing device. The processor212may be connected to the processor support structure218with a processor connector220. The processor connector220may be any type of connector, including an adhesive, a thermally conductive material, a series of struts, any other type of connector, and combinations thereof. In some embodiments, the processor212may be directly connected to the socket204without the processor support structure218. For example, the processor212may include processor guide tubes222that receive the guide posts216and the mounting screws (see mounting screws226ofFIG.2-5) may directly secure the processor212to the socket. Thus, it should be understood that the installation sequence illustrated inFIG.2-1throughFIG.2-5may be performed by the processor212directly, rather than the processor assembly213. In some embodiments, the processor212may be installed on the socket204first, and the processor support structure218may subsequently be installed on the socket204after the processor212is connected to the socket204. The socket204may include one or more guide posts216extending upward from the socket base214. The guide posts216may extend above the pin cover210. The processor assembly213may include one or more guide tubes222. The guide tubes222may be complementarily shaped to the guide posts216. Put another way, the guide posts216may have a cross-sectional shape that is the same as a cross-sectional shape of the guide tubes222such that the guide posts216may be inserted into the guide tubes222. The processor assembly213may be moved into a cover removal position seen inFIG.2-2, where the processor assembly213may be located above the pin cover210. When the processor assembly213is moved into the cover removal position, the guide posts216may be inserted into the guide tubes222. The guide posts216may help to orient and guide the processor assembly213into place on the socket204. This may help the connector pads on the processor212to properly align with the connector pins206of the socket204(seeFIG.2-5). In the view shown inFIG.2-2, the processor assembly213is partially installed on the socket204in the cover removal position. In the cover removal position shown, the guide posts216may be partially inserted into the guide tubes222. In the cover removal position, the guide posts216may help to orient and align the processor assembly213in the final alignment. In this manner, after the pin cover210is removed, the processor assembly213may simply be pushed into place, without any additional orienting or other lateral movement by the processor assembly. In some embodiments, in the cover removal position, the pin cover210may prevent the connector pads on the processor212from contacting the connector pins206. This may help to reduce damage to the connector pins during installation. In some embodiments, in the cover removal position, the processor assembly213may be placed on the socket204until the processor support structure218is in contact with the pin cover210. In some embodiments, in the cover removal position, the processor assembly213may be placed on the socket204such that the guide posts216are inserted into the guide tubes222while the processor assembly213is located above the pin cover210without contacting the pin cover210. After the processor assembly213is placed in the cover removal position on the socket204, the pin cover210may be laterally removed. For example, in the embodiment shown inFIG.2-3, the pin cover210may be laterally removed by applying a lateral removal force224. When the lateral removal force224is applied to the pin cover210, the pin cover210may be slid out from the socket204. In some embodiments, the pin cover210may slide out from the socket204between the pin cover210and the PCB base214of the socket204. While in the embodiment shown inFIG.2-3the lateral removal force224is shown as being applied to the left as seen in the page, it should be understood that the lateral removal force224may be applied any lateral direction (e.g., any direction parallel or approximately parallel to the PCB). For example, the pin cover210may be laterally removed by applying the lateral removal force224out of the page. In some examples, the pin cover210may be laterally removed by applying the lateral removal force224to the right. In some embodiments, the lateral removal force224may be applied in any direction except up and down in the page, including a combination of right or left and out of the page. As may be seen inFIG.2-3, when the processor assembly213is in the cover removal position, the processor212may not contact the connector pins206(e.g., the contactor pads on the processor212may not contact the connector pins206). In some embodiments, in the cover removal position, the pin cover210may prevent the processor212from contacting the connector pins206. Furthermore, because the processor assembly213is aligned by the guide posts216inserted into the guide tubes222, the processor assembly213may cover the connector pins206in the cover removal position. In this manner, during installation of the processor assembly213on the socket204, and even after the pin cover210is removed, the connector pins206may never be exposed, or may only be exposed from the lateral position after the pin cover210is removed. This may help to prevent inadvertent damage to the connector pins206during manufacture, shipping and handling, and assembly of a computing device. After the pin cover210is removed (seeFIG.2-4), the processor assembly213may be moved into the final installed position shown inFIG.2-5. In some embodiments, the processor assembly213may remain in the cover removal position shown inFIG.2-2throughFIG.2-4until it is moved into the installed position shown inFIG.2-5. In some embodiments, to maintain the processor assembly213in the cover removal position, the guide posts216may include a position maintenance feature. In some embodiments, the position maintenance feature may include a friction fit between the guide post216and the guide tube222. In a friction fit, the guide post216may have an outside diameter that is the same as or slightly larger than an inside diameter of the guide tube222. A force greater than the force of gravity may need to be applied to the processor assembly to overcome the friction fit and move the processor assembly213down the guide posts216. In some embodiments, to maintain the processor assembly213in the cover removal position, the position maintenance feature may include one or more detents, or circumferential grooves, around the outer surface of the guide posts216. The guide tubes222may include a matching annular protrusion on the inner surface of the guide tubes222. As the processor assembly213is lowered onto the guide posts216, the protrusion on the guide tubes222may enter into the matching detent. When the protrusion is inserted into the matching detent, a large force may be required to move the processor assembly out of the cover removal position. This may help to maintain the cover removal position of the processor assembly213while the pin cover210is being removed. Increasing the force needed to move the processor assembly213from the cover removal position may help to prevent the processor assembly213from becoming dislodged while the pin cover210is being removed. In some embodiments, the guide tubes222may include the detent on an inner surface of the guide tubes222, and the guide posts216may include the protrusion on an outer surface of the guide post216. Maintaining the processor assembly213in the cover removal position before, during, and after removal of the pin cover210may help to prevent inadvertent removal of the processor. The socket204may include any number of guide posts216. For example, the socket204may include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more guide posts216. In the embodiment shown inFIG.2-1throughFIG.2-5, the socket204includes two guide posts216. In the embodiment shown inFIG.1, the socket104includes four guide posts116. Increasing the number of guide posts216may help to increase the accuracy and/or precision of the alignment of the processor assembly213on the socket204. In some embodiments, each guide post216may have a position maintenance feature. In some embodiments, one or more guide posts216may have a position maintenance feature and one or more guide posts216may not have a position maintenance feature. For example, a socket204may include four guide posts216, and two of the guide posts216may include a position maintenance feature. In some examples, one of the guide posts216may include a position maintenance feature. In some examples, three of the guide posts216may include a position maintenance feature. In some embodiments, each guide post216having a position maintenance feature may have the same position maintenance feature. In some embodiments, different guide posts216may have different position maintenance features. For example, a first guide post216may have a friction fit with a guide tube222and a second guide posts216may have a detent with a matching protrusion in the guide tube222. This may further help to align the processor assembly213over the socket204and maintain the processor assembly213in the cover removal position while the pin cover210is being removed. FIG.2-5shows the processor assembly213in the fully installed position on the socket204. In the installed position shown, the processor212is in contact with the plurality of connector pins206(e.g., the connector pads are in contact with their respective connector pins206). The processor assembly213may be secured to the socket204using one or more mounting screws226. As may be seen in the installation sequence shown inFIG.2-1throughFIG.2-5, the processor assembly213may be installed without exposing the connector pins206. This may help to protect the connector pins206and prevent the processor212from malfunctioning and/or prevent replacement of the processor212. To remove the processor assembly213from the socket204, the installation sequence shown inFIG.2-1throughFIG.2-5may be reversed. During the removal sequence, the mounting screws226ofFIG.2-5may be removed, and the processor assembly213may be moved from the installed position to the cover removal position shown inFIG.2-4. While the processor assembly213is in the cover removal position, the pin cover210may be laterally installed (e.g., slid into place) between the processor assembly213and the socket204. As may be seen inFIG.2-3, to install the pin cover210, a lateral installation force228may be applied to the pin cover210to slide the pin cover210in between the processor assembly213and the socket204. While in the embodiment shown inFIG.2-3the lateral installation force228is shown as being applied to the right as seen in the page, it should be understood that the lateral installation force228may be applied any lateral direction. For example, the pin cover210may be laterally installed by applying the lateral installation force228into the page. In some examples, the pin cover210may be laterally installed by applying the lateral installation force228to the right. In some embodiments, the lateral installation force228may be applied in any direction except up and down in the page, including a combination of right or left and into the page. In some embodiments, the processor assembly213may be moved into the cover removal position by the user. After the mounting screws226have been removed, the user may pull on the processor assembly213until the processor assembly has reached the cover removal position. In some embodiments, the position maintenance features discussed herein may help the user to know how far to pull out the processor assembly213. For example, the user may pull on the processor assembly213until protrusion in the guide tube222is inserted into a detent on the guide post216(or until a protrusion on the guide post216is inserted into a detent in the guide tube222). When the protrusion enters the detent, the user may feel a change in the force used to remove the processor assembly213further (such as a click, or an increase in the necessary removal force). This change in removal force may alert the user that the processor assembly213is in the cover removal position shown inFIG.2-4, and that the pin cover210is ready to be installed. Using a position maintenance feature to determine when the processor assembly213is in the cover removal position may help the user to laterally install the pin cover210without accidently fully removing the processor assembly. In some embodiments, after the mounting screws226have been removed, the processor assembly213may be moved into the cover removal position using the pin cover210. For example, when the processor assembly213is in the installed position shown inFIG.2-5, the pin cover210may be pressed up against the lateral end230of the processor assembly213. The pin cover210may include a rounded lateral edge232. By applying the lateral installation force228against the pin cover210, the rounded lateral edge232may transfer that force to the processor support structure218. At least a portion of the lateral installation force228may be converted to an upward force by the rounded lateral edge232, which may push the processor assembly213upward into the cover removal position shown inFIG.2-3. Thus, in some embodiments, the pin cover210disconnects the processor assembly213from the socket204. Put another way, the pin cover210may disconnect the plurality of connector pads from the connector pins206. This may reduce the need for an operator or technician to physically pull on the processor assembly213before the pin cover210is in place. After the pin cover210has been laterally moved into place (seeFIG.2-2), the processor assembly213may be fully removed (seeFIG.2-1). As may be seen, installing the pin cover210before the processor assembly213has been fully removed may prevent the connector pins206from being exposed during removal of the processor assembly213. This may help to prevent damage to the socket204. For example, if the processor212is being replaced, such as to replace a faulty processor, upgrade the processor, or any other reason, the old processor212may be removed and the new processor212installed without exposing the connector pins206. This may help reduce the replacement costs of a new processor212that can utilize the same socket204. FIG.3-1throughFIG.3-4represent a schematic installation sequence of a processor assembly313on a socket304, according to at least one embodiment of the present disclosure. As may be seen inFIG.3-1, the pin cover310may be secured to the socket304with a latch334. In some embodiments, the latch334may prevent the pin cover310from being removed from the socket304. For example, the latch334may prevent the pin cover310from being removed in a vertical direction336. In some examples, the latch334may prevent the pin cover310from being removed in a lateral direction338. In some examples, the latch334may prevent the pin cover310from being removed in a vertical direction336and a lateral direction338. Preventing the pin cover310from being removed may help to protect the socket304during handling and/or installation of the processor assembly313. To install the processor assembly313on the socket304, the processor assembly313may be lowered in the vertical direction336onto the socket. One or more guide posts316may extend above the pin cover310. In some embodiments, the guide posts316may extend above the latch334. The guide posts316may be inserted into corresponding guide tubes322. Insertion of the guide posts316into the guide tubes322may align and/or orient the processor assembly313onto the socket304. The processor assembly313may be lowered into the cover removal position shown inFIG.3-2. In some embodiments, the processor assembly313may be lowered down the guide posts316. In some embodiments, the processor assembly313may be maintained in the cover removal position with one or more position maintenance features, as discussed herein. When the processor assembly313is located in the cover removal position, the latch334may be unlatched (e.g., placed from a latched position shown inFIG.3-1into an unlatched position shown inFIG.3-2) from the pin cover310. In some embodiments, the latch334may be manually unlatched by the user or technician installing the processor assembly313. For example, the user may rotate the latch334outward with a finger or tool such that removal of the pin cover310is no longer prevented by the latch334. In some embodiments, the user may completely remove the latch334. For example, when preparing to install the processor assembly313in the cover removal position, the user may remove the latch334from the socket304before inserting the processor assembly313onto the guide posts316. In some embodiments, the user may remove the latch334after the processor assembly313is placed in the cover removal position. In some embodiments, the latch334may be unlatched by the processor assembly313when the processor assembly is placed into the cover removal position shown inFIG.3-2. For example, as the processor assembly313is lowered down the guide posts316, the processor support structure318may engage a contact edge340of the latch334. This contact may move the latch334from the latched position ofFIG.3-1to the unlatched position ofFIG.3-2. After the latch334is moved from the latched position to the unlatched position, the pin cover310may be laterally removed from the socket304. Unlatching the latch334by moving the processor assembly313into the cover removal position may help to prevent inadvertent removal of the pin cover310from the socket304. As discussed above, the latch334may prevent the pin cover310from being removed before the processor assembly313is installed in the cover removal position. In this manner, the pin cover310may not be removed until the user is ready for it to be removed. Furthermore, unlatching the latch with the processor assembly313may increase the ease of installation of the processor assembly313. For example, the user may not need to perform any additional actions to unlatch the latch334. In this manner, the pin cover310may be more fully secured to the socket304without increasing the installation complexity experienced by the user. After the pin cover310is laterally removed from between the processor assembly313and the socket304, the processor assembly313may be connected to the socket304using one or more mounting screws326, as shown inFIG.3-3. In some embodiments, when the processor assembly313is connected to the socket304, the latch334may latch on to the processor assembly313, such as latching onto the processor support structure318. Latching the processor assembly313to the socket304may help to prevent the processor assembly313from being removed until the processor assembly313is ready to be removed. This may help to prevent exposure of the connector pins306and reduce inadvertent damage to the socket pins306. To remove the latched processor assembly313, the pin cover310may be laterally inserted onto the socket304, as may be seen inFIG.3-4. The pin cover310may be pushed laterally until it comes into contact with the latch334. This may push the latch334from the latched position shown inFIG.3-3to the unlatched position shown inFIG.3-4. Thus, when a user wishes to replace the processor assembly313, the user may laterally push the pin cover310until it unlatches the latch334. The processor assembly313may then be removed. In this manner, the processor assembly313may be replaced without exposing the socket304and the connector pins306. By latching the processor assembly313to the socket304, the processor assembly313may not be removed until the pin cover310is in place, thereby protecting the socket304from damage. FIG.4is a representation of a PCB assembly400with a processor assembly413being installed on a socket404, according to at least one embodiment of the present disclosure. In the embodiment shown, the processor assembly413may include a spreader442. Using the spreader442, the processor assembly413may laterally move one or more sections of the pin cover410as the processor assembly413moved in the vertical direction436onto the socket404. In some embodiments, the spreader442may include a wedge444or other contact surface. As the processor assembly413is moved onto the socket, the wedge444of the spreader442may come into contact with one or more sections of a pin cover410. As the processor assembly413is further lowered onto the socket404, the wedge444may push one or more sections of the pin cover410in the lateral direction438. In some embodiments, when the processor assembly413is fully installed on the socket404, the spreader442may push on the one or more sections of the pin cover410until the pin cover410is dislodged from the socket404. In some embodiments, the spreader442may push on the one or more sections of the pin cover410to make it easier for a user to grip the pin cover410for lateral removal. In some embodiments, as discussed herein, the one or more guide posts416may be used to align the processor assembly413. As the processor assembly413is moved down the guide posts416and the spreader442pushes against the pin covers410, the guide posts416provide a counter force from the contact of the spreader440against the pin covers410. In some embodiments, the guide posts416may be sufficiently strong to maintain alignment of the processor assembly with respect to the socket404. In some embodiments, a spreader442may push against a single section of the pin cover410. In some embodiments, a spreader442may push against multiple sections of the pin cover410. For example, in the embodiment shown inFIG.4, the spreader442has a wedge444that pushes against a first section of the pin cover410-1and a second section of the second pin cover410-2. In some embodiments, the spreader442may push the first section of the pin cover410-1and the second section of the pin cover410-2in the same direction. In some embodiments, the spreader442may push the first section of the pin cover410-1in a first direction (e.g., to the left in the embodiment shown) and the second section of the pin cover410-2in a second direction (e.g., to the right in the embodiment shown). Utilizing a spreader442to laterally move the pin covers410may increase the ease of installation of the processor assembly413. For example, laterally moving the pin covers410may remove the pin cover410from the socket404, which may reduce the interaction between the user and the socket404. In some examples, laterally moving the pin cover410may make the pin cover410easier for the user to remove. In some embodiments, to remove the processor assembly413, the user may apply a lateral force to a section of the pin cover410when the processor assembly413is in the installed position. The pin cover410may engage the wedge444of the spreader442, and a portion of the lateral force may be converted to an upward force. The processor assembly413may be urged upward until the pin cover410is in place. In this manner, the processor assembly413may be removed without exposing the connector pins in the socket404. FIG.5-1is a representation of a top down view of a pin cover510, according to at least one embodiment of the present disclosure. The pin cover510may include a first side section546-1and a second side section546-2. In some embodiments, the first side section546-1may be configured to connect to a socket (e.g., the socket104ofFIG.1) on a first side. The second side section546-2may be configured to connect to the socket on a second side. In some embodiments, the connector pins on the socket may be located between the first side and the second side of the socket. Thus, the pin cover510may straddle the socket and the connector pins of the socket between the first side section546-1and the second side section546-2. In some embodiments, a cover top548may extend between the first side section546-1and the second side section546-2. The cover top548may extend over the top of the connector pins. The cover top548may provide protection for the connector pins from inadvertent damage caused during handling and/or assembly of a processor assembly on the socket. In some embodiments, the first side section546-1and the second side section546-2may be connected to the socket. To remove the pin cover510, the pin cover may be moved in a first lateral direction538-1or a second lateral direction538-1. Because the first side section546-1and the second side section546-2are connected to the socket, the pin cover510may not be moved in a third lateral direction568-1or a fourth lateral direction568-2. The pin cover510includes a front end550and a rear end552. In some embodiments, one or both of the front end550and the rear end552may be open. Put another way, on an open end, the cover top548may terminate at the front end550or the rear end552without contacting the socket, or at a height that is greater than a connector pin height. An open end may be slid over the socket without contacting and/or damaging the connector pins. Thus, if the front end550is open, the pin cover510may be removed from the socket in the second lateral direction538-2. If the rear end552is open, the pin cover510may be removed from the socket in the first lateral direction538-1. In some embodiments, the front end550may be closed and the rear end552may be open. In some embodiments, the rear end552may be closed and the front end550may be open. In some embodiments, both the front end550and the rear end552may be open. FIG.5-2is a representation of a front view of the pin cover510ofFIG.5-1installed on a socket504. As may be seen, the pin cover510extends over the connector pins506. Specifically, the cover top548extends between the first side section546-1and the second side section546-2over the top of the connector pins506. Thus, the pin cover510may be seen to straddle the connector pins506between the first side section546-1and the second side section546-2. WhileFIG.5-2shows the cover top548as being flush with an upper surface of the first side section546-1and a second side section546-2, it should be understood that the cover top548may be located at any location between the upper surface of the side sections546and a lower surface of the side sections546. In the embodiment shown, the first side section546-1and the second side section546-2may be secured to a pin base558with an interlocking connection. For example, in the embodiment shown, the side sections (collectively546) may include a groove554. The pin base558may include a complementary tongue section556that extends from the pin base558. The tongue section556may be inserted into the groove554to secure the pin cover510to the socket504. This may help to prevent movement, such as removal, of the pin cover510from the socket504in the vertical direction536. While a tongue and groove connection between the pin base558and the pin cover510is shown inFIG.5-2, it should be understood that any type of interlocking or sliding connection between the pin base558and the pin cover510may be used, including a dovetail connection (which may only allow lateral movement in a single direction). As may be seen, the connector pins506extend above the pin base558with a pin height562. The cover top548extends above the pin base558with a cover height560. The cover height560may be greater than the pin height562. Thus, the pin cover510may not contact the connector pins506when installed on the socket504. Furthermore, the cover height560being greater than the pin height562may allow the pin cover510to be laterally removed (e.g., into and out of the page) without contacting and/or damaging the connector pins506. In this manner, the pin cover510may help to prevent damage to the connector pins506during handling and/or assembly of the processor on the socket504. In the embodiments shown inFIG.5-1andFIG.5-2, the pin cover510shown is integrally formed from a single, unitary piece. For example, the pin cover510may be molded in a single mold such that there is no break in material type, composition, or structure along the entirety of the pin cover510. In some embodiments, the sections of the pin cover510may be separately formed and permanently connected or adhered together. A permanent connection or adhesion is one in which the connected elements may not be removed without plastically deforming or fracturing at least one of the elements. FIG.6is a representation of top down view of a pin cover610formed from a plurality of sections, according to at least one embodiment of the present disclosure. The pin cover610may include a first side section646-1, a second side section646-2, a front section664, a rear section666, and a cover top648. In some embodiments, two or more of the sections may be separately (e.g., independently) formed. Forming the pin cover610from two or more sections (e.g., multiple sections) may allow the pin cover610to be removed in multiple pieces or from multiple directions. This may allow for a customized installation sequence for a processor assembly (e.g., the processor assembly213ofFIG.2-1throughFIG.2-5) based on the specific geometry of a particular PCB layout. In some embodiments, any combination of the first side section646-1, the second side section646-2, the front section664, the rear section666, and the cover top648may be separately or integrally formed. For example, a first portion of the cover top648may be integrally formed with the first side section646-1and a second portion of the cover top648may be integrally formed with the second side section646-1. In some examples, a front portion of the cover top648may be integrally formed with the front section664and a rear portion of the cover top648may be integrally formed with the rear section666. In some embodiments, the rear section664may be integrally formed with the first side section646-1and/or the second side section646-2. In some embodiments, the front section666may be integrally formed with the first side section646-1and/or the second side section646-2. Selectively integrally forming different sections of the pin cover610may allow a computer designer to customize the installation sequence of the processor assembly to fit a specific geometry of a particular PCB. In some embodiments, one or more sections of the pin cover610may prevent another section from removal in a particular direction. For example, in the embodiment shown inFIG.6, the first side section646-1and the second side section646-2may be removed in a first lateral direction638or a second lateral direction668. However, prior to removal, the first side section646-1and the second side section646-2may prevent the front portion664and/or the rear portion666from removal in the second lateral direction668. Thus, to remove the front portion664and/or the rear portion666in the second lateral direction, the first side section646-1and/or the second side section646-2may be removed first. By coordinating which of the sections of the pin cover610block the other sections, the computing system designer may develop an installation sequence specific to the geometry of a particular PCB. FIG.7is a representation of a top view of a pin cover710having multiple interlocking sections, according to at least one embodiment of the present disclosure. The pin cover710may include a first side section746-1, a second side section746-2, a front section764, a rear section766, and a cover top748. In the embodiment shown, the front section764is connected to the first side section746-1with an interlocking connection770. The interlocking connection770may prevent removal of one or both of the front section or the first side section746-1in the first lateral direction738and/or the second lateral direction768, based on the orientation of the interlocking connection. The interlocking connection770shown may include a notch in the first side section746-1and a complementary protrusion in the front section764. The protrusion may be inserted into the notch. As may be seen the interlocking connection770may prevent removal of both the front section764and the first side section746-1in the first lateral direction738. Thus, to remove the pin cover710, the first side section746may be removed in the second lateral direction768. The front section764may then be removed in the second lateral direction. Alternatively, the second side section746-2may be removed in the second lateral direction768, and the front section764may then be removed in the first lateral direction. The pin cover710may further include other interlocking connections770. Each of the interlocking connections770may prevent removal of one or more of the sections in either the first lateral direction738or the second lateral direction768. Thus, by arranging the pin cover710with multiple side sections and multiple interlocking connections770, a computer designer may design a pin cover710that with sections that are removed from a PCB in a particular order. This may further help to protect the connector pins of the socket from damage during handling and/or installation of a processor assembly. FIG.8is a representation of a method872for connecting a processor to a socket, according to at least one embodiment of the present disclosure. The acts and elements of the method872may be illustrated graphically in the installation sequence shown in and described with respect toFIG.2-1throughFIG.2-5and the installation sequence shown in and described with respect toFIG.3-1throughFIG.3-4. The method872may include placing a processor on a laterally removable pin cover connected to the socket at874. The pin cover may then be laterally removed from the socket at876and the processor moved into an installed position at878. In some embodiments, the method872may include unlatching the laterally removable pin cover before removing the laterally removable pin cover. Unlatching the laterally removable pin cover may include unlatching a latch connecting the laterally removable pin cover to the PCB. The latch may be unlatched when the processor is moved into the cover removal position. In some embodiments, moving the processor into the cover removal position may unlatch the latch by pushing the latch outward away from the pin cover. In some embodiments, the method may further include latching the processor assembly to the PCB using the same latch that latched the laterally removable pin cover to the PCB. The processor assembly may be latched to the PCB when the processor assembly is placed in the final, installed position. FIG.9is a representation of a method980for removing a processor from a socket, according to at least one embodiment of the present disclosure. The acts and elements of the method980may be illustrated graphically by following the installation sequence shown in and described with respect toFIG.2-1throughFIG.2-5in reverse order, as well as following the installation sequence shown in and described with respect toFIG.3-1throughFIG.3-4in reverse order. To remove the processor, while the processor is installed in a socket, a pin cover may be inserted between the processor and the socket at982. After the pin cover is inserted between the processor and the socket, the processor may be removed at984. In some embodiments, the method980may further include unlatching the processor assembly from the PCB. The processor assembly may be unlatched from the PCB when the pin cover is laterally inserted in between the processor assembly and the PCB. In some embodiments, the pin cover may push the latch away from the processor assembly. When the processor assembly is removed, the latch may then connect with the pin cover, thereby latching the pin cover to the PCB. One or more specific embodiments of the present disclosure are described herein. These described embodiments are examples of the presently disclosed techniques. Additionally, in an effort to provide a concise description of these embodiments, not all features of an actual embodiment may be described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous embodiment-specific decisions will be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one embodiment to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure. The articles “a,” “an,” and “the” are intended to mean that there are one or more of the elements in the preceding descriptions. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one embodiment” or “an embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. For example, any element described in relation to an embodiment herein may be combinable with any element of any other embodiment described herein. Numbers, percentages, ratios, or other values stated herein are intended to include that value, and also other values that are “about” or “approximately” the stated value, as would be appreciated by one of ordinary skill in the art encompassed by embodiments of the present disclosure. A stated value should therefore be interpreted broadly enough to encompass values that are at least close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least the variation to be expected in a suitable manufacturing or production process, and may include values that are within 5%, within 1%, within 0.1%, or within 0.01% of a stated value. A person having ordinary skill in the art should realize in view of the present disclosure that equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made to embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions, including functional “means-plus-function” clauses are intended to cover the structures described herein as performing the recited function, including both structural equivalents that operate in the same manner, and equivalent structures that provide the same function. It is the express intention of the applicant not to invoke means-plus-function or other functional claiming for any claim except for those in which the words ‘means for’ appear together with an associated function. Each addition, deletion, and modification to the embodiments that falls within the meaning and scope of the claims is to be embraced by the claims. The terms “approximately,” “about,” and “substantially” as used herein represent an amount close to the stated amount that still performs a desired function or achieves a desired result. For example, the terms “approximately,” “about,” and “substantially” may refer to an amount that is within less than 5% of, within less than 1% of, within less than 0.1% of, and within less than 0.01% of a stated amount. Further, it should be understood that any directions or reference frames in the preceding description are merely relative directions or movements. For example, any references to “up” and “down” or “above” or “below” are merely descriptive of the relative position or movement of the related elements. The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments are to be considered as illustrative and not restrictive. The scope of the disclosure is, therefore, indicated by the appended claims rather than by the foregoing description. Changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope. | 46,553 |
11862888 | DETAILED DESCRIPTION TO EXECUTE THE INVENTION Hereinafter, embodiments are described. Note that constituent elements may be enlargedly shown to facilitate understanding in the accompanying drawings. Dimension ratios of the constituent elements may be different from actual ones or those in other drawings. Further, hatching of some constituent elements may be omitted to facilitate understanding in sections. (First Embodiment) A first embodiment is described below in accordance withFIGS.1to5. A vehicle-side connector1shown inFIGS.1to5is for charging a power storage device equipped in a vehicle such an electric vehicle or a plug-in hybrid electric vehicle. As shown inFIG.2, the vehicle-side connector1is fixed to a vehicle91by unillustrated fastening members such as bolts. The vehicle-side connector1is connected to the unillustrated power storage device via wires80shown inFIG.1and the like. As shown inFIGS.2and3, a charger-side connector95as a mating connector is connected to the vehicle-side connector1from left inFIG.2. This left side shown inFIGS.2and3is an outer side of the vehicle91. A lateral direction shown inFIGS.2and3is an inserting/withdrawing direction of the charger-side connector95. In the following description, a left side, a right side, an upper side and a lower side ofFIG.2are referred to as a front side, a rear side, an upper side and a lower side. Further, an upper side and a lower side ofFIG.3are referred to as a right side and a left side. As shown inFIG.3, the vehicle-side connector1includes a connector housing10, a plurality of (two in this embodiment) vehicle-side terminals50and heat storage bodies70. The connector housing10includes a housing body20and a retainer30. The housing body20is made of insulating synthetic resin. The housing body20includes a fitting portion21, a flange portion22, a tubular portion23, terminal accommodating portions24and terminal holding portions25. The charger-side connector95is inserted into the fitting portion21. The fitting portion21is in the form of a bottomed hollow cylinder with an open front end, and includes a hollow cylindrical receptacle21aand a back wall portion21bfor closing the rear end of the receptacle21a. The flange portion22projects outward from the outer peripheral surface of the receptacle21a.As shown inFIG.1, the flange portion22is in the form of a substantially rectangular plate. The flange portion22includes a plurality of mounting holes22penetrating through the flange portion22in a front-rear direction. Unillustrated fastening members are inserted into the mounting holes22aand the vehicle-side connector1is fixed to the vehicle91shown inFIG.2by these fastening members. The tubular portion23extends rearward from the flange portion22. The tubular portion23has a substantially hollow cylindrical shape. As shown inFIGS.1and2, the tubular portion23is shifted downward with respect to the fitting portion21in the vehicle-side connector1of this embodiment. As shown inFIG.3, the terminal accommodating portion24extends forward from the back wall portion21b.The terminal accommodating portion24has a substantially hollow cylindrical shape. Two terminal accommodating portions24are provided side by side in a lateral direction of the vehicle-side connector1. The terminal holding portions25are provided behind the back wall portion21b.The terminal holding portion25has a substantially hollow cylindrical shape having an inner diameter larger than that of the terminal accommodating portion24. Two terminal holding portions25are provided coaxially with the two terminal accommodating portions24. The inside of the terminal holding portion25communicates with that of the terminal accommodating portion24. The vehicle-side terminal50is inserted into the terminal accommodating portion24and the terminal holding portion25. That is, the terminal accommodating portion24and the terminal holding portion25constitute a terminal accommodating tube for accommodating the vehicle-side terminal50. The vehicle-side terminal50is a female terminal and a charger-side terminal96of the charger-side connector95is inserted thereinto. The vehicle-side terminal50includes a protruding portion51projecting outward from an outer peripheral surface. This protruding portion51comes into contact with the rear surface of the back wall portion21b.The vehicle-side terminal50includes a wire connecting portion52behind the protruding portion51. In this embodiment, the wire connecting portion52has a hollow cylindrical shape and a core81of the wire80is inserted thereinto. The wire connecting portion52is connected to the core81of the wire80, for example, by crimping. As shown inFIGS.1to3, the retainer30is mounted on the rear end of the tubular portion23. The retainer30retains the vehicle-side terminals50shown inFIG.3. The retainer30is made of synthetic resin. As shown inFIG.3, the retainer30includes a base portion31, a peripheral wall32, terminal pressing portions33and wire holding portions34. The base portion31is in the form of a circular plate. The peripheral wall32projects forward from a peripheral edge part of the base portion31. The peripheral wall32is disposed outside the tubular portion23of the housing body20. Unillustrated engaging portions to be engaged with each other are formed on the peripheral wall32and the outer side surface of the tubular portion23of the housing body20. The retainer30is mounted on the rear end of the tubular portion23by engaging the engaging portions of the peripheral wall32and the tubular portion23. The terminal pressing portions33project forward from the base portion31. The terminal pressing portions33are provided at positions corresponding to the terminal holding portions25of the housing body20. In this embodiment, the terminal pressing portion33is formed into a hollow cylindrical shape. The terminal pressing portion33is inserted between the inner surface of the terminal holding portion25and the outer surface of the vehicle-side terminal50. The tip of the terminal pressing portion33comes into contact with the protruding portion51of the vehicle-side terminal50to retain the vehicle-side terminal50from behind. The wire holding portions34project rearward from the base portion31. The wire holding portions34are provided at positions corresponding to the terminal pressing portions33. In this embodiment, the wire holding portion34is formed into a hollow cylindrical shape. The wire holding portion34is formed to have the same diameter as the terminal pressing portions33. The inside of the wire holding portion34and that of the terminal pressing portion33communicate with each other. The wire80is inserted into the wire holding portion34. Note that the retainer30of this embodiment includes a plurality of signal line holding portions35as shown inFIGS.4and5. Although not shown, the vehicle-side connector1of this embodiment includes a plurality of signal terminals. The signal terminals are used for communication with a charging device. Similarly to the above vehicle-side terminals50, the signal terminals are accommodated into the housing body20and retained by terminal holding portions of the retainer30. Signal lines connected to the signal terminals are inserted into the signal line holding portions35of the retainer30. A surrounding wall portion36projects rearward from the base portion31. The surrounding wall portion36is formed into a hollow cylindrical shape. The surrounding wall portion36collectively surrounds the pair of wire holding portions34and the plurality of signal line holding portions35. As shown inFIG.3, the retainer30of this embodiment includes insertion portions37to be inserted between the terminal holding portions25and the tubular portion23of the housing body20. The insertion portion37projects forward from the base portion31. The insertion portion37is in the form of a bottomed tube open rearward and having a bottom part on a front side. As shown inFIGS.4and5, the retainer30of this embodiment further includes separation wall portions38,39. The separation wall portions38,39extend from the wire holding portions34to the surrounding wall portion36. The separation wall portions38of this embodiment extend upward from the wire holding portions34to the surrounding wall portion36. Further, the separation wall portions39of this embodiment extend downward from the wire holding portions34to the surrounding wall portion36. The insertion portion37, the separation wall portions38,39, the wire holding portion34and the surrounding wall portion36described above form an accommodation recess40. The heat storage body70is accommodated in the accommodation recess40. The heat storage body70includes a case71and heat storage materials76accommodated in the case71. The case71includes a case body72in the form of a bottomed tube formed to contact the inner surface of the accommodation recess40and a lid member73for closing an opening of the case body72. A thermally expansible material or a material with good thermal conductivity can be used as a material of the case71. Examples of the thermally expansible material include rubber, resin, metal and the like. By forming the case71using the thermally expansible material, the outer surface of the case71can be held in close contact with the inner surface of the accommodation recess40. Examples of the rubber include EPDM (ethylene propylene diene rubber), silicon rubber, fluororubber and the like. Examples of the resin include epoxy resin, polyethylene resin, polyurethane resin and the like. Examples of the metal include copper (Cu), aluminum (Al) and the like. The same material as the case body72can be used as a material of the lid member73. The lid member73is fixed, for example, by ultrasonic welding, laser welding or another method. The heat storage material76can temporarily store heat. A material utilizing latent heat during a phase change between liquid and solid can be used as the heat storage material76. Further, a material having a melting point in a used temperature range can be used as the heat storage material76. For example, the heat storage material76can be selected from compounds which are solid at a normal temperature, e.g. when the vehicle-side connector1is not energized, and are at least partially melted, softened, fluidized or liquefied when the temperature of the vehicle-side connector1(particularly, the vehicle-side terminals50) rises and exceeds a predetermined value according to energization. The compound can reversibly return from liquid to solid when the energization to the vehicle-side connector1is finished and the temperature of the vehicle-side connector1(particularly, the vehicle-side terminals50) drops. The compound can reversibly or repeatedly change between solid and liquid as the temperature of the terminals50rises from the normal temperature and drops to the normal temperature and may be called a reversible heat storage compound. The heat storage material76may be the single compound, may be a mixture of two or more types of the compounds or may be a composite of the compound and another type of compound or material. Paraffin, sodium sulfate tetrahydrate, sodium acetate trihydrate, vanadium dioxide and the like can be, for example, used as the material of the heat storage material76. In this embodiment, the case71is provided with at least one partition wall74. The case71of this embodiment is provided with six partition walls74. The partition walls74partition an internal space of the case71into a plurality of compartments75. The above heat storage material76is accommodated in each of the compartments75. In this embodiment, each partition wall74is formed to extend from a part adjacent to the wire holding portion34to a part adjacent to the surrounding wall portion36. Further, each partition wall74is formed to radially extend along a straight line passing through a center of the hollow cylindrical wire holding portion34. In this way, the heat storage materials76accommodated in the respective compartments75are held in contact with the outer peripheral surfaces of the terminal holding portion25and the wire holding portion34shown inFIG.3by the radial partition walls74. Thus, the heat storage material76in each compartment75stores heat generated from the terminal holding portion25and the wire holding portion34. The case71is closed by the lid member73. The leakage of the heat storage materials76liquefied in the case71is prevented by the lid member73. Note that the lid member73preferably renders the heat storage material76liquefied in each compartment75incapable of penetrating through the lid member73. Note that an adhesive, a thermal interface material (TIM) or the like may be interposed between the accommodation recess40of the retainer30and the case71. An epoxy resin-based adhesive, a polyurethane-based adhesive or an acrylic resin-based adhesive can be used as the adhesive. Silicon grease or the like can be, for example, used as the thermal interface material. (Functions) Next, functions of the vehicle-side connector1configured as described are described above. The charger-side connector95shown inFIG.1is connected to the vehicle-side connector and a charging current is supplied to the heat storage device of the vehicle from a charger outside the vehicle via the charger-side connector95and the vehicle-side connector1. A large charging current is supplied to shorten a charging time. When the supply of this charging current is started, heat is generated in contact parts of the charger-side terminals96and the vehicle-side terminals50, the vehicle-side terminals50, connected parts of the vehicle-side terminals50and the wires80and the like. Thus, the entire vehicle-side terminals50are heated. The heat in the vehicle-side terminals50and the like suddenly increases at the start of charging and transitions at a temperature lower than a maximum temperature at the start when a predetermined time elapses. The heat storage bodies70are accommodated in the connector housing10. In this embodiment, the heat storage bodies70are accommodated in the retainer30. The heat storage body70includes the case71and the heat storage materials76accommodated in the case71. The heat storage materials76are for temporarily storing heat, and temporarily store latent heat (heat of dissolution) by being changed from solid to liquid by the heat generated in the vehicle-side terminals50and the like. That is, the heat storage materials76absorb the heat generated in the vehicle-side terminals50. Therefore, sudden temperature rises of the vehicle-side terminals50can be suppressed. The amount of heat transferred from the vehicle-side terminals50to the wires80, the connector housing10and the like is reduced by the heat absorption of the heat storage materials76. Thus, sudden temperature rises of the connector housing10and the like can be suppressed. Further, by using the heat storage materials76, the maximum temperature can be lower than that in the case of not using the heat storage materials76. When time elapses from the start of the charging, the temperature of the vehicle-side terminals50transitions near a predetermined temperature. Thicknesses of the wires80and the heat resistance of the connector housing10are set to withstand a highest temperature even temporarily. In this embodiment, temperature rises of the wires80and the connector housing10can be suppressed by using the heat storage materials76. Thus, thin wires80, i.e. light wires80, can be used. The case71of the heat storage body70is, for example, formed of a thermally expansible material. Such a case71is expanded by heat transferred from the vehicle-side terminal50and the outer surface of the case71is held in close contact with the inner surface of the accommodation recess40, whereby heat transfer can be more enhanced. The retainer30of the vehicle-side connector1includes the separation wall portions38,39extending from the terminal holding portions25to the surrounding wall portion36. The heat of the vehicle-side terminals50is transferred from the terminal holding portions25holding the vehicle-side terminals50toward the surrounding wall portion36. The heat storage body70is in contact with the separation wall portions38,39. Thus, the heat of the vehicle-side terminals50is easily absorbed by the heat storage materials76of the heat storage bodies70. Therefore, the temperature rises of the vehicle-side terminals50and the wires80can be more suppressed. Further, the retainer30includes the plurality of partition walls74partitioning the insides of the accommodation recesses40. The heat storage materials76are accommodated in the compartments75partitioned by the respective partition walls74. The heat of the vehicle-side terminals50is transferred to the heat storage materials76in the respective compartments75via the partition walls74. Thus, the heat of the vehicle-side terminals50is easily absorbed by the heat storage materials76. Therefore, the temperature rises of the vehicle-side terminals50and the wires80can be more suppressed. The plurality of partition walls74are formed to radially extend along straight lines passing through a center of the vehicle-side terminal50inside the case71. The heat of the vehicle-side terminal50is transferred toward the outside of the retainer30via the partition walls74. Therefore, the heat of the vehicle-side terminal50can be efficiently radiated to the outside of the retainer30. When the charging is finished, the charger-side connector95is separated from the vehicle-side connector1. The heat stored in the heat storage materials76of the vehicle-side connector1is gradually radiated via the connector housing10. The heat storage materials76are solidified by heat radiation. Since no current flows into the vehicle-side terminals50when the charging is not performed, heat is not generated. The heat storage materials76radiate heat and are solidified. As described above, the following effects are achieved according to this embodiment. (1-1) The vehicle-side connector1includes the vehicle-side terminals50, the connector housing10for holding the vehicle-side terminals50and the heat storage bodies70accommodated in the connector housing10. The heat storage body70includes the case71to be accommodated into the connector housing and the heat storage materials76accommodated in the case71. The charger-side connector95is connected to the vehicle-side connector1at the time of charging, i.e. in use. The large charging current flows into the vehicle-side terminals50to shorten the charging time. At the start of supplying this charging current, heat is generated in the contact parts of the charger-side terminals96and the vehicle-side terminals50, the vehicle-side terminals50, the connected parts of the vehicle-side terminals50and the wires80and the like. Since the heat storage materials76absorb the heat generated in the vehicle-side terminals50, sudden temperature rises of the vehicle-side terminals50and the like can be suppressed. (1-2) The connector housing10includes the accommodation recesses40for accommodating the heat storage bodies70. In this way, the connector housing10accommodating the heat storage bodies70can be provided. (1-3) The case71of the heat storage body70includes the partition walls74partitioning the internal space. The heat storage materials76are accommodated in the compartments75formed by partitioning the inside of the case71by the partition walls74. By accommodating the heat storage materials76in the plurality of compartments75, a biased distribution of the heat storage materials76can be reduced and the heat of the vehicle-side terminal50can be more easily absorbed. (1-4) The plurality of partition walls74are formed to radially extend along the straight lines passing through the center of the vehicle-side terminal50inside the case71. The heat of the vehicle-side terminal50is transferred toward the outside of the retainer30via the partition walls74of the case71. Therefore, the heat of the vehicle-side terminal50can be efficiently radiated to the outside of the retainer30. (1-5) The heat storage bodies70constitute the connector housing10and are accommodated into the retainer30for retaining the vehicle-side terminals50. Thus, a member for accommodating the heat storage bodies70needs not be separately provided and an increase in the number of members can be suppressed. (1-6) The accommodation recesses40for accommodating the heat storage bodies70are formed by the terminal holding portions25for holding the vehicle-side terminals50, the surrounding wall portion36surrounding the terminal holding portions25and the separation wall portions38,39extending from the terminal holding portions25to the surrounding wall portion36. By providing the accommodation recesses40inside the surrounding wall portion36of the retainer30in this way, the enlargement of the vehicle-side connector1can be suppressed as compared to the case where a part for accommodating the heat storage bodies70is separately provided outside the retainer30. (Second Embodiment) A second embodiment is described below with reference toFIGS.6to9. A connector100shown inFIGS.6to9is, for example, a terminal block to be fixed to a case191of a device such as an inverter provided in a vehicle. The connector100includes a connector housing110and device-side terminals150. The connector housing110includes a housing body120and a shell130. The shell130includes an accommodating portion131for accommodating the housing body120and a flange portion132to be fixed to the case191of the device. The shell130is, for example, made of metal. The housing body120is, for example, made of synthetic resin. As shown inFIG.6, the housing body120is fixed to the shell130by screws181. The housing body120includes a fitting portion121, a terminal holding portion122and a nut holding portion123. The fitting portion121is formed into a substantially tubular shape and an unillustrated cable-side connector is fit thereinto. The terminal holding portion122holds the device-side terminals150. The device-side terminals150are, for example, made of metal such as copper. Each of the two device-side terminals150is in the form of a rectangular plate. As shown inFIG.8, the two device-side terminals150are arranged along a lateral direction. Insertion holes150a,150bare formed in both ends of the device-side terminals150. The device-side terminals150are so held in the terminal holding portion122that end parts formed with the insertion holes150a,150bare exposed. The above fitting portion121holds nuts161at positions corresponding to the insertion holes150aof the device-side terminals150. The nut holding portion123holds nuts162at positions corresponding to the insertion holes150bof the device-side terminals150projecting from the housing body120. The device-side terminals150are connected to terminals connected to end parts of wires inside the device by bolts inserted into the insertion holes150aand the nuts161. The fitting portion121is formed with a first opening124and a second opening125. The first opening124is for inserting the cable-side connector into the fitting portion121. The second opening125is for inserting the bolts for connecting the device-side terminals150and wire-side terminals of the connector and a tool during a bolting operation. The first opening124is closed by the connector inserted into the fitting portion121. The second opening125is closed by fixing an unillustrated cap to the shell130. The terminal holding portion122includes an accommodation recess126. The accommodation recess126is recessed, above the device-side terminals150, from a side where the device-side terminals150project toward the side of the fitting portion121into which the connector is fit. A heat storage body170is accommodated in the accommodation recess126. The heat storage body170includes a case171and heat storage materials176accommodated in the case171. The case171includes a case body172in the form of a bottomed tube formed to contact the inner surface of the accommodation recess126, and a lid member173for closing an opening of the case body172. A thermally expansible material or a material with good thermal conductivity can be used as a material of the case171. Examples of the thermally expansible material include rubber, resin, metal and the like. By forming the case171using the thermally expansible material, the outer surface of the case171can be held in close contact with the inner surface of the accommodation recess126. Examples of the rubber include EPDM (ethylene propylene diene rubber), silicon rubber, fluororubber and the like. Examples of the resin include epoxy resin, polyethylene resin, polyurethane resin and the like. Examples of the metal include copper (Cu), aluminum (Al) and the like. The same material as the case body172can be used as a material of the lid member173. The lid member173is fixed, for example, by ultrasonic welding, laser welding or another method. The heat storage material176can temporarily store heat. A material utilizing latent heat during a phase change between liquid and solid can be used as the heat storage material176. Further, a material having a melting point in a used temperature range can be used as the heat storage material176. Paraffin, sodium sulfate tetrahydrate, sodium acetate trihydrate, vanadium dioxide and the like can be, for example, used as the material of the heat storage material176. As shown inFIG.8, the case171is provided with at least one partition wall174. The connector100of this embodiment includes seven partition walls174in the case171. The partition walls174partition the inside of the case171into compartments175. In this embodiment, the partition wall174is formed to extend along a direction orthogonal to an arrangement direction of the two device-side terminals150. As shown inFIG.8, in this embodiment, the two device-side terminals150are arranged along a lateral direction ofFIG.8. The partition walls174are formed to extend in a vertical direction. The heat storage material176is accommodated in each compartment175. (Functions) Next, functions of the connector100of this embodiment are described. As shown inFIG.8, the heat storage body170is accommodated in the connector housing110. The heat storage body170includes the case171accommodated in the connector housing110and the heat storage materials176accommodated in the case171. The heat storage materials176are for temporarily storing heat and temporarily store latent heat (heat of dissolution) by being changed from solid to liquid by heat generated in the device-side terminals150and the like. That is, the heat storage materials176absorb the heat generated in the device-side terminals150. Therefore, sudden temperature rises of the device-side terminals150can be suppressed. Further, the amount of heat transferred from the device-side terminals150to the wires, the connector housing110and the like is reduced by the heat absorption of the heat storage materials176. Thus, sudden temperature rises of the connector housing110and the like can be suppressed. Further, by using the heat storage materials176, a maximum temperature can be lower than that in the case of not using the heat storage materials176. When a predetermined time elapses from the start of charging, the temperature of the device-side terminals150transitions near a predetermined temperature. Thicknesses of the wires and the heat resistance of the connector housing110are set to withstand a highest temperature even temporarily. In this embodiment, temperature rises of the wires and the connector housing110can be suppressed by using the heat storage materials176. Thus, thin wires, i.e. light wires, can be used. The case171of the heat storage body170includes the plurality of partition walls174for partitioning the inside thereof. The heat storage materials176are accommodated in the compartments175partitioned by the respective partition walls174. The heat of the device-side terminals150is transferred to the heat storage materials176in the respective compartments175via the partition walls174. Thus, the heat of the device-side terminals150is easily absorbed by the heat storage materials176. Therefore, the temperature rises of the device-side terminals150and the like can be more suppressed. The plurality of partition walls174are formed to radially extend along the direction orthogonal to the arrangement direction of the device-side terminals150. The heat of the respective device-side terminals150is transferred from the device-side terminals150to an upper part of the connector housing110via the partition walls174and radiated to the outside of the connector housing110. Therefore, the heat of the device-side terminals150can be efficiently radiated to the outside of the connector housing110. As described above, the following effects are achieved according to this embodiment. (2-1) The connector100includes the device-side terminals150, the connector housing110for holding the device-side terminals150and the heat storage body170accommodated in the connector housing110. The heat storage body170includes the case171accommodated in the connector housing110and the heat storage materials176accommodated in the case171. The device-side terminals150generate heat by a current flowing when the connector100is used. Since the heat storage materials176absorb heat generated in the vehicle-side terminals150, sudden temperature rises of the vehicle-side terminals150and the like can be suppressed. (2-2) The housing body120of the connector housing110includes the accommodation recess126for accommodating the heat storage body170. In this way, the connector100accommodating the heat storage materials176can be easily provided. (2-3) The case171of the heat storage body170includes the partition walls174for partitioning the inside of the case171. The heat storage materials176are accommodated in the compartments175partitioned by the partition walls174. By accommodating these heat storage materials176into the plurality of compartments175, a biased distribution of the heat storage materials176can be reduced and the heat of the device-side terminals150can be more easily absorbed. (2-4) The plurality of partition walls174are formed to extend along the direction orthogonal to the arrangement direction of the device-side terminals150. The heat of the device-side terminals150is transferred from the device-side terminals150to the upper part of the connector housing110via the partition walls174. Therefore, the heat of the device-side terminals150can be efficiently radiated to the outside of the connector housing110. (Modifications) Note that each of the above embodiments may be carried out in the following modes.In each of the above embodiments, the extending directions of the partition walls74,174may be changed as appropriate.In each of the above embodiments, the number of the partition walls74,174may be changed as appropriate.In each of the above embodiments, the partition walls74,174may be omitted.Although the core81of the wire80is connected by being directly inserted into the vehicle-side terminal50in the first embodiment, a terminal connected to a core of a wire by a screw screwed into a vehicle-side terminal may be, for example, fixed to the vehicle-side terminal.In the second embodiment, the wire may be connected to the device-side terminal150, such as by crimping.In each of the above embodiments and modifications thereof, the vehicle-side terminals50may be male terminals and the charger-side terminals96may be female terminals. The present disclosure encompasses the following implementation examples. Typical constituent elements of the embodiments are denoted by reference signs not for limitation, but for understanding assistance. [Addendum 1] One or more implementation examples of the present disclosure are directed to a connector (1) to be detachably connected to a mating connector (95) and the connector (1) may include a housing (10) to be mechanically connected to the mating connector (95), a terminal (50;150) to be electrically connected to a mating terminal (96) of the mating connector (95), a heat storage material accommodation case (71;171) to be mounted on the connector housing (10), the heat storage material accommodation case being an individual member different from the connector housing (10), and a heat storage material (76;176) accommodated into the heat storage material accommodation case (71;171), the heat storage material being an individual member different from the connector housing (10) and the heat storage material accommodation case (71;171). [Addendum 2] In several implementation examples, the heat storage material accommodation case (71;171) may be mounted on the connector housing (10) detachably from the connector housing (10). [Addendum 3] In several implementation examples, the heat storage material (76;176) may contain a reversible heat storage compound which reversibly changes between solid and liquid as the temperature of the terminal (50;150) rises from the normal temperature and drops to the normal temperature. [Addendum 4] In several implementation examples, the heat storage material (76;176) may contain a reversible heat storage compound which is solid at a normal temperature and at least partially melted, softened, fluidized or liquefied when the temperature of the terminal (50;150) rises and exceeds a predetermined value. [Addendum 5] In several implementation examples, the heat storage material accommodation case (71;171) may be made of a material different from the heat storage material (76;176) and may be made of a material capable of maintaining an original solid shape without being liquefied when the heat storage material (76;176) is at least partially liquefied. [Addendum 6] In several implementation examples, the heat storage material accommodation case (71;171) may be mounted on the connector housing (10) with the heat storage material accommodation case (71;171) and the terminal (50;150) kept out of contact. [Addendum 7] In several implementation examples, the heat storage material accommodation case (71;171) and the connector housing (10) may be so configured that the heat storage material (76:176) and the terminal (50;150) are kept out of contact when the heat storage material accommodation case (71;171) is mounted on the connector housing (10). [Addendum 8] In several implementation examples, the heat storage material accommodation case (71;171) can directly contact the connector housing (10). [Addendum 9] In several implementation examples, the heat storage material accommodation case (71;171) may be configured to contact the connector housing (10) with sliding resistance when the heat storage material (76;176) is not melted, softened, fluidized or liquefied. [Addendum 10] In several implementation examples, the heat storage material accommodation case (71;171) may be configured to tightly contact the connector housing (10) when the heat storage material (76;176) is at least partially melted, softened, fluidized or liquefied. [Addendum 11] In several implementation examples, the connector housing (10) may include a housing body (20) for holding the terminal (50) and a retainer (30), which is an individual member different from the housing body (20), the retainer (30) may include a case accommodation chamber (40) for accommodating the heat storage material accommodation case (71;171), and an outer surface of the heat storage material accommodation case (71;171) and an inner surface of the case accommodation chamber (40) may be held in contact without forming any clearance. [Addendum 12] In several implementation examples, the mating connector (95) may be a charger-side connector and the connector (1) may be a vehicle-side connector. It would be apparent to a person skilled in the art that the present invention may be embodied in other specific forms without departing from the technical concept thereof. For example, some of the components described in the embodiments (or one or more modes thereof) may be omitted or several components may be combined. The scope of the present invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. LIST OF REFERENCE NUMERALS 1. . . vehicle-side connector,10. . . connector housing,20. . . housing body,23. . . tubular portion,24. . . terminal accommodating portion,25. . . terminal holding portion,30. . . retainer,31. . . base portion,33. . . terminal pressing portion,34. . . wire holding portion,36. . . surrounding wall portion,37. . . insertion portion,38. . . separation wall portion,39. . . separation wall portion,40. . . accommodation recess,50. . . vehicle-side terminal,70. . . heat storage body,71. . . case,74. . . partition wall,76. . . heat storage material,80. . . wire,91. . . vehicle,100. . . connector,110. . . connector housing,120. . . housing body,122. . . terminal holding portion,126. . . accommodation recess,130. . . shell,150. . . vehicle-side terminal,170. . . heat storage body,171. . . case,174. . . partition wall,176. . . heat storage material | 37,223 |
11862889 | DETAILED DESCRIPTION Before any embodiments of the invention are explained in detail, it is to be understood that the embodiments are not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. Aspects of the present disclosure are capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the use the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. Furthermore, the use of “right”, “left”, “front”, “back”, “upper”, “lower”, “above”, “below”, “top”, or “bottom” and variations thereof herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms “mounted,” “connected,” “supported,” and “coupled” and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings. Further, “connected” and “coupled” are not restricted to physical or mechanical connections or couplings. The following discussion is presented to enable a person skilled in the art to make and use embodiments of the present disclosure. Various modifications to the illustrated embodiments will be readily apparent to those skilled in the art, and the generic principles herein can be applied to other embodiments and applications without departing from embodiments of the present disclosure. Thus, embodiments of the present disclosure are not intended to be limited to embodiments shown, but are to be accorded the widest scope consistent with the principles and features disclosed herein. The following detailed description is to be read with reference to the figures, in which like elements in different figures have like reference numerals. The figures, which are not necessarily to scale, depict selected embodiments and are not intended to limit the scope of embodiments of the present disclosure. Skilled artisans will recognize the examples provided herein have many useful alternatives and fall within the scope of embodiments of the present disclosure. Disclosed herein is a connector for positioning and locating a flat, ribbon-style cable. The connector may be used in conjunction with such a ribbon cable for use in industrial control, monitoring, and similar power and data network systems, for example, as a node or power connection for a device within the system, passing data and/or power between the ribbon cable and the device, or a termination or splicer for cables within the system. The connectors for various purposes (e.g., power connection, node connection, termination, splicing) can incorporate one or more universal parts, enabling easy assembly of the network with common tooling for all connectors and re-use of certain components for different purposes. Some embodiments of a connector incorporate a cover configured to be coupled to a housing, where the cover is moved along a linear trajectory. By way of example,FIG.1schematically illustrates a data and power network10. The network10includes a plurality of device nodes12coupled to one another via a network ribbon cable14. Each device node12can receive power and/or data signals from the ribbon cable14via a connector16. More specifically, once coupled to the ribbon cable14via a respective connector16, each device node12can transmit and receive control and data signals via the ribbon cable14in accordance with various standard protocols in addition to receiving various forms of electrical power. Various examples of device nodes12may include, but are not limited to, devices such as push-button switches, motor starters, proximity sensors, flow sensors, speed sensors, actuating solenoids, electrical relays, and electrical contactors. Additionally, electrical power can be provided to the network10via one or more intelligent power taps18. For example, intelligent power taps18can be intelligent devices having the ability to interact with the control and data signals of the network10, in addition to providing various forms of power. The intelligent power taps18can provide power (e.g., in the form of 24 volts DC) to the network10by connecting to the ribbon cable14via a connector16. In addition to, or as an alternative to, one or more of the intelligent power taps18, the network10can include one or more non-intelligent power taps20connected to the ribbon cable14via a connector16. For example, a non-intelligent power tap20may only provide power to the network10, without interacting with control and data signals. At one or both ends of ribbon cable14, a connector16can further be provided in the form of a terminator for capping the ribbon cable ends and terminating the signal conductors of the ribbon cable14. Furthermore, within the network10, one or more connectors16can be provided in the form of splicers to electrically connect and cap respective ends of two ribbon cables14. As shown inFIG.1A, a ribbon cable14for use in such a network10can include a plurality of parallel conductors22enclosed in a common insulation jacket24. The conductors22can comprise a conductive material such as, but not limited to, copper or another conductive metal. The insulation jacket24can comprise an electrical insulating material such as, but not limited to, a plastic material. The insulation jacket24can sit on the conductors22, e.g., as an extruded integral insulation, so that a cylindrical outer contour on the top and bottom of the ribbon cable14emerges, separated by flat insulation webbing26between conductors. In this manner, the ribbon cable14can define a ribbon profile28of curved, longitudinal tracks on top and bottom surfaces thereof. In some applications, all conductors22may be identical in size and equally spaced apart, forming a symmetrical ribbon profile28; however, in other applications, the conductors22may differ in size and/or spacing, creating a varied or asymmetrical ribbon profile28. According to the non-limiting example ofFIG.1A, the ribbon cable14includes seven extruded conductors22of various sizes, including four conductors22dedicated to power and three conductors22dedicated to data transfer, forming an asymmetrical ribbon profile28. In some embodiments, each connector16can be configured to be coupled to and guide the ribbon cable14to maintain power and data connections within the network10. As such, all connectors16within the network10can include generally similar components, with some components and features being universal across all connectors16, and other components and features being specific to a connector16to achieve particular physical and/or electrical connections within the network10. For example, connectors, according to some embodiments, for use in a network, can include, but are not limited to: a node connector30, as shown inFIGS.2-5,7, and9, configured to couple a ribbon cable14to a device node; a power tap left connector32, as shown inFIGS.10A and10B, configured to couple a ribbon cable14to a power tap to direct power in a first direction; a power tap right connector configured to couple a ribbon cable14to a power tap to direct power in a second direction; a terminator configured to terminate a ribbon cable14; and a splicer configured to splice together two ribbon cables14. Generally, each connector can include at least a housing40, a cable organizer46, and a cover48, as further described below. Furthermore, at least each of the node connector30, the power tap left connector32, the power tap right connector, and the splicer can include a printed circuit board44, as further described below. By way of example, referring toFIGS.2-5and7, a node connector30, according to some embodiments, is illustrated. The node connector30can include a housing40, a removable protection cap42(shown inFIG.11), a printed circuit board44, a cable organizer46, and a cover48. Generally, a ribbon cable14can be positioned within (e.g., extend across) an open top50of the housing40and be supported by the cable organizer46, as shown inFIG.7. The ribbon cable14can be enclosed within the housing40by the cover48when the node connector30is in an assembled state, as shown inFIGS.2and5. When enclosed within the housing40, individual conductors22of the ribbon cable14can engage one or more conductor contacts52(such as insulation-displacement contacts (IDCs) and/or insulation-piercing contacts (IPCs)) extending from the printed circuit board44. The housing40can be further adapted to plug into a corresponding jack on a device node to electrically and physically connect the ribbon cable14to the device node. More specifically, with respect to the housing40, in some embodiments, the housing40can support and enclose the printed circuit board44and the cable organizer46therein, and can be coupled to the cover48in a manner so that open top50of the housing40can be selectively covered by the cover48, as further described below. The housing40can be generally rectangular in shape and can include an upper section56and a lower section58, an open top50(e.g., at the upper section56) and an open bottom60(e.g., at the lower section58), a first side62, a second side64, a first end66, and a second end68. As shown inFIG.5, when a ribbon cable14is positioned in the housing40, the ribbon cable14extends out of the connector30from both sides62,64. The upper section56of the housing40can define the open top50. In some embodiments, as shown inFIG.3, the first side62and the second side64can each include a lowered edge with a profile82configured to permit a ribbon cable14to extend out from the first side62and the second side64of the housing40, respectively, when the ribbon cable14is coupled to the node connector30. For example, as described above with respect toFIG.1A, a ribbon cable14can include a ribbon profile28defined by outer contours of the insulated conductors22of the ribbon cable14. The first side62and the second side64can therefore each include an inverse ribbon profile82that substantially corresponds to the ribbon profile28of a ribbon cable14, allowing the ribbon cable14to sit within the profile82. As a result, the housing40can facilitate and maintain proper alignment of the ribbon cable14within the housing40when the ribbon cable14is coupled to the node connector30. Furthermore, along the first end66, the upper section56of the housing40can include an outwardly extending knob84and inwardly extending guide walls86, as shown inFIG.3. The guide walls86can be internally offset from an outer surface of the first end66, creating a shoulder88. Also, the guide walls86can extend around to the first side62and the second side64until reaching the profiled edges82. Along the second end68, the upper section56of the housing40can also include an outwardly extending knob90and inwardly extending guide walls92. In some embodiments, the guide walls86can be internally offset from the knob90and can extend higher than the guide walls86along the first end66. Also, the guide walls92can extend around to the first side62and the second side64until reaching the profiled edges82. As shown inFIG.3, along the first side and the second side62,64, each guide wall92can include a track94. As further described below, the guide walls92and, more specifically, the tracks94, can support linear translation of the cover48relative to the housing40. In some embodiments, as shown inFIGS.2-4, the lower section58of the housing40can be integral with the upper section56, though smaller than the upper section56. The lower section58can be dimensioned to define the open bottom60and also to plug into a node jack of a device node, i.e., so that the housing40can be plugged into the node jack, thus physically and electrically coupling the ribbon cable14to the device node via the node connector30. In some embodiments, to facilitate proper directional (e.g., right-left) alignment of the connector30with a node jack, the lower section58can be longer on the second end68than the first end66to define a corner extension87. Accordingly, the lower section58can include a generally rectangular profile with the corner extension87, which matches a corresponding rectangular opening and corner extension of the node jack (not shown) in order to plug the connector30into the node jack. Furthermore, in some embodiments, the lower section58of the housing40can be selectively covered by a protection cap42in order to cover the open bottom60. For example, the protection cap42can protect an interior of the housing40from outside elements when the connector30is not connected to a device node and can protect components within the interior of the housing40(such as the printed circuit board44) from tooling when the connector30is placed in its assembled state, as further described below. An example protection cap is shown inFIG.11and described and further illustrated in U.S. patent application Ser. No. 17/114,203, filed Dec. 7, 2020, the entire contents of which is incorporated herein by reference. As shown inFIG.11, the protection cap42can include pivotable latches93with the detents91adjacent inner, top ends thereof to couple the protection cap42to the lower section58of the housing40. As shown inFIG.3, the upper and lower sections56,58of the housing40can define an interior space96that houses the printed circuit board44. More specifically, in some embodiments, the printed circuit board44, such as a printed circuit board assembly, can sit within the housing40and can include, extending from an upper end thereof, one or more individual and distinct conductor contacts52, each of which are separately soldered or pressed-in to the printed circuit board44with a mechanical and electrical connection, sufficient to connect the printed board circuits to the various individual conductors22of the ribbon cable14. For example, in some embodiments, the conductor contacts52can include one or more insulation-displacement contacts (IDCs) and/or one or more insulation-piercing contacts (IPCs). In some embodiments, the printed circuit board44and the conductor contacts52are positioned within the upper section56of the housing40. For example, the upper section56can include a bottom seat78defined by an inward-stepped portion that connects that upper section56to the lower section58, and the bottom seat78can support the printed circuit board44within the upper section56. In some embodiments, the printed circuit board44can extend within the interior space96across the upper section56to define open areas between respective ends of the printed circuit board44and the first and second ends66,68of the housing40. As further described below, lower detents112of the cable organizer and/or portions of the cover48can extend into the open areas. The conductor contacts52can be located along the printed circuit board44so that they can be configured to electrically contact individual conductors22of a ribbon cable14when the connector30is in its assembled state, as further described below. The printed circuit board44further includes, extending from a lower end thereof into the lower section58of the housing40, a connector socket receptacle100electrically coupled to the conductor contacts52and accessible via the open bottom60of the housing40. For example, the connector socket receptacle100can be adapted to plug into a corresponding node jack on a device node to electrically and physically connect the ribbon cable to the device node when the lower section58of the housing40is plugged into the node jack. To facilitate proper connections between the conductor contacts52and respective conductors22of a ribbon cable14, the cable organizer46can be configured to maintain a position of the ribbon cable14within the connector30. More specifically, still referring toFIGS.2-6, the cable organizer46can sit within and be supported by the housing40, and positioned over top of the printed circuit board44so that it accessible via the open top50of the housing40. The cable organizer46can include a first side102, a second side104, a first end106, and a second end108that generally align with the first side62, the second side64, the first end66, and the second end68, respectively, of the housing40. The cable organizer46can also include a generally flat surface110between two raised end surfaces114, with one or more lower detents112that extend generally downward from the end surfaces114(e.g., along corners of the cable organizer46or at other positions along the sides102,104or ends106,108). In some embodiments, the cable organizer46can include a plurality of longitudinal grooves or guideways120in the flat surface110extending from the first side102to the second side104thereof and configured to receive insulated conductors22of a ribbon cable14. For example, as described above, a ribbon cable14includes a ribbon profile28defined by outer contours of the insulated conductors22. The longitudinal guideways120of the cable organizer46can define an inverse ribbon profile122that substantially corresponds to the ribbon profile28of the ribbon cable14(e.g., matching the inverse ribbon profiles82on the first and second sides62,64of the housing40), thus permitting proper alignment of individual conductors22of the ribbon cable14within the connector30when the ribbon cable14is placed on the cable organizer46. Additionally, in some embodiments, as shown inFIGS.3,4, and7, the cable organizer46can include an angled surface126between each end surface114and the flat surface110. As further described below, the angled surfaces126can help guide a cable14into position into the grooves120of the flat surface110when the cover48is closed onto the housing40. The cable organizer46also includes a plurality of apertures124extending through one or more of the longitudinal grooves120and configured to axially align with the conductor contacts52, as further described below. To further facilitate ribbon cable installation, the cable organizer46can be moveable in an axial direction within the housing40, for example, along an axis134(as shown inFIG.4). In some embodiments, the cable organizer46can be moved between a first position when the connector30is in a preassembled state (as shown inFIGS.4and7) and a second, lower position when the connector30is in an assembled state. For example, in some embodiments, as shown inFIG.3, the housing40can include one or more upper slots136extending through the first and second ends66,68, and one or more lower slots138extending through the first and second ends66,68and positioned a distance below the upper slots136. The lower detents112of the cable organizer46can be configured to engage or snap into the slots136,138of the housing40to lock the cable organizer46in the first position (e.g., preassembled state) and the second position (e.g., assembled state), respectively. More specifically, in the preassembled state, the lower detents112can each engage a respective upper slot136of the housing40. In this position, as shown inFIG.4, the raised end surfaces114of the cable organizer46can generally align with or extend above upper edges of the guide walls86or92(thus placing the cable organizer46within, or extending across, the open top50) and the inverse ribbon profile122of the cable organizer46can be positioned above the inverse ribbon profiles82of the housing40. Additionally, in the preassembled state, the cable organizer46is spaced a first distance above the printed circuit board44so that the conductor contacts52do not extend through the apertures124of the cable organizer46. In the assembled state, the cable organizer46can be pressed axially downward along the axis134into the housing40so that the lower detents112disengage the upper slots136and slide down the interior96of the housing40until they each engage (e.g., snap into) a respective lower slot138. In this position, the inverse ribbon profile122of the cable organizer46can align with the inverse ribbon profiles82of the housing40. Additionally, in the assembled state, the cable organizer46is spaced a second distance above the printed circuit board44so that the conductor contacts52extend through the apertures124and, as a result, can engage the individual conductors22of the ribbon cable14received within the longitudinal grooves120. Additionally, as shown inFIG.3, in some embodiments, the node connector34can incorporate a cutter139configured to sever a specific cable conductor22when the connector30is installed. Generally, the cable organizer46can be enclosed within the housing40by the cover48. In some embodiments, as shown inFIGS.2-6, the cover48can be generally rectangular in shape and include a first side140, a second side142, a first end144, and a second end146. The cover48can also include an upper surface148and a bottom surface152. The bottom surface152of the cover48can include an inverse cable profile154extending from the first side140to the second side142(e.g., corresponding to the ribbon profile28of a ribbon cable14) and one or more apertures or indentations155that can generally align with the apertures124of the cable organizer46, as shown inFIG.6. As shown inFIG.6, the cover48can include outer walls156at the first and second ends144,146, which can extend around to the first and second sides140,142. Additionally, along the first and second ends144,146, each outer wall156can include a notch158. The cover48can further include hooks160extending from the bottom surface152and positioned adjacent the first and second ends144,146, spaced inward from the respective notches158. Furthermore, as shown inFIG.6, the cover48can include internal ribs162on the first and second sides140,142adjacent the second end146. Each rib162can be sized to engage and slide along a respective track94of the housing40, to support linear translation of the cover48relative to the housing40, as further described below. Regarding the upper surface148of the cover48, in some embodiments, the upper surface148may be substantially flat. However, in other embodiments, the upper surface148can include a nonplanar surface profile. For example, the upper surface148may be beveled, created by angled indentations on the first and second sides140,142. In another example, as shown inFIGS.2-4, the upper surface148includes a bump164generally extending from the first side140to the second side142. The bump164may be a gradual bump, as shown inFIGS.2-4, or may be a discrete bump and/or may include a rounded, square, triangular, or other profile that generally extends from the first side140to the second side142and peaks adjacent a center of the cover48(e.g., equidistant from the first end144and the second end146). The central peak of the bump164can serve as contact point for tooling used to assemble the connector30, as described below. In further embodiments, as shown inFIG.8, the upper surface148may include an inverted central bump190or other profile configured to receive or engage a separate flat plate192, which may then serve as the contact surface for associated tooling. More specifically, in some embodiments, a profiled upper surface148may be part of an assembly including a separate pivoting plate192that engages the upper surface148. The pivoting plate192can interface to a clamping tool (as discussed below) for more efficient load transfer with reduced friction and/or linear slipping during clamping. While the resultant force from clamping tool jaws can generate many different magnitudes and directions (illustrated by arrows194inFIG.8), which deviate from the final desired direction of movement of the cover48, the assembly can help redirect the force in the desired direction of movement. Additionally, in some embodiments, as shown inFIGS.2-5, the upper surface148of the cover48can include one or more features170that provide information to a user, for example, when the connector30is in the assembled or preassembled state. In one example, the feature170may be a horizontal line and/or one or more arrows, such as an indented or protruding line and arrows formed in the upper surface148, or a colored line and arrows applied (e.g., painted on, printed on, etched on, etc.) to the upper surface148. The line170can align with a cable orientation strip128along the cable14(as shown inFIG.5) and/or a cable orientation strip (not shown) along the cable organizer46to further assist proper positioning of a ribbon cable14in the connector30, while the arrows170can indicate ribbon cable direction out of the connector30. Other features170not specifically described herein, such as arrows, tabs, or others, may be included within the scope of this disclosure to provide information to the user. Furthermore, in some embodiments, as shown inFIGS.2,3, and5, the upper surface148can include slots178, for example, configured to receive a label tag (not shown). When in the assembled state, the cover48can cover the open top50of the housing40to capture and entrap the ribbon cable14within the housing40between the cover48and the cable organizer46. That is, the ribbon cable14can be held between the lower inverse cable profile122of the cable organizer46and the inverse cable profile154of the bottom surface152of the cover48, thereby preventing vertical and/or horizontal movement of the ribbon cable14within the connector30to facilitate secured connections between the cable conductors22and the conductor contacts52. For example, as shown inFIGS.2and5, the first side140, the second side142, the first end144, and the second end146of the cover48can generally align with the first side62, the second side64, the first end66, and the second end68, respectively, of the housing40. The outer walls156of the cover48can also rest upon the shoulders88of the housing40, and the end notches158in the cover48can align with the knobs84,90of the housing40, as shown inFIGS.2and3. Furthermore, the internal hooks160of the cover48can snap onto the first and second ends106,108of the cable organizer46, thus securing the cover48to the cable organizer46. As the cable organizer46is secured to the housing40(that is, via the lower detents112engaged with the lower slots138of the housing40), the cover48may be secured to the housing40at least via the cable organizer46. Additionally, in some embodiments, as shown inFIG.4, the cover48can be coupled to, and also move relative to, the housing40via ribs162of the cover48engaging the tracks94of the housing. For example, as shown inFIGS.3,4, and6, each track94can include an upper detent172and a lower detent174, and each rib162can include a corresponding notch176configured to engage an upper detent172when in the preassembled state and a lower detent174when in the assembled state. Thus, the upper detent172and corresponding notch176can hold or fix the cover48relative to the housing40in the preassembled state, allowing a ribbon cable14to be inserted into the open top50of the housing40. However, in some embodiments, the notches176and the upper detents172can be sized so that the cover48can be pulled off of the housing40with a sufficient amount of force. Accordingly, the cover48can freely translate along the axis134in a first, upward direction, until reaching an upward-most position when the notches176reach the upper detents172. And the cover48can freely translate in a second, downward direction until reaching a downward-most position when the notches176reach the lower detents174. In other words, the cover48can translate linearly along the axis134a specified vertical distance between the upward-most position and the downward-most position, and can be held open in the upward-most position to facilitate insertion of the ribbon cable14into the open top50. The ribs162described above allows re-use of the cover48with a multiplicity of connectors (as further described below), thus creating several variant combinations which take advantage of the same, universal cover48for use with any housing40including tracks94. As discussed above, in some embodiments, the cover48may be coupled to the housing40at all times, in both the preassembled and assembled states, therefore reducing the chances of losing components. However, in some embodiments, the cover48may be configured to be selectively uncoupled from the housing40. In some embodiments, the cover48and the cable organizer46can include additional features that help align the components during installation. For example, as shown inFIG.9, the bottom surface152of the cover48and the cable organizer46can include mating guide ribs180,181and apertures182that engage each other during installation. More specifically, the cover48can include pairs of guide ribs180adjacent both ends144,146. The cable organizer46, along the first end106can include apertures182configured to receive the mating guide ribs180. The cable organizer46, along the second end108can include apertures182configured to receive the mating guide ribs180as well as further guide ribs181that slide adjacent (e.g., “scissor”) the mating guide ribs180of the cover48. In some cases, the mating guide ribs180,181and apertures182can further help prevent potential misalignment of the connector30during installation. While the connector described above with respect toFIGS.2-7is a node connector30, one or more of the above-described components and features can be incorporated into other connectors in a network, such as the network10ofFIG.1. In some embodiments, unless specified otherwise below, any one or more of the above-described components of the node connector30can be incorporated into any one of a power tap left connector32(illustrated inFIGS.10A and10B), a power tap right connector, a terminator, and/or a splicer. Thus, inFIGS.10A and10B, like numerals illustrate like components as described above with respect to the node connector30ofFIGS.2-7may be incorporated in the power tap left connector32. And, while any of the above-described features of the like components of the node connector30can be incorporated into any one of the power tap left connector32, the power tap right connector, the terminator, and/or the splicer in some embodiments, such features will not be described in detail again below for the sake of brevity. For example, as shown inFIGS.10A and10B, the power tap left connector32can include a housing40, a protection cap, a printed circuit board44, a cable organizer46, and a cover48. As described above, the node connector30is configured to be coupled to a ribbon cable14so that the ribbon cable14extends out from the first and second sides62,64. However, in the power tap left connector32, a cut end of a ribbon cable14can be adjacent the first, or left, side62thereof, and the ribbon cable extends out of the connector32from the second, or right, side64thereof. As such, with respect to the housing40, the first side62may not include a lowered edge with a profile82, as described above, but, rather, may include a raised or straight edge extending from the first end66to the second end68. Additionally, with respect to the cover48, the inverse cable profile154may stop short of the first side140, in that the outer cover wall156defines an extended edge150extending entirely across the first side140. As a result, the straight edges prevent a ribbon cable14from extending out from the first side of the connector32. Furthermore, in some embodiments, the cable organizer46can include additional apertures124so as to accommodate multiple patterns of conductor contacts52to be used in any one of the node connector30, the power tap left connector32, the power tap right connector, the terminator, and/or the splicer. As such, the cable organizer46can be a universal cable organizer46for use in any type of connector. However, in other embodiments, the cable organizer46can include apertures124specific only to one, two, or more types of connectors. Accordingly, in some embodiments, the covers48of the node connector30and the power tap left connector32may be different in that the power tap left connector cover48includes the extended edge150along the first side140. In some embodiments, covers48may also differ with respect to placement of the features170. For example, while the feature170shown inFIGS.2-5is depicted as a line extending across the entire cover48, the feature shown inFIGS.10A and10Bis depicted as an indent that extends only to the second side142(e.g., indicating a power or ribbon cable direction). However, in some embodiments, the cover48may be manufactured without such components. For example, the cover48may not include the components, or the components can be applied to the cover48after manufacture based on its use with a desired connector. As such, in some embodiments, a universal cover48can be manufactured, applicable or adaptable to any type of connector within the network. Furthermore, in some embodiments, the cover48of the power tap left connector32can include a window184along the first side140, serving as an indicator for different stages of the installation process. For example, as shown inFIG.10B, in the preassembled state, the window184can act as a view port to assist with positioning of the ribbon cable14within the connector32. On the other hand, as shown inFIG.10A, the window184can act as an indicator that the connector32is in the assembled state when the raised edge of the housing40is viewable through the window184. Turning now to a power tap right connector (not shown), in some embodiments, a power tap right connector can include a housing40, a protection cap, a printed circuit board44, a cable organizer46, and a cover48. However, the power tap right connector can generally be a mirror image of the power tap left connector32. More specifically, in the power tap left connector32, as described above, a cut end of a ribbon cable14is adjacent the first, or left, side62thereof, and the ribbon cable extends out of the connector from the second, or right,64side thereof. However, in the power tap right connector, a cut end of a ribbon cable14is adjacent a second, or right, side64thereof, and the ribbon cable extends out of the connector from the first, or left, side62thereof. As such, with respect to the housing40, features on the first side62of the housing40of the power tap left connector32(such as the extended edge150with substantially straight profile) can be incorporated on the second side64of the housing40of the power tap right connector, and features on the second side64of the housing40of the power tap left connector32(such as the inverse ribbon profile82) can be incorporated on the first side62of the housing40of the power tap right connector. Furthermore, in some embodiments, the printed circuit board44can include conductor contacts52in the same relative locations, so that the power tap right connector can engage the same conductors22as the power tap left connector32. Furthermore, in some embodiments, the another difference between the covers48of the power tap left connector32and the power tap right connector may be the placement of the features170, such as being mirror images of each other. However, in some embodiments, the cover48may be manufactured without such components. For example, as discussed above, a universal cover48may not include the components, or the components can be applied to the cover48after manufacture based on its use with a desired connector. Turning now to a terminator (not shown), in some embodiments, a terminator can include a housing40, a cable organizer46, and a cover48. Like the power tap connectors32, the terminator can include one side62,64accommodating a cut end of a ribbon cable14. However, unlike the power tap connectors32and the node connector30, the terminator is not adapted to electrically or physically couple the ribbon cable14to a device in the network10. Thus, the terminator may not require certain features to accomplish such a device coupling. For example, in some embodiments, the housing40of the terminator can be substantially identical to the upper section56of the housing40of the power tap left connector32(e.g., including a similar width, length, and/or height as the upper section56). However, rather than including a lower section58defining an open bottom60, the terminator can include a rectangular housing with a closed bottom (e.g., the bottom seat78extends entirely across the bottom of the housing40). Additionally, the cable organizer46of the terminator can be identical to the cable organizer46of the power tap connectors32and/or the node connector30(e.g., a universal cable organizer46). However, in other embodiments, the cable organizer46can be specific only to the terminator, for example, without any apertures. Also, the cover48of the terminator can be identical to the cover48of the power tap right connector (or the power tap left connecter32). For example, when installed on the terminator, a cut end of a ribbon cable14can be adjacent a second, or right, side64thereof, and the ribbon cable14extends out of the terminator from the first, or left, side62thereof. That is, while no conductors22of the ribbon cable14are selectively severed by the terminator, the cut end of the ribbon cable14can be covered by the second side64of the housing40, with the cover48providing a visual indication of such termination via a feature170. Referring now a splicer (not shown), according to some embodiments, the splicer can include a housing40, a printed circuit board44, two cable organizers46, and two covers48. Like the power tap connectors32and the terminator, the splicer can accommodate cut ends of two ribbon cables14. Furthermore, unlike the power tap connectors32and the node connector30, splicer may not be adapted to electrically or physically couple the ribbon cable14to a device in the network10. Thus, the splicer may not require certain features to accomplish this coupling. For example, in some embodiments, the housing40of the splicer can be substantially identical to upper sections56of the housings40of the power tap left connector32and the power tap right connector, coupled together side-by-side (e.g., equal in width and height as the connectors32, but at least double the length). Thus, a first side62of the housing40can include an inverse ribbon profile82, like the power tap right connector to receive a first ribbon cable14, a second side64of the housing40can include an inverse ribbon profile82, like the power tap left connector32, to receive a second ribbon cable14, and a central raised edge (not shown) can extend through a center of the housing40, similar in function to the extended edges150of power tap connectors32, to cover cut ends of the first and second ribbon cables14. The central raised edge can be a separate component coupled to the housing40, or can be integral with the housing in some embodiments. In some embodiments, the central raise edge does not extend through an entire depth of the housing40, so that the interior space96can be defined within the housing40, extending from the first side62to the second side64thereof. The splicer can include a printed circuit board44that generally extends across the interior space96, with two sets of conductor contacts52configured to contact individual conductors of the first and second ribbon cables14, respectively. The printed circuit board44can further include traces that electrically couple the conductors of the first and second ribbon cables14together via the two sets of conductor contacts52. Additionally, the splicer can include two side-by-side cable organizers46, for example, each identical to the cable organizer46of the power tap connectors32, the node connector30, and/or the terminator (e.g., a universal cable organizer46). However, in other embodiments, the cable organizers46can be specific only to the splicer. Furthermore, as no electrical connections need to be made at to an external device, the interior space96of the housing40can accommodate the cable organizers46and a printed circuit board44without a socket receptacle. For example, rather than the housing40including lower sections58defining open bottoms60, the splicer can include a rectangular housing with a closed bottom (e.g., the bottom seat78extends entirely across the bottom of the housing40). Also, the splicer can include two covers48, for example, substantially identical to the covers48of the power tap left connector32and the power tap right connector coupled together to engage tracks94on both sides62,64of the housing40. In some embodiments, the central raised edge may also include a section adjacent the second end68with tracks94to receive internal ribs162of the covers48. Accordingly, when installed on the splicer, a cut end of a first ribbon cable14is adjacent the central raised edge and extends out of the splicer from the first, or left, side62thereof, and a cut end of a second ribbon cable14is adjacent the central raised edge and extends out of the splicer from the second, or right, side64thereof. In light of the above description, while the splicer can include a larger housing40than the other connectors, the splicer can still incorporate the same covers48and/or cable organizers46. As all connectors described above can include similar parts, such as similar covers48and/or housings40, a ribbon cable14can be installed on any connector using substantially the same method and/or the same tooling. For example, in some embodiments, a ribbon cable14can be installed on a desired connector using traditional tooling, such as conventional pliers. However, in other embodiments, specialty tooling specific to the connector may be used. Thus, according to some embodiments, the following method can be executed to install a ribbon cable14on a connector. First, while the connector is in the preassembled state, the cover48can be linearly translated away from the housing40to create a cable access pathway186, for example, as shown inFIG.4. For example, in some embodiments, the cover48can be pulled away from the housing40so that the ribs162slide along the tracks94until the notches176reach the upper detents172, thus maintaining the cover48away from the housing40in the preassembled state and creating the cable access pathway186. While the cable access pathway186is shown inFIG.4as an opening adjacent the first end66of the housing40, in some embodiments, a cable14may instead be inserted via the sides62,64of the housing40. Additionally, because the cover48remains coupled to the housing40in the preassembled state, the connector (and, more specifically, the guide walls92of the housing40and/or the outer walls156of the cover48along the second end146) can “hang” on the ribbon cable14during installation at a desired location along the ribbon cable14. The ribbon cable14can then be inserted and positioned, via the cable access pathway186, onto the cable organizer46so that the ribbon profile28of the ribbon cable14conforms to and aligns with the inverse ribbon profile122of the cable organizer46. For example, the ribbon cable14can be inserted on the cable organizer46so that the respective strips128on the cable organizer46and the ribbon cable14can be aligned. In some embodiments, such alignment can be assisted by the angled surfaces126adjacent the flat surface110of the cable organizer46, as further described below. In addition, in some embodiments, with respect to the power tap connectors32, the terminator, and/or the splicer, a cut end of the ribbon cable14can be aligned adjacent the raised edge150or central raised edge of the housing40. Once the ribbon cable14is generally aligned, the cover48can be pressed linearly along the axis134toward the housing40. That is, the cover48can be pressed toward the housing40so that the ribs162slide along the tracks94until the notches176reach the lower detents174to entrap the ribbon cable14within the housing40between the cover48and the cable organizer46. As the cover48is being pressed toward the housing40, the ribbon cable14can be more precisely aligned relative to the cable organizer46as it slides down the angled surfaces126toward the profiled surface122. Thus, the angled surfaces126can act as cable guide ramps to guide the cable onto the profiled surface122. In some embodiments, a clamping tool, such as a pliers, can be used to press the cover48toward the housing40to move the connector from the preassembled state to the assembled state, as described above. That is, the tool can engage the upper surface148of the cover48(such as the bump164) and a lower surface of the connector30,32. The lower surface can be, for example, the lower surface of the housing40(e.g., the lower section58of the housing40of the node connector30, or the power tap connectors32, or the enclosed bottom seat78of the terminator or the splicer). In some embodiments, to protect the open bottom60of the power tap connectors32and the node connector30, the protection cap can first be placed over the lower section58of the housing40so that the tool can instead engage the protection cap. Once engaged, the tool can be actuated to press the cover48toward the housing40. In some embodiments, at the end of this movement, the applied compression forces can be distributed fully onto the housing40. This clamping further completes termination of each conductor contact52onto the ribbon cable14, thus electrically coupling the conductors22to the socket receptacle100in the power tap and node connectors30,32, and coupling the conductors22of adjacent ribbon cables14together in the splicer. The tool can press the cover48toward the housing40with enough force to disengage the lower detents112of the cable organizer46from the upper slots136of the housing40, moving the cable organizer46downward until the lower detents112snap into the lower slots138of the housing40. Furthermore, the tool can press the cover48toward the housing40with enough force to disengage the notches176from the upper detents172until the notches176slide down the tracks94and engage the lower detents174. These engagements can provide haptic feedback at the different stages of the cable termination process. Furthermore, the ribs162and the tracks94can permit a linear range of motion of the cover48irrespective of the direction or magnitude of applied forces by the tool against the connector30,32from initial closing of the cover48until the cable termination. That is, while the cover48can move in a single directional line of motion, the input motion of the tool need not be in the same directional line of motion. As a result, proper connections between the connector30,32and the ribbon cable14can be achieved with less precision during the clamping process, and using common tooling. For example, the profiled (e.g., nonplanar) upper surface148of the cover48, as described above, can allow a clamping tool with varying placement positions, jaw opening angles, and force component vectors, to be used to primarily transmit a useful linear magnitude and direction of force to close the cover48and fully terminate a ribbon cable14in a desired linear manner. It should be noted that, while the profiled upper surface148is discussed herein with respect to the linear, sliding connector design, it may also be applicable to hinged, floating hinge, or multi-degree of freedom connector designs of some embodiments. In the preceding specification, various embodiments have been described with reference to the accompanying drawings. It will, however, be evident that various modifications and changes may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the claims that follow. The specification and drawings are accordingly to be regarded in an illustrative rather than restrictive sense. | 47,949 |
11862890 | DETAILED DESCRIPTION TO EXECUTE THE INVENTION Description of Embodiments of Present Disclosure First, embodiments of the present disclosure are listed and described. [1] The connection terminal of the present disclosure includes a terminal connecting portion to be electrically connected to a mating terminal, a wire connecting portion to be electrically connected to a wire, and an intermediate portion provided between the terminal connecting portion and the wire connecting portion, wherein the terminal connecting portion has a hollow cylindrical shape, the terminal connecting portion includes a first slit extending over an entire length in an axial direction of the terminal connecting portion, the intermediate portion has a rectangular tube shape, and the intermediate portion includes a second slit extending over an entire length in an axial direction of the intermediate portion. According to this configuration, the terminal connecting portion and the intermediate portion are formed into a tubular shape having a hollow structure inside. Further, the terminal connecting portion and the intermediate portion are respectively formed with the first and second slits extending over the entire lengths in the axial directions of the terminal connecting portion and the intermediate portion. Thus, the connection terminal including the terminal connecting portion and the intermediate portion can be formed by press-working. In this way, the connection terminal can be more inexpensively manufactured than conventional connection terminals manufactured by cutting. As a result, increases in manufacturing costs of the connection terminal and a connector including the connection terminal can be suitably suppressed. Note that the “tubular shape” in this specification means not only the one formed by a peripheral wall continuous over the entire periphery in a circumferential direction, but also the one formed by a peripheral wall having slit(s) extending in an axial direction in parts in the circumferential direction or the one formed by a peripheral wall formed with radially penetrating through hole(s). [2] Preferably, the terminal connecting portion includes a hollow cylindrical base portion connected to the intermediate portion and a hollow cylindrical tubular connecting portion connected to the base portion, and the tubular connecting portion includes a plurality of resilient pieces provided at predetermined intervals along a circumferential direction of the tubular connecting portion and the plurality of resilient pieces form a hollow cylindrical contour of the tubular connecting portion. According to this configuration, the terminal connecting portion can be in contact with the mating terminal at many points by the plurality of resilient pieces. Thus, many contact points with the mating terminal can be ensured and contact resistance between the mating terminal and the terminal connecting portion can be reduced. Further, since the connection terminal can be formed by press-working, an increase in processing cost caused by an increase in the number of the resilient pieces can be suppressed as compared to the case where a connection terminal is formed by cutting. Thus, the number of the resilient pieces can be increased while an increase in manufacturing cost is suppressed. As a result, the number of the contact points with the mating terminal can be increased. Thus, the contact resistance between the mating terminal and the terminal connecting portion can be reduced. Since heat generation during the energization of the connection terminal can be suitably suppressed in this way, a large current can be caused to flow in the connection terminal. [3] Preferably, each resilient piece includes a base end part connected to the base portion, a tip part serving as an end part on a side opposite to the base end part in the axial direction of the tubular connecting portion and a contact portion provided between the base portion and the tip part, and a thickness of the base end part is smaller than that of the contact portion. According to this configuration, since the base end part serving as a fixed end of each resilient piece is formed to be thinner than the contact portion, each resilient piece is easily resiliently deformed. Since each resilient piece is easily deflected in a radial direction of the tubular connecting portion in this way, each resilient piece can be suitably brought into contact with the mating terminal. [4] Preferably, the thickness of the contact portion is constant over an entire length in a longitudinal direction of the contact portion along the axial direction of the tubular connecting portion. According to this configuration, the contact portion can be formed to be thicker than the base end part over the entire length in the longitudinal direction of the contact portion. Since a conductor cross-sectional area of the contact portion can be increased in this way, heat generation during the energization of the connection terminal can be suitably suppressed. [5] Preferably, a thickness of the tip part becomes smaller from the side of the contact portion toward an opening end of the tubular connecting portion, and an inner diameter of the tip part of the tubular connecting portion becomes larger from the side of the contact portion toward the opening end of the tubular connecting portion. According to this configuration, an opening diameter of the tubular connecting portion becomes wider from the side of the contact portion toward the opening end of the tubular connecting portion at an opening end part of the tubular connecting portion. In this way, the mating terminal is guided to a back side of the tubular connecting portion along the slopes of the tip parts in inserting the mating terminal into the tubular connecting portion. In this way, the mating terminal can be easily inserted into the tubular connecting portion. [6] Preferably, the tubular connecting portion includes a plurality of third slits extending over an entire length in the axial direction of the tubular connecting portion from the opening end of the tubular connecting portion, the plurality of third slits are provided at predetermined intervals along the circumferential direction of the tubular connecting portion, and some of the plurality of third slits constitute the first slit. According to this configuration, the plurality of third slits are formed to extend over the entire length in the axial direction of the tubular connecting portion. Thus, water and mud having intruded into the tubular connecting portion can be suitably discharged to the outside of the tubular connecting portion through the third slits. [7] The base portion includes a plurality of projections formed on an outer surface of the base portion, the plurality of projections include two projections provided at positions different from each other in an axial direction of the base portion, and each projection projects further radially outward than an outer surface of the tubular connecting portion. According to this configuration, the projections projecting further radially outward than the outer surface of the tubular connecting portion are provided on the outer surface of the base portion. Thus, if the connection terminal is, for example, inclined in the terminal accommodating portion when being accommodated into the connector housing, the projection can be brought into contact with the inner surface of the connector housing before the outer surface of the tubular connecting portion contacts the inner surface of the connector housing. Therefore, even if the connection terminal is inclined in the connector housing, the contact of the tubular connecting portion with the inner surface of the connector housing can be suitably suppressed. Here, if the tubular connecting portion contacts the inner surface of the connector housing, there is a problem that an insertion force in inserting the mating terminal into the tubular connecting portion increases. Further, if the insertion force in inserting the mating terminal into the tubular connecting portion increases, there is a problem that a load applied to the tubular connecting portion increases and the tubular connecting portion is more easily damaged. In contrast, in the above configuration, the contact of the tubular connecting portion with the inner surface of the connector housing can be suppressed, wherefore the occurrence of the above problems can be suppressed. [8] Preferably, a planar shape of the intermediate portion when viewed from the axial direction of the intermediate portion is larger in size than that of the terminal connecting portion when viewed from the axial direction of the terminal connecting portion. According to this configuration, a conductor cross-sectional area of the intermediate portion can be increased, wherefore heat generation during the energization of the connection terminal can be suitably suppressed. [9] Preferably, a through hole penetrating through a conductive material of the connection terminal to discharge a liquid in a direction different from a direction toward the wire connecting portion is further provided between the wire connecting portion and the terminal connecting portion. According to this configuration, even if a liquid such as water flows from the side of the terminal connecting portion toward the side of the wire connecting portion, the flow of that liquid to the wire connecting portion can be suppressed by the through hole formed between the wire connecting portion and the terminal connecting portion. In this way, the flow of the liquid such as water to a connected part of the wire connecting portion and the wire can be suppressed. Thus, the occurrence of corrosion, for example, in the connected part of the wire connecting portion and the wire can be suitably suppressed. [10] Preferably, the wire connecting portion includes a reinforcing portion projecting in a direction intersecting the longitudinal direction. According to the configuration, the strength of the wire connecting portion to be connected to the wire can be enhanced by providing the reinforcing portion. Further, since a conductor cross-sectional area of the wire connecting portion can be increased, heat generation during the energization of the connection terminal can be suitably suppressed. [11] Preferably, the plurality of resilient pieces respectively have a plurality of inner peripheral surfaces surrounding a center axis of the tubular connecting portion, each of the plurality of inner peripheral surfaces includes a dent, and the dents of the plurality of inner peripheral surfaces are provided at the same position in the axial direction of the tubular connecting portion. According to this configuration, the electrical connectivity of the connection terminal and the mating terminal can be improved by the dents of the plurality of resilient pieces. [12] Preferably, each resilient piece includes a tip part, and the dent is provided at a position closer to the tip part of each resilient piece than the base portion in the inner peripheral surface of each resilient piece. According to this configuration, the electrical connectivity of the connection terminal and the mating terminal can be improved by locally processing the inner peripheral surfaces of the resilient pieces. [13] Preferably, each resilient piece includes a contact portion between the base portion and the tip part, the inner peripheral surface of each resilient piece includes a tip part inner peripheral surface serving as a slope included in the tip part of each resilient piece and a contact portion inner peripheral surface included in the contact portion, and the dent is adjacent to a boundary between the tip part inner peripheral surface and the contact portion inner peripheral surface in the contact portion inner peripheral surface of each resilient piece or extends across the boundary. According to this configuration, the electrical connectivity of the connection terminal and the mating terminal can be improved by locally processing the inner peripheral surfaces of the resilient pieces. [14] A connector of the present disclosure preferably includes the connection terminal of any one of [1] to [13] described above, and a connector housing for holding the connection terminal. According to this configuration, an increase in the manufacturing cost of the connector including the connection terminal and the connector housing can be suitably suppressed. [15] Preferably, the connector housing is mounted in a vehicle, and a charging connector is connected to the connector housing. According to this configuration, an increase in the manufacturing cost of the connector to which the charging connector is connected can be suitably suppressed. Details of Embodiment of Present Disclosure Specific examples of a connection terminal and a connector of the present disclosure are described below with reference to the drawings. In each figure, some of components may be shown in an exaggerated or simplified manner for the convenience of description. A dimensional ratio of each part may be different in each figure. “Parallel”, “orthogonal”, “horizontal” in this specification mean not only strictly parallel, orthogonal and horizontal, but also substantially parallel, orthogonal and horizontal within a range in which functions and effects in an embodiment are achieved. “Facing each other” in this specification indicates that surfaces or members are at positions opposite to each other and means not only cases where surfaces or members are at positions perfectly opposite to each other, but also cases where surfaces or members at positions partially opposite to each other. Note that the present invention is not limited to these illustrations and is intended to be represented by claims and include all changes in the scope of claims and in the meaning and scope of equivalents. (Schematic Configuration of Vehicle-Side Connector10) A vehicle-side connector10shown inFIG.1is for charging a power storage device (not shown) installed in a vehicle V (seeFIG.2) such as an electric vehicle or plug-in hybrid vehicle. The vehicle-side connector10is, for example, a connector for quick charging in which a large current of about 200 A to 400 A flows. As shown inFIG.2, the vehicle-side connector10is fixed to the vehicle V by fastening members (not shown) such as bolts. The vehicle-side connector10is connected to the power storage device (not shown) via wires70. As shown inFIGS.2and3, a charger-side connector80(charging connector) is connected as a mating connector to the vehicle-side connector10. In an example shown inFIGS.2and3, the charger-side connector80is connected to the vehicle-side connector10from a left side. A lateral direction inFIGS.2and3is an inserting/withdrawing direction of the charger-side connector80. In the following description, the lateral direction inFIGS.2and3is referred to as a front-rear direction, a vertical direction inFIG.2is referred to as a vertical direction and a vertical direction inFIG.3is referred to as a lateral direction. Further, in the following description, a left side ofFIG.2is referred to as a front side, a right side ofFIG.2is referred to as a rear side, an upper side ofFIG.2is referred to as an upper side, a lower side ofFIG.2is referred to as a lower side, an upper side ofFIG.3is referred to as a right side, and a lower side ofFIG.3is referred to as a left side. (Specific Configuration of Vehicle-Side Connector10) As shown inFIG.3, the vehicle-side connector10includes a connector housing20and one or more (two in this embodiment) vehicle-side terminals50. The connector housing20includes a housing body30and a retainer40. (Configuration of Housing Body30) The housing body30is made of insulating synthetic resin. The housing body30includes a fitting portion31, a flange portion32, a tube portion33, one or more (two in this embodiment) terminal accommodating portions34, and one or more (two in this embodiment) terminal holding portions35. The fitting portion31is, for example, formed into a tubular shape. The charger-side connector80is inserted into the fitting portion31. Here, the charger-side connector80includes a connector housing81and charger-side terminals82(mating terminals) held in the connector housing81. A tip part (here, a rear end part) of the connector housing81is fit into the fitting portion31. The fitting portion31is, for example, formed into a tubular shape closed on one end (here, rear end). The fitting portion31of this embodiment is formed into a hollow cylindrical shape with an open front end part. The fitting portion31includes, for example, a hollow cylindrical receptacle31A and a back wall portion31B closing the rear end of the receptacle31A. As shown inFIG.1, the flange portion32is formed to project radially outwardly of the receptacle31A from the outer peripheral surface of the receptacle31A. The flange portion32is, for example, formed to project radially outward over the entire periphery in a circumferential direction of the receptacle31A. The flange portion32of this embodiment is in the form of a rectangular plate. The flange portion32includes a plurality of mounting holes32X penetrating through the flange portion32in a plate thickness direction (here, front-rear direction). The fastening members (not shown) such as bolts are inserted into the respective mounting holes32X. The vehicle-side connector10is fixed to the vehicle V (seeFIG.2) by these fastening members. As shown inFIG.3, the tube portion33extends rearward from the back wall portion31B. The tube portion33of this embodiment is formed into a hollow cylindrical shape. The outer peripheral surface of the tube portion33is, for example, formed to be continuous with the outer peripheral surface of the receptacle31A formed behind the flange portion32. An inner diameter of the tube portion33is, for example, larger than that of the fitting portion31. Each terminal accommodating portion34extends forward from the back wall portion31B. Each terminal accommodating portion34is formed to be surrounded by the receptacle31A. Each terminal accommodating portion34is, for example, formed into a tubular shape. Each terminal accommodating portion34of this embodiment is formed into a hollow cylindrical shape. Two terminal accommodating portions34are, for example, provided side by side in the lateral direction of the vehicle-side connector10. Each terminal holding portion35extends rearward from the back wall portion31B. Each terminal holding portion35is, for example, formed into a tubular shape having a hollow structure inside. Each terminal holding portion35includes peripheral walls36for surrounding the vehicle-side terminal50. The peripheral walls36are formed to extend in the front-rear direction. As shown inFIG.4, each terminal holding portion35of this embodiment is formed into a rectangular tube shape. Each terminal holding portion35is formed to have a rectangular planer shape when viewed from an axial direction (here, front-rear direction) of the terminal holding portion35. That is, each terminal holding portion35has four peripheral walls36. Each peripheral wall36is in the form of a plate. Each terminal holding portion35is integrally formed by four continuous peripheral walls36. Each terminal holding portion35includes a slit35X extending in the axial direction of the terminal holding portion35. The slit35X is formed to extend over the entire length in the axial direction of the terminal holding portion35. The slit35X is, for example, formed in the peripheral wall36provided on a lower side, out of the four peripheral walls36. An internal space of each terminal holding portion35communicates, for example, with that of each terminal accommodating portion34. The internal space of each terminal holding portion35is, for example, formed to be wider than that of the terminal accommodating portion34. For example, the internal space of each terminal holding portion35is formed one size larger than the terminal accommodating portion34. The rear surface of the back wall portion31B is partially exposed in each terminal holding portion35. The vehicle-side terminal50is inserted into the terminal accommodating portion34and the terminal holding portion35. That is, each terminal accommodating portion34and each terminal holding portion35constitute a terminal accommodation tube for accommodating the vehicle-side terminal50. The housing body30includes a plurality of signal terminal holding portions37. An unillustrated signal terminal is accommodated into each signal terminal holding portion37. The signal terminal is, for example, used for communication with a charging device. A signal line is connected to the signal terminal. (Configuration of Vehicle-Side Terminal50) As shown inFIGS.5and6, each vehicle-side terminal50includes, for example, a terminal connecting portion51to be electrically connected to the charger-side terminal82(seeFIG.3) as a mating terminal, and a wire connecting portion55to be electrically connected to the wire70(seeFIG.3). Each vehicle-side terminal50includes an intermediate portion56provided between the terminal connecting portion51and the wire connecting portion55. Each vehicle-side terminal50is, for example, a single component in which the terminal connecting portion51, the intermediate portion56and the wire connecting portion55are integrally formed while being connected in the front-rear direction. A metal material such as copper, copper alloy, aluminum, aluminum alloy or stainless steel can be, for example, used as a material of each vehicle-side terminal50. Surface processing such as silver plating, tin plating or aluminum plating may be applied to each vehicle-side terminal50according to the type of the constituent metal and the use environment of the vehicle-side terminal50. Each vehicle-side terminal50can be formed, for example, by press-working a metal plate excellent in conductivity. In this specification, an arrangement direction of the terminal connecting portion51, the intermediate portion56and the wire connecting portion55is called a “longitudinal direction” in the vehicle-side terminal50. In this embodiment, the longitudinal direction of the vehicle-side terminal50coincides with the front-rear direction. (Configuration of Terminal Connecting Portion51) As shown inFIG.5, the terminal connecting portion51is, for example, provided in a front end part of the vehicle-side terminal50. The terminal connecting portion51is, for example, a female terminal. The terminal connecting portion51includes a base portion52and a tubular connecting portion53provided in front of the base portion52. In the terminal connecting portion51, the base portion52and the tubular connecting portion53are integrally formed while being connected in the longitudinal direction. The base portion52is, for example, formed into a tubular shape having a hollow structure inside. The base portion52is formed into a hollow cylindrical shape. The base portion52includes a slit52X extending over the entire length in the axial direction in which a center axis of the base portion52extends. As shown inFIG.3, the base portion52is, for example, accommodated in the terminal accommodating portion34. An outer diameter of the base portion52is, for example, set slightly smaller than an inner diameter of the terminal accommodating portion34. With the base portion52accommodated in the terminal accommodating portion34, the outer peripheral surface of the base portion52is, for example, at least partially in contact with the inner peripheral surface of the terminal accommodating portion34. The outer peripheral surface of the base portion52and the inner peripheral surface of the terminal accommodating portion34may be in surface contact, line contact or point contact with each other. The tubular connecting portion53is formed into a tubular shape having a hollow structure inside. The tubular connecting portion53is formed into a hollow cylindrical shape. The charger-side terminal82of the charger-side connector80is inserted into the tubular connecting portion53. The charger-side terminal82of this embodiment is a male terminal. As shown inFIG.6, the tubular connecting portion53includes, for example, a plurality of resilient pieces53A provided at predetermined intervals along a circumferential direction of the tubular connecting portion53. The tubular connecting portion53is, for example, formed such that the plurality of resilient pieces54form a hollow cylindrical shape as a whole. In an example shown inFIGS.6and7, the inner peripheral surfaces or radially inward facing surfaces of the plurality of resilient pieces54correspond to the inner contour or inner surface of the tubular connecting portion53, and the outer peripheral surfaces or radially outward facing surfaces of the plurality of resilient pieces54correspond to the outer contour or outer surface of the tubular connecting portion53. In the tubular connecting portion53of this embodiment, eight resilient pieces54are provided at the predetermined intervals along the circumferential direction of the base portion52. In the tubular connecting portion53of this embodiment, eight resilient pieces54are provided at equal intervals along the circumferential direction of the base portion52. The tubular connecting portion53is provided with slits53X extending over the entire length in an axial direction, in which a center axis of the tubular connecting portion53extends, and provided at predetermined intervals along the circumferential direction of the tubular connecting portion53. One of the plurality of slits53is, for example, formed to be continuous with the slit52X of the base portion52. That is, the one slit53X is formed to communicate with the slit52X of the base portion52. The slit52X is, for example, formed to be narrower than the slit53X in a dimension along the circumferential direction of the base portion52(i.e. width). Each slit53X is, for example, formed to have a constant width over the entire length in the longitudinal direction. As shown inFIG.7, each resilient piece54includes a base end part54A (here, rear end part) connected to the base portion52, a tip part54B (here, front end part) located on a side opposite to the base end part54A in the longitudinal direction and a contact portion54C located between the base end part54A and the tip part54B. Each resilient piece54is cantilevered with the tip part54B as a free end and the base end part54A as a fixed end. Each resilient piece54is springy. Each resilient piece54is configured to be radially deflectable by being resiliently deformed. The base end part54A is, for example, formed to be smaller than the contact portion54C in a diameter along a radial direction of the tubular connecting portion53(i.e. thickness). The base end part54A is, for example, formed to have a smaller thickness than the base portion52. A thickness of the contact portion54C is, for example, the same as that of the base portion52. The thickness of the contact portion54C is, for example, constant over the entire length in the longitudinal direction of the contact portion54C. The tip part54B is, for example, formed to have a smaller thickness than the contact portion54C. The thickness of the tip part54B becomes smaller from the side of the contact portion54C toward an opening end of the tubular connecting portion53. The inner surface of the tip part54B is formed into a slope. As shown inFIG.3, an outer diameter of the tubular connecting portion53is, for example, set smaller than the inner diameter of the terminal accommodating portion34. An inner diameter of the tubular connecting portion53is set slightly smaller than an outer diameter of the charger-side terminal82. The tubular connecting portion53is, for example, so formed that the inner diameter becomes smaller from the side of the base portion52toward the opening end of the tubular connecting portion53. However, the tubular connecting portion53is so formed that the inner diameter increases from the side of the contact portions54C toward the opening end of the tubular connecting portion53at the tip parts54B. That is, a tip part of the tubular connecting portion53is formed to guide the charger-side terminal82to a back side of the tubular connecting portion53in an inserting direction. When the charger-side terminal82is inserted into the tubular connecting portion53, the plurality of resilient pieces54(specifically, inner peripheral surfaces of the contact portions54C of the resilient pieces54) contact the outer peripheral surface of the charger-side terminal82. In this way, the tubular connecting portion53(terminal connecting portion51) and the charger-side terminal82are electrically connected. The base portion52and the tubular connecting portion53(i.e. terminal connecting portion51) described above are accommodated in the terminal accommodating portion34. (Configuration of Wire Connecting Portion55) As shown inFIG.8, the wire connecting portion55is, for example, provided in a rear end part of the vehicle-side terminal50. The wire connecting portion55is electrically connected to an end part of the wire70. The wire70of this embodiment includes a busbar71made of a metal material excellent in conductivity. The busbar71is, for example, in the form of a flat plate. The busbar71includes, for example, a through hole71X penetrating in a plate thickness direction (here, vertical direction). A metal material such as a copper-based or aluminum-based metal material can be used as the material of the busbar71. The wire connecting portion55is in the form of a flat plate. The wire connecting portion55includes, for example, a through hole55X penetrating in a plate thickness direction (here, vertical direction). The wire connecting portion55is connected to the busbar71, such as by bolting, ultrasonic welding or crimping. In this embodiment, the busbar71is so provided on the upper surface of the wire connecting portion55that the through hole55X of the wire connecting portion55and the through hole71X of the busbar71overlap in the vertical direction. By fastening a nut76to a shaft part of a bolt75inserted through the through holes55X and71X, the wire connecting portion55and the busbar71are connected. In this way, the wire connecting portion55and the busbar71are electrically connected. As shown inFIG.5, reinforcing portions57projecting in a direction intersecting the longitudinal direction of the vehicle-side terminal50are, for example, formed on both lateral end parts of the wire connecting portion55. The reinforcing portions57of this embodiment are formed to project downward from the both lateral end parts of the wire connecting portion55. Each reinforcing portion57is, for example, formed to extend over the entire length in the longitudinal direction of the wire connecting portion55. (Configuration of Intermediate Portion56) The intermediate portion56is, for example, provided between the terminal connecting portion51and the wire connecting portion55. The intermediate portion56is formed into a rectangular tube shape having a hollow structure inside. The intermediate portion56is formed to have a rectangular planar shape when viewed from an axial direction in which a center axis of the intermediate portion56extends. The intermediate portion56of this embodiment includes a bottom wall56A continuously and integrally formed with the wire connecting portion55, a pair of side walls56B formed to project upward from both lateral end parts of the bottom wall56A, and a facing wall56C integrally formed to the side walls56B to face the bottom wall56A. The intermediate portion56includes a slit56X extending over the entire length in the axial direction of the intermediate portion56. The slit56X is, for example, formed in the facing wall56C. The slit56X of this embodiment is formed in a laterally central part of the facing wall56C. As shown inFIG.3, the intermediate portion56is, for example, held in the terminal holding portion35. The intermediate portion56is, for example, so dimensioned as to be accommodated into the internal space of the terminal holding portion35. The outer surface of the intermediate portion56is, for example, shaped to correspond to the inner surface of the terminal holding portion35. The terminal holding portion35is formed to surround the outer periphery of the intermediate portion56. Outside dimensions of the intermediate portion56are, for example, larger than the inner diameter of the terminal accommodating portion34. The front surface of the intermediate portion56is, for example, locked to the rear surface of the back wall portion31B exposed from the terminal holding portion35. With the intermediate portion56accommodated in the terminal holding portion35, the outer surface of the intermediate portion56is at least partially in contact with the inner surface of the terminal holding portion35. The outer surface of the intermediate portion56and the inner surface of the terminal holding portion35may be in surface contact, line contact or point contact with each other. (Configuration of Through Hole58) As shown inFIG.5, the vehicle-side terminal50includes a through hole58formed between the terminal connecting portion51and the wire connecting portion55. The through hole58is, for example, formed in the bottom wall56A of the intermediate portion56. The through hole58is formed to discharge a liquid such as water flowing from the side of the terminal connecting portion51in a direction different from a direction toward the wire connecting portion55. The through hole58is, for example, formed to penetrate through the bottom wall56A in a plate thickness direction (here, vertical direction). The through hole58is, for example, formed to extend in the lateral direction. As shown inFIG.8, the through hole58is formed at a position vertically overlapping the slit35X of terminal holding portion35with the vehicle-side terminal50accommodated in the terminal accommodating portion34and the terminal holding portion35. These through hole58and slit35X function as a water drainage hole for letting a liquid such as water having intruded from the side of the terminal connecting portion51escape to a part other than the wire connecting portion55(here, downward). As shown inFIG.5, a coupling portion59having a smaller lateral dimension than the wire connecting portion55and the bottom wall56A of the intermediate portion56is formed between the wire connecting portion55and the intermediate portion56. In other words, groove portions59A recessed toward a laterally central part are formed on both lateral end parts of the coupling portion59. Since the vehicle-side terminal50is formed by press-working a metal plate, a plate thickness (i.e. thickness) is constant as a whole and the thickness is partially reduced in parts of the base end part54A and the tip part54B. The plate thickness of a major part of the vehicle-side terminal50, specifically, the plate thickness of the vehicle-side terminal50in a part where the thickness is not set small, can be, for example, about 2 to 3 mm (Configuration of Retainer40) As shown inFIG.3, the retainer40is mounted on the rear end of the tube portion33of the housing body30. The retainer40retains the vehicle-side terminals50. The retainer40is, for example, made of synthetic resin. A synthetic resin such as polyolefin, polyamide, polyester or ABS resin can be, for example, as a material of the retainer40. The retainer40includes a base portion41, a peripheral wall42, and terminal pressing portions43. The base portion41is, for example, in the form of a circular plate. The peripheral wall42is, for example, formed to project forward from a peripheral edge part of the base portion41. The peripheral wall42is, for example, formed over the entire periphery in a circumferential direction of the peripheral edge part of the base portion41. The peripheral wall42is, for example, disposed outside the tube portion33of the housing body30. That is, the peripheral wall42is externally fit to the tube portion33of the housing body30. As shown inFIG.4, a plurality of locking portions38are formed on the outer peripheral surface of the tube portion33. The plurality of locking portions38are provided at predetermined intervals in a circumferential direction of the tube portion33. Each locking portion38is formed with a locking claw38A projecting radially outwardly of the tube portion33. The peripheral wall42is formed with a plurality of locking frame portions44, to which the locking claws38A of the locking portions38are locked. The respective locking frame portions44are provided at positions corresponding to the locking portions38. That is, the plurality of locking frame portions44are provided at predetermined intervals in a circumferential direction of the peripheral wall42. Each locking frame portion44is, for example, in the form of a substantially U-shaped frame, and includes an engaging hole44X engageable with the locking claw38A in a center. Each locking frame portion44is cantilevered with a base end part (i.e. end part connected to the base portion41) as a fixed end and a tip part on a side opposite to the base end part as a free end. Each locking frame portion44is, for example, configured to be radially deflectable by being resiliently deformed. The retainer40is, for example, mounted on the rear end of the tube portion33by engaging the locking claws38A with the engaging holes44X of the respective locking frame portions44. As shown inFIG.3, the terminal pressing portion43is, for example, formed to project forward from the base portion41. The terminal pressing portion43is provided at a position corresponding to the terminal holding portion35of the housing body30. As shown inFIG.9, the terminal pressing portion43of this embodiment is formed to have a U-shaped planar shape when viewed from the front-rear direction. The terminal pressing portion43is, for example, formed into a U shape open downward. As shown inFIG.8, the terminal pressing portion43is formed at a position corresponding to the side walls56B and the facing wall56C of the intermediate portion56of the vehicle-side terminal50. A tip part of the terminal pressing portion43is in contact with the rear surfaces of the side walls56B and the rear surface of the facing wall56C. The vehicle-side terminal50can be retained from behind by this retainer40. The retainer40includes, for example, through holes40X into which the wire connecting portions55and the reinforcing portions57of the vehicle-side terminals50are inserted. The through hole40X is formed to penetrate through the base portion41in the front-rear direction. The through hole40X is formed into a shape corresponding to the wire connecting portion55and the reinforcing portions57. As shown inFIG.9, the through hole40X of this embodiment is formed to have a U-shaped planar shape when viewed from the front-rear direction. The through hole40X is formed below the terminal pressing portion43. The retainer40includes, for example, a water drainage hole40Y provided in the lower end of the base portion41. The water drainage hole40Y is formed to penetrate through the base portion41in the front-rear direction. As shown inFIG.8, the water drainage hole40Y is a hole for discharging a liquid such as water flowing through the through holes58of the vehicle-side terminals50, the slits35X of the terminal holding portions35and the like to the outside of the vehicle-side connector10. The retainer40includes, for example, a plurality of signal line holding portions45. Signal lines connected to the signal terminals held in the signal terminal holding portions37of the housing body30are inserted into the signal line holding portions56. The signal terminals are retained from behind by the signal line holding portions45. Next, functions of this embodiment are described. (1) The vehicle-side terminal50includes the terminal connecting portion51to be electrically connected to the charger-side terminal82as a mating terminal, the wire connecting portion55to be electrically connected to the wire70and the intermediate portion56provided between the terminal connecting portion51and the wire connecting portion55. The terminal connecting portion51is formed into a hollow cylindrical shape. The terminal connecting portion51includes the slits52X,53X extending over the entire length in the axial direction of the terminal connecting portion51. The intermediate portion56is formed into a rectangular tube shape. The intermediate portion56includes the slit56X extending over the entire length in the axial direction of the intermediate portion56. According to this configuration, the terminal connecting portion51and the intermediate portion56are formed into a tubular shape having a hollow structure inside. Further, the terminal connecting portion51and the intermediate portion56are formed with the slits52X,53X and56X extending over the entire lengths in the axial directions of these terminal connecting portion51and intermediate portion56. Thus, the vehicle-side terminal50including the terminal connecting portion51and the intermediate portion56can be formed by press-working. In this way, the vehicle-side terminal50can be more inexpensively manufactured than conventional connection terminals manufactured by cutting. As a result, increases in the manufacturing costs of the vehicle-side terminal50and the vehicle-side connector10can be suitably suppressed. (2) The terminal connecting portion51includes the hollow cylindrical base portion52connected to the intermediate portion56and the hollow cylindrical tubular connecting portion53connected to the base portion52. The tubular connecting portion53includes the plurality of resilient pieces54provided at the predetermined intervals along the circumferential direction of the tubular connecting portion53, and the plurality of resilient pieces54are formed to form a hollow cylindrical contour of the tubular connecting portion53. According to this configuration, the terminal connecting portion51can be in contact with the charger-side terminal82as a mating terminal at many points by the plurality of resilient pieces54. Thus, many contact points with the charger-side terminal82can be ensured and contact resistance between the charger-side terminal82and the terminal connecting portion51can be reduced. Further, since the vehicle-side terminal50can be formed by press-working, an increase in processing cost caused by an increase in the number of the resilient pieces54can be suppressed as compared to the case where a connection terminal is formed by cutting. Thus, the number of the resilient pieces54can be increased while an increase in manufacturing cost is suppressed. As a result, the number of the contact points with the charger-side terminal82can be increased, wherefore the contact resistance between the charger-side terminal82and the terminal connecting portion51can be suitably reduced. Since heat generation during the energization of the vehicle-side terminal50can be suitably suppressed in this way, a large current can be caused to flow in the vehicle-side terminal50. Thus, even if a large current is used to increase the capacity of the power storage device installed in the vehicle or shorten a charging time, such a large current can be easily dealt with. For example, even if a large current of about 200 to 400 A flows in the vehicle-side terminal50, such a large current can be easily dealt with. (3) Each resilient piece54includes the base end part54A connected to the base portion52, the tip part54B, which is an end part on the side opposite to the base end part54A in the axial direction of the tubular connecting portion53, and the contact portion54C provided between the base end part54A and the tip part54B. The thickness of the base end part54A is smaller than that of the contact portion54C. According to this configuration, since the base end part54A serving as the fixed end of each resilient piece54is formed to be thinner than the contact portion54C, each resilient piece54is easily resiliently deformed. Since each resilient piece54is easily deflected in the radial direction of the tubular connecting portion53in this way, each resilient piece54can be suitably brought into contact with the outer surface of the charger-side terminal82. (4) The thickness of the contact portion54C is constant over the entire length in the longitudinal direction of the contact portion54C along the axial direction of the tubular connecting portion53. According to this configuration, the contact portion54C can be formed to be thicker than the base end part54A over the entire length in the longitudinal direction of the contact portion54C. Since conductor cross-sectional areas of the contact portion54C and the tubular connecting portion53can be increased in this way, heat generation during the energization of the vehicle-side terminal50can be suitably suppressed. (5) The thickness of the tip part54B becomes smaller from the side of the contact portion54C toward the opening end of the tubular connecting portion53. The tubular connecting portion53is so formed that the inner diameter becomes larger from the side of the contact portions54C toward the opening end of the tubular connecting portion53at the tip parts54B. According to this configuration, an opening diameter of the tubular connecting portion53becomes wider from the side of the contact portions54C toward the opening end of the tubular connecting portion53at an opening end part of the tubular connecting portion53. In this way, the charger-side terminal82is guided to the back side of the tubular connecting portion53along the slopes of the tip parts54B in inserting the charger-side terminal82into the tubular connecting portion53. In this way, the charger-side terminal82can be easily inserted into the tubular connecting portion53. (6) The tubular connecting portion53includes the plurality of slits53X extending over the entire length in the axial direction of the tubular connecting portion53from the opening end of the tubular connecting portion53. The plurality of slits53X are provided at the predetermined intervals along the circumferential direction of the tubular connecting portion53. One of the plurality of slits53X communicates with the slit52X of the base portion52. According to this configuration, the plurality of slits53X are formed to extend over the entire length in the axial direction of the tubular connecting portion53. Thus, water and mud having intruded into the tubular connecting portion53can be suitably discharged to the outside of the tubular connecting portion53through the slits53X. (7) The planar shape of the intermediate portion56when viewed from the axial direction of the intermediate portion56is larger in size than that of the terminal connecting portion51when viewed from the axial direction of the terminal connecting portion51. According to this configuration, a conductor cross-sectional area of the intermediate portion56can be increased. Thus, heat generation during the energization of the vehicle-side terminal50can be suitably suppressed. (8) The vehicle-side terminal50includes the through hole58formed between the wire connecting portion55and the terminal connecting portion51. The through hole58is formed to discharge a liquid in the direction (downward in this embodiment) different from the direction toward the wire connecting portion55. According to this configuration, even if a liquid such as water flows from the side of the terminal connecting portion51toward the side of the wire connecting portion55, the flow of that liquid to the wire connecting portion55can be suppressed by the through hole58formed between the wire connecting portion55and the terminal connecting portion51. In this way, the flow of the liquid such as water to a connected part of the wire connecting portion55and the wire70can be suppressed. Thus, the occurrence of corrosion, for example, in the connected part of the wire connecting portion55and the wire70can be suitably suppressed. (9) The wire connecting portion55is formed with the reinforcing portions57projecting in the direction intersecting the longitudinal direction in which the terminal connecting portion51, the intermediate portion56and the wire connecting portion55are arranged. According to the configuration, the strength of the wire connecting portion55to be connected to the wire70can be enhanced by providing the reinforcing portions57. Further, since a conductor cross-sectional area of the wire connecting portion55can be increased, heat generation during the energization of the vehicle-side terminal50can be suitably suppressed. Other Embodiments The above embodiment can be modified and carried out as follows. The above embodiment and the following modifications can be carried out in combination without technically contradicting each other.The structure of the connector housing20in the above embodiment is not particularly limited. That is, if the connector housing20has a structure capable of holding the vehicle-side terminals50, other structures are not particularly limited. For example, as shown inFIG.10, the terminal holding portions35may be changed to hollow cylindrical terminal holding portions35A. The terminal holding portion35A is formed to surround the intermediate portion56having a rectangular tube shape. The terminal holding portion35A includes a slit35Y extending over the entire length in an axial direction of the terminal holding portion35A. The slit35Y is, for example, provided in a circumferentially lower end of the terminal holding portion35A. An inner diameter of the terminal holding portion35A is, for example, set to allow the rotation of the intermediate portion56about the center axis of the intermediate portion56inside the terminal holding portion35A. The inner diameter of the terminal holding portion35A is, for example, set to be able to restrict the rotation of the intermediate portion56about the center axis of the intermediate portion56within a predetermined range. For example, the rotation of the intermediate portion56about the center axis of the intermediate portion56is restricted by the outer surface of the intermediate portion56partially contacting the inner surface of the terminal holding portion35A. Although the slit35X is formed to extend over the entire length in the axial direction of the terminal holding portion35in the above embodiment, there is no limitation to this. For example, the slit35X may be formed only partially in the axial direction of the terminal holding portion35. For example, the slit35X may be formed only at a position vertically overlapping the through hole58of the vehicle-side terminal50in the axial direction of the terminal holding portion35.The slit35X in the above embodiment may not be formed.The retainer40in the above embodiment may be omitted.As shown inFIGS.11and12, a plurality of projections90projecting radially outwardly of the base portion52may be formed on the outer surface of the base portion52of the vehicle-side terminal50. Each projection90is formed to project further radially outward than the outer surface of each resilient piece54. The plurality of projections90are provided at positions different in the axial direction of the base portion52. For example, the plurality of projections90include a plurality of (here, three) projections91provided on a side near the tubular connecting portion53and a plurality of (here, three) projections92provided on a side near the intermediate portion56. The projections91,92are, for example, provided at positions different from each other in the circumferential direction of the base portion52. The plurality of projections91are, for example, provided at predetermined intervals along the circumferential direction on the same circumference of the base portion52. The plurality of projections91are, for example, provided at positions separated by 2π/3 [rad] along the circumferential direction of the base portion52. The plurality of projections92are, for example, provided at predetermined intervals along the circumferential direction on the same circumference of the base portion52. The plurality of projections92are, for example, provided at positions separated by 2π/3 [rad] along the circumferential direction of the base portion52. As shown inFIG.13, each projection90is, for example, formed to be raised radially outwardly of the base portion52from the outer surface of the base portion52. Each projection90is, for example, formed continuously and integrally with the base portion52. Recesses90X recessed toward the projections90are formed at positions corresponding to the respective projections90in the inner surface of the base portion52. For example, the projections90and the recesses90X are formed to overlap in radial directions of the base portion52. If the tubular connecting portion53of the vehicle-side terminal50contacts the inner surface of the terminal accommodating portion34, there is a problem of increasing an insertion force in inserting the charger-side terminal82into the tubular connecting portion53. Further, if the insertion force in inserting the charger-side terminal82into the tubular connecting portion53is increased, there is a problem that a load applied to the tubular connecting portion53increases and the tubular connecting portion53is easily damaged. In contrast, in this modification, the projections90projecting further radially outward than the outer surface of the tubular connecting portion53are provided on the outer surface of the base portion52. Thus, if the vehicle-side terminal50is, for example, inclined in the terminal accommodating portion34, the projection90can be brought into contact with the inner surface of the terminal accommodating portion34before the outer surface of the tubular connecting portion53contacts the inner surface of the terminal accommodating portion34. In this way, even if the vehicle-side terminal50is inclined in the terminal accommodating portion34, the contact of the vehicle-side terminal50with the inner surface of the terminal accommodating portion34can be suitably suppressed. Therefore, an increase in the insertion force in inserting the charger-side terminal82into the tubular connecting portion53can be suitably suppressed.In the modification shown inFIGS.11to13, the number and formation positions of the projections90are not particularly limited.The structure of the vehicle-side terminal50in the above embodiment is not particularly limited. That is, if the vehicle-side terminal50includes the terminal connecting portion51having a hollow cylindrical shape, the wire connecting portion55and the intermediate portion56having a rectangular tube shape, other structures are not particularly limited.For example, the number of the resilient pieces54in the tubular connecting portion53is not particularly limited. The number of the resilient pieces54in the tubular connecting portion53may be seven or less or nine or more.Although the base end part54A of each resilient piece54is formed to be thinner than the contact portion54C in the above embodiment, there is no limitation to this. For example, the base end part54A may be formed to have the same thickness as the contact portion54C.Although the tip part54B of each resilient piece54is formed to be thinner than the contact portion54C in the above embodiment, there is no limitation to this. For example, the tip part54B may be formed to have the same thickness as the contact portion54C.The base portion52of the terminal connecting portion51in the above embodiment may be omitted. In this case, the terminal connecting portion51is, for example, composed only of the tubular connecting portion53.The intermediate portion56is formed to have a rectangular planar shape when viewed from the axial direction of the intermediate portion56in the above embodiment, there is no limitation to this. For example, the intermediate portion56may be formed to have a polygonal planar shape with five or more sides when viewed from the axial direction of the intermediate portion56.The reinforcing portions57of the vehicle-side terminal50in the above embodiment may be omitted.The through hole58of the vehicle-side terminal50in the above embodiment may be omitted.Projections similar to the projections90shown inFIG.11may be provided on the outer surface of the intermediate portion56of the above embodiment.A connection method of the wire connecting portion55and the wire70in the above embodiment is not limited to bolting. For example, the wire connecting portion55and the wire70may be connected by crimping, laser welding or ultrasonic welding.The structure of the wire70in the above embodiment is not particularly limited. For example, the wire70may be embodied by a structure including the busbar71and an insulation coating for covering the outer periphery of the busbar71. A stranded wire formed by twisting a plurality of metal strands or a tubular conductor having a hollow structure inside can be used as a core of the wire70without limitation to the busbar71. Further, a combination of a stranded wire and a column-like or tubular conductor such as the busbar71may be used as the core of the wire70.The vehicle-side connector10is embodied by a connector for quick charging provided in the vehicle V such as an electric vehicle or plug-in hybrid vehicle in the above embodiment, there is no limitation to this. The type of the vehicle-side connector10is not particularly limited, for example, if the vehicle-side connector10includes the vehicle-side terminal(s)50and the connector housing20for holding the vehicle-side terminal(s)50.In the above embodiment and modifications, the slit52X and/or the slit56X may be clearance(s) formed between two end surfaces of a metal plate constituting the vehicle-side terminal50. The two end surfaces of the metal plate may be openable and closable, i.e. contactable and separable. A width of the slit52X and/or56X, which is a distance between the two end surfaces of the metal plate, may be temporarily or constantly zero.The shape of the resilient pieces54in the above embodiment and modifications may be changed.FIG.14is a schematic diagram showing a vehicle-side terminal150as another modification. This vehicle-side terminal150is different from the vehicle-side terminals50according to the embodiment and modifications in the shape of each resilient piece154of a tubular connecting portion53, more specifically in the shape of an inner peripheral surface155of each resilient piece154. The vehicle-side terminal150of the modification is described below, centering on points of difference from the vehicle-side terminal50according to the embodiment and components similar to those of the embodiment are denoted by the same reference signs and not described in detail. (Configuration of Inner Peripheral Surface155) A plurality of the resilient pieces154of the vehicle-side terminal150have the inner peripheral surfaces155surrounding a center axis of the tubular connecting portion53. The inner peripheral surface155of each resilient piece154includes a dent54D. The dent54D is, for example, formed in the inner peripheral surface155of a contact portion54C of the resilient piece154. The dents54D of the plurality of resilient pieces154are provided at the same position in an axial direction of the tubular connecting portion53. The same position in the axial direction of the tubular connecting portion53means that all the dents54D have parts overlapping the same plane which is a cross-section passing through a predetermined position in the axial direction of the tubular connecting portion53and perpendicular to the axial direction of the tubular connecting portion53. That is, if the dents54D are provided at the same position in the axial direction of the tubular connecting portion53, a virtual plane (cross-section) perpendicular to the axial direction of the tubular connecting portion53and passing through all the dents54D is present. In a side view of the tubular connecting portion53, all the dents54D may be entirely aligned at the same position in the axial direction of the tubular connecting portion53. The dent54D extends from the side of a tip part54B toward the side of the contact portion54C in each resilient piece154. In an example ofFIG.14, the dent54D is provided at a position closer to the tip part54B than a base portion52in the inner peripheral surface155of each resilient piece154. For example, the inner peripheral surface155of each resilient piece154may have a tip part inner peripheral surface, which is a slope corresponding to the tip part54B, and a contact portion inner peripheral surface, which corresponds to the contact portion54C, and the dent54D may be adjacent to a boundary between the tip part inner peripheral surface and the contact portion inner peripheral surface on the contact portion inner peripheral surface of each resilient piece154or may extend across the boundary between the tip part inner peripheral surface and the contact portion inner peripheral surface. The bottom surface of the dent54D has a curved contour in the cross-section perpendicular to the axial direction of the tubular connecting portion53, e.g. an arcuate contour. In the example ofFIG.14, the dent54D is formed as a concave surface having a teardrop-shaped contour in a plan view of the inner peripheral surface155. The inner peripheral surface155in the contact portion54C of each resilient piece154may have a region except the dent54D (non-dent region). A curvature of the dent54D is larger than that of the non-dent region of the inner peripheral surface155in the cross-section perpendicular to the axial direction of the tubular connecting portion53. The curvature of the dent54D is preferably closer to that of the outer peripheral surface of the charger-side terminal82than that of the non-dent region of the inner peripheral surface155. The curvature of the dent54D more preferably matches that of the outer peripheral surface of the charger-side terminal82. The non-dent region of the inner peripheral surface155may have a curvature of 0, i.e. may be a flat surface. Next, functions of the other modification are described. The vehicle-side terminal150of the other modification exhibits effects similar to those of the vehicle-side terminal50of the above embodiment by having a configuration similar to that of the above embodiment. Further, in the vehicle-side terminal150, the dents54D are provided at the same position in the axial direction of the tubular connecting portion53in the inner peripheral surfaces155of the plurality of resilient pieces154. According to this configuration, the vehicle-side terminal150is electrically connected to the charger-side terminal82using the dents54D as contact points. Thus, even if the entire inner peripheral surfaces155are not formed into an arcuate shape matching the curvature of the outer peripheral surface of the charger-side terminal82, the electrical connectivity of the vehicle-side terminal150and the charger-side terminal82can be improved. Therefore, the vehicle-side terminal150is easily processed as compared to the case where the entire inner peripheral surfaces155are processed according to the curvature of the outer peripheral surface of the charger-side terminal82. Since the base end part54A serving as the fixed end of each resilient piece154is thinner than the contact portion54C as in the above embodiment in the vehicle-side terminal150of the modification, each resilient piece154is easily resiliently deformed. In this way, each resilient piece154can be suitably brought into contact with the outer surface of the charger-side terminal82. Further, a length of each resilient piece154necessary to provide predetermined deflection can be shortened. The predetermined deflection of each resilient piece154is radial deflection of the tubular connecting portion53having a magnitude necessary to insert the charger-side terminal82into the tubular connecting portion53. Since the resilient pieces154can be shortened, the vehicle-side terminal150is easily miniaturized. The thickness of the tip part54B becomes smaller from the side of the contact portion54C toward an opening end of the tubular connecting portion53as in the above embodiment in the vehicle-side terminal150of the modification. The tubular connecting portion53is so formed that the inner diameter becomes larger from the side of the contact portion54C toward the opening end of the tubular connecting portion53in the tip part54B. According to this configuration, the charger-side terminal82can be easily inserted into the tubular connecting portion53. Further, the inner diameter can become larger from the side of the contact portion54C toward the opening end of the tubular connecting portion53without making the outside dimensions of the tubular connecting portion53larger. In this way, the vehicle-side terminal150is easily miniaturized.The embodiment disclosed this time should be considered illustrative in all aspects, rather than restrictive. The scope of the present invention is represented not by the meaning described above, but by claims and is intended to include all changes in the scope of claims and in the meaning and scope of equivalents. LIST OF REFERENCE NUMERALS V vehicle10vehicle-side connector20connector housing30housing body31fitting portion31A receptacle31B back wall portion32flange portion32X mounting hole33tube portion34terminal accommodating portion35,35A terminal holding portion35X,35Y slit36peripheral wall37signal terminal holding portion38locking portion38A locking claw40retainer40X through hole40Y water drainage hole41base portion42peripheral wall43terminal pressing portion44locking frame portion44X engaging hole45signal line holding portion50,150vehicle-side terminal (connection terminal)51terminal connecting portion52base portion52X slit (first slit)53tubular connecting portion53X slit (third slit)54,154resilient piece54A base end part54B tip part54C contact portion54D dent of resilient piece55wire connecting portion55X through hole56intermediate portion56A bottom wall56B side wall56C facing wall56X slit (second slit)57reinforcing portion58through hole59coupling portion59X groove portion70wire71busbar71X through hole75bolt76nut80charger-side connector81connector housing82charger-side terminal90projection90X recess91projection92projection155inner peripheral surface of resilient piece | 66,692 |
11862891 | DETAILED DESCRIPTION TO EXECUTE THE INVENTION Description of Embodiments of Present Disclosure First, embodiments of the present disclosure are listed and described. (1) The connector of the present disclosure includes at least one inner conductor, and an inner housing, wherein the inner housing is formed by assembling a first housing and at least one second housing with each other, the first housing includes a placing portion and at least one first side wall, the inner conductor includes a terminal connecting portion, the terminal connecting portion is formed to extend forward, the inner conductor is so arranged on the placing portion that the terminal connecting portion projects forward, the first side wall extends from the placing portion toward the second housing, the second housing includes a protection wall and at least one second side wall, the protection wall is formed to be larger than the terminal connecting portion projecting from the placing portion, the second side wall is arranged from the protection wall to overlap the first side wall, the first and second side walls include a slide mechanism, the slide mechanism includes a fitting portion on either one of the first and second side walls to project toward the other side wall and a fitting hole in the other side wall, the fitting portion being fit into the fitting hole, and the fitting hole is formed to be longer in a front-rear direction than the fitting portion. The slide mechanism for moving the second housing with respect to the first housing is configured by fitting the fitting portion on either one of the first and second side walls into the fitting hole in the other side wall. That is, the slide mechanism is formed in a dimensional range equivalent to the sum of a thickness of the first side wall and a thickness of the second side wall. In this way, the slide mechanism can be reduced in size as compared to a conventional connector required to secure the sum of thicknesses of first and second side walls and a width of mutually locking parts. (2) Two inner conductors are arranged side by side in an overlapping direction of the first and second side walls on the placing portion, and a separation wall having a thickness larger than that of the slide mechanism is arranged between the adjacent inner conductors. Generally, if a ratio of a metal conductor increases around an inner conductor in which a signal flows, impedance is reduced. However, in this connector, an interval between the adjacent inner conductors can be set to be larger than a thickness of the slide mechanism. That is, an impedance reduction in each inner conductor can be suppressed by increasing the interval between the inner conductors. Details of Embodiment of Present Disclosure A specific example of a connector of the present disclosure is described below with reference to the drawings. Note that the present disclosure is not limited to these illustrations and is intended to be represented by claims and include all changes in the scope of claims and in the meaning and scope of equivalents. First Embodiment A first embodiment in the present disclosure is described with reference toFIGS.1to10. A connector10of the first embodiment is a connector for high-speed communication installed in a vehicle. As shown inFIGS.1and2, the connector10includes a plurality of inner conductors20, an inner housing30, an outer conductor60and an outer housing70. [Inner Conductors20] Each of the plurality of inner conductors20is formed by processing a conductive metal plate material. In the first embodiment, four inner conductors20are provided. As shown inFIG.1, the inner conductor20is a male terminal and includes a terminal body21, a terminal connecting portion22and a wire connecting portion24. The terminal body21is in the form of a rectangular tube long in a front-rear direction. The terminal connecting portion22is formed in front of and continuous with the terminal body21in a front end part of the inner conductor20. The terminal connecting portion22is in the form of an elongated rectangular column extending forward from the terminal body21. The wire connecting portion24is formed behind and continuous with the terminal body21. The wire connecting portion24is crimped to a front end part of a shielded cable80. [Shielded Cable80] As shown inFIG.1, the shielded cable80includes a plurality of wires (four in the first embodiment)81, a braided wire82for covering the outer peripheries of the plurality of wires81and an outer sheath84for covering the outer periphery of the braided wire82. In the front end part of the shielded cable80, the braided wire82and the outer sheath84are stripped to expose the four wires81. Out of the exposed four wires81, two arranged on a lower side are the wires81for power supply. Two arranged on an upper side are the wires81for signal having a larger wire diameter than the two on the lower side. In the front end parts of the exposed four wires81, the wire connecting portions24of the inner conductors20are respectively crimped to cores exposed by stripping coatings. In this way, the respective wires81and the inner conductors20are electrically connected. Behind the exposed parts of the four wires81, the braided wire82exposed by stripping only the outer sheath84is folded on the outer periphery of the outer sheath84. [Inner Housing30] The inner housing30is made of insulating synthetic resin. As shown inFIGS.1,3and4, the inner housing30is formed by assembling a first housing31and two second housings42with each other in a vertical direction. As shown inFIGS.1and3, the first housing31includes a placing portion32, a separation wall33and a pair of first side walls34. The placing portion32is in the form of a rectangular plate having a longer dimension in the front-rear direction than a width in a lateral direction. The separation wall33is formed in a laterally central part of the placing portion32while penetrating through the placing portion32in the vertical direction. The separation wall33is in the form of a rectangular plate longer in the front-rear direction than the terminal bodies21of the inner conductors20. The separation wall33is formed to extend in the vertical direction from the placing portion32more than heights of the terminal bodies21. Positioning protrusions35projecting in a direction away from the placing portion32are formed on tip parts of the separation wall33. The pair of first side walls34are respectively formed at positions somewhat inward of both lateral side edge parts of the placing portion32. Each first side wall34is in the form of a rectangular plate longer in the front-rear direction than the terminal bodies21of the inner conductors20while penetrating through the placing portion32in the vertical direction. The first side wall34is larger in the vertical direction than the heights of the terminal bodies21to extend toward the second housings42. Fitting portions36are formed on tip parts of each first side wall34. The respective fitting portions36are formed to extend in the front-rear direction along the tip parts of the first side walls34and project in the lateral direction to be away from each other. A region surrounded by the placing portion32, the separation wall33and the first side wall34serves as a terminal accommodating portion37for accommodating the terminal body21and the wire connecting portion24of the inner conductor20together with a protection wall43of the second housing42. That is, the inner housing30is formed with two terminal accommodating portions37arranged in the lateral direction in each of two upper and lower stages. When the inner conductor20is accommodated into the terminal accommodating portion37, the terminal connecting portion22projects forward from the terminal accommodating portion37as shown inFIG.3. Thus, four inner conductors20are so arranged on the placing portion32that the terminal connecting portions22project forward and two inner conductors20are arranged in each of the vertical direction and lateral direction. As shown inFIGS.3to9, the two second housings42are assembled with the first housing31in the vertical direction. Each second housing42includes the protection wall43, a pair of second side walls46and a front wall48. The protection wall43is in the form of a rectangular plate longer in the front-rear direction and lateral direction than the placing portion32of the first housing31. In this way, if the second housing42is assembled with the first housing31, the protection wall43surrounds the outer peripheries of a pair of inner conductors20together with the placing portion32, the separation wall33and the first side walls34as shown inFIG.10. As shown inFIGS.3to5, a positioning hole44into which the positioning protrusion35of the first housing31is fit is formed to penetrate through the protection wall43in the vertical direction in a laterally central part of the protection wall43. The positioning hole44is formed to extend in the front-rear direction more than the positioning protrusion35. Front and rear end parts of the positioning hole44serve as protrusion holding holes44A formed to be slightly larger than a lateral width of the positioning protrusion35, and a region of the positioning hole44between the protrusion holding holes44A serves as a narrow hole44B somewhat narrower than the width of the positioning protrusion35. Deformation holes45are formed to penetrate through the protection wall43in the vertical direction on both lateral sides of the positioning hole44. The deformation holes45are formed to be somewhat shorter in the front-rear direction than the positioning hole44. As shown inFIGS.3and10, the pair of second side walls46are formed to extend toward the first housing31to overlap outside the first side walls34on both lateral side edge parts of the protection walls43. The second side walls46are in the form of rectangular plates longer in the front-rear direction than the terminal bodies21of the inner conductors20. As shown inFIGS.3,4and6, the second side wall46includes fitting holes47into which the fitting portions36of the first side wall34are fit when the second housing42is assembled with the first housing31. The fitting holes47penetrate through the second side walls46in the lateral direction and are formed to be rectangular in a side view. The fitting holes47are formed to be longer in the front-rear direction than the fitting portions36. Further, the second side walls46are arranged along the placing portion32of the first housing31as shown inFIGS.6and9when the second housing42is assembled with the first housing31. The front wall48is formed to be connected to a front end part of the protection wall43and those of the pair of second side walls46. The front wall48stops the inner conductors20in front together with a front end part of the first housing31when the second housing42is assembled with the first housing31. Further, each second housing42is independently slidable in the front-rear direction between the protection position and the exposed position with respect to the first housing31by moving the fitting portions36in the front-rear direction in the fitting holes47. When each second housing42moves in the front-rear direction, the pair of second side walls46smoothly move along the placing portion32. As shown inFIGS.4to6, at the protection position, the fitting portions36are arranged in rear end parts of the fitting holes47and the protection wall43covers the terminal connecting portions22projecting forward from the terminal accommodating portions37from above or below. As shown inFIGS.7to9, at the exposed position, the fitting portions36are arranged in front end parts of the fitting holes47and the protection wall43exposes the terminal connecting portions22projecting forward from the terminal accommodating portions37. Accordingly, in the first embodiment, the first side walls34of the first housing31and the second side walls46of the second housings42constitute a slide mechanism50by fitting the fitting portions36of the pair of first side walls34into the fitting holes47of the pairs of second side walls46as shown inFIGS.4,6,7,9and10. The fitting portions36on the first side walls34move in the fitting holes47in the second side walls46, whereby the second housings42move in the front-rear direction between the protection position and the exposed position with respect to the first housing31. That is, the slide mechanism50of the first embodiment is formed in a dimensional range obtained by adding a tiny clearance dimension between the first side wall34and the second side walls46to the sum of a thickness L1of the first side wall34and a thickness L2of the second side walls46. Further, as shown inFIGS.4and5, the second housing42is held at the protection position by holding the positioning protrusion35in a semi-locked state in the rear protrusion holding hole44A of the positioning hole44. On the other hand, as shown inFIGS.7and8, the second housing42is held at the exposed position by holding the positioning protrusion35in a semi-locked state in the front protrusion holding hole44A of the positioning hole44. In the case of moving the second housing42between the protection position and the exposed position, a movement of the positioning protrusion35in the front-rear direction is allowed by the positioning protrusion35entering the narrow hole44B to resiliently deform the inner wall of the narrow hole44B toward the deformation holes45. [Outer Conductor60] The outer conductor60is formed into a rectangular tube shape by processing a conductive metal plate material. As shown inFIGS.1and2, the outer conductor60is formed by assembling an upper shell61and a lower shell66with each other in the vertical direction. The upper shell61includes a ceiling plate62, a pair of upper side plates63and a connection piece65. The ceiling plate62is in the form of a rectangular plate extending in the front-rear direction. The pair of upper side plates63are formed to extend downward from both lateral side edges of the ceiling plate62. Each upper side plate63is in the form of a rectangular plate connected to the side edge of the ceiling plate62over an entire length. A linking plate64linking the upper side plates63in the lateral direction is formed on the lower edges of the front ends of the upper side plates63. The connection piece65is formed to be connected to the rear end edge of the ceiling plate62. The connection piece65is arranged on the outer surface of the braided wire82of the shielded cable80. The lower shell66includes a bottom plate67, a pair of lower side plates68and a crimping portion69. The bottom plate67is in the form of a rectangular plate extending in the front-rear direction. The pair of lower side plates68are formed to extend upward from both lateral side edges of the bottom plate67. Each lower side plate68is formed to be connected to the side edge of the bottom plate67over an entire length. The crimping portion69is formed into a hollow cylindrical shape on the rear end edges of the bottom plate67and the pair of lower side plates68. The crimping portion69is crimped to the connection piece65of the upper shell61and the outer periphery of the braided wire82. In this way, the outer conductor60is electrically connected to the braided wire82of the shielded cable80. Further, when the upper shell61and the lower shell66are assembled with each other, a tube portion60A in the form of a rectangular tube is formed. As shown inFIGS.2and10, the inner housing30is accommodated into the tube portion60A. When the inner housing30is accommodated into the tube portion60A, the ceiling plate62of the upper shell61and the bottom plate67of the lower shell66are arranged along the upper and lower surfaces of the inner housing30and the upper side plates63of the upper shell61and the lower side plates68of the lower shell66are arranged along both lateral outer side surfaces of the inner housing30as shown inFIG.10. [Outer Housing70] The outer housing70is made of insulating synthetic resin. As shown inFIG.2, the outer conductor60connected to the front end part of the shielded cable80can be accommodated into the outer housing70. An unillustrated mating connector can enter a front end part of the outer housing70. If the mating connector enters the outer housing70, the mating connector presses the two second housings42, whereby the second housings42move from the protection position to the exposed position. In this way, the terminal connecting portions22are exposed from the second housings42and electrically connected to unillustrated mating terminals provided in the mating connector. The first embodiment is configured as described above. Next, functions and effects of the connector10are described. For example, a conventional connector201is shown inFIG.12. The conventional connector201is configured by assembling a conventional first housing202and a conventional second housing205by locking first lock ribs204formed on a pair of first side walls203of the conventional first housing202and second lock ribs207formed on a pair of second side walls206of the conventional second housing205in the vertical direction. In this conventional connector201, the conventional second housing205slides with respect to the conventional first housing202by the conventional second lock ribs207sliding in the front-rear direction with respect to the conventional first lock ribs204with the conventional first lock ribs204and the conventional second lock ribs207held in contact with each other. However, a conventional slide mechanism208for sliding the conventional second housing205with respect to the conventional first housing202needs to secure a locking margin L13for locking the conventional first lock rib204and the conventional second lock rib207in the vertical direction between the conventional first side wall203and the conventional second side wall206in addition to a thickness L11of the conventional first side wall203and a thickness L2of the conventional second side wall206. Thus, the slide mechanism208in the conventional connector201is enlarged in the lateral direction. However, if the conventional second housing205is disabled to move with respect to the conventional first housing202because the conventional slide mechanism208is enlarged in the lateral direction, terminal connecting portions of conventional inner conductors209cannot be protected by the conventional second housing205. Accordingly, the present inventor and other researchers found out the configuration of the first embodiment as a result of diligent study to solve the above problem. That is, the first embodiment relates to the connector10provided with at least one inner conductor20and the inner housing30, and the inner housing30is formed by assembling the first housing31and at least one second housing42with each other. The first housing31includes the placing portion32and at least one first side wall34, the inner conductor20includes the terminal connecting portion22, the terminal connecting portion22is formed to extend forward, the inner conductor20is so arranged on the placing portion32that the terminal connecting portion22projects forward, and the first side wall34extends from the placing portion32toward the second housing42. The second housing42includes the protection wall43and at least one second side wall46. The protection wall43is formed to be larger than the terminal connecting portion22projecting forward from the placing portion32, and the second side wall46is arranged from the protection wall43to overlap the first side wall34. The first and second side walls34,46include the slide mechanism50. The slide mechanism50includes the fitting portion36on the first side wall34(either one of the first side wall34and the second side wall46) to project toward the second side wall (other side wall)46and the fitting hole47in the second side wall46, the fitting portion36being fit into the fitting hole47, and the fitting hole47is formed to be longer in the front-rear direction than the fitting portion36. The second housing42is movable between the protection position where the terminal connecting portion22is covered by the protection wall43and the exposed position where the terminal connecting portion22is exposed from the protection wall43by the fitting portion36moving in the front-rear direction in the fitting hole47. That is, in the connector10of the first embodiment, the slide mechanism50is configured by fitting the fitting portion36on the first side wall34into the fitting hole47in the second side wall46. The second housing42can be moved between the protection position and the exposed position with respect to the first housing31by moving the fitting portion36in the front-rear direction in the fitting hole47. That is, the mechanism50of the first embodiment is configured in the dimensional range obtained by adding the tiny clearance dimension between the first and second side walls34,46to the sum of the thickness L2of the first side wall34and the thickness L2of the second side walls46. In this way, the mechanism50can be reduced in size as compared to the conventional mechanism208of the conventional connector201shown inFIG.12(which further ensures the dimension L13of the locking margin of the conventional first lock rib204and the conventional second lock rib207between the conventional first side wall203and the conventional second side wall206in addition to the sum of the thickness L11of the conventional first side wall203and the thickness L12of the conventional second side wall206). Further, the connector10can be reduced in size by reducing the size of the mechanism50. The first embodiment further includes the outer conductor60for accommodating the inner housing30, and the outer housing60includes the upper side plate63and the lower side plate68disposed outside and along the first and second side walls34,46. Generally, if a ratio of a metal conductor increases around an inner conductor in which a signal flows, impedance is reduced. Here, a ratio of a metal conductor around the terminal connecting portion22of the inner conductor20of the first embodiment increases by being connected to the mating terminal. Therefore, there is a concern for an impedance reduction. However, in the first embodiment, the outer conductor60is reduced in size according to the size reduction of the mechanism50. That is, since the ratio of the metal conductor around the terminal connecting portion22is reduced, an impedance reduction at the position of the terminal connecting portion22can be suppressed as compared to the conventional connector201. Second Embodiment Next, a second embodiment is described with reference toFIG.11. An inner housing130of the second embodiment is obtained by changing the lateral thickness of the separation wall33in the first embodiment and components, functions and effects common to the first embodiment are not described to avoid repetition. Further, the same reference signs are used for the same components as in the first embodiment. A separation wall133of the second embodiment has a lateral thickness, which is equal to or more than twice that in the first embodiment as shown inFIG.11. Further, the lateral thickness of the separation wall133is larger than that of a slide mechanism50formed over a first side wall34and a second side wall46. Further, a lateral width of the inner housing130in the second embodiment is equal to that of the conventional connector201shown inFIG.12. That is, in the second embodiment, a lateral length of a connector110is equal to that of the conventional connector201, but an interval between inner conductors20arranged in the lateral direction is larger. As described in the first embodiment, if a ratio of a metal conductor increases around an inner conductor in which a signal flows, impedance is reduced. However, in the second embodiment, the lateral size of the connector is equal to that of the conventional connector1, but the interval between the inner conductors20adjacent in the lateral direction is larger. That is, even if terminal connecting portions22are connected to mating terminals to increase the ratio of the metal conductor around the terminal connecting portions22, an impedance reduction can be suppressed as compared to the conventional connector1since the inner conductors20adjacent in the lateral direction are more spaced apart. Other Embodiments (1) In the first and second embodiments, four inner conductors20are provided. However, without limitation to this, a connector may include three or less or five or more inner conductors. (2) In the first and second embodiments, the outer conductor60and the outer housing70are provided. However, without limitation to this, a connector may not include any outer conductor or any outer housing. (3) In the first and second embodiments, the fitting portion36is formed on the first side wall34and the fitting hole47is formed in the second side wall46. However, without limitation to this, a fitting hole may be formed in a first side wall and a fitting portion may be formed on a second side wall. (4) In the first and second embodiments, the outer conductor60is formed by assembling the upper shell61and the lower shell66with each other. However, without limitation to this, an outer conductor may be constituted by one member. (5) In the first and second embodiments, the two second housings42are respectively independently slid with respect to the first housing31. However, without limitation to this, the two second housings may be coupled and configured as one second housing. LIST OF REFERENCE NUMERALS 10,110: connector20: inner conductor21: terminal body22: terminal connecting portion24: wire connecting portion30,130: inner housing31: first housing32: placing portion33,133: separation wall34: first side wall35: positioning protrusion36: fitting portion37: terminal accommodating portion42: second housing43: protection wall44: positioning hole44A: protrusion holding hole44B: narrow hole45: deformation hole46: second side wall47: fitting hole48: front wall50: slide mechanism60: outer conductor60A: tube portion61: upper shell62: ceiling plate63: upper side plate64: linking plate65: connection piece66: lower shell67: bottom plate68: lower side plate69: crimping portion70: outer housing80: shielded cable81: wire82: braided wire84: outer sheath201: connector202: first housing203: first side wall204: first lock rib205: second housing206: second side wall207: second lock rib208: slide mechanism209: inner conductorL1, L11: thickness of first side wallL2, L12: thickness of second side wallL13: dimension of locking margin | 26,708 |
11862892 | The following discussion provides various examples of semiconductor devices and methods of manufacturing semiconductor devices. Such examples are non-limiting, and the scope of the appended claims should not be limited to the particular examples disclosed. In the following discussion, the terms “example” and “e.g.” are non-limiting. The figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the present disclosure. In addition, elements in the drawing figures are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the examples discussed in the present disclosure. The same reference numerals in different figures denote the same elements. The term “or” means any one or more of the items in the list joined by “or”. As an example, “x or y” means any element of the three-element set {(x), (y), (x, y)}. As another example, “x, y, or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. The terms “comprises,” “comprising,” “includes,” or “including,” are “open ended” terms and specify the presence of stated features, but do not preclude the presence or addition of one or more other features. The terms “first,” “second,” etc. may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, for example, a first element discussed in this disclosure could be termed a second element without departing from the teachings of the present disclosure. Unless specified otherwise, the term “coupled” may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements. For example, if element A is coupled to element B, then element A can be directly contacting element B or indirectly connected to element B by an intervening element C. Similarly, the terms “over” or “on” may be used to describe two elements directly contacting each other or describe two elements indirectly connected by one or more other elements. DESCRIPTION In an example, a semiconductor device includes a substrate having substrate terminals, a first semiconductor component having a first component terminal and a second component terminal adjacent to a first major side of the first semiconductor component, and a clip structure including a first clip coupled to the first component terminal and a first substrate terminal, and a second clip coupled to a second substrate terminal. In some examples, an encapsulant covers the first semiconductor component, at least portions of the substrate, and at least portions of the clip structure. In some examples, a top side of the first clip and a top side of the second clip are exposed from a top side of the encapsulant. In an example, a semiconductor device includes a substrate having a first substrate terminal, a second substrate terminal, and a third substrate terminal. A semiconductor component includes a first major side, a second major side opposite to the first major side, a first component terminal and a second component terminal adjacent to the first major side, and the second major side can be coupled with the third substrate terminal. A clip structure includes a first clip having a first component-attached region with an upper surface, the first component-attached region coupled to the first component terminal, and a first substrate-attached region coupled to the first component-attached region and the first substrate terminal. The clip structure includes a second clip having a second component-attached region with an upper surface, and a second substrate-attached region coupled to the second component-attached region and the second substrate terminal. A first clip leg can be coupled to the first clip between the first clip and the second clip and the first clip leg can include a first leg end. A second clip leg can be coupled to the second clip between the first clip and the second clip, and the second clip leg can include a second leg end. an encapsulant can cover portions of the substrate, the first semiconductor component, and portions of the clip structure. In some examples, the first clip leg and the second clip leg are separated by a gap. In some examples, the first leg end and the second leg end are exposed from a major side of the encapsulant. In an example, a method of manufacturing a semiconductor device includes providing a substrate having substrate terminals and providing a first semiconductor component having a first component terminal and a second component terminal adjacent to a first major side of the first semiconductor component. The method includes providing a clip structure having a first clip, a second clip, and a clip connector coupling the first clip to the second clip. The method includes coupling the first clip to the first component terminal and a first substrate terminal and coupling the second clip to a second substrate terminal. The method includes encapsulating the first semiconductor component, portions of the substrate, and portions of the clip structure. The method includes removing a sacrificial portion of the clip connector while leaving a first portion of the clip connector attached to the first clip and leaving a second portion of the clip connector attached to the second clip. The first portion of the clip connector includes a first portion surface, the second portion of the clip connector includes a second portion surface, and the first portion surface and the second portion surface are exposed from a top side of the encapsulant after the removing. Other examples are included in the present disclosure. Such examples may be found in the figures, in the claims, or in the description of the present disclosure. FIGS.1A and1Bshow cross-sectional views of an example semiconductor device10, andFIG.1Cshows a plan x-ray view of example semiconductor device10.FIG.1Ais a view taken from the perspective of line X-X ofFIG.1C, andFIG.1Bis a view taken from the perspective of line Y-Y ofFIG.1C. In the example shown inFIGS.1A to1C, semiconductor device10can comprise substrate11, semiconductor component12, encapsulant13, interface materials14A,14B,14C,14D and14E, and clip structure15. Substrate11can comprise substrate terminals111,112and113. Clip structure15can comprise clips151and152, clip joint155(illustrated inFIG.2E), clip legs1551and1552. In some examples, clip joint155and clip legs1551and1552can be referred to as a clip connector, a conductive bridge, a conductive connector, a conductive bar, or a conductive interface. Substrate11, encapsulant13and clip structure15can be referred to as a semiconductor package and package can provide protection for semiconductor component12from external elements or environmental exposure. Semiconductor package can provide coupling between external electrical components and substrate terminals111,112and113. FIGS.2A,2B,2C,2D,2E,2F, and2Gshow cross-sectional views and plan views of an example method for manufacturing semiconductor device10. In the following, reference is made toFIGS.1A,1B, and1Ctogether.FIG.2Ashows a cross-sectional view and plan view of semiconductor device10at an early stage of manufacture. In the example shown inFIG.2A, substrate11can be provided. In some examples, substrate11can comprise or be referred to as a lead frame substrate, a laminate substrate, or a printed circuit board. In some examples, substrate11can comprise copper (Cu), Cu alloy, iron (Fe), Fe alloy or Fe—Ni alloy. In some examples, substrate11can comprise a coating or plating layer provided on a side of substrate11, such as nickel (Ni), palladium (Pd), gold (Au), silver (Ag), or solder (Sn). Substrate11can comprise substrate terminals111,112and113. In some examples, substrate terminals111,112and113can comprise substantially rectangular plates. In some examples, substrate terminal113can have a larger area than substrate terminals111or112. In some examples, substrate terminals111or112can comprise or be referred to as leads. In some examples, substrate terminal113can comprise or be referred to as a lead, a paddle, a pad or a flag. In some examples, substrate terminals111,112and113can be provided through etching or stamping. In some examples, substrate11can have an area ranging from approximately 3 mm (millimeter)×3 mm to approximately 15 mm×15 mm. In some examples, substrate11can have a thickness ranging from approximately 100 μm (micrometer) to approximately 200 μm. In some examples, substrate terminals111or112can have an area ranging from approximately 1 mm×1 mm to approximately 10 mm×10 mm, or can have a thickness ranging from approximately 100 μm to approximately 200 μm. In some examples, an area of substrate terminal113can be dependent on a size of semiconductor component12, or can be in a range from approximately 1.5 mm×1.5 mm to approximately 15 mm×15 mm. In some examples, substrate terminal113can have a thickness ranging from approximately 100 μm to approximately 200 μm. Substrate11can serve as wiring for coupling semiconductor component12with an external component (for example, a motherboard or circuit board). FIG.2Bshows a cross-sectional view and plan view of semiconductor device10at a later stage of manufacture. In the example shown inFIG.2B, interface material14A can be provided on substrate terminal113. In some examples, an area of interface material14A can be equal to or smaller than substrate terminal113. In some examples, interface material14A can comprise or be referred to as a solder, a conductive adhesive or a conductive paste. In some examples, interface material14A can comprise tin (Sn), silver (Ag), lead (Pb), copper (Cu), Sn—Pb, Sn37-Pb, Sn95-Pb, Sn—Pb—Ag, Sn—Cu, Sn—Ag, Sn—Au, Sn—Bi, or Sn—Ag—Cu. In some examples, interface material14A can be provided on substrate terminal113by coating or dispensing in the form of a paste. In some examples, interface material14A can have a thickness ranging from approximately 5 μm to approximately 100 μm. Interface material14A can couple semiconductor component12and substrate terminal113. FIG.2Cshows a cross-sectional view and plan view of semiconductor device10at a later stage of manufacture. In the example shown inFIG.2C, semiconductor component12can be provided on substrate terminal113. In some examples, semiconductor component12can be arranged on interface material14A. Semiconductor component12can comprise or be referred to as a die, a chip, or a power component such as a field-effect transistor (FET) or an insulated-gate bipolar transistor (IGBT). In some examples, semiconductor component12can comprise component terminals121and122provided at a top side of semiconductor component12, and component terminal123provided at a bottom side of semiconductor component12. In some examples, component terminal121can comprise or be referred to as a source terminal (or a drain terminal). In some examples, component terminal122can comprise or be referred to as a gate terminal (or a control terminal). In some examples, component terminal123can comprise or be referred to as a drain terminal (or a source terminal). In some examples, electrical current can flow or can be prevented from flowing from the source terminal to the drain terminal (or vice versa) by a control signal supplied to the gate terminal. In some examples, semiconductor component12can have an area ranging from approximately 1 mm×1 mm to approximately 10 mm×10 mm. In some examples, semiconductor component12can have a thickness ranging from approximately 50 μm to approximately 775 μm. In some examples, component terminal123of semiconductor component12can contact interface material14A. In some examples, interface material14A can be supplied with heat and then cooled, and thus substrate terminal113can be coupled to component terminal123of semiconductor component12through interface material14A. In some examples, substrate11can be placed into a reflow furnace or a laser assist bonding apparatus, thereby applying approximately 150° C. to approximately 400° C. to interface material14A. Thereafter, cooling is performed, thereby coupling semiconductor component12to substrate terminal113through interface material14A. FIG.2Dshows a cross-sectional view and plan view of semiconductor device10at a later stage of manufacture. In the example shown inFIG.2D, interface materials14B and14C can be provided on semiconductor component12. In some examples, interface materials14B and14C can be arranged on component terminals121and122of semiconductor component12, respectively. In some examples, interface materials14D and14E can be provided on substrate terminals111and112, respectively. In some examples, interface materials14B,14C,14D and14E can comprise or be referred to as a solder, a conductive adhesive or a conductive paste, or can be similar to interface material14A. In some examples, interface materials14B,14C,14D and14E can be provided on component terminals121and122and substrate terminals111and112by coating or by dispensing in the form of a paste. In some examples, interface materials14B,14C,14D and14E can have a thickness ranging from approximately 5 μm to approximately 100 μm. In some examples, interface materials14B and14C on component terminals121and122of semiconductor component12, and interface materials14E and14D on substrate terminals111and112, can couple clip structure15with substrate terminals111and112and with component terminals121and122. FIG.2Eshows a cross-sectional view and plan view of semiconductor device10at a later stage of manufacture. In the example shown inFIG.2E, clip structure15can be provided on component terminals121and122of semiconductor component12, and on substrate terminals111and112of substrate11. In some examples, clip structure15can comprise or be referred to as a conductive bridge, a conductive connector, a conductive bar, or a conductive interface. In some examples, clip structure15can comprise copper (Cu), Cu alloy, iron (Fe), Fe alloy, or Fe—Ni alloy. In some examples, clip structure15can comprise a coating layer or plating provided on a side of clip structure15, such as nickel (Ni), palladium (Pd), gold (Au), silver (Ag), or solder (Sn). In some examples, clip structure15can be formed using a material similar to that of substrate11, or can be formed in a similar manner as the substrate11. In some examples, clip structure15can be provided through etching or stamping. In some examples, clip structure15can comprise a substantially H shape in a plan view. In some examples, clip structure15can comprise clips151and152and clip joint155. In some examples, clip joint155can comprise clip legs1551and1552coupled to clips151and152, respectively. In some examples, clips151and152can be coupled to each other by clip joint155, clip leg1551, and clip leg1552. In some examples, clip joint155can have a greater height than clip151, clip152, clip leg1551, or clip leg1552. In some examples, opposite ends of clip joint155can be coupled to clips151and152through clip legs1551and1552, respectively. In some examples, clip legs1551and1552can be provided between clip joint155and clips151and152in an inclined shape that raises clip joint155relative to clips151and152. In some examples, because higher electrical current (e.g., source-drain current) can flow through clip151, and lower electrical current (e.g., a gate control signal) can flow through clip152, clip151can have a relatively larger width or area than clip152. In some examples, clip joint155can also be referred to as a sacrificial portion that is intended, for example, to be removed in a final semiconductor package. In other examples, clip151and clip152can have the same or equal widths or areas, for example if both clips are configured to have similar current load capabilities, or to meet other package design requirements. In some examples, one end of clip151can be coupled to semiconductor component12, and the other end of clip151can be coupled to substrate terminal111. In some examples, one end of clip151can be coupled to interface material14B provided on component terminal121of semiconductor component12, and the other end of clip151can be coupled to interface material14D provided on substrate terminal111. In some examples, clip151can be provided to have an inclined or stepped shape extending from semiconductor component12to substrate terminal111. In some examples, the one end of clip151coupled to semiconductor component12can be referred to as a component-attached region and the other end of claim151coupled to substrate terminal111can be referred to as a substrate-attached region. In some examples, one end of clip152can be coupled to semiconductor component12, and the other end of clip152can be coupled to substrate terminal112. In some examples, one end of clip152can be coupled to interface material14C provided on component terminal122of semiconductor component12, and the other end of clip152can be coupled to interface material14E provided on substrate terminal112. In some examples, clip152can be provided to have an inclined or stepped shape extending from semiconductor component12to substrate terminal112. In some examples, the one end of clip152coupled to semiconductor component12can be referred to as a component-attached region and the other end of claim152coupled to substrate terminal112can be referred to as a substrate-attached region. Specific shapes of clip structure15can be dependent on shapes or positions of substrate terminals111,112and113. In some examples, clip structure15can have a width ranging from approximately 200 μm to approximately 9500 μm, or a thickness ranging from approximately 100 μm to approximately 500 μm. In some examples, clip151or152can have a width ranging from approximately 200 μm to approximately 9500 μm, or a thickness ranging from approximately 100 μm to approximately 500 μm. In some examples, a top side of clip joint155can be approximately 300 μm to approximately 1300 μm higher than other regions excluding clip legs1551and1552. Clip joint155can have a thickness ranging from approximately 100 μm to approximately 500 μm. In some examples, clip legs1551and1552can have a width ranging from approximately 200 μm to approximately 1000 μm, and clip legs1551and1552can have a thickness ranging from approximately 100 μm to approximately 500 μm. In some examples, interface materials14B,14C,14D and14E can be supplied with heat and then cooled, and thus clip structure15can be coupled to substrate terminals111and112and component terminals121and122of semiconductor component12through interface materials14B,14C,14D and14E. In some examples, substrate11comprising clip structure15and interface materials14B,14C,14D and14E can be placed into a reflow furnace or a laser assist bonding apparatus, thereby applying a temperature of approximately 150° C. to approximately 400° C. to clip structure15and interface materials14B,14C,14D and14E. Thereafter, interface materials14B,14C,14D and14E can be cooled, and thus clip structure15and semiconductor component12can be coupled to each other through interface materials14B,14C,14D and14E. In some examples, a melting point of interface material14A between semiconductor component12and substrate terminal113can be higher than interface materials14B,14C,14D and14E between semiconductor component12and clip structure15or clip structure15and substrate terminals111and112. When clip structure15is coupled to semiconductor component12and substrate terminals111and112through interface materials14B,14C,14D and14E, interface materials14B,14C,14D and14E, except for interface material14A, can be melted. Accordingly, while clip structure15is coupled to semiconductor component12and substrate terminals111and112, semiconductor component12can be prevented from rotating or shifting on substrate terminal113. Adjusting of such melting point can be achieved by adjusting the content of solders in interface materials or varying kinds or composition ratios of alloys. FIG.2Fshows a cross-sectional view and x-ray plan view of semiconductor device10at a later stage of manufacture. In the example shown inFIG.2F, encapsulant13can be provided on substrate11, semiconductor component12and clip structure15. Encapsulant13can contact substrate11, semiconductor component12and clip structure15, or can encapsulate substrate11, semiconductor component12and clip structure15. As seen inFIG.2F, encapsulant13can be applied to fully cover clip structure15. There can be examples where a portion of clip structure15, such as clip joint155, can remain exposed from encapsulant13. In some examples, a region of substrate11can be exposed through encapsulant13. In some examples, bottom sides of substrate terminals111,112and113can be exposed at a bottom side of encapsulant13. In some examples, the bottom side of encapsulant13can be coplanar with the bottom sides of substrate terminals111,112and113. Encapsulant13can comprise or be referred to as a mold compound, a resin, a sealant, a filler-reinforced polymer, or a package body. In some examples, encapsulant13can comprise an epoxy or phenol resin, carbon black and a silica filler. In some examples, encapsulant13can be provided by compression molding, transfer molding, liquid encapsulant molding, vacuum lamination, paste printing or film assist molding. The compression molding can be performed by supplying a flowable resin to a mold in advance, placing a substrate into the mold and then curing the flowable resin, and the transfer molding can be performed by supplying a flowable resin to a gate (supply port) of a mold and to surroundings of a pertinent substrate and then curing the flowable resin. Encapsulant13can have a width ranging from approximately 3 mm×3 mm to approximately 15 mm×15 mm, and a thickness ranging from approximately 0.7 mm to approximately 2.1 mm. Encapsulant13can provide protection for a semiconductor component from external elements or environmental exposure and can rapidly emit heat generated from the semiconductor component outward. FIG.2Gshows a cross-sectional view and x-ray plan view of semiconductor device10at a later stage of manufacture. In the example shown inFIG.2G, encapsulant13can be thinned, for example, by grinding with a grinder. In some examples, a top side of encapsulant13can be thinned until clip joint155is removed to disconnect clip151and clip152from each other. In some examples, clip joint155can be grinded or removed while encapsulant13is thinned. In some examples, clip joint155can be cut with a mechanical or laser saw. With clip joint155removed, clips151and152are physically and electrically disconnected from each other. In some examples, source-drain current can then independently flow through clip151, and a gate control signal can be independently transmitted through clip152. As illustrated inFIG.2G, after clip joint155is removed, a gap155A or space155A is interposed between clip leg1552and clip leg1551. In some examples, after the grinding, top sides of clip legs1551and1552can remain exposed at the top side of encapsulant13. In some examples, the grinding can continue until clip legs1551and1552are also removed. In some examples, after the grinding, top sides of clips151and152can be exposed at the top side of encapsulant13. In some examples, the grinding or removal of clip joint155can comprise a stage, features or elements similar to those described with respect toFIG.7A-7C. In some examples, the stages above can be followed by performing general plating, marking, singulating and shipping. In some examples, the plating can comprise supplying an oxidation resistant film to clip legs1551and1552, clips151and152, or substrate terminals111,112and113, exposed from the top side or the bottom side of encapsulant13. In some examples, the oxidation resistant film can comprise gold (Au), silver (Ag), nickel (Ni), palladium (Pd), solder (Sn), or organic solderability preservative (OSP). In some examples, active elements, such as a semiconductor die, an electronic component, or passive elements such as an inductor or a capacitor, can be mounted on clip legs1551and1552or clips151and152exposed from encapsulant13. The marking can comprise marking a product name or a manufacturer's name on a side of encapsulant13. The singulating can comprise separating semiconductor devices fabricated in a matrix or stripe configuration having multiple rows or columns into individual semiconductor devices by sawing/cutting. The shipping can comprise placing the individual semiconductor devices into an antistatic tray. According to the present disclosure, even if semiconductor device10or clip structure15is small or narrow, clip structure15on semiconductor component12can be prevented from falling over or shifting during the manufacture of semiconductor device10because of the stability provided by clip joint155tying or coupling clips151and152together. In some examples, during the manufacture of semiconductor device10, clip structure15having a substantially H-shaped configuration can be provided, and clip structure15can be divided into individual clips by grinding or grooving after the encapsulating, thereby providing clip structure15at accurate positions between semiconductor component12and substrate terminals111and112. In some examples, active elements or passive elements can be mounted on clips151and152exposed through encapsulant13, and thus application ranges of semiconductor device10can be extended. FIGS.3A and3Bshow cross-sectional views of an example semiconductor device20andFIG.3Cshows an x-ray plan view of an example semiconductor device20.FIG.3Ais a cross-sectional view taken along line Y-Y ofFIG.3C, andFIG.3Bis a cross-sectional view taken along line X-X ofFIG.3C. In the example shown inFIGS.3A to3C, semiconductor device20can comprise substrate21, semiconductor component12and22, encapsulant13, interface materials14A,14B,14C and14D, clip structure15and interconnect29. Substrate21can comprise substrate terminals211,113and214. Semiconductor device20can be similar to the above-described semiconductor device10terms of features, elements, or manufacturing. As illustrated inFIG.3C, after clip joint155is removed, gap155A is interposed between clip leg1552and clip leg1551. FIGS.4A,4B,4C,4D,4E,4F,4G,4H, and4Ishow cross-sectional views and plan views of an example method for manufacturing semiconductor device20. In the following, reference is made toFIGS.3A,3B, and3Ctogether. FIG.4Ashows a cross-sectional view of semiconductor device20at an early stage of manufacture. In the example shown inFIG.4A, substrate21can be provided. Interface materials14A can be provided on substrate terminals113and214, similar to as described with respect to interface material14A forFIG.2B. In some examples, substrate21can be similar to substrate11. Substrate21can comprise substrate terminals211,113and214. Substrate terminals211can be arranged at peripheral edges of substrate terminals113and214. In some examples, multiple substrate terminals211can be arranged at one side of a substrate terminal113. In some examples, multiple substrate terminals211can be arranged at three side sides of substrate terminals113or214. In some examples, substrate terminal211can comprise or be referred to as one or more leads. In some examples, substrate terminals113or214can comprise or be referred to a leads, pads, paddles or flags. In some examples, substrate21can have a width ranging from approximately 3 mm×3 mm to approximately 15 mm×15 mm. In some examples, substrate21can have a thickness ranging from approximately 100 μm to approximately 200 μm. In some examples, substrate terminals211can have a width ranging from approximately 1 mm×1 mm to approximately 10 mm×10 mm. In some examples, substrate terminals211can have a thickness ranging from 100 μm to approximately 200 μm. An area of substrate terminal214can be dependent on the size of semiconductor component22, and in some examples substrate terminal214can have an area ranging from approximately 1.5 mm×1.5 mm to approximately 10.5 mm×10.5 mm, or a thickness ranging from approximately 100 μm to approximately 200 μm. FIG.4Bshows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4B, semiconductor component12can be provided on substrate terminal113. In some examples, the stage, features, or elements ofFIG.4Bcan be similar to those described with respect to semiconductor component12forFIG.2C. In some examples, semiconductor component12can be arranged on interface material14A. Semiconductor component12can comprise component terminals121and122at a top side of semiconductor component12, and component terminal123at a bottom side of semiconductor component12. In some examples, semiconductor component22can be provided on substrate terminal214. In some examples, semiconductor component22can be arranged on interface material14A. In some examples, semiconductor component22can comprise or be referred to as a controller, a digital signal processor (DSP), a microprocessor, a network processor, a power management processor, an audio processor, an RF circuit, a wireless baseband system-on-chip (SoC) processor, a sensor, or an application specific integrated circuit (ASIC). In some examples, semiconductor component22can have an area ranging from approximately 1 mm×1 mm to approximately 10 mm×10 mm. In some examples, semiconductor component22can have a thickness ranging from 50 μm to approximately 775 μm. In some examples, semiconductor component22can comprise multiple terminals221located on a top side of semiconductor component22. In some examples, interface material14A is melted or cured to couple semiconductor components12and22to substrate terminals113and214respectively. FIG.4Cshows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4C, interface materials14B,14C, and14D can be provided. In some examples, interface materials14B,14C, or14D can be applied similar to as described with respect toFIG.2D. In some examples, interface material14B and14C can be respectively provided on component terminal121and122of semiconductor component12. In some examples, interface material14D can be provided on substrate terminals211of substrate21. FIG.4Dshows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4D, clip structure15can be provided on semiconductor component12and substrate terminal211. In some examples, the stage, features, or elements ofFIG.4Dcan be similar to those described with respect to clip structure15forFIG.2E. In some examples, clip structure15can comprise clips151and152(seeFIG.3C) and clip joint155. In some examples, clip joint155can comprise clip legs1551and1552(seeFIG.3C). Clips151and152can be coupled to each other by clip joint155. In some examples, clip joint155can have a greater height than clips151and152. In some examples, opposite ends of clip joint155can be coupled to clips151and152through clip legs1551and1552, respectively. In some examples, clip legs1551and1552can be provided between clip joint155and clips151and152in an inclined shape. In some examples, first ends of clips151and152can be coupled to semiconductor component12, and second ends of clips151and152can be coupled to substrate terminal(s)211. In some examples, the first ends of clips151and152can be coupled to interface material14B provided on component terminal121of semiconductor component12, and the second ends of clips151and152can be coupled to interface material14D provided on substrate terminal211. In some examples, clips151and152can be provided in an inclined or stepped shape extending from semiconductor component12to substrate terminal(s)211. In some examples, the first ends of clips151and152can be referred to as component-attached regions. In some examples, the second ends of clips151and152can be referred to as substrate-attached regions. FIG.4Eshows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4E, a reflow process can be performed. The reflow process can comprise placing substrate21into a reflow furnace or a laser assist bonding device to apply a temperature of approximately 150° C. to approximately 400° C. Thereafter, substrate21can be cooled and thus melted interface materials14B and14D can be cooled, thereby coupling substrate terminal211and component terminal121of semiconductor component12to each other through clip structure15. FIG.4Fshows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4F, cleaning can be performed. The cleaning can comprise removing residuals of interface materials or removing a variety of particles remaining on substrate11, semiconductor component12and22, and clip structure15. In some examples, the cleaning can comprise a variety of processes including, for example, spraying a washing solution onto substrate11, soaking substrate21into a washing solution tank, or ultrasonically washing. FIG.4Gshows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4G, interconnects29can be provided. In some examples, semiconductor component12and semiconductor component22can be coupled to each other by interconnect29, and semiconductor component22and substrate terminal211can be coupled to each other by interconnect29. In some examples, terminal221of semiconductor component22and component terminal122(e.g., a gate terminal) of semiconductor component12can be bonded to each other by interconnect29. In some examples, terminal221of semiconductor component22and substrate terminal211can be bonded to each other by interconnect29. In some examples, a first end of interconnect29can be ball-bonded to terminal221of semiconductor component22, and a second end of interconnect29can be stitch-bonded to component terminal122of semiconductor component12, or vice versa. In some examples, the first end of interconnect29can be ball-bonded to terminal221of semiconductor component22, and the second end of interconnect29can be stitch-bonded to substrate terminal211, and vice versa. In some examples, interconnect29can comprise or be referred to as a conductive wire or a bonding wire. In some examples, interconnect29can have a diameter ranging from approximately 15 μm to approximately 30 μm. Interconnect29can transfer an electrical signal (e.g., a control signal) from semiconductor component22to semiconductor component12. FIG.4Hshows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4H, encapsulant13can be provided on substrate21, semiconductor component12and22, and clip structure15. In some examples, the stage, features, or elements ofFIG.4Hcan be similar to those described with respect to encapsulant13forFIG.2F. Encapsulant13can contact substrate21, semiconductor component12and22, and clip structure15, or can encapsulate substrate21, semiconductor component12and22, and clip structure15. As seen inFIG.4H, encapsulant13can be applied to fully cover clip structure15. There can be examples where a portion of clip structure15, such as clip joint155, can remain exposed from encapsulant13. FIG.4Ishows a cross-sectional view of semiconductor device20at a later stage of manufacture. In the example shown inFIG.4I, thinning can be performed. In some examples, the stage, features, or elements ofFIG.4Ican be similar to those described with respect to thinning forFIG.2G. In some examples, a top side of encapsulant13can be thinned until clip joint155is removed to disconnect clip151and clip152from each other. In some examples, clip joint155can be grinded or removed while encapsulant13is thinned. In some examples, clip joint155can be cut with a mechanical or laser saw. With clip joint155removed, clips151and152are physically and electrically disconnected from each other. In some examples, source-drain current can then independently flow through clip151, and source-drain current can then independently flow through clip152. FIGS.5A to5Bshow plan view and cross-sectional view of an example method for manufacturing example semiconductor device20. In the example shown inFIGS.5A and5B, after the grinding, clip legs1551and1552can be exposed at the top side of encapsulant13. In some examples, an oxidation resistant film made of gold (Au), silver (Ag), nickel, (Ni), palladium (Pd), solder (Sn), or organic solderability preservative (OSP) can be provided on clip legs1551and1552. In some examples, component90can be mounted on clip legs1551and1552. In some examples component90can comprise active elements, such as a semiconductor die, or passive elements such as an inductor or a capacitor. FIGS.6A to6Bshow plan view and cross-sectional view of an example method for manufacturing example semiconductor device20. In the example shown inFIGS.6A and6B, after the grinding, clips151and152or clip legs1551and1552can be exposed at the top side of encapsulant13. Note that in some examples the grinding can continue until clip legs1551and1552are completely removed, such that only clips151and152are exposed at the top side of encapsulant13. In some examples, an oxidation resistant film made of gold (Au), silver (Ag), nickel, (Ni), palladium (Pd), solder (Sn), or organic solderability preservative (OSP) can be provided on clips151and152or clip legs1551and1552. In some examples, component90can be mounted on clip legs1551and1552or clips151and152. In some examples component90can comprise active elements, such as a semiconductor die, electronic components, or passive elements such as an inductor or a capacitor. FIGS.7A to7Cshow top view, side view and front view of portions of example methods for manufacturing semiconductor device10or20. In some examples, as illustrated inFIG.7A, clip structure15can comprise clips151and152positioned adjacent each other, with clip joint155positioned between clips151and152, with clip leg1551coupling clip151with clip joint155, and with clip leg1552coupling the clip152with clip joint155. Clip legs1551and1552can extend inclined between clip joint155and respective clips151-152. A top of clip joint155can be higher than the top of clips151and152, or higher than midpoints of clip legs1551and1552. In some examples, clips151and152can also comprise inclined portions. For instance, clip151can comprise substrate-attached region151A positioned lowest coupled to substrate terminal111or211, component-attached region151B positioned highest coupled to semiconductor component12, and inclined region151C coupling substrate-attached region151A with component-attached region151B. After encapsulating with encapsulant13, clip joint155can be removed. In some examples, such removal of clip joint155can correspond or be similar to the stages described with respect toFIG.2F-2G,4H-4I,5A-5B, or6A-6B. In some examples clip joint155can be grinded to disconnect clips151and152from each other, with clip legs1551and1552or clips151and152remaining exposed at the top side of encapsulant13. In some examples, component90can be mounted on exposed clip legs1551and1552or exposed clips151and152. In some examples, as shown inFIG.7B, clip structure15can comprise clips151and152positioned adjacent each other, with clip joint155positioned between clips151and152. Clip legs1551and1552can be optional in the present example or can be considered part of clip joint155. In the present example, without clip legs1551and1552inclined, the top of clip joint155can be coplanar with or at similar height as the top of clips151or152. In some examples, clip joint155can initially tie together component-attached regions151B and152B of clips151and152. In some examples, clip joint155can be substantially coplanar with component attached region151B. In some examples, clip joint155and can comprise a thin region or groove1553at the bottom of clip joint155. After encapsulating with encapsulant13, clip joint155can be removed. In some examples, such removal of clip joint155can correspond or be similar to the stages described with respect toFIG.2F-2G,4H-4I,5A-5B, or6A-6B. In some examples clip joint155can be grinded until removed, such as by grinding to reach or expose groove1553, thus disconnecting clips151and152from each other, with clips151and152remaining exposed at the top side of encapsulant13. In some examples, component90can be mounted on exposed clips151and152. In some examples, as illustrated inFIG.7C, clip structure15can comprise clips151and152positioned adjacent each other, with clip joint155positioned between clips151and152. Clip legs1551and1552can be optional in the present example or can be considered part of clip joint155. In the present example, without clip legs1551and1552inclined, the top of clip joint155can be coplanar with or at similar height as the top of clips151or152. In some examples, clip structure15ofFIG.7Ccan initially be similar to the clip structure ofFIG.7A or7B. After encapsulating with encapsulant13, clip joint155can be removed. In some examples, such removal of clip joint155can correspond or be similar to the stages described with respect toFIG.2F-2G,4H-4I,5A-5B, or6A-6B. In some examples, after the encapsulating with encapsulant13, clip joint155can be removed by partial cutting, such as by sawing with a mechanical or laser saw, whether alone or after grinding. In some examples, clip joint155can be cut, thereby separating clips151and152from each other. In some examples, the partial cutting can be performed linearly across encapsulant13and clip joint155using a diamond wheel or a laser beam. In some examples, because of the partial cutting, encapsulant13can comprise groove131. In some examples, partial cutting to remove clip joint155can be carried out after grinding to expose clip joint155. In some examples, during the encapsulation with encapsulant13, the top of clip structure15or clip joint155remain be exposed. In some examples, encapsulant13can encapsulate a lower region of clip structure15, except for the top of clip structure15or clip joint155, by film assist molding. After encapsulating, the top side of clip structure15can remain exposed even without grinding, and grinding can be omitted. Partial cutting can be performed on the exposed clip joint155, thereby untying separating clip structure15into two clips151and152from each other.FIGS.6A,7A, and7Bshow examples where upper surfaces of component-attached regions (e.g.,151B,152B) of clip structure15are exposed from a top side of encapsulant13. The present disclosure includes reference to certain examples; however, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the disclosure. In addition, modifications may be made to the disclosed examples without departing from the scope of the present disclosure. Therefore, it is intended that the present disclosure not be limited to the examples disclosed, but that the disclosure will include all examples falling within the scope of the appended claims. | 43,436 |
11862893 | Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of implementations. DETAILED DESCRIPTION This document features an extendable electrical outlet enclosure. There are many features of an electrical enclosure and method implementations disclosed herein, of which one, a plurality, or all features or steps may be used in any particular implementation. In the following description, reference is made to the accompanying drawings which form a part hereof, and which show by way of illustration possible implementations. It is to be understood that other implementations may be utilized, and structural, as well as procedural, changes may be made without departing from the scope of this document. As a matter of convenience, various components will be described using exemplary materials, sizes, shapes, dimensions, and the like. However, this document is not limited to the stated examples and other configurations are possible and within the teachings of the present disclosure. As will become apparent, changes may be made in the function and/or arrangement of any of the elements described in the disclosed exemplary implementations without departing from the spirit and scope of this disclosure. FIG.1depicts a top perspective view of a non-limiting implementation of an extendable electrical outlet enclosure10. The extendable electrical outlet enclosure10is designed to be modular so that a different size extendable electrical enclosure10can be implemented in each new situation, depending on the needs of the particular outlet and its location and installation.FIG.2shows an exploded view of the electrical enclosure10ofFIG.1. In the implementation shown, the electrical enclosure10comprises a main body12, a bezel14, a cap16, at least one extension tube18, and a back plate20. These main components of the electrical enclosure10are configured to align and couple with the bezel14and cap16connected to a first end22of the main body12and the at least one extension tube18connected to a second end24of the main body12. The back plate20is then connected to the at least one extension tube18. Inside of the main body, an electrical device27can be coupled to the main body12at an electrical device support28. Each of the individual components may be coupled with the adjacent component using one or more screws31. FIG.3Ashows a side view of the electrical enclosure10ofFIGS.1and2. The main body12has a first end22and a second end24that is opposite the first end22. In addition, the main body12has a wall26that extends between the first end22and the second end24.FIG.3Bshows a top view of the electrical enclosure10with the cap16in place. The cap16functions to obscure a view of the electrical device27when the electrical device27is not in use by covering an opening29of the main body12.FIG.3Cshows a bottom view of the electrical enclosure10. FIG.4depicts a cross-sectional view of the electrical enclosure10taken along the section line4-4shown inFIG.3A, andFIG.2depicts an exploded view. The main body12may have a bezel support25at the first end22of the main body12. The bezel support25extends radially outward from the first end22and provides a surface to which the bezel14is configured to attach, surrounding the opening29at the first end22of the main body12. The cap16is configured to removably mount to the bezel14, thus covering the opening29when the electrical device27is not in use. An electrical device support28extends radially inward from the wall26towards the center line of the main body12. The electrical device support28defines a separation between an electrical plug section30and a wiring section32. The electrical plug section30is adjacent to the first end22, while the wiring section32is adjacent to the second end24. When an electrical device27has been installed within the electrical enclosure10, an electrical plug can be coupled with the electrical device27through the electrical plug section30. Power may be supplied to the electrical device27through wiring that is coupled with the electrical device27through the wiring section32. The main body12may have at least one screw boss34connected to the wall26at the second end24(shown inFIG.2). The at least one extension tube18may be one extension tube, two extension tubes, or more than two extension tubes. Each of the at least one extension tube18has an outer wall36extending between a leading end38and a trailing end40. The leading end38may have at least one leading screw boss42connected to the outer wall36and accessible at the leading end38. The trailing end40may have at least one trailing screw boss44connected to the outer wall36and accessible at the trailing end40. The at least one leading screw boss42may be configured to align and couple with the least one screw boss34of the main body12using a screw31. The back plate20may be the same shape as the cross section of the tubular main body12and the at least one extension18. The back plate20may have at least one cord receiver aperture46extending therethrough (see alsoFIG.5). Alternatively, the back plate20may have no cord receiver aperture (seeFIG.6), or exactly two cord receiver apertures46(seeFIG.6). The at least one cord receiver aperture46is configured to allow wiring to extend from the electrical enclosure10. The back plate20may also have at least one mounting screw aperture48extending therethrough. The at least one mounting screw aperture48is configured to align with the at least one trailing boss44of the at least one extension tube18. In implementations having more than one extension tube18, the leading screw boss42of the first extension tube18is configured and positioned to align and couple with the at least one screw boss34of the main body12. The leading screw boss42of each succeeding extension tube18is configured and positioned to align and couple with the at least one trailing screw boss44of the preceding extension tube18. The at least one mounting screw aperture48of the back plate20is configured and positioned to align and couple with the at least one trailing screw boss44of the last extension tube18. For example, in an implementation with two extension tubes, the at least one leading screw boss42of the first extension tube18is configured to align and couple with the at least one screw boss34of the main body12, the at least one leading screw boss42of the second extension tube18is configured to align and couple with the at least one trailing screw boss44of the first extension tube18, and the at least one mounting screw aperture48of the back plate20is configured to align and couple with the at least one trailing screw boss44of the second extension tube18. In situations where more wiring is attached to the electrical device27, it is beneficial to have more extension tubes18because this creates more space within the electrical enclosure10to hold the wiring. Therefore, each specific situation will determine the number of extension tubes18that could be used beneficially. FIG.7depicts a perspective bottom view of the electrical enclosure ofFIG.1with the back20plate removed, showing the internal configuration of an assembled electrical enclosure10. In the implementation shown, each extension tube18has leading screw bosses42that are out of alignment with the trailing screw bosses44of the same extension tube18. This allows easier access to the leading screw bosses42with a tool when the electrical enclosure10is assembled. In a particular use example, an electrical outlet enclosure10for in-floor installation is to be installed into a floor. In a first installation, the floor is shallow, for example, framed with only 2×4 studs or to be formed with a shallow concrete pour, and an installer does not have a lot of room to install the electrical outlet enclosure10. In this first situation, the installer uses only the main body12, bezel14, cap16, the back plate20with cord receiver apertures46, and at least one screw31to attach the back plate20to the at least one screw boss34of the main body12. In a second installation, the floor is a little deeper and more space is needed within the electrical outlet enclosure10, for example framed with 2×6 studs or to be formed with a deeper concrete pour. In this second situation, the installer could use the main body12, bezel14, cap16, a first extension tube18, the back plate20with cord receiver apertures46, and a screw31to attach the extension tube18leading screw boss42to the screw boss34of the main body12, and a screw31to attach the back plate20to the trailing screw boss44of the extension tube. In a third installation, for example, the floor is deep and an installer has plenty of room for whatever depth of the electrical outlet enclosure10the installer desires. In this third situation, the installer could use the main body12, bezel14, cap16, two or more extension tubes18, the back plate20with cord receiver apertures46, and the screws31to attach the extension tubes18leading screw boss42to the screw boss34of the main body12and to the trailing screw boss44of the extension tube(s) respectively, and a screw31to attach the back plate20to the trailing screw boss44of the extension tube. Although the embodiments illustrated show only two extension tubes18, and it is currently contemplated that most products sold will include two extension tubes18, it will be understood by those of ordinary skill in the art that one or more extension tubes18may be used and in particular installations, it may be desirable to use three or even four or more extension tubes18for an installation, attaching them to each other to form the electrical outlet enclosure10as the first two are attached and described herein. It will be understood that extendable electrical enclosure implementations are not limited to the specific assemblies, devices and components disclosed in this document, as virtually any assemblies, devices and components consistent with the intended operation of an extendable electrical enclosure may be utilized. Accordingly, for example, although particular electrical enclosures, covers, lids, sleeves, latches, snap-fit couplers, hinges, frames, enclosures, bubble covers, housings, joints, protrusions, ledges, clamps, grooves, ridges, couplers, fasteners, power sockets, and other assemblies, devices and components are disclosed, such may include any shape, size, style, type, model, version, class, measurement, concentration, material, weight, quantity, and/or the like consistent with the intended operation of an electrical enclosure implementation. Implementations are not limited to uses of any specific assemblies, devices and components; provided that the assemblies, devices and components selected are consistent with the intended operation of an extendable electrical enclosure. Accordingly, the components defining any electrical enclosure implementations may be formed of any of many different types of materials or combinations thereof that can readily be formed into shaped objects provided that the components selected are consistent with the intended operation of an electrical enclosure implementation. For example, the components may be formed of: polymers such as thermoplastics (such as ABS, Fluoropolymers, Polyacetal, Polyamide; Polycarbonate, Polyethylene, Polysulfone, and/or the like), thermosets (such as Epoxy, Phenolic Resin, Polyimide, Polyurethane, Silicone, and/or the like), any combination thereof, and/or other like materials; glasses (such as quartz glass), carbon-fiber, aramid-fiber, any combination thereof, and/or other like materials; composites and/or other like materials; metals, such as zinc, magnesium, titanium, copper, lead, iron, steel, carbon steel, alloy steel, tool steel, stainless steel, brass, tin, antimony, pure aluminum, 1100 aluminum, aluminum alloy, any combination thereof, and/or other like materials; alloys, such as aluminum alloy, titanium alloy, magnesium alloy, copper alloy, any combination thereof, and/or other like materials; any other suitable material; and/or any combination of the foregoing thereof For the exemplary purposes of this disclosure, sizing, dimensions, and angles of electrical enclosure implementations may vary according to different implementations. Various electrical enclosure implementations may be manufactured using conventional procedures as added to and improved upon through the procedures described here. Some components defining electrical enclosure implementations may be manufactured simultaneously and integrally joined with one another, while other components may be purchased pre-manufactured or manufactured separately and then assembled with the integral components. Various implementations may be manufactured using conventional procedures as added to and improved upon through the procedures described here. Accordingly, manufacture of these components separately or simultaneously may involve extrusion, pultrusion, vacuum forming, injection molding, blow molding, resin transfer molding, casting, forging, cold rolling, milling, drilling, reaming, turning, grinding, stamping, cutting, bending, welding, soldering, hardening, riveting, punching, plating, and/or the like. If any of the components are manufactured separately, they may then be coupled with one another in any manner, such as with adhesive, a weld, a fastener (e.g. a bolt, a nut, a screw, a nail, a rivet, a pin, and/or the like), wiring, any combination thereof, and/or the like for example, depending on, among other considerations, the particular material forming the components. It will be understood that the assembly of extendable electrical enclosures are not limited to the specific order of steps as disclosed in this document. Any steps or sequence of steps of the assembly of electrical enclosures indicated herein are given as examples of possible steps or sequence of steps and not as limitations, since various assembly processes and sequences of steps may be used to assemble electrical enclosures. The electrical enclosure implementations described are by way of example or explanation and not by way of limitation. Rather, any description relating to the foregoing is for the exemplary purposes of this disclosure, and implementations may also be used with similar results for a variety of other applications requiring an extendable electrical enclosure. | 14,566 |
11862894 | DETAILED DESCRIPTION The invention can be implemented in numerous ways, including as a process; an apparatus; a system; a composition of matter; a computer program product embodied on a computer readable storage medium; and/or a processor, such as a processor configured to execute instructions stored on and/or provided by a memory coupled to the processor. In this specification, these implementations, or any other form that the invention may take, may be referred to as techniques. In general, the order of the steps of disclosed processes may be altered within the scope of the invention. Unless stated otherwise, a component such as a processor or a memory described as being configured to perform a task may be implemented as a general component that is temporarily configured to perform the task at a given time or a specific component that is manufactured to perform the task. As used herein, the term ‘processor’ refers to one or more devices, circuits, and/or processing cores configured to process data, such as computer program instructions. A detailed description of one or more embodiments of the invention is provided below along with accompanying figures that illustrate the principles of the invention. The invention is described in connection with such embodiments, but the invention is not limited to any embodiment. The scope of the invention is limited only by the claims and the invention encompasses numerous alternatives, modifications and equivalents. Numerous specific details are set forth in the following description in order to provide a thorough understanding of the invention. These details are provided for the purpose of example and the invention may be practiced according to the claims without some or all of these specific details. For the purpose of clarity, technical material that is known in the technical fields related to the invention has not been described in detail so that the invention is not unnecessarily obscured. Existing configurations for constructing a battery system for home or grid scale use have various pros and cons:For example, among existing configurations that use Li-ion battery cells for storing electrical energy, there exists an ever present risk that any single cell may have a critical failure that leads to thermal runawayManaging a cell that has tripped into thermal runaway is a non-trivial challenge.The event results in nearly all the mass of a single cell to undergo an exothermic chemical reaction that raises the temperature of that cell from ˜100 C to >1000 C in a matter of seconds.The same chemical reaction produces an excessive amount of superheated gases that must escape the energy storage system.In some embodiments, to improve upon existing battery system configurations and manage thermal runaway events, a battery design (also referred to herein as a “submodule”) is used that isolates all battery cells within a battery system into, in some embodiments, groups of no more than 2 cellsIn some embodiments, the isolation of these cells provides enough thermal resistance from one cell to the next to prevent thermal propagation beyond the single bay of two cells.In some embodiments, the isolation of these cells may present electrical challenges by fully encapsulating each pair of cells inside of a sealed box or enclosure. Described herein are embodiments of techniques for ensuring the submodule cells remain isolated (sealed) within their respective chambers while simultaneously providing electrical pathways to carry power, signal, and data into and out of the sealed chambers. Example Embodiments Example Embodiment 1: In some embodiments, an electromechanical connector that can pass power into and out of the cells while also providing an IP68 seal to the container:includes busbars capable of handling high density current into and out of the submoduleincludes gasket geometry that seals the plate against the openings in the submodule wallprovides additional electrical ports for the independent measurement of voltage and temperature at one or more nodes along the battery systemprovides fastening architecture that is similarly used to ensure an effective seal is produced at all locations where the submodule container has an openingExample Embodiment 2: In some embodiments, an electromechanical connector is designed that can be used as a subassembly insert on the larger electromechanical assembly referenced aboveIn some embodiments, this electromechanical connector fits within the constraints of the container and power lines as defined by the minimum container size, driven in some embodiments by the thickness of the cells as stacked within a single containerIn some embodiments, the electromechanical connector provides sufficient electrical isolation so as to comply with the standards set forth by regulatory bodies; i.e. designed to withstand full system voltages of up to 300VIn some embodiments, the electromechanical connector provides sufficient electrical conductivity so as to allow for balancing currents to be fed into the battery system through this connectorIn some embodiments, the electromechanical connector provides a minimum of two lines (feeds and returns) as required for the installation of a plurality of thermistors upon the interior of each battery cell containerIn some embodiments, lines of this nature may be combined with additional returns (voltage change) and only one feed (ground) so as to minimize additional leak points and space requiredIn some embodiments, the electromechanical connector may provide features that can be overmolded during a subsequent insert mold applicationIn some embodiments, features may melt/converge with the injection resin during the subsequent insert molding process, so long as the exterior profile dimensions after the fact remain unchanged. In some embodiments, the tooling is configured to change the external profile dimensions.In some embodiments, the electromechanical connector provides for duplicated mating connector plugs to be applied to both sides of the same receptacleIn some embodiments, the inverse may also be true, wherein the plug is double ended and the receptacle is duplicated for mating purposesIn some embodiments, the electromechanical connector provides a latching mechanism on both sides of the signal input/output so as to create a strong mechanical retention of any mating connector throughout the product lifecycleIn some embodiments, the electromechanical connector is manufacturable at high volume and out of a readily available, and in some embodiments recycled, polymeric compound, ceramic compound, or any other insulating material as appropriate.In some embodiments, the electromechanical connector includes independent sealing features to further facilitate the IP68 isolation of cells interior to the containers and the surrounding environmentExample Embodiment 3: A cable harness that mates with the smaller electromechanical connector referenced above that is plugged into the connector One embodiment of the small electromechanical assembly is an off the shelf connector that is capable of: 1. Measuring voltages at every location within a collection of containers (in some embodiments, each container is connected to one another in series, and with ‘central’ nodes that cannot be accessed from outside of each container) 2. Measuring the temperature at a plurality of the coldest and hottest locations of each container (e.g., in hottest and/or coldest locations in a container) 3. Supplying balancing current to designated nodes throughout the series connection of cells/containers 4. Having mating plug/receptacle features that in some embodiments are exactly or substantially the same on both sides of the connector 5. In some embodiments, fitting within the height of two battery cells stacked atop one another 6. In some embodiments, high temperature resistant insulator or an insulator that is compatible with an insert mold that will be injected around this connector In some embodiments, the embodiment identified above facilitates a long term path of creating a single, full turn-key solution for the top level electromechanical design identified as in Embodiment 1 above. One example iteration of Embodiment 1 is one in which the power carrying busbars/connectors are deformed, scored, or modified in a material fashion so as to create positive-pressure interference fit of overmolded resin, thereby further preventing leaks. An example alternative to Embodiment 2 is to use a contactless-connector to pass signal and current across an insulator without introducing a risk of leak path. Embodiment 2 Example Iterations/Concepts Example Baseline assumption: use of standard pins and socket electrical connections may lead to greater risk of leaking or harder time positioning.Example Iteration 1: use a PCB (printed circuit board) with through-holes and pads that are touched off against by pogo-pins on the plugsExample Iteration 1.1: use deflecting formed contacts for touching off on the PCB pads In another embodiment, a PCB with mechanically connected pins is used as the plug component that is used to create embodiment 1. In another embodiment, use of a PCB with mechanically connected pins and additional location features constitutes the entirety of Embodiment 2 for inclusion in Embodiment 1. In some embodiments of this instance, the location features may be electrically insulating. In some embodiments, for this embodiment, the location features may be electrically conducting. with pins. In another embodiment, the PCB has mechanically connected sockets that mate In some embodiments, the pins and or sockets attached to the PCB are electrically connected to the PCB. In some embodiments, the PCB is made of a flexible circuit board. The following are additional embodiments and details regarding electromechanical connectors. Additional Embodiments FIG.1illustrates an embodiment of a sub-module. In this example, and as described above, the sub-module encapsulates a pair of cells (also referred to herein as pouches) inside of a sealed enclosure. FIG.2Aillustrates an embodiment of an electromechanical connector plate200of a sub-module. The face of the connector plate includes power connectors202and204, where power is carried through the power connectors into and out of the battery cells. In some embodiments, the connector plate200is integrated into a larger power transfer system for a battery management system. In some embodiments, the connector is linear. In some embodiments, the connector plate component200fits over one end of the sub-module, “capping” one end of the enclosure. The other end of the enclosure of the sub-module may be sealed with another cap. In some embodiments, the plate is a closing, sealing component to the assembly of the sub-module. Further details regarding fastening of the connector plate to the face of a submodule are described below. In some embodiments, the plate component form factor carries power into and out using metal inserts202and204(which may be connected to busbars) directly to the cells. In some embodiments, the face plate also includes an electromechanical port206. Further details regarding the port206are described below. In some embodiments the connector plate is fastened linearly in place (as opposed for example, in a circular fashion or using flanges around a connector). As one example, the plate200fits over the cutouts in the face of the sub-module enclosure as shown in the example ofFIG.3, providing both connection points, while also sealing the sub-module. For example, as shown in the embodiment ofFIG.3, the can/enclosure of the sub module includes cutout holes302-308for fastening the connector plate to the bulkhead passthrough of the face of the sub-module, as well as passthroughs for the electrical signal (e.g., passthrough306for connector206) and for power (302and304for power connectors202and204, respectively). Further details regarding fastening of the connector plate200to a submodule enclosure are provided below. Continuing with the example ofFIG.2A, in some embodiments, the electromechanical port206includes pins208. In some embodiments, the pins are used to carry signals into/out of the sub-module. In some embodiments, at least some of the pins (e.g., middle two pins) are used for measuring the temperature using instrumentation in the inside of the sub-module to ensure safety of the battery system. As one example, the temperature sensing is performed using thermistors. In some embodiments, at least some of the pins (e.g., outer two pins) are used for balancing battery cells and their voltages. These pins may be used to actively measure the voltage of the cells. In some embodiments, these pins also supply the cells balancing currents. For example, in some embodiments, two of the pins are connected to two different ends of a battery cell in the sub-module. In some embodiments, the balancing current pins are spaced as far apart as possible (e.g., as the two outermost pins). In some embodiments, the pins for current balancing are also used to simultaneously measure the voltage. In some embodiments, the voltage measuring pins are separated from the circuit including metal portions/power connectors202and204. In some embodiments, the voltage sensing pin simultaneously, based on its connection to a sensor network inside the sub-module, also allows for current to flow into the battery cell (or through another pin, such as an outer pin). Those currents are then used to appropriately ensure that every parallel set of batteries (e.g., throughout an entire stack of sub-modules) are maintained at the same voltage level as other battery cells within the stack. As described above, the sub-module is designed to handle battery cells in a manner that effectively manages thermal runaway events. In some embodiments the connector plate component200functions to facilitate such thermal management by allowing electrical signals to pass into and out of the sub-module, both from a power side, as well as a balancing current side, for example via the electromechanical connector206. In some embodiments, connector206is designed into a mold for the connector plate200. FIG.2Billustrates an embodiment of a connector plate for a sub-module. A rear view of plate200is shown in the example ofFIG.2B. In this example, connector port206is the same material on both sides as a bulkhead pass-through connector. As shown in this example, the connector206is an example of a bulkhead connector that is double ended. In some embodiments, the receptacle206mates to a plug. In some embodiments, the connector206is plugged into the same way on both sides of the plate. As shown in this example, the connector plate is an example of a linear connector that is able to carry currents for a battery system (e.g., via the busbars), while simultaneously providing the ability to obtain balancing currents, voltage sensing, temperature instrumentation out of a sub-module, etc. without causing leakage. In some embodiments, gasket210is used to prevent leakage. An example of gasket210isolated is shown inFIG.2C. In some embodiments, the connector206includes a double ended receptacle that may be overmolded with the rest of the plate assembly200. In some embodiments, portions202,204, and the connector206are inserts during the manufacturing process, where the plate is injected over the inserts, and the gasket is then overmolded. In some embodiments, the face connector plate is built as a full turnkey part. In some embodiments, as used herein, for injection molding, there are three types or categories. One example is straight injection molding where a plastic part is manufactured that does not have anything else associated with it, until it is introduced into a next level subassembly or top level assembly. Another example is insert-molded parts. This includes having components such as metal or plastic components that are inserted into the tool to manufacture the (electromechanical) assembly as a whole. Here, polymer is molded around those inserts. An overmold includes using a piece that has already been injection molded once before, which is inserted into a tool that is configured to shut off on that plastic piece and mold a different plastic over it, whether that is a gasket or a different resin altogether with a different color. In overmolding, there is an existing injection molded piece on top of which more material is being molded. The following is one embodiment of manufacturing the connector plate200. Connector206is molded. The connector206is used as an insert for an insert mold. The remaining portion of the plate200(minus the gasket) is molded around the connector, as well as the metal inserts202and204. An overmold is then performed to include the gasket210. In another embodiment, manufacturing of the connector plate200in its entirety is made by a tool, eliminating the middle step of first manufacturing the connector206as an insert. In various embodiments, the gasket is adhered in place (e.g., with a sticker), or placed without an adhesive between the connector plate and the pass-through wall. FIG.2Dillustrates an embodiment of an exploded view of the face plate component200. In some embodiments, manufacturing starts with an empty tool into which parts202,204(power connectors), and pins208are inserted. Compression limiters214-220are also included (embodiments of compression limiters are described in further detail below) Those parts are inserted into the tool. The tool then molds component212(e.g., plastic component) around the inserts (inserted parts202,204,208, and214-220), where in some embodiments component212is molded in a single pass or in one shot. The gasket is then overmolded. As shown in this example, the gasket210is overmolded over both sides of the connector plate (as also shown in the examples ofFIGS.2B and13). In some embodiments, the receptacle206is molded as part of the pass in which component212is molded. In other embodiments, receptacle206is molded around the pins208first, and then the combination of the receptacle/connector with inserted pins, along with the power connectors202and204, is overmolded with component212all at once. This allows, for example, the use of arbitrary off-the-shelf connectors. In this example, the connector206is used as a subassembly insert that then is included as an interstitial step, which allows for various changes to instrumentation while minimizing changes to the overall connector profile or geometry or design. In some embodiments, the connector206is flanged. In some embodiments, the double-ended connector has a flange geometry for overmolding (rather than for being assembled). This allows the connector to fit within the sub-module, while eliminating leak points (which would be introduced if it were separately assembled). This also allows for integration with the gasket geometry. In some embodiments, the retention feature of the connector206is removed from the connector, and is instead incorporated into the overmolded component itself. In some embodiments, laser welding is performed. In some embodiments, rather than having connector206, the signal lines are incorporated into the geometry of component212. In this manner, a connection may be made directly from the outside of the module to the inside. By doing so, the requirements for mating force retention of a bulkhead passthrough is eliminated, which allows for a much smaller geometry for the signals carried by the pins208that are contained within connector206or component212. With the reduced size, the connector with the pins208may be removed, and the signal lines incorporated in parallel with the overall power transfer components (including the metal inserts202and204). This further eliminates and minimizes the number of fasteners, thereby further reducing the number of openings in the sealed container that holds the cells. In some embodiments, the pins208of connector206are electrically isolated from higher voltages that may be observed on the energy storage module, thereby reducing the voltage isolation requirements between each of the pins208. This lowering of the requirement on voltage isolation allows a reduction in the overall size of the connector in some embodiments. FIG.4illustrates an embodiment of a sub-module. A top-down view of sub-module100is shown in this example. In this example, the connector plate200is installed on the left side of the sub-module. Metal portions202and204are shown in the example ofFIG.4. Suppose that50Amps is running through power connectors202and204. In some embodiments, the battery cells402and404are series-connected, and the same current will be flowing through them. Suppose that one of the cells drops in voltage lower than other cells or sub-modules. This can cause issues. Similarly, if it becomes too high in voltage, this can also cause an issue. As described above, in some embodiments, the electromechanical connector port206is configured to sense the voltage, for example at location406. In some embodiments, voltage sensing is connected off of location202and the common node across the battery cells, and through that voltage connection, balancing current may also be supplied, for example, up to 150 mA, to offset any internal resistance changes or differential voltages that are observed between one set of cells and the next set of cells (e.g., between battery cells402and404) FIG.5illustrates an embodiment of a portion of a sub-module. In this example, the “face” or “terminal side” of the sub-module is shown. Connector plate200is shown at the face of the sub-module. In some embodiments, the plate200allows the ability to passthrough into/out of the sub-module while still maintaining a level of isolation (e.g., IP68 isolation) within the sub-module. In some embodiments, the connector plate, when fastened, is a water-tight seal connector. In some embodiments, the plate is installed by being bolted into place onto the exterior face of the sub-module. In some embodiments, the plate is installed on the interior face of the sub-module. Further details regarding embodiments of a fastening architecture are described below. The following are embodiments of obtaining a functional seal by using fasteners. In some embodiments, the fasteners are overmolded with their own seal geometry. Examples of such fasteners are shown at602and606ofFIG.6. As shown in the example ofFIG.7, fastener702, which includes a bolt that goes from the interior to the exterior of the enclosure, is overmolded at704with its own seal and is bolted into place. As shown in the example ofFIG.8, in some embodiments, connector200has physical fasteners to bolt the connector plate into place on either side of the bulkhead passthrough to create a solid seal, while still being able to pass electrical power and information signal back and forth across the metal barrier (e.g., via the power connectors204and206and port206. In some embodiments, the plate200includes two power connectors (e.g., connectors202and204) and a central signal connector (e.g., port206), which are all integrated into a single part or component. In this example, with the one single connector plate described herein and gasket, a seal is made to the face of the sub-module, where various connections into/out of the sub-module are made through the connector plate200. The following are further details regarding embodiments of a fastening architecture. In some embodiments, the fastening architecture of the electromechanical connector200ensures that an effective seal is produced at all locations where the submodule container/enclosure has an opening (e.g., at holes308-314as shown in the example ofFIG.3). In the example ofFIG.2D, compression limiters214-220are shown. In the example ofFIG.9, a portion of plate200is shown. In some embodiments, a compression limiter is insert molded into the opening in the plate at902(and similarly at904in this example). In some embodiments, the compression limiter is configured to provide a level of interference. In some embodiments, as shown in the example ofFIG.10, when fastening bolt1002is put into place, the compression limiter provides a known set separation distance between the bottom face of the nut1004and the front face of the plate200(the face of the plate that faces away from the enclosure) so that the plastic of the plate is not simply squeezed. In some embodiments, the limiter provides a hard stop. In this way, the torque that is applied is transmitted to a fastened feature. In some embodiments, bolt1002is integrated into the module100through one or more fastening processes including, but not limited to, resistance welding, clinching, stir-welding, or tack welding. In some embodiments, the compression limiter is press fit rather than insert-molded. This reduces the number of components included during the molding process. While in some embodiments the compression limiter is press fit rather than insert-molded, a seal may still be provided. The following are further examples and embodiments of providing a seal and reducing leakage. FIG.11Aillustrates an embodiment of a portion of a sub-module. In this example, a cross section of a side view of a front face/terminal-side of a sub-module is shown. Connector plate200is shown in this example. In this example, prevention of leakage at the flange bolt702is shown. In some embodiments, there is a second bolt on the opposite side of the sub-module (not shown). A cross-section view of the interface for the seal is shown. A back component1102including the bolt is shown in this example. In some embodiments, the overmolded component is an M5 stud (e.g., stud/bolt702) that includes its own gasket overmold1104. In some embodiments, the gasket overmold uses the same geometry as the gasket overmold210of the connector plate200.FIG.11Billustrates an embodiment of a view of an overmolded back component. In some embodiments, when assembled (where the connector plate is fastened to the surface of the enclosure's face) in the orientation shown inFIG.11A, there is interference1110between the back component1102with the bolt and the surface of the metal enclosure. In some embodiments, there is deformation of the interference portion into a cavity space (e.g., cavity1108). In some embodiments, the deformation is structured and biased in terms of its orientation such that any pressure observed from within the enclosure attempting to leak out improves the pressure seal. In some embodiments, the deformation is structured and biased in terms of its orientation such that any exterior pressure observed from the environment attempting to leak into the enclosure improves the pressure seal. FIG.11Cillustrates an embodiment of a sealing fastener with a bolt. In this example, a view of back component1102with a bolt is shown. As described above, in some embodiments, the component1102is overmolded and integrates a bolt. As one example of manufacturing component1102, plastic1114is insert molded around bolt1116, where a gasket1118is then subsequently overmolded. In some embodiments, when fastening the connector plate to the enclosure (e.g., via the holes shown inFIG.3), component1102is then biased against the inside wall of the sub-module enclosure by screwing the nut onto the bolt. In some embodiments, the component1102is positively positioned based off of its geometry. In some embodiments, screwing the nut onto a bolt from one side of the enclosure as shown inFIG.11Asqueezes the connector plate200onto the enclosure (face surface1112as shown inFIG.11A). In the example ofFIG.11A, a cutaway view of a compression limiter is shown at1120. In various embodiments, the compression limiter serves multiple purposes. As one example, the compression limiter prevents the connector plate (which for example is constructed of plastic) from being squeezed. In some embodiments, the use of the compression limiter facilitates achieving an ideal tension on the bolt to maximize the fastening clamp of the sealing geometry, as well as prevent the bolt from unscrewing due to, for example, vibrations, an earthquake, etc. If there were only the plastic (without the compression limiter), while the correct torque may be reached when the bolt is tightened down, not all of the pressure may be being transferred into the bolt itself. Rather, the pressure would be transferred into compressing the plastic. As the plastic relaxes, the plate would lose that tension. Here, as shown in the example ofFIG.11A, the compression limiter lines up and overhangs the lip of the stud, so that when the stud is bolted down, the bolt head is effectively clamped onto the nut, providing a tight clamp and tension on this portion of the bolt for long term efficacy. In this example, the force is transmitted from the nut to the compression limiter1120to the wall of the enclosure (1112) to the head of the bolt, which in some embodiments are all metal parts. This accounts for any relaxation that may occur in the plastic of the connector plate200. As shown in the example ofFIG.11A, the nut1106pressing against the compression limiter provides the needed compression of the gasket to create a seal around that opening. As shown in this example, the bolts hold the connector plate on a sub-module level. In various embodiments, the bolt (or for example the remaining part of the bolt that sticks out or protrudes from the connector plate) may be used for various other purposes as well. For example, the bolts may provide posts by which to mechanically fasten submodules to each other (e.g., to a frame or rack for stacking submodules). As shown in this example, the bolts provide compression against the interior surface of the submodule can/enclosure. As shown in the example ofFIG.3, the can/enclosure of the sub module includes cutout holes308-314for the fasteners, as well as passthroughs for the electrical signal (e.g., pass through306) and for power (e.g.,302and304). In some embodiments, using the bolt/stud with back component as shown in the example ofFIGS.11A and11B, a large surface area is provided that ensures the bolt is perpendicular to the enclosure wall. In other embodiments, weld studs, clinch studs, or rivet studs are used. In some embodiments, the head diameter of the stud is optimized to reduce issues in maintaining plainarity or perpendicularity of the bolt to the surface of the enclosure. In some embodiments, the fastener head geometry is biased out of perpendicularity to the fastener axis to control fastener orientation during assembly. In some embodiments, and as shown in the example ofFIG.3, the plate has four fastening points to fasten to the corresponding holes in the bulkhead passthrough at the face of the submodule and seal that face of the submodule. Other numbers of fastening points may be implemented. An example of fastening at the outer fastening points (e.g., points308and314ofFIG.3) is shown in the example ofFIGS.11A and11B. A similar type of fastening is performed at the inner two fastening points (e.g., points312and310ofFIG.3). Further examples of inner fastening points are shown at1202and1204in the example ofFIG.12A. The fasteners at1202and1204provide additional force for fastening or clamping the connector plate200to the face of the sub-module enclosure. As shown in the example ofFIG.12A, the power (passed via power connectors202and204) is separated from the signal (via the pins of port206) with additional fastening features (1202and1204) sandwiched in between them, which facilitates maintaining seal efficacy over the long term. As shown in the example ofFIG.12A, a bolt or screw that goes internally into the enclosure is used, along with a blind nut. In some embodiments, the blind nut is insert-molded then overmolded with a gasket. An embodiment of the blind nut component attached to the interior surface of the enclosure is shown inFIG.12B. An example of a blind nut is shown at1206ofFIG.12C. In some embodiments, blind nut1206is placed into a tool, and after it is placed in the tool, it is insert molded within an outer part1208, where finally it is overmolded with a gasket1210.FIG.12Dillustrates an embodiment of a fastening feature. As shown in this example, hex bolt1212is screwed into the insert-molded blind nut1206. A cross section of the fastening is shown inFIG.12E. An example gasket geometry of a nut is shown at1214. In some embodiments, the fastening shown in the example ofFIG.12Ecreates a seal around the hole from the interior of the enclosure, preventing leakage out the enclosure. In some embodiments, the gasket on the blind nut component1216prevents a fluid flow path from the exterior of the submodule into the submodule. In some embodiments, seal1216is on one face of the connector plate, referred to herein as a “backside” of the connector plate, where the associated face touches the surface of the enclosure when fastened, and this face prevents a fluid flow path into the enclosure. For example,FIG.13illustrates an embodiment of a view of a connector plate. In this example, the “backside” of connector plate200is shown along with seal1216. In some embodiments, the gasket1216prevents leaks coming in from the outer face of the connector plate, past the compression limiter and the screw and along the face of the plate, through the power connector, and into the enclosure. Here, in this example, the gasket in the center region provides improved seal uniformly on this face. In some embodiments, reinforcements or additional metal components may be added to the connector plate for structural rigidity and to prevent material creepage over time. Multi-stage Molding of Connector Plate The electromechanical connector206(along with pins208) may be fairly intricate and complex to form along with the rest of the plate at the same time, as an entire, single assembly. In some embodiments, to ease the manufacturing process, the connector plate/module cap is generated in multiple phases or stages, in which the electromechanical connector is first produced (e.g., with the auxiliary pins), and then placed along the rest of the components of the plate (e.g., sheet metal for inserts for electrical bus connection) and molded together (where, for example, the resin is molded, along with other components, such as compression limiters and power terminals, over the electromechanical connector molded in a previous phase of the manufacturing process). Typically, fabricating components in multiple phases may result in additional issues with leakage paths and structural integrity, as there may be gaps where sub-components meet. This would result in issues with sealing. As will be described in further detail below, the design of the geometry of the electromechanical connector is designed in such a way that upon completion of the multi-stage molding process, the overall plate will have the sealing characteristics of a plate that had been molded in a single piece. FIGS.14A-14Dillustrates an embodiment of a plate with electromechanical connector. An alternative geometry of a plate such as that shown inFIG.2is shown in this example. As shown in this example, the plate includes components similar to that as shown inFIG.2, such as including multiple power terminals (e.g., power terminal1402ofFIG.14A), gasket (e.g., gasket1404ofFIG.14D), etc. In some embodiments, the gasket is molded. In various embodiments, the plate is made out of a variety of materials. For example, thermo-set or reaction set polymers may be used. Thermoplastics may also be used in some embodiments. As one example, a thermos-set or reaction injection molded polymer such as LSR (Liquid Silicone Rubber) is used. In some embodiments, the polymer used is cross-linked or vulcanized. Other types of polymers may be used as appropriate. Ceramics such as graphite may also be used as a gasket material. FIGS.15A-15Eillustrate views of an embodiment of an electromechanical connector. As shown in these examples, the electromechanical connector (1502) includes various details and features. As described above, in some embodiments, the electromechanical connector is created first, and then molded along with other components (e.g., pins, power terminals, compression limiters, etc.) to form the plate or end cap. As the plate is generated in multiple stages, the electromechanical connector is designed in a manner such that when it is molded over by the polymer for the plate, a mechanical interlock is formed, along with generation of a fluid seal. For example, in order to encourage the formation of such a mechanical interlock, the electromechanical connector is designed with a flange (1504). In some embodiments, in order to encourage a seal, the flange is further tapered. In the example ofFIG.15E, the flange tapers downward. The tapering of the flange allows for the edges to effectively melt during the subsequent stage of the molding process with the resin that fully surrounds the electromechanical connector. When the electromechanical connector is molded, it is designed to be held by the pins and the rest of the geometry on the top and the bottom (e.g., resin that molds over the flange area) so that when the rest of the assembly is created around the electromechanical connector, a seal is formed based off of the tapered edges of the flange portion of the electromechanical connector melting in preferred locations (e.g., along the edges of the taper) and adhering in its full perimeter to the rest of the assembly that is molded around it. FIG.16Aillustrates an embodiment of a cross-section of a connector plate. In this example, a cross-section of electromechanical connector1604is shown within the overall connector plate1602. While for purposes of clarity, the electromechanical connector and remaining assembly are visually distinguished from each other in the example ofFIG.16A, subsequent to the actual molding process, they may be indistinguishable (e.g., after melting).FIG.16Billustrates a top-down view of the cross section shown inFIG.16A. As shown in this example, the electromechanical includes a tapered flange, such as that shown at1612and1614, which interface with the resin that is molded over the electromechanical connector. While the boundaries of the flange are visually delineated in this example, when fabricated, the edges of the flange will have melted or fused with the surrounding polymer, in which case the edges of the flange and the surrounding polymer may be indistinguishable from each other. In some embodiments, the mating location between the two polymers may be indistinguishable from an insert or tool parting line. FIG.16Cillustrates an embodiment of a portion of the connector plate. In this example,FIG.16Cillustrates the interface between the electromechanical connector and surrounding resin (applied at a subsequent stage around the electromechanical connector) shown at1612ofFIG.16B. While the flanged geometry provides a physical interlock with the resin that is molded over it, as shown in this example, in order to avoid cracks or gaps (which would be potential leakage paths) between the electromechanical connector and resin molded over the electromechanical connector, the flange is tapered such that it melts or fuses with the resin during the molding process, such that there are no unwelded faces where plastics meet, and it is indistinguishable between the tapered edge of the flange and the surrounding resin subsequent to the molding process. Rather, a single piece of polymer is formed. In some embodiments, the electromechanical connector is formed first using an insert molding process, where the polymer for the connector is molded over metal components such as the pins. At a next stage, to form an intermediate connector plate, the additional polymer is molded, in a hybrid insert/overmolded process, over the molded electromechanical connector, along with other mechanical connectors, such as the power terminals and compression limiters (where in this example the plastic over the plate is molded over a combination of another molded component and also metal components). In some embodiments, the gasket is then overmolded onto the connector plate (that includes the electromechanical connector) to form a final connector plate. As described above, during this phase, in which the plastic of the plate is molded over the molded electromechanical connector (molded in a previous phase), the tapered edges of the molded electromechanical connector melt and fuse with the plastic that is being molded over it. By facilitating this full perimeter weld via melting, this allows, along with the gasket, maintaining of a seal for the entire overall connector plate. In this way, an isolation is created for a battery module from the internal environment of the module and the external environment that is outside of the module. The following is an embodiment of a process for manufacturing a module connector plate. FIGS.17A-17Cillustrate an embodiment of a process for molding an electromechanical connector. The process starts with the pins such as pin1702. In this example, there are four pins. Other numbers of pins may be used, as appropriate. The four pins are placed into a tool. Polymer is molded over the four pins to create the molded electromechanical connector (1704), and which is also shown in the examples ofFIG.17BandFIG.17C. As shown in the example ofFIG.17C, which illustrates an embodiment of a perspective view of the molded electromechanical connector ofFIG.17B, the electromechanical connector is end to end, allowing two plugs of the same type to plug into the electromechanical connector and terminate to one another. Molding the electromechanical connector separately from the rest of the overall connector allows for the complex geometry of the connector, as well as the control and positioning of the pins to be more easily manufactured, as compared to having to mold everything at once with the other components of the connector plate. For example, in some embodiments, the electromechanical connector includes a retention lock on its backside to prevent the plug from coming out (e.g., during shipping, handling, an earthquake, etc.). The backside retention lock, and the feature that locks underneath it may have a narrow separation. Manufacturing such a geometry may already be difficult for injection molding. For example, molding the electromechanical connector on its own may already be challenging. Attempting to do so while also injection molding the rest of the connector plate may be impractical for some tools. For example, attempting to mold everything at once may result in a high risk of pitting holes, as well as other deficiencies or difficulties. In embodiments of the manufacturing process described herein, the electromechanical connector is separately molded first, where the electromechanical connector is designed in a manner such that when it is combined with other materials in a later stage of the processing, mechanical interlocking and fusing are provided that results in strength and sealing as if the overall connector plate had been created in a single pass. For example, as will be described in further detail below, components such as the electromechanical connector are designed such that when they are overmolded with resin in a latter stage of the manufacturing process, weld lines are fused together, and any gaps between the different parts that are being molded together (which may include plastic-on-plastic molding) are minimized. In some embodiments, the output of the multi-stage manufacturing process described herein is an end cap that has the properties of having been molded in a single pass, such as high structural integrity and sealing. FIGS.18A-18Billustrate embodiments of a process for manufacturing a connector plate over a set of components and a molded electromechanical connector. In this phase of manufacturing the connector plate, which is subsequent to the molding of the electromechanical connector, the molded electromechanical connector is placed in a tool along with other components, such as compression limiters (1802,1804,1806, and1808) and power terminals (1810and1812), as shown in the examples ofFIGS.18A and18B.FIG.18Billustrates an embodiment of an orientation of placement of the components in the tool. In some embodiments, after the tool closes, injection molding is performed to mold resin over the components shown inFIGS.18A and18B. This results in the molded connector plate shown in the examples ofFIGS.19A and19B. As described above, the electromechanical connector may have a complex geometry that would make it difficult to be properly created if molded in one piece along with the other components of the module connector plate. Instead, in some embodiments, the plate is manufactured in multiple, individual steps, as described above. The final connector plate, which is constructed from combining multiple pieces together, in multiple layers, must maintain a high seal. Using the design described herein, a tight seal may be created, even during a multi-stage molding process. For example, using the tapered flange described herein, the interface where the molded electrical connector meets the resin of the connector plate is eliminated by the melting of the tapered edge with the resin that is molded over the electromechanical connector. In this way, gaps are minimized, and leak paths are reduced. Further details regarding how the tapered flange facilitates the fusing of the molded electromechanical connector to the surrounding resin are described below.FIG.20Aillustrates an embodiment of a portion of a connector plate. Shown in the example ofFIG.20Aare divot2020and divot2022. During the molding of the plate around the electromechanical connector, resin is injected at those points (the divots may be included for cosmetic process, so that during the injection molding process, in which the injection mold tool injects into the center of the divot, when the tool pulls apart, the vestigial portion that is left behind does not protrude above the surface). This results in two mold fronts, which approach the electromechanical connector from two sides. During this stage of the molding process, this results in two molten plastic fronts spreading outward from the two ports and approaching the electromechanical connector from either side, melting the flanges as they approach each other, and causing them to weld to one another. Here, while the injected plastic is still molten, the two weld fronts come together, melting the flange and fusing the flange with the injected polymer into a single, solid piece. With the fusing, a seal is created to prevent any fluid leakage. The tapering of the edges of the flange facilitates the fusing described above. In some embodiments, because the electromechanical connector is not heated in the tool, any melting of the edges of the flange would have to rely on the heating caused by the weld fronts. Without the taper, the edges of the flange may be more difficult to melt due to the thermal mass of the flange, resulting in unwelded faces where plastics meet. FIGS.20B-20Cillustrate an embodiment of injection molding. In this example, plastic is being molded over components such as the molded electromechanical connector (2024), power terminals (2026and2028), and compression limiters (2030,2032,2034,2036). In the example ofFIG.20B, resin is injected at points2020and2022. As it is injected, the resin, which is heated, spreads out from the injection points. In the example ofFIG.20B, the spreading of the fronts towards the electromechanical connector is shown. As shown in the example ofFIG.20C, as the weld fronts expand, the portions of the weld fronts meeting the tapered edge of the flange melt the plastic of the edges of the flange. If the edge were not tapered, because of the thermal mass of the connector, this may not guarantee fully melting of the entire perimeter of the electromechanical connector's flange during the molding process, making it difficult to ensure that there is a completely hermetic bond between the existing connector and the molding process itself. There would be a higher likelihood that unwelded faces where plastics meet would result, translating to a higher chance of a potential leak path. The tapered flange described herein increases the likelihood of a hermetic seal and reduces the chance of unwelded faces where plastics meet that are leakage paths. For example, as shown in the example ofFIG.20C, the injected polymer molds over the flange of the electromechanical connector, from both ends. The two molding fronts meet in the center of the plate as they continue to fill out. Where the two fronts fill out over the flange, this area is fairly well heated as there is a significant amount of residual heat from the initial injection molding, where the polymer is fully melted. That heat melts the flange, where because the flange is tapered, there is less thermal mass due to the thinness. With less thermal mass at the tapered perimeter of the flange, there is less specific heat capacity for that flange to absorb heat without melting. The tapered perimeter of the flange then defaults to melting away and fusing with the injected polymer. In some embodiments, the polymers of the electromechanical connector and the overmold are matching polymers to promote fusion/bonding. In other embodiments, the polymers are different or mismatched, but selected such that the polymers mix well when heated, to allow for the creation of strong fusing/bonding. Thus, the flange of the electromechanical connector described herein facilitates mechanical interlock of the electromechanical connector with the resin that is molded around it. The tapering of the flange further facilitates fusing of the perimeter of the electrical connector with the resin surrounding it, ensuring a hermetic seal. The tapering of the edge of the flange enhances and improves the likelihood of the fusing. As shown throughout, the tapered flange provides multiple functions. One function is to physically hold the electromechanical connector in place within the plate and the surrounding polymer that is injected around the electromechanical connector. A second function is to create a hermetic seal, which is provided via the tapering of the flange, as described above. Perforated Flange with Pass-Through Openings In some embodiments, the electromechanical connector includes perforations or holes.FIGS.21A and21Billustrate an embodiment of an electromechanical connector including holes.FIG.21Aillustrates one face of the electromechanical connector, andFIG.21Billustrates the opposite face of the electromechanical connector. As shown in these examples, holes (2102-2116) are added to the flange of the electromechanical connector. In some embodiments, the holes pass through the electromechanical connector (as shown inFIG.21B). The use of such holes provides for improved mechanical interlock between the plastic overmold and the molded electromechanical connector (over which the overmolded plastic is injected). For example, the overmolded plastic fills through the holes of the flange, further locking the electromechanical connector to the surrounding overmolded polymer from both faces of the flange. In addition to improving mechanical interlock, the cooling process within the injection molding tool also causes the overmolded plastic to shrink down over whatever portion of the flange that did not melt. For example, the overmold will shrink tightly on the holes. Thus, even if there were some areas of the flange that did not melt, there is the added benefit of mechanical compression from the contraction of the outer overmold, onto the plastic around the holes on the molded electromechanical connector. In this way, the holes through the flange facilitate creating physical retention of the electromechanical connector to the overmolded resin. In addition to improved mechanical interlock, the use of holes improves the ability for the polymer of the existing mechanical interlock to melt. Similar to the tapering described above, the use of the holes thins out the perimeter of the flange, where taking out material to form the holes reduces the thermal mass in those areas, which improves the ease with which the fusing/bonding occurs at those holes as well. While circular pass-through openings are shown in the examples ofFIGS.21A and21B, holes or slots of other sizes and shapes within the flange may be used, as appropriate. In some embodiments, the holes are chamfered, as shown in the example ofFIG.21C. The chamfering (2118) of a hole effectively adds a thinning process to the hole, similarly to the tapering of the flange described above. For example, the hole may be chamfered to a point to allow for as much thinning as possible to promote fusion of the chamfered material to the overmolded polymer. The tapered holes allow for mechanical interlocking between the material, and where the holes are chamfered and thinnest, a full perimeter seal is promoted as well, as the overmolded plastic melts through the hole. In some embodiments, the perforations described above are similarly applied to other portions of the connector, such as the power terminals, as shown in the examples ofFIGS.22A and22B. As shown in the examples ofFIGS.22A and22B, the sheet metal for the power terminals is also perforated with pass-through openings (e.g., openings2202-2214). This creates an improved seal with the polymer that is overmolded over the metal power terminals, reducing leaks due to higher pressure. While there may not be fusing (because of the two different types of materials, for example), the pass through still allows improved mechanical interlock. Further, the cooling described above allows contraction of the overmolded plastic over the holes through the sheet metal, further improving the mechanical interlock. Without the passthrough holes, the overmold plastic may instead contract away from the surface and perimeter of the terminals, resulting in a higher likelihood of leakage paths. Here, the introduction of the pass-through holes allows the creation of posts or columns of overmolded plastic through the sheet metal during the injection molding process. During cooling, the columns contract, where the contraction inside each of those columns creates compression down on the surface of the sheet metal. While circular pass-through holes are shown in these examples, the geometry of the pass-through holes may be a variety of shapes, as appropriate. Electromechanical Connector Pins The following are embodiments of the pins of the electromechanical connector.FIG.23Aillustrates an embodiment of a pin. The pin ofFIG.23Ais an example of one of the four pins shown at208ofFIG.2A.FIG.23Billustrates an embodiment of a pin. In this example, a profile view of the pin within the electromechanical connector housing is shown. In the examples ofFIGS.23A and23B, a pin (2302) inside the electromechanical connector housing is shown. In this example, the pin has mechanically interlocking features that are designed for the overmolding process (during the phase to create the electromechanical connector), such that the pin does not move after it has been molded inside of the electromechanical connector housing. This ensures that during plug mates or de-mates, a user does not accidentally push the pin in one direction or another. As one example of creating the mechanically interlocking features, the outer surface of the pin is turned down or grooved to create retention grooves on the outer surface of the pin. The retention grooves are one example mechanism of providing the interlocking described above. As shown in the examples ofFIGS.23A and23B, the retention grooves (e.g., groove2304) on the pin add a tortuous geometry that makes it difficult for leaking to occur. In some embodiments, the pin is fabricated to include one or more pass-through holes. Similar to as described above with respect to the embodiment of the tapered flange of the electromechanical connector housing including holes, including a hole in the pin allows a column of polymer to pass through the pin, further interlocking the pin with the surrounding polymer of the electromechanical connector housing. In some embodiments, the hole through the pin is generated by punching through a square wire using a bladed chisel, resulting in creation of an “eye” or retention hole/perforation that provides the ability for the pin to be fully retained by the polymer of the electromechanical connector housing (as the polymer is molded over the pin, the polymer will fill in and pass through the hole(s) of the pin). Various square wire geometries may be used in which an eyehole is opened. Various types of wires may be used. The pins may be square or round. The pin may also be generated when stamping out the square wire. Using such a pin with a mechanically interlocking feature such as an eyehole, an interlocking column of polymer through the pin may be created with the overmolded polymer of the electromechanical connector housing flowing through the channel formed by the retention hole in the pin. When the connector housing cools, this column further constricts, generating a tighter seal around the pin, facilitating long term interlocking. Using the pin described herein, physical interlocking of the pin with the electromechanical connector housing is provided, along with an improved seal to prevent leakage. Bolt Embodiments Described above are embodiments of using a bolt with a blind nut. Described herein are alternative embodiments of bolts used in conjunction with the connector plate.FIG.24Aillustrates an embodiment of a sealing bolt assembly. In some embodiments, the sealing bolt assembly ofFIG.24Arequires less manufacturing processing than the bolt/blind nut described above. In this example of the bolt (where the threads of the bolt are not shown), the gasket (2402) is moved away from the clearance hole. FIG.24Billustrate an embodiment of a sealing bolt assembly. In this example, the bolts point from the inside of the module out. The module face (on which the connector plate is connected) is shown at2412. The self-sealing bolt (2404) is designed to prevent pressure from one side of the module to give cause for any fluid to cross the boundary defined by the faces of the enclosure. In this example, with the orientation of the bolt facing outward, the O-ring or gasket is positioned away from the shaft diameter, as shown in the example ofFIG.24A. In this example, an M5 bolt assembly is shown. Other size bolts may be used with the techniques described herein. In some embodiments, the gasket is designed so as to prevent exterior pressure from forcing fluids into the enclosure. In some embodiments, the gasket is designed so as to prevent internal pressure from forcing fluids out of the enclosure. In some embodiments, the gasket is designed to prevent fluids from going either into or out of the enclosure. FIG.24Cillustrates an embodiment of a self-sealing bolt assembly. In this example, when external pressure is coming towards the bolt, the O-ring is pushed outwards against the outside edge of the gasket groove. This makes the seal stronger. That is, the higher the pressure from outside the module, the stronger the seal becomes, because the O-ring (2406) is pushed outwards against the outer diameter (2408) of the gasket groove. In this way, air is prevented from entering into the module. In contrast, if the O-ring were on the inner diameter of the gasket groove, and up against the shaft, as is typical in off-the-shelf bolts, the higher pressure would cause the O-ring to deform up against the shaft, resulting in a fluid leakage path into the module. The use of such a self-sealing assembly allows the bolt to be pointed from inside the module outwards, while having a seal interface that prevents pressure from outside the module entering into the module. Embodiments of an electromechanical connector include a plate, a gasket that is overmolded over the plate, at least one power connector molded into the plate, and a plurality of pins molded into the plate. In some embodiments, the plate is insert molded around the at least one power connector and the pins. In some embodiments, the gasket is overmolded. In some embodiments, when the plate is installed on a submodule (e.g., bulkhead passthrough of a submodule enclosure that encapsulates a set of battery cells), the gasket provides a seal. Power, signal, and current (e.g., balancing current) may be passed through the connector plate that includes the overmolded gasket seal. Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, the invention is not limited to the details provided. There are many alternative ways of implementing the invention. The disclosed embodiments are illustrative and not restrictive. | 61,174 |
11862895 | DETAILED DESCRIPTION The electrical plug of the present invention is capable of carrying electronic or light signal. More particularly, as shown in the embodiments inFIGS.2A and2B, one end of the electrical plug900is coupled to the signal cable800, wherein the electrical plug900is capable of electrically connecting to and fixing to corresponding sockets (not shown). As shown in the embodiments inFIGS.2A and2B, the electrical plug900includes a body100and a retention device200. The body100includes a first casing110and a second casing120. The second casing120is pivotally connected, e.g. by a pivot123, to one side of the first casing110and is capable of rotating to make one of its ends away from one end of the first casing110. The first casing110and the second casing120can form a body inner space together to accommodate electronic circuits and elements, etc. The retention device200connects to the end of the first casing110opposite to the second casing120. At least a portion of the retention device200is capable of rotating along the same direction as the second casing120rotates. Specifically, as shown in the embodiments inFIGS.2A and2B, the first casing110includes a first A end111and a first B end112disposed on opposite ends. The body100is capable of inserting into a socket with the first A end111facing the socket. The second casing120is capable of rotating to make one end of the second casing120away from the first B end112. The retention device200is capable of fixing the body100to the socket when the body100is inserted into the socket. Fixing the body100to a socket by the retention device200is not described since it is a well-known technique. More particularly, as shown in the embodiments inFIGS.2A to3B, the second casing120includes a second A end121and a second B end122disposed on opposite ends. The second casing120is disposed in one side of the first casing110with the second A end121pivotally connected to the first casing110. The second casing120is capable of rotating with the second A end121as a pivot to make the second B end122selectively adjacent to or away from the first B end112. Viewing it from a different perspective, as shown in the embodiments inFIGS.2A to3B, the first casing110and the second casing120are long objects extend along the X-axis and respectively have a top opening and a bottom opening. The second casing120is pivotally connected to the upper edge of the first casing110by the second A end121, hence the second B end122is capable of rotating along a plane parallel to the X-Z plane. As shown in the embodiments inFIGS.2A and2B, the second casing120rotates to make the second B end122adjacent to the first B end112, i.e. the first casing110and the second casing120form a body inner space together. On the other hand, as shown in the embodiments inFIGS.3A and3B, the second casing120rotates to make the second B end122away from the first B end112, i.e. the first casing110and the second casing120are opened with an angle θ1to expose the interior of the body100. After then, as shown in the embodiments inFIGS.4A and4B, while the second casing120rotates further, since at least a portion of the retention device200is capable of rotating along the same direction as the second casing120rotates, the second B end122can continue to move away from the first B end112and makes the first casing110and the second casing120be opened with an angle θ2. More particularly, as shown in the embodiments inFIGS.3A to4B, the retention device200includes a latch210and a deformation part220. The latch210includes a connecting end211and an extending end212disposed on opposite ends. The connecting end211connects to the first A end111. The extending end212extends toward the second A end121. The deformation part220is disposed on the extending end212, which is the end of the latch210extending toward the second A end121. The deformation part220is capable of rotating along the same direction as the second casing120rotates. In this embodiment, the deformation part220includes a bending piece pivotally connected to the extending end212. The bending piece is capable of rotating along the same direction as the second casing120rotates. The deformation part220is pivotally connected to the extending end212by pivots230, for example. Accordingly, when the second casing120rotates to make one end of the second casing120away from the first B end112, the retention device200can rotate to increase the angle the second casing120is capable of rotating, exposing the interior of the body100to a greater extent. Therefore, a user can accomplish work (such as wire matching) inside the body100more conveniently and hence the electrical plug is more convenient to use. For a better interworking between the retention device200and the second casing120to increase the angle the second casing120is capable of rotating, for example, the distance between the second A end121and the second B end122is ½ to ⅔ of the distance between the first A end111and the first B end112. In other words, the length of the second casing120is about ½ to ⅔ of the length of the first casing110. Viewing it from a different perspective, the distance between the vertical projection of the second A end121on the first casing110and the second B end112is ½ to ⅔ of the distance between the first A end111and the first B end112. On the other hand, as shown in the embodiments inFIG.5A, a concave124is disposed on one side of the second casing120facing the retention device200. As described above, the retention device200is capable of fixing the body100to the socket when the body100is inserted into the socket. To release the body100from the socket, as shown in the embodiments inFIGS.5A and5B, the user can press down on the retention device200and makes the latch210close to the first casing110, i.e. makes the extending end212move toward the first casing110. At this time, at least a portion of the retention device200is capable of being accommodated in the concave124. In other words, the concave124may reduce the limitation set by the second casing120on the retention device200when it is pressed down, to makes the latch210closer to the first casing110. Although the preferred embodiments of the present invention have been described herein, the above description is merely illustrative. Further modification of the invention herein disclosed will occur to those skilled in the respective arts and all such modifications are deemed to be within the scope of the invention as defined by the appended claims. | 6,521 |
11862896 | Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the present invention. The apparatus and method components have been represented where appropriate by conventional symbols in the drawings, showing only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the disclosure with details that will be readily apparent to those of ordinary skill in the art having the benefit of the description herein. DETAILED DESCRIPTION Turning to the figures, reference numeral10generally identifies an example mobile device capable of performing a number of functions such as, for example, scanning items including barcodes or labels, capturing images, receiving and/or processing electronic payments, obtaining measurements, and any number of additional functions. The device10may be provided in a number of varying form factors, models, arrangements, or SKUs depending on the desired application and/or use, but may still retain the same overall shape and size across these different arrangements. Further, the device10may be modified to be used in varying environments where any number of accessory devices may be implemented. As a non-limiting example, the accessory device or devices may be any number of a charging cradle, a payment module, a trigger handle, a dimensioning module, a heads-up display, a hand strap and/or other securement feature. Other examples are possible. These different accessory devices may have different electrical requirements for transmitting signals, data and/or power, and as such, to accommodate the use of the device10with varying accessory devices, the device10includes an input/output (I/O) interface in the form of a connector assembly20operably and removably coupled with the mobile device10. The connector assembly20(as well as any additional connector assemblies described herein) may be coupled with the desired mobile device10model or arrangement as needed. The connector assembly20includes a bottom plate22in the form of a body operably coupled with the mobile device10, a connector region30operably coupled with the bottom plate22, any number of alignment members40operably coupled with the bottom plate22, and a towel bar50operably coupled with the bottom plate22. Briefly, the mobile device10includes a front end11, a back end12, and a sidewall13extending between the front and back ends11,12. In some examples, the bottom plate22is dimensioned to frictionally engage the mobile device10(e.g., via a snap-fit connection). More specifically, the bottom plate22may include outer ends24and a lower end26dimensioned to be placed over and frictionally engage the sidewall13of the mobile device10. Other examples of suitable coupling mechanisms are possible. As previously noted, the connector region30is operably coupled with the bottom plate22. More specifically, as illustrated inFIGS.4and5, the connector region30may be disposed on the lower end26of the bottom plate22. In some examples, the connector region30is flush-mounted with the lower end26of the bottom plate22, and as such, the connector region30does not protrude outwardly therefrom. In other examples, the connector region30may be recessed relative to the lower end26of the bottom plate22. The connector region30is configurable in any number of different arrangements where any number of charging pads or electrical connectors32may be implemented thereon. Generally, the connector region30is arranged to provide an electrical coupling between a desired accessory device and the mobile device10, and may be configured in a multitude of arrangements. More specifically, the electrical connectors32may provide charging power to the mobile device10. In the illustrated example ofFIGS.4and5, the connector region30includes two electrical connectors32. However, in other examples, the connector region30may include no electrical connectors or any other number of electrical connectors32as desired. In some examples, the electrical connectors32may be in the form of pogo pins that are coupled with a circuit board of the mobile device10via a surface-mount technology (SMT) whereby a flex board electrically connects the circuit board with the electrical connectors32. However, other examples of suitable electrical connectors32are possible. Depending on the number of electrical connectors32needed to electrically connect the desired accessory device with the mobile device10, the electrical connectors32may be selectively removed from or coupled with the connector region30. These electrical connectors32may be coupled with the connector region30via a frictional connection, a snap-fit connection, a fastener or fasteners, and the like. Other examples of coupling mechanisms are possible. In some examples, a cover may be provided to cover or block off areas of the connector region30that are not occupied by an electrical connector32. The connector region30may further include at least one data port34operably coupled with the mobile device10to allow the accessory devices to transmit data to and/or receive data from the mobile device10. In some examples, the data port34is in the form of a USB-c connector, but in other examples, different connectors may be used. It is appreciated that the data port34may also be capable of providing charging power to the mobile device10and/or may be capable of providing power to the accessory device coupled thereto. The connector assembly20additionally includes any number of locking regions35disposed along the outer ends24of the bottom plate22. The locking regions35are in the form of an elongated groove or channel extending in a longitudinal direction having a proximal end35aand a distal end35b. An engagement member36is positioned at the distal end35bof the locking region35. In some examples, the engagement member36includes a protrusion extending inwardly into the channel. In other words, in these examples, the protrusion may be of a greater depth than the remainder of the channel. So configured, an accessory device having a corresponding notch or tab (not illustrated) may be inserted into the locking region35to couple the accessory device with the bottom plate22(and thus the mobile device10), while restricting relative movement therebetween until a sufficient urging force is exerted to remove the notch or tab from the engagement member36. As previously noted, the connector assembly20further includes at least one alignment member40operably coupled with the lower end26of the bottom plate22. In the illustrated example, two alignment members40are provided that are positioned adjacent to the connector region30on opposite ends thereof, but in other examples, any number of alignment members40may be provided on the bottom plate22. Generally, the alignment members40are provided to align any electrical connectors and/or data ports disposed on the accessory device such as, for example, a cradle with the electrical connectors32and/or data ports34of the connector region30. In the illustrated examples, the alignment members40are in the form of recesses42extending inwardly into the lower end26of the bottom plate22having a generally rectangular prismatic or cylindrical shape. Other examples are possible. Notably, the alignment members40do not include an undercut region to further retain the accessory device. Rather, the recess42is shaped to receive a corresponding protrusion formed on the accessory device and form a friction fit therewith while permitting relative axial movement therebetween. The sidewalls of the recess42includes a sidewall surface that is uninterrupted or continuous such that it is arranged to prevent relative, non-axial movement between the connector assembly20(and thus, the mobile device10) and the accessory device. In other words, in the illustrated examples, the recess42is free of additional depressions, notches, and/or catches, thus the recess42may be used primarily for alignment of the device10and the desired accessory (e.g., the electrical connectors32). Advantageously, by incorporating accessory devices in the form of protruding posts, such posts may protect the electrical connectors32from side impact that may potentially bend or otherwise damage the electrical connectors32. Further, the recess42may prevent reverse insertion of the device10into the accessory device (e.g., a charging cradle) by having a non-symmetrical shape. Such reverse insertion of the device10into the accessory may potentially damage the device10and/or the electrical connectors32. Notably, the locking regions35include an undercut region to help secure the accessory to the device10. So configured, the alignment members40may cooperate with the locking regions35to securely retain and align the accessory device relative to the mobile device. As previously noted, the connector assembly20may be provided in a number of different arrangements or configurations. For example, depending on the desired accessory device, different bottom plates22may be coupled with the mobile device10. More specifically, in a first arrangement, a bottom plate22may be provided having a connector region30including any number of electrical connectors32and no data ports. In a second arrangement, a bottom plate22may be provided having a connector region30including a data port34and no electrical connectors. In a third arrangement, a bottom plate22may be provided having a connector region30including any number of electrical connectors32as well as a data port34. In any of these arrangements, the locking region35may be provided as desired. Accordingly, instead of selectively removing electrical connectors from the connector region as needed to accommodate different accessory devices, a user may simply replace the first bottom plate22with a second bottom plate to accommodate a different accessory device. The connector assembly20may further include a towel bar50coupled with the bottom plate22to provide additional engagement with accessory devices. Generally, the towel bar50has a body52in the form of a quadrilateral cross section that defines a first engaging surface52aand a second engaging surface52b. The body52extends outwardly from and across the bottom plate22to define an opening53therebetween. More specifically, in the illustrated example, the bottom plate22further includes a recessed region28across which the body52of the towel bar50extends. As best illustrated inFIGS.6,7, and11, in some examples, the towel bar50may further include any number of locking ledges54positioned between the first engaging surface52aof the body52and the recessed region28. In the illustrated example, the locking ledge or ledges54define a first engaging surface54aand a second engaging surface54bpositioned adjacent to the first engaging surface54a. In the illustrated example, the first engaging surface54aof the locking ledge54extends along a plane that is generally parallel to the first engaging surface52aof the body52, but in other examples, the first engaging surface54aof the locking ledge54may not extend along a plane that is generally parallel to the first engaging surface52aof the body52. Further, in the illustrated example, the first engaging surface54aof the locking ledge54is recessed relative to the first engaging surface52aof the body52, but in other examples, the first engaging surface52a,54amay be coplanar. Other examples are possible. As previously noted, the towel bar50may be used to couple various accessory devices with the connector assembly20(and thus the mobile device10). For example, as illustrated inFIG.6, a first example accessory80in the form of a hand strap or neck lanyard is provided that may be inserted through the opening53and wrapped around the body52of the towel bar50. In this arrangement, the hand strap may engage the first and second engaging surface52a,52bof the body52to be retained. Though not illustrated, the hand strap80may include any number of fasteners or securement features to close the loop in order to be securely retained with the towel bar50. With reference toFIG.7, a second example accessory180is provided in the form of a hand strap or neck lanyard181coupled with a quick-release buckle182to selectively couple with the towel bar50and the back plate22. The quick-release buckle182may be partially or entirely constructed from a resilient material capable of selectively being urged inwardly. More specifically, the quick-release buckle182includes a base184and two resilient arms186extending therefrom. Each of the resilient arms186includes a first end186a(coupled with the base184) and a second end184bhaving a coupling portion187. In the illustrated example, the coupling portions187are in the form of outwardly-facing hooks having a curved or angled upper surface187a. Further, the quick-release buckle182includes an opening188to receive the hand strap181. As illustrated inFIG.7, to secure the quick-release buckle182with the bottom plate22of the connector assembly20(and thus the mobile device10), the second end186bof each of the resilient arms186are positioned near the opening53and the recess28formed in the bottom plate22. In this orientation, the curved upper surface187aof the coupling portion187abuts against a lower surface of the locking ledge54. Upon urging the quick-release buckle182into the opening53, the curved upper surface187aof the coupling portion187slides against the lower surface of the locking ledge54, and the resilient arms186are urged inwards. Upon the coupling portion187clearing the second engaging surface54bof the locking ledge54, the resilient arms186move outwardly to their original configuration, whereby the coupling portions187engage and couple with the first engaging surface54a(and/or the second engaging surface54b) of the respective locking ledge54to retain the quick-release buckle182and prevent the quick-release buckle182from being pulled out of the opening53. When it is desired to remove the quick-release buckle182, a user may grasp and squeeze the sides of the resilient arms186inwardly, thus decoupling the coupling portions187from the locking ledge54. The user may then pull the quick-release buckle182out of the opening53. With reference toFIG.8, a third example accessory280is provided in the form of an alternative quick-release buckle282capable of selectively coupling with the bottom plate22. The quick-release buckle282includes a body284, a first arm285, a second arm286, and an opening287formed therebetween. The first arm285includes a tab or protrusion288. During operation, the towel bar50is positioned within the opening287such that the second arm286is disposed through the opening. The tab or protrusion288may then engage the towel bar50and operate as a catch to prevent the towel bar50from being removed from the opening287. With reference toFIG.9, a fourth example accessory380is provided in the form of an alternative quick-release buckle382capable of selectively coupling with the bottom plate22. The quick-release buckle382includes a body384and an arm385coupled with the body384at a first end385athereof and further including a second end385band a recessed region386. Further, the quick-release buckle382may include an opening388to receive a hand strap381. During operation, the second end385bof the arm385is positioned adjacent to the towel bar50, and the quick-release buckle382is urged into the opening53. The towel bar50then urges the arm385downwards until being positioned within the recessed region386, which serves to retain and to prevent the towel bar50from being decoupled from the quick-release buckle382. The arm385may be urged away from the towel bar50to remove the quick-release buckle382from the opening53. With reference toFIGS.10and11, a fifth example accessory480in the form of a cradle482capable of engaging the connector region30and, in some examples, to electrically couple with the mobile device10. In this example, the cradle482includes an engaging arm484operably coupled with a cradle wall485(seeFIG.11). It is appreciated that the cradle482may include any number of additional features such as, for example, a coil490disposed within a solenoid bracket and operably coupled with a solenoid spring, and the like. The engaging arm484may be configured to move along with the cradle wall485in a direction away from the towel bar50during coupling of the cradle482with the mobile device10. Upon clearing the towel bar50, the engaging arm484may return to its resting configuration whereby the engaging arm484engages and/or abuts the first engaging surface52aof the body52of the towel bar50to prevent relative motion between the mobile device10and the cradle482. In this configuration, a portion of the engaging arm484may be disposed within the recessed region28formed on the bottom plate22. Further, in some examples, the engaging arm484may additionally include a protrusion disposed at an end thereof to further engage the second engaging surface52bof the body52of the towel bar50and/or the first or second engaging surfaces54a,54bof the locking ledges. In the foregoing specification, specific embodiments have been described. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the invention as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of present teachings. Additionally, the described embodiments/examples/implementations should not be interpreted as mutually exclusive, and should instead be understood as potentially combinable if such combinations are permissive in any way. In other words, any feature disclosed in any of the aforementioned embodiments/examples/implementations may be included in any of the other aforementioned embodiments/examples/implementations. The benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential features or elements of any or all the claims. The invention is defined solely by the appended claims including any amendments made during the pendency of this application and all equivalents of those claims as issued. Moreover, in this document, relational terms such as first and second, top and bottom, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms “comprises,” “comprising,” “has”, “having,” “includes”, “including,” “contains”, “containing” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises, has, includes, contains a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by “comprises . . . a”, “has . . . a”, “includes . . . a”, “contains . . . a” does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises, has, includes, contains the element. The terms “a” and “an” are defined as one or more unless explicitly stated otherwise herein. The terms “substantially”, “essentially”, “approximately”, “about” or any other version thereof, are defined as being close to as understood by one of ordinary skill in the art, and in one non-limiting embodiment the term is defined to be within 10%, in another embodiment within 5%, in another embodiment within 1% and in another embodiment within 0.5%. The term “coupled” as used herein is defined as connected, although not necessarily directly and not necessarily mechanically. A device or structure that is “configured” in a certain way is configured in at least that way, but may also be configured in ways that are not listed. It will be appreciated that some embodiments may be comprised of one or more generic or specialized processors (or “processing devices”) such as microprocessors, digital signal processors, customized processors and field programmable gate arrays (FPGAs) and unique stored program instructions (including both software and firmware) that control the one or more processors to implement, in conjunction with certain non-processor circuits, some, most, or all of the functions of the method and/or apparatus described herein. Alternatively, some or all functions could be implemented by a state machine that has no stored program instructions, or in one or more application specific integrated circuits (ASICs), in which each function or some combinations of certain of the functions are implemented as custom logic. Of course, a combination of the two approaches could be used. Moreover, an embodiment can be implemented as a computer-readable storage medium having computer readable code stored thereon for programming a computer (e.g., comprising a processor) to perform a method as described and claimed herein. Examples of such computer-readable storage mediums include, but are not limited to, a hard disk, a CD-ROM, an optical storage device, a magnetic storage device, a ROM (Read Only Memory), a PROM (Programmable Read Only Memory), an EPROM (Erasable Programmable Read Only Memory), an EEPROM (Electrically Erasable Programmable Read Only Memory) and a Flash memory. Further, it is expected that one of ordinary skill, notwithstanding possibly significant effort and many design choices motivated by, for example, available time, current technology, and economic considerations, when guided by the concepts and principles disclosed herein will be readily capable of generating such software instructions and programs and ICs with minimal experimentation. The Abstract of the Disclosure is provided to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in various embodiments for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separately claimed subject matter. | 23,145 |
11862897 | DETAILED DESCRIPTION The following describes the implementation mode of the disclosure through specific embodiments, and those skilled in the art can easily understand the other advantages and effects of the invention from the contents disclosed in the description. The disclosure can also be implemented or applied by different embodiments, and various details in the specification can also be modified or changed based on different views and application systems without departing from the purpose of the invention. It should be noted that the embodiments and features in the embodiments in the invention can be combined with each other in case of no conflict. The following is a detailed description of the embodiments of the invention with reference to the drawings, so that those skilled in the art to which the invention belongs can easily implement it. The invention can be embodied in a variety of different forms, and is not limited to the embodiments described herein. In order to clearly explain the embodiments, devices irrelevant to the description are omitted, and the same reference symbols are assigned to the same or similar constituent elements in the entire specification. In the entire specification, when a device is described to be “connected” with another device, it includes not only the case of “direct connection”, but also the case of “indirect connection” where other components are placed between them. In addition, when a device “includes” certain constituent elements, as long as there is no record to the contrary, it does not exclude other constituent elements, it means that it can also include other constituent elements. When a device is described to be “above” another device, it can be directly on the other device, but it can also be accompanied by other devices in between. In contrast, when a device is “directly” on another device, it is not accompanied by other devices in between. Although the terms “first”, “second”, and such words are used herein to describe various elements in some examples, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, the first interface and the second interface etc. Furthermore, as used herein, the singular forms “one”, “a” and “the” are intended to include the plural, unless the context indicates otherwise. It should be further understood that the terms “comprise” and “include” indicate the existence of the described features, steps, operations, elements, components, items, categories, and/or groups, but do not exclude the existence, presence, or addition of one or more other features, steps, operations, elements, components, items, categories, and/or groups. The terms “or” and “and/or” as used herein are interpreted to be inclusive or to mean any one or any combination thereof. Therefore, “A, B or C” or “A, B and/or C” means “any of the following: A; B; C; A and B; A and C; B and C; A, B and C”. Exceptions to this definition occur only when combinations of components, functions, steps, or operations are inherently mutually exclusive in some ways. The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the invention. The singular form used here also includes the plural form, as long as the statement does not clearly express the opposite meaning. The meaning of “including” used in the specification is to specify the unique characteristics, regions, integers, steps, operations, elements and/or components, not to exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and/or components. The terms “under”, “over” and other relative spaces term may be used in order to illustrate more easily the direction relationship of one device to another illustrated in the drawings. The terms are, not only in the sense referred to in the drawings, but also in other senses or operations of the device in use. For example, if the device in the drawings is turned over, a device that was illustrated as being “under” another device is illustrated as being “over” another device. Thus, the exemplary term “under” includes both above and below. Devices can be rotated by 90° or other angles and the terms representing relative space are interpreted accordingly. Although it is not defined differently, all terms, including technical terms and scientific terms used herein, have the same meaning as is generally understood by those skilled in the art to which the present invention belongs. Terms defined in commonly used dictionaries are additionally interpreted as having a meaning consistent with the content of the relevant technical literature and current understanding, and can't be over-interpreted in a desirable or very formulaic sense, provided that they are not defined. The first embodiment of the invention is described below with reference to the drawings. As shown inFIGS.1and2, the connector of the invention comprises the first pluggable unit1and the second pluggable unit2; the end of the first pluggable unit1is provided with two terminal pins11, the end of the second pluggable unit2is provided with two terminal sockets21, the end of the first pluggable unit1is also provided with an error-proof protrusion part12, and the end of the second pluggable unit2is also provided with an error-proof concave part22. Specifically, two terminal pins11and two terminal sockets21can be operatively connected in a corresponding manner. For example, a conductive connection of the positive and negative poles is formed. The other end of the two terminal pins11can be respectively connected with the positive or negative wires (not shown in the figure), and the other end of the two terminal sockets21can be respectively connected with the positive or negative wires (not shown in the figure). In some embodiments, the end of the first pluggable unit1can also be provided with two first through-hole13, and the terminal pin11is set in the first through-hole13. The end of the second pluggable unit2can also be provided with two second through-hole23, and the terminal socket21is set in the second through-hole23. The first through-hole13and the second through-hole23can be operatively connected in a corresponding manner, so that the terminal pin and socket can be isolated from the external environment. The positive or negative wires (not shown in the figure) are respectively connected to the two terminal pins11through the two first through-hole13, the positive or negative wires (not shown in the figure) are respectively connected to two terminal sockets21through two second through-holes23. The error-proof concave part22and the error-proof protrusion part12can be operatively connected in a corresponding manner to prevent incorrect insertion of the first pluggable unit1and the second pluggable unit2. The error-proof protrusion part12is a uniaxially symmetric outline on the plane intersecting with the insertion direction, such as the T-outline inFIG.1, to prevent abnormal insertion when the positive and negative connections are reversed, the error-proof protrusion part12and the error-proof concave part22can be clearance fit to prevent the error-proof protrusion part12and the error-proof concave part22from being inserted too tightly and not easily separated. As shown inFIG.4, the end of the first pluggable unit1is provided with a first pluggable unit groove14. As shown inFIG.5, the end of the second pluggable unit2is provided with a second pluggable unit groove24. Specifically, on the plane intersecting with the insertion direction, the inner wall outline of the first pluggable unit groove14is the same as the outer wall outline of bottom part of the error-proof protrusion part12, so that the error-proof protrusion part12can be inserted into the first pluggable unit groove14to be fixed in the groove. The inner wall outline of the second pluggable unit groove24is approximately the same as the outer wall contour of the error-proof concave part22, so that the error-proof concave part22can be inserted into the second pluggable unit groove24to be fixed in the groove. The inner wall outline of the error-proof concave part22is roughly the same as the outer wall outline of the error-proof protrusion part12, so that the error-proof protrusion part12can be inserted into the error-proof concave part22and cannot be rotated. The error-proof protrusion part12and the first pluggable unit groove14can be detachable connected in an interference fit manner to ensure that the error-proof protrusion part12is not easily loosened, and the error-proof concave part22and the second pluggable unit groove24can also be detachable connected in an interference fit manner to ensure that the error-proof concave part22is not easily loosened. However, it can be understood that the number of terminal pins11and terminal sockets21, and corresponding first through-holes13and second through-holes23, can be either two or more or any other number. Different levels of aircrafts have different battery power levels. In order to connect the corresponding batteries in series, it can replace the error-proof heads of different battery connectors (i.e., the error-proof protrusion part12and the error-proof concave part22) to ensure error proofing. That is, for different product models, it can replace the error-proof protrusion part12and the error-proof concave part22corresponding to the products to achieve the error proofing effect of connectors of different products. However, it can be understood that, the error-proof protrusion part12corresponding to the product and the part connecting to the error-proof concave part22and the groove (the first pluggable unit groove14or the second pluggable unit groove24) should be designed to be consistent, so that the error-proof protrusion part12and the error-proof concave part22can be inserted into the corresponding groove. In addition, the error-proof protrusion part12is not limited to be installed on the first pluggable unit1, and the error-proof concave part22is not limited to be installed on the second pluggable unit2. The embodiments of the invention can be error-proofed by replacing the error-proof heads of different connectors (i.e., error-proof protrusion part12and error-proof concave part22). The same first pluggable unit1and second pluggable unit2(excluding error-proof head) can be used to perform error proofing of connectors in combination with the corresponding error-proof heads (i.e., error-proof protrusion part12and error-proof concave part22). For different products, it is not necessary to have different tooling, so that the tooling cost is greatly reduced. In some embodiments, the first pluggable unit groove14or the second pluggable unit groove24is an equilateral polygon on the plane intersecting with the insertion direction. For example, it is an equilateral pentagon. At the same time, the outer wall outline of bottom part of the error-proof protrusion part12and the outer wall outline of bottom part of the error-proof concave part22are also equilateral pentagons matching with the groove. Specifically, the circumferential angle corresponding to each line of the equilateral pentagon is 72 degrees, and the error-proof protrusion part12or the error-proof concave part22can rotate every 72 degrees, which can be five series plugs to prevent incorrect insertion. By analogy, an equilateral hexagon can be used to be six series plugs to prevent incorrect insertion. However, it can be understood that the first pluggable unit groove14or the second pluggable unit groove24can also be of other outlines. In some embodiments, as shown inFIGS.4and5, the outlines of the two first through-holes13on the plane intersecting with the insertion direction are respectively circular and square, and the corresponding outlines of the two second through-holes23on the plane intersecting with the insertion direction are also circular and square. And the corresponding contours of the first pluggable unit1and the second pluggable unit2are also circular and square, respectively. This setting can also play a role in error proofing. In some embodiments, as shown inFIG.3, the first pluggable unit1comprises a plug upper housing15and a plug lower housing16, and the second pluggable unit2comprises a socket upper housing25and a socket lower housing26; The plug upper housing15and the plug lower housing16can be detachably connected with each other, the socket upper housing25and the socket lower housing26can be detachably connected, the terminal pin11is set between the plug upper housing15and the plug lower housing16, and the terminal socket21is set between the socket upper housing25and the socket lower housing26. Both the first pluggable unit1and the second pluggable unit2are designed as detachable structures, which facilitate the replacement of terminals to meet the aircraft's requirements for connector weight under different working conditions of large and small current. The plug upper housing15and the plug lower housing16can be connected by pressing the lock catch to make the plug anti loose and easy to pull out, and can also be connected by fasteners such as screws. Similarly, the socket upper housing25and the socket lower housing26can be connected by pressing the lock catch or by fasteners such as screws, which are not specifically limited here. In some embodiments, the surface of the plug is provided with an anti-skid groove, which is convenient for holding the plug for pulling. In addition, positive and negative signs can be designed on the surface of the plug to facilitate prompt users. The second embodiment of the present invention relates to an aircraft. The aircraft in this embodiment comprises the above connectors. The connectors in this embodiment perform error proofing by replacing the error-proof heads of different connectors (i.e., error-proof protrusion part12and error-proof concave part22). The same first pluggable unit1and second pluggable unit2(excluding error-proof head) can be used to perform error proofing of connectors in combination with the corresponding error-proof heads (i.e., error-proof protrusion part12and error-proof concave part22). For different products, it is not necessary to have different tooling, so that the tooling cost is greatly reduced. The above embodiments are merely illustrative of the principles of the present invention and its effects, which is not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the purpose and the scope of the present invention. Accordingly, all equivalent modifications or alterations made by persons having ordinary knowledge in the art, without departing from the purpose and technical ideas disclosed in the present invention, shall still be covered by the claims of the present invention. | 14,951 |
11862898 | DETAILED DESCRIPTION Exemplary embodiments will be described in detail here, examples of which are shown in drawings. When referring to the drawings below, unless otherwise indicated, same numerals in different drawings represent the same or similar elements. The examples described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of devices and methods consistent with some aspects of the application as detailed in the appended claims. The terminology used in this application is only for the purpose of describing particular embodiments, and is not intended to limit this application. The singular forms “a”, “said”, and “the” used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should be understood that the terms “first”, “second” and similar words used in the specification and claims of this application do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, “an” or “a” and other similar words do not mean a quantity limit, but mean that there is at least one; “multiple” or “a plurality of” means two or more than two. Unless otherwise noted, “front”, “rear”, “lower” and/or “upper” and similar words are for ease of description only and are not limited to one location or one spatial orientation. Similar words such as “include” or “comprise” mean that elements or objects appear before “include” or “comprise” cover elements or objects listed after “include” or “comprise” and their equivalents, and do not exclude other elements or objects. The term “a plurality of” mentioned in the present disclosure includes two or more. Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other. First Embodiment Referring toFIGS.1and2, a first embodiment of the present disclosure discloses a backplane connector assembly which includes a first backplane connector100, a second backplane connector200for mating with the first backplane connector100, a first circuit board301mounted with the first backplane connector100, and a second circuit board302mounted with the second backplane connector200. In the illustrated embodiment of the present disclosure, the first backplane connector100and the second backplane connector200are mated in an orthogonal manner. The first circuit board301is perpendicular to the second circuit board302. Referring toFIGS.3and4, the first backplane connector100includes a first header1, a plurality of first wafers2assembled to the first header1, a first spacer3fixed at a rear end of the plurality of first wafers2, and a first mounting block4mounted at a bottom end of the plurality of first wafers2. The second backplane connector200includes a second header5, a plurality of second wafers6assembled to the second header5, a second spacer7holding on one side of the plurality of second wafers6, and a second mounting block8holding the other side of the plurality of second wafers6. Referring toFIGS.5and6, each second wafer6includes a second insulating frame61, a plurality of second conductive terminals62insert-molded with the second insulating frame61, a third metal shield63fixed on one side of the second insulating frame61, and a fourth metal shield64fixed on the other side of the second insulating frame61. Each second conductive terminals62includes a second contact portion621, second tail portion622, and a second connection portion623connecting the second contact portion621and the second tail portion622. Some of the second contact portions621are used to electrically connect with the first backplane connector100. The second tail portions622are used to be mounted to the second circuit board302. In the illustrated embodiment of the present disclosure, the second contact portion621is substantially perpendicular to the second tail portion622. The second connection portion623is of a curved configuration. Referring toFIG.7, each group of second conductive terminals62include a plurality of third ground terminals G3, a plurality of fourth ground terminals G4, and a plurality of second signal terminals S2. In the illustrated embodiment of the present disclosure, two adjacent second signal terminals S2form a pair of second differential signal terminals. Each pair of second differential signal terminals are located between one third ground terminal G3and one fourth ground terminal G4. That is, each group of second conductive terminals62are disposed in a manner of G3-S2-S2-G4, which is beneficial to improve the quality of signal transmission. The second differential signal terminals are narrow-side coupling or wide-side coupling. A width of the third ground terminal G3and a width of the fourth ground terminal G4are greater than a width of each second signal terminal S2therebetween, which is beneficial to increase the shielding area and improve the shielding effect. Referring toFIGS.8to10, each group of second wafers6further includes an insulating block65sleeved on the second contact portions621, and a shielding shell66sleeved on the insulating block65. Each insulating block65includes two through holes651into which the second contact portions621of the second signal terminals S2are inserted, and a mating surface652at an end thereof. In the illustrated embodiment of the present disclosure, the insulating block65is substantially cuboid shaped. Correspondingly, the shielding shell66is substantially cuboid shaped. The shielding shell66includes a first side wall661, a second side wall662, a third side wall663and a fourth side wall664. The first side wall661is opposite to the third side wall663. The second side wall662is opposite to the fourth side wall664. An area of the first side wall661and the third side wall663is larger than an area of the second side wall662and the fourth side wall664. The ends of the first side wall661, the second side wall662, the third side wall663and the fourth side wall664all include a deflection portion665which is bent inwardly. By providing the deflection portions665, a constricted portion can be formed at an end of the shielding shell66, so that outer surfaces6651of the deflection portions665can guide the second wafer6to be assembled to the second header5, and even guide the shielding shell66to be inserted into the shielding space27of the first backplane connector100. In addition, in order to better restrict the insulating block65, the second side wall662and the fourth side wall664further include restriction protrusions6621,6641formed by stamping the second side wall662and the fourth side wall664inwardly. The restriction protrusions6621,6641are used to mate with the insulating block65so as to prevent the insulating block65from being drawn out of the shielding shell66. Of course, in other embodiments, the restriction protrusions6621,6641can be provided on the first side wall661and the third side wall663so as to prevent the insulating block65from being drawn out of the shielding shell66. In the illustrated embodiment of the present disclosure, the shielding shell66further includes a first extension piece6611extending from the first side wall661and a pair of first slots6612located on opposite sides of the first extension piece6611. The shielding shell66further includes a second extension piece6631extending from the third side wall663and a pair of second slots6632located on opposite sides of the second extension piece6631. The first extension piece6611is in vertical contact with the second contact portion621of the third ground terminal G3so as to improve the shielding effect. The second extension piece6631is in vertical contact with the second contact portion621of the fourth ground terminal G4so as to improve the shielding effect. In the illustrated embodiment of the present disclosure, the first extension piece6611and the second extension piece6631are deflected outwardly and then extend, so that a distance between the first extension piece6611and the second extension piece6631on the same shielding shell66is greater than a distance between the first side wall661and the third side wall663. Referring toFIG.7, for a group of second conductive terminals62arranged in the manner of G3-S2-S2-G4, the second contact portion621of the third ground terminal G3includes a first notch6216adjacent to the second differential signal terminals. The first notch6216is used for receiving the first extension piece6611. The second contact portion621of the fourth ground terminal G4includes a second notch6217adjacent to the second differential signal terminals. The second notch6217is used for receiving the second extension piece6631. In the illustrated embodiment of the present disclosure, taking two adjacent pairs of second differential signal terminals sharing one fourth ground terminal G4as an example, two sides of the fourth ground terminal G4respectively include second notches6217facing different second differential signal terminals, and the second notches6217are used for mating with two adjacent shielding shells66. When the first backplane connector100is mated with the second backplane connector200, the first header1of the first backplane connector100is at least partially inserted into the second header5of the second backplane connector200. The shielding shells66of the second wafers6of the second backplane connector200are inserted into the first backplane connector100under the guidance of the deflection portions665. Second Embodiment Referring toFIGS.13and14, the second embodiment of the present disclosure also discloses another backplane connector assembly which includes the first backplane connector100shown inFIGS.1to12and another second backplane connector200′ mated with the first backplane connector100. The first backplane connector100is adapted for being mounted on the first circuit board301. The second backplane connector200′ is adapted for being mounted on the second circuit board302. Since the first backplane connector100has been described in detail in the first embodiment, it will not be described in detail in the second embodiment of the present disclosure, and its related structure will be directly quoted. Referring toFIGS.15to17, the second backplane connector200′ includes a housing21′, a plurality of second terminal modules22′ installed in the housing21′, a plurality of shielding shells23′ fixed to the second housing21′ and located outside corresponding second terminal modules22′, and a second mounting block24′ mounted to the housing21′. Referring toFIG.17, the housing21′ is made of insulating material and includes a base210′, a first side wall211′ extending upwardly from one side of the base210′, and a second side wall212′ extending upwardly from the other side of the base210′. The base210′, the first side wall211′ and the second side wall212′ jointly form a receiving space213′ for receiving a part of the first backplane connector100. In the illustrated embodiment of the present disclosure, the first side wall211′ and the second side wall212′ are parallel to each other and both are perpendicular to the base210′. In the illustrated embodiment of the present disclosure, the housing21′ further includes a plurality of insulating protrusions214′ integrally extending from the base210′. The plurality of insulating protrusions214′ are spaced apart from one another. The plurality of insulating protrusions214′ extend upwardly into the receiving space213′. The plurality of insulating protrusions214′ are disposed in multiple rows along a front-to-rear direction. The insulating protrusions214′ in two adjacent rows are disposed in a staggered manner, that is, the insulating protrusions214′ in the same position in two adjacent rows are not in alignment with each other in the front-to-rear direction. The base210′ includes a top surface2101′ exposed in the receiving space213′, a bottom surface2102′ opposite to the top surface2101′, two mounting protrusions2103′ respectively protruding downwardly from opposite sides of the bottom surface2102′, and a receiving groove2100′ located between the two mounting protrusions2103′. The receiving groove2100′ is adapted for receiving the second mounting block24′. Referring toFIGS.16and17, the base210′ includes a plurality of positioning grooves2104′ extending through the top surface2101′. In the illustrated embodiment of the present disclosure, each positioning groove2104′ is substantially U-shaped. The positioning groove2104′ is arranged around the corresponding insulating protrusion214′ and is used to install the corresponding shielding shell23′. In the illustrated embodiment of the present disclosure, each positioning groove2104′ also extends through the bottom surface2102′ so as to communicate with the receiving groove2100′. Referring toFIGS.18to24. In the illustrated embodiment of the present disclosure, the shielding shell23′ is formed by stamping, bending and riveting a metal plate. The shielding shell23′ includes a hollow portion231′, a mounting portion232′ extending downwardly from the hollow portion231′, and a plurality of mounting feet233′ extending downwardly from the mounting portion232′. The hollow portion231′ includes a first side wall2311′, a second side wall2312′, a third side wall2313′ and a fourth side wall2314′ which are connected in sequence. The first side wall2311′ is opposite to the third side wall2313′, and the second side wall2312′ is opposite to the fourth side wall2314′, thereby forming an enclosed shielding cavity. Of course, in other embodiments, the shielding cavity may also be of a non-enclosed type. For example, the hollow portion231′ includes a first side wall2311′, a second side wall2312′, and a third side wall2313′ which are connected in sequence, so that the hollow portion231′ is substantially U-shaped. In the illustrated embodiment of the present disclosure, areas of the first side wall2311′ and the third side wall2313′ are larger than areas of the second side wall2312′ and the fourth side wall2314′. Each end of the first side wall2311′, the second side wall2312′, the third side wall2313′ and the fourth side wall2314′ includes a deflection portion2315′ which is bent inwardly. The deflection portions2315′ are independent from one another so that they can be bent independently in order to avoid mutual interference. Each deflection portion2315′ has a guiding portion2315a′ on its outer surface. By providing the deflection portions2315′, a constricted opening can be formed at the end of the shielding shell23′. The guiding portion2315a′ can guide the deflection portions2315′ from being easily inserted into the first backplane connector100. In the illustrated embodiment of the present disclosure, the first side wall2311′ includes a first wall portion2311a′ and a second wall portion2311b′. The first wall portion2311a′ and the second wall portion2311b′ are fixed together by riveting. A riveting line2311c′ is formed at a junction of the first wall portion2311a′ and the second wall portion2311b′. In other embodiments of the present disclosure, it is also possible that only the ends of at least three of the first side wall2311′, the second side wall2312′, the third side wall2313′ and the fourth side wall2314′ which are connected to each other, are provided with the deflection portions2315′ bent inwardly. In the illustrated embodiment of the present disclosure, the mounting portion232′ is substantially U-shaped, and includes a base portion2320′, a first bending portion2321′ bent from one side of the base portion2320′, a second bending portion2322′ bent from the other side of the base portion2320′, a first tail portion2324′ extending downwardly from the first bending portion2321′, and a second tail portion2325′ extending downwardly from the second bending portion2322′. The base portion2320′ is coplanar with the third side wall2313′. The first bending portion2321′ and the second side wall2312′ are located on the same side. The first bending portion2321′ protrudes outwardly beyond the second side wall2312′. The second bending portion2322′ and the fourth side wall2314′ are located on the same side. The second bending portion2322′ protrudes outwardly beyond the fourth side wall2314′. The mounting portion232′ also includes a bottom retaining portion2326′ located at the base portion2320′. In the illustrated embodiment of the present disclosure, when the shielding shell23′ is not mounted to the insulating protrusion214′, the retaining portion2326′ and the base portion2320′ are located in the same plane. After the shielding shell23′ is installed to the insulating protrusion214′, the retaining portion2326′ is bent inwardly (that is, in a direction toward the first side wall2311′) so that the retaining portion2326′ is perpendicular to the base portion2320′. The retaining portion2326′ is located in the middle of the bottom edge of the base portion2320′. A plurality of first barbs2321a′ are further provided on the side of the first bending portion2321′ away from the third side wall2313′. A plurality of second barbs2322a′ are further provided on the side of the second bending portion2322′ away from the third side wall2313′. The first barbs2321a′ and the second barbs2322a′ both extend beyond the first side wall2311′ to be fixed in the housing21′. The first tail portion2324′ is provided with a first fisheye hole2324a′, so that the first tail portion2324′ has a certain degree of elasticity. Therefore, the first tail portion2324′ can be easily pressed into the conductive hole of the second circuit board302for achieving electrical conduction. The second tail portion2325′ is provided with a second fisheye hole2325a′, so that the second tail portion2325′ has a certain elasticity. Therefore, the second tail portion2325′ can be easily pressed into the conductive hole of the second circuit board302for achieving electrical conduction. In the illustrated embodiment of the present disclosure, the first tail portion2324′ and the second tail portion2325′ are arranged parallel to each other and are in alignment with each other along the left-to-right direction. Referring toFIG.24, each second terminal module22′ includes a first signal terminal221′, a second signal terminal222′, and an insulating block223′ fixed to the first signal terminal221′ and the second signal terminal222′. In an embodiment of the present disclosure, the first signal terminal221′ and the second signal terminal222′ are insert-molded with the insulating block223′. In an embodiment of the present disclosure, the first signal terminal221′ and the second signal terminal222′ form a pair of differential signal terminals. In the illustrated embodiment of the present disclosure, the first signal terminal221′ and the second signal terminal222′ are symmetrically arranged along a central axis of the insulating block223′. When assembling, firstly, the plurality of shielding shells23′ are sleeved on the insulating protrusions214′ along a top-to-bottom direction, so that the hollow portions231′ enclose the insulating protrusions214′. The U-shaped mounting portions232′ are inserted into the U-shaped positioning grooves2104′. The first tail portions2324′ and the second tail portions2325′ respectively extend beyond the bottom surface2102′ and are exposed in the receiving groove2100′. The mounting portions232′ are partially exposed in the receiving groove2100′ to increase the shielding length of the first signal terminal221′ and the second signal terminal222′. When the shielding shells23′ are installed in place, the first barbs2321a′ and the second barbs2322a′ will pierce the inner wall of the positioning grooves2104′ so as to improve the fixing force. Secondly, the second terminal modules22′ are inserted into the corresponding positioning grooves2104′ along a bottom-to-top direction. When the second terminal modules22′ are installed in place, top surfaces of the insulating blocks223′ press against bottom surfaces of partitions2145′ so as to achieve position restriction. Thirdly, the retaining portions2326′ are bent inwardly so that the retaining portions2326′ abut against the corresponding insulating blocks223′. With this arrangement, on the one hand, the shielding shells23′ can be prevented from escaping upwardly from the insulating protrusions214′, and on the other hand, the second terminal modules22′ can be prevented from being separated from the housing21′. Finally, the second mounting block24′ is installed in the receiving groove2100′ along the bottom-to-top direction. The first tail portions2324′ and the second tail portions2325′ of the shielding shell23′ extend through mounting holes243′ of the second mounting block24′ so as to be electrically connected to the second circuit board302. When the first backplane connector100is mated with the second backplane connector200′, the first housing1of the first backplane connector100is inserted into the receiving space213′ of the housing21′ of the second backplane connector200′. The hollow portions231′ of the second terminal modules22′ of the second backplane connector200′ are inserted into the first terminal modules2of the first backplane connector100under the guidance of the deflection portions2315′. The above embodiments are only used to illustrate the present disclosure and not to limit the technical solutions described in the present disclosure. The understanding of this specification should be based on those skilled in the art. Descriptions of directions, although they have been described in detail in the above-mentioned embodiments of the present disclosure, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the application, and all technical solutions and improvements that do not depart from the spirit and scope of the application should be covered by the claims of the application. | 22,134 |
11862899 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments or examples of the content of the present disclosure shown in the drawings are described using a specific language. It is to be understood that this is not intended to limit the scope of the present disclosure. Any variations or modifications of the described embodiments, as well as any further applications of the principles described herein, will normally occur to those skilled in the art. The reference numerals may be repeated in each embodiment, but even if the elements have the same reference numeral, the features in the embodiment are not necessarily used in another embodiment. It will be understood that the various elements, assemblies, regions, layers or sections may be described herein using the terms first, second, third, etc., however, these elements, assemblies, regions, layers or sections are not limited to these terms. These terms are only used to distinguish one element, assembly, region, layer or section from another element, assembly, region, layer or section. The first element, assembly, region, layer or section described below may be referred to as a second element, assembly, region, layer or section without departing from the teachings of the inventive concept of the present disclosure. The words used in the present disclosure are only used for the purpose of describing the specific exemplary embodiments and are not intended to limit the concept of the present disclosure. As used herein, “a” and “the” in singular are also used to contain plural, unless otherwise expressly indicated herein. It is to be understood that the word “include” used in the specification specifically indicates the existence of a feature, integer, step, operation, element or assembly which is described, but does not excludes the existence of one or more other features, integers, steps, operations, elements, assemblies or groups thereof. FIG.1is an assembled perspective schematic view of a circuit board, a connector assembly and a board-end connector.FIG.2is an exploded perspective schematic view of the connector assembly and the board-end connector ofFIG.1. Referring toFIG.1andFIG.2, the connector assembly2is inserted into the board-end connector3and is electrically connected to the circuit board1via the board-end connector3. FIG.3is an assembled perspective schematic view of the connector assembly ofFIG.2.FIG.4is a side plan schematic view of the connector assembly ofFIG.3.FIG.5is a plan schematic view of the connector assembly ofFIG.3viewed from inside to outside. Referring toFIG.3toFIG.5, the connector assembly2includes at least one wire-end connector and a housing42. The housing42is elongated and extends in a length direction D1and has a width in a width direction D2and a height in a height direction D3. In the present embodiment, the connector assembly2includes a first wire-end connector4A and a second wire-end connector4B. The first wire-end connector4A and the second wire-end connector4B are independent of each other and can be individually inserted into the board-end connector3ofFIG.2. In some embodiments, the housing42can be removed. In some embodiments, the connector assembly2includes one of the first wire-end connector4A and the second wire-end connector4B. Referring back toFIG.2, the housing42includes a guiding block receiving space420. When the connector assembly2is inserted into the board-end connector3in the height direction D3, a guiding block300of a plug housing30of the board-end connector3will guide the guiding block receiving space420of the housing42. FIG.6is an exploded perspective schematic view of the connector assembly ofFIG.3.FIG.7is an exploded perspective schematic view of the connector assembly ofFIG.6from another angle. Referring toFIG.6andFIG.7, the first wire-end connector4A and the second wire-end connector4B are arranged side by side and share one housing42. The housing42is configured to assemble the first wire-end connector4A and the second wire-end connector4B. The first wire-end connector4A includes a twin-ax cable40and a wafer44A. The twin-ax cable40is electrically connected to the wafer44A. The wafer44A is received in a first wafer receiving groove422of the housing42and is inserted into the board-end connector3and is electrically connected to the circuit board1. The second wire-end connector4B includes a twin-ax cable40and a wafer44B. The twin-ax cable40is electrically connected to the wafer44B. The wafer44B is received in a second wafer receiving groove424of the housing42and is inserted to the board-end connector3and is electrically connected to the circuit board1. In the present embodiment, a size of the wafer44B in the height direction D3is larger than a size of the wafer44A in the height direction D3. However, the present disclosure is not limited thereto. In some embodiments, the size of the wafer44B in the height direction D3is equal to the size of the wafer44A in the height direction D3. FIG.8is an assembled perspective schematic view of the wafer of the first wire-end connector ofFIG.3.FIG.9is an exploded perspective schematic view of the wafer ofFIG.8. Referring toFIG.8andFIG.9, the wafer44A includes a shield plate5, a terminal group6and a frame7. In the present embodiment, the shield plate5and the terminal group6are both positioned in the frame7. In some embodiments, the shield plate5and the terminal group6are both provided in the frame7by insert molding. The terminal group6is configured to be supported in the frame7and includes a plurality of signal terminal pairs66and a ground plate68. The ground plate68is configured to provide a ground terminal680on both sides of the signal terminal pair66in the length direction D1. Signal terminals of the signal terminal pair66and the ground terminal680each include a contact portion62. The contact portion62of the signal terminal and the contact portion62of the ground terminal680are electrically connected to terminals32of the board-end connector3(as shown inFIG.2). Thus, the ground plate68can reduce crosstalk between two adjacent signal terminal pairs66. In the present embodiment, the ground plate68is a single plate body. However, the present disclosure is not limited thereto. In some embodiments, the ground plate68may include a plurality of separate plate bodies. Each plate body provides two ground terminals in the length direction D1respectively on both sides of the corresponding signal terminal pair66. In the present disclosure, based on the wafer44A and wafer44B, a direction facing the twin-ax cable40is an inside direction, and a direction away from the twin-ax cable40is an outside direction. Elements included in the second wire-end connector4B are similar to the first wire-end connector4A, with a difference that the contact portion62of the terminal group6of the first wire-end connector4A faces the outside direction, while the contact portion62of the terminal group6of the second wire-end connector4B faces the inside direction. FIG.10is a plan schematic view of the first wire-end connector4A ofFIG.3from inside to outside.FIG.11is a cross-sectional plan schematic view of the first wire-end connector4A ofFIG.10taken along a line A-A. Referring toFIG.10andFIG.11, the shield plate5includes an opening50penetrating the shield plate5. The opening50is a closed hole. Specifically, the twin-ax cable40includes a pair of conductors402, a ground portion404and an insulative material406. The pair of conductors402are surrounded by the insulative material406and extend through the opening50of the shield plate5in the width direction D2and connect to the signal terminal pair66. The opening50, which is a closed hole, completely encircles the twin-ax cable40. Therefore, the opening50, which is a closed hole, can better reduce the electric field leakage caused by the twin-ax cable40. The shield plate5is provided near a connection location of the twin-ax cable40and the terminal group6and is positioned between the terminal group6and the twin-ax cable40. In the present embodiment, the opening50of the shield plate5is a completely closed hole to completely encircle the twin-ax cable40. However, the present disclosure is not limited thereto. In other embodiments, the opening50of the shield plate5may not be completely closed and thus partially encircle the twin-ax cable40, thereby reducing the electric field leakage caused by the twin-ax cable40. Referring back toFIG.9andFIG.11, in the present embodiment, the pair of conductors402respectively extend through frame apertures700of a recessed portion70of the frame7in the width direction D2and are respectively connected to a pair of conductor apertures64of the signal terminal pair66in the width direction D2. Thus, the pair of conductors402are electrically connected with the signal terminal pair66. Moreover, because of the recessed portion70of the frame7, the insulative material406of the twin-ax cable40can be closer to the terminal group6. In some embodiments, the frame7may not have the recessed portion70. With the structural configuration between the shield plate5, the twin-ax cable40and the terminal group6, the shield plate5can reduce the crosstalk between adjacent twin-ax cables40in addition to reducing the crosstalk between adjacent signal terminal pairs66. FIG.12is a cross-sectional plan schematic view of the first wire-end connector ofFIG.10taken along a line B-B. Referring toFIG.12, the ground portion404extends through the opening50of the shield plate5in the width direction D2and is connected to the ground plate68. In the present embodiment, the ground portion404is a drain wire, which extends through a frame ground aperture701of the recessed portion70of the frame7in the width direction D2(as shown inFIG.9), and is connected to a ground aperture65of the ground plate68in the width direction D2(as shown inFIG.9). Thus, the ground portion404is directly electrically connected with the ground plate68. In some embodiments, the ground portion404of the twin-ax cable40is not directly electrically connected with the ground plate68, but is directly connected to the shield plate5, and the shield plate5is connected to the ground plate68by a solder or fusion welding operation or by using a conductive adhesive. In some embodiments, the ground portion404of the twin-ax cable40is a metal shielding layer or two or more drain wires. FIG.13is a cross-sectional plan schematic view of the first wire-end connector ofFIG.10taken along a line C-C. Referring toFIG.13, the shield plate5is configured to cover the ground plate68in the width direction D2, and is connected to the ground plate68. Specifically, the shield plate5further includes a protrusion52. The protrusion52has a contact flat surface, the contact flat surface abuts the ground plate68. Thus, the shield plate5has the same ground reference point as the ground plate68. However, the present disclosure is not limited thereto. In some embodiments, the shield plate5and the ground plate68are connected by a solder or fusion welding operation or by using a conductive adhesive. FIG.14is an exploded perspective schematic view of another embodiment of the wire-end connector. Referring toFIG.14, the wire-end connector9is similar to the first wire-end connector4A ofFIG.3, with a difference that the wire-end connector9includes a wafer49. The wafer49includes a frame90and a terminal group94. The terminal group94includes a plurality of signal terminal pairs944and a ground plate930. The ground plate930includes at least one fixing hole940penetrating the ground plate930. The present embodiment includes three fixing holes940. Each signal terminal of the signal terminal pair944includes a fixing hole942penetrating the signal terminal. The frame90includes at least one ground plate fixed portion904and at least one terminal fixed portion906. The present embodiment includes three ground plate fixed portions904and four terminal fixed portions906. FIG.15is an assembled plan schematic view of the wire-end connector ofFIG.14viewed from outside to inside.FIG.16is a cross-sectional plan schematic view of the wire-end connector ofFIG.15taken along a line D-D. Referring toFIG.15andFIG.16, each ground plate fixed portion904of the frame90extends through the corresponding fixing hole940of the ground plate930in the width direction D2so as to be fixed in the fixing hole940. For example, in the insert molding process, a plastic that makes the frame body90flows through each fixing hole940of the ground plate930. After the plastic is cured, each ground plate fixed portion904includes a portion of the plastic formed in each fixing hole940. Similarly, each terminal fixed portion906of the frame90extends through each fixing hole942of the corresponding signal terminal pair944in the width direction D2so as to be fixed in the fixing hole942. For example, in the insert molding process, the plastic that makes the frame body90flows through each fixing hole942of the signal terminal. After the plastic is cured, each ground plate fixed portion904includes a portion of the plastic formed in each fixing hole940. Due to the engagement of the ground plate fixed portion904of the frame90with the fixing hole940and the engagement of the terminal fixed portion906with the fixing hole942, the structure of the wafer49is more stable. In some embodiments, the wafer49includes at least one of the fixing hole940and the fixing hole942, the frame90correspondingly includes at least one of the ground plate fixed portion904and the terminal fixed portion906. In some embodiments, the ground plate68, each signal terminal pair66and the frame7of at least one of the first wire-end connector4A and the second wire-end connector4B may be respectively replaced by the ground plate930, the signal terminal pair944and the frame90. While the present disclosure and advantages thereof are described in detail, it is understood that various changes, replacements and substitutions may be made without departing from the spirit and scope of the present disclosure defined by the appended claims. For example, many processes described above can be implemented in a variety of ways, and many processes described above can be replaced with other processes or combinations thereof. Further, the scope of the present disclosure is not limited to the specific embodiments of process, machinery, manufacturing, substance composition, means, method or step described in the specification. Those skilled in the art can understand from the disclosed contents of the present disclosure that existing or future developed process, machinery, manufacturing, substance composition, means, method or step which has the same function or achieve essentially the same result as the corresponding embodiment described herein can be used in accordance with the present disclosure. Accordingly, such a process, machinery, manufacturing, substance composition, mean, method or step is included in the technical solution of the present disclosure. | 15,012 |
11862900 | Embodiments of the present invention and their advantages are best understood by referring to the detailed description that follows. It should be appreciated that like reference numerals are used to identify like elements illustrated in one or more of the figures. DETAILED DESCRIPTION The detailed description set forth below is intended as a description of various configurations of the subject technology and is not intended to represent the only configurations in which the subject technology can be practiced. The appended drawings are incorporated herein and constitute a part of the detailed description. The detailed description includes specific details for the purpose of providing a thorough understanding of the subject technology. However, it will be clear and apparent to those skilled in the art that the subject technology is not limited to the specific details set forth herein and may be practiced using one or more embodiments. In one or more instances, structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject technology. One or more embodiments of the subject disclosure are illustrated by and/or described in connection with one or more figures and are set forth in the claims. In one or more embodiments, a low partial discharge high voltage connector (e.g., also referred to as a connector assembly) is provided that includes a hybrid electrical seal design configured to displace air from partial discharge sensitive regions of the connector to other regions of the connector where electrical flux is reduced (e.g., very low or at zero value). The seal and/or mating surface is convex shaped so that an initial contact of the seal and mating surfaces occurs at an initial contact region (e.g., an area of contact between the seal and mating surfaces) situated between the seal member's innermost layer and outermost layer. As compressible material of the seal member is compressed axially, the deformation of the compressible material progresses radially inward toward the innermost layer of the seal member and radially outward toward the outermost layer of the seal member away from the initial contact region. This geometry forces the inherent air to be pushed away from the central insulation region towards the innermost and outermost semi-conductive layers. The pushed air collects in regions within or beyond the semi-conductive sections of the seal member where the gradient of the electrical field is reduced, preventing partial discharge from occurring in the sealed and connectorized sections. Since the sealing starts between the seal's innermost layer and outermost layer as opposed to the innermost layer or the outermost layer, each sealing distance is roughly half that of a traditional sealing mechanism. This reduction in sealing distance dramatically reduces the amount of mating force required to evacuate air from high stress regions. That is, to prevent partial discharges from occurring in regions susceptible to localized dielectric breakdown, the connector must be mated with enough force to remove air from regions with high field gradient. General high-voltage connector designs in the current market that require low partial or micro discharges tend to require relatively large sealing diameters to compensate for the high electrical flux in a sealing region between a receptacle member and a plug member. Because the sealing region increases quadratically with the connector diameter, large connector designs face the challenging problem of maintaining reasonable sealing forces without sacrificing the ability to displace air from partial discharge sensitive regions of the connector. To significantly reduce the force required to completely displace air in the sealing region, a convex geometry is utilized. This convex geometry is applicable to connectors regardless of the seal member's material or its manufacturing method. While not exclusive to the following manufacturing methods, the seal member may be integrated as part of the connector body with an overmold design or as a standalone component to be captured mechanically and/or bonded either to become a receptacle or plug end of a connector. The annular ring where the seal member and the mating surface initially make contact is between or in the middle of the seal member's innermost layer and outermost layer. As the plug and receptacle of the connector assembly begins to engage, the seal compresses starting between the seal member's innermost layer and outermost layer, progressing radially inward toward the innermost layer of the seal member and radially outward toward the outermost layer of the seal member away from the initial contact region. This middle-out sealing design reduces the longitudinal distance required to fully mate the sealing region by a significant margin when compared to that of conical seals on similar high voltage, low discharge connector designs without sacrificing the effectiveness of the air removal mechanism. This, in turn, dramatically reduces the force required to get an equivalent compression along the sealing surface. Consequently, the effort to remove air from the sealed regions and the effectiveness of the seal's ability to squeeze air away from high electrical field sections are optimized. While the aforementioned middle-out sealing design is independently applicable to all high voltage connector designs, its effectiveness is amplified when used in conjunction with a hybrid semi-conductor seal member. The hybrid seal design is a multi-part seal comprising of alternating semi-conductive and insulative layers. While the insulative region acts as the portion to prevent electrical breakdown, the semi-conductive layers act as a protective barrier that prevents partial discharges that occur from gaseous pockets, cracks, voids, or inclusions by removing any and all electrical flux as in accordance with Gauss's flux theorem—charge is reduced in the void that is surrounded by conductor. Furthermore, the elimination of plasma formation or ionized air reduces the seeding of the avalanching behavior of dielectric breakdown, especially when seeding location occurs at a triple junction. The electrical circuit between the receptacle member and the plug member of the low partial discharge high voltage connector is completed by compressing the semi-conductive layer of the seal member to the mating surfaces of the plug member and the receptacle member. Once the air is displaced from the seal member's insulated surfaces and within or behind the semi-conductive layer and electrically conductive shell of the plug member and the receptacle member, the cavity provided by the plug member and/or the receptacle member, in which the seal member is disposed, will no longer produce partial discharge. Turning now to the drawings,FIG.1illustrates an assembled view of a low partial discharge high voltage connector assembly in accordance with embodiments of the disclosure. Low partial discharge high voltage connector assembly100comprises receptacle member102, plug member104, and a seal member106(seeFIGS.2-3and6-7), with cable assembly138being coupled to plug member104and conductive member118of receptacle member102being coupled to, for example, a power distribution unit, an electrical panel, a transformer, etc.FIG.2illustrates a cross-sectional view of a low partial discharge high voltage connector assembly100ofFIG.1, as seen along the lines of the section2-2taken therein, in accordance with embodiments of the disclosure. Low partial discharge high voltage connector assembly100comprises receptacle member102, plug member104, and seal member106. Seal member106is also illustrated separately in an isometric view ofFIG.3with a portion removed to reveal cross-sections of an innermost layer108, a middle layer110, and an outermost layer112. Innermost layer108is constructed of a semi-conductive material. In some embodiments, innermost layer108is overmolded by middle layer110constructed of an insulative material and middle layer110is then overmolded by outermost layer112constructed of a semi-conductive material, all in concentric annular rings. In some embodiments, innermost layer108, middle layer110, and outermost layer112are coextruded simultaneously. Innermost layer108, constructed of a semi-conductive material, acts as the first shielding layer to attenuate an electrical field on displaced air pockets that may be discharging had the material been made of non-conductive properties that do not maintain the same electrical potential as a conductive member of receptacle member102and a conductive member of plug member104. Middle layer110, constructed of an insulative material, prevents breakdown between innermost layer108and outermost layer112. Outermost layer112, constructed of a semi-conductive material, functions similarly to innermost layer108except that outmost layer maintains an electrical potential of an exterior conductive shell of receptacle member102and an exterior conductive shell of plug member104. Therefore, the hybrid construction of semi-conductive (innermost layer108), insulative (middle layer110), semi-conductive (outermost layer112) layers collectively provide a pliant interface to facilitate air being pushed middle-out. This configuration allows for a uniform radial e-field distribution along the entire length of low partial discharge high voltage connector assembly100unlike that of traditional connector designs using a fully insulative seal. By having innermost layer108and outermost layer112constructed of semi-conductive materials, overvoltages and ionization of surrounding gases may no longer occur due to Gauss's flux theorem. Receptacle member102, which is also illustrated separately in the cross-sectional view ofFIG.4, as seen along the lines of section2-2shown inFIG.1, comprises exterior conductive shell114, insulative layer116, conductive member118, and insulator120. Exterior conductive shell114, which is formed around insulative layer116, co-radially aligns with outermost layer112of seal member106to maintain a uniform and contiguous transition to prevent undesirable field enhancements. Insulative layer116, which is molded around conductive member118, aligns with middle layer110of seal member106and is complementary to middle layer110, in that, insulative layer116prevents breakdown between conductive member118and exterior conductive shell114. As illustrated, mating face122of insulative layer116mates with an adjacent mating face of middle layer110of seal member106. That is, receptacle member102provides a cavity162bounded by exterior conductive shell114, post124, mating face122of insulative layer116, and mating face136of insulative layer130of plug member104. Conductive member118aligns with innermost layer108of seal member106such that post124slides through the center of seal member106exposing tip126so that tip126electrically couples to a conductive socket member of plug member104thereby maintaining a continuous electrical field. Insulator120is constructed from a voidless insulation material, such as silicone rubber, polyurethane, or the like, and is overmolded around the end of conductive member118preventing electrical breakdown out of the end of receptacle member102. The exposed portion of conductive member118protruding through insulator120couples to, for example, a power distribution unit, an electrical panel, a transformer, etc. thereby providing continuity of electrical flow. Plug member104, which is illustrated separately in the cross-sectional view ofFIG.5, as seen along the lines of section2-2shown inFIG.1, comprises exterior conductive shell128, insulative layer130, conductor member132, and conductive socket pin134. Exterior conductive shell128, which is formed around insulative layer130, co-radially aligns with outermost layer112of seal member106to maintain a uniform and contiguous transition to prevent undesirable field enhancements. Insulative layer130, which is molded around conductor member132, aligns with middle layer110of seal member106as is complementary to middle layer110, in that, insulative layer130prevents breakdown between conductor member132and exterior conductive shell128. As illustrated, mating face136of insulative layer130mates with an adjacent mating face of middle layer110of seal member106. Conductive socket pin134is molded, embedded, or the like, within conductor member132, which preserves the uniform shape of conductive socket pin134. That is, conductor member132aligns with innermost layer108of seal member106to maintain a smooth electrical field. However, as tip126of conductive member118mates to conductive socket pin134, i.e., when tip126slides into an open end of conductive socket pin134as receptacle member102and plug member104are mated, any deformity that could possibly be caused by the mating of tip126into conductive socket pin134is preserved by conductor member132. Plug member104further comprises a cable assembly138comprising conductor140, inner semi-conductive layer142, insulative layer144, outer semi-conductive layer146, and braided mesh shield148. Cable assembly138extending to the right in the drawing may be coupled to a piece of electronic equipment. Conductor140is coupled to the other end of conductive socket pin134in a permanent manner, such as through crimping, soldering, or the like, thereby maintaining a continuous electrical field. Inner semi-conductive layer142is molded around conductor140and attenuates the electrical field of conductor140. Insulative layer144is molded around inner semi-conductive layer142and prevents breakdown between inner semi-conductive layer142and outer semi-conductive layer146. Outer semi-conductive layer146is molded around insulative layer144and maintains an electrical potential of cable assembly138. The transitional gap between cable assembly138and the outer portion of plug member104is comprised of a voidless insulation material150with braided mesh shield148embedded in voidless insulation material150. That is, gaps in braided mesh shield148allow the voidless insulation material150to embed within the gaps thereby bonding the braided mesh shield148and voidless insulation material150. Braided mesh shield148further bonded to exterior conductive shell128to increase the outer diameter of exterior conductive shell128thereby maximizing a creep distance from conductor140prior to losing the shielding benefits of outer semi-conductive layer146. When receptacle member102and plug member104are mated, seal member106is inserted into receptacle member102and coupling nut152rotates around the threads154of exterior conductive shell114of receptacle member102so as to fully mate receptacle member102to plug member104Coupling nut152rotates on threads154to be fully mated up when a catch156of coupling nut152meets stop158of plug member104. In accordance with the illustrative embodiments, the middle-out sealing design may be accomplished in different ways. In a first embodiment, the faces of middle layer110of seal member106, which mate with mating face122of insulative layer116of receptacle member102and mating face136of insulative layer130of plug member104, have a convex shape.FIG.6illustrates a cross-sectional view of a convex shape of mating face160of middle layer110of seal member106contacting a flat surface mating face136of insulative layer130of plug member104, as seen along the lines of section2-2shown inFIG.1, in accordance with embodiments of the disclosure. While not illustrated inFIG.6, a similar convex shape of middle layer110on an opposite side of seal member106contacts a flat surface mating face122of insulative layer116of receptacle member102. Therefore, by the convex shape of the mating face160contacting the flat surface mating face136and, similarly, by the convex shape of middle layer110on the opposite side of the seal member106contacting the flat surface mating face122, as the plug member104is mated to the receptacle member102, air is forced radially inward toward the innermost layer of the seal member106and post124of receptacle member102and radially outward toward the outermost layer of the seal member106and exterior conductive shell114away from the partial discharge sensitive regions (e.g., regions susceptible to localized dielectric breakdown where there is a voltage gradient across entrapped air or the area between the innermost layer108and the outermost layer112of seal member106). In a second embodiment, mating face122of insulative layer116of receptacle member102and mating face136of insulative layer130of plug member104, which mate with the faces of middle layer110of seal member106, have the convex shape.FIG.7illustrates a cross-sectional view of a convex shape of mating face137of insulative layer130of plug member104contacting a flat surface mating face163of middle layer110of seal member106, as seen along the lines of section2-2shown inFIG.1, in accordance with embodiments of the disclosure. While not illustrated inFIG.7, a similar convex shape of mating face122of insulative layer116of receptacle member102contacts a flat surface mating face of middle layer110on an opposite side of seal member106. Therefore, by the convex shape of the mating face137contacting the flat surface mating face163and, similarly, by the convex shape of mating face122contacting the flat surface mating face of middle layer110on the opposite side of the seal member106, as the plug member104is mated to the receptacle member102, air is forced radially inward toward the innermost layer of the seal member106and post124of receptacle member102and radially outward toward the outermost layer of the seal member106and exterior conductive shell114away from the partial discharge sensitive regions, i.e. regions susceptible to localized dielectric breakdown where there is a voltage gradient across entrapped air or the area between the innermost layer108and the outermost layer112of seal member106. In either embodiment, when the mating faces of seal member106initially mate with mating face122of insulative layer116of receptacle member102and mating face136of insulative layer130of plug member104, middle layer110compresses radially inward toward the innermost layer108of the seal member106and radially outward toward the outermost layer112of the seal member106away from the initial contact region. This middle-out sealing design reduces the longitudinal distance required to fully mate seal member106by a significant margin when compared to that of conical seals on similar high voltage, low discharge connector designs without sacrificing the effectiveness of the air removal mechanism. This, in turn, dramatically reduces the force required to get an equivalent compression along the sealing surface. Consequently, the effort to remove air from the sealed regions and the effectiveness of the seal's ability to squeeze air away from high electrical field sections are optimized. FIG.8illustrates a process800of forming a low partial discharge high voltage connector assembly in accordance with an embodiment of the disclosure. In block802, plug member104is mated to a receptacle member102such that seal member106is disposed in a cavity provided by plug member104and/or receptacle member102. In block804, in response to the mating, seal member106is compressed at an initial contact region between innermost layer108and outermost layer112of seal member106. In block806, in response to the compressing, air is forced radially inward toward the innermost layer108of the seal member106and radially outward toward the outermost layer112of the seal member106away from the initial contact region to reduce partial discharge associated with the connector. Where applicable, various embodiments provided by the present disclosure can be implemented using hardware, software, or combinations of hardware and software. Also, where applicable, the various hardware components and/or software components set forth herein can be combined into composite components comprising software, hardware, and/or both without departing from the spirit of the present disclosure. Where applicable, the various hardware components and/or software components set forth herein can be separated into sub-components comprising software, hardware, or both without departing from the spirit of the present disclosure. In addition, where applicable, it is contemplated that software components can be implemented as hardware components, and vice-versa. Software in accordance with the present disclosure, such as program code and/or data, can be stored on one or more computer readable mediums. It is also contemplated that software identified herein can be implemented using one or more general purpose or specific purpose computers and/or computer systems, networked and/or otherwise. Where applicable, the ordering of various steps described herein can be changed, combined into composite steps, and/or separated into sub-steps to provide features described herein. For example, in some embodiments, software controlled machines (e.g., 3D printers) may be used to manufacture seal member106and/or other components described herein. Embodiments described above illustrate but do not limit the invention. It should also be understood that numerous modifications and variations are possible in accordance with the principles of the present invention. Accordingly, the scope of the invention is defined only by the following claims. | 21,483 |
11862901 | Like reference numerals in different figures indicate like elements. DETAILED DESCRIPTION An example interposer includes an interconnect for transmitting signals between a source and a destination. For example, the interposer may include electrical conductors to transmit electrical signals between components of a test system. An example interposer includes coaxial cables, each of which is configured to transport a first portion of current originating from a current source. The example interposer also includes printed circuit boards (PCBs), each of which is connected to a set of the coaxial cables in order to receive the first portion of the current from each coaxial cable in the set and to transport a second portion of the current. A spring leaf assembly includes spring leaves, each which is connected to a PCB in order to transport a third portion of the current obtained from the PCB to a device interface board (DIB) that connects to devices under test (DUTs) to be tested by the test system. Inner and outer conductors of the coaxial cables on each PCB are arranged in parallel, the PCBs are arranged in parallel, and the spring leaves on each PCB may be arranged in parallel. In some implementations, two or more of the first portion of current, the second portion of current, or the third portion of current—for example, all three—are different. Implementations of the interposer may enable relatively high currents to be transmitted through the interposer at relatively low inductances and resistances. In this regard, inductance includes the tendency of an electrical conductor to oppose a change in current flowing therethrough. Resistance is a measure of the opposition to current flow through a conductor. It is therefore preferable to keep inductance and resistance values low. With regard to inductance, in some implementations, the current through the interposer is pulsed at least part of the time or all of the time. A pulsed current may include a rapid, transient change in amplitude from a baseline value such as “0” to a higher or lower value, followed by a rapid return to the baseline value. In some implementations, the current is periodic, for example. Reducing inductance reduces the opposition to changes in current such as these. Examples of high current include, but are not limited to, currents over 500 Amperes (A), over 1000 A, over 2000 A, over 3000 A, or more. Examples of low inductance include, but are not limited to 100 nanoHenries (nH) to 60 nH or less. Examples of low resistance include 10 milliohms (Ω) or less or 3 mΩ or less. Implementations of the interposer may be relatively small in terms of physical dimensions. For example, referring toFIG.6, the interposer may connect to low-inductance copper pads80on the DIB (or on a probe card, for example) on an area of the DIB (or probe card) within an area that is 2 inches (5.08 centimeters (cm)) by 3 inches (7.62 cm) or less. In an example, the interposer connects to the DIB within an area that is 1.5 inches (3.81 cm) by 2.5 inches (6.35 cm). The parallel conductors included in the interposer may enable such small sizes while maintaining relatively low resistance and inductance values even at relatively high currents. However, interposers having the features described herein are not limited to any particular dimensions or values of resistance, inductance, or current. FIGS.1to4shows an example implementation of an interposer10that may have features like those described in the preceding paragraphs. Interposer10includes PCBs12,13,14,15,16, and17. Although six PCBs are included in the implementation ofFIGS.1to4, interposer10may include more than six PCBs or fewer than six PCBs. Each PCB includes a non-conductive substrate such as G10 FR-4, which is a glass-reinforced epoxy laminate material. One or more electrically-conductive conduits run through or over the substrate to carry electrical signals, such as current, from the input of each PCB to the output of each PCB. Generally, the more signal pathways that there are through a PCB, the lower will be the resistance and inductance of that PCB. Non-conductive spacers20,21,22,23, and24separate adjacent PCBs within the interposer. Non-conductive spacers20to24may be made of G10 FR-4 or any appropriate dielectric—that is, an electrically-non-conductive material. As shown inFIG.3, in some implementations, each PCB may also include a surge suppressor26to protect against voltage spikes or current spikes on that PCB. The input to each PCB includes multiple coaxial cables30. In the example configuration ofFIGS.1to4, there are six coaxial cables31,32,33,34,35, and36per PCB. Each of the coaxial cables30may connect to the PCB using edge plating29, in which each cable is spliced and soldered to the PCB. Although six coaxial cables are shown per board inFIGS.1to4, interposer10may include more than six coaxial cables per PCB or fewer than six coaxial cables per PCB. Accordingly, in the example ofFIGS.1to4, there are 36 coaxial cables in total on interposer10. A coaxial cable includes an inner conductor surrounded by a concentric conducting shield. The inner conductor and the concentric conducting shield are separated by a dielectric. Each coaxial cable also includes a protective outer sheath that is also non-conductive. Current passes through the inner conductor of each coaxial cable30, with the concentric conducting shield acting as a return path for current. For example, force-high (or positive) current may pass through the inner conductor and force-low (or negative) current may pass through the outer conductor, where force-high currents and force-low currents correspond to currents having different polarities. Use of the center conductor and the concentric conductive shield to transmit force-current high and force-current low signals, respectively, may limit or reduce inductance in the coaxial cables through inductance cancellation effects. In addition, thin dielectrics, such as in a range of 2 mils (0.5 millimeters (mm)) to 10 mils (0.25 mm), may also contribute to inductance cancellation. The coaxial cables for a PCB connect electrically to the electrically-conductive conduits in the PCB via an edge plating technique. For example, the inner conductor of a coaxial cable may connect electrically to a first set of the electrically-conductive conduits in the PCB, where the first set may include one or more of the electrically-conductive conduits. The outer (or return) conductor of the same coaxial cable may connect electrically to a second set of the electrically-conductive conduits in the PCB, where the second set may include one or more of the electrically-conductive conduits that are different than the first set. Different coaxial cables may connect in this way to different sets of conduits on a PCB. Current from the coaxial cables connected to a PCB, such as PCB17, thus runs through that PCB, with a return path also running through the PCB. In some implementation, sets of electrically-conductive conduits on the PCB that transport current having different polarities are adjacent. For example, no two sets of electrically-conductive conduits on a PCB may transport current of the same polarity. This may produce at least some inductive cancellation on the PCB. The output of each PCB12to17also includes a spring leaf assembly40(seeFIG.1). Each PCB may include edge plating to implement such connections. Each spring leaf assembly40includes multiple leaves41,42,43, and44. Each leaf includes an electrically-conductive material that is connectable, electrically, to one or more of the electrically-conductive conduits on the PCB. A leaf may include a pre-loaded spring finger that is compressible to provide a stable electrical contact. As shown inFIGS.1and3, in some implementations there are four spring leaves on each PCB; however, in some implementations there may be different numbers of spring leaves per PCB. In some implementations, each of the spring leaves is connected to a corresponding PCB in order to transport a portion of the current obtained from the PCB to a device interface board (DIB) of a test system. The spring leaf connectors may be arranged to alternate in polarity. For example, in a case where there are four spring leaf connectors on a PCB, a first leaf connector41may be for a force-high current path, a second leaf connector42adjacent to the first leaf connector may be for a force-low or return current path, a third leaf connector43adjacent to the second leaf connector may be for a force-high current path, and a fourth leaf connector44adjacent to the third leaf connector may be for a force-low or return current path. In this example, the first (force-high) leaf connector41may connect electrically to a first set of the electrically-conductive conduits in the PCB, where the first set may include one or more of the electrically-conductive conduits. The second (force-low or return) leaf connector42may connect electrically to a second set of the electrically-conductive conduits in the PCB, where the second set may include one or more of the electrically-conductive conduits that are different than the first set. The third (force-high) leaf connector43may connect electrically to a third set of the electrically-conductive conduits in the PCB, where the third set may include one or more of the electrically-conductive conduits that are different than the first set and the second set. The fourth (force-low or return) leaf connector44may connect electrically to a fourth set of the electrically-conductive conduits in the PCB, where the fourth set may include one or more of the electrically-conductive conduits that are different than the first set, the second set, and the third set. As shown in the figures, the coaxial cables30on each PCB are arranged in parallel with each other, the PCBs are arranged in parallel with each other, and the spring leaves40on each PCB are arranged in parallel with each other. In addition, the groups of coaxial cables (in this example, six coaxial cables) on each PCB are also in parallel with each other. And, the groups of spring leaf connectors (in this example, four spring leaf connectors) on each PCB are also in parallel with each other. Use of parallel connections such as these, provide support for high levels of current, such as, but not limited to, currents over 500 Amperes (A), 1000 A or more, 2000 A or more, or 3000 A or more. Use of parallel connections such as these, also provide support for low levels of current, such as currents of less than 500 A, less than 5 A, less than 1 A, and into or below the single-digit milliampere range. In addition, by alternating force and return paths within interposer10, along with use of coaxial cables, inductance in the interposer can be limited or reduced to, for example, 100 nanoHenries (nH) to 60 nH or less. The multiple parallel paths also function to limit or to reduce resistance in the interposer. In this regard, in the example presented inFIGS.1to4, there may be 2000 A of pulsed current passing through interposer10. For example, there may be pulsed current of 2000 Amps on the force and return each passing through the interposer10. In this case, there are 36 coaxial cables (six per PCB), each of which transports 55 A of pulsed current. There are six PCBs, each of which transports 300 A of pulsed current. There are 24 spring leaf connectors, 12 of which are force connectors that each transports 166.6 A of pulsed current. Accordingly, each of the coaxial cables transports a different portion of pulsed current than each of the PCBs and each of the spring leaf connectors; each of the spring leaf connectors transports a different portion of current than each of the PCBs and each of the coaxial cables; and each of the PCBs transports a different portion of current than each of the PCBs and each of the spring leaf connectors. In some implementations, there may be different numbers of PCBs, different numbers of coaxial cables, and different numbers of spring leaf connectors. For example, the number of spring leaf connectors may be increased so that the portions of current transmitted by each spring leaf connector and each coaxial cable are equal. In some implementations, different PCBs may include different numbers of coaxial cable connections and different numbers of spring leaf connections. The coaxial cables, the PCBs, and the spring leaves may be configured and arranged to minimize the resistance and the inductance of the interposer assembly. For example, a computer program may be executed to simulate various configurations of the interposer and the configuration that produces the lowest resistance and inductance for a given current or range of currents may be selected. The coaxial cables, the PCBs, and the spring leaves may be configured and arranged to reduce the resistance and the inductance of the interposer assembly. For example, increasing the numbers of conductive paths, while maintaining them in parallel may reduce these characteristics of the interposer. The spring leaves may be configured and arranged to implement a target resistance and a target inductance of the interposer assembly. For example, by selecting the numbers and arrangements of components of the interposer—e.g., the PCBs, the coaxial connections, and the spring leaves—it is possible to produce specific resistance and inductance in the interposer. In some implementations, interposer10includes a shroud50comprised of electrically-insulating insulating material. Shroud50is at least partly around spring leaf assembly, particularly the areas where human contact with electrical conductors is possible. In some implementations, shroud50surrounds the entire spring leaf assembly. In some implementations, as shown inFIG.4, shroud50is around sides of the spring leaf assembly and extends partway along sides of the PCBs to cover any electrical connections that may exist along the sides of the PCBs. In some implementations, interposer10may be used to make a blind mate connection to gold or copper pads a DIB or a probe card holding DUTs to be tested by a test system such as automatic test equipment (ATE). For example, the blind-mate connection may be within a test head of the ATE. A blind-mate connector includes self-aligning features that guide the connector into the correct mating position. Connections to the gold or copper pads may alternate in polarity such that each positive connection is next to each negative connection, thereby reducing inductance Referring toFIG.5, an example test system, such as ATE70, may include a current source71, a polarity inverter72, an interposer73of the type described herein, and a DIB74. In an example the interposer may have an inductance of 100 nh or less for a pulsed current of 2000 A or more. In another example, the interposer may have a resistance of 3 milliohms (mΩ) or less for a current of 2000 A or more. In another example, the interposer may have an inductance of 500 nH or less for a pulsed current of 2000 A or more. In still another example, the interposer may have a resistance of 10 mΩ or less for a pulsed current of 2000 A or more. During operation, current flows from the current source through the polarity inverter72, where its polarity is either kept the same or changed based on requirements to test DUTs connected to the test system. In some examples, the polarity inverter may be omitted. Current output from the polarity inverter is passed to interposer73which, in this example includes an electrical and/or mechanical interface to DIB74. The current is passed from polarity inverter72to interposer73over coaxial cables, such as coaxial cables30. Current from the interposer then passes to the DIB. The DIB, as noted, holds DUTs in sites75for testing and distributes the current from interposer73to the DUTs in the sites for testing. In some implementations, multiple interposers of the type described herein may be connected to a single DIB. In some implementations, the coaxial cables each have a length of 13 meters or 13.5 meters; however, different lengths may be used. For example, the coaxial cables each may have lengths defined in triple-digit meters or less; the coaxial cables each may have lengths defined in double-digit meters or less; the coaxial cables each may have lengths defined in single-digit meters or less; the coaxial cables each may have lengths defined in single-digit decimeters or less; or the coaxial cables each may have lengths defined in single-digit centimeters or less. In some implementations, particularly those that have shorter distances between the interposer and the current source, electrical conduits other than coaxial cables may be used. ATE70also includes a control system76. The control system may include a computing system comprised of one or more microprocessors or other appropriate processing devices as described herein. Communication between the control system and the other components of ATE70is represented conceptually by line77. DIB74includes a PCB having sites that include mechanical and electrical interfaces to one or more DUTs that are being tested or are to be tested by the ATE. Power, including voltage, may be run via one or more layers in the DIB to DUTs connected to the DIB. DIB74also may include one or more ground layers and one or signal layers with connected vias for transmitting signals to the DUTs. Sites75may include pads, conductive traces, or other points of electrical and mechanical connection to which the DUTs may connect. Test signals and response signals, including high current signals pass via test channels over the sites between the DUTs and test instruments. DIB74may also include, among other things, connectors, conductive traces, conductive layers, and circuitry for routing signals between test instruments, DUTs connected to sites75, and other circuitry. Control system76communicates with test instruments (not shown) to control testing. Control system76may also configure the polarity inverter72to provide voltage/current at the polarity required for testing. The control may be adaptive in that the polarity may be changed during testing if desired or required. All or part of the test systems described in this specification and their various modifications may be configured or controlled at least in part by one or more computers such as control system76using one or more computer programs tangibly embodied in one or more information carriers, such as in one or more non-transitory machine-readable storage media. A computer program can be written in any form of programming language, including compiled or interpreted languages, and it can be deployed in any form, including as a stand-alone program or as a module, part, subroutine, or other unit suitable for use in a computing environment. A computer program can be deployed to be executed on one computer or on multiple computers at one site or distributed across multiple sites and interconnected by a network. Actions associated with configuring or controlling the test system described herein can be performed by one or more programmable processors executing one or more computer programs to control or to perform all or some of the operations described herein. All or part of the test systems and processes can be configured or controlled by special purpose logic circuitry, such as, an FPGA (field programmable gate array) and/or an ASIC (application-specific integrated circuit) or embedded microprocessor(s) localized to the instrument hardware. Processors suitable for the execution of a computer program include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Generally, a processor will receive instructions and data from a read-only storage area or a random access storage area or both. Elements of a computer include one or more processors for executing instructions and one or more storage area devices for storing instructions and data. Generally, a computer will also include, or be operatively coupled to receive data from, or transfer data to, or both, one or more machine-readable storage media, such as mass storage devices for storing data, such as magnetic, magneto-optical disks, or optical disks. Non-transitory machine-readable storage media suitable for embodying computer program instructions and data include all forms of non-volatile storage area, including by way of example, semiconductor storage area devices, such as EPROM (erasable programmable read-only memory), EEPROM (electrically erasable programmable read-only memory), and flash storage area devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CD-ROM (compact disc read-only memory) and DVD-ROM (digital versatile disc read-only memory). Elements of different implementations described may be combined to form other implementations not specifically set forth previously. Elements may be left out of the systems described previously without adversely affecting their operation or the operation of the system in general. Furthermore, various separate elements may be combined into one or more individual elements to perform the functions described in this specification. Other implementations not specifically described in this specification are also within the scope of the following claims. | 21,449 |
11862902 | DETAILED DESCRIPTION OF THE INVENTION For the sake of the advantages, spirits and features of the present invention can be understood more easily and clearly, the detailed descriptions and discussions will be made later by way of the embodiments and with reference of the diagrams. It is worth noting that these embodiments are merely representative embodiments of the present invention, wherein the specific methods, devices, conditions, materials and the like are not limited to the embodiments of the present invention or corresponding embodiments. Moreover, the devices in the figures are only used to express their corresponding positions and are not drawing according to their actual proportion. In the description of this specification, the description with reference to the terms “a specific embodiment”, “another specific embodiment” or “parts of specific embodiments” etc. means that the specific feature, structure, material or feature described in conjunction with the embodiment include in at least one embodiment of the present invention. In this specification, the schematic representations of the above-mentioned terms do not necessarily refer to the same embodiment. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments in a suitable manner. In the description of the present invention, it is to be understood that the orientations or positional relationships of the terms “longitudinal, lateral, upper, lower, front, rear, left, right, top, bottom, inner, outer” and the like are based on the orientation or positional relationship shown in the drawings. It is merely for the convenience of the description of the present invention and the description of the present invention, and is not intended to indicate or imply that the device or component referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore cannot be understood as limitations of the invention. Please refer toFIG.1andFIG.2.FIG.1is a partial exploded diagram illustrating an electrical connector1with electromagnetic shielding function according to an embodiment of the present invention.FIG.2is an exploded diagram illustrating the circuit board11, the cables12and the shielding component13inFIG.1. As shown inFIG.1andFIG.2, in this embodiment, the electrical connector1with electromagnetic shielding function includes a case10, a circuit board11, a plurality of cables12and a shielding component13. The circuit board11, the plurality of cables12and the shielding component13are configured in the case10. The circuit board11includes a plurality of conductive pads111and a plurality of ground pads112. The plurality of cables12are connected to the circuit board11. Each of cables12includes a wire core121and a shielding layer123covering the wire core121. One end of the wire core121is exposed from the shielding layer123, and the wire cores121of the cables12are electrically connected to the conductive pads111respectively. The shielding component13is configured on the circuit board11and electrically connected to the ground pads112. The shielding component13forms a plurality of shielding grooves131for covering the conductive pads111and the cables12. The shielding groove131includes a contact portion1311and a shielding portion1312extended from the contact portion1311. The contact portions of the shielding grooves131are contacted the shielding layers123of the cables12respectively and the shielding portions1312of the shielding grooves131cover the exposed wire cores121of the cables12respectively to provide electromagnetic shielding to the cables12. In practice, the case10of the electrical connector1with electromagnetic shielding function has an opening101and a containing space communicated with the opening101. The circuit board11, the cables12and the shielding component13can be disposed in the containing space from the opening101to be installed in the case10. When the electrical connector1is assembled, one end of the circuit board11is exposed outside the case10to connect to the socket of the electrical connector1, and the other end of the circuit board11includes a plurality of conductive pads111and a plurality of ground pads112configured to electrically connect the cables12and the shielding component13respectively. The conductive pads111and the ground pads112can be arranged in a straight line, and the conductive pads111and the ground pads112can be staggered. It should be noted that the arrangement of the conductive pads111and the ground pads112is not limited inFIG.2, and the sizes of the conductive pads111and the ground pads112can be designed as requirement. As shown inFIG.2, in this embodiment, the cable12includes a wire core121, insulating layer122and a shielding layer123. The insulating layer122covers the wire core121, and the shielding layer123covers the insulating layer. Furthermore, one end of the insulating layer122is exposed from the shielding layer123, and one end of the wire core121is exposed from the insulating layer122. When the electrical connector1is assembled, the wire core121of the cable12is electrically connected to the conductive pad111of the circuit board11. In practice, the wire core121can be fixed and electrically connected to the conductive pad111of the circuit board11by welding for transmission. The shielding layer123can be a sheet-like or mesh-like aluminum foil layer to shield the electromagnetic field generated by the wire core121due to the passing of current. The material of the shielding layer123is not limited to aluminum. The material of the shielding layer123also can be other conductive materials. The insulating layer122between the wire core121and the shielding layer123can not only ensure the transmission function of the wire core121, but also separate the wire core121from the shielding layer123. The cable12further can include an oversheath (not shown in figure) covering the shielding layer123, and partial shielding layer123is exposed from the oversheath. In this embodiment, the shielding layer123of the cable12is configured in the case10of the electrical connector1and the oversheath of the cable12is configured outside of the case10of the electrical connector1, but it is not limited hereto. The length of the shielding layer of the cable and the configuration of the oversheath can be determined according to design or requirement. The shielding component13is substantially U-shaped and has a top portion132, a first sidewall133A and a second sidewall133B. Moreover, the shielding component13includes a plurality of protruding structure134extended from the top portion132and disposed between the first sidewall133A and the second sidewall133B. The shielding groove131can be formed among the top portion132, the first sidewall133A and the second sidewall133B, among the top portion132, the second sidewall133B and the protruding structure134, and among the top portion and the two protruding structures134. In addition, each of shielding grooves131includes a contact portion1311and a shielding portion1312. As shown inFIG.2, the contact portion1311is located at the one end of the shielding groove131, and the shielding portion1312is located at the other end of the shielding groove131relative to the contact portion1311. In this embodiment, the shielding component13includes four shielding grooves131and three protruding structures134, and each of protruding structures134is between the two shielding grooves131respectively. In practice, number of the shielding groove131and protruding structure134of the shielding component13is not limited hereto, the number of the shielding groove131and protruding structure134also can be determined according to design or requirement. In this embodiment, the number and position of the ground pads112of the circuit board11are corresponding to those of the protruding structures134of the shielding component13, and the protruding structures134of the shielding component13are electrically connected to the ground pads112of the circuit board11respectively. As shown inFIG.2, the circuit board11of the electrical connector1includes five ground pads112, and the first sidewall133A, the second sidewall133B and the protruding structures134of the shielding component13are electrically connected to the ground pads respectively to make the shielding component13being grounded. In practice, the material of the shielding component13can be selected from metal, conductive plastic or other conductive materials. Furthermore, the first sidewall133A, the second sidewall133B and protruding structure134of the shielding component13can be fixed on the circuit board11and electrically connected to the ground pads112by welding, riveting, snapping to make the shielding component13being grounded. Since the first sidewall133A, the second sidewall133B and protruding structure134of the shielding component13are grounded and the top portion132of the shielding component13is connected to the first sidewall133A, the second sidewall133B and protruding structure134, the shielding grooves131of the shielding component13have electromagnetic shielding function. Please refer toFIG.1toFIG.4.FIG.3is a sectional diagram illustrating the circuit board11, the cables12and the shielding component13in one perspective view ofFIG.1.FIG.4is a sectional diagram illustrating the circuit board11, the cables12and the shielding component13in another perspective view ofFIG.1. As shown inFIG.2,FIG.3andFIG.4, in this embodiment, the electrical connector1includes four cables12, and each of cables12includes a first wire core121A and a second wire core121B. The number of the shielding groove131of the shielding component13is corresponding to that of cables12, and the first sidewall133A, the second sidewall133B and protruding structure134of the shielding component13are electrically connected to the ground pads112. Moreover, the circuit board11includes a first conductive pad111A and a second conductive pad111B between each two ground pads112. When the electrical connector1is assembled, the first wire core121A and the second wire core121B of the cable12are fixed to the first conductive pad111A and the second conductive pad111B respectively. The shielding component13is configured above the cable12and first sidewall133A, the second sidewall133B and the protruding structures134of the shielding component13are fixed on the ground pads112of the circuit board11. At this time, the position of the shielding groove131of the shielding component13is corresponding to that of the cable12. The first conductive pad111A and the second conductive pad111B of the circuit board11and the first wire core121A and the second wire core121B of the cable12are located in the same shielding groove131. Furthermore, the wall surface1313of the contact portion1311of the shielding groove131is contacted to the shielding layer123of the cable12, and the shielding portion1312of the shielding component13covers the first wire core121A and the second wire core121B of the cable12and the first conductive pad111A and the second conductive pad111B of the circuit board11, to provide electromagnetic shielding to the first wire core121A and the second wire core121B of the cable12. In practice, the shielding component13is connected to the ground pad112of the circuit board11, and the contact portion1311of the shielding groove131of the shielding component13is contacted to the shielding layer123of the cable12. That is to say, the shielding layer123of the cable12can be electrically connected to the ground pad112through the shielding component13. The shape of the contact portion1311of the shielding groove131can be corresponding to that of the shielding layer123of the cable12. When all the shielding grooves131contact the shielding layers123of the cables12respectively, the shielding grooves131can connect the shielding layers123of all the cables12in series through the contact portions1311to be grounded. Therefore, the electrical connector of the present invention can enhance the electromagnetic shielding effect of the cables through the shielding component, thereby improving the efficiency. Moreover, when the electrical connector1is assembled, the cables12are disposed in the shielding grooves131respectively. In other words, the protruding structure134is located between each two adjacent cables12. In practice, when the cables12are the high frequency differential signal cables, the protruding structure134of the shielding component13can shield the two cables12located in the adjacent two shielding grooves131to prevent crosstalk between the cables inside the electrical connector, and can replace the ground wire of the cable, thereby improving efficiency and saving cost. Furthermore, when the electrical connector1is assembled, the shielding component13contacts the shielding layer123of the cable12and covers the wire core121of the cable12. Therefore, the electrical connector of the present invention also can effectively block the electromagnetic interference of other electrical components outside the electrical connector, thereby improving the transmission quality and efficiency. The connection manner of the first sidewall, the second sidewall and the protruding structure of the shielding component and the ground pad of the circuit board can be other types. In one embodiment, the lengths of the first sidewall and the second sidewall of the shielding component are smaller than the lengths of the protruding structures, and the protruding structures of the shielding component are connected to the ground pads of the circuit board. In practice, when the protruding structures of the shielding component are connected to the ground pads of the circuit board, the shielding component has electromagnetic shielding function. That is to say, the first sidewall and the second sidewall that not connected to the ground pad of the circuit board still have electromagnetic shielding function. In another one embodiment, the lengths of the first sidewall and the second sidewall of the shielding component are greater than the lengths of the protruding structures, and the first sidewall and the second sidewall are connected to the ground pads of the circuit. In practice, when the first sidewall and the second sidewall are connected to the ground pads of the circuit, the shielding component has electromagnetic shielding function. Furthermore, the protruding structures that not connected to the ground pad of the circuit board still have electromagnetic shielding function. Therefore, the protruding structures of the shielding component can prevent crosstalk among the cables. In addition, in one embodiment, the top portion of the shielding component further includes a plurality of grooves opposite to the plurality of shielding grooves, and the cables can configured in the grooves of the shielding component. In practice, when the electrical connector is designed to include upper and lower layers of cables, the cables in the lower layer can be attached to the circuit board, and the shielding grooves of the shielding component can be configured on the cables in the lower layer. Then, the wire core of the cable on the upper layer is soldered to the circuit board, and the shielding layer of the cable can further be configured and contacted the groove of the shielding component. Therefore, the shielding component not only can prevent the crosstalk between the cables of the same layer through the shielding groove, but also prevent the interference between the cables of different layers through the groove, so that the cables to be arranged neatly and not easily entangled to save space. The number of the groove can be corresponding to that of the cables of the upper layer. In addition to the ground component of the circuit board can be the ground pad described in the aforementioned embodiment, the ground component also can be in other forms. In one embodiment, the ground component is a ground layer, and the shielding component is electrically connected to the ground layer. In practice, the circuit board can be a multi-layer printed circuit board, and the ground layer can be configured in the circuit board. The layers other than the ground layer of the circuit board may be formed a plurality of holes by etching, and the positions of the holes can be corresponding to the positions of the sidewalls of the shielding component. When the shielding component is configured on the circuit board, the sidewalls of the shielding component can pass through the holes and be connected to the ground layer of the circuit board by riveting and snapping, so that the shielding component is grounded and has shielding function. Similarly, the positions of the holes of the circuit board further can be corresponding to the positions of the sidewall of the shielding component. The protruding structures of the shielding component can pass through the holes and be connected to the ground layer of the circuit board by riveting and snapping. In addition to the shielding component can be the structure described in the aforementioned embodiment, the ground component also can be in other forms. Please refer toFIG.5AandFIG.5B.FIG.5Ais a structure schematic diagram illustrating the shielding component23according to an embodiment of the present invention.FIG.5Bis a sectional diagram illustrating the shielding component23, the circuit board21and the cables22in one perspective view ofFIG.5A. As shown inFIG.5A, the difference between this embodiment and the aforementioned embodiment is that the shielding component23of this embodiment further includes a plurality of rib structures235. The rib structures235are configured on the contact portion2311of the shielding component23and located in the shielding grooves231respectively. In practice, the shape of the rib structure235can be square shape, rectangle shape or arc shape. The rib structures235can be integrally formed on the shielding component23or can be configured on the shielding component23by stamping. When the electrical connector is assembled, the rib structure235of the shielding component23contacts the shielding layer223of the cable22to provide electromagnetic shielding to the cable22. In this embodiment, rib structures235are located at the top portion of the shielding component23, but it is not limited hereto, the rib structures235also can be located at the sidewall of the contact portion2311or on the protruding structure. The electrical connector may include cables with different wire diameters due to design or requirements. Therefore, the shielding component of the electrical connector of the present invention can contact the shielding layer of the cable with the smaller wire diameter through the rib structures to improve the shielding efficiency. Please refer toFIG.6AandFIG.6B.FIG.6Ais a structure schematic diagram illustrating the shielding component33according to another one embodiment of the present invention.FIG.6Bis a sectional diagram illustrating the shielding component33, the circuit board31and the cables32in one perspective view ofFIG.6A. As shown inFIG.6A, the difference between this embodiment and the aforementioned embodiment is that the shielding component33of this embodiment further includes a plurality of elastic structures335. The elastic structure335is configured on the contact portion3311of the shielding groove331and extended from wall surface toward the shielding groove331. In practice, the elastic structure335can be an elastic arm, and the elastic arm can be formed on the shielding component33by stamping. Since the electrical connector may include cables with different wire diameters due to design or requirements, the elastic structure335located at the shielding groove331can contact the shielding layer323of the cable32with the smaller wire diameter to provide electromagnetic shielding to the cable32when the electrical connector is assembled. Furthermore, the cable32with the larger wire diameter can compress the elastic structure335of the shielding component33, then the elastic structure335resists and contacts the shielding layer323of the cable32according to the elastic force generated by compressed to provide electromagnetic shielding to the cable32. Therefore, the shielding component of the electrical connector of the present invention can contact the shielding layer of the cable with the smaller wire diameter through the elastic structures to improve the shielding efficiency. Please refer toFIG.7AandFIG.7B.FIG.7Ais a structure schematic diagram illustrating the shielding component43according to an embodiment of the present invention.FIG.7Bis an assembly diagram illustrating the shielding component43, the circuit board41and the cables42inFIG.7A. As shown inFIG.7AandFIG.7B, in this embodiment, the shielding portion4312of the shielding component43further includes a plurality of separating structures436configured in the shielding grooves431respectively. Each of the separating structures436is configured on the end of the shielding component43close to the wire core421of the cable42. The shape of the separating structure436can be corresponding to that of the wire core421of the cable42. When the shielding component43is configured on the circuit board41, the shielding portion4312of the shielding component43can cover and separate the two wire cores421of the cables42by separating structures436to provide electromagnetic shielding between the wire cores421of the cables42, thereby increasing shielding efficiency. Please refer toFIG.8AandFIG.8B.FIG.8Ais a structure schematic diagram illustrating the shielding component53according to an embodiment of the present invention.FIG.8Bis a sectional diagram illustrating the shielding component53, the circuit board51and the cables52in one perspective view ofFIG.8A. As shown inFIG.8AandFIG.8B, the difference between this embodiment and the aforementioned embodiment is that the shielding component53of this embodiment further includes a third sidewall533C configured on the shielding portion5312and connected to the shielding grooves531. In practice, the third sidewall533C can be configured on the end of the shielding component53and cover one end of the opening of the shielding grooves531. Moreover, the third sidewall533C can be configured on one end of the shielding component53close to the wire core521of the cable52. The third sidewall533C can be connected to the first sidewall533A and the second sidewall533B of the shielding component53, also can be connected to the protruding structures534. When the shielding component53is configured on the circuit board51, the shielding portion5312of the shielding component53can completely cover the wire core521of the cable52and the shielding component53does not contact the wire core521to provide electromagnetic shielding to the cable52, thereby increasing shielding efficiency. In summary, the electrical connector with electromagnetic shielding function of the present invention can cover the wire core of the cable and contact the shielding layer of the cable at the same time by the shielding component to provide the electromagnetic shielding, thereby increasing efficiency. Furthermore, the electrical connector of the present invention can separate the two adjacent cables and generate electromagnetic shielding through the protruding structures of the shielding component, to prevent crosstalk between cables inside electrical connectors, thereby increasing the electromagnetic shielding efficiency. Moreover, the shielding component of the electrical connector of the present invention can contact the shielding layer of the cable in different ways to adapt to cables with different wire diameters, thereby improving the efficiency. In addition, the electrical connector of the present invention can cover the wire core and the shielding layer of the cable to prevent the cables of the electrical connector from being electromagnetically interfered by other external electronic components, thereby improving the transmission quality and efficiency. With the examples and explanations mentioned above, the features and spirits of the invention are hopefully well described. More importantly, the present invention is not limited to the embodiment described herein. Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims. | 24,630 |
11862903 | DETAILED DESCRIPTION Charging of electronic devices, such as mobile devices, cell phones, tablets, laptops, and the like, is often performed using purpose-built charging units which plug into wall outlets; however, such purpose-built charging units can easily be lost and/or forgotten and/or may generally not be available. Furthermore, such purpose-built charging units often include cords and/or require cords, which can lead to cord-clutter. An aspect of the specification provides a device comprising: a faceplate having an electrical outlet-sized aperture therethrough, the faceplate comprising an electrical circuit; a first body extending from a rear side of the faceplate, the first body comprising an AC-to-DC (alternating current-to-direct current) power supply; a second body extending from the rear side of the faceplate, the first body and the second body including respective electrical contacts located to electrically contact one or more respective electrical outlet terminals, the respective electrical contacts configured to provide alternating current from the one or more respective electrical outlet terminals to an AC input of the AC-to-DC power supply at least partially via the electrical circuit of the faceplate; and at least one electrical connector, located at a front side of the faceplate, connected to a DC output of the AC-to-DC power supply, the at least one electrical connector for providing DC power to an external device connected thereto. Another aspect of the specification provides a retraction mechanism comprising: a first geared wheel that includes: a spindle around which a retractable cord wraps; and respective electrical connections around the spindle from the retractable cord to symmetrical concentric multi-ring slip rings configured for electrical communication with a power supply; and a second geared wheel interlocked with the first geared wheel, the second geared wheel including a spring mechanism for providing tension to the first geared wheel, to cause the second geared wheel to rotate the first geared wheel to retract the retractable cord. Another aspect of the specification provides a power supply comprising: an alternating current (AC) input; a direct current (DC) output a full wave rectifier electrically connected to the AC input; a buck regulator in communication with the full wave rectifier to step down rectified AC voltage to a lower voltage; a push-pull converter, comprised of a chopper circuit in communication with the buck regulator to control a duty cycle of lower voltage rectified AC voltage, and a planar transformer in communication with the chopper circuit to further reduce voltage of the lower voltage rectified AC voltage; a rectifier in communication with the planar transformer to convert electrical output of the planar transformer to direct current voltage, wherein the DC output of the AC-to-DC power supply comprises an output of the rectifier; and a feedback circuit between the DC output and the buck regulator to control the direct current voltage output from the rectifier by controlling the lower voltage output of the buck regulator. Attention is next directed toFIG.1,FIG.2,FIG.3,FIG.4,FIG.5andFIG.6which depict front, back, right, left, bottom and top views of a device charger101(interchangeably referred to hereafter as the device101). As will be explained in detail hereafter, the device101is generally configured for installation at a junction box (for example, a North American sized junction box) at which an electrical outlet is already installed and connected to a mains power supply. In particular, an existing faceplate may be removed from the junction box, and the device101may be inserted into, and/or attached to, the junction box in place of the removed faceplate. When the device101is inserted into the junction box, electrical contacts of the device101contact respective electrical outlet terminals of the electrical outlet (e.g. and specifically side electrical terminals of the electrical outlet), providing alternating current (AC) power to a power supply in the device101located in a first body that extends from a rear side of the device101, with the AC power at least partly routed through a faceplate of the device101. The power supply of the device charger converts the AC power to direct current (DC) power, and the DC power is routed to electrical connectors at the front side of the device101. The electrical connectors may comprise one or more electrical ports and/or one or more connectors (e.g. male connectors) attached to a retractable cord; in examples that include the retractable cord, a retraction mechanism for the retractable cord may be contained in a second body that also extends from the rear side of the device101. The device101is now described in more detail. As depicted, the device101comprises: a faceplate103having an electrical outlet-sized aperture105(interchangeably referred to hereafter as the aperture105) therethrough, the faceplate103comprising an electrical circuit (e.g. internal to the faceplate103and described in more detail with respect toFIG.11andFIG.12). As depicted, the faceplate103has a shape and dimensions of a North American-sized single duplex outlet faceplate and, similarly, the aperture105has a shape and size of a North American-sized “decora” style single duplexed outlet. In other examples, the faceplate103and aperture105may have any suitable size and shape; for example, the aperture105may comprise two apertures for respective outlets of a “standard” single duplexed outlet. In general, the faceplate103comprises a front side106(as best seen inFIG.1), and a rear side108(as best seen inFIG.2) opposite the front side106. As depicted, the front side106is rounded and/or chamfered at an outside edge to both align with a shape and dimensions of a North American-sized single duplex outlet faceplate, and to provide depth to the faceplate103to contain the electrical circuit therein, as described below. Indeed, the rear side108of the faceplate103may comprise an outer side of a printed circuit board (PCB) on which the electrical circuit contained in the faceplate103is mounted. As best seen inFIG.2andFIG.3, the faceplate103further comprises a pair of fastener holes109through which fasteners, such as screws and the like, may be inserted to attach the faceplate103to an electrical outlet and/or junction box. In particular, as depicted, each of the faceplate103and the aperture105are rectangularly shaped, and hence each have a long axis and a short axis. The fastener holes109are located along the long axis, in positions complementary to respective fastener receptacles of North American electrical outlets and/or junction boxes. As best seen inFIG.2,FIG.3,FIG.4,FIG.5andFIG.6, the device101further comprises: a first body111and a second body112, each extending from the rear side108of the faceplate103. In the depicted examples, the first body111and the second body112are located on opposite sides of the electrical outlet-sized aperture105(for example to allow for an electrical outlet installed in a junction box to fit therebetween. However, in other examples, the first body111and the second body112may be conjoined and/or at least partially conjoined (e.g. across a top or bottom of the device101and/or in other configurations of the device101, for example for jurisdictions other than North America, the first body111and the second body112may be at least partially conjoined into a unitary body). In general, the first body111and the second body112contain different types of electrical components that are at least in partial communication via the electrical circuit of the faceplate103. As depicted schematically, inFIG.2,FIG.3,FIG.5andFIG.6the first body111comprises an AC-to-DC (alternating current-to-direct current) power supply113(interchangeably referred to hereafter as the power supply113). As depicted, the power supply113is contained within the first body111and is hence depicted in dashed lines, a convention used throughout the present specification. While any suitable power supply is within the scope of the present specification, a specific example of the power supply113is described below with respect toFIG.13A,FIG.14,FIG.15andFIG.16. In some examples, components of the AC-to-DC power supply113may be located on a printed circuit board (PCB) and enclosed in an overmold material, which also provides rigidity to the first body111. As best seen inFIG.2,FIG.5andFIG.6, the first body111and the second body112each include respective electrical contacts121,122located to electrically contact one or more respective electrical outlet terminals, the respective electrical contacts121,122configured to provide alternating current from the one or more respective electrical outlet terminals to an AC input of the AC-to-DC power supply113at least partially via the electrical circuit of the faceplate103. Details of the respective electrical contacts121,122will be described below with respect toFIG.9,FIG.10AandFIG.10B. As best seen inFIG.1, the device101further comprises at least one electrical connector (as depicted four connectors131,132,133,134), located at the front side106of the faceplate103, connected to a DC output of the AC-to-DC power supply113, the at least one electrical connector131,132,133,134for providing DC power to an external device connected thereto. In some examples, the at least one electrical connector131,132,133,134comprises one or more charging ports; indeed, as depicted, each of the connectors133,134comprise charging ports; for example, the connector133comprises a USB (Universal Serial Bus) charging port, and specifically a USB-A charging port, and the electrical connector133comprises a USB-C charging port, each of the charging ports connected to a DC output of the power supply113. While as depicted the charging ports of the connectors133,134each are of different types, in other examples the charging ports of the connectors133,134may be of a same type. Put another way, as depicted, the one or more charging ports includes a first charging port of a first type and a second charging port of a second type. However, in other examples, the one or more charging ports includes two or more charging ports of a same type. Indeed, when the connectors133,134include charging ports, the charging ports may be of any suitable type including, but not limited to, USB-A, USB-B, USB-C, USB Mini ports, USB Micro ports, and/or charging ports that are not USB-based. Furthermore, while the connectors133,134are depicted as being oriented parallel to a long axis of the faceplate103, one or more of the connectors133,134may be oriented perpendicular to the long axis of the faceplate103and/or the connectors133,134may be oriented in different directions. As depicted, the at least one electrical connector also comprises one or more connectors131,132(e.g. male connectors) for connecting to one or more different charging port types at an external device, the one or more connectors131,132attached to a retractable cord135(described in more detail below with respect toFIG.17andFIG.21, and as partially seen inFIG.4) located in the second body112, the retractable cord135connecting the one or more connectors131,132to the DC output via the faceplate103. As depicted, and with further reference toFIG.4, the connectors131,132extend from a T-shaped connector136(described in more detail below with respect toFIG.21andFIG.22) comprising a first connector131and a second connector132at about 180° to each other. Furthermore, inFIG.1andFIG.4, the connectors131,132are depicted in dashed lines as they are located at a recess137(e.g. as best seen inFIG.4) at the front side106of the faceplate103(e.g. in which the T-shaped connector136resides when the retractable cord135is retracted), and covered by a flexible cover139on the T-shaped connector136. In other examples, however, the connectors131,132extend from a T-shaped connector136may not reside in a recess, but may, in a retracted state, be located at the surface of the faceplate103. InFIG.4, the connectors131,132are also depicted in dashed lines as the recess137is at least partially covered by a wall138of the second body112. Indeed, in the depicted example, the wall138of the second body112includes a cutout that shows part of the recess137. With further reference toFIG.4, and end of the of the retractable cord135is also visible in the recess137(e.g. through the cutout). Indeed, as depicted, and with reference toFIG.1, the device101comprises the flexible cover139on the T-shaped connector136; in general, the flexible cover139covers the T-shaped connector136when retracted into the recess137(e.g. as best seen inFIG.4), the flexible cover139comprising a first flap141for covering the first connector131and a second flap142for covering the second connector132, the first flap141and the second flap142each configured to fold about 90° and/or more than 90°, to allow the external device to respectively connect to the first connector131or the second connector132, as described in more detail below with respect toFIG.23. As depicted, the flexible cover139and/or the T-shaped connector136includes a handle143which may be grasped (e.g. by a user of the device101) to extend the T-shaped connector136, the connectors131,132, and the retractable cable from the recess137and/or the faceplate103to connect one or more of the connectors131,132to one or more external devices, to charge the one or more external devices. Details of such operation are described in more detail below with respect toFIG.22andFIG.23. As best seen inFIG.2,FIG.4,FIG.5andFIG.6, the second body112generally comprises a retraction mechanism152for extending and retracting the retractable cord135. InFIG.2,FIG.4,FIG.5andFIG.6, the retraction mechanism152is depicted in dashed lines to indicate that the retraction mechanism152is contained within the second body112. With reference toFIG.1,FIG.3,FIG.4andFIG.6, the device101and/or the retraction mechanism152further includes a button155at the front side106of the faceplate103, the button155configured to release the retraction mechanism152(e.g. release a ratchet of the retraction mechanism152) such that, when the retractable cord135and/or the T-shaped connector136and/or the connectors131,132are retracted, and the button155is actuated, the retractable cord135is retracted into the second body112. While any suitable retraction mechanism is within the scope of the present specification, a specific example of the retraction mechanism152is described below with respect toFIG.17,FIG.18andFIG.19. However, in some examples, the retraction mechanism152may be at least partially constructed from PCBs, which may also form one or more walls of the second body112to provide rigidity to the second body112, as well as provide electrical communication and/or routing between the power supply113and the retractable cord135(e.g. and further via the faceplate103) and/or between the contact122and the power supply113(e.g. and further via the faceplate103). While as depicted, the device101includes two connectors131,132of the T-connector136, the T-connector136may be replaced by any suitably shaped connector that includes other numbers of electrical connectors, with, for example, as few as one electrical connectors, or more than two electrical connectors. For example, the T-shaped connector136may be replaced with an other-shaped connector that includes three connectors (e.g. similar to the connectors131,132) each at about 90° to each other, for example in a cross-shape. However, any type suitable connector of any suitable shape may be used in place of the T-connector136which includes any suitable number of connectors similar to the connectors131,132, and arranged in a manner so as to not interfere with each other's operation. In yet further examples, the connectors131,132may be replaceable and/or interchangeable at the T-shaped connector136(and/or other-shaped connector). Hence, for example, the connectors131,132may be provided in the form of connector heads, and T-shaped connector136, and the like, may be adapted to include slots, and the like, into which the connector heads may be inserted for mechanical and electrical attachment to the device101. Such connector heads maybe sold separate from the device101to adapt the device101for used with new types of connectors and/or other types of connectors. As depicted the connectors131,132each comprise a male connector, for example for use with a complementary female charging port of an external device. Furthermore, the first connector131and the second connector132may be of different types; for example, the first connector131may comprise a Lightning™ male connector compatible with Apple™ devices, while the second connector132may comprise a USB Type C male connector compatible with Apple™ devices, Android™, and other devices. However, while as depicted the connectors131,132each are of different types, in other examples the connectors131,132may be of a same type and/or be provided as connector heads that may be swapped and/or exchanged at the T-shaped connector136, and the like. Furthermore, as new electrical connectors types are developed and released, for example by entities that develop electrical connectors for charging and the like, it is understood that such new electrical connectors types may be incorporated into the device101. Hence, the connectors131,132,133,134are understood to be replaceable with any suitable connector type. Furthermore, while as depicted the device101comprises four electrical connectors131,132,133,134, in other examples the device101may comprise as few as one electrical connector, for example one retractable electrical connector (e.g. connected to a retractable cord135) or one charging port. However, the device101may comprise any suitable combination of retractable electrical connectors and/or charging ports, with the components of the power supply113adjusted accordingly to provide power to the any suitable combination of retractable electrical connectors and/or charging ports. In yet further examples, the device101may include male electrical connectors that are not retractable, for example, as protrusions, and the like, from the faceplate103. Use of the device101with an electrical outlet in a junction box, and electrical operation of the device101, is next described. Attention is next directed toFIG.7andFIG.8which depicts the device101in use with an electrical outlet701compatible with the aperture105; for example, as best seen inFIG.7, fasteners, such as screws709, have been inserted through the holes109to attach the device101to the electrical outlet701and/or a junction box into which the electrical outlet701has been installed. However, in other examples, the device101may be adapted to “snap” into a junction box without the used to separately provided fasteners and/or the apertures105. In particular,FIG.7depicts a front view of the device101in use with the electrical outlet701andFIG.8depicts a top view of the device101in use with the electrical outlet701. For example,FIG.7is similar toFIG.1, but also shows the electrical outlet701, andFIG.8is similar toFIG.6, but also shows the electrical outlet701and a perimeter of a junction box801into which the electrical outlet701is installed. While a connection of the electrical outlet701to a mains power supply is not depicted, such a connection is nonetheless understood to be present. With reference toFIG.7, as depicted the electrical outlet701is filling the aperture105and/or is at least partially extending through the aperture105. For example, as depicted, the electrical outlet701comprises a duplex electrical outlet with two outlets located on a step and/or ridge of the electrical outlet701, and a perimeter of the step of the electrical outlet701is of a complementary size and shape of the aperture105, such that the step of the electrical outlet701extends into and/or through the aperture105. With reference toFIG.8, the electrical outlet701includes terminals821,822, which are connected to AC power of the mains power supply. In some examples, each of the terminals821,822may comprise a pair of terminals each pair comprising one or more screw heads (e.g. of one or two respective screws) under which corresponding wires of the mains power supply are attached. However, in other examples, the mains power supply may be attached via slots and/or holes in the rear of the electrical outlet701. In general, as depicted, the terminals821,822are similar and/or the same as terminals of a standard North American electrical outlet, and are further located in a similar and/or same position as terminals of a standard North American electrical outlet. As such one pair of the terminals821,822may be a “hot” (and/or positive, e.g. in North America, a “black” terminal) while the other pair of the terminals821,822may be “neutral” (and/or negative, e.g. in North America, a “white” terminal). The terminals821,822are located on opposite sides of the electrical outlet701. Furthermore, as best seen inFIG.8, the contacts121,122are of a size, shape and location to contact a respective terminal821,822when the device101is inserted into the junction box801. Furthermore, while the device101is depicted inFIG.7andFIG.8as being inserted into the junction box801in a particular orientation, in other examples the device101may be inserted into the junction box801at 180° and the contacts121,122again contact the terminals821,822, for example due to the shape and/or dimensions of the contacts121,122, described below. In particular, each of the terminals821,822is located on a respective side of a respective body111,112adjacent the aperture105. For example, as depicted, each of the bodies111,112is of a shape and size to fit between outer sides of the electrical outlet701and corresponding sides of the junction box801, such that the contacts121,122electrically contact and/or touch the respective terminals821,822. Each of the bodies111,112may be a shorter depth than the junction box801, and further may be at an angle to assist with insertion into the junction box801and/or fitting between outer sides of the electrical outlet701and corresponding sides of the junction box801, to reduce the likelihood of leading edges of the bodies111,112from catching on the electrical outlet701or terminals821,822. For example, each of the first body111and the second body112may each be at about a 2° angle from a normal of the rear side108of the faceplate103, and extending (slightly) away from the electrical outlet-sized aperture105, such that the inner walls of the bodies111,112(e.g. adjacent the aperture105) are closer together adjacent the rear side108of the faceplate103than at ends of the bodies111,112that are furthest from the rear side108of the faceplate103. However, while in a specific examples, each of the first body111and the second body112may each be at about a 2° angle from a normal of the rear side108of the faceplate103, each of the first body111and the second body112may each be at any suitable non-zero angle from a normal of the rear side108of the faceplate103, and extending away from the electrical outlet-sized aperture105. In yet further examples, each of the first body111and the second body112may not be angled. In yet further examples, each of the first body111and the second body112may be angled inward towards the aperture105to assist the contacts121,122with contacting the terminals821,822, for example. Furthermore, as depicted, the first body111and the second body112each have rounded corners at an end that that is distal from the faceplate103, for example to reduce the likelihood of catching on wires, components, and the like that are contained in the junction box801. In particular examples, for example, when the device101is adapted for North American electrical outlets and junction boxes, each of the bodies111,112may have dimensions of as follows. For example, each of the bodies111,112may be about 75 mm (+/−10 mm) long by about 45 mm (+/−10 mm) wide by about 6.5 mm (+/−2 mm) thick (e.g. when the bodies111,112are not conjoined and as depicted inFIGS.1to6). However, such dimensions are merely an example, and the dimensions of the bodies111,112may be adapted for any suitable electrical outlet and/or junction box, for example for jurisdictions other than North America. Furthermore, when the bodies111,112are at least partially conjoined, the dimensions of the conjoined bodies may be adapted accordingly and may depend on specific types electrical outlets and/or junction boxes for which they may be further adapted. Furthermore, the listed dimensions are understood to be exterior body measurements, and walls of the bodies111,112(which may include the overmold material) may be approx. 0.5 mm (+/−1 mm) thick, such that, for example, a body111,112that is about 6.5 m externally would be about 5.5 mm. internally. Furthermore, as each of the first body111and the second body112may be rigid, as described above, such rigidity may assist the contacts121,122with electrical interaction with and/or contact with the terminals821,822. For example, as depicted inFIG.8, the contacts121,122may comprise at least one spring contact in at least a partially triangular shape and/or at least partially curved shape, and the rigidity of the bodies111,112may provide a rigid base for the spring action of the contacts121,122. Furthermore, each of the contacts121,122comprise an electrically conducting material that also may form a spring contact, such as aluminum, copper, gold, conductive gel, impregnated conductive plastic, any suitable combination thereof, and the like. Attention is further directed toFIG.9,FIG.10AandFIG.10Bwhich show details of the contact121and the terminals821. For example,FIG.9depicts a perspective view of the contact121at the device101and a location of the terminals821; in other words, inFIG.9, a body of the electrical outlet701is removed to schematically show the location of the terminals821relative to the contact121, the terminals821comprising a pair of terminals, as described above. As depicted, the contact121is contacting one of the terminals821. FIG.10Adepicts a perspective view of the contact121that is similar to that depicted inFIG.9, but with the remainder of the device101removed;FIG.10Afurther shows a location of the contacted terminal821in dashed lines.FIG.10Bdepicts a side view of the contact121in contact with one of the terminals821. With reference toFIG.10AandFIG.10B, the contact121comprises two triangular shaped spring contacts1021, at least one of which contacts one of the terminals821when the device101is inserted into the junction box801. The contact121further comprises an optional central prong1023between the spring contacts1021, and connected thereto via a base1025, the base1025for attaching the contact to a wall of the first body111adjacent the aperture105(e.g. via apertures therethrough and the like). At least one of the spring contacts1021hence contacts a terminal821and conveys AC power to the prong1023which is electrically connected to an AC input of the power supply113(e.g. via the electrical circuit of the faceplate103); for example, as best seen inFIG.10B, the central prong1023may include a step1024which connects to the electrical routing to the AC input of the power supply113(e.g. seeFIG.11, described below). Indeed, in some examples, with reference toFIG.9, the central prong1023may penetrate a respective body111,112and about 1 mm to about 2.0 mm of the central prong1023is not exposed such that the central prong1023does not contact the faceplate103and/or the front-facing edge of the respective body111,112(e.g. to meet North American electrical standards, and the like). However, the central prong1023may be optional and/or adapted to any suitable shape and/or removed, and/or the contact121may be include any suitable shape that conveys AC power to an AC input of the power supply113via the electrical circuit of the faceplate103. Furthermore, one of the contacts121,122may include the central prong1023and the other of the contacts121,122may not include the central prong1023and/or have a central prong that is reduced in length. Furthermore, the spring contacts1021may be of any suitable shape that are not triangular. For example, attention is directed toFIG.10Cwhich depicts an alternative contact121athat maybe used in place of the contact121. The contact121ais similar in shape to the contact121, but includes curved spring contacts1021ain place of the triangular shaped spring contacts1021. The contact122is similar to the contact121(and/or the contact121a), but located at the second body112and located to contact one or more of the terminals822. Hence, the contacts122convey AC power to an AC input of the power supply113, at least partially via the faceplate103. With reference toFIG.9andFIG.10A, it is understood each of the contacts121,122are centered on a long axis (e.g. length-wise) of a respective body111,112, the bodies111,112, are generally centered length-wise on the faceplate103. However, as depicted, the terminals821,822are generally not centered with respect to their position in the junction box801and/or with respect to the contacts121,122(e.g. which is common in North American electrical outlets; however, the terminals821,822may alternatively be centered with respect to their position in the junction box801and/or with respect to the contacts121,122). In some examples, the contacts121,122may be about 9 mm wide (e.g. from outside edges of the spring contacts1021) and the spring contacts1021may be separated by about 4 mm (e.g. the spring contacts1021may be about 2.5 mm wide). The contacts121,122may be about 20 mm long, for example, from an edge of the base1025opposite the spring contacts1021(and/or the central prong1023), to an end of the central prong1023that does not include the step1024. In some of these examples, the spring contacts1021may be about 2 mm to about 3 mm high. In a particular implementation, each of the contacts121,122may be centered on a long axis of aperture-facing wall of a respective body111,112, with a respective center of each of the contacts121,122may be about 37.5 mm (+/−5 mm) from each outer edge of a respective body111,112(e.g. an edge of a body111,112extending from the faceplate103that is furthest from the faceplate103). The center prong1023(e.g. when present) may terminates about 1.0 mm to about 2.0 mm before a front-facing edge of a respective body111,112(e.g. adjacent the aperture105) such that the central prong1023does not contact the faceplate103and/or the front-facing edge of the respective body111,112. Such dimensions may assist with the contacts121,122contacting the terminals821,822regardless of the orientation of the device101with respect to the junction box801. However, other shapes and/or dimensions of the contacts121,122are within the scope of the present specification. Attention is next directed toFIG.11which depicts a schematic electrical diagram of the device101. Electrical routing and/or connections and/or wiring between the electrical components of the device101are depicted inFIG.11in lines of a larger width as compared to lines showing schematic locations of the components. In particularFIG.11depicts: the contacts121,122, the power supply113, an AC input1101of the power supply113, a DC output1102of the power supply, an electrical circuit1103of the faceplate103. As depicted, the electrical circuit1103includes a controller1105, and electrical routing and/or connections between the contacts121,122and the AC input1101, as well as between the controller1105and the connectors131,132,133,134, and between the controller1105and the retractable cord135located in the retraction mechanism152. The controller1105may include any suitable processing and/or control components of the device101as described hereafter. As depicted, the electrical circuit1103comprises: electrical routing to provide AC power from the respective electrical contacts121,122to the AC input1101; electrical routing from the DC output1102to the retractable cord135(e.g. as depicted, via the controller1105); electrical routing from the DC output1102to the connectors133,134(e.g. as depicted, via the controller1105). As depicted, the electrical routing from the DC output1102to the retractable cord135and the connectors133,134is also via the controller1105, and the controller1105comprises components for providing additional functionality to the device101, as described hereafter. Furthermore, while the electrical routing from the DC output1102and the electrical routing to the connectors131,132,133,134are depicted as single lines, it is understood that the DC output1102is provided in a pair of electrical connections (e.g. for “high” and a “low” electrical output and the like). For example, as depicted, the electrical circuit1103further comprises, for example as a component of the controller1105, at least one microcontroller unit (MCU)1115configured for one or more of: internal device monitoring (e.g. to monitor, for example, current, voltage, power, temperature and the like; hence the MCU1115may include a temperature sensor, and/or the MCU1115may be in communication with a temperature sensor in the faceplate103and/or located at the power supply113); internal and external power amplitude monitoring and modulation; internal power switching; and internal device control. In other words, the controller1105and/or the MCU1115generally executes instructions and/or one or more applications (e.g. as stored in a memory, not depicted, and/or as or received via an antenna1123, described below) which implements given functionality of the device101. While only one MCU1115is depicted, the electrical circuit1103the MCU1115, may include more than one microcontroller units. In some examples, the MCU1115may be further configured to communicate with external devices connected to the connectors131,132,133,134; as such the electrical routing between the controller1105and the connectors131,132,133134, and/or the connectors131,132,133134, may be further configured for two-way data communication between the MCU1115and external devices, such that, for example, the MCU1115may query such external devices for data that may include, but is not limited to a, battery charging state of such external devices; in these examples, the MCU1115may be in communication with power supply113and/or a power control circuit of the controller1105, to control charging of the external devices accordingly, (e.g. by controlling power output to the external devices). In such examples, the MCU1115may further query an external device to determine a type thereof, which may be used to determine power output characteristics to be used to charge the external device. For example, the controller11105may further comprise, as depicted, a routing circuit1117configured to prevent power from the DC output1102from being routed to at least one electrical connector131,132,133,134when no respective external device is connected thereto, such that, when a single external device is connected to a single electrical connector131,132,133,134(e.g. and no additional external devices are connected to other electrical connectors), the power from the DC output1102is routed to the single electrical connector131,132,133,134only. The routing circuit1117may be controlled by the MCU1115and/or the routing circuit1117may comprise any suitable combination of detectors and/or switches and the like for routing power to one or more of the electrical connectors131,132,133,134. While electrical connections between the components of the controller1105are not depicted, such electrical connections are nonetheless understood to be present to route power to the electrical connectors131,132,133,134. As depicted, the electrical circuit1103further comprises a wireless local area network wireless antenna1123to provide one or more of: external connectivity, external monitoring, external control and external programming to the device101. For example, instructions maintained at the device101(e.g. as stored at a memory of the controller1105) may be updated via the antenna1123, and/or the antenna1123may be used to transmit parameters of the device101to a wireless network, for example to indicate whether an external device is connected to the device101and the like. The antenna1123may hence further enable the device101as an internet-of-things (IoT) device such that the device101may be controlled and/or monitored by an external IoT system and/or device. While not depicted, it is further understood that, when the antenna1123is present the electrical circuit1103further comprises one or more communication units and/or transceivers to implement radio functionality of the device101. The antenna1123, and associated communication units, may comprise one or more of a WiFi antenna/communication unit, a Bluetooth™ antenna/communication unit, a near-field communication (NFC) antenna/communication unit and the like, and/or any other suitable antenna/communication unit. FIG.11further schematically depicts an electrical circuit1124in communication with each of the first connector131and the second connector132. The electrical circuit1124may be integrated into the T-shaped connector136of the connectors131,132and is configured to: detect when a first external device is connected to the first connector131; and detect when a second external device is connected to the second connector132. The electrical circuit1124may hence be configured communicate such information to the MCU1115and/or the routing circuit1117such that the routing circuit1117may route power accordingly. Hence, the electrical circuit1124may be in communication with the MCU1115via the retractable cable135. In some examples, the electrical circuit1124may include similar functionality as the routing circuit1117and may be configured to prevent power from being routed to at least one electrical connector131,132when no respective external device is connected thereto, such that, when a single external device is connected to a single electrical connector131,132and no additional external devices are connected to other electrical connectors, the power is routed to the single electrical connector131,132only, or otherwise as instructed or routed by the MCU1115and/or the controller1105. Attention is next directed toFIG.12which is substantially similar toFIG.11, with like components having like numbers; however,FIG.12depicts an alternative implementation of the device101in which the retraction mechanism152, the retractable cord135and the connectors131,132(e.g. as well as the T-shaped connector136and circuit1124) is replaced by a battery1201, for example located in the second body112. In these examples the battery1201may be used to store power produced by the power supply113and/or provide power to external devices as an alternate power source to the power supply113. For example, during a power blackout and/or when the mains power supply is at least temporarily not working, the battery1201may provide power to the device101and/or one or more external devices via the connectors133,134. However, the battery1201may also be used to transmit DC power to one or more of the connectors131,132,133,134at a same rate and/or a similar rate and/or a higher rate (e.g. as compared to the power supply113), for example for short periods of time to boost an amount of charge amount delivered to an external device. In some examples, the MCU1115may control the device101(e.g. as depicted inFIG.12) to charge the battery1201during off-peak electricity rate times and discharge (e.g. to an external device) during peak electricity rate times. The battery1201may include, but is not limited to, a lithium ion battery, a lithium polymer battery, solid state battery, and/or any other suitable battery type. As such, the device101and/or the controller1105is modified, as compared toFIG.11, to include: electrical routing from the DC output1102to the battery1201(e.g. via the controller1105). Indeed, the device101as depicted inFIG.12includes electrical routing to the battery1201to charge the battery1201, and electrical routing from the battery1201to draw power therefrom; in some examples the charging and power supply electrical routing may be at least partially combined. The device101and/or the controller1105depicted inFIG.12is further modified, as compared toFIG.11, to include: a load monitor1217for at least one electrical connector133,134to firstly provide power to the at least one electrical connector133,134from onboard battery power storage (e.g. from the battery1201) and secondly provide the power to the at least one electrical connector131,132from the AC-to-DC power supply113. In these examples, the load monitor1217hence causes power to be initially provided to an external device from the battery1201and, when the battery1201drops below a given charge level, the load monitor1217may causes power to be provided to the external device from the power supply113. For example, the load monitor1217and the MCU1115are generally configured to communicate with each other, and the MCU1115may instruct the load monitor1217whether to route power to the connectors131,132,133,134from the battery1201or the power supply113. In particular, the load monitor1217monitors load on the connectors131,132,133,134and instructs and/or signals the MCU1115accordingly. Indeed, the device101and/or the controller1105is further modified, as compared toFIG.11, to include: a DC-to-DC booster circuit1218to maintain output voltage to the electrical connectors131,132,133,134when an external device is initially connected thereto. For example, when an external device is initially connected to an electrical connector131,132,133,134, and the being charged via the battery1201, a drop in voltage may initially occur; the booster circuit1218generally prevents such a drop in voltage from occurring, and may be powered by DC power from the DC output1102to boost the power output to a connector131,132,133,134. When the DC power from the DC output1102is 5V, the DC-to-DC booster circuit1218may comprise a 5V booster circuit. For example, voltage of power from the battery1201may be DC and in a range of 4.2-5V, with 4.2 V being provided when the battery12012comprises a lithium battery; when load is placed on a lithium battery, the voltage can drop to the 3V range, and the DC-to-DC booster circuit1218may hence boost the voltage accordingly to 5V. Indeed, the device101and/or the controller1105is further modified, as compared toFIG.11, to include: a battery monitor and charger1219, and the MCU1115may be further configured to monitor and charge the onboard battery power storage (e.g. the battery1201), for example by communicating with the battery monitor and charger1219, when the MCU1115determines available power storage capacity within the battery1201. Hence the battery monitor and charger1219may be used to monitor the battery1201and/or charge the battery1201. Attention is next directed toFIG.13Awhich depicts an example implementation of the power supply113. In particular, it can be challenging to provide an AC-to-DC power supply in a small package, for example, that can fit into the dimensions of the first body111and provide power to the four connectors131,132,133,134, for example when four external devices are respectively connected thereto, and further minimize power loss and/or dissipate heat (e.g. heat is a by-product of power loss) effectively when the device101is installed in the junction box801. The depicted combination of components of the power supply113depicted inFIG.13Amay address each of these issues. As depicted, the components of the power supply113depicted inFIG.13Aare mounted on, and/or attached to, and/or laid out on a PCB1301which, as depicted is shaped similar to the first body111, for example with rounded corners corresponding to the rounded corners of the first body111depicted inFIG.3. The PCB1301may further provide electrical connections between the components of the power supply113Furthermore, the components of the power supply113are depicted inFIG.13Ato show their relative position on the PCB1301. In other examples, however, the components of the power supply113may be positioned and/or packaged in any suitable manner (e.g. on a PCB). Specifically, the components of the power supply113depicted inFIG.13Acomprise a full wave rectifier1303electrically connected to the AC input1101, which is connected to the contacts121,122as described above with respect toFIG.11andFIG.12. The full wave rectifier1303generally rectifies the AC power received from the AC input1101. The power supply113further comprises a buck regulator1305in communication with the full wave rectifier1303to step down rectified AC voltage from the full wave rectifier1303to a lower voltage. For example, when the AC power received at the AC input1101is about 120V, the rectified AC voltage is about 60V, and the buck regulator1305may step down the rectified AC voltage to about 50 V, as depicted. However, the power supply113may be adapted for use with 210V-240V AC power and/or any other suitable voltage range. The power supply113further comprises a push-pull converter1306which, as depicted, comprises: a chopper circuit1307in communication with the buck regulator1305to control a duty cycle of the lower voltage rectified AC voltage; and a planar transformer1309in communication with the chopper circuit1307to further reduce voltage of the lower voltage rectified AC voltage. Further details of the chopper circuit1307and the planar transformer1309(interchangeably referred to hereafter as the transformer1309) are described below. However, the output from the push-pull converter1306generally comprises low voltage square pulses that are at a desired output voltage of the power supply113. Indeed, the output from the planar transformer1309may be 5V (e.g. at 200-300 mA). The power supply113further comprises a rectifier1313in communication with the planar transformer1309to convert electrical output of the planar transformer1309to direct current voltage. In general, the DC output1102of the AC-to-DC power supply113comprises an output of the rectifier1313. As depicted, the rectifier1313comprises a synchronous rectifier, as synchronous rectifiers are switch-based and tend to generate less heat than a diode-based rectifier. The DC output1102of the AC-to-DC power supply113may output voltages compatible with standards associated with the connectors131,132,133,134, for example DC voltage of about 5V at up to about 10 A current and/or any suitable combination of voltage and/or current. However, in a successful prototype the power supply113as depicted provided power at about 5V at a current greater than about 4 A at the DC output1102. As depicted, the power supply113further comprises a feedback circuit1315between the DC output1102(and/or an output of the rectifier1313) and the buck regulator1305, to control the direct current voltage output from the rectifier1313by controlling the lower voltage output of the buck regulator1305. The feedback circuit1315may include one or more MCUs which may be in communication with the MCU1115. For example, the feedback circuit1315is generally configured to monitor the direct current voltage output from the rectifier1313and adjust the output of the buck regulator1305to raise or lower the direct current voltage output from the rectifier1313(e.g. to maintain the output of the direct current voltage output from the rectifier1313within a given voltage range). In some examples, feedback circuit1315generally comprises a negative feedback loop which (to ensure no oscillation) works by controlling the duty cycle of the output of the buck regulator1305(e.g. output voltage and/or current). For example, by increasing the duty cycle of the buck regulator1305, the feedback circuit1315lowers the current or increases the voltage, and vice versa. In some examples, the feedback circuit1315may include an error amplifier which may measure and/or determine a difference between a reference value and output value and alters the buck current or voltage accordingly. Alternatively, and/or in addition to controlling a duty cycle of the buck regulator1305, the buck regulator1305may comprise one or more variable electrical components (e.g. resistors and/or capacitors and/or inductors, and the like), and the feedback circuit1315may control parameters of such variable electrical components to control the output of the buck regulator1305. The feedback circuit1315may comprise a processor and/or a microcontroller unit, and the like, configured to implement such functionality, and a device for measuring DC power and/or DC voltage output by the rectifier1313. As depicted, the power supply113further comprises an optocoupler1317and/or an opto-isolator between the feedback circuit1315and the buck regulator1305to maintain isolation between the AC power from the DC power in the power supply113. As depicted, the feedback circuit1315is optionally and/or alternatively configured to control the chopper circuit1307, for example to control a duty cycle and/or frequency of the chopper circuit1307to control the direct current voltage output from the rectifier1313. Hence, for example, when load on the DC output1102increases (which may be measured as a drop in DC voltage and/or DC power by the feedback circuit1315), the feedback circuit1315may decrease the duty cycle of chopper circuit to increase power output of the device101. Feedback control routing of the power supply113are depicted in dashed lines to distinguish from power routing depicted in solid lines. As depicted, the power supply further comprises an auxiliary low voltage power supply1319configured to power the chopper circuit1307. For example, as depicted, the auxiliary low voltage power supply1319may be powered by the output of the buck regulator1305. Alternatively, and/or in addition to the auxiliary low voltage power supply1319configured to power the chopper circuit1307, an auxiliary coil at the planar transformer1309may be used to at least partially power the chopper circuit1307. As mentioned previously, components of the AC-to-DC power supply113are laid out on the PCB1301. In order to fit the components into the first body111, which may have an external thickness of about 5 mm to about 8.5 mm, when respective components of the power supply113are one or more of greater than a PCB thickness (e.g. of the PCB1301), non-surface-mountable, and exceed a given maximum height above the PCB1301, the respective components may be located in cutouts of the PCB1301. Indeed, locating such components in cutouts may to assist accommodate taller (e.g. greater than the PCB1301thickness) electrical components in the power supply113while minimizing power loss to less than 20% (e.g. in a successful prototype) in the power supply113and/or assist with heat dissipation in the power supply113. For example, at least the planar transformer1309may be located in such a cutout. In general, planar transformers may be used with lower voltage DC power. Adapting the planar transformer1309of the power supply for use with AC power may be achieved by using the buck regulator1305and the chopper circuit1307to step down the AC power input into the power supply113(e.g. using the buck regulator1305) and chopping the rectified AC power of the buck regulator1305into pulses (e.g. using the chopper circuit1307). In some examples, the power supply113may be adapted to include a secondary buck regulator1351, for example between rectifier1313and the DC output1102(and after the feedback circuit1315such that the feedback circuit1315measured the output of the rectifier1313and/or the input to the secondary buck regulator). Such a secondary buck regulator1351may regulate and/or control of the DC output voltage and current from the push-pull converter1306to the DC output1102via the rectifier1313to improve and/or regulate transient responses, and the like. In general, the power supply113comprises a voltage-fed buck (regulator) plus push-pull (converter) topology; as such, while not depicted, the buck regulator1305includes an output capacitor. However, the power supply113maybe adapted to a current-fed buck plus push-pull topology in which a respective buck regulator does not include an output capacitor which may render the current-fed buck plus push-pull topology more compact than the voltage-fed buck plus push-pull topology. Furthermore, in the current-fed buck plus push-pull topology, the buck regulator (e.g. similar to the buck regulator1305) drives a respective push-pull converter (e.g. similar to the push-pull converter1306) with a current sources, which may result in reduced stress on transistors and/or MOSFETs (metal-oxide-semiconductor field-effect transistors) of the components of the power supply over an operating range, as compared to the voltage-fed buck plus push-pull topology. As depicted, the power supply113(e.g. as depicted inFIG.13A) may include one or more temperature sensors1352(e.g. one or more thermistors) in communication with the MCU1115, for example via suitable connections between the power supply113(and/or the body111) and the faceplate103; in these examples, the MCU1115receives temperature readings from the one or more temperature sensors1352to monitor the temperature of the power supply113, for example, for internal device monitoring. When the one or more temperatures sensors1352include a plurality of temperature sensors and/or reading locations, the MCU1115may receive a plurality of temperature readings and determine a temperature gradient map of the power supply11(e.g. the locations of the the plurality of the temperature sensor at the power supply113may be preconfigured at the MCU1115and/or a memory which with the MCU1115is in communication). In these examples, the MCU1115may be in communication with feedback circuit1315(e.g. via suitable connections) and signal the feedback circuit1315to control the buck regulator1305and/or the chopper circuit1307to reduce power generated by the power supply113, for example when the temperature of the power supply113(and/or a temperature of the temperature gradient map) exceeds a threshold temperature. In some of these examples,1115the MCU may alternatively control routing of reduced power to any external devices connected to the connectors131,132,133,134, for example to distribute power thereto on a priority basis (e.g. based on a charging state of respective batteries and the like, and/or any other suitable parameter). In some of these examples, as depicted, the power supply113may include at least one MCU (e.g. an optional “MCU” as indicated at the “Temperature Sensor/MCU1352) which may also measure temperature (and/or a temperature gradient map) of the power supply13via the one or more temperature sensors and control the feedback circuit1315accordingly to reduce power to in turn reduce temperature, as described above with respect to the MCU1115(e.g. such an MCU of the power supply113may be in communication with feedback circuit1315, and power reduction may be based on a threshold temperature). When both the MCU1115and an MCU of the power supply113are in communication with the feedback circuit1315, one of the MCU1115and the MCU of the power supply113may have priority and control the feedback circuit1315accordingly, and/or the MCU1115and the MCU of the power supply113may operate in tandem. Attention is next directed toFIG.13Bwhich depicts an alternative power supply113bhaving multi-phase flyback topology which comprises a rectifier1303aconnected to the AC input1101, which may be similar to the rectifier1303, and generally rectifies AC power and remove outliers therefrom. The rectifier1303adistributes power to two or more flyback circuits (e.g. as depicted “n” flyback circuits) that are connected in parallel and which operate in-synchronization and/or in-phase with each other. Each flyback circuit comprises a respective flyback controller and/or converter in communication with a planar transformer, which is in communication with a rectifier. For example, as depicted, a first flyback circuit comprises a flyback controller and/or converter1350-1in communication with a planar transformer1309a-1(which may be similar to the planar transformer1309), which is in communication with a rectifier1313a-1(e.g. a synchronous rectifier, and/or which may be similar to the rectifier1313). Similarly, as depicted, an “nth” flyback circuit comprises a flyback controller and/or converter1350-nin communication with a planar transformer1309a-n(which may be similar to the planar transformer1309), which is in communication with a rectifier1313a-n(e.g. a synchronous rectifier, and/or which may be similar to the rectifier1313). The output from the flyback circuits is combined and provided to a buck regulator1351a(which may regulate and/or control of the output of the flyback circuits to the DC output1102, similar to the buck regulator1351). In general, each of the flyback circuits converts a portion of the output of the rectifier1303afrom AC power to DC power and/or distributes such conversion therebetween. As such, each of the flyback circuits delivers a lower voltage and current (e.g. as compared to the voltage-fed buck plus push-pull topology of the power supply113ofFIG.13A) but collectively they provide a similar power output. As depicted, the power supply113aincludes a feedback circuit1315athat monitors the output from the flyback circuits and controls the flyback controllers and/or converters1350to maintain a given output power thereof. Feedback control routing of the power supply113aare depicted in dashed lines to distinguish from power routing depicted in solid lines. While not depicted the power supply113amay include an opto-coupler, similar to the optocoupler1317, between the feedback circuit1315aand the flyback controllers and/or converters1350to maintain isolation between the AC power from the DC power in the power supply113a. The power supply113include yet further types of topologies including, but not limited to a half-bridge topology (e.g. which replaces the of the push-pull converter of the in buck plus push-pull topology), which may also be referred to as a buck plus half-bridge topology. In these examples, whereas the buck plus push-pull topology includes two sets of coils that occupy about half of the volume of the planar transformer,1309the half-bridge topology may include only one set of coils equivalent to one-quarter of the number of turns in the same transformer volume. Hence, the wiring of the one coil (e.g. copper and the like) can be thicker as compared to coils of the buck plus push-pull topology, which may improve DC resistance, and which may further improve (and/or reduces losses) transformer efficiency. However, the half-bridge plus half-bridge topology includes additional capacitors over the buck plus push-pull topology and a more complicated MOSFET control circuit, for example in a chopper circuit thereof. In yet further examples, the power supply113may include, but is not limited to, a full bridge topology (e.g. a full-bridge plus half-bridge topology and/or buck plus full-bridge topology), similar to the half-bridge topology and which includes a single coil, but has four MOSFET (e.g. in a chopper circuit) and four outputs. In yet further examples, the power supply113may include, but is not limited to, one or more of forward convertor topology with active clamp/reset or without active clamp/reset. In yet further examples, the power supply113may include, but is not limited to, other isolated switch mode power supplies (SMPSs) and the like. Indeed, the power supply113may include any suitable topology and/or combination of topologies (e.g. as described herein and/or as otherwise contemplated). The planar transformer1309is next described with respect toFIG.14,FIG.15andFIG.16, which respectively depict a perspective view of the planar transformer1309, a primary side/circuit and secondary side/circuit of the planar transformer1309, and a schematic diagram of layers of the planar transformer1309. With reference toFIG.14, the planar transformer1309comprises a magnetic core1401that is less than 6.5 mm in height, and may comprise a ferrite material, but other types of magnetic materials are within the scope of the present specification. As depicted, the planar transformer is “E-shaped” with two apertures1402(e.g. each less than 6.5 mm in height) forming a central portion therebetween around which the primary circuit and the secondary circuit are wrapped, the primary circuit and the secondary circuit located for example on PCBs. However, in other examples, the magnetic core1401may be of any suitable shape and may not be E-shaped. For example, the primary circuit and the secondary circuit may comprise layers of coils of individual 2-layer PCBs, or two or more multi-layer PCBs. In some examples, the planar transformer1309comprises flame retardant 4 (FR-4) materials; for example, PCBs and/or insulating material between layers of the primary circuit and the secondary circuit of the may comprise FR-4 materials. As depicted inFIG.14, the primary circuit and the secondary circuit, and insulating material therebetween, are depicted as layers1403which extend through the apertures1402, which are depicted in dashed lines, as the apertures1402are hidden by the layers1403; the primary circuit and the secondary circuit may be referred to as being physically integrated with the magnetic core1401, as the primary circuit and the secondary circuit generally coil and/or wrap around the central portion of the magnetic core1401, as defined by the apertures1402. Also schematically depicted inFIG.14are connections1405to the primary circuit to which the chopper circuit1307may be connected (e.g. as input to the planar transformer1309), and connections1407to the secondary circuit to which the rectifier1313may be connected (e.g. as output from the planar transformer1309). However, it is understood that the depicted locations of the connections1405,1407may be varied and may depend on the physical layout of the primary circuit and the secondary circuit. For example, attention is next directed toFIG.15which depicts coils of a primary circuit1501and a secondary circuit1502of the planar transformer1309, for example located on PCBs1503(only one of which is indicated inFIG.15, however it is understood rectangles inFIG.15correspond to PCBs1503, which may include, but are not limited to, 2-layer PCBs, or two or more multi-layer PCBs, and the like). Furthermore, while the magnetic core1401is not depicted inFIG.15, it is understood that coils of the primary circuit and the secondary circuit wrap around the central portion of the magnetic core1401. As depicted, the primary circuit1501comprises: a plurality of primary coils1511on PCBs1503around the central portion of the magnetic core1401, each in a spiral shape having a center1513and an outer end1515. As depicted, only one coil1511, one center1513and one outer end1515is indicated, however, it is understood fromFIG.15that in the depicted example, the primary circuit1501comprises four primary coils1511. As depicted, respective outer ends1515of a first primary coil and a last primary coil1511(e.g. as depicted, top and bottom primary coils1511) may be communication with the chopper circuit1307. In particular, the outer ends1515of the first and last primary coils1511correspond to the connections1405. Furthermore, adjacent primary coils1511may be connected either center-to-center1513or outer end-to outer end1515, such that the plurality of primary coils1511form the primary circuit1501as a first continuous circuit in a same spiraling direction around the central portion of the magnetic core1401. For example, as depicted, the top primary coil1511and the second from the top primary coil1511inFIG.15are connected center-to-center1513, for example using vias through the PCBs1503. Similarly, as depicted, the second and third primary coils1511inFIG.15are connected outer end-to outer end1515, for example using vias through the PCBs1503. While certain directions of the spirals of the coils1511are depicted, the coils1511may spiral in any suitable direction to form the primary circuit1501. Similarly, the secondary circuit1502comprises: a plurality of secondary coils1522around the magnetic core1401, each in a circular and/or oval shape and connected to form the second circuit1502as a second continuous circuit wrapped around the central portion of the magnetic core1401. Each of the coils1522has two ends1523. As depicted, only one coil1522, and one pair of ends1523is indicated, however, it is understood fromFIG.15that in the depicted example, the secondary circuit1502comprises four secondary coils1522. As depicted, respective ends1523of a first secondary coil and a last secondary coil1522(e.g. as depicted, top and bottom secondary coils1522) may be communication with the rectifier1313. In particular, ends1523of the first and last secondary coils1522correspond to the connections1407. Furthermore, adjacent secondary coils1522may be connected end-to-end1523, such that the plurality of secondary coils1522form the secondary circuit1502as a second continuous circuit in a same spiraling direction around the central portion of the magnetic core1401. While certain directions of the spirals of the coils1522are depicted, the coils1522may spiral in any suitable direction to form the secondary circuit1502. Furthermore, in the depicted example, the coils1511,1522are selected to step down the voltage from about 50V to about 5 V. It is further understood that the planar transformer1309also comprises insulating material (e.g. the PCBs1503) between each of the plurality of primary coils1511and the plurality of secondary coils1522. Indeed, attention is next directed toFIG.16which depicts a schematic diagram of layers of the primary coils1511, the secondary coils1522, and insulating material1603. As depicted, the planar transformer1309comprises (e.g. around the central portion of the magnetic core1401), in order from top to bottom: a first layer of the insulating material1603; a first primary coil1511; a second layer of the insulating material1603; a first secondary coil1522; a third layer of the insulating material1603; a second secondary coil1522; a fourth layer of the insulating material1603; a second primary coil1511; a fifth layer of the insulating material1603; a third primary coil1511; a sixth layer of the insulating material1603; a third secondary coil1522; a seventh layer of the insulating material1603; a fourth secondary coil1522; an eighth layer of the insulating material1603; a fourth primary coil1511; and a ninth layer of the insulating material1603. Hence, the planar transformer1309has a general structure of two secondary coils1522located between two respective primary coils1511, a structure that is repeated twice in the planar transformer1309. In other configurations this structure may be repeated more than twice in the planar transformer1309, with the dimensions of the planar transformer1309adjusted accordingly. Furthermore, a successful prototype of the example planar transformer1309(e.g. which was initially based on an electrical model and confirmed using a breadboard design), for example as incorporated into a successful prototype of the power supply113as depicted inFIG.13A, provided DC output of 5V at a current of greater than about 4 A. However, other configurations and/s layouts of the planar transformer1309and primary coils1511and secondary coils1522are within the scope of the present specification. Also depicted inFIG.16is an auxiliary coil1605, for example located outside the primary coils1511and secondary coils1522, at an end of the stack of layers depicted inFIG.16(e.g. under the ninth layer of the insulating material1603), the auxiliary coil1605configured to power the chopper circuit1307. A tenth layer of the insulating material1603is provided under the auxiliary coil1605to insulate the auxiliary coil1605from the magnetic core1401. Indeed, the first layer of the insulating material1603insulates the first primary coil1511from the magnetic core1401. In general, thicknesses of each respective layer of the planar transformer1309, and in particular thicknesses of the insulating material1603, are selected to isolate the primary circuit1501from the secondary circuit1502and to minimize isolation between same-type coils (e.g. coils1511or coils1522) and to maximize isolation between different-type coils (e.g. coils1511,1522). For example, isolation between same-type coils is minimized and isolation between different-type coils to reduce loss in the planar transformer1309. Furthermore, while the power supply113ofFIG.13A, FIG.FIG.14andFIG.15is described with respect to integration with the device101, the power supply113may be used with other types of devices and/or may be provided and/or sold as a stand-alone component for use with other types of devices. Hence, while the PCB1301is of shape compatible with the first body111, the PCB1301may be of any suitable shape and size. Furthermore, other types of power supplies for use with the device101are within the scope of the present specification. For example, a power supply similar to the power supply113may be provided, but which lacks the buck regulator1305; in these examples, the feedback circuit1315may be adapted to control the chopper circuit1307to control the output of the rectifier, and the chopper circuit1307may be powered by an auxiliary power supply that draws power from the AC input1101and/or the fully wave rectifier1303. Attention is next directed toFIG.17,FIG.18,FIG.19andFIG.20which shows details of an example retraction mechanism152and connectors131,132. While the example retraction mechanism152is described with respect to being integrated with the device101, the example retraction mechanism152may be used with other types of devices and/or may be provided and/or sold as a stand-alone component for use with other types of devices. Attention is first directed toFIG.17which depicts a right-side view of the device charger101, with the wall138of the second body112removed (e.g. as compared toFIG.4). As such, the connectors131,132extending from the T-shaped connector136are shown, as well as further details of the recess137, with the electrical circuit1124depicted in dashed lines, as the electrical circuit1124is internal to the T-shaped connector136. FIG.17further depicts details of the retraction mechanism152which comprises a first geared wheel1701and a second geared wheel1702interlocked with the first geared wheel1701. As depicted, the first geared wheel1701is adjacent the button155, and the second geared wheel is adjacent the recess137and/or the T-shaped connector136. Furthermore, each of the geared wheels1701,1702are mounted on a PCB1703which may at least partially form a wall of the second body112adjacent the aperture105, and provide stiffness to the second body112. Furthermore, portions of the first geared wheel1701may comprise PCBs, as described in more detail below, for example portions of the first geared wheel1701that convey power from the DC output1102to the retractable cord135. The first geared wheel1702generally includes: a spindle1704around which the retractable cord135wraps; and respective electrical connections1705around the spindle1704from the retractable cord135to symmetrical concentric multi-ring slip rings (shown in detail inFIG.19AandFIG.19B) in electrical communication with the DC output1102of the AC-to-DC power supply113via the electrical circuit1103of the faceplate103. It is understood that the retractable cord135includes at least a “high” electrical wire and a “low” electrical wire therein, that carries the DC voltage to the connectors131,132, and the electrical connections1705are connected to respective wires of the retractable cord135. As also depicted inFIG.17, the second geared wheel1702includes a spring mechanism1707for providing tension to the first geared wheel1701, to cause the second geared wheel1702to rotate the first geared wheel1701to retract the retractable cord135, for example when the retractable cord135is extended. As depicted, the spring mechanism1707includes a spring internal to the second geared wheel1702, which is attached to the center of the second geared wheel1702, and concentrically arranged around the center of the second geared wheel1702, and further attached to an outer wall1708of the second geared wheel1702. Hence, when the second geared wheel1702turns, in response to the first geared wheel1701turning as the retractable cord135is extended from the device101(e.g. via the handle143), the spring of the spring mechanism1707tightens, placing tension on the first geared wheel1701. Returning toFIG.17, the retraction mechanism152further comprises a ratchet1709for preventing one or more of the first geared wheel1701and the second geared wheel1702from retracting the retractable cord135as the retractable cord is extended. The retraction mechanism152further comprises the button155at the front side106of the faceplate103, the button155mechanically connected to the ratchet1709, the button155configured to release the ratchet1709such that, when the button155is actuated, the second geared wheel1702turns via the spring mechanism1707to cause the first geared wheel1701to retract the retractable cord135to wrap around the spindle1704. For example, as depicted, the ratchet1709is located to engage first teeth1721of the first geared wheel1701, to prevent the first geared wheel1701from retracting the retractable cord135as the retractable cord135is extended. As each of the first teeth1721pass the ratchet1709, as the first geared wheel1701turns, a next tooth1721is engaged by the ratchet1709. However, the ratchet1709is released from engaging the first teeth1721of the first geared wheel1701when the button155is actuated (e.g. actuation of the button155causes the ratchet to rotate about a central pivot point, which disengages the ratchet1709from the first teeth1721). It is further understood that, while not depicted, the button155may include a spring mechanism to bias the button155to a position where the ratchet1709engages the first teeth1721. However, in other examples, the ratchet1709may be positioned to engage second teeth1722of the second geared wheel1702, to prevent the second geared wheel1702from retracting the retractable cord135as the retractable cord135is extended; in these examples, the ratchet1709is further adapted to be released by the button155in this position, for example, via an arm, and the like, extending from the ratchet1709to the button155. As depicted, the second geared wheel1702further comprises an arm and/or a “tooth”1730which extends from the outer wall1708(e.g. “above” the second teeth1722, seeFIG.18); in some examples, the ratchet1709may be positioned to engage the tooth1730of the second geared wheel1702, to prevent the second geared wheel1702from retracting the retractable cord135as the retractable cord135is extended. In these examples, the second geared wheel1702rotates through one turn before the tooth1730is next engaged by the ratchet1709(e.g. the ratchet engages the tooth1730each time the second geared wheel1702rotates through 360°), which may be desirable to reduce noise of the retraction mechanism152(e.g. each time the ratchet1709engages a tooth1721, a tooth1722or the tooth1730, a clicking sound may occur). Indeed, a ratio of the first teeth1721, of the first geared wheel1701, to the second teeth1722(and/or the tooth1730), of the second geared wheel1702, may be one of: greater than one; less than one; or one. While not depicted, the device101may further include guide posts to guide the retractable cord135and which may also provide strain relief as the retractable cord135is extended and/or retracted. Indeed, it is further understood that the retractable cord135is connected to the T-shaped connector136, for example via an overmold material; hence an attachment region of the retractable cord135and/or the T-shaped connector136may provide strain relief. In some examples, a length of the the retractable cord135may be between about 30 inches to about 40 inches long. In some examples, the retractable cord135may be adapted to have a cross-section that is about 3 mm wide by about 1.1 mm thick to fit into the compact space of the retraction mechanism152(e.g. around the spindle1704) when retracted. However, the retractable cord135may be shorter than 36 inches with a cross-section of about 4 mm wide by about 1.5 mm thick (this wider and thicker cord would be shorter in length in order to fit into the compact space of the retraction mechanism152(e.g. around the spindle1704)). In some examples, the retractable cord135may have a resistance of less than about 100 ohms/km. Attention is next directed toFIG.18, which depicts a side view of the geared wheels1701,1702. FromFIG.18, it is apparent that teeth1721,1722of each of the geared wheels1701,1702are at a side of the geared wheels1701,1702adjacent the PCB1703. For example, the outer wall1708of the second wheel1702extends cylindrically from the second wheel1702to contain the spring of the spring mechanism1707. While not depicted, the second geared wheel1702may further include a cover to enclose the spring of the spring mechanism1707. FromFIG.18, it is further apparent that the spindle1704of the first geared wheel1701extends perpendicularly from the first geared wheel1701, and that the retractable cord135wraps around the spindle1704, residing on a portion of the first geared wheel1701from which the first teeth1721extend. The symmetrical concentric multi-ring slip rings of the retraction mechanism152are next described with respect toFIG.19AandFIG.19Bwhich respectively depict a portion of the PCB1703at which the first geared wheel1701is supported and/or rotates and a side of the first geared wheel1701that is adjacent the PCB1703. With reference toFIG.19A, two concentric conducting rings1901,1902are located on the PCB1703, which are in electrical communication with the DC output1102of the power supply113(e.g. via the electrical circuit1103of the faceplate103). For example, one of the rings1901,1902is connected to a “high” electrical output of the DC output1102, and the other of the rings1901,1902is connected to a “low” electrical output of the DC output1102. The PCB1703further comprises an aperture1903which provides rotational support for the first geared wheel1701. With reference toFIG.19B, the first geared wheel1701comprises a plurality of prongs1911,1912(described in more detail with respect toFIG.20), each of which arranged to provide stability between the first geared wheel1701and the conductive rings1901,1902of the symmetrical concentric multi-ring slip rings, and to electrically contact the conductive rings1901,1902as the first geared wheel1701rotates. Furthermore, the plurality of prongs1911,1912may be mounted to a PCB (e.g. which may be a clover shape, and the like (and/or any suitable shape), inset in the first geared wheel1701, the PCB providing electrical connections from the plurality of prongs1911,1912to the respective electrical connections1705at the spindle1704. With brief reference toFIG.20, which depicts a perspective view of a prong1911,1912, each of the prongs1911,1912comprises a conductive spring contact with a spring portion2001that extends towards a respective conductive ring1901,1902to make electrical contact therewith. For example, comparingFIG.17,FIG.19AandFIG.19B, each of the prongs1911,1912is in electrical communication with respective electrical connections1705of the spindle1704such that, as the prongs1911,1912contact the conducting rings1901,1902, the DC output1102of the power supply113is connected to the connectors131,132. As depicted, the prongs1911are arranged to contact the larger and/or outer conducting ring1901, and the prongs1912are arranged to contact the smaller and/or inner conducting ring1902. Furthermore, eight prongs1911,1912(e.g. four of prongs1911, and four of prongs1912) are provided, arranged in an “X” pattern which provides stability to the first geared wheel1701as it rotates. Put another way, a pair of prongs1911,1912are arranged along four radii of the first geared wheel1701, the four radii being at 90° intervals. however, any suitable number of prongs1911,1912, arranged in any suitable pattern is within the scope of the present specification. FIG.19Bfurther depicts a central axle1933of the first geared wheel1701which may be supported by the aperture1903of the PCB1703. While not depicted, the PCB1703and the second geared wheel1702includes similar aperture/axle arrangement. Attention is next directed toFIG.21which depicts the device101in use with the electrical outlet701and with the T-shaped connector136extended from the recess137via the retractable cable135(depicted schematically inFIG.21), for example, when a user of the device101grabs the handle143of the T-shaped connector136and pulls the T-shaped connector136from the recess137. Attention is next directed toFIG.22which depicts the T-shaped connector in use with an external device2201; while the remainder of the device101is not depicted, it is understood that the retractable cord135is extending from the device101, similar to as depicted inFIG.21. In particular,FIG.22depicts the connector131inserted into a port of the external device2201(e.g. a cell phone, and the like), to charge the external device2201. InFIG.22, the connector131is depicted in dashed lines indicating that the connector131is plugged into the external device2201and/or is presently internal to the external device2201. Furthermore, as also depicted inFIG.22, the first flap141of the flexible cover139, that covers the connector131has been folded towards the handle143so that the connector131may be inserted into the external device2201. As the second connector132is not in use inFIG.22, the second flap142of the flexible cover139, that covers the second connector132has not been folded. However, the second flap142may also be folded towards the handle143when the second connector132is inserted into a second external device (not depicted) to charge the second external device. For example, the flexible cover139and/or the flaps141,142may comprise a silicone material and/or any other suitable flexible material. Furthermore, the flaps141,142may be biased to cover the respective connectors131,132such that when the external device2201(and/or a second external device) is disconnected from a respective connector131,132, the flaps141,142return to a covering position. Also depicted inFIG.22is the electrical circuit1124(depicted in dashed lines as the electrical circuit1124is internal to the T-shaped connector136) which may detect that the connector131is connected to the external device2201and that the connector132is not connected to an external device, which may cause power to be directed to the connector131and not the connector132. While not depicted, the T-shaped connector136may be at least partially encased in an overmolded body, and may include a plurality of PCBs which are connected and/or layered together to drive one or more of the connectors131,132(e.g. one or more of the plurality of the PCBs may include the electrical circuit1124which distributes power to the connectors131,132). The one or more PCBs (e.g. including the electrical circuit1124) are selected to fit within the overmolded body. For example, in a successful prototype the overmolded body of the T-shaped connector136is about 13.5 mm (+/−1.5 mm) tall (e.g. along the axis between the connectors131,132) by about 10 mm (+/−1 mm) deep (e.g. from front to back, or from where the handle143attaches to the flaps141,142to where the retractable cord135is attached to the T-shaped connector136) by about 6 mm (+/−1 mm) (e.g. from side to side). The shape and attachment configuration of the plurality of PCBs within the T-shaped connector136may depend on a type of the connectors131,132. In examples where the connector131comprises an Apple™ Lightning™ connector and the connector132comprises a USB-C connector, a PCB that extends from the Lightning™ connector (e.g. at a rear end) fits into an opening of a U-shaped PCB of the USB-C connector (e.g. also at a rear end), for example like a lock and key, and a third PCB may be layered on top of this lock and key PCB configuration, adjoining and electrically connecting the underlying two PCBs of the connectors131,132. In this configuration, the electrical circuit1124may be located at the third PCB, and the third PCB may be a primary electrical connection between the T-shaped connector136, the PCBs of the connectors131,132and the retractable cord135. In alternative examples of the connectors131,132, the plurality, shape and configuration of PCBs within the T-shaped connector136may be adapted to accommodate the electrical and/or physical specifications of the connectors131,132(e.g. when one or more of the connectors131,132include other types of connectors). It is further understood that each of the power supply113ofFIG.13A,FIG.14andFIG.15, the retraction mechanism152ofFIG.17,FIG.18andFIG.19, the T-shaped connector ofFIG.20andFIG.21may be implemented with devices other than the device101and/or each may be provided as stand-alone components for use or sale and/or for integration with other types of devices. Furthermore, the device101may be adapted to include other types of power supplies and/or other types of retraction mechanisms and/or other types of connectors. Furthermore, the device101may be adapted to include a battery at the second body112, for example as depicted inFIG.12, and may not comprise a retraction mechanism. Furthermore, the device101may include only charging ports at the faceplate103and may not include a retraction mechanism; in these examples, the second body112may be adapted to include the electrical contact122, and no other electrical components, with a size and shape of the second body112adapted accordingly. For example, in some examples, the second body112may comprise a rigid extension from the rear side108of the faceplate103, the rigid extension having the electrical contact122mounted thereupon with a thickness and/or material of the rigid extension configured to maintain rigidity thereof. For example, such a rigid extension may comprise a PCB with the electrical contact122mounted thereupon and electrical routing to the electrical circuit1103of the faceplate103, with suitable insulating material covering and/or encasing such electrical routing. In some examples, the device101may be adapted to include other types of devices in the second body112, including, but not limited to, communication devices such as a networking adapter and/or a power-line networking adapter powered by the power supply113; in some of these examples, the faceplate103may include a network connector at the front side106. In yet further examples, the device101may be adapted for use with ganged electrical outlets and/or junction boxes that include ganged electrical outlets; in such examples the device101and/or the faceplate103is adapted to dimensions of such ganged electrical outlets and/or junction boxes. Furthermore, the device101may include more than one aperture105, for example a respective aperture105for each ganged electrical outlet. Furthermore, in these examples, the first body111and/or the second body112maybe adapted to extend between two of the apertures105and/or between two ganged electrical outlets. Attention is next directed toFIG.23Awhich schematically depicts a top view of a device2301A similar to the device101, and including a faceplate2303A having two apertures2305A (depicted in dashed lines to indicate that the apertures2305A are through the faceplate2303A similar to the aperture105through the faceplate103), a first body2311A, a second body2312A, and a third body2313A extending from a rear side of the faceplate2303A. A first one of the bodies2311A,2312A,2313A may include a power supply, similar to the power supply113, a second one of the bodies2311A,2312A,2313A may include a retraction mechanism, similar to the retraction mechanism152, and a third one of the bodies2311A,2312A,2313A may include a battery, similar to the battery1201. Such components may be provided in the bodies2311A,2312A,2313A in any suitable combination, and the bodies2311A,2312A,2313A may include any suitable combination of components describe herein. Furthermore, in these examples, an electrical circuit of the faceplate2303A may include the components of both the examples depicted inFIG.11andFIG.12. While electrical connectors (similar to connectors131,132,133,134) are not depicted, they are nonetheless assumed to be present. Furthermore, in some examples, the device2301A may be adapted to conjoin at least two of the bodies2311A,2312A,2313A. For example, attention is next directed toFIG.23Bwhich schematically depicts a top view of a device2301B similar to the device2301A, and including a faceplate2303B having two apertures2305B (depicted in dashed lines to indicate that the apertures2305B are through the faceplate2303B), a first body2311B, a second body2312B, and a third body2313B extending from a rear side of the faceplate2303B, which contain a power supply, a retraction mechanism, and a battery. However, in contrast to the device2301A. the bodies2311A,2312B are conjoined and located between the apertures2303B. In some jurisdictions, electrical outlets (e.g. in some jurisdictions, for example in Europe) are provided with a faceplate integrated with the electrical outlet (e.g. as an integrated body), and the device101may be adapted accordingly. In these examples, the device101may not include an aperture and/or the contacts121,122. Rather, the device101may be configured to replace an existing electrical outlet and faceplate combination in a junction box, the device101adapted to include connectors to a mains power supply within the junction box. In these examples, the device101may include any suitable combination of the power supply113ofFIG.13A,FIG.14andFIG.15, the retraction mechanism152ofFIG.17,FIG.18andFIG.19, and the T-shaped connector ofFIG.20andFIG.21. For example, attention is next directed toFIG.24which depicts a perspective view of device2401, which is substantially similar to the device101, with like components having like numbers however in a “2400” series rather than a “100” series. Furthermore, while some internal and/or recessed and/or retracted components of the device2401are not depicted inFIG.24, they are nonetheless understood to be present. The device2401does not include an aperture, and is of a shape and size to replace an existing electrical outlet and faceplate integrated combination in a junction box. As depicted, the device2401includes a body2411which includes a front side2406at which at least one electrical connector is located, for example connectors2431,2432,2433,2434, respectively similar to the connectors131,132,133,134. The device2401further includes a power supply2413(which may be similar or different from the power supply113ofFIG.13A,FIG.14andFIG.15, and which is depicted in dashed lines as the power supply2413is located internal to the device2401) which powers the connectors2431,2432,2433,2434. The connectors2431,2432are also depicted in dashed lines as, like the connectors131,132, the connectors2431,2432extend from a T-shaped connector (e.g. recessed into the device2401and hence hidden inFIG.24) similar to the T-shaped connector136. Hence, the connectors2431,2432may be attached to a retraction mechanism2452(which may be similar or different from the retraction mechanism152ofFIG.17,FIG.18andFIG.19, and which is depicted in dashed lines as the retraction mechanism2452is located internal to the device2401). The connectors2431,2432hence may be attached to the retraction mechanism2452via a retractable cable (e.g. retracted into the device2401and hence hidden inFIG.24) similar to the retractable cable135. Also visible inFIG.24are a handle2445for extending the T-shaped connector and/or the connectors2431,2432and/or the retractable cable, and a button2455for causing the retraction mechanism2452to retract the T-shaped connector and/or the connectors2431,2432and/or the retractable cable. As depicted, the device2401further includes connectors2498for connecting the power supply2413to a mains power supply, for example in a junction box. While the connectors2498are schematically depicted on a top of the device2401, the connectors2498may include any suitable connectors for connecting to a mains power supply in any suitable location, for example compatible with a given electrical code in a given jurisdiction. As depicted, the device2401further comprises at least one electrical outlet2499which may also be connected to the connectors2498, and which may be used to power external devices that operate via AC power. However at least one electrical outlet2499is understood to be optional. In yet further examples, the device2401may include other components including, but not limited to, one or more switches for turning the power supply2413(and/or the at least one electrical outlet2499) on and off, one or more fuses, a battery (which may be provided in addition to the retraction mechanism2452within the body2411), and the like. In yet further examples, the device101may be adapted for use outside a junction box (and/or outside a wall), and hence may include a cord and/or a plug for plugging into an electrical outlet, for example for use as a stand-alone charging device and/or as an extension cord. For example, attention is directedFIG.25which depicts a perspective front view of the device2501that includes a faceplate2503, a body2511that bulges from a front of the faceplate2503, a T-shaped connector2536, similar to the T-shaped connector136, (and which includes two connectors similar to the connectors131,132) and two electrical connectors2533,2534similar to the connectors133,134. The device2501further includes an electrical outlet2599. While not depicted, a rear side of the device2501includes electrical prongs of a plug to enable to the device2501to be plugged into an electrical outlet on a wall, and the like, such that the rear side of the device2501is generally about flush with the front of the electrical outlet. The body2511generally includes a power supply, similar to the power supply113, a retraction mechanism and retractable cord (e.g. similar to the retraction mechanism152and retractable cord135) connected to the T-shaped connector2536, and optionally a battery. An electrical circuit of the faceplate2503further routes AC power from the plug on the rear side of the device2501to the electrical outlet2599so that devices which would otherwise plug into the electrical outlet on the wall may be plugged into the electrical outlet2599. Indeed, the devices described herein may be provided in other form factors and/or with other types of electrical outlets and devices, for other jurisdictions. For example, attention is directed toFIG.26A,FIG.26B,FIG.26CandFIG.26Deach of which a respective front side of a device2601A,2601B,2601C,2601D, each similar to the device2400and including a respective body2603A,2603B,2603C,2603D, one respective connector2631A,2631B,2631C,2631D, and a respective electrical outlet2699A,2699B,2699C,2699D. Each of the connectors2631A,2631B,2631C,2631D may be similar to one or more of the connectors131,132,133,134. When a connector2631A,2631B,2631C,2631D is extendible, a respective device2601A,2601B,2601C,2601D includes a button similar to the button155. Hence, each body2603A,2603B,2603C,2603D includes a power supply (e.g. similar to the power supply113, but adapted for an AC mains voltage of a respective jurisdiction) and, when a connector2631A,2631B,2631C,2631D is extendible, a retraction mechanism and retractable cord (e.g. similar to the retraction mechanism152and/or the retractable cord135). The respective electrical outlet2699A,2699B, respective electrical outlet2699A,2699B,2699C,2699D,2699D are generally adapted for a given jurisdiction and may be flush with the front side of a respective body (e.g. the electrical outlet2699C) or recessed (e.g. the electrical outlets2699A,2699B,2699D). Attention is directed toFIG.27A,FIG.27B,FIG.27CandFIG.27Deach of which a respective front side of a device2701A,2701B,2701C,2701D, each similar to the device2400and including a respective body2703A,2703B,2703C,2703D, one or more respective connectors2731and one or more respective electrical outlets2799. Each of the connectors2731may be similar to one or more of the connectors131,132,133,134. When a connector2731of a respective device2701A,2701B,2701C,2701D is extendible, a respective device2701A,2701B,2701C,2701D includes a button similar to the button155. Hence, each body2703A,2703B,2703C,2703D includes a power supply (e.g. similar to the power supply113, but adapted for an AC mains voltage of a respective jurisdiction) and, when a connector2731A,2731B,2731C,2731D is extendible, a retraction mechanism and retractable cord (e.g. similar to the retraction mechanism152and/or the retractable cord135). In particular, the device2701A includes one electrical outlet2799, the devices2701B,2701C each include two electrical outlets2799, and the device2701D includes three electrical outlets2799. All the electrical outlets2799are of a same type. Hence, each of the devices2701A,2701B,2701C,2701D depict different alternatives of a devices which may be sold and/or provided in a given jurisdiction, for example for different size junction boxes; in other words, each of the devices2701A,2701B,2701C,2701D are generally to be wired into a junction box. Each of the devices2701A,2701B,2701C,2701D further includes one or more respective switches2798, for example one switch2798for each electrical outlet2799, the switches2798for turning a respective electrical outlet2799on and off. The devices2701B,2701C are similar other than in the arrangement of the connectors2731and the switches2798. The device2701D further includes a fuse box2797(e.g. containing a fuse for the device2701D). Indeed,FIG.26A,FIG.26B,FIG.26CandFIG.26D, andFIG.27A,FIG.27B,FIG.27CandFIG.27D, generally show that the devices described herein may be adapted for various jurisdictions and/or incorporate other types of electrical devices including, but not limited to, switches, fuses and the like. In this specification, elements may be described as “configured to” perform one or more functions or “configured for” such functions. In general, an element that is configured to perform or configured for performing a function is enabled to perform the function, or is suitable for performing the function, or is adapted to perform the function, or is operable to perform the function, or is otherwise capable of performing the function. It is understood that for the purpose of this specification, language of “at least one of X, Y, and Z” and “one or more of X, Y and Z” can be construed as X only, Y only, Z only, or any combination of two or more items X, Y, and Z (e.g., XYZ, XY, YZ, XZ, and the like). Similar logic can be applied for two or more items in any occurrence of “at least one . . . ” and “one or more . . . ” language. The terms “about”, “substantially”, “essentially”, “approximately”, and the like, are defined as being “close to”, for example as understood by persons of skill in the art. In some embodiments, the terms are understood to be “within 10%,” in other embodiments, “within 5%”, in yet further embodiments, “within 1%”, and in yet further embodiments “within 0.5%”. Persons skilled in the art will appreciate that in some embodiments, the functionality of devices and/or methods and/or processes described herein can be implemented using pre-programmed hardware or firmware elements (e.g., application specific integrated circuits (ASICs), electrically erasable programmable read-only memories (EEPROMs), etc.), or other related components. In other embodiments, the functionality of the devices and/or methods and/or processes described herein can be achieved using a computing apparatus that has access to a code memory (not shown) which stores computer-readable program code for operation of the computing apparatus. The computer-readable program code could be stored on a computer readable storage medium which is fixed, tangible and readable directly by these components, (e.g., removable diskette, CD-ROM, ROM, fixed disk, USB drive). Furthermore, it is appreciated that the computer-readable program can be stored as a computer program product comprising a computer usable medium. Further, a persistent storage device can comprise the computer readable program code. It is yet further appreciated that the computer-readable program code and/or computer usable medium can comprise a non-transitory computer-readable program code and/or non-transitory computer usable medium. Alternatively, the computer-readable program code could be stored remotely but transmittable to these components via a modem or other interface device connected to a network (including, without limitation, the Internet) over a transmission medium. The transmission medium can be either a non-mobile medium (e.g., optical and/or digital and/or analog communications lines) or a mobile medium (e.g., microwave, infrared, free-space optical or other transmission schemes) or a combination thereof. Persons skilled in the art will appreciate that there are yet more alternative embodiments and modifications possible, and that the above examples are only illustrations of one or more embodiments. The scope, therefore, is only to be limited by the claims appended hereto. | 102,118 |
11862904 | DETAILED DESCRIPTION The following detailed description is merely exemplary in nature and is not intended to limit the application and uses. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary, or the following detailed description. As used herein, the term module refers to an application-specific integrated circuit (ASIC), an electronic circuit, a processor (shared, dedicated, or group) and memory that executes one or more software or firmware programs, a combinational logic circuit, and/or other suitable components that provide the described functionality. Turning now toFIG.1, an exemplary vehicle10equipped to connect to a trailer13of various types having various trailer13configurations is shown in accordance with various embodiments. The exemplary vehicle10is shown to include a multimodal sensing system100in accordance with various embodiments. The multimodal sensing system100provides for a system100to continuously monitor the connection status of the 7-pin trailer cable and the trailer breakaway cable and notifies the driver in case of disconnection also proactively recommending actions to be taken to mitigate potential risks. In embodiments, the breakaway cable can be broadly construed to include an electronic brake cable, or “eBrake” cable (i.e., the references to a “breakaway” cable, and “eBrake” cable are interchangeable). In embodiments, the system100monitors the connection status of the 7-pin trailer cable and the trailer breakaway cable and is initiated by a trailer presence detection module to start the connection condition monitoring feature once a trailer is detected and provides a set of sensors to monitor the multimodal sensor-based 7-pin trailer cable and breakaway cable switch/battery. System100includes an information fusion methodology to integrate the unimodal estimations taking into consideration the level of uncertainty of each sensing modality and available prior information and implements an action state machine that generates alerts and recommends actions to be taken based on the connection status taking into consideration the vehicle speed & calibratable speed threshold. In embodiments, the system100allows access of input/output devices of the trailer13to vehicle applications of the vehicle10and/or access of input/output devices of the vehicle10to trailer applications of the trailer13, and the system100can be configured to implement a distributed agreement and protocol to propagate trailer information (such as the multimodal sensor signals) within the architecture. The new trailer information can be leveraged by existing vehicle applications (e.g., brake control, active safety applications, autonomous driving applications, service/diagnostics applications, etc.) and/or to create new vehicle applications. In embodiments, the system100implements various modules or applications that include a trailer presence detection to start the connection condition monitoring feature once a trailer is detected, initiating the monitoring of the multimodal sensor-based 7-pin trailer cable and breakaway cable switch/battery, using information fusion processes to integrate the unimodal estimations and taking into consideration the level of uncertainty of each sensing modality and available prior information, and further implementing an action state machine that generates alerts and recommends actions to be taken based on the cable connection status detected which also takes into consideration the vehicle speed, and calibratable speed threshold. System100continuously monitors the connection status of the 7-pin trailer cable and the trailer breakaway cable and notifying the driver in case of disconnection and proactively recommends actions to be taken to mitigate any potential risks The system100in embodiments, includes a connection condition monitoring feature that starts by detecting the trailer presence using Trailer-Interface (TIM)-based trailer presence detection and RVC-based trailer presence detection. For example, the TIM-based trailer presence detection may detect the brake lighting current consumption to determine the trailer13presence. The RVC-based trailer presence detection module may detect a coupler at the hitch ball location in the RVC View and determine the trailer13presence. In embodiments, the system100may implement a Multimodal sensor 7-pin trailer cable monitoring module that uses vision data from rear view camera (RVC) and radio signals from ultrawideband and Bluetooth® and/or range signals from ultrasonic/radar/lidar sensor to identify the state of connection of the 7-pin trailer cable. For example, using the RVC data, the position of the 7-pin socket is fixed with respect to the rear bumper, zooming a small window and detecting cable status at this end is a feasible task. The vision-based cable detection starts by auto-detecting the region of interest referring to the center of the rear bumper. The rear bumper is then segmented based on optical flow followed by segmenting the foreground by comparing road texture. In embodiments, a color sticker may be added on the cable to assist in robustly identifying not-plugged, not firmly-plugged, or loosely-plugged cables. In embodiments, the system100may implement a multimodal sensor trailer breakaway cable monitoring module that uses vision data from RVC and radio signals from ultrawideband and Bluetooth® transmissions, and/or range signals from ultrasonic/radar/lidar sensor to identify the state of connection of the trailer breakaway cable. For example, using the RVC data, the position of the breakaway cable is continuously monitored in the RVC views. In embodiments, the system100uses applications to implement an information fusion process to integrate the unimodal estimations taking into consideration the level of uncertainty of each sensing modality and available a priori information such as image/signal quality, time of the day, and/or weather condition. Image quality is quantitively characterized using no-reference image quality assessment (NR-IQA) methods to decide whether to enhance or not and to fusion weight of the vision-based estimator. In embodiments, system100implements an action state machine that generates alerts and recommends actions for the operator when operating the vehicle trailer combo based on the connection status of the 7-Pin trailer cable and trailer breakaway cable based on vehicle speeds and calibratable speed threshold. Vehicle10is described herein as an automobile, such as a truck, a sport utility vehicle, a sedan, or other automobile type configured to tow a trailer. As can be appreciated, vehicle10is not limited to an automobile and can be another vehicle type configured to tow a trailer such as, but not limited to, a semi-truck, an off-road vehicle, a construction vehicle, a farming vehicle, etc. As depicted inFIG.1, vehicle10generally includes a chassis12, a body14, front wheels16, and rear wheels18. Body14is arranged on chassis12and substantially encloses components of vehicle10. Body14and chassis12may jointly form a frame. The vehicle wheels16-18are each rotationally coupled to the chassis12near a respective corner of the body14. As shown, vehicle10generally includes a propulsion system20, a transmission system22, a steering system24, a brake system26, a sensor system28, an actuator system30, at least one data storage device32, at least one controller34, and a communication system36to another vehicle48(or remote server system etc.). The propulsion system20may, in this example, includes an electric machine such as a permanent magnet (PM) motor. The transmission system22is configured to transmit power from the propulsion system20to the vehicle wheels16and18according to selectable speed ratios. The brake system26is configured to provide braking torque to the vehicle wheels16and18. Brake system26may, in various exemplary embodiments, include friction brakes, brake by wire, a regenerative braking system such as an electric machine, and/or other appropriate braking systems. The steering system24influences the position of the vehicle wheels16and/or18. While depicted as including a steering wheel25for illustrative purposes, in some exemplary embodiments contemplated within the scope of the present disclosure, the steering system24may not include a steering wheel. The sensor system28(i.e., the multimodal sensors) includes one or more sensing devices40a-40nthat sense observable conditions of the exterior environment and/or the interior environment of the vehicle10and generate sensor data relating thereto. The actuator system30includes one or more actuator devices42a-42nthat control one or more vehicle features such as, but not limited to, the propulsion system20, the transmission system22, the steering system24, and the brake system26. In various exemplary embodiments, vehicle10may also include interior and/or exterior vehicle features not illustrated inFIG.1, such as various doors, a trunk, and cabin features such as air, music, lighting, touch-screen display components, and the like. The data storage device32stores data that can be used in controlling the vehicle10. The data storage device32may be part of controller34, separate from controller34, or part of controller34and part of a separate system. The controller34(i.e., vehicle controller) includes at least one processor44(integrate with system100or connected to the system100) and a computer-readable storage device or media46for the multimodal sensing and applications associated with the state action machine described. The processor44(implemented for the multi-modal fusion data analysis, and the action state machine recommendations) may be any custom-made or commercially available processor, a central processing unit (CPU), a graphics processing unit (GPU), an application-specific integrated circuit (ASIC) (e.g., a custom ASIC implementing a neural network), a field-programmable gate array (FPGA), an auxiliary processor among several processors associated with the controller34, a semiconductor-based microprocessor (in the form of a microchip or chipset), any combination thereof, or generally any device for executing instructions. The computer-readable storage device or media46may include volatile and non-volatile storage in read-only memory (ROM), random-access memory (RAM), and keep-alive memory (KAM), for example. KAM is a persistent or non-volatile memory that may be used to store various operating variables while processor44is powered down. The computer-readable storage device or media46may be implemented using any of a number of known memory devices such as PROMs (programmable read-only memory), EPROMs (electrically PROM), EEPROMs (electrically erasable PROM), flash memory, or any other electric, magnetic, optical, or combination memory devices capable of storing data, some of which represent executable instructions, used by the controller34in controlling the vehicle10. The instructions (for the various multi-modal monitoring/detection/sensing actions, and state machine logic analysis with vehicle speed and threshold calibration data) may include one or more separate programs, each of which includes an ordered listing of executable instructions for implementing logical functions. The instructions, when executed by the processor44, receive and process signals (e.g., sensor data) from the sensor system28, perform logic, calculations, methods, and/or algorithms for automatically controlling the components of the vehicle10, and generate control signals that are transmitted to the actuator system30to automatically control the components of the vehicle10based on the logic, calculations, methods, and/or algorithms. Although only one controller34is shown inFIG.1, embodiments of the vehicle10may include any number of controllers34that communicate over any suitable communication medium or a combination of communication mediums and that cooperate to process the sensor signals, perform logic, calculations, methods, and/or algorithms, and generate control signals to automatically control features of the vehicle10. As an example, system100may include any number of additional sub-modules embedded within controller34which may be combined and/or further partitioned to similarly implement systems and methods described herein. Additionally, inputs to the system100may be received from the sensor system28, received from other control modules (not shown) associated with the vehicle10, and/or determined/modeled by other sub-modules (not shown) within the controller34ofFIG.1. Furthermore, the inputs might also be subjected to preprocessing, such as sub-sampling, noise-reduction, normalization, feature-extraction, missing data reduction, and the like. An autonomous system may include a Level Four system which indicates “high automation”, referring to the driving mode-specific performance by an automated driving system of all aspects of the dynamic driving task, even if a human operator does not respond appropriately to a request to intervene; and a Level Five system which indicates “full automation”, referring to the full-time performance by an automated driving system of all aspects of the dynamic driving task under all roadway and environmental conditions that can be managed by a human operator. With reference now toFIG.2, a functional block diagram illustrates the initiating, and monitoring by the multimodal sensors with the action state machine, and the trailer detection, in accordance with various embodiments. As shown, inFIG.2, the multimodal sensors210are coupled to an initiate function215that sends an initiate signal to the set of multimodal sensors based on presence detection of the trailer by either signaling from a trailer intake module presence detection system220that detects the brake lighting current consumption230of the trailer braking system, or by the rearview camera (RVC)-based trailer presence-detection system225that detects whether a coupler at the hitch location that is within the RVC view235has been coupled to the ball of the hitch of the vehicle. In embodiments, the initiate function215may be triggered by detections of either or both systems based on the trailer braking current consumption or the camera data showing the coupler at the hitch location. In embodiments, the TIM-based trailer presence detection system220(and in instances, the RVC-based trailer presence detection system225) may be communicatively coupled to one or more vehicle ports (VP), or one or more trailer ports (TP), and or integrated with one or more trailer path ports (TPP) to facilitate the communication of trailer information to the multimodal sensing systems for the trailer cable and the breakaway cable. With continued reference toFIG.2, the multimodal sensor trailer cable monitoring240(i.e., 7-Pin trailer cable or other trailer sized trailer cable pin connector), and the multimodal sensor trailer breakaway cable monitoring255both are configured to enable monitoring operating for enhanced performance based in part on priori information245that can include factors to cause adjustments in cable monitoring algorithms of time of day, weather conditions, time of year, and signal integrity. Further, output from each of the monitoring operations, for example, the 7-pin trailer cable's state of the connection (from the multimodal sensor trailer cable monitoring240), and trailer breakaway cable's state of the connection (from the multimodal sensor trailer breakaway cable monitoring255) are communicated to the action state machine250. The action state machine250with inputs from the vehicle controller of the vehicle speed and calibrated speed thresholds for a stationary vehicle, low-speed vehicle, and a high-speed vehicle generates a set of recommended actions as described inFIG.3. The multimodal sensors210provide sensing by devices including camera, radar, and Bluetooth®/Wi-Fi® operated devices of the trailer cable connection statuses that are determined by fusing together using an information fusion algorithm one or more types of signal data of the devices configured for use by the multimodal sensors that includes generated optical signal data, radio signal data, and range signal data. With reference toFIG.3,FIG.3illustrates an exemplary embodiment of the state action machine recommendations based on vehicle speed and calibratable speed thresholds of stationary, low-speed, and high-speed of the vehicle in accordance with various embodiments. InFIG.3, there is shown a set of recommendations from the action state machine for a stationary vehicle310, a vehicle at a low speed320, and a vehicle at a high speed330. The set of recommendations from the action state machine include the set of recommendations that are defined as follows: “0” for “no action” recommended, “1” for “breakaway cable alert”, “2” for “7-pin cable alert”, “3” for “safety walkthrough” recommended, “4” for recommended “vehicle brake”, “5” for “avoiding hard braking” recommended, “6” for “slowdown safely” recommended, and “7” for “pull-over” recommended. The set of recommendations of the set of 1 to 7, is merely exemplary, and it is contemplated, that the set is not limited or static, but is dynamic and may be expanded, changed, or modified depending on a variety of factors that include the location of the vehicle, the kind of trailer-vehicle combination, the roadway (highway, curvy road, straight road, incline, uphill, etc.), weather condition (i.e., time of year), congestion of vehicles on the roadway, driver profile information including operator experience, etc., and weight of the trailer and vehicle. In embodiments, the recommendations may be configured with alerts that include images of the cable statuses displayed to the operator on vehicle displays, audible alerts, and visual alerts. The recommendations may be configured with natural language processing for more sophisticated phrases, such as a recommendation for a walkthrough at a rest station in 5 miles, etc. In other embodiments, the recommendations may trigger autonomous vehicle controls such as braking of vehicle and trailer if there is a disconnection event, notification on mobile devices of the operator, and recommended vehicle operations in the near future based on historic (priori information) data or intelligent algorithms. In embodiments, inFIG.3, for a stationary vehicle310, the actions for various 7-pin and a breakaway cable (or eBrake cable) states of “ON” and “OFF” are shown in logic table302that includes for statuses of both cables connection “ON” of “0” or no action, where the 7-pin cable status is connected (or stable) but the breakaway cable status is not of “1” or an “breakaway cable alert”, likes if the 7-pin cable status OFF, and it is not connected, not stable, likely to be disconnected, etc . . . then the action state machine issues a “2” action or a “7-pin cable alert”, and finally, if neither cables are connected both have an OFF status are not stable in connection, likely to be disconnected, etc., then actions of “1-2-3” are issued by the action state machine of the “breakaway cable alert”, the “7-pin cable alert” and “3” of a recommended “safety walkthrough”. In embodiments, as the vehicle is no longer in the stationary state, and is operating towards a vehicle at low speed320or operating vice versa from a low speed320to a stationary vehicle310, the action recommendations are slightly modified to include the recommendation of “7” to “pull-over” when either or both of the cable statuses are OFF and both cables are not connected, likely to disconnect, not stable in connection, etc . . . as shown in the logic table304when the vehicle operates towards a low-speed, and the logic table306when the vehicle operated from the low-speed towards the stationary speed. As an example, when both cables are disconnected or likely to disconnect, the actions triggered with OFF statuses for both cables are 1-2-7-3 of an breakaway cable alert, 7-pin cable alert, pull-over, and safety walkthrough. When the vehicle is operating from a low speed320to a high speed330, the actions issued by the state action machine are modified slightly from those actions recommended in logic table308of “1, 2, 7 and 3” for the set of cable statuses, to include the set of actions shown in logic table312when going towards the high speed330, and the set of actions shown in logic table314when going from the high speed330to the low speed320. In logic table312, the recommendations include action “5” to avoid “hard braking” if the breakaway cable status is OFF, and if both are cable statuses are OFF, the recommended actions remain the same as at a low speed320. In logic table314when slowing down from a high vehicle speed, the recommended actions in the case of the 7-pin cable status OFF with breakaway cable status ON include “4” of recommended vehicle brake. If the breakaway cable status is OFF and the 7-pin cable status is ON, then recommended actions include “6” to slow down safely. Finally, for the high speed330, the logic table316includes if the breakaway cable status OFF, “5” and to avoid hard braking. The combinations shown in the various logic table may be programmed to include more or fewer action sets as desired based on operating data, and historic data as well as the other factors mentioned earlier. With reference toFIG.4,FIG.4illustrates functional diagrams of the range, radio, and image sensing combined with probability detection that weights the detection probability of the cable connection detections by the different multimodal sensors in the fusion process for input to the action state machine of the multimodal sensing system, in accordance with various embodiments. InFIG.4, there is for the image sensing process using the rearview camera that captures images of the 7-pin and breakaway cable connection a processing functional pipeline of the Rear View Camera (RVC)405capturing images of the cables in a sequence. Next, apply an image quality index (IQI) to determine the quality of the image for cable status detection. For example, due to motion, the image capture may be blurry and require further image stabilization, or there may be saturation of pixels due to sunlight causing the image quality to be reduced. In either case, an image quality analysis is performed at420, if the image is deemed not of sufficient quality based on a threshold quality index then an appropriate weighting435based on the IQI and/or an image enhancement415may be applied. In embodiments, the vision data from RVC405and radio signals427from ultrawideband (UWB)/Bluetooth® connected sensors, and/or range signals429from ultrasonic, radar, or lidar sensors can be used to identify the state of connection of the 7-pin trailer cable. For example, using RVC data, the position of the 7-pin socket is fixed when compared to the position of the rear bumper by zooming a small window of the 7-pin socket and detecting cable status using positional images of the 7-pin socket, the bumper, and the cable for the detection of the 7-pin cable status. In embodiments, the RVC405captures a sequence of images by auto-detecting a region of interest defined with respect to a certain location (e.g., in a middle point) of a rear bumper of the vehicle. The vehicle bumper is then segmented into a set of regions of images based on optical flow followed by more segmenting of image captures that include foreground images and making comparisons using algorithms for positional changes of the cable socket, cables, and other changes. For example, in embodiments, a color sticker may be attached to one or both or the cables to identify the cable and to assist in image detection by regional image segmentation and comparisons the tagged cable by the color sticker is likely to become loose from the socket, is not plugged in firmly or is loosely-plugged when connected. In embodiments, the radio signals427for the wireless-based 7-pin detection and brake cable detection are sent for fusing processing by the fusion processor440, with a probability factor that assesses the accuracy of the detection to the other types of multimodal sensor detections of the range signals429for the range based detection450, and the vision-based detection425. Each of the multimodal types of detection of wireless, range, and vision are each assigned appropriate probability detection factors for the detection result data that are fused together by an algorithm of the fusion processor440and sent to the action state machine445that generates actions based on the cable statutes at various calibration speed thresholds. In embodiments, the algorithm of the fusion processor440integrates the unimodal estimations taking into consideration the level of uncertainty of each sensing modality and available prior information, and is described as follows: {ConnectediffSig(wvwv+ww+wrpv+wwwv+ww+wrpw+wrwv+ww+wrpr)≥TDisconnectedotherwisepv: the probability of cable detection by vision-based estimator with variance σv;pw: the probability of cable detection by wireless-based estimator with variance σw;ps: represents the probability of cable detection by range-based estimator with variance σr; andww, wvand ws: weight to aggregate the multiple predictions. Weight is inversely proportional to the variance. Very low weight is given to the visual modality if IQI<TQ.Cs: cable connection state (connected, disconnected).T: calibratable detection threshold. With reference toFIG.5,FIG.5illustrates a functional diagram of monitoring the e-brake cable in RVC view of the cable monitoring system in accordance with various embodiments. InFIG.5in the functional flow diagram for the visual detection of the multimodal sensing system, a sequence of images capture by the RVC510are defined at stage520into a region or frame that focuses on the area of the central rear bumper of the vehicle captured in the images by the RVC view. Then the system applies a segmentation operation at stage530to the defined bumper region based on the optical flow (i.e., an optical flow is a visual technique used for motion estimation, object tracking, and activity recognition) to determine whether the cables are connected, loose, not fixed properly, etc . . . by the cable position by comparison operations of regions of the rear bumper to differences in motion of the cable position. As an example of this optical flow of the image motion that is tracked and compared, at stage540, a foreground segmentation of the image is compared to the road texture in the image for position changes and motion activity of cables. The changes and activity are analyzed by optical flow algorithms, and at stage550, a report is generated of the estimations and activities with determinations of the cable status. FIG.6illustrates a flowchart of operations of the multimodal sensor monitoring and detecting to determine the pin connector cable and the brake cable statuses, and of the range, radio, and image sensing combined with probability detection that weights the detection probability of the cable connection detections by the different multimodal sensors in a fusion process for input to the action state machine of the multimodal sensing system, in accordance with various embodiments. At step605, the cable monitoring system is initiated by a monitor function upon detection of a presence of the trailer connected to the vehicle by at least one sensor of the set of multimodal sensors integrated with the vehicle. As an example, the monitoring cable system based on an initiate signal generated by an initiate function sends a signal to the set of multimodal sensors based on presence detection of the trailer by either signaling from a trailer intake module presence detection system which detects the brake lighting current consumption of the trailer braking system, or by the rearview camera (RVC)-based trailer presence-detection system which detects whether a coupler at the hitch location that is within the RVC view has been coupled to the ball of the hitch of the vehicle. The initiate function may generate the start or initiate signal by either detection of the trailer by the power consumptions of the braking systems or vision flow detections of the trailer hitch connected at the hitch location. At step610, the cable monitoring system monitors the statuses of the set of cable connections based on connection data generated by the set of multimodal sensors integrated with the vehicle by fusing together using an information fusion algorithm one or more types of signal data from the set of multimodal sensors of optical signal data, radio signal data, and range signal data. At step615, the cable monitoring system sends detection results of cable statuses to an action state machine that generates a set of recommended actions to the operator of the vehicle trailer combination based on logical relationships of connections status of both the pin connector cable and the breakaway cable which is tied together with one or more vehicle states or operation of a stationary vehicle, a low-speed vehicle, and a high-speed vehicle. That is, the action state machine, generates one or more action sets based on a combination set of logical pairs including a cable connector state and a brake action state, and with a respective vehicle action state of the stationary vehicle, the low-speed vehicle, and the high-speed vehicle. At step620, the cable monitoring system implements an information fusion algorithm based on different weighting associated with a set of multiple probability detection inputs including probabilities of detection of the optical signal data, probabilities of detection of the radio signal data, and probabilities of detections of the range data received by one or more sensors of the set of the multimodal sensors to determine the current cable connection statuses of the set of cables coupled between the trailer and vehicle. At step625, the cable monitoring system for enhancements of the monitoring and determining of the current cable connection statuses, and particularly for better vision detection and analysis, additional information is utilized by the detection and determination algorithms that include priori information of at least signal quality, weather conditions, and time of data. While at least one exemplary embodiment has been presented in the foregoing detailed description, it should be appreciated that a vast number of variations exist. It should also be appreciated that the exemplary embodiment or exemplary embodiments are only examples, and are not intended to limit the scope, applicability, or configuration of the disclosure in any way. Rather, the foregoing detailed description will provide those skilled in the art with a convenient road map for implementing the exemplary embodiment or exemplary embodiments. It should be understood that various changes can be made in the function and arrangement of elements without departing from the scope of the disclosure as set forth in the appended claims and the legal equivalents thereof. | 31,224 |
11862905 | DETAILED DESCRIPTION This disclosure, its aspects and implementations, are not limited to the specific components or assembly procedures disclosed herein. Many additional components and assembly procedures known in the art consistent with the intended operation and assembly procedures for an electrical receptacle or electrical cord will become apparent for use with implementations of an electrical receptacle or electrical cord from this disclosure. Accordingly, for example, although particular components are disclosed, such components and other implementing components may comprise any shape, size, style, type, model, version, measurement, concentration, material, quantity, and/or the like as is known in the art for such implementing components, consistent with the intended operation of an electrical receptacle or electrical cord. In various descriptions, electrical receptacle or electrical cord is utilized, but a person of skill in the art will immediately appreciate that the description will apply equally to power taps, surge protectors, power strips, cord reels, extension cords, cord end replacements and the like which may utilize components similar to the electrical receptacle or electrical cord. FIGS.1-10illustrate various views of electrical receptacle20having a rear body22with sidewalls22A and back wall22B. A front body24which may be a separate piece from rear body22and they may be connected together while front body24includes a front surface26having at least one aperture29for receiving an electrical device200. Electrical device200may include a device face44and include a plurality of openings30and ground prong opening(s)30A and a chamber211. Electrical receptacle20may also include electrical connection screws32, yoke34, and grounding screw36as is commonly known in the electrical receptacle art. Grounding screw36may be positioned on a ground wire connection tab41having a hole43, while connection screws32may be positioned in apertures97in sidewalls22A of rear body22for accessing receiving arms96of connectors92while in rear body chamber242. Yoke may include mounting flanges35on each end with a vertical portion37having a hole37therein which is positioned to mount the yoke to rear body22at a hole (not shown) in the rear body back wall22B. Referring toFIG.1, an electrical plug38is shown separated from electrical receptacle20. Electrical plug38may include plug blades40and ground prong40A extending therefrom and having apertures42in the plug blades. While a 3 prong electrical plug and plug blades is shown, it is within the spirit and scope of the present disclosure to incorporate a two prong electrical plug or any other suitable numbers of prongs. Electrical device200may include a pointer line52on front surface44, while front surface26may include a first arrow54and a second arrow56. In the unlocked position, electrical device pointer line52is aligned with first arrow54. In the locked position, electrical device pointer line52is aligned with second arrow56. FIG.2Aillustrates devices200having a face201, a recessed portion202, an outer surface205with a rounded portion204and notches206. Notches206preferably extend from a front end208to a rear end210. Electrical contact prongs212may each include a mounting portion214and a shaft216. A first arm218and a second arm220together with a wall224form a receiving region222for receiving electrical plug blades40or ground prong40A as appropriate. Still further, electrical contact prongs for electrical plug blades40may also include projections226extending inward from either first arm218or second arm220. In one implementation, electrical contact prong arms may be curved inward to assist with retaining the electrical plug blades therein. In another implementation, the electrical plug38may be removed after a specified amount of force, such as 50 pounds of pulling force overcoming the projections226and thereby permitting the electrical plug to be removed without inadvertently dislodging the electrical receptacle. In yet another implementation, the electrical plug may only be removed when the projections226are disengaged from blade apertures90. Specifically, the electrical plug is removable from the electrical device with less than 15 pounds of removal force in the unlocked position and in one implementation between 3 to 15 pounds of force removes the plug as identified in UL498. In another implementation, the removal force in the unlocked position is between 0 and 30 pounds of removal force. A person of ordinary skill in the art will immediately appreciate that the retention force is a function of the frictional engagement between the electrical contact prong arms and/or design of projections226, both of which may be designed to provide any required plug retention force. A cap228may include a ring230and a first hole232to receive a first electrical contact prong, a second hole234to receive a second electrical contact prong, and a third hole236for receiving a third electrical contact prong. An aperture238and a slot240may also be positioned in cap228and are arranged to receive shafts248and250as will be described in greater detail below. FIGS.2B and3illustrate rear body22and various components removed from chamber242. Chamber242includes tabs244and246each having an appropriate shaft248or250. Each of tabs244and246also includes a face252or254which are used to compress electrical contact prongs212as will be discussed in greater detail below. A rotation tab255may be positioned within chamber242or may be formed as part of rear body22and includes a pivotable arm256having an end258with a protrusion260. Protrusion260moves with pivotable arm256to provide tactile feedback to the user when rotating the electrical device200. Specifically, protrusion260selectively fits within each notch206as the electrical device is rotated and helps to secure the electrical device in the current position by providing additional frictional engagement due to the protrusion260and notch206interaction. Preferably, one of notches206is aligned so that protrusion260fits therein when the electrical device is rotated to the locked position. Electrical receptacle20includes connectors92and93which include contactor ends136which are arranged to contact mounting portion214of electrical contact prongs212, while contactor ends138are arranged to contact mounting portions214of different electrical contact prong mounting portions. Ground contactor ends140connect still other electrical contact prongs212to grounding contactor142. FIG.4illustrates the electrical contactors in electrical communication with electrical contact prongs212in the unlocked position and the electrical contact prongs uncompressed. As can be seen, the electrical contact prongs212remain in contact with connectors92,93and142in the unlocked position and the locked position as shown inFIG.10. FIG.5-7illustrate electrical plug38inserted in the direction associated with arrows264into electrical receptacle20through receptacle openings30and ground prong opening30A. As can be seen, electrical plug blades40are positioned within electrical contact prongs212and specifically within retaining regions222. Projections226may be positioned at least partially within plug blade apertures40but still permit removal in this position due to the flexibility of first arm218and second arm220. Electrical continuity is achieved by the interaction between electrical contact prongs212interaction with connectors92,93, and142and screws32. This electrical continuity is then conveyed through electrical contact prongs212to the electrical plug prongs40therein. While this and other embodiments illustrate the use of a side-wired receptacle, a person of skill in the art will immediately appreciate that a back wired, side wired, hard wired, or any other suitable connection method to the structural wiring system may be utilized without departing from the spirit and scope of the present disclosure. FIGS.8-10illustrate various views of the electrical receptacle rotated in the direction associated with arrow266to the locked position. In this position, rotation tabs255are positioned with pivot arm256and protrusion260positioned within notch206to help prevent the electrical device200from rotating out of the locked position. Further, the rotation in the direction associated with arrows266orients electrical contact prongs212into a position in contact with faces252and254respectively. This rotation thereby imparts a respective force in the direction associated with arrow268which compresses electrical contact prongs212and particularly projections226into plug blade apertures42. In this manner, removal of the electrical plug38is more difficult because the additional frictional engagement increases the retention force to a desired amount, including but not limited to, force sufficient to completely prevent removal. Nevertheless, certain electrical code restrictions may require that the retention force is limited to a certain threshold before the electrical plug must be removable. As previously discussed, the electrical receptacle remains in electrical continuity throughout the full rotation between locked and unlocked positions. Still further, the faces of tabs244and246assist, in addition to other features disclosed, to limit the rotation of the electrical devices. FIG.11illustrates an electrical plug tap270having a plurality of electrical devices200therein. The electrical plug tap270may include any number of electrical devices200and the figures illustrating three electrical devices200should not be viewed as in any way limiting. Functionally, each electrical device200operates in a manner similar to the previously disclosed embodiments and therefore will not be repeated. FIG.12illustrates an electrical cord272having a cord274connected to a cord end276. Cord end276includes a cord end face278with an end chamber280having an electrical device200therein. Once again, electrical device200functions similar to previously described embodiments but is instead implemented in an electrical or extension cord to prevent an electrical plug from being inadvertently removed when the electrical device is in the locked position. FIG.13illustrates a power strip or surge protector282having a plurality of electrical devices200. Similar to power tap270, any suitable number of electrical devices200may be incorporated and the function of the electrical devices200is similar to previously disclosed embodiments. FIG.14illustrates a plurality of electrical devices200on a cord reel284. Once again, any suitable number of electrical devices200maybe incorporated and the function of the electrical devices200is similar to previously disclosed embodiments. FIG.15illustrates an electrical receptacle286having electrical devices200. In this embodiment, electrical devices200remain in a locked position until a user depresses a release button288on a front surface of the device. The release button288may be inactive when the electrical device is in any position other than the locked position. FIGS.16-24illustrate various views of an electrical cord end300connected to a cord302. Cord end300includes a body304with a first end306having a surface308with receptacle apertures310for plug blades40and receptacle aperture312for ground prong40A. First end306may include a boot314made of rubber or any other suitable pliable material which is water resistant and flexible to provide movement with first end308and is preferably assists with sealing an electrical plug38against surface308when fully inserted to limit liquids from entering the electrical cord end300. A mounting portion315connects to cord end mounting portion318with screws316. Engagement face317includes a front surface319both of which are positioned inside boot314and is also at least partially positioned within a cavity334of body304through opening330. Receptacle openings321and ground prong openings323are positioned on front surface319. Rotating face317also includes a cylindrical body320having an end324with slots322therein and tabs326with angled clips328at one end. Body304includes a front surface332with a plurality of engagement steps335,336,337, and339therein and a groove331for receiving boot314. Engagement step335corresponds with the unlocked position, while engagement steps336and339correspond to intermediate or non-stationary positions, and engagement step337corresponds with the locked position as will all be detailed below. Further, a surface333is positioned opposite surface332and forms a base of the various engagement steps. A movable ground electrical contact338includes arms340forming an opening342therein for receiving ground plug40A therein. The movable ground electrical contact338may also include a mounting portion344having a mounting aperture therein. Movable electrical contacts346include arms348defining an opening350therein for receiving plug blades40therein. One arm348of each moveable electrical contact may include a projection352extending into opening350and is used to fit within aperture42of plug blades40to help assist with retaining the electrical plug in the electrical cord end. The moveable electrical contacts are secured to the rest of the electrical cord end with mounting portions353. The cord end300also includes static contacts358,362, and354. Static contact358includes a contact surface360, while static contact362includes a contact surface364, and static contact354includes a contact surface356. In one implementation, static contacts358and362may selectively be a line/neutral line and the other may be a hot line. In most instances, static contact354is a ground contact. The static contacts354,358, and362may each be directly connected to electrical wires within cord302or any other suitable wires which may have constant electrical current as required. A movable ring366includes an inner surface380with protrusions382extending inwards. An outer surface378includes protrusions376extending outwards form the outer surface378. The movable ring366also includes a front surface368and a rear surface370. Rear surface370includes peaks372and valleys374formed between each of the peaks372. In one implementation, movable ring366is press-fit or otherwise secured to engagement face317preferably at slots322. Specifically, protrusions382may be positioned within slots322so that the movable ring366moves inwards and outwards with engagement face317during operation. A rotating ring384is engaged with movable ring366and therefore engagement face317due to its press-fit or otherwise interaction with movable ring366. Rotating ring includes an inner surface386, a front surface388, a rear surface389, and an outer surface391. A plurality of protrusions390extend outward from outer surface391and each include a rear surface394, an angled front surface392, and an engaging tip395. Angled front surface392is oriented to engage with movable ring366and the angled surface imparts a rotational movement on rotating ring384when the movable ring moves inward in the direction associated with arrow393as will be described in greater detail below. Further, the engaging tip395may follow the ramped surfaces of movable ring366instead of angled front surface392in one implementation. Cord end300also includes a spring404which is engaged with a wall403on one end. A rod396may be fixed within the cord end and includes a stop398for the contacting the engagement face if necessary and a rod top wall400, a rod wall end402, and rod side walls418which may be in engagement or next to the static and/or movable electrical contacts. Moving toFIG.19, a perspective rear view of engagement face317, a mounting structure406is shown for each movable electrical contact346. Each mounting structure406may also include an aperture408for securing a river, screw or the like therein to secure the movable contacts346at mounting portion353. Similarly, a mounting structure410is provided with an aperture412to secure movable ground contact at mounting portion344to the mounting structure410with a rivet415or similar hardware. FIGS.21and22illustrate various partial section views of the assembled cord end300. Specifically, this view illustrates the cord end in the electrical inactive position where movable contacts346and338are not contacting, directly or via other electrical communication, static contacts354,358, or362. Still further, movable contacts346each include a rear surface414,416for selectively engaging the static contacts358,362as will be shown inFIG.24. In terms of component contact, spring404interacts with wall403and rear surface394of rotating ring384. As described above, rotating ring384in turn contacts movable ring366with angled front surface392engaging with peaks372and valleys374of the movable ring to impart both inward and outward movement of movable ring366with engagement face317connected thereto as described above. In addition, the inward and outward movement imparts a rotational movement on rotating ring384to reposition protrusions376against the appropriate engagement steps335in the electrically inactive position, engagement steps339in the electrically active position, and engagement steps336/337in the intermediate positions. Spring404assists by forcing the engagement face317and other components away from the cord end until the movable ring contacts the appropriate engagement step upon compression toward the cord end. FIGS.21and22also illustrate the cord end300in the electrically inactive position with contact rear surfaces414,416and rivet415spaced apart from appropriate contact surfaces356,360, and364. Accordingly the cord end is not electrically active in this position. Still further, movable ring366engages with cavity334to prevent the engagement face317from being removed. Similarly, clips328engage with a rear surface389of rotating ring384to ensure that the engagement face317, rotating ring384and movable ring366remaining engaged and move linearly together as appropriate. FIGS.23A,23B, and23Cillustrates views of the cord end in the electrically inactive position, an intermediate position, and an electrically active position such as positioning tip395in a point397in one example for an electrically active position. When engagement face317is pushed in the direction associated with arrows418, the spring404is overcome and the angled surface392of rotating ring384follows peaks372and valleys374of movable ring366, rotates the rotating ring384in the direction associated with arrows420,422until engagement step337is contacted by the angled surface392. At this time, when the user removes the inward force, spring404forces the components in the direction associated with arrow424. In this position, the cord end300remains in an electrically active position until the engagement face is moved inward again and the spring404is again overcome. After pressing the engagement face317inward, the angled surface392again imparts rotation on the rotating ring until the electrically inactive step335or opening is aligned. When the user removes the inward pressure, the cord end moves from the electrically active position to an electrically inactive position as shown inFIGS.21and22. As discussed and shown inFIG.24, the inward movement in the direction associated with arrows428, the return force of spring404provides movement in the direction associated with arrows426until the movable and static electrical contacts are in electrical engagement. Once again, from the electrically inactive position, the cord end moves to an electrically active intermediate position shown inFIG.23Band then to an electrically active position shown inFIG.23Cwhen the user removes the inward force. From the electrically active position shown inFIG.23C, inward pressure again moves the electrical cord end to an electrically inactive position shown inFIG.23A. Accordingly, the electrical cord end300can selectively provide any suitable number of electrically active or inactive positions to both secure the electrical device and provide a safer connection for the electrical cord end because the cord end is not always electrically active. FIGS.25-27illustrate various view of a similar cord end300A having a motion sensor or current sensor to detect the presence of an electrical plug38therein. A motion sensor429includes a body430having an outer arm432, an inner arm434, and a plug blade receiving region436formed there between. While two motion sensors429are shown, it is within the spirit and scope of the disclosure to provide only a single motion sensor or three or more motion sensors depends on the type of electrical plug. Motion sensors429are powered by a controller442on a circuit board441which is used to sense the presence at the motion sensor and then provide electrical continuity to the electrical contacts as previously discussed above. The cord end300A also includes a spring biased engagement face317with spring438contacting a rotating ring440similar to the previously disclosed structure whereby inward movement yields a rotational resultant which moves the cord end300A from an electrically active position to an electrically inactive position and from an electrically inactive position to an electrically active position. In this instance, electrical plug prongs40cannot reach the motion sensor blade receiving region until the engagement face317is pushed inward in the direction associated with arrow444and moved to the electrically active position shown in dashed lines inFIG.27. The user can once again push the engagement face317inward to force the adjustment mechanism (movable ring and rotating ring) to utilize spring438to force the engagement face317in the direction associated with arrow446. Accordingly, the remaining structure and operation is similar to those embodiments described above and therefore will not be repeated for the sake of brevity. FIGS.28-40illustrate various views of a cord end500having a body502and a cord504. Body502includes a an unlocked arrow506, a locked arrow508and a pointer line510, with the pointer line510rotating with an engagement face514. Engagement face514includes a first end509with an insert511having a surface512. Insert511may be composed of rubber, silicone, or any other suitable material which may be pliable to help assist with more efficient sealing against electric plug38is inserted into receptacle apertures310and ground aperture312. Engagement face514includes a front surface516and a rear portion518with apertures520for receiving dowels522. A rear end524includes recessed regions526and projections528. Engagement face514may also include receptacle apertures310and ground aperture312. A washer530includes an inner surface532, a front surface534, a rear surface536, and an outer surface535. An adjustment ring538includes an inner surface540, an outer surface541, a front surface542, and a rear surface544. Rear surface544also includes ramped regions545with recessed regions546. Further, outer surface541also includes projections548. A ground contact550includes a pair of arms552with an opening554between the arms552. Electrical contacts556are used for hot and line/neutral contacts. Each electrical contact includes a mount558having a rear wall570and an end portion559. A static arm560extends from rear wall570and includes an apertures566in end564arranged to selectively receive a protrusion574on movable arm562at end572. Movable arm562extends through a hole576and hole576is used as leverage when end568is forced in a direction opposite the directed movement of protrusions574. A tab578also prevents the movable arm from moving too far through hole576and also assist with the leverage necessary to insert protrusion574into aperture566. A spring580is positioned within a cavity597in the assembled position. A cam device582includes an outer surface583with apertures590and windows598therein and a rear wall588. A front wall584includes a cavity592with pins586extending forward from the front wall584. A lower cam593includes walls594with a recess596. A top cam wall595is also formed in cam device582. Moving to body502, a front end591includes a recessed edge589with recesses599therein. FIG.31illustrates a front view of cam device582with a rear wall601having apertures603therein for receiving electrical contacts556. Top cam wall595and lower cam wall593each extend forward from rear wall601. A first passage600is formed in cavity592between front wall584and upper cam wall595. A projection604extends forward from rear wall601in passage600. A projection604extends forward from rear wall601in passage602. Passage602is formed in cavity592between lower cam wall593and front wall584. In one implementation, projections604interact with and are engaged with recesses526in engagement face514such that the engagement face and the cam device rotate together due to this engagement between the projections and recesses. FIG.33illustrates body502in section with a first track605and a second track607extending forward from a back wall503. First track605includes an outer wall606and a shared inner wall610forming a channel612. Channel612may include an unlocked position electrical plug prong receiving position616and a locked position electrical plug prong receiving position620. Second track607includes an outer wall608and utilizes the shared inner wall610to form a channel614. Channel614may include an unlocked position electrical plug prong receiving position618and a locked position electrical plug prong receiving position622. Body502also includes a spring channel624arranged to receive one end of spring580, while the other end contacts a rear wall588of cam device582. A hot static contact626and a neutral/line static contact628are both positioned within cavity597and are arranged to connect with mounts558of each of the electrical contacts556to provide electrical continuity when rotated to the locked position. In this manner, the cord end500may be selectively electrically inactive when in the unlocked position and electrically active in the locked position. Still further, a ground cable630extending into cavity597and connects with ground contact550. FIG.34illustrates the view before the electrical plug blades are inserted into the cord end and positioned within channels612and614at the unlocked receiving positions616and618. FIGS.35and36illustrate the electrical plug inserted into the cord end500in the direction associated with arrows632until the electrical plug is fully seated against insert511and plug blades40and ground prong40A are fully within cord end500. In this orientation, electrical contacts556are not in the locked position and plug blades40contacts only static arms560. Further, the cord end500may be electrically inactive or electrically active in this position depending on how static contacts626and628are arranged. FIG.37illustrates the cord end500with engagement face514rotated in the direction associated with arrow634to partially engage the cord end movable arm562. FIGS.38-40illustrate the cord end500with engagement face514rotated in the direction associated with arrow634to fully engage the cord end movable arm562through plug blade apertures42and static arm aperture566. Still further, this rotation positions the hot static contact626and neutral/line static contact in electrical communication with mounts558to convey electrical current through electrical contacts556and ultimately to the electrical plug blades40and ground prong40A of the electrical plug therein. As seen inFIG.39, during rotation in the direction associated with arrows634, ends568of electrical contact556remain within channels612and614and when the ends568reach the locked receiving position shown inFIG.39, the ends568are biased in a direction to force movable arm562end564in the direction associated with arrows636, thereby positioning protrusions574within apertures566. This position maintains the electrical plug within cord end500because the protrusions574extend through apertures42in plug blades40. Alternatively, if a given retention force must permit removal, the protrusions can extend only partially into apertures42to limit the retention force necessary to remove the electrical plug. As can be seen, the angle orientation of channels612and614ensures that proper movement of ends568are achieved in a small and compact structure. In order to remove the electrical plug easily and electrically de-active cord end500, the user simply rotates the engagement face514in a direction opposite arrows634until the protrusions are withdrawn from apertures42and apertures566. This movement may also electrically de-activate the cord end at electrical contacts556because electrical contacts556may no longer be in electrical communication with static contacts626and628. Referring back toFIG.36, the interaction of some components can be seen more clearly. Specifically, washer530is positioned between engagement face514and recessed edge589. While not specifically shown within recesses599, adjustment ring538is positioned with projections548within recesses599. In order to ensure a consistent rotation, engagement face514, insert511, electrical contacts556, and cam device582are connected together with dowels522at apertures520and apertures590, while electrical contacts556extend out of windows598. An additional operation feature is the increased tension provided by the adjustment ring538ramped portions545which, during rotation to the locked position, force cam device582into spring580to thereby move the entire electrical contacts556in the direction associated with arrows632. This allows compression of the insert511as shown inFIG.40due to the protrusions pulling the plug blades40at apertures42in the direction associated with arrows632during rotation to the locked position. Still further, washer530may be glued, sonically welded, or attached to the cord end in any suitable manner to prevent removal of the components during normal operation. Still further, other suitable means of securing the components may include pins or projections which limit or prevent removal of components but still allow appropriate rotation. Again, any suitable components may also be glued, welded, or otherwise attached to the cord end or each other to ensure the components are not removed during operation without departing from the spirit and scope of the present disclosure. In the locked position, the removal force may be higher. The removal force in the locked position may be between 32 and 38 pounds of removal force or between 25 and 50 pounds of removal force in another implementation. As can be seen, any suitable holding force may be utilized in the locked position between 25 to 50 plus pounds of force as the electrical code, UL, and various requirements may specify. In another implementation, the locking force may be less than 20 or 15 pounds. Accordingly, any suitable unlocked and locked force may be utilized to secure the electrical cord within the receptacle. While the above description relates to a three prong electrical plug, a similar analysis may be accomplished for a two prong electrical plug whereby the two prong electrical plug may have higher or lower removal force in the locked or unlocked positions selectively between 0 and 50 plus pounds. In another aspect, the electrical receptacle or cord end may include an electrical current control or cutoff circuit. In this instance, the electrical contact mechanisms may be electrically isolated from the electrical connection screws and other line voltage until the electrical receptacle is moved to the active, engaged, or locked position. Any of the electrical devices or electrical cords may include a control which applies a small amount of voltage to test for the presence of plug blades while a water probe is used to detect the presence of water. If the controller detects a short circuit or if the water probe detects the presence of water, electrical current is denied or shut off, even after previously flowing, to the electrical contacts. In another implementation, an indicator light may be utilized to provide user feedback on the operational status of the electrical cord or device. In another implementation, spring biased or automatically closing shutter doors may be positioned directly behind or within receptacle openings30,30A,310, and312with rubber gaskets or other suitable water resistant feature to prevent water from entering. The electrical receptacle or electrical cord may also include switches which prevent electrical current from flowing to the electrical contacts unless all relevant receptacle openings are in the open position. In another implementation, self-sealing rubber grommets or door covers are utilized which permit the electrical plug blades and ground prong to pass through but seal around the blades and prong once inserted and further refill the same electrical receptacle and cord receptacle openings once an electrical plug is removed. The electrical circuitry may also fail to energize the electrical receptacle or electrical cord when an electrical plug is only partially inserted to prevent electrocution. In another aspect, a person of skill in the art will immediately appreciate that any of the electrical receptacles or cord ends may include multiple devices on a single unit. For example, two rotating and/or locking faces may move together or independently of each other. While these and other embodiments illustrate the use of a side-wired receptacle, a person of skill in the art will immediately appreciate that a back wired, side wired, hard wired, or any other suitable connection method to the structural wiring system may be utilized without departing from the spirit and scope of the present disclosure. In another implementation, illustrated inFIGS.41through44C, an electrical receptacle700has a body702with a front plate708with a thickness703and a front surface704, a rear end706opposite the front surface704, and at least two separate and distinct prong receptacles712extending through the thickness703of the front plate708. The front plate708and the rest of the body702may be one unitary piece. The body702may be located on an electrical cord710which extends away from the rear end706. The electrical cord710may have an end configured to electrically couple with an electrical device (not shown). Alternatively, the body702may be a wall electrical device. The body702may be cylindrical. The front surface704has at least two prong receptacles712that are configured to receive an electrical plug714that has at least two electrical prongs716. FIGS.43A-43Cillustrate the electrical receptacle700when there is no electrical plug714inserted. The at least two prong receptacles712each have a first width718within the thickness703at a first layer719forming an outer front plate portion of the front plate708. The first width718is sized and shaped to receive one of the at least two electrical prongs716of the electrical plug714. The at least two prong receptacles712each also have a second width720within the thickness703at second layer721forming an inner front plate portion of the front plate708. The second width720is smaller than the first width718and is closer to the front surface704than the first width718. Because the second width720is smaller than the first width718, the portion of the thickness703that has the second width720fits tighter around the at least two electrical prongs716than does the portion of the thickness703that has the first width718. This tighter fit helps to prevent contaminants such as dirt and water from entering the at least two prong receptacles712. The electrical receptacle700with the front plate708may be implemented on any of the preceding embodiments of the locking electrical device disclosed herein. For example, the front plate708could be used on any of the embodiments shown inFIGS.11-15. In addition, the tighter fit increases the removal force required to remove the electrical plug714from the at least two prong receptacles712. In different implementations, the removal force may be between 15 and 50 pounds, between 15 and 30 pounds, between 30 and 40 pounds, between 40 and 50 pounds, between 15 and 20 pounds, between 20 and 30 pounds, less than 50 pounds, or less than 15 pounds. The removal force is adjusted by increasing or decreasing the second width720. An implementation of the electrical receptacle700may have a smaller second width720, which would create a greater removal force for that implementation, while a different implementation may have a larger second width720, and therefore a smaller removal force. The removal force is also influenced by the material chosen for the front plate708. FIGS.44A-44Cillustrate the electrical receptacle700when there is an electrical plug714inserted. As shown inFIG.44C, in some implementations the portion of the thickness703with the second width720stretches to accommodate the at least two electrical prongs716, leading the second width720to approach the first width718while the electrical plug714is inserted. It will be understood that implementations are not limited to the specific components disclosed herein, as virtually any components consistent with the intended operation of a method and/or system implementation for an electrical receptacle or cord end may be utilized. Components may comprise any shape, size, style, type, model, version, class, grade, measurement, concentration, material, weight, quantity, and/or the like consistent with the intended operation of a method and/or system implementation for an electrical receptacle or cord end. The concepts disclosed herein are not limited to the specific implementations shown herein. For example, it is specifically contemplated that the components included in a particular implementation of an electrical receptacle or cord end may be formed of any of many different types of materials or combinations that can readily be formed into shaped objects and that are consistent with the intended operation of an electrical receptacle or cord end. For example, the components may be formed of: rubbers (synthetic and/or natural) and/or other like materials; polymers and/or other like materials; plastics, and/or other like materials; composites and/or other like materials; metals and/or other like materials; alloys and/or other like materials; and/or any combination of the foregoing. Furthermore, embodiments of the electrical receptacle or cord end may be manufactured separately and then assembled together, or any or all of the components may be manufactured simultaneously and integrally joined with one another. Manufacture of these components separately or simultaneously may involve extrusion, pultrusion, vacuum forming, injection molding, blow molding, resin transfer molding, casting, forging, cold rolling, milling, drilling, reaming, turning, grinding, stamping, cutting, bending, welding, soldering, hardening, riveting, punching, plating, and/or the like. If any of the components are manufactured separately, they may then be coupled or removably coupled with one another in any manner, such as with adhesive, a weld, a fastener, any combination thereof, and/or the like for example, depending on, among other considerations, the particular material(s) forming the components. In places where the description above refers to particular implementations of an electrical receptacle or cord end, it should be readily apparent that a number of modifications may be made without departing from the spirit thereof and that these implementations may be applied to other electrical receptacles and cord ends. The accompanying claims are intended to cover such modifications as would fall within the true spirit and scope of the disclosure set forth in this document. The presently disclosed implementations are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the disclosure being indicated by the appended claims rather than the foregoing description. All changes that come within the meaning of and range of equivalency of the claims are intended to be embraced therein. | 40,095 |
11862906 | DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Before any embodiments of the application are explained in detail, it is to be understood that the application is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The application is capable of other embodiments and of being practiced or carried out in various ways. As described herein, terms such as “front,” “rear,” “side,” “top,” “bottom,” “above,” “below,” “upwardly,” and “downwardly” are intended to facilitate the description of the electrical receptacle of the application, and are not intended to limit the structure of the application to any particular position or orientation. Exemplary embodiments of devices consistent with the present application include one or more of the novel mechanical and/or electrical features described in detail below. Such features may include a compactly positioned sensing core, a vertical solenoid, and a latching mechanism including a lifting shelf, a slide mechanism, an intermediate collar, and a cam surface. In some exemplary embodiments of the present application, multiple features listed above are incorporated into one element whereas in other exemplary embodiments, each feature is distinct from one another and coupled to interact with each other. The novel mechanical and/or electrical features detailed herein efficiently utilize the space within the device housing to provide more area for additional features and/or components. FIG.1illustrates a perspective view of a GFCI receptacle10according to one embodiment of the application. The GFCI receptacle10includes a front cover12having an outlet face14with phase16, neutral18, and ground20openings. The outlet face14also has a central opening22for a reset button24adjacent to an opening26for a test button28. Rear cover36is secured to front cover12by screws (not shown or enumerated). Screw terminals38mechanically and/or electrically couple wires when wiring the receptacle10. A ground yoke/bridge assembly40includes standard mounting ears42that protrude from the ends of the receptacle10. Referring toFIG.2, the GFCI receptacle10with the front cover12, rear cover36, and tamper-resistant mechanisms (not enumerated) removed shows phase terminal30, neutral terminal32, ground terminal34, and a circuit board58. The phase, neutral, and ground terminals30,32,34are respectively configured to receive electrical plugs35of a connecting electrical device, such as a power cord. The circuit board58provides control and physical support for most of the working components of the receptacle10. The phase and neutral terminals30,32may be movable, supported and energized through bus bars44,46, respectively. Bus bars44,46act as cantilevered arms that support a set of contacts48. As shown in the embodiment ofFIG.3, the set of contacts48include a set of movable contacts48A and a set of fixed contacts48B. Bus bars44,46respectively serve as cantilevered support for the set of movable contacts48A while the set of fixed contacts48B is supported by a carrier assembly8. This configuration may be reversed or changed in other embodiments of the application not described in detail herein. In various embodiments, an indicator light L may be included in the GFCI receptacle10and configured to indicate the state of the GFCI receptacle10. The resiliency of the cantilevered support provided by the bus bars44,46bias the set of movable contacts48A away from the set of fixed contacts48B. A latching mechanism including a movable carriage, described in further detail in the following figures, is used to engage with the set of movable contacts48A, thereby pushing the set of movable contacts48A in an upward direction to engage the set of fixed contacts48B in a closed position during resetting of the GFCI receptacle10. This upward movement of the set of movable contacts48A also causes corresponding upward movement in the attached phase and neutral terminals30,32closer to the front cover12of the receptacle10. Electricity may then be delivered from an external power source to the receptacle openings16,18,20. In other embodiments, the resiliency of the cantilevered bus bars44,46may bias the set of movable contacts48A toward the set of fixed contacts48B, and a latching mechanism may be employed in reverse to engage and hold the set of movable contacts48A away from the set of fixed contacts48B in an open position during tripping of the GFCI receptacle10. The phase and neutral terminals30,32will likewise increase in distance from the front cover12, thereby prohibiting the flow of electricity between the external power source and the receptacle openings16,18,20. Various embodiments of the latching mechanism may be used by various application designs, the details of each are not disclosed in detail herein. Referring toFIG.4A, in addition to providing structural support for the set of fixed contacts48B, the carrier assembly8also provides structural support for a sense transformer core50and conductor windings52,54. In another embodiment shown inFIG.4B, the carrier assembly8may provide structural support for multiple sets of sense transformer cores50,51, as described in further detail below. Various placements of sense transformer core(s)50,51may be possible and will be further described in the following figures. FIG.5Aillustrates a perspective view of a core assembly2of the GFCI receptacle10depicted inFIG.1. A solenoid60is oriented to define a central axis A. Multiple sense transformer cores50may be stacked together and configured to receive a phase conductor winding52and a neutral conductor winding54through a common central cavity56. Additional sets of stacked sense transformer cores51may be added to the carrier assembly8(seeFIG.4B) to provide further measurements, such as arc fault measurements, to the GFCI receptacle10. The phase and neutral conductor windings52,54respectively direct AC current from the phase and neutral terminals30,32through the central cavity56, where the current may be measured for potential ground faults or arc faults. The AC current flow through the central cavity56defines a direction B, which is perpendicular to the central axis A of the solenoid60. In the embodiment ofFIG.5A, the two sets of sense transformer cores50,51are placed symmetrically at two ends of the circuit board58with current flow directions parallel to each other. This symmetrical placement allows less or essentially no interference of the sense transformer cores50,51with the phase, neutral, or ground openings16,18,20, respectively. It would be appreciated by those skilled in the art that other positioning configurations of the sets of sense transformer cores may be possible and not exhaustively described herein. For example, the current flow directions defined by multiple sets of sense transformer cores50,51may be at an angle to each other and both parallel to the circuit board58. The angle defined by the current flow directions may be acute, right, or obtuse. In another example shown inFIGS.5B-C, only one sense transformer core50may be included in the GFCI receptacle10. The sense transformer core50may be placed at either ends of the circuit board58and with various orientations to allow less or essentially no interference with the phase, neutral, and ground openings16,18,20. Referring toFIGS.6A-B, the solenoid60is coupled to a carriage62that is axially movable along the solenoid60. On one side, the carriage62is coupled to a set of carriage springs64, the compression force of which distances the carriage62from the circuit board58in a rest position. On the other side, the carriage62is configured to engage the set of movable contacts48A, which presses down on the carriage62when in an unbiased resting position. During the resetting process of the GFCI receptacle10, the carriage62will oppose the resiliency of the abutting set of movable contacts48A to advance the set movable contacts48A in an upward direction and form electrical communication with the set of fixed contacts48B. The upward movement of the set of movable contacts48A stops once electrical communication is formed with the set of fixed contacts48B. During the tripping process of the GFCI receptacle10, the resiliency of the abutting set of movable contacts48A pushes the carriage62in a downward direction back to its original rest position, thereby effectively breaking the electrical connection between the set of movable contacts48A and the set of fixed contacts48B. The downward movement range of the set of movable contacts48A is limited by a stopping plane in the solenoid support structure61. Once the set of movable contacts48A hits the stopping plane or returns to the unbiased resting position, push force is no longer exerted on the carriage62, thereby effectively halting the downward movement and limiting the maximum range of movement of the carriage62. Resetting and latching of the GFCI receptacle10may be controlled by the circuit board58that receives ground fault and arc fault signal inputs from the sense transformer cores50,51. FIG.7shows an exploded view of a solenoid assembly4of the GFCI receptacle10according to one embodiment of the present application. The solenoid assembly4includes a reset button24, a reset spring68, a solenoid60, a reset plunger assembly6, a solenoid support structure61, and a circuit board58. In some embodiments, the solenoid support structure61is coupled to the circuit board58and supports the solenoid60. When assembled as shown inFIG.8, the reset button24is biased away from the solenoid60via the reset spring68as long as no push force is exerted on the reset button24. When a push force is exerted and subsequently released on the reset button24, the compression force of the reset spring68returns the reset plunger66and the reset button24to an original resting position biased away from the solenoid support structure61. Likewise, without an externally exerted downward force, the carriage62is biased away from the circuit board58via the set of carriage springs64. The compression force of the carriage springs64returns the carriage62to an original position biased away from the circuit board58when external forces are removed. Referring toFIGS.9-11, the reset plunger assembly6includes a reset plunger66with an intermediate collar78and an armature70that is axially movable along the length of the reset plunger66. The armature70contains a slanted projection feature71that is energized by the solenoid60through which the armature70extends. The slanted projection feature71is configured to engage with the latching mechanism, which is structurally supported by the carriage62and the set of carriage springs64. The latching mechanism includes a cam surface72coupled to a lifting plate74. The lifting plate74is coupled through a slot75in the carriage62, as shown inFIG.10. The lifting plate74includes a latching portion80configured to receive and engage the intermediate collar78of the reset plunger66during resetting and tripping of the GFCI receptacle10, as shown inFIG.11. A return spring76is coupled to one end of the lifting plate74and is configured to apply a compression force against one side of the carriage62. Two exemplary embodiments of the latching mechanism are shown inFIGS.12A-C. In the two-piece latching mechanism design ofFIG.12A, the cam surface72A is configured as a separate triangular plate coupled to channels (not enumerated) in the lifting plate74A. Additionally, a set of tabs73A at one end of the lifting plate74A is configured to engage with edges of the cam surface72A to transfer a translational force from the cam surface72A to the lifting plate74A. The return spring76A is positioned between the other end of the lifting plate74A and one side of the carriage62A. The latching portion80A is configured as the only opening in the lifting plate74A and receives/engages with the intermediate collar78. In the one-piece latching mechanism ofFIGS.12B-C, the cam surface72B is integrated into the lifting plate74B as one element. Since the cam surface72B does not move independent of the lifting plate74B, coupling mechanism including channels (not enumerated) and tabs74A are not necessary in the lifting plate74B. The lifting plate74B includes an opening77B and a latching portion80B. The return spring76B is situated in the opening77B and exerts a compression force between edges of the opening77B and one side of the carriage62B. The latching portion80B is configured to receive/engage with the intermediate collar78. It would be appreciated by those skilled in the art that other design possibilities not detailed herein may serve to achieve essentially the same results and do not deviate from the teachings of the present application. According to one embodiment shown inFIG.13, a contact spring82is coupled to the bottom of the lifting plate74. When in an unlatched pushing state as described in further detail below, the contact spring82will form electrical communication with at least one contact pads (not shown or enumerated) on the circuit board58. This electrical communication will provide a communication signal and power from the circuit board58to the solenoid60, thereby energizing the armature70and resetting the GFCI receptacle10. The GFCI receptacle10according to embodiments of the present application has four different states: 1) unlatched state or tripped state, 2) unlatched pushing state, 3) latched pulling state, and 4) latched state or reset state. During the tripped state ofFIGS.14A-B, the carriage62is in a resting position biased away from the circuit board58via carriage springs64, so the contact spring82(not shown) does not form electrical communication with at least one contact pads (not shown or enumerated) on the circuit board58. The set of movable contacts48A does not engage with the set of fixed contacts48B (not shown), and the receptacle terminals30,32,34remain biased away from the receptacle openings16,18,20via cantilevered bus lines44,46. Therefore, the solenoid60does not receive external power and is not energized, causing the slanted projection feature71of the armature70to bias away from cam surface72(FIG.14B). There is no compression force in the return spring76, and the engaging portion80of the lifting plate74is not aligned to receive the intermediate collar78biased away from the lifting plate74. Once a downward pushing force is received on the reset plunger66from a user pushing down on the reset button24, the GFCI receptacle10enters the unlatched pushing state ofFIG.15. In the unlatched pushing state, the downward force pushes the reset plunger66towards the lifting plate74until the intermediate collar78engages with an upper surface of the engaging portion80. Because the engaging portion80is misaligned with the intermediate collar78from the previous tripped state, the intermediate collar78engages with but does not latch to the upper surface of engaging portion80. Thus, the downward force from the intermediate collar78transfers to the engaging portion80and the lifting plate74, which results in downward movement of the carriage62via the slot75(FIG.10). This downward movement continues until the contact springs82(not shown) form electrical communication with at least one contact pads (not shown or enumerated) on the circuit board58. Upon contact, electrical power and communication is sent from the circuit board58to the solenoid60, energizing the solenoid on a positive half cycle of the input AC power and moving the armature70axially along the reset plunger66. Referring toFIG.16, the slanted projection feature71of the armature70engages with the cam surface72, which translates the downward force to a translational force parallel to the circuit board58. Translational movement of the cam surface72also translationally moves the coupled lifting plate74against the compression force of the return spring76, thus aligning the engaging portion80with the intermediate collar78. Referring toFIG.17, the continued downward force on the reset plunger66applied by the user causes the intermediate collar78to travel through the aligned engaging portion80. At this point, the solenoid60de-energizes on a negative half cycle of the input AC power and retracts axially along the reset plunger66, as shown inFIG.18. The compression force of the return spring76pushes the side of the carriage62and returns the lifting plate74and cam surface72back to the original position. In this original position, the intermediate collar78is once again misaligned with the engaging portion80. When the user releases the downward pushing force on the reset plunger66, the reset spring68provides an upward pulling force on the reset plunger66and intermediate collar78, thereby latching and locking the intermediate collar78to a lower surface of the engaging portion80. Hence, the GFCI receptacle10enters the latched pulling state of the resetting process. When the GFCI receptacle10is in the latched pulling state shown inFIG.19, the compression force of the reset spring68creates an upward force on the reset button24and the coupled reset plunger66. This upward force pulls the intermediate collar78along with the latched lifting plate74, which is coupled to the carriage62via the slot75, causing the carriage62to move axially upward along the solenoid60. The axially upward movement of the carriage62opposes the resiliency of the abutting set of movable contacts48A and disconnects the contact springs82(not shown) from the at least one contact pads (not shown or enumerated) on the circuit board58, thus preventing continued energizations of the solenoid60. The carriage62engages with the set of movable contacts48A to form electrical connection with the set of fixed contacts48B. Correspondingly, the receptacle terminals30,32,34also resist the cantilevered bus lines44,46and move closer to the front cover12. Once electrical communication between the set of movable contacts48A and the set of fixed contacts48B is formed, electricity may be delivered from the receptacle terminals30,32,34to the receptacle openings16,18,20via the bus lines44,46. Hence, the GFCI receptacle10is fully reset. When the sense transformer cores50,51detect the present of a fault, the GFCI receptacle10completes a tripping process. During the tripping process, the GFCI receptacle10experiences the states of the resetting process in reverse order, thereby unlatching the intermediate collar78from the latching portion80and breaking the electrical communication between the set of movable contacts48A and the set of fixed contacts48B. FIGS.20&21illustrate a GFCI receptacle10according to some embodiments. In the illustrated embodiment, the GFCI receptacle10includes a printed circuit board90. In some embodiments, the printed circuit board90includes one or more slots, or apertures,92. As illustrated, the slots92may be configured receive, or be placed over, line conductors94and/or the neutral conductors96, or a portion thereof (for example, bus bars44,46). The printed circuit board90may further include, or be coupled to, coils (for example, transformer cores50,51), which may be used to sense and/or monitor a current. In such an embodiment, the coils may also include a slot, aperture, configured to receive, or be placed over, the line conductors and/or the neutral conductors, or a portion thereof (for example, bus bars44,46). In certain other embodiments, additional elements, such as springs, contacts, etc., may be included in various places within the GFCI receptacle10to accomplish resetting or tripping of the device. All combinations of embodiments and variations of design are not exhaustively described in detail herein. Said combinations and variations are understood by those skilled in the art as not deviating from the teachings of the present application. | 19,906 |
11862907 | DETAILED DESCRIPTION TO EXECUTE THE INVENTION [Description of Embodiments of Present Disclosure] First, embodiments of the present disclosure are listed and described. (1) The present disclosure is directed to a connector with cable in which a connector is connected to an end part of a cable, the connector with cable including a cable having a wire, a sheath and a braided member interposed between the wire and the sheath, the braided member being formed by braiding conductive wire materials, the braided member being provided with a folded portion formed by folding the braided member exposed from an end of the sheath toward the sheath, a sleeve made of metal, the sleeve being externally fit to an outer surface of the sheath inside the folded portion in a radial direction of the cable, a shield member made of metal, the shield member having a barrel for sandwiching the folded portion between the sleeve and the barrel while being crimped to an outer surface of the folded portion, and a housing covered with the shield member, wherein the barrel is formed with a barrel-side protrusion projecting radially inwardly of the cable at a position behind a rear end part of the sleeve in an axial direction of the cable, and a sleeve-side protrusion projecting radially outwardly of the cable is formed on a rear end part of the sleeve. According to the above configuration, a contact area of the barrel-side protrusion and the rear end part of the sleeve is increased as compared to the case where the sleeve-side protrusion projecting radially outwardly of the cable is not formed. In this way, a fixing force of the cable and the connector can be improved. (2) Preferably, a tapered surface expanded in diameter toward a rear side is formed on an inner surface of a rear end edge of the sleeve. According to the above configuration, in inserting the cable into the sleeve from behind the sleeve, the tapered surface and the cable slide in contact with each other, whereby the cable is guided into the sleeve. As a result, since the efficiency of an operation of inserting the cable into the sleeve can be improved, the manufacturing efficiency of the connector with cable can be improved. (3) Preferably, an escaping portion for allowing an inner edge part in the radial direction of the cable, out of the barrel-side protrusion, to escape with the barrel crimped to the outer surface of the folded portion is formed to be recessed radially outwardly of the cable on a projecting end edge projecting radially inwardly of the cable, out of the barrel-side protrusion. According to the above configuration, even if a metal plate material concentrates on the projecting end edge of the barrel-side protrusion in a state after the barrel is crimped to the cable, the formation of creases in the barrel-side protrusion is suppressed. (4) Preferably, the barrel is provided with a plurality of the barrel-side protrusions spaced apart in the circumferential direction of the cable. According to the above configuration, since the contact area of the barrel protrusion and the rear end edge of the sleeve can be increased as compared to the case where one barrel protrusion is provided, the fixing force of the cable and the connector can be improved. [Details of Embodiments of Present Disclosure] Hereinafter, embodiments of the present disclosure are described. The present invention is not limited to these illustrations and is intended to be represented by claims and include all changes in the scope of claims and in the meaning and scope of equivalents. <First Embodiment> A first embodiment according to the present disclosure is described with reference toFIGS.1to9. As shown inFIG.1, this embodiment relates to a connector with cable12in which a connector11is connected to an end part of a cable10. In the following description, a direction indicated by an arrow Z is referred to as an upward direction, a direction indicated by an arrow Y is referred to as a forward direction and a direction indicated by an arrow X is referred to as a leftward direction. Further, for a plurality of identical members, only some may be denoted by a reference sign and the other members may not be denoted by the reference sign. [Cable10] As shown inFIG.2, the cable10includes wires13(two in this embodiment), a braided member14surrounding the outer peripheries of the wires13and a sheath15made of insulating synthetic resin and surrounding the outer periphery of the braided member14. Although not shown in detail, the wire13includes a core and an insulation coating made of insulating synthetic resin and surrounding the outer periphery of the core. An arbitrary metal such as copper, copper alloy, aluminum or aluminum alloy can be appropriately selected as a metal constituting the core if necessary. In this embodiment, copper or copper alloy is used. An unillustrated terminal is connected to the tip of the wire13. The braided member14is formed by braiding a plurality of conductive wire materials into a tubular shape. The conductive wire materials are not particularly limited, but are wire materials made of metal in this embodiment. An arbitrary metal such as copper or copper alloy can be appropriately selected as a metal constituting the wire materials made of metal if necessary. Wire materials made of synthetic resin and covered with a metal foil may be, for example, used as the conductive wire materials. As shown inFIG.1, the sheath15in a front end part of the cable10(front end part in an axial direction of the cable10) is stripped. In this way, the wires13and the braided member14are exposed from an end of the sheath15. The braided member14exposed from the end of the sheath15includes a folded portion18folded toward the end of the sheath15. In other words, the folded portion18is shaped by folding the braided member14exposed forward in the axial direction from a front end part of the sheath15rearward in the axial direction. Note that the axial direction of the cable10is described as a direction parallel to a front-rear direction in this embodiment. The folded portion18is formed to overlap on the sheath15of the cable10from a radially outer side of the cable10. [Sleeve19] As shown inFIG.1, the sleeve19is made of metal and formed into a hollow cylindrical shape. An arbitrary metal such as copper, copper alloy, aluminum or aluminum alloy can be appropriately selected as a metal constituting the sleeve19if necessary. In this embodiment, copper or copper alloy is used. As shown inFIG.3, a sleeve-side protrusion20projecting radially outwardly of the sleeve19is formed on a rear end part of the sleeve19. The sleeve-side protrusion20according to this embodiment is continuously formed in a circumferential direction of the sleeve19. A tapered surface21expanded in diameter toward a rear side is formed at a position corresponding to the sleeve-side protrusion20on the inner surface of the sleeve19. [Connector11] As shown inFIG.1, the connector11includes a shield member40made of metal and a housing41covered with the shield member40. [Housing41] The housing41is formed by injection molding an insulating synthetic resin material. The housing41has a substantially rectangular parallelepiped shape. The unillustrated terminals are accommodated inside the housing41. [Shield Member40] As shown inFIG.1, the shield member40is formed by press working a metal plate material into a predetermined shape. An arbitrary metal such as copper, copper alloy, aluminum or aluminum alloy can be appropriately selected as a metal constituting the shield member40if necessary. In this embodiment, copper or copper alloy is used. As shown inFIG.1, the shield member40includes a first shield member22arranged on a lower and a second shield member23to be mounted on an upper side of the first shield member22. Note that a vertical direction is used for the convenience of description and does not limit the configuration of the shield member40. As shown inFIG.1, the first shield member22is formed by press working the metal plate material into a predetermined shape. The first shield member22includes a tube portion27having a tubular shape, an inclined portion28obliquely extending to a lower-rear side from a rear end part of the tube portion27and a tongue piece29extending rearward from a rear end part of the inclined portion28. The tube portion27is in the form of a rectangular tube extending in the front-rear direction and flat in the vertical direction. The housing41is inserted into the tube portion27from behind and accommodated therein. The housing41is held inside the tube portion27not to come out rearward by a known technique such as a locking structure. The inclined portion28is connected to the lower wall of the tube portion27and parts of both left and right side walls of the tube portion27near a lower end part, and extends obliquely to the lower-rear side. The tongue piece29extends rearward from the vicinity of a lateral center of the rear end part of the inclined portion28. The tongue piece29is in the form of a plate elongated in the front-rear direction. [Second Shield Member23] As shown inFIG.1, the second shield member23includes an upper wall25and side walls26extending downward from both left and right side edges of the upper wall25. Fixing pieces34to be crimped to wind around the lower wall of the tube portion27of the first shield member22extend on the lower end edges of the side walls26. As shown inFIG.2, the fixing pieces34are crimped to wind around the lower wall of the tube portion27, whereby the first and second shield members22,23are integrally assembled. A barrel30is formed behind the upper wall25and the side walls26. The barrel30is formed to be open downward in a state before being crimped to the cable10. The barrel30is crimped to wind around the folded portion18of the cable10from outside, whereby the first and second shield members22,23and the cable10are connected. As shown inFIG.5, two right opening preventing pieces35extending downward are formed on the right lower end edge of the barrel30while being spaced apart in the front-rear direction. One left opening preventing piece36extending downward is formed on the left lower end edge of the barrel30. When viewed from right, the left opening preventing piece36is formed to be located between the two right opening preventing pieces35in the front-rear direction. As shown inFIG.5, a right locking portion37is formed on the tip of the right opening preventing piece35. The right locking portion37is formed by folding and bending a tip part of the right opening preventing piece35inward. Further, a left locking portion38is formed on the tip of the left opening preventing piece36. The left locking portion38is formed by folding and bending a tip part of the left opening preventing piece36inward. As shown inFIG.6, with the barrel30crimped to the outer periphery of the cable10, the right locking portions37of the right opening preventing pieces35are in contact with the left side edge of the tongue piece29from left. In this way, the right opening preventing pieces35are suppressed from being opened rightward due to springback. As shown inFIG.6, with the barrel30crimped to the outer periphery of the cable10, the left locking portion38of the left opening preventing piece36is in contact with the right side edge of the tongue piece29from right. In this way, the left opening preventing piece36is suppressed from being opened leftward due to springback. (Barrel-Side Protrusions32) As shown inFIG.5, a plurality of (four in this embodiment) barrel-side protrusions32project radially inwardly of the cable10on the rear end edge of the barrel30while being spaced part in a circumferential direction of the cable10. The barrel-side protrusions32have a substantially rectangular shape with rounded corners when viewed from behind. The barrel-side protrusions32are bent radially inward substantially at a right angle from the rear end edge of the barrel30. As shown inFIG.7, the rear end edge of the barrel-side protrusion32is formed to be substantially flush with that of the barrel30. In other words, the barrel-side protrusion32does not project further rearward than the rear end edge of the barrel30. In this way, the interference of the barrel-side protrusion32with a tool for press working or the like can be suppressed in press working the barrel30. As shown inFIG.8, with the barrel30crimped to the outer periphery of the folded portion18, the barrel-side protrusions32are disposed at a position behind a rear end part of the sleeve19in the axial direction of the cable10. A projecting diameter of the barrel-side protrusions32radially inwardly of the cable10is so set that the barrel-side protrusions32are lockable to the rear end edge of the sleeve19from behind in the axial direction of the cable10with the barrel30crimped to the outer periphery of the folded portion18. In this way, the barrel-side protrusions32come into contact with the rear end edge of the sleeve19from behind in the axial direction if a force is applied to pull the cable10rearward in the axial direction (seeFIG.9). As shown inFIG.8, in a state where the cable10is not pulled rearward in the axial direction, the rear end edge of the sleeve19and the front surfaces of the barrel-side protrusions32may be in contact or may be separated. The plurality of barrel-side protrusions32on the rear end part of the barrel30are bilaterally symmetrically arranged when viewed from behind. In this way, the sleeve19can be received by the bilaterally symmetrically arranged barrel-side protrusions32when the cable10is pulled rearward in the axial direction. Thus, it can be suppressed that a force is applied to specific barrel-side protrusion(s)32in a biased manner (Manufacturing Process of Connector with Cable12) Next, an example of a manufacturing process of the connector with cable12is described. Note that the process of the connector with cable12is not limited to the following process. The sheath15of the cable10is stripped over a predetermined length. In this way, the wires13and the braided member14are exposed from the sheath15. A pipe made of metal is cut to a predetermined length and one end part of the cut pipe is expanded in diameter by drawing, thereby forming the sleeve-side protrusion20and the tapered surface21. The sleeve19is externally fit at a position near the front end part of the sheath15. The braided member14exposed from the front end part of the sheath15is folded toward the front end part of the sheath15. In other words, the braided member14exposed from the front end part of the sheath15is folded rearward in the axial direction of the cable10. In this way, the folded portion18is formed outside the sleeve19in the radial direction of the cable10. On the other hand, the first and second shield members22,23are integrally assembled by crimping the fixing pieces34of the second shield member23to the tube portion27of the first shield member22. Subsequently, the barrel30is crimped to wind around the outer periphery of the folded portion18. In this way, the barrel30and the folded portion18are electrically and physically connected. In the above way, the connector with cable12is completed. [Functions and Effects of Embodiment] Next, functions and effects of this embodiment are described. This embodiment relates to the connector with cable12in which the connector1is connected to the end part of the cable10and which includes the cable10having the wires13, the sheath15and the braided member14interposed between the wires13and the sheath15, the braided member14being formed by braiding the conductive wire materials, the braided member14being provided with the folded portion18formed by folding the braided member14exposed from the end of the sheath15toward the sheath15, the sleeve19made of metal and externally fit to the outer surface of the sheath15inside the folded portion in the radial direction of the cable10, the shield member40made of metal and having the barrel30for sandwiching the folded portion18between the sleeve19and the barrel30with the barrel30crimped to the outer surface of the folded portion18, and the housing41covered with the shield member40, wherein the barrel30is formed with the barrel-side protrusions32projecting radially inwardly of the cable10at the position behind the rear end part of the sleeve19in the axial direction of the cable10, and the sleeve-side protrusion20projecting radially outwardly of the cable10is formed on the rear end part of the sleeve19. According to this embodiment, a contact area of the barrel-side protrusion32and the rear end part of the sleeve19is increased as compared to the case where the sleeve-side protrusion20projecting radially outwardly of the cable10is not provided. In this way, a fixing force of the cable10and the connector11can be improved. Further, according to this embodiment, the tapered surface21expanded in diameter toward the rear side is formed on the inner surface of the rear end edge of the sleeve19. In this way, in inserting the cable10into the sleeve19from behind the sleeve19, the tapered surface21and the cable10slide in contact with each other, whereby the cable10is guided into the sleeve19. As a result, the efficiency of an operation of inserting the cable10into the sleeve19can be improved, wherefore the manufacturing efficiency of the connector with cable12can be improved. Further, according to this embodiment, the barrel30is provided with the plurality of barrel-side protrusions32spaced apart in the circumferential direction of the cable10. In this way, the contact area of the barrel-side protrusions32and the rear end edge of the sleeve19can be increased as compared to the case where one barrel-side protrusion32is provided. Therefore, the fixing force of the cable10and the connector11can be improved. <Second Embodiment> Next, a second embodiment of the present disclosure is described with reference toFIGS.10to13. As shown inFIG.10, in a connector with cable50according to this embodiment, the configuration of barrel-side protrusions51is different from the first embodiment. As shown inFIG.11, a plurality of (two in this embodiment) barrel-side protrusions51project radially inwardly of a cable10on the rear end edge of a barrel30while being spaced apart in a circumferential direction of the cable10. The barrel-side protrusion51is formed on each of right and left sides of the barrel30when viewed from behind. As shown inFIG.11, an escaping portion52depressed into a valley shape when viewed from behind is formed near a substantially vertical center on the projecting end edge of the barrel-side protrusion51in a state before the barrel30is crimped to the cable10. In other words, the escaping portion52is recessed radially outwardly of the cable10on the projecting end edge of the barrel-side protrusion51. As shown inFIG.12, the escaping portions52formed on the projecting end edges of the barrel-side protrusions51are smaller in the circumferential direction of the cable10in a state after the barrel30is crimped to the cable10than in the state before the barrel30is crimped to the cable10. As shown inFIG.13, with the barrel30crimped to the outer periphery of a folded portion18, the barrel-side protrusions51are disposed at a position behind a rear end part of a sleeve19in an axial direction of the cable10. Since the other configuration is substantially the same as in the first embodiment, the same members are denoted by the same reference signs and repeated description is omitted. As shown inFIG.12, the projecting end edges of the barrel-side protrusions51are compressed in the circumferential direction of the cable10in the state after the barrel30is crimped to the cable10. Thus, there is a concern that a metal plate material constituting inner edge parts of the barrel-side protrusions51concentrates on the projecting end edges of the barrel-side protrusions51and creases are formed. Accordingly, in this embodiment, the escaping portions52depressed into a valley shape are formed on the projecting end edges of the barrel-side protrusions51. In this way, even if the metal plate material concentrates on the projecting end edges of the barrel-side protrusions51in the state after the barrel30is crimped to the cable10, the formation of creases in the barrel-side protrusions51can be suppressed. Further, since a contact area of the barrel-side protrusions51and the rear end edge of the sleeve19can be increased as compared to the case where the barrel-side protrusions51are provided at intervals, a fixing force of the cable10and a connector53can be improved. Since the other configuration is substantially the same as in the first embodiment, the same members are denoted by the same reference signs and repeated description is omitted. <Other Embodiments> The technique disclosed in this specification is not limited to the above described and illustrated embodiments. For example, the following embodiments are also included in the technical scope of the technique described in this specification. (1) The barrel30may be provided with one, three, five or more barrel-side protrusions. (2) A plurality of sleeve-side protrusions20may be formed at intervals in the circumferential direction of the sleeve. LIST OF REFERENCE NUMERALS 10: cable11,53: connector12,50: connector with cable13: wire14: braided member15: sheath18: folded portion19: sleeve20: sleeve-side protrusion21: tapered surface22: first shield member23: second shield member25: upper wall26: side wall27: tube portion28: inclined portion29: tongue piece30: barrel32,51: barrel-side protrusion34: fixing piece35: right opening preventing piece36: left opening preventing piece37: right locking portion38: left locking portion40: shield member41: housing52: escaping portion | 21,872 |
11862908 | DETAILED DESCRIPTION Some preferred embodiments of the present invention will now be described in greater detail. However, it should be recognized that the preferred embodiments of the present invention are provided for illustration rather than limiting the present invention. In addition, the present invention can be practiced in a wide range of other embodiments besides those explicitly described, and the scope of the present invention is not expressly limited except as specified in the accompanying claims. Referring toFIGS.1-5, which show structural detail of a power plug device100. The power plug device100includes a first housing110, a circuit board120, a conducting wire assembly130, and a second housing140. The first housing110may be referred to an upper housing, and the second housing140may be referred to a lower housing. The first housing (upper housing)110includes an upper-housing body112with an opening G, a bottom closed the upper-housing body112on the side opposite to the opening G. The upper-housing body112and the bottom form a accommodating portion113located in the upper-housing body112. A through hole114is formed on one side of the upper-housing body112, penetrates the upper shell body112, interconnecting the accommodating portion113and the outside of the upper-housing body112. An annular groove116, i.e. an upper-housing groove, is formed on the opening G of the upper-housing body112. An inner cover117is fixed inside the accommodating portion113of the first housing110. Please refers toFIGS.3-4, which respectively depict the cross-sectional view (FIG.3) and a partial enlarged view of circle A of the power plug device100illustrated inFIG.3, the inner cover117is fixed inside the accommodating portion113of the first housing110, where the space enclosed by the inner cover117, the inner side wall of the upper-housing body112, and the bottom thereof form a receptive space117A. The through hole114passes through the receptive space117A, so that the receptive space117A can interconnects with the outside of the upper-housing body112via the through hole114. As illustrated inFIG.2, a guiding slot115is formed on inner wall of the upper-housing body112, which is located inside the accommodating portion113of the first housing110, and extends inward along the inner side wall retracted by a predetermined distance from the opening G. As shown inFIGS.2and5, the annular groove116is formed on the opening G of the upper-housing body112, which is consisted of a ring-shaped first upper-housing convex portion116A, a ring-shaped second upper-housing convex portion116B, and a ring-shaped upper-housing concave portion116C, where the upper-housing concave portion116C is formed between the first upper-housing convex portion116A and the second upper-housing convex portion116B. The circuit board120shown inFIG.2can be installed in the upper-housing body112through the guiding slot115. Please refers toFIG.2andFIG.3, a conducting wire assembly130passes through the through hole114and is electrically connected to the circuit board120. The circuit board120includes a first section122, a second section124, and a recess126. The first section122is connected to the second section124, and the second section124having a recess126. The circuit board120is installed in the accommodating portion113, the recess126is supported by the inner cover117, and the core wires132of the conducting wire assembly130are electrically connected to the second section124. In one embodiment, the first housing110includes a concave portion118, which is formed and encircled on the edge of the through hole114connected to the upper-housing body112. The conducting wire assembly130includes a conducting wire body131and a coupling unit1310. The coupling unit1310includes a wire stopper134and a necked section136. The conducting wire body131covers the core wires132and is connected to the necked section136. The conducting wire body131passes through the coupling unit1310, i.e. the wire stopper134and the necked section136in the middle, have the core wires132exposed at one end. The necked section136of the coupling unit1310is used to buckle the concave portion118of the through hole114, while installing the conducting wire assembly130, for forming an interlocking structure between the conducting wire assembly130and the upper-housing body112. Since the conducting wire body131and the covered core wires132used in the present invention are made of soft materials, the necked section136can be designed as a snap structure, and the conducting wire assembly130can be easily assembled into the first housing110without applying excessive force. In one embodiment of the present invention, there are at least two mating convex and concave structure between the first housing110and the second housing140for combining them together, and the details will be disclosed in the following paragraphs. Please refers toFIGS.2-5, a second housing140includes a lower-housing body142, a pair of conducting pins, a cover edge portion146, a ring-shaped first lower-housing convex portion147A and second lower-housing convex portion147B extruding from there to form a lower-housing groove147between them. The lower-housing groove147is also ring-shaped (annular). A pair of conductive pins144are arranged on one side of the lower-housing body142and protrude to its outside for conducting electricity. The cover edge portion146is connected to the other side (opposite side) of the lower-housing body142.FIG.5shows the connection details of the upper and lower housings, in which the first lower-housing convex portion147A and the second lower-housing convex portion147B protrude from the cover edge portion146, and a ring-shaped lower-housing groove147are formed between the first lower-housing convex portion147A and the second lower-housing convex portion147B. The first lower-housing convex portion147A of the lower housing body140is ultrasonically welded into the upper-housing concave portion116C of the upper housing body110, and the second upper-housing convex portion116B of the upper housing body110is ultrasonically welded into the lower-housing groove147of the second housing140, so that the first housing (upper housing)110and the second housing (lower housing)140are combined together to form a sealed structure. In the assembly process, first, as shown inFIGS.6-8, wire assembly is performed, that is, passing the conducting wire assembly130through the through hole114. In detail, as shown inFIGS.13to14, the conducting wire assembly130includes core wires132, which passes through the through hole114and the receptive space117A, so that the core wire132is accommodated in the accommodating portion113of the upper housing110. Then, the glue filling operation is performed, and the glue GB is suitable for filling the glue GB in the receptive space117A to secure the core wires132(as shown inFIG.8), which provides a waterproof filling for the exposed core wires132. The amount of the glue GB does not have to cover the entire accommodating portion113, but only needs to be able to fill the receptive space117A, which can greatly reduce the amount of using glue GB. It should be noted that this disclosure does not limit the composition of glue GB applied, for example, which can be chosen from silicone, epoxy resin, polyurethane resin, butyl rubber, chlorosulfonated polyethylene rubber, natural rubber, acrylic rubber, neoprene glue, or combinations of the above materials. Moreover, since the conducting wire body131of the present invention is a soft material, the necked section136can be designed as a buckle structure, and the conducting wire assembly130can be easily assembled into the first housing110without applying excessive force. Next, as shown inFIGS.9-10, the circuit board120is assembled into the accommodating portion113of the first housing110, and the conducting wire assembly130is electrically connected to the circuit board120. In detail, the circuit board120is installed inside the accommodating portion113through the guiding slot115, the recess126is supported by the inner cover117located in the accommodating portion113, and the core wires132is electrically connected to the second section124of the circuit board120(seeFIG.2). As shown inFIGS.11-12, the second housing140is then assembled with the first housing110to complete the assembly. In detail, as shown inFIG.5, the first lower-housing convex portion147A and the second lower-housing convex portion147B protrude from the cover edge portion146of the second housing140, the first lower-housing convex portion147A has a welded portion PA, and the second lower-housing convex portion116B has a welded portion PB, where the first lower-housing convex portion147A, the welded portion PA, the second lower-housing convex portion116B, and the welded portion PB are all ring-shaped. The first lower-housing convex part147A is ultrasonically welded into the upper-housing concave portion116C through the welding portion PA, while the second upper-housing convex portion116B is ultrasonically welded into the lower-housing groove147through the welding portion PB, and therefore the first housing110is combined with the second housing140. In addition to the ultrasonic welding of the upper-housing concave portion116C, the ultrasonic welding is also used in the lower-housing groove147to achieve a double-layer waterproof structure and therefore improve the waterproof effect of the power plug device100. In summary, the present disclosure allows the first housing110and the second housing140to be joined together through dual-layer ultrasonic welding, and achieves a better waterproof effect for the power plug device100. In addition, a pair of conductive pins144provided on the lower-housing body142is electrically connected to the circuit board120to form a conductive path with the conducting wire assembly130. Furthermore, the accommodating groove of the present disclosure is suitable for accommodating glue GB to secure the exposed core wires132. In this way, the amount of glue GB used does not have to cover the entire accommodating portion113of the first housing (lower housing)110, it only needs to fill up the receptive space117A, which can greatly reduce the amount of glue to be used. In addition, the receptive space117A of the present disclosure is suitable for accommodating glue GB to secure the exposed core wires132, and the glue GB also provide waterproof effect for the exposed core wires132. Since the conducting wire assembly130of the present disclosure is made of a soft material, its necked section136can be designed as a buckle structure, and the conducting wire assembly130can be assembled with the first housing (lower housing)110without applying excessive force. While various embodiments of the present invention have been described above, it should be understood that they have been presented by a way of example and not limitation. Numerous modifications and variations within the scope of the invention are possible. The present invention should only be defined in accordance with the following claims and their equivalents. | 11,132 |
11862909 | DETAILED DESCRIPTION OF EMBODIMENTS In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application is further described in detail with reference to the drawings and embodiments as follows. It should be understood that the embodiments described here are only intended to explain the present application, but not used to limit the present application. In the description of the present application, it should be noted that, unless otherwise stated, “plurality” means two or more; orientations or positional relations, indicated by the terms “upper”, “lower”, “left”, “right”, “inside”, “outside”, “front end”, “rear end”, “head part”, “tail part” and the like, are based on the orientation or positional relation shown in the drawings, which is only used for obtaining the convenience of describing the present application and simplifying the description, rather than indicating or implying that the pointed device or element must be in the specific orientation, or be constructed and operated in the specific orientation, and therefore they cannot be understood as a limitation to the present application. In addition, the terms “first”, “second”, “third”, and etc. are only used for the purpose of description, and cannot be understood as indicating or implying the importance of relativity. In the description of the present application, it should be noted that the terms “install”, “link”, and “connect” should be understood in a broad sense unless otherwise clearly specified and limited. For example, it can be the fixed connection or detachable connection, or the integral connection. It can be a mechanical connection or an electrical connection. It can be a direct connection or an indirect connection through an intermediate medium. It can be the internal communication between two devices. For those ordinarily skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood in specific situations. As shown inFIGS.1to6, the radio-frequency coaxial connector comprises a radio-frequency plug and a radio-frequency socket coaxially arranged with the radio-frequency plug. The coaxial arrangement here means that the central axis of the radio-frequency plug is in collineation with the central axis of the radio-frequency socket. The radio-frequency plug and the radio-frequency socket are movably linked in a plug-in manner. The radio-frequency plug comprises a tubular plug outer conductor1, and the plug outer conductor1is provided therein with a plurality of the first conductor plates2along the axial direction of the plug outer conductor1. The first conductor plate2is a plate-shaped conductor. The inside edge of the first conductor plate2is integrally connected to the plug outer conductor1, and the outside edge of the first conductor plate2is arranged inside the plug outer conductor1. The inside edge of the first conductor plate2is the side of the first conductor plate2that is connected with the plug outer conductor1, and the outside edge of the first conductor plate2is the side opposite to the inside edge of the first conductor plate2. The second conductor plate3is fixedly provided at the central axis of the plug outer conductor1, and the second conductor plate3is also a plate-shaped conductor. The second conductor plate3is arranged coaxially with the plug outer conductor1. The second conductor plate3is arranged inside the plug outer conductor1. There is a gap is provided between the outside wall of the second conductor plate3and the inside wall of the plug outer conductor1. The radio-frequency socket comprises a tubular socket shell5. The front end of the socket shell5is provided with a first slot51matching the first conductor plate2. A tuning fork-shaped socket inner conductor6is provided at the center axis of the socket shell5. The tuning fork shape is similar to a Y-shaped structure. The head end of the socket inner conductor6is provided with a U-shaped second slot61matching the second conductor plate3. An insulation sleeve7is filled between the tail part of the socket inner conductor6and the inner wall of the socket shell5. When the radio-frequency plug is plugged into the radio-frequency socket, the front end of the radio-frequency plug is inserted into the front end of the radio-frequency socket. At this time, the first conductor plate2will be inserted to the first slot51, and at the same time, the second conductor plate3will be inserted to the U-shaped second slot61in the tuning fork-shaped socket inner conductor6. The front end of the socket shell5is inserted to the plug outer conductor1, as shown inFIGS.5and6. In the above process, the socket shell5is an outer conductor, and the socket shell5is in contact with the plug outer conductor1to be electrically connected. The first conductor plate2is in contact with the socket shell5to be electrically connected, and the first conductor plate2is electrically connected to the plug outer conductor1as well. Therefore, the socket shell5and the first conductor plate2are electrically connected to each other. The second conductor plate3is fixedly installed inside the plug outer conductor1. There is no contact between the second conductor plate3and the plug outer conductor1. The second conductor plate3is electrically connected to the socket inner conductor6, and the socket inner conductor6is, through the insulation sleeve7, separated from the socket shell5. Therefore, the second conductor plate3and the socket inner conductor6are electrically connected to form the first parallel plate in the parallel plate capacitor. The socket shell5, the first conductor plate2and the plug outer conductor1are electrically connected to each other, to form the second parallel plate of the parallel plate capacitor. According to the formula of the parallel plate capacitance, it can be known that the relationship of the capacitance C and the direct facing area S of the polar plates and the distance d of the polar plates is: the capacitance C is positively proportional to the S, and the capacitance C is inversely proportional to the d. In the process of making the radio-frequency plug and the radio-frequency socket plugged in each other, after the radio-frequency plug and the radio-frequency socket are completely plugged, the end portion of the second conductor plate3is inserted to the bottom of the second slot61, as a standard. When the plugging is not in place, that is, the end portion of the second conductor plate3is not in contact with the bottom of the second slot61, and at this time, even if being not completely contacted, there is a gap between the end portion of the second conductor plate3and the bottom of the second slot61, when the gap is not more than 3 mm, due to the matching structure of the second conductor plate3and the socket inner conductor6and the matching structure of the socket shell5, the first conductor plate2and the plug outer conductor1, the socket shell5and the plug outer conductor1are in shape of round tube, and moreover the width direction of the second conductor plate3and the width direction of the socket inner conductor6are perpendicular to each other, after the second conductor plate3is inserted to the second slot61in the socket inner conductor6, the projections, which are projected by the second conductor plate3and the socket inner conductor6onto the axial direction of the second conductor plate3or the axial direction of the socket inner conductor6, are cross-shaped, that is, in the parallel plate capacitor C composed of the first parallel plate and the second parallel plate, the first conductor plate2, the second conductor plate3, the socket inner conductor6are arranged at equal spacing from the socket shell5and the plug outer conductor1. The direct-facing area S of the polar plates is always in a fixed and constant state. The distance d of the polar plates is ultimately determined by the cross-shaped structure between the second conductor plate3and the socket inner conductor6. In this structure, the polar plate distance d between the second conductor plate3and the socket inner conductor6has a small change, and the change of the capacitance C is very small. Finally, change of the impedance between the radio-frequency plug and the radio-frequency socket is not large, and the signal transmission loss is small. Herein, the opening size of the second slot61is smaller than the bottom size of the second slot61, such that the second slot61has elasticity and can better make electrical contact with the second conductor plate3. Further, in order to facilitate the plug-in connection, the inner wall of the front end of the plug outer conductor1is provided with an inner conical-surface structure, and the inner wall of the front end of the socket shell5is provided with an outer conical-surface structure. The front end of the plug outer conductor1is the end that is plugged in the radio-frequency plug; and similarly, the front end of the socket shell5is the end that is plugged in the radio-frequency socket. Further, in order to facilitate the plug-in connection, a clearance fit is provided between the second conductor plate3and the second slot61. Further, in order to facilitate the plug-in connection, a clearance fit is provided between the first conductor plate2and the first slot51. Further, a clearance fit is provided between the front end of the socket shell5and the front end of the plug outer conductor1. Further, the number of the first conductor plates2is set as two, and the central axes of the two first conductor plates2and the central axis of the second conductor plate3are coplanar with each other. In the same way, since the first conductor plates2are in one-to-one correspondence to the first slots51, and the second conductor plates3are in one-to-one correspondence to the second slots61. The number of the first slots51is set as two, and the central axes of the two first slots51and the central axis of the second slot61are coplanar with each other. In the above arrangement, on one hand, it is more convenient to plug the radio-frequency plug in the radio-frequency socket, and on the other hand, it is helpful to further reduce the change of the distance d of polar plates. In the above embodiment, when the radio-frequency plug and the radio-frequency socket are plugged in, since the plug-in structure between the radio-frequency plug and the radio-frequency socket is of equal interval arrangement, even if the radio-frequency plug and the radio-frequency socket are not plugged in place, for example, in the present application, even if the error between the actual plug-in position of the radio-frequency plug and the radio-frequency socket and the complete plug-in position of the radio-frequency plug and the radio-frequency socket reaches 3 mm, the impedance between the radio-frequency plug and the radio-frequency socket is 50±0.5Ω. That is to say, in the present application, the error between the actual plug-in position of the radio-frequency plug and radio-frequency socket and the complete plug-in position of the radio-frequency plug and radio-frequency socket is 0-3 mm, and the change of the impedance between the radio-frequency plug and the radio-frequency socket is ±0.5Ω. The impedance change is very small, which can significantly reduce interference. Therefore, when the radio-frequency coaxial connector of the present application is applied in a large scale and when a plurality of radio-frequency coaxial connectors are plugged in at the same time, even if the phenomenon of incomplete plug-in exists in the radio-frequency plugs and radio-frequency sockets in several radio-frequency coaxial connectors, as long as the error is less than 3 mm, the impedance change is very small, and the signal transmission is almost undisturbed, such that the multiple times of operations, such as, debugging, adjustment, re-plugging and etc., are not necessary to be performed in the future. Not only the operation is convenient, but also it is not easy to cause the damage to the signal transmission. The radio-frequency coaxial connector of the present application has broad application prospects and important application value in high-tech fields, such as electronic information. The foregoing descriptions are only preferred embodiments of the present application and not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application. | 12,657 |
11862910 | Reference numerals of accompanying drawings are explained as follows:1, charger;10, charging module;11, main board;20, plug structure;21, plug body;210, top end;211, accommodating groove;2111, first accommodating groove;2112, second accommodating groove;2113, third accommodating groove;2115, first guide groove;2116, second guide groove;212, upper housing;2121, via hole;2122, snapping groove;213, lower housing;214, sliding groove;2141, first end;2142, second end;2143, first limiting member;2144, second limiting member;2145, first sliding groove;2146, second sliding groove;215, boss;216, through groove;22, plug;221, rotating shaft;222, pin;223, end portion;23, connecting member;232, convex post;233, first convex rib;234, second convex rib;24, elastic conductive sheet;241, elastic portion;30, accommodating chamber;301, upper accommodating chamber;302, lower accommodating chamber;40, circuit module;41, energy storage unit;42, charging and discharging circuit. DESCRIPTION OF EMBODIMENTS Although the present disclosure can be easily embodied in different forms of embodiments, only some specific embodiments are illustrated in the accompanying drawings and described in detail in this specification. Also, it can be understood that this specification should be regarded as exemplary description of principles of the present disclosure, and is not intended to limit the present disclosure to the description made herein. Therefore, a feature described in this specification is used to describe one of the features of an embodiment of the present disclosure, rather than implying that each embodiment of the present disclosure must have the described feature. In addition, it should be noted that this specification describes many features. Although some features can be combined together to illustrate possible system designs, these features can also be used in other unspecified combinations. Consequently, unless otherwise stated, combinations illustrated herein are not intended to be limiting. Exemplary embodiments will now be described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms, and should not be construed as being limited to examples set forth herein. On the contrary, the exemplary embodiments are provided to facilitate thorough and comprehensive description of the present disclosure, and fully convey the concept of the exemplary embodiments to those skilled in the art. The accompanying drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale. Same reference numerals in the figures denote same or similar parts, and thus repeated description of the same reference numerals will be omitted here. In addition, described features, structures, or characteristics may be combined in one or more example embodiments in any suitable manner. In the following description, many specific details are provided to facilitate solid understanding of the exemplary embodiments of the present disclosure. However, it is conceivable for those skilled in the art that technical solutions of the present disclosure can be practiced without one or more specific details, or other methods, components, steps, etc., can be adopted. In other cases, well-known structures, methods, implementations, or operations are not illustrated or described in detail to highlight and avoid obscuring various aspects of the present disclosure. Some of the block diagrams illustrated in the figures are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities may be implemented in a form of software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor apparatuses and/or microcontroller apparatuses. Preferred embodiments of the present disclosure will be further described in detail below in conjunction with the accompanying drawings in the specification. At present, since a plug structure of a charger has a plurality of outstretched pins, the plug structure of the charger often occupies a large space, which hinders portable storage of the charger. The present disclosure proposes an electronic device including a circuit module and a plug structure. The circuit module is electrically connected to the plug structure. The circuit module and the plug structure can be integrally formed as one piece, the plug structure has an accommodating groove defined therein, and the accommodating groove is configured to accommodate the circuit module. Alternatively, the circuit module and the plug structure may be formed as separate pieces, and the circuit module can be detachably connected to the plug structure. The electronic device can be a charger, a mobile power supply, or a plug adapter. Specifically, in the present disclosure, description is made by taking the electronic device being the charger and the circuit module being a charging module as an example. In some embodiments, referring toFIG.1andFIG.2, a charger1includes a charging module10and a plug structure20. A plug body21of the plug structure20has an accommodating chamber30defined therein. The accommodating chamber30is configured to accommodate the charging module10, and the charging module10is electrically connected to a plug22of the plug structure20. The plug structure20is configured to be connected to an external power supply to provide power to the charging module10. The charging module10is electrically connected to an apparatus to be charged to charge the apparatus to be charged. The charging module10includes a main board11and electronic components (not illustrated) arranged on the main board11. One end of the charging module10is electrically connected to the plug22, and the other end of the charging module10is electrically connected to the apparatus to be charged to charge the apparatus to be charged. Here, the apparatus to be charged may be an electronic device such as a smart mobile terminal, a mobile power supply, a notebook computer, a drone, an e-book, an electronic cigarette, a smart wearable device, and a sweeping robot. A charging object to which the charger is applied is not limited here. In some embodiments, the plug structure20is a two-pole plug. That is, the two-pole plug includes two pins. It can be understood that the plug structure20can also be a two-pole grounding plug. The two-pole grounding plug includes three pins. In some embodiments, the plug structure20includes the plug body21and the plug22. The plug body21has an accommodating groove211configured to accommodate the plug22. The plug22is close to a top end210of the plug body21, and the accommodating groove211extends towards the top end210of the plug body21. A first position and a second position are two different positions on the accommodating groove211. A distance between the first position and the top end210of the plug body21is different from a distance between the second position and the top end210of the plug body21. The first position may be located at an end of the accommodating groove211, and the second position may be located at another end of the accommodating groove211. It can be understood that the first position and the second position may alternatively be located in a middle region of the accommodating groove211. In addition, a plurality of first positions and a plurality of second positions may be provided. As long as there is a certain distance between the first position and the second position along an extending direction of the accommodating groove211, the first position and the second position are not limited in quantities thereof here. In some embodiments, the plug body21may be a rectangular box body. Two short side ends of the plug body21are a bottom end and the top end210of the plug body21, respectively. The extending direction of the accommodating groove211is parallel to a direction along a long side of the plug body21. The plug22includes a rotating shaft221and a plurality of pins222. The rotating shaft221is slidably arranged in the accommodating groove211and is rotatable to at least the first position and the second position. That is, the rotating shaft221is movable along the accommodating groove211towards or away from the top end210of the plug body21, between the first position and the second position. Referring toFIG.3, when the rotating shaft221is rotated to the first position, the plurality of pins222is accommodated in the accommodating groove211, the rotating shaft221abuts against a bottom of the accommodating groove211, and the plug22of the plug structure20is in a retracted state. Referring toFIG.4, when the rotating shaft221is rotated towards the top end210of the plug body21from the first position to the second position, the rotating shaft221moves towards the top end210of the plug body21, the rotating shaft221slides to a position having a first distance from an end surface of the top end210of the plug body, and the plurality of pins222protrudes out of the accommodating groove211and is perpendicular to the plug body21. In this way, the plug structure20can be plugged into an external socket to operate in the working state. The plug22can be in a retracted state in which the plug22is retracted in the accommodating groove211. In this way, when the plug structure20is not in use, the plug22can be retracted to reduce a space occupied by the plug22, which is convenient for carrying and storage. Referring toFIG.5andFIG.6, when there is a need for the plug structure20to expand the plug22for use, the plug22can slide along the accommodating groove211towards the top end210of the plug body21to the second position. The plurality of pins222protrudes out of the accommodating groove211and is perpendicular to the plug body21, such that the plug can be plugged into an external socket to enable the plug structure20to operate in the working state. Since the second position is a position to which the rotating shaft221slides and which has a first distance A from the end surface of the top end210of the plug body, the second position is closer to the end surface of the top end210of the plug body21than the first position. When the rotating shaft221slides to the position having the first distance A from the end surface of the top end210of the plug body, the plurality of pins222can be close to the end surface of the top end210of the plug body21, such that a distance between each of the plurality of pins222and the end surface of the top end210of the plug body is shortened. In a conventional plug, when a pin is in a working state, a distance between an edge of the plug body and the pin is usually at least 15.8 mm, which is a relatively great value and occupies a relatively large space. When the conventional plug structure is plugged into a socket, the plug structure may occupy a relatively large space since the edge of the plug body occupies a large area. In this case, a socket body “invades” a jack of the socket in an adjacent position, which affects the use of the adjacent position in the socket, and leads to an occurrence of an “overlord plug” phenomenon. Referring toFIG.4, the plug22in the plug structure20is in the working state. In this case, the plug22in the second position is closer to the end surface of the top end210of an end of the plug body21than the plug22in the first position, and a distance between the pins222and the end surface of the top end210of the end of the plug body21is shortened. Therefore, the distance between the pins222of the plug structure20in the working state and the end surface of the top end210of the plug body21is shortened, thereby reducing a space occupied by the edge of the plug structure20. When the plug structure20is plugged into the socket, the plug structure20neither “invades” a space of the adjacent position in the socket, nor affects plugging and use of another plug structure. In some embodiments, when the plurality of pins222is in the second position, the first distance A between the rotating shaft221and a bottom of the accommodating groove211is 6.5 mm. Therefore, in the extending direction of the accommodating groove211, the distance between the pin222and the end surface of the top end of the plug body21can reach 6.5 mm. The distance between the end surface of the top end210of the plug structure20and the plurality of pins222needs to be at least 6.5 mm to prevent fingers from contacting a plug insert and getting an electric shock and satisfy safety codes and standards of the plug structure20. In addition, a minimum distance between the end surface of the top end210of the plug body21and the pins222can be 6.5 mm to minimize a space occupied by an outer edge of the plug body21, thereby avoiding the occurrence of the “overlord plug” phenomenon to the greatest extent under the premise of ensuring the safe use of the plug structure. In some embodiments, referring toFIG.2, the plug body21includes an upper housing212and a lower housing213that fit with and are connected to each other, and the upper housing212and the lower housing213together define the accommodating groove211. The upper housing212and the lower housing213may be fixedly connected to each other by means of snapping, screwing, or hot melting. In other embodiments, the plug body21is not limited to being divided into two structural portions, i.e., an upper portion and a lower portion, and may alternatively be of another form of structural composition. The structural composition of the plug body21is not limited here. Referring toFIG.7, the upper housing212has an upper accommodating chamber301defined therein. The main board11is fixed in the upper accommodating chamber301. In addition, a shape of the upper accommodating chamber301matches a shape of the main board11. The main board11is snapped into and fixed in the upper accommodating chamber301of the upper housing212. Referring toFIG.8, the upper housing212has via holes2121defined thereon, and the via holes2121are configured for the pins222to be rotated out of the accommodating groove211. The via holes2121are in communication with the accommodating groove211, and the pins222are rotatable from a side of the upper housing212to an outer side of the plug body21. Referring toFIG.9, the lower housing213has a lower accommodating chamber302. The lower accommodating chamber302corresponds to electronic components arranged on the main board11. In addition, a shape of the lower accommodating chamber302matches the shape of the upper accommodating chamber301. The upper housing212and the lower housing213may be injection-molded plastic members. In addition, the upper housing212and the lower housing213are formed as an integrative structure. The upper housing212and the lower housing213may be fabricated at a high precision to facilitate molding. The accommodating groove211includes a first accommodating groove2111configured to accommodate the rotating shaft221and a second accommodating groove2112and a third accommodating groove2113that are configured to accommodate two pins222, respectively. The two pins222are located on two sides of the rotating shaft221, respectively, and the second accommodating groove2112and the third accommodating groove2113are located on two sides of the first accommodating groove2111, respectively. The rotating shaft221moves along the first accommodating groove2111, and the two pins222move along the second accommodating groove2112and the third accommodating groove2113, respectively. In some embodiments, the first accommodating groove2111is arc-shaped, and the rotating shaft221is rotatable along the first accommodating groove2111to the second position. Correspondingly, the second accommodating groove2112and the third accommodating groove2113are also arc-shaped. When the rotating shaft221moves along the first accommodating groove2111, the two pins222also follows to move along the second accommodating groove2112and the third accommodating groove2113. Groove opening widths of the second accommodating groove2112and the third accommodating groove2113match widths of the two pins222to enable the two pins222to be stably accommodated in the second accommodating groove2112and the third accommodating groove2113in a one-to-one correspondence. In some embodiments, the first accommodating groove2111includes an arc groove214. The arc groove214is arranged on the lower housing213. The upper housing212has a boss215matching a shape of the arc groove214. A channel configured for sliding of the plug22is defined between a top surface of the boss215of the upper housing212and a bottom surface of the arc groove214. It can be understood that the channel can alternatively be directly defined in the upper housing212or the lower housing213. The rotating shaft221is rotatable to the second position along the arc groove214. The bottom surface of the arc groove214is shaped as an arc concave surface, and the boss215has an arc convex surface. The arc concave surface and the arc convex surface match each other, and form an arc channel. The rotating shaft221is slidable along the arc channel. In some embodiments, a first position2141and a second position2142correspond to two ends of the arc groove214, respectively. When the rotating shaft221moves along the arc groove214, by virtue of the shape of the arc groove214, the rotating shaft221can be rotated easily to exert a pushing force to enable the pins222to slide and rotate along the arc groove214. The first position2141and the second position2142are located at the two ends of the arc groove214, respectively, and a length of the arc groove214can be minimized, thereby reducing a volume of the plug body21. It can be understood that, in other embodiments, the first position and the second position may alternatively be located in a middle portion of the arc groove214, and the arc concave surface may also be located in a middle segment region of the arc groove214. For convenience of description, one end of the arc groove214is correspondingly the first position2141, and the other end of the arc groove214is correspondingly the second position2142. The second position2142is close to the end surface of the top end210of an end of the lower housing213. Here, when the rotating shaft221is located at the first position2141of the arc groove214, the plug22is in the retracted state. When the rotating shaft221slides to the second position2142along the arc groove214, the plug22is rotated relative to the arc groove214, the top end210of the plug22is rotated out of the accommodating groove211from the via holes2121to enable the pins222to be rotated to the working state and the rotating shaft221to be located at the second position2142. When the pins222are in the working state, the pins222are perpendicular to a surface of the plug body21, thereby ensuring that the pins222can be stably plugged into the jacks of the socket. In some embodiments, with continued reference toFIG.2andFIG.7, each pin222has a connecting member23provided at a bottom thereof. The rotating shaft221is connected to the two pin222through the connecting member23, such that the rotating shaft221can drive the two pins222to move together. The connecting member23may be injection-molded from materials such as plastic and rubber. The connecting member23at least partially wraps the bottom of the pin222, and can provide insulation protection to the bottom of the pin222. In addition, the connecting member23can be slidably arranged on the arc groove214. The connecting member23wraps the bottom of the pin222, and the pin222is not in direct contact with the arc groove214. Both the connecting member23and the lower housing213are injection-molded plastic members, and thus a small frictional resistance is present between the connecting member23and the arc groove214, thereby facilitating sliding and rotation of the pin222. In addition, the connecting member23has a bottom that is arc-shaped. The arc-shaped bottom of the connecting member23can reduce a contact area between the connecting member23and the arc groove214, and ensure that the connecting member23can also slide and rotate smoothly along the arc groove214. Since at least two pins222are provided, the rotating shaft221is connected to two pins222. By connecting the two pins222with the rotating shaft221located between the two pins222and enabling the two pins222to slide along the arc groove214, the two pins222can maintain a consistent moving trajectory, such that the two pins222can move synchronously. The rotating shaft221has an arc-shaped side surface that can reduce a contact area between the rotating shaft221and the arc groove214, thereby ensuring that the pins222can smoothly slide and rotate along the arc groove214. Referring toFIG.5, in some embodiments, a cross section of the rotating shaft221is ellipse-shaped. When the rotating shaft221slides and rotates along the arc groove214, a long-axis direction of the ellipse is parallel to an extending direction of the arc groove214. In conjunction withFIG.7, when the rotating shaft221moves to the second position2142of the arc groove214, the rotating shaft221is rotated to enable that an outer surface of the rotating shaft221and an inner side wall of the arc groove214can abut against each other to fix and support the rotating shaft221, ensure that the pins222can be stably limited to the second position2142of the arc groove214, and guarantee that the pins222can be in a stable working state for normal use. Referring toFIG.9, the accommodating groove211has a limiting member provided at a bottom thereof. When the rotating shaft is rotated to the first position2141or the second position2142, the rotating shaft221is connected to the limiting member in a position limiting manner. In some embodiments, the arc groove214has a first limiting member2143arranged at a position close to the first position. The first limiting member2143is arranged at a position in the accommodating groove211close to the first position. When the pins are retracted in the accommodating groove, the rotating shaft221abuts against the first limiting member2143in a position limiting manner. The first limiting member2143has a guiding surface. The guiding surface of the first limiting member2143can facilitate smooth sliding of the pins222from the first position2141to the second position2142via the first limiting member2143. The limiting member includes a second limiting member2144. The second limiting member2144is arranged at a position in the accommodating groove211close to the second position2142. Specifically, the arc groove214has the second limiting member2144arranged at the position close to the second position2142. When the rotating shaft221is rotated to the second position2142, the rotating shaft221abuts against the second limiting member2144in a position limiting manner. The second limiting member2144also has a guiding surface. The guiding surface of the second limiting member2144has a smooth transition along a direction from the first position2141to the second position2142, thereby facilitating the sliding of the rotating shaft221along the arc groove214, and enabling the rotating shaft221to smoothly slide to the second position2142of the arc groove214, thereby maintaining the working state of the pin222. In addition, the first limiting member2143and the second limiting member2144are elongated and extend along a direction parallel to an axial direction of the rotating shaft221. Therefore, each of the first limiting member2143and the second limiting member2144can have a large contact area with the rotating shaft221, thereby ensuring that the first limiting member2143and the second limiting member2144can maintain stable contact with the rotating shaft221in a position limiting manner. The first limiting member2143and the second limiting member2144are staggered, and the first limiting member2143and the second limiting member2144are located on two opposite sides of the bottom surface of the arc groove214, respectively. Correspondingly, referring toFIG.7again, the rotating shaft221has a convex rib provided thereon. The convex rib is configured to cooperate with and abut against the limiting member in a position limiting manner. The convex rib includes a first convex rib233and a second convex rib234. The first convex rib233and the second convex rib234are staggered, such that the first convex rib233may abut against the first limiting member2143and the second convex rib234may abut against the second limiting member2144. Referring toFIG.10, when the pins222are in the retracted state, the first convex rib233of the rotating shaft221and the first limiting member2143on the arc groove214abut against each other, such that positions of the pins222are limited to the retracted state. When the rotating shaft221slides and rotates along the arc groove214and moves to the second position2142of the arc groove214, the second convex rib234of the rotating shaft221cooperates with and abuts against the second limiting member2144on the arc groove214, such that positions of the pins222are limited to the working state, as illustrated inFIG.11. In addition, the pins222in the retracted state are perpendicular to the pins222in the working state. Therefore, the first convex rib233and the second convex rib234on the rotating shaft221correspond to a central angle of 90 degrees of the rotating shaft221to ensure that the rotating shaft221can be rotated by 90 degrees, and the pins222can be rotated from the retracted state to the working state, where the pins in the working state are perpendicular to the pins in the retracted state. With reference toFIG.2again, in some embodiments, the accommodating groove211has through grooves216defined in an end thereof facing away from the first position2141. The through grooves216are in communication with an outer side of the plug body21. When the rotating shaft221is located in the first position2141, each of the pins222is partially accommodated in the through groove216. Specifically, the through grooves216are arranged at the second position2142of the arc groove214. Each through groove216extends along the extending direction of the arc groove214. The arc groove214is in communication with the outer side of the plug body21via the through grooves216, and the through grooves216are configured to accommodate the plug22. In addition, in some embodiments, the through grooves216may be defined by the upper housing212and the lower housing213together. Both the upper housing212and the lower housing213have the through grooves216defined thereon. A groove opening width of the through groove216is smaller than a groove opening width of the via hole2121. The through groove216only needs to partially accommodate the pin22. The groove opening width of the through groove216is smaller than that the groove opening width of the accommodating groove211to improve structural compactness of the plug structure20. In some embodiments, a length of the accommodating groove211is smaller than a length of each pin222, and an end portion223of the pin222protrudes out of the through groove216. When the pin222is in the retracted state, i.e., when the rotating shaft221is in the first position, the end portion223of the pin222is located outside the plug body21, which is convenient for manually holding the pin222and rotating the pin222with a force. In addition, the plug body21has the through grooves216defined to further achieve a short length of the accommodating groove211of the plug body21. The pin222can be accommodated in the accommodating groove211of the short length, such that the pin222can be in the retracted state. In this way, it is avoided that to accommodate the pin222, the plug structure20has the accommodating groove211of a large length defined therein, and the accommodating groove211of the large length causes the plug structure20to occupy a large area. When the rotating shaft221moves in the arc groove214, the pins222can slide relative to and along the arc groove214in the extending direction of the arc groove214, can also be rotated relative to the arc groove214. In addition, an order of the sliding and the rotation of the pin222relative to the arc groove214is not limited, and the pins222can slide before being rotated, or be rotated before sliding. In some embodiments, simultaneous to the relative movement of the pins222in the arc-shaped arc groove214, the pins are rotated. With reference toFIG.9again, in some embodiments, two side walls of the accommodating groove211further have a first guide groove2115and a second guide groove2116. The first guide groove2115and the second guide groove2116are respectively located on two sides of the accommodating groove211. Each pin222has a convex post232protruding from an outer side thereof. The convex post232is electrically connected to the pin222. The convex posts232can be slidably arranged in the first guide groove2115and the second guide groove2116. The convex posts232slide along the first guide groove2115and the second guide groove2116, which helps the rotating shaft221to slide and rotate stably. The convex posts232and the rotating shaft221are located on a same axis. Therefore, shapes of the first guide groove2115and the second guide groove2116are the same. Here, heights of the first guide groove2115and the second guide groove2116match heights of the convex posts232, such that the convex posts232can slide and rotate along the first guide groove2115and the second guide groove2116. In addition, the convex post232is a conductor. The convex post232is electrically connected to the pin222. The convex post232may be a metallic convex post. The convex post232is electrically connected to the bottom of the pin222in the interior of the connecting member23. The plug structure20includes elastic conductive sheets24that are arranged in the accommodating groove211. Each elastic conductive sheet24is arranged on an inner side of the accommodating groove211and faces towards one of the pins222. An end of the elastic conductive member24is electrically connected to the pin222, and another end of the elastic conductive sheet24is electrically connected to the charging module10via a wire. Referring toFIG.11andFIG.12, specifically, the elastic conductive sheets24are mounted on the upper housing212. The upper housing212has snapping grooves2122. The two ends of the elastic conductive sheet24are snapped into and fixed in the snapping groove2122. The elastic conductive member24is electrically connected to the main board11via a wire. In some embodiments, the upper housing212has the snapping grooves2122provided on two sides of the boss215. Each elastic conductive sheet24has an elastic portion241. A shape of the snapping groove2122matches the elastic conductive member24, such that the elastic portion241can be snapped into the snapping groove2122to limit a position of the elastic conductive sheet24. Referring toFIG.13, two elastic conductive sheets24are provided, which are provided on two opposite sides of the plurality of pins222in an axial direction of the rotating shaft231, respectively. The convex posts232protrude outwards relative to the two opposite sides of the plurality of pins222, such that the convex posts232are in contact with the elastic conductive sheets24in one-to-one correspondence to realize electrical connection. Referring toFIG.14andFIG.15, when the pins222are rotated to the working state, the elastic portions241are squeezed by the convex posts232and deform elastically to generate an elastic resilience force. Specifically, the elastic conductive sheets24are formed by bending a metallic sheet, and the elastic portions241have elasticity after the bending. When the upper housing212and the lower housing213are bonded to other, the boss215of the upper housing212faces the arc groove214of the lower housing213, and the elastic conductive sheets24face the outer sides of the pins222. Referring toFIG.8andFIG.9, when the elastic portions241correspond to the second position2142of the sliding groove, the convex posts232protrude from the outer side of the plurality of pins222. When the plurality of pins222is located at the second position2142, the convex posts232abut against the elastic portions241of the elastic conductive sheets24in such a manner that the elastic conductive sheets24deform and then the elastic conductive sheets24are electrically connected to the plurality of pins222. In the plug structure20, the plurality of pins222can be accommodated in the accommodating groove211when in the retracted state. When the pins222need to be stretched for use, the pins222can slide and rotate along the accommodating groove211to be stretched out for use. Therefore, when the plug structure20is not in use, the pins222are retracted to reduce the space occupied by the pins222and facilitate carrying and storage of the plug structure20. When the pins222slide to the working state, the position of the pins222moves towards an edge of the plug body21to shorten a distance between the pins222and the edge of the plug body21. Therefore, when the plug structure20is plugged into the socket, the plug structure20occupies a small space and does not “invade” the space of an adjacent position in the socket. In other embodiments, the plug may be the two-pole grounding plug, and thus the plug structure includes three pins. The three pins can be one grounding pin and two electrode pins. The two electrode pins can have one rotating shaft arranged therebetween, and the accommodating groove of the plug body can have the sliding groove defined therein, such that the rotating shaft can slide and rotate along the sliding groove to drive the two electrode pins to move. The grounding pin can be rotatably arranged on the plug body. When the two electrode pins are in the retracted state, the grounding pin is also in the retracted state, and can be accommodated between the two electrode pins. When the two electrode pins are in the working state, the grounding pin is also in the working state, such that the two-pole grounding plug can be plugged normally for use. Therefore, the two-pole grounding plug can also reduce an occupied volume and facilitate storage and carrying. Also, a distance between an edge of the two-electrode grounding plug and each pin is also short, such that the two-pole grounding plug does not invade space of an adjacent position in the socket to affect normal use of another plug, thereby avoiding the occurrence of the “overlord plug” phenomenon. Referring toFIG.16, in other embodiments, the electronic device may alternatively be a mobile power supply. The circuit module40further includes an energy storage unit41configured to store electric energy and a charging and discharging circuit42. The energy storage unit41is electrically connected to the charging and discharging circuit42. The charging and discharging circuit42can be configured to charge the energy storage unit41, and the energy storage unit41can supply power to an external power consumption apparatus through the charging and discharging circuit42. In other embodiments, the circuit module may alternatively be other power supply circuits. The power supply circuit is electrically connected to the pins of the plug structure to establish a connection with an external power source through the plug structure, and supply power to a power consumption apparatus through the power supply circuit. The power supply circuit may be, e.g., a transformer conversion circuit. The electronic device can be an adapter, a power adapter, or the like. In addition, in other embodiments, the circuit module detachably connected to the plug structure. The circuit module can be an independent structure relative to the plug structure, and the circuit module and the plug structure can be electrically connected to each other by a plugging wire. For example, when the circuit module is a power bank, the plug structure may be a charging plug. The power bank can be independent of the plug structure to facilitate carrying. Although the present disclosure has been described with reference to several typical embodiments, it should be understood that terms used in the present disclosure are illustrative and exemplary, rather than restrictive. Since the present disclosure can be implemented in various forms without departing from the spirit or essence of the present disclosure, it should be understood that the above embodiments, instead of being construed as being limited to any of the details described above, should be interpreted broadly within the spirit and scope defined by the claims as attached. Therefore, all changes and modifications falling within the scope of the claims or their equivalents shall be encompassed by the claims as attached. | 36,834 |
11862911 | DETAILED DESCRIPTION In various embodiments, as set forth inFIG.1, the system includes a combination of power and lighting. The systems may be designed for the cabinetry and casework industry. The power, lighting, and charging technologies may be housed, out-of-sight, underneath and within the cabinetry and casework systems. One reason for using the system is to remove all electrical devices from the backsplash area between the countertops and bottom of the upper wall cabinets so the design features associated with the backsplash may remain unencumbered. The system is designed to be user and installer friendly with all systems having the ability to be installed with or without the use of licensed electricians depending on the systems selected for use. The system allows for electrical, lighting, and charging systems to be combined into one discreet system that hides conveniently behind molding. For example, the system may hide behind a ¾″ (20 mm) high light molding, or in the case of frameless cabinetry, within a 1 5/16″ (33 mm) wide or 2 1/16″ (53 mm) wide by ¾″ D (20 mm) channel depending on the lighting system selected. The systems may be available in corded or hardwired applications. The systems may be extended in intervals of 12″ (30.48 cm) up to a total length of 20′ (609.6 cm). The lighting for the systems may be line voltage LED lighting. The lighting may be capable of being dimmer controlled. The system may be used by three levels of clientele: The do-it-yourselfer (DIY), the construction/cabinet installer, and the professional cabinetry company. In various embodiments, systems are designed for the DIYer and include electrical, lighting, and charging ports that are positioned as required to meet most NEC conditions. The system is a single-circuit system with integrated electrical receptacles and LED lighting. For example, the receptacles and lighting may be located on 12″ centers and one set of USB charging ports for 12″, 24″, and 36″ lengths. Lighting may turned on and off via a slide dimmer switch (e.g., located at one end of the of the chassis body). The system may be available in hardwire and corded varieties and in 12″, 24″, 36″, 48″, 60″, and 72″ lengths. In various embodiments, the systems are designed to be energized via a GFCI receptacle installed in the cabinet above where the system is located that is recessed into the wall at 6″ to 16″ above the bottom of the cabinet. If hardwired, the feed from the load side of the GFCI may be attached to the system via a self-clamping romex connector and terminals for the hot, common, and ground wires. If corded, the cord is simply plugged into the GFCI receptacle. The wiring within the system features feed-thru 12 gauge copper wiring rated for 20 amps that is split at the entrance into the chassis. In various embodiments, continuous power is maintained at the receptacle locations while also powering the line voltage LED lighting via a slide dimmer installed on the exterior of the chassis. The chassis material may be steel with powder-coated finishes in white, almond, brown, and black. In various embodiments, the systems may be designed for use by construction and cabinet installation specialists. The system may include electrical, lighting, and charging port “blocks” that the installer can position as required for their project or per the client's needs. The system may be a two-circuit system with one circuit energized for receptacles and charging ports and the other circuit to control the lighting systems. The two circuit system allows for lighting to be controlled via wall mounted dimmer switches and multiple systems to be controlled from one switching location. In various embodiments, as set forth inFIG.2, the system may include a 4-pin connection to a two-circuit system. When hardwired, the system may include two separate feeds. In various embodiments, a first feed may be continuously hot for the receptacles and a second feed may be switched for the lights. Both the first and second feeds may be attached to the system via a 4-pin connecting wire with male/female 12 gauge conductors. The conductors may be wired into the system at a wall-mounted junction box. The conductors may be plugged into the chassis via the 4-pin connector with the chassis containing the male side of the connection and the 4-pin connecting wire containing the female side of the connection. A spring-loaded clamp may keep the connection secure at the chassis. The 4-pin connecting wire may be encased as a corded unit. The 4-pin connecting wire may be protected by a metal raceway (e.g., ¾″ wide by ½″ high) from where it leaves the junction box to the connection at the chassis. A similar pin connecting device system may be used for other models, but it may only include a 3-pin conductor. Each specific length of chassis may have a specific number of block locations. For instance, a 36″ long chassis has six block locations. The installer could position receptacle blocks at positions one, three, and five while positioning light blocks at positions two, four, and six. The specific block types (receptacle, lighting, or charging) connect to the chassis at the appropriate circuit designated for their block. The receptacle and USB port portions of the systems are designed to be energized via a GFCI receptacle installed in the cabinet above where the system is located that is recessed into the wall at 6″ to 16″ above the bottom of the cabinet. If hardwired, the feed from the load side of the GFCI is attached to the system via a self-clamping romex connector and terminals for the hot, common, and ground wires. If corded, the cord is simply plugged into the GFCI receptacle. The lighting portion of the Plug-N-Select system can be energized by directly wiring the switched line to the terminals within the chassis for hardwired applications or by plugging in the lighting cord to a switched receptacle for corded applications. The wiring within the system features feed-thru 12 gauge copper wiring rated for 20 amps. The Plug-N-Select system is available in hardwire and corded varieties (two cords) and in 12″, 24″, 36″, 48″, 60″, and 72″ lengths. Chassis material is steel with powder-coated finishes in white, almond, brown, and black. In various embodiments, the systems are designed for the high-end cabinetry professional and are designed to be integrated into the design of the cabinetry whether the cabinetry is frameless or otherwise. The system offers two different lighting system options—continuous LED lighting and specific point LED lighting depending on the design and purpose of the lighting. In various embodiments, the systems include electrical, lighting, and charging port “blocks” that can be positioned as required for the project, and it is also a two-circuit system with one circuit for receptacles and charging ports and the other for lighting. If the continuous LED lighting option is desired, the designer has the option of using receptacle and charging port blocks as well as lighting blocks if needed. The system with continuous LED lighting may include the wider chassis system (2 1/16″ or 53 mm) and is available in hardwire and corded varieties (two cords) in 12″, 24″, 36″, 48″, 60″, and 72″ lengths. The systems are designed to be energized via two separate circuits with one circuit energized continuously while the other is a switched for the lighting control. Chassis material is available in natural milled aluminum or steel with powder-coated finishes in white, almond, brown, and black. In various embodiments, connectivity from one system to another, or one unit to another, may be by joining the conductors together via wire nuts housed within the chassis and sliding one chassis into the next. In various embodiments, connectivity from one system to another, or one unit to another, may be via a male/female port system whereby one system simply plugs into the next. In various embodiments, connectivity from one system to another, or one unit to another, may be via a coupling whereby one system plugs into one side of the coupling and the other system plugs into the other side of the coupling. 12 gauge conductors within the system may be in the form of copper, or other conductor material, that are extruded or otherwise manufactured to be flat and/or rectangular/square in their shape and housed/insulated within the chassis system to aid in the transfer of electricity through the chassis system from one block type to the next block type and the connection of one chassis system to the next chassis system. Reshaping the conductors may allow for better positioning of the conductor within the chassis for high/low positioning in multi-circuit applications and better connection of the snap-in blocks to the conductor. Blocks for receptacle and charging ports may have their conductors at specific height positions on both sides of the block which are different from the height positions for the lighting blocks. The differing height positions of the conductors on the blocks defines that a receptacle or charging port will only make contact with the conductors specific to its use in the chassis system while the lighting blocks only make contact with the conductors specific to its use in the chassis system. The differing of connections between the receptacle/charging port block types and the lighting block types is crucial in a multi-circuit system that allows for continuous connectivity to the receptacles and charging ports while also allowing the lighting to be controlled separately and remotely via a wall switch or remote control device. The attachment of the systems to the cabinetry may be via the Strap-N-Snap attachment system for the systems whereby a spring-loaded U-shaped strap is first attached to the bottom of the cabinetry using ⅜″ wood screws at multiple positions depending on the length of the chassis system. Once the straps have been secured to the bottom of the cabinetry the chassis is then snapped into the straps and held firmly in place. Strap-N-Snap allows for the installation of a corded system without the user/installer ever having to open the chassis system. In various embodiments, the light blocks for the system may be designed, dimensioned, molded, and/or otherwise fabricated for use in any existing receptacle bar or chassis systems. For example, the WIREMOLD chassis system manufactured by Legrand North America LLC, which is hereby incorporated by reference for all purposes. The light blocks may replace a receptacle block in the existing system and fit properly into the system in substantial compliance with all aspects including, for example, the size requirement, the finish requirement, the conductivity requirement, and the ability to allow other conductors to pass through it or around it. The light block may possess the same ability for the rear assembly to be detached from the front assembly. This would allow for the conductors to feed through the light block assembly in the same manner as the existing receptacle assembly. This would also energize the light block assembly and the attached or built-in G8 bulb socket, or other bulb socket size, into which an LED bulb would be inserted. The LED bulb would have specific finished dimensions to substantially match the receptacle block cutout or any other cutout size within any existing chassis system. Some of the differences between the present systems and prior systems with receptacle strips have to do with the joining of a lighting block system platform that works in conjunction with a receptacle block system platform, the internal wiring within the chassis system, the connection of the line voltage electrical wires to the system, the use of line voltage LED lighting, and the chassis system itself. Exemplary purposes of the systems are to minimize the appearance of a combined lighting and receptacle based system that is hidden from appearance underneath the upper wall cabinets in a kitchen environment from a normal standing height, and, if seen, looks completely finished in its appearance. The system also includes an all-in-one lighting and receptacle format that meets the needs of design professionals and their clients at nearly any price point including entry level kitchens. The system also includes a system of lighting and receptacle products that are installer friendly, even to the point that a DIYer can install them. For the industry professional, the system includes a system of combined lighting and receptacle based systems that can be seamlessly integrated into the cabinetry manufacturing process and meet the finish needs of the most discriminating clientele. The detailed description of exemplary embodiments herein makes reference to the accompanying drawings, which show exemplary embodiments by way of illustration and its best mode, and not of limitation. While these exemplary embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, it should be understood that other embodiments may be realized and that logical, chemical and mechanical changes may be made without departing from the spirit and scope of the invention. For example, the steps recited in any of the method or process descriptions may be executed in any order and are not necessarily limited to the order presented. Moreover, many of the functions or steps may be outsourced to or performed by one or more third parties. Furthermore, any reference to singular includes plural embodiments, and any reference to more than one component or step may include a singular embodiment or step. Also, any reference to attached, fixed, connected or the like may include permanent, removable, temporary, partial, full and/or any other possible attachment option. Additionally, any reference to without contact (or similar phrases) may also include reduced contact or minimal contact. Systems and methods are provided. In the detailed description herein, references to “various embodiments”, “one embodiment”, “an embodiment”, “an example embodiment”, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. After reading the description, it will be apparent to one skilled in the relevant art(s) how to implement the disclosure in alternative embodiments. Benefits, other advantages, and solutions to problems have been described herein with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any elements that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as critical, required, or essential features or elements of the invention. The scope of the invention is accordingly to be limited by nothing other than the appended claims, in which reference to an element in the singular is not intended to mean “one and only one” unless explicitly so stated, but rather “one or more.” Moreover, where a phrase similar to “at least one of A, B, or C” is used in the claims, it is intended that the phrase be interpreted to mean that A alone may be present in an embodiment, B alone may be present in an embodiment, C alone may be present in an embodiment, or that any combination of the elements A, B and C may be present in a single embodiment; for example, A and B, A and C, B and C, or A and B and C. Furthermore, no element, component, or method step in the present disclosure is intended to be dedicated to the public regardless of whether the element, component, or method step is explicitly recited in the claims. No claim element herein is to be construed under the provisions of 35 U.S.C. 112(f) unless the element is expressly recited using the phrase “means for.” As used herein, the terms “comprises”, “comprising”, or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. | 16,631 |
11862912 | DETAILED DESCRIPTION FIG.1is a diagram of a portion of an example communications and data management system100. The example system100shown inFIG.1includes a part of a communications network101along which communications signals S1pass. In one example implementation, the network101can include an Internet Protocol network. In other implementations, however, the communications network101may include other types of networks. The communications network101includes interconnected network components (e.g., connector assemblies, inter-networking devices, internet working devices, servers, outlets, and end user equipment (e.g., computers)). In one example implementation, communications signals S1pass from a computer to a wall outlet to a port of communication panel, to a first port of an inter-networking device, out another port of the inter-networking device, to a port of the same or another communications panel, to a rack mounted server. The portion of the communications network101shown inFIG.1includes first and second connector assemblies130,130′ at which communications signals S1pass from one portion of the communications network101to another portion of the communications network101. Non-limiting examples of connector assemblies130,130′ include, for example, rack-mounted connector assemblies (e.g., patch panels, distribution units, and media converters for fiber and copper physical communication media), wall-mounted connector assemblies (e.g., boxes, jacks, outlets, and media converters for fiber and copper physical communication media), and inter-networking devices (e.g., switches, routers, hubs, repeaters, gateways, and access points). In the example shown, the first connector assembly130defines at least one port132configured to communicatively couple at least a first media segment105to at least a second media segment115to enable the communication signals S1to pass between the media segments105,115. The at least one port132of the first connector assembly130may be directly connected to a port132′ of the second connector assembly130′. As the term is used herein, the port132is directly connected to the port132′ when the communications signals S1pass between the two ports132,132′ without passing through an intermediate port. For example, routing a patchcord between port132and port132′ directly connects the ports132,132′. The port132of the first connector assembly130also may be indirectly connected to the port132′ of the second connector assembly130′. As the term is used herein, the port132is indirectly connected to the port132′ when the communications signals S1pass through an intermediate port when traveling between the ports132,132′. For example, in one implementation, the communications signals S1may be routed over one media segment from the port132at the first connector assembly130to a port of a third connector assembly at which the media segment is coupled to another media segment that is routed from the port of the third connector assembly to the port132′ of the second connector assembly130′. Non-limiting examples of media segments include optical fibers, which carry optical data signals, and electrical conductors (e.g., CAT-5, 6, and 7 twisted-pair cables), which carry electrical data signals. Media segments also can include electrical plugs, fiber optic connectors (e.g., SC, LC, FC, LX.5, or MPO connectors), adapters, media converters, and other physical components terminating to the fibers, conductors, or other such media segments. The techniques described here also can be used with other types of connectors including, for example, BNC connectors, F connectors, DSX jacks and plugs, bantam jacks and plugs. In the example shown, each media segment105,115is terminated at a plug or connector110,120, respectively, which is configured to communicatively connect the media segments105,115. For example, in one implementation, the port132of the connector assembly130can be configured to align ferrules of two fiber optic connectors110,120. In another implementation, the port132of the connector assembly130can be configured to electrically connect an electrical plug with an electrical socket (e.g., a jack). In yet another implementation, the port132can include a media converter configured to connect an optical fiber to an electrical conductor. In accordance with some aspects, the connector assembly130does not actively manage (e.g., is passive with respect to) the communications signals S1passing through port132. For example, in some implementations, the connector assembly130does not modify the communications signal S1carried over the media segments105,115. Further, in some implementations, the connector assembly130does not read, store, or analyze the communications signal S1carried over the media segments105,115. In accordance with aspects of the disclosure, the communications and data management system100also provides physical layer information (PLI) functionality as well as physical layer management (PLM) functionality. As the term is used herein, “PLI functionality” refers to the ability of a physical component or system to identify or otherwise associate physical layer information with some or all of the physical components used to implement the physical layer of the system. As the term is used herein, “PLM functionality” refers to the ability of a component or system to manipulate or to enable others to manipulate the physical components used to implement the physical layer of the system (e.g., to track what is connected to each component, to trace connections that are made using the components, or to provide visual indications to a user at a selected component). As the term is used herein, “physical layer information” refers to information about the identity, attributes, and/or status of the physical components used to implement the physical layer of the communications system101. In accordance with some aspects, physical layer information of the communications system101can include media information, device information, and location information. As the term is used herein, “media information” refers to physical layer information pertaining to cables, plugs, connectors, and other such media segments. In accordance with some aspects, the media information is stored on or in the media segments, themselves. In accordance with other aspects, the media information can be stored at one or more data repositories for the communications system, either alternatively or in addition to the media, themselves. Non-limiting examples of media information include a part number, a serial number, a plug or other connector type, a conductor or fiber type, a cable or fiber length, cable polarity, a cable or fiber pass-through capacity, a date of manufacture, a manufacturing lot number, information about one or more visual attributes of physical communication media (e.g., information about the color or shape of the physical communication media or an image of the physical communication media), and an insertion count (i.e., a record of the number of times the media segment has been connected to another media segment or network component). Media information also can include testing or media quality or performance information. The testing or media quality or performance information, for example, can be the results of testing that is performed when a particular segment of media is manufactured. As the term is used herein, “device information” refers to physical layer information pertaining to the communications panels, inter-networking devices, media converters, computers, servers, wall outlets, and other physical communications devices to which the media segments attach. In accordance with some aspects, the device information is stored on or in the devices, themselves. In accordance with other aspects, the device information can be stored at one or more data repositories for the communications system, either alternatively or in addition to the devices, themselves. Non-limiting examples of device information include a device identifier, a device type, port priority data (that associates a priority level with each port), and port updates (described in more detail herein). As the term is used herein, “location information” refers to physical layer information pertaining to a physical layout of a building or buildings in which the network101is deployed. Location information also can include information indicating where each communications device, media segment, network component, or other component that is physically located within the building. In accordance with some aspects, the location information of each system component is stored on or in the respective component. In accordance with other aspects, the location information can be stored at one or more data repositories for the communications system, either alternatively or in addition to the system components, themselves. In accordance with some aspects, one or more of the components of the communications network101is configured to store physical layer information pertaining to the component as will be disclosed in more detail herein. InFIG.1, the connectors110,120, the media segments105,115, and/or the connector assemblies130,130′ may store physical layer information. For example, inFIG.1, each connector110,120may store information pertaining to itself (e.g., type of connector, data of manufacture, etc.) and/or to the respective media segment105,115(e.g., type of media, test results, etc.). In another example implementation, the media segments105,115or connectors110,120may store media information that includes a count of the number of times that the media segment (or connector) has been inserted into port132. In such an example, the count stored in or on the media segment is updated each time the segment (or plug or connector) is inserted into port132. This insertion count value can be used, for example, for warranty purposes (e.g., to determine if the connector has been inserted more than the number of times specified in the warranty) or for security purposes (e.g., to detect unauthorized insertions of the physical communication media). In accordance with certain aspects, one or more of the components of the communications network101also can read the physical layer information from one or more media segments retained thereat. In certain implementations, one or more network components includes a media reading interface that is configured to read physical layer information stored on or in the media segments or connectors attached thereto. For example, in one implementation, the connector assembly130includes a media reading interface134that can read media information stored on the media cables105,115retained within the port132. In another implementation, the media reading interface134can read media information stored on the connectors or plugs110,120terminating the cables105,115, respectively. In some implementations, some types of physical layer information can be obtained by the connector assembly130from a user at the connector assembly130via a user interface (e.g., a keypad, a scanner, a touch screen, buttons, etc.). The connector assembly130can provide the physical layer information obtained from the user to other devices or systems that are coupled to the network101(as described in more detail herein). In other implementations, some or all physical layer information can be obtained by the connector assembly130from other devices or systems that are coupled to the network101. For example, physical layer information pertaining to media that is not configured to store such information can be entered manually into another device or system that is coupled to the network101(e.g., at the connector assembly130, at the computer160, or at the aggregation point150). In some implementations, some types of non-physical layer information (e.g., network information) can be obtained by one network component from other devices or systems that are coupled to the network101. For example, the connector assembly130may pull non-physical layer information from one or more components of the network101. In other implementations, the non-physical layer information can be obtained by the connector assembly130from a user at the connector assembly130. In accordance with some aspects of the disclosure, the physical layer information read by a network component may be processed or stored at the component. For example, in certain implementations, the first connector assembly130shown inFIG.1is configured to read physical layer information stored on the connectors110,120and/or on the media segments105,115using media reading interface134. Accordingly, inFIG.1, the first connector assembly130may store not only physical layer information about itself (e.g., the total number of available ports at that assembly130, the number of ports currently in use, etc.), but also physical layer information about the connectors110,120inserted at the ports and/or about the media segments105,115attached to the connectors110,120. In some implementations, the connector assembly130is configured to add, delete, and/or change the physical layer information stored in or on the segment of physical communication media105,115(i.e., or the associated connectors110,120). For example, in some implementations, the media information stored in or on the segment of physical communication media105,115can be updated to include the results of testing that is performed when a segment of physical media is installed or otherwise checked. In other implementations, such testing information is supplied to the aggregation point150for storage and/or processing. In some implementations, modification of the physical layer information does not affect the communications signals S1passing through the connector assembly130. In other implementations, the physical layer information obtained by the media reading interface (e.g., interface134ofFIG.1) may be communicated (see PLI signals S2) over the network101for processing and/or storage. The components of the communications network101are connected to one or more aggregation devices150(described in greater detail herein) and/or to one or more computing systems160. For example, in the implementation shown inFIG.1, each connector assembly130includes a PLI port136that is separate from the “normal” ports132of the connector assembly130. Physical layer information is communicated between the connector assembly130and the network101through the PLI port136. In the example shown inFIG.1, the connector assembly130is connected to a representative aggregation device150, a representative computing system160, and to other components of the network101(see looped arrow) via the PLI port136. The physical layer information is communicated over the network101just like any other data that is communicated over the network101, while at the same time not affecting the communication signals S1that pass through the connector assembly130on the normal ports132. Indeed, in some implementations, the physical layer information may be communicated as one or more of the communication signals S1that pass through the normal ports132of the connector assemblies130,130′. For example, in one implementation, a media segment may be routed between the PLI port136and one of the “normal” ports132. In such an implementation, the physical layer information may be passed along the communications network101to other components of the communications network101(e.g., to the one or more aggregation points150and/or to the one or more computer systems160). By using the network101to communicate physical layer information pertaining to it, an entirely separate network need not be provided and maintained in order to communicate such physical layer information. In other implementations, however, the communications network101includes a data network along which the physical layer information described above is communicated. At least some of the media segments and other components of the data network may be separate from those of the communications network101to which such physical layer information pertains. For example, in some implementations, the first connector assembly130may include a plurality of fiber optic adapters defining ports at which connectorized optical fibers are optically coupled together to create an optical path for communications signals S1. The first connector assembly130also may include one or more electrical cable ports at which the physical layer information (see PLI signals S2) are passed to other parts of the data network. (e.g., to the one or more aggregation points150and/or to the one or more computer systems160). FIG.2is a block diagram of one example implementation of a communications management system200that includes PLI functionality as well as PLM functionality. The management system200comprises a plurality of connector assemblies202. The system200includes one or more connector assemblies202connected to an IP network218. The connector assemblies202shown inFIG.2illustrate various implementations of the connector assembly130ofFIG.1. Each connector assembly202includes one or more ports204, each of which is used to connect two or more segments of physical communication media to one another (e.g., to implement a portion of a logical communication link for communication signals S1ofFIG.1). At least some of the connector assemblies202are designed for use with segments of physical communication media that have physical layer information stored in or on them. The physical layer information is stored in or on the segment of physical communication media in a manner that enables the stored information, when the segment is attached to a port204, to be read by a programmable processor206associated with the connector assembly202. In the particular implementation shown inFIG.2, each of the ports204of the connector assemblies202comprises a respective media reading interface208via which the respective programmable processor206is able to determine if a physical communication media segment is attached to that port204and, if one is, to read the physical layer information stored in or on the attached segment (if such media information is stored therein or thereon). The programmable processor206associated with each connector assembly202is communicatively coupled to each of the media reading interfaces208using a suitable bus or other interconnect (not shown). In the particular implementation shown inFIG.2, four example types of connector assembly configurations are shown. In the first connector assembly configuration210shown inFIG.2, each connector assembly202includes its own respective programmable processor206and its own respective network interface216that is used to communicatively couple that connector assembly202to an Internet Protocol (IP) network218. In the second type of connector assembly configuration212, a group of connector assemblies202are physically located near each other (e.g., in a bay or equipment closet). Each of the connector assemblies202in the group includes its own respective programmable processor206. However, in the second connector assembly configuration212, some of the connector assemblies202(referred to here as “interfaced connector assemblies”) include their own respective network interfaces216while some of the connector assemblies202(referred to here as “non-interfaced connector assemblies”) do not. The non-interfaced connector assemblies202are communicatively coupled to one or more of the interfaced connector assemblies202in the group via local connections. In this way, the non-interfaced connector assemblies202are communicatively coupled to the IP network218via the network interface216included in one or more of the interfaced connector assemblies202in the group. In the second type of connector assembly configuration212, the total number of network interfaces216used to couple the connector assemblies202to the IP network218can be reduced. Moreover, in the particular implementation shown inFIG.2, the non-interfaced connector assemblies202are connected to the interfaced connector assembly202using a daisy chain topology (though other topologies can be used in other implementations and embodiments). In the third type of connector assembly configuration214, a group of connector assemblies202are physically located near each other (e.g., within a bay or equipment closet). Some of the connector assemblies202in the group (also referred to here as “master” connector assemblies202) include both their own programmable processors206and network interfaces216, while some of the connector assemblies202(also referred to here as “slave” connector assemblies202) do not include their own programmable processors206or network interfaces216. Each of the slave connector assemblies202is communicatively coupled to one or more of the master connector assemblies202in the group via one or more local connections. The programmable processor206in each of the master connector assemblies202is able to carry out the PLM functions for both the master connector assembly202of which it is a part and any slave connector assemblies202to which the master connector assembly202is connected via the local connections. As a result, the cost associated with the slave connector assemblies202can be reduced. In the particular implementation shown inFIG.2, the slave connector assemblies202are connected to a master connector assembly202in a star topology (though other topologies can be used in other implementations and embodiments). Each programmable processor206is configured to execute software or firmware that causes the programmable processor206to carry out various functions described below. Each programmable processor206also includes suitable memory (not shown) that is coupled to the programmable processor206for storing program instructions and data. In general, the programmable processor206determines if a physical communication media segment is attached to a port204with which that processor206is associated and, if one is, to read the identifier and attribute information stored in or on the attached physical communication media segment (if the segment includes such information stored therein or thereon) using the associated media reading interface208. In the fourth type of connector assembly configuration215, a group of connector assemblies202are housed within a common chassis or other enclosure. Each of the connector assemblies202in the configuration215includes their own programmable processors206. In the context of this configuration215, the programmable processors206in each of the connector assemblies are “slave” processors206. Each of the slave programmable processor206is also communicatively coupled to a common “master” programmable processor217(e.g., over a backplane included in the chassis or enclosure). The master programmable processor217is coupled to a network interface216that is used to communicatively couple the master programmable processor217to the IP network218. In this configuration215, each slave programmable processor206is configured to determine if physical communication media segments are attached to its port204and to read the physical layer information stored in or on the attached physical communication media segments (if the attached segments have such information stored therein or thereon) using the associated media reading interfaces208. The physical layer information is communicated from the slave programmable processor206in each of the connector assemblies202in the chassis to the master processor217. The master processor217is configured to handle the processing associated with communicating the physical layer information read from by the slave processors206to devices that are coupled to the IP network218. The system200includes functionality that enables the physical layer information that the connector assemblies202capture to be used by application-layer functionality outside of the traditional physical-layer management application domain. That is, the physical layer information is not retained in a PLM “island” used only for PLM purposes but is instead made available to other applications. In the particular implementation shown inFIG.2, the management system200includes an aggregation point220that is communicatively coupled to the connector assemblies202via the IP network218. The aggregation point220includes functionality that obtains physical layer information from the connector assemblies202(and other devices) and stores the physical layer information in a data store. The aggregation point220can be used to receive physical layer information from various types of connector assemblies202that have functionality for automatically reading information stored in or on the segment of physical communication media. Also, the aggregation point220and aggregation functionality224can be used to receive physical layer information from other types of devices that have functionality for automatically reading information stored in or on the segment of physical communication media. Examples of such devices include end-user devices—such as computers, peripherals (e.g., printers, copiers, storage devices, and scanners), and IP telephones—that include functionality for automatically reading information stored in or on the segment of physical communication media. The aggregation point220also can be used to obtain other types of physical layer information. For example, in this implementation, the aggregation point220also obtains information about physical communication media segments that is not otherwise automatically communicated to an aggregation point220. This information can be provided to the aggregation point220, for example, by manually entering such information into a file (e.g., a spreadsheet) and then uploading the file to the aggregation point220(e.g., using a web browser) in connection with the initial installation of each of the various items. Such information can also, for example, be directly entered using a user interface provided by the aggregation point220(e.g., using a web browser). The aggregation point220also includes functionality that provides an interface for external devices or entities to access the physical layer information maintained by the aggregation point220. This access can include retrieving information from the aggregation point220as well as supplying information to the aggregation point220. In this implementation, the aggregation point220is implemented as “middleware” that is able to provide such external devices and entities with transparent and convenient access to the PLI maintained by the access point220. Because the aggregation point220aggregates PLI from the relevant devices on the IP network218and provides external devices and entities with access to such PLI, the external devices and entities do not need to individually interact with all of the devices in the IP network218that provide PLI, nor do such devices need to have the capacity to respond to requests from such external devices and entities. For example, as shown inFIG.2, a network management system (NMS)230includes PLI functionality232that is configured to retrieve physical layer information from the aggregation point220and provide it to the other parts of the NMS230for use thereby. The NMS230uses the retrieved physical layer information to perform one or more network management functions. The NMS230communicates with the aggregation point220over the IP network218. As shown inFIG.2, an application234executing on a computer236can also use the API implemented by the aggregation point220to access the PLI information maintained by the aggregation point220(e.g., to retrieve such information from the aggregation point220and/or to supply such information to the aggregation point220). The computer236is coupled to the IP network218and accesses the aggregation point220over the IP network218. In the example shown inFIG.2, one or more inter-networking devices238used to implement the IP network218include physical layer information (PLI) functionality240. The PLI functionality240of the inter-networking device238is configured to retrieve physical layer information from the aggregation point220and use the retrieved physical layer information to perform one or more inter-networking functions. Examples of inter-networking functions include Layer 1, Layer 2, and Layer 3 (of the OSI model) inter-networking functions such as the routing, switching, repeating, bridging, and grooming of communication traffic that is received at the inter-networking device. The aggregation point220can be implemented on a standalone network node (e.g., a standalone computer running appropriate software) or can be integrated along with other network functionality (e.g., integrated with an element management system or network management system or other network server or network element). Moreover, the functionality of the aggregation point220can be distribute across many nodes and devices in the network and/or implemented, for example, in a hierarchical manner (e.g., with many levels of aggregation points). The IP network218can include one or more local area networks and/or wide area networks (e.g., the Internet). As a result, the aggregation point220, NMS230, and computer236need not be located at the same site as each other or at the same site as the connector assemblies202or the inter-networking devices238. Also, power can be supplied to the connector assemblies202using conventional “Power over Ethernet” techniques specified in the IEEE 802.3af standard, which is hereby incorporated herein by reference. In such an implementation, a power hub242or other power supplying device (located near or incorporated into an inter-networking device that is coupled to each connector assembly202) injects DC power onto one or more of the wires (also referred to here as the “power wires”) included in the copper twisted-pair cable used to connect each connector assembly202to the associated inter-networking device. FIG.3is a schematic diagram of one example connection system300including a connector assembly320configured to collect physical layer information from a connector arrangement310. The example connection system300shown includes a jack module320and an electrical plug310. The connector arrangement310terminates at least a first electrical segment (e.g., a conductor cable)305of physical communications media and the connector assembly320terminates at least second electrical segments (e.g., twisted pairs of copper wires)329of physical communications media. The connector assembly320defines at least one socket port325in which the connector arrangement310can be accommodated. Each electrical segment305of the connector arrangement310carries communication signals (e.g., communications signals S1ofFIG.1) to primary contact members312on the connector arrangement310. The connector assembly320includes a primary contact arrangement322that is accessible from the socket port325. The primary contact arrangement322is aligned with and configured to interface with the primary contact members312to receive the communications signals (S1ofFIG.1) from the primary contact members312when the connector arrangement310is inserted into the socket325of the connector assembly320. The connector assembly320is electrically coupled to one or more printed circuit boards. For example, the connector assembly320can support or enclose a first printed circuit board326, which connects to insulation displacement contacts (IDCs)327or to another type of electrical contacts. The IDCs327terminate the electrical segments329of physical communications media (e.g., conductive wires). The first printed circuit board326manages the primary communication signals carried from the conductors terminating the cable305to the electrical segments329that couple to the IDCs327. In accordance with some aspects, the connector arrangement310can include a storage device315configured to store physical layer information. The connector arrangement310also includes second contact members314that are electrically coupled (i.e., or otherwise communicatively coupled) to the storage device315. In one implementation, the storage device315is implemented using an EEPROM (e.g., a PCB surface-mount EEPROM). In other implementations, the storage device315is implemented using other non-volatile memory device. Each storage device315is arranged and configured so that it does not interfere or interact with the communications signals communicated over the media segment305. The connector assembly320also includes a second contact arrangement (e.g., a media reading interface)324. In certain implementations, the media reading interface324is accessible through the socket port325. The second contact arrangement324is aligned with and configured to interface with the second contact members314of the media segment to receive the physical layer information from the storage device315when the connector arrangement310is inserted into the socket325of the connector assembly320. In some such implementations, the storage device interfaces314and the media reading interfaces324each comprise three (3) leads—a power lead, a ground lead, and a data lead. The three leads of the storage device interface314come into electrical contact with three (3) corresponding leads of the media reading interface324when the corresponding media segment is inserted in the corresponding port325. In certain example implementations, a two-line interface is used with a simple charge pump. In still other implementations, additional leads can be provided (e.g., for potential future applications). Accordingly, the storage device interfaces314and the media reading interfaces324may each include four (4) leads, five (5) leads, six (6) leads, etc. The storage device315also may include a processor or micro-controller, in addition to the storage for the physical layer information. In some example implementations, the micro-controller can be used to execute software or firmware that, for example, performs an integrity test on the cable305(e.g., by performing a capacitance or impedance test on the sheathing or insulator that surrounds the cable305, (which may include a metallic foil or metallic filler for such purposes)). In the event that a problem with the integrity of the cable305is detected, the micro-controller can communicate that fact to a programmable processor (e.g., processor206ofFIG.2) associated with the port using the storage device interface (e.g., by raising an interrupt). The micro-controller also can be used for other functions. The connector assembly320also can support or enclose a second printed circuit board328, which connects to the second contact arrangement324. The second printed circuit board328manages the physical layer information communicated from a storage device315through second contacts314,324. In the example shown, the second printed circuit board328is positioned on an opposite side of the connector assembly320from the first printed circuit board326. In other implementations, the printed circuit boards326,328can be positioned on the same side or on different sides. In one implementation, the second printed circuit board328is positioned horizontally relative to the connector assembly320(seeFIG.3). In another implementation, the second printed circuit board328is positioned vertically relative to the connector assembly320. The second printed circuit board328can be communicatively connected to one or more programmable electronic processors and/or one or more network interfaces. In one implementation, one or more such processors and interfaces can be arranged as components on the printed circuit board328. In another implementation, one of more such processor and interfaces can be arranged on a separate circuit board that is coupled to the second printed circuit board328. For example, the second printed circuit board328can couple to other circuit boards via a card edge type connection, a connector-to-connector type connection, a cable connection, etc. The network interface is configured to send the physical layer information to the data network (e.g., see signals S2ofFIG.1). FIGS.4-78provide example implementations of physical layer management networks and components for electrical (e.g., copper) communications applications.FIGS.4-14show an example of a connector arrangement5000in the form of a modular plug5002for terminating an electrical communications cable5090. The connector arrangement5000is configured to be received within a port of a connector assembly as will be described in more detail herein. In accordance with one aspect, the connector arrangement5000includes a plug5002, such as an RJ plug, that connects to the end of an electrical segment of communications media, such as twisted pair copper cable5090. The plug5002includes a wire manager5008for managing the twisted wire pairs and a strain relief boot5010, which snaps to the plug5002(seeFIGS.4and5). For example, the plug5002defines openings5005in which lugs5009on the wire manager5008can latch (seeFIG.13).FIGS.12-14show details of one example wire manager5008and boot5010suitable for use with the plug5002. In the example shown, the wire manager5008and boot5010are integrally formed. A first portion5008A of the wire manager5008is connected to a second portion5008B with a living hinge. In other implementations, however, other types of wire managers and boots may be utilized. The plug5002also includes a plug nose body5004having a first side5014and a second side5016(FIGS.6-11). In one embodiment, a shield5003can be mounted to the plug nose body5004. For example, the shield5003can be snap-fit to the plug nose body5004. The first side5014of the plug nose body5004includes a key member5015and a finger tab5050that extends outwardly from the key member5015. The key member5015and finger tab5050facilitates aligning and securing the connector arrangement5000to a connector assembly as will be described in more detail herein. In certain implementations, the finger tab5050attaches to the plug nose body5004at the key member5015. In one implementation, the finger tab5050and the key member5015are unitary with the plug nose body5004. The finger tab5050is sufficiently resilient to enable a distal end5051of the finger tab5050to flex or pivot toward and away from the plug nose body5004. Certain types of finger tabs5050include at least one cam follower surface5052and a latch surface5054for latching to the connector assembly as will be described in more detail herein. In certain implementations, the finger tab5050includes two cam follower surfaces5052located on either side of a handle extension5053(seeFIG.6). Depressing the handle extension5053moves the latch surfaces5054toward the plug nose body5004. In certain implementations, the wire manager5008and/or boot5010include a flexible grip surface5011that curves over at least the distal end5051of the handle extension5053to facilitate depressing of the handle extension5053(e.g., seeFIG.4). The second side5016of the plug nose body5004is configured to hold main signal contacts5012, which are electrically connected to the twisted pair conductors of the communications cable. Ribs5013protect the main signal contacts5012. In the example shown, the plug5002is insertable into a port of a mating jack of a connector assembly, such as port325of jack module320ofFIG.3. The main signal contacts5012of the plug5002electrically connect to contacts positioned in the jack module to create an electrical path over which communications signals, such as signals S1ofFIG.1, are carried. In accordance with other aspects, however, the connector arrangement5000can define other types of electrical connections. In some implementations, the key member5015of the plug nose body5004defines a cavity5060(seeFIG.6). In accordance with some aspects, the key member5015is positioned at a front of the plug nose body5004. In the example shown, the key member5015forms the base5052of the finger tab5050. The key member5015includes support members5016that defines guide grooves5017in the interior sides of the housing member5015. The connector arrangement5000also includes a storage device5030(FIG.7) that is configured to store information (e.g., an identifier and/or attribute information) pertaining to the segment of physical communications media (e.g., the plug5002and/or the electrical cable terminated thereat). In some embodiments, the connector arrangement5000also can include additional components to aid in physical layer management. In some embodiments, the storage device5030can be arranged on a printed circuit board5020that is mounted to the modular plug5002(seeFIGS.8-9). In the example shown, the printed circuit board5020can be slid along the guide grooves5017within the cavity5060defined by the housing member5015. In certain embodiments, additional components can be arranged on the printed circuit board5020. In the example shown inFIGS.6-7, the printed circuit board5020includes a substrate with conductive traces electrically connecting contacts and lands. The circuit5020also includes circuit components, including the media storage device5030, at the lands. In the example shown inFIG.7, the circuit5020includes an EEPROM5032. In one embodiment, the EEPROM5032forms the media storage device5030for modular plug5002. In other embodiments, however, the storage device5030can include any suitable type of memory. In accordance with some aspects, the circuit5020defines a body5022having a first side5021and a second side5023. The EEPROM5032can be mounted to the second side5023of the PCB body5022. The circuit contacts5034are arranged on the first side5023of the PCB body5022. The circuit contacts5034permit connection of the EEPROM5032to a media reading interface, such as media reading interface324ofFIG.3. The plug5002also includes a plug cover5006that mounts on the plug nose body5004(seeFIGS.8-9). In the example shown, the plug cover5006mounts to the housing member5015to enclose the cavity5060. For example, the plug cover5006includes a body5040defining a first side5042and a second side5044. In the example shown, the first side5042is generally orthogonal to the second side5044. Ribs5046extend between the first and second sides5042,5044. In the example shown, the ribs5046extend over a curved edge defined by the first and second sides5042,5044. In one example, contacts of a media reading interface on a patch panel can extend through the ribs5046to connect to the circuit contacts5034on the printed circuit board5020. The body5040of the plug cover5006can define latch arms5007configured to latch within the cavity5060defined in the housing member5015. For example, the latch arms5007can latch behind the support members5016defined in the cavity5060. In the example shown, the latch arms5007are configured to extend beneath the printed circuit board5020when the board5020is mounted within the guiding grooves5017in the cavity5060. In one implementation, the plug cover5006fits generally flush with the housing member5015when the printed circuit board5020is mounted within the housing member5015(seeFIGS.10-11) In accordance with some aspects, the connector arrangement is manufactured by fabricating a plug body5004including a key member5015, mounting a storage device5030within a cavity5060of the key member5015, and closing the cavity5060with a cover member5006. In some implementations, fabricating the plug body5004includes molding the plug body5004with the cavity5060in the key member5015. In other implementations, fabricating the plug body5004includes molding the plug body5004with the key member5015and subsequently eliminating (e.g., cutting, melting, disintegrating, etc.) material in the key member5015to form the cavity5060. In some implementations, the storage device5030is manufactured by mounting an EEPROM chip5032on a printed circuit board5020. Contacts5034also are mounted to the printed circuit board5020to be electrically connected to the EEPROM chip5032via tracings of the printed circuit board5020. In certain implementations, the EEPROM5032is mounted to one side of the printed circuit board and the contacts5034are mounted to a different (e.g., opposite) side. In some implementations, positioning the storage device5030within the plug cavity5060includes sliding the storage device5030along guides5017formed in the cavity5060. In certain implementations, mounting the storage device5030within the cavity5060including positioning the storage device5030within the cavity5060with the contact pads5034outwardly from the plug body5004and the EEPROM5032facing inwardly toward the plug body5004. In certain implementations, closing the cavity5060of the plug5002includes latching the cover member5006to inner surfaces of the key member5015. FIG.15shows one example connector arrangement5000(e.g., plug5002) being inserted into an example connector assembly5100. The example connector assembly5100shown includes a jack module5110defining a socket5112that is configured to receive the plug5002. In one implementation, the jack module5110includes an RJ-45 jack socket5112. In other implementations, the jack module5110may include another type of jack socket. FIGS.16-23illustrate one example jack module5110that is suitable for use with the plug5002disclosed herein. The jack module5110also defines slots5119through which plug connection contacts5141extend into the socket5112. The plug connection contacts5141define contact surfaces5142at which the plug connection contacts5141contact the main signal contacts5012of the plug5002. The jack module5110defines a guide surface5114within the socket5112that the plug5002follows when inserted into the jack module5110(FIG.17). The guide surface5114leads to a stop surface5115within the socket5112that abuts against a front end of the plug5002when the plug5002is inserted. Certain types of jack modules5110also include latching members5116that retain the plug5002within the socket5112when the plug5002is inserted (seeFIG.17). In some implementations, the latching members5116having a first end defining a cam surface5117and a second end defining a shoulder5118(FIG.19). When the plug5002is inserted into the socket5112, the cam follower surfaces5052on the finger tab5050of the plug5002ride over the cam surface5117of the latching member5116of the jack module5110. When the plug5002has been sufficiently inserted, the latch surfaces5054of the finger tab5050snap behind the shoulders5118of the latching members5116of the jack module5110. The latching members5116retain the plug5002within the socket5112and guard against unintentional removal of the plug5002from the socket5112. To remove the plug5002from the socket5112, a user may depress the handle extension5053of the finger tab5050to flex the finger tab5050toward the plug nose body5004. For example, the user may push on the flexible grip surface5011on the plug5002, which presses on the handle extension5053of the finger tab5050. Flexing the finger tab5050toward the plug nose body5004lifts the latch surfaces5054out of alignment with the shoulders5118of the latching members5116of the jack module5110, thereby allowing a user to pull the plug5002out of the socket5112. In certain types of jack modules5110, the plug connection contacts5141of the jack module5110are configured to electrically couple to one or more insulation displacement contacts (IDCs)5144located at an IDC section5121of the jack module5110(seeFIG.32). Inserting the plug5002into the socket5112brings the main signal contacts5012of the plug5002into contact with the contact surfaces5142of the plug connection contacts5141, thereby establishing an electrical connection therebetween. Signals carried by the media segments terminated at the plug5002may be transferred to media segments terminated at the IDCs5144via the plug main signal contacts5012of the jack module5110. In other implementations, however, the plug connection contacts5141may connect to other types of contacts, such as plug contacts of another jack module, or to other electrical components. In some implementations, the plug connection contacts5141connect directly to the IDCs5144. For example, in one implementation, the plug connection contacts5141and the IDCs5144may form a unitary contact member. In other implementations, the plug connection contacts5141connect to the IDCs5144via a first printed circuit board5143. For example, in one implementation, the plug connection contacts5141and the IDCs5144may connect to the printed circuit board5143using solder pins, using a surface mount connection, or using another type of connection (seeFIG.32). Certain types of jack modules5110includes a seat5120configured to support the first printed circuit board5143. In the example shown inFIG.32, the first printed circuit board5143extends in a plane that is parallel to the insertion axis of the plug5002. In some implementations, the jack module5110also includes a strain relief member5130that aids in retaining a second electrical cable at the jack module5110. In particular, the strain relief member5130aids in retaining a second electrical cable having electrical conductors (e.g., wires) terminated at the IDCs5144of the jack module5110. Certain types of strain relief members5130include a support surface5131connected to at least one arm5132having a latching tab5133that connects to the jack module5110. In the example shown inFIGS.18,19, and21, the example strain relief member5130includes a curved support surface5131extending between two arms5132, each arm5132defining a latching tab5133. The jack module5110defines at least one rib5129at which the latching tab5133of the strain relief member5130may latch. In the example shown, the jack module5110defines multiple ribs5129at each side of the jack module5110. The strain relief device5130may be adjusted to accommodate various types and sizes of second cables by latching the tabs5133of the strain relief device5130to appropriate ribs5129. In certain implementations, the strain relief device5130defines a spring clip such that outward pressure applied to the support member5131causes the arms5132to flex toward the sides of the jack module5110, thereby strengthening the force with which the strain relief device5130attaches to the jack module5110. In one implementation, the support member5131defines one or more protrusions, cutouts, bumps, or other surface texturing members that aid in retaining the cable against the support member5131(e.g., seeFIG.18). In some implementations, the jack module5110includes a second section5138that couples to the first section5111. In certain implementations, the first section5111defines the socket5112, the latching members5116, and the IDC section5121. In such implementations, the second section5138may cover at least the IDC section5121of the first section5111to protect the conductor terminations at the IDCs5144. For example, certain types of second sections5138include a base5139that extends across the IDC section5121and arms5140that extend over sides of the jack module5110(FIG.16). The arms5140of the second section5138may latch or otherwise attach to the first section5111of the jack module5110. In some implementations, the first section5111defines the ribs5129to which the strain relief member5130attaches. In other implementations, however, the second section5138may define the ribs5129. In some implementations, an electrically conductive shield5134may be installed (e.g., snap-fit, clipped, latched, etc.) on the jack module5110(FIG.17). For example, the shield5134may be used to ground the jack module5110and electrical segments connected therein. In the example shown, the conductive shield5134includes a first section5135that extends over a first side of the jack module5110and side sections5136that extend over the sides of the jack module5110. In certain implementations, the shield5134includes wrap-around sections5137that wrap around the front of the jack module5110and extend at least partially into the socket5112. The wrap-around sections5137are configured to contact the shield5003of the plug5002when the plug5002is inserted in the jack module5110. In one implementation, the wrap-around sections5137define a resilient section to aid in making contact with the plug shield5003. Certain types of jack modules5110are configured to mount to a patch panel as will be described in more detail herein. In some implementations, the jack module5110includes guides5122that aid in installing the jack module5110in an example patch panel. In the example shown inFIGS.16-23, the guides5122define wing extensions having ramped or camming surfaces at a first end. In one implementation, the jack module5110includes a guide5122extending outwardly from each side of the jack module5110(FIGS.20-21). In one implementation, the guides5122are formed on the first section5111of the jack module5110. Certain types of jack modules5110also may include a panel latching arrangement5123to aid in securing the jack module5110to a patch panel. In some implementations, the panel latching arrangement5123includes at least a first latch member having a ramped surface5124and a shoulder5125. In the example shown, the panel latching arrangement5123includes two latch members separated by a gap5126. Each latch member defines a ramped surface5124at one end and a shoulder5125at the opposite end. In certain implementations, the latch members are generally located between the guides5122. In certain implementations, the panel latching arrangement5123is located on the first section5111of the jack module5110. Referring back toFIG.15, the connector assembly5100also includes a media reading interface5145(FIGS.24-29) coupled to the jack module5110. The media reading interface5145includes a second set of contacts5146that are configured to contact the storage device contacts5034of the plug5002(e.g., seeFIG.30) to provide a conductive path between the storage device contacts5034and a data network, such as network101ofFIG.1or network218ofFIG.2. In certain implementations, the second contacts5146connect to a second printed circuit board5165(seeFIG.32) that is configured to connect to the data network (e.g., via a processor and/or network interface as described herein). In accordance with some aspects, at least portions of the second contacts5146of the media reading interface5145extend into the socket5112of the jack module5110. In some implementations, the portions of the second contacts5146may extend through a cutout5113defined in a surface of the jack module5110(seeFIG.31). The cutout5113provides access to the jack socket5112through a wall of the jack module5110. In some implementations, the cutout5113is continuous with a socket port at the front of the jack module5110. In certain implementations, the cutout5113may be located at an opposite side of the jack module5110from the contact slots5119through which the plug connection contacts5141extend into the socket5112(e.g., seeFIG.15). For example, in one implementation, the cutout5113is located on the same side of the jack module5110as the latching members5116for securing the plug5002(e.g., seeFIG.31). Certain types of jack modules5110may include guide members5127(seeFIGS.16,19, and20) that aid in securing the media reading interface5145to the jack module5110. In the example shown inFIG.16, the guide members5127are located on either side of the cutout5113. In other implementations, the guide members5127may be located elsewhere on the jack module5110. In some implementations, the guide members5127define channels5128(FIG.20) that are configured to receive portions of the media reading interface5145(e.g., seeFIG.15). One example media reading interface5145is shown inFIGS.24-29. The example media reading interface5145is suitable for use with the jack module5110shown inFIGS.16-23. The media reading interface5145includes guide flanges5151(FIG.24) that are sized and shaped to be received within the channels5128of the guide members5127of the jack module5110. In one implementation, the guide flanges5151include stops (e.g., bumps)5152that aid in securing the media reading interface5145to the guide members5127of the jack module5110(seeFIG.24). For example, the stops5152may be defined at forward ends of the guide flanges5151. In some implementations, the media reading interface5145also includes a stop arrangement5163. In the example shown inFIG.24, the stop arrangement5163defines a generally U-shaped upward extension including laterally extending wings that define guide channels on either side of the stop5163. In some implementations, the media reading interface5145is mounted to the jack module5110by sliding the guide flanges5151of the media reading interface5145into the guide channels5128of the jack module5110. In certain implementations, the stop5163of the media reading interface5145defines wings that ride over the camming surfaces of the latching members5116of the jack module5110when the media reading interface5145is inserted. The example media reading interface5145also defines a channel5150(FIGS.25and29) configured to receive a second printed circuit board5165, which connects to a data network. For example, the second printed circuit board5165may connect to a processor (e.g., a slave processor or a master processor) and/or to a network interface for connection to the data network. In certain implementations, the second printed circuit board5165extends in a plane that is generally orthogonal to the insertion axis of the plug5002into the socket5112. In one implementation, the second printed circuit board5165extends in a plane that is generally orthogonal to the first printed circuit board5143. As shown inFIGS.26and27, the second contacts5146include one or more contact members that extend from first sections defining plug contact surfaces5147to second sections defining PCB contact surfaces5148. The plug contact surfaces5147of the second contacts5146extend out of the media reading interface5145, through the cutout5113of the jack module5110, and into the jack socket5112. The PCB contact surfaces extend into the channel5150to contact the second printed circuit board5165(seeFIG.25). In certain implementations, the second sections of the second contacts5146curve around in a J-shape to align the PCB contact surfaces5148with the second circuit board5165within the channel5150. In certain implementations, the media reading interface5145includes a first housing part5156and a second housing part5160. The second contacts5146are held between the first and second housing parts5156,5160. In some implementations, the channel5150for the second circuit board5165is formed in the first housing part5156. In other implementations, the channel5150is formed in the second housing part5160. In still other implementations, the first and second housing parts5156,5160cooperate to form the channel5150(e.g., seeFIG.32). In some implementations, the first housing part5156defines a viewing channel5153that forms a passage between the PCB channel5150and an exterior of the media reading interface5145. The viewing channel5153is configured to align with a light indicator (e.g., an LED)5169installed on the second printed circuit board5165(e.g., seeFIG.42). In some implementations, the first housing part5156forms a main housing and the second housing part5160defines a retention section. The first housing part5156defines the PCB channel5150extending between front and rear flanges. The viewing channel5153extends through the front flange. The rear flange defines a passage5158in which the second housing part5160may be received. In certain implementations, one of the housing parts5156,5160defines alignment members and the other of the housing parts5156,5160defines alignment slots to aid in assembling the media reading interface5146(e.g., seeFIG.26). Further, in certain implementations, one of the housing parts5156,5160defines slots in which the contact members of the second contacts5146may be received. For example, in some implementations, the first housing part5156defines slots5157that receive the contact members of the second contacts5146. Indeed, in some implementations, the second housing part5160includes ribs5161that aid in spacing the contact members of the second contacts5146and inhibit touching of the contact members. The slots5157of the first housing part5156align with channels between the ribs5161of the second housing part5160. In some implementations, the second contacts5146form spring contacts. In some such implementations, the first sections are configured to flex toward the stop5163when a plug5002presses against the plug contact surfaces5147. For example, the first sections may pass through the channels defined between the ribs5161. In certain implementations, the stop5163defines a ramped surface5164facing the second contacts5146. The ramped surface5164may be shaped and positioned to accommodate flexing of the second contacts5146when a plug5002is inserted into the jack5110. In some implementations, the second housing part5160is configured to latch to the first housing part5156. For example, in some implementations, the second housing part includes one or more latch members5162that are configured to latch to latching recesses5159of the first housing part5156. In one implementation, each latch member5162defines a ramped surface and an opposite facing shoulder (FIGS.26-27). In other implementations, the latch members may be defined on the first housing part5156and the latching recesses may be defined on the second housing part5160. In still other implementations, the second housing part5160may be otherwise secured to the first housing part5156. In accordance with some aspects, certain types of media reading interfaces5145are configured to aid in determining whether a plug5002has been received in the socket5112of the jack module5110. In some implementations, the media reading interface5145includes a sensing member that interacts with at least some of the second contacts5146. In other implementations, the media reading interface5145includes a shorting pin5155that extends across at least two contact members of the second contacts5146(seeFIGS.28and31). At least some of the contact members of the second contacts5146define shorting surfaces5149that are configured to selectively contact the shorting pin5155. The shorting pin5155causes an electrical short between two or more contact members of the second contacts5146when the shorting surfaces5149of the contact members touch the shorting pin5155. The second printed circuit board5165is configured to determine whether the contact members are shorted together. In some implementations, the media reading interface5145defines a pin receiving passage5154(FIGS.27-29) in which the shorting pin5155may be received. In some implementations, the pin receiving passage5154is defined in the first housing part5156. In certain implementations, the passage5154extends across two contact member slots5157of the first housing5156. In other implementations, the passage5154extends cross all contact members slots5157of the first housing part5156. In still other implementations, the pin receiving passage5154may be defined in the second housing part5160. As shown inFIG.32, when the plug5002is received in the socket5112of the jack module5110, the main signal contacts5012touch the plug connection contacts5141and the storage member contacts5034touch the plug contact surfaces5147of the second contacts. The key member5015of the plug5002pushes the first sections of the second contacts5146downwardly (seeFIG.30). Depressing the plug contact surfaces5147of the second contacts5146pulls the shorting surfaces5149away from the shorting pin5155(seeFIG.32), thereby eliminating the electrical short between the contact members. Referring toFIGS.33-78, in accordance with some aspects, one or more jack modules5110and media reading interfaces5145can be coupled together to form patch panels. In general, the patch panels have fronts, rears, first sides, and second sides. The fronts of the patch panels defines multiple front ports at which to receive plugs (e.g., plug5002ofFIGS.4-14) that terminate electrical cables. The rears of the patch panels define multiple rear terminations at which additional electrical cables may be received and terminated. In some implementations, the rear terminations include fixed terminations, such as insulation displacement contacts. For example, in certain implementations, the sockets5112of the jack modules5110define the front ports and the IDCs5144of the jack modules5110define the rear terminations. In other implementations, the rear terminations may include additional jack modules or other types of connectors. FIGS.33-51show a first example patch panel5200having a front5201, a rear5202, a first side5203, and a second side5204. The patch panel5200is configured to hold at least one jack module (e.g., jack module5110ofFIGS.16-23) and at least one media reading interface (e.g., media reading interface5145ofFIGS.24-29). The front5201of the first example patch panel5200defines one or more front ports5205through which the sockets of the jack modules are accessible. The rear5202of the first example patch panel5200includes rear terminations defined by the IDS section5121of the jack modules. The patch panel5200includes mounting members5206that are configured to enable installation of the patch panel5200to a rack, frame, cabinet, or other equipment structure. In certain implementations, the mounting members5206are located at the sides5203,5204of the patch panel5200. In the example shown, the mounting members5206define openings5207through which fasteners (e.g., screws, bolts, rivets, etc.) may extend to secure the patch panel5200to one or more rails. In some implementations, the patch panel5200includes a front housing part5210and a rear housing part5220(seeFIG.34). The first housing part5210defines the front ports5205. In some implementations, the front housing part5210includes a frame5240. In certain implementations, the front housing part5210also includes a fascia5250that is removeably coupled to the frame5240. In certain implementations, the patch panel5200also includes a grounding connection5209(FIG.35). The grounding connection5209may connect to the shields5134of the jack modules5110and/or to the second printed circuit board5165. The rear housing part5220includes at least one or more jack modules5110mounted to a chassis5230. In certain implementations, the rear housing part5220also includes one or more media reading interfaces5145. In one implementation, the patch panel5200has the same number of jack modules5110and media reading interfaces5145. In other implementations, the patch panel5200has more jack modules5110than media reading interfaces5145. For example, in one implementation, the patch panel5200may have twice as many jack modules5110than media reading interfaces5145. In other implementations, the patch panel5200may include more media reading interfaces5145than jack modules5110. For example, in certain implementations, each jack module5110may define two plug sockets. In such implementations, each plug socket may have its own media reading interface5145. In some implementations, the media reading interfaces5145are mounted to a printed circuit board5165. In the example shown inFIG.34, multiple media reading interfaces5145mount over at least a first edge of the second printed circuit board5165. Each media reading interface5145also is connected to at least one jack module5110. The second printed circuit board5165in installed at the patch panel5200. For example, inFIG.34, the second printed circuit board5165is configured to be held between the first housing part5210and the second housing part5220. In some implementations, the first housing part5210is fastened to the second housing part5220. In the example shown, the frame5240defines one or more first openings5212, the second printed circuit board5165defines one or more second openings5222, and the chassis5230defines one or more third openings5224. One or more fasteners (e.g., screws, bolts, etc.)5215are configured to extend through the first, second, and third openings5212,5222,5224to secure the second printed circuit board5165between the frame5240and the chassis5230. In certain implementations, the fastener5215is configured to extend through a spacer5218positioned between the frame5240and the second printed circuit board5165. In the example shown, a threaded fastener5215is configured to extend through the openings5212,5222,5224. In some implementations, the threaded fastener5215is configured to screw directly into the chassis5230(e.g., into the passages5224defined in the chassis5230). In other implementations, however, the threaded fastener5215is configured to screw into a threaded insert5225. In some such implementations, the threaded insert5225may abut against a portion of the chassis5230from a rear of the chassis5230. For example, the threaded insert5225may mount at least partially within the passage5224defined in the chassis5230and abut against a forward or intermediate surface of the chassis5230. Of course, any of these attachment mechanisms can be used on the components of any of the patch panels disclosed herein. The patch panel5200may be configured to receive a processing unit (e.g., a CPU)5270. In generally, the processing unit5270includes at least one processor (e.g., processor206or processor217ofFIG.2). For example, the second printed circuit board5165may define a connector or connector port (e.g., seeFIG.57) that connects to a connector port or connector5271on the processing unit5270. The second printed circuit board5165electrically connects the media reading interfaces5145to the processing unit5270. Accordingly, the processing unit5270may request one or more of the media reading interfaces5145to read information (e.g., physical layer information) from the storage device5030of one or more corresponding plugs5002. The processing unit5270also may receive the information from the media reading interfaces5145and provide the information to a data network (e.g., network101ofFIG.1or network218ofFIG.2). In certain implementations, the processing unit5270also may provide (e.g., write) information to the storage device5030of one or more plugs5002via the media reading interfaces5145. In some implementations, the patch panel5200also may include at least one cable manager5260. In certain implementations, the patch panel5200includes a cable manager5260that organizes the cables connected to the rear terminations. In some implementations, the cable manager5260mounts to the second housing part5220. For example, in one implementation, the cable manager5260mounts to the chassis5230. In another implementation, the cable manager mounts to the grounding assembly5209(e.g., seeFIG.52) that mounts to the chassis5230. In other implementations, the cable manager5206may mount to the front housing part5210. One example implementation of a frame5240is shown inFIG.34B. The frame5240includes a frame body5241defining at least one opening5242through which a plug5002can access a socket5112of a jack module5110. In certain implementations, the openings5242are sufficiently large to enable the front of both the jack module5110and the media reading interface5145to be viewing from a front of the frame5240when the first and second housing parts5210,5220are mounted together. For example, the viewing channel5153of the media reading interface5145may be viewing through the frame opening5242. In certain implementations, the frame body5241defines upper and lower bent flanges5243that wrap around portions of the second housing part5220to aid in retaining the first and second housing parts5210,5220. In certain implementations, the lower flange5243may aid in retaining the second printed circuit board5165within the patch panel5200. For example, the lower bent flange5243of the frame body5241may extend over a bottom of the second circuit board5165to hold the second circuit board5165within the channel5150defined in the second media reading interface (e.g., seeFIG.51) As noted above, the frame body5241also defines openings5212through which fasteners (e.g., screws, bolts, rivets, etc.)5215may be inserted to secure the first housing part5210to the second housing part5220. In some implementations, the frame body5241also defines openings to accommodate components mounted to the second housing part5220. For example, the frame body5241may define openings5246,5247to accommodate a cable port5166and light indicators5167, respectively, as will be described in more detail herein. In some implementations, the frame body5241defines the mounting members5206. For example, side flanges of the frame5241define the openings5207through which fasteners may be extended. In other implementations, separate mounting members5206may connect to the frame body5241. In other implementations, the mounting members5206may be defined by the fascia5250. In still other implementations, the mounting members5206may connect to the second housing part5220(e.g., to the chassis5230). The frame body5241also is configured to receive the fascia5250. In some implementations, the frame body5241defines openings5244configured to receive retaining members5258of the fascia5250. In other implementations, the frame body5241may define retaining members that fit into openings defined in the fascia5250. In certain implementations, the frame body5241also includes tabs5245that extend forwardly from some of the openings5242to be received in slots defined in the fascia5250to aid in aligning and installing the fascia5250on the frame5240. One example implementation of a fascia5250is shown inFIG.34A. The fascia5250includes a fascia body5251defining a plurality of openings5252that align with the openings5242of the frame body5241to provide access to the jack module socket5112from the front5201of the patch panel5200. In some implementations, the openings5252of the fascia body5251are smaller than the openings5242of the frame body5241. In certain implementations, the openings5252of the fascia body5251define keyways5253for the plugs5002. They keyways5253of the fascia body5251are oriented to align with the cutouts5113of the jack modules5110when the first and second housing parts5210,5220are mounted together. In some implementations, the fascia body5251includes tabs5254that extend rearwardly from the fascia body5251. In the example shown, the tabs5254generally align with the openings5252. In other implementations, however, the fascia body5251may include greater or fewer tabs5254. The tabs5254extend over the upper and lower bend flanges5243of the frame body5241when the fascia5250is mounted to the frame5240. In one implementation, the tabs5254friction-fit over the flanges5243of the frame to aid in retaining the fascia5250to the frame5240. In certain implementations, some of the tabs5254define openings, cutouts5255, or inner protrusions that may aid in retaining the fascia5250to the frame5240. As noted above, the fascia body5251also includes retaining members5258to secure the fascia body5251to the frame body5241. In some implementations, the fascia body5251includes at least one retaining member5258at each side of the fascia body5251. In other implementations, the fascia body5251includes multiple retaining members5258at each side of the fascia body5251. In still other implementations, the fascia body5251includes multiple retaining members spaced along at least one side (e.g., a bottom) of the fascia body5251. In some implementations, the retaining members5258extend through the frame body5241and latch in the openings5244. In other implementations, the retaining members5258may otherwise secure (e.g., latch, press-fit, snap-fit, etc.) to the frame body5241via latching openings5244. In other implementations, the retaining members5258may extend through the openings5244and secure to the chassis5230of the second housing part5220. In some implementations, the fascia body5251also defines openings to accommodate components mounted to the second housing part5220. For example, the fascia body5251may define openings5256,5257,5259to accommodate a cable port5166and light indicators5167of the second printed circuit board5165. One example implementation of a printed circuit board5165including a cable port5166and light indicators5167will be described in more detail herein. As shown inFIGS.37-39, end caps5280may be mounted over the side flanges of the frame5241to cover the mounting members5206. In the example shown, each end cap5280includes a body5281that is sized and shaped to cover the front of one side flange of the frame5241. Each end cap5280also includes mounting members5282by which the end cap body5281is attached to the patch panel5200. In some implementations, the mounting members5282attach to the frame body5241. In other implementations, the mounting members5282attach to the fascia body5251. Certain types of end caps5280are configured to pivot to selectively expose and cover the openings5207of the mounting members5206. In some implementations, the mounting members5282include pins about which the end cap body5281may pivot (FIG.39). In the example shown inFIG.37, the mounting pins5282attach to sides of the fascia body5251. The end cap5280also includes a retention mechanism5283(FIG.39) by which the end cap body5281may be retained in position to cover the mounting member openings5207. The retention mechanism5283grips a portion5287(FIG.37) of the mounting member5206when the end cap5280covers the mounting member5206. In the example shown, the retention mechanism5283includes flanges5284and latching tab5285that extend through cutouts5286defined in the mounting member. The latching tab5285snaps behind the portion5287of the mounting member5206. Labels may be installed on the fascia body5251. In some implementations, labels are installed on a front of the fascia body5251. For example, labels may be glued, latched, or otherwise secured to a front of the fascia body5251. In other implementations, however, labels may be installed behind a clear or opaque fascia body5251. In certain implementations, one or more label holders5290may be mounted to first part5210of the patch panel5200. One example label holder5290is shown inFIGS.40and41. The example label holder5290includes a holder body5291having a first side5298and a second side5299. At least the first side5298of the holder body5291defines a tray5292bounded by upper and lower flanges5293. One or more labels may be seated in the tray5292between the flanges5293. In certain implementations, retention tabs5296(FIG.41) may be provided to further aid in retaining the labels within the tray5292. In certain implementations, the label holder5290may include dividing flanges5297(FIG.41) that separate sections of the holder tray5292to facilitate mounting multiple labels to the tray5292side-by-side. In some implementations, the label holder5290is configured to mount between the frame body5241and the fascia body5251. For example, in certain implementations, the holder body5291includes a first attachment end5294and a second attachment end5295that are held between the frame and fascia bodies5241,5251(e.g., seeFIGS.36and36A). In the example shown, at least the second attachment end5295is configured to extend through an opening5259in the fascia body5251(seeFIG.36A). Certain types of label holders5290are configured to be reversible. For example, the label holder5290shown inFIGS.40-41includes flanges5293that extend both forwardly and rearwardly from the tray5292. Accordingly, labels may be seated at the tray5292on either side5298,5299of the label holder5290. In one implementation, the first side5298(FIG.40) of the label holder5290is configured to hold one elongated label and the second side5299(FIG.41) of the label holder5290is configured to hold multiple shorter labels. The first and second attachment ends5294,5295of the holder body5291are configured so that the label holder5290may be secured to the first housing part5210with either the first side5298or the second side5299facing forwardly through the fascia body5251. Accordingly, a user may select which side of the label holder5290to utilize to holder labels. FIGS.42-49show example components of the second housing part5220.FIG.42is a front perspective view of one example second housing part5220mounted to a first edge of the second printed circuit board5165. A front side of the second printed circuit board5165defines contact pads5168at which the second contacts5146of the media reading interface5145electrically connect to the second circuit board5165(seeFIG.43). The rear side of the second printed circuit board5165includes a connector or connector5278(FIG.57) that is configured to couple to a connector or connector port5271(FIG.34) of the processing unit5270. The front side of the second circuit board5165also includes a light indicator (e.g., an light emitting diode)5169that is used to display information pertaining to the media reading interface5145, the second contacts5146, the jack module5110, and/or the plug connection contacts5141(seeFIG.43). The light is visible through the viewing channel5153of the media reading interface5145. In some implementations, the second printed circuit board5165also may include additional light indicators5167to provide information to a user about the status of the patch panel (seeFIG.42). For example, the additional light indicators5167may provide error information. In the example shown inFIG.42, the second printed circuit board5165includes three additional light indicators5167. In other implementations, however, the second printed circuit board5165may include greater or fewer additional light indicators5167. In certain implementations, the second circuit board5165also includes a cable port5166at which a cable may be interfaced to the second printed circuit board5165(e.g., seeFIG.42). For example, the cable port5166may enable a user to connect a data cable to the second printed circuit board5165to obtain information from the storage device5030on one or more plugs5002inserted in the patch panel5200. In certain implementations, the cable port5166also may enable a user to write information directly to the storage device5030of one or more plugs5002. In other implementations, the cable port5166enables a user to access the processing unit5270from the front5201of the patch panel5200. One example chassis5230is shown inFIGS.45-48. The chassis5230includes a chassis body5231defining openings5232through which the jack modules5110can be mounted to the chassis body5231. In the example shown, the chassis body5231defines a recess5235(FIGS.45-46) through which the processing unit5270may extend to connect to the second printed circuit board5165. In certain implementations, the chassis body5231includes a mounting member5233extending into each opening5232(seeFIGS.43-44). In the example shown, each mounting member5233includes a generally T-shaped body defining channels5234on either side. Each mounting member5233is configured to aid in retaining one of the jack modules5110in the opening5232. In certain implementations, the jack modules5110are installed on the chassis body5231from the rear side of the chassis body5231(e.g., seeFIG.42). The jack module5110slides into the opening5232with the guide members5127of the jack module5110(seeFIGS.17and19) positioned on either side of the mounting member5233. In one implementation, the latching members5116of the jack module5110slide within the channels5234defined by the mounting member5233(seeFIGS.43-44). In some implementations, each media reading interface5145is mounted to a corresponding jack module5110after the jack module5110is mounted to the chassis body5231. In other implementations, each media reading interface5145is installed on the second printed circuit board5165to form a board arrangement5289(FIG.49). The board arrangement5289can be mounted to the chassis body5231before or after the jack modules5110are mounted to the chassis body5231(e.g., seeFIG.43). In some implementations, the chassis body5231includes one or more latching members5236that aid in retaining the jack modules5110to the chassis body5231. The example latching members5236shown inFIGS.47and48include flexible tabs5237defining at least one shoulder5238. In certain implementations, each latching member5236defines a shoulder5238on each side of the flexible tab5237. In the example shown, each flexible tab5237generally defines a mushroom shape. In other implementations, each flexible tab5237generally defines a T-shape. When the jack modules5110are installed on the chassis body5231, the front ends of the jack modules5110are inserted through the openings5232of the chassis body5231from a rear of the chassis body5231. As the jack module5110is being inserted, one of the latching members5236of the chassis body5231cams over the ramped surfaces5124of the latching members5123of the jack modules5110(seeFIG.47). When the jack module5110has been sufficiently inserted in the chassis5231, the latching member5236of the chassis body5231snaps over the latching members5123of the jack module5110so that the shoulders5238of the chassis latching member5236abut against shoulders5125of the jack latching member5123(seeFIG.48). FIG.51shows a cross-sectional view of an example plug5002inserted within an assembled patch panel5200. The plug5002extends through the fascia opening5252, the frame opening5242, and into the socket5112of the jack module5110mounted to the chassis5230. The storage member contacts5034of the plug5002depress the second contacts5146of the media reading interface5145to lift the second contacts5146off the shorting pin5155. The second printed circuit board5165is electrically connected to the second contacts5146is configured to sense when the second contacts5146are no longer being shorted together by the pin5155. One example processing unit5270is shown inFIG.34C. The processing unit5270includes at least a first connector5271with which the processing unit5270may be connected to the second printed circuit board5270. In accordance with some aspects, certain types of processing units include guide and/or retaining members that facilitate connecting the processing units to the printed circuit board5165. For example, the processing unit5270includes a retaining member5274with which the processing unit5270may be secured to the patch panel5200. In certain implementations, the retaining member5274includes a guiding member5275, at least one latching member5276, and a depression surface5277. In the example shown, the retaining member5274includes two latching members5276. The example processing unit5270also may include a port (e.g., see port5273ofFIG.35) configured to receive an electrical cable (e.g., a power cable, a data cable connected to a data network, etc.). In one implementation, the port includes an RJ jack (e.g., an RJ-45 jack). In other implementations, however, the processing unit5270may utilize other types of ports. In certain implementations, the processing unit5270also includes a second port (e.g., a USB port) at which another type of cable may be connected to the processing unit5270(e.g., see port5273ofFIG.35). FIGS.34and50show one example support member5260suitable for use with the patch panel5200. The support member5260includes a body5261having arms5262that are configured to attach to the patch panel5200. For example, in some implementations, the arms5262may attach to the second housing part5220of the patch panel5200(e.g., to the chassis5230). In other implementations, the arms5262may attach to grounding modules5209attached to the patch panel5200(e.g., seeFIG.52). In one implementation, the arms5262are unitary with the body5261of the support member5260. As shown inFIG.34C, the body5261of the support plate5260includes a retention section5264at which the processing unit5270may be secured to the support plate5260. For example, in some implementations, the support plate5260defines a slot5265at the retention section5274that is configured to receive the guide member5275of the retaining processing unit5270. The body5261of the support plate5260also may define openings or slots5266that are configured to receive the latching members5276of the retaining member5274of the processing unit5270. In some implementations, the processing unit5270is latched to the support plate5260by sliding the processing unit5270forwardly relative to the support plate5260. In accordance with some implementations, the support plate5260defines a manager. In some such implementations, the body5261defines one or more slots5263at which cables (e.g., cables terminating at the jack modules5110) can be secured with cable ties or other retention members. In other implementations, the body5261may include one or more raised tabs at which the cable ties or other retention members may be fastened. For example, one example implementation of a suitable cable manager body is shown inFIG.55Eand will be described in more detail herein. FIGS.52-60show another example patch panel5400including another example fascia5450mounted to another example frame5440. The frame5440secures to another example chassis5430to enclose media reading interfaces5145mounted to the second printed circuit board5165. End caps5480pivotally mount to the chassis5450to cover the mounting sections of the frame5440. A second example processing unit5470including a processor (e.g., processor206,217ofFIG.2) suitable for attachment to the patch panel5400is shown inFIG.55. The second example processing unit5470includes a first connector5471that connects the processing unit5470to the second printed circuit board5165. The second processing unit5470also include a port5472configured to receive an electrical cable (e.g., a power cable, a data cable connected to a data network, etc.). In one implementation, the port5472includes an RJ jack (e.g., an RJ-45 jack). In other implementations, however, the processing unit5470may utilize other types of ports. In certain implementations, the processing unit5470also includes a second port (e.g., a USB port)547′ at which another type of cable may be connected to the processing unit5470. As shown inFIG.55, the processing unit5470also may include retaining members5474extending outwardly from sides of the processing unit5470. In some implementations, the retaining members5474are located towards the rear end of the processing unit5470. In other implementations, the retaining members5474may be located at an intermediate position along the sides of the processing unit5470. Each retaining member5474defines a camming surface5475and at least one retention tab5476. In the example shown, each guide member5474includes an upwardly extending retention tab5476and a downwardly extending retention tab5476. The processing unit5470also may include guide members5477on one or both sides of the processing unit5470. In some implementations, the guide members5477include one or more rails that extend at least partially between the front and rear of the processing unit5470. In certain implementations, the guide members5477also include a stop5478at an end of the rail. In the example shown, the stop5478is located at an intermediate position between the front and rear of the processing unit5470. The stop5478extends generally orthogonally from the end of the rail5477. In one implementation, the guide members5477also may include a forward stop5479. A second example cable manager5460suitable for use with the patch panel5400(seeFIG.53). The cable manager5460includes a body5461attached to the patch panel5400. The body5461of the manager5460defines one or more slots5463at which cables (e.g., cables terminating at the jack modules5110) can be secured with cable ties or other retention members. In some implementations, the body5461of the manager5460may include raised tabs in place of or in addition to the slots5463. In some implementations, the body5461extending between two arms5462that are configured to attach to the patch panel5400. For example, in some implementations, the arms5462may attach to a second housing part of the patch panel5400(e.g., to the chassis5430). In other implementations, the arms5462may attach to grounding modules5409attached to the patch panel5400(e.g., seeFIG.52). In one implementation, the arms5462are unitary with the body5461of the cable manager5460. Certain types of cable managers5460also may be configured to organize and/or secure cables routed to the processing unit5470when the processing unit5470is connected to the patch panel5400. In some implementations, the example cable manager5460includes a support plate5464that is spaced from the body5461of the manager5460. In the example shown, the support plate5464is generally parallel to the manager body5461. In certain implementations, the support plate5464includes one or more slots or raised tabs5465at which one or more cables may be secured to the support plate5464using cable ties or other fasteners. For example, cables mounted to the processing unit5470may be secured to the support plate5464using the raised tabs5465. Certain types of cable managers5460also may be configured to support and/or retain the processing unit5470when the processing unit5470is connected to the patch panel5400. In some implementations, the cable manager5460includes one or more retaining arms5500that releasably secure to the processing unit5470to the patch panel5400. For example, the cable manager5460may include two spaced retaining arms5500that retain the retaining members5474at opposite sides of the processing unit5470. In certain implementations, each retaining arm5500is configured to flex or pivot relative to the patch panel5400. As shown inFIG.56, each retaining arm5500includes an elongated member5510extending between a mounting section5520and a handle5540. In certain implementations, the elongated member5510defines a guiding surface5515that facilitates sliding the processing unit5470toward the printed circuit board5165. The mounting section5520of the arm5500defines a pivot opening5522through which a fastener can extend to pivotally mount the arm5500to the support plate5464. In certain implementations, the arm5500includes one or more tabs5524that extend outwardly from the mounting section5520. In the example shown, the arm5500includes two spaced tabs5524. A retaining section5530is provided on the arm5500at a location spaced from the mounting section5520. In the example shown, the retaining section is provided adjacent the handle5540. The retaining section5530includes at least a first flange5542extending outwardly from the elongated member5510. In the example shown, first and second flanges5532extend outwardly from opposite sides of the elongated member5510. In one implementation, the first and second flanges5532extend generally parallel to each other. Each flange5532defines an opening or slot5535that is sized and configured to receive a retention tab5476of the processing unit5470(seeFIGS.52-54). As shown inFIGS.59-60, each of the arms5500is configured to pivot relative to the support plate5474. In some implementations, the support plate5474includes inner stops5476and outer stops5477that define inhibit pivoting of the arms5500beyond a particular range of movement. For example, the inner and outer stops5476,5477may inhibit movement of the arms5500beyond where the handle5540of each arm5500would be accessible to a user. In the example shown inFIGS.59-60, a first arm5500is shown in a first position adjacent the inner stop5476and a second arm5500is shown in a second position adjacent the outer stop5477. To mount the processing unit5470to the second printed circuit board5165of the second patch panel5400, a user moves the arms5500toward the second position. The user then slides the processing unit5470toward the second printed circuit board5165. When the processing unit5470is slid sufficiently forward, the stop5478on the processing unit5470contacts the tabs5524of the arms5500. Continuing to slide the processing unit5470forward applies a force to the tabs5524, which causes the arms5500to pivot toward the first position. Pivoting the arms5500to the first position causes the retaining sections5530of the arms to contact the retaining members5574on the processing unit. For example, the slots5535of the retaining flanges5532of the arms5500may receive the tabs5476of the retaining members5474of the processing unit5470. To release the second processing unit5470from the patch panel5400, a user pulls the retaining arms5500(e.g., via the grip portions5540) away from the processing unit5470. Pivoting the arms5500toward the second position causes the tabs5524of the arms5500to apply a levering force to the stops5478of the processing unit5470. In some implementations, the levering force applied to the stops5478may be sufficient to disconnect the processing unit5470from the second printed circuit board5165(e.g., even when a sufficient gripping surface of the processing unit5470is not available to the user). Indeed, in some implementations, the levering force applied to the stops5478is sufficient to slide the processing unit5470rearwardly of the patch panel5400. FIGS.61-71show a third example patch panels5300at which multiple jack modules5110can be assembled. The third example patch panel5300includes two rows of front cable ports5305at which the sockets5112of the jack modules5110are accessible. In some implementations, the jack modules5110of the second row are oriented upside-down relative to the jack modules5110of the first row (e.g., seeFIGS.61-62). In certain implementations, the media reading interfaces5145associated with the jack modules5110of the second row are oriented upside-down relative to the media reading interfaces5145associated with the jack modules5110of the first row. For example, a first row of media reading interfaces5145may be mounted to a first edge of the second printed circuit board5165and a second row of media reading interfaces5145may be mounted to a second edge of the second printed circuit board5165(FIG.64). In some implementations, the patch panel5300shown inFIG.61is sized at 2 RU. In one example implementation, the patch panel5300shown inFIG.61defines forty-eight cable ports5305with twenty-four ports in each row. In certain implementations, the patch panel5300shown inFIG.61is sized to be smaller than 2 RU. In certain implementations, the patch panels5200,5400are sized at 1 RU and define twenty-four front ports5205,5405each. In other implementations, however, each patch panel5200,5300,5400may define greater or fewer front ports. The third patch panel5300includes mounting members5306. The mounting member5306defines one or more openings5307through which a fastener may extend to secure the third patch panel5300to rails or posts of a frame, a rack, a cabinet, or other telecommunications equipment structures. End caps can be installed over the mounting members5306. In one implementation, the end caps may be larger versions of the end caps5280shown inFIGS.37-39. In other implementations, the end caps may be configured to snap-fit, friction-fit, or otherwise secure over the mounting members5306to cover the openings5307. In some implementations, the third patch panel5300includes a first housing part5310and a second housing part5320(seeFIG.61). The first housing part5310defines the front ports5305. In some implementations, the first housing part5310includes a frame5340. In certain implementations, the first housing part5310also includes a fascia5350that is removeably coupled to the frame5340. In certain implementations, the third patch panel5300also includes a grounding connection. The grounding connection may connect to the shields5134of the jack modules5110and/or to the second printed circuit board5165. The second housing part5320includes at least one or more jack modules5110mounted to a chassis arrangement5330. In certain implementations, the second housing part5320also includes one or more media reading interfaces5145. In one implementation, the third patch panel5300has the same number of jack modules5110and media reading interfaces5145. In other implementations, the third patch panel5300has more jack modules5110than media reading interfaces5145. For example, in one implementation, the third patch panel5300may have twice as many jack modules5110than media reading interfaces5145. In other implementations, the third patch panel5300may include more media reading interfaces5145than jack modules5110. For example, in certain implementations, each jack module5110may define two plug sockets. In such implementations, each plug socket may have its own media reading interface5145. In some implementations, the media reading interfaces5145are mounted to a printed circuit board5165. Multiple media reading interfaces5145mount over at least a first edge of the second printed circuit board5165. In the example shown inFIGS.61and64, multiple media reading interfaces5145mount over different (e.g., opposite) edges of the second printed circuit board5165. Each media reading interface5145also is connected to at least one jack module5110. The second printed circuit board5165in installed at the third patch panel5300. For example, inFIG.61, the second printed circuit board5165is configured to be held between the first housing part5310and the second housing part5320. In some implementations, the first housing part5310is fastened to the second housing part5320. In the example shown, the frame5340defines one or more first openings5312(FIG.63), the second printed circuit board5165defines one or more second openings5322(FIG.64), and the chassis arrangement5230defines one or more third openings5324(FIGS.65-66). One or more fasteners (e.g., screws, bolts, etc.)5315are configured to extend through the first, second, and third openings5312,5322,5324to secure the second printed circuit board5165between the frame5340and the chassis arrangement5330. In certain implementations, the fastener5315is configured to extend through a spacer5318positioned between the frame5340and the second printed circuit board5165. In the example shown, a threaded fastener5315is configured to extend through the openings5312,5322,5324. In some implementations, the threaded fastener5315is configured to screw directly into the chassis arrangement5330(e.g., into the passages5324defined in the chassis arrangement5330). In other implementations, however, the threaded fastener5315is configured to screw into a threaded insert5325. In some such implementations, the threaded insert5325may abut against a portion of the chassis arrangement5330from a rear of the chassis arrangement5330. For example, the threaded insert5325may mount at least partially within the passage5324defined in the arrangement5330and abut against a forward or intermediate surface of the arrangement5330. One example implementation of a frame5340is shown inFIG.63. The frame5340includes a frame body5341defining at least one opening5342through which a plug5002can access a socket5112of a jack module5110. In certain implementations, the openings5342are sufficiently large to enable the front of both the jack module5110and the media reading interface5145to be viewing from a front of the frame5340when the first and second housing parts5310,5320are mounted together. For example, the viewing channel5153of the media reading interface5145may be viewing through the frame opening5342. In certain implementations, the frame body5341defines upper and lower bent flanges5343that wrap around portions of the second housing part5320to aid in retaining the first and second housing parts5310,5320. In certain implementations, the lower flange5343may aid in retaining the second printed circuit board5165within the patch panel5300. For example, the lower bent flange5343of the frame body5341may extend over a bottom of the second circuit board5165to hold the second circuit board5165within the channel5150defined in the second media reading interface (e.g., seeFIG.71) As noted above, the frame body5341also defines openings5312through which fasteners (e.g., screws, bolts, rivets, etc.)5315may be inserted to secure the first housing part5310to the second housing part5320. In some implementations, the frame body5341also defines openings to accommodate components mounted to the second housing part5320. For example, the frame body5341may define openings5346,5347to accommodate a cable port5166and light indicators5167, respectively, as will be described in more detail herein. In some implementations, the frame body5341defines the mounting members5206. For example, side flanges of the frame5341define the openings5307through which fasteners may be extended. In other implementations, separate mounting members5306may connect to the frame body5341. In other implementations, the mounting members5306may be defined by the fascia5350. In still other implementations, the mounting members5306may connect to the second housing part5320(e.g., to the chassis5330). The frame body5341also is configured to receive the fascia5350. In some implementations, the frame body5341defines openings5344configured to receive retaining members5358of the fascia5350. In other implementations, the frame body5341may define retaining members that fit into openings defined in the fascia5350. In certain implementations, the frame body5341also includes tabs5345that extend forwardly from some of the openings5342to be received in slots defined in the fascia5350to aid in aligning and installing the fascia5350on the frame5340. One example implementation of a fascia5350is shown inFIG.62. The fascia5350includes a fascia body5351defining a plurality of openings5352that align with the openings5342of the frame body5341to provide access to the jack module socket5112from the front5301of the patch panel5300. In some implementations, the openings5352of the fascia body5351are smaller than the openings5342of the frame body5341. In certain implementations, the openings5352of the fascia body5351define keyways5353for the plugs5002. They keyways5353of the fascia body5351are oriented to align with the cutouts5113of the jack modules5110when the first and second housing parts5310,5320are mounted together. In some implementations, the fascia body5351includes tabs5354that extend rearward from the fascia body5351. In the example shown, the tabs5354generally align with the openings5352. In other implementations, however, the fascia body5351may include greater or fewer tabs5354. The tabs5354extend over the upper and lower bend flanges5343of the frame body5341when the fascia5350is mounted to the frame5340. In one implementation, the tabs5354friction-fit over the flanges5343of the frame to aid in retaining the fascia5350to the frame5340. In certain implementations, some of the tabs5354define openings, cutouts5355, or inner protrusions that may aid in retaining the fascia5350to the frame5340. As noted above, the fascia body5351also includes retaining members5358to secure the fascia body5351to the frame body5341. In some implementations, the fascia body5351includes at least one retaining member5358at each side of the fascia body5351. In other implementations, the fascia body5351includes multiple retaining members5358at each side of the fascia body5351. In some implementations, the retaining members5358may secure (e.g., latch, press-fit, snap-fit, etc.) to the frame body5341via latching openings5344. In other implementations, the retaining members5358may extend through the openings5344and secure to the chassis5330of the second housing part5320. In some implementations, the fascia body5351also defines openings to accommodate components mounted to the second housing part5320. For example, the fascia body5351may define openings5356,5357,5359to accommodate a cable port5166and light indicators5167of the second printed circuit board5165. One example implementation of a printed circuit board5165including a cable port5166and light indicators5167will be described in more detail herein. One example chassis arrangement5330is shown inFIGS.65-66. The chassis arrangement5330includes a first chassis body5331and a second chassis body5331′ that are configured to attach to the frame5340. In the example shown, each chassis body5331,5331′ defines a recess5335,5335′ that cooperate to define a passage through which a processing unit (e.g., processing unit5270ofFIG.34C, processing unit5270′ ofFIG.55, etc.) may extend to connect to the second printed circuit board5165. In some implementations, some of the openings5322through which the fasteners pass to attach the chassis arrangement5330to the frame5340are defined in the first chassis body5331and others of the openings5322are defined in the second chassis body5331′. For example, the first chassis body5331shown inFIG.65defines three passages5322on either side of the recess5335and the second chassis body5331′ shown inFIG.66defines three passages5322on either side of the recess5335′. The passages5322′ defined by the second body5331′ are laterally offset from the passages5322defined by the first body5331. In certain implementation, the first and second bodies5331,5331′ define complementary protrusions and recesses that fit together when the chassis bodies5331,5331′ are mounted to the frame5340. In one implementation, the passages5322are defined in the protrusions (e.g., seeFIGS.65-66). Each chassis body5331,5331′ defines openings5332,5332′ through which the jack modules5110can be mounted to the chassis bodies5331,5331′. In the example shown, each chassis body5331,5331′ defines a row of openings5332,5332′. In certain implementations, each chassis body5331,5331′ includes a mounting member5333,5333′ located within each opening5332,5332′. In the example shown inFIGS.65and66, each mounting member5333,5333′ includes a generally T-shaped body defining channels5334,5334′ on either side. Each mounting member5333,5333′ is configured to aid in retaining one of the jack modules5110in the opening5232. In certain implementations, the jack modules5110are installed on the chassis bodies5331,5331′ from the rear side of the chassis arrangement5330(e.g.,FIG.61). The jack module5110slides into the opening5332,5332′ with the guide members5127of the jack module5110(seeFIGS.17and19) positioned on either side of the mounting member5333,5333′. In one implementation, the latching members5116of the jack module5110slide within the channels5334,5334′ defined by the mounting member5333,5333′. In some implementations, each media reading interface5145is mounted to a corresponding jack module5110after the jack module5110is mounted to the chassis arrangement5330. In other implementations, each media reading interface5145is installed on the second printed circuit board5165to form a board arrangement5389(FIG.64). The board arrangement5389can be mounted to the chassis arrangement5330before or after the jack modules5110are mounted to the chassis arrangement5330. In some implementations, each chassis body5331,5331′ includes one or more latching members5336that aid in retaining the jack modules5110to the chassis body5331,5331′. The example latching members5336shown inFIG.65include flexible tabs5337defining at least one shoulder5338. In certain implementations, each latching member5336defines a shoulder5338on each side of the flexible tab5337. In the example shown, each flexible tab5337generally defines a mushroom shape. In other implementations, each flexible tab5337generally defines a T-shape. When the jack modules5110are installed on the chassis arrangement5330, the front ends of the jack modules5110are inserted through the openings5332,5332′ of the chassis bodies5331,5331′ from a rear of the chassis bodies5331,5331′. As the jack module5110is being inserted, one of the latching members5336of the chassis body5331,5331′ cams over the ramped surfaces5124of the latching members5123of the jack modules5110(seeFIG.67). When the jack module5110has been sufficiently inserted in the chassis body5331,5331′, the latching member5336of the chassis body5331,5331′ snaps over the latching members5123of the jack module5110so that the shoulders5338of the chassis latching member5336abut against shoulders5125of the jack latching member5123(seeFIG.67). In accordance with some aspects, the second printed circuit board5165is configured to receive a processing unit (e.g., processing unit5270ofFIG.34C, processing unit5470ofFIG.55). In accordance with some aspects, the cable manager5360is configured similarly to the cable manager5260of the patch panel5200(seeFIGS.67-70). The cable manager5360includes at least one rail5361that defines slots5363at which cable may be secured to the rail5361using cable ties or other fasteners. The cable manager5360also includes arms5362that secure the rail5361to the patch panel5300. In some implementations, the cable manager5360includes multiple rails5361,5361′ each defining slots5363,5363′ and including arms5362,5362′ to secure the rails5361,5361′ to the patch panel5300. One example cable manager5360includes a first rail5361(FIG.69) and a second rail5361′ (FIG.70). The first rail5361also defines a retention section5364that is configured to receive the processing unit5270. The retention surface5364defines a recess5365through which the guide member5275of the processing unit5270can extend to connect to the second printed circuit board5165of the patch panel5300. The retention section5364also includes openings5366at which retaining members5276of the processing unit5270latch to secure the processing unit5270to the patch panel5300. In the example shown, the retention section5364also includes raised tabs5367at which cables routed to the processing unit5270may be managed FIGS.72-78show a fourth example patch panel5600. The fourth example patch panel5600includes a fascia5650(FIGS.73-75), a frame5640(FIGS.76-78), and a chassis5630(seeFIG.72). A second printed circuit board5165is mounted between the frame5640and the chassis5630. For example, the fourth patch panel5600can be assembled as described above with respect to any of patch panels5200,5300, and5400. A grounding arrangement5609(FIG.78) connects to the frame5640. A cable manager5660is configured to mount to the fourth patch panel5600(e.g., to a grounding plate arrangement5609of the patch panel5600). In certain implementations, the cable manager5660includes multiple rails5661at which cables can be secured (e.g., using cable ties). In the example shown, the cable manger5560includes a rail5661,5661′ for each row of jack modules5110. In some implementations, the cable manager5660utilizes the retaining arms5500described above with respect toFIGS.52-60. One example implementation of a fascia5250is shown inFIG.73-75. The fascia5650includes a fascia body5651defining a plurality of openings5652through which a plug5002can access a socket5112of a jack module5110from the front of the patch panel5600. In some implementations, the openings5652of the fascia body5651are smaller than the openings5642of the frame body5641. In certain implementations, the openings5652of the fascia body5651define keyways5653for the plugs5002. They keyways5653of the fascia body5651are oriented to align with the cutouts5113of the jack modules5110when the patch panel5600is assembled. In some implementations, the fascia body5651includes tabs5654that extend rearward from the fascia body5651. In the example shown, the tabs5654generally align with the openings5652. In other implementations, however, the fascia body5651may include greater or fewer tabs5654. The tabs5654extend over the upper and lower bend flanges5643of the frame body5641when the fascia5650is mounted to the frame5640. In one implementation, the tabs5654friction-fit over the flanges5643of the frame to aid in retaining the fascia5650to the frame5640. In certain implementations, some of the tabs5654define openings, cutouts, or inner protrusions that may aid in retaining the fascia5650to the frame5640(seeFIG.74). As noted above, the fascia body5651also includes retaining members5658to secure the fascia body5651to the frame body5641. In some implementations, the fascia body5651includes multiple retaining members5658spaced along a one side of the fascia body5651. In the example shown, the fascia body5651includes multiple hooks5658spaced along a bottom of the fascia body5651. The retaining members5658extend through the frame body5641and latch in the openings5644. In certain implementations, the top of the fascia body5651may be configured to snap, pivot, or otherwise secure to the top of the frame5640. Of course, this attachment mechanism can be used between any of the frames and fascias disclosed herein. In some implementations, the fascia body5651also defines openings to accommodate components mounted to the chassis5630or second printed circuit board5165. For example, the fascia body5651may define openings5656,5657,5659to accommodate a cable port5166and light indicators5167of the second printed circuit board5165. One example implementation of a printed circuit board5165includes a cable port5166, a first light indicator, and three additional light indicators5167. Labels may be installed on the fascia body5651. In some implementations, labels are installed on a front of the fascia body5651. For example, labels may be glued, latched, or otherwise secured to a front of the fascia body5651. In other implementations, however, labels may be installed behind a clear or opaque fascia body5651. In certain implementations, one or more label holders5290(FIGS.40-41) may be mounted to back of the fascia body5651. For example, the label holder may be mounted within one or more tracks5655(FIG.75). One example implementation of a frame5640is shown inFIGS.76-78. The frame5640includes a frame body5641defining at least one opening5642that align with the openings5642of the frame body5241to provide access to a socket5112of a jack module5110. In certain implementations, the openings5642are sufficiently large to enable the front of both the jack module5110and the media reading interface5145to be viewing from a front of the frame5640when the frame5640and chassis5630are mounted together. For example, the viewing channel5153of the media reading interface5145may be viewing through the frame opening5642. In certain implementations, the frame body5641defines upper and lower bent flanges5643that wrap around portions of the chassis5630to aid in retaining the second printed circuit board5165within the patch panel5600. For example, the lower bent flange5643of the frame body5641may extend over a bottom of the second circuit board5165to hold the second circuit board5165within the channel5150defined in the second media reading interface (e.g., seeFIG.51). As noted above, the frame body5641also defines openings5612through which fasteners (e.g., screws, bolts, rivets, etc.) may be inserted to secure the frame5640to the chassis5630. In some implementations, the frame body5641also defines openings to accommodate components mounted to the chassis5630and second printed circuit board5165. For example, the frame body5641may define openings5646,5647to accommodate a cable port5166and light indicators5167, respectively, as described herein. In some implementations, the frame body5641defines the mounting members5606. For example, side flanges of the frame5641define the openings5607through which fasteners may be extended. In other implementations, separate mounting members5606may connect to the frame body5641. In other implementations, the mounting members5606may be defined by the fascia5650. In still other implementations, the mounting members5606may connect to the chassis5630. The frame body5641also is configured to connect to the fascia5650. In some implementations, the frame body5641defines openings5644configured to receive retaining members5658of the fascia5650(FIG.78). In other implementations, the frame body5641may define retaining members that fit into openings defined in the fascia5650. In certain implementations, the frame body5641also includes tabs5645that extend forwardly from some of the openings5642to be received in slots defined in the fascia5650to aid in aligning and installing the fascia5650on the frame5640. As shown inFIGS.74and78, end caps5680may be mounted over the side flanges of the frame5641to cover the mounting members5606. In the example shown, each end cap5680includes a body that is sized and shaped to cover the front of one side flange of the frame5641. Each end cap5680also includes mounting members by which the end cap body is attached to the patch panel5600. In some implementations, the mounting members attach to the fascia body5651(FIG.74). A number of embodiments of the invention defined by the following claims have been described. Nevertheless, it will be understood that various modifications to the described embodiments may be made without departing from the spirit and scope of the claimed invention. Accordingly, other embodiments are within the scope of the following claims. | 121,293 |
11862913 | DETAILED DESCRIPTIONS OF PREFERRED EMBODIMENTS FIG.1shows a printed circuit board arrangement according to a first exemplary embodiment of the invention in a perspective illustration. The printed circuit board arrangement1has an electrical connector2(printed circuit board connector) and an electric printed circuit board3. The electrical connector2has a first end portion, on which a first interface4or a first plug-in site is arranged. The electrical connector2furthermore has a second end portion, on which a second interface5or a second plug-in site is arranged. The first interface4and the second interface5can each be connected to an electrical mating connector6. The electrical connector2can be designed to optionally enable plugging-in of a mating connector6from one of the two sides of the printed circuit board3or possibly also simultaneously from both sides of the printed circuit board3. An exemplary mating connector6corresponding to the connector2is shown in a perspective detailed illustration inFIG.3. The mating connector6has an outer conductor7, which, in the exemplary embodiments, is designed by way of example in the manner of a spring cage in its portions which are provided for contacting purposes. Provided coaxially within the outer conductor7is an insulator8in which an inner conductor9in turn extends coaxially, which inner conductor has, for example, individual spring tabs. Any construction of the mating connector6can essentially be provided. The illustrated construction as a connecting element is, in particular, suitable for electrically and mechanically connecting two printed circuit board arrangements1to one another by means of a common mating connector6. A particularly advantageous board-to-board connection can thus be provided. However, the mating connector6can also enable a connection of the printed circuit board arrangement1to an electric cable or other electric assembly. The mating connector6can therefore also be designed, in particular, as a cable connector. The electrical connector2preferably has a linear extent between the first end portion and the second end portion or between the first interface4and the second interface5. The longitudinal axis L of the electrical connector2therefore extends linearly. However, the electrical connector2can essentially also be designed to be angled or it can have angled portions, for example an angled first end portion or an angled first interface4and/or an angled second end portion or an angled second interface5. The first interface4and the second interface5can preferably each be connected to an electrical mating connector6of an identical connector type. The first interface4and the second interface5are therefore designed to be preferably functionally (mechanically and electrically) identical. The printed circuit board arrangement1and the electrical connector2shall be explained in more detail below. To this end,FIG.2shows a perspective exploded illustration of the printed circuit board arrangement1,FIG.4a sectional illustration of the printed circuit board arrangement1,FIG.5a sectional illustration of the printed circuit board arrangement1with a plugged-in mating connector6andFIG.6a sectional illustration of the printed circuit board arrangement1with two plugged-in mating connectors6. The first interface4of the electrical connector2forms at least two contact element pairs with the second interface5, wherein each of the contact element pairs has a first contact element10,12, which is associated with the first interface4, and a second contact element11,13, which is mechanically connected to the first contact element10,12and is associated with the second interface5. In the exemplary embodiments, the electrical connector2has a coaxial construction—although this is merely exemplary and should not be regarded as restrictive. In the exemplary embodiments, it is provided that one of the contact element pairs is designed as an outer conductor contact element pair having a first outer conductor contact element10and having a second outer conductor contact element11. The electrical connector2of the first exemplary embodiment has a two-part outer conductor contact element pair. However, the outer conductor contact elements10,11of a common outer conductor contact element pair can essentially also be formed in one part (compare for exampleFIGS.16and17described below). A second contact element pair is designed as an inner conductor contact element pair having a respective first inner conductor contact element12and a respective second inner conductor contact element13. The inner conductor contact element pair is arranged coaxially within the outer conductor contact element pair, wherein the longitudinal axes of the two outer conductor contact elements10,11of the outer conductor contact element pair extend coaxially and the longitudinal axes of the inner conductor contact elements12,13of the inner conductor contact element pair likewise extend coaxially. In the exemplary embodiments, the outer conductor contact elements10,11are each designed in the form of a sleeve, although they can essentially be configured in any manner. The inner conductor contact elements12,13can likewise be configured in any manner. By way of example, the inner conductor contact elements12,13according to the first embodiment and the second, third and fourth embodiment of the invention, described below, are designed as pin contacts. The two inner conductor contact elements12,13of the common inner conductor contact element pair are preferably formed in one part. Possible variants for producing a one-part inner conductor contact element pair designed as a pin contact are shown inFIGS.7to12. By way of example, an inner conductor contact element pair can be produced by the method sequence of punching and stamping, as shown inFIG.7. Alternatively, an inner conductor contact element pair illustrated inFIG.8can be produced by the method steps of punching, rolling and bending. Alternatively, it can in turn be provided that the contact body14, described in more detail below, of the inner conductor contact element pair is produced as a punched part and the pin contact is produced as a turned part, which are then press-connected to one another as shown whenFIGS.9and10are viewed together. Provision can furthermore also be made to produce an inner conductor contact element pair by deep drawing and subsequent bending, as revealed with the aid ofFIGS.11and12. The inventive electrical connector2has a third interface15between the first end portion and the second end portion (or between the first interface4and the second interface5) in order to electrically and mechanically connect at least one of the contact element pairs, preferably the inner conductor contact element pair and the outer conductor contact element pair, in each case to the printed circuit board3. The third in each case interface15is preferably arranged centrally between the first interface4and the second interface5. The electrical connector2is preferably received in an opening16of the printed circuit board3(the opening16can be clearly seen inFIG.2, for example). To connect the contact element pairs to the electric printed circuit board3, the third interface15has corresponding contacting means14which extend away from the longitudinal axis L of the connector2starting from the respective contact element pair. In the exemplary embodiments, the contacting means connecting the inner conductor contact element pair to the printed circuit board3is designed by way of example as a contact body14, which extends in the radial direction starting from the first inner conductor contact element12of the inner conductor contact element pair. The contact body14can be connected to a trace17(only shown inFIGS.1and2for simplification) of the printed circuit board3, in particular soldered to a contact portion18(e.g. a solder surface) of the printed circuit board3. However, any contacting type for establishing contact between one or more inner conductor contact elements12,13and the printed circuit board3can essentially be provided. At this point, it should be mentioned that the inner conductor contact element pair can essentially have any number of contact bodies15, for example a contact body14on each side of the printed circuit board3or a contact body14starting from each of the inner conductor contact elements12,13of the common inner conductor contact element pair. An annularly circumferential arrangement of multiple contact bodies14can also be provided. To connect the outer conductor contact element pair to the electric printed circuit board3, it can be provided that the outer conductor contact element pair has at least one solder surface, which can be connected to a corresponding solder surface19of the printed circuit board3(compare alsoFIG.2). Alternatively or additionally, at least one of the outer conductor contact elements10,11can also have, for example, one or more pin contacts (not illustrated), which can be inserted into corresponding contact openings of the printed circuit board3. Any connecting techniques are essentially possible for connecting the outer conductor contact element pair to the electric printed circuit board3. In order to enable the contacting of the inner conductor contact element pair by means of the contact body14, the outer conductor contact element pair has a corresponding feedthrough20. As is revealed particularly clearly with the aid ofFIG.2, the electrical connector2has an insulating element21, which electrically insulates the contact element pairs from one another and is arranged between the first interface4and the second interface5. The insulating element21can be formed in one part or in two parts. By way of example, in the first exemplary embodiment, a one-part insulating element21, illustrated separately inFIGS.13and14, is provided. For assembly of the inner conductor contact element pair, the one-part insulating element21has a film hinge22.FIG.13shows an open state of the insulating element21andFIG.14a closed state. In order to enable the contact body14to be guided through the insulating element21, the insulating element21has a corresponding guide channel23. The insulating element21preferably has an annularly circumferential outer sheath. The electrical connector2of the first exemplary embodiment is designed to optionally enable contact with a mating connector6to be established from one of the two sides of the printed circuit board3(compare for exampleFIG.5). However, in the case of the connector2of the first exemplary embodiment, it is also possible to establish contact with two main connectors6on both sides, as revealed with the aid ofFIG.6. InFIG.15, a second exemplary embodiment of an inventive printed circuit board arrangement1is illustrated, in which the insulating element21sheathes the inner conductor contact element pair entirely in the longitudinal direction. At this point, it should be mentioned that features which have already been mentioned and described in association with another exemplary embodiment will essentially not be explained in detail again and, for simplification, substantially only the differences between the exemplary embodiments will be discussed. In this case, a combination of features of the different exemplary embodiments is possible provided this is not ruled out for technical reasons. A further exemplary embodiment of an inventive printed circuit board arrangement1is shown inFIGS.16and17. The electrical connector2of the third exemplary embodiment has a one-part outer conductor contact element pair. InFIG.17, the connection of a mating connector6to the electrical connector2of the third exemplary embodiment ofFIG.16is shown. As is revealed particularly clearly with the aid ofFIG.16, the insulating element21has an end-face stop24for the mating connector6(this also applies to the connector2of the second and fourth exemplary embodiments). It can thus be prevented that a loss of contact, resulting in a non-linear transmission behavior, occurs between the outer conductor7of the mating connector6and the outer conductor contact element10,11of the connector2as a result of mechanical jiggling at an end-face contact point. An electrical connector2can therefore be provided in which a passive intermodulation is prevented, since only lateral contacting is provided between the outer conductor7of the mating connector6and the outer conductor contact element10,11of the connector2. A further exemplary embodiment of the invention is shown inFIGS.18and19. The electrical connector2ofFIGS.18and19has a two-part outer conductor contact element pair, which can be mechanically connected to one another via a flange connection. Finally, a fifth exemplary embodiment of an inventive printed circuit board arrangement1is shown inFIGS.20to24.FIG.20shows a perspective exploded illustration for this andFIG.23shows a cross-section through the printed circuit board arrangement1. InFIG.24, the printed circuit board arrangement1of the fifth exemplary embodiment, with mating connectors6plugged in on both sides, is shown in cross-section. The electrical connector2of the fifth exemplary embodiment has an inner conductor contact element pair, whereof the inner conductor contact elements12,13are designed as socket contacts. The inner conductor contact elements12,13have spring tabs25connected on both sides, wherein one of the spring tabs25is detached at one end and bent round to form a contact body14. The insulating element21of the electrical connector2of the fifth exemplary embodiment has a two-part construction comprising a first insulating part26and a second insulating part27. Particularly simple assembly of the inner conductor contact element pair can thus take place. The two-part insulating element21is shown in a non-assembled state inFIG.21and in an assembled state inFIG.22together with the inner conductor contact element pair. To connect the two insulating parts26,27, a combination of latching hooks28and latching openings29can be provided, for example. In the exemplary embodiment, it is provided by way of example that each of the insulating parts26,27has a latching hook28and a latching opening29. A sixth exemplary embodiment of the inventive printed circuit board arrangement1is illustrated inFIGS.25to31.FIG.25shows the printed circuit board arrangement1in a perspective illustration, with a perspective exploded illustration being shown inFIG.26.FIG.30shows a sectional illustration of the printed circuit board arrangement1. The electrical connector2is furthermore shown in its state connected to the mating connector6in a sectional illustration inFIG.31. In the sixth exemplary embodiment of the electrical connector2, an inner conductor contact element pair is in turn provided, which has a socket-like design. The insulating element21is formed in two parts from two insulating parts26,27. A two-part construction of the outer conductor contact element pair is also provided in the sixth exemplary embodiment of the electrical connector2. However, this can be assembled starting from the same assembly direction, wherein, before the assembly of the two parts of the outer conductor contact element pair, the insulating element21equipped with the inner conductor contact element pair should be inserted into the outer conductor contact element pair. The insulating element21represents a particular feature of the sixth exemplary embodiment. Multiple webs30extend from the outer sheath of the insulating element21. By way of example, precisely four webs30are provided, which are arranged equidistantly distributed on the outer sheath. FIGS.27and28show the insulating element21during assembly in an enlarged detailed illustration together with the inner conductor contact element pair. To connect the two insulating parts26,27, latching hooks28and latching openings29are in turn provided, which, in the present case, are formed on or in the webs30. By way of example, each insulating part26,27has precisely one latching hook28and one latching opening29. However, any number of latching hooks28and latching openings29can essentially be provided and arranged in any distribution. The webs30enable twist-proof fastening of the mating connector6in its plugged-in state. To this end, the mating connector6can have corresponding receiving portions31for the webs30.FIG.29illustrates the principle. The connector2of the sixth exemplary embodiment is designed, for example, to enable a mating connector6to only be plugged in from one side of the printed circuit board3and to block simultaneous plugging-in of two mating connectors6. The electrical connector2or the contact element pairs and the insulating element21are designed such that the mating connector6, in its fully plugged-in state, projects beyond the central region of the electrical connector2and therefore into the opposing interface4, as revealed particularly clearly with the aid ofFIGS.29and31. A further mating connector6can therefore not be plugged into the electrical connector2, at least not fully or with sufficient depth, starting from the opposite side of the printed circuit board3. While the invention has been described with reference to various preferred embodiments, it should be understood by those skilled in the art that various changes may be made and equivalents substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt to a particular situation or application of the invention without departing from the scope of the invention. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed but rather, that the invention will include all embodiments falling within the scope of the appended claims, either literally or under the Doctrine of Equivalents. | 17,921 |
11862914 | Reference Number:10—Bulb Adaptor;11—Mounting housing;110—Thread;111—First Mounting Cavity;112—Second Mounting Cavity;113—Clamping Groove;114—Limiting Part;115—Sliding Groove;12—Rotating Mechanism;121—Rotating Member;1211—Sliding Part;122—Convex Part;1221—Live Contact Point;1222—Neutral Contact Point;1223—Live Contact;1224—Neutral Contact;13—First Connecting Member;131—First Live Contact Part;132—First Supporting Part;133—First Metal Connecting Part;134—First Telescopic Connecting Member;14—Second Connecting Member;141—Second Live Contact Part;142—Neutral Contact Part;143—Second Supporting Part;144—Second Metal Connecting Part;145—Second Telescopic Connecting Member;15—Plastic Isolation Plate. DETAILED DESCRIPTION In order to make the purposes, technical schemes and advantages of embodiments of this disclosure more clear, the technical schemes in the embodiments of this disclosure will be described clearly and completely with reference to the drawings in the embodiments of this disclosure; and it is Obvious that the described embodiments are part of the embodiments of this disclosure, but not all of them. The components of the embodiments of the application generally described and illustrated in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the application provided in the drawings is not intended to limit the claimed scope of the application, but only shows selected embodiments of the application. On a basis of the embodiments in this application, all other embodiments obtained by the ordinary skilled in the art without any creative effort are within the protection scope of this application. In the description of this application, it should be noted that the orientation or position relationships indicated by the terms such as “top”, “bottom”, “inner” and “outer” are based on the orientation or position relationships shown in the drawings, or the generally adopted orientation or position relationships when the products of this application are used are only for convenience of describing this application and for simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this disclosure. In addition, the terms “first”, “second”, etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying a relative importance. In the description of this application, it should also be noted that unless otherwise specified and limited, the terms “providing”, “installing” and “connecting” should be understood in a broad sense, for example, it can be “fixedly connecting”, or “detachably connecting” or “integrally connecting”, or it can be “mechanically connecting” or “electrically connecting”, or it can be “directly connecting” or “indirectly connecting through an intermediate medium”, or it can be “communicating within two elements”. For those ordinary skilled in the art, the specific meanings of the above terms in this application can be understood according to specific situations. A bulb adaptor10is provided in an embodiment of the disclosure, which includes a mounting housing11, a rotating mechanism12, a first connecting member13and a second connecting member14with cavities inside. Referring toFIGS.1and2, the mounting housing11is a cylindrical structure and is provided with a first opening and a second opening oppositely disposed. As shown inFIG.1, the first opening is located at top and the second opening is located at bottom. An inner wall of the mounting housing11is provided with threads110at the first opening, and the inner wall of the mounting housing11is provided with two first mounting cavities111oppositely disposed and two second mounting cavities112oppositely disposed, the first mounting cavities111and the second mounting cavities112are arranged at intervals, and the mounting housing11is further provided with a clamping groove113for matching with a clamping joint of the bayonet bulb. The threads110are mainly used for matching with the threaded110bulb, and the clamping groove113is mainly used for matching with the bayonet bulb, so that two kinds of bulbs can be fixed. Referring toFIGS.1to3, the first connecting member13includes a convex first live contact part131and two first metal connecting parts133. One of the first metal connecting parts133is electrically connected with the threads110through a wire, and the other of the first metal connecting parts133is electrically connected with the first live contact part131through a wire. Optionally, the first connecting member13includes a first supporting part132connected to both ends of the first live contact part131, a bottom of the first supporting part132is provided with the first metal connecting part133, two first supporting parts132are respectively provided in the two first mounting cavities111, and the first supporting part132is connected with the mounting housing11through a first telescopic connecting member134. It should be noted that the first connecting member13is made of insulating material except the first live contact part131and the first metal connecting part133. For example, the first telescopic connecting member134is a spring, and the spring can be compressed when a bottom end of the first supporting part132is subjected to a force to make the first supporting part132move upward. When the force at the bottom end of the first supporting part132is removed, the spring changes from a compressed state to a normal state, so that the first supporting part132moves downward. In other embodiments, the first telescopic connecting member134may also be an elastic piece. Referring toFIGS.1,2and4, the second connecting member14includes a convex second live contact part141, a neutral contact part142and two second metal connecting parts144, and the two second metal connecting parts144are electrically connected with the second live contact part141and the neutral contact part142by a wire respectively. The second connecting member14is arranged crosswise with the first connecting member13, so that the first live contact part131is staggered with both the second live contact part141and the neutral contact part142. Optionally, the second connecting member14includes two second supporting parts143respectively connected with the second live contact part141and the neutral contact part142, and a bottom end of the second supporting part143is provided with a second metal connecting part144. The two second supporting parts143are respectively arranged in the two second mounting cavities112, and the second supporting parts143are connected with the mounting housing11through the second telescopic connecting member145. The second connecting member14is arranged crosswise with the first connecting member13, so that the first live contact part131is staggered with both the second live contact part141and the neutral contact part142, it should be noted that the second connecting member14is made of insulating material except the second live contact part141, the neutral contact part142and the second metal connecting part144. For example, the second telescopic connecting member145is a spring, and the spring can be compressed when a bottom end of the second supporting part143is subjected to a force to make the second supporting part143move upward. When the force at the bottom end of the second supporting part143is removed, the spring changes from a compressed state to a normal state, so that the second supporting part143moves downward. In other embodiments, the second telescopic connecting member145may also be an elastic piece. Referring toFIGS.2and5, the rotating mechanism12includes a rotating member121and a convex part122fixed to the rotating member121, The convex part122has a first position and a second position. The first position is where the convex part122is in electrical contact with the two first metal connecting parts133(seeFIGS.1and2), and the second position is where the convex part122is in electrical contact with the two second metal connecting parts144(seeFIG.6). The rotating member121is slidably connected with the mounting housing11, so that the rotating member121can rotate along a circumferential direction of the mounting housing11, and the convex part122moves between the first position and the second position. In some embodiments, the convex part122is arranged at the second opening and extends along a radial direction of the mounting housing11, two ends of the convex part122along an extending direction are provided with a live contact point1221and a neutral contact point1222, a side wall of the convex part122away from the second opening is connected with a live contact1223and a neutral contact1224, the live contact1223is electrically connected with the live contact point1221, and the neutral contact1224is electrically connected with the neutral contact point. The live contact1223and the neutral contact1224of the protrusion122are used to connect with a live wire and a neutral wire in an arranged circuit. The first position is where the live contact point1221and the neutral contact point1222of the convex part122are electrically contacted with the two first metal connecting parts133respectively (seeFIGS.1and2), and the second position is where the live contact point1221and the neutral contact point1222of the convex part122are electrically contacted with the two second metal connecting parts144respectively (seeFIG.6). When the convex part122is located at the first position, the convex part122supports the two first supporting parts132, and makes the live contact point1221and the neutral contact point1222of the convex part122electrically contact with the two first metal connecting parts133respectively. At this time, the threaded110bulb is screwed in from the first opening to form a threaded110connection with the threads110of the inner wall of the mounting housing11, the threads110of the mounting housing11is electrically connected with one of the first metal connecting parts133, and the other of the first metal connecting parts133is electrically connected with the first live contact part131, and the threads110of the mounting housing11serves as a neutral connecting part. When the threaded110bulb is screwed in, a live wire of the threaded110bulb is connected with the convex first live contact part131and a neutral wire of the threaded110bulb is connected with the threads110of the mounting housing11, so that the threaded110bulb can be lit. When the bayonet bulb is to be matched and installed, the rotating member121moves along the circumferential direction of the mounting housing11, the convex part122moves out of supporting the two first supporting parts132, the live contact point1221and the neutral contact point1222of the convex part122are disconnected with the two first metal connecting parts133, and a position of the first connecting member13lowers along a height direction of the mounting housing11. When the rotating member121is rotated to the second position of the convex part122, the convex part122supports the two second supporting parts143, and makes the live contact point1221and the neutral contact point1222of the convex part122electrically contact with the two second metal connecting parts144, respectively. A position of the second connecting member14rises along the height direction of the mounting housing11. In this process, because the second connecting member14is arranged crosswise with the first connecting member13, the first live contact part131is staggered with both the second live contact part141and the neutral contact part142, so that the first live contact part131does not interfere with the second live contact part141and the neutral contact part142in a lowering or rising process. In the first position, the first live contact part131is located above the second live contact part141and the neutral contact part142, and in the second position, the second live contact part141and the neutral contact part142are located above the first live contact part131. Optionally, the second connecting member14and the first connecting member13are arranged in a cross. When the convex part122is at the second position, the bayonet bulb is matched with a clamping groove113of the mounting housing11to fix the bulb, the live wire and the neural wire of the bayonet bulb are respectively connected with the convex second live contact part141and the neutral contact part142, so that the threaded110bulb can be lit. The bulb adaptor10of the embodiment of the disclosure can be matched and used with the threaded110bulb or the bayonet bulb respectively only by rotating the rotating part, which is convenient to use. Referring toFIG.2, in a feasible embodiment, a plastic isolation plate15is provided within an inner space of the mounting housing11, the plastic isolation plate15is defined with a plurality of through holes, and the plurality of through holes are respectively arranged corresponding to the first live contact part131, the second live contact part141and the neutral contact part142. When the bulb is matched with the bulb adaptor10, whether it is a threaded110bulb or a bayonet bulb, the live wire or the neural wire of the bulb can only contact with the first live contact part131, the second live contact part141and the neutral contact part142through the through holes due to action of the plastic isolation plate15, with a more accurate connection. Referring toFIGS.1,5and7, for example, an inner wall of the rotating member121is provided with a sliding part1211, and an outer wall of the mounting housing11is provided with a limiting part114with a sliding groove115, the sliding groove115extends along the circumferential direction of the mounting housing11, and the sliding part1211is slidably matched with the sliding groove115. The sliding part1211can move along the circumferential direction of the mounting housing11through sliding fit between the sliding part1211and the sliding groove115. The sliding groove115limits a moving path of the sliding part1211, so that the sliding part1211moves along the circumferential direction of the mounting housing11more smoothly, Optionally, the sliding part1211is a triangular protrusion. Two sides of the triangle can cooperate with the sliding groove115and both sides are limited, so that the sliding part1211can move along the circumferential direction of the mounting housing11more smoothly: Optionally, the sliding groove115is provided with an engaging port (not shown in the figure), the sliding part1211is provided with an engaging joint which can be snapped with the engaging port (not shown in the figure), and the engaging port is arranged correspondingly to the first supporting parts132and the second supporting parts143. When the rotating part is rotated so that the convex part122is located at the first position, the engaging joint of the sliding part1211matches with the engaging port of the corresponding first supporting part132of the sliding groove115, and the sliding part1211stops moving. At this time, the sliding part1211can only move in a opposite direction. When the rotating part is rotated in the opposite direction so that the convex part122is located at the second position, the engaging joint of the sliding part1211engages with the engaging port of the corresponding second supporting part143of the sliding groove115, and the sliding part1211stops moving. With the sliding slot115being provided with the engaging port, the sliding part1211is provided with the engaging joint which can be snapped with the engaging port, and the engaging port is arranged correspondingly to the first supporting parts132and the second supporting parts143, so that the convex part122can be fixed at the first position and the second position respectively, with a more accurate positioning. In a feasible embodiment, a cross section of the convex part122along a thickness direction is trapezoidal (seeFIG.8). The convex part122extends in a radial direction of the mounting housing11, and its cross section along the thickness direction is trapezoidal, so that when the convex part122is at the first position, its top can jack up the first supporting part132, and when the rotating part is rotated to move the convex part122from the first position to the second position, an inclined surface of the trapezoid can easily jack up the second supporting part143. Illustratively, ends of the first metal connecting part133and the second metal connecting part144are both arc-shaped. In this way; resistance for the convex part122when moving between the first position and the second position is small, which facilitates movement of the convex part122. Further, in a feasible embodiment, the live wire contact1223and the live wire contact1221are electrically connected through a wire, and an infrared remote control switch is provided on the wire. Since the bulb adaptor10is provided with the infrared remote control switch, the infrared remote control switch can be remotely controlled by a remote controller to control switching and brightness of the bulb, which is convenient for operation. In another feasible embodiment, a control switch can be provided on the wire, which has a Bluetooth module. With a wireless connection between Bluetooth on a mobile phone and the Bluetooth module of the bulb adaptor10, the bulb can be controlled by the mobile phone, which is convenient for operation. To sum up, the bulb adaptor10of the embodiment of the present disclosure can be matched and used with the threaded bulb110or the bayonet bulb respectively only by rotating the rotating part to make the convex part122move between the first position and the second position, which is convenient to use. The above is only preferred embodiments of this application, and is not intended to limit this application, and modifications and variations can be made in this application for those skilled in the art. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of this disclosure shall be encompassed within the protection scope of this disclosure. | 18,330 |
11862915 | DESCRIPTION OF EMBODIMENTS An embodiment of a joined conductor100and a conductor joining device1for manufacturing the joined conductor100according to the present invention will be described with reference to the following drawings. FIG.1illustrates a schematic perspective view of the joined conductor100, andFIGS.2A to2Cillustrate explanatory diagrams of the joined conductor100. Specifically,FIG.2Aillustrates an enlarged plan view of a joining portion110in the joined conductor100,FIG.2Billustrates a cross-sectional view taken along an A-A line inFIG.2A, andFIG.2Cillustrates a cross-sectional view taken along a B-B line inFIG.2A. FIG.3is a schematic perspective view of the conductor joining device1,FIG.4is a schematic exploded perspective view of the conductor joining device1,FIGS.5A to5Care explanatory diagrams of a horn13configuring the conductor joining device1,FIGS.6A to6Care explanatory diagrams of a regulating portion21configuring the conductor joining device1,FIGS.7A and7Bare explanatory diagrams of an anvil30configuring the conductor joining device1, andFIGS.8A and8Bare explanatory diagrams for explaining a configuration of the conductor joining device1. Here, inFIG.3, a longitudinal direction of insulated wires200is indicated as a longitudinal direction X, a direction that is a lateral width direction of the insulated wires200and that is orthogonal to the longitudinal direction X is indicated as a width direction Y, a left side along the longitudinal direction X inFIG.3is indicated as a +X direction, and a right side is indicated as a −X direction, and a left side along the width direction Y is indicated as a −Y direction, and a right side is indicated as a +Y direction. In addition, inFIG.3, a vertical direction is indicated as an up-down direction Z, and an upper side inFIG.3is indicated as a +Z direction (upward) and a lower side is indicated as a −Z direction (downward). Referring toFIGS.5A to5Cin details,FIG.5Aillustrates an enlarged bottom view of a bottom surface of the horn13,FIG.5Billustrates an enlarged side view of the horn13as viewed from a +Y side, andFIG.5Cillustrates an enlarged front view of the horn13as viewed from a +X side. Note thatFIGS.5B and5Cillustrate only a part of the horn13in an enlarged manner. FIGS.6A to6CandFIGS.7A and7Bwill be described in details.FIG.6Aillustrates an enlarged plan view of an upper surface of the regulating portion21,FIG.6Billustrates an enlarged side view of the regulating portion21as viewed from the +Y side, andFIG.6Cis an enlarged front view of the regulating portion21as viewed from the +X side. Note thatFIGS.6A and6Cillustrate only a part of the regulating portion21in an enlarged manner.FIG.7Aillustrates a plan view of the anvil30, andFIG.7Billustrates an enlarged side view of an anvil upper portion32erected in the anvil30, as viewed from the +Y side. Also,FIGS.8A and8Bwill be described in details.FIG.8Aillustrates a schematic front view of parts that join conductor exposed portions220in the conductor joining device1as viewed from the +X direction, andFIG.8Billustrates a cross-sectional view taken along a C-C line inFIG.8A. The joined conductor100is a conductor in which the conductor exposed portions220which are tip portions of a plurality of insulated wires200are joined and integrated by ultrasonic welding, and is used to electrically connect electrical devices such as batteries to each other. The insulated wire200is configured by covering a stranded wire conductor formed by twisting wires made of aluminum alloy together with an insulating covering210made of insulating resin, and the insulated wire200is provided with, on a tip side thereof, the conductor exposed portion220where the stranded wire conductor is exposed by peeling the insulating covering210by a predetermined length (seeFIG.3). Note that the stranded wire conductor may be made of any material having electrical conductivity, and may be formed by twisting wires made of, for example, aluminum, copper, copper alloy, or the like, together. In addition, the conductor exposed portion220is not necessarily configured of the stranded wire conductor, and may be configured by bundling wires having electrical conductivity. The joined conductor100has a configuration in which a plurality (nine in the present embodiment) of insulated wires200are bundled along the longitudinal direction X, and a plurality of conductor exposed portions220which are exposed by peeling off the insulating coverings210on the tip side (−X side) of the insulated wires200are bundled, fused and joined as a conductor bundle, and the tip portion of the joined conductor100has the joining portion110formed by fusing and joining the conductor exposed portions220. As illustrated inFIG.1andFIGS.2A to2C, the joining portion110is configured in a rectangular shape in cross-section with a first surface121(which is a surface formed on a left side (−Y side)) and a second surface122(which is a surface formed on a right side (Y side)) that face each other in the width direction Y, and a third surface131(which is a surface formed on a lower side (−Z side)) and a fourth surface132(which is a surface formed on an upper side (+Z side)) that face each other in the up-down direction Z, and a planar portion150formed in a planar shape is provided at each of end portions of the joining portion110on the +X side and the −X side. On the first surface121and the second surface122, corrugated portions140formed in a sine wave shape along the longitudinal direction X are formed in a plan view (seeFIG.2A). The corrugated portion140is continuously configured with a ridge141that protrudes outward along the width direction Y, and a valley142that is recessed inward along the width direction Y. A height L1of a top of the ridge141with respect to a bottom of the valley142is configured to be about 0.20 times a distance between the first surface121and the second surface122, that is, a length L2of a width in the joined conductor100. In the present embodiment, the height L1is 0.20 times the length L2, but this value is not necessarily required, and may be changed as appropriate. Note that from the perspective of electrical conductivity and rigidity, the value is preferably equal to or less than 0.5 times. Also, the height L1of the top of the ridge141with respect to the bottom of the valley142is configured to be approximately 0.6 times a diameter L3that is the minimum diameter of the conductor exposed portions220configuring the joining portion110. In the present embodiment, the height L1is 0.6 times the diameter L3, but this value is not necessarily required, and may be changed as appropriate. Note that from the perspective of electrical conductivity, the height L1is preferably equal to or more than 0.5 times a diameter of wires, and more preferably equal to or more than 0.5 times an outer diameter of the stranded wire conductor. In addition, in the present embodiment, all nine conductor exposed portions220have the same diameter, but some or all of the conductor exposed portions220may have different diameters. In this case, the height L1is preferably equal to or more than 0.5 times the diameter L3that is the minimum diameter of the conductor exposed portions220. Among the corrugated portions140configured in this manner, corrugated portions140L provided on the first surface121are aligned and provided in four rows such that the valleys142and the ridges141are arranged in an alternately continuous manner from the +X side. On the other hand, corrugated portions140R provided on the second surface122among the corrugated portions140are aligned and provided in four rows such that the ridges141and the valleys142are arranged in an alternately continuous manner from the +X side. In other words, the valleys142and the ridges141arranged on the first surface121are arranged so as to face the ridges141and valleys142arranged on the second surface122along the width direction Y. In other words, the corrugated portions140L and the corrugated portions140R are provided on the first surface121and the second surface122, respectively, in such a manner that sine waves having the same shape each other are deviated by a half wavelength along the longitudinal direction X. As illustrated inFIGS.2B and2C, the joining portion110configured in this manner repeats periodically from a state where the cross-sectional shape protrudes toward the −Y side to a state where the cross-sectional shape protrudes toward the +Y side from the −X side toward the +X side. As a result, an apparent cross-sectional coefficient of the joining portion110is improved, so rigidity of the joining portion110is improved. Furthermore, as will be described below, the conductor joining device1performs ultrasonic welding for the joined conductor100, and thus an ultrasonic joining portion160is formed at an interface between the conductors in a cross section of the joining portion110. Furthermore, the joining portion110includes the planar portion150between the corrugated portion140arranged at a tip and an end portion on the tip side in the longitudinal direction X, and includes the planar portion150between the corrugated portion140arranged at a base end and an end portion on the base end side in the longitudinal direction X. Specifically, as illustrated inFIG.1andFIG.2A, the planar portions150are formed so as to protrude in a planar shape toward the −X side and the +X side. In other words, the corrugated portions140are arranged at positions separated by a predetermined interval from the tip of the joined conductor100. Next, the conductor joining device1that manufactures the joined conductor100by joining the conductor exposed portions220on a tip side that are exposed from the insulated wires200will be described with reference toFIG.3toFIGS.8A and8B. As illustrated inFIG.3, the conductor joining device1is configured to perform ultrasonic welding (ultrasonic metal joining) on the conductor exposed portions220exposed from a tip side of a plurality of insulated wires200, and is configured with an ultrasonic welding tool10configured to move up and down in the up-down direction Z, a pair of width direction adjustment portions20fixed to the ultrasonic welding tool10on a +X direction side thereof, a plurality of anvils30configured to compress the conductor exposed portions220with the ultrasonic welding tool10that moves down, and a control unit40configured to control movement of the ultrasonic welding tool10and the width direction adjustment portions20. The ultrasonic welding tool10is configured with a lifting portion11that rises and lowers in the up-down direction Z by using a lifting motor (not illustrated), a horn support portion12protruding from a central portion of the lifting portion11toward the +X direction side, and the horn13extending downward from an end surface on +X direction side of the horn support portion12. The lifting motor is controlled by the control unit40. As illustrated inFIG.3andFIG.4, the horn support portion12protrudes from the central portion of the lifting portion11toward the +X direction side, and is configured to support the horn13on the lifting portion11. Note that in the present embodiment, the horn support portion12protrudes from the lifting portion11along the longitudinal direction X, but does not necessarily protrude along the longitudinal direction X, and may be configured to protrude along the width direction Y, for example. That is, in the present embodiment, a protruding direction of the horn support portion12is configured so as to be orthogonal to the movement direction of the regulating portions21to be described below, but may also be configured so as to be along the movement direction of the regulating portions21. The horn13extends downward from the end surface on the +X direction side of the horn support portion12and is configured to ultrasonically oscillate along the longitudinal direction X by being connected to an ultrasonic oscillator (not illustrated). In addition, as illustrated inFIG.5A, on a horn-side lower surface13athat is a bottom surface of the horn13, a plurality of horn-side concave portions14formed by being recessed upward, and a plurality of horn-side convex portions15formed by being protruded downward are provided in a lattice pattern along the longitudinal direction X and the width direction Y. That is, the bottom surface of the horn13is formed to have a concave-convex shape as viewed from the longitudinal direction X and the width direction Y (seeFIGS.5B and5C). Specifically, the horn-side concave portion14is configured of a horn valley in longitudinal direction14a(seeFIG.5B) formed by being recessed upward from the horn-side lower surface13a, and a horn valley in width direction14b(seeFIG.5C) formed by being recessed upward from the horn-side lower surface13a, and is formed at an intersecting portion thereof. Also, the horn-side convex portion15is configured of a horn ridge in longitudinal direction15a(seeFIG.5B) that protrudes downward from the horn-side lower surface13abetween the horn valleys in longitudinal direction14aformed along the longitudinal direction X, and a horn ridge in width direction15b(seeFIG.5C) that protrudes downward from the horn-side lower surface13abetween the horn valleys in width direction14bformed along the width direction Y, and is formed at an intersecting portion thereof. The horn valleys in longitudinal direction14aand the horn ridges in longitudinal direction15aare arrayed in five rows and six rows, respectively, at equal intervals along the width direction Y, and the horn ridges in width direction15band the horn valleys in width direction14bare arrayed in 23 rows and 24 rows, respectively, at equal intervals along the longitudinal direction X (refer toFIG.5A). The horn-side concave portions14and the horn-side convex portions15arranged in this manner are formed so as to have a twill line shape when viewed from the bottom surface. Each of the pair of width direction adjustment portions20arranged so as to face each other on the +X direction side of the ultrasonic welding tool10includes the regulating portion21that regulates movement of the insulated wires200in the width direction Y, a fixing and support portion22that fixes and supports the regulating portion21, a fixing portion23that indirectly fixes the regulating portion21to the lifting portion11, and a connecting portion24that movably connects the fixing and support portion22to the fixing portion23. The regulating portions21are arranged with a predetermined interval along the width direction, and each of them is configured such that a length thereof along the longitudinal direction X is equal to a length of the corresponding horn13, and a height in the up-down direction Z is sufficiently longer than three times the outer diameter of the conductor exposed portion220, and is provided with a regulating surface26that faces the other facing regulating portion21, as illustrated inFIG.3andFIG.4. Note that, in the present embodiment, the regulating portion21has a height that is sufficiently long compared to three times the outer diameter of the conductor exposed portion220, it is not necessary for the height to be three times the outer diameter of the conductor exposed portion220, and thus the regulating portion21may be formed so as to have a height that is sufficiently longer than a total outer diameter of a bundle of electric wires formed by the plurality of conductor exposed portions220that are to be subjected to ultrasonic welding. A movement assist portion for regulation25that engages with the horn-side concave portions14and the horn-side convex portions15to assist movement of the regulating portion21in the width direction Y is formed on an upper end surface of the regulating portion21. The movement assist portion for regulation25is configured of a movement assist portion251slightly protruding upward from an upper end side of the regulating surface26and an upper surface concave portion252formed by being recessed downward on the outer side in the width direction Y of the movement assist portion251. In addition, in the movement assist portion251, a plurality of regulating portion-side convex portions253protruding upward are aligned along the longitudinal direction X. The regulating portion-side concave portions253are configured such that a height thereof is approximately one half of a height of the horn valley in longitudinal direction14aand the horn ridge in longitudinal direction15a, and a width formed by three regulating portion-side concave portions253is slightly smaller than a width of the horn ridge in longitudinal direction15a(horn valley in longitudinal direction14a), and18regulating portion-side concave portions253are aligned at equal intervals along the longitudinal direction X so as to correspond to the horn valleys in longitudinal direction14aand the horn ridges in longitudinal direction15a. The regulating portion-side concave portions253configured in this manner can absorb amplitude in the longitudinal direction X due to ultrasonic oscillation by providing slight gaps between the horn valleys in longitudinal direction14aand the horn ridges in longitudinal direction15ain a state in which the horn13and the regulating portions21are in engagement. As illustrated inFIG.6A, each of the regulating surfaces26provided on facing portions of the pair of regulating portions21is provided with a corrugated regulating portion27having a sine wave shape in a plan view, and flat portions28formed so as to be flat at both ends in the longitudinal direction X of the corrugated regulating portion27. The corrugated regulating portion27is configured such that a regulating portion-side convex portion271that protrudes by a predetermined height toward a side of the facing regulating surface26, and a regulating portion-side concave portion272that is recessed so as to have the same depth as the height of the regulating portion-side convex portion271in a direction opposite to a protruding direction of the regulating portion-side convex portion271are alternately smoothly continuous (seeFIG.6A). Note that in the corrugated regulating portion27, four regulating portion-side convex portions271and four regulating portion-side concave portions272are arranged so as to be alternately continuous along the longitudinal direction X. In each of the corrugated regulating portions27provided on each of the facing regulating surfaces26, the regulating portion-side convex portion271and the regulating portion-side concave portion272are arranged so as to face the regulating portion-side concave portion272and the regulating portion-side convex portion271provided on the other facing regulating surface26. In other words, a corrugated shape formed by the regulating portion-side convex portions271and the regulating portion-side concave portions272on the regulating surface26on the +Y side (hereinafter referred to as a regulating surface26R) and a corrugated shape formed by the regulating portion-side convex portions271and the regulating portion-side concave portions272on the regulating surface26on the +Y side (hereinafter referred to as a regulating surface26L) are formed so as to be deviated by a half wavelength from each other. In the present embodiment, each of the number of the regulating portion-side convex portions271and the number of the regulating portion-side concave portions272formed on the regulating surface26is four, but the present invention is not limited to this number, and according to a method for use, shapes, and sizes of the conductor joining device1, the number can be appropriately adjusted. The flat portion28is a planar surface formed in a flat shape along the up-down direction Z and the longitudinal direction X on each end side in the longitudinal direction X of the corrugated regulating portion27. As illustrated inFIG.3andFIG.4, the outer side of the regulating portion21configured in this manner is fixed by being engaged with the fixing and support portion22. As illustrated inFIG.3andFIG.4, the connecting portion24is a rod-like body that penetrates through the fixing portion23fixed to the lifting portion11along the width direction Y, and that is fixed at one end to the fixing and support portion22, and is configured to be movable along the width direction Y by using a motor for movement in the width direction (not illustrated) that is controlled by the control unit40. That is, the connecting portion24connects the fixing and support portion22and the fixing portion23, and allows the fixing and support portion22fixed with the regulating portion21to be moved along the width direction Y with respect to the fixing portion23. Note that the fixing portion23is fixed to the lifting portion11, so that the regulating portion21and the fixing and support portion22are indirectly fixed to the lifting portion11. The control unit40configured to control the lifting motor and the motor for movement in width direction, which are not illustrated, is configured to be allowed to drive the lifting motor and the motor for movement in width direction in synchronization with each other, and can lower the ultrasonic welding tool10and move the regulating portions21that are arranged so as to face each other along the width direction Y at the same time. Note that the regulating portions21can be moved separately and independently along the width direction Y due to control by the control unit40. The anvil30is a receiving jig having a rectangular parallelepiped shape and provided on a substrate of the conductor joining device1, and is configured of a movable base portion31that is configured so as to be movable along a rail50, which will be described later, and an anvil upper portion32erected on the movable base portion31. The anvil upper portion32is configured such that a length thereof with respect to the width direction Y is slightly longer than a length of the bundle of wires formed by the plurality of conductor exposed portions220that are ultrasonically welded with respect to the width direction, and a height thereof is higher than a height of the regulating portion21, and anvil main surfaces321which are main surfaces of the anvil upper portion32are erected on an upper portion of the movable base portion31so as to face in the width direction Y. Anvil-side corrugated portions33that are continuously arranged along the longitudinal direction X are formed on the anvil main surface321. The anvil-side corrugated portion33is configured of an anvil-side convex portion331that protrudes outward in the width direction Y from the anvil main surface321, and an anvil-side concave portion332that is recessed inside the anvil main surface321. The anvil-side convex portion331is formed so as to engage with the regulating portion-side concave portion272, and the anvil-side concave portion332is formed so as to engage with the regulating portion-side convex portion271. In other words, an amplitude of the anvil-side corrugated portions33is formed in a sine wave shape in a plan view so as to be equal to amplitude of the corrugated regulating portions27. As illustrated inFIG.7A, the anvil-side corrugated portion33in which the anvil-side convex portion331and the anvil-side concave portion332that are configured in such a manner are continuously arranged is formed in a sine wave shape in a plan view, and four anvil-side corrugated portions33are continuously aligned along the longitudinal direction. Additionally, the anvil-side corrugated portions33are provided on both of the anvil main surfaces321facing in the width direction Y, but the anvil-side corrugated portions33(anvil-side corrugated portions33R) provided on the +Y side and the anvil-side corrugated portions33(anvil-side corrugated portions33L) provided on the −Y side are deviated by a half wavelength from each other and arranged. That is, in the anvil-side corrugated portion33R, the anvil-side concave portion332and the anvil-side convex portion331are provided in this order from the +X side, and in the anvil-side corrugated portion33L, the anvil-side convex portion331and the anvil-side concave portion332are provided in this order from the +X side, and the anvil-side corrugated portion33R and the anvil-side corrugated portion33L are formed such that the anvil-side convex portion331and the anvil-side concave portion332face each other. Furthermore, the anvil30and a regulating portion21L are arranged such that the anvil-side convex portion331and the anvil-side concave portion332provided in the anvil-side corrugated portion33L face the regulating portion-side concave portion272and the regulating portion-side convex portion271provided on the regulating surface26L. Similarly, the anvil30and a regulating portion21R are arranged such that the anvil-side convex portion331and the anvil-side concave portion332provided in the anvil-side corrugated portion33R face the regulating portion-side concave portion272and the regulating portion-side convex portion271provided on the regulating surface26R. An anvil-side upper surface322which is an upper surface of the anvil upper portion32is a surface that compresses the conductor exposed portions220with the horn-side lower surface13ain a case where the ultrasonic welding tool10is lowered, and an anvil-side concave-convex portion34having concaves and concaves and formed along the up-down direction Z is provided. Further, a flat portion35formed in a planar shape having a length of approximately a half wavelength of the sine wave formed by the anvil-side corrugated portion33is provided along the longitudinal direction X on each of a tip side and a rear end side of the anvil-side concave-convex portion34. Note that, in the present embodiment, three anvils30configured so as to be different in a width of the anvil upper portion32in the width direction Y are provided (anvils30a,30b, and30c). The widths in the width direction are formed such that the anvil30ahas a smallest width and the anvil30chas a largest width. The plurality of anvils30(anvils30a,30b, and30c) provided as described above are configured to be movable along the rail50, so that the desired anvil30can be positioned below the ultrasonic welding tool10. In addition, while the three anvils30are provided in the present embodiment, the number of anvils30can be appropriately adjusted so as to be suitable for the insulated wires200to be connected, and a width of the anvil upper portion32of each of the anvils30can also be appropriately adjusted. As illustrated inFIG.3andFIGS.8A and8B, the ultrasonic welding tool10and the width direction adjustment portion20configured as described above can move the regulating portions21along the horn-side lower surface13aby engaging the horn-side concave portions14and the horn-side convex portions15with the regulating portion-side convex portion235. Furthermore, the anvil30can be positioned such that the horn-side lower surface13aand the anvil-side upper surface322face each other by being moved along the rail50(seeFIG.8B). Thus, the horn-side lower surface13a, the anvil-side upper surface322, and the pair of regulating surfaces26can form an arrangement space S through which the plurality of conductor exposed portions220are inserted (seeFIG.8A). In such a manner, the conductor joining device1in which the width direction adjustment portions20are fixed to the ultrasonic welding tool10such that the regulating portions21can move along the width direction Y, and the anvil30is positioned below the horn13enables not only the ultrasonic welding tool10and the width direction adjustment portions20to be moved downward by using the lifting motor, but also the regulating portions21to be moved along the width direction Y by using the motor for movement in width direction, by control of the control unit40in a state where the conductor exposed portions220are inserted through the arrangement space S. Hereinafter, a method for manufacturing the joined conductor100by using the conductor joining device1will be described briefly with reference toFIG.9toFIGS.11A and11B. Here,FIG.9illustrates a flowchart of a conductor joining method that fuses and joins a plurality (nine in the present embodiment) of conductor exposed portions220of the insulated wires200,FIGS.10A to10Cillustrate explanatory diagrams for explaining a state where the conductor exposed portions220(conductor exposed portions220) are inserted through the arrangement space S, and the regulating portions21are moved along the width direction Y, andFIGS.11A and11Billustrate explanatory diagrams for explaining a conductor joining method in which the conductor exposed portions220are joined, using a cross-sectional view taken along a D-D line of an a portion inFIGS.8A and8B. Specifically,FIG.10Aillustrates an enlarged plan view of the regulating portions21and the anvil30before the conductor exposed portions220are inserted,FIG.10Billustrates an enlarged plan view of the regulating portions21and the anvil30in a state in which the conductor exposed portions220are inserted and the regulating portions21are moved toward the conductor exposed portions220, andFIG.10Cillustrates a schematic plan view of the conductor exposed portions220compressed inFIG.10B. FIG.11Aillustrates a cross-sectional view taken along a D-D line in a state where the conductor exposed portions220are inserted into the arrangement space S, andFIG.11Billustrates a cross-sectional view taken along a D-D line in a state where ultrasonic welding is performed on the conductor exposed portions220compressed by lowering the ultrasonic welding tool10and the width direction adjustment portions20with the conductor exposed portions220inserted into the arrangement space S. Note that inFIGS.11A and11B, the horn-side concave portion14and the horn-side convex portion15are omitted. As illustrated inFIG.9, the conductor exposed portions220provided at terminal portions of the insulated wires200are conductively connected by performing an electric wire arrangement step s1of arranging the conductor exposed portions220in the arrangement space S, a compression and movement step s2of lowering the ultrasonic welding tool10and the width direction adjustment portions20, a conductor compressing step s3of compressing the conductor exposed portions220by using the horn13and the anvil30, and an ultrasonic welding step s4of fusing and welding the compressed conductor exposed portions220by ultrasonic waves in this order. Note that the conductor compressing step s3and the ultrasonic welding step s4may be performed simultaneously. Each of the steps will be described in details below with reference toFIGS.10A to10CandFIGS.11A and11B. Preliminarily, a plurality (nine in the present embodiment) of the insulated wires200are prepared, and the insulating covering210on each of the insulated wires200on one end side (−X direction side) thereof is cut and peeled off by a predetermined length to expose a stranded conductor surrounded by the insulating covering210, thereby forming the conductor exposed portions220. Next, an anvil30suitable for the number and outer diameter of the conductor exposed portions220to be connected is selected, and the anvil30selected is arranged at a predetermined position by being moved along the rail50so as to allow the anvil-side upper surface322to be arranged so as to face the horn-side lower surface13a. Here, the anvil30ais positioned below the ultrasonic welding tool10. Subsequently, the regulating portions21are moved along the width direction Y until the regulating surfaces26have a predetermined interval, and the ultrasonic welding tool10is risen until the horn13reaches a predetermined height to form the arrangement space S. In this state, as illustrated inFIG.10A, the conductor exposed portions220are arrayed in the arrangement space S formed by the regulating portions21arranged so as to face each other at a predetermined interval and the horn13, and are inserted from the +X direction side toward the −X direction side (the electric wire arrangement step s1). Note that, in the present embodiment, by arranging three conductor exposed portions220along the up-down direction Z and arranging three conductor exposed portions220along the width direction Y, nine conductor exposed portions in total are inserted into the arrangement space S and joined together. Then, while the ultrasonic welding tool10is lowered, the regulating portions21are moved toward a conductor exposed portions220side along the width direction Y in synchronization with lowering of the ultrasonic welding tool10, by control of the control unit40. Accordingly, as illustrated inFIG.10BandFIG.11A, the regulating surfaces26are brought into contact with both respective side surfaces of the anvil upper portion32on a width direction Y side, the conductor exposed portions220are sandwiched between the horn-side lower surface13aand the anvil-side upper surface322, and the conductor exposed portions220are pressed from the above by the horn13(the compression and movement step s2). Specifically, in this compression and movement step s2, the ultrasonic welding tool10is lowered in a state in which the conductor exposed portions220are arranged in the arrangement space S formed among the horn-side lower surface13a, the anvil-side upper surface322, and the pair of regulating surfaces26, and the regulating portions21are moved toward the conductor exposed portions220side along the horn-side lower surface13a, thereby causing the corrugated regulating portions27provided on the regulating surfaces26and the anvil-side corrugated portions33provided on the anvil main surfaces321to engage with each other. Here, since a width of the anvil main surfaces321with respect to the width direction Y is configured so as to be slightly longer than a width formed by a bundle of the wires of the conductor exposed portions220, the conductor exposed portions220can also be prevented from being caught between the regulating portions21and the anvil upper portion32in a state where the corrugated regulating portions27and the anvil-side corrugated portions33engage with each other. Further, in the state where the conductor exposed portions220are arranged in the arrangement space S, even when the conductor exposed portions220are pushed from the above and moved in the width direction Y by further lowering the ultrasonic welding tool10, the movement in the width direction Y of the conductor exposed portions220can be regulated by the regulating surfaces26. Subsequently, by lowering the ultrasonic welding tool10further downward (conductor compressing step s3), the conductor exposed portions220are pressurized and deformed by the horn13and expands in the width direction Y, but the corrugated regulating portions27engage with the anvil upper portion32, thereby causing the conductor exposed portions220to be brought into contact with the regulating surfaces26. Additionally, by further pressurizing the conductor exposed portions220by the horn13, as illustrated inFIG.10B, the conductor exposed portions220are pressed against the corrugated regulating portions27provided on the regulating surfaces26, and continuous corrugated shapes are formed along the longitudinal direction X at positions corresponding to side surfaces of the insulated wires200. In this manner, by further lowering the horn13in a state where the insulated wires200are arranged in the arrangement space S, the conductor exposed portions220can be compressed from the up-down direction Z (conductor compressing step s3), and the conductor exposed portions220arranged in the up-down direction Z can be more reliably in contact with each other. Additionally, the conductor exposed portions220are formed in corrugated shapes along the longitudinal direction X because the conductor exposed portions220are compressed in contact with the regulating surfaces26. As a result, the conductor exposed portions220arranged in parallel along the width direction Y can be brought into contact with each other in a direction intersecting the longitudinal direction X (the width direction Y), and the conductor exposed portions220can be reliably brought into contact with each other by the compression. Ensuring reliable electrical conductivity by reliably being in contact with and joining the conductor exposed portions220with each other in this manner is an important issue in manufacturing the joined conductor100. In addition, for example, according to request for reduction in weight of vehicles in recent years, there has also been a need to join alloyed electric wires having high strength. These materials having high strength are difficult to deform, and it is difficult to make the conductor exposed portions220be brought into contact with each other more reliably. In order to reliably bring the conductor exposed portions220into contact with each other and joining them in this manner, for example, as manufacturing steps in the present embodiment, the conductor compressing step s3may be performed while temperature of the materials is increased and the strength is reduced by performing ultrasonic oscillation that is weaker than that in the welding of the ultrasonic welding step s4to be described below in the conductor compressing step s3. The same object is also achieved, for example, by performing ultrasonic oscillation that is weaker than that in the welding immediately before the ultrasonic welding step s4, after the conductor compressing step s3is completed. When a thickness in a case where an inside of a mold is filled 100% with conductors, which is calculated by dividing a total cross-sectional area of the conductors of the conductor exposed portions220by a surface width of the anvil, is defined as a 100% height, it is desirable to compress the conductor exposed portions220up to a height lower than the 100% height when the conductor compressing step s3is performed. As a result, elongation in the longitudinal direction X occurs in the conductor exposed portions220filled in the mold, an oxide film formed on the conductor exposed portions220is broken, and the oxide film is efficiently removed in subsequent welding. In a case of the height less than or equal to 100%, the above described object is achieved, but a height less than or equal to 95% and equal to or more than 70% is preferable. More preferably, the compression is performed between 90% and 80%. When the compression is small, the above described object is not easily achieved, and when the compression is too large, the cross-sectional area becomes smaller in a root portion of the electric wires and the strength becomes weak, which is not preferable. In this state, by ultrasonically oscillating the horn13along the longitudinal direction X intersecting the width direction Y, the conductor exposed portions220are ultrasonically metal-joined to each other by ultrasonic welding (the ultrasonic welding step s4). In the ultrasonic welding step s4, control may be performed by the control unit40to determine a bottom dead center (stopping point) in the up-down direction Z during welding. As a result, sudden increase in temperature during welding of the conductor exposed portions220is suppressed, and sticking to the horn13is suppressed. The ultrasonic oscillation may also be continued after reaching the bottom dead center during welding. As a result, the welded portion is maintained at high temperature while the oxide film is removed and atoms of the top surface of the conductor exposed portions220remain in contact with one another. As a result, the electrical conductivity and the rigidity are further improved. Note that it is desirable that a height of the bottom dead center be smaller than the height formed in the conductor compressing step s3, and it is desirable that the height of the bottom dead center be smaller than the 100% height which means that the inside of the mold is filled 100% with the conductors and which is calculated by the total cross-sectional area of the conductor exposed portions220and the surface width of the anvil. When the height of the bottom dead center is less than or equal to 100%, the above described object is achieved, but the height less than or equal to 90% and equal to or more than 70% is preferable. More preferably, the height is between 85% and 80%. When the compression is small, the above described object is not easily achieved, and when the compression is too large, the cross-sectional area becomes small in the root portion of the electric wires, and it becomes weak, which is not preferable. Note that, as described in the present embodiment, even in a case where the corrugated regulating portion27is not formed on the regulating surface26of the regulating portion21, that is, even in a case where the corrugated portion140having the corrugated shape is not formed on the side surface of the joining portion110in the joined conductor100to be manufactured, the conductor exposed portions can be reliably brought into contact with each other and be joined, and the electrical conductivity of the joined conductor can be reliably ensured. As a result, nine conductor exposed portions220that are pressurized so as to form the corrugated shape along the longitudinal direction X inside the arrangement space S are ultrasonically welded with the conductor exposed portions220adjacent to each other along the longitudinal direction X and the width direction Y reliably brought into contact with each other, so that the joined conductor100with the improved electrical conductivity and rigidity can be manufactured (seeFIG.11B). Thus, the joined conductor100includes the joining portion110in which the plurality of conductor exposed portions220arranged along the longitudinal direction X are fused and joined, the joining portion110is along the longitudinal direction X, and is provided with the first surface121and the second surface122being two surfaces that face each other, and in a case where a direction in which the first surface121and the second surface122being two surfaces that face each other is referred to as the width direction Y, and the corrugated portions140in which the ridges141protruding outward in the width direction Y and the valleys142recessed inward in the facing direction are continuously provided along the longitudinal direction X on both the first surface121and the second surface122that face each other are provided, so that the joining strength between the conductor exposed portions220can be improved and the electrical conductivity can be improved. Specifically, since the corrugated portion140is formed on at least the first surface121of the first surface121and the second surface122which are facing surfaces, the conductor exposed portions220aligned and arranged in the width direction Y among the plurality of conductor exposed portions220configuring the joining portion110are joined in a state where the conductor exposed portion220is in contact with other conductor exposed portions220adjacent thereto in the width direction Y along a direction intersecting the longitudinal direction X (seeFIG.10C) Thus, the joining strength between the conductor exposed portions220arranged in the width direction Y is improved in the joining portion110. Thus, the integrity of the joining portion110can be improved, the electrical conductivity of the conductor exposed portions220configuring the joined conductor100can be improved, and the rigidity of the joined conductor100can also be improved. In addition, the corrugated portions140are provided on both the first surface121and the second surface122that faces the first surface121, when the corrugated portion140formed on the first surface121is referred to as the corrugated portion140L, and the corrugated portion140formed on the second surface122is referred to as the corrugated portion140R, the corrugated portion140L and the corrugated portion140R are configured with the same corrugated shape, and the ridge141in the corrugated portion140L faces the valley142of the corrugated portion140R, and the valley142in the corrugated portion140L faces the ridge141of the corrugated portion140R, in other words, the corrugated portion140L formed on the first surface121and the corrugated portion140R formed on the second surface122are configured so as to deviated by a half wavelength along the longitudinal direction, so that the conductor exposed portions220aligned and arranged along the width direction Y oscillate at a constant width in the width direction Y. As a result, the apparent cross-sectional coefficient of the entire joining portion110can be improved, and the rigidity of the joined conductor100can be improved. In addition, since widths of the first surface121and the second surface122with respect to the width direction Y are constant in the longitudinal direction X, that is, since cross-sectional areas of the conductor exposed portions220in the longitudinal direction X are constant, unevenness in rigidity of the joining portion110can be suppressed, and variations in quality of the joined conductor100can be suppressed. Furthermore, by providing a plurality of the corrugated portions140along the longitudinal direction X, in the joining portion110where the conductor exposed portions220periodically aligned and arranged in the intersecting direction that intersects the longitudinal direction X are joined (seeFIG.10C), the joining strength between the conductor exposed portions220aligned and arranged in the intersecting direction can be improved, and a contact area between the conductor exposed portions220can be increased. Accordingly, the integrity of the joining portion110can be further improved, and the electrical conductivity and the rigidity of the conductor exposed portions220can be further improved. Additionally, the height L1in an orthogonal cross-sectional direction from the bottom of the valley142to the vertex of the ridge141is configured to be less than or equal to 0.5 times the interval L2in the width direction Y between the first surface121and the second surface122, so that the electrical conductivity of the joined conductor100can be improved and the rigidity can be reliably improved. Specifically, when the height of the ridge141with respect to the valley142is higher than 0.5 times the interval between the first surface121and the second surface122in the width direction Y, the amplitude of the corrugated shape in the joining portion110increases, and a load applied to the conductor exposed portions220increases, so that the conductor exposed portions220may be partially ruptured or damaged, the electrical conductivity of the joined conductor100may not be sufficiently ensured, and the rigidity may decline. However, by configuring the height L1of the ridge141with respect to the valley142in the width direction Y so as to be less than or equal to 0.5 times the interval L2in the width direction Y between the first surface121and the second surface122, the load of the conductor exposed portions220configuring the joining portion110can be reduced, and the conductor exposed portions220aligned in the width direction Y can be oscillated in the width direction Y, so that the joining strength between the conductor exposed portions220due to curvature can be reliably improved, and the contact area between the conductor exposed portions220can be increased. As a result, the integrity of the joining portion110can be improved, and a possibility that the conductor exposed portions220are partially ruptured or damaged can be reduced, and the electrical conductivity of the joined conductor100can be sufficiently improved, and the rigidity can be reliably improved. Furthermore, the height L1in the orthogonal cross-sectional direction from the bottom of the valley142to the vertex of the ridge141is configured to be equal to or more than 0.5 times the diameter L3that is the minimum diameter of the plurality of conductor exposed portions220that are arranged, so that the electrical conductivity of the joined conductor100can be improved. Specifically, when the height L1of the ridge141with respect to the valley142in the width direction Y is lower than 0.5 times the minimum diameter of the plurality of conductor exposed portions220that are arranged, since an amplitude amount of a corrugated shape formed by the ridge141and the valley142in the joining portion110is small, and the conductor exposed portions220arranged along the width direction Y are not arranged so as to intersect with each other with respect to the longitudinal direction X, the integrity of the joining portion110cannot be sufficiently improved, and the electrical conductivity of the joined conductor100cannot be sufficiently improved. In contrast, by making the height of the ridge141with respect to the valley142in the width direction Y be equal to or more than 0.5 times the minimum diameter of the plurality of conductor exposed portions220that are arranged, the joining portion110can be reliably bent along the ridge141and the valley142, so that the conductor exposed portions220arranged along the width direction Y are arranged so as to intersect with each other in the longitudinal direction X. As a result, the joining strength between the conductor exposed portions220can be reliably improved, the contact area between the conductor exposed portions220can be increased, and the electrical conductivity of the joined conductor100can be improved. Further, the joining portion110may have the planar portion150formed in a planar shape along the longitudinal direction X between the tip thereof and the corrugated portion140. Accordingly, it is possible to suppress peel-off of the joining between the conductor exposed portions220from a tip side of the joining portion110. Specifically, since the ridge141and the valley142that configure the corrugated portion140are configured by bending the conductor exposed portions220, the joining between the conductor exposed portions220is easily peeled off, when an external force acts on an opposite side to a bending direction. However, since the joining portion110has the planar surface150between the tip and the corrugated portion140, it is possible to prevent an unintended external force on the opposite side to the bending direction from directly acting on the ridge141and the valley142, and even when an unintended external force is applied, it is possible to suppress the peel-off of the joining between the conductor exposed portions220because the external force can be absorbed by the planar portion150. In addition, since the joining portion110is configured with the joining portion110formed by ultrasonic welding, an interface between the conductor exposed portions220in the joining portion110can be joined by ultrasonic welding, so sufficient joining can be performed even inside the joined conductor100. As a result, the joining strength of the joined conductor100can be stabilized. Furthermore, change in physical properties caused by excessive heat is suppressed and, therefore, mixing of foreign objects can be prevented. Accordingly, the electrical conductivity and the rigidity of the joined conductor100can be stabilized. Further, in the cross section of the joining portion110, the conductor exposed portions220are deformed and the interfaces between the conductor exposed portions220are closely in contact with and are joined by the ultrasonic joining portion160, and thus, specifically, as illustrated inFIGS.2B and2C, since the conductor exposed portions220are deformed from a perfect circular shape to an elliptical shape, for example, in an orthogonal cross section orthogonal to the longitudinal direction X, the contact area between the conductor exposed portions220is increased, and the joining strength between the conductor exposed portions220is increased, so that the integrity of the joining portion110can be further improved, and the electrical conductivity and the rigidity of the joined conductor100can be further improved. Furthermore, the conductor exposed portions220are formed of aluminum or aluminum alloy, which makes it possible to reduce the weight of the joined conductor100. Further, the conductor joining device1for joining the plurality of conductor exposed portions220by ultrasonic welding includes the ultrasonic welding tool10having the horn-side lower surface13athat is brought into contact with the conductor exposed portions220, and configured to ultrasonically oscillate, the pair of regulating portions21configured to be brought into contact with the horn-side lower surface13aand configured to be relatively movable along the horn-side lower surface13a, and the anvil30configured to relatively move in the up-down direction Z of approaching to or separating from the horn-side lower surface13a, the corrugated regulating portion27having the corrugated potion in which, on each of the regulating surfaces26facing each other in the pair of the regulating portions21, the regulating portion-side convex portion271protruding toward the facing other regulating surface26and the regulating portion-side concave portion272recessed in a direction opposite to the protruding direction of the regulating portion-side convex portion271are continuously provided along the width direction Y in which the pair of regulating surfaces26face each other and the longitudinal direction X orthogonal to the up-down direction Z is formed, and the anvil30includes the anvil-side convex portion331and the anvil-side concave portion332that engage with the regulating portion-side convex portion271and the regulating portion-side concave portion272, and the ultrasonic welding tool10and the regulating portions21relatively move with respect to the anvil30in such a manner that the anvil30is sandwiched between the regulating portions21facing each other and at least one of the pair of regulating portions21relatively moves toward the other regulating portion21, which allows the joining strength between the conductor exposed portions220to be improved. Specifically, the horn13relatively moves with respect to the anvil30by forming the corrugated regulating portions27having the corrugated shape on the regulating surfaces26, and providing the anvil-side convex portions331and the anvil-side concave portions332formed on the anvil30so as to be able to engage with the corrugated regulating portion27, so that the plurality of arranged conductive exposed portions220are compressed by the anvil30and the horn13. In addition, since the regulating portions21move inward in the width direction Y according to the relative movement of the horn13, the regulating portions21can regulate movement of the conductors outward in the width direction Y, and can bend the conductor exposed portions220into the corrugated shape that oscillates with respect to the width direction Y toward the longitudinal direction X. By bending the conductor exposed portions220into the corrugated shape that oscillates with respect to the width direction Y in this manner, the conductor exposed portions220aligned and arranged along the width direction Y can be brought into contact with each other along a direction intersecting the longitudinal direction X, and the conductor exposed portions220can be reliably brought into contact with each other. Thus, by joining the conductor exposed portions220together by ultrasonic welding, the joining strength between the conductor exposed portions220arranged along the width direction Y can also be increased, and the integrity of the joined conductor100can be improved. Thus, the electrical conductivity and the joining strength of the joined conductor100can be improved. In addition, since the joining strength between the conductor exposed portions220is improved, the rigidity of the manufactured joined conductor100as a whole can also be improved. Additionally, since the corrugated regulating portion27is formed in a sine wave shape, the end portions in the width direction Y of the arrangement space S formed by the horn13, the regulating portions21, and the anvil30are formed in a circular arc shape, so it is possible to form the corrugated shape in which the conductor exposed portions220are bent in the circular arc shape along the longitudinal direction X. As a result, the conductor exposed portions220arranged in the width direction Y can be continuously brought into contact with each other, and the conductor exposed portions220can be reliably brought into contact with each other, and the joining strength can be increased. In addition, it is possible to prevent a corner portion in which the joining becomes weak from being formed in the joined conductor100during compression and ultrasonic welding. Furthermore, since the conductor exposed portions220can be formed in a smooth corrugated shape along the longitudinal direction X by the corrugated regulating portion27, as in a case where the anvil-side convex portion331is formed in a rectangular shape, it is possible to prevent a corner of the anvil-side convex portion331from abutting on the conductor exposed portions220and cutting the conductor exposed portions220, and it is possible to reliably improve the electrical conductivity and the rigidity of the joined conductor100. Furthermore, the plurality of regulating portions27are provided along the longitudinal direction X, so that the conductor exposed portions220can be bent into the corrugated shape that periodically repeatedly oscillates with respect to the width direction Y toward one side in the longitudinal direction X, the conductor exposed portions220aligned and arranged in the width direction Y can be periodically brought into contact with each other in a direction that intersects the longitudinal direction X, and the conductor exposed portions220can be more reliably brought into contact with each other. As a result, the joining strength can be further improved by ultrasonically joining the conductor exposed portions220. Therefore, the integrity of the joining part of the conductor exposed portions220can be further improved, and the electrical conductivity of the joined conductor100can be further improved. In addition, the corrugated regulating portions27are formed on both regulating surfaces26(regulating surfaces26R, and26L) that face each other in the pair of regulating portions21, and the corrugated regulating portion27formed on the regulating surface26L is referred to as the corrugated regulating portion27L, the corrugated regulating portion27formed on the regulating surface26R is referred to as the corrugated regulating portion27R, the corrugated regulating portion27L and the corrugated regulating portion27R are configured to have the same corrugated shape, and the regulating portion-side convex portion271of the corrugated regulating portion27L faces the regulating portion-side concave portion272of the corrugated regulating portion27R, and the regulating portion-side concave portion272of the corrugated regulating portion27L faces the regulating portion-side convex portion271of the corrugated regulating portion27R, that is, the corrugated regulating portion27L formed in the corrugated regulating portion27L and the corrugated regulating portion27R formed in the regulating surface26R are configured to be deviated by a half wavelength, so that the joined conductor100bent by the corrugated regulating portion27L and the corrugated regulating portion27R is formed in the corrugated shape that oscillates in the width direction Y with a predetermined width with respect to the width direction Y toward one side in the longitudinal direction X. As a result, the apparent cross-sectional coefficient of the joined conductor100ultrasonically welded can be improved, and the rigidity of the joined conductor100can be improved. In addition, since the length (length L2) of the width between the side surfaces (first surface121and second surface122) along the width direction Y in the joined conductor100becomes a predetermined value, it is possible to suppress imbalance in contact area and joining strength between the conductor exposed portions220in the longitudinal direction X. Thus, the electrical conductivity and the joining strength of the joined conductor100can be stabilized. In addition, by providing the flat portion28formed so as to be flat along the longitudinal direction X on the tip side in the longitudinal direction X of the regulating surface26in the regulating portion21, the tip side of the joined conductor100can be formed in a planar shape, and it is possible to suppress the peel-off of the joining between the conductor exposed portions220from the tip side. Specifically, in the bending part bent into the corrugated shape in the joined conductor100, the joining between the conductor exposed portions220is easily peeled off in a case where unintended external force acts on the opposite side to the bending direction. In addition, when the tip side of the joined conductor100is formed in the corrugated shape, the unintended external force on the opposite side to the bending direction may act on the tip portion with the corrugated shape. In contrast, by providing the flat portion28on the tip side in the longitudinal direction X of the regulating surface26, the tip side of the joined conductor100can be formed in a planar shape, and it is possible to prevent the unintended external force on the opposite side to the bending direction from acting directly on the bending part bent in the corrugated shape in the joined conductor100. In addition, even when the unintended external force acts on the tip part of the joined conductor100, the tip part formed on the planar surface can absorb the external force, so it is possible to suppress the peel-off of the joining between the conductor exposed portions220. Additionally, the ultrasonic welding tool10can effectively join the conductor exposed portions220when the ultrasonic welding tool10ultrasonically oscillates along a direction (the longitudinal direction X) intersecting a direction (the up-down direction Z) in which the ultrasonic welding tool10and the anvil30face each other. Specifically, by compressing the conductor exposed portions220arranged in the arrangement space S by the ultrasonic welding tool10and the anvil30, external force along the up-down direction Z (a compressing direction) acts on the horn-side lower surface13aof the conductor exposed portions220aligned in the up-down direction Z. In addition, when the ultrasonic welding tool10and the anvil30compress the conductor exposed portions220to cause the conductor exposed portions220to tend to extend in the width direction Y, movement of the conductor exposed portions220in the width direction Y is regulated by the corrugated regulating portions27, and the conductor exposed portions220are arranged so as to be bent in the width direction Y toward the longitudinal direction X. As a result, the conductor exposed portions220aligned in the width direction Y are more reliably brought into contact with each other, and the horn-side lower surface13ais formed along a direction intersecting the longitudinal direction X. In this state, when the ultrasonic welding tool10is ultrasonically oscillated in the longitudinal direction, in the conductor exposed portions220in which the external force acts on the conductor exposed portions220arranged in the up-down direction Z, an oxide film or the like on a metal surface of each of the conductor exposed portions220on which the external force acts is reliably removed by ultrasonic oscillation, and then the conductor exposed portions220are easily welded due to interatomic forces of attraction of metal configuring each of the conductor exposed portions220. Furthermore, the conductor exposed portions220aligned in the width direction Y are also bent, so that the horn-side lower surface13ais formed along a direction intersecting the longitudinal direction X, and therefore, an oxide film or the like on the metal surface of each of the conductor exposing portions220is reliably removed, and the conductor exposed portions220are easily welded due to interatomic forces of attraction of the metal configuring each of the conductor exposed portions220. Accordingly, the conductor exposed portions220aligned in the up-down direction Z or the width direction Y can be efficiently and reliably joined. Note that, in the present embodiment, the horn13is configured to ultrasonically oscillate along the longitudinal direction X, but instead of the longitudinal direction X, may also be configured to ultrasonically oscillate in a direction intersecting the width direction Y or the longitudinal direction X. In addition, in the present embodiment, the anvil main surface321is configured to face the width direction Y and the regulating portions21are configured to move along the width direction Y, but this configuration is not necessarily required, and for example, the anvil main surface321may be configured to face the longitudinal direction X orthogonal to the width direction Y and the regulating portions21may be configured to move along the longitudinal direction X orthogonal to the width direction Y. Furthermore, the anvil main surface321may be configured to face in a direction intersecting the width direction Y, and the regulating portions21may be configured to move along a direction in which the anvil main surface321faces. That is, a direction of ultrasonic oscillation of the horn13and the longitudinal direction of the insulated wires200may coincide with each other or may intersect with each other. In addition, by allowing the control unit40that synchronizes relative movement of the ultrasonic welding tool10and the regulating portions21with respect to the anvil30and movement of at least one of the pair of regulating portions21with respect to the other to be provided, that is, by allowing movement of the ultrasonic welding tool100and the regulating portions21in a compressing direction and movement of the regulating portions21in the width direction Y to be synchronized with each other, the anvil30and the pair of regulating portions21can be brought into contact with each other before the anvil30and the ultrasonic welding tool10compress the conductor exposed portions220, and thus, the conductor exposed portions220can be reliably prevented from being caught in a gap formed between the anvil30and the regulating portions21. As for correspondence between the configuration of the invention and the above-described embodiment, the conductor corresponds to the conductor exposed portion220, the convex line portion corresponds to the ridge141, the concave line portion corresponds to the valley142, the joining portion corresponds to the joining portion110, the joined conductor corresponds to the joined conductor100, the first corrugated portion corresponds to the corrugated portion140L, the second corrugated portion corresponds to the corrugated portion140R, the facing direction corresponds to the width direction Y, the ultrasonic joining portion corresponds to the joining portion110, the ultrasonic welding portion corresponds to the ultrasonic joining portion160, the first direction corresponds to the up-down direction Z, the second direction corresponds to the width direction Y, the contact surface corresponds to the horn-side lower surface13a, the facing direction corresponds to the width direction Y, the orthogonal direction corresponds to the longitudinal direction X, the convex portion corresponds to the regulating portion-side convex portion271, the concave portion corresponds to the regulating portion-side concave portion272, the engaging convex portion corresponds to the anvil-side convex portion331 the engaging concave portion corresponds to the anvil-side concave portion332, the first corrugated regulating portion corresponds to the corrugated regulating portion27R, the second corrugated regulating portion corresponds to the corrugated regulating portion27L, the facing contact surface corresponds to the anvil-side upper surface322, the step of arranging conductors corresponds to the electric wire arrangement step s1and, the step of moving and compressing corresponds to the compression and movement step s2, but the invention is not limited to the configuration of the embodiment described above, and many embodiments can be obtained. For example, in the present embodiment, the conductor exposed portion220is a stranded conductor formed by twisting wires with electrical conductivity together, but is not limited to this embodiment, and may be, for example, configured of a solid wire or wires bundled together. Furthermore, the conductor exposed portion220is not limited to an aluminum-based conductor made of aluminum, aluminum alloy, or the like, and may be made of, for example, copper or copper alloy. That is, any material may be used as long as it has electrical conductivity. Further, the conductor exposed portion220is exposed by cutting and peeling off the insulating covering210forming the outer layer at one end of the insulated wire200covered with the insulating covering210having insulating properties, but may be a conductor covered with no insulating covering210, or a conductor in which wires are only bundled. Furthermore, the conductor exposed portions220are the same conductor, but a plurality of conductors having different types may be used. In other words, a configuration in which the joining portion is surrounded by copper tube, copper foil, or the like, for example, may be used for the plurality of conductor exposed portions220described above. In addition, not only a case where the corrugated portion140is formed on each of the first surface121and the second surface122but also a case where the corrugated portion140is formed on only one of the first surface121and the second surface122may be applicable. In addition, the corrugated portion140may be formed on an entire surface of the first surface121or the second surface122, or may be formed on a part of the first surface121or the second surface122. Furthermore, in the corrugated portion140, it is sufficient that at least one or more of the ridges141and at least one or more of the valleys142may be continuous along the longitudinal direction X, and for example, as long as at least one of the ridges141and at least one of the valleys142are continuous, the number of the ridges141and the number of the valleys142do not need to be coincident. In addition, in the present embodiment, among the horn-side lower surface13a, the anvil-side upper surface322, and the pair of regulating surfaces26that form the arrangement space S for inserting the conductor exposed portions220, although the corrugated regulating portions27are provided only on the regulating surfaces26, as illustrated inFIG.12andFIG.13, for example, the bottom surface portion of the horn13(referred to as a corrugated bottom surface portion13b) and the anvil-side upper surface322may be formed in a corrugated shape. Hereinafter, a conductor joining device1xin which the corrugated bottom surface portion13band the anvil-side upper surface322are formed in a corrugated shape will be briefly described based onFIG.12andFIG.13. Here,FIG.12is a schematic perspective view of the conductor joining device1x, and the horn13is illustrated by enlarging the corrugated bottom surface portion13band the anvil-side upper surface322of the cross-sectional illustration corresponding to the cross-sectional view taken along a C-C line inFIG.8Aof the conductor joining device1x. As illustrated inFIG.12andFIG.13, a compression-side corrugated portion37is provided on the anvil-side upper surface322in place of the anvil-side concave-convex portion34. Note that the anvils30each of which the compression-side corrugated portion37is configured are referred to as an anvil30d, an anvil30e, and an anvil30f(seeFIG.12). The compression-side corrugated portion37corresponds to the intersecting-side corrugated portion, and is configured of a compression-side convex portion371protruding upward compared to the flat portion35, and a compression-side concave portion372recessed downward, and four compression-side corrugated portions37are continuously aligned and arranged along the longitudinal direction X. That is, the compression-side convex portion371corresponds to the intersecting-side convex line portion, and the compression-side concave portion372corresponds to the intersecting-side concave line portion, and are arranged continuously along the longitudinal direction X, respectively. On the other hand, as illustrated inFIG.13, the corrugated bottom surface portion13bprotruding downward is provided on the bottom surface side of the horn13, and the corrugated bottom surface portion13bis provided with the horn valley in width direction14cthat forms a valley recessed downward in a circular arc shape and a horn ridge in width direction15cprotruding downward in a circular arc shape. In addition, a corrugated portion for movement29is formed in place of the movement assist portion for regulation25in the regulating portion21that is formed so as to be movable in the width direction Y along the corrugated bottom surface portion13b. The corrugated portion for movement29is configured of a convex portion for movement assist291that can loosely engage with the horn valley in width direction14c, and a concave portion for movement assist292that can loosely engage with the horn ridge in width direction15c. Note that the convex portion for movement assist291and the concave portion for movement assist292are formed in a continuous and substantial sine wave shape in a side view. The conductor joining device1xconfigured in this manner can ultrasonically join the conductor exposed portions220formed in a corrugated shape not only along the width direction Y but also along the up-down direction Z, so that the conductor joining device1xcan manufacture a joined conductor100xin which not only are the corrugated portions140formed on the first surface121and the second surface122that face each other along the width direction Y, but also upper and lower side corrugated portions170are formed on a third surface131and a fourth surface132facing each other along the up-down direction Z. Hereinafter, the joined conductor100xwill be briefly described based onFIG.14toFIGS.16A to16D. Here,FIG.14illustrates a schematic perspective view of the joined conductor100x, andFIGS.15A and15Billustrate a plan view (FIG.15A) and a side view (FIG.15B) of the joined conductor100x.FIGS.16A to16Dillustrate a cross-sectional plan view taken along an E-E line (FIG.16A), a cross-sectional plan view taken along an F-F line (FIG.16B), a cross-sectional plan view taken along a G-G line (FIG.16C), and a cross-sectional plan view taken along an H-H line (FIG.16D) inFIG.15A. As illustrated inFIG.14andFIGS.15A and15B, in the joined conductor100x, not only are the corrugated portions140formed on the first surface121and the second surface122, but also four of the upper and lower side corrugated portions170(corresponding to the intersecting-side corrugated portions) having a corrugated shape are continuously provided on the third surface131and the fourth surface132along the longitudinal direction X, and are formed in a sine wave shape in a side view. More specifically, the upper and lower side corrugated portion170includes an upper and lower side ridge171(corresponding to the intersecting-side convex line portion) protruding outward in the up-down direction Z with respect to the third surface131, and the upper and lower side valley172(corresponding to the intersecting-side concave line portion) recessed inward in the up-down direction Z with respect to the third surface131, and the upper and lower side ridges171and the upper and lower side valleys172are continuously alternately arranged. As illustrated inFIGS.16A to16D, as the joined conductor100xconfigured in this manner goes from −X toward +X along the longitudinal direction X, a state of the joined conductor100xshifts from a state where the ridge141protrudes toward the −Y side in the width direction Y (seeFIG.16A) to a state where the ridge141does not protrude (seeFIG.16B), then passes through a state where the ridge141protrudes toward the +Y side (see FIG.16C), and becomes a state where the ridge141does not protrude (seeFIG.16D). Similarly, as for the up-down direction Z, as the jointed conductor100xgoes from −X toward +X along the longitudinal direction X, the state shifts from a state where the upper and lower side ridge171protrudes toward the side (seeFIG.16B) to a state where the upper and lower side ridge171protrudes upward (+Z side) (seeFIG.16B), then passes through a state where the upper and lower side ridge171does not protrude (seeFIG.16C), and becomes a state where the upper and lower side ridge171protrudes downward (−Z side) (seeFIG.16D). In other words, as the joined conductor100xgoes from −X toward +X along the longitudinal direction X, since the ridges141and the upper and lower side ridges171which are protruding portions protrude in a spiral manner, an apparent cross-sectional coefficient can be further improved than that of the joined conductor100and rigidity can be improved. Note that the corrugated bottom surface portion13bwhich is the bottom surface of the horn13and the anvil-side upper surface322are configured so as to be respectively provided with the horn valley in width direction14cand the horn ridge in width direction15c, and the compression-side corrugated portion37, but a configuration may be adopted in which the compression-side corrugated portion37is provided only on the anvil-side upper surface322, for example. In this manner, the up-down side corrugated portions170that have a corrugated shape and in which the upper and lower side ridges171protruding outward and the regulating portion-side valleys272recessed inward are continuous along longitudinal direction on the third surface131and the fourth surface132of a pair of side surfaces in up-down direction130facing in the orthogonal cross section, so that the contact area and the joining strength between the conductor exposed portions220aligned and arranged in the width direction Y and the up-down direction Z are increased. That is, since the contact area and the joining strength between the conductor exposed portions220are increased, the integrity of the joined conductor100can be further improved, and the electrical conductivity of the joined conductor100can be further improved. In addition, the corrugated regulating portion27may be formed on both of or only one of the pair of regulating surfaces26. Furthermore, the corrugated regulating portion27may be formed on the entire regulating surface26or a part of the regulating surface26. Furthermore, regarding the regulating portion27, it is sufficient that at least one or more of the regulating portion-side ridges271and at least one or more the regulating portion-side valleys272are continuous along the longitudinal direction X, and for example, as long as at least one or more of the regulating portion-side ridges271and at least one or more of the regulating portion-side valleys272are continuous, the number of the regulating portion-side ridges271and the regulating portion-side valleys272do not need to be coincident. REFERENCE SIGNS LIST 13aHorn-Side lower surface100Joined conductor110Joining portion121First surface122Second surface131Third surface132Fourth surface140Corrugated portion140L Corrugated portion140R Corrugated portion141Ridge142Valley150Planar portion170Upper and lower side corrugated portion171Upper and lower side ridge172Upper and lower side valley220Conductor exposed portion271Regulating portion-side convex portion272Regulating portion-side concave portion27R Corrugated regulating portion27L Corrugated regulating portion322Anvil-side upper surface331Anvil-side convex portion332Anvil-side concave portions1Electric wire arrangement configurations2Compression and movement steps3Conductor compressing steps4Ultrasonic welding stepX Longitudinal directionY Width directionZ Up-down direction | 80,267 |
11862916 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, an embodiment of a terminal-equipped electric wire according to the present invention is now described in detail, but the present invention is not limited to this embodiment. Embodiment One embodiment of a terminal-equipped electric wire according to the present invention is now described with reference toFIGS.1to7. Reference numeral1inFIGS.1to5indicates the terminal-equipped electric wire according to the present embodiment. The terminal-equipped electric wire1includes an electric wire10and a terminal fitting20, which are physically and electrically connected to each other. The terminal-equipped electric wire1also includes a water seal member30to enhance anticorrosion performance of a connection portion between the electric wire10and the terminal fitting20(FIGS.1and2). The terminal-equipped electric wire1may have the terminal fitting20connected to one end of the electric wire10, or may have the terminal fitting20connected to a section between both ends of the electric wire10. Furthermore, in the terminal-equipped electric wire1, at least one terminal fitting20may be connected to one electric wire10, or a plurality of electric wires10may be connected by at least one terminal fitting20, and the electric wires10may be electrically connected via the terminal fitting20. For example, when the terminal fitting20is formed to be physically and electrically connected to a counterpart terminal connector by fitting and connecting to the counterpart terminal connector of a counterpart terminal fitting, or to be physically and electrically connected to the counterpart terminal connector by fastening with a screw to the counterpart terminal connector, the terminal fitting20is connected to an end of at least one electric wire10. In another example in which the terminal fitting20is formed as a joint terminal for electrically connecting a plurality of electric wires10, the terminal fitting20is connected to an end of each electric wire10or a section between both ends of each electric wire10. In this case, the terminal fitting20may be a joint terminal that is physically and electrically connected to a plurality of electric wires10to electrically connect all the electric wires10to one another via the terminal fitting20. Alternatively, the terminal fitting20may be a joint terminal in which groups each combining at least two wires of the electric wires10are connected physically and electrically, and may be provided for each of the groups. The terminal-equipped electric wire1illustrated herein has a terminal fitting20connected to an end of one electric wire10. This terminal fitting20is to be fitted and connected to a counterpart terminal connector (not illustrated). The electric wire10includes a core wire11and a sheath12covering the core wire11, and a part of the sheath12is peeled off so that the core wire11is partially uncovered (FIGS.1to5). The core wire11is formed by bundling a plurality of strands13formed by conductive metal wires. The strands13is formed of aluminum, an aluminum alloy, copper, or a copper alloy, for example. The sheath12is formed of an insulating resin material, and covers the core wire11while exposing a core-wire uncovered portion11aof the core wire11. The electric wire10of the present embodiment has the core-wire uncovered portion11aat its end. The terminal fitting20is formed of a conductive material such as metal (for example, aluminum, an aluminum alloy, copper, or a copper alloy). The terminal fitting20is formed by shaping a metal plate as a base material into a predetermined shape by press work such as bending or cutting. The terminal fitting20has a terminal connector21, which is to be electrically connected to the counterpart terminal connector of a counterpart terminal fitting (FIGS.1,3,4, and6). For example, one of the terminal connector21and the counterpart terminal connector has a shape of a female terminal, and the other has a shape of a male terminal. The terminal connector21and the counterpart terminal connector are inserted and fitted to each other to be physically and electrically connected. In this example, the terminal connector21is shaped in the female terminal having the shape of a rectangular tube, while the counterpart terminal connector is shaped in the male terminal having the shape of a male tab. The terminal fitting20has a base wall22, on which the electric wire10is placed when the terminal-equipped electric wire1is assembled (FIGS.1to6). The terminal fittings20includes a pair of core-wire crimping sections23,23, which is raised from the base wall22and crimped onto the core-wire uncovered portion11atogether with the base wall22, and a pair of sheath crimping sections24,24, which is raised from the base wall22and crimped onto a sheath end portion12aof the sheath12in a side on the core-wire uncovered portion11atogether with the base wall22with a distal end12bof the sheath end portion12ain the side on the core-wire uncovered portion11aprojecting from a distal end portion24a(FIGS.1to6). In the terminal fitting20, the distal end of the core-wire uncovered portion11aprojects from the pair of core-wire crimping sections23,23, and the terminal connector21is located at the side corresponding to the distal end of the core-wire uncovered portion11a. The terminal fitting20also includes a pair of side walls (hereinafter referred to as “first side walls”)25,25that is raised from the base wall22along the core-wire crimping sections23,23and connects the sides of the core-wire crimping sections23,23corresponding to the base wall22to the sides of the sheath crimping sections24,24corresponding to the base wall22. The first side walls25,25are formed such that the distal end12bof the sheath end portion12ais exposed through an opening25adefined between an edge of the pair of core-wire crimping sections23,23and an edge of the pair of sheath crimping sections24,24(FIGS.1,3,4, and6). The terminal fitting20further includes a pair of side walls (hereinafter referred to as “second side walls”)26,26that is raised from the base wall22along the core-wire crimping sections23,23and connects the sides of the core-wire crimping sections23,23corresponding to the base wall22to the terminal connector21(FIGS.1,3,4, and6). The base wall22includes a first base portion22a(FIGS.1to6), from which the pair of core-wire crimping sections23,23, the pair of sheath crimping sections24,24, the pair of first side walls25,25, and the pair of second side walls26,26are raised, and a second base portion22b(FIGS.1,3,4, and6), which is a part of the wall portion of the terminal connector21and is continuous with the first base portion22a. That is, the base wall22has the first base portion22a, on which an end of the electric wire10is placed, and the second base portion22b, which is a part of the wall portion of the terminal connector21. For example, in the base wall22, both of the first and second base portions22aand22bare formed in a flat or curved shape, or one of the first and second base portions22aand22bis formed in the flat shape, and the other in the curved shape. In the base wall22of this embodiment, the first and second base portions22aand22bare both formed in the flat shape. The pair of core-wire crimping sections23,23are sections projecting from both ends in a direction perpendicular to a axial direction of the electric wire10at the first base portion22aof the base wall22, on which the electric wire10is placed (FIGS.1,3,4, and6). In the terminal fitting20, for example, the pair of core-wire crimping sections23,23are projected in a direction intersecting the wall surface of the first base portion22aand are arranged so as to face each other with a space in between, so that the first base portion22aand the pair of core-wire crimping sections23,23form a U shape (FIG.3). In the terminal fitting20, the core-wire uncovered portion11ais placed on the first base portion22a, which is the base of the U shape, and the pair of core-wire crimping sections23,23are wound around the core-wire uncovered portion11aand compressed to be crimped. As a result, the core-wire uncovered portion11ais physically and electrically connected to the first base portion22aand the pair of core-wire crimping sections23,23. The pair of core-wire crimping sections23,23is crimped onto the core-wire uncovered portion11atogether with the first base portion22aof the base wall22with both ends of the core-wire uncovered portion11ain the axial direction projecting from the core-wire crimping sections23,23. In the pair of core-wire crimping sections23,23of the present embodiment, with being crimped onto the core-wire uncovered portion11a, the distal end of the core-wire uncovered portion11acorresponding to the pair of second side walls26,26projects along the second side walls26,26, while a rear end11bof the core-wire uncovered portion11acorresponding to the pair of first side walls25,25projects along the first side walls25,25(FIGS.1,2,4, and5). The terminal fitting20of the present embodiment includes, on its inner wall surface, a serration region27(FIGS.3and6) including at least one of a plurality of recesses and a plurality of projections. The serration region27extends from one of the core-wire crimping sections23to the other core-wire crimping section23. In the first base portion22aand the pair of core-wire crimping sections23,23, the serration region27increases the contact surface with the core-wire uncovered portion11a, thereby increasing the adhesion strength between these portions to improve contact reliability. The electrical connection between these portions is thus improved. The pair of sheath crimping sections24,24are sections projecting from both ends in a direction perpendicular to the axial direction of the electric wire10at the first base portion22aof the base wall22, on which the electric wire10is placed (FIGS.1,3,4, and6). In the terminal fitting20, for example, the pair of sheath crimping sections24,24are projected in a direction intersecting the wall surface of the first base portion22aand are arranged so as to face each other with a space in between, so that the first base portion22aand the pair of sheath crimping sections24,24form a U shape (FIG.3). In the terminal fitting20, the sheath end portion12ais placed on the first base portion22a, which is the base of the U shape, and the pair of sheath crimping sections24,24is wound around the sheath end portion12aand compressed to be crimped. When the pair of sheath crimping sections24,24is crimped onto the sheath end portion12atogether with the first base portion22aof the base wall22, the distal end12bof the sheath end portion12aprojects from the distal end portion24a, which corresponds to the pair of core-wire crimping sections23,23toward the pair of first side walls25,25, and the electric wire10extends outward from a rear end portion24b, which is opposite to the distal end portion24a(FIGS.1and4). The pair of first side walls25,25are sections projecting from both ends in a direction perpendicular to the axial direction of the electric wire10at the first base portion22aof the base wall22, on which the electric wire10is placed (FIGS.1,3,4, and6). The pair of first side walls25,25are projected in a direction intersecting the wall surface of the first base portion22aand are arranged so as to face each other with a space in between. In the pair of first side walls25,25, one of the first side walls25is connected to the side of one of the core-wire crimping sections23corresponding to the first base portion22aand the side of one of the sheath crimping sections24corresponding to the first base portion22a, while the other first side wall25is connected to the side of the other core-wire crimping section23corresponding to the first base portion22aand the side of the other sheath crimping section24corresponding to the first base portion22a. In the terminal fitting20, the opening25afor exposing the distal end12bof the sheath end portion12ais defined between the ends of the pair of first side walls25,25on a projecting direction and between the pair of core-wire crimping sections23,23and the pair of sheath crimping sections24,24(FIGS.1,2,4, and5). The opening25aof the present embodiment exposes the distal end12bof the sheath end portion12aand the rear end11bof the core-wire uncovered portion11a. The pair of second side walls26,26are sections projecting from both ends in a direction perpendicular to the axial direction of the electric wire10at the first base portion22aof the base wall22, on which the electric wire10is placed (FIGS.1,3,4, and6). The pair of second side walls26,26are projected in a direction intersecting the wall surface of the first base portion22aand are arranged so as to face each other with a space in between. In the pair of the second side walls26,26, one of the second side walls26is connected to the terminal connector21and the side of one of the core-wire crimping sections23corresponding to the first base portion22a, while the other second side wall26is connected to the terminal connector21and the side of the other core-wire crimping section23corresponding to the first base portion22a. In the terminal fitting20, an opening26afor exposing the distal end of the core-wire uncovered portion11ais defined between the ends of the pair of second side walls26,26on the projecting direction and between the terminal connector21and the pair of core-wire crimping sections23,23(FIGS.1and4). The base wall22of the terminal fitting20includes a recess22c(FIGS.2,5, and6), which extends continuously from an opposite arrangement area of the pair of sheath crimping sections24,24offset from the rear end portion24btoward the distal end portion24ato an area beyond the distal tip surface12b1of the distal end12bof the sheath end portion12a. The recess22creceives a side on the base wall22of the sheath end portion12afrom a crimped portion offset from the rear end portion24btoward the distal end portion24ain the pair of sheath crimping sections24,24to the distal tip surface12b1. The recess22cis formed in the first base portion22a. The recess22cof the present embodiment is located in a recess formation region extending from the opposite arrangement area of the pair of sheath crimping sections24,24, excluding the rear end portion24band being offset toward the distal end portion24a, to an area beyond the distal tip surface12b1of the sheath end portion12ain the inner wall surface of the first base portion22a. The recess22cis recessed in a rectangular shape from one of the first side walls25to the other first side wall25(FIG.6). In the terminal-equipped electric wire1, when the pair of sheath crimping sections24,24is crimped onto the sheath end portion12a, the crimping force applied by the pair of sheath crimping sections24,24presses the sheath end portion12ainto the recess22c. The recess22cis formed to have a size such that a gap is formed between the distal tip surface12b1and the surface defining the recess22cin a state where the sheath end portion12ais pressed inside so that the recess22cextends continuously beyond the distal tip surface12b1of the sheath end portion12a(FIGS.2and5). In the terminal-equipped electric wire1, the crimping force acts on the sheath end portion12afrom the pair of sheath crimping sections24,24and the first base portion22aof the base wall22after crimping. As a result, a force acts on the distal end12bof the sheath end portion12a, which is supported by the first base portion22a, in the directions opposite to the directions of the crimping force from the pair of sheath crimping sections24,24. As such, the distal end12bof the sheath end portion12acurls outward in the directions of this opposite force. However, in the terminal-equipped electric wire1, the recess22cin the first base portion22areceives the sheath end portion12a, thereby suppressing the curling of the curling part12cin the distal end12bof the sheath end portion12ato a small degree (FIGS.2and5). The recess22cis preferably formed as a recess having a depth corresponding to the thickness of the sheath12. This allows the recess22cto reduce the load on the core-wire uncovered portion11aextending beyond the distal tip surface12b1of the sheath end portion12a, while suppressing the curling of the curling part12cin the distal end12bof the sheath end portion12ato a small degree. The water seal member30covers the exposed part of the electric wire10in the terminal fitting20together with the terminal fitting20from the outside (FIG.1). The water seal member30thus suppresses the entry of liquid into the connection portion between the electric wire10and the terminal fitting20. The water seal member30is made from a curable resin material and obtained by curing the curable liquid resin material with fluidity. After the electric wire10and the terminal fitting20are crimped together, the curable liquid resin material is applied from a nozzle N to the exposed part of the electric wire10and the surrounding area in the terminal fitting20. The water seal member30is formed by curing this curable resin material (FIGS.1,2,4, and5). To cover the electric wires10exposed through the openings25aand26a(the distal end12bof the sheath end portion12aand the distal end and the rear end11bof the core-wire uncovered portion11a), the curable liquid resin material is applied to the openings25aand26a, the pair of core-wire crimping sections23,23, and the pair of sheath crimping sections24,24. In the terminal-equipped electric wire1, the curling of the curling part12cin the distal end12bof the sheath end portion12ais suppressed to a small degree, as described above. Accordingly, as compared to a conventional configuration in which the curling of the distal end of the sheath end portion is not suppressed (FIG.7), the terminal-equipped electric wire1allows the curable liquid resin material applied to the distal end12bof the sheath end portion12athrough the opening25ato remain on the distal end12bof the sheath end portion12awith its thickness maintained. The terminal-equipped electric wire1also allows the curable liquid resin material to be cured on the distal end12bof the sheath end portion12awith its thickness maintained (except for the shrinkage due to curing). Consequently, as compared to the water seal member of a conventional terminal-equipped electric wire, the cured water seal member30has a smaller difference in thickness between the section that covers the distal end12bof the sheath end portion12aand the other section. The entire water seal member30is therefore sufficiently thick. For example, this significantly reduces the factors of a decrease in durability, which would occur at the curling part in the distal end of the sheath end portion of a conventional water seal member due to the influence of atmospheric pressure variation. Accordingly, the terminal-equipped electric wire1of the present embodiment has improved durability of the water seal member30as compared with a conventional configuration, so that it is possible to obtain anticorrosion performance with high durability. For example, the terminal-equipped electric wire1is particularly useful when the core wire11and the terminal fitting20are made of metal materials with different ionization tendencies, such as when the strands13are made of aluminum or an aluminum alloy and the terminal fitting20is made of copper or a copper alloy, and effectively suppresses an occurrence of galvanic corrosion. InFIG.7, for convenience of illustration, the same reference numerals as those of the terminal-equipped electric wire1of the present embodiment are used. With a conventional terminal-equipped electric wire, to form a water seal member with a suitable thickness on the curling part in the distal end of the sheath end portion, some techniques need to be devised in applying a curable resin material, such as increasing the amount of the curable liquid resin material applied to the distal end of the sheath end portion. In contrast, with the terminal-equipped electric wire1of the present embodiment, by simply applying a constant amount of curable liquid resin material while moving the nozzle N at a fixed speed from the pair of sheath crimping sections24,24to the opening26a, for example, the water seal member30with a suitable thickness is formed with an insignificant difference between the section on the distal end12bof the sheath end portion12aand the other section. The terminal-equipped electric wire1thus simplifies the application process of the curable resin material. Furthermore, since the terminal-equipped electric wire1of the present embodiment suppresses the curling of the curling part12cin the distal end12bof the sheath end portion12ato a small degree as compared to a conventional configuration, it is easier to predict how the curable liquid resin material applied through the opening25aflows and how the flowing ends. The terminal-equipped electric wire1thus simplifies the application process of the curable resin material also in this respect. Moreover, since the terminal-equipped electric wire1of the present embodiment suppresses the curling of the curling part12cin the distal end12bof the sheath end portion12ato a small degree, the load applied by the pair of sheath crimping sections24,24to the distal end12bof the sheath end portion12ais reduced during and after crimping. Accordingly, the distal end12bis more likely to resist any damage inflicted by the pair of sheath crimping sections24,24. The sheath12of the terminal-equipped electric wire1thus has improved durability at the distal end12bof the sheath end portion12a. In addition, since the terminal-equipped electric wire1of the present embodiment suppresses the curling of the curling part12cin the distal end12bof the sheath end portion12ato a small degree, the specified range of appropriate crimp height of the pair of sheath crimping sections24,24and the base wall22after crimping can be increased. In the terminal-equipped electric wire according to the present embodiment, a crimping force acts on the sheath end portion from the pair of sheath crimping sections and the base wall after crimping. As a result, a force acts on the distal end of the sheath end portion, which is supported by the base wall, in the directions opposite to the directions of the crimping force from the pair of sheath crimping sections. As such, the distal end of the sheath end portion curls outward in the directions of this opposite force. However, in this terminal-equipped electric wire, the recess in the base wall receives the sheath end portion, thereby suppressing the curling of the curling part in the distal end of the sheath end portion to a small degree. Accordingly, as compared to a conventional configuration in which the curling of the distal end of the sheath end portion is not suppressed, the terminal-equipped electric wire allows the curable liquid resin material applied to the distal end of the sheath end portion through an opening to remain on the distal end of the sheath end portion with its thickness maintained. The terminal-equipped electric wire also allows the curable liquid resin material to be cured on the distal end of the sheath end portion with its thickness maintained. Consequently, as compared to the water seal member of a conventional terminal-equipped electric wire, the cured water seal member has a smaller difference in thickness between the section that covers the distal end of the sheath end portion and the other section. For example, the entire water seal member is therefore sufficiently thick. This significantly reduces the factors of a decrease in durability, which would occur at the curling part in the distal end of the sheath end portion of a conventional water seal member due to the influence of atmospheric pressure variation. Accordingly, the terminal-equipped electric wire of the present embodiment has improved durability of a water seal member as compared with a conventional configuration, so that it is possible to obtain anticorrosion performance with high durability. Although the invention has been described with respect to specific embodiments for a complete and clear disclosure, the appended claims are not to be thus limited but are to be construed as embodying all modifications and alternative constructions that may occur to one skilled in the art that fairly fall within the basic teaching herein set forth. | 24,523 |
11862917 | DETAILED DESCRIPTION FIG.1shows a crimp connector1having an elongate, U-shaped body2which at a lower end has a fastening portion3by means of which the crimp connector1can be fastened to a further body at its place of use. The fastening portion3here takes the form of a latching mechanism. On the side of the crimp connector1that faces away from the fastening portion3, the crimp connector1has a clamping portion4which has a first clamping plate5and a second clamping plate6. The first clamping plate5is connected to the body2. At the end of the first clamping plate5facing away from the body2, the first clamping plate5is connected to the second clamping plate6via a bending portion7and thus forms a U-shaped configuration. The first clamping plate5, the second clamping plate6and the bending portion7, which connects the first clamping plate5and the second clamping plate6, are formed in one piece. The second clamping plate6forms the free end of the clamping portion4. The second clamping plate6is pivotable with respect to the first clamping plate5, with the pivot axis8running through the bending portion7. As a result, the second clamping plate6can be pivoted against the first clamping plate5about the pivot axis8of the bending portion7, which is indicated by a curved arrow9. The fastening portion3has an elastic latching element10having a curved end portion for quickly fastening the crimp connector1at its place of use. FIG.2shows the clamping portion4of the crimp connector1fromFIG.1. In addition,FIG.2shows a wire11made of a shape memory alloy (SMA) that is indicated by dashed lines. In order to clamp the wire between the first clamping plate5and the second clamping plate6and to fasten it to the crimp connector, the first clamping plate5and the second clamping plate6are pivoted against one another in the pivoting direction9and a clamping state is produced in which the wire11is clamped between the clamping plates5and6. To fix the wire11, the first clamping plate5and the second clamping plate6have structured inner surfaces which face one another in the clamping state and which serve as clamping surfaces. The inner surface12of the first clamping plate5has a plurality of elongate depressions13,14,15and16. The elongate depressions13to16each extend perpendicularly to the pivot axis8, that is to say in the Y direction. The depressions of the first clamping plate5comprise two outer depressions13and16distributed along the pivot axis8(in the X direction) and two inner depressions14and15which are arranged between the outer depressions13and16. The depressions13to16of the first clamping plate5that are arranged next to one another are arranged at a distance from one another such that adjacent depressions form ribs between them. A first rib17is formed between the outer depression13and the adjacent inner depression14. A second rib18is formed between the outer depression16and the adjacent inner depression15. A third rib19is formed between the inner depressions14and15. The inner surface20of the second clamping plate6has a surface structure corresponding to the depressions and ribs of the inner surface12of the first clamping plate5. The inner surface20comprises a first outer depression21and a second outer depression22, and also an inner depression23situated between the outer depressions21and22. The depressions21to23of the second clamping plate6are arranged in such a way that, in the clamping state, that is to say when the first and the second clamping plates5and6are pivoted against one another and the inner surfaces12,20are situated opposite one another, the depression21of the second clamping plate6receives the rib17of the first clamping plate5, the depression23of the second clamping plate6receives the rib19of the first clamping plate5, and the depression22of the second clamping plate6receives the rib18of the first clamping plate5. The second clamping plate6forms a rib24between the depressions21and23. The second clamping plate6forms a further rib25between the depressions22and23. In addition, the second clamping plate6also forms outer ribs26and27. The ribs24to27of the second clamping plate6are arranged in such a way that they are arranged in the depressions13to16of the first clamping plate5in the clamping state. The ribs17,18and19of the first clamping plate5are received in the depressions21,22and23of the second clamping plate6. At the first and second ends of the clamping plates5and6in the X direction, the inner surfaces12and20of the first and second clamping plates5and6are provided with oblique edges28and29. The oblique edges29,29of the second clamping plate6are connected to the respective adjacent ribs26,27via an elongate depression or via a portion which extends along the respective rib26,27and which has a lower profile height with respect to the adjacent rib26,27and flattens off in the direction of the respective edge29,29. That is to say that the outer ribs are each formed by the depressions21,22and by the flattening-off portion which is formed between the outermost rib26,27and the respective adjacent oblique edge29,29and has a smaller profile height than the respective rib26,27. To produce the clamping state, the wire11is placed on the inner surface12of the first clamping plate5or the inner surface20of the second clamping plate6. The clamping state is then produced by pivoting the first clamping plate5and the second clamping plate6together, with the ribs of the inner surfaces engaging in the manner described above in the depressions of the respective other inner surface and forming, between the clamping plates folded onto one another, a meandering passage which extends in the X direction. The wire is deformed by the clamping plates being pivoted together and likewise assumes a meandering shape. In the side view, that is to say when looking at the X-Z plane, the wire forms a number of waves. FIG.3once again shows the clamping portion4of the crimp connector fromFIG.2. In the first clamping plate5, the outer depression13and the adjacent inner depression14and also the other outer depression16and the inner depression15adjacent thereto are arranged at a distance d1in the X direction. The two inner depressions14and15are arranged at a distance d2in the X direction. The distance d2is less than the distance d1. Thus, the distance between adjacent depressions in the first clamping plate5varies along the clamping surface12on a straight line parallel to the pivot axis8. Since the inner surface20of the second clamping plate6approximately constitutes a negative shape of the inner surface12of the first clamping plate5at least in certain portions, a corresponding nonuniform distribution of the depressions and ribs can be found here. The distance c1between the rib26and the rib24, and also the distance c1between the rib27and rib25, is greater than the distance c2between the two inner ribs24and25. This has the result that, in the second clamping plate6, too, the distance between adjacent depressions varies along the clamping surface20on a straight line parallel to the pivot axis8. In the first clamping plate5, the distance between adjacent depressions decreases starting from the marginal regions of the first clamping plate5that are situated in the X direction in the direction of a center30of the first clamping5that is situated in the X direction, which means that the distance between adjacent inner depressions is less than the distance between the outer depressions and the adjacent inner depressions. Starting from the center30in the first clamping plate5, the inner depressions14and15and also the outer depressions13and16are symmetrically distributed in the direction of the marginal regions of the first clamping plate5. The bending portion7is formed in one piece with the first clamping plate5and the second clamping plate6. The bending portion7has a portion31of reduced interior thickness. This makes it easier for the second clamping plate6to be bent over onto the first clamping plate5. LIST OF REFERENCE SIGNS 1Crimp connector2Body3Fastening portion4Clamping portion5First clamping plate6Second clamping plate7Bending portion8Pivot axis9Pivoting direction10Latching element11SMA wire12Inner surface of the first clamping plate13Outer depression of the first clamping plate14Inner depression of the first clamping plate15inner depression of the first clamping plate16Outer depression of the first clamping plate17Rib18Rib19Rib20Inner surface of the second clamping plate21Outer depression of the second clamping plate22Outer depression of the second clamping plate23Inner depression of the second clamping plate24Rib25Rib26Rib27Rib28Oblique edge29Oblique edge30Center31Portion of reduced material thickness | 8,725 |
11862918 | DESCRIPTION OF EMBODIMENTS Embodiments are described below with reference to the drawings. In the following description, identical components and identical constituent elements are given respective identical reference signs. Such components and constituent elements are also identical in name and function. Thus, a specific description of those components and constituent elements is not repeated. Terminal1 FIG.1is a perspective view of a terminal1in accordance with an embodiment of the present invention. The terminal1includes an electric wire provision section2, a terminal main body3, and an external electric wire attachment section4. On an upper part of the electric wire provision section2, electric wires10athrough10f(not illustrated) are to be provided. More specifically, the electric wire provision section2is a rectangular parallelepiped and has grooves5athrough5fon a main surface side of the electric wire provision section2. The electric wires10athrough10fare respectively provided in the grooves5athrough5f.This allows the electric wires10athrough10fto be provided stably on the electric wire provision section2. The terminal main body3has a tapered part6and a plurality of insertion holes7athrough7f.More specifically, the terminal main body3is a rectangular parallelepiped. The terminal main body3has a groove on its main surface side, and the groove has a linear taper shape and extends throughout a length of a main surface of the terminal main body3. The groove is hereinafter referred to as a “tapered part6”. The tapered part6has one opening of each of the plurality of insertion holes7athrough7f.Details of the tapered part6will be described with reference toFIG.2. The electric wires10athrough10fare respectively inserted into the insertion holes7athrough7f.Each size of the insertion holes7athrough7fcan be determined in accordance with a diameter of a corresponding one of the electric wires10. The insertion holes7athrough7feach have a diameter φ of, for example, 1.6 mm. The external electric wire attachment section4is provided so that an external electric wire (not illustrated) is electrically connected to the terminal1. The electric wire10is electrically connected to the external electric wire via the external electric wire attachment section4. The terminal1is not limited to the above configuration, and can be configured in various manners as described below. More specifically, the electric wire provision section2, the terminal main body3, and the external electric wire attachment section4can be formed integrally. In this case, the electric wire provision section2, the terminal main body3, and the external electric wire attachment section4can be integrally formed with use of, for example, a tinned copper material. The number of insertion holes provided at the tapered part6only needs to be one or more, and is not therefore limited to a specific number. The terminal1does not necessarily need to include the electric wire provision section2. The electric wire provision section2does not necessarily need to have the grooves5athrough5fon its main surface side. The external electric wire attachment section4can be provided at any position of the terminal1. The electric wire provision section2and the terminal main body3are not limited to a rectangular parallelepiped shape, and can have other shapes. The electric wire10can be a covered wire or a bare wire. The following description will discuss the tapered part6, with reference toFIG.2.FIG.2is a cross-sectional view schematically illustrating how the terminal1and the electric wire10inserted into the terminal1are joined by thermal spraying. The electric wire provision section2is located (though not illustrated) on a left side inFIG.2, and the electric wire10passes through an insertion hole rightward inFIG.2. As described above, the terminal main body3has the tapered part6. The tapered part6has a width which gradually increases in a direction in which the electric wire10passes through an insertion hole7(rightward inFIG.2). A taper angle is set to 30°, 45°, or the like with respect to the direction in which the electric wire10passes through the insertion hole. Note, however, that the taper angle is not limited to a specific angle. It is preferable that a tip part of the electric wire10be flush with or substantially flush with the main surface of the terminal main body3which has the tapered part6. Note, however, that the present embodiment is not limited to such a configuration. As illustrated inFIG.2, in a state where the electric wire10has passed through the insertion hole7, a spray material20a,which is electrically conducive, is sprayed onto the tapered part6. The spray material20ais accumulated, so that a film of the spray material20ais formed. The film is hereinafter referred to as a “joining part20”. A thermal spray method employed in an embodiment of the present invention can be a well-known thermal spray method. The spray material can also be a well-known spray material. With reference toFIG.2, the following discusses a case in which (i) the electric wire10is a covered wire and (ii) a tip part of the electric wire10is flush with or substantially flush with the main surface of the terminal main body3which has the tapered part6. The joining part20is secured in the tapered part6, by the spray material20abeing sprayed onto the tapered part6in a state where the electric wire10has passed through the insertion hole7. As illustrated inFIG.2, the tip part, in which a conductor is exposed, of the electric wire10is embedded in the joining part20. This allows the conductor of the electric wire10and the terminal main body3to be electrically connected to each other via the joining part20. Note that in a case where the electric wire10is a bare wire, the electric wire10is not covered. As such, a tip section of the electric wire10does not need to be embedded in the joining part20in order for a conductor of the electric wire10and the terminal main body3to be electrically connected to each other. Accordingly, in a case where the electric wire10is a bare wire, an amount of the spray material20a,necessary in order to cause the electric wire10and the terminal1to be electrically connected to each other, is smaller than that in a case in which the electric wire10is a covered wire. FIG.3is a perspective view of an electric wire joining structure80in accordance with an embodiment of the present invention. The electric wire joining structure80includes the terminal1and the electric wires10athrough10f.The terminal1is joined to the electric wires10athrough10fby thermal spraying. More specifically, the joining part20is located in the tapered part6of the terminal main body3. The tip parts of the respective electric wires10athrough10fare embedded inside the joining part20. This allows the conductor, located in the tip part of each of the electric wires10athrough10f,to be electrically connected to the terminal main body3via the joining part20. Note that the electric wire joining structure80is described as including the plurality of electric wires10athrough10f,but it is only necessary that the number of electric wires of the electric wire joining structure80be one or more. The electric wire joining structure80can be used in a power device through which a large electric current flows. For example, the electric wire joining structure80can be used in an electric car, a hybrid car, inverter control, various general-purpose motors, or the like. This also applies to an electric wire joining structure90which will be described later. Terminal30 With reference toFIG.4, the following description will discuss a terminal30in accordance with another embodiment of the present invention.FIG.4is a perspective view of the terminal30. The terminal30includes an electric wire provision section32, a terminal main body33, and an external electric wire attachment section34. The electric wire provision section32can be the same as the electric wire provision section2of the terminal1. The external electric wire attachment section34can be the same as the external electric wire attachment section4of the terminal1. Accordingly, descriptions of the electric wire provision section32and the external electric wire attachment section34will be omitted in the following description. The terminal main body33includes a plurality of insertion holes37athrough37f.The terminal main body33is a rectangular parallelepiped. Unlike the terminal1, the terminal main body33of the terminal30does not include a tapered part. The plurality of insertion holes37athrough37fpass from a first main surface, which is in contact with the electric wire provision section32, through to a second main surface, which is opposite to the first main surface. The terminal30can be realized by the following various configurations as described below. More specifically, the electric wire provision section32, the terminal main body33, and the external electric wire attachment section34can be formed integrally. In this case, the electric wire provision section32, the terminal main body33, and the external electric wire attachment section34are integrally formed with use of, for example, a tinned copper material. The terminal30does not necessarily need to include the electric wire provision section32. The electric wire provision section32does not necessarily need to include the grooves35athrough35fon one main surface of the electric wire provision section32. The external electric wire attachment section34can be provided at any place of the terminal30. The electric wire provision section32and the terminal main body33are not limited to a rectangular parallelepiped shape, and can therefore have other shapes. The electric wire10can be a covered wire or a bare wire. The following description discusses, with reference toFIG.5, a method for joining the terminal30and the electric wire10.FIG.5is a perspective view of the electric wire joining structure90in accordance with an embodiment of the present invention. The electric wire joining structure90includes the terminal30and the electric wires10athrough10f.The terminal30is joined to the electric wires10athrough10fby thermal spraying. More specifically, the following discusses a case in which (i) the electric wire10is a covered wire and (ii) a tip part of the electric wire10is flush with or substantially flush with the second main surface. As illustrated inFIG.5, the joining part20is provided on the second main surface of the terminal main body3. The tip parts of the respective electric wires10athrough10fare embedded inside the joining part20. This allows the conductor in the tip part of each of the electric wires10athrough10fto be electrically connected to the terminal main body33via the joining part20. Note that although the electric wire joining structure90includes the electric wires10athrough10fin the above description, it is only necessary that the number of electric wires of the electric wire joining structure90be one or more. Terminal40and terminal50 With reference toFIG.6, the following description will discuss a terminal main body43of a terminal40in accordance with still another embodiment of the present invention.FIG.6is a cross-sectional view schematically illustrating the terminal main body43. The following description will also discuss, with reference toFIG.7, a terminal main body53of a terminal50in accordance with still another embodiment of the present invention.FIG.7is a cross-sectional view schematically illustrating the terminal main body53. In general, the term “taper/tapered” means becoming gradually enlarged in diameter from the bottom up. Types of “taper” encompass linear taper, exponential taper, parabolic taper, inverse taper, and the like. The terminal main body43illustrated inFIG.6includes a tapered part46having a circular shape. The terminal main body53illustrated inFIG.7includes a tapered part57having an inverse taper shape. A tapered part can thus have various shapes. Further, a tapered part of an embodiment of the present invention is not limited to a configuration in which opposite surfaces of a taper shape of the tapered part are inclined symmetrically. Alternatively, such a tapered part can be configured so that the opposite surfaces are inclined asymmetrically. Formation of Joining Part20by Cold Spraying Among well-known thermal spray methods, for example, the following methods are known: warm spraying, aerosol deposition, free jet PVD, flame spraying, wire flame spraying, powder flame spraying, wire/rod flam spraying, high velocity flame spraying, detonation spraying, electrical spraying, arc spraying, plasma spraying, wire explosion spraying, and cold spraying. The following description will discuss, as an example, a method of forming the joining part20by use of the cold spraying. In recent years, a film forming method, that is called “cold spraying,” has been used. The cold spraying is a method for (i) causing a carrier gas, whose temperature is lower than a melting point or a softening temperature of a film material, to flow at a high speed, (ii) introducing the film material into the flow of the carrier gas so as to increase the speed of the carrier gas into which the film material has been introduced, and (iii) causing the film material to collide with, for example, a base material at a high speed while the film material is in a solid phase so as to form a film. A principle of film formation by use of the cold spraying is understood as below. A collision speed of not less than a certain critical value is required for a film material to adhere to and accumulate on a base material so as to form a film on the film material. Such a collision speed is hereinafter referred to as a critical speed. In a case where the film material collides with the base material at a speed that is lower than the critical speed, the base material is worn, so that small crater-shaped cavities are merely formed in the substrate. The critical speed is changed in accordance with, for example, a material, a size, a shape, a temperature, and/or an oxygen content of the film material, or a material of the base material. In a case where the film material collides with the base material at a speed that is not less than the critical speed, plastic deformation caused by a great shearing force occurs near an interface between the film material and the base material (or the film which has already been formed). The plastic deformation and generation of a great shock wave in a solid due to the collision cause an increase in temperature near the interface, and in this process, solid phase bonding occurs (i) between the film material and the base material and (ii) between the film material and the film (or the film material which has already adhered to the base material). Cold Spray Device100 FIG.8is a view schematically illustrating a cold spray device100. As illustrated inFIG.8, the cold spray device100includes a tank110, a heater120, a spray nozzle160, a feeder140, a base material holder150, and a control device (not illustrated). The tank110stores therein a carrier gas. The carrier gas is supplied from the tank110to the heater120. Examples of the carrier gas include nitrogen, helium, air, and a mixed gas of nitrogen, helium, and air. A pressure of the carrier gas is adjusted so that the pressure of the carrier gas at the exit of the tank110is, for example, not less than 70 PSI and not more than 150 PSI (not less than approximately 0.48 Mpa and not more than approximately 1.03 Mpa). Note, however, that the pressure of the carrier gas at the exit of the tank110does not necessarily need to fall within the above range, and such pressure is appropriately adjusted in accordance with, for example, material(s) and/or a size of a film material, or material(s) of a base material. The heater120heats the carrier gas which has been supplied from the tank110. More specifically, the carrier gas is heated to a temperature that is lower than a melting point of the film material which is supplied from the feeder140to the spray nozzle160. For example, the carrier gas is heated so that the temperature of the carrier gas at an exit of the heater120falls within the range of not less than 50° C. and not more than 500° C. Note, however, that a heating temperature of the carrier gas at the exit of the heater120does not necessarily need to fall within the above range, and is appropriately adjusted in accordance with, for example, the material(s) and/or the size of the film material, or the material(s) of the base material. The carrier gas is heated by the heater120and is then supplied to the spray nozzle160. The spray nozzle160(i) accelerates a speed of the carrier gas, which has been heated by the heater120, so that the speed falls within the range of not less than 300 m/s and not more than 1200 m/s, and then (ii) sprays the carrier gas therethrough onto a base material170(the terminal main body3or the terminal main body33). Note, however, that the speed of the carrier gas does not necessarily need to fall within the above range, and is appropriately adjusted in accordance with, for example, the material(s) and/or the size of the film material, or the material(s) of the base material. The feeder140supplies the film material to the flow of the carrier gas whose speed is accelerated by the spray nozzle160. The film material which is supplied from the feeder140has a particle size of, for example, not less than 1 μm and not more than 50 μm. Together with the carrier gas, the film material which has been supplied from the feeder140is sprayed through the spray nozzle160onto the base material170. The base material holder150fixes the base material170. Onto the base material170which has been fixed by the base material holder150, the carrier gas and the film material are sprayed, through the spray nozzle160. A distance between a surface of the base material170and a tip of the spray nozzle160is adjusted so that the distance falls within the range of, for example, not less than 1 mm and not more than 30 mm. In a case where the distance between the surface of the base material170and the tip of the spray nozzle160is less than 1 mm, a spraying speed at which the film material is sprayed is decreased. This is because the carrier gas, sprayed from the spray nozzle160, flows back into the spray nozzle160. During the flowing back, a pressure, generated when the carrier gas flows back, can cause a member (e.g., a hose) connected to the spray nozzle160to be detached from the spray nozzle160. Note, however, that in a case where the distance between the surface of the base material170and the tip of the spray nozzle160is more than 30 mm, efficiency in film formation is decreased. This is because it becomes more difficult for the carrier gas and the film material, which have been sprayed from the spray nozzle160, to reach the base material170. Note, however, that the distance between the surface of the base material170and the tip of the spray nozzle160does not necessarily need to fall within the above range, and is therefore appropriately adjusted in accordance with, for example, the material(s) and/or the size of the film material, or the material(s) of the base material. The control device controls the cold spray device100in accordance with information stored therein in advance and/or an input by an operator. More specifically, the control device controls, for example, (i) the pressure of the carrier gas which is supplied from the tank110to the heater120, (ii) the temperature of the carrier gas which is heated by the heater120, (iii) a kind and an amount of the film material which is supplied from the feeder140, and (iv) the distance between the surface of the base material170and the spray nozzle160. In an embodiment of the present invention, the film material is sprayed onto the base material170by use of the cold spraying. The cold spray device100may use a well-known spray material in order to perform the cold spraying. For example, a mixed material of tin powder and zinc powder can be used as a spray material. With use of the cold spray device100in this manner, a joining part20, which joins an electric wire and a terminal, can be provided on a side on which the electric wire has passed through an insertion hole. Note that the use of the cold spray device100allows enjoying advantages of cold spraying. The cold spraying brings about, for example, the following advantages: (1) prevention of oxidization of a film, (2) prevention of a change in quality of a film by heat, (3) formation of a dense film, (4) prevention of generation of fumes, (5) minimum masking, (6) film formation achieved by a simple device, and (7) formation of a thick metal film achieved in a short period of time. Electric Wire Joining Method The following description will discuss an electric wire joining method, with reference toFIGS.1and9.FIG.9is a flowchart of an electric wire joining method in accordance with an embodiment of the present invention. First, the electric wires10athrough10fare inserted into the insertion holes7athrough7fformed in the terminal1(S10). Subsequently, a spray material is sprayed onto the terminal1(more specifically, the tapered section6of the terminal main body3) and the electric wires10athrough10f,on the side on which the electric wires10athrough10fhave passed through the respective insertion holes7athrough7f(S20). Then, the electric wires10athrough10fare joined to the terminal1(more specifically, onto the tapered section6of the terminal main body3) (S30). The electric wire joining structure80is obtained by S10through S30thus proceeded with. Similarly, the electric wire joining structure90is obtained by S10through S30being proceeded with. Tapered Part The following description will discuss effects which are brought about by the terminal1including the tapered part6. As described above, the terminal main body3of the terminal1includes the tapered part6having a linear shape. The structure of the terminal main body3is hereinafter referred to as a “V-shaped structure”. In contrast, the terminal main body33of the terminal30does not have any tapered part. The structure of the terminal main body33is hereinafter referred to as a “flat structure”. The following description will discuss comparison between the V-shaped structure and the flat structure, in terms of (1) amount of a spray material adhering and (2) tensile strength of an electric wire. A spray material was sprayed, in a certain amount, onto the terminal main body3having the V-shaped structure (cone angle: 45°). The spray material was also sprayed, in the above certain amount, onto the terminal main body33having the flat structure. Then, a comparison was made between the V-shaped structure and the flat structure in terms of both (1) amount of the spray material adhering and (2) tensile strength of an electric wire. (1) Amount of Spray Material Adhering According to the comparison between the V-shaped structure and the flat structure, the V-shaped structure had approximately 1.7 times more spray material adhered than the flat structure. This is because the spray material, sprayed onto the tapered part6, is (i) less likely to leak out of the tapered part6and (ii) therefore more likely to adhere to the tapered part6. (2) Tensile Strength of Electric Wire According to the comparison between the V-shaped structure and the flat structure, the V-shaped structure exhibited approximately 2.1 times greater tensile strength of an electric wire than the flat structure. This is because, in the V-shaped structure, (i) the spray material easily accumulates on the tapered part6, so that an area of contact between the spray material and the electric wire10is increased and (ii) the electric wire10and the tapered part6are therefore tightly joined together. Note that the above results of (1) and (2) are brought by cold spraying in which the spray material used was mixed powder of tin and zinc. However, also in a case where the spray material used was a different spray material, similar results are brought about due to a structural difference between the V-shaped structure and the flat structure. Further, the V-shaped structure is more advantageous than the flat structure when compared in terms of the viewpoints (1) and (2). It should be noted, however, that the flat structure itself is also encompassed in an embodiment of the present invention. Joining Electric Wire and Terminal by Thermal Spraying The following advantages are brought about by joining an electric wire and a terminal by a thermal spray method. As described above, the caulking has been widely known as a technique for joining an electric wire and a terminal. Since the caulking is performed manually, one joint at a time, a burden on an operator increases as the number of joints of an electric wire and a terminal to be made increases. In contrast, in a case of joining an electric wire and a terminal by a thermal spray method, a thermal spraying device (e.g., the cold spray device100) can be used. In a case where a large number of electric wires need to be joined, the electric wires and the terminal can be joined all together (batch process). That is, in the case where a large number of electric wires need to be joined, a reduction in burden on an operator is significant. When taking the terminal1for instance, a single joining part20can be provided for all of the insertion holes7athrough7fin a case where the insertion holes7athrough7f,formed in the terminal main body3, are arranged at short intervals. In a case where the insertion holes7athrough7fin the terminal main body3are arranged at long intervals, a plurality of joining parts are provided for the respective insertion holes7athrough7fso as to reduce an amount of the spray material to be used. Thus, in a case of joining of an electric wire and a terminal by thermal spraying, it is possible to carry out flexible spraying in accordance with a structure of the terminal. Further, a terminal in accordance with an embodiment of the present invention has electrical conductivity. This causes the electric wire10and an external wire to be electrically connected to each other via a spray material. The spray material may be a metal, a ceramic, a composite material (cermet) of a metal and a ceramic, or a resin each of which has electrical conductivity. In a case where a ceramic is employed as the spray material, the joining part20improves in durability. In a case where a resin is employed as the spray material, the joining part20can realize its weight saving. By thus changing the spray material, it is possible to enjoy advantages of respective spray materials. Note that the joining part20can be formed by a method other than the thermal spraying. The joining part20can be formed by soldering. Alternatively, the joining part20can be formed with use of electrically conducive paste. Aspects of the present invention can also be expressed as follows: An electric wire joining structure in accordance with Aspect 1 of the present invention is an electric wire joining structure, including: one or more electric wires; a terminal including one or more insertion holes for the respective one or more electric wires, the one or more electric wires being inserted into the respective insertion holes; and a joining part formed by thermal spraying, the joining part joining the one or more electric wires to the terminal on a side on which the one or more electric wires have passed through the respective one or more insertion holes. Caulking has been widely known as a technique for joining an electric wire and a terminal. Caulking requires manual operation. As such, in a case where caulking is adopted, a burden on an operator increases as the number of electric wires to be joined increases. In contrast, with the above configuration, the one or more electric wires are joined to the terminal by the joining part as a result of thermal spraying. Thermal spraying may be carried out with use of a conventional thermal spraying device. As such, with the above configuration, it is possible to reduce a burden on an operator. This effect is exhibited to a greater extent as the number of electric wires to be joined increases. In Aspect 2 of the present invention, the electric wire joining structure in accordance with Aspect 1 above may be configured such that: the terminal has a tapered part on the side of the terminal on which side the one or more electric wires have passed through the respective one or more insertion holes; the tapered part has the one or more insertion holes; and the joining part joins the one or more electric wires to the terminal in the tapered part. With the above configuration, it is possible to increase a tensile strength of the one or more electric wires. In Aspect 3 of the present invention, the electric wire joining structure in accordance with Aspect 1 or 2 above may be configured such that: each of the one or more electric wires is a covered wire; and the joining part joins an uncovered portion of a tip part of the each of the one or more electric wires to the terminal. With the above configuration, it is possible to electrically connect the one or more electric wires to the terminal even in a case where each of the one or more electric wires is a covered wire. In Aspect 4 of the present invention, the electric wire joining structure in accordance with any one of Aspects 1 through 3 above may be configured such that the joining part is a film formed by cold spraying. With the above configuration, it is possible to both (i) reduce oxidization of the film and (ii) control the film to have a high density, as compared with other thermal spray methods (arc spraying, plasma spraying, or the like). An electric wire joining method in accordance with Aspect 5 of the present invention is an electric wire joining method, including the steps of: (a) inserting, into one or more insertion holes formed in a terminal, respective one or more electric wires; and (b) joining, by thermal spraying, the one or more electric wires to the terminal on a side on which the one or more electric wires have passed through the respective one or more insertion holes. According to the configuration, an effect similar to that of the electric wire joining structure is brought about. In Aspect 6 of the present invention, the electric wire joining method in accordance with Aspect 5 above may be configured such that: the terminal has a tapered part on the side on which the one or more electric wires have passed through the respective one or more insertion holes; and the one or more insertion holes are formed in the tapered part. With the configuration, an effect similar to that of the electric wire joining structure is brought about. In Aspect 7 of the present invention, the electric wire joining method in accordance with Aspect 5 or 6 above may be configured such that in the step (b), the one or more electric wires are joined to the terminal by cold spraying. With the configuration, an effect similar to that of the electric wire joining structure is brought about. In Aspect 8 of the present invention, the electric wire joining method in accordance with Aspect 7 above may be configured such that in a case where (i) the one or more insertion holes are a plurality of insertion holes and (ii) the one or more electric wires are a plurality of electric wires, in the step (b) the plurality of electric wires are joined to the terminal all together. With the above configuration, it is possible to further reduce a burden required in joining the one or more electric wires to the terminal. A terminal in accordance with Aspect 9 of the present invention is a terminal to be joined to one or more electric wires, including: a terminal main body having one or more insertion holes into which the respective one or more electric wires are to be inserted, the terminal main body including a tapered part, the one or more insertion holes being formed in the tapered part. With the configuration, an effect similar to that of the electric wire joining structure is brought about. The terminal in accordance with Aspect 9 of the present invention is configured such that the terminal further includes: an electric wire provision section connected to the terminal main body, the electric wire provision section including one or more grooves in which the respective one or more electric wires are to be provided. With the configuration, the one or more electric wires are provided stably on the electric wire provision section. This allows stabilizing the position of each of the one or more electric wires in occasions such as when the one or more electric wires are subjected to thermal spraying or when the above electric wire joining structure is used. The present invention is not limited to the embodiments, but can be altered by a skilled person in the art within the scope of the claims. The present invention also encompasses, in its technical scope, any embodiment derived by combining technical means disclosed in differing embodiments. Reference Signs List 1,30,40,50: terminal2,32: electric wire provision section3,33,43,53: terminal main body4,34: external electric wire attachment section6,46,57: tapered part7,7a,7f,37a,37f:insertion hole10,10a,10f:electric wire20: joining part20a:spray material80,90: electric wire joining structure100: cold spray device110: tank120: heater140: feeder150: base material holder160: spray nozzle170: base material | 33,652 |
11862919 | DETAILED DESCRIPTION OF THE EMBODIMENTS Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein the like reference numerals refer to the like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the concept of the disclosure to those skilled in the art. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing. According to embodiments of the present disclosure, a system for separating a terminal (e.g., an electrical terminal) from a terminal strip comprising a plurality of terminals during a crimping operation is provided. The system includes a movable terminal shear or shear tool for receiving a terminal of the terminal strip. The shear tool is driven (e.g., downwardly) by a primary shear depressor from an initial position to an intermediate position for shearing the terminal from the strip. The primary depressor may be fixedly mounted to an applicator ram or crimping actuator which performs the crimping operation of the terminal after it has been separated. A secondary shear depressor according to embodiments of the present disclosure is movably mounted to the primary shear depressor. After the terminal has been sheared from the terminal strip and the primary depressor has reached the end of its travel, the secondary shear depressor is operative to drive the terminal shear further downwardly from the intermediate position and out of an extrusion space into which the crimped terminal may extend during crimping. The operation of the secondary shear depressor may be passive in nature, acting in an automatic manner without the need for additional operator and/or control system input. Embodiments of the present disclosure will be described in more detail in the context of an exemplary simplified system or terminal applicator for crimping an electrical terminal to a conductor. Specifically, referring toFIGS.1-3, a terminal applicator10for performing terminating or crimping operations is configured to feed a terminal strip17comprising a plurality of interconnected terminals16into a crimping position in which a free end of a conductive wire or cable will be fixed thereto. The applicator10includes a movable crimping die12and an opposing stationary crimping die13between which the terminal16is arranged in the crimping position. The crimping die12is fixedly connected to a movable end of an applicator ram or crimping actuator18. As shown, the applicator ram18may include, for example, one or more pneumatic or hydraulic cylinders or a motor-driven mechanism for selectively moving the crimping die12in the vertical direction(s) during crimping operations. As set forth above, a passive terminal shear or shear tool14is provided for cutting or separating the terminal16from a remainder of the terminal strip or tape17prior to, but in conjunction with, the crimping process. Specifically, the exemplary terminal shear14includes a body having a slotted opening19formed therethrough and defining a shearing blade or edge. The opening19receives the terminal strip17therein in a direction normal to the moving directions (e.g., the vertical directions) of the terminal shear14, as shown inFIG.1. With the terminal16inserted within the terminal shear14, extension of the applicator ram18in the downward direction is operative to bias the terminal shear downwardly via contact with a main depressor15for shearing the individual terminal16from the terminal strip17. The terminal shear14may be movably or floatably mounted to the applicator10, and more specifically, to a frame22thereof. In one embodiment, the terminal shear14is elastically mounted relative to the fixed frame22so as to resiliently return from a final post-shearing position to the initial position shown inFIG.1after shearing and crimping operations have been performed. More specifically, the shear14may be biased in a vertically-upward direction by one or more elastic elements, such as one or more springs21, as shown inFIG.3. It should be understood, however, that the terminal shear14may be floatable mounted and/or elastically biased by other arrangements, including spring elements positioned in any suitable location without departing from the scope of the present disclosure. Embodiments of the present disclosure include a two-stage depressor for engaging with the terminal shear14for performing an improved shearing operation. In particular, the terminal shear depressor includes the main or first stage shear depressor15. The first stage shear depressor15may take the form of a rigid cylinder, by way of example only. In the exemplary embodiment, the main stage shear depressor15is fixedly attached to the movable end of the applicator ram18. As set forth above, the first stage shear depressor15is operative to engage with and apply a downward force on the terminal shear14for performing the shearing operation as the crimping die12is moved downwardly toward the terminal16. As described above, and as would be understood by one of ordinary skill in the art, during the crimping process, the terminal16may be subject to lengthening or extrusion via plastic deformation. This may result in the terminal16making contact with the terminal shear14which is arranged immediately adjacent thereto after the shearing operation. Embodiments of the present disclosure provide a means to ensure the terminal shear14does not interfere with or contact the terminal16as a result of its extrusion during crimping. In particular, a second stage depressor or passive shear depressor20according to the present disclosure is provided and includes a movable plunger or piston arranged on and/or within an end of the first stage shear depressor15. In the exemplary embodiment, the second stage shear depressor20may take the form of a cylindrical element. Of course, other shapes of both the first and second stage depressors15,20are envisioned without departing from the scope of the present disclosure. The second stage depressor20is movable between an extended position, as shown inFIGS.1-3and6, and a contracted position as shown inFIGS.4and5. As described herein, the second stage depressor20is operative to engage with and bias the terminal shear14from an intermediate, post-shear position after the terminal16has been sheared from the terminal strip17, into the final position and outside of an extrusion area of the terminal. In the exemplary embodiment, the base22defines a recess or opening24for receiving the terminal shear14as it is further downwardly biased during this second stage of movement. The second stage depressor20may be passively elastically biased into the extended position via an internal spring arranged within the first stage shear depressor15. As shown inFIG.7, the second stage depressor20may be coaxially aligned with the first stage shear depressor15and, along with an elastic element32(e.g., a coil spring), slidably arranged within a corresponding cylindrical opening30formed in the free end of the first stage shear depressor. While a spring-loaded second stage shear depressor20is shown and described, other means may be used to passively bias the second stage shear depressor into the extended position, such as fluid (e.g., air or hydraulic fluid). In other embodiments, the second stage depressor20may be actively controlled via, for example, one or more actuators in conjunction with solenoids and associated control/processing hardware and software, as would be understood by one of ordinary skill in the art. The operation of the two-stage shear depressor is shown inFIGS.4-6. Referring toFIG.4, the moving end of the applicator ram18has lowered the first stage shear depressor15into contact with the terminal shear14. In turn, the terminal shear14is biased into initial contact with the terminal16of the terminal strip17. The second stage depressor20is simultaneously biased into the contracted position within the opening formed in the end of the first stage shear depressor15. More specifically, the elastic force biasing the second stage depressor20into the extended position is selected so as to be less than the force required to shear the terminal16from the terminal strip17. In this way, the second stage depressor20is adapted to be passively biased into the contracted position prior to the shearing of the terminal16by the terminal shear14. As shown inFIGS.5and6, the shearing step is completed by continued downward force acting on the terminal shear14via the first stage shear depressor15. After the terminal16is sheared, the closing of the crimping dies12,13may cause the extrusion of the terminal16. More specifically, according to embodiments of the prior art, the terminal shear14may remain present in an extrusion path of the terminal16until completion of the crimping operation, after which the terminal shear14is permitted to return to its initial position. According to embodiments of the present disclosure, however, at the point which the terminal shear14just breaks through the strip17and disconnects the terminal16therefrom, the force resisting the extension of the second stage depressor20is released. The second stage depressor20is now free to extend from the end of the first stage shear depressor15under the biasing force of the spring, by way of example. As it extends, the second stage depressor20is operative to push or bias the terminal shear14from an intermediate position further vertically downward, and out of the extrusion area of the terminal16. As shown inFIG.6, in a lower or final position, the terminal shear14is arranged completely below the terminal16and/or the terminal strip17, preventing its interference with the extrusion or lengthening of the terminal16during subsequent crimping. It should be understood that the spring force or biasing force acting on the second stage depressor20is selected so as to be greater than a return force biasing the terminal shear14into its initial position, but less than that required to shear the terminal16. Accordingly, embodiments of the present disclosure add a second, low-force tool or actuator within the primary shear depressor which can rapidly actuate the terminal shear and remove it from an extrusion area or window of a terminal to be crimped. After the terminal shear has completed the severing of the terminal from the strip, there is little resistance to further downward motion. As such, the second, low force stroke will then accelerate the terminal shear downwardly and out of the extrusion window before significant extrusion can occur. The second stage depressor may be always-acting (e.g., via a spring or air pressure), but of a low enough extension force that it the terminal shear position is unaffected until shearing is complete. In this way, no actively-controlled motor or valve is needed, nor software to control its operation. It should be appreciated for those skilled in this art that the above embodiments are intended to be illustrated, and not restrictive. For example, many modifications may be made to the above embodiments by those skilled in this art, and various features described in different embodiments may be freely combined with each other without conflicting in configuration or principle. Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents. As used herein, an element recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural of said elements or steps, unless such exclusion is explicitly stated. Furthermore, references to “one embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments “comprising” or “having” an element or a plurality of elements having a particular property may include additional such elements not having that property. | 12,778 |
11862920 | DETAILED DESCRIPTION OF THE INVENTION FIG.1illustrates an electrical connector assembling machine100in accordance with an exemplary embodiment. The electrical connector assembling machine100is used for assembling electrical connectors102(further shown inFIGS.2-6). For example, the electrical connector assembling machine100is used for forming connector housings104from a connector strip110, which is a continuous extruded dielectric material connector strip. The electrical connector assembling machine100is used for forming contacts106manufactured from continuous wires112. The electrical connector assembling machine100manufactures the electrical connectors102in a continuous, feed based manufacturing process, wherein formed electrical connectors102are separated from the continuous strip. The electrical connectors102may have various lengths to vary the number of positions or contacts within the electrical connector102for a particular application (for example, between 2 positions and 30 positions). In an exemplary embodiment, the electrical connector assembling machine100is used for assembling mass termination assembly (MTA) electrical connectors, such as MTA100or MTA156connectors commercially available from TE Connectivity. For example, the electrical connector assembling machine100is used for assembling board mounted header connectors. The MTA100connectors have contacts in a single row on 0.100″ (2.54 mm) centerline spacing between 2 and 28 positions. The MTA156connectors have contacts in a single row on 0.156″ (3.96 mm) centerline spacing between 2 and 24 positions. The header connectors may be right angle connectors or vertical mount connectors. The header connectors may have latching features for latched coupling with the mating, receptacle connectors. The header connectors may have polarizing features, such as notches, for keyed mating with the receptacle connectors. The header connectors may have different colors (for example, MTA100vs MTA156). The header connectors may have the contacts with different plating to offer solutions for a multitude of diverse applications. The electrical connector assembling machine100includes a connector loading assembly150for supplying the connector housings104and a contact loading assembly152for supplying the contacts106. The connector loading assembly150and the contact loading assembly152operate synchronously to manufacture the electrical connectors102. The connector loading assembly150of the electrical connector assembling machine100includes a connector strip distribution unit200, a connector strip feed unit300and a connector strip notching unit400. The electrical connector assembling machine100may further include an electrical connector separating unit600. The connector strip distribution unit200is used to distribute the connector strip110to the machine100. The connector strip feed unit300is used to feed the connector strip110through the machine100. The connector strip notching unit400is used to process the connector strip110during a manufacturing process. The contact loading assembly152is used to feed the wires112through the machine100. The electrical connector separating unit600is used to separate the assembled electrical connectors102from the strip. The electrical connector assembling machine100may include additional units in alternative embodiments for performing additional manufacturing processes. The connector strip distribution unit200includes a reel cradle210for holding a reel202of the connector strip110. The connector strip distribution unit200is used to unwind the connector strip110from the reel202. In an exemplary embodiment, the connector strip distribution unit200includes a roller212for rotating the reel202of the connector strip110to unwind the connector strip110from the reel202. The roller212automatically unwinds the connector strip110from the reel202, such as to provide a slack length of the connector strip110, which may be easily feed through the machine100without pulling the connector strip110tight at the reel202. The roller212may be a powered roller that is rotated by an electric motor to unwind the reel202. The roller212unwinds the connector strip110independent of the connector strip feed unit300. For example, the connector strip feed unit300does not need to pull the connector strip110off of the reel202. Rather, the connector strip110may be fed from the slack length that is unwound from the reel202by the roller212. In an exemplary embodiment, the connector strip distribution unit200includes a roller actuator214operably coupled to the roller212to rotate the roller212. The roller actuator214may be a motor or other device used to rotate the roller212, which in turn rotates the reel202to unwind the connector strip110from the reel202. In an exemplary embodiment, the connector strip distribution unit200includes a roller trigger216operably coupled to the roller actuator214to activate the roller actuator214and cause the roller actuator214to rotate the roller212. In an exemplary embodiment, the connector strip feed unit300includes a feed track302receiving and guiding the connector strip110through the machine100. The connector strip feed unit300includes a feeding device310configured to index the connector strip110through the feed track302in successive feed strokes. For example, the feeding device310may feed a defined length of the connector strip110for each feed stroke. In an exemplary embodiment, the feeding device310feeds the same length of connector strip110for each feed stroke. In various embodiments, the feeding device310may feed a length of the connector strip110corresponding to four contact positions or a four position connector length. For example, the feeding device310may feed 0.400″ (10.16 mm) (for example, when manufacturing MTA100connectors) or 0.624″ (15.84 mm) (for example, when manufacturing MTA156connectors). In an exemplary embodiment, the connector strip notching unit400including a notching device402configured to cut notches in the connector strip110at designated locations. For example, the notches may be provided at ends of the connector housings104formed from the connector strip110. The locations of the notches may be varied depending on the length of the connector housings104(for example, based on the number of contact positions of the electrical connector102being manufactured). In an exemplary embodiment, the notching device402includes a plurality of cutters404for selectively cutting through the dielectric material of the connector strip110. The connector strip notching unit400includes a notching unit controller406operably coupled to the plurality of cutters404to selectively operate or actuate the cutters404as the connector strip110is indexed through the machine100. In an exemplary embodiment, the contact loading assembly152loads the contacts106into the connector strip110as the connector strip110is advanced through the electrical connector assembling machine100. The contact loading assembly152may be used to simultaneously load multiple contacts106into the connector strip110. For example, the connector strip110may remain at a fixed location for a period of time, during which the multiple contacts106are loaded into the connector strip110, and then the connector strip110may be advanced during a feed stroke where another set of the contacts106may again be loaded into the connector strip110. In various embodiments, four contacts106may be loaded into corresponding positions in the connector strip110during each feed stroke. In an exemplary embodiment, the contact loading assembly152includes a wire distribution unit700, a wire feed unit800, a contact forming unit900, and a contact loading device1000. The wire distribution unit700is used to distribute the one or more of the wires112to the machine100. In an exemplary embodiment, multiple wires112are simultaneously used to form contacts. For example, four different wires may be used for forming four contacts, which are simultaneously loaded into the connector strip110. The wire feed unit800is used to feed the wires112through the machine100. The contact forming unit900is used to process the wires112to form separate contacts106from the wires112during a manufacturing process. The contact loading device1000is used to load the contacts106into the connector strip110. The electrical connector assembling machine100may include additional units in alternative embodiments for performing additional manufacturing processes. In an exemplary embodiment, the electrical connector separating unit600is located downstream of the contact loading assembly152. The electrical connector separating unit600includes a cutting device602for separating the electrical connectors102, with the contacts106in the connector housing104, from the connector strip110as the connector strip110is advanced through the electrical connector assembling machine100. After the contacts106are loaded into the connector strip110, the loaded connector housings104are separated from the connector strip110to form the electrical connector102. The length of the connector housings104may be varied to vary the number of contacts106included in the electrical connector102. For example, the machine100may manufacture short electrical connectors (for example, 2 or 4 position connectors), medium electrical connectors (for example, 10 or 15 position electrical connectors) or long electrical connectors (for example, 20 or 28 position electrical connectors). The machine may be used to make any reasonable length electrical connectors (for example, greater than 28 positions). The electrical connector separating unit600includes a cutting device602for separating the electrical connectors102from the connector strip110. FIG.2is a cross sectional view of the electrical connector102manufactured by the electrical connector assembling machine100(FIG.1) in accordance with an exemplary embodiment. The electrical connector102includes the connector housing104and the contact(s)106received in the connector housing104. Any number of the contacts106may be received in the connector housing104(for example, between 2 and 28 contacts). The electrical connector102is a header connector mounted to a printed circuit board114. The contacts106may be soldered to the printed circuit board114. A receptacle connector180is shown coupled to the electrical connector102. The electrical connector102is a vertical connector mated with the receptacle connector180in a vertical direction (for example, downward) in a direction perpendicular to the printed circuit board114. In alternative embodiments, the electrical connector102may be a right angle header connector configured to be mated with the receptacle connector180in a mating direction parallel to the printed circuit board114. FIG.3is a perspective view of the electrical connector102in accordance with an exemplary embodiment. The electrical connector102is manufactured by the electrical connector assembling machine100(FIG.1). For example, the electrical connector assembling machine100is used to manufacture the contacts106from the wires112and load the contacts106into the continuous strip of material defining the connector housing104. The connector housings104with the contacts106therein are then separated from the continuous strip to form the electrical connectors102.FIG.3shows the electrical connector102as a two position electrical connector; however, the electrical connectors102may be made in various lengths to vary the number of contacts106in the electrical connector102(for example, any length between 2 positions and 28 positions). The connector housing104is made from the connector strip110(shown inFIG.1), which is a continuous extruded dielectric material that is formed into a predetermined shape, such as an L-shape. The connector housing104includes a front120and a rear122opposite the front120. During assembly, the contacts106are loaded into the connector strip through the rear122. The connector housing104includes a first end124and a second end126opposite the first end124. The connector housing104includes a first side130and a second side132opposite the first side130. The sides130,132are cut sides formed by cutting the connector housing104from the connector strip110. In an exemplary embodiment, the connector housing104includes contact openings136therethrough that receive corresponding contacts106. The contact openings136may be preformed (for example, cut or drilled) through the main body of the connector housing104. Alternatively, the contacts106may be pressed through the main body of the connector housing104during assembly to form the contact openings136. In an exemplary embodiment, the connector housing104includes a finger140extending from the front120of the main body. In the illustrated embodiment, the finger140is located at the second end126. The finger140is a friction lock finger in various embodiments used for securing the receptacle connector180(shown inFIG.2) to the electrical connector102. In alternative embodiments, the connector housing104may be manufactured without the finger140. For example, the connector strip110may be extruded without the finger140. FIG.4is a perspective view of the electrical connector102in accordance with an exemplary embodiment. In the illustrated embodiment, the electrical connector102is a right-angle header connector. The contacts106are bent to include a right-angle bend. In such embodiment, the second end126is configured to be mounted to the printed circuit board114(shown inFIG.2). FIG.5is a rear perspective view of a portion of the electrical connector assembling machine100showing the wire distribution unit700. The wire distribution unit700includes reel cradles710for holding reels702of the wire112. The wire distribution unit700is used to unwind the wires112from the reels702. In an exemplary embodiment, the wire distribution unit700includes rollers712for rotating the reels702of the wire112to unwind the wire112from the reels702. The rollers712automatically unwind the wires112from the reels702. The rollers712may be rotated by an electric motor to unwind the reels702. In an exemplary embodiment, the wire distribution unit700includes a manifold720used to gather the wires112. The manifold720combines the wires112in a consolidated area to direct the wires112into the wire feed unit800. The manifold720may include rollers to straighten the wires112to remove the natural bend in the wires112from being wound on the reels702. FIG.6is a perspective view of the wire feed unit800and the contact forming unit900in accordance with an exemplary embodiment.FIG.7is a perspective view of a portion of the wire feed unit800and the contact forming unit900in accordance with an exemplary embodiment. The wire feed unit800includes a feed track802receiving and guiding the wire112through the machine100. The wire feed unit800includes a feeding device810configured to index the wires112through the feed track802in successive feed strokes. For example, the feeding device810may feed defined lengths of the wires112for each feed stroke. In an exemplary embodiment, the feeding device810feeds the same length of wire112for each feed stroke. In various embodiments, the feeding device810may feed four of the wires112through the wire feed unit800, which are processed by the contact forming unit900to make four contacts106at a time from the four wires112. In an exemplary embodiment, the feeding device810is programmable to feed different lengths of the wires112depending on the particular application and requirements for the electrical connector102. The feeding device810includes a holding device820and an indexing device830. The indexing device830is movable relative to the holding device820. The indexing device830is used to advance or feed the wires112through the contact loading assembly152. The holding device820is in a fixed position relative to the frame of the electrical connector assembling machine100. In an exemplary embodiment, the feeding device810includes an indexer840operably coupled to the indexing device830. The indexer840moves the indexing device830relative to the fixed holding device820from a retracted position to an advanced position. The indexing distance of the indexing device830corresponds to the feed length of the wires112through the wire feed unit800, which corresponds to the lengths of the contacts106manufactured by the machine100. The indexing device830moves the wires112as the indexing device830is moved from the retracted position to the advanced position. The indexing device830releases the wires112and moves relative to the wires112as the indexing device830is returned from the advanced position to the retracted position. In alternative embodiments, a second indexer may be provided such that both the holding device820and the indexing device830may be movable relative to each other and relative to the frame. In an exemplary embodiment, the holding device820includes a holding clamp822and a holding actuator821operably coupled to the holding clamp822. The holding actuator821is operated to move the holding clamp822between a clamping position (closed) and a released position (open). In the illustrated embodiment, the holding actuator821is a pneumatic actuator that allows opening and closing of the holding clamp822. However, other types of actuators may be used in alternative embodiments, such as a hydraulic actuator, an electric actuator, and the like. The holding actuator821includes a piston configured to be extended and retracted to move the holding clamp822. The holding clamp822is used to hold or fix the wires112relative to the holding device820in the clamping position. For example, the wires112may be captured between the holding clamp822and another structure, such as a clamping wall. In various embodiments, the clamping wall may be positioned below the wires112and the holding clamp822is moved downward to the clamping position to capture the wires112between the holding clamp822and the clamping wall. The holding actuator821moves the holding clamp822toward and away from the clamping wall828during operation. The holding clamp822is released from the wires112in the released position and the wires112is allowed to move relative to the holding clamp822in the released position. In an exemplary embodiment, the holding clamp822includes slots or channels that define portions of the feed track802. In an exemplary embodiment, the indexing device830includes an indexing clamp832and an indexing actuator831operably coupled to the indexing clamp832. The indexing actuator831is operated to move the indexing clamp832between a clamping position (closed) and a released position (open). In the illustrated embodiment, the indexing actuator831is a pneumatic actuator that allows opening and closing of the indexing clamp832. However, other types of actuators may be used in alternative embodiments, such as a hydraulic actuator, an electric actuator, and the like. The indexing actuator831includes a piston configured to be extended and retracted to move the indexing clamp832. The indexing clamp832is used to hold or fix the wires112relative to the indexing device830in the clamping position. For example, the wires112may be captured between the indexing clamp832and another structure, such as a clamping wall to allow the wires112to move with the indexing device830. The indexing actuator831moves the indexing clamp832toward and away from the clamping wall during operation. The indexing clamp832is released from the wires112in the released position and the wires112are allowed to move relative to the indexing clamp832in the released position. In an exemplary embodiment, the indexing clamp832includes slots or channels that define portions of the feed track802. The indexer840moves the indexing device830in a feed direction along a feed stroke to advance or feed the wire112through the electrical connector assembling machine100. The indexer840controls the feed distance that the wires112are indexed through the electrical connector assembling machine100. Optionally, the indexer840feeds the wires112in a forward feed direction. In the illustrated embodiment, the indexer840includes a motor842, a ball screw844driven by the motor842, and a carriage846operably coupled to the ball screw844. The carriage846is slidable along a feed rail848, which controls the feed direction. The indexing device830is mounted to the carriage846, such as being bolted or otherwise fastened or secured to the carriage846. The indexing device830is carried by the carriage846and is movable with the carriage846as the carriage846slides along the feed rail848both in the forward advancing direction and in the rearward retracting direction. For example, the carriage846moves the indexing device830relative to the holding device820. The motor842is operated to drive the ball screw844and move the carriage846in a forward direction and a reverse direction to move the indexing device830between the retracted position and the advanced position. The indexer840has controlled movement and positioning for repeatable and known positioning of the indexing device830, and thus the wires112, within the electrical connector assembling machine100. The indexer840may be programmable to control functions of the indexer840, such as the feed stroke length, the feed stroke speed, and the like. For example, the motor842of the indexer840may be a servo motor having computer controlled forward and reverse operation. Other types of drive mechanisms may be used in alternative embodiments. In an exemplary embodiment, the wire feed unit800includes a wire guide assembly870used to guide the wires112through the wire feed unit800. The wire guide assembly870may form a portion of the feed track802. In an exemplary embodiment, the wire guide assembly870may provide guidance for the wires112in multiple directions, such as from above, below and both sides. For example, the wires112may be enclosed by the wire guide assembly870. Optionally, multiple wire guide assemblies870may be used, such as at the entry and exit to the wire feed unit800. The wire guide assembly870is used to prevent buckling of the wires112as the wires112are indexed through the wire feed unit800. In an exemplary embodiment, the wire guide assembly870is flexible (for example, expands and contracts) to accommodate movement of the indexing device830and/or the holding device820. For example, the wire guide assembly870may have multiple pieces that are coupled to different components, which are movable relative to each other. The pieces of the wire guide assembly870are movable relative to each other, such as sliding relative to each other. In an exemplary embodiment, the contact forming unit900includes one or more forming dies910used to form portions of the contacts106from the wires112. The forming dies910are pressed into the wires112during a pressing operation to form the wires112. In an exemplary embodiment, the wires112are square wires and the forming dies910are used to form tapered ends at the ends of the contacts106. For example, the forming dies910are used to form pyramidal sections at the ends of the contacts106. In various embodiments, one forming die910may be used to form tapered sides of the contacts106while another forming die910may be used to form tapered tops and bottoms of the contacts106. In an exemplary embodiment, the forming dies910are integrated with the holding device820and the indexing device830. For example, the forming dies910may include a first forming die920with the holding device820and a second forming die930with the indexing device830. The pressing operation of the first forming die920is performed with the clamping operation of the holding clamp822. For example, actuation of the holder actuator821drives the pressing operation of the first forming die920. The pressing operation of the second forming die930is performed with the clamping operation of the indexing clamp832. For example, actuation of the indexing actuator831drives the pressing operation of the first forming die920. In an exemplary embodiment, the contact forming unit900includes a wire cutter912for separating the contacts106from the wires112. The wire cutter912may be integrated with one of the forming dies910, such as the first forming die920or the second forming die930. Optionally, the wire cutter912may be part of the forming die910, such as at an end of the forming die910used to cut through the wires112. Alternatively, a cutting element may be provided. The wire cutter912physically separates the contacts106from the wires112to allow the separated contacts106into the connector strips110by the contact loading device1000. FIG.8illustrates a portion of the wire feed unit800and the contact forming unit900in accordance with an exemplary embodiment showing the holding device820and the first forming die920.FIG.9is an enlarged view of the wire feed unit800and the contact forming unit900shown inFIG.8in accordance with an exemplary embodiment. The holding device820includes the first wire clamp or the holding wire clamp822used to hold the wires112during the pressing or forming process. For example, when the first forming die920is pressed into the wires112to form the ends of the contacts106, the holding wire clamp822holds the wires112to resist longitudinal and lateral movement of the wires112. The holding wire clamp822resists shape changes of the wires112when the forming die920presses the wires112to form the tapered ends of the contacts106. The first forming die920includes forming tools922,924shaped to form tapered sections into the wires112, which correspond to the tapered ends of the contacts106. Optionally, the lower forming tool924is fixed in place and the upper forming tool922is movable relative to the lower forming tool924. The upper forming tool922includes forming surfaces926forming the tops of the wires112, whereas the lower forming tool924includes forming surfaces928forming the bottoms of the wires112. The forming tool922is movable in a vertical pressing direction. For example, the forming tool922may be pressed downward into the wires112to swage and reshape the wires112and form the tapered sections. In an exemplary embodiment, the holding actuator821(shown inFIG.6) is used to drive the forming tool922. For example, operation of the holding actuator821causes the forming tool922to move downward in a pressing direction and to move upward in a return direction. During the downward pressing stroke, the forming tool922engages the wires112and forms the wires112into the desired shape between the upper and lower forming tools922,924. In an exemplary embodiment, the wire cutter912is integrated with the first forming die920. For example, the wire cutter912is movable with the upper forming tool922to cut through the wires112as the wire cutter912is moved in the downward direction. The wire cutter912is used to physically separate the contacts106from the wires112. In an exemplary embodiment, the holding wire clamp822includes multiple clamping elements823. For example, clamping elements823may be provided on both sides of the first forming die920(for example, upstream and downstream). The clamping elements823are positioned adjacent to the forming die920, such as in close proximity to the forming area to hold the wires112in position during the forming process. The clamping elements823support segments of the wires112adjacent to the segments of the wires112being formed (for example, the segments corresponding to the tapered ends of the contacts). The clamping elements823resist shape changes (for example, stretching of the material during swaging) of the wires112at the supported segments of the wires112. The clamping elements823resist longitudinal movements of the wires112and resist lateral movements of the wires112. As such, the forming die920is able to consistently and reliably form the tapered ends to produce high quality electrical connectors. FIG.10illustrates a portion of the wire feed unit800and the contact forming unit900in accordance with an exemplary embodiment showing the indexing device830and the second forming die930.FIG.11is an enlarged view of the wire feed unit800and the contact forming unit900shown inFIG.10in accordance with an exemplary embodiment. The indexing device830includes the second wire clamp or the indexing wire clamp832used to hold the wires112during the pressing or forming process. For example, when the second forming die920is pressed into the wires112to form the ends of the contacts106, the indexing wire clamp832holds the wires112to resist longitudinal and lateral movement of the wires112. The indexing wire clamp832resists shape changes of the wires112when the forming die920presses the wires112to form the tapered ends of the contacts106. The second forming die930includes a forming tool932shaped to form tapered sections into the wires112, which correspond to the tapered ends of the contacts106. The forming tool932includes forming surfaces936used to form the sides of the wires112. The forming tool932is movable in a vertical pressing direction. For example, the forming tool932may be pressed downward into the wires112to reshape the wires112and form the tapered sections. In an exemplary embodiment, the indexing actuator831(shown inFIG.6) is used to drive the forming tool932. For example, operation of the indexing actuator831causes the forming tool932to move downward in a pressing direction and to move upward in a return direction. During the downward pressing stroke, the forming tool932engages the wires112and forms the wires112into the desired shape. In an exemplary embodiment, the indexing wire clamp832includes multiple clamping elements833. For example, clamping elements833may be provided on both sides of the second forming die930(for example, upstream and downstream). The clamping elements833are positioned adjacent to the forming die930, such as in close proximity to the forming area to hold the wires112in position during the forming process and the contact separating process. The clamping elements833support segments of the wires112adjacent to the segments of the wires112being formed (for example, the segments corresponding to the tapered ends of the contacts). The clamping elements833resist shape changes of the wires112at the supported segments of the wires112. The clamping elements833resist longitudinal movements of the wires112and resist lateral movements of the wires112. As such, the forming die930is able to consistently and reliably form the tapered ends to improve the shape of the end of the contact and produce high quality contacts for the electrical connectors. FIG.12is a perspective view of a portion of the wire clamp832in accordance with an exemplary embodiment.FIG.13is an enlarged, end view of the wire clamp832in accordance with an exemplary embodiment.FIGS.12and13illustrate one of the clamping elements833of the wire clamp832. It is realized that the wire clamp822and corresponding clamping elements823(shown inFIG.8) may be similar or identical to the wire clamp832shown inFIGS.12and13. The wire clamp832includes wire channels834at a bottom thereof. The wires channels834receive corresponding wires112. The wire clamp832includes support surfaces835defining the wire channels834. The support surfaces835may be shaped to closely follow the profile of the wires112(for example, square-shaped wires). The support surfaces835may be sized to tightly receive or pinch the wires112to resist shape changes or other movements of the wires112within the wire channels834. In the illustrated embodiment, the support surfaces835are angled or tapered slightly to guide loading of the wires112into the wire channels834and pinch the wires112when clamped. For example, the wire channels834may be trapezoidal shaped to receive the wires112. In an exemplary embodiment, the wire channels834included lead-in surfaces836at the bottom of the wire clamp832. The lead-in surfaces836guide the wires112into the wire channels834. FIG.14illustrates the wire guide assembly870in accordance with an exemplary embodiment.FIG.15is an enlarged view of a portion of the wire guide assembly870in accordance with an exemplary embodiment. The wire guide assembly870guides or positions the wires112as the wires112are indexed through the wire feed unit800.FIGS.14and15illustrate one of the wire guide assemblies870, such as the wire guide assembly at the exit from the wire feed unit800; however, a similar wire guide assembly870may be used at the entrance to the wire feed unit800. The wire guide assembly870includes multiple pieces that are coupled to different components. The pieces are movable relative to each other, such as to slide relative to each other in a direction parallel to the wires112. In an exemplary embodiment, the wire guide assembly870includes a rear guide member872and a front guide member874. The guide members872are coupled to different components and are configured to be movable relative to each other. For example, the rear guide member872is coupled to the holding device820while the front guide member874is coupled to another component, such as the contact loading device1000(shown inFIG.1). The holding device820may be movable relative to the contact loading device1000(for example, repositioned to control contact length), and thus the rear guide member872may be movable relative to the front guide member874. The guide members872,874may be secured to the respective components using fasteners, welding or other securing means. The wires112are indexed through the guide members872,874. In an exemplary embodiment, the rear guide member872includes an upper rear guide element880and a lower rear guide element882. The upper and lower rear guide elements880,882are coupled together, such as using fasteners. Optionally, the upper and lower rear guide elements880,882may be identical to each other and inverted 180° relative to each other. In an exemplary embodiment, the front guide member874includes an upper front guide element890and a lower front guide element892. The upper and lower front guide elements890,892are coupled together, such as using fasteners. Optionally, the upper and lower front guide elements890,892may be identical to each other and inverted 180° relative to each other. In various embodiments, the upper and lower front guide elements890,892may be identical to the upper and lower rear guide elements880,882and rotated 180° relative to each other. FIG.16is a perspective view of a portion of the wire guide assembly870, illustrating the upper rear guide element880. In various embodiments, the lower rear guide element882, and the upper and lower front guide elements890,892may be identical to the upper rear guide element880and like components are identified with like reference numerals. The guide element880includes a base block884and rails886extending from the base block884. The base block884includes slots888extending therethrough offset relative to the rails886. The rails886may have different sizes. The slots888may have different sizes. The slots888are sized to receive rails of another guide element (for example, the slots888of the upper rear guide element are configured to receive rails of the upper front guide element890, whereas the slots of the upper front guide element890are configured to receive the rails886of the upper rear guide element880). The rails886include wire channels894, which receive portions of the wires112. The rails886have horizontal surfaces895and vertical surfaces896that meet at a corner, which form the wire channels894. The wire channels894extend the length of the rails886. In an exemplary embodiment, the wire channels894receive a corresponding corner of the square-shaped wire112. In an exemplary embodiment, the wire channels894have lead-in surfaces897to guide the wires112into or out of the wire channels894. FIG.17is a cross sectional view of the wire guide assembly870in accordance with an exemplary embodiment. The wire guide assembly870includes the upper and lower rear guide elements880,882and the upper and lower front guide elements890,892. The rails886aof the upper rear guide element880are received in the slots888cof the upper front guide element890. The rails886cof the upper front guide element890are received in the slots888aof the upper rear guide element880. The rails886bof the lower rear guide element882are received in the slots888dof the lower front guide element892. The rails886dof the lower front guide element892are received in the slots888bof the lower rear guide element882. The wire channels894a,894b,894c,894dof the upper and lower rear guide elements880,882and the upper and lower front guide elements890,892, respectively, cooperate to hold the wires112. The wires112are supported by the horizontal and vertical surfaces895,896of the upper and lower rear guide elements880,882and the upper and lower front guide elements890,892. For examples, the corners of the square-shaped wires112are located in the corners of the upper and lower rear guide elements880,882and the upper and lower front guide elements890,892. The upper and lower rear guide elements880,882and the upper and lower front guide elements890,892guide the wires112and resist horizontal and vertical movement of the wires112. The wire guide assembly870is designed such that the wires112may be wholly supported just using the two of the guide elements880,882,890,892supporting opposite corners (for example, NE and SW or NW and SE). For example, when the wire guide assembly870is expanded (for example, the rear guide member872is moved away from the front guide member874), the wires112may only be supported at two corners rather than all four corners along lengths of the wires112. The wire guide assembly870provides support while still allowing relative movement between the parts. FIG.18is a perspective view of a portion of the electrical connector assembling machine100showing the contact loading device1000in accordance with an exemplary embodiment. The contact loading device1000is downstream of the wire feed unit800and the contact forming unit900. The contacts106are separated from the wires112by the contact forming unit900and indexed to the contact loading device1000. The wire guide assembly870guides the contacts106from the contact forming unit900to the contact loading device1000. For example, the rear guide member872is coupled to the contact forming unit900and the front guide member874is coupled to the contact loading device1000. The wire guide assembly870is expandable to accommodate relative movement between the contact forming unit900and the contact loading device1000. The contact loading device1000positions the contacts106for loading into the connector strip110as the connector strip110is indexed through the electrical connector assembling machine100. The contacts106are fed or loaded into the connector strip110by the contact loading device1000. In an exemplary embodiment, the four wires112form four different sets of the contacts106, which are simultaneously fed into the connector strip110. Once the contacts106are loaded into the connector strip110, lengths of the loaded connector strip110, with the contacts106, may be separated from the connector strip110to form the electrical connectors102. Different length electrical connectors102may be manufactured by the electrical connector assembling machine100by varying the length of the connector strip110that is separated from the connector strip110. The electrical connectors102may be transported or loaded to another machine or container for further processing and/or assembly to a circuit board and/or shipping. It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means-plus-function format and are not intended to be interpreted based on 35 U.S.C. § 112(f), unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure. | 41,299 |
11862921 | In the drawings:1—terminal fixing portion;11—terminal fixing base;12—terminal connecting shaft;13—terminal clipping seat;14—the first terminal gripper;15—the second terminal gripper;16—the first terminal groove;17—the second terminal groove;2—wire storage portion;21—wire storage component;211—wire storage wrench;212—wire storage buckle;213—wire storage gripper;22—wire feeding component;221—first wire feeding system;222—second wire feeding system;223—third wire feeding system;3—transferring portion;31—transferring base;311—first transferring gripper;312—second transferring gripper;313—third transferring gripper;314—first transferring clipping boss;315—second transferring clipping boss;32—transferring motor;33—transferring bracket;4—connector fixing portion;41—connector fixing base;42—connector bracket;43—connector support column;5—insert portion;51—insert base;52—insert fixture base;53—first insert gripper;54—second insert gripper;55—third insert gripper;56—first insert boss;57—second insert boss;6—conveying portion. DETAILED DESCRIPTION Technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present disclosure. A connector insert device for automatic switching of connector fixtures of the present disclosure comprises at least one terminal fixing portion1configured to hold a wire to be inserted, a wire storage portion2configured to store groups of wires to be inserted, at least one transferring portion3configured to store the wire to be inserted clipped by the at least one terminal fixing portion1in the wire storage portion2through a conveying portion6, a connector fixing portion4configured to store connectors of the groups of wires to be inserted, and an insert portion5configured to insert the groups of wires to be inserted in the wire storage portion2to the connector fixing portion4through the conveying portion6. As shown inFIG.1, in one embodiment, the at least one transferring portion3and the insert portion5are arranged above the conveying portion6and are movable along the conveying portion6. The at least one terminal fixing portion1, the wire storage portion2, and the connector fixing portion4are sequentially fixed on a same side of the conveying portion6. Furthermore, the at least one terminal fixing portion1rotates the wire to be inserted to a predetermined angle. The at least one transferring portion3clips the wire rotated by the predetermined angle and places the wire rotated by the predetermined angle in the wire storage portion2according to a predetermined instruction. In one embodiment, the predetermined angle of the wire to be inserted is set according to actual needs of installation of the terminal and the connector. In one embodiment, multiple wires need to be inserted into a same connector, an insert angle of each wire is able to be set independently, and an order of the wires to be inserted are set, so that the connector insert device of the present disclosure is able to automatically complete the insertion of the wires. The connector insert device of the present disclosure has a high degree of automation and processing flexibility. In one embodiment, in order to save an installation space, the conveying portion6is a linear motor. Furthermore, as shown inFIG.2, the at least one terminal fixing portion1comprises a terminal fixing base11, a terminal clipping base13, and a terminal gripper. In one embodiment, the terminal clipping base13is rotatably connected with the terminal fixing base11through a terminal connecting shaft12. The terminal gripper is fixedly connected with the terminal clipping base13. The terminal gripper comprises a first terminal gripper14and a second terminal gripper15. The first terminal gripper14has a first terminal groove16. The second terminal gripper15has a second terminal groove17corresponding to the first terminal groove16. Optionally, both of the first terminal grooves16and the second terminal grooves17are V-shaped grooves. Specifically, when the first terminal gripper14and the second terminal gripper15are installed, the first terminal groove16is opposite to the second terminal groove17. Optionally, the second terminal groove17is embeddable in the first terminal groove16. In one embodiment, the at least one terminal fixing portion1clips the wire by clipping the terminal. When clipping the terminal, a terminal head faces the terminal clipping base13. In one embodiment, after the second terminal groove17is embedded into the first terminal groove16, the terminal is clipped, so that the at least one terminal fixing portion1is adapted to different sizes of terminals by adjusting a distance between the first terminal groove16and the second terminal groove17when clipping the wire or replacing the first terminal groove16and the second terminal groove17. Thus, processing flexibility and production efficiency of the at least one terminal fixing portion1is increased. Further, since the terminal clipping base13is rotatable relative to the terminal fixing base11, the at least one terminal fixing portion1is able to adjust an angle of the clipped terminal according to actual needs, which further increases processing flexibility of the at least one terminal fixing portion1. In one embodiment, two terminal fixing portions are arranged side by side, which improve processing efficiency. When two terminals are connected to the wire, the two terminal fixing portions1clip the two terminals at the same time and different predetermined angles can be set for the two terminals respectively, so that an adaptable range of the terminal fixing portions1is further expanded. In one embodiment, in order to improve an accuracy of a rotating angle of the terminal clipping base13, each terminal fixing portion1comprises a terminal fixing motor. Optionally, each terminal fixing motor is a servo motor. Furthermore, as shown inFIG.3, the wire storage portion2comprises wire storage component21and a wire feeding component22fixedly connected with the wire storage component21. The wire storage component21are arranged between the terminal fixing portions1and the wire feeding component22. In one embodiment, the wire storage portion2is a disk structure, and the wire storage component21are arranged on a circumference of the wire storage portion2. Optionally, the wire storage component21are arranged on the circumference of the wire storage portion2at equal intervals. As shown inFIG.4, each of the wire storage component21comprises a wire storage wrench211, wire storage buckles212, and wire storage grippers213. Specifically, the wire storage buckles212and the wire storage grippers213comprise wire storage clipping surfaces. The wire storage clipping surfaces are made of flexible materials, such as rubber. When installation, the wire storage clipping surfaces of the wire storage buckles212are opposite to the wire storage clipping surfaces of the wire storage grippers213. When a distance between each wire storage gripper213and an adjacent wire storage buckle212reaches a predetermined wire storage clipping distance, the wires in the wire storage grippers213are locked and are unable to move. Thus, the wire storage buckles212and the wire storage grippers213not only clip the terminals of the wires, but also avoid damage to the wire or surfaces of the terminals. Because the wire storage clipping surfaces of the wire storage buckles212and the wire storage clipping surfaces of the wire storage grippers213are made of a flexible material, the adaptable range of the wire storage component21is expanded. For wires with small diameter differences, there is no need to adjust the predetermined wire storage clipping distance, it can be used compatible. In one embodiment, the wire storage component21are disc-shaped and are rotatable along a center of the wire storage component21. A plurality of wire storage buckles212and a plurality of wire storage grippers213one-to-one corresponding to the plurality of wire storage buckles212are provided. Positions of the wire storage buckles212and positions of the wire storage grippers213change with rotation of the wire storage component21. In this way, the wire storage component21can store a plurality of wires and therefore reduces an installation space required by the wires. In one embodiment, in order to ensure high reliability of clipping of the wires, two wire storage component21are overlapped to respectively clip two ends of each of the wires. The centers of the two wire storage component21overlap each other. One wire storage component21close to the conveying portion6is configured to clip the wires, and the other wire storage component21away from the conveying portion6is configured to clip the terminals of a predetermined angle. Specifically, each wire storage wrench211is hinged with the wire storage portion2. The wire storage component21rotate to drive the wire storage buckles212and the wire storage grippers213to a predetermined wire storage position. Then each wire storage wrench211moves closer to the wire storage buckles212. After each wire storage wrench211is snapped on a corresponding wire storage buckle212, each wire storage wrench211unlocks the corresponding wire storage buckle212, so that a distance between the wire storage buckles212and an adjacent wire storage gripper213increases, The insert portion5first clips the terminal head, and then clips the terminal tail to take away the wire. In one embodiment, when the wire storage component21clips the wires, the terminal heads are away from the conveying portion6. As shown inFIG.5, in one embodiment, the wire feeding component22comprises a first wire feeding system221, a second wire feeding system222, and a third wire feeding system223. The third wire feeding system223is arranged between the second wire feeding system222and the conveying portion6. The second wire feeding system222is arranged between the first wire feeding system221and the third wire feeding system223. Specifically, the first wire feeding system221comprises a terminal groove configured to receive the terminal head. The first wire feeding system221comprises a wire clipping groove configured to clip the terminal tail. The second wire feeding system222and the third wire feeding system.223are configured to clip the wire. When the wire is released, the insert portion5first clips the terminal head, then the first wire feeding system221releases the terminal. Then the insert portion5clips the terminal tail, the second wire feeding system222and the third wire feeding system223simultaneously release the wire, and the insert portion5takes the wire away. In this way, it can be ensured that the predetermined angle of the wire does not change when the wire is moved from the wire feeding component22to the insert portion5. In one embodiment, when the wire feeding component22clips the wires, the terminal heads are away from the conveying portion6. In one embodiment, the wires are transferred from the terminal fixing portions1to the wire storage portion2by the transferring portion3. Further, as shown inFIG.6, the at least one transferring portion3comprises a transferring base31, a transferring motor32, and a transferring bracket33, The transferring base31is fixedly connected with the transferring bracket33. The transferring bracket33is connected with the conveying portion6and is movable along the conveying portion6. Furthermore, the at least one transferring portion3comprises a first transferring clipping component and a second transferring clipping component. The first transferring clipping component is arranged between the transferring clipping component and the wire storage portion and is close to the second transferring clipping component. The first transferring clipping component is configured to clip a terminal head. The second transferring clipping component is configured to clip a terminal tail. Optionally, in order to improve the processing efficiency of the present disclosure, two transferring portions3are arranged side by side, so that when two terminals are connected to a same wire, the two transferring portions3can clips the two terminals at the same time. Even if the predetermined angles of the two terminals are different, the two transferring portions3are able to adapt to them. In one embodiment, according to the predetermined instruction, the transferring portions3transfer the wire to be immediately transferred to the insert portion5to the wire feeding component22, and transfer the wire that does not need to be immediately transferred to the insert portion5to the wire storage component21. In one embodiment, in order to improve a distance adjustment accuracy of the transferring portions3, each transferring motor32is a servo motor. In one embodiment, when the transferring portions3clip the wire, the terminal head is away from the transferring base31. As shown inFIG.7, in one embodiment, each first transferring clipping component comprises a first transferring gripper311and a second transferring gripper312. Each first transferring gripper311comprises a first transferring clipping boss314. Each second transferring gripper312comprises a second transferring clipping boss315. In one embodiment, each first transferring gripper311is fixedly connected with a corresponding transferring base31. Each second transferring gripper312is connected with a corresponding transferring base31through a connecting shaft and is rotatable relative to a corresponding first transferring gripper311through the connecting shaft. Specifically, when each first transferring clipping boss314moves away from a corresponding transferring bracket33in a direction perpendicular to the corresponding transferring bracket33and contacts the corresponding terminal, each second transferring gripper312rotates clockwise from a first transferring starting position to a first predetermined transferring position. At this time, one end of each second transferring clipping boss315facing the transferring base31cooperates with each first transferring clipping boss314to clip one terminal head. Thus, the predetermined angle of the wire is kept unchanged. Optionally, each second transferring clipping component comprises two third transferring grippers313. The third transferring grippers313have clipping surfaces. When installing, the clipping surfaces of each two third transferring grippers313are opposite to each other. and are movable with respect to each other When the two third transferring grippers313of each second transferring clipping component move toward each other and when a distance between the two third transferring grippers313is reduced to a predetermined third transferring distance, each second transferring clipping component clips one terminal tail. When the two third transferring grippers313of each second transferring clipping component move away from each other, the distance between the two third transferring grippers313of each second transferring clipping component increases, and each second transferring clipping component releases the one terminal tail. In one embodiment, each first transferring clipping component is configured to clip one terminal head, and each second transferring clipping component is configured to clip one terminal tail. Specifically, when the transferring portions3clips the wire from the terminal fixing portions1, the first transferring clipping components first clip the terminal heads. Then the terminal fixing portions1release the wire, the second transferring clipping components clip the terminal tails, and the transferring portions3take away the wire. Furthermore, when the transferring portions3transfer the wire to the wire storage portion2, the first transferring clipping components first place the clipped terminal heads in the wire storage portion2at the predetermined angle, and the wire storage portion2clips the terminals. Then the second transferring clipping components release the terminal tails, the wire storage portion2immediately clips the wire, and then the first transferring clipping components and the second transferring clipping components synchronously move away from the wire storage portion2, so that when the transferring portions3transfer the wire to the wire storage portion2, the predetermined angle of the terminals does not change. Furthermore, the connector fixing portion4comprises connector fixing bases41and a connector bracket42. The connector fixing bases41are movable to a predetermined fixing position along the connector bracket42. Specifically, a front side of each of the connector fixing bases41is provided with connecting grooves configured to install connectors. Rollers matched with the connector bracket42are arranged on a back side of each of the connector fixing bases41. In one embodiment, the connector bracket42is a square frame structure. In one embodiment, the connector bracket42comprises pulleys and rails, and the connector fixing bases41are movable on the rails. In one embodiment, the connector fixing bases41are removable from the connector bracket42for replacement. In one embodiment, the connectors are configured for the wires to insert into, and are manually arranged on the connector fixing seat41according to a predetermined connector fixing position. In order to improve an efficiency of the connector insertion, multiple connectors are arranged on each of the connector fixing bases41at same time. After the connectors are arranged, the connector fixing bases41are moved to predetermined fixing positions along the connector bracket42according to an insertion instruction. In one embodiment, connector support columns43are arranged according to the predetermined fixing positions, so as to improve stability of the connector fixing bases41. In one embodiment, the connector support columns43is arranged in the connector bracket42and are detachably connected with the connector bracket42. When the connector fixing bases41are in the predetermined fixing positions, the connector support columns43are configured to enhance the stability of the connector fixing bases41. By arrangement of the connector support columns43, the predetermined fixing position are flexibly set by changing positions of the connector supporting columns43. In one embodiment, two connector fixing bases41are provided, so that the current processing is not affected when one of the connector fixing bases41is replaced, and the work efficiency is improved. Furthermore, as shown inFIG.9, the insert portion5comprises an insert base51. The insert base51is movable along the conveying portion6. In one embodiment, the insert portion5further comprises a first insert component and a second insert component. The second insert component is arranged between the first insert component and the insert base51. The second insert component is close to the first insert component. In one embodiment, the insert portion5further includes an insert fixture base52. The first insert component and the second insert component are installed on the insert fixture base52. In one embodiment, when the insert portion5clips the wire, the terminal heads are away from the insert base51. In one embodiment, the insert fixture base52is movable toward and away from the connector fixing bases41relative to the insert base51. Furthermore, as shown inFIG.10, the first insert component comprises a first insert gripper53and a second insert gripper54. A first insert boss56is arranged on the first insert gripper53. A second insert boss57is arranged on the second insert gripper54. The first insert boss56and the second insert boss57are configured to fix a direction of the terminal to ensure that the predetermined angle of the terminal does not change. Specifically, after one side of the first insert boss56moves away from the insert base51in a direction perpendicular to the insert base51and contacts the terminal, the second insert boss57rotates counterclockwise from the first insert starting position to a first predetermined insert position. At this time, one end of the second insert boss57facing the insert base51cooperates with the first insert boss56to clip the terminal. In this way, the predetermined angle of the wire is kept unchanged. Optionally, the second insert component comprises two third insert grippers55. The two third insert grippers55have clipping surfaces. When installing, the clipping surfaces of the two third insert grippers55are opposite to each other. and are movable with respect to each other When the two third insert grippers55move toward each other and when a distance between the two third insert grippers55is reduced to a first predetermined insert distance, the second insert component clips the wire. When the two third insert grippers55move away from each other, the distance between the two third insert grippers55increases, and the second insert component releases the wire. Specifically, when the insert portion5clips the wire from the wire storage portion2, the wire storage portion2first releases the terminal, the first insert component grippers the terminal. Then the wire storage portions2releases the wire, and the second insert component clips the wire. Thus, when the insert portion5clips the wire from the wire storage portion2, the predetermined angle of the wire does not change. In one embodiment, the first insert component clips the terminal head, and the second insert component clips the terminal tail. In one embodiment, when the insert portion5insert the wire into the connector fixing portion4, the insert portion5moves to a predetermined insert position along the conveying portion6. At this time, the predetermined insert position is corresponding to the predetermined fixing positions. That is, a position of the wire on the insert portion5corresponds to a position of a connector to be inserted on the connector fixing portion4. When the wire is inserted in, the first insert component releases the terminal heads, and the insert fixture base52drives the first insert component and the second insert component to move synchronously to the connector fixing portion4. When the insert fixture base52reaches a second predetermined insert position, the terminals are fixed on the connector to be inserted on the connector fixing portion4. The second insert component releases the terminal tails, and the insert fixture base52drives the first insert component and the second insert component to move away from the connector fixing portion4to complete work of inserting the wire into the connector. Working principle and use flow of the present disclosure is as follow: The terminal fixing portions1clip and rotate the wire to be inserted to the predetermined angle to fix an angle of the wire and the terminals. The transferring portions3transfer the wire rotating to the predetermined angle to the wire storage portion2. The insert portion5takes out the wire to be inserted from the wire storage portion2according to the predetermined angle of the wire, and then inserts the wires to be inserted into the connector fixing portion4according to the predetermined angle of the wire, The transferring portions3and the insert portion5are movable on the conveying portion6to complete transferring and inserting of the wire. The connector insert device for automatic switching of the connector fixtures of the present disclosure only needs to set a processing sequence of the wire and an inserting angle of the terminal at beginning to automatically complete the work of inserting the wire into the connector. The connector insert device for automatic switching of the connector fixtures of the present disclosure adapts to different sizes of wires and different inserting angles of terminals, which has characteristics of wide adaptability, high degree of automation, and high production efficiency. Although the embodiments of the present disclosure have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims and their equivalents. In the above-mentioned embodiments, descriptions of each embodiment have their own emphasis. For parts that are not described in detail or recorded in one embodiment, reference may be made to related descriptions of other embodiments. Those of ordinary skill in the art can realize that units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solutions. Those of ordinary skill in the art may implement the described functionality using different methods for each particular application, and such implementations should not be considered beyond the scope of the present disclosure. The above-mentioned embodiments are only used to illustrate technical solutions of the present disclosure, but not to limit the present disclosure. Although the present disclosure has been described in detail with reference to the foregoing embodiments. It should be understood that those of ordinary skill in the art are still able to modify the technical solutions described in the foregoing embodiments, or equivalently replace some of the technical features in the foregoing embodiments; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from spirit and scope of the technical solutions of the embodiment of the present disclosure, which shall be included in the protection scope of the present disclosure. | 26,379 |
11862922 | DETAILED DESCRIPTION Hereinafter, an embodiment of the invention will be described in detail with reference to the drawings. Additionally, in the following description, the same or corresponding components will be denoted by the same reference symbols without redundant description. [Configuration of Laser Excitation Light Source] As illustrated inFIGS.1to5, a laser excitation light source (light source device)1includes a light emitting sealed body2, a laser light source3, a mirror4, an optical system5, and a casing (lamp house)6. The light emitting sealed body2, the laser light source3, the mirror4, and the optical system5are stored inside the casing6. A discharge gas G1is enclosed in the light emitting sealed body2. The discharge gas G1is, for example, a xenon gas. In the laser excitation light source1, plasma is generated in the discharge gas G1. First light L1which is laser light for maintaining plasma is incident to the light emitting sealed body2and second light L2which is light from plasma is emitted from the light emitting sealed body2as output light. The first light has a wavelength of, for example, about 800 nm to 1100 nm. The second light L2is, for example, light in the mid-infrared region and has a wavelength of about 2 μm to 20 μm. The light emitting sealed body2will be described in detail later. The laser light source3is, for example, a laser diode and outputs the first light L1which is laser light. The mirror4reflects the first light L1from the laser light source3toward the optical system5. The optical system5includes one or plural lenses. The optical system5guides the first light L1from the mirror4to the light emitting sealed body2while condensing the first light L1. The laser light source3, the mirror4, and the optical system5constitute a light introduction unit R which causes the first light L1to be incident to a first opening11along a first optical axis A1. The first opening11and the first optical axis A1will be described later. The casing6includes a main body portion61and a lid member62. A storage space S1is formed inside the main body portion61and the laser light source3, the mirror4, and the optical system5are arranged inside the storage space S1. A depression61ais formed in the main body portion61and an opening portion of the depression61ais closed by the lid member62so as to form a storage space S2. The light emitting sealed body2is disposed inside the storage space S2. The main body portion61includes a pair of wall portions611which define the depression61aand each wall portion611is provided with an opening611athrough which the second light L2emitted from the light emitting sealed body2passes. The second light L2passes through the opening611aand is emitted to the outside. The main body portion61includes a wall portion612which divides the storage space S1and the depression61aand the storage space S1and the storage space S2are divided by the wall portion612. Further, an opening612ais formed in the wall portion612. A part of the optical system5is disposed inside the opening612aand the first light L1passes through the opening612aand is incident to the light emitting sealed body2. A flow path63is formed inside the lid member62. A gas G2flows in the flow path63. The gas G2is, for example, an inert gas such as nitrogen. The flow path63is connected to the outside through an opening63aand the gas G2is supplied from an external gas supply device (not illustrated) to the flow path63through the opening63a. The flow path63is connected to the storage space S2of the main body portion61through an opening63band the gas G2flows from the flow path63into the storage space S2through the opening63b. The gas G2passes between the wall portions611and612of the main body portion61and the light emitting sealed body2and/or between the lid member62and the light emitting sealed body2and is discharged from a ventilation hole613ato the outside. The ventilation hole613ais a through-hole which is formed in a wall portion613of the main body portion61so as to communicate with the storage space S2. The wall portion613includes a pair of tapered surfaces613bwhich are respectively formed at the boundary portions of the pair of wall portions611. The pair of tapered surfaces613bare inclined so as to be closer to each other as it goes toward the ventilation hole613a. Each tapered surface613bis connected to the ventilation hole613a. The tapered surface613bguides the gas G2toward the ventilation hole613a. A through-hole612bis formed in the wall portion612of the main body portion61and a part of the gas G2flowing from the flow path63to the storage space S2passes through the through-hole612band flows into the storage space S1. [Configuration of Light Emitting Sealed Body] The light emitting sealed body2includes a housing10, a first window portion20, two second window portions30, a first electrode40, and a second electrode50. The housing10is formed in a substantially box shape by a metal material and stores the discharge gas G1. More specifically, a sealed internal space S3is formed inside the housing10and the internal space S3is filled with the discharge gas G1. As an example of the metal material forming the housing10, stainless steel is exemplified. In this case, the housing10has a light shielding property with respect to the first light L1and the second light L2. That is, the housing10is formed of a light shielding material which does not allow the first light L1and the second light L2to be transmitted therethrough. The first opening11and two second openings12are formed in the housing10. The first light L1is incident to the first opening11along the first optical axis A1. The first opening11is formed in a circular shape, for example, as viewed from a direction (hereinafter, referred to as a Z-axis direction) parallel to the first optical axis A1. In this example, the first optical axis A1passes through the center of the first opening11as viewed from the Z-axis direction. The first opening11includes an inner portion11a, a middle portion11b, and an outer portion11c. The inner portion11aopens to the internal space S3. The outer portion11copens to the outside. The middle portion11bis connected to the inner portion11aand the outer portion11c. Each of the inner portion11a, the middle portion11b, and the outer portion11chas, for example, a cylindrical shape. The diameter (outer shape) of the middle portion11bis larger than the diameter (outer shape) of the inner portion11aand the diameter (outer shape) of the outer portion11cis larger than the diameter (outer shape) of the middle portion11b. A part of the optical system5is disposed in the outer portion11c. The second light L2is emitted from each second opening12along a second optical axis A2. Each second opening12is formed in, for example, a circular shape as viewed from a direction (hereinafter, referred to as a Y-axis direction) parallel to the second optical axis A2. In this example, the second optical axis A2passes through the center of the second opening12as viewed from the Y-axis direction. Each second opening12includes an inner portion12a, a middle portion12b, and an outer portion12c. The inner portion12aopens to the internal space S3. The outer portion12copens to the outside. The middle portion12bis connected to the inner portion12aand the outer portion12c. Each of the inner portion12a, the middle portion12b, and the outer portion12chas, for example, a cylindrical shape. The diameter (outer shape) of the middle portion12bis larger than the diameter (outer shape) of the inner portion12aand the diameter (outer shape) of the outer portion12cis larger than the diameter (outer shape) of the middle portion12b. The first optical axis A1intersects the second optical axis A2inside the internal space S3. That is, the first opening11and the second opening12are disposed so that the first optical axis A1and the second optical axis A2intersect each other. An intersection C between the first optical axis A1and the second optical axis A2is located inside the internal space S3. In this example, the first optical axis A1perpendicularly intersects the second optical axis A2, but the first optical axis A1may intersect the second optical axis A2at an angle other than a right angle. The first optical axis A1is not parallel to the second optical axis A2. The first optical axis A1does not pass through the second opening12and the second optical axis A2does not pass through the first opening11. The first window portion20hermetically seals the first opening11. The first window portion20includes a first window member21and a first frame member22. The first window member21is formed in, for example, a circular flat plate shape by a translucent material that allows the first light L1to be transmitted therethrough. In this example, the first window member21is formed of sapphire and allows light having a wavelength of 5 μm or less to be transmitted therethrough. The first frame member22is formed in, for example, a frame shape by Kovar metal. The first frame member22is formed in a substantially cylindrical shape as a whole. The first frame member22includes a first portion22ahaving a cylindrical shape and a second portion22bhaving a cylindrical shape and integrally formed with the first portion22a. The outer shape of the second portion22bis larger than the outer shape of the first portion22a. The first window member21is disposed inside the first portion22a. Specifically, a boundary portion between the inner surface of the first portion22aand the inner surface of the second portion22bis provided with a circular ring-shaped protrusion portion22cwhich protrudes inward and the first window member21is disposed inside the first portion22awhile contacting the protrusion portion22c. In this state, a side surface21aof the first window member21contacts the inner surface of the first portion22a. The side surface21aof the first window member21is hermetically joined to the inner surface of the first portion22aover the entire circumference by a joining material (first joining material)23. Accordingly, a gap between the first window member21and the first frame member22is hermetically sealed. The joining material23is, for example, a metal brazing material and is, more specifically, a titanium-doped silver brazing material. The titanium-doped silver brazing material is a brazing material composed of, for example, 70% of silver, 28% of copper, and 2% of Ti and is, for example, TB-608T manufactured by Tokyo Braze Co., Ltd. An outer surface of the second portion22bis provided with a circular ring-shaped flange portion22dwhich protrudes outward. The first frame member22is fixed to the housing10while the flange portion22dis disposed inside the middle portion11bof the first opening11. In this state, a part of the first portion22aof the first frame member22protrudes from the first opening11. The first window member21is disposed so as to face the intersection C between the first optical axis A1and the second optical axis A2. In this example, the light incident surface and the light emitting surface of the first window member21are flat surfaces which extend so as to be perpendicular to the Z-axis direction. The first frame member22is hermetically fixed to the housing by laser welding. More specifically, a contact portion between the flange portion22dand the inner surface of the middle portion11bof the first opening11is irradiated with laser from the outside to be welded over the entire circumference, so that the first frame member22is hermetically joined to the housing10. InFIGS.4and5, a welded part is denoted by the sign W. Accordingly, a part between the first frame member22and the housing10is hermetically sealed. In this way, the first window member21is hermetically joined to the first frame member22by the joining material23and is hermetically fixed to the housing10via the first frame member22. Since the first frame member22is interposed between the first window member21and the housing10, problems caused by a difference in thermal expansion rate between the first window member21and the housing10can be suppressed. Each second window portion30hermetically seals the second opening12. Each second window portion30includes a second window member31and a second frame member32. The second window member31is formed in, for example, a circular flat plate shape by a translucent material that allows the second light L2to be transmitted therethrough. In this example, the second window member31is formed of diamond and allows light having a wavelength of 20 μm or less to be transmitted therethrough. The second frame member32is formed in, for example, a frame shape by Kovar metal. The second frame member32is formed in a substantially cylindrical shape as a whole. The second frame member32includes a first portion32ahaving a cylindrical shape and a second portion32bhaving a cylindrical shape and integrally formed with the first portion32a. The outer shape of the second portion32bis larger than the outer shape of the first portion32a. The second window member31is disposed inside the first portion32a. Specifically, the first portion32aincludes an arrangement portion32ctherein and the second window member31is disposed inside the arrangement portion32c. In this state, a part on the side opposite to the intersection C in the side surface31aof the second window member31contacts the inner surface of the first portion32a. A space inside the second frame member32further includes a middle portion32dconnected to the arrangement portion32cand an outer portion32econnected to the middle portion32d. The middle portion32dhas a truncated cone shape in which a diameter (outer shape) increases when going outward. The outer portion32eis formed in a cylindrical shape having a diameter (outer shape) larger than the middle portion32d. The side surface31aof the second window member31is hermetically joined to the inner surface of the first portion32aover the entire circumference by a joining material (second joining material)33. Accordingly, a part between the second window member31and the second frame member32is hermetically sealed. The joining material33is, for example, a metal brazing material and is, more specifically, a titanium-doped silver brazing material. An outer surface of the second portion32bis provided with a circular ring-shaped flange portion32fwhich protrudes outward. The second frame member32is fixed to the housing10while the flange portion32fis disposed inside the middle portion12bof the second opening12. In this state, a part of the first portion32aof the second frame member32protrudes from the second opening12. The second window member31is disposed so as to face the intersection C between the first optical axis A1and the second optical axis A2. In this example, the light incident surface and the light emitting surface of the second window member31are flat surfaces which extend so as to be perpendicular to the Y-axis direction. The second frame member32is hermetically fixed to the housing by laser welding. More specifically, a contact portion between the flange portion32fand the inner surface of the middle portion12bof the second opening12is irradiated with laser from the outside to be welded over the entire circumference, so that the second frame member32is hermetically joined to the housing10. Accordingly, a part between the second frame member32and the housing10is hermetically sealed. In this way, the second window member31is hermetically joined to the second frame member32by the joining material33and is hermetically fixed to the housing10through the second frame member32. Since the second frame member32is interposed between the second window member31and the housing10, problems caused by a difference in thermal expansion rate between the second window member31and the housing10can be suppressed. The first electrode40extends along an X-axis direction (predetermined direction) which is perpendicular to both the Y-axis direction and the Z-axis direction. The first electrode40faces the second electrode50with the intersection C between the first optical axis A1and the second optical axis A2interposed therebetween. A distance between the intersection C and a front end of the first electrode40in the X-axis direction is the same as a distance between the intersection C and a front end of the second electrode50. The first electrode40is formed of, for example, a metal material such as tungsten. The first electrode40is fixed to the housing10via a first insulation member7at the base end side thereof and is electrically separated from the housing10. The first electrode40is formed in a substantially rod shape as a whole. The first electrode40includes a first support portion (first portion)41formed at a base end side and a first discharge portion (second portion)42located closer to the front end of the second electrode50than the first support portion41. The first discharge portion42has a diameter smaller than that of the first support portion41and has a pointed shape. A boundary portion between the first support portion41and the first discharge portion42is provided with a tapered portion42s. The tapered portion42shas a surface which is inclined so that a diameter increases as it goes toward the first support portion41. The tapered portion42sis disposed at a positional relationship that forms a recess with respect to a surface71aof a main body portion71to be described later. With such an arrangement of the tapered portion42s, electrons E generated in a triple junction P to be described later can be caught in the recess. The first support portion41is a middle portion (a part) of the first electrode40in the X-axis direction. An end portion41aat a base end side opposite to the first discharge portion42in the first support portion41is formed so as to be thicker than a portion other than the end portion41a. The first discharge portion42is formed in a rod shape and is disposed inside the housing10(that is, inside the internal space S3). The first insulation member7includes the main body portion71and a cylindrical portion72. The first insulation member7is formed of, for example, an insulating material such as alumina (aluminum oxide) or ceramic. The main body portion71is formed in, for example, a columnar shape and holds the first support portion41of the first electrode40. The main body portion71includes the surface71aperpendicular to the X-axis direction. The surface71ais a surface exposed to the internal space S3. The surface71ais provided with an insertion hole71bwhich penetrates the main body portion71in the X-axis direction and the first support portion41is disposed inside the insertion hole71band is fixed. The cylindrical portion72is formed in a cylindrical shape so as to extend along the X-axis direction from the surface71aof the main body portion71and surrounds a part at the side (the base end side) of the first support portion41in the first discharge portion42. The end portion41aof the first support portion41is hermetically joined to the inner surface of the insertion hole71bover the entire circumference by a joining material43. Accordingly, a gap between the first electrode40and the first insulation member7is hermetically sealed. The joining material43is, for example, a metal brazing material and is, more specifically, a titanium-doped silver brazing material. The surface71aof the main body portion71is roughened. In this embodiment, the surface71ais roughened by forming a depression73in the surface71a. The depression73extends in a circular ring shape so as to surround the first discharge portion42as viewed from the X-axis direction. The depression73is disposed so as to be separated from each of the first electrode40and the cylindrical portion72. The shape of the depression73in a cross-section parallel to the X-axis direction is, for example, a rectangular shape. The first insulation member7is hermetically fixed to the housing10via a connection member8. An outer surface of the main body portion71of the first insulation member7is provided with a circular ring-shaped flange portion74which protrudes outward. The connection member8is formed of a metal material such as stainless steel. The connection member8includes a first portion81having a cylindrical shape and a second portion82having a ring-shaped flat plate shape and extending from a first end portion81aof the first portion81inward in the radial direction. A front end of the second portion82contacts the outer surface of the main body portion71. The flange portion74contacts the first portion81and the second portion82. The second portion82of the connection member8is hermetically joined to the outer surface of the main body portion71of the first insulation member7over the entire circumference by a joining material83. Accordingly, a part between the connection member8and the first insulation member7is hermetically sealed. The joining material83is, for example, a metal brazing material and is, more specifically, a titanium-doped silver brazing material. The connection member8is hermetically fixed to the housing10by laser welding. More specifically, a third opening13is formed in the housing10. The cylindrical portion72of the first insulation member7is disposed inside the third opening13while being apart from the third opening13. The connection member8is disposed so that a second end portion81bof the first portion81contacts an opening edge of the third opening13. A contact portion between the first portion81and the opening edge of the third opening13is irradiated with laser from the outside to be welded over the entire circumference, so that the connection member8is hermetically joined to the housing10. Accordingly, a part between the connection member8and the housing10is hermetically sealed. In this way, the first insulation member7is hermetically joined to the connection member8and is hermetically fixed to the housing10via the connection member8. In this state, the first electrode40extends so as to penetrate the third opening13. The third opening13is hermetically sealed by the first electrode40, the first insulation member7, and the connection member8. The connection member8can also be regarded as forming a part of the housing10. The second electrode50extends along the X-axis direction. The front end of the second electrode50faces the first electrode40with the intersection C between the first optical axis A1and the second optical axis A2interposed therebetween. The second electrode50is formed of, for example, a metal material such as tungsten. The second electrode50is electrically connected to the housing10. The second electrode50is formed in a substantially rod shape having diameter larger than that of the first electrode40as a whole. The second electrode50includes a second support portion51formed at a base end side and a second discharge portion52located closer to the front end of the first electrode40than the second support portion51and having a pointed shape. The second support portion51is a middle portion (a part) of the second electrode50in the X-axis direction. The second discharge portion52is formed in a rod shape and is disposed inside the housing10(that is, inside the internal space S3). A fourth opening14is formed in the housing10. The second support portion51of the second electrode50is disposed inside the fourth opening14so that an outer surface of the second support portion51contacts the inner surface of the fourth opening14. The second support portion51is hermetically joined to the inner surface of the fourth opening14over the entire circumference by a joining material53. Accordingly, a part between the second electrode50and the housing10is hermetically sealed. The joining material53is, for example, a metal brazing material and is, more specifically, a titanium-doped silver brazing material. The housing10is provided with an enclosing hole15for enclosing the discharge gas G1in the internal space S3. An enclosing tube16is connected to the enclosing hole15. The enclosing tube16is formed of, for example, a metal material such as copper. An end portion16aopposite to the enclosing hole15in the enclosing tube16is sealed. A protection member17is attached to the enclosing tube16so as to cover the sealed end portion16a. The protection member17is formed of, for example, a resin material such as rubber. An outer surface of the enclosing tube16is joined to the inner surface of the enclosing hole15over the entire circumference by a joining material18. Accordingly, a part between the enclosing tube16and the housing10is hermetically sealed. The joining material18is, for example, a metal brazing material and is, more specifically, a titanium-doped silver brazing material. When enclosing the discharge gas G1, for example, the discharge gas G1is introduced into the internal space S3through the enclosing tube16and the end portion16aof the enclosing tube16is sealed by pressing and cutting (cutting out) the enclosing tube16while crushing the enclosing tube16. Then, the protection member17is attached to the enclosing tube16. Such a direct enclosing method is advantageous in the following points compared to a trap method using liquid nitrogen. That is, in the trap method, there is concern that the window member may be distorted when liquid nitrogen is placed in the light emitting sealed body. In the direct enclosing method, such a situation can be suppressed. Further, a variation in enclosing pressure may be generated in the trap method, but such a variation can be suppressed in the direct enclosing method. The trap method may be used when enclosing the discharge gas in a glass bulb. In the light emitting sealed body2, the internal space S3is defined by the housing10, the first window portion20, and the second window portion30. In the light emitting sealed body2, the internal space S3is also defined by the first electrode40, the second electrode50, the first insulation member7, the connection member8, and the enclosing tube16. The entire internal space S3is filled with the discharge gas G1. That is, the internal space S3is filled with the discharge gas G1. The discharge gas G1contacts the first window member21, the first frame member22, the second window member31, and the second frame member32. The enclosing pressure (the maximal enclosing pressure) of the discharge gas G1is, for example, about 5 MPa (50 atm). The light emitting sealed body2can withstand an internal pressure of 15 MPa or more. Operation Example of Laser Excitation Light Source In the laser excitation light source1, a negative voltage pulse is applied to the first electrode40by a voltage application circuit (a voltage application unit) (not illustrated) disposed inside the casing6using the second electrode50as a ground potential. Accordingly, electrons are discharged from the first electrode40toward the second electrode50. As a result, an arc discharge is generated and plasma is generated in a gap (intersection C) between the first electrode40and the second electrode50. This plasma is irradiated with the first light L1from the light introduction unit R through the first window member21. Accordingly, the generated plasma is maintained. The second light L2which is the light from the plasma is emitted as the output light to the outside through the second window member31. In the laser excitation light source1, the second light L2is emitted from two second window members31toward both sides of the Y-axis direction. A positive voltage pulse which is a trigger voltage for generating plasma may be applied to the first electrode40. In this case, electrons are discharged from the second electrode50toward the first electrode40. Function and Effect In the light emitting sealed body2, the first electrode40and the second electrode50are provided so as to face each other with the intersection C between the first optical axis A1and the second optical axis A2interposed therebetween. Accordingly, plasma can be generated between the first electrode40and the second electrode50by applying a voltage between the first electrode40and the second electrode50. The housing10is formed of a light shielding material which does not allow the first light L1and the second light L2to be transmitted therethrough. The internal space S3is defined by the housing10, the first window portion20, and the second window portion30and the internal space S3is filled with the discharge gas G1. Accordingly, since a material having a relatively high strength such as a metal material can be selected as the light shielding material, the enclosing pressure of the discharge gas G1can be increased. As a result, high efficiency and high output can be achieved. Further, since the first light L1and the second light L2are not transmitted through a member other than the first window portion20and the second window portion30, the loss of light can be reduced. Also by this, high efficiency and high output can be achieved. Further, the first opening11and the second opening12are disposed so that the first optical axis A1and the second optical axis A2intersect each other. Accordingly, since it is possible to suppress the first light L1from being emitted from the second opening12to be mixed with the second light L2, the quality of the output light can be increased. Thus, according to the light emitting sealed body2, high efficiency and high output can be achieved and the quality of the output light can be increased. The first window member21is formed of sapphire and the second window member31is formed of diamond. Accordingly, for example, light having a long wavelength in the infrared region can be transmitted through the first window member21and the second window member31. Each of the first window member21and the second window member31is formed in a flat plate shape. Accordingly, astigmatism can be suppressed. For example, in a light emitting sealed body in which a pair of electrodes are disposed inside a glass housing having a curved surface, astigmatism is generated when laser light and output light are transmitted through the curved surface, but in the light emitting sealed body2, generation of such astigmatism can be suppressed. The first window member21is hermetically joined to the first frame member22by a titanium-doped silver brazing material and the second window member31is hermetically joined to the second frame member32by a titanium-doped silver brazing material. Accordingly, the first window member21can be satisfactorily joined to the first frame member22and the second window member31can be satisfactorily joined to the second frame member32. More specifically, the present inventors have found that a silver brazing material is repelled and unfamiliar in a configuration in which a window member formed of diamond is joined to a frame member formed of Kovar metal by a silver brazing material not doped with titanium. The present inventors have found that a silver brazing material becomes familiar when the window member is joined to the frame member using a titanium-doped silver brazing material and the window member can be satisfactorily joined to the frame member. The housing10is formed of a metal material. Accordingly, the enclosing pressure of the discharge gas G1can be further increased. Further, since the housing10can be formed by machining, manufacturing tolerance can be reduced and manufacturing accuracy can be improved. The second electrode50is electrically connected to the housing10. Accordingly, the second electrode50can be set to a ground potential by the connection to the housing10and the wiring for setting the ground potential can be omitted. The first electrode40is fixed to the housing10through the first insulation member7and is electrically separated from the housing10. Accordingly, a voltage can be applied to the first electrode40. The first insulation member7includes the main body portion71which holds the first support portion41of the first electrode40and the depression73is formed in the surface71aof the main body portion71. As the enclosing pressure of the discharge gas G1becomes higher, a discharge starting voltage becomes higher according to Paschen's law. For that reason, the voltage applied between the first electrode40and the second electrode50needs to be large. On the other hand, there is concern that an unexpected discharge may be generated inside the housing10due to electrons generated in the vicinity of the triple junction in which the discharge gas G1, the first insulation member7, and the first electrode40are in contact with each other when the applied voltage is large. Regarding this point, in the light emitting sealed body2, the depression73is formed in the surface71aof the main body portion71of the first insulation member7. Accordingly, it is possible to suppress that electrons generated in the triple junction move along the surface71aand reach the cylindrical portion72and to suppress the generation of the unexpected discharge. This point will be described further with reference toFIGS.6A to7B. InFIGS.7A and7B, an electric field distribution generated in the configurations ofFIGS.6A and6Bis illustrated by equipotential lines. Among the equipotential lines, the equipotential lines which are closer to the first electrode40have lower potentials. InFIGS.7A and7B, only the lower side of the drawing is illustrated, but the same electric field distribution is also generated at the upper side. These are also the same forFIGS.8B and9Bto be described later. In a first modified example illustrated inFIG.6B, the depression73is not formed and the surface71aof the main body portion71is flat. Electrons E are apt to be generated in the vicinity of the triple junction P in which the discharge gas G1, the first insulation member7, and the first electrode40are in contact with each other. The electrons E hop and move on the surface of the first insulation member7due to the electric field generated as illustrated inFIG.7Band positively charge the surface of the first insulation member7. The electrons are attracted to this positive charge and secondary electron multiplication may be generated. As a result, the secondary electrons that have acceleratedly increased in amount collide with molecules of the discharge gas G1on the surface of the first insulation member7and release the molecules, so that a creeping discharge may be generated. In contrast, as illustrated inFIG.6A, in the light emitting sealed body2, the depression73is formed in the surface71aof the main body portion71of the first insulation member7. Accordingly, the electrons E generated in the triple junction P can be captured by the depression73. As a result, it is possible to suppress that the electrons E move along the surface71aand reach the cylindrical portion72and to suppress the generation of the above-described unexpected discharge. In the light emitting sealed body2, an electric field is generated as illustrated inFIG.7A. Further, in the light emitting sealed body2, the depression73is disposed so as to be separated from each of the first electrode40and the cylindrical portion72. Accordingly, it is possible to effectively suppress the generation of the unexpected discharge. Modified Examples In a second modified example illustrated inFIG.8A, the depression73is disposed so as to contact the first electrode40and to be separated from the cylindrical portion72. Also in the second modified example, similarly to the above-described embodiment, high efficiency and high output can be achieved and the quality of the output light can be increased. Further, the electrons E generated in the triple junction P can be captured by the depression73and the generation of the unexpected discharge can be effectively suppressed. In the second modified example, an electric field is generated as illustrated inFIG.8B. In a third modified example illustrated inFIG.9A, the first insulation member7includes a covering portion75which surrounds a part of the base end side of the first electrode40in the X-axis direction. An inner peripheral surface75bof the covering portion75surrounds a part of the front end side of the first support portion41and a part of the base end side of the first discharge portion42. A gap75swhich extends to the tapered portion42sof the base end side of the first discharge portion42is formed between the inner peripheral surface75band the outer peripheral surface of the first electrode40. The covering portion75has a shape in which a thickness becomes thinner as it goes toward the second electrode50and an outer peripheral surface75aof the covering portion75becomes a tapered surface. The outer peripheral surface75aof the covering portion75is roughened. In the third modified example, the outer peripheral surface75ais roughened by forming a plurality of grooves76extending around the first electrode40in the outer peripheral surface75a. The plurality of grooves76are arranged side by side in the X-axis direction. Each groove76extends in a circular ring shape so as to surround the first electrode40. The shape of the groove76in a cross-section parallel to the X-axis direction is, for example, a semi-circular shape. Also in the third modified example, similarly to the above-described embodiment, high efficiency and high output can be achieved and the quality of the output light can be increased. Further, electrons generated in the triple junction P are difficult to reach the outer peripheral surface75aof the covering portion75due to the gap75sand the movement of electrons along the outer peripheral surface75acan be suppressed by the plurality of grooves76, so that the generation of the unexpected discharge can be suppressed. That is, in the third modified example, an electric field is generated as illustrated inFIG.9B. Electrons easily move in the direction in which the equipotential lines are arranged (perpendicular to the electric field) and are difficult to move along the equipotential lines. Therefore, in the third modified example, electrons generated in the triple junction P are not easy to move along the outer peripheral surface75aof the covering portion75. In a fourth modified example illustrated inFIG.10, the second electrode50is fixed to the housing10via a second insulation member7A and is electrically separated from the housing10. The second insulation member7A is hermetically fixed to the housing10through a connection member8A. The second insulation member7A is configured and connected similarly to the first insulation member7and the connection member8A is configured and connected similarly to the connection member8. Also in the fourth modified example, similarly to the above-described embodiment, high efficiency and high output can be achieved and the quality of the output light can be increased. Further, since the second electrode50is electrically separated from the housing10, a voltage can be individually applied to the first electrode40and the second electrode50. For example, a positive voltage pulse may be applied to the second electrode50in accordance with a timing at which a negative voltage pulse is applied to the first electrode40. In this case, it is possible to reduce an absolute value of a peak voltage of each of the negative voltage pulse applied to the first electrode40and the positive voltage pulse applied to the second electrode50compared to a case in which the negative voltage pulse is applied only to the first electrode40. As a result, for example, noise caused when generating the negative voltage pulse and the positive voltage pulse can be reduced. In a fifth modified example illustrated inFIG.11, a mirror91is disposed inside the housing10. The mirror91faces the first window member21with the intersection C between the first optical axis A1and the second optical axis A2interposed therebetween. In the fifth modified example, the first light L1passing through plasma in the first light L1irradiated on the plasma from the first window member21is returned to the plasma while being condensed by the mirror91. Also in the fifth modified example, similarly to the above-described embodiment, high efficiency and high output can be achieved and the quality of the output light can be increased. Further, since the first light L1passing through the plasma can be returned to the plasma by the mirror91, higher efficiency and higher output can be achieved. In a sixth modified example illustrated inFIG.12, each of the first window member21and the second window member31has a lens shape. Also in the sixth modified example, similarly to the above-described embodiment, high efficiency and high output can be achieved and the quality of the output light can be increased. Further, the first window member21and the second window member31can have a lens effect and a beam diameter can be decreased. In a seventh modified example illustrated inFIG.13, an insulation member (a space limiting member)93is disposed inside the housing10. The insulation member93is formed in, for example, a block shape by an insulating material such as ceramic. The insulation member93is disposed so as to fill a region other than the optical paths of the first light L1and the second light L2in the internal space S3. As illustrated inFIG.13, the first light L1is directed toward the intersection C while being condensed and the second light L2is directed from the intersection C toward the outside while being widened. The insulation member93includes a first opening93ato which the first light L1is incident and two second openings93bfrom which the second light L2is emitted. Also in the seventh modified example, similarly to the above-described embodiment, high efficiency and high output can be achieved and the quality of the output light can be increased. Further, the generation of the leakage current inside the housing10can be suppressed. Further, since the internal space S3is filled by the insulation member93, it is possible to suppress convection due to the discharge gas G1in the internal space S3. As a result, it is possible to suppress a situation in which the light emitting point shakes due to convection. The present disclosure is not limited to the above-described embodiment and the modified example. For example, the material and shape of each component are not limited to the materials and shapes described above and various materials and shapes can be adopted. The shapes of the first opening11and the second opening12are not limited to the circular shape and may be various shapes. The shapes of the first window member21and the second window member31are not limited to the circular plate shape and may be various shapes. The roughness of the surface71aof the main body portion71and/or the outer peripheral surface75aof the covering portion75is not limited to the case of forming the depression or the groove and may be performed by forming a protrusion or forming an unevenness portion. In the present disclosure, “A and/or B” means “at least one of A and B”. The joining material23may be a silver brazing material not doped with titanium or may be a titanium brazing material or a nickel brazing material. This is also the same in the joining materials18,33,43,53, and83. In the above-described embodiment, two second openings12are formed, but only one second opening12may be formed and three or more second openings12may be formed. A material forming the housing10may be a light shielding material which does not transmit (interrupts) the first light L1and the second light L2and may not be necessarily a metal material. An insulating material, for example, ceramic or the like may be used. The first electrode40and the second electrode50may be omitted. Also in this case, plasma can be generated at a focal point by irradiating the discharge gas G1with the condensed first light L1. The first window member21may be formed of diamond and the second window member31may be formed of sapphire. Alternatively, both the first window member21and the second window member31may be formed of sapphire or diamond. When using UV light, the first window member21and/or the second window member31may be formed of magnesium fluoride or quartz. The first window member21and/or the second window member31may be formed of Kovar glass. The laser light source3may not be provided inside the laser excitation light source1. For example, the laser excitation light source1may include an optical fiber which guides light from a light source disposed at the outside to the mirror4instead of the laser light source3. In this case, the light introduction unit R which cause the first light L1to be incident to the first opening11along the first optical axis A1is configured by the optical fiber, the mirror4, and the optical system5. | 44,809 |
11862923 | DETAILED DESCRIPTION The following detailed description of example implementations refers to the accompanying drawings. The same reference numbers in different drawings may identify the same or similar elements. As described above, a mode field adapter (MFA) is an optical device that can be used to merge or otherwise match core fundamental mode fields of a first fiber (e.g., an input fiber) and a second fiber (e.g., an output fiber). For example, in a fiber laser system such as a cladding pumped high-power fiber laser with a master oscillator fiber amplifier (MOFA) configuration, an MFA is usually needed to match a mode field of a seed laser (e.g., an oscillator) fiber and a core fundamental mode (which may be referred to herein as an LP01 mode) of an amplifier fiber to improve beam quality. For example, an MFA may be used to efficiently expand a core fundamental mode of a single-mode or large-mode-area (LMA) input fiber to match an LP01 mode of a larger LMA fiber and/or to expand the mode field of a polarization-maintaining (PM) fiber to match the LP01 mode of a polarization-maintaining LMA (PLMA) fiber. Furthermore, an MFA may be bidirectional and can be used in reverse to compress a core fundamental mode field when the output end is used as an input. Accordingly, when an MFA is spliced into a beam delivery system or another high-power setup, signal transmission and/or beam quality may be improved relative to a standard splice that is typically associated with high insertion loss and degraded beam quality (e.g., a poor M2 factor, which refers to a beam propagation ratio or beam quality factor that represents a degree of variation of a beam from an ideal Gaussian beam). However, existing MFA designs are generally limited to matching the core fundamental mode fields of the two fibers that are connected using the MFA. Accordingly, existing MFA designs either cannot handle high-power cladding light or have a limited ability to handle high-power cladding light, which makes existing MFA designs unsuitable for applications that carry high-power light in the cladding in addition to light carried in the fiber core. For example, one existing MFA design is an MFA with a thermally expanded core (TEC), which has been widely used in some single-mode fibers. However, an MFA with a TEC does not work well for many LMA fibers, especially when the LMA fibers have relatively large cores and a low numerical aperture (NA). Accordingly, MFA designs that are based on the TEC technique have applications that are limited to a few fiber types. Furthermore, in some cases, an MFA with a TEC and fiber tapering may be used, where combining the TEC and fiber tapering techniques can work for a wider range of fibers. However, in cases where the cladding size of the input fiber is the same as or larger than the cladding size of the output fiber, the input side will have a larger cladding diameter at the splice point than the output side, which may prevent an MFA with TEC and fiber tapering from working when high-power cladding light is present. Furthermore, an MFA with fiber tapering only has similar drawbacks, in that the cladding sizes are usually mismatched at the splice point such that an MFA with fiber tapering may fail to sufficiently preserve high-power cladding light (e.g., a beam parameter product (BPP) may be a few time higher, which significantly worsens beam quality and incurs significant loss). Some implementations described herein relate to a high cladding power MFA that matches a core fundamental mode of a first fiber (e.g., a single-mode or LMA input fiber) to an LP01 mode of a second fiber (e.g., a larger LMA output fiber) and matches a cladding size of the first fiber to a cladding size of the second fiber in order to handle high-power cladding light and preserve brightness. For example, in some implementations, the MFA may include a first fiber that includes a core associated with a fundamental mode field and a second fiber that includes a core associated with a fundamental mode field that matches the fundamental mode field of the first fiber at a splice point between the first fiber and the second fiber (e.g., corresponding to a waist of the first fiber and a waist of the second fiber). For example, as described herein, the core fundamental mode field of an optical fiber may be related to a mode field diameter (MFD), which is a measure of the width of an irradiance distribution (e.g., an optical power per unit area, across the end-face of a single-mode fiber) that may be considered analogous to a 1/e{circumflex over ( )}2 measure of a beam diameter for a beam propagating in free space. Accordingly, in cases where the core of the first fiber and the core of the second fiber have the same numerical aperture (NA), the core mode fields may match when the core diameters are the same. Alternatively, in cases where the cores of the first fiber and the second fiber have different NAs, the MFA may match the core fundamental mode (or LP01 mode) fields of the input and output fibers. Furthermore, as described herein, the first fiber may include a cladding, surrounding the core of the first fiber, that is etched (e.g., to remove material from the cladding) such that a diameter of the cladding surrounding the core of the first fiber decreases adiabatically toward a waist of the first fiber. Furthermore, the second fiber may include a cladding that surrounds the core of the second fiber, where the core and the cladding surrounding the core of the second fiber may be tapered (e.g., pulled to a desired size after the second fiber is heated) such that a diameter of the cladding surrounding the core of the second fiber matches the diameter of the cladding of the first fiber at the waist of the second fiber and increases adiabatically from the waist of the second fiber. In this way, the MFA described herein has a design that may preserve light traveling in the claddings (e.g., ensure that there is no loss of cladding light) and conserve brightness of the cladding light. FIG.1is a diagram of an example high cladding power MFA100described herein. As shown inFIG.1, the high cladding power MFA includes an input fiber spliced to an output fiber at a splice point160that corresponds to a waist of the input fiber and a waist of the output fiber. As shown inFIG.1, the input fiber and the output fiber each include a core110that is surrounded by a first (inner) cladding120, a second (outer) cladding130surrounding the first cladding120, and a coating140surrounding the second cladding130. Furthermore, inFIG.1, reference number150depicts a cross-sectional view of the input fiber and/or the output fiber, where in one example arrangement the core110may have a thirty (30) micrometers (μm) diameter, the first cladding120may have a 440 μm diameter, the second cladding130may have a 500 μm diameter, and the coating140may have a 650 μm diameter. However, it will be appreciated that these diameters are examples only, and that other suitable dimensions may be used. For example, the diameter of the first cladding120may generally range from 0.04 millimeters to more than 2 millimeters, and the diameters of the core110and second cladding130may be varied accordingly. Furthermore, although the example high power MFA100illustrated inFIG.1is a double cladding fiber, it will be appreciated that the input fiber and the output fiber may have one cladding layer, two cladding layers, three cladding layers, or more than three cladding layers. In general, where the input fiber and/or output fiber have multiple claddings, the multiple claddings may be referred to as a first cladding, a second cladding, a third cladding, and so on, from inside to outside (e.g., an innermost cladding may be referred to as the first cladding, a cladding surrounding the innermost cladding may be referred to as the second cladding, and so on). Furthermore, in some implementations, the input fiber and the output fiber may have different numbers of cladding layers, the cladding layers may have different sizes, and/or the cladding layers may have different shapes (e.g., circular, hexagonal, octagonal, and/or D-shaped). In some implementations, as shown inFIG.1, the high cladding power MFA100may have a design in which the input fiber has a coating140-1that is stripped over a certain length, and the claddings120-1and130-1are then adiabatically etched down to the designed diameters (e.g., by removing material from the claddings120-1,130-1). The etched regions of the claddings120-1and130-1may then be fire polished. In some implementations, the etching of the claddings120-1,130-1is smooth (e.g., adiabatic) to ensure that there is no loss and to conserve brightness. Accordingly, as described herein, the high cladding power MFA100may have design in which any cladding that could carry power is adiabatically etched in order to maintain brightness of light carried in such cladding(s). Furthermore, as shown, the output fiber has a coating140-2that is also stripped over a certain length before the outer cladding130-2is adiabatically etched away and fire polished over the etched sections to smooth the glass surface that is roughened by the etching. In some implementations, the inner cladding120-2and the core110-2of the output fiber are then adiabatically tapered such that the diameter of the inner cladding120-2matches the diameter of the inner cladding120-1of the etched input fiber. During the tapering of the inner cladding120-2, the core110-2is also adiabatically tapered. For example, to taper the inner cladding120-2and the core110-2of the output fiber, the output fiber may be heated and pulled to a desired size such that the inner cladding120-2and the core110-2are tapered at the same ratio (e.g., the tapering does not change a ratio between the inner cladding120-2and the core110-2). The input fiber is then spliced to the output fiber at the splice point160, and the sample is sealed within a package170(e.g., to protect the exposed components in the area where the coatings140-1,140-2were removed from the input fiber and the output fiber). In some implementations, as described herein, a method for making the high cladding power MFA100may include stripping the coating140-1of the input fiber, adiabatically etching away one or more outer claddings130-1(if any) of the input fiber, and adiabatically etching the inner cladding120-1to a designed size (e.g., a diameter that is matched to a diameter of the inner cladding120-2of the output fiber at the splice point160). For example, in some implementations, the outer cladding(s)130-1and the inner cladding120-1of the input fiber may be adiabatically etched (e.g., to remove material) using an acid etching process, a CO2laser ablation process, a mechanical machining process, and/or another suitable material removal process. In general, when the outer cladding(s)130-1and the inner cladding120-1are etched, material is removed only from the outer cladding(s)130-1and the inner cladding120-1, and the core110-1is unaffected, whereby the etching can be used to change or otherwise control a ratio between the core110-1and the inner cladding120-1. In some implementations, glass surfaces of the etched claddings120-1,130-1may be rough after the etching, whereby the etched sections of the claddings120-1,130-1may be fire polished, CO2laser polished, mechanically polished, and/or otherwise polished to smooth the roughened surfaces of the etched claddings120-1,130-1. The input fiber may then be cleaved at a waist (e.g., a location along the input fiber where the diameter has a target value). In some implementations, the coating140-2may be similarly stripped from the output fiber, and the outer cladding(s)130-2(if any) of the output fiber are adiabatically etched away with acid, laser ablation, mechanical machining, and/or other suitable techniques. The etched sections of the outer cladding(s)130-2, if any, are then fire polished or otherwise polished to smooth a glass surface that may have been roughened by the etching. In some implementations, the inner cladding120-2and the core110-2of the output fiber are then adiabatically tapered to the designed size (e.g., by heating the output fiber and pulling the output fiber until the inner cladding120-2and the core110-2have a desired size), and the output fiber is then cleaved at a waist of the output fiber. The input fiber is then spliced to the output fiber at the splice point160and properly packed (e.g., sealed within a package170). Accordingly, by carefully designing the parameters (e.g., selecting diameters, etch lengths, tapering parameters, and/or other parameters that satisfy an adiabatic condition), the LP01 mode fields of the respective cores110-1,110-2and the diameters of the inner claddings120-1,120-2of the input and output fibers may be matched at the splice point160, which may allow the high cladding power MFA100to maintain high beam quality in the cores110-1,110-2and also allow high power cladding light to pass through the inner claddings120-1,120-2with little or no loss or degradation. For example, using a combination of etching and tapering as described herein, the MFA100may be designed to match core fundamental modes and cladding sizes for almost any combination of input and output fibers. Furthermore, in some implementations, the high cladding power MFA100may maintain high beam quality in the cores110-1,110-2and allows high power cladding light to pass through the inner claddings120-1,120-2regardless of whether the cores110-1,110-2have the same NA or different NAs. For example, the diameters of the cores110-1,110-2may match at the splice point160in cases where the cores110-1,110-2have the same NA, or the mode fields of the fundamental modes (LP01 modes) may be matched at the splice point160when the cores110-1,110-2have different NAs. In one example, where the core110-1of the input fiber and the core110-2of the output fiber have the same NA and different diameters, the input fiber and the output fiber may be adiabatically etched and/or adiabatically tapered such that the diameters of the cores110-1,110-2and the diameters of the inner claddings120-1,120-2match at the splice point. For example, assuming that the core110-1and the inner cladding120-1of the input fiber have respective diameters of 12 μm and 500 μm and that the core110-2and the inner cladding120-2of the output fiber have respective diameters of 30 μm and 500 μm, the input fiber may be adiabatically etched such that the core110-1and the inner cladding120-1of the input fiber have respective diameters of 12 μm and 200 μm at the splice point160that corresponds to the waist of the input fiber. Furthermore, the output fiber may be adiabatically tapered such that the core110-2and the inner cladding120-2of the output fiber have respective diameters of 12 μm and 200 μm at the splice point160that corresponds to the waist of the input fiber. In another example, if the core110-1and the inner cladding120-1of the input fiber have respective diameters of 20 μm and 500 μm and the core110-2and the inner cladding120-2of the output fiber have respective diameters of 30 μm and 500 μm, then the input fiber and the output fiber may be adiabatically etched and/or tapered such that the cores110-1,110-2each have a diameter of 20 μm at the splice point160and the inner claddings120-1,120-2each have a diameter of 333 μm at the splice point160. Alternatively, in cases where the cores110-1,110-2have different NAs, the mode field diameter may be determined based on a wavelength. In one example, the core110-1and the inner cladding120-1of the input fiber have respective diameters of 12 μm and 500 μm, the core110-1of the input fiber has an NA of 0.065, the core110-2and the inner cladding120-2of the output fiber have respective diameters of 30 μm and 450 μm, the core110-2of the output fiber has an NA of 0.1, and the wavelength is 1080 nanometers (nm). In this example, the inner cladding120-1of the input fiber may be adiabatically etched such that the core110-1and the inner cladding120-1have respective diameters of 12 μm and 258 μm at the splice point160that corresponds to the waist of the input fiber. Furthermore, the inner cladding120-2and the core110-2of the output fiber may be adiabatically tapered such that the core110-2and the inner cladding120-2of the output fiber have respective diameters of 17.2 μm and 258 μm at the splice point160that corresponds to the waist of the input fiber. In this case, the fundamental mode fields of the cores110-1,110-2match, and the sizes of the inner claddings120-1,120-2match, as the mode field diameters are the same for a 12 μm diameter and a 0.065 NA and a 17.2 μm diameter and a 0.1 NA at a wavelength of 1080 nm. Accordingly, as shown inFIG.1and described herein, the high cladding power MFA100may match the core fundamental mode of the input fiber to the core fundamental mode of the output fiber, and may also match inner cladding sizes of the input fiber and the output fiber to handle high-power cladding light that may be carried in the inner claddings120-1,120-2and preserve brightness of the high-power cladding light. For example, as described herein, the input fiber may include a core110-1associated with a fundamental mode field and a cladding120-1, surrounding the core110-1of the first fiber, with a diameter that decreases adiabatically toward a waist of the first fiber. Furthermore, the high cladding power MFA includes an output fiber with a core110-2associated with a fundamental mode field that matches the fundamental mode field of the input fiber at a waist of the output fiber. As shown, the output fiber also includes a cladding120-2, surrounding the core110-2of the output fiber, with a diameter that matches the diameter of the cladding120-1of the input fiber at the waist of the output fiber, where the diameter of the cladding120-2of the output fiber increases adiabatically from the waist of the output fiber. Accordingly, in cases where the claddings120-1,120-2are arranged to carry high-power cladding light, the diameter of the inner cladding120-1of the input fiber decreases adiabatically and the diameter of the inner cladding120-2of the output fiber increases adiabatically to preserve brightness of cladding light carried in the claddings120-1,120-2. Furthermore, in cases where the input fiber and/or output fiber include one or more outer claddings (e.g., surrounding an inner cladding120), the outer cladding(s) may have diameters that increase and/or decrease adiabatically. Furthermore, as shown, the high cladding power MFA may include a package170sealing at least a first length over which the inner cladding120-1of the input fiber decreases in size and a second length over which the inner cladding120-2of the output fiber increases in size. For example, the input fiber and the output fiber include respective coatings140-1,140-2that are stripped over at least the first length over which the inner cladding120-1of the input fiber decreases in size and the second length over which the inner cladding120-2of the output fiber increases in size, and the package170may seal at least the area where the respective coatings140-1,140-2are stripped. As indicated above,FIG.1is provided as an example. Other examples may differ from what is described with regard toFIG.1. The number and arrangement of devices shown inFIG.1are provided as examples. In practice, there may be additional devices, fewer devices, different devices, or differently arranged devices than those shown inFIG.1. Furthermore, two or more devices shown inFIG.1may be implemented within a single device, or a single device shown inFIG.1may be implemented as multiple, distributed devices. Additionally, or alternatively, a set of devices (e.g., one or more devices) shown inFIG.1may perform one or more functions described as being performed by another set of devices shown inFIG.1. FIGS.2A-2Care diagrams of an example process200for fabricating a high cladding power MFA as described herein. In some implementations, as shown inFIG.2A, and by reference number210, a first fiber (e.g., an input fiber) may include a core, an inner cladding surrounding the core, an outer cladding surrounding the inner cladding, and a coating surrounding the outer cladding. As shown by reference number212, the coating of the first fiber may be stripped over a desired length. As further shown inFIG.2A, and by reference number214, the inner cladding and the outer cladding of the first fiber are adiabatically etched to a designed size. For example, in some implementations, the outer cladding and the inner cladding of the first fiber may be adiabatically etched (e.g., to remove material) using an acid etching process, a CO2laser ablation process, a mechanical machining process, and/or another suitable material removal process. In general, when the outer cladding and the inner cladding are etched, material is removed only from the claddings, and the core of the first fiber is unaffected, whereby the etching can be used to change or otherwise control a ratio between the core and the inner cladding of the first fiber. In some implementations, glass surfaces of the etched claddings1may be rough after the etching. Accordingly, as shown by reference number216, the etched sections of the claddings may be fire polished, CO2laser polished, mechanically polished, and/or otherwise polished to smooth the roughened surfaces of the etched claddings. As further shown by reference number216, the first fiber may then be cleaved at a waist (e.g., a location along the first fiber where the diameter has a target value). In some implementations, as shown inFIG.2B, and by reference number220, a second fiber (e.g., an output fiber) may include a core, an inner cladding surrounding the core, an outer cladding surrounding the inner cladding, and a coating surrounding the outer cladding. As shown by reference number222, the coating of the second fiber may be stripped over a desired length. As shown by reference number224, one or more outer claddings (if any) of the output fiber are adiabatically etched away with acid, laser ablation, mechanical machining, and/or other suitable techniques. As shown by reference number225, any etched sections of the outer cladding(s) are then fire polished or otherwise polished to smooth a glass surface that may have been roughened by the etching. As shown by reference number227, the inner cladding and the core of the output fiber are then adiabatically tapered to the designed size (e.g., by heating the output fiber and pulling the output fiber until the inner cladding and the core have a desired size). As shown by reference number229, the output fiber is then cleaved at a waist of the output fiber. Accordingly, as shown inFIG.2C, and by reference number230, the input fiber is then spliced to the output fiber at a splice point and properly packed (e.g., sealed within a package). As indicated above,FIGS.2A-2Care provided as an example. Other examples may differ from what is described with regard toFIGS.2A-2C. For example,FIGS.2A-2Cillustrate an example process200where the high cladding power MFA is fabricated by etching the input fiber to change a core-to-inner cladding ratio of the input fiber and tapering the inner cladding and the core of the output fiber to maintain a core-to-inner cladding ratio of the output fiber. In other examples, both the input fiber and the output fiber may be adiabatically etched (e.g., the cores of the input and output fiber are unchanged), the cladding of the input fiber may be etched and the cladding of the output fiber may be tapered, the cladding of the input fiber may be etched and the cladding of the output fiber may be etched (either to a single diameter or in to a tapered configuration) before the core and cladding of the (etched) output fiber are tapered, the cladding and the core of both the input fiber and the output fiber may be tapered, or a combination of etching and tapering may be used for both the input fiber and the output fiber. FIG.3is a diagram of an example optical system300that includes a high cladding power MFA100as described herein. For example, the optical system300shown inFIG.3may be an example of a cladding-pumped high-power fiber laser with a master oscillator fiber amplifier (MOFA) configuration, where the MFA100may be needed in order to match the mode field of a seed laser (e.g., a fiber laser oscillator320) and an LP01 mode of an amplifier330to improve beam quality. For example, as shown inFIG.3, the optical system300may include a pump combiner310, a fiber laser oscillator320, and an amplifier330, where the oscillator320includes a fiber that has a much smaller core than the amplifier330, and the fibers of the oscillator320and the amplifier330both carry high power cladding light. Accordingly, in some implementations, the high cladding power MFA may act as a bridge fiber between the oscillator320and the amplifier330, matching both the core fundamental modes and the diameters of the innermost claddings of the oscillator320and the amplifier330. In this way, the high cladding power MFA100may handle high-power cladding light carried in the innermost claddings of the oscillator320and the amplifier330such that beam quality and power are maintained in both the cores and the claddings surrounding the respective cores. Accordingly, as described herein, the high cladding power MFA100may be used in an optical system that includes a first optical device having a core to carry core light and a cladding, surrounding the core, to carry high-power cladding light and a second optical device having a core to carry core light and a cladding, surrounding the core, to carry high-power cladding light, where the cores of the first optical device and the second optical device have different fundamental mode fields. For example, the high cladding power MFA100may be coupled between the first optical device and the second optical device and may include an input fiber having a core and a cladding, surrounding the core of the input fiber, with a diameter that decreases adiabatically. In addition, the high cladding power MFA may include an output fiber having a core and a cladding, surrounding the core of the output fiber, with a diameter that matches the diameter of the cladding of the input fiber at a waist of the output fiber. Accordingly, a core fundamental mode of the input fiber matches a core fundamental mode of the output fiber at the waist of the output fiber, and the diameter of the cladding of the output fiber increases adiabatically such that beam quality and power are maintained in both the cores and the claddings surrounding the respective cores. For example, in the optical system300shown inFIG.3, the first optical device may be a fiber laser oscillator320arranged to receive cladding light from a pump combiner310. The fiber laser oscillator320may absorb a portion of the received cladding light, and may transmit the rest of the cladding light (the unabsorbed portion) toward the high cladding power MFA100. Furthermore, the second device may be an amplifier330that is arranged to receive the cladding light from the high cladding power MFA110, where most cladding light will be absorbed in the amplifier330and a remaining portion of the cladding light is transmitted to a feeding fiber (not explicitly shown). Simultaneously, the optical system300will transmit light in the core of fiber laser oscillator320into the cores of the high cladding power MFA100, through the cores of the high cladding power MFA100, into the core of the amplifier330(where the power in the core is amplified by the power in the cladding), and into a feeding fiber (not explicitly shown). As indicated above,FIG.3is provided as an example. Other examples may differ from what is described with regard toFIG.3. The number and arrangement of devices shown inFIG.3are provided as examples. In practice, there may be additional devices, fewer devices, different devices, or differently arranged devices than those shown inFIG.3. Furthermore, two or more devices shown inFIG.3may be implemented within a single device, or a single device shown inFIG.3may be implemented as multiple, distributed devices. Additionally, or alternatively, a set of devices (e.g., one or more devices) shown inFIG.3may perform one or more functions described as being performed by another set of devices shown inFIG.3. FIG.4is a flowchart of an example method400for making a high cladding power mode field adapter as described herein. As shown inFIG.4, method400may include stripping, over a first length, a coating from an input fiber (block410). As further shown inFIG.4, method400may include etching at least an inner cladding of the input fiber adiabatically over a portion of the first length such that a core-to-cladding ratio of the input fiber changes over the portion of the first length (block420). In some implementations, the inner cladding and any outer claddings of the input fiber may be etched using an acid etching process, a laser ablation process, a mechanical machining process, and/or another suitable process. As further shown inFIG.4, method400may include stripping, over a second length, a coating from an output fiber (block430). As further shown inFIG.4, method400may include tapering an inner cladding and a core of the output fiber adiabatically over a portion of the second length such that a core-to-cladding ratio of the output fiber is constant over the portion of the second length (block440). In some implementations, in cases where the output fiber includes one or more outer claddings, the one or more outer claddings of the output fiber may be etched using an acid etching process, a laser ablation process, a mechanical machining process, and/or another suitable process. In some implementations, the output fiber may include a core with a diameter that changes over the portion of the second length. In some implementations, after etching the inner cladding of the input fiber (and any outer cladding(s) of the input fiber, if present), the etched cladding(s) of the input fiber may be polished, and the input fiber may be cleaved at a waist of the input fiber. Furthermore, in cases where the output fiber includes one or more outer claddings, the one or more outer claddings of the output fiber may be polished after the one or more outer claddings are etched, and the output fiber may be cleaved at a waist of the output fiber. For example, in some implementations, the etched cladding(s) of the input fiber and/or the output fiber may be polished using a fire polishing process, a laser polishing process, a mechanical polishing process, or another suitable polishing process. As further shown inFIG.4, method400may include splicing the input fiber to the output fiber at a splice point that corresponds to the waist of the input fiber and the waist of the output fiber (block450). In some implementations, the input fiber may be spliced to the output fiber after the input fiber and the output fiber are cleaved at the respective waists. In some implementations, as described herein, a core fundamental mode of the input fiber matches a core fundamental mode of the output fiber at the splice point, and the inner cladding of the input fiber and the inner cladding of the output fiber include respective diameters that match at the splice point. Furthermore, as described herein, the input fiber is etched adiabatically and the output fiber is tapered adiabatically to preserve brightness of cladding light carried in one or more claddings of the input fiber and one or more claddings of the output fiber. In some implementations, after the input fiber is spliced to the output fiber at the splice point, at least the first length and the second length may be sealed within a package. AlthoughFIG.4shows example blocks of method400, in some implementations, method400includes additional blocks, fewer blocks, different blocks, or differently arranged blocks than those depicted inFIG.4. Additionally, or alternatively, two or more of the blocks of method400may be performed in parallel. The foregoing disclosure provides illustration and description, but is not intended to be exhaustive or to limit the implementations to the precise forms disclosed. Modifications and variations may be made in light of the above disclosure or may be acquired from practice of the implementations. Furthermore, any of the implementations described herein may be combined unless the foregoing disclosure expressly provides a reason that one or more implementations may not be combined. Even though particular combinations of features are recited in the claims and/or disclosed in the specification, these combinations are not intended to limit the disclosure of various implementations. In fact, many of these features may be combined in ways not specifically recited in the claims and/or disclosed in the specification. Although each dependent claim listed below may directly depend on only one claim, the disclosure of various implementations includes each dependent claim in combination with every other claim in the claim set. As used herein, a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members. As an example, “at least one of: a, b, or c” is intended to cover a, b, c, a-b, a-c, b-c, and a-b-c, as well as any combination with multiple of the same item. No element, act, or instruction used herein should be construed as critical or essential unless explicitly described as such. Also, as used herein, the articles “a” and “an” are intended to include one or more items, and may be used interchangeably with “one or more.” Further, as used herein, the article “the” is intended to include one or more items referenced in connection with the article “the” and may be used interchangeably with “the one or more.” Furthermore, as used herein, the term “set” is intended to include one or more items (e.g., related items, unrelated items, or a combination of related and unrelated items), and may be used interchangeably with “one or more.” Where only one item is intended, the phrase “only one” or similar language is used. Also, as used herein, the terms “has,” “have,” “having,” or the like are intended to be open-ended terms. Further, the phrase “based on” is intended to mean “based, at least in part, on” unless explicitly stated otherwise. Also, as used herein, the term “or” is intended to be inclusive when used in a series and may be used interchangeably with “and/or,” unless explicitly stated otherwise (e.g., if used in combination with “either” or “only one of”). Further, spatially relative terms, such as “below,” “lower,” “above,” “upper,” “inner,” “outer,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the apparatus, device, and/or element in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. | 35,431 |
11862924 | DETAILED DESCRIPTION Embodiments described herein are directed to the realization of low noise lasers in photonic integrated circuits with improved performance and additional functionality over currently available devices. In the following detailed description, reference is made to the accompanying drawings which form a part hereof, wherein like numerals designate like parts throughout, and in which are shown by way of illustration embodiments in which the subject matter of the present disclosure may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of embodiments is defined by the appended claims and their equivalents. The description may use perspective-based descriptions such as top/bottom, in/out, over/under, and the like. Such descriptions are merely used to facilitate the discussion and are not intended to restrict the application of embodiments described herein to any particular orientation. The description may use the phrases “in an embodiment,” or “in embodiments,” which may each refer to one or more of the same or different embodiments. Furthermore, the terms “comprising,” “including,” “having,” and the like, as used with respect to embodiments of the present disclosure, are synonymous. For the purposes of the present disclosure, the phrase “A and/or B” means (A), (B), or (A and B). For the purposes of the present disclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C). A photonic integrated circuit (PIC) or integrated optical circuit is a device that integrates multiple photonic functions and as such is analogous to an electronic integrated circuit. The term “coupled with,” along with its derivatives, may be used herein. “Coupled” may mean one or more of the following. “Coupled” may mean that two or more elements are in direct physical, electrical, or optical contact. However, “coupled” may also mean that two or more elements indirectly contact each other, but yet still cooperate or interact with each other, and may mean that one or more other elements are coupled or connected between the elements that are said to be coupled with each other. FIG.1(prior art) shows a top-down view of a semiconductor laser105that is stabilized by injection-locking to a high-quality factor (high-Q) resonator110providing low noise semiconductor laser100. The forward propagating (as indicated by solid-line arrows) light from laser105passes through phase control130(to be described in more detail below) and coupler/splitter115before emerging as output140. Part of the light is coupled via coupler/splitter115to the resonator110. This resonator can be a circular resonator (e.g. micro-ring, micro-disk, micro-sphere, toroid, rod) or other type of resonator. Such resonators are typically characterized by the quality factor Q, where higher Q signifies a higher-quality resonator. The Q factor can be defined in multiple ways, one of which is determined in terms of the relative linewidth of the resonance as follows: the Q factor is the ratio of the resonance frequency v0and the full width at half-maximum (FWHM) bandwidth δv of the resonance. We define high-Q resonators as resonators whose Q value exceeds 1M (million), with best performing resonators achieving Q>1 B (billion). A small part of laser105's output is coupled via115to resonator110. Resonator110is also defined by a roundtrip time, i.e. time needed for light to make one full roundtrip. During each cycle of propagation around resonator110, light accumulates phase, and at certain frequencies (corresponding to resonances) the phase of new incoming light combines coherently with the light that has already made one or more roundtrips inside the resonator. This can lead to significant power buildup and storing of coherent photons. Each waveguide linking or making up elements of laser100is characterized by some level of scattering, either due to material itself or processing related roughness, and such scattering causes loss. Part of the scattered light is coupled into the waveguide, but may have the opposite direction of propagation, as suggested in the figure by dashed-line arrow. Even though in a high-Q resonator, such scattering and loss are generally low, due to the high-power buildup at resonance wavelengths, the backscattered power can be significant. Such filtered, back-scattered light can be injected back into the laser105, effectively stabilizing it, improving both the RIN and phase/frequency noise. For best performance, the operating frequency of the laser105and the resonant frequency of the high-Q resonator110have to be controlled and adjusted properly, which can be done either on the laser end using current injection, thermal and/or other mechanisms of tuning generally employed in semiconductor lasers, or at the resonator. In the case where adjustment is done by tuning the resonator, a suitable tuning element120can be incorporated. Such tuning mechanisms can be thermal, electro-optical, strain/stress based and/or others. As the laser is sensitive to the phase of the backscattered light providing feedback, another phase tuning element130is typically introduced. Phase tuning element130can be a discrete tuning element as shown inFIG.1, or it can be a part of the laser105. Various tuning elements can be utilized, depending on the exact way the whole apparatus is made. If components are free space based, then the phase tuning can be obtained by controlling the distance between elements. If components are fiber coupled, then the phase tuning element can be piezo based, thermal, and/or some other type of fiber coupled phase tuner. In the case where the functionality of100is at least partly made in a PIC, then the tuning element can be any type of common phase tuning element used in PICs such as thermal, carrier, electro-optic based and/or others. FIG.2shows a top-down view of one embodiment200of the current invention in which a semiconductor laser (or, parts of a semiconductor laser that at least provide optical gain functionality and one of the cavity mirrors)205is stabilized by injection-locking to (or, by forming a low noise laser by coupling to) a high-quality factor (high-Q) resonator210. Element205is described in more detail with the help ofFIG.4below. In contrast toFIG.1where the resonator is utilized in an all-pass configuration and the laser output is at140, here the resonator210is utilized in an add-drop configuration and the primary laser output is at245while the secondary output240can optionally be used for monitor functionality. The difference in performance between all-pass and add-drop resonators is explained later with the help ofFIG.5. The add-drop resonator210is characterized by two coupler/splitter structures215and216whose splitting ratios are optimization parameters depending on propagation loss, coupler/splitter loss and other sources of loss inherent to the resonator. Depending on the level of noise and power desired to be achieved in the system, the ring resonator can be designed to operate in “under-coupled” or “over-coupled” regimes, terms known to those of skill in the art. For maximum noise reduction the high Q ring resonator is typically operated in an under-coupled regime, while for maximum laser output power the high Q ring resonator is typically operated in an over-coupled regime. As the regime of operation (e.g. under-coupled, critically-coupled or over-coupled) depends both on the coupler/splitter coupling value, loss and the internal resonator losses including the propagation loss, in some embodiments the coupler/splitter structure215and216can be made tunable or adjustable. In this way, the resonator can be controlled to operate in the desired regime even if process variation is large. Tunable coupler/splitters can be made in various ways, including e.g. two couplers with phase control between at least one of the arms connecting them, piezo based or others. The forward propagating (as indicated by solid-line arrows) light from laser205passes through phase control230and coupler/splitter215before reaching monitor output240. Part of the light is coupled via coupler/splitter215to the resonator210. This resonator can be a ring-resonator or other type of resonator providing add and drop port functionality. A small part of laser output is coupled via215to resonator210and, as discussed above for laser100, there can be significant power buildup and storing of coherent photons where parts of the filtered, back-scattered light can be injected back into semiconductor laser205effectively stabilizing laser205, improving both the RIN and phase/frequency noise. The level of backscattering can be engineered by introducing intentional scattering that can be broadband or frequency selective. This is typically done by introducing defects, non-periodic or periodic structures that can be discrete, distributed, pseudo-randomized and/or randomized. In this way the performance can be more deterministically engineered compared to using material and fabrication imperfection to provide backscattered signal as the latter largely depends on the fabrication process so can result with larger variation. In some other embodiments, the backscattering at splitter/coupler provides sufficient and controlled back-reflection. Power build up in the resonator210means that the average power in the resonator can be significantly higher than the power that couples into the resonator each cycle. In other words, although only a small amount of forward propagating power couples into the resonator at splitter/coupler215, due to very small losses in each roundtrip, that power can constructively accumulate at resonance resulting in significant average power buildup, and the amount of power that couples out again, after traveling around the resonator (in a clockwise direction inFIG.2) can be of comparable value to the forward propagating light which travels directly from the laser and is not coupled into the resonator at all. If those two components of power are of opposite phase (a coupler/splitter typically introduces additional phase shift for cross-coupled light) they will interfere destructively resulting in only small amounts of power reaching output240. The situation is different at coupler/splitter216as there is no direct laser light interfering with power coupled out of the resonator, so greater amounts of signal are outcoupled and245acts as primary laser output power point. Phase tuner230and/or resonator tuner220, corresponding to elements130and120inFIG.1, serve the same purpose of optimizing the injection-locking and/or feedback conditions. The light output at245is very stable, first because laser205has been stabilized by injection-locking by the optical light returned to it from the resonator210, and then because of the additionally filtering action, the add-drop frequency response to be described below with reference toFIG.5, of the resonator210, significantly reducing both the amplitude and phase/frequency noise. The injection locking generally reduces the lower-frequency range noise, while the add-drop filter characteristics reduces the high-frequency range noise, which in combination can reduce the laser linewidth at output245by multiple orders of magnitude as will be described with the help ofFIG.5. FIG.3shows a top-down view of one embodiment300of the current invention in which low noise laser301(essentially the same as apparatus200described in detail with respect toFIG.2) is optically connected to modulator305. Modulator305can be any type of common modulator, modulating amplitude, phase, or frequency, or it can be of a more advanced type providing e.g. both amplitude and phase modulation to enable utilization of higher-order modulation formats. Modulator305accepts the low-noise signal from low noise laser301as an optical carrier, and imprints data of interest315on the optical carrier producing signal322at the output. Additional optical components can be added (not shown) such as a pre-amplifier before the modulator, or a booster amplifier after the modulator, to control the output power. The control may include switching the output off without turning off the laser, preserving the low noise operation for applications requiring a fast switched source. In yet another embodiment, photodetectors can be connected to one or more laser outputs, or another splitter/coupler can be utilized to tap some amount of power to a photodetector. Such photodetectors can be used to provide easier control of the apparatus including the alignment between the laser and the resonator, control of the output power (e.g. constant output power across full operating temperature range) or others. FIG.4shows some embodiments410,430,450,470of the semiconductor laser205that may be used in apparatus200. In other embodiments, not shown inFIG.4, semiconductor laser205is a standalone semiconductor laser such as a distributed feedback (DFB) laser, distributed Bragg reflector (DBR) laser, widely tunable laser Fabry-Pérot and/or other type of standard commercial laser. A standalone semiconductor laser would provide lasing without interacting with other components, i.e. it comprises both the gain medium and the resonator (both mirrors) and the feedback from resonator210provides filtered laser light to be injected into the standalone laser to improve the noise performance. In embodiments such as those shown inFIG.4, semiconductor laser205utilizes one or more external components to close the laser cavity as illustrated with the help ofFIG.4. Each of the structures shown can be connected to resonator210to provide one of the mirrors necessary to form the full laser cavity. Examples of such structures include: (1) reflective semiconductor amplifier (RSOA) (410) comprising one broadband mirror and laser gain, (2) laser gain with one mirror formed by Bragg grating (430), (3) laser gain with one mirror formed by ring resonator (450) where this ring resonator, in some embodiments, can be tuned and (4) laser gain with one broadband mirror and one or more tunable ring resonators (470), and/or other types providing laser gain with at least one mirror with or without frequency selective elements such as gratings, ring resonators, Mach-Zehnder interferometers (MZIs) and/or other types of filters. In all such embodiments, the block205would not lase unless also optically coupled to resonator210whose back-reflection is used to form the second mirror. Resonator210, being in effect a part of the whole laser cavity, provides a high-level of filtering inside the laser enhancing the performance and providing both low- and high-frequency filtering of laser noise at the output245. FIG.5illustrates the different noise filter responses of an all-pass filter510and an add-drop filter550, and demonstrates the superiority of latter for applications requiring low noise lasers. The optical transmission for all-pass filter510, defined as the ratio of output512to input511is shown in520. There is a transmission reduction at resonance, while other wavelengths are transmitted with no or very little attenuation. The full-width half-maximum (FWHM) of the resonance can be used to determine the Q factor which is the ratio of the resonance frequency and the FWHM bandwidth of the resonance”. The effect on noise suppression can be expressed as noise factor which we define as the ratio of the output noise to the input noise. A noise factor of 1 indicates no addition or suppression of noise; a noise factor smaller than 1 indicates noise suppression. For an all-pass filter510, a typical plot of noise factor (or normalized optical transmission) as a function of frequency offset from the resonant frequency is shown in530. The noise factor is shown to have a minimum value, well below 1, at the resonant frequency, meaning that a significant amount of low-frequency noise suppression or filtering is provided. The exact value of the noise factor will depend on the Q factor of the resonator and on loading), but the dependence of the noise factor on offset frequency means that the value rises—so the effect of noise filtering is reduced—as offset frequency is increased up to and beyond the resonance FWHM, and vanishes as offset frequency is further increased and approaches the resonator's free spectral range (FSR) for the first time, where the noise factor reaches 1. When the offset frequency increases beyond the resonator's FSR, the same pattern of noise filtering behavior repeats1through the next FSR, and so on, due to the same effect of adjacent resonant modes. A self-injection locked laser based on an all-pass filter, therefore, would feature a sharp rise of the noise level at offset frequencies sufficiently higher than the resonance FWHM—which typically ranges from MHz to GHz level for high-Q resonators.1The logarithmic horizontal scale compresses the shape of the illustrated curve. In contrast to plot520for an all-pass filter510, the optical transmission for an add-drop filter550, defined as the ratio of output553to input551, is shown in560. There is maximum transmission at resonance, while the transmission is significantly reduced at other wavelengths and approaches very low values at optical frequencies sufficiently different from the resonance frequency. For an add-drop filter550, the noise factor as a function of frequency offset from the resonant frequency is plotted in570. Add-drop filter510can provide some low-frequency noise filtering even at the resonant frequency (the exact amount depending as before on filter Q factor and loading), but the magnitude of this filtering increases substantially as offset frequency increases. The noise filter approaches 0 as the offset frequency approaches the resonator's FSR for the first time, meaning that noise filtering is maximized. When the offset frequency increases beyond the resonator's first FSR, the noise filtering action resets and the pattern repeats for the next FSR. A self-injection locked laser based on the add-drop filter, therefore, would have the noise well suppressed through the entire frequency span between adjacent FSRs, outperforming the noise performance at high frequency range of lasers injection locked to all-pass filters. The response of add-drop filter550on secondary output552is very similar to the response of all-pass filter510on output512as described above. The effect of the noise factor on the output of apparatus200applies to both the intensity (RIN) noise and phase/frequency noise, and with high-Q resonators can reduce resulting output laser noise by multiple orders of magnitude, correspondingly reducing the linewidth by the same amount. With high-Q resonators, laser linewidth can be reduced from 100 kHz-1 MHz range for standalone lasers down to Hz levels or below. FIG.6Ashows one embodiment600of a device according to the present invention that comprises two low noise lasers601and611(corresponding to200inFIG.2), each of which can comprise additional functionality with components (not shown) such as modulators, amplifiers, or photodetectors as described above with respect toFIG.3. Two or more such lasers are coupled to element620—typically one or more high-speed photodetectors, photo-mixers, or a combination of both—where a high-speed RF signal is generated. The frequency of the RF signal is equal to the difference in optical frequencies of optical sources601and602, and the linewidth/phase noise of the RF signal is equal to the convolution of the two optical signal linewidths. It is evident that for high quality (low noise) RF signals, very low noise optical sources are needed. In some embodiments of device600high-frequency signals may be generated at the element620. In other embodiments, a modulator (not shown in the figure for simplicity, but see element305ofFIG.3for a possible implementation) may be present in one or both optical paths leaving lasers601and611, imprinting a high-bandwidth signal on the corresponding optical frequency. Mixing of the two optical carriers at element620will then generate a down-converted signal RF signal that conveys the desired information that was modulated onto one or both optical carrier frequencies This enables transmission of ultra-high bandwidth RF signals at long distances using optical carriers and optical fiber and/or free space, removing the high propagation loss limitation commonly associated with electrical cables at very high frequencies. FIG.6Bshows yet another embodiment650of a device according to the present invention that comprises two low noise lasers that share a common gain material655comprising single mirror functionality656. In one of the embodiments, gain material655is quantum dot based. Quantum dots have significantly reduced gain competition and provide higher stability of simultaneous lasing at two or more wavelengths using a single gain region. The output from gain material655is split into two parts, and two separate laser cavities are formed, not separately outlined in the figure for simplicity. The first cavity includes a phase control element (680) and a frequency-selective filter685, providing control of the first lasing wavelength. The first cavity is coupled to first add-drop resonator690, which provides mirror functionality (the second “mirror”) for the first laser cavity. Various types of frequency-selective filters can be utilized, some of which are listed above in the description ofFIG.4, such as ring-resonators, gratings and/or others. The second cavity includes a phase control element (681) and a frequency-selective filter686providing control of the second lasing wavelength. The second cavity is coupled to second add-drop resonator691which provides mirror functionality to the second laser cavity. The two laser outputs are coupled to element670(one or more high-speed photodetectors and/or photomixers) where high-speed RF signals are generated as explained above in relation to element620inFIG.6A. One or both of the frequency-selective filters685and686can be made tunable. Some embodiments of the present invention can be assembled from various fiber-pigtailed components where connections are made with splices or common optical connectors. In some embodiments, elements providing parts of the functionality are integrated in PICs that can be made in various platforms. The PICs are then fiber pigtailed or assembled on a common carrier, with the latter approach providing size reduction. Particular functionalities can be implemented in different technologies or platforms, e.g. semiconductor laser is made in GaAs, InP, GaN or other common semiconductor platforms for making optical sources, while the resonators are made in Si, SiN, LiNbO3 or other common platforms used for providing high-quality planar resonators. Use of multiple material systems allows for better performance of individual devices. In yet another embodiment, the whole functionality of apparatus200,300,600and/or650is made on a common carrier using heterogeneous integration, where pieces, dies or whole wafers are bonded and then processed using common lithography alignment marks as e.g. described in e.g. H. Park “Integrated active devices with improved optical coupling to dielectric waveguides”, U.S. Pat. No. 10,718,898 and/or H. Park “Integrated active devices with improved optical coupling to planarized dielectric waveguides”, U.S. Pat. No. 10,641,959. Heterogeneous integration, as described in above references, enables efficient integration between common materials used for making optical sources and common materials used for waveguides and resonators. FIG.7shows a cross-section of heterogeneous photonic integrated circuit platform providing optimized performance for apparatuses described in this disclosure. This is just one example, illustrative of how devices according the present invention may be practically fabricated and incorporated into more complex photonic integrated circuits. One key consideration is the layer in which the one or more high Q resonators of the present invention may be fabricated. This layer—layer740inFIG.7—has to meet specific requirements on the waveguide geometry, specifically to have very low propagation loss, it typically requires reduced thickness (actual thickness depends on wavelength of operation and is in the range of 40-150 nm for e.g. 1550 nm or is in the range of 10-80 nm for e.g. 400 nm operation). It is typically challenging to optically couple layer740, providing high-Q resonator functionality, directly to layer710providing active functionality (optical gain, modulation, detection) due to significant difference in their optical mode size. To facilitate more efficient coupling, optical mode786supported in740can first be adiabatically transformed by taper structures to optical mode785and finally optical mode784supported by second waveguide layer730. Second waveguide layer730generally provides higher optical confinement than the first waveguide layer740due to higher refractive index and/or larger waveguide core cross-section. Coupling between mode784supported by second waveguide layer and optical mode781supported by layer710is facilitated by edge coupling as described in e.g. H. Park “Integrated active devices with improved optical coupling to dielectric waveguides: U.S. Pat. No. 10,718,898 and/or H. Park “Integrated active devices with improved optical coupling to planarized dielectric waveguides”, U.S. Pat. No. 10,641,959, referenced above. The optical mode is first adiabatically transformed to mode783and finally mode782supported by intermediate waveguide formed by layer720with final transition between modes782and781supported by layer710is facilitated by butt-coupling. The optical coupling process is reciprocal so transition from781→786follows same steps. Additional cladding layers (not shown) might be deposited to reduce propagation loss and protect the waveguides. Additional processing steps, such as metal deposition, liftoff, passivation, etc might be introduced to form the active structures including the laser. Other active devices, such as modulators, photodetectors, phase shifters can be integrated in the same way. In the cross-section shown inFIG.7, substrate750can be any type of material typically used for making wafers such as silicon, sapphire, fused silica, lithium-niobate, other types of glass, other dielectrics and/or semiconductors. Layer740, deposited, bonded or otherwise attached to substrate750, is made up of one or more materials such as Si, SiN, LiNbO3, Ta2O5, Al2O3 etc. If the refractive index of layer740is lower than the refractive index of layer750, an optional layer760having lower refractive index than740and providing cladding functionality can be deposited prior to layer740. Layer740can be patterned to define optical functionality before upper cladding layer770is deposited. Layer770has lower refractive index than both layer740and layer730. Embodiments of the semiconductor lasers described herein may be incorporated into various other devices and systems including, but not limited to, various optical networks, various computing and/or consumer electronic devices/appliances, communication systems, sensors and sensing systems. It is to be understood that the disclosure teaches just a few examples and illustrative embodiments, that many variations of the invention can easily be devised by those skilled in the art after reading this disclosure, and that the scope of the present invention is to be determined by the following claims. | 27,786 |
11862925 | FIG.1includes:1—high-reflectivity fiber grating,2—high-gain fiber,3—low-reflectivity polarization-maintaining fiber grating,4—stress adjusting device,5—optical wavelength division multiplexer,6—single-mode semiconductor pump laser,7—polarization beam splitter,8—polarization controller,9—optical coupler, and10—photoelectric detector. DETAILED DESCRIPTION The specific implementations of the present invention will be further described below with reference to the drawings and specific embodiments. It should be noted that the scope of protection claimed by the present invention is not limited to the scope expressed by the embodiments. If there are any processes or components that are not specifically described below, those skilled in the art can understand or realize them with reference to the prior art. Embodiment 1 A specific structure of a tunable narrow-linewidth photo-generated microwave source based on polarization control according to this embodiment is as shown inFIG.1. A central reflection wavelength of a high-reflectivity fiber grating1according to this is a laser output wavelength which of 1550.12 nm, a 3 dB reflection spectrum width of 1.2 nm, and a central wavelength reflectivity greater than 99.95%. A slow-axis reflection peak central wavelength of a low-reflectivity polarization-maintaining fiber grating3is 1550.12 nm, and a fast-axis reflection peak central wavelength of the low-reflectivity polarization-maintaining fiber grating is 1550.50 nm, with a reflectivity of both 60%. A high-gain fiber2is a phosphate gain fiber co-doped with erbium and ytterbium. The high-gain fiber2, the high-reflectivity fiber grating1and the low-reflectivity polarization-maintaining fiber grating3together form a Bragg reflection resonant cavity of a laser. A single-mode semiconductor pump laser6pumps into the resonant cavity through an optical wavelength division multiplexer5of 980/1550 nm. Due to birefringence in the low-reflectivity polarization-maintaining fiber grating, two reflection peaks with different polarization modes and different central wavelengths exist, so that the laser is enabled to realize orthogonal dual-frequency narrow-linewidth optical fiber laser output and output the laser from an output end of the optical wavelength division multiplexer5. The output orthogonal dual-frequency laser is divided into a fast-axis laser and a slow-axis laser through a polarization beam splitter7, wherein the slow-axis laser adjusts a polarization state thereof through a polarization controller8to destroy an orthogonal relationship between the slow-axis laser and the fast-axis laser, and then is re-coupled into one laser through an optical coupler9, and injected into an indium-gallium-arsenic photoelectric detector10, thus being capable of obtaining a microwave signal of about 50 GHz. Meanwhile, a stress adjusting device4can apply a lateral stress to the low-reflectivity polarization-maintaining fiber grating, wherein the stress adjusting device4is composed of an optical fiber groove made of a rigid material and a piezoelectric ceramic. When a direct-current voltage signal is applied to the piezoelectric ceramic, stretching of the piezoelectric ceramic will exert the lateral stress on the low-reflectivity polarization-maintaining fiber grating, thereby controlling the birefringence distribution in the low-reflectivity polarization-maintaining fiber grating, and laser frequencies in two different polarization modes corresponding to the low-reflectivity polarization-maintaining fiber grating are also changed, and a beat-frequency signal generated by injecting the laser into the indium-gallium-arsenic photoelectric detector10is also changed, and finally, a tunable narrow-linewidth photo-generated microwave signal source can be obtained. The specific effects of this embodiment are as shown inFIG.2andFIG.3. By adjusting the direct current voltage signal on the piezoelectric ceramics, three results are obtained, including 1550.124 nm and 1550.245 nm (interval of 15 GHz), 1550.060 nm and 1550.212 nm (interval of 22 GHz), 1550.092 nm and 1550.298 nm (interval of 25 GHz), and a corresponding spectrum of the radio-frequency signals obtained by beat-frequency is as shown inFIG.2. In addition, an output laser linewidth in each state is measured separately, and the results are shown in (a), (b) and (c) inFIG.3. It can be seen that a 20 dB bandwidth is less than 70 kHz under different conditions, and a corresponding 3 dB linewidth can basically keep less than 3.5 kHz. In conclusion, the tunable narrow-linewidth photo-generated microwave source based on polarization control of the present invention takes the low-reflectivity polarization-maintaining fiber grating as a frequency-selecting element of the laser, and achieves the narrow-linewidth optical fiber laser output under pumping excitation of the single-mode semiconductor pump laser to the high-gain fiber. The polarization state of the generated dual-frequency lasers is adjusted by the polarization beam splitter and the polarization controller, and then the dual-frequency lasers are re-coupled together by the optical coupler and injected into the photoelectric detector, so that the narrow-linewidth microwave signal with higher intensity can be output. Meanwhile, the stress adjusting device controls the birefringence distribution in the low-reflectivity polarization-maintaining fiber grating by applying the stress to the low-reflectivity polarization-maintaining fiber grating, thereby controlling the laser frequencies working in different polarization modes in the resonant cavity. The tunable narrow-linewidth photo-generated microwave source is generated by the beat-frequency technology using dual-wavelength narrow-linewidth lasers with variable frequency intervals. | 5,810 |
11862926 | DETAILED DESCRIPTION Reference will now be made in detail to embodiments of the invention. The features of the invention can be used individually or in combination with selected or all other inventive features in each of the disclosed configurations of the inventive Raman source. Wherever possible, same or similar reference numerals are used in the drawings and the description to refer to the same or like parts or steps. The drawings are in simplified form and are not to precise scale. The term “couple” and similar terms do not necessarily denote direct and immediate connections, but also include connections through intermediate elements or devices. FIG.1Aillustrates a Raman fiber laser source10configured with multiple SM or MM laser pumps2which are preferably, but not necessarily based on fiber lasers each capable of outputting SM pump bright light having a power reaching a kilowatt (kW) level. For example, individual SM fiber laser pumps2each are operative to output 1 kW SM pump light. The SM fiber laser pumps may optionally have a master oscillator power fiber amplifier (MOPFA) configuration. The output passive fibers4of respective laser pumps2are coupled together in a well-known manner by a fiber combiner having an output fiber6which is further referred to as the feeding fiber. The combination of multiple pump outputs results in a multi kW cumulative pump light that depends only on reasonable number of pumps2and their individual output powers. For example, a power range between 5 and 100 kW in a CW regime is readily accessible today. The beam quality of cumulative pump light is very good at these powers, but with forever increasing industrial demands, it could be further improved. The combiner coupling multiple output fibers to produce a low- or MM output is referred to as SM-LM or LM-/MM combiner depending on the modality of individual pumps and the M2factor of the cumulative pump beam. The feeding fiber6is configured with a cladding8surrounding a MM core12which guides the cumulative pump light towards a MM Raman fiber14which is butt spliced to the output end of feeding fiber6. The MM fiber Raman laser (FRL) is configured to support the propagation of substantially only a single, FM through the beam cleanup effect of SRS in multimode fibers. High pump light powers require that feeding fiber6has MM core12with a relatively large dimeter, such as 50 to 100 μm which matches a waveguiding inner cladding16of double clad MM Raman fiber14. The diameters of MM Raman core18and cladding16are selected to ensure the effective absorption of the pump light over the shortest possible length of the MM Raman core. The latter outputs kW signal light in a fundamental mode at the desired signal light wavelength which is preferably the 1st Stokes wavelength. To insure the near diffraction-limited signal light at the desired signal wavelength, such as 1stStokes wave, Raman source10includes a combination of a central core region30in Raman fiber14and strong and weak FBGs26and28, respectively, with respective pitches adjusted for the effective index of the FM. The spaced FBGs26and28are written directly in MM Raman core18to define a Raman resonant cavity for the desired 1stStokes wavelength. may occupy no more than 70% of the entire The central core region30is incorporated within the resonant cavity and doped, as the rest of the core as illustrated inFIGS.3and4with impurities which are selected from boron, known to one of ordinary skill in the optical fiber arts to lower the refractive index, germanium, phosphorous or a combination of these. The central region30core area which is substantially the core region occupied by the FM, whereas HOMs tend to occupy the periphery of core area18. Since central core region30is dimensioned to substantially match the mode field diameter of FM, it is amplified incomparably greater than the majority of HOMs which are thus reduced to the background noise at the output of Raman fiber14. Accordingly, the above-disclosed structure ensures that the signal radiation emitted from Raman fiber14is in the FM. Optionally, as diagrammatically shown inFIG.1B, an intermediary MM passive fiber15can be spliced to the opposing ends of respective feeding and Raman fibers. Despite having a MM core17, the intermediary fiber can be configured to support the propagation of only a FM with a MFD substantially matching that of the FM supported in Raman core18. In this modification, strong FBG26may be written in the intermediary fiber. If a pure SM is required, the shown structure may have a SM output fiber22which is coupled to the output end of Raman fiber14. The weak FBG28may be written in SM core24of output fiber22. If both FBGs are formed onto respective intermediary and output passive fibers, central core region30of Raman fiber14may remain undoped. FIG.2shows an alternative architecture of the disclosed Raman source10. While the cumulative pump light from MM feeding fiber6propagates over free space, it is incident on a guiding optic assembly which includes spaced apart collimating and focusing lenses25,35respectively. As a result, the pump light is focused on the cladding of Raman fiber14. Positioned between lenses25and35is a slanted reflector45preventing the propagation of backreflected Raman light toward upstream to SM laser pumps2shown inFIG.1. The remaining structure is analogous to that ofFIG.1. FIG.3illustrates an example of Raman fiber14ofFIGS.1and2having 30 μm MM core18with central core region30being of about 20 μm. The tests conducted with this index profile of Raman fiber14show good results as can be seen inFIGS.4and5illustrating field and intensity profile for fundamental mode LPo. The configuration used in the tests include SM fiber laser pumps operated at 1070 nm, whereas SM Raman signal light was generated at 1120 nm. All of the above ranges of fibers shown inFIGS.1and2are exemplary and can be altered without however deviating from the scope of the invention. As shown, the refractive index profile of inner cladding16has a depressed portion due to the fluorine-doped inner region. Otherwise, the raised region of cladding16and Raman core18, which may be made of pure silica and thus have substantially the same refractive index. The central core region30is doped with a combination of Raman gain increasing impurities and silica refractive index decreasing impurities which lower the central core region refractive index to that of the Raman core and cladding16. FIG.6illustrates another aspect of the disclosure wherein fiber Raman source50is configured with a MM fiber Raman amplifier (FRA)32. The realization of this requires a SM seed laser source34configured as a SM fiber laser or pigtailed SM diode laser. The seed34outputs a SM signal beam at the desired Raman wavelength λram, such as 1120 nm, which is guided in a SM fiber36. The wavelength range of pump and therefore signal wavelengths is not limited to a 1-2 micron interval and extends well beyond it. The seed34may include a SM DL or SM fiber laser. The SM fiber36may be directly spliced to a central fiber of a SM-MM combiner48or, as shown, to a strong FBG38which together with a weak FBG46are part of a central SM fiber laser pump42. Here, like in the schematics ofFIGS.1and2, the SM-MM combiner is coupled to central and multiple SM fiber laser pumps42and44, respectively, on the input end and to a feeding fiber52on the output end. The feeding fiber52is configured with a core supporting the SM signal beam, and a cladding guiding the cumulative pump beam at a wavelength λpump shorter than the desired Raman wavelength, for example, it may be 1070 nm. End-spliced to a double-clad FRA32, the cumulative MM pump beam is coupled into the cladding of FRA, while signal beam into the MM core of the FRA. Alternatively, element42ofFIG.6may be configured as a seed laser outputting light at the first Stokes wavelength, such as 1120 nm. The rest of the configuration remains the same as disclosed above except for component34. As the cumulative pump beam continuously cross the MM core of ERA32, its energy is transferred to a 1stStoke wave. The suppression of high order Stokes waves is realized by the calculated length of the Raman fiber and the ratio between MM core and cladding diameters. The amplification of the fundamental mode at the expense of high order transverse modes is a result of matched MFDs of respective feeding and Raman fibers and their alignment. The MM Raman core may be provided with a central region doped with ions of standard Raman dopants and dimensioned to correspond to the MFD of the fundamental mode, like in the embodiments ofFIGS.1A,1B and2. If the residual, unabsorbed pump light still propagates through the cladding of the Raman fiber, a mode stripper may be arranged along the downstream stretch of a fiber train in any of embodiments of respectiveFIGS.1,2and6. Although the present disclosure has been described in terms of the disclosed example, numerous modifications and/or additions to the above-disclosed embodiments would be readily apparent to one skilled in the laser arts without departing however from the scope and spirit of the following claims. | 9,195 |
11862927 | DESCRIPTION OF THE PREFERRED EMBODIMENTS The present inventions generally relate to lasers that produce laser beams of high quality and high reliability in the blue wavelength ranges. In embodiments, there is generally provided laser systems, and solid-state laser packaging for such systems, in the wavelength range of about 400 nm to about 500 nm. Although this Specification primarily focusses on wavelengths of 500 nm, this is merely illustrative, it being understood that the packaging, assembly techniques, and cleaning techniques provided are applicable to blue-green, green, shorter wavelength, and potentially other wavelength laser systems, and in particular, high brightness, high power systems. Typically, the output power of blue laser diode emitters is generally about 5 W per diode, and typically less than 10 W per diode, although higher powers may be possible. High power blue laser systems are obtained by combining beams from multiple emitters, e.g., diodes. The combination of these blue laser beams can be from single emitters, bars of emitters and combinations and variations of these. The laser beams from these emitters are combined by using, for example, combinations of spatial, spectral, coherent and polarization methods. Examples of these beam combining systems are taught and disclosed in US Patent Publication Nos. 2016/0322777, 2018/0375296, 2016/0067827 and 2019/0273365, and U.S. patent application Ser. Nos. 16/695,090 and 16/558,140, the entire disclosure of each of which is incorporated herein by reference. Generally, the combination of these beams from the multiple emitters, involves the use of passive optical elements to collimate and combine the beams, such as lenses, mirrors, gratings, waveplates. Raman conversion may also be used for beam combination. High brightness sources are needed for most industrial applications such as welding, brazing or additive manufacturing; these typically have a very short focal length lens placed in close proximity to the laser emitter, inside the same package. In the following, the components in the package refer to any element that forms the laser assembly; they are grouped as the optically functional components (like lenses, gratings, mirrors, waveplates, windows), the mechanical components (such as package housing, spacers, mounts) and the positioning components (for example adhesives, solders, mechanical hardware). Laser diode manufacturers have made advances in the design and manufacturing of blue laser diodes to ensure high reliability of the emitters themselves. In the same way, reliable dielectric coatings are available that provide the desired reflectivity at the blue wavelength while being compatible with the typical intensity of the blue laser diode sources. However, prior to the present inventions, high power blue laser diode systems lacked the level of reliability required for use in industrial applications, and in particular for cost effective use in industrial applications. It has been discovered that this results from the presences of sources of Silicon and Carbon based contaminants that are typically introduced into the system during assembly of the system; and which, as discussed below, have the potential during laser operation to form deposits on the active optical surfaces of the system. It has been discovered that a limiting factor, and in embodiments the main limiting factors for the lifetime of high-power blue laser diode systems are related to packaging of the system and in particular of the diode, the optical assembly and both the diode and optical assembly. Contamination by volatile organic compounds, like hydrocarbons or poly-siloxanes, can result from outgassing of adhesives, or other materials in the package. Other common sources of contamination include airborne contaminants present in the environment during the assembly process, residues from storage containers of any of the components, surface contaminants present on the tools used for the process, and in general any surface that comes in contact with any of the materials used in the package. In general, it is presently believed that any organic compound that has a vapor pressure sufficient to generate trace amounts of gaseous contaminants in the range of temperature associated with normal operation of the laser is potentially harmful to laser system reliability. It is theorized that the short wavelength of the blue lasers, and shorter wavelength lasers, allows two-photon processes to efficiently generate reactive species in the package, like atomic oxygen, hydroxyls, or ozone. These reactive species then have a gas phase reaction with the volatile organic contaminants leading to deposits or buildup of various solids on optical surfaces in the beam path, i.e., optically active surfaces, which increases the optical losses, reduces the system output, and degrades the properties of the laser beam over time. It is theorized that these deposits and buildup reduce, and greatly reduce, the lifetime of a system. It is further theorized that these deposits and buildup are a primary reason for reaching the end of the lifetime of a system. Thus, embodiments of the present inventions, it is theorized, minimize, reduce, and avoid these buildups and provide blue, and potentially green, laser systems having the high reliability, small degradation rates, and long lifetimes, as described and taught in this Specification. Thus, turning toFIG.3there is a schematic block diagram of high power, high brightness blue laser system300. The system300has a collection of laser diodes, e.g., emitters,301. The laser diodes301have various mechanical components320to mount, position and hold the diodes. These mechanical components320are directly or indirectly physically associated with, e.g., attached to, affixed to, etc., a base321. The base321is mechanically associated with a cover322, which has an inner surface323. The cover322is attached to the base321and sealed to the base to form housing326that houses or contains an internal cavity334, that is isolated from the exterior environment335. There are optical components302that are directly or indirectly physically associated with the further mechanical components324, which are directly or indirectly physically associated with the base321. The laser diodes301and the optical components302are contained within the internal cavity334are isolated from the exterior environment335by the housing326. Each of the laser diodes has a facet, e.g.,304(only one is shown for clarity) from which the blue laser beams are propagated. The laser beam350is propagated along laser beam path350a(it being understood that the laser beam travels along the laser beam path, and thus is coincident with the laser beam path) to the optics302, and then to, and through a window325in housing326. Thus, the laser beam is propagated through the internal cavity334and out of that cavity and into the exterior environment335. The internal cavity, of these embodiments, and thus the environment within that cavity and preferable all surfaces within that cavity, are free from sources of silicon based contaminates, such as siloxanes, polymerized siloxanes, linear siloxanes, cyclic siloxanes, cyclomethicones, and poly-siloxanes. In particular, in an embodiment, the surfaces and joints within the housing that are heated during operation, that are exposed to the laser beam, and both, are free from sources of silicon based contaminates. By “free from” it is meant that the amount of contaminate present is so low as to render de minimis, and preferably zero, the amount of Silicon (or specified contaminant) released into the internal cavity during operation. In this manner, it is theorized that the reactive oxygen formed during propagation of the blue laser beam through the interior cavity will have, essentially no, and no Silicon available to react with, and thus, minimize the formation of SiO2, preferably avoid the formation of SiO2, and more preferably will not form SiO2, and, in turn, will minimize SiO2deposits, avoid SiO2deposits, and more preferably will not have SiO2deposits forming on the optically active surfaces within the cavity. The amount of Silicon based contamination is avoided, and thus reduced to such a low level that any available Silicon for forming SiO2is de minimis, negligible, or below the level that would cause laser degradate rates greater than the embodiments of the present systems. Generally, an optically active surface, is any surface that is contacted by the laser beam and is on the laser beam path, this would include facets, fiber faces, mirrors, lenses, windows, propagations surfaces, and transmission surfaces. The internal cavity, of these embodiments, and thus the environment within that cavity, however, can contain sources of Carbon based contamination. Thus, all, or most, Carbon based contamination does not need to be removed during assembly, e.g., packaging, of the laser assembly or system. Such Carbon based contamination would include for example, cleaners, solvents, lubricants, oils, human finger prints and oils, and generally any other hydrocarbon source. The internal cavity contains gaseous oxygen, a source of gaseous Oxygen during operation (e.g., a port or flow line in the housing to supply Oxygen to the system during operation), or both. The Oxygen forms reactive atomic oxygen when exposed to the blue laser beam and this reactive Oxygen forms gaseous CO2by reacting with any Carbon that is released from the Carbon based contamination sources, and thus, minimized, preferably avoids, and more preferably prevents, the deposit, deposition, or buildup of Carbon on the optically active surfaces within the internal cavity. The internal cavity, of these various embodiments, can have from 1% to 100% Oxygen, from about 5% to about 80% Oxygen, from about 10% to about 50%, from about 30% to about 80% Oxygen, from about 5% to about 30% Oxygen, and the ambient amount of Oxygen present in air (e.g., the internal cavity can contain clean dry air). The other gases in the internal cavity can be, for example, Nitrogen. The internal cavity, of these embodiments, can have less than 0.01 ppm Silicon, less than 0.001 ppm Silicon, less than 0.0001 ppm Silicon, and lessor amounts, present in, or available to, the internal cavity. The combination of a blue laser beam, with one and preferably both of gaseous oxygen in the internal cavity, and the absence of sources of Silicon based contamination in the internal cavity, of the laser assembly provides assemblies that can have lifetimes (and also can be accurately characterized, marketed and labeled, as having such lifetimes) of from about 5,000 hours to about 100,000 hours, from about 10,000 hours to about 90,000 hours, from about 5,000 hours to about 50,000 hours, from about 30,000 hours to about 70,000 hours, at least about 20,000 hours, at least about 30,000 hours, at least about 40,000 hours, at least about 50,000 hours and longer times. These various embodiments of laser systems or assemblies, having these high reliabilities, i.e., these long lifetimes, can provide or propagate blue laser beams (e.g., wavelength of from about 410 nm to about 500 nm, 410 nm to 500 nm, about 405-495 nm, 450 nm, about 450 nm, 460 nm, and about 470 nm). These blue laser beams can have bandwidths of from about 10 pm (picometer) to about 10 nm, about 5 nm, about 10 nm, about 20 nm, from about 10 nm to about 30 nm, from about 5 nm to about 40 nm, about 20 nm or less, about 30 nm or less, about 15 nm or less, about 10 nm or less, as well as greater and smaller values. These blue laser beams can have powers of from about 100 W (Watts) to about 100,000 W, from about 100 W to about 40,000 W, from about 100 W to about 1,000 W, about 200 W, about 250 W, about 500 W, about 1,000 W, about 10,000 W, at least about 100 W, at least about 200 W, at least about 500 W, at least about 1,000 W, and larger and smaller powers. For the packaging of individual diodes, these laser beams can have powers for from about 1 W to about 10 W, about 3 W, about 5 W, about 6 W and about 10 W and greater. These blue laser beams can have BPP of from about 5 mm-mrad to about 50 mm-mrad, less than about 40 mm-mrad, less than about 30 mm-mrad, less than about 20 mm-mrad, less than about 15 mm-mrad, less than about 10 mm-mrad, 20 mm-mrad and lower, and 15 mm-mrad and lower, as well as greater and smaller values. For Raman laser based systems the BPP for these blue laser beams can be less than 5 mm-mrad, less than 1 mm-mrad, from about 0.1 to about 1 mm-mrad, from about 0.1 to about 0.5 mm-mrad, about 0.13 mm-mrad, and about 0.15 mm-mrad. These laser beams for these various embodiments of laser systems and assemblies can have degradation rates of beam properties (e.g., power, BBP, bandwidth, or other properties of the beam, and combinations of one or more and all of these properties) of about 2.5% per khrs or less, about 2.3% per khrs or less, about 2.1% per khrs or less, about 2.0% per khrs or less, about 1.8% per khrs or less, from about 2.3% per khrs to about 1.5% per khrs, as well as, larger and smaller amounts. In preferred embodiments, these degradation rates are present starting at, based upon, the “normal values” of the properties for the laser, during the lifetime of the laser system, and both. In preferred embodiments these degradation rates are present over the entire lifetime of the system. In more preferred embodiments the laser systems will have a period of their lifetime when the degradation curve, i.e., the plot of the degradation vs time, is flat, i.e., the degradation rate is zero. This period of zero degradation can be from 1 hour to 500 hours and more, can be for a period that is 10% of the lifetime, 20% of the lifetime, 30% of the lifetime and more. It should be noted that these contaminates form when the lasers are operated at lower powers, as well as high power, over their entire operating range and rated powers. Thus, these degradation rates, unless expressly stated otherwise, are for operation of the laser at rated powers, within rated operating ranges, or at normal and establish operating ranges for such lasers. It is theorized that there are three primary components that contribute to the build up of deposits on the optically active surfaces, and thus, reduce the lifetime of blue laser systems. These components are Carbon and SiO2. Conventional thinking would suggest that any such deposit contributing components be reduced or eliminated during assembly and packaging. The present inventions go against these conventions, however, buy increasing the amount of Oxygen, which would potentially increase the amount of SiO2buildup, in order to manage any residual hydrocarbon contamination. In this manner residual hydrocarbon contamination can be present, but the system avoids, and preferably poses no, risk to the system because of the elevated Oxygen levels. The amount of siloxanes are minimized and preferably eliminated. Thus, one of the components needed for SiO2deposits or buildup is minimized or eliminated; enabling the oxygen to neutralize the hydrocarbon buildup and deposits by forming CO2instead of the solid Carbon buildup or deposit material. In an embodiment the amount of hydrocarbon contaminates are preferably minimized and can be essentially eliminated. There are a large number of different cleaning and assembly techniques and procedures known, such as clean room assembly and protocols, solvent washes, extractions, plasma cleaning and the like, that can be used to remove and avoid the presence of any source of silicon based contamination, any source of carbon based contamination and both. The present cleaning and assembly techniques, are an example of many different such techniques and combinations of these techniques, that have applicability to these laser systems; and will have applicability to blue laser systems, shorter wavelength systems, blue-green and green laser systems, and to the high power systems of the present embodiments. In embodiments of the assembly process for the present solid-state lasers, optical assemblies, laser systems and combinations and variations of these, various methods of cleaning and assembling components, can be used to minimize the detrimental effect of the various contamination phenomena that have been discovered for blue and green laser systems, as well as shorter wavelength systems. In embodiments, methods of cleaning and assembling optical components for blue laser systems, and systems having lower and higher wavelengths, are used to mitigate, minimize, or eliminate, the materials that degrade laser performance over time. These assembly processes for a such lasers, optical assemblies and systems address and solve the reliability shortcomings of prior systems. For example, in an embodiment a cleaning method is used to remove silicon based sources of contaminates, which operating methods in embodiments are configured to remove targeted contaminants at specific steps in the assembly process, at specific locations on the components and combinations and variations of these. This cleaning method can provide an embodiment of a package that houses the solid-state laser, optics assembly, laser system (e.g., laser and optics) or combinations of these, preferably having levels of silicon based contaminates that are not detectable by standard analytic techniques. Such packages, which include any of the present embodiments and Examples, can have amounts of silicon based contaminates that are lower than 0.01 g., lower than 0.001 g., lower than 0.0001 g., and lower than 0.00001 g., and lower than 0.000001 g., within the isolated environment of the package. Such packages, which include any of the present embodiments and Examples, can have amounts of silicon based contaminates in the internal cavity (as determined by ppm Silicon based on the constituents of the internal cavity environment, e.g., the gas contained within the internal environment) that are lower than 0.1 ppm Silicon, lower than 0.01 ppm Silicon, less than 0.001 ppm Silicon, lower than 0.0001 ppm Silicon, lower than 0.00001 ppm Silicon, and lower. These systems and methods can have one or more of the following features: wherein there is primarily removed volatile contaminants of poly-siloxanes; wherein there is provided the benefit of removing any residue volatile hydrocarbons; and wherein other operating parameters are selected to remove different contaminants. In an embodiment of an assembly process, plasma cleaning is used, and in particular plasma cleaning removes trace amounts of contaminants from surfaces of the components in the package, to dislodge contamination or particulates, and for example larger amounts of this contamination or particulates. In an embodiment plasma cleaning is used with a precleaning step, in which precleaning of the surface with carefully selected solvents, both polar and non-polar are used. Preferably, the solvent is chosen so that its polarity matches that of the targeted contaminant. Thus, it is envisioned that multiple precleaning, cleaning and plasma cleaning steps can be performed, and that these steps can be tailored to specific contaminates. In an embodiment of these assembly processes, system components are heated under reduced pressure for predetermined periods of time to remove residual traces of volatile contaminants, in order to accelerate the outgassing of all volatile components. This preheating step can be, and preferably is, used with the other assembly techniques disclose in the Specification. The operating conditions of temperature and pressure are chosen so that the vapor pressure of the target contaminant is higher than the actual pressure in the oven, while still being safe for the component. This step also ensures that any residue of solvents from the precleaning steps is removed from the component. An embodiment of the assembly process defines a sequence of precleaning and cleaning, in which it is advantageous to measure the polar and non-polar components of the surface free energy of the parts to be cleaned at different stages of the cleaning process. This provides useful information to select the appropriate combination of solvents and the best gas mixture to target the actual contaminants to be removed. In embodiments a preferred sequence can be different for different components of the assembly, due to the various histories of fabrication, storage and handling of each part. In an embodiment of the assembly process these cleaning techniques are performed just before packaging, or at the time of packaging, as an additional or secondary, or tertiary cleaning step, e.g., the final cleaning step. It being recognized that even with careful cleaning of the parts and tooling prior to performing the assembly, there exists the possibility that some contamination may be introduced in the package during the integration. This can come, for example, from airborne contaminants present in the assembly area; outgassing from the adhesives during curing is another source of contamination. Therefore, in an embodiment, a final cleaning of the assembly is performed just before sealing the package. The same cleaning methods can be used that are described herein for the individual components. Turing toFIG.9there is shown a schematic diagram of a laser diode1000. The diode has a transverse guiding ridge1010, a front facet1011, a mode1012, and vertical confining layers1013. The contaminants that are formed during operation typically build up along the laser diode vertical confining layer1013, with the greatest contamination being deposited in the central region of the mode and typically decreasing with the mode intensity in the transverse direction. The embodiments of the present systems and methods provide systems that when operated avoid, minimize and preferably prevent this buildup, as well as other buildups and deposits from occurring. In order to prevent the ingress of external contaminants, high power laser systems were typically sealed with an inert or protective atmosphere, e.g., atmospheres with little and preferably no Oxygen. This technique however has proven less than effective for blue laser systems, and ineffective for providing long lifetime blue laser systems. It is theorized that the prior use of inert atmosphere is ineffective for blue laser systems, as well as, ineffective for green laser systems, because of the contaminate dissociation effect discussed in this Specification, and it is theorized potentially other phenomenon both understood and not yet fully understood, but who's effects can be seen on the degradation of laser performance, during normal operation of these blue wavelength laser systems, as well as in green laser systems. Further, during operation of these systems the temperature inside the package increases, which also results in outgassing from any component in the assembly; thus, these trace amounts of contaminants, from thermal outgassing, can have a detrimental impact on the reliability of the system, which impact could in some situations be very detrimental. Having discovered these problems with blue wavelength systems and it is theorized green laser systems as well as shorter wavelength systems, embodiments of the present inventions, provide among other things, examples for appropriate methods to precisely clean, assemble, and both clean and assemble, the system's package or housing, including the optical package (as well as the components within that package, including the solid state laser) during the assembly process and prevent these detrimental processes, and the degradation of the laser system, from taking place. Another issue, in addition to volatile organic contaminants build up on optical surfaces in the beam path, is the build-up of Silicon Dioxide (SiO2) on the surface of the laser diode facet or other optical components. This build up of Silicon Dioxide results in a change in the coating reflectivity. In some cases the build up of the Silicon Dioxide changes the optical properties of the surface. The single blue laser diode prior to collimation has a very intense optical field at the surface of the laser diode itself. The power density at the facet can exceed 20 MW/cm2peak due to modal filaments forming in the cavity. It has been discovered and theorized that this high power density is what drives the two photon reaction that dissociates the atmosphere in the package. Once dissociated, the free oxygen atoms rapidly combine with any free Silicon to form SiO2at the facet. The SiO2is deposited in a similar manner to Carbon gettering. The process of forming and depositing SiO2can also proceed throughout other optics including the collimating optics, but due to the much lower power densities at the collimating optics, which can be on the order of a few kW/cm2, the deposition rate is 1,000× less than it is at the facets, but should still be taken in to consideration in the packaging, assembly and cleaning of the system. The optically active surface of a solid-state laser device of the present systems and assemblies, from which the laser beam is propagated, e.g., a fiber face, a window, or a facet, can have a power density of at least about 0.5 MW/cm2, at least about 1 MW/cm2, at least about 10 MW/cm2, at least about 20 MW/cm2, at least about 50 MW/cm2, at least about 100 MW/cm2, at least about 500 MW/cm2, about 1,000 MW/cm2or lower, from about 10 MW/cm2to about 100 MW/cm2, from about 5 MW/cm2to about 20 MW/cm2, and from about 50 MW/cm2to about 500 MW/cm2. Any solid-state device for generating and propagating a laser beam can be used in the present systems and assemblies. Preferably, the solid-state device propagates a laser beam having a wavelength in the blue, blue-green and green wavelengths. Such solid-state laser devices can be, for example, laser diodes, fiber lasers, Raman fiber lasers, and Raman lasers based upon crystal (e.g., diamond, KGW, YVO4, Ba(NO3)2, etc.), and combinations and variations of one or more of these. The present systems can have one, two, three, five, ten, tens, a hundred, hundreds, and thousands of these solid-state devices having their beams combined to provide a high power, high brightness, laser beam for industrial and other applications. It being understood that although this Specification focusses on complete laser systems, e.g., the solid-state laser device and the optics assembly are combined or integrated into one package or housing, its teaching have equal applicability to a stand-alone laser device with no optics, stand-alone optics assembly with no laser, and combinations and variations of these. These assemblies can be optically integrated, e.g., connected, in the field or before shipment by for example optical fibers with optical connectors. Embodiments of the present laser devices and systems can be used for industrial applications such as for example for welding components, including components in electronic storage devices. Since the process which creates the deposits on the facet, and other surfaces, of the laser diode, as well as other optically active surface, that lead to a loss of power are driven by a two photon process, the process can occur whether the devices are pulsed or run CW. A difference between the two operating modes is the rate of deposition of the SiO2on the facet of the laser diode. The rate of deposition is directly proportional to the power density, the amount of deposit is the integral of this deposition rate over time. Consequently, if the deposition proceeds at a rate of 10 μm per 1,000 hours when operating CW, then it will only deposit 1 μm per 1,000 elapsed hours when operating at a 10% duty cycle. The deposition rate used here is merely an example, it is dependent on a number of other factors, primarily the amount of poly-siloxanes trapped in the package. The comparative example given inFIGS.1and2uses a 60 W class blue laser composed on 20 single emitter diodes, each being collimated with a fast axis collimation lens to allow coupling into a delivery fiber. The lenses are attached with UV cured optical epoxy after submicron precision alignment. The package is made of gold-plated copper parts, using low temperature solders. The lenses are attached to glass mounts to match the coefficient of thermal expansion. This fairly simple assembly uses 3 different types of optical adhesives, 2 solders, 3 different types of glasses and 2 variations of the gold-plated copper. The assembly process involves multiple steps with different tools and storage containers for the components, which all provide opportunities to contaminate the surfaces. As a result, the interaction of the blue light with the contamination results in a rapid degradation of the output power from the device over time. This is illustrated inFIG.1, which shows the performance of a typical device over extended testing; the expected lifetime of the laser is only around 200 hours (based on the definition of the time to reach 80% of nominal power), which is clearly not enough for industrial operation. The curve ofFIG.1exhibits a very typical degradation rate of −100%/khrs, the corresponding lifetime of the device is less than 200 hours. The devices in bothFIG.1andFIG.2had the same amount of Oxygen, 60%. It has been discovered that there are at least two blue light interactions in the system that are detrimental to laser performance, and, in particular laser performance over time. First, the scattered light, reflected light and both, from the system heats the surfaces of the system increasing the outgassing from those surfaces and increasing the amount of volatilized contaminates, which in turn increases the amount of those contaminants that are deposited on, and degrade the performance of the laser system. Second, the laser beam, photolyze Oxygen through the two-photon process. The Oxygen atoms then react with both the organics in the package forming CO2, and the poly-siloxanes to from SiO2. In the case of the organics, the CO2does not deposit on any surfaces and thus, their hydrocarbon source is less of a concern, but the poly-siloxanes are highly detrimental to the reliability. Consequently, the packaging environment (e.g., the inner environment of the housing containing the solid-state laser device, beam path and optics) is assembled and sealed to keep moisture and other contaminates from being introduced to achieve reliable operation. FIG.2shows a graph of the variation of the output power from 5 samples of high-power blue laser devices that were packaged and assembled so as to be free from siloxanes in the internal environment and with an oxygen atmosphere. The laser devices used for theFIG.2tests were cleaned using an example of the cleaning sequences according to the present embodiments. The average degradation rate for these devices is −2.3% per khrs which is a 43× improvement of the lifetime compared to the devices ofFIG.1, which were free from siloxanes. The following examples are provided to illustrate various embodiments of the present assembly methods, laser systems and operations. These examples are for illustrative purposes, may be prophetic, and should not be viewed as, and do not otherwise limit the scope of the present inventions. Example 1 Turning toFIG.10there is shown a schematic diagram of the laser diode ofFIG.9that is assembled into a sealed package that provides for extended lifetime of the diode. This package may then be later integrated into a laser system providing extended lifetime to that system. The diode1000is located inside of a sealed housing1050, that forms the package or packaging for the laser diode, and is a laser diode assembly. The housing1050contains an internal environment1051that is isolated from an external environment1052. The diode1000propagates a laser beam along a laser beam path1056through window1055and into the external environment1052. The inner surface1080of the window1055is exposed to, and in contact with the internal environment1051. All the surfaces in the internal cavity are free from silicon based contaminates. The laser beam is in the blue wavelength ranges and has a power of 3 W. The internal environment contains 60% Oxygen, whereby during operation of the solid-state device CO2is created within the internal cavity from any carbon based contaminates that may be present after cleaning. The packaged assembly has a power degradation rate of less than 2.0% and an laser lifetime of at least 30,000 hours. Example 1A In embodiments of Example 1, the internal environment may contain from 1% to 80% Oxygen. The laser beam power may be from about 1 W to about 10 W, The power degradation rate may be less than 3%, less than 2.5%, less than 2% and less than 1.5%. The embodiment may have a laser lifetime of at least 20,000 hours, at least 40,000 hours, at least 50,000 hours, and at least 100,000 hours. In particular, the embodiments may have these lifetimes and degradation rates when assembled into a laser system, e.g., packaged with optics. Example 1B The laser diode of Example 1 is a TO-9 Can blue laser diode. Example 1C Turning toFIG.11there is shown a schematic diagram of 4 laser diodes that provide blue laser beams that are assembled into a sealed package that provides for extended lifetime of the diodes. This package may then be later integrated into a laser system providing extended lifetime to that system. The four laser diodes1100a,1100b,1100c,1100dare packed, e.g., contained, within a housing1150that is sealed, and thus, has an internal environment1151. The housing1150protects, and isolates, the internal environment1151from an external environment1152. The four laser diodes propagate blue laser beams having a power of about 5 W that travel along beam paths1156a,1156b,1156c,1156d. The laser beam travel along their respective beam paths exiting the housing1150through window1155, where they travel into the external environment1152. The inner surface1180of the window1155is exposed to, and in contact with, the internal environment1151. Four separate windows, one for each diode may also be used. All the surfaces in the internal cavity are free from silicon based contaminates. The laser beams are each in the blue wavelength ranges, and each have a power of about 5 W. The internal environment contains 60% Oxygen, whereby during operation of the solid-state device CO2is created within the internal cavity from any carbon based contaminates that remain after cleaning. The packaged assembly has a power degradation rate of less than 2.0% and a laser lifetime of at least 30,000 hours. Example 1D In embodiments of Example 1C, the internal environment may contain from 1% to 80% Oxygen. The laser beam power may be from about 1 W to about 10 W, The power degradation rate may be less than 3%, less than 2.5%, less than 2% and less than 1.5%. The embodiment may have a laser lifetime of at least 20,000 hours, at least 40,000 hours, at least 50,000 hours, and at least 100,000 hours. In particular, the embodiments may have these lifetimes and degradation rates when assembled into a laser system, e.g., packaged with optics. Example 1E The laser diodes of Example 1C are TO-9 Can blue laser diodes. Example 2 Turning toFIG.4there is shown a schematic of an embodiment of a high power, high brightness solid-state laser assembly400, or laser system, for providing a high-quality laser beam450over long periods of time without substantial degradation of the laser beam properties, the assembly having: a housing426the housing defining an internal cavity434; wherein the internal cavity is isolated from an environment435that is external to the housing; a solid-state device401for propagating a laser beam450from a propagation surface404of the solid-state device along a laser beam path450a, and wherein the laser beam has a power density of at least about 0.5 MW/cm2at the propagation surface404; an optics assembly402, the optics assembly in optical communication with the solid-state device401and on the laser beam path450a; wherein the solid-state device and the optics assembly are located within the housing426and in the internal cavity434, whereby the solid-state device and the optics assembly are isolated from the external environment435; the housing comprising a housing propagation surface425, whereby the laser beam450is transmitted from the housing426into the external environment435along the laser beam path450a; the housing propagation surface425in optical communication with the optics assembly402and on the laser beam path450a; the laser beam upon exiting the housing propagation surface characterized by beam properties, the beam properties comprising: (i) a power of at least 100 W; and, (ii) a BPP of less than 40 mm-mrad; and, the internal cavity being free from sources of silicon based contaminates, whereby during operation of the solid-state device SiO2is not produced within the internal cavity; whereby the internal cavity remains free of SiO2build up; thereby the degradation rate of the beam properties is 2.3% per khrs or less. Example 3 In an embodiment the laser assembly of Example 2 has a solid-state device that produces a laser beam wherein the laser beam has a wavelength in the range of 410 nm to 500 nm. Example 4 In an embodiment the laser assembly of Example 2 has a solid-state device that produces a laser beam wherein the laser beam has a wavelength in the range of 405 nm to 575 nm. Example 5 In an embodiment the laser assembly of Example 2 has a solid-state device that produces a laser beam wherein the laser beam has a wavelength in the range of 500 nm to 575 nm. Example 6 In embodiments of the laser assemblies of Examples 2, 3, 4 and 5 the solid-state device is a Raman fiber laser, a diode laser, a Raman laser based on a crystal and combinations and variations of one or more of these. The optics assembly has optical elements including collimating optics, focusing optics, lenses, mirrors, beam combining optics and combinations and variations of one or more of these. The beam properties further have a bandwidth of about 20 nm or less. The housing propagation surface is a window and a fiber face and combinations and variations of one or more of these. The BPP is less than about 15 mm-mrad; and, the power density at the propagation surface is from about 1 MW/cm2to about 1,000 MW/cm2. Example 7 In embodiments of the laser assemblies of Examples 2, 3, 4, 5 and 6 the power of the laser beam is from about 100 W to about 1,000 W. The beam properties further comprise a bandwidth of about 20 nm or less; the power density at the propagation surface is from about 0.5 MW/cm2to about 1,000 MW/cm2; and, the degradation rate of the beam properties is less than 2.0% per khrs. Example 8 In embodiments of the laser assemblies of Examples 2-7 and 13-26, the internal cavity comprises a gas consisting of at least 1% Oxygen; whereby during operation of the solid-state device CO2is created within the internal cavity from carbon based contaminates; whereby the propagation surface of the solid-state device and the optics assembly remain free of Carbon build up. Example 9 In embodiments of the laser assemblies of Examples 2-7 and 13-26, the internal cavity comprises a gas consisting of at least 5% Oxygen; whereby during operation of the solid-state device CO2is created within the internal cavity from carbon based contaminates; whereby the propagation surface of the solid-state device and the optics assembly remain free of Carbon build up. Example 10 In embodiments of the laser assemblies of Examples 2-7 and 13-26, the internal cavity comprises a gas consisting of at least 10% Oxygen; whereby during operation of the solid-state device CO2is created within the internal cavity from carbon based contaminates; whereby the propagation surface of the solid-state device and the optics assembly remain free of Carbon build up. Example 11 In embodiments of the laser assemblies of Examples 2-7 and 13-26, the internal cavity comprises a gas consisting of at least 20% Oxygen; whereby during operation of the solid-state device CO2is created within the internal cavity from carbon based contaminates; whereby the propagation surface of the solid-state device and the optics assembly remain free of Carbon build up. Example 12 In embodiments of the laser assemblies of Examples 2-7 and 13-26, the internal cavity comprises a gas consisting of from about 5% to at least about 50% Oxygen; whereby during operation of the solid-state device CO2is created within the internal cavity from carbon based contaminates; whereby the propagation surface of the solid-state device and the optics assembly remain free of Carbon build up. Example 13 In embodiments of the laser assemblies of Examples 2-12 and 17-26, the degradation rate of the beam properties is 2.0% per khrs or less. Example 14 In embodiments of the laser assemblies of Examples 2-12 and 17-26, the degradation rate of the beam properties is 1.8% per khrs or less. Example 15 In embodiments of the laser assemblies of Examples 2-12 and 17-26, the assembly has, and is characterized by, having an extended lifetime of not less than 10,000 hours. Example 16 In embodiments of the laser assemblies of Examples 2-12 and 17-26, the assembly is characterized by having an extended lifetime of not less than 5,000 hours. Example 17 Turning toFIG.5there is provided a schematic of a high power, high brightness solid-state laser assembly500, for providing a high-quality blue laser beam550over long periods of time without substantial degradation of the laser beam properties, the assembly having: a housing526, the housing defining an internal cavity534; wherein the internal cavity is isolated from an environment535that is external to the housing526; a plurality of diode laser devices,501a,501b,501c,501d,501e, for propagating a plurality of laser beams, e.g., beam550, from a plurality of facets, e.g., facet504, along a plurality of diode laser beam paths, e.g., path550a, wherein the laser beams have a wavelength in the range of 400 nm to 500 nm; and wherein each laser beam has a power density of at least about 0.5 MW/cm2at each of the facets; an optics assembly502, the optics assembly in optical communication with each of the diode laser devices and on the laser beam paths; the optics assembly comprising collimating optics, e.g., collimating optic560, and beam combining optics565; the optics assembly502combining the plurality of diode laser beams to provide a combined laser beam552along a combined laser beam path552a; wherein the plurality of diode laser devices and the optics assembly are located within the housing526and in the internal cavity534, whereby the plurality of diode laser devices and the optics assembly are isolated from the external environment535; the housing comprising a housing propagation surface525, whereby the combined laser beam is transmitted from the housing526into the external environment535along the combined laser beam path552a; the housing propagation surface525in optical communication with the optics assembly502and on the combined laser beam path552a; the combined laser beam552upon exiting the housing propagation surface525characterized by beam properties, the beam properties comprising: (i) a power of at least 100 W; and, (ii) a BPP of less than 40 mm mrad; and, the internal cavity534being free from sources of silicon based contaminates, whereby during operation of the plurality of diode laser devices SiO2is not produced within the internal cavity; whereby the internal cavity remains free of SiO2build up; thereby the degradation rate of the combined beam properties is 2.3% per khrs or less. Example 18 In embodiments of the laser assemblies of Example 17, and other Examples, the beam properties further comprise a bandwidth of about 15 nm or less; the housing propagation surface is selected from the group consisting of a window and a fiber face; the BPP is less than about 15 mm mrad; and, the power density at the propagation surface is from about 0.5 MW/cm2to about 1,000 MW/cm2. Example 19 In embodiments of the laser assemblies of Example 17, and other Examples, the beam properties further comprise a bandwidth of about 15 nm or less; the power of the combined laser beam is at least about 500 W; the housing propagation surface is selected from the group consisting of a window and a fiber face; the BPP is less than about 30 mm mrad; and, the power density at the propagation surface is from about 0.5 MW/cm2to about 1,000 MW/cm2. Example 20 Turning toFIG.6there is provided a schematic of a high power, high brightness solid-state laser assembly600, for providing a high-quality blue laser beam650along a laser beam path650aover long periods of time without substantial degradation of the laser beam properties, the assembly having: a housing626, the housing defining an internal cavity634; wherein the internal cavity634defines an isolated environment; a plurality of optically active surfaces, e.g., surface604a, surface604b, surface604c, surface604d, surface604e, wherein a blue laser beam is propagated from, transmitted into or reflected by the optically active surfaces; the plurality of optically active surfaces located within the isolated environment of the internal cavity634of the housing; at least one of the optically active surfaces being located on a solid-state laser device601; wherein the laser beam has a power density of at least about 0.5 MW/cm2at one or more of the optically active surfaces, e.g., surface604a, surface604b, surface604c, surface604d, surface604e; and, the internal cavity634being free from sources of silicon based contaminates, whereby during operation of the solid-state laser device SiO2is not produced within the internal cavity; wherein the internal cavity634comprises a gas comprising Oxygen; whereby during operation of the solid-state laser device CO2is created within the internal cavity from carbon based contaminates; whereby the plurality of optically active surfaces remain free of carbon and SiO2build up; thereby the degradation rate of a power of the blue laser beam is 2.3% per khrs or less. Optically active surface604eis a window providing for transmission of the laser beam650out of the housing and into an external environment635. Example 21 The laser assembly600ofFIG.6and the laser assembly500ofFIG.5, where the solid-state laser produces a laser beam having a wavelength in the green wavelength range. Example 21A The green solid-solid state laser of Example 22 is an IR laser system that is doubled in a lithium niobite crystal. The system would have a laser diode, an external cavity and a lithium niobite crystal at the focal point of the external cavity, all of which would be contained within the housing. Example 22 The laser systems and assemblies of Examples 2-21, 21A, where the laser beams have a band width of about 5 nm, about 10 nm, about 20 nm, from about 10 nm to about 30 nm, from about 5 nm to about 40 nm, about 20 nm or less, about 30 nm or less, about 15 nm or less, about 10 nm or less. Example 23 The laser systems and assemblies of Examples 2-23, where the laser beam at, or near, the point where the beam exits the housing and propagates into the exterior environment, has powers of from about 100 W to about 100,000 W, from about 100 W to about 40,000 W, from about 100 W to about 1,000 W, about 200 W, about 250 W, about 500 W, about 1,000 W, about 10,000 W, at least about 100 W, at least about 200 W, at least about 500 W, and at least about 1,000 W. Example 24 The laser systems and assemblies of Examples 2-23, where the laser beam has a BPP of from about 10 mm-mrad to about 50 mm-mrad, less than about 40 mm-mrad, less than about 30 mm-mrad, less than about 20 mm-mrad, less than about 15 mm-mrad, and less than about 10 mm-mrad. Example 25 The laser systems and assemblies of Examples 2-23, where the sources of silicon based contaminates are siloxanes, polymerized siloxanes, linear siloxanes, cyclic siloxanes, cyclomethicones, poly-siloxanes and combinations and variations of one or more of these. Example 26 The laser systems and assemblies of Examples 2-25, where the sources of carbon based contaminates are solvent residues, oils, fingerprints, other sources of hydrocarbons and combinations and variations of one or more of these. Example 27 Embodiments of solid-state, high brightness blue lasers are shown in Table 1. This table shows the power, brightness and performance that can be achieved with 2.5 Watt laser diodes in a two dimensional spectrally beam combined configuration. This table illustrates how the power and brightness of laser systems based on a building block 350 Watt module scales to the multi-kW power level using fiber combiners to launch into a process fiber. TABLE 1BPPModulesOutput Power(mm-mrad)135052700133105014414001551750176210019724501982800219315023103500241138502512420027134550271449002815525029165600301759503118630032 The systems providing the beams of Table 1 have degradation rate of the beam properties that is from about 5% to about 1.5% per khrs or less, 2.5% per khrs or less, 2.0% per khrs or less, 1.8% per khrs or less, 1.0% per khrs or less and smaller values. The systems providing the beams of Table 1 have lifetimes of from at least about 5,000 hours to about 100,000 hours, at least about 5,000 hours, at least about 10,000 hours, at least about 20,000 hours, at least about 40,000 hours from about 10,000 hours to about 50,000 hours and longer lifetimes. Example 28 The same modules of EXAMPLE 27 may also be combined in free space which conserves brightness but makes module replacement slightly more complicated. The power and beam parameter products that can be achieved with free space combination are shown in Table 2. TABLE 2Process FiberBPPOutput Power(microns)(mm-mrad)35045570090910509710140010911175012213210013514245013514280014916315016317350017218385018119420019120455019520490020321525020822560021623595021923630023024 The systems providing the beams of Table 2 have degradation rate of the beam properties that is from about 5% to about 1.5% per khrs or less, 2.5% per khrs or less, 2.0% per khrs or less, 1.8% per khrs or less, 1.0% per khrs or less and smaller values. The systems providing the beams of Table 2 have lifetimes of from at least about 5,000 hours to about 100,000 hours, at least about 5,000 hours, at least about 10,000 hours, at least about 20,000 hours, at least about 40,000 hours from about 10,000 hours to about 50,000 hours and longer lifetimes. Example 29 Embodiments of solid-state, high brightness blue lasers are shown in Table 3 for systems using a higher power blue laser diode with each device being approximately 6.5 Watts. The base module is now approximately 900 Watts and these modules are combined through fiber combiners to build high power, high brightness blue laser diode systems. As shown in Table 3. TABLE 3BPPNumber of ModulesOutput Power(mm-mrad)1882521,7641332,6461443,5281554,4101765,2921976,1741987,0562197,93823108,82024119,702251210,584271311,466271412,348281513,230291614,112301714,994311815,87632 The systems providing the beams of Table 3 have degradation rate of the beam properties that is from about 5% to about 1.5% per khrs or less, 2.5% per khrs or less, 2.0% per khrs or less, 1.8% per khrs or less, 1.0% per khrs or less and smaller values. The systems providing the beams of Table 3 have lifetimes of from at least about 5,000 hours to about 100,000 hours, at least about 5,000 hours, at least about 10,000 hours, at least about 20,000 hours, at least about 40,000 hours from about 10,000 hours to about 50,000 hours and longer lifetimes. Example 30 Turning toFIG.7is a graph of laser power vs operating times. It can be seen that the blue laser diode assembly provides an operating profile where the rate of degradation (plotted line) is slow. The degradation rate has a flat portion at around 200 hrs to around 550 hours. After about 800 hours the rate of degradation is about 0.7% per khr. This rate of degradation shown for the time from 800 to 1,600 hours will remain the same (i.e., the slope of the plotted line will not materially change) for the remainder of the lifetime of the system. Example 31 Turning toFIG.8is a graph of laser power vs operating times. It can be seen that the blue laser diode assembly provides an operating profile where the rate of degradation (plotted line) is slow. The degradation rate has a flat portion at around 150 hrs to around 800 hours. After about 800 hours the rate of degradation is about 0.7% per khr. This rate of degradation shown for the time from 800 to 1,600 hours will remain the same (i.e., the slope of the plotted line will not materially change) for the remainder of the lifetime of the system. It is noted that there is no requirement to provide or address the theory underlying the novel and groundbreaking performance or other beneficial features and properties that are the subject of, or associated with, embodiments of the present inventions. Nevertheless, various theories are provided in this specification to further advance the art in this important area, and in particular in the important area of lasers, laser processing and laser applications. These theories put forth in this specification, and unless expressly stated otherwise, in no way limit, restrict or narrow the scope of protection to be afforded the claimed inventions. These theories many not be required or practiced to utilize the present inventions. It is further understood that the present inventions may lead to new, and heretofore unknown theories to explain the operation, function and features of embodiments of the methods, articles, materials, devices and system of the present inventions; and such later developed theories shall not limit the scope of protection afforded the present inventions. The various embodiments of lasers, diodes, arrays, modules, assemblies, activities and operations set forth in this specification may be used in the above identified fields and in various other fields. Additionally, these embodiments, for example, may be used with: existing lasers, additive manufacturing systems, operations and activities as well as other existing equipment; future lasers, additive manufacturing systems operations and activities; and such items that may be modified, in-part, based on the teachings of this specification. Further, the various embodiments set forth in this specification may be used with each other in different and various combinations. Thus, for example, the configurations provided in the various embodiments of this specification may be used with each other. For example, the components of an embodiment having A, A′ and B and the components of an embodiment having A″, C and D can be used with each other in various combination, e.g., A, C, D, and A. A″ C and D, etc., in accordance with the teaching of this Specification. The scope of protection afforded the present inventions should not be limited to a particular embodiment, configuration or arrangement that is set forth in a particular embodiment, example, or in an embodiment in a particular Figure. The invention may be embodied in other forms than those specifically disclosed herein without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects only as illustrative and not restrictive. | 55,654 |
11862928 | DETAILED DESCRIPTION OF PARTICULAR EMBODIMENTS In the figures and in the rest of the description, identical or similar elements have been designated with the same references. In addition, the various elements are not shown to scale for the sake of clarity of the figures. Moreover, the various embodiments and variants are not exclusive from one another and may be combined together. Unless otherwise indicated, the terms “substantially”, “about” and “of the order of” mean to within 10%, and preferably to within 5%. Moreover, the expression “comprised between . . . and . . . ” and equivalents mean that the limits are included, unless otherwise mentioned. FIGS.1A and1B, which have already been briefly described above, are schematic and partial transverse (FIG.1A) and longitudinal (FIG.1B) cross-sectional views of a laser source1according to one example of the prior art. Here, a three-dimensional orthogonal direct coordinate system XYZ, in which the XZ-plane is a plane parallel to the plane of the functionalized substrate20, the Z-axis being oriented along the longitudinal axis of the active waveguide, the X-axis being oriented in the direction of the width of the waveguides, and the Y-axis being oriented from the functionalized substrate20toward the semiconductor pad10of the laser source1, is defined; this coordinate system will be referred to in the rest of the description. In the rest of the description, the terms “lower” and “upper” are to be understood to be relative to positions of increasing height in the +Y-direction. The laser source1is here a distributed-feedback (DFB) laser, but it may equally well be a DBR laser. It comprises a semiconductor pad10made of at least one semiconductor compound, here a III-V compound, and arranged on a functionalized substrate20, here a silicon-on-insulator (SOI) substrate. The optical cavity is formed by a Bragg grating2located in the integrated waveguide22, which extends longitudinally facing the active waveguide12. The semiconductor pad10contains the gain medium, which is located in a first waveguide, referred to as the active waveguide. It comprises a layer11containing an alternation of multiple quantum wells and barrier layers, the quantum wells for example being made of InGaAsP (or AlGaInAs), with a maximum gain for example centred on the wavelength A equal to 1310 nm. The quantum-well layer11is flanked along the Y-axis by n- and p-doped semiconductor layers, which are for example made of InP. Thus, the semiconductor pad10contains a PIN junction that extends parallel to the XZ plane. The active waveguide12comprises optical amplifying means for producing a stimulated light emission, here the quantum-well layer11. It extends in a longitudinal direction, here along the Z-axis. The functionalized substrate20is a carrier substrate of the semiconductor pad10, and incorporates optical functions of a photonic circuit. It comprises to this end a second waveguide, referred to as the integrated waveguide, belonging to the integrated photonic circuit. The functionalized substrate20is here a silicon-on-insulator (SOI) substrate, so that the integrated waveguide22comprises a core made of silicon encircled by a silicon oxide forming a cladding. More precisely, the functionalized substrate20comprises: a base layer21made of silicon oxide; the integrated waveguide22made of silicon that rests on the base layer21; and at least one layer of silicon oxide that encircles the integrated waveguide22and ensures a vertical spacing along the Y-axis between the latter and the semiconductor pad10. The integrated waveguide22comprises a first portion23that rests in contact with the base layer21, and a second portion24that rests on the first portion23. The first portion23is here made of crystalline silicon, and preferably of single-crystal silicon, and is formed from the layer of crystalline silicon of the SOI substrate. The second portion24may be made of amorphous silicon. It is therefore a question of a stack, along the Y-axis, of the first longitudinal portion23and of the second longitudinal portion24, which portions extend longitudinally along the axis of the integrated waveguide22. In this example, the integrated waveguide22is a rib guide. In other words, the first portion23forms a slab23, and the second portion24forms a longitudinal rib. The longitudinal rib24is a narrow ridge that protrudes with respect to the slab23in the +Y-direction. The width W2of the integrated waveguide22is here the width of the longitudinal rib24along the X-axis, which width is smaller than the width of the slab23. The integrated waveguide22is spaced apart from the semiconductor pad10by an upper layer26of silicon oxide. The integrated waveguide22is oriented, in the region of optical coupling, parallel to the active waveguide12, and is located perpendicular thereto along the Y-axis. The two waveguides are optically coupled to each other so as to support a hybrid optical mode. The integrated waveguide22here comprises a Bragg grating2defining the optical cavity. The Bragg grating2is here distributed along at least one portion of the active waveguide12(DFB laser source). It is formed by a periodic alternation of teeth2.1and of troughs2.2that are formed in the upper face of the longitudinal rib24of the integrated waveguide22. The troughs2.2are thus filled with the upper layer26of silicon oxide. Thus, the Bragg grating2is located on that face of the integrated waveguide22which is oriented toward the semiconductor pad10. FIGS.2Aa to2Hbillustrate an example of a process for fabricating a hybrid laser source1similar to that described above with reference toFIGS.1A and1B. The figures contain one transverse cross-sectional view (left-hand side) of an XY-plane, and one longitudinal cross-sectional view (right-hand side) of a YZ-plane passing through the centre of the integrated waveguide22. FIGS.2Aa and2Abillustrate a first step of producing the first portion23of the integrated waveguide22, here the slab23. The slab23is produced by structuring a layer of single-crystal silicon of an SOI substrate. It has a thickness H1equal to that of the layer of single-crystal silicon, for example of about 300 nm, and rests on a thick layer of silicon oxide, of SiO2 for example, of a thickness of the order of a few tens to a few hundred microns. The slab23may have a width W1for example equal to 10 μm and is encircled laterally, in the XZ-plane, by a layer of silicon oxide (not shown). FIGS.2Ba and2Bbillustrate the production of a longitudinal aperture31in an intermediate layer25, with a view to forming the longitudinal rib24. To this end, an intermediate layer25, made of silicon oxide for example, is deposited so as to cover the slab23, and a longitudinal aperture31that opens onto a surface of the single-crystal silicon is produced by photolithography. The aperture extends longitudinally along the Y-axis. The longitudinal aperture31has a depth corresponding to the desired height H2of the longitudinal rib24, for example here about 200 nm. The width of the longitudinal aperture31along the X-axis defines the width W2of the longitudinal rib24, and may be equal to about 3 μm. FIGS.2Ca and2Cbillustrate the deposition of amorphous silicon. To do this, a wafer-scale deposition of a layer27of amorphous silicon is carried out so as to entirely fill the longitudinal aperture31formed in the intermediate layer25. FIGS.2Da and2Dbillustrate planarization, by chemical-mechanical polishing (CMP), of the deposited amorphous silicon, so as to preserve the amorphous silicon located in the longitudinal aperture31, and to remove the amorphous silicon resting on the upper face of the intermediate layer25. A longitudinal rib24made of amorphous silicon of a width W2of about 3 μm and of a thickness H2of the order of about 200 nm is thus obtained, resting in contact with the slab23made of single-crystal silicon of a width W1of about 10 μm and of a thickness of about 300 nm. However, the inventors have observed that this step of planarization by CMP may lead to the formation of dishing32in the segment of amorphous silicon located in the longitudinal aperture31. In other words, a concavity is formed in the segment of amorphous silicon, from its upper face, this causing the thickness H2to vary in the XZ-plane. Thus, the thickness H2has a value substantially equal to about 200 nm on the border of the longitudinal rib24, and decreases in the direction of the centre of the longitudinal rib24. The dishing32may have a maximum value of about a few tens of nanometres, about 25 nm for example, this being of the same order of magnitude as the depth of the troughs2.2of the Bragg grating2(between about 10 nm for a DBR source and about 50 nm for a DFB source). FIGS.2Ea to2Fbillustrate production of the Bragg grating2in the longitudinal rib24of the integrated waveguide22from the upper face of the longitudinal rib24. To this end, an etch mask33is deposited so as to cover the longitudinal rib24and holes33.1, here through-holes, intended for production of the Bragg grating2are produced. The material of the etch mask33may be, inter alia, a silicon nitride. A dry RIE etch is then performed so as to form the Bragg grating2in the longitudinal rib24from its upper face, and the etch mask33is entirely removed. The Bragg grating2is then formed from a periodic alternation of troughs2.2and teeth2.1. In this example, the depth of the troughs2.2is of the order of about 50 nm; however, as may be seen, because of the dishing32caused by the CMP planarization, it is not uniform in the XZ-plane. An undesired spatial non-uniformity in the dimensions of the patterns of the Bragg grating2, which may lead to a degradation of the performance of the Bragg grating2and therefore of the laser source1, results therefrom. FIGS.2Ga and2Gbillustrate the deposition of the upper layer26of silicon oxide, so as to entirely cover the intermediate layer25of silicon oxide and the longitudinal rib24of amorphous silicon. This upper layer26ensures the spacing between the integrated waveguide22and the semiconductor pad10, and may have a thickness for example equal to about 100 nm (and preferably comprised between about 80 nm and 140 nm). FIGS.2Ha and2Hbillustrate the production of the semiconductor pad10on the functionalized substrate20. In a known way, an assembly is produced by bonding a stack of, here III-V, semiconductor layers containing quantum wells to the functionalized substrate20. Steps of structuring the semiconductor stack are then performed to obtain the semiconductor pad10of desired size. The known steps of encapsulating the semiconductor pad10with a passivation layer and of producing the biasing electrodes are not described. Hence, this process for fabricating a laser source1that is identical or similar to the one illustrated inFIGS.1A and1B, which employs a damascene process (filling of the longitudinal aperture31then chemical-mechanical polishing), may lead to dishing32in the deposited amorphous silicon intended to form the longitudinal rib24. This dishing32, which results in a spatial non-uniformity in the thickness of the amorphous silicon, causes the dimensions of the Bragg grating2to be non-uniform in the XZ-plane. The performance of the Bragg grating2and hence of the laser source1may therefore be degraded. Moreover, with reference toFIGS.2Fa and2Fb, the inventors have observed that, following production of the patterns of the Bragg grating2, transverse physical contact, i.e. contact along the X-axis, may be interrupted locally between the amorphous silicon of the teeth2.1and the silicon oxide of the intermediate layer25. This lack of physical contact between the materials results in the presence of empty regions on either side of the teeth2.1along the X-axis, at the interface between the teeth2.1made of amorphous silicon and the intermediate layer25made of silicon oxide. These empty regions may lead to optical losses that degrade the performance of the integrated waveguide22, and therefore also that of the laser source (and notably to an undesirable alteration of the emission wavelength). Thus, to preserve the performance of the Bragg grating2during the fabricating process, and thus to obtain a Bragg grating2the dimensions of the teeth2.1and of the troughs2.2remain uniform in the XZ-plane, the Bragg grating2of the laser source1according to the invention is located between the first portion23and the second portion24of the integrated waveguide22and is formed from the upper face of the first portion23. Thus a Bragg grating2, referred to as the intermediate grating, is obtained. In addition, this arrangement of the Bragg grating2within the integrated waveguide22allows the formation of empty regions located at the interface between the teeth2.1and the intermediate layer25to be avoided. FIGS.3Aa to3Hb,3I and3Jillustrate a process for fabricating a hybrid laser source1according to one embodiment. In this example, the laser source1is a DFB source, but it could equally well be a DBR source. Each figure contains one transverse cross-sectional view (left-hand side) of an XY-plane, and one longitudinal cross-sectional view (right-hand side) of a YZ-plane passing through the centre of the integrated waveguide22. The laser source1according to this embodiment differs from the one described with reference toFIGS.1A and1Bessentially in that the Bragg grating2is arranged in the first portion23in the upper face thereof, and not in the second portion24. In this example, since the integrated waveguide22is a rib guide, the first portion23is a slab23and the second portion24is the longitudinal rib24. FIGS.3Aa and3Abillustrate a first step of producing the slab23of the integrated waveguide22. The slab23is formed by structuring a layer of crystalline silicon of an SOI substrate, so that it has a thickness H1equal to that of the silicon layer of an SOI substrate, for example about 300 nm. It rests on a thick layer of silicon oxide, for example of SiO2, of a thickness for example comprised between 720 nm and a few microns. This step is similar or identical to that described above with reference toFIG.2A. FIGS.3Ba,3Bb,3Ca and3Cbillustrate the production of the Bragg grating2in the slab23made of crystalline silicon from its upper face. To this end, an etch mask33(for example of Si3N4) is deposited so as to cover the slab23, and holes33.1, here through-holes, intended for the production of the Bragg grating2are produced. Dry RIE etching is then performed so as to form the Bragg grating2in the slab23made of crystalline silicon from its upper face, and the etch mask33is entirely removed. In so far as the slab23made of crystalline silicon is obtained from the silicon layer of the SOI substrate and is not formed using a damascene process, it has a thickness H1that is substantially uniform in the XZ-plane. Thus, the dimensions of the patterns of the Bragg grating2are uniform in the XZ-plane. FIGS.3Da and3Dbillustrate the deposition of a filling layer34made of a low-index material, for example a silicon oxide or a silicon nitride. Here, a silicon oxide is deposited, and covers the slab23and therefore entirely fills the troughs2.2of the Bragg grating2. The filling layer34is advantageously made of silicon oxide, and may thus participate in the production of the longitudinal rib24while forming subsequently the intermediate layer25, which then encircles the longitudinal rib24in the XZ-plane. FIGS.3Ea and3Ebillustrate the production of a longitudinal aperture31in the filling layer34, this aperture being intended for production of the longitudinal rib24made of amorphous silicon of the integrated waveguide22. The longitudinal aperture31is here produced by dry etching with the end-point of the etching detected via the crystalline silicon of the slab23. The longitudinal aperture31is therefore here a through-aperture, so that the upper face of the teeth2.1made of crystalline silicon is freed whereas the troughs2.2of the Bragg grating2remain filled with the low-index material, here silicon oxide. FIGS.3FGa and3Fb illustrate the deposition of amorphous silicon. To this end, a wafer-scale deposition of a layer27of amorphous silicon is carried out so as to entirely fill the longitudinal aperture31formed in the intermediate layer25of silicon oxide. The amorphous silicon therefore makes contact with the crystalline silicon of the teeth2.1of the Bragg grating2and with the silicon oxide filling the troughs2.2. FIGS.3Ga and3Gbillustrate the planarization by chemical-mechanical polishing (CMP) of the deposited amorphous silicon, so as to preserve the amorphous silicon located in the longitudinal aperture31in the layer of silicon oxide and to remove the amorphous silicon resting on the upper face of the filling layer34. In this example, since the filling layer34is a silicon oxide, it is advantageously preserved and forms the intermediate layer25that participates in encircling the integrated waveguide22in the XZ-plane. This step of planarization by CMP may lead to the formation of dishing32in the longitudinal ridge24of amorphous silicon. Said ridge therefore exhibits a thickness non-uniformity in the XZ-plane. However, unlike the process described above, this non-uniformity in the thickness of the amorphous silicon planarized by CMP has no impact on the dimensions and therefore on the performance of the Bragg grating2. FIGS.3Ha and3Hbillustrate the deposition of the upper layer26of silicon oxide, so as to entirely cover the intermediate layer25of silicon oxide and the longitudinal rib24of amorphous silicon. This upper layer26ensures the spacing between the integrated waveguide22and the semiconductor pad10, and may have a thickness for example equal to about 100 nm. FIGS.3I and3Jillustrate the production of the semiconductor pad10on the functionalized substrate20. In a known way, an assembly is produced by bonding a stack of, here III-V, semiconductor layers containing quantum wells to the functionalized substrate20. Steps of structuring the semiconductor stack are then performed to obtain the semiconductor pad10of desired size and comprising an active waveguide12. Therefore, as a result, by arranging the Bragg grating2in the first portion23of the integrated waveguide22(here the slab23), and more precisely in its upper face, the dishing32that may be formed in the CMP step is prevented from degrading the uniformity of the dimensions of the patterns of the Bragg grating2. Moreover, the risk of loss of lateral contact between the teeth2.1made of crystalline silicon of the Bragg grating2and the intermediate layer25made of silicon oxide is avoided. Thus, the performance of the Bragg grating2and therefore that of the laser source1is preserved. FIGS.4A to4Cillustrate examples of spectral reflectivity response of various Bragg gratings. FIG.4Acorresponds to an integrated waveguide22that is identical or similar to that described with reference toFIGS.1A and1B. It is formed from a slab23made of single-crystal silicon of a width W1of 10 μm and of a thickness H1of 300 nm. It is covered locally with a longitudinal rib24made of amorphous silicon of a width W2of 3 μm and of a thickness H2of 200 nm. It is encircled by SiO2. The Bragg grating2is located in the upper face of the longitudinal rib24, and is therefore not an intermediate Bragg grating2. It is formed from a periodic alternation of troughs2.2of a depth of 10 nm and of a width here equal to W2along the X-axis, and of teeth2.1of a dimension along the Z-axis of P=λ/2neff, i.e. equal to about 200 nm, P being the period of the Bragg grating and neffthe effective index of the optical mode (neff≈3.29 for the hybrid III-V/silicon mode). Along the Z-axis, the troughs2.2and the teeth2.1preferably have a fill factor of 50% (P/2). The wavelength of the guided mode is here 1.31 μm. It may be seen that, for such a Bragg grating2of a length of 300 μm, the spectral reflectivity response (as estimated using the commercially available simulation software package GratingMOD from Rsoft) has a peak of a maximum value of 97% and a full width at half maximum of 1.8 nm. FIG.4Bcorresponds to an integrated waveguide22that is identical or similar to that described with reference toFIGS.3I and3J, i.e. an integrated waveguide that comprises an intermediate Bragg grating2. The integrated waveguide22is formed from a slab23made of crystalline silicon of a width W1of 10 μm and of a thickness H1of 300 nm. The Bragg grating2is formed in the upper face of the slab23. It has the same dimensions as that ofFIG.4A, and the troughs2.2are filled with SiO2. The longitudinal rib24made of amorphous silicon covers the slab23and the Bragg grating2. It has a width W2of 3 μm and a thickness H2of 200 nm. It may be seen that, for such a Bragg grating2of a length of 300 μm and a wavelength of 1.31 μm, the spectral reflectivity response has a higher peak, equal to 100% and a larger full width at half maximum of 12 nm. FIG.4Ccorresponds to an integrated waveguide22that is similar to that described with reference toFIG.4B, i.e. an integrated waveguide that comprises an intermediate Bragg grating2, and that differs therefrom only in that it has a length of 30 μm. The spectral reflectivity response of such a grating here has a peak equal to 93% and a full width at half maximum of 16 nm. Thus, depending on the targeted application, the performance of an integrated waveguide22comprising an intermediate Bragg grating2located between the first portion23and the second portion24may be improved while the length of the grating is kept the same, or may be kept broadly the same while the length of the grating is decreased. FIGS.5Aa to5Dbillustrate certain steps of a process for fabricating a laser source1according to one variant embodiment. The laser source1according to this embodiment differs from that described with reference toFIGS.3Aa and3Aband the related figures essentially in that the integrated waveguide22comprises a thin continuous layer34.1made of low-index material arranged at the interface between the first portion23and the second portion24. The fabricating process comprises steps of producing a slab23made of crystalline silicon from an SOI substrate, of producing the etch mask33containing holes33.1, of etching the etch mask33and producing the Bragg grating2in the slab23, and of depositing a filling layer34made of a low-index material. These steps are identical or similar to those described with reference toFIGS.3Aa to3Dband are not described again. FIGS.5Aa and5Abillustrate the production of a longitudinal aperture31in the filling layer34, which aperture is intended for the production of the longitudinal rib24made of amorphous silicon of the integrated waveguide22. The longitudinal aperture31is here produced by dry etching that is stopped in time, so as not to produce a through-aperture but to preserve a thin continuous layer34.1that covers the upper face of the slab23made of crystalline silicon. Thus, the teeth2.1made of crystalline silicon remain covered by the thin continuous layer34.1, which still fills the troughs2.2of the Bragg grating2. The thin continuous layer34.1has a thickness chosen so as to be optically neutral with respect to the guided optical mode. To this end, it has a thickness on the teeth2.1of the Bragg grating2that is preferably smaller than or equal to 20 nm. Moreover, it has a substantially planar upper face. FIGS.5B, SC and SD5Ba to5Db are steps of depositing amorphous silicon, of CMP planarization then of depositing the upper layer26made of silicon oxide, respectively. These steps are identical or similar to those described above. Thus, an integrated waveguide22formed from a first portion23made of crystalline silicon containing an intermediate Bragg grating2located in its upper face, from a thin continuous layer34.1made of a low-index material that fills the troughs2.2of the Bragg grating2and covers the first portion23, and from a second portion24made of amorphous silicon that rests in contact with the thin continuous layer34.1is obtained. FIGS.6Aa to6Dbillustrate certain steps of a process for fabricating a laser source1according to another variant embodiment. The laser source1according to this embodiment differs from that described with reference toFIG.3Aand the associated figures essentially in that the troughs2.2of the Bragg grating2are filled with a silicon nitride and not with a silicon oxide. The fabricating process comprises steps of producing a slab23made of crystalline silicon from an SOI substrate, and of producing the etch mask33containing holes33.1. These steps are identical or similar to those described with reference toFIGS.3Aa to3Bband are not described again. FIGS.6Aa and6Abillustrate the structure obtained following the step of etching the etch mask33and of producing the Bragg grating2in the slab23. This step is similar to that described with reference toFIGS.3Ca and3Cb. FIGS.6Ba and6Bbillustrate the deposition of a filling layer34made of a low-index material different from silicon oxide, silicon nitride for example. The silicon nitride covers the slab23and therefore entirely fills the troughs2.2of the Bragg grating2. FIGS.6Ca and6Cbillustrate the production of a longitudinal aperture31in an intermediate layer25of silicon oxide. Beforehand, the filling layer34is thinned by CMP until the upper surface of the teeth2.1made of crystalline silicon is freed. The troughs2.2of the Bragg grating2remain filled with the silicon nitride. An intermediate layer25made of silicon oxide is then deposited so as to cover the slab23, then a longitudinal aperture31is produced by dry etching, for example RIE, with the end-point of the etching detected via the crystalline silicon of the slab23. Potential over-etching of the silicon nitride located in the troughs2.2of the Bragg grating2is thus limited. FIGS.6Da and6Dbillustrate the structure obtained after the steps of depositing amorphous silicon, of planarization by CMP and of depositing the upper layer26made of silicon oxide. These steps are similar to those described with reference toFIGS.3Fa to3Hb. Thus, an integrated waveguide22formed from a first portion23made of crystalline silicon containing an intermediate Bragg grating2located in its upper face, the troughs2.2of the Bragg grating2being filled with a silicon nitride, and from a second portion24made of amorphous silicon that rests in contact with the thin continuous layer34.1is obtained. Thus there is no need to have a thin continuous layer34.1located at the interface between the first and second portions23,24of the integrated waveguide22, and the risk of over-etching the low-index material located in the troughs2.2of the Bragg grating2is limited. Particular embodiments have just been described. Various variants and modifications will appear obvious to those skilled in the art. The integrated waveguide22described above is a rib waveguide. As a variant, the integrated waveguide22could be a slab waveguide, i.e. a waveguide formed from a first portion23and second portion24having the same width along the longitudinal axis. Likewise, the second portion24may have a local width larger than that of the first portion23(inverted rib waveguide). The laser source described above was a DFB source but it could have been a DBR source. In this case, two Bragg gratings would be placed on either side of the semiconductor pad10in order to define the optical cavity of the laser source. | 27,509 |
11862929 | DETAILED DESCRIPTION OF THE EMBODIMENTS In order to make the objectives, technical solutions, and advantages of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be described below with reference to the drawings. It will be appreciated that the described embodiments are some rather than all of the embodiments of the present disclosure. It should be understood that the present disclosure is not limited by the example embodiments described herein. Other embodiments conceived by those having ordinary skills in the art on the basis of the described embodiments without inventive efforts should fall within the scope of the present disclosure. In the following description, numerous specific details are given in order to provide a more thorough understanding of the embodiments of the present disclosure. However, it is obvious to those skilled in the art that the present disclosure can be implemented without one or more of these details. In some embodiments, in order to avoid confusion with the present disclosure, some technical features known in the art are not described. It should be understood that the present disclosure can be implemented in different forms and should not be construed as being limited to the embodiments presented here. On the contrary, the provision of these embodiments will make the disclosure more thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit the inventive concept. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “includes” and/or “including”, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the terms “and/or” includes any and all combinations of related listed items. In order to thoroughly understand the present disclosure, a detailed structured will be provided in the following description to explain the technical solutions provided in the present disclosure. The example embodiments of the present disclosure are described in detail below. However, in addition to these details descriptions, the present disclosure may also have other embodiments. In order to improve the conventional technology described above, the present disclosure provides a laser diode package module. The package module may include a substrate including a first surface; a cover disposed on the first surface of the substrate, a accommodation space may be formed between the substrate and the cover, where a light-transmitting area may be at least partially disposed on the surface of the cover opposite to the substrate; a laser diode die disposed in the accommodation space; and a reflective surface disposed in the accommodation space, the reflective surface may be used to reflect the emitted light of the laser diode die emit through the light-transmitting area. The packaging method of the present disclosure can be packaged by substrate packaging with high packaging efficiency, and the packaged die is suitable for the SMT. In addition, in the package module structure of the present disclosure, the pin path is short, and the parasitic inductance is greatly reduced compared with the TO package. Further, the laser diode die emits light from the side surface, and the direction of the emitted light can be substantially parallel to the first surface of the substrate. A reflective surface can be disposed on the propagation path of the emitted light of the laser diode die, and the emitted light can be reflected and emitted from the light-transmitting area on the cover, thereby changing the propagation direction of the light beam. Since the reflective surface is added to the propagation path of the emitted light, the bottom surface of the laser diode die may be mounted in the accommodation space, and the emitted light beam can be emitted in a direction substantially perpendicular to the first surface. In addition, the area of the bottom surface of the laser diode die is relatively large, which can facilitate the placement of the die and the position of the package module in the whole device. First Embodiment A specific embodiment of the laser diode package module of the present disclosure will be described in detail below with reference toFIG.1,FIG.2,FIGS.3A-3D, andFIGS.4A-4I. FIG.4Ais a cross-sectional view of the laser diode package structure according to an embodiment of the present disclosure, andFIG.4Bis a top view of the laser diode package module structure inFIG.4Aafter the cover is removed. In one embodiment, the laser diode package module structure of the present disclosure includes a substrate300including a first surface30. The substrate300may include various types of substrates, such as a printed circuit board (PCB) substrate, a ceramic substrate, a pre-mold substrate, etc. The ceramic substrate may be an aluminum nitride or an alumina substrate. The PCB may be made of different components and a variety of complex process technologies. The structure of the PCB may include a single-layer, double-layer, multi-layer structure, and different hierarchical structure may have different manufacturing methods. In some embodiments, the PCB is mainly composed of pads, through holes, mounting holes, wires, components, connectors, filing, electrical boundaries, etc. Further, the conventional layer structures of the PCB includes single-layer PCB, double-layer PCB, and multi-layer PCB. The specific structures are described below. (1) Single-layer PBC: a circuit board with copper on one side and no copper on the other side. Generally the components are placed on the side without copper, and the side with copper is mainly used for wiring the welding. (2) Double-layer PCB: a circuit with copper on both sides. Generally one side is called the top layer, and the other side is call the bottom layer. Generally, the top layer is used as the surface for placing components and the bottom layer is used as the welding surface for components. (3) Multi-layer PCB: a circuit board including multiple working layers. In addition to the top and bottom layers, it also includes several intermediate layers. Generally the intermediate layers can be used as a wiring layer, signal layer, power layer, ground layer, etc. The layers are insulated from each other, and the connection between the layers is generally achieved via through holes. The PCB may include many types of working layers, such as the signal layer, protective layer, silk screen layer, internal layer, etc., which will not be repeated here. In addition, the substrate described in the present disclosure may also be a ceramic substrate. The ceramic substrate may refer to a special processed board in which copper foil is directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single-sided or double-sided) at a high temperature. The ultra-thin composite substrate from this process has excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength, and can be etched into various patterns like a PCB board, and has a large current-carrying capacity. Further, the substrate may be a pre-mold substrate. The pre-mold substrate may include injection molded wires and pins, and the injection molded wires may be embedded in the main structure of the substrate. The pins may be positioned on the surface of the main structure of the substrate, such as the inner surface and/or the outer surface, to realize the electrical connection between the substrate and the laser diode die, the driving chip, and the circuit board, respectively. The preparation method of the pre-mold substrate may include a conventional injection process, planer excavation process, and molding process, which will not be repeated here. The injection material of the pre-mold substrate may be a conventional material, such as a thermally conductive plastic material, etc., and is not limited to a certain type of material. The shape of the pre-mold substrate is limited by the injection frame, and is not limited to a certain type of shape. In addition, the laser diode package module structure may further include a laser diode die303, which may be disposed in the accommodation space. In some embodiments, the laser diode die303may be mounted on the first surface30of the substrate300. As an example, the laser diode die303may be a side laser, that is, the side of the laser diode die can emit light. A structure of the laser diode die is shown inFIG.1andFIG.2.FIG.1is a schematic diagram of a structure of a laser diode in a laser diode package module provided in the present disclosure, andFIG.2is a cross-sectional view of the laser diode of FIG.1along a B-B direction. The laser diode die includes a first electrode201and a second electrode202disposed opposite to each other, and the surface on which the first electrode201is positioned is mounted on the first surface of the substrate. In some embodiments, the first electrode201and the second electrode202may both be metalized electrodes. The first electrode201may be disposed on the bottom surface of the laser diode die, and the first electrode201may be an n-electrode. The second electrode202may be disposed on the top surface of the laser diode die, and the second electrode202may be a p-electrode. In one example, as shown inFIG.4A, the first electrode of the laser diode die303is mounted on the first surface of the substrate through a conductive adhesive layer, such as being mounted on a substrate metal layer3041corresponding to the first surface30of the substrate300. The laser diode die303may be a bare die, that is, a small piece of circuited “die” cut from a wafer, which is mounted on the substrate300by means of die bond. Die bond may refer to the process of bonding the die to a designated are of the substrate through glue, generally a conductive glue or an insulating glue, to form a thermal path or an electrical path to provide conditions for the subsequent wire bonding. In this embodiment, the first surface of the substrate is covered with a patterned metal layer. For example, as shown inFIGS.4A and4B, a substrate metal layer3041is disposed on the first surface30of the substrate300for electrical connection with the laser diode die303, A pattern may be formed on the substrate metal layer3041by etching the copper foil on the ceramic substrate. These substrate metal layers may also be used as alignment marks in the process of mounting various devices on the substrate. As an example, as shown inFIGS.4C and4D, a plurality of laser diode dies303are mounted on the first surface of the substrate, each laser diode die303corresponds to a substrate metal layer3041, and the substrate metal layers3041are isolated from each other. The substrate metal layer3041of the substrate may also be used to lead out electrodes of the laser diode die303positioned on the bottom surface to facilitate electrical connection with other devices. Further, the first electrode of each laser diode die303(that is, the electrode mounted on the substrate, also called the electrode on the bottom surface of the laser diode die) may be mounted on the first surface of the substrate corresponding to a conductive adhesive layer (not shown inFIGS.4C and4D), such as being mounted on the corresponding substrate metal layer3041on the first surface30of the substrate300. In addition, the adjacent conductive adhesive layers may be isolated from each other to prevent the electrodes on the bottom surface of the laser diode die from being electrical connected. In one example, the area of the conductive adhesive layer may be larger than the area of the bottom surface of the laser diode die; and/or the conductive adhesive layer may be electrically connected to a pad on the substrate through a wire to lead out the first electrode. In this embodiment, an electrical path may be formed by mounting the laser diode die303on the substrate through a conductive adhesive layer (not shown in FIGs). The material of the conductive adhesive layer (not shown in FIGs) may include a conductive silver paste, a solder, or a conductive die attach film (DAF). The conductive silver paste may be an ordinary silver paste or a nano-silver paste. The solder may include, but is not limited to AuSn20. In some embodiments, in order to ensure the placement accuracy and high heat dissipation, AuSn20 eutectic may be used for mounting. Since a solder such as AuSn20 is used as the conductive adhesive layer, it is basically non-volatile or low-volatile compared to other solders including volatile flux (such as a tin solder paste), therefore, the light output efficiency of the laser diode die will not be affected due to the volatile substances in the solder polluting the laser diode die and the reflective surface. In one example, the second electrode may be electrically connected to the substrate through a wire305, for example, the second electrode (e.g., a p-electrode) may be electrically connected to a pad306disposed on the substrate through the wire305. In some embodiments, the wire305may be a metal wire, such as a gold wire. The diameter of the gold wire may be about 1 mil (25.4 micrometer) or other suitable diameter, and the number of the wires305can be set reasonably based on actual needs. A plurality of wires may be used side by side to realize the electrical connection between the second electrode and the pad, and the wire arc may be pulled as low as possible. In one example, the shape of the laser diode die may be a column structure, for example, it may be a cuboid, a polyhedron, a column, or other suitable shapes, which will not be listed here. The exit surface of the laser diode die may be disposed on the side surface of one side of the cuboid structure of the laser diode die, and the side surface may be the smallest surface of the laser diode die. Further, the bottom surface of the laser diode die may be mounted in the accommodation space, where the area of the bottom surface of the laser diode die maybe relatively large, for example, larger than the area of the exit surface. In some embodiments, the bottom surface of the laser diode die may be mounted on the first surface of the substrate, and the side of the laser diode die may emit light. Due to the arrangement of the reflective surface, the bottom surface of the laser diode die may be mounted in the accommodation space and the emitting light may be emitted in a direction substantially perpendicular to the first surface. The area of the bottom surface of the laser diode die may be relative large, which is convenient for the placement of the die, and it is also convenient for the position setting of the package module in the whole device. In a specific embodiment, the laser diode die may have a cuboid structure, and the exit surface of the laser diode die may refer to the side surface of one side of the cuboid structure. As shown inFIG.1, the exit surface of the laser diode die is the side surface at the left side of the cuboid structure, where a light-emitting area203is disposed under the second electrode, and the light-emitting area203is close to the second electrode202, as shown inFIG.2. It should be noted that exit surface (also referred to as the light-emitting surface) may refer to the surface of the laser diode die emitting light. The exit surface may also be the side surface of the right side of the laser diode die, it may also be the front surface and rear surface of the laser diode die, and is not limited to the above example. As an example, the laser diode package module structure of the present disclosure may further include a reflective surface, which may be disposed in the accommodation space for making the emitting light of the laser diode die reflected by the reflective surface to emit through the light-transmitting area. In some embodiments, the emitted light of the laser diode die may be reflected by the reflective surface, and then emitted through the light-transmitting area in a direction substantially perpendicular to the first surface of the substrate. In one example, the package module may also include a semiconductor with an anisotropic structure. The semiconductor with an anisotropic structure may include, but is not limited to silicon, and may also be other semiconductor materials, such as germanium and III-V group (such as GaAs) compound semiconductors. In some embodiments, the semiconductor may include a semiconductor wafer, such as a single crystal silicon wafer. In one example, the reflective surface may specifically be an inclined surface prepared by etching the semiconductor using anisotropy. Since the semiconductor itself has the function of reflecting light, the inclined surface of the semiconductor may be directly used as the reflective surface. As an example, as shown inFIGS.3A and3B, the semiconductor is a silicon wafer301. The material of the semiconductor, silicon, has anisotropic characteristics due to its diamond cubic lattice structure, and has anisotropic characteristics in terms of etching. As shown inFIG.3A, a crystal orientation <100> of the silicon wafer301and a crystal orientation <111> form an angle of 54.74°. Since the angle is determined by the material lattice structure, it will not change with the fluctuation of the parameters of the production process, therefore, the angle of the inclined plane prepared from the silicon wafer is basically 54.74°. Any suitable etchant may be used for the etching, for example, an inorganic alkali solution or an organic alkali solution may be used as the etchant. The inorganic alkaline solutions may include, but are not limited to KOH, and the organic alkaline solutions may include, but are not limited to tetramethylammonium hydroxide (TMAH). Further, the semiconductor may be etched using anisotropy to obtain at least one inclined surface. In one example, at least two obliquely arranged reflective surfaces may be disposed on different inclined surfaces prepared by etching the semiconductor using anisotropy. Taking the silicon wafer as an example, as shown inFIGS.3A and3B, the silicon wafer301is etched using anisotropy to prepare an inclined surface, and at least one inclined surface can be prepared by a suitable etching method, for example, by etching through the upper and lower surfaces of the silicon wafer to form the structure shown inFIG.3B. The left image ofFIG.3Bshows a silicon wafer301with one inclined surface, or the right image ofFIG.3Bshows a silicon wafer301with two opposite inclined surfaces. The cross-sectional shape of the semiconductor (such as the silicon wafer301) may be a right-angled trapezoid or an isosceles trapezoid. The reflective surface mentioned in the present disclosure may be disposed on different inclined surfaces prepared by etching the semiconductor using anisotropy may refer to directly using the inclined surface of the semiconductor (such as a silicon wafer) as the reflective surface, or the reflective surface may include a reflective film coated on an inclined surface prepared by etching the semiconductor using anisotropy. For light beams with wavelengths between 300 and 1200 nm, the quantum efficiency absorbed by a monocrystalline silicon can exceed 50%. In one embodiment, the wavelength of the light beam emitted by the laser diode die may be about 905 nm. Within this range, the reflectivity of the monocrystalline silicon is approximately 70%. In some embodiments, in the case of using the monocrystalline silicon as a semiconductor, in order to improve the reflectivity, a reflectivity film may be coated on the inclined surface of the monocrystalline silicon. For example, as shown inFIG.3B, a reflective film302is coated on the inclined surface prepared by etching the silicon wafer301using anisotropy to increase the reflectivity of the reflective surface, thereby increasing the output power of the laser. The material of the reflective film302may include any suitable metal material that can reflect light. For example, the reflective film302may include at least one of gold, silver, and aluminum, where the reflectivity of gold or silver to the light beam with a wavelength of 905 nm is above 95%. A deposition method such as vacuum evaporation can be used to form the reflective film302on the inclined surface of the semiconductor. During the die bond process, due to the downward pressure, the sharp corners of the bottom of the semiconductor (such as the silicon wafer301shown inFIG.3B) may be relatively thin, and there may be a risk of corner chipping, which will cause the inclined surface to break near the bottom and generate debris. In order to avoid the corner chipping effect described above, a notch or a groove may be provided at the sharp corners of the bottom surface of the semiconductor. Since the size and formation position of the predetermined notch or shallow groove are more controllable then the chipping formed by the downward pressure, it can be ensured that the reflective surface can receive all the light spots emitted from the laser diode die without the corner chipping effect. In one example, as shown inFIG.3C, a plurality of notches3011are disposed at the sharp corners of the bottom surface of the semiconductor (e.g., the silicon wafer301). In some embodiments, the notch may specifically be a notch formed by removing a part of the bottom corner of the semiconductor, and a part of the bottom corner can be removed by etching. The etching may use a conventional dry etching process, such as reactive ion etching, ion beam etching, plasma etching, laser ablation, or any combination of these methods. A single etching method may be used, or more than one etching method may be used. In another example, as shown inFIG.3D, a plurality of shallow grooves3012are disposed at the sharp corners of the bottom surface of the semiconductor (e.g., the silicon wafer301). In some embodiments, the shallow groove3012may be provided at the edge of the sharp corner of the bottom surface and recess at a depth from the bottom surface of the semiconductor to the top surface of the semiconductor. The shallow groove3012may be formed by an etching method including, but is not limited to wet etching or dry etching. In one example, the method of forming the shallow groove may include forming a mask, such as a photoresist, on the bottom surface of the semiconductor; defining a predetermined pattern of shallow groove in the photoresist through a photolithography process; using the photoresist layer as a mask; etching the semiconductor from the bottom surface to from the shallow groove3012; and removing the photoresist layer at the end. In one example, an obliquely disposed reflectivity surface may be disposed in the package module. For example, as shown inFIGS.4A and4B, the reflective surface includes a reflective film302coated on an inclined surface prepared by etching the semiconductor (e.g., the silicon wafer301) using anisotropy. The reflective surface is disposed opposite to the exit surface of the laser diode die303, such that the exit light of the laser diode die303may be reflected by the reflective surface and then emitted through the light-transmitting area. When the angle between the reflective surface and the bottom surface of the semiconductor (e.g., the silicon wafer301) is substantially 54.74°, the emitted light of the laser diode die303may be reflected by the reflective surface and then emitted through the light-transmitting area at an angle substantially 19.48 to the normal of the substrate. In another example, as shown inFIGS.4C and4D, an obliquely disposed reflectivity surface is disposed in the package module. The reflective surface includes a reflective film302coated on an inclined surface prepared by etching the semiconductor (e.g., the silicon wafer301) using anisotropy. The reflective surface is disposed opposite to the exit surfaces of at least two laser diode dies303disposed side by side, such that the exit light of each laser diode die303may be reflected by the For example, and then emitted though the light-transmitting area, thereby realizing the 1×N one-dimensional multi-line package structure, where N is greater than or equal to 2. In this embodiment, the semiconductor (e.g., the silicon wafer301) is mounted on the first surface30of the substrate300through an adhesive layer (not shown in FIGs). For example, a substrate metal layer3042corresponding to the semiconductor may be disposed on the first surface30of the substrate300, and the semiconductor may be attached to the surface of the substrate metal layer3042on the first surface30of the substrate through an adhesive layer. The material of the adhesive layer may use the same material as the conductive adhesive layer described above. The material of the conductive adhesive layer (not shown in FIGs) may include a conductive silver paste, a solder, or a conductive die attach film (DAF), where the conductive silver paste may be an ordinary silver paste or a nano-silver paste. The solder may include, but is not limited to AuSn20. In some embodiments, in order to ensure the placement accuracy and high heat dissipation, AuSn20 eutectic may be used for mounting. In one example, the method of using AuSn eutectic for die bond may include the following processes of bonding the backside of the semiconductor and the surface of the substrate metal layer, where the substrate metal layer3042may be an AuSn alloy; providing gold at the back surface of the semiconductor; and heating for form an alloy between the gold on the back surface of the semiconductor and the substrate metal layer, which plays the role of fixing the semiconductor on the first surface of the substrate and making a good electrical connection. In another example, the adhesive layer may include an adhesive glue. The adhesive glue may be coated on the position where the semiconductor is scheduled to be placed on the substrate. Then the semiconductor may be placed on the adhesive glue. Subsequently, baking and curing may be performed, such that the semiconductor may be mounted on the first surface of the substrate. Further, as shown inFIG.4D, a plurality of laser diode dies303are mounted on the first surface of the substrate300. The first electrode (e.g., an n-electrode) of each laser diode die303corresponds to a substrate metal layer3041and is mounted on the first surface of the substrate300, and adjacent substrate metal layers3041are isolated from each other. In one example, as shown inFIG.4D, the second electrodes (e.g., a p-electrode) of the plurality of laser diode dies303opposite to the same reflective surface are electrically connected to the same pad306on the substrate300through the wires305. The pad306has a long strip shape and is disposed on the outside of the surface of the laser diode die303opposite to the exit surface. The material of the pad306may include aluminum or other suitable metal materials. In one example, the package module may include a semiconductor with an anisotropy structure, and at least two obliquely disposed reflective surfaces may be disposed on different inclined surfaces prepared by etching the semiconductor using anisotropy. For example, as shown in the right image ofFIG.3B, two obliquely disposed reflective surfaces are disposed on opposite oblique surfaces which are symmetrically disposed on the semiconductor (e.g., the silicon wafer301). Alternatively, two obliquely disposed reflective surfaces may also be disposed on two adjacent oblique surfaces on the semiconductor. In one example, at least two obliquely disposed reflective surfaces may be disposed in the package module, and each reflective surface may be disposed opposite to the exit surface of at least one of the laser diode dies, such that the emitted light of each laser diode die may be reflected by the reflective surface and emitted through the light-transmitting area. In one specific example, the package module may include at least two semiconductors with an anisotropic structure, and at least two obliquely disposed reflective surfaces may be respectively disposed on the inclined surfaces prepared by etching different semiconductors using anisotropy. The different semiconductors may be disposed on the substrate in any suitable arrangement, and the semiconductors may be spaced apart from each other and disposed in rows on the substrate. For example, taking the silicon wafer as an example, as shown inFIG.4E, the package module includes three silicon wafers301with an anisotropic structure, and three obliquely disposed reflective surfaces are respectively disposed on different oblique surfaces prepared by anisotropic etching of different silicon wafers301. Further, each of the reflective surfaces may be disposed opposite to the exit surfaces of at least two laser diode dies303arranged in parallel, such that the exit light of each laser diode die may be reflected by the reflective surface and emitted through the light-transmitting area, thereby realizing an M×N two-dimensional multi-line package. For example, as shown inFIGS.4E and4F, each reflective surface is disposed opposite to the emitting surface of six laser diode dies303disposed side by side, such that the emitted light of each laser diode die may be reflected by the reflective surface and emitted through the light-transmitting area. The number of laser diode dies303facing the same reflective surface can be reasonably selected based on the needs of the actual device. It should be noted that that only a semiconductor with one inclined surface is shown inFIG.4F, and the semiconductor may also be a semiconductor with at least two inclined surfaces. A plurality of laser diode dies303opposite to the same reflective surface may be arranged in any suitable interval on the first surface of the substrate. In some embodiments, as shown inFIG.4F, a plurality of laser diode dies303opposite to the same reflective surface are arranged at equal intervals on the first surface of the substrate300, such that the emitted lights of different laser diode dies303reflected by the reflective surface may be emitted at different intervals. When the package module of the present disclosure is applied to a lidar, each light emitted from the light-transmitting area needs to correspond to each receiver in a one-to-one correspondence. That is, a part of the laser light emitted by each laser diode die is reflected by the object to return to the corresponding receiver. As such, the transmitting and receiving positions need to be calibrated to make them correspond one-to-one. Therefore, the laser diode dies303are arranged at equal intervals, which is more convenient for the arrangement of the receivers. The distance between the exit surface of the laser diode die opposite to the same reflective surface and the reflective surface may be reasonably set based on the needs of the specific device. In some embodiments, as shown inFIG.4F, the distance between the exit surface of each laser diode die303opposite to the same reflective surface and the reflective surface is equal, thereby ensuring the general consistency of the light of each laser diode die reaching the reflective surface. In the technical solutions of the present disclosure, in some embodiments, as shown inFIGS.4A and4B, the direction of the emitted light of the laser diode die303is perpendicular to the bottom side of the reflective surface and parallel to the first surface of the substrate. The reflective surface is quadrilateral, and the side adjacent to and parallel to the first surface of the substrate serves as the bottom side. The light beam emitted from the laser diode die may be an elliptical spot. The divergence angle of the light beam along the direction perpendicular to the first surface of the substrate (herein referred to as the y direction) is large, which can be referred to as the fast axis, and the divergence angle of the light beam along the x direction (where the x direction is perpendicular to the y direction) is small, which can be referred to as the slow axis. Due to the difference in the light beam waist and divergence angle of the fast and slow axes, the light beam quality BPP of the fast and slow axes of the semiconductor laser can be very different. Therefore, the package module of the present disclosure may also include a collimating element for collimating the light beam, reducing the divergence angle of the light beam in the fast axis direction, or reducing the divergence angle of the light beam in the slow axis direction. The collimating element may be disposed between the laser diode die and the reflective surface, such that the emitted light from the laser diode die can reach the reflective surface after passing through the collimating element. The collimating element can eliminate astigmatism between the fast and slow axes, improve the light beam quality, compress the divergence angle of the light beam in the fast axis direction, and improve the radiation utilization rate of the laser diode die. The collimating element may be any element known to those skill in the art that can collimate light, such as a cylindrical lens, a D lens, an optical fiber rod, an aspheric lens, and the like. As shown inFIG.4G, taking the cylindrical lens309as the collimating element as an example, the cylindrical lens309is disposed between the laser diode die and the reflective surface in order to make all the emitted light reflected from the exit surface of each laser diode die303reach the cylindrical lens309. The curved surface of the cylindrical lens is opposite to the exit surface of the laser diode die303, such that the emitted light of the laser diode die303can irradiate the curved surface of the cylindrical lens309. In some embodiments, the size of the curved surface of the cylindrical lens309may be larger than the size of the spot of the light emitted from the laser diode die303on the plane where the light incident surface of the cylindrical lens309is located, thereby ensuring that all the emitted light can irradiate the cylindrical lens309and be collimated. In one example, the collimating element may be mounted on the first surface of the substrate. For example, as shown inFIG.4G, the cylindrical lens309is mounted on the first surface30of the substrate300. In one example, the surface of the collimating element mounted on the substrate300may be flat, and the plane arrangement can better combine the collimating element with the first surface of the substrate, such that the collimating element can be easily mounted on the substrate. In one example, the top surface of the collimating element may be flat. In the process of mounting the collimating element on the substrate, it generally involves the use of a transfer tool to pick up the collimating element, and then place the collimating element in a predetermined position. The top surface of the collimating element being flat can make the collimating element suitable for suction. The collimating element may be mounted on the substrate in any suitable manner. For example, the collimating element (e.g., the cylindrical lens309) may be mounted on the first surface of the substrate300through an adhesive layer. Further, the laser diode package module structure may further include a cover, which may be disposed on the first surface30of the substrate300, and a accommodation space may be formed between the substrate300and the cover. A light-transmitting area may be at least partially disposed on the surface of the cover opposite to the substrate300. In the embodiments of the present disclosure, the cover is not limited to a certain structure. The cover may be at least partially disposed with a light-transmitting area, and the emitted light of the laser diode die may be reflected by the reflective surface and emitted through the light-transmitting area. For example, in this embodiment, the cover is a metal shell with a glass widow. Further, as shown inFIGS.4A,4C,4E, and4G, the cover includes a U-shapes or a square cover307with a window, and a light-transmitting plate308that covers the window to from the light-transmitting area. The emitted light of the laser diode die303is reflected and emitted from the light-transmitting plate. The light-transmitting plate may be parallel to the first surface of the substrate, or the cover may be an all light-transmitting plate-like structure. Further, the cover can provide protection and an airtight environment for the die enclosed therein. As an example, the projection of the U-shaped cover307with the window on the first surface of the substrate may be circular or other suitable shapes. The projection of the square cover307on the first surface of the substrate is a square. The size of the square cover may match the size of the substrate, which can effectively reduce the package size. The material of the cover may be any suitable material. For example, the material of the cover may include metal, resin, or ceramic. In one example, the material of the cover307may use metal materials. The metal materials may be a material similar to the thermal expansion coefficient of the light-transmitting plate308, such as a Kovar alloy. Since the thermal expansion coefficient of the cover307and the light-transmitting plate308is similar, therefore, when the light-transmitting plate is bonded to the window of the cover307, the cracking of the light-transmitting plate due to the difference thermal expansion coefficient can be avoided. In some embodiments, the cover may be fixedly connected to the first surface of the substrate by welding. The welding may use any suitable welding method, such as parallel seam welding or store energy welding. In one example, the light-transmitting plate308may also be bonded to the inner side of the window of the cover. The light-transmitting plate308may be made of commonly used light-transmitting materials, such as glass, which needs to have high passability to the laser wavelength emitted by the laser diode die. In another example, the cover may be an all light-transmitting plate-like structure. The plate-shaped structure may use commonly used light-transmitting material, such as glass. The glass needs to have high passability to the laser wavelength emitted by the laser diode die. The overall structure of the substrate may be in the shape of a groove, and the groove may be a square groove or a circular groove. The cover may be disposed on top of the groove of the substrate and joined with the top surface of the substrate to cover the groove, and the accommodation space may be formed between the substrate and the cover. In the aforementioned package module solution shown inFIGS.4A to4G, due to the short pin path, the parasitic inductance is greatly reduced compared with the TO package, and the packaging can be performed through the operation of substrate packaging, which has high packaging efficient and the packaged die is suitable for SMT. In one example, as shown inFIGS.4H and4I, in order to improve the integration of the package, shorten the pin between the laser diode die303and the driving chip, and further reduce the inductance, the package module may further include a driving chip310for controlling the emission of the laser diode die303. The driving chip310may be disposed in the accommodation space, and the driving chip310may be mounted on the first surface30of the substrate300. In this embodiment, the driving chip310that controls the emission of the laser diode die and the laser diode die may be directly packaged together, and both may be packaged in the accommodation space formed between the substrate and the cover. By using this setting, the inductance between the laser diode die and the driving chip next to the laser diode die in the conventional TO package and the distributed inductance on the line can be eliminated to reduce the distributed inductance of the package module, thereby realizing high-power laser emission and narrow pulse laser driving. In some embodiments, in the package module, the laser diode die may be placed as close to the driving chip as possible. The shorter the distance between the laser diode die and the driving chip, the more effective the distributed inductance can be reduced. The loss of the distributed inductance of the transmitting module will be much smaller by using this setting, and it is easier to achieve high-power laser emission. The reduction of the distributed inductance also makes narrow pulse laser driving possible. In a specific embodiment of the present disclosure, the package module may further include a switching chip. The switching chip may also be disposed in the accommodation space. The switching chip may include a switching circuit, and the switching circuit may be used for controlling the laser diode die to emit laser light under the driving of the driving circuit. In addition, as shown inFIGS.4H and4I, other devices may also be disposed on the substrate, for example, FET devices or other types of switching devices, or the driving chip of the switching device, needed resistors and capacitors311, and surface mount circuit (SMT IC) and other devices. These devices may be mounted on the substrate through a conductive material, such as a conductive adhesive (including but not limited to solder paste) through SMT. In the package module structure shown inFIG.4H, the laser diode die303, the driving chip310, the reflective surface, and other devices are all mounted on the first surface of the substrate300, and are all disposed in the accommodation space between the cover and the substrate. In some embodiments, in the package module structure, a non-volatile or low-volatile conductive adhesive layer may be used to mount on the first surface of the substrate. Such arrangement can prevent the volatilization of volatile substances in the volatile conductive adhesive layer from polluting the laser diode die, the reflective surface, and the light-transmitting area, such that the light-emitting efficiency of the laser diode die will not be affected. In another example, in the package module structure shown inFIG.4I, the driving chip310, the reflective surface, and the laser diode die303are packaged in the accommodation space, and the package module further includes solder paste mounted devices. The solder paste mounted devices are disposed outside the accommodation space, that is, on the substrate outside the cover. The solder paste mounted devices may include, but is not limited to, FET devices or other types of switching devices, or the driving chip for the switching device, needed resistors and capacitors311, etc. In this embodiment, taking the resistors and capacitors311as an example, the resistors and capacitors311may be mounted by solder paste on the first surface of the substrate outside the accommodation space, that is, on the first surface of the substrate outside the cover. The advantage of this arrangement is that the integrated driving chip310and the laser diode die303are integrated in the accommodation space, such that there is a shorter distance between the two, and the purpose of reducing parasitic inductance can be achieved. At the same time, the solder paste mounted devices are isolated from the laser diode die303to prevent the flux in the solder paste from volatilizing, contaminating the laser diode die and the reflector, and then affecting the light output efficiency of the laser diode die. In summary, in the package module structure of the above embodiment, a reflective surface may be disposed on the propagation path of the emitted light of the laser diode die to reflect the emitted light originally parallel to the first surface of the substrate. The reflected light may be emitted from a light-transmitting area on the cover. The laser diode die may emit light from the side, and the direction of the emitted light may be substantially parallel to the first surface of the substrate. By placing the reflective surface on the propagation path of the emitted light of the laser diode die, the emitted light may be reflected and emitted from the light-transmitting area on the cover, thereby changing the propagation direction of the light. Since a reflective surface is added to the propagation path of the emitted light, the bottom surface of the laser diode die may be mounted in the accommodation space, and the emitted light may be emitted in a direction substantially perpendicular to the first surface. In addition, the area of the bottom surface of the laser diode die is relatively large, which can facilitate the placement of the die and the positioning of the package module in the whole device. Further, the reflective surface of the present disclosure is specifically an inclined surface prepared by etching the semiconductor using anisotropy. Since each semiconductor has a specific crystal orientation, the angle of the inclined surface formed by it is also specific, such that the light reflected by the reflective surface may be emitted in a specific direction. In addition, the pin path in the package module of the present disclosure is short, and the parasitic inductance can be greatly reduced compared with the TO package. As such, the package module can be packaged by substrate packaging with high packaging efficiency, and the packaged die is suitable for SMT. Second Embodiment Another embodiment of the package module structure of the present disclosure will be described below with reference toFIGS.5A to5BandFIGS.6A to6C. In order to avoid repetition, in this embodiment, for the structure and material of the substrate400, the laser diode die403, the cover407, the light-transmitting plate408, etc., the description of some features that are the same as those in the foregoing first embodiment, reference may be made to the foregoing first embodiment, which will not be repeated here. The difference between this embodiment and the foregoing first embodiment lies in the structure of the anisotropic semiconductor included in the package module. More specifically, as an example, as shown inFIGS.6A and6B, the package module includes an anisotropic semiconductor. The semiconductor is disposed in the accommodation space formed by the cover and the substrate. The semiconductor includes a first part4011positioned at the bottom and a second part positioned on a partial surface of the first part4011, where the reflective surface is disposed on at least one inclined surface of the second part4012. As an example, the reflective surface may specifically be an inclined surface prepared by etching the semiconductor using anisotropy, such as etching the semiconductor using wet etching. As such, the etching may be stopped in the semiconductor without etching through the upper and lower surfaces of the semiconductor substrate, thereby forming a semiconductor including the first part4011and the second part4012. Due to the anisotropy of the semiconductor, the second part4012may have at least one inclined surface. For example, when the semiconductor is silicon, the acute angle between the inclined surface and the second part below may be generally 54.74°. In one example, as shown inFIGS.5A and5B, taking semiconductor as a SOI wafer401as an example, the SOI wafer401includes a buried oxide and tow upper and lower silicon layers separated by the buried oxide. The second part4012may be formed by etching one of the two silicon layers. The etching may be a wet etching, for example, wet etching may be used. The wet etching may use an etchant with high selectivity to silicon relative to the buried oxide, such as KOH solution. For example, before etching, it is also possible to form a mask layer, such as a photoresist, on a partial area of the surface of the SOI wafer401to be etched, and define a pattern of the surface of the second part4012to be formed in the mask layer through a photolithography process, that is, the surface of the second part4012to be formed may be covered with a patterned mask layer, and other areas other than the surface of the second part4012may be exposed. Subsequently, the SOI wafer401with the mask layer formed on the part of the surface area may be etched and stopped in the buried oxide401b. Due to the anisotropy of the semiconductor, the formed second part4012has at least one inclined surface, and the reflective surface may be at least one inclined surface of the second part4012. The buried oxide401band the silicon layer410aunder the buried oxide401bmay serve as the first part4011, and the anisotropically etched silicon layer on the buried oxide401bmay serve as the second part4012. In another example, as shown inFIG.5B, the reflective surface includes a reflective film402coated on an inclined surface prepared by etching the semiconductor using anisotropy to increase the reflectivity of the reflective surface, thereby increasing the output power of the laser. In some embodiments, at least a part of the exposed surface of the first part4011may also be covered with a conductive layer. For example, the reflective film402may be a conductive film. The reflective film402on the reflective surface may further extend to cover at least a part of the exposed surface of the first part4011outside the reflective surface. When the semiconductor is an SOI wafer, the reflective film402may extend to the surface of the buried oxide401boutside the second part4012. For example, the conductive reflective film402may be a metal layer. The material of the reflective film402may include any suitable material that reflects light. For example, the reflective film402may include at least one of gold, silver, and aluminum. The reflective film402may be formed on the inclined surface of the semiconductor using a deposition method, such as vacuum evaporation. In one example, the laser diode die403may be mounted on the surface of the first part4011outside the reflective surface, and the exit surface of the laser diode die403may be disposed opposite to the reflective surface, such that the exit light of the laser diode die may be reflected by the reflective surface and emitted through the light-transmitting area. In this embodiment, the characteristics of the positional relationship between the laser diode die and the reflective surface in the first embodiment are also applicable. For example, as shown inFIGS.6A to6C, a laser diode die is disposed on the surface of the first part4011outside each reflective surface, and the exit surface of the laser diode die is opposite to the reflective surface. Alternatively, at least two laser diode dies are disposed on the surface of the first part outside each reflective surface, and the exit surface of each laser diode die is opposite to the reflective surface. In one example, as shown inFIG.6B, the laser diode die403is disposed on a conductive reflective film402positioned on the surface of the first part. The pattern of the conductive reflective film402on the surface of the first part may match and may be electrically connected to the bottom surface of the laser diode die, and the area of the reflective film402positioned on the surface of the first part may be larger than the area of the bottom surface of the laser diode die. As such, the conductive reflective film402partially positioned on the surface of the first part may be exposed from the outside of the laser diode die, such that it is convenient to lead out the electrodes on the bottom surface of the laser diode die. For example, the shape of the reflective film402on the surface of the first part4011inFIG.6Bis T-shaped, or it can be other suitable shapes, such as a strip, a cross, etc. It should be noted that althoughFIG.6Bshows the case where the laser diode die is disposed on the surface of the first part4011, for at least two laser diode dies disposed side by side on the surface of the first part4011, a plurality of reflective films space apart from each other may be correspondingly disposed on the surface of the first part, and each reflective film may correspond to a laser diode die. Any suitable method may be used to form the reflective film402on the surface of the first part4011. In one example, the method of forming the reflective film402may include the following steps. Step A1, providing a semiconductor, the semiconductor (e.g., a silicon wafer or an SOI wafer) may include a first part4011positioned at the bottom and a second part4012positioned on a partial surface of the first part4011, where the reflective surface may be disposed on at least one inclined surface of the second part4012. Next, perform step A2, which includes forming the reflective film402that can completely cover the exposed surfaces of the first part4011and the second part4012, where the reflective film402may be formed by a method such as vacuum evaporation. Subsequently, perform step A3, which includes patterning the reflective film402using photolithography and etching processes. For example, a photoresist layer may be coated on the reflective film, and the photoresist layer may be patterned by the processes of exposure and development of the photolithography process to form a patterned photoresist layer. The patterned photoresist layer may define parameters such as the pattern shape and position of the reflective film that is scheduled to be formed on the first part4011, and the patterned photoresist layer may be cover the inclined surface of the second part intended to be used as a reflective surface. Then the patterned photoresist layer may be used as a mask to etch the reflective film on the first part4011and stop in the first part4011to form a patterned reflective film402on the surface of the first part4011, and finally remove the photoresist layer. Further, in the technical solution of the packaging structure of this embodiment, when the laser diode die is mounted on the surface of the first part4011, the pattern of the reflective film402on the first part4011may also be used as an alignment mark. Since the pattern of the alignment mark is formed by photolithography and etching, its accuracy can be within 2 μm. An alignment mark with high accuracy can improve the position accuracy of the laser diode die during the mounting, and the relative position accuracy between the laser diode die and the reflective surface. In this embodiment, the laser diode die403may be mounted on the surface of the first part by, for example, the method provided in the aforementioned first embodiment. For example, the laser diode die403may be mounted on the reflective film402on the first part through a conductive adhesive layer to realize the electrical connection between the laser diode die403and the reflective film402. In one example, as shown inFIGS.6A and6B, an anisotropic semiconductor (such as a silicon wafer or an SOI wafer) is mounted on the first surface40of the substrate400through a conductive adhesive layer, that is, the bottom surface of the first part4011is attached to the substrate400and disposed in the accommodation space. In one example, as shown inFIGS.6A and6B, the laser diode die403includes a first electrode and a second electrode disposed oppositely. For example, the first electrode may be disposed on the bottom surface of the laser diode die403, and the second electrode may be disposed on the top surface of the laser diode die403. The first electrode may be a p-electrode, and the second electrode may be an n-electrode. Alternatively, the first electrode may be an n-electrode, and the second electrode may be a p-electrode. The first electrode and the second electrode may be respectively electrically connected to the substrate400through wires, in particular to different pads on the first surface of the substrate. For example, the electrode on the top surface of the laser diode die403may be electrically connected to a pad4062through a wire4052, and the electrode on the bottom surface of the laser diode die403may be electrically connected to a pad4061through a wire4051. Since the electrode on the bottoms surface is electrically connected to the reflective film402positioned on the first part4011, the reflective film402may be electrically connected to the pad4062through a wire, thereby achieving electrical connection between the bottom surface of the laser diode die403and the pad4062. The pad4062and the pad4061may be spaced apart from each other. In order to ensure that the reflective film can lead out the electrodes on the bottom surface of the laser diode die403, the area of the reflective film402on the first part4011may be larger than that of the bottom surface of the laser diode die403. That is, the laser diode die403can cover a part of the reflective film402on the surface of the first part4011. It should be noted that the above method of leading out the first electrode and the second electrode is merely an example, and other suitable methods can also be applied to the present disclosure. For example, it can also be achieved by providing a contact hole under each laser diode die that penetrates the first part and is electrically connected to the bottom electrode of the laser diode die. The bottom electrode (e.g., the first electrode) of the laser diode die may be electrically connected through the contact hole. A substrate metal layer may be disposed under the bottom surface of the first part of the semiconductor on the substrate. The metal layer of the substrate can be electrically connected to the bottom electrode (e.g., the first electrode) of the laser diode die through the contact hole, thereby realizing the lead out of the bottom electrode of the laser diode die. In one example, FIC.6C shows the structure of a package module. The structure of the package module is difference from the structure shown inFIG.6A. InFIG.6C, the second part4012has two symmetrically inclined surfaces disposed opposite to each other. The inclined surfaces may be reflective surfaces, and each of the reflective surfaces may be disposed opposite to the exit surface of at least one laser diode die403. Each laser diode die403may be mounted on the reflective film402positioned on the first part through the conductive adhesive layer, thereby realizing the electrical connection between the laser diode die403and the reflective film402. As such,FIG.6Cshows a 2×N type package structure. It should be noted that in this embodiment, the anisotropic semiconductor can also be replaced with other suitable materials, such as glass, ceramic, or resin. In summary, the package structure in this embodiment also has the advantage of the package structure in the first embodiment. The reflective film on the reflective surface may be used to reflect the emitted light of the laser diode die, and the part of the reflective film positioned on the first part outside the reflective surface may also be used to electrically connect the bottom surface of the laser diode die, and may be used as an external mark when the laser diode die is being mounted. The reflective film on the first part formed by photolithography and etching has high accuracy, such that the position accuracy of the laser diode die mounting and the relative position accuracy between the laser diode die and the reflective film can be improved. Third Embodiment Another embodiment of the package module structure of the present disclosure will be described below with reference toFIGS.7A to7C,FIGS.8A to8C, andFIGS.9A to9D. In order to avoid repetition, in this embodiment, for the structure and material of the substrate400, the reflective film502, the laser diode die503, the cover507, the light-transmitting plate508, the substrate metal layer5041,5042, etc., the description of some features that are the same as those in the foregoing first and second embodiments, reference may be made to the foregoing first and second embodiments, which will not be repeated here. The difference between this embodiment and the foregoing first embodiment is that the anisotropic semiconductor in the first embodiment is replaced with a glass in this embodiment. More specifically, in an example, as shown inFIGS.7A to7C, the package module includes a glass501. The glass501may include at least one inclined surface, and the reflective surface may include a reflective film502coated on the inclined surface of the glass501. The angle between the reflective surface and the bottom surface of the glass can be any suitable angle less than 90°. In some embodiments, the angle between the reflective surface and the bottom surface of the glass may be substantially 45°. With this arrangement, the emitted light emitted from the emitting surface of the laser diode die503can be emitted from the light-transmitting area on the cover in a direction perpendicular to the first surface of the substrate after being reflected by the reflective surface. The glass501with at least inclined surface may be formed by any suitable method. For example, the conventional optical element manufacturing method can be used to process the optical glass into a glass prism of a predetermined size by grinding, polishing, and coating the optical glass, such that the angle between the reflective surface and the bottom surface of the glass may be 45° or any other angle. Alternatively, the glass501of a predetermined size can also be formed by molding. The molding method includes pouring the molten optical glass blank into a low-temperature mold that is 50° C. higher than the glass transition point and pressing it. In one example,FIG.7Bshows a glass501with only one inclined surface. A reflective film502is disposed on the inclined surface as a reflective surface. At least one laser diode die503is disposed on the first surface of the substrate outside the reflective surface, and the exit surface of each laser diode die is disposed opposite to the reflective surface. Further, the light emitted from the exit surface of the laser diode die is perpendicular to the bottom side of the reflective surface, and the angle between the reflective surface and the bottom surface of the glass is substantially 45°. As such, the emitted light emitted from the emitting surface of the laser diode die503may be reflected by the reflective surface and then emitted from the light-transmitting area on the cover in a direction perpendicular to the first surface of the substrate. In another example,FIG.7Cshows a glass501with two inclined surfaces disposed opposite to each other. A reflective film502is disposed on the tow inclined surfaces as the reflective surface, where at least one laser diode die503is disposed on the first surface of the substrate500outside each reflective surface. The inclined surfaces of the glass opposite to each other can be symmetrical or asymmetrical, that is the angle between one of the inclined surfaces and the bottom surface of the glass may be different from the angle between the other inclined surface and the bottom surface of the glass. Further, the reflective surface may also be a concave surface. The concave surface may specifically be a concave surface of an anisotropic semiconductor, or a concave surface of glass or other suitable concave surface that can be used as a mirror material. The concave reflective surface can not only reflect the light emitted by the laser diode die, but also can play a similar role to the aforementioned collimating element, which can reduce the astigmatism between the fast and slow axes, improve the light beam quality, reduce the divergence angle in the fast axis direction, and improve the radiation utilization rate under the condition of limited light exit aperture. In one example, as shown inFIGS.8A to8C, taking the reflective surface as a concave surface of glass5011as an example, the reflective surface further includes a reflective film502coated on at least one concave surface of the glass5011.FIG.8Bshows that the reflective surface being specifically a concave surface of the glass.FIG.8Cshows that the reflective surface including specifically two opposite concave surfaces of the glass, and the two opposite concave surfaces can also be disposed symmetrically. The concave glass5011may be formed by any suitable method, for example, the reflective surface of the glass may be made into a concave shape by a molding method, and a reflective film502may be coated on the concave surface. In some embodiments, when the reflective surface is a concave surface of an anisotropic semiconductor, the concave surface may be formed by any suitable method known to those skilled in the art. For example, the concave surface described above may be obtained by isotropic wet etching of the semiconductor. It should be noted that the glass described above may be mounted on the first surface of the substrate through a conductive adhesive layer. For detailed description, reference may be made to the first embodiment described above, which will not be repeated here. For example, as shown inFIGS.7B to7CandFIGS.8C to8C, the laser diode die503can be mounted on the first surface50of the substrate500through a conductive adhesive layer. The second electrode (that is, the electrode on the top surface) of the laser diode die503is electrically connected to a pad506on the first surface50of the substrate500through a wire505. It should be noted that for the arrangement of the laser diode die503on the outside of the concave reflective surface, reference may be made to the first and second embodiments described above, which will not be repeated here. In one example, as shown inFIG.9A, tow obliquely disposed reflective surfaces are respectively disposed on two inclined surfaces opposite to each other on a glass5012, where each reflective surface is disposed opposite to the exit surface of at least one laser diode die503. As such, the exit light of each laser diode die503may be reflected by the reflective surface and then emitted through the light-transmitting area. The glass5012is in the shape of a triangular prism, one side surface of the triangular prism-shaped glass is mounted on the first surface of the substrate, the other two sides surfaces are inclined surfaces as the reflective surfaces, and the reflective surfaces include reflective films coated on the inclined surfaces (not shown inFIG.9A). Further, the angle between the two inclined surface as the reflective surfaces and the bottom surface of the triangular prism mounted on the substrate can be 45° or other suitable angles.FIG.9Ashow four laser diode dies503disposed side by side on the outside of each reflective surface, and different numbers of laser diode dies503can also be disposed outside of different reflective surfaces. The number can be reasonably selected based on the needs of the device structure. For example, three laser diode dies may be disposed on the outside of on reflective surface, and four laser diode dies may be disposed on the outside of the other side. When four laser diode dies are mounted on the outside of each reflective surface,FIG.9Bshows the equivalent position of the laser diode die503inFIG.9A, in which the block dots shown in theFIG.9Bonly represent the positional relationship and are not related to the shape of the light source. The two row of laser diode dies503shown inFIG.9Bare disposed opposite to each other, and the laser diode dies503in each row are arranged at equal intervals. In one example, the glass may also be in the shape of a triangular pyramid or a triangular prism. For example, the glass5013shown inFIG.9Cis in the shape of a triangular pyramid, and three obliquely disposed reflective surfaces are respectively disposed on the three inclined surfaces of the glass. Each of the reflective surfaces is disposed opposite to the exit surface of at least one of the laser diode dies503, such that the exit light of each laser diode die503may be reflected by the reflective surface and then emitted through the light-transmitting area. For example, as shown inFIGS.9C and9D, three laser diode dies503are disposed on the outside of each reflective surface, and the three laser diode dies503on each side are disposed at equal intervals.FIG.9Dshows the equivalent position of the laser diode die503inFIG.9C, in which the block dots shown in theFIG.9Donly represent the positional relationship and are not related to the shape of the light source. It should be noted that the glass described above is not limited double-sided reflection, but also multi-sided reflection, and its shape can be N prism or N pyramid, where N is greater than or equal to three. In addition, not only the glass has a plurality of obliquely disposed reflective surfaces, but also the anisotropic semiconductor or other materials in the foregoing first and second embodiments may also have a plurality of obliquely disposed reflective surfaces to form, for example, a structure such as a triangular prism, an N prism, or an N pyramid. The package module in this embodiment also has the advantages of the package module in the first embodiment. In addition, for the example where the reflective surface is a concave surface, in addition to reflecting the light emitted by the laser diode die, it can also reduce the astigmatism between the fast and slow axes and improve the light beam quality. At the same, it is possible to avoid the additional optical collimating elements such as cylindrical lenses on the substrate, which can reduce the size of the package module structure. It should be noted that the package structures in the first, second, and third embodiments described above are only examples, and the package structure of the present disclosure is not limited to the above examples. Various modifications of the above examples can also be applied to the present disclosure, for example, the semiconductor and glass with inclined surfaces may be mounted in a package module; the number of laser diode dies opposite toe each reflective surface, the number and size of the semiconductors or glasses included in the package module, etc. can be selected reasonably based on actual needs, which will not be listed here. Fourth Embodiment As shown inFIG.10, an embodiment of the present disclosure provides a distance detection device800including a light emitting module810and a reflected light receiving module820. The light emitting module810may include at least one laser diode package module described in the first, second, or third embodiment for emitting optical signals, and the optical signals emitted by the optical emitting module801may cover the field of view (FOV) of the distance detection device800. The reflected light receiving module820can be used for receiving the reflected light after the light emitted by the light emitting module810encounters an object to be measured, and calculating the distance between the distance detection device800and the object to be measured. The light emitting module810and its working principle will be described below with reference toFIG.10. As shown inFIG.10, the light emitting module810includes a light emitter811and a light beam expanding unit812. The light emitter811can be used to emit light, and the light beam expanding unit812can be used to perform at least one of the processes of collimation, beam expansion, homogenization, and FOV expansion on the light emitted by the light emitter811. The light emitted by the light emitter811may pass through at least one of the processes of collimation, beam expansion, homogenization, and FOV expansion of the light beam expanding unit812, such that the emitted light becomes divergent and evenly distributed, which can cover a certain two-dimensional angle in the scene. As shown inFIG.8, the emitted light can cover at least a part of the surface of the object to be measure. In one example, the light emitter811may be a laser diode. For the wavelength of the light emitted by the light emitter811, in one example, light with a wavelength between 895 nanometers and 915 nanometers may be selected, for example, light with a wavelength of 905 nanometers may be selected. In another example, light with a wavelength between 1540 nanometers and 1560 nanometers may be selected. In other examples, other suitable wavelengths of light may also be selected based on the application scenarios and various needs. In one example, the light beam expanding unit812may be realized by a single-stage or multi-stage beam expansion system. The light beam expansion process can be reflective or transmission, or a combination of the two. In one example, a holographic filter may be used to obtain a large-angle beam composed of multiple sub-beams. In another example, a laser diode array may also be used to form multiple beams of light with laser diodes to obtain lasers similar to the beam expansion (such as VESEL array lasers). In another example, a two-dimensional angle adjustable micro-electromechanical system (MEMS) lens may also be used to reflect the emitted light. By driving the MEMS micro-mirrors to constantly change the angle between the mirror surface and the light beam, the angle of the reflected light may be constantly changing, thereby diverging into a two-dimensional angle to cover the entire surface of the object to be measured. The distance detection device may be used to sense external environmental information, such as distance information, angle information, reflection intensity information, speed information, etc. of a target in the environment. More specifically, the distance detection device in the embodiment of the present disclosure can be applied to a mobile platform, and the distance detection device can be mounted on the platform body of the mobile platform. A mobile platform with a distance detection device can measure the external environment, such as measuring the distance between the mobile platform and an obstacle for obstacle avoidance and other purposes, and for two-dimensional or three-dimensional mapping of the external environment. In some embodiments, the mobile platform may include at least one of an unmanned aerial vehicle (UAV), a car, and a remote control car. When the distance detection device is applied to a UAV, the platform body may be the body of the UAV. When the distance detection device is applied to a car, the platform body may be the body of the car. When the distance detection device is applied to a remote control car, the platform body may be the body of the remote control car. Since the light emitted by the light emitting module810can cover at least a part of the surface or even the entire surface of the object to be measure, correspondingly, the light is reflected after reaching the surface of the object, and the light reaching the reflected light receiving module820may not be a single point, but distributed in an array. The reflected light receiving module820may include a photoelectric sensing cell array821and a lens822. After the light reflected from the surface of the object to be measured reaches the lens822, based on the principle of lens imaging, it can reach the corresponding photoelectric sensing unit in the photoelectric sensing cell array821, and then be received by the photoelectric sensing unit, causing the photoelectric response of the photoelectric sensing process. Since in the process of the light being emitted until the photoelectric sensing unit receiving the reflected light, the light emitter811and the photoelectric sensing cell array821may be controlled by a clock control module to synchronize them (for example, a clock control module830shown inFIG.10is included in the distance detection device800, or the clock control module may be outside the distance detection device800). Therefore, based on the time of flight (TOF) principle, the distance between the point reached by the reflected light and the distance detection device800can be determined. In addition, since the photoelectric sensing unit is not a single point, but a photoelectric sensing cell array821, therefore, after data process by a data processing module (such as the data processing module840shown inFIG.8included in the distance detection device800, or the data processing module may be outside the distance detection device800), the distance information of all points in the field of view of the entire distance detection device can be obtained. That is, the point cloud data of the distance from the external environment that the detection device faces. Based on the foregoing structure and working principle of the laser diode package module based on the embodiments of the present disclosure and the structure and working principle of the distance detection device based on the embodiment of the present disclosure, those skilled in the art can understand the structure and working principle of the electronic device based on the embodiments of the present disclosure. For brevity, detailed will not be repeated here. Fifth Embodiment With the development of science and technology, detection and measurement technologies are being applied in various fields. Lidar is a perception system of the outside world, which can learn the three-dimensional information of the outside world, and is no longer limited to the plane perception of the outside world, such as a camera. The principle is to actively emit laser pulse signals out, detect the reflected pulse signals, determined the distance of the measured object based on the time different between the emission and the reception, and combine the emission angle information of the light pulse to reconstruct the three-dimensional depth information. An embodiment of the present disclosure provides a distance detection device, which can be used to measure the distance of an object to be detected to the detection device, and the orientation of the object to be detected relative to the detection device. In one embodiment, the detection device may include a radar, such as a lidar. The detection device can detect the distance between the detection device and the object to be detected by measuring the time of light propagation between the detection device and the object to be detected, that is, the time-of-flight (TGF). A coaxial optical path may be used in the distance detection device, that is, the light emitted by the detection device and the reflected light share at least a part of the optical path in the detection device. Alternatively, the detection may also use an off-axis optical path, that is, the light emitted by the detection device and the reflected light are transmitted along different optical paths in the detection device.FIG.11is a schematic diagram of the distance detection device of the present disclosure. The distance detection device100includes an optical transceiver110, and the optical transceiver110includes a light source103, a collimating element104, a detector105, and an optical path changing element106. The optical transceiver110may be configured to emit a light beam, receive the returned light, and convert the returned light into an electrical signal. The light source103may be used to emit a light beam. In one embodiment, the light source103may emit a laser beam. The light source may include the laser diode package module described in the first, second, and third embodiments, and may be configured to emit laser pulse in a direction at a certain angle with the first surface of the substrate of the laser diode package module, and the angle may be less than 90°. In some embodiments, the laser beam emitted by the light source103may be a narrow-bandwidth beam with a wavelength outside the visible light range. The collimating element104may be disposed outside the light-transmitting area of the laser package module, and may be configured to collimate the light emitted from the light-transmitting area (that is, to collimate the light beam emitted from the light source103), and collimate the light beam emitted from the light source103into parallel light. The collimating element may also be used to condense at least a part of the returned light reflected by the objected to be detected. The collimating element104may be a collimating lens or other elements capable of collimating light beams. The distance detection device100may further include a scanning module102. The scanning module102may be placed on the exit light path of the optical transceiver110. The scanning module102may be configured to change the transmission direction of a collimated light beam119emitted by the collimating element104and projecting it to the external environment, and projecting the returned light to the collimating element104. The returned light may be collected by the detector105via the collimating element104. In one embodiment, the scanning module102may include one or more optical elements, such as a lens, a mirror, a prism, a grating, an optical phased array, or any combination of the foregoing optical elements. In some embodiments, the plurality of optical elements of the scanning module102may rotate around a common axis109, and each rotating optical element may be used to continuously change the propagation direction of the incident light beam. In one embodiment, the plurality of optical elements of the scanning module102may rotate at different rotation speeds. In another embodiment, the plurality of optical elements of the scanning module102may rotate at substantially the same rotation speed. In some embodiments, the plurality of optical elements of the scanning module may also rotate around different axes, or vibrate in the same direction, or vibrate in different directions, which is not limited here. In one embodiment, the scanning module102may include a first optical element114and a driver116connected to the first optical element114. The driver116may be configured to drive the first optical element114to rotate around the rotation axis109, such that the first optical element114may change the direction of the collimated light beam119. The first optical element114may project the collimated light beam119to different directions. In one embodiment, the angle between the direction of the collimated light beam119changed by the first optical element and the rotation axis109may change with the rotation of the first optical element114. In one embodiment, the first optical element114may include a pair of opposite non-parallel surfaces through which the collimated light beam119may pass. In one embodiment, the first optical element114may include a wedge-angle prism to collimate the collimated light beam119for refracting. In one embodiment, the first optical element114may be coated with an anti-reflection coating, and the thickness of the anti-reflection coating may be equal to the wavelength of the light beam emitted by the light source103, which can increase the intensity of the transmitted light beam. In the embodiment shown inFIG.11, the scanning module102includes a second optical element115. The second optical element115may rotate around the rotation axis109, and the rotation speed of the second optical element115may be different from the rotation speed of the first optical element114. The second optical element115may be configured to change the direction of the light beam projected by the first optical element114. In one embodiment, the second optical element115may be connected to another driver117, and the driver117may be configured to drive the second optical element115to rotate. The first optical element114and the second optical element115may be driven by different drivers, such that the rotation speed of the first optical element114and the second optical element115may be different. As such, the collimated light beam119can be projected to different directions in the external space, and a larger spatial range can be scanned. In one embodiment, a controller118may control the driver116and the driver117to drive the first optical element114and the second optical element115, respectively. The rotation speeds of the first optical element114and the second optical element115may be determined based on the area and pattern expected to be scanned in actual applications. The drivers116and117may include motors or other driving devices. In one embodiment, the second optical element115may include a pair of opposite non-parallel surfaces through which the light beam may pass. The second optical element115may include a wedge-angle prism. In one embodiment, the second optical element115may be coated with an anti-reflection coating to increase the intensity of the transmitted light beam. The rotation of the scanning module102may project light to different directions, such as a direction111and a direction113, thereby scanning the space around the detection device100. When the light in the direction111projected by the scanning module102hits an object to be detected101, a part of the light may be reflected by the object to be detected101to the detection device100in a direction opposite to the direction111of the projected light. The scanning module102may receive a returned light112reflected by the object to be detected101and project the returned light112to the collimating element104. The collimating element104may be configured to converge at least a part of the returned light112reflected by the object to be detected101. In one embodiment, an anti-reflection coating may be coated on the collimating element104to increase the intensity of the transmitted light beam. The detector105and the light source103may be disposed on the same side of the collimating element104, and the detector105may be configured to convert at least a part of the returned light passing through the collimating element104into an electrical signal. In some embodiments, the detector105may include an avalanche photodiode. The avalanche photodiode is a highly sensitive semiconductor device that can convert an optical signal into an electrical signal using the photocurrent effect. In some embodiments, the distance detection device100may include a measuring circuit, such as a TOF unit107, which can be used to measure TOF to measure the distance of the object to be detected101. For example, the TOF unit107can calculate the distance by the formula of t=2D/c, where D is the distance between the detection device and the object to be detected, c is the speed of light, and t is the total time it takes for the light to project from the detection device to the object to be detected and returned from the object to be detected to the detection device. The distance detection device100can determine the time t based on the time difference between the light emitted by the light source103and the returned light received by the detector105, and then the distance D may be determined. The distance detection device100can also detect the position of the object to be detected101relative to the distance detection device100. The distance and orientation detected by the distance detection device100can be used for remote sensing, obstacle avoidance, surveying and mapping, modeling, navigation, and the like. In some embodiments, the light source103may include a laser diode, through which nanosecond laser light can be emitted. For example, the laser pulse emitted by the light source103may last for 10 ns, and the pulse duration of the returned light detected by the detector105may be substantially the same as the emitted laser pulse duration. Further, the laser pulse receiving time may be determined. For example, by detecting the rising edge time and/or falling edge time of the electrical signal pulse to determine the laser pulse receiving time. In some embodiments, multi-stage amplification may be performed on the electrical signal. As such, the distance detection device100can calculate the TOF by using the pulse receiving time information and the pulse sending time information, thereby determining the distance between the object to be detected101and the distance detection device100. FIG.12is a schematic diagram of a distance detection device600according to another embodiment. The distance detection device600is similar to the distance detection device100shown inFIG.11. Compared with the embodiment shown inFIG.11, an optical transceiver610of the distance detection device600of the embodiment shown inFIG.12includes a plurality of optical path changing elements6061-6063, which can change the optical path of the outgoing light beam and the optical path of the returned light emitted by a light source603. In this way, a collimating lens604with a longer focal length may be used, and the light source603and a detector605may be equivalent to the focal position of the collimating lens604through the plurality of optical path changing elements6061-6063. As such, the optical path can be folded by the optical path changing elements6061-6063, such that the structure of the distance detection device600is compact, which is beneficial for the miniaturization. The light source603may include the laser package module structure of the first, second, or third embodiment, and may be used to emit laser pulses at a certain angle with the first surface of the substrate of the laser diode package module, and the angle may be less than 90°. For example, the package module in the aforementioned first embodiment may further include a semiconductor with an anisotropic structure, and the reflective surface may specifically be an inclined surface prepared by etching the semiconductor using anisotropy. Alternatively, the reflective surface may include a reflective film coated on the inclined surface prepared by etching the semiconductor using anisotropy. The inclined surface prepared after etching may be used as the reflective surface, and the angle between the inclined surface and the bottom surface of the semiconductor may be substantially 54.74°. The emitted light of the laser diode die may be reflected by the reflective surface and then emitted through the light-transmitting area at an angle of substantially 19.48° to the normal of the substrate. That is, the laser pulse is emitted in a direction at a certain angle with the first surface of the substrate of the laser diode package module, and the angle is less than 90°. The collimating lens604may be disposed on the outside of the light-transmitting area of the laser diode package module, and may be configured to collimate the exit light emitted from the light-transmitting area. The collimating lens may also be configured to condense at least a part of the returned light reflected by the object to be detected. The laser diode package module may be positioned on one side of the center axis of the collimating lens604, and the first surface of the substrate in the laser diode package module may be substantially parallel to the center axis of the collimating lens604. The plurality of optical path changing elements6061-6063may include mirrors, prisms, or other optical elements that can change the optical path. In the illustrated embodiment, the plurality of optical path changing elements6061-6063includes a first light path changing element6061, a second light path changing element6062, and a second light path changing element6063. The first light path changing element6061is disposed on the outside of the light-transmitting area, facing the light source603and the collimating lens604, and may be configured to change the light path of the outgoing light emitted from the light-transmitting area of the laser diode package module. As such, the laser pulse form the laser diode package module may incident on the collimating lens604in a direction substantially along the center axis of the collimating lens. For example, the first light path changing element6061may be a mirror. The first light path changing element6061is may be disposed on the center axis of the collimating lens, and may be configured to reflect the laser pulse emitted by the laser diode package module to a direction generally along the center axis of the collimating lens. Taking the case where the reflective surface is specifically an inclined surface prepared by etching the semiconductor using anisotropy as an example, the angle between the inclined surface prepared after etching and the bottom surface of the semiconductor may be substantially 54.74°, and the emitted light of the laser diode die may be reflected by the reflective surface and then emitted through the light-transmitting area at an angle of substantially 19.48° to the normal of the substrate. Subsequently, the light may be irradiated on the first light path changing element6061, and reflected by the first light path changing element6061to a direction generally along the center axis of the collimating lens. The light source603may emit a light beam diagonally downward and the light beam may reach the first light path changing element6061, and the first light path changing element6061may reflect the light beam toward the collimating lens604. For example, the mirror of the first light path changing element6061may be placed obliquely with respect to the optical axis of the collimating lens604, that is, deviating from the optical axis of the collimating lens604, facing the light source603and the collimating lens604, and may be configured to reflect the exit light emitted from the light-transmitting area to the collimating lens604. That is, the light source603may emit a light beam diagonally downward and the light beam may reach the first light path changing element6061, and the first light path changing element6061may reflect the light beam toward the collimating lens604. A light-transmitting area, such as a through hole6064may be disposed at the center of the second light path changing element6062. The through hole6064may be substantially posited in the middle of the second light path changing element6062. The through hole6064may have a trapezoidal shape. In some embodiments, the through hole6064may be rectangular, circular, or other shapes. Continue to refer toFIG.12, the second light path changing element6062is disposed between the first light path changing element6061and the collimating lens604, and faces the collimating lens604. The optical axis of the collimating lens604may pass through the through hole6064. The light beam reflected by the first light path changing element6061may pass through the through hole6064of the second light path changing element6062, project to the collimating lens604, and be collimated by the collimating lens604. In the illustrated embodiment, the detector605is positioned on the other side of the distance detection device600relative to the light source603, and may be configured to convert the received optical signal into an electrical signal. The electrical signal may be used to measure the distance between the object to be detected and the distance detection device. The returned light converged by the collimating lens604may pass through the second light path changing element6062and the third light path changing element6063, and converge to the detector605. The third light path changing element6063may be positioned outside the collimating lens604, above the detector605close to the collimating lens604, facing the second light path changing element6062and the detector605, and may be respectively disposed opposite to the second light path changing element6062and the detector605. The returned light combined by the collimating lens604may be reflected to the third light path changing element6063through the second light path changing element6062, and then the third light path changing element6063may reflect the returned light to the detector605. A person having ordinary skill in the art can appreciate that units and algorithms of the disclosed methods and processes may be implemented using electrical hardware, or a combination of electrical hardware and computer software. Whether the implementation is through hardware or software is to be determined based on specific application and design constraints. A person of ordinary skill in the art may use different methods to realize different functions for each specific application. Such implementations fall within the scope of the present disclosure Those skilled in the art should realize that the present disclosure can be implemented electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software may depend on the specific applications and design constraints. Those skilled in the art can use different methods to achieve the described functions for each of the specific applications, but such achievement should not be considered to exceed the scope of the present disclosure. In the several embodiments provided by the present disclosure, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative. For example, the unit division is merely logical function division and there may be other division in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features can be omitted or not be executed. In the specification provided herein, a plenty of particular details are described. However, it can be appreciated that embodiments of the present disclosure may be practiced without these particular details. In some embodiments, well known methods, structures and technologies are not illustrated in detail so as not to obscure the understanding of the specification. Similarly, it shall be appreciated that in order to simplify the present disclosure and help the understanding of one or more of all the inventive aspects, in the above description of the exemplary embodiments of the present disclosure, sometimes individual features of the invention are grouped together into a single embodiment, figure or the description thereof. However, the disclosed methods should not be construed as reflecting the following intention, namely, the claimed invention claims more features than those explicitly recited in each claim. More precisely, as reflected in the following claims, an aspect of the invention lies in being less than all the features of individual embodiments disclosed previously. Therefore, the claims complying with a particular implementation are hereby incorporated into the particular implementation, wherein each claim itself acts as an individual embodiment of the present disclosure. Those skilled in the art can understand that in additional to mutual exclusion between the features, all the features disclosed in the specification (including the accompanying claims, abstract and drawings) and all the procedures or units of any method or device disclosed as such may be combined employing any combination. Unless explicitly stated otherwise, each feature disclosed in the specification (including the accompanying claims, abstract and drawings) may be replaced by an alternative feature providing an identical, equal or similar objective. Furthermore, it can be appreciated to the skilled in the art that although some embodiments described herein comprise some features and not other features comprised in other embodiment, a combination of features of different embodiments is indicative of being within the scope of the invention and forming a different embodiment. For example, in the following claims, any one of the claimed embodiments may be used in any combination. Each embodiment of the present disclosure may be implemented by hardware or implemented by a software module operating on one or more processors or implemented by a combination of the hardware and the software module. A person skilled in the art should understand that partial or complete functions of some or all components in the device for data matching according to the embodiment of the present disclosure may be implemented by using a microprocessor or a digital signal processor (DSP) in practice. The present disclosure may be further implemented as a program of a device or apparatus (such as a computer program and a computer program product) to be configured to partially or completely perform the method described here. The program realizing the present disclosure may be stored in a computer readable medium, or may have one or more signal types. The signals may be downloaded from an Internet website or provided by a carrier signal or provided in any other form. It should be noted that the embodiments above are illustrations rather than limitations on the present disclosure; moreover, a person skilled in the art may design substituting embodiments in case of not deflecting from scope of accompanying claims. In the claims, any reference signs in brackets shall not be construed as a limitation on the claims. The present disclosure may be implemented by hardware including a plurality of different elements as well as a properly programmed computer. In a claim listing a plurality of apparatus units, several of the apparatus units may be specifically implemented by a same hardware item. Use of words “first”, “second”, “third”, and the like, does not represent any sequence preference. The words may be explained as names. Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. It is intended that the specification and examples be considered as example only and not to limit the scope of the present disclosure, with a true scope and spirit of the invention being indicated by the following claims. Variations or equivalents derived from the disclosed embodiments also fall within the scope of the present disclosure. | 102,378 |
11862930 | DESCRIPTION OF EMBODIMENTS The following describes an optical module according to an embodiment of the present invention with reference to the accompanying drawings. Identical or corresponding components are denoted by an identical reference sign or an identical name, and duplicate description thereof will be omitted in some cases. Embodiment 1 FIG.1is a cross-sectional view of an optical module10according to Embodiment 1. The optical module10includes a stem13including a first surface13aand a second surface13bopposite to the first surface13a. A thermoelectric cooler16is provided to the first surface13aof the stem13. The thermoelectric cooler16is a thermoelectric cooler (TEC) in which a heat-absorbing substrate16band a heat-releasing substrate16care attached on the respective sides of a Peltier element16a. The heat-releasing substrate16cis fixed to the first surface13a. The fixation method is not particularly limited but is, for example, soldering by using AuSn, SnAgCu, or the like. Alternatively, the fixation method may be welding. A semiconductor laser element18is attached to the thermoelectric cooler16through a heat-releasing block or the like. Specifically, the semiconductor laser element18is attached to the heat-absorbing substrate16bthrough a heat-releasing block or the like. The semiconductor laser element18is, for example, a laser diode. The temperature of the semiconductor laser element18is adjusted by the thermoelectric cooler16. A cap20is fixed to the first surface13a. The cap20covers the thermoelectric cooler16and the semiconductor laser element18. A lens22is fixed to the cap20. The lens22condenses light emitted from the semiconductor laser element18. The semiconductor laser element18can be sealed in an airtight manner by fixing the cap20holding the lens22to the first surface13aof the stem13by, for example, resistance welding. A restriction body30is fixed to the second surface13b. The fixation method is not particularly limited but is, for example, soldering by using AuSn, SnAgCu, or the like. Alternatively, the fixation method may be welding. The restriction body30is, for example, a metal having a plate shape. The linear thermal expansion coefficients of the restriction body30and the heat-releasing substrate16care smaller than the linear thermal expansion coefficient of the stem13. The restriction body30, the heat-releasing substrate16c, and the stem13may be each made of any material that satisfies this relation among the linear thermal expansion coefficients. The linear thermal expansion coefficient of the restriction body30is preferably smaller than the linear thermal expansion coefficient of the heat-releasing substrate16c. A power supply lead pin penetrating through the stem13is provided to supply electrical power to the semiconductor laser element18and the thermoelectric cooler16. An optical signal output from the semiconductor laser element18is maintained at high quality so that the temperature of the semiconductor laser element18is adjusted to be constant by the thermoelectric cooler16. FIG.2is a diagram illustrating the status of thermal deformation of the optical module10at high temperature.FIG.3is a diagram illustrating the status of thermal deformation of the optical module10at low temperature.FIGS.2and3relate to the optical module in which the linear thermal expansion coefficient of the heat-releasing substrate16cis smaller than the linear thermal expansion coefficient of the stem13and the linear expansion coefficient of the restriction body30is smaller than the linear thermal expansion coefficient of the heat-releasing substrate16c.FIGS.2and3illustrate an optical fiber32coupled with a laser beam from the semiconductor laser element18. As illustrated inFIG.2, thermal expansion of the stem13is restricted by both the restriction body30and the heat-releasing substrate16c, but the restriction body30exerts larger force of restricting thermal expansion than the heat-releasing substrate16c. Thus, thermal expansion of the second surface13bis smaller than thermal expansion of the first surface13a, and the stem13warps in a convex manner projecting toward the cap20side. Accordingly, the position of the semiconductor laser element18varies in the direction toward the optical fiber32. In addition, the position of the lens22varies in the direction toward the optical fiber32due to thermal expansion of the cap20, and thus variation of the distance between the semiconductor laser element18and the lens22due to thermal deformation can be reduced. The following describesFIG.3illustrating thermal deformation of the optical module10at low temperature. The restriction body30exerts larger force to restrict heat contraction of the stem13than the heat-releasing substrate16c, and thus the stem13warps in a convex manner projecting toward the restriction body30side. Accordingly, the position of the semiconductor laser element18varies in the direction toward the stem13. In addition, the position of the lens22varies in the direction toward the stem13due to heat contraction of the cap20, and thus variation of the distance between the semiconductor laser element18and the lens22due to thermal deformation can be reduced. In the optical module10according to Embodiment 1, the heat-releasing substrate16cis attached to the first surface13aof the stem13and the restriction body30is attached to the second surface13b, thereby reducing variation of the distance between the semiconductor laser element18and the lens22due to thermal deformation. Accordingly, variation of the position of the light condensation point can be reduced, and thus tracking error can be reduced. The optical module10according to Embodiment 1 can be modified in various manners within characteristics thereof. The linear thermal expansion coefficients of the restriction body30and the heat-releasing substrate16cneed to be smaller than the linear thermal expansion coefficient of the stem13. However, the linear thermal expansion coefficients of the restriction body30and the heat-releasing substrate16cmay be equal to each other. Alternatively, the linear thermal expansion coefficient of the restriction body30may be larger than the linear thermal expansion coefficient of the heat-releasing substrate16c. In these cases as well, tracking error can be reduced as compared to a configuration in which the restriction body30is not provided. The stem13may be made of, for example, cold milling steel such as SPCC. The heat-releasing substrate16cmay be made of, for example, aluminum nitride, in other words, AlN, or alumina. The restriction body30may be made of, for example, aluminum nitride, alumina, kovar, or invar. With these materials, the linear thermal expansion coefficient of the restriction body30is equal to or smaller than the linear thermal expansion coefficient of the heat-releasing substrate16c, and the linear thermal expansion coefficient of the stem13is larger than the linear thermal expansion coefficients of the restriction body30and the heat-releasing substrate16c. When the restriction body30is made of AlN or alumina, thermal conductivity of the restriction body30is higher than thermal conductivity of the stem13, thereby preventing degradation of the heat-releasing characteristic of a product due to attachment of the restriction body30. These materials are exemplary. Optical modules according to embodiments below are similar to that of Embodiment 1, and thus the following mainly describes difference thereof from that of Embodiment 1. Embodiment 2 FIG.4is a cross-sectional view of an optical module according to Embodiment 2. A recess13cis formed at the second surface13b. The restriction, body30is provided in the recess13c. The restriction body30is fixed to the recess13cby, for example, welding. The restriction body30, which is housed in the recess13c, is positioned between the first surface13aand the second surface13b. A flexible substrate40is fixed to the second surface13bof the stem13. The flexible substrate40includes a high-frequency line and transmits an input electric signal to the semiconductor laser element18and the thermoelectric cooler16. The stem13has a side surface in contact with an optical transceiver housing42. Accordingly, heat generated through the operation of the thermoelectric cooler16is released to the optical transceiver housing42. FIG.5is a bottom view of the stem13of the optical module according to Embodiment 2. The recess13cdescribed above is formed at the center of the stem13. A lead pin44used for power supply to the semiconductor laser element18and the thermoelectric cooler16is fixed to the stem13. The lead pin44penetrates around the recess13cthrough the stem13. Accordingly, the lead pin44is provided at a position different from that of the recess13c. The area and thickness of the restriction body30are desirably larger than those of the heat-releasing substrate16c. The size of the recess13cis determined to house the restriction body30having such area and thickness. The flexible substrate40is electrically connected with the lead pin44to transmit an input electric signal to the semiconductor laser element18and the thermoelectric cooler16. When a flexible substrate is provided in the optical module illustrated inFIG.1, the flexible substrate needs to be provided at the lower surface of the restriction body30, and accordingly, the distance between the flexible substrate and the stem13increases as compared to a case in which the flexible substrate is directly fixed to the second surface13b. As a result, the configuration inFIG.1needs to be newly designed. However, in the optical module illustrated inFIG.4, since the restriction body30is provided in the recess13cof the stem13, the gap between the flexible substrate40and the stem13can be made equivalent to that in a conventional product including no restriction body30. Thus, a high-frequency line from the stem13to the flexible substrate40can be designed with an impedance equivalent to that of the conventional product, thereby avoiding degradation of the high-frequency characteristic. In addition, similarly to the conventional product, the side surface of the stem13can be provided in contact with the optical transceiver housing42to allow heat-releasing to the housing42by a method similar to that of the conventional product. As a result, the heat-releasing characteristic is not degraded by providing the restriction body30and the flexible substrate40. Similarly to the restriction body30, the heat-releasing substrate16cis attached to the stem13at a part where the lead pin44is not provided. Accordingly, the area of the restriction body30can be designed to be equivalent to the area of the heat-releasing substrate16c. The thickness of the stem13is, for example, 1.2 mm to 1.3 mm approximately, and the thickness of the heat-releasing substrate16cis, for example, 0.2 mm approximately. In this case, the thickness of the restriction body30provided in the recess13ccan be easily designed to be equivalent to or larger than the thickness of the heat-releasing substrate16c. In this example, the depth of the recess13cis 0.2 mm or larger, and the restriction body30having a thickness of 0.2 mm or larger is provided in the recess13c. As described above, the area and thickness of the restriction body30can be made equivalent to or larger than the area and thickness of the heat-releasing substrate16c. When the linear thermal expansion coefficient of the restriction body30is same as the linear thermal expansion coefficient of the heat-releasing substrate16c, the warping of the stem is reduced at least as compared to a case in which no restriction body is provided. In addition, when the linear thermal expansion coefficient of the restriction body30is smaller than the linear thermal expansion coefficient of the heat-releasing substrate16c, the directions of variation of the semiconductor laser element18and the position of the lens22due to thermal deformation can be same as described in Embodiment 1. In this manner, in the optical module according to Embodiment 2, since the recess13cis provided to the stem13and the restriction body30is embedded in the recess13c, tracking error can be reduced while the high-frequency characteristic and the heat-releasing characteristic equivalent to those of the conventional product are maintained. Embodiment 3 FIG.6is a cross-sectional view of an optical module according to Embodiment 3. This optical module includes the lead pin44penetrating through the stem13. In addition, a through-hole30athrough which the lead pin44penetrates is formed at the restriction body30. Accordingly, the area of the restriction body30can be increased to increase the contact area of the restriction body30and the stem13. For example, the contact area of the restriction body30and the second surface13bcan be larger than the contact area of the heat-releasing substrate16cand the first surface13a. When the contact areas of the restriction body30and the stem13are large, force exerted by the restriction body30to restrict thermal deformation of the stem13is increased. Accordingly, warping larger than that of the stem according to Embodiment 1 or 2 occurs to the stem13of the optical module according to Embodiment 3 at high temperature or low temperature, and the amount of change of the position of the semiconductor laser element18due to thermal deformation is increased. For example, when the stem13is made of cold milling steel and the cap20is made of stainless steel, the difference between the linear thermal expansion coefficients of both members is reduced to 12 ppm approximately. In addition, when the length of the cap20in the optical axis direction is, for example, 5 mm to 6 mm and the length of the stem13in the optical axis direction is 1.2 mm to 1.3 mm, the length of the cap20in the optical axis direction is longer than the length of the stem13in the optical axis direction, and thus the amount of thermal expansion of the cap20is larger than the amount of thermal expansion of the stem13. In this case, the amount of change of the position of the lens22due to thermal deformation is larger than the amount of change of the position of the semiconductor laser element18under the same condition. As described above, when the restriction body30is attached to the stem13, the positional variation directions of the semiconductor laser element18and the position of the lens22can be same. However, the amount of position change is larger at the lens22than the semiconductor laser element18. In Embodiment 3, the amount of change of the position of the semiconductor laser element18can be increased by increasing the area of the restriction body30, thereby reducing the amount of change of the relative positions of the semiconductor laser element18and the lens22. As a result, tracking error can be further reduced. Embodiment 4 FIG.7is a plan view of the stem and other components of an optical module according to Embodiment 4. A restriction body50is fixed to a side surface13dof the stem13. The restriction body50is annular in plan view.FIG.8is a cross-sectional view of the optical module according to Embodiment 4. The dashed and single-dotted line represents the center line of the stem13. The center line is positioned between the first surface13aand the second surface13b. The restriction body50is fixed to the side surface13dat a position closer to the second surface13bthan the first surface13a. In other words, the restriction body50is attached to cover a lead-pin output side of the side surface13dof the stem13but is not attached on the thermoelectric cooler16side. Accordingly, the restriction body50is provided on the second surface13bside of the dashed and single-dotted line. The linear thermal expansion coefficients of the heat-releasing substrate16cand the restriction body50are smaller than the linear thermal expansion coefficient of the stem13. At high temperature or low temperature, the restriction body50restricts thermal expansion and contraction of the lead-pin output side of the stem13, thereby making it possible to generate warping of the stem13in a direction same as that in Embodiment 1. Thus, tracking error is reduced.FIG.9is a cross-sectional view of the optical module according to Embodiment 4 at high temperature. As illustrated inFIG.9, the stem13largely expands on the first surface13aside, but the expansion on the second surface13bside is restricted by the restriction body50. In this manner, in addition to the tracking-error reduction effect, the optical module according to Embodiment 4 needs no special fabrication such as formation of a recess at the stem13, thereby avoiding increase in the cost of the stem13. The restriction body50inFIG.8can be modified in various manners as long as the restriction body50is fixed to the side surface13don the second surface side of a middle position at which the distance from the first surface13ais equal to the distance from the second surface13b. For example, the contact area of the restriction body and the stem may be smaller than that in the case ofFIG.8. Embodiment 5 FIG.10is a diagram illustrating a restriction body and other components according to Embodiment 5. A restriction body52is semicircular and provided to the side surface13dof the stem13. As described in Embodiment 4, the restriction body52is fixed to the side surface13dat a position closer to the second surface13bthan the first surface13a. As illustrated inFIG.10, the restriction body52does not cover the entire side surface of the stem13in plan view but covers part of the side surface13dof the stem13in plan view. Part of the side surface13dnot covered by the restriction body52thermally contacts the optical transceiver housing42. Accordingly, favorable heat-releasing from the optical module to the housing42is achieved while the restriction body52is attached. Embodiment 6 FIG.11is a cross-sectional view of an optical module according to Embodiment 6. An operation temperature range is determined for an optical module as a product. For example, a product configured to operate at −5° C. to 80° C. has a central temperature of 37.5° C. A product configured to operate at −40° C. to 95° C. has a central temperature of 27.5° C. For example, the central temperature of the operation temperature range of a product is adjusted to room temperature as ambient temperature of the product. FIG.11illustrates the optical fiber32provided outside the cap20and facing the lens22. Typically, an optical fiber is provided so that a coupling efficiency peak is obtained at the central temperature of the operation temperature range. However, the optical fiber32according to Embodiment 6 is provided at a position where the coupling efficiency peak is obtained at a temperature lower than the central temperature of the operation temperature. Specifically, the optical fiber32is defocused in the direction departing from the optical module and fixed. FIG.12is a diagram illustrating the relation between the package ambient temperature and the coupling efficiency. T1 and T2 represent the lowest and highest temperatures of an assumed operation temperature range. Tc represents the central temperature of the operation temperature range. Tc is, for example, room temperature at 25° C. approximately. In a “without defocus” case illustrated with the solid line, the optical fiber is provided so that the coupling efficiency peak can be obtained at the central operation temperature Tc. For example, when the strength of bonding between the stem13and the restriction body30is weak, force exerted by the restriction body50to restrict thermal deformation of the stem13decreases along with thermal contraction of the stem13at low temperature. As a result, at low temperature, the tracking-error reduction effect is small and change of the coupling efficiency due to change of the ambient temperature is large. Accordingly, decrease of the coupling efficiency is large at low temperature. As a result, in a “without defocus” case illustrated inFIG.12, high coupling efficiency is obtained at the central temperature Tc, but the coupling efficiency abruptly decreases as temperature becomes lower than Tc. A “with defocus” case illustrated with the dashed line inFIG.12corresponds to the relation between temperature and the coupling efficiency when the optical fiber32is defocused in the direction departing from the lens22and fixed. In the “with defocus” case, the optical fiber32is provided at a position where the coupling efficiency peak is obtained at a temperature lower than the central temperature Tc of the operation temperature.FIG.13is a cross-sectional view of the optical module when the ambient temperature is lower than Tc in the “with defocus” case. In this case, the cap20thermally contracts, and accordingly, the position of the lens22varies in the direction toward the stem13. Along this, the position of the condensation point of light emitted from the semiconductor laser element18varies in the direction toward the optical fiber32. Since the optical fiber32is defocused, the coupling efficiency increases at low temperature. As a result, the coupling efficiency peak is obtained at a temperature lower than Tc. In the optical module according to Embodiment 6, the coupling efficiency peak is shifted to the low temperature side with taken into consideration the abrupt decrease of the coupling efficiency at low temperature, for example, when the strength of bonding between the stem13and the restriction body30is weak. Accordingly, coupling efficiency change that occurs in the entire operation temperature range can be reduced. In other words, tracking error can be reduced. The coupling efficiency abruptly decreases at low temperature not only when the strength of bonding between the stem13and the restriction body30is weak but also, for example, when force that restricts thermal deformation of the stem is weak due to characteristics of the material of the restriction body. Thus, it is effective to adjust the position of the optical fiber in the optical axis direction as described above. Features of the optical module according to each embodiment described above may be combined as appropriate to enhance the effect of the present invention. DESCRIPTION OF SYMBOLS 10optical module,13stem,16thermoelectric cooler,18semiconductor laser element,20cap,22lens | 22,437 |
11862931 | DETAILED DESCRIPTION Contents 1. Description of terms2. Overview of laser system2.1 Configuration2.1.1 Configuration of laser system2.1.2 Configuration of wavelength conversion system2.2 Operation3 Problems4. First Embodiment4.1 Configuration4.2 Operation4.2.1 Crystal replacement control4.2.2 Determination of spare cell preparation start timing4.3 Effects and advantages5. Second Embodiment5.1 Configuration5.2 Operation5.3 Effects and advantages6. Method for manufacturing electronic device7. Others Embodiments of the present disclosure will be described below in detail with reference to the drawings. The embodiments described below show some examples of the present disclosure and are not intended to limit the contents of the present disclosure. Furthermore, all configurations and operations described in the embodiments are not necessarily essential as configurations and operations in the present disclosure. The same component has the same reference character, and no redundant description of the same component will be made. 1. Description of Terms The terms used in the present specification are defined as follows. The term “hybrid laser apparatus” refers to a two-stage laser apparatus including an oscillation stage (master oscillator) and an amplification stage (amplifier) with a solid-state laser apparatus provided in the oscillation stage and an excimer laser apparatus provided in the amplification stage. The term “excimer amplifier” refers to the excimer laser apparatus used in the amplification stage. The term “perpendicular” or “orthogonal” used herein may conceptually include roughly perpendicular or orthogonal, which can be regarded as equal to substantially perpendicular or orthogonal in a technical sense. 2. Overview of Laser System 2.1 Configuration 2.1.1 Configuration of Laser System FIG.1schematically shows an example of the configuration of a solid-state laser system1. The solid-state laser system1includes a first solid-state laser apparatus10, which outputs first pulsed laser light, a second solid-state laser apparatus12, which outputs second pulsed laser light, a wavelength conversion system14, a synchronization circuit20, and a control section22. In the description, the laser light traveling direction is defined as a “direction Z”. One direction perpendicular to the direction Z is defined as a “direction V”, and the direction perpendicular to the directions V and Z is defined as a “direction H”. The first solid-state laser apparatus10includes a first semiconductor laser24, a first semiconductor optical amplifier SOA26, an Yb fiber amplifier system28, an Yb:YAG (yttrium aluminum garnet) crystal amplifier30, and an LBO (LiB3O5) crystal32. The first semiconductor laser24(denoted as semiconductor laser1inFIG.1) is a single longitudinal mode laser that outputs seed light having a wavelength of about 1030 nm when operating in CW or pulsed oscillation. The first semiconductor laser24may, for example, be a distributed feedback (DFB) semiconductor laser. The first semiconductor optical amplifier SOA26(denoted as semiconductor optical amplifier SOA1inFIG.1) is a semiconductor device that converts the CW or pulsed seed light into pulsed laser light having a predetermined pulse width when a current control element that is not shown causes a pulsed current to flow in a semiconductor portion of the device. The Yb fiber amplifier system28includes multistage optical fiber amplifiers28A doped with Yb and a CW pumping semiconductor laser that is not shown but operates in CW oscillation to output pumping light and supplies each of the optical fiber amplifiers28A with the pumping light. The Yb:YAG crystal amplifier30is a YAG crystal doped with Yb. The LBO crystal32is a nonlinear crystal. On the other hand, the second solid-state laser apparatus12includes a second semiconductor laser36(denoted as semiconductor laser2inFIG.1), a second semiconductor optical amplifier SOA38(denoted as semiconductor optical amplifier SOA2inFIG.1), and an Er fiber amplifier system40. The second semiconductor laser36is a single longitudinal mode laser that outputs seed light having a wavelength of about 1553 nm when operating in CW or pulsed oscillation. The second semiconductor laser36may, for example, be a distributed feedback (DFB) semiconductor laser. The second semiconductor optical amplifier SOA38is a semiconductor device that converts the CW or pulsed seed light into pulsed laser light having a predetermined pulse width when a current control element that is not shown causes a pulsed current to flow in a semiconductor portion of the device. The Er fiber amplifier system40includes multistage optical fiber amplifiers40A doped with Er and Yb and a CW pumping semiconductor laser that is not shown but operates in CW oscillation to output pumping light and supplies each of the optical fiber amplifiers40A with the pumping light. The wavelength conversion system14includes a wavelength conversion box42, which is an enclosure, a first window44, a second window46, and a third window48. The wavelength conversion system14includes the following components housed in the wavelength conversion box42: a first CLBO (CsLiB6O10) crystal50; a second CLBO crystal52; a third CLBO crystal54; a first high-reflectance mirror56; a second high-reflectance mirror58; a first dichroic mirror60; a second dichroic mirror62; a third dichroic mirror64; a first HVθ stage66; and a second HVθ stage68. The wavelength conversion box42is an example of the “third container” in the present disclosure. The first window44and the second window46are disposed on the light incident side of the wavelength conversion box42. The third window48is disposed on the light exit side of the wavelength conversion box42. The first window44, the first CLBO crystal50, the first dichroic mirror60, the second CLBO crystal52, the second dichroic mirror62, the third CLBO crystal54, and the third dichroic mirror64are arranged in this order along the optical path of the pulsed laser light. The first high-reflectance mirror56is so disposed as to reflect at high reflectance the second pulsed laser light outputted from the second solid-state laser apparatus12and incident via the second window46and to cause the reflected light to be incident on the first dichroic mirror60. The first CLBO crystal50(denoted as CLBO1inFIG.1) is a nonlinear crystal that generates the first pulsed laser light having a wavelength of about 258 nm from pulsed laser light outputted from the first solid-state laser apparatus10, incident via the first window44, and having a wavelength of about 515 nm. The first CLBO crystal50is an example of the “first nonlinear crystal” in the present disclosure. The first dichroic mirror60is coated with a film that transmits at high transmittance the first pulsed laser light having the wavelength of about 258 nm and reflects at high reflectance the second pulsed laser light having a wavelength of about 1553 nm. The first dichroic mirror60is so disposed that the first pulsed laser light and the second pulsed laser light are incident on the second CLBO crystal52in the state in which the optical path axes of the first pulsed laser light and the second pulsed laser light coincide with each other. The second CLBO crystal52(denoted as CLBO2inFIG.1) is a nonlinear crystal that uses the first pulsed laser light and the second pulsed laser light incident thereon to generate pulsed laser light having a wavelength of about 221 nm, which corresponds to the sum frequency. The second dichroic mirror62is coated with a film that reflects at high reflectance the first pulsed laser light having the wavelength of about 258 nm and transmits at high transmittance the second pulsed laser light having the wavelength of about 1553 nm and the pulsed laser light generated by the second CLBO crystal52and having the wavelength of about 221 nm. The third CLBO crystal54(denoted as CLBO3inFIG.1) is a nonlinear crystal that uses the second pulsed laser light having the wavelength of about 1553 nm and the pulsed laser light having the wavelength of about 221 nm incident thereon to generate pulsed laser light having a wavelength of about 193 nm, which corresponds to the sum frequency. The third dichroic mirror64is coated with a film that transmits at high transmittance the second pulsed laser light having the wavelength of about 1553 nm and the pulsed laser light having the wavelength of about 221 nm and reflects at high reflectance the pulsed laser light having the wavelength of about 193 nm. The second high-reflectance mirror58is so disposed as to cause the pulsed laser light having the wavelength of about 193 nm to be outputted from the wavelength conversion system14via the third window48. The second CLBO crystal52and the third CLBO crystal54are disposed at the first HVθ stage66and the second HVθ stage68, respectively, each via a first crystal holder90. The first HVθ stage66and the second HVθ stage68move in H-axis and V-axis directions, respectively, and rotate around the axis H. Signal lines are connected to the synchronization circuit20and allow it to control the first semiconductor optical amplifier SOA26and the second semiconductor optical amplifier SOA38. The control section22includes a CPU (central processing unit), a ROM (read only memory), a RAM (random access memory), an input/output interface, and other components, none of which is shown. Signal lines are connected to the control section22and allow it to control the synchronization circuit20, the first HVθ stage66, and the second HVθ stage68. The control section22is communicatively connected to an external apparatus control section98external to the solid-state laser system1. The control section22is an example of the “controller” in the present disclosure. 2.1.2 Configuration of Wavelength Conversion System FIG.2is a configuration diagram showing an example of the wavelength conversion system14. InFIG.2, the directions in the description are defined as follows: a direction X is the rightward direction; a direction Y is the upward direction orthogonal to the direction X; and a direction Z is the direction orthogonal to the directions X and Y. The wavelength conversion box42of the wavelength conversion system14includes a first purge gas inlet tube70and a first purge gas outlet tube72, in addition to the first window44, the second window46, and the third window48described above. The first purge gas inlet tube70and the first purge gas outlet tube72cause the spaces inside and outside the wavelength conversion box42to communicate with each other. The first purge gas inlet tube70is connected to a cylinder that is not shown but supplies, for example, an N2gas as a purge gas. The first purge gas inlet tube70is an example of the “third gas introduction tube” in the present disclosure. The first purge gas outlet tube72is an example of the “third gas discharge tube” in the present disclosure. The N2gas is an example of the “second gas” in the present disclosure. The wavelength conversion box42houses a first CLBO crystal cell74, a second CLBO crystal cell76, and a third CLBO crystal cell78, in addition to the first high-reflectance mirror56and the first dichroic mirror60described above. The second high-reflectance mirror58, the second dichroic mirror62, the third dichroic mirror64, the first HVθ stage66, and the second HVθ stage68are omitted inFIG.2. The first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78include the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54described above, respectively. The first CLBO crystal cell74includes a first container80, a second purge gas inlet tube86, a second purge gas outlet tube88, the first crystal holder90, and a first heater92. The second purge gas inlet tube86causes the space outside the wavelength conversion box42to communicate with the space inside the first container80. The second purge gas inlet tube86is connected to a cylinder that is not shown but supplies the first CLBO crystal50, for example, with an Ar gas or a He gas, which are inert gases. In the example shown inFIG.2, the second purge gas inlet tube86is connected to a cylinder containing an Ar gas as the purge gas. The second purge gas inlet tube86is an example of the “first gas introduction tube” in the present disclosure. The Ar gas is an example of the “first gas” in the present disclosure. The second purge gas outlet tube88causes the space inside the first container80to communicate with the space inside the wavelength conversion box42. The second purge gas outlet tube88is an example of the “first gas discharge tube” in the present disclosure. The first container80includes a first light incident window82and a first light exit window84. In the first container80, the first light incident window82is disposed on the light incident side of the wavelength conversion box42, and the first light exit window84is disposed on the light exit side thereof. The first container80accommodates the first crystal holder90and the first heater92. The first crystal holder90is a holding member that holds the first CLBO crystal50. The first heater92is a heating member that heats the first CLBO crystal50. The first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78have the same configuration, and the configurations of the second CLBO crystal cell76and the third CLBO crystal cell78will therefore not be described. The wavelength conversion system14further includes a temperature adjuster94external to the wavelength conversion box42. The temperature adjuster94is provided in the control section22(seeFIG.1). The temperature adjuster94is connected to the first heaters92in the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78. 2.2 Operation The operation of the solid-state laser system1will be described. In the description, the temperature adjuster94controls the first heaters92in the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78to heat the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54to 150° C. in advance. The spaces inside the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78are each purged with the Ar gas in advance via the second purge gas inlet tube86and the second purge gas outlet tube88. Furthermore, the space inside the wavelength conversion box42is purged with the N2gas in advance via the first purge gas inlet tube70and the first purge gas outlet tube72. The control section22develops in the RAM, which is not shown, a variety of programs, such as a control program, stored in the ROM, which is not shown, and the CPU, which is not shown, executes the programs developed in the RAM. When the control section22receives a laser oscillation preparation signal and a target oscillation wavelength from the external apparatus control section98, the control section22causes the first semiconductor laser24, the CW pumping semiconductor laser that is not shown but is provided in the Yb fiber amplifier system28, the second semiconductor laser36, and the CW pumping semiconductor laser that is not shown but is provided in the Er fiber amplifier system40to undergo CW or pulsed oscillation. Furthermore, when the control section22receives a light emission trigger from the external apparatus control section98, the control section22transmits a trigger signal Tr1to the synchronization circuit20. Having received the trigger signal Tr1from the control section22, the synchronization circuit20transmits control signals to the first semiconductor optical amplifier SOA26and the second semiconductor optical amplifier SOA38. In the first solid-state laser apparatus10, the first semiconductor optical amplifier SOA26converts the laser light outputted from the first semiconductor laser24and having a wavelength of about 1030 nm into laser light having a predetermined pulse width and amplifies the converted laser light, and the amplified laser light enters the Yb fiber amplifier system28as the pulsed seed light. The Yb fiber amplifier system28and the Yb:YAG crystal amplifier30amplify the pulsed seed light. The LBO crystal32generates pulsed laser light having a wavelength of about 515 nm from the amplified pulsed laser light. The pulsed laser light outputted from the first solid-state laser apparatus10and having the wavelength of about 515 nm enters the first CLBO crystal50in the wavelength conversion system14via the first window44. The first CLBO crystal50uses the pulsed laser light having the wavelength of about 515 nm incident thereon to generate the first pulsed laser light having the wavelength of about 258 nm and causes the first pulsed laser light to be incident on the first dichroic mirror60. In the second solid-state laser apparatus12, on the other hand, the second semiconductor optical amplifier SOA38converts the CW or pulsed oscillation laser light outputted from the second semiconductor laser36and having the wavelength of about 1553 nm into laser light having a predetermined pulse width and amplifies the converted laser light, and the amplified laser light enters the Er fiber amplifier system40. The Er fiber amplifier system40further amplifies the pulsed seed light. The second pulsed laser light outputted from the second solid-state laser apparatus12and having the wavelength of about 1553 nm is incident on the first high-reflectance mirror56in the wavelength conversion system14via the second window46. The first high-reflectance mirror56reflects at high reflectance the second pulsed laser light incident thereon and causes the reflected pulsed laser light to be incident on the first dichroic mirror60. The synchronous circuit20transmits a signal having a predetermined pulse width to the first semiconductor optical amplifier SOA26and the second semiconductor optical amplifier SOA38at predetermined timings based on the trigger signal Tr1. The wavelength conversion system14adjusts the predetermined pulse width in such a way that the pulsed laser light having the wavelength of about 193 nm has a desired pulse width. The adjustment of the pulse width allows adjustment of the pulse width of the pulsed laser light having the wavelength of about 193 nm. The predetermined timings are so adjusted that the first pulsed laser light outputted from the first CLBO crystal50and the second pulsed laser light outputted from the Er fiber amplifier system40enter the second CLBO crystal52roughly at the same time. The first pulsed laser light having the wavelength of about 258 nm and the second pulsed laser light having the wavelength of about 1553 nm therefore enter the second CLBO crystal52roughly at the same time, and the two beams overlap with each other on the second CLBO crystal52. As a result, the second CLBO crystal52generates the pulsed laser light having the wavelength of about 221 nm, which corresponds to the sum frequency produced from about 258 nm and about 1553 nm. The second dichroic mirror62reflects at high reflectance the pulsed laser light having the wavelength of about 258 nm. The second dichroic mirror62transmits at high transmittance the pulsed laser light having the wavelength of about 1553 nm and the pulsed laser light having the wavelength of about 221 nm incident thereon and causes the transmitted pulsed laser light to enter the third CLBO crystal54. The third CLBO crystal54uses the pulsed laser light having the wavelength of about 1553 nm and the pulsed laser light having the wavelength of about 221 nm incident thereon to generate the pulsed laser light having the wavelength of about 193 nm, which is the sum frequency produced from about 1553 nm and about 221 nm. The third dichroic mirror64transmits at high transmittance the pulsed laser light having the wavelength of about 1553 nm and the pulsed laser light having the wavelength of about 221 nm. The third dichroic mirror64reflects at high reflectance the pulsed laser light having the wavelength of about 193 nm and causes the reflected pulsed laser light to be incident on the second high-reflectance mirror58. The second high-reflectance mirror58reflects at high reflectance the incident pulsed laser light having the wavelength of about 193 nm and outputs the reflected pulsed laser light out of the wavelength conversion system14via the third window48. The second CLBO crystal52and the third CLBO crystal54are damaged in some cases by the ultraviolet pulsed laser light having any of the wavelengths of about 258 nm, 221 nm, and 193 nm. To avoid the damage, the control section22controls the first HVθ stage66and the second HVθ stage68in such a way that the second CLBO crystal52and the third CLBO crystal54move by a predetermined distance in the direction V or H whenever a predetermined number of shots of the pulsed laser light are applied. As a result, the laser light incident points can be changed, whereby the crystal lifetimes of the second CLBO crystal52and the third CLBO crystal54can be extended. When the external device control section98changes the target wavelength of the output laser light, the control section22changes the oscillation wavelength of the laser light from the first semiconductor laser24or the second semiconductor laser36and controls the first HVθ stage66and the second HVθ stage68in such a way that the angle of incidence of the light incident on the second CLBO crystal52and the angle of incidence of the light incident on the third CLBO crystal54are each the phase-matching angle corresponding to the target wavelength. 3. Problems Since CLBO crystals are deliquescent and hygroscopic, the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54are used as being heated to 150° C. with the interiors of the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78purged with the Ar gas or any other purge gas. For example, when the first CLBO crystal50reaches the end of its life, the temperature thereof is gradually lowered, and the wavelength conversion box42and the first CLBO crystal cell74are then opened, followed by replacement of the first CLBO crystal50. Furthermore, since the first CLBO crystal50is heated in the first CLBO crystal cell74and used with the temperature maintained, it takes three to four days to heat, increase the temperature of, and dehydrate the first CLBO crystal50after the replacement, resulting in a time-consuming maintenance process as a whole. As described above, it takes a long period to replace the CLBO crystal and generate deep ultraviolet light having the wavelength of about 193 nm. 4. First Embodiment 4.1 Configuration FIG.3schematically shows the configuration of a solid-state laser system1A according to a first embodiment. InFIG.3, the directions in the description are defined as follows: the direction X is the right direction; the direction Y is the upper direction orthogonal to the direction X; and the direction Z is the direction orthogonal to the directions X and Y, as inFIG.2. Differences from the solid-state laser system1shown inFIGS.1and2will be described below. The solid-state laser system1A shown inFIG.3includes a fourth CLBO crystal cell100, a fifth CLBO crystal cell102, and a sixth CLBO crystal cell104. The solid-state laser system1A further includes a first stage106, a second stage108, and a third stage110. The solid-state laser system1A still further includes a stage controller112in the control section22. The fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104include a fourth CLBO crystal120, a fifth CLBO crystal122, and a sixth CLBO crystal124, respectively. The fourth CLBO crystal120is a crystal that generates light having the same wavelength as the light generated by the first CLBO crystal50. The fourth CLBO crystal120is an example of the “second nonlinear crystal” in the present disclosure. The fifth CLBO crystal122is a crystal that generates light having the same wavelength as the light generated by the second CLBO crystal52. The sixth CLBO crystal124is a crystal that generates light having the same wavelength as the light generated by the third CLBO crystal54. The fourth CLBO crystal cell100includes a second container130, a second light incident window132, a second light exit window134, a third purge gas inlet tube136, a third purge gas outlet tube138, a second crystal holder140, and a second heater142. The configurations of the second container130, the second light incident window132, the second light exit window134, the third purge gas inlet tube136, the third purge gas outlet tube138, the second crystal holder140, and the second heater142are the same as those of the first container80, the first light incident window82, the first light exit window84, the second purge gas inlet tube86, the second purge gas outlet tube88, the first crystal holder90, and the first heater92, respectively. The third purge gas inlet tube136is an example of the “second gas introduction tube” in the present disclosure. The third purge gas outlet tube138is an example of the “second gas discharge tube” in the present disclosure. The fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104have the same configuration. The second crystal holders140of the fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104hold the fourth CLBO crystal120, the fifth CLBO crystal122, and the sixth CLBO crystal124, respectively. The second purge gas inlet tubes86in the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78are connected to a common tube96via valves87A,87B, and87C, respectively, outside the wavelength conversion box42. Similarly, the third purge gas inlet tubes136in the fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104are connected to the common tube96via valves87D,87E, and87F, respectively, outside the wavelength conversion box42. The valves87A,87B, and87C are controlled by the control section22and switch between communication and blockage of the second purge gas inlet tubes86. The valves87A,87B, and87C may instead be configured to allow the second purge gas inlet tubes86to communicate with either the common tube96or a tube that is not shown. The tube that is not shown may communicate with a compressor that supplies the atmosphere. Similarly, the valves87D,87E, and87F are controlled by the control section22and switch between communication and blockage of the third purge gas inlet tubes136. The valves87D,87E, and87F may be configured to allow the third purge gas inlet tubes136to communicate with either the common tube96or a tube that is not shown. The tube that is not shown may communicate with a compressor that supplies the atmosphere. The second purge gas inlet tubes86and the third purge gas inlet tubes136are each at least partially flexible. The second heaters142in the fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104are connected to the temperature adjuster94. The first stage106includes a rail150extending in the direction Y and a movable section152held by the rail150so as to be movable in the direction Y along the rail150. The first CLBO crystal cell74and the fourth CLBO crystal cell100are arranged in the direction Y and held by the movable section152. The second stage108includes a rail154extending in the direction Y and a movable section156held by the rail154so as to be movable in the direction Y along the rail154. The second CLBO crystal cell76and the fifth CLBO crystal cell102are arranged in the direction Y and held by the movable section156. Similarly, the third stage110includes a rail158extending in the direction Y and a movable section160held by the rail158so as to be movable in the direction Y along the rail158. The third CLBO crystal cell78and the sixth CLBO crystal cell104are arranged in the direction Y and held by the movable section160. The first stage106, the second stage108, and the third stage110each include an actuator that is not shown. The actuators, which are not shown, are connected to the stage controller112. In the example shown inFIG.3, the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54are placed in the optical path of the laser light, and the fourth CLBO crystal120, the fifth CLBO crystal122, and the sixth CLBO crystal124are placed outside the optical path of the laser light. FIG.4shows the state in which the movable sections152,156, and160have been moved from the state shown inFIG.3. In the example shown inFIG.4, the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54are placed outside the optical path of the laser light, and the fourth CLBO crystal120, the fifth CLBO crystal122, and the sixth CLBO crystal124are placed in the optical path of the laser light. 4.2 Operation An operator causes in advance the first crystal holders90in the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78to hold the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54, respectively, and stores the resultant units in the respective first containers80. Similarly, the operator causes the second crystal holders140in the fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104to hold the fourth CLBO crystal120, the fifth CLBO crystal122, and the sixth CLBO crystal124, respectively, and stores the resultant units in the respective second containers130. The temperature adjuster94controls the first heaters92in the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78to heat the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54to 150° C. in a default step. Similarly, the temperature adjuster94controls the second heaters142in the fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104to heat the fourth CLBO crystal120, the fifth CLBO crystal122, and the sixth CLBO crystal124to 150° C. in the default step. The control section22purges the interior of the wavelength conversion box42with the N2gas for a default period at a default flow rate by introducing the N2gas via the first purge gas inlet tube70and discharging the N2gas via the first purge gas outlet tube72. Furthermore, the control section22purges the interiors of the first containers80in the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78with the Ar gas for a default period at a default flow rate. Similarly, the control section22purges the interiors of the second containers130in the fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104with the Ar gas for a default period at a default flow rate. The stage controller112places the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78in the optical path of the laser light, as in the example shown inFIG.2. The control section22uses the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78to generate ultraviolet light. Also while using the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78to generate the ultraviolet light, the control section22keeps maintaining the temperatures of the second heaters142and the gas flow rates in the second containers130in the fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104. When the first CLBO crystal50reaches the end of its life, the stage controller112controls the first stage106to move the movable section152so that the first CLBO crystal50in the first CLBO crystal cell74is moved away from the optical path of the laser light and the fourth CLBO crystal120in the fourth CLBO crystal cell100is inserted into the optical path of the laser light. The wavelength conversion system14thus uses the fourth CLBO crystal120in place of the first CLBO crystal50to perform the wavelength conversion. When the second CLBO crystal52reaches the end of its life, the stage controller112controls the second stage108to move the movable section156so that the second CLBO crystal52in the second CLBO crystal cell76moves away from the optical path of the laser light and the fifth CLBO crystal122in the fifth CLBO crystal cell102is inserted into the optical path of the laser light. The wavelength conversion system14thus uses the fifth CLBO crystal122in place of the second CLBO crystal52to perform the wavelength conversion. When the third CLBO crystal54reaches the end of its life, the stage controller112controls the third stage110to move the movable section160so that the third CLBO crystal54in the third CLBO crystal cell78moves away from the optical path of the laser light and the sixth CLBO crystal124in the sixth CLBO crystal cell104is inserted into the optical path of the laser light. The wavelength conversion system14thus uses the sixth CLBO crystal124in place of the third CLBO crystal54to perform the wavelength conversion. 4.2.1 Crystal Replacement Control Crystal replacement control will be described in detail.FIG.5is a flowchart showing an example of how the control section22controls the solid-state laser system1A during the crystal replacement. The description will be made of a case of replacement of the second CLBO crystal52with the fifth CLBO crystal122. In step S1, the control section22causes the solid-state laser system1A to start outputting the pulsed laser light having the wavelength of about 193 nm. In the description, the stage controller112controls the first stage106, the second stage108, and the third stage110to place the first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78in the optical path of the laser light. The fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104are thus placed outside the optical path of the laser light. The first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54are therefore placed in the optical path of the laser light, and the fourth CLBO crystal120, the fifth CLBO crystal122, and the sixth CLBO crystal124are placed outside the optical path of the laser light. The solid-state laser system1A uses the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54placed in the optical path of the laser light to perform the wavelength conversion and outputs the pulsed laser light having the wavelength of about 193 nm. The first CLBO crystal cell74, the second CLBO crystal cell76, and the third CLBO crystal cell78placed in the optical path of the laser light are called driven cells. The fourth CLBO crystal cell100, the fifth CLBO crystal cell102, and the sixth CLBO crystal cell104placed outside the optical path of the laser light are called spare cells. When any of the driven cells used to perform the wavelength conversion reaches the end of its life, the solid-state laser system1A switches the driven cell to the corresponding spare cell to perform the wavelength conversion. In step S2, the control section22evaluates whether or not the first CLBO crystal50in the driven cell held by the movable section152of the first stage106is immediately before the end of its life. The control section22further evaluates whether or not the second CLBO crystal52in the driven cell held by the movable section156of the second stage108is immediately before the end of its life. Similarly, the control section22evaluates whether or not the third CLBO crystal54in the driven cell held by the movable section160of the third stage110is immediately before the end of its life. When none of the first CLBO crystal50, the second CLBO crystal52, and the third CLBO crystal54is immediately before the end of its life, the control section22repeats the process in step S2. It is assumed that the control section22has determined that the second CLBO crystal52is immediately before the end of its life. In step S3, the control section22evaluates whether or not the fifth CLBO crystal122has already been set in (held by) the second crystal holder140in the fifth CLBO crystal cell102, which is a spare cell, held by the movable section156of the second stage108. When the fifth CLBO crystal122has not been set in the second crystal holder140, the control section22carries out the process in step S4. When the fifth CLBO crystal122has been set in the second crystal holder140, the control section22carries out the process in step S5. In step S4, the control section22displays on a display section, which is not shown, that the second CLBO crystal52in the driven cell is just immediately before the end of its life. The operator is thus requests to set the fifth CLBO crystal122, which is a spare cell. The control section22then carries out the process in step S3. In step S5, the control section22starts the step of controlling the temperature of the fifth CLBO crystal cell102, which is a spare cell, and dehydrating the fifth CLBO crystal cell102. The temperature control and dehydration step is an example of the “dehydration process” in the present disclosure. To control the temperature of the spare cell, the temperature adjuster94carries out a heating process of heating the fifth CLBO crystal122. That is, the temperature adjuster94controls the second heater142in the fifth CLBO crystal cell102to raise the temperature of the fifth CLBO crystal122to 150° C. at a rate of 1° C./min. The temperature adjuster94then maintains the temperature of the fifth CLBO crystal122at 150° C. until the fifth CLBO crystal122reaches the end of its life. As the step of dehydrating the spare cell, the control section22carries out an atmosphere flow process. That is, the control section22keeps the air flowing into the second container130in the fifth CLBO crystal cell102via the third purge gas inlet tube136and the third purge gas outlet tube138for 48 hours to sufficiently dehydrate the fifth CLBO crystal cell102. The control section22then performs an inert gas flow process as the step of dehydrating the spare cell. That is, the control section22keeps an inert gas (Ar or Ne, for example) having a low dew point flowing in the second container130in the fifth CLBO crystal cell102for 48 hours to further dry the fifth CLBO crystal cell102. An Ar gas is herein used as the inert gas. The dehydration step using the air may be omitted, and the fifth CLBO crystal cell102may be dried only by the dehydration step using an inert gas. When the fifth CLBO crystal122has been set in advance in the spare cell, the temperature control and dehydration process may be initiated before the timing immediately before the second CLBO crystal52in the driven cell reaches the end of its life. In step S6, the control section22evaluates whether or not the second CLBO crystal52in the driven cell has reached the end of its life. When the second CLBO crystal52has not reached the end of its life, the control section22repeats the process in step S6. When the second CLBO crystal52has reached the end of its life, the control section22carries out the process in step S7. In step S7, the control section22stops inputting the laser light into the wavelength conversion system14. For example, the control section22stops the operation of the first solid-state laser apparatus10and the second solid-state laser apparatus12. The control section22may stop inputting the laser light into the wavelength conversion system14by closing a shutter that is not shown. In step S8, the stage controller112controls the actuator, which is not shown, of the second stage108to move the second CLBO crystal52in the driven cell away from the optical path of the laser light and insert the fifth CLBO crystal122in the spare cell into the optical path of the laser light. In step S9, the control section22evaluates whether or not the step of dehydrating the spare cell has been completed. When the 48-hour atmosphere flow process and the 48-hour inert gas flow process started in step S5have been completed, the control section22carries out the process in step S10. When the 48-hour atmosphere flow process and the 48-hour inert gas flow process started in step S5have not been completed, the control section22repeats the process in step S9. In step S10, the control section22starts inputting the laser light to the wavelength conversion system14. That is, the control section22causes the first solid-state laser apparatus10and the second solid-state laser apparatus12to start operating. In the description, the control section22controls a shutter that is not shown to block the laser light outputted from the solid-state laser system1A. In step S11, the control section22adjusts the phase matching angle of the fifth CLBO crystal122in the fifth CLBO crystal cell102that is a new driven cell. Although not shown inFIG.3, the fifth CLBO crystal cell102includes an HVθ stage. The control section22controls the HVθ stage in the fifth CLBO crystal cell102based on the result of detection performed by an energy sensor that is not shown but measures the energy of the laser light that exits via the third window48. The control section22adjusts the phase matching angle of the fifth CLBO crystal122in such a way that the energy after the wavelength conversion is maximized. Finally, in step S12, the control section22controls the shutter, which is not shown, to cause the solid-state laser system1A to start outputting the pulsed laser light having the wavelength of about 193 nm. 4.2.2 Determination of Spare Cell Preparation Start Timing The control section22determines the spare cell preparation start timing based on parameters of the laser light. The control section22detects the timing immediately before the end of the life of a driven cell based on at least one of the following (1) to (6) and starts the spare cell preparation (setting, temperature control, and dehydration step). (1) Detection Based on Laser Radiation Period The total laser radiation period for which the laser light is radiated onto a CLBO crystal is measured from the start of use of the driven cell, and the timing when a specified period elapses is detected based on the result of the measurement. For example, the total laser radiation period for which the laser light is radiated onto a CLBO crystal is 4000 hours at the longest, and the specified period is 3200 hours, which is 80% of 4000 hours. (2) Detection Based on the Number of Pulses The number of pulses by which the laser light is radiated onto a CLBO crystal is counted from the start of use of the driven cell, and the timing when a specified number of times is reached is detected based on the result of the counting. For example, the total number of pulses by which the laser light is radiated onto a CLBO crystal is 20 billions (20×109) at the maximum, and the specified number of pulses is 16 billions, which is 80% of 20 billions. (3) Detection Based on Intensity of Laser Light after Wavelength Conversion A first energy sensor that is not shown is provided downstream from the wavelength conversion box42to detect the timing when the pulse energy of the wavelength converted light is smaller than or equal to a threshold. The threshold is, for example, 80 nW. (4) Detection Based on Conversion Efficiency During Wavelength Conversion The first energy sensor, which is not shown, is provided downstream from the wavelength conversion box42, and a second energy sensor that is not shown is provided upstream therefrom. Let Eout be the output of the first energy sensor and Ein be the output of the second energy sensor, and the timing when conversion efficiency Eout/Ein during the wavelength conversion is smaller than or equal to a threshold is detected. For example, the threshold is 1% on the assumption that Eout is the output from the third CLBO crystal54and Ein is the input to the first CLBO crystal50. (5) Detection Based on the Number of Times of Movement of Light Incident Point The CLBO crystals are partially contaminated at the light incident point on the laser light incident surface. Therefore, when the contamination has progressed to some extent, the crystals are each moved by a 2-axis stage so that the light incident point moves. FIG.6shows the laser light incident surface of the second CLBO crystal52. InFIG.6, the laser light traveling direction is the direction Z, one direction perpendicular to the direction Z is the direction V, and the direction perpendicular to the directions V and Z is the direction H, as inFIG.1. First, the second CLBO crystal52is used with the laser light incident on a point P1. Thereafter, as the contamination at the point P1progresses, the second CLBO crystal52is moved in the direction H by the first HVθ stage66and used with the laser light incident on a point P2. Whenever the contamination at the light incident point progresses, the second CLBO crystal52is moved in the direction H or V to switch the light incident point to points P3, P4, . . . , PN-1, and PN. The timing when the number of times the light incident point is moved reaches a specified number of times is detected. Let N be the total number of light incident points, and the total movement number is (N−1), and the specified number of times is, for example, (N−2). The movement of the light incident point on the second CLBO crystal52has been described, and the same applies to the first CLBO crystal50, the third CLBO crystal54, the fourth CLBO crystal120, the fifth CLBO crystal122, and the sixth CLBO crystal124. For example, a two-axis (ZY-plane) stage that is not shown can be further provided between the movable section152and the first CLBO crystal cell74or between the movable section152and the rail150to move the light incident point on the first CLBO crystal50. In this case, let N be the total number of light incident points moved by the 2-axis stage, which is not shown, and the specified number of times may, for example, be (N−2). (6) Detection Based on Intensity of Laser Light Before Wavelength Conversion The first energy sensor, which is not shown, is provided downstream from the wavelength conversion box42, and the second energy sensor, which is not shown, is provided upstream therefrom. When the energy before the wavelength conversion is so controlled that the energy after the wavelength conversion remains constant, the energy before the wavelength conversion increases as the CLBO crystal deteriorates. Therefore, the timing when the energy before the wavelength conversion is greater than or equal to a threshold is detected. The threshold is, for example, 8 W for the energy of the pulsed laser light having the wavelength of about 515 nm inputted to the wavelength conversion box42. 4.3 Effects and Advantages As described above, the solid-state laser system1A allows the replacement of each of the crystals on a cell basis to be completed by simply moving the movable section of the stage, whereby the replacement period can be shortened. Furthermore, when the movable section of the stage is moved, the crystal preparation, such as dehydration, has already started, whereby the replacement period can be further shortened. Moreover, a crystal newly inserted into the optical path by the stage can be placed in roughly the same position in the optical path from which the crystal having been moved away, whereby the period for the adjustment of the phase matching angle can be shortened. 5. Second Embodiment 5.1 Configuration FIG.7schematically shows the configuration of a solid-state laser system1B according to a second embodiment. Differences from the solid-state laser system1A shown inFIG.3will be described. The solid-state laser system1B shown inFIG.7includes a seventh CLBO crystal cell200, an eighth CLBO crystal cell202, a fourth stage204, a third high-reflectance mirror240, and a fourth dichroic mirror242. The fourth stage204includes a rail206extending in the direction Y and a movable section208held by the rail206so as to be movable in the direction Y along the rail206. The seventh CLBO crystal cell200and the eighth CLBO crystal cell202are arranged in the direction Y and held by the movable section208. The fourth stage204includes an actuator that is not shown. The actuator, which is not shown, is connected to the stage controller112. The seventh CLBO crystal cell200includes a fourth container210, a third light incident window212, and a third light exit window214. The fourth container210is an example of the “first container” in the present disclosure. The third light incident window212is an example of the “first light incident window” in the present disclosure. The third light exit window214is an example of the “first light exit window” in the present disclosure. The fourth container210accommodates a plurality of CLBO crystals. The fourth container210accommodates three CLBO crystals arranged in series: a seventh CLBO crystal216; an eighth CLBO crystal218; and a ninth CLBO crystal220. The seventh CLBO crystal216is an example of the “first nonlinear crystal” in the present disclosure. Out of the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220arranged in series, the seventh CLBO crystal216, which is the first one, and the ninth CLBO crystal220, which is the third one, are each a wavelength converting crystal having a type-1 phase matching condition. On the other hand, the eighth CLBO crystal218, which is the second one, is a wavelength converting crystal having a type-2 phase matching condition. The seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220are each held by the first crystal holder90. The seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220are each provided with the first heater92. The third light incident window212, the seventh CLBO crystal216, the eighth CLBO crystal218, the ninth CLBO crystal220, and the third light exit window214are arranged in series in the direction X. The eighth CLBO crystal cell202includes a fifth container222, a fourth light incident window224, and a fourth light exit window226. The fifth container222is an example of the “second container” in the present disclosure. The fourth light incident window224is an example of the “second light incident window” in the present disclosure. The fourth light exit window226is an example of the “second light exit window” in the present disclosure. The fifth container222accommodates a plurality of CLBO crystals. The fifth container222accommodates three CLBO crystals arranged in series: a tenth CLBO crystal228; an eleventh CLBO crystal230; and a twelfth CLBO crystal232. The tenth CLBO crystal228is an example of the “second nonlinear crystal” in the present disclosure. The tenth CLBO crystal228is a crystal that generates light having the same wavelength as the light generated by the seventh CLBO crystal216. The eleventh CLBO crystal230is a crystal that generates light having the same wavelength as the light generated by the eighth CLBO crystal218. The twelfth CLBO crystal232is a crystal that generates light having the same wavelength as the light generated by the ninth CLBO crystal220. The tenth CLBO crystal228and the twelfth CLBO crystal232are each a wavelength converting crystal having the type-1 phase matching condition. On the other hand, the eleventh CLBO crystal230is a wavelength converting crystal having the type-2 phase matching condition. Instead, the seventh CLBO crystal216and the eighth CLBO crystal218may each be a wavelength converting crystal having the type-1 phase-matching condition, and the ninth CLBO crystal220may be a wavelength converting crystal having the type-2 phase-matching condition. In this case, the tenth CLBO crystal228and the eleventh CLBO crystal230are each a wavelength converting crystal having the type-1 phase-matching condition, and the twelfth CLBO crystal232is a wavelength converting crystal having the type-2 phase-matching condition. The tenth CLBO crystal228, the eleventh CLBO crystal230, and the twelfth CLBO crystal232are each held by the second crystal holder140. The second CLBO crystal holder140is an example of the “second crystal holder” in the present disclosure. The tenth CLBO crystal228, the eleventh CLBO crystal230, and the twelfth CLBO crystal232are each provided with the second heater142. The fourth light incident window224, the tenth CLBO crystal228, the eleventh CLBO crystal230, the twelfth CLBO crystal232, and the fourth light exit window226are arranged in series in the direction X. The third high-reflectance mirror240is so disposed as to reflect at high reflectance the second pulsed laser light outputted from the second solid-state laser apparatus12and incident via the second window46and cause the reflected light to be incident on the fourth dichroic mirror242. The fourth dichroic mirror242is coated with a film that transmits at high transmittance the pulsed laser light outputted from the first solid-state laser apparatus10, incident via the first window44, and having the wavelength of about 515 nm and reflects at high reflectance the second pulsed laser light having the wavelength of about 1553 nm. The fourth dichroic mirror242is so disposed that the pulsed laser light having the wavelength of about 515 nm and the second pulsed laser light are incident on the seventh CLBO crystal cell200or the eighth CLBO crystal cell202with the optical path axes of the two types of pulsed laser light aligned with each other. A collimator lens that is not shown but parallelizes the pulsed laser light may be disposed in the optical path between the first window44and the fourth dichroic mirror242. A beam expander (BEX) lens or a focusing lens either of which is not shown but adjusts the beam diameter of the pulsed laser light may be disposed in the optical path between the third high-reflectance mirror240and the fourth dichroic mirror242. The BEX lens may be formed of a pair of concave and convex lenses that are not shown. In the example shown inFIG.7, the seventh CLBO crystal cell200is placed in the optical path of the laser light, and the eighth CLBO crystal cell202is placed outside the optical path of the laser light.FIG.8shows the state in which the movable section208has been moved from the state shown inFIG.7. In the example shown inFIG.8, the seventh CLBO crystal cell200is placed outside the optical path of the laser light, and the eighth CLBO crystal cell202is placed in the optical path of the laser light. 5.2 Operation The operator causes the first crystal holders90in the seventh CLBO crystal cell200to hold the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220and stores the resultant units in the fourth container210in advance. Similarly, the operator causes the second crystal holders140in the eighth CLBO crystal cell202to hold the tenth CLBO crystal228, the eleventh CLBO crystal230, and the twelfth CLBO crystal232and stores the resultant units in the fifth container222. The temperature adjuster94controls the first heaters92for the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220to heat the CLBO crystals to 150° C. in the default step. Similarly, the temperature adjuster94controls the second heaters142for the tenth CLBO crystal228, the eleventh CLBO crystal230, and the twelfth CLBO crystal232to heat the CLBO crystals to 150° C. in the default step. The control section22subsequently purges the interior of the wavelength conversion box42with the N2gas for a default period at a default flow rate. The control section22further purges the interior of the fourth container210in the seventh CLBO crystal cell200and the interior of the fifth container222in the eighth CLBO crystal cell202with the Ar gas for a default period at a default flow rate. The stage controller112places the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220in the optical path of the laser light, as shown inFIG.7. The control section22causes the solid-state laser system1B to generate ultraviolet light in this state. That is, the control section22causes the pulsed laser light outputted by the first solid-state laser apparatus10and having the wavelength of about 515 nm to enter via the first window44and causes the second pulsed laser light outputted by the second solid-state laser apparatus12and having the wavelength of about 1553 nm to enter via the second window46. The pulsed laser light having the wavelength of about 515 nm and the second pulsed laser light having the wavelength of about 1553 nm thus enter the seventh CLBO crystal216via the fourth dichroic mirror242roughly at the same time along roughly the same optical path axis. The angle of incidence of the pulsed laser light having the wavelength of about 515 nm incident on the seventh CLBO crystal216is adjusted so as to satisfy the phase matching condition. As a result, the seventh CLBO crystal216generates the pulsed laser light having the wavelength of about 258 nm, which is the second harmonic of the pulsed laser light having the wavelength of about 515 nm. The pulsed laser light having the wavelength of about 258 nm and the pulsed laser light having the wavelength of about 1553 nm therefore exit from the seventh CLBO crystal216. The pulsed laser light having the wavelength of about 258 nm and the pulsed laser light having the wavelength of about 1553 nm enter the eighth CLBO crystal218roughly at the same time along roughly the same optical path axis. The angle of incidence of the pulsed laser light having the wavelength of about 258 nm and the angle of incidence of the pulsed laser light having the wavelength of about 1553 nm incident on the eighth CLBO crystal218are adjusted so as to satisfy the phase alignment condition. As a result, the eighth CLBO crystal218generates the pulsed laser light having the wavelength of about 221 nm, which corresponds to the sum frequency produced from the wavelength of the pulsed laser light having the wavelength of about 258 nm and the wavelength of the pulsed laser light having the wavelength of about 1553 nm. The pulsed laser light having the wavelength of about 221 nm, the pulsed laser light having the wavelength of about 258 nm, and the pulsed laser light having the wavelength of about 1553 nm therefore exit from the eighth CLBO crystal218. The pulsed laser light having the wavelength of about 221 nm, the pulsed laser light having the wavelength of about 258 nm, and the pulsed laser light having the wavelength of about 1553 nm enter the ninth CLBO crystal220. The angle of incidence of the pulsed laser light having the wavelength of about 221 nm and the angle of incidence of the pulsed laser light having the wavelength of about 1553 nm incident on the ninth CLBO crystal220are adjusted so as to satisfy the phase alignment condition. As a result, the ninth CLBO crystal220generates the pulsed laser light having the wavelength of about 193 nm, which corresponds to the sum frequency produced from the wavelength of the pulsed laser light having the wavelength of about 221 nm and the wavelength of the pulsed laser light having the wavelength of about 1553 nm. The pulsed laser light having the wavelength of about 193 nm is outputted from the wavelength conversion system14via the third light exit window214and the third window48. As described above, also while causing the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220in the seventh CLBO crystal cell200to each generate the ultraviolet light, the control section22keeps maintaining the temperature of the second heaters142in the eighth CLBO crystal cell202and the gas flow rate in the fifth container222. When any of the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220reaches the end of its life, the stage controller112controls the fourth stage204to move the movable section208so that the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220in the seventh CLBO crystal cell200move away from the optical path of the laser light. Furthermore, the stage controller112inserts the tenth CLBO crystal cell228, the eleventh CLBO crystal cell230, and the twelfth CLBO crystal cell232in the eighth CLBO crystal cell202into the optical path of the laser light. The wavelength conversion system14thus performs the wavelength conversion by using the tenth CLBO crystal228, the eleventh CLBO crystal230, and the twelfth CLBO crystal232in place of the seventh CLBO crystal216, the eighth CLBO crystal218, and the ninth CLBO crystal220. 5.3 Effects and Advantages As described above, the solid-state laser system1B provides the same effects and advantages as the first embodiment. Furthermore, since the optical paths are coupled to each other before inputted to the CLBO crystals, a plurality of CLBO crystals (three in the description) can be arranged in series in each of the CLBO crystal cell for the wavelength conversion and the CLBO crystal cell for backup, whereby the size of the wavelength conversion system14can be reduced. Moreover, since the plurality of CLBO crystals are disposed in a single CLBO crystal cell, the number of stages and tubes can be reduced, whereby the size of the entire apparatus can be reduced. Furthermore, since the plurality of CLBO crystals can be replaced by replacing the single CLBO crystal cell, the period required for maintenance can be shortened. 6. Method for Manufacturing Electronic Device FIG.9schematically shows an example of the configuration of an exposure apparatus302. The method for manufacturing electronic devices is achieved by the solid-state laser system1, an excimer amplifier300, and the exposure apparatus302. The excimer amplifier300is, for example, an ArF excimer laser apparatus that amplifies laser light. The solid-state laser system1and the excimer amplifier300form a hybrid laser apparatus. The excimer amplifier300amplifies the pulsed laser light outputted from the solid-state laser system1. The pulsed laser light amplified by the excimer amplifier300is inputted to the exposure apparatus302and used as exposure light. The exposure apparatus302includes an illumination optical system304and a projection optical system306. The illumination optical system304illuminates a reticle pattern on a reticle stage RT with the excimer laser light having entered the exposure apparatus302from the excimer amplifier300. The projection optical system306performs reduction projection of the laser light having passed through the reticle to bring the laser light into focus on a workpiece that is not shown but is placed on a workpiece table WT. The workpiece is a light sensitive substrate onto which a photoresist has been applied, such as a semiconductor wafer. The exposure apparatus302translates the reticle stage RT and the workpiece table WT in synchronization with each other to expose the workpiece to the laser light having reflected the reticle pattern. Semiconductor devices can be manufactured by transferring a device pattern onto the semiconductor wafer in the exposure step described above. The semiconductor devices are an example of the “electronic devices” in the present disclosure. The solid-state laser system1may be either of the solid-state laser systems1A and1B described in the embodiments. 7. Others The description above is intended to be illustrative and the present disclosure is not limited thereto. Therefore, it would be obvious to those skilled in the art that various modifications to the embodiments of the present disclosure would be possible without departing from the spirit and the scope of the appended claims. Further, it would be also obvious for those skilled in the art that embodiments of the present disclosure would be appropriately combined. The terms used throughout the present specification and the appended claims should be interpreted as non-limiting terms. For example, terms such as “comprise”, “include”, “have”, and “contain” should not be interpreted to be exclusive of other structural elements. Further, indefinite articles “a/an” described in the present specification and the appended claims should be interpreted to mean “at least one” or “one or more.” Further, “at least one of A, B, and C” should be interpreted to mean any of A, B, C, A+B, A+C, B+C, and A+B+C as well as to include combinations of the any thereof and any other than A, B, and C. | 64,884 |
11862932 | DETAILED DESCRIPTION While the present teachings are described in conjunction with various embodiments and examples, it is not intended that the present teachings be limited to such embodiments. On the contrary, the present teachings encompass various alternatives and equivalents, as will be appreciated by those of skill in the art. All statements herein reciting principles, aspects, and embodiments of this disclosure, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure. As used herein, the terms “first”, “second”, and so forth are not intended to imply sequential ordering, but rather are intended to distinguish one element from another, unless explicitly stated. Similarly, sequential ordering of method steps does not imply a sequential order of their execution, unless explicitly stated. InFIGS.1to7, similar reference numerals denote similar elements. A portable/wearable display often requires the functionality of variable focusing and/or redirection of light beams carrying color channels of a displayed image. Beam scanners based on tiltable mirrors and varifocal lenses may be used for these purposes. However, mirror-based beam scanners and varifocal lens assemblies tend to be relatively bulky and heavy, with limited possibilities of miniaturization of these devices. One approach to provide beam redirecting/scanning and/or refocusing is to direct wavelength-tuned light beams at wavelength-dispersing optical elements, such as diffraction gratings, diffractive lenses, diffractive reflectors, etc. Diffractive optical elements can be made very thin. For example, they may be manufactured as surface-relief features on other optical elements. Diffractive optical components may also be written in a thin photosensitive transparent substrate and/or formed in a liquid crystal layer, to name just a few techniques and methods. A plurality of collimated, wavelength-tunable light beams may be redirected by a diffraction grating depending the beams wavelengths. When the wavelengths of the beams are tuned, the beams themselves are angularly scanned by the diffraction grating. When the light beams are scanned across the entire field of view (FOV), an image in angular domain may be formed. At each moment of time, a direction of collimated light beams carrying red, green, and blue color channel corresponds to a pixel of an image being displayed. The wavelength of collimated light beams carrying color channels of pixels being displayed can be varied within certain limits to provide the desired beam redirecting and/or refocusing functionality by e.g. using corresponding diffractive components. Changing color coordinates of image pixels may be avoided or reduced by adjusting relative brightness of the light beams simultaneously with tuning the wavelength. The wavelength and output power of a light source for a scanning color-tuned display needs to be variable at a frequency of up to approximately 200 kHz, with the wavelength tuning range of about 10 nm. To provide high selectivity of tuning the beam parameters by wavelength, the light sources need to be highly monochromatic, the spectral linewidth no greater than 10 pm in some applications. Due to the spectral bandwidth limitation, a tunable laser source may be required for each one of red, green, and blue color channel. Visible laser sources satisfying the above stated requirements are not readily available, especially in the compact form required for wearable display devices. Such sources are, however, available in near infrared part of the spectrum, e.g. at optical telecommunications wavelengths. In accordance with this disclosure, nonlinear optical phenomenon of optical frequency mixing may be used to obtain visible light sources based on nonlinear optical conversion of light emitted by tunable laser sources emitting in invisible parts of optical spectrum such as infrared (IR) and ultraviolet (UV). In accordance with the present disclosure, there is provided a light source comprising a first laser for emitting light at a first optical frequency, a plurality of second lasers for emitting light at different second optical frequencies, and an optical frequency mixer coupled to the first laser and to the plurality of second lasers for nonlinear optical mixing of optical frequencies of the light emitted by the first laser and the light emitted by each one of the plurality of second lasers, to provide a plurality of output light beams at mixed optical frequencies. The first laser may be a tunable laser for emitting light at a tunable optical frequency, and each second laser of the plurality of second lasers may be a fixed laser for emitting light at a fixed optical frequency. The first laser may be a fixed laser for emitting light at a fixed optical frequency, and each second laser of the plurality of second lasers may be a tunable laser for emitting light at a tunable optical frequency. The first laser and each second laser of the plurality of second lasers may be tunable. A mixed optical frequency of each one of the plurality of output light beams may be a sum optical frequency of the first optical frequency and a particular one of the second optical frequencies. The plurality of output light beams may include a light beam at a red wavelength, a light beam at a green wavelength, and a light beam at a blue wavelength. The red, green, and blue wavelengths may be variable by tuning at least one of: the first laser; or a second laser of the plurality of the second lasers. In some embodiments, the optical frequency mixer includes an optical routing element coupled to a plurality of nonlinear optical elements. The optical routing element may be configured for coupling the light at the first optical frequency to each one of the plurality of nonlinear optical elements, and for coupling the light at each second optical frequency to a particular one of the plurality of nonlinear optical elements. The optical routing element may include a photonic integrated circuit (PIC). Each one of the plurality of nonlinear optical elements may include a quasi-phase-matched nonlinear optical element. The quasi-phase-matched nonlinear optical element may include e.g. a poled crystalline material. A poling period of the poled crystalline material is chirped, with the poling period varying by at least 0.1% and no more than 50% of a median value of the poling period. A plurality of electrodes may be disposed in proximity of the poled crystalline material for providing a stationary or dynamically variable electrical field gradient along the poled crystalline material for varying phase matching of the poled crystalline material by using an electro-optical effect. In accordance with the present disclosure, there is provided a tunable RGB light source comprising red, green, and blue light sources, each comprising a tunable laser and a nonlinear optical element coupled to that laser, and a controller operably coupled to the tunable lasers of the red, green, and blue light sources, for synchronous tuning of optical frequency of the tunable lasers. The nonlinear optical element of each one of the red, green, and blue light sources may include a frequency doubling nonlinear optical element. At least one of the red, green, or blue light sources may include a plurality of lasers for providing multiple output light beams at different wavelengths of a same color channel. Each one of the red, green, and blue light sources may further include a fixed laser for emitting light at a fixed optical frequency, and an optical combiner for optically coupling the fixed laser and the tunable laser to the nonlinear optical element. The nonlinear optical element may be configured for mixing optical frequencies of the fixed laser and the tunable laser. For example, the nonlinear optical element may be configured for providing an output light beam at a sum optical frequency of the fixed laser and the tunable laser. In accordance with the present disclosure, there is further provided a projector including any of the above light source(s) including a nonlinear optical element, which may be configured to double the tunable optical frequency. The light source may further include a fixed laser for emitting light at a fixed optical frequency. The fixed laser may be optically coupled to the nonlinear optical element. The nonlinear optical element may be configured to produce the first beam at a sum frequency of the fixed laser and the tunable laser. The light source may include a plurality of lasers coupled to nonlinear optical elements for providing a beam of visible light including the first beam, at a tunable optical frequency for each of red, green, and blue color channels. Referring now toFIG.1, a light source100includes a first laser101for emitting light111at a first optical frequency. A plurality102of second lasers, in this example a red color channel laser102R, a green color channel laser102G, and a blue color channel laser102B, are provided for emitting light112R,112G, and112B respectively at different second optical frequencies. An optical frequency mixer104is coupled to the first laser101and to the plurality102of second lasers102R,102G, and102B for nonlinear optical mixing of optical frequencies of the light111emitted by the first laser101and the light112R,112G, and112B, emitted by each one of the plurality of second lasers102R,102G, and102B respectively. As a result of the nonlinear optical frequency mixing, output light beams are generated at mixed optical frequencies, including red122R, green122G, and blue122B output light beams. The optical frequency mixer104provides nonlinear optical interaction of the light111,112R,112G, and112B emitted by the first101and second101,102R,102G, and102B lasers. The nonlinear optical interaction may include sum frequency generation, difference frequency generation, harmonic(s) generation, etc. A controller106may be operably coupled to the first laser101and to the plurality102of second lasers102R,102G, and102B for controlling optical power level and/or emission wavelength of these lasers, which impact the optical power levels and wavelengths/optical frequencies of the red122R, green122G, and blue122B output light beams. Specific embodiments of light sources and non-limiting examples of optical frequency mixing configurations will now be provided. Referring toFIG.2, a light source200is an embodiment of the light source100ofFIG.1. The light source200ofFIG.2includes a tunable laser201emitting light211at a tunable optical frequency, and a plurality of fixed lasers, in this example a red color channel fixed laser202R, a green color channel fixed laser202G, and a blue color channel fixed laser202B, emitting light212R,212G, and212B, respectively at different fixed optical frequencies. In the specific non-limiting example shown, all four lasers are red or infrared lasers: the tunable laser201is tunable around a wavelength of 1550 nm, the red color channel fixed laser202R emits light at a wavelength of 1033 nm, the green color channel fixed laser202G emits light at a wavelength of 780 nm, and the blue color channel fixed laser202B emits light at a wavelength of 655 nm. An optical frequency mixer204of the light source200includes a photonic integrated circuit (PIC)208coupled to a plurality of nonlinear optical elements210R,210G, and210B. The PIC208is configured for coupling the light211at the tunable optical frequency to each one of the plurality of nonlinear optical elements210R,210G, and210B, and for coupling the light212R,212G, and212B at each fixed optical frequency to one of the nonlinear optical elements210R,210G, and210B, respectively. Each single light beam is coupled to a particular one of the plurality of nonlinear optical elements210R,210G, and210B. A combination of optical splitters and combiners, e.g. Y-splitters/combiners, directional splitters/combiners, or another optical routing element or elements, may be used instead of the PIC208to provide the same functionality. Each nonlinear optical element210R,210G, and210B may include a quasi phase-matched nonlinear element, such as a poled lithium niobate (PPLN) crystal, or a thin film lithium niobate waveguide structure, for example. The quasi phase-matched nonlinear element may form a waveguide configured for co-propagating the light211at the tunable optical frequency together with the light212R,212G, or212B at fixed optical frequencies. In the embodiment shown inFIG.2, mixed optical frequencies of each one of red, green, and blue output light beams222R,222G, and222B are sum frequencies of the first (tunable) optical frequency and a particular one of the second (fixed) optical frequencies of the red color channel fixed laser202R, a green color channel fixed laser202G, and a blue color channel fixed laser202B. As the optical frequency of the tunable laser201is swept between a low value and a high value, the optical frequencies and wavelengths of the red, green, and blue output light beams222R,222G, and222B are swept simultaneously between their corresponding low and high values. To provide a reasonable nonlinear conversion efficiency at each optical frequency of the light211at the tunable optical frequency, the poling period of the quasi phase-matched nonlinear element may be chirped, e.g. with the poling period varying by at least 0.1% and no more than 50% of a median value, for example. Herein and throughout the rest of the specification, the term “red light beam” or “red wavelength” denotes a wavelength range of monochromatic light that appears red to the viewer, e.g. between 600 nm and 750 nm; the term “green light beam” or “green wavelength” denotes a wavelength range of monochromatic light that appears green to the viewer, e.g. between 500 nm and 600 nm; and the term “blue light beam” or “blue wavelength” denotes a wavelength range of monochromatic light that appears blue to the viewer, e.g. between 350 nm and 500 nm. Referring now toFIG.3, a light source300is an embodiment of the light source100ofFIG.1. In contradistinction to the light source200ofFIG.2, the light source300ofFIG.3includes a fixed laser301for emitting light311at a fixed optical frequency, and a plurality of tunable lasers, in this example a red color channel tunable laser302R, a green color channel tunable laser302G, and a blue color channel tunable laser302B, for emitting light312R,312G, and312B, respectively at different tunable wavelengths/optical frequencies. In this particular example, all four lasers are infrared lasers: the fixed laser301emits light at a wavelength of 990 nm, the red channel tunable laser302R emits light at a wavelength of 1650 nm, the green channel fixed laser302G emits light at a wavelength of 1100 nm, and the blue channel fixed laser302B emits light at a wavelength of 860 nm. An optical frequency mixer304of the light source300is similar to the optical frequency mixer204of the light source200ofFIG.2. The optical frequency mixer304ofFIG.3may include a PIC308or another suitable optical routing element coupled to a plurality of nonlinear optical elements310R,310G, and310B such as quasi phase-matched crystals, for example lithium niobate (LiNbO3) quasi phase-matched poled crystal waveguide. The PIC308is configured for coupling the light311at the fixed optical frequency to each one of the plurality of nonlinear optical elements310R,310G, and310B, and for coupling the light312R,312G, and312B at each tunable optical frequency to the nonlinear optical elements310R,310G, and310B, respectively. Each single light beam at a tunable optical frequency is coupled to a particular one of the plurality of nonlinear optical elements310R,310G, and310B. Mixed optical frequencies of red, green, and blue output light beams322R,322G, and322B is a sum frequency of the first (fixed) optical frequency and a particular one of the second (tunable) optical frequencies of the red color channel tunable laser302R, a green color channel tunable laser302G, and a blue color channel tunable laser302B. To provide a reasonable nonlinear conversion efficiency at each optical frequency of the light211at the tunable optical frequency, the poling periods of the poled crystalline materials may be chirped as noted above with reference toFIG.2. One advantage of the light source300ofFIG.3as compared with the light source200ofFIG.2is that wavelengths of the red, green, and blue output light beams322R,322G, and322B are individually tunable. Turning toFIG.4, a light source400is an embodiment of the light source100ofFIG.1. All laser sources of the light source400ofFIG.4are tunable in wavelength/optical frequency, including a first laser401tunable around 1550 nm, and a plurality of second lasers, including a red channel laser402R tunable around 1033 nm, a green channel laser402G tunable around 780 nm, and a blue channel laser402B tunable around 655 nm. An optical frequency mixer404is similar in construction and operation to the optical frequency mixer304ofFIG.3and the optical frequency mixer204ofFIG.2. Briefly, the first laser401emits light411at first optical frequency, and a PLC408distributes the light411between nonlinear optical elements410R,410G, and410B. Light412R emitted by the red color channel laser402R is coupled to the red color channel nonlinear optical element410R, light412G emitted by the green color channel laser402G is coupled to the green color channel nonlinear optical element410G, and light412B emitted by the blue color channel laser402B is coupled to the blue color channel nonlinear optical element410B. Red422R, green422G, and blur422B output light beams are obtain by sum frequency generation in respective nonlinear optical elements410R,410G, and410B. One advantage of the light source400is an increased range of tuning of the output wavelengths, since all the lasers in this light source are independently tunable thereby extending the tunability range at the sum optical frequency. Referring toFIG.5A, a light source500A is similar in construction and operation to previously considered light sources100,200,300, and400. The light source500A ofFIG.5Aincludes a PLC508coupled to a nonlinear optical element with phase matching, e.g. a poled crystalline material510, for mixing optical frequencies of light propagating in the poled crystalline material510. By way of non-limiting examples, the poled crystalline material510may include a bulk crystal, e.g. a lithium niobate bulk crystal cut into a desired shape, or a thin crystal layer on a dielectric substrate and subsequently fabricated into a waveguide. A heater511may be thermally coupled to the poled crystalline material510for providing a temperature gradient along the poled crystalline material510. The thermal gradient creates a refractive index gradient due to a thermo-optic effect, and also may cause the poled crystalline material510to expand in a spatially varying manner, which causes the refractive index modulation strength and effective poling period of the poled crystalline material510to spatially vary. The degree of variation may be tuned by changing the amount of heat applied by the heater511to the poled crystalline material510. Referring now toFIG.5B, a light source500B is similar to the light source500A ofFIG.5A, and includes similar elements. The light source500B ofFIG.5Bincludes a plurality of electrodes513instead of, or in addition to, the heater511. The plurality of electrodes513may be configured for providing a stationary or dynamically varying electrical field gradient along the poled crystalline material510. For example, in the embodiment shown inFIG.5B, the plurality of electrodes513includes a common electrode513C and segmented opposite electrodes513S. In operation, the electric field applied to the poled crystalline material510causes its refractive index to change due to an electro-optical effect. An electric field gradient applied to the poled crystalline material510causes the refractive index modulation strength of the poled crystalline material to spatially vary. The degree of variation may be tuned by changing the electric field gradient by applying voltages of different amplitudes to the plurality of electrodes513. Turning toFIG.6, a tunable RGB light source600is an embodiment of the light source100ofFIG.1. The tunable RGB light source600ofFIG.6includes red color channel632R, green color channel632G, and blue color channel632B light sources. Each light source632R,632G, and632B includes a tunable laser coupled to a nonlinear optical element. The tunable lasers are all infrared lasers in this example: the red light source632R includes a laser602R tunable around 1260 nm, coupled to a nonlinear optical element610R; the green light source632G includes a laser602G tunable around 1060 nm, coupled to a nonlinear optical element610G; and the blue light source632B includes a laser602B tunable around 940 nm, and coupled to a nonlinear optical element610B. A controller606may be operably coupled to the tunable lasers602R,602G, and602B of the red632R, green632G, and blue632B light sources, respectively, for synchronous or separate tuning optical frequencies of the tunable lasers602R,602G, and602B. In the embodiment shown inFIG.6, the nonlinear optical elements610R,610G, and610B are frequency doubling crystals, providing output red622R, green622G, and blue622B output beams at a higher optical frequency via second harmonic generation (SHG). The frequency doubling crystals may include, for example, poled frequency doubling crystal waveguides, which may be temperature controlled and/or electric-field tuned as explained above with reference toFIGS.5A and5B. Referring now toFIG.7, a tunable RGB light source700is an embodiment of the light source100ofFIG.1. The tunable RGB light source700ofFIG.7includes red732R, green732G, and blue732B light sources coupled to an optional controller706. Each light source includes a nonlinear optical element coupled to a fixed laser and a tunable laser by an optical combiner. Specifically, the red light source732R includes a fixed laser701R and a tunable (also termed swept) laser702R coupled by an optical combiner708R to a nonlinear optical element710R; the green light source732G includes a fixed laser701G and a tunable laser702G coupled by an optical combiner708G to a nonlinear optical element710G; and the blue light source732B includes a fixed laser701B and a tunable laser702B coupled by an optical combiner708B to a nonlinear optical element710B. The nonlinear optical elements710R,710G, and710B may each include, for example, a nonlinear optical crystal, such as a poled crystal or crystal waveguide, configured for mixing optical frequencies of the respective fixed and tunable lasers. The poling period may be chirped to provide the required conversion efficiency within the band of wavelength or optical frequency tuning. In the illustrated embodiment, the nonlinear optical elements710R,710G, and710B are configured for providing an output light beam at a sum optical frequency of the respective fixed and tunable lasers, providing red722R, green722G, and blue722B output light beams respectively. The controller706may be coupled to each tunable laser702R,702G,702B, and to each fixed laser701R,701G,701B, for controlling the laser output power and/or emission wavelength, as applicable, for provide the required power level and emission wavelengths of the red722R, green722G, and blue722B output light beams generated by SFG. A wavelength of an output light beam generated by SFG of a fixed and tunable laser can be calculated from the following relationship: cλVisible=cλFixed+cλSwept(1) where λVisibleis a wavelength of an output light beam, λFixedis an emission wavelength of the fixed-wavelength laser, λSweptis an emission wavelength of a wavelength-tunable laser, and c is speed of light. It follows from (1) that as the wavelength of the tunable laser is swept, the wavelength of the visible output light beam is swept at a slower rate.FIGS.8A and8Bshow examples of nanometer per nanometer sweeping rate for blue and red output light beams, respectively. It is seen that, for example for blue light (FIG.8A), the output beam wavelength changes at approximately 0.12 nm per 1 nm wavelength change of the swept infrared light beam at around 1300 nm. For red light (FIG.8B), the output beam wavelength changes at a faster rate, approximately 0.23 nm per 1 nm wavelength change of the swept infrared light beam at around 1300 nm. Sweeping wavelengths of both infrared beams participating in SFG may further increase the attainable total wavelength tuning range. For SHG, the relationship is approximately 0.5 nm of the wavelength tuning of the visible light beam per 1 nm of the wavelength tuning of the infrared (fundamental) light beam. The relationship may be not exactly 0.5 nm per 1 nm due to material dispersion. Referring now toFIG.9A, a projector900A includes a wavelength-tunable visible light source902, such as, for example, any of the light sources100-700ofFIGS.1-7considered above. The wavelength-tunable visible light source902is optically coupled to a wavelength-dispersive element, in this case a diffractive lens904A. Focal length of a diffractive lens or mirror depends strongly on the wavelength of impinging light. In operation, the diffractive lens904A receives an output light beam922emitted by the wavelength-tunable visible light source902and changes a divergence of the output light beam922depending on the wavelength or optical frequency of the output light beam922, which is controlled by the wavelength-tunable visible light source902. Depending on the wavelength of the output light beam922, the output light beam922may be focused at any one of locations941,942, or943. The projector900A ofFIG.9Ais an example of an optical system where tuning a beam parameter, in this case the beam divergence, is achieved by tuning the optical frequency or wavelength of an output light beam. The spacing between the locations941,942, and943is exaggerated for clarity. Turning toFIG.9B, a projector900B includes the wavelength-tunable visible light source902, e.g. any of the light sources100-700ofFIGS.1-7, optically coupled to a wavelength-dispersive element, specifically a diffraction grating904B. In operation, the diffraction grating904B receives the output light beam922emitted by the light source902and changes a direction of propagation of the output light beam922depending on the optical frequency or wavelength of the output light beam922. Depending on the wavelength of the output light beam922, the output light beam922may be directed at951(solid lines),952(dashed lines), or953(dotted lines). When the wavelength of the output light beam922is continuously tuned, the direction of the output light beam922is continuously swept. The projector900B ofFIG.9Bis an example of an optical system where tuning the optical frequency or wavelength of an output light beam results enables angular scanning of an output beam. An image in angular domain may be rastered this way by modulating the beam's intensity. Light beams carrying different color channels such as red, green, and blue color channels can be swept simultaneously by simultaneously sweeping the output beams wavelengths, rendering a color image. More generally, the light source902may be optically coupled to any element having an optical property depending on optical frequency or wavelength of output light beam922. The tunability of the light source902will result in the optical property of a light beam downstream of the element being tuned. The optical property may include divergence, direction, power level, optical phase, etc. When the light beams carrying individual color channels are swept in wavelength or optical frequency, their color changes slightly. This effect needs to be taken into account when rendering a color image. To keep the color coordinate at a required value, the optical power levels of the red, green, and blue color channel light beams may need to be adjusted depending on the current wavelengths of the output color beams. FIG.10illustrates a color space of a wavelength-scanned display in CIE x, y color coordinates. Points1001R,1002R, and1003R denote color coordinates of a red channel light beam of the wavelength-scanned display as the wavelength of the red channel light beam is swept. Similarly, points1001G,1002G, and1003G denote color coordinates of a green channel light beam of the wavelength-scanned display as the wavelength of the green channel light beam is swept; and points1001B,1002B, and1003B denote color coordinates of a blue channel light beam of the wavelength-scanned display as the wavelength of the blue channel light beam is swept. Triangles1011,1012, and1013denote color space that is available by varying relative optical power of red, green, and blue light beams at the wavelengths corresponding to points1001R,1001G,1001B;1002R,1002G,1002B; and1003R,1003G,1003B, respectively. A common area of the triangles1011,1012, and1013, represented by a triangle1050(thick dashed lines), approximately denotes the sRGB color space and is a subset of the total color space available for a scanning color display where red, green, and blue light beams are scanned by tuning their respective wavelengths. Turning toFIG.11, an augmented reality (AR) near-eye display1100is an example optical system where light sources or projectors of this disclosure may be used. The AR near-eye display1100includes a frame1101having a form factor of a pair of eyeglasses. The frame1101supports, for each eye: a projector1108, e.g. any projector described herein, a pupil-replicating waveguide1110optically coupled to the projector1108, an eye-tracking camera1104, and a plurality of illuminators1106. The illuminators1106may be spread over the pupil-replicating waveguide1110for illuminating an eyebox1112. The projector1108provides a fan of light beams carrying an image in angular domain to be projected into a user's eye. The pupil-replicating waveguide1110receives the fan of light beams and provides multiple laterally offset parallel copies of each beam of the fan of light beams, thereby extending the projected image over the eyebox1112. Any of the light sources disclosed herein may be used in the projector1108. For AR applications, the pupil-replicating waveguide1110can be transparent or translucent to enable the user to view the outside world together with the images projected into each eye and superimposed with the outside world view. The images projected into each eye may include objects disposed with a simulated parallax, so as to appear immersed into the real world view. The purpose of the eye-tracking cameras1104is to determine position and/or orientation of both eyes of the user. Once the position and orientation of the user's eyes are known, a gaze convergence distance and direction may be determined. The imagery displayed by the projectors1108may be adjusted dynamically to account for the user's gaze, for a better fidelity of immersion of the user into the displayed augmented reality scenery, and/or to provide specific functions of interaction with the augmented reality. In operation, the illuminators1106illuminate the eyes at the corresponding eyeboxes1112, to enable the eye-tracking cameras to obtain the images of the eyes, as well as to provide reference reflections i.e. glints. The glints may function as reference points in the captured eye image, facilitating the eye gazing direction determination by determining position of the eye pupil images relative to the glints images. To avoid distracting the user with illuminating light, the latter may be made invisible to the user. For example, infrared light may be used to illuminate the eyeboxes1112. Embodiments of the present disclosure may include, or be implemented in conjunction with, an artificial reality system. An artificial reality system adjusts sensory information about outside world obtained through the senses such as visual information, audio, touch (somatosensation) information, acceleration, balance, etc., in some manner before presentation to a user. By way of non-limiting examples, artificial reality may include virtual reality (VR), augmented reality (AR), mixed reality (MR), hybrid reality, or some combination and/or derivatives thereof. Artificial reality content may include entirely generated content or generated content combined with captured (e.g., real-world) content. The artificial reality content may include video, audio, somatic or haptic feedback, or some combination thereof. Any of this content may be presented in a single channel or in multiple channels, such as in a stereo video that produces a three-dimensional effect to the viewer. Furthermore, in some embodiments, artificial reality may also be associated with applications, products, accessories, services, or some combination thereof, that are used to, for example, create content in artificial reality and/or are otherwise used in (e.g., perform activities in) artificial reality. The artificial reality system that provides the artificial reality content may be implemented on various platforms, including a wearable display such as an HMD connected to a host computer system, a standalone HMD, a near-eye display having a form factor of eyeglasses, a mobile device or computing system, or any other hardware platform capable of providing artificial reality content to one or more viewers. The present disclosure is not to be limited in scope by the specific embodiments described herein. Indeed, other various embodiments and modifications, in addition to those described herein, will be apparent to those of ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Further, although the present disclosure has been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize that its usefulness is not limited thereto and that the present disclosure may be beneficially implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be construed in view of the full breadth and spirit of the present disclosure as described herein. | 34,731 |
11862933 | DETAILED DESCRIPTION The present disclosure provides a method of forming an electrical metal contact within a semiconductor layer stack of a vertical cavity surface emitting laser which overcomes at least a part of the above-mentioned disadvantages. The present disclosure further provides a method of fabricating a vertical cavity surface emitting laser which uses such a method of forming an electrical metal contact. According to a first aspect, a method of forming an electrical metal contact within a semiconductor layer stack of a vertical cavity surface emitting laser is provided, the method comprising:forming a contact hole into the semiconductor layer stack, the contact hole having a bottom and the side wall extending from the bottom,providing a photoresist mask inside the contact hole, the photoresist mask covering the side wall of the contact hole, the photoresist mask having an opening extending to the bottom of the contact hole,wet-chemical isotropic etching the bottom of the contact hole,depositing a metal on the bottom of the contact hole, andremoving the photoresist mask so that the metal on the bottom of the contact hole is left as the electrical metal contact. The method uses a photoresist mask which advantageously protects the sensitive semiconductor layers exposed at the side wall of the contact hole in the subsequent etching process and may also be used in a later lift-off process. The photoresist mask is also suitable to provide protection of the side walls when oxide is to be removed before metal deposition. The method comprises wet-chemical isotropic etching of the semiconductor material at the bottom of the contact hole while the side wall of the contact hole is masked by the photoresist mask. The wet-chemical isotropic etching may be different from the etching process used for making the contact hole in the semiconductor layer stack. The wet-chemical isotropic etching of the bottom of the contact hole inherently generates an undercut below the lower end of the photoresist mask and smoothens the initially sharper transition from the bottom of the contact hole to the side wall of the contact hole. The smoother transition from the side wall to the bottom of the contact hole advantageously enables a self-aligning of the metal contact when the metal is deposited on the bottom of the contact hole. After the wet-chemical etching, the side wall at the transition to the bottom may be less steep than in an outer region of the contact hole. The self-aligned metal contact deposition method may produce a step-like side wall profile of the contact hole, consisting of a steeper portion and a flatter portion of the side wall. The steeper side wall portion is situated at the outer hole area, and an e.g. 40° to 50° degree profile is produced at the transition to the bottom of the contact hole. Wet-chemical etching may be performed using a combination of an oxidant, with comparable oxidation rates of the different semiconductor materials, with an acid. The different semiconductor materials may be AlGaAs and GaAs. The metal deposited on the bottom of the contact hole may be a metal stack comprising different metal materials, e.g. Ti, Ag, Pt, Au. After metal deposition, the lift-off process leaves a metal contact on the bottom of the contact hole, which is self-aligned due to the wet-chemical etching process. Preferably, the photoresist mask comprises a positive-tone photoresist. A positive photoresist has some advantages over a negative photoresist. A positive photoresist can be structured more accurate without the need to form sufficient undercut. This in turn provides an advantage in terms of smaller chip size and layout dimensions. Negative-tone photoresists which are chemically stabilized need strong mechanical treatment, e.g. megasonic treatment, to provide a sufficient lift-off. Furthermore, high layout topologies degrade the megasonic penetration inside the contact hole and prohibit the lift-off possibility. Positive-tone photoresist has the advantage that it can be chemically dissolved and can thus provide 100% lift-off rate inside the contact hole. Thus, removing the photoresist mask after metal deposition preferentially comprises a chemically induced lifting off of the photoresist mask, if the photoresist is a positive resist. Nevertheless, a negative photoresist may be used in the method as well. In addition, the photoresist thickness is not constrained by the metal thickness of the deposited metal. Due to good solubility and photoresist removal rates, photoresist thicknesses below the metal thickness can be used. The process sequence of the method therefore supports thick contact metal layers for reduced thermal resistance. Providing the photoresist mask in the contact hole may comprise lithographically structuring the photoresist mask to provide the opening through the photoresist mask to the bottom of the contact hole. The method may further comprise, prior to depositing the metal, removing oxide from the bottom of the contact hole. After the chemical etching, the surface of the contact hole at the bottom may be left oxidized. In order to form a clean interface for the metal to be deposited, oxide should be removed. Preferably, oxide is removed by in-situ Ar-sputtering before metal deposition. The method may further comprise, after lift-off of the photoresist mask, applying an electrical passivation layer on the side wall of the contact hole. The smooth transition from the side wall to the bottom of the contact hole due to the isotropic wet-chemical etching process supports sufficient coverage of an electrical passivation layer and further metallization processes on top of the electrical contact. The semiconductor layer stack may comprise a distributed Bragg reflector, and the contact hole may be formed into the distributed Bragg reflector. The semiconductor layer stack may be arranged on a substrate, and the contact hole may be formed into the semiconductor layer stack down to a semiconductor layer of the layer stack above the substrate, or the contact hole may be formed into the semiconductor layer stack down to the substrate. In each case, the contact hole may be formed with a depth, from an upper end of the contact hole to the bottom, of more than 10 μm. The contact hole may be formed using etching, in particular non-selective etching. The method of forming an electrical contact in a layer stack of a vertical cavity surface emitting laser results in a defined positioning of the electrical contact inside the epitaxial layer stack and produces no harm to the etched epitaxial structure. Native oxide films in the contact hole may be removed. A lift-off procedure may be used using a positive-tone photoresist. The resulting electrical metal contact is self-aligned in the contact hole. The electrical metal contact may be thus formed inside a topological high contact hole with a depth up to 15 μm with shallow side walls at an angle of about 40°-45° at the transition from the outer region of the contact hole to the bottom thereof. A single lithographic mask, in particular a positive-tone photoresist mask, may be used. According to a second aspect, a method of producing a vertical cavity surface emitting laser is provided, the method comprising:providing a semiconductor layer stack, andforming an electrical metal contact within the semiconductor layer stack using a method according to the first aspect. The method according to the second aspect may have the same embodiments as described with respect to the method according to the first aspect. The method according to the second aspect may have the same advantages and embodiments as the method according to the first aspect. FIG.1shows a layer stack10in a stage of a method of fabricating a vertical cavity surface emitting laser (VCSEL). The method includes a method of forming an electrical metal contact within the semiconductor layer stack10described herein. In the method of fabricating a VCSEL, the layer stack10may be epitaxially grown on a substrate12, e.g. a GaAs substrate. On the substrate12, an arrangement of semiconductor layers14is epitaxially grown. The layers14may form a first (lower) distributed Bragg reflector (DBR). The layers14forming the DBR may have alternating high and low refractive indices. For example, the layers14may comprise alternating AlGaAs/GaAs layers. The layers14may be n-doped. An active region16for laser light emission is arranged on the layers14forming the lower DBR. The active region16may comprise one or more quantum wells, e.g. comprising GaAs. An arrangement of further layers18is grown on the active region16. The layers18may form a second (upper) DBR. The layers18may have alternating high and low refractive indices. The layers18forming the second DBR may comprise AlGaAs/GaAs layers. The second DBR formed by the layers18may be p-doped. The layers14and the layers18thus form a p-n-junction in the layer stack. In case the VCSEL to be produced is a top emitter, the reflectivity of the second DBR is lower than the reflectivity of the first DBR. In case the VCSEL to be produced is a bottom emitter, the reflectivity of the first DBR is lower than the reflectivity of the second DBR. Initially, the layer stack10may be formed on the substrate with an even surface topology (not shown). After the layer stack10has been grown, the layer stack10may be etched to form a mesa20and to separate the n-type doped and p-type doped layers14and18. An oxide aperture19may be formed after the mesa20is created. FIG.1shows with broken lines that the etching process for forming the mesa structure can produce a plurality of mesa structures20,20′, . . . , e.g. to produce a VCSEL array on a single wafer. To connect the p-n-junction, metal contacts need to be formed in the p-type doped part of the p-n-junction and the n-type doped part of the p-n-junction. For the p-side, a ring electrode22may be formed on top of the layer stack10. An n-side electrical metal contact could be formed on the underside of the substrate12. It may be however advantageous to form the n-side electrical metal contact on the epitaxy side of the layer stack10to keep the underside of the substrate free for further processing. Forming both, the p-side and n-side contacts, on the epitaxy side of the layer stack requires to etch a contact hole24into the layer stack10. In the present embodiment, the contact hole24is formed in the first DBR (layers14). Thus, as can be seen inFIG.1, a high aspect ratio etching of the epitaxial layers of the layer stack10is required. Etching the layer stack10to form the mesa20and/or to form the contact hole24may be performed by non-selective etching. The contact hole24may be etched with an etching depth in a range of more than 10 μm, e.g. the etching depth may be as high as 13-15 μm.FIG.2shows the contact hole24including the side wall28and the bottom26in a top plan view. The side wall28may have a tapering shape seen from the top to the bottom26of the contact hole24as a result of the etching process for forming the contact hole24. The contact hole24comprises a bottom26and a side wall28extending from the bottom26. An electrical metal contact is to be formed on the bottom26of the contact hole24. Due to the etching process for forming the contact hole24, the side wall28of the contact hole24at which the layers14are exposed due to the etching process, may be mechanically unstable and sensitive to the processing steps for forming the electrical metal contact on the bottom26of the contact hole24. With reference toFIGS.3to8, a method of forming an electrical metal contact in the layer stack10on the bottom26of the contact hole24will be described. InFIGS.3to8, the layer structure of the layers14and the substrate12are not shown. FIG.3shows a portion of the layer stack10in the region of the contact hole24only. The contact hole24with the bottom24and the side wall28may have been formed by a non-selective etching process. Etching the contact hole24may be performed such that the contact hole24is formed into the semiconductor layer stack10down to the substrate12or down to a semiconductor layer of the layer stack10, e.g. down to one of the lower layers of the layers14of the lower DBR. When the contact hole24has been formed, a photoresist mask30is provided inside the contact hole24as shown inFIG.4. The photoresist mask30especially comprises a positive-tone photoresist. A positive-tone photoresist can be lithographically structured in a very accurate manner. In the method of forming an electrical contact on the bottom26of the contact hole24, the photoresist mask30may be structured, in particular lithographically structured, to provide an opening32through the photoresist mask30down to the bottom26of the contact hole24. The photoresist mask30covers the side wall28of the contact hole completely in the processing stage inFIG.4. Next, an isotropic wet-chemical etching of the bottom26of the contact hole24is performed as shown inFIG.5. The isotropic wet-chemical etching of the semiconductor material of the layers14in combination with the photoresist mask30inherently generates an undercut34below the lower end of the photoresist mask30. The isotropic wet-chemical etching may be performed by using an oxidant, e.g. H2O2with comparable oxidation rates of e.g. AlGaAs and GaAs in combination with an acid (e.g. H2SO4; concentration of 1:40) which may provide isotropic etching rates of around 1 μm/min. The wet-chemical etching smoothens the transition from the bottom26of the contact hole24to the side wall28, i.e. a side wall portion34of the side wall close to the bottom is not as steep as the side wall28in an outer region of the contact hole24. The flatter side wall portion34is generated by the process of isotropic wet-chemical etching of the bottom26. Thus, the side wall28may obtain a step-like side wall profile in the region of the transition of the side wall28to the bottom26, with a steeper slope in an outer region of the contact hole24and a flatter slope close to the bottom of the contact hole24. The isotropic wet-chemical etching process may result in an oxidized surface of the bottom26of the contact hole24. For the subsequent metal deposition, the surface of the bottom26should be cleaned from any oxides. Removing the oxides from the bottom26of the contact hole24is preferentially performed by argon (Ar)-ion in-situ sputtering as indicated by arrows36inFIG.6. The photoresist mask30protects the sensitive side wall28of the contact hole24in this cleaning process. After the semiconductor surface of the bottom26(and the side wall portions34) have been cleaned from the oxide, a metal is deposited on the bottom26of the contact hole24.FIG.7shows the processing stage, where one or more metals38have been deposited. The metal or metals deposited cover the photoresist mask30as well as the bottom26of the contact hole24. An advantage of the undercut below the photoresist mask30produced by the isotropic wet-chemical etching process (FIG.5) is that the metal film during deposition easily tears off at the lower edge of the photoresist mask30. The metal layer38bon the bottom26of the contact hole24self-aligns on the bottom26in the correct position. The positive-tone photoresist can be chemically dissolved and thus can provide 100% lift-off rate inside the contact hole. Therefore, the photoresist mask30is also used as a lift-off mask in the metal-stack evaporation process of depositing a metal on the bottom26of the contact hole24. After chemically induced lift-off processing by simply dissolving the photoresist mask30, a metal contact40is left on the bottom26of the contact hole24which is self-aligned in the contact hole24. The sensitive side wall28has not been affected by virtue of the processing sequence described above. In further steps, an electrical passivation layer may be deposited on the side wall28of the contact hole24, and further metallizations may be applied on top of the metal contact40up to the upper end of the contact hole24. The smooth transition from the side wall28to the bottom26of the contact hole24, i.e. the flatter side wall portions34support sufficient coverage of the electrical passivation layer and further metallization. The smooth transition from the side wall28in the outer area of the contact hole24to the bottom26of the contact hole24is an advantageous effect of the isotropic wet-chemical etching of the semiconductor material in the area of the bottom26of the contact hole24. In the final VCSEL, the self-aligned metal contact deposition method as described above is visible by a side wall profile as shown inFIG.8, or as shown inFIGS.9to11. The actual shape of the lower portion of the contact hole24, in particular at the transition from the side wall28in the outer area of the contact hole24to the bottom26of the contact hole24may depend on the etching rate, etching angle and the substances used in the isotropic wet-chemical etching process.FIG.9shows a rounded transition42from the side wall28to the bottom26.FIG.10shows a stepped transition44.FIG.11shows a stepped transition with a larger rounded area. The bottom26may have a round shape in each case or may be straight. In contrast,FIG.12shows an electrical contact50formed in the contact hole24by a conventional method, where the side wall28does not exhibit a side wall portion or transition like side wall portions34,42,44,46. The transition from the side wall28in an outer region to the bottom26of the contact hole24inFIG.12thus is more or less sharp and not smooth. While embodiments of the invention have been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. It will be understood that changes and modifications may be made by those of ordinary skill within the scope of the following claims. In particular, the present invention covers further embodiments with any combination of features from different embodiments described above and below. Additionally, statements made herein characterizing the invention refer to an embodiment of the invention and not necessarily all embodiments. The terms used in the claims should be construed to have the broadest reasonable interpretation consistent with the foregoing description. For example, the use of the article “a” or “the” in introducing an element should not be interpreted as being exclusive of a plurality of elements. Likewise, the recitation of “or” should be interpreted as being inclusive, such that the recitation of “A or B” is not exclusive of “A and B,” unless it is clear from the context or the foregoing description that only one of A and B is intended. Further, the recitation of “at least one of A, B and C” should be interpreted as one or more of a group of elements consisting of A, B and C, and should not be interpreted as requiring at least one of each of the listed elements A, B and C, regardless of whether A, B and C are related as categories or otherwise. Moreover, the recitation of “A, B and/or C” or “at least one of A, B or C” should be interpreted as including any singular entity from the listed elements, e.g., A, any subset from the listed elements, e.g., A and B, or the entire list of elements A, B and C. | 19,373 |
Subsets and Splits
No community queries yet
The top public SQL queries from the community will appear here once available.